<?xml version="1.0" encoding="utf-8"?>
<tw-patent-applications total-count="2173">
  <tw-patent-application no="1" publication-number="202625312">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625312</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113133740</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電連接器及其組件</chinese-title>
        <english-title>ELECTRICAL CONNECTOR AND ELECTRICAL CONNECTOR ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">H01R13/631</main-classification>
        <further-classification edition="201101120260309B">H01R12/72</further-classification>
        <further-classification edition="201101120260309B">H01R12/75</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英屬開曼群島商鴻騰精密科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOXCONN INTERCONNECT TECHNOLOGY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>KY</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐揚尊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YANG-TSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳榮發</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JERRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樊曉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, XIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊奇峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, QI-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電連接器，其包括殼體、設置在所述殼體中的接觸端子、與所述接觸端子連接的沿第一方向延伸的電纜、以及設置在殼體內的閂鎖，所述殼體包括頂部、底部、設置在所述頂部和底部之間的第一側壁及第二側壁、可容納所述接觸端子且沿垂直於所述第一方向的第二方向延伸的腔、及可通向所述腔的閂鎖容納部，所述底部具有可供配合連接器進入且連通至所述腔的開口，所述配對連接器的配合端子可通過所述開口進入以與所述接觸端子電性連接，所述閂鎖可移動地接收在所述閂鎖容納部中，且可通過順時針及逆時針旋轉實現與所述配合端子的解鎖與鎖止。本發明中的電連接器可與配合連接器實現可靠、穩定的連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrical connector includes: a housing, a contact terminal provided in the housing, a cable extending in a first direction connected to the contact terminal, and a latch provided in the housing. The housing includes a top, a bottom, a first side wall and a second side wall disposed between the top and the bottom, a cavity that can accommodate the contact terminal and extends along a second direction perpendicular to the first direction, and a latch receiving portion accessible to the cavity. The bottom has an opening connected to the cavity for a mating connector to enter, and a mating terminal of the mating connector can enter through the opening to be electrically connected to the contact terminal. The latch is movably received in the latch receiving portion, and can be unlocked and locked with the mating terminal by clockwise and counterclockwise rotation.The electrical connector in the present invention can achieve reliable and stable connection with the mating connector.</p>
      </isu-abst>
      <representative-img>
        <p type="p">114:間隔壁</p>
        <p type="p">121:第一接觸端子</p>
        <p type="p">122:第二接觸端子</p>
        <p type="p">141:旋鈕</p>
        <p type="p">142:旋鈕部</p>
        <p type="p">144:延伸部</p>
        <p type="p">146:第一臂</p>
        <p type="p">147:第二臂</p>
        <p type="p">1131:第一收容部</p>
        <p type="p">1132:第二收容部</p>
        <p type="p">1133:隔板</p>
        <p type="p">1136:凹口</p>
        <p type="p">203:基板</p>
        <p type="p">207:凹槽</p>
        <p type="p">211:第一配合端子</p>
        <p type="p">212:第二配合端子</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2" publication-number="202625310">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625310</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113133741</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電連接器及其組件</chinese-title>
        <english-title>ELECTRICAL CONNECTOR AND ELECTRICAL CONNECTOR ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">H01R13/627</main-classification>
        <further-classification edition="201101120260309B">H01R12/70</further-classification>
        <further-classification edition="201101120260309B">H01R12/71</further-classification>
        <further-classification edition="201101120260309B">H01R12/75</further-classification>
        <further-classification edition="200601120260309B">H01R13/10</further-classification>
        <further-classification edition="200601120260309B">H01R13/629</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英屬開曼群島商鴻騰精密科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOXCONN INTERCONNECT TECHNOLOGY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>KY</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐揚尊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YANG-TSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳榮發</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JERRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樊曉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, XIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電連接器，其包括殼體、設置在所述殼體中的接觸端子、以及閂鎖，所述殼體包括可容納所述接觸端子的腔、可通向所述腔的閂鎖容納部、及從所述殼體底部連通至腔的可供配合端子進入的開口，所述閂鎖可移動地接收在所述閂鎖容納部中以與所述配合端子鎖定及解鎖，所述閂鎖包括釋放部、與所述釋放部相對的第一臂、及連接所述釋放部和第一臂的第二臂及第三臂，所述釋放部、第一臂、第二臂及第三臂形成可圍繞所述配合端子並供所述配合端子延伸而出的包圍空間，所述第一臂、第二臂及第三臂中的至少一個設有向所述包圍空間內凸伸的可接合所述配合端子以對其進行鎖定的第一凸起。本發明中的電連接器可與配合連接器實現可靠、穩定的連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrical connector includes: a housing, a contact terminal provided in the housing, and a latch provided in the housing. The housing includes a cavity for receiving the contact terminal, a latch receiving portion open to the cavity, and an opening connected from the bottom of the housing to the cavity for the mating terminal to enter. The latch is movably received in the latch receiving portion for locking and unlocking with the mating terminal. The latch includes a release portion, a first arm opposite the release portion, and second and third arms connecting the release portion and the first arm. The release portion, the first arm, the second arm and the third arm form an surrounding space that can surround the mating terminal and allow the mating terminal to extend out, and at least one of the first arm, the second arm and the third arm is provided with a first protrusion protruding into the surrounding space and capable of engaging the mating terminal to lock it.The electrical connector in the present invention can achieve reliable and stable connection with the mating connector.</p>
      </isu-abst>
      <representative-img>
        <p type="p">113a:第一容納部</p>
        <p type="p">113b:第二容納部</p>
        <p type="p">118:分隔壁</p>
        <p type="p">148:第一凸起</p>
        <p type="p">170:限位部</p>
        <p type="p">171:第二凸起</p>
        <p type="p">172:第三凸起</p>
        <p type="p">181:第一限位凹部</p>
        <p type="p">182:第二限位凹部</p>
        <p type="p">183:斜面</p>
        <p type="p">184:止退面</p>
        <p type="p">191:第一彈性臂</p>
        <p type="p">192:第二彈性臂</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="3" publication-number="202625313">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625313</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113133742</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電連接器及其組件</chinese-title>
        <english-title>ELECTRICAL CONNECTOR AND ELECTRICAL CONNECTOR ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">H01R13/631</main-classification>
        <further-classification edition="201101120260309B">H01R12/72</further-classification>
        <further-classification edition="201101120260309B">H01R12/75</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英屬開曼群島商鴻騰精密科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOXCONN INTERCONNECT TECHNOLOGY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>KY</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐揚尊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YANG-TSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳榮發</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JERRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樊曉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, XIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電連接器，其包括殼體、設置在所述殼體中的接觸端子、與所述接觸端子連接的沿第一方向延伸的電纜、以及設置在所述殼體中的閂鎖，所述殼體包括頂部、底部、設置在所述頂部和底部之間的第一側壁及第二側壁、可容納所述接觸端子且沿垂直於所述第一方向的第二方向延伸的腔、及可通向所述腔的閂鎖容納部，所述底部具有可供配合連接器進入且連通至所述腔的開口，所述配合連接器的配合端子可通過所述開口進入以與所述接觸端子電性連接，所述閂鎖可移動地接收在所述閂鎖容納部中，且沿垂直於所述第一方向及第二方向的第三方向往復移動實現所述電連接器與所述配合連接器的解鎖與鎖止。本發明中的電連接器可與配合連接器實現可靠、穩定的連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrical connector includes: a housing, a contact terminal provided in the housing, a cable extending in a first direction connected to the contact terminal, and a latch provided in the housing. The housing includes a top, a bottom, a first side wall and a second side wall disposed between the top and the bottom, a cavity that can accommodate the contact terminal and extends along a second direction perpendicular to the first direction, and a latch receiving portion accessible to the cavity. The bottom has an opening connected to the cavity for a mating connector to enter, and a mating terminal of the mating connector can enter through the opening to be electrically connected to the contact terminal. The latch is movably received in the latch receiving        &lt;br/&gt;portion, and reciprocates in a third direction perpendicular to the first direction and the second direction to unlock and lock the electrical connector and the mating connector. The electrical connector in the present invention can achieve reliable and stable connection with the mating connector.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">141:第一按壓部</p>
        <p type="p">145:第一卡合部</p>
        <p type="p">146:第二卡合部</p>
        <p type="p">171:第一凸起</p>
        <p type="p">172:第二凸起</p>
        <p type="p">173、174:凹口</p>
        <p type="p">175、176:間隙</p>
        <p type="p">181:第一限位部</p>
        <p type="p">182:第二限位部</p>
        <p type="p">183:第一止退面</p>
        <p type="p">184:第二止退面</p>
        <p type="p">185:第一收容部</p>
        <p type="p">186:第二收容部</p>
        <p type="p">187、188:突出部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="4" publication-number="202623707">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623707</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146472</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>愛纖維貓砂　與其製備方法</chinese-title>
        <english-title>LOVE FIBER CAT LITTER AND ITS PREPARATION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">A01K1/015</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅司任</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, SZU-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅司任</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, SZU-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種結塊型環保貓砂及其製備方法，屬於環保型寵物用品技術領域。該貓砂採用天然可食用等級成分製成，主要包括木質材料（如木屑、木粉）、天然纖維（如椰子纖維、麻纖維）、天然膠體（如羧甲基纖維素、瓜爾豆膠、鹿角菜膠或三仙膠）、檸檬酸及澱粉（如玉米澱粉、馬鈴薯澱粉或木薯澱粉）等。配方具有優異的吸水性、結塊性及長效除臭能力，同時低粉塵且完全可降解，環保無毒，適合寵物長期使用。製備方法包括原料準備、配方混合、制粒、乾燥及包裝等過程，最終形成顆粒大小均勻（寬2mm8mm）的貓砂。經驗證，本發明產品性能穩定，安全性高，符合現代環保與寵物健康需求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a clumping eco-friendly cat litter and its preparation method, belonging to the technical field of environmentally friendly pet products. The cat litter is made from natural and edible-grade ingredients, including wood-based materials (e.g., wood chips, sawdust), natural fibers (e.g., coconut fiber, hemp fiber), natural colloids (e.g., carboxymethyl cellulose, guar gum, carrageenan, or xanthan gum), citric acid, and starches (e.g., corn starch, potato starch, or cassava starch). The formula exhibits excellent water absorption, clumping ability, and long-lasting deodorization, while being low in dust, fully biodegradable, non-toxic, and suitable for long-term use by pets. The preparation method includes raw material preparation, formula mixing, granulation, drying, and packaging, resulting in uniformly sized granules (2mm8mm in length). Verified by tests, the product demonstrates stable performance and high safety, meeting modern environmental and pet health requirements.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(W):木質材料：木屑、木粉</p>
        <p type="p">(NF):天然纖維：麻纖維、椰子纖維</p>
        <p type="p">(G):天然膠體：羧甲基纖維素、鹿角菜膠、瓜爾豆膠或三仙膠等</p>
        <p type="p">(CA):檸檬酸</p>
        <p type="p">(S):澱粉：玉米澱粉、馬鈴薯澱粉或木薯澱粉等</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="5" publication-number="202625121">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625121</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146473</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>模擬葉脈輸送水份之教具</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">G09B23/38</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣亞學校財團法人育達科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鳳卿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鳳卿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉安鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作是提供一種模擬葉脈輸送水份之教具，其包含：一葉形底座、一葉脈變色體，該葉形底座上表面形成有向下凹陷之葉脈凹槽，該葉脈凹槽之形狀係模仿自然界之葉脈形狀而設置，葉脈凹槽之一端具有一凹槽葉柄部，另一端具有一凹槽葉尖部；該葉脈變色體具有遇水會改變顏色之特性，其形狀係模仿自然界之葉脈形狀而設置，其係置於葉脈凹槽中，當注水於葉脈凹槽之凹槽葉柄部時，水會朝凹槽葉尖部的方向流去，置於葉脈凹槽中之葉脈變色體遇水時        &lt;br/&gt;，其會自第二顏色變為第一顏色；藉由上述之教具，乃可讓學習者觀察到類似自然界中之葉脈輸送水份及養份的軌跡，而不再侷限於想像之中，使植物教學之進行，既生動而又有趣，藉此，以提昇學習者的興趣及教學效果。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:模擬葉脈輸送水份之教具</p>
        <p type="p">10:葉脈變色體</p>
        <p type="p">11:變色葉柄部</p>
        <p type="p">12:變色葉尖部</p>
        <p type="p">13:變色主脈</p>
        <p type="p">14:變色側脈</p>
        <p type="p">15:變色油墨</p>
        <p type="p">16:葉脈變色體上表面</p>
        <p type="p">20:葉形底座</p>
        <p type="p">201:底座葉柄部</p>
        <p type="p">202:底座葉尖部</p>
        <p type="p">203:底座上表面</p>
        <p type="p">204:葉脈凹槽</p>
        <p type="p">205:排水孔</p>
        <p type="p">21:凹槽葉柄部</p>
        <p type="p">22:凹槽葉尖部</p>
        <p type="p">23:凹槽主脈</p>
        <p type="p">24:凹槽側脈</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="6" publication-number="202624039">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624039</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146474</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池交換方法及電池交換站</chinese-title>
        <english-title>BATTERY EXCHANGE METHOD THEREOF BATTERY EXCHANGE STATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120241230B">B60L53/80</main-classification>
        <further-classification edition="201901120241230B">B60L53/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英屬開曼群島商睿能創意公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOGORO INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KY</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭明義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, MING-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡彣娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, WEN CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳薇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張舒婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, SHU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅治閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, CHIH-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YEN-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐殷偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳春成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董浩宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUNG, HAO-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電池交換方法應用於電池交換站。電池交換站包含複數個電池槽以及分別上鎖電池槽的複數個門板模組。電池交換方法包含：接收換電請求資訊；偵測電池槽的空槽數；以及於換電請求資訊通過驗證且交換電池數大於空槽數時執行第一換電程序，並於交換電池數不大於空槽數時執行第二換電程序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A battery exchange method is applied to a battery exchange station. The battery exchange station includes a plurality of battery slots and a plurality of door modules respectively locking the battery slots. The battery exchange method includes: receiving battery exchange request information; detecting a number of empty slots of the battery slots; and executing a first battery exchange procedure when the battery exchange request information is verified and an exchanging number of battery is greater than the number of empty slots and executing a second battery exchange procedure when the exchanging number of battery is not greater than the number of empty slots.</p>
      </isu-abst>
      <representative-img>
        <p type="p">M:電池交換方法</p>
        <p type="p">S110,S120,S130,S1300,S1301:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="7" publication-number="202623769">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623769</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146483</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>手術器械導引系統與夾持裝置</chinese-title>
        <english-title>NAVIGATION SYSTEM FOR SURGICAL INSTRUMENT AND FASTENING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120241219B">A61B34/20</main-classification>
        <further-classification edition="200601120241219B">A61B17/00</further-classification>
        <further-classification edition="200601120241219B">A61B17/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>炳碩生醫股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POINT ROBOTICS MEDTECH INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳昭緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHAO-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方廷勻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, TING-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃昆斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, KUN-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種手術器械導引系統，其包括機械臂、夾持裝置以及導航標記元件。夾持裝置包括本體部、容置部、套筒件、第一按壓件以及多連桿機構。本體部的一端連接於機械臂。容置部連接於本體部的另一端。容置部具有容置孔。套筒件可拆卸的設置於容置孔。套筒件具有通孔以供        &lt;b&gt;一&lt;/b&gt;手術器械插入。套筒件的一側沿通孔的軸向設有缺口，缺口與通孔相連通。套筒件於缺口的邊緣還設有限位部。第一按壓件設置於本體部。多連桿機構設置於本體部及容置部，並連接於第一按壓件及套筒件。第一按壓件用於被按壓，帶動多連桿機構推抵限位部以縮小缺口，促使套筒件變形而夾固手術器械。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A surgical instrument navigation system includes a mechanical arm, a fastening device and a navigation marking element. The fastening device includes a body portion, an accommodating portion, a sleeve member, a first pressing member, and a multi-linkage mechanism. One end of the body portion is connected to the mechanical arm. The accommodating portion is connected to another end of the body portion. The accommodating portion has an accommodating hole. The sleeve member is detachably arranged in the accommodating hole. The sleeve member has a through hole for being inserted into by a surgical instrument. One side of the sleeve member is provided with a gap along an axial direction of the through hole, and the gap is connected with the through hole. The sleeve member is provided with a limiting portion at an edge of the gap. The first pressing member is arranged on the body portion. The multi-linkage mechanism is provided on the body portion and the accommodating portion, and the multi-linkage mechanism is connected to the first pressing member and the sleeve member. The first pressing member is used to be pressed, driving the multi-linkage mechanism to push against the limiting portion to narrow the gap, so that the sleeve member is deformed and clamps the surgical instrument.</p>
      </isu-abst>
      <representative-img>
        <p type="p">D:夾持裝置</p>
        <p type="p">1:本體部</p>
        <p type="p">2:容置部</p>
        <p type="p">3:套筒件</p>
        <p type="p">7:外殼</p>
        <p type="p">71:第三切口</p>
        <p type="p">R:機械臂</p>
        <p type="p">F1:手術器械</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="8" publication-number="202625663">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625663</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146493</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙面式薄膜電晶體連接結構及顯示面板</chinese-title>
        <english-title>DOUBLE-SIDED THIN-FILM TRANSISTOR CONNECTION STRUCTURE AND DISPLAY PANEL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250218B">H10K59/123</main-classification>
        <further-classification edition="202301120250218B">H10K59/50</further-classification>
        <further-classification edition="202501120250218B">H10D30/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凌巨科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIANTPLUS TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅康銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, KANG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種雙面式薄膜電晶體連接結構，其包括基板、第一薄膜電晶體陣列及第二薄膜電晶體陣列。基板具有第一表面及相對的第二表面，基板開設有貫通第一表面及第二表面的多個貫孔。第一薄膜電晶體陣列設置於第一表面上，第一薄膜電晶體陣列包括多個第一薄膜電晶體。第二薄膜電晶體陣列設置於第二表面上，第二薄膜電晶體陣列包括多個第二薄膜電晶體。在相對應的畫素中，第一薄膜電晶體的汲極通過一電連接體，穿過貫孔電性連接於第二薄膜電晶體的源極。本發明還提供一種顯示面板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A double-sided thin-film transistor connection structure is provided. The structure includes a substrate, a first thin-film transistor array and a second thin-film transistor array. The substrate has a first surface and an opposite second surface, and the substrate is provided with a plurality of through holes penetrating the first surface and the second surface. The first thin-film transistor array is disposed on the first surface, and the first thin-film transistor array includes a plurality of first thin-film transistors. The second thin-film transistor array is disposed on the second surface, and the second thin-film transistor array includes a plurality of second thin-film transistors. In the corresponding pixel, the drain electrode of the first thin-film transistor is electrically connected to the source electrode of the second thin-film transistor through an electrical connector and through the through hole. The invention also provides a display panel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">Z1:顯示面板</p>
        <p type="p">11:基板</p>
        <p type="p">11a:第一表面</p>
        <p type="p">11b:第二表面</p>
        <p type="p">111:貫孔</p>
        <p type="p">14:電連接體</p>
        <p type="p">2:發光層</p>
        <p type="p">3:液晶層</p>
        <p type="p">6:第一畫素電極層</p>
        <p type="p">7:第二畫素電極層</p>
        <p type="p">8:第一電極</p>
        <p type="p">9:第二電極</p>
        <p type="p">CH:接觸孔</p>
        <p type="p">D1:垂直方向</p>
        <p type="p">DR1:第一汲極</p>
        <p type="p">DR2:第二汲極</p>
        <p type="p">GE1:第一閘極</p>
        <p type="p">GE2:第二閘極</p>
        <p type="p">GP1:第一閘極絕緣層</p>
        <p type="p">GP2:第二閘極絕緣層</p>
        <p type="p">OL1:第一有機層</p>
        <p type="p">OL2:第二有機層</p>
        <p type="p">SE1:第一通道層</p>
        <p type="p">SE2:第二通道層</p>
        <p type="p">SL1:第一源極</p>
        <p type="p">SL2:第二源極</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="9" publication-number="202624997">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624997</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146498</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>筆記型電腦及其資訊安全保護方法</chinese-title>
        <english-title>NOTEBOOK COMPUTER AND INFORMATION SECURITY PROTECTION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120250321B">G06F21/70</main-classification>
        <further-classification edition="200601120250321B">G06F11/22</further-classification>
        <further-classification edition="200601120250321B">G06F1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佩儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PE-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種應用於筆記型電腦的資訊安全保護方法。該方法包含以下步驟：從筆記型電腦的多個控制組件接收相應的多個控制信號；藉由比對該些控制信號與安全性設定檔(security profile)中記錄的暗鎖組合，以判定安全性驗證通過或失敗，其中安全性設定檔記錄暗鎖組合，及記錄多個反應行動各自的開關狀態(toggle state)；若判定安全性驗證通過，允許筆記型電腦正常上電；以及若判定安全性驗證失敗，根據安全性設定檔中記錄的開關狀態選擇性地執行反應行動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a information security protection method applied to a laptop computer. The method includes the following steps: receiving corresponding control signals from multiple control components of the laptop computer; determining security verification pass or fail by comparing the control signals with a dark lock combinations recorded in a security profile, where the security profile records the dark lock combination and the toggle state of each of multiple response actions; if security verification is determined to be passed, allowing the laptop computer to power on normally; and if security verification is determined to be failed, selectively executing the response actions based on the toggle states recorded in the security profile.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:資訊安全保護方法</p>
        <p type="p">S201-S204:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="10" publication-number="202625005">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625005</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146499</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在電路設計流程中使用機器學習預測電路元件特性的方法與系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR USING MACHINE LEARNING TO PREDICT CELL CHARACTERISTICS IN CIRCUIT DESIGN PROCEDURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250425B">G06F30/367</main-classification>
        <further-classification edition="202001120250425B">G06F30/30</further-classification>
        <further-classification edition="202001120250425B">G06F30/27</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張晏慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YEN-TZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林欣樟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIN-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志璟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIH-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於一電路設計流程的方法，該方法包含：從一電路元件資料庫中獲取關於一特定電路元件的資訊；根據該特定電路元件的資訊，產生一初始資料集；基於該初始資料集建立或優化一機器學習模型；基於已建立或優化後的該機器學習模型，產生關於該特定電路元件的一個或多個目標特性資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for use in a circuit design process includes: obtaining information about a specific cell from a cell library; generating an initial data set based on the information about the specific cell; based on the initial data set, constructing or optimizing a machine learning model; generating one or more target characteristic data about the specific cell based on the constructed or optimized machine learning model.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101~S110:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="11" publication-number="202625021">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625021</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146507</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>行動人工智慧工安監控系統及其方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250303B">G06N3/088</main-classification>
        <further-classification edition="202301120250303B">G06N3/0475</further-classification>
        <further-classification edition="202201120250303B">G06V10/82</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣智能機器人科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN INTELLIGENT ROBOTICS COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃國聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, KUO-TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李政育</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHENG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李保祿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種行動人工智慧工安監控系統及其方法，該行動人工智慧工安監控系統，包含影像擷取裝置、影像辨識裝置、資料庫、生成式對抗網路裝置與深度學習裝置；其中，資料庫訊號連接影像擷取裝置與影像辨識裝置；生成式對抗網路裝置訊號連接資料庫；深度學習裝置訊號連接生成式對抗裝置。生成式對抗網路裝置基於資料庫中的影像或影像擷取裝置所擷取的影像，進一步產生特徵向量，特徵向量提供給深度學習裝置，並產生學習結果，此學習結果可提高影像辨識裝置的精準度。本發明藉由高精準度的影像辨識裝置，以辨識工業場所或任何場合的影像，藉由影像辨識提供警示作用以避免意外的發生，進而提高工業場所或任何場合的安全度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:影像擷取裝置</p>
        <p type="p">11:影像辨識裝置</p>
        <p type="p">12:資料庫</p>
        <p type="p">13:生成式對抗網路裝置</p>
        <p type="p">130:生成器</p>
        <p type="p">131:鑑別器</p>
        <p type="p">14:深度學習裝置</p>
        <p type="p">15:警示裝置</p>
        <p type="p">16:控制裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="12" publication-number="202625582">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625582</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146514</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250731B">H10D30/47</main-classification>
        <further-classification edition="202501120250731B">H10D30/87</further-classification>
        <further-classification edition="202501120250731B">H10D62/60</further-classification>
        <further-classification edition="202501120250731B">H10D62/824</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>世界先進積體電路股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈士強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, SHYH-CHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭韋志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, WEI-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林柏亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PO-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例提供半導體裝置。半導體裝置包括基板、緩衝層、通道層、阻障層、閘極結構、第一N型蓋層以及閘極電極層。緩衝層位於基板上。通道層位於緩衝層上。阻障層位於通道層上。閘極結構位於阻障層上。第一N型蓋層位於通道層上。第一N型蓋層為輕摻雜。閘極電極層位於第一N型蓋層上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments provide a semiconductor device. The semiconductor device includes a substrate, a buffer layer, a channel layer, a barrier layer, a gate structure, a first N-type cap layer and a gate electrode layer. The buffer layer is located on the substrate. The channel layer is located on top of the buffer layer. The barrier layer is located on the channel layer. The gate structure is located on the barrier layer. The first N-type cap layer is located on the channel layer. The first N-type cap layer is lightly doped. The gate electrode layer is located on the first N-type cap layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:基板</p>
        <p type="p">202:緩衝層</p>
        <p type="p">204:通道層</p>
        <p type="p">206:阻障層</p>
        <p type="p">208:閘極結構</p>
        <p type="p">210:第一N型蓋層</p>
        <p type="p">214:閘極電極層</p>
        <p type="p">216:保護層</p>
        <p type="p">230S:源極電極</p>
        <p type="p">230D:汲極電極</p>
        <p type="p">500A:半導體裝置</p>
        <p type="p">D1,D2:二極體</p>
        <p type="p">D3:蕭基二極體</p>
        <p type="p">W1:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="13" publication-number="202625201">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625201</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146515</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>人體平衡評估系統與方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR HUMAN BODY BALANCE ASSESSMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250228B">G16H10/00</main-classification>
        <further-classification edition="201801120250228B">G16H30/40</further-classification>
        <further-classification edition="201801120250228B">G16H50/30</further-classification>
        <further-classification edition="201801120250228B">G16H50/80</further-classification>
        <further-classification edition="201701120250228B">G06T7/20</further-classification>
        <further-classification edition="202201120250228B">G06V40/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥合</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YAN-HE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉家福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, CHIA-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高志忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, CHIH-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李潤容</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, RUEN-RONE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種基於數位影片的人體平衡狀態分析系統與方法。該系統包含：一人體關鍵點擷取模組，用以基於該數位影片，偵測該數位影片中一幀影像的複數個人體關鍵點；一人體平衡點計算模組，用以基於該數位影片中至少連續二幀影像的複數個人體關鍵點，計算一人體平衡點；一人體支撐區計算模組，用以基於該數位影片中一幀影像的複數個人體關鍵點，計算一人體支撐區； 以及一人體平衡評估模組，基於該人體平衡點與該人體支撐區，評估該人體是否為平衡狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a human body balance assessment system and method based on a digital video. The system comprises: a body key point detection module for detecting a plurality of body key points based on a frame in the digital video; a human body balance point calculation module for calculating a human body balance point based on the plurality of body key points in at least two consecutive frames in the digital video; a human body support area calculation module for calculating a human body support area based on the plurality of body key points in a frame in the digital video; and a human body balance assessment module for evaluating whether the human body is in balance state based on the human body balance point and the human body support area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:人體穩定點估測系統</p>
        <p type="p">101:人體關鍵點擷取模組</p>
        <p type="p">102:人體平衡點計算模組</p>
        <p type="p">103:人體支撐區計算模組</p>
        <p type="p">104:人體平衡評估模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="14" publication-number="202625783">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625783</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146516</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置的製造方法及半導體裝置</chinese-title>
        <english-title>METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260316B">H10P76/00</main-classification>
        <further-classification edition="202601120260316B">H10P14/00</further-classification>
        <further-classification edition="202601120260316B">H10P50/00</further-classification>
        <further-classification edition="202501120260316B">H10D30/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>世界先進積體電路股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯永正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, YUNG-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇皖亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, WAN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>甘鎧銓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAN, KAI-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗曄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHUNG-YEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖志成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHIH-CHERNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置的製造方法，包括下列步驟。提供基板，其由下至上依序包括底半導體層、絕緣層、和頂半導體層，且絕緣層和頂半導體層的整體包括第一整體厚度。形成圖案化遮罩層在基板上，其中圖案化遮罩層包括底遮罩層和頂遮罩層。在圖案化遮罩層的覆蓋下，蝕刻頂半導體層和絕緣層，以形成圖案化頂半導體層和圖案化絕緣層。形成第一磊晶層在底半導體層上，其中第一磊晶層的頂面低於頂遮罩層的底面。移除圖案化遮罩層。形成第二磊晶層在頂半導體層和第一磊晶層之上，其具有第二厚度，且和第一整體厚度的比值為2至30。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of manufacturing a semiconductor device includes the following steps. Providing a substrate including, from bottom to top, a bottom semiconductor layer, an insulating layer, and a top semiconductor layer, where the insulating layer and the top semiconductor layer together have a first total thickness. Forming a patterned mask layer on the substrate, where the patterned mask layer includes a bottom mask layer and a top mask layer. Etching the top semiconductor layer and the insulating layer under the coverage of the patterned mask layer to form a patterned top semiconductor layer and a patterned insulating layer. Forming a first epitaxial layer on the bottom semiconductor layer, where the top surface of the first epitaxial layer is lower than the bottom surface of the top mask layer. Removing the patterned mask layer. Forming a second epitaxial layer on the top semiconductor layer and the first epitaxial layer, where the second epitaxial layer has a second thickness, and the ratio of the second thickness to the first total thickness is from 2 to 30.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體裝置</p>
        <p type="p">101:基底層</p>
        <p type="p">102:底半導體層</p>
        <p type="p">103p:圖案化絕緣層</p>
        <p type="p">103s:上凹曲面側壁</p>
        <p type="p">104p:圖案化頂半導體層</p>
        <p type="p">110:基板</p>
        <p type="p">410:第一磊晶層</p>
        <p type="p">420:第二磊晶層</p>
        <p type="p">430:晶格缺陷</p>
        <p type="p">510:第一區</p>
        <p type="p">515:深溝槽隔離結構</p>
        <p type="p">520:第二區</p>
        <p type="p">530:交界區</p>
        <p type="p">610a、610b:第一半導體元件</p>
        <p type="p">620:第二半導體元件</p>
        <p type="p">D:汲極</p>
        <p type="p">G:閘極</p>
        <p type="p">S:源極</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="15" publication-number="202624493">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624493</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146518</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>腸病毒分型的套組、方法及系統</chinese-title>
        <english-title>KIT, METHOD, AND SYSTEM FOR ENTEROVIRUS TYPING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250501B">C12Q1/6876</main-classification>
        <further-classification edition="201801120250501B">C12Q1/6888</further-classification>
        <further-classification edition="200601120250501B">C12Q1/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立陽明交通大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL YANG MING CHIAO TUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>衛生福利部疾病管制署</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CENTERS FOR DISEASE CONTROL MINISTRY OF HEALTH AND WELFARE TAIWAN, R.O.C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家靖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIA-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊志元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JYH-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIA-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周昊勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, HAO-SYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孚竹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種用於腸病毒分型的套組，其包括具有特定核酸序列的引子對以及核酸探針。本揭露另提供利用該套組進行腸病毒分型的方法及系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a kit for classifying enterovirus, which includes primers and probes having specific nucleic acid sequences. Also provided are a method and a system to classify enterovirus by using the kit.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="16" publication-number="202625681">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625681</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146529</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>快閃記憶體的形成方法</chinese-title>
        <english-title>METHOD FOR FORMING FLASH MEMORY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260203B">H10P14/40</main-classification>
        <further-classification edition="202601120260203B">H10P50/00</further-classification>
        <further-classification edition="202301120260203B">H10B41/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華邦電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINBOND ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳盈儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YING-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何誠圃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, CHENG-PU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林政陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JENG-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倪志榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NI, CHIH-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供快閃記憶體的形成方法，此方法包含形成隔離結構圍繞複數個主動區，形成複數個第一閘極電極層分別於主動區之上，沉積第一氧化矽層沿著第一閘極電極層的上表面和側壁以及隔離結構的上表面，進行第一乾式蝕刻製程以減薄第一氧化矽層，進行第一濕式蝕刻製程，以移除第一氧化矽層且凹蝕隔離結構，以及形成第二閘極電極層圍繞第一閘極電極層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for forming a flash memory is provided. The method includes forming an isolation structure surrounding a plurality of active regions, forming a plurality of first gate electrode layers respectively on the active regions, depositing a first silicon oxide layer along the upper surface and sidewalls of the first gate electrode layers and the upper surface of the isolation structure, performing a first dry etching process to thin down the first silicon oxide layer, performing a first wet etching process to remove the first silicon oxide layer and recess the isolation structure, and forming a second gate electrode layer surrounding the first gate electrode layers.</p>
      </isu-abst>
      <representative-img>
        <p type="p">104:主動區</p>
        <p type="p">110:隔離結構</p>
        <p type="p">114:穿隧氧化物層</p>
        <p type="p">116:浮置閘極電極層</p>
        <p type="p">120:第一氧化矽層</p>
        <p type="p">122:第二氧化矽層</p>
        <p type="p">1000:修整處理</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="17" publication-number="202624036">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624036</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146532</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電源轉換裝置與電源轉換系統</chinese-title>
        <english-title>POWER CONVERSION APPARATUS AND POWER CONVERSION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120241230B">B60L53/62</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS,INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李聖華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, SHENG-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電源轉換裝置包括複數三相電源模組、開關矩陣以及控制器。各三相電源模組包括三個單相交流對直流轉換單元，分別接收三相交流電源的三相交流電壓，且轉換三相交流電壓提供直流電流。開關矩陣接收該等三相電源模組提供的該等直流電流。控制器提供開關控制信號，控制開關矩陣，以決定該等直流電流提供的輸出功率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power conversion apparatus incudes a plurality of three-phase power modules, a switch matrix, and a controller. Each three-phase power module includes three single-phase AC-to-DC conversion units to respectively three AC voltages of a three-phase AC power supply, and convert the three AC voltages into a plurality of DC currents. The switch matrix receives the DC currents provided by the three-phase power modules. The controller provides a switch control signal to control the switch matrix to decide an output power provided by the DC currents.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電源轉換裝置</p>
        <p type="p">11~1N:三相電源模組</p>
        <p type="p">20:開關矩陣</p>
        <p type="p">30:控制器</p>
        <p type="p">V&lt;sub&gt;AC3&lt;/sub&gt;:三相交流電源</p>
        <p type="p">V&lt;sub&gt;R&lt;/sub&gt;,V&lt;sub&gt;S&lt;/sub&gt;,V&lt;sub&gt;T&lt;/sub&gt;:三相交流電壓</p>
        <p type="p">i&lt;sub&gt;dc1&lt;/sub&gt;,i&lt;sub&gt;dc2&lt;/sub&gt;,i&lt;sub&gt;dc3&lt;/sub&gt;,...,i&lt;sub&gt;dcN&lt;/sub&gt;:直流電流</p>
        <p type="p">P&lt;sub&gt;OUT&lt;/sub&gt;:輸出功率</p>
        <p type="p">S&lt;sub&gt;SC&lt;/sub&gt;:控制信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="18" publication-number="202625065">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625065</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146535</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>款項移轉服務系統及款項移轉方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120250212B">G06Q40/04</main-classification>
        <further-classification edition="202301120250212B">G06Q40/02</further-classification>
        <further-classification edition="201201120250212B">G06Q20/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林書維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林書維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種款項移轉服務系統，包含一管理端伺服系統，該管理端伺服系統包括一處理單元及一電連接該處理單元的儲存單元。該處理單元用於在接收到一由一使用者電子裝置所傳送的款項移轉預約請求後，據以產生一款項移轉訂單資料並將其儲存至該儲存單元，且於接收到一由一服務端設備所傳送的收款完成通知後，產生並傳送一對應於該款項移轉訂單資料的發幣通知至一加密貨幣交易伺服端，以致該加密貨幣交易伺服端據以使一筆加密貨幣款項被轉換成一筆要被匯入一境外收款帳戶的境外貨幣款項。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:款項移轉服務系統</p>
        <p type="p">11:服務端設備</p>
        <p type="p">111:控制單元</p>
        <p type="p">112:顯示單元</p>
        <p type="p">113:輸入單元</p>
        <p type="p">114:掃描單元</p>
        <p type="p">115:紙鈔收取單元</p>
        <p type="p">12:管理端伺服系統</p>
        <p type="p">121:處理單元</p>
        <p type="p">122:儲存單元</p>
        <p type="p">D:註冊使用者資料</p>
        <p type="p">D1:帳戶識別資料</p>
        <p type="p">D2:境外帳戶資料</p>
        <p type="p">K1:驗證端金鑰資料</p>
        <p type="p">K2:使用端金鑰資料</p>
        <p type="p">20:加密貨幣交易伺服端</p>
        <p type="p">30:使用者電子裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="19" publication-number="202625030">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625030</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146536</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>作業時間預估系統及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250303B">G06Q10/06</main-classification>
        <further-classification edition="202301120250303B">G06Q10/063</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大聯大控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳葦柔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI JOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李子瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, TZU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋品燊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNG, PIN SEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種作業時間預估系統包含一處理單元，以及一與該處理單元電連接且儲存有一作業紀錄及多個權重參數的儲存單元。該處理單元用於：將該作業紀錄所包含的多個歷史耗時結果分為多個分別對應該等權重參數的耗時結果群組；根據每一耗時結果群組中的歷史耗時結果，計算出一對應於該耗時結果群組所對應之該權重參數的群組模擬時長；根據該等群組模擬時長及該等權重參數計算出一要被應用於待處理作業的預估時長；根據該預估時長產生一或多個分別對應於該（等）待處理作業的預估完成時間點，並將該（等）作業完成時間點輸出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:作業時間預估系統</p>
        <p type="p">11:處理單元</p>
        <p type="p">12:儲存單元</p>
        <p type="p">5:作業使用端</p>
        <p type="p">D1:作業紀錄</p>
        <p type="p">D11:參考資料</p>
        <p type="p">D10A:第一參考資料</p>
        <p type="p">D10B:第二參考資料</p>
        <p type="p">D110:歷史耗時結果</p>
        <p type="p">D2:權重資料</p>
        <p type="p">D21:權重參數</p>
        <p type="p">D21A:第一權重參數</p>
        <p type="p">D21B:第二權重參數</p>
        <p type="p">D21C:第三權重參數</p>
        <p type="p">D22:適用數值範圍</p>
        <p type="p">D22A:第一適用數值範圍</p>
        <p type="p">D22B:第二適用數值範圍</p>
        <p type="p">D22C:第三適用數值範圍</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="20" publication-number="202625034">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625034</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146537</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>出倉時間預估系統及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250319B">G06Q10/08</main-classification>
        <further-classification edition="202301120250319B">G06Q10/109</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大聯大控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王婉如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WAN-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周哲丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, CHE-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種出倉時間預估系統包含一前台伺服器及一通訊連接該前台伺服器的倉庫伺服器。該前台伺服器根據一訂單請求包含的一訂單類別和一倉庫作業行事曆計算一配貨起始時間，並產生及提供與該訂單請求對應的一訂單資訊給該倉庫伺服器。該倉庫伺服器根據該訂單資訊其中的一貨物料號和一訂單數量計算一出貨箱數，並根據該訂單資訊其中的一倉庫別和該配貨起始時間及該出貨箱數查找該預估時間查找表，以獲得該出倉時間，並提供該出倉時間給該前台伺服器，由該前台伺服器提供該出倉時間給一通訊連接該前台伺服器的客戶端裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S21~S29:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="21" publication-number="202623826">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623826</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146538</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>乾酪乳桿菌ＧＫＣ１用於製備降低血清中內毒素含量之口服組成物的用途</chinese-title>
        <english-title>USE OF LACTOBACILLUS CASEI GKC1 FOR PREPARING ORAL COMPOSITION FOR REDUCING SERUM ENDOTOXIN LEVEL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120241212B">A61K35/741</main-classification>
        <further-classification edition="200601120241212B">A61P37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葡萄王生技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRAPE KING BIO LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳勁初</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIN-CHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳炎鍊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN-LIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林詩偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡侑珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YOU-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王啟憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CI-SIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯毓欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, YU-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林子淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TZU-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石仰慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, YANG-TZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳雅君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YA-JYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林靜雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHING-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江佳琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, JIA-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳姿和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, ZI-HE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN-PO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是有關於一種干酪乳桿菌GKC1用於製備降低血清中內毒素含量之口服組成物的用途。干酪乳桿菌GKC1施予呼吸道過敏的受試者後，可改善受試者的呼吸道阻力，並降低受試者的血清中對過敏原具特異性的免疫球蛋白E含量及內毒素含量，故可作為降低血清中內毒素含量之口服組成物的有效成分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is related to a use of        &lt;i&gt;Lactobacillus casei GKC1&lt;/i&gt;for preparing an oral composition for reducing endotoxin level.        &lt;i&gt;Lactobacillus casei&lt;/i&gt;GKC1 can improve airway resistance of a subject with respiratory allergies as well as reduce a serum allergen-specific immunoglobulin E level and a serum endotoxin level and therefore can be used as an active ingredient of an oral composition for reducing the serum endotoxin level.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">300:直條圖</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="22" publication-number="202624040">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624040</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146545</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池交換裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120241230B">B60L53/80</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光陽工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張志宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明電池交換裝置包含一櫃體、複數架體及複數鎖定機構，該複數架體間隔地設置於該櫃體中，每一鎖定機構對應設置於一架體的末端，並包含一馬達、一撥片、一第一擺臂、一第二擺臂及一感測開關，第一擺臂及第二擺臂能相扣合而將投入架體中的電池上鎖，同時觸發感測開關以判斷電池為上鎖狀態，當要解鎖電池時，馬達連接並能驅動撥片旋轉而抵靠第二擺臂，使第二擺臂旋轉而與第一擺臂分開，電池就能被取出，透過結構設計，鎖定機構僅使用一個感測開關，且透過使用馬達及撥片進行解鎖，在停電時鎖定機構不會將電池鎖定，提升維護及使用便利性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">30:鎖定機構</p>
        <p type="p">31:基座</p>
        <p type="p">311:限位突</p>
        <p type="p">32:馬達</p>
        <p type="p">34:第一擺臂</p>
        <p type="p">341:扣合凹部</p>
        <p type="p">342:鎖勾</p>
        <p type="p">344:限位軌</p>
        <p type="p">35:第二擺臂</p>
        <p type="p">36:感測開關</p>
        <p type="p">37:彈性件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="23" publication-number="202623728">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623728</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146546</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化粧品容器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">A45D33/22</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牧信企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳迦得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作係一種化粧品容器，其包含容裝瓶、能拆組設於容裝瓶內部的補充瓶、能蓋合於補充瓶的封蓋及能蓋合於容裝瓶上的外蓋，容裝瓶於內部容置空間的開口處形成配合凸緣，配合凸緣內側凸伸形成扣接單元，補充瓶外側延伸形成握持部，且補充瓶的外周面能與容裝瓶的扣接單元相互扣接的扣接槽，握持部係設置於該容裝瓶的配合凸緣並延伸至配合凸緣的外側，本創作化粧品容器藉由位在容裝瓶內部的扣接單元與補充瓶的扣接槽相互扣接組合，除了能提供消費者透過更換補充瓶以達到減少資源浪費之效果外，亦能避免污垢殘留及影響外觀的問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:容裝瓶</p>
        <p type="p">11:裝配空間</p>
        <p type="p">12:螺合部</p>
        <p type="p">13:配合凸緣</p>
        <p type="p">14:扣接單元</p>
        <p type="p">15:配合扣部</p>
        <p type="p">20:補充瓶</p>
        <p type="p">21:容室</p>
        <p type="p">22:握持部</p>
        <p type="p">23:扣接槽</p>
        <p type="p">231:導引段</p>
        <p type="p">232:扣接段</p>
        <p type="p">24:止擋凸緣</p>
        <p type="p">30:封蓋</p>
        <p type="p">31:操作凸片</p>
        <p type="p">40:外蓋</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="24" publication-number="202624631">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624631</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146549</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>快脫萬向接頭</chinese-title>
        <english-title>QUICK-RELEASE UNIVERSAL JOINT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250224B">F16C11/06</main-classification>
        <further-classification edition="200601120250224B">B25B23/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寰球企業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANDA TOOL CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳定財</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, TING-YSAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇士傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種快脫萬向接頭，包含一公件及一母件。公件一端成型一連接頭，連接頭之相對兩側分別成型二導引部。母件一端成型一連接槽，連接槽之相對兩側分別組設二限位件，且二限位件一端凸設於連接槽內，連接槽槽底組設一磁性元件，公件的連接頭組設於母件的連接槽內而被磁性元件產生一磁力磁吸，連接槽的二限位件組設於連接頭的二導引部內。藉此，能夠視需求任意替換及快速拆組公件或母件，大大提升靈活性及便利性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A quick-release universal joint comprises a male member and a female member. One end of the male member is formed with a connector, and two guide portions are respectively formed on two opposite sides of the connector. One end of the female member is formed with a connecting groove, two limiting members are respectively assembled on two opposite sides of the connecting groove, one end of each of the two limiting members is protruding disposed in the connecting groove, a magnetic component is assembled at a bottom of the connecting groove, the connector of the male member is assembled in the connecting groove of the female member and is magnetically attracted by a magnetic force generated by the magnetic component, and the two limiting members of the connecting groove are assembled in the two guide portions of the connector. Thereby, the male member or the female member can be replaced and quickly disassembled and assembled as required, greatly improving flexibility and convenience.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:快脫萬向接頭</p>
        <p type="p">11:公件</p>
        <p type="p">11X:第一方向</p>
        <p type="p">111:連接頭</p>
        <p type="p">112:導引部</p>
        <p type="p">1121:底面</p>
        <p type="p">1123:第二側面</p>
        <p type="p">113:公件工作端</p>
        <p type="p">1131:第一套筒</p>
        <p type="p">1132:第一多角孔</p>
        <p type="p">12:母件</p>
        <p type="p">12Y:第二方向</p>
        <p type="p">12X:第三方向</p>
        <p type="p">121:連接槽</p>
        <p type="p">122:限位件</p>
        <p type="p">1221:端面</p>
        <p type="p">1222:周面</p>
        <p type="p">123:容槽</p>
        <p type="p">124:組裝孔</p>
        <p type="p">125:組合孔</p>
        <p type="p">126:定位件</p>
        <p type="p">127:母件工作端</p>
        <p type="p">1271:第二套筒</p>
        <p type="p">1272:第二多角孔</p>
        <p type="p">13:磁性元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="25" publication-number="202624502">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624502</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146567</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鋁鈧合金濺鍍靶材及其製備方法</chinese-title>
        <english-title>ALUMINUM-SCANDIUM ALLOY SPUTTERING TARGET AND PREPARATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241209B">C22C21/00</main-classification>
        <further-classification edition="200601120241209B">C22C28/00</further-classification>
        <further-classification edition="200601120241209B">C22C1/02</further-classification>
        <further-classification edition="200601120241209B">C23C14/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高宥榛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, YU-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳佑明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳禹函</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YU-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鋁鈧合金濺鍍靶材，基本上由10 at%至50 at%的鈧以及90 at%至50 at%的鋁所組成。所述鋁鈧合金濺鍍靶材具有微結構包括金屬鋁基質以及在金屬鋁基質中的介金屬鋁鈧相，所述之介金屬鋁鈧相包括Al        &lt;sub&gt;3&lt;/sub&gt;Sc、Al        &lt;sub&gt;2&lt;/sub&gt;Sc、或AlSc。在鋁鈧合金濺鍍靶材的任意兩個不同的位置中，鈧的含量差異小於等於1 at%，且在鋁鈧合金濺鍍靶材的表面的任意兩個不同的位置中，鋁鈧晶粒尺寸差異小於等於13 μm。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An aluminum-scandium alloy sputtering target consists essentially of 10 at% to 50 at% of scandium and 90 at% to 50 at% of aluminum. The aluminum-scandium alloy sputtering target has microstructure that includes a metallic aluminum matrix and an aluminum-scandium intermetallic phase in the metallic aluminum matrix. The aluminum-scandium intermetallic phase includes Al        &lt;sub&gt;3&lt;/sub&gt;Sc, Al        &lt;sub&gt;2&lt;/sub&gt;Sc, or AlSc. At any two different positions on the aluminum-scandium alloy sputtering target material, the difference in scandium content is less than or equal to 1 at%, and at any two different positions on a surface of the aluminum-scandium alloy sputtering target material, the difference in the aluminum-scandium grains size is less than or equal to 13 μm.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">S101,S103,S105,S107,S109:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="26" publication-number="202624594">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624594</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146571</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於大跨度防洪閘門板的頂部扣壓式固定壓迫柱</chinese-title>
        <english-title>TOP BUCKLE-TYPE FIXED COMPRESSION COLUMN FOR LARGE-SPAN FLOOD CONTROL GATE PANELS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">E02B7/54</main-classification>
        <further-classification edition="200601120241230B">E06B5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯索建築科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANSUO CONSTRUCTION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李寶齡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, PAO-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高宏銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於大跨度防洪閘門板的頂部扣壓式固定壓迫柱，包括壓迫柱主體、頂部扣壓件和底部固定裝置，所述頂部扣壓件設置在所述壓迫柱主體的一端，所述底部固定裝置設置在所述壓迫柱主體的另一端；所述頂部扣壓件包括壓杆、壓杆連結軸、方向調節螺絲、方軸、行程調節螺母、行程調節螺絲和固定底座圓管，所述底部固定裝置包括底部固定裝置固定螺絲；通過頂部扣壓件對大跨度防洪閘門板施加向下的壓力，同時壓迫柱主體提供側向支撐，從而實現對閘門板的穩固固定。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A top buckle-type fixed compression column for large-span flood control gate panels is disclosed. It includes a compression column main body, a top holding member and a bottom fixing device. The top retaining piece is provided at one end of the compression column main body. The bottom fixing device is provided at the other end of the compression column body. The top holding member includes a pressure rod, a pressure rod connecting shaft, a direction adjustment screw, a square shaft, a stroke adjustment nut, a stroke adjustment screw and a fixed base round tube. The bottom fixing device includes a bottom fixing device fixing screw. The top holding member exerts downward pressure on the large-span flood control gate plate, and at the same time the compression column main body provides lateral support, thereby achieving firm fixation of the gate plate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:頂部扣壓件</p>
        <p type="p">2:上部壓迫柱主體</p>
        <p type="p">3:高度調節對鎖螺栓</p>
        <p type="p">4:下部壓迫柱主體</p>
        <p type="p">5:底部固定裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="27" publication-number="202625319">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625319</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146574</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電器插頭端子製作方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250210B">H01R43/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>建通精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇敦禮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧信智</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種電器插頭端子製作方法，係選用JIS C2800規範下含鉛量0.1wt%以下環保低鉛銅捲條料；對該環保低鉛銅捲條料進行沖壓冷鍛加工；並於串列狀態逐一裁切製成端子半成品；再對該端子半成品使用刀具車削前、後端部；然後對該端子半成品後端鑽孔加工，令其形成最終成品。透過該環保低鉛銅之材質延展性較高而適合沖壓冷鍛加工，且透過沖壓冷鍛加工，取代傳統「全面車削」之製法，可以有效降低殘料容易形成捲屑，降低刀具損壞，且降低銅材耗損，符合經濟效益。且令其符合歐盟RoHS或者其他低鉛環保要求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(S1):第一步驟</p>
        <p type="p">(S2):第二步驟</p>
        <p type="p">(S3):第三步驟</p>
        <p type="p">(S4):第四步驟</p>
        <p type="p">(S5):第五步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="28" publication-number="202624725">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624725</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146575</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>表面粗糙度測量方法與表面粗糙度測量系統</chinese-title>
        <english-title>SURFACE ROUGHNESS MEASUREMENT METHOD AND SURFACE ROUGHNESS MEASUREMENT SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120250613B">G01N21/3586</main-classification>
        <further-classification edition="201401120250613B">G01N21/3581</further-classification>
        <further-classification edition="200601120250613B">G01B11/30</further-classification>
        <further-classification edition="200601120250613B">G01B11/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>筑波醫電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED ACEBIOTEK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>官暉舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUAN, HUI-SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許永周</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YUNG-CHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊承山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHAN-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳裕昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳治誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JYH-CHERN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許深福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, SHEN-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種表面粗糙度測量方法，包括產生一太赫茲發射電磁波，並入射至一待測物；偵測該太赫茲發射電磁波入射至該待測物後反射、透射或散射的複數個太赫茲接收電磁波；根據該太赫茲發射電磁波與該複數個太赫茲接收電磁波，測量複數個特徵信號；以及分析該複數個特徵信號，以判斷該待測物之一表面的粗糙度特性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A surface roughness measurement method, includes generating a terahertz emission electromagnetic wave and irradiating it onto a test object; detecting a plurality of terahertz receiving electromagnetic waves that are reflected, transmitted, or scattered after the terahertz emission electromagnetic wave irradiates the test object; measuring a plurality of characteristic signals based on the terahertz emission electromagnetic wave and the plurality of terahertz receiving electromagnetic waves; and analyzing the plurality of characteristic signals to determine surface roughness characteristics of the test object.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:表面粗糙度測量系統</p>
        <p type="p">10:太赫茲電磁波產生器</p>
        <p type="p">12:太赫茲電磁波接收器</p>
        <p type="p">14:檢測裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="29" publication-number="202623958">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623958</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146577</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>活動扳手結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">B25B13/12</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鴻瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>豐鐿企業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FON-I ENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鴻瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HONG-RUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種活動扳手結構，其係包括：一第一本體設有一第一套合部、一第二套合部、一第三套合部、一第一作用端及一第一旋動部；該第一套合部係包括有二第一面、二第二面、一第三面及二端部，該第三面係呈弧面狀，該第二面係位於該第一面及該第三面之間，該第三面係連接二個該第二面，該端部係設於該第一面之角落處；以二維平面觀之，該第三面構成一第一圓、一軸心及一第一半徑；該端部與該軸心之間具有一第一距離，該第二面之長度具有一第二距離，該第一面與該第二面之間具有一第一角度，該端部與該第三套合部之間具有一第三距離。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:第一本體</p>
        <p type="p">11:第一套合部</p>
        <p type="p">12:第二套合部</p>
        <p type="p">13:第三套合部</p>
        <p type="p">14:第一作用端</p>
        <p type="p">15:第一旋動部</p>
        <p type="p">16:貫穿槽</p>
        <p type="p">17:樞孔</p>
        <p type="p">30:第二本體</p>
        <p type="p">31:第四套合部</p>
        <p type="p">32:第五套合部</p>
        <p type="p">33:第六套合部</p>
        <p type="p">34:第二作用端</p>
        <p type="p">35:第二旋動部</p>
        <p type="p">36:咬合部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="30" publication-number="202625299">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625299</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146580</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>頻率選擇表面及通信系統</chinese-title>
        <english-title>FREQUENCY SELECTIVE SURFACE AND COMMUNICATION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">H01Q15/00</main-classification>
        <further-classification edition="200601120250303B">H01Q15/14</further-classification>
        <further-classification edition="200601120250303B">H01Q1/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商鴻運科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CLOUD NETWORK TECHNOLOGY SINGAPORE PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏家笙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, CHIA-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種頻率選擇表面，包括呈週期性排列的多個多頻段陣列單元，每個多頻段陣列單元包括：反射單元，設置於基板的上表面，反射單元包括第一金屬矩形貼片，第一金屬矩形貼片的四邊分別掏空一L形單元，使第一金屬矩形貼片的四邊分別保留一條一端懸空的長條形枝節，形成風車狀；透射單元，設置於基板的上表面，透射單元包括第二金屬矩形貼片，第二金屬矩形貼片的中心掏空一耶路撒冷十字單元；反射單元的第一金屬矩形貼片與透射單元的第二金屬矩形貼片大小相同，並相互重疊，縮小了頻率選擇表面尺寸，滿足小型化需求。本申請還提供一種通信系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A frequency selective surface includes multiple multi-band array units arranged in a periodic manner, and each multi band array unit includes a reflection unit and a transmission unit; the reflection unit is arranged on an upper surface of a substrate, and the reflection unit includes a first metal rectangular patch, four sides of the first metal rectangular patch are respectively hollowed out an L-shaped slot, so that the four sides of the first metal rectangular patch respectively retain a long rectangular branch with one end suspended; the transmission unit is arranged on the upper surface of the substrate, the transmission unit includes a second metal rectangular patch, a center of the second metal rectangular patch is hollowed out a Jerusalem cross slot; the second metal rectangular patch of the transmission unit is the same size as the first metal rectangular patch of the reflection unit, and overlap with each other.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:頻率選擇表面</p>
        <p type="p">10:多頻段陣列單元</p>
        <p type="p">100:反射單元</p>
        <p type="p">101:透射單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="31" publication-number="202624660">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624660</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146581</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>蒸氣鍋爐節省燃料調控裝置</chinese-title>
        <english-title>STEAM BOILER FUEL SAVING CONTROL DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">F23N1/00</main-classification>
        <further-classification edition="200601120241230B">F23N5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王振行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHEN-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連錦信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIEN, CHIN-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉文西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIOU, WEN-CIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳呂華娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN LU, FELICIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳蕙瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HUI YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王振行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHEN-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連錦信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIEN, CHIN-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉文西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIOU, WEN-CIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳呂華娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN LU, FELICIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳蕙瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HUI YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃珊珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種蒸氣鍋爐節省燃料調控裝置，包含一加熱單元、一第一導熱單元，及一受熱單元，該加熱單元包括一加熱模組，該第一導熱單元包括一與該加熱模組連接的第一導熱主體，及一容置於該第一導熱主體中的第一導熱介質，該第一導熱介質中具有油類，特別是蓖麻油，該受熱單元包括一與該第一導熱主體連接的受熱主體，及一容置於該受熱主體中的受熱介質，該第一導熱介質儲存該加熱模組提供的熱量，並將熱量傳導至該受熱介質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fuel-saving control device for a steam boiler includes a heating unit, a first heat conduction unit, and a heating unit. The heating unit includes a heating module. The first thermal conductive unit includes a first thermal conductive body connected to the heating module, and a first thermal conductive medium accommodated in the first thermal conductive body. The first thermal conductive medium contains general oils, especially castor oil. The heat receiving unit includes a heat receiving body connected to the first heat conducting body, and a heat receiving medium accommodated in the heat receiving body. The first heat-conducting medium stores the heat provided by the heating module and conducts the heat to the heated medium.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:加熱單元</p>
        <p type="p">31:加熱模組</p>
        <p type="p">4:第一導熱單元</p>
        <p type="p">41:第一導熱主體</p>
        <p type="p">42:第一導熱介質</p>
        <p type="p">43:第一液位控制模組</p>
        <p type="p">44:第一溫度偵測模組</p>
        <p type="p">45:第一溫度控制模組</p>
        <p type="p">5:受熱單元</p>
        <p type="p">51:受熱主體</p>
        <p type="p">511:受熱管件</p>
        <p type="p">512:受熱加壓泵</p>
        <p type="p">513:受熱容置槽</p>
        <p type="p">514:受熱高溫出口</p>
        <p type="p">52:受熱介質</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="32" publication-number="202623768">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623768</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146584</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多模態超音波肝纖維化檢測系統及其方法</chinese-title>
        <english-title>MULTI-MODAL ULTRASOUND LIVER FIBROSIS DETECTION SYSTEM AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">A61B8/08</main-classification>
        <further-classification edition="201801120241231B">G16H30/00</further-classification>
        <further-classification edition="201801120241231B">G16H50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長庚大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG GUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔博翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUI, PO-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴達英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAI, DAR-IN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案之發明揭露一種多模態超音波肝纖維化檢測系統及其方法。多模態超音波肝纖維化檢測方法，包括：在定量超音波包絡統計成像中僅提取共13個一階統計量的特徵，並對該些特徵進行Z-score標準化和LASSO回歸篩選，然後輸入至支持向量機（SVM）、隨機森林（RF）和線性判別分析（LDA）模型中進行機器學習以建立一分類模型，而用於肝纖維化檢測。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multi-modal ultrasound liver fibrosis detection system and method thereof are disclosed. The multi-modal ultrasound liver fibrosis detection method includes: a step of extracting only a total of 13 first-order statistical features in quantitative ultrasound envelope statistical imaging; a step of performing Z-score normalization and LASSO regression screening on these features; and a step of inputting such processed features to support vector machine (SVM), random forest (RF) and linear discriminant analysis (LDA) models for machine learning to build a classification model for liver fibrosis detection.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1、S2、S3、S4:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="33" publication-number="202625035">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625035</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146585</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>配貨單生成方法及其裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250319B">G06Q10/08</main-classification>
        <further-classification edition="202301120250319B">G06Q10/087</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大聯大控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝智偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周哲丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, CHE-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種配貨單生成方法，適用於對一包括一配貨策略、至少一訂購貨物及其訂購數量的訂單進行配貨處理，並藉由一配貨單生成裝置來實施。該配貨單生成裝置包含一處理模組及一儲存模組，該儲存模組儲存有多筆對應於多個不同貨物的貨物資料。對於每一訂購貨物，該處理模組根據該訂購貨物判定該儲存模組中是否存在對應於該訂購貨物的至少一待選取貨物資料。該處理模組判定該至少一待選取貨物資料是否存在滿足該配貨策略的至少一候選貨物資料。當該處理模組判定出存在該至少一候選貨物資料時，該處理模組根據該至少一候選貨物資料獲得一配貨結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1~8:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="34" publication-number="202624628">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624628</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146586</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>旋轉式自動定位裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">F16B1/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恒昌行精密工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANWIT PRECISION INDUSTRIES LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾英智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, YING-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李毓庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張朝坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為有關一種旋轉式自動定位裝置，該基座係包括座體及蓋體，且座體內部具有貫通之容置空間，而蓋體則設有通孔與容置空間對位、通孔外部表面設有二限位桿柱，可供軸座之軸體組裝於座體的容置空間內部、位於軸體上方設有軸柱為凸出蓋體的通孔外部，而於軸體與軸柱內部設有矩形狀槽孔，且於軸柱上套置有彈性件、以二側之第一定位桿、第二定位桿分別固設於座體及軸體處，再於軸座之軸柱處組裝於旋鈕、可覆蓋於基座的蓋體上，旋鈕上設有二限位滑道分別供二限位桿柱活動穿設，當旋動旋鈕時可帶動軸座旋轉供外部預設固定件組裝或分離，達到快速組裝或拆解之目的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基座</p>
        <p type="p">11:座體</p>
        <p type="p">110:容置空間</p>
        <p type="p">111:對接部</p>
        <p type="p">1111:限位抵擋面</p>
        <p type="p">1112:定位孔</p>
        <p type="p">12:蓋體</p>
        <p type="p">120:通孔</p>
        <p type="p">121:限位桿柱</p>
        <p type="p">1211:頂持桿座</p>
        <p type="p">122:內銜接槽</p>
        <p type="p">1221:止擋切面</p>
        <p type="p">2:軸座</p>
        <p type="p">202:組裝空間</p>
        <p type="p">21:軸體</p>
        <p type="p">211:固定孔</p>
        <p type="p">22:軸柱</p>
        <p type="p">220:第一軸孔</p>
        <p type="p">23:彈性件</p>
        <p type="p">231:第一定位桿</p>
        <p type="p">232:第二定位桿</p>
        <p type="p">3:旋鈕</p>
        <p type="p">30:限位滑道</p>
        <p type="p">32:第二軸孔</p>
        <p type="p">33:固定軸桿</p>
        <p type="p">34:扳轉部</p>
        <p type="p">35:底座</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="35" publication-number="202624481">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624481</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146592</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>胚胎免疫缺陷的細胞疾病模型及其應用</chinese-title>
        <english-title>CELLULAR DISEASE MODEL FOR INBORN ERRORS OF IMMUNITY AND USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120250701B">C12N5/0735</main-classification>
        <further-classification edition="201501120250701B">A61K35/545</further-classification>
        <further-classification edition="200601120250701B">A61K48/00</further-classification>
        <further-classification edition="200601120250701B">A61P35/00</further-classification>
        <further-classification edition="200601120250701B">A61P37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商幹細胞轉化研究中心有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CENTRE FOR TRANSLATIONAL STEM CELL BIOLOGY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　曦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, PHILIP HEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉雪燕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, XUEYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉澎濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, PENGTAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　澤星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAU, CHAK SING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　秀芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, SAU FONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供了一種評估用於治療胚胎免疫缺陷（IEI）的候選藥劑的方法，該方法包括：a）使擴展潛能幹細胞（EPSC）和/或由其分化的細胞的群體與候選藥劑接觸，其中該EPSC來源於包含IEI相關基因中突變的個體的細胞；和b）相對於不與該候選藥劑接觸的個體的細胞的EPSC和/或由其分化的細胞的群體，評估指示EPSC和/或由其分化的細胞的IEI表型的一個或多個特徵的變化。還提供了鑒定用於治療與IEI相關基因中突變相關的IEI的藥劑的方法、治療受試者IEI的方法、以及可用於此類方法的組合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides a method of evaluating a candidate agent for treating Inborn Errors of Immunity (IEI), comprising: a) contacting a population of expanded potential stem cells (EPSCs) and/or cells differentiated therefrom with the candidate agent, wherein the EPSCs are derived from a cell of an individual comprising a mutation in an IEI-related gene; and b) assessing change of one or more characteristics indicative of IEI phenotypes of the EPSCs and/or cells differentiated therefrom relative to a population of EPSCs and/or cells differentiated therefrom from a cell of the individual without contacting with the candidate agent. Methods of identifying an agent for treating IEI related to a mutation in an IEI-related gene, methods of treating IEI in a subject, and compositions useful for such methods are also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="36" publication-number="202625858">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625858</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146597</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子封裝件及其製法</chinese-title>
        <english-title>ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W74/00</main-classification>
        <further-classification edition="202601120260302B">H10W72/20</further-classification>
        <further-classification edition="202601120260302B">H10W42/60</further-classification>
        <further-classification edition="202601120260302B">H10W74/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矽品精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICONWARE PRECISION INDUSTRIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡俊忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, CHUN CHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱志賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHIH-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>焦嘉振</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIAO, CHIA CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊超雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHAO YA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林建成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIEN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張俊陞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHUN-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鑫隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIN-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子封裝件及其製法，主要將一配有第一電子元件之線路結構上藉由導電柱堆疊一包含第二電子元件之封裝模組，使該第一電子元件與第二電子元件相互面對面，並於該第一電子元件與該第二電子元件之間設有屏蔽層，故能同時滿足縮減線路結構之佈設面積及增加屏蔽效果之兩種要求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic package is made by stacking a package module with a second electronic component on a circuit structure with a first electronic component through conductive pillars, and the first electronic component and the second electronic component face each other, and then forming a shielding layer between the first electronic component and the second electronic component. Therefore, it can simultaneously meet the two requirements of reducing the molding area of the circuit structure and increasing the shielding effect.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:電子封裝件</p>
        <p type="p">2a:封裝模組</p>
        <p type="p">20:線路結構</p>
        <p type="p">20a:第一側</p>
        <p type="p">20b:第二側</p>
        <p type="p">21:第一電子元件</p>
        <p type="p">22:第二電子元件</p>
        <p type="p">220,262:導電凸塊</p>
        <p type="p">23:導電柱</p>
        <p type="p">24:包覆層</p>
        <p type="p">25:封裝層</p>
        <p type="p">26:承載結構</p>
        <p type="p">26a:第一表面</p>
        <p type="p">26b:第二表面</p>
        <p type="p">260:佈線層</p>
        <p type="p">261:功能元件</p>
        <p type="p">27:屏蔽件</p>
        <p type="p">28:屏蔽層</p>
        <p type="p">29:導電元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="37" publication-number="202625859">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625859</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146598</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>封裝結構</chinese-title>
        <english-title>PACKAGE STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W74/00</main-classification>
        <further-classification edition="202601120260302B">H10W40/00</further-classification>
        <further-classification edition="200601120260302B">G02B6/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矽品精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICONWARE PRECISION INDUSTRIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊舒萍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHU PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佳熹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHIA HSI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳亮斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LIANG-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種封裝結構，包含有基板結構、光電模組、散熱件及光通訊單元。該散熱件及該光電模組設置於該基板結構上，其中，該散熱件具有一開槽，該光電模組具有一光子晶片，該開槽用於供該光通訊單元穿設並與光子晶片連接，藉以提昇散熱效率並縮短訊號傳輸距離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a package structure which comprises: an optical engine module, a heat sink and an optical communication unit. The heat sink and the optical engine module are arranged on the substrate structure, wherein the heat sink has a slot, the optical engine module has a photonic IC, and the slot is used for the optical communication unit to pass through and connect with photonic IC to improve heat dissipation efficiency and shorten signal transmission distance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:封裝結構</p>
        <p type="p">20:基板結構</p>
        <p type="p">201:絕緣層</p>
        <p type="p">202:線路層</p>
        <p type="p">21:光電模組</p>
        <p type="p">210:佈線結構</p>
        <p type="p">210a:第一側</p>
        <p type="p">210b:第二側</p>
        <p type="p">211:半導體元件</p>
        <p type="p">212:電子元件</p>
        <p type="p">213:光子元件</p>
        <p type="p">214:導電凸塊</p>
        <p type="p">22:散熱件</p>
        <p type="p">221:遮蓋部</p>
        <p type="p">222:支撐部</p>
        <p type="p">220:導熱介電材</p>
        <p type="p">2220:開槽</p>
        <p type="p">223:容置空間</p>
        <p type="p">23:光通訊單元</p>
        <p type="p">24:導電元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="38" publication-number="202625066">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625066</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146601</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自訂投資損益多群組之裝置、方法與電腦程式產品</chinese-title>
        <english-title>DEVICE, METHOD, AND COMPUTER PROGRAM PRODUCT OF CUSTOMIZED MULTIPLE INVESTMENT PROFIT AND LOSS GROUPS FOR OWNED SHARES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120250303B">G06Q40/06</main-classification>
        <further-classification edition="201201120250303B">G06Q40/04</further-classification>
        <further-classification edition="202301220250303B">G06Q10/087</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三竹資訊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITAKE INFORMATION CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱宏哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, HUNG CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鼎堅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自訂投資損益多群組之裝置、方法與電腦程式產品。該方法包含：與中台伺服器建立連線並接收庫存股名單；產生包含群組管理按鍵的庫存股視圖；接收群組管理指令產生庫存群組管理視圖；接收群組分派指令以將庫存股設置於群組；產生庫存群組名單；於庫存股視圖揭示庫存群組名單中群組各自所包含的庫存股及所對應的個股損益資訊或／與個股報酬率，以及各群組所對應的群組損益資訊或／與群組報酬率。透過本發明讓使用者可自訂庫存股的群組分類，以清楚瞭解各群組的群組損益與群組報酬率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure is related to a device, method, and computer program product of customized multiple investment profit and loss groups for owned shares. Establish a connection with the middleware server and receive an owned shares list; generate an owned shares view containing a group management button; generate a group management view; receive a group assignment command to assign the owned shares to the groups; display the owned shares contained in each group, along with the corresponding individual share profit and loss and/or individual share return rate, as well as the corresponding group profit and loss and/or group return rate for each group. Users can customize the groups of owned shares to clearly understand the profit and loss and return rate of each group.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:應用程式</p>
        <p type="p">22:登入驗證模組</p>
        <p type="p">24:庫存股視圖模組</p>
        <p type="p">26:庫存群組管理模組</p>
        <p type="p">36:下單交易模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="39" publication-number="202625692">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625692</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146604</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>導電材料列印及移除方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260316B">H10P50/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德芮達科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱雲堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡欣佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昆亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林明璇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係揭露一種導電材料列印及移除方法，係至少包括下列步驟：第一噴塗步驟：利用第一噴塗模組將一水解材料噴塗於一基板表面；第一固化步驟：利用第一固化模組將噴塗於該基板表面之水解材料加熱，以令該水解材料固化；第二噴塗步驟：利用該第二噴塗模組將一導電材料噴塗於已固化後之該水解材料上；第二固化步驟：利用第二固化模組將噴塗於該水解材料之該導電材料加熱，以令該導電材料固化；以及一移除步驟：利用一水溶液以水解的方式將已固化之該水解材料及該導電材料去除。因此，本發明之導電材料列印及移除方法係以溫和且不具破壞性的方法將導電材料去除。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:第一噴塗步驟</p>
        <p type="p">S2:第一固化步驟</p>
        <p type="p">S3:第二噴塗步驟</p>
        <p type="p">S4:第二固化步驟</p>
        <p type="p">S5:移除步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="40" publication-number="202624972">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624972</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146610</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資料處理裝置及資料處理方法</chinese-title>
        <english-title>DATA PROCESSING DEVICE AND DATA PROCESSING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">G06F13/28</main-classification>
        <further-classification edition="200601120250303B">G06F3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝憲慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, HSIEN-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃柏涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, PO-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許芷瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳泳超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YUNG-CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種資料處理裝置。資料處理裝置包括主記憶體、多個運算單元、直接記憶體存取控制器以及群播控制器。主記憶體被配置成儲存資料，其中資料包括單播資料或群播資料。多個運算單元被配置成處理資料。直接記憶體存取控制器被配置成從主記憶體取得資料，並將單播資料提供到多個運算單元中的一個單播運算單元，且將群播資料提供到群播控制器。群播控制器被配置成從直接記憶體存取控制器取得群播資料，並將群播資料同時地提供到多個運算單元中的多個群播運算單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure provides a data processing device. The data processing device includes a main memory, a plurality of processing elements, a direct memory access controller, and a multicast controller. The main memory is configured to store data, wherein the data includes unicast data or multicast data. The plurality of processing elements are configured to process the data. The direct memory access controller is configured to obtain the data from the main memory, provide the unicast data to one unicast computing unit of the plurality of computing units, and provide the multicast data to the multicast controller. The multicast controller is configured to obtain the multicast data from the direct memory access controller and simultaneously provide the multicast data to the plurality of multicast processing elements of the plurality of processing elements.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:資料處理裝置</p>
        <p type="p">110:主記憶體</p>
        <p type="p">120:直接記憶體存取控制器</p>
        <p type="p">122:匯流排</p>
        <p type="p">130:群播控制器</p>
        <p type="p">132:群播通道</p>
        <p type="p">140:運算單元</p>
        <p type="p">M:主埠</p>
        <p type="p">Z:群播埠</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="41" publication-number="202623779">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623779</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146612</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>人體組織檢驗套組</chinese-title>
        <english-title>TEST KIT FOR HUMAN TISSUE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250701B">A61J1/05</main-classification>
        <further-classification edition="202301120250701B">A61J1/14</further-classification>
        <further-classification edition="200601120250701B">A61B10/00</further-classification>
        <further-classification edition="200601120250701B">G01N21/78</further-classification>
        <further-classification edition="200601120250701B">G01N33/52</further-classification>
        <further-classification edition="200601120250701B">G01N33/487</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑩芳有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IN FUNG CO.LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王上宜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHANG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇士傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種人體組織檢驗套組，包含：一底座，頂面凹設有一容置槽且至少於容置槽處為透明者而可自外目視；一試紙，設於容置槽底部且具檢測與顯色功能，以供自外目視檢測結果；一黏貼層，具有黏貼面供黏貼於底座之頂面以覆蓋容置槽；一壓抵塊，具有第一面與第二面，第一面設置於黏貼層之黏貼面，第二面朝向底座且表面具有複數凸起部分，壓抵塊對應容置槽之位置與形狀，當待測人體組織置入容置槽，再將黏貼層黏貼至該底座之頂面後，壓抵塊之第二面壓抵該人體組織而使其汁液流出以沾濕試紙，藉以對該人體組織進行特定檢驗並供自底座之底部目視確認。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The test kit for human tissue includes a seat, a test paper, an adhesion layer, and a pressing piece. The seat is formed with a receiving groove on its top face, and the seat is transparent at least at the receiving groove. The test paper is arranged at the bottom of the receiving groove and is able to test and to show the result in colors. The adhesion layer has a adhesion face to adhere onto the top face of the seat to cover the receiving groove. The pressing piece has a first face and a second face. The first face is disposed on the adhesion face of the adhesion layer, and the second face has plural protrusions. The position and the shape of the pressing piece coreespond to those of the receiving groove. When the human tissue is placed into the receiving groove, and the adhesion layer adheres onto the top face of the seat, the second face of the pressing piece presses the human tissue to squeeze the fluid out to make the test paper wet. Thereby, test can be achieved, and is able to be checked from the bottom of the seat.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:底座</p>
        <p type="p">11:容置槽</p>
        <p type="p">20:試紙</p>
        <p type="p">30:黏貼層</p>
        <p type="p">40:壓抵塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="42" publication-number="202623911">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623911</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146617</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水垢清除裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">B08B9/08</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余國賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋富璘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余國賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋富璘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡芝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為應用於冷卻水池的一種水垢清除裝置，用以解決水箱長時間靜置產生水垢不易清洗的問題，係包含有:一本體，係由一第一殼體及一第二殼體互相接設形成該本體並形成一容置空間，其中該容置空間填充液態物質，又其中該第一殼體及該第二殼體皆設有一窩孔；一銜接管件組，其中一第一銜接件接設於該第一殼體的窩孔，且該第一銜接件設有一注入通道，又其中一第二銜接件接設於第二殼體的窩孔；一封閉組件，係該封閉組件設置於該銜接管件組的注入通道並設有一密封膠塗布於該封閉組件之表面；藉由共振效應解決冷卻水在其外表生成硬實的水垢之問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">A:水垢清除裝置</p>
        <p type="p">1:本體</p>
        <p type="p">11:第一殼體</p>
        <p type="p">2:銜接管件組</p>
        <p type="p">21:第一銜接件</p>
        <p type="p">22:第二銜接件</p>
        <p type="p">4:環體</p>
        <p type="p">5:矽膠保護層</p>
        <p type="p">51:半圓</p>
        <p type="p">511:密封弧邊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="43" publication-number="202624684">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624684</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146621</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>弓箭裝置之卸弦結構</chinese-title>
        <english-title>A STRING-UNLOADING STRUCTURE OF A BOW AND ARROW DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250603B">F41B5/14</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>保聯企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POE LANG ENTERPRISE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉吉昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHI-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊益松</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明一種弓箭裝置之卸弦結構，其主要裝設於槍體的控制匣殼並與保險模組及扣發模組相組合，控制匣殼設有開口，控制匣殼內部且鄰近於保險模組、扣發模組處係設有容置室並連接開口，其包括: 旋控件裝設於控制匣殼且部分設於容置室內，另一部分凸出於開口，旋控件相對開口旋轉而使凸出於開口的部分從開口末入容置室；推桿件包含夾持部及推抵部，夾持部夾設旋控件位於容置室的部分，又推抵部於旋控件活動末入容置室時推動保險模組及扣發模組；二彈性件分別設置旋控件及推抵部之間，以及容置室與旋控件端部之間，利用旋控件相對控制匣殼的按壓可控制並解除保險模組，以及解除扣發模組對弓弦的勾抵，藉此即可控制弓弦緩速的移動至未上弦的位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is a string-unloading structure of a bow and arrow device. It is mainly installed on the control box shell of the gun body and is combined with the safety module and the hair-locking module. The control box shell is provided with an opening. The control box shell is inside and adjacent to the safety module. The assembly and the hair fastening module are provided with a holding chamber and connected to the opening, which includes: the rotary control is installed on the control box shell and is partially located in the holding chamber, and the other part protrudes from the opening. The rotary control rotates relative to the opening to cause the protrusion to The part that comes out of the opening enters the accommodation chamber from the opening; the push rod component includes a clamping part and a pushing part, the clamping part clamps the part of the rotating control located in the accommodation chamber, and the pushing part enters the accommodation after the rotation control moves When placing the chamber, push the safety module and the locking module; the two elastic members are respectively arranged between the rotary control and the pushing part, and between the accommodation chamber and the end of the rotary control. The rotation control can be controlled by pressing the rotary control relative to the control box shell. Release the safety module and release the hooking of the bowstring by the buckle module, thereby controlling the bowstring to move slowly to the unstrung position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:旋控件</p>
        <p type="p">11:控壓段</p>
        <p type="p">15:凸擋肋</p>
        <p type="p">2:推桿件</p>
        <p type="p">3:彈性件</p>
        <p type="p">200:控制匣殼</p>
        <p type="p">200A:容置室</p>
        <p type="p">200B:底容室</p>
        <p type="p">200C:上容室</p>
        <p type="p">202:剖孔</p>
        <p type="p">204:弦扣剖道</p>
        <p type="p">4060:扳機扣件</p>
        <p type="p">4061:連桿</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="44" publication-number="202624065">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624065</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146623</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>組合式自行車貨架結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">B62J7/04</main-classification>
        <further-classification edition="200601120241231B">B62J7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜海寰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜海寰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種組合式自行車貨架結構，包括：一貨架體，係為一平板狀，其前後二邊端分別設有左右凹垣，該等左右凹垣內設有一連結孔；一前支撐架，係略呈倒V形之平面板條狀，上端為與貨架體前端之二左右凹垣連結之連結部，分別藉由一鎖扣與貨架體鎖結；一後支撐架，係為呈倒V形之平面板條狀，上端為與貨架體後端之二左右凹垣連結之連結部，分別藉由一鎖扣與貨架體鎖結；二貨架腳，分別接設於二前後支撐架下端，以配合鎖設固定於自行車車架之後叉端，藉此由於該貨架體與該二前、後支撐架為板片狀之一體成形，且採組合式之結構組裝，組裝上不僅不用專業焊接且包裝材積亦可大幅減少，同時亦可提升該貨架之整體結構強度，增加該貨架鎖固於該自行車車架後叉部之穩定性。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:貨架體</p>
        <p type="p">11:前左右凹垣</p>
        <p type="p">12:後左右凹垣</p>
        <p type="p">13:第一穿孔</p>
        <p type="p">14:第二穿孔</p>
        <p type="p">20:前支撐架</p>
        <p type="p">22、23:兩側板架</p>
        <p type="p">221、231:貫孔</p>
        <p type="p">30:後支撐架</p>
        <p type="p">32、33:兩側板架</p>
        <p type="p">321、331:貫孔</p>
        <p type="p">50:貨架腳</p>
        <p type="p">55:軸孔</p>
        <p type="p">60:前支架</p>
        <p type="p">61:波浪狀條孔</p>
        <p type="p">62:抵接端</p>
        <p type="p">63:U形狀剖溝</p>
        <p type="p">64:凸勾</p>
        <p type="p">A1:第一螺栓</p>
        <p type="p">A3:第三螺栓</p>
        <p type="p">A5:第五螺栓</p>
        <p type="p">A6:第六螺栓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="45" publication-number="202624255">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624255</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146625</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>小球藻胜肽製程及其用途與抗牙周病菌口凝膠</chinese-title>
        <english-title>MANUFACTURING PROCEDURE OF CHLORELLA PEPTIDES, USE OF THE SAME AND ANTI-BACTERIA ORAL GEL FOR PERIODONTITIS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">C07K14/405</main-classification>
        <further-classification edition="200601120250501B">A61K38/16</further-classification>
        <further-classification edition="200601120250501B">A61P1/02</further-classification>
        <further-classification edition="200601120250501B">A61P31/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台建生技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAI JIAN BIOTECH CO,. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王舒眉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHU-MEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱建民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIOU, CHIEN-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張嘉祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIA-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁庭彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, TING-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱智東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHIH-TUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴貞余</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHEN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏福楨</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種小球藻胜肽及其用途與抗牙周病菌口凝膠，其中該小球藻胜肽係以特定製法製成，所製的該小球藻胜肽經實驗證明具有抑制牙周病菌的效果，而可與預定成份製成抗牙周病菌口凝膠，以改善先前技術中小球藻萃取物之抑菌效果不佳的問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention related to a kind of chlorella peptides, use of the same and anti-bacteria oral gel for periodontitis. The chlorella peptides are produced by specific method. It was proved that the chlorella peptides of the present invention has the ability to inhibit periodontitis bacteria. So the chlorella peptides can mixed with other ingredients to produce anti-bacteria oral gel for periodontitis to improve the problem about the chlorella extract of the prior art does not have enough anti-bacteria ability.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="46" publication-number="202624482">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624482</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146629</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製備用於療法之強固間葉基質細胞之試劑及方法</chinese-title>
        <english-title>REAGENTS AND METHODS FOR PREPARING ROBUST MESENCHYMAL STROMAL CELLS FOR THERAPY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120250701B">C12N5/0775</main-classification>
        <further-classification edition="201501120250701B">A61K35/28</further-classification>
        <further-classification edition="200601120250701B">A61P39/06</further-classification>
        <further-classification edition="200601120250701B">A61P17/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威斯康辛校友研究基金會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISCONSIN ALUMNI RESEARCH FOUNDATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　萬柱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, WAN-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於選擇具有治療應用優勢性質的MSC(特別是與細胞老化相關之彼等MSC及產生具有適當及足夠強固性之MSC)之試劑及方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides reagents and methods for selecting MSCs having advantageous properties for therapeutic applications, particularly those related to cellular aging and producing MSCs of appropriate and sufficient robustness.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="47" publication-number="202625129">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625129</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146643</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>畫素電路</chinese-title>
        <english-title>PIXEL CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250218B">G09G3/30</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李念真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, NIEN-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王雅榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YA-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃書豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHU-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種畫素電路包含發光元件、電容、驅動電晶體、第一寫入電路、第二寫入電路、補償電路、第一電晶體以及第二電晶體。發光元件耦接第一系統電壓源。電容耦接第一節點及第二節點。驅動電晶體耦接第一節點及第三節點。第一寫入電路對第一節點寫入資料電壓。第二寫入電路分別對第二節點及第三節點寫入初始電壓。補償電路對第二節點補償，且透過電容提升第一節點之準位。第一電晶體響應驅動訊號導通，改變第三節點之準位。第二電晶體響應驅動訊號導通，透過第三節點及第一節點之準位導通驅動電晶體，產生驅動電流，點亮發光元件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pixel circuit includes a light-emitting element, a capacitor, a driving transistor, a first writing circuit, a second writing circuit, a compensation circuit, a first transistor and a second transistor. The light-emitting element is coupled to a first system voltage source. The capacitor is coupled to a first node and a second node. The driving transistor is coupled to the first node and a third node. The first writing circuit is configured to write a data voltage to the first node. The second writing circuit is configured to write an initial voltage to the second node and the third node. The compensation circuit is configured to compensate the second node and increase a voltage level of the first node through the capacitor. The first transistor is conducted in response to a driving signal to change a voltage level of the third node. The second transistor is conducted in response to the driving signal to conduct the driving transistor through the voltage levels of the first node and third node so as to generate a driving current to light up the light-emitting element.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:畫素電路</p>
        <p type="p">110:第一寫入電路</p>
        <p type="p">120:第二寫入電路</p>
        <p type="p">130:補償電路</p>
        <p type="p">EM[n-2],EM[n]:驅動訊號</p>
        <p type="p">SN[n]:第一控制訊號</p>
        <p type="p">EMC[n]:第二控制訊號</p>
        <p type="p">T1~T6,DT1:電晶體</p>
        <p type="p">C1:電容</p>
        <p type="p">Vdata:資料電壓</p>
        <p type="p">DL:資料線</p>
        <p type="p">EM_Vgl:補償電壓之電壓準位</p>
        <p type="p">L:發光元件</p>
        <p type="p">N1~N3:節點</p>
        <p type="p">SVDD,SVSS:系統電壓源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="48" publication-number="202625132">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625132</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146644</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>畫素驅動電路</chinese-title>
        <english-title>PIXEL DRIVING CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120250418B">G09G3/32</main-classification>
        <further-classification edition="201601120250418B">G09G3/3225</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇文銓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, WEN-CHIUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林子淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TSU-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡靈櫻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, LING-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳弘基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUNG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種畫素驅動電路，包含補償、發光、重置及測試電路。補償電路的第一電晶體耦接於系統高電壓及第二節點之間，控制端耦接第一節點；其第二電晶體耦接於第一節點及第二節點之間，控制端接收第一掃描訊號；其電容器耦接於第一節點及第三節點之間。發光電路的第三電晶體耦接於第二節點及第四節點之間，控制端接收發光控制訊號，而其發光元件耦接於第四節點及系統低電壓之間。重置電路的第四電晶體耦接於第三節點及第四節點之間，控制端接收第二掃描訊號。測試電路的第五電晶體耦接於第四節點及資料電壓之間，控制端接收測試訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pixel driving circuit includes a compensation circuit, a light emitting circuit, a reset circuit, and a test circuit. The compensation circuit includes a first transistor coupled between a system high voltage and a second node, with a control terminal coupled to a first node; a second transistor coupled between the first node and the second node, with a control terminal receiving a first scanning signal; and a capacitor coupled between the first node and a third node. The light emitting circuit includes a third transistor coupled between the second node and a fourth node, with a control terminal receiving a light emitting control signal, and its light emitting element is coupled between the fourth node and a system low voltage. The reset circuit includes a fourth transistor coupled between the third node and the fourth node, with a control terminal receiving a second scanning signal. The test circuit includes a fifth transistor coupled between the fourth node and a data voltage, with a control terminal receiving a test signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:畫素驅動電路</p>
        <p type="p">110:補償電路</p>
        <p type="p">120:發光電路</p>
        <p type="p">130:重置電路</p>
        <p type="p">140:測試電路</p>
        <p type="p">AT:測試訊號</p>
        <p type="p">C1:電容器</p>
        <p type="p">Data:資料電壓</p>
        <p type="p">EM:發光控制訊號</p>
        <p type="p">LED:發光元件</p>
        <p type="p">N1:第一節點</p>
        <p type="p">N2:第二節點</p>
        <p type="p">N3:第三節點</p>
        <p type="p">N4:第四節點</p>
        <p type="p">Q1:第一電晶體</p>
        <p type="p">Q2:第二電晶體</p>
        <p type="p">Q3:第三電晶體</p>
        <p type="p">Q4:第四電晶體</p>
        <p type="p">Q5:第五電晶體</p>
        <p type="p">S1:第一掃描訊號</p>
        <p type="p">S2:第二掃描訊號</p>
        <p type="p">VDD:系統高電壓</p>
        <p type="p">VSS:系統低電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="49" publication-number="202624753">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624753</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146645</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接器、電子裝置、電子裝置的檢測系統及檢測方法</chinese-title>
        <english-title>CONNECTOR, ELECTRONIC DEVICE, INSPECTION SYSTEM OF ELECTRONIC DEVICE AND INSPECTION METHOD OF ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250925B">G01R1/04</main-classification>
        <further-classification edition="200601120250925B">G01R1/06</further-classification>
        <further-classification edition="200601120250925B">G01R31/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞儀光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RADIANT OPTO-ELECTRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳弘昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUNG-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHE-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪世杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORNG, SHYH-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹誌銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, CHIH-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種連接器，包含殼體及多個接腳。殼體具有檢測面，這些接腳設置於殼體中並沿第一方向延伸，且沿不同於第一方向的第二方向間隔設置。殼體的檢測面具有多個檢測孔，這些檢測孔沿第二方向間隔設置並分別暴露這些接腳。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A connector includes a shell and multiple pins. The shell has an inspection surface. The pins are disposed in the shell, extend in a first direction, and are arranged at intervals in a second direction different from the first direction. The inspection surface of the shell has multiple inspection holes arranged at intervals in the second direction and exposing the pins respectively.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:連接器</p>
        <p type="p">102:殼體</p>
        <p type="p">102C:掀蓋</p>
        <p type="p">104:接腳</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">DS:檢測面</p>
        <p type="p">E1:第一連接側</p>
        <p type="p">E2:第二連接側</p>
        <p type="p">O:檢測孔</p>
        <p type="p">O1:第一排檢測孔</p>
        <p type="p">O2:第二排檢測孔</p>
        <p type="p">P1、P2:排列間距</p>
        <p type="p">P3:設置間距</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="50" publication-number="202624781">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624781</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146646</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池壽命檢測器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250407B">G01R31/392</main-classification>
        <further-classification edition="202001120250407B">G01R31/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>精英電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELITEGROUP COMPUTER SYSTEMS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許家緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIA-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱振發</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIOU, CHEN-FA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡秀玫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡依庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電池壽命檢測器，其係先將規格控制模組輸入規格資料，需求控制模組輸入需求資料，當偵測模組偵測電池之電流並產生電流資料，計算模組接收並依據電流資料、規格資料及需求資料產生壽命資料及計算結果，輸出模組依據計算結果產生輸出訊號，以解決習知在量測電池壽命時僅透過電池健康狀態預測電池的剩餘壽命，並無法提供精確的電池壽命之問題，以及在預測電池的剩餘壽命之同時無法達到快速檢測電池壽命之功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電池壽命檢測器</p>
        <p type="p">3:電池</p>
        <p type="p">32:電流</p>
        <p type="p">10:偵測模組</p>
        <p type="p">11:電流資料</p>
        <p type="p">20:規格控制模組</p>
        <p type="p">21:規格資料</p>
        <p type="p">30:需求控制模組</p>
        <p type="p">31:需求資料</p>
        <p type="p">40:計算模組</p>
        <p type="p">41:壽命資料</p>
        <p type="p">43:計算結果</p>
        <p type="p">50:輸出模組</p>
        <p type="p">51:輸出訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="51" publication-number="202625346">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625346</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146650</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>混合式差動放大器及其方法</chinese-title>
        <english-title>HYBRID DIFFERENTIAL AMPLIFIER AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200701120250303B">H02M1/42</main-classification>
        <further-classification edition="200701120250303B">H02M1/44</further-classification>
        <further-classification edition="200601120250303B">H03F3/45</further-classification>
        <further-classification edition="200601120250303B">H03F3/42</further-classification>
        <further-classification edition="200601120250303B">H02M3/156</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立錡科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHTEK TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳奕光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-KUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫紹茗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, SHAO-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭鳴均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, MING-JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許麗美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種混合式差動放大器，包括：第一至第四脈寬調變電路，比較三角波訊號與濾波訊號產生脈寬調變訊號；第一處理電路，根據脈寬調變訊號和輸入訊號正負值產生脈寬處理訊號；判斷電路，依據差動輸入訊號位準產生選擇訊號；選擇電路，根據選擇訊號和脈寬處理訊號產生切換控制訊號；第一、第二功率級電路，依據切換訊號產生切換電壓，切換電感以產生輸出訊號。在輕載範圍外時，第一切換訊號控制切換電壓在較高電壓與接地間切換，第二切換訊號接近基頻；在輕載範圍內時，切換控制訊號控制切換電壓在較低電壓與接地間切換。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A hybrid amplifier includes: a first to fourth PWM circuit, comparing triangular wave signals and filter signals to generate PWM signals; a first processing circuit, generating pulse-width processed signals based on the PWM signals and the polarity of input signals; a judgment circuit, generating a selection signal based on the level of a differential input signal; a selection circuit, generating switching control signals according to the selection signal and the pulse-width processed signals; and a first and second power stage generating switching voltages based on the switching control signals to switch an inductor to generate output signals. When outside the light-load range, the first switching signal controls the switching voltage to alternate between a higher voltage and ground, while the second switching signal is close the fundamental frequency. When within the light-load range, the switching control signals control the switching voltage to alternate between a lower voltage and ground.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:混合式差動放大器</p>
        <p type="p">201:訊號選擇電路</p>
        <p type="p">202:迴路濾波電路</p>
        <p type="p">203a,203b,203c,203d:脈寬調變電路</p>
        <p type="p">204:訊號判斷電路</p>
        <p type="p">205:遮罩倍頻電路</p>
        <p type="p">206a,206b:功率級電路</p>
        <p type="p">207:負載</p>
        <p type="p">A1,A2,Ab:切換控制訊號</p>
        <p type="p">C1,C2,Cb:切換控制訊號</p>
        <p type="p">CMPn1,CMPn2,CMPp1,CMPp2:脈寬調變訊號</p>
        <p type="p">Co:輸出電容</p>
        <p type="p">Lp:電感</p>
        <p type="p">LXn,LXp:切換節點</p>
        <p type="p">Ndn1,1-Ndn1,Ndp1,1-Ndp1:脈寬遮罩倍頻訊號</p>
        <p type="p">SEL_LL:輕載選擇訊號</p>
        <p type="p">SEL_Rb:位準選擇訊號</p>
        <p type="p">Ven,Vep:濾波訊號</p>
        <p type="p">Vid:差動輸入訊號</p>
        <p type="p">Vip,Vin:輸入訊號</p>
        <p type="p">VLXn,VLXp:切換電壓</p>
        <p type="p">Vod:差動輸出訊號</p>
        <p type="p">Von,Vop:輸出訊號</p>
        <p type="p">Vtr1,Vtr2:三角波訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="52" publication-number="202624248">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624248</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146652</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>有機金屬化合物以及金屬釕膜之製造方法</chinese-title>
        <english-title>ORGANOMETALLIC COMPOUNDS AND METHODS FOR MANUFACTURING METALLIC RUTHENIUM FILM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260316B">C07F17/02</main-classification>
        <further-classification edition="200601120260316B">C23C16/18</further-classification>
        <further-classification edition="200601120260316B">C23C16/455</further-classification>
        <further-classification edition="202601120260316B">H10P70/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏紫伃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, ZI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李勇杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YONG-JAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>包郁傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAO, YU-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳世言</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHI-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃柏元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, PO-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳彥儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YEN-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種具有如式(I)所示結構之有機金屬化合物以及金屬釕膜之製造方法，該有機金屬化合物之沸點及氣化溫度較低，藉此，該有機金屬化合物能夠合適地作為前驅物以形成良好的金屬鍍膜。        &lt;br/&gt;&lt;img align="absmiddle" height="188px" width="362px" file="ed10014.JPG" alt="ed10014.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides an organometallic compound represented by formula (I) and a method for manufacturing a ruthenium metal film. The organometallic compound has a lower boiling point and a lower vaporization temperature. Therefore, the organometallic compound can be suitably used as a precursor to form a high-quality metal coating.        &lt;br/&gt;&lt;img align="absmiddle" height="193px" width="353px" file="ed10015.JPG" alt="ed10015.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="53" publication-number="202625210">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625210</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146654</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>急性缺血性中風評估模型的建立方法、急性缺血性中風評估方法及急性缺血性中風評估系統</chinese-title>
        <english-title>METHOD FOR ESTABLISHING ACUTE ISCHEMIC STROKE MODEL, METHOD FOR EVALUATING ACUTE ISCHEMIC STROKE AND ACUTE ISCHEMIC STROKE EVALUATING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120241219B">G16H50/20</main-classification>
        <further-classification edition="201801120241219B">G16H50/30</further-classification>
        <further-classification edition="201801120241219B">G16H30/40</further-classification>
        <further-classification edition="201701120241219B">G06T7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國醫藥大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA MEDICAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王韋竣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WEI-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡昇達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, SHENG-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮　登科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, DANG-KHOA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林敬庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHING-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊玉婉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YU-WAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳亞倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YA-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂明桂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, MING-KUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡崇豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHON-HAW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許凱程</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, KAI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡上淯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, SHANG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種急性缺血性中風評估系統，包含一記憶體以及一處理器。記憶體用以儲存一受試者的複數個目標無顯影劑電腦斷層影像及複數個目標核磁共振影像。處理器訊號連接記憶體，處理器包含一標記模組、一三維影像生成模組、一圖像分割模組及一缺血性中風評估模型。藉此，本發明之急性缺血性中風評估系統可用於評估受試者發生急性缺血性中風於24小時內的缺血性區域，以解決臨床上對於早期發生急性缺血性中風診斷的困難。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an acute ischemic stroke evaluating system, including a random access memory and a processor. The random access memory is used for storing a plurality of target non-contrast CT images and a plurality of target magnetic resonance images of a subject. The processor is signally connected to the random access memory, and the processor includes a marked module, a three-dimensioned image generation module, an image segmentation module and an acute ischemic stroke evaluating model. Therefore, the acute ischemic stroke evaluating system of the present disclosure can be used to evaluate an ischemic area of a subject occur acute ischemic stroke within 24 hours, so as to solve the clinical difficulty of diagnosing early occurrence of acute ischemic stroke.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:急性缺血性中風評估系統</p>
        <p type="p">310:記憶體</p>
        <p type="p">320:處理器</p>
        <p type="p">321:標記模組</p>
        <p type="p">322:三維影像生成模組</p>
        <p type="p">323:圖像分割模組</p>
        <p type="p">324:缺血性中風評估模型</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="54" publication-number="202623739">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623739</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146655</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>咖啡粉體整壓裝置</chinese-title>
        <english-title>COFFEE POWDER DISTRIBUTING AND TAMPING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241209B">A47J31/44</main-classification>
        <further-classification edition="200601120241209B">B65B1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊育旻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YUMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊育旻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YUMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種咖啡粉體整壓裝置包含一裝置殼體、一固定支架、一壓粉伸縮組件以及一整粉模組。裝置殼體係具有一容置空間以及一操作開口。粉杯承接架與壓粉伸縮組件透過固定支架固接於裝置殼體。整粉模組連結於壓粉伸縮組件，並具有一壓粉筒與一整粉針盤，且可透過複數個整粉伸縮組件帶動。在一整粉階段時，整粉針盤是透過整粉伸縮組件與整粉驅動組件之帶動而使整粉針伸入粉杯內攪動咖啡粉體，而在咖啡粉體均勻散布後，可藉由整粉針與壓粉筒所形成之壓粉平面將粉體壓平。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A coffee powder distributing and tamping device includes a device shell, a fixed bracket, a tamping telescopic assembly, and a powder distributing module. The device shell has a storage space and an operating opening. The basket holder and the tamping telescopic assembly are fixedly connected to the device shell through the fixed bracket. The powder distributing module is connected to the tamping telescopic assembly, and has a powder pressing cylinder and a powdering needle plate, which can be driven by multiple powdering stretching assemblies. During a powder distribution stage, the powder needle plate is driven by the powder tamping telescopic assembly and a powder distributing driving assembly to extend into a basket and stir a coffee powder. After the coffee powder is evenly distributed, the coffee powder can be flattened by a pressing plane formed by the powder needle and the pressing cylinder.</p>
      </isu-abst>
      <representative-img>
        <p type="p">21:支架本體</p>
        <p type="p">211:內側承接板</p>
        <p type="p">221:頂板</p>
        <p type="p">41:第一驅動器</p>
        <p type="p">411:第一伸縮桿</p>
        <p type="p">42:第一彈簧</p>
        <p type="p">43:壓力感測器</p>
        <p type="p">44:第二彈簧</p>
        <p type="p">51:整粉模組殼體</p>
        <p type="p">5113:背板</p>
        <p type="p">51131:連動結構</p>
        <p type="p">5114:頂板</p>
        <p type="p">5131:擋板本體</p>
        <p type="p">52:壓粉筒</p>
        <p type="p">53:整粉伸縮組件</p>
        <p type="p">531:第二伸縮桿</p>
        <p type="p">541:馬達架</p>
        <p type="p">542:馬達本體</p>
        <p type="p">5421:馬達輸出軸</p>
        <p type="p">551:針盤本體</p>
        <p type="p">552:整粉針</p>
        <p type="p">61:夾板</p>
        <p type="p">62:彈性元件</p>
        <p type="p">200:粉杯把手</p>
        <p type="p">300:粉杯</p>
        <p type="p">400:咖啡粉體</p>
        <p type="p">S3:筒體空間</p>
        <p type="p">D1:第一方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="55" publication-number="202624097">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624097</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146659</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>校正裝置、校正方法及其應用的作業機</chinese-title>
        <english-title>CALIBRATION DEVICE, CALIBRATION METHOD AND OPERATION MACHINE APPLIED WITH SAID DEVICE AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250317B">B65G47/24</main-classification>
        <further-classification edition="200601120250317B">G05B19/404</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻勁精密股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON. PRECISION, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡志欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHIH HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俐均</last-name>
                <first-name></first-name>
              </chinese-name>
              <address></address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種校正裝置，適於對一移載裝置進行校正，校正裝置包括：一校正單元、一影像擷取單元及一補償處理單元。校正單元具有一本體及至少一校正件，移載裝置上具有至少一取放部而可對應取放校正件，使得取放部可運載校正件在工作位置與儲料位置之間位移。影像擷取單元分別擷取工作位置上未運載校正件的取放部影像及被取放部運載的校正件影像，使得補償處理單元透過上述影像取得移載裝置的位置誤差，進而計算出補償值。故，本發明可確保移載裝置的位置誤差得到補償，以提升精確性與工作效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A calibration device, suitable for calibrating a transfer device, is provided. The calibration device includes: a calibration unit, an image capturing unit, and a compensation processing unit. The calibration unit has a body and at least one calibration component, and the transfer device has at least one pick-and-place portion capable of picking and placing the calibration component correspondingly, so that the pick-and-place portion can carry the calibration component to move between a working position and a storage position. The image capturing unit separately captures images of the pick-and-place portion not carrying the calibration component and images of the calibration component carried by the pick-and-place portion at the working position, so that the compensation processing unit obtains a position error of the transfer device through the above images, and then calculates a compensation value. Therefore, in the present invention, compensation of the position error of the transfer device is ensured, thus enhancing accuracy and work efficiency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:作業機</p>
        <p type="p">10:校正單元</p>
        <p type="p">11:本體</p>
        <p type="p">111:定位孔</p>
        <p type="p">12:校正件</p>
        <p type="p">20:影像擷取單元</p>
        <p type="p">70:電子元件</p>
        <p type="p">75B:第二料盤</p>
        <p type="p">81:機台</p>
        <p type="p">811:梭車</p>
        <p type="p">82:移載裝置</p>
        <p type="p">821:取放部</p>
        <p type="p">825A:第一搬運臂</p>
        <p type="p">825B:第二搬運臂</p>
        <p type="p">83:測試裝置</p>
        <p type="p">A1:第一方向</p>
        <p type="p">P0、P0’:初始位置</p>
        <p type="p">P1、P1’:工作位置</p>
        <p type="p">P2、P2’:儲料位置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="56" publication-number="202625301">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625301</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146669</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>植針式功率元件及其信號傳輸組件</chinese-title>
        <english-title>POWER COMPONENT HAVING PIN INSERTION CONFIGURATION AND SIGNAL TRANSMISSION ASSEMBLY THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250512B">H01R4/2406</main-classification>
        <further-classification edition="201101120250512B">H01R12/58</further-classification>
        <further-classification edition="200601120250512B">H01R13/415</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>同欣電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TONG HSING ELECTRONIC INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YAN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾志育</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, CHIH-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張錦文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIN-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝有德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, YU-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種植針式功率元件及其信號傳輸組件。所述信號傳輸組件包含有一端子座及插設於所述端子座的一導電端子。所述端子座為一體形成的單件式管狀構造，並且所述端子座具有一連接端部、一插接端部、及位於所述連接端部與所述插接端部之間的一定位段。所述插接端部具有一第一長度與一第一內徑，所述定位段具有大於所述第一長度的一第二長度、及小於所述第一內徑的一第二內徑。所述導電端子與所述插接端部之間形成有一第一干涉量，並且所述導電端子與所述定位段之間形成有大於所述第一干涉量的一第二干涉量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a power component having a pin insertion configuration and a signal transmission assembly thereof. The signal transmission assembly includes a pin holder and a conductive pin that is inserted into the pin holder. The pin holder is integrally formed as a single one-piece tube structure and has a connection end portion, an insertion end portion, and a positioning segment that is arranged between the connection end portion and the insertion end portion. The insertion end portion has a first length and a first inner diameter, and the positioning segment has a second length being greater than the first length and a second inner diameter that is less than the first inner diameter. The conductive pin and the insertion end portion have a first interference therebetween, and the conductive pin and the positioning segment have a second interference therebetween that is greater than the first interference.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:植針式功率元件</p>
        <p type="p">10:信號傳輸組件</p>
        <p type="p">1:線路板</p>
        <p type="p">11:板材</p>
        <p type="p">111:內板面</p>
        <p type="p">112:外板面</p>
        <p type="p">12:連接墊</p>
        <p type="p">2:電子元件</p>
        <p type="p">3:端子座</p>
        <p type="p">31:連接端部</p>
        <p type="p">32:插接端部</p>
        <p type="p">33:定位段</p>
        <p type="p">35:貫穿槽</p>
        <p type="p">4:導電端子</p>
        <p type="p">41:植針段</p>
        <p type="p">42:固定段</p>
        <p type="p">5:封裝體</p>
        <p type="p">L:長度方向</p>
        <p type="p">W:寬度方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="57" publication-number="202623900">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623900</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146670</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>粉碎機之自動拉引進料裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">B02C23/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普聯國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PULIAN INTERNATIONAL ENTERPRISE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾鉦隸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明有關一種粉碎機之自動拉引進料裝置，尤指可將寬面的板料、薄膜及熱成型塑膠或橡膠板體的裁切邊料予以回收粉碎再生之粉碎機之自動拉引進料裝置者，該自動拉引進料裝置於一下封板二側固設一左、右支撐座，該左、右支撐座間供一上、下滾輪套設，並藉由一上封板蓋合，於該上滾輪二側心軸上依序可套設一內封板、一墊片及一連座軸承，該內封板上設置一縱向長槽孔，該墊片上設有一軸孔，該長槽孔、軸孔、連座軸承可供上滾輪二側心軸上依序套設，該內封板鎖設固結於左、右支撐座內側壁上，且該內封板的長度大於左、右缺槽的高度，而該墊片的直徑大於或等於內封板的長槽孔的長度，藉由內封板及墊片的阻隔，可防止粉碎機內粉塵滲透沾黏於連座軸承與上滾輪的間隙間，防止異物不會掉落粉碎機內及達到簡易維修、適時保養、降噪等功效。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">3:自動拉引進料裝置</p>
        <p type="p">31:下封板</p>
        <p type="p">32:右支撐座</p>
        <p type="p">321:右缺槽</p>
        <p type="p">33:左支撐座</p>
        <p type="p">331:左缺槽</p>
        <p type="p">34:上滾輪</p>
        <p type="p">341:上從動輪</p>
        <p type="p">342:心軸</p>
        <p type="p">35:下滾輪</p>
        <p type="p">351:傳動輪</p>
        <p type="p">352:下從動輪</p>
        <p type="p">36:連座軸承</p>
        <p type="p">37:上封板</p>
        <p type="p">371:汽缸組</p>
        <p type="p">38:內封板</p>
        <p type="p">381:螺結元件</p>
        <p type="p">382:長槽孔</p>
        <p type="p">39:墊片</p>
        <p type="p">391:軸孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="58" publication-number="202624773">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624773</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146672</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>檢測導線的模組及方法</chinese-title>
        <english-title>MODULE AND METHOD FOR DETECTING WIRES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250512B">G01R31/302</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唯一高科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OUTSTANDING HIGH TECHNOLOGIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長井秀夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAI, HIDEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安田俊朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YASUDA, TOSHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪文隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, WEN LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種檢測導線的模組及方法。檢測導線的模組包括：至少一感測器，各設有一扇出供電電極，配置為在一扇出區操作期間定位在待測物件的扇出區且驅動該扇出供電電極；以及一獨立感測器，設有至少一扇出受電電極，配置為在該扇出區操作期間關聯該至少一感測器，以及在待測物件的主動區沿第二軸向移動且接收該至少一扇出受電電極的響應。在該扇出區操作期間，待測物件配置為主動區的導線平行第一軸向、該扇出供電電極配置為與主動區的導線正交，以及該至少一扇出受電電極配置為與主動區的導線平行。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A module and method for detecting wires are provided. The module for detecting wires includes: at least one sensor, each provided with a fan-out power-supplying electrode, configured to be positioned in a fan-out area of an object under test during fan-out area operation and to drive the fan-out power-supplying electrode; and an independent sensor, provided with at least one fan-out power-receiving electrode, configured to, during fan-out area operation, be associated with the at least one sensor, move along a second axis in an active area of the object under test and receive the response of the at least one fan-out power-receiving electrode. During fan-out area operation, the object under test is configured such that the wires of the active area are parallel to the first axis, the fan-out power-supplying electrode is configured to be orthogonal to the wires of the active area, and the at least one fan-out power-receiving electrode is configured to be parallel to the wires of the active area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:第一接點墊</p>
        <p type="p">12:第二接點墊</p>
        <p type="p">13:第三接點墊</p>
        <p type="p">14:第四接點墊</p>
        <p type="p">15:第五接點墊</p>
        <p type="p">16:第六接點墊</p>
        <p type="p">32、33、34:導線</p>
        <p type="p">100:獨立感測器</p>
        <p type="p">110:第一扇出受電電極</p>
        <p type="p">120:第二扇出受電電極</p>
        <p type="p">200:第一感測器</p>
        <p type="p">230:第一扇出供電電極</p>
        <p type="p">300:第二感測器</p>
        <p type="p">330:第二扇出供電電極</p>
        <p type="p">400:第三感測器</p>
        <p type="p">430:第三扇出供電電極</p>
        <p type="p">500:第四感測器</p>
        <p type="p">530:第四扇出供電電極</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="59" publication-number="202623970">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623970</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146677</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>機械手臂</chinese-title>
        <english-title>ROBOTIC ARM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">B25J9/04</main-classification>
        <further-classification edition="200601120260302B">B25J9/10</further-classification>
        <further-classification edition="202601120260302B">H10P72/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三和技研股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANWA ENGINEERING CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭擎宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, CHING-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種機械手臂，包括彼此連接的第一手臂、第二手臂、第一載板與第二載板。第一手臂包括依序連接的第一旋轉電機、第一皮帶齒輪組、第一變速模組與第一臂部。第二手臂包括依序連接的第二旋轉電機、第二皮帶齒輪組、第二變速模組與第二臂部。第一載板包括依序連接的第三旋轉電機、第三皮帶齒輪組、第三變速模組與第一板體。第二載板包括相互連接的第四旋轉電機、第四皮帶齒輪組、第四變速模組與第二板體。第二旋轉電機、第三旋轉電機與第四旋轉電機分別設置於第一臂部內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A robotic arm including a first arm, a second arm, a first holding plate, and a second holding plate connected with each other is provided. The first arm includes a first rotating motor, a first belt gear set, a first transmission module, and a first arm portion connected sequentially. The second arm includes a second rotating motor, a second belt gear set, a second transmission module, and a second arm portion connected sequentially. The first holding plate includes a third rotating motor, a third belt gear set, a third transmission module, and a first plate body. The second holding plate includes a fourth rotating motor, a fourth belt gear set, a fourth transmission module, and a second plate body. The second, the third, and the fourth rotating motors are disposed in the first arm portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:機械手臂</p>
        <p type="p">110:第一手臂</p>
        <p type="p">120:第二手臂</p>
        <p type="p">130:第一載板</p>
        <p type="p">140:第二載板</p>
        <p type="p">150:基座</p>
        <p type="p">200:晶圓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="60" publication-number="202625518">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625518</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146680</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路板結構的電鍍方法</chinese-title>
        <english-title>METHOD FOR PLATING A CIRCUIT BOARD STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250922B">H05K3/06</main-classification>
        <further-classification edition="200601120250922B">H05K3/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>健鼎科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRIPOD TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳永論</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YUNG-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>屈縣軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, HSIEN-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種電路板結構的電鍍方法。所述電路板結構的電鍍方法包含前置步驟，提供表面上形成有多個基座的基板，並且各個所述基座定義有線路區域及由所述線路區域的一側延伸的連接區域；化銅步驟，於所述基板形成化銅層；遮蔽膜覆蓋步驟，將遮蔽膜覆蓋於所述所述化銅層，並且位於多個所述線路區域的所述化銅層是暴露自所述遮蔽膜；第一微蝕步驟，對所述基板進行微蝕，以移除位於多個所述線路區域的所述化銅層；鍍金步驟，於多個所述線路區域鍍設多個鍍金層；以及第二微蝕步驟；對所述基板進行微蝕以移除所述化銅層，從而形成電路板結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for plating a circuit board structure is provided. The method for plating the circuit board structure includes a preparing process, a chemical plating copper process, a masking film covering process, a first etching process, a plating gold process, and a second etching process. The preparing process is implemented by providing a substrate having a plurality of base seats at a surface thereof, and each of the base seats define a circuit region and a connection region extending from one side of the circuit region. The chemical plating copper process is implemented by forming a chemical plating copper layer on the substrate. The masking film covering process is implemented by covering a masking film onto the chemical plating copper layer, and the chemical plating copper layer arranged at the circuit regions is exposed from the masking film. The first etching process is implemented by etching the substrate to remove the chemical plating copper layer arranged at the circuit regions. The plating gold process is implemented by plating a plurality of gold plating layers on the circuit regions. The second etching process is implemented by etching substrate to remove the chemical plating copper layer, so as to form a circuit board structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110:前置步驟</p>
        <p type="p">S120:化銅步驟</p>
        <p type="p">S130:遮蔽膜覆蓋步驟</p>
        <p type="p">S140:第一微蝕步驟</p>
        <p type="p">S150:鍍金步驟</p>
        <p type="p">S160:第二微蝕步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="61" publication-number="202625418">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625418</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146681</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>片上網路、資料規約方法和電子設備</chinese-title>
        <english-title>NETWORK-ON-CHIP, DATA REDUCTION METHOD AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250303B">H04L49/10</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英屬開曼群島商臉萌有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEMON INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KY</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭　軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種片上網路、資料規約方法和電子設備。該片上網路包括耦接的多個路由節點，多個路由節點中多個物件路由節點每個包括流式縮減引擎，並且每個物件路由節點與處理單元耦接，多個路由節點包括的多個流式縮減引擎級聯。所述流式縮減引擎配置為：對前一級提供的第一資料和物件處理單元提供的第二資料進行規約操作得到規約結果，物件處理單元為所述多個處理單元中與所述流式索引引擎所在的物件路由節點耦接的處理單元；以及向流式縮減引擎的下一級提供規約結果。該片上網路能夠使得資料以流的方式在路由節點中執行規約操作，提高頻寬利用率，節省執行規約操作的時間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A network-on-chip, a data reduction method, and an electronic device are provided. The network-on-chip includes a plurality of routing nodes that are coupled, where each of a plurality of object routing nodes among the plurality of routing nodes includes a streaming reduction engine, each object routing node is coupled with a processing unit, a plurality of streaming reduction engines included in the plurality of object routing nodes are cascaded. The streaming reduction engine is configured to perform a reduction operation to obtain a reduction result on first data provided by a previous stage with respect to the streaming reduction engine and second data provided by an object processing unit, where the object processing unit is a processing unit among the plurality of processing units that is coupled to an object routing node where the streaming reduction engine is located; and provide the reduction result to a next stage with respect to the streaming reduction engine. The network-on-chip enables the data to be subjected to the reduction operation in the routing nodes in a stream manner, thereby improving the bandwidth utilization, and saving the time to perform the reduction operation.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="62" publication-number="202624952">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624952</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146682</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>建立圖形化介面的方法、開發裝置及系統</chinese-title>
        <english-title>METHOD FOR ESTABLISHING GRAPHICAL INTERFACE, DEVELOPMENT APPARATUS AND DEVELOPMENT SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250319B">G06F8/38</main-classification>
        <further-classification edition="201301120250319B">G06F3/048</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大同大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TATUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭福烱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, FU-CHIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王岱鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, DAI-XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉威成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, WEI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種建立圖形化介面的方法、開發系統及裝置。開發裝置連線至雲端伺服器以使用提供編輯區域及預覽區域的開發介面，並透過開發介面以：匯入包括多個分頁的電子試算表文件，並基於所述分頁產生多個響應式變數；將至少一個響應式變數與多個使用者介面元件中的一或多個進行綁定；響應於其中一個響應式變數被拖曳至編輯區域，在編輯區域中顯示被拖曳的響應式變數的變數名稱，並且在預覽區域中顯示被拖曳的響應式變數的變數內容；應於開發介面的儲存功能被致能，基於編輯區域中的當前編輯結果產生對應至圖形化介面的視圖程式碼。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for establishing a graphical interface, a development system and a development apparatus are provided. The development apparatus is connected to the cloud server to use a development interface that provides an editing area and a preview area for: importing a spreadsheet file including multiple paginations, and generating multiple response variables based on the paginations; binding at least one response variable to one or more of a plurality of user interface elements; in response to one of the response variables being dragged to the editing area, displaying a variable name of the dragged response variable in the editing area, and displaying variable content of the dragged response variable in the preview area; in response to a saving function of the development interface being enabled, generating view program code corresponding to a graphical interface based on a current editing result in the editing area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S205~S225:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="63" publication-number="202625875">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625875</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146688</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體封裝結構</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W76/136</main-classification>
        <further-classification edition="202601120260302B">H10W74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南茂科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIPMOS TECHNOLOGIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉盈志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YE, YING-ZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體封裝結構，包括導線架、第一晶片以及封裝膠體。導線架的晶片承載座具有彼此相對的兩第一側與彼此相對的兩第二側。導線架的多個引腳鄰近於兩第二側間隔排列。導線架的至少一延伸部連接兩第一側的至少其中一者。第一晶片配置於晶片承載座上，並電性連接引腳，第一晶片具有遠離晶片承載座的第一頂面以及對應於兩第一側的兩第一側表面。至少一延伸部包括連接晶片承載座的至少其中一第一側且平行第一晶片的第一側表面的第一區段以及連接第一區段且延伸至並配置於第一頂面上的第二區段。封裝膠體覆蓋第一晶片與導線架且暴露出至少一延伸部的第二區段的上表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor package structure includes a lead frame, a first chip and an encapsulant. A die pad of the lead frame has two first sides opposite to each other and two second sides opposite to each other. A plurality of leads of the lead frame are arranged at intervals adjacent to the two second sides. At least one extension part of the lead frame is connected to at least one of the two first sides. The first chip is disposed on the die pad and is electrically connected to the leads. The first chip has a first top surface away from the die pad and two first side surfaces corresponding to the two first sides. The at least one extension part includes a first section connecting at least one of the first side of the die pad and parallel to the first side surface of the first chip and a second section connected to the first section and extending to and disposed on the first top surface. The encapsulant covers the first chip and the lead frame and exposes an upper surface of the second section of the at least one extension part.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體封裝結構</p>
        <p type="p">110:導線架</p>
        <p type="p">111:晶片承載座</p>
        <p type="p">112:引腳</p>
        <p type="p">113:延伸部</p>
        <p type="p">120:第一晶片</p>
        <p type="p">121:第一頂面</p>
        <p type="p">122:第一側表面</p>
        <p type="p">130:封裝膠體</p>
        <p type="p">140:導線</p>
        <p type="p">150:黏著層</p>
        <p type="p">180:導電材料層</p>
        <p type="p">L1:第一區段</p>
        <p type="p">L2:第二區段</p>
        <p type="p">L21:上表面</p>
        <p type="p">L22:下表面</p>
        <p type="p">P1:接墊</p>
        <p type="p">S1:第一側</p>
        <p type="p">S2:第二側</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="64" publication-number="202624611">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624611</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146689</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>潛式無人海洋溫差發電載體</chinese-title>
        <english-title>SUBMERSIBLE UNMANNED OTEC CARRIER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250321B">F03G7/05</main-classification>
        <further-classification edition="200601120250321B">B63B3/13</further-classification>
        <further-classification edition="200601120250321B">B63B22/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尚瑞文創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁乃匡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, NAI-KUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種潛式無人海洋溫差發電載體，取代發電船廠接於錨碇後的浮式海洋深水井(中華民國專利號碼I589775)，颱風來臨時不須解開連接返回港灣，而下沉迴避巨浪；錨碇塊採用可回收重力式錨塊裝置(中華民國專利號碼I648200)，可安裝預定海床點並回收；電纜繫於系列圓柱型浮體纜索(該纜索須拉緊)，在海面下適當深度通往岸上。潛式無人海洋溫差發電載體包含一潛體單元及一浮標單元。潛體單元包括一可引入或排出海水以改變沉浮狀態的調節艙，一或數個入水口及出水口，及一當潛體單元浮出海面時可讓人員物資進出的人孔。浮標單元設置於海面，並包括一與潛體單元連接的纜索以控制潛體單元下潛深度，一通往調節艙的氣管，以及一氣閥裝置以便和工作船上的空氣壓縮機連接進行充氣或直接洩氣。初時潛體單元浮在海面，當潛體單元和浮式海洋深水井完成連接通水通電並開始發電，如颱風將來襲，派工作船把氣閥裝置打開，讓潛體單元連同浮式海洋深水井下沉到預定深度，可避開颱風巨浪；如有需要，派工作船把空氣壓縮機連接氣閥裝置進行充氣，該潛體單元重新浮出海面。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:潛式無人海洋溫差發電載體</p>
        <p type="p">70:浮式海洋深水井</p>
        <p type="p">1:潛體單元</p>
        <p type="p">2:浮標單元</p>
        <p type="p">3:工作船</p>
        <p type="p">4:可回收重力式錨塊裝置</p>
        <p type="p">5:圓柱型浮體</p>
        <p type="p">51:圓柱型浮體纜索</p>
        <p type="p">11:連接件</p>
        <p type="p">12:可伸縮水管</p>
        <p type="p">13:電纜</p>
        <p type="p">14:入水口</p>
        <p type="p">15:出水口</p>
        <p type="p">16:人孔</p>
        <p type="p">17:調節艙</p>
        <p type="p">21:浮台</p>
        <p type="p">22:纜索</p>
        <p type="p">23:氣閥裝置</p>
        <p type="p">24:氣管</p>
        <p type="p">80:海面</p>
        <p type="p">90:海底</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="65" publication-number="202625287">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625287</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146698</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>通訊裝置和通訊方法</chinese-title>
        <english-title>COMMUNICATION DEVICE AND COMMUNICATION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">H01Q1/12</main-classification>
        <further-classification edition="200601120250303B">H01Q1/22</further-classification>
        <further-classification edition="200601120250303B">H01Q15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏達國際電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HTC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊熠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHUN-YIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浦大鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PU, TA-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭彥良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, YEN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種通訊裝置，包括：一第一頻率選擇面元件、一第二頻率選擇面元件、一饋入輻射部，以及至少一介電雷射加速器。第二頻率選擇面元件係鄰近於第一頻率選擇面元件。饋入輻射部可產生一電磁信號，其中電磁信號可藉由使用第一頻率選擇面元件和第二頻率選擇面元件來進行傳播。介電雷射加速器可發射至少一電子束。第一頻率選擇面元件、第二頻率選擇面元件，以及饋入輻射部可共同形成一天線結構。電子束可與電磁信號之間發生一耦合效應，使得電磁信號之輻射能量將會被增強。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A communication device includes a first FSS (Frequency Selective Surface) element, a second FSS element, a feeding radiation element, and at least one DLA (Dielectric Laser Accelerator). The second FFS element is adjacent to the first FSS element. The feeding radiation element generates an electromagnetic signal. The electromagnetic signal is propagated by using the first FSS element and the second FSS element. The DLA transmits at least one electron beam. An antenna structure is formed by the first FSS element, the second FSS element, and the feeding radiation element. A coupling effect is induced between the electron beam and the electromagnetic signal, such that the radiation energy of the electromagnetic signal is enhanced.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:通訊裝置</p>
        <p type="p">110:第一頻率選擇面元件</p>
        <p type="p">120:第二頻率選擇面元件</p>
        <p type="p">130:饋入輻射部</p>
        <p type="p">150:介電雷射加速器</p>
        <p type="p">160:電子束</p>
        <p type="p">DS:特定距離</p>
        <p type="p">SE:電磁信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="66" publication-number="202625586">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625586</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146700</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>薄膜電晶體</chinese-title>
        <english-title>THIN FILM TRANSISTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250922B">H10D30/67</main-classification>
        <further-classification edition="202501120250922B">H10D86/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江家維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHIA-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡明侑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MING-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李國銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, KUO-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃震鑠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHEN-SHUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖柏詠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, PO-YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范揚順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, YANG-SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種薄膜電晶體包括基板、半導體圖案、源極、汲極、閘極與電極圖案。半導體圖案設置在基板上，且具有源極區、汲極區與通道區。通道區連接在源極區與汲極區之間。源極與汲極設置在半導體圖案上，且分別電性連接半導體圖案的源極區與汲極區。閘極設置在半導體圖案上，且位在源極與汲極之間。閘極完全重疊於半導體圖案的通道區。電極圖案設置在基板與半導體圖案之間，且重疊於半導體圖案。電極圖案電性連接閘極或源極，且不重疊於源極區與汲極區的至少一者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A thin film transistor including a substrate, a semiconductor pattern, a source electrode, a drain electrode, a gate electrode and a electrode pattern is provided. the semiconductor pattern is disposed on the substrate, and has a source region, a drain region and a channel region. The channel region is connected between the source region and the drain region. The source electrode and the drain electrode are disposed on the semiconductor pattern, and are electrically connected to the source region and the drain region of the semiconductor pattern, respectively. The gate electrode is disposed on the semiconductor pattern, and located between the source electrode and the drain electrode. The gate electrode completely overlaps the channel region of the semiconductor pattern. The electrode pattern is disposed between the substrate and the semiconductor pattern, and overlaps the semiconductor pattern. The electrode pattern is electrically connected to the gate electrode or the source electrode, and does not overlap at least one of the source region and the drain region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:薄膜電晶體</p>
        <p type="p">101:基板</p>
        <p type="p">101s:基板表面</p>
        <p type="p">110、120、130:絕緣層</p>
        <p type="p">CR:通道區</p>
        <p type="p">DE:汲極</p>
        <p type="p">DR:汲極區</p>
        <p type="p">EP:電極圖案</p>
        <p type="p">GE:閘極</p>
        <p type="p">S:間距</p>
        <p type="p">SC:半導體圖案</p>
        <p type="p">SE:源極</p>
        <p type="p">SF1、SF2:表面</p>
        <p type="p">SR:源極區</p>
        <p type="p">TH1、TH2:通孔</p>
        <p type="p">Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="67" publication-number="202625133">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625133</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146701</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感測放大器電路</chinese-title>
        <english-title>SENSE AMPLIFIER CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120250212B">G09G3/32</main-classification>
        <further-classification edition="200601120250212B">G11C7/06</further-classification>
        <further-classification edition="200601120250212B">G11C11/4193</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯詠科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳翊佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種感測放大器電路，包括感測放大器及控制電路。感測放大器用以偵測輸入資料。控制電路耦接到感測放大器。控制電路用以輸出控制信號以控制感測放大器偵測輸入資料。控制電路根據前次週期及當次週期的輸入資料來控制感測放大器是否進行預充電操作或預放電操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A sense amplifier circuit including a sense amplifier and a control circuit is provided. The sense amplifier is configured to detect an input data. The control circuit is coupled to the sense amplifier. The control circuit outputs a control signal to control the sense amplifier to detect the input data. The control circuit controls whether the sense amplifier performs a pre-charge operation or a pre-discharge operation based on the input data of the previous cycle and the current cycle.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:感測放大器電路</p>
        <p type="p">110:感測放大器</p>
        <p type="p">120:控制電路</p>
        <p type="p">VI1、VI2:輸入資料</p>
        <p type="p">VO1、VO2:輸出資料</p>
        <p type="p">EN1、EN2、EN3:控制信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="68" publication-number="202624847">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624847</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146702</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250123B">G02F1/133</main-classification>
        <further-classification edition="200601120250123B">G02F1/137</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>俞方正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, FANG-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置，包括畫素單元，畫素單元包括第一區和第二區，第一區包括第一子畫素和阻擋層，第一子畫素包括第一發光元件、第一色轉換結構，第一發光元件發出第一顏色光，第一色轉換結構於第一發光元件上覆蓋第一發光元件且將第一顏色轉換成第二顏色，阻擋層環繞第一發光元件，第二區包括第二子畫素、第三子畫素和散射粒子層，第二子畫素包括第二發光元件，第二發光元件發出第三顏色光，第三子畫素包括第三發光元件，第三發光元件發出第一顏色光，散射粒子層位於第二發光元件與第三發光元件之間、第二發光元件至少一側以及與第三發光元件至少一側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device includes a pixel unit, the pixel unit includes a first area and a second area, the first area includes a first sub-pixel and a blocking layer, the first sub-pixel includes a first light-emitting element, and a first color conversion structure, the first light-emitting element emits light of a first color, the first color conversion structure located on the first light-emitting element covers the first light-emitting element and converts the light of the first color into light of a second color, the blocking layer surrounds the first light-emitting element, the second area includes a second sub-pixel, a third sub-pixel and a particle scattering layer. The second sub-pixel includes a second light-emitting element, and the second light-emitting element emits light of a third color. The third sub-pixel includes a third light-emitting element, and the third light-emitting element emits light of a first color. The scattering particle layer is located between the second light-emitting element and the third light-emitting element, at least one side of the second light-emitting element, and at least one side of the third light-emitting element.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100A:畫素單元</p>
        <p type="p">110:第一基板</p>
        <p type="p">120:第二基板</p>
        <p type="p">121:第一子畫素</p>
        <p type="p">121A:第一發光元件</p>
        <p type="p">121B、123B、125B:電極</p>
        <p type="p">121C:第一色轉換結構</p>
        <p type="p">121S1、123S1、125S1:第一側</p>
        <p type="p">121S2、123S2、125S2:第二側</p>
        <p type="p">123:第二子畫素</p>
        <p type="p">123A:第二發光元件</p>
        <p type="p">125:第三子畫素</p>
        <p type="p">125A:第三發光元件</p>
        <p type="p">BM:遮光元件</p>
        <p type="p">CF1、CF2:濾光層</p>
        <p type="p">C1:第一顏色</p>
        <p type="p">C2:第二顏色</p>
        <p type="p">C3:第三顏色</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">OC:光學透明膠層</p>
        <p type="p">R1:第一區</p>
        <p type="p">R2:第二區</p>
        <p type="p">SOC:散射粒子層</p>
        <p type="p">SP:散射粒子</p>
        <p type="p">WB:擋牆</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="69" publication-number="202624149">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624149</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146703</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微壓循環控制系統及其用於厭氧甲烷發酵之方法</chinese-title>
        <english-title>CIRCULATION CONTROL SYSTEM UNDER MICRO-PRESSURE AND METHOD OF ANAEROBIC METHANE FERMENTATION USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">C02F11/04</main-classification>
        <further-classification edition="202301120250102B">C02F3/30</further-classification>
        <further-classification edition="200601120250102B">C12M1/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TSUNG-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉軒誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HSUAN CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪政源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, CHENG-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張益三</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YI-SAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃彥傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YEN-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明有關於一種微壓循環控制系統及其用於厭氧甲烷發酵之方法。此系統包含彼此連通的厭氧發酵槽、微氣泡產生裝置及氣體控制模組。氣體控制模組藉由微氣泡產生裝置可調控輸入厭氧發酵槽的氣體，使厭氧發酵槽的微生物在室溫及微加壓狀態進行厭氧甲烷發酵製程，以產生含甲烷氣體，不僅有效提升製程的碳轉化效率，又具有顯著的減碳效益。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a circulation control system under micro-pressure and a method of anaerobic methane fermentation using the same. The system includes an anaerobic fermentation tank, a micro-bubble generation device and a gas control module, all of which are connected to each other. The gas control module can modulate the gases flowing into the anaerobic fermentation tank, allowing microbes in the anaerobic fermentation tank to perform the anaerobic methane fermentation process under room temperature and micro-pressure state for producing a methane-containing gas. Therefore, the process can have substantially increased carbon conversion efficiency, and notable carbon reduction benefits.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:微壓循環控制系統</p>
        <p type="p">101:厭氧發酵槽</p>
        <p type="p">103:封閉槽體</p>
        <p type="p">105:槽底</p>
        <p type="p">105A:第一通孔</p>
        <p type="p">107:下側壁</p>
        <p type="p">107A:第二通孔</p>
        <p type="p">109:上側壁</p>
        <p type="p">109A:第三通孔</p>
        <p type="p">111:第一容置空間</p>
        <p type="p">113:第一液體</p>
        <p type="p">115:第一壓力感測器</p>
        <p type="p">117:第四氣動閥</p>
        <p type="p">121:微氣泡產生裝置</p>
        <p type="p">121A:頂部</p>
        <p type="p">123:第二容置空間</p>
        <p type="p">125:第二液體</p>
        <p type="p">127:微氣泡產生器</p>
        <p type="p">128:內底面</p>
        <p type="p">129:底部</p>
        <p type="p">129A:第四通孔</p>
        <p type="p">130:微氣泡</p>
        <p type="p">131:第一管路</p>
        <p type="p">133:第二管路</p>
        <p type="p">141:氣體控制模組</p>
        <p type="p">143:第三管路</p>
        <p type="p">145:第四管路</p>
        <p type="p">147:氣體偵測器</p>
        <p type="p">149:第二壓力感測器</p>
        <p type="p">150:氣體源</p>
        <p type="p">151:氫氣源</p>
        <p type="p">151A:氣動閥</p>
        <p type="p">153:二氧化碳氣體源</p>
        <p type="p">153A:氣動閥</p>
        <p type="p">155:氣體加壓泵</p>
        <p type="p">157:控制元件</p>
        <p type="p">159:第五管路</p>
        <p type="p">161:混合氣體收集裝置</p>
        <p type="p">163:第三壓力感測器</p>
        <p type="p">165:第一泵浦</p>
        <p type="p">167:第二泵浦</p>
        <p type="p">169:第五氣動閥</p>
        <p type="p">171:第一氣動閥</p>
        <p type="p">173:第三氣動閥</p>
        <p type="p">175:第六氣動閥</p>
        <p type="p">177:第二氣動閥</p>
        <p type="p">181,183,185,187,189:箭頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="70" publication-number="202625817">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625817</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146711</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W40/22</main-classification>
        <further-classification edition="202601120260302B">H10W72/20</further-classification>
        <further-classification edition="202601120260302B">H10W72/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾耀賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, YAO-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馥郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, FU-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡濱祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, BIN-SIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體裝置及其形成方法，包括基底、第一介電層和第二介電層、接合界面層、以及複數個虛設插塞。第一介電層和第二介電層堆疊地設置在基底上。接合界面層設置在第一介電層和第二介電層之間，其中，接合界面層包括依序堆疊的第一界面層和第二界面層。虛設插塞設置在第一介電層和第二介電層中的一個內，並在垂直方向上僅位在接合界面層的一側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Semiconductor device and method of fabricating the same, includes a substrate, a first dielectric layer and a second dielectric layer, a bonding interface layer, and a plurality of dummy vias. The first dielectric layer and the second dielectric layer are stacked in sequence on the substrate. The bonding interface layer is disposed between the first dielectric layer and the second dielectric layer, wherein the bonding interface layer includes a first interface layer and a second interface layer stacked in sequence. The plurality of dummy vias is disposed within one of the first dielectric layer and the second dielectric layer, being located at only one side of the bonding interface layer in a vertical direction of the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體裝置</p>
        <p type="p">100:基底</p>
        <p type="p">104:絕緣層</p>
        <p type="p">106:第一介電層</p>
        <p type="p">108:阻擋層</p>
        <p type="p">110:絕緣層</p>
        <p type="p">112:第二介電層</p>
        <p type="p">114:阻擋層</p>
        <p type="p">116:介電層</p>
        <p type="p">118:阻擋層</p>
        <p type="p">130:接合界面層</p>
        <p type="p">132:第一界面層</p>
        <p type="p">134:第二界面層</p>
        <p type="p">140:虛設插塞</p>
        <p type="p">150:導電結構</p>
        <p type="p">152:第一部分</p>
        <p type="p">154:第二部分</p>
        <p type="p">160、162、164:穿矽通孔</p>
        <p type="p">D1:垂直方向</p>
        <p type="p">D2:水平方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="71" publication-number="202623760">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623760</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146723</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>穿戴式眼底檢查裝置</chinese-title>
        <english-title>WEARABLE FUNDUS EXAMINATION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241219B">A61B3/12</main-classification>
        <further-classification edition="200601120241219B">A61B3/14</further-classification>
        <further-classification edition="200601120241219B">G02B5/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中央大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CENTRAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫慶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, CHING-CHERNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊益松</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種穿戴式眼底檢查裝置，包括：一本體，設置於一受測者之耳部；一成像模組，設置於本體並具有相互電性連接之一照明單元、一光學單元、一影像攝取單元及一外部光阻擋單元；其中，照明單元用以投射出一第一光束及一第二光束；光學單元用以將第一光束及第二光束導引至受測者之眼球底部並產生一反射光束；影像攝取單元用以擷取光學單元匯聚來自受測者之眼球底部的反射光束並形成一眼底影像；外部光阻擋單元配置於本體上並與本體之間建構出一黑暗空間，黑暗空間係覆蓋受測者的眼球並隔絕所有可見光，避免受測者之瞳孔因接收到可見光而縮小。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wearable fundus examination device, including: a body, which is arranged on the ear of a subject; an imaging module, which is arranged on the body and has a lighting unit, an optical unit, and an image capture unit that are electrically connected to each other. and an external light blocking unit; wherein, the lighting unit is used to project a first light beam and a second light beam; the optical unit is used to guide the first light beam and the second light beam to the bottom of the subject's eyeball and generate a reflection Light beam; the image capture unit is used to capture the optical unit to collect the reflected light beam from the bottom of the subject's eyeball and form a fundus image; the external light blocking unit is arranged on the body and constructs a dark space between the body and the body, and the dark space system Cover the subject's eyeballs and block out all visible light to prevent the subject's pupils from shrinking due to receiving visible light.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:照明單元</p>
        <p type="p">21:光學單元</p>
        <p type="p">22:影像攝取單元</p>
        <p type="p">3:眼球底部</p>
        <p type="p">4:光軸線</p>
        <p type="p">5:外部光阻擋單元</p>
        <p type="p">50:黑暗空間</p>
        <p type="p">6:傳輸單元</p>
        <p type="p">7:多媒體單元</p>
        <p type="p">L1:第一光束</p>
        <p type="p">L2:第二光束</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="72" publication-number="202624420">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624420</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146727</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>塗料與防油紙</chinese-title>
        <english-title>COATING MATERIAL AND OIL-PROOF PAPER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241220B">C09D101/02</main-classification>
        <further-classification edition="200601120241220B">C09D103/04</further-classification>
        <further-classification edition="200601120241220B">C09K3/18</further-classification>
        <further-classification edition="200601120241220B">D21H19/12</further-classification>
        <further-classification edition="200601120241220B">D21H21/14</further-classification>
        <further-classification edition="200601120241220B">D21H21/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新川創新股份有限公司 臺北市中正區思源街18號 台大育成中心B棟504室</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUSTAINABLE CARBOHYDRATE INNOVATION CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃雅惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YA-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高毓謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, YU-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">塗料包括矽烷鹽改質的多醣鹽；陽離子澱粉；以及水。矽烷鹽可為Si(OH)        &lt;sub&gt;x&lt;/sub&gt;(OK)        &lt;sub&gt;y&lt;/sub&gt;(R)        &lt;sub&gt;4-x-y&lt;/sub&gt;；R為C        &lt;sub&gt;1-10&lt;/sub&gt;的烷基；x=1至2，y=1至2，且x+y=2至3。多醣鹽為纖維素衍生物、天然樹膠、海藻酸、澱粉、殼聚醣、或上述之組合的鹽類。上述塗料可用於形成防油紙。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A coating material includes silane salt-modified polysaccharide salt, cationic starch, and water. The silane salt can be Si(OH)        &lt;sub&gt;x&lt;/sub&gt;(OK)        &lt;sub&gt;y&lt;/sub&gt;(R)        &lt;sub&gt;4-x-y&lt;/sub&gt;; R is a C        &lt;sub&gt;1-10&lt;/sub&gt;alkyl group; x=1 to 2, y=1 to 2, and x+y=2 to 3. The polysaccharide salt is a salt of cellulose derivative, natural gum, alginic acid, starch, chitosan, or a combination thereof. The coating material can be used to manufacture an oil-proof paper.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="73" publication-number="202624125">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624125</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146733</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>超疏水性複合塗料之製備方法</chinese-title>
        <english-title>METHOD FOR MANUFACTURING A SUPERHYDROPHOBIC COMPOSITE COATING MATERIAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241220B">C01G9/02</main-classification>
        <further-classification edition="200601120241220B">C09C1/04</further-classification>
        <further-classification edition="200601120241220B">C09C3/00</further-classification>
        <further-classification edition="200601120241220B">C09D167/00</further-classification>
        <further-classification edition="201801120241220B">C09D7/62</further-classification>
        <further-classification edition="200601120241220B">C09D5/08</further-classification>
        <further-classification edition="200601120241220B">C09D5/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立高雄科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL KAOHSIUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高立衡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, LI-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳芊惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉冠廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <address></address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明超疏水性複合塗料之製備方法，其包含有備料、基材準備、合成、改質及拌合等步驟，首先將鋅粉與聚乙烯醇縮丁醛混合後燃燒，以生成四針狀氧化鋅，接著將其浸泡於過氧化氫溶液中，並經抽氣過濾，以形成奈米級的二氧化矽顆粒外層，再與無水酒精、氨水混合，並另以無水酒精與四乙氧基矽烷混合之溶液逐步滴入，而後加入矽烷偶合劑進行攪拌、抽氣過濾及烘乾，最後再與矽聚酯樹脂混合，從而形成超疏水性複合塗料，不僅有效簡化整體製程，以及降低所需費用成本外，同時改善該超疏水性複合塗料之表面粗糙度，並有效提升耐腐蝕性、耐化學性、機械性能及疏水性等性能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for manufacturing a superhydrophobic composite coating material includes a preparation step, a base material preparing step, a synthesizing step, a modification step, and a mixing step. First, zinc powder and polyvinyl butyral (PVB) are mixed and burned to form tetrapod zinc oxide. The tetrapod zinc oxide is then soaked in a hydrogen peroxide solution and subjected to a suction filtration operation to form a nano-sized silica layer. After the tetrapod zinc oxide with the nano-sized silica layer is mixed with anhydrous alcohol and an ammonia solution, another solution which includes the anhydrous alcohol and tetraethoxysilane (TEOS) is gradually added. A silane coupling agent is added and mixed thereafter. After a suction filtration operation and a drying operation are executed, silicone polysiloxane (SP) is added and mixed to obtain the superhydrophobic composite coating material, thereby facilitating in a reduction of the manufacturing process effectively, reducing manufacturing costs, improving the surface roughness of the superhydrophobic composite coating material, increasing the capabilities of corrosion resistance, chemical resistance, and hydrophobicity, and improving the mechanical property.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="74" publication-number="202625510">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625510</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146735</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路載板及其製造方法</chinese-title>
        <english-title>CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">H05K1/02</main-classification>
        <further-classification edition="200601120241231B">H05K3/18</further-classification>
        <further-classification edition="200601120241231B">H05K3/40</further-classification>
        <further-classification edition="200601120241231B">H05K3/06</further-classification>
        <further-classification edition="200601120241231B">H05K3/46</further-classification>
        <further-classification edition="200601120241231B">H05K1/05</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪維鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, WEI-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃昱瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林坤成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電路載板，其包括介電層、第一導體層、第一接地件及複數個訊號線。第一導體層設置於介電層的一側。第一接地件由第一導體層突出並設置於介電層內。該些訊號線設置於介電層內並位於第一接地件的一側。其中各個訊號線在第一導體層的投影鄰近於第一接地件在第一導體層的投影，但各個訊號線在第一導體層的投影沒有與第一接地件在第一導體層的投影接觸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit substrate includes a dielectric layer, a first conductor layer, a first ground element and a plurality of signal traces. The first conductor layer is disposed on one side of the dielectric layer. The first ground element protrudes from the first conductor layer and disposed inside the dielectric layer. The signal traces are disposed inside the dielectric layer and located on one side of the first ground element. The projection of each signal trace on the first conductor layer is close to the projection of the first ground element on the first conductor layer, but the projection of each signal trace on the first conductor layer does not contact the projection of the first ground element on the first conductor layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電路載板</p>
        <p type="p">10:絕緣基板</p>
        <p type="p">11:介電層</p>
        <p type="p">12:第一導體層</p>
        <p type="p">G1:第一接地件</p>
        <p type="p">St:個訊號線</p>
        <p type="p">t1:第一接地件的頂面的左端角</p>
        <p type="p">t2:第一接地件的頂面的右端角</p>
        <p type="p">t3:訊號線的底面的內端角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="75" publication-number="202623991">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623991</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146743</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有加壓結構之超聲波點焊機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250214B">B29C65/08</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐利速精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORISOL TAIWAN LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, WEN-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃一凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YI-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳秋萌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIU-MENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有加壓結構之超聲波點焊機，包括固定板、移動模組、點焊槍，及加壓模組。該移動模組具有滑軌、滑塊，及設置於該滑塊的上夾板。該點焊槍安裝於該上夾板，透過自身重量或受推抵而沿該滑軌上下移動。該加壓模組具有上支架，及位於該上支架與該上夾板之間的加壓彈性件。當該點焊槍向上移動並由該上夾板壓縮該加壓彈性件時，該加壓彈性件產生彈性下推力，以加強對鞋材的下壓力。為了因應數個鞋材堆疊時的厚度變化，透過該點焊槍的重量及該加壓彈性件產生的彈性下推力，確保該等鞋材緊密地貼合，有助於提升焊接品質，且整體製造成本較低。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">4:點焊單元</p>
        <p type="p">41:固定板</p>
        <p type="p">42:移動模組</p>
        <p type="p">420:下夾設空間</p>
        <p type="p">421:滑軌</p>
        <p type="p">422:滑塊</p>
        <p type="p">423:上夾板</p>
        <p type="p">424:下夾板</p>
        <p type="p">425:上定位板部</p>
        <p type="p">426:上扣合板部</p>
        <p type="p">427:上夾設空間</p>
        <p type="p">428:下定位板部</p>
        <p type="p">429:下扣合板部</p>
        <p type="p">43:點焊槍</p>
        <p type="p">44:加壓模組</p>
        <p type="p">441:上支架</p>
        <p type="p">442:加壓彈性件</p>
        <p type="p">45:緩衝模組</p>
        <p type="p">451:下支架</p>
        <p type="p">452:緩衝彈性件</p>
        <p type="p">X:前後方向</p>
        <p type="p">Y:左右方向</p>
        <p type="p">Z:上下方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="76" publication-number="202623778">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623778</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146745</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>呼吸式按摩系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">A61H23/00</main-classification>
        <further-classification edition="200601120250501B">A61H39/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鑫視科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寶全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PAOCH-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪惠泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, HUI-TAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種呼吸式按摩系統，至少包含有：一接收呼吸單元、一同步控制、一下肢按摩系統，主要在以配合呼吸頻率，進行間歇性的擠壓小腿按摩，令小腿上的靜脈血更容易回流心臟，達到不增高舒張壓或心律而促進循環的功效；此即小腿肌肉中的靜脈血量平時受重力影響，堆積了一定量的血量，故依呼吸節拍同步推擠兩小腿，達到增加血回流心臟及改善下肢循環為目的。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:接收呼吸單元</p>
        <p type="p">11:第一接收訊號單元</p>
        <p type="p">20:同步控制器</p>
        <p type="p">23:調控及保護單元</p>
        <p type="p">30:下肢按摩系統</p>
        <p type="p">40:人體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="77" publication-number="202625466">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625466</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146751</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池通訊系統及其運作方法</chinese-title>
        <english-title>BATTERY COMMUNICATION SYSTEM AND OPERATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120241231B">H04W4/38</main-classification>
        <further-classification edition="200601120241231B">H04B7/08</further-classification>
        <further-classification edition="200601120241231B">H01M10/48</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連恩微電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRACE CONNECTION MICROELECTRONICS CO. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳培煒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PEI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳憲穀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIEN-KU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電池通訊系統及其運作方法。電池通訊系統用以進行數個電池單元之溝通。電池通訊系統之運作方法包括以下步驟。於電池通訊系統之一無線菊鏈通訊路徑（Wireless Daisy Chain communication path）中，第一無線通訊單元透過一一電/磁耦合波（Electronic/ Magnetic Coupling Wave）或一無線傳輸方式向相鄰之一第二無線通訊單元發出一傳輸訊號。於電池通訊系統之無線菊鏈通訊路徑中，第一無線通訊單元與第二無線通訊單元執行一自動增益控制程序（Auto-Gain Control, AGC），以自動調整第二無線通訊單元之一接收增益。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A battery communication system and an operation method thereof are provided. The battery communication system is used to communicate between a plurality of battery units. The operation method of the battery communication system includes the following steps. In a wireless daisy chain communication path of the battery communication system, a first wireless communication unit sends a transmission signal to a second wireless communication unit adjacent thereto through an electrical/ magnetic coupling wave or a wireless communication. In the wireless daisy chain communication path of the battery communication system, the first wireless communication unit and the second wireless communication unit execute an Auto-Gain Control (AGC) to automatically adjust a receiving gain of the second wireless communication unit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100,S200:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="78" publication-number="202625522">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625522</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146754</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路板結構及其製造方法</chinese-title>
        <english-title>CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">H05K3/46</main-classification>
        <further-classification edition="200601120250102B">H05K3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞電路板股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAN YA PRINTED CIRCUIT BOARD CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅維達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, WEI-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林亞萱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YA-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電路板結構及其製造方法。電路板結構包括基板、磁性感應件、耐蝕層及通孔金屬層。基板包括通孔，自基板的正面穿設至背面。磁性感應件設置於基板中通孔的側壁。耐蝕層設置於該磁性感應件上。通孔金屬層設置於耐蝕層上。耐蝕層隔離磁性感應件與通孔金屬層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit board structure and a manufacturing method thereof are provided. The circuit board structure includes a substrate, a magnetic induction component, a protection layer, and a through-hole electrode layer. The substrate includes a through hole penetrating through the front side to the back side of the substrate. The magnetic induction component is disposed on the sidewall of the through hole in the substrate. The protection layer is disposed on the magnetic induction component. The through-hole electrode layer is disposed on the protection layer. The protective layer isolates the magnetic induction component from the through-hole electrode layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電路板結構</p>
        <p type="p">10:基板</p>
        <p type="p">101:基板正面</p>
        <p type="p">102:基板背面</p>
        <p type="p">104:電連接墊</p>
        <p type="p">106:磁性感應件/磁性感應材料</p>
        <p type="p">106P:突出部分</p>
        <p type="p">108:耐蝕層/耐蝕材料</p>
        <p type="p">110:晶種層</p>
        <p type="p">112:通孔金屬層</p>
        <p type="p">114:填充層</p>
        <p type="p">116:通孔</p>
        <p type="p">C:通孔中心</p>
        <p type="p">B-B:剖線</p>
        <p type="p">X:X方向</p>
        <p type="p">Y:Y方向</p>
        <p type="p">Z:Z方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="79" publication-number="202624776">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624776</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146755</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池系統之製造方法</chinese-title>
        <english-title>MANUFACTURING METHOD FOR BATTERY SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250402B">G01R31/36</main-classification>
        <further-classification edition="201901120250402B">G01R31/385</further-classification>
        <further-classification edition="201901120250402B">G01R31/396</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連恩微電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRACE CONNECTION MICROELECTRONICS CO. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳培煒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PEI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳憲穀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIEN-KU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電池通訊系統之量測校正方法與電池系統之製造方法。電池通訊系統用以進行數個電池單元之溝通。電池通訊系統之量測校正方法包括以下步驟。於電池通訊系統之一無線菊鏈通訊路徑（Wireless Daisy Chain communication path）中，以一類比轉數位電路，對一電源進行電位量測，以獲得一第一量測資訊。類比轉數位電路已設置於一電路板上。以一電錶對電源進行電位量測，以獲得一第二量測資訊。依據第一量測資訊與第二量測資訊，獲得類比轉數位電路之一增益誤差（gain error）與一偏移誤差（offset error）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A measurement calibration method for a battery communication system and a manufacturing method for a battery system are provided. The battery communication system is used to communicate between a plurality of battery units. The measurement calibration method of the battery communication system includes the following steps. In a wireless daisy chain communication path of the battery communication system, an analog-to-digital circuit is used to measure the potential of a power supply to obtain first measurement information. The analog-to-digital circuit has been installed on a circuit board. An electric meter is used to measure the potential of the power supply to obtain a second measurement information. According to the first measurement information and the second measurement information, a gain error and an offset error of the analog-to-digital circuit are obtained.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:監測通訊晶片</p>
        <p type="p">310:類比轉數位電路</p>
        <p type="p">330:無線通訊單元</p>
        <p type="p">400:電路板</p>
        <p type="p">410:電路板線路</p>
        <p type="p">500:無線耦合元件</p>
        <p type="p">600:電錶</p>
        <p type="p">900:電池單元</p>
        <p type="p">900’:電源</p>
        <p type="p">910:電源線</p>
        <p type="p">MS21:第一量測資訊</p>
        <p type="p">MS22:第二量測資訊</p>
        <p type="p">R410:線路電阻</p>
        <p type="p">R910:線材電阻</p>
        <p type="p">Rref:參考電阻</p>
        <p type="p">RX:接收電路</p>
        <p type="p">TX:傳輸電路</p>
        <p type="p">Vref:參考電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="80" publication-number="202623787">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623787</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146759</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微針貼片</chinese-title>
        <english-title>MICRONEEDLE PATCH</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">A61K9/70</main-classification>
        <further-classification edition="200601120241230B">A61M37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達運精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DARWIN PRECISIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊芸珮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YUN-PEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余俊毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, JYUN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李忠霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHUNG-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種微針貼片，其包含微針層及膠層。微針層包括多個微針，且由生物相容性成分所構成。膠層含有功效性成分，而微針層設置於膠層上。膠層還包含第一區域及第二區域。第二區域圍繞第一區域，且微針層位於第一區域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A microneedle patch comprises a microneedle layer and a glue layer. The microneedle layer includes a plurality of microneedles and is composed of a biocompatible component. The glue layer contains a functional ingredient, and the microneedle layer is disposed on the glue layer. The glue layer also comprises a first area and a second area. The second area surrounds the first area, and the microneedle layer is located in the first area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:微針貼片</p>
        <p type="p">10:微針層</p>
        <p type="p">100:微針</p>
        <p type="p">150:基底層</p>
        <p type="p">151:第一面</p>
        <p type="p">152:第二面</p>
        <p type="p">20:膠層</p>
        <p type="p">30:載體層</p>
        <p type="p">C:生物活性成分</p>
        <p type="p">F:功效性成分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="81" publication-number="202624873">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624873</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146764</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可加快組裝作業的加熱鏡頭模組及其加熱鏡頭</chinese-title>
        <english-title>HEATING LENS MODULE AND HEATING LENS FOR ACCELERATING ASSEMBLY OPERATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120250310B">G03B17/55</main-classification>
        <further-classification edition="202101120250310B">G03B17/00</further-classification>
        <further-classification edition="202101120250310B">G02B7/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紘立光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ETERGE OPTO-ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許智程</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIH-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昀憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YUN-XIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李祖孟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TSU-MENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊函諺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種加熱鏡鏡頭包括一鏡頭、設置在該鏡頭上的一加熱裝置、及承載該鏡頭的一座體。該加熱裝置包括位於該鏡頭的該前蓋內的一加熱環片、從該加熱環片的一側邊延伸到該鏡頭外面且位於該筒體旁邊的一導線段、連接該導線段的一絕緣連接座、及從該絕緣連接座的一側邊凸出的多根導電針腳。該座體的一第一接槽接收該鏡頭及該加熱裝置的該導線段，該座體的一第二接收槽接收該絕緣連接座，以使一雷射焊接機可對從該絕緣連接座凸出的該些導電針腳進行雷射焊接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A heating lens includes a lens, a heating device disposed on the lens, and a body for supporting the lens. The heating device includes a heating ring located within the front cover of the lens; a conductive segment extends from one side of the heating ring to the outside of the lens and is positioned next to the lens barrel, an insulated connector connected to the conductive segment, and a plurality of conductive pins protruding from one side of the insulated connector. A first receiving groove of the body accommodates the lens and the conductive segment of the heating device, while a second receiving groove accommodates the insulated connector, so that the laser welding machine is able to perform laser welding on the conductive pins protruding from the insulated connector.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:鏡頭</p>
        <p type="p">11:筒體</p>
        <p type="p">12:前鏡片</p>
        <p type="p">13:前蓋</p>
        <p type="p">131:底緣</p>
        <p type="p">2:座體</p>
        <p type="p">201:頂面</p>
        <p type="p">202:底面</p>
        <p type="p">203:支持部</p>
        <p type="p">21:第一接收槽</p>
        <p type="p">22:凸栓</p>
        <p type="p">3:加熱裝置</p>
        <p type="p">311:加熱環片</p>
        <p type="p">312:導線段</p>
        <p type="p">321:絕緣連接座</p>
        <p type="p">322:導電針腳</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="82" publication-number="202625222">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625222</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146766</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>過電流保護元件</chinese-title>
        <english-title>OVER-CURRENT PROTECTION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">H01C7/02</main-classification>
        <further-classification edition="200601120241230B">H01C7/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聚鼎科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POLYTRONICS TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董朕宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUNG, CHENG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱敬庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHINGTING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李家源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIA-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉振男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHEN-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏修哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, HSIU-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張永賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YUNG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YAO-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙益安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHA, YI-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種過電流保護元件包含電極層及熱敏電阻層。電極層具有上金屬層及下金屬層，而熱敏電阻層疊設於其間。熱敏電阻層具有正溫度係數特性且包含聚合物基材及導電填料。導電填料包含金屬化合物散佈於聚合物基材中，藉此形成熱敏電阻層的導電通道。金屬化合物由金屬碳化物及不可避免之雜質所組成。以金屬碳化物及不可避免之雜質的含量為100%計，金屬碳化物佔90%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An over-current protection device includes an electrode layer and a heat-sensitive layer. The electrode layer has a top metal layer and a bottom metal layer, and the heat-sensitive layer is laminated between them. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a polymer matrix and a conductive filler. The conductive filler includes a metal compound dispersed in the polymer matrix, thereby forming an electrically conductive path in the heat-sensitive layer. The metal compound consists of a metal carbide and unavoidable impurities. The total amount of the metal carbide and unavoidable impurities is taken as 100%, and the metal carbide accounts for at least 90%.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="83" publication-number="202624494">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624494</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146773</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自我競爭型引子及其用途</chinese-title>
        <english-title>SELF-COMPETITIVE PRIMERS, AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250501B">C12Q1/6876</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣基督長老教會馬偕醫療財團法人馬偕紀念醫院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACKAY MEMORIAL HOSPITAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張志隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳昭志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHAO-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何美瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盛珮雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容是關於一種自我競爭型引子，其相較於參考核酸可專一擴增突變核酸，其中所述突變核酸及參考核酸在一選定位置分別具有變異核苷酸及參考核苷酸。依據本揭示內容的實施方式，所述自我競爭型引子由5’端到3’端包含：錨定域、阻斷域及延長域，其中錨定域之核苷酸序列與一位於選定位置上游之上游區域的核苷酸序列相同，而阻斷域及延長域的核苷酸序列則分別包含參考核苷酸及變異核苷酸。本揭示內容亦關於一種利用本發明自我競爭型引子來決定檢體核酸是否存在變異核苷酸的方法，以及一種利用本發明自我競爭型引子來診斷子宮內膜癌的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein is a self-competitive primer for specifically amplifying a mutant nucleic acid over a reference nucleic acid, wherein the mutant nucleic acid and reference nucleic acid respectively have a variant nucleotide and a reference nucleotide at a selected position. According to the embodiments of the present disclosure, the self-competitive primer comprises, from 5’ end to 3’ end, an anchoring domain, a blocking domain, and an elongating domain, in which the anchoring domain has a nucleotide sequence identical to that an upstream region located upstream of the selected position, and the blocking and elongating domains respectively comprise the reference nucleotide and the variant nucleotide in their nucleotide sequences. Also disclosed herein are methods of determining the presence or absence of a variant nucleotide in a sample nucleic acid and methods of making a diagnosis of endometrial cancer by using the instant self-competitive primer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:突變核酸</p>
        <p type="p">300:自我競爭型引子</p>
        <p type="p">310:錨定域</p>
        <p type="p">315:第一連接子</p>
        <p type="p">320:阻斷域</p>
        <p type="p">325:第二連接子</p>
        <p type="p">330:延長域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="84" publication-number="202624681">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624681</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146776</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>散熱模組</chinese-title>
        <english-title>HEAT DISSIPATION MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">F28F3/04</main-classification>
        <further-classification edition="200601120250303B">F28F13/02</further-classification>
        <further-classification edition="200601120250303B">H05K7/20</further-classification>
        <further-classification edition="200601120250303B">G06F1/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李紹名</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, SHAO-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡孟諺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MENG-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖建順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAW, JANE-SUNN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林依萍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YI-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王建昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIEN-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種散熱模組包含迎風散熱器、背風散熱器及連接管。迎風散熱器包含二第一水箱、第一微流道結構及第一鰭片，二第一水箱連通第一微流道結構，二第一水箱具有第一入口及第一出口，第一鰭片設置於第一微流道結構。背風散熱器與迎風散熱器並排。背風散熱器包含二第二水箱、第二微流道結構及第二鰭片，二第二水箱連通第二微流道結構，二第二水箱分別具有第二入口及第二出口，第二鰭片設置於第二微流道結構。連接管連接第二水箱及第一水箱。第一鰭片為波浪形百葉窗鰭片，第二鰭片為方形百葉窗鰭片，且第一鰭片的密度小於第二鰭片的密度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A heat dissipation module includes a windward radiator, a leeward radiator and a connection pipe. The windward radiator includes two first tanks, a plurality of first micro channel structures and a plurality of first fins. The two first tanks communicate with each other via the first micro channel structures, and the two first tanks respectively have a first inlet and a first outlet. The first fins are disposed between the first micro channel structures. The leeward radiator and the windward radiator are arranged side by side. The leeward radiator includes two second tanks, a plurality of second micro channel structures and a plurality of second fins. The two second tanks communicate with each other via the second micro channel structures, and the two second tanks respectively have a second inlet and a second outlet. The second fins are disposed between the second micro channel structures. The connection pipe is connected to the second outlet of one of the second tanks and the first inlet of one of the first tanks. The first fins are triangular louvered fins, and the second fins are rectangular louvered fins. A density of the first fins is smaller than a density of the second fins.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:散熱模組</p>
        <p type="p">10:迎風散熱器</p>
        <p type="p">11:第一水箱</p>
        <p type="p">12:第一微流道結構</p>
        <p type="p">13:第一鰭片</p>
        <p type="p">20:背風散熱器</p>
        <p type="p">21:第二水箱</p>
        <p type="p">30:連接管</p>
        <p type="p">i1:第一入口</p>
        <p type="p">O2:第二出口</p>
        <p type="p">F:氣流</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="85" publication-number="202625064">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625064</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146777</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>跨行交易管理系統及其方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250313B">G06Q40/02</main-classification>
        <further-classification edition="201201120250313B">G06Q40/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>第一商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FIRST COMMERCIAL BANK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉英豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂冠瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種跨行交易管理系統，包含一處理單元及一儲存單元。該儲存單元儲存有多筆客戶資訊及多筆跨行交易紀錄。每一客戶資訊包含一本行帳號及一客戶名稱。每一筆跨行交易紀錄對應於該等客戶資訊之其中一者並包含一跨行帳號。該處理單元接收到一包含一匯款帳號及一匯款人名稱的跨行匯款資料後，判斷該匯款人名稱是否與該等客戶名稱的至少一者相符，並於判斷為是且於判斷該其中一相符者對應的該或該等跨行交易紀錄中存在至少一筆其該跨行帳號與該匯款帳號相符的跨行交易紀錄後，該處理單元將該其中一相符者對應的該本行帳號作為一收款帳號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:跨行交易管理系統</p>
        <p type="p">1:處理單元</p>
        <p type="p">2:儲存單元</p>
        <p type="p">10:跨行驗證伺服器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="86" publication-number="202624825">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624825</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146778</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>取像光學系統、取像裝置及電子裝置</chinese-title>
        <english-title>IMAGE CAPTURING OPTICAL SYSTEM, IMAGE CAPTURING UNIT AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">G02B11/34</main-classification>
        <further-classification edition="202101120250303B">G02B7/02</further-classification>
        <further-classification edition="202101120250303B">G03B17/12</further-classification>
        <further-classification edition="202101120250303B">G03B17/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大立光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LARGAN PRECISION CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊諺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖冠智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, GUAN-JR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種取像光學系統，包含七片透鏡。七片透鏡沿光路由物側至像側依序為第一透鏡、第二透鏡、第三透鏡、第四透鏡、第五透鏡、第六透鏡以及第七透鏡。七片透鏡分別具有朝向物側方向的物側表面與朝向像側方向的像側表面。第三透鏡具有負屈折力。第五透鏡物側表面於近光軸處為凹面。第六透鏡具有正屈折力。第七透鏡具有負屈折力。第七透鏡物側表面於近光軸處為凸面。第七透鏡像側表面於近光軸處為凹面，且第七透鏡像側表面具有至少一反曲點。當滿足特定條件時，取像光學系統能同時滿足微型化和高成像品質的需求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image capturing optical system includes seven lens elements which are, in order from an object side to an image side along an optical path: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element. Each of the seven lens elements has an object-side surface facing toward the object side and an image-side surface facing toward the image side. The third lens element has negative refractive power. The object-side surface of the fifth lens element is concave in a paraxial region thereof. The sixth lens element has positive refractive power. The seventh lens element has negative refractive power. The object-side surface of the seventh lens element is convex in a paraxial region thereof. The image-side surface of the seventh lens element is concave in a paraxial region thereof and has at least one inflection point. When specific conditions are satisfied, the requirements of miniaturization and high image quality can be met by the image capturing optical system, simultaneously.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:取像裝置</p>
        <p type="p">ST:光圈</p>
        <p type="p">S1:光闌</p>
        <p type="p">E1:第一透鏡</p>
        <p type="p">E2:第二透鏡</p>
        <p type="p">E3:第三透鏡</p>
        <p type="p">E4:第四透鏡</p>
        <p type="p">E5:第五透鏡</p>
        <p type="p">E6:第六透鏡</p>
        <p type="p">E7:第七透鏡</p>
        <p type="p">E8:濾光元件</p>
        <p type="p">IMG:成像面</p>
        <p type="p">IS:電子感光元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="87" publication-number="202625045">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625045</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146781</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>減少信用卡服務主機服務項目的系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR REDUCING SERVICE ITEMS OF CREDIT CARD SERVICE HOST</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120250206B">G06Q20/34</main-classification>
        <further-classification edition="201201120250206B">G06Q20/40</further-classification>
        <further-classification edition="202301120250206B">G06Q30/015</further-classification>
        <further-classification edition="202301120250206B">G06Q30/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華南商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUA NAN COMMERCIAL BANK, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YEN HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提出一種減少信用卡服務主機服務項目的系統方法，所述方法包括：決策主機通訊連接至信用卡服務主機及聯徵中心主機以分別取得第一及第二風險指標資料，依據這些風險指標資料計算風險評分並轉換為風險等級。決策主機定期輸出風險等級大於第一閾值且個人信用評分小於第二閾值的多個第一客戶作為定期管理名單，在偵測到繳款異常及消費異常的第二客戶時輸出作為特殊管理名單。風險控制主機根據這些管理名單及從聯徵中心取得的控管參考資料決定停用項目，信用卡服務主機依此回應相關停用請求並發出拒絕訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and method for reducing service items of credit card service hosts is proposed. The method includes: a decision host communicating with the credit card service host and the credit bureau host to obtain first and second risk indicator data, respectively. Based on these risk indicators, the system calculates a risk score and converts it into a risk level. The decision host periodically generates a regular management list comprising multiple first customers whose risk levels exceed a first threshold and whose personal credit scores fall below a second threshold. When payment or consumption abnormalities are detected for second customers, the system generates a special management list. The risk control host determines deactivation items based on these management lists and control reference data obtained from the credit bureau. The credit card service host responds to related deactivation requests accordingly and issues denial signals.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1,S2,S3,S4,S5:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="88" publication-number="202625205">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625205</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146797</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>建立組織微陣列影像模型以及使用該模型判定組織型態的方法</chinese-title>
        <english-title>METHODS FOR ESTABLISHING TISSUE MICROARRAY IMAGING MODEL AND IDENTIFYING TISSUE MORPHOLOGY BY USING THE MODEL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250303B">G16H30/40</main-classification>
        <further-classification edition="201801120250303B">G16H30/20</further-classification>
        <further-classification edition="201801120250303B">G16H50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中央大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CENTRAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛教慈濟醫療財團法人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUDDHIST TZU CHI MEDICAL FOUNDATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>花蓮縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許藝瓊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YI-CHIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王家慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIA-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>範　白松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PHAM, BACH TUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡國旺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, KUO-WANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容關於一種建立組織微陣列影像模型的方法，具體是藉由訓練經處理後的組織微陣列影像來建立該模型。所述方法包含以下步驟：(a) 取得組織之組織微陣列影像，其中組織微陣列影像包含複數個組織影像，各該組織影像對應組織型態資訊；(b) 調整組織影像之大小，以對應形成複數個調整後組織影像；(c) 對步驟(b)的複數個調整後組織影像進行數據增強，以對應形成複數個增強影像，其中各該增強影像為一完整圓形；以及(d) 藉助於步驟(a)的組織型態資訊來訓練步驟(c)之複數個增強影像，從而建立所述模型。本揭示內容還關於藉由前揭模型來判定一組織之組織型態的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein is a method for establishing a tissue microarray image model by training processed tissue microarray images. The method comprises the following steps: (a) obtaining an image of a tissue microarray, wherein the image contains a plurality of tissue images, each corresponding to a tissue morphology information; (b) resizing the tissue images to generate a plurality of resized tissue images; (c) performing data augmentation on the plurality of resized tissue images of step (b) to produce a plurality of augmented images, each of which is a complete circle; and (d) training the plurality of augmented images from step (c) with aid of the tissue morphology information from step (a) to establish the present model. Also disclosed herein is a method for identifying the tissue morphology of a tissue by using the aforementioned model.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:方法</p>
        <p type="p">S101-S104:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="89" publication-number="202624029">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624029</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146798</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>車輛自動防西曬調光系統</chinese-title>
        <english-title>VEHICLE AUTOMATIC SUN PROTECTION DIMMING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">B60J1/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中央大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CENTRAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫慶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, CHING-CHERNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊宗翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, ZONG-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊益松</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係為一種車輛自動防西曬調光系統，包括：調光面板，安裝於擋風玻璃上並具有複數相互獨立的液晶薄膜分區；偵測單元，電性連接該調光面板並用以偵測陽光照射到駕駛人眼睛的眩光；控制單元，電性連接該調光面板及該偵測單元，當該偵測單元偵測到該駕駛人眼睛有眩光時，便會發送偵測訊號至該控制單元，該控制單元根據該偵測訊號對該調光面板之複數液晶薄膜分區之光穿透率進行調整，使調光面板進行局部區域的逐漸調暗，避免陽光直射到駕駛人眼睛造成眩光情況，影響駕駛安全。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention is an automatic sun protection dimming system for vehicles, which includes: a dimming panel installed on the windshield and having a plurality of independent liquid crystal film partitions; a detection unit electrically connected to the dimming panel and used for detection The glare caused by sunlight hitting the driver's eyes; the control unit is electrically connected to the dimming panel and the detection unit. When the detection unit When the unit detects glare in the driver's eyes, it will send a detection signal to the control unit. The control unit adjusts the light transmittance of the plurality of liquid crystal film partitions of the dimming panel based on the detection signal, so that The dimming panel gradually dims local areas to prevent direct sunlight from hitting the driver's eyes, causing glare and affecting driving safety.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:調光面板</p>
        <p type="p">10:液晶薄膜分區</p>
        <p type="p">3:偵測單元</p>
        <p type="p">4:擋風玻璃</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="90" publication-number="202623863">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623863</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146799</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>球棒加工方法</chinese-title>
        <english-title>A BAT PROCESSING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120250214B">A63B59/50</main-classification>
        <further-classification edition="201501120250214B">A63B60/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>復盛應用科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUSHENG PRECISION CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫毅宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, YI-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃耀霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種球棒加工方法，用以解決習知空心球棒擊球效果不佳的問題。係包含：將一球棒半成品以一軸心旋轉，該球棒半成品為一空心筒體具相對的一外表面及一內表面，該球棒半成品的一端具有一開口，該開口連通該球棒半成品內的一空間；及以一刀具對該球棒半成品的內表面切削，使該外表面與該內表面之間形成非均一的厚度。藉此可以達成提升擊球效果功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bat processing method is used to solve the problem of poor hitting effect of conventional hollow bats. Includes: rotating a semi-finished bat on an axis. The semi-finished bat is a hollow cylinder with an opposite outer surface and an inner surface. One end of the semi-finished bat has an opening, and the opening is connected to the bat. a space in the semi-finished product; and cutting the inner surface of the semi-finished ball bat product with a tool to form a non-uniform thickness between the outer surface and the inner surface. This can achieve the effect of improving the batting effect.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:球棒半成品</p>
        <p type="p">1a:外表面</p>
        <p type="p">1b:內表面</p>
        <p type="p">11:第一端</p>
        <p type="p">12:第二端</p>
        <p type="p">13:開口</p>
        <p type="p">2:刀具</p>
        <p type="p">21:刃部</p>
        <p type="p">S:空間</p>
        <p type="p">O1:軸心</p>
        <p type="p">O2:旋轉軸心</p>
        <p type="p">W:夾具</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="91" publication-number="202625397">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625397</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146800</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>由終端裝置控制的中繼器及其控制方法</chinese-title>
        <english-title>USER-CONTROLLED REPEATER AND METHOD FOR CONTROLLING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">H04B7/14</main-classification>
        <further-classification edition="200901120250303B">H04W88/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中山大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL SUN YAT-SEN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫朝凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEN, CHAO-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹晏丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, YEN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃子豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TZU-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃耀霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種由終端裝置控制的中繼器，用以解決習知無線通訊系統頻譜效益受到侷限的問題。係包含：一接收天線，用於接收來自基站的一第一訊號；一發射天線，用於發射一第二訊號；一通訊單元，用於透過一短距離通訊協議與該終端裝置建立連線，傳送一回報資料，並接收來自該終端裝置的一控制指令；一轉換單元，用於調整該第一訊號的頻率，以產生該第二訊號；及一控制單元，用於依據該回報資料及該控制指令，控制該轉換單元進行頻率調整。同時，亦揭露一種由終端裝置控制中繼器的控制方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A user-controlled repeater includes a receiving antenna, transmitting antenna, a communication unit, a frequency conversion unit, and a control unit. The receiving antenna can receive a first signal from a base station. The transmitting antenna can transmit a second signal. The communication unit can establish a wireless connection with the user device via a short-range communication protocol, transmit feedback data, and receive a control command from the user device. The frequency conversion unit can adjust the frequency of the first signal to generate the second signal. The control unit can control the frequency conversion unit to perform frequency adjustments based on the feedback data and the control command. Additionally, a method for controlling the user-controlled repeater is also disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:中繼器</p>
        <p type="p">2:終端裝置</p>
        <p type="p">3:基站</p>
        <p type="p">A:第一訊號</p>
        <p type="p">B:第二訊號</p>
        <p type="p">C:回報資料</p>
        <p type="p">D:控制指令</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="92" publication-number="202624922">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624922</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146801</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>吸音結構及伺服器</chinese-title>
        <english-title>SOUND ABSORPTION STRUCTURE AND SERVER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250409B">G06F1/16</main-classification>
        <further-classification edition="200601120250409B">H05K5/02</further-classification>
        <further-classification edition="200601120250409B">F04D29/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃心豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HSIN-HAOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡登善</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, TENG-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳伯修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO-HSIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡協良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, HSIEH-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種吸音結構，包含至少一吸音單元。吸音單元包含多個子單元，這些子單元呈陣列排列且彼此相連而共同圍繞形成一透音槽。這些子單元各者包含相連通的一吸音腔室及一連通道，吸音腔室為多邊形腔室，連通道位於吸音腔室的角落處，且這些子單元至少一者的吸音腔室透過連通道連通於透音槽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A sound absorption structure includes at least one sound absorption unit. The sound absorption unit includes a plurality of subunits. The subunits are arranged in an array and connected to each other so as to surround and form a sound penetrable slot. Each of the subunits includes a sound absorption chamber and a communication channel communicating with each other. The sound absorption chamber is a polygonal chamber, and the communication channel is located at a corner of the sound absorption chamber. The sound absorption chamber of at least one of the subunits communicates with the sound penetrable slot via the communication channel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">41:吸音單元</p>
        <p type="p">411:子單元</p>
        <p type="p">4111:吸音腔室</p>
        <p type="p">4112:連通道</p>
        <p type="p">4113:第一表面</p>
        <p type="p">4114:第二表面</p>
        <p type="p">412:連接部</p>
        <p type="p">413:透音槽</p>
        <p type="p">4131:第一側</p>
        <p type="p">4132:第二側</p>
        <p type="p">4133:第三側</p>
        <p type="p">4134:第四側</p>
        <p type="p">4135:端部</p>
        <p type="p">4136:中央部</p>
        <p type="p">W1,W2:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="93" publication-number="202624072">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624072</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146803</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>剎車握把止動安全結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">B62L1/00</main-classification>
        <further-classification edition="200601120250303B">B62L3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃漢珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃漢珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白丞堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種剎車握把止動安全結構，係安裝在一剎車本體，該止動安全結構包含有：一上止動片、一下止動片及一扭轉彈簧所構成；該上止動片及該下止動片中央有一貫穿孔供軸桿穿設，使得該上止動片與該下止動片能沿著該軸桿轉動，該上止動片另設有一穿槽，該穿槽供該扭轉彈簧彈性連接，而扭轉彈簧另一端則連接於該剎車本體，且該上止動片與該下止動片具有一突出之止擋端，前述的止擋端對應該制動鈕之制動槽；藉由轉動該止動安全結構，使得該等止擋端嵌入該制動鈕之制動槽，使得剎車制動狀態下，防止該制動鈕跳脫解除制動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">5:剎車握把</p>
        <p type="p">51:軸孔</p>
        <p type="p">52:轉動部</p>
        <p type="p">53:軸桿</p>
        <p type="p">6:制動鈕</p>
        <p type="p">61:彈簧</p>
        <p type="p">62:制動槽</p>
        <p type="p">7:止動安全結構</p>
        <p type="p">71:上止動片</p>
        <p type="p">711:貫穿孔</p>
        <p type="p">712:穿槽</p>
        <p type="p">713:撥桿</p>
        <p type="p">714:止擋端</p>
        <p type="p">72:下止動片</p>
        <p type="p">721:貫穿孔</p>
        <p type="p">722:止擋端</p>
        <p type="p">73:扭轉彈簧</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="94" publication-number="202624622">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624622</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146804</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>吸音結構及伺服器</chinese-title>
        <english-title>SOUND ABSORPTION STRUCTURE AND SERVER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">F04D29/66</main-classification>
        <further-classification edition="200601120241230B">H05K7/20</further-classification>
        <further-classification edition="200601220241230B">E04B1/86</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃心豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HSIN-HAOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡登善</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, TENG-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳伯修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO-HSIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡協良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, HSIEH-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種吸音結構，包含至少一吸音單元。吸音單元包含多個子單元，這些子單元呈陣列排列且彼此相連而共同圍繞形成一透音槽。這些子單元各者包含相連通的一吸音腔室及一連通道，吸音腔室為多邊形腔室，連通道分離於吸音腔室的角落處，且這些子單元至少一者的吸音腔室透過連通道連通於透音槽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A sound absorption structure includes at least one sound absorption unit. The sound absorption unit includes a plurality of subunits. The subunits are arranged in an array and connected to each other so as to surround and form a sound penetrable slot. Each of the subunits includes a sound absorption chamber and a communication channel communicating with each other. The sound absorption chamber is a polygonal chamber, and the communication channel is separated from corners of the sound absorption chamber. The sound absorption chamber of at least one of the subunits communicates with the sound penetrable slot via the communication channel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">41:吸音單元</p>
        <p type="p">411:子單元</p>
        <p type="p">4111:吸音腔室</p>
        <p type="p">4112:連通道</p>
        <p type="p">4113:第一表面</p>
        <p type="p">4114:第二表面</p>
        <p type="p">412:連接部</p>
        <p type="p">413:透音槽</p>
        <p type="p">4131:第一側</p>
        <p type="p">4132:第二側</p>
        <p type="p">4133:第三側</p>
        <p type="p">4134:第四側</p>
        <p type="p">4135:端部</p>
        <p type="p">4136:中央部</p>
        <p type="p">W1,W2:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="95" publication-number="202624656">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624656</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146806</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於辨識管閥洩漏的辨識模型建構方法及管閥洩漏模擬系統</chinese-title>
        <english-title>A METHOD FOR CONSTRUCTING AN IDENTIFICATION MODEL FOR DETECTING VALVE LEAKAGE AND A VALVE LEAKAGE SIMULATION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">F17D5/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳明進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MING CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安乃駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AN, NAI CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於辨識管閥洩漏的辨識模型建構方法及管閥洩漏模擬系統，其步驟包括：透過管閥洩漏模擬系統，依據配管閥資訊，設置複數個管閥件；針對可能的複數個洩漏狀況，對應設定複數個管閥件的洩漏流量來模擬複數個管閥件洩漏狀態；配置感測模組蒐集時段內來自管閥洩漏模擬系統中之各位置的複數個感測訊號；以及將複數個感測訊號進行前處理後，產生對應的複數個頻率域影像，並以複數個頻率域影像訓練注意力模型，計算頻率數值間的相關性，依據相關性分配權重以強化關鍵特徵，再透過卷積神經網路獲得辨識模型。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for constructing an identification model for detecting valve leakage and a valve leakage simulation system includes the following steps: Using the valve leakage simulation system, multiple valve components are set up based on piping and valve information. For various potential leakage scenarios, corresponding leakage flow rates are configured for the multiple valve components to simulate their leakage states. A sensing module is deployed to collect multiple sensor signals from various locations within the valve leakage simulation system over a specific period. After preprocessing these sensor signals, corresponding frequency-domain images are generated. These frequency-domain images are used to train an attention model, which calculates correlations between frequency values, assigns weights based on the correlations to enhance key features, and ultimately obtains the identification model through a convolutional neural network.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110~S140:步驟流程</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="96" publication-number="202625081">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625081</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146807</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種基於人工智慧識別球墨鑄鐵的影像辨識之方法及其電腦可讀媒體</chinese-title>
        <english-title>A METHOD FOR IMAGE RECOGNITION OF DUCTILE IRON BASED ON AI AND ITS COMPUTER-READABLE MEDIUM.</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120250303B">G06T7/00</main-classification>
        <further-classification edition="202201120250303B">G06V10/82</further-classification>
        <further-classification edition="202301120250303B">G06N3/045</further-classification>
        <further-classification edition="201901120250303B">G06N20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIA WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝榮哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, JUNG-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基於人工智慧識別球墨鑄鐵的影像辨識之方法及其電腦可讀媒體，方法包括以下步驟：擷取影像；訓練人工智慧模型；辨識影像；以及分析影像。本發明復提供一種電腦可讀媒體，存有指令係用以執行本發明之方法。本發明中藉由人工智慧模型深度學習訓練，用以識別球墨顆粒並提升計算球化率的效率及準確度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for image recognition of ductile iron based on AI and its computer-readable medium, comprising the following steps: capturing an image; training an AI model; recognizing the image; and analyzing the image. This invention also provides a computer-readable medium containing instructions for executing the method of this invention. In this invention, the AI model is trained through deep learning to recognize spheroidal particles and enhance the efficiency and accuracy of calculating the spheroidization rate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10~S40:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="97" publication-number="202624923">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624923</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146808</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>吸音結構及伺服器</chinese-title>
        <english-title>SOUND ABSORPTION STRUCTURE AND SERVER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250415B">G06F1/16</main-classification>
        <further-classification edition="200601120250415B">H05K5/02</further-classification>
        <further-classification edition="200601120250415B">F04D29/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃心豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HSIN-HAOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡登善</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, TENG-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳伯修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO-HSIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡協良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, HSIEH-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種吸音結構，包含至少一吸音單元。吸音單元包含多個子單元及多個連接部，這些子單元呈陣列排列，且透過這些連接部彼此相連而共同圍繞形成一透音槽。這些子單元各者包含一吸音腔室，這些連接部各者包含一連通道，這些連接部的這些連通道分別連通於這些子單元的這些吸音腔室。這些連接部至少一者的連通道連通於透音槽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A sound absorption structure includes at least one sound absorption unit. The sound absorption unit includes a plurality of subunits and a plurality of connection portions. The subunits are arranged in an array and connected to each other via the connection portions so as to surround and form a sound penetrable slot. Each of the subunits includes a sound absorption chamber. Each of the connection portions includes a communication channel. The communication channels of the connection portions respectively communicate with the sound absorption chambers of the subunits. The communication channel of at least one of the connection portions communicates with the sound penetrable slot.</p>
      </isu-abst>
      <representative-img>
        <p type="p">41:吸音單元</p>
        <p type="p">411:子單元</p>
        <p type="p">4111:吸音腔室</p>
        <p type="p">412:連接部</p>
        <p type="p">4121:連通道</p>
        <p type="p">41211:第一延伸段</p>
        <p type="p">41212:第二延伸段</p>
        <p type="p">413,414,415:透音槽</p>
        <p type="p">4131:第一側</p>
        <p type="p">4132:第二側</p>
        <p type="p">4133:第三側</p>
        <p type="p">4134:第四側</p>
        <p type="p">W1,W2:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="98" publication-number="202625524">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625524</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146809</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>吸音結構及伺服器</chinese-title>
        <english-title>SOUND ABSORPTION STRUCTURE AND SERVER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250411B">H05K5/02</main-classification>
        <further-classification edition="200601120250411B">G06F1/16</further-classification>
        <further-classification edition="200601120250411B">F04D29/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃心豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HSIN-HAOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡登善</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, TENG-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳伯修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO-HSIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡協良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, HSIEH-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種吸音結構，包含至少一吸音單元。吸音單元包含多個子單元，這些子單元呈陣列排列且彼此相連而共同圍繞形成一透音槽。這些子單元各者包含多個吸音腔室及多個連通道，這些吸音腔室及這些連通道相連通，這些子單元至少一者的這些連通道的其中一者連接於透音槽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A sound absorption structure includes at least one sound absorption unit. The sound absorption unit includes a plurality of subunits. The subunits are arranged in an array and connected to each other so as to surround and form a sound penetrable slot. Each of the subunits includes a plurality of sound absorption chambers and a plurality of communication channels, and the sound absorption chambers and the communication channels communicate with each other. One of the communication channels of at least one of the subunits is connected to the sound penetrable slot.</p>
      </isu-abst>
      <representative-img>
        <p type="p">41:吸音單元</p>
        <p type="p">411:子單元</p>
        <p type="p">4111:吸音腔室</p>
        <p type="p">4112:連通道</p>
        <p type="p">412:連接部</p>
        <p type="p">413:透音槽</p>
        <p type="p">4131:第一側</p>
        <p type="p">4132:第二側</p>
        <p type="p">4133:第三側</p>
        <p type="p">4134:第四側</p>
        <p type="p">4135:端部</p>
        <p type="p">4136:中央部</p>
        <p type="p">W1,W2:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="99" publication-number="202625537">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625537</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146810</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>減振結構及電子裝置</chinese-title>
        <english-title>DAMPING STRUCTURE AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241227B">H05K7/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃心豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HSIN-HAOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳品傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PIN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳伯修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO-HSIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡協良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, HSIEH-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置，包含一機殼、一硬碟、至少一風扇以及至少一減振結構。硬碟設置於機殼內。至少一風扇設置於機殼內。至少一減振結構位於硬碟與至少一風扇之間，並包含一彈片以及一質量塊。彈片包含二安裝部以及一彎曲部。二安裝部安裝於機殼。彎曲部之相對兩端分別連接於二安裝部。彎曲部之中段與機殼的距離大於彎曲部之相對兩端與機殼的距離。質量塊設置於彎曲部之中段。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device includes a casing, a hard disk, at least one fan and at least one damping structure. The hard disk is disposed in the casing. The at least one fan is disposed in the casing. The at least one damping structure is located between the hard disk and the at least one fan, and includes an elastic component and a mass block. The elastic component includes two mounting portions and a bending portion. The two mounting portions are mounted in the casing. Opposite ends of the bending portion are respectively connected to the two mounting portions. A distance between a central section of the bending portion and the casing is greater than a distance between the opposite ends of the bending portion and the casing. The mass block is disposed on the central section of the bending portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:機殼</p>
        <p type="p">21:機殼本體</p>
        <p type="p">22:磁性件</p>
        <p type="p">50:減振結構</p>
        <p type="p">51:彈片</p>
        <p type="p">511:安裝部</p>
        <p type="p">512:彎曲部</p>
        <p type="p">5122:缺槽</p>
        <p type="p">52:質量塊</p>
        <p type="p">521:表面</p>
        <p type="p">522:組裝柱</p>
        <p type="p">523:安裝槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="100" publication-number="202625531">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625531</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146812</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>減振結構及電子裝置</chinese-title>
        <english-title>DAMPING STRUCTURE AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">H05K7/14</main-classification>
        <further-classification edition="200601120241230B">F16F15/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃心豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HSIN-HAOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳品傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PIN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳伯修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO-HSIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡協良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, HSIEH-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置，包含一機殼、一硬碟、至少一風扇以及至少一減振結構。硬碟設置於機殼內。至少一風扇設置於機殼內。至少一減振結構位於硬碟與至少一風扇之間，並包含一彈性件以及一質量塊。彈性件包含一安裝部、一支撐部以及一擺動部。安裝部設置於機殼。支撐部之相對兩端分別連接於安裝部以及擺動部。安裝部與擺動部位於支撐部之同一側。擺動部可相對支撐部與安裝部擺動。質量塊設置於擺動部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device includes a casing, a hard disk, at least one fan and at least one damping structure. The hard disk is disposed in the casing. The at least one fan is disposed in the casing. The at least one shock absorbing structure is located between the hard disk and the at least one fan, and includes an elastic component and a mass block. The elastic component includes a mounting portion, a supporting portion and a swinging portion. The mounting portion is disposed on the casing. Opposite ends of the support portion are respectively connected to the mounting portion and the swing portion. The mounting portion and the swinging portion are located on the same side of the supporting portion. The swinging portion can swing relative to the supporting portion and the mounting portion. The mass block is disposed on the swing portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:減振結構</p>
        <p type="p">51:彈性件</p>
        <p type="p">511:安裝部</p>
        <p type="p">512:支撐部</p>
        <p type="p">513:擺動部</p>
        <p type="p">5131:組裝槽</p>
        <p type="p">52:質量塊</p>
        <p type="p">522:組裝柱</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="101" publication-number="202624639">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624639</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146818</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>減振結構及電子裝置</chinese-title>
        <english-title>DAMPING STRUCTURE AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250321B">F16F15/04</main-classification>
        <further-classification edition="200601120250321B">H05K5/02</further-classification>
        <further-classification edition="200601120250321B">F04D29/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃心豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HSIN-HAOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳品傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PIN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳伯修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO-HSIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡協良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, HSIEH-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置，包含一機殼、一硬碟、至少一風扇以及至少一減振結構。硬碟設置於機殼內。至少一風扇設置於機殼內。至少一減振結構位於硬碟與至少一風扇之間，並包含一框件、一撓性薄膜以及一質量塊。框件設置於機殼。撓性薄膜設置於框件。撓性薄膜的周緣與框件相連。質量塊設置於撓性薄膜。框件將質量塊圍繞於內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device includes a casing, a hard disk, at least one fan and at least one damping structure. The hard disk is disposed in the casing. The at least one fan is disposed in the casing. The at least one damping structure is located between the hard disk and the at least one fan, and includes a frame, a flexible film and a mass block. The frame is disposed on the casing. The flexible film is disposed on the frame. The periphery of the flexible film is connected to the frame. The mass block is disposed on the flexible film. The frame surrounds the mass block.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:減振結構</p>
        <p type="p">51:框件</p>
        <p type="p">511:夾持框部</p>
        <p type="p">52:撓性薄膜</p>
        <p type="p">53:質量塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="102" publication-number="202625158">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625158</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146819</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>有聲故事動畫自動產生系統、方法及其電腦可讀取儲存媒體</chinese-title>
        <english-title>SYSTEM AND METHOD FOR AUTOMATICALLY GENERATING AUDIOBOOKS WITH ANIMATION AND COMPUTER-READABLE STORAGE MEDIUM THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">G10L13/00</main-classification>
        <further-classification edition="201301120250303B">G10L13/02</further-classification>
        <further-classification edition="201101120250303B">G06T13/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉冠廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIOU, GUAN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林長榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種有聲故事動畫自動產生方法、相應之系統及其電腦可讀取儲存媒體。該方法包括：接收一故事概述；產生角色之特徵標籤；使用大型語言模型技術，且根據該故事概述，生成符合該角色之特徵標籤的對話內容；使用該角色之語音模型為該對話內容配音，以產生故事對話語音，其中，該語音模型與該角色之特徵標籤相對應；以及根據該角色之特徵標籤及該故事對話語音，並使用人工智慧動畫生成技術，產生有聲故事動畫。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for automatically generating audiobooks with animation, a corresponding system and a corresponding computer-readable storage medium thereof are provided. The method includes the following steps: receiving a story overview; generating characteristics tags of a character; generating dialogue contents matching the character's characteristics tags using large-scale language model technology and based on the story overview; dubbing the dialogue contents using the character's voice model to generate story dialogue voice, where the voice model corresponds to the character's characteristics tags; and generating an audiobook with animation using the character's characteristics tags, the story dialogue voice and artificial intelligence animation generation technology.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:多語者語料</p>
        <p type="p">101:角色特徵標籤</p>
        <p type="p">102:使用者形象標籤</p>
        <p type="p">103:語音資料庫及對應標籤建立模組</p>
        <p type="p">104:故事生成模組</p>
        <p type="p">105:故事形象標籤及語音提取模組</p>
        <p type="p">106:故事分鏡及內容創建模組</p>
        <p type="p">107:使用者特徵標籤提取模組</p>
        <p type="p">108:使用者語音學習模組</p>
        <p type="p">109:故事內容生成模組</p>
        <p type="p">110:動畫生成模組</p>
        <p type="p">111:使用者語音模型</p>
        <p type="p">112:角色語音模型</p>
        <p type="p">113:語音資料庫及對應標籤</p>
        <p type="p">114:對話內容描述</p>
        <p type="p">115:故事分鏡內容</p>
        <p type="p">116:故事對話語音</p>
        <p type="p">117:故事角色形象</p>
        <p type="p">118:故事完整描述</p>
        <p type="p">119:故事概述</p>
        <p type="p">121:使用者語音檔案</p>
        <p type="p">122:有聲故事動畫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="103" publication-number="202624946">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624946</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146820</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>產生虛擬化身連結元宇宙互動之方法、系統及其電腦可讀媒介</chinese-title>
        <english-title>METHOD AND SYSTEM FOR GENERATING AVATAR FOR COMMUNICATION AND INTERACTION WITH VIRTUAL WORLD AND COMPUTER READABLE MEDIUM THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250418B">G06F3/04815</main-classification>
        <further-classification edition="200601120250418B">G10L15/02</further-classification>
        <further-classification edition="200601120250418B">G10L15/08</further-classification>
        <further-classification edition="201101120250418B">G06T13/40</further-classification>
        <further-classification edition="201301120250418B">G06F21/31</further-classification>
        <further-classification edition="202001120250418B">G06F40/295</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林國朝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, GUO-CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林長榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種產生虛擬化身連結元宇宙互動之方法與系統，用於進行元宇宙之使用者和該元宇宙外之通話對方的語音通話。該方法與該系統係根據該通話對方之通訊資訊，判定該通話對方之身分，進而決定該通話對方在該元宇宙之虛擬化身。此外，該方法與該系統能根據該通話對方之語音資料，令該虛擬化身做出相應之表情動作。再者，該方法與該系統能根據該使用者與該虛擬化身之互動，且根據該元宇宙之虛擬空間中的場景或活動，令該虛擬化身做出相應之動作或變更狀態。本發明復提供一種電腦可讀媒介，係用於執行本發明之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a method and a system for generating an avatar for communication and interaction with a virtual world, which is capable of conducting voice communication between a user of the virtual world and a person outside the virtual world. The method and the system determine the identity of the person based on the communication information of the person, so as to determine the avatar of the person in the virtual world. In addition, the method and the system can control the avatar to perform corresponding facial expressions and/or actions based on voice data of the person. Further, the method and the system can control the avatar to act or change state according to the user's interaction with the avatar and according to the scene or the activity in the virtual space of the virtual world. The present invention also provides a computer-readable medium for executing the method of the present invention.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100~S700:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="104" publication-number="202624638">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624638</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146822</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>減振結構及電子裝置</chinese-title>
        <english-title>DAMPING STRUCTURE AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">F16F15/02</main-classification>
        <further-classification edition="200601120241231B">G06F1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃心豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HSIN-HAOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳品傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PIN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳伯修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO-HSIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡協良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, HSIEH-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置，包含一機殼、一硬碟、至少一風扇以及至少一減振結構。硬碟設置於機殼內。至少一風扇設置於機殼內。至少一減振結構位於硬碟與至少一風扇之間，並包含至少一固定底座、至少一第一質量塊、至少一第二質量塊以及至少一懸臂。至少一固定底座設置於機殼。至少一第一質量塊之一端設置於固定底座。至少一懸臂銜接於至少一第一質量塊之另一端以及至少一第二質量塊之一端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device includes a casing, a hard disk, at least one fan and at least one damping structure. The hard disk is disposed in the casing. The at least one fan is disposed in the casing. The at least one damping structure is located between the hard disk and the at least one fan, and includes at least one fixed base, at least one first mass block, at least one second mass block and at least one cantilever. The at least one fixed base is disposed on the casing. An end of the at least one first mass block is disposed on the fixed base. The at least one cantilever is connected to another end of the at least one first mass block and an end of the at least one second mass block.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:減振結構</p>
        <p type="p">51:固定底座</p>
        <p type="p">52:第一質量塊</p>
        <p type="p">53:第二質量塊</p>
        <p type="p">54:懸臂</p>
        <p type="p">55:組合件</p>
        <p type="p">56:緊固件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="105" publication-number="202625071">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625071</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146823</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>順路辦理規劃系統及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250303B">G06Q50/40</main-classification>
        <further-classification edition="202401120250303B">G06Q10/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田寶祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>嘉義縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田寶祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種順路辦理規劃系統，包含一第一資訊模組、一第二資訊模組，及一雲端伺服器。該第一資訊模組含有一透過一第一端提供的需求資訊；該第二資訊模組含有一透過一第二端輸入的路徑資訊；該雲端伺服器包括一處理單元，該處理單元包括一儲存模組、一可計算出至少一目的路線的計算模組，及一選定模組。本發明亦提供由前述系統執行的方法。藉由一需求提出步驟將該該資訊模組存入該儲存模組，並在該第二端完成一路程輸入步驟後，該雲端伺服器透過一媒合步驟判定所述需求資訊與所述路徑資訊是否相符並進行配對，藉此達成順路辦理之精準媒合的目的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">A:需求提出步驟</p>
        <p type="p">B:路程輸入步驟</p>
        <p type="p">C:媒合步驟</p>
        <p type="p">D:訂單成立步驟</p>
        <p type="p">E:變現步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="106" publication-number="202624104">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624104</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146824</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>線材供線裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250411B">B65H49/18</main-classification>
        <further-classification edition="200601120250411B">B65H7/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國聯機械實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種線材供線裝置，包含一輸送單元、一作動單元，及一控制單元。該輸送單元沿一第一方向延伸且適用於輸送一線材。該作動單元包括一沿一第二方向延伸且用以沿自身軸線轉動的輥軸，及一沿一第三方向地設置的頂抵機構。該頂抵機構具有一支撐件、一動滾輪，及一定滾輪。該控制單元能切換一正常作業狀態，及一異常排除狀態。在該正常作業狀態時，該控制單元控制該輥軸朝該第一方向轉動且該動滾輪與該定滾輪彼此遠離地間隔排列。當該線材因纏繞不當或是設備長期磨損而致輸送過程卡料時，能藉由該控制單元切換到該異常排除狀態而排除卡料的狀況。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:輸送單元</p>
        <p type="p">2:作動單元</p>
        <p type="p">21:輥軸</p>
        <p type="p">22:頂抵機構</p>
        <p type="p">23:支撐件</p>
        <p type="p">231:結合部</p>
        <p type="p">232:第一銜接段</p>
        <p type="p">233:第二銜接段</p>
        <p type="p">24:動滾輪</p>
        <p type="p">25:定滾輪</p>
        <p type="p">26:致動器</p>
        <p type="p">3:基座</p>
        <p type="p">5:傳感器</p>
        <p type="p">6:切割單元</p>
        <p type="p">7:光學檢測模組</p>
        <p type="p">9:線材</p>
        <p type="p">X:第一方向</p>
        <p type="p">Y:第二方向</p>
        <p type="p">Z:第三方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="107" publication-number="202625206">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625206</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146825</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>內視鏡影像的自動挑選方法及系統</chinese-title>
        <english-title>AN AUTOMATIC SELECTION METHOD AND SYSTEM FOR ENDOSCOPIC IMAGES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250218B">G16H30/40</main-classification>
        <further-classification edition="201801120250218B">G16H50/20</further-classification>
        <further-classification edition="200601120250218B">A61B1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周君諦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, CHUN-TI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳維超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏智斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, CHIH-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃柏瑄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, PO HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭仁柏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, JEN-PO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧秋蓉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHIU-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提出一種內視鏡影像的自動挑選方法及系統。所述方法包括以運算裝置執行的多個步驟，這些步驟包括：取得多個內視鏡影像及對應這些內視鏡影像的多個位置標記，每個位置標記用於指示以內視鏡拍攝一人體器官的一部位，依據這些位置標記從所述多個內視鏡影像中挑選出屬於相同部位的多個候選影像，依據影像顏色或預設病徵進行影像分割以將每個候選影像區分為彼此不重疊的第一區域及第二區域，依據第一區域及第二區域的面積計算一比例，以及輸出比例大於閾值的至少一候選影像作為挑選結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An automatic selection method and system for endoscopic images are proposed. This method includes several steps performed by a computing device, which involve: obtaining multiple endoscopic images and their corresponding position markers, with each marker indicating a specific part of a human organ captured by the endoscope. Based on these position markers, multiple candidate images belonging to the same organ part are selected from the endoscopic images. An image segmentation is performed based on image color or predefined symptoms to divide each candidate image into a first and a second non-overlapping region. A ratio is calculated based on the areas of the first and second regions, and at least one candidate image with a ratio greater than a threshold is outputted as the selection result.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1,S2,S3,S4,S5:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="108" publication-number="202624652">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624652</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146828</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>接頭組件及接頭輔助組件</chinese-title>
        <english-title>JOINT ASSEMBLY AND JOINT AUXILIARY ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">F16L17/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JUN-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種接頭組件及接頭輔助組件。接頭組件包含第一接頭、第二接頭、第一組裝座、組裝柱、彈性元件、彈性環以及第二組裝座。第一組裝座包含第一接頭穿孔及組裝孔。第一接頭沿軸向方向穿設於第一接頭穿孔。組裝柱至少部分地設置於組裝孔中。彈性元件套設於組裝柱。彈性環包含凸部及凹部。凸部及凹部彼此間隔配置。彈性環套設於第二接頭。第二組裝座包含本體部及組裝凸部。本體部透過組裝柱及彈性元件沿軸向方向可活動地設置於第一組裝座。彈性環介於第二接頭及組裝凸部之間，且相對應於組裝凸部的凸部抵頂於組裝凸部的內側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A joint assembly and a joint auxiliary assembly. The joint assembly includes a first joint, a second joint, a first mount, a mounting post, an elastic component, an elastic ring, and a second mount. The first mount has a first through hole and a mounting hole. The first joint is disposed through the first through hole along an axial direction. The mounting post at least partially disposed in the mounting hole. The elastic component is sleeved on the mounting post. The elastic ring includes convex parts and concave parts spaced apart from each other. The elastic ring is sleeved on the second joint. The second mount includes a body part and a mounting protrusion. The body part is movably disposed on the first mount along the axial direction via the mounting post and the elastic component. The elastic ring is located between the second joint and the mounting protrusion, and the convex part corresponding to the mounting protrusion presses against an inner side of the mounting protrusion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:接頭組件</p>
        <p type="p">100:第一接頭</p>
        <p type="p">200:第二接頭</p>
        <p type="p">300:第一組裝座</p>
        <p type="p">350:組裝柱</p>
        <p type="p">400:彈性元件</p>
        <p type="p">450:第二組裝座</p>
        <p type="p">500:彈性環</p>
        <p type="p">501:凸部</p>
        <p type="p">502:凹部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="109" publication-number="202625298">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625298</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146830</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>天線裝置</chinese-title>
        <english-title>ANTENNA DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">H01Q13/10</main-classification>
        <further-classification edition="201501120250303B">H01Q5/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴郁書</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAI, YU SHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭偉晨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, WEI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種天線裝置，包含共振殼、基板、高頻單元及低頻單元。基板設置於共振殼。高頻單元設置於基板，並具有高頻激發槽及高頻匹配槽。低頻單元包含第一低頻體、第二低頻體及第三低頻體。第一低頻體、第二低頻體及第三低頻體位於高頻單元之一側。第二低頻體連接於高頻單元，並與高頻匹配槽相鄰。高頻單元、第一低頻體與第二低頻體共同圍繞第三低頻體。第二低頻體遠離第三低頻體之一側具有一低頻匹配槽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An antenna device includes a resonance casing, a substrate, a high frequency component and a low frequency component. The substrate is disposed on the resonance casing. The high frequency component is disposed on the substrate, and has a high frequency exciting slot and a high frequency matching slot. The low frequency component includes a first low frequency body, a second low frequency body and a third low frequency body. The first low frequency body, the second low frequency body and the third low frequency body are located on a side of the high frequency component. The second low frequency body is connected to the high frequency component, and is adjacent to the high frequency matching slot. The high frequency component, the first low frequency body and the second low frequency body together surround the third low frequency body. A side of the second low frequency body away from the third low frequency body has a low frequency matching slot.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:天線裝置</p>
        <p type="p">11:共振殼</p>
        <p type="p">111:共振腔</p>
        <p type="p">12:基板</p>
        <p type="p">13:高頻單元</p>
        <p type="p">14:低頻單元</p>
        <p type="p">141:第一低頻體</p>
        <p type="p">142:第二低頻體</p>
        <p type="p">143:第三低頻體</p>
        <p type="p">15:饋入部</p>
        <p type="p">L:分隔線</p>
        <p type="p">L1:長度</p>
        <p type="p">W1:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="110" publication-number="202625348">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625348</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146832</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置及抑制升降壓電路雜訊的方法</chinese-title>
        <english-title>ELECTRONIC DEVICE AND METHOD OF SUPPRESSING NOISE GENERATED BY BUCK IC</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200701120241231B">H02M1/44</main-classification>
        <further-classification edition="200601120241231B">H05K1/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江志謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHIH-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置，用以供一升降壓電路設置，並包含一機體、一電路板以及多個抗雜訊電容。電路板設置於機體，並用以供升降壓電路設置。電路板具有一電源層。電源層具有多個電源穿層部。這些抗雜訊電容設置於電源層之至少一側。至少部分這些抗雜訊電容分別位於靠近這些電源穿層部處。至少另一部分這些抗雜訊電容位於遠離這些電源穿層部處。位於遠離這些電源穿層部處之這些抗雜訊電容中任二相鄰者之間的間距用以小於等於升降壓晶片所產生之雜訊的波長之八分之一。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device is configured for a buck IC to be disposed, and includes a machine body, a circuit board and a plurality of anti-noise capacitors. The circuit board is disposed on the machine body, and is configured for the buck IC to be disposed. The circuit board has a power plane. The power plane has a plurality of via portions. The anti-noise capacitors are disposed on at least one side of the power plane. At least a part of the anti-noise capacitors are located close to the via portions. At least another part of the anti-noise capacitors are located away from the via portions. The distance between any two adjacent anti-noise capacitors located away from the via portions is configured to be less than or equal to one-eighth of the wavelength of the noise generated by the buck IC.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電子裝置</p>
        <p type="p">11:機體</p>
        <p type="p">12:電路板</p>
        <p type="p">121:電源層</p>
        <p type="p">1211:電源穿層部</p>
        <p type="p">13:抗雜訊電容</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="111" publication-number="202625364">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625364</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146835</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>評估光電裝置中的陷阱態的方法及系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR ASSESSING TRAP STATES IN OPTOELECTRONIC DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120250704B">H02S50/10</main-classification>
        <further-classification edition="201401120250704B">G01N21/35</further-classification>
        <further-classification edition="200601120250704B">G01J3/28</further-classification>
        <further-classification edition="202501120250704B">H10F10/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商帝國理工學院創新有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMPERIAL COLLEGE INNOVATIONS LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴庫林　阿爾喬姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAKULIN, ARTEM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘嘉欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, JIAXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳梓銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ZIMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種包含幫浦-推送-光電流（PPPc）光譜術的用於評估光電裝置中的陷阱態的方法，以及用於實施該方法的系統。在一態樣中，本發明提供一種用於評估光電裝置中的陷阱態的方法，其包括以下步驟：&lt;br/&gt;i)       提供一光電裝置樣品；&lt;br/&gt;ii)    在該樣品上進行一個或多個幫浦-推送-光電流（PPPc）光譜術測量，其中可見光係作為幫浦源，且紅外線（IR）光作為推送源，所述PPPc測量包括：&lt;br/&gt;a)     將可見光和紅外光的光束合併為共線；&lt;br/&gt;b)    將經合併的光束聚焦在該樣品的某一區域；且&lt;br/&gt;c)     檢測在該樣品中可見光引起的光電流和IR引起的光電流；&lt;br/&gt;其中，所述PPPc測量包括連續波形（CW）-PPPc測量和/或時間解析的PPPc測量，係如下文所述。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to method for assessing trap states in an optoelectronic device comprising Pump-Push-Photocurrent (PPPc) spectroscopy, as well as a system for implementing the method. In one aspect, the present invention provides a method for assessing trap states in an optoelectronic device comprising the following steps:&lt;br/&gt;i) providing an optoelectronic device sample;&lt;br/&gt;ii) performing one or more Pump-Push-Photocurrent (PPPc) spectroscopy measurements on the sample wherein visible light is used as the pump source and infrared (IR) light is used as the push source, said PPPc measurements comprising:&lt;br/&gt;a) combining beams of visible light and IR light to be collinear;&lt;br/&gt;b) focussing the combined beams on an area of the sample; and&lt;br/&gt;c) detecting visible light-induced photocurrents and IR-induced photocurrents in the sample;&lt;br/&gt;wherein the PPPc measurements include continuous waveform (CW)-PPPc measurements and/or time-resolved PPPc measurements, as described herein.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="112" publication-number="202624637">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624637</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146838</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於主動抑制具有地板的結構中多個振動的電腦執行方法、系統以及電腦程式</chinese-title>
        <english-title>COMPUTER IMPLEMENTED METHOD FOR ACTIVE DAMPENING VIBRATIONS IN A STRUCTURE, SYSTEM, AND COMPUTER PROGRAM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">F16F15/00</main-classification>
        <further-classification edition="200601120250303B">E04H9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商馬卡爾知識產權和標準有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MECAL INTELLECTUAL PROPERTY AND STANDARDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴克　伯恩哈德　米哈伊爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAKKER, BERNHARD MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>容曼　亨德里庫斯　阿倫德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNGMAN, HINDERICUS AREND</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露用於主動抑制具有地板的建築結構中多個振動的一種電腦執行方法以及一種系統（1）。電腦執行方法包括在地板（3）上分配具有多個振動感測器（6）及/或多個振動產生器（7）的多個裝置（4）以擷取關於多個振動的多筆資料。在誘發多個初始振動後，擷取關於地板的質量、剛性以及阻尼分布的資料。創建針對地板的質量特性、剛性特性及/或阻尼分布的資料模型（15）。資料模型（15）用於計算對應先前所偵測的多個外部振動之有效的多個反振動，以有效地抑制多個外部振動而允許振動敏感機器部署在地板（3）上。多個實施例進一步揭露本發明所提出的系統（1）與建築物地震保護系統的交互作用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a computer implemented method as well as a system (1) for active dampening vibrations in a building structure having a floor. The method comprises distributing devices (4) vibration transducers (6) and/or vibration generators (7) on the floor (3) capturing data related to vibrations. After inducing initial vibrations, data is captured related to mass, stiffness, and damping distribution. A data model (15) for mass, stiffness, and/or damping properties of the floor is created. The data model (15) is used to calculate effective counter-vibrations corresponding to the previously detected external vibrations to effectively dampen vibrations allowing a deployment of vibration sensitive machinery (8) on said floor (3). Embodiments furthermore disclose an interplay of the proposed system (1) with a building earthquake protection system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:系統</p>
        <p type="p">2:結構</p>
        <p type="p">3:地板</p>
        <p type="p">5:控制單元</p>
        <p type="p">6:振動感測器</p>
        <p type="p">7:振動產生器</p>
        <p type="p">8:機器</p>
        <p type="p">10:質量阻尼器</p>
        <p type="p">11:避震器</p>
        <p type="p">12:地震感測器</p>
        <p type="p">13:地震預警系統</p>
        <p type="p">14:資料模型</p>
        <p type="p">15:地震波</p>
        <p type="p">16:天氣資料庫</p>
        <p type="p">17:交通監控系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="113" publication-number="202625059">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625059</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146839</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>以合購區域整合線上與線下的合購方法</chinese-title>
        <english-title>METHOD FOR INTEGRATING ONLINE AND OFFLINE GROUP BUYING WITHIN A DESIGNATED GROUP BUYING AREA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250922B">G06Q30/0601</main-classification>
        <further-classification edition="202301120250922B">G06Q10/10</further-classification>
        <further-classification edition="201201120250922B">G06Q20/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥易購股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAI YIGO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊國勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, KUO SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇士傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種以合購區域整合線上與線下的合購方法，包含步驟如下，一網路平台以一合購發起者的一經緯度資料為中心點定義一合購區域。網路平台判斷一合購參與者的一經緯度資料是否位在合購區域，是的話，合購參與者能編輯一合購資料建立一合購參與資料。否的話，合購參與者不能編輯合購資料。藉此，能減少時間浪費，以降低人力成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for integrating online and offline group buying within a designated group buying area, comprising the following steps: A network platform defines a group buying area using a set of geographic coordinates (latitude and longitude) from an initiator’s data as the center point of the group buying area. The network platform determines whether the geographic coordinates of the participant’s data fall within the defined group buying area. If the participant is within the area, they are permitted to edit group buying data and create a group buying participation data; If the participant is outside the area, they are not permitted to edit the group buying data. This method reduces time waste and lowers labor costs.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:會員資料建立步驟</p>
        <p type="p">S2:合購區域建立步驟</p>
        <p type="p">S3:合購發起步驟</p>
        <p type="p">S4:合購參與步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="114" publication-number="202624664">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624664</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146841</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>針對除濕裝置的滿水時間預測系統及其控制方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">F24F3/14</main-classification>
        <further-classification edition="201801120241230B">F24F11/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣松下電器股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUSHITA ELECTRIC (TAIWAN) CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李明訓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉志昀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIH-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘鴻立</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪偉峻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張峻堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種針對除濕裝置的滿水時間預測系統及其控制方法，該滿水時間預測系統包含一除濕裝置及一處理裝置，該除濕裝置包括一用於生成一室內溫度值的溫度感測單元、一用於生成一室內濕度值的濕度感測單元、一用於生成一目標濕度值的操作面板、一水箱單元，及一用於生成一水量參考值的水位量測單元。該處理裝置包括一嵌入式機器學習模型，並用於代入該室內溫度值、該室內濕度值、該目標濕度值、一相對應的水位比例值與一相對應的預計除濕水量值至該嵌入式機器學習模型，以生成一滿水時間預測值。本發明藉由生成該滿水時間預測值，以供使用者更彈性地安排自己的時間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:除濕裝置</p>
        <p type="p">11:溫度感測單元</p>
        <p type="p">12:濕度感測單元</p>
        <p type="p">13:操作面板</p>
        <p type="p">14:除濕單元</p>
        <p type="p">15:水箱單元</p>
        <p type="p">16:水位量測單元</p>
        <p type="p">17:控制單元</p>
        <p type="p">2:處理裝置</p>
        <p type="p">21:嵌入式機器學習模型</p>
        <p type="p">22:參數資料庫</p>
        <p type="p">3:應用程式</p>
        <p type="p">9:智慧型裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="115" publication-number="202624028">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624028</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146845</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具自動夾持的氣嘴頭結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250214B">B60C29/06</main-classification>
        <further-classification edition="200601120250214B">F16L37/086</further-classification>
        <further-classification edition="200601120250214B">F16K15/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>創永實業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許龍國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許龍國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許耿禎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明一種具自動夾持的氣嘴頭結構，該氣嘴頭包含：一氣嘴頭本體，一端設有一充氣嘴插孔，外周緣等分設有四容置槽；四活動咬合件，安裝於該氣嘴頭本體的四容置槽內，各該活動咬合件設有一卡齒部，該卡齒部可受控制在一卡制位置與一釋放位置之間的移動，當該四活動咬合件的卡齒部處於卡制位置時，於該充氣嘴插孔內形成一包圍空間；一彈性手段，用以彈抵該四活動咬合件；及一操作手段，用以控制該四活動咬合件的運作；藉以，能夠提升夾持充氣嘴的夾持能力和穩定性，有效避免充氣過程中出現歪斜、漏氣或脫落的問題，並且製作容易，組裝簡便，而可提高生產效率，降低製作成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:氣嘴頭</p>
        <p type="p">10:氣嘴頭本體</p>
        <p type="p">11:充氣嘴插孔</p>
        <p type="p">111:第二螺牙</p>
        <p type="p">12:容置槽</p>
        <p type="p">13:止氣環</p>
        <p type="p">131:止氣卡扣凸部</p>
        <p type="p">14:鎖環</p>
        <p type="p">141:第一螺牙</p>
        <p type="p">15:滑槽</p>
        <p type="p">16:第三螺牙</p>
        <p type="p">17:端蓋</p>
        <p type="p">171:第四螺牙</p>
        <p type="p">18:O型環</p>
        <p type="p">20:擋塊</p>
        <p type="p">21:側擋片</p>
        <p type="p">22:樞槽</p>
        <p type="p">30:活動咬合件</p>
        <p type="p">31:樞軸</p>
        <p type="p">32:連動部</p>
        <p type="p">33:卡齒部</p>
        <p type="p">40:彈性件</p>
        <p type="p">50:外殼</p>
        <p type="p">51:進氣接管</p>
        <p type="p">52:滑桿</p>
        <p type="p">53:連動部</p>
        <p type="p">531:控制部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="116" publication-number="202625498">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625498</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146851</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>燈條區域化系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250303B">H05B45/00</main-classification>
        <further-classification edition="201601120250303B">F21S4/28</further-classification>
        <further-classification edition="200601120250303B">F21S10/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樺緯物聯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳信宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一燈條區域化系統包括一燈條裝置和一控制裝置；該控制裝置具有電性連接一處理單元的一輸入單元、一通訊單元和一記憶單元，該燈條裝置具有電性連接一燈條處理單元的一燈條通訊單元和複數發光單元；該燈條通訊單元和該通訊單元通訊連接，各該發光單元依序排列且具有獨特的一晶片位址；該記憶單元存有的發光模式資料包含各該晶片位址對應的一發光資訊以及一節點位址，對應該節點位址的該發光單元以前的至少一該發光單元與以後的至少一該發光單元係設定為不同燈條區域的該些發光單元，且該些燈條區域的該些發光單元受到控制而各自分區發亮。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:燈條區域化系統</p>
        <p type="p">100:控制裝置</p>
        <p type="p">110:處理單元</p>
        <p type="p">120:通訊單元</p>
        <p type="p">130:記憶單元</p>
        <p type="p">140:輸入單元</p>
        <p type="p">150:顯示單元</p>
        <p type="p">200:燈條裝置</p>
        <p type="p">210:燈條處理單元</p>
        <p type="p">220:燈條通訊單元</p>
        <p type="p">230:發光單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="117" publication-number="202624743">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624743</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146852</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鳥類的飛行數據分析系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250228B">G01N30/88</main-classification>
        <further-classification edition="202301120250228B">G06F18/21</further-classification>
        <further-classification edition="200601120250228B">A01K35/00</further-classification>
        <further-classification edition="200601120250228B">A01K45/00</further-classification>
        <further-classification edition="200601120250228B">G05B19/042</further-classification>
        <further-classification edition="202301120250228B">G06F18/2413</further-classification>
        <further-classification edition="201301120250228B">G01P15/18</further-classification>
        <further-classification edition="200601120250228B">G01D21/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>旻新科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高淑惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鳥類的飛行數據分析系統，包含一紀錄裝置及一處理裝置，該紀錄裝置可拆卸地設置在一鳥類上，以計算並儲存該鳥類在一飛行過程中的多個振翅數值，該處理裝置可電性連接該紀錄裝置，該處理裝置接收該多個振翅數值並根據該多個振翅數值判斷該鳥類在該飛行過程中的多個運動狀態；以該鳥類為一賽鴿為例，鴿主即可瞭解其賽鴿在該飛行過程中呈飛行狀態的比重，進而分析其賽鴿的習性及生理數值以調整其賽鴿於賽前的訓練項目，或者競賽的主辦單位可瞭解賽鴿在競賽過程中的運動狀態，進而判斷賽鴿是否有作弊的情形發生。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:紀錄裝置</p>
        <p type="p">20:處理裝置</p>
        <p type="p">30:顯示器</p>
        <p type="p">S1:振翅數值</p>
        <p type="p">S2:加速度數值</p>
        <p type="p">S3:定位資訊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="118" publication-number="202624766">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624766</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146854</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>測試參數設定系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250512B">G01R31/26</main-classification>
        <further-classification edition="201801120250512B">G06F9/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>欣銓科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗衡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種測試參數設定系統，包含一電腦、一測試應用裝置及一顯示器，該電腦電性連接該測試應用裝置及該顯示器，該電腦讀取複數設定檔中的其中一者作為該測試應用裝置的一設定檔，該測試應用裝置根據該設定檔的複數測試參數進行設定，並根據該複數測試參數的設定結果產生並傳送一回饋資訊至該電腦，使該電腦判斷該回饋資訊是否對應該複數測試參數，當該電腦判斷不對應時，該電腦控制該顯示器顯示一錯誤提示訊息並控制該測試應用裝置停止測試，藉此，節省參數調整過程所需的時間且使該測試應用裝置20能以正確的測試內容進行測試。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電腦</p>
        <p type="p">11:儲存裝置</p>
        <p type="p">20:測試應用裝置</p>
        <p type="p">30:顯示器</p>
        <p type="p">S1:設定檔</p>
        <p type="p">D1:回饋資訊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="119" publication-number="202624754">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624754</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146855</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>探針卡的熱數據量測系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250402B">G01R1/06</main-classification>
        <further-classification edition="202001120250402B">G01R31/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>欣銓科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗衡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種探針卡的熱數據量測系統，包含一測試應用裝置及一電腦，該測試應用裝置包含一探針卡、一晶圓承載盤及一鏡頭，該測試應用裝置執行一預熱流程以加熱該探針卡上的複數探針及該晶圓承載盤上的一晶圓，該電腦電性連接該測試應用裝置且儲存有複數量測排程，並根據該複數量測排程的其中一者中的複數時間點控制該鏡頭移動，使該鏡頭拍攝拍複數探針且該測試應用裝置產生該探針卡於各該時間點的一熱數據，該電腦接收並儲存該探針卡於各該時間點的該熱數據，據此，本發明節省人力量測所需的成本並提升該探針卡的熱數據之量測正確性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:測試應用裝置</p>
        <p type="p">20:電腦</p>
        <p type="p">30:顯示器</p>
        <p type="p">R1:預熱報告</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="120" publication-number="202624582">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624582</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146864</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>假撚機異常預警方法</chinese-title>
        <english-title>FALSE TWISTING MACHINE ABNORMAL WARNING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">D01H13/26</main-classification>
        <further-classification edition="201901120241230B">G06N20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人紡織產業綜合研究所</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN TEXTILE RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴允昱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YUN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃慶堂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHING-TANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">假撚機異常預警方法包含:藉由一假撚機，將複數個參考絲錠轉換為複數個參考絲餅；測量參考絲錠的複數個參考絲線在假撚機中的複數個參考輸入參數組；測量參考絲餅的複數個參考實際良率；依據參考輸入參數組及參考實際良率訓練一機器學習模型；藉由假撚機，將複數個絲錠轉換為複數個絲餅；測量絲錠的複數個絲線在假撚機中的複數個輸入參數組；藉由機器學習模型，依據輸入參數組產生複數個預測良率；以及依據預測良率，決定是否維修假撚機。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A false twisting machine abnormal warning method includes: transforming reference silk spools to reference silk cakes by a false twisting machine; measuring reference input parameter groups of reference silks of the reference silk spools in the false twisting machine; measuring reference actual yield rates of the reference silk cakes; training a machine learning model according to the reference input parameter groups and the reference actual yield rates; transforming the silk spools to the silk cakes by the false twisting machine; measuring input parameter groups of silks of the silk spools in the false twisting machine; generating predicted yield rates according to the input parameter groups; and determining whether to repair the false twisting machine according to the predicted yield rates.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:假撚機異常預警方法</p>
        <p type="p">OP21~OP28:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="121" publication-number="202624861">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624861</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146865</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>背光模組及顯示器</chinese-title>
        <english-title>BACKLIGHT MODULE AND LIQUID CRYSTAL DISPLAY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">G02F1/13357</main-classification>
        <further-classification edition="200601120241231B">G02F1/1333</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡瑞鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, RUEI-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提出一種背光模組及顯示器。背光模組包含框架和光源組件。框架包含底板、側壁、承載板和側牆。側壁連接底板，且自底板以向上的第一方向延伸。承載板連接側壁的頂端，且以遠離頂端的第二方向延伸，並與部分的底板重疊。承載板具有開口。側牆連接頂端，且自頂端以第一方向延伸。側牆與開口相鄰。光源組件設置在底板上，且部分位於由底板、側壁和承載板界定的容置空間內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A backlight module and a liquid crystal display are provided. The backlight module includes a bezel and a light source assembly. The bezel includes a bottom plate, a side plate, a holding plate, and a side wall. The side plate is connected to the base plate and extends upward from the bottom plate in a first direction. The holding plate is attached to a top of the side plate and extends away from the top in a second direction and overlaps the portion of the bottom plate. The holding plate has an opening. The side wall is attached to the top and extends from the top in the first direction. The side wall is adjacent to the opening. The light source assembly is disposed on the bottom plate and the portion of the light source assembly is located in an accommodation space defined by the bottom plate, the side plate, and the holding plate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100A:顯示器</p>
        <p type="p">200:背光模組</p>
        <p type="p">300:顯示面板</p>
        <p type="p">310:下偏光片</p>
        <p type="p">320:上偏光片</p>
        <p type="p">330:第一基板</p>
        <p type="p">331:外引腳接合區</p>
        <p type="p">340:第二基板</p>
        <p type="p">400A:驅動電路板</p>
        <p type="p">410A:接頭</p>
        <p type="p">510A,520A:柔性電路板</p>
        <p type="p">600A:框架</p>
        <p type="p">610:底板</p>
        <p type="p">624:側壁</p>
        <p type="p">630:承載板</p>
        <p type="p">633:開口</p>
        <p type="p">650:側牆</p>
        <p type="p">670:容置空間</p>
        <p type="p">700:光源組件</p>
        <p type="p">710:發光元件</p>
        <p type="p">720:導光板</p>
        <p type="p">721:入光部</p>
        <p type="p">730:光學膜片</p>
        <p type="p">800:遮光膠帶</p>
        <p type="p">L1,L2,L3:高度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="122" publication-number="202624115">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624115</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146867</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具強結合力及回彈性的多層次石墨烯導熱片及其製備方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120241210B">C01B32/194</main-classification>
        <further-classification edition="201901120241210B">B32B7/027</further-classification>
        <further-classification edition="200601120241210B">B32B3/24</further-classification>
        <further-classification edition="200601120241210B">C09K5/14</further-classification>
        <further-classification edition="200601120241210B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華越科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾程睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何崇熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>桃園市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具強結合力及回彈性的多層次石墨烯導熱片，包括：多數的石墨烯薄膜，以一雷射進行打孔，使其形成多數孔徑為0.1mm～1mm的孔洞，而孔洞的孔徑及所佔的表面積，依石墨烯薄膜所要的結合力及回彈性來設定；將打孔後的石墨烯薄膜，以一紫外燈照射處理1～2分鐘，使表面產生親水性官能團；在第一石墨烯薄膜的表面塗佈第一矽膠層; 在第一矽膠層上放置第二石墨烯薄膜；讓第一矽膠層有一部份滲入該第一石墨烯薄膜及第二石墨烯薄膜的孔洞中；重複上述堆疊，得到一橫向石墨烯薄膜與矽膠堆疊體後進行固化，形成一橫向石墨烯薄膜與矽膠複合材料塊；沿著堆疊厚度的方向進行切割，使其形成多數的堆疊狀切片；再將上下端面進行除膠作業，形成一鏤空部後進行石墨烯纖維填補作業，使各石墨烯薄膜之間可相互連結，使其形成一厚度0.15mm～5mm，具強結合力及回彈性的多層次石墨烯導熱片。藉此，石墨烯結合性好，可以承受高壓縮率而不會開裂，從根本上解決習用石墨烯導熱片的開裂問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">40:石墨烯薄膜</p>
        <p type="p">41:孔洞</p>
        <p type="p">40a:第一石墨烯薄膜</p>
        <p type="p">40b:第二石墨烯薄膜</p>
        <p type="p">40n:第n層石墨烯薄膜</p>
        <p type="p">50:矽膠</p>
        <p type="p">51:鏤空部</p>
        <p type="p">50a:第一矽膠層</p>
        <p type="p">50b:第二矽膠層</p>
        <p type="p">70B:立式多層次石墨烯導熱片</p>
        <p type="p">71:石墨烯纖維</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="123" publication-number="202625474">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625474</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146869</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於時槽ALOHA協定整合異質感測器之無線感測裝置及方法</chinese-title>
        <english-title>WIRELESS SENSOR DEVICE AND METHOD FOR INTEGRATING HETEROGENEOUS SENSORS BASED ON SLOTTED ALOHA PROTOCOL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120241231B">H04W24/00</main-classification>
        <further-classification edition="202201120241231B">H04L43/0829</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立高雄師範大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL KAOHSIUNG NORMAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾秀松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TZENG, SHOW-SHIOW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林盈甄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YING-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王聲葦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHENG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種無線感測裝置，包含第一感測器、第二感測器、記憶體及處理器。第一感測器配置以在時槽（slot）內依據第一感測機率感測並產生第一感測資料。第二感測器配置以在時槽內依據第二感測機率感測並產生第二感測資料。記憶體配置以儲存第一感測資料及第二感測資料。處理器耦接記憶體，且配置將第一感測資料及第二感測資料封裝成感測資料封包，並在時槽內傳送感測資料封包至基地台。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wireless sensor network system includes a first sensor, a second sensor, a memory, and a processor. The first sensor is configured to sense and generate first sensing data according to a first sensing probability in a time slot. The second sensor is configured to sense and generate second sensing data according to a second sensing probability in the time slot. The memory is configured to store the first sensing data and the second sensing data. The processor is coupled to the memory and configured to package the first sensing data and the second sensing data into the sensing data packet, and transmit the sensing data packet to a base station in the time slot.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:無線感測網路系統</p>
        <p type="p">120:基地台</p>
        <p type="p">140:無線感測裝置</p>
        <p type="p">142:處理器</p>
        <p type="p">144:通訊單元</p>
        <p type="p">s1:第一感測器</p>
        <p type="p">s2:第二感測器</p>
        <p type="p">sn:第n感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="124" publication-number="202624687">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624687</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146870</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>孔徑量測設備與孔徑量測方法</chinese-title>
        <english-title>HOLE DIAMETER MEASUREMENTAPPARATUS AND HOLE DIAMETER MEASUREMENT METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">G01B5/12</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉義桐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YI-TONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡佳銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHIA-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張晉嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIN-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種孔徑量測設備包含移動平台、量測夾頭裝置以及多個感測器。量測夾頭裝置固定於移動平台上，其中量測夾頭裝置包含多組夾爪模組。夾爪模組中的每一者包含抵靠件以及位移顯示元件。抵靠件設置於夾爪模組遠離移動平台的一端。位移顯示元件設置於夾爪模組鄰近移動平台的一端，多個感測器連接移動平台且分別面對量測夾頭裝置。夾爪模組的抵靠件隨移動平台移動以進入工件的孔洞內。位移顯示元件與抵靠件可相對於參考中心軸徑向移動。感測器配置以量測位移顯示元件的位移。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A hole diameter measurement apparatus includes a transport platform, a measurement chuck device and multiple sensors. The measurement chuck device is fixed on the transport platform. The measurement chuck device includes at least three clamping jaw modules. Each one of the clamping jaw modules includes an against element and a displacement presenting element. The against element is disposed at a side of the clamping jaw modules away from the transport platform. The against element is configured to be pushed into a hole of a working piece along with the transport platform. The displacement presenting element is disposed at a side of the clamping jaw modules close to the transport platform. The sensors connect the transport platform and face the measurement chuck device. The against elements of the clamping jaw modules is configured to move along with the transportation platform into the hole of the working piece. The displacement presenting element and the against element can axially move relative to a reference center axis. The sensors are configured to measure displacement of the displacement sensing elements.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:移動平台</p>
        <p type="p">120A,120B:夾爪模組</p>
        <p type="p">122A,122B:抵靠件</p>
        <p type="p">124A,124B:位移顯示元件</p>
        <p type="p">1242A,1242B:量測表面</p>
        <p type="p">130:感測器</p>
        <p type="p">400:工件</p>
        <p type="p">410:孔洞</p>
        <p type="p">420:內壁</p>
        <p type="p">D1:垂直方向</p>
        <p type="p">AX1,AX2:徑向</p>
        <p type="p">HD:孔徑</p>
        <p type="p">N1:法線方向</p>
        <p type="p">REF:參考中心軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="125" publication-number="202625511">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625511</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146872</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>主機板總成及應用其之可攜式電子裝置</chinese-title>
        <english-title>MOTHERBOARD ASSEMBLY AND PORTABLE ELECTRONIC DEVICE USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250925B">H05K1/02</main-classification>
        <further-classification edition="200601120250925B">H05K5/02</further-classification>
        <further-classification edition="200601120250925B">H05K9/00</further-classification>
        <further-classification edition="200601120250925B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>微星科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICRO-STAR INT'L CO., LIMITED.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商微盟電子（昆山）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MSI ELECTRONICS (KUN SHAN) CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江正雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHENG-HSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝信賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, HSIN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳星宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, XING-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳政大</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種主機板總成，包含主機板本體、電壓調節模組、散熱元件及電源雜訊遮蔽元件。電壓調節模組位於主機板本體的一側緣。散熱元件，位於電壓調節模組上。電源雜訊遮蔽元件包含輻射屏蔽部以及接地部。輻射屏蔽部包含第一遮蔽段及第二遮蔽段，第一遮蔽段與散熱元件的上表面連接，第二遮蔽段與第一遮蔽段連接，遮蔽主機板本體、電壓調節模組、及散熱元件的一側表面。接地部與第二遮蔽段連接。透過電源雜訊遮蔽元件，可以解決電壓調節模組位於主機板本體的側緣產生的板邊輻射問題，符合電磁干擾標準規範，且能夠提升主機板本體上的元件配置裕度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A motherboard assembly includes a motherboard body, a voltage regulation module, a heat dissipation component and a power supply noise shielding component. The voltage regulation module is on one edge of the motherboard body. The heat dissipation component is on the voltage regulation module. The power supply noise shielding component includes a radiation shielding portion and a grounding portion. The radiation shielding portion includes a first shielding section and a second shielding section. The first shielding section is connected to the upper surface of the heat dissipation element. The second shielding section is connected to the first shielding section to shield the motherboard body, the voltage adjustment module, and a side surface of the heat dissipation element. The ground portion is connected to the second shielding section. By using power noise shielding components, the board edge radiation problem caused by the voltage regulation module located on the side edge of the motherboard body can be solved, such that complies with the electromagnetic interference standards, and improves the component configuration margin on the motherboard body.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:主機板本體</p>
        <p type="p">20:電壓調節模組</p>
        <p type="p">30:散熱元件</p>
        <p type="p">35:導熱墊</p>
        <p type="p">41:輻射屏蔽部</p>
        <p type="p">411:第一遮蔽段</p>
        <p type="p">413:第二遮蔽段</p>
        <p type="p">43:接地部</p>
        <p type="p">50:連接件</p>
        <p type="p">L:電壓調節模組的長度</p>
        <p type="p">L3:接地部的長度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="126" publication-number="202625101">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625101</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146873</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>管路缺陷辨識系統及管路缺陷辨識模型訓練方法</chinese-title>
        <english-title>PIPELINE DEFECT IDENTIFICATION SYSTEM AND METHOD FOR TRAINING A PIPELINE DEFECT IDENTIFICATION MODEL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250418B">G06V10/764</main-classification>
        <further-classification edition="202201120250418B">G06V10/44</further-classification>
        <further-classification edition="202201120250418B">G06V10/36</further-classification>
        <further-classification edition="202301120250418B">G06N3/0985</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>淡江大學學校財團法人淡江大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAMKANG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游國忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, KUO-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉怡成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, I-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種管路缺陷辨識系統，包括一儲存單元、一管路缺陷辨識模型、一處理器。管路缺陷辨識模型儲存於儲存單元內，管路缺陷辨識模型包括一第一裂痕辨識模型及一第二裂痕辨識模型，第一裂痕辨識模型及第二裂痕辨識模型分別用以辨識圖片中不同程度的裂痕。處理器以相隔一預設幀數擷取一影像，得到複數待處理圖片，對各待處理圖片進行邊緣偵測，再利用第一裂痕辨識模型及第二裂痕辨識模型進行裂痕辨識，產生一辨識圖片，辨識圖片於裂痕處設有一第一缺陷文字標記。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pipeline defect recognition system comprising a storage unit, a pipeline defect recognition model set, and a processor. The pipeline defect recognition model set is stored in the storage unit and includes a first crack recognition model and a second crack recognition model. The first crack recognition model and the second crack recognition model are respectively used to recognize different degrees of cracks in images. The processor captures an image at intervals of a preset number of frames to obtain multiple pending images, performs edge detection on each pending image, and then uses the first crack recognition model and the second crack recognition model to perform crack recognition, generating a recognized image with a first defect text label at the crack location.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:儲存單元</p>
        <p type="p">20:管路缺陷辨識模型</p>
        <p type="p">21:積水辨識模型</p>
        <p type="p">22:裂痕辨識模型</p>
        <p type="p">221:第一裂痕辨識模型</p>
        <p type="p">222:第二裂痕辨識模型</p>
        <p type="p">23:結垢辨識模型</p>
        <p type="p">24:腐蝕辨識模型</p>
        <p type="p">30:處理器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="127" publication-number="202625174">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625174</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146876</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有資料有效視窗擴展機制的資料接收裝置及方法</chinese-title>
        <english-title>DATA RECEIVING APPARATUS AND METHOD HAVING DATA VALID WINDOW EXPANDING MECHANISM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">G11C7/10</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳世昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHIH-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余俊錡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHUN-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張志偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有資料有效視窗擴展機制的資料接收裝置。資料前處理電路對輸入資料訊號及延遲資料訊號進行及邏輯運算及或邏輯運算，產生及閘處理訊號與或閘處理訊號。取樣電路根據資料閃控訊號的取樣正緣及取樣負緣取樣產生及閘正緣取樣結果、或閘正緣取樣結果、及閘負緣取樣結果與或閘負緣取樣結果，以使正緣選擇電路與負緣選擇電路據以判斷當下正緣取樣結果與負緣取樣結果，進而分別根據當下正緣取樣結果與當下負緣取樣結果控制正緣資料多工器與負緣資料多工器輸出當下正緣資料與當下負緣資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A data pre-processing circuit performs AND and OR logic operations on an input data signal and a delayed data signal to generate an AND gate processed signal and an OR gate processed signal. A sampling circuit performs sampling according to a sampling rising edge and a sampling falling edge of a data strobe signal to generate AND gate rising and falling edge sampling results and OR gate rising and falling edge sampling results such that a rising edge selection circuits and a falling edge selection circuit determine a current rising edge sampling result and a current falling edge sampling result to control a rising edge data multiplexer and a falling edge data multiplexer to output current rising edge data and current falling edge data accordingly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:資料接收裝置</p>
        <p type="p">105:資料前處理電路</p>
        <p type="p">110:取樣電路</p>
        <p type="p">115:資料相位狀態儲存電路</p>
        <p type="p">120:正緣資料多工器</p>
        <p type="p">125:負緣資料多工器</p>
        <p type="p">130:資料後段正緣資料多工器</p>
        <p type="p">135:資料後段負緣資料多工器</p>
        <p type="p">140:正緣選擇電路</p>
        <p type="p">145:負緣選擇電路</p>
        <p type="p">CAN:及閘負緣取樣結果</p>
        <p type="p">CAP:及閘正緣取樣結果</p>
        <p type="p">CON:或閘負緣取樣結果</p>
        <p type="p">COP:或閘正緣取樣結果</p>
        <p type="p">DAN:及閘處理訊號</p>
        <p type="p">DGN:資料後段負緣資料</p>
        <p type="p">DGP:資料後段正緣資料</p>
        <p type="p">DLN:資料前段負緣資料</p>
        <p type="p">DLP:資料前段正緣資料</p>
        <p type="p">DOR:或閘處理訊號</p>
        <p type="p">DPN:負緣資料相位狀態</p>
        <p type="p">DPP:正緣資料相位狀態</p>
        <p type="p">DQ:輸入資料訊號</p>
        <p type="p">DQN:當下負緣資料</p>
        <p type="p">DQP:當下正緣資料</p>
        <p type="p">DQS:資料閃控訊號</p>
        <p type="p">GAN:資料後段及閘負緣取樣結果</p>
        <p type="p">GAP:資料後段及閘正緣取樣結果</p>
        <p type="p">GON:資料後段或閘負緣取樣結果</p>
        <p type="p">GOP:資料後段或閘正緣取樣結果</p>
        <p type="p">SPN:先前負緣取樣結果</p>
        <p type="p">SPP:先前正緣取樣結果</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="128" publication-number="202624960">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624960</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146879</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>控制電路、微控制器及控制方法</chinese-title>
        <english-title>CONTROL CIRCUIT, MICRO-CONTROLLER AND CONTROL METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250425B">G06F11/30</main-classification>
        <further-classification edition="200601120250425B">G06F13/20</further-classification>
        <further-classification edition="200601120250425B">G06F13/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新唐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳奇峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHI-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種控制電路，包括一偵測電路、一取樣電路以及一運算電路。偵測電路收集一外部資訊，用以產生一偵測信號。取樣電路具有一取樣頻率，並取樣偵測信號，用以產生一取樣信號。運算電路將取樣信號輸入一推論模型，用以產生一推論結果，並根據推論結果，判斷一預設條件是否被滿足。當預設條件被滿足時，運算電路調整取樣頻率，由一第一預設值調整至一第二預設值。當預設條件未被滿足時，運算電路維持取樣頻率於第一預設值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A control circuit including a detection circuit, a sampling circuit, and an calculation circuit is provided. The detection circuit collects external information to generate a detection signal. The sampling circuit has a sample frequency and samples the detection signal to generate a sampled signal. The calculation circuit inputs the sampled signal to an inference result and determines whether a predetermined condition is satisfied. When the predetermined condition is satisfied, the calculation circuit adjusts the sample frequency from a first value to a second value. When the predetermined condition is not satisfied, the calculation circuit maintains the sample frequency to the first value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:控制電路</p>
        <p type="p">210:偵測電路</p>
        <p type="p">211:感測器</p>
        <p type="p">220:取樣電路</p>
        <p type="p">221:次取樣電路</p>
        <p type="p">230:運算電路</p>
        <p type="p">SD1:偵測信號</p>
        <p type="p">RA1:取樣頻率</p>
        <p type="p">SS1:取樣信號</p>
        <p type="p">MD:推論模型</p>
        <p type="p">IR:推論結果</p>
        <p type="p">SC:控制信號</p>
        <p type="p">231、250、260:儲存電路</p>
        <p type="p">232:判斷電路</p>
        <p type="p">240:多工器</p>
        <p type="p">PG1、PG2:參數組</p>
        <p type="p">IN1:外部資訊</p>
        <p type="p">SO1:輸出信號</p>
        <p type="p">SWU:喚醒信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="129" publication-number="202623788">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623788</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146890</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>經皮吸收貼片及其製備方法</chinese-title>
        <english-title>TRANSDERMAL PATCH AND PREPARATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">A61K9/70</main-classification>
        <further-classification edition="200601120250501B">A61M37/00</further-classification>
        <further-classification edition="200601120250501B">A61L15/12</further-classification>
        <further-classification edition="200601120250501B">A61L15/58</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>得生製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEH SENG PHARMACEUTICAL MFG, CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, SHIH-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冠賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇建太</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種經皮吸收貼片，包含：一背膜層；一第一含藥之黏著劑層，包含一第一尼古丁或其藥學上可接受的鹽類及一第一黏著劑；一第二含藥之黏著劑層，包含一第二尼古丁或其藥學上可接受的鹽類及一第二黏著劑；以及一離型層；其中，該第一含藥之黏著劑層和該第二含藥之黏著劑層位於該背膜層與該離型層之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A transdermal patch is provided, which comprises: a backing layer; a first drug-containing adhesive layer comprising a first nicotine or a pharmaceutically acceptable salt thereof and a first adhesive; a second drug-containing adhesive layer comprising a second nicotine or a pharmaceutically acceptable salt thereof and a second adhesive; and a release liner; wherein the first drug-containing adhesive layer and the second drug-containing adhesive layer is disposed between the backing layer and the release liner.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="130" publication-number="202624982">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624982</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146893</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>活動資訊整合方法以及電腦程式產品</chinese-title>
        <english-title>METHOD FOR INTEGRATING ACTIVITY INFORMATION AND COMPUTER PROGRAM PRODUCT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250117B">G06F16/24</main-classification>
        <further-classification edition="201901120250117B">G06N20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡議元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, I-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹淩帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAO, LING-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YEN-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種活動資訊整合方法，包括：由電腦系統的處理單元，取得餐廳或景點的搜尋列表；由處理單元，使用訓練完成的AI(人工智慧)模型，以執行：(i)從搜尋列表中的各連結的網頁中，找出餐廳的官網、或景點的地方政府官網；(ii)從官網中、或述地方政府官網中，找出餐廳、或景點的所有活動資訊、和起迄時間；由處理單元依據日期整理活動資訊，以篩選出在既定期間內的推廣活動；由處理單元，透過搜尋工具，取得在既定期間內對餐廳、或景點的評價資訊；由處理單元將評價資訊與推廣活動，添加至搜尋列表中的每一個連結；以及，顯示搜尋列表的連結。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for integrating activity information includes: obtaining a search list of restaurant or attraction through a search tool performed by a processing unit of a computer system; using a trained AI model by the processing unit to execute the operations of (i) finding official website of the restaurant or government website of the attraction from the links of the search list, and (ii) finding the activity information and start-and-end time of the activity of the restaurant or attraction; filtering out the promotion activity by the processing unit according to the date of the activity; obtaining evaluation information of the restaurant or attraction during a specific period through the search tool; attaching the evaluation information and the promotion activity to each link of the search list; and displaying the links of the search list.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S201~S214:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="131" publication-number="202625104">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625104</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146894</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有混合式深度學習手掌融合模型的手掌影像驗證方法</chinese-title>
        <english-title>PALM IMAGE VERIFICATION METHOD HAVING HYBRID DEEP LEARNING PALM FUSION MODEL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250303B">G06V10/80</main-classification>
        <further-classification edition="202301120250303B">G06F18/25</further-classification>
        <further-classification edition="202201120250303B">G06V40/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人亞洲大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASIA UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪西進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORNG, SHI-JINN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武　亭忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VU, DINH-TRUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種具有混合式深度學習手掌融合模型的手掌影像驗證方法，其包含以下步驟：通過影像擷取裝置取得手掌可見光影像，進行手掌感興趣區域偵測程序，提取手掌感興趣區域影像；進行通道提取程序，取得手掌在各個通道的影像；進行影像強化程序，取得強化影像；執行混合式深度學習手掌融合模型，提取各通道的特徵向量；存取儲存手掌特徵向量，結合各通道的特徵向量計算各通道的特徵分數，並依據通道權重進行融合以取得通道融合分數；比對通道融合分數與預設閾值，若比對結果相符，判斷為驗證成功，若比對結果不符，判斷為驗證失敗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A palm image verification method having hybrid deep learning palm fusion model is disclosed. The method includes the following steps: obtaining a visible light palm image by an image capture device and conducting a palm region of interest detection process to extract a palm region of interest image; conducting a channel extraction process to obtain palm images in each channel; conducting an image enhancement process to obtain enhanced images; executing the hybrid deep learning palm fusion model to extract feature vectors of each channel; accessing stored palm feature vectors and combining with the feature vectors of each channel to calculate feature scores of each channel and conducting a fusion process to obtain channel fusion score based on the channel weight; compare the channel fusion score with the preset threshold value. If the comparison results match, the verification is successful; if the comparison results are inconsistent, the verification fails.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S8:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="132" publication-number="202625469">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625469</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146900</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連線驗證方法以及應用此方法的路由器</chinese-title>
        <english-title>METHOD FOR WIRELESS CONNECTION VERIFICATION AND ROUTER USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120250303B">H04W12/06</main-classification>
        <further-classification edition="202101120250303B">H04W12/08</further-classification>
        <further-classification edition="202101120250303B">H04W12/69</further-classification>
        <further-classification edition="202201120250303B">H04L9/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚勝雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, SHENG-HSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹淩帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAO, LING-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種連線驗證方法，適用於路由器的無密碼訪客驗證，包括：確認有一至多個訪客裝置要無線連入路由器；由前述路由器判斷前述訪客裝置的媒體存取控制位址(MAC Address)是否在永久白名單、或黑名單中；當前述訪客裝置的媒體存取控制位址，不在前述永久白名單及前述黑名單時，確定前述路由器是否已啟動自由加入期間；當前述路由器已啟動前述自由加入期間時，前述路由器將前述訪客裝置的媒體存取控制位址加入至臨時白名單中，並且設定前述訪客裝置可連線的期限；以及，前述路由器准許前述訪客裝置與其連線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method is provided for a router to carry out verification for guest users to access the router without using password. The method includes determining one or more guest devices to access the router; determining whether the MAC address of the guest device is in a permanent whitelist or a blacklist; determining whether the router has activated a free-to-join period when the MAC address of the guest device is not in the permanent whitelist and the blacklist; by the router, joining the MAC address of the guest device to a temporary whitelist and setting an expired time that the guest device can access the router when the router has activated the free-to-join period; and by the router, allowing the guest device to access the router.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S41~S49,S49a~s49c:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="133" publication-number="202625645">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625645</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146901</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250414B">H10H29/80</main-classification>
        <further-classification edition="202501120250414B">H10H20/83</further-classification>
        <further-classification edition="202501120250414B">H10H29/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝家銓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHIA-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置，包括驅動背板以及發光二極體。驅動背板包括承載基底、絕緣結構、第一電性連接材料、第二電性連接材料、第一焊料以及第二焊料。絕緣結構設置於承載基底上，且具有第一凹槽與第二凹槽。第一電性連接材料位於第一凹槽。第二電性連接材料位於第二凹槽。第一焊料位於第一電性連接材料上。第二焊料位於第二電性連接材料上。發光二極體包括第一電極以及第二電極。第一電極接合於第一焊料。第二電極接合於第二焊料。在平行於承載基底表面的方向上，第一電極與第二電極重疊於絕緣結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device includes a driving backplane and a plurality of light emitting diodes. The driving backplane includes a carrying base, an insulating structure, a first electrical connection material, a second electrical connection material, a first solder and a second solder. The insulating structure is disposed on the carrying base and has a first groove and a second groove. The first electrical connection material is located in the first groove. The second electrical connection material is located in the second groove. The first solder is located on the first electrical connection material. The second solder is located on the second electrical connection material. The light-emitting diode includes a first electrode and a second electrode. The first electrode is bonded to the first solder. The second electrode is bonded to the second solder. In a direction parallel to the surface of the carrying substrate, the first electrode and the second electrode overlap the insulating structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:顯示裝置</p>
        <p type="p">100:發光二極體</p>
        <p type="p">110:第一電極</p>
        <p type="p">120:第二電極</p>
        <p type="p">200:驅動背板</p>
        <p type="p">210:承載基底</p>
        <p type="p">220:絕緣結構</p>
        <p type="p">221:第一凹槽</p>
        <p type="p">222:第二凹槽</p>
        <p type="p">230:第一電性連接材料</p>
        <p type="p">240:第二電性連接材料</p>
        <p type="p">250:第一焊料</p>
        <p type="p">260:第二焊料</p>
        <p type="p">D1:距離</p>
        <p type="p">D2:距離</p>
        <p type="p">G1:間隙</p>
        <p type="p">H1:高度</p>
        <p type="p">H2:高度</p>
        <p type="p">H3:高度</p>
        <p type="p">W1:第一擋牆</p>
        <p type="p">W12:外側</p>
        <p type="p">W2:第二擋牆</p>
        <p type="p">W22:外側</p>
        <p type="p">X、Y、Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="134" publication-number="202625151">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625151</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146902</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置及其顯示亮度調整方法</chinese-title>
        <english-title>DISPLAY DEVICE AND DISPLAY BRIGHTNESS ADJUSTMENT METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250120B">G09G5/10</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華碩電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASUSTEK COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊志賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIH-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置及其顯示亮度調整方法。依據光感測信號判斷顯示裝置位於室內或室外，並於判斷顯示裝置位於室外時，依據公式對應室內顯示亮度調整顯示裝置的顯示亮度，其中公式包含室外顯示亮度調整範圍與室內顯示亮度調整範圍的比例。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device and a display brightness adjustment method thereof are provided. Determine whether the display device is located indoors or outdoors based on a light sensing signal, and when it is determined that the display device is located outdoors, adjust a display brightness of the display device corresponding to an indoor brightness based on a formula, the formula includes a ratio of an outdoor display brightness adjustment range to an indoor display brightness adjustment range.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示裝置</p>
        <p type="p">102:光感測器</p>
        <p type="p">104:控制電路</p>
        <p type="p">106:顯示面板</p>
        <p type="p">108:儲存電路</p>
        <p type="p">S1:光感測信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="135" publication-number="202625632">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625632</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146903</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光電半導體元件</chinese-title>
        <english-title>OPTOELECTRONIC SEMICONDUCTOR ELEMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10H20/814</main-classification>
        <further-classification edition="202501120250102B">H10H20/824</further-classification>
        <further-classification edition="202501120250102B">H10H20/855</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉學興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HSUEH-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光電半導體元件，包括依序堆疊的基板、第一N型布拉格反射鏡、N型氮化鎵層、穿隧接面層、P型氮化鎵層、發光層和第二N型布拉格反射鏡。第一N型布拉格反射鏡具有第一反射率，第二N型布拉格反射鏡具有第二反射率，且第一反射率和第二反射率皆大於等於90%，且第一反射率不同於第二反射率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optoelectronic semiconductor element, including a sequentially stacked a substrate, a first N-type Bragg reflector, an N-type gallium nitride layer, a tunnel junction layer, a P-type gallium nitride layer, a light emitting layer and a second N-type Bragg reflector mirror. The first N-type Bragg reflector has a first reflectivity, the second N-type Bragg reflector has a second reflectivity, and both the first reflectivity and the second reflectivity are greater than or equal to 90%, and the first reflectivity is different from the second reflectivity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10A:光電半導體元件</p>
        <p type="p">100:基板</p>
        <p type="p">101:第一電極</p>
        <p type="p">102:第二電極</p>
        <p type="p">110A:第一N型布拉格反射鏡</p>
        <p type="p">110B:第二N型布拉格反射鏡</p>
        <p type="p">120:N型氮化鎵層</p>
        <p type="p">130:穿隧接面層</p>
        <p type="p">140:P型氮化鎵層</p>
        <p type="p">150:發光層</p>
        <p type="p">160:第二接觸層</p>
        <p type="p">170:第一接觸層</p>
        <p type="p">LB1:第一光束</p>
        <p type="p">LB2:第二光束</p>
        <p type="p">PO:孔洞</p>
        <p type="p">Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="136" publication-number="202624030">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624030</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146913</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>油箱蓋及進油裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">B60K15/05</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巨鎧精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COPLUS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳柏樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, PO-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種進油裝置，包含一油管接頭，及一油箱蓋。該油管接頭包括兩個突設在內周面的卡抵件。每一該卡抵件具有一向下突伸的卡塊。該油箱蓋可取下地安裝在該油管接頭，並包括一第一突出部，及兩個自該第一突出部外周側相背往外突伸的第二突出部。每一該第二突出部具有沿周緣方向相間隔的一第一卡槽與一第二卡槽。藉由該等第二突出部的結構設計，可使該油箱蓋以該等第一卡槽分別卡抵於該等卡塊，當該油箱蓋的該等第一卡槽因車輛行駛震動而發生相對該油管接頭旋轉位移而脫離該等卡塊時，會再以該等第二卡槽分別與該等卡塊嵌卡，而有多一層保護。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:油管</p>
        <p type="p">2:油管接頭</p>
        <p type="p">20:本體</p>
        <p type="p">21:筒壁</p>
        <p type="p">210:入口段</p>
        <p type="p">22:卡抵件</p>
        <p type="p">221:擋止塊</p>
        <p type="p">222:導引條</p>
        <p type="p">223:卡塊</p>
        <p type="p">23:入口槽</p>
        <p type="p">3:油箱蓋</p>
        <p type="p">31:握持件</p>
        <p type="p">32:第一突出部</p>
        <p type="p">33:第二突出部</p>
        <p type="p">331:迫緊面</p>
        <p type="p">332:第一卡槽</p>
        <p type="p">333:第二卡槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="137" publication-number="202623959">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623959</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146919</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙頭棘輪工具</chinese-title>
        <english-title>DOUBLE HEAD RATCHET TOOL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250305B">B25B13/46</main-classification>
        <further-classification edition="200601120250305B">B25B23/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張永宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YUNG TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張永宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YUNG TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種雙頭棘輪工具，其包括：一本體、一第一驅動頭與一第二驅動頭。該本體包含有相對的一第一端部與一第二端部；該第一驅動頭包含有一第一座體與一第一棘輪，該第一座體以一第一擺動軸為軸擺動地設於該第一端部，該第一棘輪以一第一旋轉軸為中心可轉動地設於該座體，該第一旋轉軸與該第一擺動軸呈相交配置；該第二驅動頭包含有一第二座體與一第二棘輪，該第二座體以一第二擺動軸為軸擺動地設於該第二端部，該第二擺動軸與該第一擺動軸呈橫向配置，該第二棘輪以一第二旋轉軸為中心可轉動地設於該第二座體，該第二旋轉軸與該第二擺動軸呈不相交配置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a double-head ratchet tool, which includes: a body, a first driving head and a second driving head. The body includes a first end and a second end opposite to each other. The first driving head includes a first base body and a first ratchet wheel. The first base body is swingably mounted on the first end with a first swing axis as an axis. The first ratchet wheel is rotatably mounted on the base body with a first rotation axis as the center, and the first rotation axis and the first swing axis are arranged at an intersection. The second driving head includes a second base body and a second ratchet wheel. The second base body is swingably provided at the second end with a second swing axis as an axis. The second swing axis and the first swing axis are arranged transversely, The second ratchet wheel is rotatably mounted on the second base body with a second rotation axis as the center, and the second rotation axis and the second swing axis are arranged non-intersectingly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:本體</p>
        <p type="p">2:第一驅動頭</p>
        <p type="p">3:第二驅動頭</p>
        <p type="p">81:第一擺動軸</p>
        <p type="p">82:第二擺動軸</p>
        <p type="p">91:第一旋轉軸</p>
        <p type="p">92:第二旋轉軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="138" publication-number="202623960">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623960</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146920</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>棘輪扳手</chinese-title>
        <english-title>RATCHET WRENCH</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250305B">B25B13/46</main-classification>
        <further-classification edition="200601120250305B">B25B23/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張永宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YUNG TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張永宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YUNG TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種棘輪扳手，其包括：一本體、一第一工作頭、一插桿、二轉接頭及一驅動頭。該第一工作頭包含有一第一座體與一第一棘輪，該第一座體設於該本體之一端，該第一棘輪以一第一旋轉軸為中心可轉動地設於該第一座體。該插桿可分離地沿該第一旋轉軸插接於該第一棘輪而成同轉動關係。該二轉接頭分別可拆卸地組接於該插桿凸出於該第一工作頭之相對二側，且當該插桿未插接於該第一棘輪時，各該轉接頭可沿該第一旋轉軸插接於該第一棘輪而成同轉動關係。該驅動頭設於該本體之另一端以供組接待旋動件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a ratchet wrench, which includes: a body, a first working head, an insertion rod, two adapters and a driving head. The first working head includes a first base body and a first ratchet wheel. The first base is located at one end of the body. The first ratchet wheel is rotatably mounted on the first base with a first rotation axis as the center. The insertion rod is detachably inserted into the first ratchet wheel along the first rotation axis to form a rotational relationship. The two adapters are detachably assembled to the insertion rod protruding from the two opposite sides of the first working head. When the insertion rod is not inserted into the first ratchet wheel, each of the adapters can be inserted into the first ratchet wheel along the first rotation axis to form a synchronous rotation relationship. The driving head is located at the other end of the body for assembly and reception of the rotating member.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:本體</p>
        <p type="p">2:第一工作頭</p>
        <p type="p">3:第二工作頭</p>
        <p type="p">4:插桿</p>
        <p type="p">5:轉接頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="139" publication-number="202623983">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623983</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146921</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>模具裝置</chinese-title>
        <english-title>MOLD DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250124B">B29C45/27</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>成鎂開發企業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANCE MATE DEVELOP INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林忠献</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, ZHONG-XIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種模具裝置，包括：一承板，其設有複數容孔；及複數灌嘴，該複數灌嘴設於該複數容孔，各該灌嘴包括一頭部、一身部及貫設該頭部及該身部之貫孔，該頭部設有一第一環抵部，各該容孔設有一第二環抵部，該第一環抵部之一徑向截面與該第二環抵部之一徑向截面相異且彼此之間形成複數間隙；藉此，可提高各該灌嘴的使用壽命。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A mold device is provided, including: a load board, having a plurality of receiving holes; and a plurality of nozzles, the plurality of nozzles received within the plurality of receiving holes, each nozzle including a head portion, a body portion and a through hole disposed though the head portion and the body portion, the head portion having a first annular abutment portion, each receiving holes having a second annular abutment portion, a radial cross-section of the first annular abutment portion and a radial cross-section of the second annular abutment portion being different from each other and forming a plurality of gaps therebetween; therefore, a life span of each nozzle can be increased.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:模具裝置</p>
        <p type="p">10:承板</p>
        <p type="p">80:熱流板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="140" publication-number="202623984">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623984</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146922</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>模具裝置</chinese-title>
        <english-title>MOLD DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">B29C45/27</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>成鎂開發企業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANCE MATE DEVELOP INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林忠献</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, ZHONG-XIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種模具裝置，包括：二模組，各該模組包括一模殼及一模仁，該模仁設於該模殼且彼此之間形成一空間，該二模仁可移動地相抵靠；及複數間隔單元，該複數間隔單元設於各該模組之該空間且隔開該模殼及該模仁，該複數間隔單元之間形成複數空隙。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A mold device, including: two modules, each module includes a base plate and a mold core, the mold core disposed on the base plate and formed a space therebetween, the two mold cores movably abutted against each other; and a plurality of spacing units, the plurality of spacing units disposed within the spaces and separated the base plate and the mold core, the plurality of spacing units formed a plurality of gaps therebetween.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:模具裝置</p>
        <p type="p">10:模組</p>
        <p type="p">11:模殼</p>
        <p type="p">12:模仁</p>
        <p type="p">18:溫控管路</p>
        <p type="p">20:間隔單元</p>
        <p type="p">50:溫控裝置</p>
        <p type="p">60:導引結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="141" publication-number="202625587">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625587</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146931</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>薄膜電晶體、畫素結構及薄膜電晶體的製造方法</chinese-title>
        <english-title>THIN FILM TRANSISTOR, PIXEL STRUCTURE AND METHOD FOR MANUFACTURING THIN FILM TRANSISTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250304B">H10D30/67</main-classification>
        <further-classification edition="202501120250304B">H10H29/37</further-classification>
        <further-classification edition="202501120250304B">H10D30/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江丞偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, CHENG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種薄膜電晶體，包括、基板、閘極、半導體層和閘極絕緣層。閘極設置在基板上具有頂面和側面。半導體層設置在基板上，包括汲極區、通道區和源極區，且閘極重疊通道區。閘極絕緣層設置在半導體層和閘極之間，閘極絕緣層的上表面輪廓具有依序排列的第一面、第二面、第三面及第四面以形成凹槽。第一面重疊於頂面，第二面和第三面重疊於側面，第四面重疊於基板。閘極絕緣層在第一面的厚度小於第二面的厚度，且閘極絕緣層的厚度從第三面處往第四面處遞增。亦提供一種畫素結構和薄膜電晶體的製造方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A thin film transistor includes a substrate, a gate, a semiconductor layer and a gate insulating layer. The gate is disposed on the substrate and has a top surface and side surface. The semiconductor layer is disposed on the substrate and includes a drain region, a channel region and a source region, and the gate overlaps the channel region. The gate insulating layer is disposed between the semiconductor layer and the gate. An upper surface contour of the gate insulating layer has a first surface, a second surface, a third surface and a fourth surface disposed in sequence to form a groove. The first surface overlaps the top surface, the second surface and third surface overlap the side surface, and the fourth surface overlaps the substrate. A thickness of the gate insulating layer on the first surface is smaller than a thickness on the second surface, and a thickness of the gate insulating layer increases from the third surface to the fourth surface. A pixel structure and a method for manufacturing the thin film transistor are also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110A:第一閘極</p>
        <p type="p">111A:頂面</p>
        <p type="p">112A:側面</p>
        <p type="p">120A:第一半導體層</p>
        <p type="p">120B:第二半導體層</p>
        <p type="p">130A:第一閘極絕緣層</p>
        <p type="p">131A:第一子層</p>
        <p type="p">132A:第二子層</p>
        <p type="p">140:緩衝層</p>
        <p type="p">150:絕緣層</p>
        <p type="p">CA:凹陷結構</p>
        <p type="p">D1,D2,D3,D4,D110,D120,D132,D150:厚度</p>
        <p type="p">DG:深度</p>
        <p type="p">exL:延伸平面</p>
        <p type="p">F1:第一面</p>
        <p type="p">F2:第二面</p>
        <p type="p">F3:第三面</p>
        <p type="p">F4:第四面</p>
        <p type="p">GR1:凹槽</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="142" publication-number="202623969">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623969</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146932</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>物件重量檢知結構及其整合系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251105B">B25J3/04</main-classification>
        <further-classification edition="200601120251105B">G01G3/13</further-classification>
        <further-classification edition="200601120251105B">G05B13/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聖杰國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANJET INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張慶三</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖鉦達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種物件重量檢知結構及其整合系統，係通過該物件重量檢知結構檢知一待測物件的重量，再經過一處理器依據所測得的該待測物件的重量值，經過分析判斷之後，自動調整一搬運裝置的運作參數，以使該搬運裝置能以適當的功率輸出及適當的速度來執行搬運程序，據以確保搬運過程的順暢及效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:物件重量檢知結構</p>
        <p type="p">10:基座</p>
        <p type="p">20:承載盤</p>
        <p type="p">32:檢知器</p>
        <p type="p">33:軸承座</p>
        <p type="p">200:搬運裝置</p>
        <p type="p">201:基台</p>
        <p type="p">202:舉升單元</p>
        <p type="p">202a:支臂</p>
        <p type="p">202b:活動關節</p>
        <p type="p">202c:抓取件</p>
        <p type="p">203:馬達</p>
        <p type="p">300:處理器</p>
        <p type="p">A:待測物件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="143" publication-number="202624937">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624937</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146936</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>避免外灌電壓測試誤判的驅動電路、方法及顯示觸控驅動晶片</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">G06F3/041</main-classification>
        <further-classification edition="200601120250303B">G01R31/28</further-classification>
        <further-classification edition="200601120250303B">H03K17/94</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商格科微電子（上海）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>段陸強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣昕佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種避免外灌電壓測試誤判的驅動電路、方法及顯示觸控驅動晶片，所述驅動電路包括：類比數位轉換模組，用於觸控感測電壓信號的模數轉換；開關模組，用於驅動電路在承受外灌電壓測試時，避免模數轉換模組的第一輸入端和第二輸入端之間形成直流通路。本發明解決了在對TDDI晶片進行外灌電壓測試時存在的誤判問題，提高晶片測試的準確性和良率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="144" publication-number="202624653">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624653</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146943</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>組合式安裝裝置</chinese-title>
        <english-title>COMBINED MOUNTING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250218B">F16M11/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>研華股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANTECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李俊賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHUN HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱奕璿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, I-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種組合式安裝裝置包含一安裝支架、一第一功能支架及多個第一緊固單元。該第一功能支架通過該等第一緊固單元可拆卸地組裝固定於該安裝支架。該組合式安裝裝置藉由該第一功能支架能通過該等第一緊固單元可拆卸地組裝固定於該安裝支架，使得使用者能通過該安裝支架及該第一功能支架安裝不同的構件並應用於不同的環境。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A combined mounting device includes a mounting bracket, a first functional bracket, and first fastening units. The first functional bracket is detachably assembled and fixed to the mounting bracket through the first fastening units. The combined mounting device is detachably assembled to the mounting bracket through the first fastening units, so that a user can mount different components through the mounting bracket and the first functional bracket and apply to different environments.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:組合式安裝裝置</p>
        <p type="p">1:安裝支架</p>
        <p type="p">11:安裝板</p>
        <p type="p">111:第二安裝孔</p>
        <p type="p">112:第三安裝孔</p>
        <p type="p">114:卡扣孔部</p>
        <p type="p">115:通孔部</p>
        <p type="p">12:凹陷板</p>
        <p type="p">121:第一安裝孔</p>
        <p type="p">2:第一功能支架</p>
        <p type="p">21:支架體</p>
        <p type="p">211:側孔</p>
        <p type="p">22:束帶</p>
        <p type="p">3:第一緊固單元</p>
        <p type="p">X:左右方向</p>
        <p type="p">Y:上下方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="145" publication-number="202624234">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624234</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146944</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電洞傳輸材</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241217B">C07D495/04</main-classification>
        <further-classification edition="202301120241217B">H10K30/85</further-classification>
        <further-classification edition="202301120241217B">H10K85/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東吳大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有式I所示的結構的電洞傳輸材，式I中的R        &lt;sub&gt;1&lt;/sub&gt;至R        &lt;sub&gt;4&lt;/sub&gt;各自獨立地選自於        &lt;img align="absmiddle" height="97px" width="99px" file="ed10040.JPG" alt="ed10040.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;、        &lt;img align="absmiddle" height="98px" width="101px" file="ed10041.JPG" alt="ed10041.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;、        &lt;img align="absmiddle" height="99px" width="122px" file="ed10042.JPG" alt="ed10042.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;或        &lt;img align="absmiddle" height="101px" width="118px" file="ed10043.JPG" alt="ed10043.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。該電洞傳輸材本身具有良好的電洞遷移率，並有優異的疏水性而不易對鈣鈦礦層的結構穩定性乃至鈣鈦礦太陽能電池的使用壽命造成不良影響。該電洞傳輸材可單獨作為鈣鈦礦太陽能電池的電洞傳輸層，且讓鈣鈦礦太陽能電池具有良好的光電轉換效率。        &lt;br/&gt;&lt;img align="absmiddle" height="264px" width="455px" file="ed10044.JPG" alt="ed10044.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="146" publication-number="202625690">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625690</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146945</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體元件及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICES AND FABRICATION METHODS THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P14/69</main-classification>
        <further-classification edition="202301120260302B">H10N97/00</further-classification>
        <further-classification edition="202601120260302B">H10W72/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>世界先進積體電路股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張正平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHENG-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳永祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YUNG-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李建輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHIEN-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巫建勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIEN-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體元件，包括基底、薄膜電阻、導線結構以及保護層。薄膜電阻設置於基底之上，具有第一末端和第二末端。導線結構設置於基底之上，包括導電層堆疊於蝕刻停止層上，蝕刻停止層接觸且覆蓋薄膜電阻的第一末端和第二末端，保護層覆蓋薄膜電阻和導線結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a substrate, a thin film resistor, a lead structure and a passivation layer. The thin film resistor is disposed above the substrate and has a first end and a second end. The lead structure is disposed above the substrate and includes a conductive layer stacked on an etch stop layer. The etch stop layer is in direct contact with and covers the first end and the second end of the thin film resistor. The passivation layer covers the thin film resistor and the lead structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100A:半導體元件</p>
        <p type="p">101:基底</p>
        <p type="p">102:金屬互連層</p>
        <p type="p">103:介電層</p>
        <p type="p">109:薄膜電阻</p>
        <p type="p">109-1:第一末端</p>
        <p type="p">109-2:第二末端</p>
        <p type="p">110:導線結構</p>
        <p type="p">112:蝕刻停止層</p>
        <p type="p">114:導電層</p>
        <p type="p">120:保護層</p>
        <p type="p">122:開口</p>
        <p type="p">A-A’:線段</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="147" publication-number="202625724">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625724</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146949</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子元件翻轉裝置</chinese-title>
        <english-title>REVERSING DEVICE FOR ELECTRONIC COMPONENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260316B">H10P72/00</main-classification>
        <further-classification edition="202601120260316B">H10P74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS,INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仁明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JEN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳正鍇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHENG-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧冠妤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, KUAN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡竣宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, JIUN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電子元件翻轉裝置，其應用於一外觀檢測裝置，且電子元件翻轉裝置包括一入料組件、一翻轉組件及一出料組件。入料組件包含一入料槽道，入料槽道的一端對應該外觀檢測裝置配置。翻轉組件包含一轉向旋轉盤，轉向旋轉盤的旋轉動作定義有一旋轉路徑，入料槽道的另一端對應該旋轉路徑的一端配置。出料組件包含一出料槽道，該出料槽道對應該旋轉路徑的另一端配置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure is directed to a reversing device for electronic components applied to an appearance inspection device. The reversing device has a feeding assembly, a turning assembly and a discharging assembly. The feeding assembly has a feeding channel, and one end of the feeding channel is disposed corresponding to the appearance inspection device. The turning assembly has a turning disk. A rotation path is defined by a rotation of the turning disk. Another end of the feed channel is disposed corresponding to one end of the rotation path. The discharging assembly has a discharging channel disposed corresponding to another end of the rotation path.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:入料組件</p>
        <p type="p">110:入料槽道</p>
        <p type="p">200:翻轉組件</p>
        <p type="p">210:轉向旋轉盤</p>
        <p type="p">211:旋轉路徑</p>
        <p type="p">211a:旋轉始點</p>
        <p type="p">211b-c:旋轉經過點</p>
        <p type="p">211d:旋轉終點</p>
        <p type="p">300:出料組件</p>
        <p type="p">310:出料槽道</p>
        <p type="p">320:出料輪</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="148" publication-number="202624706">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624706</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146951</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>成形負荷校正與感測方法及其裝置</chinese-title>
        <english-title>FORMING LOAD CORRECTION AND SENSING METHOD AND DEVICE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250423B">G01L1/16</main-classification>
        <further-classification edition="200601120250423B">G01L1/26</further-classification>
        <further-classification edition="202001120250423B">G01L5/167</further-classification>
        <further-classification edition="200601120250423B">B21C51/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立高雄科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL KAOHSIUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宗哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, TSUNG-CHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李春興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHUN-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許進忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEU, JINN-JONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余征諴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHENG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉旭芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HSU-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種成形負荷校正與感測方法，包含：在一成形機上安裝一校正裝置，校正裝置中裝設有一荷重元；以荷重元量測成形機在一試模校正階段對應於一沖程之一成形負荷；在一成形機上安裝一感測裝置，感測裝置中裝設有一壓力感測器；以壓力感測器量測成形機在試模校正階段對應於沖程之一電壓；根據沖程及對應之成形負荷及電壓建立一電壓負荷轉換模型；以感測裝置量測成形機在一生產階段對應於沖程之一運作電壓，並根據電壓負荷轉換模型將運作電壓轉換為成形機之一運作成形負荷。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A forming load correction and sensing method includes: installing a correction device on a forming machine equipped with a load cell; measuring a forming load corresponding to a stroke of the forming machine in a trial mold correction stage with the load cell; installing a sensing device on the forming machine equipped with a piezoelectric sensor; measuring a voltage corresponding to the stroke of the forming machine in the trial mold correction stage with the piezoelectric sensor; establishing a voltage load transformation model based on the stroke and the forming load and the voltage corresponding to the stroke; measuring an operating voltage corresponding to the stroke of the forming machine in the production stage with the piezoelectric sensor, and transforming the operating voltage to an operating forming load of the forming machine with the voltage load transformation model.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:成形負荷校正與感測裝置</p>
        <p type="p">110:第一安裝治具</p>
        <p type="p">111a,111b:第一定位部</p>
        <p type="p">120:第二安裝治具</p>
        <p type="p">121a,121b:第二定位部</p>
        <p type="p">122:第一接觸面</p>
        <p type="p">123:第二接觸面</p>
        <p type="p">140:第二安裝槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="149" publication-number="202623862">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623862</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146956</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具可拆式伸縮筒之高爾夫球袋</chinese-title>
        <english-title>GOLF BAG WITH DETACHABLE TELESCOPIC TUBE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120250305B">A63B55/50</main-classification>
        <further-classification edition="201501120250305B">A63B55/57</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴偉浤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, WEI HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴偉浤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, WEI HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王德文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具可拆式伸縮筒之高爾夫球袋，包含有：一袋體，內部具有一容置空間，且頂端具有一開口連通至該容置空間；其中該袋體在該容置空間中設有複數個支架，一端固定於該袋體底側，另一端沿接近該開口之方向延伸；一頭框組，具有一第一頭框、一第二頭框及一控制件；該第一頭框概呈環狀，於外周面上環繞設置有複數個中空之定位件，其中該等支架鄰近該開口之一端分別貫穿該等定位件，使該第一頭框被固定於該袋體之該容置空間並鄰近於該開口；該第二頭框透過該控制件以可拆離的方式連接於該第一頭框；該控制件可供操作而於一關閉狀態及一開啟狀態間切換；當該控制件切換至該關閉狀態時，該控制件將該第二頭框固定於該第一頭框；當該控制件切換至該開啟狀態時，該控制件脫離該第一頭框，使該第二頭框可相對該第一頭框分離；以及一伸縮筒，以可拆離的方式設於該袋體之該容置空間中，並可受驅動而沿接近或遠離該袋體之方向移動； 其中，當該第二頭框從該袋體中拆離時，該伸縮筒可從該袋體之該開口取出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A golf bag with a detachable telescopic tube, comprising: A bag body, which includes an internal accommodating space and an opening at the top communicating with the accommodating space; wherein the bag body is provided with a plurality of brackets inside the accommodating space, each bracket having one end fixed to the bottom side of the bag body and the other end extending toward the opening. A head frame assembly, comprising a first head frame, a second head frame, and a control member; The first head frame is generally ring-shaped and has multiple hollow positioning members arranged around its outer peripheral surface. Each of the brackets near the end adjacent to the opening passes through the positioning members, thereby securing the first head frame within the accommodating space of the bag body near the opening. The second head frame is detachably connected to the first head frame via the control member. The control member is operable to switch between a closed state and an open state; When the control member is in the closed state, it secures the second head frame to the first head frame. When the control member is in the open state, it disengages from the first head frame, allowing the second head frame to separate from the first head frame. A telescopic tube, which is detachably installed within the accommodating space of the bag body and can be driven to move toward or away from the bag body. When the second head frame is detached from the bag body, the telescopic tube can be removed from the opening of the bag body.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:袋體</p>
        <p type="p">11:容置空間</p>
        <p type="p">12:開口</p>
        <p type="p">13:支架</p>
        <p type="p">20:頭框組</p>
        <p type="p">21:第一頭框</p>
        <p type="p">210:隔板</p>
        <p type="p">211:隔間</p>
        <p type="p">212:定位件</p>
        <p type="p">22:第二頭框</p>
        <p type="p">220:外殼件</p>
        <p type="p">221:軟膠件</p>
        <p type="p">222:軟膠孔</p>
        <p type="p">223:卡合槽</p>
        <p type="p">23:控制件</p>
        <p type="p">230:螺座</p>
        <p type="p">231:旋鈕</p>
        <p type="p">30:伸縮筒</p>
        <p type="p">31:中框</p>
        <p type="p">310:環壁</p>
        <p type="p">311:底壁</p>
        <p type="p">312:軌道件</p>
        <p type="p">312a:缺口</p>
        <p type="p">32:筒身</p>
        <p type="p">320:內凹部</p>
        <p type="p">321:封蓋</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="150" publication-number="202624853">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624853</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146963</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置、背光模組及顯示裝置的組裝方法</chinese-title>
        <english-title>DISPLAY DEVICE, BACKLIGHT MODULE AND METHOD OF ASSEMBLING DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250313B">G02F1/1333</main-classification>
        <further-classification edition="200601120250313B">G02F1/1335</further-classification>
        <further-classification edition="200601120250313B">G02F1/13357</further-classification>
        <further-classification edition="200601120250313B">H05K13/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞軒科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMTRAN TECHNOLOGY CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王鼎權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TING-CHUEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪千雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, CIAN-WUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳志政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIH-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置，包含一背光模組以及一顯示面板。顯示面板設置於背光模組上。背光模組包含一背板、一燈板、複數個支撐柱以及一擴散板。燈板設置於背板朝向顯示面板的一面上。複數個支撐柱設置於燈板或背板上。各支撐柱包含一支撐件以及一緩衝層。緩衝層由軟性材料製成且至少包覆支撐件之頂部。擴散板設置於燈板與背板上間隔一光腔距離。擴散板抵接於緩衝層。在一實施例中，各支撐柱之周圍可具有複數個微結構，以將燈板發出之光線朝擴散板的方向反射。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device includes a backlight module and a display panel. The display panel is disposed on the backlight module. The backlight module includes a back cover, a light board, a plurality of support pillars and a diffuse plate. The light board is disposed on a surface of the back cover facing the display panel. The plurality of support pillars are disposed on the light board or the back cover. Each of the plurality of support pillars includes a support member and a cushion layer. The cushion layer is made of a soft material and at least covers a top of the support member. The diffuse plate is disposed on the light board and the back cover at an optical chamber distance. The diffuse plate abuts against the cushion layer. In an embodiment, a periphery of each of the plurality of support pillars may have a plurality of microstructures to reflect light emitted by the light board toward the diffuse plate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:背光模組</p>
        <p type="p">102:燈板</p>
        <p type="p">104:支撐柱</p>
        <p type="p">106:擴散板</p>
        <p type="p">1020:電路板</p>
        <p type="p">1022:發光單元</p>
        <p type="p">1040:支撐件</p>
        <p type="p">1042:緩衝層</p>
        <p type="p">1044:固定件</p>
        <p type="p">1046:微結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="151" publication-number="202624705">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624705</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146969</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>觸控模組</chinese-title>
        <english-title>TOUCH MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250418B">G01L1/00</main-classification>
        <further-classification edition="200601120250418B">G06F3/041</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>致伸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRIMAX ELECTRONICS LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃韋強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEI-CHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹偉平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, WEI-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝杰紘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHIEH-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>關澤平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUAN, TSE-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, MING-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種觸控模組。觸控模組包括一基板、一觸控板、一第一壓力感測元件、一第二壓力感測元件以及一控制器。觸控板包括有一第一觸壓區、一第二觸壓區以及第三觸壓區。觸控板設置於基板上方，第一壓力感測元件以及第二壓力感測元件設置於基板與觸控板之間，控制器設置於觸控板中並用於產生一壓力訊號。當觸控板第一觸壓區域被觸壓時，第一壓力感測元件產生第一訊號，控制器根據第一訊號產生壓力訊號；第二觸壓區被觸壓時，第二壓力感測元件產生第二訊號，控制器根據第二訊號產生壓力訊號；第三觸壓區被觸壓時，第一壓力感測元件以及第二壓力感測元件同時產生第一訊號以及第二訊號，控制器判斷第一訊號以及第二訊號二者之訊號強度後，產生壓力訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a touch module including a baseboard, a touch board, a first pressure sensor, a second pressure sensor and a controller. The touch board including a first touch area, a second touch area, and a third touch area. The touch board is disposed above the baseboard. The first pressure sensor and the second pressure sensor are disposed between the baseboard and the touch board. The controller is disposed in the touch board and used to generate a pressure signal. When the first touch area of ​​the touch board is touched, the first pressure sensor generates a first signal, and the controller generates the pressure signal according to the first signal; When the second touch area is touched, the second pressure sensor generates a second signal, and the controller generates the pressure signal according to the second signal; When the third touch area is touched, the first pressure sensor and the second pressure sensor simultaneously generate the first signal and the second signal. The controller compares the signal strengths of the first signal and the second signal to generate the pressure signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:觸控模組</p>
        <p type="p">10:基板</p>
        <p type="p">20:觸控板</p>
        <p type="p">22:觸控層</p>
        <p type="p">60:震動元件</p>
        <p type="p">224:平面中心</p>
        <p type="p">225:外周緣</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="152" publication-number="202624854">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624854</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146971</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置及背光模組</chinese-title>
        <english-title>DISPLAY DEVICE AND BACKLIGHT MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250304B">G02F1/1333</main-classification>
        <further-classification edition="200601120250304B">G02F1/1335</further-classification>
        <further-classification edition="200601120250304B">G02F1/13357</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞軒科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMTRAN TECHNOLOGY CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳志政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIH-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁睿騏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, RUEI-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置，包含一背光模組以及一顯示面板。顯示面板設置於背光模組上。背光模組包含一背板、一燈板、一支撐柱、一緩衝件以及一擴散板。燈板設置於背板的內側面上。支撐柱包含一底座以及一支撐結構。支撐結構自底座延伸突起。背板與燈板夾持於底座與支撐結構之間。緩衝件設置於支撐結構之頂部。擴散板設置於燈板與背板上間隔一定距離。擴散板抵接於緩衝件。在一實施例中，背光模組可包含一彈性件，套設於支撐結構上。彈性件之二端分別抵接於背板與底座。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device includes a backlight module and a display panel. The display panel is disposed on the backlight module. The backlight module includes a back cover, a light board, a support pillar, a cushion member and a diffuse plate. The light board is disposed on an inner surface of the back cover. The support pillar includes a base and a support structure. The support structure protrudes from the base. The back cover and the light board clamped between the base and the support structure. The cushion member is disposed on a top of the support structure. The diffuse plate is disposed on the light board and the back cover at a certain distance. The diffuse plate abuts against the cushion member. The display panel is disposed on the backlight module. In an embodiment, the backlight module may include an elastic member sleeved on the support structure. Two ends of the elastic member respectively abut against the back cover and the base.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:顯示裝置</p>
        <p type="p">10:背光模組</p>
        <p type="p">12:顯示面板</p>
        <p type="p">100:背板</p>
        <p type="p">102:燈板</p>
        <p type="p">104:支撐柱</p>
        <p type="p">106:緩衝件</p>
        <p type="p">108:擴散板</p>
        <p type="p">110:光學膜片</p>
        <p type="p">112:反射片</p>
        <p type="p">1000:第一通孔</p>
        <p type="p">1002:第一容置槽</p>
        <p type="p">1020:電路板</p>
        <p type="p">1022:發光單元</p>
        <p type="p">1024:第二通孔</p>
        <p type="p">1040:底座</p>
        <p type="p">1044:彈臂</p>
        <p type="p">1046:第一限位部</p>
        <p type="p">1048:斜面</p>
        <p type="p">1060:圓弧頭部</p>
        <p type="p">1062:第二限位部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="153" publication-number="202625134">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625134</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146975</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>畫素電路以及顯示面板</chinese-title>
        <english-title>PIXEL CIRCUIT AND DISPLAY PANEL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120241218B">G09G3/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錼創顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PLAYNITRIDE DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖冠詠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, KUAN-YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅政祺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, CHENG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種畫素電路以及顯示面板被提出。畫素電路包括二開關電晶體、掃描線路、二驅動電晶體、一訊號源以及一發光元件。各開關電晶體具有通道，各開關電晶體的閘源電壓差具有使對應的通道可導通的電位區間，且二電位區間彼此不重疊。掃描線路電性連接各開關電晶體的閘極以傳輸選擇訊號，且選擇訊號使其中一個開關電晶體的閘源電壓差位於其對應的電位區間。在飽和操作條件下，二驅動電晶體的轉移特性曲線在相同的閘源電壓差具有相異的切線斜率。訊號源和發光元件連接在二個驅動電晶體的兩端，或發光元件連接在訊號源以及二個驅動電晶體之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pixel circuit and a display panel are provided. The pixel circuit includes two switch transistors, a scan line, two driving transistors, a signal source and a light-emitting component. Each of the switching transistor has a channel, a gate-source voltage difference of each switch transistor has a voltage level interval for turning on the corresponding channel, and the two voltage levels of the two switch transistors are not overlapped to each other. The scan line is electrically connected to a gate of each switch transistor to transmit a selection signal, and the selection signal makes the gate-source voltage difference is in the corresponding voltage level of one of the switch transistors. In a saturation operation condition, slopes of tangent lines of transfer characteristic curves corresponding to a same gate-source voltage differences of the two driving transistors are different. The signal source and the light-emitting component are connected between two ends of the two driving transistors, or the light-emitting component is connected between the signal source and the two driving transistors.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:畫素電路</p>
        <p type="p">Sn-1、Sn:時序訊號</p>
        <p type="p">SW1、SW2:開關</p>
        <p type="p">T1~T4、TA、TB:電晶體</p>
        <p type="p">VgA、VgB、VC1、VsA、VdB:電位</p>
        <p type="p">Vd1、Vd2:驅動訊號</p>
        <p type="p">VSS:參考接地端</p>
        <p type="p">C1:電容</p>
        <p type="p">DSL:選擇訊號</p>
        <p type="p">DCL:控制訊號</p>
        <p type="p">SL:掃描線路</p>
        <p type="p">CL:控制線路</p>
        <p type="p">ELVDD1、ELVDD2:訊號源</p>
        <p type="p">LD:發光元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="154" publication-number="202624791">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624791</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146976</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>偵測裝置和偵測方法</chinese-title>
        <english-title>DETECTION DEVICE AND DETECTION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250303B">G01S17/02</main-classification>
        <further-classification edition="200601120250303B">G06F3/01</further-classification>
        <further-classification edition="202101120250303B">A61B5/05</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏達國際電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HTC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊熠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHUN-YIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浦大鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PU, TA-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭彥良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, YEN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種偵測裝置，包括：一信號產生器、一頻率選擇面、一電光晶體元件、一光源、一光波導、一光感測器，以及一處理器。信號產生器可產生一毫米波信號。電光晶體元件係鄰近於頻率選擇面。毫米波信號可透過頻率選擇面和電光晶體元件傳送至一人體部份，使得人體部份回傳一反射信號至電光晶體元件。光源可產生一光通訊信號。光波導係鄰近於電光晶體元件。光波導可傳送光通訊信號，其中光通訊信號可根據反射信號來進行調變。光感測器可由光波導處接收光通訊信號。處理器係耦接至光感測器。處理器可分析光通訊信號，以取得人體部份之一生理資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A detection device includes a signal generator, an FSS (Frequency Selective Surface), an EO (Electro-Optical) crystal element, a light source, a light waveguide, a light sensor, and a processor. The signal generator generates an mmWave (Millimeter Wave) signal. The EO crystal element is adjacent to the FSS. The mmWave signal is transmitted through the FSS and the EO crystal element to a human body portion. Thus, the human body portion transmits a reflection signal back to the EO crystal element. The light source generates a light communication signal. The light waveguide is adjacent to the EO crystal element. The light waveguide transmits the light communication signal. The light communication signal is modulated according to the reflection signal. The light sensor receives the light communication signal from the light waveguide. The processor is coupled to the light sensor. The processor can analyze the light communication signal, so as to obtain the physiological information of the human body portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:偵測裝置</p>
        <p type="p">110:信號產生器</p>
        <p type="p">120:頻率選擇面</p>
        <p type="p">130:電光晶體元件</p>
        <p type="p">140:光源</p>
        <p type="p">150:光波導</p>
        <p type="p">160:光感測器</p>
        <p type="p">170:處理器</p>
        <p type="p">IA:生理資訊</p>
        <p type="p">HB:人體部份</p>
        <p type="p">SW:毫米波信號</p>
        <p type="p">SR:反射信號</p>
        <p type="p">ST:光通訊信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="155" publication-number="202625525">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625525</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146978</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有發光設計的殼體結構</chinese-title>
        <english-title>HOUSING STRUCTURE WITH LIGHT EMITTING DESIGN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">H05K5/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳弘基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUNG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊惠婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, HUEI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳順彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHUN-BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孟傳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MENG-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種殼體結構，包括殼件、透光膠體層及發光模組。殼件具有外觀面、相對於外觀面的內面及貫通外觀面與內面的透光槽。透光膠體層填充於透光槽。發光模組設置於內面，且覆蓋透光槽或位於透光槽的一側，以將光線傳遞至透光膠體層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A housing structure including a housing member, a light-transmitting adhesive layer, and a light emitting module is provided. The housing member has an appearance surface, an inner surface opposite to the appearance surface, and a light-transmitting slot penetrating the appearance surface and the inner surface. The light-transmitting adhesive layer is filled in the light-transmitting slot. The light emitting module is disposed at the inner surface and cover the light-transmitting slot or at one side of the light-transmitting slot, and thus transmit light to the light-transmitting adhesive layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:殼體結構</p>
        <p type="p">110:殼件</p>
        <p type="p">111:外觀面</p>
        <p type="p">112:內面</p>
        <p type="p">1121:第一凹槽</p>
        <p type="p">1122:第二凹槽</p>
        <p type="p">113:透光槽</p>
        <p type="p">120:透光膠體層</p>
        <p type="p">121:第一部分</p>
        <p type="p">122:第二部分</p>
        <p type="p">1201:入光面</p>
        <p type="p">1202:出光面</p>
        <p type="p">130:發光模組</p>
        <p type="p">131:光源</p>
        <p type="p">132:導光板</p>
        <p type="p">D:方向</p>
        <p type="p">W:截面寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="156" publication-number="202624055">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624055</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146981</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>車輛被追撞主被動防護系統及方法</chinese-title>
        <english-title>VEHICLE COLLISION ACTIVE AND PASSIVE PROTECTION SYSTEM AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120241231B">B60W30/08</main-classification>
        <further-classification edition="201201120241231B">B60W30/095</further-classification>
        <further-classification edition="200601120241231B">G08G1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯陽半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITE TECH. INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐崇平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHUNG-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種車輛追撞主被動防護系統包括陀螺儀、後保桿碰撞感應器及氣簾控制器。陀螺儀用以偵測車輛的重心偏移，後保桿碰撞感應器用以偵測車輛是否發生追撞，氣簾控制器用以當車輛發生追撞且重心偏移滿足一條件時，啟動氣簾以保護乘客。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A vehicle collision active and passive protection system includes a gyroscope, a rear bumper collision sensor and an inflatable curtain controller. The gyroscope is used to detect the shift in the center of gravity of a vehicle, the rear bumper collision sensor is used to detect whether a vehicle collision occurs, and the inflatable curtain controller is used to activate the inflatable curtains to protect passengers during a vehicle collision when the shift in center of gravity meets a condition.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:車輛追撞主被動防護系統</p>
        <p type="p">402:陀螺儀</p>
        <p type="p">404:後保桿碰撞感應器</p>
        <p type="p">406:氣簾控制器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="157" publication-number="202623902">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623902</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146988</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>噴嘴之設計方法</chinese-title>
        <english-title>NOZZLE DESIGN METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">B05B1/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許富銓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, FU-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹尚祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAN, SHANG-YOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡孟修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MENG-HSIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪筠捷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, YUN-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳奕誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伏和中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, HO-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種噴嘴之設計方法，適用以設計微粒子表面改質用之噴嘴，其包含依序相接之收縮段、喉段、及擴散段。在此方法中，利用計算流體力學-離散元素法(CFD-DEM)軟體在一微粒子速度範圍下對至少一噴嘴尺寸組進行模擬，以獲得噴嘴尺寸設計方程式之第一至第三係數範圍、及常數範圍。噴嘴尺寸設計方程式為V=a*X+b*Y+c*Z+d，V為微粒子速度，a、b、與c分別為第一至第三係數，d為常數，X、Y、與Z分別為收縮段、喉段、與擴散段流道最大直徑。利用CFD-DEM軟體，通過噴嘴尺寸設計方程式於第一至第三係數範圍與常數範圍，及一目標速度下，進行運算而取得計算噴嘴尺寸組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A nozzle design method is suitable for designing a nozzle for particle surface modification, which includes a constriction section, a throat section, and a diffusion section that are connected in sequence. In this method, a computational fluid dynamics-discrete element method (CFD-DEM) software is used to simulate at least one nozzle size set in a particle velocity range to obtain first to third coefficient ranges and constant ranges of a nozzle size design equation. The nozzle size design equation is V=a*X+b*Y+c*Z+d, in which V is a particle velocity, a, b, and c are first to third coefficients respectively, d is a constant, X, Y, and Z are maximum diameters of flow channels of the constriction section, the throat section, and the diffusion section respectively. The CFD-DEM software is used to calculate through the nozzle size design equation in the first to third coefficient ranges and the constant range, and a target speed to obtain a calculated nozzle size set.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:噴嘴之設計方法</p>
        <p type="p">210:步驟</p>
        <p type="p">220:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="158" publication-number="202624951">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624951</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146990</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>適用於反平方根運算和倒數運算之間切換的電路架構</chinese-title>
        <english-title>CIRCUIT STRUCTURE ADAPTED TO SWITCH BETWEEN INVERSE SQUARE ROOT OPERATION AND RECIPROCAL OPERATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">G06F7/38</main-classification>
        <further-classification edition="200601120250303B">G06F7/48</further-classification>
        <further-classification edition="200601120250303B">G06F7/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立陽明交通大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL YANG MING CHIAO TUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃俊達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, JUINN-DAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳絜恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JYE-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡庭偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, TING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種適用於反平方根運算和倒數運算之間切換的電路架構，且包括一多工器模組以選擇性提供反平方根運算常數或倒數運算常數，及一運算電路用於選擇性使用該(等)反平方根運算常數對一正整數執行一反平方根運算或使用該(等)倒數運算常數對該正整數執行倒數運算。該運算電路包括至少一用於該反平方根運算和該倒數運算的算術單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit structure is adapted to switch between inverse square root (ISR) operation and reciprocal operation, and includes a multiplexer module to selectively provide ISR operation constant(s) or reciprocal operation constant(s), and an operation circuit configured to selectively use the ISR operation constant(s) to perform ISR operation or use the reciprocal operation constant(s) to perform reciprocal operation on a positive integer. The operation circuit includes at least one arithmetic unit that is used in both of the ISR operation and the reciprocal operation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:暫存器模組</p>
        <p type="p">2:多工器模組</p>
        <p type="p">21:第一常數選擇多工器</p>
        <p type="p">22:第二常數選擇多工器</p>
        <p type="p">23:第三常數選擇多工器</p>
        <p type="p">3:運算電路</p>
        <p type="p">31:近似值計算模組</p>
        <p type="p">311:整數轉浮點轉換器</p>
        <p type="p">312:第一運算切換多工器</p>
        <p type="p">313:減法器</p>
        <p type="p">32:優化計算模組</p>
        <p type="p">320:浮點轉定點轉換器</p>
        <p type="p">321:第二運算切換多工器</p>
        <p type="p">322:第三運算切換多工器</p>
        <p type="p">323:乘法器</p>
        <p type="p">324:乘法器</p>
        <p type="p">325:乘法器</p>
        <p type="p">326:減法器</p>
        <p type="p">327:乘法器</p>
        <p type="p">328:暫存器單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="159" publication-number="202623776">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623776</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146992</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具多姿態之輔助位移裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241219B">A61H3/00</main-classification>
        <further-classification edition="200601120241219B">A61G5/00</further-classification>
        <further-classification edition="200601120241219B">A61G7/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立高雄科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義大醫療財團法人義大醫院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝其昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHI-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林禮獎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, LI-CHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊慶煜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHING-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英淑玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENG, SHU-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具多姿態之輔助位移裝置，包含：一基架，包括一底座及一立架，該底座與該立架共同形成一容身空間；一第一升降單元，可升降地設於該立架，並具有位於該容身空間的一上身支撐桿；一第二升降單元，可升降地設於該立架，並具有位於該容身空間的一下身支撐桿；及一彈性承載件，位於該容身空間中，並連接該上身支撐桿與該下身支撐桿。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基架</p>
        <p type="p">11:底座</p>
        <p type="p">12:立架</p>
        <p type="p">2:第一升降單元</p>
        <p type="p">21:上身支撐桿</p>
        <p type="p">3:第二升降單元</p>
        <p type="p">31:下身支撐桿</p>
        <p type="p">4:彈性承載件</p>
        <p type="p">S:容身空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="160" publication-number="202623857">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623857</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146993</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有評估心理壓力的運動訓練偵測系統</chinese-title>
        <english-title>SPORTS TRAINING DETECTION SYSTEM WITH ASSESSMENT OF PSYCHOLOGICAL STRESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241219B">A63B24/00</main-classification>
        <further-classification edition="200601120241219B">A61B5/16</further-classification>
        <further-classification edition="200601120241219B">A61B5/22</further-classification>
        <further-classification edition="200601120241219B">A61B3/113</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立屏東科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王采蕎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TSAI-CHIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡佳良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHIA-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯大緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, TA-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂孟潔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LYU, MENG-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有評估心理壓力的運動訓練偵測系統包含：顯示裝置，接收虛擬場景影像信號並據以播放虛擬場景影像；音訊播放裝置，接收音訊信號並據以播放聽覺回饋；生理感測裝置，感測使用者以產生生理感測資訊；眼球追蹤裝置，追蹤使用者的眼球以產生眼部資訊；心理壓力判斷裝置，根據眼部資訊及預設眼部資訊，產生指示使用者的心理壓力的判斷結果；及管控裝置，於初始設定期間，根據生理感測資訊及眼部資訊進行初始設定並產生虛擬場景影像信號及音訊信號，並於使用者運動期間，根據判斷結果調整虛擬場景影像信號及音訊信號中的至少一者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A sports training detection system with assessment psychological stress includes a display device, an audio playback device, a physiological sensing device, an eye tracking device, a psychological stress judgment device, and a management and control device. The display device receives a virtual scene image signal and plays a virtual scene image accordingly. The audio playback device receives an audio signal and plays an auditory feedback accordingly. The physiological sensing device senses a user to generate physiological sensing information. The eye tracking device tracks the user's eyeballs to generate eye information. The psychological stress judgment device generates a judgment result indicating the user's psychological stress based on the eye information and preset eye information. The management and control device initially sets and generates the virtual scene image signal and the audio signal based on the physiological sensing information and the eye information during an initial setup period, and adjusts at least one of the virtual scene image signal and the audio signal based on the judgement result during a user movement.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:運動訓練偵測系統</p>
        <p type="p">10:顯示裝置</p>
        <p type="p">11:音訊播放裝置</p>
        <p type="p">12:生理感測裝置</p>
        <p type="p">13:眼球追蹤裝置</p>
        <p type="p">14:心理壓力判斷裝置</p>
        <p type="p">15:管控裝置</p>
        <p type="p">16:攝影裝置</p>
        <p type="p">17:姿態影像回饋裝置</p>
        <p type="p">18:姿態判斷裝置</p>
        <p type="p">19:效果比對裝置</p>
        <p type="p">21:使用者</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="161" publication-number="202624629">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624629</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147005</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自動定位無段式解鎖之固定裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">F16B1/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恒昌行精密工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANWIT PRECISION INDUSTRIES LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾英智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, YING-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李毓庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張朝坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種自動定位無段式解鎖之固定裝置，包括：一基座，包括頂板、底板、側板及容置腔，於頂板與底板中皆設有穿孔，於側板中形成有作動開口；一彈片，固定於基座之頂板處，彈片包括接觸部及卡塊；一扳柄，包括凸輪部及操作部，於凸輪部與基座的樞接結構之間設有彈性件，且凸輪部頂側可供卡塊卡合定位，而凸輪部一側形成有抵接構造，且抵接構造包括鎖定區、緩衝區及解鎖區，且鎖定區與緩衝區由上而下呈漸擴弧面構造；一頂持座，包括有定位盤及頂桿，頂桿之頂側形成有接觸面且於側邊上方形成有寬度較大的干涉部及下方寬度較小的鎖定部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基座</p>
        <p type="p">10:容置腔</p>
        <p type="p">101:穿孔</p>
        <p type="p">102:作動開口</p>
        <p type="p">103:第一定位槽</p>
        <p type="p">104:第二定位槽</p>
        <p type="p">105:透孔</p>
        <p type="p">106:第三定位槽</p>
        <p type="p">107:第四定位槽</p>
        <p type="p">11:頂板</p>
        <p type="p">12:底板</p>
        <p type="p">13:側板</p>
        <p type="p">131:擋止壁</p>
        <p type="p">14:樞軸</p>
        <p type="p">15:擋止桿</p>
        <p type="p">2:彈片</p>
        <p type="p">21:緊固件</p>
        <p type="p">3:扳柄</p>
        <p type="p">31:凸輪部</p>
        <p type="p">310:軸孔</p>
        <p type="p">311:凸體</p>
        <p type="p">3111:收納槽</p>
        <p type="p">3112:卡合面</p>
        <p type="p">32:操作部</p>
        <p type="p">33:彈性件</p>
        <p type="p">331:固定段</p>
        <p type="p">332:環形部</p>
        <p type="p">333:抵持段</p>
        <p type="p">4:頂持座</p>
        <p type="p">41:定位盤</p>
        <p type="p">411:防轉定位切邊</p>
        <p type="p">42:頂桿</p>
        <p type="p">421:接觸面</p>
        <p type="p">422:干涉部</p>
        <p type="p">423:鎖定部</p>
        <p type="p">5:第一板材</p>
        <p type="p">51:第一固定槽</p>
        <p type="p">6:第二板材</p>
        <p type="p">61:第二固定槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="162" publication-number="202624630">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624630</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147006</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無段式解鎖之固定裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">F16B1/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恒昌行精密工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANWIT PRECISION INDUSTRIES LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾英智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, YING-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李毓庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張朝坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種無段式解鎖之固定裝置，包括：一基座，包括底板及二側板且圈圍形成有容置腔，於底板中間處設有穿孔且於一側設有卡扣；一扳柄，包括樞接於基座的二側板之間且收納於容置腔中的凸輪部，凸輪部朝卡扣方向延伸有操作部，而凸輪部相對於操作部的另一側形成有呈凸出體之接觸部及弧面，弧面於靠近接觸部處形成有第一抵持部且遠離接觸部形成有第二抵持部；一頂持座，包括有定位盤且定位盤向上凸設有可伸入基座之穿孔及進入容置腔之頂桿，頂桿之頂側形成有接觸面且於側邊上方形成有寬度較大的干涉部及下方寬度較小的鎖定部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基座</p>
        <p type="p">10:容置腔</p>
        <p type="p">11:底板</p>
        <p type="p">12:側板</p>
        <p type="p">13:卡扣</p>
        <p type="p">14:第一定位槽</p>
        <p type="p">15:第二定位槽</p>
        <p type="p">16:擋止桿</p>
        <p type="p">2:扳柄</p>
        <p type="p">21:凸輪部</p>
        <p type="p">210:軸孔</p>
        <p type="p">211:頂面</p>
        <p type="p">22:操作部</p>
        <p type="p">221:定位面</p>
        <p type="p">222:卡槽</p>
        <p type="p">23:接觸部</p>
        <p type="p">24:弧面</p>
        <p type="p">241:第一抵持部</p>
        <p type="p">242:第二抵持部</p>
        <p type="p">25:樞軸</p>
        <p type="p">26:彈性件</p>
        <p type="p">261:環形部</p>
        <p type="p">262:固定段</p>
        <p type="p">263:抵持段</p>
        <p type="p">3:頂持座</p>
        <p type="p">31:定位盤</p>
        <p type="p">311:防轉定向切邊</p>
        <p type="p">32:頂桿</p>
        <p type="p">321:接觸面</p>
        <p type="p">4:第一板材</p>
        <p type="p">41:第一固定槽</p>
        <p type="p">5:第二板材</p>
        <p type="p">51:第二固定槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="163" publication-number="202624193">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624193</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147007</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>純化乙二胺的方法</chinese-title>
        <english-title>METHOD OF PURIFYING ETHYLENEDIAMINE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241216B">C07C209/86</main-classification>
        <further-classification edition="200601120241216B">C07C211/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東聯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORIENTAL UNION CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭敦鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, TUN HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江建章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHIEN CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許祐川</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YU CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林文勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEN YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉　庭善</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POERNOMO, TAUFIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ID</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯逸宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, YI TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡錫津</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, HSI CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供一種純化乙二胺的方法，其包含下列步驟。將一含苯基化合物加入至一乙二胺混合液中，以獲得一待蒸餾混合物，其中乙二胺混合液包含沸點高於乙二胺的一第一有機胺化合物及沸點低於乙二胺的一第二有機胺化合物中的至少一者，且含苯基化合物與乙二胺及水產生共沸。在一蒸餾壓力下對待蒸餾混合物進行蒸餾，以獲得一低沸點混合物，其中蒸餾壓力等於或小於常壓。對低沸點混合物進行相分離並除水，以獲得一乙二胺純化物。乙二胺純化物的一純度大於99.5%。藉此，可大幅減少廢棄物產生，有助於簡化純化流程並降低資源消耗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">According to the present disclosure, a method of purifying ethylenediamine includes the following steps. A phenyl compound is added to an ethylenediamine mixture solution to obtain a mixture to be distilled. The ethylenediamine mixture solution includes at least one of a first organic amine compound with a boiling point higher than ethylenediamine and a second organic amine compound with a boiling point lower than ethylenediamine. The phenyl compound forms an azeotrope with ethylenediamine and water. The mixture to be distilled is distilled under a distillation pressure to obtain a low boiling point mixture. The distillation pressure is equal to or less than normal pressure. The low boiling point mixture undergoes phase-separation and water removal to obtain a purified ethylenediamine product. A purity of the purified ethylenediamine product is greater than 99.5%. Therefore, the waste can be significantly reduced, and it is favorable for simplifying the purification process and reducing the consumption of resources.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:純化乙二胺的方法</p>
        <p type="p">110,120,130:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="164" publication-number="202623842">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623842</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147011</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>止血複合纖維及其製造方法</chinese-title>
        <english-title>HEMOSTATIC COMPOSITE FIBER AND MANUFACUTRE METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">A61L15/28</main-classification>
        <further-classification edition="200601120241230B">D01F1/02</further-classification>
        <further-classification edition="200601120241230B">D01F6/96</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人紡織產業綜合研究所</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN TEXTILE RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳奕村</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-TSUEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李瑞生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JUI-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容的一些實施方式提供止血複合纖維，包含複數分子篩嫘縈纖維以及複數幾丁聚醣纖維，幾丁聚醣纖維交錯分布於分子篩嫘縈纖維之間。複數分子篩嫘縈纖維包含複數嫘縈纖維以及複數分子篩，分子篩分布於嫘縈纖維的表面。本揭露內容的一些實施方式還提供製造止血複合纖維的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A hemostatic composite fiber is provided in some embodiments of the present disclosure, including: a plurality of molecular sieve rayon fibers and a plurality of chitosan fibers interwoven among the plurality of molecular sieve rayon fibers. The plurality of molecular sieve rayon fibers include a plurality of rayon fibers and a plurality of molecular sieves distributed on surfaces of the plurality of rayon fibers. A manufacture method of a hemostatic composite fiber is further provided in some embodiments of the present disclosure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">S110、S120、S130、S140:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="165" publication-number="202623915">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623915</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147017</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>焚化飛灰的處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120241230B">B09B3/20</main-classification>
        <further-classification edition="202201120241230B">B09B3/38</further-classification>
        <further-classification edition="202201320241230B">B09B101/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊雅好</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊雅好</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種焚化飛灰的處理方法，是將所述焚化飛灰與水以及芮式硬度高於7的砂料混合為處理漿料，依序導入串聯的多個攪拌設備。每一該攪拌設備具有一桶槽、一設置於該桶槽中的攪拌器，及一安裝於該桶槽並用以往該桶槽內導入超音波的超音波產生器。接著以一過濾設備濾除該處理漿料所含砂料，再將該處理漿料導入至少一濕式渦錐進行分選，形成一含有至少一種有害物質的溢流物料，及一底流物料。再將該溢流物料導入一攪拌槽，並加入一螯合劑，使有害物質與該螯合劑反應為無害的螯合物而移除，最後將該溢流物料及該底流物料分別儲存而供後續應用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:機械碰撞步驟</p>
        <p type="p">111:第一階段</p>
        <p type="p">112:第二階段</p>
        <p type="p">12:中介步驟</p>
        <p type="p">121:調節子步驟</p>
        <p type="p">13:濕式分選步驟</p>
        <p type="p">14:螯合處理步驟</p>
        <p type="p">15:儲存步驟</p>
        <p type="p">151:乾燥子步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="166" publication-number="202623729">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623729</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147018</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>牙刷</chinese-title>
        <english-title>TOOTHBRUSH</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250304B">A46B9/02</main-classification>
        <further-classification edition="200601120250304B">A46B9/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龍昌兄弟股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACUMEN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃守仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHOU REN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李珩</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>桃園市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種牙刷包括刷本體，所述刷本體具有柄部、頸部以及位於所述頸部前端的頭部，頭部的正面具有植毛面，頭部具有複數第一傾斜凸台以及複數固定金屬片，複數第一傾斜凸台係突出於該植毛面而形成第一傾斜面，第一傾斜面並朝第一傾斜方向傾斜，且於該第一傾斜面朝內凹入一第一植毛孔以供植設有毛束，而複數固定金屬片係將毛束分別固定於第一植毛孔內，固定金屬片朝第一傾斜方向形成傾斜，固定金屬片之中軸線與第一植毛孔之中軸線相互重疊，且固定金屬片之各處與第一傾斜面之間具有相同深度，可改善毛束拉力不均的問題，以增加毛束的固定強度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a toothbrush having a brush body. The brush body includes a handle portion, a neck portion, and a head portion located at the front end of the neck. The head portion is provided on its upper surface with a bristle mounting face and includes a plurality of first inclined bosses and a plurality of metal fixing pieces. The respective first inclined bosses protrude from the bristle mounting face and incline in a first inclined direction, thus forming first inclined faces. Each of the first inclined faces is recessed inwardly to form a first bristle mounting hole for receiving a bristle tuft, with each of the metal fixing pieces being used to secure the bristle tuft in the corresponding first bristle mounting hole. The respective metal fixing pieces are arranged to incline relative to the normal direction of the respective first inclined faces. The central axes of the respective metal fixing pieces are arranged to align with the central axes of the respective first bristle mounting holes, and the depth between each part of the respective metal fixing pieces and the corresponding first inclined faces is consistent. The invention improves the problem of uneven bristle tension and increases the strength of bristle fixation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">A1、A2:中軸線</p>
        <p type="p">H5、H6:深度</p>
        <p type="p">5:頭部</p>
        <p type="p">5a:植毛面</p>
        <p type="p">5b:第一傾斜面</p>
        <p type="p">51:第一傾斜凸台</p>
        <p type="p">511:第一植毛孔</p>
        <p type="p">61:毛束</p>
        <p type="p">62:固定金屬片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="167" publication-number="202625431">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625431</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147019</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種互動式展演系統</chinese-title>
        <english-title>AN INTERACTIVE PERFORMANCE SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">H04N9/12</main-classification>
        <further-classification edition="200601120250303B">H04N9/31</further-classification>
        <further-classification edition="200601120250303B">G06F3/01</further-classification>
        <further-classification edition="200601120250303B">G06F3/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紅然股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RYB STUDIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃維韶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEI-SHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊惠美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, HUEI-MEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉建汎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIEN-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李柏憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, PO-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊景文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JING-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃頊榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HSU-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游子樂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, TZU-LE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周螢瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, YING-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫大龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種互動式展演系統，應用於一展演場景，包括：一伺服器，管理該展演場景的複數個背景資料，該複數個背景資料各自至少包括至少一場景內容、至少一時序和至少一景深，該伺服器包含一背景排序模組，該背景排序模組讀取並選擇該複數個背景資料中的一者為第一背景，生成投影該第一背景的一第一指示；至少一投影裝置，通訊連接該伺服器，從該伺服器接收該第一指示並據以進行投影；和至少一控制裝置，通訊連接該伺服器，提供一輸入介面以獲得一場景選擇，傳送該場景選擇至該伺服器；其中，當該伺服器接收到該場景選擇，該背景排序模組根據該場景選擇讀取並選擇該複數個背景資料中的另一者為第二背景，生成切換至該第二背景的一第二指示，並傳送該第二指示至該至少一投影裝置，以使該至少一投影裝置根據該第二指示進行投影。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:互動式展演系統</p>
        <p type="p">11:伺服器</p>
        <p type="p">12:投影裝置</p>
        <p type="p">13:控制裝置</p>
        <p type="p">14:聲音裝置</p>
        <p type="p">15:燈光裝置</p>
        <p type="p">16:機械裝置</p>
        <p type="p">17:感應器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="168" publication-number="202625153">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625153</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147020</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>螢幕畫面控制裝置及螢幕畫面控制方法</chinese-title>
        <english-title>DISPLAY IMAGE CONTROL DEVICE AND DISPLAY IMAGE CONTROL METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250319B">G09G5/36</main-classification>
        <further-classification edition="200601120250319B">G06F3/041</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華碩電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASUSTEK COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭亞娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, YA-CUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭佳融</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, JIA-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種螢幕畫面控制裝置，適用於一電子裝置，電子裝置具有一觸控螢幕，觸控螢幕適於顯示一畫面。此螢幕畫面控制裝置包含一介面層設置單元、一顯示區域設定單元以及一介面層狀態控制單元。其中，介面層設置單元適於因應一啟動指令，在畫面之最上層設置一介面層。顯示區域設定單元適於透過介面層獲取一第一觸控軌跡，第一觸控軌跡對應於該畫面之一第一區域。介面層狀態控制單元適於依據第一區域確認一屏蔽區域，並改變對應於屏蔽區域之部分介面層之透明度。本案並提供一種螢幕畫面控制方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display image control device applicable to an electronic device having a touch display for showing an image is provided. The display image control device comprises an interface layer setting unit, a display area setting unit, and an interface layer control unit. The interface layer setting unit is for setting an interface layer at the uppermost layer of the image in responsive to an enabling instruction. The display area setting unit is for acquiring a first touch trajectory through the interface layer. The first touch trajectory corresponds to a first area of the image. The interface layer transparency control unit is for acquiring a shielding area based on the first area, and changing transparency of a portion of the interface layer according to the shielding area. A display image control method is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S220,S240,S260,S280,S290:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="169" publication-number="202624612">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624612</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147025</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>足踏式打氣筒</chinese-title>
        <english-title>FOOT-OPERATED AIR PUMP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">F04B33/00</main-classification>
        <further-classification edition="200601120241231B">F04B39/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>集優企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CO-LUCK ENTERPRISE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳樹木</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, SHU MU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡侑芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明足踏式打氣筒包括有一個底座、一個活塞組及一個壓力錶，底座設置有一個固定踩踏部及一個汽缸，活塞組連接於汽缸，活塞組設置有一個活動踩踏部，活動踩踏部能夠沿垂直方向上下移動，壓力錶連接於底座並位於固定踩踏部與汽缸之間，打氣筒透過上述結構能夠方便使用者觀看壓力數值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A foot-operated air pump of the present invention includes a base, a piston assembly, and a pressure gauge. The base is provided with a fixed stepping portion and a cylinder. The piston assembly is connected to the cylinder and provided with a movable stepping portion capable of moving vertically up and down. The pressure gauge is connected to the base and positioned between the fixed stepping portion and the cylinder. This structure allows the user to conveniently view the pressure readings during operation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:打氣筒</p>
        <p type="p">20:底座</p>
        <p type="p">21:固定踩踏部</p>
        <p type="p">22:汽缸</p>
        <p type="p">23:踏桿</p>
        <p type="p">321:活動踩踏部</p>
        <p type="p">40:壓力錶</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="170" publication-number="202624998">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624998</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147026</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>服裝版型模擬圖產生系統及其方法</chinese-title>
        <english-title>GENERATION SYSTEM AND METHOD OF CLOTHING PATTERN SIMULATION DIAGRAM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120241213B">G06F30/12</main-classification>
        <further-classification edition="202001120241213B">G06F30/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>輔仁大學學校財團法人輔仁大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU JEN CATHOLIC UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃盈嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YING-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭傑遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, JIE-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘柏均</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種服裝版型模擬圖產生系統及方法，該系統包括：輸入裝置，用以輸入標準化設計圖及設計圖輪廓；輪廓種類確認模組，確認該設計圖輪廓之種類；定義模組，定義出該設計圖輪廓所對應之人體區塊及關節之數量；版型產生模組，計算出服裝機械圖組合數量；服裝機械及模擬圖模組，生成服裝機械圖，並根據該服裝機械圖於該設計圖輪廓上繪製出服裝模擬圖；以及服裝版型模擬圖模組，根據該服裝模擬圖生成一體成型的服裝版型模擬圖。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure provides a generation system and method of clothing pattern simulation diagram, the system comprises: an input device for inputting a standardized design diagram and a design diagram outline; an outline type confirmation module for confirming a type of the design diagram outline; a definition module for defining numbers of human body blocks and joints corresponding to the design diagram outline; a pattern generation module for calculating a combination number of clothing mechanical diagrams; a clothing mechanical and simulation diagram module for generating a clothing mechanical diagram and drawing a clothing simulation diagram on the design diagram outline according to the clothing mechanical diagram; and a clothing pattern simulation diagram module for generating an integrated clothing pattern simulation diagram according to the clothing simulation diagram.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:服裝版型模擬圖產生系統</p>
        <p type="p">10:輸入裝置</p>
        <p type="p">11:輪廓種類確認模組</p>
        <p type="p">12:定義模組</p>
        <p type="p">13:版型產生模組</p>
        <p type="p">14:服裝機械及模擬圖模組</p>
        <p type="p">15:服裝版型模擬圖模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="171" publication-number="202624054">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624054</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147032</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>怠速起停系統之發電控制方法</chinese-title>
        <english-title>POWER GENERATION CONTROL METHOD FOR IDLE STOP-START SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">B60W10/08</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三陽工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANYANG MOTOR CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾威婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, WEI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冠賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇建太</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種怠速起停系統之發電控制方法，所述怠速起停系統包括一電池系統、一起動兼發電控制系統、一引擎燃油噴射控制系統以及一具有一曲軸之引擎以及一油門，起動兼發電控制系統包括一起動兼發電控制器及一起動兼發電裝置，起動兼發電控制器分別電連接電池系統及起動兼發電裝置，引擎燃油噴射控制系統接收來自油門之油門訊號並通訊連接起動兼發電控制器，起動兼發電裝置係與曲軸同軸設置，引擎燃油噴射控制系統分別電連接電池系統及引擎。藉此，透過本發明之怠速起停系統之發電控制方法，利用此方法可有效降低引擎在需要加速時因為發電產生的損耗而影響引擎加速過程的加速表現，讓引擎加速不被發電負載效應影響。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a power generation control method for an idle stop-start system. The idle stop-start system includes a battery system, a starter generator control system, an engine fuel injection control system, an engine with a crankshaft and a throttle. The starter generator control system includes starter generator controller and a starter generator device. The starter generator controller is electrically connected to the battery system and the starter generator device respectively. The engine fuel injection control system is connected to the starter generator controller by communication. The starter generator device is arranged coaxially with the crankshaft, and the engine fuel injection control system is electrically connected to the battery system and the engine respectively. As such, through the power generation control method of the idle stop-start system of the present invention, this method can effectively reduce the acceleration performance of the engine acceleration process caused by the loss of power generation when the engine needs to be accelerated, so that the engine acceleration is not affected by the power generation load effect.</p>
      </isu-abst>
      <representative-img>
        <p type="p">A~C3:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="172" publication-number="202624371">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624371</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147033</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種微波裂解碳纖維複合材料再生碳纖維的方法</chinese-title>
        <english-title>A METHOD OF MICROWAVE PYROLYSIS CARBON FIBER COMPOSITE MATERIALS TO REGENERATE CARBON FIBERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250402B">C08J11/12</main-classification>
        <further-classification edition="200601120250402B">D01G11/00</further-classification>
        <further-classification edition="200601120250402B">D21B1/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上緯創新育成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SWANCOR INNOVATION AND INCUBATION CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>南投縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美林能源科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEI LIN ENERGY TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊茹媛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, RU-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁敏航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENG, MIN-HANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林國權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KUO-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIA-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭子豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, TZU-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示了一種微波裂解碳纖維複合材料再生碳纖維的方法，其主要步驟包含：將一大片碳纖維複合材料板裁切成複數個碳纖維複合材料片；將該些碳纖維複合材料片置入一微波加熱腔體；該些碳纖維複合材料片在該微波加熱腔體中在含惰性氣體的一無氧氣氛，進行一第一微波熱處理以形成複數個半完成碳纖維材料；該些半完成碳纖維材料在該微波加熱腔體中在含混合空氣的一少氧氣氛下，進行一第二微波熱處理以形成複數個再生碳纖維材料；以及該些再生碳纖維材料由該微波加熱腔體中進入一冷卻容器中。該方法操作簡單方便，微波處理產生的再生碳纖維為具有原碳纖維的特性，為可利用的再生資源。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention discloses a method for microwave pyrolysis of carbon fiber composite materials to regenerate carbon fibers, the main steps comprising: cutting a large carbon fiber composite material plate into a plurality of carbon fiber composite material sheets; placing these carbon fiber composite material sheets into a microwave heating cavity; performing the carbon fiber composite material sheets to a first microwave heat treatment in an oxygen-free atmosphere containing inert gas in the microwave heating cavity to form a plurality of semi-finished carbon fiber materials; performing the semi-finished carbon fiber materials to a second microwave heat treatment in a microwave heating cavity in a low-oxygen atmosphere containing mixed air to form a plurality of regenerated carbon fiber materials; and entering the regenerated carbon fiber materials to a cooling container from the microwave heating cavity. The method is simple and convenient to operate, and the regenerated carbon fiber produced by microwave processs has the characteristics of the original carbon fiber and is an available renewable resource.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="173" publication-number="202623985">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623985</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147035</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>射出機的節能控制方法</chinese-title>
        <english-title>ENERGY SAVING CONTROL METHOD OF INJECTION MACHINE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250218B">B29C45/76</main-classification>
        <further-classification edition="200601120250218B">G05B19/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李柏昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, BO-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳尹軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YIN SYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡宗憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, TSUNG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何家瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, CHIA-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡國信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, GUO-SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種射出機的節能控制方法包括：根據射出機的歷史生產參數以及對應歷史生產參數的歷史生產能耗來訓練能耗預測模型；根據歷史生產參數以及對應歷史生產參數的歷史產品重量差異來訓練重量差異預測模型；根據目標函數執行最佳化演算法，藉此嘗試多組生產參數，將每組生產參數輸入能耗預測模型與重量差異預測模型以取得預測生產能耗與預測產品重量差異，並據以尋找最佳化目標函數的一組最佳生產參數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An energy saving control method of an injection machine includes: training an energy consumption prediction model according to historical production parameters of the injection machine and a historical production energy consumption corresponding to the historical production parameters; training a weight difference prediction model according to the historical production parameters and a historical production weight difference corresponding to the historical production parameters; performing an optimization algorithm based on an objective function to try multiple sets of production parameters so as to input each set of production parameters into the energy consumption prediction model and the weight difference prediction model to obtain a predicted production energy consumption and a predicted product weight difference, thereby searching an optimal set of production parameters which optimizes the objective function.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1,S2,S3,S4,S5:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="174" publication-number="202625120">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625120</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147036</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>輔助幼兒學習說話之教具</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250304B">G09B19/04</main-classification>
        <further-classification edition="200601120250304B">G09B19/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣亞學校財團法人育達科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鳳卿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡宜姗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鳳卿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡宜姗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉安鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作是提供一種輔助幼兒學習說話之教具，其包含：複數張句子元素圖卡、複數個人形偶、一句子元素轉盤、一數字轉盤、一情境空間配置圖卡、一句子結構圖卡，上述構件於遊戲前係放置於一區域範圍內，且彼此之間係互相具有間隔；藉由上述之教具，乃可輔助學語期的幼兒以扮家家酒的方式，配合指導者或家長的口語引領，一方面可藉由句子元素圖卡學習新的詞彙，另方面可透過人形偶與各句子元素圖卡可相互磁吸於一起的特性，幼兒可自己動手操作而將人物圖卡及時間圖卡及置於情境空間配置圖卡中之地點圖卡及事件圖卡        &lt;br/&gt;，搭配句子元素轉盤及數字轉盤的選定，而將上述圖卡移位至句子結構圖卡之對應欄位中，而完成一個句子的排列，遊戲過程中充分的運用了幼兒的視覺、聽覺、觸覺、思覺，藉此，以提昇幼兒的邏輯及認知能力，並透過移位至句子結構圖卡上之人物圖卡、時間圖卡、地點圖卡、事件圖卡的順序，來教導及協助幼兒說出完整的句子。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:輔助幼兒學習說話之教具</p>
        <p type="p">10:句子元素圖卡</p>
        <p type="p">11:人物圖卡</p>
        <p type="p">12:時間圖卡</p>
        <p type="p">13:地點圖卡</p>
        <p type="p">14:事件圖卡</p>
        <p type="p">20:人形偶</p>
        <p type="p">30:句子元素轉盤</p>
        <p type="p">40:數字轉盤</p>
        <p type="p">50:情境空間配置圖卡</p>
        <p type="p">60:句子結構圖卡</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="175" publication-number="202625338">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625338</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147042</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鼓風機馬達散熱結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250414B">H02K9/06</main-classification>
        <further-classification edition="200601120250414B">F04D29/44</further-classification>
        <further-classification edition="200601120250414B">F04D29/58</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>品陞金屬工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯宛禎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯育任</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱世仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鼓風機馬達散熱結構，其包含有一馬達及一風扇組，馬達具有一輸出軸桿，而風扇組具有至少一設於輸出軸桿端部之扇輪，扇輪具有一扇盤，且扇盤周緣具複數等距佈設之扇葉，扇輪於扇盤中相鄰馬達的表面設有一導流件，又導流件具有複數呈等角放射狀設置之導流片，而導流片端部斷面呈相鄰馬達之一較薄的葉刃部及貼合於扇盤之表面一較厚的葉背部，藉此，能利用扇輪上的導流件產生導引氣流，以將馬達內部熱氣排出，使其可被扇輪快速帶出，而達到散熱、降溫之目，進而延長馬達使用壽命。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:馬達</p>
        <p type="p">11:馬達殼</p>
        <p type="p">12:通氣孔</p>
        <p type="p">15:輸出軸桿</p>
        <p type="p">20:風扇組</p>
        <p type="p">21:扇輪</p>
        <p type="p">22:扇盤</p>
        <p type="p">23:軸孔凸柱</p>
        <p type="p">25:扇葉</p>
        <p type="p">26:內環空間</p>
        <p type="p">27:外環空間</p>
        <p type="p">30:導流件</p>
        <p type="p">31:導流片</p>
        <p type="p">311:葉刃部</p>
        <p type="p">312:葉背部</p>
        <p type="p">315:導氣面</p>
        <p type="p">32:安裝盤體</p>
        <p type="p">33:軸孔</p>
        <p type="p">341:結合穿孔</p>
        <p type="p">342:結合鎖孔</p>
        <p type="p">345:鎖固件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="176" publication-number="202624601">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624601</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147044</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>按鍵式數字鎖</chinese-title>
        <english-title>BUTTON-TYPE COMBINATION LOCK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250207B">E05B37/20</main-classification>
        <further-classification edition="200601120250207B">E05B15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>優護國際企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABA LOCKS INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李謀政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作提出一種按鍵式數字鎖，其具有變更密碼及一重設狀態。按鍵式數字鎖包含一外殼、一鎖心組件、一密碼盤組件、一鎖頭、及一重設裝置。鎖心組件包含一開鎖單元及一重設單元。密碼盤組件包含複數按鍵組、一開鎖帶動片、一固定帶動片、及一重設帶動片。各按鍵組具有一本體及一導套，導套套設於本體。按鍵組穿設於固定帶動片。重設帶動片套設於按鍵組。當本創作在重設狀態時，重設裝置連接於重設單元，重設單元位於一重設位置，重設帶動片推抵於導套，藉此各導套位於一第一位置。本創作藉由重設裝置和重設單元搭配密碼盤組件，讓使用者能夠重設密碼。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A button-type combination lock which has a reset state comprises a housing, a lock core assembly, a password pad assembly, a latch, and a reset device. The lock core assembly includes an unlocking unit and a resetting unit. The password pad assembly includes multiple button sets, an unlocking driving piece, a fixing driving piece, and a resetting driving piece. Each one of the button sets has a main body and a guiding sleeve, and the guiding sleeve is sleeved on the main body. The button sets are mounted through the fixing driving piece. The resetting driving piece is sleeved on the button sets. When the button-type combination lock is under the reset state, the reset device is connected to the resetting unit, the resetting unit is in a resetting position, and the resetting driving piece presses the guiding sleeves, thereby placing the guiding sleeves in a first position. The button-type combination lock allows the user to reset password by the reset device and the resetting unit combined with the password pad assembly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:外殼</p>
        <p type="p">2:鎖心組件</p>
        <p type="p">41:按鍵組</p>
        <p type="p">5:鎖頭</p>
        <p type="p">11:操作面</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="177" publication-number="202625336">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625336</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147048</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磁性裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250210B">H02K7/09</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台全電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIGENE ELECTRIC MACHINERY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石軒光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHR, SHIUAN-GUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張宇辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YU-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝進來</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHIN-LAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種磁性裝置包含一套筒、一固持組件及一磁鐵。該套筒包括一端壁，及由該端壁外周緣延伸而出的一圍壁。該端壁與該圍壁共同界定出一容置空間。該套筒界定連通於該容置空間的一環形避讓空間。該固持組件設置於該容置空間內並與該端壁相間隔。該磁鐵設置於該容置空間內並且被該固持組件固持而抵靠於該端壁。該磁鐵包括對應於該環形避讓空間的一環形角隅部。該磁性裝置藉由該固持組件，將該磁鐵安裝於套筒內。在長期使用下，該磁鐵仍維持在特定位置，不易脫落。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:磁性裝置</p>
        <p type="p">1:套筒</p>
        <p type="p">11:端壁</p>
        <p type="p">111:端壁體</p>
        <p type="p">112:開口</p>
        <p type="p">113:簧片</p>
        <p type="p">12:圍壁</p>
        <p type="p">14:環形凸出壁體</p>
        <p type="p">2:固持組件</p>
        <p type="p">21:彈性卡扣件</p>
        <p type="p">3:磁鐵</p>
        <p type="p">31:環形角隅部</p>
        <p type="p">9:馬達主軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="178" publication-number="202625230">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625230</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147049</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>按鍵結構</chinese-title>
        <english-title>KEY STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250227B">H01H13/83</main-classification>
        <further-classification edition="200601120250227B">H01H13/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光寶科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林格祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KO-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提出一種按鍵結構。此按鍵結構包括一電路板、至少一發光單元、一導光板以及一鍵帽。電路板具有一觸控感應電路。至少一發光單元電性連接電路板並位於電路板之上方。導光板位於至少一發光單元之鄰側及電路板之上方。鍵帽位於至少一發光單元、導光板與電路板之上方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A key structure is provided. The key structure comprises a circuit board, at least one light-emitting unit, a light guide plate and a keycap. The circuit board has a touch sensing circuit. The at least one light-emitting unit is electrically connected to the circuit board and is located above the circuit board. The light guide plate is located adjacent to the at least one light-emitting unit and above the circuit board. The keycap is located above the at least one light-emitting unit, the light guide plate and the circuit board.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:按鍵結構</p>
        <p type="p">110:電路板</p>
        <p type="p">120:發光單元</p>
        <p type="p">130:導光板</p>
        <p type="p">140:鍵帽</p>
        <p type="p">140P:透光符號區</p>
        <p type="p">141:頂部</p>
        <p type="p">142:側延伸部</p>
        <p type="p">150:反射片</p>
        <p type="p">160:擴散板</p>
        <p type="p">170:透光膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="179" publication-number="202624593">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624593</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147050</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>模組化共桿</chinese-title>
        <english-title>MODULAR COMMON POLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120250117B">E01F9/623</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達運精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DARWIN PRECISIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚弦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種模組化共桿，包含主桿結構及機箱，主桿結構包含主桿體及主桿外觀模組，主桿外觀模組包含多個主桿外觀件。主桿體包含第一主桿部及第二主桿部，且第二主桿部與第一主桿部縱向相連。主桿外觀件掛設於主桿體。機箱包含機殼、機箱門 及機箱外觀件，機殼具有頂面、底面及主體面，頂面及底面相對；機箱門設置於主體面的一側；主體面與頂面及底面連接且建構容置空間。第二主桿部縱向插設於頂面的機箱連接口。機箱外觀件掛設於機殼的主體面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A modular common pole includes a main-pole structure and a chassis. The main-pole structure includes a main-pole body and a main-pole appearance module. The main-pole body includes a first main-pole portion and a second main-pole portion, and the second main-pole portion is longitudinally connected to the first main-pole portion. The main-pole appearance parts are hung on the main-pole body. The chassis includes a chassis shell, a chassis door and chassis exterior parts. The chassis shell has a top surface, a bottom surface and a body surface. The top surface and the bottom surface are opposite. The chassis door is set on one side of the body surface. The body surface is connected to the top surface and the bottom surface and forms an accommodation space. The second main-pole portion is longitudinally inserted into the chassis connection opening on the top surface. The chassis appearance parts are hung on the body surface of the chassis.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:模組化共桿</p>
        <p type="p">10:主桿結構</p>
        <p type="p">110:主桿外觀模組</p>
        <p type="p">112:主桿外觀件</p>
        <p type="p">26:頂部裝置</p>
        <p type="p">30:機箱</p>
        <p type="p">301:機殼</p>
        <p type="p">302:機箱外觀件</p>
        <p type="p">303:機箱門</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="180" publication-number="202624643">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624643</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147053</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用以密封過濾裝置的方法以及用以密封過濾裝置的活塞裝置</chinese-title>
        <english-title>METHOD FOR POTTING FILTRATION DEVICE AND A PISTON DEVICE FOR POTTING FILTRATION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">F16J15/16</main-classification>
        <further-classification edition="200601120241230B">B01D33/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佳世達科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QISDA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張順富</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, SHUN-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHUN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊錦文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIN-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供用以密封過濾裝置的方法以及用以密封過濾裝置的活塞裝置。用以密封過濾裝置的方法包含：使用活塞裝置以使接著劑附著於過濾裝置的端部；使附著於過濾裝置的端部的接著劑固化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for potting a filtration device and a piston device for potting a filtration device are provided. The method for potting a filtration device includes: apply an adhesive to an end of a filtration device through a piston device; curing the adhesive attached to the end of the filtration device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">30:接著劑</p>
        <p type="p">100:活塞裝置</p>
        <p type="p">101:管</p>
        <p type="p">101S:空腔</p>
        <p type="p">102:活塞</p>
        <p type="p">103:推桿</p>
        <p type="p">104:支座</p>
        <p type="p">111S:第一空腔部</p>
        <p type="p">112S:第二空腔部</p>
        <p type="p">200:過濾裝置</p>
        <p type="p">200E:端部</p>
        <p type="p">201:殼體</p>
        <p type="p">201H:開口</p>
        <p type="p">202:中空纖維束</p>
        <p type="p">212:中空纖維膜</p>
        <p type="p">D1,D2:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="181" publication-number="202625100">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625100</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147057</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像特徵比對定位系統與方法</chinese-title>
        <english-title>IMAGE FEATURE MATCHING LOCALIZATION SYSTEM AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250922B">G06V10/762</main-classification>
        <further-classification edition="202201120250922B">G06V10/75</further-classification>
        <further-classification edition="202201120250922B">G06V10/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊耀欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YAO-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范庭維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, TING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇奕宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, YI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂坤憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, KUN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供影像特徵比對定位方法與系統。對一局部影像與複數個全域影像進行特徵分析，以取得該局部影像與該些全域影像的個別特徵點及個別特徵描述資訊。將該局部影像進行區塊化，以得到複數個網格區塊。將該局部影像之一第一網格區塊之該些特徵點與該些全域影像之該些特徵點進行特徵比對以得到複數個特徵點比對結果。對該些特徵點比對結果進行叢集分析，計算該第一網格區域所對應之該全域影像的一目標區域，其中，該目標區塊滿足一第一條件，該第一條件指示該目標區塊的一第一特徵點平均相鄰距離值小於或等於該局部影像之該第一網格區域之一第二特徵點平均相鄰距離值。根據一特徵點比對關係與根據是否對應於該全域影像之該目標區域，決定保留或刪除該第一網格區域內之該些特徵點。分析該局部影像的該第一網格區域之一第一管線方向及該全域影像的該目標區域之一第二管線方向，計算該局部影像之該第一管線方向與一第一特徵點迴歸線之間一第一夾角，計算該全域影像之該第二管線方向與一第二特徵點迴歸線之一第二夾角。調整特徵點選取，計算一特徵點集合使得該第一夾角與該第二夾角之一夾角差小於一門檻值。根據該全域影像之一迴歸分析結果之一特徵點分布，進行外輪廓範圍分析，取得一網格區塊定位結果。根據該些網格區塊對應於該些全域影像之一定位結果集合進行空間聯集處理，並計算外輪廓空間範圍，即為該局部影像在該些全域影像上之一定位結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The application provides a method and a system for image feature matching and positioning. Feature analysis is performed on a partial image and multiple global images to obtain individual feature points and feature descriptions for each image. The partial image is divided into multiple grid blocks. Feature points in a first grid block of the partial image are matched with feature points in the global images, producing multiple feature point matching results. These matching results are analyzed through clustering to calculate a target area in the global image that corresponds to the first grid region. This target block meets a specific condition: the average neighboring distance of a first feature point in the target block is less than or equal to the average neighboring distance of a second feature point in the first grid region of the partial image. Based on feature point matching relationships and whether they correspond to the target area in the global image, it is determined whether to retain or remove feature points within the first grid region. The first pipeline direction of the first grid region in the partial image and the second pipeline direction of the target area in the global image are analyzed. The first angle between the first pipeline direction of the partial image and the regression line of a first feature point is calculated, as is the second angle between the second pipeline direction of the global image and the regression line of a second feature point. Feature point selection is adjusted to calculate a feature point set so that the angle difference between the first and second angles is below a threshold. Based on the feature point distribution in the global image’s regression analysis results, an outer contour range analysis is conducted to obtain a grid block positioning result. Finally, spatial union processing is applied to the grid block positioning results corresponding to the global images, calculating an outer contour spatial range, which is the positioning result of the partial image on the global images.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:局部影像</p>
        <p type="p">103:全域影像</p>
        <p type="p">110-153:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="182" publication-number="202625784">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625784</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147067</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置與其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND FORMING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P76/00</main-classification>
        <further-classification edition="202601120260302B">H10P50/00</further-classification>
        <further-classification edition="202601120260302B">H10P14/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>能創半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWERX SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳韋霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種形成半導體裝置的方法包含在介電層上形成第一晶種層，在第一晶種層上形成第二晶種層，在第二晶種層上形成導線層，以導線層為遮罩，蝕刻第二晶種層，以第二晶種層為遮罩，蝕刻第一晶種層，在蝕刻第一晶種層之後，蝕刻導線層與第二晶種層，其中在蝕刻導線層與第二晶種層之後，第一晶種層與第二晶種層之間具有底切。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of forming a semiconductor device includes forming a first seed layer over a dielectric layer, forming a second seed layer over the first seed layer, forming a wiring layer over the second seed layer, etching the second seed layer by using the wiring layer as mask, etching the first seed layer by using the second seed layer as mask, etching the second seed layer and the wiring layer after etching the first seed layer, in which an undercut is formed between the first seed layer and the second seed layer after etching the second seed layer and the wiring layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">140:介電層</p>
        <p type="p">150、160:晶種層</p>
        <p type="p">150E、160E:第五部分</p>
        <p type="p">150F、160F:第六部分</p>
        <p type="p">170:導線層</p>
        <p type="p">170B:第二部分</p>
        <p type="p">170C:第三部分</p>
        <p type="p">a:角度</p>
        <p type="p">T1:厚度</p>
        <p type="p">UC2、UC3:底切</p>
        <p type="p">W6、W7、W8、W9、W10、W11:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="183" publication-number="202625191">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625191</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147068</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>快閃記憶體裝置及其抹除方法</chinese-title>
        <english-title>FLASH MEMORY APPARATUS AND ERASING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250310B">G11C16/14</main-classification>
        <further-classification edition="200601120250310B">G11C16/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華邦電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINBOND ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宗仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUNG-ZEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種快閃記憶體裝置及其抹除方法。所述抹除方法包括下列步驟：對記憶體區塊中的目標記憶體區塊施加抹除電壓；利用第一抹除驗證電壓來對目標記憶體區塊進行第一抹除驗證；在目標記憶體區塊中存在有未通過第一抹除驗證的記憶胞群組的情況下，利用高於第一抹除驗證電壓的第二抹除驗證電壓來對目標記憶體區塊進行第二抹除驗證；以及根據第一抹除驗證與第二抹除驗證的驗證結果，設定目標記憶體區塊中的每個記憶胞群組所對應的第一抹除旗標及第二抹除旗標，以將每個記憶胞群組進行分類，且據以調整抹除電壓的增加量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A flash memory apparatus and an erasing method thereof are provided. The erasing method includes following steps: applying an erase voltage to a target memory block among memory blocks; performing a first erase verification on the target memory block using a first erase verification voltage; performing a second erase verification on the target memory block using a second erase verification voltage higher than the first erase verification voltage in a case that a memory cell group failing the first erase verification is in the target memory block; and setting a first erase flag and a second erase flag corresponding to each memory cell group in the target memory block according to verification results of the first erase verification and the second erase verification to classify each memory cell group and accordingly adjust increase amount of the erase voltage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">EV0:第一抹除驗證電壓</p>
        <p type="p">EV1:第二抹除驗證電壓</p>
        <p type="p">S200~S206:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="184" publication-number="202623759">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623759</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147072</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>指診套裝置及建立肛門檢查判斷系統的方法</chinese-title>
        <english-title>DIGITAL RECTAL EXAMINATION DEVICE AND METHOD FOR ESTABLISHING AN ANORECTAL INSPECTION JUDGMENT SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241219B">A61B1/31</main-classification>
        <further-classification edition="200601120241219B">A61B1/04</further-classification>
        <further-classification edition="200601120241219B">A61B1/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立成功大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張志涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHUN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱芎蓉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHIUNG-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊秉翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, PING-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種指診套裝置及建立肛門檢查判斷系統的方法。指診套裝置包含指套本體、微型鏡頭以及發光條。指套本體包含互相接合的硬質端部以及軟質套接部，其中硬質端部為一透明殼體。微型鏡頭設置在硬質端部內發光條，從軟質套接部的內部延伸至微型鏡頭周圍。本發明的指診套裝置結合了視覺與觸覺檢查方式，提升了對肛門及直腸內壁的檢查精準度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a digital rectal examination device and a method for establishing an anorectal inspection judgment system. The digital rectal examination device includes a finger cover body, a miniature camera, and a light bar. The finger cover body includes a rigid end portion and a soft fitting portion that are joined together, in which the rigid end portion is a transparent casing. The miniature camera is disposed inside the rigid end portion, and the light bar extends from the interior of the soft fitting portion to a position near the miniature camera. The digital rectal examination device of the present invention combines both visual and tactile examination methods, thereby improving the accuracy of inspecting the anorectal and rectal walls.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:指診套裝置</p>
        <p type="p">11:指套本體</p>
        <p type="p">11a:接合處</p>
        <p type="p">111:硬質端部</p>
        <p type="p">112:軟質套接部</p>
        <p type="p">112a:開口</p>
        <p type="p">12:微型鏡頭</p>
        <p type="p">13:發光條</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="185" publication-number="202625405">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625405</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147073</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於CRYSTALS-Kyber運算的加密系統及金鑰生成方法</chinese-title>
        <english-title>ENCRYPTION SYSTEM FOR CRYSTALS-KYBER AND KEY GENERATION METHOD USE THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">H04L9/08</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立成功大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卿文龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIN, WEN-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊于華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YU-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周士翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, SHIH-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳祺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於CRYSTALS-Kyber運算的加密系統，其包括SHA-3運算模組、取樣模組以及多模運算模組。SHA-3運算模組配置為基於隨機數值產生多個雜湊值。取樣模組電性連接該SHA-3運算模組，且配置為對該等雜湊值進行取樣以產生對應一多項式環的多個係數，其中該多項式環係用於生成公鑰與密鑰。多模運算模組電性連接取樣模組，配置為對該等係數選擇性地進行數論轉換、數論反轉換、點乘、模加法及模減法中之一者的運算，其中多模運算模組包括一基-2蝴蝶運算單元與至少一基-4蝴蝶運算單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cryptographic system for CRYSTALS-Kyber includes a SHA-3 operation module, a sampling module, and a multi-mode operation module. The SHA-3 operation module is configured to generate multiple hash values based on random values. The sampling module is electrically connected to the SHA-3 operation module and configured to sample the hash values to generate multiple coefficients corresponding to a polynomial ring, in which the polynomial ring is used to generate public and private keys. The multi-mode operation module is electrically connected to the sampling module and configured to selectively perform one of number theoretic transform, number theoretic inverse transform, dot multiplication, modular addition, and modular subtraction on the coefficients. The multi-mode operation module includes a radix-2 butterfly operation unit and at least one radix-4 butterfly operation unit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:用於CRYSTALS-Kyber運算的加密系統</p>
        <p type="p">110:SHA-3運算模組</p>
        <p type="p">120:取樣模組</p>
        <p type="p">121:第一取樣單元</p>
        <p type="p">122:第二取樣單元</p>
        <p type="p">123:第三取樣單元</p>
        <p type="p">130:多模運算模組</p>
        <p type="p">140:係數重排列模組</p>
        <p type="p">150:暫存器模組</p>
        <p type="p">160:壓縮運算模組</p>
        <p type="p">170:解壓縮運算模組</p>
        <p type="p">180:控制模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="186" publication-number="202625725">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625725</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147074</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>濕製程設備</chinese-title>
        <english-title>WET PROCESS DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/00</main-classification>
        <further-classification edition="202601120260302B">H10P50/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>政漢電子科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JHENG HAN ELECTRONIC TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡漢平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, HAN PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇培文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, PEI WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種濕製程設備，包括第一槽體、晶舟及噴流裝置。第一槽體包括相對設置的二槽壁及槽底板。晶舟可活動地設置於第一槽體內並包括多個插槽，且多個插槽沿任一該二槽壁的一寬度方向彼此間隔設置。噴流裝置包括至少一上噴流管及至少一下噴流管，上噴流管沿至少一該槽壁的寬度方向設置，並包括多個上噴流孔。下噴流管位於晶舟的下方並包括多個下噴流孔。多個上噴流孔及多個下噴流孔相對該晶舟以不同方向朝多個插槽噴出處理液。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wet process device includes a first tank body, a wafer boat, and a spray device. The first tank body includes two opposite tank walls and a tank bottom plate. The wafer boat is movably disposed in the first tank body and includes a plurality of slots spaced apart from each other in a width direction of any one of the tank walls. The spray device includes at least one upper spray pipe and at least a lower spray pipe. The upper spray pipe is arranged in the width direction of the tank wall and includes a plurality of upper spray holes. The lower spray pipe is located below the wafer boat and includes a plurality of lower spray holes. The upper spray holes and the lower spray holes spray the processing liquid toward the slots in different directions relative to the wafer boat.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:濕製程設備</p>
        <p type="p">10:第一槽體</p>
        <p type="p">11:槽壁</p>
        <p type="p">13:前槽壁</p>
        <p type="p">14:後槽壁</p>
        <p type="p">15:層流板</p>
        <p type="p">20:第二槽體</p>
        <p type="p">21:外壁</p>
        <p type="p">30:晶舟</p>
        <p type="p">31:插槽</p>
        <p type="p">50:噴流裝置</p>
        <p type="p">51:上噴流管</p>
        <p type="p">511:上噴流孔</p>
        <p type="p">52:上供液管</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="187" publication-number="202623976">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623976</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147077</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>新型混合驅動七自由度仿人機械手臂</chinese-title>
        <english-title>A NOVEL HYBRID-DRIVEN SEVEN-DEGREE-OF-FREEDOM (7-DOF) ANTHROPOMORPHIC MANIPULATOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">B25J17/02</main-classification>
        <further-classification edition="200601120241230B">B25J9/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中興大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHUNG HSING UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李聯旺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, LIAN-WANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林浩庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HAO-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李硯諶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YEN-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊晉淯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JIN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧亮宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, LIANG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>時渝恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種新型混合驅動七自由度仿人機械手臂，其包含：其主要透過分別於肩關節裝置，配置第一至第三軸機構；藉以於分別進行肩關節之水平、屈伸及外展運動；而於肘關節裝置配置第四及第五軸機構，以分別進行肘關節之屈伸及旋轉運動，並於腕關節裝置配置第六及第七軸機構，以分別對腕關節進行屈伸及旋轉運動；藉此，本發明係可根據人體手臂的生理結構、關節順序與運動特徵，以達到仿人機械手臂於七個自由度之作動；其中，第二至第七軸機構，係可分別透過設置具備仿生特性的氣壓肌肉致動器（Pneumatic Muscle Actuator, PMA），且第四軸至第七軸機構係可結合扭力彈性元件以組成並聯彈性體致動關節，並利用導入分數階自適應擴張狀態觀測器（Fractional Order Adaptive Extended State Observer, FoAESO），並結合分數階滑模控制（Fractional Order Sliding Mode Control, FoSMC），使解決PMA於控制能量消耗、模型的不確定性及外部干擾的問題，實現系統對總干擾的估測與補償，提升整體控制的穩定性，同時可提升控制精度並降低其能量之消耗者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a novel hybrid-driven seven-degree-of-freedom (7-DOF) anthropomorphic manipulator, comprising the following: The shoulder joint assembly is equipped with the first to third-axis mechanisms, enabling horizontal, flexion-extension, and abduction movements of the shoulder joint, respectively. The elbow joint assembly is equipped with the fourth and fifth-axis mechanisms to perform flexion-extension and rotational movements of the elbow joint, respectively. Additionally, the wrist joint assembly is equipped with the sixth and seventh-axis mechanisms to achieve flexion-extension and rotational movements of the wrist joint, respectively. This invention is designed to mimic the physiological structure, joint sequence, and motion features of the human arm to achieve the functionality of an anthropomorphic manipulator. The second to seventh-axis mechanisms incorporate pneumatic muscle actuators (PMA) with bionic characteristics. Furthermore, the fourth to seventh-axis mechanisms integrate torque elastic elements to form parallel elastic actuated joints. The fractional-order adaptive extended state observer (FoAESO) is proposed and integrated with the fractional-order sliding mode control (FoSMC). This integration achieves system estimation and compensation of total disturbances. It enhances the overall stability of the control, improving control accuracy, and reducing energy consumption.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:肩關節裝置</p>
        <p type="p">11:第一軸機構</p>
        <p type="p">111:肩傳動軸</p>
        <p type="p">112:水平驅動裝置</p>
        <p type="p">12:第二軸機構</p>
        <p type="p">121:肩屈伸轉盤</p>
        <p type="p">122:肩屈伸氣壓肌肉致動裝置</p>
        <p type="p">13:第三軸機構</p>
        <p type="p">131:基座</p>
        <p type="p">132:外展轉盤</p>
        <p type="p">133:肩外展氣壓肌肉致動裝置</p>
        <p type="p">14:支架</p>
        <p type="p">141:平板</p>
        <p type="p">2:肘關節裝置</p>
        <p type="p">21:肘座</p>
        <p type="p">22:第四軸機構</p>
        <p type="p">222:肘屈伸轉盤</p>
        <p type="p">223:肘屈伸氣壓肌肉致動裝置</p>
        <p type="p">224:肘屈伸扭力彈性元件</p>
        <p type="p">23:第五軸機構</p>
        <p type="p">231:肘傳動裝置</p>
        <p type="p">232:肘旋轉盤</p>
        <p type="p">233:肘旋轉氣壓肌肉致動裝置</p>
        <p type="p">234:肘旋轉扭力彈性元件</p>
        <p type="p">24:連桿</p>
        <p type="p">3:腕關節裝置</p>
        <p type="p">31:腕座</p>
        <p type="p">32:第六軸機構</p>
        <p type="p">321:腕傳動軸</p>
        <p type="p">322:腕屈伸轉盤</p>
        <p type="p">323:腕屈伸氣壓肌肉致動裝置</p>
        <p type="p">324:腕屈伸扭力彈性元件</p>
        <p type="p">33:第七軸機構</p>
        <p type="p">331:腕傳動裝置</p>
        <p type="p">332:腕旋轉盤</p>
        <p type="p">333:腕旋轉氣壓肌肉致動裝置</p>
        <p type="p">334:腕旋轉扭力彈性元件</p>
        <p type="p">34:傳動桿</p>
        <p type="p">4:操作裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="188" publication-number="202625538">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625538</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147078</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>印刷電路熱交換器及其最佳化的方法與模擬系統</chinese-title>
        <english-title>PRINTED CIRCUIT HEAT EXCHANGER, METHOD FOR OPTIMIZING THEREOF, AND SYSTEM THEREFOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250512B">H05K7/20</main-classification>
        <further-classification edition="200601120250512B">F28F1/10</further-classification>
        <further-classification edition="200601120250512B">G05D7/06</further-classification>
        <further-classification edition="200601120250512B">F16K15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立成功大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>闕志哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUEH, CHIH-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周哲言</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, CHE-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許智為</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李威聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種最佳化印刷電路熱交換器及其最佳化的方法，其中，該方法包括：輸入預設幾何參數組至評估模型以產生模擬熱交換器以計算效能評估參數並根據該效能評估參數決定該模擬熱交換器是否為最佳化印刷電路熱交換器，並將呈現有最佳效能評估參數之預設幾何參數組輸出作為最佳化幾何參數組；通過系統性地調整流體擋板的關鍵幾何參數，本發明可依據特定需求的流場特性來決定流體檔板的最佳幾何配置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses an optimized printed circuit heat exchanger and a method for optimizing thereof. The method comprises: inputting a default geometric parameter set to an evaluation model so as to generate a simulated heat exchanger for calculation of an efficacy evaluation index; determining whether the simulated heat exchanger is an optimal printed circuit heat exchanger according to the efficacy evaluation index; and outputting an optimized geometric parameter set with reference to the default geometric parameter set presenting the optimal efficacy evaluation index. Through systematic adjustment of key geometric parameters of the flow baffles, an optimal geometric configuration of the flow baffle can be determined according to specific requirement of flow fields.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(步驟S1至S3)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="189" publication-number="202624082">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624082</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147079</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於檢測水中微塑膠及生物顆粒的移動式水質檢測裝置</chinese-title>
        <english-title>PORTABLE INSPECTION DEVICE FOR UNDERWATER MICROPLASTICS AND BIOLOGICAL PARTICLES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120241230B">B64C39/02</main-classification>
        <further-classification edition="200601120241230B">G01N27/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立虎尾科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL FORMOSA UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>雲林縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡松霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, SUNG-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許智為</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李威聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露書提出一種用於檢測水中微塑膠及生物顆粒的移動式水質檢測裝置，包括：一採樣器，該採樣器具有：一採樣控制器；一泵浦，用以輸出一正壓和一負壓；一採樣瓶，連接該泵浦；一採樣管，其中，該採樣管的一端連接該採樣瓶，當該採樣控制器開啟該採樣管且該泵浦輸出該負壓時，該採樣管用以進行採樣，且採樣取得的液體儲存於該採樣瓶；一檢測器，具有一阻抗感測器、一微流道和複數個感測電極；其中，一連通管連接該採樣瓶和該檢測器，當該採樣控制器關閉該採樣管且該泵浦輸出該正壓時，該阻抗感測器藉由該複數個感測電極檢測通過該微流道之該液體的阻抗。藉此，由於可以在無人載具上即時檢測，所以在每次檢測時需要抽取的樣本量少，且在檢測完後可以直接把採樣的樣品再釋放回原本採樣的地方，減少了碳足跡及樣本污染的可能性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure presents a portable inspection device designed for the detection of underwater microplastics and biological particles. The device includes a sampler, which consists of a sampling controller, a pump capable of generating both positive and negative pressure, a sampling bottle connected to the pump, and a sampling tube, with one end of the sampling tube attached to the sampling bottle. When the sampling controller opens the sampling tube and the pump generates negative pressure, the sampling tube is utilized for collecting samples, and the extracted liquid is stored in the sampling bottle. Additionally, the device features an electrochemical impedance sensor and a detector equipped with a microchannel and multiple sensing electrodes, which are connected to the electrochemical impedance sensor. A connecting tube links the sampling bottle to the detector by a channel selector. When the sampling controller closes the sampling tube and the pump generates positive pressure, the impedance sensor measures the impedance of the liquid flowing through the microchannel via the sensing electrodes. This portable device enables real-time detection and requires only a small sample volume for each test. Furthermore, the collected sample can be returned to its original location after testing, thereby minimizing the carbon footprint and reducing the risk of sample contamination.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(100):移動式水質檢測裝置</p>
        <p type="p">(10):採樣器</p>
        <p type="p">(11):採樣控制器</p>
        <p type="p">(12):泵浦</p>
        <p type="p">(13):採樣瓶</p>
        <p type="p">(14):採樣管</p>
        <p type="p">(15):連通管</p>
        <p type="p">(20):檢測器</p>
        <p type="p">(21):阻抗感測器</p>
        <p type="p">(22):微流道</p>
        <p type="p">(23):感測電極</p>
        <p type="p">(24):前處理器</p>
        <p type="p">(25):前處理控制器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="190" publication-number="202625352">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625352</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147081</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電源供應器與增壓控制方法</chinese-title>
        <english-title>POWER SUPPLY AND BOOST CONTROL METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250425B">H02M3/156</main-classification>
        <further-classification edition="200701120250425B">H02M1/42</further-classification>
        <further-classification edition="200601120250425B">G05F1/565</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>技嘉科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIGA-BYTE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃順治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHUN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>毛黛娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAO, TAI-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林立凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, LI-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃政誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電源供應器與增壓控制方法，電源供應器具有功率因數校正單元、感測單元與調壓單元。功率因數校正單元產生目標電壓與輸出電壓；感測單元連接於功率因數校正單元，感測單元根據目標電壓與輸出電壓的差值判斷功率因數校正單元是否處於超載狀態；調壓單元連接於功率因數校正單元與感測單元，功率因數校正單元於超載狀態時，感測單元驅動調壓單元向功率因數校正單元提供補償電壓，功率因數校正單元根據輸出電壓與補償電壓的總和輸出時間對應於超載狀態的維持時間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power supply and boost control method, wherein the power supply comprises a power factor correction unit, a sensing unit, and a voltage regulation unit. The power factor correction unit generates a target voltage and an output voltage. The sensing unit, connected to the power factor correction unit, determines whether the power factor correction unit is in an overloaded state based on the difference between the target voltage and the output voltage. The voltage regulation unit, connected to the power factor correction unit and the sensing unit, provides a compensation voltage to the power factor correction unit when it is in an overloaded state, as driven by the sensing unit. The power factor correction unit outputs a time corresponding to the duration of the overloaded state based on the sum of the output voltage and the compensation voltage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電源供應器</p>
        <p type="p">110:輸入端</p>
        <p type="p">120:輸出端</p>
        <p type="p">130:功率因數校正單元</p>
        <p type="p">140:感測單元</p>
        <p type="p">150:調壓單元</p>
        <p type="p">200:負載設備</p>
        <p type="p">310:目標電壓</p>
        <p type="p">320:輸出電壓</p>
        <p type="p">330:補償電壓</p>
        <p type="p">340:外部電力</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="191" publication-number="202625277">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625277</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147082</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電解質組成物以及包含其之鋁電池</chinese-title>
        <english-title>ELECTROLYTE COMPOSITION AND ALUMINUM BATTERY CONTAINING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120241210B">H01M10/056</main-classification>
        <further-classification edition="201001120241210B">H01M10/054</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞福儲能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APH EPOWER CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡施柏達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, SHIH PO-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊竣傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHUN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪偉捷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, WEI-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃琬雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WAN-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李春霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種電解質組成物，其包含鋁鹽、離子液體以及酞菁配位化合物。鋁鹽中之陰離子為F        &lt;sup&gt;-&lt;/sup&gt;、Cl        &lt;sup&gt;-&lt;/sup&gt;、Br        &lt;sup&gt;-&lt;/sup&gt;、I        &lt;sup&gt;-&lt;/sup&gt;、BF        &lt;sub&gt;4&lt;/sub&gt;&lt;sup&gt;-&lt;/sup&gt;、PF        &lt;sub&gt;6&lt;/sub&gt;&lt;sup&gt;-&lt;/sup&gt;、[(CF        &lt;sub&gt;3&lt;/sub&gt;SO        &lt;sub&gt;2&lt;/sub&gt;)        &lt;sub&gt;2&lt;/sub&gt;N]        &lt;sup&gt;-&lt;/sup&gt;、CF        &lt;sub&gt;3&lt;/sub&gt;SO        &lt;sub&gt;3&lt;/sub&gt;&lt;sup&gt;-&lt;/sup&gt;、NO        &lt;sub&gt;3&lt;/sub&gt;&lt;sup&gt;-&lt;/sup&gt;、CH        &lt;sub&gt;3&lt;/sub&gt;CO        &lt;sub&gt;2&lt;/sub&gt;&lt;sup&gt;-&lt;/sup&gt;、SO        &lt;sub&gt;4&lt;/sub&gt;&lt;sup&gt;2-&lt;/sup&gt;、C        &lt;sub&gt;2&lt;/sub&gt;O        &lt;sub&gt;4&lt;/sub&gt;&lt;sup&gt;2-&lt;/sup&gt;或[B(C        &lt;sub&gt;2&lt;/sub&gt;O        &lt;sub&gt;4&lt;/sub&gt;)        &lt;sub&gt;2&lt;/sub&gt;]        &lt;sup&gt;-&lt;/sup&gt;。離子液體具有如說明書中所示式（I）之結構。酞菁配位化合物中具有二價金屬離子。於電解質組成物中，鋁鹽的重量大於離子液體的重量，且離子液體的重量大於酞菁配位化合物的重量。本申請另亦提供包含該電解質組成物的鋁電池。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrolyte composition including an aluminum salt, an ionic liquid, and a phthalocyanine coordination compound is provided. The anion of the aluminum salt is F        &lt;sup&gt;-&lt;/sup&gt;, Cl        &lt;sup&gt;-&lt;/sup&gt;, Br        &lt;sup&gt;-&lt;/sup&gt;, I        &lt;sup&gt;-&lt;/sup&gt;, BF        &lt;sub&gt;4&lt;/sub&gt;&lt;sup&gt;-&lt;/sup&gt;, PF        &lt;sub&gt;6&lt;/sub&gt;&lt;sup&gt;-&lt;/sup&gt;, [(CF        &lt;sub&gt;3&lt;/sub&gt;SO        &lt;sub&gt;2&lt;/sub&gt;)        &lt;sub&gt;2&lt;/sub&gt;N]        &lt;sup&gt;-&lt;/sup&gt;, CF        &lt;sub&gt;3&lt;/sub&gt;SO        &lt;sub&gt;3&lt;/sub&gt;&lt;sup&gt;-&lt;/sup&gt;, NO        &lt;sub&gt;3&lt;/sub&gt;&lt;sup&gt;-&lt;/sup&gt;, CH        &lt;sub&gt;3&lt;/sub&gt;CO        &lt;sub&gt;2&lt;/sub&gt;&lt;sup&gt;-&lt;/sup&gt;, SO        &lt;sub&gt;4&lt;/sub&gt;&lt;sup&gt;2-&lt;/sup&gt;, C        &lt;sub&gt;2&lt;/sub&gt;O        &lt;sub&gt;4&lt;/sub&gt;&lt;sup&gt;2-&lt;/sup&gt;or [B(C        &lt;sub&gt;2&lt;/sub&gt;O        &lt;sub&gt;4&lt;/sub&gt;)        &lt;sub&gt;2&lt;/sub&gt;]        &lt;sup&gt;-&lt;/sup&gt;. The ionic liquid has a structure as shown in formula (I) in the specification. The phthalocyanine coordination compound contains a divalent metal ion. In the electrolyte composition, the weight of the aluminum salt is greater than that of the ionic liquid, and the weight of the ionic liquid is greater than that of the phthalocyanine coordination compound. An aluminum battery containing the electrolyte composition is also provided.      </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="192" publication-number="202624827">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624827</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147083</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學鏡頭與高光譜成像系統</chinese-title>
        <english-title>OPTICAL LENS AND HYPERSPECTRAL IMAGING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250305B">G02B13/00</main-classification>
        <further-classification edition="200601120250305B">G02B11/34</further-classification>
        <further-classification edition="200601120250305B">G02B9/34</further-classification>
        <further-classification edition="200601120250305B">G02B3/00</further-classification>
        <further-classification edition="202101120250305B">G02B7/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商生活光學有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIVING OPTICS LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張劭宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, SHAO-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡立酋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, LI-CHIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　孝梧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ROBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍內特　山姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORNETT, SAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佑俞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種高光譜成像系統及其所使用的光學鏡頭，所述光學鏡頭由物側至像側沿光軸依序包括第一至第五透鏡、光圈以及第六至第九透鏡。這些透鏡可以被群組為第一至第四透鏡組，第三透鏡組包括第六至第八透鏡，第四透鏡組用以沿光軸移動進行對焦。這些透鏡滿足：        &lt;img align="absmiddle" height="47px" width="137px" file="ed10038.JPG" alt="ed10038.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，        &lt;img align="absmiddle" height="46px" width="118px" file="ed10039.JPG" alt="ed10039.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，以及        &lt;img align="absmiddle" height="49px" width="186px" file="ed10040.JPG" alt="ed10040.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，其中        &lt;i&gt;n          &lt;sub&gt;2&lt;/sub&gt;&lt;/i&gt;、        &lt;i&gt;n          &lt;sub&gt;3&lt;/sub&gt;&lt;/i&gt;、        &lt;i&gt;n          &lt;sub&gt;8&lt;/sub&gt;&lt;/i&gt;、        &lt;i&gt;n          &lt;sub&gt;9&lt;/sub&gt;&lt;/i&gt;分別為第二、第三、第八和第九透鏡的折射率，        &lt;i&gt;f          &lt;sub&gt;G3&lt;/sub&gt;&lt;/i&gt;、        &lt;i&gt;f          &lt;sub&gt;G4&lt;/sub&gt;&lt;/i&gt;分別為第三和第四透鏡組的等效焦距，        &lt;i&gt;d          &lt;sub&gt;6&lt;/sub&gt;&lt;/i&gt;、        &lt;i&gt;d          &lt;sub&gt;7&lt;/sub&gt;&lt;/i&gt;、        &lt;i&gt;d          &lt;sub&gt;8&lt;/sub&gt;&lt;/i&gt;、        &lt;i&gt;d          &lt;sub&gt;9&lt;/sub&gt;&lt;/i&gt;分別為第六至第九透鏡的厚度，        &lt;i&gt;f          &lt;sub&gt;6,7,8,9&lt;/sub&gt;&lt;/i&gt;為第六至第九透鏡的等效焦距。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A hyperspectral imaging (HSI) system and an optical lens used by the HSI system are provided. The optical lens includes, in sequence from an object side to an image side along an optical axis, first to fifth lenses, an aperture, and sixth to ninth lenses. The lenses are grouped into first to fourth lens groups, with the third lens group including the sixth to eighth lenses, and the fourth lens group configured to moving along the optical axis for focusing. The lenses satisfy the following conditions:        &lt;img align="absmiddle" height="43px" width="132px" file="ed10042.JPG" alt="ed10042.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;img align="absmiddle" height="46px" width="111px" file="ed10043.JPG" alt="ed10043.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, and        &lt;img align="absmiddle" height="48px" width="169px" file="ed10044.JPG" alt="ed10044.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="27px" width="17px" file="ed10041.JPG" alt="ed10041.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, where        &lt;i&gt;n          &lt;sub&gt;2&lt;/sub&gt;&lt;/i&gt;,        &lt;i&gt;n&lt;/i&gt;&lt;sub&gt;3&lt;/sub&gt;,        &lt;i&gt;n&lt;/i&gt;&lt;sub&gt;8&lt;/sub&gt;, and        &lt;i&gt;n          &lt;sub&gt;9&lt;/sub&gt;&lt;/i&gt;are refractive indices of the second, third, eighth, and ninth lenses, respectively;        &lt;i&gt;f          &lt;sub&gt;G3&lt;/sub&gt;&lt;/i&gt;and        &lt;i&gt;f          &lt;sub&gt;G4&lt;/sub&gt;&lt;/i&gt;are effective focal lengths of the third and fourth lens groups, respectively;        &lt;i&gt;d          &lt;sub&gt;6&lt;/sub&gt;&lt;/i&gt;,        &lt;i&gt;d          &lt;sub&gt;7&lt;/sub&gt;&lt;/i&gt;,        &lt;i&gt;d          &lt;sub&gt;8&lt;/sub&gt;&lt;/i&gt;, and        &lt;i&gt;d          &lt;sub&gt;9&lt;/sub&gt;&lt;/i&gt;are thicknesses of the sixth to ninth lenses, and        &lt;i&gt;f          &lt;sub&gt;6,7,8,9&lt;/sub&gt;&lt;/i&gt;is an effective focal length of the sixth to ninth lenses.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:高光譜成像系統</p>
        <p type="p">10:光學色散裝置</p>
        <p type="p">11:遮罩</p>
        <p type="p">12:第一影像感測器</p>
        <p type="p">13:光學鏡頭</p>
        <p type="p">14:分光器</p>
        <p type="p">15:第二影像感測器</p>
        <p type="p">16:處理器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="193" publication-number="202624714">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624714</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147086</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種外加式高壓氫氣之測試裝置</chinese-title>
        <english-title>A PLUG-IN HIGH-PRESSURE HYDROGEN TESTING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">G01N3/08</main-classification>
        <further-classification edition="200601120241231B">G01N3/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉宗榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, ZONG RONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡修安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, HSIU-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種外加式高壓氫氣之測試裝置，包括：一上蓋；一本體，該本體固定設置於上蓋及本體具有容置空間，該容置空間有試片及該試片可連接於上蓋之一端，且本體之側面具有位移感測孔；以及支架，該支架固定設置於本體，該支架具有拉伸桿及拉伸桿可連接於試片之一端；其中，上蓋具有感測訊號孔及氣體孔，氣體孔用於使氫氣進入本體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A plug-in high-pressure hydrogen testing device includes: an upper cover; a main body, where the main body is fixedly installed on the upper cover and has a containing space that holds a test specimen, with the test specimen being attachable to one end of the upper cover. Additionally, the side of the main body has a connection port for a displacement gauge signal port. It also includes a support bracket, which is fixedly installed on the main body and features a tensile rod that can connect to one end of the test specimen. The upper cover has a sensor signal port and a gas port, the latter being used for the entry of hydrogen gas into the main body.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:外加式高壓氫氣之測試裝置</p>
        <p type="p">10:上蓋</p>
        <p type="p">20:本體</p>
        <p type="p">30:支架</p>
        <p type="p">40:感測訊號孔</p>
        <p type="p">50:氣體孔</p>
        <p type="p">60:第一O型環</p>
        <p type="p">70:容置空間</p>
        <p type="p">80:第二O型環</p>
        <p type="p">90:試片</p>
        <p type="p">100:位移感測孔</p>
        <p type="p">110:第三O型環</p>
        <p type="p">120:拉伸桿</p>
        <p type="p">130:第四O型環</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="194" publication-number="202625448">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625448</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147088</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>圖像處理裝置與自動曝光控制方法</chinese-title>
        <english-title>IMAGE PROCESSING DEVICE AND AUTO EXPOSURE CONTROL METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250319B">H04N23/60</main-classification>
        <further-classification edition="202301120250319B">H04N23/80</further-classification>
        <further-classification edition="200601120250319B">G06T1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商星宸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIGMASTAR TECHNOLOGY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, MING-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">圖像處理裝置包含控制器、圖像處理器以及處理器。控制器在裝置開機後的第一期間內輸出多個彼此不同的預設曝光控制參數至圖像感測器，以使圖像感測器基於該些預設曝光控制參數產生多個第一圖幀資料。圖像處理器根據該些預設圖幀資料產生多個統計資料。處理器根據該些統計資料決定第二曝光控制參數，並經由控制器輸出第一曝光控制參數至圖像感測器，以使圖像感測器在第二期間內基於第一曝光控制參數產生第二圖幀資料，其中第一圖幀資料中每一者的圖幀率高於第二圖幀資料的圖幀率，且第一圖幀資料中每一者的解析度低於第二圖幀資料的解析度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image processing device includes a controller, an image processor, and a processor. The controller outputs different predetermined exposure control parameters to the image sensor during a first period after the device is powered on, such that the image sensor generates first frame data based on the predetermined exposure control parameters. The image processor generates multiple statistical data according to these first frame data. The processor determines a first exposure control parameter according to these statistical data and outputs the first exposure control parameter to the image sensor via the controller, such that the image sensor generates second frame data based on the first exposure control parameter during a second period. A frame rate of each first frame data is higher than that of the second frame data, and a resolution of each first frame data is lower than that of the second frame data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:圖像處理裝置</p>
        <p type="p">101:圖像感測器</p>
        <p type="p">110:圖像輸入介面電路</p>
        <p type="p">120:控制器</p>
        <p type="p">125:指令儲存電路</p>
        <p type="p">130:圖像處理器</p>
        <p type="p">135:資料儲存電路</p>
        <p type="p">140:處理器</p>
        <p type="p">CMD1~CMD5:預設指令</p>
        <p type="p">F1~F5:預設曝光控制參數</p>
        <p type="p">F6:曝光控制參數</p>
        <p type="p">FD11~FD15:圖幀資料</p>
        <p type="p">FD2:圖幀資料</p>
        <p type="p">FT:圖幀同步時序資訊</p>
        <p type="p">SA:位址資訊</p>
        <p type="p">SD1~SD5:統計資料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="195" publication-number="202625207">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625207</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147089</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>醫學影像處理方法及其系統</chinese-title>
        <english-title>MEDICAL IMAGING PROCESSING METHOD AND SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250203B">G16H30/40</main-classification>
        <further-classification edition="201801120250203B">G16H50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>智德萬生醫科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AITEWAN BIOMEDICAL TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳育德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YU-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王富民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, FU-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱珍元</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種醫學影像處理方法，其係包含一目標檢出程序、一聚焦區域遮罩對照程序、以及一目標分類程序。目標檢出程序係將一醫學影像中之一目標檢出，並檢知該目標於醫學影像中之至少一特徵資訊；聚焦區域遮罩對照程序係對應該醫學影像生成一至少包含一聚焦區域的聚焦區域遮罩，並將該聚焦區域遮罩疊加於該醫學影像，進而產生一疊加醫學影像，並依據該聚焦區域之屬性來對照該疊加醫學影像中之該目標的屬性，進而產生一分類結果；而，目標分類程序係當該目標位於該聚焦區域遮罩以外時，則藉由至少一分類強化資訊對該目標進行屬性分類，進而產生另一分類結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a medical image processing method, which includes a target detection process, a focusing area mask mapping process, and a target classification process. The target detection process is to detect a target from a medical image and to sense at least one characteristic information of the target in the medical image. The focusing area mask mapping process is to generate a focusing area mask at least containing a focusing area corresponding to the medical image, to superimpose the focusing area mask on the medical image to generate a superimposed medical image, and to map the property of the target in the superimposed medical image based on the property of the focusing area so as to generate a classification result. The target classification process is to perform a property classification based on at least one classification enhancement information to generate another classification result, when the target is located outside the focusing area mask, or when the target is located within the focusing area, but the characteristic information of the target is different from a preset characteristic information of the focusing area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">P11:目標檢出程序</p>
        <p type="p">P12:聚焦區域遮罩對照程序</p>
        <p type="p">P13:目標分類程序</p>
        <p type="p">MI:醫學影像</p>
        <p type="p">CEI:分類強化資訊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="196" publication-number="202625208">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625208</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147090</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>腦部醫學影像處理方法及其系統</chinese-title>
        <english-title>BRAIN MEDICAL IMAGING PROCESSING METHOD AND SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250303B">G16H30/40</main-classification>
        <further-classification edition="201701120250303B">G06T7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>智德萬生醫科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AITEWAN BIOMEDICAL TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳育德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YU-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王富民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, FU-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱珍元</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種腦部醫學影像處理方法，其係包含一腦腫瘤檢出程序、一聚焦區域遮罩對照程序、以及一腦腫瘤分類程序。腦腫瘤檢出程序係將一腦部醫學影像中之一腦腫瘤檢出，並檢知該腦腫瘤於腦部醫學影像中之至少一特徵資訊；聚焦區域遮罩對照程序係對應該腦部醫學影像生成一至少包含一聚焦區域的聚焦區域遮罩，並將該聚焦區域遮罩疊加於該腦部醫學影像，進而產生一疊加腦部醫學影像，並依據該聚焦區域之屬性來對照該疊加腦部醫學影像中的該腦腫瘤屬性，進而產生一分類結果；而，腦腫瘤分類程序係藉由至少一分類強化資訊對該腦腫瘤進行屬性分類，進而產生另一分類結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a brain medical image processing method, which includes a brain tumor detection process, a focusing area mask mapping process, and a brain tumor classification process. The brain tumor detection process is to detect a brain tumor from a brain medical image and to sense at least one characteristic information of the brain tumor in the brain medical image. The focusing area mask mapping process is to generate a focusing area mask at least containing a focusing area corresponding to the brain medical image, to superimpose the focusing area mask on the brain medical image so as to generate a superimposed brain medical image, and to map the property of the brain tumor in the superimposed brain medical image based on the property of the focusing area so as to generate a classification result. The brain tumor classification process is to perform a property classification of the brain tumor based on at least one classification enhancement information to generate another classification result, when the brain tumor is located outside the focusing area mask, or when the brain tumor is located within the focusing area, but the characteristic information of the brain tumor is different from a preset characteristic information of the focusing area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">P11:腦腫瘤檢出程序</p>
        <p type="p">P12:聚焦區域遮罩對照程序</p>
        <p type="p">P13:腦腫瘤分類程序</p>
        <p type="p">MI:腦部醫學影像</p>
        <p type="p">CEI:分類強化資訊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="197" publication-number="202624123">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624123</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147092</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>由水刀切割耗材之廢砂回收鋁物質製成氧化鋁的方法及其製備系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR PRODUCING ALUMINA FROM RECYCLED ALUMINUM MATERIALS IN WATERJET CUTTING WASTE SAND</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241220B">C01F7/46</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>處鋰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISHES TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳明山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MING-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孟儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MENG-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宛儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WAN-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林淑玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHU-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃國偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種由水刀切割耗材之廢砂回收鋁物質製成氧化鋁的方法，主要的目的在將處理水刀切割後所產生無機汙泥中廢棄鐵質物品，透過製程來清洗、脫水、乾燥、比重篩選等步驟得到氧化鋁產品，達成物質永續循環使用，減少資源浪費之效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for producing alumina from recycled aluminum materials in waterjet cutting waste sand aims to process the inorganic sludge produced after waterjet cutting, which contains discarded iron materials. The method involves steps such as washing, dehydration, drying, and density screening to obtain alumina products. This process achieves sustainable material recycling and reduces resource wastage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:步驟一</p>
        <p type="p">S2:步驟二</p>
        <p type="p">S3:步驟三</p>
        <p type="p">S4:步驟四</p>
        <p type="p">S5:步驟五</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="198" publication-number="202624150">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624150</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147093</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>回收水刀切割耗材汙泥製成鋁酸鈉及氫氧化鋁的方法及其製備系統</chinese-title>
        <english-title>A METHOD AND SYSTEM FOR PRODUCING SODIUM ALUMINATE AND ALUMINUM HYDROXIDE FROM RECYCLED WATERJET CUTTING SLUDGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120241218B">C02F11/127</main-classification>
        <further-classification edition="201901120241218B">C02F11/14</further-classification>
        <further-classification edition="200601120241218B">C01F7/46</further-classification>
        <further-classification edition="202201120241218B">B09B3/30</further-classification>
        <further-classification edition="202201120241218B">B09B3/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>處鋰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISHES TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳明山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MING-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孟儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MENG-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃國偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種回收水刀切割耗材汙泥製成鋁酸鈉及氫氧化鋁的方法，主要的目的在將處理水刀切割後所產生無機汙泥中廢棄鐵質物品，透過不同的製程來清洗、脫水、鹼浸泡、高溫高壓煮、蒸發結晶、酸溶解、水洗、乾燥等步驟分別得到鋁酸鈉及氫氧化鋁粉末產品，達成物質永續循環使用，減少資源浪費之效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for producing sodium aluminate and aluminum hydroxide from recycled waterjet cutting sludge. The primary objective is to process the inorganic sludge generated after waterjet cutting, specifically the discarded iron materials, through various procedures such as cleaning, dewatering, alkaline soaking, high-temperature high-pressure cooking, evaporation crystallization, acid dissolution, water washing, and drying. These steps yield sodium aluminate and aluminum hydroxide powder products, achieving sustainable material recycling and reducing resource waste.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:步驟一</p>
        <p type="p">S2:步驟二</p>
        <p type="p">S3:步驟三</p>
        <p type="p">S4:步驟四</p>
        <p type="p">S5:步驟五</p>
        <p type="p">S6:步驟六</p>
        <p type="p">S7:步驟七</p>
        <p type="p">S8:步驟八</p>
        <p type="p">S9:步驟九</p>
        <p type="p">D:無機汙泥</p>
        <p type="p">D1:高比重無機汙泥</p>
        <p type="p">D2:鋁酸鈉水溶液</p>
        <p type="p">D3:鋁酸鈉粉末</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="199" publication-number="202623917">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623917</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147094</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>由水刀切割耗材之廢砂回收鐵物質製成氧化鐵的製造方法及其製備系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR PRODUCING IRON OXIDE FROM RECYCLED IRON MATERIALS IN WATERJET CUTTING WASTE SAND</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250414B">B09B3/35</main-classification>
        <further-classification edition="202201120250414B">B09B3/30</further-classification>
        <further-classification edition="202201120250414B">B09B3/70</further-classification>
        <further-classification edition="200601120250414B">B09B5/00</further-classification>
        <further-classification edition="200601120250414B">C22B1/00</further-classification>
        <further-classification edition="200601120250414B">C01G49/04</further-classification>
        <further-classification edition="200601120250414B">C01G49/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>處鋰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISHES TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳明山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MING-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孟儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MENG-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宛儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WAN-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林淑玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHU-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃國偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種由水刀切割耗材之廢砂回收鐵物質製成氧化鐵的製造方法，將這些粉碎過後的細小廢砂收集，並透過不同的製程來乾燥、風選、清洗、磁選、篩選、浸泡、脫水、乾燥等不同步驟，並在其中階段加入強氧劑來氧化所得到的鐵砂生成氧化鐵、氧化亞鐵等金屬粉末。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for producing iron oxide from recycled iron materials in waterjet cutting waste sand involves collecting the finely ground waste sand and processing it through various steps such as drying, air classification, washing, magnetic separation, sieving, soaking, dehydration, and drying. During the process, strong oxidizers are added to oxidize the iron sand, resulting in the formation of iron oxide, ferrous oxide, and other metal powders.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:步驟1</p>
        <p type="p">S2:步驟2</p>
        <p type="p">S3:步驟3</p>
        <p type="p">S4:步驟4</p>
        <p type="p">S5:步驟5</p>
        <p type="p">S6:步驟6</p>
        <p type="p">S7:步驟7</p>
        <p type="p">S8:步驟8</p>
        <p type="p">S9:步驟9</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="200" publication-number="202624151">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624151</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147095</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>由水刀切割耗材之廢砂回收物矽物質製成二氧化矽與β-石英的方法及其製備系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR PRODUCING SILICON DIOXIDE AND Β-QUARTZ FROM RECYCLED RESIDUAL MATERIALS IN WATERJET CUTTING WASTE SAND</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120241218B">C02F11/127</main-classification>
        <further-classification edition="201901120241218B">C02F11/14</further-classification>
        <further-classification edition="200601120241218B">C02F11/18</further-classification>
        <further-classification edition="200601120241218B">C01B33/12</further-classification>
        <further-classification edition="202201120241218B">B09B3/30</further-classification>
        <further-classification edition="202201120241218B">B09B3/70</further-classification>
        <further-classification edition="202201120241218B">B09B3/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>處鋰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISHES TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳明山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MING-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孟儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MENG-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃國偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種由水刀切割耗材之廢砂回收物矽物質製成二氧化矽與β-石英的方法，主要的目的在將處理水刀切割後所產生無機汙泥中廢棄物清洗、脫水、乾燥、比重篩選、磁吸、鹼浸泡、水洗、脫水、乾燥、高溫熔解等步驟得到二氧化矽粉末及β-石英產品，達成物質永續循環使用，減少資源浪費之效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for producing silicon dioxide and β-quartz from recycled residual materials in waterjet cutting waste sand involves processing the inorganic sludge produced after waterjet cutting. The method includes steps such as washing, dehydration, drying, density screening, magnetic separation, alkaline leaching, washing, dehydration, drying, and high-temperature melting. These steps result in silicon dioxide powder and β-quartz products. This approach achieves sustainable material recycling and reduces resource wastage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:步驟一</p>
        <p type="p">S2:步驟二</p>
        <p type="p">S3:步驟三</p>
        <p type="p">S4:步驟四</p>
        <p type="p">S5:步驟五</p>
        <p type="p">S6:步驟六</p>
        <p type="p">S7:步驟七</p>
        <p type="p">S8:步驟八</p>
        <p type="p">S9:步驟九</p>
        <p type="p">S10:步驟十</p>
        <p type="p">S11:步驟十一</p>
        <p type="p">D:無機汙泥</p>
        <p type="p">D’:高比重無機汙泥</p>
        <p type="p">D1:高比重粉末</p>
        <p type="p">D2:白色粉末</p>
        <p type="p">D3:白色粉末之粉漿</p>
        <p type="p">D4:微濕白色粉末</p>
        <p type="p">D5:二氧化矽粉末</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="201" publication-number="202623901">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623901</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147096</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>由水刀切割耗材之廢砂回收物燒製出陶瓷鐵胎結構的方法及其製備系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR PRODUCING CERAMIC IRON BODIES FROM RECYCLED WASTE SAND IN WATERJET CUTTING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251105B">B03B5/32</main-classification>
        <further-classification edition="202201320251105B">B09B101/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>處鋰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISHES TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳明山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MING-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孟儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MENG-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宛儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WAN-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林淑玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHU-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃國偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種由水刀切割耗材之廢砂回收物燒製出陶瓷鐵胎結構的方法，主要的目的在將處理水刀切割後所產生無機汙泥中廢棄鐵質物品，透過沉澱、脫水、乾燥、磁吸、篩選等步驟得到鐵金屬粉末產品，並透過調整無機汙泥內中的金屬含量，使用一定的比例，如0.5%～5%比例加入到陶土、瓷土內混合使用，並捏製成不同的陶器，如杯、盤、碗、瓢、盆、鍋、甕、甑、調羹等生活食用瓷器，然後進行燒製成瓷器或陶器產品使用，燒製方法可以採用一般氧化燒製、還原燒製任一種方式皆可以。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for producing ceramic iron body structures from recycled waste sand in waterjet cutting involves processing the inorganic sludge produced after waterjet cutting to extract discarded iron materials. This process includes steps such as precipitation, dehydration, drying, magnetic separation, and screening to obtain iron metal powder products. By adjusting the metal content in the inorganic sludge and mixing it in a proportion of 0.5% to 5% with ceramic clay and porcelain clay, various ceramic items such as cups, plates, bowls, ladles, basins, pots, urns, steaming vessels, and spoons are formed. These items are then fired to produce ceramic or pottery products. The firing method can be either oxidation firing or reduction firing, depending on the requirements.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:步驟一</p>
        <p type="p">S2:步驟二</p>
        <p type="p">S3:步驟三</p>
        <p type="p">S4:步驟四</p>
        <p type="p">S5:步驟五</p>
        <p type="p">S6:步驟六</p>
        <p type="p">S7:步驟七</p>
        <p type="p">S8:步驟八</p>
        <p type="p">D:無機汙泥</p>
        <p type="p">D1:鐵類金屬粉末</p>
        <p type="p">D2:微小鐵類金屬粉末</p>
        <p type="p">P:陶瓷鐵胎產品</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="202" publication-number="202625127">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625127</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147100</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置以及用於顯示裝置的操作方法</chinese-title>
        <english-title>DISPLAY DEVICE AND OPERATING METHOD FOR DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250305B">G09G3/00</main-classification>
        <further-classification edition="202301120250305B">H04N9/64</further-classification>
        <further-classification edition="200601120250305B">G06F3/041</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商群豐駿科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARUX TECHNOLOGY PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁贊博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENG, TSAN-PO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳佳玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIA-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許乃方</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, NAI-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種顯示裝置以及用於顯示裝置的操作方法。顯示裝置包括影像數據電路、辨識電路以及補償電路。影像數據電路輸出影像數據。辨識電路接收影像數據，並辨識影像數據以產生辨識結果。補償電路依據辨識結果來產生補償信號，並依據補償信號來補償影像數據。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device and an operating method for the display device are provided. The display device includes an image data circuit, an identification circuit and a compensation circuit. The image data circuit outputs an image data. The identification circuit receives the image data and identifies the image data to generate an identification result. The compensation circuit generates a compensation signal according to the identification result, and compensates the image data according to the compensation signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示裝置</p>
        <p type="p">110:影像數據電路</p>
        <p type="p">120:辨識電路</p>
        <p type="p">130:補償電路</p>
        <p type="p">DIMG:影像數據</p>
        <p type="p">DIMG’:經補償影像數據</p>
        <p type="p">IMG:輸入影像</p>
        <p type="p">RS:辨識結果</p>
        <p type="p">SC:補償信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="203" publication-number="202625816">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625816</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147101</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具高導熱及電磁屏蔽的電子封裝結構</chinese-title>
        <english-title>ELECTRONIC PACKAGING STRUCTURE WITH HIGH THERMAL CONDUCTIVITY AND ELECTROMAGNETIC SHIELDING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W40/10</main-classification>
        <further-classification edition="202601120260302B">H10W42/60</further-classification>
        <further-classification edition="200601120260302B">H05K9/00</further-classification>
        <further-classification edition="202601120260302B">H10W74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇志彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, CHIH-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具高導熱及電磁屏蔽的電子封裝結構包括一線路基板、一晶片、一電磁屏蔽層、一鈍化層、一介電層、一銲接複合層、一導熱金屬層、一散熱蓋。晶片設置於線路基板的上表面，晶片具有接地導通孔電連接於線路基板的接地線路。電磁屏蔽層設置於晶片的表面。鈍化層設置於電磁屏蔽層上。介電層設置於該鈍化層上。銲接複合層包括一銲接基材層、及一錫層。銲接基材層設置於介電層上，錫層設置於銲接基材層。導熱金屬層設置於錫層上。散熱蓋設置於導熱金屬層，該散熱蓋的內錫層與導熱金屬層共同形成一金屬間化合物層以固定地連接散熱蓋於銲接基材層。多顆錫球設置於線路基板的下表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic packaging structure with high thermal conductivity and electromagnetic shielding includes a circuit substrate, a chip, an electromagnetic shielding layer, a passivation layer, a dielectric layer, a welding composite layer, a thermal-conductive metal layer, and a heat dissipation cover. The chip is disposed on a upper surface of the circuit substrate, and the chip has a ground via hole electrically connected to a ground line of the circuit substrate. The electromagnetic shielding layer is arranged on the wafer. The passivation layer is disposed on the electromagnetic shielding layer. The dielectric layer is disposed on the passivation layer. The welding composite layer includes a welding base layer and a tin layer. The welding base material layer is disposed on the dielectric layer, and the tin layer is disposed on the welding base layer. The thermal- conductive metal layer is arranged on the tin layer. The heat dissipation cover is disposed on the thermal-conductive metal layer. An inner tin layer of the heat dissipation cover and the thermal-conductive metal layer jointly form an intermetallic compound layer to firmly connect the heat dissipation cover to the welding base layer. A plurality of solder balls are arranged on a lower surface of the circuit substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:晶片</p>
        <p type="p">14:導電材料</p>
        <p type="p">15:導電凸塊</p>
        <p type="p">20:電磁屏蔽層</p>
        <p type="p">30:鈍化層</p>
        <p type="p">40:介電層</p>
        <p type="p">50:銲接複合層</p>
        <p type="p">51:銲接基材層</p>
        <p type="p">52:錫層</p>
        <p type="p">60:導熱金屬層</p>
        <p type="p">70:散熱蓋</p>
        <p type="p">71:頂壁</p>
        <p type="p">710:氣孔</p>
        <p type="p">72:內錫層</p>
        <p type="p">73:側壁</p>
        <p type="p">74:防銲層</p>
        <p type="p">8:線路基板</p>
        <p type="p">81:上表面</p>
        <p type="p">82:下表面</p>
        <p type="p">83:接地線路</p>
        <p type="p">F:底部填充材料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="204" publication-number="202624833">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624833</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147102</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>頭戴式顯示裝置及其頭帶模組</chinese-title>
        <english-title>HEAD MOUNTED DISPLAY DEVICE AND STRAP MODULE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250414B">G02B27/01</main-classification>
        <further-classification edition="200601120250414B">G06F1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏達國際電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HTC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>解智翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHIH-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張立勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, LI-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種頭戴式顯示裝置及其頭帶模組。頭帶模組包括一殼體、一第一帶體、一第二帶體、一第一喇叭模組以及一第二喇叭模組。第一帶體與第二帶體分別連接於一主機的相對兩側。第一帶體與第二帶體至少部分重疊地容置於殼體內。第一喇叭模組與第二喇叭模組滑設於殼體的滑軌。第一帶體的第一連接段具有一第一磁吸部。第二帶體的第二連接段具有一第二磁吸部。第一連接段與第二連接段在殼體內滑動時，第一磁吸部磁吸第一喇叭模組的第三磁吸部而帶動第一喇叭模組在滑軌滑動，第二磁吸部磁吸第二喇叭模組的第四磁吸部而帶動第二喇叭模組在滑軌滑動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A head mounted display device and a strap module thereof are provided. The strap module includes a casing, a first strap, a second strap, a first speaker module and a second speaker module. The first strap and the second strap are respectively connected to opposite sides of a body. The first strap and the second strap are partially overlapped and accommodated in the casing. The first speaker module and the second speaker module are slidably mounted on slide rails of the casing. The first connecting section of the first strap has a first magnetic portion. The second connecting section of the second strap has a second magnetic portion. When the first connecting section and the second connecting section slide in the casing, the first magnetic portion magnetically attracts a third magnetic portion of the first speaker module to drive the first speaker module to slide on the slide rail, and the second magnetic portion magnetically attracts a fourth magnetic portion of the second speaker module to drive the second speaker module to slide on the slide rail.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:耳朵</p>
        <p type="p">50:頭戴式顯示裝置</p>
        <p type="p">52:主機</p>
        <p type="p">100:頭帶模組</p>
        <p type="p">110:殼體</p>
        <p type="p">120:第一帶體</p>
        <p type="p">122:第一末端</p>
        <p type="p">130:第二帶體</p>
        <p type="p">132:第二末端</p>
        <p type="p">140:第一喇叭模組</p>
        <p type="p">150:第二喇叭模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="205" publication-number="202624778">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624778</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147103</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置及其電池管理方法</chinese-title>
        <english-title>ELECTRONIC DEVICE AND BATTERY MANAGEMENT METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250925B">G01R31/378</main-classification>
        <further-classification edition="201901120250925B">G01R31/385</further-classification>
        <further-classification edition="200601120250925B">H01M10/44</further-classification>
        <further-classification edition="200601120250925B">H01M10/48</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華碩電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASUSTEK COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳英堉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YING-YUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIA-SEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴俊諺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHUNYEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇鈺修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, YU-HSIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAO, CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈育成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, YU-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案揭示一種電子裝置及其電池管理方法。所述方法包括下列步驟：於接電模式下，在電池保養模式功能啟動的期間，判斷電池模組是否處於滿電儲存狀態；當電池模組處於滿電儲存狀態時，判斷電池模組的當下儲存電量是否達到滿充容量；以及當處於滿電儲存狀態的電池模組的當下儲存電量達到滿充容量時，階段性地調降電池回充容量與充電電流限制。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device and a battery management method thereof are provided. The method includes following steps: determining whether or not a battery module is in a fully charged storage status during a period when a battery care mode function is activated in a power connection mode; determining whether or not a current stored power of the battery module has reached a full charge capacity when the battery module is in the fully charged storage status; and reducing a battery recharge capacity and a charging current limit in stages when the current stored power of the battery module in the fully charged storage status has reached the full charge capacity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S200~S204:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="206" publication-number="202625635">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625635</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147105</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發光二極體封裝結構</chinese-title>
        <english-title>LIGHT-EMITTING DIODE PACKAGE STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250204B">H10H20/841</main-classification>
        <further-classification edition="202501120250204B">H10H20/85</further-classification>
        <further-classification edition="202501120250204B">H10H20/851</further-classification>
        <further-classification edition="202501120250204B">H10H20/855</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>隆達電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEXTAR ELECTRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭修邑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, SHIOU-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一發光二極體封裝結構。發光二極體封裝結構包括發光二極體晶片、波長轉換層、介電層、分散式布拉格反射層、導電件與反射層。發光二極體晶片包括出光面及複數個側表面。波長轉換層設置在發光二極體晶片的出光面上，波長轉換層包括複數個側表面。介電層覆蓋發光二極體晶片的側表面，分散式布拉格反射層設置於發光二極體晶片下。導電件設置於分散式布拉格反射層下，並穿過分散式布拉格反射層與發光二極體晶片電性連接，以及反射層設置波長轉換層的側表面上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light-emitting diode package structure is provided. The light-emitting diode package structure includes a light-emitting chip, a wavelength conversion layer, a dielectric layer, a distributed bragg reflection layer, a conductive part, and a reflective layer. The light-emitting chip includes a light-emitting surface, and a plurality of side surfaces. The wavelength conversion layer is disposed on the light-emitting surface of the light-emitting chip, and the wavelength conversion layer includes a plurality of side surfaces of the wavelength conversion layer. The dielectric layer covers the side surface of light-emitting chip. The distributed bragg reflection layer is arranged under the light-emitting chip. The conductive part is arranged under the distributed bragg reflection layer, and is electrically connected to the light-emitting chip through the distributed bragg reflection layer. The reflective layer is disposed on the side surface of the wavelength conversion layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:發光二極體封裝結構</p>
        <p type="p">12C:第三黏著層</p>
        <p type="p">13:發光二極體晶片</p>
        <p type="p">13A:出光面</p>
        <p type="p">13B:電極面</p>
        <p type="p">13C:側表面</p>
        <p type="p">130:電極</p>
        <p type="p">14:介電層</p>
        <p type="p">16:分散式布拉格反射層</p>
        <p type="p">32:反射層</p>
        <p type="p">40:填充材料層</p>
        <p type="p">50:保護層</p>
        <p type="p">50A:外側表面</p>
        <p type="p">50T,90T:上表面</p>
        <p type="p">50I:內側表面</p>
        <p type="p">50B:下表面</p>
        <p type="p">70:導電件</p>
        <p type="p">80:導電墊</p>
        <p type="p">90:波長轉換層</p>
        <p type="p">90S:側表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="207" publication-number="202624696">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624696</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147107</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>厚度量測補償系統及厚度量測補償方法</chinese-title>
        <english-title>COMPENSATION SYSTEM AND COMPENSATION METHOD FOR THICKNESS MEASUREMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250304B">G01B15/02</main-classification>
        <further-classification edition="200601120250304B">B21B37/16</further-classification>
        <further-classification edition="201801120250304B">G06F9/38</further-classification>
        <further-classification edition="200601120250304B">G06F17/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳禹州</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-CHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種厚度量測補償方法，適用於鋼鐵製程，此厚度量測補償方法包含：取得鋼鐵製程之至少一製程資訊；取得進行鋼鐵製程所生產之鋼捲的鋼捲基本資料；利用合金補償值演算法處理鋼捲基本資料以計算出鋼捲之合金補償值，其中合金補償值演算法依據此些製程資訊建立合金補償值模型；以及設定合金補償值於厚度量測裝置，並利用厚度量測裝置量測鋼捲之鋼捲厚度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A compensation method of thickness measurement suitable for a steel manufacturing process. The compensation method includes: obtaining at least one process information of the steel manufacturing process; obtaining basic information of the steel coil produced by the steel manufacturing process; utilizing the alloy compensation algorithm to process the basic information of the steel coil to calculate an alloy compensation value of the steel coil, in which the alloy compensation algorithm establishes an alloy compensation model based on the at least one process information; and setting the alloy compensation value in a thickness measuring device, and utilizing the thickness measuring device to measure thickness of the steel coil.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:厚度量測補償方法</p>
        <p type="p">S210,S220,S230,S240:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="208" publication-number="202624965">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624965</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147109</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>固態硬碟及記憶體模式切換方法</chinese-title>
        <english-title>SOLID STATE DRIVE AND MEMORY MODE SWITCHING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120250425B">G06F12/0866</main-classification>
        <further-classification edition="200601120250425B">G11C16/06</further-classification>
        <further-classification edition="200601120250425B">G06F13/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>技嘉科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIGA-BYTE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高聖亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, SHENG-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳華逸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HUAYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何上吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, SHANG-JI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林睿文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, RUEI-WUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種固態硬碟及記憶體模式切換方法。記憶體模式切換方法適用於記憶體，記憶體模式切換方法以控制器執行且包含：接收使用者指令，其中使用者指令指定記憶體的指定運作模式，根據使用者指令，對記憶體的儲存空間進行格式化，以及在格式化後，將儲存空間從當前運作模式切換為指定運作模式。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a solid state drive and memory mode switching method. The memory mode switching method is adapted to a memory, the memory mode switching method is performed by a controller and includes: receiving a user command, wherein the user command designates a designated operation mode of the memory, formatting a storage space of the memory according to the user command, and switching a current operation mode of the storage space into the designated operation mode after the formatting.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101,S103,S105:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="209" publication-number="202624535">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624535</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147119</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於微波電漿化學氣相沉積設備的腔體結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250627B">C23C16/54</main-classification>
        <further-classification edition="200601120250627B">C23C16/511</further-classification>
        <further-classification edition="200601120250627B">C23C16/513</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碩系統股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧亘皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作提出一種用於微波電漿化學氣相沉積設備的腔體結構，其用以讓一微波形成一微波場，該腔體結構包含一外殼及一載物台。外殼包含一內底面、一內頂面、及一內環壁面。內頂面和內底面彼此之間互相間隔且面向彼此，內底面的直徑大於內頂面的直徑，且內頂面朝向內底面凸出。內環壁面兩端分別連接內頂面及內底面，藉此一腔室形成於內底面、內頂面、及內環壁面之間。微波場位於腔室。載物台設置於腔室，載物台具有一載物面，載物面面向內頂面。本創作的腔體結構可以避免引發雙火球現象，減少對微波電漿化學氣相沉積反應的影響。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:外殼</p>
        <p type="p">11:底盤件</p>
        <p type="p">12:周壁件</p>
        <p type="p">121:進氣口</p>
        <p type="p">13:頂蓋件</p>
        <p type="p">20:腔室</p>
        <p type="p">21:內底面</p>
        <p type="p">211:周緣部</p>
        <p type="p">212:中央部</p>
        <p type="p">22:內頂面</p>
        <p type="p">23:內環壁面</p>
        <p type="p">30:載物台</p>
        <p type="p">31:載物面</p>
        <p type="p">40:微波管</p>
        <p type="p">50:冷卻器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="210" publication-number="202625074">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625074</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147126</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>門牌地址正規化系統及方法</chinese-title>
        <english-title>HOUSE ADDRESS NORMALIZATION SYSTEM AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250303B">G06Q50/60</main-classification>
        <further-classification edition="201901120250303B">G06F16/20</further-classification>
        <further-classification edition="201901120250303B">G06F16/29</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞竣科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHI TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佳宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHIA-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹維軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAO, WEI HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳婷芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TING-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂亞宣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YA-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種門牌地址正規化系統及方法。本發明的門牌地址正規化系統執行本發明的門牌地址正規化方法。本發明的門牌地址正規化方法包含以下步驟：多個用戶輸入地址中的每一者與多個預定正規門牌地址進行比對，以判斷各用戶輸入地址是否為一正規門牌地址，若否，地址正規化模組依據從正規化資料庫取得的多個預定正規門牌地址中的至少一者，校正此用戶輸入地址以形成一正規化用戶輸入地址。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A house address normalization system and method is provided. The house address normalization method is performed by the house address normalization system. The house address normalization method includes steps of: comparing each of a plurality of user input addresses with a plurality of preset normalization house addresses to determine whether or not each one of the user input addresses is a normalization house addresses, if not, according to at least one of the plurality of preset normalization house addresses, correcting the one of the plurality of user input addresses to form a normalized user input addresses.</p>
      </isu-abst>
      <representative-img>
        <p type="p">USR:用戶裝置</p>
        <p type="p">100:資料庫建立模組</p>
        <p type="p">110:正規化資料庫</p>
        <p type="p">200:地址正規化模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="211" publication-number="202624938">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624938</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147128</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>觸控顯示面板、觸控顯示面板的驅動方法和顯示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241229B">G06F3/041</main-classification>
        <further-classification edition="201601120241229B">G09G3/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商格科微電子（上海）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉上逸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>段陸強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣昕佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種觸控顯示面板、觸控顯示面板的驅動方法和顯示裝置，所述觸控顯示面板包括：至少兩組感測電極組、至少兩個與所述感測電極組電性連接的多工選擇器，以及與所述多工選擇器電性連接的觸控積體電路；其中，所述多工選擇器至少包括並聯的觸控通路和顯示通路；若干個所述多工選擇器的觸控通路上設置有第一電阻，和/或，若干個所述多工選擇器的顯示通路上設置有第二電阻。        &lt;br/&gt;本發明使所有多工選擇器與對應的感測電極組之間的總電阻在觸控時間段相同，避免了因寄生電容引起的額外電荷輸入，提高了觸控檢測的準確性；並使所有多工選擇器與對應的感測電極組之間的總電阻在顯示時間段也相同，從而使觸控顯示面板上的亮度均勻，提高了顯示效果。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:感測電極</p>
        <p type="p">21:多工選擇器</p>
        <p type="p">22:觸控積體電路</p>
        <p type="p">23:類比前端</p>
        <p type="p">24:類比數位轉換器</p>
        <p type="p">25:觸控通路</p>
        <p type="p">26:顯示通路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="212" publication-number="202625388">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625388</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147134</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無線通道重構器</chinese-title>
        <english-title>WIRELESS CHANNEL RECONFIGURATOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">H04B1/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張晨毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHEN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖昌倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHANG-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周錫增</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, HSI-TSENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種無線通道重構器。無線通道重構器包含驅動電路以及射頻阻抗調整平面。射頻阻抗調整平面連接驅動電路，其中射頻阻抗調整平面包含第一射頻阻抗調整單元。第一射頻阻抗調整單元包含第一導體部件、第二導體部件、第一高通濾波器以及第一壓控開關。第一導體部件連接第一接地部。第二導體部件連接第一偏壓部，其中第一偏壓部與驅動電路連接。第二導體部件透過第一高通濾波器連接第一導體部件，其中第一導體部件、第一高通濾波器以及第二導體部件形成第一共振槽孔。第一壓控開關跨越第一共振槽孔以與第一導體部件及第二導體部件連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wireless channel reconfigurator is provided. The wireless channel reconfigurator includes a driving circuit and a radio frequency (RF) impedance adjustment surface. The RF impedance adjustment surface is connected to the driving circuit, wherein the RF impedance adjustment surface includes a first RF impedance adjustment unit. The first RF impedance adjustment unit includes a first conductor part, a second conductor part, a first high-pass filter (HPF), and a first voltage-controlled switch. The first conductor part is connected to a first grounding part. The second conductor part is connected to a first biasing part, wherein the first biasing part is connected to the driving circuit. The second conductor part is connected to the first conductor part through the first HPF, wherein the first conductor part, the first HPF, and the second conductor part form a first resonance slot. The first voltage-controlled switch spans across the first resonance slot to connected to the first conductor part and the second conductor part.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100A,100B,100C,100D:射頻阻隔器</p>
        <p type="p">101A,101B,101C,101D:高通濾波器</p>
        <p type="p">102A,102B,102C,102D:壓控開關</p>
        <p type="p">103A,103B,103C,103D:導體部件</p>
        <p type="p">104A,104B:接地部</p>
        <p type="p">105A,105B:偏壓部</p>
        <p type="p">106,106A,106B,107,107A,107B:槽孔</p>
        <p type="p">7:射頻阻抗調整單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="213" publication-number="202624654">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624654</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147142</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>隱藏式電視牆架結構</chinese-title>
        <english-title>HIDDEN TV WALL STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250121B">F16M13/02</main-classification>
        <further-classification edition="200601120250121B">H05K7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉瑞麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, JUI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉瑞麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, JUI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張禮宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, LI-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係指一種隱藏式電視牆架結構，其附接於一牆壁上，該隱藏式電視牆架結構包含有一可置放一顯示裝置之框架體、至少一壁板組及一開門模組所組成，藉以利用該開門模組來作動該等壁板組選擇性於該顯示裝置之前方或後方間位移，供該顯示裝置外露使用或隱藏收納。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A hidden TV wall structure is mounted on a wall and comprises a frame for accommodating an electronic visual display, at least one panel assembly, and an activation device for moving the panel assembly to a position in front of the electronic visual display for hiding same or in rear of the electronic visual display for use.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示裝置</p>
        <p type="p">10:框架體</p>
        <p type="p">11:緃向桿件</p>
        <p type="p">12:橫向桿件</p>
        <p type="p">13:邊板</p>
        <p type="p">20:蓋板組</p>
        <p type="p">21:蓋框</p>
        <p type="p">22:蓋板</p>
        <p type="p">23:伸片</p>
        <p type="p">24:連動片</p>
        <p type="p">30:壁板組</p>
        <p type="p">32:壁板</p>
        <p type="p">40:開門模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="214" publication-number="202624110">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624110</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147147</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多孔生質碳材的製造方法</chinese-title>
        <english-title>MANUFACTURE METHOD OF POROUS BIO-CARBON MATERIAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120241216B">C01B32/05</main-classification>
        <further-classification edition="201301120241216B">H01G11/26</further-classification>
        <further-classification edition="201301120241216B">H01G11/32</further-classification>
        <further-classification edition="201001120241216B">H01M4/583</further-classification>
        <further-classification edition="201001120241216B">H01M10/0525</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣中油股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CPC CORPORATION, TAIWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝子賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, TZU-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖又賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, YU-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王柏弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, PO-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林建宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JARRN-HORNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張揚狀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YANG-CHUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志青</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種多孔生質碳材的製造方法，包含：材料堆疊步驟，將生質碳源及氧化鐵依序自下而上分層堆疊成原料堆；及熱處理步驟，對該原料堆進行熱處理而還原該氧化鐵，而藉由還原時產生之二氧化碳，使該生質碳源反應產生孔洞而形成多孔生質碳材。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacture method for porous bio-carbon material comprising: a material stacking step, which stacking a bio-carbon sources and a iron oxide sequentially from bottom to top in layers to form a raw material pile; and a heat treatment step, which heat treating the raw material pile to reduce the iron oxide and generating pores in the bio carbon source by reaction of the carbon source and the carbon dioxide produced during reduction to form a porous biocarbon material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:材料堆疊步驟</p>
        <p type="p">S2:熱處理步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="215" publication-number="202624318">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624318</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147150</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚氨酯樹脂及聚氨酯皮膜</chinese-title>
        <english-title>POLYURETHANE RESIN AND POLYURETHANE FILM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241210B">C08G18/44</main-classification>
        <further-classification edition="200601120241210B">C08G64/02</further-classification>
        <further-classification edition="200601120241210B">C08G18/72</further-classification>
        <further-classification edition="200601120241210B">C08J5/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣中油股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CPC CORPORATION, TAIWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀景發</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHI, CHING-FA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭政柏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHENG-PO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊英傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YING-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何奇律</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, CHYI-LIUH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林建琛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JANN-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種聚氨酯樹脂，其特徵在於：該聚氨酯樹脂係由包含聚碳酸酯二醇、二元醇及異氰酸酯之原料所製成；該聚碳酸酯二醇係包括以下式（A）及式（B）所示之重複單元，且該式（B）所示之重複單元係占該聚碳酸酯二醇的大於10 mol%至30 mol%。        &lt;br/&gt;&lt;img align="absmiddle" height="158px" width="479px" file="ed10024.JPG" alt="ed10024.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;；        &lt;br/&gt;&lt;br/&gt;於式（A）中，R        &lt;sub&gt;1&lt;/sub&gt;為直鏈、支鏈或環狀的C2-20亞烷基；於式（B）中，R        &lt;sub&gt;2&lt;/sub&gt;為直鏈或支鏈的C2-10亞烷基，m及n各自為0至10的整數，且m+n≧1，A為C3-20的脂環烴或以下式（C）所示之結構：        &lt;br/&gt;&lt;img align="absmiddle" height="118px" width="320px" file="ed10025.JPG" alt="ed10025.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;；        &lt;br/&gt;於式（C）中，R        &lt;sub&gt;3&lt;/sub&gt;與R        &lt;sub&gt;4&lt;/sub&gt;各自獨立地為氫原子或C1-6的烷基；S為1；且B選自於：        &lt;img align="absmiddle" height="116px" width="59px" file="ed10026.JPG" alt="ed10026.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;或        &lt;img align="absmiddle" height="54px" width="62px" file="ed10027.JPG" alt="ed10027.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;或        &lt;img align="absmiddle" height="95px" width="121px" file="ed10028.JPG" alt="ed10028.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;；        &lt;br/&gt;其中，R        &lt;sub&gt;5&lt;/sub&gt;與R        &lt;sub&gt;6&lt;/sub&gt;各自獨立地為氫原子或C1-12的烴基。又，藉由使用前述聚氨酯樹脂，能夠適用於製備具有高彈性係數之聚氨酯皮膜。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A polyurethane resin is characterized in that: the polyurethane resin is made of a raw material including polycarbonate diol, diol and isocyanate; the polycarbonate diol comprises repeating units as shown in formula (A) and formula (B) below, and the repeating units shown in formula (B) account for more than 10 mol% to 30 mol% of the polycarbonate diol.        &lt;br/&gt;&lt;img align="absmiddle" height="157px" width="507px" file="ed10030.JPG" alt="ed10030.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;;        &lt;br/&gt;&lt;br/&gt;In formula (A), R        &lt;sub&gt;1&lt;/sub&gt;is a straight, branched, or cyclic C2-20 alkylene group; in formula (B), R        &lt;sub&gt;2&lt;/sub&gt;is a straight or branched C2-10 alkylene group, m and n are integers from 0 to 10 respectively, and m+n≧1, A is a C3-20 alicyclic hydrocarbon or the structure shown in formula (C) below:        &lt;br/&gt;&lt;img align="absmiddle" height="120px" width="343px" file="ed10031.JPG" alt="ed10031.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;;        &lt;br/&gt;In formula (C), R        &lt;sub&gt;3&lt;/sub&gt;and R        &lt;sub&gt;4&lt;/sub&gt;are each independently a hydrogen atom or a C1-6 alkyl group; S is 1; and B is selected from:        &lt;br/&gt;&lt;img align="absmiddle" height="98px" width="91px" file="ed10032.JPG" alt="ed10032.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;or        &lt;img align="absmiddle" height="65px" width="66px" file="ed10033.JPG" alt="ed10033.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;or        &lt;img align="absmiddle" height="103px" width="112px" file="ed10029.JPG" alt="ed10029.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;;        &lt;br/&gt;wherein, R        &lt;sub&gt;5&lt;/sub&gt;and R        &lt;sub&gt;6&lt;/sub&gt;are each independently a hydrogen atom or a C1-12 hydrocarbon group. Furthermore, by using the aforementioned polyurethane resin, it is suitable to prepare a polyurethane film having a high elastic modulus.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="216" publication-number="202625369">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625369</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147152</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自動增益控制器</chinese-title>
        <english-title>AUTOMATIC GAIN CONTROLLER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">H03F3/217</main-classification>
        <further-classification edition="200601120250303B">H03F3/181</further-classification>
        <further-classification edition="200601120250303B">H03G3/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>晶豪科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELITE SEMICONDUCTOR MICROELECTRONICS TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熊子翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SYONG, ZIH-SIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳曜洲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ISAAC Y.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自動增益控制器包含：多個電阻，串接在用以接收輸入信號的輸入端及運算放大器的反相輸入端之間；多個切換開關，各自具有耦接在該等電阻中的一對應者的第一端，及耦接反相輸入端的第二端，該等切換開關分別受多個切換信號控制而導通或不導通；緩衝器，根據反相輸入端的電壓，產生緩衝信號；電荷泵電路，根據緩衝信號及時脈信號，產生升壓電壓；及電壓準位移位器，根據緩衝信號及升壓電壓對多個控制信號進行電壓準位轉換，以分別產生該等切換信號並分別輸出至該等切換開關。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An automatic gain controller includes a plurality of resistors, a plurality of switches, a buffer, a charge pump circuit and a voltage level shifter. The resistors are connected in series between an input terminal for receiving an input signal and an inverting input terminal of an operational amplifier. Each of the switches has a first terminal coupled to a corresponding one of the resistors, and a second terminal coupled to the inverting input terminal. The switches are respectively controlled by a plurality of switching signals to conductive or non-conductive. The buffer generates a buffer signal according to the voltage at the inverting input terminal. The charge pump circuit generates a boosted voltage according to the buffer signal and a clock signal. The voltage level shifter converts the voltage levels of a plurality of control signals according to the buffer signal and the boosted voltage to respectively generate the switching signals and output them to the switches respectively.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1a:音訊放大器</p>
        <p type="p">2:自動增益控制器</p>
        <p type="p">10:揚聲器</p>
        <p type="p">11a:積分電路</p>
        <p type="p">12:信號產生電路</p>
        <p type="p">13:運算放大器</p>
        <p type="p">21:緩衝器</p>
        <p type="p">22:電荷泵電路</p>
        <p type="p">23:電壓準位移位器</p>
        <p type="p">Am:放大信號</p>
        <p type="p">C1~C4:控制信號</p>
        <p type="p">CLK:時脈信號</p>
        <p type="p">Is:積分信號</p>
        <p type="p">R1~R4:電阻</p>
        <p type="p">S1~S4:切換信號</p>
        <p type="p">Sw1~Sw4:切換開關</p>
        <p type="p">Vb:緩衝信號</p>
        <p type="p">Vcp:升壓電壓</p>
        <p type="p">Vin:輸入信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="217" publication-number="202624919">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624919</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147154</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>參考電流產生電路、半導體裝置及其控制方法</chinese-title>
        <english-title>REFERENCE CURRENT GENERATING CIRCUIT, SEMICONDUCTOR DEVICE, AND CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250402B">G05F3/26</main-classification>
        <further-classification edition="200601120250402B">G05F3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華邦電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINBOND ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬英庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, YING-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種參考電流產生電路、半導體裝置及其控制方法。參考電流產生電路包括輸出正常參考電流的電流產生器、測試參考電流產生電路與切換電路。測試參考電流產生電路包括運算放大器與第一電晶體。運算放大器被配置以接收第一電位與第二電位，且產生測試參考電流控制訊號。第一電晶體被配置以受控於測試參考電流控制訊號而根據第一電位產生測試參考電流。切換電路耦接至電流產生器、測試參考電流產生電路及輸出節點，且被配置以根據模式控制訊號來決定在輸出節點輸出正常參考電流或測試參考電流。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a reference current generating circuit, a semiconductor device, and a control method thereof. The reference current generating circuit includes a current generator that outputs a normal reference current, a test reference current generating circuit, and a switching circuit. The test reference current generating circuit includes an operational amplifier and a first transistor. The operational amplifier is configured to receive a first voltage and a second voltage and generate a test reference current control signal. The first transistor is configured to generate a test reference current based on the first voltage and controlled by the test reference current control signal. The switching circuit is coupled to the current generator, the test reference current generating circuit, and an output node, and is configured to determine whether to output the normal reference current or the test reference current at the output node based on a mode control signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:參考電流產生電路</p>
        <p type="p">120:運算放大器</p>
        <p type="p">130:第一電晶體</p>
        <p type="p">140:切換電路</p>
        <p type="p">150:測試參考電流產生電路</p>
        <p type="p">160:電流產生器</p>
        <p type="p">190:內部電路</p>
        <p type="p">CMD:模式控制訊號</p>
        <p type="p">CT:測試參考電流控制訊號</p>
        <p type="p">IREF:正常參考電流</p>
        <p type="p">IREFT:測試參考電流</p>
        <p type="p">NOUT:輸出節點</p>
        <p type="p">V1:第一電位</p>
        <p type="p">V2:第二電位</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="218" publication-number="202625118">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625118</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147157</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>船舶身份影像即時辨識疊合顯示方法</chinese-title>
        <english-title>REAL TIME VESSEL IDENTITY AND IMAGE MATCHING DISPLAY METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">G08G3/02</main-classification>
        <further-classification edition="202201120250401B">G06V20/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人船舶暨海洋產業研發中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIP AND OCEAN INDUSTRIES R&amp;D CENTER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋彥陞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, YAN-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉建宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIEN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭煜庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, YU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃昭仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示了一種船舶身份影像即時辨識疊合顯示方法。首先，步驟(A)提供一船舶身份影像即時辨識疊合顯示系統。進一步地，步驟(B)運算單元使用航儀資料、每個識別資訊和第一影像進行運算而得到一分析資料。步驟(C)運算單元依據一遮擋過濾條件過濾分析資料得到一第二影像。步驟(D)運算單元在第二影像顯示每個至少一物件之識別資訊並依據一位置調整條件調整至少一物件之識別資訊顯示位置得到一第三影像。最後，步驟(E)運算單元將第三影像傳送給顯示裝置。步驟(F)顯示裝置顯示第三影像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention discloses a real time vessel identity and image matching display method. The step of (A) is providing a real time vessel identity and image matching system. The step of (B) is a calculating unit using a nautical data, every identity information and first image to calculate and obtaining analysis data. The step of (C) is the calculating unit filtering the analysis data via a block filtering condition to obtain second image. The step of (D) is the calculating unit displaying the identity information of at least one object on the second image and adjusting the position of the identity information of each of the at least one object via a position adjustment condition to obtain third image. The step of (E) is calculating unit sending the third image to a display device. The step of (F) is display device displaying the third image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(A)-(F):步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="219" publication-number="202624668">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624668</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147160</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>壓縮機補氣裝置、注入機構與平行式環狀注射結構</chinese-title>
        <english-title>COMPRESSOR AIR SUPPLEMENTATION DEVICE, INJECTION MECHANISM AND A PARALLEL ANNULAR INJECTION STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">F25B49/02</main-classification>
        <further-classification edition="200601120241230B">F04C29/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊閔傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, MIN-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JUN-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鐘震麒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, JENN-CHYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林坤成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種壓縮機補氣裝置，包括吸入口流道、一級葉輪、二級葉輪、回流彎道流道及補氣流道結構。一級葉輪連通於吸入口流道。回流彎道流道連通於一級葉輪與二級葉輪之間，其中回流彎道流道包括出口流道與注射流道，出口流道連通於注射流道，注射流道連通二級葉輪。補氣流道結構包括一補氣通道，補氣通道連通注射流道，其中補氣通道的流向與出口流道的流向相同，且該補氣通道的延伸方向平行於出口流道的延伸方向。此外，一種注入機構與一種平行式環狀注射結構亦被提出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A compressor air supplementation device is provided. The compressor air supplementation device includes an intake passage, a first-stage impeller, a second-stage impeller, a recirculation bend passage, and an air supplementation passage structure. The first-stage impeller is connected to the intake passage. The recirculation bend passage connects between the first-stage impeller and the second-stage impeller. The recirculation bend passage includes an outlet passage and an injection passage. The outlet passage is connected to the injection passage, and the injection passage is connected to the second-stage impeller. The air supplementation passage structure includes an air supplementation channel, which is connected to the injection passage. The flow direction of the air supplementation channel is the same as that of the outlet passage, and the extension direction of the air supplementation channel is parallel to the extension direction of the outlet passage. In addition, an injection mechanism and a parallel annular injection structure are also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:壓縮機補氣裝置</p>
        <p type="p">110:渦殼</p>
        <p type="p">112:渦道前蓋</p>
        <p type="p">120:軸心</p>
        <p type="p">130:吸入式導管</p>
        <p type="p">140:一級葉輪</p>
        <p type="p">150:二級葉輪</p>
        <p type="p">160:回流導葉</p>
        <p type="p">170:回流彎道前蓋</p>
        <p type="p">180:回流彎道</p>
        <p type="p">182:環狀注射結構</p>
        <p type="p">184:本體</p>
        <p type="p">190:流體寬度調節元件</p>
        <p type="p">192:寬度件</p>
        <p type="p">B1:軸向方向</p>
        <p type="p">B2:徑向方向</p>
        <p type="p">DL:回流彎道流道</p>
        <p type="p">L1:流入流道</p>
        <p type="p">L2:轉彎流道</p>
        <p type="p">L3:出口流道</p>
        <p type="p">L4:注射流道</p>
        <p type="p">P1:吸入口流道</p>
        <p type="p">P2:補氣流道結構</p>
        <p type="p">PA:注入通道</p>
        <p type="p">PC:補氣通道</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="220" publication-number="202625332">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625332</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147167</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>永磁馬達的轉子結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250425B">H02K1/27</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>士林電機廠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝韙丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林桓槶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳建德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭俊憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇騰鋐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種永磁馬達的轉子結構，其包含一定子與一轉子，定子位於外側，定子纏繞線圈並以特定方式結線，定子與轉子間有一氣隙，其間距非固定，透過轉子非正圓設計，使磁阻得到緩增或緩減的變化，藉此降低頓轉轉矩；轉子有多數個V型槽，每個V型槽內放置有兩片磁鐵，藉由V型槽所設的止擋塊，使槽內的磁鐵在止擋塊的受限下被固定；在轉子外緣輪廓有多數個磁場導引凹槽，每個V型槽分別對應兩個磁場導引凹槽，磁場導引凹槽位於V型槽的兩側，呈對稱分佈；V型槽作為分界處，將轉子分為兩區域，V形夾角內稱為V形上半區，V形夾角外稱為V形下半區，多數個第一矩形孔位於V形上半區之V型槽中線上；多數個第二矩形孔位於兩個V型槽之間中線處，圓型孔位於V形下半區之V型槽中線處。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:轉子</p>
        <p type="p">22:V型槽</p>
        <p type="p">24:磁鐵</p>
        <p type="p">26:磁場導引凹槽</p>
        <p type="p">28:第一矩形孔</p>
        <p type="p">30:第二矩形孔</p>
        <p type="p">32:圓型孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="221" publication-number="202625053">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625053</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147175</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於提高藝術品網路平台流量之方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120241231B">G06Q30/0217</main-classification>
        <further-classification edition="202301120241231B">G06Q30/0226</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳信宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳信宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係指一種基於提高藝術品網路平台流量之方法，其應用於一系統，該系統包含有執行一藝術品網路平台之一雲端伺服主機、一連線用之網際網路、供複數瀏覽會員用於瀏覽該藝術品網路平台之至少一瀏覽終端裝置及供複數作品會員上傳藝術品資料於該藝術品網路平台之至少一上傳終端裝置，使得該雲端伺服主機、該等瀏覽終端裝置及該等上傳終端裝置可同步運行一展示打賞管理程式，藉以，讓瀏覽會員與作品會員可利用該展示打賞管理程式於藝術品網路平台進行藝術品瀏覽、打賞及獎勵之互動，以有效提高該藝術品網路平台之流量與藝術品瀏覽量，同時可以提升藝術品的可交易性及教育性。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">S01:藉由至少一瀏覽會員利用至少一瀏覽終端裝置及/或至少一作品會員利用至少一上傳終端裝置啟動連線及註冊登入執行一藝術品網路平台之一雲端伺服主機</p>
        <p type="p">S01a:前述瀏覽會員利用其所有之瀏覽終端裝置儲值至少一打賞金額及/或前述作品會員利用其所有之上傳終端裝置購買至少一平台點數</p>
        <p type="p">S02:通過前述作品會員之上傳終端裝置上傳至少一藝術品於前述藝術品網路平台中進行展示</p>
        <p type="p">S03:前述瀏覽會員可以利用其瀏覽終端裝置於前述雲端伺服主機之藝術品網路平台中瀏覽所展出之前述藝術品，前述瀏覽會員可對前述藝術品中之個別藝術品執行至少一打賞事件，且每一個打賞事件中具有至少一打賞數額</p>
        <p type="p">S04:通過前述藝術品網路平台將前述打賞事件之打賞數額依設定比例分配給每一個打賞事件中指定之個別藝術品的作品會員，並通知該作品會員</p>
        <p type="p">S05:利用前述藝術品網路平台統計前述瀏覽會員中個別瀏覽會員所有之打賞事件的打賞數額成為一累計打賞總額</p>
        <p type="p">S06:當個別瀏覽會員的累計打賞總額達到一抽獎資格數額時，則該個別瀏覽會員即取得參加抽獎之一抽獎資格</p>
        <p type="p">S07:當取得前述抽獎資格之個別瀏覽會員達到一抽獎設定人數時，則前述藝術品網路平台執行一抽獎事件，其中每一次之抽獎事件的中獎人數超過參與該次抽獎事件中個別瀏覽會員數量的一半或一半以上，且中獎之個別瀏覽會員數量的一半或一半以上其得獎數額超過前述抽獎資格數額，同時該次抽獎事件中發出之獎金不超過所有個別瀏覽會員之抽獎資格數額總數的一半</p>
        <p type="p">S08:通過前述藝術品網路平台將該次抽獎事件之中獎金額分配予相對之個別瀏覽會員，並通知該個別瀏覽會員</p>
        <p type="p">S09:利用前述藝術品網路平台儲存並記錄前述已完成動作之打賞事件及抽獎事件，同時執行該系統之更新</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="222" publication-number="202625054">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625054</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147176</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>跨平台廣告管理系統及跨平台廣告管理方法</chinese-title>
        <english-title>A CROSS-PLATFORM ADVERTISEMENT MANAGEMENT SYSTEM AND A CROSS-PLATFORM ADVERTISEMENT MANAGEMENT METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250303B">G06Q30/0241</main-classification>
        <further-classification edition="202301120250303B">G06Q30/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>玉山商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>E.SUN COMMERCIAL BANK, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐枬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘皓天</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, HAO-TIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾映嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, YIN-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳照元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHAO-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TZUNG-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐銘霞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, MING-HSIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋元筑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNG, YUAN-JWU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡宇萱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, YU-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉羽軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, YU-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種跨平台廣告管理系統，包含一廣告來源端電子裝置及與其電連接的一廣告管理主機。該廣告來源端電子裝置將多個廣告資料傳送給該廣告管理主機。該廣告管理主機產生對應於一使用者的一廣告排序清單及一廣告露出紀錄。該廣告排序清單包含有順序的多個廣告項目。每一廣告項目指示出該等廣告資料其中一者。每當供該使用者操作的一使用端電子裝置連結多個前台伺服器其中一者，該廣告管理主機根據該廣告排序清單及該廣告露出紀錄依序於該前台伺服器露出該廣告排序清單的該等廣告項目所指示的該等廣告資料，並更新該廣告露出紀錄。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cross-platform advertisement management system includes an advertisement source-end electronic device and an advertisement management host electrically connected thereto. The advertisement source-end electronic device transmits a plurality of advertisement data to the advertisement management host. The advertisement management host generates an advertisement sorting list and an advertisement exposure record corresponding to a user. The advertisement sorting list comprises a plurality of advertisement items in an order. Each of the advertisement items indicates one of the advertisement data. Each time a user end electronic device operated by the user connects to one of a plurality of front-end servers, the advertisement management host sequentially exposes the advertisement data indicated by the advertisement items in the advertisement sorting list from the front-end server according to the advertisement sorting list and the advertisement exposure record, and updates the advertisement exposure record.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:跨平台廣告管理系統</p>
        <p type="p">1:廣告來源端電子裝置</p>
        <p type="p">2:廣告管理主機</p>
        <p type="p">200:使用端電子裝置</p>
        <p type="p">300:前台伺服器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="223" publication-number="202624956">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624956</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147183</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>初始值設定裝置、方法與使用其的電子裝置</chinese-title>
        <english-title>INITIAL CONFIGURATION VALUE SETTING APPARATUS, METHOD AND ELECTRONIC APPARATUS USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250303B">G06F9/445</main-classification>
        <further-classification edition="200601120250303B">G06F9/06</further-classification>
        <further-classification edition="201801120250303B">G06F9/44</further-classification>
        <further-classification edition="200601120250303B">G11C16/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新唐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林瑋玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEI-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種初始值設定裝置，其具有初始流程設定解碼器以及初始設定單元，其中初始流程設定解碼器電性連接記憶體，初始設定單元電性連接初始流程設定解碼器、記憶體及晶片。初始流程設定解碼器用於自記憶體中讀取初始流程設定值，並對初始流程設定值進行解碼以產生初始流程有效設定碼。初始設定單元接收初始流程有效設定碼，用於根據初始流程有效設定碼讀取記憶體所儲存的複數個初始設定值的至少一者，並根據讀取的至少一初始設定值對晶片進行初始設定。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An initial configuration value setting apparatus has an initial setting flow decoder and an initial setting unit, wherein the initial setting flow decoder is electrically connected to a memory, and the initial setting unit is electrically connected to the initial setting flow decoder, the memory and a chip. The initial setting flow decoder reads an initial setting flow value from the memory and decodes the initial setting flow value to generate a valid initial setting flow code. The initial setting unit receives the valid initial setting flow code and is used to read at least one of a plurality of initial configuration values ​​stored in the memory according to the valid initial setting flow code, and further to initialize the chip according to the at least one read initial configuration value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:初始流程設定解碼器</p>
        <p type="p">102:初始設定單元</p>
        <p type="p">103:記憶體</p>
        <p type="p">200:晶片</p>
        <p type="p">201:暫存器</p>
        <p type="p">CFGV:初始設定值</p>
        <p type="p">FCNS:初始設定信號</p>
        <p type="p">FV:初始流程設定值</p>
        <p type="p">FADR:初始流程設定值位址</p>
        <p type="p">IADR:初始設定值位址</p>
        <p type="p">INIB:初始流程有效設定碼</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="224" publication-number="202624033">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624033</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147185</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>充電轉接器</chinese-title>
        <english-title>CHARGING ADAPTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250303B">B60L53/16</main-classification>
        <further-classification edition="201901120250303B">B60L53/31</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾昀軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, YUN HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種充電轉接器包含轉接器主體以及設置在轉接器主體上的第一卡榫、第二卡榫及連動機構。轉接器主體包含第一電連接器及第二電連接器，第一、第二電連接器設置在轉接器主體的相對兩端，並配置以分別連接第一、第二外部連接器。第一卡榫包含按鈕以及卡合結構，卡合結構連接按鈕，並配置以與第一外部連接器卡固。第二卡榫配置以與第二外部連接器卡固。連動機構連接第一、第二卡榫，第一、第二卡榫配置以透過連動機構同步地與第一、第二外部連接器卡固及分離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A charging adapter includes an adapter main body, as well as a first latch, a second latch and a synchronizing mechanism disposed on the adapter main body. The adapter main body includes a first electrical connector and a second electrical connector. The first and second electrical connectors are provided on opposite sides of the adapter main body and are configured to mate with a first external connector and a second external connector. The first latch includes a push button and an interlocking structure connected to the push button. The interlocking structure is configured to interlock with the first external connector. The second latch is configured to interlock with the second external connector. The first and second latches are configured to interlock with or disengage from the first and second external connectors, respectively, in a synchronous manner by virtue of the synchronizing mechanism connecting the first and second latches.</p>
      </isu-abst>
      <representative-img>
        <p type="p">12:充電轉接器</p>
        <p type="p">13:充電槍</p>
        <p type="p">15:被充電裝置</p>
        <p type="p">17:彈性件</p>
        <p type="p">20:轉接器主體</p>
        <p type="p">21:第一電連接器</p>
        <p type="p">22:第二電連接器</p>
        <p type="p">24:側開口</p>
        <p type="p">29:第二卡榫</p>
        <p type="p">30:第一卡榫</p>
        <p type="p">34:樞接軸</p>
        <p type="p">35:按鈕</p>
        <p type="p">37:卡合結構</p>
        <p type="p">50:連動機構</p>
        <p type="p">53:平移滑動件</p>
        <p type="p">E1:第一外部連接器</p>
        <p type="p">E2:第二外部連接器</p>
        <p type="p">K1:卡合特徵</p>
        <p type="p">K2:孔位</p>
        <p type="p">S1:第一側</p>
        <p type="p">S2:第二側</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="225" publication-number="202624786">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624786</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147186</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>訊號處理裝置以及訊號收發裝置</chinese-title>
        <english-title>SIGNAL PROCESSING DEVICE AND SIGNAL TRANSCEIVING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">G01S7/35</main-classification>
        <further-classification edition="200601120250303B">H03F1/26</further-classification>
        <further-classification edition="200601120250303B">H03F3/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立積電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHWAVE TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭丁元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, TING-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種訊號處理裝置以及訊號收發裝置被提出。訊號處理裝置包括第一放大器、兩第一斬波器、第二斬波器以及第三斬波器。第一放大器用以根據第一訊號以產生第二訊號。兩第一斬波器內嵌在該第一放大器的輸入端與輸出端之間並分別用以進行第一頻率的偏移處理及第一頻率的移回處理。第二斬波器耦接第一放大器的輸入端並用以進行第二頻率的偏移處理。第三斬波器耦接第一放大器的輸出端並用以進行第二頻率的移回處理，第一頻率與第二頻率不相同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A signal processing device and a signal transceiving device are provided. The signal processing device includes a first amplifier, two first choppers, and a second chopper and a third chopper. The first amplifier is configured to generate a second signal according to a first signal. The two first choppers are embedded between input end and output end of the first amplifier and respectively configured to perform a shifting operation of a first frequency and a shifting back operation of the first frequency. The second chopper is coupled to input end of the first amplifier and configured to perform a shifting operation of a second frequency. The third chopper is coupled to output end of the first amplifier and configured to perform a shifting back operation of the second frequency. The first frequency and the second frequency are different.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:訊號處理裝置</p>
        <p type="p">110:放大器</p>
        <p type="p">111、112:第一斬波器</p>
        <p type="p">120:第二斬波器</p>
        <p type="p">130:第三斬波器</p>
        <p type="p">EI1、EI2:輸入端</p>
        <p type="p">EO1、EO2:輸出端</p>
        <p type="p">S1、S2:訊號</p>
        <p type="p">VOP、VON:輸出訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="226" publication-number="202624610">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624610</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147190</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>浮球發電系統</chinese-title>
        <english-title>FLOATING BALL POWER GENERATION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250305B">F03G3/00</main-classification>
        <further-classification edition="200601120250305B">F03B17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝宜芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, YI-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, MING-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴雅韻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係在提供一種浮球發電系統，主要設有集水單元、集球單元、運球單元、補水單元、轉輪發電單元及配球單元，該集球單元連接該集水單元，該運球單元連接該集球單元，該補水單元連接該運球單元，該轉輪發電單元連接該運球單元，該配球單元連接該轉輪發電單元，並分配浮球給該集球單元；如此，利用管路抽水重複運送浮球帶動轉輪旋轉及轉軸傳動，進而使發電機可以日夜不停的持續發電，不受限於天候因素及特定區域，也不會對空氣及環境造成極大的汙染，更不用透過國外進口發電所需之燃煤或天然氣，達到浮球循環帶動，提供相當充裕的發電量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">※ English abstract will be filed later.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:集水單元</p>
        <p type="p">10:抽水管</p>
        <p type="p">11:馬達</p>
        <p type="p">12:集水管</p>
        <p type="p">13:入水管</p>
        <p type="p">2:集球單元</p>
        <p type="p">20:集球管</p>
        <p type="p">21:出水管</p>
        <p type="p">22:入球孔</p>
        <p type="p">23:入球閘門</p>
        <p type="p">24:球閘拉桿</p>
        <p type="p">25:下三通管</p>
        <p type="p">26:水閘門</p>
        <p type="p">27:水閘拉桿</p>
        <p type="p">28:排放管</p>
        <p type="p">3:運球單元</p>
        <p type="p">30:上三通管</p>
        <p type="p">31:運球管</p>
        <p type="p">32:導引彎角</p>
        <p type="p">33:浮球槽道</p>
        <p type="p">4:補水單元</p>
        <p type="p">40:補水管</p>
        <p type="p">41:水箱</p>
        <p type="p">42:送水管</p>
        <p type="p">43:浮球開關</p>
        <p type="p">5:轉輪發電單元</p>
        <p type="p">50:轉輪</p>
        <p type="p">51:發電機</p>
        <p type="p">52:轉軸</p>
        <p type="p">53:浮球孔</p>
        <p type="p">54:凸塊</p>
        <p type="p">55:定位擋板</p>
        <p type="p">56:斜角擋板</p>
        <p type="p">57:傳球槽道</p>
        <p type="p">58:傳球擋板</p>
        <p type="p">59:第二彈性元件</p>
        <p type="p">6:配球單元</p>
        <p type="p">60:配球管</p>
        <p type="p">61:主配球槽道</p>
        <p type="p">610:第一擺動元件</p>
        <p type="p">611:第一配球閘門</p>
        <p type="p">612:第一閘門控制器</p>
        <p type="p">613:第一滾輪</p>
        <p type="p">614:第一軌道</p>
        <p type="p">62:分配球槽道</p>
        <p type="p">620:第二擺動元件</p>
        <p type="p">621:第二配球閘門</p>
        <p type="p">622:第二閘門控制器</p>
        <p type="p">623:第二滾輪</p>
        <p type="p">624:第二軌道</p>
        <p type="p">A:入水閥</p>
        <p type="p">B:出水閥</p>
        <p type="p">C:球閘控制器</p>
        <p type="p">D:水閘控制器</p>
        <p type="p">E:排放閥</p>
        <p type="p">G:電源線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="227" publication-number="202624099">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624099</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147192</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有力測量的拾放設備</chinese-title>
        <english-title>PICK-AND-PLACE APPARATUS WITH FORCE MEASUREMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">B65G47/91</main-classification>
        <further-classification edition="200601120260302B">G02B27/44</further-classification>
        <further-classification edition="202601120260302B">H10P72/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商安世私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEXPERIA B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　婭釗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YAZHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古森　約翰內斯法蘭斯洛德韋克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOOSEN, JOHANNES FRANS LODEWIJK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范德文　海斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN DER VEEN, GIJS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本公開的一個方面，提供了一種拾放設備，用於從第一載體拾取電子元件、和將該電子元件放置到第二載體上。該設備包括拾取單元，該拾取單元設置有衍射光柵，該衍射光柵包括圖案單元沿第一方向的重複。通過將准直光照射到該衍射光柵上，生成第n級光束。可以基於所感測到的第n級光束來確定在該衍射光柵的位置處該拾取單元沿該第一方向的長度改變。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">According to an aspect of the present disclosure, a pick-and-place apparatus is provided for picking an electronic component from a first carrier and for placing the electronic component onto a second carrier. The apparatus comprises a pickup unit that is provided with a diffraction grating that comprises a repetition, in a first direction, of a pattern unit. By impinging collimated light onto the diffraction grating, an n-th order light beam is generated. A change in length of the pickup unit in the first direction at a position of the diffraction grating can be determined based on the sensed n-th order light beam.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:拾放設備</p>
        <p type="p">201:圓盤傳送帶</p>
        <p type="p">210:拾取單元</p>
        <p type="p">210_1:拾取單元</p>
        <p type="p">211:衍射光柵</p>
        <p type="p">221:光源</p>
        <p type="p">221A:准直透鏡</p>
        <p type="p">241:光感測器</p>
        <p type="p">241A:感測器表面</p>
        <p type="p">242:光感測器</p>
        <p type="p">300:半導體晶圓</p>
        <p type="p">301:半導體管芯</p>
        <p type="p">302:第二載體</p>
        <p type="p">303:針狀元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="228" publication-number="202624939">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624939</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147193</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>筆芯模組及其電容式觸控筆</chinese-title>
        <english-title>PEN LEAD MODULE AND CAPACITIVE STYLUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250319B">G06F3/041</main-classification>
        <further-classification edition="201301120250319B">G06F3/0354</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立邁科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EMRIGHT TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連建枷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIEN, CHIEN-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周明暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, MING-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種筆芯模組，應用於電容式觸控筆。筆芯模組包含有筆芯件、固定件以及壓力感測器。筆芯件包含相連接的非導電部與導電部。固定件設置在導電部之相對於非導電部之一端。固定件具有相連接的定位部與支撐部。導電部安裝在定位部內，支撐部連結於電容式觸控筆之內壁。壓力感測器設置在支撐部之相對於定位部的表面，用來感應支撐部之變形量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pen lead module is applied to a capacitive stylus and includes a pen lead component, a fixing component and a pressure sensor. The pen lead component includes a non-conductive portion and a conductive portion connected with each other. The fixing component is disposed on an end of the conductive portion opposite to the non-conductive portion. The fixing component includes a positioning portion and a supporting portion connected with each other. The conductive portion is disposed inside the positioning portion. The supporting portion is connected to an inner wall of the capacitive stylus. The pressure sensor is disposed on a surface of the supporting portion opposite to the positioning portion, and adapted to sense deformation of the supporting portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:筆芯模組</p>
        <p type="p">22:筆芯件</p>
        <p type="p">24:固定件</p>
        <p type="p">26:壓力感測器</p>
        <p type="p">28:第一訊號線</p>
        <p type="p">30:第二訊號線</p>
        <p type="p">32:支撐架</p>
        <p type="p">34:感應件</p>
        <p type="p">36:非導電部</p>
        <p type="p">38:導電部</p>
        <p type="p">40:定位部</p>
        <p type="p">42:支撐部</p>
        <p type="p">44:內壁</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="229" publication-number="202625545">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625545</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147196</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>拾取單元</chinese-title>
        <english-title>PICKUP UNIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250925B">H05K13/02</main-classification>
        <further-classification edition="200601120250925B">H05K13/04</further-classification>
        <further-classification edition="200601120250925B">G02B27/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商安世私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEXPERIA B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　婭釗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YAZHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古森　約翰內斯法蘭斯洛德韋克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOOSEN, JOHANNES FRANS LODEWIJK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范德文　海斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN DER VEEN, GIJS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本案的一個方面，提供了一種用於拾放設備的拾取單元。該拾取單元包括可變形軸，該可變形軸在縱向軸線上是細長的並且具有帶有平坦部分的外表面。至少一個衍射光柵形成或佈置在該外表面的該平坦部分中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">211:衍射光柵</p>
        <p type="p">2101:可變形軸</p>
        <p type="p">2102:中心孔</p>
        <p type="p">2105:末梢</p>
        <p type="p">2106:中心孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="230" publication-number="202625039">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625039</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147197</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種永續報告書生成系統</chinese-title>
        <english-title>A SYSTEM FOR GENERATING A SUSTAINABILITY REPORT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250303B">G06Q10/10</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉普拉斯智能科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAPLACEAI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林韋銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEI MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡翔崴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, HSIANG WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊鈞宜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JIUN YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳韋廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林文杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關一種永續報告書生成系統，包括：一資料採集模組，用以收集有關公司經營的異質資料，包含：內部資料及外部資料，其中該內部資料為財務報表、營運數據、碳排放記錄、及/或員工多樣性報告，該外部資料為市場研究、政策法規及/或第三方評估數據；一融合模組，用以將上述異質資料進行多模態數據融合，其係利用大規模語言模型(LLM)將不同來源的數據轉化為統一的向量表示，以確保數據之間的互通性和可比性；一自然語言生成模組，用以基於融合後的數據自動生成一永續報告書。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention is related to a system for generating a sustainability report, comprising: a data collection module for collecting heterogeneous data relating to running a company, including internal data and external data, in which the internal data is financial statements, operational data, carbon emission record, and/or employee diversity report, and the external data is market research, policies and regulations, and/or third party assessment data; a fusion module for performing fusion of the multimodal data with respect to the heterogeneous data via utilizing a Large Language Model (LLM) to covert the data from different sources into one with unified vector representation so as to ensure interoperability and comparability; and a natural language generating module for automatically generating the sustainability report based on the fused data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:永續報告書生成系統</p>
        <p type="p">20:資料採集模組</p>
        <p type="p">30:融合模組</p>
        <p type="p">40:自然語言生成模組</p>
        <p type="p">50:引導式問卷模組</p>
        <p type="p">60:自動摘要技術模組</p>
        <p type="p">70:語義理解與情境感知模組</p>
        <p type="p">80:用於檢索一向量資料庫中標準版永續報告書的模組</p>
        <p type="p">81:用於進行語義相似度檢索的模組</p>
        <p type="p">90:合規異常檢測與差異分析模組</p>
        <p type="p">100:生成性建議模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="231" publication-number="202624609">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624609</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147198</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>葉片檢測工具連接裝置</chinese-title>
        <english-title>BLADE DETECTION TOOL CONNECTION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120241230B">F03D17/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國家原子能科技研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL ATOMIC RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林玉楚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-CHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐奉璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種葉片檢測工具連接裝置，係包括一移動機構連接板、一檢測工具連接板、一球接頭、及數個彈簧所組成，主要作為移動機構與檢測工具之間的連接器使用。該移動機構連接板可連接該移動機構；該球接頭及該些彈簧可同時連接該移動機構連接板與該檢測工具連接板；該檢測工具連接板可連接該檢測工具。在檢測葉片時，本發明藉由該球接頭及該些彈簧作動，使得該檢測工具與葉片表面服貼接觸，不遺漏檢測區域，在葉片表面進行精確及有規律的移動，準確發送訊號及接收訊號，增加葉片檢測資料精確度，提高葉片損害程度判斷準確度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A blade detection tool connection device is composed of a moving mechanism connecting plate, a detection tool connecting plate, a ball joint, and a plurality of springs, and is mainly used as a connector between the moving mechanism and the detection tool. This moving mechanism connecting plate can be connected to this moving mechanism; This ball joint and these springs can be connected with this moving mechanism connecting plate and this detection tool connecting plate simultaneously; The detection tool connection plate can be used to connect the inspection tool. When detecting a blade, the invention is actuated by this ball joint and these springs, so that the detection tool is in contact with the blade surface, does not miss the detection area, carries out precise and regular movement on the blade surface, accurately sends a signal and receives a signal, increases the accuracy of the blade detection data, and improves the accuracy of judging the degree of damage to the blade</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:連接裝置</p>
        <p type="p">1:移動機構連接板</p>
        <p type="p">2:檢測工具連接板</p>
        <p type="p">3:球接頭</p>
        <p type="p">4:彈簧</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="232" publication-number="202624047">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624047</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147199</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>視覺死角消除裝置</chinese-title>
        <english-title>VEHICLE BLIND SPOT ELIMINATION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">B60R1/08</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪昀珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, YUN-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪昀珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, YUN-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種視覺死角消除裝置設置於交通工具內，用以當一駕駛者駕駛一交通工具而無法看見被交通工具之遮擋部位所遮蔽之視覺死角區域之視覺死角外部影像時，呈現出包含視覺死角外部影像之整合影像，並且包含局部穿透反射鏡與反光鏡。局部穿透反射鏡具有反射區域與穿透區域。反射區域用以反射出投射至反光鏡之第一反射光影。穿透區域用以形成投射至駕駛者之目視位置之鄰近區域影像。反光鏡用以反射出投射至目視位置之視覺死角外部影像，使駕駛者於目視位置看見由鄰近區域影像與視覺死角外部影像所合成之整合影像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A Vehicle Blind Spot Elimination Device is installed inside a vehicle, used to display an integrated image containing external blind spot images when a driver operating a vehicle cannot see the external blind spot images of blind spot areas blocked by the obstructing parts of the vehicle. And it includes a partially transmissive reflector and a mirror. The partially transmissive reflector has reflection areas and transmission areas. The reflection areas are used to reflect the first reflected light image projected onto the mirror. The transmission areas are used to form nearby area images projected to the driver's viewing position. The mirror is used to reflect the external blind spot images projected to the viewing position, allowing the driver to see at the viewing position an integrated image composed of nearby area images and external blind spot images.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:視覺死角消除裝置</p>
        <p type="p">201:目視位置</p>
        <p type="p">402:擋風玻璃</p>
        <p type="p">403:汽車立柱</p>
        <p type="p">500:行人</p>
        <p type="p">1:局部穿透反射鏡</p>
        <p type="p">11:入光側</p>
        <p type="p">14:背側</p>
        <p type="p">2:反光鏡</p>
        <p type="p">21:反光側</p>
        <p type="p">3a:第一入射光影</p>
        <p type="p">3b:被遮蔽光影</p>
        <p type="p">4:第一反射光影</p>
        <p type="p">5:第二入射光影</p>
        <p type="p">6:穿透光影</p>
        <p type="p">8:第二反射光影</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="233" publication-number="202625365">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625365</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147202</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於最佳化環形振盪器之溫度調整機制的電腦系統及方法</chinese-title>
        <english-title>COMPUTER SYSTEM AND METHOD FOR OPTIMIZING TEMPERATURE TRIM OF RING OSCILLATOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250425B">H03B5/04</main-classification>
        <further-classification edition="200601120250425B">H03B5/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新唐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張恒愷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HEN-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種用於最佳化環形振盪器之溫度調整機制的電腦系統，包含儲存單元和處理單元。儲存單元儲存RC特性資料集，包含多個RC各者的一或多個特性及每一RC的最佳溫度係數組。每一RC的特性包含此RC的溫度頻率關係。處理單元從儲存單元讀取程式，以接收目標RC的一或多個目標特性，以及基於RC特性資料集及目標特性決定目標RC的目標溫度係數組。目標特性包含目標RC的溫度頻率關係。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A computer system for optimizing a temperature trim of a ring oscillator (RC) is provided. The computer system includes a storage unit and a processing unit. The storage unit stores an RC characteristic data set, including one or more characteristics of each of a plurality of RCs and an optimal temperature coefficient set of each RC. The characteristic of each RC includes the temperature-frequency relationship of the RC. The processing unit reads a program from the storage unit to receive one or more target characteristics of a target RC, and determine a target temperature coefficient set of the target RC based on the RC characteristic data set and the target characteristics. The target characteristics include the temperature-frequency relationship of the target RC.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電腦系統</p>
        <p type="p">S10:方法</p>
        <p type="p">11:儲存單元</p>
        <p type="p">12:處理單元</p>
        <p type="p">13:RC特性資料集</p>
        <p type="p">14:目標特性</p>
        <p type="p">S101,S102:步驟</p>
        <p type="p">15:目標係數組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="234" publication-number="202624921">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624921</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147211</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250502B">G06F1/12</main-classification>
        <further-classification edition="200601120250502B">H04L7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許烱發</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEU, JEONG-FA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸美娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, MEI-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹睿彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAO, JUI-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林永昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUNG-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露了一種電子裝置，其包含有一第一電路模組、一第二電路模組以及一傳輸模組。該傳輸模組耦接於該第一電路模組與該第二電路模組之間，其中該第一電路模組透過該傳輸模組以將多筆資料傳送至該第二電路模組。該傳輸模組包含有多級驅動電路，其中每一級驅動電路由多個時序重置管道正反器所組成，在時鐘樹合成時只需對每一級驅動電路內的正反器進行時鐘傳播延遲平衡，而該多級驅動電路彼此之間不進行時鐘平衡。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides an electronic device, which includes a first circuit module, a second circuit module and a transmission module. The transmission module is coupled between the first circuit module and the second circuit module, wherein the first circuit module transmits multiple data to the second circuit module through the transmission module. The transmission module includes multiple stages of driving circuits, wherein each stage of drive circuit includes multiple retimed pipeline flip-flops, and only the clock propagation latency balance of the flip-flops in the drive circuit itself is required in a clock tree synthesis, and the multiple stages of driving circuits are not performed clock balancing against each other.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:電路模組</p>
        <p type="p">112:正反器</p>
        <p type="p">120:電路模組</p>
        <p type="p">122:正反器</p>
        <p type="p">130:傳輸模組</p>
        <p type="p">132_1:第一級驅動電路</p>
        <p type="p">132_2:第二級驅動電路</p>
        <p type="p">132_3:第三級驅動電路</p>
        <p type="p">134:非同步介面電路</p>
        <p type="p">136_1,136_2,136_3,136_4:時鐘樹</p>
        <p type="p">clka,clkb:時鐘訊號</p>
        <p type="p">CTS1,CTS2,CTS3,CTS4:時鐘訊號</p>
        <p type="p">clkw:寫入時鐘訊號</p>
        <p type="p">clkr:讀取時鐘訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="235" publication-number="202625366">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625366</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147213</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>耦合偏壓器及用於通訊電路功率調整方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">H03B5/08</main-classification>
        <further-classification edition="200601120250401B">H03K3/01</further-classification>
        <further-classification edition="200601120250401B">H01F27/28</further-classification>
        <further-classification edition="200601120250401B">H01F38/04</further-classification>
        <further-classification edition="200901120250401B">H04W52/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國家中山科學研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人國家實驗研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL APPLIED RESEARCH LABORATORIES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭宇劭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIAO, YU-SHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃國威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, GUO-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種耦合偏壓器，其係為一種用於通訊電路之偏壓器結構，該耦合偏壓器係包括：一具有第一表面、第二表面及一貫穿開孔之本體、一以一固定形狀設置於該第一表面之第一導線，以及一設置於該貫穿開孔內之第二導體，其中，該第二導體電性連接該通訊電路，透過該第一導線電性連接一外部電源，俾使該耦合偏壓器與該通訊電路產生耦合，藉以達到該通訊電路偏壓之目的。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">31:本體</p>
        <p type="p">32:第一導線</p>
        <p type="p">33:第二導線</p>
        <p type="p">311:第一表面</p>
        <p type="p">312:第二表面</p>
        <p type="p">313:貫穿開孔</p>
        <p type="p">321:第一端點</p>
        <p type="p">322:第二端點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="236" publication-number="202624626">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624626</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147217</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>桿件固定裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250326B">F16B7/14</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國家中山科學研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳書偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡冠瑒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIAN, GUAN-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂承訓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHENG-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YAN-ZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種桿件固定裝置，其係為一種用於伸縮桿件之固定裝置，透過該桿件固定裝置固定第一桿件及第二桿件，及連動第二桿件及第三桿件，該裝置係包括一具有容置空間之本體、一設置於該容置空間內，具有一第一活動單元、一第二活動單元及一固定銷之活動模組、設置於該容置空間內之固定單元，及一設置於該本體與該活動模組間之卡合單元，當該第一桿件於該第二桿件內移動時，該卡合單元受到該第一桿件作用產生移動，該活動模組與該固定單元產生解鎖，並同時與該卡合單元進行固定，進一步達到解鎖及固定桿件之目的。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">4:桿件固定結構</p>
        <p type="p">41:第一桿件</p>
        <p type="p">42:第二桿件</p>
        <p type="p">43:第三桿件</p>
        <p type="p">44:本體</p>
        <p type="p">45:活動模組</p>
        <p type="p">46:固定單元</p>
        <p type="p">47:卡合單元</p>
        <p type="p">451:第一活動單元</p>
        <p type="p">452:第二活動單元</p>
        <p type="p">453:固定銷</p>
        <p type="p">454:卡合部</p>
        <p type="p">B:容置空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="237" publication-number="202624688">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624688</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147218</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>桿件位置偵測裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250418B">G01B7/004</main-classification>
        <further-classification edition="200601120250418B">G01B11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國家中山科學研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳書偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡冠瑒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIAN, GUAN-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂承訓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHENG-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YAN-ZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種桿件位置偵測裝置，係為一種用於伸縮桿件之位置偵測裝置，該伸縮桿件係具有一中空部之第一桿件，及容設於該中空部之第二桿件，該裝置係包括一偵測模組，及一定位模組，其中，該偵測模組係設置於該第一桿件一端，該定位模組係設置於該本體對應該第二桿件一側，透過該定位模組對應該伸縮產生相對應之動作，透過該偵測模組偵測該定位模組之動作，並產生一位置偵測訊號控制該動力源停止動作，以達到伸縮桿件位置控制，進一步達到保護該伸縮桿件之目的</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">4:位置偵測裝置</p>
        <p type="p">41:伸縮桿件</p>
        <p type="p">42:偵測模組</p>
        <p type="p">43:定位模組</p>
        <p type="p">411:第一桿件</p>
        <p type="p">412:第二桿件</p>
        <p type="p">421:本體</p>
        <p type="p">422:偵測單元</p>
        <p type="p">431:定位桿</p>
        <p type="p">432:感測探棒</p>
        <p type="p">D:貫穿開口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="238" publication-number="202624792">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624792</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147219</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於決定裝置的取向的系統</chinese-title>
        <english-title>SYSTEM FOR DETERMINING AN ORIENTATION OF A DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G01S17/42</main-classification>
        <further-classification edition="202601120260302B">H10P72/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商安世私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEXPERIA B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　婭釗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YAZHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古森　約翰內斯法蘭斯洛德韋克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOOSEN, JOHANNES FRANS LODEWIJK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范德文　海斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN DER VEEN, GIJS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本案的一個方面，提供了一種用於決定裝置的取向的系統，該系統包括佈置在該裝置的表面上的衍射光柵。通過將准直光束照射到該衍射光柵上，產生第m級光束和第n級光束。通過監測感測器表面上檢測到這些光束的位置，可以決定關於該裝置的取向的取向資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:拾放設備</p>
        <p type="p">201:圓盤傳送帶</p>
        <p type="p">210:拾取單元</p>
        <p type="p">210_1:拾取單元</p>
        <p type="p">211:衍射光柵</p>
        <p type="p">221:光源</p>
        <p type="p">221A:准直透鏡</p>
        <p type="p">241:光感測器</p>
        <p type="p">241A:感測器表面</p>
        <p type="p">242:光感測器</p>
        <p type="p">300:半導體晶圓</p>
        <p type="p">301:半導體晶粒</p>
        <p type="p">302:第二載體</p>
        <p type="p">303:針狀元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="239" publication-number="202625323">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625323</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147220</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>同軸光纖雷射結構</chinese-title>
        <english-title>THE COAXIAL FIBER LASER STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120250416B">H01S5/12</main-classification>
        <further-classification edition="200601120250416B">G02B6/00</further-classification>
        <further-classification edition="200601120250416B">G02B6/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊春足</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHUN CHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊春足</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHUN CHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">為提升光纖雷射以更小結構取得更高功率雷射輸出目的，本發明同時以同軸長線形雷射二極體當泵浦光源及以鑭系元素離子如鐿(Yb)或其他元素離子，以三角形折射率分佈摻雜在同軸單模態光纖的圓環形纖核光纖上，取代摻雜在習知單模態光纖纖核中，形成的光纖雷射結構。以相同截止波長在單模態波導下比較同軸單模態光纖的圓環形纖核在光纖上截面積，有16.5倍於在習知單模態光纖纖核在光纖上截面積。此圓環形光纖纖核稀土離子位在單模態波導帶中，其所構成可從基態激發更多摻雜離子所產生高激發水平光子量，共振時光子量不斷地被放大，成為更高功率及波長品質輸出的一種同軸光纖雷射。同軸光纖雷射的長度可更為縮短。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In order to enlarge the fiber laser output power, the invention use both the coaxial line laser diode as pumping diode and the Yb-doped ring core of the coaxial single mode optical fiber with triangular-index profile to replace the prior Yb-doped core of the single mode fiber with step-index profile. The cross section area with same cut-off wavelength waveguide in ring core is 16.5 times more than the cross section area in prior single mode core. It increases the amount of stimulated photons pumped from doped rare earth element ions in the ring core. The lengths of the coaxial single mode fiber laser may be shorten and the single mode wavelength quality become well.</p>
      </isu-abst>
      <representative-img>
        <p type="p">201:同軸長線形結構高功率雷射二極體泵浦光源</p>
        <p type="p">202:耦合器</p>
        <p type="p">203:第一個高反射同軸圓環形布拉格光纖光柵</p>
        <p type="p">204:具有週期表鑭系元素摻雜的同軸單模態光纖</p>
        <p type="p">2041:具有週期表鑭系元素摻雜的同軸單模態光纖纖核</p>
        <p type="p">205:第二個低反射同軸圓環形布拉格光纖光柵</p>
        <p type="p">206:同軸的單模態光纖折射率分佈圖</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="240" publication-number="202624968">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624968</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147221</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>存取儲存裝置的方法及相關的系統晶片</chinese-title>
        <english-title>METHOD FOR ACCESSING STORAGE DEVICE AND ASSOCIATED SYSTEM ON CHIP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250425B">G06F12/14</main-classification>
        <further-classification edition="201601120250425B">G06F12/0866</further-classification>
        <further-classification edition="200601120250425B">G06F13/14</further-classification>
        <further-classification edition="200601120250425B">G11C16/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>智原科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FARADAY TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江峰興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, FENG-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉森進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, SEN-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖泰翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, TAI-XIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露了一種存取一儲存裝置的方法，其包含有以下步驟：建立一命令，並將該命令寫入至一提交佇列的一條目，其中該命令包含該提交佇列的一佇列身分、該條目的一索引值、一邏輯區塊位址偏移以及一實體位址；設置一輔助提交佇列，其中該輔助提交佇列包含了多組安全性資訊；根據對應於該命令的該佇列身分以及該條目的該索引值，以自該輔助提交佇列擷取一特定安全性資訊；以及根據該命令的該邏輯區塊位址偏移以及該特定安全性資訊以對一資料進行加密或解密。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a method for accessing a storage device, which includes the following steps: establishing a command and writing the command to an entry of a submission queue, wherein the command includes an identity of the submission queue, an index of the entry, a logical block address offset, and a physical address; setting a sibling submission queue, where the sibling submission queue includes multiple security information; retrieving specific security information from the sibling submission queue according to the identity of the submission queue and the index of the entry corresponding to the command; and performing an encryption or decryption operation on data based on the logical block address offset of the command and the specific security information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">112:核心電路</p>
        <p type="p">114:安全控制電路</p>
        <p type="p">116:安全引擎</p>
        <p type="p">119:DRAM控制器</p>
        <p type="p">120:DRAM</p>
        <p type="p">130:儲存裝置</p>
        <p type="p">300:輔助提交佇列</p>
        <p type="p">410:介面電路</p>
        <p type="p">420:記憶體</p>
        <p type="p">430:位址過濾器</p>
        <p type="p">440:PCIe介面電路</p>
        <p type="p">450:安全引擎介面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="241" publication-number="202624915">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624915</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147222</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>應用於複數移動載具的路徑規劃系統及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120241231B">G05D1/692</main-classification>
        <further-classification edition="202401120241231B">G05D1/693</further-classification>
        <further-classification edition="202401120241231B">G05D1/43</further-classification>
        <further-classification edition="202401320241231B">G05D109/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華汽車工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA MOTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴居廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳育菘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種應用於複數移動載具的路徑規劃系統，包含一伺服器及複數移動載具。該伺服器根據一環境資訊與一任務清單，運算每一該移動載具的複數路徑點間的至少一子路徑，以得出每一該移動載具依序抵達該等路徑點的一總路徑及對應的時間點資訊。該伺服器對該等總路徑執行衝突檢測，若判斷存在衝突，提取存在衝突的該等子路徑重新規劃，並將優先序較後的該移動載具的該子路徑進行更新。該伺服器於該等總路徑不存在衝突時，將各該總路徑傳送給該等移動載具，以指示該等移動載具根據相應的該總路徑移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S11~S16:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="242" publication-number="202624782">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624782</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147228</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池資料的擷取系統及擷取方法</chinese-title>
        <english-title>BATTERY DATA RETRIEVAL SYSTEM AND RETRIEVAL METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250402B">G01R31/396</main-classification>
        <further-classification edition="202001120250402B">G01R31/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭容平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, JUNG-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巫瑞庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JUI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何政祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, CHENG-YOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃建中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIEN-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋隆裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNG, LUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電池資料的擷取方法，包括：透過資料擷取系統基於資料擷取系統與資料同步平台之間傳遞的校時報文以及校時報文響應取得對應於資料同步平台的多個時間戳記；透過資料擷取系統根據多個時間戳記計算對應於資料同步平台的傳輸延遲以及發送延遲；透過資料擷取系統基於傳輸延遲、發送延遲、最大傳輸延遲以及最大發送延遲計算對應於資料同步平台的擷取延遲，並發送傳輸延遲以及擷取延遲至資料同步平台；透過資料同步平台基於傳輸延遲校正資料同步平台的本地系統時間；透過資料同步平台基於本地系統時間以及擷取延遲計算資料擷取時間；以及透過資料同步平台基於資料擷取時間擷取電池資料，並定期上傳電池資料至該資料擷取系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A battery data retrieving method includes: obtaining multiple timestamps corresponding to a data synchronization platform through a data retrieval system based on a timing correction message and a response of the timing correction message transmitted between the data retrieval system and the data synchronization platform; calculating transmission delay and sending delay corresponding to the data synchronization platform based on the multiple timestamps through the data retrieval system; calculating retrieval delay corresponding to the data synchronization platform based on the transmission delay, the sending delay, maximum transmission delay, and maximum sending delay, and transmitting the transmission delay and the retrieval delay to the data synchronization platform; correcting a local system time of the data synchronization platform based on the transmission delay through the data synchronization platform; calculating a data retrieval time based on the local system time and the retrieval delay through the data synchronization platform; and retrieving the battery data based on the data retrieval time through the data synchronization platform, and regularly uploading the battery data to the data retrieval system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">4:電池資料的擷取方法</p>
        <p type="p">S411~S414、S421~S425:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="243" publication-number="202625378">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625378</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147230</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>類比數位轉換電路的測試裝置及方法</chinese-title>
        <english-title>TEST DEVICE AND METHOD FOR ANALOG-TO-DIGITAL CONVERSION CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250402B">H03M1/10</main-classification>
        <further-classification edition="200601120250402B">G01R31/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞鼎科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAYDIUM SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHAO-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱勝源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, SHENG-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUANG, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許有津</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YU-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李貞儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種類比數位轉換(ADC)電路的測試裝置，用以對ADC電路進行ADC測試以將類比斜坡電壓轉換為數位輸出信號。測試裝置包括控制器、記憶體、ADC遺失碼檢查單元及類比斜坡電壓產生電路控制器。控制器用以產生控制信號。記憶體分別耦接控制器及ADC電路，用以根據控制信號接收並儲存數位輸出信號。ADC遺失碼檢查單元分別耦接控制器及記憶體，用以根據控制信號檢查數位輸出信號是否有至少一遺失碼數值並產生檢查結果。類比斜坡電壓產生電路控制器分別耦接控制器及ADC遺失碼檢查單元，用以根據控制信號及檢查結果產生斜坡電壓控制信號及斜坡斜率控制信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A test device for an ADC circuit used to perform ADC testing on the ADC circuit to convert an analog ramp-voltage into a digital output signal is disclosed. The test device includes a controller, a memory, an ADC missing-code checking unit and an analog ramp-voltage generation circuit controller. The controller generates a control signal. The memory is coupled to the controller and ADC circuit and receives and stores the digital output signal according to the control signal. The ADC missing-code checking unit is coupled to the controller and memory and checks whether the digital output signal has at least one missing-code value according to the control signal and generate a checking result. The analog ramp-voltage generation circuit controller is coupled to the controller and ADC missing-code checking unit and generates a ramp-voltage control signal and a ramp slope control signal according to the control signal and the checking result.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:類比斜坡電壓產生電路</p>
        <p type="p">3:數位內建自測試(BIST)電路</p>
        <p type="p">30:BIST控制器</p>
        <p type="p">32:記憶體</p>
        <p type="p">34:類比數位轉換遺失碼檢查單元</p>
        <p type="p">36:類比斜坡電壓產生電路控制器</p>
        <p type="p">38:暫存器</p>
        <p type="p">ADC:類比數位轉換電路</p>
        <p type="p">RAMP:類比斜坡電壓</p>
        <p type="p">DO:數位輸出信號</p>
        <p type="p">CON:控制信號</p>
        <p type="p">TR:檢查結果</p>
        <p type="p">MG:訊息</p>
        <p type="p">CS1:斜坡電壓控制信號</p>
        <p type="p">CS2:斜坡斜率控制信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="244" publication-number="202624712">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624712</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147231</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>環境量測裝置</chinese-title>
        <english-title>ENVIRONMENTAL MEASUREMENT DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G01N1/26</main-classification>
        <further-classification edition="202401120260302B">G01N15/06</further-classification>
        <further-classification edition="200601120260302B">G01P5/02</further-classification>
        <further-classification edition="200601120260302B">G01D21/02</further-classification>
        <further-classification edition="202401120260302B">G05D1/43</further-classification>
        <further-classification edition="202601120260302B">H10P74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周振華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, CHEN-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種環境量測裝置，受控於一監控系統，環境量測裝置包括一移動模組、一升降模組以及一量測模組。升降模組配置於移動模組。量測模組配置於升降模組的一末端。移動模組依序移動至多個指定位置，且升降模組抬升量測模組至多個高度以量測多組環境數據，並回傳至監控系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An environment measurement device controlled by a monitoring system is provided. The environment measurement device includes a mobile module, a lifting module and a measurement module. The lifting module is disposed on the mobile module. The measurement module is disposed at one end of the lifting module. The mobile module is moved to a plurality of designated positions in sequence, and the lifting module lifts the measurement module to a plurality of heights to measure a plurality set of environmental data and transmitted to the monitoring system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:環境量測裝置</p>
        <p type="p">110:移動模組</p>
        <p type="p">111:車體</p>
        <p type="p">112:承架</p>
        <p type="p">113:導航組件</p>
        <p type="p">114:座標雷達</p>
        <p type="p">115:環境雷達</p>
        <p type="p">116:相機</p>
        <p type="p">120:升降模組</p>
        <p type="p">123:柱體結構</p>
        <p type="p">124:剛性鏈</p>
        <p type="p">130:量測模組</p>
        <p type="p">131:殼體</p>
        <p type="p">132:風速計</p>
        <p type="p">133:溫濕度計</p>
        <p type="p">134:微粒計數器</p>
        <p type="p">1341:取樣部</p>
        <p type="p">136:防撞雷達</p>
        <p type="p">H:孔隙</p>
        <p type="p">W1:驅動輪</p>
        <p type="p">W2:自由輪</p>
        <p type="p">D:驅動組件</p>
        <p type="p">TS:頂面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="245" publication-number="202625031">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625031</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147232</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>人力資源管理系統及其方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250303B">G06Q10/06</main-classification>
        <further-classification edition="202301120250303B">G06Q10/063</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>第一商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FIRST COMMERCIAL BANK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江盈樵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高芳如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宗銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭怡君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種人力資源管理系統，包含一外部資料擷取單元、一資料倉儲單元、一適配評分單元，及一職務適配單元。該外部資料擷取單元儲存一員工識別號，該員工識別號對應複數外部帳號，該外部資料擷取單元週期性地擷取複數對應該等外部帳號的員工現況資料，該資料倉儲單元儲存該等員工現況資料於一員工現況資料庫，該適配評分單元輸入該等員工現況資料於一職務評分模型以輸出一人事輪調評價，該職務適配單元儲存有該員工識別號及複數職務，接收來自該適配評分單元的人事輪調評價以判定該員工識別號適配到其中一職務，並儲存為一適配結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:外部資料擷取單元</p>
        <p type="p">12:資料倉儲單元</p>
        <p type="p">121:員工現況資料庫</p>
        <p type="p">122:員工人資資料庫</p>
        <p type="p">123:員工交易資料庫</p>
        <p type="p">13:適配評分單元</p>
        <p type="p">131:職務評分模型</p>
        <p type="p">132:職務風險模型</p>
        <p type="p">133:事件偵測模型</p>
        <p type="p">14:職務適配單元</p>
        <p type="p">2:外部網站</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="246" publication-number="202625317">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625317</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147233</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>插頭連接器、插座連接器及連接器組件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120250218B">H01R24/20</main-classification>
        <further-classification edition="201101120250218B">H01R13/6581</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商莫仕有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOLEX, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊喆元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHE-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊蕙瑄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, HUI-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡忠翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHUNG-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊竣傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHUN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳烈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種插頭連接器、插座連接器及連接器組件，該插頭連接器包含一基板與至少一接地屏蔽蓋。該基板具有一對接板部，在該對接板部的表面設置有多對信號導電墊片及分別設置在每對信號導電墊片兩側的多個接地導電墊片。該至少一接地屏蔽蓋安裝在該基板表面，該接地屏蔽蓋與該基板共同圍繞該多對信號導電墊片中的至少部分。該插座連接器包含有多對信號端子及多個接地端子。當該插頭連接器與該插座連接器對接時，該插座連接器的接地端子電性連接該接地屏蔽蓋，該插座連接器的每一對信號端子電性連接對應的一對信號導電墊片，其中，該接地屏蔽蓋覆蓋且屏蔽該多對信號端子的自由端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:連接器組件</p>
        <p type="p">12:基板</p>
        <p type="p">121:連接板部</p>
        <p type="p">121a:信號導電墊片</p>
        <p type="p">121b:接地導電墊片</p>
        <p type="p">122:對接板部</p>
        <p type="p">13:線纜</p>
        <p type="p">15:接地屏蔽蓋</p>
        <p type="p">152:壁部</p>
        <p type="p">153:連接部</p>
        <p type="p">23:端子模組</p>
        <p type="p">231:端子組</p>
        <p type="p">235:信號端子</p>
        <p type="p">235e:自由端</p>
        <p type="p">235f:接觸部</p>
        <p type="p">236d:接觸段</p>
        <p type="p">24:第一接地屏蔽件</p>
        <p type="p">24h:套管部</p>
        <p type="p">24j、24k:凸片</p>
        <p type="p">25:第二接地屏蔽件</p>
        <p type="p">25c:接觸部</p>
        <p type="p">25d:壁部</p>
        <p type="p">25e:連接部</p>
        <p type="p">D1:前後方向</p>
        <p type="p">D2:上下方向</p>
        <p type="p">D3:左右方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="247" publication-number="202624703">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624703</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147234</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>物件溫度測量方法及系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120241230B">G01K13/00</main-classification>
        <further-classification edition="202201120241230B">G01J5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>所羅門股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOLOMON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳政隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHENG-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮　春祿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, XUAN LOC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李佳運</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIA-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種物件溫度測量方法，由一物件溫度測量系統實施，其包含一：(A)該處理單元控制該拍攝單元進行拍攝，以獲得由該拍攝單元產生的一拍攝影像及一熱感影像；(B)該處理單元利用該影像辨識模型從該拍攝影像中辨識出一被該拍攝影像所呈現出的目標物件，並將該拍攝影像中呈現出該目標物件的區域作為一目標區域；(C)該處理單元將該熱感影像中對應該目標區域的其中一部分作為一關鍵部分，並根據該關鍵部分產生並輸出一對應該目標物件的溫度測量結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S5:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="248" publication-number="202625156">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625156</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147241</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>小號改變聲調的裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">G10H1/00</main-classification>
        <further-classification edition="200601120241231B">G10H1/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賀聲樂器股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>嘉義縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李國安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種小號改變聲調的裝置，包括一喇叭聲管與併排在一起而由不同活動通道而通設的第一至三活塞，該第三活塞與一吹嘴導管通設，該第一至三活塞上分別對應伸縮的穿設第一至三調節管，該喇叭聲管由前向後彎繞而接設一彎接管，該第一活塞上向後伸設一聲調管管接部，又依據不同聲調所需的長度而繞設不同聲調的聲調管，各別聲調管的兩端前伸分可別接於該彎接管與聲調管管接部之間，讓小號在更換不同聲調的聲調管後，就能夠以相同的指法發出不同聲調的音色。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:喇叭聲管</p>
        <p type="p">10:彎接管</p>
        <p type="p">21:第一活塞</p>
        <p type="p">210:聲調管管接部</p>
        <p type="p">211:第一活塞調節管接管</p>
        <p type="p">22:第二活塞</p>
        <p type="p">221:第二活塞調節管接管</p>
        <p type="p">23:第三活塞</p>
        <p type="p">231:第三活塞調節管接管</p>
        <p type="p">31:第一調節管</p>
        <p type="p">32:第二調節管</p>
        <p type="p">33:第三調節管</p>
        <p type="p">4:吹嘴導管</p>
        <p type="p">41:吹嘴接管</p>
        <p type="p">51,52,53:聲調管</p>
        <p type="p">E:端接部</p>
        <p type="p">G,F:聲調記號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="249" publication-number="202624685">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624685</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147253</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>弓弦釋放安全裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">F41B5/18</main-classification>
        <further-classification edition="200601120241231B">F41B5/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>經緯度企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張助偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佐偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種弓弦釋放安全裝置，其包括一弩機盒、一扳機組、一勾弦組、一防空釋弦組、及一卸弦組。該弩機盒與一弩身連接，提供一腔室。該扳機組、勾弦組、及防空釋弦組係分別組設於弩機盒內，且彼此互動約束一弓弦作動。該卸弦組，容置於弩機盒內選擇性觸發扳機組及防空釋弦組，令勾弦組釋放弓弦。藉由上述構件組成，於十字弓上緊弓弦後，如欲卸除弓弦張力時，利用卸弦組並配合一拉弦器牽引弓弦，使弓弦自弩機盒內緩慢離開並釋放其動能，達成無損十字弓結構又能安全釋放弓弦的訴求。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">100:弩機盒</p>
        <p type="p">101:腔室</p>
        <p type="p">102:箭尾剖槽</p>
        <p type="p">103:箭尾容槽</p>
        <p type="p">11:第一殼體</p>
        <p type="p">113:限位槽孔</p>
        <p type="p">12:第二殼體</p>
        <p type="p">121:第二復位件容槽</p>
        <p type="p">200:扳機組</p>
        <p type="p">413:爪勾</p>
        <p type="p">51:扳機卡掣件</p>
        <p type="p">512:卡掣件下軸孔</p>
        <p type="p">52:第四樞軸</p>
        <p type="p">53:卡掣件撥桿</p>
        <p type="p">54:卡掣限位件</p>
        <p type="p">62:撥塊撥桿</p>
        <p type="p">64:內連桿撥件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="250" publication-number="202624767">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624767</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147261</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種晶片測試設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250425B">G01R31/26</main-classification>
        <further-classification edition="200601120250425B">G01R1/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國大陸商無錫艾方芯動自動化設備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周建松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種晶片測試設備，其包括：支撐架、中空馬達、轉筒、晶片測模組、進料轉接頭、出料轉接頭及冷卻管，轉筒與中空馬達連接，晶片測模組與轉筒連接且設有管路通道，進料轉接頭設有進料通道，進料通道的進口端與冷媒源連通，進料轉接頭包括第一機體和第一連接頭，第一機體與中空馬達的側壁連接，第一連接頭設於進料通道的出口端，並與第一機體轉動連接，出料轉接頭包括第二機體和第二連接頭，第二機體與支撐架連接，第一機體內開設有出料通道，第二連接頭設於出料通道的進口端，並與第二機體轉動連接，第一連接頭和第二連接頭均通過冷卻管與晶片測模組相連，達到減少冷媒洩漏現象的出現的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:支撐架</p>
        <p type="p">11:第一支架</p>
        <p type="p">12:第二支架</p>
        <p type="p">2:中空馬達</p>
        <p type="p">21:安全罩</p>
        <p type="p">3:轉筒</p>
        <p type="p">4:進料轉接頭</p>
        <p type="p">5:第一箱體</p>
        <p type="p">6:出料轉接頭</p>
        <p type="p">7:第二箱體</p>
        <p type="p">8:冷卻管</p>
        <p type="p">9:晶片測試模組</p>
        <p type="p">91:管路通道</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="251" publication-number="202624106">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624106</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147268</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>捲線器</chinese-title>
        <english-title>CORD ORGANIZER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250305B">B65H75/38</main-classification>
        <further-classification edition="200601120250305B">B65H75/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立晏企業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIH YANN INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖伯霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, PO-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種捲線器，包括：至少二線架及一連接座。各該線架包括一供容置一線材之線槽；該連接座可拆卸地連接於該至少二線架之間，各該線架之該線槽朝背向該連接座之一側開放。藉此，該捲線器可供收納該線材，可依需求變更該至少二線架之數量，以符合不同使用需求，且便於維修及更換，克服現有捲線器之缺弊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a cord organizer, including at least two cord frames and a connecting base. Each of the at least two cord frames includes a groove configured to receive a cord. The connecting base is detachably connected between the at least two cord frames, and the groove of each of the at least two cord frames is open in a direction facing away from the connecting base. Therefore, the cord organizer is configured to store the core, a number of the at least two cord frames is changeable to meet different requirements, and the at least two cord frames are easy to repair and replace, which overcomes the shortcomings of the existing cord organizer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:捲線器</p>
        <p type="p">10:線架</p>
        <p type="p">11:線槽</p>
        <p type="p">20:連接座</p>
        <p type="p">21:第一組接部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="252" publication-number="202624602">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624602</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147269</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可調整之吊輪組件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">E05D13/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>晟鈺智能全球有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>基隆市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王瑞汶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作提出一種可調整之吊輪組件，其可裝設於一平面窗上，且具有一卡扣座、一調整座、一吊輪、一固定軸、一插銷及一調整件。卡扣座具有兩固定槽道，其為鉛直狀，且分別形成於卡扣座的相對兩面。調整座連接於卡扣座，且具有兩調整槽道。兩調整槽道分別相鄰於兩固定槽道，且與固定槽道不平行。固定軸連接於吊輪與卡扣座。插銷穿設於兩固定槽道及兩調整槽道中。調整件螺合於卡扣座以及調整座中，且藉由轉動調整件，能調整調整座與卡扣座的距離，並藉此調整卡扣座與吊輪的距離。同時，避免調整件上的螺紋會因平面窗的向下移動而磨損。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:固定槽道</p>
        <p type="p">13:卡固槽道</p>
        <p type="p">211:調整槽道</p>
        <p type="p">212:卡固塊</p>
        <p type="p">30:吊輪</p>
        <p type="p">40:固定軸</p>
        <p type="p">50:插銷</p>
        <p type="p">60:調整件</p>
        <p type="p">70:限位組件</p>
        <p type="p">80:固定件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="253" publication-number="202625325">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625325</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147273</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>數據中心走線槽扣具</chinese-title>
        <english-title>DATA CENTER CABLE TRUNKING FASTENER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">H02G3/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐啓峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHI-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐啓峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHI-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡嘉慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種數據中心走線槽扣具，其係用於將一第一走線槽或一第二走線槽固定在一C型鋼架，包含一雙頭固定件與一迫緊組件。該雙頭固定件具有一本體、一第一扣合端與一第二扣合端，該第一扣合端與該第二扣合端係分別形成該本體的二側邊，該第一扣合端係用於扣合該第一走線槽，該第二扣合端係用於扣合該第二走線槽。該迫緊組件係用於將扣合該第一走線槽或該第二走線槽的該雙頭固定件固定在該C型鋼架。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A data center cable trunking fastener, which is used for fastening a first cable trunking or a second cable trunking on a C-shaped steel frame, comprises a double-head fastening member and a compression component. The double-head fastening member has a body, a first fastening portion, and a second fastening portion. The first fastening portion and the second fastening portion are formed on two sides of the body respectively. The first fastening portion is used for fastening the first cable trunking. The second fastening portion is used for fastening the second cable trunking. The compression component is used for fixing the double-head fastening member, which fastens the first cable trunking or the second cable trunking, to the C-shaped steel frame.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:數據中心走線槽扣具</p>
        <p type="p">20:雙頭固定件</p>
        <p type="p">21:本體</p>
        <p type="p">22:第一扣合端</p>
        <p type="p">221:勾槽</p>
        <p type="p">23:第二扣合端</p>
        <p type="p">231:第一段</p>
        <p type="p">232:第二段</p>
        <p type="p">233:第三段</p>
        <p type="p">24:第一包覆端</p>
        <p type="p">25:第二包覆端</p>
        <p type="p">26:迫緊孔</p>
        <p type="p">30:迫緊組件</p>
        <p type="p">31:鎖固件</p>
        <p type="p">311:頭端</p>
        <p type="p">312:螺紋段</p>
        <p type="p">313:凹部</p>
        <p type="p">32:迫緊件</p>
        <p type="p">321:鎖固孔</p>
        <p type="p">322:迫緊端</p>
        <p type="p">33:墊片</p>
        <p type="p">34:扣環</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="254" publication-number="202623714">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623714</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147274</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>橙茶茶葉的製備方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">A23F3/08</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>農業部茶及飲料作物改良場</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEA AND BEVERAGE RESEARCH STATION, MOA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇宗振</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, TSUNG-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱垂豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHUI-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳聲舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張正桓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHENG-HUAG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅士凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, SHIH-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇彥碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種橙茶茶葉的製備方法，包含將具有活性酵素的茶菁進行萎凋處理、炒菁處理、揉捻處理、發酵處理、第一乾燥處理及第二乾燥處理。萎凋處理是在溫度為25℃至28℃、相對濕度為70%至80%及空氣流通下進行36小時至60小時，獲得萎凋率為35%至55%的具有活性酵素的第一經處理的茶葉。炒菁處理是在溫度為70℃以上進行2分鐘至4分鐘，獲得具有活性酵素的第二經處理的茶葉。發酵處理是在溫度為25℃至28℃且相對濕度為70%至80%以自然乾燥的方式進行12小時至36小時。第一乾燥處理是在溫度為90℃至100℃進行5分鐘至20分鐘。第二乾燥處理是在溫度為60℃至80℃進行2小時至4小時。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="255" publication-number="202625335">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625335</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147277</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>轉子磁鐵固定結構</chinese-title>
        <english-title>ROTOR MAGNETS FIXING STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">H02K1/28</main-classification>
        <further-classification edition="200601120250501B">H02K1/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇鋐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASIA VITAL COMPONENTS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, CHUNG-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫大龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種轉子磁鐵固定結構，包括：磁性基體、複數磁鐵及二端面矽鋼片。該磁性基體係由複數矽鋼片疊合設置構成，且外周緣形成結合區域；該等磁鐵以其內側緣配合設置於該結合區域，並且至少部分該等磁鐵的上、下端面分別凹設凹槽；該等端面矽鋼片分別設置於該磁性基體的上、下端面，且分別向外凸設至少一固定瓣，該等固定瓣分別覆蓋該等磁鐵的上、下端面，並且至少部分該等固定瓣分別朝軸向凸設一卡扣，以對應干涉並扣持該等磁鐵上、下端面的該等凹槽。藉此，本案減少元件數量、成本與精密度要求，更提升界面可以承受的摩擦力，提升固定的穩定性，也大大減少轉子中任何元件受損，以及轉子故障、失效的風險。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:磁性基體</p>
        <p type="p">10:結合區域</p>
        <p type="p">12:引導臂</p>
        <p type="p">2:磁鐵</p>
        <p type="p">20:凹槽</p>
        <p type="p">21:外側凸緣</p>
        <p type="p">22:內側緣</p>
        <p type="p">3:端面矽鋼片</p>
        <p type="p">31:固定瓣</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="256" publication-number="202623918">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623918</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147278</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>以竹資材製成生質顆粒燃料的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250102B">B09B3/35</main-classification>
        <further-classification edition="202201120250102B">B09B3/38</further-classification>
        <further-classification edition="200601120250102B">C10L5/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川連國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁三裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種以竹資材製成生質顆粒燃料的製造方法，包含一將一竹材廢棄物破碎為多個呈一預定粒徑以下的製程物料的破碎步驟、一將該等製程物料導入一水洗粉碎設備而形成多個呈小於該預定粒徑之製造粒徑的待成型粉料的粉碎步驟、一將所述製程物料導入一烘乾設備乾燥至濕度為15%以下的乾燥步驟、一將該等待成型粉料與一油料及多個木屑混合均勻而在一造粒設備中一同造粒為多個所述生質顆粒燃料的造粒步驟，及一使該等生質顆粒燃料的溫度冷卻至25~30℃的冷卻步驟。確實因應該竹材廢棄物的特性，提供將竹材廢棄物”轉廢為能”製成該等生質顆粒燃料的專門製程。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:破碎步驟</p>
        <p type="p">12:粉碎步驟</p>
        <p type="p">13:乾燥步驟</p>
        <p type="p">14:造粒步驟</p>
        <p type="p">15:冷卻步驟</p>
        <p type="p">16:篩回步驟</p>
        <p type="p">17:循環利用步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="257" publication-number="202624623">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624623</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147282</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>散熱風扇</chinese-title>
        <english-title>COOLING FAN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250305B">F04D29/66</main-classification>
        <further-classification edition="200601120250305B">F04D29/30</further-classification>
        <further-classification edition="200601120250305B">F04D29/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>建準電機工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNONWEALTH ELECTRIC MACHINE INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫安柏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOHAMMED ABDELKAREEM MOSTAFA AMER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JO</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李殷兆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YIN-ZHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃耀霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種散熱風扇，用以解決習知散熱風扇運作時的噪音過大的問題。係包含：一扇框，具有一基座，一側牆連接該基座，一蓋板連接該側牆，該蓋板與該基座相對，該扇框具有一入風口，該基座、該側牆及該蓋板共同形成一出風口；一扇輪，可旋轉地位於該扇框內，該扇框具有一風道；及至少一凸體，位於扇輪與該側牆之間的該風道，該至少一凸體具有一第一軸向高度，該扇輪具有一第二軸向高度，該第一軸向高度大於或等於該第二軸向高度的1/10，以及該第一軸向高度小於或等於該第二軸向高度的1/4。藉此可以達成降低風扇運作時氣流所產生噪音的功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cooling fan is provided to solve the problems of excessive noise when the conventional cooling fan is operating. The cooling fan includes a fan frame with a wind tunnel, a fan wheel and at least one convex body. The fan frame includes a base, a side wall connected to the base, a cover connected to the side wall, and an air inlet. The cover is opposite to the base. The base, the side wall and the cover together form an air outlet. The fan wheel is rotatably located in the fan frame. The at least one convex body is in the wind tunnel between the fan wheel and the side wall. The at least one convex body has a first axial height. The fan wheel has a second axial height. The first axial height is greater than or equal to one-tenth of the second axial height, and the first axial height is less than or equal to one quarter of the second axial height. The cooling fan can reduce the noise generated by the air flow when the fan is operating.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:扇框</p>
        <p type="p">11:基座</p>
        <p type="p">12:側牆</p>
        <p type="p">13:蓋板</p>
        <p type="p">14:入風口</p>
        <p type="p">15:出風口</p>
        <p type="p">2:扇輪</p>
        <p type="p">21:輪轂</p>
        <p type="p">22:葉片</p>
        <p type="p">23:轉軸</p>
        <p type="p">3:凸體</p>
        <p type="p">3a:端部</p>
        <p type="p">31:導弧端緣</p>
        <p type="p">F:散熱風扇</p>
        <p type="p">R:風道</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="258" publication-number="202625161">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625161</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147284</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於實體會議的音訊處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">G10L15/26</main-classification>
        <further-classification edition="200601120250303B">H04N7/15</further-classification>
        <further-classification edition="200601120250303B">G06F3/16</further-classification>
        <further-classification edition="202301120250303B">G06Q10/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人國家實驗研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL APPLIED RESEARCH LABORATORIES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林博文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃俊銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡英琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊嘉怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏志宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於實體會議的音訊處理方法包含以下步驟：(A)當接收到一音訊資料時，獲得該音訊資料的至少一音訊片段；(B)對於每一音訊片段，獲得該音訊片段的一文字內容；(C)根據該至少一音訊片段及其對應之文字內容產生另一發言資料並傳送至其他使用端裝置；(D)當接收到來自任一其他使用端裝置的一發言資料時，依序地儲存該發言資料；(E)根據該實體會議中所有音訊片段所對應的所有文字內容獲得一會議摘要內容；(F)產生至少一對應於該至少一重點摘錄內容的會議摘記；及(G)根據該至少一會議摘記產生一會議紀錄，並將對應的音訊片段嵌入該會議紀錄。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">301~305:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="259" publication-number="202625149">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625149</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147285</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像顯示資訊的調整方法</chinese-title>
        <english-title>IMAGE DISPLAY INFORMATION ADJUSTMENT METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">G09G5/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏正自動科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ATEN INTERNATIONAL CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭存淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, TSUN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種影像顯示資訊的調整方法，適用於一影像資訊調整裝置。影像資訊調整裝置與第一裝置及第二裝置電性連接，使第一裝置及第二裝置藉由影像資訊調整裝置建立影像顯示資訊交握流程，並第一裝置及/或第二裝置可在不中斷影像顯示資訊交握流程的情況下動態地且快速地得到影像顯示資訊，達到提升影像顯示資訊調整便利性的功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure is related to an image display information adjustment method applied to an image information adjustment device. The image information adjustment device is electrically connected to a first device and a second device for establishing an image display information exchange process between the first device and the second device through the image information adjustment device. The first device and/or the second device can dynamically and quickly obtain appropriate image display information without interrupting the image display information exchange process. Therefore, the effect of improving the convenience of image display information adjustment is achieved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:第一裝置</p>
        <p type="p">20:第二裝置</p>
        <p type="p">30:影像資訊調整裝置</p>
        <p type="p">31:開關模組</p>
        <p type="p">32:控制模組</p>
        <p type="p">101:第一通道</p>
        <p type="p">102:第二通道</p>
        <p type="p">103:第三通道</p>
        <p type="p">104:第四通道</p>
        <p type="p">a:第一端</p>
        <p type="p">b:第二端</p>
        <p type="p">c:第三端</p>
        <p type="p">Cs:控制訊號</p>
        <p type="p">f1:第一封包流</p>
        <p type="p">f2:第二封包流</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="260" publication-number="202623839">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623839</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147293</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可快速更換香味的煙霧滅菌機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">A61L2/22</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃少綱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃少綱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林湧群</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹銘煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓修齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可快速更換香味的煙霧滅菌機，於其本體內形成有一混合空間，本體上設有連通混合空間之一煙霧出口及一可供插入擴香片之插設槽，而一霧化裝置具有一可供裝填滅菌藥劑之容器，霧化裝置用以將該容器中之抗菌藥劑霧化成一抗菌煙霧後排入混合空間，使抗菌煙霧進入混合空間時可先與擴香卡所散發之香味混合後，再由煙霧出口向外釋出，藉由更換不同香味的擴香卡插入於插設槽中，即可簡單且快速地完成其更換香味的工作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:本體</p>
        <p type="p">12:隔板</p>
        <p type="p">122:風扇</p>
        <p type="p">13:混合空間</p>
        <p type="p">14:主控制板</p>
        <p type="p">15:煙霧出口</p>
        <p type="p">16:插設槽</p>
        <p type="p">17:手把</p>
        <p type="p">171:啟動按鈕</p>
        <p type="p">19:掃描單元</p>
        <p type="p">21:霧化裝置</p>
        <p type="p">22:容器</p>
        <p type="p">23:抽取泵</p>
        <p type="p">31:供電單元</p>
        <p type="p">41:擴香卡</p>
        <p type="p">42:條碼</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="261" publication-number="202624775">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624775</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147295</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>動力源異常檢測方法及其系統</chinese-title>
        <english-title>POWER SOURCE ANOMALY DETECTION METHOD AND SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250306B">G01R31/34</main-classification>
        <further-classification edition="201601120250306B">H02K11/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立屏東科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳智勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH-YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇智翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, ZHI-XIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張育惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YU-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張鐸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, TO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃珊珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種動力源異常檢測方法，於一裝置設置步驟中，對一動力源上設置一偵測單元，於一特徵建置步驟中，於一比對資料庫中建立比對資料，於一工作監測步驟中，該動力源工作運轉以使該偵測單元取得運轉的偵測資料，於一資料收集步驟中，一資料收集模組收集該偵測單元的偵測資料，於一資料轉換步驟中，該分析比對模組中的一轉換函數對該資料收集模組收集的偵測資料進行分析以取得一偵測特徵資料，於一狀態分析步驟中，該分析比對模組進行該偵測特徵資料的比對，於該結果輸出步驟中，輸出該分析比對模組的分析比對結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power source anomaly detection method. In a device setting step, a detection unit is set on a power source. In a feature creation step, comparison data is created in a comparison database. In a work monitoring step, the power source is operated so that the detection unit obtains operation detection data. In a data collection step, a data collection module collects detection data of the detection unit. In a data conversion step, a conversion function in the analysis and comparison module analyzes the detection data collected by the data collection module to obtain detection characteristic data. In a state analysis step, the analysis and comparison module performs comparison of the detection characteristic data. In the result output step, the analysis and comparison results of the analysis and comparison module are output.</p>
      </isu-abst>
      <representative-img>
        <p type="p">31:動力單元</p>
        <p type="p">311:動力源</p>
        <p type="p">32:偵測單元</p>
        <p type="p">321:震動偵測模組</p>
        <p type="p">322:聲音偵測模組</p>
        <p type="p">323:溫度偵測模組</p>
        <p type="p">324:電流偵測模組</p>
        <p type="p">325:轉速偵測模組</p>
        <p type="p">33:分析單元</p>
        <p type="p">331:資料收集模組</p>
        <p type="p">332:分析比對模組</p>
        <p type="p">333:比對資料庫</p>
        <p type="p">334:圖形化模組</p>
        <p type="p">34:顯示單元</p>
        <p type="p">341:資料顯示模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="262" publication-number="202624050">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624050</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147298</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>車輛防盜系統及車輛防盜方法</chinese-title>
        <english-title>VEHICLE ANTI-THEFT SYSTEM AND VEHICLE ANTI-THEFT METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120241230B">B60R25/25</main-classification>
        <further-classification edition="201301120241230B">B60R25/33</further-classification>
        <further-classification edition="201301120241230B">B60R25/31</further-classification>
        <further-classification edition="200601120241230B">G08B25/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>啓碁科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON NEWEB CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹益坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, I-KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種車輛防盜系統，車輛防盜系統包含車輛以及雲端監控中心。車輛包含追蹤器及攝影裝置。追蹤器包含定位模組及追蹤器處理器。定位模組用以產生複數定位座標。追蹤器處理器儲存電子圍籬座標區域，追蹤器處理器判斷車輛位於安全區域或警戒區域，車輛位於電子圍籬座標區域外時，判斷車輛位於警戒區域。攝影裝置包含攝影機處理器及攝影機。當追蹤器處理器判定車輛位於警戒區域時，攝影機處理器判斷車輛是否處於警示狀態或安全狀態。雲端監控中心接收定位座標。藉此，可判斷車輛狀態並追蹤車輛位置，而可減少車輛遭偷盜的可能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a vehicle anti-theft system. The vehicle anti-theft system includes a vehicle and a cloud monitoring center. The vehicle includes a tracker and a photographing device. The tracker includes a positioning module and a tracking processor. The positioning module is configured for generating a plurality of positioning coordinates. The tracking processor stores an electronic fence coordinate area. The tracking processor judges if the vehicle is in a safe area or in a warning area. When the vehicle is outside the electronic fence coordinate area, the vehicle is in the warning area. The photographing device includes a photographing processor and a camera. When the tracker judges the vehicle is in the warning area, the photographing processor judges if the vehicle is in a warning status or a safe status. The cloud monitoring center receives the positioning coordinates. Therefore, the status of the vehicle can be determined, and the position of the vehicle can be tracked, thereby decreasing the possibility of vehicle theft.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:車輛</p>
        <p type="p">110:追蹤器</p>
        <p type="p">111:定位模組</p>
        <p type="p">112:追蹤器處理器</p>
        <p type="p">113:追蹤藍芽收發模組</p>
        <p type="p">114:車輛網路模組</p>
        <p type="p">115:燈光</p>
        <p type="p">116:喇叭</p>
        <p type="p">120:攝影裝置</p>
        <p type="p">121:攝影機處理器</p>
        <p type="p">122:攝影機</p>
        <p type="p">123:攝影藍芽收發模組</p>
        <p type="p">124:防盜元件</p>
        <p type="p">200:雲端監控中心</p>
        <p type="p">210:監控處理器</p>
        <p type="p">220:顯示模組</p>
        <p type="p">230:監控網路模組</p>
        <p type="p">300:車輛防盜系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="263" publication-number="202624728">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624728</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147299</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>物件檢查裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">G01N21/88</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬潤科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALL RING TECH CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃景德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHING-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉家豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIA-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇麟翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, LIN-SHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種物件檢查裝置。該物件檢查裝置適用於檢查複數個物件，並設有一旋轉座、複數個保持組件，以及複數個第一檢查站。該旋轉座能沿一旋轉方向間歇旋轉。所述保持組件沿該旋轉方向間隔排列地設置在該旋轉座上。每一該保持組件適用於保持各別的一個該物件。所述第一檢查站在該旋轉方向上分別對應所述保持組件的其中至少數個地排列設置在該旋轉座外。每一該第一檢查站設有可將該物件相對該保持組件移出或移入的一提取機構，以及可對位於該提取機構上的該物件拍攝的一第一取像機構。本發明可解決以人力檢查所述物件較為費時費力的問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:旋轉座</p>
        <p type="p">11:盤體部</p>
        <p type="p">12:座臂部</p>
        <p type="p">2:保持組件</p>
        <p type="p">3:第一檢查站</p>
        <p type="p">31:提取機構</p>
        <p type="p">R1:旋轉方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="264" publication-number="202623928">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623928</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147300</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自動傳動裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">B23G1/44</main-classification>
        <further-classification edition="200601120241230B">B21H3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍵財機械企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN TSAI MACHINERY ENTERPRISE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳清雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHING-HSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自動傳動裝置適用於具有搓牙通道的搓牙機，並包含安裝於搓牙機的傳動機構、導引機構及彈力機構。傳動機構能前後往復運動且包括第一抵靠面。導引機構包括可脫離地靠抵第一抵靠面的第二抵靠面，並在第一、二位置間移動。在第一位置時，導引機構位於該搓牙通道。在第二位置時，導引機構移離搓牙通道。彈力機構連接導引機構並提供導引機構朝向第一位置移動的彈力。利用第一抵靠面靠抵於第二抵靠面，在導引機構卡住無法後移時，傳動機構能維持作動，避免發生傳動機構與帶動機構也被卡住無法運轉而損壞的情況，並有效降低維修成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:自動傳動裝置</p>
        <p type="p">1:帶動機構</p>
        <p type="p">11:偏心輪</p>
        <p type="p">12:搖臂</p>
        <p type="p">121:樞接部</p>
        <p type="p">122:臂部</p>
        <p type="p">123:萬向接頭部</p>
        <p type="p">13:軸筒</p>
        <p type="p">14:連接件</p>
        <p type="p">2:傳動機構</p>
        <p type="p">21:連桿組</p>
        <p type="p">211:連桿</p>
        <p type="p">212:限位件</p>
        <p type="p">22:第一抵靠組</p>
        <p type="p">221:套接塊</p>
        <p type="p">222:第一抵靠塊</p>
        <p type="p">223:第一抵靠面</p>
        <p type="p">3:導引機構</p>
        <p type="p">31:導引塊</p>
        <p type="p">311:槽面</p>
        <p type="p">312:槽底面部</p>
        <p type="p">313:槽周面部</p>
        <p type="p">314:容槽</p>
        <p type="p">315:開口</p>
        <p type="p">32:導引板</p>
        <p type="p">33:第二抵靠組</p>
        <p type="p">331:固定塊</p>
        <p type="p">332:抵靠桿</p>
        <p type="p">333:固接件</p>
        <p type="p">334:第二抵靠面</p>
        <p type="p">4:彈力機構</p>
        <p type="p">41:彈力頂撐組</p>
        <p type="p">411:頂撐塊</p>
        <p type="p">412:輔助限位件</p>
        <p type="p">42:彈性件</p>
        <p type="p">94:預成形件</p>
        <p type="p">X1:第一方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="265" publication-number="202624414">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624414</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147301</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>塗料套組</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241211B">C09D5/08</main-classification>
        <further-classification edition="200601120241211B">C09D183/04</further-classification>
        <further-classification edition="200601120241211B">C23F11/173</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勝一化工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINY CHEMICAL INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林盛偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHENG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙玹紳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAO, HSUAN-SHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫啓發</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, CHI-FA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種塗料套組，包含彼此分開包裝的一呈酸性的第一劑與一呈鹼性的第二劑。以該第一劑的總量為100 wt%計，該第一劑包括25～40wt%的烷氧基矽烷組分，以及餘量的第一溶劑。以該烷氧基矽烷組分的總量為100wt%計，該烷氧基矽烷組分包括不少於10wt%的二烷氧基矽烷。該第一溶劑包括水及醇類。以該第二劑的總量為100 wt%計，該第二劑的水含量不超過5wt%，且該第二劑包括20～50wt%的氨烷基烷氧基矽烷組分，以及餘量的第二溶劑。該第二溶劑包括醇類。以該第二劑的使用量為基準，該第一劑的使用量為該第二劑的使用量的0.4～2倍。該烷氧基矽烷組分不同於該氨烷基烷氧基矽烷組分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="266" publication-number="202625123">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625123</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147306</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>折疊式顯示裝置</chinese-title>
        <english-title>FOLDABLE DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250415B">G09F9/30</main-classification>
        <further-classification edition="200601120250415B">G09F9/302</further-classification>
        <further-classification edition="200601120250415B">F16M11/06</further-classification>
        <further-classification edition="200601120250415B">H05K5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳美蓁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MEI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種折疊式顯示裝置，包含一軟性顯示器、複數三角形機殼以及複數旋轉機構。軟性顯示器包含一表面。前述複數三角形機殼連接軟性顯示器且將表面劃分為複數三角形區域。每一旋轉機構連接每一三角形機殼，且每一旋轉機構包含一旋轉軸、一馬達及一旋轉支架。旋轉軸連接於每一三角形機殼的一側邊，側邊不平行於軟性顯示器的一長邊方向。馬達用以驅動旋轉軸旋轉且位於旋轉軸的一端。旋轉支架連接旋轉軸並支撐每一三角形機殼。其中，前述複數旋轉機構轉動，使軟性顯示器折疊為一三角形。藉此可提高使用便利性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a foldable display device including a flexible display, a plurality of triangle cases and a plurality of rotating mechanisms. The flexible display includes a surface. The rotating mechanisms are connected to the flexible display to divide the surface into a plurality of triangle areas. Each of the rotating mechanisms is connected to each of the triangle cases. Each of the rotating mechanisms includes a rotating axle, a motor and a frame. The rotating axle is connected to a side of each of the triangle cases, and the side of each of the triangle cases is not parallel to a length direction of the flexible display. The motor drives the rotating axle and is located at one end of the rotating axle. The frame is connected to the rotating axle and supports each of the triangle cases. As the rotating mechanisms rotate, the flexible display is folded into a triangle. Therefore, the using convenience is increased.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:折疊式顯示裝置</p>
        <p type="p">110:軟性顯示器</p>
        <p type="p">120:三角形機殼</p>
        <p type="p">130:旋轉機構</p>
        <p type="p">131:旋轉軸</p>
        <p type="p">132:旋轉支架</p>
        <p type="p">140:玻璃蓋板</p>
        <p type="p">150:軟性印刷電路板</p>
        <p type="p">160:印刷電路板組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="267" publication-number="202625130">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625130</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147308</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發光訊號產生電路及移位暫存器</chinese-title>
        <english-title>LIGHT EMITTING SIGNAL GENERATION CIRCUIT AND SHIFT REGISTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250425B">G09G3/30</main-classification>
        <further-classification edition="202001120250425B">H05B45/30</further-classification>
        <further-classification edition="200601120250425B">G11C27/04</further-classification>
        <further-classification edition="200601120250425B">G11C19/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHE-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董哲維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUNG, CHE-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李玫憶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, MEI-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭豫杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, YU-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱郁勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, YU-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉恩池</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, EN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊銘宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, MING-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種發光訊號產生電路，用以驅動一像素列且包含第一電路單元、第二電路單元及第三電路單元。第一電路單元依據總時脈訊號、第一參考訊號及第二參考訊號產生總發光訊號。第二電路單元耦接第一電路單元，且依據總發光訊號、第一參考訊號、第二參考訊號及第一時脈訊號產生第一發光訊號，以驅動此像素列的第一子像素及第二子像素。第三電路單元耦接第一電路單元，且依據總發光訊號、第一參考訊號、第二參考訊號及第二時脈訊號產生第二發光訊號，以驅動此像素列的第三子像素。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light emitting signal generation circuit for driving a row of pixels and including a first circuit module, a second circuit module, and a third circuit module. The first circuit module generates a total emitting signal based on a total clock signal, a first reference signal and a second reference signal. The second circuit module is coupled to the first circuit module and generates a first light emitting signal to drive a first sub-pixel and a second sub-pixel of the row of pixels based on the total light emitting signal, the first reference signal, the second reference signal, and a first clock signal. The third circuit module is coupled to the first circuit module and generates a second light emitting signal based on the total light emitting signal, the first reference signal, the second reference signal, and a second clock signal to drive a third sub-pixel of the row of pixels.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:移位暫存器</p>
        <p type="p">110:發光訊號產生電路</p>
        <p type="p">111:第一電路單元</p>
        <p type="p">112:第二電路單元</p>
        <p type="p">113:第三電路單元</p>
        <p type="p">CKE,XCKE:總時脈訊號</p>
        <p type="p">EMT[1],EMT[2],EMT[n-1]:總發光訊號</p>
        <p type="p">G_CK:第二時脈訊號</p>
        <p type="p">G[1],G[2],G[3],G[n]:發光訊號</p>
        <p type="p">RB_CK:第一時脈訊號</p>
        <p type="p">RB[1],RB[2],RB[3],RB[n]:發光訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="268" publication-number="202625135">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625135</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147309</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置及降低雜訊的方法</chinese-title>
        <english-title>DISPLAY DEVICE AND METHOD OF REDUCING NOISE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120250305B">G09G3/32</main-classification>
        <further-classification edition="200601120250305B">G09G3/36</further-classification>
        <further-classification edition="200601120250305B">H03K19/0185</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐偉鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, WEI-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁友信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TING, YU-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅春霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, CHUNG-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提出一種顯示裝置和降低雜訊的方法。顯示裝置包含源極驅動電路和顯示面板。顯示面板包含多個資料線和多工器。多工器包含多個控制信號線、多個反向信號線和多個多工器電路。每一個多工器電路包含第一電晶體和第二電晶體。第一電晶體具有第一端、第二端和第一控制端。第一端耦接源極驅動電路。第二端耦接其中一個資料線，且第一控制端耦接其中一個控制信號線。第二電晶體具有第三端、第四端和第二控制端。第三端和第四端耦接其中一個反向信號線。第二控制端耦接第一電晶體的第一端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device and a method of liquid crystal display are provided. The display device includes a source driving circuit and a display panel. The display panel includes multiple data lines and a multiplexer. The multiplexer includes multiple control signal lines, multiple inverse signal lines, and multiple multiplex circuits. Each multiplex circuit includes a first transistor and a second transistor. The first transistor has a first end, a second end, and a first control end. The first end is coupled to the source driving circuit. The second end is coupled to one of the data lines, and the first control end is coupled to one of the control signal lines. The second transistor has a third end, a fourth end, and a second control end. The third end and the fourth end are coupled to one of the inverse signal lines. The second control end is coupled to the first end of the first transistor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">120:源極驅動電路</p>
        <p type="p">200A:多工器</p>
        <p type="p">210A,220A,230A,240A,250A,260A:多工器電路</p>
        <p type="p">311:第一端</p>
        <p type="p">312:第二端</p>
        <p type="p">313:第三端</p>
        <p type="p">314:第四端</p>
        <p type="p">DL1~DL6:資料線</p>
        <p type="p">S1:第一源極驅動信號</p>
        <p type="p">S2:第二源極驅動信號</p>
        <p type="p">SW1~SW3:控制信號線</p>
        <p type="p">XSW1~XSW3:反向信號線</p>
        <p type="p">T1:第一電晶體</p>
        <p type="p">T2:第二電晶體</p>
        <p type="p">X,Y:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="269" publication-number="202624709">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624709</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147311</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>管線監測模組與管線監測方法</chinese-title>
        <english-title>TUBE DETECTION MODULE AND TUBE DETECTION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">G01M3/24</main-classification>
        <further-classification edition="200601120241231B">F17D5/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭佩棋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, PEI-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭沁柔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHIN-JOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇中源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, CHUNG-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李柏勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, BOR-SHIUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">管線監測模組包含至少兩感測裝置以及分析模組。兩感測裝置設置於管線外，感測裝置中的每一者包含訊號發送器以及訊號接收器。訊號發送器與訊號接收器沿著管線的軸向排列。分析模組電性連接感測裝置，其中分析模組配置以分析訊號接收器接收的實際訊號以判斷管線的狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A tube detection module includes at least two sensing devices and an analysis module. The two sensing devices are disposed outside the tube. Each one of the sensing devices includes a signal emitter and a signal receiver. The signal emitter and the signal receiver are arranged along an axial direction of the tube. The analysis module is electrically connected to the sensing devices and configured to analysis a real signal received by the signal receiver to determine the condition of the tube.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:第一感測裝置</p>
        <p type="p">112:第一訊號發送器</p>
        <p type="p">114:第一訊號接收器</p>
        <p type="p">120:第二感測裝置</p>
        <p type="p">122:第二訊號發送器</p>
        <p type="p">124:第二訊號接收器</p>
        <p type="p">140:耦合層</p>
        <p type="p">200:管線</p>
        <p type="p">210:外壁</p>
        <p type="p">AX:軸向</p>
        <p type="p">θ:角度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="270" publication-number="202625032">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625032</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147313</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>旅遊活動管理系統及其管理方法</chinese-title>
        <english-title>TOURISM ACTIVITY MANAGEMENT SYSTEM AND MANAGEMENT METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250305B">G06Q10/06</main-classification>
        <further-classification edition="201201120250305B">G06Q50/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亮言</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, LIANG-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亮言</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, LIANG-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種旅遊活動管理系統及其管理方法，旅遊活動管理方法包含：由活動創建管理模組接收來自伺服器所管理的活動創建者的會員帳號所委託的活動創建請求；活動創建請求經由活動創建管理模組中的處理單元處理後產生邀約請求，並透過第一收發單元將邀約請求之訊息傳送至活動參與管理模組中的所有活動參與者的會員帳號，並透過處理單元接收活動參與者的回應訊息，再由處理單元將回應訊息傳送至第一收發單元；活動參與者的回應訊息為參與時，根據該回應訊息開啟活動事件，產生並傳送群組掃描碼至活動創建者及活動參與者的電子裝置上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a tourism activity management system and management method thereof. The tourism activity management method includes: receiving an activity creation request authorized by the membership account of the activity creator managed by the server via an activity creation management module; processing the activity creation request through a processing unit in the activity creation management module to generate an invitation request, transmitting the invitation request message to all participants' membership accounts in the activity participation management module via a first transceiver unit, and receiving participants' response messages through the processing unit. The response messages are then transmitted back to the first transceiver unit via the processing unit. If the response message from a participant indicates participation, an activity event is initiated based on the response message, and a group QR code is generated and sent to the electronic devices of the activity creator and participants.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:旅遊活動管理系統</p>
        <p type="p">10:伺服器</p>
        <p type="p">11:註冊單元</p>
        <p type="p">12:資料庫</p>
        <p type="p">13:處理單元</p>
        <p type="p">20:活動創建管理模組</p>
        <p type="p">21:活動創建單元</p>
        <p type="p">22:第一收發單元</p>
        <p type="p">30:活動參與管理模組</p>
        <p type="p">31:第二收發單元</p>
        <p type="p">32:查詢單元</p>
        <p type="p">33:活動啟動單元</p>
        <p type="p">34:活動確認單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="271" publication-number="202624588">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624588</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147315</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>節能減碳環保型染布印花機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250324B">D06B3/32</main-classification>
        <further-classification edition="200601120250324B">D06B3/12</further-classification>
        <further-classification edition="200601120250324B">D06B3/14</further-classification>
        <further-classification edition="200601120250324B">D06C23/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡木春</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡木春</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃信嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝煒勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種節能減碳環保型染布印花機，包括一儲布輪、複數個導向用的滾輪、一展布輪、一槽體、一滾壓機構、一第一乾燥滾輪組及一第二乾燥滾輪組及一回收布輪。將一布料經該儲布輪送出後，依序通過展布、浸染、滾壓及乾燥後，快速獲得染色效果，本創作之主要手段係利用該滾壓機構能對浸染有該染液的該布料進行輸送過程中的壓力夾擠，使該染液充分進入該布料的纖維內，並去除多餘的該染液，最後由該第一乾燥滾輪組及該第二乾燥滾輪組完全乾燥後完成染色程序，據以大幅降低染料浪費，更減少水資源和染料的使用量，兼顧環保與高效染色之功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:節能減碳環保型染布印花機</p>
        <p type="p">11:儲布輪</p>
        <p type="p">12:滾輪</p>
        <p type="p">121:第一滾輪</p>
        <p type="p">122:第二滾輪</p>
        <p type="p">123:第三滾輪</p>
        <p type="p">124:第四滾輪</p>
        <p type="p">125:第五滾輪</p>
        <p type="p">13:展布輪</p>
        <p type="p">14:槽體</p>
        <p type="p">15:滾壓機構</p>
        <p type="p">151:金屬滾筒</p>
        <p type="p">1511:印花結構</p>
        <p type="p">152:油壓輪</p>
        <p type="p">16:第一乾燥滾輪組</p>
        <p type="p">161:第一乾燥滾輪</p>
        <p type="p">17:第二乾燥滾輪組</p>
        <p type="p">171:第二乾燥滾輪</p>
        <p type="p">18:回收布輪</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="272" publication-number="202625155">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625155</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147319</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可折收康茄鼓架</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">G10G5/00</main-classification>
        <further-classification edition="202001120241231B">G10D13/03</further-classification>
        <further-classification edition="202001120241231B">G10D13/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>信聲實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張銘益</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林湧群</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹銘煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓修齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可折收康茄鼓架，由多個腳架單元及連結單元相互連接圈圍構成一可用以承托康茄鼓之框架，各腳架單元分別具有一與連結單元相互固接之主桿，主桿具有一上關節部，而一支撐單元具有一活動肘部，支撐單元以其活動肘部與上關節部樞接，使支撐單元可相對主桿樞擺，且支撐單元向外延伸形成有一支撐臂，並於支撐臂之延伸末端樞設有一呈狹長狀而可自由樞擺之承托件，並藉此使本發明具有可穩固承托康茄鼓以及可折收縮小材積之功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:腳架單元</p>
        <p type="p">12:主桿</p>
        <p type="p">13:上關節部</p>
        <p type="p">14:下關節部</p>
        <p type="p">21:支撐單元</p>
        <p type="p">22:第一活動肘部</p>
        <p type="p">23:第一鎖設件</p>
        <p type="p">25:承托件</p>
        <p type="p">31:連結單元</p>
        <p type="p">32:束環</p>
        <p type="p">33:連桿</p>
        <p type="p">41:腳柱</p>
        <p type="p">42:第二活動肘部</p>
        <p type="p">43:第二鎖設件</p>
        <p type="p">44:伸縮腳</p>
        <p type="p">45:圈束件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="273" publication-number="202624479">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624479</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147323</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有密封蓋的凍存管</chinese-title>
        <english-title>CRYOGENIC VIAL WITH SEALED CAP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">C12M1/24</main-classification>
        <further-classification edition="200601120250501B">C12M1/26</further-classification>
        <further-classification edition="201001120250501B">C12N5/071</further-classification>
        <further-classification edition="200601120250501B">C09K3/18</further-classification>
        <further-classification edition="200601120250501B">A61B10/02</further-classification>
        <further-classification edition="200601120250501B">B65D85/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>向榮生醫科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNICOCELL BIOMED CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林震宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHEN YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種具有密封蓋的凍存管，包括：管體、塞體以及固定件。其中，該管體具有：腔室、開孔、第一卡齒、第二卡齒以及凸齒部。該腔室形成於管體內部；該開孔設置於管體一端連接該腔室與外界；該第一卡齒與該第二卡齒設置於管體一端的外圍表面。該塞體設置於該管體的開孔用以封閉開孔。該固定件為管狀，且設置於管體的一端以將塞體固定於開孔，並具有：第一溝槽、第二溝槽、第三溝槽、定位部、封蓋以及凹齒部。其中，該第一溝槽與該第二溝槽位於固定件的內圍表面。使用時，塞體可以先安置於開孔，再以固定件的底端開口朝開孔壓合，使固定件的內圍表面沿著管體的外圍表面朝管體的另一端滑動。直到該第二溝槽滑過第一卡齒，再與第二卡齒相互卡合，以穩固連接並密封管體。此外，封蓋與固定件之間設置有易斷部，使封蓋可以從固定件上扭斷以露出塞體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a cryogenic vial with sealed cap, which includes a tube body, a plug, and a fastener. Wherein, the tube body has a chamber, an opening, a first latching tooth, a second latching tooth, and a convex tooth portion. The chamber is formed inside the tube body. The opening is at one end of the tube body to connect the chamber with the outside. The first latching tooth and the second latching tooth are provided on the peripheral surface of one end of the tube body. The plug seals the opening. The fastener is tubular, and is provided at the one end of the tube body to secure the plug in place. The fastener has a first groove, a second groove, a third groove, a positioning part, a cover, and a concave tooth part. Wherein, the first groove and the second groove are on the inner peripheral surface of the fastener. During use, the plug is inserted into the opening, and then the bottom opening of the fastener is pressed towards the opening. This causes the inner peripheral surface of the fastener to slides towards the other end of the tube body along the peripheral surface. Until the second groove slides past the first latching tooth, it engages with the second latching tooth to firmly connect and seal the tube body.　In addition, a breakable portion is provided between the cover and the fastener so that the cover can be twisted off from the fastener to expose the plug.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:管體</p>
        <p type="p">101:第一端</p>
        <p type="p">102:第二端</p>
        <p type="p">12:開孔</p>
        <p type="p">13:第一卡齒</p>
        <p type="p">14:第二卡齒</p>
        <p type="p">15:凸齒部</p>
        <p type="p">20:塞體</p>
        <p type="p">21:組裝凸起部</p>
        <p type="p">22:凸緣</p>
        <p type="p">23:穿刺部</p>
        <p type="p">24:導引部</p>
        <p type="p">25:密封部</p>
        <p type="p">26:凹陷部</p>
        <p type="p">30:固定件</p>
        <p type="p">31:第一溝槽</p>
        <p type="p">341:段差</p>
        <p type="p">35:封蓋</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="274" publication-number="202625289">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625289</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147332</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>耦合式天線模組</chinese-title>
        <english-title>COUPLED ANTENNA MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250304B">H01Q1/36</main-classification>
        <further-classification edition="200601120250304B">H01Q21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佳邦科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INPAQ TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范揚鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, YANG-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王政一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHENG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝立庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, LEE-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種耦合式天線模組。耦合式天線模組包括天線承載基板、第一天線結構以及第二天線結構。第一天線結構設置以及第二天線結構相對應設置在天線承載基板上。第一天線結構具有設置在天線承載基板的上表面的一第一輻射層、設置在天線承載基板的第一側表面的一第一延伸層以及設置在天線承載基板的下表面的一第一導電層。第二天線結構具有設置在天線承載基板的上表面的一第二輻射層、設置在天線承載基板的第二側表面的一第二延伸層以及設置在天線承載基板的下表面的一第二導電層。藉此，第一天線結構可以依據不同的需求而被配置以應用於一第一天線工作頻率範圍，並且第二天線結構可以依據不同的需求而被配置以應用於一第二天線工作頻率範圍。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a coupled antenna module. The coupled antenna module includes an antenna carrier substrate, a first antenna structure and a second antenna structure. The first antenna structure and the second antenna structure are arranged correspondingly on the antenna carrier substrate. The first antenna structure has a first radiation layer disposed on the upper surface of the antenna carrier substrate, a first extension layer disposed on the first lateral surface of the antenna carrier substrate, and a first conductive layer disposed on the lower surface of the antenna carrier substrate. The second antenna structure has a second radiation layer disposed on the upper surface of the antenna carrier substrate, a second extension layer disposed on the second lateral surface of the antenna carrier substrate, and a second conductive layer disposed on the lower surface of the antenna carrier substrate. Thereby, the first antenna structure can be configured to be applied to a first antenna operating frequency range according to different requirements, and the second antenna structure can be configured to be applied to a second antenna operating frequency range according to different requirements.</p>
      </isu-abst>
      <representative-img>
        <p type="p">M:耦合式天線模組</p>
        <p type="p">1:天線承載基板</p>
        <p type="p">101:上表面</p>
        <p type="p">1010:連續蜿蜒狀區域</p>
        <p type="p">1011:第一分隔區域</p>
        <p type="p">1012:第二分隔區域</p>
        <p type="p">102:下表面</p>
        <p type="p">103:第一側表面</p>
        <p type="p">104:第二側表面</p>
        <p type="p">105:第三側表面</p>
        <p type="p">106:第四側表面</p>
        <p type="p">2:第一天線結構</p>
        <p type="p">21:第一輻射層</p>
        <p type="p">22:第一延伸層</p>
        <p type="p">23:第一導電層</p>
        <p type="p">3:第二天線結構</p>
        <p type="p">31:第二輻射層</p>
        <p type="p">32:第二延伸層</p>
        <p type="p">33:第二導電層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="275" publication-number="202625472">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625472</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147338</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於切換操作頻段的無線通訊裝置和方法</chinese-title>
        <english-title>WIRELESS COMMUNICATION DEVICE AND METHOD FOR SWITCHING OPERATION FREQUENCY BAND</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120250303B">H04W16/14</main-classification>
        <further-classification edition="200601120250303B">H04B1/00</further-classification>
        <further-classification edition="200601120250303B">H01Q21/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>四零四科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOXA INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏國峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, KUO-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯榮傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, JUNG-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種用於切換操作頻段的無線通訊裝置和方法。無線通訊裝置包含第一天線、第二天線以及控制器。控制器耦接第一天線以及第二天線，並且經配置以執行：通過第一天線和第二天線監聽第一頻段以取得第一測量結果；以及根據第一測量結果將第一天線的資料通道從第一頻段切換至不同於第一頻段的第二頻段。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wireless communication device and a method for switching an operation frequency band are provided. The wireless communication device includes a first antenna, a second antenna, and a controller. The controller is coupled to the first antenna and the second antenna and is configured to: monitoring a first frequency band through the first antenna and the second antenna to obtain a first measurement result; and switching a data channel of the first antenna from the first frequency band to a second frequency band different from the first frequency band according to the first measurement result.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:無線通訊裝置</p>
        <p type="p">110,120:天線</p>
        <p type="p">130:控制器</p>
        <p type="p">140:頻率轉換電路</p>
        <p type="p">141,142:開關</p>
        <p type="p">143:混頻器</p>
        <p type="p">144:頻率合成器</p>
        <p type="p">145:微處理單元</p>
        <p type="p">146:射頻前端電路</p>
        <p type="p">21,22:路徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="276" publication-number="202624785">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624785</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147339</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雷達系統</chinese-title>
        <english-title>RADAR SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">G01S7/03</main-classification>
        <further-classification edition="200601120250303B">H01Q1/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立積電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHWAVE TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀翔峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHI, HSIANG-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林士凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIH-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種雷達系統。雷達系統包括多個發射天線及多個接收天線。多個發射天線包括兩發射天線，且兩發射天線用以在不同的時間發射傳送訊號。多個接收天線包括兩接收天線，且兩接收天線用以在不同的時間接收回波訊號。兩發射天線之間在某一方向上具有垂直間距且在另一方向上具有水平間距。兩接收天線之間在某一方向上具有另一垂直間距且在另一方向上具有另一水平間距，這兩方向相互垂直，兩發射天線之間的垂直間距等於兩接收天線之間的垂直間距，且兩發射天線之間的水平間距等於兩接收天線之間的水平間距。這些間距皆大於零。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A radar system is provided. The radar system includes multiple transmitting antennas and multiple receiving antennas. The multiple transmitting antennas includes two transmitting antennas, and the two transmitting antennas are used to transmit transmission signals at different times. The multiple receiving antennas include two receiving antennas, and the two receiving antennas are used to receive echo signals at different times. There is a vertical spacing between two transmitting antennas in one direction and a horizontal spacing in the other direction. There is another vertical spacing between the two receiving antennas in one direction and another horizontal spacing in the other direction, and the two directions are perpendicular to each other. The vertical spacing between the two transmitting antennas is equal to the vertical spacing between the two receiving antennas, and the horizontal spacing between two transmitting antennas is equal to the horizontal spacing between two receiving antennas. These spacings are all greater than zero.</p>
      </isu-abst>
      <representative-img>
        <p type="p">TX&lt;sub&gt;0&lt;/sub&gt;、TX&lt;sub&gt;1&lt;/sub&gt;:發射天線</p>
        <p type="p">RX&lt;sub&gt;0&lt;/sub&gt;、RX&lt;sub&gt;1&lt;/sub&gt;:接收天線</p>
        <p type="p">D1、D2:方向</p>
        <p type="p">d&lt;sub&gt;V1&lt;/sub&gt;、d&lt;sub&gt;V2&lt;/sub&gt;:垂直間距</p>
        <p type="p">d&lt;sub&gt;H1&lt;/sub&gt;、d&lt;sub&gt;H2&lt;/sub&gt;:水平間距</p>
        <p type="p">H:長度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="277" publication-number="202623872">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623872</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147340</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>旋轉蒸餾盤機構及蒸餾塔</chinese-title>
        <english-title>SPINNING DISTILLATION PLATE MECHANISM AND DISTILLATION TOWER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241226B">B01D3/02</main-classification>
        <further-classification edition="200601120241226B">B01D3/10</further-classification>
        <further-classification edition="200601120241226B">B01D3/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊智博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIH-PO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅偉仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, WEI-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王思云</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SSU YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳永泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YUNG-TAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連培榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIEN, PEI-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種旋轉蒸餾盤機構，包含固定盤及旋轉盤。固定盤包含第一主體及數個凸出環設於第一主體之底面下。第一主體具有傾斜盤面與開孔。開孔位於傾斜盤面之底部中。旋轉盤可旋轉地設於固定盤下。旋轉盤包含第二主體及數個離心霧化環設於第二主體之頂面上。離心霧化環與凸出環彼此交錯且依序圍繞在開孔外，而共同形成數個徑向流體通道。第一個離心霧化環位於開孔之下方以承接液體。旋轉盤的旋轉，使得液體因離心力而從第一個離心霧化環依序旋出離心霧化環並沿徑向流體通道朝第二主體外流出，以和從第二主體外經由徑向流體通道流入之氣體交會接觸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A spinning distillation plate mechanism includes a fixed plate and a spinning plate. The fixed plate includes a first body and plural protruding rings disposed on a bottom surface of the first body. The first body has a tilt plate surface and a hole. The hole is located in a bottom of the tilt plate surface. The spinning plate is rotatably disposed under the fixed plate. The spinning plate includes a second body and plural centrifugal atomization rings disposed on a top surface of the second body. The centrifugal atomization rings and the protruding rings are interlaced with each other and sequentially surround the hole to collectively form plural radial fluid channels. A first one of the centrifugal atomization rings is located below the hole to receive liquid. The spinning of the spinning plate causes the liquid to sequentially spin out of the centrifugal atomization rings from the first one of the centrifugal atomization rings due to centrifugal force and flow out of the second body along the radial fluid channels to meet and contact gas flowing from an outside of the second body through the radial fluid channels.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:旋轉蒸餾盤機構</p>
        <p type="p">200:固定盤</p>
        <p type="p">210:第一主體</p>
        <p type="p">212:傾斜盤面</p>
        <p type="p">214:底面</p>
        <p type="p">216:開孔</p>
        <p type="p">220:凸出環</p>
        <p type="p">222:第二內側面</p>
        <p type="p">222a:第三邊</p>
        <p type="p">222b:第四邊</p>
        <p type="p">224:第二外側面</p>
        <p type="p">230:凸出環</p>
        <p type="p">232:第二內側面</p>
        <p type="p">232a:第三邊</p>
        <p type="p">232b:第四邊</p>
        <p type="p">234:第二外側面</p>
        <p type="p">300:旋轉盤</p>
        <p type="p">310:第二主體</p>
        <p type="p">312:頂面</p>
        <p type="p">320:離心霧化環</p>
        <p type="p">322:第一內側面</p>
        <p type="p">322a:第一邊</p>
        <p type="p">322b:第二邊</p>
        <p type="p">324:第一外側面</p>
        <p type="p">330:離心霧化環</p>
        <p type="p">332:第一內側面</p>
        <p type="p">332a:第一邊</p>
        <p type="p">332b:第二邊</p>
        <p type="p">334:第一外側面</p>
        <p type="p">340:離心霧化環</p>
        <p type="p">342:第一內側面</p>
        <p type="p">342a:第一邊</p>
        <p type="p">342b:第二邊</p>
        <p type="p">344:第一外側面</p>
        <p type="p">CA:中心軸</p>
        <p type="p">D1:距離</p>
        <p type="p">D2:距離</p>
        <p type="p">D3:距離</p>
        <p type="p">D4:距離</p>
        <p type="p">G:氣體</p>
        <p type="p">L:液體</p>
        <p type="p">RFC:徑向流體通道</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="278" publication-number="202623815">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623815</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147353</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>通過KRAS突變來關聯AKR1C3酶表達水平及醫藥用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250701B">A61K31/664</main-classification>
        <further-classification edition="200601120250701B">A61K31/396</further-classification>
        <further-classification edition="200601120250701B">A61K31/04</further-classification>
        <further-classification edition="200601120250701B">A61K31/06</further-classification>
        <further-classification edition="200601120250701B">A61P35/00</further-classification>
        <further-classification edition="201801120250701B">C12Q1/6886</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳艾欣達偉醫藥科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASCENTAWITS PHARMACEUTICALS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李安蓉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, ANRONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>段建新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUAN, JIANXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齊天陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QI, TIANYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孟　繁英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENG, FANYING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊世超</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">通過KRAS突變來關聯AKR1C3酶表達水平及醫藥用途。AKR1C3酶激活的抗癌前藥可以直接使用KRAS基因突變作為用藥前檢測目標，即KRAS突變患者即是AKR1C3酶高表達的患者而無需進行AKR1C3酶表達水平或AKR1C3 RNA檢測，也就是說可以使用KRAS突變檢測陽性來作為篩選指標篩選AKR1C3酶高表達的患者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="279" publication-number="202624574">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624574</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147366</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250623B">C30B25/02</main-classification>
        <further-classification edition="200601120250623B">C30B25/18</further-classification>
        <further-classification edition="200601120250623B">C30B29/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈志彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, CHIH-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體結構包括基板、第一三族氮化物結構以及第二三族氮化物結構。第一三族氮化物結構設置於基板上，其中第一三族氮化物結構的上表面具有複數個五角形坑槽。第二三族氮化物結構設置於第一三族氮化物結構上並填充五角形坑槽。一種製造半導體結構的方法包括以下操作。形成第一三族氮化物結構在基板上。沉積碳層在第一三族氮化物結構上。蝕刻碳層與第一三族氮化物結構以形成複數個坑槽。形成第二三族氮化物結構在第一三族氮化物結構上並填充坑槽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure includes a substrate, a first group III nitride structure, and a second group III nitride structure. The first group III nitride structure is disposed on the substrate, in which an upper surface of the first group III nitride structure has a plurality of pentagonal pits. The second group III nitride structure is disposed on the first group III nitride structure and fills the pentagonal pits. A method of fabricating the semiconductor structure includes the following operations. A first group III nitride structure is formed on the substrate. A carbon layer is deposited on the first III nitride structure. The carbon layer and the first group III nitride structure are etched to form a plurality of pits. The second group III nitride structure is formed on the first group III nitride structure and fills the pits.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200A:半導體結構</p>
        <p type="p">202:基板</p>
        <p type="p">216:第一三族氮化物結構</p>
        <p type="p">206:成核層</p>
        <p type="p">208’:第一三族氮化物層</p>
        <p type="p">212:坑槽</p>
        <p type="p">230A:第二三族氮化物結構</p>
        <p type="p">240、250:超晶格結構</p>
        <p type="p">242、252:第一超晶格層</p>
        <p type="p">244、254:第二超晶格層</p>
        <p type="p">260、262:GaN層</p>
        <p type="p">264:AlGaN層</p>
        <p type="p">266:pGaN層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="280" publication-number="202624575">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624575</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147367</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250623B">C30B25/02</main-classification>
        <further-classification edition="200601120250623B">C30B25/18</further-classification>
        <further-classification edition="200601120250623B">C30B29/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈志彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, CHIH-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體結構包括基板、設置於基板上的第一三族氮化物結構、複數個碳塊及第二三族氮化物結構。第一三族氮化物結構的上表面具有複數個坑槽。這些碳塊位於這些坑槽中。第二三族氮化物結構設置於第一三族氮化物結構與這些碳塊上。一種製造半導體結構的方法包括以下操作。形成第一三族氮化物結構在基板上，其中第一三族氮化物結構的上表面具有複數個坑槽。形成複數個碳塊在這些坑槽中。形成第二三族氮化物結構在第一三族氮化物結構與這些碳塊上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure includes a substrate, a first group III nitride structure disposed on the substrate, a plurality of carbon blocks, and a second group III nitride structure. An upper surface of the first group III nitride structure has a plurality of pits. The carbon blocks are located in the pits. The second group III nitride structure is disposed on the first group III nitride structure and the carbon blocks. A method of fabricating the semiconductor structure includes the following operations. The first group III nitride structure is formed on the substrate, in which the upper surface of the first group III nitride structure has the pits. The carbon blocks are formed in the pits. The second group III nitride structure is formed on the first group III nitride structure and the carbon blocks.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:半導體結構</p>
        <p type="p">202:基板</p>
        <p type="p">204:成核層</p>
        <p type="p">206:第一三族氮化物結構</p>
        <p type="p">208:坑槽</p>
        <p type="p">210:第一側壁</p>
        <p type="p">212:第二側壁</p>
        <p type="p">218:碳塊</p>
        <p type="p">220:第二三族氮化物結構</p>
        <p type="p">t4:厚度</p>
        <p type="p">d1:深度</p>
        <p type="p">θ1:夾角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="281" publication-number="202623943">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623943</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147369</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磨床主軸改良結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">B23Q5/04</main-classification>
        <further-classification edition="200601120241230B">B24B41/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹士逸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹士逸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種磨床主軸改良結構，其包含外殼、心軸、砂輪組、無線供電組件及振動組件，心軸能轉動地設於外殼內，無線供電組件包含電磁轉換件及電路設置座，電磁轉換件固定於外殼，且能藉由一供電接口通電而產生磁場，磁電轉換件設於心軸的一端與電磁轉換件之間，且與心軸同步轉動，振動組件設有致動件，致動件電性連接磁電轉換件，砂輪組則設於心軸的另一端，且連接致動件，砂輪組受心軸驅動而轉動並加工工件時，磁電轉換件感應電磁轉換件產生之磁場的變化而產生感應電壓，從而驅動致動件帶動砂輪組振動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:外殼</p>
        <p type="p">11:襯套</p>
        <p type="p">12:後蓋</p>
        <p type="p">13:前蓋</p>
        <p type="p">14:軸承座</p>
        <p type="p">20:心軸</p>
        <p type="p">30:無線供電組件</p>
        <p type="p">31A:電磁轉換件</p>
        <p type="p">31B:磁電轉換件</p>
        <p type="p">32:電路設置座</p>
        <p type="p">40:振動組件</p>
        <p type="p">50:砂輪組</p>
        <p type="p">51:砂輪</p>
        <p type="p">52:砂輪座</p>
        <p type="p">60:連接線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="282" publication-number="202624384">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624384</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147399</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物、包含其的預浸體以及覆金屬積層板</chinese-title>
        <english-title>RESIN COMPOSITION, AND PREPREG AND METAL-CLAD LAMINATE USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241220B">C08L21/00</main-classification>
        <further-classification edition="200601120241220B">C08L71/12</further-classification>
        <further-classification edition="200601120241220B">C08L79/04</further-classification>
        <further-classification edition="200601120241220B">C08K3/36</further-classification>
        <further-classification edition="200601120241220B">C08K5/14</further-classification>
        <further-classification edition="200601120241220B">C08K5/3492</further-classification>
        <further-classification edition="200601120241220B">C08K5/5397</further-classification>
        <further-classification edition="200601120241220B">C08K5/5425</further-classification>
        <further-classification edition="200601120241220B">C08J5/24</further-classification>
        <further-classification edition="200601120241220B">B32B15/08</further-classification>
        <further-classification edition="200601120241220B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞塑膠工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAN YA PLASTICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁敬堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, CHING-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓孟淮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, MENG-HUAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳其霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種樹脂組成物、包含其的預浸體以及覆金屬積層板。樹脂組成物包括（A）改性聚苯醚樹脂，其化學結構可由以下化學式1表示；（B）雙馬來醯亞胺樹脂；（C）液態橡膠樹脂；（D）催化劑；（E）交聯劑；（F）球型二氧化矽；（G）無鹵耐燃劑；以及（H）矽氧烷偶合劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A resin composition, and a prepreg and a metal-clad laminate using the same are provided. The resin composition includes (A) a modified PPE resin represented by the following Chemical Formula 1, (B) a bismaleimide resin, (C) a liquid rubber resin, (D) a catalyst, (E) a cross-linking agent, (F) spherical silicon dioxide, (G) a halogen-free flame retardant, and (H) a siloxane coupling agent.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="283" publication-number="202624538">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624538</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147400</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於銅箔的表面處理劑</chinese-title>
        <english-title>SURFACE TREATMENT AGENT FOR COPPER FOIL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241216B">C23C22/52</main-classification>
        <further-classification edition="200601120241216B">C08K5/54</further-classification>
        <further-classification edition="201801120241216B">C09D7/40</further-classification>
        <further-classification edition="200601120241216B">C07F7/08</further-classification>
        <further-classification edition="200601120241216B">H05K3/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞塑膠工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAN YA PLASTICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁敬堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, CHING-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張宏毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HUNG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王俐婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃威儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEI-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於銅箔的表面處理劑，包括矽烷偶合劑、密著促進劑以及水性表面助劑。密著促進劑包括甲基或羧酸基的唑類結構或其衍生物。水性表面助劑包括短鏈有機矽表面活性劑、長鏈有機矽表面活性劑、改性苯乙烯-馬來酸共聚物、聚丙烯酸酯或炔二醇。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a surface treatment agent for copper foil, which includes a silane coupling agent, an adhesion accelerator and a water-based surface additive. The adhesion accelerator includes methyl or carboxylic acid-based azole structures or derivatives thereof. The water-based surface additive includes a short-chain silicone surfactant, a long-chain silicone surfactant, modified styrene-maleic acid copolymers, polyacrylates or acetylene glycols.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="284" publication-number="202624383">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624383</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147401</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>低介電樹脂組成物</chinese-title>
        <english-title>LOW DIELECTRIC RESIN COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241220B">C08L9/06</main-classification>
        <further-classification edition="200601120241220B">C08L25/02</further-classification>
        <further-classification edition="200601120241220B">C08L39/04</further-classification>
        <further-classification edition="200601120241220B">C08L71/12</further-classification>
        <further-classification edition="200601120241220B">C08K5/14</further-classification>
        <further-classification edition="200601120241220B">C08K5/3492</further-classification>
        <further-classification edition="200601120241220B">C08K5/5397</further-classification>
        <further-classification edition="200601120241220B">C08K5/5425</further-classification>
        <further-classification edition="200601120241220B">C08K7/18</further-classification>
        <further-classification edition="200601120241220B">C08K7/26</further-classification>
        <further-classification edition="200601120241220B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞塑膠工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAN YA PLASTICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁敬堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, CHING-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔鈺君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUI, YU-JUIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張宏毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HUNG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃威儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEI-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉家霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIA-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種低介電樹脂組成物，包括含氮雜芳香族環苯乙烯聚合物樹脂、PPE樹脂、聚二乙烯苯樹脂、SBS樹脂、交聯劑、磷系耐燃劑、球型二氧化矽、二氧化矽中空微球或二氧化矽中空微球懸浮液、過氧化物促進劑以及矽氧烷偶合劑。本發明的低介電樹脂組成物，加工後的外觀優良且介電常數與介電損耗進一步地降低。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a low dielectric resin composition, including a nitrogen-containing aromatic cyclone polymer resin, a PPE resin, a polyethylene resin, a SBS resin, a cross-linked agent, a phosphorus flame retardant, a spherical silica, a silicon dioxide hollow microsphere or silicon dioxide hollow microsphere suspension, a peroxide promoter, and a siloxane coupling agent. As for the low dielectric resin composition of the invention, the appearance after processing is excellent and the dielectric constant and dielectric loss have been further reduced.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="285" publication-number="202624247">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624247</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147402</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磷系耐燃劑及包含其的製品</chinese-title>
        <english-title>PHOSPHOROUS FLAME RETARDANT AND PRODUCT INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250107B">C07F9/50</main-classification>
        <further-classification edition="200601120250107B">C08K5/50</further-classification>
        <further-classification edition="200601120250107B">C09K21/12</further-classification>
        <further-classification edition="200601120250107B">C08L25/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞塑膠工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAN YA PLASTICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁敬堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, CHING-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓孟淮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, MENG-HUAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳其霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種磷系耐燃劑以及包含其的製品，磷系耐燃劑為下述化學式1所示的化學結構：        &lt;br/&gt;&lt;img align="absmiddle" height="338px" width="343px" file="ed10014.JPG" alt="ed10014.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;在化學式1中，A彼此相同或不同，且各自獨立地為未經取代或經甲基或乙烯基取代的伸苯基；伸丁烯基；或伸甲基丙烷基。R1彼此相同或不同，且各自獨立地為氫；碳數1至4的烷基；或鹵素基。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a phosphorous flame retardant and a product including the same. The phosphorus flame retardant has the chemical structure shown in the following Chemical Formula 1:        &lt;br/&gt;&lt;img align="absmiddle" height="330px" width="318px" file="ed10015.JPG" alt="ed10015.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;In Chemical Formula 1, As are the same or different from each other, and As are each independently unsubstituted phenylene groups or phenylene groups substituted by methyl or vinyl groups; butenylene groups; or tert-butylidene groups. R1s are the same or different from each other, and R1s are each independently hydrogen; alkyl groups having 1 to 4 carbon atoms; or halogen.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="286" publication-number="202625716">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625716</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147411</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>材料次表面層裂紋促長方法及其機器</chinese-title>
        <english-title>METHOD AND MACHINE THEREOF FOR PROMOTING CRACK GROWTH IN THE SUBSURFACE LAYER OF MATERIALS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260223B">H10P54/00</main-classification>
        <further-classification edition="202601120260223B">H10P72/00</further-classification>
        <further-classification edition="201401120260223B">B23K26/352</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊忠義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, ZHONG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENG, CHIH-CHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張高德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, KAO-DER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁嘉仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TING, CHIA-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林坤成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種材料次表面層裂紋促長方法，以能量加工方法如雷射對材料之次表面層進行改質，以於次表面層生成多個微裂紋，其中材料包括欲分離片體與其連接之次表面層；方法包括以下步驟：以多個微米級粒子衝擊欲分離片體之上表面，以使這些微裂紋促長而產生結合結構；及以治具作動於欲分離片體，使欲分離片體於結合結構處與材料分離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for promoting crack growth in the subsurface layer of materials is provided. Modify the subsurface layer of the material using an energy processing method such as with laser beam to generate multiple micro-cracks in the subsurface layer, wherein the material includes a target separation layer and its connected subsurface layer. The method includes the following steps. Propel multiple micrometer-sized particles onto an upper surface of the target separation layer to promote the growth of micro-cracks to form a bonding structure. And then use a fixture to act on the target separation layer to separate it from the material at the bonding structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100:材料次表面層裂紋促長方法</p>
        <p type="p">S110~S130:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="287" publication-number="202623861">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623861</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147424</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高爾夫球桿頭之打擊面的加工方法</chinese-title>
        <english-title>METHOD FOR PROCESSING STRIKING SURFACE OF GOLF CLUB HEAD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120250203B">A63B53/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大田精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>O-TA PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZENG, PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露是關於一種高爾夫球桿頭之打擊面的加工方法。在此方法中，對高爾夫球桿頭進行銑削作業，以平整化高爾夫球桿頭之打擊面。根據刮削紋路選取刮削刀具，並將刮削刀具安裝於刮削刀把上。此刮削紋路為對稱或非對稱紋路，且此刮削紋路包含數個立體結構。對打擊面進行刮削作業，以根據刮削紋路而相對於刮削刀具移動高爾夫球桿頭，藉以利用刮削刀具將刮削紋路刮削在打擊面上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a method for processing a striking surface of a golf club head. In this method, a milling operation is performed on the golf club head to smoothen the striking surface of the golf club head. A scraping tool is selected according to a scraping texture and the scraping tool is installed on a scraping tool handle. The scraping texture is a symmetrical or asymmetrical texture, and the scraping texture includes plural three-dimensional structures. A scraping operation is performed on the striking surface to move the golf club head relative to the scraping tool according to the scraping texture so as to use the scraping tool to scrape the scraping texture on the striking surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:加工方法</p>
        <p type="p">S1:步驟</p>
        <p type="p">S2:步驟</p>
        <p type="p">S3:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="288" publication-number="202623740">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623740</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147427</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>肉品煎悶裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250214B">A47J37/01</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹永良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹永良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種肉品煎悶裝置包含有一煎台、一上蓋，及一上加熱器，該煎台具有一煎板，該上加熱器設於該上蓋內，當該上蓋罩設於該煎台時，該上蓋與該煎台之間形成一封閉的加熱空間，且該上加熱器輸出的上加熱溫度高於該煎板溫度，使肉品在加熱空間內所受到的加熱溫度趨近於肉品接觸煎板表面的加熱溫度，而對肉品均勻加熱，維持肉品的美味度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:煎台</p>
        <p type="p">11:殼體</p>
        <p type="p">111:台面</p>
        <p type="p">113:肩部</p>
        <p type="p">12:下容室</p>
        <p type="p">13:煎板加熱器</p>
        <p type="p">15:煎板</p>
        <p type="p">20:上蓋</p>
        <p type="p">21:罩體</p>
        <p type="p">22:上容室</p>
        <p type="p">23:把手</p>
        <p type="p">25:密封墊</p>
        <p type="p">30:上加熱器</p>
        <p type="p">31:加熱管</p>
        <p type="p">40:連結件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="289" publication-number="202624716">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624716</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147428</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>空氣偵測無人機</chinese-title>
        <english-title>AIR DETECTION DRONE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120241231B">G01N15/075</main-classification>
        <further-classification edition="200601120241231B">G01N21/17</further-classification>
        <further-classification edition="200601120241231B">G01N1/24</further-classification>
        <further-classification edition="200601120241231B">G08C17/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>研能科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICROJET TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫皓然</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOU, HAO-JAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳錦銓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIN-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃啟峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHI-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種空氣偵測無人機，包含飛行載具主體。飛行載具主體包含電源系統、飛控系統、視覺系統、偵測系統、舵機動力系統及通訊系統。電源系統提供飛行載具主體所需之電能。通訊系統用於收發指令及資料。飛控系統及舵機動力系統根據指令控制飛行載具主體之飛行。視覺系統產生視頻數據資料，並透過通訊系統對外輸出視頻數據資料。偵測系統用於偵測空污，以產生偵測數據資料，並透過通訊系統對外輸出偵測數據資料，以實現遠端存取與分析，達到可移動即時監測環境之空氣品質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An air detection drone is disclosed and includes a flying carrier main body. The flying carrier main body includes a power system, a flying control system, a vision system, a detection system, a steering gear power system and a communication system. The power system provides the required power to the flying carrier main body. The communication system is configured to transmit and receive commands and data. The flying control system and the steering gear power system control the flight of the flying carrier main body according to the commands. The vision system generates vision data, and output the vision data via the communication system. The detection system is configured to detect air pollution, generate detection data, and output the detection data via the communication system, so as to realize remote access and analysis, and achieving mobile real-time monitoring of environmental air quality.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:飛行載具主體</p>
        <p type="p">11:電源系統</p>
        <p type="p">12:飛控系統</p>
        <p type="p">13:視覺系統</p>
        <p type="p">14:偵測系統</p>
        <p type="p">14a:氣體偵測模組</p>
        <p type="p">141:控制電路板</p>
        <p type="p">142:氣體偵測主體</p>
        <p type="p">143:微控制器(MCU)</p>
        <p type="p">144:連接介面</p>
        <p type="p">15:舵機動力系統</p>
        <p type="p">16:通訊系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="290" publication-number="202623892">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623892</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147430</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>金屬負載觸媒、其用途與燃料電池</chinese-title>
        <english-title>METAL-LOADING CATALYSIST, USE THEREOF AND FUEL CELL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">B01J23/755</main-classification>
        <further-classification edition="200601120241230B">B01J32/00</further-classification>
        <further-classification edition="201701120241230B">C01B32/159</further-classification>
        <further-classification edition="200601120241230B">H01M4/90</further-classification>
        <further-classification edition="201101120241230B">B82Y30/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中正大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHUNG CHENG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>嘉義縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YUAN-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳聿滙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李忠諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種金屬負載觸媒，包含一載體、複數個奈米碳管、複數個金屬氧化物粒子以及複數個金屬粒子。載體由一海藻酸鈉混合一結構引導劑形成複數個層狀結構，每一層狀結構包含複數個弧形凹部，且弧形凹部彼此相接，層狀結構相互堆疊，且複數個容置空間形成於層狀結構的相對應二者之間。奈米碳管分散地鑲嵌於層狀結構。金屬氧化物粒子均勻地分散於容置空間中。複數個金屬粒子均勻地分散於容置空間中。藉此，提供一種成本低廉且具有高催化效率的金屬負載觸媒，可用於催化一氧氣還原反應和應用於一燃料電池。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a metal-loading catalyst that includes a support, a plurality of carbon nanotubes, a plurality of metal oxide particles, and a plurality of metal particles. The support is composed of a sodium alginate mixed with a structure-guiding agent to form a plurality of layered structures. Each of the layered structures includes a plurality of curved recesses, and the curved recesses connect to each other. The layered structures are stacked on each other, and a plurality of accommodating spaces are formed between corresponding two of the layered structures. The carbon nanotubes are dispersedly embedded in the layered structures. The metal oxide particles are evenly dispersed in the accommodating spaces. The metal particles are evenly dispersed in the accommodating spaces. Therefore, a metal-loading catalyst with a low cost and a high catalytic efficiency can be provided, that can be used to catalyze an oxygen reduction reaction and applied to a fuel cell.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:金屬負載觸媒</p>
        <p type="p">101:層狀結構</p>
        <p type="p">102:弧形凹部</p>
        <p type="p">103:容置空間</p>
        <p type="p">110:載體</p>
        <p type="p">120:奈米碳管</p>
        <p type="p">130:金屬氧化物粒子</p>
        <p type="p">140:金屬粒子</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="291" publication-number="202623785">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623785</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147431</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>金奈米粒子組合物及其應用</chinese-title>
        <english-title>GOLD NANOPARTICLE COMPOSITION AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250701B">A61K9/127</main-classification>
        <further-classification edition="200601120250701B">A61K9/16</further-classification>
        <further-classification edition="200601120250701B">A61K38/42</further-classification>
        <further-classification edition="200601120250701B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立成功大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉晨聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, CHEN-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳英齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YING-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露係關於一種金奈米粒子組合物。該金奈米粒子組合物包含金奈米粒子、囊封該金奈米粒子之脂質體及整合於該脂質體中之血紅素。亦提供一種用於治療癌症之方法以及一種用於誘導脂質氧化、膜電位變化及/或ROS產生之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a gold nanoparticle composition. The gold nanoparticle composition comprising a gold nanoparticle, a liposome encapsulating the gold nanoparticle, and a heme integrated into the liposome. A method for treating cancer and a method for inducing lipid oxidation, membrane potential change and/or ROS generation are also provided.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="292" publication-number="202625815">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625815</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147440</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有遮板冷卻裝置的沉積設備</chinese-title>
        <english-title>DEPOSITION EQUIPMENT WITH SHIELD COOLING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W40/00</main-classification>
        <further-classification edition="202601120260302B">H10P72/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>天虹科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SKYTECH INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王俊富</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHUN-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭耀璿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, YAO-SYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭啟鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHI-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉啟翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHI-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉國儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KUO-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>易錦良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YI, CHING-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱永豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種具有遮板冷卻裝置的沉積設備，主要包括一腔體、一遮板、一固定環、一承載盤及一冷卻裝置。遮板的一端連接腔體，另一端則用以承載固定環。承載盤用以承載一晶圓，其中承載盤位於固定環的下方，並可帶動承載的晶圓相對於固定環及遮板位移，使得固定環接觸晶圓的邊緣，並將晶圓固定在承載盤上。冷卻裝置連接固定環，其中冷卻裝置內具有一冷卻流體，並透過熱傳導的方式由固定環接收熱量，以降低固定環的溫度。透過固定環溫度的降低，可避免在固定環與晶圓的交界處形成薄膜，並可有效防止固定環與晶圓之間發生沾黏。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention is a deposition equipment with shield cooling device, which comprises a chamber, a shield, a fixed ring, a carrier, and a cooling device. One end of the shield is connected to the chamber, while the other end supports the fixed ring. The carrier is used to support a wafer, where the carrier is located below the fixed ring and can drive the supported wafer to displace relative to the fixed ring and the shield, causing the fixed ring to contact the edge of the wafer and fix the wafer on the carrier. The cooling device is connected to the fixed ring, wherein the cooling device contains a cooling fluid and receives heat from the fixed ring through heat conduction to reduce the temperature of the fixed ring. By reducing the temperature of the fixed ring, the formation of a film at the interface between the fixed ring and the wafer can be avoided, and the adhesion between the fixed ring and the wafer can be effectively prevented.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:具有遮板冷卻裝置的沉積設備</p>
        <p type="p">11:腔體</p>
        <p type="p">111:容置空間</p>
        <p type="p">112:反應空間</p>
        <p type="p">113:晶圓進出口</p>
        <p type="p">115:抽氣口</p>
        <p type="p">12:晶圓</p>
        <p type="p">13:承載盤</p>
        <p type="p">14:靶材</p>
        <p type="p">15:遮板</p>
        <p type="p">16:真空泵</p>
        <p type="p">161:閥門</p>
        <p type="p">17:固定環</p>
        <p type="p">19:冷卻裝置</p>
        <p type="p">191:冷卻管線</p>
        <p type="p">1911:環形冷卻部</p>
        <p type="p">1913:輸送管線</p>
        <p type="p">193:幫浦</p>
        <p type="p">195:冷槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="293" publication-number="202623763">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623763</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147441</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光感測模組</chinese-title>
        <english-title>OPTICAL SENSING MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250325B">A61B5/1455</main-classification>
        <further-classification edition="201801120250325B">G16H50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>百騰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRIGHTON PRECISION ENGINEERING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊豐如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, FENG-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張秀夏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種光感測模組，包括一承載板、至少一可動裝置、至少一光發射單元及至少一光感測單元。光發射單元用以產生一檢測光，其中檢測光用以投射至一受測體，並產生一漫反射光。可動裝置設置於承載板上，其中光發射單元則設置可動裝置上，可動裝置用以帶動光發射單元相對於承載板位移，並將產生的檢測光投射至受測體的不同區域上。光感測單元用以接收不同區域的漫反射光，可進一步分析光感測單元接收的多個漫反射光，並找出其中一個漫反射光進行運算，以提高光感測模組所檢測的生理參數的準確性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention is an optical sensing module, which comprises a carrier board, at least one movable device, at least one light emitting unit, and at least one optical sensing unit. The movable device is mounted on the carrier board, and the light emitting unit is mounted on the movable device. The movable device is used to drive the light emitting unit to displace relative to the carrier board and project a detection light onto different areas of the subject. The optical sensing unit is used to receive multiple diffuse reflected lights from different areas. Multiple diffuse reflected lights received by the optical sensing unit can be further analyzed, and one of them can be selected for calculation to improve the accuracy of the physiological parameters detected by the optical sensing module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:光感測模組</p>
        <p type="p">11:承載板</p>
        <p type="p">121:第一位置</p>
        <p type="p">123:第二位置</p>
        <p type="p">13:光發射單元</p>
        <p type="p">15:光感測單元</p>
        <p type="p">17:可動裝置</p>
        <p type="p">171:滑軌</p>
        <p type="p">173:滑座</p>
        <p type="p">18:電源供應單元</p>
        <p type="p">19:驅動單元</p>
        <p type="p">X:第一方向</p>
        <p type="p">Y:第二方向</p>
        <p type="p">L1:檢測光</p>
        <p type="p">L2:漫反射光</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="294" publication-number="202625726">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625726</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147445</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>薄膜沉積設備、承載盤及薄膜沉積方法</chinese-title>
        <english-title>THIN FILM DEPOSITION APPARATUS, HOLDING TRAY AND THIN FILM DEPOSITION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/00</main-classification>
        <further-classification edition="202601120260302B">H10P72/10</further-classification>
        <further-classification edition="202601120260302B">H10P72/70</further-classification>
        <further-classification edition="200601120260302B">C23C14/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴識翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, SHIH-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董福慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUNG, FU-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王亘黼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HSUAN-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林義鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YI-JIUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉志宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIH-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種薄膜沉積設備、承載盤及薄膜沉積方法，其中薄膜沉積設備用以透過多個容器內之靶材於一基板上進行薄膜沉積並包含一腔體、一承載盤、多個容器、一基板承座以及一侷限遮板。腔體具有一真空腔室。承載盤可轉動地設置於真空腔室中。容器設置於承載盤，容器內放置欲沉積於基板上之靶材。這些容器與承載盤的幾何中心相隔不同的距離。基板承座承載著基板，且可轉動地設置於真空腔室中。容器介於承載盤及基板承座之間。基板承座及承載盤偏心設置。侷限遮板設置於真空腔室中。侷限遮板介於基板承座及容器之間並具有一頂面、一底面及至少一槽穿孔。侷限遮板設置靠近基板承座下方，用來侷限電漿蕈狀團沉積於基板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A thin film deposition apparatus, a holding tray and a thin film deposition method. The thin film deposition apparatus is configured to perform thin film deposition on a substrate by targets, and includes a chamber, a holding tray, containers, a substrate holder and a local shutter disk. The chamber has a vacuum space. The holding tray is rotatably disposed in the vacuum space. The containers are disposed on the holding tray, and the target material to be deposited on the substrate is placed in the containers. These containers are located at different distances from the geometric center of the holding tray. The substrate holder carries the substrate and is rotatably arranged in the vacuum chamber. The containers are located between the holding tray and the substrate holder. The substrate holder and the holding tray are not concentric. The local shutter disk is disposed in the vacuum space, and located between the substrate holder and the containers. The local shutter disk has a top surface, a bottom surface and at least one slot hole. The local shutter disk is placed close to the bottom of the substrate holder to confine the deposition of the plasma plumes on the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:薄膜沉積設備</p>
        <p type="p">100:腔體</p>
        <p type="p">101:真空腔室</p>
        <p type="p">102:透明視窗</p>
        <p type="p">200:承載盤</p>
        <p type="p">300,310,320,330:容器</p>
        <p type="p">400:基板承座</p>
        <p type="p">500:侷限遮板</p>
        <p type="p">501:遮蔽部</p>
        <p type="p">502:開孔設置部</p>
        <p type="p">510:頂面</p>
        <p type="p">520:底面</p>
        <p type="p">530:槽穿孔</p>
        <p type="p">20:能量源</p>
        <p type="p">30:靶材</p>
        <p type="p">40:基板</p>
        <p type="p">C1:承載盤的幾何中心</p>
        <p type="p">C2:侷限遮板的幾何中心</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="295" publication-number="202623922">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623922</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147450</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鑄造方法及鑄造模具</chinese-title>
        <english-title>CASTING METHOD AND CASTING MOLD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">B22C9/08</main-classification>
        <further-classification edition="200601120241230B">B22C9/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH&amp;DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪啟銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, CHI-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許富淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, FU-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅章元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, ZHANG YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈閎駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, HUNG-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鑄造方法及鑄造模具。鑄造方法包含提供具有一模穴、一注入口及獨立分散的多個暗冒口的一鑄造模具，注入口及多個暗冒口位於模穴同一側；將鑄造模具接合至一澆鑄機構，而使得澆鑄機構的一澆注孔透過注入口連通於模穴，並令澆鑄機構中的一鑄造液透過澆注孔及注入口流動至模穴中而形成一鑄件；以及將鑄造模具從澆鑄機構移除，並轉動鑄造模具而使得暗冒口的水平高度高於模穴之水平高度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A casting method and casting mold. The casting method includes: providing a casting mold containing a cavity, an inlet and dispersive individual blind risers, the inlet and the blind risers are located on the same side of the cavity; bonding the casting mold to a casting mechanism so that a casting outlet of the casting mechanism is connected to the cavity via the inlet, and feeding a casting liquid to the cavity via the casting outlet and the inlet to form a cast; and removing the casting mold from the casting mechanism and rotate the casting mold to make the altitude of the blind riser to be higher than that of the cavity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:鑄造模具</p>
        <p type="p">100:上模具</p>
        <p type="p">120:暗冒口</p>
        <p type="p">150:模穴</p>
        <p type="p">200:下模具</p>
        <p type="p">300:澆流道模具</p>
        <p type="p">312:彎折段</p>
        <p type="p">313:第二連通段</p>
        <p type="p">410:第一安裝架</p>
        <p type="p">420:第二安裝架</p>
        <p type="p">20:承載板</p>
        <p type="p">40:鑄件</p>
        <p type="p">50:蓋體</p>
        <p type="p">G:重力方向</p>
        <p type="p">D:凸出方向</p>
        <p type="p">P:轉動方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="296" publication-number="202624367">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624367</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147452</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化學發泡摻混物及其製成發泡部件成品的方法</chinese-title>
        <english-title>CHEMICAL FOAM BLEND AND METHOD FOR MAKING FOAMED COMPONENT PRODUCT USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250120B">C08J9/10</main-classification>
        <further-classification edition="200601120250120B">B29C44/16</further-classification>
        <further-classification edition="201001120250120B">B29D35/12</further-classification>
        <further-classification edition="200601120250120B">A43B1/14</further-classification>
        <further-classification edition="200601320250120B">B29L31/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>豐泰企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG TAY ENTERPRISES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>雲林縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪啓源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, CHI-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施駿逸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, CHUN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖鉦達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種包含反應生成的相變材料之化學發泡摻混物，包含一熱塑性材料、一離子樹脂、一相變材料、一發泡劑及一架橋劑；離子樹脂為一酸性樹脂與一硬脂酸金屬鹽產生中和反應所生成；相變材料為硬脂酸，由硬脂酸金屬鹽與酸性樹脂經反應所生成，且另一實施例提供以前述化學發泡摻混物製成發泡部件的方法，其步驟係將前述化學發泡摻混物填入一模具中加熱發泡與架橋反應，形成一發泡部件半成品，將發泡部件半成品放置於一成型環境中收縮成型一發泡部件成品，如此方法能縮短製程的冷卻收縮時間，並讓發泡部件成品具備低密度及輕量化的特性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a chemical foam blend incorporating a phase change material, comprising a thermoplastic material, an ionic resins, a phase change material, a blowing agent, and a crosslinking agent. The ionic resins is formed through a neutralization reaction between an acidic resin and a metallic stearate. The phase change material is stearic acid, which is generated by the reaction between the metallic stearate and the acidic resin. Another embodiment provides a method for making a foamed component product from a chemical foam blend, comprising the steps of filling the chemical foam blend into a mold for heating, foaming, and crosslinking, to form a semi-finished foamed component. The semi-finished foamed component is then placed in a molding environment to shrink and form into a finished foamed component. This method shortens the cooling and shrinkage time during the manufacturing process and provides the finished foamed component with low density and lightweight characteristics.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S3:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="297" publication-number="202624045">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624045</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147453</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>車燈系統與用於車燈系統的主動調燈方法</chinese-title>
        <english-title>VEHICLE LAMP SYSTEM AND ACTIVE LIGHT ADJUSTMENT METHOD FOR A VEHICLE LAMP SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250123B">B60Q1/06</main-classification>
        <further-classification edition="201801120250123B">F21S41/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緯創資通股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林秀美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIU MEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳芊樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許晉豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIN HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱志豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHIH HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝筑媗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, ZHU XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孝璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIAO CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃博亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, PO LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井民全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JING, MING CHIUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種車燈系統，包括一基板及多個發光元件。基板具有一第一區、一第二區及一第三區，其中第一區對應至對向來車的方向，第二區與第三區對應至同向前車的方向，且第二區位於第三區上方。這些發光元件配置於基板上，且分布於第一區、第二區及第三區中，其中第一區中的多個發光元件的間距大於第二區中的多個發光元件的間距，且第二區中的多個發光元件的間距大於第三區中的多個發光元件的間距。一種用於車燈系統的主動調燈方法亦被提出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A vehicle lamp system includes a substrate and a plurality of light-emitting devices. The substrate has a first area, a second area, and a third area. The first area corresponds to a direction of an oncoming vehicle, and the second area and the third area correspond to a direction of a vehicle ahead in a same direction. The second area is located above the third area. The light-emitting devices are disposed on the substrate and distributed in the first area, the second area, and the third area. An interval between the light-emitting devices in the first area is greater than an interval between the light-emitting devices in the second area. An interval between the light-emitting devices in the second area is greater than an interval between the light-emitting devices in the third area. An active light adjustment method for a vehicle lamp system is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:基板</p>
        <p type="p">120:發光元件</p>
        <p type="p">A1:第一區</p>
        <p type="p">A2:第二區</p>
        <p type="p">A3:第三區</p>
        <p type="p">G1、G2、G3:間距</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="298" publication-number="202624187">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624187</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147454</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具α位氯基的交聯劑、其合成方法、環氧樹脂類玻璃體及其製備方法</chinese-title>
        <english-title>CROSS-LINKING AGENT WITH CHLORINE GROUP AT Α-POSITION, SYNTHESIS METHOD THEREOF, VITRIMER AND PREPARATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241220B">C07C67/14</main-classification>
        <further-classification edition="200601120241220B">C07C67/307</further-classification>
        <further-classification edition="200601120241220B">C07C67/347</further-classification>
        <further-classification edition="200601120241220B">C07C69/63</further-classification>
        <further-classification edition="200601120241220B">C08K5/103</further-classification>
        <further-classification edition="200601120241220B">C08K5/11</further-classification>
        <further-classification edition="200601120241220B">C08L63/00</further-classification>
        <further-classification edition="200601120241220B">C08J3/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中興大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHUNGHSING UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃智峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIH-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃柏睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, BO-RUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃易紳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YI-SHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種具α位氯基的交聯劑、其合成方法、環氧樹脂類玻璃體及其製備方法。具α位氯基的交聯劑的合成方法包含將多元醇與α-溴代異丁醯溴在酯化溫度下進行酯化反應以形成前驅體，將前驅體、丙烯酸第三丁酯與氯化物進行原子轉移自由基加成反應以形成中間體，以及將中間體於反應時間中去除保護基，以獲得具α位氯基的交聯劑。藉此，具α位氯基的交聯劑有利於在無催化劑存在下製備出環氧樹脂類玻璃體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a cross-linking agent with chlorine group at α-position, a synthesis method thereof, a vitrimer and a preparation method thereof. The synthesis method of the cross-linking agent with chlorine group at α-position includes performing an esterification reaction with a polyol and α-bromoisobutyryl bromide at an esterification temperature to form a precursor, performing an atom transfer radical addition reaction with the precursor, tert-butyl acrylate and a chloride to form an intermediate, and removing a protective group from the intermediate with a reaction time period to form the cross-linking agent with chlorine group at α-position. Therefore, the cross-linking agent with chlorine group at α-position can be favorable for preparing a vitrimer without a catalyst.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:具α位氯基的交聯劑的合成方法</p>
        <p type="p">110,120,130:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="299" publication-number="202624368">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624368</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147461</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具回收織物板材及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">C08J11/04</main-classification>
        <further-classification edition="200601120241230B">B29B17/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邦泰複合材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PONTEX POLYBLEND CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余有發</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳眉菱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪文彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭儒鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王昱鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖鉦達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具回收織物板材，包含一塑膠板體及複數回收織物碎片；該些回收織物碎片分布於該塑膠板體中，並平整嵌入且顯露於該塑膠板體之頂面、底面與周面；此外，在另一實施例提供一種具回收織物板材的製造方法亦揭露於此；如此，該具回收織物板材同時具備優良的機械性能，能廣泛應用於建材以及牆面裝潢等，以提高廢舊織物的回收效率，並達到實現廢舊織物的最大化利用之效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:具回收織物板材</p>
        <p type="p">10:塑膠板體</p>
        <p type="p">11:頂面</p>
        <p type="p">13:周面</p>
        <p type="p">131:第一倒圓部</p>
        <p type="p">132:平直部</p>
        <p type="p">133:第二倒圓部</p>
        <p type="p">14:染色部</p>
        <p type="p">20:回收織物碎片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="300" publication-number="202623994">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623994</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147463</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有多腔構造的複合材料之製造方法</chinese-title>
        <english-title>A MANUFACTURING METHOD OF A COMPOSITE MATERIAL WITH MULTI-SPACES STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">B29C70/34</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金盛元興業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLORY WHEEL ENTERPRISE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李健豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIEN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何崇民</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種具有多腔構造的複合材料之製造方法，其步驟包含：使用兩相材料製成的至少二個內模具，包含一指引構造；依據該指引構造於該內模具外包覆一碳纖維材料，形成至少二個纖維包覆材；組合至少二個該纖維包覆材，施加溫度以及壓力；提供一變相條件去除至少二個該內模具，形成多腔構造的複合材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a manufacturing method of a composite material with multi-spaces structure, having steps with: using at least two inner molds which comprise a guidance structure; warping a composite fabric on the inner mold according to the guidance structure to become at least two fiber covering materials; combining at least two fiber covering materials, and applying temperature and pressure; providing a transformation condition to remove at least two inner molds to form a composite material with multi-spaces structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:內模具</p>
        <p type="p">11:成形部</p>
        <p type="p">12:組合部</p>
        <p type="p">14:指引構造</p>
        <p type="p">141:纖維種類指引構造</p>
        <p type="p">142:纖維走向指引構造</p>
        <p type="p">143:纖維披覆層數指引構造</p>
        <p type="p">144:凹陷區域</p>
        <p type="p">145:突起區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="301" publication-number="202625526">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625526</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147464</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有多腔構造的機殼之製造方法及其機殼</chinese-title>
        <english-title>A MANUFACTURING METHOD OF A CASING WITH MULTI-SPACES STRUCTURE AND A CASING THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250207B">H05K5/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金盛元興業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLORY WHEEL ENTERPRISE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李健豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIEN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何崇民</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種具有多腔構造的機殼之製造方法，其步驟包含：使用兩相材料製成的至少二個內模具，包含一指引構造；依據該指引構造於該內模具外包覆一碳纖維材料，形成至少二個纖維包覆材；組合至少二個該纖維包覆材，施加溫度以及壓力；提供一變相條件去除至少二個該內模具，形成多腔構造的機殼。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a manufacturing method of a casing with multi-spaces structure, having steps with: using at least two inner molds which comprise a guidance structure; warping a composite fabric on the inner mold according to the guidance structure to become at least two fiber covering materials; combining at least two fiber covering materials, and applying temperature and pressure; providing a transformation condition to remove at least two inner molds to form a casing with multi-spaces structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:內模具</p>
        <p type="p">11:成形部</p>
        <p type="p">12:組合部</p>
        <p type="p">14:指引構造</p>
        <p type="p">141:纖維種類指引構造</p>
        <p type="p">142:纖維走向指引構造</p>
        <p type="p">143:纖維披覆層數指引構造</p>
        <p type="p">144:凹陷區域</p>
        <p type="p">145:突起區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="302" publication-number="202624826">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624826</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147465</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>攝影光學透鏡組、取像裝置及電子裝置</chinese-title>
        <english-title>PHOTOGRAPHING OPTICAL LENS ASSEMBLY, IMAGE CAPTURING UNIT AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250306B">G02B11/34</main-classification>
        <further-classification edition="202101120250306B">G02B7/02</further-classification>
        <further-classification edition="202101120250306B">G03B9/02</further-classification>
        <further-classification edition="202101120250306B">G03B17/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大根光學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LARGAN INDUSTRIAL OPTICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡翔軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, SHIANG-SHIUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施語函</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, YU-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種攝影光學透鏡組，包含七片透鏡。七片透鏡沿光路由物側至像側依序為第一透鏡、第二透鏡、第三透鏡、第四透鏡、第五透鏡、第六透鏡以及第七透鏡。七片透鏡分別具有朝向物側方向的物側表面與朝向像側方向的像側表面。第二透鏡物側表面於近光軸處為凸面，且第二透鏡像側表面於近光軸處為凹面。第五透鏡具有正屈折力。第七透鏡具有負屈折力，且第七透鏡物側表面於近光軸處為凹面。攝影光學透鏡組更包含一光圈，且光圈位於第二透鏡與第三透鏡之間。當滿足特定條件時，攝影光學透鏡組能同時滿足微型化和高成像品質的需求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A photographing optical lens assembly includes seven lens elements which are, in order from an object side to an image side along an optical path: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element. Each of the seven lens elements has an object-side surface facing toward the object side and an image-side surface facing toward the image side. The second lens element has the object-side surface being convex in a paraxial region thereof and the image-side surface being concave in a paraxial region thereof. The fifth lens element has positive refractive power. The seventh lens element with negative refractive power has the object-side surface being concave in a paraxial region thereof. The photographing optical lens assembly further includes an aperture stop disposed between the second lens element and the third lens element. When specific conditions are satisfied, the requirements of miniaturization and high image quality can be met by the photographing optical lens assembly, simultaneously.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:取像裝置</p>
        <p type="p">ST:光圈</p>
        <p type="p">E1:第一透鏡</p>
        <p type="p">E2:第二透鏡</p>
        <p type="p">E3:第三透鏡</p>
        <p type="p">E4:第四透鏡</p>
        <p type="p">E5:第五透鏡</p>
        <p type="p">E6:第六透鏡</p>
        <p type="p">E7:第七透鏡</p>
        <p type="p">E8:濾光元件</p>
        <p type="p">IMG:成像面</p>
        <p type="p">IS:電子感光元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="303" publication-number="202623993">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623993</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147467</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有多腔構造的機械結構之製造方法及其機械結構</chinese-title>
        <english-title>A MANUFACTURING METHOD OF A MACHINERY WITH MULTI-SPACES STRUCTURE AND A MACHINERY THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250217B">B29C70/30</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金盛元興業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLORY WHEEL ENTERPRISE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李健豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIEN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何崇民</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種具有多腔構造的機械結構之製造方法，其步驟包含：使用兩相材料製成的至少二個內模具，包含一指引構造；依據該指引構造於該內模具外包覆一碳纖維材料，形成至少二個纖維包覆材；組合至少二個該纖維包覆材，施加溫度以及壓力；提供一變相條件去除至少二個該內模具，形成多腔構造的機械結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a manufacturing method of a machinery with multi-spaces structure, having steps with: using at least two inner molds which comprise a guidance structure; warping a composite fabric on the inner mold according to the guidance structure to become at least two fiber covering materials; combining at least two fiber covering materials, and applying temperature and pressure; providing a transformation condition to remove at least two inner molds to form a machinery with multi-spaces structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:內模具</p>
        <p type="p">11:成形部</p>
        <p type="p">12:組合部</p>
        <p type="p">14:指引構造</p>
        <p type="p">141:纖維種類指引構造</p>
        <p type="p">142:纖維走向指引構造</p>
        <p type="p">143:纖維披覆層數指引構造</p>
        <p type="p">144:凹陷區域</p>
        <p type="p">145:突起區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="304" publication-number="202623867">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623867</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147473</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自我生成式AI遊戲引擎系統及運作方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120241230B">A63F13/63</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳泓均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳泓均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐治民</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自我生成式AI遊戲引擎系統及運作方法，應用在製作遊戲、多媒體，或是學習教材生成方式，開發一套全新自我生成製作方式，完全改變現今的製作模式與執行模式，並且在遊戲領域中，遊戲本身會有自我學習，修正，製造的模式，使得遊戲內容充滿變化率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:設計者端</p>
        <p type="p">20:使用者端</p>
        <p type="p">21:遊戲控制中心</p>
        <p type="p">30:AI遊戲生成系統</p>
        <p type="p">31:文字大模型</p>
        <p type="p">32:圖像大模型</p>
        <p type="p">33:理化大模型</p>
        <p type="p">34:狀態推理大模型</p>
        <p type="p">35:自定義大模型</p>
        <p type="p">40:邏輯解析系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="305" publication-number="202624789">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624789</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147475</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高度資訊重建系統及高度資訊重建方法</chinese-title>
        <english-title>HEIGHT INFORMATION RECONSTRUCTION SYSTEM AND HEIGHT INFORMATION RECONSTRUCTION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250303B">G01S13/93</main-classification>
        <further-classification edition="202001120250303B">G01S13/931</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯俊宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, CHUN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種高度資訊重建方法，適用於車輛，包括：透過三維雷達感測多個物體以產生對應於車輛的三維雷達點雲；透過慣性量測單元感測物體以產生對應於車輛的慣性量測資料；以及透過處理器執行：接收三維雷達點雲以及慣性量測資料，並據以計算三維雷達的雷達位移以及雷達速度；根據雷達速度計算每一物體的徑向速度；基於雷達速度和徑向速度執行動態分割以提取物體中的靜態物體；計算靜態物體的仰角角度；基於仰角角度以及雷達位移執行時序濾波以計算靜態物體的高度數值；以及根據靜態物體的高度數值產生高度重建雷達點雲。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A height information reconstruction method suitable for a vehicle, includes: sensing multiple objects through a three-dimensional radar to generate a three-dimensional radar point cloud corresponding to the vehicle; sensing objects through an inertial measurement unit to generate inertial measurement data corresponding to the vehicle data; and executing through the processor: receiving the three-dimensional radar point cloud and the inertial measurement data, and calculating the radar displacement and radar velocity of the three-dimensional radar; calculating the radial velocity of each object based on the radar speed; performing dynamic segmentation to extract a static object in the objects based on the radar velocity and radial velocity; calculating the elevation angle of the static object; performing temporal filtering to calculate the height value of the static object based on the elevation angle and the radar displacement; and generating a height reconstruction radar point cloud based on the height value of the static object.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:高度資訊重建方法</p>
        <p type="p">S210~S260:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="306" publication-number="202624563">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624563</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147476</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>板片移載輸送系統</chinese-title>
        <english-title>SHEET TRANSFER CONVEYOR SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">C25D17/08</main-classification>
        <further-classification edition="200601120241230B">C25D21/10</further-classification>
        <further-classification edition="200601120241230B">B66C11/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>億鴻工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PROCESS ADVANCE TECHNOLOGY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李伯仲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, PO-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>桃園市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種板片移載輸送系統包括電鍍吊籃載台、多個氣動旋轉柱與多個旋轉裝置。多個氣動旋轉柱分別直立安裝於該電鍍吊籃載台之四周，每一該氣動旋轉柱包括外蓋、外蓋內部墊片、內柱、把手、外筒、固定座、上墊片、下墊片、底座、旋轉套筒、C形扣與彈性件。多個旋轉裝置分別安裝於一定位平台上，每一該旋轉裝置包括汽缸固定座、旋轉汽缸、連動軸、旋轉件與環形件。當該天車裝置將該電鍍吊籃載台移動至該定位平台後，會透過內部的氣動方式來驅動機械運作以自動化進入到最終復位狀態，以讓電鍍吊籃載台穩定地安置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A sheet transfer conveyor system includes an electroplating basket carrier, a plurality of pneumatic rotary columns and a plurality of rotary devices. The pneumatic rotary columns are installed upright around the electroplating basket carrier, and each of them includes an outer cover, an inner gasket of the outer cover, an inner column, a handle, an outer cylinder, a fixing seat, an upper gasket, a lower gasket, a base, a rotary sleeve, a C-shape buckle, and an elastic member. The rotary devices are mounted on a positioning platform, and each rotary device includes a cylinder holder, a rotary cylinder, a link shaft, a rotary member and a ring member. When an overhead crane moves the electroplating basket carrier to the positioning platform, it will drive the machine to operate through the internal pneumatic method to automatically enter the final reset state, so as to stably place the electroplating basket carrier.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:板片移載輸送系統</p>
        <p type="p">100:電鍍吊籃載台</p>
        <p type="p">200:氣動旋轉柱</p>
        <p type="p">300:旋轉裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="307" publication-number="202624117">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624117</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147477</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於超級電容器的活性碳材的製法</chinese-title>
        <english-title>METHOD FOR MAKING ACTIVATED CARBON MATERIAL FOR SUPERCAPACITOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120250114B">C01B32/312</main-classification>
        <further-classification edition="201701120250114B">C01B32/342</further-classification>
        <further-classification edition="201301120250114B">H01G11/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣中油股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CPC CORPORATION, TAIWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YAN-SHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高鈺婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, YU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於超級電容器的活性碳材的製法，包括(A)在2~3atm的壓力與460~500℃的溫度下加熱重質油4小時以上，以令其經結焦生成QI值95~98wt%間且TI值89~91wt%間並含大於50vol%的介相結構的軟碳前驅物；(B)研磨分級軟碳前驅物以取得平均粒徑0.3至5mm間的細化軟碳前驅物；(C)混合細化軟碳前驅物與固態活化劑以取得混合物，細化軟碳前驅物與固態活化劑的重量比值介於0.25至0.5；(D)加熱混合物以使其經活化及碳化反應並取得含活性碳與殘留活化劑的第一碳質成分；(E)自第一碳質成分中移除殘留活化劑以取得第二碳質成分；(F)研磨分級第二碳質成分以取得第三碳質成分；及(G)加熱第三碳質成分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for making activated carbon material for supercapacitor comprises the following steps of (A) heating a heavy oil at a pressure between 2 atm and 3 atm and a temperature between 460 °C and 500 °C for at least 4 hours to cause it to generate a coking reaction and generate a soft carbon precursor having a quinoline insoluble content between 95 wt% to 98 wt% and toluene insoluble content between 89 wt% to 91 wt%, and containing a mesophase structure greater than 50 vol%; (B) grinding and grading the soft carbon precursor to obtain a refined soft carbon precursor having an average particle diameter between 0.3 mm and 5 mm; (C) mixing the refined soft carbon precursor and a solid activator to obtain a mixture, wherein a weight ratio of the refined soft carbon precursor to the solid activator ranges from 0.25 to 0.5; (D) heating the mixture to react it with an activation reaction and a carbonization reaction and to obtain a first carbonaceous component containing an activated carbon and a residual activator; (E) removing the residual activator from the first carbonaceous component to obtain a second carbonaceous component; (F) grinding and grading the second carbonaceous component to obtain a third carbonaceous component; and (G) heating the third carbonaceous component to obtain an activated carbon material for a supercapacitor.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="308" publication-number="202624591">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624591</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147478</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>均染方法</chinese-title>
        <english-title>UNIFORM DYEING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">D06P3/26</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人紡織產業綜合研究所</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN TEXTILE RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHUN-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIA-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪崇翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, CHUNG-SHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃慶堂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHING-TANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種均染方法，其包括：將聚酯布浸入含有染液的染色裝置中；以第一升溫速率進行染色製程的第一階段，直到染色裝置內的溫度達到攝氏85至95度；當染色裝置內的溫度達到攝氏85至95度時，以第二升溫速率進行染色製程的第二階段，直到染色裝置內的溫度達到攝氏120至130度，其中第二升溫速率小於第一升溫速率；以及當染色裝置內的溫度達到攝氏125至135度時，保持恆溫以進行染色製程的第三階段。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a uniform dyeing method, which includes: immersing a polyester cloth into a dyeing device containing a dye liquid; performing a first stage of a dyeing process at a first heating rate until the temperature in the dyeing device reaches 85°C to 95°C; when the temperature in the dyeing device reaches 85°C to 95°C, performing a second stage of the dyeing process at a second heating rate until the temperature in the dyeing device reaches 120°C to 130°C, in which the second heating rate is smaller than the first heating rate; and when the temperature in the dyeing device reaches 125°C to 135°C, maintaining a constant temperature to perform a third stage of the dyeing process.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10~S40:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="309" publication-number="202625223">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625223</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147481</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>平整化電阻元件及其製造方法</chinese-title>
        <english-title>FLATTENING RESISTOR AND MANUFACTURE METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250512B">H01C17/24</main-classification>
        <further-classification edition="200601120250512B">H01C17/22</further-classification>
        <further-classification edition="200601120250512B">H01C7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光頡科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIKING TECH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭順和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, SHUN-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧契佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡朝安</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種平整化電阻元件及其製造方法，其包含一基板、一電阻層以及一電極層，本發明解決電極層與電阻層交界面接合不當所導致的阻抗增加和產品特性異常問題，包括在電極層製程完成後，通過利用雷射或研磨來消除交接面高低差及處理電極層輪廓不連續的結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A flattening resistor and a manufacturing method thereof are provided. The flattening resistor includes a substrate, a resistance layer, and an electrode layer. The present disclosure solves the problems of increased impedance and abnormal product characteristics caused by improper jointing of the interface between the electrode layer and the resistance layer, which includes using laser or grinding to eliminate the step difference of the interface and process the discontinuous structure of the electrode layer after the electrode layer process is completed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:平整化電阻元件</p>
        <p type="p">10:基板</p>
        <p type="p">20:電極層</p>
        <p type="p">30:電阻層</p>
        <p type="p">40:保護層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="310" publication-number="202625674">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625674</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147486</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260316B">H10P10/00</main-classification>
        <further-classification edition="202601120260316B">H10P50/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈志彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, CHIH-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體結構包括基板、設置於基板上的超晶格結構及設置於超晶格結構上的三族氮化物結構。超晶格結構包括不同材料的複數層第一三族氮化物層與複數層第二三族氮化物層交替堆疊，超晶格結構的上表面具有複數個坑槽，且這些坑槽的側壁具有交替的複數個凸部與複數個凹部。三族氮化物結構填充這些坑槽。一種製造半導體結構的方法包括以下操作。形成超晶格結構在基板上。沉積碳層在超晶格結構上。蝕刻碳層與超晶格結構以形成複數個坑槽。形成三族氮化物結構在超晶格結構上並填充這些坑槽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure includes a substrate, a superlattice structure disposed on the substrate, and a group III nitride structure disposed on the superlattice structure. The superlattice structure includes a plurality of first group III nitride layer and a plurality of second group III nitride layer of different materials that are alternately stacked. An upper surface of the superlattice structure has a plurality of pits, and the sidewalls of the pits have a plurality of convex portions and a plurality of concave portions that are alternate. The group III nitride structure fills the pits. A method of fabricating the semiconductor structure includes the following operations. The superlattice structure is formed on the substrate. A carbon layer is deposited on the superlattice structure. The carbon layer and the superlattice structure are etched to form the pits. The group III nitride structure is formed on the superlattice structure and fills the pits.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200A:半導體結構</p>
        <p type="p">202:基板</p>
        <p type="p">204:成核層</p>
        <p type="p">206:三族氮化物層</p>
        <p type="p">208、234:超晶格結構</p>
        <p type="p">210、244:第一三族氮化物層</p>
        <p type="p">212、246:第二三族氮化物層</p>
        <p type="p">220:凸部</p>
        <p type="p">222:凹部</p>
        <p type="p">232A:三族氮化物結構</p>
        <p type="p">236、238:GaN層</p>
        <p type="p">240:AlGaN層</p>
        <p type="p">242:pGaN層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="311" publication-number="202623903">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623903</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147494</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>噴漆槍之分流蓋結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250327B">B05B7/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施念偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, NIEN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施念偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, NIEN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳芳池</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種噴漆槍之分流蓋結構，包括：一槍體、一分流蓋、一噴嘴以及一噴帽，其中，該槍體設一槍頭，該槍頭內部凹設一供氣容室，該供氣容室靠近內環壁設有至少一塗料吸引氣道以及至少一噴幅氣道，該分流蓋，係設置於該供氣容室內，該分流蓋係呈圓環狀具有一小徑段以及一大徑段，該小徑段係朝內抵靠該供氣容室底壁，並介於所述塗料吸引氣道以及噴幅氣道間；據此，該分流蓋以簡單且輕便的設計可確實將該供氣容室內之塗料吸引氣道以及噴幅氣道區隔分流，且該分流蓋組裝時不分角度，大幅降低組裝耗費的時間，具實用性者。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:槍體</p>
        <p type="p">11:槍頭</p>
        <p type="p">12:供氣容室</p>
        <p type="p">13:供漆槽室</p>
        <p type="p">14:塗料吸引氣道</p>
        <p type="p">15:噴幅氣道</p>
        <p type="p">20:分流蓋</p>
        <p type="p">21:小徑段</p>
        <p type="p">22:大徑段</p>
        <p type="p">221:凸部</p>
        <p type="p">222:透氣凹部</p>
        <p type="p">23:阻漏環</p>
        <p type="p">30:噴嘴</p>
        <p type="p">31:噴漆孔</p>
        <p type="p">32:通氣孔</p>
        <p type="p">40:噴帽</p>
        <p type="p">41:塗料吸引噴氣孔</p>
        <p type="p">42:噴幅噴氣孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="312" publication-number="202624857">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624857</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147498</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241223B">G02F1/1335</main-classification>
        <further-classification edition="200601120241223B">G02B5/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐嘉均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIA-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭家斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, CHIA-BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置，包括一顯示層、一下偏光板、一膜層組、一相機模組以及一背光模組。下偏光板位於顯示層下方。下偏光板位於膜層組與顯示層之間，膜層組具有一第一區以及一第二區。相機模組對應第一區設置。膜層組位於背光模組與下偏光板之間，其中第一區的外霧度為0，第二區的總霧度大於0。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device includes a display layer, a lower polarizing plate, a film layer group, a camera module and a backlight module. The lower polarizing plate is located below the display layer. The lower polarizing plate is located between the film layer group and the display layer. The film layer group has a first area and a second area. The camera module corresponds to the first zone settings. The film layer group is located between the backlight module and the lower polarizing plate. The external haze in the first area is 0, and the total haze in the second area is greater than 0.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示裝置</p>
        <p type="p">130:顯示層</p>
        <p type="p">140:下偏光板</p>
        <p type="p">150:膜層組</p>
        <p type="p">151:第一接合層</p>
        <p type="p">154:保護層</p>
        <p type="p">1541:外表面</p>
        <p type="p">160:相機模組</p>
        <p type="p">170:背光模組</p>
        <p type="p">180:上偏光板</p>
        <p type="p">A1:第一區</p>
        <p type="p">A2:第二區</p>
        <p type="p">DA:顯示區</p>
        <p type="p">TA:透光區</p>
        <p type="p">X、Y、Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="313" publication-number="202623899">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623899</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147499</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>血液分離管以及活化釋放血液中活性成分的方法</chinese-title>
        <english-title>BLOOD SEPARATION TUBE AND METHOD FOR ACTIVATING AND RELEASING ACTIVE INGREDIENTS IN BLOOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241219B">B01L3/14</main-classification>
        <further-classification edition="200601120241219B">A61B5/15</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞恩生醫股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AEON BIOTHERAPEUTICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李岱蓁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DAI-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳世偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種血液分離管以及活化釋放血液中活性成分的方法，活化釋放血液中活性成分的方法包括以下步驟。將血液樣本置於血液分離管中，使血液樣本與經表面處理以帶電荷的儲血管及含有帶電荷的含矽聚合物之分離膠接觸。進行離心，以將血液樣本分成位於分離膠下方的紅血球層及位於分離膠上方的活化血清層，以活化釋放血液中的活性成分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a blood separation tube and a method for activating and releasing active components in blood, and the method includes the following steps. A blood sample is placed in the blood separation tube, and the blood sample is brought into contact with a surface-treated charged storage vessel and a separation gel containing a charged silicon-containing polymer. Centrifugation is performed to separate the blood sample into a red blood cell layer located below the separation gel and an activated serum layer located above the separation gel, so as to activate and release the active components in the blood.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:血液分離管</p>
        <p type="p">12:儲血管</p>
        <p type="p">12A:封閉端</p>
        <p type="p">12B:開口端</p>
        <p type="p">12C:儲血空間</p>
        <p type="p">14:分離膠</p>
        <p type="p">16:蓋體</p>
        <p type="p">20:紅血球層</p>
        <p type="p">22:活化血清層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="314" publication-number="202625403">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625403</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147500</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>時間同步系統及時間同步方法</chinese-title>
        <english-title>TIME SYNCHRONIZATION SYSYEM AND TIME SYNCHRONIZATION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">H04L7/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>駱昱銓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, YU-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡晉誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, CHIN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡秀芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, HSIU-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊博凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, PO-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種時間同步系統及時間同步方法，時間同步系統包括主時鐘電路以及從屬時鐘子系統。從屬時鐘子系統通過第一光路徑與第二光路徑與主時鐘電路連接。從屬時鐘子系統分別對第一光路徑與第二光路徑發送第一光脈衝訊號與第二光脈衝訊號，並檢測第一光脈衝訊號的第一光訊號與第二光脈衝訊號的第二光訊號。從屬時鐘子系統基於第一光訊號與第二光訊號判斷是否需要執行補償操作。若是，則從屬時鐘子系統對第一光路徑及/或第二光路徑執行補償操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A time synchronization system and a time synchronization method are provided. The time synchronization system includes a master clock circuit and a slave clock subsystem. The slave clock subsystem connects to the master clock circuit through a first optical path and a second optical path. The slave clock subsystem transmits a first optical pulse signal and a second optical pulse signal to the first optical path and the second optical path respectively and detects a first optical signal of the first optical pulse signal and a second optical signal of the second optical pulse signal. The slave clock subsystem determines whether a compensation operation needs to be performed based on the first optical signal and the second optical signal. If so, the slave clock subsystem performs the compensation operation on the first optical path and/or the second optical path.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S501、S502、S503、S504、S505:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="315" publication-number="202623709">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623709</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147504</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>種蛋照蛋汰除裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">A01K43/00</main-classification>
        <further-classification edition="200601120250501B">G01N33/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>農業部畜產試驗所</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN LIVESTOCK RESEARCH INSTITUTE, MINISTRY OF AGRICULTURE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中興大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHUNG HSING UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JIUNN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張力天</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, LEE-TIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭智翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHIH-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種種蛋照蛋汰除裝置，包含蛋架、發光模組、影像辨識模組及控制模組。蛋架包括架體及透光孔的置蛋槽。發光模組的光線經透光孔照射置蛋槽上的蛋品。影像辨識模組包括蛋架上擷取蛋品照光的待分析影像的影像擷取單元、處理單元及辨識單元。處理單元將待分析影像轉換為多個對應蛋品的蛋影像資料。辨識單元比對蛋影像資料與比對資料產生辨識資料。控制模組控制發光模組對蛋品照光，及依辨識資料控制發光模組對數個蛋品照光。上述設計能直接分析具有照光蛋品之待分析影像，快速區隔出檢選蛋品為種蛋，人員不需檢查強光照射下的蛋品，避免傷眼。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:蛋架</p>
        <p type="p">11:架體</p>
        <p type="p">111:圍框</p>
        <p type="p">112:金屬桿</p>
        <p type="p">114:第一金屬桿</p>
        <p type="p">115:第二金屬桿</p>
        <p type="p">117:置蛋槽</p>
        <p type="p">118:透光孔</p>
        <p type="p">2:發光模組</p>
        <p type="p">21:底座</p>
        <p type="p">22:照蛋燈</p>
        <p type="p">3:影像辨識模組</p>
        <p type="p">31:影像擷取單元</p>
        <p type="p">4:控制模組</p>
        <p type="p">90:蛋品</p>
        <p type="p">X1:第一方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="316" publication-number="202624100">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624100</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147507</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電動吸盤</chinese-title>
        <english-title>ELECTRIC VACUUM SUCTION CUP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250214B">B65G47/91</main-classification>
        <further-classification edition="200601120250214B">F16B47/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立晏企業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIH YANN INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖伯霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, PO-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種電動吸盤，其包括：一吸盤本體，包括一吸附部、一握把部及一抽氣機構，該吸附部界定一腔室，該抽氣機構可對該腔室進行抽氣使該吸附部供吸附於一表面，該握把部設於該吸附部，該握把部包括一握部，該握部相對端分別設有一第一端部及一第二端部，該第一端部包括一第一殼部及一第二殼部；一背光模組，跨設該第一殼部及該第二殼部；及一面板，具有至少一顯示部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electric vacuum suction cup is provided, including: a suction cup body, a handle portion and an air extraction mechanism, the suction portion defined a chamber, the air extraction mechanism extracted air from the chamber to allow the suction portion to adhere to a surface, the handle portion disposed on the suction portion, the handle portion including a gripping portion, two opposite sides of the gripping portion having a first end portion and a second end portion, the first end portion including a first shell portion and a second shell portion; a backlight module, disposed across the first shell portion and the second shell portion; and a panel, having at least one display portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電動吸盤</p>
        <p type="p">10:吸盤本體</p>
        <p type="p">11:吸附部</p>
        <p type="p">12:握把部</p>
        <p type="p">15:握部</p>
        <p type="p">16:第一端部</p>
        <p type="p">161:第一殼部</p>
        <p type="p">162:第二殼部</p>
        <p type="p">17:第二端部</p>
        <p type="p">171:第三殼部</p>
        <p type="p">172:第四殼部</p>
        <p type="p">30:面板</p>
        <p type="p">31:顯示部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="317" publication-number="202623710">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623710</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147510</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>蜂蟹蟎抑制同步系統</chinese-title>
        <english-title>VARROA MITE INHIBITION SYNCHRONIZATION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">A01K47/06</main-classification>
        <further-classification edition="200601120250203B">A01K29/00</further-classification>
        <further-classification edition="202401120250203B">G06Q50/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英田科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEANG TENG TECHNOLOGY CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳千皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳佩妤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PEI YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余奕賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種蜂蟹蟎抑制同步系統，將防治實驗室的實驗蜂箱用於模擬實驗抑制蜂蟹蟎族群數的養蜂條件，且透過溫度調控裝置、濕度調控裝置、微波裝置和一聲波裝置調控該實驗蜂箱內抑制蜂蟹蟎的防治環境條件；防治實驗室的監控伺服器根據該養蜂場環境數據，及每個養蜂箱回傳其抑制裝置的狀態，將實驗成功抑制蜂蟹蟎的防治環境條件的實驗數據傳至蜂場監控裝置；藉此，蜂場監控裝置根據不同的養蜂箱當時各自的抑制裝置狀態，調控每個養蜂箱箱內抑制蜂蟹蟎的防治環境條件，藉此該些養蜂箱與該實驗蜂箱實驗結果同步抑制蜂蟹蟎的防治條件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A varroa mite inhibitory synchronization system. The experimental beehives in the control laboratory were used to simulate beekeeping conditions for experimentally suppressing the population of varroa mites. The temperature control device, humidity control device, microwave device and sound wave device are used to control the environmental conditions for the prevention and control of wasp and varroa mites in the experimental beehive. Based on the environmental data of the apiary and the status of each beehive's suppression device, the monitoring server of the prevention and control laboratory transmits the experimental data on the environmental conditions of the prevention and control of varroa mites successfully suppressed to the apiary monitoring device. In this way, the apiary monitoring device regulates the prevention and control environmental conditions of each beehive to suppress wasp varroa mites according to the status of the respective inhibitory devices of different beehives at that time. In this way, the experimental results of these beehives and the experimental beehives can simultaneously suppress the prevention and control conditions of varroa mites.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:防治實驗室</p>
        <p type="p">110:實驗蜂箱</p>
        <p type="p">120:監控伺服器</p>
        <p type="p">200:養蜂場</p>
        <p type="p">210:養蜂箱</p>
        <p type="p">220:環境感測裝置</p>
        <p type="p">230:蜂場監控裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="318" publication-number="202625040">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625040</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147513</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>儲蓄行事曆系統</chinese-title>
        <english-title>SAVINGS CALENDAR SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250320B">G06Q10/109</main-classification>
        <further-classification edition="202301120250320B">G06Q40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>兆豐國際商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEGA INTERNATIONAL COMMERCIAL BANK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳燿光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YAO GUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡菀晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, WAN CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供一種儲蓄行事曆系統，其包括使用者裝置和耦接至使用者裝置的伺服器。伺服器包括行動銀行應用程式、帳務管理模組、行事曆應用程式以及比對模組。行動銀行應用程式用以提供複數個金融服務。帳務管理模組耦接行動銀行應用程式。行事曆應用程式耦接帳務管理模組，並用以顯示日期、時間和日程安排的資訊。比對模組耦接帳務管理模組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a savings calendar system, which includes a user device and a server coupled to the user device. The server includes a mobile banking application, an accounting management module, a calendar application, and a comparison module. The mobile banking application is used to provide a plurality of financial services. The accounting management module is coupled to the mobile banking application. The calendar application is coupled to the accounting management module and used to show date, time, and schedule informations. The comparison module is coupled to the accounting management module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:儲蓄行事曆系統</p>
        <p type="p">100:伺服器</p>
        <p type="p">110:行動銀行應用程式</p>
        <p type="p">120:帳務管理模組</p>
        <p type="p">122:記帳裝置</p>
        <p type="p">124:記帳資料庫</p>
        <p type="p">130:行事曆應用程式</p>
        <p type="p">140:比對模組</p>
        <p type="p">200:使用者裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="319" publication-number="202623948">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623948</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147514</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>提高探針研磨效率的控制方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">B24B19/16</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉而特科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳炯男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張沛華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇先琦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種提高探針研磨效率的控制方法，由一處理單元執行，該方法包含接收一原始數據、擷取該原始數據中各研磨數據區段的一初始數值、一區段極大值及一結束數值、計算各該研磨數據區段的一數值增進量、一數值衰減量及一變化量比值，以及根據該數值增進量、該數值衰減量及該變化量比值判斷一探針卡的一研磨狀態是否符合一進給條件或一停止條件；本發明可使該處理單元判斷該探針研磨裝置的研磨效率，執行對應提高研磨效率的控制流程(控制一研磨座進給一研磨單位或控制該研磨座停止研磨)，進而提升探針研磨的效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="320" publication-number="202623988">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623988</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147515</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>封裝薄膜及其製造方法</chinese-title>
        <english-title>PACKAGING FILM AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260316B">B29C48/395</main-classification>
        <further-classification edition="201901120260316B">B29C48/08</further-classification>
        <further-classification edition="202601120260316B">H10W74/01</further-classification>
        <further-classification edition="200601120260316B">C08G77/08</further-classification>
        <further-classification edition="202601120260316B">H10W74/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許滄益</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, TSANG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許滄益</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, TSANG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林坤成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種封裝薄膜的製造方法，其包含下列步驟：將聚烯烴彈性體、架橋劑及矽烷偶合劑進行造粒，同時進行架橋及接支反應以產生多個材料顆粒，該些材料顆粒包括已完成架橋及接支反應的第一部分及未完成架橋及接支反應的第二部分；將第一部分及第二部分混合以產生混合材料；將混合材料置入押出機的入料口，並透過押出機的加熱器及螺桿對混合材料進行加熱及壓縮；透過押出機的出料口將經過加熱及壓縮的混合材料輸送至衣架型膜頭；經由衣架型膜頭將混合材料擠出形成封裝薄膜；以及透過整平機對封裝薄膜進行整平。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for manufacturing a packaging film, which includes the following steps: granulating polyolefin elastomer, bridging agent and silane coupling agent, and simultaneously performing bridging and grafting reactions to produce multiple material particles, wherein the material particles include the first part in which the bridging and grafting reactions have been completed, and the second part in which the bridging and grafting reactions are unfinished; mixing the first part and the second part to produce a mixed material; putting the mixed material into the inlet of the extruder, and heating and compressing the mixed material through the heater and the screw of the extruder; transporting mixed material, which has been heated and compressed, to the hanger-type membrane head through the discharge port of the extruder; forming a packaging film by extruding the mixed material through the hanger-type membrane head; and leveling the packaging film through a leveling machine.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:封裝組件</p>
        <p type="p">10:玻璃基板</p>
        <p type="p">11:封裝薄膜</p>
        <p type="p">12:封裝元件</p>
        <p type="p">13:背板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="321" publication-number="202625426">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625426</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147521</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>掃描裝置及應用於掃描裝置的歸位方法</chinese-title>
        <english-title>SCANNING DEVICE AND HOMING METHOD OF SCANNING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">H04N1/047</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金寶電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINPO ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊博智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, BOR CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭永森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, YUNG SEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種掃描裝置包括掃描模組及定位圖形。定位圖形是在掃描視窗的外側且沿著掃移循環方向設置。定位圖形的第一區塊關聯於定位位置且第二區塊關聯於起掃位置。在掃描模組往定位位置的方向移動第一步進距離後，檢測當下位置的擷取特徵，並在當下位置的擷取特徵與第二區塊的圖樣特徵相同時，掃描模組切換為往定位位置的方向移動第二步進距離。接著，當掃描模組判斷當下位置的擷取特徵與第一區塊的圖樣特徵相同時，掃描模組判斷完成歸位。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A scanning device includes a scanning module and a positioning pattern. The positioning pattern is disposed on outside of a scanning window along a moving-scan cycle direction. A first block of the positioning pattern is associated with a positioning location, and a second block is associated with a starting-scan location. After moving a first stepping distance toward the positioning location, the scanning module detects an acquired feature of a current position; when the acquired feature of the current position matches a pattern feature of the second block, the scanning module switches to moving a second stepping distance toward the positioning location. When the scanning module determines that the acquired feature of the current position matches the pattern feature of the first block, the scanning module completes the homing process.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:掃描裝置</p>
        <p type="p">210:掃描模組</p>
        <p type="p">216:掃描段</p>
        <p type="p">218:冗餘段</p>
        <p type="p">222:起掃位置</p>
        <p type="p">224:定位位置</p>
        <p type="p">226:掃描終點位置</p>
        <p type="p">250:掃描視窗</p>
        <p type="p">290:掃移循環方向</p>
        <p type="p">300:定位圖形</p>
        <p type="p">310:第一區塊</p>
        <p type="p">320:第二區塊</p>
        <p type="p">330:第三區塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="322" publication-number="202625727">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625727</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147524</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>封裝設備及封裝方法</chinese-title>
        <english-title>PACKAGING EQUIPMENT AND PACKAGING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/00</main-classification>
        <further-classification edition="202601120260302B">H10W74/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矽品精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICONWARE PRECISION INDUSTRIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉峻昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, CHUN SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種封裝設備及封裝方法，主要將電子模組置於模壓裝置中進行模壓作業，以於該電子模組上形成封裝層，接著利用加濕裝置對該封裝層進行加濕作業，之後利用乾燥裝置進行乾燥作業，以去除該封裝層內之水分，同時可對該電子模組進行塑形。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A packaging equipment and packaging method, which mainly places an electronic module in a molding device to perform molding process to form a molding layer on the electronic module, and uses a humidifying device to humidify the molding layer, and then uses a drying device to perform drying process to remove moisture in the molding layer and shape the electronic module at the same time.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:電子模組</p>
        <p type="p">22:封裝層</p>
        <p type="p">32:加濕裝置</p>
        <p type="p">320:腔室</p>
        <p type="p">321:架體</p>
        <p type="p">322:加濕液體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="323" publication-number="202625425">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625425</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147525</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電話隱碼服務之系統、方法及其電腦程式產品</chinese-title>
        <english-title>SYSTEM AND METHOD FOR NUMBER MASKING SERVICE AND COMPUTER PROGRAM PRODUCT THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">H04M3/42</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅兆良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, CHAO LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱志豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHIH HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林長榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案揭示一種電話隱碼服務之系統、方法及其電腦程式產品。該系統接收發話端以發話端門號撥打第一代表號的呼叫，再根據發話端所提供之訂單編號向企業用戶資訊系統查詢對應訂單編號的受話端門號，進而以一第二代表號撥打受話端門號呼叫受話端，使發話端與受話端進行雙方通話。該系統儲存訂單編號、對應訂單編號的受話端門號及發話端門號。又，該系統接收受話端以受話端門號撥打第二代表號的呼叫，再根據受話端門號查詢出訂單編號以及對應訂單編號的發話端門號，進而以第一代表號撥打發話端門號呼叫發話端，使受話端與發話端進行雙方通話。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and a method for number masking service and a computer program product thereof are provided. The system receives a call from a calling terminal that dials a first representative number with a calling telephone number. Then, based on an order number provided by the calling terminal, the system queries an enterprise user information system for a called telephone number corresponding to the order number. Thereafter, the system calls a called terminal by dialing the called telephone number with a second representative number, thereby enabling the calling terminal and the called terminal to establish a bilateral communication. The system stores the order number, the calling telephone number and the called telephone number corresponding to the order number. Further, the system receives a call from the called terminal that dials the second representative number with the called telephone number. Then, based on the called telephone number, the system queries the order number and the calling telephone number corresponding to the order number. Thereafter, the system calls the calling terminal by dialing the calling telephone number with the first representative number, thereby enabling the called terminal and the calling terminal to establish a bilateral communication.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:企業用戶資訊系統</p>
        <p type="p">20:發話端</p>
        <p type="p">30:電話隱碼服務系統</p>
        <p type="p">31:語音流程控制單元</p>
        <p type="p">32:介面代理單元</p>
        <p type="p">33:資料庫單元</p>
        <p type="p">40:受話端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="324" publication-number="202625213">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625213</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147526</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自動生成個人化衛教指引之系統、方法、及其電腦程式產品</chinese-title>
        <english-title>SYSTEM AND METHOD FOR AUTOMATICALLY GENERATING PERSONALIZED HEALTH EDUCATION AND COMPUTER PROGRAM PRODUCT THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250123B">G16H80/00</main-classification>
        <further-classification edition="202501120250123B">G06F16/33</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉應翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YING-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱陳彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JU, CHERN-BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林世明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIH-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊家毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHUANG, CHIA-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林長榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種自動生成個人化衛教指引之方法，包括：先處理自第一使用者所接收到之輸入病況以產生病況文字資料，進而利用大型語言模型處理以生成病況摘要，再處理自第二使用者所接收到之看診紀錄以產生診斷文字資料，進而利用大型語言模型處理以生成診斷摘要，接著根據病況摘要中之主訴和過往病史以及診斷摘要中之主訴和診斷，於衛教資料庫中檢索出對應的衛教內容，最後及利用大型語言模型處理病況摘要中之主訴和過往病史、診斷摘要中之主訴和診斷、及檢索出之對應的衛教內容，以生成個人化衛教指引。本發明更揭示一種自動生成個人化衛教指引之系統及其電腦程式產品。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for automatically generating a personalized medical counseling is provided. An input condition received from a first user is processed to generate a condition text, which is then processed by using a large language model to generate a condition summary. A diagnosis record received from a second user is processed to generate a diagnosis text, which is then processed by using a large language model to generate a diagnosis summary. Subsequently, based on a main complaint and a past medical history in the condition summary and a main complaint and a diagnosis in the diagnosis summary, a corresponding health education content is retrieved from a health education database. Finally, using a large language model, the main complaint and the past medical history in the condition summary, the chief complaint and the diagnoses in the diagnosis summary, and the retrieved corresponding health education content are processed to generate a personalized health education. A system for automatically generating personalized health education and a computer program product thereof are also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S11~S19:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="325" publication-number="202625428">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625428</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147528</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>動態切換混音終端之系統、方法及其電腦程式產品</chinese-title>
        <english-title>SYSTEM AND METHOD FOR DYNAMICALLY SWITCHING MIXING TERMINAL AND COMPUTER PROGRAM PRODUCT THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">H04N7/15</main-classification>
        <further-classification edition="201101120250303B">H04N7/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佳育</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHIA-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李俊儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JIUN-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, PE-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖勝廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, SHENG-LIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張景雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHING-HSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林長榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種動態切換混音終端之系統、方法及其電腦程式產品。首先，發起加密會議的用戶終端為混音終端。其次，加入會議的用戶終端回報各自的網路與設備資訊以供伺服終端據此選出備援終端，加入會議的用戶終端發送各自的加密語音以由伺服終端轉送至混音終端及備援終端。再者，混音終端將所接收之加入會議的用戶終端的加密語音依序進行解密、混音、加密而產出混音加密語音，以由伺服終端轉送至加入會議的用戶終端，其中，當原混音終端離開會議或混音效果不佳時，伺服終端通知加入會議的用戶終端指示原備援終端需切換為新混音終端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and a method for dynamically switching mixing terminal and a computer program product thereof are provided. First, a user terminal that initiates an encryption meeting is a mixing terminal. Then, a plurality of user terminals join the encryption meeting and report their network and device information. A server terminal selects a backup terminal from among the user terminals joining the encryption meeting based on the network and device information. The server terminal forwards encrypted voice sent from the user terminals joining the encryption meeting to the mixing terminal and the backup terminal. Further, the mixing terminal decrypts, mixes and encrypts the received encrypted voice received to produce a mixed encrypted voice, for being forwarded by the server terminal to the user terminals joining the encryption meeting, wherein, if the mixing terminal leaves the encryption meeting or its mixing effect is not good, the server terminal notifies the user terminals joining the encryption meeting that the original backup terminal is switched to a new mixing terminal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S11:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="326" publication-number="202624783">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624783</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147532</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>USB-C型的測試設備、系統與方法</chinese-title>
        <english-title>USB-C TYPE TESTING DEVICE, SYSTEM, AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250425B">G01R31/44</main-classification>
        <further-classification edition="200601120250425B">G06F13/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>技嘉科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIGA-BYTE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐理芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, LI-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孟憲明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENG, HSIEN-MI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, WU-HSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖祝湘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHU-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張基霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖偉然</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, WEI-RAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭登福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, TENG-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝泳龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, YUNG-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃政誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種USB-C型的測試設備、系統與方法，提供免實體插拔的正反向插接測試。USB-C型的測試設備包括第一連接埠、訊號輸入端與處理單元。第一連接埠通過第一電纜連接於下行設備；訊號輸入端接收選擇訊號；處理單元具有第一正向通道模式與第一反向通道模式，處理單元根據第一電纜的設定通道腳位判斷連接於第一正向腳位組或第一反向腳位組，並將所連接的腳位組視為第一物理通道，處理單元根據選擇訊號選擇第一正向通道模式或第一反向通道模式之任一，處理單元將受選的通道模式匹配於第一物理通道並形成第一模擬通道。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A USB-C type testing device, system, and method, providing forward and reverse connection testing without physical plugging and unplugging. The USB-C type testing device comprises a first port, a signal input terminal, and a processing unit. The first port is connected to a end device via a first cable; the signal input terminal receives a selection signal; the processing unit has a first downstream channel mode and a first reverse channel mode. The processing unit determines if it's connected to the first forward pin group or the first reverse pin group based on the designated channel pins of the first cable, and designates the connected pin group as a first physical channel. Based on the selection signal, the processing unit chooses either the first forward or first reverse channel mode. The processing unit then aligns the chosen channel mode with the first physical channel, thereby forming a first simulated channel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:測試系統</p>
        <p type="p">100:測試設備</p>
        <p type="p">110:第一連接埠</p>
        <p type="p">120:第二連接埠</p>
        <p type="p">130:訊號輸入端</p>
        <p type="p">140:電力埠</p>
        <p type="p">150:處理單元</p>
        <p type="p">200:下行設備</p>
        <p type="p">210:第一電纜</p>
        <p type="p">300:上行設備</p>
        <p type="p">310:第二電纜</p>
        <p type="p">410:選擇訊號</p>
        <p type="p">420:測試要求</p>
        <p type="p">430:測試結果</p>
        <p type="p">441:第一物理通道</p>
        <p type="p">451:第二物理通道</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="327" publication-number="202624751">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624751</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147533</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>分層溫控之預燒設備</chinese-title>
        <english-title>BURN-IN DEVICE FOR LAYERED TEMPERATURE CONTROL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">G01R1/02</main-classification>
        <further-classification edition="200601120241231B">G01R31/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>京元電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KING YUAN ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉大綱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, TA-KANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李明憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MING-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TSUNG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種分層溫控之預燒設備。分層溫控之預燒設備包含固定架、中空層板及流體供應裝置。中空層板配置於固定架且具有第一流體腔室。中空層板適於承載預燒板。流體供應裝置適於供給溫控流體至中空層板之第一流體腔室。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A burn-in device for layered temperature control is provided. The burn-in device includes a fastening bracket, a hollow plate and a fluid supply device. The hollow plate is at the fastening bracket and has a first fluid chamber. The hollow plate is adapted to carry a burn-in board. The fluid supply device is adapted to provide a temperature controlled fluid to the first fluid chamber of the hollow plate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:分層溫控之預燒設備</p>
        <p type="p">20:固定架</p>
        <p type="p">30:中空層板</p>
        <p type="p">31:第一流體腔室</p>
        <p type="p">50:預燒板</p>
        <p type="p">51A:第一預燒座</p>
        <p type="p">51B:第二預燒座</p>
        <p type="p">52:預燒元件</p>
        <p type="p">53:測試電路</p>
        <p type="p">54:立架</p>
        <p type="p">400:預燒爐體</p>
        <p type="p">TF1:第一頂面</p>
        <p type="p">BF1:第一底面</p>
        <p type="p">GP:間距</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="328" publication-number="202625165">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625165</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147536</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>語音活動檢測的計算機實施方法、系統與電腦程式產品</chinese-title>
        <english-title>COMPUTER-IMPLEMENTED METHOD, SYSTEM AND COMPUTER PROGRAM PRODUCT FOR VOICE ACTIVITY DETECTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120250303B">G10L25/00</main-classification>
        <further-classification edition="201301120250303B">G10L17/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立清華大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李祈均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHI-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳柏澄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, BO-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佑俞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種語音活動檢測的計算機實施方法。所述計算機實施方法基於多個特徵提取器分別提取輸入話語的多個第一特徵，並且基於這些第一特徵，通過預訓練分類器判斷輸入話語是否對應於目標對象。所述多個特徵提取器是分別由對應不同的多個情境的多個訓練集來訓練。此外，使用此方法的系統和電腦程式產品亦被提出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A computer-implemented method for voice activity detection (VAD) is provided. According to this computer-implemented method, multiple first features of an input utterance are extracted based on multiple feature extractors respectively, and whether the input utterance corresponds to a target object is determined through a pre-trained classifier based on the multiple first features. The multiple feature extractors are respectively trained by multiple training sets corresponding to multiple different scenarios. In addition, a system and a computer program product using this method are also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:輸入話語</p>
        <p type="p">11:第一特徵</p>
        <p type="p">12:第二特徵</p>
        <p type="p">13:相似度特徵</p>
        <p type="p">14:分類器</p>
        <p type="p">15:預測結果</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="329" publication-number="202625420">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625420</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147538</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>監測網路輿情的系統與方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR MONITORING ONLINE PUBLIC OPINION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250303B">H04L51/52</main-classification>
        <further-classification edition="202401120250303B">G06Q50/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣大哥大股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN MOBILE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡育興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YU HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張崇文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHUNG-UEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翟浩宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAI, HAO YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種監測網路輿情的方法，包括：透過電子裝置的使用者介面，顯示關鍵字設定區的複數個關鍵字、角色設定區、以及第一致動按鈕；響應於第一致動按鈕被致動，透過包括於伺服器的處理器分析包括關鍵字中之至少一者的複數個網站資料以產生對應的複數個風向值；以及當處理器偵測到風向值大於風向閾值時，透過伺服器根據對應角色設定區的複數個角色資料傳送對應的複數個回覆資料至對應網站資料的複數個留言區。網站資料以及角色資料儲存於包括於伺服器的資料庫。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for monitoring online public opinion includes: displaying, by a user interface of a digital device, a plurality of keywords in a keyword setup area, a role setup area, and a first-action button; analyzing, by a processor in a server, in response to activation of the first action button, a plurality of website data including at least one of the keywords to generate the corresponding a plurality of opinion trend values; sending, by the server, based on a plurality of role data of the corresponding role setting area, the corresponding a plurality of reply data to a plurality of message areas of the corresponding website data when the processor detects that the opinion trend value is greater than an opinion trend threshold. The website data and the role data are stored in a database that is included in the server.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:監測網路輿情的系統</p>
        <p type="p">110:電子裝置</p>
        <p type="p">111:使用者介面</p>
        <p type="p">120:伺服器</p>
        <p type="p">121:處理器</p>
        <p type="p">122:資料庫</p>
        <p type="p">1311:網站資料</p>
        <p type="p">1312:網站資料</p>
        <p type="p">131N:網站資料</p>
        <p type="p">140:網路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="330" publication-number="202625056">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625056</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147540</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>超級個人化服務系統</chinese-title>
        <english-title>HYPER-PERSONALIZATION SERVICE SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120241231B">G06Q30/0251</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富邦綜合證券股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUBON SECURITIES CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周士偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, SHIH WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦偉翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIN, WEI SHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃于庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YU TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種超級個人化服務系統，用以針對一商品找到合適的複數個目標客戶，並對應每一目標客戶分別提供一個人化訊息，該超級個人化服務系統包含一資料庫、一事件定義模組、一名單產生模組、一個人化文案內容生成模組、一訊息推播及監測模組以及一自動化迭代模組。本發明之超級個人化服務系統可以透過內建的多個AI機器學習模型實現數據驅動的自動化溝通，透過即時監測客戶行為變化，並在符合特定事件規則時，自動發送個人化行銷訊息，以提升訊息傳遞的精準度與互動效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A hyper-personalization service system for identifying multiple suitable target customers for a product and delivering a personalized message to each target customer. The hyper-personalization service system comprises a database, an event definition module, a list generation module, a personalized content generation module, a message push and monitoring module, and an automated iteration module. The hyper-personalization service system of the present invention achieves data-driven automated communication through multiple built-in AI machine learning models, enabling real-time monitoring of customer behavior changes and automatically sending personalized marketing messages when specific event rules are met, thereby enhancing the accuracy and interaction effectiveness of message delivery.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:超級個人化服務系統</p>
        <p type="p">10:資料庫</p>
        <p type="p">11:事件定義模組</p>
        <p type="p">12:名單產生模組</p>
        <p type="p">13:個人化文案內容生成模組</p>
        <p type="p">14:訊息推播及監測模組</p>
        <p type="p">15:自動化迭代模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="331" publication-number="202625527">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625527</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147545</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抵頂結構及其抵頂方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250217B">H05K5/02</main-classification>
        <further-classification edition="200601120250217B">H05K7/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達霆精密工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DTECH PRECISION INDUSTRIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王鼎瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TING-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種抵頂結構及其抵頂方法，其包含身部、抵頂部及扣部。抵頂部活動設於身部；抵頂部抵頂扣部。以藉由抵頂部帶動扣部，而達到抵頂限位之功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:抵頂結構</p>
        <p type="p">11:身部</p>
        <p type="p">111:組接部</p>
        <p type="p">113:組合部</p>
        <p type="p">110:設置部</p>
        <p type="p">1101:設置位置</p>
        <p type="p">12:抵頂部</p>
        <p type="p">122:另一扣部</p>
        <p type="p">127:另一組合部</p>
        <p type="p">128:扣部</p>
        <p type="p">13:彈性元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="332" publication-number="202625033">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625033</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147546</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>產業網絡分析方法及系統</chinese-title>
        <english-title>INDUSTRIAL NETWORK ANALYSIS METHOD AND SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250303B">G06Q10/067</main-classification>
        <further-classification edition="202301120250303B">G06Q10/06</further-classification>
        <further-classification edition="202301120250303B">G06Q10/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中興工程顧問股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINOTECH ENGINEERING CONSULTANTS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳逸歆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱琦文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王珮琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳郁倩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種產業網絡分析方法及系統。該方法包括一資料取得步驟：取得一產業分析報告；一資料處理步驟：針對該產業分析報告中的不同工廠進行地址定位而分別產生一工廠點位並進行一預定等時圈的一等時圈分析；一資料串接步驟：將不同工廠的一工廠點位、該預定等時圈以及一產業鏈階層進行串接；一空間處理步驟：根據該產業鏈階層的上游廠商與下游廠商，協同各工廠的對應各該工廠點位與對應的行政區分布進行配置以產生一配置結果；以及一資料庫建置步驟：創建一資料庫並將該配置結果儲存在該資料庫中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to an industrial network analysis method and system. The method involves a data obtaining step: obtaining an industry analysis report; a data processing step: performing address positioning for different factories in the industry analysis report to generate a factory location point respectively and conduct a predetermined isochrone analysis with a predetermined isochrone; a data concatenation step: concatenating the factory location point of different factories, the predetermined isochrone and an industrial chain level; a spatial processing step: producing an arrangement result by cooperating the corresponding factory location point and the corresponding administrative district distribution of each factory according to the upstream manufacturers and downstream manufacturers of the industrial chain level; and a database creation step: creating a database and store the arrangement result in the database.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100:產業網絡分析方法</p>
        <p type="p">S110~S170:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="333" publication-number="202624948">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624948</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147552</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智慧處理器與其資料擴維方法</chinese-title>
        <english-title>INTELLIGENCE PROCESSING UNIT AND DATA DIMENSION EXPANDING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">G06F3/06</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商星宸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIGMASTAR TECHNOLOGY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REN, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">資料擴維方法包含下列操作：自一記憶體讀取一輸入張量資料的一輸入分塊資料，並儲存該輸入分塊資料至一智慧處理器中的一暫存器；以及根據一輸出張量資料的一輸出分塊資料的大小在該暫存器內沿著該輸入分塊資料的一第一維度複製該輸入分塊資料，以產生一第一分塊資料，其中該第一分塊資料和該輸出分塊資料的大小相同，且該複數個第一分塊資料用來執行一逐元素運算，以產生該輸出分塊資料</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A data dimension expanding method includes the following operations: reading an input tile data of input tensor data from a memory and storing the input tile data into a register of an intelligence processing unit; and copying the input tile data along a first dimension of the input tile data within the register according to a size of an output tile data of output tensor data, in order to generate first tile data, in which a size of the first tile data is the same as the size of the output tile data, and the first tile data is utilized to perform an elementwise operation to generate the output tile data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:資料擴維方法</p>
        <p type="p">S510,S520:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="334" publication-number="202624506">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624506</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147556</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>表面合金化製備抗菌含銀不銹鋼之方法</chinese-title>
        <english-title>METHOD FOR PREPARING ANTIBACTERIAL SILVER-CONTAINING STAINLESS STEEL BY SURFACE ALLOYING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241220B">C23C14/02</main-classification>
        <further-classification edition="200601120241220B">C23C14/16</further-classification>
        <further-classification edition="200601120241220B">C23C14/34</further-classification>
        <further-classification edition="200601120241220B">C23C14/58</further-classification>
        <further-classification edition="200601120241220B">C22C38/22</further-classification>
        <further-classification edition="200601120241220B">C22C38/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東盟開發實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUNG MUNG DEVELOPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉浩志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, BERNARD HAOCHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡文達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, WEN-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧彥傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YEN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊喬棻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIAO-FEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳治諺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ZHI-YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃忠誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHONG-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>時渝恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種表面合金化製備抗菌含銀不銹鋼之方法，其包含：於一不銹鋼表面披覆至少一擴散輔助介質層；於所述擴散輔助介質層披覆至少一含銀之銀抗菌金屬層，且所述銀抗菌金屬層中，銀之濃度係至少0.2 wt.% 以上；將該不銹鋼進行熱處理，使銀抗菌金屬擴散至該不銹鋼內；藉此，本發明係可最終於不銹鋼表面形成銀抗菌合金層，使賦予不銹鋼抗菌性能，更有效提升不銹鋼之耐蝕性能；此外，本發明不僅能通用於各式不銹鋼種，且能通過製程參數調整抗菌合金元素的濃度以及合金層的厚度，因應不同使用場合，使具有廣泛之適用性者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a method for preparing antibacterial silver-containing stainless steel by surface alloying, which includes: coating at least one diffusion-assisted medium layer on the surface of a stainless steel; coating at least one silver-containing antibacterial metal layer on the diffusion-assisted medium layer, wherein the silver concentration in the antibacterial metal layer is at least 0.2 wt.% or higher; performing heat treatment on the stainless steel to allow the silver antibacterial metal to diffuse into the stainless steel; thus, the invention enables the formation of a silver antibacterial alloy layer on the surface of the stainless steel, imparting antibacterial properties and significantly improving the corrosion resistance of the stainless steel. Moreover, this method is universally applicable to various types of stainless steel and can adjust the concentration of antibacterial alloy elements and the thickness of the alloy layer through process parameter adjustments to suit different applications, providing wide applicability.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S001~S003:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="335" publication-number="202624583">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624583</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147558</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>紗線加工加熱裝置</chinese-title>
        <english-title>YARN PROCESSING HEATING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">D01H13/28</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人紡織產業綜合研究所</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN TEXTILE RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪瑞達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, JUI-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃慶堂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHING-TANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂慶祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHING-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種紗線加工加熱裝置包括殼體、電熱棒、外蓋與紅外線加熱裝置。殼體的頂面具有凹槽，凹槽配置以供紗線通過。電熱棒位於殼體中，且位於凹槽下方。外蓋樞接於殼體的一側，且配置以覆蓋殼體。紅外線加熱裝置位於外蓋中，且位於凹槽上方，配置以對紗線發出紅外線而使紗線經熱輻射加熱。紅外線加熱裝置的啟動期間是在電熱棒的兩相鄰輸出峰值對應的兩時間點之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A yarn processing heating device includes a casing, an electric heating rod, a cover, and an infrared heating device. The top surface of the casing has a groove configured to allow a yarn to pass through. The electric heating rod is located in the casing, and is located bellow the groove. The cover is pivotally connected to one side of the casing and covers the casing. The infrared heating device is located in the cover and above the groove, and is configured to emit infrared rays to the yarn and causes the yarn to be heated by thermal radiation. The startup period of the infrared heating device is between two time points corresponding to two adjacent output peaks of the electric heating rod.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:紗線加工加熱裝置</p>
        <p type="p">110:殼體</p>
        <p type="p">112:凹槽</p>
        <p type="p">120:電熱棒</p>
        <p type="p">130:外蓋</p>
        <p type="p">140:紅外線加熱裝置</p>
        <p type="p">150:導熱塊體</p>
        <p type="p">160:反射罩</p>
        <p type="p">170:保溫棉</p>
        <p type="p">L:紅外線</p>
        <p type="p">x,y,z:方向</p>
        <p type="p">Y:紗線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="336" publication-number="202624855">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624855</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147559</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>背板及顯示裝置</chinese-title>
        <english-title>BACKSHEET AND DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241223B">G02F1/1333</main-classification>
        <further-classification edition="200601120241223B">F21V15/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳慧娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUI-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何俊樟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, JYUN-JANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳家豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIA-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種背板，背板應用於一背光模組。背板包含一背板本體以及二孔洞。二孔洞開設於背板本體且以一長邊中心線為軸對稱，各孔洞包含相互連接的一直邊及一弧邊，各弧邊較各直邊接近長邊中心線。藉此，可減輕背板重量，並解決背板因強度不足而過度彎曲的問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a backsheet. The backsheet is applied in a backlight module. The backsheet includes a backsheet body and two holes. The two holes are disposed at the backsheet body and are symmetrical with a center line of a long side. Each of the holes includes a straight edge and an arc edge that are connected to each other. Each of the arc edges is closer to the center line of the long side than each of the straight edges. Therefore, a weight of the backsheet can be decreased, and a problem of excessive bending of the backsheet due to insufficient strength can be solved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:背板</p>
        <p type="p">111,112:長邊</p>
        <p type="p">113,114:短邊</p>
        <p type="p">120,130:孔洞</p>
        <p type="p">121,131:直邊</p>
        <p type="p">122,132:弧邊</p>
        <p type="p">1221,1321:弧邊中點</p>
        <p type="p">123,133:圓角</p>
        <p type="p">140:定位孔</p>
        <p type="p">C1:長邊中心線</p>
        <p type="p">L:背板長度</p>
        <p type="p">L1:短邊鄰近距離</p>
        <p type="p">L2:弧邊距離</p>
        <p type="p">W:背板寬度</p>
        <p type="p">W1:第一長邊鄰近距離</p>
        <p type="p">W2:第二長邊鄰近距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="337" publication-number="202624084">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624084</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147565</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無人機及其操作方法</chinese-title>
        <english-title>DRONE AND OPERATING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120241230B">B64U20/00</main-classification>
        <further-classification edition="202301120241230B">B64C39/02</further-classification>
        <further-classification edition="202301320241230B">B64U101/15</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緯創資通股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁東昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TING, TUNG SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種無人機及操作無人機的方法。方法包含：接收控制訊號以及定位訊號；在無人機移動時記錄無人機的第一姿態於無人機的儲存媒體中；判斷是否失去控制訊號或定位訊號；響應於失去控制訊號以及定位訊號，從儲存媒體讀取第一姿態，並取得與第一姿態相反的第二姿態；以及操作無人機以第二姿態移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A done and a method of operating a drone are provided. The method includes: receiving control signal and positioning signal; recording a first attitude of the drone in a storage medium when the drone is moving; determining whether the control signal or the positioning signal is lost; in response to losing the control signal and the positioning signal, reading the first attitude from the storage medium and obtaining a second attitude opposite to the first attitude; and operating the drone to move in the second attitude.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S601,S602,S603,S604,S605:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="338" publication-number="202624046">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624046</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147566</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>控燈方法及裝置</chinese-title>
        <english-title>LIGHT CONTROL METHOD AND APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">B60Q1/08</main-classification>
        <further-classification edition="200601120241231B">B60Q1/076</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緯創資通股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳力維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LI WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林秀美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIU MEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許晉豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIN HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林慧珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HUI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井民全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JING, MING CHIUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">控燈方法及裝置。所述控燈方法包括：在第一車輛開啟照明光源的情況下，響應於偵測到行駛在第一車輛的前方的第二車輛進入照明光源對應的控燈範圍，調降照明光源的光源亮度；在偵測到第二車輛進入照明光源對應的控燈範圍之後，響應於偵測到第二車輛完全離開控燈範圍，基於第一車輛與第二車輛之間的相對速度以及環境光亮度，獲得開燈延遲秒數；以及在經過開燈延遲秒數之後，調高照明光源的光源亮度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light control method and apparatus are provided. The light control method includes: when a first vehicle turns on a lighting source, in response to detecting that a second vehicle traveling in front of the first vehicle enters a lighting control range corresponding to the lighting source, reducing brightness of the lighting source; after detecting that the second vehicle enters the lighting control range corresponding to the lighting source, in response to detecting that the second vehicle completely leaves the lighting control range, obtaining a number of seconds for delaying light-on based on a relative speed between the first vehicle and the second vehicle and ambient light brightness; and after the number of seconds for delaying light-on have passed, increasing the brightness of the lighting source.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S305~S315:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="339" publication-number="202625359">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625359</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147570</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於堆高機的能量回收裝置以及能量回收方法</chinese-title>
        <english-title>ENERGY RECOVERY DEVICE AND ENERGY RECOVERY METHOD FOR FORKLIFT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">H02P3/18</main-classification>
        <further-classification edition="200601120241230B">B66F9/075</further-classification>
        <further-classification edition="200601120241230B">B66F9/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞福儲能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APH EPOWER CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑄易</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SYUAN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉正堂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, CHENG-TANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒侑澄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSOU, YU-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇修賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, HSIU-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃上正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHANG-ZENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於堆高機的能量回收裝置以及能量回收方法。堆高機包括貨叉。能量回收裝置包括發電機、動能運算電路、轉換模組、控制電路、調速模組以及儲能模組。動能運算電路計算貨叉在下降時的動能。轉換模組依據動能來獲得轉速以及轉矩。控制電路獲得發電機對應於轉矩以及發電機的最高效率的最佳轉速，並依據發電機的當前轉速與最佳轉速之間的誤差來提供調速命令。調速模組依據調速命令將當前轉速調整為最佳轉速，使發電機產生發電機電能至儲能模組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An energy recovery device and an energy recovery method for a forklift are provided. The forklift includes a fork. The energy recovery device includes a dynamotor, a kinetic energy calculation circuit, a conversion module, a control circuit, a speed regulation module and energy storage module. The kinetic energy calculation circuit calculates a kinetic energy of the fork as it descends. The conversion module obtains rotational speed and torque according to the kinetic energy. The control circuit obtains an optimal rotational speed of the dynamotor corresponding to the torque and the highest efficiency of the dynamotor, and provides a speed regulation command according to an error between a current rotational speed and the optimal rotational speed of the dynamotor. The speed regulation module adjusts the current speed to the optimal speed according to the speed control command, so that the dynamotor provides a dynamotor power to the energy storage module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:能量回收裝置</p>
        <p type="p">110:動能運算電路</p>
        <p type="p">120:轉換模組</p>
        <p type="p">130:控制電路</p>
        <p type="p">140:調速模組</p>
        <p type="p">150:儲能模組</p>
        <p type="p">300:貨叉</p>
        <p type="p">CMD:調速命令</p>
        <p type="p">DN:發電機</p>
        <p type="p">ED:發電機電能</p>
        <p type="p">EM:動能</p>
        <p type="p">ERR:誤差</p>
        <p type="p">FL:堆高機</p>
        <p type="p">LT:查找表</p>
        <p type="p">TQ:轉矩</p>
        <p type="p">WD:當前轉速</p>
        <p type="p">WO:最佳轉速</p>
        <p type="p">WS:轉速</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="340" publication-number="202624799">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624799</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147573</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>導光板</chinese-title>
        <english-title>LIGHT GUIDE PLATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">G02B6/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀚宇彩晶股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANNSTAR DISPLAY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇振豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, CHEN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧嘉峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TENG, CHIA-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉金湧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIN-YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種導光板，包括主體部及入光結構。主體部具有相對之第一光學面及第二光學面。入光結構設置在主體部之入光側，其中主體部與入光結構為一體成形之整體結構。入光結構包含第一反射斜面、第二反射斜面及第一穿槽。第一反射斜面連接第一光學面。第二反射斜面連接第一反射斜面與第二光學面。第一穿槽鄰近第一反射斜面與第二反射斜面，並且沿著入光側之延伸方向延伸並且穿過主體部。第一穿槽之至少一開口配置以供至少一光源設置，且第一反射斜面與第二反射斜面配置以將至少一光源所發出之光線反射至主體部中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a light guide plate, which includes a body portion and a light incident structure. The body portion has a first optical surface and a second optical surface opposite to each other. The light incident structure is disposed on an light incident side of the body portion, in which the body portion and the light incident structure are integrally formed. The light incident structure includes a first reflecting inclined surface, a second reflecting inclined surface and a first through groove. The first reflecting inclined surface is connected to the first optical surface. The second reflecting inclined surface is connected to the first reflecting inclined surface and the second optical surface. The first through groove is adjacent to the first reflecting inclined surface and the second reflecting inclined surface, and extends along an extending direction of the light incident side and through the body portion. At least one opening of the first through groove is configured to accommodate at least one light source, and the first reflecting inclined surface and the second reflecting inclined surface are configured to reflect light emitted by the at least one light source into the body portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">A1:顯示裝置</p>
        <p type="p">1:導光板</p>
        <p type="p">11:主體部</p>
        <p type="p">111:第一光學面</p>
        <p type="p">112:第二光學面</p>
        <p type="p">12:入光結構</p>
        <p type="p">121:第一反射斜面</p>
        <p type="p">122:第二反射斜面</p>
        <p type="p">123:第一穿槽</p>
        <p type="p">123a:開口</p>
        <p type="p">124:第二穿槽</p>
        <p type="p">2:光源</p>
        <p type="p">3:顯示面板</p>
        <p type="p">4:反射片</p>
        <p type="p">L1:長度方向</p>
        <p type="p">T1:厚度方向</p>
        <p type="p">W1:寬度方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="341" publication-number="202624127">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624127</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147580</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>二氧化鈦摻雜金屬氧化物之表面層及其製造方法</chinese-title>
        <english-title>SURFACE LAYER OF TITANIUM DIOXIDE DOPED WITH METAL OXIDES AND ITS MANUFACTURING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">C01G23/047</main-classification>
        <further-classification edition="200601120250401B">C11D1/66</further-classification>
        <further-classification edition="200601120250401B">B01J21/06</further-classification>
        <further-classification edition="200601120250401B">B01J37/04</further-classification>
        <further-classification edition="202001120250401B">C01F17/235</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龍華科技大學 桃園市龜山區萬壽路一段300 號</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUNGHWA UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許春耀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHUN-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡哲齡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, ZHE-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇育生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, YU-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡奕暄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, I-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張振文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHEN-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>時渝恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種二氧化鈦摻雜金屬氧化物之表面層，金屬氧化物（CeO        &lt;sub&gt;2&lt;/sub&gt;）濃度分別為（0.01, 0.03, 0.05, 0.1, 0.3, 0.5 wt%） 摻雜二氧化鈦（TiO        &lt;sub&gt;2&lt;/sub&gt;），二氧化鈦具較佳之能隙也具有較強之氧化還原能力，化學穩定性高，微量wt%金屬氧化物摻雜二氧化鈦多孔表面層，提高能隙並且有效提升二氧化鈦光觸媒的效果，光觸媒技術能有效處理有毒性的有機物，將環境汙染物去除淨化。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a surface layer of titanium dioxide (TiO        &lt;sub&gt;2&lt;/sub&gt;) doped with metal oxides (CeO        &lt;sub&gt;2&lt;/sub&gt;) at concentrations of 0.01, 0.03, 0.05, 0.1, 0.3, and 0.5 wt%. The doped TiO        &lt;sub&gt;2&lt;/sub&gt;has better band gap properties, enhanced redox capabilities, and high chemical stability. Trace wt% metal oxides doped into the TiO        &lt;sub&gt;2&lt;/sub&gt;porous layer can increase the band gap and effectively enhance the photocatalytic performance of TiO        &lt;sub&gt;2&lt;/sub&gt;. This photocatalytic technology can efficiently degrade toxic organic compounds, removing and purifying environmental pollutants.      </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="342" publication-number="202625350">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625350</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147582</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電源轉換裝置</chinese-title>
        <english-title>POWER CONVERSION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">H02M3/04</main-classification>
        <further-classification edition="200601120250102B">H02M1/08</further-classification>
        <further-classification edition="200601120250102B">H02J7/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞福儲能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APH EPOWER CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王建民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIAN-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李金春</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JIN-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪煒翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, WEI-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇修賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, HSIU-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃上正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHANG-ZENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電源轉換裝置。電源轉換裝置包括外部電源端、正電源端、負電源端、第一輸出電路、第二輸出電路、電池模組、第一轉換電路以及第二轉換電路。第二輸出電路與第一輸出電路並聯耦接。控制開關耦接於外部電源端與正電源端之間。電池模組耦接於正電源端與負電源端之間。當位於外部電源端的外部電源不足時，控制開關被導通，電池模組、第一轉換電路以及第一輸出電路在第一期間形成第一電能迴路，並且電池模組以及第二轉換電路在第一期間形成第二電能迴路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power conversion device is provided. The power conversion device includes an external power terminal, a positive power terminal, a negative power terminal, a first output circuit, a second output circuit, a battery module, a first conversion circuit and a second conversion circuit. The second output circuit is coupled in parallel with the first output circuit. The control switch is coupled between the external power terminal and the positive power terminal. The battery module is coupled between the positive power terminal and the negative power terminal. When an external power supply at the external power supply terminal is insufficient, the control switch is turned on, the battery module, the first conversion circuit and the first output circuit form a first power loop in a first period, and the battery module and the second conversion circuit form a second power loop in the first period.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電源轉換裝置</p>
        <p type="p">110:第一輸出電路</p>
        <p type="p">120:第二輸出電路</p>
        <p type="p">130:第一轉換電路</p>
        <p type="p">140:第二轉換電路</p>
        <p type="p">BM:電池模組</p>
        <p type="p">PB:電池電能</p>
        <p type="p">PC1:第一電能</p>
        <p type="p">PC2:第二電能</p>
        <p type="p">PC3:第三電能</p>
        <p type="p">PE:外部電源</p>
        <p type="p">PO:輸出電能</p>
        <p type="p">POUT1:第一輸出電能</p>
        <p type="p">POUT2:第二輸出電能</p>
        <p type="p">POUT3:第三輸出電能</p>
        <p type="p">PP1:第一電能迴路</p>
        <p type="p">PP2:第二電能迴路</p>
        <p type="p">PP3:第三電能迴路</p>
        <p type="p">PP4:第四電能迴路</p>
        <p type="p">SWC:控制開關</p>
        <p type="p">T1:外部電源端</p>
        <p type="p">TOUT:輸出端</p>
        <p type="p">T+:正電源端</p>
        <p type="p">T-:負電源端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="343" publication-number="202623734">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623734</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147584</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>蜂窩式床墊</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241219B">A47C27/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>好睡王家居有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>刘南阳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杨松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>刘进貢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孟欣達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address></address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種蜂窩式床墊，主要包括︰包括多個獨立的柔性錐體，柔性錐體採用正六棱錐，全部柔性錐體呈蜂窩狀排列形成支撐主體，相鄰兩個柔性錐體之間形成V形間隙。本發明的床墊結構更加簡單，更便於加工，各個柔性錐體結構相互獨立，局部受壓時對周邊牽拉影響範更小，不僅具有較好的伸縮緩衝性能，在快速衝擊下也能保持較低的噪音，能夠有效增加使用舒適度和使用體驗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:支撐主體</p>
        <p type="p">101:第一支撐面</p>
        <p type="p">102:第二支撐面</p>
        <p type="p">103:柔性錐體</p>
        <p type="p">104:V形間隙</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="344" publication-number="202624003">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624003</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147590</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有高銅瘤分布密度的低粗糙度銅箔、其製作方法及包括其的銅箔基板</chinese-title>
        <english-title>COPPER FOIL HAVING LOW ROUGHNESS AND HIGH COPPER NODULE DISTRIBUTION DENSITY, MANUFACTURING METHOD THEREOF, AND COPPER CLAD LAMINATE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">B32B15/20</main-classification>
        <further-classification edition="200601120250102B">C25D7/06</further-classification>
        <further-classification edition="200601120250102B">C25D11/34</further-classification>
        <further-classification edition="200601120250102B">H05K1/09</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞塑膠工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAN YA PLASTICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁敬堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, CHING-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭維昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, WEI-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝育淇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, YU-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種具有高銅瘤分布密度的低粗糙度銅箔、其製作方法及包括其的銅箔基板，其中該銅箔包括一主體層、一粗化鍍層以及至少一表面處理層。該主體層具有一基本平坦表面，該粗化鍍層形成於該基本平坦表面上且包括複數細小銅瘤，至少一該表面處理層形成於該粗化鍍層上。複數該細小銅瘤在該基本平坦表面上呈均勻分布，且在該基本平坦表面之平均每1.0 μm        &lt;sup&gt;2&lt;/sup&gt;的面積上有135至203個細小銅瘤。該銅箔具有小於0.8 μm的表面粗糙度Rz。因此，該銅箔能夠滿足高頻和高速傳輸的要求。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A copper foil having a low roughness and a high copper nodule distribution density, a manufacturing method thereof, and a copper clad laminate including the same are provided. The copper foil includes a base layer, a roughening plated layer, and at least one surface treatment layer. The base layer has a substantially flat surface. The roughening plated layer is formed on the substantially flat surface and includes a plurality of fine copper nodules. The at least one surface treatment layer is formed on the roughening plated layer. The fine copper nodules are uniformly distributed on the substantially flat surface, and the number of the fine copper nodules per unit area of 1.0 μm        &lt;sup&gt;2&lt;/sup&gt;of the substantially flat surface ranges from 135 to 203. The copper foil has a surface roughness Rz of less than 0.8 μm. Therefore, the copper foil can meet the requirements of high-frequency and high-speed transmission.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">Z:具有高銅瘤分布密度的低粗糙度銅箔</p>
        <p type="p">1:主體層</p>
        <p type="p">100:基本平坦表面</p>
        <p type="p">2:粗化鍍層</p>
        <p type="p">21:細小銅瘤</p>
        <p type="p">3:表面處理層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="345" publication-number="202625152">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625152</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147592</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250512B">G09G5/14</main-classification>
        <further-classification edition="200601120250512B">H05F3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宏昆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUNG-KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>船越克久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUNAKOSHI, KATSUHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱庭瑤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, TING-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冠賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇建太</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置具有第一區包含第一週邊子區和第一顯示子區、及第二區包含第二週邊子區和第二顯示子區，且包含：第一驅動單元和第一電源設於第一週邊子區；第二驅動單元和第二電源設於第二週邊子區；第一訊號線及第二訊號線設於第一區和第二區中；第一顯示單元設於第一顯示子區且經由第一訊號線電性連接第一驅動單元；第二顯示單元設於第二顯示子區且經由第二訊號線電性連接第二驅動單元；第一放電單元電性連接於第一電源與第一訊號線之間；以及第二放電單元電性連接於第二電源與第二訊號線之間，其中，第一電源與第二電源電性分離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device is provided with a first area including a first peripheral sub-area and a first display sub-area, and a second area including a second peripheral sub-area and a second display sub-area, and includes: a first driving unit and a first power supply arranged in the first peripheral sub-area, a second driving unit and a second power supply arranged in the second peripheral sub-area, a first signal line and a second signal line arranged in the first area and the second area; a first display unit arranged in first display sub-area and electrically connected to the first driving unit via the first signal line; a second display unit arranged in the second display sub-area and electrically connected to the second driving unit via the second signal line, a first discharge unit electrically connected between the first power supply and the first signal line, and a second discharge unit electrically connected between the second power supply and the second signal line, wherein the first power supply and the second power supply are electrically separated.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:顯示裝置</p>
        <p type="p">10、20:區</p>
        <p type="p">11、21:週邊子區</p>
        <p type="p">13、23:顯示子區</p>
        <p type="p">111、211:驅動單元</p>
        <p type="p">113:電源</p>
        <p type="p">213:電源</p>
        <p type="p">115、215:訊號線</p>
        <p type="p">131、231:顯示單元</p>
        <p type="p">117、217:放電單元</p>
        <p type="p">Br:交界線</p>
        <p type="p">VGH、VGL、VGH_1、VGL_1、VGH_2、VGL_2:電壓</p>
        <p type="p">6:基板</p>
        <p type="p">e2~e4、e2’~e4’:邊緣</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="346" publication-number="202625086">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625086</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147593</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具影像分離協定之視覺定位系統</chinese-title>
        <english-title>VISUAL POSITIONING SYSTEM WITH IMAGE SEPARATION PROTOCOL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120250123B">G06T7/223</main-classification>
        <further-classification edition="202401120250123B">G06T5/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>逢甲大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG CHIA UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHE-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇渝閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, YU-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　鈺茗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OOI, YEE-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張喬茗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIAO-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仕偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種具影像分離協定之視覺定位系統，通過分析地面幾何特徵來確定飛行器的位置並識別其飛行路徑，當飛行載具的該視覺感測器捕捉到資料時，變化的視角將影響該電腦中的該機器學習模型的準確性和穩定性；本發明使用了影像分離協定與分類機制，可以減少飛行視角與光線的影響，以實現準確且穩定的位置預測，本發明僅需在飛行過程比對現有的含有座標資訊之空拍圖，即可得到當時的定位資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a visual positioning system with image separation protocol. This method determines the position of the aerial vehicle and identifies its flight path by analyzing ground geometric features. The computer vision sensors of the aerial vehicle capture data and changing viewpoints that affect the accuracy and stability of machine learning models. To address this, the present invention designs a new architecture incorporating an image separation protocol and a classification mechanism, reducing the impact of varying flight angles and lighting conditions and enabling accurate and stable position prediction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:飛行器</p>
        <p type="p">11:視覺感測器</p>
        <p type="p">12:電腦</p>
        <p type="p">20:影像增強模組</p>
        <p type="p">30:機器學習模組</p>
        <p type="p">M:標準圖資</p>
        <p type="p">m:小影像區塊</p>
        <p type="p">m’:地貌影像</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="347" publication-number="202625851">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625851</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147597</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微孔填裝系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR FILLING MICRO CONDUCTIVE BODIES IN MICROPORES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W72/50</main-classification>
        <further-classification edition="202601120260302B">H10W76/05</further-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
        <further-classification edition="200601120260302B">G01N21/25</further-classification>
        <further-classification edition="200601120260302B">G01N29/04</further-classification>
        <further-classification edition="200601120260302B">G01N29/46</further-classification>
        <further-classification edition="200601120260302B">B81C1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聚嶸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COHPROS INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林士聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIH-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游智偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種微孔填裝系統及方法，適用於將具磁性的複數個微導電體填裝於一基板的複數個微孔中。本發明的微孔填裝系統包含：一處理模組、一磁力模組以及一振動模組；其中，所述磁力模組係電性連接於所述處理模組，通過接收所述處理模組的訊號，在所述基板上方提供一磁力，以使所述微導電體受所述磁力影響而移動；所述振動模組係電性連接於所述處理模組，用以振動所述基板，使所述微導電體填入於所述微孔中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a system and a method of filling micro conductive bodies in micropores of a substrate. The system includes a processing module, a magnetic module and a vibration module. The magnetic, electrically connected to the processing module, provides a magnetic force above the substrate through receiving a signal of the processing module so that the micro conductive bodies moves under the influence of the magnetic force. The vibration module, electrically connected to the processing module, vibrates the substrate and makes the micro conductive bodies be filled in the micropores.</p>
      </isu-abst>
      <representative-img>
        <p type="p">Z:微孔填裝系統</p>
        <p type="p">21:處理模組</p>
        <p type="p">22:監測模組</p>
        <p type="p">23:振動模組</p>
        <p type="p">24:磁力模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="348" publication-number="202624558">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624558</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147599</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微細粗化的電解銅箔、其製作方法及包括其的銅箔基板</chinese-title>
        <english-title>MICRO-ROUGHENED ELECTRODEPOSITED COPPER FOIL, MANUFACTURING METHOD THEREOF, AND COPPER CLAD LAMINATE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">C25D7/06</main-classification>
        <further-classification edition="200601120250102B">C25D3/38</further-classification>
        <further-classification edition="200601120250102B">C25D5/10</further-classification>
        <further-classification edition="200601120250102B">C25D21/12</further-classification>
        <further-classification edition="200601120250102B">B32B15/20</further-classification>
        <further-classification edition="200601120250102B">B32B15/04</further-classification>
        <further-classification edition="200601120250102B">H05K1/09</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞塑膠工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAN YA PLASTICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁敬堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, CHING-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭維昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, WEI-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝育淇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, YU-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種微細粗化的電解銅箔、其製作方法及包括其的銅箔基板，其中該微細粗化的電解銅箔包括一主體層、一粗化鍍層以及一固化鍍層。該主體層具有一基本平坦表面，該粗化鍍層形成於該基本平坦表面上且包括複數細小銅瘤，該固化鍍層形成於該粗化鍍層與該基本平坦表面之間，以鞏固複數該細小銅瘤。複數該細小銅瘤在該基本平坦表面上呈均勻分布，且每一該細小銅瘤的最大粒徑小於100 nm，該微細粗化的電解銅箔具有小於0.8 μm的表面粗糙度Rz。因此，該微細粗化的電解銅箔能夠滿足高頻和高速傳輸的要求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A micro-roughened electrodeposited copper foil, a manufacturing method thereof, and a copper clad laminate including the same are provided. The micro-roughened electrodeposited copper foil includes a base layer, a roughening plated layer, and a solidifying plated layer. The base layer has a substantially flat surface. The roughening plated layer is formed on the substantially flat surface and includes a plurality of fine copper nodules. The solidifying plated layer is formed between the roughening plated layer and the substantially flat surface, so as to solidify the fine copper nodules. The fine copper nodules are uniformly distributed on the substantially flat surface, and the maximum particle size of each of the fine copper nodules is less than 100 nm. The micro-roughened electrodeposited copper foil has a surface roughness Rz less than 0.8 μm. Therefore, the micro-roughened electrodeposited copper foil can meet the requirements of high-frequency and high-speed transmission.</p>
      </isu-abst>
      <representative-img>
        <p type="p">Z:微細粗化的電解銅箔</p>
        <p type="p">1:主體層</p>
        <p type="p">100:基本平坦表面</p>
        <p type="p">2:粗化鍍層</p>
        <p type="p">21:細小銅瘤</p>
        <p type="p">3:固化鍍層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="349" publication-number="202625852">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625852</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147600</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>同時巨量轉移微導電柱的方法及設備</chinese-title>
        <english-title>METHODS AND EQUIPMENT FOR SIMULTANEOUSLY TRANSFERRING LARGE QUANTITIES OF MICRO-CONDUCTIVE PILLARS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260316B">H10W72/50</main-classification>
        <further-classification edition="202601120260316B">H10P72/00</further-classification>
        <further-classification edition="202601120260316B">H10P52/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聚嶸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COHPROS INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林士聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIH-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游智偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種同時巨量轉移微導電柱的方法，包括：提供基板。於基板開設多個微貫孔。將多個微導電柱設置於暫時載體上。微導電柱包括基底與本體。以本體朝向微貫孔的方式，將微導電柱分別置入微貫孔，本體凸露或顯露於基板的第一表面，基底凸露於基板的第二表面。於第一表面上塗佈導電膠，使導電膠填充於本體與對應的微貫孔之間的間隙。移除暫時載體。移除第一表面上的導電膠，以及移除本體凸露於第一表面的部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for transferring a large amount of micro-conductive pillars at the same time is provided. The method includes: providing a substrate. A plurality of micro through holes are opened in the substrate. A plurality of micro conductive pillars are arranged on a temporary carrier. The micro conductive pillars include a base and a body. The micro conductive pillars are respectively placed into the micro through holes with the body facing the micro through holes, the body is exposed or exposed on a first surface of the substrate, and the base is exposed on a second surface of the substrate. Coating conductive glue on the first surface, the conductive glue fills the gap between the body and the corresponding micro-through hole. Remove the temporary carrier. And remove the conductive glue on the first surface and remove the portion of the body exposed on the first surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:同時巨量轉移微導電柱的方法</p>
        <p type="p">S1-S8:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="350" publication-number="202624470">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624470</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147617</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶圓清洗液及其製造方法</chinese-title>
        <english-title>WAFER CLEANING SOLUTION AND METHOD FOR PRODUCING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">C11D1/68</main-classification>
        <further-classification edition="200601120250102B">C11D1/04</further-classification>
        <further-classification edition="200601120250102B">C11D1/34</further-classification>
        <further-classification edition="200601120250102B">C11D3/20</further-classification>
        <further-classification edition="200601120250102B">C11D3/26</further-classification>
        <further-classification edition="200601120250102B">C11D3/34</further-classification>
        <further-classification edition="200601120250102B">C11D11/04</further-classification>
        <further-classification edition="200601120250102B">B08B3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞塑膠工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAN YA PLASTICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁敬堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, CHING-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹俊哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAO, CHUN-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江培瑀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, PEI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種晶圓清洗液及其製造方法。所述晶圓清洗液包含一非離子型界面活性劑、一陰離子型界面活性劑、一抗菌劑、一pH值調節劑及水。所述非離子型界面活性劑的數均分子量是介於3,000至6,000之間。所述陰離子型界面活性劑是選自由十二烷基硫酸鈉及十三烷基聚氧乙烯醚磷酸酯所組成的材料群組中的至少其中一種。所述pH值調節劑的酸解離常數（pKa）是介於1.38至4.76之間。所述抗菌劑是選自由卡松、甲基異噻唑啉酮、二氯苯氧氯酚、氯二甲苯酚、甲基丙烯醯氧十二烷基溴化吡啶鹽及四級銨鹽化合物所組成的材料群組中的至少其中一種。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wafer cleaning solution and method for producing the same are provided. The wafer cleaning solution includes a nonionic surfactant, an anionic surfactant, an antibacterial agent, a pH value adjusting agent, and water. A number average molecular weight of the nonionic surfactant is between 3,000 and 6,000. The anionic surfactant is selected from the group consisting of sodium lauryl sulfate and tridecyl polyoxyethylene ether phosphate. An acid dissociation constant (pKa) of the pH value adjusting agent is between 1.38 and 4.76. The antibacterial agent is selected from the group consisting of cassone, methylisothiazolinone, dichlorophenoxychlorophenol, chloroxylenol, methacryloxydodecylpyridinium bromide salt and a quaternary ammonium salt compound.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110:第一混合步驟</p>
        <p type="p">S120:第二混合步驟</p>
        <p type="p">S130:pH值調節步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="351" publication-number="202625872">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625872</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147618</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微孔填裝系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR FILLING MICRO CONDUCTIVE BODIES IN MICROPORES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W76/05</main-classification>
        <further-classification edition="202601120260302B">H10W72/50</further-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
        <further-classification edition="202601120260302B">H10W76/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聚嶸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COHPROS INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林士聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIH-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游智偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種微孔填裝系統及方法，適用於將具磁性的複數個微導電體填裝於一基板的複數個微孔中。本發明的微孔填裝系統包含：一處理模組、一磁力模組、一振動模組以及一監測模組；其中，所述磁力模組係電性連接於所述處理模組，通過接收所述處理模組的訊號，在所述基板上方或下方提供一磁力，以使所述微導電體受所述磁力影響而移動；所述振動模組係電性連接於所述處理模組，用以振動所述基板，使所述微導電體填入於所述微孔中；所述監測模組係電性連接於所述處理模組，用以即時監測所述基板的表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a system and a method of filling micro conductive bodies in micropores of a substrate. The system includes a processing module, a magnetic module, a vibration module, and a monitoring module. The magnetic, electrically connected to the processing module, provides a magnetic force above or under the substrate through receiving a signal of the processing module so that the micro conductive bodies moves under the influence of the magnetic force. The vibration module, electrically connected to the processing module, vibrates the substrate and makes the micro conductive bodies be filled in the micropores. The monitoring module, electrically connected to the processing module, is used to monitor a surface of the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">Z:微孔填裝系統</p>
        <p type="p">21:處理模組</p>
        <p type="p">22:監測模組</p>
        <p type="p">23:振動模組</p>
        <p type="p">24:磁力模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="352" publication-number="202625360">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625360</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147626</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>馬達控制器</chinese-title>
        <english-title>MOTOR CONTROLLER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120250526B">H02P6/08</main-classification>
        <further-classification edition="201601120250526B">H02P29/60</further-classification>
        <further-classification edition="200601120250526B">H02P25/16</further-classification>
        <further-classification edition="200601120250526B">H02P27/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>致新科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLOBAL MIXED-MODE TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李榮欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, RONG-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種馬達控制器具有一開關電路、一驅動電路、一脈寬調變電路、以及一單一霍爾感測器。該單一霍爾感測器耦合至該脈寬調變電路，用以產生一霍爾信號。該霍爾信號產生一第一時間且該馬達控制器會紀錄該第一時間。於該第一時間過後，該馬達控制器將所紀錄之該第一時間用以驅動一第一驅動信號，使得該第一驅動信號具有一第一驅動時間且該第一驅動時間等於該第一時間。該馬達控制器係用以減少噪音且降低成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A motor controller comprises a switch circuit, a driving circuit, a pulse width modulation circuit, and a single Hall sensor. The single Hall sensor is coupled to the pulse width modulation circuit for generating a Hall signal. The Hall signal generates a first time and the motor controller records the first time. After the first time elapses, the motor controller utilizes the recorded first time to drive a first driving signal, such that the first driving signal has a first driving time and the first driving time is equal to the first time. The motor controller is configured to reduce noise and decrease the cost.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:馬達控制器</p>
        <p type="p">100:開關電路</p>
        <p type="p">110:驅動電路</p>
        <p type="p">120:脈寬調變電路</p>
        <p type="p">130:單一霍爾感測器</p>
        <p type="p">Vp:脈寬調變信號</p>
        <p type="p">Vh:霍爾信號</p>
        <p type="p">101:第一電晶體</p>
        <p type="p">102:第二電晶體</p>
        <p type="p">103:第三電晶體</p>
        <p type="p">104:第四電晶體</p>
        <p type="p">105:第五電晶體</p>
        <p type="p">106:第六電晶體</p>
        <p type="p">U:第一端點</p>
        <p type="p">V:第二端點</p>
        <p type="p">W:第三端點</p>
        <p type="p">VCC:第四端點</p>
        <p type="p">GND:第五端點</p>
        <p type="p">C1:第一控制信號</p>
        <p type="p">C2:第二控制信號</p>
        <p type="p">C3:第三控制信號</p>
        <p type="p">C4:第四控制信號</p>
        <p type="p">C5:第五控制信號</p>
        <p type="p">C6:第六控制信號</p>
        <p type="p">L1:第一線圈</p>
        <p type="p">L2:第二線圈</p>
        <p type="p">L3:第三線圈</p>
        <p type="p">M:三相馬達</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="353" publication-number="202624627">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624627</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147631</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>轉向扣合結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250217B">F16B13/10</main-classification>
        <further-classification edition="200601120250217B">F16B5/07</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伍鐌科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FIVETECH TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王鼎瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TING-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張桐榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, TUNG JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種轉向扣合結構，其包含身部、操動部及扣部。身部設於物體；操動部與身部活動組合；扣部活動設於身部且與操動部組合，操動部縱向移動後再旋向移動，以帶動扣部經物體而扣接至另一物體或帶動扣部於另一物體進行解扣。藉此，可施力於操動部，而使扣部進行扣接或解扣，以完成至少兩物體之快速結合與分離，而達到反復快速結合與分離之功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:轉向扣合結構</p>
        <p type="p">11:身部</p>
        <p type="p">111:組接部</p>
        <p type="p">112:防轉部</p>
        <p type="p">113:第一限制部</p>
        <p type="p">114:第二限制部</p>
        <p type="p">12:操動部</p>
        <p type="p">121:擋抵部</p>
        <p type="p">122:避讓部</p>
        <p type="p">13:扣部</p>
        <p type="p">131:組合件</p>
        <p type="p">132:桿體</p>
        <p type="p">133:扣接體</p>
        <p type="p">14:彈性元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="354" publication-number="202625583">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625583</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147633</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260203B">H10D30/60</main-classification>
        <further-classification edition="202501120260203B">H10D62/60</further-classification>
        <further-classification edition="202501120260203B">H10D30/01</further-classification>
        <further-classification edition="202601120260203B">H10P32/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>世界先進積體電路股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳姿宣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TZU-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋建憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, CHIEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒振東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TZOU, CHEN-DONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴云凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YUN-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李家豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIA-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅宗仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAO, CHUNG-REN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖志成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHIH-CHERNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種半導體結構，包括：一基板；一磊晶層，設置於該基板上；多個第一垂直場板結構，設置於該磊晶層中，且在一水平方向上彼此分隔；一閘極結構，設置於該磊晶層上，且包括在該水平方向上彼此分隔的一第一閘極部及一第二閘極部；以及一間隙場板結構，設置於該第一閘極部與該第二閘極部之間的一間隙中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a semiconductor structure includes: a substrate; an epitaxial layer disposed on the substrate; first vertical field plate structures disposed in the epitaxial layer and separated from each other in a horizontal direction; a gate structure disposed on the epitaxial layer and including a first gate portion and a second gate portion separated from each other in the horizontal direction; and a gap field plate structure disposed in a gap between the first gate portion and the second gate portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體結構</p>
        <p type="p">100:基板</p>
        <p type="p">110:磊晶層</p>
        <p type="p">120:第一垂直場板結構</p>
        <p type="p">122:第一導電填充層</p>
        <p type="p">124:第一介電間隔層</p>
        <p type="p">125:第二垂直場板結構</p>
        <p type="p">126:第二導電填充層</p>
        <p type="p">128:第二介電間隔層</p>
        <p type="p">130:閘極結構</p>
        <p type="p">131:第一閘極部</p>
        <p type="p">132:第二閘極部</p>
        <p type="p">133:間隙</p>
        <p type="p">134:閘極介電層</p>
        <p type="p">140:間隙場板結構</p>
        <p type="p">142:介電間隔層</p>
        <p type="p">144:電場調整層</p>
        <p type="p">150:摻雜結構</p>
        <p type="p">152:摻雜井</p>
        <p type="p">154:第一重摻雜區</p>
        <p type="p">156:第二重摻雜區</p>
        <p type="p">160:層間介電層</p>
        <p type="p">168:接觸層</p>
        <p type="p">170:源極電極</p>
        <p type="p">171:第一源極部</p>
        <p type="p">172:第二源極部</p>
        <p type="p">180:汲極電極</p>
        <p type="p">D1,D2:距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="355" publication-number="202625285">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625285</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147634</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有重力閥的電池模組</chinese-title>
        <english-title>BATTERY MODULE WITH GRAVITY VALVE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120250418B">H01M50/30</main-classification>
        <further-classification edition="202101120250418B">H01M50/317</further-classification>
        <further-classification edition="202101120250418B">H01M50/358</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉勝發</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, SHENG-FA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林坤成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有重力閥的電池模組，包含一外殼、一電池組與至少一重力閥；重力閥包括一框體與一閥門，閥門具有相對之樞設端與開合端，樞設端樞設於框體，閥門可以樞設端為中心樞轉與框體於一夾角間扇形相對開合，夾角大於0度且小於45度；重力閥可以於閉合狀態較開啟狀態具有較高或較低重力位能的狀態設置於外殼，當電池模組內的壓力升高時可推動閥門翻轉而與框體貼靠或分離，當壓力降低或消失時，閥門因其本身的重力而翻轉而與框體分離或貼靠，藉此控制電池模組內部與外部環境是否連通。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A battery module with gravity valve is disclosed, which includes a housing, a battery assembly and at least one gravity valve. The gravity includes a frame and a door which has a pivoting end and an open-close end relatively. The pivoting end is pivoted on the frame while allowing the door to move close or away from the frame according to their respective fan-like rotation angle. The angle is bigger than 0 degree and smaller than 45 degrees. The gravity valve can be arranged on the housing in a state where the closed state has higher or lower gravity potential energy than the open state. The door could be pushed to against or away from the frame when pressure in the battery module is increasing, then the door will be away from or against the frame while the pressure is decreasing or disappear.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電池模組</p>
        <p type="p">10:外殼</p>
        <p type="p">11:頂面</p>
        <p type="p">111:排氣口</p>
        <p type="p">12:底面</p>
        <p type="p">13A~13D:側面</p>
        <p type="p">20:電池組</p>
        <p type="p">30:重力閥</p>
        <p type="p">G:間距</p>
        <p type="p">S:內部</p>
        <p type="p">H1:高度</p>
        <p type="p">L:長度</p>
        <p type="p">W1:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="356" publication-number="202625303">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625303</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147636</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電連接器及電連接器的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120251030B">H01R12/71</main-classification>
        <further-classification edition="201101120251030B">H01R12/79</further-classification>
        <further-classification edition="200601120251030B">H01R13/627</further-classification>
        <further-classification edition="200601120251030B">H01R13/639</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商莫仕有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOLEX, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳詩弦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHIH-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電連接器及電連接器的製造方法，該電連接器包含一外殼、一電路板、線纜、一背板，以及兩個固定柱。該外殼具有朝向後方的一容置槽、連通該容置槽且朝前開口的一通槽、位於該容置槽兩側的兩個固定凸起、分別位於該兩個固定凸起且上下貫穿地形成的兩個第一安裝孔，以及位於該外殼頂部的兩個第二安裝孔。該電路板具有兩個第三安裝孔。所述線纜電性該電路板。該背板包覆於該電路板與所述線纜的連接處外周且設於該容置槽，使該電路板自該通槽朝前凸伸，該背板具有兩個第一固定部，以及位於該兩個第一固定部的兩個第四安裝孔。該兩個固定柱上下地延伸且穿設於該兩個第一安裝孔、該兩個第二安裝孔、該兩個第三安裝孔及該兩個第四安裝孔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電連接器</p>
        <p type="p">1:外殼</p>
        <p type="p">11:前壁</p>
        <p type="p">12:頂壁</p>
        <p type="p">121:第二安裝孔</p>
        <p type="p">122:收容凹部</p>
        <p type="p">13:側壁</p>
        <p type="p">14:側板</p>
        <p type="p">16:容置槽</p>
        <p type="p">18:通槽</p>
        <p type="p">19:固定凸起</p>
        <p type="p">191:第一安裝孔</p>
        <p type="p">2:電路板</p>
        <p type="p">21:對接部</p>
        <p type="p">22:接線部</p>
        <p type="p">23:翼部</p>
        <p type="p">24:第三安裝孔</p>
        <p type="p">3:線纜</p>
        <p type="p">4:背板</p>
        <p type="p">41:第一固定部</p>
        <p type="p">411:收容槽</p>
        <p type="p">42:第二固定部</p>
        <p type="p">43:第四安裝孔</p>
        <p type="p">44:第五安裝孔</p>
        <p type="p">45:第一成型體</p>
        <p type="p">451:開孔</p>
        <p type="p">46:第二成型體</p>
        <p type="p">47:穿帶孔</p>
        <p type="p">5:固定柱</p>
        <p type="p">51:螺紋結構</p>
        <p type="p">6:鎖扣件</p>
        <p type="p">7:拉帶</p>
        <p type="p">D1:前後方向</p>
        <p type="p">D2:上下方向</p>
        <p type="p">D3:左右方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="357" publication-number="202625614">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625614</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147639</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10D84/80</main-classification>
        <further-classification edition="202501120250102B">H10D30/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>世界先進積體電路股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃曄仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YEH-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李建興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JIAN-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪力揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, LI-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周業甯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOU, YEH-NING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例提供半導體裝置。半導體裝置包括基底以及多個汲極接觸。基底具有主動區。主動區包括閘極主動區、源極主動區和汲極主動區。源極主動區和汲極主動區分別位於閘極主動區的相對兩側。汲極主動區包括彼此隔開的多個汲極主動區塊。汲極接觸設置於部分汲極主動區塊上。汲極主動區塊具有第一數量，汲極接觸具有第二數量，且第一數量不等於第二數量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments provide a semiconductor device. The semiconductor device a substrate and drain contacts. The substrate has an active region. The active region includes a gate active region, a source active region and a drain active region. The source active region and the drain active region are located on opposite sides of the gate active region. The drain active region includes drain active segments that are spaced apart from each other. The drain contacts are disposed on a portion of the drain active segments. The drain active segments have a first number, the drain contacts have a second number, and the first number is not equal to the second number.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:基底</p>
        <p type="p">202-1,202-2:隔離部件</p>
        <p type="p">207:汲極主動區塊</p>
        <p type="p">214:汲極接觸</p>
        <p type="p">216:源極接觸</p>
        <p type="p">220:閘極電極</p>
        <p type="p">240:框線區域</p>
        <p type="p">500A:半導體裝置</p>
        <p type="p">A-A’:切線</p>
        <p type="p">AR:主動區</p>
        <p type="p">AR-B:基體主動區</p>
        <p type="p">AR-D:汲極主動區</p>
        <p type="p">AR-G:閘極主動區</p>
        <p type="p">AR-S:源極主動區</p>
        <p type="p">CR1:圓角部</p>
        <p type="p">DA:分佈區域</p>
        <p type="p">DA-1,DA-2,DA-3:U型區</p>
        <p type="p">DA-S1:第一側</p>
        <p type="p">DA-S2:第二側</p>
        <p type="p">EL1:直線延伸部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="358" publication-number="202625728">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625728</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147644</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>重工系統及覆晶組件</chinese-title>
        <english-title>REWORK SYSTEM AND FLIP CHIP ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/00</main-classification>
        <further-classification edition="202601120260302B">H10W72/50</further-classification>
        <further-classification edition="202601120260302B">H10W72/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>啟端光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRILIT OPTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳炳昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, BIING SENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李杏櫻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HSING YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃子欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TZU HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林敬倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種重工系統，包含基板；複數基板主墊片，設於基板上；及複數基板修補墊片，設於基板上。基板修補墊片相鄰且對應至少一部分的基板主墊片。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A rework system includes a substrate, a plurality of primary substrate pads disposed on the substrate, and a plurality of repair substrate pads disposed on the substrate. The repair substrate pads are adjacent and correspond to at least a part of the primary substrate pads.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:重工系統</p>
        <p type="p">11:基板</p>
        <p type="p">12:基板主墊片</p>
        <p type="p">13:基板修補墊片</p>
        <p type="p">d:距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="359" publication-number="202623851">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623851</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147650</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>美容儀</chinese-title>
        <english-title>BEAUTY INSTRUMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241212B">A61N1/40</main-classification>
        <further-classification edition="200601120241212B">A61N1/32</further-classification>
        <further-classification edition="200601120241212B">A61N1/36</further-classification>
        <further-classification edition="200601120241212B">A61F7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和碩聯合科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEGATRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, CHUN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱榆皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, YU-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種美容儀，包括一殼體、一撥鈕、一連桿組件及至少一美容件。殼體包括一握持部及連接握持部的一主體部。握持部包括一第一開口，主體部包括至少一第二開口。撥鈕可移動地設置於握持部，且外露於第一開口。連桿組件設置於殼體內且連動於撥鈕。至少一美容件連動於連桿組件，可伸縮地設置於主體部，而自至少一第二開口凸出或內縮。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A beauty instrument includes a housing, a button, a linkage assembly and at least one beauty appliance. The housing includes a holding part and a main part connected to the holding part. The holding part includes a first opening, and the main part includes at least a second opening. The button is movably provided on the holding part and exposed at the first opening. The linkage assembly is disposed in the housing and linked to the button. The at least one beauty appliance is linked to the linkage assembly and is telescopically disposed on the main part. Therefore, the at least one beauty appliance is protruded or retracted from the at least one second opening.</p>
      </isu-abst>
      <representative-img>
        <p type="p">D1、D2:方向</p>
        <p type="p">100:美容儀</p>
        <p type="p">110:握持部</p>
        <p type="p">112:第一開口</p>
        <p type="p">120:主體部</p>
        <p type="p">123:第二固定部</p>
        <p type="p">124:第二內軌道</p>
        <p type="p">130:撥鈕</p>
        <p type="p">140:連桿組件</p>
        <p type="p">142:第一連桿</p>
        <p type="p">144:滑動部</p>
        <p type="p">146:第二連桿</p>
        <p type="p">148:第三連桿</p>
        <p type="p">150:美容件</p>
        <p type="p">152:第一部分</p>
        <p type="p">154:第二部分</p>
        <p type="p">156:限位面</p>
        <p type="p">160:電極頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="360" publication-number="202624408">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624408</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147651</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可輻射快速定型或固化之聚矽氧烷組合物</chinese-title>
        <english-title>RADIATION RAPID SETTING OR CURING POLYSILOXANE COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260316B">C08L83/07</main-classification>
        <further-classification edition="200601120260316B">C08L83/05</further-classification>
        <further-classification edition="200601120260316B">C08J3/24</further-classification>
        <further-classification edition="202601120260316B">H10W74/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長興材料工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ETERNAL MATERIALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾宇霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, YU TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳信宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIN HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳語蘋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘怡晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, YI CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊郁沁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可輻射快速定型或固化之聚矽氧烷組合物，其包含：        &lt;br/&gt;(A)具有兩個以上烯基之有機聚矽氧烷，        &lt;br/&gt;(B)具有兩個以上SiH基之有機氫化聚矽氧烷，        &lt;br/&gt;(C)具有兩個以上烯基之有機交聯劑，以及        &lt;br/&gt;(D)光活性型催化劑，        &lt;br/&gt;其中組份(C)之折射率(N        &lt;sub&gt;c&lt;/sub&gt;)與組份(A)及(B)之混合物之折射率(N        &lt;sub&gt;ab&lt;/sub&gt;)存在以下關係：        &lt;br/&gt;| N        &lt;sub&gt;c&lt;/sub&gt;-N        &lt;sub&gt;ab&lt;/sub&gt;| ≤ 0.1。        &lt;br/&gt;本發明並提供一種封裝材料之製造方法。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a radiation rapid setting or curing polysiloxane composition, which contains:        &lt;br/&gt;(A) an organopolysiloxane having two or more alkenyl groups,        &lt;br/&gt;(B) an organohydrogenated polysiloxane having two or more SiH groups,        &lt;br/&gt;(C) an organic cross-linking agent having two or more alkenyl groups, and        &lt;br/&gt;(D) a photoactive catalyst,        &lt;br/&gt;wherein the refractive index (N        &lt;sub&gt;c&lt;/sub&gt;) of the component (C) has the following relationship with the refractive index (N        &lt;sub&gt;ab&lt;/sub&gt;) of the mixture of components (A) and (B):        &lt;br/&gt;| Nc-Nab | ≤ 0.1.        &lt;br/&gt;The present invention also provides a method for manufacturing packaging materials.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="361" publication-number="202624704">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624704</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147657</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>寵物用體溫測量儀以及寵物體溫測量方法</chinese-title>
        <english-title>THERMOMETER FOR PET BODY TEMPERATURE AND METHOD FOR MEASURING PET BODY TEMPERATURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120241231B">G01K13/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾特生醫科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TECHNCARE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳其定</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡書豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, SHU-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種寵物用體溫測量儀，涉及寵物體溫測量儀技術領域。包括測量儀主體，測量儀主體包括主殼以及套設於主殼上的矽膠套，主殼的頂部設置有測溫頭，矽膠套的頂部可拆卸連接有內部與測溫頭外部相套接的替換頭。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a pet body temperature measuring device, belonging to the technical field of thermometer for pet body temperature. The device includes a thermometer body, which includes a main case and a silicone sleeve fitted onto the main shell. A temperature-sensing head is disposed at the top of the main case, and the top of the silicone sleeve is detachably connected to a replaceable head, and the replaceable head internally interfaces with the exterior of the temperature-sensing head.</p>
      </isu-abst>
      <representative-img>
        <p type="p">111:面殼</p>
        <p type="p">12:矽膠套</p>
        <p type="p">122:避讓口二</p>
        <p type="p">123:連接頭</p>
        <p type="p">13:替換頭</p>
        <p type="p">132:爪片</p>
        <p type="p">133:爪牙</p>
        <p type="p">18:按鍵組</p>
        <p type="p">19:顯示幕</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="362" publication-number="202625290">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625290</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147658</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>零階共振天線</chinese-title>
        <english-title>ZERO ORDER RESONANT ANTENNA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250304B">H01Q1/36</main-classification>
        <further-classification edition="201501120250304B">H01Q5/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立屏東大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL PINGTUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇欣龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, HSIN-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳佑東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-TUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種零階共振天線，其包含介電基板、輻射金屬層、接地金屬層、多個導電結構和饋入端。輻射金屬層位於介電基板且具有第一外框部、第二外框部、第三外框部、多個輻射部和饋入部。第一外框部圍繞且與第二外框部相隔。第二外框部圍繞且與第三外框部相隔。第三外框部圍繞且與此些輻射部相隔。此些輻射部彼此相隔。饋入部位於第一外框部外，且在饋入部與第一外框部之間存在間隙。接地金屬層位於介電基板。多個導電結構分別對應此些輻射部，且貫穿介電基板並分別連接在此些輻射部和接地金屬層之間。饋入端位於饋入部之遠離第一外框部的一端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A zero order resonant antenna includes a dielectric substrate, a radiating metal layer, a ground metal layer, multiple conductive structures, and a feeding end. The radiating metal layer is located on the dielectric substrate, and has a first outer frame, a second outer frame, a third outer frame, multiple radiation portions, and a feeding portion. The first outer frame surrounds the second outer frame and is separated from the second outer frame. The second outer frame surrounds the third outer frame and is separated from the third outer frame. The third outer frame surrounds the radiation portions and is separated from the radiation portions. The radiation portions are separated from each other. The feeding portion is located out of the first outer frame, and a gap is existed between the feeding portion and the first outer frame. The ground metal layer is located on the dielectric substrate. The conductive structures correspond to the radiation portions, and penetrate the dielectric substrate, and are connected between the radiation portions and the ground metal layer, respectively. The feeding end is located on the feeding portion at an end far from the first outer frame.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:零階共振天線</p>
        <p type="p">200:介電基板</p>
        <p type="p">300:輻射金屬層</p>
        <p type="p">400:接地金屬層</p>
        <p type="p">500:導電結構</p>
        <p type="p">600:接地板</p>
        <p type="p">700:饋入端</p>
        <p type="p">800:被動元件</p>
        <p type="p">L&lt;sub&gt;200&lt;/sub&gt;,L&lt;sub&gt;200&lt;/sub&gt;’,L&lt;sub&gt;600&lt;/sub&gt;,L&lt;sub&gt;600&lt;/sub&gt;’:邊長</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="363" publication-number="202624869">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624869</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147659</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示器及前光模組</chinese-title>
        <english-title>DISPLAY AND FRONT LIGHT MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250418B">G02F1/1675</main-classification>
        <further-classification edition="200601120250418B">G02B6/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>元太科技工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>E INK HOLDINGS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃信道</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HSIN-TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫育銓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEN, YU-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余仁斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, JEN-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雅菁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YA-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖經桓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHING-HUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示器包括導光板、第一光學膠、光源元件及顯示面板。導光板包括導光基材及強化層。導光基材具有入光表面、第一表面與第二表面，第一表面與第二表面相對，且入光表面延伸於第一表面與第二表面之間。強化層配置於導光基材上。第一光學膠配置於導光基材上。強化層的至少一部分夾於導光基材的第一表面與第一光學膠之間。光源元件配置於入光表面旁。顯示面板面向導光基材的第二表面。導光基材的折射率為        &lt;img align="absmiddle" height="15px" width="19px" file="ed10081.JPG" alt="ed10081.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。強化層的至少一部分的折射率為        &lt;img align="absmiddle" height="15px" width="19px" file="ed10084.JPG" alt="ed10084.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。第一光學膠的折射率為        &lt;img align="absmiddle" height="15px" width="19px" file="ed10085.JPG" alt="ed10085.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。導光基材的折射率與強化層的至少一部分的折射率的差為        &lt;img align="absmiddle" height="19px" width="31px" file="ed10086.JPG" alt="ed10086.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。        &lt;img align="absmiddle" height="19px" width="51px" file="ed10087.JPG" alt="ed10087.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="16px" width="61px" file="ed10088.JPG" alt="ed10088.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。第一光學膠的折射率與強化層的至少一部分的折射率的差為        &lt;img align="absmiddle" height="19px" width="30px" file="ed10089.JPG" alt="ed10089.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。        &lt;img align="absmiddle" height="20px" width="123px" file="ed10090.JPG" alt="ed10090.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，        &lt;img align="absmiddle" height="19px" width="68px" file="ed10091.JPG" alt="ed10091.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，        &lt;img align="absmiddle" height="19px" width="67px" file="ed10082.JPG" alt="ed10082.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，且        &lt;img align="absmiddle" height="22px" width="90px" file="ed10083.JPG" alt="ed10083.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display includes a light guide plate, a first optical adhesive, a light source element and a display panel. The light guide plate includes a light guide substrate and an enhancement layer. The light guide substrate has a light incident surface, a first surface and a second surface, the first surface is opposite to the second surface, and the light incident surface extends between the first surface and the second surface. The enhancement layer is disposed on the light guide substrate. The first optical adhesive is disposed on the light guide substrate. At least one portion of the enhancement layer is interposed between the first surface of the light guide substrate and the first optical adhesive. The light source element is disposed beside the light incident surface. The display panel faces the second surface of the light guide substrate. The refractive index of the light guide substrate is        &lt;img align="absmiddle" height="15px" width="19px" file="ed10081.JPG" alt="ed10081.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;. The refractive index of the at least portion of the enhancement layer is        &lt;img align="absmiddle" height="15px" width="19px" file="ed10084.JPG" alt="ed10084.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;. The refractive index of the first optical adhesive is        &lt;img align="absmiddle" height="15px" width="19px" file="ed10085.JPG" alt="ed10085.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;. A difference between the refractive index of the light guide substrate and the refractive index of the at least one portion of the enhancement layer is               &lt;img align="absmiddle" height="23px" width="163px" file="ed10092.JPG" alt="ed10092.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;. A difference between the refractive index of the first optical adhesive and the refractive index of the at least one portion of the enhancement layer is        &lt;img align="absmiddle" height="20px" width="32px" file="ed10093.JPG" alt="ed10093.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;.        &lt;img align="absmiddle" height="22px" width="124px" file="ed10094.JPG" alt="ed10094.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;img align="absmiddle" height="21px" width="67px" file="ed10096.JPG" alt="ed10096.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;,&lt;img align="absmiddle" height="21px" width="71px" file="ed10095.JPG" alt="ed10095.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, and        &lt;img align="absmiddle" height="20px" width="88px" file="ed10097.JPG" alt="ed10097.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:顯示面板</p>
        <p type="p">20:觸控面板</p>
        <p type="p">30:蓋板</p>
        <p type="p">120:第一光學膠</p>
        <p type="p">40:第二光學膠</p>
        <p type="p">50:第三光學膠</p>
        <p type="p">100:光源裝置</p>
        <p type="p">110:導光板</p>
        <p type="p">110a:第一光學表面</p>
        <p type="p">110b:第二光學表面</p>
        <p type="p">110c:光學側面</p>
        <p type="p">110d:內部界面</p>
        <p type="p">112:導光基材</p>
        <p type="p">114:強化層</p>
        <p type="p">130:光源元件</p>
        <p type="p">DP1:顯示器</p>
        <p type="p">L1、L2:光線</p>
        <p type="p">S1:第一表面</p>
        <p type="p">S2:第二表面</p>
        <p type="p">S3:入光表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="364" publication-number="202625334">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625334</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147660</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>外轉子電機及應用外轉子電機的電動工具</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250210B">H02K1/2786</main-classification>
        <further-classification edition="200601120250210B">H02K1/16</further-classification>
        <further-classification edition="200601120250210B">H02K5/20</further-classification>
        <further-classification edition="200601120250210B">H02K9/06</further-classification>
        <further-classification edition="200601120250210B">B25B21/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>筌誠機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRANMAX MACHINERY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳新吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIN-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宏亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱謙成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的外轉子電機包括一連接座、一定子模組、一轉軸、一支撐件及一轉子模組。連接座包括一端架、一中空管體及一中空筒身。端架連接中空管體。中空管體具有一通道。中空筒身連接端架，且與端架及中空管體形成一開放空間。通道連通開放空間。定子模組連接中空管體，且在開放空間內。轉軸插入通道。轉軸的二端伸出中空管體，轉軸的二端的其中一者位在中空筒身外。支撐件連接轉軸，且在通道內。轉子模組插入開放空間，且包括一結合端蓋。結合端蓋連接轉軸，且外露於開放空間外。其中，定子模組用以驅動轉子模組相對連接座旋轉。中空筒身具有多個結合部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:外轉子電機</p>
        <p type="p">10:連接座</p>
        <p type="p">11:端架</p>
        <p type="p">111:散熱口</p>
        <p type="p">13:中空管體</p>
        <p type="p">131:通道</p>
        <p type="p">15:中空筒身</p>
        <p type="p">151:凹槽</p>
        <p type="p">153:結合部</p>
        <p type="p">155:自由端</p>
        <p type="p">157:外側</p>
        <p type="p">159:內壁面</p>
        <p type="p">17:開放空間</p>
        <p type="p">20:定子模組</p>
        <p type="p">21:定子鐵芯</p>
        <p type="p">30:轉軸</p>
        <p type="p">40:支撐件</p>
        <p type="p">41:軸承</p>
        <p type="p">43:扣接單元</p>
        <p type="p">50:轉子模組</p>
        <p type="p">51:結合端蓋</p>
        <p type="p">511:通風口</p>
        <p type="p">513:螺孔</p>
        <p type="p">55:中空套筒</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="365" publication-number="202624395">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624395</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147682</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子零件之橡膠密封墊片組成物</chinese-title>
        <english-title>RUBBER GASKET COMPOSITION FOR ELECTRONIC COMPONENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250124B">C08L51/04</main-classification>
        <further-classification edition="200601120250124B">C08F291/12</further-classification>
        <further-classification edition="200601120250124B">C08K3/34</further-classification>
        <further-classification edition="200601120250124B">C08K13/00</further-classification>
        <further-classification edition="200601120250124B">C08K13/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>毅豐橡膠工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU FENG RUBBER INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜建昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, CHIEN CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱銘峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王傳勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種電子零件之橡膠密封墊片組成物，包含有:丁腈橡膠，具有100重量份;碳黑，具有30至50重量份；滑石粉，具有10至30重量份；高齡土，具有30至60重量份；加工助劑，具有2至5重量份；老化防止劑，具有1至3重量份；交聯劑，具有6至10重量份。藉以能製成具有極佳耐油性的橡膠密封墊片，以供作為電子零件之組裝使用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="366" publication-number="202624765">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624765</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147683</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於可重構智慧面之散射特性之量測系統及其方法及非暫態電腦可讀儲存媒體</chinese-title>
        <english-title>MEASUREMENT SYSTEM FOR SCATTERING CHARACTERISTICS BASED ON RECONFIGURABLE INTELLIGENT SURFACE AND METHOD THEREOF, AND NON-TRANSITORY COMPUTER READABLE STORGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250512B">G01R29/08</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中正大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHUNG CHENG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>嘉義縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林士程</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIH-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張盛富</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, SHENG-FUH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張嘉展</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIA-CHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳佑誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YOU-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐偉倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, WEI-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種基於可重構智慧面之散射特性之量測系統，其中轉台用以放置可重構智慧面。處理器驅動轉台旋轉至角度，並執行所有狀態量測操作。所有狀態量測操作包含在取樣時間內切換可重構智慧面之所有複數預設狀態，並藉由量測裝置量測可重構智慧面，以得到可重構智慧面對應角度之量測結果。處理器確認轉台是否完成所有量測角度而產生確認結果，並依據確認結果決定是否改變角度且重複執行所有狀態量測操作，並依據確認結果及量測結果評估可重構智慧面之散射特性。藉此，通過整合可重構智慧面與轉台，能高效且準確地測量電磁特性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A measurement system for scattering characteristics based on a reconfigurable intelligent surface (RIS) is configured to measure the RIS. The measurement system for the scattering characteristics based on the RIS includes a turntable, a measurement device and a processing device. The turntable is configured to dispose the RIS. The measurement device is disposed corresponding to the turntable. The processing device is connected to the turntable and the measurement device, and includes a memory and a processor. The memory stores an angle and a sampling time. The angle is set to 0 degrees. The processor is signally connected to the RIS, the turntable, the measurement device and the memory. The processor drives the turntable to rotate to an angle, and performs an all-state measurement operation. The all-state measurement operation includes switching all of a plurality of predetermined states of the RIS within the sampling time, and measuring the RIS by the measurement device to obtain a measurement result of the RIS corresponding to the angle. The processor confirms whether the turntable completes the rotation through all the angles to generate a confirmation result, and decides whether to change the angle and repeatedly perform the all-state measurement operation according to the confirmation result, and evaluates the scattering characteristics of the RIS according to the confirmation result and the measurement result. Therefore, the measurement system for the scattering characteristics based on the RIS of the present disclosure can integrate the RIS with a high-precision measurement turntable to be capable of comprehensively measuring the electromagnetic characteristics of the RIS in an efficient and accurate manner.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基於可重構智慧面之散射特性之量測系統</p>
        <p type="p">200:轉台</p>
        <p type="p">300:量測裝置</p>
        <p type="p">310:量測設備</p>
        <p type="p">400:處理裝置</p>
        <p type="p">410:記憶體</p>
        <p type="p">420:處理器</p>
        <p type="p">RIS:可重構智慧面</p>
        <p type="p">RX:接收器</p>
        <p type="p">TX:發射器</p>
        <p type="p">θ&lt;sub&gt;t&lt;/sub&gt;:入射角</p>
        <p type="p">θ&lt;sub&gt;r&lt;/sub&gt;:反射角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="367" publication-number="202624620">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624620</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147685</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有兩段式翼尖小翼扇葉的風扇</chinese-title>
        <english-title>FAN WITH TWO-SECTION WINGLET BLADES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250213B">F04D29/38</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>建準電機工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNONWEALTH ELECTRIC MACHINE INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪朗瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, LANG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃耀霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有兩段式翼尖小翼扇葉的風扇，用以解決習知軸流風扇的翼端繞流造成噪音及風扇效率降低的問題。係包含：一轂部；數個葉片，環繞排列並連接於該轂部的外周緣；及數個小翼，一對一連接該數個葉片，各該小翼係位於各該葉片遠離該轂部的一端，各該小翼之一第一摺沿各該葉片之外緣設置，並形成以徑向朝外的斜面，各該小翼之一第二摺沿該第一摺的外緣設置，並形成以徑向朝內的斜面，各該葉片與該第一摺之交界處的折線係一第一圓弧，其中，該第一圓弧的兩端分別位於各該葉片之前緣及葉面上。藉此可以達成提升風扇效率及降低噪音的功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fan with two-section winglet blades is provided to solve the problems of noise and low fan efficiency caused by the wingtip vortices of conventional axial flow fan. The fan includes a hub, a plurality of blades arranged around and connected to the outer periphery of the hub, and a plurality of winglets connecting the plurality of blades one-to-one. Each winglet is located at an end of each blade away from the hub. A first fold of each winglet is provided along the outer edge of each blade and forms a radially outward inclined surface. A second fold of each winglet is provided along the outer edge of the first fold and forms a radially inward inclined surface. The fold line at the junction of each blade and the first fold is a first arc. Both ends of the first arc are respectively located on the leading edge and blade surface of each blade. The fan with two-section winglet blades can improve fan efficiency and reduce noise.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:小翼</p>
        <p type="p">11:第一摺</p>
        <p type="p">12:第二摺</p>
        <p type="p">2:葉片</p>
        <p type="p">3:轂部</p>
        <p type="p">B:扇葉</p>
        <p type="p">P1:第一圓弧</p>
        <p type="p">P1’:虛擬弧線</p>
        <p type="p">P2:第二圓弧</p>
        <p type="p">P3:第三圓弧</p>
        <p type="p">X:軸心</p>
        <p type="p">r1:第一半徑</p>
        <p type="p">r2:第二半徑</p>
        <p type="p">r3:第三半徑</p>
        <p type="p">C:前緣</p>
        <p type="p">D:後緣</p>
        <p type="p">G:旋轉方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="368" publication-number="202624216">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624216</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147686</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗壞血酸共熔物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241219B">C07D307/62</main-classification>
        <further-classification edition="200601120241219B">C07C31/125</further-classification>
        <further-classification edition="200601120241219B">C07C31/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嘉藥學校財團法人嘉南藥理大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIA NAN UNIVERSITY OF PHARMACY AND SCIENCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何文岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, WEN-YUEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEU, KUEN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂孟娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, MENG-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林維炤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEI-CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉家全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIA-CHYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊彩秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, TSAI-HSIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑜惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YU-HUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種抗壞血酸共熔物，由抗壞血酸及與抗壞血酸以分子間作用力結合的多元醇所構成，且多元醇選自於總碳數為4至10的二元醇、單月桂酸山梨糖醇酯、單棕櫚酸山梨糖醇酯、單硬脂酸山梨糖醇酯或聚氧乙烯山梨糖醇酐單月桂酸酯。以抗壞血酸共熔物的總量為100mol%計，抗壞血酸的含量為20mol%以上且小於100mol%。透過多元醇以分子間作用力與抗壞血酸結合，抗壞血酸共熔物在水溶液中或不同pH環境中的降解率是低於抗壞血酸，表示不易受環境影響而氧化降解，因此在穩定性上是優於抗壞血酸，且在抗氧化能力上是與抗壞血酸相當近似，並優於以往抗壞血酸衍生物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="369" publication-number="202625835">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625835</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147687</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子封裝件及其基板結構</chinese-title>
        <english-title>ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W70/62</main-classification>
        <further-classification edition="202601120260302B">H10W20/43</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矽品精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICONWARE PRECISION INDUSTRIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉怡彣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YI WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秀容</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, HSIU-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳婉柔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WAN ROU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張馨尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HSIN YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫芝潔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, CHIH CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子封裝件及其基板結構，其中，該電子封裝件包括該基板結構以及設於該基板結構上之電子元件與被動元件，且於該基板結構之基板本體之表面上定義有相鄰之置晶區與功能區，以藉由減少佈線層於該置晶區內之金屬片之面積，使該基板本體表面上之金屬面積縮減，避免應力集中於該置晶區內而發生翹曲問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic package comprises a substrate structure and an electronic component and a passive component disposed on the substrate structure, wherein a die bond area and a functional area adjacent each other are defined on a surface of a substrate body of the substrate structure, an area of a metal panel of a wiring layer arranged in the die bond area is reduced, so as to reduce the metal on the surface of the substrate body to avoid warpage caused by stress concentration in the die bond area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:基板結構</p>
        <p type="p">2a:佈線層</p>
        <p type="p">20:基板本體</p>
        <p type="p">200:金屬片</p>
        <p type="p">201:導電跡線</p>
        <p type="p">204:電性接觸墊</p>
        <p type="p">25,85:被動元件</p>
        <p type="p">80:另一金屬片</p>
        <p type="p">A:置晶區</p>
        <p type="p">B:功能區</p>
        <p type="p">D:垂直投影區域</p>
        <p type="p">R1:線寬</p>
        <p type="p">t:距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="370" publication-number="202625072">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625072</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147688</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於區塊鏈的交通運具計費系統以及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR TRANSPORTATION BILLING BASED ON BLOCKCHAIN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120250303B">G06Q50/40</main-classification>
        <further-classification edition="201201120250303B">G06Q20/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林冠華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KUAN-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸本立</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, BEN-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林士弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIH-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋泊儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, BO-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴東祺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, DONG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林長榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案揭示一種基於區塊鏈的交通運具計費系統以及方法，包括：電子支付平台執行來自交通運具驗票機讀取乘車碼後所傳輸之支付請求而產生對應支付請求之交易紀錄；交通運具平台接收來自交通運具驗票機讀取乘車碼後所傳輸之搭乘紀錄；交通運具平台觸發第一智能合約以令第一智能合約根據搭乘紀錄計算出乘車費用；電子支付平台觸發第二智能合約以令第二智能合約根據交易紀錄計算出折抵費用；以及交易平台接收來自第一智能合約的乘車費用以及來自第二智能合約的折抵費用，從而觸發第三智能合約令第三智能合約彙整出乘車費用與折抵費用之交通運具計費結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and a method for transportation billing based on blockchain are disclosed. An electronic payment platform is configured to execute a payment request transmitted from a transportation ticket verification machine after reading a trip code to generate a transaction record corresponding to the payment request. A transportation platform is configured to receive a trip record transmitted from the transportation ticket verification machine after reading the trip code. The transportation platform triggers a first smart contract to calculate a transportation fare based on the trip record. The electronic payment platform triggers a second smart contract to calculate a discount fare based on the transaction record. A transaction platform is configured to receive the transportation fare from the first contract and the discount fare from the second contract, so as to trigger a third smart contract to sort out a transportation billing result from the transportation fare and the discount fare.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:系統</p>
        <p type="p">21:第一智能合約</p>
        <p type="p">22:交通運具平台</p>
        <p type="p">23:第二智能合約</p>
        <p type="p">24:電子支付平台</p>
        <p type="p">25:第三智能合約</p>
        <p type="p">26:交易平台</p>
        <p type="p">27:交通運具驗票機</p>
        <p type="p">28:行動終端</p>
        <p type="p">29:電子支付服務</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="371" publication-number="202625407">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625407</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147689</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>整合用戶身分驗證及電子簽章之方法與系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR INTEGRATING USER IDENTITY VERIFICATION AND ELECTRONIC SIGNATURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250327B">H04L9/32</main-classification>
        <further-classification edition="200601120250327B">H04L9/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江彬榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, PIN-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱華洲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, HUA-CHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林崇頤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUNG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭凱方</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, KAI-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方竣民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, JIUN-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林長榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種整合用戶身分驗證及電子簽章之方法與系統，係由用戶之終端裝置通過應用伺服器與驗證伺服器將待簽資料傳送至該用戶之行動裝置，該行動裝置於取得該用戶同意並完成該用戶之生物特徵身分驗證後，進行該待簽資料之電子簽章，再將該待簽資料之簽章結果與該簽章結果之驗證碼傳回該驗證伺服器，以由該驗證伺服器接收並驗證該簽章結果與該驗證碼，俾於該簽章結果與該驗證碼通過驗證後，將該簽章結果提供至該應用伺服器。藉此，本發明能以單一整合機制完成前述之身分驗證及電子簽章，且能呈現用戶之簽章意願，而符合電子簽章法之規範。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and a system for integrating user identity verification and electronic signature are provided, wherein a terminal device of a user transmits the data to be signed to a mobile device of the user through an application server and an authentication server. After obtaining the user's consent and completing the user's biometric identity verification, the mobile device performs the electronic signature of the data to be signed, and then transmits a signature result of the data to be signed and a verification code of the signature result back to the authentication server. The authentication server receives and verifies the signature result and the verification code. After the signature result and the verification code are successfully verified, the authentication server provides the signature result to the application server. In this way, the present invention can accomplish the aforementioned identity verification and electronic signature by a single integrated mechanism, and can present the user's signing intention in compliance with the Electronic Signature Law.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S9:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="372" publication-number="202624702">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624702</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147695</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於分析樣本的方法及其裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250925B">G01J3/44</main-classification>
        <further-classification edition="200601120250925B">G01N21/01</further-classification>
        <further-classification edition="200601120250925B">G01N21/65</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧地利商布雷夫分析有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRAVE ANALYTICS GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紐珀　克里斯提安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEUPER, CHRISTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希爾　克里斯提安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HILL, CHRISTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費策克　哈拉德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FITZEK, HARALD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西米克　馬可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIMIC, MARKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種特別是藉由拉曼光譜法來分析樣本的方法，該樣本包含流體及分散在流體中的顆粒（1），其中該樣本沿一流向（2）以一流速運動穿過腔室（3），其中在該樣本處於該腔室（3）中期間，在一分析時間長度內進行分析，其中用光束、特別是雷射光束（4）照射該樣本，且該樣本的流向（2）反向於該光束的傳播方向（5）。為了即使在高流速下亦可實現高品質的分析，根據本發明，用該光束將力施加至該腔室（3）中的顆粒（1），該力反向於該流體的流速，從而將該流體中的至少一些顆粒（1）沿該流向（2）的速度減小至該流體的流速的90%以下，以增加分析時間長度。        &lt;br/&gt;本發明還有關於一種用於分析樣本的裝置，該樣本包含流體及分散在流體中的顆粒（1），該裝置具有：腔室（3），該樣本可沿一流向（2）運動穿過該腔室；光源，特別是雷射，該光源可用來在該腔室（3）中形成光束，該光束的傳播方向（5）反向於該流向（2）。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:顆粒</p>
        <p type="p">2:流向</p>
        <p type="p">3:腔室</p>
        <p type="p">4:雷射光束</p>
        <p type="p">5:傳播方向</p>
        <p type="p">6:強度分佈</p>
        <p type="p">7:窗口</p>
        <p type="p">8:散射輻射</p>
        <p type="p">9:拉曼訊號</p>
        <p type="p">10:感測器</p>
        <p type="p">11:光學力</p>
        <p type="p">12:流體力</p>
        <p type="p">14:焦點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="373" publication-number="202624988">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624988</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147698</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>馬達健康暨使用壽命管理系統</chinese-title>
        <english-title>MOTOR HEALTH AND SERVICE LIFE MANAGEMENT SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120241231B">G06F17/00</main-classification>
        <further-classification edition="201601120241231B">H02P29/02</further-classification>
        <further-classification edition="201601120241231B">H02P29/40</further-classification>
        <further-classification edition="201601120241231B">H02P29/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東訊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TECOM CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜顯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, YI HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊士進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHIH CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>易承霈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YI, CHEN PEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊虹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種馬達健康暨使用壽命管理系統包括工業電腦，持續地從資料處理器接收多個工作屬性的多個狀態感測資料，分別基於各工作屬性的多個狀態感測資料持續地計算對應各工作屬性的變化趨勢。當變化趨勢符合觸發條件時，工業電腦計算預測各工作屬性到達對應失效臨界值的剩餘時間。當判斷多個工作屬性中的至少一者對應的預測剩餘使用時間小於故障閥值時，工業電腦透過輸出介面顯示預測剩餘使用時間並發出警示訊息。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A motor health management system includes an industrial computer, continuously receiving multiple status sensing data of multiple working attributes from a data processor, keeping computing a variation tendency corresponding to each working attribute based on the status sensing data of each working attribute. When the variation tendency satisfies a trigger condition, the industrial computer computes a remaining time to failure corresponding to each working attribute. When the predicted remaining usable time corresponding to each working attribute is less than a failure threshold, the industrial computer displays through an output interface the predicted remaining usable time and outputs a warning message.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:馬達</p>
        <p type="p">120:感測器模組</p>
        <p type="p">130:資料處理器</p>
        <p type="p">140:工業電腦</p>
        <p type="p">150:供電模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="374" publication-number="202624693">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624693</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147699</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>表面形貌檢測系統</chinese-title>
        <english-title>SURFACE TOPOGRAPHY MEASURING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250416B">G01B11/24</main-classification>
        <further-classification edition="200601120250416B">G02B27/18</further-classification>
        <further-classification edition="200601120250416B">G02B13/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鑑微科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BENANO INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余良彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, LIANG-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種表面形貌檢測系統，適用於平行於第一掃描方向的承載面。表面形貌檢測系統包含光圖案產生器、感測器及鏡片組。光圖案產生器包括與第一掃描方向不平行的光圖案產生面。光圖案產生面能夠發射出週期性圖案光束。感測器包括能夠感測光的感測面。鏡片組對準光圖案產生面與感測器。光圖案產生面所發射出的週期性圖案光束透過鏡片組朝承載面垂直投影形成與第一掃描方向傾斜交會的投影焦平面圖案，且感測器透過鏡片組將投影焦平面圖案成像在感測面。投影焦平面圖案可與待測物的待測面於不同水平位置且高度不同處交會，使表面形貌檢測系統無需垂直掃描，僅需沿著第一掃描方向連續取像並進行影像重組計算，以減少作動次數，提升檢測效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A surface topography measuring system is suitable for a bearing surface parallel to a first scanning direction. The surface topography measuring system includes a light pattern generator, a sensor and a lens set. The light pattern generator includes a light pattern generating surface that is not parallel to the first scanning direction. The light pattern generating surface can emit a periodic pattern beam. The sensor includes a sensing surface capable of sensing light. The lens set is aligned with the light pattern generating surface and the sensor. The periodic pattern beam emitted by the light pattern generating surface is vertically projected toward the bearing surface by the lens set to form a projection focal plane pattern that obliquely intersects with the first scanning direction, and the sensor is projected through the lens set images the projected focal plane pattern on the sensing surface. The projected focal plane pattern can intersect a surface of the object to be measured at different horizontal positions and different heights, so that the surface topography measuring system does not need to scan vertically, but only needs to continuously capture and image along the first scanning direction and perform image reorganization calculation to reduce the number of operations and improve measuring efficiency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光圖案產生器</p>
        <p type="p">11:光圖案產生面</p>
        <p type="p">2:感測器</p>
        <p type="p">21:感測面</p>
        <p type="p">3:鏡片組</p>
        <p type="p">31:第一透鏡單元</p>
        <p type="p">311:第一光軸</p>
        <p type="p">312:第一鏡片</p>
        <p type="p">32:分光鏡</p>
        <p type="p">33:第二透鏡單元</p>
        <p type="p">331:第二光軸</p>
        <p type="p">332:第二鏡片</p>
        <p type="p">5:發光裝置</p>
        <p type="p">9:待測物</p>
        <p type="p">91:待測面</p>
        <p type="p">300:承載面</p>
        <p type="p">X:第一掃描方向</p>
        <p type="p">Y:高度方向</p>
        <p type="p">Z:第二掃描方向</p>
        <p type="p">P':投影焦平面圖案</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="375" publication-number="202625291">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625291</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147703</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>天線結構</chinese-title>
        <english-title>ANTENNA STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250320B">H01Q1/36</main-classification>
        <further-classification edition="201501120250320B">H01Q5/20</further-classification>
        <further-classification edition="201501120250320B">H01Q5/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>啓碁科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON NEWEB CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣政緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHENG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JIAN-ZHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊諺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JUN-YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳靜雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHING-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種天線結構，包括：一接地元件、一第一輻射部、一第二輻射部、一電容元件、一第三輻射部、一可調電路、一第四輻射部、一第五輻射部，以及一非導體支撐元件。第一輻射部具有一饋入點。第二輻射部係耦接至饋入點。第三輻射部可經由電容元件耦接至第二輻射部。第四輻射部係經由可調電路耦接至接地元件。第四輻射部係鄰近於第一輻射部。第五輻射部係耦接至第四輻射部。非導體支撐元件具有相對之一第一表面和一第二表面。第一輻射部、第二輻射部、電容元件、第三輻射部，以及第四輻射部皆設置於第一表面。第五輻射部係設置於第二表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An antenna structure includes a ground element, a first radiation element, a second radiation element, a capacitive element, a third radiation element, a tunable circuit, a fourth radiation element, a fifth radiation element, and a nonconductive support element. The first radiation element has a feeding point. The second radiation element is coupled to the feeding point. The third radiation element is coupled through the capacitive element to the second radiation element. The fourth radiation element is coupled through the tunable circuit to the ground element. The fourth radiation element is adjacent to the first radiation element. The fifth radiation element is coupled to the fourth radiation element. The nonconductive support element has a first surface and a second surface which are opposite to each other. The first radiation element, the second radiation element, the capacitive element, the third radiation element, and the fourth radiation element are disposed on the first surface. The fifth radiation element is disposed on the second surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:天線結構</p>
        <p type="p">110:接地元件</p>
        <p type="p">120:第一輻射部</p>
        <p type="p">121:第一輻射部之第一端</p>
        <p type="p">122:第一輻射部之第二端</p>
        <p type="p">130:第二輻射部</p>
        <p type="p">131:第二輻射部之第一端</p>
        <p type="p">132:第二輻射部之第二端</p>
        <p type="p">140:電容元件</p>
        <p type="p">150:第三輻射部</p>
        <p type="p">151:第三輻射部之第一端</p>
        <p type="p">152:第三輻射部之第二端</p>
        <p type="p">160:可調電路</p>
        <p type="p">170:第四輻射部</p>
        <p type="p">171:第四輻射部之第一端</p>
        <p type="p">172:第四輻射部之第二端</p>
        <p type="p">180:第五輻射部</p>
        <p type="p">181:第五輻射部之第一端</p>
        <p type="p">182:第五輻射部之第二端</p>
        <p type="p">190:非導體支撐元件</p>
        <p type="p">199:信號源</p>
        <p type="p">E1:非導體支撐元件之第一表面</p>
        <p type="p">FP:饋入點</p>
        <p type="p">GC1:耦合間隙</p>
        <p type="p">L1,L2,L3,L4:長度</p>
        <p type="p">LC1:剖面線</p>
        <p type="p">SC:控制信號</p>
        <p type="p">VSS:接地電位</p>
        <p type="p">Z:可變阻抗值</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="376" publication-number="202624924">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624924</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147717</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水冷散熱及監控系統及方法</chinese-title>
        <english-title>LIQUID-COOLING AND MONITORING SYSTEM AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250416B">G06F1/20</main-classification>
        <further-classification edition="200601120250416B">H05K7/20</further-classification>
        <further-classification edition="200601120250416B">G05D23/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>技嘉科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIGA-BYTE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃順治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHUN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>毛黛娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAO, TAI-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭春亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, CHUN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種水冷散熱及監控系統，包含幫浦、水冷管路、水冷頭、水冷排、多個溫度感測器以及微控制器。幫浦與水冷管路用於傳輸所述冷卻液。水冷頭熱接觸於一功率元件。水冷排用於使冷卻液與周遭環境進行熱交換。多個溫度感測器設置於水冷路徑上的至少相異兩點。微控制器連接於所述多個溫度感測器及幫浦，用於至少取得所述至少相異兩點的至少一溫度差值及冷卻液的量測流速，並根據所述至少一溫度差值、量測流速、冷卻液的比熱容及密度取得功率元件的一預估功耗及一預估溫度，並根據所述預估溫度控制該幫浦的轉速以調節冷卻液的流速。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A liquid-cooling and monitoring system includes a pump, a liquid-cooling pipeline, a cold plate, a liquid-cooling radiator, a plurality of temperature sensors and a microcontroller. The pump and the liquid-cooling pipe line are configured to transport coolant. The liquid-cooling radiator is in thermal contact with a power component. The plurality of temperature sensors are disposed at at least two different points on a liquid-cooling cooling path. The microcontroller is connected to the plurality of temperature sensors and the pump, and is configured to obtain at least one temperature difference between the at least two different points and the measured flow rate of the coolant, and obtain an estimated power consumption and an estimated temperature of the power component based on the at least one temperature difference, the measured flow rate, and specific heat capacity and density of the coolant, and control the rotation speed of the pump according to the estimated temperature to adjust the flow rate of the coolant.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:水冷散熱及監控系統</p>
        <p type="p">11:幫浦</p>
        <p type="p">12:水冷管路</p>
        <p type="p">13:水冷頭</p>
        <p type="p">14:水冷排</p>
        <p type="p">15:溫度感測元件</p>
        <p type="p">16:微控制器</p>
        <p type="p">20:功率元件</p>
        <p type="p">N1,N2:散熱節點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="377" publication-number="202623770">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623770</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147723</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>反饋強化學習式智能數位植牙工具系統及其方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241219B">A61C13/00</main-classification>
        <further-classification edition="200601120241219B">A61C13/36</further-classification>
        <further-classification edition="201801120241219B">G16H50/50</further-classification>
        <further-classification edition="201801120241219B">G16H30/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立勤益科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHIN-YI UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何境峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, TSENG-FUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳濟行</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係揭露一種反饋強化學習式智能數位植牙工具系統及其方法，其包括植牙工具、植牙標示單元、第二訊號傳輸模組、資訊輸出模組及資訊裝置，並於植牙工具設置包含植牙運作感測單元、植牙運作感測單元及第一訊號處理模組。第一訊號處理模組將運作感測訊號處理轉換為相應的植牙運作數據。植牙標示單元標示植牙患者的植牙位置。資訊裝置以第二訊號傳輸模組接收植牙運作數據，當植牙運作數據低於高於或偏離植牙預設運作數據時，資訊裝置則輸出植牙運作異常訊號及反饋運作修正數據，反饋運作修正數據為植牙運作數據與植牙預設運作數據的差值，並由資訊輸出模組依序輸出為植牙運作資訊、植牙運作異常資訊及反饋運作修正資訊，俾能藉由植牙施作的反饋與強化學習等機能設置，以監控與導引牙醫達到更為精準化控制的植牙效果，進而有效提升植牙醫療的成功機率。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:植牙工具</p>
        <p type="p">10a:驅動部件</p>
        <p type="p">10b:本體部件</p>
        <p type="p">10c:容置部件</p>
        <p type="p">11:植牙運作感測單元</p>
        <p type="p">12:第二訊號傳輸模組</p>
        <p type="p">13:第一訊號處理模組</p>
        <p type="p">14:第一供電模組</p>
        <p type="p">30:資訊裝置</p>
        <p type="p">31:第一訊號傳輸模組</p>
        <p type="p">32:資訊輸出模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="378" publication-number="202624832">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624832</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147724</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>放大鏡與照明工具組</chinese-title>
        <english-title>MAGNIFYING GLASS AND LIGHTING TOOL SET</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250306B">G02B25/02</main-classification>
        <further-classification edition="200601120250306B">F21V33/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻安國際興業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG ANN TOOL INDUSTRIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇政維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, CHENG WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡侑芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明放大鏡與照明工具組包括有一個支撐架、一個手電筒及一個放大鏡，支撐架設置有一個連接部，手電筒包括有一個手柄及一個燈頭，手柄的一端可脫離地連接於連接部，燈頭連接於手柄相反於連接部的一端，放大鏡套設於燈頭外並可脫離地連接於手柄相反於連接部的一端，工具組透過上述結構不僅能夠將手電筒與放大鏡結合使用且手電筒與放大鏡亦能夠分別單獨使用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a magnifying glass and lighting tool set comprising a support frame, a flashlight, and a magnifying glass. The support frame is provided with a connection part, the flashlight includes a handle and a light head, wherein one end of the handle can detachably connect to the connection part, the light head is connected to the end of the handle opposite to the connection part, and the magnifying glass is fitted over the light head and can be detachably connected to the end of the handle opposite to the connection part. Through this structure, the tool set can not only combine the flashlight and magnifying glass for joint use but also allows the flashlight and magnifying glass to be used separately.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:工具組</p>
        <p type="p">20:支撐架</p>
        <p type="p">22:底座</p>
        <p type="p">23:管件</p>
        <p type="p">30:手電筒</p>
        <p type="p">31:手柄</p>
        <p type="p">32:燈頭</p>
        <p type="p">40:放大鏡</p>
        <p type="p">41:外框</p>
        <p type="p">42:透鏡</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="379" publication-number="202623967">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623967</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147725</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有鎖定機構的折疊工具</chinese-title>
        <english-title>FOLDABLE TOOL WITH LOCKING MECHANISM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">B25F1/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻安國際興業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG ANN TOOL INDUSTRIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇政維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, CHENG WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡侑芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明具有鎖定機構的折疊工具包括有一個本體、一個工具頭組及一個定位機構，工具頭組包括有一個第一工具頭，第一工具頭能相對本體樞轉，第一工具頭的外周緣設置有一個第一卡掣部，定位機構包括有一個第一定位鈕，第一定位鈕能在鎖定位置與釋放位置之間移動的連接於本體，第一定位鈕設置有一個第一扣部，第一定位鈕在鎖定位置時，第一扣部扣接於第一卡掣部並限制第一工具頭轉動，第一定位鈕在釋放位置時，第一扣部脫離第一卡掣部並解除限制，折疊工具透過上述結構既方便使用者操作且提供效率更高的空間配置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a foldable tool with a locking mechanism, comprising a main body, a tool head assembly, and a positioning mechanism. The tool head assembly includes a first tool head, wherein the first tool head can pivot relative to the main body. The outer periphery of the first tool head is provided with a first catch part. The positioning mechanism includes a first positioning button, which is connected to the main body and can move between a locking position and a release position. The first positioning button is provided with a first engagement part, such that when the first positioning button is in the locking position, the first engagement part engages with the first catch part and restricts the rotation of the first tool head, and when the first positioning button is in the release position, the first engagement part disengages from the first catch part and releases the restriction. Through this structure, the foldable tool is convenient for user operation and provides a more efficient spatial configuration.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:折疊工具</p>
        <p type="p">20:本體</p>
        <p type="p">22:第一側蓋</p>
        <p type="p">23:第二側蓋</p>
        <p type="p">25:第一鎖緊件</p>
        <p type="p">27:第二鎖緊件</p>
        <p type="p">30:工具頭組</p>
        <p type="p">32:第二工具頭</p>
        <p type="p">322:第二卡掣部</p>
        <p type="p">323:第二工作部</p>
        <p type="p">40:定位機構</p>
        <p type="p">412:第一操作部</p>
        <p type="p">415:第一鈕件</p>
        <p type="p">42:第一彈性件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="380" publication-number="202625043">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625043</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147732</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>行動應用程式無交易安控機制時引導設定之裝置及方法</chinese-title>
        <english-title>DEVICE AND METHOD FOR GUIDING SETTINGS WHEN NO TRANSACTION SECURITY CONTROL MECHANISM IS IN MOBILE APPLICATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120250303B">G06Q20/30</main-classification>
        <further-classification edition="201201120250303B">G06Q20/32</further-classification>
        <further-classification edition="201201120250303B">G06Q20/38</further-classification>
        <further-classification edition="201201120250303B">G06Q20/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彰化商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG HWA COMMERCIAL BANK, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳敏仙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, MIN HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鼎鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種行動應用程式無交易安控機制時引導設定之裝置及方法，其透過判斷銀行客戶輸入之交易操作需要執行交易安控機制時，偵測裝置是否已綁定交易安控機制，當裝置未綁定交易安控機制時，依據驗證碼的取得狀態與裝置上之軟硬體選擇身分識別機制，並在身分識別機制確認銀行客戶之身分後提供銀行客戶設定交易安控機制之技術手段，可以不使用密碼簡訊來確認身分，並達成減少簡訊發送數量以降低成本的技術功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device for guiding settings when there is no transaction security control mechanism in a mobile application and a method thereof are provided. By detecting whether a device has been bound to a transaction security control mechanism when determining that a transaction operation input by a bank customer requires to execute the transaction security control mechanism, selecting an identity recognition mechanism based on a verification code acquisition status and the software and hardware on the device when the device is not bound to a transaction security control mechanism, and providing the bank customer with the ability to set up the transaction security control mechanism after the identity recognition mechanism confirms an identity of the bank customer, the device and the method can confirm identity without password text messages, and can achieve the effect of reducing sent number of text messages to reduce costs.</p>
      </isu-abst>
      <representative-img>
        <p type="p">步驟301:提供銀行客戶輸入交易操作</p>
        <p type="p">步驟310:判斷交易操作需要執行交易安控機制時，偵測裝置是否已被綁定</p>
        <p type="p">步驟330:當裝置未被綁定時，取得驗證碼之取得狀態</p>
        <p type="p">步驟340:判斷取得狀態是否表示驗證碼已取得</p>
        <p type="p">步驟350:提供銀行客戶輸入驗證碼，並驗證驗證碼</p>
        <p type="p">步驟360:偵測裝置上之硬體及/或之軟體以產生偵測結果，並依據偵測結果選擇身分識別機制</p>
        <p type="p">步驟370:依據身分識別機制確認銀行客戶之身分</p>
        <p type="p">步驟381:判斷驗證碼通過驗證時，提供銀行客戶設定交易安控機制</p>
        <p type="p">步驟385:判斷銀行客戶之身分通過身分識別機制確認時，提供銀行客戶設定交易安控機制</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="381" publication-number="202625574">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625574</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147735</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>絕緣閘雙極電晶體及其製造方法</chinese-title>
        <english-title>IGBT AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250620B">H10D12/00</main-classification>
        <further-classification edition="202501120250620B">H10D10/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王佩如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, PEI-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅維德　多梅尼科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO VERDE, DOMENICO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>切薩雷　隆西斯瓦萊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CESARE, RONSISVALLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許晃賓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU,HUANG-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃子豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TZU-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝松穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, SUNG-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡清福</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馭理</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種製造一絕緣閘雙極電晶體(IGBT)的方法，包含下列步驟：提供一第一類型高摻雜半導體基板；沉積一碳化矽磊晶層在該第一類型高摻雜半導體基板上；研磨該第一類型高摻雜半導體基板以將其移除；沉積一第一類型半導體層於該研磨後碳化矽磊晶層上；以及沉積一第二類型高摻雜半導體層於該第一類型半導體層上，其中該碳化矽磊晶層之一第一厚度介於幾微米到數十微米之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of manufacturing an insulated gate bipolar transistor (IGBT), including the following steps of: providing a first type highly doped semiconductor substrate; depositing a silicon carbide epitaxial layer on the first type highly doped semiconductor substrate; grinding the first type highly doped semiconductor substrate to remove it; depositing a first type semiconductor layer on the ground silicon carbide epitaxial layer; and depositing a second type highly doped semiconductor layer on the first type semiconductor layer, wherein a first thickness of the silicon carbide epitaxial layer is between several microns and tens of microns.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10:製造一絕緣閘雙極電晶體(IGBT)的方法</p>
        <p type="p">S101~S105:製造一絕緣閘雙極電晶體(IGBT)的步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="382" publication-number="202625019">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625019</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147738</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>訓練系統以及訓練方法</chinese-title>
        <english-title>TRAINING SYSTEM AND TRAINING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250320B">G06N3/08</main-classification>
        <further-classification edition="201901120250320B">G06N20/00</further-classification>
        <further-classification edition="202301120250320B">G06N3/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周開祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, KAI-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種訓練系統、訓練方法、內儲程式之非暫時性電腦可讀取記錄媒體以及非暫時性電腦程式產品；訓練系統包含人工智慧模組以及處理模組；處理模組經配置以執行：基於第一訓練集訓練人工智慧模組，以及執行驗證程序以確認人工智慧模組的一效能是否改善；響應於人工智慧模組的效能改善，確認人工智慧模組的多個參數是否包含凍結參數集，其中凍結參數集中的每一個的參數值變化滿足未變動條件；以及響應於該些參數包含凍結參數集，凍結前述凍結參數集並且基於第二訓練集訓練人工智慧模組，其中第二訓練集的元素數量大於第一訓練集的元素數量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A training system, a training method, a non-transitory computer readable recording medium with stored program, and a non-transitory computer program product; the training system comprising an artificial intelligence module and a processing module; the processing module being configured to perform: training of the artificial intelligence module based on a first training set, and a validation procedure to determine whether a performance of the artificial intelligence module has improved; in response to the improvement in the performance of the artificial intelligence module, determining whether a plurality of parameters of the artificial intelligence module comprise a frozen parameter set, wherein a change in a parameter value of each of the frozen parameter sets satisfies a no-change condition; and in response to the parameters comprising a frozen parameter set, freezing the aforementioned frozen parameter set and training the artificial intelligence module based on a second training set, wherein a number of the elements of the second training set is greater than a number of the elements of the first training set.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S401~S407:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="383" publication-number="202625124">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625124</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147739</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250227B">G09F9/30</main-classification>
        <further-classification edition="200601120250227B">G09G3/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙益聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JHAO, YI-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種顯示裝置，顯示裝置包括驅動電路基板、多個發光元件以及遮光圖案層。發光元件設置於驅動電路基板上，並且電性連接至驅動電路基板。遮光圖案層設置於驅動電路基板上，並且暴露出發光元件。遮光圖案層具有背對驅動電路基板的第一表面以及第二表面，且這些發光元件的至少兩者分別裸露於第一表面以及第二表面。第一表面以及驅動電路基板之間的距離小於第二表面以及驅動電路基板之間的距離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device which includes a driver circuit board, a plurality of light-emitting components and a light shielding pattern layer is provided. The light-emitting components are disposed on and electrically connected to the driver circuit board. The light shielding pattern layer is disposed on the driver circuit board and the light-emitting components are exposed. The light shielding pattern layer has a first surface and a second surface which back on to the driver circuit board, and at least two of the light-emitting components are exposed on the first surface and the second surface separately. The distance between the first surface and the driver circuit board is smaller than the distance between the second surface and the driver circuit board.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示裝置</p>
        <p type="p">110:驅動電路基板</p>
        <p type="p">120:發光元件</p>
        <p type="p">120t,130t:頂表面</p>
        <p type="p">130:接墊</p>
        <p type="p">140:遮光圖案層</p>
        <p type="p">140f:第一表面</p>
        <p type="p">140s:第二表面</p>
        <p type="p">150:光學膜片</p>
        <p type="p">170:接合材料</p>
        <p type="p">d1,d2,d3,d4:距離</p>
        <p type="p">s1,s2:間距</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="384" publication-number="202625068">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625068</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147740</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>檢驗設備異常的方法與裝置</chinese-title>
        <english-title>METHOD AND DEVICE FOR DETECTING ABNORMALITY OF AN APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120241231B">G06Q50/04</main-classification>
        <further-classification edition="200601120241231B">G01H1/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俞安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林冠瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, GUAN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳翰蕓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HAN-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種檢驗設備異常的方法與裝置。檢驗設備異常的裝置包含：記憶體與處理器。處理器用以載入記憶體之指令，以進行上述檢驗設備異常的方法。檢驗設備異常的方法包含：提供複數個設備之工作轉速頻率與工作功率；根據設備之零件的關鍵頻率來計算出零件之原始分數；根據設備之工作轉速頻率、工作功率、零件之原始分數來利用曲線擬合計算出一擬合模型；提供一目標設備之工作轉速頻率與工作功率；根據目標設備之零件之關鍵頻率來計算出零件之原始分數；根據目標設備之工作轉速頻率、工作功率、零件之原始分數來利用擬合模型計算出零件之評估分數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and a device for detecting abnormality of an apparatus are provided. The device for detecting apparatus abnormality includes a memory and a processor. The processor is configured to load instructions in the memory to perform the method for detecting apparatus abnormality. The method for detecting apparatus abnormality includes: providing plural working rotation speed frequencies and working powers of plural apparatuses; calculating original scores of plural parts of the apparatuses in accordance with critical frequencies of the parts of the apparatuses; calculating a fitting model by using curve fitting in accordance with the working rotation speed frequencies and the working powers of the apparatuses and the original scores of the parts of the apparatuses; providing a working rotation speed frequency and working power of a target apparatus; calculating an original score of a part of the target apparatus in accordance with a critical frequency of the part of the target apparatus; calculating an evaluation score of the part of the target apparatus by using the fitting model in accordance with the working rotation speed frequency and working power of the target apparatus and the original score of the part of the target apparatus.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:檢驗設備異常的方法</p>
        <p type="p">110~160:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="385" publication-number="202625853">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625853</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147741</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>接合裝置、方法以及程式產品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260316B">H10W72/50</main-classification>
        <further-classification edition="202601120260316B">H10W72/00</further-classification>
        <further-classification edition="202601120260316B">H10P72/70</further-classification>
        <further-classification edition="200601120260316B">G01B11/00</further-classification>
        <further-classification edition="201701120260316B">G06T7/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商雅馬哈智能機器股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAHA ROBOTICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野口勇一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOGUCHI, YUICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於抑制伴隨安裝高度的變化的安裝位置的偏離，實現安裝品質的提高。本發明包括：接合工具，安裝有攝像基準；第一攝像部，對安裝於所述接合工具的所述攝像基準進行拍攝；支撐構件，對所述接合工具以能夠沿上下方向驅動的方式進行支撐，並且對所述第一攝像部進行支撐；測定部，基於由所述第一攝像部拍攝到的圖像資料，對所述攝像基準在第一高度處的第一位置、及與所述第一高度不同的第二高度處的所述攝像基準的第二位置進行測定；以及檢測部，對所述第一位置與所述第二位置的第一相對位置進行檢測。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:晶圓保持部</p>
        <p type="p">20:處理單元</p>
        <p type="p">21:步進馬達</p>
        <p type="p">22:旋轉軸</p>
        <p type="p">23:臂</p>
        <p type="p">24:基座</p>
        <p type="p">24a:上表面</p>
        <p type="p">24b:下表面</p>
        <p type="p">25:拾取工具</p>
        <p type="p">30:接合頭部</p>
        <p type="p">31:Z軸驅動機構</p>
        <p type="p">32:接合工具</p>
        <p type="p">33:第一攝像部</p>
        <p type="p">34:XY工作台</p>
        <p type="p">40:接合載台部</p>
        <p type="p">50:接合控制部</p>
        <p type="p">51:測定部</p>
        <p type="p">52:檢測部</p>
        <p type="p">53:儲存部</p>
        <p type="p">54:安裝部</p>
        <p type="p">60:晶圓(wafer)</p>
        <p type="p">61:半導體晶片(chip)</p>
        <p type="p">70:基板</p>
        <p type="p">100:接合裝置</p>
        <p type="p">X、Y、Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="386" publication-number="202624862">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624862</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147742</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可達到動態發光效果之背光模組</chinese-title>
        <english-title>BACKLIGHT MODULE CAPABLE OF ACHIEVING DYNAMIC LIGHTING EFFECTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250325B">G02F1/13357</main-classification>
        <further-classification edition="200601120250325B">G02F1/29</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茂林光電科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLOBAL LIGHTING TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志恆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳健君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIEN-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李江衍廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI JIANG, YAN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許祐誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YU-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴威廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, WEI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范　長安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PHAM, TRUONG-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃信嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝煒勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可達到動態發光效果之背光模組，包含導光板，具有入光側且上或下表面設有排列形成網點圖案之指向性網點，指向性網點為紡錘狀凹陷結構而呈朝一長軸及一短軸方向延伸之狀態，其長度為X，寬度為Y，且        &lt;img align="absmiddle" height="41px" width="49px" file="ed10012.JPG" alt="ed10012.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，指向性網點於長軸方向截面的側壁邊線與垂直線夾角為80±5度，於短軸方向截面的側壁邊線與垂直線夾角為50±5度；發光二極體，對應入光側設置且相對導光板形成不同入射光角度；時序控制電路電性連接發光二極體。其中發光二極體受時序控制電路驅動點亮時，指向性網點因應不同方向入光而產生不同亮度，使網點圖案形成動態發光效果。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A backlight module capable of achieving dynamic lighting effects is disclosed. The backlight module includes a light guide plate with a light incident side and either its upper or lower surface is equipped with a plurality of directional dots arranged to form a dot pattern. The directional dots are spindle-shaped recessed structures extending along a major axis and a minor axis. The length of the directional dots is denotes as X, the width is Y, with a ratio of        &lt;img align="absmiddle" height="48px" width="55px" file="ed10013.JPG" alt="ed10013.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;. The sidewall edges of the directional dots form an angle of 80±5 degrees with the vertical line in the cross-section along the major axis and 50±5 degrees in the cross-section along the minor axis. The module also includes light-emitting diodes (LEDs) positioned corresponding to the light incident side, creating various incident light angles relative to the light guide plate, and a timing control circuit electrically connected to the LEDs. When the LEDs are driven and illuminated by the timing control circuit, the directional dots respond to light entering from different directions by exhibiting varying brightness, thereby enabling the dot pattern to produce a dynamic lighting effect.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:背光模組</p>
        <p type="p">10:導光板</p>
        <p type="p">101:入光側</p>
        <p type="p">102:指向性網點</p>
        <p type="p">11:發光二極體</p>
        <p type="p">12:時序控制電路</p>
        <p type="p">P:網點圖案</p>
        <p type="p">A:長軸方向</p>
        <p type="p">B:短軸方向</p>
        <p type="p">θ&lt;sub&gt;1&lt;/sub&gt;:指向性網點於長軸方向之截面的側壁邊線與垂直線夾角</p>
        <p type="p">θ&lt;sub&gt;2&lt;/sub&gt;:指向性網點於短軸方向之截面的側壁邊線與垂直線夾角</p>
        <p type="p">X:指向性網點之長度</p>
        <p type="p">Y:指向性網點之寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="387" publication-number="202625341">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625341</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147744</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>車用輪轂馬達之止轉元件及車用輪轂馬達</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">H02K21/24</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李書賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李書賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃信嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝煒勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種車用輪轂馬達之止轉元件及車用輪轂馬達結構，止轉元件供以設於車用輪轂馬達結構之定子組並包含本體、軸孔及凸肋，以分攤削減車架端部U型槽施予穿設於定子組之固定軸之受力負擔。本體具有相對設置之一第一側及一第二側，第一側係朝向定子組；軸孔設於本體之中心位置，以供固定軸穿過；凸肋設於第二側，供靠抵於車架端部U型槽，其中，凸肋之寬度為X，通過固定軸軸心之最小寬度為Y，車架端部U型槽之寬度為Z，且符合Y＜X≦Z。定子組大致由繞線結構與通道結構組成，通道結構連通於繞線結構中間位置。其中，止轉元件可與通道結構為分離式或一體成型結構態樣。如此透過止轉元件，即可減緩固定軸於馬達作動時與車架碰撞而旋轉位移或受損斷裂，進而有效延長馬達使用壽命。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:止轉元件</p>
        <p type="p">10:本體</p>
        <p type="p">101:第一側</p>
        <p type="p">102:第二側</p>
        <p type="p">11:軸孔</p>
        <p type="p">12:凸肋</p>
        <p type="p">13:穿線槽</p>
        <p type="p">14:第一組裝結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="388" publication-number="202624868">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624868</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147745</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250124B">G02F1/153</main-classification>
        <further-classification edition="200601120250124B">G09F9/33</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅唯菘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, WEI-SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚怡安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, I-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露公開一種電子裝置，包括一第一鏡面顯示器、一第二鏡面顯示器以及一反射元件。第二鏡面顯示器相鄰於第一鏡面顯示器設置；反射元件設置於第一鏡面顯示器與第二鏡面顯示器之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses an electronic device, which includes a first mirror display unit, a second mirror display unit, and a reflective element. The first mirror display unit and the second mirror display unit are disposed adjacent to each other. The reflective element is disposed between the first mirror display unit and the second mirror display unit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電子裝置</p>
        <p type="p">20:第一鏡面顯示器</p>
        <p type="p">21,31:第一基板</p>
        <p type="p">22,32:第二基板</p>
        <p type="p">23,33:發光單元</p>
        <p type="p">23a,23b,23c,33a,33b,33c:發光元件</p>
        <p type="p">24,34:反射層</p>
        <p type="p">25,35:吸光層</p>
        <p type="p">26,36:黏著層</p>
        <p type="p">30:第二鏡面顯示器</p>
        <p type="p">40:反射元件</p>
        <p type="p">D,d2:寬度</p>
        <p type="p">d1,d4,d5:距離</p>
        <p type="p">O1,O2:開口</p>
        <p type="p">W1,W2:寬度</p>
        <p type="p">X:第一方向</p>
        <p type="p">Y:第二方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="389" publication-number="202625666">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625666</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147746</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示面板及其製造方法</chinese-title>
        <english-title>DISPLAY PANEL AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120241223B">H10K59/80</main-classification>
        <further-classification edition="202301120241223B">H10K59/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙益聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JHAO, YI-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示面板包括基板、多個發光元件、不透光膠層以及第一透光膠層。這些發光元件設置於基板的第一面。不透光膠層位於基板的第一面之上且覆蓋一部分的這些發光元件的多個側面。第一透光膠層位於基板的第一面之上且連接不透光膠層。第一透光膠層覆蓋另一部分的這些發光元件的多個側面。不透光膠層包括連接第一透光膠層的斜面段，斜面段的長度介於0.1公厘至2公厘之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The display panel includes a substrate, a plurality of light emitting elements, an opaque adhesive layer and a first translucent adhesive layer. The plurality of light emitting elements is disposed on a first side of the substrate. The opaque adhesive layer is disposed on the first side of the substrate and covers a plurality of side surfaces of part of the plurality of light emitting elements. The first translucent adhesive layer is disposed on the first side of the substrate and is connected to the opaque adhesive layer. The first translucent adhesive layer covers a plurality of side surfaces of another part of the plurality of light emitting elements. The opaque adhesive layer includes a slope segment connected to the first translucent adhesive layer, and a length of the slope segment is between 0.1 mm to 2 mm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示面板</p>
        <p type="p">110:基板</p>
        <p type="p">112:第一面</p>
        <p type="p">120:發光元件</p>
        <p type="p">122:頂面</p>
        <p type="p">124:側面</p>
        <p type="p">130:不透光膠層</p>
        <p type="p">132:斜面段</p>
        <p type="p">134:第二面</p>
        <p type="p">136:第三面</p>
        <p type="p">140:第一透光膠層</p>
        <p type="p">142:邊緣</p>
        <p type="p">150:第二透光膠層</p>
        <p type="p">152:邊緣</p>
        <p type="p">154:斜面段</p>
        <p type="p">160、190:接墊</p>
        <p type="p">170:阻水膠</p>
        <p type="p">h1:凸起高度</p>
        <p type="p">h2:凹陷深度</p>
        <p type="p">h3:高度</p>
        <p type="p">h4、h5:距離</p>
        <p type="p">h6:厚度</p>
        <p type="p">L1、L2:長度</p>
        <p type="p">TP:穿透區</p>
        <p type="p">UTP:非穿透區</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="390" publication-number="202624599">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624599</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147748</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>針對需用機械式螺紋鎖接之可快速判斷是否被鎖緊的鋼筋續接器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250217B">E04C5/16</main-classification>
        <further-classification edition="200601120250217B">F16B7/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倍適得有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王嘉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種針對需用機械式螺紋鎖接之可快速判斷是否被鎖緊的鋼筋續接器，包括第一續接部及第二續接部。第一續接部包括第一端部、第二端部及固定部，第一續接部的第一端部與固定部的相接處的外側開設第一溝槽，使得第一續接部的第一端部與固定部的相接處的厚度小於第一續接部的第一端部的厚度和固定部的厚度。第二續接部包括第一端部及第二端部，第二續接部的第一端部穿過第一續接部的第一端部並且固定於固定部中。藉此，監造管理人員可快速經由目視觀察第一續接部的第一端部與固定部的相接處是否斷裂並分離，藉此判斷鋼筋續接器是否鎖緊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:第一續接部</p>
        <p type="p">11:第一端部</p>
        <p type="p">111:穿孔</p>
        <p type="p">12:第二端部</p>
        <p type="p">121:穿孔</p>
        <p type="p">13:固定部</p>
        <p type="p">131,132:螺孔</p>
        <p type="p">133:通孔</p>
        <p type="p">14,14A:相接處</p>
        <p type="p">15:第一溝槽</p>
        <p type="p">20:第二續接部</p>
        <p type="p">21:第一端部</p>
        <p type="p">22:第二端部</p>
        <p type="p">100:鋼筋</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="391" publication-number="202624996">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624996</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147749</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於蜜餌的攻擊轉移與告警系統</chinese-title>
        <english-title>ATTACK TRANSFERRING AND ALARMING SYSTEM BASED ON HONEY TOKEN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120250303B">G06F21/55</main-classification>
        <further-classification edition="201301120250303B">G06F21/50</further-classification>
        <further-classification edition="202201120250303B">H04L9/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雲首博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUN, SPOU-BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃秀娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HSIU-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周國森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, KUO-SEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種基於蜜餌的攻擊轉移與告警系統。所述系統包括蜜餌生成模組、蜜罐封裝模組、蜜餌事件告警通報模組以及蜜罐日誌收容與行為分析模組。蜜餌生成模組生成對應於特徵碼的蜜餌。蜜罐封裝模組對蜜罐執行封裝操作，其中蜜罐對應於蜜餌，其中蜜罐包括日誌。當蜜餌被攻擊者裝置存取時，蜜餌事件告警通報模組將攻擊者裝置轉移至蜜罐，並且蜜餌事件告警通報模組發佈對應於特徵碼的告警通報，並且蜜罐日誌收容與行為分析模組利用日誌來分析攻擊者行為。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An attack transferring and alarming system based on honey token is provided. The system includes a honey token generation module, a honey pot packaging module, a honey token event alarm reporting module, and a honey pot log containment and behavior analysis module. The honey token generation module generates a honey token corresponding to a feature code. The honey pot packaging module performs a packaging operation on a honey pot, wherein the honey pot corresponds to the honey token, and the honey pot includes a log. When the honey token is accessed by an attacker device, the honey token event alarm reporting module transfers the attacker device to the honey pot, and the honey token event alarm reporting module issues an alarm notification corresponding to the feature code, and the honey pot log containment and behavior analysis module uses the log to analyze an attacker behavior.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基於蜜餌的攻擊轉移與告警系統</p>
        <p type="p">110:蜜餌生成模組</p>
        <p type="p">120:蜜罐封裝模組</p>
        <p type="p">130:蜜餌事件告警通報模組</p>
        <p type="p">140:蜜罐日誌收容與行為分析模組</p>
        <p type="p">150:攻擊威脅產出模組</p>
        <p type="p">160:攻擊威脅資訊庫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="392" publication-number="202625010">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625010</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147750</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於生成式大語言模型的任務型對話系統及方法</chinese-title>
        <english-title>TASK-ORIENTED DIALOGUE SYSTEM AND METHOD BASED ON GENERATIVE LARGE LANGUAGE MODEL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250303B">G06F40/56</main-classification>
        <further-classification edition="202001120250303B">G06F40/30</further-classification>
        <further-classification edition="202001120250303B">G06F40/20</further-classification>
        <further-classification edition="201901120250303B">G06F16/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪國竣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, KUO-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊富丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, FU-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種基於生成式大語言模型的任務型對話系統及方法。所述方法包括以下步驟：建立對應於參數定義的參數回傳格式定義描述，並且建立對應於參數定義的提示詞；利用提示詞以及生成式大語言模型來從對話歷程資料提取結構化資料，其中對話歷程資料對應於任務型對話，其中結構化資料包括參數定義，且結構化資料包括參數回傳格式定義描述的數值；利用結構化資料來建立回應語句範例；以及從生成式大語言模型接收對應於回應語句範例、驗證規則以及結構化資料的回應語句。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A task-oriented dialogue system and method based on generative large language model are provided. The method includes following steps: establishing a parameter-return-format-definition-description corresponding to a parameter definition, and establishing a prompt corresponding to the parameter definition; using the prompt and a generative large language model to extract structured data from dialogue history data, wherein the dialogue history data corresponds to a task-oriented dialogue, wherein the structured data includes the parameter definition, and the structured data includes a value of the parameter-return-format-definition-description; using the structured data to build a response sentence example; and receiving a response sentence corresponding to the response sentence example, a validation rule, and the structured data from the generative large language model.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S61、S62、S63、S64:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="393" publication-number="202623761">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623761</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147752</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>呼吸狀態辨識與調整系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">A61B5/0205</main-classification>
        <further-classification edition="200601120241231B">A61B5/113</further-classification>
        <further-classification edition="201801120241231B">G16H50/20</further-classification>
        <further-classification edition="202201120241231B">G06V40/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳　敏莉 臺東縣東河鄉都蘭村27鄰187 號</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳　敏莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳友炘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種呼吸狀態辨識與調整系統，其包含一呼吸狀態辨識系統、一呼吸狀態調整系統、一系統資料庫與一伺服器。呼吸狀態辨識系統用以針對一使用者的一呼吸狀態進行即時的辨識與監控，並判斷呼吸狀態是否符合一預設狀態。呼吸狀態調整系統，用以當呼吸狀態辨識系統判斷呼吸狀態未符合預設值時，由呼吸狀態調整系統介入調整使用者之呼吸狀態。系統資料庫與伺服器用以儲存、管理使用者之呼吸狀態及預設狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:呼吸狀態辨識與調整系統</p>
        <p type="p">200:呼吸狀態辨識系統</p>
        <p type="p">300:呼吸狀態調整系統</p>
        <p type="p">400:系統資料庫</p>
        <p type="p">500:伺服器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="394" publication-number="202624713">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624713</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147753</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種加速材料氣體浸潤的裝置及其方法</chinese-title>
        <english-title>APPARATUS AND METHOD FOR ACCELERATING GAS INFILTRATION INTO MATERIALS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250512B">G01N1/31</main-classification>
        <further-classification edition="200601120250512B">G01N13/04</further-classification>
        <further-classification edition="201901120250512B">G01N33/20</further-classification>
        <further-classification edition="200601120250512B">G01N3/10</further-classification>
        <further-classification edition="200601120250512B">G01N7/16</further-classification>
        <further-classification edition="200601120250512B">G05B13/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉宗榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, ZONG RONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡修安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, HSIU-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種加速材料氣體浸潤的裝置及其方法，包括：儲存單元，係用以儲存至少一氣體；加壓單元，連接於該儲存單元並輸入該些氣體至該加壓單元，且該加壓單元對該些氣體進行增壓；反應單元，連接於該儲存單元及該加壓單元，該反應單元用於容置待測材料；第一閥，連接於該儲存單元與該反應單元之間；加熱器，連接至反應單元，可設定溫度並輸入熱能至反應單元；以及第二閥，連接於該儲存單元、該加壓單元及該反應單元之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus and method for accelerating gas infiltration into materials comprises: a storage unit for storing at least one type of gas; a pressurization unit connected to the storage unit, configured to receive the gases and pressurize them; a reaction unit connected to both the storage unit and the pressurization unit, is used to contain the material; a first valve positioned between the storage unit and the reaction unit; a heater connected to the reaction unit, capable of setting the temperature and supplying heat energy to the reaction unit; and a second valve connected among the storage unit, the pressurization unit, and the reaction unit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:儲存單元</p>
        <p type="p">20:加壓單元</p>
        <p type="p">30:反應單元</p>
        <p type="p">40:待測材料</p>
        <p type="p">50:加熱器</p>
        <p type="p">60:壓力感測模組</p>
        <p type="p">70:溫度感測模組</p>
        <p type="p">80:第一閥</p>
        <p type="p">90:第二閥</p>
        <p type="p">100:第一壓力調節器</p>
        <p type="p">110:第二壓力調節器</p>
        <p type="p">120:第三壓力調節器</p>
        <p type="p">130:控制系統</p>
        <p type="p">140:排氣系統</p>
        <p type="p">150:第四壓力調節器</p>
        <p type="p">160:第三閥</p>
        <p type="p">170:第五壓力調節器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="395" publication-number="202623956">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623956</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147754</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可調及緩衝功能之管材夾具</chinese-title>
        <english-title>ADJUSTABLE AND CUSHIONING CLAMP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">B25B1/20</main-classification>
        <further-classification edition="200601120241230B">B23Q3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施威任</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, WEI JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪旭承</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON, XU-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林原誌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SLIN, YUAN CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳永成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YUNG CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可調及緩衝功能之管材夾具，包括有基座、定位面、複數個夾持器以及複數個固定器。基座，具有複數個凹槽；定位面，位於該基座的中央處；複數個夾持器，該些夾持器設置於該基座的該些凹槽，該些夾持器之側面設覆有一彈性元件；以及複數個固定器，設置於該基座的周邊緣處，每一固定器具有支撐元件、調節桿以及彈性元件，該支撐元件的外部設置有該調節桿， 並該支撐元件之內部設置有該彈性元件。其中，該管材固定並抵靠於該基座， 並該些夾持器將該管材由內往外撐。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention provides an adjustable and cushioning clamp, comprising a base, a positioning surface, multiple fixtures, and multiple fasteners. The base has multiple grooves, and the positioning surface is located at the center of the base. The multiple fixtures are arranged in the grooves of the base, and the multiple fasteners are located around the perimeter of the base, and the sides of the fixtures are covered with an elastic element. Each fastener includes a supporting element, an adjusting rod, and an elastic component. The adjusting rod is mounted on the exterior of the supporting element, and the elastic component is placed inside the supporting element. The pipe is fixed and rests against the base, while the fixtures support the pipe from the inside out.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:可調及緩衝功能之管材夾具</p>
        <p type="p">10:基座</p>
        <p type="p">20:夾持器</p>
        <p type="p">30:定位面</p>
        <p type="p">40:固定器</p>
        <p type="p">50:凹槽</p>
        <p type="p">60:調節桿</p>
        <p type="p">70:調整元件</p>
        <p type="p">80:彈性元件</p>
        <p type="p">90:力學感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="396" publication-number="202623992">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623992</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147755</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種複合管材密封及縮徑結構</chinese-title>
        <english-title>A COMPOSITE PIPE SEALING AND DIAMETER-REDUCING STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">B29C70/28</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施威任</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, WEI JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪旭承</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON, XU-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林原誌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SLIN, YUAN CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳永成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YUNG CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種複合管材密封及縮徑結構，包括：套管、第一管材以及第二管材。套管具有外套管以及中間環，第一管材的第一外螺紋段插入該外套管的第一內螺紋段以螺接固定，第二管材的第二外螺紋段插入該外套管的第二內螺紋段以螺接固定；其中，該套管的口徑從該第一外套管朝向該第二外套管方向而漸縮， 並該中間環斜向連接具有不同口徑之該第一管材以及該第二管材，從而銜接並密封兩個不同口徑之管材。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention provides a composite pipe diameter-reducing structure, comprising a reducing sleeve, a first pipe, and a second pipe. The reducing sleeve includes a sleeve and an intermediate ring. The first threaded section of the first pipe is inserted into the first threaded section of the sleeve and secured by threaded connection, while the second threaded section of the second pipe is inserted into the second threaded section of the sleeve and similarly secured by threaded connection. The diameter of the reducing sleeve tapers gradually from the first sleeve toward the second sleeve, with the intermediate ring connecting the first pipe and the second pipe at an angle,        &lt;br/&gt;&lt;br/&gt;accommodating their differing diameters. This configuration effectively joins two pipes of different diameters.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:複合管材密封及縮徑結構</p>
        <p type="p">10:套管</p>
        <p type="p">20:第一管材</p>
        <p type="p">30:第二管材</p>
        <p type="p">40:外套管</p>
        <p type="p">50:中間環</p>
        <p type="p">60:斜面</p>
        <p type="p">70:第一內螺紋段</p>
        <p type="p">80:第二內螺紋段</p>
        <p type="p">90:第一外螺紋段</p>
        <p type="p">100:第二外螺紋段</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="397" publication-number="202625300">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625300</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147758</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可調變式指向型天線模組</chinese-title>
        <english-title>ADJUSTABLE DIRECTIONAL ANTENNA MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241213B">H01Q21/29</main-classification>
        <further-classification edition="200601120241213B">H01Q3/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佳邦科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INPAQ TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳師鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHI-PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏劭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, BOSHAU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可調變式指向型天線模組。可調變式指向型天線模組包括一第一承載基板、一第二承載基板、一訊號控制晶片、一共用導電結構以及多個天線結構。第一承載基板與第二承載基板可以相互配合，以使得第一承載基板與第二承載基板呈現相互交叉設置。訊號控制晶片設置在第一承載基板上。共用導電結構設置在第一承載基板上。每一個天線結構設置在第一承載基板上或者第二承載基板上。多個天線結構電性連接於共用導電結構與訊號控制晶片之間。藉此，當訊號控制晶片被配置以控制電壓是否允許通過多個天線結構中的至少一者時，可調變式指向型天線模組所產生的輻射場型可以依據使用者的可攜式電子裝置的使用方位或者位置而被調整。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides an adjustable directional antenna module. The adjustable directional antenna module includes a first carrier substrate, a second carrier substrate, a signal control chip, a common conductive structure and a plurality of antenna structures. The first carrier substrate and the second carrier substrate can cooperate with each other, so that the first carrier substrate and the second carrier substrate are arranged crosswise with each other. The signal control chip is disposed on the first carrier substrate. The common conductive structure is disposed on the first carrier substrate. Each antenna structure is disposed on the first carrier substrate or the second carrier substrate. The plurality of antenna structures are electrically connected between the common conductive structure and the signal control chip. Thereby, when the signal control chip is configured to control whether voltage is allowed to pass through at least one of the plurality of antenna structures, the radiation field pattern generated by the adjustable directional antenna module can be adjusted according to the orientation or position of the user's portable electronic device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">M:可調變式指向型天線模組</p>
        <p type="p">1:第一承載基板</p>
        <p type="p">101:第一配合部</p>
        <p type="p">102:第一插入部</p>
        <p type="p">11:第一導電線路層</p>
        <p type="p">12:第二導電線路層</p>
        <p type="p">13:第五導電線路層</p>
        <p type="p">14:正面導電線路層</p>
        <p type="p">15:背面導電線路層</p>
        <p type="p">2:第二承載基板</p>
        <p type="p">201:第二配合部</p>
        <p type="p">202:第二插入部</p>
        <p type="p">21:第三導電線路層</p>
        <p type="p">22:第四導電線路層</p>
        <p type="p">23:第一跨接線路層</p>
        <p type="p">24:第二跨接線路層</p>
        <p type="p">3:訊號控制晶片</p>
        <p type="p">4:共用導電結構</p>
        <p type="p">40:導電貫穿結構</p>
        <p type="p">401:第一墊接區域</p>
        <p type="p">41:導引部</p>
        <p type="p">42:漸擴部</p>
        <p type="p">43:凸出部</p>
        <p type="p">5:第一天線結構</p>
        <p type="p">51:第一本體部</p>
        <p type="p">52:第一垂直延伸部</p>
        <p type="p">53:第一水平延伸部</p>
        <p type="p">6:第二天線結構</p>
        <p type="p">61:第二本體部</p>
        <p type="p">62:第二垂直延伸部</p>
        <p type="p">63:第二水平延伸部</p>
        <p type="p">7:第三天線結構</p>
        <p type="p">71:第三本體部</p>
        <p type="p">72:第三垂直延伸部</p>
        <p type="p">73:第三水平延伸部</p>
        <p type="p">8:第四天線結構</p>
        <p type="p">81:第四本體部</p>
        <p type="p">82:第四垂直延伸部</p>
        <p type="p">83:第四水平延伸部</p>
        <p type="p">9:訊號饋入結構</p>
        <p type="p">G:接地結構</p>
        <p type="p">G11:主體部</p>
        <p type="p">G12:漸縮部</p>
        <p type="p">G13:延伸部</p>
        <p type="p">L1:第一電感元件</p>
        <p type="p">L2:第二電感元件</p>
        <p type="p">L3:第三電感元件</p>
        <p type="p">L4:第四電感元件</p>
        <p type="p">L5:第五電感元件</p>
        <p type="p">D1:第一二極體元件</p>
        <p type="p">D2:第二二極體元件</p>
        <p type="p">D3:第三二極體元件</p>
        <p type="p">D4:第四二極體元件</p>
        <p type="p">R1:第一電阻元件</p>
        <p type="p">R2:第二電阻元件</p>
        <p type="p">R3:第三電阻元件</p>
        <p type="p">R4:第四電阻元件</p>
        <p type="p">E1:第一跨接電子元件</p>
        <p type="p">E2:第二跨接電子元件</p>
        <p type="p">E3:第三跨接電子元件</p>
        <p type="p">E4:第四跨接電子元件</p>
        <p type="p">E5:第五跨接電子元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="398" publication-number="202624788">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624788</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147759</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>偵測方法、處理裝置及電子裝置</chinese-title>
        <english-title>DETECTION METHOD, A PROCESSING DEVICE, AND AN ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">G01S13/66</main-classification>
        <further-classification edition="200601120250303B">G01S7/41</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>啟碁科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WNC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冠賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, GUAN-SIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宥安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳銘杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MING-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種偵測方法、處理裝置及電子裝置。雷達掃描器於第一模式時，處理器能依據雷達掃描器產生的雷達回波資訊，判斷於預設範圍中，是否出現待追蹤物。若判定無，則使雷達掃描器保持在第一模式。若判定出現待追蹤物，則使雷達掃描器切換至第二模式，並利用多筆雷達回波資訊判斷待追蹤物的移動軌跡是否符合多個預設軌跡之一。若判定不符合，則判斷待追蹤物是否符合多種預設需監控狀態中之一。若判定符合，則使雷達掃描器保持在第二模式，反之，則使雷達掃描器切換至第一模式。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a detection method, a processing device, and an electronic device. When the radar scanner is in a first mode, the processor can determine, based on radar echo information generated by the radar scanner, whether an object to be tracked appeared within a preset range . If there is no object to be tracked, the radar scanner remains in the first mode. If the object to be tracked is present, the radar scanner switches to a second mode, and the processor determines whether the movement trajectory of the object to be tracked matches one of the multiple preset trajectories using radar echo information. If the trajectory does not match, the processor further determines whether the object to be tracked meets one of several preset monitoring states. If the object to be tracked meets one of the preset monitoring states, the radar scanner remains in the second mode. Conversely, if the object to be tracked does not meet the states, the radar scanner switches back to the first mode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:狀態改變判斷步驟</p>
        <p type="p">SX:保持步驟</p>
        <p type="p">SY:通知步驟</p>
        <p type="p">S2:模式切換步驟</p>
        <p type="p">S3:軌跡判斷步驟</p>
        <p type="p">S4:監控判斷步驟</p>
        <p type="p">S5:切換步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="399" publication-number="202625798">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625798</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147761</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體元件及其製作方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W20/00</main-classification>
        <further-classification edition="202601120260302B">H10W20/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊宗祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, TSUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡成宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHENG-TZUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉遠智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YUAN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江昌達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHANG-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種製作半導體元件的方法，其主要先形成一金屬間介電層於一基底上以及一金屬內連線於該金屬間介電層內，然後形成一介電層於該金屬間介電層上，圖案化該介電層以形成一開口，形成一接觸墊於該開口內，再形成一保護層於該接觸墊上，其中該接觸墊頂表面包含一第一曲面而接觸墊側壁則包含一第二曲面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for fabricating a semiconductor device includes the steps of first forming an inter-metal dielectric ((IMD) layer on a substrate and a metal interconnection in the IMD layer, forming a dielectric layer on the IMD layer, patterning the dielectric layer to form an opening, forming a bonding pad in the opening, and then forming a passivation layer on the bonding pad. Preferably, a top surface of the bonding pad includes a first curve and a sidewall of the bonding pad includes a second curve.</p>
      </isu-abst>
      <representative-img>
        <p type="p">12:基底</p>
        <p type="p">14:金屬間介電層</p>
        <p type="p">16:金屬內連線</p>
        <p type="p">18:介電層</p>
        <p type="p">20:介電層</p>
        <p type="p">22:介電層</p>
        <p type="p">28:接觸墊</p>
        <p type="p">30:保護層</p>
        <p type="p">32:第一保護層</p>
        <p type="p">34:第二保護層</p>
        <p type="p">36:第三保護層</p>
        <p type="p">38:曲面</p>
        <p type="p">42:區域</p>
        <p type="p">44:區域</p>
        <p type="p">46:開口</p>
        <p type="p">48:粗糙表面</p>
        <p type="p">50:平滑表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="400" publication-number="202624655">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624655</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147762</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氣閥櫃以及電控箱</chinese-title>
        <english-title>GAS VALVE CABINET AND ELECTRIC CONTROL BOX</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">F17C13/04</main-classification>
        <further-classification edition="200601120241230B">F17C13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯宸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APEX UNION TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝承甫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEN, CHENG PU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露了一種氣閥櫃以及電控箱。氣閥櫃包括一電控箱以及一氣閥箱。電控箱包括一第一箱體單元、多個控制單元、多個基板單元以及一無線通訊單元。第一箱體單元具有一第一容置空間。多個控制單元設置於第一容置空間中。多個基板單元分別連接於其中一控制單元。無線通訊單元設置於第一箱體單元且連接控制單元。氣閥箱包括第二箱體單元、多個管路單元以及多個感測單元。第二箱體單元具有一第二容置空間且鄰近於第一箱體單元。多個管路單元設置於第二容置空間，至少一管路單元穿設於第二箱體單元。多個感測單元設置於多個管路單元且連接於至少一控制單元，每一感測單元被配置成用於偵測其中一管路單元所傳輸的氣體的流量或壓力，以產生至少一感知訊號。至少一無線通訊單元被配置成用於將至少一感知訊號傳送到至少一外部設備。藉此，本發明之氣閥櫃以及電控箱可提升實用性及便利性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A gas valve cabinet and an electric control box are disclosed. The gas valve cabinet includes an electric control box and a gas valve box. The electric control box includes a first box unit, a plurality of control units, a plurality of substrate units and a wireless communication unit. The first box unit has a first accommodation space. The plurality of control units are disposed in the first accommodation space. The plurality of substrate units are respectively connected to one of the plurality of control units. The wireless communication unit is installed in the first box unit and connected to the plurality of control units. The valve box includes a second box unit, a plurality of pipeline units and a plurality of sensing units. The second box unit has a second accommodation space and is adjacent to the first box unit. The plurality of pipeline units are disposed in the second accommodation space, and at least one of the plurality of pipeline units is disposed through the second box unit. The plurality of sensing units are disposed on the plurality of pipeline units and connected to at least one of the plurality of control units. Each of the plurality of sensing units is configured to detect the flow rate or pressure of the gas transmitted by one of the plurality of pipeline units to generate at least one sensing signal. The wireless communication unit is configured to transmit the at least one sensing signal to at least one external device. By means of the present disclosure, the gas valve cabinet and the electric control box can improve the practicality and convenience.</p>
      </isu-abst>
      <representative-img>
        <p type="p">Z:氣閥櫃</p>
        <p type="p">D:電控箱</p>
        <p type="p">D1:第一箱體單元</p>
        <p type="p">D11:頂表面</p>
        <p type="p">D13:前側面</p>
        <p type="p">D15:左側面</p>
        <p type="p">D16:右側面</p>
        <p type="p">D4:無線通訊單元</p>
        <p type="p">D6:人機介面單元</p>
        <p type="p">G:氣閥箱</p>
        <p type="p">G1:第二箱體單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="401" publication-number="202624565">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624565</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147763</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鍍覆裝置之氣泡去除方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">C25D21/04</main-classification>
        <further-classification edition="200601120260128B">C25D17/00</further-classification>
        <further-classification edition="200601120260128B">C25D17/06</further-classification>
        <further-classification edition="200601120260128B">C25D7/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商荏原製作所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EBARA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平久保華子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRAKUBO, HANAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芹沢祐太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SERIZAWA, YUTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳傳岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾文岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">［課題］本發明提供一種可抑制導因於氣泡而基板之鍍覆品質惡化的技術。        &lt;br/&gt;［解決手段］鍍覆裝置之氣泡去除方法包含：進行將陽極室之壓力設為比陰極室之壓力還高，藉此使隔膜突出於上方，而在隔膜突出於上方之部位的下面集中氣泡的第一處理；進行將陰極室之壓力設為比陽極室之壓力還高，使隔膜突出於下方，而使氣泡移動至隔膜之外周緣的第二處理；及進行使配置於陽極室的陽極液排出口吸入移動至隔膜外周緣之氣泡，並使其從陽極室排出之第三處理。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:鍍覆槽</p>
        <p type="p">11:底壁</p>
        <p type="p">12:外周壁</p>
        <p type="p">13:陽極室</p>
        <p type="p">14:陰極室</p>
        <p type="p">30:基板固持器</p>
        <p type="p">40:旋轉機構</p>
        <p type="p">45:升降機構</p>
        <p type="p">46:支柱</p>
        <p type="p">60:陽極</p>
        <p type="p">61:隔膜</p>
        <p type="p">70:陽極液循環裝置</p>
        <p type="p">73:陽極液循環管線</p>
        <p type="p">74:陽極液泵浦</p>
        <p type="p">75:貯存槽</p>
        <p type="p">78a,78b:流量調整閥</p>
        <p type="p">80:陰極液循環裝置</p>
        <p type="p">83:陰極液循環管線</p>
        <p type="p">84:陰極液泵浦</p>
        <p type="p">85:貯存槽</p>
        <p type="p">88a,88b:流量調整閥</p>
        <p type="p">400:鍍覆模組</p>
        <p type="p">800:控制模組</p>
        <p type="p">801:處理器</p>
        <p type="p">802:記憶裝置</p>
        <p type="p">1000:鍍覆裝置</p>
        <p type="p">Ps1:陽極液</p>
        <p type="p">Ps2:陰極液</p>
        <p type="p">Wf:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="402" publication-number="202624927">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624927</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147764</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>控制電路及控制方法</chinese-title>
        <english-title>CONTROL CIRCUIT AND CONTROL METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250526B">G06F1/26</main-classification>
        <further-classification edition="200601120250526B">G06F11/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新唐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張恒愷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HEN-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種控制電路，包括複數處理電路以及一運算電路。運算電路偵測處理電路是否被開啟，並包括一機器學習模型。機器學習模型根據一功耗輪廓，預測被開啟的處理電路的一總功耗值。當總功耗值大於一臨界值時，運算電路調整被開啟的處理電路的運作狀態，用以減少總功耗值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A control circuit including a plurality of processor circuits and a calculation circuit is provided. The calculation circuit detects which processor circuits are turned on and includes a machine learning model. The machine learning model predicts a total power-consumption value of the turned-on processor circuits according to a power-consumption profile. When the total power-consumption value of the turned-on processor circuits is higher than a threshold value, the calculation circuit adjusts the behaviors of the turned-on processor circuits to reduce the total power-consumption value of the turned-on processor circuits.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:控制電路</p>
        <p type="p">IP1~IPn、140:處理電路</p>
        <p type="p">110:運算電路</p>
        <p type="p">111:機器學習模型</p>
        <p type="p">112:處理器</p>
        <p type="p">120:連接電路</p>
        <p type="p">130:驅動電路</p>
        <p type="p">131:電源供應電路</p>
        <p type="p">132:時脈產生電路</p>
        <p type="p">150、160:儲存電路</p>
        <p type="p">PW1~PWn:操作電壓</p>
        <p type="p">CK1~CKn:操作頻率</p>
        <p type="p">EN1~ENn:暫存器</p>
        <p type="p">SA:調整信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="403" publication-number="202624975">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624975</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147765</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>控制晶片、控制系統及方法</chinese-title>
        <english-title>CONTROL CHIP, SYSTEM AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250526B">G06F13/38</main-classification>
        <further-classification edition="200601120250526B">G06F13/10</further-classification>
        <further-classification edition="200601120250526B">G06F11/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新唐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, ZONG-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種控制晶片，耦接一外部晶片，並包括一介面控制電路、一第一記憶體、一第二記憶體以及一處理電路。介面控制電路根據一傳輸設定值，輸出資料予外部晶片。第一記憶體用以儲存一效能狀態以及一介面設定值。第二記憶體用以儲存一預設資料。處理電路根據效能狀態、介面設定值以及預設資料，動態地調整傳輸設定值，用以改變介面控制電路的傳輸效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A control chip coupled to an external chip and including an interface control circuit, a first memory, a second memory, and a processing circuit is provided. The interface control circuit outputs data to the external chip according to a transmission setting. The first memory stores a performance status and an interface setting. The second memory stores predetermined data. The processing circuit dynamically adjusts the transmission efficiency of the interface control circuit according to the performance status, the interface setting and the predetermined data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:晶片</p>
        <p type="p">205:調整電路</p>
        <p type="p">210:處理電路</p>
        <p type="p">211:中央處理器</p>
        <p type="p">212:神經處理電路</p>
        <p type="p">220:監控電路</p>
        <p type="p">230:內部連接電路</p>
        <p type="p">240、250:記憶體</p>
        <p type="p">241、243:效能狀態</p>
        <p type="p">242、244:介面設定值</p>
        <p type="p">251:預設資料</p>
        <p type="p">260、270:介面控制電路</p>
        <p type="p">TS_1、TS_2:傳輸設定值</p>
        <p type="p">IOC_1、IOC_2:推論設定值</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="404" publication-number="202624768">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624768</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147766</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>預測方法、預測裝置及電腦可讀儲存媒介</chinese-title>
        <english-title>PREDICTION METHOD, DEVICE AND COMPUTER-READABLE STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250512B">G01R31/26</main-classification>
        <further-classification edition="201901120250512B">G06N20/00</further-classification>
        <further-classification edition="201201120250512B">G06Q50/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新唐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪健哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, JIAN-JHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種預測方法，用以預測一批晶圓的良率。在一訓練期間，接收複數晶圓的複數晶圓接受度測試(WAT)樣本資料；對晶圓進行一晶片針測(CP)測試，用以產生複數CP樣本資料；以及輸入WAT樣本資料以及CP樣本資料予一機器學習模型。機器學習模型計算該等WAT樣本資料以及該等CP樣本資料，用以產生一相關性。在一預測期間，輸入一WAT量測資料予機器學習模型。機器學習模型根據相關性及WAT量測資料，預測批晶圓的良率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A prediction method for predicting the yield of a batch of wafers is provided. In a training period, a plurality of wafer acceptance test (WAT) sample data for a plurality of wafers are received, a plurality of wafer probe (CP) sample data which are obtained after performing a CP test operation on the plurality of wafers are received, and the WAT sample data and CP sample data are input to a machine learning model. The machine learning model calculates the WAT sample data and the CP sample data to generate a correlation. During a prediction period, WAT ​​measurement data is input to the machine learning model. The machine learning model predicts the yield of the batch of wafers according to the correlation and the WAT measurement data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">111~113、121~123:步驟</p>
        <p type="p">110:訓練期間</p>
        <p type="p">120:預測期間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="405" publication-number="202624770">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624770</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147768</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>測試機台、測試方法及電腦可讀儲存媒介</chinese-title>
        <english-title>TEST EQUIPMENT, METHOD AND COMPUTER READABLE STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G01R31/28</main-classification>
        <further-classification edition="202601120260302B">H10P74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新唐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林則余</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TSE-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種測試方法，包括在一訓練期間，接收複數樣本晶圓的複數晶圓接受度測試(WAT)樣本資料；對樣本晶圓進行一晶片針測(CP)測試，用以產生複數CP樣本資料；輸入WAT樣本資料以及CP樣本資料予一機器學習模型。機器學習模型計算WAT樣本資料以及CP樣本資料，用以產生一相關性。在一測試期間，輸入一待測晶圓的一產品資訊以及一WAT量測資料予機器學習模型，使得機器學習模型根據相關性，從WAT量測資料中找出至少一關鍵參數，機器學習模型根據關鍵參數，調整複數測試項目的順序；根據調整後的該等測試項目的順序，測試該待測晶圓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A test method is provided. A plurality of wafer acceptance test (WAT) sample data of a plurality of sample wafers are received during a training period. A wafer probe (CP) test is performed on each sample wafer to generate a plurality of CP sample data during the training period. The WAT sample data and the CP sample data are input to a machine learning model during the training period. The machine learning model calculates WAT sample data and CP sample data to generate a correlation. During a test period, product information and WAT measurement data of a wafer to be tested are input to the machine learning model, so that the machine learning model finds at least one key parameter from the WAT measurement data according to the correlation. The machine learning model adjusts the order of multiple test items according to the key parameter. The wafer to be tested is tested according to the adjusted order of the test items.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:訓練期間</p>
        <p type="p">120:測試期間</p>
        <p type="p">S111~S113、S121、S122:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="406" publication-number="202624769">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624769</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147769</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>目標良率校正方法、校正裝置及電腦可讀儲存媒介</chinese-title>
        <english-title>TARGET YIELD CORRECTION METHOD, DEVICE AND COMPUTER-READABLE STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250512B">G01R31/26</main-classification>
        <further-classification edition="201201120250512B">G06Q50/04</further-classification>
        <further-classification edition="201901120250512B">G06N20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新唐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡政翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHENG-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種目標良率校正方法，包括獲取一特定產品於複數晶圓中的複數良率及複數尺寸；根據該等尺寸，區分該等良率，用以產生複數群組；計算每一群組的平均良率；計算該等平均良率及該等尺寸，用以產生複數缺陷密度值；輸入該等缺陷密度值予一機器學習模型，該機器學習模型剃除該等缺陷密度值中不符合一預設規則的缺陷密度值；根據剩餘的缺陷密度值，產生一缺陷密度曲線；計算該缺陷密度曲線及該等尺寸，用以產生複數目標良率，每一目標良率對應該等尺寸之一者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A target yield correction method is provided. A plurality of yields and a plurality of sizes of a specific product in a plurality wafers are obtained. The yields are divided into a plurality of groups according to the sizes. The yields of each group are averaged to generate an average yield. The average yields and the sizes are calculated to generate a plurality of defect density values. The defect density values are input to a machine learning model. The machine learning model eliminates defects that do not match a predetermined standard and generate a defect density curve according to the remaining defect density values. The defect density curve and the sizes are calculated to generate a plurality of target yield. Each target yield corresponds to one of the sizes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110~S150:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="407" publication-number="202625768">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625768</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147770</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>測試裝置、測試方法及測試系統</chinese-title>
        <english-title>TEST DEVICE, METHOD AND SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P74/00</main-classification>
        <further-classification edition="202001120260302B">G01R31/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新唐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王政治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHENG-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種測試裝置，包括一儲存電路以及一處理電路。儲存電路儲存一機器學習模型。處理電路存取儲存電路。在一訓練模式下，處理電路載入機器學習模型，並輸入一樣本晶圓的一晶圓允收測試樣本數據予機器學習模型，用以訓練機器學習模型預測樣本晶圓的每一樣本晶粒的一製程參數。在一測試模式下，處理電路輸入一待測晶圓的一晶圓允收測試數據予機器學習模型，用以預測待測晶圓的每一待測晶粒的一製程參數。處理電路轉換每一待測晶粒的製程參數，用以產生一修整碼，並提供修整碼予相對應待測晶粒的一第一功能電路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A test device including a storage circuit and a processing circuit is provided. The storage circuit stores a machine learning model. The processing circuit accesses the storage circuit. In a training mode, the processing circuit loads the machine learning model and inputs the wafer acceptance test (WAT) sample data of a sample wafer to the machine learning model to train the machine learning model to predict the process factor of each die of the sample wafer. In a test mode, the processing circuit inputs the WAT data of a wafer to be tested to the machine learning model to predict the process factor of each die of the wafer to be tested. The processing circuit converts the process factor of each die of the wafer to be tested to generate a trim code, and provides the trim code to a functional circuit of a corresponding die of the wafer to be tested.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:測試系統</p>
        <p type="p">310:測試裝置</p>
        <p type="p">320:測試平台</p>
        <p type="p">WF:晶圓</p>
        <p type="p">331:樣本晶圓</p>
        <p type="p">332:待測晶圓</p>
        <p type="p">311:儲存電路</p>
        <p type="p">312:處理電路</p>
        <p type="p">313:輸入輸出介面</p>
        <p type="p">ML:機器學習模型</p>
        <p type="p">WS、WT:WAT數據</p>
        <p type="p">MS、MT:晶圓地圖</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="408" publication-number="202625296">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625296</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147773</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>天線控制方法及天線系統</chinese-title>
        <english-title>ANTENNA CONTROL METHOD AND ANTENNA SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250304B">H01Q3/02</main-classification>
        <further-classification edition="201801120250304B">H04B7/02</further-classification>
        <further-classification edition="200601120250304B">H01Q25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>耀登科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUDEN TECHNO CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠溢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, GUAN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘仁義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, JEN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡宗樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, TSUNG-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種天線控制方法及天線系統。天線控制方法包括以下步驟：載入初始收發方向數據；依據初始收發方向數據朝著多個衛星進行接收，以取得多個信號強度數據；利用最低強度閥值由多個信號強度數據建立候選列表；由候選列表選取具有最大信號強度數據的衛星定義為目標對象；於目標對象的信號強度數據大於預定強度閥值時，取得目標對象的基頻訊號數據，並帶入基頻訊號數據至子空間追蹤法中以取得主特徵向量數據與主特徵值數據；利用主特徵向量數據與主特徵值數據帶入至ESPRIT中，以取得目標對象的到達方向數據；依據到達方向數據調整波束以追蹤目標對象。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An antenna control method and an antenna system are provided. The antenna control method includes the following steps: loading initial transmission and reception direction data; receiving from multiple satellites based on the initial transmission and reception direction data to obtain multiple signal strength data; establishing a candidate list from the multiple signal strength data using a minimum intensity threshold; selecting the satellite with the highest signal strength data from the candidate list as the target object; when the signal strength data of the target object is greater than a predetermined intensity threshold, obtaining the baseband signal data of the target object and inputting the baseband signal data into subspace tracking method to obtain the principal eigenvector data and principal eigenvalue data; inputting the principal eigenvector data and principal eigenvalue data into ESPRIT to obtain the direction of arrival data of the target object; and adjusting the beam based on the direction of arrival data to track the target object.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101~S117:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="409" publication-number="202625398">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625398</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147774</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光收發裝置、電子設備及光收發裝置之控制方法</chinese-title>
        <english-title>OPTICAL TRANSCEIVER DEVICE, ELECTRONIC EQUIPMENT, AND METHOD OF CONTROLLING OPTICAL TRANSCEIVER DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120250306B">H04B10/40</main-classification>
        <further-classification edition="201301120250306B">H04B10/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華景電通股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRILLIAN NETWORK &amp; AUTOMATION INTEGRATED SYSTEM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志益</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIH-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開是一種光收發裝置、電子設備及光收發裝置之控制方法。光收發裝置包括光接收模組、光發射器及控制電路。光接收模組具有多個光接收器。控制電路連接於光接收模組及光發射器。控制電路接收光接收模組取得的多筆光接收訊號，並根據多筆光接收訊號中相對應的多筆接收訊號強度指示值，選擇性地使用其中一個光接收器作為後續接收資料來源的資料接收端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical transceiver device, a method of controlling optical transceiver device, and an electronic equipment are provided. The optical transceiver device includes an optical receiving module, an optical transmitter and a control circuit. The optical receiver module has multiple optical receivers. The control circuit is connected to the optical receiver module and the optical transmitter. The control circuit receives a plurality of received signal strength indication values corresponding to the plurality of optical receiving signals obtained by the optical receiving module, and selectively uses one of the optical receivers as a data receiver according to the multiple received signal strength indication values.</p>
      </isu-abst>
      <representative-img>
        <p type="p">OT:光收發裝置</p>
        <p type="p">11:光接收模組</p>
        <p type="p">111:第一光接收器</p>
        <p type="p">113:第二光接收器</p>
        <p type="p">13:光發射器</p>
        <p type="p">
        &lt;b&gt;θ&lt;/b&gt;1:第一光接收角度</p>
        <p type="p">
        &lt;b&gt;θ&lt;/b&gt;2:第二光接收角度</p>
        <p type="p">TA:目標裝置</p>
        <p type="p">E1:光發射器</p>
        <p type="p">R1:光接收器</p>
        <p type="p">WA:工作區</p>
        <p type="p">SA:感應區</p>
        <p type="p">SA1:第一感應區</p>
        <p type="p">SA2:第二感應區</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="410" publication-number="202625166">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625166</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147776</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>偵測語速的電子裝置及語速偵測方法</chinese-title>
        <english-title>ELECTRONIC DEVICE AND METHOD FOR DETECTING SPEECH RATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120250320B">G10L25/51</main-classification>
        <further-classification edition="201301120250320B">G10L25/78</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙盈盈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAO, YING-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露是關於一種語速偵測方法，包括：取得數位音訊；從數位音訊中取得多個音框並設定觀察框，其中觀察框包含多個第一音框；判斷觀察框是否屬於語音；若觀察框屬於語音，對第一音框進行區域峰值偵測，若第一音框包含不連續峰值則累計音節計數值；以及根據音節計數值計算語速。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure relates to a method for detecting a speech rate. The method includes: obtaining a digital audio signal; acquiring multiple frames from the digital audio signal and setting an observation window which includes multiple first frames; determining whether the observation window belongs to speech; if the observation window belongs to speech, performing a local peak detection on the first frames, and accumulating a syllable count if the first frames contain discontinuous peaks; and calculating the speech rate based on the syllable count.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S201~S209、S220:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="411" publication-number="202625539">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625539</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147778</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用液冷技術冷卻其中的電子裝置的機箱以及包括其的機櫃</chinese-title>
        <english-title>CHASSIS USING LIQUID-COOLING FOR COOLING ELECTRONIC DEVICE THEREIN AND RACK INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250227B">H05K7/20</main-classification>
        <further-classification edition="200601120250227B">F28F5/00</further-classification>
        <further-classification edition="200601120250227B">F28F1/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>技鋼科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIGA COMPUTING TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃肇湘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHAO HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃進權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHING-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種機箱以及包括其的機櫃。機箱可用於冷卻一電子裝置。機箱包括一本體、一電連接模組、一熱交換模組、一第一液體入口、一第一液體出口、一第二液體注入孔。本體具有一容納空間。電連接模組設置於本體，並用於電連接電子裝置。熱交換模組設置於容納空間。第一液體入口、第一液體出口、第二液體注入孔形成於本體。電子裝置設置於容納空間。藉由第二液體注入孔注入一第二液體，使得電子裝置以及熱交換模組浸沒於第二液體，而且，一第一液體依序流過第一液體入口、熱交換模組、第一液體出口，以散逸電子裝置所產生的熱量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A chassis and a rack including the same are provided. The chassis can be used to cool an electronic device. The chassis includes a main body, an electrical connection module, a heat exchange module, a first liquid inlet, a first liquid outlet, and a second liquid injection port. The main body has an accommodation space. The electrical connection module is disposed on the main body. The electrical connection module provides an electrical connection to the electronic device. The heat exchange module is disposed in the accommodation space. The first liquid inlet, the first liquid outlet, and the second liquid injection port are formed on the main body. The electronic device is positioned in the accommodation space. By injecting a second liquid through the second liquid injection port, the electronic device and the heat exchange module are immersed in the second liquid, and a first liquid sequentially flows through the first liquid inlet, the heat exchange module, and the first liquid outlet to dissipate the heat generated by the electronic device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:機箱</p>
        <p type="p">210:本體</p>
        <p type="p">211:容納空間</p>
        <p type="p">220:蓋體</p>
        <p type="p">221:前蓋</p>
        <p type="p">222:上蓋</p>
        <p type="p">230:電連接模組</p>
        <p type="p">231:內側電源匯流排</p>
        <p type="p">232:外側電源匯流排</p>
        <p type="p">240:熱交換模組</p>
        <p type="p">241:鰭片</p>
        <p type="p">291:托架</p>
        <p type="p">292:防漏元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="412" publication-number="202623791">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623791</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147779</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>建立難治型憂鬱症之小鼠模型的方法及其藥物組合</chinese-title>
        <english-title>THE METHOD FOR ESTABLISHING A TREATMENT-RESISTANT DEPRESSION MODEL AND DRUG COMBINATION THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">A61K31/138</main-classification>
        <further-classification edition="200601120250501B">A61K31/155</further-classification>
        <further-classification edition="200601120250501B">A61K31/536</further-classification>
        <further-classification edition="200601120250501B">A61K31/55</further-classification>
        <further-classification edition="200601120250501B">A61K31/135</further-classification>
        <further-classification edition="200601120250501B">A61P25/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立陽明交通大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL YANG MING CHIAO TUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林惠菁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HUI-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李正達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHENG-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李旂緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張傑宥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIEH-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種建立難治型憂鬱症之小鼠模型的方法，包括以下步驟：連續兩天以多次的一條件創傷組合至少一小鼠進行刺激；使用至少一抗憂鬱藥物對該至少一小鼠進行多個耐受性測試，其中上述條件創傷組合為包含以一聲音刺激作為提示，並搭配一足部電刺激做為創傷。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a method for establishing a treatment-resistant depression model. The method for establishing a treatment-resistant depression model includes the following steps. First, at least one mouse is stimulated multiple times with a conditional trauma combination for two consecutive days. Second, multiple tolerance tests is performed on the at least one mouse using at least one antidepressant drug. The conditional trauma combination is composed of a sound stimulus as a cue paired with a foot shock as the trauma.</p>
      </isu-abst>
      <representative-img>
        <p type="p">
        </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="413" publication-number="202624856">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624856</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147780</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">G02F1/1333</main-classification>
        <further-classification edition="200601120241231B">G02F1/1335</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商群豐駿科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARUX TECHNOLOGY PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李俊賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JYUN-SIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋立偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNG, LI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝宏昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, HONG-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種顯示裝置，包括：顯示面板、第一視角控制面板以及第二視角控制面板。第一視角控制面板重疊於顯示面板，且包括第一液晶層。第一液晶層具有第一液晶折射率差異值、第一液晶層間距。第二視角控制面板重疊於顯示面板及第一視角控制面板，且包括第二液晶層。第二液晶層具有第二液晶折射率差異值、第二液晶層間距。第一液晶層不同於第二液晶層，且第一液晶折射率差異值與第一液晶層間距的乘積不同於第二液晶折射率差異值與第二液晶層間距的乘積。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device is provided. The display device includes a display panel, a first viewing angle control panel, and a second viewing angle control panel. The first viewing angle control panel overlaps the display panel and includes a first liquid crystal layer. The first liquid crystal layer has a first liquid crystal refractive index difference value and a first liquid crystal layer spacing. The second viewing angle control panel overlaps the display panel and the first viewing angle control panel and includes a second liquid crystal layer. The second liquid crystal layer has a second liquid crystal refractive index difference value and a second liquid crystal layer spacing. The first liquid crystal layer is different from the second liquid crystal layer, and the product of the first liquid crystal refractive index difference value and the first liquid crystal layer spacing is different from the product of the second liquid crystal refractive index difference value and the second liquid crystal layer spacing.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:顯示裝置</p>
        <p type="p">101,103:視角控制面板</p>
        <p type="p">120,140,160,180:偏光板</p>
        <p type="p">200:顯示面板</p>
        <p type="p">300:半波板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="414" publication-number="202625036">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625036</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147781</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>倉儲空間動態分配系統、倉儲空間動態分配方法及電子設備</chinese-title>
        <english-title>DYNAMIC ALLOCATION SYSTEM OF STORAGE SPACE, DYNAMIC ALLOCATION METHOD OF STORAGE SPACE AND ELECTRONIC EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120241231B">G06Q10/08</main-classification>
        <further-classification edition="200601120241231B">B65G1/137</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盟立自動化股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIRLE AUTOMATION CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉美微</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, MEI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開是一種倉儲空間動態分配系統、倉儲空間動態分配方法及電子設備。倉儲空間動態分配系統包括第一系統及第二系統。第一系統產生一搬運指令，以使物件由來源位置搬運至目的地位置。第二系統根據搬運指令產生搬運任務。第二系統接收搬運指令後，判斷搬運指令中的目的地位置是否符合變更條件。當符合變更條件時，分別計算倉儲設備中的每一備用區域與來源位置的一適配度。根據計算結果，選擇其中一個備用區域作為一新目的地位置。根據新目的地位置重新規劃搬運任務，以使物件由來源位置變更搬運至新目的地位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure are directed to a dynamic allocation system of a storage space, a dynamic allocation method of a storage space, and an electronic device. The dynamic allocation system includes a first system and a second system. The first system generates a transport instruction to cause an object to be transported from a source position to a destination position. The second system generates a transport task according to the transport instruction. Upon receiving the transport instruction, the second system determines whether the destination position in the transport instruction meets a change condition. When the change condition is met, the compatibility between each alternate area in the storage equipment and the source location is calculated separately. According to the calculation result, one of the alternate areas is selected as a new destination position. The transport task is replanned according to the new destination position, so that the object is transported from the source position to the new destination position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:製程設備</p>
        <p type="p">12:機台自動化控制系統</p>
        <p type="p">14:倉儲空間動態分配系統</p>
        <p type="p">141:第一系統</p>
        <p type="p">142:第二系統</p>
        <p type="p">16:搬運設備控制系統</p>
        <p type="p">161:搬運設備</p>
        <p type="p">18:倉儲設備控制系統</p>
        <p type="p">181:倉儲設備</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="415" publication-number="202623998">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623998</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147803</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有多層結構的冷卻塗層和使用其的冷卻系統</chinese-title>
        <english-title>COOLING COATING WITH MULTI-LAYER STRUCTURE AND COOLING SYSTEM USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120251106B">B32B7/027</main-classification>
        <further-classification edition="200601120251106B">B32B15/04</further-classification>
        <further-classification edition="200601120251106B">B32B33/00</further-classification>
        <further-classification edition="200601120251106B">H05K7/20</further-classification>
        <further-classification edition="200601120251106B">F25B23/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>匯聚精密科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUGEE PRECISE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈弘濱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, HUNG PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈弘祚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, HUNG TZUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有多層結構的冷卻塗層，其包括：核心吸熱層、導熱增強層以及輻射散熱層。核心吸熱層覆蓋在目標物件上，以與目標物件形成第一接觸面，並至少包括金屬合金。導熱增強層設置在核心吸熱層上，以與核心吸熱層形成第二接觸面，且導熱增強層包括金屬氮化物、金屬氧化物、碳系材料或是其組合。輻射散熱層設置在導熱增強層上，以與導熱增強層形成第三接觸面，且輻射散熱層包括金屬合金與金屬氧化物，其中輻射散熱層具有暴露於環境的外表面，其至少用於輻射散熱。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cooling coating with a multi-layer structure, including: a core heat-absorbing layer, a thermal conductivity-enhancing layer, and a radiation heat-dissipating layer. The core heat-absorbing layer is applied to a target object, forming a first contact surface with the target object, and includes at least a metal alloy. The thermal conductivity-enhancing layer is placed on the core heat-absorbing layer, forming a second contact surface with the core heat-absorbing layer, and the thermal conductivity-enhancing layer includes metal nitrides, metal oxides, carbon-based materials, or a combination thereof. The radiation heat-dissipating layer is placed on the thermal conductivity-enhancing layer, forming a third contact surface with the thermal conductivity-enhancing layer, and the radiation heat-dissipating layer includes a metal alloy and metal oxides. The radiation heat-dissipating layer has an outer surface exposed to the environment, configured for radiative heat dissipation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:冷卻塗層</p>
        <p type="p">110:核心吸熱層</p>
        <p type="p">120:導熱增強層</p>
        <p type="p">130:輻射散熱層</p>
        <p type="p">S1、S2:接觸面</p>
        <p type="p">S3:外表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="416" publication-number="202625192">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625192</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147808</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體裝置及其資料抹除方法</chinese-title>
        <english-title>MEMORY DEVICE AND DATA ERASING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250310B">G11C16/16</main-classification>
        <further-classification edition="200601120250310B">G11C16/14</further-classification>
        <further-classification edition="200601120250310B">G11C16/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華邦電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINBOND ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭如傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, JU-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊育錚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, YU-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡三玄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, SHAN-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施亮丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, LIANG-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體裝置及其資料抹除方法被提出。資料抹除方法包括：使記憶體區塊被區分為多個記憶胞分區；執行記憶體區塊的記憶胞分區的第一資料抹除動作；由記憶胞分區中的第一記憶胞分區開始，根據第一順序逐一針對各記憶胞分區執行第一抹除驗證動作，並記錄第一失敗記憶胞分區；由記憶胞分區中的第N記憶胞分區開始，根據第二順序逐一針對各記憶胞分區執行第二抹除驗證動作，並記錄第二失敗記憶胞分區；針對第一失敗記憶胞分區至第二失敗記憶胞分區間的至少一選中記憶胞分區執行第二資料抹除動作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory device and a data erasing method are provided. The data erasing method includes: dividing a memory block to a plurality of memory cell divisions; performing a first data erase operation on the memory divisions; start from a first memory cell division, performing a first erase verify operation on each of the memory cell divisions one by one according to a first sequence, and recording a first failure memory cell division; start from a Nth memory cell division, performing a second erase verify operation on each of the memory cell divisions one by one according to a second sequence, and recording a second failure memory cell division; performing a second data erase operation on the first failure memory division to the second failure memory division.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110~S150:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="417" publication-number="202624086">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624086</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147817</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>手拉器的制動器</chinese-title>
        <english-title>BRAKE FOR A TIE-DOWN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">B65B13/18</main-classification>
        <further-classification edition="200601120241230B">F16G3/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃炳鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, PING-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃炳鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, PING-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林松柏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明包括：一個手拉器與一個制動器。該手拉器包括：一條長帶；一根可捲收該長帶的軸；一個結合該軸而能同步作動的齒輪，該齒輪露出該手拉器外。該制動器包括：一個殼體；一個位於該殼體內部的組裝室；一個形成該殼體的通孔，該通孔與該組裝室相通；一個裝入該組裝室的卡掣件，該卡掣件相對該殼體往復運動；以及，一個突出該卡掣件一側的勾部。當該殼體固定該手拉器的外部時，該齒輪經由該通孔進入該組裝室中，該卡掣件相對該殼體移動，該勾部卡掣該齒輪，對該軸產生剎車作用，執行該長帶的更換，抑或解除卡掣關係，使該軸恢復原來的捲帶功能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A tie-down includes a long strap, a shaft for winding the long strap, a frame for supporting the shaft, a gear connected to the shaft, and a brake. The brake includes a housing attached to the frame and a detent movable in the housing between two positions. In the first position, the detent engages with the gear to prevent the shaft from rotation. In the second position, the detent disengages from the gear to allow the shaft to rotate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:制動器</p>
        <p type="p">15:短軸</p>
        <p type="p">16:珠體</p>
        <p type="p">17:壓縮彈簧</p>
        <p type="p">20:卡掣件</p>
        <p type="p">21:孔</p>
        <p type="p">22:勾部</p>
        <p type="p">23:角錐</p>
        <p type="p">24:搖頭開關</p>
        <p type="p">30:蓋體</p>
        <p type="p">31:頂板</p>
        <p type="p">32:壁</p>
        <p type="p">33:組裝室</p>
        <p type="p">34:缺口</p>
        <p type="p">35:固定部</p>
        <p type="p">37:簧槽</p>
        <p type="p">40:長軸</p>
        <p type="p">41:齒輪</p>
        <p type="p">42:齒</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="418" publication-number="202625693">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625693</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147822</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>揮發性有機化合物淨化裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P50/00</main-classification>
        <further-classification edition="200601120260302B">B01D53/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>關隆股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRAND MATE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃錦穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃信銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃信雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉嚴仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林冠州</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖鉦達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種揮發性有機化合物淨化裝置，定義相垂直的一第一軸向及一第二軸向，該揮發性有機化合物淨化裝置包括一殼體、一進氣管、一出氣管、至少一加熱模組及至少一觸媒模組，該殼體於該第一軸向上具有相對的兩側，殼體內部具有一容置空間；該進氣管及該出氣管分別穿設該殼體的兩側；該至少一加熱模組設置於該殼體的容置空間中；該至少一觸媒模組設置於該殼體的容置空間中且與該至少一加熱模組沿該第一軸向排列於該進氣管與該出氣管之間，以提升該揮發性有機化合物淨化裝置之分解效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:揮發性有機化合物淨化裝置</p>
        <p type="p">10:外箱</p>
        <p type="p">12:箱體</p>
        <p type="p">14:側蓋</p>
        <p type="p">30:進氣管</p>
        <p type="p">40:出氣管</p>
        <p type="p">L1:第一軸向</p>
        <p type="p">L2:第二軸向</p>
        <p type="p">L3:第三軸向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="419" publication-number="202623940">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623940</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147823</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可拆式夾持裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241225B">B23Q3/154</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>關隆股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRAND MATE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃錦穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃信銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃信雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉嚴仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖鉦達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可拆式夾持裝置，設置於一加工機的一基座，該基座包括一轉盤與一分配器，該分配器設置於該轉盤的頂面。該可拆式夾持裝置包括一轉接盤與一夾座模組；該夾座模組包括一底盤與複數個夾具，該底盤以可拆離之方式設置於該轉接盤的頂面。透過轉接盤與夾座模組之底盤可拆離之設計，欲更換夾座模組時，可快速將夾座模組拆離，更換另一個夾座模組結合於轉接盤上，藉此增加更換加工件的作業效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:可拆式夾持裝置</p>
        <p type="p">1:基座</p>
        <p type="p">10:轉接盤</p>
        <p type="p">20:第一夾座模組</p>
        <p type="p">21:第一底盤</p>
        <p type="p">22:第一夾具</p>
        <p type="p">23:第一治具</p>
        <p type="p">B:阻塞件</p>
        <p type="p">W1:第一工件</p>
        <p type="p">P1:鎖定位置</p>
        <p type="p">P2:釋放位置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="420" publication-number="202623741">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623741</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147825</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>烤爐</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241225B">A47J37/06</main-classification>
        <further-classification edition="200601120241225B">A21B3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>關隆股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRAND MATE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃錦穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃信銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃信雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉嚴仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖鉦達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種烤爐，包含一底座、一可收折式爐身、一頂蓋與一加熱裝置，其中，該底座具有一上容槽。該可收折式爐身具有複數個壁板，可於一展開狀態與一收折狀態之間變化。該頂蓋之頂板凹入形成一加熱槽。該加熱裝置設置於該頂蓋的內部，且位於該加熱槽的相反側，當該可收折爐身於該展開狀態時，該些壁板共同圍成一烘烤空間並可拆離地插設於該上容槽中，該頂蓋則可拆離地覆蓋於該可收折式爐身的頂側，此時該加熱裝置面對該烘烤空間，且該加熱裝置產生的熱能同時對該烘烤空間與該加熱槽進行加熱。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:瓦斯罐</p>
        <p type="p">4:鍋具</p>
        <p type="p">100:烤爐</p>
        <p type="p">10:底座</p>
        <p type="p">16:腳架</p>
        <p type="p">20:可收折式爐身</p>
        <p type="p">21:壁板</p>
        <p type="p">217:門板</p>
        <p type="p">30:頂蓋</p>
        <p type="p">31:頂板</p>
        <p type="p">32:加熱槽</p>
        <p type="p">321:槽面</p>
        <p type="p">33:圍壁</p>
        <p type="p">41:撓性管路</p>
        <p type="p">P21:封閉位置</p>
        <p type="p">P32:第二位置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="421" publication-number="202623746">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623746</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147826</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>地面清掃機</chinese-title>
        <english-title>FLOOR SWEEPER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250121B">A47L11/24</main-classification>
        <further-classification edition="200601120250121B">A47L11/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>正修學校財團法人正修科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG SHIU UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李春雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHUN-HSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李淑芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李碩安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SHUO-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, BO-XIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳泳孜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YONG-ZIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李碩崴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SHUO-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種地面清掃機，包含：一載體，該載體的底部設有複數驅動輪，該載體的內部具有一容置空間，該容置空間設有一入口；一蓋體，設置對應於該容置空間之頂面；一撿拾模組，其設有一撿球組件，該撿球組件包含數組捕捉器、數個撿拾馬達及一組馬達傳動桿，該些撿拾馬達驅動該捕捉器旋轉，使該捕捉器輸送地面一目標物，並將該目標物送入該入口而投放於該容置空間；一影像辨識模組，用以擷取並辨識一路況與一目標物影像；及一控制模組，設置於該載體上，電性連接該驅動輪、該撿拾馬達及該影像辨識模組自行設定及記錄所需清掃區域及辨識障礙物繞行。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A floor sweeper, including: a carrier, the bottom of the carrier is provided with a plurality of driving wheels, the interior of the carrier has an accommodation space, and the accommodation space is provided with an entrance; a cover body is provided corresponding to the accommodation space the top surface; a pickup module, which is provided with a ball pickup assembly, which includes an array of catchers, several pickup motors, and a set of motor transmission rods. The pickup motors drive the catchers to rotate, causing the catchers to rotate. Transporting a target object on the ground, and sending the target object into the entrance and placing it in the accommodation space; an image recognition module for capturing and identifying road conditions and an image of the target object; and a control module configured on the carrier, the driving wheel, the pickup motor and the image recognition module are electrically connected to set and record the required cleaning area and identify obstacles to bypass.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(10):載體</p>
        <p type="p">(11):驅動輪</p>
        <p type="p">(12):容置空間</p>
        <p type="p">(20):蓋體</p>
        <p type="p">(30):撿拾模組</p>
        <p type="p">(31):撿球組件</p>
        <p type="p">(32):捕捉器</p>
        <p type="p">(33):撿拾馬達</p>
        <p type="p">(34):馬達傳動桿</p>
        <p type="p">(35):輸送履帶</p>
        <p type="p">(351):刷條</p>
        <p type="p">(40):影像辨識模組</p>
        <p type="p">(41):攝像單元</p>
        <p type="p">(50):控制模組</p>
        <p type="p">(60):收納盒</p>
        <p type="p">(61):收納盒導入口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="422" publication-number="202623977">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623977</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147829</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>剪管刀結構</chinese-title>
        <english-title>PIPE CUTTER STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">B26D3/16</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>甲舜企業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORIX ENTERPRISE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖秋煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, ERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王德文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種剪管刀結構，包含有：一本體，具有一第一握持件及一第二握持件；該第一握持件之一端設有一導槽；該第二握持件樞設於該第一握持件，一端具有一容刀槽；一夾持組件，具有一第一夾塊及一第二夾塊並排樞設於該第一握持件之該導槽中；該第一夾塊與該第二夾塊可受外力作用而改變該第一夾塊與該第二夾塊之間之一夾持角度；以及一切刀，固定於該本體之該第二握持件之該容刀槽中，具有一刃部從該容刀槽伸出並對應於該夾持組件，用以隨該第二握持件同步移動而朝接近或遠離該夾持組件之方向移動；其中一切割空間形成於該切刀與該夾持組件之間，用以容置一管件；其中，當該切刀施力於該切割空間中之該管件時，該夾持組件之該第一夾塊與該第二夾塊朝接近彼此的方向轉動，使該第一夾塊與該第二夾塊共同夾持該管件之外壁面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pipe cutter structure comprises: A main body, which includes a first gripping member and a second gripping member; the first gripping member has a guide slot at one end; the second gripping member is pivotally connected to the first gripping member and has a blade-holding slot at one end. A clamping assembly, which includes a first clamping block and a second clamping block that are pivotally arranged side by side within the guide slot of the first gripping member. The first and second clamping blocks can change the clamping angle between them under the influence of external force. A cutting blade, which is fixed in the blade-holding slot of the second gripping member of the main body. The blade has a cutting edge extending out from the blade-holding slot and corresponds to the clamping assembly. The blade moves synchronously with the second gripping member in a direction toward or away from the clamping assembly. A cutting space is formed between the cutting blade and the clamping assembly to accommodate a pipe. When the cutting blade applies force to the pipe in the cutting space, the first and second clamping blocks of the clamping assembly rotate toward each other, causing them to jointly clamp the outer surface of the pipe.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:剪管刀結構</p>
        <p type="p">10:本體</p>
        <p type="p">11:第一握持件</p>
        <p type="p">12:第二握持件</p>
        <p type="p">20:夾持組件</p>
        <p type="p">21:第一夾塊</p>
        <p type="p">22:第二夾塊</p>
        <p type="p">30:切刀</p>
        <p type="p">40:定位件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="423" publication-number="202624034">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624034</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147848</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>充電樁動態負載管理系統的運作方法</chinese-title>
        <english-title>OPERATION METHOD OF CHARGING PILE DYNAMIC LOAD MANAGEMENT SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120241218B">B60L53/31</main-classification>
        <further-classification edition="201901120241218B">B60L53/64</further-classification>
        <further-classification edition="202401120241218B">G06Q50/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>微電能源股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICRO ELECTRICITY CO. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳靖方</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JING-FANGN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪國勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, KUO-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案之發明揭露一種充電樁動態負載管理系統的運作方法，適用於一電源管理系統。所述電源管理系統乃利用一雲端平臺，執行一演算法，以一或多個雲端電源管理系統對應地管理一或多個在地端的電源管理系統。每一在地端的電源管理系統包含一或多個充電樁，而所述演算法對所述一或多個充電樁執行一動態負載管理方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An operation method of a charging pile dynamic load management system is disclosed, and is suitable for a power management system. The power management system utilizes a cloud platform to execute an algorithm to correspondingly manage one or more local power management systems with one or more cloud power management systems. Each on-ground power management system includes one or more charging piles, and the algorithm performs a dynamic load management method on the one or more charging piles.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="424" publication-number="202625497">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625497</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147856</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>長晶爐之電源控制系統與控制方法</chinese-title>
        <english-title>POWER CONTROL SYSTEM AND METHOD FOR A CRYSTAL GROWTH FURNACE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250306B">H05B6/06</main-classification>
        <further-classification edition="200601120250306B">C30B35/00</further-classification>
        <further-classification edition="200601120250306B">H05B6/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馗鼎奈米科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CREATING NANO TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白盛方</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, SHENG-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李志勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JI-YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江鴻展</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, HUNG-CHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JIUN HAU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡柏帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, BO-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林資祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, ZI-YOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛義信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSUEH, YI-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種長晶爐之電源控制系統與控制方法。電源控制系統包含：加熱線圈及電源控制裝置。電源控制方法包含：初始功率輸出階段和穩定功率連續輸出階段。初始功率輸出階段包含：計算電源控制系統之輸出電流相位與輸出電壓相之相位差；當相位差小於第一預設相位閾值時，提高脈波寬度調變(pulse-width modulation；PWM)頻率值。當相位差大於第二預設相位閾值時，降低PWM頻率值。穩定功率連續輸出階段包含：偵測電源控制系統之轉換器電路之突波電壓值；當突波電壓值小於第一預設突波閾值時，降低PWM頻率值；當突波電壓值大於第二預設突波閾值時，提高PWM頻率之值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power control system and a power control method for a crystal growth furnace are provided. The power control system includes: a heating coil and a power control device. The power control method includes: an initial power output stage and a stable power output stage. The initial power output stage includes calculating a phase difference between an output current and an output voltage of the power control system; increasing a pulse-width modulation (PWM) frequency value when the phase difference is smaller than a first predetermined phase threshold; and decreasing the PWM frequency value when the phase difference is greater than a second predetermined phase threshold. The stable power output stage includes: detecting a spike voltage value of a converter in the power control system; decreasing the PWM frequency value when the spike voltage value is smaller than a first predetermined spike threshold; and increasing the PWM frequency value when the spike voltage value is greater than a second predetermined spike threshold.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:長晶爐之電源控制系統</p>
        <p type="p">110:交流電源</p>
        <p type="p">120:轉換器電路</p>
        <p type="p">122:整流濾波電路</p>
        <p type="p">124:降壓轉換器電路</p>
        <p type="p">126:全橋式電源轉換器電路</p>
        <p type="p">130:電容器電路</p>
        <p type="p">140:加熱線圈</p>
        <p type="p">150:相位差計算電路</p>
        <p type="p">160:突波電壓計算電路</p>
        <p type="p">170:控制電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="425" publication-number="202625379">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625379</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147864</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置及偏移校正方法</chinese-title>
        <english-title>ELECTRONIC DEVICE AND OFFSET CALIBRATION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250512B">H03M1/10</main-classification>
        <further-classification edition="200601120250512B">H03M1/12</further-classification>
        <further-classification edition="200601120250512B">H03F1/30</further-classification>
        <further-classification edition="200601120250512B">G01R19/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新唐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王政治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHENG-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置，包含：偏移校正模組，用以量測操作電壓及溫度；以及判斷該偏移校正模組是否儲存關聯於該操作電壓及該溫度的偏移誤差資訊；類比數位轉換器模組；主機；以及運算放大器，其負輸入端電性連接該偏移校正模組，其正輸入端電性連接該類比數位轉換器模組，以及其輸出端電性連接該主機。當該偏移校正模組儲存該偏移誤差資訊時，該偏移校正模組輸出該偏移誤差資訊至該運算放大器，以及該類比數位轉換器模組基於觸發訊號執行正常類比數位轉換以輸出原始數值至該運算放大器，從而使該運算放大器輸出結果數值至該主機。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device, including: an offset calibration module for measuring operating voltage and temperature; and determining whether the offset calibration module stores offset error information associated with the operating voltage and the temperature; an analog-to-digital converter module; a host; and an operational amplifier, a negative input pin of which electrically connected to the offset calibration module, a positive input pin of which electrically connected to the analog-to-digital converter module, and an output pin of which electrically connected to the host. When the offset calibration module stores the offset error information, the offset calibration module outputs the offset error information to the operational amplifier, and the analog-to-digital converter module performs normal analog-to-digital converter conversion based on a trigger signal to output an original value to the operational amplifier, so that the operational amplifier outputs a result value to the host.</p>
      </isu-abst>
      <representative-img>
        <p type="p">40:電子裝置</p>
        <p type="p">402:偏移校正模組</p>
        <p type="p">404:類比數位轉換器模組</p>
        <p type="p">406:運算放大器</p>
        <p type="p">408:主機</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="426" publication-number="202623725">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623725</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147870</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>扣具</chinese-title>
        <english-title>BUCKLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">A44B11/00</main-classification>
        <further-classification edition="200601120241231B">A41F1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王建煒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIEN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>基隆市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王建煒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIEN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高宏銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種扣具，其包含一上蓋與一底座。上蓋包括了一蓋板與二第一圓形插接部，底座包括了一底板與二第二圓形插接部。本發明的上蓋與底座之設計，讓磁鐵能更有效地發揮其磁力，使上蓋與底座間的結合順暢，插拔不費力的同時也讓磁力固定兩者。同時，二者的設計可讓裝飾物黏附於其上，從而增加了接合物件的裝飾感。此外，上蓋與底座間的空間可以讓至少一條繩帶穿過，用來束縛該些繩帶或固定該些繩帶的延伸方向。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A buckle is disclosed. It includes an upper cover and a base. The upper cover includes a cover plate and two first circular plug-in portions, and the base includes a bottom plate and two second circular plug-in portions. The design of the upper cover and the base of the present invention allows magnets to exert their magnetic force more effectively, making the connection between the upper cover and the base smooth, making insertion and removal effortless while also allowing the magnetic force to fix the two. At the same time, the two designs allow decorative objects to adhere to them, thereby increasing the decorative feel for the joined object. In addition, at least one straps can pass through the space between the upper cover and the base to bind them and fix the extending direction thereof.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:扣具</p>
        <p type="p">10:上蓋</p>
        <p type="p">20:底座</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="427" publication-number="202623727">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623727</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147871</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>扣具</chinese-title>
        <english-title>BUCKLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">A45C13/10</main-classification>
        <further-classification edition="200601120241231B">A44B11/25</further-classification>
        <further-classification edition="200601120241231B">A44B18/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王建煒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIEN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>基隆市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王建煒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIEN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高宏銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種扣具，其包含一上蓋與一扣接座。上蓋包括了一第一圓形插接部與一圓形頂蓋。扣接座包括了一第二圓形插接部與一圓形底座。本發明的上蓋與扣接座之設計，讓埋設於兩者中的磁鐵能更有效地發揮其磁力，使上蓋與扣接座間的結合順暢，插拔不費力的同時也讓磁力固定兩者。此外，第二圓形插接部的設計可讓固定端套接於其外圍或結合於圓形底座的下方，從而增加了本發明接合物件的態樣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A buckle is disclosed. It includes an upper cover and a buckle base. The upper cover includes a first circular plug portion and a circular top cover. The buckle base includes a second circular plug portion and a circular base. The design of the upper cover and the buckle base of the present invention allows the magnets embedded in the two to exert their magnetic force more effectively, making the connection between the upper cover and the buckle base smooth, making insertion and removal effortless while also allowing the magnetic force to fix both. In addition, the design of the second circular plug portion allows a fixed end to be sleeved around its periphery or combined under the circular base, thereby increasing the aspect of the jointing objects of the present invention.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:扣具</p>
        <p type="p">10:上蓋</p>
        <p type="p">20:扣接座</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="428" publication-number="202623914">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623914</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147873</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>廢棄物乾燥裝置及廢棄物乾燥方法</chinese-title>
        <english-title>WASTE DRYING DEVICE AND WASTE DRYING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120241231B">B09B3/00</main-classification>
        <further-classification edition="200601120241231B">F26B23/04</further-classification>
        <further-classification edition="200601120241231B">F26B11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裕山環境工程股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUH SHAN ENVIRONMENTAL ENGINEERING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冠宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, KUAN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉原宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YUAN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張育祺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YU-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳品旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PIN-XU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種廢棄物乾燥裝置包含反應槽、空氣壓縮機、電熱棒以及防飛屑組件。反應槽包含殼體、中空管以及多個中空攪拌棒。殼體具有容置初始廢棄物以及乾燥廢棄物的廢棄物乾燥空間。中空管設置於殼體的側壁上且位於殼體內。多個中空攪拌棒設置於中空管的外側面上且位於殼體內。空氣壓縮機流體連接中空管。電熱棒位於中空管中。防飛屑組件設置於殼體上且流體連接廢棄物乾燥空間，並配置以防止初始廢棄物及/或乾燥廢棄物飛離廢棄物乾燥空間。廢棄物乾燥裝置可以增加廢棄物的乾燥效率並減少廢棄物的損失。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A waste drying device includes a reaction tank, an air compressor, an electric heating rod, and a debris prevention assemble. The reaction tank includes a housing, a hollow tube, and a plurality of hollow stirring rods. The housing has a waste drying space for accommodating an initial waste and a dried waste. The hollow tube is disposed on a sidewall of the housing and located inside the housing. The plurality of hollow stirring rods is disposed on an outer surface of the hollow tube and located in the housing. The air compressor is fluidly connected to the hollow tube. The heating rod is located in the hollow tube. The debris prevention assemble is disposed on the housing and fluidly connected to the waste drying space, and is configured to prevent the initial waste and/or the dried waste from flying out of the waste drying space. The waste drying device can increase waste drying efficiency and reduce waste losses.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:廢棄物乾燥裝置</p>
        <p type="p">110:反應槽</p>
        <p type="p">112:殼體</p>
        <p type="p">114:中空管</p>
        <p type="p">116:中空攪拌棒</p>
        <p type="p">118:攪拌撥片</p>
        <p type="p">119:工作窗口</p>
        <p type="p">120:空氣壓縮機</p>
        <p type="p">130:電熱棒</p>
        <p type="p">140:防飛屑組件</p>
        <p type="p">142:腔體</p>
        <p type="p">146:出風口</p>
        <p type="p">150:氣流控制器</p>
        <p type="p">160:氣流計</p>
        <p type="p">170:電力調整器</p>
        <p type="p">180:加熱裝置</p>
        <p type="p">DS:廢棄物乾燥空間</p>
        <p type="p">EP:端部</p>
        <p type="p">ES:外部空間</p>
        <p type="p">H:出氣孔</p>
        <p type="p">OS:外側面</p>
        <p type="p">RA:旋轉軸</p>
        <p type="p">SW1,SW2,SW3:側壁</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="429" publication-number="202624092">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624092</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147874</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>轉動軸結構及其組裝方法</chinese-title>
        <english-title>A ROTATING SHAFT STRUCTURE AND A ASSEMBLING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250217B">B65D43/26</main-classification>
        <further-classification edition="200601120250217B">B65D77/04</further-classification>
        <further-classification edition="200601120250217B">B65D25/10</further-classification>
        <further-classification edition="200601120250217B">B65D55/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>兆利科技工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JARLLYTEC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱國銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, KUO MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁鐵生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉偉隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之轉動軸結構包括一第一殼體，第一殼體具有一定位孔，一第二殼體具有第一、第二定位部；一轉動組件之一阻尼裝置之一端卡合連接第一定位部，另一端限位於定位孔內；一凹凸輪組件之一端卡合連接第二定位部，另一端具有第一、第二凹凸輪，第一凹凸輪限位於定位孔內；一彈性伸縮件之一端連接阻尼裝置，另一端連接凹凸輪組件；組裝時，將阻尼裝置、彈性伸縮件及凹凸輪組件依序經由定位孔之一端插入定位孔內，再經由彈性伸縮件分別將阻尼裝置及凹凸輪組件分別頂出，藉以卡合連接第一定位部及第二定位部以完成組裝。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The rotating shaft structure of the present invention includes a first housing, the first housing has a positioning hole, a second housing has first and second positioning parts; one end of the damping device of the rotating component is snap-connected to the first The positioning part, the other end is limited in the positioning hole; one end of a concave cam assembly is snap-connected to the second positioning part, and the other end has first and second concave cams, the first concave cam is limited in the positioning hole; an elastic telescopic component one end is connected to the damping device, and the other end is connected to the concave and cam assembly; during assembly, the damping device, the elastic telescopic part and the concave and cam assembly are inserted into the positioning hole in sequence through one end of the positioning hole, and then the damping device and concave and convex assembly are respectively connected through the elastic telescopic part. The wheel assemblies are respectively pushed out to engage and connect the first positioning part and the second positioning part to complete the assembly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:轉動軸結構</p>
        <p type="p">2:第一殼體</p>
        <p type="p">21:凸出部</p>
        <p type="p">22:定位孔</p>
        <p type="p">221:第一長切面</p>
        <p type="p">3:第二殼體</p>
        <p type="p">31:凹陷部</p>
        <p type="p">32:第一定位部</p>
        <p type="p">33:直槽部</p>
        <p type="p">34:第二定位部</p>
        <p type="p">4:轉動組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="430" publication-number="202625327">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625327</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147875</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>能源管理系統的運作方法</chinese-title>
        <english-title>OPERATION METHOD OF AN ENERGY MANAGEMENT SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H02J3/38</main-classification>
        <further-classification edition="200601120260302B">H02J7/10</further-classification>
        <further-classification edition="202601120260302B">H02J13/00</further-classification>
        <further-classification edition="202401120260302B">G06Q50/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>微電能源股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICRO ELECTRICITY CO. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪國勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, KUO-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昱穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案之發明揭露一種能源管理系統的運作方法，利用一雲端平臺，執行一演算法，以一或多個雲端能源管理系統對應地管理一或多個在地端的能源管理系統。尤其是，所述能源管理系統的運作方法係利用一雲端調度引擎執行所述演算法，於再生能源使用比例優化、轉供達成率優化以及電費優化的目標下，提高太陽能發電的利用率，減少對外部電網的依賴。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An operation method of an energy management system is disclosed. The operation method uses a cloud platform to execute an algorithm to correspondingly manage one or more on-premises energy management systems with one or more cloud energy management systems. In particular, the operation method of the energy management system utilizes a cloud scheduling engine to execute the algorithm, with the goals of optimizing the proportion of renewable energy usage, thereby optimizing the transfer rate and optimizing the electricity bill. In doing so, the utilization rate of solar power generation is improved and dependence on external grid is reduced.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="431" publication-number="202625244">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625244</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147878</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>驗證工件對準之系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD OF VERIFYING WORKPIECE ALIGNMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">H01J37/317</main-classification>
        <further-classification edition="202601120260302B">H10P72/70</further-classification>
        <further-classification edition="202601120260302B">H10P72/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾克塞利斯科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AXCELIS TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>努里　尤瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOURI, YUSEF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種用於使用一可伸縮感測器判定一工件於一工件支撐件上之一對準的工件加工系統及方法。當該工件支撐件旋轉時，一感測器相對於該工件支撐件之一邊緣移入/移出以獲得位置資料。基於該位置資料，可判定該工件與該工件支撐件之該對準。在判定該對準之後，該感測器可縮回該工件支撐件後方，使得該感測器在離子植入期間由該工件支撐件屏蔽以免受一離子束影響。使用一螺旋運動，該感測器與該工件支撐件之一支撐表面之間的一角度可在量測期間保持近似恆定。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A workpiece processing system and method are disclosed for determining an alignment of a workpiece upon a workpiece support using a retractable sensor. A sensor moves in/out relative to an edge of the workpiece support to obtain positional data while the workpiece support is rotated. Based on the positional data, the alignment of the workpiece and workpiece support may be determined. After determining the alignment, the sensor may be retracted behind the workpiece support, such that the sensor is shielded by the workpiece support from an ion beam during ion implantation. Using a helical motion, an angle between the sensor and a support surface of the workpiece support may be maintained approximately constant during the measurement.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:工件加工系統</p>
        <p type="p">102:工件</p>
        <p type="p">104:加工介質</p>
        <p type="p">106:加工介質源</p>
        <p type="p">112:工件支撐件</p>
        <p type="p">114:加工腔室</p>
        <p type="p">116:加工介質入口</p>
        <p type="p">118:傳送腔室</p>
        <p type="p">120:傳送設備</p>
        <p type="p">122:傳送腔室支撐件</p>
        <p type="p">126:加工環境</p>
        <p type="p">128:外部環境</p>
        <p type="p">130:傳送腔室通道</p>
        <p type="p">132:支撐表面</p>
        <p type="p">134:支撐平面</p>
        <p type="p">136:加工位置</p>
        <p type="p">138:工件定位設備</p>
        <p type="p">140:加工介質路徑</p>
        <p type="p">142:機器人設備</p>
        <p type="p">144:工件支撐軸</p>
        <p type="p">146:周邊區</p>
        <p type="p">150:工件表徵系統</p>
        <p type="p">152:感測器</p>
        <p type="p">154:第一位置</p>
        <p type="p">156:第二位置</p>
        <p type="p">158:致動器</p>
        <p type="p">160:耦接設備</p>
        <p type="p">162:控制器</p>
        <p type="p">164:周緣</p>
        <p type="p">x:x軸</p>
        <p type="p">y:y軸</p>
        <p type="p">z:z軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="432" publication-number="202625069">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625069</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147880</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>綠電匹配方法</chinese-title>
        <english-title>GREEN POWER MATCHING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120260302B">G06Q50/06</main-classification>
        <further-classification edition="202601120260302B">H02J3/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>微電能源股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICRO ELECTRICITY CO. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪國勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, KUO-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昱穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案之發明揭露一種綠電匹配方法，包括：整合能源數據；建立一能源匹配公式，以計算一再生能源比例，其中該再生能源比例係實際可供應的發電量以及總需求電量的函數；根據經整合之該能源數據以及約束條件，透過該能源匹配公式進行迭代優化運算而產生一能源匹配清單；以及根據最小餘電量和該再生能源比例的一目標值，在該能源匹配清單中決定一最佳綠電組合配置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A green power matching method is disclosed. The method includes: integrating energy data; establishing an energy matching formula to calculate a renewable energy ratio, where the renewable energy ratio is a function of the actual power generation capacity that can be supplied and the total demand power; generating an energy matching list, according to the integrated energy data and constraint conditions, by using the energy matching formula through iterative optimization; and determining a best green power combination configuration, based on the minimum remaining power and a target value of the renewable energy ratio, in the energy matching list.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="433" publication-number="202624617">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624617</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147884</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>吊扇控制系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250109B">F04D25/08</main-classification>
        <further-classification edition="200601120250109B">F04D27/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德禮實業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林國尊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KUO-TSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種吊扇控制系統，包含複數吊扇、複數遙控裝置及一控制單元。每一該吊扇以RF技術與該遙控裝置通訊，以Wi-Fi或藍牙技術與該控制單元通訊。每一該吊扇與每一該遙控裝置皆設置有指撥開關模組，並分別設置9個位元以上且相匹配的配對位址。該控制單元儲存該等吊扇的配對位址。於一配對階段，該遙控裝置輸出自身的配對位址與一滾動碼，該吊扇於判斷位址匹配時紀錄該滾動碼。於一運作階段，該遙控裝置輸出自身的配對位址、該滾動碼與一控制資訊，該吊扇於判斷位址匹配且該滾動碼相同時，根據該控制資訊進行控制。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:吊扇</p>
        <p type="p">22:第一傳輸模組</p>
        <p type="p">23:第二傳輸模組</p>
        <p type="p">24:動力模組</p>
        <p type="p">25:吊扇指撥開關模組</p>
        <p type="p">26:控制模組</p>
        <p type="p">3:遙控裝置</p>
        <p type="p">31:遙控傳輸模組</p>
        <p type="p">32:遙控指撥開關模組</p>
        <p type="p">33:運算模組</p>
        <p type="p">4:控制單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="434" publication-number="202625637">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625637</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147885</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發光裝置</chinese-title>
        <english-title>LIGHT EMITTING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250307B">H10H20/851</main-classification>
        <further-classification edition="202501120250307B">H10H20/857</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林小郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIAO-LANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡宗翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, TSUNG-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種發光裝置，其包括基板、第一電晶體、第一發光單元以及色彩轉換結構。第一電晶體與第一發光單元設置在基板上。色彩轉換結構設置在第一電晶體與第一發光單元之間，色彩轉換結構具有重疊於第一發光單元的第一部分與相鄰於第一部分的第二部分。第一發光單元的光線穿過第一部分與基板，第一發光單元透過第二部分電連接於第一電晶體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light emitting device includes a substrate, a first transistor, a first light emitting unit and a color conversion structure. The first transistor and the first light emitting unit are disposed on the substrate. The color conversion structure is disposed between the first transistor and the first light emitting unit, and has a first portion overlapped with the first light emitting unit and a second portion adjacent to the first portion. A light of the first light emitting unit passes through the first portion and the substrate, and the first light emitting unit is electrically connected to the first transistor through the second portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:發光裝置</p>
        <p type="p">110:基板</p>
        <p type="p">110s:下表面</p>
        <p type="p">120:電路元件層</p>
        <p type="p">120i1,120i2,120i3,120i4,140i,146,IN1,IN2:絕緣層</p>
        <p type="p">122:電晶體</p>
        <p type="p">122a:第一電晶體</p>
        <p type="p">122b:第二電晶體</p>
        <p type="p">122c:第三電晶體</p>
        <p type="p">124:訊號線</p>
        <p type="p">126C1,126C2,126C3,126C4,CCX1,CCX2:導電件</p>
        <p type="p">130:發光單元</p>
        <p type="p">130a:第一發光單元</p>
        <p type="p">130b:第二發光單元</p>
        <p type="p">130c:第三發光單元</p>
        <p type="p">132,132_1,132_2:接腳</p>
        <p type="p">134,134_1,134_2:導電部</p>
        <p type="p">136:發光體</p>
        <p type="p">140:色彩轉換結構</p>
        <p type="p">140p1:第一部分</p>
        <p type="p">140p2:第二部分</p>
        <p type="p">140p3:第三部分</p>
        <p type="p">140s1,140s2:子結構層</p>
        <p type="p">142:色彩轉換單元</p>
        <p type="p">142a:第一色彩轉換單元</p>
        <p type="p">142b:第二色彩轉換單元</p>
        <p type="p">144,144c:光散射單元</p>
        <p type="p">148:濾色片</p>
        <p type="p">148a:第一濾色片</p>
        <p type="p">148b:第二濾色片</p>
        <p type="p">148c:第三濾色片</p>
        <p type="p">150:反射層</p>
        <p type="p">160:像素定義層</p>
        <p type="p">160a,160b:子層</p>
        <p type="p">162:部</p>
        <p type="p">162a:第一部</p>
        <p type="p">162b:第二部</p>
        <p type="p">AL:絕緣膠</p>
        <p type="p">CH:通道層</p>
        <p type="p">CM1,CM2,CM3,CM4,CM5,CM6:導電元件</p>
        <p type="p">CS1,CS2:導電結構</p>
        <p type="p">D1,D2,D3,D4:深度</p>
        <p type="p">DE:汲極</p>
        <p type="p">GE:閘極</p>
        <p type="p">OP1,OP2,OP3,OP4:開口</p>
        <p type="p">PL1,PL2:絕緣保護層</p>
        <p type="p">SE:源極</p>
        <p type="p">SP,SP1,SP2,SP3:子像素</p>
        <p type="p">WC,WS,W1,W2:寬度</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="435" publication-number="202625449">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625449</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147891</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無人機鏡頭模組化控制裝置及其控制方法</chinese-title>
        <english-title>MODULAR CONTROL DEVICE FOR DRONE CAMERA AND CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250303B">H04N23/60</main-classification>
        <further-classification edition="202301120250303B">H04N23/66</further-classification>
        <further-classification edition="202301120250303B">B64U20/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神耀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITAC ADVANCE TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃予</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王襄畇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HSIANG-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李旻燁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MIN-YEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林坤成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種無人機鏡頭模組化控制裝置，其包含輸入模組、儲存模組、控制模組及處理模組。輸入模組接收包含製造商名稱及產品型號的輸入指令。儲存模組儲存功能模板及複數個功能指令檔。控制模組提供複數個標準化功能鍵。處理模組由該些功能指令檔中選擇與製造商名稱及產品型號對應的功能指令檔，並將選定的功能指令檔的複數個功能指令與功能模板比對以找出與各個功能指令對應的標準化功能鍵，使該些標準化功能鍵能控制與製造商名稱及產品型號對應的酬載。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A modular control device for drone camera includes an input module, a storage module, a control module, and a processing module. The input module receives an input command including the manufacturer’s name and product model. The storage module stores a function template and a plurality of function command files. The control module provides a plurality of standardized function keys. The processing module selects a function command file corresponding to the manufacturer’s name and product model from the function command files and compares the function commands in the selected function command file with the function template to identify standardized function keys corresponding to each function command, such that the standardized function keys cam be used to control the camera corresponding to the manufacturer’s name and product model.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:無人機鏡頭模組化控制裝置</p>
        <p type="p">11:輸入模組</p>
        <p type="p">12:儲存模組</p>
        <p type="p">13:處理模組</p>
        <p type="p">14:控制模組</p>
        <p type="p">15:通訊模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="436" publication-number="202623737">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623737</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147892</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>凹形方管升降置物架</chinese-title>
        <english-title>CONCAVE SQUARE TUBE LIFTING STORAGE SHELF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">A47F7/00</main-classification>
        <further-classification edition="200601120241231B">A47F5/10</further-classification>
        <further-classification edition="200601120241231B">A47B47/00</further-classification>
        <further-classification edition="200601120241231B">F16B12/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盈太企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PROTREND CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳順義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHUN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林坤成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種凹形方管升降置物架，包括複數個立柱組、多個組裝固定件及多個置物層。立柱組分別包括凹形方管及長形孔被扣件，這些長形孔被扣件每隔一段距離分別組設於凹形板件。立柱組之上端與下端位置分別組裝一個組裝固定件。多個置物層分別包括一活動層架及四個組裝組件，四個組裝組件分別設於活動層架的四個角落，這些置物層能沿升降方向移動，四個組裝組件包括多個凸出柱體，這些凸出柱體分別扣合於長形孔被扣件之扣合孔之內，以將置物層組立於這些立柱組之間，且位於這些立柱組之上端與之下端的組裝組件分別貼合於相對應之組裝固定件之外表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A concave square tube lifting storage shelf is provided. The concave square tube lifting storage shelf includes a plurality of post components, several assembly fixtures, and multiple storage layers. Each post components includes a hollow square tube and an elongated hole secured by fasteners, which are arranged at intervals along the hollow square tube. The upper and lower ends of the post components are each equipped with an assembly fixture. The multiple storage layers each include a movable shelf and four assembly components, which are positioned at the four corners of the movable shelf. These storage layers move along a lifting direction. The four assembly components each have multiple protruding columns, which are respectively engaged with the engagement holes of the elongated hole secured by fasteners to assemble the storage layers between the post components. The upper and lower assembly fixtures are attached to the outer surface of the corresponding assembly fixtures at the upper and lower ends of the pillar assemblies.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:凹形方管升降置物架</p>
        <p type="p">110:立柱組</p>
        <p type="p">112:凹形方管</p>
        <p type="p">120:置物層</p>
        <p type="p">122:組裝組件</p>
        <p type="p">170:腳柱</p>
        <p type="p">180:蓋合件</p>
        <p type="p">L1:堆疊方向</p>
        <p type="p">LA:升降方向</p>
        <p type="p">T1:上端</p>
        <p type="p">T2:下端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="437" publication-number="202625157">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625157</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147896</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>饒舌歌詞產生方法及其模型訓練方法、饒舌旋律產生模型訓練方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">G10H1/00</main-classification>
        <further-classification edition="201301120250303B">G10L13/02</further-classification>
        <further-classification edition="202301120250303B">G06N3/08</further-classification>
        <further-classification edition="202301120250303B">G06N3/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長庚大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG GUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立清華大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇豐文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOO, VON-WUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡祐瑄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, YO-SHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種饒舌歌詞產生模型訓練方法，該饒舌歌詞產生模型用於產生插入一歌曲的一饒舌歌詞，由一電子裝置來實施，包含以下步驟：(A)對於每一饒舌歌詞訓練資料，根據該饒舌歌詞訓練資料進行特徵嵌入，以獲得一嵌入資料；(B)對於每一嵌入資料，利用一深度學習模型的一編碼器，根據該嵌入資料進行編碼，以產生一編碼資料；(C)對於每一編碼資料，利用該深度學習模型的一解碼器，根據該編碼資料進行解碼，以獲得一解碼結果；及(D)根據所有解碼結果調整該深度學習模型參數，並重複步驟(B)~(C)，直到該深度學習模型收斂。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">21~25:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="438" publication-number="202623708">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623708</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147897</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>組合式寵物推拖車</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250214B">A01K1/02</main-classification>
        <further-classification edition="200601120250214B">B62B3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>優利冠企業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古博升</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種組合式寵物推拖車，其包含一車架，車架設置有一底座、一扶手、複數車輪、複數前連接部及複數後連接部，各前連接部設置於底座的前端，且每一前連接部包含一卡榫，各後連接部設置於底座的後端；一寵物屋，其包含一框架結構及一遮罩，框架結構具有一下前支架及一下後支架，遮罩套設於框架結構，寵物屋以下前支架組裝於各前連接部，且每一卡榫可卡合於下前支架，下後支架可分離的組裝於各後連接部；藉此達到本發明可快速的組裝寵物屋或與底座分離，不但具有寵物推車之功能外，還能同時兼具寵物屋之功能，進而提升使用上之便利性及通用性，以節省成本及佔據之空間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:車架</p>
        <p type="p">11:底座</p>
        <p type="p">12:扶手</p>
        <p type="p">13:車輪</p>
        <p type="p">14:連接部</p>
        <p type="p">2:寵物屋</p>
        <p type="p">20:框架結構</p>
        <p type="p">26:遮罩</p>
        <p type="p">30:拖車桿組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="439" publication-number="202624080">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624080</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147898</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>細喉型水中推進裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250317B">B63H11/04</main-classification>
        <further-classification edition="200601120250317B">B63H11/103</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立高雄科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張弘道</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>俞克維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連長華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張皓欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作係一種細喉型水中推進裝置，其係用以設置於載體內，細喉型水中推進裝置包含依序連接之入口管道、泵浦、迴流管以及細喉管，泵浦係透過入口管道連接載體的流體入口，迴流管包含連接泵浦之第一彎曲段及第二彎曲段，細喉管包含依序連接之匯聚段、細喉部以及發散段，細喉管的匯聚段係連接迴流管的第二彎曲段，且細喉部的口徑係小於匯聚段及發散段的口徑，而發散段係連接所述載體之流體出口，本創作能透過泵浦將流體輸入迴流管內，並藉由迴流管搭配細喉管的結構設計，大幅提高流體的流速，進而提供良好的推進效果，藉此能有效減少泵浦的電功率需求，進而達到降低能源消耗之效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:入口管道</p>
        <p type="p">20:泵浦</p>
        <p type="p">30:迴流管</p>
        <p type="p">31:第一彎曲段</p>
        <p type="p">311:第一彎管部</p>
        <p type="p">312:第二彎管部</p>
        <p type="p">32:第二彎曲段</p>
        <p type="p">321:第三彎管部</p>
        <p type="p">322:第四彎管部</p>
        <p type="p">40:細喉管</p>
        <p type="p">41:匯聚段</p>
        <p type="p">42:細喉部</p>
        <p type="p">43:發散段</p>
        <p type="p">60:載體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="440" publication-number="202624698">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624698</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147900</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學測距器的動態雜訊辨識系統</chinese-title>
        <english-title>THE DYNAMIC NOISE IDENTIFICATION SYSTEM FOR OPTICAL DISTANCE METERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250418B">G01C3/06</main-classification>
        <further-classification edition="200601120250418B">G06T5/10</further-classification>
        <further-classification edition="202301120250418B">G06N3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　招慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JAO CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　招慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JAO CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧宇勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TENG, YU-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宜誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學測距器的動態雜訊辨識系統，該系統包含一發射單元、一接收單元以及一控制中心，該發射單元輸出一光源形成一發射訊號；該接收單元將該光源之一反射訊號傳遞至該控制中心，該反射訊號包含一目標訊號以及一雜訊訊號，本發明於進行光學測距時即時建立動態一雜訊閾值，並透過一數位濾波器設置於該控制中心初步濾除該光學測距器之系統雜訊，且進一步結合機器學習之數據演算法，進而達成能夠即時辨識該雜訊訊號，進一步降低量測誤差之效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A dynamic noise identification system for optical distance meters includes an emitting unit, a receiving unit, and a control center. The emitting unit outputs a light source to form an emission signal, while the receiving unit transmits a reflected signal from the light source, containing both target and noise signals, to the control center. This invention establishes a noise threshold in advance during optical distance measurement and utilizes a digital filter in the control center to preliminarily filter out system noise. Additionally, this invention corporates a machine learning-based data algorithm, enabling real-time noise signal recognition and effectively reducing measured errors.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:發射單元</p>
        <p type="p">20:接收單元</p>
        <p type="p">30:控制中心</p>
        <p type="p">31:數位訊號處理器</p>
        <p type="p">311:數位濾波器</p>
        <p type="p">32:資料庫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="441" publication-number="202625540">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625540</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147907</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>散熱模組</chinese-title>
        <english-title>HEAT DISSIPATION MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241229B">H05K7/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>技嘉科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIGA-BYTE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃順治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHUN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>毛黛娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAO, TAI-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仲崇遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHONG, JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭春亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, CHUN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種散熱模組，用以冷卻一熱源。散熱模組包含一散熱鰭片組、一入流風扇組以及至少一出流風扇組。散熱鰭片組用以熱接觸熱源，且散熱鰭片組具有一入風側以及相鄰於入風側的至少一出風側。入流風扇組設置於入風側，且出流風扇組設置於出風側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A heat dissipation module is configured to cool a heat source. The heat dissipation module includes a heat dissipation fin assembly, an inflow fan assembly, and at least one outflow fan assembly. The heat dissipation fin assembly is configured to be in thermal contact with the heat source, and the heat dissipation fin assembly has an inflow side and at least one outflow side adjacent to the inflow side. The inflow fan assembly is disposed on the inflow side, and the outflow fan assembly is disposed on the outflow side.</p>
      </isu-abst>
      <representative-img>
        <p type="p">9:熱源</p>
        <p type="p">1:散熱模組</p>
        <p type="p">10:散熱鰭片組</p>
        <p type="p">12:入流風扇組</p>
        <p type="p">14:出流風扇組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="442" publication-number="202625432">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625432</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147909</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>投影裝置及其控制方法</chinese-title>
        <english-title>PROJECTION DEVICE AND CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">H04N9/31</main-classification>
        <further-classification edition="200701120250401B">H02M1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中強光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORETRONIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾子銓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, TZU-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖允在</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, YUN-TZAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種投影裝置及其控制方法，該投影裝置包括電源轉換單元、第一偵測單元、第二偵測單元、運算單元以及控制單元。藉由運算單元接收來自第一偵測單元的第一電壓偵測值及來自第二偵測單元的電流偵測值，運算單元根據電流偵測值計算出功耗總和值，控制單元根據第一電壓偵測值及功耗總和值控制至少一耗能元件的功耗，如此可良好控制投影裝置的運作功耗，使投影裝置達到最佳化的亮度效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a projection device and a control method thereof. The projection device comprises a power conversion unit, a first detection unit, a second detection unit, a computing unit and a control unit. The computing unit receives a first voltage detection value from the first detection unit and a current detection value from the second detection unit. The computing unit calculates a total power consumption value according to the current detection value. The control unit controls the power consumption of at least one energy consumption element according to the first voltage detection value and the total power consumption value, thereby well controlling the operational power consumption of the projection device. The optimal brightness effect of the projection device is achieved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:投影裝置</p>
        <p type="p">11:電源轉換單元</p>
        <p type="p">111:輸入端</p>
        <p type="p">112:輸出端</p>
        <p type="p">12:第一偵測單元</p>
        <p type="p">13:第二偵測單元</p>
        <p type="p">14:運算單元</p>
        <p type="p">15:控制單元</p>
        <p type="p">16:耗能元件</p>
        <p type="p">V&lt;sub&gt;AC&lt;/sub&gt;:交流電壓</p>
        <p type="p">V&lt;sub&gt;DC&lt;/sub&gt;:直流電壓</p>
        <p type="p">VD1:第一電壓偵測值</p>
        <p type="p">ID:電流偵測值</p>
        <p type="p">TP:功耗總和值</p>
        <p type="p">SC:控制訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="443" publication-number="202624925">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624925</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147910</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>透過導風罩連通電源供應器與系統風扇的伺服器</chinese-title>
        <english-title>SERVER CONNECTING POWER SUPPLY AND SYSTEM FAN THROUGH AIR DUCT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250418B">G06F1/20</main-classification>
        <further-classification edition="200601120250418B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>技鋼科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIGA COMPUTING TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃進權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHING CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃肇湘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHAO HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHUN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張馨予</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HSIN YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭宗庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, TSUNG TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林聿萱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種伺服器，包含一機殼、至少一電源供應器、至少一系統風扇、至少一導風罩以及一液冷模組。機殼具有一容置空間。至少一電源供應器位於容置空間。至少一電源供應器之相對兩側具有相連通的一進風口以及一出風口。至少一系統風扇位於容置空間，並用以產生一散熱氣流。散熱氣流自進風口流向出風口。至少一導風罩連通至少一電源供應器之出風口與至少一系統風扇，並導引散熱氣流自出風口流入容置空間。液冷模組位於容置空間。至少一系統風扇位於至少一電源供應器與液冷模組之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A server includes a casing, at least one power supply, at least one system fan, at least one air duct and a liquid cooling module. The casing has an accommodating space. The at least one power supply is located in the accommodating space. Two opposite sides of the at least one power supply have an air inlet and an air outlet which are in fluid communication with each other. The at least one system fan is located in the accommodating space, and is configured to generate a cooling airflow. The cooling airflow flows from the air inlet to the air outlet. The at least one air duct is connected to the air outlet of the at least one power supply and the at least one system fan, and guides the cooling airflow to flow from the air outlet into the accommodating space. The liquid cooling module is located in the accommodating space. The at least one system fan is located between the at least one power supply and the liquid cooling module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:伺服器</p>
        <p type="p">11:機殼</p>
        <p type="p">111:容置空間</p>
        <p type="p">12:主機板</p>
        <p type="p">13:液冷模組</p>
        <p type="p">14:中繼板</p>
        <p type="p">15:電源供應器</p>
        <p type="p">151:進風口</p>
        <p type="p">152:出風口</p>
        <p type="p">16:系統風扇</p>
        <p type="p">17:導風罩</p>
        <p type="p">18:硬碟</p>
        <p type="p">A~C:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="444" publication-number="202624701">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624701</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147912</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光成份檢測系統及方法</chinese-title>
        <english-title>LIGHT COMPONENT DETECTOR SYSTEM AND DETECTING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250512B">G01J1/42</main-classification>
        <further-classification edition="200601120250512B">G03F7/20</further-classification>
        <further-classification edition="201201120250512B">G03F1/84</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳政憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHENG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖淑君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, SHU-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開提出一種光成份檢測器及方法。光成份檢測器，適於檢測半導體製程設備的光源，光成份檢測器包含：基板、至少一檢測元件以及多個鍍膜區塊。所述至少一檢測元件設置於基板上。所述多個鍍膜區塊設置於所述至少一檢測元件上，且分別具有多個厚度，所述多個厚度分別對應於多個光波長。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure proposes a light component detector and detecting method. The light component detector, for detecting a light source of semiconductor processing equipment, includes: a substrate, at least one detecting element and coating blocks. The at least one detecting element is disposed on the substrate. The coating blocks are disposed on the at least one detecting element and have thicknesses, respectively. The thicknesses correspond to wavelengths of light, respectively.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板</p>
        <p type="p">11:檢測元件</p>
        <p type="p">1a:檢測平台</p>
        <p type="p">T:承載平台</p>
        <p type="p">L:光源</p>
        <p type="p">L’:照射區</p>
        <p type="p">P:承載板</p>
        <p type="p">D:長度</p>
        <p type="p">C:充電單元</p>
        <p type="p">B:電源供應單元</p>
        <p type="p">A:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="445" publication-number="202625108">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625108</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147913</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具全天候保障獨居者隱私與跌倒精準警示的室內監視系統</chinese-title>
        <english-title>AN INDOOR SURVEILLANCE SYSTEM WITH 24/7 FUNCTIONS FOR THE PEOPLE LIVING ALONE TO PROTECT THE PRIVACY AND PROVIDE ACCURATE FALL WARNINGS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250401B">G06V40/20</main-classification>
        <further-classification edition="202201120250401B">G06V20/52</further-classification>
        <further-classification edition="200601120250401B">G08B21/04</further-classification>
        <further-classification edition="200601120250401B">G08B21/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝基生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHI-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝文皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, WEN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝基生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHI-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝文皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, WEN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">獨居老年人的跌倒對其健康構成重大風險，然而，傳統的跌倒偵測設備常用攝影涉及隱私或容易被老人遺忘按下求救鈕或拒絕麻煩使用的穿戴式配備，因此，本發明提出了一種利用毫米波以調頻連續波(FMCW)檢測的理論作為主感測器，實現包括移動、靜止和跌倒在內活動檢測的點雲數據以及；用以同步比照利用一種多光譜熱像儀作為附感測器產生化身輪廓的多光譜影像包含可自動檢測體溫、室內溼度、跌倒前預測和警告護理人員的功能，達到確保獨居老人的隱私與安全監視的高精確度、實現就地老化、遠距智能照護的系統裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Falls of elderly people living alone pose a significant risk to their health. However, the traditional fall-detection equipment commonly used for photography involves privacy or is easy for the elderly to forget to press the help-button or refuse to use the troublesome wearable equipment. Therefore, the present invention proposes a signal-detection-theory of frequency modulated continuous wave (FMCW) detection using millimeter waves as the main sensor to achieve point-cloud data for activity detection including movement, stationary and falling; for simultaneous comparison, a multi-spectral thermal imaging camera is used as an accessory the multispectral-image generated by the sensor's avatar profile includes functions that can automatically detect body temperature, indoor humidity, predict falls before and warn caregivers, achieving high accuracy in ensuring the privacy and safety monitoring of elderly people living alone, enabling in-place aging, and remote-monitoring-intelligent care system device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:室內監視系統</p>
        <p type="p">110</p>
        <p type="p">120:毫米波雷達偵測器</p>
        <p type="p">1201:數據信息</p>
        <p type="p">12011</p>
        <p type="p">1202:觸發單元</p>
        <p type="p">130:多光譜熱像儀</p>
        <p type="p">1301:熱像鏡頭</p>
        <p type="p">13011:純熱像</p>
        <p type="p">1302:可見光鏡頭</p>
        <p type="p">13021:可見光影像</p>
        <p type="p">13022:提取邊緣的影像處理</p>
        <p type="p">130221:可見光邊緣</p>
        <p type="p">1303:阿爾法影像透明處理</p>
        <p type="p">13031:阿爾法化身影像</p>
        <p type="p">140:獨居老人</p>
        <p type="p">150:同步誤報比照</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="446" publication-number="202624926">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624926</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147914</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子設備</chinese-title>
        <english-title>ELECTRONIC APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250418B">G06F1/20</main-classification>
        <further-classification edition="200601120250418B">F28D15/02</further-classification>
        <further-classification edition="200601120250418B">F28F1/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何亞奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, YA-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳采亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, TSAI-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>饒達仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, DA-JENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林建羽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIEN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, WUN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子設備，包含槽體、電子模組及浸潤式熱交換模組。槽體容納一第一冷卻液。電子模組設置於槽體內以浸潤於第一冷卻液。浸潤式熱交換模組包含脈動式熱管及熱交換器。脈動式熱管部分地位於槽體內以浸潤於第一冷卻液中。脈動式熱管內填充有工作流體及界面活性劑，且脈動式熱管的真空度小於或等於8.0×10        &lt;sup&gt;-2&lt;/sup&gt;torr。熱交換器包含殼體及散熱鰭片，殼體具有入液通道、熱交換腔室及出液通道，入液通道及出液通道連通於熱交換腔室。散熱鰭片位於熱交換腔室內，脈動式熱管穿過殼體且熱耦合於散熱鰭片。散熱鰭片與熱交換腔室內的一第二冷卻液進行熱交換。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic apparatus includes a tank, an electronic module and an immersion-typed heat exchange module. The tank is configured to accommodate a first coolant. The electronic module is disposed in the tank to be immersed in the first coolant. The immersion-typed heat exchange module includes a plurality of pulsating heat pipes and a heat exchanger. The pulsating heat pipes are partially located in the tank to be immersed in the first coolant. Each of the pulsating heat pipes is filled with a working fluid and a surfactant, and a vacuum degree of each of the pulsating heat pipes is smaller than or equal to 8.0×10        &lt;sup&gt;-2&lt;/sup&gt;torr. The heat exchanger includes a casing and a heat sink. The casing has an inlet channel, a heat exchange chamber and an outlet channel. The inlet channel and the outlet channel communicate with the heat exchange chamber. The heat sink is located in the heat exchange chamber. The pulsating heat pipes are disposed through the casing and are thermally coupled to the heat sink. The heat sink is configured to perform heat exchange with a second coolant in the heat exchange chamber.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:槽體</p>
        <p type="p">20:電子模組</p>
        <p type="p">21:主機板</p>
        <p type="p">22:發熱元件</p>
        <p type="p">30:浸潤式熱交換模組</p>
        <p type="p">31:脈動式熱管</p>
        <p type="p">311:直線部</p>
        <p type="p">312:彎折部</p>
        <p type="p">313:連接部</p>
        <p type="p">32:熱交換器</p>
        <p type="p">321:殼體</p>
        <p type="p">3211:入液通道</p>
        <p type="p">3212:熱交換腔室</p>
        <p type="p">3213:出液通道</p>
        <p type="p">322:散熱鰭片</p>
        <p type="p">3221:孔洞</p>
        <p type="p">40:絕緣層</p>
        <p type="p">C1:第一冷卻液</p>
        <p type="p">M:混合物</p>
        <p type="p">C2:第二冷卻液</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="447" publication-number="202625136">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625136</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147921</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自校正電路與方法、顯示驅動晶片及資訊處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120250307B">G09G3/32</main-classification>
        <further-classification edition="202001120250307B">H05B45/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京集創北方科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIPONE TECHNOLOGY (BEIJING) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡龍山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉盛豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明主要揭示一種自校正電路，應用於一顯示驅動晶片之中，且包括：參考電壓獲取模塊，用於根據與該顯示驅動晶片相連的多個LED燈珠的平均順向導通電壓以獲得一校正參考電壓；誤差獲取模塊，用於獲取該校正參考電壓相對於一基準電壓的誤差；自校正模塊，用於對預充電電壓與該誤差進行加權處理以獲得一校正後預充電電壓，實現對於預充電電壓的校正。如此，通過對預充電電壓的自校正，使得該顯示驅動晶片輸出至LED顯示面板的多個預充電電壓一致，有效的避免了LED顯示面板出現色塊現象。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:LED顯示裝置</p>
        <p type="p">11:LED顯示面板</p>
        <p type="p">111:LED燈珠</p>
        <p type="p">12:顯示驅動晶片</p>
        <p type="p">121:恆流源</p>
        <p type="p">120:驅動開關元件</p>
        <p type="p">122:電壓提供單元</p>
        <p type="p">123:開關元件</p>
        <p type="p">13:行驅動電路</p>
        <p type="p">130:行開關元件</p>
        <p type="p">2:自校正電路</p>
        <p type="p">21:參考電壓獲取模塊</p>
        <p type="p">22:誤差獲取模塊</p>
        <p type="p">23:自校正模塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="448" publication-number="202625143">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625143</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147922</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>畫素電路、OLED顯示裝置及資訊處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120241227B">G09G3/3233</main-classification>
        <further-classification edition="200601120241227B">G09G5/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京歐錸德微電子技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OLED IC MICROELECTRONICS (BEIJING) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>席悅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高雪岭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>譚仲齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉盛豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明主要揭示一種畫素電路，用以和一OLED元件組成一個OLED畫素單元，從而應用在包含X×Y個OLED畫素單元的一OLED顯示面板中。本發明之畫素電路包括：一驅動單元、一儲存電容、一第一調光單元、一第二調光單元、以及一初始化單元。特別地，本發明以三個TFT元件組成所述驅動單元且同樣以三個TFT元件組成所述初始化單元，並且，令該第一調光單元和該第二調光單元皆包含一個TFT元件。依此設計，本發明之畫素電路具有以下優點：(1)實現對於驅動TFT元件的Vth補償；(2)滿足低刷新率(如：1Hz)的應用需求；(3)在skip frames時間區間內改善Vth飄移；以及(4)在高skip frames模式下適應性地調整調光信號(EM)的脈衝寬度以實現亮度補償並改善顯示閃爍現象。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">112:OLED元件</p>
        <p type="p">11S:源極線</p>
        <p type="p">2:畫素電路</p>
        <p type="p">20:開關單元</p>
        <p type="p">21:驅動單元</p>
        <p type="p">21C1:第一控制端</p>
        <p type="p">21C2:第二控制端</p>
        <p type="p">21C3:第三控制端</p>
        <p type="p">21T1:第一電性端</p>
        <p type="p">21T2:第二電性端</p>
        <p type="p">21T3:第三電性端</p>
        <p type="p">22:第一調光單元</p>
        <p type="p">22T1:第一電性端</p>
        <p type="p">22T2:第二電性端</p>
        <p type="p">22C0:控制端</p>
        <p type="p">23:第二調光單元</p>
        <p type="p">23T1:第一電性端</p>
        <p type="p">23T2:第二電性端</p>
        <p type="p">23C0:控制端</p>
        <p type="p">24:初始化單元</p>
        <p type="p">24C1:第一控制端</p>
        <p type="p">24C2:第二控制端</p>
        <p type="p">24C3:第三控制端</p>
        <p type="p">24T1:第一電性端</p>
        <p type="p">24T2:第二電性端</p>
        <p type="p">24T3:第三電性端</p>
        <p type="p">24T4:第四電性端</p>
        <p type="p">24T5:第五電性端</p>
        <p type="p">C1:儲存電容</p>
        <p type="p">M0:TFT元件</p>
        <p type="p">M1:第一TFT元件</p>
        <p type="p">M2:第二TFT元件</p>
        <p type="p">M3:第三TFT元件</p>
        <p type="p">M4:第四TFT元件</p>
        <p type="p">M5:第五TFT元件</p>
        <p type="p">M6:第六TFT元件</p>
        <p type="p">M7:第七TFT元件</p>
        <p type="p">M8:第八TFT元件</p>
        <p type="p">N1:第一共接點</p>
        <p type="p">N2:第二共接點</p>
        <p type="p">N3:第三共接點</p>
        <p type="p">N4:第四共接點</p>
        <p type="p">N5:第五共接點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="449" publication-number="202623938">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623938</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147923</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雷射加工裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120250416B">B23K26/70</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈦昇科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾卓君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱育民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張介豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種雷射加工裝置，包含一沿一運送方向延伸的運輸單元、多個沿該運送方向間隔設置於該運輸單元上的作業單元，及多個分別設置於該等作業單元下的運作單元。每一該運作單元包括一界定一能讓雷射光通過之開槽的下壓框板、一設置於該下壓框板下方的定位頂板、一用以帶動該定位頂板的升降機構，及多個配置於該下壓框板下方且用以固定該定位頂板的鎖定機構。該升降機構用以在一抬升該定位頂板而與該下壓框板定位該產品的抬升位置，及一相對於該抬升位置下降至該運輸單元下方，並使所述產品能在該運輸單元沿該運送方向運輸的待命位置之間移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:運輸單元</p>
        <p type="p">2:作業單元</p>
        <p type="p">21:工作模組</p>
        <p type="p">3:運作單元</p>
        <p type="p">31:下壓框板</p>
        <p type="p">310:開槽</p>
        <p type="p">32:定位頂板</p>
        <p type="p">33:升降機構</p>
        <p type="p">331:動力缸</p>
        <p type="p">332:帶動件</p>
        <p type="p">34:鎖定機構</p>
        <p type="p">4:確保單元</p>
        <p type="p">D:運送方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="450" publication-number="202624037">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624037</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147926</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智慧供電系統</chinese-title>
        <english-title>SMART POWER SUPPLY SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260302B">B60L53/63</main-classification>
        <further-classification edition="200601120260302B">H02J7/04</further-classification>
        <further-classification edition="202601120260302B">H02J3/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣車輛充電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN VEHICLE CHARGING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林敬哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JING-JHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃鐙緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TENG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一智慧供電系統，包括一市電端、一電動車、一智慧開關以及一用電端，該智慧開關具有多數個連接模式，該等連接模式包括一電網與電動車對用電端的連接模式、一電動車對用電端的連接模式以及一電動車對電網與用電端的連接模式；該電動車可選擇性地連接至該智慧開關；該智慧開關根據該市電端、該電動車或該用電端的訊號判斷電網系統的狀態是否發生改變，若是，該智慧開關切換成該等連接模式的其中之一，藉由該智慧開關的運作即時切換連接模式以構成智慧調控供電路徑，可妥善利用該電動車的電能，降低建置成本與建置空間，並降低電網負荷。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention provides an intelligent power supply system, comprising a utility power end, an electric vehicle, an intelligent switch, and a power consumption end. The intelligent switch has a plurality of connection modes, including a connection mode of the power grid and the electric vehicle to the power consumption end, a connection mode of the electric vehicle to the power consumption end, and a connection mode of the electric vehicle to the power grid and the power consumption end. The electric vehicle can be selectively connected to the intelligent switch. The intelligent switch determines whether the state of the power grid system has changed according to the signal from the utility power end, the electric vehicle, or the power consumption end. If so, the intelligent switch switches to one of the connection modes. By switching the connection mode in real time through the operation of the intelligent switch to form an intelligent regulated power supply path, the electric energy of the electric vehicle can be properly utilized, the construction cost and space can be reduced, and the load on the power grid can be reduced.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:市電端</p>
        <p type="p">20:電動車</p>
        <p type="p">21:電力儲存裝置</p>
        <p type="p">30:智慧開關</p>
        <p type="p">40:用電端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="451" publication-number="202625328">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625328</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147928</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電力變換裝置</chinese-title>
        <english-title>POWER CHANGING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H02J3/38</main-classification>
        <further-classification edition="200601220260302B">F27D11/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＭＥＩＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TMEIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大木𨺓広</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHKI, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柏木航平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KASHIWAGI, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種交流電弧爐用的電力變換裝置，其具備：變換器，係設在交流電弧爐的電極與輸入變壓器之間；及控制裝置，係控制變換器的動作；變換器係具有：變流器，係將供給自輸入變壓器的交流電力變換成直流電力；及逆變器，係將經變流器變換的直流電力變換成交流電力，而將變換後的交流電力輸出至電極側。藉此，能夠以更簡單的構成提高交流電弧爐所連接的電力系統的電源品質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a power changing device that includes a changer installed between electrodes of an AC arc furnace and an input transformer, and a control device for controlling the operation of the changer, the changer including a converter that converts AC power supplied from the input transformer into DC power, and an inverter that converts the DC power converted by the converter into AC power and outputs the converted AC power to the electrode side. This provides a power changing device for AC arc furnace that can improve the power quality of a power system to which the AC arc furnace is connected with simple a configuration.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:交流電弧爐</p>
        <p type="p">3:爐體</p>
        <p type="p">4:電極</p>
        <p type="p">5:輸出變壓器</p>
        <p type="p">6:爐用斷路器</p>
        <p type="p">7:輸入變壓器</p>
        <p type="p">10:電力變換裝置</p>
        <p type="p">12:變換器</p>
        <p type="p">14:控制裝置</p>
        <p type="p">20:變流器</p>
        <p type="p">22:逆變器</p>
        <p type="p">PS:電力系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="452" publication-number="202625117">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625117</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147932</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>降低開放性水域災害發生警示方法</chinese-title>
        <english-title>METHOD FOR REDUCING OPEN WATER HAZARDS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">G08B21/02</main-classification>
        <further-classification edition="200601120250602B">G08B21/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳誌泓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIHHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳東樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, TUNG HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王昱中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YU CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳佳琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIA-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳誌泓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIHHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳東樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, TUNG HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王昱中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YU CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳佳琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIA-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種降低開放性水域災害發生的方法，結合影像分析技術與GPS定位系統，透過設置兩條虛擬警戒線實現水域邊緣的即時監控。當物體穿越警戒線時，系統會自動啟動警報與廣播功能，並將資訊傳送至中央處理單元進行後續指令分配。系統基於GPS定位數據，自動指派距事發位置最近的行動裝置執行支援任務，有效提升應急反應效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a method for reducing hazards in open water areas by combining image analysis technology with a GPS positioning system. The system achieves real-time monitoring of water boundaries through the establishment of two virtual warning lines. When an object crosses the warning lines, the system automatically activates alarms and broadcasting functions, transmitting the information to a central processing unit for further command allocation. Based on GPS location data, the system automatically assigns the nearest mobile device to the incident location to execute support tasks, thereby improving emergency response efficiency.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="453" publication-number="202624159">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624159</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147934</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>玻璃組成物及玻璃纖維</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241216B">C03C3/093</main-classification>
        <further-classification edition="200601120241216B">C03C13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富喬工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FULLTECH FIBER GLASS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>雲林縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許憲忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HSIEN-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳壁程</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHERN, BIH-CHERNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張晉碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHING-SHUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張致源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅偉志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, WEI-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐文合</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, WEN-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種玻璃組成物，包含以該玻璃組成物的總量為100wt%計，56wt%～66wt%的SiO        &lt;sub&gt;2&lt;/sub&gt;、15wt%～22wt%的Al        &lt;sub&gt;2&lt;/sub&gt;O        &lt;sub&gt;3&lt;/sub&gt;、0.1wt%～3.5wt%的CaO、10wt%～18wt%的MgO、大於0wt%且小於2.5wt%的ZnO、大於0wt%且小於1wt%的CuO及4wt%～6wt%的B        &lt;sub&gt;2&lt;/sub&gt;O        &lt;sub&gt;3&lt;/sub&gt;，其中，[(CaO的含量+MgO的含量)/SiO        &lt;sub&gt;2&lt;/sub&gt;的含量]+{[(CaO的含量)        &lt;sup&gt;2&lt;/sup&gt;+MgO的含量]/[Al        &lt;sub&gt;2&lt;/sub&gt;O        &lt;sub&gt;3&lt;/sub&gt;的含量+(ZnO的含量)        &lt;sup&gt;2&lt;/sup&gt;]}為0.70至1.35。本發明亦提供一種包含該玻璃組成物的玻璃纖維。本發明玻璃組成物能夠賦予該玻璃纖維具有高楊氏模數的特性，且具有寬廣的玻璃纖維抽絲成型作業視窗。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="454" publication-number="202625763">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625763</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147936</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>夾具裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260316B">H10P72/76</main-classification>
        <further-classification edition="200601120260316B">B23Q3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈦昇科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾卓君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱育民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張介豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種夾具裝置，包含一本體單元、一安裝於該本體單元的夾持單元，及一用以驅動該夾持單元的驅動單元。該本體單元包括一載板，及一設置於該載板的延伸模組。每一該延伸模組具有一軌道，及二設置於該軌道的配置塊。該夾持單元包括四個分別設置於該等配置塊且適用於配合夾持目標物的夾片。每一該夾片具有一沿縱向延伸的平直面，及一自該平直面下方遠離另一該夾片傾斜，且形成有多個供該目標物伸置之鋸齒槽的傾斜面。該驅動單元包括一連結於該等配置塊的傳動機構，及一用以提供使該等配置塊在該軌道上同步反向移動之動力的動力馬達。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:本體單元</p>
        <p type="p">11:載板</p>
        <p type="p">111:頂面</p>
        <p type="p">112:底面</p>
        <p type="p">12:延伸模組</p>
        <p type="p">121:軌道</p>
        <p type="p">122:配置塊</p>
        <p type="p">2:夾持單元</p>
        <p type="p">21:夾片</p>
        <p type="p">22:可傾軸</p>
        <p type="p">24:壓制件</p>
        <p type="p">3:驅動單元</p>
        <p type="p">32:動力馬達</p>
        <p type="p">D1:第一軸向</p>
        <p type="p">H:縱軸向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="455" publication-number="202625276">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625276</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147941</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於鋰離子電池的放電方法</chinese-title>
        <english-title>METHOD FOR DISCHARGING LITHIUM-ION BATTERY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120250117B">H01M10/0525</main-classification>
        <further-classification edition="200601120250117B">H01M10/44</further-classification>
        <further-classification edition="200601120250117B">H01M10/54</further-classification>
        <further-classification edition="200601120250117B">C25C1/22</further-classification>
        <further-classification edition="200601120250117B">H01H83/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺南大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL UNIVERSITY OF TAINAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIA-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何麗貞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HER, LI-JANE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作提供一種用於鋰離子電池的放電方法，其包括，其包括將一待放電的鋰離子電池置於一放電組成液中進行放電，得到一經放電的鋰離子電池；其中，該放電組成液包含0.5 M至2 M的鹼性溶液和0.1 M至3 M的輔助劑，該輔助劑包含醋酸鹽、檸檬酸鹽、氯鹽、硫酸鹽、磷酸鹽、草酸鹽、有機酸、或其組合。藉由控制放電組成液的組成和濃度，本創作能高效、安全地對鋰離子電池進行放電，避免以往有毒之氯氣產生或者氯離子對鋰離子電池的罐體腐蝕，解決以往電池內部材料溶解、極片沾黏、後續回收處理困難等問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a method of discharging lithium-ion battery, which comprises placing a lithium-ion battery to be discharged in a discharge solution to obtain a discharged lithium-ion battery. The discharge solution includes 0.5 M to 2 M of alkaline solution and 0.1 M to 3 M of auxiliary agent. The auxiliary agent includes acetate, citrate, chloride, sulfate, phosphate, oxalate, organic acid, or any combinations thereof. The discharge solution with foresaid composition can efficiently and safely discharge the lithium-ion battery and avoid the generation of toxic chlorine gas or the corrosion of its case caused by chlorine ions, thereby solving the problems of dissolution of internal materials of battery, electrode sticking, and difficulties in subsequent recycling.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="456" publication-number="202624147">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624147</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147942</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>現地超微氣泡循環系統</chinese-title>
        <english-title>IN-SITU ULTRAFINE BUBBLE CIRCULATION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250423B">C02F3/34</main-classification>
        <further-classification edition="202301120250423B">C02F3/02</further-classification>
        <further-classification edition="202201120250423B">B01F25/312</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裕山環境工程股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUH SHAN ENVIRONMENTAL ENGINEERING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冠宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, KUAN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉原宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YUAN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張育祺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YU-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝伯林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIE, BO-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種現地超微氣泡循環系統包含抽水井、抽水幫浦、空壓機、多個文氏管、整治井、水力旋流噴頭以及篩管。抽水井與整治井鑽設於地表下。抽水幫浦配置以透過管路抽取地表下的地下水。空壓機配置以將氣體注入管路內之地下水中。多個文氏管配置以在地下水中形成多個第一超微氣泡。水力旋流噴頭配置以在來自多個文氏管之地下水通過時，將地下水中之多個第一超微氣泡改變成多個第二超微氣泡。篩管配置以將通過水力旋流噴頭之地下水中的多個第二超微氣泡改變成多個第三超微氣泡，以利用多個第三超微氣泡來整治地表下之地下水。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An in-situ ultrafine bubble circulation system includes a pumping well, a pump, an air compressor, a plurality of venture tubes, a remediation well, a hydrocyclone nozzle, and a sieve tube. The pumping well and the remediation well are drilled beneath an earth surface. The pump is configured to pump groundwater from beneath the earth surface through a pipeline. The air compressor is configured to inject gas into the groundwater within the pipeline. The plurality of venture tubes is configured to form a plurality of first ultrafine bubbles in the groundwater. The hydrocyclone nozzle is configured to change the plurality of first ultrafine bubbles in the groundwater into a plurality of second ultrafine bubbles when the groundwater from the plurality of venturi tubes passes through the hydrocyclone nozzle. The sieve tube is configured to change the plurality of second ultrafine bubbles in the groundwater passing through the hydrocyclone nozzle into a plurality of third ultrafine bubbles, so as to utilize the plurality of third ultrafine bubbles to remediate the groundwater under the earth surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:現地超微氣泡循環系統</p>
        <p type="p">110:抽水井</p>
        <p type="p">120:抽水幫浦</p>
        <p type="p">130:空壓機</p>
        <p type="p">140:文氏管</p>
        <p type="p">150:整治井</p>
        <p type="p">160:水力旋流噴頭</p>
        <p type="p">170:篩管</p>
        <p type="p">180:旋流空間</p>
        <p type="p">L1,L2,L3,L4:管路</p>
        <p type="p">S1:地表</p>
        <p type="p">S2:地下水面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="457" publication-number="202624056">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624056</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147944</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>行車資訊處理裝置及行車資料提供方法</chinese-title>
        <english-title>VEHICLE DATA PROCESSING DEVICE AND VEHICLE DATA PROVISION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120250429B">B60W30/08</main-classification>
        <further-classification edition="200601120250429B">B60W30/14</further-classification>
        <further-classification edition="200601120250429B">B60W50/04</further-classification>
        <further-classification edition="200601120250429B">B60W40/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林港喬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KANG-CHIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種行車資訊處理裝置及行車資料提供方法，其中行車資訊處理裝置，包含通訊單元、感測單元、處理單元以及顯示裝置。通訊單元接收第一感測物件資料。感測單元產生本車感測資料。處理單元根據第一感測物件資料與本車感測資料產生外部物件資料，基於外部物件資料中的位置資料和本車感測資料中的位置資料，產生比較結果，以及若比較結果包含至少一未匹配物件，產生觸發訊號至通訊單元以請求並接收行車透視資料。顯示裝置根據行車透視資料提供包含未匹配物件的顯示畫面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A vehicle data processing device and vehicle data provision method, the device includes a communication unit, a sensing unit, a processing unit and a display unit. The communication unit receives first sensing object data. The sensing unit generates vehicle sensing data. The processing unit generates external object data based on the first sensing object data and the vehicle sensing data, generates a comparison result based on the position data in the external object data and the position data in the vehicle sensing data, and generates a trigger signal to the communication unit to request and receive vehicle see-through data if the comparison result includes at least one mismatched objects. The display unit provides display images based on the vehicle see-through data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:行車資料提供方法</p>
        <p type="p">S201~S210:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="458" publication-number="202624603">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624603</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147945</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>皮帶輪連動門連桿滑車總成</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250217B">E05D13/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富采國際有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧俊民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉昉昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種皮帶輪連動門連桿滑車總成，係包括一皮帶輪連動門連桿；一第一滑車座，係連接固定於該皮帶輪連動門連桿的一端；一第二滑車座，係連接固定於該皮帶輪連動門連桿的另一端；一第一滑車及一第二滑車；其中該第一滑車係可以左右位移微調整，以配合連動門片所設置的兩門片吊座之間距公差具有安裝施工方便之實用性，更進一步，其中該皮帶輪連動門連桿包含一連動門連桿第一軌以及一滑套於該連動門連桿第一軌內的連動門連桿第二軌，該連動門連桿第二軌可相對於連動門連桿第一軌做位移而伸縮調整以適用於不同連動門片的寛度尺寸規格，相對可擴大其適用範圍；本發明安裝於天花板施工時，可以先在桌上或地面進行初步組裝然後再進行安裝於天花板作業，故具有施工安裝方便且相對亦節省施工人力與工時之優點。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">(1):皮帶輪連動門連桿</p>
        <p type="p">(11):連動門連桿第一軌</p>
        <p type="p">(12):連動門連桿第二軌</p>
        <p type="p">(124):固定孔</p>
        <p type="p">(125):鎖固元件</p>
        <p type="p">(2):第一滑車座</p>
        <p type="p">(31):第一皮帶輪</p>
        <p type="p">(32):第二皮帶輪</p>
        <p type="p">(4):第二滑車座</p>
        <p type="p">(5):第一滑車</p>
        <p type="p">(51):第一滑車本體</p>
        <p type="p">(511):滑塊</p>
        <p type="p">(513):限位件</p>
        <p type="p">(52):第一滑輪組</p>
        <p type="p">(53):第一連接件</p>
        <p type="p">(6):第二滑車</p>
        <p type="p">(61):第二滑車本體</p>
        <p type="p">(611):固定塊</p>
        <p type="p">(613):定位件</p>
        <p type="p">(62):第二滑輪組</p>
        <p type="p">(63):第二連接件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="459" publication-number="202625749">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625749</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147946</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光罩圖樣面朝下之光罩移載裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260316B">H10P72/30</main-classification>
        <further-classification edition="202601120260316B">H10P72/50</further-classification>
        <further-classification edition="202601120260316B">H10P72/76</further-classification>
        <further-classification edition="200601120260316B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華洋精機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭賢德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昆夆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張宇樞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光罩圖樣面朝下之光罩移載裝置，包含有：一基座；一X向移動台；一Y向移動台；一夾爪組，具有二夾持單元；一推動定位組，具有一不動單元以及一推動單元；一升降旋轉台；以及一承接台，具有四承接架；其中，該承接台上下移動的位置中，具有一承接位置、一夾持位置以及一底部位置，該承接台位於該夾持位置時，該二夾持單元係可夾持或釋放位於該承接台上的該光罩，且該推動單元係可推動或不推動該光罩。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">31:Y向移動台</p>
        <p type="p">41:夾爪組</p>
        <p type="p">42:夾持單元</p>
        <p type="p">52:不動單元</p>
        <p type="p">61:升降旋轉台</p>
        <p type="p">71:承接台</p>
        <p type="p">72:承接架</p>
        <p type="p">721:斜壁</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="460" publication-number="202625041">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625041</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147949</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>員工健康狀態追蹤管理的系統以及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR TRACKING AND MANAGING HEALTH STATUS OF EMPLOYEES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250303B">G06Q10/1091</main-classification>
        <further-classification edition="202301120250303B">G06Q10/10</further-classification>
        <further-classification edition="202301120250303B">G06Q10/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>兆豐國際商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEGA INTERNATIONAL COMMERCIAL BANK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹麒霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAN, CHI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓昱圻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JHUO, YU-CI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種員工健康狀態追蹤管理的系統，包含：雲端伺服器及中台伺服器。雲端伺服器用以接收來自多個員工所傳送的健康狀態資料。中台伺服器與雲端伺服器通訊連接且包含互相電性連接的通訊裝置、處理器、和儲存裝置。其中儲存裝置包含：資訊收集整合單元、警示通知處理單元和報表產生單元。資訊收集整合單元用以接收來自雲端伺服器的員工的健康狀態資料。警示通知處理單元用以在員工的健康狀態資料中有高風險情況時，自動發送警示通知至人資單位或門禁管理單位。報表產生單元用以根據員工的健康狀態資料產生管理報表且發送至主管單位裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system for tracking and managing employee health status, including a cloud server and a middleware server. The cloud server is configured to receive health status data transmitted by employees. The middleware server communicates with the cloud server and includes a communication device, a processor, and a storage device that are electrically connected. The storage device includes an information collection and integration unit, an alert processing unit, and a report generation unit. The information collection unit is configured to receive the health status data of the employees from the cloud server. The alert processing unit automatically sends an alert to a human resource (HR) unit or an access control management unit when a high-risk condition is detected in the health status data of the employees. The report generation unit generates a management report based on the health status data of the employees and sends the management report to a supervisory unit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:員工健康狀態追蹤管理的系統</p>
        <p type="p">110:雲端伺服器</p>
        <p type="p">120:中台伺服器</p>
        <p type="p">130:健康資訊收集單元</p>
        <p type="p">132:門禁通知單元</p>
        <p type="p">140:通訊裝置</p>
        <p type="p">142:處理器</p>
        <p type="p">144:儲存裝置</p>
        <p type="p">150:資訊收集整合單元</p>
        <p type="p">152:警示通知處理單元</p>
        <p type="p">154:報表產生單元</p>
        <p type="p">202、204、206:個人裝置</p>
        <p type="p">210:人資單位的裝置</p>
        <p type="p">212:門禁管理單位的裝置</p>
        <p type="p">214:主管單位的裝置</p>
        <p type="p">220:打卡系統伺服器</p>
        <p type="p">230:遠端辦公系統伺服器</p>
        <p type="p">240、242、244:計算裝置</p>
        <p type="p">250:差勤系統伺服器</p>
        <p type="p">260:行政部門的裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="461" publication-number="202625106">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625106</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147950</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>駕駛臉部影像加密辨識系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR FACIAL IMAGE ENCRYPTION AND RECOGNITION OF DRIVERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250303B">G06V40/16</main-classification>
        <further-classification edition="201301120250303B">G06F21/30</further-classification>
        <further-classification edition="202201120250303B">G06V40/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳嘉倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JIA-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳思瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田仲豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIEN, CHUNG-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YAN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃騰緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TENG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃美蓮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, MEI-LIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種駕駛臉部影像加密辨識系統，包含顯示器以及加密影像辨識伺服器。顯示器包含光學加密元件和影像擷取裝置。光學加密元件具有多個透光孔，且用以接收駕駛之臉部反射之反射光線通過多個透光孔形成加密光線。影像擷取裝置用以接收加密光線並形成加密影像。加密影像辨識伺服器用以接收加密影像，且包含加密影像特徵提取模組和加密影像辨識模組。加密影像特徵提取模組用以提取加密影像之加密特徵。加密影像辨識模組用以比對加密特徵與註冊加密特徵以判斷加密特徵是否為已註冊駕駛之註冊加密特徵，並據以生成辨識結果資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system for facial image encryption and recognition of drivers includes: a display device and an encrypted image recognition server. The display device includes an optical encryption element and an image capture device. The optical encryption element having multiple light-transmitting holes, is used for receiving the reflected light reflected from a face of a driver and forming an encrypted light through the multiple light-transmitting holes. The image capture device is used for receiving the encrypted light and forming the encrypted image. The encrypted image recognition server is used for receiving the encrypted image, and includes an encrypted image feature extraction module and encrypted image recognition module. The encrypted image feature extraction module is used for extracting an encryption feature of the encrypted image. The encrypted image recognition module is used for comparing the encrypted feature with a registered encrypted feature to determine whether the encrypted feature are the registered encrypted feature of a registered driver, and generating an identification result data accordingly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:駕駛臉部影像加密辨識系統</p>
        <p type="p">110:顯示器</p>
        <p type="p">111:透光板</p>
        <p type="p">112:透光顯示面板</p>
        <p type="p">113,113F:光學加密元件</p>
        <p type="p">114:影像擷取裝置</p>
        <p type="p">120:加密影像辨識伺服器</p>
        <p type="p">121:特徵提取模組</p>
        <p type="p">122:加密影像辨識模組</p>
        <p type="p">123:車輛鎖定模組</p>
        <p type="p">130:註冊駕駛資料庫</p>
        <p type="p">D1:第一距離</p>
        <p type="p">D2:第二距離</p>
        <p type="p">EI:加密影像</p>
        <p type="p">F:臉部</p>
        <p type="p">FI:臉部影像</p>
        <p type="p">H:透光孔</p>
        <p type="p">L1:反射光線</p>
        <p type="p">L2:加密光線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="462" publication-number="202623772">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623772</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147951</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>產生三維咬合墊高模型的裝置、產生三維咬合墊高物的方法及其電腦程式產品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">A61C19/05</main-classification>
        <further-classification edition="201801120241231B">G16H50/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHUN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHUN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳翠華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種產生三維咬合墊高模型的裝置、產生三維咬合墊高物的方法及其電腦程式產品。三維咬合墊高模型包含底座模型及平台模型。裝置根據中心關係確認第一顎中與第二顎最早接觸的目標牙齒，根據目標牙齒的切端及預劃咬深值決定預劃咬深位置，根據預劃咬深位置及顎舌側功能性咬頭位置決定預劃咬合平面，根據該中心關係決定預劃咬合平面上的咬合接觸點。所產生的底座模型的鄰接面能夠於顎舌側鄰接包含目標牙齒的多個連續排列的牙齒。所產生的平台模型自底座模型對應至目標牙齒處朝向顎舌側突出，咬合面落在預劃咬合平面上，咬合面涵蓋咬合接觸點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S601、S603、S605、S607、S609、S611、S613:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="463" publication-number="202623906">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623906</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147962</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>秤杯結構及使用此秤杯結構進行出膠量測的方法</chinese-title>
        <english-title>SCALE CUP STRUCTURE AND A METHOD FOR MEASURING DISPENSING AMOUNT USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">B05C11/00</main-classification>
        <further-classification edition="200601120241230B">G01G19/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竑騰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORNG TERNG AUTOMATION CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王裕賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YU-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, WEN-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種秤杯結構及使用此秤杯結構進行出膠量測的方法。秤杯結構適用於佈膠設備的出膠量測裝置，用以承接待測膠。秤杯結構包含杯體以及接膠平台。杯體具有容置空間。接膠平台凸伸在容置空間中，其中接膠平台的頂面為水平面，且具有粗糙度。待測膠與頂面之間的摩擦力大於待測膠與佈膠設備之出膠針頭內壁之間的摩擦力。本發明能有效解決膠液供應過程中的餘膠殘留問題，確保膠體完整移除並精確附著於接膠平台，從而提升量測準確性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a scale cup structure and a method for measuring dispensing amount using the scale cup structure. The scale cup structure is applicable to a dispensing amount measurement device in dispensing equipment and is used to receive the glue to be measured. The scale cup structure includes a cup body and a receiving platform. The cup body has an accommodating space. The receiving platform extends in the accommodating space, and a top surface of the receiving platform is a horizontal plane with roughness. The frictional force between the glue to be measured and the top surface is greater than the frictional force between the glue to be measured and the inner wall of a dispensing needle of the dispensing equipment. The present invention effectively solves the problem of residual glue during the dispensing process, ensuring the complete removal of the glue and its precise attachment to the receiving platform of the scale cup structure, thereby improving the measurement accuracy.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:方法</p>
        <p type="p">S11:步驟</p>
        <p type="p">S12:步驟</p>
        <p type="p">S13:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="464" publication-number="202625673">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625673</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147963</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>壓電閥及其適用之壓電噴射裝置</chinese-title>
        <english-title>PIEZOELECTRIC VALVE AND PIEZOELECTRIC INJECTION DEVICE USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250418B">H10N30/20</main-classification>
        <further-classification edition="202301120250418B">H10N30/80</further-classification>
        <further-classification edition="200601120250418B">F16K31/02</further-classification>
        <further-classification edition="200601120250418B">B05B17/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竑騰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORNG TERNG AUTOMATION CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鼎融</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TING-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃一展</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YI-CHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種壓電閥及其適用之壓電噴射裝置，壓電閥包含閥體、壓電驅動桿、調整組件、出力組件及撞針。壓電驅動桿設置於閥體的內部空間中。調整組件連接壓電驅動桿上端。出力組件連接壓電驅動桿下端，包含出力轉軸和出力槓桿。出力槓桿的底部與頂部靠近第一端的位置分別抵接於出力轉軸與壓電驅動桿下端。撞針頂部抵接於槓桿底部靠近第二端的位置。調整組件與壓電驅動桿上端間、壓電驅動桿下端與出力槓桿間、調整組件與閥體內壁間和/或出力組件與閥體內壁間，設有由圓弧部及至少兩個支撐面構成的雙面支撐結構，提供穩定支撐和限位功能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a piezoelectric valve and a piezoelectric injection device using the same, the piezoelectric valve includes a valve body, a piezoelectric driving rod, an adjustment assembly, an output assembly, and a pushing pin. The piezoelectric driving rod is disposed in an internal space of the valve body. The adjustment assembly is connected to an upper end of the piezoelectric driving rod. The output assembly is connected to a lower end of the piezoelectric driving rod and includes an output shaft and an output lever. A bottom portion and a top portion of the output lever near a first end of the output lever respectively abut against the output shaft and the lower end of the piezoelectric driving rod. A top portion of the pushing pin abuts against a bottom portion of the lever near the second end. A double-sided support structure is provided between the adjustment assembly and the upper end of the piezoelectric driving rod, the lower end of the piezoelectric driving rod and the output lever, the adjustment assembly and the inner wall of the internal space, and/or the output assembly and the inner wall of the internal space. This double-sided support structure consists of an arc-shaped member and at least two support surfaces, providing both stable support and limiting functions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">A:圖1的放大部分</p>
        <p type="p">22:壓電驅動桿</p>
        <p type="p">222:下端</p>
        <p type="p">24:出力組件</p>
        <p type="p">241:出力轉軸</p>
        <p type="p">242:出力槓桿</p>
        <p type="p">242a:第一端</p>
        <p type="p">242b:第二端</p>
        <p type="p">25:撞針</p>
        <p type="p">5:雙面支撐結構</p>
        <p type="p">51:圓弧部</p>
        <p type="p">52:支撐面</p>
        <p type="p">53:支撐面</p>
        <p type="p">6:雙面支撐結構</p>
        <p type="p">61:圓弧部</p>
        <p type="p">62:支撐面</p>
        <p type="p">63:支撐面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="465" publication-number="202625060">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625060</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147969</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於電子支付之減碳消費方法</chinese-title>
        <english-title>METHOD FOR CARBON REDUCTION CONSUMPTION BASED ON ELECTRONIC PAYMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250306B">G06Q30/0601</main-classification>
        <further-classification edition="201201120250306B">G06Q20/22</further-classification>
        <further-classification edition="201201120250306B">G06Q20/38</further-classification>
        <further-classification edition="201301120250306B">G06F21/33</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全盈支付金融科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALL WIN FINTECH COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾明峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, MING-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭湘陵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, HSIANG-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡秀玫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡依庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種基於電子支付之減碳消費方法，當使用者使用一行動裝置中的電子支付應用程式透過一電子支付伺服器完成一消費行為時，一交易伺服器提供之訂單資料與電子支付伺服器中的減碳資料集做比對，以確認訂單資料中的綠色商品之之一數量、一使用次數、一交易金額或一再生塑料材質及其佔比，並取得對應之一減碳紀錄資料，並回傳至該行動裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a method for carbon reduction consumption based on electronic payment. When a user uses an electronic payment application in a mobile device to complete a consumption behavior by an electronic payment server, an order data from a seller server is compared with a carbon reduction data set in the electronic payment server. Thereby, a carbon reduction point data is obtained correspondingly according to the order data and a quantity, a usage, a transaction amount, or a recycle resin weight of the green commodities, and sent back to the mobile device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10-S50:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="466" publication-number="202624935">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624935</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147970</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>指向輸入裝置</chinese-title>
        <english-title>TRACKPOINT INPUT DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250123B">G06F3/023</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義隆電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELAN MICROELECTRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐澤文明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARASAWA, FUMIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣少邯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, SHAO-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖恩孝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, EN-HSIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許新富</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HSIN-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡書慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳嘉敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種指向輸入裝置，其中具有支架，支架中設有穿孔，承座設於支架上，而凸柱設於承座之第一側，且凸柱之部分相對位於支架的穿孔中，並以感測基板貼靠於承座之第二側來依據凸柱之操作輸出感測訊號，利用凸柱有部分設於支架的穿孔中，來讓凸柱與支架的厚度於空間上疊合，進而有效減少整體結構的厚度，且承座提供凸柱及支架間的結合與支撐效果，以使得降低整體厚度的同時，仍能維持結構強度及靈敏度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a pointing input device, which includes a bracket having a through hole. A base is mounted on the bracket. A post is positioned on the first side of the base. A portion of the post is disposed in the through hole in the bracket. A sensing substrate is applied to the second side of the base, enabling the sensing signals to be output based on the operation of the post. By positioning part of the post within the through hole of the bracket, the thicknesses of the post and the bracket overlap spatially, effectively reducing the overall structural thickness. Additionally, the base provides a combination and support function between the post and the bracket, ensuring that while the overall thickness is minimized, the structural strength and sensitivity are maintained.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:支架</p>
        <p type="p">11:穿孔</p>
        <p type="p">12:凸耳</p>
        <p type="p">20:承座</p>
        <p type="p">21:第一側</p>
        <p type="p">22:第二側</p>
        <p type="p">31:凸柱</p>
        <p type="p">32:蓋體</p>
        <p type="p">40:感測基板</p>
        <p type="p">41:感測器</p>
        <p type="p">50:環壁</p>
        <p type="p">60:環肩部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="467" publication-number="202625411">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625411</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147978</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多輸入多輸出正交分頻多工通訊系統與其對數似然比縮放方法</chinese-title>
        <english-title>MULTIPLE-INPUT MULTIPLE-OUTPUT ORTHOGONAL FREQUENCY DIVISION MULTIPLEXING COMMUNICATION SYSTEM AND LOG LIKELIHOOD RATIO SCALING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">H04L27/26</main-classification>
        <further-classification edition="200601120250303B">H04L25/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, CHUN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">對數似然比縮放方法，包含：在前置符碼期間根據封包的前置符碼決定所有子載波中的對應子載波的通道增益以及該些子載波的平均通道增益值，並據此決定對數似然比平均值；在前置符碼期間根據該平均通道增益值、該通道增益以及縮放參數決定縮放比例；在有效負載期間根據該封包的有效負載產生原始對數似然比序列；根據對數似然比平均值與縮放參數調整該原始對數似然比序列以產生第一對數似然比序列； 以及根據該縮放比例調整該第一對數似然比序列以產生第二對數似然比序列，其中該第二對數似然比序列經量化與解碼以提供該有效負載的相關資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for a MIMO-OFDM system includes: during a preamble period, determining a channel gain of a corresponding subcarrier of all subcarriers and an average channel gain value of the all subcarriers according to a preamble of a packet, and determining a log-likelihood ratio average value according to the average channel gain value and the scaling parameter; determining a scaling factor according to the average channel gain value, the channel gain and a scaling parameter; during a payload period, generating an original log-likelihood ratio sequence according to a payload of the packet; during the payload period, adjusting the original log-likelihood ratio sequence according to the log-likelihood ratio average value and the scaling factor to generate a first log-likelihood ratio sequence; and during the payload period, adjusting the first log-likelihood ratio sequence according to the scaling factor to generate a second log-likelihood ratio sequence, in which the second log-likelihood ratio sequence is quantized and decoded to provide the relevant information of the payload.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:對數似然比縮放方法</p>
        <p type="p">S310,S320,S330,S340,S350:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="468" publication-number="202624964">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624964</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147980</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有低功耗高效能存取機制的快取電路及其操作方法</chinese-title>
        <english-title>CACHE CIRCUIT AND OPERATION METHOD THEREOF HAVING LOW POWER DISSIPATION AND HIGH PERFORMANCE MECHANISM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120250102B">G06F12/0802</main-classification>
        <further-classification edition="200601120250102B">G06F13/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許烱發</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEU, JEONG-FA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有低功耗高效能存取機制的暫存器快取電路。寫入計數電路依序循環產生對應參照值的計數值。在位址暫存電路中，位址暫存解多工器接收有效寫入位址並根據計數值寫入對應參照值的位址暫存器，比較電路比較讀取位址內容與位址暫存器的儲存位址內容產生比對結果，優先權順序解碼電路根據計數值判斷最新相符比對結果來產生選擇訊號。在資料暫存電路中，資料暫存解多工器接收對應有效寫入位址的有效寫入資料並根據計數值寫入對應參照值的資料暫存器，選擇電路接收選擇訊號選擇資料暫存器的儲存資料或由記憶體輸出的讀取資料輸出為實際讀取資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cache circuit having low power dissipation and high performance mechanism is provided. A write counter circuit cyclically generates a counting value in turns corresponding to one of reference values. In an address storage circuit, an address storage demultiplexer receives and writes an effective write address to one of address registers according to the counting value, each of comparison circuits compares a read address content and a stored address content in one of the address registers to generate a comparison result, and a priority decoding circuit determines a newest matched comparison result according to the counting value to generate a selection signal. In a data storage circuit, a data storage demultiplexer receives and writes an effective write data corresponding to the effective write address to one of data registers corresponding to one of the reference values according to the counting value and a selection circuit receives the selection signal to select stored data in one of the data registers or read data outputted from a memory to be actual read data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:記憶體系統</p>
        <p type="p">110:記憶體電路</p>
        <p type="p">120:快取電路</p>
        <p type="p">130:寫入計數電路</p>
        <p type="p">140:位址暫存電路</p>
        <p type="p">150:資料暫存電路</p>
        <p type="p">ARD:實際讀取資料</p>
        <p type="p">COU:計數值</p>
        <p type="p">RAC、M_RAC:讀取位址內容</p>
        <p type="p">RAD、WAD、M_RAD、M_WAD:位址</p>
        <p type="p">RAV、WAV、M_RAV、M_WAV:位址有效位元</p>
        <p type="p">RD:讀取資料</p>
        <p type="p">SEL:選擇訊號</p>
        <p type="p">WAC、M_WAC:寫入位址內容</p>
        <p type="p">WDA、M_WDA:資料</p>
        <p type="p">WDC、M_WDC:寫入資料內容</p>
        <p type="p">WDV、M_WDV:資料有效位元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="469" publication-number="202625380">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625380</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147982</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>類比數位轉換裝置及類比數位轉換方法</chinese-title>
        <english-title>ANALOG TO DIGITAL CONVERSION DEVICE AND ANALOG TO DIGITAL CONVERSION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">H03M1/12</main-classification>
        <further-classification edition="200601120250102B">H03M1/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪瑋謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, WEI-CIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">類比數位轉換裝置包含第一斜率信號產生器、第二斜率信號產生器以及比較器。第一斜率信號產生器用以產生第一斜率信號，其中第一斜率信號於第一電壓區間以至少一第一斜率來回升降。第二斜率信號產生器用以產生第二斜率信號，其中第二斜率信號於第二電壓區間以至少一第二斜率來回升降。比較器用以根據第一斜率信號、第二斜率信號與輸入信號以產生輸出信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An analog to digital conversion device includes a first slope signal generator, a second slope signal generator, and a comparator. The first slope signal generator is configured to generate a first slope signal, wherein the first slope signal rises and falls with at least one first slope in a first voltage range. The second slope signal generator is configured to generate a second slope signal, wherein the second slope signal rises and falls with at least one second slope in a second voltage range. The comparator is configured to generate an output signal based on the first slope signal, the second slope signal, and an input signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:類比數位轉換裝置</p>
        <p type="p">110:第一斜率信號產生器</p>
        <p type="p">120:第二斜率信號產生器</p>
        <p type="p">130:比較器</p>
        <p type="p">140:數位邏輯處理器</p>
        <p type="p">Cs3:電容</p>
        <p type="p">cmp1、cmpN:輸出信號</p>
        <p type="p">cmp1X、cmpNX:輸出信號</p>
        <p type="p">DFF1、DFF1X:正反器</p>
        <p type="p">D1[3：0]:資料信號</p>
        <p type="p">Dcnt[3：0]、Dcntx[3：0]:計數值</p>
        <p type="p">Out1:第一輸出端</p>
        <p type="p">Out2:第二輸出端</p>
        <p type="p">SW1:第一開關</p>
        <p type="p">SW2:第二開關</p>
        <p type="p">SW3:第三開關</p>
        <p type="p">SW4:第四開關</p>
        <p type="p">Scon1:第一控制信號</p>
        <p type="p">Scon2:第二控制信號</p>
        <p type="p">Sre1:第一重置信號</p>
        <p type="p">Sre2:第二重置信號</p>
        <p type="p">Vslope1:第一斜率信號</p>
        <p type="p">Vslope2:第二斜率信號</p>
        <p type="p">Vi,p、Vi,n:輸入信號</p>
        <p type="p">VDD:電源供應電壓</p>
        <p type="p">I:電流源電流</p>
        <p type="p">V1、V2:電壓位準</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="470" publication-number="202625381">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625381</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147983</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>類比數位轉換裝置及類比數位轉換方法</chinese-title>
        <english-title>ANALOG TO DIGITAL CONVERSION DEVICE AND ANALOG TO DIGITAL CONVERSION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">H03M1/12</main-classification>
        <further-classification edition="200601120250102B">H03M1/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪瑋謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, WEI-CIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">類比數位轉換裝置包含第一斜率信號產生器、第二斜率信號產生器以及比較器。第一斜率信號產生器用以產生第一斜率信號，其中第一斜率信號於電壓區間以至少一第一斜率來回升降。第二斜率信號產生器用以產生第二斜率信號，其中第二斜率信號於電壓區間以至少一第二斜率來回升降，且至少一第一斜率與至少一第二斜率負相關。比較器用以根據第一斜率信號、第二斜率信號與輸入信號以產生輸出信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An analog to digital conversion device includes a first slope signal generator, a second slope signal generator, and a comparator. The first slope signal generator is configured to generate a first slope signal, wherein the first slope signal rises and falls with at least one first slope in a voltage range. The second slope signal generator is configured to generate a second slope signal, wherein the second slope signal rises and falls with at least one second slope in the voltage range, and the at least one first slope is negatively related to the at least one second slope. The comparator is configured to generate an output signal based on the first slope signal, the second slope signal, and an input signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:類比數位轉換裝置</p>
        <p type="p">110:第一斜率信號產生器</p>
        <p type="p">120:第二斜率信號產生器</p>
        <p type="p">130:比較器</p>
        <p type="p">140:數位邏輯處理器</p>
        <p type="p">Cs3:電容</p>
        <p type="p">cmp1、cmpN:輸出信號</p>
        <p type="p">cmp1X、cmpNX:輸出信號</p>
        <p type="p">DFF1、DFF1X:正反器</p>
        <p type="p">D1[3：0]:資料信號</p>
        <p type="p">Dcnt[3：0]、Dcntx[3：0]:計數值</p>
        <p type="p">GND:接地電壓</p>
        <p type="p">Out1:第一輸出端</p>
        <p type="p">Out2:第二輸出端</p>
        <p type="p">SW1:第一開關</p>
        <p type="p">SW2:第二開關</p>
        <p type="p">SW3:第三開關</p>
        <p type="p">SW4:第四開關</p>
        <p type="p">Scon1:第一控制信號</p>
        <p type="p">Scon2:第二控制信號</p>
        <p type="p">Sre1:第一重置信號</p>
        <p type="p">Sre2:第二重置信號</p>
        <p type="p">Vslope1:第一斜率信號</p>
        <p type="p">Vslope2:第二斜率信號</p>
        <p type="p">Vi,p、Vi,n:輸入信號</p>
        <p type="p">VDD:電源供應電壓</p>
        <p type="p">I:電流源電流</p>
        <p type="p">V1、V2:電壓位準</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="471" publication-number="202625382">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625382</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147984</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>類比數位轉換裝置及類比數位轉換方法</chinese-title>
        <english-title>ANALOG TO DIGITAL CONVERSION DEVICE AND ANALOG TO DIGITAL CONVERSION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">H03M1/12</main-classification>
        <further-classification edition="200601120250102B">H03M1/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪瑋謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, WEI-CIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">類比數位轉換裝置包含斜率信號產生器以及比較器。斜率信號產生器用以於電壓區間的第一子電壓區間根據第一電流源以產生斜率信號，並於電壓區間的第二子電壓區間根據第二電流源以產生斜率信號，其中斜率信號於電壓區間以至少一斜率來回升降。比較器用以根據斜率信號與輸入信號以產生輸出信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An analog to digital conversion device includes a slope signal generator and a comparator. The slope signal generator is configured to generate a slope signal according to a first current source during a first sub-voltage range of a voltage range, and generate the slope signal according to a second current source during a second sub-voltage range of a voltage range, wherein the slope signal rises and falls with at least one slope in the voltage range. The comparator is configured to generate an output signal based on the slope signal and an input signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:類比數位轉換裝置</p>
        <p type="p">110:斜率信號產生器</p>
        <p type="p">120:比較器</p>
        <p type="p">CS1:第一電流源</p>
        <p type="p">CS2:第二電流源</p>
        <p type="p">Cs3:電容</p>
        <p type="p">cmpN:輸出信號</p>
        <p type="p">DFFN:正反器</p>
        <p type="p">D[3：0]:資料信號</p>
        <p type="p">Dcnt[3：0]:計數值</p>
        <p type="p">Out:輸出端</p>
        <p type="p">SW1:第一開關</p>
        <p type="p">SW2:第二開關</p>
        <p type="p">SW3:第三開關</p>
        <p type="p">Scon1:第一控制信號</p>
        <p type="p">Scon2:第二控制信號</p>
        <p type="p">Sre:重置信號</p>
        <p type="p">Vslope:斜率信號</p>
        <p type="p">Vi,p、Vi,n:輸入信號</p>
        <p type="p">VDD:電流源供應電壓</p>
        <p type="p">Vref:參考電壓</p>
        <p type="p">V1:電壓位準</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="472" publication-number="202625383">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625383</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147985</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>類比數位轉換裝置及類比數位轉換方法</chinese-title>
        <english-title>ANALOG TO DIGITAL CONVERSION DEVICE AND ANALOG TO DIGITAL CONVERSION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">H03M1/12</main-classification>
        <further-classification edition="200601120250102B">H03M1/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪瑋謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, WEI-CIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">類比數位轉換裝置包含第一斜率信號產生器、第二斜率信號產生器以及比較器。第一斜率信號產生器用以產生第一斜率信號，其中第一斜率信號於電壓區間以至少一第一斜率來回升降。第二斜率信號產生器用以產生第二斜率信號，其中第二斜率信號於電壓區間以至少一第二斜率來回升降，其中第一斜率信號與第二斜率信號之間具有一相位差。比較器用以根據第一斜率信號、第二斜率信號與輸入信號以產生輸出信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An analog to digital conversion device includes a first slope signal generator, a second slope signal generator, and a comparator. The first slope signal generator is configured to generate a first slope signal, wherein the first slope signal rises and falls with at least one first slope in a voltage range. The second slope signal generator is configured to generate a second slope signal, wherein the second slope signal rises and falls with at least one second slope in the voltage range, wherein there is a phase difference between the first slope signal and the second slope signal. The comparator is configured to generate an output signal based on the first slope signal, the second slope signal, and an input signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:類比數位轉換裝置</p>
        <p type="p">110:第一斜率信號產生器</p>
        <p type="p">120:第二斜率信號產生器</p>
        <p type="p">130:比較器</p>
        <p type="p">140:數位邏輯處理器</p>
        <p type="p">Cs3:電容</p>
        <p type="p">cmp1、cmpN:輸出信號</p>
        <p type="p">cmp1X、cmpNX:輸出信號</p>
        <p type="p">DFF1、DFF1X:正反器</p>
        <p type="p">D1[3：0]:資料信號</p>
        <p type="p">Dcnt[3：0]、Dcntx[3：0]:計數值</p>
        <p type="p">Out1:第一輸出端</p>
        <p type="p">Out2:第二輸出端</p>
        <p type="p">SW1:第一開關</p>
        <p type="p">SW2:第二開關</p>
        <p type="p">SW3:第三開關</p>
        <p type="p">SW4:第四開關</p>
        <p type="p">Scon1:第一控制信號</p>
        <p type="p">Scon2:第二控制信號</p>
        <p type="p">Sre1:第一重置信號</p>
        <p type="p">Sre2:第二重置信號</p>
        <p type="p">Vslope1:第一斜率信號</p>
        <p type="p">Vslope2:第二斜率信號</p>
        <p type="p">Vi,p、Vi,n:輸入信號</p>
        <p type="p">VDD:電源供應電壓</p>
        <p type="p">I:電流源電流</p>
        <p type="p">V1:電壓位準</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="473" publication-number="202624662">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624662</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147986</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>空調換氣機及其安裝方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250214B">F24F1/00</main-classification>
        <further-classification edition="200601120250214B">F24F13/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋正明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋正明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孟欣達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address></address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種空調換氣機及其安裝方法，主要包括︰一通風裝置，該通風裝置包括一引風單元和一排風單元，該引風單元連接該排風單元，用於引進外部空氣並排出過濾後的空氣至室內；一過濾單元，位於該通風裝置中，用於過濾進入室內的室外空氣；一導流裝置，位於該通風裝置與密閉空間之間，用於導引過濾後的新鮮空氣進入室內機進風口之後，將導引新鮮空氣均勻分佈到室內密閉空間的各個區域；一溫度監測單元，連接該通風裝置，用於監測室內空氣的溫度，並控制室內外進風量，以提供舒適的環境；一空氣品質監測顯示面板，連接該通風裝置，用於監控室內空氣品質，並據此調整室內空氣品質的環境；以及一控制單元，連接該通風裝置，用於控制該通風裝置的開關動作，並提供空調換氣機進行以下步驟 : S1 將該通風裝置設置於該空調換氣機上或吊隱式空調換氣機的一側；S2 將該引風單元內嵌於該空調換氣機上或吊隱式空調換氣機的一側；S3 透過配對遙控器控制該空調換氣機的開關動作；S4 使用配對遙控器控制該引風單元的升降開合功能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">101:空調換氣機</p>
        <p type="p">100:通風裝置</p>
        <p type="p">20:控制單元</p>
        <p type="p">110:引風單元</p>
        <p type="p">120:排風單元</p>
        <p type="p">200:導流裝置</p>
        <p type="p">300:溫度監測單元</p>
        <p type="p">400:空氣品質監測顯示面板</p>
        <p type="p">41:數據處理單元</p>
        <p type="p">42:顯示單元</p>
        <p type="p">7:過濾單元</p>
        <p type="p">8:配對遙控器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="474" publication-number="202623945">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623945</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147989</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>剝除氧氣瓶外包覆層之方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250423B">B24B5/04</main-classification>
        <further-classification edition="200601120250423B">B26D1/01</further-classification>
        <further-classification edition="202201120250423B">B09B3/30</further-classification>
        <further-classification edition="200601120250423B">F17C13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>展苑有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>雲林縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡依倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種剝除氧氣瓶外包覆層之方法，其包含有準備一剝除系統，該剝除系統包含有一密閉室、一機台、一切削刀具、一吸塵系統，將氧氣瓶夾制於機台的夾具上並轉動氧氣瓶，移動切削刀具以將氧氣瓶上的外包覆層自鋼瓶上剝除，啟動吸塵系統的吸塵主機將氧氣瓶外包覆層為切削刀具所剝除的碎屑及粉塵抽送至集塵箱收集。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:密閉室</p>
        <p type="p">12:通風口</p>
        <p type="p">14:濾網</p>
        <p type="p">20:機台</p>
        <p type="p">22:切削刀具</p>
        <p type="p">30:吸塵系統</p>
        <p type="p">32:吸塵罩</p>
        <p type="p">34:吸塵主機</p>
        <p type="p">36:集塵箱</p>
        <p type="p">40:水簾系統</p>
        <p type="p">42:抽氣主機</p>
        <p type="p">44:水簾機構</p>
        <p type="p">442:本體</p>
        <p type="p">444:水簾</p>
        <p type="p">446:上水箱</p>
        <p type="p">448:下水箱</p>
        <p type="p">449:濾網</p>
        <p type="p">60:氧氣瓶</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="475" publication-number="202623921">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623921</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147992</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>軋機輥隙監控系統及其方法</chinese-title>
        <english-title>ROLLING MILL ROLL GAP MONITORING SYSTEM AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250325B">B21B38/10</main-classification>
        <further-classification edition="200601120250325B">B21B33/00</further-classification>
        <further-classification edition="200601120250325B">G08B21/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝豐帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, FENG-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇靖尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, JING-YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種軋機輥隙監控系統，包含：至少一輥隙感測器，裝設於至少一軋機上，用以感測至少一軋機在軋延一鋼胚時一上下軋輥之一輥隙值；一軋機監控伺服器，用以接收至少一軋機之一電控資料；一輥隙監控伺服器，與至少一輥隙感測器連接以接收輥隙值且與軋機監控伺服器連接以接收電控資料，並包含：一輥隙智慧分析模組，用以根據輥隙值之變化及電控資料，判斷輥隙值是否出現異常；以及一異常告警模組，用以在輥隙值出現異常時發出一警報；一輥隙監控介面，用以顯示輥隙值之變化及警報。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A rolling mill roll gap analysis system includes: at least one roll gap sensor, installed on at least one rolling mill, and used for sensing a roll gap value of an upper and lower roll when the at least one rolling mill is rolling a billet; a rolling mill monitoring server, used for receiving electrical control data of the at least one rolling mill; and a roll gap monitoring server, connected to the at least one roll gap sensor to receive the roll gap value and connected to the rolling mill monitoring server to receive the electronic control data. The roll gap monitoring server includes: a roll gap intelligent analysis module, used for determining whether the roll gap value is abnormal based on changes in the roll gap value and the electronic control data; an abnormality alarm module, used for sending an alarm when the roll gap value is abnormal; and a roll gap monitoring interface, used for displaying changes in the roll gap value and the alarms.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:軋機輥隙監控系統</p>
        <p type="p">110:輥隙監控伺服器</p>
        <p type="p">111:輥隙校正模組</p>
        <p type="p">112:輥隙智慧分析模組</p>
        <p type="p">113:異常告警模組</p>
        <p type="p">120:軋機監控伺服器</p>
        <p type="p">130:製程伺服器</p>
        <p type="p">140:輥隙監控介面</p>
        <p type="p">150:輥隙感測器</p>
        <p type="p">160:生產資料庫</p>
        <p type="p">R:軋機</p>
        <p type="p">R1:粗軋機</p>
        <p type="p">R2:中軋機</p>
        <p type="p">R3:預精軋機</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="476" publication-number="202624916">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624916</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147993</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>搬運車系統及其控制方法</chinese-title>
        <english-title>TRANSPORTATION VEHICLE SYSTEM AND A CONTROL METHOD THEREFOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120241231B">G05D1/692</main-classification>
        <further-classification edition="202401120241231B">G05D1/43</further-classification>
        <further-classification edition="202401320241231B">G05D109/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盟立自動化股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIRLE AUTOMATION CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊胤勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YIN-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種搬運車系統及其控制方法。搬運車系統的中央控制裝置接收搬運車傳遞的路段預約資訊時，能執行搬運車的控制方法。中央控制裝置執行搬運車的控制方法時，將先查找出路段預約資訊，對應的路段預約清單，並判斷路段預約清單中，是否存在該搬運車的搬運車識別資料。若判定不存在該搬運車識別資料，則判斷路段預約清單中已存在的搬運車識別資料的總數量，是否超過預設數量。若判定未超出預設數量，則回傳預約成功資訊至搬運車。若判定等於預設數量，則不回傳預約成功資訊至搬運車。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure are directed to a transportation vehicle system and a control method therefor. When a central control device of the transportation vehicle system receives a road section reservation information transmitted by the transportation vehicle, the control method therefor can be executed. When the central control device executes the control method, it will first look up a road section reservation information list corresponding to the road section reservation information, and determine whether a transportation vehicle identification data exists in the road section reservation list. If it determines that the transportation vehicle identification data does not exist, it will then determine whether the total number of transportation vehicle identification data already existing in the road section reservation list exceeds a preset number. If it is determined that it does not exceed the preset number, a reservation success information will be returned to the transportation vehicle. If it is determined to be equal to the preset number, the reservation success information will not be returned to the transportation vehicle.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S11:清單查詢步驟</p>
        <p type="p">S12:數量判斷步驟</p>
        <p type="p">S13:更新步驟</p>
        <p type="p">S14:回傳步驟</p>
        <p type="p">S15:預約失敗步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="477" publication-number="202624848">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624848</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147994</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250526B">G02F1/133</main-classification>
        <further-classification edition="200601120250526B">G02F1/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭博升</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, PO-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張鴻光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HONG-KANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂璨朱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, TSAN-CHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冠賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇建太</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種電子裝置，包含：基板構造，包含：基板；第一導電層，設置於基板上且包含第一共同電極線，沿第一方向延伸；第二導電層，設置於第一導電層上且包含第二共同電極線，沿第二方向延伸，第一方向不同於第二方向，其中，於基板的法線方向上，第一共同電極線與第二共同電極線部分重疊，其中，第二共同電極線具有第一部分和第二部分，於第一方向上，第一部分的寬度大於第二部分的寬度；以及像素電極，至少一部分的像素電極設置於第二導電層上，於基板的法線方向上，像素電極與第二共同電極線部分重疊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device is provided, which comprises: a substrate structure comprising: a substrate; a first conductive layer disposed on the substrate and including a first common electrode line extending along a first direction; a second conductive layer disposed on the first conductive layer and including a second common electrode line extending along a second direction, the first direction being different from the second direction, wherein in a normal direction of the substrate, the first common electrode line partially overlaps the second common electrode line, wherein the second common electrode line has a first part and a second part, in the first direction, a width of the first part is greater than a width of the second part; and a pixel electrode, wherein at least a part of the pixel electrode is disposed on the second conductive layer, in the normal direction of the substrate, the pixel electrode partially overlaps the second common electrode line.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板構造</p>
        <p type="p">11:基板</p>
        <p type="p">12:第一導電層</p>
        <p type="p">121:第一共同電極線</p>
        <p type="p">122:閘極線</p>
        <p type="p">123:第一閘極</p>
        <p type="p">124:第二閘極</p>
        <p type="p">125:導電塊</p>
        <p type="p">13:第二導電層</p>
        <p type="p">131:第二共同電極線</p>
        <p type="p">131A:第一部分</p>
        <p type="p">131B:第二部分</p>
        <p type="p">132:數據線</p>
        <p type="p">133:第一源極</p>
        <p type="p">134:第一汲極</p>
        <p type="p">135:第二源極</p>
        <p type="p">136:第二汲極</p>
        <p type="p">15:像素電極</p>
        <p type="p">H1:第一通孔</p>
        <p type="p">H2:第二通孔</p>
        <p type="p">W1、W2:寬度</p>
        <p type="p">X:第二方向</p>
        <p type="p">Y:第一方向</p>
        <p type="p">Z:法線方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="478" publication-number="202624336">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624336</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147996</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高分子可塑劑、其製造方法、及聚氯乙烯產品</chinese-title>
        <english-title>POLYMERIC PLASTICIZER, METHOD FOR PRODUCING THE SAME, AND POLYVINYL CHLORIDE PRODUCT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250402B">C08G63/16</main-classification>
        <further-classification edition="200601120250402B">C08K5/11</further-classification>
        <further-classification edition="200601120250402B">C08L27/06</further-classification>
        <further-classification edition="200601120250402B">C08J3/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞塑膠工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAN YA PLASTICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁敬堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, CHING-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹俊哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAO, CHUN-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳品洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PIN-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種高分子可塑劑、其製造方法、以及聚氯乙烯產品。製造方法包含將二元酸成分、二元醇成分、一元酸成分進行混和，以形成一反應混合物，其中，所述二元酸成分為己二酸，所述二元醇成分包含1,2-丁二醇及二甘醇，並且所述一元酸成分為具有C8至C16碳鏈的飽和脂肪酸；以及將所述反應混合物加熱至介於150℃至210℃間的一反應溫度，並且在760托至60托的一減壓條件下進行酯化反應，以形成一高分子可塑劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A polymeric plasticizer, a method for producing the same, and a polyvinyl chloride (PVC) product are provided. The method includes: mixing a dicarboxylic acid component, a diol component, and a monocarboxylic acid component to form a reaction mixture, in which the dicarboxylic acid component is adipic acid, the diol component comprises 1,2-butanediol and diethylene glycol, and the monocarboxylic acid component is a saturated fatty acid with a carbon chain length of C8 to C16; and heating the reaction mixture to a reaction temperature ranging from 150°C to 210°C to perform an esterification reaction under a reduced pressure condition ranging from 760 Torr to 60 Torr, so as to form a polymeric plasticizer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110:步驟S110</p>
        <p type="p">S120:步驟S120</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="479" publication-number="202625458">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625458</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147997</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微型揚聲器與電路系統</chinese-title>
        <english-title>MINIATURE SPEAKER AND CIRCUIT SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250207B">H04R9/02</main-classification>
        <further-classification edition="200601120250207B">H04R9/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聖德斯貴股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOUNDS GREAT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商廈門聖德斯貴電子科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIAMEN SOUNDS GREAT ELECTRONIC SCIENCE AND TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宏達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, HONG-DA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王成川</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHENG-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王冠智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, KUAN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張若軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAMG, JO-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露書關於一種微型揚聲器與電路系統，微型揚聲器包括基板、形成於基板上的感應電路層、控制電路層與磁性元件，感應電路層連接一振膜，磁性元件與感應電路層之間具有提供振膜運動的間隙。感應電路層接受電氣訊號後，通過改變電氣訊號的極性而於感應電路層形成變動的磁場，即可與磁性元件之間形成驅動振膜運動的力，運動中的振膜產生微型揚聲器輸出的聲波。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A miniature speaker and a circuit system are provided. The miniature speaker includes a substrate, an inductive circuit layer formed on the substrate, a control circuit layer and a magnetic element. The inductive circuit layer couples to a membrane. There is a gap providing a space allowing the membrane to move between the magnetic element and the inductive circuit layer. The inductive circuit layer is configured to receive electrical signals. A changing magnetic field is formed on the inductive circuit layer by changing polarity of the electrical signals, and a force driving the membrane to move is formed between the inductive circuit layer and the magnetic element. The moving membrane produces acoustic waves to be outputted from the miniature speaker.</p>
      </isu-abst>
      <representative-img>
        <p type="p">411:接電結構</p>
        <p type="p">401:感應電路層</p>
        <p type="p">403:連接層</p>
        <p type="p">405:控制電路層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="480" publication-number="202623723">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623723</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147998</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>邊緣高彈性強化構造及其製品</chinese-title>
        <english-title>EDGE-REINFORCED HIGH ELASTICITY STRUCTURE AND ITS PRODUCT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">A43B13/42</main-classification>
        <further-classification edition="200601120241231B">A43B23/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>滙歐科技開發股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EURO-ACE COMPOSITE MANUFACTURING CO,. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭清松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAW, CHING-SONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何崇民</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種邊緣高彈性強化構造，其包含一本體以及一支撐結構，該支撐結構適用於各種形狀的板體，特別是鞋墊等可穿戴物品，在該本體邊緣設置該支撐結構，該支撐結構包括多層凹曲結構，該凹曲結構可以透過局部加熱後凹折、熱壓成型或機械凹折，旨在使該本體增強了耐用性和支撐性，並且有效減少穿戴時的壓力和摩擦，提升整體的舒適度和使用效能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An edge-reinforced high elasticity structure has a main body and a support structure. The support structure is designed to fit various shapes of plate-like objects, particularly wearable items such as insoles. It is positioned along the edge of the main body and features multiple layers of concave curves. These concave curves can be formed by localized heating, thermal pressing, or mechanical folding. This design enhances the durability and supportive of the main body, effectively reduces pressure and friction during wear, and improves overall comfort and functionality.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:本體</p>
        <p type="p">11:氣孔</p>
        <p type="p">20:支撐結構</p>
        <p type="p">21:凹曲部</p>
        <p type="p">211:第一凹曲部</p>
        <p type="p">212:第二凹曲部</p>
        <p type="p">22:彈片部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="481" publication-number="202625622">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625622</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147999</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其製作方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D89/60</main-classification>
        <further-classification edition="202601120260302B">H10W42/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜　東鶴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DU, DONGHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱曉忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, XIAO ZHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體結構包含半導體基底；源極結構，設置在半導體基底中，源極結構包含源極漂移區和設置在源極漂移區內的重摻雜源極區；凹槽，設置在半導體基底中且與源極結構間隔開；汲極結構，設置在凹槽的底部，汲極結構包含汲極漂移區、設置在汲極漂移區內的重摻雜汲極區和位於重摻雜汲極區上的碳摻雜表面層；以及閘極結構，設置在半導體基底上且位於源極結構和汲極結構之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure includes a semiconductor substrate; a source structure in the semiconductor substrate, wherein the source structure includes a source drift region and a heavily doped source region within the source drift region; a recessed trench disposed in the semiconductor substrate and spaced apart from the source structure; a drain structure disposed at a bottom of the recessed trench, wherein the drain structure includes a drain drift region, a heavily doped drain region disposed within the drain drift region, and a carbon-doped surface layer on the heavily doped drain region; and a gate structure disposed on the semiconductor substrate between the source structure and the drain structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體結構</p>
        <p type="p">100:半導體基底</p>
        <p type="p">100a:主表面</p>
        <p type="p">101p:輸出輸入P型井</p>
        <p type="p">101n:深N型井</p>
        <p type="p">302:矽化金屬阻擋層</p>
        <p type="p">310:介電層</p>
        <p type="p">CS1:碳摻雜表面層</p>
        <p type="p">CT1、CT2:接觸插塞</p>
        <p type="p">DF1:源極漂移區</p>
        <p type="p">DF2:汲極漂移區</p>
        <p type="p">GE1:閘極電極</p>
        <p type="p">GD1:閘極介電層</p>
        <p type="p">NR1:重摻雜源極區</p>
        <p type="p">NR2a、NR2b:重摻雜汲極區</p>
        <p type="p">SAC1、SAC2、SAC5:矽化金屬層</p>
        <p type="p">SB1:底部</p>
        <p type="p">SP1:側壁子</p>
        <p type="p">SW1:側壁</p>
        <p type="p">P1:閘極結構</p>
        <p type="p">R:轉角</p>
        <p type="p">RT1:凹槽</p>
        <p type="p">SS:源極結構</p>
        <p type="p">DS:汲極結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="482" publication-number="202625624">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625624</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148003</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有二次光偏折的光感測結構</chinese-title>
        <english-title>LIGHT-SENSING STRUCTURE WITH SECONDARY LIGHT DEFLECTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250416B">H10F30/21</main-classification>
        <further-classification edition="202501120250416B">H10F77/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中央大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CENTRAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳奇夆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHI-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝丞駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHENG-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊億</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種具有二次光偏折的光感測結構，設置於光學感測元件之一側，光感測結構包含有集光板及光偏折元件。集光板具有相鄰於光學感測元件的第一集光面及遠離光學感測元件的第二集光面，而第一集光面傳遞由第二集光面收集之有效光源至光學感測元件；光偏折元件設置於集光板與光學感測元件之間，第一集光面傳遞的有效光源利用光偏折元件而偏離原本有效光源的行徑路線而傳遞至光學感測元件，進而增加收光效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a light-sensing structure with secondary light deflection, positioned on one side of an optical sensing element. The light-sensing structure comprises a light-collecting plate and a light-deflection element. The light-collecting plate includes a first light-collecting surface adjacent to the optical sensing element and a second light-collecting surface located away from the optical sensing element. The first light-collecting surface transmits effective light sources collected by the econd light-collecting surface to the optical sensing element. The light-deflection lement is situated between the light-collecting plate and the optical sensing element. he effective light sources transmitted by the first light-collecting surface are eflected from their original paths by the light-deflection element and then delivered to the optical sensing element, thereby enhancing light-collection efficiency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:具有二次光偏折的光感測結構</p>
        <p type="p">1:光學感測元件</p>
        <p type="p">2:有效光源</p>
        <p type="p">10:集光板</p>
        <p type="p">10a:基礎側邊</p>
        <p type="p">11:第一集光面</p>
        <p type="p">12:第二集光面</p>
        <p type="p">20:光偏折元件</p>
        <p type="p">23:反射件</p>
        <p type="p">231:側部反射件</p>
        <p type="p">232:中央反射件</p>
        <p type="p">30:加強集光板</p>
        <p type="p">31:第一加強面</p>
        <p type="p">32:第二加強面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="483" publication-number="202623981">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623981</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148005</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>馬達定子之漆包線多段式電流熔結方法及應用彼之馬達</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">B29C35/02</main-classification>
        <further-classification edition="202501120250102B">H02K15/12</further-classification>
        <further-classification edition="202501120250102B">H02K15/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷虎科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林湧群</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹銘煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓修齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種馬達定子之漆包線多段式電流熔結方法，取一馬達定子，向其輸入第一電流並延續第一時程，藉由線圈產生熱量使漆包線的膠結層活化處於熔融狀態。待第一時程結束後，再向馬達定子輸入比第一電流低的第二電流並延續第二時程，使線圈產生熱量下降而逐漸降溫，讓仍處於熔融狀態的膠結層逐漸固化。待第二時程結束，解除第二電流至膠結層完全冷卻，使該些線圈之漆包線相互固結，即完成漆包線熔結固定之馬達定子，並應用此馬達定子製得馬達。以此方法可有效縮短漆包線固結時間，提高生產效率且固結後漆包線及支板表面平整不干擾馬達運轉，確保馬達生產良率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="484" publication-number="202625339">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625339</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148006</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>馬達殼體之磁鐵容置結構成型方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H02K15/03</main-classification>
        <further-classification edition="202501120250102B">H02K15/14</further-classification>
        <further-classification edition="200601120250102B">H02K1/17</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷虎科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林湧群</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹銘煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓修齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種馬達殼體之磁鐵容置結構成型方法，取一殼體，以拉刀方式沿殼體軸向在其環形內壁開設複數嵌槽，使相鄰嵌槽之間形成一凸肋，取一端蓋，將端蓋具一環形凸部之一側組設於殼體，並組接於各凸肋之端部，使各嵌槽之一端被兩相鄰凸肋及環形凸部所圍合，另一端呈開放狀。再將磁鐵磁吸置入嵌槽內，即完成磁鐵的安裝，並製成馬達殼體作爲馬達外轉子，並應用此馬達殼體與內定子組裝製得馬達。本發明以拉刀方式成型嵌槽，降低加工難度，且凸肋不易偏移歪斜，使磁鐵精準填裝，不僅提高生產效率，更降低生產不良率，所製得馬達運轉平穩度高。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="485" publication-number="202625147">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625147</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148011</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙穩態顯示器及雙穩態顯示器驅動方法</chinese-title>
        <english-title>BISTABLE DISPLAY AND BISTABLE DISPLAY DRIVING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250307B">G09G3/34</main-classification>
        <further-classification edition="200601120250307B">G09G3/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>虹彩光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IRIS OPTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊仁光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JEN KUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚正宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, CHENG HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖奇璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHI CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供一種雙穩態顯示器，其包含顯示面板及驅動裝置。顯示面板包含複數像素、複數掃描線及複數資料線。驅動裝置傳輸複數掃描訊號至掃描線且傳輸複數資料訊號至資料線，並提供共同電壓至像素，藉以控制像素處於亮態、完全亮態或完全暗態。當共同電壓與此些資料訊號的一者具有相反相位時，此些像素的一者處於完全暗態。當共同電壓與此些資料訊號的此者具有相同相位時，此些像素的此者處於亮態或完全亮態。像素處於亮態和完全亮態下分別具有第一反射率與第二反射率，第一反射率小於第二反射率。藉此，可達到快速應答與動畫化顯示。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bistable display is proposed, and includes a display panel and a driving device. The display panel includes a plurality of pixels, a plurality of scan lines and a plurality of data lines. The driving device transmits a plurality of scan signals to the scan lines and a plurality of data signals to the data lines, and provides a common voltage to the pixels to control the pixels to be in a bright state, an entirely bright state, or an entirely dark state. When the common voltage is in opposite phase to one of the data signals, one of the pixels is in the entirely dark state. When the common voltage has the same phase as the one of the data signals, the one of the pixels is in the bright state or the entirely bright state. The one of the pixels has a first reflectivity and a second reflectivity respectively in the bright state and the entirely bright state, and the first reflectivity is smaller than the second reflectivity. Thus, fast response and animated display can be achieved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:雙穩態顯示器</p>
        <p type="p">110:顯示面板</p>
        <p type="p">120:驅動裝置</p>
        <p type="p">121:閘極驅動器</p>
        <p type="p">122:源極驅動器</p>
        <p type="p">123:共同電極驅動單元</p>
        <p type="p">124:時序控制器</p>
        <p type="p">D&lt;sub&gt;1&lt;/sub&gt;,D&lt;sub&gt;2&lt;/sub&gt;,D&lt;sub&gt;M-1&lt;/sub&gt;,D&lt;sub&gt;M&lt;/sub&gt;:資料線</p>
        <p type="p">DS&lt;sub&gt;1&lt;/sub&gt;,DS&lt;sub&gt;2&lt;/sub&gt;,DS&lt;sub&gt;M-1&lt;/sub&gt;,DS&lt;sub&gt;M&lt;/sub&gt;:資料訊號</p>
        <p type="p">G&lt;sub&gt;1&lt;/sub&gt;,G&lt;sub&gt;2&lt;/sub&gt;,G&lt;sub&gt;N&lt;/sub&gt;:掃描線</p>
        <p type="p">GS&lt;sub&gt;1&lt;/sub&gt;,GS&lt;sub&gt;2&lt;/sub&gt;,GS&lt;sub&gt;N&lt;/sub&gt;:掃描訊號</p>
        <p type="p">Ena:致能訊號</p>
        <p type="p">Hsync:水平同步訊號</p>
        <p type="p">P:像素</p>
        <p type="p">T:電晶體</p>
        <p type="p">Vcom:共同電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="486" publication-number="202623908">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623908</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148013</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>超音波換能器</chinese-title>
        <english-title>ULTRASONIC TRANSDUCER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250324B">B06B1/06</main-classification>
        <further-classification edition="200601120250324B">B06B1/02</further-classification>
        <further-classification edition="200601120250324B">A61B8/00</further-classification>
        <further-classification edition="200601120250324B">G01N29/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佳世達科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QISDA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣富昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, FU-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種超音波換能器，其包括換能層與聲透鏡層。換能層具有相對的第一表面與第二表面。換能層包括壓電材料層。壓電材料層具有第一切口。第一切口沿第一方向延伸，並朝向聲透鏡層。第一方向平行於壓電材料層的厚度方向。聲透鏡層設置於第一表面。聲透鏡層具有一弧面，弧面沿第二方向配置。第二方向平行於該壓電材料層的寬度方向。第一切口對應於該第一表面具有第一坐標點，第一坐標點沿第一方向對應到弧面的一焦點，第一坐標點與焦點之間的距離等於超音波之中心頻率的1/2波長整數倍。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An ultrasonic transducer is used to transmit and receive an ultrasonic signal. The ultrasonic transducer includes an energy conversion layer and an acoustic lens layer. The energy conversion layer has a first surface and a second surface that are opposite to each other. The transducing layer includes a piezoelectric material layer. The piezoelectric material layer has a first groove. The first groove extends along a first direction and faces the acoustic lens layer. The first direction is parallel to a thickness direction of the piezoelectric material layer. The acoustic lens layer is disposed on the first surface. The acoustic lens layer has an arc surface, and the arc surface is arranged along a second direction. The second direction is parallel to a width direction of the piezoelectric material layer. The first groove has a first coordinate point corresponding to the first surface. The first coordinate point corresponds to a focus of the arc surface along the first direction. A distance between the first coordinate point and the focus is equal to an integer multiple of 1/2 wavelength of a center frequency of the ultrasonic signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S:換能層</p>
        <p type="p">S1:第一表面</p>
        <p type="p">S2:第二表面</p>
        <p type="p">1:壓電材料層</p>
        <p type="p">11:第一切口</p>
        <p type="p">12:第二切口</p>
        <p type="p">2:聲透鏡層</p>
        <p type="p">21:弧面</p>
        <p type="p">3:背載材料層</p>
        <p type="p">4:填充材料</p>
        <p type="p">5:匹配層</p>
        <p type="p">C1:第一坐標點</p>
        <p type="p">C2:第二坐標點</p>
        <p type="p">F:焦點</p>
        <p type="p">N:法線</p>
        <p type="p">θ1:第一夾角</p>
        <p type="p">θ2:第二夾角</p>
        <p type="p">T1、T2:厚度</p>
        <p type="p">W1、W2:寬度</p>
        <p type="p">D1、D2:深度</p>
        <p type="p">H1:距離</p>
        <p type="p">L1:第一連線</p>
        <p type="p">L2:第二連線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="487" publication-number="202624156">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624156</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148014</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>玻璃纖維絲及其製造方法</chinese-title>
        <english-title>GLASS FIBER AND METHOD FOR PRODUCING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241218B">C03B37/022</main-classification>
        <further-classification edition="200601120241218B">C03B37/014</further-classification>
        <further-classification edition="200601120241218B">C03C13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞塑膠工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAN YA PLASTICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁敬堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, CHING-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭維昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, WEI-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇珈臻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, CHIA-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種玻璃纖維絲及其製造方法。所述玻璃纖維絲的製造方法包含一披覆步驟、一混合步驟及一抽紗步驟。於所述披覆步驟中，將氮化矽化粉末披覆於多個無機粒子的表面以形成多個改質無機粒子。基於各個所述改質無機粒子的總重為100 wt%，所述氮化矽化粉末的含量是介於0.01 wt%至5 wt%之間，並且所述無機粒子的含量是介於95 wt%至99.99 wt%之間。於所述混合步驟中，將多個所述改質無機粒子混合於呈熔融狀態的一玻璃原料中。於所述抽紗步驟中，對混合有多個所述改質無機粒子的所述玻璃原料進行抽紗以形成一玻璃纖維絲。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A glass fiber and method for producing the same are provided. The method for producing the glass fiber includes a covering process, a mixing process, and a drawing process. The covering process is implemented by covering a plurality of silicon nitride powders onto a plurality of surfaces of a plurality of inorganic particles to form a plurality of modified inorganic particles. Based on a total weight of each of the modified inorganic particles being 100 wt%, a content of the silicon nitride powders is between 0.01 wt% and 5 wt%, and a content of the inorganic particles is between 95 wt% and 99 wt%. The mixing process is implemented by mixing the modified inorganic particles into a glass raw material that is in a molten state. The drawing process is implemented by drawing the glass raw material having the modified inorganic particles mixed therein to form a glass fiber.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110:披覆步驟</p>
        <p type="p">S120:混合步驟</p>
        <p type="p">S130:抽紗步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="488" publication-number="202625606">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625606</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148015</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250801B">H10D64/27</main-classification>
        <further-classification edition="202501120250801B">H10D64/20</further-classification>
        <further-classification edition="202501120250801B">H10D62/10</further-classification>
        <further-classification edition="202501120250801B">H10D30/47</further-classification>
        <further-classification edition="202501120250801B">H10D64/01</further-classification>
        <further-classification edition="202501120250801B">H10D30/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>冠亞半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAMP-ASIA SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾瑞倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, JUI-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉尊揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YE, TZUEN-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林義傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉彥宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁國隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體結構及其製造方法，半導體結構包含一基板、一通道層、一電極及一多層場板。其中，通道層設置於基板上方，電極設置於通道層上方。多層場板電性連結至電極，具有至少一第一場板及一第二場板，其中第一場板與電極部分重疊連結，第二場板與第一場板部分重疊連結，使電極與多層場板共同地形成一連續階梯狀結構，其中，所述部分重疊連結係指部分直接實體接觸和連接的一種配置而沒有任何中間結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure and a manufacturing method are provided. The semiconductor structure comprises a substrate, a channel layer, an electrode, and a multilayer field plate. The channel layer is disposed above the substrate. The electrode is disposed above the channel layer. The multilayer field plate is electrically connected to the electrode and includes at least a first field plate and a second field plate. The first field plate partially overlaps and connects with the electrode. The second field plate partially overlaps and connects with the first field plate. The electrode and the multilayer field plate are configured to collectively form a continuous stepped structure. The term of partially overlapping and connecting refers to a configuration of partially direct physical contact and connection without any intervening structures.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板</p>
        <p type="p">110:通道層</p>
        <p type="p">120:覆蓋層</p>
        <p type="p">130:源極電極</p>
        <p type="p">140:汲極電極</p>
        <p type="p">150:第一阻擋層</p>
        <p type="p">151:第一介電層</p>
        <p type="p">152:第二阻擋層</p>
        <p type="p">153:第二介電層</p>
        <p type="p">162:閘極電極</p>
        <p type="p">164:多層場板</p>
        <p type="p">1641:第一場板</p>
        <p type="p">1642:第二場板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="489" publication-number="202625823">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625823</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148024</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>靜電放電保護結構</chinese-title>
        <english-title>ELECTROSTATIC DISCHARGE PROTECTION STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W42/60</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>世界先進積體電路股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪力揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, LI-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李建興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JIAN-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃曄仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YEH-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周業甯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOU, YEH-NING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種靜電放電保護結構，包括一基底、一井區、一第一摻雜區、一第二摻雜區以及一電壓提取結構。基底具有一第一導電型。井區設置於基底之中，並具有一第二導電型。第一摻雜區設置於井區之中，電性連接一第一電源線，並具有第一導電型。第二摻雜區設置於基底之中，電性連接一第二電源線，並具有第二導電型。電壓提取結構包括複數氧化物定義區。設置於井區的氧化物定義區映射至基底的總面積小於第一摻雜區映射至基底的面積。設置於基底的氧化物定義區映射至基底的總面積小於第二摻雜區映射至基底的面積。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrostatic discharge (ESD) protection structure including a substrate, a well, a first doped region, a second doped region, and a voltage pick-up structure is provided. The substrate has a first conductivity type. The well is disposed in the substrate and has a second conductivity type. The first doped region is disposed in the well, electrically connected to a first power line and has the first conductivity type. The second doped region is disposed in the substrate, electrically connected to a second power line and has the second conductivity type. The voltage pick-up structure includes a plurality of oxide definition regions. The total projection area of ​​the oxide definition region disposed in the well on the substrate is smaller than the projection area of ​​the first doped region on the substrate. The total projection area of ​​the oxide definition region disposed in the substrate on the substrate is smaller than the projection area of ​​the second doped region on the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:靜電放電保護結構</p>
        <p type="p">110:基底</p>
        <p type="p">121、122:井區</p>
        <p type="p">131、132:摻雜區</p>
        <p type="p">140:電壓提取結構</p>
        <p type="p">141~146:氧化物定義區</p>
        <p type="p">D1~D6、S1~S4:距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="490" publication-number="202624385">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624385</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148027</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚烯烴組合物、聚烯烴膜的製造方法及聚烯烴皮革</chinese-title>
        <english-title>POLYOLEFIN COMPOSITION, MANUFACTURING METHOD OF POLYOLEFIN FILM, AND POLYOLEFIN LEATHER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250402B">C08L23/00</main-classification>
        <further-classification edition="202501120250402B">C08L23/08</further-classification>
        <further-classification edition="200601120250402B">C08L53/00</further-classification>
        <further-classification edition="200601120250402B">C08J5/18</further-classification>
        <further-classification edition="202001120250402B">C08J7/04</further-classification>
        <further-classification edition="200601120250402B">D06N3/00</further-classification>
        <further-classification edition="200601120250402B">D06N3/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞塑膠工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAN YA PLASTICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁敬堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, CHING-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹俊哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAO, CHUN-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴佳昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHIA-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種聚烯烴組合物、聚烯烴膜的製造方法及聚烯烴皮革。所述聚烯烴組合物包括100 PHR的聚烯烴彈性體以及1 PHR至10 PHR的熱塑性聚烯烴。所述聚烯烴彈性體包括聚烯烴嵌段共聚物以及乙烯-辛烯共聚物。所述聚烯烴嵌段共聚物與所述乙烯-辛烯共聚物的重量比為1:1至1:10。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a polyolefin composition, manufacturing method of polyolefin film, and polyolefin leather. The polyolefin composition includes 100 PHR of polyolefin elastomer and 1 to 10 PHR of thermoplastic polyolefin. The polyolefin elastomer includes polyolefin block copolymers and ethylene-octene copolymers. The weight ratio of the polyolefin block copolymer to the ethylene-octene copolymer is 1:1 to 1:10.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10~S40:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="491" publication-number="202625372">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625372</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148045</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>開關元件</chinese-title>
        <english-title>SWITCHING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241218B">H03K17/687</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃聖峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHENG-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱鈺梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, YU-MEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊詠舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YUNG-SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王富民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, FU-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露公開了一種開關元件，其包括閘極以及半導體。半導體包括第一區、第二區以及第三區，第一區位於第二區與第三區之間，第一區包括至少一第一子區及除了至少一第一子區以外的第二子區，而至少一第一子區鄰近半導體的邊緣。於開關元件的俯視圖中，第一區的至少一部份與閘極重疊，且至少一第一子區所摻雜的離子濃度與第二子區所摻雜的離子濃度不同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure r discloses a switching device having a gate and a semiconductor. The semiconductor includes a first region, a second region, and a third region, wherein the first region is located between the second region and the third region. The first region includes at least one first sub-region and a second sub-region other than the at least one first sub-region, and the at least one first sub-region is adjacent to an edge of the semiconductor. In a top view of the switching device, at least a portion of the first region overlaps with the gate, and the doping concentration of the at least one first sub-region is different from the doping concentration of the second sub-region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10A:開關元件</p>
        <p type="p">20:半導體</p>
        <p type="p">30:閘極</p>
        <p type="p">32:第二子區</p>
        <p type="p">34:輕摻雜區</p>
        <p type="p">40:第一區</p>
        <p type="p">43、45:連接線</p>
        <p type="p">44:第一子區</p>
        <p type="p">50:第二區</p>
        <p type="p">60:第三區</p>
        <p type="p">70:穿孔</p>
        <p type="p">E1:邊緣</p>
        <p type="p">L1、L2、W1、W2:距離</p>
        <p type="p">S、S2、S3:側邊</p>
        <p type="p">X、Y、Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="492" publication-number="202623869">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623869</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148056</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>仿生動物</chinese-title>
        <english-title>BIONIC ANIMAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">A63H13/02</main-classification>
        <further-classification edition="200601120251103B">A63H29/24</further-classification>
        <further-classification edition="200601120251103B">F16H33/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>先鋒材料科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PIONEER MATERIAL PRECISION TECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林家樑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIA-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊皓程</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, HAO-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種仿生動物，包含一軀體、一馬達以及一腿部。該馬達設置於該軀體中。該腿部連接於該馬達。該腿部包含一連桿機構以及一彈性體。該連桿機構包含複數個連桿。該複數個連桿可轉動地相互連接。該彈性體嵌設於該複數個連桿中。該彈性體隨著該複數個連桿的轉動而彈性變形。在該複數個連桿轉動後，該彈性體提供彈性力使該複數個連桿復位。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bionic animal includes a body, a motor and a leg. The motor is disposed in the body. The leg is connected to the motor. The leg includes a linkage mechanism and an elastomer. The linkage mechanism includes a plurality of linkage bars. The plurality of linkage bars are rotatably connected to each other. The elastomer is embedded in the plurality of linkage bars. The elastomer elastically deforms along with rotation of the plurality of connecting bars. After the plurality of linkage bars rotate, the elastomer provides an elastic force to make the plurality of linkage bars return.</p>
      </isu-abst>
      <representative-img>
        <p type="p">14:腿部</p>
        <p type="p">140:連桿機構</p>
        <p type="p">140a,140b,140c,140d:連桿</p>
        <p type="p">142:彈性體</p>
        <p type="p">1400:容置槽</p>
        <p type="p">1402:定位柱</p>
        <p type="p">1404:卡槽</p>
        <p type="p">1408:避讓槽</p>
        <p type="p">1420:定位孔</p>
        <p type="p">1422:突出部</p>
        <p type="p">1424:可變形回彈結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="493" publication-number="202625502">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625502</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148060</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>燈效控制方法與電子裝置</chinese-title>
        <english-title>LIGHTING EFFECT CONTROL METHOD AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250203B">H05B47/105</main-classification>
        <further-classification edition="200601120250203B">H01H13/84</further-classification>
        <further-classification edition="200601120250203B">G06F13/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIH-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昱維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種燈效控制方法與電子裝置。所述方法包括：取得目標影像；取得燈效裝置的組態資訊，其中組態資訊反映多個發光元件的實體位置分布狀態；根據目標影像與組態資訊，建立對應於所述多個發光元件的燈效控制映射表；以及在顯示器呈現目標影像的期間，根據燈效控制映射表，控制燈效裝置發光，以同步透過所述多個發光元件呈現目標影像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A lighting effect control method and an electronic device are disclosed. The method includes: obtaining a target image; obtaining configuration information of a lighting effect device, wherein the configuration information reflects a physical position distribution status of a plurality of light-emitting components; establishing a lighting effect control mapping table corresponding the light-emitting components according to the target image and the configuration information; and during a period when the display presents the target image, controlling the lighting effect device to emit light according to the lighting effect control mapping table to synchronously present the target image through the light-emitting components.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S601~S604:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="494" publication-number="202625322">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625322</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148061</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>VCSEL元件及其製造方法</chinese-title>
        <english-title>VCSEL COMPONENT AND METHOD FOR MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250203B">H01S5/024</main-classification>
        <further-classification edition="200601120250203B">H01S5/183</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台亞半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN-ASIA SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李尚澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SHANG-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林義傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉彥宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁國隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種VCSEL元件製造方法，包括以下步驟：提供磷化銦基板；執行磊晶製程以於磷化銦基板上形成磊晶結構，且磊晶結構包括頂面及底面；執行第一平台成型製程以使磊晶結構形成第一平台；執行濕氧化製程以於第一平台內形成濕氧層；移除磷化銦基板；執行第二平台成型製程以使磊晶結構形成第二平台，且第二平台與第一平台之間形成間隙；執行沉積製程以於磊晶結構上形成絕緣層；以及執行金屬化製程以於磊晶結構上形成N型電極及P型電極，其中N型電極位於磊晶結構之底面，且P型電極自磊晶結構之頂面沿著側壁延伸至底面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention provides a method for manufacturing a VCSEL component, which includes the following steps: providing an InP substrate; performing an epitaxial process to form an epitaxial structure on the InP substrate, and the epitaxial structure includes a top surface and a bottom surface; performing a first mesa formation process to form a first mesa from the top surface of the epitaxial structure; performing a wet oxidation process to form a wet oxide layer in the first mesa; removing the InP substrate; performing a second mesa formation process to form a second mesa from the top surface of the epitaxial structure, and a gap is formed between the first mesa and the second mesa; performing a deposition process to form an insulating layer on the epitaxial structure; and performing a metallization process to form an N-type electrode and a P-type electrode on the epitaxial structure, where the N-type electrode is positioned on the bottom surface of the epitaxial structure, and the P-type electrode extends from the top surface of the epitaxial structure along a sidewall to the bottom surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S8:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="495" publication-number="202623961">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623961</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148063</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>棘輪扳手</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250109B">B25B13/46</main-classification>
        <further-classification edition="200601120250109B">B25B13/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭雋翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭雋翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉安鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種棘輪扳手，包含有：一棘輪扳手本體，具有一握桿、一棘輪機構及一驅動頭，該握桿之自由端面上軸向往內延伸有一收納孔，該收納孔具有一內孔，該內孔為四角孔，該內孔之各內壁面上各別形成有一定位部，該棘輪機構係設置於該握桿內，該驅動頭係與該棘輪機構連接，而位於該握桿之一側面上；一連接用配件，具有一配件主體及一定位單元，該配件主體具有一位於一端之柱部及一位於另一端之孔部，該柱部為四角柱，該孔部之自由端面上往內軸向延伸形成有一呈四角孔狀之套接孔，該定位單元係設置於該配件主體之柱部外側面上，用以與該定位部進行可分離之定位結合，以將該連接用配件收納於該收納孔中；藉以達到不易遺失、不易忘記攜帶及使用上較為便利之功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:棘輪扳手</p>
        <p type="p">10:棘輪扳手本體</p>
        <p type="p">11:握桿</p>
        <p type="p">111:握持端</p>
        <p type="p">113:收納孔</p>
        <p type="p">114:內孔</p>
        <p type="p">115:外孔</p>
        <p type="p">116:定位部</p>
        <p type="p">117:弧形凹槽</p>
        <p type="p">20:連接用配件</p>
        <p type="p">21:配件主體</p>
        <p type="p">211:柱部</p>
        <p type="p">212:孔部</p>
        <p type="p">213:身部</p>
        <p type="p">214:套接孔</p>
        <p type="p">22:定位單元</p>
        <p type="p">221:凹槽</p>
        <p type="p">222:珠體</p>
        <p type="p">223:彈簧</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="496" publication-number="202625373">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625373</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148065</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>開關裝置及其控制方法</chinese-title>
        <english-title>SWITCH DEVICE AND CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241218B">H03K17/687</main-classification>
        <further-classification edition="200601120241218B">H03K17/567</further-classification>
        <further-classification edition="200601120241218B">H03K17/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立積電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHWAVE TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李孟倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, MENG-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭天雲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, TIEN-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳智聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提出一種開關裝置及其控制方法。開關裝置包括接收電路。接收電路包括接收串聯電路。接收串聯電路包括相互串聯的多個接收串聯電晶體，接收串聯電晶體由至少一第一接收串聯電晶體及至少一第二接收串聯電晶體所組成。當開關裝置執行第一模式時，至少一第一接收串聯電晶體為導通，至少一第二接收串聯電晶體為截止。當開關裝置執行第二模式時，至少一第一接收串聯電晶體為導通，至少一第二接收串聯電晶體為導通。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A switch device and a control method thereof are provided. The switch device includes a receiving circuit. The receiving circuit includes a receiving series circuit. The receiving series circuit includes a plurality of receiving series transistors coupled in series with each other, and the receiving series transistors includes at least one first receiving series transistor and at least one second receiving series transistor. When the switch device performs a first mode, the at least one first receiving series transistor is turned on, and the at least one second receiving series transistor is cut-off. When the switch device performs a second mode, the at least one first receiving series transistor is turned on, and the at least one second receiving series transistor is turned on.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:開關裝置</p>
        <p type="p">110:接收電路</p>
        <p type="p">111:接收串聯電路</p>
        <p type="p">CP1、CP2:寄生電容</p>
        <p type="p">S1、S2:控制訊號</p>
        <p type="p">T1、T2:接收串聯電晶體</p>
        <p type="p">TE1、TE2:終端</p>
        <p type="p">VD、VS:端點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="497" publication-number="202623870">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623870</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148070</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>仿生動物</chinese-title>
        <english-title>BIONIC ANIMAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">A63H13/02</main-classification>
        <further-classification edition="200601120241231B">A63H29/22</further-classification>
        <further-classification edition="200601120241231B">A63H29/24</further-classification>
        <further-classification edition="200601120241231B">A63H3/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>先鋒材料科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PIONEER MATERIAL PRECISION TECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林家樑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIA-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊皓程</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, HAO-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種仿生動物，包含一前軀體、一後軀體以及一尾部。該後軀體可轉動地連接於該前軀體。該尾部連接於該後軀體。該尾部包含一彈性體、複數個關節組件以及至少一驅動線。該複數個關節組件相互並排地設置於該彈性體上。該至少一驅動線穿設於該複數個關節組件且連接於該前驅體。當該後軀體相對該前軀體轉動時，該至少一驅動線被拉動而驅動該複數個關節組件相對轉動，進而帶動該彈性體彈性變形。在該至少一驅動線被釋放後，該彈性體提供彈性力使該複數個關節組件復位。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bionic animal includes a fore body, a hind body and a tail. The hind body is rotatably connected to the fore body. The tail is connected to the hind body. The tail includes an elastomer, a plurality of joint members and at least one driving wire. The plurality of joint members are disposed side by side on the elastomer. The at least one driving wire passes through the plurality of joint members and is connected to the fore body. When the hind body rotates with respect to the fore body, the at least one driving wire is pulled to drive the plurality of joint members to rotate with respect to each other, so as to drive the elastomer to elastically deform. After the at least one driving wire is released, the elastomer provides an elastic force to make the plurality of joint members return.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:仿生動物</p>
        <p type="p">10:前軀體</p>
        <p type="p">12:後軀體</p>
        <p type="p">14:尾部</p>
        <p type="p">100:架體</p>
        <p type="p">102:連接件</p>
        <p type="p">120:第一轉動件</p>
        <p type="p">122:第二轉動件</p>
        <p type="p">142:關節組件</p>
        <p type="p">144a,144b,144c:驅動線</p>
        <p type="p">1422:固定塊</p>
        <p type="p">1424:卡槽</p>
        <p type="p">1428:關節</p>
        <p type="p">A1:第一軸</p>
        <p type="p">A2:第二軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="498" publication-number="202625532">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625532</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148081</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>機箱及托盤</chinese-title>
        <english-title>CHASSIS AND TRAY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250418B">H05K7/14</main-classification>
        <further-classification edition="200601120250418B">G06F1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緯穎科技服務股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIWYNN CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張智瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾云婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, YUN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種機箱，包含一殼體以及一托盤。托盤設置於殼體中。托盤包含一盤體、一鎖定件以及一釋鎖件。盤體具有一底板以及一側牆。鎖定件樞接於底板，且鎖定件與殼體鎖定。釋鎖件樞接於側牆，且釋鎖件與鎖定件卡合。當釋鎖件朝一第一方向轉動而脫離鎖定件時，托盤可自殼體中移出，且鎖定件可被殼體推動而朝一第二方向轉動，使得鎖定件與殼體釋鎖。第一方向垂直第二方向。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A chassis includes a casing and a tray. The tray is disposed in the casing. The tray includes a tray body, a lock member and an unlock member. The tray body has a bottom plate and a side wall. The lock member is pivotally connected to the bottom plate and the lock member is locked with the casing. The unlock member is pivotally connected to the side wall and the unlock member engages with the lock member. When the unlock member rotates toward a first direction to disengage from the lock member, the tray is able to move out of the casing and the lock member is able to be pushed by the casing to rotate toward a second direction, such that the lock member is unlocked from the casing. The first direction is perpendicular to the second direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:機箱</p>
        <p type="p">10:殼體</p>
        <p type="p">12:托盤</p>
        <p type="p">120:盤體</p>
        <p type="p">122:鎖定件</p>
        <p type="p">124:釋鎖件</p>
        <p type="p">126:第一復位件</p>
        <p type="p">128:第二復位件</p>
        <p type="p">130,132:樞軸</p>
        <p type="p">1200:底板</p>
        <p type="p">1202:側牆</p>
        <p type="p">1204:通孔</p>
        <p type="p">1206,1208,1220,1240:連接部</p>
        <p type="p">1210:避讓孔</p>
        <p type="p">1212:凹陷部</p>
        <p type="p">1214:止擋部</p>
        <p type="p">1242:按壓部</p>
        <p type="p">1244:卡勾</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="499" publication-number="202625347">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625347</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148099</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>能偵測直流電壓信息的控制器</chinese-title>
        <english-title>CONTROLLER CAPABLE OF DETECTING A DIRECT CURRENT (DC) VOLTAGE INFORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200701120250806B">H02M1/42</main-classification>
        <further-classification edition="200601120250806B">H02M1/08</further-classification>
        <further-classification edition="200601120250806B">G05F1/565</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>通嘉科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEADTREND TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏健州</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, JIAN-ZHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">能偵測直流電壓信息的控制器應用於一功率因素校正電源轉換器。該控制器包含一主動開關和一濾波器。該主動開關是用以從該控制器的一偵測接腳接收一偵測信號，且濾除該偵測信號中的一電壓成分以產生一第一信號，其中該電壓成分有關於該功率因素校正電源轉換器中的一功率開關的開啟期間。該濾波器耦接於該主動開關，用以濾除該第一信號中的一開關切換成分以產生該直流電壓信息。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A controller capable of detecting a direct current (DC) voltage information is applied to a power factor correction (PFC) power converter. The controller includes an active switch and a filter. The active switch is used for receiving a detection signal from a detection pin of the controller, and filtering a voltage component of the detection signal to generate a first signal, wherein the voltage component relates to a turning-on period of a power switch of the PFC power converter. The filter is coupled to the active switch and used for filtering a switching component of the first signal to generate the DC voltage information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:功率因素校正電源轉換器</p>
        <p type="p">102:功率開關</p>
        <p type="p">104:電感</p>
        <p type="p">106:橋式整流器</p>
        <p type="p">200:控制器</p>
        <p type="p">202:主動開關</p>
        <p type="p">204:濾波器</p>
        <p type="p">206:比較器</p>
        <p type="p">208:過壓/欠壓保護電路</p>
        <p type="p">210:高/低壓偵測電路</p>
        <p type="p">BNI/BNOPS:過壓/欠壓保護信號</p>
        <p type="p">DRV:驅動信號</p>
        <p type="p">PFCCSZCD_IN(t):第一信號</p>
        <p type="p">PFCCSZCD_LPF(t):直流電壓信息</p>
        <p type="p">PFCCSZCDS(t):偵測信號</p>
        <p type="p">PFCDRV、GND、PFCCSZCD:接腳</p>
        <p type="p">RPFCZCDH:上電阻</p>
        <p type="p">RPFCZCDL:下電阻</p>
        <p type="p">THDOS:總諧波失真優化信號</p>
        <p type="p">VAC:交流電壓</p>
        <p type="p">VIN(t):直流電壓</p>
        <p type="p">VDS(t):汲極電壓</p>
        <p type="p">ZCDS:零交越偵測信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="500" publication-number="202625729">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625729</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148105</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>對位平台及校正方法</chinese-title>
        <english-title>ALIGNMENT STAGE AND CALIBRATION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260316B">H10P72/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓金星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUO, CHIN-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王錦燕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓金星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUO, CHIN-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王錦燕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種對位平台，其包括：一基座；一平台，可活動地設於該基座；一驅動裝置，可帶動該平台相對該基座活動；至少一氣體流通部，該至少一氣體流通部設於該基座及該平台其中一者，以噴出氣體使該平台以非接觸狀態支撐於該基座；及一光學測量裝置，包括一光學尺及一讀頭，該光學尺及該讀頭其中一者設於該平台、另一者設於該基座，該光學尺及該讀頭相互對應。本發明關於一種校正方法，其包括前述之對位平台。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An alignment stage is provided, including: a base; a platform, movably disposed on the base; a driving device, driving the platform to move relative to the base; at least one air flow passage portion, the at least one air flow passage portion disposed on one of the base and the platform, the at least one air flow passage portion emitting air to support the platform over the base in a non-contact manner; and an optical measurement device, including an optical scale and a read head, one of the optical scale and the read head disposed on the platform, the other of the optical scale and the read head disposed on the base, the optical scale and the read head corresponding to each other. A calibration method is further provided, including the alignment stage mentioned above.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:對位平台</p>
        <p type="p">10:基座</p>
        <p type="p">20:平台</p>
        <p type="p">30:驅動裝置</p>
        <p type="p">31:第一磁性單元</p>
        <p type="p">32:第二磁性單元</p>
        <p type="p">80:軸組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="501" publication-number="202624808">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624808</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148106</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光電模組製造方法</chinese-title>
        <english-title>MANUFACTURING METHOD OF OPTOELECTRONIC MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250327B">G02B6/13</main-classification>
        <further-classification edition="200601120250327B">G02B6/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特崴光波導股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUANTUMZ INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝明哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, MING CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃士瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHIH YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>耿鴻鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KENG, HUNG CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡孟岑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAI, MENG CEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種光電模組製造方法，包括下列步驟：(1)備一第一電路基板；(2)設一第一覆層於該第一電路基板；(3)設一包含一光敏材料之核心層於該第一覆層，並以一光束照射該核心層以曝光形成一光通路；(4)備一第二覆層及一第二電路基板，設該第二電路基板於該核心層相對於該第一電路基板之一側，並使該第二覆層位於該核心層與該第二電路基板之間；(5)以至少一傳導結構電性連接該第一電路基板及該第二電路基板；及(6)固定複數光電元件於該第一電路基板及該第二電路基板至少其中一者上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a manufacturing method of an optoelectronic module, including following steps: (1) preparing a first circuit substrate; (2) providing a first cladding layer on the first circuit substrate; (3) providing a core layer including a photosensitive material on the first cladding layer, and exposing the a core layer by a light beam to form an optical path; (4) preparing a second circuit substrate and a second cladding layer, arranging the second circuit substrate at a side of the core layer opposite to the first circuit substrate, and arranging the second cladding layer between the core layer and the second circuit substrate; (5) electrically connecting the first circuit substrate with the second circuit substrate by at least one conductive structure; and (6) mounting a plurality of optoelectronics to at least one of the first circuit substrate and the second circuit substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光電模組</p>
        <p type="p">11:第一光通口</p>
        <p type="p">12:第二光通口</p>
        <p type="p">70:光電元件</p>
        <p type="p">71:正發光VCSEL</p>
        <p type="p">72:控制晶片</p>
        <p type="p">73:光接收器</p>
        <p type="p">74:跨組放大器</p>
        <p type="p">80:凹槽</p>
        <p type="p">81:斜面</p>
        <p type="p">S1:光靶定位基準</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="502" publication-number="202624806">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624806</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148107</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光波導結構</chinese-title>
        <english-title>WAVEGUIDE STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250307B">G02B6/124</main-classification>
        <further-classification edition="200601120250307B">G02B6/34</further-classification>
        <further-classification edition="201101120250307B">B82Y20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淇霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHY-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉泰源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, TAI-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張學智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HSUEH-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">光波導結構包括基板。光波導結構還包括在基板上的入射光柵區、轉折光柵區與出射光柵區。入射光柵區、轉折光柵區與出射光柵區中的每一者包括多個週期性排列的超穎光柵單元。每一個超穎光柵單元包括第一光柵與第二光柵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A waveguide structure includes a substrate. The waveguide structure further includes an input grating region, a fold grating region and an output grating region. Each of the input grating region, the fold grating region and the output grating region includes a plurality of meta-grating units. Each of the meta-grating units includes a first grating and a second grating.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:光波導結構</p>
        <p type="p">210:基板</p>
        <p type="p">221,231,241:光柵</p>
        <p type="p">IG:入射光柵區</p>
        <p type="p">FG:轉折光柵區</p>
        <p type="p">FG1,FG2:轉折光柵分區</p>
        <p type="p">FGS:出光側</p>
        <p type="p">OG:出射光柵區</p>
        <p type="p">OG1,OG2,OG3,OG4,OG5:出射光柵分區</p>
        <p type="p">L1,L2,L3,L4,L5:光線</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="503" publication-number="202623964">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623964</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148109</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>夾頭接桿</chinese-title>
        <english-title>ANGLED TOOL CONNECTING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241217B">B25B23/12</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薪螢企業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN YING ENTPR CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江文宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, WEN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種夾頭接桿，包括：一殼體，為硬質材料構件，包括一身部及一橫向連接於該身部之頭部；一軸桿，可轉動地插設於該身部，包括相對之一第一端部及一第二端部，該第一端部供與一第一工具組接；及一套接組件，包括一可轉動地插設於該頭部之驅動套件、一套設於該驅動套件之滑套、以及一卡掣件，該驅動套件與該第二端部同轉動地相連接，該驅動套件供一第二工具插接，該第二工具供與一待驅動工件組接，該驅動套件的周壁貫設有一卡孔，該滑套位於遠離該驅動套件之一側設有一磁件，該滑套可相對該驅動套件活動於一鎖定位置與一釋放位置之間，該卡掣件設於該驅動套件與該滑套之間，該卡掣件包括一位於該卡孔中之卡掣部；其中，當該滑套位於該鎖定位置時，該滑套徑向限位該卡掣部使得該卡掣部凸入該驅動套件內部且卡掣於該第二工具之一限掣部，組接於該第二工具之該待驅動工件與該磁件具有一第一距離，該第二工具之限掣部與該待驅動工件具有一第二距離，該第一距離不大於該第二距離的1/5；當該滑套位於該釋放位置時，該滑套未徑向限位該卡掣部使得該待驅動工件之限掣部可脫離該卡掣部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An angled tool connecting device includes: a housing made of a hard material, including a body portion and a head portion transversely connected to the body portion; a shaft rotatably inserted in the body portion and including a first end portion for connecting with a first tool assembly and a second end portion; a socket assembly including a drive sleeve rotatably inserted in the head portion, a sliding sleeve mounted on the drive sleeve, and a locking member; the drive sleeve being rotatably connected to and rotatable with the second end portion of the shaft and being configured to receive a second tool, the second tool being configured to receive a driven workpiece; a peripheral wall of the drive sleeve including an engaging hole; a magnetic member being disposed on a side of the sliding sleeve remote from the drive sleeve, the sliding sleeve being movable relative to the drive sleeve between a locking position and a release position; the locking member being disposed between the drive sleeve and the sliding sleeve and including a locking portion disposed in the engaging hole; when the sliding sleeve is in the locking position, the sliding sleeve radially constrains the locking portion so that the locking portion protrudes within the interior of the drive sleeve and engages a limiting portion of the second tool, the driven workpiece inserted in the second tool maintains a first distance from the magnetic member, and the limiting portion of the second tool has a second distance from the driven workpiece, where the first distance is less than or equal to one-fifth of the second distance; when the sliding sleeve is in the release position, the sliding sleeve does not radially constrain the locking portion so that the limiting portion of the driven workpiece can disengage from the locking portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:夾頭接桿</p>
        <p type="p">10:殼體</p>
        <p type="p">11:身部</p>
        <p type="p">12:頭部</p>
        <p type="p">20:軸桿</p>
        <p type="p">30:套接組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="504" publication-number="202625362">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625362</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148113</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無併網再生能源與市電電力感應馬達</chinese-title>
        <english-title>INDUCTION MOTOR VIA RENEWABLE ENERGY AND MAINS POWER WITHOUT GRID CONNECTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">H02P27/06</main-classification>
        <further-classification edition="200601120260302B">H02J9/06</further-classification>
        <further-classification edition="202601120260302B">H02J3/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>城市學校財團法人臺北城市科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIPEI CITY UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃柏原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, PO-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃柏原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, PO-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳以安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本項發明創作屬於一種可無併網供電作馬達跳電正常運轉之新穎再生能源與市電電力感應馬達，係在一感應馬達內部可設多個電力線圈，在該感應馬達外部設一市電、一再生能源交流電及一再生能源直流電，以共同組成一「無併網再生能源與市電電力感應馬達」。該感應馬達設有鐵心繞組轉子及轉動軸，於該多個電力線圈分別設有市電線圈、多個再生能源線圈，該再生能源直流電則設有逆變器。該再生能源市電電力感應馬達利用該市電、該再生能源交流電及該再生能源直流電供電予該多個電力線圈(無併網供電)，並藉該多個電力線圈與該鐵心繞組轉子間之電磁作用，帶動該鐵心繞組轉子轉動以利用該轉動軸驅動一負載工作。該再生能源市電電力感應馬達藉由該多個電力線圈與該市電、該再生能源交流電、該再生能源直流電構成一「無併網電源供電變換結構」，使該市電、該再生能源交流電及該再生能源直流電可正常供電予該多個電力線圈(無併網正常供電)，以作馬達正常運轉工作；或者，當該市電跳電斷電時，使該再生能源交流電及該再生能源直流電可升載供電予該多個電力線圈(無併網升載供電)，以作馬達跳電正常運轉工作，而不影響該再生能源市電電力感應馬達之負載工作。如此，運用本項發明創作中，由一感應馬達之多個電力線圈及一市電、一再生能源交流電、一再生能源直流電構成之「無併網再生能源與市電電力感應馬達」，令該多個電力線圈與該市電、該再生能源交流電、該再生能源直流電可作馬達跳電正常運轉，利用本創作新式之電源供電變換結構，將可達到感應馬達可無併網供電作馬達跳電正常運轉之用電特性與功效。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">11:再生能源市電電力感應馬達</p>
        <p type="p">111:鐵心繞組轉子</p>
        <p type="p">112:轉動軸</p>
        <p type="p">1131:市電三極線圈</p>
        <p type="p">1132:市電三極線圈</p>
        <p type="p">1141:第一再生能源三極線圈</p>
        <p type="p">1142:第一再生能源三極線圈</p>
        <p type="p">1151:第二再生能源三極線圈</p>
        <p type="p">1152:第二再生能源三極線圈</p>
        <p type="p">12:負載</p>
        <p type="p">13:再生能源交流電</p>
        <p type="p">14:再生能源直流電</p>
        <p type="p">15:逆變器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="505" publication-number="202624729">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624729</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148122</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>檢測系統及檢測模組</chinese-title>
        <english-title>INSPECTION SYSTEM AND INSPECTION MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">G01N21/88</main-classification>
        <further-classification edition="200601120241231B">B65G49/07</further-classification>
        <further-classification edition="200601120241231B">B25J15/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>啓碁科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON NEWEB CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張翔斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HSIANG PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁冠彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DING, GUAN JHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在此提供一種用於檢測料件的檢測模組，包括收料模組及側視覺模組。收料模組包括收料夾具及收料旋轉軸以持定及旋轉料件。側視覺模組包括側視覺相機。其中收料模組經配置以：(1)將持定於收料夾具的料件置於側視覺相機之前，讓側視覺相機取得料件的第一側邊影像；及(2)以收料旋轉軸使持定於收料夾具的料件旋轉一角度，讓側視覺相機取得料件的第二側邊影像；其中第一側邊影像與第二側邊影像反映料件的不同側視覺位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein is an inspection module for inspecting workpieces, the inspection module including a collection module, and a side vision module. The collection module includes a collection clamp and a collection rotation shaft to hold and rotate the workpiece. The side vision module includes a side vision camera. The collection module is configured to: (1) position the workpiece held by the collection clamp in front of the side vision camera, allowing the side vision camera to capture a first side image of the workpiece; and (2) rotate the workpiece held by the collection clamp by an angle using the collection rotation shaft, allowing the side vision camera to capture a second side image of the workpiece; wherein the first side image and the second side image reflect different side visual positions of the workpiece.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:檢測系統</p>
        <p type="p">101:安全區域</p>
        <p type="p">102:上料機</p>
        <p type="p">104:取料模組</p>
        <p type="p">106:上視覺載台</p>
        <p type="p">110:料槽</p>
        <p type="p">112:上視覺X軸</p>
        <p type="p">114:上視覺模組</p>
        <p type="p">116:下視覺模組</p>
        <p type="p">117:側視覺模組</p>
        <p type="p">118:非通過下料機</p>
        <p type="p">120:通過下料機</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="506" publication-number="202624763">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624763</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148123</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可透過電壓偵測來確認裸露銲墊的銲接狀況的電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE CONFIRM SOLDERING STATUS OF EXPOSED PAD BY VOLTAGE DETECTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250314B">G01R1/30</main-classification>
        <further-classification edition="200601120250314B">G01R31/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新唐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃俊豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHUN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈子嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, TZU-LAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種電子裝置，包括具有裸露銲墊的積體電路，裸露銲墊透過銲接而連接至電路基板的接地，且裸露銲墊作用為積體電路的參考接地。透過檢測積體電路的特定電壓節點(例如帶差參考電路的輸出)相對於參考接地(裸露銲墊)的第一電壓V1以及此特定電壓節點相對於基板接地的第二電壓V2，以判定裸露銲墊的銲接狀況。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is an electronic device, including an integrated circuit with an exposed pad. The exposed pad is connected to a ground of a circuit board through welding, and the exposed pad serves as a reference ground of the integrated circuit. By detecting a first voltage V1 of a specific voltage node of the integrated circuit (such as the output of an band-gap reference circuit) relative to the reference ground (exposed pad), and a second voltage V2 of the specific voltage node relative to the ground of the circuit board, to determine the soldering status of the exposed pad.</p>
      </isu-abst>
      <representative-img>
        <p type="p">30:電子裝置</p>
        <p type="p">31:積體電路</p>
        <p type="p">32:電路基板</p>
        <p type="p">33:模式控制開關</p>
        <p type="p">321:內部開關</p>
        <p type="p">322:參考電壓單元</p>
        <p type="p">EPAD:裸露銲墊</p>
        <p type="p">PA0~PA3:輸入/輸出腳位</p>
        <p type="p">VDD:工作電壓源</p>
        <p type="p">GND:基板接地</p>
        <p type="p">GND’:參考接地</p>
        <p type="p">MCU:微控制器單元</p>
        <p type="p">BGC:帶差參考電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="507" publication-number="202624048">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624048</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148124</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>泛用型的外接式控制器</chinese-title>
        <english-title>UNIVERSAL EXTERNAL CONTROLLER FOR ELECTRONIC PARKING BRAKE MOTOR OPERATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250328B">B60R16/02</main-classification>
        <further-classification edition="200601120250328B">G05B19/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉正雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHENG-HSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉正雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHENG-HSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳居亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種泛用型的外接式控制器，其係在車輛熄火狀態下，用於控制電子手剎車裝置的馬達運轉，從而遂行來令片更換作業；其包括一第一輸電配件、一第二輸電配件、一電連接埠、一控制單元、一第一感測器、一第二感測器、一微處理器及一顯示單元，其中該控制單元控制對該馬達傳送電力，該微處理器運行應用程式，依據對該馬達傳送電力的電壓值或電流值並配合該控制單元啟動後的計時，判斷該第二輸電配件與該馬達的電性連接的極性，據此解除駐車制動或啟動駐車制動，從而降低更換來令片作業的複雜度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a universal external controller for controlling the operation of a motor in an electronic parking brake device when the vehicle is in an ignition-off state, thereby facilitating brake pad replacement operations. The controller comprises a first power transmission accessory, a second power transmission accessory, an electrical connection port, a control unit, a first voltage sensor, a second voltage sensor, a microprocessor, and a display unit. The control unit controls the delivery of power to the motor. The microprocessor executes an application program to determine the polarity of the electrical connection between the second power transmission accessory and the motor based on the second voltage value of the power delivered to the motor and in conjunction with a timing mechanism activated by the control unit. Based on the determination, the parking brake is released or engaged, thereby reducing the complexity of brake pad replacement operations.</p>
      </isu-abst>
      <representative-img>
        <p type="p">12:第一輸電配件</p>
        <p type="p">14:第二輸電配件</p>
        <p type="p">20:電連接埠</p>
        <p type="p">30:控制單元</p>
        <p type="p">42:第一感測器</p>
        <p type="p">44:第二感測器</p>
        <p type="p">50:微處理器</p>
        <p type="p">60:顯示單元</p>
        <p type="p">92:馬達</p>
        <p type="p">94:外部蓄電池</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="508" publication-number="202624102">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624102</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148129</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>棧板交接機構及棧板交接系統</chinese-title>
        <english-title>PALLET TRANSFER MECHANISM AND PALLET TRANSFER SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251030B">B65G61/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永聯物流開發股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALLY LOGISTIC PROPERTY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張建泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIEN-TAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉佩佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, PEI-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林楷倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KAI-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭禹辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, YU-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王祺澔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHI-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭士軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, SHIH-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊海倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, HAI-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種棧板交接機構，其用以讓不同的運送裝置交接棧板，本申請包含承放裝置、障礙感測器及棧板感測器。承放裝置包含有用以放置棧板的複數支架；障礙感測器設置於其中一支架，障礙感測器沿斜向對角方向經過交接空間，並朝對角設置的另一支架發射一障礙感測光線，障礙感測光線用以確認交接空間是否有物體；棧板感測器設置於其中一支架，棧板感測器沿水平方向朝相鄰設置的另一支架發射一棧板感測光線，棧板感測光線用以確認棧板是否放置於承放件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pallet transfer mechanism designed to facilitate the transfer of pallets between different transport devices. The application includes a supporting device, an obstacle sensor, and a pallet sensor.The supporting device comprises multiple brackets for placing pallets. The obstacle sensor is installed on one of the brackets, emitting an obstacle detection beam diagonally across the transfer space toward another diagonally positioned bracket. This beam is used to detect the presence of objects in the transfer space. The pallet sensor is also installed on one of the brackets, emitting a pallet detection beam horizontally toward an adjacent bracket to confirm whether a pallet is placed on the supporting device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:棧板</p>
        <p type="p">10:承放裝置</p>
        <p type="p">11:支架</p>
        <p type="p">111:支撐件</p>
        <p type="p">112:承放件</p>
        <p type="p">13:導正件</p>
        <p type="p">14:抵擋件</p>
        <p type="p">20:障礙感測器</p>
        <p type="p">30:棧板感測器</p>
        <p type="p">P:交接位置</p>
        <p type="p">L1:障礙感測光線</p>
        <p type="p">L2:棧板感測光線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="509" publication-number="202624943">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624943</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148134</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>人工智慧之燈效生成方法及應用其之電子裝置</chinese-title>
        <english-title>ARTIFICIAL INTELLIGENCE METHOD FOR GENERATING LIGHTING EFFECTS OF AND ELECTRONIC DEVICE USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120250526B">G06F3/048</main-classification>
        <further-classification edition="200601120250526B">G06F3/01</further-classification>
        <further-classification edition="200601120250526B">G06T1/00</further-classification>
        <further-classification edition="202301120250526B">G06N3/063</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳良其</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LIANG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種人工智慧之燈效生成方法及應用其之電子裝置。人工智慧之燈效生成方法用以於一燈效裝置顯示對應於一螢幕畫面之一燈效圖案。人工智慧之燈效生成方法包括以下步驟。進行一初始程序，以獲得一人工智慧模型之一模型輸入張量與一模型輸出張量的數據格式的內容與維度。進行一執行程序，以依據模型輸入張量的數據格式的內容與維度，調整螢幕畫面之一畫面張量（frame tensor），並依據模型輸出張量的數據格式的內容與維度，對人工智慧模型之一推論結果進行調整。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An artificial intelligence method for generating lighting effects of and an electronic device using the same are provided. The artificial intelligence method for generating lighting effects is used to display a lighting effect pattern corresponding to a screen image on a lighting effect device. The artificial intelligence method for generating lighting effects includes the following steps. An initialization procedure is performed to obtain the content and dimension of the data format of a model inputting tensor and a model outputting tensor of an artificial intelligence model. An execution procedure is performed to adjust a frame tensor of the screen image according to the content and dimension of the data format of the model inputting tensor, and to adjust an inference result of the artificial intelligence model according to the content and dimension of the data format of the model outputting tensor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">FM:螢幕畫面</p>
        <p type="p">FT:畫面張量</p>
        <p type="p">IN:輸入資料</p>
        <p type="p">LM:燈效圖</p>
        <p type="p">MD:人工智慧模型</p>
        <p type="p">MT1:模型輸入張量</p>
        <p type="p">MT2:模型輸出張量</p>
        <p type="p">PD1:初始程序</p>
        <p type="p">PD2:執行程序</p>
        <p type="p">RS:推理結果</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="510" publication-number="202625167">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625167</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148140</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用以分類及減輕吶語症嚴重度級別的方法及系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR CLASSIFYING AND MITIGATING THE SEVERITY LEVEL OF DYSARTHRIA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120250303B">G10L25/66</main-classification>
        <further-classification edition="201801120250303B">G16H50/20</further-classification>
        <further-classification edition="200601120250303B">A61B5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中原大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG YUAN CHRISTIAN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳賦郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, FU-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何美瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盛珮雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在此揭示一種用於分類及減輕帕金森氏症（PD）患者吶語症嚴重度級別的系統。所述系統包括一個用於生成多個 PD 患者之聲音紀錄的語言訓練模組，以及一個依據從這些聲音紀錄中提取的語音特徵對吶語症的嚴重程度進行分級的人工智慧（AI）模組。此外，還揭示了一種用於減緩 PD 患者吶語症嚴重程度的方法。所述方法包括使用本系統來確定 PD 患者吶語症的嚴重程度；向 PD 患者建議一項或多項語言訓練練習；以及指示 PD 患者練習所建議的語言訓練練習，以減緩吶語症的嚴重程度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein is a system for classifying the severity level of dysarthria in a subject having Parkinson’s Disease (PD). The system includes a language training module for producing a plurality of acoustic recordings of the PD subject, an artificial intelligence (AI)-based module for classifying the severity level of dysarthria based on speech features extracted from the plurality of acoustic recordings. Also provided herein is a method for mitigating the severity of dysarthria of a PD subject. The method includes determining the severity level of dysarthria of the PD subject by using the present system; suggesting one or more language training exercises to the PD subject; and instructing the PD subject to practice the suggested one or more language training exercises to mitigate the severity level of dysarthria.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:使用者</p>
        <p type="p">100:系統</p>
        <p type="p">110:預備語言訓練模組</p>
        <p type="p">120:語言訓練模組</p>
        <p type="p">130:AI模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="511" publication-number="202625351">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625351</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148142</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於調變閘-源極電壓的電壓控制裝置與交換式電容系統</chinese-title>
        <english-title>VOLTAGE CONTROL DEVICE AND SWITCHED CAPACITOR SYSTEM FOR MODULATING GATE-SOURCE VOLTAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">H02M3/07</main-classification>
        <further-classification edition="200601120241231B">H02M3/158</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李清然</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHING-RAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JIA-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張簡樂仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG-CHIEN, LE-REN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龔哲民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNG, CHE-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林和正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HO-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">電壓控制裝置與交換式電容系統。電壓控制裝置應用於一交換式電容電路，交換式電容電路包括多個開關元件與多個電容。開關元件至少包括第一開關元件。第一開關元件係接收一閘-源極電壓以控制其導通程度 。電壓控制裝置至少對於第一開關元件的閘-源極電壓執行階段性時變之調變或連續時變之調變。於第一開關元件為導通的時段內，因應於一組開關控制訊號將第一開關元件的閘-源極電壓在多個時間點分別調變為多個目標電壓。電壓控制裝置設置於交換式電容系統之中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A voltage control device and a switched capacitor system. The voltage control device is applied to a switched capacitor circuit, the switched capacitor circuit includes multiple switching elements and multiple capacitors. The switching elements include at least a first switching element. The first switching element receives a gate-source voltage to control its conduction degree. The voltage control device performs a stepwise time-varying modulation or a continuous time-varying modulation on the gate-source voltage of the first switching element. During the period for the first switching element being turned on, the gate-source voltage of the first switching element is modulated as multiple target voltages at multiple time points in response to a set of switching control signals. The voltage control device is disposed in the switched capacitor system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:交換式電容電路</p>
        <p type="p">100:電壓控制裝置</p>
        <p type="p">Vi:輸入電壓</p>
        <p type="p">Vo:輸入電壓</p>
        <p type="p">V_SRC:電源</p>
        <p type="p">RL:負載</p>
        <p type="p">S1~S4:開關元件</p>
        <p type="p">C1,C2:電容</p>
        <p type="p">d:汲極</p>
        <p type="p">g:閘極</p>
        <p type="p">s:源極</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="512" publication-number="202624051">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624051</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148146</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可調式噴頭</chinese-title>
        <english-title>ADJUSTABLE NOZZLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250217B">B60S1/48</main-classification>
        <further-classification edition="200601120250217B">B60S1/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翔宣富企業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIANG SYUAN FU ENTERPRISE CO.,LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪振軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, CHEN HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種可調式噴頭，其包括：一第一構件及一第二構件。該第一構件包含有一第一主體、一第一通道與一斜口，該第一通道沿一第一方向延伸貫穿該第一主體，該第一方向係斜向於通過該斜口之開口方向；該第二構件包含有一第二主體、一第二通道與一卡抵部，該第二通道貫穿該第二主體，該卡抵部設於該第二主體，當該第二主體穿設該第一通道而凸伸出該斜口時，該第二主體可相對該第一主體轉動，該卡抵部位於該第一通道且於該第一方向上與圍構該斜口之一口緣相互擋止，該第二通道連通該第一通道。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to an adjustable nozzle, which comprises a first component and a second component. The first component includes a first body, a first channel, and an inclined opening. The first channel extends through the first body along a first direction, which is inclined relative to the opening direction of the inclined opening. The second component includes a second body, a second channel, and a latching part. The second channel extends through the second body, and the latching part is provided on the second body. When the second body is inserted into the first channel and protrudes out of the inclined opening, the second body can rotate relative to the first body. The latching part is positioned within the first channel and engages with the edge of the inclined opening along the first direction, thereby preventing movement. The second channel is in communication with the first channel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:第一主體</p>
        <p type="p">18:旋轉軸</p>
        <p type="p">21:第二主體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="513" publication-number="202624665">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624665</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148150</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>防進水構造及空調設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250307B">F24F13/22</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣松下電器股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUSHITA ELECTRIC (TAIWAN) CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝明志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江宏修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江旺城</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種防進水構造，適用於阻隔一冷凝水進入一空調本體。該空調本體包含一外殼、一風胴基座、一導風環、及一集水盤。該集水盤形成一排水孔。該防進水構造包含一導流結構，及一固定結構。 該導流結構具有一設置於該導風環的管體、間隔設置於該管體的一第一外環及一第二外環，及一設置於該管體且界於該第一外環及該第二外環間的一第一內環。該管體、該第一外環、該第一內環共同界定一溝槽，該溝槽供該冷凝水流動。 該固定結構設置於該第一內環，用於固定該導流結構在該風胴基座。達到避免冷凝水進入該空調本體的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:防進水構造</p>
        <p type="p">21:導流結構</p>
        <p type="p">211:管體</p>
        <p type="p">212:第一外環</p>
        <p type="p">213:第二外環</p>
        <p type="p">214:第一內環</p>
        <p type="p">215:溝槽</p>
        <p type="p">216:擋止件</p>
        <p type="p">217:第二內環</p>
        <p type="p">218:嵌槽</p>
        <p type="p">219:凹槽</p>
        <p type="p">22:固定結構</p>
        <p type="p">221:承載件</p>
        <p type="p">222:固定件</p>
        <p type="p">9:冷凝水</p>
        <p type="p">A:軸向方向</p>
        <p type="p">R:徑向方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="514" publication-number="202624981">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624981</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148151</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於磁碟近似最近點搜尋的運算用儲存裝置、運算用儲存系統及用於記憶體裝置的操作方法</chinese-title>
        <english-title>COMPUTATIONAL STORAGE DEVICE, COMPUTATIONAL STORAGE SYSTEM FOR DISKANN SEARCH AND OPERATION METHOD FOR MEMORY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250401B">G06F16/22</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>旺宏電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACRONIX INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇威丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, WEI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊志祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIH-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龍翔瀾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUNG, HSIANG-LAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的一方面提供一種運算用儲存裝置，用於執行磁碟近似最近點(DiskANN)搜尋。運算用儲存裝置包括NAND記憶體陣列，用於儲存對應磁碟近似最近點中多個節點的多個節點資料塊(node chunk)。運算用儲存裝置同樣包括非揮發性記憶體陣列，用於儲存對應多個節點資料塊中的多個節點的多個乘積量化(product quantization, PQ)向量運算用儲存裝置同樣包括處理單元，耦接於NAND記憶體陣列及非揮發性記憶體。處理單元用於根據所接收到的搜尋指令，對NAND記憶體陣列中的多個節點資料塊及非揮發性記憶體陣列中的多個乘積量化向量執行磁碟近似最近點搜尋，並輸出搜尋結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A computational storage device for executing DiskANN search is provided by an aspect of the present disclosure. The computational storage device comprises a NAND memory array configured to store node chunks corresponding to nodes in the DiskANN. The computational storage device also comprises a non-volatile memory array configured to store multiple product quantization (PQ) vectors corresponding to the nodes of the node chunks. The computational storage device also comprises a processing unit coupled to the NAND memory array and the non-volatile memory array. The processing unit configured to execute DiskANN search (DiskANNs) among the node chunks in the NAND memory array and the multiple PQ vectors in the non-volatile memory array according to a received searching instruction, and output a search result.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:運算系統</p>
        <p type="p">110:CPU</p>
        <p type="p">112,122:暫存器、快取及內部記憶體</p>
        <p type="p">120:GPU</p>
        <p type="p">130:系統DRAM</p>
        <p type="p">140:運算用儲存裝置</p>
        <p type="p">150:傳統儲存裝置</p>
        <p type="p">160:I/O</p>
        <p type="p">170:匯流排/介面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="515" publication-number="202624090">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624090</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148157</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>速裝環保餐盒</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250326B">B65D5/32</main-classification>
        <further-classification edition="200601120250326B">B65D5/64</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特騰綠的包材股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PONIPACK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭彭益</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊延壽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明在於提供一種速裝環保餐盒，其包含有一本體，以及一能翻折蓋合於本體上的蓋體，其特徵在於：本體具有一底面，由底面相應側邊緣處分別依序相應向上延伸設置的前、後、左、右側面，設於前、後、左、右側面相互之間的接合部，以及一由底面與前、後、左、右側面相配合界定出的容置空間；蓋體的一側與後側面相應側邊樞接，前側邊緣設有一前翼片，由相應側邊緣處分別向外依序相應延伸出一左、右翼片；而前側面中央凸設有一卡條，卡條頂端兩側設有能往本體外方向彎折的定位片；且左、右側面自由側邊處，還分別相應設有一弧凸部；另蓋體對應於卡條處，還開設有一定位槽，能供卡條穿過後定位，讓蓋體的左、右側邊緣服貼於相應的左、右側面、之弧凸部上。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:本體</p>
        <p type="p">12:前側面</p>
        <p type="p">13:後側面</p>
        <p type="p">14:左側面</p>
        <p type="p">15:右側面</p>
        <p type="p">17:容置空間</p>
        <p type="p">18:卡條</p>
        <p type="p">181:定位片</p>
        <p type="p">19:弧凸部</p>
        <p type="p">2:蓋體</p>
        <p type="p">21:前翼片</p>
        <p type="p">22:左翼片</p>
        <p type="p">23:右翼片</p>
        <p type="p">24:定位槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="516" publication-number="202624658">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624658</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148158</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>固態燃料之燃燒器</chinese-title>
        <english-title>SOLID FUEL BURNER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250318B">F23C5/02</main-classification>
        <further-classification edition="200601120250318B">F23B30/00</further-classification>
        <further-classification edition="200601120250318B">C10J3/48</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊智博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIH-PO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅偉仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, WEI-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王思云</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SSU YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連培榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIEN, PEI-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林烈全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, LEI-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李約亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YUEH-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YAN-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種固態燃料之燃燒器，包含第一管件、第二管件、以及擴散裝置。第一管件具有第一空氣流道。第一空氣流道具有第一入口與第一出口。第二管件設於第一管件中。第二管件具有固態燃料流道。固態燃料流道具有第二入口與第二出口鄰近第一出口。擴散裝置包含第三管件以及擴散件。第三管件設於第二管件中。第三管件具有燃氣流道。燃氣流道具有一第三入口與至少一第三出口，至少一第三出口位於第二出口之下方。擴散件設於第三管件中。擴散件包含擴散鈍體遮擋在第二出口之下方，以將自第二出口流出之固態燃料向外擴散。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A solid fuel burner includes a first pipe, a second pipe, and a diffusion device. The first pipe has a first air flow channel. The first air flow channel has a first inlet and a first outlet. The second pipe is disposed in the first pipe. The second tube has a solid fuel flow channel. The solid fuel flow channel has a second inlet and a second outlet that is adjacent to the first outlet. The diffusion device includes a third pipe and a diffusion member. The third pipe is disposed in the second pipe. The third pipe has a fuel gas flow channel. The fuel gas flow channel has a third inlet and at least one third outlet, and the at least one third outlet is located below the second outlet. The diffusion member is located in the third pipe. The diffusion member includes a diffusion blunt body below the second outlet to block and diffuse a solid fuel flowing out from the second outlet outward.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:固態燃料之燃燒器</p>
        <p type="p">200:第一管件</p>
        <p type="p">202:內側面</p>
        <p type="p">210:第一空氣流道</p>
        <p type="p">212:第一入口</p>
        <p type="p">214:第一出口</p>
        <p type="p">300:第二管件</p>
        <p type="p">310:固態燃料流道</p>
        <p type="p">312:第二入口</p>
        <p type="p">314:第二出口</p>
        <p type="p">400:擴散裝置</p>
        <p type="p">410:第三管件</p>
        <p type="p">412:燃氣流道</p>
        <p type="p">414:第三入口</p>
        <p type="p">416:第三出口</p>
        <p type="p">420:擴散件</p>
        <p type="p">422:擴散鈍體</p>
        <p type="p">424:擴散面</p>
        <p type="p">426:底面</p>
        <p type="p">430:第四管件</p>
        <p type="p">432:第二空氣流道</p>
        <p type="p">434:第四入口</p>
        <p type="p">436:第四出口</p>
        <p type="p">500:渦流產生機構</p>
        <p type="p">A:空氣</p>
        <p type="p">FG:燃氣</p>
        <p type="p">SF:固態燃料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="517" publication-number="202625080">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625080</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148162</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱成像的影像優化方法以及裝置</chinese-title>
        <english-title>IMAGE OPTIMIZATION METHOD AND DEVICE FOR THERMAL IMAGING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120241231B">G06T5/60</main-classification>
        <further-classification edition="202301120241231B">G06N3/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菱光科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CREATIVE SENSOR INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳佩萱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PEI-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋育寰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNG, YU-HUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種熱成像的影像優化方法，包括：藉由資料擷取電路，從檢測場域中的熱成像裝置擷取原始影像；藉由處理器，利用儲存器儲存的多個樣本影像以及與多個樣本影像分別對應的多個樣本對應表更新神經網路模型，其中多個樣本對應表指示熱成像裝置在多個訓練場域產生的多個樣本影像中的像素值與經優化的多個樣本影像中的像素值之間的對應關係；藉由處理器，將原始影像輸入神經網路模型以產生優化對應表；以及藉由處理器，利用優化對應表將原始影像轉換為優化影像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image optimization method for thermal imaging is disclosed, which includes: by a data capturing circuit, capturing a raw image from a thermal imaging device in a detection field; by a processor, updating a neural network model by utilizing multiple sample images and multiple sample mapping tables respectively corresponding to the multiple sample images stored in a memory, where the multiple sample mapping tables indicate a relationship between pixel values in the multiple sample images generated by the thermal imaging device in multiple training fields and pixel values in the multiple sample images being optimized; by the processor, inputting the raw image into the neural network model to generate an optimized mapping table; and by the processor, converting the raw image into an optimized image by utilizing the optimized mapping table.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:熱成像的影像優化裝置</p>
        <p type="p">110:資料擷取電路</p>
        <p type="p">120:儲存器</p>
        <p type="p">130:處理器</p>
        <p type="p">131:神經網路模型</p>
        <p type="p">200:熱成像裝置</p>
        <p type="p">si1~siN:樣本影像</p>
        <p type="p">st1~stN:樣本對應表</p>
        <p type="p">img1:原始影像</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="518" publication-number="202624139">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624139</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148164</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>浮渣剝離裝置及導水渠以及沉澱池</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250910B">C02F1/40</main-classification>
        <further-classification edition="200601120250910B">B01D21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商宇都宮工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UTSUNOMIYA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宇都宮秀雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UTSUNOMIYA, HIDEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一對管，係於導水渠本體之兩側壁之內側沿著原水之流動方向延伸，於長度方向隔著間隔具有複數個開口部，並設為位於浮渣之下側；以及複數個壓力流體供給部，係對於前述管供給來自壓力流體供給源之壓力流體；前述管，係沿著原水之流動方向，被劃分為預定長度之複數區域，對於每個該所劃分之區域分別連接有壓力流體供給部，並使前述壓力流體自前述管之前述開口部噴出，藉此自前述導水渠本體之全內壁順暢地將浮渣剝離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">5:側壁</p>
        <p type="p">9:管</p>
        <p type="p">11:水噴射噴嘴(水上噴嘴)</p>
        <p type="p">12:壓力水供給管</p>
        <p type="p">13:水噴射噴嘴(水中噴嘴)</p>
        <p type="p">14:壓力水供給管</p>
        <p type="p">21:吐出口構件</p>
        <p type="p">23:壓力流體供給部</p>
        <p type="p">25:分歧管</p>
        <p type="p">27:長管部</p>
        <p type="p">28:短管部</p>
        <p type="p">29:中央連接管</p>
        <p type="p">30:連接管</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="519" publication-number="202624140">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624140</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148165</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>下水處理廠之浮渣去除系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250531B">C02F1/40</main-classification>
        <further-classification edition="202301120250531B">C02F1/24</further-classification>
        <further-classification edition="200601120250531B">B01D21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商宇都宮工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UTSUNOMIYA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宇都宮秀雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UTSUNOMIYA, HIDEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">能夠改善處理水質以減輕對於自然環境之負擔，並且有助於節能化。&lt;br/&gt;導水渠之第1浮渣去除裝置，係具備浮渣剝離裝置以及水噴射噴嘴；該浮渣剝離裝置，係具備：一對管，係於原水之流動方向延伸，且具有複數個開口部，並設為位於浮渣之下側；以及壓力流體供給部，係對於該等管供給壓力流體；該水噴射噴嘴，係使浮渣往導水渠本體之終端之浮渣槽側移動；最初沉澱池之第2浮渣去除裝置，係具備管撇取器、浮渣引導機構，以及使浮渣往管撇取器側移動之水噴射噴嘴；最終沉澱池之第3浮渣去除裝置，係具備管撇取器，以及使浮渣往管撇取器側移動之水噴射噴嘴；最終沉澱池用之前述水噴射噴嘴，係使水面之流動加速而使浮渣移動，然係設定為水噴射量比導水渠用之水噴射噴嘴更少，而不致令水噴射之力道破壞浮渣導致水中混濁。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:導水渠本體</p>
        <p type="p">3:浮渣槽</p>
        <p type="p">6:沉澱池(最初沉澱池)</p>
        <p type="p">7:流入口</p>
        <p type="p">15:排泥管</p>
        <p type="p">61:(最初沉澱池用)管撇取器</p>
        <p type="p">100:沉澱池(最終沉澱池)</p>
        <p type="p">101:排泥管</p>
        <p type="p">106:(最終沉澱池用)管撇取器</p>
        <p type="p">A:最初沉澱池用導水渠</p>
        <p type="p">B:最初沉澱池群</p>
        <p type="p">C:反應槽</p>
        <p type="p">D:最終沉澱池用導水渠</p>
        <p type="p">E:最終沉澱池群</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="520" publication-number="202624141">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624141</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148166</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>浮渣去除裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250512B">C02F1/40</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商宇都宮工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UTSUNOMIYA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宇都宮秀雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UTSUNOMIYA, HIDEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種浮渣去除裝置，其目的在於改善處理水質以減輕對於自然環境之負擔，並且有助於節能化，更有甚者，係亦能夠輕易運用於既有之沉澱池。&lt;br/&gt;一種浮渣去除裝置，係使浮渣流入至浮渣接收部而去除浮渣；該浮渣接收部，係於設在下水處理廠之沉澱池之下游側，以堰塞水面之流動之方式設置；其特徵為：於浮渣接收部，具備：一對導板，係配置為使相互之間隔朝向原水流動來之方向逐漸擴大；以及流體噴出管，係於長度方向隔著間隔具有複數個開口部，自開口部噴出從一對導板之下端部於一對導板之原水流動來之側之表面上升之流體。一對導板，係設為上部位於水面上，且下部沒入水中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">40:水噴射噴嘴(水上噴嘴)</p>
        <p type="p">41:水噴射噴嘴(水上噴嘴)</p>
        <p type="p">42:水噴射噴嘴(水中噴嘴)</p>
        <p type="p">43:狹縫</p>
        <p type="p">44:整流片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="521" publication-number="202625363">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625363</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148173</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可移動式太陽能獨立集熱儲能系統</chinese-title>
        <english-title>MOBILE SOLAR INDEPENDENT ENERGY COLLECTION AND STORAGE SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120250303B">H02S40/44</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中原大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG YUAN CHRISTIAN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃建勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, JIAN-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林家甫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIA-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓋勁達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAI, CHIN-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭德翊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, TE-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁宸煒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, CHEN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可移動式太陽能獨立集熱儲能系統包含一可移動式基座、一太陽能光電板、一太陽能集熱板、一供水桶、一保溫儲熱桶、一電池模組及一供水幫浦。太陽能光電板與太陽能集熱板分別組接於可移動式基座之兩端，並彼此背向設置而與可移動式基座圍構出一容置空間。供水桶、保溫儲熱桶、電池模組及供水幫浦分別設置於容置空間，且太陽能集熱板分別連通於供水桶與保溫儲熱桶。電池模組是電性連結於太陽能光電板，用以儲存電能。供水幫浦是連通於供水桶與太陽能集熱板，並電性連結於電池模組，用以將常溫水輸送至太陽能集熱板進行加熱，藉以使加熱後產生的蓄熱水儲存至保溫儲熱桶。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A mobile solar independent energy collection and storage system includes a system base, a solar panel, a solar collector, a water supply tank, a thermal insulation heat storage tank, a battery module, and a water supply pump. The solar panel and the solar collector are respectively mounted at both ends of the system base, and facing away from each other to form an accommodating space. The water supply tank, thermal insulation heat storage tank, battery module, and water supply pump are installed within the accommodating space. The solar panel is connected to both the water supply tank and the thermal insulation heat storage tank. The battery module is electrically connected to the solar panel to store electrical energy. The water supply pump is connected to the water supply tank and the solar collector, and electrically connected to the battery module. Thus, the water supply pump pumps room temperature water to the solar panel for heating, allowing the heated water to be stored in the thermal insulation heat storage tank.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:可移動式太陽能獨立集熱儲能系統</p>
        <p type="p">1:可移動式基座</p>
        <p type="p">11:第一端部</p>
        <p type="p">12:第二端部</p>
        <p type="p">2:太陽能光電板</p>
        <p type="p">21:光電板底座</p>
        <p type="p">22:光電板本體</p>
        <p type="p">3:太陽能集熱板</p>
        <p type="p">31:集熱板底座</p>
        <p type="p">311:進水口</p>
        <p type="p">4:供水桶</p>
        <p type="p">5:保溫儲熱桶</p>
        <p type="p">51:電熱棒</p>
        <p type="p">6:電池模組</p>
        <p type="p">8:提把</p>
        <p type="p">p1,p2,p3:輸水管路</p>
        <p type="p">e1,e2,e3:電纜線路</p>
        <p type="p">S1:容置空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="522" publication-number="202624146">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624146</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148174</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>移除廢液中氨氮之改良設備及其操作方法</chinese-title>
        <english-title>IMPROVED EQUIPMENT FOR REMOVING AMMONIA NITROGEN FROM WASTE LIQUID AND OPERATING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120241220B">C02F1/72</main-classification>
        <further-classification edition="202301120241220B">C02F1/66</further-classification>
        <further-classification edition="200601320241220B">C02F101/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泓泰環保科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG TAI ENVIRONMENTAL TECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許凱捷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, KAI-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許庭維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉箐茹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>桃園市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種移除廢液中氨氮之改良設備包括化學反應槽以及曝氣裝置。化學反應槽具有槽體以及頂蓋。槽體具有反應空間。蝕刻廢液經由第一進料口進入至槽體的反應空間中。曝氣裝置具有通氣管件以及供氣裝置。通氣管件設置於槽體的底部。曝氣裝置使用第一風量對反應空間中的蝕刻廢液進行曝氣，使得蝕刻廢液中的氨氮形成揮發的游離氨氣。接著，氧化劑經由第二進料口進入至反應空間中並與蝕刻廢液進行反應，以降低蝕刻廢液中的氨氮濃度。接著，沉澱劑經由第三進料口進入至反應空間中並與蝕刻廢液進行反應，以降低蝕刻廢液中的氨氮濃度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:步驟</p>
        <p type="p">S2:步驟</p>
        <p type="p">S3:步驟</p>
        <p type="p">S4:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="523" publication-number="202623864">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623864</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148175</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>混合實境互動系統及其操作方法</chinese-title>
        <english-title>MIXED REALITY INTERACTIVE SYSTEM AND OPERATING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120241218B">A63F13/52</main-classification>
        <further-classification edition="201401120241218B">A63F13/65</further-classification>
        <further-classification edition="201401120241218B">A63F13/92</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>致理學校財團法人致理科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIHLEE UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭建文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳聖璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游柔榛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡彤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉箐茹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>桃園市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種混合實境互動系統包括攝影機、物件場景互動伺服器以及頭戴式裝置。攝影機觀測真實環境以獲取即時影像。物件場景互動伺服器接收攝影機傳輸的即時影像。物件場景互動伺服器根據真實環境的即時影像建立真實場場景並在真實場場景中放置虛擬物件以形成混合實境場景。頭戴式裝置具有顯示螢幕並被遊玩者配戴，使得遊玩者藉由顯示螢幕觀測到物件場景互動伺服器傳送的混合實境場景。頭戴式裝置更藉由攝影機觀測遊玩者的身體部位以獲取對應身體部位的虛擬部位觸碰到虛擬物件或獲取身體部位觸碰到真實環境中的真實物件所產生的互動資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S11、S12、S13、S14:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="524" publication-number="202625459">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625459</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148177</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種自動化聽覺輔助系統及其方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241219B">H04R25/00</main-classification>
        <further-classification edition="200601120241219B">H04R1/04</further-classification>
        <further-classification edition="201301120241219B">G10L25/51</further-classification>
        <further-classification edition="201301120241219B">G10L21/003</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許　伯州</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CLARK BOB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許　又仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, JOSHUA TYLER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許　伯安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, PAUL A</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許　伯州</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CLARK BOB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許　又仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, JOSHUA TYLER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許　伯安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, PAUL A</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自動化聽覺輔助系統及其方法，先由一耳戴式電子裝置接收一聲音輸入，比對該聲音輸入的多個候選聲音特徵是否符合至少一關聯於一參考聲音特徵的條件並產生一比對結果，該參考聲音特徵關聯於至少一特定人的人聲，若至少一該候選聲音特徵滿足該條件，該耳戴式電子裝置根據該比對結果對該聲音輸入進行處理以令從該耳戴式電子裝置輸出的一聲音輸出包括一第一及第二聲音組成，該第一聲音組成對應符合該條件的該候選聲音特徵，該第二聲音組成對應不屬於符合該條件的該候選聲音特徵，經處理後該第一聲音組成具有一相較於該第二聲音組成的增益。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:聽覺輔助裝置</p>
        <p type="p">101:殼體</p>
        <p type="p">102:麥克風單元</p>
        <p type="p">103:處理器電路</p>
        <p type="p">104:揚聲器</p>
        <p type="p">105:儲存單元</p>
        <p type="p">106:使用者可致動控制</p>
        <p type="p">107:通訊單元</p>
        <p type="p">108:電力單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="525" publication-number="202625424">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625424</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148179</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智慧語音訂位應答方法、系統及電腦可讀取儲存媒體</chinese-title>
        <english-title>METHOD AND SYSTEM OF SMART VOICE BOOKING RESPONSE AND COMPUTER-READABLE STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250224B">H04M1/65</main-classification>
        <further-classification edition="200601120250224B">H04M3/487</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃至德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIH-DE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊富丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, FU-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林長榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種智慧語音訂位應答方法、相應之系統及電腦可讀取儲存媒體，該智慧語音訂位應答方法係由電子裝置執行，且包括：與顧客進行語音通話，其中，該語音通話係由該顧客或該電子裝置發起；令預設之應答流程的第一個表單成為目前表單；通過該語音通話向該顧客發出該目前表單之問題中尚未取得答案的一目前問題之語音提問，以通過該語音通話取得該顧客之回應；自該回應中提取該目前表單之各該問題之答案；以及判斷是否已取得該目前表單之各該問題之答案，若是，則結束該目前表單，否則返回向該顧客發出該語音提問之該步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and a corresponding system of smart voice booking response and a corresponding computer-readable storage medium are provided. The method is executed by an electronic device and includes: conducting a voice call with a customer, wherein the voice call is set up by the customer or the electronic device; setting the first list of a preset response flow to be a current list; sending a voice prompt of a current question that has not obtained its answer among the questions of the current list to the customer through the voice call in order to obtain a response of the customer through the voice call; extracting the answer of each of the questions of the current list from the response; and determining whether the answer of each of the questions of the current list is already obtained. If the answers are already obtained, the current list is ended. Otherwise, the response flow returns to the step of sending the voice prompt to the customer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:智慧語音訂位應答系統</p>
        <p type="p">2:交換機</p>
        <p type="p">3:電話機</p>
        <p type="p">4:資料庫</p>
        <p type="p">11:字轉音模組</p>
        <p type="p">12:音轉字模組</p>
        <p type="p">13:交換機控制模組</p>
        <p type="p">14:自然語言模組</p>
        <p type="p">15:流程控制模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="526" publication-number="202625470">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625470</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148180</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於信標之報到系統、方法及其電腦程式產品</chinese-title>
        <english-title>CHECK-IN SYSTEM AND METHOD BASED ON BEACON, AND COMPUTER PROGRAM PRODUCT THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120250303B">H04W12/06</main-classification>
        <further-classification edition="201801120250303B">H04W4/80</further-classification>
        <further-classification edition="202101120250303B">H04W12/60</further-classification>
        <further-classification edition="200601120250303B">H04L9/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐智文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OU, CHIH-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸培華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, PEI-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋育展</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNG, YU-CHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>繆嘉新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIOU, CHAR-SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林長榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種基於信標之報到系統、方法及其電腦程式產品，信標裝置發出包含身分識別碼和時間型密碼之廣播封包，行動裝置接收廣播封包以讀取身分識別碼和時間型密碼並且讀取行動裝置內的感測器值，進而根據身分識別碼、時間型密碼、和感測器值生成報到資料，以輸出至驗證服務端，供驗證服務端自報到資料讀取出身分識別碼、時間型密碼、和感測器值，進而根據報到集合資料驗證行動裝置的報到資料，其中，若時間型密碼和感測器值驗證成功，則行動裝置報到成功。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A check-in system and method based on beacon, and computer program product thereof are provided. A beacon device sends a broadcast packet containing an identifier and a time-based password. A mobile device receives the broadcast packet to read the identifier and the time-based password and reads a sensor value of the mobile device. Based on the identifier, the time-based password and the sensor value, the mobile device generates a check-in data for output to an authentication server. Subsequently, the authentication server reads out the identifier, the time-based password and the sensor value from the check-in data, and then verifies the check-in data of the mobile device based on a check-in set data. If the time-based password and the sensor value in the check-in data of the mobile device are successfully verified by the authentication server, the mobile device checks in successfully.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:信標裝置</p>
        <p type="p">11:安全元件</p>
        <p type="p">12:時間元件</p>
        <p type="p">13:處理器元件</p>
        <p type="p">14:發射元件</p>
        <p type="p">20:行動裝置</p>
        <p type="p">21:接收模組</p>
        <p type="p">22:感測器</p>
        <p type="p">23:生成模組</p>
        <p type="p">30:驗證服務端</p>
        <p type="p">31:安全模組</p>
        <p type="p">32:時間模組</p>
        <p type="p">33:報到紀錄資料庫</p>
        <p type="p">34:報到紀錄時間驗證模組</p>
        <p type="p">35:感測器異常偵測模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="527" publication-number="202625119">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625119</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148183</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>星期運算教具及其編寫方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250310B">G09B19/02</main-classification>
        <further-classification edition="200601120250310B">G09B19/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯永欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯永欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇士傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種星期運算教具及其編寫方法，本發明主要係藉由一圖卡具有12個為一組的日期代碼，再藉由7個星期代號列入該些日期代碼，再以該月份第一日的星期為基準，並以七日為倍數搭配餘日數的加總運算，來進行推算任意日期的星期，以進行「你說日期我猜星期」的遊戲，本發明可以用查看圖卡的日期代碼搭配顏色所象徵的星期代號方式，藉由心算快速推算任意日期的星期，能達成屢猜必中，令學生在當下感到不可思議，繼而引發學生的好奇心，老師則可傳授學生該遊戲原理皆是圖卡可供查表並作心算快速推算任意日期的星期，以使該星期推算能達到育教於樂的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:圖卡</p>
        <p type="p">A:日期代碼</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="528" publication-number="202624678">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624678</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148186</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有立體散熱結構之熱導板</chinese-title>
        <english-title>VAPOR CHAMBER HAVING THREE-DIMENSIONAL HEAT DISSIPATION STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250307B">F28F3/02</main-classification>
        <further-classification edition="200601120250307B">F28F3/12</further-classification>
        <further-classification edition="200601120250307B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳桂芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUEI-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　錫園</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHYI-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳桂芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUEI-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　錫園</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHYI-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有立體散熱結構之熱導板，包括本體、流道結構及至少一散熱結構。本體包括腔室、至少一延伸部及相對設置的第一表面及第二表面。延伸部鄰接於腔室。流道結構設置在該腔室內，且流道結構充填一流體，用以吸收來自發熱元件產生的熱。散熱結構設置在該延伸部上，並包括多個突起於第一表面的散熱條，用以傳導流道結構所吸收來自發熱元件產生的熱，且每一散熱條與第一表面之間具有多個鏤空部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A vapor chamber having three-dimensional heat dissipation structure includes a body, a flow channel structure, and at least a heat dissipation structure. The body includes a chamber, at least an extension portion, and oppositely arranged first and second surfaces. The extension portion is adjacent to the cavity. The flow channel structure is disposed in the chamber, and the flow channel structure is filled with a fluid to absorb heat generated from a heating element. The heat dissipation structure is provided on the extension portion and includes a plurality of heat dissipation strips. The heat dissipation strips protrude from the first surface and are configured to conduct the heat generated by the heating element and absorbed by the flow channel structure, and a hollow portion is formed between each heat dissipation strip and the first surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:熱導板</p>
        <p type="p">10:本體</p>
        <p type="p">101:第一表面</p>
        <p type="p">102:第二表面</p>
        <p type="p">11:腔室</p>
        <p type="p">111:腔壁</p>
        <p type="p">12:延伸部</p>
        <p type="p">13:流道結構</p>
        <p type="p">130:流體</p>
        <p type="p">131:毛細結構</p>
        <p type="p">132:流道</p>
        <p type="p">15:散熱結構</p>
        <p type="p">151:散熱條</p>
        <p type="p">152:波浪部</p>
        <p type="p">1521:波峰</p>
        <p type="p">1522:波谷</p>
        <p type="p">153:鏤空部</p>
        <p type="p">154:沖槽</p>
        <p type="p">G1:間隔</p>
        <p type="p">T1、T2:厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="529" publication-number="202625456">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625456</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148188</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱成像壞點檢測方法以及裝置</chinese-title>
        <english-title>METHOD AND DEVICE OF DETECTING BAD PIXELS FOR THERMAL IMAGING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120241231B">H04N25/683</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菱光科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CREATIVE SENSOR INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬智豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, CHIH HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋育寰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNG, YU HUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種熱成像壞點檢測方法，包括：藉由資料擷取電路，從熱成像裝置擷取原始影像；藉由處理器，對原始影像進行非均勻校正演算法以產生原始影像的多個像素各自的多個校正係數；藉由處理器，根據原始影像的各像素的像素值以及各像素的多個校正係數產生特徵空間中的多個特徵座標；以及藉由處理器，對多個特徵座標進行離群值檢測以產生至少一離群座標做為至少一壞點座標，其中至少一壞點座標指示原始影像中與至少一壞點座標對應的至少一像素為異常。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of detecting bad pixels for thermal imaging is disclosed, which includes: by a data capturing circuit, capturing a raw image from a thermal imaging device; by a processor, performing a non-uniformity correction algorithm on the raw image to generate multiple correction coefficients for each of multiple pixels of the raw image; by the processor, generating multiple feature coordinates in a feature space based on a pixel value and the multiple correction coefficients of each pixel of the raw image; and by the processor, performing outlier detection on the multiple feature coordinates to generate at least one outlier coordinate as at least one bad pixel coordinate, where the at least one bad pixel coordinate indicates that at least one of the pixels in the raw image corresponding to the at least one bad pixel coordinate is abnormal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S210~S240:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="530" publication-number="202624682">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624682</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148189</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用沖壓及鍛壓而成的二相流散熱板結構</chinese-title>
        <english-title>TWO-PHASE FLOW HEAT DISSIPATION PLATE STRUCTURE FORMED BY STAMPING AND FORGING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250418B">F28F3/04</main-classification>
        <further-classification edition="200601120250418B">F28D15/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳興奇宏科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASIA VITAL COMPONENTS (CHINA) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫大龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明一種利用沖壓及鍛壓而成的二相流散熱板結構，包括一由金屬板沖壓製成的板體，該板體一側設有一凹置空間，在該凹置空間之中央位置設有一熱源接觸區，該熱源接觸區上具有多個以鍛壓製成呈凸或凹狀的微結構設在該板體一側，藉由該複數個微結構增加散熱面積，進而提供更多與一工作流體相接觸的熱接觸面積，以有效提升熱交換效率及降低成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:二相流散熱板結構</p>
        <p type="p">11:板體</p>
        <p type="p">111:板體上側</p>
        <p type="p">112:凹置空間</p>
        <p type="p">113:板體下側</p>
        <p type="p">12:熱源接觸區</p>
        <p type="p">13:微結構</p>
        <p type="p">131:散熱面</p>
        <p type="p">2:二相流散熱單元</p>
        <p type="p">22:毛細結構</p>
        <p type="p">25:上板體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="531" publication-number="202625224">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625224</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148191</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>柱狀電阻元件及製造其之雷射修阻方法</chinese-title>
        <english-title>COLUMNAR RESISTOR AND METHOD OF LASER TRIMMING FOR MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">H01C17/242</main-classification>
        <further-classification edition="200601120250401B">H01C7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光頡科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIKING TECH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李季倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHI-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧契佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡朝安</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種柱狀電阻元件及製造其之雷射修阻方法，其包含一電阻層設置於一柱狀基材的表面，該電阻層包含一電阻決定區、一第一電阻調整區以及一第二電阻調整區，該電阻決定區被配置為藉由第一次雷射切割，以形成一第一切割線並達到一第一電阻值，該第一電阻調整區被配置為藉由第二次雷射切割，以形成一第二切割線並達到一第二電阻值。利用二次修阻電阻層的方式，達到微調電阻值，進而提升產品製造的穩定性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A columnar resistor and a method of laser trimming for manufacturing the same are provided. The columnar resistor includes a resistance layer diposed on the surface of a columnar substrate and the resistive layer includes a resistance determining area, a first resistance adjustment area, and a second resistance adjustment area. The resistance determining area is confirgured to form a first laser-trimming line and achieve a first resistance value by a first laser-trimming. The first resistance adjustment area is confirgured to form a second laser-trimming line and achieve a second resistance value by a second laser-trimming. The resistance value is precisely adjusted by two laser-trimming processes of the resistive layer, thereby improving the stability of product manufacturing.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:柱狀電阻元件</p>
        <p type="p">10:柱狀基材</p>
        <p type="p">20:電極層</p>
        <p type="p">30:電阻層</p>
        <p type="p">31:第一切割線</p>
        <p type="p">32:第二切割線</p>
        <p type="p">33:第三切割線</p>
        <p type="p">40:保護層</p>
        <p type="p">D1~D3:第一間隔距離至第三間隔距離</p>
        <p type="p">R1:電阻決定區</p>
        <p type="p">R2:第一電阻調整區</p>
        <p type="p">R3:第二電阻調整區</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="532" publication-number="202624632">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624632</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148192</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多通道流量控制系統</chinese-title>
        <english-title>MULTI-CHANNEL FLOW CONTROL SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250423B">F16C32/06</main-classification>
        <further-classification edition="200601120250423B">B23Q11/00</further-classification>
        <further-classification edition="200601120250423B">B23Q1/38</further-classification>
        <further-classification edition="200601120250423B">G05D9/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱証裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, CHENG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳尚德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHANG-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林坤成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種多通道流量控制系統，適用於可擺動的液靜壓旋轉機構，包含：角度感測模組、訊號處理模組與流量控制模組；液靜壓旋轉機構具有一盛裝液壓油之盛油空間；液靜壓旋轉機構可以一第一旋轉軸為中心擺動並帶動盛油空間與角度感測模組同步擺動，使盛油空間相對兩側之出油孔之水平高度相對升降；流量控制模組具有複數管路分別連接各出油孔與一回油管，於各管路設有一閥；角度感測模組感測液靜壓旋轉機構的擺動角度並產生感測訊號；訊號處理模組接收感測訊號以產生控制訊號控制至少一閥，以控制由盛油空間經由各出油孔流入回油管的液壓油的量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multi-channel flow control system adapted for a hydrostatic rotary mechanism, includes an angle detect module, a signal processing module and a flow control module. The hydrostatic rotary mechanism has an oil housing for containing hydraulic oil and is routable by taking a first axis as the center and driving the oil housing and the angle detect module rotate synchronously to make the horizontal height of oil outlets which are disposed on both side of the oil housing rise and fall relatively. The flow control module has a polarity of pipes connect relatively an oil outlet and an oil recycle pipe. The angle detect module detects rotary angle of the hydrostatic rotary mechanism and transmitting detect signal. The signal processing module receives detect signal and transmitting control signal to control at least one valve for controlling quantity of hydraulic oil from each oil outlet to oil recycle pipe.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:多通道流量控制系統</p>
        <p type="p">10:液靜壓旋轉機構</p>
        <p type="p">11:工作臺</p>
        <p type="p">12:盛油空間</p>
        <p type="p">121:第一側</p>
        <p type="p">122:第二側</p>
        <p type="p">123:第三側</p>
        <p type="p">20:角度感測模組</p>
        <p type="p">30:訊號處理模組</p>
        <p type="p">40:流量控制模組</p>
        <p type="p">B:油箱</p>
        <p type="p">H1:第一出油孔</p>
        <p type="p">H2:第二出油孔</p>
        <p type="p">M:馬達幫浦</p>
        <p type="p">LO:液壓油</p>
        <p type="p">P1:第一管路</p>
        <p type="p">P2:第二管路</p>
        <p type="p">PR:回油管</p>
        <p type="p">PR1:進油端</p>
        <p type="p">PR2:出油端</p>
        <p type="p">V1:第一閥</p>
        <p type="p">V2:第二閥</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="533" publication-number="202625215">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625215</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148193</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>模具鋼及其製備方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251105B">G21D5/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>榮剛材料科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳作瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉安洲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鐘健銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種模具鋼的製備方法，包含一提供步驟、一熱加工步驟、一第一降溫步驟、一沃斯田鐵化步驟，及一第二降溫步驟。該提供步驟提供一合金鋼胚。該熱加工步驟將該合金鋼胚升溫並對合金鋼胚進行熱加工。該第一降溫步驟將該合金鋼胚冷卻至室溫後，形成一第一半成品。該沃斯田鐵化步驟將該第一半成品升溫並持溫以形成一第二半成品。該第二降溫步驟將該第二半成品冷卻至室溫，以獲得主要為麻田散鐵相的模具鋼。透過熱加工步驟以及升/降溫步驟的參數調整，控制沃斯田鐵相的體積分率不大於0.5%，以達到提升模具鋼穩定性的功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S2:提供步驟</p>
        <p type="p">S3:熱加工步驟</p>
        <p type="p">S4:第一降溫步驟</p>
        <p type="p">S5:沃斯田鐵化步驟</p>
        <p type="p">S6:第二降溫步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="534" publication-number="202624064">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624064</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148194</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>機車的腳架裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">B62H1/02</main-classification>
        <further-classification edition="200601120241231B">B62H1/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光陽工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃正宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種機車的腳架裝置，該機車包含一車架。所述機車的腳架裝置包含一適用於安裝在該車架的止擋件，及一適用於安裝在該車架並樞接於該止擋件的支撐機構。該止擋件包括一適用於連接該車架的連接端，及一相反於該連接端的阻擋端。該支撐機構是樞接於該止擋件之該連接端，且能在一撐立於地面的駐車位置，及一向上樞轉而抵靠於該阻擋端的收合位置之間移動。由於該止擋件與該支撐機構同是安裝於該車架上，且是在彼此之相對位置固定的情況下一起安裝，於是能盡可能地降低公差造成的影響，藉此確保該支撐機構在該收合位置時精準對位於該阻擋端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:機車</p>
        <p type="p">11:車架</p>
        <p type="p">12:引擎</p>
        <p type="p">13:排氣管</p>
        <p type="p">2:止擋件</p>
        <p type="p">3:支撐機構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="535" publication-number="202624070">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624070</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148195</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>跨坐型車輛</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250217B">B62K11/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光陽工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃正宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種跨坐型車輛，包含一車架、一設置於該車架上的座墊、一個部分位於該座墊下方的油箱、一連接於該油箱下方的引擎，及一回收模組。該車架包括一頭管、一連接該頭管且向後延伸的主架體、一自該頭管連接於該主架體之位置的下方延伸至該主架體的下支架，及一自該下支架延伸的延伸支架。該回收模組包括一連接該油箱的第一管線、一連通於該油箱且位於該延伸支架前方的碳罐、一連接該碳罐的第二管線、一連接該引擎的第三管線，及一連通於該碳罐及該引擎之間的電磁閥。藉此利用該車架的既有空間，妥善因應該碳罐及該電磁閥之配置需求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:車架</p>
        <p type="p">21:頭管</p>
        <p type="p">22:主架體</p>
        <p type="p">23:下支架</p>
        <p type="p">24:延伸支架</p>
        <p type="p">25:橋架</p>
        <p type="p">26:銜接支架</p>
        <p type="p">3:座墊</p>
        <p type="p">4:油箱</p>
        <p type="p">5:引擎</p>
        <p type="p">6:回收模組</p>
        <p type="p">61:第一管線</p>
        <p type="p">62:碳罐</p>
        <p type="p">65:電磁閥</p>
        <p type="p">7:水箱</p>
        <p type="p">8:空氣濾清器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="536" publication-number="202624545">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624545</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148196</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氫水機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120241231B">C25B1/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友荃科技實業股份有限公司 高雄市岡山區文興路 6 之 8 號</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林明賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種氫水機，包含機座、電動升降機構、汲水單元、泵浦、氫氣產生單元、奈米混合槽，及氫水輸出單元等元件。所述電動升降機構帶動所述汲水單元下降至杯子的水液中。所述泵浦透過所述汲水單元將水液抽吸至所述所述氫氣產生單元及所述奈米混合槽中。所述氫氣產生單元將所述泵浦傳來的水液電解成氫氣及氧氣。所述奈米混合槽將所述氫氣與水液奈米混合成氫水，並輸出所述氫水。所述氫水輸出件能夠與所述汲水單元的所述汲水件同時下降而將所述氫水輸出至所述杯子中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:機座</p>
        <p type="p">2:電動升降機構</p>
        <p type="p">21:馬達</p>
        <p type="p">22:電動推桿</p>
        <p type="p">23:連接板</p>
        <p type="p">31:汲水單元</p>
        <p type="p">311:汲水件</p>
        <p type="p">312:進水管</p>
        <p type="p">32:氫水輸出單元</p>
        <p type="p">321:氫水輸出件</p>
        <p type="p">322:出水管</p>
        <p type="p">4:濾水器</p>
        <p type="p">5:泵浦</p>
        <p type="p">51:第一出水口</p>
        <p type="p">52:第二出水口</p>
        <p type="p">6:氫氣產生單元</p>
        <p type="p">7:奈米混合槽</p>
        <p type="p">71:氫水</p>
        <p type="p">72:輸出口</p>
        <p type="p">73:細化石</p>
        <p type="p">8:控制機板</p>
        <p type="p">81:啟動開關</p>
        <p type="p">A:杯子</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="537" publication-number="202625047">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625047</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148197</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顧客接觸管理系統及顧客接觸管理方法</chinese-title>
        <english-title>A CUSTOMER CONTACT MANAGEMENT SYSTEM AND A CUSTOMER CONTACT MANAGEMENT METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250102B">G06Q30/02</main-classification>
        <further-classification edition="202301120250102B">G06Q40/02</further-classification>
        <further-classification edition="201201120250102B">G06Q50/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>玉山商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>E.SUN COMMERCIAL BANK, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝嘉琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHIA-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范薷丰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, JU-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃亭勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TING-SYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅兆匡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, CHAO-KUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈柏任</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, PO-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顧客接觸管理系統，包含一儲存單元及一處理單元。該儲存單元儲存有分別對應於多個行銷活動的多個待接觸顧客清單，各該接觸待顧客清單包含多個顧客識別資料。該處理單元電連接於該儲存單元。該處理單元自該等待接觸顧客清單中找出重複存在於該等待接觸顧客清單其中二者以上的顧客識別資料作為多個待分配顧客識別資料。對於各該待分配顧客識別資料，該處理單元從包含該待分配顧客識別資料的待接觸顧客清單中選出其中一者保留其中的該待分配顧客識別資料，並將其餘待接觸顧客清單中的該待分配顧客識別資料移除。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A customer contact management system comprises a storage unit and a processing unit. The storage unit storing a plurality of to-be-contacted customer lists corresponding to a plurality of marketing activities, respectively, each of the to-be-contacted customer lists comprising a plurality of customer identification data. The processing unit is electrically connected to the storage unit. The processing unit finds out, from the to-contact customer lists, repeating customer identification data present at more than two of the to-contact customer lists as a plurality of to-be-allocated customer identification data. For each of the to-be-allocated customer identification data, the processing unit selects one of the to-be-contacted customer lists comprising the to-be-allocated customer identification data to reserve the to-be-allocated customer identification data and removes the to-be-allocated customer identification data in the remaining to-be-contacted customer lists.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顧客接觸管理系統</p>
        <p type="p">1:儲存單元</p>
        <p type="p">2:處理單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="538" publication-number="202623840">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623840</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148199</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於提升香材之氣味分子種類的方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241218B">A61L9/02</main-classification>
        <further-classification edition="200601120241218B">H05B6/64</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人石材暨資源產業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STONE &amp; RESOURCE INDUSTRY R&amp;D CENTER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>花蓮縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張曉菁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HSIAO-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳哲銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JHE-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許紘瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃子航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TZU-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種用於提升香材之氣味分子種類的方法，其包括：令一香材在800至1400 W的功率下進行一微波處理歷時30至60秒，其中該香材是一選自於由下列所構成之群組中的植物：稀子蕨(        &lt;i&gt;Monachosorum henryi Christ&lt;/i&gt;)、樟樹(        &lt;i&gt;Cinnamomum camphora&lt;/i&gt;)、細枝柃木(        &lt;i&gt;Eurya loquaiana&lt;/i&gt;)，以及它們的組合。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="539" publication-number="202623880">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623880</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148201</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>以均勻電場介電質放電反應器結合集束放電反應器分解二氧化碳之裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250402B">B01D53/32</main-classification>
        <further-classification edition="200601120250402B">B01D53/62</further-classification>
        <further-classification edition="200601120250402B">B01J19/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪崑喨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪崑喨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳吉隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關一種以均勻電場介電質放電反應器結合集束放電反應器分解二氧化碳之裝置，其係包括分解裝置，其中分解裝置包括外框體、進氣銜接管、排氣銜接管及處理單元，其中處理單元設於所述外框體內，處理單元包括至少一節處理部，每一節處理部內組設有一均勻電場介電質放電反應器及一集束放電反應器，所述進氣銜接管及排氣銜接管分別連接於處理單元之兩端，進氣銜接管係與工廠所產生有害廢氣之排出煙管銜接，將工廠所排放之有害廢氣導入處理單元，有害廢氣經一節以上內組設有一均勻電場介電質放電反應器及一集束放電反應器之處理部，再將處理完成之無害氣體由排氣銜接管排出，通過本發明處理部內組設有一均勻電場介電質放電反應器及一集束放電反應器，可有效分解二氧化碳、硫氧化物、氮氧化物及分解廚房油煙、香煙煙霧及工業用於機械加工產生的煙霧，並對於有機氣體、無機氣體的分解及殺滅空氣中的細菌之功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:外框體</p>
        <p type="p">12:進氣銜接管</p>
        <p type="p">13:排氣銜接管</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="540" publication-number="202625320">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625320</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148208</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>端子模組及端子模組製造方法</chinese-title>
        <english-title>PIN MODULE, AND PIN MODULE MANUFACTURE METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250121B">H01R43/16</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利鴻科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI HONG TECHNOLOGY SOLUTIONS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李承陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHENG-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種端子模組及端子模組製造方法，其中，端子模組製造方法包含：提供一料帶；於該料帶上以衝壓方式形成複數個端子，各該端子的一端子根部分離；以及先將一端子座形成於該複數個端子上，再將該複數個端子與該料帶分離；或先將該複數個端子與該料帶分離，再將一端子座形成於該複數個端子上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pin module and a pin module manufacturing method, wherein the terminal module manufacturing method includes: providing a material tape; forming a plurality of pins on the material tape by stamping, wherein a pin root of each terminal are separated; and forming a pin base on the plurality of pins first, and then separating the plurality of pins from the material strip; or separating the plurality of pins from the material strip first, and then forming the pin base on the plurality of pins.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1、S2、S31、S32:流程</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="541" publication-number="202624801">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624801</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148209</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>異質整合結構以及異質整合晶圓</chinese-title>
        <english-title>HETEROGENEOUS INTEGRATION STRUCTURE AND HETEROGENEOUS INTEGRATION WAFER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250429B">G02B6/12</main-classification>
        <further-classification edition="200601120250429B">G02B6/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>温新助</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WUN, SIN-JHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種異質整合結構，包括光子積體電路以及光導引裝置。光子積體電路包括基板、光源以及光學耦合元件。光源提供第一光至光學耦合元件。光導引裝置與光子積體電路形成異質整合且包括第一透鏡以及第一反射器。第一透鏡配置於基板上，且對準至光學耦合元件。來自光學耦合元件的第一光依序穿透第一透鏡、被第一反射器反射並傳遞至一光纖連接器。來自光纖連接器的第二光依序被第一反射器反射、穿透第一透鏡並傳遞至光學耦合元件。一種異質整合晶圓亦被提出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A heterogeneous integration structure including a photonic integrated circuit and a light guiding device is provided. The photonic integrated circuit includes a substrate, a light source and an optical coupling element. The light source provides a first light to the optical coupling element. The light guiding device forms heterogeneous integration with the photonic integrated circuit, and includes a first lens element and a first reflector. The first lens element is disposed on the substrate and aligned with the optical coupling element. The first light coming from the optical coupling element passes through the first lens element, gets reflected by the first reflector and reaches a fiber connector in sequence. A second light coming from the fiber connector gets reflected by the first reflector, passes through the first lens element, and reaches the optical coupling element in sequence. A heterogeneous integration wafer is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:異質整合結構、異質整合晶片</p>
        <p type="p">100:光子積體電路</p>
        <p type="p">101:光源</p>
        <p type="p">102:光學耦合元件</p>
        <p type="p">103:光學調變器</p>
        <p type="p">104:波導</p>
        <p type="p">200:光導引裝置</p>
        <p type="p">201:可拆卸模組</p>
        <p type="p">201A:第一部件</p>
        <p type="p">201B:第二部件</p>
        <p type="p">201C:第三部件</p>
        <p type="p">202、204:透鏡</p>
        <p type="p">203:第一反射器</p>
        <p type="p">205:第二反射器</p>
        <p type="p">206:光纖</p>
        <p type="p">SB:基板</p>
        <p type="p">ST:頂面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="542" publication-number="202624132">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624132</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148216</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池正極材料、其前驅物及其製造的方法以及鋰離子電池</chinese-title>
        <english-title>BATTERY CATHODE MATERIAL, ITS PRECURSOR, METHOD FOR ITS MANUFACTURE, AND LITHIUM-ION BATTERY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250325B">C01G53/50</main-classification>
        <further-classification edition="200601120250325B">C11D11/02</further-classification>
        <further-classification edition="202301120250325B">C22C1/053</further-classification>
        <further-classification edition="201001120250325B">H01M4/505</further-classification>
        <further-classification edition="201001120250325B">H01M10/0525</further-classification>
        <further-classification edition="201001120250325B">H01M4/1393</further-classification>
        <further-classification edition="200601120250325B">C09D127/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芯量科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOLIDEDGE SOLUTION INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪辰宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, CHEN-TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張曾隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, TSENG-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供一種電池正極材料，包括鋰鎳錳氧化物粉體，鋰鎳錳氧化物粉體的晶體結構為單晶，鋰鎳錳氧化物粉體的粒徑跨度小於5，以及粒徑跨度為粒徑分佈中的(D        &lt;sub&gt;90&lt;/sub&gt;-D        &lt;sub&gt;10&lt;/sub&gt;)/D        &lt;sub&gt;50&lt;/sub&gt;。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a battery cathode material, including a lithium nickel manganese oxide powder, a crystal structure of the lithium nickel manganese oxide powder is single crystal, a particle size span of the lithium nickel manganese oxide powder is less than 5, and the particle size span is (D        &lt;sub&gt;90&lt;/sub&gt;-D        &lt;sub&gt;10&lt;/sub&gt;)/D        &lt;sub&gt;50&lt;/sub&gt;from a particle size distribution.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:鋰鎳錳氧化物粉體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="543" publication-number="202625279">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625279</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148217</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>固態電池之電芯的製備機台</chinese-title>
        <english-title>APPARATUS FOR MANUFACTURING SOLID STATE BATTERY CELL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120250417B">H01M10/0562</main-classification>
        <further-classification edition="201001120250417B">H01M10/0565</further-classification>
        <further-classification edition="201001120250417B">H01M10/058</further-classification>
        <further-classification edition="201001120250417B">H01M10/0585</further-classification>
        <further-classification edition="201001120250417B">H01M10/052</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芯量科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOLIDEDGE SOLUTION INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉建弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIEN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張志清</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張曾隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, TSENG-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種固態電池之電芯的製備機台，包含夾持平台、整型治具、以及側邊封裝治具。夾持平台包含下部基座與上部基座。整型治具包含上部整型機構與下部整型機構。上部整型機構套裝於上部基座外側且包含具有收邊板的收邊元件，收邊板為具有錐度的楔形板。下部整型機構套裝於下部基座外側且包含具有多個折邊板的折邊元件，折邊板為具有錐度的楔形板，其中折邊元件的內徑大於收邊元件的內徑。側邊封裝治具包含複數個貼膠夾爪，橫向地圍繞整型治具設置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus for manufacturing solid state battery cell, the apparatus includes a clamping platform, a shaping unit, and a side-package unit. The clamping platform includes a bottom base and a top base. The shaping unit includes a lower shaping mechanism and an upper shaping mechanism. The upper shaping mechanism is disposed surrounding the top base and includes a trimming component having trimming plates. The trimming plates are wedge plates with taper. The lower shaping mechanism is disposed surrounding the top base and includes a fixing component having fixing plates. The fixing plates are wedge plates with taper. The inner dimension of the fixing component is greater than the inner dimension of the trimming component. The side-package unit includes taping clamps disposed laterally surround in the shaping unit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:固態電池之電芯的製備機台</p>
        <p type="p">200:夾持平台</p>
        <p type="p">210:上部基座</p>
        <p type="p">212:升降柱</p>
        <p type="p">214:壓頭部</p>
        <p type="p">216:抵接面</p>
        <p type="p">220:下部基座</p>
        <p type="p">222:底柱</p>
        <p type="p">224:承載部</p>
        <p type="p">226:承靠面</p>
        <p type="p">300:整型治具</p>
        <p type="p">310:上部整型機構</p>
        <p type="p">312:上部升降柱</p>
        <p type="p">314:收邊元件</p>
        <p type="p">316:第一收邊板</p>
        <p type="p">318:第二收邊板</p>
        <p type="p">320:上部開槽</p>
        <p type="p">322:導引片</p>
        <p type="p">330:下部整型機構</p>
        <p type="p">332:下部升降柱</p>
        <p type="p">334:折邊元件</p>
        <p type="p">336:第一折邊板</p>
        <p type="p">338:第二折邊板</p>
        <p type="p">340:下部開槽</p>
        <p type="p">400:側邊封裝治具</p>
        <p type="p">410:貼膠夾爪</p>
        <p type="p">S1:極耳側</p>
        <p type="p">S2:非極耳側</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="544" publication-number="202623919">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623919</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148219</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電熱結構及其製造方法暨其應用</chinese-title>
        <english-title>ELECTRIC HEATING STRUCTURE, MANUFACTURING METHOD AND APPLICATION THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">B09C1/06</main-classification>
        <further-classification edition="200601120241231B">H05B3/02</further-classification>
        <further-classification edition="200601120241231B">C08K3/38</further-classification>
        <further-classification edition="200601120241231B">C09K5/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裕山環境工程股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUH SHAN ENVIRONMENTAL ENGINEERING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, WEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾建棠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZENG, JIAN-TANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉原宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YUAN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張育祺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YU-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冠宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, KUAN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電熱結構的製造方法包含以下步驟。提供電熱棒。形成導熱塗層於電熱棒的外表面上，以形成電熱結構。導熱塗層包含於外表面上的內部塗層以及於內部塗層上的外部塗層。電熱結構可以提升土壤層的升溫速率，從而增加對污染土壤的整治效率並擴大整治範圍。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method of an electric heating structure includes the following steps. An electric heating rod is provided. A thermally conductive coating layer is formed on an outer surface of the electric heating rod to form the electric heating structure. The thermally conductive coating layer includes an inner coating layer on the outer surface and an outer coating layer on the inner coating layer. The electric heating structure can increase a heating rate of the soil layer, thereby increasing the remediation efficiency for contaminated soil and expanding the scope of remediation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">110,120:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="545" publication-number="202623990">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623990</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148221</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水泥３Ｄ列印在鋼骨上滑動固定結構</chinese-title>
        <english-title>SLIDING AND FIXING STRUCTURE OF THREE-DIMENSIONAL CONCRETE PRINTING APPLIED TO STEEL SKELETONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120250307B">B29C64/20</main-classification>
        <further-classification edition="201701120250307B">B29C64/232</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>頡欣機械有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>E-PLAST MACHINERY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳國信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUO-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李汪周</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, WANG-CHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏福楨</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種水泥3D列印在鋼骨上滑動固定結構，其具有複數鋼骨，該鋼骨開設有複數卡孔，該鋼骨裝設有一上滑行裝置與一下滑行裝置，該上滑行裝置具有一升降驅動總成，該下滑行裝置則具有一接設於該升降驅動總成的升降件，該上滑行裝置與該下滑行裝置並皆可卡入或退出於該卡孔，以轉換成固定或可滑行狀態，藉此當該升降驅動總成產生動力於該升降件時，可讓該上滑行裝置或該下滑行裝置相對該鋼骨滑移，以改變一設置於該下滑行裝置上的二維列印裝置之高度，進而解決三維列印技術過往在建築產業的侷限性問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention related to a sliding and fixing structure of three-dimensional contrete printing applied to steel skeletons includes several steel skeletons. The steel skeleton was disposed for several latch holes. Each steel skeleton mounted with a top sliding device and a bottom sliding device. The top sliding device has an elevation driving assembly. The bottom sliding device has an elevation element connected to the elevation driving assembly. The top sliding device and the bottom sliding device can both latch in or leave the latch holes to transform into a fixed or a slidable situation. When the elevation driving assembly exerts power to the elevation element, the top sliding device or the bottom sliding device can slide on the steel skeleton to change the height of a two-dimentional printing device disposed on the bottom sliding device. So the present invention can solve the past limitation problem of three-dimentional printing technology in the building industrial.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:鋼骨組件</p>
        <p type="p">11:鋼骨</p>
        <p type="p">12:卡孔</p>
        <p type="p">2:上滑行裝置</p>
        <p type="p">21:上滑座</p>
        <p type="p">22:上滾輪</p>
        <p type="p">23:上卡具驅動器</p>
        <p type="p">25:升降驅動總成</p>
        <p type="p">251:馬達</p>
        <p type="p">3:下滑行裝置</p>
        <p type="p">31:下滑座</p>
        <p type="p">32:下滾輪</p>
        <p type="p">33:下卡具驅動器</p>
        <p type="p">35:升降件</p>
        <p type="p">4:二維列印裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="546" publication-number="202625860">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625860</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148222</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>中介層電子模組、半導體封裝結構及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W74/00</main-classification>
        <further-classification edition="202601120260302B">H10W72/00</further-classification>
        <further-classification edition="202601120260302B">H10W74/01</further-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈞得股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃士軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龍振炫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王克倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種中介層電子模組、半導體封裝結構及其製造方法，所述的中介層電子模組包括有一絕緣層及被絕緣層完全或部分包覆的多個導體，所述絕緣層為具有絕緣效果的材料，所述導體呈柱狀並具有良好導電性，其中所述各導體的至少一端表面露出於所述絕緣層的表面；本發明通過前述的中介層電子模組可以作為類似被動元件的效果用於連接晶片與晶片、晶片與電路板或電路板與電路板的中介層模組，改良了現有製程的複雜製法並且具有更高的泛用性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">M1:中介層電子模組</p>
        <p type="p">10:絕緣層</p>
        <p type="p">11:上表面</p>
        <p type="p">12:下表面</p>
        <p type="p">20:導體</p>
        <p type="p">21:端表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="547" publication-number="202625528">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625528</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148225</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>伺服器、機殼模組及可轉式承載盤</chinese-title>
        <english-title>SERVER, CASING MODULE AND ROTATABLE SUPPORT TRAY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">H05K5/02</main-classification>
        <further-classification edition="200601120241231B">H05K7/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緯穎科技服務股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIWYNN CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱筠雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, YUN-YA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃柏翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, PO HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種伺服器，包含一機殼模組。機殼模組包含一機殼及一可轉式承載盤。機殼具有一第一定位結構。可轉式承載盤包含一盤體及一鉸接組件。鉸接組件設置於盤體且包含一組接件、一第二定位結構及至少一接觸凸塊，盤體透過組接件可樞轉地組接於機殼，第二定位結構用以卡合於機殼的第一定位結構而定位盤體相對機殼的角度，至少一接觸凸塊用以於盤體相對機殼樞轉時接觸機殼而提供一摩擦阻力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A server includes a casing module and a motherboard. The casing module includes a casing and a rotatable support tray. The casing has a first positioning structure. The rotatable support tray includes a tray body and a hinge assembly. The hinge assembly is disposed on the tray body and includes a mount component, a second positioning structure and at least one contact protrusion. The tray body is pivotably mounted on the casing via the mount component. The second positioning structure is configured to be engaged with the first positioning structure of the casing to position an angle of the tray body relative to the casing. The contact protrusion is configured to contact the casing during the rotation of the tray body relative to the casing for providing friction resistance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:主機板</p>
        <p type="p">10:機殼</p>
        <p type="p">11:外殼</p>
        <p type="p">111:第一底板</p>
        <p type="p">1111:第一承載面</p>
        <p type="p">112:第一側牆</p>
        <p type="p">1121:組接孔</p>
        <p type="p">1122:固持孔</p>
        <p type="p">12:支撐架</p>
        <p type="p">20:可轉式承載盤</p>
        <p type="p">21:盤體</p>
        <p type="p">211:第二底板</p>
        <p type="p">2111:第二承載面</p>
        <p type="p">212:第二側牆</p>
        <p type="p">2122:滑槽</p>
        <p type="p">22:鉸接組件</p>
        <p type="p">23:固持件</p>
        <p type="p">30:連桿組件</p>
        <p type="p">31:第一連桿</p>
        <p type="p">32:第二連桿</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="548" publication-number="202625854">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625854</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148227</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體封裝結構</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGING STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260223B">H10W72/50</main-classification>
        <further-classification edition="202601120260223B">H10W70/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商強茂半導體（徐州）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANJIT SEMICONDUCTOR (XUZHOU) CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方廷宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, TING YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏冰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, BING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬翠鳳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAN, CUIFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何中雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, CHUNG HSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王永輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YUNG-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳政賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JENG SIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體封裝結構，包含一導線架、一晶粒、一第一電連接元件、一第二電連接元件以及一封裝層。導線架包含彼此分離的一承載部及一電路部。晶粒設置於該導線架的該承載部，並電性連接於該導線架的該電路部。第一電連接元件以及第二電連接元件各自包含一導電膠。第一電連接元件以及第二電連接元件導電膠分別設置並電性連接於導線架的電路部承載部。封裝層包覆晶粒。導電膠設置于封裝層中且封裝層的相對二側面分別顯露第一電連接元件的導電膠及第二電連接元件的導電膠。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor packaging structure including a lead frame, a die, a first electrically connecting component and a molding layer. The lead frame includes a support part and a circuit part spaced apart from each other. The die is disposed on the support part and electrically connected to the circuit part. The first and second electrically connecting components each include a conductive adhesive. The conductive adhesives are disposed on and electrically connected to the support part and the circuit part. The molding layer covers the die. The conductive adhesive is disposed in the molding layer and a side surface of the molding layer expose the conductive adhesive.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體封裝結構</p>
        <p type="p">100:導線架</p>
        <p type="p">110:承載部</p>
        <p type="p">111:側面</p>
        <p type="p">120:電路部</p>
        <p type="p">121:側面</p>
        <p type="p">200:晶粒</p>
        <p type="p">210:接墊</p>
        <p type="p">250:引線</p>
        <p type="p">300:金屬層</p>
        <p type="p">310:底部</p>
        <p type="p">320:側部</p>
        <p type="p">321:平坦段</p>
        <p type="p">322:弧形段</p>
        <p type="p">400:第一電連接元件</p>
        <p type="p">410:導電膠</p>
        <p type="p">420:非金屬核心</p>
        <p type="p">430:金屬膜</p>
        <p type="p">500:第二電連接元件</p>
        <p type="p">510:導電膠</p>
        <p type="p">520:非金屬核心</p>
        <p type="p">530:金屬膜</p>
        <p type="p">600:封裝層</p>
        <p type="p">610:側面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="549" publication-number="202624078">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624078</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148228</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自行車後變速器</chinese-title>
        <english-title>BICYCLE REAR DERAILLEUR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120250307B">B62M9/1242</main-classification>
        <further-classification edition="201001120250307B">B62M9/126</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彥豪智能科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEKTRO TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡蘭卓爾　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CALENDRILLE, JR.,L. JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖博益</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, BO-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自行車後變速器，用以安裝於一車架，包含一基座構件、一活動構件、一第一樞軸、一第二樞軸、一第三樞軸、一第四樞軸、一連桿組件及一導鏈構件。基座構件用以安裝於車架。連桿組件包含一外連桿及一內連桿，外連桿的一端及內連桿的一端分別透過第一樞軸及第二樞軸樞接於基座構件，外連桿的另一端及內連桿的另一端分別透過第三樞軸及第四樞軸樞接於活動構件。導鏈構件樞接於活動構件。第一樞軸之中心線至第二樞軸之中心線的距離大於第三樞軸之中心線至第四樞軸之中心線的距離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bicycle rear derailleur is configured to be mounted on a bicycle frame. The bicycle rear derailleur includes a base component, a movable component, a first shaft, a second shaft, a third shaft, a fourth shaft, a linkage assembly and a chain guide. The base component is configured to be mounted on the bicycle frame. The linkage assembly includes an outer link and an inner link. One end of the outer link and one end of the inner link are respectively pivotably connected to the base component via the first shaft and the second shaft. Another end of the outer link and another end of the inner link are respectively pivotably connected to the movable component via the third shaft and the fourth shaft. The chain guide is pivotably connected to the movable component. A distance between a central axis of the first shaft and a central axis of the second shaft is greater than a distance between a central axis of the third shaft and a central axis of the fourth shaft.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基座構件</p>
        <p type="p">20:活動構件</p>
        <p type="p">30:第一樞軸</p>
        <p type="p">40:第二樞軸</p>
        <p type="p">50:第三樞軸</p>
        <p type="p">60:第四樞軸</p>
        <p type="p">70:連桿組件</p>
        <p type="p">71:外連桿</p>
        <p type="p">72:內連桿</p>
        <p type="p">80:導鏈構件</p>
        <p type="p">81:架體</p>
        <p type="p">82,83:導輪</p>
        <p type="p">I:安裝軸線</p>
        <p type="p">F:車架</p>
        <p type="p">C1,C2,C3,C4:中心線</p>
        <p type="p">R1:樞轉軸線</p>
        <p type="p">R2,R3:轉動軸線</p>
        <p type="p">S1-S12:齒盤</p>
        <p type="p">θ:傾斜角度</p>
        <p type="p">H:水平線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="550" publication-number="202625212">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625212</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148230</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>亞健康預防追蹤裝置系統及其方法</chinese-title>
        <english-title>A DEVICE SYSTEM OF SUBOPTIMAL HEALTH STATUS PREVENTION TRACKING AND THE METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250307B">G16H50/30</main-classification>
        <further-classification edition="201801120250307B">G16H50/70</further-classification>
        <further-classification edition="200601120250307B">G02B27/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>點睛科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IDEABUS TECHNOLOGY LIMITED LIABILITY COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林翠娥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TSUI-E</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育竹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本技術涉及一種基於頭戴式裝置與多感測器協作的個人亞健康預防預測系統。系統由頭戴式裝置、第一電子裝置，以及多個感測器（如智慧型手錶、智慧手環、智慧衣）組成，通過實時數據收集與分析，提供個性化健康管理服務。在數據收集階段，頭戴式裝置記錄用戶的行為數據（如反應時間、運動軌跡），感測器同步收集生理指標（如心率、血壓、呼吸速率）。系統利用AI模型融合並分析數據間的相關性，檢測亞健康跡象（如動作不協調或心率異常）。基於分析結果，生成個性化健康報告，提供亞健康風險預測、改善建議及康復目標。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a suboptimal health status prevention and prediction system based on the cooperation of a head-mounted device and multiple sensors. The system consists of a head-mounted device, a first electronic device, and multiple sensors (such as smart watches, smart bracelets, and smart clothing). It provides personalized health management services through real-time data collection and analysis. In the data collection phase, the head-mounted device records the user's behavioral data (such as reaction time, movement trajectory), and the sensors simultaneously collect physiological indicators (such as heart rate, blood pressure, breathing rate). The system uses AI models to fuse and analyze the correlation between data to detect signs of sub-health (such as uncoordinated movements or abnormal heart rate).</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:亞健康預防追蹤裝置系統</p>
        <p type="p">100:頭戴式裝置</p>
        <p type="p">11:第一電子裝置</p>
        <p type="p">11P:第一處理器</p>
        <p type="p">11M:第一記憶體</p>
        <p type="p">11D:第一顯示器</p>
        <p type="p">12:智慧型手錶</p>
        <p type="p">13:智慧手環</p>
        <p type="p">14:智慧衣</p>
        <p type="p">15:手臂護套</p>
        <p type="p">16:腿部護套</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="551" publication-number="202624985">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624985</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148231</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>個人化運動處方裝置系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD OF PERSONALIZED EXERCISE PRESCRIPTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120241231B">G06F16/248</main-classification>
        <further-classification edition="200601120241231B">A63B24/00</further-classification>
        <further-classification edition="200601120241231B">A61B5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>點睛科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IDEABUS TECHNOLOGY LIMITED LIABILITY COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林翠娥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TSUI-E</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育竹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明主要揭示一種個人化運動處方系統，其包括一電子裝置與複數個感測器，且具有以下功能：(1)收集用戶的靜態生理數據；以及(2)依據生理數據、用戶個人數據與用戶輸入的一運動目標產生一運動處方/方案。並且，在用戶依據該運動處方進行至少一種運動的情況下，所述個人化運動處方系統執行以下功能：(3)收集用戶的動態感測數據，包括動態生理數據以及體感數據；以及(4)依據動態感測數據計算一運動強度並評估運動成效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a system of personalized exercise prescription, which comprises an electronic device and a plurality of sensors. The system is configured to perform functions of (1) collecting static physiological data from a user; and (2) generating an exercise prescription/solution based on the static physiological data, a user personal data and a target of exercise inputted by the user. Moreover, the system is further configured to, in case of the user conducting at least one exercise according to the exercise prescription, the functions of (3) collecting real-time monitoring data of the user including physiological data and kinesthetic data; and (4) conducting a computing of exercise intensity and an evaluation of exercise performance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:個人化運動處方系統</p>
        <p type="p">11:第一電子裝置統</p>
        <p type="p">11P:第一處理器</p>
        <p type="p">11M:第一記憶體</p>
        <p type="p">11D:第一顯示器</p>
        <p type="p">11U:用戶操作介面</p>
        <p type="p">12:智慧型手錶</p>
        <p type="p">13:智慧手環</p>
        <p type="p">14:智慧衣</p>
        <p type="p">15:手臂護套</p>
        <p type="p">16:腿部護套</p>
        <p type="p">17:第二電子裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="552" publication-number="202625058">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625058</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148233</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>店鋪代收物品系統與店鋪代收物品方法</chinese-title>
        <english-title>SHOP GOODS COLLECTION SYSTEM AND SHOP GOODS COLLECTION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250102B">G06Q30/06</main-classification>
        <further-classification edition="202401120250102B">G06Q10/08</further-classification>
        <further-classification edition="201201120250102B">G06Q50/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全家便利商店股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN FAMILYMART CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳沁羽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CIN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇奕穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, YEE-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳重佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHONG-YOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林旻萱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, MIN-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種店鋪代收物品系統包括訂單生成伺服器、條碼掃描裝置以及店鋪管理伺服器。訂單生成伺服器配置以接收訂單資料並產生寄件單據。寄件單據包括條碼。條碼包括第一驗證連結位址與第二驗證連結位址。條碼掃描裝置配置以讀取寄件單據的條碼。店鋪管理伺服器通訊連接於條碼掃描裝置。當條碼掃描裝置在第一時間區間内讀取條碼時，店鋪管理伺服器通過條碼掃描裝置獲取第一驗證連結位址並提示第一驗證程序。當條碼掃描裝置在第二時間區間内讀取條碼時，店鋪管理伺服器通過條碼掃描裝置獲取第二驗證連結位址並提示第二驗證程序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A shop goods collection system includes an order generation server, a barcode scanning device, and a shop management server. The order generation server is configured to receive an order data and generate a delivery document. The delivery document includes a barcode. The barcode includes a first verification link address and a second verification link address. The barcode scanning device is configured to read the barcode of the delivery document. The shop management server is communicatively connected to the barcode scanning device. When the barcode scanning device reads the barcode within a first time interval, the shop management server obtains the first verification link address through the barcode scanning device and prompts a first verification procedure. When the barcode scanning device reads the barcode within a second time interval, the shop management server obtains the second verification link address through the barcode scanning device and prompts a second verification procedure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:店鋪代收物品系統</p>
        <p type="p">20:第一用戶裝置</p>
        <p type="p">30:第二用戶裝置</p>
        <p type="p">40:物流裝置</p>
        <p type="p">110:多媒體裝置</p>
        <p type="p">120:訂單生成伺服器</p>
        <p type="p">130:條碼掃描裝置</p>
        <p type="p">140:店鋪管理伺服器</p>
        <p type="p">150:訊息發送平台</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="553" publication-number="202624932">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624932</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148240</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>階層式熱設計功率管理方法、模組及使用其之電子裝置</chinese-title>
        <english-title>HIERARCHY BASED THERMAL DESIGN POWER MANAGEMENT METHOD, MODULE, AND ELECTRONIC DEVICE USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120241231B">G06F1/3234</main-classification>
        <further-classification edition="200601120241231B">G06F11/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飛捷科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLYTECH TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周立群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, LI-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡水金</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, SHUI-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白大尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種階層式熱設計功率管理方法，其包含：透過基本輸入輸出系統韌體，提供使用者自訂包含當前溫度階層之複數溫度階層，該當前溫度階層透過區間溫度上限以及區間溫度下限而界定；透過嵌入式控制器：週期性讀取處理器之工作溫度；如果該工作溫度大於該區間溫度上限，將較高溫度階層指定為該當前溫度階層；以及如果該工作溫度小於該區間溫度下限，將較低溫度階層指定為該當前溫度階層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a hierarchy based thermal design power management method. The method includes steps of: through a BIOS firmware, providing for a user to customize a plurality of temperature levels including a current temperature level defined by an interval temperature upper limit and an interval temperature lower limit; through an embedded controller: periodically reading an operating temperature for a processor; assigning a higher temperature level as the current temperature level, if the operating temperature is greater than the interval temperature upper limit; and assigning a lower temperature level as the current temperature level, if the operating temperature is less than the interval temperature lower limit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:嵌入式控制器</p>
        <p type="p">20:基本輸入輸出系統韌體</p>
        <p type="p">30:處理器</p>
        <p type="p">31:溫度感知器</p>
        <p type="p">32:模型特定暫存器</p>
        <p type="p">100:階層式熱設計功率管理模組</p>
        <p type="p">200:電子裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="554" publication-number="202624081">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624081</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148241</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>導流裝置</chinese-title>
        <english-title>FLOW GUIDE DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250317B">B64C1/38</main-classification>
        <further-classification edition="202301120250317B">B64U10/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊光勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, KUANG-SHINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許昭傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHAO CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴聖儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI, SHENG-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種導流裝置，適於設置在一飛行器的至少一槳翼的至少一馬達上，且包括至少一第一導流結構。至少一第一導流結構適於設置至至少一馬達。第一導流結構包括一第一套設部及一第一導流部。第一套設部包括一第一容納槽，適於容納馬達。第一導流部延伸自第一套設部，第一導流部包括傾斜的一弧形坡面，且第一導流部越遠離第一套設部的寬度越小，而呈鴨嘴狀。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A flow guide device is adapted for being disposed at at least one motor of at least one blade of an aircraft, and includes at least one first flow guide structure. The at least one first air guide structure is adapted to be provided to the at least one motor. The first guide structure includes a first sleeve portion and a first flow guide portion. The first sleeve portion includes a first receiving groove, which is adapted for receiving the motor. The first flow guide portion extends from the first sleeve portion. The first flow guide portion includes an arc-shaped slope which is inclined, and widths of the first flow guide portion is reduced along a direction away from the first sleeve portion so as to form a duckbill shape.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:固定桿</p>
        <p type="p">40:馬達</p>
        <p type="p">110:第一導流結構</p>
        <p type="p">120:第一套設部</p>
        <p type="p">121:第一容納槽</p>
        <p type="p">122:第一頂壁</p>
        <p type="p">123:第一底壁</p>
        <p type="p">124:第一開孔</p>
        <p type="p">125:導流斜面</p>
        <p type="p">126:第二開孔</p>
        <p type="p">130:第一導流部</p>
        <p type="p">131:前端</p>
        <p type="p">132:後端</p>
        <p type="p">133:弧形坡面</p>
        <p type="p">134:第一部分</p>
        <p type="p">135:第二部分</p>
        <p type="p">136:轉折邊界</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="555" publication-number="202625354">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625354</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148253</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙主動橋式轉換器及其輸出電壓偏移方法</chinese-title>
        <english-title>DUAL ACTIVE BRIDGE CONVERTER AND VOLTAGE SHIFTING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">H02M3/335</main-classification>
        <further-classification edition="200601120241231B">H02M1/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>致茂電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHROMA ATE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭譽耀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, YU-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TSUNG-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JUN-YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃政誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種雙主動橋式轉換器及其輸出電壓偏移方法。雙主動橋式轉換器包括功率級電路及控制電路。控制電路對功率級電路的前橋及後橋分別輸出第一組及第二組控制信號，使功率級電路的輸出端在正功率輸出狀態下具有第一電壓，並在負功率輸出狀態下具有第二電壓。第一組控制信號與第二組控制信號之間具有橋間相移角。控制電路根據中心相移角估計輸出電流，並據以決定補償角，而依據中心相移角與補償角的總和更新橋間相移角。中心相移角對應於第一電壓與第二電壓間的第三電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A dual active bridge converter and a voltage shifting method thereof are provided. The dual active bridge converter includes a power-stage circuit and a controlling circuit. The controlling circuit respectively outputs a first set and a second set of control signals to a front-end bridge and a rear-end bridge of the power-stage circuit. An output-end of the power-stage circuit has a first voltage in a positive power state and a second voltage in a negative power state. There is an inter-bridges phase-shift angle between the first set of control signals and the second set of control signals. The controlling circuit estimates an output current according to the center phase-shift angle, and determines the compensation angle accordingly. The inter-bridges phase-shift angle is updated based on the sum of a center phase-shift angle and the compensation angle. The center phase-shift angle corresponds to a third voltage between the first voltage and the second voltage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1,S2,S3,S31,S32,S4,S41,S42,S5,S6:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="556" publication-number="202623972">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623972</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148255</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>機械手臂系統及其控制方法</chinese-title>
        <english-title>MECHANICAL ARM SYSTEM AND CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250307B">B25J13/08</main-classification>
        <further-classification edition="200601120250307B">B25J19/00</further-classification>
        <further-classification edition="201701120250307B">G06T7/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史　瓦米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SWAMI, SIDDHARTH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡銘浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MING-HAU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙克傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAO, KO-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林義暐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提出一種機械手臂系統及其控制方法。機械手臂系統用以移動物體，機械手臂系統包含攝像器、光源以及處理器。所述攝像器具有視軸及取景範圍，攝像器用以沿視軸之方向擷取位於取景範圍之物體的物體影像。所述光源具有光軸，視軸與光軸不平行，光源用以沿光軸之方向照射取景範圍。所述處理器用以識別物體影像以獲取物體之形心。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A mechanical arm system and a control method thereof are provided. The mechanical arm system is configured to move an object. The mechanical arm system comprises a camera, a light source, and a processor. The camera has an optical axis and a field of view and is configured to capture an image of the object located within the field of view along the direction of the optical axis. The light source has a light axis that is not parallel to the optical axis and is configured to illuminate the field of view along the direction of the light axis. The processor is configured to recognize the image to obtain the centroid of the object.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S31~S37:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="557" publication-number="202625629">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625629</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148256</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多接面太陽能電池</chinese-title>
        <english-title>MULTIPLE JUNCTION SOLAR CELL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250303B">H10F77/42</main-classification>
        <further-classification edition="202501120250303B">H10F77/40</further-classification>
        <further-classification edition="202501120250303B">H10F19/00</further-classification>
        <further-classification edition="201401120250303B">H02S40/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>晶泰國際科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAICRYSTAL INTERNATIONAL TECHNOLOGIES CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林瑞陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, RAY-YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾貴聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZENG, GUI-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAO, MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖緯承</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, WEI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鐘惠滿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, HUI-MAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡孟熹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種多接面太陽能電池，包含第一、第二及第三太陽能電池單元、第一及第二抗反射鍍層、光學膠層、保護玻璃及鉭矽氧化物抗反射疊層，對於波長600至900nm的光波的反射率小於6.5%。第一、第二及第三太陽能電池單元串接，分別吸收波長660nm以下、600至900nm波長及900nm以上的光波轉換為電能。第一、第二抗反射鍍層分別由二氧化鈦及氧化鋁所製成，且厚度分別在45至75nm及65至110nm之間。光學膠層與保護玻璃的折射率分別在1.52至1.58與1.46至1.54之間。鉭矽氧化物抗反射疊層包含第一鉭矽氧化物堆疊層及第二鉭矽氧化物堆疊層，鉭矽氧化物抗反射疊層的厚度小於75nm。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multiple junction solar cell includes a first solar cell unit, a second solar cell units, a third solar cell unis, a first anti-reflective coating, a second anti-reflective coating, an optical adhesive layer, a protective glass and tantalum silicon oxide anti-reflective laminating layers, and the reflectivity for light waves with wavelengths from 600 to 900nm is less than 6.5%. The first, second and third solar cell units are connected in series and respectively absorb light waves with wavelengths less than 660nm, 600 to 900nm and higher than 900nm and convert them into electrical energy. The first and second anti-reflective coatings are made of titanium dioxide and aluminum oxide, respectively, and have thicknesses between 45 to 75nm and 65 to 110nm, respectively. The refractive index of the optical adhesive layer and the protective glass are, respectively, between 1.52 and 1.58 and between 1.46 and 1.54. The tantalum silicon oxide anti-reflective laminating layers includes a first tantalum silicon oxide laminating layer and a second tantalum silicon oxide laminating layer. The thickness of the tantalum silicon oxide anti-reflective laminating layer is less than 750nm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:多接面太陽能電池</p>
        <p type="p">11:第一太陽能電池單元</p>
        <p type="p">11A:第一上表面</p>
        <p type="p">11B:第一下表面</p>
        <p type="p">13:第二太陽能電池單元</p>
        <p type="p">13B:第二下表面</p>
        <p type="p">15:第三太陽能電池單元</p>
        <p type="p">21:第一穿隧接面</p>
        <p type="p">23:第二穿隧接面</p>
        <p type="p">31:第一抗反射鍍層</p>
        <p type="p">33:第二抗反射鍍層</p>
        <p type="p">40:光學膠層</p>
        <p type="p">50:保護玻璃</p>
        <p type="p">60:鉭矽氧化物抗反射疊層</p>
        <p type="p">61:第一鉭矽氧化物堆疊層</p>
        <p type="p">63:第二鉭矽氧化物堆疊層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="558" publication-number="202625646">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625646</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148257</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示器</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250307B">H10H29/80</main-classification>
        <further-classification edition="202501120250307B">H10H29/855</further-classification>
        <further-classification edition="202501120250307B">H10H29/856</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝嘉定</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHIA-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃子芩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TZU-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉展睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHAN-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種顯示器，此顯示器包括基板以及設置於基板上的多個子畫素。每一個子畫素包括發光元件、透光結構以及透光層。發光元件設置於基板的平面上，並且電性連接至基板。透光結構設置於基板的平面上，並且鄰設於發光元件。透光結構包括面對發光元件的側壁，而側壁與基板的平面之間的距離沿著遠離發光元件的方向遞增。發光元件用以朝向透光結構的側壁發出光線。透光層設置於透光結構上，並且覆蓋發光元件以及透光結構的側壁。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device which includes a substrate and a plurality of sub-pixels disposed on the substrate. Each subs-pixel includes a light-emitting component, a light-transmitting structure and a light-transmitting layer. The light-emitting component is disposed on a plane of the substrate and electrically connected to the substrate. The light-transmitting structure is disposed on the plane of the substrate and adjacent to the light-emitting component. The light-transmitting structure includes a side wall facing to the light-emitting component, while a distance between the side wall and the plane of the substrate increases along with the direction away from the light-emitting component. The light-emitting component is used to emit the light ray toward the side wall of the light-transmitting structure. The light-transmitting layer is disposed on the light-transmitting structure and covers the light-emitting component and the side wall of the light-transmitting structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:基板</p>
        <p type="p">110s:平面</p>
        <p type="p">120:子畫素</p>
        <p type="p">121,123,125:條狀透光結構</p>
        <p type="p">122:發光元件</p>
        <p type="p">122t:頂表面</p>
        <p type="p">124:透光結構</p>
        <p type="p">121a,123a,124a,125a:第一側壁</p>
        <p type="p">124b:第二側壁</p>
        <p type="p">126:透光層</p>
        <p type="p">127:畫素分隔層</p>
        <p type="p">128:波長轉換層</p>
        <p type="p">129:接合層</p>
        <p type="p">130:覆蓋層</p>
        <p type="p">C1:線路層</p>
        <p type="p">D1:方向</p>
        <p type="p">E1,E2:電極</p>
        <p type="p">h1:高度</p>
        <p type="p">L1:光線</p>
        <p type="p">p1,p2,p3:間距</p>
        <p type="p">w1:寬度</p>
        <p type="p">α:夾角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="559" publication-number="202624044">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624044</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148259</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可投放動態變化光影圖像的投影模組</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250416B">B60Q1/00</main-classification>
        <further-classification edition="200601120250416B">F21S10/00</further-classification>
        <further-classification edition="200601120250416B">G03B21/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏裕汽車股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON YU AUTO-PARTS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭瑩燈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童沈源</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃建富</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可投放動態變化光影圖像的投影模組，包括有一投影裝置和一光源控制器；該投影裝置可將多個不同光影圖像同時投放在一目標區域，以產生錯位或互補的光影圖像；該光源控制器用於控制光源，並經由時間差的控制，而形成非同步的光源明暗變化，進而使投射在目標區域上的光影圖像，產生連續動態變化的視覺效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:投影裝置</p>
        <p type="p">11:第一投影單元</p>
        <p type="p">111:投影筒</p>
        <p type="p">112:透鏡組</p>
        <p type="p">113:微縮圖像透光片</p>
        <p type="p">12:第二投影單元</p>
        <p type="p">121:投影筒</p>
        <p type="p">122:透鏡組</p>
        <p type="p">123:微縮圖像透光片</p>
        <p type="p">13:基板單元</p>
        <p type="p">13a:第一基板</p>
        <p type="p">13b:第二基板</p>
        <p type="p">131:發光元件</p>
        <p type="p">132:發光元件</p>
        <p type="p">20:光源控制器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="560" publication-number="202624863">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624863</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148261</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>背光模組及顯示裝置</chinese-title>
        <english-title>BACKLIGHT MODULE AND DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250327B">G02F1/13357</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝志良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHIH-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種背光模組，包含背框、光學板材、光源及緩衝件。背框包含底板及連接底板的側牆。光學板材設置於背框中，且具有入光側、連接入光側的第一側及面對底板的底面。光源設置於背框中並位於入光側。緩衝件設置於背框與光學板材之間，且包含底部、第一壁及第二壁。底部位於底板與底面之間。第一壁連接底部，且位於側牆與入光側之間。第二壁連接底部及第一壁，且位於側牆與第一側之間。入光側及第一側分別具有凹陷，第一壁及第二壁分別包含對應入光側及第一側的凹陷的凸出部，且凸出部面對凹陷的表面為弧面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A backlight module includes a back frame, an optical plate, a light source and a buffer element. The back frame includes a base and a side walls connected to the base. The optical plate is disposed in the back frame and has a light incident side, a first side connected to the light incident side, and a bottom surface facing the base. The light source is disposed in the back frame and located at the light incident side. The buffer element is disposed between the back frame and the optical plate, and includes a bottom, a first wall and a second wall. The bottom is located between the base and the bottom surface. The first wall is connected to the bottom and is located between the side wall and the light incident side. The second wall is connected to the bottom and the first wall and is located between the side wall and the first side. The light incident side and the first side respectively have recesses, the first wall and the second wall respectively include protrusions corresponding to the recesses of the light incident side and the first side, and the surfaces of the protrusions facing the recesses are arc surfaces.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:背框</p>
        <p type="p">102b:底板</p>
        <p type="p">102w:側牆</p>
        <p type="p">104:光學板材</p>
        <p type="p">106A:第一緩衝件</p>
        <p type="p">108:光源</p>
        <p type="p">108e:發光元件</p>
        <p type="p">108b:擋塊</p>
        <p type="p">B1:第一底部</p>
        <p type="p">ES:入光側</p>
        <p type="p">P1:第一凸出部</p>
        <p type="p">P2:第二凸出部</p>
        <p type="p">R1:第一凹陷</p>
        <p type="p">R2:第二凹陷</p>
        <p type="p">S1:第一側</p>
        <p type="p">W1:第一壁</p>
        <p type="p">W2:第二壁</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="561" publication-number="202625297">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625297</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148268</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120250307B">H01Q5/25</main-classification>
        <further-classification edition="200601120250307B">H01Q1/48</further-classification>
        <further-classification edition="200601120250307B">H01Q1/36</further-classification>
        <further-classification edition="200601120250307B">H01Q1/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和碩聯合科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEGATRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖志威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊皓翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, HAO-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳朝旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHAO-HSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃士耿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHIH-KENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許勝欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, SHENG-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置包括天線模組及金屬機殼。天線模組設置於金屬機殼內，並適以共振出一頻段。天線模組包括絕緣基板、兩貼片天線、接地面及兩接地延伸段。絕緣基板包括第一面及第二面。兩貼片天線設置於第一面，兩貼片天線沿著第一方向並排且間隔設置。兩貼片天線的每一者包括沿著第一方向延伸的中心軸線、饋入端及中心點，饋入端位於中心軸線上且偏離於中心點，兩貼片天線的其中一者的中心點與另一者的中心點之間的距離小於等於頻段的0.5倍波長。接地面設置於第二面。兩接地延伸段連接於接地面。兩接地延伸段的其中一者延伸至金屬機殼的側殼。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device includes an antenna module and a metal casing. The antenna module is arranged in the metal casing and is adapted to resonate at a frequency band. The antenna module includes an insulating base plate, two patch antennas, a grounding surface and two grounding extension segments. The insulating base plate includes a first surface and a second surface which are relative to each other. The two patch antennas are disposed on the first surface. The two patch antennas are arranged side by side and spaced apart along a first direction. Each of the two patch antennas includes a central axis which is extended along the first direction, a feeding end and a center point. The feeding end is located at the central axis and deviated from the center point. A distance between the center point of one of the two patch antennas and the center point of another of the two patch antennas is minus and equal to the half of a wavelength of the frequency band. The grounding surface is disposed on the second surface. The two grounding extension segments are connected to the grounding surface. One of the two grounding extension segments is extended to a side casing of the metal casing.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:超寬頻晶片</p>
        <p type="p">110:天線模組</p>
        <p type="p">111:絕緣基板</p>
        <p type="p">1111:第一面</p>
        <p type="p">1112:第二面</p>
        <p type="p">113:貼片天線</p>
        <p type="p">115:接地面</p>
        <p type="p">117:接地延伸段</p>
        <p type="p">120:金屬機殼</p>
        <p type="p">121:側殼</p>
        <p type="p">123:底殼</p>
        <p type="p">130:電子組件</p>
        <p type="p">131:絕緣外殼</p>
        <p type="p">1311:上表面</p>
        <p type="p">140:非金屬件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="562" publication-number="202625495">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625495</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148269</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無線存取點及其重啟方法</chinese-title>
        <english-title>WIRELESS ACCESS POINT AND REBOOT METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120250303B">H04W88/08</main-classification>
        <further-classification edition="200901120250303B">H04W24/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華碩電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASUSTEK COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳卓然</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHO-JAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧天隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAN, TEN-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈長毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, CHANG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宗仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TSUNG-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種無線存取點及其重啟方法。無線存取點具有系統。系統具有記錄檔案。記錄檔案包括關機時點以及多個暖重啟條件。重啟方法包括：在無線存取點因重啟原因而重啟後，基於網路時間協定執行時間同步操作以取得當前時點，並根據關機時點及當前時點計算出重啟消耗時間；判斷重啟消耗時間是否小於預設消耗時間；當重啟消耗時間不小於預設消耗時間，則執行重新定位操作；當重啟消耗時間小於預設消耗時間，則判斷重啟原因是否為多個暖重啟條件之一；以及若重啟原因為暖重啟條件，則不執行重新定位操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wireless access point and a reboot method thereof are provided. The wireless access point includes a log with a shutdown time point and warm reboot conditions. The reboot method includes: after the wireless access point reboots due to a reboot reason, performing a time synchronization operation based on a network time protocol to obtain a current time point, and calculating a reboot consuming time according to the shutdown time point and the current time point; determining whether the reboot consuming time is less than a preset consuming time; when the reboot consuming time is not less than the preset consuming time, performing a relocation operation; when the reboot consuming time is less than the preset consuming time, determining whether the reboot reason is one of the warm reboot conditions; and when the reboot reason is one of the plurality of warm reboot conditions, not performing the relocation operation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S401、S402、S403、S404、S405:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="563" publication-number="202625209">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625209</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148270</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>圖像清洗方法、電子設備及儲存介質</chinese-title>
        <english-title>METHOD FOR CLEANING IMAGES, ELECTRONIC DEVICE, AND STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250701B">G16H30/40</main-classification>
        <further-classification edition="200601120250701B">G06T5/50</further-classification>
        <further-classification edition="200601120250701B">A61B3/12</further-classification>
        <further-classification edition="200601120250701B">A61B3/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>疆域醫創科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANGYU INNOVATIVE MEDICAL TECHNOLOGY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇映璇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, YING-XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種圖像清洗方法、電子設備及儲存介質。所述方法包括：獲取多張眼底圖像；識別所述多張眼底圖像中的非目標圖像；從所述多張眼底圖像中刪除所述非目標圖像，獲得目標圖像，其中所述目標圖像包括彩色眼底圖。利用上述方法，能夠刪除眼底圖像中除了目標圖像之外的其他類型的圖像，從而能夠消除對目標圖像中的異常眼底圖的識別干擾。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides a method for cleaning images, an electronic device, and a storage medium. The method includes: acquiring a plurality of fundus images, identifying non-target images in the plurality of fundus images; obtaining target images by deleting the non-target images from the plurality of fundus images, the target images including color fundus images. By utilizing the present application, other types of images, which are different from the target images in the fundus image, can be deleted, so that the so that the recognition interference of abnormal fundus images in the target image can be eliminated.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S11~S13:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="564" publication-number="202625142">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625142</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148272</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示驅動方法以及顯示裝置</chinese-title>
        <english-title>DRIVING METHOD OF DISPLAY AND DISPLAY APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120250328B">G09G3/3208</main-classification>
        <further-classification edition="200601120250328B">G09G3/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳天德鈺科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JADARD TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳芝婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁　漢源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEO, HON-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及一種顯示驅動方法以及顯示裝置。該方法包括：計算顯示圖像中每條資料線的平均亮度及其對應的平均亮度差值；判斷資料線的平均亮度差值是否大於預設閾值；在資料線的平均亮度差值大於預設閾值時，設定資料線作為目標資料線，並提取與目標資料線相鄰的多條資料線作為輔助資料線；目標資料線和輔助資料線共同作為補償資料線；計算每條補償資料線對應的補償參數；計算每條補償資料線對應的微調參數；根據每條資料線的原始亮度值、對應的補償參數以及對應的微調參數計算補償資料線的輸出亮度值，並將輸出亮度值提供給資料驅動電路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a driving method of a display and a display apparatus. The method includes: calculating an average brightness of each data line in a display image and an average brightness difference, determining whether the average brightness difference is larger than a predefined threshold value; when the average brightness difference is larger than the predefined threshold value, setting the data line as a target data line and extracting a plurality of data lines adjacent to the target data line as assistance data lines; wherein the target data line and the assistance data lines serve as compensating data lines; calculating compensating parameters of each of the compensating data lines; calculating fine tuning parameters of each of the compensating data lines; calculating an output brightness of each of the compensating data lines based on an original brightness, the corresponding compensating parameter, and the corresponding fine tuning parameter and outputting the calculated output brightness of each of the compensating data lines to a data driving circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S51~S56:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="565" publication-number="202625557">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625557</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148281</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260223B">H10B41/30</main-classification>
        <further-classification edition="202601120260223B">H10W20/00</further-classification>
        <further-classification edition="202601120260223B">H10P14/69</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華邦電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINBOND ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余秉隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, PING-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵柏竣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAO, PO-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供半導體裝置及其形成方法。半導體裝置的形成方法包括提供基底。形成溝槽於基底中。對基底執行植入製程，以形成第一阻障層於溝槽的側表面上。形成第二阻障層於第一阻障層上且於溝槽的底表面上。形成晶種層於第二阻障層上。形成導電柱於晶種層上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device and a method of forming the same are provided. The method of forming the semiconductor device includes providing a base. A trench is formed in the base. An implantation process is performed on the base to form a first barrier layer on a side surface of the trench. A second barrier layer is formed on the first barrier layer and on a bottom surface of the trench. A seed layer is formed on the second barrier layer. A conductive pillar is formed on the seed layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體裝置</p>
        <p type="p">100:基底</p>
        <p type="p">100T,110T:頂表面</p>
        <p type="p">110:導電結構</p>
        <p type="p">130:溝槽</p>
        <p type="p">200:第一阻障層</p>
        <p type="p">200S,300S:側表面</p>
        <p type="p">300:第二阻障層</p>
        <p type="p">400:晶種層</p>
        <p type="p">510:導電柱</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="566" publication-number="202623888">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623888</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148285</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>次微米級散氣膜及應用其之散氣管及散氣盤</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250701B">B01F23/231</main-classification>
        <further-classification edition="202301120250701B">C02F3/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菁泉科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALPSPRING INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周錦志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, CHIN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾雨廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, YU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張翔諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HSIANG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅芳研</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, FANG YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種次微米級散氣膜，具備：塗佈層，具有孔徑為0.10μm~0.20μm的微孔，孔隙率為70%~80%；及支撐層，具有平均孔徑為5.0~10.0μm的孔洞，該塗佈層係形成於該支撐層的表面；其中，該塗佈層係包含高分子化合物，該高分子化合物係選自由PC、PVDF、PSF、PES、PVP及PVC所組成之群組。藉由本發明之次微米級散氣膜，可大幅提高溶氧量及傳氧效率，同時降低安裝成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:次微米級散氣膜</p>
        <p type="p">11:塗佈層</p>
        <p type="p">12:支撐層</p>
        <p type="p">111:微孔</p>
        <p type="p">112:通道</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="567" publication-number="202624490">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624490</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148287</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>扭脫甲基桿菌及使用其之乳酸生產方法</chinese-title>
        <english-title>METHYLOBACTERIUM EXTORQUENS AND METHOD FOR PRODUCING LACTIC ACID USING SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">C12P7/56</main-classification>
        <further-classification edition="200601120250501B">C12P1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣中油股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CPC CORPORATION, TAIWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李信毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HSIN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳勁中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIN-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭　宜錚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAN, ETHAN I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宥安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YOU AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪嘉彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, BILLY C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李語婕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YU CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種扭脫甲基桿菌及使用其生產乳酸之乳酸生產方法。該扭脫甲基桿菌能夠發酵甲醇來生產乳酸。該乳酸生產方法包含下列步驟：(a) 提供一扭脫甲基桿菌，其能夠發酵甲醇以生產乳酸，該扭脫甲基桿菌寄存於日本獨立行政法人製品評價技術基盤機構，寄存編號為NITE BP-04142； (b) 將該扭脫甲基桿菌接種於甲醇培養基中，該甲醇培養基中含有濃度低於2%(v/v)的甲醇，該甲醇培養基的碳/氮比值在3.5至21之間且pH值在pH 6至pH 9之間；及 (c) 使該扭脫甲基桿菌利用該甲醇培養基中的甲醇在20℃至30℃環境下進行發酵，藉此產生乳酸。藉由如上所述之扭脫甲基桿菌及乳酸生產方法，可以提供一種可以非糧食作物原料來生產乳酸的乳酸生產方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides        &lt;i&gt;Methylobacterium extorquens&lt;/i&gt;and a method for producing lactic acid using the same. The        &lt;i&gt;Methylobacterium extorquens&lt;/i&gt;is capable of fermenting methanol to produce lactic acid. The lactic acid production method comprises the following steps: (a) providing        &lt;i&gt;Methylobacterium extorquens&lt;/i&gt;that can ferment methanol to produce lactic acid, wherein the bacteria is deposited at the Japan National Institute of Technology and Evaluation (NITE) with the accession number NITE BP-04142; (b) inoculating the        &lt;i&gt;Methylobacterium extorquens&lt;/i&gt;into a methanol culture medium containing methanol at a concentration of below 2%(v/v), the methanol culture medium has a C/N ratio value of 3.5 to 21 and a pH value of pH 6 to pH 9; and (c) allowing the        &lt;i&gt;Methylobacterium extorquens&lt;/i&gt;to ferment the methanol in the methanol culture medium to produce lactic acid under 20°C to 30°C. Through the aforementioned        &lt;i&gt;Methylobacterium extorquens&lt;/i&gt;and lactic acid production method, a method for producing lactic acid using non-crop materials is provided.      </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="568" publication-number="202624118">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624118</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148288</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>超級電容碳材的製造方法</chinese-title>
        <english-title>METHOD FOR MANUFACTURING SUPERCAPACITOR CARBON MATERIAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120250114B">C01B32/312</main-classification>
        <further-classification edition="201701120250114B">C01B32/342</further-classification>
        <further-classification edition="201301120250114B">H01G11/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣中油股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CPC CORPORATION, TAIWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YAN-SHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高鈺婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, YU TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種超級電容碳材的製造方法，其係包含：步驟(A)，將重質油經過第一熱處理，以形成軟碳前驅結構物，該軟碳前驅結構物的介相結構比例大於50%，喹啉不溶物值(QI值)為95%~98%之間，且甲苯不溶物質(TI值)為89%~91%之間；步驟(B)，將該軟碳前驅結構物進行研磨分級，之後將其與活化劑及鈍化劑混合，以形成混合物；步驟(C)，對該混合物進行活化及碳化處理，以形成碳化組分，該碳化組分包括殘留的活化劑和鈍化劑；步驟(D)，對該碳化組分進行水洗處理，以去除殘留的活化劑，並以乙醇去除殘留的鈍化劑，再進行酸洗與水洗至中性，之後在90℃下烘乾至少16小時，以獲得活性碳材；步驟(E)，對該活性碳材進行第二熱處理，以形成超級電容碳材。藉由本發明的方法，能夠將容易引火性的鹼金屬鈍化成安全的碳酸鉀，進而提升製備超級電容碳材時的安全性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for manufacturing a supercapacitor carbon material includes: step (A), allowing heavy oil to be subjected to a first heat treatment to form a soft carbon precursor structure, a mesophase structure ratio of the soft carbon precursor structure is greater than 50%, a quinoline insoluble matter value (QI value) is between 95% and 98%, and a toluene insoluble matter value (TI value) is between 89% and 91%; step (B), grinding and classifying the soft carbon precursor structure, and then mixing it with an activator and a passivator to form a mixture; step (C) activating and carbonizing the mixture to form a carbonized component, the carbonized component comprising the residual activator and passivator; step (D), washing the carbonized component with water to remove the residual activator, and removing the residual passivator with ethanol, and then pickling and washing with water to neutral, and then drying at 90℃ for at least 16 hours to obtain an activated carbon material; step (E), allowing the activated carbon material to be subjected to a second heat treatment to form a supercapacitor carbon material. Through the method of the present disclosure, the alkali metal that is easily flammable can be passivated into safe potassium carbonate, and then the safety of the preparation of supercapacitor carbon material can be improved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">A~E:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="569" publication-number="202625268">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625268</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148301</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>提升鋰離子電池安全性的方法</chinese-title>
        <english-title>METHOD FOR IMPROVING SAFETY OF LITHIUM-ION BATTERIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120250117B">H01M4/583</main-classification>
        <further-classification edition="200601120250117B">H01M4/04</further-classification>
        <further-classification edition="201001120250117B">H01M10/0525</further-classification>
        <further-classification edition="201701120250117B">C01B32/05</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣中油股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CPC CORPORATION, TAIWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YAN-SHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種提升鋰離子電池安全性的方法，其係包含：步驟(A)，將重質油加熱使其成為生焦；步驟(B)，以3˚C/min至5˚C/min的第一升溫速率加熱該生焦至850˚C至900˚C持溫至少4小時，使其成為含碳材料；步驟(C)，研磨該含碳材料，並自經研磨後的該含碳材料中分級並取出D        &lt;sub&gt;50&lt;/sub&gt;介於8μm至12μm間且D        &lt;sub&gt;10&lt;/sub&gt;介於1μm至8μm的含碳粉末；步驟(D)，以3˚C/min至10˚C/min的第二升溫速率加熱該含碳粉末至1030˚C至1220˚C持溫至少4小時，使其成為碳材粉末；步驟(E)，於該碳材粉末中添加占該碳材粉末至少4重量%的瀝青後，以0.90˚C/min至1.25˚C/min的第三升溫速率加熱添加有瀝青的該碳材粉末至1030˚C至1220˚C持溫至少5小時，使其成為經瀝青修飾的軟碳；及步驟(F)，於石墨中添加該軟碳以作為第一型負極材料，且該軟碳與該石墨之重量比為1：1~39。藉由本發明的方法，能夠降低鋰離子電池熱失控的發生機率，進而提升鋰離子電池使用時的安全性。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for improving safety of lithium-ion batteries includes: step (A) heating heavy oil to make it into a green coke; step (B) heating the green coke to 850℃ to 900℃ for at least 4 hours at a first heating rate of 3℃/min to 5℃/min to make it into a carbon-containing material; step (C) grinding the carbon-containing material, classifying the carbon-containing material after grinding, and taking out a carbon-containing powder with D        &lt;sub&gt;50&lt;/sub&gt;between 8 μm and 12 μm and D        &lt;sub&gt;10&lt;/sub&gt;between 1 μm and 8 μm; step (D) heating the carbon-containing powder to 1030℃ to 1220℃ for at least 4 hours at a second heating rate of 3℃/min to 10℃/min to make it into a carbon material powder; step (E) after adding pitch accounting for at least 4 wt% of the carbon material powder to the carbon material powder, heating the carbon material powder added with pitch to 1030℃ to 1220℃ for at least 5 hours at a third heating rate of 0.90℃/min to 1.25℃/min, so as to make it into soft carbon modified by pitch; and step (F) adding the soft carbon to graphite as a first type anode material, and a weight ratio of the soft carbon to the graphite is 1:1-39. The method of the present disclosure can reduce the probability of thermal runaway of lithium-ion battery, thus improving the safety of lithium-ion battery during use.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">A~F:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="570" publication-number="202624874">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624874</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148306</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>投影機以及投影機的溫度控制方法</chinese-title>
        <english-title>PROJECTOR AND CONTROL METHOD OF PROJECTOR TEMPERATURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250122B">G03B21/16</main-classification>
        <further-classification edition="200601120250122B">G05D23/19</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中強光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORETRONIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林秋君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, QIU-JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃耀磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YAO-LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王福山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, FU-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種投影機以及透過投影機執行的投影機的溫度控制方法。投影機包括至少一熱源、熱電致冷晶片、驅動電路以及微控制器。至少一熱源適於在第一模式中運作，並在第二模式中關閉。熱電致冷晶片具有第一端部以及第二端部。驅動電路耦接第一端部，並適於驅動熱電致冷晶片。微控制器根據對應於第一模式的第一模式指令，控制驅動電路運作於第一工作模式，將第二端部作為冷端，以對至少一熱源冷卻。微控制器根據對應於第二模式的第二模式指令，控制驅動電路運作於第二工作模式，將第二端部作為熱端而升溫。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure provides a projector and a control method of projector temperature performed by the projector. The projector includes at least one heat source, a TEC chip, a driving circuit and a microcontroller. The at least one heat source is adapted to operate in a first mode and to be turned off in a second mode. The TEC chip has a first end portion and a second end portion. The driving circuit is coupled to the first end portion and is adapted to drive the TEC chip. The microcontroller controls the driving circuit to operate in a first working mode according to the first mode command corresponding to the first mode, the second end portion serves as a cold surface to cool down the at least one heat source. The microcontroller controls the driving circuit to operate in a second working mode according to the second mode command corresponding to the second mode, the second end portion serves as the hot surface and rises in temperature.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:投影機</p>
        <p type="p">10:熱源</p>
        <p type="p">20:微控制器</p>
        <p type="p">30:驅動電路</p>
        <p type="p">40:熱電致冷晶片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="571" publication-number="202624095">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624095</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148308</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>支援拖板車與自動引導車取放貨物之設備及方法</chinese-title>
        <english-title>EQUIPMENT AND METHODS TO SUPPORT THE PICK-UP AND UNLOADING OF GOODS BY TRAILERS AND AUTOMATED GUIDED VEHICLES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250317B">B65G1/10</main-classification>
        <further-classification edition="200601120250317B">B65G43/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永聯物流開發股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALLY LOGISTIC PROPERTY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張建泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIEN-TAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉佩佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, PEI-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林楷倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KAI-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭禹辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, YU-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王祺澔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHI-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請為一種設備，其包含有一入庫區、一貨物偵測裝置、一貨物升降裝置、一貨物移動裝置及一出庫區。入庫區具有一入庫位置與一預設位置；貨物偵測裝置設置於入庫區，用於偵測入庫位置的貨物；貨物升降裝置設置於入庫區，當貨物位於入庫位置時，貨物升降裝置將貨物由入庫位置升高至預設位置；貨物移動裝置相鄰於貨物升降裝置，當貨物位於預設位置時，貨物移動裝置承接位於預設位置的貨物，並沿一入庫方向輸出貨物；出庫區相鄰於入庫區，出庫區接收貨物，並將貨物輸出予自動引導車。藉此，有效支援拖板車與自動引導車取放貨物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A equipment comprises an inbound area, a cargo detection device, a cargo lifting device, a cargo moving device and an outbound area. The inbound area has a inbound position and a preset position; The cargo detection device is arranged in the inbound area and is used for detecting the goods in the inbound position; The cargo lifting device is arranged in the inbound area, and when the goods are located in the inbound position, the cargo lifting device raises the goods from the inbound position to the preset position; The cargo moving device is adjacent to the cargo lifting device, and when the cargo is at a preset position, the cargo moving device undertakes the goods that are located at the preset position, and outputs the goods along an inbound direction; The outbound area is adjacent to the inbound area, and the outbound area receives the goods and exports the goods to the automated guided vehicles. Thus, it effectively supports the picking and unloading of goods by trailers and automated guided vehicles.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:設備</p>
        <p type="p">2:支撐架</p>
        <p type="p">10:貨物偵測裝置</p>
        <p type="p">20:貨物升降裝置</p>
        <p type="p">30:貨物移動裝置</p>
        <p type="p">40:棧板檢測裝置</p>
        <p type="p">50:監控裝置</p>
        <p type="p">60:機具偵測裝置</p>
        <p type="p">72:抵靠部</p>
        <p type="p">80:重量檢測裝置</p>
        <p type="p">90:體積檢測裝置</p>
        <p type="p">D:異物檢測裝置</p>
        <p type="p">IA:入庫區</p>
        <p type="p">OA:出庫區</p>
        <p type="p">S:攝像裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="572" publication-number="202624580">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624580</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148309</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>精練劑、精練液、與精練染色方法</chinese-title>
        <english-title>SCOURING AGENT, SCOURING LIQUID, AND METHOD OF SCOURING AND DYEING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250121B">D01C3/00</main-classification>
        <further-classification edition="200601120250121B">D01B3/04</further-classification>
        <further-classification edition="200601120250121B">D06P1/06</further-classification>
        <further-classification edition="200601120250121B">D06M13/00</further-classification>
        <further-classification edition="200601120250121B">D06M13/175</further-classification>
        <further-classification edition="200601120250121B">D06P3/06</further-classification>
        <further-classification edition="200601120250121B">D06P3/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃魁彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, KUEI-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖苡君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, YI-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉瑞珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, JUI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇稚琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, CHIH-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張昌榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHANG-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張芬梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, FEN-MEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">精練劑係由脂肪醇聚氧乙烯醚與磺基琥珀酸進行酯化反應而成，其中脂肪醇聚氧乙烯醚的化學式為R        &lt;sup&gt;1&lt;/sup&gt;O(CH        &lt;sub&gt;2&lt;/sub&gt;CH        &lt;sub&gt;2&lt;/sub&gt;O)        &lt;sub&gt;n&lt;/sub&gt;H，R        &lt;sup&gt;1&lt;/sup&gt;為C        &lt;sub&gt;6-20&lt;/sub&gt;的脂肪族，且n為5至15，以及磺基琥珀酸的化學結構為        &lt;img align="absmiddle" height="142px" width="237px" file="ed10015.JPG" alt="ed10015.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。採用上述精練劑，可在同一槽中精練染色織物。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A scouring agent is formed by performing an esterification of fatty alcohol polyoxyethylene ether and 2-sulfobutanedioic acid. The fatty alcohol polyoxyethylene ether has a chemical formula of R        &lt;sup&gt;1&lt;/sup&gt;O(CH        &lt;sub&gt;2&lt;/sub&gt;CH        &lt;sub&gt;2&lt;/sub&gt;O)        &lt;sub&gt;n&lt;/sub&gt;H, R        &lt;sup&gt;1&lt;/sup&gt;is C        &lt;sub&gt;6-20&lt;/sub&gt;aliphatic group, and n is 5 to 15. The 2-sulfobutanedioic acid has a chemical structure of        &lt;img align="absmiddle" height="143px" width="229px" file="ed10016.JPG" alt="ed10016.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;. The scouring agent can be used to scour and dye a fabric in a same tank.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="573" publication-number="202624959">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624959</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148314</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基本輸入輸出系統的控制系統及方法以及擴充卡</chinese-title>
        <english-title>CONTROL SYSTEM AND METHOD OF BASIC INPUT/OUTPUT SYSTEM AND EXPANSION CARD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">G06F11/22</main-classification>
        <further-classification edition="200601120250102B">G06F13/38</further-classification>
        <further-classification edition="200601120250102B">G06F13/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>技嘉科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIGA-BYTE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宗達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, TSUNG TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許書瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, SHU-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林台立</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TAI LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基本輸入輸出系統的控制系統及方法以及擴充卡。基本輸入輸出系統的控制方法包括以處理裝置執行：取得對應於基本輸入輸出系統的操作指令，當判斷操作指令對應於基本輸入輸出系統的多個可存取參數中的目標參數時，依據基本輸入輸出系統的指令格式對操作指令進行轉換以產生目標指令，以及提供目標指令至基本輸入輸出系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a control system and method of basic input/output system and expansion card. The control system of basic input/output system, performed by a processing device, includes: obtaining a setting command corresponding to the basic input/output system, converting the setting command into a target command according to a command format of the basic input/output system when the setting command corresponds to a target parameter of accessible parameters of the basic input/output system, and providing the target command to the basic input/output system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101,S103,S105,S107:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="574" publication-number="202625682">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625682</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148318</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體元件及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260316B">H10P14/40</main-classification>
        <further-classification edition="202601120260316B">H10P30/00</further-classification>
        <further-classification edition="202601120260316B">H10P95/90</further-classification>
        <further-classification edition="202501120260316B">H10D64/01</further-classification>
        <further-classification edition="202501120260316B">H10D64/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>積亞半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PROASIA SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉蔭桓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, YIN-HUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林義傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉彥宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁國隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體元件之形成方法，包括以下步驟：提供半導體基底；於半導體基底上形成閘極氧化層；於閘極氧化層上形成閘極結構；針對閘極結構執行離子植入製程，以於閘極結構內形成離子分佈區域；針對閘極結構執行熱氧化製程，以於閘極結構形成表面氧化層，其中藉由離子分佈區域改善表面氧化層形成後閘極結構之側壁表面之輪廓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a method for forming a semiconductor device, which includes the following steps: providing a semiconductor substrate; forming a gate oxide layer on the semiconductor substrate; forming a gate structure on the gate oxide layer; performing an ion implantation process to form an ion distribution area in the gate structure; and performing a thermal oxidation process to form a surface oxide layer on the gate structure. A profile of the sidewall surface of the gate structure after the surface oxide layer is formed is improved through the ion distribution area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S5:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="575" publication-number="202625196">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625196</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148323</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於記憶體裝置的測試方法</chinese-title>
        <english-title>TESTING METHOD FOR MEMORY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241218B">G11C29/44</main-classification>
        <further-classification edition="200601120241218B">G11C29/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>力晶積成電子製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧才科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TENG, TSAI-KO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳佳燕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIA-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於記憶體裝置的測試方法。記憶體裝置包括記憶體陣列以及解碼器電路。解碼器電路依據第一參考電壓來運行。記憶體陣列依據第二參考電壓來運行。測試方法包括：將記憶體陣列區分為多個記憶體區塊；調整第一參考電壓以及第二參考電壓的至少其中之一的電壓值以依序對所述多個記憶體區塊進行存取操作，並接收所述多個記憶體區塊在存取操作後的多個錯誤位元計數（failed bit count，FBC）；以及統計對應於第一參考電壓及/或第二參考電壓的多個不同電壓值以及所述多個FBC的多個記憶體區塊數量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A testing method for a memory device are provided. The memory device includes a memory array and a decoder circuit. The decoder circuit operates based on a first reference voltage. The memory array operates based on a second reference voltage. The testing method includes: dividing the memory array into memory blocks; adjusting a voltage value of at least one of the first reference voltage and the second reference voltage to sequentially access the memory blocks and receiving failed bit counts (FBCs) of the memory blocks after access operations; and counting number of memory blocks corresponding to different voltage values of the first reference voltage and/or the second reference voltage and the FBCs.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100:測試方法</p>
        <p type="p">S110~S130:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="576" publication-number="202625547">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625547</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148326</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體元件及其製作方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260302B">H10B12/00</main-classification>
        <further-classification edition="202601120260302B">H10W72/50</further-classification>
        <further-classification edition="202601120260302B">H10P52/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡登傳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, TENG-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鉅富</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHU-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳春宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林川嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUAN-LAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凃巧慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, CHIAO-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種製作半導體元件的方法，其主要先將一第一晶圓接合至一載體，然後對該第一晶圓背面進行第一研磨製程，對第一晶圓側壁進行一第一修整製程，形成第一保護層於第一晶圓側壁，形成第一接觸墊於第一晶圓背面，將一第二晶圓接合至第一晶圓，對第二晶圓背面進行第二研磨製程，對第二晶圓側壁進行第二修整製程，形成第二保護層於第一晶圓側壁以及第二晶圓側壁，再形成一第二接觸墊於第二晶圓背面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for fabricating semiconductor device includes first bonding a first wafer to a carrier, performing a first grinding process on a backside of the first wafer, performing a first trimming process on a sidewall of the first wafer, forming a first protective layer on the sidewall of the first wafer, forming a first bonding pad on the backside of the first wafer, bonding a second wafer to the first bonding pad, performing a second grinding process on a backside of the second wafer, performing a second trimming process on a sidewall of the second wafer, forming a second protective layer on the sidewalls of the first wafer and the second wafer, and forming a second bonding pad on the backside of the second wafer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">12:第一晶圓</p>
        <p type="p">16:基底</p>
        <p type="p">18:金屬間介電層</p>
        <p type="p">20:金屬內連線</p>
        <p type="p">22:矽穿導孔</p>
        <p type="p">26:接觸墊</p>
        <p type="p">28:介電層</p>
        <p type="p">30:金屬內連線</p>
        <p type="p">32:第二晶圓</p>
        <p type="p">42:第三晶圓</p>
        <p type="p">44:保護層</p>
        <p type="p">52:第四晶圓</p>
        <p type="p">62:第五晶圓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="577" publication-number="202624053">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624053</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148333</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>怠速起停系統之發電控制方法</chinese-title>
        <english-title>POWER GENERATION CONTROL METHOD FOR IDLE STOP-START SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250317B">B60W10/06</main-classification>
        <further-classification edition="200601120250317B">F02D41/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三陽工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANYANG MOTOR CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾威婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, WEI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冠賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇建太</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種怠速起停系統之發電控制方法，所述怠速起停系統包括一電池系統、一起動兼發電控制系統、一引擎燃油噴射控制系統以及一具有一曲軸之引擎以及一油門，起動兼發電控制系統包括一起動兼發電控制器及一起動兼發電裝置，起動兼發電控制器分別電連接電池系統及起動兼發電裝置，引擎燃油噴射控制系統接收來自油門之油門訊號並通訊連接起動兼發電控制器，起動兼發電裝置係與曲軸同軸設置，引擎燃油噴射控制系統分別電連接電池系統及引擎。藉此，透過本發明之怠速起停系統之發電控制方法，可有效提升當使用者騎乘中需要動力時，起動兼發電控制系統可以適時提供驅動扭力幫助引擎加速，進而達到整車動力表現提升。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a power generation control method for an idle stop-start system. The idle stop-start system includes a battery system, a starter generator control system, an engine fuel injection control system, an engine with a crankshaft and a throttle. The starter generator control system includes starter generator controller and a starter generator device. The starter generator controller is electrically connected to the battery system and the starter generator device respectively. The engine fuel injection control system is connected to the starter generator controller by communication. The starter generator device is arranged coaxially with the crankshaft, and the engine fuel injection control system is electrically connected to the battery system and the engine respectively. As such, through the power generation control method of the idle stop-start system of the present invention, when the user needs power while riding, starter generator control system can provide driving torque in a timely manner to help the engine accelerate, thereby achieving the overall vehicle power better performance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">A~G2:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="578" publication-number="202625467">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625467</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148343</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於用戶分類之URL導向裝置及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120250303B">H04W8/18</main-classification>
        <further-classification edition="202201120250303B">H04L67/10</further-classification>
        <further-classification edition="202201120250303B">H04L67/50</further-classification>
        <further-classification edition="202201120250303B">H04L67/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣大哥大股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN MOBILE CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>年華亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉韋志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹詠竣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊善美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林發立</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種基於用戶分類之URL導向方法，包括：經由一登入模組，接收關聯於一用戶的資訊，所述用戶註冊於該第一商家的網路系統或該第二商家的網路系統，所述關聯於該用戶的資訊用於識別出該用戶的分類；由一URL導向模組，基於該用戶的分類，從多個預定的功能URL中關聯出一目標功能URL，並將該用戶導向至該目標功能URL；及由一瀏覽器，呈現該目標功能URL。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">200:頁面導向模組</p>
        <p type="p">DB:資料庫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="579" publication-number="202625473">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625473</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148345</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於行動通訊公司擴充基地台設備的判斷方法及系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120250303B">H04W16/18</main-classification>
        <further-classification edition="200901120250303B">H04W48/06</further-classification>
        <further-classification edition="200901120250303B">H04W36/16</further-classification>
        <further-classification edition="200901120250303B">H04W36/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣大哥大股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN MOBILE CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳佳興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃康倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施冠全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林發立</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種用於行動通訊公司擴充基地台設備的判斷方法，包括：持續收集一基地台細胞的PRB使用率；持續收集該基地台細胞的RRC連接UE數量；及基於所述PRB使用率超過一第一閥值，且所述PRC連接UE數量超過一第二閥值，產生一告警通知，指示該基地台細胞呈現高負載狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="580" publication-number="202625131">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625131</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148346</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>透明顯示器</chinese-title>
        <english-title>TRANSPARENT DISPLAY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250327B">G09G3/30</main-classification>
        <further-classification edition="200601120250327B">G02F1/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳佳龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JIA-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡玉堂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YU-TANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田堃正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIEN, KUN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種 透明顯示器包括多個透光區塊、多個橫向走線條、多個縱向走線條與多個驅動電極區塊。驅動電極區塊連接橫向走線條與縱向走線條。橫向走線條、縱向走線條與驅動電極區塊沿著多條橫向參考線與多條縱向參考線而呈網狀分布。橫向走線條、縱向走線條與驅動電極區塊圍繞透光區塊。各個驅動電極區塊具有至少一第一邊緣與至少一第二邊緣。第一邊緣與第二邊緣分別沿著第一直線與第二直線延伸。第一直線與第二直線不平行。第一直線與第二直線任一者不平行橫向參考線與縱向參考線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A transparent display includes a plurality of light-permeable sections, a plurality of horizontal line strips, a plurality of vertical line strips, and a plurality of driving electrode sections. The driving electrode sections are connected to the horizontal line strips and the vertical line strips. The horizontal line strips, the vertical line strips, and the driving electrode sections are arranged in a mesh along a plurality of horizontal auxiliary lines and vertical auxiliary lines. The horizontal line strips, the vertical line strips, and the driving electrode sections surround the light-permeable sections. The driving electrode sections have at least one first edge and at least one second edge apiece. The first and the second edges extend along a first and a second straight line respectively. The first and the second straight lines are not parallel. Neither the first straight line nor the second straight line is parallel to the horizontal and the vertical auxiliary lines.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:透明顯示器</p>
        <p type="p">110:透光區塊</p>
        <p type="p">120:驅動電極區塊</p>
        <p type="p">121:第一邊緣</p>
        <p type="p">122:第二邊緣</p>
        <p type="p">131:橫向走線條</p>
        <p type="p">132:縱向走線條</p>
        <p type="p">L1:橫向參考線</p>
        <p type="p">L2:縱向參考線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="581" publication-number="202624596">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624596</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148352</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>防止混凝土漏水的修繕方法及防止混凝土漏水的結構</chinese-title>
        <english-title>REPAIR METHOD TO PREVENT CONCRETE LEAKAGE AND THE STRUCTURE TO PREVENT CONCRETE LEAKAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250311B">E04B1/62</main-classification>
        <further-classification edition="200601120250311B">E04B1/64</further-classification>
        <further-classification edition="200601120250311B">E04G23/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳奕廣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YI-KUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂政欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHENG-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳奕廣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YI-KUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂政欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHENG-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳天賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是一種防止混凝土漏水的修繕方法及防止混凝土漏水的結構，該方法包含依序執行的負水壓面漏水點定位步驟、正水壓面施工範圍劃定步驟、鑽孔步驟、灌注步驟、以及確認步驟，該結構適用於設在混凝土，該混凝土具有結構層，該結構包含：防水層、保護層、以及防水材料；藉由該防水材料的填充，使得該結構層與該防水層之間、以及該防水層與該保護層之間的間隙空間形成防水材料層、以及填補該結構層、防水層與保護層所產生的裂縫，藉以有效防止混凝土漏水，另外，本發明的方法通過局部處理，不僅提升了防水效果，還節省了施工時間和成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A repair method to prevent concrete leakage and the structure to prevent concrete leakage, the method includes the steps of positioning of negative water pressure surface, delimiting of construction scope of positive water pressure surface, drilling, filling, and confirming, the structure is suitable for the concrete having a structural layer, the structure includes: a waterproof layer, a protective layer and a waterproof material, by filling with the waterproof material, the gap between the structural layer and the waterproof layer, and between the waterproof layer and the protective layer forms a waterproof material layer, and the filling of the cracks caused by the structural layer, the waterproof layer and the protective layer, so as to effectively prevent the leakage of concrete, moreover, the method not only improves the waterproof effect, but also saves the construction time and cost.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10:負水壓面漏水點定位步驟</p>
        <p type="p">S20:正水壓面施工範圍劃定步驟</p>
        <p type="p">S30:鑽孔步驟</p>
        <p type="p">S40:灌注步驟</p>
        <p type="p">S50:確認步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="582" publication-number="202624657">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624657</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148353</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>燈具</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250217B">F21S41/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>無理股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張昊貞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作提出一種燈具，其具有一底座及一燈座。底座具有一固定座、一轉軸、一馬達、一馬達開關及一碳刷。轉軸穿設於固定座，並能相對於固定座旋轉。馬達可分離地推抵於轉軸，並能驅動轉軸旋轉。馬達開關能使馬達推抵於轉軸或使馬達與轉軸分離。碳刷連接一電源。燈座設置於底座上，並連接轉軸。該燈座透過轉軸及碳刷電連接電源。使用者能手動控制燈具的馬達開關，藉此控制馬達推抵於轉軸或分離於轉軸，以控制燈座的轉動。當馬達推抵於轉軸時，馬達能帶動轉軸轉動，進而使燈座轉動。當馬達與轉軸分離時，轉軸及燈座停止轉動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:底座</p>
        <p type="p">10:第二殼體</p>
        <p type="p">2:燈座</p>
        <p type="p">20:第一殼體</p>
        <p type="p">22:燈桿</p>
        <p type="p">23:光源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="583" publication-number="202624595">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624595</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148354</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可監測預警的岩壁護坡構造</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250310B">E02D17/20</main-classification>
        <further-classification edition="200601120250310B">G01L1/22</further-classification>
        <further-classification edition="200601120250310B">G08B21/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立高雄科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈茂松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種可監測預警的岩壁護坡構造，其用以設置於一岩壁，包含複數岩釘，其穿設固定於岩壁且間隔排列呈一面狀；複數掛網，其鋪設於岩壁且各岩釘貫穿掛網；複數固定桿，其組成網格狀結構且蓋設於各掛網，並與各岩釘相結合固定；複數應變計，每一應變計設置於每一固定桿；藉由將本發明設置於岩壁，透過應變計偵測的數值，利用網路傳輸數據至監控室點腦分析，達到無線監控，換算成應力大小並參考監測管理值表作出應變事宜，達到除了具有護坡的功能外，還進一步具有監測岩壁預警山崩的功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:岩釘</p>
        <p type="p">20:掛網</p>
        <p type="p">30:固定桿</p>
        <p type="p">40:應變計</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="584" publication-number="202624548">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624548</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148356</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電化學反應設備及其使用方法</chinese-title>
        <english-title>ELECTROCHEMICAL REACTION APPARATUS AND THE METHOD OF USING THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250402B">C25B1/20</main-classification>
        <further-classification edition="202101120250402B">C25B1/50</further-classification>
        <further-classification edition="202101120250402B">C25B9/23</further-classification>
        <further-classification edition="202101120250402B">C25B11/034</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人石材暨資源產業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STONE &amp; RESOURCE INDUSTRY R&amp;D CENTER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>花蓮縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃子航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TZU-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳輔庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, FU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林倞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電化學反應設備，適用於與反應液搭配使用，且包含反應槽、電極單元、移除單元、輸送單元及驅動單元。該反應槽界定出被分隔為上空間部及下空間部的反應空間。電極單元包括陰極及具有反應部的陽極。陰極能夠被驅動而旋轉並包括兩個以上的反應部。陰極的該等反應部輪流地設置在第一位置及第二位置，且當陰極的該等反應部中任一者在第一位置時，陰極的該反應部位於下空間部且與陽極的反應部相對設置，當陰極的該等反應部中任一者在第二位置時，陰極的該反應部位於上空間部且傾斜於反應液的液面，並與液面的夾角為大於0度且85度以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrochemical reaction apparatus suitable for use with a reaction solution, comprising a reaction tank, an electrode unit, a removal unit, a delivery unit, and a driving unit. The reaction tank defines a reaction space divided into an upper space and a lower space. The electrode unit includes a cathode and an anode with a reaction section. The cathode is rotatable and includes two or more reaction sections. These reaction sections of the cathode are alternately positioned in a first position and a second position. When any of the reaction sections of the cathode is in the first position, it is located in the lower space and arranged opposite the reaction section of the anode. When any of the reaction sections of the cathode is in the second position, it is located in the upper space, inclined to the liquid surface of the reaction solution, and forms an angle with the liquid surface greater than 0 degrees and less than or equal to 85 degrees.</p>
      </isu-abst>
      <representative-img>
        <p type="p">90:反應液</p>
        <p type="p">80:沉積物</p>
        <p type="p">1:反應槽</p>
        <p type="p">10:反應空間</p>
        <p type="p">101:上空間部</p>
        <p type="p">102:下空間部</p>
        <p type="p">12:入液口</p>
        <p type="p">13:出液口</p>
        <p type="p">2:電極單元</p>
        <p type="p">21:陽極</p>
        <p type="p">211:反應部</p>
        <p type="p">22:陰極</p>
        <p type="p">221:反應部</p>
        <p type="p">θ1:夾角</p>
        <p type="p">23:隔離件</p>
        <p type="p">3:移除單元</p>
        <p type="p">4:輸送單元</p>
        <p type="p">41:承載件</p>
        <p type="p">411:承載部</p>
        <p type="p">412:延伸部</p>
        <p type="p">5:驅動單元</p>
        <p type="p">51:轉軸</p>
        <p type="p">θ2:夾角</p>
        <p type="p">6:儲存單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="585" publication-number="202625824">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625824</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148364</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>靜電放電保護電路</chinese-title>
        <english-title>ESD PROTECTION CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260316B">H10W42/60</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新唐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳祖儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, TSU-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種靜電放電保護電路，耦接於一第一電源線以及一第二電源線之間，並包括一釋放電路、一電壓調變電路以及一偵測電路。釋放電路耦接於第一電源線與第二電源線之間。電壓調變電路調節第一電源線的電壓，用以產生一輸出電壓。偵測電路接收輸出電壓，並根據一靜電放電事件，控制釋放電路。當靜電放電事件發生時，偵測電路導通釋放電路，用以將一靜電放電電流由第一電源線釋放至第二電源線。當靜電放電事件未發生時，偵測電路不導通釋放電路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrostatic discharge (ESD) protection circuit coupled between a first power line and a second power line is provided. The ESD protection circuit includes a release circuit, a voltage modulation circuit, and a detection circuit. The release circuit is coupled between the first and second power lines. The voltage modulation circuit adjusts the voltage of the first power line to generate an output voltage. The detection circuit receives the output voltage and controls the release circuit according to the occurrence of an ESD event. When the ESD event occurs, the detection circuit turns on the release circuit to release an ESD current from the first power line to the second power line. When the ESD event does not occur, the detection circuit turns off the release circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:靜電放電保護電路</p>
        <p type="p">101~103:電源線</p>
        <p type="p">110:電壓調變電路</p>
        <p type="p">120:偵測電路</p>
        <p type="p">130:釋放電路</p>
        <p type="p">HV、GND:操作電壓</p>
        <p type="p">LV:輸出電壓</p>
        <p type="p">SC:控制信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="586" publication-number="202623893">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623893</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148366</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>混合觸媒與合成烷烯烴的方法</chinese-title>
        <english-title>CATALYST MIXTURE AND METHOD OF SYNTHESIZING ALKANES/OLEFINS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250120B">B01J23/889</main-classification>
        <further-classification edition="200601120250120B">B01J23/745</further-classification>
        <further-classification edition="202401120250120B">B01J35/61</further-classification>
        <further-classification edition="202401120250120B">B01J35/64</further-classification>
        <further-classification edition="202401120250120B">B01J35/66</further-classification>
        <further-classification edition="200601120250120B">C07C1/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳國卿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, KUO-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林保岑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PAO-TSERN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許希彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HSI-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳朝煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHAO-HUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李承勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHENG-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥至</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李盈傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YING-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">混合觸媒包括金屬氧化物觸媒與鐵基觸媒的混合物。金屬氧化物觸媒具有化學式：Fe        &lt;sub&gt;1&lt;/sub&gt;Mn        &lt;sub&gt;a&lt;/sub&gt;M        &lt;sub&gt;b&lt;/sub&gt;O        &lt;sub&gt;x&lt;/sub&gt;，M係Ce或La；a係0.1至0.5；b係0.1至0.3，且x為化學計量。鐵基觸媒包括70 mol%至97 mol%的多孔FeO(OH)        &lt;sub&gt;c&lt;/sub&gt;，其中1＜c＜2；以及3 mol%至30 mol%的鹼金屬化合物，負載於多孔FeO(OH)        &lt;sub&gt;c&lt;/sub&gt;上。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A catalyst mixture includes a mixture of a metal oxide catalyst and an iron-based catalyst. The metal oxide catalyst has a chemical formula Fe        &lt;sub&gt;1&lt;/sub&gt;Mn        &lt;sub&gt;a&lt;/sub&gt;M        &lt;sub&gt;b&lt;/sub&gt;O        &lt;sub&gt;x&lt;/sub&gt;, wherein M is Ce or La, a is 0.1 to 0.5, b is 0.1 to 0.3, and x is chemical stoichiometry. The iron-based catalyst includes 70 mol% to 97 mol% of porous FeO(OH)        &lt;sub&gt;c&lt;/sub&gt;(wherein 1＜c＜2), and 3 mol% to 30 mol% of alkaline metal compound loaded onto the porous FeO(OH)        &lt;sub&gt;c&lt;/sub&gt;.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="587" publication-number="202625309">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625309</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148369</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電連接器組合</chinese-title>
        <english-title>ELECTRICAL CONNECTOR ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250124B">H01R13/42</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐德斯電通科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OUTDOOR SOLUTIONS ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹益東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, YI-TUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家鳴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIA-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳政輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHENG-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃德耀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, DE-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳豫宛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種電連接器組合，包括有一第一電連接器、以及一第二店連接器。該第一電連接器包括一第一連接器本體、以及設置於該第一連接器本體外周的一或複數個導引件，其中該第一連接器本體內側設置由隔斷所分割而成的複數個插槽、以及一或複數個設置於該插槽內的第一電性單元。該第二電連接器包括內側設置有一內螺紋部的一第二連接器本體、以及設置於該第二連接器本體內側對應該導引件的導引溝，其中該第二連接器本體內側設置有複數個插件、以及一或複數個設置於該插件內的第二電性單元，其中，該隔斷前端至該導引件前端的軸向距離大於該內螺紋部前端至該插件前端的軸向距離。        &lt;br/&gt;​      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an electrical connector assembly, comprising a first electrical connector and a second electrical connector. The first electrical connector includes a first connector body and one or a plurality of guide elements disposed around the outer periphery of the first connector body. The interior of the first connector body is equipped with a plurality of slots separated by partitions and one or a plurality of first electrical units. The first electrical units are disposed of inside the slots. The second electrical connector includes a second connector body with an internal thread portion provided inside and one or a plurality of guiding grooves disposed on the inside of the second connector body, corresponding to the guide elements. A plurality of inserts and one or a plurality of second electrical units are disposed on the interior of the first connector body. The axial distance from the front end of the partition to the front end of the guide element is greater than the axial distance from the front end of the internal thread portion to the front end of the insert.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電連接器組合</p>
        <p type="p">10:第一電連接器</p>
        <p type="p">11:第一連接器本體</p>
        <p type="p">111:第一本體單元</p>
        <p type="p">16:中空套件</p>
        <p type="p">162:轉動部</p>
        <p type="p">20:第二電連接器</p>
        <p type="p">21:第二連接器本體</p>
        <p type="p">211:第二本體單元</p>
        <p type="p">212:第二環形牆</p>
        <p type="p">24:第二電性單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="588" publication-number="202623894">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623894</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148372</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>金屬氧化物觸媒與選擇性還原二氧化碳的方法</chinese-title>
        <english-title>METAL OXIDE CATALYST AND METHOD OF SELECTIVELY AND CHEMICALLY REDUCING CARBON DIOXIDE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250120B">B01J23/889</main-classification>
        <further-classification edition="201701120250120B">C01B32/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳國卿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, KUO-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林保岑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PAO-TSERN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許希彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HSI-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳朝煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHAO-HUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李承勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHENG-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥至</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李盈傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YING-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">選擇性還原二氧化碳的方法包括使二氧化碳、甲烷、與氫氣的混合氣體接觸金屬氧化物觸媒，以形成含有一氧化碳與氫氣的合成氣體。金屬氧化物觸媒，具有化學式：Fe        &lt;sub&gt;1&lt;/sub&gt;Mn        &lt;sub&gt;a&lt;/sub&gt;M        &lt;sub&gt;b&lt;/sub&gt;O        &lt;sub&gt;x&lt;/sub&gt;，其中M係Ce或La；a係0.1至0.5；b係0.1至0.3，且x為化學計量。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of selectively and chemically reducing carbon dioxide includes bringing a gaseous mixture of carbon dioxide, methane, and hydrogen into contact with a metal oxide catalyst to form a syngas containing carbon monoxide and hydrogen. The metal oxide catalyst has a chemical formula of Fe        &lt;sub&gt;1&lt;/sub&gt;Mn        &lt;sub&gt;a&lt;/sub&gt;M        &lt;sub&gt;b&lt;/sub&gt;O        &lt;sub&gt;x&lt;/sub&gt;, wherein M is Ce or La, a is 0.1 to 0.5, b is 0.1 to 0.3, and x is chemical stoichiometry.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="589" publication-number="202625533">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625533</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148374</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>支撐機構及其把手套件</chinese-title>
        <english-title>SUPPORTING MECHANISM AND HANDLE KIT THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250416B">H05K7/14</main-classification>
        <further-classification edition="200601120250416B">H05K7/10</further-classification>
        <further-classification edition="200601120250416B">H05K5/02</further-classification>
        <further-classification edition="200601120250416B">G06F1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川湖科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KING SLIDE WORKS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川益科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KING SLIDE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳庚金</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KEN-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊順和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHUN-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李庭楷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, TING-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王俊強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHUN-CHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種支撐機構包含一把手套件適用於連接至一預定對象物，該把手套件包含一殼體、一把手以及一鎖件。該殼體安裝至該預定對象物；該把手與該鎖件活動地安裝至該殼體；當該把手處於一第一狀態時，該鎖件相對該殼體橫向地伸出，可用以將該預定對象物鎖定至一機架；當該把手從該第一狀態被操作至一第二狀態時，該鎖件相對該殼體縮入，可將該預定對象物從該機架解鎖。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A supporting mechanism includes a handle kit adapted for being connected to a predetermined target object. The handle kit includes a housing, a handle and a locking member. The housing is mounted to the predetermined target object. The handle and the locking member are movably mounted to the housing. When the handle is at a first state, the locking member is transversely extended out relative to the housing so as to lock the predetermined target object with a rack. When the handle is at a second state, the locking member is retracted relative to the housing so as to unlock the predetermined target object from the rack.</p>
      </isu-abst>
      <representative-img>
        <p type="p">22:機架</p>
        <p type="p">24:承載物</p>
        <p type="p">26a:第一側柱</p>
        <p type="p">26b:第二側柱</p>
        <p type="p">28:第一支撐件</p>
        <p type="p">30:第二支撐件</p>
        <p type="p">34:第二把手套件</p>
        <p type="p">36:第一縱向部</p>
        <p type="p">44:第一安裝特徵</p>
        <p type="p">46:第二安裝特徵</p>
        <p type="p">B:底部</p>
        <p type="p">f:前端</p>
        <p type="p">L1:第一側部</p>
        <p type="p">L2:第二側部</p>
        <p type="p">r:後端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="590" publication-number="202623705">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623705</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148375</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>EPE珍珠棉水培管柱</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120241231B">A01G24/00</main-classification>
        <further-classification edition="201801120241231B">A01G24/30</further-classification>
        <further-classification edition="200601120241231B">A01G31/02</further-classification>
        <further-classification edition="200601120241231B">A01G31/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周順隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周順隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種EPE珍珠棉水培管柱，該水培管柱主要係為一種由EPE珍珠棉空心管製成之管柱，藉由EPE珍珠棉其具有隔水防潮、防震、隔音、保溫、可塑性能佳、韌性強、回收再造、環保、抗撞力強等材質特性，不僅輕量化且能降低水培裝置的成本，更具有可降解之環保、反覆回收利用之功效。一EPE珍珠棉空心管，其圓柱管體壁面開設一列或一列以上之圓形或橢圓形種植槽孔，用以容置定植籃；一組EPE珍珠棉製成之圓型蓋板，該蓋板設有一孔洞，一組噴水頭，用以提供營養液與水分。將該EPE珍珠棉水培管柱之頂部及底部分別以蓋板卡掣閉合後，於該上下蓋板之孔洞穿設一噴水頭，並利用三通循環接頭使其與栽培管道連接。本發明係以EPE珍珠棉製成的水培管柱，其質量輕之材質特性，可向上吊掛於空中，避免土壤裡的昆蟲蠶食種植的蔬菜或花卉，免除農藥噴灑，危害人體健康，提供消費者健康的產品；且該EPE珍珠棉水培管柱可不受地形及地點限制向上增加高度，增加單位種植面積，有效提升垂直水培的生產效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:EPE珍珠棉水培管柱</p>
        <p type="p">20:EPE珍珠棉空心管</p>
        <p type="p">200:種植槽孔</p>
        <p type="p">21:蓋板</p>
        <p type="p">210:孔洞</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="591" publication-number="202625311">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625311</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148376</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>懸浮連接器及其組裝方式</chinese-title>
        <english-title>SUSPENSION CONNECTOR AND ITS ASSEMBLY METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">H01R13/629</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀚荃股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CVILUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃文星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WUN-SING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JHIH-CIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃靜雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之一種懸浮連接器，包含：一公端連接器、一母端連接器、至少一個以上之彈性端子及至少一個以上之固定部；該公端連接器中間適當處設有一個以上之插入端子，二側適當處分別設有固定端子；該母端連接器分為一容置部及一外圍部；該彈性端子之一端為導電端，另一端為接地端，且設有一個以上之彎折段，而該彈性端子之適當處設有至少一個以上之接觸段；其中，彈性端子會置於母端連接器中並置於容置部之彈性端子槽A及外圍部之彈性端子槽B中，且彈性端子之導電端會置於容置部所具之凹陷部內，接地端會突出於外圍部之外側，而公端連接器會由上方插入母端連接器，且公端連接器之插入端子會與於彈性端子之接觸段作結合，形成電性連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A floating connector of the present invention includes: a male connector, a female connector, at least one elastic terminal and at least one fixed part; the male connector is provided with more than one at an appropriate place in the middle. Insert the terminal, and fixed terminals are provided at appropriate places on both sides; the female connector is divided into a receiving part and a peripheral part; one end of the elastic terminal is a conductive end, the other end is a grounding end, and is provided with more than one Bend section, and the elastic terminal is provided with at least one contact section at an appropriate place; Among them, the elastic terminal will be placed in the female connector and placed in the elastic terminal slot A of the accommodation part and the elastic terminal slot B of the peripheral part, and the conductive end of the elastic terminal will be placed in the depression of the accommodation part. Inside, the ground end will protrude from the outside of the peripheral part, and the male connector will be inserted into the female connector from above, and the insertion terminal of the male connector will be combined with the contact segment of the elastic terminal to form an electrical connection.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:公端連接器</p>
        <p type="p">10:插入端子</p>
        <p type="p">101:插入段A</p>
        <p type="p">102:插入段B</p>
        <p type="p">11:固定端子</p>
        <p type="p">2:母端連接器</p>
        <p type="p">20:容置部</p>
        <p type="p">201:導引槽</p>
        <p type="p">202:凹陷部</p>
        <p type="p">203:彈性端子槽A</p>
        <p type="p">204:斷料台階</p>
        <p type="p">21:外圍部</p>
        <p type="p">211:貫穿孔</p>
        <p type="p">213:彈性端子槽B</p>
        <p type="p">214:固定槽</p>
        <p type="p">3:彈性端子</p>
        <p type="p">31:導電端</p>
        <p type="p">32:接地端</p>
        <p type="p">33:彎折段</p>
        <p type="p">34:接觸段</p>
        <p type="p">35:錯位段</p>
        <p type="p">36:卡點</p>
        <p type="p">4:固定部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="592" publication-number="202624748">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624748</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148377</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於2-哌啶酮檢測大腸直腸癌的方法及其醫藥用途</chinese-title>
        <english-title>METHOD FOR DETECTING COLORECTAL CANCER BASED ON 2- PIPERIDINE AND MEDICAL USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260316B">G01N33/575</main-classification>
        <further-classification edition="200601120260316B">G01N33/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立成功大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張權發</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHUAN-FA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUNG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　俊凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, JUN-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李永國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YUNG-KUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許邦弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, PANG-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許智為</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李威聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種基於2-哌啶酮檢測大腸直腸癌的方法及其醫藥用途，其中，該方法包括：量化受試者之血液樣本中的2-哌啶酮以獲得含量檢測值P，依據該含量檢測值P與含量界限值Px判斷該受試者為大腸直腸癌陽性患者、大腸直腸癌陰性患者或大腸直腸癌前期患者；藉由上述方法所判定之大腸直腸癌陽性患者，可更進一步投予2-哌啶酮以抑制癌細胞的侵襲及遷移能力，達到治療或緩解大腸直腸癌的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a method for detecting colorectal cancer based on 2- piperidine and a medical use thereof. The method comprises: quantifying content of 2- piperidine in a blood sample from a subject so as to obtain a content testing value P, and determining the subject to be a colorectal cancer positive patient, a colorectal cancer negative patient or an early-stage colorectal cancer patient according to the content testing value and a content threshold value Px. The colorectal cancer positive patient identified by using the method can be further administrated of 2- piperidine so as to suppress invasion or migration of cancer cells, and thereby curing or relieving colorectal cancer.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="593" publication-number="202625631">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625631</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148380</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體元件及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250311B">H10H20/80</main-classification>
        <further-classification edition="202501120250311B">H10H20/825</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富采光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENNOSTAR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳日康</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JIH-KANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋彩蓁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, CAI-JHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIA-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐震</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OU, CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖偉鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, WEI-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖清翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHING-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇靖驊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, CHING-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體元件，包含半導體疊層以及絕緣結構覆蓋於半導體疊層之上，半導體疊層包含上表面、下表面及側壁，其中絕緣結構覆蓋上表面及側壁，側壁包含第一子側壁，第一子側壁與下表面相連且第一子側壁相對於下表面具有第一角度，絕緣結構覆蓋第一子側壁，覆蓋於第一子側壁的絕緣結構具有漸變的厚度，且厚度係以朝向下表面的方向漸減。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a semiconductor stack and an insulating structure covering the semiconductor stack. The semiconductor stack includes an upper surface, a lower surface and a side wall. The insulating structure covers the upper surface and the side wall, and the side wall includes a first sub-side wall which is connected to the lower surface and has a first angle relative to the lower surface. The insulating structure covers the first sub-side wall and has a gradient thickness on the first sub-side wall which gradually decreases toward the lower surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:發光元件</p>
        <p type="p">120:半導體疊層</p>
        <p type="p">120a:上表面</p>
        <p type="p">120b:下表面</p>
        <p type="p">121:第一半導體層</p>
        <p type="p">121a:第一半導體層上表面</p>
        <p type="p">122:第二半導體層</p>
        <p type="p">122a:第二半導體層上表面</p>
        <p type="p">123:主動區域</p>
        <p type="p">31:第一電極</p>
        <p type="p">32:第二電極</p>
        <p type="p">50:絕緣結構</p>
        <p type="p">501:第一開口</p>
        <p type="p">502:第二開口</p>
        <p type="p">53:端部</p>
        <p type="p">L:水平基準線</p>
        <p type="p">S:側壁</p>
        <p type="p">S1:第一子側壁</p>
        <p type="p">θ1:第一夾角</p>
        <p type="p">θt:斜角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="594" publication-number="202624564">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624564</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148382</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>不溶性陽極與其製造方法與電解裝置</chinese-title>
        <english-title>INSOLUBLE ANODE AND METHOD OF MANUFACTURING THE SAME AND ELECTROLYSIS DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241226B">C25D17/10</main-classification>
        <further-classification edition="200601120241226B">C25D21/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏銘翬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, MING-HUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文錦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, WEN-JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張郁苓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YU-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙一如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, YI-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">不溶性陽極包括基材；觸媒層；以及中間層，設置於基材與觸媒層之間，其中觸媒層包括氧化銥、氧化鉬、與氧化銥鉬，且銥與鉬的莫耳比為9:1至2:8，其中中間層係氧化鈦或氧化錫。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An insoluble anode includes a substrate, a catalyst layer, and an intermediate layer interposed between the substrate and the catalyst layer. The catalyst layer includes iridium oxide, molybdenum oxide, and iridium molybdenum oxide, and iridium and molybdenum have a molar ratio of 9:1 to 2:8. The intermediate layer is titanium oxide or tin oxide.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="595" publication-number="202623767">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623767</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148387</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>超音波換能器</chinese-title>
        <english-title>ULTRASONIC TRANSDUCER DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">A61B8/00</main-classification>
        <further-classification edition="200601120241231B">B06B1/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佳世達科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QISDA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣富昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, FU-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮政傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUAN, CHENG-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可以提高訊號雜訊比的超音波換能器，其包含有一減振層、一聲透鏡、一換能模組以及一介面結構。該換能模組設置在該減振層與該聲透鏡之間。該介面結構設置在該換能模組之鄰近該減震層的一側。該介面結構具有規則排列的複數個子結構，並且該複數個子結構之任意兩個子結構的尺寸差異低於一預定值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An ultrasonic transducer device that can improve a signal-to-noise ratio includes a vibration reduction layer, an acoustic lens, a transducer module and an interface structure. The transducer module is disposed between the vibration reduction layer and the acoustic lens. The interface structure is disposed on a side of the transducer module adjacent to the vibration reduction layer. The interface structure has a plurality of substructures in a regularly arranged manner. A size difference between any two substructures of the plurality of substructures is lower than a predefined value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:超音波換能器</p>
        <p type="p">12:減振層</p>
        <p type="p">14:聲透鏡</p>
        <p type="p">16:換能模組</p>
        <p type="p">18:介面結構</p>
        <p type="p">20:子結構</p>
        <p type="p">22:壓電材料層</p>
        <p type="p">24:聲阻匹配層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="596" publication-number="202624642">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624642</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148391</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>減速裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250217B">F16H3/44</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連哲文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連哲文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃啟修</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係指一種減速裝置，其係由一輸入件、一連接該輸入件之主動齒輪組、一與該主動齒輪組同軸設置之被動齒輪組及一接設該被動齒輪組之輸出件所組成，將同軸驅動之該主動齒輪組與該被動齒輪組的齒數比設計成不同，供形成轉速差，並透過同軸之該等主動行星齒輪與該等被動行星齒輪呈剛性連結的結構，而發生動態支點之抵力，藉此，能達到減速之作用，且能大幅簡化結構，並能有效縮小材積，同時具有加大扭力輸出之效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:輸入件</p>
        <p type="p">11:輸出軸</p>
        <p type="p">20:主動齒輪組</p>
        <p type="p">21:第一輪架</p>
        <p type="p">23:軸承</p>
        <p type="p">24:第一連接柱</p>
        <p type="p">25:主動太陽齒輪</p>
        <p type="p">26:第一軸孔</p>
        <p type="p">27:軸桿</p>
        <p type="p">28:第一軸承</p>
        <p type="p">29:主動行星齒輪</p>
        <p type="p">30:被動齒輪組</p>
        <p type="p">31:第二輪架</p>
        <p type="p">34:第二連接柱</p>
        <p type="p">35:被動太陽齒輪</p>
        <p type="p">36:第二軸孔</p>
        <p type="p">350:凸軸部</p>
        <p type="p">37:鎖固件</p>
        <p type="p">38:第二軸承</p>
        <p type="p">39:被動行星齒輪</p>
        <p type="p">40:輸出件</p>
        <p type="p">41:外齒緣</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="597" publication-number="202625023">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625023</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148394</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>應用於人工智慧模型中之模型轉換方法、包含指令的電腦程式以及電腦可讀儲存媒體</chinese-title>
        <english-title>MODEL CONVERSION METHOD, COMPUTER PROGRAM CONTAINING INSTRUCTIONS, AND COMPUTER-READABLE STORAGE MEDIUM APPLIED IN ARTIFICIAL INTELLIGENCE MODELS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">G06N3/10</main-classification>
        <further-classification edition="201801120250102B">G06F8/40</further-classification>
        <further-classification edition="202001120250102B">G06F30/27</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威盛電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIA TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李蛟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張朝晉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHAOCHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊代強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種模型轉換方法、包含指令的電腦程式以及電腦可讀儲存媒體，可應用於人工智慧中之一源模型的處理，該模型轉換方法包含下列步驟：將該源模型匯出成一待處理模型，該待處理模型具有一中間格式；根據一第一部署端之一規格而對應出一第一模型轉換工具與一第一等價轉換運算子資料庫；以及使用該第一模型轉換工具與該第一等價轉換運算子資料庫來將該待處理模型轉換成一第一目標模型，使該第一目標模型可運行於該第一部署端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A model conversion method, computer program containing instructions, and computer-readable storage medium applicable to processing a source model in artificial intelligence. The model conversion method includes the following steps: exporting the source model to an intermediate model, where the intermediate model has an intermediate format; mapping to a first model transformation tool and a first equivalent transformation operator database based on specifications of a first deployment end; and using the first model transformation tool and the first equivalent transformation operator database to transform the intermediate model into a first target model, allowing the first target model to operate on the first deployment end.</p>
      </isu-abst>
      <representative-img>
        <p type="p">31:第一小模型</p>
        <p type="p">40:模型轉換工具</p>
        <p type="p">41:第一目標小模型</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="598" publication-number="202625137">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625137</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148399</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>畫素電路</chinese-title>
        <english-title>PIXEL CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120241218B">G09G3/32</main-classification>
        <further-classification edition="200601120241218B">G09G5/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐懿夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OU, YI-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏志帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, ZHI-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林雨仙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-SHIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">畫素電路包括發光元件、修補用發光元件、驅動電路、第一發光控制電晶體與第二發光控制電晶體。驅動電路耦接發光元件與修補用發光元件以分別驅動發光元件與修補用發光元件發光。第一發光控制電晶體串聯耦接於驅動電路與發光元件之間以控制發光元件的發光與否。第二發光控制電晶體串聯耦接於驅動電路與修補用發光元件之間以控制修補用發光元件的發光與否。於畫素電路的發光期間，透過驅動電路或透過第一與第二發光控制電晶體，以使得修補用發光元件的發光亮度低於發光元件的發光亮度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pixel circuit includes a light-emitting element, a repair light-emitting element, a driving circuit, a first emission control transistor and a second emission control transistor. The driving circuit is coupled to the light-emitting element and the repair light-emitting element to drive the light-emitting element and the repairing light-emitting element to emit light. The first emission control transistor is coupled in series between the driving circuit and the light-emitting element to control whether the light-emitting element emits light. The second emission control transistor is coupled in series between the driving circuit and the repair light-emitting element to control whether the repair light-emitting element emits light. During an emission period of the pixel circuit, a brightness of the repair light-emitting element is lower than a brightness of the light-emitting element through the driving circuit or through the first and second emission control transistors.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:畫素電路</p>
        <p type="p">11:控制與補償電路</p>
        <p type="p">C1:電容</p>
        <p type="p">DATA:資料訊號</p>
        <p type="p">DT:驅動電晶體</p>
        <p type="p">EM,EM_A[n],EM_B[n]:發光控制訊號</p>
        <p type="p">EM1,EM2:發光控制電晶體</p>
        <p type="p">L1:發光元件</p>
        <p type="p">L2:修補用發光元件</p>
        <p type="p">S1,S2:掃描訊號</p>
        <p type="p">T1:初始化電晶體</p>
        <p type="p">T2:寫入電晶體</p>
        <p type="p">T3,T4:補償電晶體</p>
        <p type="p">T5:重置電晶體</p>
        <p type="p">VDD:系統高電壓端</p>
        <p type="p">VREFN:起始電壓端</p>
        <p type="p">VREFP:參考電壓端</p>
        <p type="p">VSS:系統低電壓端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="599" publication-number="202625873">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625873</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148411</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體封裝結構與半導體晶片</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICONDUCTOR CHIP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W76/12</main-classification>
        <further-classification edition="202601120260302B">H10W74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鯨鏈科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WHALECHIP CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>台北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡至鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHIH-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開一種半導體封裝結構與半導體晶片。半導體封裝結構包括：承載層、第一電子元件、第二電子元件與信號補償器；承載層包括線路層；第一電子元件與第二電子元件各自分別選擇性設置於承載層的表面上或內部且電性連接線路層，第一電子元件與第二電子元件透過線路層的導電線路進行信號的傳輸；信號補償器設置在導電線路的路徑上，信號補償器被配置為補償第一電子元件所發送給第二電子元件的信號，或者補償第二電子元件所發送給第一電子元件的信號。因此，可透過信號補償器的設置，降低信號傳輸的耗損。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are a semiconductor package structure and a semiconductor chip. The semiconductor package structure includes a carrier layer, a first electronic component, a second electronic component and a signal compensator. The carrier layer includes a circuit layer. The first electronic component and the second electronic component are respectively selectively disposed above a surface of the carrier layer or inside the carrier layer, and are electrically connected to the circuit layer. The first electronic component and the second electronic component transmit signals through a conductive trace of the circuit layer. The signal compensator is arranged on a path of the conductive trace, and the signal compensator is configured to compensate for a signal sent by the first electronic component to the second electronic component or to compensate for a signal sent by the second electronic component to the first electronic component. Therefore, the signal transmission loss can be reduced through the arrangement of the signal compensator.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:導電接點</p>
        <p type="p">50:導電線路</p>
        <p type="p">60:導電層</p>
        <p type="p">65:介質層</p>
        <p type="p">68:導電通孔</p>
        <p type="p">100:半導體封裝結構</p>
        <p type="p">110:承載層</p>
        <p type="p">112:線路層</p>
        <p type="p">120:第一電子元件</p>
        <p type="p">130:第二電子元件</p>
        <p type="p">140:信號補償器</p>
        <p type="p">T:厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="600" publication-number="202624256">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624256</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148413</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多肽、含彼之醫藥組合物及其用途</chinese-title>
        <english-title>POLYPEPTIDE, MEDICINE COMPOSITION INCLUDING IT AND USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">C07K14/54</main-classification>
        <further-classification edition="200601120250501B">A61K38/20</further-classification>
        <further-classification edition="200601120250501B">A61K38/16</further-classification>
        <further-classification edition="200601120250501B">C07K14/47</further-classification>
        <further-classification edition="200601120250501B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立成功大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊偉哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, WOEI-JER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許智為</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李威聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種多肽、含彼之醫藥組合物及其用途，其中，該多肽包含：第一結構域、第二結構域及第三結構域，其中，第二結構域為介白素-2受體次單元α結合域，第一結構域及第三結構域為非介白素-2受體次單元α結合域，該第三結構域具有取代為半胱胺酸之第一突變，與可選擇發生於第一結構域、該第二結構域或該第三結構域中的第二突變，其取代為另一半胱胺酸，共同形成雙硫鍵；本發明所提供的多肽具有較佳的熱穩定性、溶解度與產率，且具有偏向結合IL-2受體次單元α或βγ，具有調節T細胞（Regulatory T cells)或作用型T細胞 (Effector T cells)以刺激抗腫瘤免疫反應的功能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a polypeptide, medicine composition including it and use thereof. The polypeptide comprises: a first structural domain, a second structural domain and a third structural domain, wherein the second structural domain is an interleukin-2 receptor subunit α-binding domain, and the first structural domain and the third structural domain are non-interleukin-2 receptor subunit α-binding domain. A first mutation is introduced into the third structural domain by substitution with cysteine, and a second mutation is introduced optionally into the first structural domain, the second structural domain or the third structural domain by substitution with cysteine, and a disulfide bond forms therebetween. The polypeptide presents better thermal stability, solubility and productivity, and shows tendency to bind IL-2Rα or IL-2Rβγ. The polypeptide is able to activate anti-cancer immune response by regulation of regulatory T cells or effector T cells.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="601" publication-number="202625638">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625638</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148415</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>近紅外發光二極體及其製造方法</chinese-title>
        <english-title>NEAR INFRARED LIGHT EMITTING DIODE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10H20/851</main-classification>
        <further-classification edition="200601120250102B">C07C69/12</further-classification>
        <further-classification edition="200601120250102B">C07C49/587</further-classification>
        <further-classification edition="202501120250102B">H10H20/824</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台亞半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN-ASIA SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳皇名</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUANG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林義傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉彥宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁國隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種近紅外發光二極體及其製造方法，其中近紅外發光二極體包含一基板、一磊晶複合層、一上部電極及一黑色光阻。其中，磊晶複合層設置於基板上，具有一發光波段為750奈米（nm）至1000奈米（nm）之一發光層。上部電極設置於磊晶複合層之上表面，黑色光阻包覆磊晶複合層而僅露出上部電極，藉以吸收發光波段中之可見光而僅讓紅外光穿透黑色光阻對外射出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A near-infrared (NIR) light-emitting diode (LED) and a manufacturing method thereof are provided. The NIR LED includes a substrate, an epitaxial composite layer, an upper electrode, and a black photoresist. The epitaxial composite Layer is disposed on the substrate and comprises a light-emitting layer with an emission wavelength ranging from 750 nanometers (nm) to 1000 nm. The upper electrode is disposed on the top surface of the epitaxial composite layer. The black photoresist encapsulates the epitaxial composite layer while exposing only the upper electrode wherein the black photoresist absorbs visible light within the emission wavelength range and allows only the infrared light to pass through and be emitted externally.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:近紅外發光二極體</p>
        <p type="p">10:基板</p>
        <p type="p">100:磊晶複合層</p>
        <p type="p">110:N型磊晶層</p>
        <p type="p">120:發光層</p>
        <p type="p">130:P型磊晶層</p>
        <p type="p">140:上部電極</p>
        <p type="p">150:下部電極</p>
        <p type="p">160:黑色光阻</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="602" publication-number="202623930">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623930</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148421</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>擴散接合工件的方法</chinese-title>
        <english-title>METHOD OF DIFFUSION BONDING WORKPIECE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">B23K3/04</main-classification>
        <further-classification edition="200601120241230B">B23K3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳毓珣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YU-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李名言</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, MING-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>管琪芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUAN, CHI-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種擴散接合工件的方法，其係包含放置待接合工件於熱壓設備中，其中待接合工件包含上下疊合的兩個待接物；以及對待接合工件進行熱壓操作，其中熱壓操作包含第一階段熱壓步驟及第二階段熱壓步驟。各階段的熱壓步驟係以不同壓塊對待接合工件進行接合，藉以達到提升工件的接合強度及接合率的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of diffusion bonding workpiece is provided. The method includes disposing a workpiece to be joined in a hot-pressing equipment, in which the workpiece to be joined includes two substances to be joined; and performing a hot-pressing operation to the workpiece to be joined, in which the hot-pressing operation includes a first-stage hot-pressing step and a second-stage hot-pressing step. Various stages of hot-pressing steps are performed to bond the workpiece to be joined with different briquettes. Therefore, a bonding strength and a bonding rate of the workpiece can be increased.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:製程裝置</p>
        <p type="p">110:熱壓設備</p>
        <p type="p">120:待接合工件</p>
        <p type="p">122,125:待接物</p>
        <p type="p">130:下壓塊</p>
        <p type="p">140:上壓塊</p>
        <p type="p">120A:表面</p>
        <p type="p">125A:待接合面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="603" publication-number="202623975">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623975</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148425</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>固定支架的吸附裝置</chinese-title>
        <english-title>ADSORPTION DEVICE FOR FIXED BRACKET</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251030B">B25J15/06</main-classification>
        <further-classification edition="200601120251030B">F16B47/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茂傑國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAGIC CONTROL TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉培中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, PEI-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種固定支架的吸附裝置，係在設於吸盤座中央設置軸桿，該軸桿依序穿過彈性元件、底座、外殼及凸輪後設置銷桿，使該銷桿接觸至該凸輪的凸輪曲線，並且使該凸輪固定至旋帽；當往第一方向旋轉該旋帽而使該凸輪往該第一方向旋轉時，該凸輪藉由該銷桿帶動該軸桿往遠離該吸盤座的方向移動，從而使吸盤座之吸盤本體與物體之間產生真空吸附作用，當往第相反的第二方向旋轉該旋帽而使該凸輪往該第二方向旋轉時，該凸輪藉由該銷桿帶動該軸桿往接近該吸盤座的方向移動，從而解除該吸盤本體與物體之間的真空吸附作用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An adsorption device for a fixed bracket is provided with a shaft in the center of a suction cup seat. The shaft passes through an elastic element, a base, housing and a cam in order, and then a pin is set so that the pin contacts a cam curve of the cam, and the cam is fixed to a rotating nut. Wherein, when the rotating nut is rotated in a first direction and the cam is rotated in the first direction, the cam drives the shaft through the pin to move in a direction away from the suction cup seat, thereby causing a vacuum adsorption effect between the suction cup body of the suction seat and an object. When the rotating nut is rotated in the opposite second direction to cause the cam to rotate in the second direction, the cam drives the shaft through the pin to move closer to the suction cup seat, thereby releasing the vacuum adsorption effect between the suction cup body and the object.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:吸盤座</p>
        <p type="p">30:外殼</p>
        <p type="p">60:旋帽</p>
        <p type="p">80:固定支架</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="604" publication-number="202625394">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625394</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148426</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>兼具空中測試機制與電路自校準機制的陣列天線系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250102B">H04B7/02</main-classification>
        <further-classification edition="200601120250102B">H01Q21/00</further-classification>
        <further-classification edition="201501120250102B">H04B1/38</further-classification>
        <further-classification edition="201501120250102B">H04B17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>創威訊科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周錫增</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏志達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安謙信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許家華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李易撰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種兼具空中測試機制與電路自校準機制的陣列天線系統，包括複數個天線單元、複數個射頻模組、一處理裝置與複數個訊號管理模組，其中，該等天線單元排列成一陣列結構，並分別連接至射頻模組，該處理裝置內設有一空中測試校準數據庫，且該處理裝置能在電路自校準機制中，與各該射頻模組及各該訊號管理模組相互傳送射頻訊號，以取得對應的待分析訊號，並根據前述待分析訊號與空中測試校準數據庫的內容，各自運算出所需的校準資訊，再合併運算出最終校準參數。如此，該陣列天線系統於實際工作時，藉由該空中測試校準數據庫的內容，可使空中測試機制與電路自校準機制於同步進行，進而優化陣列天線系統的輻射特性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:處理裝置</p>
        <p type="p">10:空中測試校準數據庫</p>
        <p type="p">11:升降頻轉換器</p>
        <p type="p">13:訊號處理模組</p>
        <p type="p">14:射頻端口</p>
        <p type="p">3:訊號管理模組</p>
        <p type="p">5:空中量測裝置</p>
        <p type="p">S:陣列天線系統</p>
        <p type="p">T:天線部</p>
        <p type="p">T1:天線單元</p>
        <p type="p">T2:射頻模組</p>
        <p type="p">P:訊號源裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="605" publication-number="202625598">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625598</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148427</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磊晶結構、功率元件及磊晶結構之製造方法</chinese-title>
        <english-title>EPITAXIAL STRUCTURE, POWER DEVICE AND MANUFACTURING METHOD OF EPITAXIAL STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D62/40</main-classification>
        <further-classification edition="202501120260302B">H10D62/85</further-classification>
        <further-classification edition="202501120260302B">H10D30/47</further-classification>
        <further-classification edition="202601120260302B">H10P10/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台亞半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN-ASIA SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝博任</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, PO-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHUN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江品豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, PIN-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林義傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉彥宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁國隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種磊晶結構，主要包含二漸變層，一含鋁漸變層及一含鎵漸變層及二漸變層間之一緩衝層。含鋁漸變層設置於一矽基板上，具有一含鋁三維結構及一含鋁二維結構，其中含鋁三維結構係形成於矽基板上，並成長以部分漸變形成含鋁二維結構。含鎵漸變層設置於緩衝層上，具有一含鎵三維結構及一含鎵二維結構，其中含鎵三維結構係形成於緩衝層上，並成長以部分漸變形成含鎵二維結構。藉由二層三維轉變二維之漸變層以緩解矽基板對磊晶層之經格差異，並使內應力下降。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An epitaxial structure is provided. The epitaxial structure mainly comprises two transition layers, an aluminum-containing transition layer, a gallium-containing transition layer, and a buffer layer therebetween. The aluminum-containing transition layer is disposed on a silicon substrate and includes an aluminum-containing three-dimensional structure and an aluminum-containing two-dimensional structure. The aluminum-containing three-dimensional structure is formed on the silicon substrate and grows transitionally to partially form the aluminum-containing two-dimensional structure. The gallium-containing transition layer is disposed on the buffer layer and includes a gallium-containing three-dimensional structure and a gallium-containing two-dimensional structure. The gallium-containing three-dimensional structure is formed on the buffer layer and grows transitionally to partially form the gallium-containing two-dimensional structure. By means of two three-dimensional to two-dimensional transition layers, the lattice difference between the silicon substrate and the epitaxial layer can be released and the internal stress can be reduced.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板</p>
        <p type="p">110:含鋁漸變層</p>
        <p type="p">120:含鋁同質層</p>
        <p type="p">130:第一緩衝層</p>
        <p type="p">140:含鎵漸變層</p>
        <p type="p">150:含鎵同質層</p>
        <p type="p">160:第二緩衝層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="606" publication-number="202624093">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624093</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148429</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於形成保溫容器之胚料</chinese-title>
        <english-title>A BLANK FOR FORMING A THERMAL CONTAINER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250228B">B65D81/18</main-classification>
        <further-classification edition="200601120250228B">B65D81/38</further-classification>
        <further-classification edition="200601120250228B">B65D5/02</further-classification>
        <further-classification edition="200601120250228B">B65D6/16</further-classification>
        <further-classification edition="200601120250228B">B65D65/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澳大利亞商庫爾全球解決方案有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOOL GLOBAL SOLUTIONS PTY LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>隆　湯姆約瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LONG, TOM JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於形成保溫容器之胚料，該胚料包含：一第一板部，用於形成容器形成後之前壁，該第一板部包含一第一板自由邊緣；一第二板部，用於形成容器形成後之底部，該第二板部位於第一板部的相鄰處，並與其共享一第一共同邊緣；以及一第三板部，用於形成容器形成後之背壁，該第三板部位於第二板部的相鄰處，並與其共享一第二共同邊緣，該第二共同邊緣位於第一共同邊緣的相對側；其中該第一板部及該第三板部各自與一對翻邊構件相關聯，該對翻邊構件適於相對於各自的第一板部及第三板部進行折疊移動，使得於組裝後，各該翻邊構件覆蓋於該第二板部之邊緣，其沿該第一共同邊緣與該第二共同邊緣之間延伸以形成各側壁；一子板，用於形成容器形成後的蓋部，該子板位於第三板部的相鄰處，並與其共享一第三共同邊緣，該第三共同邊緣位於第二共同邊緣的相對側，該子板具有一可折疊部分，沿第三共同邊緣的相對側設置，其中該可折疊部分具有一第二板自由邊緣，且可收入形成後之容器內，相鄰於第一板靠近該第一板自由邊緣，其特徵係該可折疊部分之自由邊緣因該胚料之形狀朝向該自由邊緣漸縮，而短於該第三共同邊緣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A blank for forming a thermal container, the blank comprising a first panel portion for forming a front wall of the container once formed, the first panel portion comprising a first panel-free edge; a second panel portion for forming a base of the container once formed, located adjacent the first panel portion and sharing a first common edge therewith; and a third panel portion for forming a back wall of the container once formed, located adjacent the second panel portion and sharing a second common edge therewith, the second common edge being on the side opposite to the first common edge, wherein the first panel portion and the third panel portion are each associated with a pair of flap members adapted for folding movement relative to the respective first and third panel portions such that, when assembled, each of the flap members overlies an edge of the second panel portion that runs between the first common edge and the second common edge to form respective side walls, a subpanel for forming a lid of the container once formed, located adjacent the third panel portion and sharing a third common edge therewith, the third common edge being on the side opposite to the second common edge, the subpanel having a foldable portion along the side opposite to the third common edge wherein the foldable portion has a second panel-free edge and is tuckable into the container once formed, adjacent the first panel near the first panel-free edge, characterised in that the free edge of the foldable portion is shorter than the third common edge due to a tapered shape of the blank towards the free edge.</p>
      </isu-abst>
      <representative-img>
        <p type="p">12:第一板部</p>
        <p type="p">24:一對翻邊構件(與第一板部12相關聯)</p>
        <p type="p">25:一對翻邊構件(與第三板部20相關聯)</p>
        <p type="p">26:一對翻邊構件(與子板30相關聯)</p>
        <p type="p">30:子板</p>
        <p type="p">34:可折疊部分(與子板30相關聯)</p>
        <p type="p">36:第二板自由邊緣(與子板30相關聯)</p>
        <p type="p">52:側接縫接合</p>
        <p type="p">100:由胚料10形成之保溫容器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="607" publication-number="202625841">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625841</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148430</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子封裝件及其電子裝置與製法</chinese-title>
        <english-title>ELECTRONIC PACKAGE, ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W72/00</main-classification>
        <further-classification edition="202601120260302B">H10W74/10</further-classification>
        <further-classification edition="200601120260302B">G02B6/12</further-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矽品精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICONWARE PRECISION INDUSTRIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>符毅民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, YI-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何祈慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, CHI CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王愉博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YU-PO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種電子封裝件，包括：承載結構；佈線結構，設於該承載結構上；電子結構，設於該佈線結構上，並包含複數第一導電凸塊及複數第二導電凸塊，其中，該複數第一導電凸塊電性連接該佈線結構；包覆層，設於該佈線結構上並包覆該電子結構，且外露該複數第二導電凸塊；以及連接件，設於該包覆層上，並電性連接該複數第二導電凸塊。本揭露更提供一種具有該電子封裝件之電子裝置及該電子封裝件之製法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an electronic package, the electronic package comprises: a carrying structure; a wiring structure provided on the carrying structure; an electronic structure provided on the wiring structure and included a plurality of first conductive bumps and second conductive bumps, wherein the first conductive bumps electronically connect to the wiring structure; an encapsulation layer provided on the wiring structure, covered the electronic structure, and exposed the second conductive bumps; and a connecting element provided on the encapsulation layer and electronically connected to the second conductive bumps. The present disclosure further provides an electronic device having the electronic package and a manufacturing method of the electronic package.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:電子封裝件</p>
        <p type="p">2a:電子結構</p>
        <p type="p">20:電子主體</p>
        <p type="p">20a,25a,27a:第一側</p>
        <p type="p">20b,25b,27b:第二側</p>
        <p type="p">200:導電穿孔</p>
        <p type="p">21:第一導電凸塊</p>
        <p type="p">22:第二導電凸塊</p>
        <p type="p">23:導電線路</p>
        <p type="p">24:佈線結構</p>
        <p type="p">241,271:介電層</p>
        <p type="p">242,272:線路層</p>
        <p type="p">25:包覆層</p>
        <p type="p">26:導電元件</p>
        <p type="p">27:承載結構</p>
        <p type="p">273:底膠</p>
        <p type="p">28:連接件</p>
        <p type="p">29:導電體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="608" publication-number="202625730">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625730</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148432</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種單側雙迴路的低溫高壓旋轉接頭模組</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/00</main-classification>
        <further-classification edition="202601120260302B">H10P74/00</further-classification>
        <further-classification edition="200601120260302B">F16L39/06</further-classification>
        <further-classification edition="202101120260302B">F25B41/00</further-classification>
        <further-classification edition="200601120260302B">F16L27/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商無錫艾方芯動自動化設備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周建松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種單側雙迴路的低溫高壓旋轉接頭模組，其包括旋轉接頭、旋轉驅動部和測試模組；測試模組用於承放待測晶片，測試模組設有用於接收冷媒的冷媒進口管和用於排出冷媒的冷媒出口管；旋轉驅動部用於驅動測試模組轉動至特定角度；旋轉接頭用於與冷媒進口管和冷媒出口管構成完整的冷媒回路；藉此本發明結構能讓負責輸送的冷媒管件不需轉動，能消除傳統圓盤收放管因長期收放拉扯而引起的管路破損洩漏問題，延長系統的使用壽命的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:測試模組</p>
        <p type="p">2:動力源</p>
        <p type="p">3:中空傳動軸</p>
        <p type="p">4:固定架</p>
        <p type="p">5:支撐架</p>
        <p type="p">611:第一進氣接頭</p>
        <p type="p">8:殼體</p>
        <p type="p">81:氣源固定孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="609" publication-number="202625168">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625168</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148443</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體裝置</chinese-title>
        <english-title>MEMORY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">G11C5/02</main-classification>
        <further-classification edition="200601120250303B">G11C16/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>旺宏電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACRONIX INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳士弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHIH-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供記憶體裝置的周邊電路系統以及記憶體裝置。周邊電路系統包含電性連接記憶體裝置的記憶體陣列的第一周邊電路、以及電性連接記憶體陣列的第二周邊電路。第一周邊電路與第二周邊電路沿著一縱向方向設置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Peripheral circuit systems of memory devices and memory devices are provided. The peripheral circuit system include a first peripheral circuit electrically connected to a memory array of a memory device and a second peripheral circuit electrically connected to the memory array. The first peripheral circuit and the second peripheral circuit are arranged along a longitudinal direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:記憶體裝置</p>
        <p type="p">101:記憶體陣列</p>
        <p type="p">103:第一周邊電路</p>
        <p type="p">105:第二周邊電路</p>
        <p type="p">110W:第一半導體結構</p>
        <p type="p">112:裝置層</p>
        <p type="p">113,123:互連結構</p>
        <p type="p">114:穿孔元件</p>
        <p type="p">115:接墊</p>
        <p type="p">116:輸入/輸出墊</p>
        <p type="p">120W:第二半導體結構</p>
        <p type="p">122:裝置層</p>
        <p type="p">130:基板</p>
        <p type="p">131:堆疊結構</p>
        <p type="p">132:導電元件</p>
        <p type="p">133:記憶體串列</p>
        <p type="p">141:階梯結構</p>
        <p type="p">142:插塞元件</p>
        <p type="p">143:導電結構</p>
        <p type="p">144:接觸元件</p>
        <p type="p">1120,1220:半導體層</p>
        <p type="p">1311:導電層</p>
        <p type="p">1312:絕緣層</p>
        <p type="p">1411:導電階梯層</p>
        <p type="p">1412:絕緣階梯層</p>
        <p type="p">MR:陣列區</p>
        <p type="p">T1,T2:電晶體</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="610" publication-number="202624780">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624780</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148448</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池內阻量測系統及其方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250311B">G01R31/389</main-classification>
        <further-classification edition="201901120250311B">G01R31/396</further-classification>
        <further-classification edition="201901120250311B">G01R31/364</further-classification>
        <further-classification edition="201901120250311B">G01R31/378</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>能元科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>E-ONE MOLI ENERGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭朝絪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHAO-YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊仁嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, JEN-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁啟達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電池內阻量測系統，用於量測一待測電池的一內阻阻值，該待測電池包含一第一端部以及一第二端部，且該第一端部具有一氧化層；該電池內阻量測系統包含：一供電裝置，包含一第一連接端子以及一第二連接端子，該第一連接端子以及該第二連接端子分別用以與該待測電池的該第一端部以及該第二端部電性連接，其中該第一連接端子以及該第二連接端子其中一者具有一探針；其中，該探針用以接觸該待測電池的該氧化層，並透過該探針對該待測電池供電，使得電子得以穿過該氧化層抵達該第一端部，藉以產生一穿隧電流；一數據獲取裝置，電性連接該待測電池及該供電裝置，以形成一迴路；其中，該數據獲取裝置於該穿隧電流產生後，量測該穿隧電流的一電流值以及該待測電池的一電壓值；以及一計算裝置，通訊連接該供電裝置及/或該數據獲取裝置，該計算裝置根據該電壓值以及該電流值，計算出該待測電池的該內阻阻值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電池內阻量測系統</p>
        <p type="p">110:供電裝置</p>
        <p type="p">112:第一連接端子</p>
        <p type="p">114:第二連接端子</p>
        <p type="p">116:探針</p>
        <p type="p">116a:尖端</p>
        <p type="p">116b:鈍端</p>
        <p type="p">120:數據獲取裝置</p>
        <p type="p">130:計算裝置</p>
        <p type="p">900:待測電池</p>
        <p type="p">910:第一端部</p>
        <p type="p">920:第二端部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="611" publication-number="202624066">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624066</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148452</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>機車的前置物箱構造</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250218B">B62J9/00</main-classification>
        <further-classification edition="200601120250218B">B62K27/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光陽工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳奕雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周哲民</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關一種機車的前置物箱構造，機車至少包括有車架單元與蓋設於該車架單元外周的車體蓋單元；該車架單元設有轉向機構，該車架單元上方設有座墊；該轉向機構與該座墊之間的車體蓋單元上設有前置物箱，該前置物箱具有箱蓋，該箱蓋的下端連接有可使該箱蓋緩速開啟的緩衝機構。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:機車</p>
        <p type="p">2:車架單元</p>
        <p type="p">21:頭管</p>
        <p type="p">22:聯板機構</p>
        <p type="p">221:上聯板</p>
        <p type="p">222:下聯板</p>
        <p type="p">23:轉向機構</p>
        <p type="p">231:轉向把手</p>
        <p type="p">24:前叉單元</p>
        <p type="p">25:主車架</p>
        <p type="p">251:上側車架</p>
        <p type="p">2511:傾斜段</p>
        <p type="p">2512:延伸段</p>
        <p type="p">252:下側車架</p>
        <p type="p">253:腳踏管部</p>
        <p type="p">26:連接板架</p>
        <p type="p">261:連接桿</p>
        <p type="p">27:後車架</p>
        <p type="p">271:上升段</p>
        <p type="p">272:延設段</p>
        <p type="p">28:後搖臂</p>
        <p type="p">3:動力單元</p>
        <p type="p">31:汽缸部</p>
        <p type="p">32:傳動部</p>
        <p type="p">321:帶動件</p>
        <p type="p">6:後避震器</p>
        <p type="p">B:置物箱</p>
        <p type="p">C:空氣過濾裝置</p>
        <p type="p">C1:進氣管</p>
        <p type="p">H:散熱器</p>
        <p type="p">M:排氣裝置</p>
        <p type="p">T:燃油箱</p>
        <p type="p">V:節流閥體</p>
        <p type="p">FW:前輪</p>
        <p type="p">RW:後輪</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="612" publication-number="202624605">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624605</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148453</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>機車的構造</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250224B">F01N3/035</main-classification>
        <further-classification edition="201001120250224B">B62M6/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光陽工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭溫坐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卜俊宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周哲民</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關一種機車的構造，機車至少包括有車架單元、設於該車架單元上的動力單元；該車架單元連接有轉向機構，該轉向機構下方連接有前輪，該車架單元之頭管的後方設有空氣過濾裝置；該動力單元包含有汽缸部、設於該汽缸部下方的曲軸箱與連結於該曲軸箱的傳動部；該汽缸部連接有排氣裝置，該排氣裝置上設有觸媒器；該觸媒器係位於該前輪的後方、該汽缸部下方及該曲軸箱的前方之間，其中，該觸媒器係位於該空氣過濾裝置的前端緣與後端緣之間。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:機車</p>
        <p type="p">2:車架單元</p>
        <p type="p">21:頭管</p>
        <p type="p">22:聯板機構</p>
        <p type="p">221:上聯板</p>
        <p type="p">222:下聯板</p>
        <p type="p">23:轉向機構</p>
        <p type="p">231:轉向把手</p>
        <p type="p">24:前叉單元</p>
        <p type="p">25:主車架</p>
        <p type="p">251:上側車架</p>
        <p type="p">2511:傾斜段</p>
        <p type="p">2512:延伸段</p>
        <p type="p">252:下側車架</p>
        <p type="p">253:腳踏管部</p>
        <p type="p">26:連接板架</p>
        <p type="p">261:連接桿</p>
        <p type="p">27:後車架</p>
        <p type="p">271:上升段</p>
        <p type="p">272:延設段</p>
        <p type="p">28:後搖臂</p>
        <p type="p">3:動力單元</p>
        <p type="p">31:汽缸部</p>
        <p type="p">32:曲軸箱</p>
        <p type="p">33:傳動部</p>
        <p type="p">331:帶動件</p>
        <p type="p">6:後避震器</p>
        <p type="p">7:排氣裝置</p>
        <p type="p">71:排氣管部</p>
        <p type="p">72:消音部</p>
        <p type="p">8:觸媒器</p>
        <p type="p">B:置物箱</p>
        <p type="p">C:空氣過濾裝置</p>
        <p type="p">Ca:進氣管</p>
        <p type="p">H:散熱器</p>
        <p type="p">S:含氧感知器</p>
        <p type="p">T:燃油箱</p>
        <p type="p">V:節流閥體</p>
        <p type="p">FW:前輪</p>
        <p type="p">RW:後輪</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="613" publication-number="202623859">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623859</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148454</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>蛙鞋蹼板安裝機構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">A63B31/11</main-classification>
        <further-classification edition="200601120241231B">A63B31/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>天福國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIEN FU TRADING CO.,LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙鈺淇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAO, YU-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙鈺淇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAO, YU-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃翊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNAG, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方信恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, HSIN-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃信嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝煒勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種蛙鞋蹼板安裝機構，其包含一基座件、一壓板件及一扣件。該基座件設有供組接該蛙鞋腳套之一基座主體、至少一滑座及一第一移動單元。該壓板件設有一壓板主體、一活動區及一第二移動單元，該活動區凹設於該壓板主體頂面，該第二移動單元對應該第一移動單元而設於該壓板主體上，當該壓板件組接該基座件時，該活動區容置該滑座，該第一移動單元及該第二移動單元對應組接而供產生一相對位移。該扣件設有一夾持部、一對可撓曲部及一對鉗持單元，該夾持部一端相對兩側分別連接一個該可撓曲部一端，且各該可撓曲部另一端分別連接一個該鉗持單元，該對鉗持單元間的相應兩內側分別凹設有一嵌槽，以供一蹼板由該對嵌槽插入。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:蛙鞋蹼板安裝機構</p>
        <p type="p">10:基座件</p>
        <p type="p">100:基座主體</p>
        <p type="p">101:滑座</p>
        <p type="p">104:第一移動單元</p>
        <p type="p">11:壓板件</p>
        <p type="p">110:壓板主體</p>
        <p type="p">111:活動區</p>
        <p type="p">112:第二移動單元</p>
        <p type="p">12:扣件</p>
        <p type="p">120:夾持部</p>
        <p type="p">121:可撓曲部</p>
        <p type="p">122:鉗持單元</p>
        <p type="p">1220:嵌槽</p>
        <p type="p">2:蛙鞋腳套</p>
        <p type="p">3:蹼板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="614" publication-number="202624103">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624103</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148455</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於使用者導向以外顯切割器之安全膠台</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">B65H35/07</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞東學校財團法人亞東科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江倫志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳舒羨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳姝羽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李妤婕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃品慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何姵誼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張棓琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳嘉芊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝依琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張鈞堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃信嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝煒勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基於使用者導向以外顯切割器之安全膠台，供安裝一膠帶而進行使用，包括一膠台本體、一切割模組及一活動護蓋。其中該膠台本體包含一膠帶安裝部及一容置盒，該切割模組包含一刀板、一推桿及一彈力元件而設於該容置盒內，該刀板前端設有一刀刃部，該推桿活動樞接設於該刀板上，最後藉由該彈力元件連接該推桿及該刀板，使該推桿可連動該活動護蓋伸縮移動；操作時，該膠帶向下撕取而觸發該活動護蓋往內縮入，使該刀刃部向外顯露切斷該膠帶，使用後，透過該彈力元件將該活動護蓋向外彈出而包覆該刀刃部以達到防割效果，且不需改變使用習慣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基於使用者導向以外顯切割器之安全膠台</p>
        <p type="p">11:膠台本體</p>
        <p type="p">111:膠帶安裝部</p>
        <p type="p">1111:側蓋</p>
        <p type="p">11111:第一吸附件</p>
        <p type="p">1112:軸桿</p>
        <p type="p">11121:第二吸附件</p>
        <p type="p">112:容置盒</p>
        <p type="p">1121:開口</p>
        <p type="p">1122:第一限位部</p>
        <p type="p">12:切割模組</p>
        <p type="p">121:刀板</p>
        <p type="p">1211:刀刃部</p>
        <p type="p">1212:第二限位部</p>
        <p type="p">1213:樞接部</p>
        <p type="p">1214:第一卡鉤</p>
        <p type="p">1215:凹槽</p>
        <p type="p">1216:限位塊</p>
        <p type="p">122:推桿</p>
        <p type="p">1221:樞接孔</p>
        <p type="p">1222:推動部</p>
        <p type="p">1223:第二卡鉤</p>
        <p type="p">123:彈力元件</p>
        <p type="p">13:活動護蓋</p>
        <p type="p">131:遮蔽套環</p>
        <p type="p">1311:第三限位部</p>
        <p type="p">1312:第四限位部</p>
        <p type="p">1313:延伸板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="615" publication-number="202623706">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623706</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148456</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>寵物排便裝置以及對應監測方法</chinese-title>
        <english-title>PET DEFECATION DEVICE AND MONITORING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250218B">A01K1/01</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許綠庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, LU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許綠庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, LU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">寵物排便裝置包含儲存空間、多個荷重元件、站立平臺以及監測裝置。儲存空間容置一寵物的排泄物。多個荷重元件設置於儲存空間的上表面上。站立平臺設置於多個荷重元件上，用以提供寵物排便。多個荷重元件分別量測站立平臺重量產生多個重量值。監測裝置耦接多個荷重元件，接收多個重量值以產生一重心位置，並根據重心位置在一重心穩定框範圍內的持續時間判定該寵物是否正在此排便狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The pet defecation device includes a storage container, a plurality of load cells, a standing platform and a monitoring device. The storage container holds a pet's waste. A plurality of load cells is disposed on the upper surface of the storage container. The standing platform is disposed on the plurality of load cells to allow pets to stand and defecate. A plurality of load cells measures the weight of the standing platform respectively to generate a plurality of weight values. The monitoring device coupled to the plurality of load cells receives a plurality of weight values ​​to generate a center of gravity position and determines whether the pet is in the standing defecation state based on the duration of the center of gravity position within the range of a center of gravity stable frame.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:寵物排便裝置</p>
        <p type="p">110:儲存空間</p>
        <p type="p">111:上表面</p>
        <p type="p">112、115、121:開口</p>
        <p type="p">113:排泄物容器</p>
        <p type="p">114:側表面</p>
        <p type="p">120:站立平臺</p>
        <p type="p">130:荷重元件</p>
        <p type="p">140:監測裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="616" publication-number="202625076">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625076</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148461</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>個人調色行為分析研究系統及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251105B">G06Q90/00</main-classification>
        <further-classification edition="200601120251105B">B44D3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種個人調色行為分析研究系統及方法，該系統係可安裝並運行於一伺服器中，所述伺服器與複數採集終端進行通訊連接，用以數據化地記錄並分析使用者的調色行為。該系統係至少包含視覺介面設計單元、狀態管理與適時數據處理單元、調色軌跡的可視化單元、背景分離與物件偵測單元及畫筆位置追蹤單元。藉由該等單元記錄及分析使用者的調色行為，藉由背景分離技術精確追蹤畫筆與調色盤的交互，並基於畫筆位置判斷顏色使用，完整捕捉、分析調色行為，並轉化為可視化數據，以揭示使用者創作過程中的潛在模式，進而達到探索「藝術風格」之目的。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:調色行為分析研究系統</p>
        <p type="p">11:視覺介面設計單元</p>
        <p type="p">12:狀態管理與適時數據處理單元</p>
        <p type="p">13:調色軌跡的可視化單元</p>
        <p type="p">14:背景分離與物件偵測單元</p>
        <p type="p">15:畫筆位置追蹤單元</p>
        <p type="p">16:顏色偵測與混色行為分析單元</p>
        <p type="p">2:伺服器</p>
        <p type="p">3:採集終端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="617" publication-number="202624475">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624475</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148462</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔發泡錠及其製作方法</chinese-title>
        <english-title>FOAMING TABLET AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250207B">C11D7/26</main-classification>
        <further-classification edition="200601120250207B">C11D7/60</further-classification>
        <further-classification edition="200601120250207B">C11D17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馥泰國際有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FT INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>駿禾科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JYUN HE TECHNOLOGY COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳明鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MIN HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林坊云</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, FANG-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂有宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YOU-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何崇民</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種清潔發泡錠，以該清潔發泡錠的總重量計，其配方包含：一含量為5 wt%至50 wt%的聚乙烯醇、一含量為10 wt%至20 wt%的過碳酸鈉、一含量為10 wt %至30wt %的碳酸氫鈉、一含量為10 wt %至20 wt %的檸檬酸、一含量為1 wt%至10 wt% 的非離子介面活性劑、一含量為0.1 wt%至10 wt%的硬脂酸，以及一含量為1 wt%至10 wt%的甘油。以該配方所製得的該清潔發泡錠能夠在遇水後迅速分解，並具有優良的清潔效果，還能減少洗劑殘留。該清潔發泡錠在潮濕環境下不易碎裂，而有良好的儲存性。此外，本案還提供該清潔發泡錠的製作方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a foaming tablet. Based on a total weight of the foaming tablet, a formulation of the foaming tablet includes 5 wt% to 50 wt% of Polyvinyl Alcohol, 10 wt% to 20 wt% of Sodium percarbonate, 10 wt% to 30 wt% of Sodium bicarbonate, 10 wt% to 20 wt% of Citric acid, 1 wt% to 10 wt% of Nonionic surfactant, 0.1 wt% to 10 wt% of Stearic acid, and 1 wt% to 10 wt% of Glycerin. The foaming tablet can quickly dissolve in water and provide excellent cleaning performance while reducing detergent residue. Additionally, the foaming tablet is resistant to crumbling in a humid environment, making it suitable for storage. Besides, the invention also provides a manufacturing method of the foaming tablet.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S5:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="618" publication-number="202625048">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625048</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148468</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於顏色的紡織品確定方法及裝置</chinese-title>
        <english-title>COLOR-BASED TEXTILE IDENTIFICATION METHOD AND APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250512B">G06Q30/02</main-classification>
        <further-classification edition="201201120250512B">G06Q50/04</further-classification>
        <further-classification edition="200601120250512B">G01J3/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣保楊有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMARTEX SOLUTION TAIWAN LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊惠婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, HUEI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊凱強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, KAI-CHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯慶辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示了一種基於顏色的紡織品確定方法及裝置，方法包括：獲取目標顏色資料；基於目標顏色資料，在顏色空間中確定若干個色塊為候選顏色，其中，顏色空間中包括多個色塊，每個色塊具有對應的紡織品屬性；基於紡織品屬性的篩選條件，在候選顏色中篩選出若干個推薦顏色。本實施例的基於顏色的紡織品確定方法，從使用者提供的目標顏色出發，在顏色空間擴展一個合理的顏色範圍確定出然後選出更多的候選顏色，然後從紡織品屬性的維度篩選出符合預期的若干個顏色，顯著提升了顏色推薦的準確性和實用性，解決了傳統顏色匹配方法的多項缺陷，為紡織品設計領域提供了一種更加科學和高效的技術手段。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a method and apparatus for textile identification based on color. The method includes: acquiring target color data; based on the target color data, determining several color blocks as candidate colors in a color space, wherein the color space includes multiple color blocks, each corresponding to a textile property; and filtering the candidate colors based on filtering criteria related to textile properties to select several recommended colors. The color-based textile identification method of this embodiment starts with the target color provided by the user, expands a reasonable color range in the color space to determine additional candidate colors, and then filters out several colors that meet the expected criteria based on textile properties. This significantly improves the accuracy and practicality of color recommendation, addresses several shortcomings of traditional color matching methods, and provides a more scientific and efficient technical solution for the textile design field.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10:步驟</p>
        <p type="p">S30:步驟</p>
        <p type="p">S50:步驟</p>
        <p type="p">10:獲取模組</p>
        <p type="p">20:確定模組</p>
        <p type="p">30:篩選模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="619" publication-number="202623968">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623968</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148469</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電動工具</chinese-title>
        <english-title>POWER TOOL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250217B">B25F5/02</main-classification>
        <further-classification edition="200601120250217B">H01M10/48</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朝程工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TECHWAY INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐志華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIH HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭真真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHEN CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連正男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIEN, CHENG NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施心智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, HSIN CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱世仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電動工具，包含；一本體，形成有一主容室以及一電池容室；一接腳組，該接腳組具有一判斷接腳，設置於該電池容室內；一電動機組，設置於該本體之主容室，具有一電動機一微處理器及一判斷單元；一電池包，有一預定電壓值，一端設置有一導電接腳組與該接腳組電性相連，該導電接腳組設置有一身分接腳與該判斷接腳電性相連，該判斷單元與該判斷接腳電性相連，該判斷單元會偵測該電池包的電壓值，並傳送至該微處理器，該微處理器可依據電池包提供不同電壓值而對電動機切換不同操作模式。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power tool includes; a body formed with a main chamber and a battery chamber; a pin set with a detection pin disposed in the battery chamber; and a motor unit disposed in the main chamber. The motor unit has a motor, a microprocessor and a judgement unit; a battery pack has a predetermined voltage, and a conductive pin set is provided at one end to be electrically connected to the pin set; the conductive pin set is provided with an identity pin is electrically connected to the detection pin, and the judgement unit is electrically connected to the detection pin. The judgement unit detects the voltage value of the battery pack and transmits it to the microprocessor. The microprocessor can switch the motor to different operating modes according to the different voltage ​​provided by the battery pack.</p>
      </isu-abst>
      <representative-img>
        <p type="p">23:接腳組</p>
        <p type="p">231:判斷接腳</p>
        <p type="p">232:狀態偵測接腳</p>
        <p type="p">30:電池包</p>
        <p type="p">31:插入部</p>
        <p type="p">311:凸塊</p>
        <p type="p">32:導電接腳組</p>
        <p type="p">321:身分接腳</p>
        <p type="p">322:狀態接腳</p>
        <p type="p">40:電動機組</p>
        <p type="p">41:微處理器</p>
        <p type="p">411:判斷單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="620" publication-number="202624035">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624035</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148481</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具群組用電控制之電動車充電站之充電管理方法及系統</chinese-title>
        <english-title>CHARGING MANAGEMENT METHODS AND SYSTEMS FOR ELECTRIC VEHICLE CHARGING STATIONS WITH GROUP POWER USAGE CONTROL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250401B">B60L53/60</main-classification>
        <further-classification edition="201901120250401B">B60L53/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拓連科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOODOE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周凡凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, FAN-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡育庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊怡凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, YI-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉得權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, TE-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具群組用電控制之電動車充電站之充電管理方法及系統，適用於包括複數第一電動車充電站以及至少一第一伺服器之至少一充電場域，其中每一第一電動車充電站係透過一網路與第一伺服器耦接。首先，第一伺服器將第一電動車充電站組成複數第一充電群組並對第一充電群組執行一負載調整作業，且依據相應至少一充電場域之一第一電力限制指定每一第一充電群組一群組輸出電力上限值。第一伺服器透過網路由每一第一充電群組之每一第一電動車充電站接收相應至少一第一充電作業之一第一充電資料。第一伺服器依據由每一第一電動車充電站所接收相應至少一第一充電作業之第一充電資料計算相應每一第一充電群組之一用電量。接著，第一伺服器依據相應第一充電群組之用電量決定是否執行一調整作業以調整第一充電群組之群組輸出電力上限值，其中，在調整作業中，當特定充電群組之用電量持續低於相應之群組輸出電力上限值時，第一伺服器計算特定充電群組之一可用電量，並依據可用電量調低相應特定充電群組之群組輸出電力上限值且依據可用電量調高剩餘之第一充電群組之至少一者之群組輸出電力上限值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Charging management methods and systems for electric vehicle charging stations with group power usage control are provided, which is applicable to at least one charging field including a plurality of first electric vehicle charging stations and a first server, and the first electric vehicle charging stations are connected to the first server through a network. First, the first server divides the first electric vehicle charging stations into a plurality of first charging groups and performs a load adjustment operation on the first charging groups to assign a group output power limit value to each first charging group based on a power limit of the charging field. The first server receives first charging data of at least one first charging operation from each first electric vehicle charging station of each first charging group through the network. The first server calculates a power consumption of each first charging group based on the first charging data received from each first electric vehicle charging station. Then, the first server determines whether to perform an adjustment operation to adjust the group output power limit value of each first charging group based on the power consumption of the corresponding first charging group.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S610、S620、S630、S640:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="621" publication-number="202624038">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624038</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148482</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>應用人工智慧之電動車充電站之動態充電計價方法及系統</chinese-title>
        <english-title>DYNAMIC CHARGING PRICING METHODS AND SYSTEMS FOR ELECTRIC VEHICLE CHARGING STATIONS USING ARTIFICIAL INTELLIGENCE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250303B">B60L53/66</main-classification>
        <further-classification edition="201901120250303B">B60L53/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拓連科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOODOE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周凡凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, FAN-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江紀威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳竑霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HONG-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉建宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIEN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種應用人工智慧之電動車充電站之動態充電計價方法，適用於提供至少一電動車輛進行充電之一充電場域，該充電場域包括複數電動車充電站、及透過一網路與該等電動車充電站連接之一伺服器。首先，伺服器透過網路連接至每一電動車充電站，以取得相應每一電動車充電站之一充電資料並記錄一既定時間週期中相應每一電動車充電站之複數充電作業及充電作業對應之複數充電費率、複數充電費用及複數用電記錄以產生相應每一電動車充電站之一歷史充電記錄。接著，提供伺服器一人工智慧模組，其中，伺服器係以歷史充電記錄訓練人工智慧模組。伺服器透過人工智慧模組，依據歷史充電記錄產生相應既定時間週期中一特定時間段之一歷史用電資料，且依據歷史用電資料識別相應特定時間段之至少一用電高峰時段並計算相應至少一用電高峰時段之一第一費率。之後，透過人工智慧模組，於特定時間段之至少一用電高峰時段到達時，依據第一費率調整相應充電場域之一充電費率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Dynamic charging pricing methods and systems for electric vehicle charging stations using artificial intelligence applied to a charging field that provides at least one electric vehicle for charging and a server which is connected to the electric vehicle charging stations through a network are provided. The charging field includes a plurality of electric vehicle charging stations. First, the server records multiple charging operations and corresponding charging rates, fees, and electricity usage records over a predetermined time period to generate a historical charging record for each electric vehicle charging station. Next, an artificial intelligence (AI) module is provided to the server, where the server trains the AI module using the historical charging record. The server, through the AI module, generates historical electricity usage data for a specific time period within the predetermined time period based on the historical charging record, identifies at least one peak electricity usage period within the specific time period, and calculates a first rate for the peak electricity usage period. Then, when the at least one peak electricity usage period arrives, the charging rate for the charging field is adjusted based on the first rate through the AI module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S410、S420、S430、S440:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="622" publication-number="202624085">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624085</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148483</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>纏繞膜設備及纏繞方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251105B">B65B11/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻寶興業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張守綜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁玉芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種纏繞膜設備及纏繞膜方法，包括將待包裝的貨物放置於兩個可移動的第一膜架和第二膜架之間；該二膜架相對移動環繞貨物並進行初始纏繞；將一上蓋膜拉伸至所需長度，並切割成適合的尺寸；將切割好的上蓋膜覆蓋於貨物頂面，多餘部分自然垂下；該二膜架向上移動，同時膜卷持續旋轉，將薄膜由下往上纏繞包裹整個貨物，並包括上蓋膜自然垂下的部分；完成纏繞包裹後，該二膜架相離移動，貨物即可移出。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:機座</p>
        <p type="p">101:垂直護桿</p>
        <p type="p">11:第一膜架</p>
        <p type="p">12:第二膜架</p>
        <p type="p">21:膜卷</p>
        <p type="p">211:控制裝置</p>
        <p type="p">30:離合裝置</p>
        <p type="p">31:升降裝置</p>
        <p type="p">32:上蓋膜舖展裝置</p>
        <p type="p">321:上膜卷</p>
        <p type="p">322:膜卷架</p>
        <p type="p">323:拉膜器</p>
        <p type="p">324:切刀組</p>
        <p type="p">325:刀架</p>
        <p type="p">33:拉膜滑軌</p>
        <p type="p">331:移動件</p>
        <p type="p">40:上蓋膜夾具組</p>
        <p type="p">41:電控夾具</p>
        <p type="p">42:上蓋膜覆蓋裝置</p>
        <p type="p">421:縱向滑軌</p>
        <p type="p">422:鞍座</p>
        <p type="p">P1:第一位置</p>
        <p type="p">P2:第二位置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="623" publication-number="202624067">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624067</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148486</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>跨坐車輛</chinese-title>
        <english-title>STRADDLED VEHICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120241230B">B62J11/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三陽工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANYANG MOTOR CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡名岩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MING-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王宥惟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YOU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林松崑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SUNG-KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>易定芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明跨坐車輛，包含：車架、置物箱、第一電子裝置與第二電子裝置，車架在頭管位置設有頭管支架，並在右側車管位置設有側車管支架，而側車管支架設置於右側車管，且置物箱連接於右側車管，此外，第一電子裝置連接於頭管支架，而第二電子裝置連接於側車管支架的右側，使得沿著Z軸方向觀之，右側車管會重疊於側車管支架與一部分的第二電子裝置，而第二電子裝置的剩餘部分會朝向右側車管的右側凸出，藉此，當置物箱連接於右側車管，第一、二電子裝置能避開置物箱的安裝位置，使得置物箱能沿著X軸方向與Y軸方向擴大來增加置物箱的內部空間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a straddled vehicle comprising a frame, a storage box, a first electronic device, and a second electronic device. A head tube of the frame is provided with a head tube frame and a right side tube of the frame is provided with a side tube frame. The side tube frame is positioned directly under the right side tube. The storage box is connected to the right side tube. Moreover, the first electronic device is connected to the head tube frame, and the second electronic device is connected to the right side of the side tube frame, so that from the view along the z-axis, the right side tube covers the whole of the side tube frame and part of the second electronic device, and the remaining part of the second electronic device protrudes toward the right side of the right side tube. Therefore, when the storage box is connected to the right side tube, the assembling positions of the first electronic device and the second electronic device can be kept away from the assembling position of the storage box, so that the storage box can expand along the x-axis direction and the y-axis direction to increase the internal space of the storage box.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:跨坐車輛</p>
        <p type="p">10:車架</p>
        <p type="p">11:頭管</p>
        <p type="p">13:頭管支架</p>
        <p type="p">15:前車管</p>
        <p type="p">16:踏板管</p>
        <p type="p">17:側車管</p>
        <p type="p">171:左側車管</p>
        <p type="p">172:右側車管</p>
        <p type="p">19:側車管支架</p>
        <p type="p">30:置物箱</p>
        <p type="p">40:電子組件</p>
        <p type="p">41:第一電子裝置</p>
        <p type="p">42:第二電子裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="624" publication-number="202624772">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624772</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148488</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>動態測試管理預燒裝置及系統</chinese-title>
        <english-title>DYNAMIC TEST MANAGEMENT BURN-IN DEVICE AND SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">G01R31/30</main-classification>
        <further-classification edition="202001120250501B">G01R31/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>京元電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KING YUAN ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張世寶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, SHIH-BOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉大綱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, TA-KANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李明憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MING-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯永仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, YUNG-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TSUNG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種動態測試管理預燒裝置及系統；在一些實施例中，動態測試管理預燒裝置包括多個測試座、多個電源轉換器及多個控制器。該些電源轉換器適於自電源供應裝置接收第一電源，並對該些測試座分別供給第二電源。該些控制器分別包括多個電源偵測單元，適於偵測第二電源，並根據該些電源偵測單元之偵測結果控制該些電源轉換器之輸出或啟閉。第一電源之電壓大於第二電源之電壓，而第一電源之電流小於第二電源之電流。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A dynamic test management burn-in device and system are disclosed. In certain embodiments, the device comprises multiple test sockets, multiple power converters, and multiple controllers. Each power converter is configured to receive a first power supply from a power source and to provide a second power supply to the respective test sockets. Each controller includes a power detection unit, configured to detect the second power supply and to control the output or activation of the power converters based on the detection result from the power detection unit. The voltage of the first power supply is higher than that of the second power supply, while the current of the first power supply is lower than that of the second power supply.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:動態測試管理預燒裝置</p>
        <p type="p">2:測試座</p>
        <p type="p">3:電源轉換器</p>
        <p type="p">4:控制器</p>
        <p type="p">8:電源供應裝置</p>
        <p type="p">9:待測裝置</p>
        <p type="p">10:電路基板</p>
        <p type="p">11:動態測試管理預燒系統</p>
        <p type="p">12:電源介面</p>
        <p type="p">30:電源反饋單元</p>
        <p type="p">41:主控制器</p>
        <p type="p">42:子控制器</p>
        <p type="p">411:儲存單元</p>
        <p type="p">412:電源轉換器設定資料</p>
        <p type="p">421:電源偵測單元</p>
        <p type="p">P1:第一電源</p>
        <p type="p">P2:第二電源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="625" publication-number="202625568">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625568</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148489</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電容器結構及其製造方法</chinese-title>
        <english-title>CAPACITOR STRUCTURE AND METHOD FOR FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250204B">H10D1/60</main-classification>
        <further-classification edition="202501120250204B">H10D1/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳則甫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TSE-PU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李建宜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIEN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴聖輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI, SHENG-HUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電容器結構包括: 半導體基材、第一圖案化導電層、至少一個第一接觸插塞以及至少一個第二接觸插塞。半導體基材包括彼此鄰接的第一電性阱區和第二電性阱區。第一圖案化導電層位於半導體基材上，且包括彼此隔離的第一電極圖案和第二電極圖案，並在二者之間形成至少一個第一寄生電容。第一接觸插塞電性連接第一圖案化導電層和第一電性阱區。第二接觸插塞電性連接第二圖案化導電層和第二電性阱區，在第一電性阱區和第二電性阱區之間形成至少一個第二寄生電容。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A capacitor structure includes: a semiconductor substrate, a first patterned conductive layer, at least one first contact plug, and at least one second contact plug. The semiconductor substrate includes a first-conductivity well region and a second-conductivity well region adjacent to each other. The first patterned conductive layer is disposed on the semiconductor substrate and includes a first electrode pattern and a second electrode pattern that are separated from each other and form at least one first parasitic capacitance there between. The first contact plug electrically connects the first patterned conductive layer and the first-conductivity well region. The second contact plug is electrically connected to the second patterned conductive layer and the second-conductivity well region, so as to form at least one second parasitic capacitance between the first-conductivity well region and the second-conductivity well region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電容器結構</p>
        <p type="p">101:半導體基材</p>
        <p type="p">101D:第一電性深摻雜阱區</p>
        <p type="p">101J:p-n接面</p>
        <p type="p">101N:第一電性阱區</p>
        <p type="p">101P:第二電性阱區</p>
        <p type="p">101t:半導體基材的上表面</p>
        <p type="p">102:第一介電層</p>
        <p type="p">102t:第一介電層的上表面</p>
        <p type="p">103:第一接觸插塞</p>
        <p type="p">104:第二接觸插塞</p>
        <p type="p">106:第一導電層</p>
        <p type="p">106A:第一電極圖案</p>
        <p type="p">106B:第二電極圖案</p>
        <p type="p">107:第一寄生電容</p>
        <p type="p">108:第二寄生電容</p>
        <p type="p">110:圖案化金屬疊層</p>
        <p type="p">112:第二介電層</p>
        <p type="p">112t:第二介電層的上表面</p>
        <p type="p">116:第二導電層</p>
        <p type="p">116A:第三電極圖案</p>
        <p type="p">116B:第四電極圖案</p>
        <p type="p">116O:開口</p>
        <p type="p">117:第三寄生電容</p>
        <p type="p">122:第三介電層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="626" publication-number="202625138">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625138</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148490</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120250801B">G09G3/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHE-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董哲維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUNG, CHE-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李玫憶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, MEI-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭豫杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, YU-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱郁勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, YU-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉恩池</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, EN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊銘宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, MING-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種顯示裝置。顯示裝置包括顯示模組以及多個發光驅動電路。各個發光驅動電路包括時序電路以及驅動電路。時序電路，接收多個時脈訊號及前序發光時序訊號，以提供發光時序訊號及內部電壓。驅動電路接收多個相位訊號中、全開訊號以及內部電壓，以分別地提供多個發光驅動訊號到多個像素，從而致能多個像素。驅動電路更被配置成：在驅動模式下，基於多個相位訊號，依序地致能多個發光驅動訊號，從而依序地致能多個像素，以及在感測模式下，基於全開訊號，同時地致能多個發光驅動訊號，從而同時地致能致能多個像素。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure provides a display device. The display device includes a display module and a plurality of light-emitting driving circuits. Each light-emitting driving circuit includes a timing circuit and a driving circuit. The timing circuit receives multiple clock signals and a previous light-emitting timing signal to provide a light-emitting timing signal and an internal voltage. The driving circuit receives a plurality of phase signals, an all-on signal and the internal voltage to provide a plurality of light-emitting driving signals to a plurality of pixels respectively, thereby enabling the plurality of pixels. The driving circuit is further configured to: in a driving mode, based on the plurality of phase signals, sequentially enable multiple light-emitting driving signals to sequentially enable multiple pixels, and in a sensing mode, based on the all-on signal, enabling multiple light-emitting driving signals at the same time, thereby enabling multiple pixels at the same time.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示裝置</p>
        <p type="p">110:顯示模組</p>
        <p type="p">120:發光驅動器</p>
        <p type="p">121~123:發光驅動電路</p>
        <p type="p">AON:全開訊號</p>
        <p type="p">CK、XCK:時脈訊號</p>
        <p type="p">CTC:時序電路</p>
        <p type="p">CTD:驅動電路</p>
        <p type="p">GOFF:閘極關閉訊號</p>
        <p type="p">VSTV:發光起始訊號</p>
        <p type="p">EM[1]~EM[3]、EM[n]:發光時序訊號</p>
        <p type="p">ES[1]~ES[3]、ES[n]:發光驅動訊號</p>
        <p type="p">P[i]:相位訊號</p>
        <p type="p">PX:像素</p>
        <p type="p">Q:內部電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="627" publication-number="202625057">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625057</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148491</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>配方推薦系統及其方法</chinese-title>
        <english-title>RECIPE RECOMMENDATION SYSTEM AND METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250602B">G06Q30/0282</main-classification>
        <further-classification edition="202301120250602B">G06Q30/02</further-classification>
        <further-classification edition="202001120250602B">G06F40/44</further-classification>
        <further-classification edition="202301120250602B">G06N5/04</further-classification>
        <further-classification edition="202301120250602B">G06N3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳佳鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIA-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈宜萱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, YI-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅倆凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, LIANG-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李韋辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, WEI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種配方推薦系統，包含：配方分析與決策生成模組及多語言模型整合模組。配方分析與決策生成模組包含取樣模組及對話策略生成模組。多語言模型整合模組包含對話提示模組及權重調變模組。一種配方推薦方法，包含：分析配方與成品對應表以獲得成品集合，並基於成品集合生成對話策略；以及使用複數個語言模型處理對話策略，以推論出推薦成品。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A recipe recommendation system, comprising: a recipe analysis and decision generation module and a multilingual model integration module. The recipe analysis and decision generation module includes a sampling module and a dialogue strategy generation module. The multilingual model integration module includes a dialogue prompt module and a weight modulation module. A recipe recommendation method, comprising: analyzing a recipe and product correspondence table to obtain a product set, and generating a dialogue strategy based on the product set; and the multiple language models are used to process the dialogue strategy to infer a recommended product.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:配方推薦系統</p>
        <p type="p">110:配方分析與決策生成模組</p>
        <p type="p">111:取樣模組</p>
        <p type="p">112:對話策略生成模組</p>
        <p type="p">120:多語言模型整合模組</p>
        <p type="p">121:對話提示模組</p>
        <p type="p">122:權重調變模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="628" publication-number="202625144">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625144</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148496</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置及其畫素驅動方法</chinese-title>
        <english-title>DISPLAY APPARATUS AND METHOD OF DRIVING PIXELS THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120250123B">G09G3/3233</main-classification>
        <further-classification edition="201601120250123B">G09G3/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭景陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHING-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊銘宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, MING-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置及其畫素驅動方法。顯示裝置包括畫素陣列、源極驅動器、感測電路、計算電路、以及開關電路。畫素陣列具有多個畫素電路及耦接畫素電路的多個源極線，其中各個畫素電路具有位於電流路徑上的發光元件以及驅動電晶體。開關電路將這些源極線耦接至源極驅動器以及感測電路中的一者。在感測模式中，感測電路感測各個畫素電路中的驅動電晶體的導通電流，以提供感測電壓，並且計算電路基於這些感測電壓判斷各個畫素電路中的驅動電晶體的臨界電壓偏移以及載流子遷移率衰減，以校正源極驅動器提供的資料電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An display apparatus and a method of driving pixels thereof are provided. The display apparatus includes a pixel array, a source driver, a sensing circuit, a computing circuit, and a switching circuit. The pixel array has a plurality of pixel circuits and a plurality of source lines coupled to the pixel circuits, wherein each pixel circuit has a light-emitting element and a driving transistor located on a current path. The switching circuit couples the source lines to either the source driver or the sensing circuit. In a sensing mode, the sensing circuit senses a conduction current of the driving transistor in each pixel circuit to provide sensing voltages, and the computing circuit determines the threshold voltage offset and the mobility decay of the driving transistor in each pixel circuit based on the sensing voltages to correct data voltages provided by the source driver.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示裝置</p>
        <p type="p">110:時序控制器</p>
        <p type="p">120:源極驅動器</p>
        <p type="p">130:掃描驅動器</p>
        <p type="p">140:畫素陣列</p>
        <p type="p">150:發光驅動器</p>
        <p type="p">160:開關電路</p>
        <p type="p">170:感測電路</p>
        <p type="p">180:計算電路</p>
        <p type="p">C1:電容</p>
        <p type="p">EM:發光信號</p>
        <p type="p">Iph:電流路徑</p>
        <p type="p">LD1:微型發光二極體</p>
        <p type="p">Lsrc:源極線</p>
        <p type="p">PX:畫素電路</p>
        <p type="p">SCAN:掃描信號</p>
        <p type="p">SEN:感測信號</p>
        <p type="p">SIO_V:感測電壓</p>
        <p type="p">SSE:感測開關信號</p>
        <p type="p">T1~T5:電晶體</p>
        <p type="p">Vdata&lt;sub&gt;(sen)&lt;/sub&gt;:感測用資料電壓</p>
        <p type="p">Vdata:資料電壓</p>
        <p type="p">Vdata_new:校正後資料電壓</p>
        <p type="p">VDD:系統高電壓</p>
        <p type="p">VREF:第一參考電壓</p>
        <p type="p">VSS:系統低電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="629" publication-number="202624616">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624616</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148499</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>壓縮機</chinese-title>
        <english-title>COMPRESSOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">F04C29/00</main-classification>
        <further-classification edition="200601120241230B">F04C18/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江昌霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHANG-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐俊言</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OU, CHUN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林依萍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YI-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁坤億</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, KUN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王建昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIEN-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭麟雁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, LIN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">壓縮機包括固定渦卷、轉動渦卷及第一洩壓孔。轉動渦卷相對固定渦卷可轉動地配置。第一洩壓孔配置在固定渦卷。固定渦卷與轉動渦卷之間定義流體入口、第一壓力區、第二壓力區及第三壓力區，第一壓力區位於流體入口與第二壓力區之間，第二壓力區位於第一壓力區與第三壓力區之間，而第一洩壓孔位於第一壓力區與第二壓力區之一者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A compressor includes a fixed scroll, a rotating scroll and a pressure relief hole. The rotating scroll is disposed rotatably relative to the fixed scroll. The pressure relief hole is disposed on the fixed scroll. A fluid inlet, a first pressure zone, a second pressure zone and a third pressure zone are defined between the fixed scroll and the rotating scroll. The first pressure zone is located between the fluid inlet and the second pressure zone, the second pressure zone is located between the first pressure zone and the third pressure zone, and the pressure relief hole is located in one of the first pressure zone and the second pressure zone.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:壓縮機</p>
        <p type="p">110:固定渦卷</p>
        <p type="p">120:轉動渦卷</p>
        <p type="p">121:轉動渦卷載體</p>
        <p type="p">121s1:第三表面</p>
        <p type="p">121s2:第四表面</p>
        <p type="p">122:轉動渦卷葉片</p>
        <p type="p">123:偏心軸</p>
        <p type="p">130i:流體入口</p>
        <p type="p">P1:第一壓力區</p>
        <p type="p">P2:第二壓力區</p>
        <p type="p">P3:第三壓力區</p>
        <p type="p">140:閥門</p>
        <p type="p">150a:開孔</p>
        <p type="p">150g:通道</p>
        <p type="p">G1:氣體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="630" publication-number="202625639">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625639</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148501</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發光裝置</chinese-title>
        <english-title>LIGHT-EMITTING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10H20/855</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊元箴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHUANG, YUAN-ZHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃茂愷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, MAO-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林晃巖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HOANG YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇薪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YU-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林冠亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KUAN-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種發光裝置，包括：光源，用以發出照明光束；反射層，具有一第一空腔，所述光源位於所述第一空腔的底面；集光層，位於所述反射層上方，具有一第二空腔，所述第二空腔的底面與所述第一空腔的頂面對接；第一光場控制層，位於所述集光層上方，具有一第三空腔，所述第三空腔的底面與所述第二空腔的頂面相對；第二光場控制層，位於所述第一光場控制層上方，具有一第四空腔，所述第四空腔的底面與所述第三空腔的頂面相連，其中所述第一空腔與所述第二空腔組合成一下部空腔，其中所述反射層包括具有第一折射率的第一材料，所述下部空腔包括具有第二折射率的第二材料，所述集光層包括具有第三折射率的第三材料，其中所述第二折射率大於所述第一折射率，且所述第二折射率大於所述第三折射率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light-emitting device includes: a light source for emitting an illumination beam; a reflective layer having a first cavity, wherein the light source is located at the bottom of the first cavity; a light collecting layer disposed on the reflective layer and having a second cavity, a bottom surface of the second cavity connects with a top surface of the first cavity; a first light field control layer, disposed on the light collection layer, has a third cavity, wherein a bottom surface of the third cavity is facing a top surface of the second cavity; the second light field control layer, disposed on the first light field control layer, has a fourth cavity, and a bottom surface of the fourth cavity is connects with a top surface of the third cavity, wherein the first cavity and the second cavity are combined to form a lower cavity, wherein the reflective layer includes a first material with a first refractive index, and the lower cavity includes a second material having a second refractive index, the light collecting layer includes a third material having a third refractive index, wherein the second refractive index is greater than the first refractive index, and the second refractive index is greater than the third refractive index.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:發光裝置</p>
        <p type="p">102:發光區</p>
        <p type="p">104:吸光區</p>
        <p type="p">106:發光層</p>
        <p type="p">108:光場控制層</p>
        <p type="p">112:光源</p>
        <p type="p">114:反射層</p>
        <p type="p">116:第一空腔</p>
        <p type="p">116T、120T、126T、130T:頂面</p>
        <p type="p">118:集光層</p>
        <p type="p">120:第二空腔</p>
        <p type="p">120B、126B、130B:底面</p>
        <p type="p">122:銜接層</p>
        <p type="p">124:第一光場控制層</p>
        <p type="p">126:第三空腔</p>
        <p type="p">128:第二光場控制層</p>
        <p type="p">130:第四空腔</p>
        <p type="p">132:保護層</p>
        <p type="p">134:吸光層</p>
        <p type="p">136:抗反射膜</p>
        <p type="p">140:下部空腔</p>
        <p type="p">HBMR、W1、W2:寬度</p>
        <p type="p">HR、H1、H3、H4:高度</p>
        <p type="p">L:照明光束</p>
        <p type="p">LH、LL:長度</p>
        <p type="p">X、Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="631" publication-number="202624931">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624931</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148502</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智慧節能顯示裝置及其控制方法與應用其之電子系統</chinese-title>
        <english-title>SMART ENERGY-SAVING DISPLAY DEVICE, CONTROLLING METHOD AND ELECTRONIC SYSTEM USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120241231B">G06F1/3218</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>向瑞傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIANG, JUI-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴義昶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YI-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾緒祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, HSU-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種智慧節能顯示裝置及其控制方法與應用其之電子系統。智慧節能顯示裝置之控制方法包括以下步驟。以一用戶追蹤裝置偵測一用戶狀態。依據用戶狀態，決定是否啟動一極性模式調整程序。依據一當前畫面，獲得一極性調整模式。依據極性調整模式，調整智慧節能顯示裝置之一極性模式。顯示當前畫面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A smart energy-saving display device, a controlling method and an electronic system using the same are provided. The controlling method of the smart energy-saving display device includes the following steps. A user status is detected by a user tracking device. Whether a polarity mode adjustment procedure is enabled is determined according to the user status. A polarity adjustment mode is obtained according to a current frame. A polarity mode of the smart energy saving display device is adjusted according to the polarity adjustment mode. The current frame is displayed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:用戶追蹤裝置</p>
        <p type="p">110:偵測器</p>
        <p type="p">120:微處理器</p>
        <p type="p">200:主機</p>
        <p type="p">210:記憶體</p>
        <p type="p">220:處理器</p>
        <p type="p">300:智慧節能顯示裝置</p>
        <p type="p">310:記憶體</p>
        <p type="p">320:時序控制器</p>
        <p type="p">321:神經處理器</p>
        <p type="p">330:訊號轉換器</p>
        <p type="p">340:源驅動器</p>
        <p type="p">350:背光驅動單元</p>
        <p type="p">360:顯示面板</p>
        <p type="p">370:背光模組</p>
        <p type="p">1000:電子系統</p>
        <p type="p">CM:控制訊號</p>
        <p type="p">FM0:當前畫面</p>
        <p type="p">PM:極性模式</p>
        <p type="p">PMa:極性調整模式</p>
        <p type="p">PMc:候選極性模式</p>
        <p type="p">PWc:功耗總值</p>
        <p type="p">TB:查找表</p>
        <p type="p">US:用戶狀態</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="632" publication-number="202625077">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625077</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148503</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>圖像生成方法與應用其之圖像生成系統</chinese-title>
        <english-title>IMAGE GENERATION METHOD AND IMAGE GENERATION SYSTEM USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">G06T1/00</main-classification>
        <further-classification edition="202401120250303B">G06T3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李季剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHI-KANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐文正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, WEN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林士豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIH-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王傑生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIEH-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種圖像生成方法與應用其之圖像生成系統。圖像生成方法包括以下步驟。執行一文字轉圖像程序，以依據一文字提示，生成一基礎圖像。執行一圖像擴展繪製程序，以依據基礎圖像，獲得一已擴展圖像。執行一解析度調整程序，以調整已擴展圖像之解析度後，獲得一已調解析度影像。執行一隱藏浮水印合成程序，以對已調解析度影像合成一隱藏浮水印後，獲得一生成影像。文字轉圖像程序、圖像擴展繪製程序、解析度調整程序及隱藏浮水印合成程序透過一圖形處理器及一神經處理器以一管線化的方式執行。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image generation method and an image generation system using the same are provided. The image generation method includes the following steps. A text-to-image conversion procedure is executed according to a prompt to generate a basic image. An image out-painting procedure is executed according to the basic image to obtain an out-painted image. A resolution adjustment procedure is executed to adjust a resolution of the out-painted image to and an adjusted resolution image is obtained. A hidden watermark synthesis procedure is executed to synthesize a hidden watermark on the adjusted resolution image and a generated image is obtained. The text-to-image conversion procedure, the image out-painting procedure, the resolution adjustment procedure and the hidden watermark synthesis procedure are executed in a pipeline manner through a Graphic Processing Unit (GPU) and a Neural network Processing Unit (NPU).</p>
      </isu-abst>
      <representative-img>
        <p type="p">IM1:基礎圖像</p>
        <p type="p">IM8:已擴展圖像</p>
        <p type="p">IM9:已調解析度影像</p>
        <p type="p">IM10:生成影像</p>
        <p type="p">PD1:文字轉圖像程序</p>
        <p type="p">PD2:圖像擴展繪製程序</p>
        <p type="p">PD3:解析度調整程序</p>
        <p type="p">PD4:隱藏浮水印合成程序</p>
        <p type="p">PT:文字提示</p>
        <p type="p">WM:隱藏浮水印</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="633" publication-number="202625078">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625078</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148505</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>圖像生成方法、圖像再生方法及應用其之電子裝置</chinese-title>
        <english-title>IMAGE GENERATING METHOD, IMAGE REPRODUCING METHOD AND ELECTRONIC DEVICE USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">G06T1/00</main-classification>
        <further-classification edition="202401120250303B">G06T3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李季剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHI-KANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林士豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIH-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和　佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANTERO CLARES, SERGIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王傑生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIEH-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種圖像生成方法、圖像再生方法及應用其之電子裝置。圖像生成方法包括以下步驟。獲得一生成提示（prompt）、一擴散種子（stable diffusion seed）及一擴展種子（out painting seed）。依據生成提示、擴散種子及擴展種子，以一圖像生成模型，獲得一生成圖像。將生成提示、擴散種子及擴展種子編碼為一隱藏式浮水印。將隱藏式浮水印加入生成圖像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image generating method, an image reproducing method and an electronic device using the same are provided. The image generating method includes the following steps. A prompt, a stable diffusion seed and an out painting seed are obtained. A generation image is obtained by an image generating model according to the prompt, the stable diffusion seed and the out painting seed. The prompt, the stable diffusion seed and the out painting seed are encoded into a hidden watermark. The hidden watermark is added to the generation image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">210:影像擷取單元</p>
        <p type="p">IM11:生成圖像</p>
        <p type="p">IM12:擷取圖像</p>
        <p type="p">IM13:再生圖像</p>
        <p type="p">WM1:隱藏式浮水印</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="634" publication-number="202623730">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623730</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148506</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可調拉力的隱藏滑軌</chinese-title>
        <english-title>A HIDDEN SLIDE RAIL FOR ADJUSTING TENSILE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120241231B">A47B88/40</main-classification>
        <further-classification edition="201701120241231B">A47B88/477</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林敬哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHING-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林敬哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHING-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>易定芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明可調拉力的隱藏滑軌，包含：支架、調整組件、活動組件、阻尼器、滑動件與彈簧，支架的組裝部連接物件，調整組件具有旋鈕與罩體來設置於支架的開口部，而旋鈕具有位在開口部內側的鋸齒端與位於開口部外側的扳動端，罩體卡扣於開口部，且活動組件具有鋸齒部、滑塊部與勾扣部，鋸齒部齧合於鋸齒端，滑塊部組裝於支架的軌道部，使得活動組件能透過軌道部來進行直線移動，藉此，當旋鈕被相對於支架旋轉時，活動組件會被旋鈕移動來拉動彈簧，使得彈簧能從原始待機長度改變成調整待機長度，讓隱藏滑軌的拉力可以被改變來乘載不同的物件重量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a hidden slide rail for adjusting tensile force, the hidden slide rail comprises a frame, an adjusting member, a moving member, a damper, a sliding member, and a spring. The frame is provided with an assembling portion to connect to an object. The adjusting member is provided with a knob and a hood to be assembled on an opening portion of the frame. The knob has a saw-tooth end located at an inner side of the opening portion and an operating end located at an external side of the opening portion. The hood is snapped onto the opening portion for positioning the knob. The moving member includes a saw-tooth portion, a sliding portion, and a locking portion. The saw-tooth portion meshes the saw-tooth end. The sliding portion is assembled with a rail portion, so that the moving member can cooperate with the rail portion to move along a linear line. When the knob is rotated relative to the frame, the moving member will be moved by the knob to pull the spring, so that a length of the spring can be changed from an original length to an adjusted length. Therefore, the tensile force of the hidden slide rail can be changed for loading different weight of the object.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:隱藏滑軌</p>
        <p type="p">2:支架</p>
        <p type="p">22:軌道部</p>
        <p type="p">23:開口部</p>
        <p type="p">3:調整組件</p>
        <p type="p">31:旋鈕</p>
        <p type="p">311:鋸齒端</p>
        <p type="p">32:罩體</p>
        <p type="p">4:活動組件</p>
        <p type="p">43:導向輪</p>
        <p type="p">5:阻尼器</p>
        <p type="p">6:滑動件</p>
        <p type="p">7:彈簧</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="635" publication-number="202625485">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625485</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148509</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智慧家居設備控制系統</chinese-title>
        <english-title>INTELLIGENT DOMESTIC APPLIANCE CONTROL SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120241231B">H04W64/00</main-classification>
        <further-classification edition="201801120241231B">H04W4/33</further-classification>
        <further-classification edition="201801120241231B">H04W4/38</further-classification>
        <further-classification edition="200601120241231B">G06F3/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英華達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC APPLIANCES CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭智軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, CHIH-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李哲偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHE-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種智慧家居設備控制系統包含移動終端設備、數個存取點以及雲端伺服器。移動終端設備配置以測量移動終端設備之方位角以及俯仰角。存取點配置以：對數個家居設備定位以取得家居設備之數個位置；以及分別測量存取點與移動終端設備之間之數個距離。雲端伺服器配置以判斷移動終端設備之位置是否變化並計算移動終端設備之位置。雲端伺服器配置以判斷移動終端設備之方位角以及俯仰角是否變化並計算移動終端設備之指向。雲端伺服器配置以響應於來自移動終端設備之使用者介面之控制訊號控制與控制訊號對應之家居設備中之至少一者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An intelligent domestic appliance control system includes a mobile terminal apparatus, a plurality of access points, and a cloud server. The mobile terminal apparatus is configured to measure an azimuth and a pitch of the mobile terminal apparatus. The access points are configured to: position a plurality of domestic appliances to obtain a plurality of locations of the domestic appliances; and respectively measure a plurality of distances between the access points and the mobile terminal apparatus. The cloud server is configured to determine whether a location of the mobile terminal apparatus changes and calculate the location of the mobile terminal apparatus. The cloud server is configured to determine whether the azimuth and the pitch of the mobile terminal apparatus change and calculate an orientation of the mobile terminal apparatus. The cloud server is configured to control at least one of the domestic appliances corresponding to a control signal from a user interface of the mobile terminal apparatus in response to the control signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:智慧家居設備控制系統</p>
        <p type="p">110:移動終端設備</p>
        <p type="p">112,122:通訊裝置</p>
        <p type="p">114:經緯計算裝置</p>
        <p type="p">116:慣性測量裝置</p>
        <p type="p">120:雲端伺服器</p>
        <p type="p">123:資料庫</p>
        <p type="p">124:定位裝置</p>
        <p type="p">126:指向計算裝置</p>
        <p type="p">127:選擇裝置</p>
        <p type="p">128:控制裝置</p>
        <p type="p">ITN:網路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="636" publication-number="202624991">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624991</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148510</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於零信任環境的動態信任推斷系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR DYNAMIC TRUST INFERENCE IN ZERO-TRUST ENVIRONMENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120250303B">G06F21/31</main-classification>
        <further-classification edition="201301120250303B">G06F21/55</further-classification>
        <further-classification edition="202201120250303B">H04L9/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭睿哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, JUI-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華荐治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUA, CHIEN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周國森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, KUO-SEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於零信任環境的動態信任推斷系統和動態信任推斷方法，該方法包含：通訊連接至零信任環境的存取閘道；響應於偵測到使用者設備向存取閘道發出的登入請求，收集與登入請求有關的數據；分析數據以獲取分析結果；獲取與數據相關的歷史資料；根據數據和歷史資料來檢測登入行為的異常情況，以獲取檢測結果；根據分析結果和檢測結果，分別推斷基礎分數和動態調整分數；以及根據基礎分數和動態調整分數推斷信任分數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and a method for dynamic trust inference in zero-trust environments are provided. The method includes: communicatively connecting to an access gateway in a zero-trust environment; in response to detecting a login request from a user device to the access gateway, collecting data related to the login request; analyzing the data to obtain an analytical result; retrieving historical data associated with the data; detecting anomalies in login behavior based on the data and historical data to obtain a detection result; inferring a basic score and a dynamic adjustment score based on the analytical result and detection result respectively; and inferring a trust score based on the basic score and the dynamic adjustment score.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S201、S202、S203、S204、S205、S206、S207:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="637" publication-number="202625162">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625162</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148511</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於仿聲翻譯的系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR VOICE MIMICKING TRANSLATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">G10L15/26</main-classification>
        <further-classification edition="200601120250303B">G10L13/00</further-classification>
        <further-classification edition="202001120250303B">G06F40/58</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIA-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種用於仿聲翻譯的系統及方法。所述方法包括以下步驟：訊號前處理模組對原始語音訊號執行前處理操作來獲得前處理後的原始語音訊號；多語言語音辨識模組利用前處理後的原始語音訊號來獲得原始語言種類以及原始語言文字；多語言翻譯模組利用原始語言種類、原始語言文字以及目標語言種類來獲得目標語言文字；以及多語言語音仿聲合成模組利用前處理後的原始語音訊號以及目標語言文字來獲得翻譯後語音訊號，其中翻譯後語音訊號包括對應於原始語音訊號的音色以及語調。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and a method for voice mimicking translation are provided. The method includes following steps: a signal-pre-processing-module performs a pre-processing operation on an original voice signal to obtain the pre-processed original voice signal; a multilingual-voice-recognition-module uses the pre-processed original voice signal to obtain an original language type and an original language text; a multilingual-translation-module uses the original language type, the original language text, and a target language type to obtain a target language text; and a multilingual-voice-mimicking-synthesis-module uses the pre-processed original voice signal and the target language text to obtain a translated voice signal, wherein the translated voice signal includes a timbre and an intonation corresponding to the original voice signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S61、S62、S63、S64:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="638" publication-number="202624023">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624023</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148513</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多功能事務機</chinese-title>
        <english-title>MULTI-FUNCTION PERIPHERAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250311B">B41L21/02</main-classification>
        <further-classification edition="200601120250311B">B41L23/00</further-classification>
        <further-classification edition="200601120250311B">B41L39/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金寶電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINPO ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宏瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HUNG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭宗樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, TSUNG-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃耀德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YAO-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉桂梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KUEI-MEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林瑋翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEI-XIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種多功能事務機，包括機體、雷射掃描模組以及控制模組。機體具有饋紙區、紙張傳送路徑與出紙區，其中紙張傳送路徑的上游連接饋紙區，紙張傳送路徑的下游連接出紙區。設置於機體內的雷射掃描模組包括雷射發射器、旋轉式多面鏡與反射模組。控制模組電性連接雷射發射器、旋轉式多面鏡與反射模組，以驅動雷射發射器產生第一光束射至旋轉式多面鏡，經旋轉式多面鏡反射成多個第二光束射至反射模組，再從反射模組反射成多個第三光束射至下游。當紙張行經下游時，第三光束在紙張上間隔地打孔而形成預裁線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multi-function peripheral including a body, a laser scanning module, and a control module is provided. The body has a paper feeding zone, a paper transferring route, and a paper outputting zone, wherein an upstream of the paper transferring route is connected to the paper feeding zone, and a downstream of the paper transferring route is connected to the paper outputting zone. The laser scanning module disposed in the body includes a laser transmitter, a rotatable polygon mirror, and a reflection module each electrically connected to the control module. The control module drives the laser transmitter to emit a first beam to the rotatable polygon mirror, and the first beam is reflected by the rotatable polygon mirror into a plurality of second beams directed to the reflection module. Then the second beams are reflected into a plurality of third beams and projected to the downstream. When a paper passes through the downstream, the third beams punch a plurality of holes at intervals to form a pre-cut line.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:多功能事務機</p>
        <p type="p">11:機體</p>
        <p type="p">12:紙張傳送路徑</p>
        <p type="p">12a:上游</p>
        <p type="p">12b:下游</p>
        <p type="p">13:饋紙區</p>
        <p type="p">14:出紙區</p>
        <p type="p">100:雷射掃描模組</p>
        <p type="p">110:雷射發射器</p>
        <p type="p">120:旋轉式多面鏡</p>
        <p type="p">130:反射模組</p>
        <p type="p">200:電子成像系統</p>
        <p type="p">300:定型模組</p>
        <p type="p">L2:第六光束</p>
        <p type="p">S1、S2、S3:感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="639" publication-number="202624018">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624018</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148515</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具自我演算氣壓煞車的移印機</chinese-title>
        <english-title>A PAD PRINTING MACHINE WITH SELF-CALCULATING PNEUMATIC BRAKE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250417B">B41F1/32</main-classification>
        <further-classification edition="200601120250417B">B41F7/02</further-classification>
        <further-classification edition="200601120250417B">B41F33/14</further-classification>
        <further-classification edition="200601120250417B">B41F17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佳因企業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FINECAUSE ENTERPRISE COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇克政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, KO-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>易定芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明具自我演算氣壓煞車的移印機包含：氣體供應裝置、氣壓迴路、氣壓缸、平移機構、感應器、兩調整裝置與控制器，其中，氣體供應裝置能透過氣壓迴路將氣體輸送至氣壓缸，氣壓迴路具有兩氣體流路，分別連接至氣壓缸的兩氣壓室，通過控制氣體流向驅動氣壓缸使得平移機構向前或向後移動，而感應器能感測平移機構的移動速度，控制器將依據此速度計算出最佳煞停時間，再透過調節調整裝置改變氣體流路的管徑來減少排氣流量，本發明在平移機構每次運行時，皆能依據不同速度實現精準煞車，使得移印機不再需要維護與校正。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention is related to a pad printing machine with self-calculating pneumatic brake, the pad printing machine comprising: an air supply device, an air circuit, an air cylinder, a moving assembly, a sensor, two adjustment devices and a controller; wherein the air supply device transports air through the air circuit to the air cylinder. The air circuit has two flowing paths for connecting to two chambers of the air cylinder respectively. The controller chooses one of the flowing paths to supply air into the air cylinder, so that the moving assembly is moved forward or backward by the air cylinder. The sensor senses a moving speed of the moving assembly, and the controller will calculate an optimal braking time according to the moving speed. Then the diameter of the air circuit is changed by the adjustment device to reduce an exhaust flow of the air circuit. Therefore, the pad printing machine can change the braking status according the moving speed of the moving assembly every time without routine calibrating and maintaining.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:移印機</p>
        <p type="p">2:氣體供應裝置</p>
        <p type="p">3:氣壓迴路</p>
        <p type="p">31:五口電磁閥</p>
        <p type="p">32:第一氣體流路</p>
        <p type="p">321:第一進氣流道</p>
        <p type="p">322:第一煞車流道</p>
        <p type="p">323:第一連接流道</p>
        <p type="p">33:第二氣體流路</p>
        <p type="p">331:第二進氣流道</p>
        <p type="p">332:第二煞車流道</p>
        <p type="p">333:第二連接流道</p>
        <p type="p">4:氣壓缸</p>
        <p type="p">41:主體部</p>
        <p type="p">42:推桿</p>
        <p type="p">421:分隔板</p>
        <p type="p">422:桿部</p>
        <p type="p">43:腔室</p>
        <p type="p">431:第一氣壓室</p>
        <p type="p">432:第二氣壓室</p>
        <p type="p">5:平移機構</p>
        <p type="p">51:感應片</p>
        <p type="p">6:移動軌道</p>
        <p type="p">61:定位螺絲</p>
        <p type="p">62:感應器</p>
        <p type="p">7:調整裝置</p>
        <p type="p">71:第一三口電磁閥</p>
        <p type="p">72:第二三口電磁閥</p>
        <p type="p">90:第一調速閥</p>
        <p type="p">91:第二調速閥</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="640" publication-number="202625647">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625647</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148516</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250416B">H10H29/80</main-classification>
        <further-classification edition="202501120250416B">H10H29/85</further-classification>
        <further-classification edition="202501120250416B">H10H29/855</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>俞方正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, FANG-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置，包括電路基板、第一發光二極體、第一墊高層、第二發光二極體、色轉換層、第一光學封裝層、擋牆結構以及介面層。第一發光二極體透過第一電極設置於電路基板上。第一墊高層設置於電路基板上。第二發光二極體透過第二電極設置於第一墊高層上。色轉換層包覆第一發光二極體。第一光學封裝層包覆第二發光二極體，第一光學封裝層具有朝向第二發光二極體的凹面。擋牆結構位於電路基板上並覆蓋色轉換層的側面、第一光學封裝層的側面及第一墊高層的側面。介面層位於第一光學封裝層之上。第一發光二極體與第二發光二極體之間具有高度差。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device includes a circuit substrate, a first LED, a first elevating layer, a second LED, a color conversion layer, a first optical encapsulation layer, a block wall structure and an interface layer. The first LED is disposed on the circuit substrate through a first electrode. The first elevating layer is disposed on the circuit substrate. The second LED is disposed on the first elevating layer through a second electrode. The color conversion layer wraps the first LED. The first optical encapsulation layer warps the second LED and includes a concave surface facing the second LED. The block wall structure is disposed on the circuit substrate and covers a side surface of the color conversion layer, a side surface of the first optical encapsulation layer and a side surface of the first elevating layer. The interface layer is located on the first optical encapsulation layer. A height difference exists between the first LED and the second LED.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示裝置</p>
        <p type="p">110:電路基板</p>
        <p type="p">121:第一發光二極體</p>
        <p type="p">121F、131F、141F:出光面</p>
        <p type="p">122:第一電極</p>
        <p type="p">131:第二發光二極體</p>
        <p type="p">132:第二電極</p>
        <p type="p">141:第三發光二極體</p>
        <p type="p">142:第三電極</p>
        <p type="p">150:第一墊高層</p>
        <p type="p">151、CCB、OC1B:側面</p>
        <p type="p">170:玻璃基板</p>
        <p type="p">A-A’:剖面線</p>
        <p type="p">BM:遮光層</p>
        <p type="p">C1:第一顏色</p>
        <p type="p">C2:第二顏色</p>
        <p type="p">C3:第三顏色</p>
        <p type="p">CC:色轉換層</p>
        <p type="p">CF1、CF2:彩色濾光層</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">h1:厚度</p>
        <p type="p">H1:深度</p>
        <p type="p">L:距離</p>
        <p type="p">L1、L2、L3:高度</p>
        <p type="p">ML:介面層</p>
        <p type="p">OC1:第一光學封裝層</p>
        <p type="p">UF1:凹面</p>
        <p type="p">WB:擋牆結構</p>
        <p type="p">WBT:頂面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="641" publication-number="202625651">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625651</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148518</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示面板及其製造方法</chinese-title>
        <english-title>DISPLAY PANEL AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250204B">H10K50/84</main-classification>
        <further-classification edition="202301120250204B">H10K50/844</further-classification>
        <further-classification edition="202301120250204B">H10K59/80</further-classification>
        <further-classification edition="202301120250204B">H10K71/00</further-classification>
        <further-classification edition="200601120250204B">G09F9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富為</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, FU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許凱閎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, KAI HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王勝進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHENG-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示面板包括基板、多個發光元件、多個接墊以及封裝層。基板設有顯示區與接墊區。多個發光元件設置在基板的顯示區內。多個接墊設置在基板的接墊區內。封裝層覆蓋多個發光元件，且未覆蓋多個接墊。封裝層具有鄰近接墊區的翹曲部。翹曲部與基板的基板表面之間設有間隙。間隙沿著基板表面的法線方向具有間隙高度，且間隙高度隨著接近多個接墊而增加。一種顯示面板的製造方法也被提出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display panel including a substrate, a plurality of light emitting devices, a plurality of pads and an encapsulation layer is provided. The substrate is provided with a display area and a pad area. The plurality of light emitting devices are disposed in the display area of the substrate. The plurality of pads are disposed in the pad area of the substrate. The encapsulation layer covers the plurality of light emitting devices and does not cover the plurality of pads. The encapsulation layer has a warped portion adjacent to the pad area. A gap is provided between the warped portion and a substrate surface of the substrate. The gap has a gap height along a normal direction of the substrate surface, and the gap height increases as it approaches the plurality of pads. A manufacturing method of the display panel is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:顯示面板</p>
        <p type="p">100:基板</p>
        <p type="p">100sf:基板表面</p>
        <p type="p">110:接墊</p>
        <p type="p">120:發光元件</p>
        <p type="p">140:封裝層</p>
        <p type="p">140t1、140t2:厚度</p>
        <p type="p">140wp:翹曲部</p>
        <p type="p">180:封裝體</p>
        <p type="p">200:柔性電路板</p>
        <p type="p">BFA:緩衝區</p>
        <p type="p">DA:顯示區</p>
        <p type="p">G:間隙</p>
        <p type="p">Hg:間隙高度</p>
        <p type="p">PDA:接墊區</p>
        <p type="p">W:寬度</p>
        <p type="p">WA:翹曲區</p>
        <p type="p">X、Y、Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="642" publication-number="202625375">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625375</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148520</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>訊號產生裝置以及頻率校正電路</chinese-title>
        <english-title>SIGNAL GENERATION DEVICE AND FREQUENCY CALIBRATION CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">H03L7/08</main-classification>
        <further-classification edition="200601120250303B">H03L7/099</further-classification>
        <further-classification edition="200601120250303B">H03L7/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立積電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHWAVE TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張博鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, PO CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種訊號產生裝置以及頻率校正電路。訊號產生裝置包括壓控振盪器以及頻率校正電路。壓控振盪器根據第一控制訊號及第二控制訊號提供振盪訊號。頻率校正電路將第一控制訊號比較到至少一閾值電壓以產生至少一比較訊號，且根據至少一比較訊號產生第二控制訊號。至少一閾值電壓的電壓位準的變化方向與振盪訊號的直流成分的電壓位準的變化方向一致。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A signal generation device and a frequency calibration circuit are provided. The signal generation device includes a voltage controlled oscillator (VCO) and the frequency calibration circuit. The VCO provides an oscillation signal according to a first control signal and a second control signal. The frequency calibration circuit compares the first control signal with at least one threshold voltage to generate at least one comparison signal, and generates the second control signal according to the at least one comparison signal. A variation direction of a voltage level of the at least one threshold is equal to a variation direction of a voltage level of a direct current (DC) component of the oscillation signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:訊號產生裝置</p>
        <p type="p">110:頻率校正電路</p>
        <p type="p">OSC:振盪訊號</p>
        <p type="p">VCO:壓控振盪器</p>
        <p type="p">Vctrl、Cctrl:控制訊號</p>
        <p type="p">Vth1、Vth2:閾值電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="643" publication-number="202625088">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625088</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148522</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>拍攝設備位姿確定方法、電子設備及儲存介質</chinese-title>
        <english-title>METHOD FOR DETERMINING POSE OF CAMERA DEVICE, ELECTRONIC DEVICE AND STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120250602B">G06T7/80</main-classification>
        <further-classification edition="201801120250602B">H04N13/204</further-classification>
        <further-classification edition="202201220250602B">B60R1/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富智捷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOBILE DRIVE TECHNOLOGY CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張傑閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIEH-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種拍攝設備位姿確定方法、電子設備及儲存介質。該方法包括：根據起點位置的標定板的第一標定圖像，確定第一拍攝設備與中繼拍攝設備的第一相對位姿；根據每次移動的標定板拍攝的第二標定圖像，確定跟隨標定板進行所述每次移動之前與之後的中繼拍攝設備的第二相對位姿；根據第二拍攝設備的視野中的標定板的第三標定圖像，確定中繼拍攝設備與第二拍攝設備的第三相對位姿；依據第一相對位姿、第二相對位姿及第三相對位姿，確定第一拍攝設備與第二拍攝設備之間的相對位姿關係。利用上述方法，能夠準確確定拍攝設備之間的相對位姿。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides a method for determining a pose of a camera device, an electronic device and a storage medium. The method includes: determining a first relative pose between a first camera device and a relay camera device based on first calibration images of a calibration plate at an initial position; based on second calibration images of the calibration plate for the each movement, determining a second relative pose between the relay camera device before moving at each time and the relay camera device after moving at each time while following movements of the calibration plate; determining a third relative pose between the relay camera device and a second camera device based on third calibration images of the calibration plate within a field of view of the second camera device, determining a relative pose relationship between the first camera device and the second camera device based on the first relative pose, the second relative pose, and the third relative pose. By utilizing the present application, the relative pose between camera devices can be accurately determined.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S11~S14:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="644" publication-number="202625093">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625093</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148523</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>點雲生成方法、裝置、電子設備及電腦可讀存儲介質</chinese-title>
        <english-title>POINT CLOUD GENERATION METHOD, EQUIPMENT, ELECTRONIC DEVICE AND COMPUTER READABLE STORAGE MEDIA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">G06T17/00</main-classification>
        <further-classification edition="201101120250303B">G06T19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>疆域醫創科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANGYU INNOVATIVE MEDICAL TECHNOLOGY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TSUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭　振鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUOK, CHAN-PANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MO</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及一種點雲生成方法、裝置、電子設備及電腦可讀存儲介質。該點雲生成方法包括：獲取目標物體的醫學影像資料；在醫學影像資料中，基於亨氏值篩選目標物體的體素，得到第一體素集合；對醫學影像資料進行邊緣檢測，得到第二體素集合，第二體素集合包括目標物體輪廓處的體素；基於第一體素集合和第二體素集合生成目標物體的點雲。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A point cloud generation method includes: acquiring medical image data of a target object; in the medical image data, acquiring voxels of the target object based on Hounsfield values to obtain a first voxel set; performing edge detection on the medical image data to obtain a second voxel set, where the second voxel set includes the voxels at the contour of the target object; generating the point cloud of the target object based on the first voxel set and the second voxel set. Point cloud generation equipment, an electronic device and a computer readable storage medium are also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101、102、103、104:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="645" publication-number="202623866">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623866</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148530</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>遊戲系統及遊戲輔助方法</chinese-title>
        <english-title>GAME SYSTEM AND GAME ASSISTANCE METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120241230B">A63F13/5375</main-classification>
        <further-classification edition="201401120241230B">A63F13/822</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新唐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昌宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHANG-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂結盛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, CHIEH-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種遊戲系統，包含顯示裝置、輸入裝置、處理裝置及微控制器。顯示裝置配置以顯示第一遊戲畫面。輸入裝置配置以接收遊戲操作。處理裝置配置以基於第一遊戲畫面及遊戲操作，生成第二遊戲畫面。微控制器連接處理裝置、顯示裝置及輸入裝置，並且配置以透過人工智慧模組，基於第一遊戲畫面及遊戲操作，生成遊戲建議。顯示裝置更配置以顯示第三遊戲畫面，第三遊戲畫面包含第二遊戲畫面及遊戲建議，遊戲建議疊加在第二遊戲畫面之上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A game system is provided. The game system includes a display device, an input device, a processing device and a microcontroller. The display device is configured to display a first game screen. The input device is configured to receive a game operation. The processing device is configured to generate a second game screen based on the first game screen and the game operation. The microcontroller is connected to the processing device, the display device and the input device. The microcontroller is configured to generate a game suggestion based on the first game screen and the game operation through the artificial intelligence (AI) module. The display device is further configured to display a third game screen including the second game screen and the game suggestion. The game suggestion is overlayed on the second game screen.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:處理裝置</p>
        <p type="p">12:微控制器</p>
        <p type="p">13:輸入裝置</p>
        <p type="p">14:顯示裝置</p>
        <p type="p">22:人工智慧模組(AI)</p>
        <p type="p">23:第一遊戲操作</p>
        <p type="p">24:第一遊戲畫面</p>
        <p type="p">26:遊戲建議</p>
        <p type="p">33:第二遊戲操作</p>
        <p type="p">35:第二遊戲畫面</p>
        <p type="p">37:第三遊戲畫面</p>
        <p type="p">40:遊戲輔助方法</p>
        <p type="p">S401~S405:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="646" publication-number="202625007">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625007</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148538</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路佈局熱點檢測系統</chinese-title>
        <english-title>CIRCUIT LAYOUT HOTSPOT DETECTION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250401B">G06F30/392</main-classification>
        <further-classification edition="202001120250401B">G06F30/398</further-classification>
        <further-classification edition="202001120250401B">G06F30/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡秉諺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, PIN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵皓強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAO, HAO-CHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">電路佈局熱點檢測系統包含光刻模擬器、物件檢測器及跨模型特徵融合模組。光刻模擬器用於接收電路佈局資料，以產生佈局形變特徵矩陣。物件檢測器耦接於光刻模擬器，用以依據電路佈局資料，產生複數個佈局圖樣特徵矩陣。跨模型特徵融合模組耦接於光刻模擬器及物件檢測器，用以依據該些佈局圖樣特徵矩陣及佈局形變特徵矩陣，產生電路佈局資料對應的潛在異常熱點資料。電路佈局資料包含至少一個電路佈局圖層。潛在異常熱點資料包含至少一個潛在異常熱點的位置以及至少一個潛在異常熱點的尺寸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit layout hotspot detection system includes a lithography simulator, an object detector, and a cross-model feature fusion module. The lithography simulator is configured to receive circuit layout data to generate a layout deformation feature matrix. The object detector is coupled to the lithography simulator and configured to generate a plurality of layout pattern feature matrices according to the circuit layout data. The cross-model feature fusion module is coupled to the lithography simulator and the object detector and configured to generate potential abnormal hotspot data corresponding to the circuit layout data according to the plurality of layout pattern feature matrices and the layout deformation feature matrix. The circuit layout data includes at least one circuit layout layer. The potential abnormal hotspot data includes a location of at least one potential abnormal hotspot and a size of the at least one potential abnormal hotspot.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電路佈局熱點檢測系統</p>
        <p type="p">10:光刻模擬器</p>
        <p type="p">11:物件檢測器</p>
        <p type="p">12:跨模型特徵融合模組</p>
        <p type="p">Din:電路佈局資料</p>
        <p type="p">Dout:潛在異常熱點資料</p>
        <p type="p">f&lt;sub&gt;Y,1&lt;/sub&gt;至f&lt;sub&gt;Y,M&lt;/sub&gt;:佈局圖樣特徵矩陣</p>
        <p type="p">f&lt;sub&gt;de&lt;/sub&gt;:佈局形變特徵矩陣</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="647" publication-number="202624560">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624560</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148539</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鍍覆裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C25D17/00</main-classification>
        <further-classification edition="200601120260302B">C25D17/02</further-classification>
        <further-classification edition="200601120260302B">C25D17/06</further-classification>
        <further-classification edition="200601120260302B">C25D17/10</further-classification>
        <further-classification edition="200601120260302B">C25D21/12</further-classification>
        <further-classification edition="200601120260302B">C25D5/04</further-classification>
        <further-classification edition="200601120260302B">C25D7/12</further-classification>
        <further-classification edition="202601120260302B">H10P14/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商荏原製作所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EBARA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樋渡良輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIWATASHI, RYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳傳岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾文岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">［課題］本發明係使基板周緣部之鍍覆膜厚分布的均勻性提升。        &lt;br/&gt;［解決手段］本發明之鍍覆模組400包含：鍍覆槽410，用以容納鍍覆液；陽極430，配置於鍍覆槽410內；基板固持器440，用以在使被鍍覆面Wf-a朝向下方的狀態下保持基板Wf；旋轉機構447，構成來使基板固持器440旋轉；分流電極481，配置於從陽極430與基板Wf之間的調整位置離開的退避位置；及調整構件485，構成來使分流電極481在調整位置與退避位置之間移動。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">410:鍍覆槽</p>
        <p type="p">420:隔膜</p>
        <p type="p">422:陰極區域</p>
        <p type="p">424:陽極區域</p>
        <p type="p">426:噴嘴</p>
        <p type="p">428:供給源</p>
        <p type="p">430:陽極</p>
        <p type="p">440:基板固持器</p>
        <p type="p">442:密封環固持器</p>
        <p type="p">443:升降機構</p>
        <p type="p">444:背板</p>
        <p type="p">446:框體</p>
        <p type="p">447:旋轉機構</p>
        <p type="p">448:軸</p>
        <p type="p">450:電阻體</p>
        <p type="p">481:分流電極</p>
        <p type="p">485:調整構件</p>
        <p type="p">Wf:基板</p>
        <p type="p">Wf-a:被鍍覆面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="648" publication-number="202625575">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625575</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148543</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置與其製造方式</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250701B">H10D30/01</main-classification>
        <further-classification edition="202501120250701B">H10D30/60</further-classification>
        <further-classification edition="202501120250701B">H10D62/10</further-classification>
        <further-classification edition="202501120250701B">H10D62/13</further-classification>
        <further-classification edition="202501120250701B">H10D62/60</further-classification>
        <further-classification edition="202501120250701B">H10D64/27</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻揚半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON YOUNG SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許宸豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHEN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置包含基板、磊晶層與閘極結構。磊晶層在基板上，其中磊晶層包含漂移區、複數個摻雜柱、井區、源極區、通道摻雜區。複數個摻雜柱在漂移區中。井區在漂移區上。源極區在井區上。通道摻雜區在源極區下與井區中，其中基板、漂移區、源極區與通道摻雜區具有第一導體型，井區與摻雜柱具有不同於第一導體型的第二導體型，通道摻雜區的摻雜濃度低於源極區的摻雜濃度。閘極結構埋在磊晶層中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a substrate, an epitaxial layer and a gate structure. The epitaxial layer is over the substrate. The epitaxial layer includes a drift layer, a plurality of doped pillars, a well region, a source region, and a channel doped region. The doped pillars are in the drift region. The well region is over the drift region. The source region is over the well region. The channel doped region is under the source region and in the well region. The substrate, the drift region, the source region, and the channel doped region have a first conductivity type. The well region and the doped pillars have a second conductivity type different from the first conductivity type. The doping concentration of the channel doped region is lower than the doping concentration of the source region. The gate structure is embedded in the epitaxial layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:基板</p>
        <p type="p">120:磊晶層</p>
        <p type="p">121:摻雜柱</p>
        <p type="p">122:JFET區</p>
        <p type="p">123:井區</p>
        <p type="p">124:通道摻雜區</p>
        <p type="p">125:源極區</p>
        <p type="p">126:體接觸區</p>
        <p type="p">127:漂移區</p>
        <p type="p">130:閘極結構</p>
        <p type="p">132:閘極介電層</p>
        <p type="p">134:閘極層</p>
        <p type="p">140:閘極電極</p>
        <p type="p">150:介電層</p>
        <p type="p">160:源極電極</p>
        <p type="p">170:汲極電極</p>
        <p type="p">D1:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="649" publication-number="202624557">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624557</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148544</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鍍覆裝置及鍍覆方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250925B">C25D5/18</main-classification>
        <further-classification edition="200601120250925B">C25D7/12</further-classification>
        <further-classification edition="200601120250925B">C25D21/12</further-classification>
        <further-classification edition="200601120250925B">C25D17/02</further-classification>
        <further-classification edition="200601120250925B">C25D17/06</further-classification>
        <further-classification edition="200601120250925B">C25D17/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商荏原製作所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EBARA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安田慎吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YASUDA, SHINGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳傳岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾文岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係以均勻高度在基板上形成複數個凸塊。本發明提供一種鍍覆裝置，係用於在基板上形成鍍覆膜之鍍覆裝置，且具備：以保持前述基板之方式而構成的基板固持器；以與前述基板固持器一起收容鍍覆液之方式而構成的鍍覆槽；與保持於前述基板固持器之前述基板相對的方式配置於前述鍍覆槽內之陽極；以在前述基板與前述陽極之間供給鍍覆電流的方式而構成之電源；及控制部；前述控制部係以使具有重複以下三個期間之鍍覆電流從前述電源輸出的方式而構成，此等期間包含：供給用於從前述鍍覆液析出金屬至前述基板上之正向電流的正向電流期間；供給在與前述正向電流相反方向流動之反向電流脈衝的反向電流期間；及在從前述反向電流脈衝向前述正向電流轉換中途停止供給電流之電流停止期間；前述控制部係以在供給前述反向電流脈衝後將鍍覆電壓之變動寬度收在指定範圍的方式，並以控制前述電流停止期間之長度的方式而進一步構成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">P1:圖案區域</p>
        <p type="p">P2:圖案區域</p>
        <p type="p">P3:圖案區域</p>
        <p type="p">V2:鍍覆電壓之極小值</p>
        <p type="p">Wd:變動寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="650" publication-number="202624976">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624976</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148552</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>橋接模組、UART擴充裝置與顯示客製化序列埠名稱的方法</chinese-title>
        <english-title>BRIDGE MODULE, UART EXPANSION DEVICE, AND METHOD OF SHOWING CUSTOMIZED SERIAL PORT NAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">G06F13/38</main-classification>
        <further-classification edition="200601120250303B">G06F13/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>旺玖科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PROLIFIC TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉榮鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, JUNG-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉雨軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, YU-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育竹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明主要揭示一種可以客製化變更序列埠名稱的橋接模組，其包括一橋接晶片與一記憶體，且應用於例如為USB-RS232轉換裝置的一UART擴充裝置之中。依據本發明，用戶可以將包含一客製化序列埠名稱的一燒寫數據寫入該記憶體之中。如此，當該UART擴充裝置連接至已安裝該UART擴充裝置的一驅動程式的一主控電子裝置之時，該橋接晶片會自該記憶體讀出該客製化序列埠名稱，並將該客製化序列埠名稱整合在傳送給該主控電子裝置的一裝置描述符之中，使得該主控電子裝置的作業系統的裝置管理員將該UART擴充裝置的UART通信埠顯示為該客製化序列埠名稱。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a bridge module capable having function of being changed its serial port name to be customized. The bridge module comprises a bridge electronic chip and a memory, and is applied in the manufacture of a UART expansion device like USB-to-RS232 converter. According to the present invention, user is allowed to program a writing data including a customized serial port name into the memory. As such, when the UART expansion device is electrically connected to a host electronic device been installed with a corresponding driver of the UART expansion device, the bridge electronic chip reads out the customized serial port name from the memory, and integrates the customized serial port name in a device descriptor, thereby transmitting the device descriptor to the host electronic device. As a result, a device manager of an operating system (e.g., windows) of the host electronic device shows at least one UART port of the UART expansion device by the customized serial port name.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:橋接模組</p>
        <p type="p">11:橋接晶片</p>
        <p type="p">12:記憶體</p>
        <p type="p">2:UART擴充裝置</p>
        <p type="p">20:電路板</p>
        <p type="p">21:信號傳輸介面</p>
        <p type="p">22:UART介面</p>
        <p type="p">3:主控電子裝置</p>
        <p type="p">4:電子裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="651" publication-number="202624675">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624675</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148553</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>散熱裝置、散熱系統與電子裝置</chinese-title>
        <english-title>HEAT DISSIPATION DEVICE, HEAT DISSIPATION SYSTEM AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250311B">F28D1/00</main-classification>
        <further-classification edition="200601120250311B">F28D15/02</further-classification>
        <further-classification edition="200601120250311B">G06F1/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立端科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANNER ELECTRONICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳光弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, KUANG-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游彥尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, YEN-YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂榮林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, JUNG-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林哲民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TSE-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃堯聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YAO-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王啟川</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHI-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭俊儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHUN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張永棟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YONG-DONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃祥河</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HSIANG-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育竹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明主要揭示一種散熱裝置，包括：一殼體、一熱管支撐塊、一熱管、具有複數個流體通道的一平板型鰭片散熱器、一第一隔板、以及一第二隔板，其中，該殼體具有一輸入埠與一輸出埠，且該熱管具有一輸入端管口連接該輸入埠。特別地，該第一隔板、該第二隔板、該熱管支撐塊在該殼體內部界定出一緩衝區，且該熱管具有一輸出端管口連通該緩衝區。並且，該緩衝區連通該平板型鰭片散熱器的該複數個流體通道。如此，在外部一儲液器通過該輸入埠將一液體注入該熱管之後，該液體經由該輸出端管口注入緩衝區。接著，該液體流過該複數個流體通道，最終通過該輸出埠回流該儲液器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a heat dissipation device, comprising a housing case, a supporting body, a heat pipe, and a plate fin heat sink having a plurality of flow channels, a first partition plate and a second partition plate, of which the housing case has an input port and an output port. Particularly, the first partition plate, the second partition plate, and the supporting body is disposed in the housing case, so as to form a buffer space in the housing case. Moreover, the heat pipe having one input orifice and one output orifice is disposed on the supporting body, and the input orifice is connected to the input port, such that the output orifice and the plurality of flow channels communicate with the buffer space. By such arrangements, after a reservoir supplies and injects a liquid into the heat pipe via the input port, the liquid flows along the heat pipe, thereby eventually getting into the buffer space via the output orifice. As a result, the liquid flows and passes the flow channels, so as to consequently flow back to the reservoir via the output port.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:散熱裝置</p>
        <p type="p">11:殼體</p>
        <p type="p">11B:底板</p>
        <p type="p">11C:罩體</p>
        <p type="p">11SU:上側板</p>
        <p type="p">11S1:第一側板</p>
        <p type="p">11S2:第二側板</p>
        <p type="p">11S3:第三側板</p>
        <p type="p">11S4:第四側板</p>
        <p type="p">11O1:第一開孔</p>
        <p type="p">11O2:第二開孔</p>
        <p type="p">11P1:輸入埠</p>
        <p type="p">11P2:輸出埠</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="652" publication-number="202625395">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625395</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148555</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>天線控制方法及天線系統</chinese-title>
        <english-title>ANTENNA CONTROL METHOD AND ANTENNA SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250303B">H04B7/02</main-classification>
        <further-classification edition="201501120250303B">H04B1/40</further-classification>
        <further-classification edition="200601120250303B">H04B1/72</further-classification>
        <further-classification edition="200601120250303B">H01Q1/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞東學校財團法人亞東科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASIA EASTERN UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡正南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, CHENG-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周光中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, KUANG-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種天線控制方法及天線系統。控制方法包括以下步驟：進行一初始化；接收來自一全球定位系統的一遙測數據；檢查遙測數據的身份是否符合一參數列表；其中，於遙測數據的身份不符合參數列表時，維持一波束的當前方向；於遙測數據的身份符合參數列表時，調整波束以面朝一地面站的位置；由一單脈衝中提取一輸出訊號；依據輸出訊號計算一角度偏差；利用一單脈衝波束跟蹤技術與角度偏差調整波束，以對準一視軸；檢查波束是否同步地面站；其中，於波束同步地面站時，下載數據至地面站；於波束不同步地面站時，再次接收來自全球定位系統的遙測數據。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An antenna control method and an antenna system are provided. The control method includes the following steps: initializing; receiving remote sensing data from a Global Positioning System (GPS); checking whether the identity of the remote sensing data matches a parameter list; wherein, when the identity of the remote sensing data does not match the parameter list, maintaining the current direction of the beam; when the identity of the remote sensing data matches the parameter list, adjusting the beam to search for the location of a ground station; extracting an output signal from a single pulse; calculating an angular deviation based on the output signal; using a single pulse beam tracking technique and the angular deviation to adjust the beam to align with the line of sight; checking whether the beam is synchronized with the ground station; wherein, when the beam is synchronized with the ground station, downloading data to the ground station; and when the beam is not synchronized with the ground station, receiving remote sensing data from the GPS again.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101:初始步驟</p>
        <p type="p">S103:接收步驟</p>
        <p type="p">S105:身份檢查步驟</p>
        <p type="p">S106A:維持步驟</p>
        <p type="p">S106B:調整步驟</p>
        <p type="p">S107:提取步驟</p>
        <p type="p">S109:計算步驟</p>
        <p type="p">S111:修正步驟</p>
        <p type="p">S113:檢查同步步驟</p>
        <p type="p">S114A:允許步驟</p>
        <p type="p">S114B:重新步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="653" publication-number="202624666">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624666</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148556</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>應用於急速冷凍器具的迴轉式壓縮機</chinese-title>
        <english-title>ROTARY COMPRESSOR FOR QUICK FREEZING EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250328B">F25B1/04</main-classification>
        <further-classification edition="200601120250328B">F04C18/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞智精密股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RECHI PRECISION CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱忠本</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHUNG-PEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐金輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIN-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種迴轉式壓縮機。迴轉式壓縮機能用來加入選自R1270及R290其中之一的製冷劑。迴轉式壓縮機包含具有第一縱向軸線的泵浦、具有第二縱向軸線的環、及穿設於環的軸。泵浦包含上支座、缸體、下支座、及葉片。缸體具有吸入口，並且吸入口能用以吸入製冷劑。上支座具有排出口、並能用以排出製冷劑。排出口具有不大於2毫米的厚度，並且排出口具有介於28平方毫米至51平方毫米的有效面積。環具有介於1.4至1.7之間的高度半徑比。軸能相對於第一縱向軸線轉動，以使環能相對於泵浦轉動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a rotary compressor for a quick freezing equipment. The rotary compressor is configured to add a refrigerant that is at least one of R1270 and R290, and the rotary compressor includes a pump having a first longitudinal axis, a roller having a second longitudinal axis, a shaft arranged to pass through the roller, and a vane. The pump includes a top flange, a cylinder, and a bottom flange. The cylinder has a suction opening configured for importing the refrigerant. The top flange has an exhaust opening configured for exhaust the refrigerant. A thickness of the exhaust opening is not greater than 2 mm, and an effective area of the exhaust opening is within a range from 28 mm        &lt;sup&gt;2&lt;/sup&gt;to 51 mm        &lt;sup&gt;2&lt;/sup&gt;. A height-to-radius ratio of the roller is within a range from 1.4 to 1.7. The shaft is rotatable relative to the first longitudinal axis so that the roller is rotatable relative to the pump.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:迴轉式壓縮機</p>
        <p type="p">1:泵浦</p>
        <p type="p">11:上支座</p>
        <p type="p">111:排出口</p>
        <p type="p">12:缸體</p>
        <p type="p">121:吸入口</p>
        <p type="p">122:凹部</p>
        <p type="p">13:下支座</p>
        <p type="p">2:環</p>
        <p type="p">21:下端面</p>
        <p type="p">22:外側面</p>
        <p type="p">23:內側面</p>
        <p type="p">3:軸</p>
        <p type="p">31:凸輪</p>
        <p type="p">A:腔室</p>
        <p type="p">d:深度</p>
        <p type="p">hr、hc:高度</p>
        <p type="p">rr:半徑</p>
        <p type="p">rs:最小半徑</p>
        <p type="p">L1:第一縱向軸線</p>
        <p type="p">L2:第二縱向軸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="654" publication-number="202625630">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625630</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148559</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發光二極體結構及其製造方法</chinese-title>
        <english-title>LIGHT-EMITTING DIODE STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250204B">H10H20/01</main-classification>
        <further-classification edition="202501120250204B">H10H20/81</further-classification>
        <further-classification edition="202501120250204B">H10H20/819</further-classification>
        <further-classification edition="202501120250204B">H10H20/82</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華碩電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASUSTEK COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林敬欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHING-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾慶安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, CHIN-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>虞嘉磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHIA-LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃建璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, JIAN-JANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王遠超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YUAN-CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余承叡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHENG-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種發光二極體結構的製造方法，包括：提供一基板；在基板上依序形成一第一型半導體層、一主動層及一第二型半導體層；依序蝕刻部分的第二型半導體層、部分的主動層及部分的第一型半導體層，以暴露出第二型半導體層的蝕刻側壁、主動層的蝕刻側壁及第一型半導體層的蝕刻側壁；以及利用水蒸氣摻透至少一部分的蝕刻側壁，以在第二型半導體層的至少一部分的邊緣區域、主動層的邊緣區域及第一型半導體層的至少一部分的邊緣區域形成金屬氧化物。一種發光二極體結構亦被提出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method of a light-emitting diode structure includes: providing a substrate; forming a first type semiconductor layer, an active layer, and a second type semiconductor layer on the substrate in sequence; etching a part of the second semiconductor layer, a part of the active layer, and a part of the first semiconductor layer in sequence to expose an etched side surface of the second type semiconductor layer, an etched side surface of the active layer, and an etched side surface of the first semiconductor layer; and use water vapor to penetrate at least a part of the etched side surfaces, so as to from metal oxide in at least a part of an edge region of the second type semiconductor layer, an edge region of the active layer, and at least a part of an edge region of the first semiconductor layer. A light-emitting diode structure is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:發光二極體結構</p>
        <p type="p">110:基板</p>
        <p type="p">122、124:第一型半導體子層</p>
        <p type="p">130、130’:第一型披覆層</p>
        <p type="p">132、142、152、162:蝕刻側壁</p>
        <p type="p">134、144、154:邊緣區域</p>
        <p type="p">140、140’:主動層</p>
        <p type="p">150、150’:第二型披覆層</p>
        <p type="p">160:第二型半導體子層</p>
        <p type="p">170:緩衝層</p>
        <p type="p">180:第一電極</p>
        <p type="p">190:第二電極</p>
        <p type="p">210:保護層</p>
        <p type="p">220:金屬氧化物層</p>
        <p type="p">300’:第一型半導體層</p>
        <p type="p">400’:第二型半導體層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="655" publication-number="202624727">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624727</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148565</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>手持式酸鹼值檢測儀</chinese-title>
        <english-title>HANDHELD PH VALUE DETECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260223B">G01N21/80</main-classification>
        <further-classification edition="200601120260223B">G01N21/01</further-classification>
        <further-classification edition="202601120260223B">H02J15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游奕欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, YI-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種手持式酸鹼值檢測儀包括一外殼、一檢測系統、一光學檢測系統以及一發電系統。檢測系統設置在外殼內並具有一滾筒組、一輸送帶與一檢測試紙，其中檢測試紙設置在輸送帶上，且輸送帶由滾筒組往外殼的一端延伸並突出外殼。光學檢測系統具有一光學檢測器以及一顯示器，其中光學檢測器設置在外殼內，且顯示器連接光學檢測器。發電系統具有一儲電元件以及一滾輪，其中儲電元件設置在外殼內並提供電力給光學檢測系統，且滾輪設置在外殼上並連接儲電元件。當檢測試紙接觸一待測液體並產生顏色變化後，光學檢測器偵測檢測試紙的顏色以判定待測液體的酸鹼值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A handheld pH value detector includes a housing, a detection system, an optical detection system and a power generation system. The detection system is disposed in the housing and includes a cylinder set, a belt and a detection test strip, wherein the detection test strip is disposed on the belt, and the belt is extends from the cylinder set to one end of the housing and protrudes from the housing. The optical detection system includes an optical detector and a display, wherein the optical detector is disposed on the housing, and the display is connected to the optical detector. The power generation system includes a power storage element and a roller, wherein the power storage element is disposed in the housing and provides power to the optical detection system. The roller is disposed on the housing and connects to the power storage element. When the detection test strip contacts a measured liquid and produces a color change, the optical detector detects the color of the detection test strip to determine the pH value of the measured liquid.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:手持式酸鹼值檢測儀</p>
        <p type="p">110:外殼</p>
        <p type="p">110a:開口</p>
        <p type="p">111:內部空間</p>
        <p type="p">112:外側</p>
        <p type="p">120:檢測系統</p>
        <p type="p">121:滾筒組</p>
        <p type="p">121a:第一滾筒</p>
        <p type="p">121b:第二滾筒</p>
        <p type="p">122:輸送帶</p>
        <p type="p">123:檢測試紙</p>
        <p type="p">124:第一轉輪</p>
        <p type="p">125:第二轉輪</p>
        <p type="p">126:第三轉輪</p>
        <p type="p">127:第一齒輪</p>
        <p type="p">128:第二齒輪</p>
        <p type="p">130:光學檢測系統</p>
        <p type="p">131:光學檢測器</p>
        <p type="p">132:顯示器</p>
        <p type="p">133:光學辨識器</p>
        <p type="p">140:發電系統</p>
        <p type="p">141:儲電元件</p>
        <p type="p">142:滾輪</p>
        <p type="p">143:微型發電機</p>
        <p type="p">143a:發電轉軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="656" publication-number="202625163">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625163</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148566</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>語音翻譯與合成方法及系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR SPEECH TRANSLATION AND SYNTHESIS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">G10L15/26</main-classification>
        <further-classification edition="201301120250303B">G10L13/02</further-classification>
        <further-classification edition="202001120250303B">G06F40/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商艾沛芯科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APACECORE PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許萓庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YI TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提出一種語音翻譯與合成方法，包含：接受第一語音訊號，並擷取第一語音訊號的語者特徵向量；透過第一機器學習模型，識別第一語音訊號的第一文本；將第一文本從第一語言轉換為第二語言以產生第二文本，其中第一語言不同於第二語言；將第二文本轉換為合成聲音訊號；以及透過第二機器學習模型，根據語者特徵向量將合成聲音訊號轉換為第二語音訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure proposes a method for speech translation and synthesis, including: receiving a first speech signal and extracting a speaker feature vector of the first speech signal; recognizing a first text of the first speech signal through a first machine learning model; converting the first text from a first language to a second language to generate a second text in which the first language is different from the second language; converting the second text into a synthesized audio signal; and transforming the synthesized audio signal into a second speech signal based on the speaker feature vector through a second machine learning model.</p>
      </isu-abst>
      <representative-img>
        <p type="p">201~209:步驟</p>
        <p type="p">210:機器學習模型</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="657" publication-number="202625013">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625013</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148567</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>卷積計算裝置</chinese-title>
        <english-title>CONVOLUTION COMPUTING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250320B">G06N3/0464</main-classification>
        <further-classification edition="200601120250320B">G06N3/06</further-classification>
        <further-classification edition="200601120250320B">G06T1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商艾沛芯科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APACECORE PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許萓庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YI TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提出一種卷積計算裝置，包含處理晶粒和記憶體晶粒。處理晶粒包含多個卷積電路、多個池化電路、以及多個全連接電路。記憶體晶粒用以儲存輸入資料。在處理晶粒讀取輸入資料的一運算週期內，卷積電路用以平行地對輸入資料執行卷積運算，池化電路用以平行地對輸入資料所產生的第一特徵圖執行池化運算，全連接電路用以平行地對輸入資料所產生的第二特徵圖執行全連接運算。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure proposes a convolution computing device, including a processing die and a memory die. The processing die includes multiple convolution circuits, multiple pooling circuits, and multiple fully-connected circuits. The memory die stores input data. Within an operation cycle that the processing die reads the input data, the convolution circuits perform convolution operations on the input data in parallel, the pooling circuits perform pooling operations on first feature maps generated from the input data in parallel, and the fully-connected circuits perform fully-connected operations on second feature maps generated from the input data in parallel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:卷積計算裝置</p>
        <p type="p">110:處理晶粒</p>
        <p type="p">120:記憶體晶粒</p>
        <p type="p">121~128:記憶體倉</p>
        <p type="p">130,140:核心</p>
        <p type="p">131,141:卷積電路</p>
        <p type="p">132,142:記憶體</p>
        <p type="p">133,143:池化電路</p>
        <p type="p">134,144:全連接電路</p>
        <p type="p">150:記憶體介面</p>
        <p type="p">151~154:通道</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="658" publication-number="202625329">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625329</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148568</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>充電裝置及其操作方法</chinese-title>
        <english-title>CHARGING DEVICE AND OPERATING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">H02J7/04</main-classification>
        <further-classification edition="201901120250303B">B60L58/10</further-classification>
        <further-classification edition="201901120250303B">B60L53/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緯創資通股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃丞偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHENG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIH FONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種充電裝置及其操作方法。充電裝置透過第一電力線、第二電力線以及接地線安裝至電力系統。充電裝置包括第一處理器、第二處理器以及微控制器。第一處理器耦接第一電力線以及第二電力線，並且用以產生第一電壓判斷訊號。第二處理器耦接第二電力線以及接地線，並且用以產生第二電壓判斷訊號。微控制器耦接第一處理器以及第二處理器，並且用以根據第一電壓判斷訊號以及第二電壓判斷訊號判斷電力系統的電力標準。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A charging device and an operating method thereof are provided. The charging device is installed to a power system through a first power line, a second power line and a ground line. The charging device includes a first processor, a second processor and a microcontroller. The first processor is coupled to the first power line and the second power line and is used to generate a first voltage determination signal. The second processor is coupled to the second power line and the ground line, and is used to generate a second voltage determination signal. The microcontroller is coupled to the first processor and the second processor, and is used to determine a power standard of the power system according to the first voltage determination signal and the second voltage determination signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:充電裝置</p>
        <p type="p">101:第一電力線</p>
        <p type="p">102:第二電力線</p>
        <p type="p">103:接地線</p>
        <p type="p">110:第一處理器</p>
        <p type="p">120:第二處理器</p>
        <p type="p">130:微控制器</p>
        <p type="p">140:繼電器</p>
        <p type="p">200:電力系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="659" publication-number="202625061">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625061</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148578</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>商品列表提供方法及系統</chinese-title>
        <english-title>METHOD FOR DISPLAYING MERCHANDISE SEARCH REPORT PAGE AND SYSTEM THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250618B">G06Q30/0601</main-classification>
        <further-classification edition="202301120250618B">G06Q30/02</further-classification>
        <further-classification edition="201901120250618B">G06F16/908</further-classification>
        <further-classification edition="200601120250618B">G06F13/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慶秀珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYUNG, SU JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧妍姝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RO, YEON JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昭允</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SO YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李坤熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KUN HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種商品列表提供方法及應用該方法的系統。根據本發明的一實施例的商品列表提供方法包括如下步驟：構建包括多個商品項目的商品列表；及向所述商品列表插入包括多個品牌搜索按鈕的品牌微件，所述插入品牌微件的步驟包括如下步驟：匯總所述商品列表中包括的商品項目的品牌數量；利用所述品牌數量確定所述品牌微件的佈局；及將確定的所述佈局的品牌微件插入到所述商品列表。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are a method for providing a product list and a system to which the method is applied. The method for providing a product list may include configuring a product list including a plurality of product items, and inserting a brand widget including a plurality of brand search buttons into the product list, wherein the inserting of the brand widget may include gathering the number of brands of the product items included in the product list, determining a layout of the brand widget using the number of brands, and inserting the brand widget of the determined layout into the product list.</p>
      </isu-abst>
      <representative-img>
        <p type="p">30:第一商品列表畫面</p>
        <p type="p">31:筆記本電腦查詢</p>
        <p type="p">32:商品列表</p>
        <p type="p">33:第一區域</p>
        <p type="p">34:第二區域</p>
        <p type="p">35:第三區域</p>
        <p type="p">36:第四區域</p>
        <p type="p">36-1:第四品牌搜索按鈕</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="660" publication-number="202625265">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625265</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148581</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池、電池的製造方法、及電極體的製造方法</chinese-title>
        <english-title>BATTERY, MANUFACTURING METHOD OF BATTERY, AND MANUFACTURING METHOD OF ELECTRODE BODY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250402B">H01M4/04</main-classification>
        <further-classification edition="201001120250402B">H01M4/139</further-classification>
        <further-classification edition="200601120250402B">H01M10/04</further-classification>
        <further-classification edition="201001120250402B">H01M10/0525</further-classification>
        <further-classification edition="201001120250402B">H01M10/058</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>能元科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>E-ONE MOLI ENERGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳奕玄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉南宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, NAN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張安平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, AN-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳弈錡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種電池、電池的製造方法、及電極體的製造方法。電極體的製造方法包含：提供集電體，其具有上表面；以圖案化熱解膠層遮蔽集電體的上表面的第一區域；在集電體的上表面上施加電極材料，其中圖案化熱解膠層相對於電極材料的接觸角為90°以上；及移除圖案化熱解膠層，以將電極材料形成為暴露集電體的上表面的第一區域的電極材料層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a battery, a method of manufacturing a battery, and a method of manufacturing an electrode body. The method of manufacturing an electrode body includes: providing a collector having an upper surface; shielding a first region of the upper surface of the collector by a patterned thermal release adhesive layer; applying an electrode material over the upper surface of the collector, wherein a contact angle of the patterned thermal release adhesive layer with respect to the electrode material is 90° or higher; and removing the patterned thermal release adhesive layer to form the electrode material into an electrode material layer that exposes the first region of the upper surface of the collector.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:集電體</p>
        <p type="p">100a,100b,500a:表面</p>
        <p type="p">110A:電極材料</p>
        <p type="p">500:熱解膠層</p>
        <p type="p">510:圖案化膠層</p>
        <p type="p">520:熱解黏著層</p>
        <p type="p">700:塗佈刀頭</p>
        <p type="p">700P:移動路徑</p>
        <p type="p">D1:距離</p>
        <p type="p">DR1:方向</p>
        <p type="p">R11,R12:區域</p>
        <p type="p">T1,T2:厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="661" publication-number="202625278">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625278</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148587</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電解質組成物及鋰電池</chinese-title>
        <english-title>ELECTROLYTE COMPOSITION AND LITHIUM BATTERY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120250116B">H01M10/056</main-classification>
        <further-classification edition="201001120250116B">H01M10/052</further-classification>
        <further-classification edition="201001120250116B">H01M10/058</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴秀菱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, HSIU-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉定儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, TING-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳偉新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, WEI-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅正錦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, JHENG-JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯發皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, FA-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖世傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, SHIH-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅仁志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, JEN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳立群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LI-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電解質組成物，包括溶劑、鋰鹽、稀釋劑、陽離子開環聚合反應起始劑、以及具有式(I)所示之重複單元的非磷聚合物：        &lt;br/&gt;&lt;img align="absmiddle" height="209px" width="167px" file="ed10006.JPG" alt="ed10006.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，其中n=30~1200。以電解質組成物的總重為100 wt%為基礎，電解質組成物包括0.5 wt%~10 wt%的非磷聚合物。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrolyte composition includes a solvent, a lithium salt, a diluent, a cationic ring-opening polymerization initiator, and a non-phosphorus polymer including repeating units represented by formula (I):        &lt;br/&gt;&lt;img align="absmiddle" height="221px" width="246px" file="ed10007.JPG" alt="ed10007.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, where n=30-1200.        &lt;br/&gt;Based on the total weight of the electrolyte composition being 100 wt%, the electrolyte composition includes 0.5-10 wt% of the non-phosphorus polymers.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:負極</p>
        <p type="p">20:正極</p>
        <p type="p">30:隔離膜</p>
        <p type="p">40:半固態電解質</p>
        <p type="p">100:鋰電池</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="662" publication-number="202624555">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624555</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148610</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阻抗體遮罩、鍍覆裝置、鍍覆方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C25D5/02</main-classification>
        <further-classification edition="200601120260302B">C25D5/08</further-classification>
        <further-classification edition="200601120260302B">C25D7/12</further-classification>
        <further-classification edition="200601120260302B">C25D17/00</further-classification>
        <further-classification edition="200601120260302B">C25D17/10</further-classification>
        <further-classification edition="200601120260302B">C25D21/12</further-classification>
        <further-classification edition="202601120260302B">H10P70/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商荏原製作所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EBARA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富田正輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMITA, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳傳岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾文岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係依基板上之晶片的配置圖案適切遮蔽非圖案區域。本發明之阻抗體遮罩係在鍍覆裝置中配置於基板與陽極之間，用於具有2個四方形重疊而形成之十字形圖案區域的阻抗體，且具備：對應於前述2個四方形中之一方四方形的各角部而設之第一至第四遮罩片；及對從前述一方四方形彼此相對之2邊的各邊延伸至外側的一對突出部分分別設置之第五及第六遮罩片。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:阻抗體</p>
        <p type="p">11:圖案區域</p>
        <p type="p">11A:四方形</p>
        <p type="p">11C:突出部分</p>
        <p type="p">12:非圖案區域</p>
        <p type="p">900:阻抗體遮罩</p>
        <p type="p">910:第一遮罩</p>
        <p type="p">910A~910D:遮罩片</p>
        <p type="p">911-1~911-4:內側輪廓</p>
        <p type="p">920:第二遮罩</p>
        <p type="p">920A~920B:遮罩片</p>
        <p type="p">921:內側輪廓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="663" publication-number="202623765">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623765</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148617</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>尿潛血檢測裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">A61B5/20</main-classification>
        <further-classification edition="200601120241231B">A61B5/00</further-classification>
        <further-classification edition="200601120241231B">G01N33/48</further-classification>
        <further-classification edition="200601120241231B">G01N33/493</further-classification>
        <further-classification edition="200601120241231B">G01N21/75</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈺記企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUH &amp; JIH INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜國賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, GUO-XIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜宜軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, I-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種尿潛血檢測裝置，包含一殼座單元、一檢測單元、一顯示單元及一控制單元。該檢測單元設置於殼座單元且包括一用來對尿液發出一入射光的發光器，及一用來接收該入射光照射尿液後產生的一反射光的接收器。該入射光為波長570奈米的綠光雷射。該顯示單元設置於該殼座單元。藉由血紅素對波長570奈米的綠光雷射的該入射光的光吸收率最高，該發光器對尿液發出該入射光，該控制單元再將該入射光的光強度與該反射光的光強度和該對照值比較且將一檢測結果顯示於該顯示單元，即可判斷該尿液是否有潛血，檢測便利性較佳。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:殼座單元</p>
        <p type="p">11:容室</p>
        <p type="p">111:檢測孔</p>
        <p type="p">112:前開槽</p>
        <p type="p">12:座本體</p>
        <p type="p">2:檢測單元</p>
        <p type="p">3:顯示單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="664" publication-number="202623771">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623771</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148618</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>口腔機能檢測裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">A61C19/00</main-classification>
        <further-classification edition="200601120241231B">A61C19/04</further-classification>
        <further-classification edition="201601120241231B">A61B90/00</further-classification>
        <further-classification edition="201601120241231B">A61B90/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈺記企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUH &amp; JIH INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜國賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, GUO-XIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜宜軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, I-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種口腔機能檢測裝置，包含一殼座、一檢測單元、一充氣機、一接頭、一壓力感測器、一顯示單元及一控制單元。該檢測單元設置於該殼座且包括一用來放入口腔且圍繞界定出一氣室的氣囊，及一連接於該氣囊的連接管。該充氣機設置於該殼座。藉由該接頭該接頭的數個限位臂用來卡抵於該充氣管的凸緣而將該檢測單元連接於該充氣機，再將該氣囊放入口中且由該充氣機充氣。待該控制單元將一壓力感測值與一壓力標準值比較且將依檢測結果顯示於該顯示單元，即可判斷口腔肌肉的機能，能提升檢測便利性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:殼座</p>
        <p type="p">11:容室</p>
        <p type="p">111:安裝孔</p>
        <p type="p">112:前開槽</p>
        <p type="p">12:座本體</p>
        <p type="p">2:檢測單元</p>
        <p type="p">21:氣囊</p>
        <p type="p">212:囊本體</p>
        <p type="p">214:螺接件</p>
        <p type="p">215:凹槽</p>
        <p type="p">22:咬持管</p>
        <p type="p">221:管本體</p>
        <p type="p">222:間隔環</p>
        <p type="p">23:連接管</p>
        <p type="p">3:充氣機</p>
        <p type="p">4:接頭</p>
        <p type="p">41:連通管</p>
        <p type="p">43:擋壁</p>
        <p type="p">45:外環</p>
        <p type="p">6:顯示單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="665" publication-number="202623957">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623957</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148621</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>套筒轉接裝置</chinese-title>
        <english-title>SOCKET ADAPTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250217B">B25B13/06</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國倡冷鍛股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUOCHANG COLD FORGING CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱庭緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, TING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳天賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾冠銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種套筒轉接裝置適於連接驅動器以及徑向尺寸不同的兩被驅動物且包含一外套筒、設在外套筒內的一滑動件及插入滑動件的容置槽內和外套筒的導引槽中的一切換件。切換件可被驅動而沿導引槽滑動，以帶動滑動件相對於外套筒在第一位置和第二位置之間滑動。當滑動件在第一位置時，滑動件的其中一端允許驅動器插入，外套筒的其中一端允許其中一個被驅動物插入。當滑動件在第二位置時，滑動件的其中另一端允許驅動器插入，外套筒的其中另一端允許另一個被驅動物插入。藉此，可快速地切換套接模式，以適應不同徑向尺寸的被驅動物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A socket adapter is adaptive to be connected to a driver and two driven objects of different radial dimensions, and includes an outer socket, a slidable member in the outer socket, and a switching member inserted in an accommodating notch of the slidable member and a guiding slot. The switching member is drivable to slide in the guiding slot, thereby driving the slidable member to slide between a first and second positions relative to the outer socket. When the slidable member is at the first position, the driver is allowed to insert into one end of the slidable member, and a driven object is allowed to insert into one end of the outer socket. When the slidable member is at the second position, the driver is allowed to insert into the other end of the slidable member, and another driven object is allowed to insert into the other end of the outer socket. Therefore, it is possible to fast switch sleeving connection modes for adapting driven objects of different radial dimensions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:套筒轉接裝置</p>
        <p type="p">10:外套筒</p>
        <p type="p">12:滑動通道</p>
        <p type="p">13:導引槽</p>
        <p type="p">131:導引孔</p>
        <p type="p">132:定位孔</p>
        <p type="p">133:定位孔</p>
        <p type="p">14:第一力輸出口</p>
        <p type="p">15:第二力輸出口</p>
        <p type="p">16A:第一端</p>
        <p type="p">16B:第二端</p>
        <p type="p">20:滑動件</p>
        <p type="p">21A:第一端</p>
        <p type="p">21B:第二端</p>
        <p type="p">22:第一力輸入槽</p>
        <p type="p">23:第二力輸入槽</p>
        <p type="p">24:容置槽</p>
        <p type="p">26:外環面</p>
        <p type="p">27:凸部</p>
        <p type="p">30:切換件</p>
        <p type="p">31:推抵部</p>
        <p type="p">32:限位部</p>
        <p type="p">33:接觸部</p>
        <p type="p">34:凹槽</p>
        <p type="p">36:倒角</p>
        <p type="p">37:倒角</p>
        <p type="p">38:倒角</p>
        <p type="p">40:彈簧</p>
        <p type="p">C:中心軸</p>
        <p type="p">D:孔徑</p>
        <p type="p">W:寬度</p>
        <p type="p">X:軸向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="666" publication-number="202623965">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623965</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148622</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多功能轉接裝置</chinese-title>
        <english-title>MULTI-FUNCTION ADAPTING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251030B">B25B27/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國倡冷鍛股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUOCHANG COLD FORGING CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱庭緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, TING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳天賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種多功能轉接裝置包含一內桿、一第一套筒和一第二套筒。該第一套筒和該第二套筒可滑動地套接在該內桿的相對兩端。當該內桿的第一側桿部伸出於該第一套筒時，可允許該第一側桿部插入一第一物件。當該第一側桿部縮入該第一套筒內時，可允許一第二物件插入該第一套筒。當該內桿的第二側桿部伸出於該第二套筒，可允許該第二側桿部插入一第三物件。當該第二側桿部縮入該第二套筒內，可允許一第四物件插入該第二套筒。藉此，不僅可作為延長桿使用，還可用於多個不同物件之間的轉接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multi-function adapting device includes an inner shaft, a first socket, and a second socket. The first and second sockets slidably sleeved on two opposite ends of the inner shaft. When a first side portion of the inner shaft reaches out of the first socket, the first side portion is allowed to be inserted into a first object. When the first side portion retracts into the first socket, a second object is allowed to be inserted into the first socket. When a second side portion of the inner shaft reaches out of the second socket, the second side portion is allowed to be inserted into a third object. When the second side portion retracts into the second socket, a fourth object is allowed to be inserted into the second side portion. Therefore, this adapting device can serve as an extender and is adaptable to different objects.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:多功能轉接裝置</p>
        <p type="p">10:內桿</p>
        <p type="p">11:主桿部</p>
        <p type="p">12:第一側桿部</p>
        <p type="p">121:外環面</p>
        <p type="p">122:卡合槽</p>
        <p type="p">123:外側端面</p>
        <p type="p">13:第二側桿部</p>
        <p type="p">132:容納槽</p>
        <p type="p">20:第一套筒</p>
        <p type="p">21:第一外側筒部</p>
        <p type="p">22:第一內側筒部</p>
        <p type="p">23:延伸筒部</p>
        <p type="p">231:外環面</p>
        <p type="p">232:凸環</p>
        <p type="p">30:第二套筒</p>
        <p type="p">31:第二外側筒部</p>
        <p type="p">32:第二內側筒部</p>
        <p type="p">40:卡合件</p>
        <p type="p">63:扣環</p>
        <p type="p">M1:磁性件</p>
        <p type="p">T:延伸方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="667" publication-number="202625368">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625368</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148623</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>功率放大器及電路保護方法</chinese-title>
        <english-title>POWER AMPLIFIER AND CIRCUIT PROTECTION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">H03F3/20</main-classification>
        <further-classification edition="200601120250303B">H03F1/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立積電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHWAVE TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王一峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YI-FONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種功率放大器及電路保護方法。功率放大器包括輸入端、輸出端、第一放大電路、第二放大電路、偏壓電路、電流偵測電路以及第一保護電路。第一放大電路包括耦接輸入端的第一訊號輸入端以及第一訊號輸出端。第一放大電路放大從輸入端接收的射頻訊號。第二放大電路放大從第一訊號輸出端接收的射頻訊號。偏壓電路輸出偏壓電流至第二放大電路。電流偵測電路依據偏壓電流產生數位控制訊號。第一保護電路依據數位控制訊號而選擇性地降低輸入至第一訊號輸入端的射頻訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power amplifier and a circuit protection method are provided. The power amplifier includes an input end, an output end, a first amplification circuit, a second amplification circuit, a bias circuit, a current detection circuit, and a first protection circuit. The first amplification circuit includes a first signal input terminal coupled to the input terminal and a first signal output terminal. The first amplification circuit amplifies the radio frequency signal received from the input terminal. The second amplification circuit amplifies the radio frequency signal received from the first signal output terminal. The bias circuit outputs the bias current to the second amplifier circuit. The current detection circuit generates a digital control signal based on the bias current. The first protection circuit selectively reduces the radio frequency signal input to the first signal input terminal according to the digital control signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:功率放大器</p>
        <p type="p">110:電流偵測電路</p>
        <p type="p">120:第一保護電路</p>
        <p type="p">130:電壓產生器</p>
        <p type="p">140:輸入匹配電路</p>
        <p type="p">150、152:級間匹配電路</p>
        <p type="p">155:輸出匹配電路</p>
        <p type="p">RFIN:輸入端</p>
        <p type="p">RF:射頻訊號</p>
        <p type="p">RFOUT:輸出端</p>
        <p type="p">PA1、PA2、PA3:放大電路</p>
        <p type="p">BIAS1、BIAS2、BIAS3:偏壓電路</p>
        <p type="p">PAEN:功率放大器致能訊號</p>
        <p type="p">VCCB:系統電壓</p>
        <p type="p">VREF、VREFP:參考電壓</p>
        <p type="p">VOCP:數位控制訊號</p>
        <p type="p">NB1、NB2、NB3:放大電路的偏壓端</p>
        <p type="p">IN1、IN2、IN3:放大電路的訊號輸入端</p>
        <p type="p">OUT1、OUT2、OUT3:放大電路的訊號輸出端</p>
        <p type="p">IBIAS1、IBIAS3:偏壓電流</p>
        <p type="p">N120-1、N120-2:第一保護電路的端點</p>
        <p type="p">VBOUT1、VBOUT2、VBOUT3:偏壓電路的輸出端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="668" publication-number="202623982">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623982</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148624</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>外觀件的加工方法</chinese-title>
        <english-title>PROCESSING METHOD OF APPEARANCE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250325B">B29C45/00</main-classification>
        <further-classification edition="200601120250325B">B29C45/26</further-classification>
        <further-classification edition="200601120250325B">B29C45/46</further-classification>
        <further-classification edition="200601120250325B">C23G1/02</further-classification>
        <further-classification edition="200601120250325B">C25D11/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華碩電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASUSTEK COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李吉豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHI-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇信安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHU, HSIN-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡育翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YU HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁瑞煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENG, JUI-JUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種外觀件的加工方法至少包括以下步驟。通過射出成型製程產生金屬基材。金屬基材包括鎂鋁合金。對金屬基材執行酸洗製程，以形成半成品金屬基材。對半成品金屬基材的表面執行微弧氧化製程，以形成外觀面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A processing method of an appearance at least includes the following steps. A metal substrate is produced through an injection molding process. The metal substrate includes magnesium and aluminum alloys. A pickling process is performed on the metal substrate to form a semi-finished metal substrate. A MAO process is performed on a surface of the semi-finished metal substrate to form an appearance surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110、S120、S130:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="669" publication-number="202625412">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625412</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148625</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於網路數位分身的事件分析與環境生成系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR NETWORK DIGITAL TWIN BASED EVENT ANALYSIS AND ENVIRONMENT GENERATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250303B">H04L41/14</main-classification>
        <further-classification edition="202201120250303B">H04L43/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀幸辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHI, HSING-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊書豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHU-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃樽湰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, ZUN-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基於網路數位分身的事件分析與環境生成系統和其方法，該方法包含：通訊連接至實體網路設備群；響應於偵測到實體網路設備群的網路事件，自知識庫模組取得與網路事件相關的關聯式資訊以分析網路事件；根據分析結果和對應實體網路設備群的主網路環境模組決定網路拓樸；根據網路拓樸生成子網路環境模組群；響應於接收到整合指令，將子網路環境模組群整合至主網路環境模組，且對整合過程進行測試；以及響應於測試結果表示整合成功，根據主網路環境模組更新實體網路設備群的網路設定。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and a method for network digital twin based event analysis and environment generation are provided. The method includes: communicatively connecting to a group of physical network devices; in response to detecting a network event of the group of physical network devices, obtaining relational information associated with the network event from a knowledge base module to analyze the network event; determining a network topology based on the analysis result and a main network environment module corresponding to the group of physical network devices; generating a group of sub-network environment modules based on the network topology; in response to receiving an integration instruction, integrating the group of sub-network environment modules into the main network environment module and performing a test on the integration process; and in response to the test result indicating that the integration process is successful, updating network settings of the group of physical network devices according to the main network environment module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S210、S220、S230、S240、S250、S260:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="670" publication-number="202625105">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625105</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148632</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>臉部追蹤與動態３Ｄ模型投射系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120241231B">G06V40/00</main-classification>
        <further-classification edition="202201120241231B">G06V40/16</further-classification>
        <further-classification edition="200601120241231B">G06T17/00</further-classification>
        <further-classification edition="200601120241231B">G06F3/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>思偉達創新科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧萬偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧萬慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃彥智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭東穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉子伯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖子涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林邦棟</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是一種臉部追蹤與動態3D模型投射系統，主要由攝像設備經聯網連結網址，網址連結臉部3D動態應用程式，其中攝像設備具備可對臉部取得臉部動態影像資訊之影像擷取裝置，臉部3D動態應用程式包含：臉部特徵動態辨識模組、臉部動態座標生成模組及3D動態生成模組，透過臉部特徵動態辨識模組接收臉部動態影像資訊並判讀臉部中至少眼部及鼻頭的位置並生成複數動態辨識點，且對動態辨識點最密集處定義為高光區，高光區根據臉部動態影像資訊的變化而改變位置；臉部動態座標生成模組根據各高光區中的各動態辨識點生成對應的動態定位座標；3D動態生成模組具備複數3D動態影像資訊，根據各動態定位座標而投射其中之一3D影像資訊並層疊於臉部動態影像資訊，透過根據臉部追蹤取得臉部動態影像資訊，搭配臉部3D動態應用程式將3D影像資訊層疊於臉部動態影像資訊，達到在臉部不同角度和狀態下自由互動，並動態顯示3D效果。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:攝像設備</p>
        <p type="p">10:影像擷取裝置</p>
        <p type="p">2:臉部3D動態應用程式</p>
        <p type="p">20:臉部特徵動態辨識模組</p>
        <p type="p">22:臉部動態座標生成模組</p>
        <p type="p">24:3D動態生成模組</p>
        <p type="p">26:3D動態控制模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="671" publication-number="202625094">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625094</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148633</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>隨機生成與存儲３Ｄ模型的非同質化代幣系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">G06T17/00</main-classification>
        <further-classification edition="202201120250303B">H04L9/40</further-classification>
        <further-classification edition="201301120250303B">G06F21/10</further-classification>
        <further-classification edition="201201120250303B">G06Q20/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>思偉達創新科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧萬偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧萬慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃彥智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭東穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉子伯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖子涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林邦棟</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是一種隨機生成與存儲3D模型的非同質化代幣系統，主要包括：圖層編輯模組、資料庫、隨機編輯模組及數位輸出模組，其中圖層編輯模組包含至少一供產生複數3D素材之3D模型編輯單元及一連結該3D模型編輯單元並針對各3D素材分別寫入相關連屬性之後設資料單元，資料庫連結圖層編輯模組並儲存完成屬性寫入的各3D素材，隨機編輯模組連結資料庫，並根據隨機演算程式取得多個3D素材並動態組合成至少一3D模型資料，數位輸出模組連結隨機編輯模組並將3D模型資料輸出為3D檔案並可對3D檔案選擇性轉化為對應的非同質化代幣，非同質化代幣被記錄至一區塊鏈，藉此可將隨機生成的3D模型資料轉化為非同質化代幣，可廣泛應用於個性化商品創作、數位收藏品或虛擬資產的生成，確保每個生成的3D模型具有唯一性和不可篡改性。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">2:資料庫</p>
        <p type="p">3:隨機編輯模組</p>
        <p type="p">4:數位輸出模組</p>
        <p type="p">5:區塊鏈</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="672" publication-number="202624071">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624071</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148658</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於一摩托車之轉向資訊感測裝置、方法及其電腦程式產品</chinese-title>
        <english-title>STEERING INFORMATION SENSING DEVICE, METHOD, AND COMPUTER PROGRAM PRODUCT THEREOF FOR A MOTORCYCLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">B62K11/14</main-classification>
        <further-classification edition="200601120250401B">B62K23/02</further-classification>
        <further-classification edition="202001120250401B">B62J45/41</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恒典車業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HDMOTO LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>基隆市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳琮閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TSUNG-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪鼎杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種轉向資訊感測裝置、方法及其電腦程式產品。該轉向資訊感測裝置包含一壓力感測模組、一處理器及一儲存器，且該壓力感測模組電性連接至該儲存器。該壓力感測模組包含二壓力感測器，分別配置於一車輛的一車把相對兩側的一左握把部及一右握把部，用以感測一使用者操作該左握把部及該右握把部進行轉向時，該使用者施予該左握把部的一第一左壓力值及該右握把部的一第一右壓力值。儲存器用以儲存該第一左壓力值及第一右壓力值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A steering information sensing device, method, and computer program product thereof are provided. The steering information sensing device includes a pressure sensing module, a processor, and a storage, wherein the pressure sensing module is electrically connected to the storage. The pressure sensing module includes two pressure sensors for sensing a first left pressure value applied by a user to a left grip part and a first right pressure value applied by the user to a right grip part when the user operates the left grip part and right grip part for steering. The storage stores the first left pressure value and the first right pressure value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">6:轉向資訊感測方法</p>
        <p type="p">61、63:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="673" publication-number="202625150">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625150</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148666</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>注意力促進裝置及其應用系統</chinese-title>
        <english-title>DEVICE FOR ATTENTION PROMOTION AND APPLICATION SYSTEM THEREWITH</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250418B">G09G5/02</main-classification>
        <further-classification edition="201301120250418B">G06F3/048</further-classification>
        <further-classification edition="200601120250418B">A61N5/06</further-classification>
        <further-classification edition="200601120250418B">A61M21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立清華大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許慧玉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HUI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁志堅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DING, TSU-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許郁莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">於此提供一種注意力促進裝置和包括其的任務暨注意力促進系統。注意力促進裝置包括可提供複數個第一特定頻率信號的頻率產生單元，其中第一特定頻率信號至少包括12赫茲、14赫茲、19赫茲、介於20~22赫茲、22赫茲和介於38~40赫茲的頻率信號；處理控制單元接收並依據該些頻率信號，產生對應的複數個視覺控制指令；以及複數個視覺介質電連接該處理控制單元，該些視覺介質依據該些視覺控制指令，發出該些第一特定頻率的可見光。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device for attention promotion and a system of a task capable of promoting attention are provided herein. The device for attention promotion includes a unit of frequency generation for providing plural first specific frequency signals which at least include frequencies of 12Hz, 14Hz, 19Hz, 20~22Hz, 22Hz and 38~40 Hz; a processing and controlling unit which receives the plural frequency signals and generates plural visual control instructions according to the plural frequency signals; and plural visual mediums electrically coupled to the processing and controlling unit and emitting visible light in those frequencies in response to the visual control instructions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:注意力促進裝置</p>
        <p type="p">12:頻率產生單元</p>
        <p type="p">14:處理控制單元</p>
        <p type="p">16:視覺介質</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="674" publication-number="202625292">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625292</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148687</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>天線裝置</chinese-title>
        <english-title>ANTENNA DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250102B">H01Q1/38</main-classification>
        <further-classification edition="200601120250102B">H01Q1/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>智易科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARCADYAN TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭世杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, SHIH-JIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭信郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, SHIN-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種天線裝置，係運作於中心頻率。天線裝置包括基板與導電層。基板具有第一平面。導電層設置於基板的第一平面上。導電層具有印刷圖案，印刷圖案包括輻射元件與匹配元件。輻射元件具有沿第一方向排列的複數個曲折部。曲折部的相鄰兩者係實質平行並且相互電性耦接。匹配元件具有沿第一方向排列的複數個突出部。突出部的相鄰兩者係實質平行並且相互電性分離。匹配元件的各突出部沿第二方向夾設於輻射元件的曲折部的其中相鄰兩者之間，第二方向係與第一方向不平行。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An antenna device, operates at a center frequency. The antenna device includes a substrate and a conductive layer. The substrate has a first plane. The conductive layer is disposed on the first plane of the substrate. The conductive layer has a printed pattern, and the printed pattern includes a radiating element and a matching element. The radiating element has a plurality of meandering portions arranged along a first direction. Two adjacent meandering portions are substantially parallel with each other and electrically coupled to each other. The matching element has a plurality of protruding portions arranged along the first direction. Two adjacent protruding portions are substantially parallel with each other and electrically isolated from each other. Each protruding portion of the matching element is sandwiched between two adjacent meandering portions of the radiating element along a second direction, and the second direction is not parallel with the first direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">81:印刷圖案</p>
        <p type="p">100:輻射元件</p>
        <p type="p">200:匹配元件</p>
        <p type="p">300:接地區</p>
        <p type="p">110~160:曲折部</p>
        <p type="p">210~230:突出部</p>
        <p type="p">X:第一方向</p>
        <p type="p">Y:第二方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="675" publication-number="202624707">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624707</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148688</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>力覺感測裝置</chinese-title>
        <english-title>FORCE SENSING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250311B">G01L1/16</main-classification>
        <further-classification edition="200601120250311B">G01L1/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TZUNG-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊實文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHIN-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏維廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, WEI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種力覺感測裝置，包含：底座、彈性件、多個力感測元件。底座具有由凹陷表面形成的容置部分。彈性件設置於容置部分。力感測元件貼附於凹陷表面，且連接彈性件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A force sensing device includes: a base, an elastic member, a plurality of force sensing elements. The base has a receiving portion formed by a recessed surface. The elastic member is disposed at the receiving portion. The force sensing element are attached at the recessed surface and connect the elastic member.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:力覺感測裝置</p>
        <p type="p">10:底座</p>
        <p type="p">101:容置部分</p>
        <p type="p">102:凹陷表面</p>
        <p type="p">11:中心力感測元件</p>
        <p type="p">12,13:相鄰力感測元件</p>
        <p type="p">14:彈性件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="676" publication-number="202623766">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623766</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148689</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>檢測系統和檢測方法</chinese-title>
        <english-title>INSPECTION SYSTEM AND INSPECTION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120241231B">A61B5/24</main-classification>
        <further-classification edition="200601120241231B">A61B5/026</further-classification>
        <further-classification edition="200601120241231B">A61B5/021</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人國家衛生研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL HEALTH RESEARCH INSTITUTES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖倫德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, LUN-DE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">檢測系統具有加壓設備、雷射成像設備和運算設備。加壓設備用於對有其需要之個體的加壓部位施加壓力和釋放壓力。雷射成像設備用於獲取個體之檢測部位的影像資料。運算設備用於監測並記錄加壓設備施加和釋放壓力的壓力時序變化資料、監測並轉換影像資料為檢測部位中感興趣區域的血流灌注時序變化資料、並根據壓力時序變化資料、影像資料和血流灌注時序變化資料生成感興趣區域的血流灌注評估結果。檢測方法係藉由檢測系統實現。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An inspection system includes a pressurizing apparatus, a laser imaging apparatus, and a computing apparatus. The pressurizing apparatus is used to apply and relieve pressure to pressure areas of an individual in need thereof. The laser imaging apparatus is used to obtain image data from an inspection area of the individual. The computing apparatus is used to monitor and record pressure time series change data of the pressure apparatus applying and releasing pressure, monitor and convert the image data into blood flow perfusion time series change data of a region of interest in the inspection area, and generate blood perfusion evaluation results of the region of interest based on the pressure time series change data, the image data and the blood flow perfusion time series change data. An inspection method is implemented by the inspection system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:檢測系統</p>
        <p type="p">100:加壓設備</p>
        <p type="p">110:加壓器</p>
        <p type="p">120:袖套</p>
        <p type="p">200:雷射成像設備</p>
        <p type="p">210:雷射發射器</p>
        <p type="p">220:相機</p>
        <p type="p">300:運算設備</p>
        <p type="p">400:人機互動介面</p>
        <p type="p">PP:加壓部位</p>
        <p type="p">EP:檢測部位</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="677" publication-number="202624917">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624917</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148693</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>輸出回授電路及其操作方法</chinese-title>
        <english-title>OUTPUT FEEDBACK CIRCUIT AND METHOD OF OPERATION THE SAM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250528B">G05F1/565</main-classification>
        <further-classification edition="200601120250528B">G05F3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞源科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASIAN POWER DEVICES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝劍祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種輸出回授電路用以提供回授訊號至轉換電路，使轉換電路根據回授訊號平衡不同輸出電壓時的輸出功率。輸出回授電路包括補償電路與回授電路，且補償電路耦接轉換電路的輸出端。回授電路耦接補償電路，且接收相應於轉換電路的輸出電流的電流偵測訊號。補償電路根據輸出電壓的大小提供參考基準，以對電流偵測訊號或第一參考電壓進行補償，且回授電路在參考基準的補償下採樣電流偵測訊號而提供回授訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An output feedback circuit is used to provide a feedback signal to a conversion circuit, so that the conversion circuit balances an output power of different output voltages according to the feedback signal. The output feedback circuit includes a compensation circuit and a feedback circuit, and the compensation circuit is coupled to an output end of the conversion circuit. The feedback circuit is coupled to the compensation circuit and receives a current detection signal corresponding to an output current of the conversion circuit. The compensation circuit adjusts a constant current value between the current detection signal and a first reference voltage according to changes in the output voltage, and the feedback circuit samples the current detection signal and the first reference voltage according to the constant current value to provide a feedback signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電源轉換器</p>
        <p type="p">1:轉換電路</p>
        <p type="p">1A:輸出端</p>
        <p type="p">2:控制器</p>
        <p type="p">3:輸出回授電路</p>
        <p type="p">32:回授電路</p>
        <p type="p">200:負載</p>
        <p type="p">Po:輸出功率</p>
        <p type="p">Vin:輸入電壓</p>
        <p type="p">Vo:輸出電壓</p>
        <p type="p">Vref1:第一參考電壓</p>
        <p type="p">Io:輸出電流</p>
        <p type="p">Sf:回授訊號</p>
        <p type="p">PWM:脈寬調變訊號</p>
        <p type="p">Si:電流偵測訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="678" publication-number="202624802">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624802</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148694</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具光子晶片的封裝結構及其製造方法</chinese-title>
        <english-title>PACKAGE STRUCTURE HAVING PHOTONIC CHIP AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">G02B6/12</main-classification>
        <further-classification edition="200601120250303B">G02B6/122</further-classification>
        <further-classification edition="200601120250303B">G02B6/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭志偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, JR-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭志誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, CHIH-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具光子晶片的封裝結構及其製造方法。封裝結構包含一基板、一中介層、一光子晶片以及一光源。中介層設置於基板。光子晶片設置於基板。光源設置於基板。中介層電性連接於基板、光子晶片及光源。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A package structure having photonic chip and a manufacturing method thereof. The package structure includes a substrate, an interposer, a photonic chip and a light source. The interposer is disposed on the substrate. The photonic chip is disposed on the substrate. The light source is disposed on the substrate. The interposer is electrically connected to the substrate, the photonic chip and the light source.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:封裝結構</p>
        <p type="p">100:基板</p>
        <p type="p">101:安裝面</p>
        <p type="p">102:凹槽</p>
        <p type="p">103:第一側緣</p>
        <p type="p">104:第二側緣</p>
        <p type="p">105:第一開口</p>
        <p type="p">106:第二開口</p>
        <p type="p">150:中介層</p>
        <p type="p">200,210:電子晶片</p>
        <p type="p">250:光子晶片</p>
        <p type="p">300:次安裝件</p>
        <p type="p">301:線路層</p>
        <p type="p">310:墊部</p>
        <p type="p">350:光源</p>
        <p type="p">351:線路</p>
        <p type="p">400:光學組件</p>
        <p type="p">450:散熱片</p>
        <p type="p">451:缺口</p>
        <p type="p">452,453:側開口</p>
        <p type="p">500:光纖組件</p>
        <p type="p">A:出光方向</p>
        <p type="p">E:延伸方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="679" publication-number="202624692">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624692</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148696</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>三維形貌檢測裝置及其量測高深寬比微結構深度的量測方法</chinese-title>
        <english-title>THREE-DIMENSIONAL MORPHOLOGY DETECTION DEVICE AND MEASUREMENT METHOD FOR DETERMINING DEPTH OF HIGH ASPECT RATIO MICROSTRUCTURES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250613B">G01B11/22</main-classification>
        <further-classification edition="202201120250613B">G01B9/02015</further-classification>
        <further-classification edition="200601120250613B">G02B21/08</further-classification>
        <further-classification edition="200601120250613B">G02B5/12</further-classification>
        <further-classification edition="200601120250613B">G02B27/10</further-classification>
        <further-classification edition="202501120250613B">H10F39/15</further-classification>
        <further-classification edition="202501120250613B">H10F39/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李正綱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHENG-KANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉佳良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, CHIA-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顧逸霞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KU, YI-SHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅竣威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, CHUN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種三維形貌檢測裝置包含感光元件及量測機構。感光元件用以提供關於樣本的檢測影像。量測機構用以提供平行光至樣本的三維形貌成像於感光元件，其中該量測機構包含在同一水平方向上配置的物鏡、分光元件、檢測光源、光束準直元件及光反射元件。物鏡用以提供樣本的檢測影像至感光元件。分光元件用以將準直後的光束分為參考光和樣品光，並將反射的參考光及由樣本反射的樣品光的相位疊加而使樣本的檢測影像具有干涉條紋。光反射元件用以反射參考光以供分光元件來接收。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A three-dimensional (3D) morphology detection device comprises a photosensitive element and a measurement mechanism. The photosensitive element is configured to provide detection images of a sample. The measurement mechanism is configured to provide parallel light to achieve 3D morphology imaging of the sample on the photosensitive element. The measurement mechanism includes, in the same horizontal direction, an objective lens, a beam splitter, a detection light source, a beam collimating element, and a light reflecting element. The objective lens is configured to provide detection images of the sample to the photosensitive element. The beam splitter is configured to split the collimated light beam into reference light and sample light and to superimpose the phases of the reflected reference light and the sample light reflected from the sample, thereby introducing interference fringes in the detection images of the sample. The light reflecting element is configured to reflect the reference light for reception by the beam splitter.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:三維形貌檢測裝置</p>
        <p type="p">9:樣本</p>
        <p type="p">10:感光元件</p>
        <p type="p">11:物鏡</p>
        <p type="p">12:鏡筒透鏡組</p>
        <p type="p">13:分光元件</p>
        <p type="p">14:檢測光源</p>
        <p type="p">15:光束準直元件</p>
        <p type="p">16:光反射元件</p>
        <p type="p">P1:參考光路</p>
        <p type="p">P2:樣品光路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="680" publication-number="202625345">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625345</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148698</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電源轉換器</chinese-title>
        <english-title>POWER CONVERTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200701120241223B">H02M1/34</main-classification>
        <further-classification edition="200601120241223B">H02M3/335</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群光電能科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHICONY POWER TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李明翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MIN-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>買柏豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAI, PO-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電源轉換器包括轉換電路、控制器、緩震電路以及儲能元件。轉換電路接收輸入電壓並且輸出輸出電壓。控制器耦接轉換電路，用以控制轉換電路以調節輸出電壓。緩震電路耦接於轉換電路與控制器之間，並且提供緩震電壓。儲能元件用以接收緩震電壓做為控制器的操作電壓。控制器、儲能元件以及緩震電路耦接於第一節點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power converter includes a conversion circuit, a controller, a snubber circuit, and an energy storage component. The conversion circuit receives an input voltage and outputs an output voltage. The controller is coupled to the conversion circuit, and is used to control the conversion circuit to adjust the output voltage. The snubber circuit is coupled between the conversion circuit and the controller, and is used to provide a snubber voltage. The energy storage component is used to receive the snubber voltage as an operating voltage of the controller. The controller, the energy storage component, and the snubber circuit are coupled to a first node.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電源轉換器</p>
        <p type="p">10:轉換電路</p>
        <p type="p">20:緩震電路</p>
        <p type="p">30:儲能元件</p>
        <p type="p">40:輔助電路</p>
        <p type="p">100:控制器</p>
        <p type="p">Vin:輸入電壓</p>
        <p type="p">Vout:輸出電壓</p>
        <p type="p">Vsnb:緩震電壓</p>
        <p type="p">Vcc:操作電壓</p>
        <p type="p">N&lt;sub&gt;1&lt;/sub&gt;:第一節點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="681" publication-number="202624695">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624695</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148700</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種感測氣體及形變的感測裝置</chinese-title>
        <english-title>APPARATUS FOR SENSING GAS AND DEFORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260316B">G01B13/24</main-classification>
        <further-classification edition="202601120260316B">H02J15/00</further-classification>
        <further-classification edition="201001120260316B">H01M10/052</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀華倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHI, HUA-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈玉杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, YU-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉建南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, CHIEN-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃肇達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHAO-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種感測裝置 ，適用於感測氣體及形變，包括基板、殼體、彈性部、形變感測元件、氣體感測元件、凸出部。殼體包括環形固定部、環形連接部、開孔。環形固定部具有下表面。環形連接部沿中心軸的軸向連接基板及環形固定部，中心軸穿過基板的中心。開孔設置於環形連接部。彈性部連接環形固定部且被環形固定部圍繞，基板、彈性部與環形連接部定義空腔，空腔與開孔相連通。形變感測元件設置於彈性部的第一表面上。氣體感測元件設置於基板上且設置在空腔中。凸出部連接彈性部，並從彈性部的第二表面沿著中心軸延伸，並且凸出於環形固定部的下表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus configured to detect gas and deformation is provided, which includes a substrate, a case, an elastic portion, a deformation sensing element, a gas sensing element, and a protruding portion. The case includes an annular fixed portion, an annular connecting portion, and an opening. The annular fixed portion has a lower surface. The annular connecting portion connects the substrate and the annular fixed portion along an axis direction of a central axis, and the central axis passes through a center of the substrate. The opening is disposed on the annular connecting portion. The elastic portion connects to the annular fixed portion and is surrounded by the annular fixed portion. A cavity is defined by the substrate, the elastic portion and the annular connecting portion. The cavity is in communication with the opening. The deformation sensing element is disposed on the substrate and in the cavity. The protruding portion connects to the elastic portion, extends from the second surface of the elastic portion along the central axis, and extends beyond the lower surface of the annular fixed portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:感測裝置</p>
        <p type="p">110:殼體</p>
        <p type="p">113:開孔</p>
        <p type="p">120:基板</p>
        <p type="p">134:凸出部</p>
        <p type="p">X,Y,Z:座標</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="682" publication-number="202623941">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623941</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148704</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>迴轉式刀庫系統</chinese-title>
        <english-title>ROTARY TOOL MAGAZINE SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250114B">B23Q3/155</main-classification>
        <further-classification edition="200601120250114B">B23Q3/157</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李浩忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HAO-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李浩忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HAO-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡和勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, HO-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種迴轉式刀庫系統，設置於加工機上，迴轉式刀庫系統包括迴轉式儲刀裝置和刀具交換裝置。迴轉式儲刀裝置位於主軸前側，並具有可繞X軸旋轉的迴轉單元，迴轉單元設置多個刀夾座，刀夾座夾持刀具，能通過迴轉單元迴旋升降，在儲刀位置與換刀夾座位置之間切換，刀具交換裝置能於換刀夾座位置將刀夾座從迴轉式儲刀裝置取下或回放，並將取下的刀夾座沿X軸、Z軸至少其中一軸移動至換刀位置，供主軸進行刀具更換，藉以達到高效換刀及減少刀庫佔用加工機空間；並可依需求於刀具交換裝置安裝刀夾座旋轉驅動單元，用以達到多方向換刀功能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure provides a rotary tool magazine system installed on a machining device. The rotary tool magazine system includes a rotary tool storage device and a tool exchange device. The rotary tool storage device is positioned at the front side of the spindle and features a rotary unit capable of rotating around the X-axis. The rotary unit is equipped with multiple tool clamp holders that hold tools and can rotate and move vertically via the rotary unit, switching between the tool storage position and the tool clamp holder position. The tool exchange device can remove or reinstall the tool clamp holders from the rotary tool storage device at the tool clamp holder position and move the removed tool clamp holders along at least one of the X-axis or Z-axis to the tool exchange position for the spindle to perform tool replacement. This configuration achieves efficient tool changing and reduces the space occupied by the tool magazine on the machining device. Additionally, a rotation drive unit for the tool clamp holders can be installed on the tool exchange device as needed to achieve multi-directional tool changing functionality.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:迴轉式刀庫系統</p>
        <p type="p">10:加工機</p>
        <p type="p">11:工作平台</p>
        <p type="p">12:主軸</p>
        <p type="p">13:機座</p>
        <p type="p">14:立柱</p>
        <p type="p">15:架體</p>
        <p type="p">20:迴轉式儲刀裝置</p>
        <p type="p">21:迴轉單元</p>
        <p type="p">22:刀夾座</p>
        <p type="p">23:刀具</p>
        <p type="p">24:限位架</p>
        <p type="p">27:橫向固定柱</p>
        <p type="p">28:支撐柱</p>
        <p type="p">30:刀具交換裝置</p>
        <p type="p">33:Z軸驅動單元</p>
        <p type="p">34:X軸驅動單元</p>
        <p type="p">35:刀夾座旋轉驅動單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="683" publication-number="202625654">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625654</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148706</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置及其修補方法</chinese-title>
        <english-title>DISPLAY DEVICE AND REPAID METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120241223B">H10K59/00</main-classification>
        <further-classification edition="202301120241223B">H10K59/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富為</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, FU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置，包括一面板、一封裝層、多個發光元件、一光學膜及至少一膠體。封裝層設置於面板的一表面上。多個發光元件配置於封裝層。光學膜覆蓋封裝層且包括一開口區。至少一膠體填充於開口區。一種顯示裝置的修補方法亦被提供。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device includes a panel, a packaging layer, a plurality of light emitting elements, an optical film, and at least one adhesive. The packaging layer is disposed on a surface of the panel. The plurality of light emitting elements is arranged in the packaging layer. The optical film covers the packaging layer and includes an open zone. The at least one adhesive is filled in the open zone. A repair method of the display device is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示裝置</p>
        <p type="p">110:面板</p>
        <p type="p">112:表面</p>
        <p type="p">120:封裝層</p>
        <p type="p">122:線路區</p>
        <p type="p">130:發光元件</p>
        <p type="p">140:光學膜</p>
        <p type="p">142:開口區</p>
        <p type="p">144:外表面</p>
        <p type="p">150:膠體</p>
        <p type="p">160:接著層</p>
        <p type="p">F:異物</p>
        <p type="p">L:方向</p>
        <p type="p">G1:間距</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="684" publication-number="202623825">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623825</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148721</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>增強幹細胞中粒線體之活性的方法、粒線體之用途及含粒線體之醫藥組成物</chinese-title>
        <english-title>METHOD FOR ENHANCING MITOCHONDRIAL ACTIVITY IN STEM CELLS, USE OF MITOCHONDRIA, AND PHARMACEUTICAL COMPOSITION INCLUDING MITOCHONDRIA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120250501B">A61K35/28</main-classification>
        <further-classification edition="200601120250501B">A61K47/36</further-classification>
        <further-classification edition="200601120250501B">A61P35/00</further-classification>
        <further-classification edition="200601120250501B">A61P9/00</further-classification>
        <further-classification edition="200601120250501B">A61P37/00</further-classification>
        <further-classification edition="200601120250501B">A61P25/00</further-classification>
        <further-classification edition="200601120250501B">A61P3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立成功大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳佳慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIA-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張明敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, MING-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於增強幹細胞中粒線體之活性的方法，其包含培養幹細胞以形成幹細胞球體。一種粒線體之用途，其係用於製備治療或預防受益於粒線體功能增強之疾病或症狀。此用途包含培養幹細胞以形成幹細胞球體，從幹細胞球體中分離粒線體，以及施予有其需要之個體有效量的粒線體。一種醫藥組成物，其包含從上述方法之幹細胞球體中分離出的粒線體以及醫藥上可接受的載體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for enhancing mitochondrial activity in stem cells includes culturing the stem cells to form stem cell spheres. A use of mitochondria for manufacture of a composition for treating or preventing a disease or condition benefiting from increased mitochondrial function. The use includes culturing the stem cells to form stem cell spheres, isolating the mitochondria from the stem cell spheres, and administering an effective amount of the mitochondria to a subject in need thereof. A pharmaceutical composition includes the mitochondria isolated from the stem cell spheres of the aforementioned method and a pharmaceutically acceptable carrier.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="685" publication-number="202624598">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624598</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148732</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>骨架之結構及其方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">E04C2/30</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>集合家股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GATHER HOME CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯俊銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇彥文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為有關一種骨架之結構及其方法，包括一骨架件、一骨架結合部、一卡掣部、一穿口、一緊迫部、至少一連接件、一對接部、一避位部、及一連接部，係先取數個四面處係分別形成有數個彼此相同外觀尺寸之骨架結合部的骨架件，且再取連接件，利用對接部先行位置對應穿口，且連接部之寬度與穿口之延伸方向呈現相互垂直，而後對接部於穿越穿口後置入卡掣部內，再將連接件進行旋轉，使避位部避開卡掣部之內側壁，使對接部順利的於卡掣部內旋轉，進而讓連接件與骨架件相互固設，最後再利用連接部與另一骨架件之骨架結合部結合，藉此達到一種連接件可直接從穿口處置入卡掣部內，無須從骨架件端部置入，方便又快速，尤其工人無須現場裁切、及額外的加工，僅需要現場直接組配安裝即可快速完成室內裝潢，且可有效節省人力，無須使用過多的工人進行裝配之優勢。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:骨架件</p>
        <p type="p">2:連接件</p>
        <p type="p">21:對接部</p>
        <p type="p">211:避位部</p>
        <p type="p">212:對位部</p>
        <p type="p">22:連接部</p>
        <p type="p">221:定位部</p>
        <p type="p">23:頸部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="686" publication-number="202624600">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624600</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148733</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>骨架之結構及其方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250312B">E04F19/00</main-classification>
        <further-classification edition="200601120250312B">E04F17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>集合家股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GATHER HOME CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯俊銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為有關一種骨架之結構及其方法，主要先取數個四面處係分別形成有數個彼此相同外觀尺寸之骨架結合部的骨架件，且利用至少一連接件將各個骨架件進行結合，並將結合後之各個骨架件分別施作設置於一室內空間的地面處、牆壁處、及天花板處，再將一具有數個第一排水部的第一排水件接設於一排水管上，再將一連通件設置於一第一排水件上，再於地面處的骨架件與牆壁處的骨架件之間設置一形成有一廢水通道的支撐件，最後將一個二側處分別設有數個第二排水部的第二排水件設置於支撐件上，且第二排水件兩側分別與各個支撐部之間形成一溢流空間，藉此使廢水通過溢流空間而經由各個第二排水部流入廢水通道內，達到工人無須現場裁切、及額外的加工，僅需要現場直接組配安裝即可快速完成裝潢，且可有效節省人力，無須使用過多的工人進行裝配。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:第一排水件</p>
        <p type="p">11:第一排水部</p>
        <p type="p">2:連通件</p>
        <p type="p">21:落水頭</p>
        <p type="p">22:止水墊圈</p>
        <p type="p">23:飾蓋</p>
        <p type="p">3:支撐件</p>
        <p type="p">31:廢水通道</p>
        <p type="p">32A:第一支撐部</p>
        <p type="p">321A:第一側壁部</p>
        <p type="p">322A:第一彎折部</p>
        <p type="p">323A:第一載部</p>
        <p type="p">32B:第二支撐部</p>
        <p type="p">321B:第二側壁部</p>
        <p type="p">322B:第二頂部</p>
        <p type="p">323B:第二載部</p>
        <p type="p">33:穿孔</p>
        <p type="p">4:第二排水件</p>
        <p type="p">41:第二排水部</p>
        <p type="p">42:載槽</p>
        <p type="p">421:載槽凹部</p>
        <p type="p">F:角碼</p>
        <p type="p">G:螺絲</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="687" publication-number="202624841">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624841</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148741</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250801B">G02B30/26</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡玉堂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YUTANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳佳龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JIA-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林晉安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIN-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖亦婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAW, YI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田堃正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIEN, KUN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置包括顯示面板及透明顯示面板。透明顯示面板設置於顯示面板的前方。顯示面板與透明顯示面板相隔一段距離。於顯示裝置的一個圖框時間內，顯示面板顯示第一畫面，透明顯示面板顯示第二畫面，第一畫面與第二畫面相搭配，以提供一實際景深畫面。圖框時間包括依時序進行的多個子圖框時間。顯示面板分別於多個子圖框時間顯示多個子畫面。多個子畫面彼此不同，且多個子畫面於圖框時間內能疊加為第一畫面。此外，其它多種顯示裝置也被提出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display apparatus includes a display panel and a transparent display panel. The transparent display panel is disposed in front of the display panel. The display panel is separated from the transparent display panel by a distance. Within a frame time of the display apparatus, the display panel displays a first image, the transparent display panel displays a second image, and the first image and the second image are matched to provide a real depth image. The frame time includes sub-frame times in time sequence. The display panel displays sub-images in the sub-frames times respectively. The sub-images are different from each other, and the sub-images can be superimposed into the first image within the frame time. In addition, other display apparatus are also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:顯示裝置</p>
        <p type="p">100:顯示面板</p>
        <p type="p">200:透明顯示面板</p>
        <p type="p">212:畫素區</p>
        <p type="p">214:透光區</p>
        <p type="p">D:距離</p>
        <p type="p">t1:子圖框時間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="688" publication-number="202623738">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623738</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148742</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>紙蓮花結構</chinese-title>
        <english-title>PAPER LOTUS STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250126B">A47G33/00</main-classification>
        <further-classification edition="201701120250126B">B31D5/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊昀達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHUANG, YUN DA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊昀達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHUANG, YUN DA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王德文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種紙蓮花結構，包含有：一紙材，具有：一第一花瓣區域，具有複數個呈環狀排列之第一花瓣切線及沿該等第一花瓣切線切割所形成之該複數個第一花瓣部，其中每一該第一花瓣切線彼此不連接，使每一該第一花瓣部與相鄰二該相鄰之第一花瓣部至少一部分相連接；一第二花瓣區域，位於該第一花瓣區域之徑向內側；該第二花瓣區域具有複數個呈環狀排列之第二花瓣切線及沿該等第二花瓣切線切割所形成之該複數個第二花瓣部，其中每一該第二花瓣切線彼此不連接，使每一該第二花瓣部與相鄰二該相鄰之第二花瓣部相連接，且每一該第二花瓣部分別位於於每一該第一花瓣部之徑向內側；一花芯部，環繞於該等第一花瓣部之徑向外側，且該花芯部至少一部分連接於該等第一花瓣部；以及複數個折線，係沿該紙材之中心放射狀向外延伸，且每一該第一花瓣部與每一該第二花瓣部被至少一該折線貫穿；藉此，將該花芯部以朝向該紙材中央的方向彎折固定，並將該等外花瓣部及該等內花瓣部分別向外扳動並沿該等折線彎折，即構成一蓮花外型之立體紙蓮花結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A paper lotus structure comprises: A paper, which includes: A first petal area: Consisting of multiple first petal segments arranged in a circular pattern and formed along multiple first petal cut lines. Each first petal cut line is unconnected to the others, so each first petal segment is at least partially connected to its two adjacent first petal segments. A second petal area: Positioned radially inward from the first petal area. The second petal area consists of multiple second petal segments arranged in a circular pattern and formed along multiple second petal cut lines. Each second petal cut line is unconnected to the others, so each second petal segment is connected to its two adjacent second petal segments. Each second petal segment is located radially inward from each corresponding first petal segment. A flower core: Surrounding the first petal segments on their radial outer side, with at least a portion of the flower core connected to the first petal segments. Multiple folding lines: Extending radially outward from the center of the paper sheet, where each first petal segment and each second petal segment are intersected by at least one folding line. By folding the flower core inward toward the center of the paper sheet and bending the first and second petal segments outward along the folding lines, a three-dimensional paper lotus structure with a lotus flower shape is formed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:紙材</p>
        <p type="p">10:第一花瓣區域</p>
        <p type="p">11:第一花瓣切線</p>
        <p type="p">110:第一弧線</p>
        <p type="p">111:第一頂點</p>
        <p type="p">112:第一反向切線</p>
        <p type="p">113:第二反向切線</p>
        <p type="p">12:第一花瓣部</p>
        <p type="p">120:第一反折部</p>
        <p type="p">121:第二反折部</p>
        <p type="p">20:第二花瓣區域</p>
        <p type="p">21:第二花瓣切線</p>
        <p type="p">210:第二弧線</p>
        <p type="p">211:第二頂點</p>
        <p type="p">212:第三反向切線</p>
        <p type="p">213:第四反向切線</p>
        <p type="p">22:第二花瓣部</p>
        <p type="p">220:第三反折部</p>
        <p type="p">221:第四反折部</p>
        <p type="p">30:第三花瓣區域</p>
        <p type="p">31:第三花瓣切線</p>
        <p type="p">310:第三弧線</p>
        <p type="p">311:第三頂點</p>
        <p type="p">312:第五反向切線</p>
        <p type="p">313:第六反向切線</p>
        <p type="p">32:第三花瓣部</p>
        <p type="p">320:第五反折部</p>
        <p type="p">321:第六反折部</p>
        <p type="p">40:第四花瓣區域</p>
        <p type="p">41:第四花瓣切線</p>
        <p type="p">410:第四弧線</p>
        <p type="p">411:第四頂點</p>
        <p type="p">12:第七反向切線</p>
        <p type="p">413:第八反向切線</p>
        <p type="p">42:第四花瓣部</p>
        <p type="p">420:第七反折部</p>
        <p type="p">421:第八反折部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="689" publication-number="202624613">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624613</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148743</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>提升組裝效率之打氣筒</chinese-title>
        <english-title>INFLATOR THAT IMPROVES ASSEMBLY EFFICIENCY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250311B">F04B33/00</main-classification>
        <further-classification edition="200601120250311B">F04B53/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雙餘實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BETO ENGINEERING &amp; MARKETING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王羅平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LOPIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱世仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種提升組裝效率之打氣筒，包含有：一底座；一凹室，自該底座的底面向內凹設；一裝設孔與一組裝孔，自該底座頂面向內凹設，並連通該凹室；一缸體，底端裝設於該裝設孔中；一活塞桿及一活塞，裝設於該缸體中；一連接構件，具有一第一連接端與一第二連接端；一氣流通道，設於該連接構件中；該連接構件係裝入該底座之該凹室中；該缸體底端與該連接構件之第一連接端連接；該連接構件之第二連接端位於該組裝孔之處；一輸氣管，其一端連接該連接構件之第二連接端。以該連接構件連接該缸體及該輸氣管，可快速組裝該打氣筒。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An inflator that improves assembly efficiency includes: a base; a recess is provided on a bottom of the base; an installation hole and an assembly hole are provided on a top of the base and communicating with the recess; a cylinder is installed in the installation hole; a piston rod and a piston are installed in the cylinder; a connecting member with a first connecting end and a second connecting end; an airflow channel is provided in the connecting member. The connecting member is installed in the recess of the base; the bottom end of the cylinder is connected to the first connecting end of the connecting member; the second connecting end of the connecting member is located at the assembly hole; an air tube with one end connected to the second connecting end of the connecting member. The cylinder and the air tube are connected with the connecting member, and the inflator can be quickly assembled.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:打氣筒</p>
        <p type="p">20:底座</p>
        <p type="p">22:筒部</p>
        <p type="p">24:凹室</p>
        <p type="p">241:第一端壁</p>
        <p type="p">242:第二端壁</p>
        <p type="p">25:裝設孔</p>
        <p type="p">26:組裝孔</p>
        <p type="p">30:缸體</p>
        <p type="p">32:壓縮空間</p>
        <p type="p">34:第一結合部</p>
        <p type="p">40:活塞桿</p>
        <p type="p">42:活塞</p>
        <p type="p">44:缸蓋</p>
        <p type="p">46:握把</p>
        <p type="p">A:連接構件</p>
        <p type="p">B:氣流通道</p>
        <p type="p">50:橋接件</p>
        <p type="p">51:第一端(第一連接端)</p>
        <p type="p">52:第二端</p>
        <p type="p">54:第一流道</p>
        <p type="p">55:第二結合部</p>
        <p type="p">56:止逆件</p>
        <p type="p">60:輸氣管座</p>
        <p type="p">61:外端(第二連接端)62:內端</p>
        <p type="p">64:第二流道</p>
        <p type="p">65:接頭</p>
        <p type="p">70:輸氣管</p>
        <p type="p">72:帽蓋</p>
        <p type="p">74:氣嘴接頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="690" publication-number="202623717">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623717</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148744</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>黑水虻寵物乾糧及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120250501B">A23K50/40</main-classification>
        <further-classification edition="201601120250501B">A23K20/147</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寶榮寵物企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇國榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李孟寰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈伊華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮莠蓉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種寵物乾糧的製造方法，是先將多個黑水虻製成多個原料蟲粉的預處理步驟，接著預備一培養基。其中，每一公升的培養基含有30~50克的蔗糖、3~5克的磷酸氫二鉀、0.5~1.5克的食鹽、0.3~0.8克的酵母提取物、1~4克的硫酸胺，及0.1~0.5克的硫酸鎂。在活化一黑酵母菌株後導入該培養基，持續8~10天的震盪培養而進行液態發酵，再導入一盛裝該培養基的發酵槽，並持續8~10天的通氣攪拌而繼續進行液態發酵。後續再將該等原料蟲粉與多個米糠混合為一培養物料，將該培養物料接種於該培養基而進行固態發酵，最後將製成的發酵蟲粉與成型用料一同成型而製成多個本發明寵物乾糧。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:預處理步驟</p>
        <p type="p">111:清洗子步驟</p>
        <p type="p">112:乾燥子步驟</p>
        <p type="p">113:碎化子步驟</p>
        <p type="p">114:過篩子步驟</p>
        <p type="p">115:保存子步驟</p>
        <p type="p">12:預備步驟</p>
        <p type="p">13:活化步驟</p>
        <p type="p">14:液態發酵步驟</p>
        <p type="p">15:固態發酵步驟</p>
        <p type="p">16:成型步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="691" publication-number="202625415">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625415</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148747</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>容器化網路功能碳排系統、估算方法及電腦可讀媒介</chinese-title>
        <english-title>CONTAINERIZED NETWORK FUNCTION CARBON EMISSION SYSTEM, ESTIMATION METHOD AND COMPUTER READABLE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250303B">H04L43/20</main-classification>
        <further-classification edition="200601120250303B">G06F11/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳銘晏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, MING-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇琬婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, WAN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡崇智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHUNG-JHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李建樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIEN-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林長榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種容器化網路功能碳排系統、估算方法及電腦可讀媒介，係由資源監控模組收集複數實體設備、容器化網路功能與容器之組態資訊與效能資訊，並量測複數實體設備與其元件之功耗。再者，由功耗估算模組之功耗估算方法利用複數實體設備、容器化網路功能與容器之組態資訊與效能資訊、及複數實體設備與其元件之功耗之量測結果，估算出複數容器化網路功能與容器之功耗資訊，進而得到複數容器化網路功能與容器之功耗估算結果。另外，由碳排估算模組之碳排估算方法利用複數容器化網路功能與容器之功耗估算結果，估算出複數容器化網路功能與容器之碳排資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention discloses a containerized network function carbon emission system, estimation method and computer readable medium. A resource monitoring module collects configuration information and performance information of multiple physical devices, containerized network functions and containers, and measures power consumption of the multiple physical devices and their components. Furthermore, a power consumption estimation method of a power consumption estimation module utilizes the configuration information and the performance information of the multiple physical devices, the containerized network functions and the containers, and measurement results of the power consumption of the multiple physical devices and their components to estimate power consumption information of the multiple containerized network functions and the containers, thereby obtaining power consumption estimation results of the multiple containerized network functions and the containers. In addition, a carbon emission estimation method of a carbon emission estimation module uses the power consumption estimation results of the multiple containerized network functions and the containers to estimate carbon emission information of the multiple containerized network functions and the containers.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:容器化網路功能碳排系統</p>
        <p type="p">10:資源監控模組</p>
        <p type="p">20:功耗估算模組</p>
        <p type="p">30:資料庫</p>
        <p type="p">40:碳排估算模組</p>
        <p type="p">50:容器基礎設施</p>
        <p type="p">60:容器化網路功能</p>
        <p type="p">70:容器</p>
        <p type="p">A:實體設備</p>
        <p type="p">A1:容器化平台</p>
        <p type="p">B:容器資源</p>
        <p type="p">C:雲管理系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="692" publication-number="202625409">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625409</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148748</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於消除週期性雜訊之方法、裝置與電腦可讀取儲存媒體</chinese-title>
        <english-title>METHOD, DEVICE AND COMPUTER-READABLE STORAGE MEDIUM FOR ELIMINATING PERIODIC NOISE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">H04L25/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張國韋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, KUO-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林長榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種週期性雜訊消除之方法，以及相應之裝置與電腦可讀取儲存媒體。該方法用於根據一輸入信號提供一輸出信號，其中，該輸入信號包含多個各有不同週期之週期信號，該輸出信號係自該輸入信號中濾除該多個週期信號中之一目標信號後所得之結果。該方法包括：接收該輸入信號；根據各該週期信號之週期建構一相伴矩陣；根據該目標信號之週期計算一第一分圓多項式；根據該相伴矩陣與該第一分圓多項式計算一過濾矩陣；以及根據該輸入信號與該過濾矩陣計算該輸出信號，藉以改善其精確度和速度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for eliminating a periodic noise, a corresponding device and a corresponding computer-readable storage medium are provided. The method is configured to provide an output signal based on an input signal. The input signalincludes a plurality of periodic signals. Each periodic signal has a different period. The output signal is the result of filtering out a target signal from the input signal. The target signal is one of the periodic signals. The method includes: receiving the input signal; constructing a companion matrix based on the period of each of the periodic signals; calculating a first cyclotomic polynomial based on the period of the target signal; calculating a filter matrix based on the companion matrix and the first cyclotomic polynomial; and calculating the output signal based on the input signal and the filter matrix, thereby improving its accuracy and speed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101~106:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="693" publication-number="202625408">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625408</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148749</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＶｏＩＰ通訊系統與方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR VOIP COMMUNICATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250325B">H04L9/32</main-classification>
        <further-classification edition="200601120250325B">H04L9/28</further-classification>
        <further-classification edition="200601120250325B">H04M1/253</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳尚逸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHANG YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊定軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JHUANG, DING SYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施銘原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, MING YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許明風</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, MING FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林長榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種VoIP通訊系統與方法，係利用區塊鏈分散式儲存技術，以達到去中心化的資訊共享。企業端則自行保管解密私鑰。當企業間進行SIP VoIP通訊時，主叫端先向被叫端發送一次性密碼請求(用被叫端之公鑰加密)，被叫端回覆SIP呼叫認證所需之一次性密碼(以主叫端之公鑰加密)給主叫端。前述流程搭配具有時效性的使用者名稱，能有效地進行SIP認證以確認被叫端企業，從而確保不會有冒名通話的問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and a method for VoIP communication are provided, which utilize blockchain decentralized storage technology to achieve decentralized information sharing. The enterprises keep private keys by themselves for decryption. When SIP VoIP communication takes place between enterprises, the caller first sends a one-time password request (encrypted with the public key of the called enterprise) to the called enterprise, and the called enterprise replies with a one-time password (encrypted with the public key of the caller ) required for SIP call authentication to the caller. The aforementioned process combined with the time-sensitive username can be effectively used for SIP authentication to authenticate the called enterprise, thus ensuring that there will be no problem of impersonation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:跨企業認證VoIP通訊模組</p>
        <p type="p">111:一次性密碼處理單元</p>
        <p type="p">112:區塊鏈接取單元</p>
        <p type="p">113:呼叫與認證單元</p>
        <p type="p">114:收發單元</p>
        <p type="p">115:區塊鏈儲存單元</p>
        <p type="p">116:郵件伺服器</p>
        <p type="p">117:外部企業</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="694" publication-number="202625399">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625399</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148766</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資料傳輸裝置及資料傳輸方法</chinese-title>
        <english-title>DATA TRANSMISSION DEVICE AND DATA TRANSMISSION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250326B">H04J14/00</main-classification>
        <further-classification edition="200601120250326B">G02B6/26</further-classification>
        <further-classification edition="200601120250326B">G02B6/293</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳婷卉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TING-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種資料傳輸裝置包含多工器、光傳輸器及去多工器。光傳輸器耦接於多工器。去多工器耦接於光傳輸器。多工器用以將第一光訊號的複數個特定波段過濾為複數個波段光訊號。光傳輸器用以傳輸複數個波段光訊號。去多工器用以將複數個波段光訊號合成為第二光訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A Data transmission device and data transmission method includes a multiplexer, an optical transmitter, and a demultiplexer. The optical transmitter is coupled to the multiplexer. The demultiplexer is coupled to the optical transmitter. The multiplexer is configured to filter a plurality of specific wavebands of a first optical signal into a plurality of waveband optical signals. The optical transmitter transmits the plurality of waveband optical signals. The demultiplexer is configured to synthesize the plurality of waveband optical signals into a second optical signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:資料傳輸裝置</p>
        <p type="p">M1:多工器</p>
        <p type="p">MZ:光傳輸器</p>
        <p type="p">M2:去多工器</p>
        <p type="p">M11~M14:第一微環諧振器/微環諧振器</p>
        <p type="p">M21~M24:第二微環諧振器/微環諧振器</p>
        <p type="p">P1:第一端口</p>
        <p type="p">P2:第二端口</p>
        <p type="p">P3:第三端口</p>
        <p type="p">P4:第四端口</p>
        <p type="p">W1:波長選擇開關單元</p>
        <p type="p">SB1:基板</p>
        <p type="p">SL1:第一光訊號</p>
        <p type="p">SL2:第二光訊號</p>
        <p type="p">SL11~SL18:波段光訊號</p>
        <p type="p">SL111,SL113:分光訊號</p>
        <p type="p">SL112:光轉換訊號</p>
        <p type="p">PS1~PS4:熱光開關</p>
        <p type="p">PL1~PL4:路徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="695" publication-number="202625445">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625445</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148767</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置以及用於顯示裝置的操作方法</chinese-title>
        <english-title>DISPLAY DEVICE AND OPERATING METHOD FOR DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120241231B">H04N21/2385</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緯創資通股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳豐元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, FENG YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種顯示裝置以及用於顯示裝置的操作方法。顯示裝置包括顯示面板、通道選擇電路以及處理器。通道選擇電路經由多個通道的其中之一傳輸溝通資料。處理器接收影像資料，並依據影像資料控制顯示面板顯示畫面。處理器依據連結命令判斷畫面的影像來源。處理器依據影像來源控制切換所述多個通道的其中之一以作為啟用通道。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device and an operating method for the display device and an electronic device are provided. The display device includes a display panel, a channel selection circuit, and a processor. The channel selection circuit transmits communication data through one of channels. The processor receives an image data and controls the display panel to display an image according to the image data. The processor determines an image source of the image according to a link command. The processor switches one of the channels to be an active channel according to the image source.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示裝置</p>
        <p type="p">110:顯示面板</p>
        <p type="p">120:集線器電路</p>
        <p type="p">130:通道選擇電路</p>
        <p type="p">140:處理器</p>
        <p type="p">CH1、CH2:通道</p>
        <p type="p">CMD1:連結命令</p>
        <p type="p">DT1:溝通資料</p>
        <p type="p">ED1:電子裝置</p>
        <p type="p">IMG:影像資料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="696" publication-number="202625541">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625541</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148768</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>散熱裝置</chinese-title>
        <english-title>HEAT DISSIPATION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250124B">H05K7/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳桂芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUEI-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　錫園</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHYI-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳桂芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUEI-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　錫園</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHYI-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種散熱裝置，用於移除一發熱元件產生的熱。散熱裝置包括第一散熱板，其包括板體、多個第一散熱脊條及多個第一沖槽。板體包括相對設置的第一表面及第二表面。多個第一散熱脊條相互間隔排列並突起於第一表面，且每一第一散熱脊條包括至少二個第一坡部及一連接於二個第一坡部之間的第一峰頂部，且第一峰頂部包括一平坦面。多個第一沖槽分別位在多個第一散熱脊條的正下方，並貫穿該第一表面及該第二表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A heat dissipation device used to remove heat generated by a heating element. The heat dissipation device includes a first heat dissipation plate including a plate body, a plurality of first heat dissipation ridges and first punching grooves. The plate body includes a first surface and a second surface arranged oppositely. The heat dissipation ridges are spaced apart from each other and protrude from the first surface, and each first heat dissipation ridge includes at least two first slopes and a first peak connected between the two first slopes. The first peak includes a flat surface. The first punching grooves are located directly below the first heat dissipation ridges, respectively, and penetrate the first surface and the second surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:散熱裝置</p>
        <p type="p">10:第一散熱板</p>
        <p type="p">100:板體</p>
        <p type="p">101:第一表面</p>
        <p type="p">102:第二表面</p>
        <p type="p">11:第一散熱脊條</p>
        <p type="p">111:第一峰頂部</p>
        <p type="p">111a:平坦面</p>
        <p type="p">111b:固定面</p>
        <p type="p">112:連接端</p>
        <p type="p">113:第一坡部</p>
        <p type="p">13:凹凸齒部</p>
        <p type="p">14:鰭片</p>
        <p type="p">30:熱導板</p>
        <p type="p">301:上表面</p>
        <p type="p">302:下表面</p>
        <p type="p">31:腔室</p>
        <p type="p">32:流道結構</p>
        <p type="p">7:發熱元件</p>
        <p type="p">T1、T2:厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="697" publication-number="202623830">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623830</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148772</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>胜肽共軛奈米金粒子增強抗癌藥物傳遞</chinese-title>
        <english-title>PEPTIDE-CONJUGATED GOLD NANOPARTICLES FOR ENHANCED ANTICANCER DRUG DELIVERY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250605B">A61K38/17</main-classification>
        <further-classification edition="201701120250605B">A61K47/69</further-classification>
        <further-classification edition="201901120250605B">A61K33/242</further-classification>
        <further-classification edition="200601120250605B">A61K31/513</further-classification>
        <further-classification edition="200601120250605B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛教慈濟醫療財團法人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUDDHIST TZU CHI MEDICAL FOUNDATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>花蓮縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慈濟學校財團法人慈濟大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TZU CHI UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>花蓮縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張淳淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHUN-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊勤皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉哲文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIOU, JE-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許豪仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HAO-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁啟達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容關於衍生自人類介白素-10（IL-10）或其結合區域的胜肽，其抑制IL-10的免疫抑制作用。這些胜肽，包括NK20a，係設計用於阻斷IL-10與其受體IL-10Ra之間的相互作用，以提供抗癌治療的潛力。本發明亦包括胜肽-奈米粒子共軛物，例如與金奈米粒子的共軛物，其用於靶向傳遞化療劑如5-氟尿嘧啶（5-FU），從而增強對癌症如淋巴瘤和乳癌的療效。此外，該些胜肽可用於癌症免疫治療和免疫調節。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure relates to peptides derived from human interleukin-10 (IL-10) or its binding region that inhibit IL-10’s immunosuppressive effects. These peptides, including NK20a, are designed to block the interaction between IL-10 and its receptor IL-10Ra, providing potential for anticancer therapies. This disclosure also includes peptide-nanoparticle conjugates, such as those with gold nanoparticles, for targeted delivery of chemotherapeutic agents like 5-fluorouracil (5-FU), enhancing efficacy against cancers such as lymphoma and breast cancer. Additionally, the peptides can be utilized in cancer immunotherapy and immune modulation.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="698" publication-number="202624483">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624483</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148781</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>提升間質幹細胞免疫調節因子表現的方法及其於間質幹細胞培養的應用</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120250102B">C12N5/0775</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人醫藥工業技術發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDICAL AND PHARMACEUTICAL INDUSTRY TECHNOLOGY AND DEVELOPMENT CENTER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江秉倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, PING-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高健育</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, CHIEN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭俋志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, YI-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝崇斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHUNG-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳翠華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種提升間質幹細胞之免疫調節因子表現的方法，其係包含將間質幹細胞與一含有干擾素-γ及布地奈德的組成物接觸，其中該免疫調節因子係以下之至少一者：腫瘤壞死因子受體1、腫瘤壞死因子刺激基因6、及前列腺素E2。亦提供一種培養高表現免疫調節因子之間質幹細胞的方法及由此方法獲得的細胞，其中該方法係包含以下步驟：(1)於一第一培養液中培養間質幹細胞；(2)使步驟(1)所提供之間質幹細胞與干擾素-γ及布地奈德接觸歷時18至36小時；以及，(3)使用細胞脫附酵素收取步驟(2)之細胞。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="699" publication-number="202624057">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624057</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148783</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>行車警示系統及方法與電腦程式產品</chinese-title>
        <english-title>SYSTEM AND METHOD FOR DRIVING WARNING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250217B">B60W50/14</main-classification>
        <further-classification edition="200601120250217B">G08G1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>明泰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALPHA NETWORKS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴瑞言</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI, RUEI-YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊淇閎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHI-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林柏辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PO-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊宸䛥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, CHEN-HSI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜智維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李亦弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YI-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡博智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, PO-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種由行車警示系統實施的行車警示方法包含：(A)在獲得一速度值及一間隔距離值的情況下執行一風險評估程序，其中，該速度值相關於一車輛的速度，該間隔距離值相關於該車輛與周圍物體之間的距離，該行車警示系統執行該風險評估程序的方式包含：利用一風險判定規則資料根據該速度值及該間隔距離值產生一風險評估結果；(B)在該風險評估結果所指示出的一碰撞風險程度屬於一須警示風險程度的情況下，輸出一音頻在一預設頻率範圍之內變化的驅趕警示音。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A driving alarm method implemented by a driving alarm system includes: (A) performing a risk evaluation procedure upon obtaining a speed value and a separation distance value, where the speed value is related to a speed of a vehicle, the separation distance value is related to a distance between the vehicle and surrounding objects, the way of the driving alarm system performing the risk evaluation procedure comprises: using a risk determination rule data to generate a risk evaluation result based on the speed value and the separation distance value; (B) upon a collision risk degree indicated by the risk evaluation result belongs to a required warning risk degree, outputting an alert sound that audio varies within a preset frequency range.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S8:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="700" publication-number="202625750">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625750</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148785</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水平式真空加熱製程傳輸機構及其操作方法</chinese-title>
        <english-title>HORIZONTAL VACUUM HEATING PROCESS CONVEYING MECHANISM AND OPERATING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/30</main-classification>
        <further-classification edition="202601120260302B">H10P95/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞礱科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAYNEXT SEMICONDUCTOR CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何焱騰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, YEN-TENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許摶扶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳家興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳乃榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡鴻源</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>桃園市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種水平式真空加熱製程傳輸機構包括旋轉腔體室、製程腔體室與待冷卻裝置。旋轉腔體室的旋轉載台接收晶舟或載盤並進行旋轉，使得晶舟的長邊由平行於第一方向旋轉為平行於第二方向。製程腔體室接收長邊平行於第二方向的晶舟，並對晶舟中的晶圓片進行真空加熱製程。在完成真空加熱製程後，旋轉腔體室接收晶舟並進行旋轉，以將晶舟的長邊由平行於第二方向旋轉回平行於第一方向。待冷卻裝置的待冷卻載台接收完成真空加熱製程的晶舟。當第一晶舟在待冷卻載台未破真空以進行冷卻降溫時，同時製程腔體室接收第二晶舟並進行真空加熱製程。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:水平式真空加熱製程傳輸機構</p>
        <p type="p">110:旋轉腔體室</p>
        <p type="p">111:輸入閘板閥</p>
        <p type="p">112:旋轉載台</p>
        <p type="p">113:輸出閘板閥</p>
        <p type="p">115:製程閘板閥</p>
        <p type="p">117:輸送閘板閥</p>
        <p type="p">120:製程腔體室</p>
        <p type="p">130:待冷卻裝置</p>
        <p type="p">132:待冷卻載台</p>
        <p type="p">134:輸出抓取件</p>
        <p type="p">136:晶舟出口</p>
        <p type="p">140:橫向輸送裝置</p>
        <p type="p">142:橫向抓取件</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="701" publication-number="202624589">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624589</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148786</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>改善抗靜電織物透氣度的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250901B">D06M11/38</main-classification>
        <further-classification edition="200601120250901B">D06L1/14</further-classification>
        <further-classification edition="202101120250901B">D03D15/20</further-classification>
        <further-classification edition="202101120250901B">D03D15/283</further-classification>
        <further-classification edition="202101120250901B">D03D15/533</further-classification>
        <further-classification edition="200601120250901B">A41D13/008</further-classification>
        <further-classification edition="201901120250901B">A41D31/26</further-classification>
        <further-classification edition="200601320250901B">D06M101/00</further-classification>
        <further-classification edition="200601320250901B">D06M101/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弘裕企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONMYUE ENTERPRISE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉博宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭彥宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖鉦達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種改善抗靜電織物透氣度的製造方法，包含下列步驟：將初始抗靜電織物經過上漿處理形成上漿抗靜電織物；接著，將上漿抗靜電織物浸泡於減量退漿液進行退漿，得到退漿抗靜電織物，且減量退漿液中的減量鹼溶液能對上漿抗靜電織物中聚酯紗線的部分表面進行溶解；將退漿抗靜電織物進行清洗並置於烘乾環境下進行烘乾與定型，最終獲得透氣抗靜電織物；相對於初始抗靜電織物，透氣抗靜電織物中聚酯紗線之含量被減少10~20wt%，該製造方法獲得的透氣抗靜電織物可有效提升透氣效果，且還能在市場應用中進一步為使用者提供更加舒適的使用體驗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S3:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="702" publication-number="202623853">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623853</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148788</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>溫度啟動伸展的撒水器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250228B">A62C37/08</main-classification>
        <further-classification edition="200601120250228B">A62C37/09</further-classification>
        <further-classification edition="200601120250228B">A62C37/11</further-classification>
        <further-classification edition="200601120250228B">A62C37/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>內政部建築研究所</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE ARCHITECTURE AND BUILDING RESEARCH INSTITUTE, MOI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾基強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>雲林縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王榮進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾基強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳又嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖鉦達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種溫度啟動伸展的撒水器，包括上下二個或兩個以上部分套合的伸縮管，於各伸縮管連接一連結座，且於下方的伸縮管連接相對於各伸縮管傾斜的出水管，於二個連結座之間結合一限制器，該限制器係以二個拉桿連接一熱敏分離元件，該熱敏分離元件具有二個連結部，所述的二個連結部相互連結且具有一對應火場環境的設定溫度，兩者於超過該設定溫度時分離；本發明設置於地下停車場時係以上方的伸縮管連接於消防管線，若環境中的車輛發生火災使該熱敏分離元件的二個連結部分離，二個伸縮管會伸長並將出水管下降至可朝車輛的車窗內噴撒消防用水的位置，對電動車輛能達到較佳的滅火效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:溫度啟動伸展的撒水器</p>
        <p type="p">10:伸縮水管裝置</p>
        <p type="p">20:限制器</p>
        <p type="p">30:壓縮彈簧</p>
        <p type="p">40:水壓偵測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="703" publication-number="202625293">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625293</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148789</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>天線裝置</chinese-title>
        <english-title>ANTENNA DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">H01Q1/38</main-classification>
        <further-classification edition="200601120250303B">H01Q1/12</further-classification>
        <further-classification edition="200601120250303B">H01Q1/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張銘軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, MING XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, WEN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃文忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEN-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉昱寬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YE, YU-KUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃仲欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHUNG-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳政翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ZHENG-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱品翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, PIN-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種天線裝置，包括第一透明基板、多個天線單元以及散熱層。相鄰的該些天線單元之間具有透光區，且各天線單元包括第一天線電極、圖案化導線層以及晶片。圖案化導線層的圖案化導線耦合第一天線電極，且晶片接合圖案化導線。散熱層包括第二透明基板以及第一圖案化微結構層。第二透明基板以及第一圖案化微結構層之間形成適於容置液體的空腔。第一圖案化微結構層的至少一部分在第一透明基板的垂直投影重疊圖案化導線或第一天線電極在第一透明基板的垂直投影。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An antenna device including a first transparent substrate, a plurality of antenna units and a heat dissipation layer is provided. A transparent region is present between adjacent antenna units, and each antenna unit includes a first antenna electrode, a patterned wire layer and a chip. A patterned wire of the patterned wire layer is coupled to the first antenna electrode, and the chip is connected to the patterned wire. The heat dissipation layer includes a second transparent substrate and a first patterned micro structure layer. A cavity suitable for accommodating liquid is formed between the second transparent substrate and the first patterned micro structure layer. A vertical projection of at least a portion of the first patterned micro structure layer on the first transparent substrate overlaps a vertical projection of the patterned wire or the first antenna electrode on the first transparent substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:天線裝置</p>
        <p type="p">100:圖案化導線層</p>
        <p type="p">101:第一天線電極</p>
        <p type="p">102:第二天線電極</p>
        <p type="p">103:晶片</p>
        <p type="p">200:散熱層</p>
        <p type="p">201、301:主動區圖案化微結構層</p>
        <p type="p">401:支撐體</p>
        <p type="p">AU:天線單元</p>
        <p type="p">AA:主動區</p>
        <p type="p">CA:空腔</p>
        <p type="p">P1、P2、P3、P4:表面</p>
        <p type="p">S1:第一透明基板</p>
        <p type="p">S2:第二透明基板</p>
        <p type="p">TR:透光區</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="704" publication-number="202625231">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625231</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148790</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>按鈕</chinese-title>
        <english-title>BUTTON</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241230B">H01H13/83</main-classification>
        <further-classification edition="200601120241230B">H01H13/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達運精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DARWIN PRECISIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉志宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIH-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯雅涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, YA HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳煒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張軒維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JHANG, SYUAN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種按鈕，包括：基板、框體、蓋板、彈性導電件及感測開關。框體設置在基板上，框體於遠離基板的一側具有開口。蓋板可移動的設置於開口。彈性導電件設置於基板及蓋板之間並受到框體圍繞。感測開關電連接彈性導電件，並適於產生第一操控訊號。感測開關透過彈性導電件在蓋板遠離基板的一側形成感測區域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A compositing button includes a substrate, a frame, a cover plate, an elastic conductive member, a contact switch and a sensing switch. The frame is arranged on the substrate, and the frame has an opening on a side away from the substrate. The cover plate is movably arranged in the opening. The elastic conductive member is connected between the substrate and the cover plate and surrounded by the frame. The sensing switch is electrically connected to the elastic conductive member and is adapted for generating a first control signal. The sensing switch forms a sensing area on the side of the cover plate away from the substrate through the elastic conductive member.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:按鈕</p>
        <p type="p">2:基板</p>
        <p type="p">21:發光件</p>
        <p type="p">3:框體</p>
        <p type="p">31:開口</p>
        <p type="p">32:導軌</p>
        <p type="p">4:蓋板</p>
        <p type="p">41:按壓件</p>
        <p type="p">411:按壓部</p>
        <p type="p">412:外凸緣</p>
        <p type="p">413:固定塊</p>
        <p type="p">413a:爪</p>
        <p type="p">414:導引塊</p>
        <p type="p">42:光學成像組件</p>
        <p type="p">5:彈性導電件</p>
        <p type="p">6:接觸開關</p>
        <p type="p">7:感測開關</p>
        <p type="p">8:中框</p>
        <p type="p">81:本體</p>
        <p type="p">82:彈臂</p>
        <p type="p">D:厚度方向</p>
        <p type="p">A-A:剖線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="705" publication-number="202625107">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625107</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148793</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自動連續抓拍鴿眼影像之座標定位辨識系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120241231B">G06V40/19</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鼎端資訊科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂秉濂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龔千芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃汝淯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林奕儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳英本</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明自動連續抓拍鴿眼影像之座標定位辨識系統，包括：一具有影像輸入單元的攝影裝置，該攝影裝置可自動連續抓拍鴿眼影像，該攝影裝置的攝影鏡頭對應鴿眼數量可設置為二個。一具有影像接收裝置、虹膜建檔與辨識裝置、鴿子虹膜處理裝置及虹膜影像比對處理裝置的偵測端電腦；該影像接收裝置與該攝影裝置的影像輸入單元輸出端訊號連結，該虹膜建檔與辨識裝置包含：資料輸入單元、判斷建檔/辨識單元、虹膜影像比對單元、資料輸出單元及結果顯示單元；該鴿子虹膜處理裝置包含：鴿眼座標判斷單元、影像擷取單元、清晰度判斷單元、虹膜分析檔產出單元及影像與分析檔輸出單元；該虹膜影像比對處理裝置包含：虹膜影像接收單元、虹膜相似度判斷單元及判斷結果輸出單元。一具有資料接收裝置、資料儲存裝置及資料輸出裝置的主機。本發明可自動連續抓拍鴿眼影像，使鴿眼虹膜的建檔、辨識、判斷及比對得以準確進行，俾令經由鴿眼驗證身份的偵測結果快速產出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">A:自動連續抓拍鴿眼影像之座標定位辨識系統</p>
        <p type="p">1:攝影裝置</p>
        <p type="p">11:影像輸入單元</p>
        <p type="p">2:偵測端電腦</p>
        <p type="p">21:影像接收裝置</p>
        <p type="p">22:虹膜建檔與辨識裝置</p>
        <p type="p">221:資料輸入單元</p>
        <p type="p">222:判斷建檔/辨識單元</p>
        <p type="p">223:虹膜影像比對單元</p>
        <p type="p">224:資料輸出單元</p>
        <p type="p">225:結果顯示單元</p>
        <p type="p">23:鴿子虹膜處理裝置</p>
        <p type="p">231:鴿眼座標判斷單元</p>
        <p type="p">232:影像擷取單元</p>
        <p type="p">233:清晰度判斷單元</p>
        <p type="p">234:虹膜分析檔產出單元</p>
        <p type="p">235:影像與分析檔輸出單元</p>
        <p type="p">24:虹膜影像比對處理裝置</p>
        <p type="p">241:虹膜影像接收單元</p>
        <p type="p">242:虹膜相似度判斷單元</p>
        <p type="p">243:判斷結果輸出單元</p>
        <p type="p">3:主機</p>
        <p type="p">31:資料接收裝置</p>
        <p type="p">32:資料儲存裝置</p>
        <p type="p">33:資料輸出裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="706" publication-number="202624798">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624798</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148797</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250416B">G02B5/30</main-classification>
        <further-classification edition="202501120250416B">H10H29/855</further-classification>
        <further-classification edition="202301120250416B">H10K77/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇薪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YU-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置，包括發光元件、反射式偏光層、第一四分之一波片和圓偏振膜。反射式偏光層設置在發光元件上，第一四分之一波片設置在反射式偏光層背離發光元件的一側。第一四分之一波片設置在圓偏振膜和發光元件之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device includes a light emitting element, a reflective polarizing layer, a first quarter wave plate and a circular polarizing film. The reflective polarizing layer is disposed on the light emitting element, and the first quarter wave plate is disposed on a side of the reflective polarizing layer away from the light emitting element. The first quarter wave plate is disposed between the circular polarizing film and the light emitting element.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:顯示裝置</p>
        <p type="p">100:驅動基板</p>
        <p type="p">110:發光元件</p>
        <p type="p">111:第一電極</p>
        <p type="p">112:第二電極</p>
        <p type="p">120:反射式偏光層</p>
        <p type="p">110R,120R,130AR:面積</p>
        <p type="p">130A:第一四分之一波片</p>
        <p type="p">130B:第二四分之一波片</p>
        <p type="p">140:圓偏振膜</p>
        <p type="p">200:保護層</p>
        <p type="p">A:區域</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="707" publication-number="202624746">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624746</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148798</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用磁性雙性粒子檢測離體生物樣本的癌症生物標記的濃度之方法</chinese-title>
        <english-title>METHOD OF DETECTING CONCENTRATION OF CANCER BIOMARKER OF IN VITRO BIOLOGICAL SAMPLE WITH MAGNETIC JANUS PARTICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G01N33/53</main-classification>
        <further-classification edition="202601120260302B">G01N33/575</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立成功大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊漢聲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, HAN-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周育瑄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, YU-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施　德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAS, DHRUBAJYOTI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是有關於一種利用磁性雙性粒子檢測離體生物樣本的癌症生物標記的濃度之方法，其係使用磁性雙性粒子及多個驅動頻率的交變磁場獲得截頻率，並利用標準樣本的已知濃度及截頻率建立標準曲線，再根據標準曲線，由待測樣本之截頻率獲得測量濃度。此方法可縮短檢測時間，並降低樣本之體積及/或濃度的下限，從而增加檢測濃度之範圍。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates a method of detecting the concentration of cancer biomarker of an        &lt;i&gt;in vitro&lt;/i&gt;biological sample with magnetic Janus particle (MJP). In the method, the MJP and a magnetic field with a plurality of driving frequencies are used to obtain cutoff frequencies, and a standard curve is established by the known concentrations of the standard samples and the cutoff frequencies, thereby obtaining a measured concentration by the cutoff frequency of a testing sample according to the standard curve. With the method, the measuring time can be shortening, and the detecting lower limitation of volume and/or concentration of the sample can be decreased, thereby increasing a detecting concentration range.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">1600:直線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="708" publication-number="202625008">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625008</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148800</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>互動式資料蒐集系統及方法</chinese-title>
        <english-title>INTERACTIVE DATA-COLLECTION SYSTEM AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250303B">G06F40/10</main-classification>
        <further-classification edition="202001120250303B">G06F40/174</further-classification>
        <further-classification edition="202301120250303B">G06Q10/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>優式資本股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UC CAPITAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁嘉頎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENG, JIA-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪鼎杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明包含一種互動式資料蒐集系統及方法。該互動式資料蒐集系統針對一電子表單之複數資料欄位建立一對話腳本，且根據該對話腳本來與一使用者互動，藉此蒐集完成該電子表單所需要的使用者資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention involves an interactive data-collection system and an interactive data-collection method. The interactive data-collection system establishes a dialogue script for a plurality data fields in an electronic form, and interacts with a user according to the dialogue script to gather the user data required to complete the electronic form.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:互動式資料蒐集系統</p>
        <p type="p">11:輸入/輸出介面</p>
        <p type="p">13:儲存器</p>
        <p type="p">131:電子表單</p>
        <p type="p">15:處理器</p>
        <p type="p">U1:使用者</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="709" publication-number="202625613">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625613</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148801</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高速切換的屏蔽閘極溝槽式功率半導體裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250307B">H10D84/40</main-classification>
        <further-classification edition="202501120250307B">H10D12/00</further-classification>
        <further-classification edition="202501120250307B">H10D62/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>創圓科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIPWELL TECH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林靖璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHING-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種屏蔽閘極溝槽式功率半導體裝置，包括一半導體基材、一漂移層、一第一摻雜區、一第二摻雜區、多個閘極溝槽、多個閘極、多個屏蔽區域、一中間層以及多個拾取溝槽，該拾取溝槽包括一第一拾取溝槽、一第二拾取溝槽以及一第三拾取溝槽，該第一拾取溝槽供連接到一閘極部的一第一導電材料設置，該第二拾取溝槽供一連接到一屏蔽部的第二導電材料設置，該第三拾取溝槽供一第三導電材料設置，該第三拾取溝槽根據該功率半導體裝置所需的阻斷電壓而選擇性地設置於該閘極溝槽的一第一段部或一第二段部之一者上方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1b:閘極槽道區域</p>
        <p type="p">1c:主動區</p>
        <p type="p">1d:終端區域</p>
        <p type="p">14、14a、14b:閘極溝槽</p>
        <p type="p">17a:閘極金屬</p>
        <p type="p">17b:源極金屬</p>
        <p type="p">18a:第一拾取溝槽</p>
        <p type="p">18b:第二拾取溝槽</p>
        <p type="p">18c:第三拾取溝槽</p>
        <p type="p">18d:第四拾取溝槽</p>
        <p type="p">20a:第一水平假想線</p>
        <p type="p">20b:第二水平假想線</p>
        <p type="p">Y:第一橫方向</p>
        <p type="p">X:第二橫方向</p>
        <p type="p">D:距離</p>
        <p type="p">W:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="710" publication-number="202625067">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625067</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148804</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>財務管理系統及財務管理方法</chinese-title>
        <english-title>FINANCE MANAGEMENT SYSTEM AND FINANCE MANAGEMENT METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120250303B">G06Q40/06</main-classification>
        <further-classification edition="202301120250303B">G06Q40/00</further-classification>
        <further-classification edition="202301120250303B">G06Q30/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>合作金庫商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN COOPERATIVE BANK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾于瑄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, YU-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">財務管理系統包含前端介面、資料庫以及後端處理器。前端介面用以供輸入一商品圖片。資料庫包含複數年齡群體，年齡群體依序分別對應第1個至第N個年齡範圍，每一年齡群體的第1個至第M個消費類別中的各者包含消費百分比R1。圖片分析模組取得商品的商品消費類別。購買判定單元計算商品的金額相對使用者的資產總額的商品百分比R2，並計算加入商品百分比R2後的第m個消費類別的消費累積百分比R3；若滿足R2≥5%及R3≥R1中至少一者，購買判定單元判定不適合購買，若均未滿足，購買判定單元判定適合購買。藉此可有效管理財務。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a finance management system including a front-end interface, a database and a back-end processor. The front-end interface is for inputting a product image. The database includes a plurality of age groups. The age groups respectively correspond to a first to an Nth age ranges. A first to an Mth consuming types of each age group includes a consuming ratio R1. An image analyzing module obtains a product consuming type. A purchase judging unit calculates a product ratio R2 between a price of a produce and total assets of a user, and calculates a cumulative consumption ratio R3 of an mth consuming type containing the product ratio R2. If at least one of R2 ≥ 5 % and R3 ≥ R1 is satisfied, the purchase judging unit judges that it is not suitable to buy the product. If both are not satisfied, the purchase judging unit judges that it is suitable to buy the product. Therefore, the finance may be efficiently managed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:財務管理系統</p>
        <p type="p">110:前端介面</p>
        <p type="p">111:攝像鏡頭</p>
        <p type="p">112:前端處理器</p>
        <p type="p">113:顯示螢幕</p>
        <p type="p">120:後端處理器</p>
        <p type="p">121:圖片分析模組</p>
        <p type="p">122:金額詢問模組</p>
        <p type="p">123:建議模組</p>
        <p type="p">1231:購買判定單元</p>
        <p type="p">1232:資產重排單元</p>
        <p type="p">1233:投資估算單元</p>
        <p type="p">124:排名模組</p>
        <p type="p">125:投資模組</p>
        <p type="p">130:資料庫</p>
        <p type="p">131,132,133:年齡群體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="711" publication-number="202625114">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625114</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148805</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鈔票影像記錄與異常偵測系統</chinese-title>
        <english-title>BANKNOTE IMAGE RECORDING AND ANOMALY DETECTION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250418B">G07D11/20</main-classification>
        <further-classification edition="201601120250418B">G07D7/187</further-classification>
        <further-classification edition="201601120250418B">G07D7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>合作金庫商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN COOPERATIVE BANK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾于瑄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, YU-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種鈔票影像記錄與異常偵測系統，其攝影機用以對鈔票擷取影像。驗鈔機用以對鈔票進行檢驗而產生驗鈔結果，並分析影像而辨識出對應鈔票之鈔票序號，並記錄鈔票狀態。伺服處理器確認資料庫之留存序號是否有與鈔票序號相同而產生第一確認結果，並依據第一確認結果決定是否執行鈔票狀態之確認操作。當第一確認結果為是時，伺服處理器依據留存鈔票狀態執行鈔票狀態之確認操作而產生第二確認結果，並依據第二確認結果及驗鈔結果決定是否產生異常通知。藉此，可有效記錄鈔票序號，並對鈔票偵測真假，以避免客戶檢舉偽鈔事件之爭議。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A banknote image recording and anomaly detection system is proposed. The banknote image recording and anomaly detection system includes a camera, a banknote validator and a server. The camera is configured to capture an image of a banknote. The banknote validator is connected to the camera and receives the image. The banknote validator is configured to check the banknote to generate a banknote detection result, and analyze the image to identify a banknote serial number corresponding to the banknote, and record a banknote status corresponding to the banknote. The server is connected to the banknote validator and includes a database and a server processor. The database stores a plurality of stored serial numbers and a plurality of stored banknote status corresponding to the stored serial numbers. The server processor is connected to the database, and receives the stored serial numbers and the stored banknote status from the database, and the banknote detection result, the banknote serial number and the banknote status from the banknote validator. The server processor confirms whether one of the stored serial numbers is the same as the banknote serial number to generate a first confirmation result, and determines whether to perform a confirmation operation of the banknote status according to the first confirmation result. When the first confirmation result is yes, the banknote serial number is the same as the one of the stored serial numbers, and the server processor performs the confirmation operation of the banknote status according to the stored banknote status to generate a second confirmation result, and determines whether an anomaly notification is generated according to the second confirmation result and the banknote detection result. Therefore, the present disclosure can effectively record the banknote serial number and detect authenticity of the banknote to avoid a dispute with a customer when the customer reports the counterfeit banknote.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:鈔票影像記錄與異常偵測系統</p>
        <p type="p">200:攝影機</p>
        <p type="p">300:驗鈔機</p>
        <p type="p">310:記憶體</p>
        <p type="p">320:處理器</p>
        <p type="p">330:網路模組</p>
        <p type="p">400:伺服器</p>
        <p type="p">410:資料庫</p>
        <p type="p">420:伺服處理器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="712" publication-number="202624624">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624624</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148809</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無人機之壓電氣動冷卻系統</chinese-title>
        <english-title>PIEZOELECTRIC PNEUMATIC COOLING SYSTEM FOR DRONE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">F04D33/00</main-classification>
        <further-classification edition="202301120241231B">B64U20/96</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>研能科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICROJET TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫皓然</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOU, HAO-JAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃啟峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHI-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種無人機之壓電氣動冷卻系統，包含：至少一壓電氣泵，用於產生高效氣流；至少一冷卻通道，設置於無人機內部的高發熱區，而該壓電氣泵設置於該冷卻通道中，用於將產生高效氣流導向無人機內部的高發熱區；至少一溫度感測器，用於實時監測無人機內部溫度而輸出一溫度數據；一主控模組，用於收集該溫度感測器所輸出溫度數據，並根據該溫度數據之分析及運算，以調節控制該壓電氣泵之運行狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A piezoelectric pneumatic cooling system for drone is disclosed and includes at least one piezoelectric air pump, at least one cooling channel, at least one temperature sensor and a main control module. The at least one piezoelectric air pump is used for generating high efficiency air flow. The at least one cooling channel is disposed in a high-heat-generation area inside a drone, and the piezoelectric air pump is disposed in the cooling channel for generating the high efficiency air flow and directing the high efficiency air flow toward the high-heat-generation area. The temperature sensor is used for monitoring the temperature inside the drone in real-time and outputs temperature data. The main control module is used for collecting the temperature data outputted by the temperature sensor. Based on an analysis and a calculation of the temperature data, the main control module controls and adjusts the operating status of the piezoelectric pump.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:壓電氣泵</p>
        <p type="p">2:冷卻通道</p>
        <p type="p">21:排氣口</p>
        <p type="p">3:溫度感測器</p>
        <p type="p">4:主控模組</p>
        <p type="p">5:電池模組</p>
        <p type="p">6:電機模組</p>
        <p type="p">H:高發熱區</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="713" publication-number="202625116">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625116</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148810</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具監測警報功能之滅火器</chinese-title>
        <english-title>FIRE EXTINGUISHER WITH MONITORING AND ALARM FUNCTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250218B">G08B17/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林洹谷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HUAN-GU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林洹谷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HUAN-GU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林見軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種具監測警報功能之滅火器，其係包含一滅火器本體及一警報裝置。該滅火器本體內部能依需要填充不同種類的滅火材質，該警報裝置呈可拆卸方式設置於該滅火器本體之底部，且該警報裝置包括一底座及一感知晶片，該底座呈中空狀，並設置有至少一穿孔，該底座嵌設有至少一指示燈及一蜂鳴器，並貫穿設有一充電接口，而該底座設置有一電源開關，該感知晶片容置於該底座內，且該感知晶片上設置有一可充電之電池，該電池相對於該底座之充電接口，該指示燈、該蜂鳴器及該電源開關亦電性連接於該感知晶片。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is a fire extinguisher with monitoring and alarm functions, comprising a fire extinguisher body and an alarm device. The interior of the fire extinguisher body can be filled with different types of fire extinguishing materials as needed. The alarm device is installed in a detachable manner at the bottom of the fire extinguisher body, and includes a base and a sensing chip. The base is hollow and has at least one hole. The base is embedded with at least one indicator light and a buzzer, and a charging interface is provided through it. The base is equipped with a power switch, and the sensing chip is accommodated in the base. The sensing chip is equipped with a rechargeable battery, which is connected to the charging interface of the base. The indicator light, buzzer, and power switch are also electrically connected to the sensing chip.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:滅火器本體</p>
        <p type="p">11:LED燈板</p>
        <p type="p">20:警報裝置</p>
        <p type="p">21:底座</p>
        <p type="p">210:穿孔</p>
        <p type="p">211:指示燈</p>
        <p type="p">212:蜂鳴器</p>
        <p type="p">22:感知晶片</p>
        <p type="p">220:鋰電池</p>
        <p type="p">23:蓋座</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="714" publication-number="202624858">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624858</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148811</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241223B">G02F1/1335</main-classification>
        <further-classification edition="200601120241223B">G02B5/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張繼聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHI SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳嘉鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIA-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置，包括顯示面板以及背光模組。顯示面板具有一顯示區以及一周邊區。背光模組位於顯示面板下方，背光模組包括背板、光源模組、膠框以及擴散板。光源模組位於背板上，且包括電路板以及多個發光二極體，多個發光二極體配置於電路板。膠框配置於電路板且包括外壁，外壁環繞於多個發光二極體外圍。擴散板位於光源模組上且配置於外壁的頂端。外壁包括第一部分與第二部分，第一部分的透光度大於第二部分的透光度，第一部分至少重疊於顯示區。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device includes a display panel and a backlight module. The display panel has a display area and a peripheral area. The backlight module is located under the display panel. The backlight module includes a back bezel, a light source module, a plastic frame and a diffusion plate. The light source module is located on the back bezel and includes a circuit board and a plurality of light-emitting diodes. The plurality of light-emitting diodes are arranged on the circuit board. The plastic frame is disposed on the circuit board and includes an outer wall surrounding the plurality of light-emitting diodes. The diffusion plate is located on the light source module and is arranged on a top end of the outer wall. The outer wall includes a first part and a second part, a light transmittance of the first part is greater than a light transmittance of the second part, and the first part at least overlaps the display area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示裝置</p>
        <p type="p">110:顯示面板</p>
        <p type="p">111:第一側</p>
        <p type="p">112:第二側</p>
        <p type="p">113:第三側</p>
        <p type="p">120:背光模組</p>
        <p type="p">121:背板</p>
        <p type="p">122:光源模組</p>
        <p type="p">1221:電路板</p>
        <p type="p">1222:發光二極體</p>
        <p type="p">123:膠框</p>
        <p type="p">1231:外壁</p>
        <p type="p">124:擴散板</p>
        <p type="p">125:外框</p>
        <p type="p">A1:顯示區</p>
        <p type="p">B1:周邊區</p>
        <p type="p">F1:光學膜層組</p>
        <p type="p">P1:第一部分</p>
        <p type="p">P2:第二部分</p>
        <p type="p">T1:頂端</p>
        <p type="p">X、Y、Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="715" publication-number="202624492">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624492</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148813</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>醣奈米材料於DNA聚合酶之用途</chinese-title>
        <english-title>APPLICATION OF SACCHARIDE NANOMATERIAL IN DNA POLYMERASE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250102B">C12Q1/686</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣海洋大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN OCEAN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>基隆市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志清</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIH-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>毛儒毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAO, JU-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐鈺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李鎮宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHEN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王晨祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHEN-YOW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡嘉慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種醣奈米材料用於抑制DNA聚合酶的用途，該醣奈米材料係由醣類透過乾式加熱生成，其中該醣奈米材料包含類石墨烯奈米片及該醣類，其中該類石墨烯奈米片包含該醣類之至少一部分的碳化產物，且該類石墨烯奈米片與該醣類係複合而形成交聯的超分子結構，該醣奈米材料能應用於熱啟動聚合酶連鎖反應，提高反應的靈敏性及專一性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides the use of saccharide nanomaterial for inhibiting DNA polymerase activity. The saccharide nanomaterial is produced by dry heating of saccharides and comprises graphene-like nanosheets and the saccharide. The graphene-like nanosheets contain at least a portion of the carbonized product of the saccharide, and form a cross-linked supramolecular structure with the saccharide. The saccharide nanomaterial can be applied to hot-start polymerase chain reaction (PCR), improving the sensitivity and specificity of the reaction.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="716" publication-number="202623854">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623854</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148814</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>肌力訓練裝置及其訓練方法</chinese-title>
        <english-title>THE MUSCLE STRENGTH TRAINING APPARATUS AND TRAINING METHOD APPLYING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241231B">A63B21/00</main-classification>
        <further-classification edition="200601120241231B">A63B23/035</further-classification>
        <further-classification edition="200601120241231B">A63B21/055</further-classification>
        <further-classification edition="200601120241231B">A63B21/012</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英華達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC APPLIANCES CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳思正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, SZU-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種肌力訓練裝置，用於訓練操作者的至少一種肌肉，包括: 致動器、第一阻力器、第一拉繩以及阻力控制器。致動器用於與操作者接觸，從而使肌肉對其施加複數個機械力。第一阻力器提供複數個與機械力相反的複數個訓練阻力。第一拉繩連接第一阻力器與致動器，將複數個機械力傳遞至第一阻力器，使複數個機械力分別對抗複數個阻力。阻力控制器用於測定拉繩的複數個繩速，並根據複數個繩速，階段式地疊加或階段式地減低訓練阻力，使最大的機械力實質上等於最大的訓練阻力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A muscle strength training apparatus used to train at least one muscle of an operator, including: an actuator, a first resistance device, a first pulling rope and a resistance controller. The actuator is used to make contact with the operator so that the muscles exert a plurality of mechanical forces on it. The first resistance device provides a plurality of training resistances that oppose the mechanical forces. The first pull rope connects the first resistance device and the actuator for transmitting the mechanical forces to the first resistance device, allowing the mechanical forces to resist the training resistances respectively. The resistance controller is used to measure multiple rope speeds of the first pulling rope, and superimpose or reduce the training resistance in stages according to the multiple rope speeds, so that the maximum mechanical force is essentially equal to the maximum training resistance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:肌力訓練裝置</p>
        <p type="p">11:操作者</p>
        <p type="p">12:可攜式電子產品</p>
        <p type="p">100:致動器</p>
        <p type="p">101:三角拉環</p>
        <p type="p">102:踏板</p>
        <p type="p">110:第一阻力器</p>
        <p type="p">120:拉繩</p>
        <p type="p">130:阻力控制器</p>
        <p type="p">140:無線通訊裝置</p>
        <p type="p">FR:訓練阻力</p>
        <p type="p">FM:機械力</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="717" publication-number="202625055">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625055</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148815</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>分眾展示內容的終端設備、處理系統與處理方法</chinese-title>
        <english-title>TERMINAL DEVICE, PROCESSING SYSTEM, AND PROCESSING METHOD FOR DISPLAYING CONTENT TO SPECIFIC AUDIENCES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250303B">G06Q30/0241</main-classification>
        <further-classification edition="201101120250303B">H04N21/25</further-classification>
        <further-classification edition="201101120250303B">H04N21/81</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YAO-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林傳凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUAN-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林伯曄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PO-YA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種分眾展示內容的終端設備、處理系統與處理方法，包括感測設備、輸出設備與伺服器。感測設備獲取受眾資訊；輸出設備播放原始展示資訊或輸出結果；伺服器連接於感測設備與輸出設備，伺服器具有原始展示資訊與AI調整模型，原始展示資訊具有多個內容塊，伺服器根據受眾資訊驅動AI調整模型，AI調整模型根據受眾資訊選擇至少一內容塊，並調整受選的內容塊為已調整區塊，伺服器根據已調整區塊與其餘內容塊產生輸出結果，伺服器發送輸出結果至輸出設備。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A terminal device, processing system, and processing method for displaying content to specific audiences, comprises a sensor, an output device, and a server. The sensor obtains a viewer data; the output device displays an original display information or outputs an output result; the server is connected to the sensors and output device, and stores original display information and an AI adjustment model. The original display information comprises a multiple content segment. Based on the audience demographics, the server activates the AI adjustment model. The AI adjustment model selects at least one content segment based on the viewer data and adjusts the selected content segment as a modified content segment. The server generates output result based on the modified content segment and other content segments and sends the output result to the output device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S310,S320,S330,S340,S350,S360:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="718" publication-number="202624604">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624604</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148816</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氣密門</chinese-title>
        <english-title>AIRTIGHT DOOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250124B">E06B5/12</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白明德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAI, MING-DER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧俊青</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHUN-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種氣密門包含捲門組件以及複數氣密組件。捲門組件包含框架、門片以及馬達。門片滑設於框架。馬達設置於框架上方並連接門片，馬達驅動門片於框架中移動而升降。複數氣密組件設置於框架，複數氣密組件推動門片壓合框架，以達成氣密。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An airtight door includes a rolling door assembly and a plurality of airtight assemblies. The rolling door assembly includes a frame, a door panel, and a motor. The door panel is slidably disposed in the frame. The motor is disposed above the frame and connected to the door panel. The motor drives the door panel to move up and down in the frame. The plurality of airtight assemblies are disposed on the frame, and the plurality of airtight assemblies push the door panel to press against the frame to achieve an airtight seal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:氣密門</p>
        <p type="p">1:捲門組件</p>
        <p type="p">11:框架</p>
        <p type="p">12:門片</p>
        <p type="p">121:肋條</p>
        <p type="p">13:馬達</p>
        <p type="p">2:氣密組件</p>
        <p type="p">3:控制器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="719" publication-number="202624276">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624276</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148817</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗血管新生之新融合蛋白</chinese-title>
        <english-title>NEW FUSION PROTEIN AGAINST ANGIOGENESIS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250701B">C07K16/46</main-classification>
        <further-classification edition="200601120250701B">C07K16/18</further-classification>
        <further-classification edition="200601120250701B">A61K39/395</further-classification>
        <further-classification edition="200601120250701B">A61P27/00</further-classification>
        <further-classification edition="200601120250701B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三鈺生物科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRICAN BIOTECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王雅萱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YA-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIN-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李政格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHENG-KE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱詩涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, SHIH-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高溥鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, PU-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈三泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, SAN-TAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭志玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種新穎雙功能融合蛋白TC1545，同時靶向血管內皮生長因子（vascular endothelial growth factor，VEGF）與血管生成素（angiopoietins，ANGs），並具有更高的單體純度。該雙功能融合蛋白含有兩個以上的人類蛋白質結構域，且全為人類序列，可用於針對人類血管生成相關疾病的治療。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a new bi-functional fusion protein TC1545, simultaneously targeting vascular endothelial growth factor (VEGF) and angiopoietins (ANGs) with a higher monomer purity. The bi-functional fusion protein contains two or more domains of human proteins and are of all human sequences, which can be used therapeutically in human targeting angiogenesis-associated diseases.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="720" publication-number="202625588">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625588</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148818</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>控制電路、薄膜電晶體及其製造方法</chinese-title>
        <english-title>CONTROL CIRCUIT, THIN FILM TRANSISTOR AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10D30/67</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JIAN-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳衍豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇婉菁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, WAN-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江丞偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, CHENG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜佳豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DU, JIA-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何毅達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, YI-DA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種薄膜電晶體包括緩衝層、半導體層、閘極介電層、第一閘極、源極及汲極。緩衝層設置於基板上。緩衝層的上表面具有第一面、第二面、第三面、第四面及第五面。第一面、第二面、第三面、第四面及第五面依續地連接而形成凹陷。半導體層設置於凹陷中。閘極介電層設置於基板、半導體層及緩衝層上。第一閘極設置於閘極介電層上且對應半導體層。源極及汲極設置於基板上且連接於半導體層。此外，上述薄膜電晶體的製造方法及包括上述薄膜電晶體的控制電路也被提出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A thin film transistor includes a buffer layer, a semiconductor layer, a gate dielectric layer, a first gate electrode, a source and a drain. The buffer layer is disposed on the substrate. An upper surface of the buffer layer has a first surface, a second surface, a third surface, a fourth surface and a fifth surface. The first surface, the second surface, the third surface, the fourth surface and the fifth surface are sequentially connected to form a recess. The semiconductor layer is disposed in the recess. The gate dielectric layer is disposed on the substrate, the semiconductor layer and the buffer layer. The first gate is disposed on the gate dielectric layer and corresponds to the semiconductor layer. The source and the drain are disposed on the substrate and connected to the semiconductor layer. In addition, a manufacturing method of the thin film transistor and a control circuit including the thin film transistor are also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:薄膜電晶體</p>
        <p type="p">110:基板</p>
        <p type="p">122:緩衝層</p>
        <p type="p">122s1:第一面</p>
        <p type="p">122s2:第二面</p>
        <p type="p">122s3:第三面</p>
        <p type="p">122s4:第四面</p>
        <p type="p">122s5:第五面</p>
        <p type="p">132:半導體層</p>
        <p type="p">132a:頂面</p>
        <p type="p">132b:底面</p>
        <p type="p">140:閘極介電層</p>
        <p type="p">150:第一閘極</p>
        <p type="p">160:層間介電層</p>
        <p type="p">162、164:開口</p>
        <p type="p">172:源極</p>
        <p type="p">174:汲極</p>
        <p type="p">D:深度</p>
        <p type="p">T:厚度</p>
        <p type="p">U1:凹陷</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="721" publication-number="202624992">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624992</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148822</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>線上防偽印鑑系統</chinese-title>
        <english-title>ONLINE ANTI-COUNTERFEITING STAMP SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120250303B">G06F21/32</main-classification>
        <further-classification edition="201301120250303B">G06F21/31</further-classification>
        <further-classification edition="202301120250303B">G06Q40/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>合作金庫商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN COOPERATIVE BANK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾于瑄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, YU-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種線上防偽印鑑系統，其資料庫儲存使用者資訊、演算法及真印鑑特徵資訊。處理器接收來自資料庫之使用者資訊、演算法、真印鑑特徵資訊及來自用戶端裝置之生物特徵資訊與印鑑影像資訊。處理器經配置以實施包含：比對生物特徵資訊與使用者資訊是否相同而產生安全驗證結果，以驗證用戶端身份；依據演算法處理印鑑影像資訊而產生印鑑特徵資訊；及比對印鑑特徵資訊與真印鑑特徵資訊是否相同而產生印鑑比對結果，以辨別真偽印鑑。藉此，能將網銀應用程式生態與智慧型印鑑特徵辨識技術整合，實現線上業務之高效、安全及便利。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An online anti-counterfeiting stamp system is proposed. The online anti-counterfeiting stamp system includes a database and a processor. The database stores a user information, an algorithm and a real stamp feature information. The processor is signally connected to the database, and receives the user information, the algorithm and the real stamp feature information from the database and a biological feature information and a stamp image information from a user device. The processor is configured to perform operations including comparing whether the biological feature information is the same as the user information to generate a security verification result so as to verify a user identity; processing the stamp image information according to the algorithm to generate a stamp feature information; and comparing whether the stamp feature information is the same as the real stamp feature information to generate a stamp comparison result so as to identify the authenticity of a stamp. Therefore, the present disclosure can integrate the online banking application ecosystem and the intelligent stamp feature identification technology to achieve efficient, safe and convenient online business.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:線上防偽印鑑系統</p>
        <p type="p">200:資料庫</p>
        <p type="p">210:使用者資訊</p>
        <p type="p">220:演算法</p>
        <p type="p">230:真印鑑特徵資訊</p>
        <p type="p">240:明碼</p>
        <p type="p">300:處理器</p>
        <p type="p">310:安全驗證操作</p>
        <p type="p">312:安全驗證結果</p>
        <p type="p">320:影像處理操作</p>
        <p type="p">322:印鑑特徵資訊</p>
        <p type="p">330:印鑑比對操作</p>
        <p type="p">332:印鑑比對結果</p>
        <p type="p">FM1:生物特徵資訊</p>
        <p type="p">FM2:印鑑影像資訊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="722" publication-number="202625037">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625037</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148823</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>料盤倉儲系統及料盤提供系統</chinese-title>
        <english-title>TRAY STORAGE SYSTEM AND TRAY SUPPLY SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120251105B">G06Q10/08</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>技高工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASCENTEX INDUSTRY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佑宣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YOU-XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鐘詩維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, SHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李冠勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KUAN-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>路志廣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHIH-KUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭志弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種料盤倉儲系統及料盤提供系統，其中，該料盤倉儲系統可以自動化方式實現料盤在倉儲模組上的存取操作，以簡化在電子產品產線上管理料盤的程序；以及該料盤提供系統係可剔除厚度不符合預期的料盤，以避免狀態不佳的料盤進入該料盤倉儲系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A tray storage system and tray supply system, wherein the tray storage system enables automated access operations of trays on the storage module, simplifying tray management procedures on the electronic product production line. Additionally, the tray supply system can remove trays with thicknesses that do not meet specified standards, preventing trays in suboptimal condition from entering the tray storage system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:第一倉儲模組</p>
        <p type="p">111:第一倉儲料盤架</p>
        <p type="p">112:第一倉儲料盤拖曳設備</p>
        <p type="p">12:第二倉儲模組</p>
        <p type="p">121:第二倉儲料盤架</p>
        <p type="p">122:第二倉儲料盤拖曳設備</p>
        <p type="p">2:料盤提供系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="723" publication-number="202624094">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624094</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148824</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>料盤提供系統及料盤倉儲系統</chinese-title>
        <english-title>TRAY SUPPLY SYSTEM AND TRAY STORAGE SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250317B">B65G1/04</main-classification>
        <further-classification edition="200601120250317B">B65G43/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>技高工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASCENTEX INDUSTRY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佑宣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YOU-XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鐘詩維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, SHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李冠勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KUAN-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>路志廣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHIH-KUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭志弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種料盤提供系統及料盤倉儲系統，其中，該料盤提供系統係可剔除厚度不符合預期的料盤，以避免狀態不佳的料盤進入該料盤倉儲系統；以及該料盤倉儲系統可以自動化方式實現料盤在倉儲模組上的存取操作，以簡化在電子產品產線上管理料盤的程序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A tray supply system and tray storage system, wherein the tray supply system is capable of removing trays with thicknesses that do not meet specified standards, preventing substandard trays from entering the tray storage system. Additionally, the tray storage system enables automated access operations of trays on the storage module, streamlining tray management procedures on electronic product production lines.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:第一倉儲模組</p>
        <p type="p">111:第一倉儲料盤架</p>
        <p type="p">112:第一倉儲料盤拖曳設備</p>
        <p type="p">12:第二倉儲模組</p>
        <p type="p">121:第二倉儲料盤架</p>
        <p type="p">122:第二倉儲料盤拖曳設備</p>
        <p type="p">2:料盤提供系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="724" publication-number="202623827">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623827</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148826</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>益生菌用於治療過敏性疾病之用途</chinese-title>
        <english-title>USE OF PROBIOTICS ON PREVENTING AND TREATING ALLERGY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120250102B">A61K35/741</main-classification>
        <further-classification edition="200601120250102B">A61P37/08</further-classification>
        <further-classification edition="200601120250102B">A61P17/00</further-classification>
        <further-classification edition="200601120250102B">A61P11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王怡人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, I-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王怡人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, I-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李斌宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種益生菌用於治療過敏性疾病之用途，其包含氣喘、異位性皮膚炎、過敏性鼻炎及過敏進行曲等。本發明之益生菌甚至能有效的阻斷過敏進行曲的發展，讓患者後續的過敏性疾病或過敏反應不再惡化或發生，以避免持續的各種過敏性疾病症對生活帶來的困擾、不適與生活壓力，有效的提升患者的生活品質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a use of a probiotic on treating allergies, including asthma, atopic dermatitis, allergic rhinitis, and others. The probiotic of present invention is even capable of effectively interrupting the progression of Atopic March, preventing subsequent allergic conditions or responses from worsening or occurring. This can help to avoid the ongoing discomfort, inconvenience, and stress caused by persistent allergic conditions, thereby significantly improving the patient's quality of life.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="725" publication-number="202624673">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624673</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148827</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>縮短烤箱升溫時間的節能方法與系統</chinese-title>
        <english-title>ENERGY-SAVING METHODS AND SYSTEM TO SHORTEN OVEN HEATING TIME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250325B">F27D7/02</main-classification>
        <further-classification edition="200601120250325B">F26B3/06</further-classification>
        <further-classification edition="200601120250325B">A47J37/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>偉勝乾燥工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEISUN INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭慧群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, HUI CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王文雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WEN-HSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李斌宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種縮短烤箱升溫時間的節能方法與系統包含烤箱本體、烘烤室、加熱室；當加熱室內氣體加熱到一烘烤溫度時由一送風裝置抽取並以一熱風形式輸送；當閥門裝置切換到一烘烤模式時，該熱風經該閥門裝置輸送到該烘烤室再返回到該加熱室內；當閥門裝置切換到一節能模式時，該閥門裝置將該熱風導向到一熱風循環流道不經過烘烤室再返回到該加熱室內；該節能模式時該加熱裝置維持該加熱室內之氣體溫度在一保溫溫度，更換待烘烤物件時再次切換到該烘烤模式，該閥門裝置將該熱風輸送到該烘烤室內，使該烘烤室內溫度快速達到該烘烤溫度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An energy-saving methods and system to shorten oven heating time comprises an oven body, a baking chamber, and a heating chamber. When the gas in the heating chamber is heated to a baking temperature, it is drawn by an air supply device and delivered in the form of hot air. When the valve device is switched to a baking mode, the hot air is conveyed through the valve device to the baking chamber and then returned to the heating chamber. When the valve device is switched to an energy-saving mode, the valve device directs the hot air into a hot air circulation channel, bypassing the baking chamber and returning to the heating chamber. In the energy-saving mode, the heating device maintains the temperature of the gas in the heating chamber at a holding temperature. When the object to be baked is replaced, the valve device is switched back to the baking mode, and the hot air is directed to the baking chamber, allowing the temperature in the baking chamber to quickly reach the baking temperature.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:烘烤室</p>
        <p type="p">11:門體</p>
        <p type="p">20:加熱室</p>
        <p type="p">21:加熱裝置</p>
        <p type="p">30:送風裝置</p>
        <p type="p">40:流道</p>
        <p type="p">41:熱風循環流道</p>
        <p type="p">50:閥門裝置</p>
        <p type="p">100:烤箱本體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="726" publication-number="202624903">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624903</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148918</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可穿戴電力供應裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120241227B">G04G19/10</main-classification>
        <further-classification edition="200601120241227B">G04G17/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王烱中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王俐媛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LI-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王烱中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王俐媛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LI-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可穿戴電力供應裝置，包含一夾具，其具有處於對立面的一上夾部和一下夾部，及一將上夾部和下夾部的同一側相互連接的側夾部，其中上夾部包含一承載部，用以承載一個或一個以上的電池，下夾部設有一與電池電連接的感應線圈。當可穿戴電力供應裝置透過夾具安裝於穿戴式電子裝置時，感應線圈將電力從電池感應傳輸到穿戴式電子裝置，逕向配戴中的穿戴式電子裝置提供電力，補充後者消耗的電能。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:可穿戴電力供應裝置</p>
        <p type="p">20:夾具</p>
        <p type="p">21:上夾部</p>
        <p type="p">22:下夾部</p>
        <p type="p">23:側夾部</p>
        <p type="p">24:承載部</p>
        <p type="p">25:電池</p>
        <p type="p">26:感應線圈</p>
        <p type="p">27:導線</p>
        <p type="p">28:控制電路</p>
        <p type="p">29:樞軸</p>
        <p type="p">30:窗孔</p>
        <p type="p">31:連接埠</p>
        <p type="p">32:導線</p>
        <p type="p">40:穿戴式電子裝置</p>
        <p type="p">42:操控鈕</p>
        <p type="p">43:感測器視窗</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="727" publication-number="202623731">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623731</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148928</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>滑軌總成及其滑軌機構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120250218B">A47B88/407</main-classification>
        <further-classification edition="201701120250218B">A47B88/423</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南俊國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAN JUEN INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張富田</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, FU-TIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊豐銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, FENG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連志益</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIEN, CHIH-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種滑軌總成及其滑軌機構，包含：一軌件，該軌件具有一抵持部；一第一軌，該第一軌活動連接該軌件；一第二軌，該第二軌活動連接該第一軌；以及一操作件，該操作件位於該軌件與該第一軌之間，並具有一彈片，該彈片具有一第一部分相對於該抵持部，當該軌件、該第一軌及該第二軌進行展開後，則以便於操作該操作件，而連動該彈片之該第一部分卡掣於該抵持部，使該操作件保持不動，配合該滑軌總成相對於該滑軌裝置進行活動位移。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">22:軌件</p>
        <p type="p">221:第一解鎖特徵</p>
        <p type="p">222:導引片</p>
        <p type="p">223:抵持部</p>
        <p type="p">224:開孔</p>
        <p type="p">225:第二解除特徵</p>
        <p type="p">226:第一解除特徵</p>
        <p type="p">60:操作件</p>
        <p type="p">61:彈片</p>
        <p type="p">611:第一部分</p>
        <p type="p">612:第二部分</p>
        <p type="p">62:第一推動部</p>
        <p type="p">63:第二推動部</p>
        <p type="p">70:第一擋件</p>
        <p type="p">71:第一擋件之延伸端</p>
        <p type="p">72:第一擋件之前端</p>
        <p type="p">73:第一擋件之尾端</p>
        <p type="p">80:第二擋件</p>
        <p type="p">81:第二擋件之延伸端</p>
        <p type="p">82:第二擋件之前端</p>
        <p type="p">83:第二擋件之尾端</p>
        <p type="p">E:掣孔</p>
        <p type="p">E1:抵靠面</p>
        <p type="p">F1:頭部特徵</p>
        <p type="p">F2:翼形特徵</p>
        <p type="p">H:啟動面</p>
        <p type="p">I:凹部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="728" publication-number="202623995">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623995</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113149167</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>殼體結構的製作方法</chinese-title>
        <english-title>MANUFACTURING METHOD OF HOUSING STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250306B">B29C71/00</main-classification>
        <further-classification edition="202501120250306B">H05K5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李柏毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, PO-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孟傳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MENG-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種殼體結構的製作方法，包括以下步驟。首先，提供殼體基材。接著，於殼體基材形成穿孔。接著，於殼體基材塗布鹼性蠟，並填滿穿孔。接著，對殼體基材進行表面處理。接著，對殼體基材進行酸洗，以移除鹼性蠟。然後，對殼體基材進行陽極處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method of a housing structure including the following steps is provided. Firstly, a housing substrate is provided. Next, a perforation is formed in the housing substrate. Then, an alkaline wax is applied to the housing substrate to fill the perforation. After that, surface treatment is performed on the housing substrate. The housing substrate is then subjected to acid pickling to remove the alkaline wax. Finally, anodizing treatment is applied to the housing substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:殼體結構</p>
        <p type="p">100:殼體基材</p>
        <p type="p">101:第一表面</p>
        <p type="p">102:第二表面</p>
        <p type="p">103:穿孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="729" publication-number="202624779">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624779</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113149597</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池電量之估算方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250401B">G01R31/382</main-classification>
        <further-classification edition="201901120250401B">G01R31/385</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商明緯（廣州）電子有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEAN WELL (GUANGZHOU) ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>明緯企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEAN WELL ENTERPRISES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃雋介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鐘聖凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡敏強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種電池電量之估算方法，其先以庫倫積分法計算在充電過程中的電池之荷電狀態，直到電池進入浮充模式為止，並根據荷電狀態及其對應之充電電壓與充電電流建立一充電電壓表與一充電電流表。在靜置電池後，量測電池之第一當前靜置開路電壓。根據電池之當前荷電狀態從充電電壓表找出對應之查表充電電壓，並根據當前荷電狀態從充電電流表找出對應之查表充電電流，且紀錄查表充電電壓與第一當前靜置開路電壓之電壓差及查表充電電流。最後，根據當前荷電狀態、第一當前靜置開路電壓、電壓差及查表充電電流決定電池之第一靜置荷電狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S10、S12、S14、S16、S18、S20、S22、S24、S26:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="730" publication-number="202624755">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624755</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113149708</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電氣特性檢查用探針接腳、探針卡及其製造方法</chinese-title>
        <english-title>PROBE PIN FOR ELECTRICAL CHARACTERISTIC INSPECTION, PROBE CARD AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">G01R1/067</main-classification>
        <further-classification edition="200601120250401B">G01R1/073</further-classification>
        <further-classification edition="200601120250401B">G01R3/00</further-classification>
        <further-classification edition="202001120250401B">G01R31/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＳＷＣＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SWCC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大達剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ODACHI, GO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小泉勉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOIZUMI, TSUTOMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新井龍一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAI, RYUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">電氣特性檢查用探針接腳（10）是包括接腳主體（12）的電氣特性檢查用探針接腳（10），所述接腳主體（12）含有6.0~30.0質量%的銀，剩餘部分由銅和不可避免的雜質的銅合金構成。通過雷射加工從銅合金的箔（11）切割接腳主體（12）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A probe pin (10) for electrical characteristics inspection includes a pin body (12) composed of a copper alloy containing 6.0 to 30.0 mass% silver, the remainder being copper and unavoidable impurities. The pin body (12) is laser cut from a copper alloy foil (11).</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="731" publication-number="202625483">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625483</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113150859</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無線通訊裝置的控制方法、無線通訊裝置及電子設備</chinese-title>
        <english-title>CONTROL METHOD OF WIRELESS COMMUNICATION DEVICE, WIRELESS COMMUNICATION DEVICE, AND ELECTRONIC EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120250602B">H04W52/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁永壯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DING, YONG-ZHUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開了一種無線通訊裝置的控制方法、無線通訊裝置及電子設備，根據預設週期獲取無線通訊裝置的通訊資訊，根據通訊資訊確認無線通訊裝置是否滿足預先設置的第一省電條件和第二省電條件。當滿足第一省電條件時，控制無線通訊裝置進入省電模式，以降低無線通訊裝置的功耗。而當滿足第二省電條件時，則將無線通訊裝置的當前通道切換為傳輸速率更大的目標通道，能夠降低通訊的功耗。基於此，能夠實現無線通訊裝置根據通訊資訊進行自我調整省電，降低無線通訊裝置的功耗，延長無線通訊裝置的電池使用時間，提高用戶體驗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides a control method of wireless communication device, a wireless communication device, and an electronic equipment, including obtaining communication information of the wireless communication device according to a preset period, confirming whether the wireless communication device meets a preset first power saving condition and a preset second power saving condition according to the communication information. When the first power saving condition is met, the wireless communication device is controlled to enter a power saving mode to reduce power consumption of the wireless communication device. When the second power saving condition is met, a current channel of the wireless communication device is switched to a target channel with a higher transmission rate, which can reduce communication power consumption. Based on this, the wireless communication device can self-adjust and save power according to the communication information, reduce the power consumption of the wireless communication device, extend a battery life of the wireless communication device, and improve a user experience.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10~S30:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="732" publication-number="202624953">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624953</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113151422</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用以將資料動態地反映至對象之裝置、方法及記錄有命令之記錄媒體</chinese-title>
        <english-title>APPARATUS, METHOD AND RECORDING MEDIUM STORING COMMANDS FOR REFLECTING DATA IN OBJECT DYNAMICALLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250908B">G06F8/65</main-classification>
        <further-classification edition="200601120250908B">G06F17/40</further-classification>
        <further-classification edition="201801120250908B">G06F9/44</further-classification>
        <further-classification edition="200601120250908B">G06F13/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳高盛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, GAOSHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種動態地構成原始碼中之對象之方法。本發明之一實施例之方法係於裝置中實行者，該裝置包括：一個以上之處理器；及一個以上之記憶體，其儲存有用以由上述一個以上之處理器執行之命令；上述方法可包括隨著上述命令之執行而由上述一個以上之處理器進行之如下步驟：接收原始碼；識別與上述原始碼中包括之第1對象對應之註解資料欄位；基於上述註解資料欄位確定與上述第1對象對應之對象屬性，上述對象屬性包括與上述第1對象對應之鍵、初始值或資料類型中之至少一者；自外部裝置中儲存之資料源獲得與上述對象屬性中包括之鍵對應之第1資料；基於上述對象屬性中包括之資料類型，轉換上述第1資料之屬性；及將上述轉換後之第1資料注入至上述第1對象。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:裝置</p>
        <p type="p">102:用戶終端</p>
        <p type="p">103:外部裝置</p>
        <p type="p">110:動作</p>
        <p type="p">120:動作</p>
        <p type="p">130:動作</p>
        <p type="p">140:動作</p>
        <p type="p">150:動作</p>
        <p type="p">160:動作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="733" publication-number="202625318">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625318</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113151808</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電源連接器</chinese-title>
        <english-title>POWER CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250124B">H01R33/06</main-classification>
        <further-classification edition="200601120250124B">H01R33/97</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商貝爾威勒電子（昆山）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BELLWETHER ELECTRONIC (KUNSHAN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柏立永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAI, LI-YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王紅豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HONGHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電源連接器包含兩電極組件、殼體以及兩固定件。兩電極組件各包含端子以及母線，端子固定地連接母線。殼體包含兩側壁以及插接部。兩側壁彼此分離地設置，並共同定義出容置空間。插接部連接兩側壁，並從兩側壁的一側突伸出。插接部定義出插槽，兩側壁與插槽彼此垂直。兩電極組件的母線彼此分離地設置在容置空間中，且端子部分延伸至插接部的插槽。兩固定件分別固定在兩電極組件的母線上。殼體的兩側壁各具有至少一凹槽，兩固定件卡合於凹槽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power connector includes two electrode assemblies, a housing and two locking pieces. The two electrode assemblies each include a busbar and a terminal fixedly attached to the busbar. The housing includes two sidewalls and a mating portion. The two sidewalls are spaced apart from each other and collectively define an accommodation space. The mating portion is connected to the sidewalls and projects from one side of the sidewalls. The mating portion defines a slot normal to the sidewalls. The busbars of the two electrode assemblies are disposed in the accommodation space and are spaced apart from each other. The terminal partially extends into the slot of the mating portion. The two locking pieces are affixed to the two busbars of the two electrode assemblies, respectively. The two sidewalls of the housing each include at least one recess. The locking pieces engage the recess.</p>
      </isu-abst>
      <representative-img>
        <p type="p">12:電源連接器</p>
        <p type="p">13:緊固件</p>
        <p type="p">20:殼體</p>
        <p type="p">23:插接部</p>
        <p type="p">24:立壁</p>
        <p type="p">26:翼部</p>
        <p type="p">31:第一導電塊</p>
        <p type="p">33:編織導線結構</p>
        <p type="p">35:端子</p>
        <p type="p">35P:第一端子</p>
        <p type="p">35Q:第二端子</p>
        <p type="p">36:平板部</p>
        <p type="p">37:接觸部</p>
        <p type="p">38:懸臂</p>
        <p type="p">50:側壁</p>
        <p type="p">56R:後開口</p>
        <p type="p">60:固定件</p>
        <p type="p">90:匯流排連接器</p>
        <p type="p">91,92:電極</p>
        <p type="p">93:絕緣條</p>
        <p type="p">94:接地墊</p>
        <p type="p">96:殼體</p>
        <p type="p">98:散熱孔</p>
        <p type="p">AF:氣流</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">G:間隙</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="734" publication-number="202624807">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624807</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113151815</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光波導結構以及增強現實顯示裝置</chinese-title>
        <english-title>OPTICAL WAVEGUIDE STRUCTURE AND AUGMENTED REALITY DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250801B">G02B6/124</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商業桓科技（成都）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERFACE ADVANCED TECHNOLOGY (CHENGDU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商業成科技(成都)有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERFACE TECHNOLOGY (CHENGDU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商業成光電（深圳）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英特盛科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENERAL INTERFACE SOLUTION LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳伯豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡珮渠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, PEI-CHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種光波導結構，包括第一波導、第一耦入光柵以及第一耦出光柵。第一波導用於接收並引導具有第一波長範圍之子圖像光沿第一方向傳播。第一耦入光柵設置於第一表面，並用於接收圖像光，第一耦入光柵之光柵方向相對於第一方向具有第一夾角。第一耦出光柵用於接收並耦出從第一波導出射之具有第一波長範圍之子圖像光，第一耦出光柵之光柵方向相對於第一方向具有第二夾角。其中，第一夾角與第二夾角不為零。本申請還提供一種包括上述光波導結構之增強現實顯示裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an optical waveguide structure. The optical waveguide structure includes a first waveguide, a first incoupling grating and a first outcoupling grating. The first waveguide is used to receive and guide the sub-image light with the first wavelength range to travel in the first direction. The first incoupling grating is arranged on the first surface. The first incoupling grating is used to receive the image light. The grating direction of the first incoupling grating has the first angle relative to the first direction. The first outcoupling grating is used to receive and decouple the sub-image light with the first wavelength range emanating from the first waveguide. The grating direction of the first outcoupling grating has a second angle relative to the first direction. The first angle and the second angle are not zero. The present disclosure also provides an augmented reality display device includes the optical waveguide structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光波導結構</p>
        <p type="p">1:第一波導</p>
        <p type="p">11:第一表面</p>
        <p type="p">12:第二表面</p>
        <p type="p">3:第一耦入光柵</p>
        <p type="p">4:第一耦出光柵</p>
        <p type="p">5:第二波導</p>
        <p type="p">51:第三表面</p>
        <p type="p">6:第二耦入光柵</p>
        <p type="p">7:第二耦出光柵</p>
        <p type="p">L0:圖像光</p>
        <p type="p">L1:具有第一波長範圍之子圖像光</p>
        <p type="p">L2:具有第二波長範圍之子圖像光</p>
        <p type="p">X:第一方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="735" publication-number="202624977">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624977</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114100126</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無晶體振盪器的通用序列匯流排裝置和時脈訊號產生方法</chinese-title>
        <english-title>CRYSTAL-LESS UNIVERSAL SERIAL BUS DEVICE AND CLOCK SIGNAL GENERATING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">G06F13/38</main-classification>
        <further-classification edition="200601120250401B">G06F1/04</further-classification>
        <further-classification edition="200601120250401B">H03L7/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯詠科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孔致遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNG, CHIH-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉益呈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李若揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, RUO-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳秉勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, BING-SYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種通用序列匯流排（USB）裝置，耦接於一USB主機，該USB裝置包含有一收發器，從該USB主機接收具有一第一頻率的一資料訊號，其中該資料訊號包含具有一周期性特徵的複數個特定封包；一封包偵測器，耦接於該收發器，透過該收發器接收該資料訊號，用來根據複數個特定封包的該周期性特徵產生一參考訊號；以及一鎖頻迴路電路，耦接於該收發器和該封包偵測器，用來根據該參考訊號產生具有一第二頻率的一時脈訊號；其中該第一頻率實質上等於該第二頻率。換言之，調整第二頻率以接近第一頻率，且第一頻率與第二頻率之間的頻率差小於500ppm。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A universal serial bus (USB) device, coupled to a USB host, includes a transceiver, receiving a data signal having a first frequency from the USB host, wherein the data signal comprises a plurality of specific packets with a periodic characteristic; a packet detector, coupled to the transceiver, receiving the data signal through the transceiver, configured to generate a reference signal according to the periodic characteristic of the plurality of specific packets; and a frequency-locked loop (FLL) circuit, coupled to the transceiver and the packet detector, configured to generate a clock signal having a second frequency according to the reference signal; wherein the first frequency is substantially equal to the second frequency. In other words, the second frequency is adjusted to approach the first frequency, and a frequency difference between the first frequency and the second frequency is smaller than 500 ppm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:USB系統</p>
        <p type="p">10:USB裝置</p>
        <p type="p">20:USB主機</p>
        <p type="p">101:收發器</p>
        <p type="p">102:封包偵測器</p>
        <p type="p">103:鎖頻迴路電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="736" publication-number="202625000">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625000</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114100529</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>模擬測試方法、電子設備及存儲介質</chinese-title>
        <english-title>METHOD FOR SIMULATING TEST, ELECTRONIC DEVICE, AND STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250501B">G06F30/20</main-classification>
        <further-classification edition="202001120250501B">G01R31/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>代中義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI, ZHONG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種模擬測試方法、電子設備及存儲介質，所述方法包括：根據飛針測試台的結構檔確定飛針測試台的機台模型；根據被測物體的結構檔確定被測物體的物體模型，物體模型包括複數元件模型；確定每個元件模型對應的複數測試點的測試位置；根據複數元件模型之間的結構關係，確定每個測試點的複數下針角度；控制飛針模型基於每個下針角度移動至相應的測試位置，得到相應的測試點在每個下針角度的下針結果；基於所有測試點對應的所有下針結果，得到模擬結果。上述模擬測試方法能夠降低測試的人工成本以及提升示教的效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides a method for simulating a test, an electronic device, and a storage medium. The method includes: determining a machine model of a flying probe tester based on a structure file; determining an object model of a test object based on a structure file of the test object, the object model including a plurality of component models; identifying test positions of test points corresponding to each component model; determining a plurality of insertion angles of a needle at each test point according to structure relationships among the component models; directing a flying probe model to move to a test position at each insertion angle, and obtaining a needle-insertion result of each test point at each insertion angle; and determining simulation results based on all needle-insertion results corresponding to all test points. The method for simulating test can reduce labor costs and improve a teaching efficiency of testing processes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S201~S206:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="737" publication-number="202624290">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624290</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114100729</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>間隙材凸塊的形成方法</chinese-title>
        <english-title>METHOD OF FORMING SPACER BUMPS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08F2/48</main-classification>
        <further-classification edition="200601120260302B">C09J4/04</further-classification>
        <further-classification edition="200601120260302B">B32B7/14</further-classification>
        <further-classification edition="200601120260302B">G02F1/1339</further-classification>
        <further-classification edition="202601120260302B">H10P54/00</further-classification>
        <further-classification edition="202601120260302B">H10W74/00</further-classification>
        <further-classification edition="202301120260302B">H10K59/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王麗菁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LI-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠位</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">間隙材凸塊的形成方法包括：提供基板，且基板上具有配向膜；放置金屬模具於配向膜上，且金屬模具具有貫穿金屬模具的多個通孔；充填光固化材料於金屬模具的通孔中，並以紫外線預固化光固化材料；移除金屬模具；以及移除金屬模具之後以紫外線二次固化光固化材料，以形成多個間隙材凸塊，其中配向膜與間隙材凸塊的材料不同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of forming spacer bumps includes providing a substrate, and the substrate has an alignment film thereon. Disposing a metal mold on the alignment film, and the metal mold includes a plurality holes penetrating therethrough. Filling a photo curable material into the holes of the metal mold, and pre-curing the photo curable material by UV radiation. Removing the metal mold, and then secondary-curing the photo curable material by UV radiation to form a plurality of spacer bumps. The material of the alignment film is different from the material of the spacer bumps.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:金屬模具</p>
        <p type="p">115:光固化材料</p>
        <p type="p">120:噴墨裝置</p>
        <p type="p">130:紫外線</p>
        <p type="p">200:基板</p>
        <p type="p">201:配向膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="738" publication-number="202625197">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625197</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114100777</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>數據儲存裝置及解碼手段選擇方法</chinese-title>
        <english-title>DATA STORAGE DEVICE AND DECODING MEANS SELECTION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">G11C29/52</main-classification>
        <further-classification edition="200601120250401B">H03M13/37</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳市欣芯半導體有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENZHEN XINXIN SEMICONDUCTOR CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張均林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JUN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種數據儲存裝置及解碼手段選擇方法。其中數據儲存裝置包括控制器及非揮發性記憶體，非揮發性記憶體用以儲存多個指令，控制器用以執行多個指令以實現解碼手段選擇方法包括：判斷有儲存前次正確讀取的第一讀取電壓；判斷硬解碼基於第一讀取電壓解碼數據失敗；獲取硬解碼的症狀權重；依據症狀權重查找基於第一讀取電壓的軟解碼所需的讀取次數；以及判斷軟解碼基於第一讀取電壓解碼數據成功。如此，可進行快速軟解碼，節省讀取電壓的跟蹤時間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A data storage device and decoding means selection method. The data storage device includes a controller and a non-volatile memory. The non-volatile memory is used to store multiple instructions. The controller is used to execute the multiple instructions to implement the decoding means selection method. The decoding means selection method includes: determining that a first read voltage that was read correctly last time is stored; determining that a hard decoding fails to decode data based on the first read voltage; obtaining a syndrome weight of the hard decoding; searching for the number of readings required for a soft decoding based on the first read voltage based on the syndrome weight; and determining that the soft decoding is successful in decoding data based on the first reading voltage. In this way, fast soft decoding can be performed and the tracking time of reading the voltage can be saved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1,S3,S5,S7,S9,S11,S13,S15,S17:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="739" publication-number="202625457">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625457</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114100804</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>耳機設備的防脫落方法、裝置及設備</chinese-title>
        <english-title>METHOD FOR PREVENTING EARPHONE FROM FALLING OFF, DEVICE, AND APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">H04R1/02</main-classification>
        <further-classification edition="202601120260302B">H04R1/10</further-classification>
        <further-classification edition="200601120260302B">H04R29/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余雷同</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, LEI-TONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐學亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, XUE-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種耳機設備的防脫落方法、裝置及設備，所述耳機設備包括感測機構與吸附機構，所述防脫落方法包括：藉由所述感測機構感測所述耳機設備與使用者的外耳道接觸的初始位置；藉由所述感測機構感測所述耳機設備與所述外耳道接觸的即時位置以及感測所述外耳道對所述耳機設備施加的即時壓力；當所述即時位置與所述初始位置之間存在偏差時，和/或所述即時壓力低於預設閾值時，控制所述吸附機構吸附所述外耳道。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a method for preventing earphone from falling off, a device, and an apparatus. Each of the earphones includes a sensing mechanism and an adsorption mechanism. The method for preventing earphone from falling off includes: detecting an initial position at which the earphone contacts the user's ear canal via the sensing mechanism; detecting an instant position of the earphone in contact with the ear canal and detecting an instant pressure exerted by the ear canal on the earphone; controlling the adsorption mechanism to adsorb the ear canal, when there is a deviation between the instant position and the initial position, and/or when the instant pressure is lower than a predetermined threshold value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10~S15:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="740" publication-number="202624963">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624963</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114100818</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>軟體測試方法以及軟體測試系統</chinese-title>
        <english-title>SOFTWARE TESTING METHOD AND SOFTWARE TEST SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250501B">G06F11/3668</main-classification>
        <further-classification edition="202501120250501B">G06F11/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商鼎捷數智股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIGIWIN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鼎新數智股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DATA SYSTEMS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志琴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ZHIQIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>刁陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIAO, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝麗霞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, LIXIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李驍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐玲玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, LINGLING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種軟體測試方法以及軟體測試系統。軟體測試方法包括以下的步驟。處理器獲取測試用例。當測試用例具有增量代碼時，處理器基於增量代碼的覆蓋率，以根據向量資料庫中的多個特徵向量以及測試用例生成補充測試用例。前述關於生成補充測試用例的步驟還包括以下的步驟。處理器提取測試用例的關鍵資訊以獲得多個第一資料向量單元。處理器根據多個第一資料向量單元以及多個特徵向量執行相似度搜索以獲得多個第二資料向量單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A software testing method and a software testing system are provided. The software testing method includes the following steps. The processor gets a test case. When the test case has a delta code, the processor generates a supplementary test case based on a plurality of feature vectors in a vector database and the test case based on the coverage of the delta code. The aforementioned steps for generating the supplementary test case also include the following steps. The processor extracts key information of the test case to obtain a plurality of first data vector units. The processor performs a similarity search based on the plurality of first data vector units and the plurality of feature vectors to obtain a plurality of second data vector units.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:軟體測試系統</p>
        <p type="p">110:處理器</p>
        <p type="p">120:記憶體</p>
        <p type="p">121:向量資料庫</p>
        <p type="p">EV:特徵向量</p>
        <p type="p">TS:測試用例</p>
        <p type="p">TS’:補充測試用例</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="741" publication-number="202625240">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625240</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114100858</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>克服負載效應之化學氣相沉積(CVD)硼均勻性</chinese-title>
        <english-title>CVD BORON UNIFORMITY OVERCOMING LOADING EFFECTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">H01J37/26</main-classification>
        <further-classification edition="201801120260302B">G01N23/2206</further-classification>
        <further-classification edition="200601120260302B">G01T1/29</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　振華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHERN, JEHN-HUAR HOWARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔伯　馬歇爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRIMPL, MARCEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布朗　大衛　Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROWN, DAVID L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">藉由在沉積硼層之前在一介電層上沉積一黏著層，可減少或消除硼層對一視窗內之矽之負載效應。該黏著層可藉由硼物種被沉積於該黏著層上來減少或消除硼物種橫向擴散至該視窗中。使用該黏著層之方法可能夠在數十毫米級及以下之視窗內形成奈米級之硼層。該硼層及矽層可形成可用於掃描電子顯微鏡及類似者之一偵測器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The loading effects of boron layers on silicon within a window may be reduced or eliminated by depositing an adhesion layer on a dielectric layer before depositing the boron layer. The adhesion layer may reduce or eliminate lateral diffusion of boron species into the window by being deposited on the adhesion layer. The approach using the adhesion layer may enable forming the boron layer at the nanometer scale within windows which are at the tens of millimeters scale and below. The boron layer and the silicon layer may form a detector which may be used in scanning electron microscopes and the like.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:偵測器</p>
        <p type="p">101:電子</p>
        <p type="p">102:矽層</p>
        <p type="p">103:光子</p>
        <p type="p">104:介電層</p>
        <p type="p">106:黏著層</p>
        <p type="p">107:視窗</p>
        <p type="p">108a:上硼層</p>
        <p type="p">108b:下硼層</p>
        <p type="p">110:磊晶層</p>
        <p type="p">112:陽極</p>
        <p type="p">114:陰極</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="742" publication-number="202625393">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625393</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114100902</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有額外延遲的數位隔離器電路</chinese-title>
        <english-title>DIGITAL ISOLATOR MODULE HAVING ADDITIONAL DELAY PATH</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">H04B1/44</main-classification>
        <further-classification edition="200601120250602B">H04B1/10</further-classification>
        <further-classification edition="202401120250602B">H04B5/75</further-classification>
        <further-classification edition="200601120250602B">H03K17/689</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>晶焱科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMAZING MICROELECTRONIC CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李冠舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, GUAN-SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有額外延遲的數位隔離器電路，包括接收資料輸入訊號並產生第一、第二發射器輸出訊號之發射器電路，其中，所述的第二發射器輸出訊號為第一發射器輸出訊號的延遲訊號。之後，隔離屏障據以產生第一、第二隔離輸出訊號，使接收器電路響應該等隔離輸出訊號產生資料輸出訊號。通過在發射器電路中進一步設置延遲電路，從而延遲第一發射器輸出訊號，產生第二發射器輸出訊號，本發明可有效增益接收器電路端的接收訊號，維持共模訊號的穩定與資料傳輸的穩健性。一脈衝載波調變機制係同時被採用，以有效減少功率消耗、電磁干擾及訊號抖動問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A digital isolator module having additional delay path is provided, comprising a transmitter circuit receiving a data input signal and generating a first and second transmitter output signal. The second transmitter output signal is a delay signal of the first transmitter output signal. An isolation barrier is then configured, accordingly developing a first and second isolated output signal. And a receiver circuit accordingly generates a data output signal in response to the first and second isolated output signals. By employing a delay circuit in the disclosed transmitter circuit for delaying the first transmitter output signal and generating the second transmitter output signal, receiving signals at the receiver input terminal can be enhanced, robustness of data transmission is greatly improved and common mode voltage instability is suppressed. A pulse carrier modulation technique is further developed in the disclosed digital isolator module for reducing power consumption, electromagnetic interferences and jitter disturbance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:上下緣轉換器</p>
        <p type="p">52:振盪器</p>
        <p type="p">54:AND邏輯閘</p>
        <p type="p">56:延遲電路</p>
        <p type="p">202:發射器電路</p>
        <p type="p">V&lt;sub&gt;ss1&lt;/sub&gt;:第一接地電壓</p>
        <p type="p">DI:資料輸入訊號</p>
        <p type="p">DI_C:轉換資料訊號</p>
        <p type="p">OSC:振盪訊號</p>
        <p type="p">TXO:第一發射器輸出訊號</p>
        <p type="p">TXOD:第二發射器輸出訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="743" publication-number="202625389">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625389</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114100903</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有額外延遲的發射器電路</chinese-title>
        <english-title>TRANSMITTER CIRCUIT HAVING ADDITIONAL DELAY PATH</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">H04B1/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>晶焱科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMAZING MICROELECTRONIC CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李冠舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, GUAN-SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有額外延遲的發射器電路，根據資料輸入訊號之上升緣與下降緣產生第一發射器輸出訊號，並藉由延遲該第一發射器輸出訊號產生第二發射器輸出訊號。發射器電路包括輸出一轉換資料訊號的上下緣轉換器、接收該轉換資料訊號並產生載波訊號的延遲邏輯單元、接收轉換資料訊號與載波訊號，以產生第一發射器輸出訊號的AND邏輯閘、及接收第一發射器輸出訊號從而產生第二發射器輸出訊號的延遲電路。本發明可增益資料傳輸的穩健性與共模訊號的穩定。同時，基於載波訊號包含脈衝的數量為有限且具有明確數量的，亦有效降低功率消耗與電磁干擾等問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A transmitter circuit is provided having an additional delay path. A first transmitter output signal is generated according to a rising edge and falling edge of its data input signal. A second transmitter output signal is generated by delaying the first transmitter output signal. The disclosed transmitter circuit includes a rising and falling converter for outputting a converted data input signal, a delay and logic unit for receiving the converted data input signal and generating a carrier signal, an AND gate receiving the converted data input signal and the carrier signal, and outputting the first transmitter output signal, and a delay circuit receiving the first transmitter output signal and outputting the second transmitter output signal. Robustness and common mode voltage stability can be enhanced. Due to a definite and limited number of pulses of the carrier signal, the invention also achieves to reduce power consumption and electromagnetic interferences effectively.</p>
      </isu-abst>
      <representative-img>
        <p type="p">60:上下緣轉換器</p>
        <p type="p">62:延遲邏輯單元</p>
        <p type="p">64:AND邏輯閘</p>
        <p type="p">66:延遲電路</p>
        <p type="p">302:發射器電路</p>
        <p type="p">DI:資料輸入訊號</p>
        <p type="p">DI_C:轉換資料訊號</p>
        <p type="p">CS:載波訊號</p>
        <p type="p">TXO:第一發射器輸出訊號</p>
        <p type="p">TXOD:第二發射器輸出訊號</p>
        <p type="p">V&lt;sub&gt;ss1&lt;/sub&gt;:第一接地電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="744" publication-number="202624836">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624836</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101166</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像顯示眼鏡</chinese-title>
        <english-title>IMAGE DISPLAY GLASSES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250422B">G02B27/02</main-classification>
        <further-classification edition="200601120250422B">G02C7/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秀育企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOLID YEAR CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳川仕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHUAN-SHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種影像顯示眼鏡，包含分光鏡、視力矯正透鏡組及可調式投射鏡組。視力矯正透鏡組與分光鏡沿第一方向排列。視力矯正透鏡組具有相背對的物側及像側。像側較物側靠近分光鏡。可調式投射鏡組包含活動式面板及活動式透鏡。活動式面板可相對分光鏡移動。活動式透鏡可相對分光鏡移動，並位於活動式面板與分光鏡之間。活動式面板、活動式透鏡與分光鏡沿第二方向排列。第一方向與第二方向不平行。其中，視力矯正透鏡組用以供外部光線入射至人眼以形成實體影像。活動式面板用以投射至少一投射光線至人眼以形成虛擬影像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image display glasses includes a beam splitter, a vision correction lens assembly and an adjustable projection lens assembly. The vision correction lens assembly and the beam splitter are arranged along a first direction. The vision correction lens assembly has an object side and an image side opposite to each other. The image side is closer to the beam splitter than the object side. The adjustable projection lens assembly includes a movable panel and a movable lens. The movable panel is movable relative to the beam splitter. The movable lens is movable relative to the beam splitter, and is located between the movable panel and the beam splitter. The movable panel, the movable lens and the beam splitter are arranged along a second direction. The first direction and the second direction are not parallel. The vision correction lens assembly is configured for an external light to enter the human eye to form a real image. The movable panel is configured to project at least one projection light to the human eye to form a virtual image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:影像顯示眼鏡</p>
        <p type="p">11:分光鏡</p>
        <p type="p">12:視力矯正透鏡組</p>
        <p type="p">121:物側</p>
        <p type="p">122:像側</p>
        <p type="p">13:可調式投射鏡組</p>
        <p type="p">131:活動式面板</p>
        <p type="p">1311:板體</p>
        <p type="p">1312:投射光源</p>
        <p type="p">132:活動式透鏡</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">E:人眼</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="745" publication-number="202625302">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625302</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101479</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>第一連接器組件及連接器系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250122B">H01R11/01</main-classification>
        <further-classification edition="200601120250122B">H01R13/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商莫仕有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOLEX, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鞠道杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JU, DAO-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡柏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, BAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅鋼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, GANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種第一連接器組件及連接器系統，第一連接器組件包括主體外殼、設在主體外殼內的至少兩種不同類型的第一端子模組及至少一個獨立二次鎖扣件；主體外殼內設有至少兩個收容腔，每個收容腔沿上下方向延伸，且至少兩個收容腔能供任一種類型的第一端子模組任意互換地插入；主體外殼在每個收容腔內壁上設有至少一個第一鎖扣結構，每個第一端子模組包括第一模組殼體及裝設在第一模組殼體內的多個導電端子，第一模組殼體外壁上設有至少一個第二鎖扣結構，第二鎖扣結構能與第一鎖扣結構相配合而將第一模組殼體鎖固至主體外殼；獨立二次鎖扣件部分穿過主體外殼殼壁的穿孔而插入到收容腔內，以將第一端子模組鎖固至主體外殼。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:第一連接器組件</p>
        <p type="p">110:主體外殼</p>
        <p type="p">1101:收容腔</p>
        <p type="p">111:彈性卡扣臂</p>
        <p type="p">130:獨立二次鎖扣件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="746" publication-number="202625569">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625569</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101672</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250401B">H10D1/60</main-classification>
        <further-classification edition="202501120250401B">H10D1/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡喻丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YU-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, MENG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林杏芝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSING-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王明璁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, MING-TSONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉人誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, JEN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊蒔融</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHIH-RONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的一些實施例是有關於包括半導體基底和配置在半導體基底上的互連結構的裝置。互連結構包括下層金屬線、中間金屬線以及上層金屬線以及多個金屬通孔。配置在互連結構中的第一電極包括第一側向部分和從第一側向部分向下延伸的突出部。第一側向部分配置在上層金屬線的上表面上，突出部延伸至下層金屬線的下表面下方。第二電極配置在互連結構中，與第一電極匹配接合，並具有低於第一電極下表面的下表面。介電質側向環繞第二電極的內側壁結構，以將第二電極與第一電極的外側壁結構分離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Some embodiments relate to a device including a semiconductor substrate, and an interconnect structure disposed over the semiconductor substrate. The interconnect structure includes a lower metal line, an intermediate metal line, and an upper metal line, and a plurality of metal vias. A first electrode disposed in the interconnect structure includes a first lateral portion and a protrusion that extends downward from the first lateral portion. The first lateral portion is disposed over an upper surface of the upper metal line, and the protrusion extends below a lower surface of the lower metal line. A second electrode is disposed in the interconnect structure, matingly engages the first electrode, and has a lower surface that is below a lower surface of the first electrode. A dielectric laterally surrounds an inner sidewall structure of the second electrode to separate the second electrode from an outer sidewall structure of the first electrode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:裝置</p>
        <p type="p">102、104:晶粒</p>
        <p type="p">106、110:半導體基底</p>
        <p type="p">108、112:互連結構</p>
        <p type="p">114a、114b:墊、層</p>
        <p type="p">116:墊</p>
        <p type="p">118:邏輯區</p>
        <p type="p">120、121:半導體裝置</p>
        <p type="p">122:電容器區域</p>
        <p type="p">124:MIM電容器</p>
        <p type="p">126、145:金屬線</p>
        <p type="p">128:金屬線、金屬層</p>
        <p type="p">130:介電結構</p>
        <p type="p">132、134:通孔層</p>
        <p type="p">136:介電結構、介電層</p>
        <p type="p">138:蝕刻停止層</p>
        <p type="p">140、148:導電特徵</p>
        <p type="p">142、146a、146b、147:通孔</p>
        <p type="p">144:金屬線</p>
        <p type="p">150:電極、金屬層</p>
        <p type="p">152:側向部分</p>
        <p type="p">156:電極</p>
        <p type="p">158:介電質</p>
        <p type="p">160:硬罩幕</p>
        <p type="p">162:間隔件</p>
        <p type="p">164:介電質、氣隙</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="747" publication-number="202625866">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625866</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101800</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>封裝基板與其製造方法與封裝結構</chinese-title>
        <english-title>PACKAGE SUBSTRATE AND METHOD OF MAKING THE SAME AND PACKAGE STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W74/10</main-classification>
        <further-classification edition="202601120260302B">H10W20/20</further-classification>
        <further-classification edition="202601120260302B">H10W20/40</further-classification>
        <further-classification edition="202601120260302B">H10W74/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王垂堂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHUEI-TANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥名</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭又銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, YU-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尚書安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANG, SHU-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　錦興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KAM HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">封裝基板包括核心、介電填充層、與介電填充層中的晶粒。晶粒含有裝置區位於晶粒的第一側上，以及穿矽通孔自晶粒的第一側延伸穿過裝置區至晶粒的第二側，且晶粒的第一側與第二側相對。製造封裝基板的方法包括提供核心，至少嵌置晶粒於核心之上或之中，其中晶粒包括裝置區於晶粒的第一側上，以及穿矽通孔自晶粒的第一側延伸穿過該裝置區並延伸至晶粒的第二側，且晶粒的第一側與第二側相對，以及形成介電填充層於晶粒周圍。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A package substrate includes a core, a dielectric filling layer, and a die in the dielectric filling layer, including a device region on a first side of the die, and a through silicon via (TSV) extending from the first side of the die, through the device region, and to a second side of the die opposite the first side of the die. A method of making a package substrate includes providing a core, mounting a die at least one of on the core or in the core, wherein the die includes a device region on a first side of the die, and a TSV extending from the first side of the die, through the device region, and to a second side of the die opposite the first side of the die, and forming a dielectric filling layer around the die.</p>
      </isu-abst>
      <representative-img>
        <p type="p">O&lt;sub&gt;112&lt;/sub&gt;:核心開口</p>
        <p type="p">10:中介層</p>
        <p type="p">100:封裝結構</p>
        <p type="p">110:封裝基板</p>
        <p type="p">112:核心</p>
        <p type="p">114:上側積層部分</p>
        <p type="p">115a:介電填充層上側部分</p>
        <p type="p">115b:介電填充層下側部分</p>
        <p type="p">115o:介電填充層開口部分</p>
        <p type="p">116:下側積層部分</p>
        <p type="p">119:模組底填層</p>
        <p type="p">120:中介層模組</p>
        <p type="p">121:焊料凸塊</p>
        <p type="p">124,126:金屬內連線結構</p>
        <p type="p">127:成型材料層</p>
        <p type="p">128:微凸塊</p>
        <p type="p">129:封裝底填層</p>
        <p type="p">140:頂部晶粒</p>
        <p type="p">141:第一半導體晶粒</p>
        <p type="p">142:第二半導體晶粒</p>
        <p type="p">150:強化環</p>
        <p type="p">160:黏著層</p>
        <p type="p">180:球格陣列</p>
        <p type="p">181:焊料球</p>
        <p type="p">191:上側接合墊</p>
        <p type="p">192:下側接合墊</p>
        <p type="p">200:晶粒</p>
        <p type="p">203:穿矽通孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="748" publication-number="202625572">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625572</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101921</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250520B">H10D1/68</main-classification>
        <further-classification edition="202301120250520B">H10B12/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳明鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, MING-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡敏瑛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MIN-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昇照</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHENG-CHAU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體裝置包括電容器結構，該電容器結構包括具有多個氧化鋁層和多個氧化鋯層的絕緣層堆疊。絕緣層堆疊形成於電容器結構的底部電極層上。氧化鋁層在絕緣層堆疊的底部和頂部的排列防止氧從氧化鋯層遷移到電容器結構的電極層，同時達成比具有不同排列絕緣體層的電容器結構更高的電容水平。此外，由於絕緣層堆疊的氧化鋁層防止氧從絕緣層堆疊的氧化鋯層遷移到電容器結構的電極層，可為電容器結構達成更快的放電時間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a capacitor structure that includes an insulator layer stack with a plurality of aluminum oxide layers and a plurality of zirconium oxide layers. The insulator layer stack is formed on a bottom electrode layer of the capacitor structure. The arrangement of the aluminum oxide layers at a bottom and a top of the insulator layer stack prevents oxygen migration from the zirconium oxide layers to the electrode layers of the capacitor structure, while achieving higher capacitance levels than those of capacitor structures with differently arranged insulator layers. In addition, since the aluminum oxide layers of the insulator layer stack prevent oxygen migration from the zirconium oxide layers of the insulator layer stack to the electrode layers of the capacitor structure, faster discharge times can be achieved for the capacitor structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1100:製程</p>
        <p type="p">1110、1120、1130、1140:方塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="749" publication-number="202625619">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625619</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101978</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>單元區域及其製造方法</chinese-title>
        <english-title>CELL REGION AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250423B">H10D89/10</main-classification>
        <further-classification edition="202001120250423B">G06F30/392</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉振華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHENG-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張洸鋐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, KUANG-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃冠銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, GUAN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭謝廷揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, HSIEH-TING-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯元德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, YUAN-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例的單元區域包括：包含第一饋通導孔排列（FTA）的電晶體元件層；位於電晶體元件層上方的第一金屬化層，包括第一正面段，第一正面段包括第一和第二正面電源網格（FPG）段，以及一或多個正面佈線（FRTE）段，包括第一FRTE段；以及位於電晶體元件層下方的第一埋入金屬化層，包括第一背面段，第一背面段包括第一和第二背面電源網格（BPG）段，以及一或多個背面佈線（BRTE）段，包括第一BRTE段。第一FTA將第一FRTE段耦合到第一BRTE段。相對於第一方向和垂直於第一方向的第二方向，第一BPG段具有第一凹槽，該凹槽部分被至少第一BRTE段的第一部分佔據。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cell region includes：a transistor-components layer including a first feedthrough via arrangement (FTA); a first metallization layer over the transistor-components layer and including first-front-side segments, the first front-side segments including first and second front-side power grid (FPG) segments, and one or more front-side routing (FRTE) segments including a first FRTE segment; and a first buried metallization layer under the transistor-components layer and including first back-side segments, the first back-side segments including first and second back-side power grid (BPG) segments, and one or more back-side routing (BRTE) segments including a first BRTE segment. The first FTA couples the first FRTE segment to the first BRTE segment. Relative to the first direction and a second direction perpendicular to the first direction, the first BPG segment having a first notch partially occupied by at least a first portion of the first BRTE segment.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:裝置</p>
        <p type="p">102:巨區</p>
        <p type="p">104:功能電路區域</p>
        <p type="p">106:饋通導孔單元區域</p>
        <p type="p">108:饋通導孔排列</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="750" publication-number="202625867">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625867</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101981</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體封裝及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W74/10</main-classification>
        <further-classification edition="202601120260302B">H10W40/10</further-classification>
        <further-classification edition="202601120260302B">H10W72/00</further-classification>
        <further-classification edition="202601120260302B">H10W74/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴杰隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHIEH-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂佳凌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHIA-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳碩懋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHUO-MAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳憲偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIEN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供半導體封裝及其製造方法。半導體封裝包括：第一半導體晶粒；第二半導體晶粒，在第一半導體晶粒旁邊且間隔開，彼此之間有間隙；模製化合物，橫向包覆第一和第二半導體晶粒；重分佈層，配置在模製化合物以及第一和第二半導體晶粒上；被動組件和散熱組件。模製化合物的第一部分配置在間隙內並填充在間隙中。被動組件配置在重分佈層上，位於模製化合物的第一部分上方並橫跨間隙。散熱組件配置於重分佈層上且位於被動組件旁邊，散熱組件與被動組件分開並遠離。散熱組件位於第一和第二半導體晶粒中的至少一者的拐角上方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a first die, and a second die disposed aside of and spaced apart from the first die with a gap there-between, a molding compound wrapping the first and second dies, a redistribution layer disposed on the molding compound and the first and second dies, a passive component and a thermal dissipating component. A first portion of the molding compound is disposed within and filled in the gap. The passive component is disposed on the redistribution layer, and located above the first portion of the molding compound and across the gap. The thermal dissipating component is disposed on the redistribution layer and beside the passive component, separate and distanced from the passive component. The thermal dissipating component is located above a corner of at least one of the first and second semiconductor dies.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110S:表面</p>
        <p type="p">120A、120B:半導體晶粒</p>
        <p type="p">120Ap、120Bp:周邊部分</p>
        <p type="p">130P:軌部分</p>
        <p type="p">140:被動組件</p>
        <p type="p">150A、150B:散熱組件</p>
        <p type="p">160:導電接點</p>
        <p type="p">CN1、CN2、CN3、CN4、CN5:拐角</p>
        <p type="p">GP1:間隙</p>
        <p type="p">PR1、TR1、TR2、TR3:安裝區</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="751" publication-number="202623773">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623773</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101992</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>通過室間隔固定的心臟瓣膜假體</chinese-title>
        <english-title>HEART VALVE PROSTHESIS FIXED THROUGH INTERVENTRICULAR SEPTUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250206B">A61F2/24</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商寧波健世科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JENSCARE SCIENTIFIC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吕世文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LV, SHIWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請係有關於醫療器械領域，尤其係有關於一種通過室間隔固定的心臟瓣膜假體，包括瓣膜支架和固定裝置，瓣膜支架包括瓣膜縫製段和人工瓣膜，人工瓣膜被固定連接在瓣膜縫製段上，固定裝置包括固定支撐段和固定件，固定支撐段的一端連接在瓣膜縫製段的近端部分上，固定支撐段的另一端通過固定件連接在患者室間隔上支撐心臟瓣膜假體並限制心臟瓣膜假體軸向移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The application relates to the field of medical apparatus, and in particular to a heart valve prosthesis fixed through the interventricular septum, including a valve stent and a fixing apparatus. The valve stent includes a valve sewing section and an artificial valve. The artificial valve is fixedly connected onto the valve sewing section. The fixing apparatus includes a fixed support section and a fixing piece. One end of the fixed support section is connected onto the proximal part of the valve sewing section. The other end of the fixed support section is connected onto the patient's interventricular septum through the fixing piece to support the heart valve prosthesis and restrict the axial movement of the heart valve prosthesis.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:瓣膜支架</p>
        <p type="p">3:自我調整覆膜支架</p>
        <p type="p">4:瓣葉提拉阻擋裝置</p>
        <p type="p">21:固定支撐段</p>
        <p type="p">213:彎曲內凹結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="752" publication-number="202625128">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625128</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102065</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抑制突波的顯示驅動電路</chinese-title>
        <english-title>DISPLAY DRIVING CIRCUIT STRUCTURE WITH SPIKE REDUCTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250205B">G09G3/20</main-classification>
        <further-classification edition="201601120250205B">G09G3/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯詠科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳嘉恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIA-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱韋達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, WEI-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁可駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, KEKO-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴玉瑄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YU-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋東壕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNG, TUNG-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種抑制突波的顯示驅動電路，包括運算放大器、切換元件及輸出電感。其中，所述的運算放大器具有第一端與反向端，其中的第一端接收一輸入訊號。切換元件之第一接點連接所述之運算放大器，切換元件具有相對設置於該第一接點的第二接點。輸出電感係電性連接於該切換元件之第二接點與一輸出節點之間，從而在該輸出節點產生輸出訊號。通過採用本發明所產生之輸出訊號驅動一顯示面板時，該輸出訊號的突波電壓係可被有效抑制並減少，從而降低顯示面板之操作溫度至少攝氏4℃，除此之外，本發明係有利於維持驅動電路相對低的電路複雜度與製程成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display driving circuit structure with spike reduction is provided, comprising an operational amplifier circuit, a switching element and an output inductor. The operational amplifier circuit includes a first terminal receiving an input signal and an inverting terminal. The switching element has a first end electrically connected with the operational amplifier circuit and a second end opposite to the first end. The output inductor is electrically connected between the second end of the switching element and an output node, where an output signal is generated and provided. By employing the generated output signal to drive a display panel, the spike voltage of the output signal can be significantly reduced, and as a result, the operating temperature of the display panel can be effectively reduced by at least 4℃. It is believed that the present invention is beneficial to maintaining both low complexity and process cost of the driver ICs.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:源極運算放大器</p>
        <p type="p">22:輸出級驅動器</p>
        <p type="p">100:顯示驅動電路</p>
        <p type="p">102:運算放大器</p>
        <p type="p">104:切換元件</p>
        <p type="p">106:輸出電感</p>
        <p type="p">VDD:電源電壓</p>
        <p type="p">GND:接地電壓</p>
        <p type="p">V&lt;sub&gt;I&lt;/sub&gt;:輸入訊號</p>
        <p type="p">V&lt;sub&gt;out&lt;/sub&gt;:輸出訊號</p>
        <p type="p">N&lt;sub&gt;1&lt;/sub&gt;:輸出節點</p>
        <p type="p">MP:P型金氧半場效電晶體</p>
        <p type="p">MN:N型金氧半場效電晶體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="753" publication-number="202625391">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625391</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102234</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有阻抗校正功能的前饋等化器之控制電路</chinese-title>
        <english-title>CONTROL CIRCUIT FOR FEED-FORWARD EQUALIZER CAPABLE OF IMPEDANCE CALIBRATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250303B">H04B1/16</main-classification>
        <further-classification edition="200601120250303B">H04B3/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯詠科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇東銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, TUNG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於一前饋等化器之控制電路，包含有一前饋等化器控制器及一阻抗控制迴路。該前饋等化器具有複數個電壓模式驅動器，其共同耦接至一輸出端。該前饋等化器控制器用來從一電流產生器接收一基礎電流，且包含有一電流數位類比轉換器及一電流鏡。該電流數位類比轉換器用來根據該基礎電流產生一參考電流。該電流鏡用來鏡射該參考電流以產生至少一第一參考電壓，並將該至少一第一參考電壓輸出至至少一第一電壓模式驅動器。該阻抗控制迴路用來根據該至少一第一參考電壓產生一第二參考電壓，並將該第二參考電壓輸出至至少一第二電壓模式驅動器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A control circuit for a feed-forward equalizer (FFE) includes an FFE controller and an impedance control loop. The FFE has a plurality of tap drivers commonly coupled to an output terminal. The FFE controller, which receives a basic current from a current generator, includes a current digital-to-analog converter (DAC) and a current mirror. The current DAC generates a reference current according to the basic current. The current mirror mirrors the reference current to generate at least one first reference voltage, and outputs the at least one first reference voltage to at least one first tap driver among the plurality of tap drivers. The impedance control loop, coupled to the FFE controller, generates a second reference voltage according to the at least one first reference voltage, and outputs the second reference voltage to at least one second tap driver among the plurality of tap drivers.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:前饋等化器</p>
        <p type="p">100:輸出電路</p>
        <p type="p">110:控制電路</p>
        <p type="p">120:前饋等化器控制器</p>
        <p type="p">130:阻抗控制迴路</p>
        <p type="p">150:電流產生器</p>
        <p type="p">122:電流數位類比轉換器</p>
        <p type="p">124:電流鏡</p>
        <p type="p">T_1~T_X:電壓模式驅動器</p>
        <p type="p">Vout:輸出訊號</p>
        <p type="p">IB:基礎電流</p>
        <p type="p">IDAC:參考電流</p>
        <p type="p">Vref1:第一參考電壓</p>
        <p type="p">Vref2:第二參考電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="754" publication-number="202624089">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624089</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102242</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具提把之紙袋結構</chinese-title>
        <english-title>HANDLE-EQUIPPED PAPER BAG STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250430B">B65D5/02</main-classification>
        <further-classification edition="200601120250430B">B65D5/46</further-classification>
        <further-classification edition="200601120250430B">B65D30/02</further-classification>
        <further-classification edition="200601120250430B">B65D30/20</further-classification>
        <further-classification edition="200601120250430B">B65D33/06</further-classification>
        <further-classification edition="200601120250430B">B65D81/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧壯興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHUANG-SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧壯興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHUANG-SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧崇誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU,TSUNG-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧柏蒼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU,PO-TSANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃柏璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種具提把之紙袋結構，其係包括袋本體以第一袋身片及第二袋身片構成，該第一袋身片設有一第一丸孔切割線，且該第一丸孔切割線相對第一袋身片形成一第一丸孔折片及一第一丸孔提把，另該第二袋身片設有一第二丸孔切割線一及第二丸孔提把，因第一丸孔折片及第二丸孔折片折合後與第一袋身片及第二袋身片呈4片層疊狀態，有效增加第一丸孔提把及第二丸孔提把之受力強度，且袋本體容置食物後不需再另外套一塑膠手提外袋，減少資源廢棄物產生，以達資源利用與環保性及使用功能性佳之功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention relates to a handle-equipped paper bag structure, comprising a bag body formed by a first bag panel and a second bag panel.The first bag panel includes a first round-hole cutting line, which defines a first round-hole foldable flap and a first round-hole handle.The second bag panel features a second round-hole cutting line and a second round-hole handle.When the first and second round-hole foldable flaps are folded and overlapped with the first and second bag panels, a four-layer stacked structure is formed.This structural design significantly enhances the load-bearing strength of the first and second round-hole handles. After the bag body is used to carry food, an additional plastic carrying bag is not needed, thereby reducing waste and achieving improved resource utilization, environmental protection, and functionality.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:袋本體</p>
        <p type="p">100:封閉段</p>
        <p type="p">101:開放段</p>
        <p type="p">110:第一丸孔切割線</p>
        <p type="p">11:第一袋身片</p>
        <p type="p">111:第一丸孔折片</p>
        <p type="p">112:第一丸孔提把</p>
        <p type="p">12:第二袋身片</p>
        <p type="p">120:第二丸孔切割線</p>
        <p type="p">121:第二丸孔折片</p>
        <p type="p">122:第二丸孔提把</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="755" publication-number="202625838">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625838</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102336</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氮化鋁燒結基板、其製造方法及電子電路用絶緣基板</chinese-title>
        <english-title>ALUMINUM NITRIDE SINTERED SUBSTRATE, ITS MANUFACTURING METHOD AND INSULATING SUBSTRATE FOR ELECTRONIC CIRCUITS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260311B">H10W70/68</main-classification>
        <further-classification edition="200601120260311B">C04B35/581</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商德山股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKUYAMA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商同和金屬技術股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOWA METALTECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本泰幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, YASUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石川巨樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIKAWA, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小山内英世</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSANAI, HIDEYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林幸司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>結城整哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUKI, SEIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提升一種使用氮化鋁燒結基板之電子電路用絶緣基板的耐部分放電性。&lt;br/&gt;作為解決手段，本發明之氮化鋁燒結基板，係在內部含有含鋯的粒子，且具有Zr/Al莫耳比為0.0017以上0.0665以下之組成，從厚度方向端部表面至至少深度10.0μm為止的區域，係在平行於厚度方向的剖面之前述含鋯的粒子之個數密度為6.0個/540μm&lt;sup&gt;2&lt;/sup&gt;以下之缺乏鋯的表層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the present invention is to provide an insulating substrate for electronic circuits that uses an aluminum nitride sintered substrate and has improved partial discharge resistance.&lt;br/&gt;As a solution, an aluminum nitride sintered substrate containing zirconium-containing particles therein, the aluminum nitride sintered substrate having a composition in which the Zr/Al molar ratio is 0.0017 or more and 0.0665 or less, and a region from an end surface in a thickness direction to a depth of at least 10.0 μm is a zirconium-deficient surface layer in which the number density of the zirconium-containing particles in a cross section parallel to the thickness direction is 6.0 particles/540 μm2 or less.</p>
      </isu-abst>
      <representative-img>
        <p type="p">4:氮化鋁燒結基板</p>
        <p type="p">5:缺乏鋯的表層</p>
        <p type="p">41:厚度方向端部表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="756" publication-number="202625050">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625050</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102394</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>會員優惠信息提供方法及裝置</chinese-title>
        <english-title>METHOD AND APPARATUS FOR PROVIDING MEMBERSHIP BENEFIT INFORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250502B">G06Q30/0207</main-classification>
        <further-classification edition="202301120250502B">G06Q10/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申在熹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, JAEHEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金湘恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HYANG EUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供的會員優惠信息提供方法由至少一個處理器執行。該方法可包括如下步驟：針對訪問與向用戶終端提供的物品配送服務相關的應用程序上的用戶賬號，判斷用戶賬號是否登錄；以及在用戶賬號未登錄的情况下，在第一頁面上一幷輸出與未訂閱會員的普通成員相對應的物品的第一信息及與訂閱會員的會員成員相對應的物品的第二信息。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for providing membership benefit information performed by at least one processor is disclosed. The method includes, determining login status of a user account accessing an application associated with a delivery service for items provided to a user terminal, and when the user account is not logged in, outputting, on a first page, first information related to the item corresponding to a non-member who is not subscribed to membership and second information related to the item corresponding to a member subscribed to membership, together.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:用戶終端</p>
        <p type="p">120:頁面</p>
        <p type="p">130:第一信息</p>
        <p type="p">140:第二信息</p>
        <p type="p">142:第一會員優惠信息</p>
        <p type="p">144:第二會員優惠信息</p>
        <p type="p">146:第三會員優惠信息</p>
        <p type="p">148:第四會員優惠信息</p>
        <p type="p">150:第一區域</p>
        <p type="p">152:與物品相關的圖像</p>
        <p type="p">160:第二區域</p>
        <p type="p">162:前往訂購按鈕</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="757" publication-number="202625842">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625842</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102509</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W72/00</main-classification>
        <further-classification edition="202601120260302B">H10W72/20</further-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
        <further-classification edition="202601120260302B">H10W20/20</further-classification>
        <further-classification edition="202601120260302B">H10W74/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝秉穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, PING-YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳志偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施應慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, YING-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置及其形成方法。在一些實施例中，半導體裝置包括在第一半導體基板上的第一互連結構，其中第一互連結構包括第一導電金屬材料和環狀結構。環狀結構可延伸至第一導電金屬材料上方或圍繞第一導電金屬材料。在一些實施例中，半導體裝置還可還包括第二導電金屬材料，並且可選擇性地包括第三導電金屬材料。環狀結構可部分地圍繞形成在第一導電金屬材料上方的焊料材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device and methods for forming the same. In some embodiments, the semiconductor device includes a first interconnect structure on a first semiconductor substrate, wherein the first interconnect structure includes a first conductive metal material and a ring structure. The ring structure may extend above the first conductive metal material or surround the first conductive metal material. In some embodiments, the semiconductor device may further include a second conductive metal material and, optionally, a third conductive metal material. The ring structure may partially surround a solder material formed above the first conductive metal material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:基板</p>
        <p type="p">104:鈍化層</p>
        <p type="p">106:介電層</p>
        <p type="p">110:凸塊下金屬結構</p>
        <p type="p">112:晶種層</p>
        <p type="p">118:第一導電金屬材料</p>
        <p type="p">124:環狀結構</p>
        <p type="p">130:焊料材料</p>
        <p type="p">140:金屬互連線</p>
        <p type="p">142:基板接合墊</p>
        <p type="p">150:互連結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="758" publication-number="202625051">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625051</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102632</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>折扣優惠提供方法及電子裝置</chinese-title>
        <english-title>METHOD AND ELECTRONIC DEVICE FOR PROVIDING DISCOUNT BENEFIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250310B">G06Q30/0207</main-classification>
        <further-classification edition="202301120250310B">G06Q30/0211</further-classification>
        <further-classification edition="202301120250310B">G06Q30/0601</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申在熹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, JAEHEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金湘恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HYANG EUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開的折扣優惠提供方法由至少一個處理器執行，折扣優惠提供方法包括如下步驟：接收用于確認訂單處理狀態的請求；響應于所接收的請求，識別是否存在折扣優惠信息；響應于識別到存在折扣優惠信息，向包括與訂單處理狀態相關的信息的第一畫面添加折扣優惠信息；以及輸出第一畫面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for providing discount benefits, performed by at least one processor, is discloses. The method comprises receiving a request to check processing status of an order, identifying whether discount benefit information is present in response to receiving the request, adding the discount benefit information to a first screen including information associated with the processing status of the order, in response to identifying the existence of the discount benefit information and outputting the first screen.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:用戶</p>
        <p type="p">110:電子裝置</p>
        <p type="p">120:訂單處理狀態畫面</p>
        <p type="p">122:表示訂單處理狀態的信息</p>
        <p type="p">124:訂購人員的位置及銷售點的位置在內的地圖</p>
        <p type="p">126:預定區域</p>
        <p type="p">126a:至少一個對象</p>
        <p type="p">128:訂單詳細信息</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="759" publication-number="202624771">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624771</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102694</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於偵測剝離的裝置及方法</chinese-title>
        <english-title>DEVICE AND METHOD FOR DETECTING DELAMINATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260223B">G01R31/28</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張文堅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, WEN-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴志軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAI, CHIH-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸湘台</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, HSIANG-TAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林偉睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEI-RAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供方法。所述方法包括：將第一電壓施加到第一測試鍵，第一測試鍵上覆於中介層且下覆於積體電路晶粒的第一內連線結構的第一部分中，第一部分與積體電路晶粒的多個凸塊所定義的開口重疊；在施加第一電壓期間，測量第一測試鍵的第一電阻；反應了第一電阻低於第一閾值，確定第一內連線結構中不存在第一剝離；以及反應了第一電阻超過第一閾值，確定第一內連線結構中存在第一剝離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method is provided. The method includes: applying a first voltage to a first test key, the first test key being positioned in a first portion of a first interconnect structure overlying an interposer and underlying an integrated circuit die, the first portion overlapping an opening defined by a plurality of bumps of the integrated circuit die; during applying the first voltage, measuring first electrical resistance of the first test key; in response to the first electrical resistance being below a first threshold value, determining that first delamination is not present in the first interconnect structure; and in response to the first electrical resistance exceeding the first threshold value, determining that first delamination is present in the first interconnect structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:方法</p>
        <p type="p">402、404、406、408、410、412、414、416、418:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="760" publication-number="202624760">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624760</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102772</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>探針卡</chinese-title>
        <english-title>PROBE CARD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">G01R1/073</main-classification>
        <further-classification edition="202001120250401B">G01R31/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李佳珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JIA ZHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭宇軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, YU-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯凱驛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, KAI-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例的探針卡包括力線、感測線、力墊、感測墊以及針狀結構。所述力墊和所述感測墊分別電性連接至所述力線和所述感測線，其中所述力墊和所述感測墊電性隔離。所述針狀結構包括力針、感測針以及絕緣層。所述力針電性連接至所述力墊。所述感測針電性連接至所述感測墊。所述絕緣層配置於所述力針和所述感測針之間並電性隔離所述力針和所述感測針。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A probe card includes a force line, a sense line, a force pad, a sense pad and a needle structure. The force pad and the sense pad are electrically connected to the force line and the sense line respectively, wherein the force pad and the sense pad are electrically isolated. The needle structure includes a force needle, a sense needle and an insulating layer. The force needle is electrically connected to the force pad. The sense needle is electrically connected to the sense pad. The insulating layer is disposed between and electrically isolates the force needle and the sense needle.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:探針卡</p>
        <p type="p">110:針狀結構</p>
        <p type="p">112a、114a、116a、118a、130a:第一表面</p>
        <p type="p">112b、114b、116b、118b、130b:第二表面</p>
        <p type="p">112:力針</p>
        <p type="p">114:感測針</p>
        <p type="p">116:絕緣層</p>
        <p type="p">118:附著層</p>
        <p type="p">120:第一佈線基底</p>
        <p type="p">122:力線</p>
        <p type="p">124:感測線</p>
        <p type="p">130:第二佈線基底</p>
        <p type="p">132:力墊</p>
        <p type="p">134:感測墊</p>
        <p type="p">136:間隙</p>
        <p type="p">140:安裝組件</p>
        <p type="p">142:夾具</p>
        <p type="p">144:間隔物</p>
        <p type="p">142a:容置空間</p>
        <p type="p">146:第一外殼元件</p>
        <p type="p">146a、148a:開口</p>
        <p type="p">148:第二外殼元件</p>
        <p type="p">150:機械連接件</p>
        <p type="p">200:半導體裝置</p>
        <p type="p">202:電性連接件</p>
        <p type="p">204:鈍化層</p>
        <p type="p">A:區域</p>
        <p type="p">D1、D2:方向</p>
        <p type="p">D&lt;sub&gt;L&lt;/sub&gt;、D&lt;sub&gt;M&lt;/sub&gt;、D&lt;sub&gt;U&lt;/sub&gt;:距離</p>
        <p type="p">L&lt;sub&gt;112&lt;/sub&gt;、L&lt;sub&gt;114&lt;/sub&gt;、L&lt;sub&gt;116&lt;/sub&gt;、L&lt;sub&gt;118&lt;/sub&gt;:總長度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="761" publication-number="202625548">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625548</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102775</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250205B">H10B12/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃仲麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHUNG-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置的製造方法，包括:形成一虛設通道結構；形成圍繞虛設通道結構的一閘極電極；形成圍繞閘極電極的一字元線；移除虛設通道結構以形成一開口；在開口中形成一閘極介電層；以及在開口中形成一通道結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of fabricating a semiconductor device, comprising: forming a dummy channel structure; forming a gate electrode surrounding the dummy channel structure; forming a word line surrounding the gate electrode; removing the dummy channel structure to form an opening; forming a gate dielectric in the opening; and forming a channel structure in the opening.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:第一介電層</p>
        <p type="p">200:第二介電層</p>
        <p type="p">300:電容器</p>
        <p type="p">400:第三介電層</p>
        <p type="p">600:襯墊層</p>
        <p type="p">702:閘極電極</p>
        <p type="p">802:字元線</p>
        <p type="p">1100:間隔物</p>
        <p type="p">1200:第五介電層</p>
        <p type="p">1400:閘極介電層</p>
        <p type="p">1500:通道結構</p>
        <p type="p">S1800:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="762" publication-number="202624936">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624936</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102809</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鍵盤裝置及檢測組件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250401B">G06F3/03</main-classification>
        <further-classification edition="200601120250401B">G06F1/16</further-classification>
        <further-classification edition="200601120250401B">H01H13/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商弘凱光電（江蘇）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弘凱光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高志强</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李致緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒純忻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明適用於光軸鍵盤技術領域，提供了一種鍵盤裝置及檢測組件，鍵盤裝置包括按照預設排布規則串連排布的n個檢測組件；第i+1個檢測組件在接收到第i個按鍵對應的第i個檢測組件發送的第i個通信數據的情況下，檢測第i+1個按鍵按壓深度數據，其中，第i個通信數據中包括第1至i個按鍵按壓深度數據；將第i+1個按鍵按壓深度數據添加至第i個通信數據中，得到第i+1個通信數據；第n個檢測組件將生成的第n個通信數據發送至處理器；處理器接收第n個通信數據並根據第n個通信數據中的第1至n個按鍵按壓深度數據中的至少一個執行回應動作。如此優化鍵盤裝置的功能以及電路設計的複雜性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">110:處理器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="763" publication-number="202625603">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625603</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102990</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構與其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D64/01</main-classification>
        <further-classification edition="202601120260302B">H10P50/00</further-classification>
        <further-classification edition="202501120260302B">H10D62/13</further-classification>
        <further-classification edition="202501120260302B">H10D62/17</further-classification>
        <further-classification edition="202501120260302B">H10D64/27</further-classification>
        <further-classification edition="202501120260302B">H10D30/01</further-classification>
        <further-classification edition="202301120260302B">H10B10/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱榮標</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, JUNG-PIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JUI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳於貝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YU-BEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">方法包括提供結構。結構包括基板；交錯的第一通道層與第一犧牲層的第一堆疊位於基板上；第一源極/汲極溝槽露出第一犧牲層的側壁；交錯的第二通道層與第二犧牲層的第二堆疊位於基板上；以及第二源極/汲極溝槽露出第二犧牲層的側壁。方法更包括進行第一蝕刻製程以選擇性移除第一犧牲層與第二犧牲層；對第一通道層而非第二通道層進行第二蝕刻製程；形成第一源極/汲極結構於第一源極/汲極溝槽中，並形成第二源極/汲極結構於第二源極/汲極溝槽中；以及形成第一閘極結構以包覆第一通道層，並形成第二閘極結構以包覆第二通道層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes providing a structure. The structure includes a substrate, a first stack of alternating first channel layers and first sacrificial layers over the substrate, a first source/drain trench exposing sidewalls of the first sacrificial layers, a second stack of alternating second channel layers and second sacrificial layers over the substrate, and a second source/drain trench exposing sidewalls of the second sacrificial layers. The method further includes performing a first etching process to selectively remove the first sacrificial layers and the second sacrificial layers, performing a second etching process to the first channel layers but not the second channel layers, forming a first source/drain feature in the first source/drain trench and a second source/drain feature in the second source/drain trench, and forming a first gate structure wrapping around the first channel layers and a second gate structure wrapping around the second channel layers.</p>
      </isu-abst>
      <representative-img>
        <p type="p">PD-1:下拉電晶體</p>
        <p type="p">PU-1:上拉電晶體</p>
        <p type="p">PG-2:穿閘電晶體</p>
        <p type="p">T1,T2:厚度</p>
        <p type="p">W1,W2:寬度</p>
        <p type="p">20:結構</p>
        <p type="p">202:基板</p>
        <p type="p">212B:基底鰭狀結構</p>
        <p type="p">214:隔離結構</p>
        <p type="p">256-3,256-4:閘極結構</p>
        <p type="p">400:靜態隨機存取記憶體單元</p>
        <p type="p">468N:n型井</p>
        <p type="p">468P:p型井</p>
        <p type="p">470:井邊界</p>
        <p type="p">480:閘極隔離結構</p>
        <p type="p">2080:通道組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="764" publication-number="202625564">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625564</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103024</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體元件</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260302B">H10B63/00</main-classification>
        <further-classification edition="202601120260302B">H10B80/00</further-classification>
        <further-classification edition="202301120260302B">H10N70/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YEN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　海光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRINH, HAI-DANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體元件包括具有高功函數材料的底部電極。高功函數材料使底部電極的功函數能夠被調整，使得半導體元件中的漏電流相較於不具有高功函數材料的半導體元件減少。由於減少漏電流，用於將半導體元件設置為低阻態的施加位元線電壓的偏壓被減少或防止，且施加位元線電壓可能對應於所需的設置電壓，使得達到低阻態所需的電壓脈衝數量少於使用低功函數材料作為底部電極時所需的數量。達到低阻態所需的減少脈衝數量增加半導體元件速度並增加整體元件可靠性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a bottom electrode that includes a high work function material. The high work function material enables the work function of the bottom electrode to be tuned such that current leakage in the semiconductor device is reduced in comparison to a semiconductor device without the high work function material. As a result of the reduced current leakage, bias of an applied bitline voltage to set a semiconductor device to a low resistance state is reduced or prevented, and the applied bitline voltage may correspond to a required set voltage, such that fewer voltage pulses will be required to achieve the low resistance state than when a low work function material is used for the bottom electrode. The reduced number of pulses needed to achieve the low resistance state increases semiconductor device speed and increases overall device reliability.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體元件</p>
        <p type="p">102:元件層</p>
        <p type="p">104:內連線層</p>
        <p type="p">106:基板</p>
        <p type="p">108:積體電路元件</p>
        <p type="p">110:介電層</p>
        <p type="p">112:接觸窗</p>
        <p type="p">114:層間介電層</p>
        <p type="p">116:蝕刻停止層</p>
        <p type="p">118a-118e、120a-120d:層</p>
        <p type="p">122:金屬化結構</p>
        <p type="p">124:內連線結構</p>
        <p type="p">126:記憶體元件</p>
        <p type="p">128:底部接觸窗</p>
        <p type="p">130:通孔</p>
        <p type="p">132:頂部接觸窗</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="765" publication-number="202625609">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625609</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103262</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體封裝件及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10D84/01</main-classification>
        <further-classification edition="202601120260302B">H10W74/00</further-classification>
        <further-classification edition="202601120260302B">H10W76/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳泓錡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HUNG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許桀豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIEN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張國欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, KUO-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>言　瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, KATHY WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李明機</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LII, MIRNG-JI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供半導體封裝件及其形成方法。半導體封裝件包括接合至封裝基板的封裝部件。封裝部件包括：半導體基板；複數個電裝置，在基板上；複數個介電層，在基板和電裝置上；第一鈍化層，在介電層上；以及密封環結構。密封環結構包括：第一環結構，在第一鈍化層中；以及第二環結構，在介電層中。在俯視圖中，第一環結構圍繞電裝置，且包括複數個彎曲部，鄰近封裝部件的第一角落。第二環結構接觸第一環結構，且在俯視圖中，第二環結構圍繞電裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor package and the method of forming are provided. The semiconductor package may include a package component bonded to a package substrate. The package component may include a semiconductor substrate, a plurality of electrical devices on the substrate, a plurality of dielectric layers over the substrate and the electrical devices, a first passivation layer on the plurality of dielectric layers, and a seal ring structure. The seal ring structure may comprise a first ring structure in the first passivation layer and a second ring structure in the plurality of dielectric layers. The first ring structure may encircle the plurality of electrical devices in a top-down view and comprise a plurality of bends adjacent a first corner of the package component in the top-down view. The second ring structure may be in contact with the first ring structure and encircle the plurality of electrical devices in the top-down view.</p>
      </isu-abst>
      <representative-img>
        <p type="p">23:封裝部件</p>
        <p type="p">24:基板</p>
        <p type="p">26:裝置</p>
        <p type="p">28:層間介電質/ILD</p>
        <p type="p">30:插塞</p>
        <p type="p">32:互連結構</p>
        <p type="p">34:導電部件</p>
        <p type="p">38:介電層</p>
        <p type="p">40:第一鈍化層</p>
        <p type="p">60:再分佈線/RDL</p>
        <p type="p">61:密封環結構</p>
        <p type="p">62:第二鈍化層</p>
        <p type="p">63:第三鈍化層</p>
        <p type="p">64:保護層</p>
        <p type="p">70:凸塊下金屬化層/UBM</p>
        <p type="p">72:連接器</p>
        <p type="p">91:開口</p>
        <p type="p">96:基板</p>
        <p type="p">97:導電墊</p>
        <p type="p">98:底部填充件</p>
        <p type="p">100:封裝件</p>
        <p type="p">30A:插塞</p>
        <p type="p">30B:插塞</p>
        <p type="p">34A:導電部件</p>
        <p type="p">34B:導電部件</p>
        <p type="p">60A:RDL</p>
        <p type="p">60B:導電部件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="766" publication-number="202625052">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625052</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103450</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>提供資訊之方法、電子裝置及記錄媒體</chinese-title>
        <english-title>METHOD OF PROVIDING INFORMATION, ELECTRONIC DEVICE AND RECORDING MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250701B">G06Q30/0207</main-classification>
        <further-classification edition="202301120250701B">G06Q30/02</further-classification>
        <further-classification edition="202301120250701B">G06Q30/0601</further-classification>
        <further-classification edition="202301120250701B">G06Q30/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯娜京</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUH, NAE KYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔英珠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, YOUNG JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金雅文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YAE EUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>具妍靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOO, YEON JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之各種實施例之藉由電子裝置而實行之提供資訊的方法可包括如下步驟：基於在第1頁面中接收到之第1用戶輸入而使第1物品包括於購物車中；確認應用於上述第1物品之折扣資訊、及可對上述第1物品追加應用之附加折扣資訊；及顯示第2頁面，該第2頁面包括上述折扣資訊、上述附加折扣資訊及表示上述第1物品已包括於購物車中之引導資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:系統</p>
        <p type="p">100:電子裝置</p>
        <p type="p">200:伺服器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="767" publication-number="202625500">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625500</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103500</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種用於LED供電的控制電路及LED供電裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250306B">H05B45/345</main-classification>
        <further-classification edition="202001120250306B">H05B45/397</further-classification>
        <further-classification edition="201601120250306B">G09G3/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商昂寶集成電路股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ON-BRIGHT INTEGRATIONS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐曉晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李萌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱力強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黎波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖俊龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">公開了一種用於發光二極體（Light Emitting Diode，LED）供電的控制電路及LED供電裝置。該控制電路包括：第一電流源模組，被配置為輸出與LED的溫度正相關的第一電流；第二電流源模組，被配置為輸出不受LED的溫度影響的第二電流；斜率電流鏡模組，連接第一電流源模組，被配置為按照第一預設比例鏡像第一電流以生成第一鏡像電流；以及，控制電流模組，連接第二電流源模組和斜率電流鏡模組，被配置為接收第二電流與第一鏡像電流，並基於第二電流和第一鏡像電流的差值電流輸出控制電流，其中，為LED供電的工作電流基於控制電流。該控制電路為LED提供了更可靠穩定的動態溫度保護。        &lt;br/&gt;&lt;b&gt;&lt;br/&gt;&lt;/b&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:控制電路</p>
        <p type="p">11:第一電流源模組</p>
        <p type="p">12:第二電流源模組</p>
        <p type="p">13:斜率電流鏡模組</p>
        <p type="p">14:控制電流模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="768" publication-number="202624690">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624690</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103599</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>檢測處理方法、電腦設備及存儲介質</chinese-title>
        <english-title>METHOD FOR PROCESSING TESTS, COMPUTER DEVICE, AND STORAGE MEDIA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250418B">G01B11/02</main-classification>
        <further-classification edition="200601120250418B">G01B11/24</further-classification>
        <further-classification edition="201701120250418B">G06T7/13</further-classification>
        <further-classification edition="201701120250418B">G06T7/174</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任春光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REN, CHUN-GUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜挺豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DU, TING-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種檢測處理方法、電腦設備及存儲介質，方法包括：利用第一拍攝設備基於第一拍攝角度拍攝待測主機板之第一圖像；確定所述第一圖像之邊緣輪廓以及所述邊緣輪廓之輪廓長度；若基於所述輪廓長度確定所述待測主機板完成研磨，則利用第二拍攝設備基於第二拍攝角度拍攝所述待測主機板之第二圖像；基於所述第二圖像，確定所述待測主機板中每個錫球之真實屬性資訊；基於所述真實屬性資訊與預設屬性資訊，確定所述每個錫球之檢測結果。利用本申請，能夠提高檢測效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application relates to a method for processing tests, a computer device, and a storage media. The method includes: capturing a first image of a motherboard under test using a first camera device according to a first shooting angle; determining an edge contour of the first image and a contour length of the edge contour; in response that the motherboard is determined to have finished grinding according to the contour length, capturing a second image of the motherboard using a second camera device according to a second shooting angle; based on the second image, determining reality attribute information of each solder ball on the motherboard; based on the reality attribute information and preset attribute information, determining a test result of each solder ball. By utilizing this application, test efficiency of the motherboard can be improved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S11-S15:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="769" publication-number="202624906">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624906</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103672</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>校準方法、電子設備及儲存介質</chinese-title>
        <english-title>CALIBRATION METHOD, ELECTRONIC DEVICE AND STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250512B">G05B19/402</main-classification>
        <further-classification edition="200601120250512B">B25J9/16</further-classification>
        <further-classification edition="200601120250512B">G05B19/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戢克建</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JI, KE-JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐才波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OU, CAI-BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉龍旺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YE, LONG-WANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及智慧製造領域，提供一種校準方法、電子設備及儲存介質。該方法包括：採集機器人的末端執行器在複數個預設位置對應的複數個第一坐標，複數個第一坐標為複數個預設位置在基坐標系上對應的坐標，基坐標系以機器人的基準點構建；根據複數個第一坐標，確定基坐標系的偏移角度；基於基坐標系的偏移角度，校準基坐標系。上述方法能夠透過校準基坐標系，能夠消除基座平面與工作臺平面之間的夾角，從而確保機器人能夠精準地執行任務。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application relates to a field of intelligent manufacturing, and provides a calibration method, an electronic device and a storage medium. The method includes: collecting a plurality of first coordinates corresponding to an end effector of a robot at a plurality of preset positions, the plurality of first coordinates corresponding to the plurality of preset positions on a base coordinate system, and the base coordinate system being constructed based on a datum point of the robot; determining an offset angle of the base coordinate system, according to the plurality of first coordinates; calibrating the base coordinate system based on the offset angle of the base coordinate system. The above method can eliminate an angle between a base plane and a work station by calibrating the base coordinate system, so as to ensure that the robot can perform a task accurately.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S301~S303:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="770" publication-number="202625863">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625863</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103988</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體封裝體及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W74/01</main-classification>
        <further-classification edition="202601120260302B">H10W72/50</further-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
        <further-classification edition="202601120260302B">H10W74/00</further-classification>
        <further-classification edition="202601120260302B">H10W72/20</further-classification>
        <further-classification edition="202601120260302B">H10W20/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭琮洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, TSUNG-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高金福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, CHIN-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾登　安蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EITAN, AMRAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊凱翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, KAI-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉晏嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YEN-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體封裝體的形成方法，包括：形成第一半導體結構，包括複數個第一金屬線於第一介電堆疊中，其中第一介電堆疊的第一上層包括無機接合層和第一含銅接觸墊，連接至第一金屬線；以及形成第二半導體結構，包括複數個第二金屬線於第二介電堆疊中，其中第二介電堆疊的第二上層包括有機接合層和第二含銅接觸墊。半導體封裝體的形成方法更包括：將第一上層與第二上層接觸，使得第一含銅接觸墊與第二含銅接觸墊對準；以及將第一半導體結構與第二半導體結構接合。無機接合層接合至有機接合層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes forming a first semiconductor structure including a first plurality of metal lines in a first dielectric stack; wherein a first upper layer of the first dielectric stack includes an inorganic bonding layer and a first copper containing contact pad to the first plurality of metal lines; and forming a second semiconductor structure including a second plurality of metal lines in a second dielectric stack, wherein a second upper layer of the second dielectric stack includes an organic bonding layer and a second copper containing contact pad. The method may further include contacting the first upper layer to the second upper layer with the first copper containing contact pad aligned to the second copper containing contact pad; and bonding the first semiconductor structure to the second semiconductor structure. In some embodiments, the inorganic bonding layer is bonded to the organic bonding layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">40:第一封裝組件</p>
        <p type="p">41:第一基板</p>
        <p type="p">44:第一介電層</p>
        <p type="p">45:第一接合層</p>
        <p type="p">46:第一導孔</p>
        <p type="p">48:第一金屬線</p>
        <p type="p">50:第一接合墊</p>
        <p type="p">55:無機接合層</p>
        <p type="p">100:第一半導體結構</p>
        <p type="p">140:第二封裝組件</p>
        <p type="p">141:第二基板</p>
        <p type="p">144:第二介電層</p>
        <p type="p">145:第二接合層</p>
        <p type="p">146:第二導孔</p>
        <p type="p">148:第二金屬線</p>
        <p type="p">150:第二接合墊</p>
        <p type="p">155:中間無機接合層</p>
        <p type="p">160:有機接合層</p>
        <p type="p">200:第二半導體結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="771" publication-number="202625610">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625610</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104015</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>封裝結構的製作方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10D84/01</main-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
        <further-classification edition="202601120260302B">H10W72/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>電子科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商珠海越芯半導體有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳先明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳苑明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃本霞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾勇志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何為</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董豔林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李路宣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開提供一種封裝結構的製作方法，包括(a)提供一銅箔；(b)在所述銅箔上電鍍形成空腔犧牲柱；(c)壓合介質材料形成介質層，所述介質層暴露所述空腔犧牲柱的端面；(d)在所述介質層上形成線路層；(e)蝕刻去除所述空腔犧牲柱，形成貫穿空腔；(f)在所述線路層上形成鍵合焊盤；(g)將元器件的背面貼裝於所述貫穿空腔內的銅箔上，引線鍵合所述元器件的端子和所述鍵合焊盤。採用這樣的製作方法，元器件直接貼裝在銅箔上，銅箔成為大面積散熱器可以快速帶走元器件運行時產生的熱量，大大提升嵌埋封裝結構的散熱性能。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">100:銅箔</p>
        <p type="p">101:保護層</p>
        <p type="p">201:介質層</p>
        <p type="p">202:金屬種子層</p>
        <p type="p">203:線路層</p>
        <p type="p">301:阻焊層</p>
        <p type="p">302:導通柱</p>
        <p type="p">303:表面處理層</p>
        <p type="p">304:鍵合焊盤</p>
        <p type="p">401:元器件</p>
        <p type="p">402:焊錫層</p>
        <p type="p">501:封裝層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="772" publication-number="202625868">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625868</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104128</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體封裝及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE AND FORMATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W74/10</main-classification>
        <further-classification edition="202601120260302B">H10W74/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王雋揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JYUN-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳旭賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSU-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳承先</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHEN-SHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧胤龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YINLUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊曜群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, YAO-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊天中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, TIEN-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳威豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種半導體封裝及其形成方法。半導體封裝包括：第一元件晶粒；第二元件晶粒，堆疊並接合於第一元件晶粒上；以及間隙填充介電質，側向環繞第二元件晶粒，並相對於第一元件晶粒而朝向第二元件晶粒局部內凹，使得在間隙填充介電質的外側壁處形成側向凹槽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor package and a formation method thereof are provided. The semiconductor package includes: a first device die; a second device die, stacked on and bonded to the first device die; and a gap fill dielectric, laterally surrounding the second device die, and locally recessed toward the second device die with respect to the first device die, such that lateral recesses are defined at outer sidewalls of the gap fill dielectric.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體封裝</p>
        <p type="p">100、116:半導體基底</p>
        <p type="p">102、118:金屬化層</p>
        <p type="p">104、120:導電特徵</p>
        <p type="p">106:電連接件</p>
        <p type="p">108:鈍化層</p>
        <p type="p">110、122:接合墊</p>
        <p type="p">112、124:絕緣層</p>
        <p type="p">114:基底穿孔</p>
        <p type="p">126:承載基底</p>
        <p type="p">128、130:接合膜</p>
        <p type="p">132:間隙填充介電質</p>
        <p type="p">134:虛設晶粒</p>
        <p type="p">136:接合層</p>
        <p type="p">BW:元件晶圓</p>
        <p type="p">LS:UV光束</p>
        <p type="p">TD:元件晶粒</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="773" publication-number="202625625">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625625</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104130</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像感測器像素及其形成方法</chinese-title>
        <english-title>IMAGE SENSOR PIXEL AND METHODS OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250422B">H10F39/12</main-classification>
        <further-classification edition="202501120250422B">H10F39/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇泊沅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, BO-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高敏峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, MIN-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江彥廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, YEN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉人誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, JEN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種影像感測器像素包括配置在半導體基板中的光感測器。為了提供隔離以減少像素間串擾並增加調製轉換函數（MTF），蝕刻停止層配置在半導體基板的第一表面上，並且與設置在第一表面上的蝕刻停止層相對的第二表面蝕刻深溝槽。蝕刻在蝕刻停止層處停止，且蝕刻深溝槽的底表面是蝕刻停止層的表面。至少一個介電層可能沉積在深溝槽的側壁和底表面上，且深溝槽的剩餘部分填充金屬或其他不透光材料。影像感測器像素包括半導體基板和配置其中的光電二極體，以及通過半導體基板並布置以提供光電二極體光學隔離的金屬阻障。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image sensor pixel includes a light sensor disposed in a semiconductor substrate. To provide isolation to reduce interpixel crosstalk and increase Modulation Transfer Function (MTF), an etch stop is disposed on a first surface of the semiconductor substrate, and a deep trench is etched from an opposite second surface to the etch stop disposed on the first surface. The etching stops at the etch stop, and a bottom surface of the etched deep trench is a surface of the etch stop. At least one dielectric layer may be deposited on a sidewall and the bottom surface of the deep trench, and the remainder of the deep trench is filled with a metal or other opaque material. An image sensor pixel includes a semiconductor substrate and a photodiode disposed therein, and a metal barrier passing through the semiconductor substrate and arranged to provide optical isolation of the photodiode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:影像感測器像素</p>
        <p type="p">12:半導體基板</p>
        <p type="p">14:第一表面、前側</p>
        <p type="p">16:第二表面、背側</p>
        <p type="p">18:影像感測元件、光感測器、光電二極體</p>
        <p type="p">20:電晶體、電子讀取裝置或子電路</p>
        <p type="p">22:閘極介電質、閘極氧化層</p>
        <p type="p">24:閘極</p>
        <p type="p">26:氧化物/氮化矽間隙壁、側壁</p>
        <p type="p">30:高介電層、介電層</p>
        <p type="p">32:氧化層、介電層</p>
        <p type="p">36:額外氧化層</p>
        <p type="p">40:蝕刻停止層</p>
        <p type="p">42:介電層、氧化層</p>
        <p type="p">44:介電層、氮化矽層</p>
        <p type="p">50:深溝槽隔離</p>
        <p type="p">54:金屬、金屬阻障</p>
        <p type="p">L:光</p>
        <p type="p">D2:深度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="774" publication-number="202625843">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625843</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104237</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W72/00</main-classification>
        <further-classification edition="202601120260302B">H10W72/00</further-classification>
        <further-classification edition="202601120260302B">H10W72/00</further-classification>
        <further-classification edition="202601120260302B">H10W72/20</further-classification>
        <further-classification edition="202601120260302B">H10W70/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張睿紳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JUI-SHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱重宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱政男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHEN-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊曜群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, YAO-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛長榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSUEH, CHANG-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體結構及其製造方法。半導體結構包括凸塊下金屬結構，凸塊下金屬結構包括一凹槽。此外，半導體結構包括球結構，位於凸塊下金屬結構的凹槽上方。另外，半導體結構包括位於凸塊下金屬結構上方且圍繞球結構的金屬間化合物結構，以及位於金屬間化合物結構上方的焊料部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure and methods for forming the same. In some embodiments, a semiconductor structure includes an under-bump metallization structure where the under-bump metallization structure includes a recess. Further, the semiconductor structure includes a ball structure is located above the recess of the under-bump metallization structure. Additionally, the semiconductor structure includes an intermetallic compound structure located above the under-bump metallization structure and surrounding the ball structure and a solder portion located above the intermetal compound structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:重分佈層(RDL)</p>
        <p type="p">103:介電層</p>
        <p type="p">104:介電層</p>
        <p type="p">105:重分佈佈線內連線</p>
        <p type="p">106:凸塊下金屬結構(UBM結構)</p>
        <p type="p">108:金屬間化合物結構(IMC結構)</p>
        <p type="p">109:接合墊</p>
        <p type="p">110:焊料材料(焊料部分)</p>
        <p type="p">111:聚醯亞胺層</p>
        <p type="p">112:球結構</p>
        <p type="p">113:矽基底</p>
        <p type="p">115:鈍化層</p>
        <p type="p">117:接合墊</p>
        <p type="p">140:凹槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="775" publication-number="202624194">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624194</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104238</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>助焊劑清潔劑組成</chinese-title>
        <english-title>FLUX CLEANER COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07C211/05</main-classification>
        <further-classification edition="200601120260302B">H05K3/26</further-classification>
        <further-classification edition="202601120260302B">H05K3/34</further-classification>
        <further-classification edition="200601120260302B">C09B57/02</further-classification>
        <further-classification edition="200601120260302B">C11D1/38</further-classification>
        <further-classification edition="200601120260302B">C09D9/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃備椿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, BARON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林文益</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭明達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, MING-DA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒　志華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZOU, ZHIHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">助焊劑清潔劑組成包括80%至99%的水；0.01%至3%的有機氮化合物；0.01%至3%的陽離子磷酸酯界面活性劑；1%至20%的非質子酮溶劑；以及0.01%至5%的偶氮香豆素衍生物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A flux cleaner composition includes water in a range from 80% to 99%, an organic nitrogen compound in a range from 0.01% to 3%, anionic phosphate surfactant in a range from 0.01% to 3%, aprotic ketone solvent in a range from 1% to 20%, and an azo-coumarin derivative in a range from 0.01% to 5%.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:中介層</p>
        <p type="p">14a:中介層下側接合墊</p>
        <p type="p">21r:助焊劑殘留物</p>
        <p type="p">110:封裝基板</p>
        <p type="p">114a:上側接合墊</p>
        <p type="p">141:第一半導體晶粒</p>
        <p type="p">142:第二半導體晶粒</p>
        <p type="p">421S:焊料接點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="776" publication-number="202624809">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624809</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104570</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學裝置及其製造方法</chinese-title>
        <english-title>OPTICAL DEVICES AND METHODS OF MANUFACTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250611B">G02B6/13</main-classification>
        <further-classification edition="200601120250611B">G02B6/122</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪嘉明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, CHIA-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施啟元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, CHI-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴文川</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAI, WEN-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃振浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHEN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提出一種製造光學裝置的方法和所形成的光學裝置，其中方法包括在晶圓周圍形成介電材料，在介電材料內形成開口，透過將半導體材料堆疊接合到介電材料來密封開口；以及使用半導體材料堆疊形成至少一個光學裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods of manufacturing optical devices and the optical devices formed are presented wherein method include forming a dielectric material around a wafer, forming an opening within the dielectric material, sealing the opening by bonding a stack of semiconductor materials to the dielectric material; and forming at least one optical component using the stack of semiconductor materials.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:晶圓</p>
        <p type="p">103:第一氧化物</p>
        <p type="p">201:熱隔離結構</p>
        <p type="p">301:第二基板</p>
        <p type="p">303:第一蝕刻停止層</p>
        <p type="p">305:第二蝕刻停止層</p>
        <p type="p">307:磊晶半導體層、第一半導體層</p>
        <p type="p">309:接合層</p>
        <p type="p">D1:第一距離</p>
        <p type="p">L1:第一長度</p>
        <p type="p">T1:第一厚度</p>
        <p type="p">T2:第二厚度</p>
        <p type="p">Tc:組合厚度</p>
        <p type="p">W1:第一寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="777" publication-number="202623971">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623971</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104672</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶圓操作裝置及監控晶圓操作裝置的方法</chinese-title>
        <english-title>WAFER HANDLING APPARATUS AND METHOD FOR MONITORING WAFER HANDLING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">B25J11/00</main-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉逸文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YI-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種晶圓操作裝置包含殼體、載入口、機械手臂、第一感測器組別以及處理單元。載入口設置在殼體的一側，並配置以接收晶圓容器，晶圓容器配置以容納至少一半導體晶圓。機械手臂設置在殼體內，並配置以將半導體晶圓移入或移出晶圓容器。機械手臂包含夾持部以及移動部。夾持部配置以夾持半導體晶圓。移動部連接夾持部，並配置以相對載入口移動夾持部。第一感測器組別設置於載入口。第一感測器組別包含至少一第一感測器。第一感測器配置以獲取夾持部之第一高度水平。處理單元訊號連接第一感測器組別。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wafer handling apparatus includes a housing, a load port, a robotic arm, a sensor group and a processing unit. The load port is mounted on a side of the housing and configured to receive a wafer container which accommodates at least one wafer. The robotic arm is disposed inside the housing and configured to transfer the wafer into or out of the wafer container. The robotic arm includes a handling portion and a moving portion. The handling portion is configured to hold the wafer. The moving portion is connected with the handling portion and configured to move the handling portion relative to the load port. The sensor group is disposed on the load port. The sensor group includes at least one first sensor configured to obtain a first height level of the handling portion. The processing unit is signally connected with the sensor group.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:晶圓操作裝置</p>
        <p type="p">110:殼體</p>
        <p type="p">120:載入口</p>
        <p type="p">130:機械手臂</p>
        <p type="p">131:夾持部</p>
        <p type="p">132:移動部</p>
        <p type="p">140:第一感測器組別</p>
        <p type="p">141:第一感測器</p>
        <p type="p">142:第二感測器</p>
        <p type="p">150:處理單元</p>
        <p type="p">200:晶圓容器</p>
        <p type="p">210:半導體晶圓</p>
        <p type="p">A-A:線段</p>
        <p type="p">SP:空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="778" publication-number="202624721">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624721</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104815</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>短波紅外檢測裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G01N21/27</main-classification>
        <further-classification edition="201401120260302B">G01N21/35</further-classification>
        <further-classification edition="200601120260302B">G01N21/88</further-classification>
        <further-classification edition="202601120260302B">H10P74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海世禹精密設備股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁猛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林海濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬仲宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孟兵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂忠訓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧升</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁家龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體晶片檢測領域的短波紅外檢測裝置，其鏡管側邊連接雷射感測器，鏡管通過液態鏡頭連接顯微鏡，顯微鏡與背光對應設置；雷射感測器檢測其與晶片表層的直線距離，液態鏡頭根據檢測到的直線距離進行對焦，背光從晶片底部打光，短波紅外光攝影機對晶片表面進行檢測。本發明中的液態鏡頭根據雷射感測器測量其到晶片表層的距離進行自主對焦，提高取像精度，採用特規短波紅外光攝影機+特製鏡管+特殊短焦距SWIR顯微鏡的組合，實現FOV：3.53mm*2.83mm，同時具有6μm景深和1.38/pixel精度，能穿透晶片表層進行高清檢測，有效解決失焦問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">201:短波紅外光攝影機</p>
        <p type="p">202:鏡管</p>
        <p type="p">203:短焦距SWIR顯微鏡</p>
        <p type="p">204:雷射感測器</p>
        <p type="p">205:背光</p>
        <p type="p">206:液態鏡頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="779" publication-number="202624735">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624735</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104860</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>外觀檢測裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G01N21/95</main-classification>
        <further-classification edition="200601120260302B">G01N21/01</further-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海世禹精密設備股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林海濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁猛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬仲宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孟兵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂忠訓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧升</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁家龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種外觀檢測裝置，包括：可見光檢查站和兩個短波紅外光檢查站，依次排列在卷帶傳輸流道側邊；卷帶傳輸流道傳輸卷帶，卷帶包括覆蓋膜、承載帶以及晶片，晶片置於承載帶內的口袋中，覆蓋膜覆蓋於承載帶上表面；可見光檢查站對卷帶進行外觀檢測，短波紅外光檢查站對晶片的表層進行外觀檢測。通過步進馬達能在移動8mm僅需100ms，整體檢查速度達到45k/h，採用短波紅外光檢查站，達到1.38μm的精度和3.53mmx2.83mm的可視範圍，實現取像時間僅1ms，滿足高速移動時取像效果不模糊；增加凸台和壓輪，向上拖住卷帶和向下壓住卷帶，讓卷帶在凸台上保持平穩的狀態，更好地確保相機成像效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:卷帶傳輸流道</p>
        <p type="p">12:可見光檢查站</p>
        <p type="p">13:短波紅外光檢查站</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="780" publication-number="202624723">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624723</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104861</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高速移動檢測系統及檢測方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120250418B">G01N21/35</main-classification>
        <further-classification edition="201401120250418B">G01N21/3563</further-classification>
        <further-classification edition="200601120250418B">G01N21/88</further-classification>
        <further-classification edition="200601120250418B">G01N21/84</further-classification>
        <further-classification edition="200601120250418B">G01N21/95</further-classification>
        <further-classification edition="200601120250418B">G01N21/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海世禹精密設備股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林海濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁猛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬仲宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂忠訓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孟兵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧升</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種涉及高速移動檢測系統及檢測方法，所述高速移動檢測系統包括：XY直線平台、加強穩固機構、Z軸模組、紅外相機及位移感測器，其中，XY直線平台上設有加強穩固機構，加強穩固機構連接Z軸模組，Z軸模組連接紅外相機，位移感測器連接Z軸模組；紅外相機通過Z軸模組進行Z軸向運動，Z軸模組通過加強穩固機構在XY直線平台上進行XY軸向運動，位移感測器通過Z軸模組檢查與卷帶的距離。本發明通過加強穩固機構確保紅外相機的穩定性，使其在高速運動時，拍照不失焦；通過位移感測器檢測紅外相機到卷帶的距離，配合Z軸模組進行補償確保位置準確，使紅外相機不失焦；選用了更快更加穩定驅動的XY直線馬達平台，能在移動3mm僅需80ms。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:XY直線平台</p>
        <p type="p">102:加強穩固機構</p>
        <p type="p">103:Z軸模組</p>
        <p type="p">104:紅外相機</p>
        <p type="p">105:位移感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="781" publication-number="202625062">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625062</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104941</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>提供資訊之方法及電子裝置</chinese-title>
        <english-title>METHOD AND ELECTRONIC DEVICE FOR PROVIDING INFORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250901B">G06Q30/0601</main-classification>
        <further-classification edition="202301120250901B">G06Q30/06</further-classification>
        <further-classification edition="202301120250901B">G06Q30/0282</further-classification>
        <further-classification edition="202301120250901B">G06Q30/0251</further-classification>
        <further-classification edition="202301120250901B">G06Q30/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明，揭示一種資訊提供方法，其包括如下步驟：確認與用戶對應之一個以上之關注物品；於一個以上之關注物品之至少一個評論中確認目標評論；及向用戶之終端提供與目標評論對應之資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">110:電子裝置</p>
        <p type="p">120:終端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="782" publication-number="202624990">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624990</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105132</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>評價設計要素之方法及包括該方法之電子裝置</chinese-title>
        <english-title>METHOD OF EVALUATING DESIGN ELEMENT AND ELECTRONIC DEVICE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250704B">G06F17/40</main-classification>
        <further-classification edition="202501120250704B">G06F11/36</further-classification>
        <further-classification edition="201301120250704B">G06F3/048</further-classification>
        <further-classification edition="202301120250704B">G06Q30/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金康賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KANG HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金相烈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SANG RYUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種電子裝置之設計要素之評價方法。設計要素之評價方法可包括如下步驟：自用戶終端獲得上述用戶終端之顯示區域中之複數個捲動頁面資訊及上述複數個捲動頁面之顯示時間資訊；確認上述複數個捲動頁面中之至少一個捲動頁面中包括之目標設計要素；將上述至少一個捲動頁面各者分割為複數個區域；及基於上述複數個區域中之至少一個區域是否包括上述目標設計要素及上述至少一個捲動頁面之顯示時間資訊，計算出上述目標設計要素之分數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S210:步驟</p>
        <p type="p">S230:步驟</p>
        <p type="p">S250:步驟</p>
        <p type="p">S270:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="783" publication-number="202624672">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624672</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105169</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>冷卻系統及使用此冷卻系統的方法</chinese-title>
        <english-title>COOLING SYSTEMS AND METHOD OF USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">F27D1/12</main-classification>
        <further-classification edition="200601120260302B">F27D9/00</further-classification>
        <further-classification edition="200601120260302B">C03B5/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿柏西　奧貝德堯沃蘭約</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABOTSI, OBED YAW WORLANYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比爾　強納森湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEALL, JONATHAN THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴特勒　布利斯派翠克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUTLER, BRYCE PATRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛格　卡洛斯愛德華多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOLGAR, CARLOS EDUARDO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>豪爾斯　傑森亞瑟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOWLES, JASON ARTHUR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米勒　艾瑞克李</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MILLER, ERIC LEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼可洛斯　艾瑞克詹姆士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NICHOLS, ERIC JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕爾默　布萊恩邁克爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PALMER, BRIAN MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供了冷卻耐火材料壁的系統和方法。系統包括至少一板，板置於從平行於耐火材料壁的外表面的一平面而測量的一板角度，板角度為非零角度。系統還包括至少一個氣源，其經配置為在至少一板與耐火材料壁的外表面之間引導一氣體。氣體經排出以保持沿著耐火材料壁的外表面的一層流，從而冷卻外表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and methods of cooling a wall of a refractory are provided herein. The system comprises at least one plate positioned at a plate angle measured from a plane parallel to an exterior surface of the wall of the refractory, the plate angle being a non-zero angle. The system further comprises at least one gas source configured to direct a gas between the at least one plate and the exterior surface of the wall of the refractory. The gas is expelled so as to maintain a laminar flow along the exterior surface of the wall of the refractory, thereby cooling the exterior surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:冷卻系統</p>
        <p type="p">207:內部熱膽</p>
        <p type="p">215:耐火材料壁</p>
        <p type="p">215a:外表面</p>
        <p type="p">215b:內表面</p>
        <p type="p">220a:第一氣源</p>
        <p type="p">220b:第二氣源</p>
        <p type="p">231:第一板</p>
        <p type="p">231a:第一邊緣</p>
        <p type="p">231b:第二邊緣</p>
        <p type="p">232:第二板</p>
        <p type="p">232a:第一邊緣</p>
        <p type="p">232b:第二邊緣</p>
        <p type="p">α&lt;sub&gt;1&lt;/sub&gt;:第一板角度</p>
        <p type="p">α&lt;sub&gt;2&lt;/sub&gt;:第二板角度</p>
        <p type="p">α&lt;sub&gt;S1&lt;/sub&gt;:第一源角度</p>
        <p type="p">α&lt;sub&gt;S2&lt;/sub&gt;:第二源角度</p>
        <p type="p">T&lt;sub&gt;W&lt;/sub&gt;:壁厚</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="784" publication-number="202624669">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624669</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105350</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>吸附器</chinese-title>
        <english-title>ADSORBER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260310B">F25J3/08</main-classification>
        <further-classification edition="200601120260310B">C01B23/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商萊寶德勒斯登責任有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEYBOLD DRESDEN GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>漢佩爾　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMPEL, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錢伯斯　東尼　威廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAMBERS, TONY WILLIAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝祥遇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種用於在低溫系統中氦氣淨化之吸附器元件，其包括：一端蓋，其待插入於一吸附器外殼中或連接至一吸附器外殼；一第一濾芯，其包括一層第一濾材，該第一濾芯連接至該端蓋且自該端蓋在一軸向方向上延伸，其中該第一濾芯形成為空心圓柱體；一第二濾芯，其包括一第二濾材，該第二濾芯連接至該端蓋且自該端蓋在該軸向方向上延伸，其中該第二濾芯具有一圓柱形形狀且與該第一濾芯嵌套。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Adsorber element for helium purification in cryogenic systems, comprising an end cap to be inserted in or connected to an adsorber housing; a first filter element comprising a layer of a first filter material connected to the end cap and extending from the end cap in an axial direction, wherein the first filter element is formed as hollow cylinder; and a second filter element comprising a second filter material connected to the end cap and extending from the end cap in the axial direction, wherein the second filter element has a cylindrical shape and is nested with the first filter element.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:吸附器</p>
        <p type="p">12:吸附器元件/匣筒</p>
        <p type="p">24:外殼</p>
        <p type="p">26:入口</p>
        <p type="p">28:出口</p>
        <p type="p">29:開口</p>
        <p type="p">30:箭頭</p>
        <p type="p">32:入口通道</p>
        <p type="p">34:中央出口通道</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="785" publication-number="202624849">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624849</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105672</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>內嵌式觸控顯示裝置及其操作方法</chinese-title>
        <english-title>IN-CELL TOUCH DISPLAY DEVICE AND OPERATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260105B">G02F1/133</main-classification>
        <further-classification edition="200601120260105B">G06F3/041</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞軒科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMTRAN TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張晏祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YENHSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種內嵌式觸控顯示裝置，其包括顯示面板、觸控電極以及蓋板。觸控電極設置於顯示面板上，且包括驅動電極以及感測電極。蓋板設置於觸控電極上。驅動電極在內嵌式觸控顯示裝置的俯視方向上相對於感測電極遠離顯示面板。本揭露另提供一種內嵌式觸控顯示裝置的操作方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An in-cell touch display device including a display panel, touch electrodes and a cover plate is provided. The touch electrodes are disposed on the display panel and include a drive electrode and a sensing electrode. The cover plate is disposed on the touch electrodes. The drive electrode is away from the display panel relative to the sensing electrode in a top view direction of the in-cell touch display device. An operating method of an in-cell touch display device is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:內嵌式觸控顯示裝置</p>
        <p type="p">100:顯示面板</p>
        <p type="p">200:觸控電極</p>
        <p type="p">300:蓋板</p>
        <p type="p">OCA、OCA1、OCA2、OCA3:黏著層</p>
        <p type="p">Rx:感測電極</p>
        <p type="p">Tx:驅動電極</p>
        <p type="p">Z:俯視方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="786" publication-number="202625447">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625447</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105675</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於視訊串流上的人工智慧推論方法及其運算裝置與邊緣裝置</chinese-title>
        <english-title>COMPUTING DEVICE, EDGE DEVICE, AND METHOD FOR ARTIFICIAL INTELLIGENCE INFERENCE ON VIDEO STREAM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120250401B">H04N21/4402</main-classification>
        <further-classification edition="201101120250401B">H04N21/43</further-classification>
        <further-classification edition="201101120250401B">H04N21/44</further-classification>
        <further-classification edition="202401120250401B">G06T3/40</further-classification>
        <further-classification edition="201901120250401B">G06N20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯詠科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱俊甯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHUN-NING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁啓銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, CHI-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝崑岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, KUN-YUEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林文祈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEN-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳金柱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIN-CHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施冠安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, GUAN-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃傢暐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIA-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳亞伶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YA-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種用於視訊串流上的人工智慧推論方法及其運算裝置與邊緣裝置。前述運算裝置包括第一處理器及第二處理器。第一處理器經配置以連續地接收主視訊串流。第二處理器配置以對主視訊串流執行縮放處理，以生成已縮放的視訊串流，及對已縮放的視訊串流的第一幀執行人工智慧推論，以生成用於主視訊串流第二幀的人工智慧推論結果，其中主視訊串流的第二幀是人工智慧推論結果生成時的時間點或生成後的時間點所對應的幀。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A computer device, an edge device, and a method for an artificial intelligence (AI) inference on a video stream are proposed. The computing device at least includes a first processor and a second processor. The first processor is configured to continuously receive a main video stream. The second processor is configured to perform scaling on the main video stream to generate a scaled video stream and to perform AI inference on a first frame of the scaled video stream to generate an AI inference result for a second frame of the main video stream, where the second frame of the main video stream is a frame corresponding to a time point when or after the AI inference result is generated.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S202~S206:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="787" publication-number="202624124">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624124</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105773</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種對環境友善退役鋰離子電池正極材料中銅、鎳、鈷、鋰的回收方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250304B">C01G3/10</main-classification>
        <further-classification edition="200601120250304B">C01G51/10</further-classification>
        <further-classification edition="200601120250304B">C01D15/02</further-classification>
        <further-classification edition="200601120250304B">B01D15/22</further-classification>
        <further-classification edition="200601120250304B">B01J43/00</further-classification>
        <further-classification edition="202301120250304B">C02F1/42</further-classification>
        <further-classification edition="202301120250304B">C02F1/52</further-classification>
        <further-classification edition="201601120250304B">H01M8/0206</further-classification>
        <further-classification edition="201001120250304B">H01M10/0525</further-classification>
        <further-classification edition="200601120250304B">C01G53/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東睿材科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃詩峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昱昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉宸宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡志宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許耿禎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明一種對環境友善退役鋰離子電池正極材料中金屬(銅、鎳、鈷、鋰)的回收方法，包含以下步驟：(a)前處理步驟，破碎退役電池以獲取正極材料，篩分並加熱處理；(b)酸溶浸漬步驟，將處理後的材料浸入硫酸和過氧化氫的混合溶液中，進行固液分離；(c)第一N型螫合樹脂萃取銅步驟，利用N型螯合樹脂提取銅；(d)第一N型螯合樹脂脫附步驟，使用硫酸脫附以獲得高純度的硫酸銅溶液；(e)沉澱分離雜質步驟，調整pH值並過濾去除雜質；(f)第二N型螯合樹脂萃取鈷、鎳步驟，使用第二N型螯合樹脂提取鈷和鎳；(g)第二N型螯合樹脂脫附步驟，使用硫酸脫附獲得高純度的硫酸鈷和硫酸鎳溶液；(h)第三P型螯合樹脂除雜步驟，通過第三P型螯合樹脂去除錳、鋁等雜質；(i)雙極膜電滲析提純步驟，利用雙極膜電滲析技術提取高純度的氫氧化鋰；藉此，高效回收鋰離子電池中的金屬，減少環境污染，促進資源的可持續利用，展現出高效、環保和經濟的優勢。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S01:前處理步驟</p>
        <p type="p">S02:酸溶浸漬步驟</p>
        <p type="p">S03:第一N型螯合樹脂萃取銅步驟</p>
        <p type="p">S04:第一N型螯合樹脂脫附步驟</p>
        <p type="p">S05:沉澱分離雜質步驟</p>
        <p type="p">S06:第二N型螯合樹脂萃取鈷、鎳步驟</p>
        <p type="p">S07:第二N型螯合樹脂脫附步驟</p>
        <p type="p">S08:第三P型螯合樹脂除雜步驟</p>
        <p type="p">S09:雙極膜電滲析提純步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="788" publication-number="202625501">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625501</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105791</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>線性恆流LED電源</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250418B">H05B45/345</main-classification>
        <further-classification edition="202001120250418B">H05B45/357</further-classification>
        <further-classification edition="202001120250418B">H05B45/395</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商昂寶集成電路股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ON-BRIGHT INTEGRATIONS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方倩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方烈義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖俊龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一種線性恆流LED電源，包括第一電容、第二電容、第一開關、第二開關、和第三開關。線性恆流LED電源的第一和第二輸出端用於耦接LED負載的兩端，第一電容的第一端經由第一二極體耦接到經整流輸入電壓並經由第三二極體耦接到第一輸出端，第一電容的第二端經由第一開關和第一電流感測電阻耦接到地，第二電容的第一端經由第二二極體耦接到經整流輸入電壓，第二電容的第二端經由第二開關和第一電流感測電阻耦接到地，第三開關耦接在第一電容的第二端和第二電容的第一端之間。通過對第一和第二電容分時恆流充電然後使第一和第二電容串聯放電，增加了LED電源的系統輸入電流的導通相位角並提高了LED電源的PF值和系統效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">300:線性恆流LED電源</p>
        <p type="p">ACIN:交流輸入電壓源</p>
        <p type="p">C1,C2:電容</p>
        <p type="p">Ccomp1,Ccomp2:補償電容</p>
        <p type="p">Co:輸出電容</p>
        <p type="p">D1,D2,D3:二極體</p>
        <p type="p">EA1,EA2:運算放大器</p>
        <p type="p">Iin:系統輸入電流</p>
        <p type="p">LED:發光二極體</p>
        <p type="p">Rcs,Rcs2:電流感測電阻</p>
        <p type="p">S1:電晶體</p>
        <p type="p">Sa,Sb,Sc:開關</p>
        <p type="p">Sa_gate,Sb_gate:控制電壓</p>
        <p type="p">Vcomp_a,Vcomp_b:輸出環路補償電壓</p>
        <p type="p">Vcs:負載電流採樣電壓</p>
        <p type="p">Vcs2:充/放電電流採樣電壓</p>
        <p type="p">Vin:經整流輸入電壓</p>
        <p type="p">Vref_a,Vref_b:基準電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="789" publication-number="202624933">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624933</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105802</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>輸入裝置及輸入模組</chinese-title>
        <english-title>INPUT DEVICE AND INPUT MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">G06F3/01</main-classification>
        <further-classification edition="200601120250602B">G06F3/041</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群光電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHICONY ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱大文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, TA-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳政大</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖韋齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種輸入裝置包括指向感應模組與輸入模組。輸入模組包括基座、擺動件、開關件及操作件。擺動件設置於基座上，擺動件可相對於基座擺動至不同傾斜角度，擺動件包括連接端與觸發端，觸發端用以連接指向感應模組。開關件設置於基座上。操作件組接於擺動件之連接端，且操作件可相對於擺動件伸縮移動以觸發開關件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An input device includes a trackpoint sensing module and an input module. The input module includes a base, a swinging member, a switch member and an operating member. The swinging member is disposed on the base, and can swing to different inclination angles relative to the base. The swinging member includes a connecting end and a trigger end, and the trigger end is used for connecting the trackpoint sensing module. The switch member is disposed on the base. The operating member is assembled at the connection end of the swinging member, and the operating member can be telescopically moved relative to the swinging member to trigger the switch member.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:指向感應模組</p>
        <p type="p">101:感測器</p>
        <p type="p">102:組裝部</p>
        <p type="p">11:基板</p>
        <p type="p">111:第一表面</p>
        <p type="p">112:第二表面</p>
        <p type="p">113:貫穿孔</p>
        <p type="p">114:組裝孔</p>
        <p type="p">12:框架</p>
        <p type="p">121:組接槽</p>
        <p type="p">122:連接柱</p>
        <p type="p">30:基座</p>
        <p type="p">40:擺動件</p>
        <p type="p">41:連接端</p>
        <p type="p">411:第一柱體</p>
        <p type="p">42:觸發端</p>
        <p type="p">43:凸緣</p>
        <p type="p">44:環狀凹槽</p>
        <p type="p">45:蓋體</p>
        <p type="p">451:開口</p>
        <p type="p">50:開關件</p>
        <p type="p">60:操作件</p>
        <p type="p">61:按壓件</p>
        <p type="p">65:軸桿</p>
        <p type="p">70:彈性圈</p>
        <p type="p">71:彈性復位件</p>
        <p type="p">73:彈性復位墊圈</p>
        <p type="p">80:固定件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="790" publication-number="202623715">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623715</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105941</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於生產飲料且特別用於釀造茶之方法以及用於實行該方法之裝置及輾磨機</chinese-title>
        <english-title>METHOD FOR PRODUCING A BEVERAGE, PREFERABLY FOR BREWING TEA, AND A DEVICE AND A MILL FOR CARRYING OUT THE METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250502B">A23F3/18</main-classification>
        <further-classification edition="200601120250502B">A23F3/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商韋吉斯斯坦納股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEINER AG WEGGIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯坦納　艾德里安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEINER, ADRIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於生產飲料且特別用於釀造茶之方法，將研磨的茶葉作為茶粉(19)或另一粉末輸送進入一釀造室(17)中，以及加入用於釀造程序的水，其中飲料的生產按以下步驟進行：&lt;br/&gt;通過缸筒(15)處的填充開口(16)進行茶粉(19)之輸送，並通過輸送管線(23)將熱水輸送到關閉的釀造室(17)中，及&lt;br/&gt;進行釀造作為第一釀造階段，&lt;br/&gt;隨後進行一暫停階段使萃取的茶飲料在釀造室(17)中放置特定的一段時間，及&lt;br/&gt;其中將釀造的飲料輸送至出口，&lt;br/&gt;在此之後接續進行至少一次第二釀造階段，重複將熱水通過輸送管線(23)輸送到釀造室(17)中，且粉末留在其中，&lt;br/&gt;並且再次允許一暫停階段使釀造的飲料在釀造室(17)中放置特定的一段停留時間，&lt;br/&gt;接著飲料同樣被輸送至出口。&lt;br/&gt;使用此釀造程序，可以以非常有效率的方式生產出非常美味的茶飲料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">With a method for producing a beverage, preferably for the brewing of tea, milled tealeaves as tea powder (19) or another powder are conveyed into a brewing chamber (17) and water for the brewing process is added, wherein the production of the beverage takes place in the following steps:&lt;br/&gt;Ø Delivery of the tea powder (19) through the filling opening (16) at the cylinder (15), and delivery of the water through the delivery line (23) into the closed brewing chamber (17), and&lt;br/&gt;Ø brewing takes place as a first brewing phase,&lt;br/&gt;Ø followed by a pause phase for the extracted tea beverage in the brewing chamber (17) for a specific period of time, and&lt;br/&gt;Ø wherein the brewed beverage is conveyed to the outlet,&lt;br/&gt;Ø this is then followed by at least one second brewing phase by the repeat delivery of hot water through the delivery line (23) into the brewing chamber (17), with the powder remaining therein,&lt;br/&gt;Ø and the brewed beverage is again allowed a pause phase for a specific dwell time in the brewing chamber (17),&lt;br/&gt;Ø and then the beverage is likewise conveyed to the outlet.&lt;br/&gt;With this brewing process, it is possible for a very tasty tea beverage to be produced in at extremely efficient manner.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:框架殼體</p>
        <p type="p">14:主軸</p>
        <p type="p">15:缸筒</p>
        <p type="p">16:填充開口</p>
        <p type="p">17:釀造室</p>
        <p type="p">18:套筒環，後套筒環</p>
        <p type="p">19:茶粉</p>
        <p type="p">22:活塞軸</p>
        <p type="p">23:輸送管線</p>
        <p type="p">25:活塞，第二活塞</p>
        <p type="p">26:活塞頭</p>
        <p type="p">30:線性驅動器</p>
        <p type="p">31:螺帽</p>
        <p type="p">32:連接元件</p>
        <p type="p">36:元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="791" publication-number="202624907">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624907</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106102</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>模組電路、製造系統及操作製造系統的方法</chinese-title>
        <english-title>MODULE CIRCUIT, MANUFACTURING SYSTEM, AND OPERATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250801B">G05B19/418</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商台積電（中國）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSMC CHINA COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱宏華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, HONGHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴志榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI, ZHIRONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張翼飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YIFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賀國平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, GUO PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">製造系統包括製程架構；及模組電路，模組電路透過複數個埠耦接至製程架構，並用以操作下列中之至少一者：基於至少一個偵測型樣，產生至少一個第一控制信號至製程架構，以控制至少一個操作製程；將來自製程架構的感測資料與至少一個臨限資料進行比較，以產生比較結果；及基於比較結果產生至少一個第二控制信號至製程架構，其中製程架構用以回應於至少一個第二控制信號來執行至少一個製程。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The system includes a process architecture; and a module circuit coupled to the process architecture through a plurality of ports and configured to operate at least one of: generating, based on at least one detection pattern, at least one first control signal to the process architecture to control at least one operation process; comparing sensing data from the process architecture with at least one threshold data to generate a comparison result; and generating, based on the comparison result, at least one second control signal to the process architecture, wherein the process architecture is configured to perform at least one first process in response to the at least one second control signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:製造系統</p>
        <p type="p">100:群集型架構</p>
        <p type="p">200:模組電路</p>
        <p type="p">300:控制裝置</p>
        <p type="p">500:互鎖電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="792" publication-number="202625754">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625754</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106602</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>大面積接合基板固定裝置及其製造方法</chinese-title>
        <english-title>LARGE AREA BONDING SUBSTRATE FIXING DEVICE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/50</main-classification>
        <further-classification edition="202601120260302B">H10P72/70</further-classification>
        <further-classification edition="200601120260302B">H02N13/00</further-classification>
        <further-classification edition="202601120260302B">H10W72/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＥＳＴ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EST, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金榮坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YOUNG GON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴載赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JAE HYUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓秉俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, BYUNG JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鍾佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, JONG WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白承浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAEK, SEUNG HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳秀學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, SU HAK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露之實施例涉及一種大面積接合基板固定裝置，本揭露之目的是藉由將多個靜電吸盤水平地接合並固定在一基底件上，以提供具有大面積靜電吸盤及優良平面度的大面積接合基板固定裝置。為此，本揭露揭露一種大面積接合基板固定裝置，包括：基底件；多個靜電吸盤，設置在基底件上並利用靜電力固定基板；及多個接合層，接合基底件及多個靜電吸盤，其中，多個靜電吸盤被沿著凹槽的週長設置，連接層被填充於凹槽內，從而將多個靜電吸盤相互接合，多個靜電吸盤分別包括陶瓷板及設置於陶瓷板上的電極層，且接合層將陶瓷板及電極層接合到基底件上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An embodiment of the present disclosure relates to a large area bonding substrate fixing device and an objective of the present disclosure is to provide a large area bonding substrate fixing device that has a large-area electrostatic chuck and has excellent flatness by horizontally bonding and fixing multiple electrostatic chucks on one base member. To this end, the present disclosure discloses a large area bonding substrate fixing device including: a base member; multiple electrostatic chucks provided on the base member and fixing a substrate using electrostatic force; and multiple bonding layers bonding the base member and the multiple electrostatic chucks to each other, wherein the multiple electrostatic chucks are provided with a concave groove along a perimeter thereof, and a joining layer is filled in the concave groove, thereby bonding the multiple electrostatic chucks to each other; and the multiple electrostatic chucks each includes a ceramic plate and an electrode layer provided on the ceramic plate, and the bonding layer bonds the ceramic plate and the electrode layer onto the base member.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:(大面積接合)基板固定裝置</p>
        <p type="p">110:基底件</p>
        <p type="p">111:冷卻管線</p>
        <p type="p">112:下區段</p>
        <p type="p">114:上區段</p>
        <p type="p">120:靜電吸盤</p>
        <p type="p">121:陶瓷板(或陶瓷燒結體)</p>
        <p type="p">122:電極層</p>
        <p type="p">124:凹槽</p>
        <p type="p">130:接合層</p>
        <p type="p">140:連接層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="793" publication-number="202625828">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625828</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106671</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260313B">H10W70/02</main-classification>
        <further-classification edition="202601120260313B">H10W70/65</further-classification>
        <further-classification edition="202601120260313B">H10D84/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周智超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, CHIH-CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱奕勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, YI-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林哲毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHE-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡慶威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIH-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體裝置包含組合半導體晶粒、中介層以及耦接於組合半導體晶粒與中介層之間的焊料凸塊，組合半導體晶粒包含在半導體基底上方的第一單元區及第二單元區，第一單元區鄰接第二單元區，第一單元區包含第一裝置部分及第一虛設部分，第二單元區包含第二裝置部分及第二虛設部分，第一虛設部分包含第一導電部件，且第二虛設部分包含物理接觸第一導電部件的第二導電部件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Semiconductor device includes a combinational semiconductor die, an interposer, and solder bumps coupled between the combinational semiconductor die and the interposer. The combinational semiconductor die includes a first unit region and a second unit region over a semiconductor substrate. The first unit region abuts the second unit region. The first unit region includes a first device portion and a first dummy portion. The second unit region includes a second device portion and a second dummy portion The first dummy portion includes a first conductive feature and the second dummy portion includes a second conductive feature in physical contact with the first conductive feature.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:組合半導體晶粒</p>
        <p type="p">102:半導體晶粒</p>
        <p type="p">110,110a,110b,110c,110d:單元區</p>
        <p type="p">110ab,110ac,110bd,110cd:拼接區</p>
        <p type="p">W1:寬度</p>
        <p type="p">W2:物理距離</p>
        <p type="p">D1,D2,D2a,D2b:尺寸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="794" publication-number="202624699">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624699</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106834</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>小型驅動及感測平衡多軸陀螺儀</chinese-title>
        <english-title>COMPACT DRIVE AND SENSE BALANCED MULTI-AXIS GYROSCOPE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260311B">G01C19/5712</main-classification>
        <further-classification edition="201201120260311B">G01C19/5747</further-classification>
        <further-classification edition="200601120260311B">G01C25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應美盛股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENSENSE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米拉尼　達米雅諾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MILANI, DAMIANO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柏提尼　羅倫索</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BERTINI, LORENZO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓋弗萊里　加科莫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAFFORELLI, GIACOMO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科羅納圖　路加</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORONATO, LUCA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種MEMS陀螺儀可包含一驅動系統，其經組態以對該MEMS陀螺儀之一裝置平面內之複數個計測塊施加一驅動運動，該複數個計測塊包含反相驅動之第一及第二平面內計測塊及經由該等平面內計測塊之移動而反相驅動之第一、第二平面外計測塊。該等平面外計測塊包含一單獨從動塊及感測塊，使得該感測塊不回應於該驅動運動而在該裝置平面中移動，而是回應於圍繞平面外軸之一角速度而基於對驅動塊施加之一科里奧利力在該裝置平面中移動。一耦合連桿連接該等感測塊，藉此使歸因於感測到之科里奧利力之該等感測塊之一反相平移同步。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A MEMS gyroscope may include a drive system configured to impart a drive motion on a plurality of proof masses within a device plane of the MEMS gyroscope, including first and second in-plane proof masses that are driven in anti-phase and first second out-of-plane proof masses that are driven in anti-phase via the movement of the in-plane proof masses. The out-of-plane proof masses include a separate driven mass and sense mass such that the sense mass does not move in the device plane in response to the drive motion but does move in the device plane in response to an angular velocity about the out-of-plane axis based on a Coriolis force imparted on the drive mass. A coupling link connects the sense masses, thereby synchronizing an anti-phase translation of the sense masses due to the sensed Coriolis force.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:平衡三軸微機電系統(MEMS)陀螺儀</p>
        <p type="p">302a:第一平面內計測塊</p>
        <p type="p">302b:第二平面內計測塊</p>
        <p type="p">308a:第一桿臂</p>
        <p type="p">308b:第二桿臂</p>
        <p type="p">310a:滑塊</p>
        <p type="p">328a:第一樞軸點</p>
        <p type="p">328b:第二樞軸點</p>
        <p type="p">330a至330d:驅動連桿組</p>
        <p type="p">332a:第三平面內計測塊</p>
        <p type="p">332b:第四平面內計測塊</p>
        <p type="p">334a:滑塊</p>
        <p type="p">334b:滑塊</p>
        <p type="p">336a:輥</p>
        <p type="p">336b:輥</p>
        <p type="p">338a:第三桿臂</p>
        <p type="p">338b:第四桿臂</p>
        <p type="p">340a:鉸鏈/第三樞軸點</p>
        <p type="p">340b:鉸鏈/第四樞軸點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="795" publication-number="202625229">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625229</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106985</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250505B">H01H13/705</main-classification>
        <further-classification edition="200601120250505B">H03K17/972</further-classification>
        <further-classification edition="200601120250505B">G06F3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群光電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHICONY ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王霆升</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TING-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳政大</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖韋齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置包括基板、按鍵、磁性組件及磁感測器。按鍵與磁性組件設置於基板上方，且按鍵可相對於基板移動於未受壓位置與受壓位置之間。磁性組件包括第一磁性件與第二磁性件，第一磁性件連接於按鍵，第二磁性件鄰近於第一磁性件。磁感測器鄰近於磁性組件。其中，按鍵於未受壓位置時，第一磁性件與第二磁性件彼此相吸，使按鍵獲得定位。按鍵由未受壓位置移動至受壓位置的過程中，第一磁性件與第二磁性件彼此遠離而產生磁場變化，磁感測器根據磁場變化產生訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device includes a substrate, a key, a magnetic assembly, and a magnetic sensor. The key and the magnetic assembly are disposed above the substrate, and the key can move between an unpressed position and a pressed position relative to the substrate. The magnetic assembly includes a first magnetic component and a second magnetic component. The first magnetic component is connected to the key, and the second magnetic component is adjacent to the first magnetic component. The magnetic sensor is adjacent to the magnetic assembly. When the key is at the unpressed position, the first magnetic member and the second magnetic member attract each other, so that the key is positioned. When the key moves from the unpressed position to the pressed position, the first magnetic member and the second magnetic member move away from each other to generate a magnetic field change, and the magnetic sensor generates a signal according to the magnetic field change.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電子裝置</p>
        <p type="p">10:基板</p>
        <p type="p">11:影像顯示區</p>
        <p type="p">20:按鍵</p>
        <p type="p">21:鍵帽</p>
        <p type="p">22:邊框</p>
        <p type="p">30:磁性組件</p>
        <p type="p">31:第一磁性件</p>
        <p type="p">32:第二磁性件</p>
        <p type="p">321:吸附區塊</p>
        <p type="p">325:鏤空部</p>
        <p type="p">40:磁感測器</p>
        <p type="p">41:電路載板</p>
        <p type="p">50:架體</p>
        <p type="p">51:容置槽</p>
        <p type="p">60:平衡組件</p>
        <p type="p">61:第一平衡桿</p>
        <p type="p">611:第一轉軸</p>
        <p type="p">612:第一側桿</p>
        <p type="p">613:第一軸桿</p>
        <p type="p">62:第二平衡桿</p>
        <p type="p">621:第二轉軸</p>
        <p type="p">622:第二側桿</p>
        <p type="p">623:第二軸桿</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="796" publication-number="202625012">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625012</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107019</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用通道注意力池化的機器學習方法</chinese-title>
        <english-title>MACHINE LEARNING METHOD USING POOLING ON CHANNEL ATTENTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250401B">G06N3/045</main-classification>
        <further-classification edition="201901120250401B">G06N20/00</further-classification>
        <further-classification edition="200601120250401B">G06N3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯詠科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃朝宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHAO-TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱彥廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, YEN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳永泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YONG-TAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種利用通道注意力池化的機器學習方法包括將第一殘差輸入輸入到第一殘差網路的卷積層以產生第一卷積輸出，及將第一卷積輸出輸入到第一池化層以產生第一池化向量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A machine learning method using pooling on channel attention includes inputting a first residual input to convolution layers of a first residual network to generate a first convolved output, and inputting the first convolved output to a first pooling layer to generate a first pooling vector.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:通道注意力池化的機器學習方法</p>
        <p type="p">202:第一殘差網路</p>
        <p type="p">204:第一殘差輸入</p>
        <p type="p">205、217:MxM卷積層</p>
        <p type="p">206、218:臨時卷積輸出</p>
        <p type="p">207、219:NxN卷積層</p>
        <p type="p">208:殘差輸出</p>
        <p type="p">209、229:加法層</p>
        <p type="p">210:第一卷積輸出</p>
        <p type="p">212:第一池化層</p>
        <p type="p">214:第一池化向量</p>
        <p type="p">216:網路輸入</p>
        <p type="p">220:第一殘差通道注意力網路</p>
        <p type="p">221:通道注意力網路</p>
        <p type="p">222:第一注意力輸入</p>
        <p type="p">223:第一全連接層</p>
        <p type="p">224:臨時全連接輸出</p>
        <p type="p">225:第二全連接層</p>
        <p type="p">226:全連接輸出</p>
        <p type="p">227:通道級乘法層</p>
        <p type="p">228:第一注意力輸出</p>
        <p type="p">230:第一殘差通道注意力輸出</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="797" publication-number="202624961">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624961</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107041</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>產生日誌資料之方法及用於該方法之電子裝置</chinese-title>
        <english-title>METHOD OF GENERATING LOG DATA AND ELECTRONIC DEVICE FOR PERFORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251028B">G06F11/30</main-classification>
        <further-classification edition="200601120251028B">G06F11/28</further-classification>
        <further-classification edition="201301120251028B">G06F3/048</further-classification>
        <further-classification edition="200601120251028B">G06F17/40</further-classification>
        <further-classification edition="202301120251028B">G06Q10/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種於電子裝置中產生日誌資料之方法。具體而言，於電子裝置中產生日誌資料之方法可包括如下步驟：確認可否顯示於用戶終端中發生變更之第1用戶介面；於第1用戶介面包括設定之構成要素之情形時，確認包括與設定之構成要素對應之節點及節點之上位等級之至少一個節點的視圖樹；及基於呼叫與第1用戶介面之可顯示與否之變更對應之第1方法的第1時點之資訊與視圖樹之資訊，產生第1日誌資料，該第1日誌資料包括與用戶終端中發生之第1事件相關之第1事件日誌資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S210:步驟</p>
        <p type="p">S220:步驟</p>
        <p type="p">S230:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="798" publication-number="202625794">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625794</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107201</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路及其形成方法</chinese-title>
        <english-title>INTEGRATED CIRCUIT AND METHODS FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260316B">H10W10/00</main-classification>
        <further-classification edition="202501120260316B">H10D30/01</further-classification>
        <further-classification edition="202501120260316B">H10D30/60</further-classification>
        <further-classification edition="202601120260316B">H10W42/60</further-classification>
        <further-classification edition="202501120260316B">H10D62/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亞庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YA-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佘銘軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHE, MING-SHIUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃俊程</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, GIN-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">形成積體電路的方法包含在複數個半導體鰭之間形成複數個半導體鰭與溝槽隔離區。該方法包含在半導體鰭的上表面與側表面上與溝槽隔離區的頂表面上形成第一介電層。該方法包含在第一介電層上形成第二介電層並透過在第二介電層上執行化學機械平坦化製程從第一介電層的頂表面去除第二介電層。第二介電層在多個後續蝕刻製程中被去除。接著在該些鰭中形成源極/汲極區。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for forming an integrated circuit includes forming a plurality of semiconductor fins and trench isolation regions between the semiconductor fins. The method includes forming a first dielectric layer on top and side surfaces of the semiconductor fins and on a top surface of the trench isolation regions. The method includes forming a second dielectric layer on the first dielectric layer and removing the second dielectric layer from a top surface of the first dielectric layer by performing a chemical mechanical planarization (CMP) process on the second dielectric layer. The second dielectric layer is removed in multiple subsequent etching processes. Formation of the source/drain regions in the fins is then performed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:積體電路</p>
        <p type="p">102:基板</p>
        <p type="p">104:半導體層</p>
        <p type="p">106:犧牲半導體層</p>
        <p type="p">112:溝槽隔離區</p>
        <p type="p">114:襯墊層(介電層)</p>
        <p type="p">116:襯墊層(介電層)</p>
        <p type="p">118:襯墊層(介電層)</p>
        <p type="p">120:淺溝槽隔離層(介電層)</p>
        <p type="p">122:半導體層</p>
        <p type="p">124:介電襯墊層(介電層)</p>
        <p type="p">126:介電層</p>
        <p type="p">127:介電屏蔽結構</p>
        <p type="p">Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="799" publication-number="202625755">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625755</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107447</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置之製造方法、半導體裝置製造用接著片、及捲繞體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260310B">H10P72/50</main-classification>
        <further-classification edition="202601120260310B">H10P54/00</further-classification>
        <further-classification edition="202601120260310B">H10W72/00</further-classification>
        <further-classification edition="200601120260310B">C09J133/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商積水化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畠井宗宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATAI, MUNEHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤原昭彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIWARA, AKIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紅林潤也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUREBAYASHI, JUNYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於：提供一種半導體裝置之製造方法，其抑制於再配線步驟時等之良率降低，提升於半導體裝置之製造等之良率。又，本發明之目的在於：提供一種半導體裝置製造用接著片，其能夠抑制於再配線步驟時等之良率降低。再者，本發明之目的在於：提供一種將該半導體裝置製造用接著片捲繞而成之捲繞體。&lt;br/&gt;本發明係一種半導體裝置之製造方法，其具有下述第1步驟、第2步驟及第3步驟。&lt;br/&gt;第1步驟：將具有包含樹脂之接著層、及金屬層之接著片積層於支持基板之步驟&lt;br/&gt;第2步驟：於上述金屬層上形成半導體再配線層之步驟&lt;br/&gt;第3步驟：去除上述支持基板及上述接著層之步驟</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="800" publication-number="202624161">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624161</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107581</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>金屬氟化物和電漿輔助原子層沉積塗層</chinese-title>
        <english-title>METAL FLUORIDE AND PLASMA ASSISTED ATOMIC LAYER DEPOSITION COATING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">C03C17/09</main-classification>
        <further-classification edition="200601120260311B">C03C17/34</further-classification>
        <further-classification edition="201501120260311B">G02B1/115</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞倫　唐納艾爾文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALLEN, DONALD ERWIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班威爾　卡拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BENWARE, KARLA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜　靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DU, JING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯塔　普拉卡許拉瑪納斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOTA, PRAKASH RAMANATH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種塗層光學組件包括：一基板，該基板包含至少一個表面；以及一原子層沉積塗層，該原子層沉積塗層沉積在該基板之該表面上，該原子層沉積塗層包含一第一層氟化鑭。該原子層沉積塗層進一步包括約10,000 ppm或更小的一碳濃度、約10,000 ppm或更小的一氧濃度及約500 ppm或更小的一硫濃度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A coated optical component including a substrate comprising at least one surface and an atomic layer deposition coating deposited on the surface of the substrate, the atomic layer deposition coating comprising a first layer of lanthanum fluoride. The atomic layer deposition further coating including a carbon concentration of about 10,000 ppm or less, an oxygen concentration of about 10,000 ppm or less, and a sulfur concentration of about 500 ppm or less.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:塗層光學組件</p>
        <p type="p">20:基板</p>
        <p type="p">22:表面</p>
        <p type="p">30:ALD塗層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="801" publication-number="202625115">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625115</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107587</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>監控設備的控制方法及控制裝置以及監控系統</chinese-title>
        <english-title>CONTROL METHOD AND CONTROL DEVICE OF MONITORING EQUIPMENT AND MONITORING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">G08B13/196</main-classification>
        <further-classification edition="202201120250602B">G06V20/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英華達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC APPLIANCES CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅家聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEI, JIA-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種監控設備的控制方法及控制裝置以及監控系統，監控設備的控制方法，包括擷取監控設備捕捉的監控畫面以及權重設置範圍，並將監控畫面劃分為陣列排布的多個子區域；根據監控畫面和權重設置範圍，為各子區域設置權重值；權重值位於權重設置範圍內；控制監控設備即時捕捉監控畫面，並即時擷取各子區域的子移動值；根據各子區域對應的子移動值和權重值，判斷監控設備的監控功率等級，並控制監控設備以監控功率等級運作。從而，可以減少監控設備在極端溫度條件下的工作時長，或避免監控設備在極端溫度條件下工作，提高監控設備的監控品質和監控設備的使用壽命。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A control method and a control device of a monitoring equipment and a monitoring system are disclosed. The control method of the monitoring equipment includes capturing a monitoring screen captured by the monitoring equipment and a weight setting range, and dividing the monitoring screen into a plurality of sub-areas arranged in an array form; setting weight values ​​for the sub-areas according to the monitoring screen and the weight setting range; wherein each of the weight values is within the weight setting range; controlling the monitoring equipment to capture the monitoring screen in real time, and capturing a sub-movement value of each of the sub-areas in real time; determining a monitoring power level of the monitoring equipment and controlling the monitoring equipment to operate at the monitoring power level. Thereby, working time of the monitoring equipment under extreme temperature conditions can be reduced or avoid the monitoring equipment from working under extreme temperature conditions, thereby improving monitoring quality of the monitoring equipment and a life of the monitoring equipment.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101~S104:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="802" publication-number="202624614">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624614</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108014</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>低溫泵</chinese-title>
        <english-title>CRYOPUMP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">F04B37/08</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾德華真空有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EDWARDS VACUUM LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達格蒂　麥可　艾瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DALGETTY, MICHAEL ERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈達德　吉娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HADDAD, JINANE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙維迪　馬特歐　法蘭西斯柯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SALVETTI, MATTEO FRANCESCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫蘭　彼得　Ｆ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORAN, PETER F.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種低溫泵，該低溫泵具有為泵提供泵抽表面之一或多個低溫板結構。藉由一製冷機冷卻該等低溫板且存在由一導電軌道形成之至少一個加熱元件，該導電軌道安裝於該等低溫板結構之至少一者之一表面上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cryopump is disclosed, the cryopump having one or more cryopanel structures providing pumping surfaces for the pump. The cryopanels are cooled by a refrigerator and there is at least one heating element formed of an electrically conductive track that is mounted on a surface of at least one of the cryopanel structures.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:第一級低溫板/第一級低溫板結構/前部陣列</p>
        <p type="p">20:第二級低溫板/第二級低溫板結構</p>
        <p type="p">22:吸附材料</p>
        <p type="p">30:製冷機</p>
        <p type="p">32:第二級</p>
        <p type="p">34:第一級</p>
        <p type="p">40:控制電路系統</p>
        <p type="p">42:加熱元件</p>
        <p type="p">44:加熱元件</p>
        <p type="p">50:入口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="803" publication-number="202625869">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625869</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108337</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體小晶片、封裝構件之製造方法及半導體小晶片之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W74/10</main-classification>
        <further-classification edition="202601120260302B">H10W72/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商Ｒａｐｉｄｕｓ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAPIDUS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大井田充</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OOIDA, MITSURU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供可以有效率地安裝複數半導體裝置之半導體小晶片(1)。半導體小晶片(1)係具備連接基板(11)，和被配置在連接基板(11)之相同主面上的第一半導體裝置(10)及第二半導體裝置(20)，該半導體小晶片(1)具備：聚合物配線層(70)，該聚合物配線層(70)具備聚合物絕緣部(81)和金屬電極部(82)，在第一半導體裝置(10)之一個主面，及第二半導體裝置(20)之一個主面，形成聚合物配線層(70)，在第二半導體裝置(20)之外周的至少一部分形成密封樹脂部(153)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體小晶片</p>
        <p type="p">11:連接基板</p>
        <p type="p">18:半導體元件</p>
        <p type="p">20:第二半導體裝置</p>
        <p type="p">20A:第一的第二半導體裝置</p>
        <p type="p">20C:第三的第二半導體裝置</p>
        <p type="p">20D:第四的第二半導體裝置</p>
        <p type="p">21:封裝零件</p>
        <p type="p">21A:第一封裝零件</p>
        <p type="p">21C:第三封裝零件</p>
        <p type="p">21D:第四封裝零件</p>
        <p type="p">24:配線層</p>
        <p type="p">32:連接凸塊部</p>
        <p type="p">34:元件電極部</p>
        <p type="p">35:凸塊部</p>
        <p type="p">60:有機聚合物層</p>
        <p type="p">70:聚合物配線層</p>
        <p type="p">71:第一聚合物配線層</p>
        <p type="p">72:第二聚合物配線層</p>
        <p type="p">74:連接基板聚合物配線層</p>
        <p type="p">81:聚合物絕緣部</p>
        <p type="p">82:金屬電極部</p>
        <p type="p">82A:金屬電極部</p>
        <p type="p">82B:金屬電極部</p>
        <p type="p">82A1:第一金屬電極部</p>
        <p type="p">82A2:第二金屬電極部</p>
        <p type="p">82B1:第一金屬電極部</p>
        <p type="p">82B2:第二金屬電極部</p>
        <p type="p">112:連接基板主面</p>
        <p type="p">150:第一密封樹脂部</p>
        <p type="p">151:第二密封樹脂部</p>
        <p type="p">153:密封樹脂部</p>
        <p type="p">211:第二主面</p>
        <p type="p">812:聚合物絕緣部</p>
        <p type="p">822:金屬電極部</p>
        <p type="p">881:焊料電極部</p>
        <p type="p">882:銅電極部</p>
        <p type="p">1003:第三方向</p>
        <p type="p">1004:第四方向</p>
        <p type="p">1010:疊層方向</p>
        <p type="p">1011:第一方向</p>
        <p type="p">1012:第二方向</p>
        <p type="p">1100:線</p>
        <p type="p">2000:半導體小晶片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="804" publication-number="202625787">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625787</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108338</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>三維半導體封裝體及三維半導體封裝體的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P95/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商Ｒａｐｉｄｕｓ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAPIDUS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大井田充</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OOIDA, MITSURU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供連接時的製程視窗廣，又能縮小連接間距的三維半導體封裝體(1)。三維半導體封裝體(1)中，具備聚合物絕緣部(81)、金屬電極部(82)、及聚合物配線層(70)；第一半導體器件(11)、第二半導體器件(20)、與第三半導體器件(40)依序層積，在第二半導體器件(20)的2個主面形成聚合物配線層(70)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:三維半導體封裝體</p>
        <p type="p">1A:三維半導體封裝體</p>
        <p type="p">11:第一半導體器件</p>
        <p type="p">12:第一基板</p>
        <p type="p">13:第一器件層</p>
        <p type="p">15:第1矽貫通導孔</p>
        <p type="p">20:第二半導體器件</p>
        <p type="p">21:第1第二半導體器件</p>
        <p type="p">22:第2基板</p>
        <p type="p">23:第2器件層</p>
        <p type="p">25:第2矽貫通導孔</p>
        <p type="p">31:第2第二半導體器件</p>
        <p type="p">32:第3基板</p>
        <p type="p">33:第3器件層</p>
        <p type="p">35:第3矽貫通導孔</p>
        <p type="p">40:第三半導體器件</p>
        <p type="p">41:第1第三半導體器件</p>
        <p type="p">42:第4基板</p>
        <p type="p">43:第4器件層</p>
        <p type="p">51:第2第三半導體器件</p>
        <p type="p">52:第5基板</p>
        <p type="p">53:第5器件層</p>
        <p type="p">70:聚合物配線層</p>
        <p type="p">71:第1聚合物配線層</p>
        <p type="p">72:第2聚合物配線層</p>
        <p type="p">73:第3聚合物配線層</p>
        <p type="p">74:第4聚合物配線層</p>
        <p type="p">75:第5聚合物配線層</p>
        <p type="p">76:第6聚合物配線層</p>
        <p type="p">81:聚合物絕緣部</p>
        <p type="p">82:金屬電極部</p>
        <p type="p">111:第1基板主面</p>
        <p type="p">112:第2基板主面</p>
        <p type="p">113:第1器件層主面</p>
        <p type="p">151:成型部</p>
        <p type="p">153:成型部主面</p>
        <p type="p">161:連接層</p>
        <p type="p">161A:連接層</p>
        <p type="p">162:電極部</p>
        <p type="p">163:絕緣部</p>
        <p type="p">165:金屬墊</p>
        <p type="p">166:絕緣樹脂部</p>
        <p type="p">167:焊接球</p>
        <p type="p">201:第二半導體器件主面</p>
        <p type="p">211:第3基板主面</p>
        <p type="p">212:第4基板主面</p>
        <p type="p">213:第2器件層主面</p>
        <p type="p">311:第5基板主面</p>
        <p type="p">312:第6基板主面</p>
        <p type="p">313:第3器件層主面</p>
        <p type="p">411:第7基板主面</p>
        <p type="p">412:第8基板主面</p>
        <p type="p">413:第4器件層主面</p>
        <p type="p">511:第9基板主面</p>
        <p type="p">512:第10基板主面</p>
        <p type="p">513:第5器件層主面</p>
        <p type="p">711:第1聚合物配線層主面</p>
        <p type="p">721:第2聚合物配線層主面</p>
        <p type="p">731:第3聚合物配線層主面</p>
        <p type="p">741:第4聚合物配線層主面</p>
        <p type="p">751:第5聚合物配線層主面</p>
        <p type="p">761:第6聚合物配線層主面</p>
        <p type="p">1003:第3方向</p>
        <p type="p">1010:層積方向</p>
        <p type="p">1011:第1方向</p>
        <p type="p">1012:第2方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="805" publication-number="202625367">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625367</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108806</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>訊號轉換器</chinese-title>
        <english-title>SIGNAL CONVERTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250806B">H03D3/02</main-classification>
        <further-classification edition="200601120250806B">H03K5/22</further-classification>
        <further-classification edition="200601120250806B">H02M7/217</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯詠科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏敬任</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, JING-REN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖育德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, YU-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">訊號轉換器包括第一電容器、第二電容器、第一開關到第四開關、以及第一回授控制電路到第四回授控制電路。第一開關和第二開關串聯耦接於參考電壓端和輸出端之間。第一開關和第二開關分別由第一回授控制訊號和第二回授控制訊號控制。第三開關和第四開關分別由第三回授控制訊號和第四回授控制訊號控制。第一回授控制電路提供第一回授控制訊號。第二回授控制電路提供第二回授控制訊號。第三回授控制電路提供第三回授控制訊號。第四回授控制電路提供第四回授控制訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A signal converter includes a first capacitor, a second capacitor, a first switch to a fourth switch, and a first feedback control circuit to a fourth feedback control circuit. The first switch and the second switch are coupled between a reference voltage end and an output end in series. The first switch and the second switch are respectively controlled by a first feedback control signal and a second feedback control signal. The third switch and a fourth switch are respectively controlled by a third feedback control signal and a fourth feedback control signal. The first feedback control circuit provides the first feedback control signal. The second feedback control circuit provides the second feedback control signal. The third feedback control circuit provides the third feedback control signal. The fourth feedback control circuit provides the fourth feedback control signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:訊號轉換器</p>
        <p type="p">C0、C1、C2、Cc3、Cc4、Cc5、Cc6:電容器</p>
        <p type="p">CS1、CS2、CS3、CS4:回授控制訊號</p>
        <p type="p">DN1、DN2、DP1、DP2:二極體</p>
        <p type="p">E0:輸出端</p>
        <p type="p">E1、E2:端點</p>
        <p type="p">FB1、FB2、FB3、FB4:回授控制電路</p>
        <p type="p">IN1、IN2:輸入端</p>
        <p type="p">MN1、MN2、MP1、MP2:電晶體</p>
        <p type="p">RFi+、RFi-:輸入訊號</p>
        <p type="p">SW1、SW2、SW3、SW4:開關</p>
        <p type="p">VOUT:輸出電壓</p>
        <p type="p">VSS:參考電壓端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="806" publication-number="202623935">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623935</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109139</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雷射加工裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120250917B">B23K26/066</main-classification>
        <further-classification edition="201401120250917B">B23K26/08</further-classification>
        <further-classification edition="201401120250917B">B23K26/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鷗爾熙製作所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORC MANUFACTURING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>船山昌彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUNAYAMA, MASAHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中澤朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAZAWA, AKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中本裕見</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMOTO, YUKEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>正田雄樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASADA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供安裝了對準機構的雷射加工裝置，可現準確度高的對準。&lt;br/&gt;[解決手段]本實施例的雷射加工裝置100包括光罩用對準機構70、工件用對準機構80，工件用對準機構80包括攝影機構82、84、86、88。攝影機構82、84、86、88的攝影機82A、84A、86A、88A由致動器82B、84B、86B、88B支撐，致動器82B、84B、86B、88B被固定於鏡筒30S。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">30B:基底部</p>
        <p type="p">80:工件用對準機構</p>
        <p type="p">82、84、86、88:攝影機構</p>
        <p type="p">82A、84A、86A、88A:攝影機</p>
        <p type="p">82B、84B、86B、88B:致動器</p>
        <p type="p">90:集塵裝置</p>
        <p type="p">92:集塵室</p>
        <p type="p">C:光軸</p>
        <p type="p">X:主掃描方向</p>
        <p type="p">Y:副掃描方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="807" publication-number="202625125">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625125</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109173</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>拼接顯示器</chinese-title>
        <english-title>TILED DISPLAY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250328B">G09F9/30</main-classification>
        <further-classification edition="200601120250328B">G09F9/33</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀宏憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHI, HONG-SIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐懿夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OU, YI-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳勇志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YUNG-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池思賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIH, SSU-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林雨潔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案揭露一種拼接顯示器，包括：複數個顯示面板，其中一拼接縫位於該些顯示面板之間。各該些顯示面板包括：多個主要畫素位於一主動區內，其中該主動區具有陣列排列的複數個第一單位區域，各該些第一單位區域聚集N個主要畫素；以及多個邊緣有效畫素位於一邊緣區內，其中該邊緣區具有陣列排列的複數個第二單位區域，各該些第二單位區域具有M個邊緣有效畫素，該邊緣區位於該主動區以及該拼接縫之間，各該些第一單位區域以及各該些第二單位區域具有一實質相同面積以及一實質相同亮度，N大於M，N與M皆為正整數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The application discloses a tiled display, which includes multiple display panels, with a tiled gap located between these display panels. Each of these display panels comprises: a plurality of primary pixels located within an active area, where the active area contains multiple first unit regions arranged in an array, and each of these first unit regions aggregates N primary pixels; and a plurality of effective edge pixels located within an edge area, where the edge area contains multiple second unit regions arranged in an array, and each of these second unit regions contains M effective edge pixels. The edge area is positioned between the active area and the tiled gap. Each of the first unit regions and second unit regions has a substantially identical area and a substantially identical brightness. N is greater than M, and both N and M are positive integers.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:拼接顯示器</p>
        <p type="p">110A與110B:顯示面板</p>
        <p type="p">111:拼接縫</p>
        <p type="p">121:主要畫素</p>
        <p type="p">131:主動區</p>
        <p type="p">141:第一單位區域</p>
        <p type="p">122:邊緣有效畫素</p>
        <p type="p">132:邊緣區</p>
        <p type="p">142:第二單位區域</p>
        <p type="p">P1、P2:像素間距</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="808" publication-number="202625429">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625429</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109221</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於氣氛控制環境的方法、電子裝置及電腦可讀取記錄媒體</chinese-title>
        <english-title>METHOD FOR CONTROLLING ENVIRONMENT BASED ON ATMOSPHERE, ELECTRONIC APPARATUS AND COMPUTER-READABLE RECORDING MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260221B">H04N7/15</main-classification>
        <further-classification edition="202201120260221B">G06V40/16</further-classification>
        <further-classification edition="201301120260221B">G10L25/63</further-classification>
        <further-classification edition="202301120260221B">G06N3/08</further-classification>
        <further-classification edition="200601120260221B">G05B15/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞軒科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMTRAN TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧宇泓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TENG, YU-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何立洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, LI-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧智中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TENG, CHIH-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基於氣氛控制環境的方法、電子裝置及電腦可讀取記錄媒體。本方法包括：收集實際空間內的至少一即時環境資訊；依據至少一即時環境資訊而獲得實際空間內多個人員的情緒資訊；統計所述人員的情緒資訊的類型而獲得多個統計參數；將所述統計參數輸入至深度學習模型，以獲得實際空間當前的氣氛狀況；以及基於氣氛狀況，控制設置在實際空間中對應的硬體設備進行運作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for controlling environment based on atmosphere, electronic apparatus and computer-readable recording medium are provided. The method includes: collecting at least one real-time environmental information in an actual space; obtaining emotional information of multiple people in the actual space based on the at least one real-time environmental information; counting types of the emotional information of these people to obtain multiple statistical parameters; inputting the statistical parameters into a deep learning model to obtain an atmosphere status of the actual space at present; and based on the atmosphere status, controlling a corresponding hardware equipment set in the actual space to operate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S205~S225:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="809" publication-number="202625330">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625330</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109875</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電動機之節能定子總成及其建構方法</chinese-title>
        <english-title>STATOR ASSEMBLY OF A MOTOR AND METHOD OF CONSTRUCTION THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250501B">H02K1/16</main-classification>
        <further-classification edition="200601120250501B">H02K3/02</further-classification>
        <further-classification edition="200601120250501B">H02K3/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鵬任</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉鶴鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳豐田</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宏亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱謙成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電動機之節能定子總成，包含一定子鐵心及一定子繞組單元。該定子繞組單元包含一銅繞組及一鋁繞組。該銅繞組通常具有一較高額定輸出功率且直接連接至電源。該鋁繞組則通常具有較低的額定輸出功率，並藉由一開關裝置連接至電源。在啟動時，該開關閉合，使電動機以兩個繞組的組合輸出功率運轉。當電動機達到設定速度後，該開關斷開，使電源僅連接至該銅繞組，從而以其額定輸出功率運轉。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A stator assembly of a motor includes a stator core and a stator winding unit. The unit includes a copper winding and an aluminum winding. The copper winding has a higher rated output power and connects directly to the power source. The aluminum winding, with lower rated output power, connects via a switching device the power source. During startup, the switch closes, combining both windings’ output powers. Once the motor reaches a set speed, the switch opens, leaving the power source connected only to the copper winding, operating at its rated output power.</p>
      </isu-abst>
      <representative-img>
        <p type="p">42:電氣控制單元</p>
        <p type="p">44:第一三相開關裝置</p>
        <p type="p">50:三相交流電源</p>
        <p type="p">320:R相第一繞組</p>
        <p type="p">322:S相第一繞組</p>
        <p type="p">324:T相第一繞組</p>
        <p type="p">340:R相第二繞組</p>
        <p type="p">342:S相第二繞組</p>
        <p type="p">344:T相第二繞組</p>
        <p type="p">440:R相第一開關裝置</p>
        <p type="p">442:S相第一開關裝置</p>
        <p type="p">444:T相第一開關裝置</p>
        <p type="p">3200:第一端</p>
        <p type="p">3220:第二端</p>
        <p type="p">3240:第三端</p>
        <p type="p">3400:第一端</p>
        <p type="p">3420:第二端</p>
        <p type="p">3440:第三端</p>
        <p type="p">A:支路</p>
        <p type="p">B:支路</p>
        <p type="p">C:支路</p>
        <p type="p">D:支路</p>
        <p type="p">E:支路</p>
        <p type="p">F:支路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="810" publication-number="202624940">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624940</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110664</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>觸控裝置及其製造方法</chinese-title>
        <english-title>TOUCH DEVICE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">G06F3/041</main-classification>
        <further-classification edition="202501120251103B">H10D89/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞軒科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMTRAN TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭霈誼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, PEI-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種觸控裝置，其包括觸控面板以及蓋板。蓋板設置於觸控面板上。蓋板遠離觸控面板的表面上包括多個微結構，多個微結構利用黃光製程以及濕式蝕刻製程形成，且多個微結構具有微米級結構或奈米級結構。本揭露另提供一種觸控裝置的製造方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A touch device including a touch panel and a cover plate is provided. The cover plate is disposed on the touch panel. A surface of the cover plate away from the touch panel includes a plurality of microstructures, the plurality of microstructures are formed by using a yellow light process and a wet etching process, and the plurality of microstructures have a micron-level structure or a nano-level structure. A manufacturing method of a touch device is also provided.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="811" publication-number="202623912">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623912</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111175</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板清洗設備及基板清洗方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">B08B11/00</main-classification>
        <further-classification edition="200601120260302B">B08B3/04</further-classification>
        <further-classification edition="200601120260302B">B08B5/00</further-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>智優科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUTEK TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>易健民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEE, JAMY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基板清洗設備及基板清洗方法，該基板清洗設備適於清洗一承載架所承載的一基板。該基板清洗設備包含一入料翻轉裝置、一清洗裝置、一乾燥裝置，及一出料翻轉裝置。該入料翻轉裝置用以翻轉該承載架以使該基板由一水平狀態翻轉至一直立狀態，該入料翻轉裝置用以沿一輸送方向將該承載架及其所承載的呈該直立狀態的該基板輸出。該清洗裝置位於該入料翻轉裝置下游用以清洗該基板。該乾燥裝置位於該清洗裝置下游用以乾燥該基板。該出料翻轉裝置位於該乾燥裝置下游用以翻轉該承載架以使該基板由該直立狀態翻轉至該水平狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:承載架</p>
        <p type="p">2:基板</p>
        <p type="p">3:入料翻轉裝置</p>
        <p type="p">4:清洗裝置</p>
        <p type="p">41:輸送機構</p>
        <p type="p">413:第二上輸送輪組</p>
        <p type="p">5:化學清洗段</p>
        <p type="p">51:第一側風刀組</p>
        <p type="p">52:浸泡區</p>
        <p type="p">53:噴灑區</p>
        <p type="p">56:第二側風刀組</p>
        <p type="p">6:水洗段</p>
        <p type="p">61:第一噴洗區</p>
        <p type="p">62:第一浸泡區</p>
        <p type="p">64:噴灑區</p>
        <p type="p">67:第二側風刀組</p>
        <p type="p">68:第二浸泡區</p>
        <p type="p">69:第二噴洗區</p>
        <p type="p">70:第三側風刀組</p>
        <p type="p">7:乾燥裝置</p>
        <p type="p">71:輸送機構</p>
        <p type="p">713:第二上輸送輪組</p>
        <p type="p">72:吹乾段</p>
        <p type="p">721:側風刀組</p>
        <p type="p">722:上風刀</p>
        <p type="p">723:側風刀</p>
        <p type="p">73:烘乾段</p>
        <p type="p">731:側風刀組</p>
        <p type="p">732:上風刀</p>
        <p type="p">733:側風刀</p>
        <p type="p">8:出料翻轉裝置</p>
        <p type="p">D:輸送方向</p>
        <p type="p">Y:左右方向</p>
        <p type="p">Z:上下方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="812" publication-number="202624026">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624026</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112377</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自行車輪圈花鼓心軸之培林萬用尺寸調節定位裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250725B">B60B27/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林春火</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林春火</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳芳池</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自行車輪圈花鼓心軸之培林萬用尺寸調節定位裝置，包含有：一花鼓，花鼓內軸設一心軸，心軸兩端設有螺紋部，在心軸兩端還螺合兩個培林，其特徵在於；該等培林依序有一外環、一內環與一扳動部，該培林內環螺設一螺孔，透過該螺孔螺合在心軸的螺紋部後，該培林可藉扳動部依螺紋旋轉沿螺紋部軸徑調至所需定位後提供定軸轉動功能，又該培林沿著安裝方向之後端還設有定位螺帽，能加以逆向對逼鎖定防止該培林鬆脫。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:花鼓</p>
        <p type="p">11:培林座位</p>
        <p type="p">111:培林座位間距</p>
        <p type="p">2:心軸</p>
        <p type="p">21:螺紋部</p>
        <p type="p">3:培林</p>
        <p type="p">31:外環</p>
        <p type="p">32:內環</p>
        <p type="p">33:扳動部</p>
        <p type="p">34:螺孔</p>
        <p type="p">4:定位螺帽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="813" publication-number="202625615">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625615</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112470</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構與其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D84/85</main-classification>
        <further-classification edition="202601120260302B">H10D84/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃少澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHAO-TSE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪昕揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, HSIN-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張晉豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JHANG, JIN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何韋德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, WEI-DE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供半導體結構的形成方法。方法包括形成隔離結構以圍繞主動區的下側部分；形成閘極堆疊以越過主動區；形成溝槽以穿過閘極堆疊；形成導電結構於溝槽中；沉積金屬材料於隔離結構的背側表面上；以及平坦化金屬材料、隔離結構、導電結構、與主動區的下側部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for forming a semiconductor structure is provided. The method includes forming an isolation structure to surround a lower portion of an active region, forming a gate stack across the active region, forming a trench through the gate stack, forming a conductive feature in the trench, depositing a metal material on a backside surface of the isolation structure, and planarizing the metal material, the isolation structure, the conductive feature, and the lower portion of the active region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">Y2-Y2:剖線</p>
        <p type="p">104L:下側鰭狀單元</p>
        <p type="p">110:隔離結構</p>
        <p type="p">119:鰭狀物間隔物層</p>
        <p type="p">122B:底部源極/汲極結構</p>
        <p type="p">122T:頂部源極/汲極結構</p>
        <p type="p">124B,124T:接點蝕刻停止層</p>
        <p type="p">126B,126T:第一層間介電層</p>
        <p type="p">140:介電層</p>
        <p type="p">142:導電結構</p>
        <p type="p">146,158:蝕刻停止層</p>
        <p type="p">148:第二層間介電層</p>
        <p type="p">150A:前側接點結構</p>
        <p type="p">152:接點襯墊</p>
        <p type="p">154:矽化物層</p>
        <p type="p">156:阻障/黏著層</p>
        <p type="p">160:第三層間介電層</p>
        <p type="p">168:內連線結構</p>
        <p type="p">169:接合介電材料</p>
        <p type="p">170:承載基板</p>
        <p type="p">174:金屬材料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="814" publication-number="202625573">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625573</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112672</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構的製造方法</chinese-title>
        <english-title>METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D1/68</main-classification>
        <further-classification edition="202601120260302B">H10P50/00</further-classification>
        <further-classification edition="202601120260302B">H10W15/00</further-classification>
        <further-classification edition="202301120260302B">H10B12/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱成偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHENG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供一種半導體結構的製造方法。將基板從其上表面朝其下表面凹陷以形成溝槽。填充半導體材料於溝槽中。形成圖案化金屬層於半導體材料上並形成圖案化硬遮罩層於圖案化金屬層上。利用圖案化金屬層和圖案化硬遮罩層作為第一蝕刻遮罩，蝕刻半導體材料的一部分，其中半導體材料的剩餘部分包括第一部分和位於第一部分下的第二部分，且第二部分比第一部分寬。形成鈍化層於第一部分的側壁上。移除鈍化層，並利用圖案化金屬層和圖案化硬遮罩層作為第二蝕刻遮罩，蝕刻剩餘部分的第二部分，從而形成半導體層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for manufacturing a semiconductor structure is provided. A substrate is recessed from an upper surface toward a lower surface to form a trench. A semiconductor material is filled in the trench. A patterned metal layer is formed on the semiconductor material and a patterned hard mask is formed on the patterned metal layer. A portion of the semiconductor material is etched by using the patterned metal layer as a mask, in which a remaining portion of the semiconductor material includes a first portion and a second portion below the first portion, and the second portion is wider than the first portion. A passivation layer is formed on a sidewall of the first portion. The passivation layer is removed and the second portion of the remaining portion of the semiconductor material is etched by using the patterned metal layer as a mask, thereby forming a semiconductor layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:基板</p>
        <p type="p">130:絕緣層</p>
        <p type="p">140:半導體材料</p>
        <p type="p">141:第一部分</p>
        <p type="p">142:第二部分</p>
        <p type="p">147:第一部分</p>
        <p type="p">148:第二部分</p>
        <p type="p">151:第二圖案化金屬層</p>
        <p type="p">152:第一圖案化金屬層</p>
        <p type="p">161:第二圖案化硬遮罩</p>
        <p type="p">162:第一圖案化硬遮罩</p>
        <p type="p">172:第一位線結構</p>
        <p type="p">180:鈍化層</p>
        <p type="p">T1:厚度</p>
        <p type="p">X:軸</p>
        <p type="p">Y:軸</p>
        <p type="p">Z:軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="815" publication-number="202625803">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625803</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113173</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有著陸墊的半導體元件及其製備方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE WITH LANDING PADS AND METHOD FOR FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W20/20</main-classification>
        <further-classification edition="202601120260302B">H10W20/44</further-classification>
        <further-classification edition="202601120260302B">H10W20/43</further-classification>
        <further-classification edition="202601120260302B">H10W20/49</further-classification>
        <further-classification edition="202601120260302B">H10W20/40</further-classification>
        <further-classification edition="202301120260302B">H10B99/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王繹綸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, I-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅嘉敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, KA-MAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種半導體元件及其製備方法。該半導體元件包括一基板；一著陸墊，位於該基板之上；以及一電極層，位於該著陸墊上。該電極層的一底表面實質上平坦。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate; a landing pad positioned over the substrate; and an electrode layer positioned on the landing pad. A bottom surface of the electrode layer is substantially flat.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1A:半導體元件</p>
        <p type="p">101:基板</p>
        <p type="p">103:隔離層</p>
        <p type="p">105a:共用源極區域</p>
        <p type="p">105b:汲極區域</p>
        <p type="p">107:底部絕緣層</p>
        <p type="p">109:分隔層</p>
        <p type="p">210:第一間隔結構</p>
        <p type="p">211:第一內部間隔物</p>
        <p type="p">215:第一外部間隔物</p>
        <p type="p">219:氣隙</p>
        <p type="p">220:第二間隔結構</p>
        <p type="p">221:第二內部間隔物</p>
        <p type="p">225:第二外部間隔物</p>
        <p type="p">229:氣隙</p>
        <p type="p">301:著陸墊</p>
        <p type="p">301TS:頂表面</p>
        <p type="p">310:單元接觸結構</p>
        <p type="p">311:底部單元接觸</p>
        <p type="p">313:頂部單元接觸</p>
        <p type="p">330:電極層</p>
        <p type="p">330BS:底表面</p>
        <p type="p">410:頂部介電層</p>
        <p type="p">420:填充層</p>
        <p type="p">510:字元線結構</p>
        <p type="p">520:位元線結構</p>
        <p type="p">521:位元線底部導電層</p>
        <p type="p">523:位元線頂部導電層</p>
        <p type="p">525:位元線覆蓋層</p>
        <p type="p">527:位元線接觸</p>
        <p type="p">A-A':線</p>
        <p type="p">B-B':線</p>
        <p type="p">CY1:空腔</p>
        <p type="p">OP4:加寬開口</p>
        <p type="p">OP5:開口</p>
        <p type="p">S1:第一側</p>
        <p type="p">S2:第二側</p>
        <p type="p">VY1:谷</p>
        <p type="p">Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="816" publication-number="202624670">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624670</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113295</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>反應裝置</chinese-title>
        <english-title>REACTION APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260310B">F27B9/30</main-classification>
        <further-classification edition="200601120260310B">F27B9/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本製鋼所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE JAPAN STEEL WORKS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>植田直樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEDA, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古木賢一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUKI, KENICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, SATORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井上茂樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOUE, SHIGEKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">反應裝置係具備：本體部，係從一端側延伸至另一端側；反應爐，為複數個筒狀的孔，且以原料可通過之方式設置於本體部的一端側至另一端側；連接部，為通路，且將鄰接的兩個反應爐以原料可通過之方式連接；螺桿，係可旋轉地支撐在反應爐的一端側以及另一端側，藉此搬送原料；驅動部，係在一端側中驅動螺桿；溫度控制部，係加熱本體部；固定支撐部，係在一端側中將本體部固定並支撐於設置面；以及可動支撐部，係在另一端側中以可於本體部的延伸方向位移之方式將本體部支撐於設置面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:反應裝置</p>
        <p type="p">100:本體部</p>
        <p type="p">101:原料接收口</p>
        <p type="p">102:送出口</p>
        <p type="p">103:被支撐部</p>
        <p type="p">110:反應爐</p>
        <p type="p">110A:第一反應爐</p>
        <p type="p">110B:第二反應爐</p>
        <p type="p">120:連接部</p>
        <p type="p">130A:第一螺桿</p>
        <p type="p">130B:第二螺桿</p>
        <p type="p">140:驅動部</p>
        <p type="p">150:溫度控制部</p>
        <p type="p">160:固定支撐部</p>
        <p type="p">161:固定盤</p>
        <p type="p">170:可動支撐部</p>
        <p type="p">171:車輪部</p>
        <p type="p">180:架台</p>
        <p type="p">II:剖面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="817" publication-number="202625874">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625874</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113595</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及形成方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHODS OF FORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W76/134</main-classification>
        <further-classification edition="202601120260302B">H10W74/10</further-classification>
        <further-classification edition="200601120260302B">B81B7/02</further-classification>
        <further-classification edition="202601120260302B">H10W10/20</further-classification>
        <further-classification edition="202601120260302B">H10D84/01</further-classification>
        <further-classification edition="202601120260302B">H10W72/50</further-classification>
        <further-classification edition="202601120260302B">H10P74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張貴松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, KUEI-SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在晶圓上製造包括微機電系統（MEMS）裝置的產品晶粒與一或多個製程控制監控（PCM）晶粒。控制晶圓上的一或多個PCM晶粒的空腔周圍的密封結構的寬度，以使PCM晶粒的空腔比產品晶粒的空腔更容易受到氣體洩漏的影響。密封結構的寬度使得能夠在第一時間和第二時間之間測量PCM晶粒的空腔壓力的變化。空腔壓力的變化可導致PCM晶粒的品質因數發生比產品晶粒更大的變化，使PCM晶粒的洩漏更容易被檢測到，而不會使產品晶粒受到破壞性的應力。密封結構可有多種設計。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Product dies that include micro-electromechanical-system (MEMS) devices are manufactured on a wafer along with one or more process control monitoring (PCM) dies. The width of a seal structure around a cavity in the one or more PCM dies on the wafer is controlled so that the cavities of the PCM dies are more susceptible to gas leakage than the cavities of the product dies. The width of the seal structure enables measurement of a change in the cavity pressure of a PCM die to be performed between a first time T0 and a second time T1.The change in cavity pressure may cause the quality factor (Q) of the PCM die to change by a greater amount than the product dies, thereby enabling leakage to be more easily detectable in the PCM dies without subjecting the product dies to damaging levels of stress. The seal structure may have various designs.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">102:裝置晶圓</p>
        <p type="p">104:內連線層</p>
        <p type="p">106:金屬化結構</p>
        <p type="p">108:內連線結構</p>
        <p type="p">110:測試墊</p>
        <p type="p">112:半導體層</p>
        <p type="p">114:接點結構</p>
        <p type="p">116:MEMS結構</p>
        <p type="p">118:頂蓋晶圓</p>
        <p type="p">120:第一接合層</p>
        <p type="p">122:第二接合層</p>
        <p type="p">124:接合結構</p>
        <p type="p">126:空腔</p>
        <p type="p">A-A':線</p>
        <p type="p">x、z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="818" publication-number="202624784">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624784</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113752</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>通用序列匯流排C型連接器晶片、測試系統、以及通用序列匯流排C型連接器晶片的校正方法</chinese-title>
        <english-title>UNIVERSAL SERIAL BUS TYPE-C CONNECTER CHIP, TEST SYSTEM AND CALIBRATION METHOD OF UNIVERSAL SERIAL BUS TYPE-C CONNECTER CHIP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120250501B">G01R31/44</main-classification>
        <further-classification edition="200601120250501B">G06F13/38</further-classification>
        <further-classification edition="200601120250501B">G06F11/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏新春</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIA, XINCHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉騰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, TENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種通用序列匯流排C型（簡稱USB-C）連接器晶片、測試系統、以及該USB-C連接器晶片的校正方法。該USB-C連接器晶片包含該判斷電路以及一校正控制電路，其中該判斷電路是用來判斷該USB-C連接器晶片的偵測腳位上的偵測電壓是否達到閾值電壓。在第一校正階段中，該校正控制電路將該偵測電壓設定至第一直流位準，以取得該閾值電壓的第一校正值。在第二校正階段中，該校正控制電路將該偵測電壓設定至第二直流位準，以取得該閾值電壓的第二校正值。尤其，該校正控制電路依據該第一校正值以及該第二校正值決定該閾值電壓的最終校正值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A universal serial bus type-C (USB-C) connecter chip, a test system and a calibration method of the USB-C connecter chip are provided. The USB-C connecter chip includes the determination circuit and a calibration control circuit, wherein the determination circuit is configured to determine whether a detection voltage on a detection pin of the USB-C connecter chip reaches a threshold voltage. In a first calibration phase, the calibration control circuit sets the detection voltage to a first direct current (DC) level to obtain a first calibration value of the threshold voltage. In a second calibration phase, the calibration control circuit sets the detection voltage to a second DC level to obtain a second calibration value of the threshold voltage. More particularly, the calibration control circuit determines a final calibration value of the threshold voltage according to the first calibration value and the second calibration value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:測試系統</p>
        <p type="p">20:測試機台</p>
        <p type="p">200:測試板</p>
        <p type="p">210:測試電路</p>
        <p type="p">220:USB-C連接器晶片</p>
        <p type="p">221:校正控制電路</p>
        <p type="p">221P:處理電路</p>
        <p type="p">221M:儲存裝置</p>
        <p type="p">221C:程式碼</p>
        <p type="p">222:判斷電路</p>
        <p type="p">230:數位至類比轉換器電路</p>
        <p type="p">V&lt;sub&gt;CCPIN&lt;/sub&gt;:偵測電壓</p>
        <p type="p">V&lt;sub&gt;TH&lt;/sub&gt;:閾值電壓</p>
        <p type="p">D&lt;sub&gt;COMP&lt;/sub&gt;:比較訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="819" publication-number="202625585">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625585</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114054</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置結構及其形成方法</chinese-title>
        <english-title>STRUCTURES OF SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250925B">H10D30/62</main-classification>
        <further-classification edition="202501120250925B">H10D30/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　秉順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, PENG-SOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙皇麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAO, HUANG-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林斌彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PINYEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容係針對一半導體裝置的一結構以及形成該結構的一方法。該結構可包括在一基體上之一閘極全環繞式場效電晶體(GAAFET)。該GAAFET可包括通道層之一堆疊以及通道層上之一遮罩層。該GAAFET可進一步包括一閘極結構，該閘極結構具有環繞該等通道層中之各者及該遮罩層的閘極電極。該閘極結構可進一步包括在該等閘極電極之間的一阻障層。GAAFET可進一步包括一閘極接觸通孔，該閘極接觸通孔穿過遮罩層來接觸該阻障層之在遮罩層與該等通道層之堆疊間的一部分。在形成閘極接觸通孔期間，阻障層之存在可防止環繞通道層中之各者的閘極電極之氧化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure is directed to a structure of a semiconductor device and a method of forming the structure. The structure can include a gate-all-around field effect transistor (GAAFET) on a substrate. The GAAFET can include a stack of channel layers and a mask layer on the channel layers. The GAAFET can further include a gate structure with gate electrodes surrounding each of the channel layers and the mask layer. The gate structure can further include a barrier layer between the gate electrodes. The GAAFET can further include a gate contact via through the mask layer in contact with a portion of the barrier layer between the mask layer and the stack of channel layers. During the formation of the gate contact via, the presence of the barrier layer can prevent an oxidation of the gate electrodes surrounding each of the channel layers.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:基體</p>
        <p type="p">110:鰭片結構</p>
        <p type="p">115:閘極結構</p>
        <p type="p">115a:介面介電層</p>
        <p type="p">115b:閘極介電層</p>
        <p type="p">115c:閘極電極</p>
        <p type="p">115d:阻障層</p>
        <p type="p">115ct:閘極電極的下部部分</p>
        <p type="p">120:奈米片層，NS層</p>
        <p type="p">125:S/D磊晶結構</p>
        <p type="p">130:內間隔件結構</p>
        <p type="p">135:閘極間隔件</p>
        <p type="p">140:遮罩層，頂部HM</p>
        <p type="p">152:介電層</p>
        <p type="p">165:層間介電層，ILD層</p>
        <p type="p">1367:閘極接觸通孔</p>
        <p type="p">C-C’:線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="820" publication-number="202624730">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624730</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114103</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多方位照明及影像檢測系統及方法</chinese-title>
        <english-title>MULTI-AZIMUTH ILLUMINATION AND IMAGING INSPECTION SYSTEM AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">G01N21/88</main-classification>
        <further-classification edition="200601120260309B">G01N21/95</further-classification>
        <further-classification edition="200601120260309B">G02B27/09</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>懷特席德　布萊特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WHITESIDE, BRET</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃崇元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHONGYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許　志偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, ZHIWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桂貫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUI, GUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙　國衡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, GUOHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種檢測系統及方法。該檢測系統可包含經組態以通信地耦合至一光學子系統之一控制器。該控制器可包含一或多個處理器，該一或多個處理器經組態以執行程式指令以引起該一或多個處理器：引導一載物台使用一光束整形通道之一第一組態執行一樣本之一第一掃描，其中該第一組態控制如投影至該樣本上之一照明光束之一光束輪廓之一定向；接收與該第一掃描相關聯之第一掃描資料；引導該載物台使用該光束整形通道之一第二組態執行一第二掃描；接收與該第二掃描相關聯之第二掃描資料；及基於來自至少該等第一及第二掃描之掃描資料來識別該樣本上之一或多個缺陷。該載物台可包含一X-Y θ載物台。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An inspection system and method are disclosed. The inspection system may include a controller configured to be communicatively coupled to an optical sub-system. The controller may include one or more processors configured to execute program instructions to cause the one or more processors to direct a stage to perform a first scanning of a sample using a first configuration of a beam-shaping channel, where the first configuration controls an orientation of a beam profile of an illumination beam as projected onto the sample; receive first scan data associated with the first scanning; direct the stage to perform a second scanning using a second configuration of the beam-shaping channel; receive second scan data associated with the second scanning; and identify one or more defects on the sample based on scan data from at least the first and second scans. The stage may include an X-Y θ stage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">104:樣本</p>
        <p type="p">106:照明子系統</p>
        <p type="p">108:照明光束</p>
        <p type="p">130:光束整形通道</p>
        <p type="p">306:繞射光學元件(DOE)</p>
        <p type="p">308B:光束輪廓</p>
        <p type="p">610:致動器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="821" publication-number="202623744">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623744</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114778</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>擦窗機</chinese-title>
        <english-title>WINDOW CLEANING MACHINE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250624B">A47L1/02</main-classification>
        <further-classification edition="200601120250624B">A47L25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>好樣科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOBOT TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾敏智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, MIN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳巧欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIAO-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種擦窗機，用於清除板件上的微粒。該擦窗機包括：一機座；一清潔裝置，設於該機座；一噴灑模組，設於該機座；及一外殼，覆蓋於該機座，用以容置該噴灑模組。其中，該外殼包含殼本體、儲液箱及封蓋，該殼本體界定出該儲液箱，該封蓋覆蓋該儲液箱以形成一容置空間用以儲存清潔液。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A window cleaning machine is provided for cleaning particles on panels. The window cleaning machine includes: a base; a cleaning device located on the base; a spray module located on the base; and a shell covering the base to accommodate the spray module. The shell includes a shell body, a liquid storage tank and a cover. The shell body defines the liquid storage tank, and the cover covers the liquid storage tank to form a receiving space for storing cleaning fluid.</p>
      </isu-abst>
      <representative-img>
        <p type="p">540:外殼</p>
        <p type="p">541:殼本體</p>
        <p type="p">542:儲液箱</p>
        <p type="p">545:開口部</p>
        <p type="p">550:噴灑模組</p>
        <p type="p">551:輸送管</p>
        <p type="p">552:噴灑單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="822" publication-number="202625184">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625184</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114786</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體裝置及其製造方法</chinese-title>
        <english-title>MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250801B">G11C11/4074</main-classification>
        <further-classification edition="202301120250801B">H10B10/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>粘逸昕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIEN, YI-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIH-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤原英弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIWARA, HIDEHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳炎輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN-HUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體裝置包括具有複數個記憶體單元的記憶體陣列及連接至複數個記憶體單元的核心電壓分配網路。各記憶體單元包括位於主動區上方的導電層及透過第一通孔連接至位於主動區上方的導電層的第一導電層。核心電壓分配網路包括第二導電層，該第二導電層包括透過第二通孔連接至第一導電層的第二導電層島及透過第三通孔連接至第二導電層島的第三導電層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory device includes a memory array having a plurality of memory cells and a core voltage distribution network connected to the plurality of memory cells. Each of the plurality of memory cells includes a conductive layer over an active area and a first conductive layer connected by a first via to the conductive layer over the active area. The core voltage distribution network includes a second conductive layer that includes a second conductive layer island connected by a second via to the first conductive layer and a third conductive layer connected by a third via to the second conductive layer island.</p>
      </isu-abst>
      <representative-img>
        <p type="p">230:記憶體陣列</p>
        <p type="p">232:記憶體單元</p>
        <p type="p">234a,234b,234c:電源電壓線</p>
        <p type="p">236a,236b:行</p>
        <p type="p">238:列</p>
        <p type="p">240:電壓線</p>
        <p type="p">242:通孔</p>
        <p type="p">M0,M1:金屬層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="823" publication-number="202625190">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625190</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114957</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於記憶體裝置之驗證及讀取控制技術</chinese-title>
        <english-title>VERIFY AND READ CONTROL TECHNIQUES FOR MEMORY DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">G11C16/10</main-classification>
        <further-classification edition="200601120251201B">G11C16/34</further-classification>
        <further-classification edition="200601120251201B">G11C16/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商晟碟科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANDISK TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡　成慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, CHENGQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文　銅一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOON, DONG-IL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　亨利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIN, HENRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">記憶體裝置包括一記憶體區塊，該記憶體區塊包括配置在字線中的記憶體單元及具有變化直徑的記憶體孔。該等字線基於記憶體孔直徑來被分組為第一群組及第二群組。電路系統經組態以判定經選擇字線係在該第一群組中抑或在該第二群組中。回應於該經選擇字線係在該第一區中，該電路系統經組態以使用參考電壓之一第一集合來執行一記憶體操作。回應於該經選擇字線係在該第二群組中，該電路系統經組態以使用參考電壓之一第二集合來執行該記憶體操作。參考電壓之該第一集合及參考電壓之該第二集合對於複數個資料狀態不同，且對於處於一最高臨限電壓範圍的至少一個資料狀態相似。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The memory device includes a memory block that includes memory cells that are arranged in word lines and memory holes with varying diameters. The word lines are grouped into first and second groups based on memory hole diameter. Circuitry is configured to determine if the selected word line is in the first group or the second group. In response to the selected word line being in the first zone, the circuitry is configured to perform a memory operation using a first set of reference voltages. In response to the selected word line being in the second group, the circuitry is configured to perform the memory operation using a second set of reference voltages. The first and second sets of reference voltages are different for a plurality of data states and are similar for at least one data state at a highest threshold voltage range.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:記憶體裝置</p>
        <p type="p">108:記憶體晶粒</p>
        <p type="p">110:控制電路系統</p>
        <p type="p">112:狀態機</p>
        <p type="p">113:儲存區域</p>
        <p type="p">114:晶片上位址解碼器</p>
        <p type="p">116:電源控制模組</p>
        <p type="p">118:線</p>
        <p type="p">120:資料匯流排</p>
        <p type="p">122:控制器</p>
        <p type="p">122a:ROM</p>
        <p type="p">122b:RAM</p>
        <p type="p">122c:處理器</p>
        <p type="p">124:列解碼器</p>
        <p type="p">126:記憶體結構</p>
        <p type="p">126a:儲存裝置</p>
        <p type="p">128:讀取/寫入電路</p>
        <p type="p">132:行解碼器</p>
        <p type="p">140:主機</p>
        <p type="p">150:控制電路</p>
        <p type="p">151:程式化電路</p>
        <p type="p">152:計數電路</p>
        <p type="p">153:判定電路</p>
        <p type="p">245:糾錯碼引擎</p>
        <p type="p">246:鎖定引擎</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="824" publication-number="202624618">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624618</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115160</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>冷卻泵浦模組及其輔助連接裝置</chinese-title>
        <english-title>COOLING PUMP MODULE AND AUXILIARY CONNECTING DEVICE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250507B">F04D29/04</main-classification>
        <further-classification edition="200601120250507B">F28F9/26</further-classification>
        <further-classification edition="200601120250507B">G06F1/20</further-classification>
        <further-classification edition="200601120250507B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光寶科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許端祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SYU, DUAN-YOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育璽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-HSI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>冒淑華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAU, SHU-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提出一種冷卻泵浦模組及其輔助連接裝置。輔助連接裝置包括一托盤、一基座以及一導桿。托盤具有固接於其上的一第一軸承。基座可滑動地設置於托盤。基座具有固接於其上的一第二軸承。導桿可轉動地設置並穿過第二軸承。當基座相對於托盤滑動時，導桿朝向第一軸承移動。當導桿移動至接近第一軸承時，導桿係允許轉動以與第一軸承接合。當導桿在第一軸承中轉動時，導桿推抵第二軸承以施力於基座。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cooling pump module and an auxiliary connecting device thereof are provided. The auxiliary connecting device comprises a tray, a base and a guide rod. The tray has a first bearing fixed thereon. The base is slidably arranged on the tray. The base has a second bearing fixed thereon. The guide rod is rotatably arranged in and penetrates the second bearing. When the base slides relative to the tray, the guide rod moves toward the first bearing. When the guide rod moves close to the first bearing, the guide rod is allowed to rotate to be engage with the first bearing. When the guide rod rotates in the first bearing, the guide rod pushes against the second bearing to apply force to the base.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:輔助連接裝置</p>
        <p type="p">110:托盤</p>
        <p type="p">111:第一軸承</p>
        <p type="p">120:基座</p>
        <p type="p">120L:長邊</p>
        <p type="p">120S:短邊</p>
        <p type="p">121:第二軸承</p>
        <p type="p">122:支撐軌</p>
        <p type="p">130:導桿</p>
        <p type="p">130E:端部</p>
        <p type="p">131:推動結構</p>
        <p type="p">140:把手</p>
        <p type="p">OP:開口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="825" publication-number="202625189">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625189</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115285</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體裝置中的程式化驗證技術</chinese-title>
        <english-title>PROGRAM-VERIFY TECHNIQUES IN A MEMORY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">G11C16/06</main-classification>
        <further-classification edition="200601120251201B">G11C16/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商晟碟科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANDISK TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹　偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COA, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普拉卡屈　阿比吉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRAKASH, ABHIJITH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, XIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">記憶體裝置包括一記憶體區塊，該記憶體區塊具有配置在複數個字線及複數個NAND串中的複數個記憶體單元。該記憶體裝置亦包括電路系統，該電路系統經組態以在複數個程式化迴圈中將該複數個字線中的一經選擇字線的該等記憶體單元程式化為複數個資料狀態，該等程式化迴圈包括程式化脈衝及驗證操作。在該等驗證操作中之至少一者期間，該電路系統經組態以不鎖定一集合之該複數個NAND串。該集合中之該等NAND串包括該經選擇字線的已完成程式化的該等記憶體單元中之至少一些，以使得在感測期間通過該集合中之該等NAND串導電。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The memory device includes a memory block with a plurality of memory cells that are arranged in a plurality of word lines and a plurality of NAND strings. The memory device also includes circuitry that is configured to program the memory cells of a selected word line of the plurality of word lines to a plurality of data states in a plurality of program loops that include programming pulses and verify operations. During at least one of the verify operations, the circuitry is configured to not lock out a set of the plurality of NAND strings. The NAND strings of the set include at least some of the memory cells of the selected word line that have completed programming so that electricity is conducted through the NAND strings of the set during sensing.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:記憶體裝置</p>
        <p type="p">108:記憶體晶粒</p>
        <p type="p">110:控制電路系統</p>
        <p type="p">112:狀態機</p>
        <p type="p">113:儲存區域</p>
        <p type="p">114:晶片上位址解碼器</p>
        <p type="p">116:電源控制模組</p>
        <p type="p">118:線</p>
        <p type="p">120:資料匯流排</p>
        <p type="p">122:控制器</p>
        <p type="p">122a:ROM</p>
        <p type="p">122b:RAM</p>
        <p type="p">122c:處理器</p>
        <p type="p">124:列解碼器</p>
        <p type="p">126:記憶體結構</p>
        <p type="p">126a:儲存裝置</p>
        <p type="p">128:讀取/寫入電路</p>
        <p type="p">132:行解碼器</p>
        <p type="p">140:主機</p>
        <p type="p">150:控制電路</p>
        <p type="p">151:程式化電路</p>
        <p type="p">152:計數電路</p>
        <p type="p">153:判定電路</p>
        <p type="p">245:糾錯碼引擎</p>
        <p type="p">246:鎖定引擎</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="826" publication-number="202625516">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625516</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115527</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>PCB電路板漲縮的線上監測方法</chinese-title>
        <english-title>AN ONLINE MONITORING METHOD FOR THE EXPANSION AND CONTRACTION OF A PCB CIRCUIT BOARD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250528B">H05K3/00</main-classification>
        <further-classification edition="200601120250528B">G06F17/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳市深逸通電子有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黄俊祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種PCB電路板漲縮的線上監測方法，包括：掃描PCB，採集PCB圖像，導入PCB設計圖；在該PCB設計圖上設置多個標定測量點；獲取每一該標定測量點對應的的標定座標組資料；採集實際PCB電路板在每一該標定測量點對應的實際座標組資料；將每一該標定座標組資料與對應的實際座標組資料之間在X方向和Y方向的數值差異，以判斷該實際PCB電路板的漲縮幅度。本發明採用PCB設計圖與實際PCB電路板計算漲縮值的方式來實現PCB電路板漲縮的線上監測，可以高效的連續監督生產中PCB板的實際漲縮情況，有效減少生產報廢耗損，進一步降低了漲縮值的誤差率，使其能夠適應實際生產需求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An online monitoring method for the expansion and contraction of a PCB circuit board comprises: scanning the PCB, collecting PCB images, and importing PCB design drawings; setting a plurality of calibration measurement points on the PCB design drawings; acquiring calibration coordinate group data corresponding to each calibration measurement point; collecting actual coordinate group data corresponding to each calibration measurement point of an actual PCB circuit board; and determining the expansion and contraction range of the actual PCB circuit board by comparing the numerical differences between each calibration coordinate group data and the corresponding actual coordinate group data in the X direction and the Y direction. The present invention realizes online monitoring of the expansion and shrinkage of the PCB circuit board by calculating the expansion and shrinkage value of the actual PCB circuit board using a PCB design drawing, which can efficiently and continuously monitor the actual expansion and shrinkage of the PCB board in production, effectively reduce production scrap and loss, and further reduce the error rate of the expansion and shrinkage value, so that it can adapt to actual production needs.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1-S5:步驟流程</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="827" publication-number="202623925">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623925</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115992</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種鈦酸鋇包覆鎳粉及粉漿</chinese-title>
        <english-title>BARIUM TITANATE-COATED NICKEL POWDER AND SLURRY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250505B">B22F1/065</main-classification>
        <further-classification edition="202201120250505B">B22F1/16</further-classification>
        <further-classification edition="202201120250505B">B22F1/0545</further-classification>
        <further-classification edition="200601120250505B">H01G4/12</further-classification>
        <further-classification edition="200601120250505B">H01G4/30</further-classification>
        <further-classification edition="202301120250505B">H10N30/05</further-classification>
        <further-classification edition="202301120250505B">H10N30/074</further-classification>
        <further-classification edition="200601120250505B">H01J49/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商江蘇博遷新材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANGSU BOQIAN NEW MATERIALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙登永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, DENGYONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　鋼強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, GANGQIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡建亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAI, JIANLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAI, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭家斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, JIABIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋財根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, CAIGEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王海勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HAIYONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳豫宛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明屬於金屬粉材料技術領域，提供一種鈦酸鋇包覆鎳粉及粉漿，鈦酸鋇包覆鎳粉具有比表面積等效粒徑d為30~600nm的鎳粉內核；其表面具有雙殼結構，內殼層為氧化合物和/或硫化合物，外殼層為鈦酸鋇。本發明提供的鈦酸鋇包覆鎳粉，具有雙殼體結構，除了通過外殼的鈦酸鋇殼體提升鎳粉與介電材料的共燒性的優點之外，還通過內殼的氧化合物和/或硫化合物，更好的提升鎳與介電材料的結合度，提升了此種鎳粉在製備電子元件過程中的良率，並提升了電子元件的電性能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention belongs to the technical area of medal powder material, providing a barium titanate-coated nickel powder and slurry, and the powder has a nickel core with a specific surface area equivalent particle diameter d of 30 to 600 nm; the surface has a double-shell structure, with an inner shell layer of oxide and/or sulfur compounds and an outer shell layer of barium titanate. The advantage of barium titanate-coated nickel powder with a double-shell structure in the present invention not only increases the cofiring ability of nickel powder and dielectric material by a barium titanate outer shell but also increases the combination of nickel and dielectric material by an inner shell layer of oxide and/or sulfur compounds. This improves the yield rate of nickel powder when producing electronic components and enhances the electrical properties of electronic components.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="828" publication-number="202624507">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624507</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116303</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>壓電積層體及壓電積層體之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C23C14/08</main-classification>
        <further-classification edition="202301120260302B">H10N30/00</further-classification>
        <further-classification edition="202301120260302B">H10N30/057</further-classification>
        <further-classification edition="202301120260302B">H10N30/063</further-classification>
        <further-classification edition="202301120260302B">H10N30/067</further-classification>
        <further-classification edition="202301120260302B">H10N30/073</further-classification>
        <further-classification edition="202301120260302B">H10N30/076</further-classification>
        <further-classification edition="202301120260302B">H10N30/079</further-classification>
        <further-classification edition="202301120260302B">H10N30/20</further-classification>
        <further-classification edition="202301120260302B">H10N30/50</further-classification>
        <further-classification edition="202301120260302B">H10N30/853</further-classification>
        <further-classification edition="202301120260302B">H10N30/87</further-classification>
        <further-classification edition="202301120260302B">H10N30/88</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴田憲治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBATA, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡辺和俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, KAZUTOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黒田稔顕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURODA, TOSHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中康教</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, YASUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提昇包含鉀、鈉、鈮、及氧之壓電膜於高溫高濕環境下之DC應力壽命。  &lt;br/&gt;本發明之壓電積層體具備：基板；基板上之下部電極膜；及下部電極膜上之壓電膜，其包含由通式ABO&lt;sub&gt;3&lt;/sub&gt;表示，A位包含K及Na，B位包含Nb之鈣鈦礦型氧化物；且於將壓電膜劃分為遍及自壓電膜之上表面朝向基板直至規定深度之範圍的表層區域、及作為除表層區域以外之區域的主體區域時，表層區域中之K及Na之合計原子濃度高於主體區域中之K及Na之合計原子濃度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板</p>
        <p type="p">1a:Si基板</p>
        <p type="p">1b:表面氧化膜</p>
        <p type="p">2:下部電極膜</p>
        <p type="p">3:壓電膜</p>
        <p type="p">3a:構成表層區域之壓電膜</p>
        <p type="p">3b:構成主體區域之壓電膜</p>
        <p type="p">3b1:構成主體區域中之下層區域之壓電膜</p>
        <p type="p">3b2:構成主體區域中之除下層區域以外之區域之壓電膜</p>
        <p type="p">4:上部電極膜</p>
        <p type="p">6:下部密接層</p>
        <p type="p">7:上部密接層</p>
        <p type="p">10:壓電積層體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="829" publication-number="202625617">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625617</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116500</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製造三維電晶體的方法和三維電晶體陣列</chinese-title>
        <english-title>METHOD OF FABRICATING THREE-DIMENSIONAL TRANSISTORS AND THREE-DIMENSIONAL TRANSISTOR ARRAY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10D88/00</main-classification>
        <further-classification edition="202501120260302B">H10D30/01</further-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林子敬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TZU-GING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃美淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, MEI-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳昀錚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YUN-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">三維電晶體的製造包括形成三維電晶體結構其包括三維通道和與三維通道連接的源極和汲極(S/D)區域。S/D區域具有凸形的上表面。遮罩材料形成在S/D區域上。至少一個介電層設置在遮罩材料上方和在三維電晶體結構上方。蝕刻至少一個介電層和遮罩材料，以打開通入凹部其穿過至少一個介電層而通入S/D區域。此蝕刻也蝕刻S/D區域的凸形的上表面，以形成S/D區域的蝕刻修改的上表面。用導電材料填充通入凹部，以形成S/D觸點其通到S/D區域的蝕刻修改的上表面。蝕刻修改的上表面可具有平行於三維通道的凹形的曲率，並且也可具有平坦的或較不凸的橫向曲率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Fabrication of three-dimensional (3D) transistors includes forming 3D transistor structures including 3D channels and source and drain (S/D) regions connected with the 3D channels. The S/D regions have convex upper surfaces. Mask material is formed on the S/D regions. At least one dielectric layer is disposed over the mask material and over the 3D transistor structures. The at least one dielectric layer and the mask material are etched to open access recesses through the at least one dielectric layer accessing the S/D regions. The etching also etching the convex upper surfaces of the S/D regions to form etch-modified upper surfaces of the S/D regions. The access recesses are filled with an electrically conductive material to form S/D contacts to the etch-modified upper surfaces of the S/D regions. The etch-modified upper surfaces may have concave curvature parallel with the 3D channels, and may also have flattened or less convex transverse curvature.</p>
      </isu-abst>
      <representative-img>
        <p type="p">12:三維通道(通道)</p>
        <p type="p">14:源極和汲極區域(源極/汲極區域、外延)</p>
        <p type="p">18:閘極(閘極線)</p>
        <p type="p">30:上表面</p>
        <p type="p">32:上表面部分(上表面)</p>
        <p type="p">34:上部空腔</p>
        <p type="p">36:隔離介電質結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="830" publication-number="202625731">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625731</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116644</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於分離半導體晶圓的系統和方法</chinese-title>
        <english-title>SYSTEMS AND METHODS FOR SEPARATING SEMICONDUCTOR WAFERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/00</main-classification>
        <further-classification edition="200601120260302B">G05B19/404</further-classification>
        <further-classification edition="200601120260302B">G05B19/406</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李怡蓁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張任遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JEN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之實施方式提供用於分離接合的第一及第二半導體晶圓的系統及方法。系統包括：具有一尖端的工具，尖端包括經組態以分別接觸第一晶圓及第二晶圓的第一部件及第二部件；感測器經組態以感測由第一部件及第二部件施加的應力；自動化設備經組態以移動第一部件及第二部件；及控制器經組態以：將工具的尖端插入該些晶圓之間；分離第一部件與第二部件，以基於一力設置施加一力；監視施加至該些晶圓的應力；回應於所施加的應力調整力設置；及回應於該些晶圓的完全分離或回應於施加至其的應力超過最大應力臨限值，將工具自該些晶圓之間移除。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and methods are provided for separation bonded first and second semiconductor wafers. The systems include a tool having a tip that includes a first and second members configured to contact the first and second wafers, respectively, sensors configured to sense stress applied by the first and second members, an automated apparatus configured to move the first and second members, and a controller configured to insert the tip of the tool between the wafers, separate the first and second members to apply a force based on a force setting, monitor the stress applied to the wafers, adjust the force setting in response to the stress applied, and remove the tool from between the wafers in response to complete separation thereof or in response to the stress applied to thereto exceeding a maximum stress threshold.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:方法</p>
        <p type="p">210:步驟</p>
        <p type="p">212:步驟</p>
        <p type="p">214:區塊</p>
        <p type="p">216:步驟</p>
        <p type="p">218:步驟</p>
        <p type="p">220:區塊</p>
        <p type="p">222:區塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="831" publication-number="202624876">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624876</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116711</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光刻遮罩及製造光刻遮罩的方法</chinese-title>
        <english-title>LITHOGRAPHY MASK AND METHOD OF MANUFACTURING LITHOGRAPHY MASK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120251020B">G03F1/22</main-classification>
        <further-classification edition="201201120251020B">G03F1/24</further-classification>
        <further-classification edition="201201120251020B">G03F1/46</further-classification>
        <further-classification edition="201201120251020B">G03F1/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許倍誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, PEI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝艮軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, KEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王聖閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHENG-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張思偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, SIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李信昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HSIN-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露之一實施方式涉及一種光刻遮罩版的製造方法。此方法包括在基板上形成多層反射結構。在多層反射結構上方形成蓋層。在蓋層上方形成緩衝層，並在緩衝層上方形成吸收層。吸收層至少包括第一吸收層及第二吸收層，各吸收層均包括非合金元素，且第一吸收層及第二吸收層由不同的非合金元素製成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a method of fabricating a lithography mask. The method includes forming a multi-layer reflective structure over a substrate. A capping layer is formed over the multi-layer reflective structure. A buffer layer is formed over the capping layer and an absorber layer is formed over the buffer layer. The absorber layer includes at least a first absorber layer and a second absorber layer, each including a non-alloyed element, and the first absorber layer and the second absorber layer are made of different non-alloyed elements.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S2301,S2303,S2305,S2307:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="832" publication-number="202623799">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623799</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116766</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>治療方法</chinese-title>
        <english-title>METHODS OF TREATMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">A61K31/4439</main-classification>
        <further-classification edition="200601120251201B">A61P35/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商雷傑製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RIGEL PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周　德彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOW, ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈迪　圖非</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GORDI, TOUFIGH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅傑爾　麗莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROJKJAER, LISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏　露西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, LUCY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示治療、管控或改善選自以下之疾病之方法：骨髓發育不良症候群(MDS)、骨髓增生性贅瘤(MPN)、MPN/MDS、意義未明之純系血球減少症(CCUS)、慢性骨髓性白血病(CML)及急性骨髓性白血病(AML)。該等方法包括向有需要之個體投與治療有效量之1-(4-(4-((3-(3,6-二氟吡啶-2-基)-1-((1r,4r)-4-乙氧基環己基)-1H-吡唑-4-基)胺甲醯基)噻唑-2-基)-1H-吡唑-1-基)乙基磷酸鹽或其立體異構物或立體異構物混合物、醫藥學上可接受之鹽、互變異構物、溶劑合物、水合物、共晶體、籠合物或多形體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are methods for treating, managing, or ameliorating a disease selected from myelodysplastic syndrome (MDS), myeloproliferative neoplasms (MPN), MPN/MDS, clonal cytopenia of undetermined significance (CCUS), chronic myeloid leukemia (CML) and acute myeloid leukemia (AML). The methods comprise administering to a subject in need thereof a therapeutically effective amount of 1-(4-(4-((3-(3,6-difluoropyridin-2-yl)-1-((1r,4r)-4-ethoxycyclohexyl)-1H-pyrazol-4-yl)carbamoyl)thiazol-2-yl)-1H-pyrazol-1-yl)ethyl phosphate or a stereoisomer or mixture of stereoisomers, a pharmaceutically acceptable salt, tautomer, solvate, hydrate, co-crystal, clathrate, or polymorph thereof.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="833" publication-number="202624934">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624934</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116844</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>投影儀及其交互控制方法</chinese-title>
        <english-title>PROJECTOR AND INTERACTIVE CONTROL METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250515B">G06F3/01</main-classification>
        <further-classification edition="202201120250515B">G06V40/20</further-classification>
        <further-classification edition="202301120250515B">G06N3/08</further-classification>
        <further-classification edition="200601120250515B">G03B21/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英華達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC APPLIANCES CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許家豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIA-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳功</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, GONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐有武</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, YOU-WU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">投影儀及其交互控制方法。該投影儀交互控制方法包括：獲取目標物件的唯一性標識資訊和交互動作資訊；將目標物件的唯一性標識資訊和交互動作資訊輸入至預設交互模型，獲取與交互動作資訊對應的交互結果；根據交互結果，控制投影儀的投影內容。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application is about a projector and interactive control method thereof. The projector interactive control method comprising: obtaining unique identification information and interactive action information of a target object; inputting the unique identification information and interactive action information of the target object into a preset interaction model to obtain the interaction result corresponding to the interaction action information; and controls the projection content of the projector according to the interaction result.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110~S130:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="834" publication-number="202625534">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625534</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116952</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>管路限位裝置及應用其之伺服器機櫃</chinese-title>
        <english-title>PIPE LIMIT DEVICE AND SERVER CABINET USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250529B">H05K7/14</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光寶科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳正宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ZHENG-ZONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊期閎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, QI-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許泓錡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HUNG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">管路限位裝置適於可拆卸地連接於一伺服器機櫃之一櫃體。管路限位裝置包括第一限位件及第二限位件。第一限位件具有第一限位孔。第二限位件具有第二限位孔且可拆卸地固定於第一限位件。第一限位孔與第二限位孔部分重疊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pipeline limiting device is suitable for detachable connection to a cabinet body of a server cabinet. The pipeline limit device includes a first position-limiting element and a second position-limiting element. The first position-limiting element has a first limiting hole. The second position-limiting element has a second limiting hole and is detachably fixed to the first element. The first limiting hole partially overlaps with the second limiting hole.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:管路限位裝置</p>
        <p type="p">110:第一限位件</p>
        <p type="p">112:第一側板</p>
        <p type="p">120:第二限位件</p>
        <p type="p">122:第三側板</p>
        <p type="p">130:第一固定件</p>
        <p type="p">113:第二側板</p>
        <p type="p">1131:第一部分</p>
        <p type="p">1132:第二部分</p>
        <p type="p">140:第二固定件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="835" publication-number="202624510">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624510</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116983</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>濺鍍裝置及鎢膜之成膜方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C23C14/34</main-classification>
        <further-classification edition="200601120260302B">C23C14/14</further-classification>
        <further-classification edition="200601120260302B">C23C14/54</further-classification>
        <further-classification edition="200601120260302B">C23C14/56</further-classification>
        <further-classification edition="202601120260302B">H10P14/45</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商愛發科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ULVAC, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中光豊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMITSU, YUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種可形成低電阻之鎢膜的濺鍍裝置及成膜方法。  &lt;br/&gt;　　[解決手段]具備有：基板平台(2)，在設置有鎢製的靶材(3)之真空腔室(1)內保持基板(Sw)；及高頻電源(Hs)，將高頻電力投入基板平台(2)。當「在真空腔室(1)內生成第1電漿氛圍(Pm1)，藉由靶材(3)之濺鍍使濺鍍粒子附著、沉積於基板(Sw)以形成鎢膜」時，將高頻電力投入基板平台(2)，生成第2電漿氛圍(Pm2)，並使第1電漿氛圍(Pm1)中的正離子亦碰撞基板(Sw)。將基板平台(2)之基板保持面(2a)的面積設為陰極面積，將以基板平台(2)作為一方之電極且作為第2電漿氛圍(Pm2)的另一方之電極而發揮功能的真空腔室(1)內之表面積設為陽極面積，陽極面積相對於陰極面積之比被設定為4.0~6.0的範圍。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:真空腔室</p>
        <p type="p">1a:成膜空間</p>
        <p type="p">2:基板平台</p>
        <p type="p">2a:基板保持面</p>
        <p type="p">3:靶材</p>
        <p type="p">3a:濺鍍面</p>
        <p type="p">4:磁鐵單元</p>
        <p type="p">5u:上屏蔽板</p>
        <p type="p">5d:下屏蔽板</p>
        <p type="p">6:絕緣體</p>
        <p type="p">11:排氣管</p>
        <p type="p">12:質量流控制器</p>
        <p type="p">13:氣體管</p>
        <p type="p">31:背板</p>
        <p type="p">51:本體部</p>
        <p type="p">52:上平板部</p>
        <p type="p">53:本體部</p>
        <p type="p">54:下平板部(屏蔽板)</p>
        <p type="p">54a:第1表面部分</p>
        <p type="p">54b:第2表面部分</p>
        <p type="p">I&lt;sub&gt;1&lt;/sub&gt;:絕緣體</p>
        <p type="p">I&lt;sub&gt;2&lt;/sub&gt;:絕緣體</p>
        <p type="p">Hs:高頻電源</p>
        <p type="p">Mb:匹配箱</p>
        <p type="p">SM:濺鍍裝置</p>
        <p type="p">Sw:基板(被處理基板)</p>
        <p type="p">Sw1:成膜面</p>
        <p type="p">Pm1:第1電漿氛圍</p>
        <p type="p">Pm2:第2電漿氛圍</p>
        <p type="p">Ps:直流電源</p>
        <p type="p">Pu:真空泵單元</p>
        <p type="p">Uc:陰極單元</p>
        <p type="p">Us:屏蔽單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="836" publication-number="202625591">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625591</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117227</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置結構及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D62/10</main-classification>
        <further-classification edition="202501120260302B">H10D64/20</further-classification>
        <further-classification edition="202501120260302B">H10D30/62</further-classification>
        <further-classification edition="202501120260302B">H10D30/60</further-classification>
        <further-classification edition="202601120260302B">H10W10/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林子敬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TZU-GING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施例提供一種半導體裝置結構及其製造方法。此結構包括一個或複數個半導體層設置於基板部分上；源極/汲極區設置為相鄰於基板部分和一個或複數個半導體層之間；以及第一應力層設置於源極/汲極區下方，其中氣隙形成於第一應力層與源極/汲極區之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure provide semiconductor device structures and methods of forming the same. The structure includes one or more semiconductor layers disposed over a substrate portion, a source/drain region disposed adjacent the substrate portion and the one or more semiconductor layers, and a first stressor layer disposed below the source/drain region, wherein an air gap is formed between the first stressor layer and the source/drain region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置結構</p>
        <p type="p">101:基板</p>
        <p type="p">106:第一半導體層</p>
        <p type="p">108:第二半導體層</p>
        <p type="p">116:基板部分</p>
        <p type="p">132:犧牲閘極介電層</p>
        <p type="p">134:犧牲閘極電極層</p>
        <p type="p">136:遮罩層</p>
        <p type="p">136a:氧化層</p>
        <p type="p">136b:氮化層</p>
        <p type="p">138:閘極間隙壁</p>
        <p type="p">138a:閘極間隙壁</p>
        <p type="p">138b:閘極間隙壁</p>
        <p type="p">146:S/D區</p>
        <p type="p">148:應力層</p>
        <p type="p">149:氣隙</p>
        <p type="p">202:第一區域</p>
        <p type="p">204:第二區域</p>
        <p type="p">210:應力層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="837" publication-number="202624101">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624101</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117242</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體晶圓容器、半導體晶圓容器內的支架結構及半導體晶圓容器的使用方法</chinese-title>
        <english-title>SEMICONDUCTOR WAFER CONTAINER, BRACKET STRUCTURE WITHIN SEMICONDUCTOR WAFER CONTAINER, AND USING METHOD FOR SEMICONDUCTOR WAFER CONTAINER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">B65G49/07</main-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張任遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JEN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李怡蓁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">工件容器內的一或多個支架結構用以在操作中接收一或多個工件(例如，未處理的晶圓、部分處理的晶圓、晶圓組件等)。該一或多個支架結構中的每一相應支架結構包括複數個凹槽，用以在操作中接收該一或多個工件。每一相應支架結構的凹槽中的至少一者部分襯有軟材料，該軟材料可為彈性材料。當該軟材料存在於襯有軟材料的相應凹槽內時，該軟材料充當緩衝器或支撐件，以防止機械缺陷(例如，劃痕、微裂縫、裂縫或一些其他相似或類似的機械缺陷)在工件處、沿著工件或在工件內傳播。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">One or more bracket structures within a workpiece container configured to, in operation, receive one or more workpieces (e.g., unprocessed wafers, partially processed wafers, wafer assemblies, etc.). Each respective bracket structure of the one or more bracket structures includes a plurality of recesses configured to, in operation, receive the one or more workpieces. At least one of the recesses of each of the respective bracket structures is partially lined with a soft material, which may be an elastic material. The soft material acts as a bumper or support to prevent mechanical defects (e.g., scratching, micro-cracking, cracking, or some other similar or like mechanical defect) from propagating at, along, or within the workpiece when present within the respective recesses lined with the soft material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:容器</p>
        <p type="p">102:側面</p>
        <p type="p">1B-1B、1C-1C:線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="838" publication-number="202625099">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625099</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117255</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置及其物件偵測方法</chinese-title>
        <english-title>ELECTRONIC DEVICE AND OBJECT DETECTION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250701B">G06V10/70</main-classification>
        <further-classification edition="201701120250701B">G06T7/00</further-classification>
        <further-classification edition="201401120250701B">H04N19/48</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇景光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIMAX TECHNOLOGIES LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃柏穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, BO-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳慈煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TZU-HSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯迪文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, TI-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">物件偵測方法包括：接收影像資訊的多個區塊；在多個區塊上執行區塊式離散餘弦轉換（DCT）以分別地獲取多個DCT係數區塊，其中DCT係數區塊包括DC係數以及對應於差頻率的多個AC係數；在多個DCT係數區塊上執行鋸齒狀掃描操作以分別地獲取多個DCT係數串；連接至少兩個不同的DCT係數串作為修改型DCT係數串；以及藉由將修改型DCT係數串饋入至卷積神經網路裝置來執行物件偵測操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A object detection method includes: receiving a plurality of blocks of the image information; performing a block-based discrete cosine transform (DCT) on a plurality of blocks to obtain a plurality of DCT-coefficient blocks respectively, wherein the DCT-coefficient block comprises a DC coefficient and a plurality of AC coefficients corresponding to difference frequencies; performing a Zig-Zag scanning operation on the plurality of DCT-coefficient blocks to obtain a plurality of DCT-coefficient strips respectively; concatenating at least two different DCT-coefficient strips as a modified DCT-coefficient strip; and performing an object detection operation by feeding the modified DCT-coefficient strip to a convolution neural network device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110~S150:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="839" publication-number="202624962">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624962</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117294</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自動化部署人工智慧模型的方法</chinese-title>
        <english-title>AUTOMATED ARTIFICIAL INTELLIGENCE MODEL DEPLOYMENT METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G06F11/34</main-classification>
        <further-classification edition="200601120260302B">G06F9/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詠鋐智能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIMES AI, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝宗震</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, TSUNG-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林淑娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種自動化部署人工智慧模型的方法，透過系統化的資料預處理、模型選擇、參數優化與性能監控機制，以簡化模型建置流程，並於應用環境中動態更新或切換模型，使整體預測效能維持在最佳狀態，同時提升模型在多元應用環境中的性能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides an automated artificial intelligence model deployment method. By implementing systematic data preprocessing, model selection, parameter optimization, and performance monitoring mechanisms, the method simplifies the model building process and enables dynamic updates or model switching within the application environment. This ensures optimal predictive performance while enhancing the model's effectiveness across diverse application scenarios.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101、S102、S103、S104、S105、S106、S107:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="840" publication-number="202625691">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625691</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117350</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>單晶矽半導體晶圓</chinese-title>
        <english-title>SEMICONDUCTOR WAFER OF MONOCRYSTALLINE SILICON</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260311B">H10P36/00</main-classification>
        <further-classification edition="200601120260311B">C30B15/20</further-classification>
        <further-classification edition="200601120260311B">C30B29/06</further-classification>
        <further-classification edition="200601120260311B">C30B33/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商世創電子材料公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILTRONIC AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆勒　蒂莫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUELLER, TIMO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓋姆里奇　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GEHMLICH, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯科洛巴奈克　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SKROBANEK, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳翠華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有正面及背面的單晶矽半導體晶圓，由以下組成：&lt;br/&gt;在晶圓外邊緣處的環形邊緣區域；及&lt;br/&gt;具恆定軸向厚度的區域，佈置在環形邊緣區域內；&lt;br/&gt;具恆定軸向厚度的區域包含在正面處的近表面區域、在背面處的近表面區域、及佈置在近表面區域間的內部區域；及&lt;br/&gt;在正面處的近表面區域從正面的表面沿軸向向下延伸至不小於50微米的深度；&lt;br/&gt;整個內部區域的間隙氧濃度為5.2×10&lt;sup&gt;17&lt;/sup&gt;至5.8×10&lt;sup&gt;17&lt;/sup&gt;原子／立方公分，徑向變化不大於0.2×10&lt;sup&gt;17&lt;/sup&gt;原子／立方公分；及&lt;br/&gt;在正面處的近表面區域的氮濃度從該表面到晶圓內部沿軸向方向減小，並在離該表面5微米深度處為1.0×10&lt;sup&gt;14&lt;/sup&gt;至1.7×10&lt;sup&gt;15&lt;/sup&gt;原子／立方公分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Semiconductor wafer of monocrystalline silicon having a front side and a back side, consisting of&lt;br/&gt;an annular edge region at the outer edge of the wafer; and&lt;br/&gt;a region with constant axial thickness, which is arranged within the annular edge region;&lt;br/&gt;the region with constant axial thickness comprises a near-surface region at the front side, a near-surface region at the back side and an inner region arranged between the near-surface regions; and&lt;br/&gt;the near-surface region at the front side extends from the surface of the front side in axial direction down to a depth of not less than 50 µm;&lt;br/&gt;wherein,&lt;br/&gt;an interstitial oxygen concentration in the entire inner region is not less than 5.2 x 10&lt;sup&gt;17&lt;/sup&gt;atoms/cm&lt;sup&gt;3&lt;/sup&gt;and not more than 5.8 x 10&lt;sup&gt;17&lt;/sup&gt;atoms/cm&lt;sup&gt;3&lt;/sup&gt;and varies in radial direction by not more than 0.2 x 10&lt;sup&gt;17&lt;/sup&gt;atoms/cm&lt;sup&gt;3&lt;/sup&gt;; and&lt;br/&gt;a nitrogen concentration in the near-surface region at the front side decreases in axial direction from the surface into the interior of the semiconductor wafer and at a depth of 5 µm from the surface is not less than 1.0 x 10&lt;sup&gt;14&lt;/sup&gt;atoms/cm&lt;sup&gt;3&lt;/sup&gt;and not more than 1.7 x 10&lt;sup&gt;15&lt;/sup&gt;atoms/cm&lt;sup&gt;3&lt;/sup&gt;.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="841" publication-number="202623952">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623952</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117363</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化學機械研磨墊</chinese-title>
        <english-title>CHEMICAL MECHANICAL POLISHING PAD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260302B">B24B37/20</main-classification>
        <further-classification edition="202601120260302B">H10P52/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, TE-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈稘翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, CHI-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林政錡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JENG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白睿宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, JUI YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭晉銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHIN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許勛豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HSUN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫旭昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUEN, SHICH-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種化學機械研磨(chemical mechanical polishing，CMP)研磨墊。該CMP研磨墊包括墊體，具有頂表面及底表面且包含多個體素。該些體素包含：由第一材料佔據的該些體素的第一部分；以及由第二材料佔據的該些體素的第二部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A chemical mechanical polishing (CMP) polishing pad is provided. The CMP polishing pad includes a pad body characterized by a top surface and a bottom surface and comprising a plurality of voxels. The plurality of voxels comprises: a first portion of the plurality of voxels occupied by a first material; and a second portion of the plurality of voxels occupied by a second material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:CMP系統</p>
        <p type="p">110:晶圓</p>
        <p type="p">114:旋轉晶圓固持器</p>
        <p type="p">122:晶圓表面</p>
        <p type="p">124:磨料漿</p>
        <p type="p">126:旋轉平台</p>
        <p type="p">128:磨料漿供應設備</p>
        <p type="p">130:添加劑供應設備</p>
        <p type="p">151:添加劑</p>
        <p type="p">152:帶正電的材料</p>
        <p type="p">153:帶負電的材料</p>
        <p type="p">154:孔</p>
        <p type="p">156:底表面</p>
        <p type="p">157:墊體</p>
        <p type="p">158:頂表面</p>
        <p type="p">200:研磨墊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="842" publication-number="202625799">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625799</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117451</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路裝置及其製造方法</chinese-title>
        <english-title>INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W20/00</main-classification>
        <further-classification edition="202601120260302B">H10W10/10</further-classification>
        <further-classification edition="202601120260302B">H10P50/20</further-classification>
        <further-classification edition="202601120260302B">H10P14/40</further-classification>
        <further-classification edition="202601120260302B">H10W20/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宛儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WAN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳郁翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳采伶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CAI-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛琇文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSUEH, HSIU-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃柏翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, PO-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡薇庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, WEI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在介電結構上方形成遮罩層，遮罩層包含暴露介電結構的一部分的開口；在遮罩層上形成保護層，保護層覆蓋開口的至少側表面；在形成保護層之後，對遮罩層進行定向蝕刻製程，在第一方向中進行定向蝕刻製程，而保護層保護遮罩層免於在不同於第一方向的第二方向中被蝕刻，使得在進行定向蝕刻製程之後，在第一方向中擴大開口，而在第二方向中大致不影響開口；在第一方向中擴大開口之後，將開口垂直延伸至介電結構中；以及在開口中形成導通孔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A mask layer is formed over a dielectric structure. The mask layer includes an opening that exposes a portion of the dielectric structure. A protective layer is formed on the mask layer. The protective layer covers at least side surfaces of the opening. After the forming of the protective layer, a directional etching process is performed to the mask layer. The directional etching process is performed in a first direction, while the protective layer protects the mask layer from being etched in a second direction different from the first direction, such that the opening is enlarged in the first direction without being substantially affected in the second direction after the directional etching process has been performed. The opening is extended vertically into the dielectric structure after the opening has been enlarged in the first direction. A conductive via is formed in the opening.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:方法</p>
        <p type="p">1010,1020,1030,1040,1050:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="843" publication-number="202624530">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624530</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117635</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構、其形成方法及其形成系統</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE, METHOD FOR FORMING THE SAME AND SYSTEM FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C23C16/455</main-classification>
        <further-classification edition="200601120260302B">C23C16/52</further-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
        <further-classification edition="202601120260302B">H10P72/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王嘉熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIA-HSI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥羽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錢人豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, JEN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供金屬氧化物層及形成金屬氧化物層的方法及系統。一種方法包括於沉積裝置中接收工件，其中沉積裝置包括腔室及設置在腔室中以容納工件的靜電吸盤；透過快門管將氧氣注入腔室內；監測工件上的靜電積聚；及調整靜電積聚，其中調整靜電積聚包括調整靜電吸盤的高度以形成具有選定厚度均勻性的沉積層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are metal oxide layers and methods and systems for forming metal oxide layers. A method includes receiving a workpiece in an apparatus for deposition, wherein the apparatus for deposition comprises a chamber and electrostatic pads disposed in the chamber to accommodate the workpiece; flowing oxygen into the chamber through a shutter tube; monitoring an electrostatic accumulation over the workpiece; and adjusting the electrostatic accumulation, wherein adjusting the electrostatic accumulation comprises adjusting heights of the electrostatic pads to form a deposited layer with a selected thickness uniformity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:製程工具</p>
        <p type="p">100a:圖</p>
        <p type="p">102:腔室外殼</p>
        <p type="p">104:晶圓</p>
        <p type="p">106:第一磁鐵</p>
        <p type="p">108:第二磁鐵</p>
        <p type="p">110:第三磁鐵</p>
        <p type="p">112:靶材</p>
        <p type="p">114:電源</p>
        <p type="p">116:晶圓吸盤</p>
        <p type="p">117:吸盤基座</p>
        <p type="p">118:ESC電路</p>
        <p type="p">120:墊部</p>
        <p type="p">122:基部</p>
        <p type="p">124,124a,124b:基部結構/基座結構</p>
        <p type="p">126,126a,126b:接觸墊</p>
        <p type="p">130:快門管</p>
        <p type="p">132:氣體/氧氣</p>
        <p type="p">140:模組</p>
        <p type="p">x,y:平面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="844" publication-number="202625800">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625800</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117768</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體記憶裝置及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W20/00</main-classification>
        <further-classification edition="202501120260302B">H10D84/80</further-classification>
        <further-classification edition="202601120260302B">H10D88/00</further-classification>
        <further-classification edition="202301120260302B">H10B99/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>那波恭介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANAMI, KYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種於將積層構造之犧牲層置換為導電材料之步驟中抑制絕緣層之彎曲之記憶體。記憶體具備於第1方向上交替地積層複數個電極膜與複數個第1絕緣膜而成之積層體。第1柱狀體包含沿第1方向貫通積層體而設置之半導體層，且於與複數個電極膜中之1者之交叉部分形成記憶胞。複數個第1柱部沿第1方向貫通積層體，且包含絕緣材料。複數個第2柱部沿第1方向貫通積層體，且包含導電材料，與複數個電極膜各自對應並電性連接。與第1方向垂直之面內之複數個第2柱部之寬度，以複數個電極膜中與複數個第2柱部各自連接之連接電極膜為界，於第1方向上位於較該連接電極膜更靠上方之柱上部與第1方向上位於較該連接電極膜更靠下方之柱下部之間不相同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2c:接觸區域</p>
        <p type="p">20:積層體</p>
        <p type="p">21:電極膜</p>
        <p type="p">21_1,21_3,21_6:連接電極膜</p>
        <p type="p">21c,22,25:絕緣膜</p>
        <p type="p">BLK:阻擋膜</p>
        <p type="p">CC,CC1,CC3,CC6:接觸插塞</p>
        <p type="p">CC1L,CC3L,CC6L:柱下部</p>
        <p type="p">CC1U,CC3U,CC6U:柱上部</p>
        <p type="p">HR:支持柱</p>
        <p type="p">SP:間隔件</p>
        <p type="p">W1L,W1U,W3L,W3U,W6L,W6U,Whr:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="845" publication-number="202625567">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625567</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117773</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及製造半導體裝置的方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251201B">H10B99/00</main-classification>
        <further-classification edition="202501120251201B">H10D89/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭朝元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHAO YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊耀仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YAO-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃家恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIA-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江庭瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, TING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種實施例半導體裝置，包括記憶體單元陣列、用以承載用於記憶體單元陣列的一組記憶體單元的操作的第一控制信號的第一導電結構、及電耦接至第一導電結構並用以承載用於記憶體單元陣列的該組記憶體單元的操作的第一控制信號的第二導電結構。該組記憶體單元中之記憶體單元沿著第一水平方向配置。第一導電結構及第二導電結構沿著第一水平方向延伸。第一導電結構與第二導電結構在第二水平方向上、在垂直方向上、或在第二水平方向及垂直方向兩者上間隔開。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An embodiment semiconductor device includes a memory cell array, a first conductive structure configured to carry a first control signal for an operation of a set of memory cells of the memory cell array, and a second conductive structure electrically coupled to the first conductive structure and configured to carry the first control signal for the operation of the set of memory cells of the memory cell array. Memory cells of the set of memory cells are arranged along a first horizontal direction. The first conductive structure and the second conductive structure extend along the first horizontal direction. The first conductive structure and the second conductive structure are spaced apart in a second horizontal direction, in a vertical direction, or both.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1100:方法</p>
        <p type="p">1110、1120、1130:方塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="846" publication-number="202624978">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624978</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117777</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>集線器及其操作方法</chinese-title>
        <english-title>HUB AND OPERATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250908B">G06F13/38</main-classification>
        <further-classification edition="200601120250908B">G06F1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>育暘機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GEARMAX CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巫宗勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, TSING-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫俊瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEN, CHUN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡松寰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, SUNG-HUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">集線器具有耦接第一電子裝置的第一連接端、耦接電源裝置的第二連接端、耦接第二電子裝置的第三連接端、用以檢測第一電子裝置電流和電壓資訊的第一檢測單元、用以檢測電源裝置電流和電壓資訊的第二檢測單元、用以檢測第二電子裝置電流和電壓資訊的第三檢測單元以及耦接第一檢測單元、第二檢測單元以及第三檢測單元的控制單元，可根據電源裝置的電流和電壓資訊以及第二電子裝置的電流和電壓資訊，產生電源裝置的可提供功率以及第二電子裝置的需求功率，以根據需求功率動態分配可提供功率給第二電子裝置以及第一電子裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The hub has a first connection end coupled to the first electronic device, a second connection end coupled to the power supply device, a third connection end coupled to the second electronic device, a first detection unit for detecting current and voltage information of a first electronic device, a second detection unit for detecting current and voltage information of a power supply device, a third detection unit for detecting current and voltage information of a second electronic device, and a control unit coupled to the first detection unit, the second detection unit and the third detection unit. The control unit can generate the available power of the power supply device and the required power of the second electronic device according to the current and voltage information of the power supply device and the current and voltage information of the second electronic device, so as to dynamically allocate the available power according to the required power to the second electronic device and the first electronic device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:通用序列匯流排C型集線器</p>
        <p type="p">101:第一連接端</p>
        <p type="p">102:第二連接端</p>
        <p type="p">103:第三連接端</p>
        <p type="p">104:第四連接端</p>
        <p type="p">201:第一檢測單元</p>
        <p type="p">202:第二檢測單元</p>
        <p type="p">203:第三檢測單元</p>
        <p type="p">204:第四檢測單元</p>
        <p type="p">205:保護元件</p>
        <p type="p">206:控制單元</p>
        <p type="p">210、230以及240:電子裝置</p>
        <p type="p">220:電源裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="847" publication-number="202625139">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625139</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118006</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示系統的顯示方法和顯示系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120251001B">G09G3/32</main-classification>
        <further-classification edition="200601120251001B">G09G3/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商硅谷數模（蘇州）半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANALOGIX (SUZHOU) SEMICONDUCTOR CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商硅谷數模國際有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANALOGIX INTERNATIONAL LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭志惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, ZHIHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉志斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, ZHIBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙詣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種顯示系統的顯示方法和顯示系統。該方法包括：主機接收主從機選擇訊號至主機，並回應於接收到的主從機選擇訊號，將生成的參考時鐘訊號發送至從機，從機為多個時序控制晶片中除主機的其他時序控制晶片；在顯示螢幕的觸控模式下，主機發送行/幀同步訊號至從機，從機回應於接收到的行/幀同步訊號，控制與主機同步向顯示螢幕傳輸資料，以使得顯示螢幕的任意兩個顯示區域同步顯示；在顯示螢幕的非觸控模式下，主機和從機根據參考時鐘訊號同步驅動行/幀同步訊號，以使得各主機同步向顯示螢幕傳輸資料，從而使得顯示螢幕的任意兩個顯示區域同步顯示，該方法解決了先前技術中不能滿足高解析度和高刷新率的顯示螢幕的正確顯示的問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S201、S202、S203:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="848" publication-number="202624694">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624694</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118057</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光軸偏移量量測方法</chinese-title>
        <english-title>METHOD OF MEASURING OFFSET OF OPTICAL AXIS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">G01B11/27</main-classification>
        <further-classification edition="200601120260304B">G01M11/00</further-classification>
        <further-classification edition="200601120260304B">G06F17/10</further-classification>
        <further-classification edition="201701120260304B">G06T7/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>明泰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALPHA NETWORKS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪維毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, WEI-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王照熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHAO HSI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊靖安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHING-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光軸偏移量量測方法，適用於量測一成像系統的一光軸偏移量，該成像系統包括一鏡頭及一影像感應器，並用於拍攝設置於一拍攝面的一個中心標記、及兩個位於該中心標記之兩側的外側標記，該光軸偏移量量測方法包含以下步驟：(A)該成像系統以一入瞳位置為旋轉中心被旋轉一目標角度，以使該中心標記成像於一影像的一中心；(B)該運算裝置根據該成像系統的一可視範圍角度，及該影像中該二外側標記分別與該中心之距離，獲得該目標角度之角度值；及(C)該運算裝置根據該目標角度之角度值及該成像系統的一有效焦距，獲得該成像系統的該光軸偏移量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of measuring offset of optical axis is used to measure offset of optical axis of an imaging system. The imaging system includes a lens and an image sensor and is used for capturing a center mark and two outer marks arranged on a shooting surface. The outer marks are located on both sides of the center mark. The method of measuring offset of optical axis includes: (A) the imaging system being rotated by a target angle with an entrance pupil position as the rotation center, so that the center mark is imaged at a center of an image; (B) by the computing device, obtaining the angle value of the target angle based on a field of view of the imaging system and the distance between the outer marks and the center in the image; and (C) by the computing device, obtaining offset of optical axis of the imaging system based on the angle value of the target angle and an effective focal length of the imaging system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">201~206:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="849" publication-number="202624019">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624019</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118124</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>三倉高效轉倉式印製板真空塞孔機及印製板輸送方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251124B">B41F15/08</main-classification>
        <further-classification edition="200601120251124B">B41F15/14</further-classification>
        <further-classification edition="200601120251124B">B41F15/18</further-classification>
        <further-classification edition="200601120251124B">B65G47/90</further-classification>
        <further-classification edition="200601120251124B">H05K3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商蘇州晟豐電子科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李明揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏洪偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>乙端陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃龍尖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明屬於印刷設備的技術領域，具體涉及三倉高效轉倉式印製板真空塞孔機及印製板輸送方法，包括殼體，殼體具有印刷倉、入料倉和出料倉，加工台位於印刷倉內；入料倉、出料倉均位於印刷倉的頂部，入料倉、出料倉均具有底部倉口以及頂部倉口；還包括與入料倉、出料倉一一對應的上蓋以及位於印刷倉內的入料裝置、出料裝置、移載裝置；入料裝置與入料倉上下正對，出料裝置與出料倉上下正對，入料裝置、出料裝置均包括用於放置印製板的升降台；移載裝置用於在入料裝置的升降台與加工台之間、出料裝置的升降台與加工台之間輸送印製板。入料倉、出料倉所需容積較小，抽真空所需的時間較短，真空塞孔機的整體印刷效率更高。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:殼體</p>
        <p type="p">101:機架</p>
        <p type="p">102:機罩</p>
        <p type="p">104:入料倉</p>
        <p type="p">105:出料倉</p>
        <p type="p">400:入料倉封閉裝置</p>
        <p type="p">500:出料倉封閉裝置</p>
        <p type="p">700:放料裝置</p>
        <p type="p">800:取料裝置</p>
        <p type="p">900:真空機組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="850" publication-number="202623792">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623792</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118278</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於處理甲癬的包含次氯酸的合成物</chinese-title>
        <english-title>COMPOSITION COMPRISING HYPOCHLOROUS ACID FOR USE IN THE TREATMENT OF ONYCHOMYCOSIS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251204B">A61K31/185</main-classification>
        <further-classification edition="200601120251204B">C01B11/04</further-classification>
        <further-classification edition="200601120251204B">A61P31/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商雅各臣貿易有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JACOBSON VAN DEN BERG (CHINA) LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　國明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM, KWOK-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林明璇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種在用於處理甲癬的包含次氯酸的合成物，包括：約1至50,000ppm的次氯酸；pH調整劑以調整合成物的pH到2至9；以及水。優選地，合成物包括100至200ppm的次氯酸。優選地，合成物包括240ppm以下的pH調整劑。優選地，pH調整劑調整合成物的pH到5至6.5。優選地，pH調整劑包括碳酸鈉、碳酸氫鈉和氫氧化鈣的其中一種。該次氯酸可抑制或殺死紅色毛癬菌、白色念珠菌、鐮孢菌屬、麴黴屬、枝頂孢黴屬、柱頂孢黴屬和短柄帚黴及其他有潛在風險引致灰甲的的真菌菌株和其孢子，因此有效處理灰指甲內的真菌及孢子和其他引致灰甲的病菌，避免灰甲反覆復發，為患者帶來徹底的解決方案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="851" publication-number="202625623">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625623</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118384</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>得到改善的可彎曲射線探測器</chinese-title>
        <english-title>IMPROVED BENDABLE RADIATION DETECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10F30/00</main-classification>
        <further-classification edition="200601120260302B">G01T1/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商迪愛股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DRTECH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文範鎭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOON, BEOM JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金炯植</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HYEONG SIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉用哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIL, YONG CHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈賢燮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIM, HYUN SUP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金起範</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KI BEOM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開涉及通過檢測射線來生成相應輸出信號的射線探測器。射線探測器包括TFT組件，TFT組件包括：TFT陣列，包括根據所檢測到的射線的強度分別生成輸出信號的多個像素TFT電路以及被配置為可以施加用於驅動多個像素TFT電路的柵極信號的柵極電路；柵極連接電纜，包括與柵極電路進行電連接的線路；以及讀出電路，被配置為可以接收在多個像素TFT電路生成的輸出信號，並向外部傳遞，柵極連接電纜及讀出電路配置於射線探測器的相同的邊或相向的邊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:基板</p>
        <p type="p">110:TFT組件</p>
        <p type="p">13:TFT陣列</p>
        <p type="p">15:電荷收集部</p>
        <p type="p">17:光導層</p>
        <p type="p">18:絕緣層</p>
        <p type="p">19:上電極</p>
        <p type="p">21:電源</p>
        <p type="p">23:多個像素TFT電路</p>
        <p type="p">231:儲存電容器</p>
        <p type="p">233:TFT開關元件</p>
        <p type="p">235:閘極線</p>
        <p type="p">237:數據線</p>
        <p type="p">250:閘極電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="852" publication-number="202623896">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623896</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118465</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙重中空構造蛋黃蛋殼型奈米粒子</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120260302B">B01J35/53</main-classification>
        <further-classification edition="202401120260302B">B01J35/39</further-classification>
        <further-classification edition="200601120260302B">B01J23/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人東京科學大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INSTITUTE OF SCIENCE TOKYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張坐福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, TSO-FU MARK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曽根正人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONE, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐雍鎣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YUNG-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡本敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMOTO, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種蛋黃蛋殼型奈米粒子，其可作為光觸媒發揮功能，且高效率地製造氫氣，上述光觸媒不僅可利用紫外線、可見光，還可利用近紅外光。  &lt;br/&gt;本發明藉由雙重中空構造蛋黃蛋殼型奈米粒子而解決問題，上述雙重中空構造蛋黃蛋殼型奈米粒子包含：第一外殼部；第一中空部，其形成於上述第一外殼部內；及中空金奈米粒子，其存在於上述第一中空部內，包含第二外殼部及形成於上述第二外殼部內之第二中空部，上述中空金奈米粒子之上述第二中空部之直徑為30 nm以上100 nm以下，且上述第二外殼部之厚度為2 nm以上10 nm以下，上述第一外殼部包含金屬硫化物及/或金屬氧化物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第一外殼部</p>
        <p type="p">2:第一中空部</p>
        <p type="p">3:第二外殼部</p>
        <p type="p">4:第二中空部</p>
        <p type="p">10:蛋黃蛋殼型奈米粒子</p>
        <p type="p">11:中空金奈米粒子</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="853" publication-number="202625499">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625499</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118470</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發光二極體驅動裝置及其產生驅動訊號之方法</chinese-title>
        <english-title>LIGHT EMITTING DIODE DRIVING DEVICE AND METHOD FOR GENERATING DRIVING SIGNAL THEREFOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260302B">H05B45/10</main-classification>
        <further-classification edition="202001120260302B">H05B45/37</further-classification>
        <further-classification edition="202201120260302B">H05B45/59</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金旻宣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MIN SEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商格勒本科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLOBAL TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金永勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YOUNG HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙啓鈺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, GEA OK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金旻宣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MIN SEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">利用(M＋N)位元之控制訊號之發光二極體驅動裝置可包括：一Σ-Δ調變部，其接收所述M位元之控制訊號而產生1位元之一調變訊號；一第一加總部，其將所述N位元之控制訊號中之N1位元之控制訊號與所述調變訊號加總而產生一第一加總訊號；以及一驅動部，其接收所述第一加總訊號而產生一驅動訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:發光二極體驅動裝置</p>
        <p type="p">110:Σ-Δ調變部</p>
        <p type="p">111:量子化器</p>
        <p type="p">112:回饋訊號產生器</p>
        <p type="p">113:第二加總器</p>
        <p type="p">120:第一加總部</p>
        <p type="p">130:驅動部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="854" publication-number="202625844">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625844</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118493</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W72/00</main-classification>
        <further-classification edition="202601120260302B">H10W72/20</further-classification>
        <further-classification edition="202601120260302B">H10W72/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長谷川一磨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASEGAWA, KAZUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青木秀夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOKI, HIDEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金野司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONNO, TSUKASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種能夠有效利用在半導體元件上形成的區域的半導體裝置及其製造方法。  &lt;br/&gt;　　根據一個實施形態，半導體裝置具備至少一個的半導體晶片，其具有第一晶片、第二晶片以及第三晶片。  &lt;br/&gt;　　第二晶片是在第一晶片上面上的第一區域上與第一晶片接合，以使和第一晶片電性連接，且具有比第一晶片面積小的面積。  &lt;br/&gt;　　第三晶片是在第一晶片上面上的第二區域上與第一晶片接合，以使和第一晶片電性連接，且具有比第一晶片面積小的面積，並具有與第二晶片不同的電性功能的電性功能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體裝置</p>
        <p type="p">10:配線基板</p>
        <p type="p">11:配線層</p>
        <p type="p">13:金屬凸塊</p>
        <p type="p">14:阻焊層</p>
        <p type="p">15:絕緣層</p>
        <p type="p">20,30~33:半導體晶片</p>
        <p type="p">40~43:接著層</p>
        <p type="p">80:樹脂層</p>
        <p type="p">90:打線</p>
        <p type="p">91:封裝樹脂</p>
        <p type="p">F1:面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="855" publication-number="202623916">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623916</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118667</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含有塊狀銅線屑之處理對象物之處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260302B">B09B3/30</main-classification>
        <further-classification edition="202201120260302B">B09B3/40</further-classification>
        <further-classification edition="200601120260302B">B07B1/28</further-classification>
        <further-classification edition="200601120260302B">B07B1/46</further-classification>
        <further-classification edition="202201320260302B">B09B101/15</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＸ金屬股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JX ADVANCED METALS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青木勝志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOKI, KATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠抑制處理對象物中含有之塊狀銅線屑之滯留的處理方法。  &lt;br/&gt;本發明係一種含有銅線屑及不鏽鋼（stainless）屑或鋁屑之處理對象物之處理方法，其包括：運送上述處理對象物，並同時使用具有複數個梳齒之梳齒狀第1振動篩進行篩分，藉此將上述銅線屑中之塊狀銅線屑擋止於上述梳齒狀之篩上；上述第1振動篩之複數個梳齒之間隔W&lt;sub&gt;1&lt;/sub&gt;為15～50 mm。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第1振動篩</p>
        <p type="p">11:梳齒</p>
        <p type="p">L&lt;sub&gt;1&lt;/sub&gt;:長度</p>
        <p type="p">W&lt;sub&gt;1&lt;/sub&gt;:間隔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="856" publication-number="202625825">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625825</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118723</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體封裝、半導體晶粒及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DIE AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260313B">H10W42/60</main-classification>
        <further-classification edition="202601120260313B">H10W20/20</further-classification>
        <further-classification edition="202501120260313B">H10D89/60</further-classification>
        <further-classification edition="202601120260313B">H10W70/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊上逸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHANG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張子恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, TZU-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體封裝包括至少第一晶粒。第一晶粒包括設置在基板上的內部電路、設置在基板上但與內部電路橫向間隔並包括第一電荷耗散元件的靜電放電(ESD)保護電路、及橫向相鄰的第一矽控制整流器(SCR)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor package includes at least a first die. The first die includes an internal circuit disposed on a substrate, an electrostatic discharge (ESD) protection circuit disposed on the substrate but laterally spaced from the internal circuit and including a first charge dissipation element, and a first Silicon Controlled Rectifier (SCR) laterally adjacent to and spaced from the first charge dissipation element.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:第一晶粒/頂部晶粒</p>
        <p type="p">104:第二晶粒/底部晶粒</p>
        <p type="p">201,207:基板</p>
        <p type="p">201F:主表面</p>
        <p type="p">350A,350B:SCR結構</p>
        <p type="p">360A,360B:內部電路</p>
        <p type="p">500:封裝</p>
        <p type="p">511,521:金屬導線</p>
        <p type="p">513,523:通孔</p>
        <p type="p">531,533:金屬焊盤</p>
        <p type="p">551:介電層</p>
        <p type="p">553:介電晶粒</p>
        <p type="p">D1,D2:汲極</p>
        <p type="p">G1,G2:閘極</p>
        <p type="p">S1,S2:源極</p>
        <p type="p">T1,T2:半導體裝置或部件/電晶體</p>
        <p type="p">VSS_A,VSS_B:第一電源線</p>
        <p type="p">VDD_A,VDD_B:第二電源線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="857" publication-number="202625604">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625604</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118748</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURES AND METHODS FOR FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251103B">H10D64/01</main-classification>
        <further-classification edition="202501120251103B">H10D30/01</further-classification>
        <further-classification edition="202501120251103B">H10D64/27</further-classification>
        <further-classification edition="202501120251103B">H10D64/66</further-classification>
        <further-classification edition="202501120251103B">H10D30/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃偵晃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHEN-HUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>殷立煒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIN, LI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉國慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KUO-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳嘉仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, RYAN CHIA-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了半導體結構和製造半導體結構的方法。方法包括在第一裝置區域和第二裝置區域中：在中介層上方形成半導體層；在半導體層和中介層上蝕刻溝槽；形成橫向鄰近溝槽的內間隔物；並去除中介層。方法還包括用遮罩覆蓋第二裝置區域，以及在第一裝置區域中橫向凹陷內間隔物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are semiconductor structures and methods for fabricating semiconductor structures. A method includes, in a first device region and in a second device region: forming a semiconductor layer over an interposer layer; etching a trench through the semiconductor layer and interposer layer; forming an inner spacer laterally adjacent to the trench; and removing the interposer layer. The method further includes covering the second device region with a mask, and recessing the inner spacer laterally in the first device region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">216:磊晶層</p>
        <p type="p">230:側壁間隔物</p>
        <p type="p">400:內間隔物</p>
        <p type="p">800:結構</p>
        <p type="p">D1:臨界尺寸</p>
        <p type="p">D2:臨界尺寸</p>
        <p type="p">D3:臨界尺寸</p>
        <p type="p">Y:方向</p>
        <p type="p">Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="858" publication-number="202625178">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625178</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118916</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>內部錯誤檢查電路和記憶體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250602B">G11C7/24</main-classification>
        <further-classification edition="200601120250602B">G11C29/08</further-classification>
        <further-classification edition="200601120250602B">G06F11/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商長鑫科技集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CXMT CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹堪宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAO, KANYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高恩鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, ENPENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫見鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, JIANPENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開提供了一種內部錯誤檢查電路，包括：時脈生成電路，回應於自刷新使能訊號生成並輸出自刷新時脈訊號；內部命令生成電路，在錯誤檢查使能訊號指示內部錯誤檢查功能開啟時對自刷新時脈訊號進行計數，並在自刷新時脈訊號的計數值為第一預設值時生成並輸出一個內部錯誤檢查命令訊號；位址生成電路，對內部錯誤檢查命令訊號進行計數以生成並輸出內部錯誤檢查位址；控制邏輯電路，響應於內部錯誤檢查命令訊號，控制糾錯電路依次對多個儲存陣列中內部錯誤檢查位址對應的目標儲存單元執行一次內部讀-修改-寫操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:內部錯誤檢查電路</p>
        <p type="p">11:時脈生成電路</p>
        <p type="p">12:內部命令生成電路</p>
        <p type="p">13:位址生成電路</p>
        <p type="p">14:控制邏輯電路</p>
        <p type="p">15:儲存陣列</p>
        <p type="p">16:糾錯電路</p>
        <p type="p">SR_EN:自刷新使能訊號</p>
        <p type="p">SR_CLK:自刷新時脈訊號</p>
        <p type="p">IMWR_EN:錯誤檢查使能訊號</p>
        <p type="p">IMWRAB:內部錯誤檢查命令訊號</p>
        <p type="p">IMWR_AD:內部錯誤檢查位址</p>
        <p type="p">IRD/IWR:內部訊號</p>
        <p type="p">RD_Data:儲存資料</p>
        <p type="p">WR_Data:校正資料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="859" publication-number="202625171">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625171</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118959</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體裝置</chinese-title>
        <english-title>MEMORY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251008B">G11C5/14</main-classification>
        <further-classification edition="202501120251008B">H10D62/10</further-classification>
        <further-classification edition="202501120251008B">H10D64/20</further-classification>
        <further-classification edition="200601120251008B">H02M3/156</further-classification>
        <further-classification edition="200601120251008B">H03M1/12</further-classification>
        <further-classification edition="200601120251008B">G05F3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂承翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHENG HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李嘉富</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIA-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體裝置包括：一記憶體陣列；一類比偏壓產生電路，其用以產生至少一個類比偏壓且供應該至少一個類比偏壓至該記憶體陣列；一指示器電路，其用以提供指示該記憶體陣列之一參數的一參數信號；及一控制電路，其用以響應於由該指示器電路提供的該參數信號調整該類比偏壓產生電路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory device includes a memory array, an analog bias generating circuit configured to generate at least one analog bias and supply the at least one analog bias to the memory array, an indicator circuit configured to provide a parameter signal indicating a parameter of the memory array, and a control circuit configured to adjust the analog bias generating circuit in response to the parameter signal provided by the indicator circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:記憶體裝置</p>
        <p type="p">101,102~10J:記憶體巨集</p>
        <p type="p">110:記憶體陣列</p>
        <p type="p">111,112~11J:指示器電路</p>
        <p type="p">111:指示器電路</p>
        <p type="p">120:局部控制電路/記憶體控制器</p>
        <p type="p">121,122~12J:參數信號</p>
        <p type="p">130:全域類比電路</p>
        <p type="p">140:類比偏壓產生電路</p>
        <p type="p">142:偏壓</p>
        <p type="p">150:全域控制電路</p>
        <p type="p">152:輸入信號</p>
        <p type="p">154:控制信號</p>
        <p type="p">BL0~BLm:位元線</p>
        <p type="p">MC:記憶體單元</p>
        <p type="p">WL0~WLn:字線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="860" publication-number="202625503">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625503</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118986</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>激發雷射系統、操作激發雷射系統的方法以及操作極紫外線（ＥＵＶ）光刻設備的激發雷射系統的方法</chinese-title>
        <english-title>EXCITATION LASER SYSTEM, METHOD OF OPERATING EXCITATION LASER SYSTEM, AND METHOD OF OPERATING AN EXCITATION LASER SYSTEM OF AN EXTREME ULTRAVIOLET (EUV) PHOTOLITHOGRAPHY APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">H05G2/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂志鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHIH-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張漢龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HAN-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張俊霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHUN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱韋懷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, WEI-HUAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳立銳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LI-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳永光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YUNG-KUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種操作激發雷射系統的方法，包括測量雷射光束的工作功率、判斷工作功率是否低於閾值功率值、光學測量從雷射光束的增益介質發射的光譜以確定增益介質的成分，及根據光學測量調整增益介質的成分。一種裝置包括：光學發射光譜儀，其配置為捕捉從雷射光束的增益介質發射的光譜，以及氣體供應單元，其配置為基於從光譜確定的增益介質的成分來控制對增益介質的氣體供應。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of operating an excitation laser system includes measuring an operating power of a laser beam, determining whether the operating power is below a threshold power value, optically measuring a spectrum of light emitted from a gain medium of the laser beam to determine a composition of the gain medium, and adjusting the composition of the gain medium based on the optical measurement. An apparatus includes an optical emission spectrum meter configured to capture a spectrum of light emitted from a gain medium of a laser beam, and a gas supply unit configured to control a supply of gas to the gain medium based on a composition of the gain medium determined from the spectrum of light</p>
      </isu-abst>
      <representative-img>
        <p type="p">1101,1102,1103,1104,1105:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="861" publication-number="202624989">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624989</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119054</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於數值型資料量化之處理裝置、用於數值型資料反量化之處理裝置及數值型資料量化方法</chinese-title>
        <english-title>PROCESSING DEVICE FOR NUMERICAL DATA QUANTIZATION, PROCESSING DEVICE FOR NUMERICAL DATA DE-QUANTIZATION AND NUMERICAL DATA QUANTIZATION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">G06F17/10</main-classification>
        <further-classification edition="200601120260309B">G06F7/74</further-classification>
        <further-classification edition="201801120260309B">G06F9/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭曉晨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, XIAOCHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克雷夫頓　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CRAFTON, BRIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿卡爾瓦達爾　穆拉特凱雷姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKARVARDAR, MURAT KEREM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樂樂　艾許文桑傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LELE, ASHWIN SANJAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯文昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHWA, WIN-SAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一或多個態樣中，一種用於數值型資料量化的處理裝置包括處理電路，其用以自一組數字之一組數位表示的一組指數確定一最大指數，基於該最大指數獲得一組縮放後指數，且執行以下操作中的一者：(i)基於該組數位表示及該組縮放後指數的一組尾數獲得一組量化有效數，或(ii)基於該組尾數而獲得一組量化尾數。該處理電路用以基於該組量化有效數或基於該組量化尾數及該組縮放後指數輸出該組數字的一組量化數位表示；及基於該最大指數輸出一偏移的指數縮放因子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In one or more aspects, a processing device for numerical data quantization includes processing circuitry configured to determine a maximum exponent from a set of exponents of a set of digital representations of a set of numbers, obtain a set of scaled exponents based on the maximum exponent, and perform one of: (i) obtain a set of quantized significands based on a set of mantissas of the set of digital representations and the set of scaled exponents, or (ii) obtain a set of quantized mantissas based on the set of mantissas. The processing circuitry is configured to output a set of quantized digital representations of the set of numbers, based on the set of quantized significands, or based on the set of quantized mantissas and the set of scaled exponents; and to output a biased exponent scaling factor based on the maximum exponent.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:處理裝置</p>
        <p type="p">110:處理電路</p>
        <p type="p">120:微型縮放量化器/MX量化器</p>
        <p type="p">122:資料</p>
        <p type="p">124:第一部分</p>
        <p type="p">126:第二部分</p>
        <p type="p">130:微型縮放關聯處理器/MX關聯處理器</p>
        <p type="p">132:數值型資料</p>
        <p type="p">140:微型縮放反量化器/MX反量化器</p>
        <p type="p">142:反量化數位表示</p>
        <p type="p">150:後置處理器</p>
        <p type="p">152:後處理資料</p>
        <p type="p">160:記憶體</p>
        <p type="p">162:權重資料</p>
        <p type="p">164:啟動資料</p>
        <p type="p">166:輸出資料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="862" publication-number="202624886">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624886</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119174</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用基於空間處理關鍵處理指示符之加權映圖用於劑量、焦點及疊對之處理控制</chinese-title>
        <english-title>PROCESS CONTROL FOR DOSE, FOCUS, AND OVERLAY USING WEIGHTING MAPS BASED ON SPATIAL PROCESS KPIS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">G03F7/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格羅杰　菲力普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GROEGER, PHILIP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">可基於計量量測及一加權映圖來產生一模型化校正。可根據該加權映圖對該模型化校正與該等計量量測之間的殘差進行加權。可根據在一樣本上產生該等計量量測之一位置，經由該加權映圖對該模型化校正進行加權。該模型化校正可包含劑量、焦點及疊對。可基於該模型化校正來控制一處理工具以控制該劑量、焦點及疊對。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A modeled correction may be generated based on metrology measurements and a weighting map. Residuals between the modeled correction and the metrology measurements may be weighted according to the weighting map. The modeled correction may be weighed via the weighting map according to a position at which the metrology measurements were generated on a sample. The modeled correction may include dose, focus, and overlay. A process tool may be controlled based on the modeled correction to control the dose, focus, and overlay.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:方法</p>
        <p type="p">210:步驟</p>
        <p type="p">220:步驟</p>
        <p type="p">230:步驟</p>
        <p type="p">240:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="863" publication-number="202625687">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625687</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119193</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法及基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P14/60</main-classification>
        <further-classification edition="202601120260302B">H10P50/00</further-classification>
        <further-classification edition="202601120260302B">H10P50/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂口理哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAGUCHI, MICHIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中込健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAGOMI, KEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊島悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUSHIMA, SATORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤幸正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, YUKIMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在透過金屬製的配管向處理容器內供應鹵素系氣體時，抑制在該處理容器內所處理之基板的金屬污染。  &lt;br/&gt;本揭露之基板處理方法係具備下述工序：處理工序，係向供收容基板的處理容器內供應處理氣體以對該基板進行處理；第1工序，係向該處理容器內供應流經金屬製的配管後的鹵素系氣體；以及第2工序，係在該第1工序之前進行，將在用於和該處理工序中構成該配管的金屬一起生成配位化合物的分子中含有氮的鹼性氣體供應到該處理容器內以使其吸附在該處理容器內的壁面，或者吸附在多孔質體或分隔構件，該多孔質體係設置在該配管所形成的流道上，該分隔構件係將該流道在流道方向上分隔且具備使該流道的上游側與下游側連通的多個孔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">W1:晶圓</p>
        <p type="p">10:膜</p>
        <p type="p">11:處理容器</p>
        <p type="p">21:排氣口</p>
        <p type="p">41:配管</p>
        <p type="p">42:供應機構</p>
        <p type="p">51:ClF&lt;sub&gt;3&lt;/sub&gt;分子</p>
        <p type="p">52:Cr化合物</p>
        <p type="p">53:NH&lt;sub&gt;3&lt;/sub&gt;分子</p>
        <p type="p">54:Cr配位化合物</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="864" publication-number="202625680">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625680</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119297</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>面發光半導體雷射元件及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260308B">H10P14/24</main-classification>
        <further-classification edition="202101120260308B">H01S5/11</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商史丹立電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STANLEY ELECTRIC CO.,LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人京都大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYOTO UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小泉朋朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOIZUMI, TOMOAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江本渓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EMOTO, KEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤原崇子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIWARA, TAKAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野田進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NODA, SUSUMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">（a）在基板上形成洞形成準備層；（b）在洞形成準備層形成二維地配置於各個晶格點的洞，從而形成洞形成層；（c）進行第一小面生長來將洞的開口面閉塞；（d）以第一小面生長的生長時間的40%以上的生長時間進行第二小面生長來形成第一埋入層；（e）進行將第一埋入層平坦地埋入的第二埋入層的生長，以形成包括具有與洞對應的氣孔的氣孔層的引導層；（f）在引導層上進行包括活性層的半導體層的結晶生長。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S0、S1、S2、S3、S4:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="865" publication-number="202625855">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625855</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119352</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>設備、功率逆變器裝置、與方法</chinese-title>
        <english-title>APPARATUS, POWER INVERTER DEVICE, AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W72/50</main-classification>
        <further-classification edition="202601120260302B">H10W20/40</further-classification>
        <further-classification edition="202501120260302B">H10D84/82</further-classification>
        <further-classification edition="200601120260302B">H02M7/537</further-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商半導體組件工業公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林承園</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IM, SEUNGWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述一種使用用於半導體晶粒之緊湊封裝的墊上(on-pad)輸入電阻的設備，以及一種用於建構此類設備，及使用此類設備的系統及裝置的方法。設備包括：基材；第一半導體晶粒，其係位於該基材上且實施一第一場效電晶體，該第一場效電晶體具有可藉由一第一閘極墊接取的一閘極端子；及一第二半導體晶粒，其係位於該基材上，且實施一第二場效電晶體，該第二場效電晶體具有可藉由一第二閘極墊接取的一閘極端子。一導電元件係設置以將該第一閘極墊及該第二閘極墊電性耦接至一共用閘極節點，其中一第一電阻器係（在該導電元件與該第一閘極墊之間）耦接至該第一閘極墊，且一第二電阻器係（在該導電元件與該第二閘極墊之間）耦接至該第二閘極墊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Apparatuses using on-pad input resistance for compact packaging of semiconductor dies are described herein, as well as methods for constructing such apparatuses and systems and devices that use them. An example apparatus includes a substrate, a first semiconductor die disposed on the substrate and implementing a first field-effect transistor with a gate terminal accessible by a first gate pad, and a second semiconductor die disposed on the substrate and implementing a second field-effect transistor with a gate terminal accessible by a second gate pad. A conductive element is configured to electrically couple the first gate pad and the second gate pad to a shared gate node with a first resistor coupled to the first gate pad (between the conductive element and the first gate pad) and with a second resistor coupled to the second gate pad (between the conductive element and the second gate pad).</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:設備</p>
        <p type="p">102:基材</p>
        <p type="p">104-1:導電部分</p>
        <p type="p">104-2:導電部分</p>
        <p type="p">104-3:第二金屬層/單一部分</p>
        <p type="p">106-1:第一半導體晶粒</p>
        <p type="p">106-2:第二半導體晶粒</p>
        <p type="p">108:墊</p>
        <p type="p">108-G:閘極墊</p>
        <p type="p">108-S:源極墊</p>
        <p type="p">110:電阻器</p>
        <p type="p">110-1:第一電阻器</p>
        <p type="p">110-2:第二電阻器</p>
        <p type="p">112:導電元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="866" publication-number="202625529">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625529</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119561</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>外殼及其製備方法和電子設備</chinese-title>
        <english-title>HOUSING STRUCTURE, METHOD FOR PREPARAING THE SAME, AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250802B">H05K5/02</main-classification>
        <further-classification edition="200601120250802B">H05K5/04</further-classification>
        <further-classification edition="200601120250802B">H05K7/18</further-classification>
        <further-classification edition="200601120250802B">H05K13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商富聯裕展科技（深圳）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FULIAN YUZHAN PRECISION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鐘雙許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHONG, SHUANG-XU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錢劍雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIAN, JIAN-XIONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孟祥坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENG, XIANG-KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙云虎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, YUN-HU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱小紅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIU, XIAO-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊仁軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, REN-JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羊克北</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, KE-BEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張峻國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JUN-GUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提出一種外殼及其製備方法和電子設備。本申請藉由在金屬複合材料上先形成連通的開孔和開槽，從而得到複合連接件，再將複合連接件設置於框體上，使開孔和框體上的通孔連通，便能形成外殼的按鍵孔。本申請的外殼中，其按鍵孔的孔壁為複合連接件的第一金屬層和框體，第一金屬層和框體的材質相同，具有良好的防水性能和防腐蝕性能。本申請的按鍵孔並非藉由熱鑽工藝形成，因此能避免熱鑽工藝所導致的良率低、成本高、易有外觀缺陷的問題，也能避免熱鑽工藝因側壁的阻擋而導致熱鑽工藝無法實施（干涉）的問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This discovery provides a housing structure, its preparation method, and an electronic device incorporating the same. In this discovery, a composite connector is formed by first creating interconnected through-openings and slots on a metal composite material. The composite connector is then mounted onto a frame structure, aligning the through-openings with corresponding through-holes on the frame to form button apertures in the housing. In the housing design of this application, the aperture walls of the button apertures consist of a first metal layer of the composite connector and the frame structure. Since the first metal layer and the frame are made of the same material, they collectively exhibit excellent waterproof and corrosion-resistant properties. Notably, the button apertures in this discovery are not formed using a thermal drilling process, thereby circumventing issues associated with thermal drilling, such as low yield rates, high costs, and susceptibility to cosmetic defects. Additionally, this approach eliminates the interference problems encountered in thermal drilling, where sidewall obstructions may prevent the process from being implemented effectively.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:外殼</p>
        <p type="p">10:複合連接件</p>
        <p type="p">110:開孔</p>
        <p type="p">120:開槽</p>
        <p type="p">20:框體</p>
        <p type="p">21:底壁</p>
        <p type="p">22:側壁</p>
        <p type="p">220:通孔</p>
        <p type="p">30:輔助構件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="867" publication-number="202624397">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624397</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119687</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08L63/00</main-classification>
        <further-classification edition="200601120260302B">C08G59/68</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/027</further-classification>
        <further-classification edition="200601120260302B">G03F7/031</further-classification>
        <further-classification edition="200601120260302B">G02B6/12</further-classification>
        <further-classification edition="200601120260302B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商味之素股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AJINOMOTO CO., INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉田拓実</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIDA, TAKUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種在光波導的芯層的形成時無需進行顯像步驟，即可製造光傳輸損失較小之光波導的樹脂組成物；包含該樹脂組成物的樹脂片；包含該樹脂組成物之硬化物的光波導；該光波導之製造方法；以及具備該光波導的光電混載基板。一種樹脂組成物，其係包含(A)環氧樹脂、(B)具(甲基)丙烯醯基之化合物及(C)光自由基產生劑的樹脂組成物，其中將波長1310nm下之(A)成分之硬化物的折射率(樹脂組成物包含2種以上之(A)成分時，係基於質量比之各(A)成分之硬化物的折射率的加權平均值)設為n&lt;sub&gt;(A)&lt;/sub&gt;、(B)成分之硬化物的折射率(樹脂組成物包含2種以上之(B)成分時，係基於質量比之各(B)成分之硬化物的折射率的加權平均值)設為n&lt;sub&gt;(B)&lt;/sub&gt;時，滿足n&lt;sub&gt;(A)&lt;/sub&gt;＜n&lt;sub&gt;(B)&lt;/sub&gt;之關係。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:光波導</p>
        <p type="p">100:芯層</p>
        <p type="p">100A:芯層的入射側端</p>
        <p type="p">100B:芯層的出射側端</p>
        <p type="p">100I:芯層與包覆層的界面</p>
        <p type="p">200:包覆層</p>
        <p type="p">300:基板</p>
        <p type="p">L:寬度</p>
        <p type="p">S:間隔</p>
        <p type="p">T:厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="868" publication-number="202625611">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625611</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119754</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構的形成方法</chinese-title>
        <english-title>METHODS OF FORMING SEMICONDUCTOR STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10D84/01</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石哲齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, CHE CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊固峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, KU-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡寬侃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, KUAN-KAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖　思雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, SZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">此方法包括形成第一晶圓和第二晶圓。第一晶圓的形成包括在第一基板上形成第一半導體層，以及在第一半導體層上沉積包含第一頂部的第一介電層。第一介電層包含第一介電材料。第二晶圓的形成包括在第二基板上形成第二半導體層，以及在第二半導體層上沉積包含第二頂部的第二介電層。第二介電層包含不同於第一介電材料的第二介電材料。將第二晶圓接合至第一晶圓以形成複合晶圓，其中第一介電層接合並連接至第二介電層。基於複合晶圓形成互補場效電晶體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes forming a first wafer and a second wafer. The formation of the first wafer comprises forming a first semiconductor layer over a first substrate, and depositing a first dielectric layer comprising a first top portion over the first semiconductor layer. The first dielectric layer comprises a first dielectric material. The formation of the second wafer comprises forming a second semiconductor layer over a second substrate, and depositing a second dielectric layer comprising a second top portion over the second semiconductor layer. The second dielectric layer comprises a second dielectric material different from the first dielectric material. The second wafer is bonded to the first wafer to form a composite wafer, wherein the first dielectric layer is bonded to and joined to the second dielectric layer. A complementary field-effect transistor is formed based on the composite wafer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:製造流程</p>
        <p type="p">202,204,206,208,210:製程</p>
        <p type="p">212,214,216,218,220:製程</p>
        <p type="p">222,224,226,228:製程</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="869" publication-number="202625628">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625628</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119775</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像感測器封裝體及其形成方法</chinese-title>
        <english-title>IMAGE SENSOR PACKAGE AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10F55/10</main-classification>
        <further-classification edition="202601120260302B">H10F39/90</further-classification>
        <further-classification edition="202601120260302B">H10W74/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商半導體組件工業公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧布古班　喬吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUBGUBAN, JORGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅伯特　加布里爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROBERT, GABRIELLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伍爾西　艾瑞克　傑弗瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOOLSEY, ERIC JEFFERY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種影像感測器封裝體可包括：一光學透射蓋體，其包括氮氧化矽層於其上；一影像感測器半導體晶粒，其係透過一黏著劑而耦接至該光學透射蓋體；及至少一個電連接器，其係包括在該影像感測器半導體晶粒中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image sensor package may include an optically transmissive cover including a layer of silicon oxynitride thereon; an image sensor semiconductor die coupled to the optically transmissive cover through an adhesive; and at least one electrical connector included in the image sensor semiconductor die.</p>
      </isu-abst>
      <representative-img>
        <p type="p">12:影像感測器封裝體</p>
        <p type="p">14:影像感測器半導體晶粒</p>
        <p type="p">16:光學透射蓋體</p>
        <p type="p">20:壩</p>
        <p type="p">21:微透鏡</p>
        <p type="p">22:穿矽通孔</p>
        <p type="p">24:焊球</p>
        <p type="p">26:氮氧化矽層；二氧化矽層</p>
        <p type="p">28:最大平坦表面</p>
        <p type="p">30:最大平坦表面</p>
        <p type="p">32:抗反射塗層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="870" publication-number="202625769">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625769</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119830</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於檢測半導體製程工具中雜質的設備和方法</chinese-title>
        <english-title>APPARATUS AND METHODS FOR DETECTING IMPURITIES IN SEMICONDUCTOR PROCESSING TOOLS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P74/00</main-classification>
        <further-classification edition="202001120260302B">G01R31/26</further-classification>
        <further-classification edition="200601120260302B">G01R27/02</further-classification>
        <further-classification edition="200601120260302B">G01R33/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊明達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, MING DA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林駿璿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童國倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUNG, KUO-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李怡蓁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露實施例涉及用於即時檢測半導體製程工具中雜質的設備和方法。即時電磁阻抗和共振頻率行為檢測/分析可以提供半導體製程中特定離子/粒子/化學物質資訊和/或特徵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure relate to apparatus and methods for detecting impurities in semiconductor processing tools in real time. The real time electromagnetic impedance and resonance frequency behavior detection/analysis can provide specific ion/particle/chemical information and/or fingerprint in the semiconductor process.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:雜質監測設備</p>
        <p type="p">102:檢測模組</p>
        <p type="p">104:分析模組</p>
        <p type="p">120:外殼</p>
        <p type="p">122:測試體積</p>
        <p type="p">122o:開口</p>
        <p type="p">124:線圈組件</p>
        <p type="p">126、128:端子</p>
        <p type="p">130:磁鐵組件</p>
        <p type="p">132:法蘭片(flange)部分</p>
        <p type="p">134:側壁部分</p>
        <p type="p">140:控制器</p>
        <p type="p">142:電力系統</p>
        <p type="p">144:數據採集單元</p>
        <p type="p">146:阻抗分析儀</p>
        <p type="p">148:函數產生器</p>
        <p type="p">150:顯示器</p>
        <p type="p">152:預定義數據庫</p>
        <p type="p">154:網路模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="871" publication-number="202624006">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624006</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119847</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物、硬化物、積層體、半導體元件及積層體的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">B32B27/00</main-classification>
        <further-classification edition="200601120260302B">B32B27/34</further-classification>
        <further-classification edition="200601120260302B">C08G73/10</further-classification>
        <further-classification edition="200601120260302B">C08L79/08</further-classification>
        <further-classification edition="200601120260302B">C08K5/20</further-classification>
        <further-classification edition="202601120260302B">H10P95/00</further-classification>
        <further-classification edition="202601120260302B">H10W72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORAY INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野村康大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOMURA, KOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>壽慶将也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUKEI, MASAYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荘司優</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHOJI, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷垣勇剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANIGAKI, YUGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供一種可獲得在將兩個基板接合時兩個基板之間的接著強度大且可靠性高的積層體的樹脂組成物、硬化物、包括硬化物的積層體及包括積層體的半導體元件以及積層體的製造方法。本發明為一種積層體的製造方法，其依次包括步驟（I）、步驟（II）及步驟（III），（B-1）樹脂層及（B-2）樹脂層中的至少一者包含樹脂組成物（D）的硬化物，所述樹脂組成物（D）含有樹脂（E）及溶劑，所述樹脂（E）具有式（1-A）所表示的重複單元及式（1-B）所表示的重複單元中的任一者或兩者，進而，所述樹脂（E）具有式（1-C）所表示的重複單元及式（1-D）所表示的重複單元中的任一者或兩者，在將所述樹脂（E）中所含的全部重複單元設為100 mol%時，所述樹脂（E）中的式（1-A）所表示的重複單元與式（1-B）所表示的重複單元的合計為80 mol%～99 mol%，且所述樹脂（E）中的式（1-C）所表示的重複單元與式（1-D）所表示的重複單元的合計為1 mol%～10 mol%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板主體(矽晶圓等)</p>
        <p type="p">2:(A-1)金屬電極(Cu等)</p>
        <p type="p">3:(B-1)樹脂層</p>
        <p type="p">4:(B-2)樹脂層或(C)無機絕緣層</p>
        <p type="p">5:(A-2)金屬電極(Cu等)</p>
        <p type="p">6:基板主體(矽晶圓等)</p>
        <p type="p">7:第一基板</p>
        <p type="p">8:第二基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="872" publication-number="202624700">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624700</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119864</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>追蹤系統及方法</chinese-title>
        <english-title>TRACKING SYSTEM AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250703B">G01C21/30</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏達國際電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HTC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王有慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YU-TZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陶聖輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAO, SHENG-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種追蹤系統及方法。由該追蹤系統之至少一電子裝置基於一初始位置配置，從一空間地圖資訊中選擇一範圍地圖資料。該至少一電子裝置載入該範圍地圖資料至該至少一電子裝置之一記憶體空間。該至少一電子裝置基於該記憶體空間中之該範圍地圖資料，執行一重新定位運作。該至少一電子裝置響應於完成該重新定位運作，啟動對應該至少一電子裝置之一追蹤運作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A tracking system and method are provided. The at least one electronic device of the tracking system selects a range map data from a spatial map information based on an initial position configuration. The at least one electronic device loads the range map data into a memory space of the at least one electronic device. The at least one electronic device performs a relocalization operation based on the range map data in the memory space. In response to completing of the relocalization operation, the at least one electronic device initiates a tracking operation corresponding to the at least one electronic device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">600:追蹤方法</p>
        <p type="p">S601、S603、S605、S607:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="873" publication-number="202624025">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624025</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119889</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有輻條孔基座環的自行車輪圈及其製作方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250930B">B60B21/06</main-classification>
        <further-classification edition="200601120250930B">B29C70/34</further-classification>
        <further-classification edition="200601120250930B">B29C70/54</further-classification>
        <further-classification edition="200601320250930B">B29L31/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商廈門碳帝複合材料科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉五瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, WURUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肖培龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIAO, PEILONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種具有輻條孔基座環的自行車輪圈及其製作方法，輪圈本體、輻條孔基座環、輻條螺帽與輻條，輪圈本體內開設有環狀的封閉腔室，輻條孔基座環設置在輪圈本體對應封閉腔室的徑向內側的底壁上，輻條孔基座環包括環帶以及設置在環帶上的多個輻條孔基座，輻條孔基座上開設有輻條孔，輻條的牙帽端穿過輻條孔與輻條螺帽進行同軸裝配，輻條孔基座的表面與輻條的軸線方向互相垂直，使得輻條螺帽的安裝方向與輻條的安裝方向相同，能夠避免輻條一側偏移與輻條螺帽接觸擠壓形成折角，從而發生折斷，同時避免輻條另外一側與輻條螺帽不接觸而產生鬆動，導致輻條張力下降，更加省心耐用，同時提高了用戶的騎行安全性，且滿足輪圈輕量化的需求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:輪圈本體</p>
        <p type="p">2:輻條孔基座環</p>
        <p type="p">3:輻條螺帽</p>
        <p type="p">4:輻條</p>
        <p type="p">5:花鼓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="874" publication-number="202625831">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625831</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119966</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置總成及其生產方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE ASSEMBLY AND METHOD FOR PRODUCING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W70/40</main-classification>
        <further-classification edition="202601120260302B">H10W72/50</further-classification>
        <further-classification edition="202601120260302B">H10W72/50</further-classification>
        <further-classification edition="202601120260302B">H10W72/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商半導體組件工業公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林承園</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IM, SEUNGWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白鐘煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAEK, JONGHWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一大致態樣中，一種半導體裝置總成包括一基材、經與基材電氣耦接之一半導體晶粒、及具有經界定貫穿其中的一開口之一導線架部分。導線架部分與基材耦接，使得半導體晶粒設置在開口內。總成進一步包括一導電構件，其具有：一第一部分，其與導線架部分之環繞開口的一表面電氣耦接；及一第二部分，其與半導體晶粒電氣耦接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In a general aspect, a semiconductor device assembly includes a substrate, a semiconductor die electrically coupled with the substrate, and a leadframe portion having an opening defined therethrough. The leadframe portion is coupled with the substrate such that the semiconductor die is disposed within the opening. The assembly further includes a conductive member having a first portion that is electrically coupled with a surface of the leadframe portion bordering the opening; and a second portion that is electrically coupled with the semiconductor die.</p>
      </isu-abst>
      <representative-img>
        <p type="p">105:端子</p>
        <p type="p">110a:端子</p>
        <p type="p">110b:端子</p>
        <p type="p">115:端子</p>
        <p type="p">200:基材總成</p>
        <p type="p">235:半導體晶粒</p>
        <p type="p">300:導線架</p>
        <p type="p">310a:子部分</p>
        <p type="p">400a:導電夾</p>
        <p type="p">400b:導電夾</p>
        <p type="p">600:子總成</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="875" publication-number="202625770">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625770</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120028</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於確定基板表面的特性之方法及設備</chinese-title>
        <english-title>METHODS AND APPARATUS FOR DETERMINING A PROPERTY OF A SUBSTRATE SURFACE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260309B">H10P74/00</main-classification>
        <further-classification edition="200601120260309B">G01N13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐然</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, RAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪　海文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, RAYMOND</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭露了一種用於確定基板表面的特性的方法和一種配置為確定基板的特性的處理腔室。該方法包含將液體流動至旋轉基板，停止流動，以及量測液體層的尾緣在旋轉基板上移動所需的時間以確定該特性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of determining a property of a substrate surface and a processing chamber configured to determine a property of a substrate are disclosed herein. The method includes flowing a liquid onto a rotating substrate, stopping the flow, and measuring a time for a trailing edge of a liquid layer to move across the rotating substrate to determine the property.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102~106:方塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="876" publication-number="202625275">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625275</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120113</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>層壓型電池及層壓型電池的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260302B">H01M10/052</main-classification>
        <further-classification edition="201001120260302B">H01M10/0562</further-classification>
        <further-classification edition="201001120260302B">H01M10/0585</further-classification>
        <further-classification edition="202101120260302B">H01M50/105</further-classification>
        <further-classification edition="202101120260302B">H01M50/119</further-classification>
        <further-classification edition="202101120260302B">H01M50/121</further-classification>
        <further-classification edition="202101120260302B">H01M50/124</further-classification>
        <further-classification edition="202101120260302B">H01M50/133</further-classification>
        <further-classification edition="202101120260302B">H01M50/178</further-classification>
        <further-classification edition="202101120260302B">H01M50/184</further-classification>
        <further-classification edition="202101120260302B">H01M50/186</further-classification>
        <further-classification edition="202101120260302B">H01M50/533</further-classification>
        <further-classification edition="202101120260302B">H01M50/557</further-classification>
        <further-classification edition="202101120260302B">H01M50/586</further-classification>
        <further-classification edition="202101120260302B">H01M50/59</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商科納維股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANADEVIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡本健児</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMOTO, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">層壓型電池（1）包括積層電池（2）、密封劑（3）、以及收容積層電池（2）的層壓型膜（4）。積層電池（2）包括電芯（20）、積層於電芯（20）的集電體（21）、以及極耳（22）。極耳（22）包括與集電體（21）連接的耳片連接部分（221）、以及與耳片連接部分（221）連續且自層壓型膜（4）的周端部突出的引線部分（222）。層壓型膜（4）包括金屬層（41）。另外，在層壓型膜（4）的周端部，密封劑（3）配置於層壓型膜（4）的內周面與引線部分（222）的外周面之間，金屬層（41）的自由端部（411）包括在厚度方向上彎曲的毛邊（412），毛邊（412）相對於引線部分（222）而朝向相反側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:層壓型電池</p>
        <p type="p">2:積層電池</p>
        <p type="p">3:密封劑</p>
        <p type="p">4:層壓型膜</p>
        <p type="p">22A:正極極耳</p>
        <p type="p">22B:負極極耳</p>
        <p type="p">222A:正極引線部分</p>
        <p type="p">222B:負極引線部分</p>
        <p type="p">E1、E2、E3、E4、e1、e2、e3、e4:邊緣</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="877" publication-number="202625795">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625795</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120155</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路結構及其形成方法</chinese-title>
        <english-title>INTEGRATED CIRCUIT STRUCTURE AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W10/00</main-classification>
        <further-classification edition="202601120260302B">H10P50/00</further-classification>
        <further-classification edition="202601120260302B">H10P10/00</further-classification>
        <further-classification edition="202601120260302B">H10W76/42</further-classification>
        <further-classification edition="202501120260302B">H10D62/10</further-classification>
        <further-classification edition="202501120260302B">H10D62/40</further-classification>
        <further-classification edition="202501120260302B">H10D64/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商台積電（南京）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSMC NANJING COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>季寶榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JI, BAORONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王昭瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHAO-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種方法包括以下步驟。在半導體基板中形成溝槽。用溝槽填充材料填充該溝槽。該溝槽填充材料具有自該溝槽填充材料的頂表面凹陷的凹陷區域。在該半導體基板及該溝槽填充材料上方沈積高k介電層。自該溝槽填充材料的該凹陷區域移除該高k介電層的第一部分，同時在該半導體基板上方留下該高k介電層的第二部分。閘極結構位於該高k介電層的該第二部分上方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes following steps. A trench is formed in a semiconductor substrate. The trench is filled with a trench filler material. The trench filler material has a recessed region recessed from a top surface of the trench filler material. A high-k dielectric layer is deposited over the semiconductor substrate and the trench filler material. A first portion of the high-k dielectric layer is removed from the recessed region of the trench filler material, while leaving a second portion of the high-k dielectric layer over the semiconductor substrate. A gate structure is over the second portion of the high-k dielectric layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:基板</p>
        <p type="p">102A:第一區域</p>
        <p type="p">108:STI填充材料</p>
        <p type="p">120A、120B:高k閘極介電層</p>
        <p type="p">130B:閘極結構</p>
        <p type="p">132、134:功函數金屬層</p>
        <p type="p">132L:下部分</p>
        <p type="p">132U:上部分</p>
        <p type="p">136:填充金屬層</p>
        <p type="p">GT2:閘極溝槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="878" publication-number="202625845">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625845</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120166</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路元件及其製造方法</chinese-title>
        <english-title>INTEGRATED CIRCUIT DEVICE AND FABRICATING METHODS THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W72/00</main-classification>
        <further-classification edition="202601120260302B">H10W20/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商台積電（中國）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSMC CHINA COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周曉鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, XIAOPENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張洪志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, HONGZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, LAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種積體電路（IC）元件，包括：互連層，包括第一互連結構和在第一方向上與第一互連結構間隔開的第二互連結構，第一互連結構和第二互連結構在第一方向上以第一間距佈置；以及鈍化結構，位於第一互連結構和第二互連結構上。鈍化結構包括位於第一互連結構之上的第一凹部、位於第二互連結構之上的第二凹部；以及從第一凹部延伸到第二凹部的傾斜區域。傾斜區域的中間區域的曲率半徑是第一間距的至少0.5倍。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An integrated circuit (IC) device includes an interconnect layer including a first interconnect structure and a second interconnect structure spaced apart from the first interconnect structure in a first direction, the first interconnect structure and the second interconnect structure being arranged at a first pitch in the first direction; and a passivation structure on the first interconnect structure and the second interconnect structure. The passivation structure includes a first recess over the first interconnect structure; a second recess over the second interconnect structure; and a sloped region extending from the first recess to the second recess. A radius of curvature of a middle region of the sloped region is at least 0.5 times the first pitch.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:方法</p>
        <p type="p">310:框</p>
        <p type="p">312:框</p>
        <p type="p">315:框</p>
        <p type="p">317:框</p>
        <p type="p">320:框</p>
        <p type="p">325:框</p>
        <p type="p">330:框</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="879" publication-number="202625002">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625002</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120305</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於對角地切割的半導體邏輯結構的３Ｄ重建的演算法</chinese-title>
        <english-title>ALGORITHM FOR 3D RECONSTRUCTION OF DIAGONALLY CUT SEMICONDUCTOR LOGIC STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260309B">G06F30/30</main-classification>
        <further-classification edition="202601120260309B">G06T11/00</further-classification>
        <further-classification edition="200601120260309B">G06T17/20</further-classification>
        <further-classification edition="201101120260309B">G06T19/20</further-classification>
        <further-classification edition="201701120260309B">G06T7/73</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商應用材料以色列公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS ISRAEL LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施瓦茨　蓋伊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHWARTZ, GUY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉翰　歐荷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAHAD, OHR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>爾多　伊倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ERDAL, ERAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿爾莫格　伊多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALMOG, IDO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞倫　利奧爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YARON, LIOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴景鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHING-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴歐　隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAR-OR, RON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">產生晶圓的結構元件的3D重建的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Method for generating a 3D reconstruction of structural elements of a wafer.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="880" publication-number="202623743">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623743</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120311</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用水裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">A47K13/24</main-classification>
        <further-classification edition="202601120260302B">A61L2/10</further-classification>
        <further-classification edition="202301120260302B">C02F1/32</further-classification>
        <further-classification edition="200601120260302B">E03D11/13</further-classification>
        <further-classification edition="200601120260302B">E03D9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＯＴＯ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOTO LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢岡寿成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAOKA, TOSHINARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雨森彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMEMORI, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松浦貴志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUURA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於提供一種用水裝置，其能夠兼顧除菌部的除菌性能與除菌部的劣化抑制。  &lt;br/&gt;　　用以解決課題之手段為，一種用水裝置，其特徵為具備：照射光線之照射裝置；及除菌部，其藉由前述照射裝置照射的光線進行除菌，前述除菌部具有：直接照射部，其被前述照射裝置照射的直接光所照射；及間接照射部，其被前述照射裝置照射且在前述直接照射部中反射的反射光所照射，前述直接光，其至少在光譜中具有350nm以上450nm以下之間的峰值波長，短波長側輻射束對於前述反射光之輻射束總和的比例，小於短波長側輻射束對於前述直接光之輻射束總和的比例。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="881" publication-number="202624640">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624640</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120319</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>防震裝置</chinese-title>
        <english-title>SEISMIC ISOLATION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">F16F15/22</main-classification>
        <further-classification edition="200601120260302B">H05K5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商八雲股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YACMO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舟木崇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUNAKI, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武内直人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEUCHI, NAOHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於提供一種防震裝置，可使伴隨地震而作用於搭載電腦伺服器等被防震體的機櫃、各類展示櫃等的地震力降低，且藉由裝設於防震裝置的罩體抑制冷氣從防震裝置的周圍洩漏而謀求冷卻的效率化，可防止有妨礙防震裝置的作用之虞的妨礙物侵入防震裝置內，且可防止人員的手指等受傷等。作為本發明的解決手段之防震裝置100係具備：基板3，係設置於OA地板或地板上：第一防震構造體，係由二個防震軌道體110構成，以預定的間隔平行地配置於基板上，且控制Y方向的移動；第二防震構造體，係由二個防震軌道體120構成，於第一防震構造體上以預定的間隔平行地配置而組合成井字框架狀，且控制X方向的移動；頂板4，係設置於第二防震軌道體上；及側面罩體6、6與正面罩體7、7，係於藉由第一防震構造體及第二防震構造體所構成的二層軌道式防震體的外側四面，沿著長度方向分別安裝。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a seismic isolation device that reduces the seismic force caused by an earthquake on racks and various display cases mounted with seismically isolated objects such as computer servers. The device also features covers that prevent cool air from leaking from around the device, improving cooling efficiency, and blocks foreign objects that could impede the operation of the device from entering the device, avoiding injuries to personnel’s fingers and the like. A seismic isolation device 100 according to the present invention includes a base plate 3 installed on an OA floor or a floor; a first seismic isolation structure for controlling movement in the Y direction, which is composed of two seismic isolation rail bodies 110 arranged in parallel on the base plate at a predetermined interval; a second seismic isolation structure for controlling movement in the X direction, which is composed of two seismic isolation rail bodies 120 arranged in parallel at a predetermined interval so as to be combined in a grid pattern on the first seismic isolation structure; a top plate 4 installed on the second seismic isolation structure; and side covers 6, 6 and front covers 7, 7 attached along the length of the four outer surfaces of the two-layer rail-type seismic isolation body composed of the first seismic isolation structure and the second seismic isolation structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:基板</p>
        <p type="p">4:頂板</p>
        <p type="p">5:開口區域</p>
        <p type="p">6:第一罩體(側面罩,罩體)</p>
        <p type="p">7:第二罩體(正面罩,罩體)</p>
        <p type="p">100:防震裝置</p>
        <p type="p">110:Y方向防震軌道體(防震軌道體)</p>
        <p type="p">120:X方向防震軌道體(防震軌道體)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="882" publication-number="202625732">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625732</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120348</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>封裝結構的清洗方法及清洗裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260311B">H10P72/00</main-classification>
        <further-classification edition="200601120260311B">B08B3/04</further-classification>
        <further-classification edition="200601120260311B">B08B11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商盛美半導體設備(上海)股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACM RESEARCH (SHANGHAI), INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王堅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈照偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIA, ZHAOWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸陳華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHENHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提出一種封裝結構的清洗方法及清洗裝置。清洗方法包括如下步驟：向封裝結構噴灑清洗液；對封裝結構所在的腔室抽氣，使腔室內的壓力達到預定壓力，預定壓力為負壓保持封裝結構靜止預定時間，使清洗液進入封裝結構的縫隙中對封裝結構進行清洗。本申請通過先向封裝結構噴灑清洗液，然後抽氣，將封裝結構中被清洗液封存在封裝結構內所殘存的氣體抽出封裝結構，以使封裝結構的每一處縫隙中均充滿清洗液，確保封裝結構的清洗效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1100、S1200、S1300、S1400、S1500:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="883" publication-number="202625199">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625199</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120701</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>測試電路、含有測試電路的記憶體裝置以及記憶體裝置之操作方法</chinese-title>
        <english-title>TEST CIRCUIT AND MEMORY DEVICE INCLUDING THEREOF, AND OPERATION METHOD OF MEMORY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251121B">G11C29/54</main-classification>
        <further-classification edition="200601120251121B">G11C17/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李知洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JISOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種測試電路，其連接至一反熔絲記憶體裝置之一規劃字線及一讀取字線。該測試電路含有：一第一拉動電路，其連接至一第一拉動節點，其中該第一拉動電路被組配成基於一模式選擇信號而電氣式地使該第一拉動節點浮動；一第一測試電晶體，其連接於該第一拉動節點與一中間節點之間，其中該第一測試電晶體之一第一閘極端子連接至該規劃字線；一第二測試電晶體，其連接於該中間節點與一第二拉動節點之間，其中該第二測試電晶體之一第二閘極端子連接至該讀取字線；以及一第二拉動電路，其連接至該第二拉動節點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A test circuit connected to a program wordline and a read wordline of an anti-fuse memory device is provided. The test circuit includes: a first pulling circuit connected to a first pulling node, wherein the first pulling circuit is configured to electrically float the first pulling node based on a mode selection signal; a first test transistor connected between the first pulling node and a middle node, wherein a first gate terminal of the first test transistor is connected to the program wordline; a second test transistor connected between the middle node and a second pulling node, wherein a second gate terminal of the second test transistor is connected to the read wordline; and a second pulling circuit connected to the second pulling node.</p>
      </isu-abst>
      <representative-img>
        <p type="p">MD_PT:規劃保護模式</p>
        <p type="p">MDS:模式選擇信號</p>
        <p type="p">NM:中間節點</p>
        <p type="p">NP1:第一拉動節點</p>
        <p type="p">NP2:第二拉動節點</p>
        <p type="p">PC1:第一拉動電路</p>
        <p type="p">PC2:第二拉動電路</p>
        <p type="p">TC:測試電路</p>
        <p type="p">TL:測試線</p>
        <p type="p">TTR1:第一測試電晶體</p>
        <p type="p">TTR2:第二測試電晶體</p>
        <p type="p">VBIAS:偏壓電壓</p>
        <p type="p">VPASS:導通電壓</p>
        <p type="p">VPGM:規劃電壓</p>
        <p type="p">WL_PGM:規劃字線</p>
        <p type="p">WL_RD:讀取字線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="884" publication-number="202624734">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624734</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120724</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資料收集裝置</chinese-title>
        <english-title>DATA COLLECTING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260221B">G01N21/892</main-classification>
        <further-classification edition="201701120260221B">G06T7/00</further-classification>
        <further-classification edition="202201120260221B">G06V10/25</further-classification>
        <further-classification edition="200601120260221B">H04N7/18</further-classification>
        <further-classification edition="200601120260221B">B65H26/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＭＥＩＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TMEIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平柳渉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRAYANAGI, WATARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供的資料收集裝置係使用於連續地同時進行長條狀的製品的製造及搬送的工廠。該工廠係具有沿著長條狀的前述製品的搬送方向排列設置的複數台攝像機，從複數台攝像機輸出拍攝到製品的狀態的複數個動態圖像資料。該資料收集裝置係具備：通訊部，係收集複數個動態圖像資料；記憶部，係進行複數個動態圖像資料的保存；及控制部，係依據製品的異常發生的檢測，將自異常發生的時刻起回溯預定時間的預定期間的複數個動態圖像資料自動地保存至記憶部。控制部係具有對複數個動態圖像資料進行圖像解析的圖像解析部，根據圖像解析部的解析結果，自動地檢測出複數個動態圖像資料中呈現的製品的缺陷。藉此，提供可在較短的時間內完成異常發生時的原因分析的資料收集裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a data collecting apparatus used in plants where long-shaped products are continuously transported and manufactured, and where a plurality of cameras that output multiple video data capturing conditions of the products are arranged side by side along the direction of product transport. The data collecting apparatus includes a communications unit that collects multiple video data; a storage unit that stores the multiple video data; and a control unit that, upon detecting a product anomaly, automatically stores in the storage unit the multiple video data for a predetermined period starting from the time the anomaly occurs until the predetermined time ends. The control unit includes an image analyzing unit that performs image analysis on the multiple video data. Based on the analysis results of the image analyzing unit, the data collecting apparatus automatically detects product defects captured in the multiple video data, allowing cause analysis to be completed in a short time when an abnormality occurs.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:製品</p>
        <p type="p">4:工廠</p>
        <p type="p">5:攝像機</p>
        <p type="p">6:網路</p>
        <p type="p">10:資料收集裝置</p>
        <p type="p">12:控制部</p>
        <p type="p">14:記憶部</p>
        <p type="p">16:通訊部</p>
        <p type="p">18:操作部</p>
        <p type="p">20:顯示部</p>
        <p type="p">22:圖像解析部</p>
        <p type="p">30:動態圖像資料</p>
        <p type="p">32:製程資料</p>
        <p type="p">TD:搬送方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="885" publication-number="202625433">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625433</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120952</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>智慧眼鏡裝置及回應指示產生方法</chinese-title>
        <english-title>SMART GLASSES DEVICE AND RESPONSE INSTRUCTION GENERATING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120250610B">H04N13/106</main-classification>
        <further-classification edition="201701120250610B">G06T7/00</further-classification>
        <further-classification edition="200601120250610B">G06F3/01</further-classification>
        <further-classification edition="200601120250610B">G06F3/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏達國際電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HTC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韋長華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, CHANG HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林聖成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHENG-CHERNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種智慧眼鏡裝置及回應指示產生方法。該裝置響應於接收一啟動指示，啟動一影像擷取器以於一第一時間區間擷取至少一即時影像。該裝置基於對應一第二時間區間之複數個慣性感測資料之一幅度變化，自該至少一即時影像中決定一目標影像集。該裝置基於對應該目標影像集之一分析結果，產生一回應指示，且該分析結果是基於對應一使用者之一語音提示所產生。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A smart glasses device and a response instruction generating method are provided. In response to receiving a startup instruction, the device activates an image capturing device to capture at least one real-time image in a first time interval. The device determines a target image set from the at least one real-time image based on an amplitude change of a plurality of inertial sensing data corresponding to a second time interval. The device generates a response instruction based on an analysis result corresponding to the target image set, and the analysis result is generated based on a voice prompt corresponding to a user.</p>
      </isu-abst>
      <representative-img>
        <p type="p">600:回應指示產生方法</p>
        <p type="p">S601、S603、S605:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="886" publication-number="202625006">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625006</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120959</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於產生具有電晶體架構的積體電路元件的佈局圖的方法、系統及非暫態電腦可讀取媒體</chinese-title>
        <english-title>METHOD, SYSTEM, AND NON-TRANSITORY COMPUTER-READABLE MEDIUM FOR GENERATING LAYOUT DIAGRAM OF INTEGRATED CIRCUIT DEVICE HAVING TRANSISTOR ARCHITECTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260302B">G06F30/39</main-classification>
        <further-classification edition="202001120260302B">G06F30/30</further-classification>
        <further-classification edition="202601120260302B">H10P70/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張修狀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HSIU-CHUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張湘和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HSIANG-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例係關於一種產生(一積體電路(IC)元件之)一佈局圖之方法，其包含：接收該IC元件之該佈局圖，該IC佈局圖包含具有橫跨一主動區之一第一寬度之一閘極區及沿該第一寬度之一第一位置處之一第一閘極通孔；構建一閘極電阻緊湊網路，其包含由該佈局圖表示之三維電晶體架構之至少四個節點及該至少四個節點之對應者之間的至少五個等效電阻；基於該等等效電阻來判定該閘極區之一有效電阻；及判定該有效電阻是否符合一設計規範。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of generating a layout diagram (of an integrated circuit (IC) device) includes: receiving the layout diagram of the IC device, the IC layout diagram including a gate region having a first width across an active region and a first gate via at a first location along the first width; building a gate-resistance compact network which includes at least four nodes of a three-dimensional transistor architecture represented by the layout diagram and at least five equivalent resistances between corresponding ones of the at least four nodes; determining an effective resistance of the gate region based on the equivalent resistances; and determining compliance of the effective resistance with a design specification.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">110至170:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="887" publication-number="202623846">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623846</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121189</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具備混合元件的乾粉吸入器</chinese-title>
        <english-title>DRY POWDER INHALER WITH A MIXING ELEMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">A61M15/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商維克圖拉傳送裝置有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VECTURA DELIVERY DEVICES LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安德森　凱蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANDERSON, CAELAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　偉安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONG, WEI ANN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塞雷達　萊利奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CEREDA, LELIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種乾粉吸入器，包括：一個或多個劑量的藥粉；一使用者可以從中吸入藥物的出氣口；一空氣通道，以及位於空氣通道中的混合元件。當使用者從出氣口吸入時，藥物隨著氣流流經呼吸道並從出氣口流出。混合元件由三個大致正交的大致圓形盤構成，該等圓形盤共享中心。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a dry powder inhaler comprising: one or more doses of powdered medication; an outlet through which a user may inhale a dose of medication; an airway, and a mixing element located in the airway. When a user inhales on the outlet, medication is entrained in an air flow and flows through the airway and out through the outlet. The mixing element is in the form of three generally orthogonal generally circular discs with a common centre.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:吸入器</p>
        <p type="p">2:蓋</p>
        <p type="p">4:吸嘴</p>
        <p type="p">10:殼體部分</p>
        <p type="p">12:篩孔</p>
        <p type="p">20:下殼體部分</p>
        <p type="p">30:中央部分</p>
        <p type="p">31:刺穿元件</p>
        <p type="p">32:通道</p>
        <p type="p">33:去聚集腔室</p>
        <p type="p">35:混合元件</p>
        <p type="p">40:泡殼</p>
        <p type="p">41:蓋</p>
        <p type="p">42:基座</p>
        <p type="p">43:邊緣</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="888" publication-number="202623883">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623883</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121253</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>純水製造系統的控制方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">B01D61/12</main-classification>
        <further-classification edition="200601120260312B">B01D61/58</further-classification>
        <further-classification edition="202301120260312B">C02F1/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商栗田工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURITA WATER INDUSTRIES LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>港康晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINATO, YASUHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林英夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, HIDEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林一人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, KAZUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邉優</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森田圭一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORITA, KEIICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>景山卓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAGEYAMA, TAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">純水製造系統3具有過濾水槽301、包括泵逆變器305B的供水泵305A及水處理設備，一次純水W2能夠貯存於子槽41中。在水處理設備的後段設置有一次純水W2的壓力計311與位準感知式控制閥312。在子槽41設置有水位計313。另外，在位準感知式控制閥312的前段設置有循環管線314，在所述循環管線314設置有壓力感知式控制閥315。根據一次純水W2向子槽41的供給量來控制泵逆變器305B、位準感知式控制閥312及壓力感知式控制閥315。若為此種純水製造系統的控制方法，則能夠根據用水量來特別控制具有多個槽的系統整體的送水量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">3:一次純水裝置(純水製造系統)</p>
        <p type="p">41:子槽</p>
        <p type="p">301:過濾水槽(被處理水供給源)</p>
        <p type="p">302:送水泵</p>
        <p type="p">303:冷卻器</p>
        <p type="p">304:保安過濾器</p>
        <p type="p">305A:供水泵</p>
        <p type="p">305B:泵逆變器</p>
        <p type="p">306:第一逆滲透膜裝置(水處理設備)</p>
        <p type="p">307:第二逆滲透膜裝置(水處理設備)</p>
        <p type="p">308:膜式脫氣裝置(水處理設備)</p>
        <p type="p">309:電去離子裝置(CDI)(水處理設備)</p>
        <p type="p">311:壓力計</p>
        <p type="p">312:位準感知式控制閥(第一流量調整機構)</p>
        <p type="p">313:水位計</p>
        <p type="p">314:循環管線</p>
        <p type="p">315:壓力感知式控制閥(第二流量調整機構)</p>
        <p type="p">321、331、334:回收管線</p>
        <p type="p">322、332:流量計</p>
        <p type="p">323、333:流量控制閥</p>
        <p type="p">324:回收水槽</p>
        <p type="p">340:回收循環管線</p>
        <p type="p">W1:前處理水(被處理水)</p>
        <p type="p">W2:一次純水(純水、處理水)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="889" publication-number="202624661">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624661</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121366</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氣體燃燒器及搭載有氣體燃燒器之加熱烹調器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120251226B">F24C3/02</main-classification>
        <further-classification edition="200601120251226B">F24C3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商林內股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RINNAI CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>淺井一浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAI, KAZUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於：當液體從火焰口浸入於混合管之流入口側之端部安裝有調節器之氣體燃燒器之內部之情形時，抑制此浸入液體接觸到配置於混合管之流入口之噴嘴。  &lt;br/&gt;本發明，係於一端與具有火焰口之燃燒器主體連接且另一端有開口流入口13a之混合管13中之流入口的略中央，配置氣體供給通路42之前端之噴嘴45。此外，混合管，係軸線方向從燃燒器主體側向流入口側呈水平或向下傾斜，並且於混合管之流入口側之端部安裝有用於調節空氣之流入量之調節器15。此調節器，係具備覆蓋流入口之平面部15a、及從平面部之外緣向混合管側延伸設置成筒狀並外嵌於混合管之筒狀部15b。並且，平面部，係設有於平面部之略中央開口且氣體供給通路之前端側插通之主開口部16a、及於主開口部之下方位置開口之副開口部16b。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">13:小混合管</p>
        <p type="p">13a:流入口</p>
        <p type="p">13b:擴徑部</p>
        <p type="p">13c:下側構件</p>
        <p type="p">13d:上側構件</p>
        <p type="p">13e:凸緣部</p>
        <p type="p">13f:凸部</p>
        <p type="p">15:調節器</p>
        <p type="p">15a:平面部</p>
        <p type="p">15b:筒狀部</p>
        <p type="p">16a:主開口部</p>
        <p type="p">16b:副開口部</p>
        <p type="p">17:貫通孔</p>
        <p type="p">18:缺口</p>
        <p type="p">42:第二分支管</p>
        <p type="p">42a:突條</p>
        <p type="p">45:噴嘴</p>
        <p type="p">45a:噴射孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="890" publication-number="202624392">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624392</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121454</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可固化組成物及經塗佈上覆板</chinese-title>
        <english-title>CURABLE COMPOSITION AND COATED SUPERSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">C08L33/12</main-classification>
        <further-classification edition="200601120260304B">C08L83/04</further-classification>
        <further-classification edition="200601120260304B">C09D133/12</further-classification>
        <further-classification edition="200601120260304B">C09D183/04</further-classification>
        <further-classification edition="200601120260304B">B05D7/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANON KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, KUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉衛軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, WEIJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史塔維克　堤墨希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STACHOWIAK, TIMOTHY BRIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAN, FEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧特加雷德爾　蘇菲亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORTEGA-REIDEL, SOPHIA A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">可固化組成物可包含基本上不含氟之第一反應性丙烯酸酯聚合物、反應性聚矽倍半氧烷、以及溶劑，其中，反應性聚矽倍半氧烷包含羥基及式(1)之結構單元   &lt;br/&gt;　　&lt;img align="absmiddle" height="76px" width="115px" file="ed10026.JPG" alt="ed10026.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，其中，X為烷基、或芳基、或芳基烷基、或含氟烷基、或其任何組合。可固化組成物之黏度可不大於50 mPa･s；  &lt;br/&gt;　　丙烯酸酯聚合物對聚矽倍半氧烷之比率為至少2:1且不大於20:1；以及  &lt;br/&gt;　　可固化組成物之固化層可具有至少75度之水接觸角。可固化組成物適於製造經塗佈上覆板，其中，經塗佈上覆板具有優異的疏水及疏油性質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A curable composition can comprise a first a reactive acrylate polymer being essentially free of fluorine, a reactive polysilsesquioxane, and a solvent, wherein the reactive polysilsesquioxane comprises hydroxyl groups and structure-units of formula (1) &lt;br/&gt;&lt;img align="absmiddle" height="71px" width="135px" file="ed10027.JPG" alt="ed10027.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, wherein X is alkyl, or aryl, or arylalkyl, or fluorine-containing alkyl, or any combination thereof. The viscosity of the curable composition can be not greater than 50 mPa·s; &lt;br/&gt;a ratio of acrylate polymer to the polysilsesquioxane is at least 2:1 and not greater than 20:1; and &lt;br/&gt;a cured layer of the curable composition may have a water contact angle of least 75 degrees. The curable composition is suitable for making a coated superstrate, wherein the coated superstrate has excellent hydrophobic and oleophobic properties.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:經塗佈上覆板</p>
        <p type="p">11:上覆板坯料</p>
        <p type="p">12:固態聚合層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="891" publication-number="202625122">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625122</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121592</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置用積層體、顯示裝置及積層體</chinese-title>
        <english-title>STACKED BODY FOR DISPLAY DEVICE, DISPLAY DEVICE AND STACKED BODY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">G09F9/00</main-classification>
        <further-classification edition="201901120260304B">B32B7/022</further-classification>
        <further-classification edition="201501120260304B">G02B1/14</further-classification>
        <further-classification edition="201501120260304B">G02B1/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大日本印刷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林篤弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, ATSUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高地清弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKACHI, KIYOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀和滋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORI, KAZUSHIGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>籔本和希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YABUMOTO, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中川涼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAGAWA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邉治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, OSAMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種顯示裝置用積層體，其具有：第1積層膜，其具有第1樹脂基材及第1功能層；接合層，其配置於上述第1積層膜之上述第1樹脂基材側之面；及第2積層膜，其配置於上述接合層之與上述第1積層膜為相反側之面，自上述接合層側起依次具有第2功能層及第2樹脂基材；上述第1積層膜及上述接合層可自上述第2積層膜剝離，上述第1功能層之厚度為8 μm以上，上述接合層之厚度未達20 μm，利用下述式(1)算出之A值為0.80×10&lt;sup&gt;-3&lt;/sup&gt; Pa・m&lt;sup&gt;3&lt;/sup&gt;以上2.70×10&lt;sup&gt;-3&lt;/sup&gt; Pa・m&lt;sup&gt;3&lt;/sup&gt;以下。A＝E×h&lt;sup&gt;3&lt;/sup&gt;/12      (1)(E表示上述顯示裝置用積層體之拉伸彈性模數(Pa)，h表示上述顯示裝置用積層體之厚度(m))。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a stacked body for a display device comprising a first stacked film including a first resin substrate and a first functional layer; a joining layer disposed on a first resin substrate side surface of the first stacked film; and a second stacked film disposed on a surface of the joining layer, that is opposite side to the first stacked film, and including a second functional layer and a second resin substrate in this order from a joining layer side, wherein the first stacked film and the joining layer are peelable from the second stacked film; a thickness of the first functional layer is 8 μm or more; a thickness of the joining layer is less than 20 μm; and an A value calculated from the following formula (1) is 0.80 × 10&lt;sup&gt;-3&lt;/sup&gt; Pa•m&lt;sup&gt;3&lt;/sup&gt; or more and 2.70 × 10&lt;sup&gt;-3&lt;/sup&gt; Pa•m&lt;sup&gt;3&lt;/sup&gt; or less. A = E × h&lt;sup&gt;3&lt;/sup&gt;/12 (1) (E indicates a tensile elastic modulus (Pa) of the stacked body for a display device; and h indicates a thickness (m) of the stacked body for a display device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:顯示裝置用積層體</p>
        <p type="p">2:接合層</p>
        <p type="p">10:第1積層膜</p>
        <p type="p">11:第1樹脂基材</p>
        <p type="p">12:第1功能層</p>
        <p type="p">20:第2積層膜</p>
        <p type="p">21:第2樹脂基材</p>
        <p type="p">22:第2功能層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="892" publication-number="202625864">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625864</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121719</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體封裝及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W74/01</main-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
        <further-classification edition="202601120260302B">H10W74/00</further-classification>
        <further-classification edition="202601120260302B">H10W20/49</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜孟哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, MENG-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王博漢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, PO-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭宏瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, HUNG-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一個實施例中，半導體封裝的形成方法包含形成互連結構，其包括由切割線分離的多個晶粒區域，多個晶粒區域的至少一個晶粒區域包括半導體基底和在半導體基底上的佈線結構，佈線結構包括對準標記，對準標記鄰近於切割線。方法包含在佈線結構上方形成鈍化層。方法包含移除鈍化層的部分以暴露對準標記。方法包含執行分離製程以將互連結構分離成個別晶粒。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In an embodiment, a method includes forming an interconnect structure including a plurality of die regions separated by scribe lines, at least one die region of the plurality of die regions including a semiconductor substrate and a routing structure on the semiconductor substrate, the routing structure including an alignment mark, the alignment mark being adjacent to the scribe lines. The method includes forming a passivation layer over the routing structure. The method includes removing a portion of the passivation layer to expose the alignment mark. The method includes performing a singulation process to separate the interconnect structure into individual dies.</p>
      </isu-abst>
      <representative-img>
        <p type="p">52:半導體基底</p>
        <p type="p">54:佈線結構</p>
        <p type="p">56:晶粒區域</p>
        <p type="p">58:密封環結構</p>
        <p type="p">60:切割道、切割道區域</p>
        <p type="p">62:對準標記</p>
        <p type="p">64:焊墊層</p>
        <p type="p">66:導電特徵</p>
        <p type="p">68:鈍化層</p>
        <p type="p">72:開口</p>
        <p type="p">78:分離製程</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="893" publication-number="202624671">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624671</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121755</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>反應裝置以及反應裝置的溫度控制方法</chinese-title>
        <english-title>REACTION APPRATUS AND METHOD FOR COTROLLING TEMPREATURE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260310B">F27B9/36</main-classification>
        <further-classification edition="200601120260310B">F27B9/40</further-classification>
        <further-classification edition="200601120260310B">F27D19/00</further-classification>
        <further-classification edition="200601120260310B">G05D23/30</further-classification>
        <further-classification edition="200601120260310B">B01J19/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本製鋼所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE JAPAN STEEL WORKS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀬尾甲太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, KOTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古木賢一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUKI, KENICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平隼也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIRA, TOSHIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原脇六四</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARAWAKI, MUTSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">反應裝置係具備缸(101)、溫度調節單元(320)、加熱器單元(360)、感測器單元(350)及控制部。加熱器單元(360)係具有：加熱器(111U)、(111D)、(111R)、(111L)，係設於缸(101)的上下左右。感測器單元(350)係具備：溫度感測器，係設於缸(101)的上下左右。溫度調節單元(320)係以溫度感測器的測定溫度成為設定溫度的方式進行回饋控制。於上側的溫度感測器與下側的溫度感測器的溫度差超過臨限值溫度時，根據下側的溫度感測器的測定溫度變更下側的溫度調節器、右側的溫度調節器及左側的溫度調節器的設定溫度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">101:缸</p>
        <p type="p">109:驅動馬達</p>
        <p type="p">110,120,130,140:溫度控制區域</p>
        <p type="p">111D,111L,111R,111U,121D,121L,121R,121U,131D,131L,131R,131U,141D,141L,141R,141U:加熱器</p>
        <p type="p">112D,112L,112R,112U,122D,122L,122R,122U,132D,132L,132R,132U,142D,142L,142R,142U:溫度感測器</p>
        <p type="p">150:溫度控制裝置</p>
        <p type="p">310:控制部</p>
        <p type="p">320:溫度調節單元</p>
        <p type="p">321:溫度調節器</p>
        <p type="p">340:加熱器驅動單元</p>
        <p type="p">341:加熱器驅動部</p>
        <p type="p">350:感測器單元</p>
        <p type="p">360:加熱器單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="894" publication-number="202623726">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623726</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121805</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>滑件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250902B">A44B19/06</main-classification>
        <further-classification edition="200601120250902B">A44B19/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＹＫＫ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YKK CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山岸宏次</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGISHI, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南保賢志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANBO, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋諒太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之滑件(1)具有滑件主體(10)，該滑件主體(10)具備上翼板(20)及下翼板(30)，於上翼板(20)及/或下翼板(30)之內表面設置有一對凹槽部(50、60)，於滑件主體(10)之剖視時，於將連結柱(40)之外周緣上之滑件寬度方向之最外側之位置規定為最外位置(41)之情形時，各凹槽部(50、60)之內側槽側緣部(52a)配置於較最外位置(41)更靠滑件寬度方向之內側，各凹槽部(50、60)之外側槽側緣部(52b)配置於較最外位置(41)更靠滑件寬度方向之外側。藉此，即便反覆進行滑動操作，亦能夠使拉鏈鏈齒不易被滑件主體(10)之內表面刮削。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:上凸緣部</p>
        <p type="p">13:凸緣平行部</p>
        <p type="p">14:凸緣彎曲部</p>
        <p type="p">15:邊界位置</p>
        <p type="p">18:導入口</p>
        <p type="p">19:嚙合口</p>
        <p type="p">20:上翼板</p>
        <p type="p">23:上翼板外周面</p>
        <p type="p">24:上側主平面</p>
        <p type="p">24a:中央平面</p>
        <p type="p">24b:側平面</p>
        <p type="p">25:上側前傾斜部</p>
        <p type="p">26:上側基準傾斜部</p>
        <p type="p">26a:第1上側基準傾斜部</p>
        <p type="p">26b:第2上側基準傾斜部</p>
        <p type="p">27:上側收容階差部</p>
        <p type="p">27a:上側階差面</p>
        <p type="p">27b:上側連結面</p>
        <p type="p">28:上側後傾斜部</p>
        <p type="p">40:連結柱</p>
        <p type="p">41:最外位置</p>
        <p type="p">42:柱前端部</p>
        <p type="p">43:柱後端面</p>
        <p type="p">44:柱側壁面</p>
        <p type="p">45:前側遞增部</p>
        <p type="p">46:後側遞減部</p>
        <p type="p">50:上側凹槽部</p>
        <p type="p">51:槽底部</p>
        <p type="p">52:槽側緣部</p>
        <p type="p">52a:內側槽側緣部</p>
        <p type="p">52b:外側槽側緣部</p>
        <p type="p">53:第1底面</p>
        <p type="p">54:第2底面</p>
        <p type="p">70:上側分模線</p>
        <p type="p">71:上側第1分模線</p>
        <p type="p">72:上側第2分模線</p>
        <p type="p">73:上側第1橫線</p>
        <p type="p">74:上側縱線</p>
        <p type="p">75:上側第2橫線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="895" publication-number="202624412">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624412</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121819</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示器用黑色顏料分散組合物、顯示器用黑色顏料分散抗蝕劑組合物、黑色抗蝕劑膜</chinese-title>
        <english-title>BLACK PIGMENT DISPERSION COMPOSITION FOR DISPLAYS, BLACK PIGMENT DISPERSION RESIST COMPOSITION FOR DISPLAYS, BLACK RESIST FILM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">C09B67/46</main-classification>
        <further-classification edition="200601120260305B">C09D17/00</further-classification>
        <further-classification edition="200601120260305B">G03F7/004</further-classification>
        <further-classification edition="200601120260305B">C08K5/3417</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商阪田油墨股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKATA INX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中川朋樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAGAWA, TOMOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高久將太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAKU, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辻康人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUJI, YASUHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平井淳一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRAI, JUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種能夠形成兼具有耐NMP溶劑性和優異斷裂點的塗膜之顯示器用黑色顏料分散組合物、顯示器用黑色顏料分散抗蝕劑組合物、黑色抗蝕劑膜。顯示器用黑色顏料分散組合物包括：內醯胺黑；含氮原子官能基的聚合物顏料分散劑；鹼可溶性樹脂；和溶劑；其中，聚合物顏料分散劑為以下（I）至（III）中的任一項：&lt;br/&gt;  （I）              含氮原子官能基為季銨鹽基；&lt;br/&gt;  （II）           含氮原子官能基含有10質量％以下的叔氨基和90質量％以上的季銨鹽基；&lt;br/&gt;  （III）        包括第一和第二聚合物顏料分散劑，第一聚合物顏料分散劑的含氮原子官能基為季銨鹽，第二聚合物顏料分散劑的含氮原子官能基為叔氨基，且第一聚合物顏料分散劑的含量為50％以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A black pigment dispersion composition for displays, a resist composition, and a black resist film that form a coating film which has both solvent resistance to NMP and an excellent breakpoint. The black pigment dispersion composition for displays, comprising lactam black, a polymeric pigment dispersant containing a nitrogen atom-containing functional group, an alkali-soluble resin, and a solvent, wherein the polymeric pigment dispersant is any of the following (I) to (III):&lt;br/&gt; (I) The nitrogen atom-containing functional group is a quaternary ammonium salt group.&lt;br/&gt; (II) The nitrogen atom-containing functional group contains 10% by mass or less of tertiary amino groups and 90% by mass or more of quaternary ammonium salt groups.&lt;br/&gt; (III) The composition comprises first and second polymeric pigment dispersants, wherein the nitrogen atom-containing functional group of the first polymeric pigment dispersant is a quaternary ammonium salt group and the nitrogen atom-containing functional group of the second polymeric pigment dispersant is a tertiary amino group, and the content of the first polymeric pigment dispersant is 50% by mass or more.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="896" publication-number="202623897">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623897</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121934</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>離子交換樹脂之前處理裝置及前處理方法</chinese-title>
        <english-title>ION EXCHANGE RESIN PRETREATMENT DEVICE AND PRETREATMENT METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260309B">B01J47/00</main-classification>
        <further-classification edition="200601120260309B">B01D15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商奧璐佳瑙股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORGANO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新田志央利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTA, SHIORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>合庭健太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIBA, KENTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, AKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種使離子交換樹脂包含之水分溶離至前處理溶劑中而去除之離子交換樹脂之前處理裝置1具有：槽2，其貯存作為前處理溶劑之非水溶劑；循環管線L1，其使槽2內之前處理溶劑循環；容器3，其設置在循環管線L1中，用以收容前處理對象之離子交換樹脂；水分去除裝置4，其設置在循環管線L1中，由循環通過循環管線L1之前處理溶劑去除水分；及排液管線L2，其連接於容器3與水分去除裝置4間之循環管線L1，將前處理溶劑排出至外部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pretreatment device 1 for an ion exchange resin, which removes the water content in the ion exchange resin by eluting the water content into a pretreatment solvent, wherein the pretreatment device 1 has a tank 2 which stores a nonaqueous solvent as the pretreatment solvent, a circulation line L1 which circulates the pretreatment solvent in the tank 2, a container 3 which is provided in the circulation line L1 and holds the ion exchange resin to be pretreated, a water content removal device 4 which is provided in the circulation line L1 and removes the water content from the pretreatment solvent circulating through the circulation line L1, and a discharge line L2 which is connected to the circulation line L1 between the container 3 and the water content removal device 4 and discharges the pretreatment solvent to the outside.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:前處理裝置</p>
        <p type="p">2:槽</p>
        <p type="p">3:管柱</p>
        <p type="p">4:水分去除裝置</p>
        <p type="p">5:送液泵</p>
        <p type="p">L1:循環管線</p>
        <p type="p">L2:排液管線</p>
        <p type="p">V1,V2:開關閥</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="897" publication-number="202625697">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625697</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121947</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於電漿蝕刻之方法</chinese-title>
        <english-title>A METHOD OF PLASMA ETCHING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P50/20</main-classification>
        <further-classification edition="200601120260302B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商ＳＰＴＳ科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPTS TECHNOLOGIES LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波曼　崔斯坦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BURMAN, TRISTAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露一種對一工件進行電漿蝕刻之方法。該方法包括以下步驟：將該工件放置於一電漿腔室內之一基板支撐件上，其中該工件包括一SiC基板；將SF&lt;sub&gt;6&lt;/sub&gt;、O&lt;sub&gt;2&lt;/sub&gt;及He程序氣體引入至該電漿腔室中；藉由在以下步驟之間交替而對該SiC基板進行電漿蝕刻以藉此降低該SiC基板之表面粗糙度：(i)將一偏壓RF功率施加至該基板支撐件以在該電漿腔室中產生一反應性離子蝕刻電漿，且在一第一電漿腔室壓力下蝕刻該SiC基板達一第一時間段；及(ii)將一源RF功率施加至該電漿腔室以在該電漿腔室中產生一感應耦合電漿，且將一偏壓RF功率施加至該基板支撐件，並且在一第二電漿腔室壓力下蝕刻該SiC基板達一第二時間段。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There is disclosed a method of plasma etching a workpiece. The method comprises the steps of: placing the workpiece upon a substrate support within a plasma chamber, wherein the workpiece comprises a SiC substrate; introducing SF&lt;sub&gt;6&lt;/sub&gt;, O&lt;sub&gt;2&lt;/sub&gt; and He process gases into the plasma chamber; plasma etching the SiC substrate to thereby reduce surface roughness of the SiC substrate by alternating between: (i) applying a bias RF power to the substrate support to generate a reactive-ion etching plasma in the plasma chamber, and etching the SiC substrate at a first plasma chamber pressure for a first period of time; and (ii) applying a source RF power to the plasma chamber to generate an inductively coupled plasma in the plasma chamber and applying a bias RF power to the substrate support, and etching the SiC substrate at a second plasma chamber pressure for a second period of time.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:感應耦合電漿設備/設備</p>
        <p type="p">10:第一氣體入口配置/內充氣室/內氣體充氣室</p>
        <p type="p">11:電漿蝕刻腔室/腔室/蝕刻腔室</p>
        <p type="p">12:第二氣體入口配置/外充氣室/外氣體充氣室</p>
        <p type="p">13:上壁或蓋</p>
        <p type="p">14:RF天線</p>
        <p type="p">16:台板RF電極</p>
        <p type="p">18:陶瓷環形殼體/環形殼體</p>
        <p type="p">20:基板支撐件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="898" publication-number="202625546">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625546</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121950</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置以及記憶體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND MEMORY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260302B">H10B10/00</main-classification>
        <further-classification edition="202601120260302B">H10W20/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張永廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YUNG-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁一峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TING, YI-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置，半導體裝置包含一第一記憶體單元區、相鄰於該第一記憶體單元區的一第二記憶體單元區，以及夾設於該第一記憶體單元區與該第二記憶體單元區之間的一中間帶區。在一些實施例中，該中間帶區包含一饋通電路，該饋通電路將該半導體裝置的一正面的一第一金屬層電氣耦接至該半導體裝置的一背面的一第二金屬層。在一些實施例中，該饋通電路包含設置在一饋通孔(FTV)上方並電氣耦接至該饋通孔的多個接點金屬層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a first memory cell area, a second memory cell area adjacent to the first memory cell area, and a middle strap area interposing the first memory cell area and the second memory cell area. In some embodiments, the middle strap area includes a feedthrough circuit that electrically couples a first metal layer on a frontside of the semiconductor device to a second metal layer on a backside of the semiconductor device. In some embodiments, the feedthrough circuit includes a plurality of contact metal layers disposed over and electrically coupled to a feedthrough via (FTV).</p>
      </isu-abst>
      <representative-img>
        <p type="p">x,y:方向/坐標軸</p>
        <p type="p">102:記憶體單元區</p>
        <p type="p">250:區域</p>
        <p type="p">314,316,318,320,322,324,326,328,330,332,334,336,338:閘極結構</p>
        <p type="p">310,312:主動區</p>
        <p type="p">500:中間帶區</p>
        <p type="p">500b:緩衝區</p>
        <p type="p">500a:饋通電路區</p>
        <p type="p">550:饋通電路</p>
        <p type="p">360,360A:接點金屬層</p>
        <p type="p">350,352,354,352A:電氣隔離結構</p>
        <p type="p">370:源/汲極接點導電通孔軌道/VDR</p>
        <p type="p">372:饋通孔/FTV</p>
        <p type="p">13cpp:長度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="899" publication-number="202624386">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624386</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121994</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚乙烯系樹脂構成的非交聯發泡成形體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08L23/04</main-classification>
        <further-classification edition="200601120260302B">C08K3/26</further-classification>
        <further-classification edition="200601120260302B">C08J9/08</further-classification>
        <further-classification edition="200601120260302B">B29C44/02</further-classification>
        <further-classification edition="200601120260302B">B29C44/50</further-classification>
        <further-classification edition="200601320260302B">B29K23/00</further-classification>
        <further-classification edition="200601320260302B">B29K105/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東楚股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOSOH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木謙一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山野直樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的為提供一種聚乙烯系樹脂組成物，能夠成為發泡倍率高，壓縮耐久性、二次加工性優異的非交聯聚乙烯發泡成形體。  &lt;br/&gt;用以解決問題的手段是一種聚乙烯系樹脂構成的非交聯發泡成形體，在160℃、牽引速度10m/min時的熔融張力為50mN以上，在動態黏彈性測量中，從140℃以1℃/min在頻率0.1Hz下降低時，在110℃與在100℃的複數黏度的比為5以下，而且，在110℃時的耗損正切(loss tangent)為3以下，在DSC從180℃以10℃/min下降時，在60℃～130℃的範圍，結晶的放熱為單一波峰，從室溫以10℃/min升溫時，在120℃以上的熔解熱量為5J/g以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="900" publication-number="202624114">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624114</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122031</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多層石墨烯膜之製造方法、製造裝置、多層石墨烯膜、及使用多層石墨烯膜之護膜之製造方法、護膜</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260302B">C01B32/184</main-classification>
        <further-classification edition="201701120260302B">C01B32/182</further-classification>
        <further-classification edition="201701120260302B">C01B32/194</further-classification>
        <further-classification edition="200601120260302B">B32B9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商艾爾薄膜股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIRMEMBRANE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長谷川雅考</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASEGAWA, MASATAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川田和則</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWATA, KAZUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川木俊輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAKI, SHUNSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種具有所需層數、尤其是10層以上且大面積之多層石墨烯膜之製造方法、製造裝置、多層石墨烯膜、及使用多層石墨烯膜之護膜之製造方法、護膜。  &lt;br/&gt;本發明之多層石墨烯膜之製造方法包括步驟A及步驟B，步驟A具有：步驟1，其係將形成於成膜用基材上之石墨烯膜與石墨烯支持膜進行貼合；步驟2，其係對該石墨烯膜進行蝕刻並去除成膜用基材，從而於石墨烯支持膜上製作石墨烯膜；以及步驟3，其係將石墨烯支持膜上石墨烯膜與隔離膜進行貼合，步驟B具有：步驟1，其係自步驟A中製作之石墨烯膜去除隔離膜，並將石墨烯支持膜上石墨烯膜與被轉印基板進行貼合；以及步驟2，其係剝離該石墨烯支持膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">101:被轉印基板</p>
        <p type="p">102:(積層)石墨烯膜</p>
        <p type="p">103:熱剝離膜</p>
        <p type="p">104:石墨烯膜/銅箔</p>
        <p type="p">105:熱剝離膜/石墨烯膜/銅箔</p>
        <p type="p">106:試樣台</p>
        <p type="p">107:貼合輥</p>
        <p type="p">108:熱剝離膜/石墨烯膜</p>
        <p type="p">109:隔離膜</p>
        <p type="p">110:熱剝離膜/石墨烯膜/隔離膜</p>
        <p type="p">111:鼓風機</p>
        <p type="p">112:試樣台</p>
        <p type="p">113:貼合輥</p>
        <p type="p">114:加熱器</p>
        <p type="p">115:UV裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="901" publication-number="202624501">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624501</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122037</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自熔合金噴塗皮膜</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C22C19/03</main-classification>
        <further-classification edition="202301120260302B">C22C1/04</further-classification>
        <further-classification edition="202201120260302B">B22F1/12</further-classification>
        <further-classification edition="200601120260302B">C23C4/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＯＣＡＬＯ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOCALO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅崎映美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UMEZAKI, EMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川崎大地</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASAKI, DAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供兼具耐磨損性和耐熱衝擊性兩種特性的自熔合金噴塗皮膜，其包含：含有50質量%以上的Ni、小於5質量%的W的第一相；含有小於50質量%的Ni、30質量%以上的W，並且含有W的碳化物或硼化物的第二相；以及滿足下述(1)~(3)中的至少一項，並且含有W、Cr或Mo的碳化物或硼化物的第三相；(1)含有大於等於5質量%且小於30質量%的W，(2)含有30質量%以上的Cr，(3)含有20質量%以上的Mo；第一相的維氏硬度為大於等於180且小於400 (Hv0.05)，第二相的維氏硬度為大於等於900且小於2200 (Hv0.05)，第三相的維氏硬度為大於等於400且小於2200 (Hv0.05)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">R1~R3:相</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="902" publication-number="202624859">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624859</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122253</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>偏光板套組及液晶面板</chinese-title>
        <english-title>SET OF POLARIZING PLATES AND LIQUID CRYSTAL PANEL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">G02F1/1335</main-classification>
        <further-classification edition="200601120260313B">G02F1/13363</further-classification>
        <further-classification edition="200601120260313B">G02B5/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萩原慎也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAGIHARA, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>太田裕史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTA, HIROFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係對液晶面板要求進一步提升在特定視角之對比度。  &lt;br/&gt;本發明之解決手段係一種偏光板套組，其係用以分別貼合於具備液晶層之液晶單元之兩面，其中，前述液晶層包含在不存在電場之狀態下呈均勻配向之液晶分子。偏光板套組係具有：配置於液晶單元之一面之第1偏光板10、及配置於液晶單元之另一面之第2偏光板20。第1偏光板10具有第1偏光片31及相位差層40，相位差層40配置於液晶單元與第1偏光片31之間，且相位差層40滿足式(1)至(3)。  &lt;br/&gt;第2偏光板20具有第2偏光片51及保護膜52，保護膜52配置於液晶單元與第2偏光片51之間，且保護膜52滿足式(4)至(6)。相位差層40之慢軸與第1偏光片31之吸收軸大致平行或大致垂直。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The liquid crystal panel is required to further improve contrast at a predetermined viewing angle. &lt;br/&gt;A set of polarizing plates to be bonded to both surfaces of a liquid crystal cell including a liquid crystal layer containing liquid crystal molecules homogeneously aligned in the absence of an electric field. The set of polarizing plates contains a first polarizing plate 10 disposed on one surface of the liquid crystal cell and a second polarizing plate 20 disposed on the other surface of the liquid crystal cell. The first polarizing plate 10 contains a first polarizer 31 and a retardation layer 40, the retardation layer 40 is disposed between the liquid crystal cell and the first polarizer 31, and the retardation layer 40 satisfies Expressions (1) to (3). &lt;br/&gt;The second polarizing plate 20 contains a second polarizer 51 and a protective film 52, the protective film 52 is disposed between the liquid crystal cell and the second polarizer 51, and the protective film 52 satisfies Expressions (4) to (6). The slow axis of the retardation layer 40 is substantially parallel to or substantially orthogonal to the absorption axis of the first polarizer 31.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:第1偏光板</p>
        <p type="p">20:第2偏光板</p>
        <p type="p">31:第1偏光片</p>
        <p type="p">32:第1保護膜</p>
        <p type="p">35:黏著劑層</p>
        <p type="p">40:相位差層</p>
        <p type="p">41:正A板</p>
        <p type="p">42:正C板</p>
        <p type="p">51:第2偏光片</p>
        <p type="p">52:第2保護膜</p>
        <p type="p">52a:一側之第2保護膜</p>
        <p type="p">52b:另一側之第2保護膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="903" publication-number="202625592">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625592</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122368</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>形成半導體結構的方法以及半導體結構</chinese-title>
        <english-title>METHOD FOR FORMING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D62/10</main-classification>
        <further-classification edition="202501120260302B">H10D64/20</further-classification>
        <further-classification edition="202601120260302B">H10P10/00</further-classification>
        <further-classification edition="202601120260302B">H10W10/00</further-classification>
        <further-classification edition="202601120260302B">H10P50/20</further-classification>
        <further-classification edition="200601120260302B">C23C16/50</further-classification>
        <further-classification edition="200601120260302B">B82B1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石哲齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, CHE CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江育賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, YU-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇曼儂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, MAN-NUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, ZHI-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊固峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, KU-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖　思雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, SZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳思樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SZU-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種方法包括形成下部半導體奈米結構及上部半導體奈米結構；及形成下部源極/汲極區域，包含執行第一磊晶製程以分別自下部半導體奈米結構及上部半導體奈米結構生長第一及第二半導體隔離層。方法進一步包括執行第二磊晶製程以經由自下而上的沉積製程自第一半導體隔離層生長磊晶半導體層；蝕刻第二半導體隔離層以暴露上部半導體奈米結構的側壁；形成自上部半導體奈米結構開始的上部源極/汲極區域；以及在上部源極/汲極區域形成之後的一時間，在介於下部源極/汲極區域與上部源極/汲極區域之間的空間中形成接觸蝕刻終止層及層間介電質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes forming a lower semiconductor nanostructure and an upper semiconductor nanostructure, and forming a lower source/drain region comprising performing a first epitaxy process to grow a first and a second semiconductor isolation layer from the lower semiconductor nanostructure and the upper semiconductor nanostructure, respectively. The method further includes performing a second epitaxy process to grow an epitaxy semiconductor layer from the first semiconductor isolation layer through a bottom-up deposition process, etching the second semiconductor isolation layer to expose a sidewall of the upper semiconductor nanostructure, forming an upper source/drain region starting from the upper semiconductor nanostructure, and, at a time after the upper source/drain region is formed, forming a contact etch stop layer and an inter-layer dielectric in a space between the lower source/drain region and the upper source/drain region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:晶圓</p>
        <p type="p">10:互補式場效電晶體(CFET)</p>
        <p type="p">10L:電晶體</p>
        <p type="p">10U:電晶體</p>
        <p type="p">20:半導體基板(基板)</p>
        <p type="p">20':半導體條帶</p>
        <p type="p">26'L:下部半導體奈米結構</p>
        <p type="p">26'M:中間半導體奈米結構</p>
        <p type="p">26'U:上部半導體奈米結構</p>
        <p type="p">44:閘極間隔物</p>
        <p type="p">54:內部間隔物</p>
        <p type="p">56:介電隔離層</p>
        <p type="p">62L:下部源極/汲極區域(源極/汲極區域)</p>
        <p type="p">62L-1:磊晶半導體層</p>
        <p type="p">62L-2:磊晶半導體層</p>
        <p type="p">62L-3:磊晶半導體層</p>
        <p type="p">62L-Iso:磊晶半導體層</p>
        <p type="p">62U:上部源極/汲極區域(源極/汲極區域)</p>
        <p type="p">70:接觸蝕刻終止層</p>
        <p type="p">70A:接觸蝕刻終止層</p>
        <p type="p">70B:接觸蝕刻終止層</p>
        <p type="p">72:層間介電質</p>
        <p type="p">72A:層間介電質</p>
        <p type="p">72B:層間介電質</p>
        <p type="p">78:閘極介電質</p>
        <p type="p">80L:閘極電極</p>
        <p type="p">80U:閘極電極</p>
        <p type="p">90:替換閘極堆疊</p>
        <p type="p">90L:閘極堆疊</p>
        <p type="p">90U:閘極堆疊</p>
        <p type="p">92:介電硬遮罩</p>
        <p type="p">116:介電膜</p>
        <p type="p">120:空洞</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="904" publication-number="202623932">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623932</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122383</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理系統、基板處理方法、基板處理程式及電腦可讀取記錄媒體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260304B">B23K26/00</main-classification>
        <further-classification edition="200601120260304B">B23K26/067</further-classification>
        <further-classification edition="201401120260304B">B23K26/57</further-classification>
        <further-classification edition="202601120260304B">H10P10/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下陽平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHITA, YOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮城有佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAGI, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於基板處理系統、基板處理方法、基板處理程式及電腦可讀取記錄媒體，在將雷射光呈圓環狀地照射至基板而予以處理時，於該圓環狀的照射區域中適當地控制雷射光之照射開始位置與照射結束位置。本發明之將基板予以處理之基板處理系統，具備將雷射光照射至該基板的雷射照射裝置、及控制裝置；該控制裝置，實行「於該雷射照射裝置中，對於該基板將該雷射光呈不同直徑之複數圓環狀地照射」的控制；該雷射光之圓環狀的照射區域，具有該雷射光之照射開始位置與照射結束位置的光間隙；對於該基板之一徑向的該光間隙之周向位置，於相鄰的該照射區域中不相同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">A,A1~An:照射區域</p>
        <p type="p">G1~Gn:光間隙</p>
        <p type="p">Jn-3~Jn:照射開始位置</p>
        <p type="p">Kn-3~Kn:照射結束位置</p>
        <p type="p">P:雷射吸收層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="905" publication-number="202625605">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625605</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122384</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置之形成方法</chinese-title>
        <english-title>METHOD OF FORMING SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260112B">H10D64/01</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林士豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIH-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥伯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YEN-PO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂惟皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, WEI-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIH-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王屏薇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, PING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置之形成方法包括：形成半導體堆疊於基底上方，其包括交錯的第一及第二半導體層；圖案化半導體堆疊及基底，以形成鰭狀結構；形成虛置閘極堆疊於鰭狀結構的通道區域上；凹陷鰭狀結構的源極/汲極區域，以形成源極/汲極凹槽；選擇性凹陷第二半導體層，以形成內部間隔凹槽；形成內部間隔特徵部件於內部間隔凹槽內；依序沉積第一磊晶層、第二磊晶層、緩衝層、第三磊晶層及介電層於源極/汲極凹槽上；去除虛置閘極堆疊；選擇性去除第二半導體層，以釋放第一半導體層作為通道部件；以及形成閘極結構以包圍每個通道部件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of forming a semiconductor device includes forming, over a substrate, a semiconductor stack that includes first semiconductor layers interleaved by second semiconductor layers, patterning the semiconductor stack and the substrate to form a fin-shaped structure, forming a dummy gate stack over the fin-shaped structure, recessing the fin-shaped structure to form a source/drain recess, selectively recessing the plurality of second semiconductor layers to form inner spacer recesses, forming inner spacer features in the inner spacer recesses, successively depositing a first epitaxial layer, a second epitaxial layer, a buffer layer, a third epitaxial layer and a dielectric layer over the source/drain recess, removing the dummy gate stack, selectively removing the second semiconductor layers to release the first semiconductor layers as channel members, and forming a gate structure to wrap around each of the channel members.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102,104,106,108,110,112,114,116,118,120:步驟區塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="906" publication-number="202624447">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624447</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122566</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>調平劑、塗敷組成物、硬塗層形成用組成物、抗蝕劑組成物及物品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">C09K3/00</main-classification>
        <further-classification edition="201801120260303B">C09D7/47</further-classification>
        <further-classification edition="200601120260303B">C08G77/20</further-classification>
        <further-classification edition="200601120260303B">C09D183/07</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＤＩＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尾﨑恭平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OZAKI, KYOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>植野純平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UENO, JUNPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤原龍太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIWARA, RYUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松木優弥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUKI, YUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹東穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可顯示出充分的疏油性且疏水性得到抑制的矽酮系調平劑。一種調平劑，含有聚合物，所述聚合物至少將具有-[OSi(R)&lt;sub&gt;2&lt;/sub&gt;]&lt;sub&gt;x&lt;/sub&gt;-（R分別獨立地為碳原子數1～6的烷基；x為重複數）所表示的聚矽氧烷結構、且具有一個以上聚合性不飽和基的聚合性單量體（A）、以及具有兩個以上聚合性不飽和基的聚合性單量體（B）（其中，所述聚合性單量體（B）不具有所述聚矽氧烷結構）作為聚合成分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="907" publication-number="202625709">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625709</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122654</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液體處理裝置、液體處理方法、及液體流動控制構件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260309B">H10P50/60</main-classification>
        <further-classification edition="202601120260309B">H10P50/64</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稲富裕一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INATOMI, YUICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木宏太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, KOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土橋和也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOBASHI, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]  &lt;br/&gt;　　能夠防止在作為觸媒的貴金屬層形成後的基板浸漬於蝕刻液時，因該貴金屬層的脫離而導致的蝕刻不良的發生。  &lt;br/&gt;[解決手段]  &lt;br/&gt;　　液體處理裝置，具備：在基板浸漬於蝕刻液時，保持在表面形成有作為用於蝕刻上述基板的觸媒的貴金屬層的該基板的基板保持部、貯存處理上述基板的處理液的貯存槽、為了使保持於上述基板保持部的上述基板在上述貯存槽內外移動，使該基板保持部與上述貯存槽相對移動的移動機構、及為了控制包含上述基板表面中的上述貴金屬層的形成區域及該形成區域的外周的控制區域的上述處理液的流動，在上述貯存槽內對向於上述控制區域的液體流動控制構件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:蝕刻處理裝置</p>
        <p type="p">11:貯存槽</p>
        <p type="p">40:基板升降機構</p>
        <p type="p">41:基板保持部</p>
        <p type="p">42:連接部</p>
        <p type="p">44:溝</p>
        <p type="p">44A:溝</p>
        <p type="p">44B:溝</p>
        <p type="p">60:整流板</p>
        <p type="p">63:貫通孔</p>
        <p type="p">W:晶圓</p>
        <p type="p">W0:Si層</p>
        <p type="p">M:貴金屬層</p>
        <p type="p">L1:蝕刻液</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="908" publication-number="202624473">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624473</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122662</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>處理液、處理液的製造方法、基板的處理方法及半導體裝置的製造方法</chinese-title>
        <english-title>PROCESSING SOLUTION, METHOD FOR MANUFACTURING PROCESSING SOLUTION, METHOD FOR PROCESSING SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">C11D7/06</main-classification>
        <further-classification edition="200601120260305B">C11D7/50</further-classification>
        <further-classification edition="200601120260305B">C23G1/18</further-classification>
        <further-classification edition="202601120260305B">H10P70/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石田信悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIDA, SHINGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">議題：提供一種處理液、處理液的製造方法，以及使用該處理液之基板的處理方法與半導體裝置的製造方法，其不僅對作為去除對象之金屬成分及殘渣物之去除性優異，在包含Cu原子之金屬的防蝕性亦優異。  &lt;br/&gt;　　解決方式：提供一種處理液、處理液的製造方法，以及使用該處理液之基板的處理方法與半導體裝置的製造方法，其中處理液包含鹼性化合物、水，以及防腐劑，處理液從調製時經過1週後的溶氧量為0.2mg/L以上、1.5mg/L以下，防腐劑是選自由N,N-二乙基羥胺、1-硫代甘油、1-胺基-4-甲基哌嗪、碳醯肼、甲基乙基酮肟、異抗壞血酸，以及該些鹽所組成的群組中至少一種。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="909" publication-number="202624280">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624280</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122750</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂水分散體及其製造方法、以及塗料及黏著劑</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08F2/24</main-classification>
        <further-classification edition="200601120260302B">C08L25/04</further-classification>
        <further-classification edition="200601120260302B">C08L33/06</further-classification>
        <further-classification edition="200601120260302B">C09D133/06</further-classification>
        <further-classification edition="200601120260302B">C09J133/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商第一工業製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DKS CO. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村拓郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, TAKURO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中万結</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, MAYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於提供一種樹脂膜的耐水性優異、並且可提高機械穩定性的樹脂水分散體。實施形態的樹脂水分散體是將單官能單體（A）與式（1）所表示的反應性乳化劑（B）、多官能單體（C）、及具有聚合性不飽和基的矽烷偶合劑（D）一起乳化聚合而獲得。式（1）中，A&lt;sup&gt;1&lt;/sup&gt;表示碳數10～14的烷二基，A&lt;sup&gt;2&lt;/sup&gt;表示碳數2～4的烷二基，n表示1～100的數，X表示氫原子、硫酸酯基、磷酸酯基、羧甲基或該些的鹽。多官能單體（C）相對於反應性乳化劑（B）與多官能單體（C）的合計量的量為1質量%～15質量%。矽烷偶合劑（D）相對於單官能單體（A）100質量份的量為0.01質量份～0.70質量份。&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="145px" width="595px" file="ed10007.JPG" alt="ed10007.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="910" publication-number="202624322">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624322</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122827</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體封裝基板之絕緣層形成用的樹脂薄片</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08G59/18</main-classification>
        <further-classification edition="200601120260302B">C08L63/00</further-classification>
        <further-classification edition="200601120260302B">C08L79/00</further-classification>
        <further-classification edition="200601120260302B">H01B3/30</further-classification>
        <further-classification edition="202601120260302B">H10W70/695</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商味之素股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AJINOMOTO CO., INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川合賢司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAI, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題是提供半導體封裝基板的絕緣層形成用的樹脂薄片，該樹脂薄片顯示出優異的膠渣除去性及優異的耐熱性(玻璃轉化溫度)，並且即使在暴露於高溫高濕環境的情況下也顯示出高密著強度(CZ銅剝離強度)，並能帶來兼具這三個特性的硬化物(絕緣層)。本發明的解決手段是一種半導體封裝基板的絕緣層形成用的樹脂薄片，該樹脂薄片具有支撐體和設置於該支撐體上的樹脂組成物層，  &lt;br/&gt;　　樹脂組成物層含有：(1A)具有下述式(1)所示的部分結構、與所述式(1)所示的部分結構化學鍵結的下述式(T-1)所示的部分結構、以及與所述式(1)所示的部分結構化學鍵結的下述式(T-2)所示的部分結構的馬來醯亞胺化合物、(B)環氧樹脂、及(C)聚碳二亞胺化合物，   &lt;br/&gt;&lt;img align="absmiddle" height="135px" width="277px" file="ed10051.JPG" alt="ed10051.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　(式(1)中，R&lt;sup&gt;a1&lt;/sup&gt;、R&lt;sup&gt;a2&lt;/sup&gt;、R&lt;sup&gt;a3&lt;/sup&gt;和R&lt;sup&gt;a4&lt;/sup&gt;各自獨立地表示氫原子或碳原子數1～18的烴基。R&lt;sup&gt;13&lt;/sup&gt;各自獨立地表示碳原子數1～18的烴基。m&lt;sup&gt;2&lt;/sup&gt;各自獨立地表示0～4的整數，n&lt;sup&gt;1&lt;/sup&gt;表示重複單元數。兩個“*”分別表示連接鍵，表示一個連接鍵在下述式(T-1)中的L&lt;sup&gt;13&lt;/sup&gt;或L&lt;sup&gt;14&lt;/sup&gt;的位置進行化學鍵結、另一個連接鍵在下述式(T-2)中的L&lt;sup&gt;11&lt;/sup&gt;或L&lt;sup&gt;12&lt;/sup&gt;的位置進行化學鍵結。）   &lt;br/&gt;&lt;img align="absmiddle" height="153px" width="395px" file="ed10052.JPG" alt="ed10052.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　(上述式(T-1)及(T-2)中，R&lt;sup&gt;11&lt;/sup&gt;和R&lt;sup&gt;15&lt;/sup&gt;各自獨立地表示碳原子數1～18的烴基。R&lt;sup&gt;12&lt;/sup&gt;和R&lt;sup&gt;14&lt;/sup&gt;各自獨立地表示碳原子數1～18的烴基。L&lt;sup&gt;11&lt;/sup&gt;、L&lt;sup&gt;12&lt;/sup&gt;、L&lt;sup&gt;13&lt;/sup&gt;和L&lt;sup&gt;14&lt;/sup&gt;各自獨立地表示連接鍵。其中，在L&lt;sup&gt;11&lt;/sup&gt;或L&lt;sup&gt;12&lt;/sup&gt;的位置與式(1)所示的部分結構化學鍵結，且在L&lt;sup&gt;13&lt;/sup&gt;或L&lt;sup&gt;14&lt;/sup&gt;的位置與式(1)所示的部分結構化學鍵結。m&lt;sup&gt;1&lt;/sup&gt;和m&lt;sup&gt;3&lt;/sup&gt;各自獨立地表示0～2的整數。)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="911" publication-number="202624378">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624378</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122828</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">C08K5/3415</main-classification>
        <further-classification edition="200601120260305B">C08L63/00</further-classification>
        <further-classification edition="200601120260305B">C08G59/42</further-classification>
        <further-classification edition="200601120260305B">C08J5/18</further-classification>
        <further-classification edition="200601120260305B">B32B27/38</further-classification>
        <further-classification edition="200601120260305B">B32B15/092</further-classification>
        <further-classification edition="200601120260305B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商味之素股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AJINOMOTO CO., INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川合賢司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAI, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永山晶子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAYAMA, SHOKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題是提供帶來低介質損耗角正切、且兼具優異的膠渣除去性和高耐熱性(玻璃轉化溫度)的硬化物的樹脂組成物。本發明的解決手段是一種樹脂組成物，其含有：(1A)具有下述式(1)所示的部分結構、與前述式(1)所示的部分結構化學鍵結的下述式(T-1)所示的部分結構、以及與前述式(1)所示的部分結構化學鍵結的下述式(T-2)所示的部分結構的馬來醯亞胺化合物、(B)環氧樹脂、及(D)硬化劑，  &lt;br/&gt;　　其中，(D)成分包含(D1)活性酯樹脂，  &lt;br/&gt;&lt;img align="absmiddle" height="134px" width="287px" file="ed10039.JPG" alt="ed10039.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　(式(1)中，R&lt;sup&gt;13&lt;/sup&gt;各自獨立地表示碳原子數1～18的烴基。m&lt;sup&gt;2&lt;/sup&gt;各自獨立地表示0～4的整數，n&lt;sup&gt;1&lt;/sup&gt;表示重複單元數。兩個“*”分別表示連接鍵，表示一個連接鍵在下述式(T-1)中的L&lt;sup&gt;13&lt;/sup&gt;或L&lt;sup&gt;14&lt;/sup&gt;的位置進行化學鍵結、另一個連接鍵在下述式(T-2)中的L&lt;sup&gt;11&lt;/sup&gt;或L&lt;sup&gt;12&lt;/sup&gt;的位置進行化學鍵結。)  &lt;br/&gt;&lt;img align="absmiddle" height="171px" width="424px" file="ed10040.JPG" alt="ed10040.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　(上述式(T-1)和(T-2)中，R&lt;sup&gt;11&lt;/sup&gt;及R&lt;sup&gt;15&lt;/sup&gt;各自獨立地表示碳原子數1～18的烴基。R&lt;sup&gt;12&lt;/sup&gt;及R&lt;sup&gt;14&lt;/sup&gt;各自獨立地表示碳原子數1～18的烴基。L&lt;sup&gt;11&lt;/sup&gt;、L&lt;sup&gt;12&lt;/sup&gt;、L&lt;sup&gt;13&lt;/sup&gt;及L&lt;sup&gt;14&lt;/sup&gt;各自獨立地表示連接鍵。其中，在L&lt;sup&gt;11&lt;/sup&gt;或L&lt;sup&gt;12&lt;/sup&gt;的位置與式(1)所示的部分結構化學鍵結，且在L&lt;sup&gt;13&lt;/sup&gt;或L&lt;sup&gt;14&lt;/sup&gt;的位置與式(1)所示的部分結構化學鍵結。m&lt;sup&gt;1&lt;/sup&gt;及m&lt;sup&gt;3&lt;/sup&gt;各自獨立地表示0～2的整數)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="912" publication-number="202624361">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624361</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122883</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於碳材料及／或含碳材料之聚醯胺基胺分散劑</chinese-title>
        <english-title>POLYAMIDOAMINE DISPERSANT FOR CARBON MATERIALS AND/OR CARBON CONTAINING MATERIALS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260310B">C08G83/00</main-classification>
        <further-classification edition="200601120260310B">C07C69/602</further-classification>
        <further-classification edition="200601120260310B">C08G73/02</further-classification>
        <further-classification edition="200601120260310B">C08G63/08</further-classification>
        <further-classification edition="202201120260310B">C09K23/00</further-classification>
        <further-classification edition="201701120260310B">C01B32/00</further-classification>
        <further-classification edition="200601120260310B">H01M4/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商贏創運營有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EVONIK OPERATIONS GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡波尼　皮爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAPONI, PIER FRANCESCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　克禮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KERH LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥克　荷姆特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACK, HELMUT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史考曼　史黛芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHUMANN, STEFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希爾德布蘭　斯文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HILDEBRANDT, SVEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅夫勒　法蘭克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOEFFLER, FRANK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">分散劑用將碳材料及/或含碳材料諸如碳塗覆電極活性材料分散於溶劑中之用途，尤其係於電池電極之製備中，其中，分散劑係由使聚醯胺基胺C與一種或至少二種聚酯P以及可選地至少一種羧酸或其酸酐或其酯Q反應獲得。亦提供分散液、分散液於製備電化學裝置之用途、以及電化學裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Use of a dispersant to disperse carbon materials and/or carbon containing materials such as carbon-coated electrode active materials in a solvent, especially in preparation of an electrode of a battery, wherein the dispersant is obtained by reacting a polyamidoamine C with one or at least two polyesters P and optionally at least one carboxylic acid or its anhydride or its ester Q. A dispersion, use of the dispersion in preparation of an electrochemical device and an electrochemical device are also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="913" publication-number="202624641">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624641</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123018</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>嚙合鏈條及嚙合鏈條單元</chinese-title>
        <english-title>ENGAGEMENT CHAIN AND ENGAGEMENT CHAIN UNIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251030B">F16G13/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商椿本鏈條股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUBAKIMOTO CHAIN CO.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樺井毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KABAI, TSUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>別所幹太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BESSHO, KANTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李貞儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之嚙合鏈條（200）具有一對可前進後退移動的一對鏈條構件（201、202）。各鏈條構件具備可旋動地連結之複數個鏈條元件（300）。各鏈條構件具有基底部（310）與被設置於基底部之嚙合部（330）。嚙合部具有分別形成於前進後退方向之側的推壓面（331、335）與構成推壓面之一部分的卡合部（332、336）。一對鏈條構件（201、202）被配置為彼此相對向之嚙合部（330）的推壓面（331、335）能夠接觸而嚙合。一對鏈條構件（201、202）之卡合部（332、336）形成為在嚙合時限制一對鏈條構件之相對向方向的移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">200:嚙合鏈條</p>
        <p type="p">201:第一鏈條構件</p>
        <p type="p">202:第二鏈條構件</p>
        <p type="p">203:銷</p>
        <p type="p">300:鏈條元件</p>
        <p type="p">310:基底部</p>
        <p type="p">311:旋動限制面</p>
        <p type="p">312:齒條部</p>
        <p type="p">320:連結旋動部</p>
        <p type="p">322:第一轂部</p>
        <p type="p">323:銷孔</p>
        <p type="p">326:第二轂部</p>
        <p type="p">327:銷孔</p>
        <p type="p">330:嚙合部</p>
        <p type="p">331:第一推壓面</p>
        <p type="p">332:第一卡合部</p>
        <p type="p">333:第一凸形狀部</p>
        <p type="p">334:第一凹形狀部</p>
        <p type="p">335:第二推壓面</p>
        <p type="p">336:第二卡合部</p>
        <p type="p">337:第二凸形狀部</p>
        <p type="p">338:第二凹形狀部</p>
        <p type="p">341:被限制面</p>
        <p type="p">342:轂卡合部</p>
        <p type="p">343:銷卡合部</p>
        <p type="p">X:相對向方向</p>
        <p type="p">X1:嚙合方向</p>
        <p type="p">X2:脫離嚙合方向</p>
        <p type="p">Y:前進後退方向</p>
        <p type="p">Y1:前進方向</p>
        <p type="p">Y2:後退方向</p>
        <p type="p">Z:寬度方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="914" publication-number="202625358">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625358</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123099</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>單相感應馬達驅動系統及馬達驅動方法</chinese-title>
        <english-title>SINGLE-PHASE INDUCTION MOTOR DRIVE SYSTEM AND MOTOR DRIVE METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250704B">H02P1/52</main-classification>
        <further-classification edition="200601120250704B">H02P1/04</further-classification>
        <further-classification edition="200601120250704B">H02P4/00</further-classification>
        <further-classification edition="201601120250704B">H02P23/20</further-classification>
        <further-classification edition="200601120250704B">H02P25/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏諺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡劭全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, SHAO-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邢雷鍾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSING, LEI-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種馬達驅動方法，包含：取得頻率變化曲線，其中頻率變化曲線用以指示不同時間所對應的多個設定頻率；提供電源命令至單相感應馬達，其中電源命令的初始頻率低於目標頻率；在該些設定頻率中對應於當前時間的一者大於初始頻率時，依據頻率變化曲線控制電源命令的當前頻率；在該些設定頻率中對應於當前時間的一者小於或等於初始頻率時，將電源命令的當前頻率維持於初始頻率，且判斷定子的輸出電流是否高於或等於電流閾值；在輸出電流高於或等於電流閾值時，固定電源命令的當前電壓；以及在輸出電流低於電流閾值時，提昇電源命令的當前電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A motor drive method, comprising: obtaining a frequency variation curve, wherein the frequency variation curve is configured to indicate a plurality of set frequencies corresponding to different times; providing a power command to a single-phase induction motor, wherein an initial frequency of the power command is lower than a target frequency; when one of the set frequencies corresponding to the current time is greater than the initial frequency, controlling a current frequency of the power command according to the frequency variation curve; when one of the set frequencies corresponding to the current time is less than or equal to the initial frequency, maintaining the current frequency of the power command at the initial frequency, and determining whether an output current of a stator is greater than or equal to a current threshold; when the output current is greater than or equal to the current threshold, fixing the current voltage of the power command; and when the output current is lower than the current threshold, increasing the current voltage of the power command.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S301-S307:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="915" publication-number="202625176">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625176</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123104</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體記憶裝置及記憶體系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250905B">G11C7/18</main-classification>
        <further-classification edition="200601120250905B">G11C8/10</further-classification>
        <further-classification edition="200601120250905B">G11C5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒井史隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAI, FUMITAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勝又竜太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATSUMATA, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體記憶裝置及記憶體系統，其能實現高耐讀性之記憶單元。  &lt;br/&gt;一實施方式之半導體記憶裝置具備分別於第1方向上相互分隔而配置之複數個記憶串。複數個記憶串分別包含：半導體層，其沿與第1方向相交之第2方向延伸；第1串，其配置於與第1方向及第2方向相交之第3方向上之半導體層之第1側面側；及第2串，其配置於第3方向上之半導體層之第2側面側。第1串包含分別以半導體層為通道，於第2方向上相互分隔而配置之第1選擇電晶體及複數個第1記憶單元電晶體。第2串包含分別以半導體層為通道，於第2方向上相互分隔而配置之複數個第1電晶體及第2選擇電晶體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">30,40,50.60:導電體膜</p>
        <p type="p">31,33,41,51:絕緣體膜</p>
        <p type="p">32:電荷儲存膜</p>
        <p type="p">61:半導體膜</p>
        <p type="p">BC:接觸插塞</p>
        <p type="p">BL:位元線</p>
        <p type="p">CGP,CGP0e~CGP7e,SGP,SGP0e,SGP1e,SGP0o,SGP1o,TRP,TRP0~TRP7:導電柱</p>
        <p type="p">CPS:半導體</p>
        <p type="p">INS:絕緣體</p>
        <p type="p">LBI:佈線</p>
        <p type="p">MS:記憶體構造</p>
        <p type="p">MT0e~MT7e:記憶單元電晶體</p>
        <p type="p">NS:NAND串</p>
        <p type="p">NSa:第1串(記憶用串)</p>
        <p type="p">NSb:第2串(讀出用串)</p>
        <p type="p">SL:源極線</p>
        <p type="p">ST1a,ST1b,ST2a,ST2b:選擇電晶體</p>
        <p type="p">TR0~TR7:電晶體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="916" publication-number="202624864">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624864</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123283</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>背光模組及其應用其之背光裝置</chinese-title>
        <english-title>BACKLIGHT MODULE AND BACKLIGHT DEVICE USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250801B">G02F1/13357</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達方電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DARFON ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉信鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HSIN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃恒儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HENG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">背光模組包括第一導光板、第二導光板及光源板。第一導光板包括第一本體及第一轉向部。第一轉向部包括第一尾段及一第一連接段。第一連接段連接第一尾段與第一本體，其中第一尾段沿第一方向與第一連接段重疊。第二導光板與第一導光板相對配置。光源板配置在第一導光板及第二導光板上。第一方向與第一本體的延伸方向實質上垂直。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A backlight module includes a first light guide plate, a second light guide plate and a light source plate. The first light guide plate includes a first body and a first turning portion. The first turning portion includes a first tail section and a first connecting section. The first connecting section connects the first tail section with the first body, wherein the first tail section overlaps the first connecting section in a direction. The second light guide plate is disposed opposite to the first light guide plate. The light source plate is disposed on the first light guide plate and the second light guide plate. The first direction is substantially perpendicular to an extending direction of the first body.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:背光模組</p>
        <p type="p">110:第一導光板</p>
        <p type="p">111,211:第一本體</p>
        <p type="p">111s:第一本體表面</p>
        <p type="p">112:第一轉向部</p>
        <p type="p">112s:第一轉向表面</p>
        <p type="p">1121:第一尾段</p>
        <p type="p">1122:第一連接段</p>
        <p type="p">120:第二導光板</p>
        <p type="p">121:第二本體</p>
        <p type="p">121s:第二本體表面</p>
        <p type="p">122:第二轉向部</p>
        <p type="p">122s:第二轉向表面</p>
        <p type="p">1221:第二尾段</p>
        <p type="p">1222:第二連接段</p>
        <p type="p">130:光源板</p>
        <p type="p">131:第一電路板</p>
        <p type="p">132:第二電路板</p>
        <p type="p">133:連接板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="917" publication-number="202624315">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624315</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123317</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂、樹脂組合物、硬化物、膜、塗液組合物、預浸體、電子基板、及樹脂之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08F299/00</main-classification>
        <further-classification edition="200601120260302B">C08F299/02</further-classification>
        <further-classification edition="200601120260302B">C08G64/04</further-classification>
        <further-classification edition="200601120260302B">C08G64/14</further-classification>
        <further-classification edition="200601120260302B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商出光興產股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IDEMITSU KOSAN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吹田百恵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKITA, MOMOE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村聖斗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彦坂高明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIKOSAKA, TAKAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森下浩延</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORISHITA, HIRONOBU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之樹脂包含下述式(UN1)所表示之聚碳酸酯結構單元、及具有乙烯基之末端結構(但，下述式(A1)所表示之聚碳酸酯結構單元、及下述式(A2)所表示之末端結構除外)。  &lt;br/&gt;[(上述式(UN1)中，Ux為單鍵或2價基，R&lt;sub&gt;1&lt;/sub&gt;及R&lt;sub&gt;2&lt;/sub&gt;分別獨立地為取代基，n為0、1、2、3、或4，m為0、1、2、3、或4，*表示鍵結鍵)(上述式(A1)中之*表示鍵結鍵，下述式(A2)中之*表示對於位於樹脂末端之重複單元之鍵結鍵)]。  &lt;br/&gt;&lt;img align="absmiddle" height="376px" width="569px" file="ed10084.JPG" alt="ed10084.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="918" publication-number="202624163">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624163</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123347</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>橡膠強化用玻璃纖維繩、橡膠強化用玻璃纖維繩的製造方法及傳動皮帶的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260302B">C03C25/27</main-classification>
        <further-classification edition="200601120260302B">C03B37/10</further-classification>
        <further-classification edition="200601120260302B">D07B1/16</further-classification>
        <further-classification edition="200601120260302B">D07B1/02</further-classification>
        <further-classification edition="200601120260302B">F16G1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商中央硝子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CENTRAL GLASS COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多田廣治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TADA, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>春日健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KASUGA, KEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大柿克彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OOGAKI, KATSUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露以提供伸長率小的橡膠強化用玻璃纖維繩為目的。本揭露係關於單撚的橡膠強化用玻璃纖維繩，其係具備由平均纖維徑3.0 μm以上且15.0 μm以下之玻璃纖維絲200根以上且3000根以下捆束成之股與被覆前述股之表面之被覆樹脂的橡膠強化用玻璃纖維繩，其中於前述橡膠強化用玻璃纖維繩僅施加有7次以上且11次以下／10cm之單撚。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="919" publication-number="202624174">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624174</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123352</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>被覆粒狀肥料及其製造方法</chinese-title>
        <english-title>COATED GRANULAR FERTILIZERS AND METHODS OF MANUFACTURE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260303B">C05G5/30</main-classification>
        <further-classification edition="202001120260303B">C05G3/40</further-classification>
        <further-classification edition="202001120260303B">C05G5/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商傑康農業科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JCAM AGRI. CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木大地</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, DAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂本淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAMOTO, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於被覆粒狀肥料，該被覆粒狀肥料係具有粒狀肥料及被覆該粒狀肥料表面之被膜，前述被膜係含有：選自由低密度聚乙烯(LDPE：Low Density Polyethylene)及直鏈狀低密度聚乙烯(LLDPE：Linear Low Density Polyethylene)所組成之群組的至少1種α-烯烴共聚物(A)、熔點為80℃以上之烴蠟(B)、及填充材(C)，前述α-烯烴共聚物(A)係滿足下述(I)：(I)藉由依據JIS K 6922-2之測定法所測得的密度為0.911至0.935(g/cm&lt;sup&gt;3&lt;/sup&gt;)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a coated granular fertilizer including a granular fertilizer and a coating film formed on the surface thereof. The coating film contains at least oneα-olefin copolymer (A) selected from the group consisting of low density polyethylene (LDPE) and linear low density polyethylene (LLDPE), and hydrocarbon wax (B) having a melting point of 80℃ or higher, and filler (C). Theα-olefin copolymer (A) is characterized in that it has a density of 0.911 to 0.935(g/cm&lt;sup&gt;3&lt;/sup&gt;), as measured by the JIS K 6922-2 measurement method.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="920" publication-number="202624282">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624282</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123420</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>著色硬化性樹脂組成物、彩色濾光片、顯示裝置、及固體攝像元件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">C08F2/44</main-classification>
        <further-classification edition="200601120260304B">G03F7/004</further-classification>
        <further-classification edition="200601120260304B">G03F7/027</further-classification>
        <further-classification edition="200601120260304B">G02B5/20</further-classification>
        <further-classification edition="200601120260304B">G02F1/1335</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹下智也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKESHITA, TOMOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中野由子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANO, YUKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供一種可製作提高與綠色光的顏色分離性的彩色濾光片的著色硬化性樹脂組成物。本發明的著色硬化性樹脂組成物的特徵在於含有著色劑、樹脂、聚合性化合物、及聚合起始劑，所述著色劑包含氧雜蒽色素、紫色顏料、及藍色顏料，相對於所述藍色顏料100質量份，所述氧雜蒽色素的含量為8質量份～45質量份。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="921" publication-number="202625371">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625371</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123429</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高速四相25%工作週期時脈產生器</chinese-title>
        <english-title>HIGH-SPEED FOUR-PHASE TWENTY-FIVE PERCENT DUTY CLOCK GENERATOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">H03K5/15</main-classification>
        <further-classification edition="200601120260202B">H03K5/156</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　嘉亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIA-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">四相位時脈產生器包括：四級環形結構，包括四個第一導電類型的電晶體，每個電晶體均配置為共源結構，並以環狀拓撲互連以依序且循環地復位輸出時脈的各相位；第一交替相位交叉耦合對，包括兩個第一導電類型的電晶體，用以交叉耦合輸出時脈的第一與第三相位；第二交替相位交叉耦合對，包括兩個第一導電類型的電晶體，用以交叉耦合輸出時脈的第二與第四相位；以及置位網路，包括四個第二導電類型的電晶體，用以根據四個閘控時脈訊號依序且循環地置位輸出時脈的各相位，該四個閘控時脈訊號是透過交替閘控輸入時脈與輸出時脈的各相位產生。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A four-phase clock generator includes a four-stage ring including four transistors of a first conductivity type, each configured in a common-source arrangement and interconnected in a ring topology to sequentially and cyclically de-assert phases of an output clock, respectively; a first alternate-phase cross-coupling pair of transistors of the first conductivity type configured to cross couple the first and the third phases of the output clock; a second alternate-phase cross-coupling pair of MOS transistors of the first conductivity type configured to cross couple the second and the fourth phases of the output clock; and an assertion network having four transistors of a second conductivity type configured to sequentially and cyclically assert phases of the output clock in accordance with four gated clock signals generated by alternately gating phases of input and output clocks.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:四相位時脈產生器</p>
        <p type="p">110:復位網路</p>
        <p type="p">120_1:第一交替相位交叉耦合對</p>
        <p type="p">120_2:第二交替相位交叉耦合對</p>
        <p type="p">130:置位網路</p>
        <p type="p">131:第一時脈閘控網路</p>
        <p type="p">131A,132A,133A,134A:NMOS電晶體</p>
        <p type="p">131B,132B,133B,134B:NMOS電晶體</p>
        <p type="p">131C,132C,133C,134C:PMOS電晶體</p>
        <p type="p">132:第二時脈閘控網路</p>
        <p type="p">133:第三時脈閘控網路</p>
        <p type="p">134:第四時脈閘控網路</p>
        <p type="p">CB,CK:相位</p>
        <p type="p">FM1,FM2,FM3,FM4,FM5,FM6,FM7,FM8:NMOS電晶體</p>
        <p type="p">SM1,SM2,SM3,SM4:PMOS電晶體</p>
        <p type="p">VDD:電源節點</p>
        <p type="p">VSS:接地節點</p>
        <p type="p">X1,X2,X3,X4:閘控時脈訊號</p>
        <p type="p">Y1,Y2,Y3,Y4:相位</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="922" publication-number="202624752">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624752</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123460</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>測試裝置以及其製造方法</chinese-title>
        <english-title>TEST DEVICE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250714B">G01R1/02</main-classification>
        <further-classification edition="200601120250714B">G01R1/04</further-classification>
        <further-classification edition="200601120250714B">G01R1/067</further-classification>
        <further-classification edition="200601120250714B">G01R1/20</further-classification>
        <further-classification edition="200601120250714B">G01R3/00</further-classification>
        <further-classification edition="202001120250714B">G01R31/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁景隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TING, CHIN-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樊光明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, KUANG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃榮書</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, LUNG-SHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種測試裝置，其包括可撓探測薄膜與支撐層，支撐層支撐可撓探測薄膜。可撓探測薄膜包括至少一探針與至少一第一元件，第一元件重疊探針，第一元件設置於探針與支撐層之間，且可撓探測薄膜包括有機材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A test device includes a flexible detecting film and a supporting layer. The supporting layer supports the flexible detecting film. The flexible detecting film includes at least one probe and at least one first component, the first component overlaps the probe, the first component is disposed between the probe and the supporting layer, and the flexible detecting film includes an organic material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:可撓探測薄膜</p>
        <p type="p">100a:第一區域</p>
        <p type="p">100b:第二區域</p>
        <p type="p">100c:第三區域</p>
        <p type="p">105:薄膜結構</p>
        <p type="p">110:元件</p>
        <p type="p">110a:第一元件</p>
        <p type="p">110b:第二元件</p>
        <p type="p">110c:第三元件</p>
        <p type="p">120:探針</p>
        <p type="p">C:轉折處</p>
        <p type="p">CB1:第一電路板</p>
        <p type="p">CB2:第二電路板</p>
        <p type="p">CT:待測元件</p>
        <p type="p">OPc:電路板開口</p>
        <p type="p">SP:支撐層</p>
        <p type="p">TD:測試裝置</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="923" publication-number="202624422">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624422</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123461</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基底材，及包含相分離構造之構造體之製造方法</chinese-title>
        <english-title>BASE MATERIAL AND METHOD FOR PRODUCING STRUCTURE INCLUDING PHASE-SEPARATED STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C09D153/00</main-classification>
        <further-classification edition="200601120260302B">B32B27/30</further-classification>
        <further-classification edition="200601120260302B">B05D7/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土屋純一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUCHIYA, JUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>太郎
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGAWARA, RYUTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種可形成水平配向性優異之相分離構造之基底材，及包含相分離構造之構造體之製造方法。  &lt;br/&gt;　　[解決手段]一種基底材，其係用以使包含嵌段共聚物之層進行相分離所使用之基底材，其中含有嵌段共聚物(A)，嵌段共聚物(A)含有具有下述式(a1)所示之構成單位之嵌段(A1)與具有下述式(a2)所示之構成單位之嵌段(A2)，構成嵌段(A2)之構成單位之莫耳數之比例為超過0莫耳%且40莫耳%以下。式(a1)中，R&lt;sup&gt;a11&lt;/sup&gt;為氫原子等，R&lt;sup&gt;a12&lt;/sup&gt;為取代基，n為0以上5以下之整數，式(a2)中，R&lt;sup&gt;a21&lt;/sup&gt;為氫原子等，L&lt;sup&gt;1&lt;/sup&gt;為單鍵等，Y&lt;sup&gt;1&lt;/sup&gt;為碳原子數1以上15以下之2價連結基。  &lt;br/&gt;&lt;img align="absmiddle" height="281px" width="346px" file="ed10026.JPG" alt="ed10026.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">
        </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="924" publication-number="202624012">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624012</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123462</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高純度藥液填充用樹脂製多層容器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">B32B27/32</main-classification>
        <further-classification edition="200601120260303B">B65D1/02</further-classification>
        <further-classification edition="200601120260303B">B65D65/40</further-classification>
        <further-classification edition="200601120260303B">A61J1/05</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商愛賽璐股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AICELLO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沓名芳道</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUTSUNA, YOSHIMICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久保幸次郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUBO, KOJIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷山紀行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANIYAMA, NORIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種高性能之高純度藥液填充用樹脂製多層容器，其可填充100mL~4L左右容量之高純度藥液，耐衝擊性優異且不易破裂，能夠以廉價且簡素的方式高品質地製造出均勻厚度，特別是使內層成為均勻厚度，不僅氣體阻隔性優異，且不會向內容物溶離或放出雜質微粒子。  &lt;br/&gt;　　高純度藥液填充用樹脂製多層容器，係為用於對內部空間填充高純度藥液者，從前述內部空間側朝外周側依序積層有：環狀聚烯烴製的內層、含有馬來酸酐改質聚乙烯之接著層、乙烯-乙烯醇共聚物製的阻隔層、含有馬來酸酐改質聚乙烯之另一接著層，以及密度為0.945~0.965 g/cm³且熔體流動速率(190℃、21.18N負載)為0.5g/10分以下之高密度聚乙烯製的外層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:高純度藥液填充用樹脂製多層容器</p>
        <p type="p">1a:外周</p>
        <p type="p">10:容器本體</p>
        <p type="p">11:內層</p>
        <p type="p">11a:延伸層</p>
        <p type="p">12:接著層</p>
        <p type="p">13:中間層</p>
        <p type="p">14:接著層</p>
        <p type="p">15:外層</p>
        <p type="p">17:開口部</p>
        <p type="p">18:口</p>
        <p type="p">19:陽螺紋</p>
        <p type="p">20:內部空間</p>
        <p type="p">21:高純度藥液</p>
        <p type="p">30:蓋體</p>
        <p type="p">31:墊片</p>
        <p type="p">31a:墊片基板</p>
        <p type="p">31b:環狀突起</p>
        <p type="p">32:爪</p>
        <p type="p">33:防滑部</p>
        <p type="p">39:陰螺紋</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="925" publication-number="202624316">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624316</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123481</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬化性樹脂組成物、乾膜、硬化物、及印刷配線板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08G8/28</main-classification>
        <further-classification edition="200601120260302B">C08L61/14</further-classification>
        <further-classification edition="200601120260302B">C08K7/18</further-classification>
        <further-classification edition="200601120260302B">C08K3/36</further-classification>
        <further-classification edition="200601120260302B">C08K3/30</further-classification>
        <further-classification edition="200601120260302B">G03F7/027</further-classification>
        <further-classification edition="200601120260302B">H05K1/03</further-classification>
        <further-classification edition="200601120260302B">H05K3/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商太陽控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIYO HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>信田和哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOBUTA, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤文崇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, FUMITAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野口聰士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOGUCHI, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小笠原郁彌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGASAWARA, FUMIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡本大地</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMOTO, DAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴田大介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBATA, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種硬化性樹脂組成物，其可賦予玻璃轉移溫度高且吸濕回焊耐性優異之硬化物。&lt;br/&gt;  [解決手段]本發明硬化性樹脂組成物，其特徵在於包含：含羧基樹脂、光聚合引發劑、熱硬化性成分及無機充填劑；其中前述含羧基樹脂包含特定單元結構；並且，相對於前述硬化性樹脂組成物之總量以固體成分換算計，前述無機充填劑之含量為12質量%以上且80質量%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="926" publication-number="202625626">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625626</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123487</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光檢測裝置及電子機器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251008B">H10F39/18</main-classification>
        <further-classification edition="202501120251008B">H10F77/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商索尼半導體解決方案公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河村智彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAMURA, TOMOHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青山航平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOYAMA, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村匠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, TAKUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之一實施形態之光檢測裝置具備：第1基板，其具有將光進行光電轉換之光電轉換元件、可蓄積由上述光電轉換元件轉換後之電荷之第1浮動擴散器、第2浮動擴散器之一部分、及可將上述第1浮動擴散器與上述第2浮動擴散器之一部分電性連接之第1電晶體；及第2基板，其具有上述第2浮動擴散器之另一部分，與上述第1基板積層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:攝像裝置</p>
        <p type="p">11:光電轉換部</p>
        <p type="p">11S1,11S2,12S1,12S2:面</p>
        <p type="p">13,21,22,25,41,42a,42b,43,44:半導體區域</p>
        <p type="p">15,17:分離區域</p>
        <p type="p">31~34:閘極電極</p>
        <p type="p">38,39:閘極絕緣膜</p>
        <p type="p">51,53:接點</p>
        <p type="p">91,92:電極</p>
        <p type="p">101,102:半導體層</p>
        <p type="p">111,121:配線層</p>
        <p type="p">201,202:基板</p>
        <p type="p">C1:電容元件</p>
        <p type="p">FCG,FDG,RST,TG:電晶體</p>
        <p type="p">FD1,FD2,FD3:浮動擴散器</p>
        <p type="p">L2:配線</p>
        <p type="p">P:像素</p>
        <p type="p">PD:光電二極體</p>
        <p type="p">VDD1:電源電壓</p>
        <p type="p">Vss:電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="927" publication-number="202624536">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624536</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123502</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>表面處理液以及使用此的表面處理方法及接著方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C23C22/06</main-classification>
        <further-classification edition="200601120260302B">C23C22/63</further-classification>
        <further-classification edition="200601120260302B">C23C22/83</further-classification>
        <further-classification edition="200601120260302B">C23C28/00</further-classification>
        <further-classification edition="200601120260302B">H05K3/38</further-classification>
        <further-classification edition="200601120260302B">C09J5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商四國化成工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIKOKU CHEMICALS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>逢坂菜月</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSAKA, NATSUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中原祥子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAHARA, SHOKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮崎真幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAZAKI, MASAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中西正人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANISHI, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">使經耦合劑處理的對象的接著性更加提高。本揭示的表面處理液係用以將經耦合劑處理的對象更進一步做表面處理的表面處理液。對象係選自由無機材料及樹脂材料所構成群組的1個以上。表面處理液係含有成分A：具有胺基的三唑化合物；及成分B：具有胺基的四唑化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="928" publication-number="202624308">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624308</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123505</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電極材料、電極、電池、與電極材料的製備方法</chinese-title>
        <english-title>ELECTRODE MATERIAL, ELECTRODE, BATTERY AND METHOD FOR FORMING THE ELECTRODE MATERIAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250901B">C08F222/22</main-classification>
        <further-classification edition="200601120250901B">C08F255/02</further-classification>
        <further-classification edition="200601120250901B">C08F263/04</further-classification>
        <further-classification edition="202501120250901B">C08L23/0853</further-classification>
        <further-classification edition="200601120250901B">C08L51/06</further-classification>
        <further-classification edition="200601120250901B">C08K3/04</further-classification>
        <further-classification edition="201001120250901B">H01M4/136</further-classification>
        <further-classification edition="201001120250901B">H01M4/58</further-classification>
        <further-classification edition="200601120250901B">H01M4/62</further-classification>
        <further-classification edition="201001120250901B">H01M10/052</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王宗雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TSUNG-HSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖如仕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, LU-SHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳明進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MING-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHANG-RUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳弘俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HUNG-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李仁傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JEN-JEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李明學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, MING-XUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂明怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, MING-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種電極材料、電極、電池、與電極材料的製備方法。該電極材料包含一活性粒子，以及一包覆層，部分或完全覆蓋該活性粒子的表面。該包覆層包含5至70重量份之傳導添加劑；以及30至95重量份之第一聚合物及第二聚合物，其中該傳導添加劑、該第一聚合物、以及該第二聚合物的總重為100重量份。該第一聚合物係為一第一組合物經聚合反應的產物，該第一組合物包含一第一化合物與一第一乙烯/乙酸乙烯酯共聚物；該第二聚合物係為一第二組合物經聚合反應的產物，該第二組合物包含一第二化合物與一第二乙烯/乙酸乙烯酯共聚物。該第一聚合物的熔體流動速率與該第二聚合物的熔體流動速率不同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrode material, electrode, battery and method for forming the electrode material are provided. The electrode material includes an active particle and a cladding layer partially or completely covering the surface of the active particle. The cladding layer includes 5 to 70 parts by weight of a conductive additive and 30 to 95 parts by weight of a first polymer and a second polymer, wherein the total weight of the first polymer, the second polymer and the conductive additive is 100 parts by weight. The first polymer is a product of polymerization of a first composition. The first composition includes a first compound and a first ethylene-vinyl acetate copolymer.The second polymer is a product of polymerization of a second composition. The second composition includes a second compound and a second ethylene-vinyl acetate copolymer via a polymerization. The melt flow rate of the first polymer is different from the melt flow rate of the second polymer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電極材料</p>
        <p type="p">12:活性粒子</p>
        <p type="p">14:包覆層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="929" publication-number="202624283">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624283</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123529</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含含有烯烴官能基的多環烯烴聚合物及三聚氰胺之無鹵無磷低損耗阻燃性組成物</chinese-title>
        <english-title>HALOGEN FREE AND PHOSPHORUS FREE LOW LOSS FLAME RETARDANT COMPOSITIONS CONTAINING POLYCYCLIC-OLEFINIC POLYMER WITH OLEFINIC FUNCTIONALITY AND MELAMINE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08F2/44</main-classification>
        <further-classification edition="200601120260302B">C08F277/00</further-classification>
        <further-classification edition="200601120260302B">C08F4/04</further-classification>
        <further-classification edition="200601120260302B">C08F4/32</further-classification>
        <further-classification edition="200601120260302B">C08L45/00</further-classification>
        <further-classification edition="200601120260302B">C08J5/04</further-classification>
        <further-classification edition="200601120260302B">C08J5/18</further-classification>
        <further-classification edition="200601120260302B">C08K3/36</further-classification>
        <further-classification edition="200601120260302B">C08K3/38</further-classification>
        <further-classification edition="200601120260302B">C08K5/3492</further-classification>
        <further-classification edition="200601120260302B">C08K5/56</further-classification>
        <further-classification edition="200601120260302B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商普羅梅勒斯有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PROMERUS, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崁達那拉曲奇　帕拉蒙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANDANARACHCHI, PRAMOD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科茲洛夫　馬可斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOZLOFF, MARCUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明之實施形態包括一種組成物，其包含由各種多環烯烴單體形成之聚合物（其中至少一種單體包含其他未聚合的乙烯鍵）、三聚氰胺、填料如六方氮化硼或二氧化矽、交聯劑、自由基起始劑、增黏劑及一種以上合適的添加劑。本發明的組成物在曝光於合適的高溫下時能夠形成各種三維絕緣物如膜。由本發明的組成物形成之物體顯示出至今未能實現的低介電常數、低損耗特性、阻燃性及極高的熱特性。本發明的組成物可用於各種應用中，包括在毫米波雷達天線中作為絕緣材料等。由本發明的組成物形成之膜顯示出至少為V-1的UL-94等級、未達2.8的介電常數（Dk）及未達0.002的介電損耗因數（Df）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments in accordance with the present invention encompass compositions containing the polymer formed from a variety of polycycloolefinic monomers at least one of which monomer contains an additional unpolymerized ethylenic bond, melamine, fillers such as hexagonal boron nitride or silica, a crosslinker, a free radical initiator, a tackifier and one or more suitable additives. The compositions of this invention can be formed into a variety of three-dimensional insulating articles upon exposure to suitable high temperature, such as for example films. The objects formed from the compositions of this invention exhibit hitherto unattainable low dielectric constant and low-loss properties, fire-retardancy and very high thermal properties. The compositions of this invention are useful in various applications, including as insulating materials in millimeter wave radar antennas, among others. The films formed from the compositions of this invention exhibit a UL-94 rating of at least V-1, dielectric constant (Dk) less than 2.8 and dielectric dissipation factor (Df) of less than 0.002.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="930" publication-number="202625560">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625560</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123535</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260302B">H10B43/20</main-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
        <further-classification edition="202601120260302B">H10W72/50</further-classification>
        <further-classification edition="202601120260302B">H10W20/20</further-classification>
        <further-classification edition="202601120260302B">H10W20/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池田光雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEDA, MITSUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池野大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKENO, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據一實施方式，半導體裝置具備：基板；及積層膜，其設置於上述基板上，且包含於與上述基板之表面垂直之第1方向上相互隔開之複數個絕緣膜。上述裝置進而具備：第1半導體層，其設置於上述複數個絕緣膜所包含之第1及第2絕緣膜間，且沿與上述第1方向垂直之第2方向延伸；及第2半導體層，其於上述第1及第2絕緣膜間設置於上述第1半導體層之側面。上述裝置進而具備：第1金屬層，其於上述第1及第2絕緣膜間設置於上述第2半導體層之側面。上述裝置進而具備：第1配線，其於上述第1及第2絕緣膜間設置於上述第1金屬層之側面，且與上述第1絕緣膜之上表面及上述第2絕緣膜之下表面相接；及第2配線，其沿上述第2方向延伸，且與上述第1配線電性連接，相當於位元線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:積層膜</p>
        <p type="p">101,171:絕緣膜</p>
        <p type="p">110,160:半導體層</p>
        <p type="p">162:金屬層</p>
        <p type="p">170:配線層</p>
        <p type="p">172:障壁金屬層</p>
        <p type="p">173:配線材層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="931" publication-number="202624511">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624511</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123615</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>旋轉陰極的電磁鐵組件</chinese-title>
        <english-title>ELECTROMAGNET ASSEMBLY OF ROTARY CATHODE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C23C14/34</main-classification>
        <further-classification edition="200601120260302B">H01F7/08</further-classification>
        <further-classification edition="200601120260302B">H01J37/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商愛發科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ULVAC, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李炤燏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SOYUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金正健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JUNG GUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卞東範</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BYEON, DONG BEOM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據一實施例的電磁鐵組件，其用於旋轉陰極，並可旋轉地分別連接至端塊和端蓋，包括：軸；主體連接器，其佈置在所述軸；電磁鐵，其與所述軸平行佈置；以及電磁鐵連接器，其佈置在所述電磁鐵上，並可拆裝地佈置在所述主體連接器，所述電磁鐵，包括：電磁鐵殼體；電磁鐵基座，其佈置在所述電磁鐵殼體內；磁路，其佈置在所述電磁鐵殼體內，並佈置在所述電磁鐵基座上；以及永磁體，其佈置在所述電磁鐵殼體內，還包括絕緣墊，其佈置在所述電磁鐵殼體內，用於支撐磁鐵底座和永磁體底座</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:軸</p>
        <p type="p">13:絕緣墊</p>
        <p type="p">15:電磁鐵</p>
        <p type="p">16:電磁鐵連接器</p>
        <p type="p">17:絕緣墊</p>
        <p type="p">131:板體</p>
        <p type="p">132:連接器臂</p>
        <p type="p">139:板O形環</p>
        <p type="p">151:電磁鐵殼體</p>
        <p type="p">152:電磁鐵基座</p>
        <p type="p">153:磁路</p>
        <p type="p">154:永磁體</p>
        <p type="p">155:電磁鐵塊</p>
        <p type="p">156:塊緊固部</p>
        <p type="p">161:電磁鐵連接器板</p>
        <p type="p">162:電磁鐵端子</p>
        <p type="p">169:電磁鐵連接器O形環</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="932" publication-number="202624004">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624004</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123671</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>織物片、熱封機用脫模材及脫模劑組合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">B32B17/04</main-classification>
        <further-classification edition="200601120260302B">C08L83/04</further-classification>
        <further-classification edition="200601120260302B">B29C33/68</further-classification>
        <further-classification edition="200601120260302B">D06M15/643</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹脇一幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEWAKI, KAZUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">議題：提供一種織物片，其不包含氟樹脂，防止熱封機的加熱器與塑膠薄膜的熔附，脫模性、滑動性及可撓性優異，適合作為熱封機用脫模材。解決方式：一種織物片，其在（A）由耐熱性纖維所構成之織布或不織布的表面及／或內部，具有（B）包含具有下述平均組成式（I）所表示之結構之有機聚矽氧烷之組合物的硬化物，  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="162px" width="641px" file="ed10009.JPG" alt="ed10009.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;（式中，R&lt;sup&gt;1&lt;/sup&gt;及R&lt;sup&gt;2&lt;/sup&gt;係各自獨立地表示碳原子數1～12的烷基等，k表示1～3的整數，m表示5～100的數，n表示1～3，R&lt;sup&gt;3&lt;/sup&gt;、R&lt;sup&gt;4&lt;/sup&gt;及R&lt;sup&gt;5&lt;/sup&gt;係各自獨立地表示碳原子數1～12的烷基等，a、b、c、d、e及f表示滿足0≦a＜1、0＜b≦1、0≦c＜1、0＜d≦1、0＜e≦1、0≦f＜1且a＋b＋c＋d＋e＋f＝1之數）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="933" publication-number="202624335">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624335</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123736</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬化性化合物、含有該化合物之樹脂組成物、及硬化物</chinese-title>
        <english-title>CURABLE COMPOUND, RESIN COMPOSITION CONTAINING THE COMPOUND, AND CURED PRODUCT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08G63/13</main-classification>
        <further-classification edition="200601120260302B">C08F20/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本化藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON KAYAKU KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赤塚泰昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKATUKA, YASUMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林本成生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHIMOTO, SHIGEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種硬化性化合物，其係藉由併用自由基起始劑而可進行熱或光硬化且可溶於鹼，並且硬化物之介電常數及介電損耗正切皆低，接著性及玻璃轉移溫度高。  &lt;br/&gt;本發明之硬化性化合物為下述式(1)所示的化合物，  &lt;br/&gt;&lt;img align="absmiddle" height="97px" width="670px" file="ed10012.JPG" alt="ed10012.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式(1)中，X係分別獨立地表示從二醇去除羥基後之二價的殘基。Y係分別獨立地表示脂肪族基或芳香族基之二價的殘基。R係分別獨立地表示氫原子或甲基。n係重複單元之數的平均值且為0.1至20之實數)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a curable compound which can be cured by heat or light when used in combination with a radical initiator, is alkali-soluble, has a low dielectric constant and a low dielectric loss tangent of a cured product, and has high adhesiveness and a high glass transition temperature. &lt;br/&gt;The curable compound is a compound represented by the following formula (1): &lt;br/&gt;(In formula (1), each X independently represents a divalent residue obtained by removing a hydroxyl group from a diol. Each Y independently represents a divalent residue of an aliphatic group or an aromatic group. Each R independently represents a hydrogen atom or a methyl group. n is the average number of repeating units and is a real number from 0.1 to 20). &lt;br/&gt;&lt;img align="absmiddle" height="98px" width="673px" file="ed10013.JPG" alt="ed10013.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">本案無圖式。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="934" publication-number="202624890">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624890</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123821</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>正型感光性樹脂組成物、光阻膜、光阻下層膜及光阻永久膜</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G03F7/039</main-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/11</further-classification>
        <further-classification edition="200601120260302B">C08G8/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＤＩＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長田裕仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGATA, HIROHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊部武史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IBE, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小関裕美子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSEKI, YUMIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可獲得顯影性、耐化學品性及耐熱性優異的光阻膜，並且保存穩定性及厚膜製膜性良好的正型感光性樹脂組成物。  &lt;br/&gt;本發明為一種正型感光性樹脂組成物，其含有下述成分(A)~(D)。(A)含有由間甲酚及/或鄰甲酚衍生的酚結構單元(a1)及由柳醛衍生的醛結構單元(a2)，且具有縮醛基系保護基的酚醛清漆型酚樹脂/(B)具有酸解離性保護基的聚羥基苯乙烯/(C)光酸產生劑/(D)溶劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="935" publication-number="202625711">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625711</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123835</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法及基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260309B">H10P52/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塚原隆太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUKAHARA, RYUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鰍場真樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INABA, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">基板處理方法包含：預處理液供給工序，其係在使冷卻物質與基板之下表面接觸的同時，用溫度高於冷卻物質之預處理液之液膜來覆蓋基板之上表面；昇華性物質含有液供給工序，其係藉由用昇華性物質含有液置換基板之上表面上的預處理液，而在使冷卻物質與基板之下表面接觸的同時，用溫度高於冷卻物質之昇華性物質含有液之液膜來覆蓋基板之上表面；固化膜形成工序，其係使基板之上表面上的昇華性物質含有液之液膜變化為含昇華性物質之固化膜；以及昇華工序，其係藉由使固化膜昇華而將其從基板之上表面去除。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">W:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="936" publication-number="202624376">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624376</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123872</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自由基聚合控制劑、自由基聚合用組成物及聚合物之製造方法</chinese-title>
        <english-title>RADICAL POLYMERIZATION CONTROL AGENT, COMPOSITION FOR RADICAL POLYMERIZATION AND METHOD FOR PRODUCING POLYMER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08K5/09</main-classification>
        <further-classification edition="200601120260302B">C08K5/10</further-classification>
        <further-classification edition="200601120260302B">C08F2/44</further-classification>
        <further-classification edition="200601120260302B">C08F4/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商可樂麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURARAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土屋日奈子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUCHIYA, HINAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高山拓未</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAYAMA, TAKUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>犬伏康貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INUBUSHI, YASUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種包含下述式(I)所表示的有機化合物(A)之自由基聚合控制劑。該自由基聚合控制劑係即使在聚合溫度比較高的情形，分子量控制性亦高。藉由在相對高溫下進行聚合，可使聚合反應所需要的自由基濃度減少、提高除熱效率。因此，前述自由基聚合控制劑適合用於聚乙烯醇等之聚合物的工業製造。&lt;br/&gt;&lt;img align="absmiddle" height="76px" width="167px" file="ed10008.JPG" alt="ed10008.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;  [式(I)中，R&lt;sub&gt;1&lt;/sub&gt;為碳數1~4之烷氧基、碳數1~4之烷基或羥基；n為2以上5以下]。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="937" publication-number="202625097">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625097</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123902</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>物件識別裝置及物件識別方法</chinese-title>
        <english-title>OBJECT RECOGNITION DEVICE AND OBJECT RECOGNITION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120251103B">G06V10/12</main-classification>
        <further-classification edition="202201120251103B">G06V20/60</further-classification>
        <further-classification edition="202201120251103B">G06V20/40</further-classification>
        <further-classification edition="202201120251103B">G06V30/10</further-classification>
        <further-classification edition="201101120251103B">H04N21/234</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威盛電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIA TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張國航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, KUO-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓曄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, YEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀豎承</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHI, SHU-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳佳樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIA-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHUN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅郁晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, YU-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方范濠麒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, FAN-HAO-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種物件識別裝置及物件識別方法。物件識別裝置包括影像感測器、電動雲台機構、至少一個標示以及運算主機。影像感測器感測成像區域以產生影像資料。電動雲台機構轉動影像感測器來調整成像區域。至少一個標示固設於電動雲台機構。運算主機在影像資料對應的畫面上的特定區域中判斷是否出現對應的至少一個標示。回應於特定區域中並未出現對應的標示時，運算主機暫停對影像資料對應的畫面進行物件識別。回應於特定區域中出現對應的標示時，運算主機開始對影像資料對應的畫面進行物件識別。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object recognition device and an object recognition method are disclosed. The object recognition device includes an image sensor, a motorized pan-tilt structure, at least one marker, and a computing host. The image sensor captures an imaging area to generate image data. The motorized pan-tilt structure rotates the image sensor to adjust the imaging area. At least one marker is fixed to the motorized pan-tilt structure. The computing host determines whether the corresponding marker appears in a designated area of the image corresponding to the image data. In response to an absence of the corresponding marker in the designated area, the computing host suspends an object recognition for the image. In response to the corresponding marker appearing in the designated area, the computing host initiates object recognition for the image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:物件識別裝置</p>
        <p type="p">110:影像感測器</p>
        <p type="p">120:電動雲台機構</p>
        <p type="p">130:標示支架</p>
        <p type="p">132:標示</p>
        <p type="p">140:運算主機</p>
        <p type="p">142:串流影像模組</p>
        <p type="p">144:字符識別模組</p>
        <p type="p">146:物件識別模組</p>
        <p type="p">VDS1:第一串流影像</p>
        <p type="p">VDS2:第二串流影像</p>
        <p type="p">EN1、EN2:致能信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="938" publication-number="202624562">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624562</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124027</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電鍍裝置及電鍍方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C25D17/06</main-classification>
        <further-classification edition="200601120260302B">C25D7/12</further-classification>
        <further-classification edition="200601120260302B">C25D21/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商盛美半導體設備(上海)股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACM RESEARCH (SHANGHAI), INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳勐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, MENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肖炎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIAO, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊宏超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, HONGCHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈照偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIA, ZHAOWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王堅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供了一種電鍍裝置及電鍍方法，涉及半導體製造設備領域，所述電鍍裝置包括：基板保持架，用於固持並旋轉所述基板；膜架，位於所述基板保持架的下方，所述膜架的內部用於容納電鍍液，所述膜架設有多個出液孔，用於向所述基板的表面噴射所述電鍍液；遮罩件，通過固定柱與所述基板保持架相連，所述遮罩件與所述基板之間具有間隙，所述遮罩件位於所述基板與所述膜架之間，所述遮罩件遮擋所述基板的一圈邊緣，用於減弱所述基板的邊緣電場。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:基板</p>
        <p type="p">10:基板保持架</p>
        <p type="p">12:遮罩件</p>
        <p type="p">11:固定柱</p>
        <p type="p">30:膜架</p>
        <p type="p">40:馬達</p>
        <p type="p">A:夾角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="939" publication-number="202624850">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624850</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124036</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>調變模組及包含其的電子裝置</chinese-title>
        <english-title>MODULATION MODULE AND ELECTRONIC DEVICE COMPRISING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251001B">G02F1/133</main-classification>
        <further-classification edition="200601120251001B">G02F1/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀仁海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHI, JEN-HAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀　震</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KEE, CHEAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭安呈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, AN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冠賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇建太</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種電子裝置，包括：一框架，包含一容置空間及鄰近配置於容置空間周邊的一框槽；一訊號連接元件，設置於所述框槽內；以及一調變模組，設置於容置空間內，包含：一第一載板；一第二載板，對應於第一載板；一電磁波接收元件，設置於第一載板或第二載板中的至少一者上；以及一電磁波調整元件，設置於第一載板與第二載板之間；其中電磁波接收元件電性連接至框槽內的訊號連接元件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device is provided, which comprises: a frame including an accommodation space and a frame slot disposed adjacent to the accommodation space; a signal connection element disposed in the frame slot; and a modulation module disposed in the accommodation space and including: a first carrier board, a second carrier board opposite to the first carrier board; an electromagnetic wave receiving element disposed on at least one of the first carrier board and the second carrier board; and an electromagnetic wave adjustment element disposed between the first carrier board and the second carrier board; wherein the electromagnetic wave receiving element is electrically connected to the signal connection element in the frame slot.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:框架</p>
        <p type="p">11:容置空間</p>
        <p type="p">12:框槽</p>
        <p type="p">121:第一子框槽</p>
        <p type="p">122:第二子框槽</p>
        <p type="p">2:訊號連接元件</p>
        <p type="p">21:第一子裝置</p>
        <p type="p">22:第二子裝置</p>
        <p type="p">3:調變模組</p>
        <p type="p">4:導線</p>
        <p type="p">CPE:客戶端設備</p>
        <p type="p">HUB:集線器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="940" publication-number="202625643">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625643</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124085</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250805B">H10H29/30</main-classification>
        <further-classification edition="202501120250805B">H10H29/39</further-classification>
        <further-classification edition="202501120250805B">H10H29/49</further-classification>
        <further-classification edition="202501120250805B">H10H29/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡順源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, SHUN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佳慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JIA-HUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種電子裝置，其包括基板、第一電子元件、第二電子元件、第一開關元件、導線以及第一導電墊。第一電子元件與第二電子元件設置於基板上。第一開關元件設置於基板上。導線設置於基板上。第一導電墊設置於基板上。第一開關元件通過導線以及第一導電墊與第一電子元件以及第二電子元件電連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device including a substrate, a first electronic component, a second electronic component, a first switch component, a wire, and a first conductive pad is provided. The first electronic component and the second electronic component are disposed on the substrate. The first switch component is disposed on the substrate. The wire is disposed on the substrate. The first conductive pad is disposed on the substrate. The first switch component is electrically connected to the first electronic component and the second electronic component through the wire and the first conductive pad.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10a:電子裝置</p>
        <p type="p">100、110、120、130、140:畫素</p>
        <p type="p">112、114、116、122、124、126、132、134、136、142、144、146:子畫素</p>
        <p type="p">E、E1、E11、E12、E13、E2、E21、E22、E23、E3、E31、E32、E33、E4、E41、E42、E43:電子元件</p>
        <p type="p">GD、GD1、GD2、GD3、GD4:接地線</p>
        <p type="p">L&lt;sub&gt;E&lt;/sub&gt;、L&lt;sub&gt;PA&lt;/sub&gt;、L&lt;sub&gt;PC&lt;/sub&gt;:長度</p>
        <p type="p">P、PA、PA1、PA11、PA12、PA13、PA2、PA21、PA22、PA23、PA3、PA31、PA32、PA33、PA4、PA41、PA42、PA43、PC、PC1、PC11、PC12、PC13、PC2、PC21、PC22、PC23、PC3、PC31、PC32、PC33、PC4、PC41、PC42、PC43、P1、P2、P3、P4:導電墊</p>
        <p type="p">RL、RL1、RL2:導線</p>
        <p type="p">S、S1、S11、S12、S13、S2、S21、S22、S23、S3、S31、S32、S33、S4、S41、S42、S43:開關元件</p>
        <p type="p">SB:基板</p>
        <p type="p">T、T1、T11、T12、T13、T2、T21、T22、T23、T3、T31、T32、T33、T4、T41、T42、T43:走線</p>
        <p type="p">W&lt;sub&gt;E&lt;/sub&gt;、W&lt;sub&gt;PA&lt;/sub&gt;、W&lt;sub&gt;PC&lt;/sub&gt;:寬度</p>
        <p type="p">X、Y、Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="941" publication-number="202623889">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623889</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124261</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子元件用清洗水之製造裝置及該清洗水之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260305B">B01F35/222</main-classification>
        <further-classification edition="202201120260305B">B01F25/30</further-classification>
        <further-classification edition="202201120260305B">B01F23/23</further-classification>
        <further-classification edition="200601120260305B">B01D19/00</further-classification>
        <further-classification edition="202301120260305B">C02F1/20</further-classification>
        <further-classification edition="202301120260305B">C02F1/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商栗田工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURITA WATER INDUSTRIES LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡崎有祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAZAKI, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井田純一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IDA, JUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子元件用清洗水之製造裝置，包括：pH調整裝置，在超純水中加入pH調整劑來製備pH調整水；脫氣裝置，對該pH調整水進行脫氣；氣體溶解膜式裝置，使功能性氣體經由氣體透過膜溶解於脫氣後的該pH調整水中來製備清洗水；以及移送管線，能夠以25 L/min以上的流速分別移送該超純水、該pH調整水及該清洗水。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電子元件用清洗水之製造裝置/製造裝置</p>
        <p type="p">12:pH調整裝置</p>
        <p type="p">12A:收容有pH調整劑的罐/罐</p>
        <p type="p">12B:泵</p>
        <p type="p">12L:pH調整劑的供給管線/供給管線</p>
        <p type="p">14:脫氣裝置</p>
        <p type="p">16:氣體溶解膜式裝置</p>
        <p type="p">16A:功能性氣體的供給裝置</p>
        <p type="p">16L:功能性氣體的供給管線/供給管線</p>
        <p type="p">L1:超純水、pH調整水或清洗水的移送管線/移送管線</p>
        <p type="p">UP:使用點</p>
        <p type="p">W:超純水</p>
        <p type="p">W1:pH調整水</p>
        <p type="p">W2:清洗水</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="942" publication-number="202625667">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625667</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124268</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>透明顯示裝置與其製造方法</chinese-title>
        <english-title>TRANSPARENT DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250801B">H10K59/80</main-classification>
        <further-classification edition="202501120250801B">H10H29/80</further-classification>
        <further-classification edition="200601120250801B">G02F1/1333</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴梓傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, TZU-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡明志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MING-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜育維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, YU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張俊翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHUN-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡嘉豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHIA-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳勇勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YUNG-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供了一種透明顯示裝置與其製造方法。透明顯示裝置包括基板、設置在基板上的第一無機層、設置在第一無機層上的驅動元件層、設置在驅動元件層上的第一有機層、設置在第一有機層上的第二有機層、以及設置在第二有機層上的發光元件，其中第一有機層具有側表面，以及第二有機層設置在第一有機層的側表面上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a transparent display device and a manufacturing method thereof. The transparent display device includes a substrate, a first inorganic layer disposed on the substrate, a driving element layer disposed on the first inorganic layer, a first organic layer disposed on the driving element layer, a second organic layer disposed on the first organic layer, and a light emitting element disposed on the second organic layer, wherein the first organic layer includes a side surface, and the second organic layer is disposed on the side surface of the first organic layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板</p>
        <p type="p">210,220,230,240,250,260,280,270,290:無機層</p>
        <p type="p">300,331,332,341,342:導電圖案</p>
        <p type="p">410:第一有機層</p>
        <p type="p">420:第二有機層</p>
        <p type="p">510,511:接合墊</p>
        <p type="p">600:發光元件</p>
        <p type="p">700:封裝層</p>
        <p type="p">800:覆蓋層</p>
        <p type="p">BM:遮光層</p>
        <p type="p">DE:汲極</p>
        <p type="p">DEL:驅動元件層</p>
        <p type="p">DR3,DR1,DR2:方向</p>
        <p type="p">E1,E2,E4:底邊緣</p>
        <p type="p">E3:轉折邊緣</p>
        <p type="p">GE:閘極</p>
        <p type="p">IS1,IS2:斜面</p>
        <p type="p">M0,M1,M2,M3,M4:導電層</p>
        <p type="p">NTR:非穿透區</p>
        <p type="p">OP1:第一開口</p>
        <p type="p">OP2:第二開口</p>
        <p type="p">OP3,OP4,OP5,OP6:開口</p>
        <p type="p">OPP:開口部分</p>
        <p type="p">OPS:開口結構</p>
        <p type="p">P1:傾斜部</p>
        <p type="p">P2:平坦部</p>
        <p type="p">SE:源極</p>
        <p type="p">SF1,SF2:側表面</p>
        <p type="p">SL:半導體圖案</p>
        <p type="p">SM:半導體層</p>
        <p type="p">SWP:側壁部分</p>
        <p type="p">TD:透明顯示裝置</p>
        <p type="p">TFT:電晶體</p>
        <p type="p">TH1,TH2,TH3,TH4,TH5,TH6:穿孔</p>
        <p type="p">TR:穿透區</p>
        <p type="p">W1,W2,W3,WS,W4,WOP,WSW:寬度</p>
        <p type="p">WG:間距</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="943" publication-number="202624310">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624310</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124346</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>壓印用光硬化性樹脂組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08F226/06</main-classification>
        <further-classification edition="200601120260302B">C08F2/50</further-classification>
        <further-classification edition="200601120260302B">B29C59/02</further-classification>
        <further-classification edition="202601120260302B">H10P76/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東洋鋼鈑股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYO KOHAN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東洋製罐集團控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYO SEIKAN GROUP HOLDINGS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>増﨑公史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASUSAKI, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>見勇介
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HENMI, YUUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村上卓生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAKAMI, TAKUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種壓印用光硬化性樹脂組成物，其含有：N-乙烯基㗁唑烷酮(oxazolidinone)系化合物(A)，含有2個以上的乙烯性不飽和基，且分子量為100以上、未滿700之化合物(B)，及光聚合起始劑，前述N-乙烯基㗁唑烷酮系化合物(A)的含量相對於前述壓印用光硬化性樹脂組成物100重量%為40重量%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">60:樹脂模具積層體</p>
        <p type="p">70:基材膜</p>
        <p type="p">80:樹脂模具</p>
        <p type="p">81:微細圖案</p>
        <p type="p">IIB:部分</p>
        <p type="p">C:剖面</p>
        <p type="p">H:高度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="944" publication-number="202625801">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625801</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124414</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置及其製造方法</chinese-title>
        <english-title>ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W20/00</main-classification>
        <further-classification edition="202601120260302B">H10W76/10</further-classification>
        <further-classification edition="202601120260302B">H10W74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許博雲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, PO-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王茹立</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JU-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高克毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, KER-YIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種電子裝置的製造方法，其包括以下步驟。提供基板，其中基板具有相對的第一表面與第二表面。形成貫穿基板的通孔。形成增層結構於基板的第一表面與第二表面。同時切割設置於第一表面與第二表面的增層結構，使得增層結構分別形成第一凹槽以及第二凹槽。本揭露另提供一種電子裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method of an electronic device including the following steps is provided. Providing a substrate, wherein the substrate has a first surface and a second surface opposite to each other. Forming a through hole penetrating the substrate. Forming a build-up structure on the first surface and the second surface of the substrate. Simultaneously cutting the build-up structure disposed on the first surface and the second surface, so that the build-up structure forms a first groove and a second groove respectively. An electronic device is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1a:電子裝置</p>
        <p type="p">10:基板</p>
        <p type="p">10s1、10s2、10s3:表面</p>
        <p type="p">20:連接元件</p>
        <p type="p">30、32、34:增層結構</p>
        <p type="p">DS:邊緣區</p>
        <p type="p">F:填充材料</p>
        <p type="p">IL、IL1、IL2:絕緣層</p>
        <p type="p">M、M1、M2:導電層</p>
        <p type="p">O:開口</p>
        <p type="p">P1、P2:凹陷</p>
        <p type="p">PR:罩幕圖案</p>
        <p type="p">R1、R2:凹槽</p>
        <p type="p">T:通孔</p>
        <p type="p">T21:厚度</p>
        <p type="p">X、Y、Z:方向</p>
        <p type="p">d1、d2:深度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="945" publication-number="202625806">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625806</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124417</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置及其製作方法</chinese-title>
        <english-title>ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W20/40</main-classification>
        <further-classification edition="202601120260302B">H10W72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊子寬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, TZU-KUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾嘉平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, CHIA-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范俊欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, CHUN-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種電子裝置及其製作方法。製作方法包括提供具有至少一通孔的基板、於基板上形成延伸至通孔中的晶種層、於晶種層上形成延伸至通孔中並曝露出晶種層位於通孔中的一部分的絕緣層、以及於晶種層的所述部分上形成導體層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device and a manufacturing method thereof are provided. The manufacturing method includes providing a substrate having at least one through hole, forming a seed layer on the substrate to extend into the through hole, forming an insulating layer on the seed layer to extend into the through hole and expose a part of the seed layer located in the through hole, and forming a conductor layer on the part of the seed layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1a:電子裝置</p>
        <p type="p">12:基板</p>
        <p type="p">12S1:第一表面</p>
        <p type="p">12S2:第二表面</p>
        <p type="p">12S3:側壁</p>
        <p type="p">14:晶種層</p>
        <p type="p">16:絕緣層</p>
        <p type="p">18,22:導體層</p>
        <p type="p">18a:橋接部</p>
        <p type="p">18b,18c:圖案部</p>
        <p type="p">20:緩衝層</p>
        <p type="p">22a,22b:導電圖案</p>
        <p type="p">DR1,DR2,DR3:方向</p>
        <p type="p">OP1,OP2,OP3:開口</p>
        <p type="p">TH1:通孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="946" publication-number="202624573">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624573</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124507</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>β－ＧａＯ單晶基板、β－ＧａＯ單晶錠、熔化液供應部件、β－ＧａＯ單晶基板的製造方法及β－ＧａＯ單晶錠的製造方法</chinese-title>
        <english-title>β-GAO SINGLE CRYSTAL WAFER, β-GAO SINGLE CRYSTAL INGOT, MELT SUPPLY MEMBER, METHOD FOR MANUFACTURING β-GAO SINGLE CRYSTAL WAFER, AND METHOD FOR MANUFACTURING β-GAO SINGLE CRYSTAL INGOT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C30B15/34</main-classification>
        <further-classification edition="200601120260302B">C30B29/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商中央硝子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CENTRAL GLASS COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本勇磨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, YUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅崎智典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UMEZAKI, TOMONORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松田裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUDA, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堤樹也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUTSUMI, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布野充祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUNO, MITSUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">熔化液供應部件係使用EFG（EDGE-DEFINED FILM-FED GROWTH）法之β-Ga&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;單晶製造用的熔化液供應部件，其具有：圓形或多邊形的頂面與將熔化液供應至該頂面的貫通孔，所述貫通孔到達該頂面且開口平面形狀未沿一方向延伸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Being a melt supply member for manufacturing β-Ga&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt; single crystal using EFG (Edge-defined Film-fed Growth) method, the melt supply member has a circular or polygonal top surface, and a through hole that reaches the top surface, has an opening planar shape does not extend in one direction, and supplies melt to the top surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:熔化液供應部件</p>
        <p type="p">11:頂面</p>
        <p type="p">12:凹陷部</p>
        <p type="p">13:第1貫通孔</p>
        <p type="p">14:第2貫通孔</p>
        <p type="p">15:外周部</p>
        <p type="p">16:狹縫</p>
        <p type="p">17:底面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="947" publication-number="202625514">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625514</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124584</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">H05K1/11</main-classification>
        <further-classification edition="202601120260302B">H10W20/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡乙誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜育維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, YU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種電子裝置，其包括多條掃描線、第一掃描傳輸線、第二掃描傳輸線、至少一第一導電圖案以及至少一第二導電圖案。多條掃描線包括第一掃描線以及第二掃描線。第一掃描傳輸線與多條掃描線交錯排列形成多個第一交錯處，多個第一交錯處包括第一掃描傳輸線與第一掃描線電連接的第一橋接部。第二掃描傳輸線與多條掃描線交錯排列形成多個第二交錯處，多個第二交錯處包括第二掃描傳輸線與第二掃描線電連接的第二橋接部。至少一第一導電圖案並聯於第一掃描傳輸線與第一掃描線中的至少一者，且具有第一面積。至少一第二導電圖案並聯於第二掃描傳輸線與第二掃描線中的至少一者，且具有第二面積。第一掃描傳輸線的長度大於第二掃描傳輸線的長度，且第一面積大於第二面積。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device including a plurality of scan lines, a first scan transmission line, a second scan transmission line, at least one first conductive pattern, and at least one second conductive pattern. The plurality of scan lines include a first scan line and a second scan line. The first scan transmission line and the plurality of scan lines are arranged in an interlaced manner to form a plurality of first intersections, and the plurality of first intersections include a first bridge portion in which the first scan transmission line is electrically connected to the first scan line. The second scan transmission line and the plurality of scan lines are arranged in an interlaced manner to form a plurality of second intersections, and the plurality of second intersections include a second bridge portion in which the second scan transmission line is electrically connected to the second scan line. The at least one first conductive pattern is connected in parallel to the first scan transmission line and the at least one of the first scan lines, and has a first area. The at least one second conductive pattern is connected in parallel to the second scan transmission line and at least one of the second scan lines, and has a second area. A length of the first scan transmission line is greater than a length of the second scan transmission line, and the first area is greater than the second area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10a:電子裝置</p>
        <p type="p">100、101~116:掃描線</p>
        <p type="p">200、201~216:掃描傳輸線</p>
        <p type="p">300、301~316:導電圖案</p>
        <p type="p">AA:主動區</p>
        <p type="p">B、B1~B16:橋接部</p>
        <p type="p">CL:訊號線</p>
        <p type="p">NB、NB1~NB15:非橋接部</p>
        <p type="p">I1~I16:交錯處</p>
        <p type="p">PX:畫素</p>
        <p type="p">R1:區域</p>
        <p type="p">X、Y、Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="948" publication-number="202624437">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624437</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124597</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>負型感光性接著劑組合物、感光性接著劑乾式膜、圖案形成方法、及積層體之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C09J163/00</main-classification>
        <further-classification edition="200601120260302B">C09J11/06</further-classification>
        <further-classification edition="200601120260302B">G03F7/038</further-classification>
        <further-classification edition="200601120260302B">G03F7/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齊藤遥平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, YOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明採用負型感光性接著劑組合物，該負型感光性接著劑組合物含有：選自由雙酚型環氧樹脂及氫化雙酚型環氧樹脂所組成之群中之環氧樹脂、單獨製成硬化物時之拉伸彈性模數顯示為100 MPa以下之環氧樹脂、以及包含式(I-an)所表示之陰離子之化合物。式(I-an)中，A選自由硼、鋁、鎵、磷、砷及鉍所組成之群。X為鹵素原子。R&lt;sup&gt;b1&lt;/sup&gt;為有機基。j為1～3之整數，k為1～6之整數，l為0～5之整數。R&lt;sup&gt;b1&lt;/sup&gt;可彼此連結，成為與A配位之2價以上之有機基。l/(k＋l)為0以上且未達0.7。根據該負型感光性接著劑組合物，能夠將基板彼此貼合，能夠抑制貼附後之積層體之翹曲，能夠減少鹵素原子游離之量。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="97px" width="376px" file="ed10038.JPG" alt="ed10038.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="949" publication-number="202625549">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625549</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124660</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包括電容器結構的半導體結構及其製備方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE INCLUDING A CAPACITOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120250709B">H10B12/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊英政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, YING-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種半導體結構及其製備方法。該半導體結構包括一底座結構、一圖案化電路結構、一電容器結構以及一垂直電晶體。該圖案化電路結構設置在該底座結構上方。電容器結構設置在該圖案化電路結構上方。該垂直電晶體設置在該電容器結構上方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure and a method of manufacturing the same are provided. The semiconductor structure includes a base structure, a patterned circuit structure, a capacitor structure and a vertical transistor. The patterned circuit structure is disposed over the base structure. The capacitor structure is disposed over the patterned circuit structure. The vertical transistor is disposed over the capacitor structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體結構</p>
        <p type="p">2:圖案化電路結構</p>
        <p type="p">2a:第一圖案化電路結構</p>
        <p type="p">2b:第二圖案化電路結構</p>
        <p type="p">4:中間結構</p>
        <p type="p">5:電容器結構</p>
        <p type="p">6:垂直電晶體</p>
        <p type="p">7a:上結構</p>
        <p type="p">10:底座結構</p>
        <p type="p">11:主動區</p>
        <p type="p">12:淺溝槽隔離(STI)區</p>
        <p type="p">20:金屬氧化物半導體(MOS)結構</p>
        <p type="p">21:閘極氧化物層</p>
        <p type="p">22:第一閘極導體層</p>
        <p type="p">23:第二閘極導體層</p>
        <p type="p">24:上層</p>
        <p type="p">25:間隙子</p>
        <p type="p">31:第一絕緣層</p>
        <p type="p">32:第二絕緣層</p>
        <p type="p">33:第一中間層</p>
        <p type="p">34:導電材料</p>
        <p type="p">35:第二中間層</p>
        <p type="p">36:導電材料</p>
        <p type="p">37:導電層</p>
        <p type="p">41:第一支撐層</p>
        <p type="p">42:下材料層</p>
        <p type="p">43:上材料層</p>
        <p type="p">44:第二支撐層</p>
        <p type="p">46:中心部</p>
        <p type="p">47:基礎材料</p>
        <p type="p">48:導電材料</p>
        <p type="p">50:電容器</p>
        <p type="p">51:第一電極</p>
        <p type="p">52:中間層</p>
        <p type="p">53:第二電極</p>
        <p type="p">61:周邊絕緣層</p>
        <p type="p">62:主材料</p>
        <p type="p">72:導電層</p>
        <p type="p">81:第六絕緣材料</p>
        <p type="p">82:孔洞</p>
        <p type="p">84:上導電層</p>
        <p type="p">85:導電材料</p>
        <p type="p">86:電子焊墊</p>
        <p type="p">101:第一表面</p>
        <p type="p">110:底座部</p>
        <p type="p">332:第一通孔</p>
        <p type="p">352:第二通孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="950" publication-number="202625273">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625273</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124715</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於電化學電池總成之板及電化學電池總成</chinese-title>
        <english-title>PLATE FOR AN ELECTROCHEMICAL CELL ASSEMBLY AND ELECTROCHEMICAL CELL ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260303B">H01M8/02</main-classification>
        <further-classification edition="202101120260303B">C25B9/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商席瑞絲電力有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CERES POWER LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特魯博迪　麥可　Ｄ　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRUEBODY, MICHAEL DAVID JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杰伊　阿拉斯泰爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAY, ALASTAIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於用於一電化學電池總成(10)之板，較佳地為燃料電池總成或電解槽電池總成，其包含在該板之一表面中形成之碎片收集特徵。本發明亦關於一種包含此一板之電化學電池總成。本發明亦關於一種系統，其包含此一電化學電池總成以及用於使一流體循環通過該電化學電池總成之一流體循環裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to plates for an electrochemical cell assembly (10), preferably fuel cell assembly or electrolyser cell assembly, comprising debris collection features formed in a surface of the plate. The invention also relates to an electrochemical cell assembly comprising such a plate. The invention also relates to a system comprising such an electrochemical cell assembly and a fluid circulation device for circulating a fluid through the electrochemical cell assembly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">12:端板</p>
        <p type="p">14:基板</p>
        <p type="p">38:外殼</p>
        <p type="p">44:流體出口端口，流體端口</p>
        <p type="p">48:出口貫穿孔，貫穿孔，(出口)貫穿孔</p>
        <p type="p">52,84:貫穿孔</p>
        <p type="p">54:流體供應端口，(第二)流體供應端口</p>
        <p type="p">56:碎片收集特徵</p>
        <p type="p">58,110:碎片收集通道</p>
        <p type="p">82:電隔離板，隔離板</p>
        <p type="p">86:流體入口端口</p>
        <p type="p">88:凹處</p>
        <p type="p">90:切口</p>
        <p type="p">94:第一切口，切口</p>
        <p type="p">96:第二切口，切口</p>
        <p type="p">106:壁</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="951" publication-number="202625175">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625175</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124726</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體裝置及操作記憶體裝置的方法</chinese-title>
        <english-title>MEMORY DEVICE AND METHOD OF OPERATING A MEMORY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">G11C7/16</main-classification>
        <further-classification edition="200601120251103B">G11C11/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>首爾大學校產學協力團</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEOUL NATIONAL UNIVERSITY R&amp;DB FOUNDATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李庚旼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KYUNG MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金載俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JAE-JOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JONG-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一種記憶體裝置及操作記憶體裝置的方法。記憶體裝置包括：記憶體胞元陣列，包括包括多個第一權重胞元對的權重胞元陣列及包括多個參考胞元對的參考胞元陣列；以及類比-數位轉換器，連接至多個第一權重胞元對及多個參考胞元對，並且被配置成在讀取操作期間因應於啟用多個第一權重胞元字元線中的至少一個對應的第一權重胞元字元線及多個參考胞元字元線中的至少一個對應的參考胞元字元線而輸出表示儲存於多個第一權重胞元對中的多個權重值中的至少一個權重值與儲存於多個參考胞元對中的多個參考值中的至少一個參考值的加權和的訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory device and method of operating a memory device are provided. A memory device includes a memory cell array comprising a weight cell array including a plurality of first weight cell pairs and a reference cell array including a plurality of reference cell pairs, and an analog-to-digital converter (ADC) connected to the plurality of first weight cell pairs and the plurality of reference cell pairs, and configured to output a signal representing a weighted sum of at least one weight value among a plurality of weight values stored in the plurality of first weight cell pairs and at least one reference value among a plurality of reference values stored in the plurality of reference cell pairs in response to activation of at least one corresponding first weight cell word line among a plurality of first weight cell word lines and at least one corresponding reference cell word line among a plurality of reference cell word lines during a read operation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:記憶體裝置</p>
        <p type="p">210:控制邏輯電路</p>
        <p type="p">220:溫度計解碼器</p>
        <p type="p">230:二進制計數器</p>
        <p type="p">240:字元線驅動器</p>
        <p type="p">250:位元線寫入驅動器</p>
        <p type="p">260:類比-數位轉換器(ADC)</p>
        <p type="p">270:感測放大器陣列</p>
        <p type="p">280:有限狀態機(FSM)陣列</p>
        <p type="p">290:輸入/輸出電路</p>
        <p type="p">BL:位元線</p>
        <p type="p">C/A:命令/位址訊號</p>
        <p type="p">DS:域訊號</p>
        <p type="p">FF:正反器</p>
        <p type="p">MCA:記憶體胞元陣列</p>
        <p type="p">RA:列位址</p>
        <p type="p">RCA:參考胞元陣列</p>
        <p type="p">RS:參考訊號</p>
        <p type="p">Sign_CT:計數訊號</p>
        <p type="p">Sign_EN:賦能訊號</p>
        <p type="p">Sign_MD:模式訊號</p>
        <p type="p">SL:源極線</p>
        <p type="p">W:權重值</p>
        <p type="p">WCA:權重胞元陣列/加權胞元陣列</p>
        <p type="p">WL:字元線</p>
        <p type="p">WSM:加權和</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="952" publication-number="202625535">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625535</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124731</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於固態驅動機的托盤及包括該托盤的驅動機伺服器裝置</chinese-title>
        <english-title>TRAY FOR SOLID STATE DRIVE AND DRIVE SERVER DEVICE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250911B">H05K7/14</main-classification>
        <further-classification edition="200601120250911B">G06F1/16</further-classification>
        <further-classification edition="200601120250911B">H05K13/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申抒呟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, SEOHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李基澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KITAEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李承翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEUNGHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫正武</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SON, JUNGMOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一種固態驅動機托盤。該固態驅動機托盤包括：一固態驅動機基體，其包括一印刷電路板及安裝於該PCB上之一半導體晶片；一導引框架，其包括接觸該PCB之一上部分之一上框架、設置有該PCB之一側部分插入至其中之一滑軌的一側框架以及界定一連接器通路部分之一下框架；一鉸鏈接合部分，其包括連接該側框架與該下框架之一側的一鉸鏈及在其中安置有該鉸鏈之一側的另一側處固定該側框架與該下框架之一接合部分；以及一連接器部分，其從該PCB之一側延伸且在該側框架及該下框架藉由該鉸鏈接合部分來固定時透過該連接器通路部分暴露在外。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A solid state drive tray is provided. The solid state drive tray includes: a solid state drive substrate including a printed circuit board and a semiconductor chip mounted on the PCB; a guide frame including an upper frame contacting an upper portion of the PCB, a side frame provided with a sliding rail into which a side portion of the PCB is inserted, and a lower frame defining a connector passage portion; a hinge joint portion including a hinge connecting the side frame and one side of the lower frame and a joint portion fixing the side frame and the lower frame at the other side of one side in which the hinge is disposed; and a connector portion extending from one side of the PCB and externally exposed through the connector passage portion while the side frame and the lower frame are fixed by the hinge joint portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:固態驅動機托盤</p>
        <p type="p">10:固態驅動機基體</p>
        <p type="p">12:印刷電路板(PCB)、PCB</p>
        <p type="p">14:半導體晶片</p>
        <p type="p">15:連接器部分</p>
        <p type="p">20:導引框架</p>
        <p type="p">22:上框架</p>
        <p type="p">24,26:側框架</p>
        <p type="p">28:下框架</p>
        <p type="p">40:鉸鏈接合部分</p>
        <p type="p">42:鉸鏈部分</p>
        <p type="p">80:閂鎖部分</p>
        <p type="p">282:連接器通路部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="953" publication-number="202623999">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623999</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124895</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積層光學薄膜及影像顯示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">B32B7/12</main-classification>
        <further-classification edition="200601120251201B">C09J4/00</further-classification>
        <further-classification edition="200601120251201B">C09J11/06</further-classification>
        <further-classification edition="200601120251201B">G02B5/30</further-classification>
        <further-classification edition="200601120251201B">G09F9/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松原情菜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUBARA, MOTONA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菅野亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANNO, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種積層光學薄膜，係透過接著劑層至少積層有第1光學薄膜與第2光學薄膜者，前述積層光學薄膜中，第1光學薄膜及第2光學薄膜皆為斷裂強度為70以下之樹脂薄膜；接著劑層係以含有自由基聚合性化合物之接著劑組成物的硬化物層形成，且拉伸彈性模數測定時之伸長度為3mm以上且50mm以下；自由基聚合性化合物之平均HSP值與第1光學薄膜及第2光學薄膜之HSP值之間各自之HSP值距離皆為3.5以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="954" publication-number="202625217">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625217</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124907</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>導電糊、RFID嵌體及RFID嵌體之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">H01B1/22</main-classification>
        <further-classification edition="200601120260302B">C09J9/02</further-classification>
        <further-classification edition="200601120260302B">C09J4/02</further-classification>
        <further-classification edition="200601120260302B">C09J11/00</further-classification>
        <further-classification edition="200601120260302B">H01R43/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商積水化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大倉滉生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OOKURA, KOUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山中雄太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMANAKA, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉本理</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIMOTO, SATORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種導電糊，其係於在大氣環境等中以相對較短時間進行安裝之情形時，能夠抑制導電糊之硬化物中孔隙之產生。  &lt;br/&gt;本發明之導電糊係包含硬化性化合物、硬化劑及導電性填料者，上述硬化性化合物包含部分環氧(甲基)丙烯酸酯化合物，於上述導電糊100重量%中，上述部分環氧(甲基)丙烯酸酯化合物之含量為10.0重量%以上45.0重量%以下，且上述導電糊不含分子量150以下之(甲基)丙烯酸化合物，或包含15.0重量%以下之分子量150以下之(甲基)丙烯酸化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="955" publication-number="202624015">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624015</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124942</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學膜套組、圓偏光板的製造方法及長形積層體</chinese-title>
        <english-title>OPTICAL FILM SET, METHOD FOR MANUFACTURING CIRCULAR POLARIZING PLATE, AND LONG LAMINATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">B32B37/12</main-classification>
        <further-classification edition="200601120260302B">B32B38/18</further-classification>
        <further-classification edition="201901120260302B">B32B7/022</further-classification>
        <further-classification edition="201901120260302B">B32B7/023</further-classification>
        <further-classification edition="200601120260302B">B32B7/12</further-classification>
        <further-classification edition="200601120260302B">G02B5/30</further-classification>
        <further-classification edition="200601120260302B">G02F1/13363</further-classification>
        <further-classification edition="202301120260302B">H10K59/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬杉直樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UMASUGI, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羽場康弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HABA, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮本知典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAMOTO, TOMONORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祖父江彰二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOBUE, SHOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種光學膜套組等，其可改善於圓偏光板之製造步驟中，於剝離基材層時之非意願分離的情形。  &lt;br/&gt;作為解決手段之本發明之光學膜套組具備有3個以上的相位差膜。各相位差膜具有基材層及設置於前述基材層上至少一個的液晶硬化層，於各相位差膜，當基材層、及至少一個的液晶硬化層中最靠近基材層之間的剝離力設為F時，至少一個的相位差膜的剝離力F與其他相位差膜的剝離力不同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The purpose of the present invention is to provide an optical film set, etc., which can improve the occurrence of undesired lifting during the peeling of the substrate layer in the manufacturing process of circular polarizing plate. &lt;br/&gt;As a means for attaining the objective of the present invention is an optical film set which comprises three or more phase-shifting films. Each phase-shifting film comprises a substrate layer and at least one liquid crystal curing layer disposed on said substrate layer. For each phase-difference film, when the peel force between the substrate layer and at least one liquid crystal curing layer closest to the substrate layer is set to F, the peel force F of at least one phase-difference film differs from the peel forces of the other phase-difference films.</p>
      </isu-abst>
      <representative-img>
        <p type="p">800A:第一相位差膜</p>
        <p type="p">800B:第二相位差膜</p>
        <p type="p">800C:第三相位差膜</p>
        <p type="p">810:基材層</p>
        <p type="p">820:第一配向膜</p>
        <p type="p">830:第一液晶硬化層</p>
        <p type="p">840:第二配向膜</p>
        <p type="p">850:第二液晶硬化層</p>
        <p type="p">1000:光學膜套組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="956" publication-number="202624450">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624450</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125010</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>表面處理劑、熱交換器及其表面處理方法、表面處理熱交換器及其製造方法、金屬材料之表面處理方法以及表面處理金屬材料之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C09K3/18</main-classification>
        <further-classification edition="200601120260302B">C23C26/00</further-classification>
        <further-classification edition="201801120260302B">C09D7/63</further-classification>
        <further-classification edition="200601120260302B">F28F13/18</further-classification>
        <further-classification edition="200601120260302B">F28F19/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本派克乃成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIHON PARKERIZING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南淳一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINAMI, JUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>猪古智洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKO, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種表面處理劑，係可形成能長期地維持親水性、抗蝕性、及防結霜性的良好皮膜。本發明為一種表面處理劑，係包含：水溶性無機化合物(A)、有機烷氧基矽烷(B)、以及選自重量平均分子量為3000以下之陰離子性界面活性劑及10質量%水溶液之濁點為20℃以上且重量平均分子量為3000以下的非離子性界面活性劑中之一種或二種以上(C)；於將前述(A)、(B)、(C)之各自質量設為Ma、Mb、Mc時，Mc/(Ma+Mb)為0.001至0.3。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="957" publication-number="202624813">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624813</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125062</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光電轉換設備及其製作方法</chinese-title>
        <english-title>PHOTOELECTRIC CONVERSION DEVICE AND ITS MANUFACTURING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G02B6/42</main-classification>
        <further-classification edition="200601120260302B">G01M3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傳承光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FORMERICA OPTOELECTRONICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃雲晟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YUN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉泓甫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, HUNG-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宥任</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙令宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAO, LING YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭志弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光電轉換設備及其製作方法，該光電轉換設備係具有一光電轉換模組與一密封空間，該光電轉換模組可於該密封空間中進行光電轉換處理，如此，當光電轉換設備浸泡於散熱液體中運行時，可以防止散熱液體滲入而影響該光電轉換模組的光電轉換，以有效地提高該光電轉換設備的運行效率和壽命。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A photoelectric conversion device and its manufacturing method are disclosed. The photoelectric conversion device includes a photoelectric conversion module and a sealed space. The photoelectric conversion module performs photoelectric conversion within the sealed space. In this way, when the photoelectric conversion device operates while immersed in a cooling liquid, the sealed space prevents the cooling liquid from infiltrating and affecting the photoelectric conversion process of the module, thereby effectively improving the operational efficiency and lifespan of the photoelectric conversion device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光電轉換設備</p>
        <p type="p">EL:液態散熱環境</p>
        <p type="p">2:數據傳輸構件</p>
        <p type="p">11:光電轉換模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="958" publication-number="202624491">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624491</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125074</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>檢測外泌體中所含蛋白質之方法</chinese-title>
        <english-title>METHOD FOR DETECTING PROTEIN CONTAINED IN EXOSOME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120251201B">C12Q1/6804</main-classification>
        <further-classification edition="201801120251201B">C12Q1/6886</further-classification>
        <further-classification edition="200601120251201B">G01N33/53</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商安弗瑞亞生命科學有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASFREYA INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>落谷孝広</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OCHIYA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹擇林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, TAEK RIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係提供一種檢測外泌體中所含蛋白質之方法。本發明藉由檢測外泌體中所含蛋白質之方法來解決上述課題，前述方法包含：將從試料分離之包含外泌體之溶液作為測量用樣品，供給至鄰近延伸測定(PEA)，定量前述樣品中的目標蛋白質之步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the present invention is to provide a method for detecting a protein contained in an exosome. &lt;br/&gt;The above problem is solved by a method for detecting a protein contained in an exosome, wherein the method comprises a step of subjecting an exosome-containing solution separated from a sample to a proximity elongation assay (PEA) as a sample for measurement, and quantifying a target protein in the sample.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="959" publication-number="202625771">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625771</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125134</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體晶片</chinese-title>
        <english-title>SEMICONDUCTOR CHIP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260312B">H10P74/00</main-classification>
        <further-classification edition="200601120260312B">G01R31/28</further-classification>
        <further-classification edition="202601120260312B">H10W29/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯詠科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱韋達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, WEI-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李怜潔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, LING-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家綸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIA-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱竣煒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHUN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體晶片，包括多個第一焊墊、多個第二焊墊、多個第一凸塊及多個第二凸塊。第一焊墊和第二焊墊沿著半導體晶片的主動表面的長邊方向配置。第一凸塊配置於第一焊墊上，且用於晶片探針測試。第二凸塊配置於第二焊墊上，且不用於晶片探針測試。第一凸塊的尺寸大於第二凸塊的尺寸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor chip including a plurality of first pads, a plurality of second pads, a plurality of first bumps, and a plurality of second bumps is provided. The first pads and the second pads are arranged along a direction of a long side of an active surface of the semiconductor chip. The first bumps are disposed on the first pads, and configured for a chip probe test. The second bumps are disposed on the second pads, and not for the chip probe test. A size of the first bump is larger than a size of the second bump.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體晶片</p>
        <p type="p">110:基板</p>
        <p type="p">BP1:第一凸塊</p>
        <p type="p">BP2:第二凸塊</p>
        <p type="p">S1:主動表面</p>
        <p type="p">SL:長邊</p>
        <p type="p">SS:短邊</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="960" publication-number="202624312">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624312</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125160</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>共聚物組成物以及硬化體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08F232/04</main-classification>
        <further-classification edition="200601120260302B">H01B3/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商電化股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENKA COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>下斗米伊吹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMOTOMAI, IBUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>前田雄大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAEDA, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大石博久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OISHI, HIROHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中野辰哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANO, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石垣雄平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIGAKI, YUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒井亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAI, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種共聚物組成物，係於硬化體顯示優異的介電特性。針對上述課題，本發明之解決手段為一種α烯烴-芳香族乙烯基-環狀烯烴-芳香族多烯共聚物組成物，係至少在-30℃至35℃以及150℃至250℃的範圍具有玻璃轉移溫度之共聚物組成物，所硬化而成之成形體係顯示：於25℃、40GHz測定到的介電係數為2.0以上至未達2.5，介電損耗正切為0.0001以上至0.0010以下，於25℃之儲存彈性模數為0.5GPa以上，於280℃之儲存彈性模數為2MPa以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="961" publication-number="202624169">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624169</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125224</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>低介電放熱材料</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C04B35/583</main-classification>
        <further-classification edition="200601120260302B">C08F212/34</further-classification>
        <further-classification edition="200601120260302B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商電化股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENKA COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒井亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAI, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南方仁孝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINAKATA, YOSHITAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金子絵梨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANEKO, ERI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之樹脂填充氮化硼板包含多孔質氮化硼燒結板、及填充至上述多孔質氮化硼燒結板所具有之氣孔中之烯烴-芳香族乙烯系化合物-芳香族多烯共聚物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="962" publication-number="202624973">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624973</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125241</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有直接記憶體存取(DMA)管理之裝置及方法</chinese-title>
        <english-title>DEVICE AND METHOD WITH DIRECT MEMORY ACCESS (DMA) MANAGEMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251204B">G06F13/28</main-classification>
        <further-classification edition="200601120251204B">G06F13/14</further-classification>
        <further-classification edition="201801120251204B">G06F9/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜旼澈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, MINCHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴星俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SUNGJOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李庸仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YONG IN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭燦奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, CHANGUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱卿櫓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOO, KYUNG-NO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種直接記憶體存取(DMA)管理裝置及其操作方法。該DMA管理裝置經組態以：對自共用一記憶體之處理器接收之一描述符進行解碼，且將該描述符劃分成數個子描述符；以及將該等子描述符傳輸至DMA引擎，且通過至少一個網路埠將平行處理之一結果傳輸至交換器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A direct memory access (DMA) management device and an operating method thereof are provided. The DMA management device is configured to decode a descriptor received from processors sharing a memory and divide the descriptor into sub-descriptors and transmit the sub-descriptors to DMA engines and transmit a result of parallel processing to a switches through at least one network port.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電腦系統</p>
        <p type="p">101:描述符</p>
        <p type="p">103:處理器</p>
        <p type="p">105:記憶體</p>
        <p type="p">107:子描述符</p>
        <p type="p">110:DMA管理裝置</p>
        <p type="p">113:第一解碼器</p>
        <p type="p">116:子描述符產生器</p>
        <p type="p">120:DMA引擎</p>
        <p type="p">130:網路埠</p>
        <p type="p">140:交換器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="963" publication-number="202624284">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624284</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125330</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光硬化性樹脂組成物、接著劑、密封材、塗覆劑、硬化物、半導體裝置、電子零件、以及使用光硬化性樹脂組成物的硬化、接著、密封及塗覆方法</chinese-title>
        <english-title>PHOTOCURABLE RESIN COMPOSITION, ADHESIVE, SEALANT, COATING AGENT, CURED PRODUCT, SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND CURING, BONDING, SEALING AND COATING METHODS USING THE PHOTOCURABLE RESIN COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08F2/44</main-classification>
        <further-classification edition="200601120260302B">C08F2/50</further-classification>
        <further-classification edition="200601120260302B">C08F22/40</further-classification>
        <further-classification edition="200601120260302B">C09D4/00</further-classification>
        <further-classification edition="200601120260302B">C09J4/00</further-classification>
        <further-classification edition="200601120260302B">C09K3/10</further-classification>
        <further-classification edition="202601120260302B">H10W74/47</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商納美仕有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAMICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齊藤信雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, NOBUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大坪広大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUBO, KODAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩谷一希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWAYA, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永田理恵子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGATA, RIEKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種不經由加熱來進行硬化處理即可完成硬化，且可抑制VOC釋放之光硬化性樹脂組成物、包含該光硬化性樹脂組成物之接著劑、密封材或塗覆劑、其硬化物、包含該硬化物之半導體裝置或電子零件，以及使用硬化性樹脂組成物之硬化方法、接著方法、密封方法及塗覆方法。  &lt;br/&gt;本發明係提供光硬化性樹脂組成物、包含該光硬化性樹脂組成物之接著劑、密封材或塗覆劑、其硬化物、包含該硬化物之半導體裝置或電子零件，以及使用光硬化性樹脂組成物之硬化方法、接著方法、密封方法及塗覆方法，其中該光硬化性樹脂組成物包含：  &lt;br/&gt;(A)聚合性化合物、  &lt;br/&gt;(B)在與聚合性化合物混合之狀態下，經X射線照射而發出波長500nm以下的光之螢光體，  &lt;br/&gt;其係至少滿足以下特徵(a)及(b)中的至少1者：  &lt;br/&gt;(a)(A)聚合性化合物中包含馬來醯亞胺化合物；  &lt;br/&gt;(b)光硬化性樹脂組成物中包含(C)肟酯系光聚合起始劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An objective of the present invention is to provide a photocurable resin composition that allows complete curing without heat treatment and suppresses VOC emissions, an adhesive, sealant or coating agent containing the photocurable resin composition, a cured product thereof, a semiconductor device or electronic component containing the cured product, and curing, bonding, sealing and coating methods using the photocurable resin composition. &lt;br/&gt;The present invention provides a photocurable resin composition that contains: &lt;br/&gt;(A) a polymerizable compound; and &lt;br/&gt;(B) a phosphor that, when mixed with the polymerizable compound, emits light with a wavelength of 500 nm or less upon X-ray irradiation, &lt;br/&gt;wherein at least one of the following characteristics (a) and (b) is satisfied: &lt;br/&gt;(a) the (A) polymerizable compound contains a maleimide compound; and &lt;br/&gt;(b) the photocurable resin composition contains (C) an oxime ester-based photopolymerization initiator. &lt;br/&gt;Also provided in the present invention are an adhesive, sealant or coating agent containing the photocurable resin composition, a cured product thereof, a semiconductor device or electronic component containing the cured product, and curing, bonding, sealing and coating methods using the photocurable resin composition.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="964" publication-number="202625599">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625599</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125362</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>複合基板及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D62/40</main-classification>
        <further-classification edition="202601120260302B">H10P14/60</further-classification>
        <further-classification edition="202601120260302B">H10P95/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本碍子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGK INSULATORS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本岳士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山寺喬紘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADERA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>近藤亘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONDO, WATARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小木曽裕佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGISO, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>片桐佳来</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATAGIRI, YOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種複合基板，可以維持電荷捕捉的性能、可以有助於用於高頻及/或高諧波用途的裝置情況的高性能化且可以廉價地製造。根據本發明實施形態的複合基板，依序具備：具有結晶性的支撐基板、第一改質層、第二改質層與活性層。第二改質層包含與構成支撐基板的元素同種的元素的非晶質結構。第一改質層包含與構成支撐基板的元素同種的元素。第一改質層中的原子排列的規則性與第二改質層中的原子排列的規則性互異。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:支撐基板</p>
        <p type="p">10a:上面</p>
        <p type="p">10b:下面</p>
        <p type="p">20:活性層</p>
        <p type="p">21:氧化膜層</p>
        <p type="p">30:改質層</p>
        <p type="p">31:第一改質層</p>
        <p type="p">32:第二改質層</p>
        <p type="p">100:複合基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="965" publication-number="202625840">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625840</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125363</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>複合基板及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W70/69</main-classification>
        <further-classification edition="202601120260302B">H10W76/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本碍子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGK INSULATORS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本岳士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>近藤亘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONDO, WATARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長屋昇吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAYA, SHOGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>片桐佳来</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATAGIRI, YOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種複合基板，可以有助於用於高諧波用途的裝置情況的高性能化。根據本發明實施形態的複合基板，依序具備：具有結晶性的支撐基板、將支撐基板的結晶性改質的改質層與活性層。相對於平面視野的全面積，改質層的面積占比為40%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:支撐基板</p>
        <p type="p">100:複合基板</p>
        <p type="p">301:改質部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="966" publication-number="202624364">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624364</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125402</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液晶聚合物薄膜、覆金屬積層板及其製造方法、以及電路基板及多層電路基板</chinese-title>
        <english-title>LIQUID CRYSTAL POLYMER FILM, METAL-CLAD LAMINATE AND METHOD FOR PRODUCING SAME, AND CIRCUIT BOARD AND MULTILAYER CIRCUIT BOARD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08J5/18</main-classification>
        <further-classification edition="200601120260302B">B29C55/18</further-classification>
        <further-classification edition="200601120260302B">B32B15/09</further-classification>
        <further-classification edition="200601120260302B">B32B27/36</further-classification>
        <further-classification edition="200601120260302B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商可樂麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURARAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐佐木翔真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKI, SHOMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中島崇裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKASHIMA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中和幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, KAZUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種與金屬片積層而作成覆金屬積層板時，能夠製造積層後的液晶聚合物薄膜的Tg以下的熱膨脹係數與Tg以上的熱膨脹係數為同等之覆金屬積層板之液晶聚合物薄膜。前述液晶聚合物薄膜係包含液晶聚合物之薄膜，熔點為270℃以上，其中在機械方向及橫切方向，30℃至薄膜的玻璃轉移溫度(Tg)的熱膨脹係數(CTE1&lt;sub&gt;MD&lt;/sub&gt;、CTE1&lt;sub&gt;TD&lt;/sub&gt;)、與Tg至200℃的熱膨脹係數(CTE2&lt;sub&gt;MD&lt;/sub&gt;、CTE2&lt;sub&gt;TD&lt;/sub&gt;)滿足CTE1&lt;sub&gt;MD&lt;/sub&gt;＞CTE2&lt;sub&gt;MD&lt;/sub&gt;、CTE1&lt;sub&gt;TD&lt;/sub&gt;＞CTE2&lt;sub&gt;TD&lt;/sub&gt;、CTE1&lt;sub&gt;MD&lt;/sub&gt;≦0ppm/℃及CTE1&lt;sub&gt;TD&lt;/sub&gt;≦5.0ppm/℃的關係。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a liquid crystal polymer film which can be used to produce a metal-clad laminate in which the liquid crystal polymer film and a metal sheet are laminated together, wherein the metal-clad laminate shows comparable coefficients of thermal expansion in the temperature range of no more than a glass transition temperature (Tg) of the laminated liquid crystal polymer film and in the temperature range of no less than the Tg. The liquid crystal polymer film is a film including a liquid crystal polymer, has a melting point of 270°C or higher, and has coefficients of thermal expansion (CTE1&lt;sub&gt;MD&lt;/sub&gt;, CTE1&lt;sub&gt;TD&lt;/sub&gt;) from 30°C to the Tg and coefficients of thermal expansion (CTE2&lt;sub&gt;MD&lt;/sub&gt;, CTE2&lt;sub&gt;TD&lt;/sub&gt;) from the Tg to 200°C in the machine direction and the transverse direction, which satisfy the following relations: CTE1&lt;sub&gt;MD&lt;/sub&gt; ＞ CTE2&lt;sub&gt;MD&lt;/sub&gt;, CTE1&lt;sub&gt;TD&lt;/sub&gt; ＞ CTE2&lt;sub&gt;TD&lt;/sub&gt;, CTE1&lt;sub&gt;MD&lt;/sub&gt; ≤ 0 ppm/°C, and CTE1&lt;sub&gt;TD&lt;/sub&gt; ≤ 5.0 ppm/°C.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:捲出輥</p>
        <p type="p">2:捲取輥</p>
        <p type="p">3,4,5,6,7:加熱輥</p>
        <p type="p">8:前驅物薄膜</p>
        <p type="p">9,10:導輥</p>
        <p type="p">11:液晶聚合物薄膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="967" publication-number="202624561">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624561</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125571</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鍍覆裝置及鍍覆方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">C25D17/02</main-classification>
        <further-classification edition="200601120260303B">C25D5/18</further-classification>
        <further-classification edition="200601120260303B">C25D21/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商荏原製作所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EBARA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辻一仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUJI, KAZUHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芹沢祐太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SERIZAWA, YUTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>関正也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKI, MASAYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾文岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳凱智</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案可在進行脈衝鍍覆的各種類型的鍍覆裝置中，提高鍍覆膜厚的均勻化。本案所提供的鍍覆裝置具備：第一鍍覆槽，向基板與陽極之間施加正向電流及反向電流脈衝，從而對上述基板進行鍍覆；第一流路，與儲液罐連接，用於從上述儲液罐排出鍍覆液；第二流路，與上述第一流路及上述第一鍍覆槽連接，向上述第一鍍覆槽供給鍍覆液；第三流路，與上述第一流路連接，使從上述儲液罐排出的鍍覆液繞過上述第一鍍覆槽而回到上述儲液罐或者向排出口排出；第一閥，用於在上述第二流路與上述第三流路之間調節鍍覆液的流動；以及控制模組，在上述基板的鍍覆中，根據反向電流脈衝的時機來控制上述第一閥，從而在上述第二流路與上述第三流路之間調節鍍覆液的流動，使向上述第二流路的鍍覆液的供給停止或者與正向電流的區間相比減少。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:鍍覆槽</p>
        <p type="p">17A、17B:陰極液供給口</p>
        <p type="p">17C:陰極液排放口</p>
        <p type="p">410:儲液罐</p>
        <p type="p">411、412、413、414:流路</p>
        <p type="p">420:泵</p>
        <p type="p">430:流路調節機構</p>
        <p type="p">440:流量計</p>
        <p type="p">800:控制模組</p>
        <p type="p">801:處理器</p>
        <p type="p">802:記憶裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="968" publication-number="202623850">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623850</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125595</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>美容器具</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">A61N1/36</main-classification>
        <further-classification edition="200601120260309B">A61N1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下知識產權經營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原田莉子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARADA, RIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北村央</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAMURA, HISASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大野木洋子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONOGI, YOKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">實施形態之美容器具(1)具備：本體部(10)；施術部(20)，在從本體部(10)的厚度方向(Z)觀看的狀態下，設置於本體部(10)的端部，並且形成為外周緣具有至少一個凸曲部(22)及至少一個凹曲部；及電極部(31~34)，為3極以上且以互相分開的狀態設置於施術部(20)。並且，由3極以上的電極部(31~34)的每一個、及3極以上的電極部(31~34)的每一個的周圍所構成的群組中選擇的至少一個部分上分別形成有凹部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:美容器具</p>
        <p type="p">10:本體部</p>
        <p type="p">12:中空部</p>
        <p type="p">16:支撐部</p>
        <p type="p">20:施術部</p>
        <p type="p">21:殼體</p>
        <p type="p">22:凸曲部</p>
        <p type="p">23:第1凸曲部</p>
        <p type="p">24:第2凸曲部</p>
        <p type="p">25:第3凸曲部</p>
        <p type="p">30:電極部</p>
        <p type="p">31:第1電極部</p>
        <p type="p">31a:第1露出部</p>
        <p type="p">32:第2電極部</p>
        <p type="p">32a:第2露出部</p>
        <p type="p">33:第3電極部</p>
        <p type="p">33a:第3露出部</p>
        <p type="p">34:第4電極部</p>
        <p type="p">34a:第4露出部</p>
        <p type="p">40:加熱部</p>
        <p type="p">X:長邊方向(X方向)</p>
        <p type="p">Y:短邊方向(Y方向)</p>
        <p type="p">Z:厚度方向(Z方向)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="969" publication-number="202625710">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625710</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125616</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在蝕刻過程振盪晶圓之蝕刻裝置</chinese-title>
        <english-title>ETCHING APPARATUS THAT OSCILLATE WAFERS DURING ETCHING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260309B">H10P50/64</main-classification>
        <further-classification edition="202601120260309B">H10P72/70</further-classification>
        <further-classification edition="202601120260309B">H10P95/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>環球晶圓股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLOBALWAFERS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江姿岑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, TZU-TSEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉德振</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, TE-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林依文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, I-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格雷比　艾利西斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRABBE, ALEXIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪榮宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示蝕刻裝置，其使安置於該蝕刻裝置內之晶圓振盪。該蝕刻裝置可使一或多個輥振盪以使該等晶圓振盪，或者可包含一或多個輥，該一或多個輥具有具使該等晶圓軸向地移動之軸向起伏部之凹槽。亦揭示用於使用此裝置蝕刻晶圓之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Etching apparatus that oscillate wafers disposed within the etching apparatus. The etching apparatus may oscillate one or more rollers to cause the wafers to oscillate or may include one or more rollers having grooves with axial undulations that cause the wafers to move axially. Methods for etching wafers that use such apparatus are also disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:蝕刻裝置/裝置</p>
        <p type="p">35:底部輥/輥/下部輥</p>
        <p type="p">46:頂部輥/輥</p>
        <p type="p">70:驅動器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="970" publication-number="202624468">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624468</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125633</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>加工液</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C10M131/08</main-classification>
        <further-classification edition="200601120260302B">C10M107/34</further-classification>
        <further-classification edition="200601320260302B">C10N30/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商出光興產股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IDEMITSU KOSAN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北村友彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAMURA, TOMOHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓬田知行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOMOGITA, AKINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可在複線式線鋸裝置中使用之具有適當切斷性能且清潔性優異之加工液。&lt;br/&gt;  具體上係一種加工液，其含有有效成分及水；&lt;br/&gt;  前述有效成分含有下述成分(A)及成分(B)，且以前述有效成分總量基準計該成分(B)之含量為25.0質量%以下；&lt;br/&gt;  成分(A)：選自伸烷基二醇及未經環氧氯丙烷改質之聚氧伸烷基化合物中之一種以上；&lt;br/&gt;  成分(B)：環氧氯丙烷改質聚氧伸烷基化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="971" publication-number="202625270">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625270</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125692</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水性組成物、不鏽鋼開孔箔及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">H01M4/66</main-classification>
        <further-classification edition="200601120260306B">H01M4/70</further-classification>
        <further-classification edition="201001120260306B">H01M10/0585</further-classification>
        <further-classification edition="200601120260306B">C23F1/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉本和志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIMOTO, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池田和彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEDA, KADUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松山洋介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUYAMA, YOUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林郁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種水性組成物，係用以於不鏽鋼箔之厚度方向形成貫穿孔，以該水性組成物之總量基準計，包含：0.01質量%以上且20質量%以下的過氧化氫、及1質量%以上且30質量%以下的鹵素離子；以及一種不鏽鋼開孔箔之製造方法，包含：使該水性組成物與不鏽鋼箔接觸，而形成於不鏽鋼箔之厚度方向貫穿之多個貫穿孔的貫穿孔形成步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="972" publication-number="202624201">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624201</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125697</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氰酸酯化合物、樹脂組成物、硬化物、預浸體、密封用材料、纖維強化複合材料、及黏接劑</chinese-title>
        <english-title>CYANATE ESTER COMPOUND, RESIN COMPOSITION, CURED PRODUCT, PREPREG, ENCAPSULATING MATERIAL, FIBER-REINFORCED COMPOSITE MATERIAL, AND ADHESIVE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">C07C265/12</main-classification>
        <further-classification edition="200601120260305B">C08K5/29</further-classification>
        <further-classification edition="200601120260305B">C08J5/24</further-classification>
        <further-classification edition="200601120260305B">C09J11/06</further-classification>
        <further-classification edition="200601120260305B">C09K3/10</further-classification>
        <further-classification edition="200601120260305B">B29C70/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩本慎平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWAMOTO, SHINPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村涼太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, RYOTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>片桐誠之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATAGIRI, MASAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林郁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的係提供具有低介電常數及低介電損耗正切，且具有優良之吸水性、低熱膨脹係數、以及高玻璃轉移溫度之氰酸酯化合物、樹脂組成物、硬化物、預浸體、密封用材料、纖維強化複合材料、及黏接劑。本發明之氰酸酯化合物，具有式(1)表示之結構，且利用凝膠滲透層析法所測得之標準聚苯乙烯換算之數量平均分子量(Mn)為850以上3000以下。&lt;br/&gt;&lt;img align="absmiddle" height="161px" width="592px" file="ed10040.JPG" alt="ed10040.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention aims to provide a cyanate ester compound having a low dielectric constant and low dielectric loss tangent, excellent water absorption properties, a low coefficient of thermal expansion, and a high glass transition temperature; and also to provide a resin composition, a cured product, a prepreg, an encapsulating material, a fiber-reinforced composite material, and an adhesive. The cyanate ester compound of the present invention has a structure represented by formula (1), and has a number-average molecular weight (Mn) of 850 or more and 3000 or less in terms of standard polystyrene, as measured by gel permeation chromatography.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="973" publication-number="202624524">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624524</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125706</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>藉由循環式沉積及處理的氮化物層形成</chinese-title>
        <english-title>NITRIDE LAYER FORMATION BY CYCLIC DEPOSITION AND TREATMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C23C16/34</main-classification>
        <further-classification edition="200601120260302B">C23C16/42</further-classification>
        <further-classification edition="200601120260302B">C23C16/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬治　強納森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHURCH, JONATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提出一種在基板上產生模堆疊的方法。該模堆疊包含交替之矽氮化物層與矽氧化物層。該方法包括形成複數層交替的矽氮化物與矽氧化物。使用複數循環來沉積至少一矽氮化物層。每一循環包括沉積一矽氮化物子層、以及在該矽氮化物子層上執行不具有矽氮化物沉積的一電漿處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for generating a mold stack on a substrate is presented. The mold stack comprises alternating layers of silicon nitride and silicon oxide. The method comprises forming a plurality of layers of alternating silicon nitride and silicon oxide. At least one silicon nitride layer is deposited using a plurality of cycles. Each cycle comprises depositing a sublayer of silicon nitride and performing a plasma treatment without silicon nitride deposition on the sublayer of silicon nitride.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:方法</p>
        <p type="p">310:形成複數層交替的矽氮化物與矽氧化物之步驟</p>
        <p type="p">320:使用複數循環來沉積至少一矽氮化物層之步驟</p>
        <p type="p">330:沉積矽氮化物子層之步驟</p>
        <p type="p">340:使用包含一或更多含矽前驅物與一或更多含氮前驅物的氣體混合物來形成電漿之步驟</p>
        <p type="p">350:在矽氮化物子層上執行不具有矽氮化物沉積的電漿處理之步驟</p>
        <p type="p">360:在高於沉積溫度的退火溫度下對模堆疊進行退火之步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="974" publication-number="202624320">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624320</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125708</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚胺基甲酸酯分散液及油墨組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">C08G18/65</main-classification>
        <further-classification edition="201401120260304B">C09D11/102</further-classification>
        <further-classification edition="201401120260304B">C09D11/30</further-classification>
        <further-classification edition="200601120260304B">B41J2/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI CHEMICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下達也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHITA, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>甲田千佳子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOUDA, CHIKAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福田和幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUDA, KAZUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之聚胺基甲酸酯分散液係聚胺基甲酸酯樹脂經水分散所成。聚胺基甲酸酯樹脂係異氰酸酯基末端預聚物與鏈延長劑之反應生成物。異氰酸酯基末端預聚物係聚異氰酸酯成分與含有大分子多元醇及含親水基活性氫化合物之多元醇成分的反應生成物。鏈延長劑含有3官能性胺。聚胺基甲酸酯樹脂之酸值為6.5 mgKOH/g以上且15.5 mgKOH/g以下。聚胺基甲酸酯樹脂之胺基甲酸乙酯基濃度及脲基濃度的合計為20.0%以下。聚胺基甲酸酯樹脂之重量平均分子量為50000以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="975" publication-number="202624377">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624377</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125726</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用羧酸鈉鹽及氮基螯合劑以恢復N-醯氧胺在鎂金屬鹽存在下的可控降解性能</chinese-title>
        <english-title>USE OF CARBOXYLATE SODIUM SALT AND NITROGEN BASE CHELATING AGENTS TO RESTORE THE CONTROLLED DEGRADATION PERFORMANCE OF N-ACYLOXYAMINE IN THE PRESENCE OF MAGNESIUM METAL SALT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">C08K5/098</main-classification>
        <further-classification edition="200601120260304B">C08K5/3472</further-classification>
        <further-classification edition="200601120260304B">C08K5/25</further-classification>
        <further-classification edition="200601120260304B">C08F8/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商巴地斯顏料化工廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASF SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅諾茲　艾杜爾多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENOZZI, EDOARDO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慕勒　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUELLER, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫德利希　威珀特　維布克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WUNDERLICH-WIPPERT, WIEBKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李允中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種在自由基生成劑及鎂鹽存在下熱降解包括聚丙烯或丙烯共聚物之聚合物組合物之方法，其中該熱降解係在選自由以下組成之群之螯合劑存在下實施：胺基羧酸、羥基羧酸、多羧酸鹽、經取代三唑及經取代柳醯基醯肼或柳醯基醯胺。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A process for the thermal degradation of a polymer composition comprising polypropylene or propylene copolymers in the presence of a free radical generator and a magnesium salt, wherein the thermal degradation is carried out in the presence of a chelating agent selected from the group consisting of aminocarboxylic acids, hydroxycarboxylic acids, polycarboxylic acid salts, substituted triazoles and substituted salicyloyl hydrazides or salicyloyl amides.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="976" publication-number="202625550">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625550</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125746</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於三維（３Ｄ）堆疊動態隨機存取記憶體（ＤＲＡＭ）上的ＤＲＡＭ單元修復測試的ＤＲＡＭ測試墊配置方法</chinese-title>
        <english-title>DYNAMIC RANDOM-ACCESS MEMORY (DRAM) TEST PAD ARRANGEMENT METHOD FOR A DRAM CELL REPAIR TEST ON THREE-DIMENSIONAL (3D) STACKED DRAM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260309B">H10B12/00</main-classification>
        <further-classification edition="202601120260309B">H10B80/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康　宇泰格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, WOO TAG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝達羅格魯　默斯塔法</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BADAROGLU, MUSTAFA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔　智弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, JIHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　中澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZHONGZE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>娜拉帕帝　吉里德爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NALLAPATI, GIRIDHAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曲丹巴瑞　派瑞安南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIDAMBARAM, PERIANNAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述一種記憶體晶圓。該記憶體晶圓包括：記憶體晶粒，其在該記憶體晶圓上。額外地，該記憶體晶圓包括：導線連接，其至少部分地在該等記憶體晶粒中之一者內。該等導線連接經組態以耦接至沿著該等記憶體晶粒中之該一者與相鄰記憶體晶粒之間的至少一切割線的記憶體測試及修復墊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory wafer is described. The memory wafer includes memory dies on the memory wafer. Additionally, the memory wafer includes wire connections at least partially within one of the memory dies. The wire connections are configured to couple to memory test and repair pads along at least one scribe line between the one of the memory dies and adjacent memory dies.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500,510,520,530,540:步驟</p>
        <p type="p">502,512,522:DRAM晶圓</p>
        <p type="p">532:DRAM晶圓堆疊</p>
        <p type="p">542:SoC晶圓</p>
        <p type="p">550:3D堆疊記憶體晶圓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="977" publication-number="202624143">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624143</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125773</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>控制逆滲透系統中總有機碳的方法</chinese-title>
        <english-title>METHOD OF CONTROLLING TOTAL ORGANIC CARBON IN REVERSE OSMOSIS SYSTEMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260302B">C02F1/58</main-classification>
        <further-classification edition="202301120260302B">C02F1/70</further-classification>
        <further-classification edition="202301120260302B">C02F1/76</further-classification>
        <further-classification edition="200601320260302B">C02F101/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商埃科萊布美國股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ECOLAB USA INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雍　順祜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, SEONG-HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, NING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供降低逆滲透滲透液中尿素濃度的方法，該方法包括：用次溴酸鹽處理逆滲透程序的進水，以提供相對於未處理的進水具有降低的尿素濃度的次溴酸鹽處理的進水，可選地用還原劑、活性炭、紫外(UV)光或其組合減少次溴酸鹽處理的進水中殘留的氧化性鹵素種類，向次溴酸鹽處理的進水中添加氧化性除生物劑，以提供除生物劑處理的進水，以及使除生物劑處理的進水與逆滲透膜接觸，以提供逆滲透滲透液。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a method of reducing urea concentration in a reverse osmosis permeate, the method comprising: treating feed water of a reverse osmosis process with hypobromite to provide hypobromite-treated feed water with reduced urea concentration relative to the untreated feed water, optionally reducing residual oxidizing halogen species in the hypobromite-treated feed water with a reducing agent, activated carbon, ultraviolet (UV) light, or a combination thereof, adding an oxidative biocide to the hypobromite-treated feed water to provide biocide-treated feed water, and contacting the biocide-treated feed water with a reverse osmosis membrane to provide the reverse osmosis permeate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="978" publication-number="202624531">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624531</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125791</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氧化劑氣體或氧化劑蒸氣產生及遞送之系統及方法</chinese-title>
        <english-title>OXIDANT GAS OR OXIDANT VAPOR GENERATION AND DELIVERY SYSTEMS AND METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">C23C16/455</main-classification>
        <further-classification edition="201801120260303B">F16L53/30</further-classification>
        <further-classification edition="200601120260303B">F17D1/04</further-classification>
        <further-classification edition="200601120260303B">F17D1/065</further-classification>
        <further-classification edition="200601120260303B">C22C16/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商拉瑟克股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RASIRC, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海森　丹尼爾　Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAZEN, DANIEL KAZUMA-TOH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍姆斯　魯塞爾　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOLMES, RUSSELL J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海萊因　愛德華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEINLEIN, EDWARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾瓦雷茲　阿德里安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALVAREZ, ADRIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加勒森　約書亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARRETSON, JOSHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯佩格曼　傑佛瑞　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPIEGELMAN, JEFFREY J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文所述之技術係關於一種用於遞送氣體之方法，該方法包括：使用系統之氧化劑氣體或氧化劑蒸氣源形成包括氧化劑氣體或氧化劑蒸氣之氣流；使用金屬管道將該氣流自該氧化劑氣體或氧化劑蒸氣源運輸至該系統之另一位置；以及使用耦接至該金屬管道之加熱器具來加熱該金屬管道。該金屬管道可包括金屬合金，其中該金屬合金之至少90%為：鋯；鉿；鉭；鋯及鉿之組合；鋯及鉭之組合；鉿及鉭之組合；或鋯、鉿及鉭之組合。氣體或蒸氣遞送系統可包括氧化劑氣體或氧化劑蒸氣源；包括該金屬合金之金屬管道；以及耦接至該金屬管道之加熱器具。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The techniques described herein relate to a method for delivering a gas including: forming a gas stream including an oxidant gas or oxidant vapor using an oxidant gas or oxidant vapor source of a system; transporting the gas stream from the oxidant gas or oxidant vapor source to another location of the system using a metal conduit; and heating the metal conduit using a heating apparatus coupled to the metal conduit. The metal conduit can include a metal alloy, wherein at least 90% of the metal alloy is: zirconium; hafnium; tantalum; a combination of zirconium and hafnium; a combination of zirconium and tantalum; a combination of hafnium and tantalum; or a combination of zirconium, hafnium, and tantalum. A gas or vapor delivery system can include an oxidant gas or oxidant vapor source; a metal conduit including the metal alloy; and a heating apparatus coupled to the metal conduit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">110:腔室</p>
        <p type="p">120:材料</p>
        <p type="p">130:入口</p>
        <p type="p">140:出口</p>
        <p type="p">150:氧化劑氣體或氧化劑蒸氣源</p>
        <p type="p">160:氣體遞送系統</p>
        <p type="p">170:加熱器</p>
        <p type="p">180a:管道</p>
        <p type="p">180b:管道</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="979" publication-number="202624461">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624461</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125831</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氧化矽膜蝕刻液組合物及使用其的蝕刻方法</chinese-title>
        <english-title>ETCHANT COMPOSITION FOR SILICON OXIDE LAYER AND ETCHING METHOD USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">C09K13/08</main-classification>
        <further-classification edition="202601120260306B">H10P50/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商易安愛富科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENF TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳正植</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, JEONG SIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金學秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HAK SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金起瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, GI YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭繁盛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, BEON SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李明鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MYUNG HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋明根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, MYUNG GEUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金址洹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JIWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金貞兒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JUNGAH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金相完</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SANGWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裵相元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE, SANG WON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳翠華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種氧化矽膜蝕刻液組合物，所述組合物包含氟化氫（HF）、氟化銨（NH&lt;sub&gt;4&lt;/sub&gt;F）、（C4-C20）烷基胺、胺系低聚化合物及有機酸，所述組合物能夠在最大限度地減少對例如氮化矽膜、氟氧化矽膜等絕緣膜及金屬的損壞的同時選擇性地蝕刻氧化矽膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to an etchant composition for a silicon oxide layer containing hydrogen fluoride (HF), ammonium fluoride (NH&lt;sub&gt;4&lt;/sub&gt;F), (C4-C20) alkylamine, an amine-based oligomeric compound, and an organic acid, which may selectively etch a silicon oxide layer while minimizing damage to insulating layers such as a silicon nitride layer and a silicon oxyfluoride layer and a metal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="980" publication-number="202624947">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624947</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125923</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>頭戴式顯示器、虛擬物件調整方法及其非暫態電腦可讀取記錄媒體</chinese-title>
        <english-title>HEAD-MOUNTED DISPLAY, VIRTUAL OBJECT ADJUSTMENT METHOD, AND NON-TRANSITORY COMPUTER READABLE STORAGE MEDIUM THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250801B">G06F3/04815</main-classification>
        <further-classification edition="201301120250801B">G06F3/0487</further-classification>
        <further-classification edition="200601120250801B">G02B27/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏達國際電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HTC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李冠慰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, KUAN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種頭戴式顯示器、虛擬物件調整方法及其非暫態電腦可讀取記錄媒體。該裝置判斷是否具有一至少一接觸動作位於該虛擬物件對應之至少一控制區域。該裝置響應於具有該至少一接觸動作位於該虛擬物件對應之至少一控制區域，計算至少一指標物件之一位移值。該裝置基於該至少一指標物件的該位移值，調整該虛擬物件之一外觀形狀。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A head-mounted display, virtual object adjustment method, and non-transitory computer readable storage medium thereof are provided. The device determines whether there is at least one contact action located in at least one control area corresponding to a virtual object. In response to the at least one contact action being located in the at least one control area corresponding to the virtual object, the device calculates a displacement value of at least one indicator object. The device adjusts an appearance shape of the virtual object based on the displacement value of the at least one indicator object.</p>
      </isu-abst>
      <representative-img>
        <p type="p">900:虛擬物件調整方法</p>
        <p type="p">S901、S903、S905:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="981" publication-number="202624342">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624342</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125936</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚醚化合物之製造方法、具有反應性矽基之聚醚化合物之製造方法、具有胺甲酸酯鍵之聚醚化合物之製造方法及具有聚合性不飽和基之聚醚化合物之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">C08G65/28</main-classification>
        <further-classification edition="200601120260303B">C08G65/336</further-classification>
        <further-classification edition="200601120260303B">C08G18/48</further-classification>
        <further-classification edition="200601120260303B">C08L71/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＡＧＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹田吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEDA, HAJIME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒井豪明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAI, TAKEAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小口亮平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOGUCHI, RYOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明具有羥基之聚醚化合物之製造方法包含在複合金屬氰化物錯合物觸媒存在下使含AO原料中之AO對具有羥基之引發劑進行聚合的步驟，且含AO原料之酸值為0.001~0.008mgKOH/g；具有反應性矽基之聚醚化合物之製造方法更包含將聚醚化合物之羥基轉換成具有反應性矽基之基團的步驟；具有胺甲酸酯鍵之聚醚化合物之製造方法更包含使具有羥基之聚醚化合物與多異氰酸酯進行反應的步驟；並且，具有聚合性不飽和基之聚醚化合物之製造方法更包含將聚醚化合物之羥基轉換成具有聚合性不飽和基之基團的步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="982" publication-number="202624402">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624402</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125950</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液晶聚酯組合物及成形體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08L67/00</main-classification>
        <further-classification edition="200601120260302B">C08K5/10</further-classification>
        <further-classification edition="200601120260302B">C08K7/02</further-classification>
        <further-classification edition="200601120260302B">C09K19/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小森一弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMORI, KAZUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小笠原健悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGASAWARA, KENGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種液晶聚酯組合物，其含有液晶聚酯、及包含季戊四醇四硬脂酸酯之脫模劑，且脫模劑滿足(a)及(b)。  (a)氮氣氛圍下之1%重量損失溫度為270℃以上360℃以下。  (b)於120℃下加熱20小時之過程中所產生之高沸成分量為15 ppm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="983" publication-number="202624120">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624120</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125974</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>低折射率膜形成用凝膠之製造方法、低折射率膜形成用塗佈液之製造方法以及低折射率膜之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">C01B33/155</main-classification>
        <further-classification edition="200601120260306B">C08J3/09</further-classification>
        <further-classification edition="201501120260306B">G02B1/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤啓介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>服部大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATTORI, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠形成低折射率膜之凝膠及塗佈液之製造方法，該低折射率膜兼具非常低之折射率及可容許之霧度值。本發明之實施方式之低折射率膜形成用凝膠之製造方法包括使凝膠之原料於凝膠製造用溶劑中凝膠化之凝膠化步驟，包括向凝膠製造用溶劑中導入微細氣泡。於一實施方式中，凝膠製造用溶劑中之微細氣泡之中值粒徑D50為200 nm以下，且氣泡直徑分佈之半高寬為400 nm以下。本發明之實施方式之低折射率膜形成用塗佈液之製造方法包括溶劑置換步驟，該溶劑置換步驟係將包含藉由低折射率膜形成用凝膠之製造方法所得之凝膠之混合液中之凝膠製造用溶劑置換成其他溶劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="984" publication-number="202625698">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625698</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126089</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>處理方法、半導體裝置之製造方法、處理裝置及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260303B">H10P50/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商國際電氣股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本貴之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田原開悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAHARA, KAIGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀田英樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORITA, HIDEKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠高效地進行基板表面的蝕刻並提高生產率的技術。其具有：(a)形成在處理容器內配置有製品基板及含氮物的狀態的步驟；及(b)藉由向配置有上述製品基板及上述含氮物的狀態的上述處理容器內供給含氟物質，而利用藉由使上述含氮物與上述含氟物質發生化學反應而產生的物質X，對上述製品基板的表面進行蝕刻的步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="985" publication-number="202624184">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624184</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126102</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>有機酸鹽的製造方法及鈣鈦礦型複合氧化物的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">C07C51/41</main-classification>
        <further-classification edition="200601120260306B">C01G23/00</further-classification>
        <further-classification edition="200601120260306B">C07C55/06</further-classification>
        <further-classification edition="200601120260306B">C07F3/00</further-classification>
        <further-classification edition="200601120260306B">C07F7/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON CHEMICAL INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金輪諒太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANAWA, RYOTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>国枝武久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNIEDA, TAKEHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種在工業上有利地製造可獲得粒徑小且高結晶的鈣鈦礦型複合氧化物的有機酸鹽的方法。一種有機酸鹽的製造方法，一邊將含有有機酸的溶液（A液）、以及含有A位元素化合物及B位元素化合物的溶液（B液）供給至反應容器，一邊自該反應容器排出反應容器內的液體，同時進行有機酸鹽的生成反應，所述有機酸鹽的製造方法的特徵在於，在該反應容器內，一邊攪拌該反應容器內的液體、及相對於該反應容器內的液體的體積為5.0體積%～95.0體積%的粒狀介質，一邊向該反應容器供給該A液及該B液，同時自該反應容器排出該反應容器內的液體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:A液</p>
        <p type="p">2:B液</p>
        <p type="p">3:液體</p>
        <p type="p">5:反應容器</p>
        <p type="p">6:攪拌機</p>
        <p type="p">7:粒狀介質</p>
        <p type="p">8:A液的供給管</p>
        <p type="p">9:B液的供給管</p>
        <p type="p">10:排出管</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="986" publication-number="202624152">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624152</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126121</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資訊處理裝置、學習模型製作裝置、資訊處理方法、學習模型製作方法及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C03B5/16</main-classification>
        <further-classification edition="200601120260302B">C03B5/24</further-classification>
        <further-classification edition="201901120260302B">G06N20/00</further-classification>
        <further-classification edition="201701120260302B">G06T7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＡＧＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安宅大騎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ATAKA, DAIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹島壮郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKESHIMA, MORIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉中泰輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHINAKA, TAIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之目的在於提供一種可穩定掌握坯料之表層狀態之資訊處理裝置、學習模型製作裝置、資訊處理方法、學習模型製作方法及程式。  &lt;br/&gt;本揭示之資訊處理裝置具備：圖像處理部，其基於對玻璃熔融爐之爐內之圖像、與包含顯示圖像所包含之一個或複數個對象物之一個或複數個區域之圖像之關係進行機器學習之已學習模型、與爐內之圖像，製作包含顯示圖像所包含之一個或複數個對象物之一個或複數個區域之已圖像處理圖像；及導出部，其基於圖像處理部製作之已圖像處理圖像，導出顯示坯料流體之資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:熔融槽</p>
        <p type="p">20:上部構造物</p>
        <p type="p">40:熱電偶</p>
        <p type="p">50:通電電極</p>
        <p type="p">60:燃燒器</p>
        <p type="p">70:玻璃原料</p>
        <p type="p">100:玻璃熔融爐</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="987" publication-number="202625321">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625321</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126162</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>針腳植入裝置</chinese-title>
        <english-title>PIN POPULATION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">H01R43/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商ＢＡＥ系統公營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE SYSTEMS PLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾哈邁德　穆罕默德易卜拉欣福耶茲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHMED, MOHAMMED IBRAHIM FOYEZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特納　馬修勞倫斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TURNER, MATHEW LAWRENCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種針腳植入裝置，用於將複數個連接器針腳插入至具有一陣列的可定址孔之一針腳觸點插座中，每一連接器針腳包括在某一末端處之一內部安裝空腔、及在另一者處之一頂端，該針腳植入裝置包括：一基座；及一個以上突起件，從該基座延伸，其中該一個以上突起件係配置成，使得每一突起件係與該針腳觸點插座中之一可定址孔對應，及每一突起件之形狀及大小係構造成，使得一連結器針腳內部空腔可緊固地安裝於每一突起件上，及使得該連接器針腳當插入至一可定址孔中之後，可從該突起件移除。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a pin population device for inserting connector pins, each connector pin comprising an internal mounting hollow at one end and a tip at the other, into a pin contact socket with an array of addressable holes, the pin population device comprising: a base; and one or more protrusions extending from the base, wherein the one or more protrusions are arranged such that each protrusion corresponds with an addressable hole in the pin contact socket, and the shape and size of each protrusion is configured such that a connector pin internal hollow can be securely mounted on each protrusion, and such that the connector pin is removable from the protrusion on insertion into an addressable hole.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:針腳植入裝置</p>
        <p type="p">110:突起件</p>
        <p type="p">120:基座</p>
        <p type="p">130:校準槽</p>
        <p type="p">140:視覺指示</p>
        <p type="p">200:連接器針腳</p>
        <p type="p">210:內部安裝空腔</p>
        <p type="p">220:頂端</p>
        <p type="p">230:圓柱形橫向延伸件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="988" publication-number="202625601">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625601</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126176</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>減薄磊晶矽裝置及MEMS結構之應力控制</chinese-title>
        <english-title>STRESS CONTROL OF THINNED EPITAXIAL SILICON DEVICES AND MEMS STRUCTURES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D62/834</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布朗　大衛　李</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROWN, DAVID LEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　振華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHERN, JEHN-HUAR HOWARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種工件包含一摻雜p型基板、安置於該摻雜p型基板上之一共摻雜P+磊晶矽層、及安置於該共摻雜P+磊晶矽層上之一摻雜硼之P-磊晶層。該共摻雜P+磊晶矽層共摻雜有鍺及硼。該共摻雜P+磊晶矽層中之鍺與硼之一比率可為自10至16。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A workpiece includes a doped p-type substrate, a co-doped P+ epitaxial silicon layer disposed on the doped p-type substrate, and a boron-doped P- epitaxial layer disposed on the co-doped P+ epitaxial silicon layer. The co-doped P+ epitaxial silicon layer is co-doped with germanium and boron. A ratio of the germanium to the boron in the co-doped P+ epitaxial silicon layer may be from 10 to 16.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:工件</p>
        <p type="p">101:摻雜p型基板</p>
        <p type="p">102:共摻雜P+磊晶矽層</p>
        <p type="p">103:摻雜硼之P-磊晶層</p>
        <p type="p">104:介電膜堆疊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="989" publication-number="202624176">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624176</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126189</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化合物及其製造方法、硬化性樹脂組成物及該些的硬化物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07C1/26</main-classification>
        <further-classification edition="200601120260302B">C07C13/547</further-classification>
        <further-classification edition="200601120260302B">C07C15/60</further-classification>
        <further-classification edition="200601120260302B">C07C2/86</further-classification>
        <further-classification edition="200601120260302B">C08F12/34</further-classification>
        <further-classification edition="200601120260302B">C08L101/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本化藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON KAYAKU KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠島隆行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOHJIMA, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>関允諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKI, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小椋一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGURA, ICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種線膨脹係數低（低CTE）、具有優異的低介電特性的化合物、硬化性樹脂組成物及其硬化物。一種化合物，由下述式（1）表示。&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="226px" width="370px" file="ed10018.JPG" alt="ed10018.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;（所述式（1）中，存在多個的R&lt;sub&gt;1&lt;/sub&gt;分別獨立地表示氫原子或碳數1～5的烴基；存在多個的R&lt;sub&gt;2&lt;/sub&gt;分別獨立地表示下述式（a）所表示的烴基；存在多個的l分別獨立地為1～4的整數；存在多個的m分別獨立地為0～4的整數，m的平均值m&lt;sub&gt;ave&lt;/sub&gt;為0＜m&lt;sub&gt;ave&lt;/sub&gt;≦4）&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="154px" width="292px" file="ed10019.JPG" alt="ed10019.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;（所述式（a）中，*表示於式（1）的芴結構上的鍵結位置；存在多個的R&lt;sub&gt;3&lt;/sub&gt;分別獨立地表示氫原子或碳數1～5的烴基；R&lt;sub&gt;3&lt;/sub&gt;及芴結構上所鍵結的亞甲基鍵可於芳香環上的任意位置進行取代；p為1～6的整數，n表示重複數且為1～3的整數）</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="990" publication-number="202624983">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624983</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126210</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>近似最近鄰搜索方法及近似最近鄰搜索系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120251201B">G06F16/245</main-classification>
        <further-classification edition="201901120251201B">G06F16/248</further-classification>
        <further-classification edition="201901120251201B">G06F16/95</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菅野伸一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANNO, SHINICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡部徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATABE, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>栗田貴宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURITA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可降低伴隨圖表型索引的更新而需要改寫的資料量且可獲得充分的搜索精度的近似最近鄰搜索方法。根據實施形態，近似最近鄰搜索方法管理用於規定叢集間圖表的圖表型索引資訊。近似最近鄰搜索方法自多個叢集中附屬於具有最接近查詢的基準位置的搜索開始叢集中的向量中搜索最接近查詢的向量。近似最近鄰搜索方法在遍歷叢集間圖表的同時選擇接近搜索開始叢集的一個以上的搜索對象叢集，自附屬於一個以上的搜索對象叢集的各者中的向量中搜索最接近查詢的向量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">c1、c2、c3、c4、c5:叢集(最下位層叢集)</p>
        <p type="p">CG:叢集間圖表</p>
        <p type="p">e12、e13、e14、e15、e16、e23、e24、e25、e27、e34、e35、e37、e45、e59:邊</p>
        <p type="p">HC:階層化叢集(階層結構)</p>
        <p type="p">L1-c1、L1-c2、L2-c:上位層叢集</p>
        <p type="p">L3-c:最上位層叢集</p>
        <p type="p">v11、v12、v13、v14、v21、v22、v23、v24、v31、v32、v33、v34、v41、v42、v43、v44、v51、v52、v53、v54:向量</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="991" publication-number="202625271">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625271</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126528</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電極、電極之製造方法及二次電池</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">H01M4/80</main-classification>
        <further-classification edition="200601120260306B">H01M4/38</further-classification>
        <further-classification edition="201001120260306B">H01M4/139</further-classification>
        <further-classification edition="201001120260306B">H01M10/0525</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商愛伯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>I-PEX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商潤珠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>URUTAMA INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土持克仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUCHIMOCHI, KATSUHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齊藤俊介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, SHUNSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森田千治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORITA, SENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤彰吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, SHOGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久保山慎吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUBOYAMA, SHINGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森脇直人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIWAKI, NAOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之電極(100)具備集電體(10)、及活性物質(21)。集電體(10)具備作為具有空隙之多孔質體之不織布(11)、及設置於不織布(11)之表面之導電體層(12)。活性物質(21)填充於不織布(11)之空隙中，且於集電體(10)之表示厚度之方向之兩面形成為第1表面層(31)及第2表面層(32)。第1表面層(31)及第2表面層(32)之厚度(T1、T2)分別為填充有活性物質(21)之集電體(10)之厚度(Tc)以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:集電體</p>
        <p type="p">11:不織布</p>
        <p type="p">11a:纖維體</p>
        <p type="p">12:導電體層</p>
        <p type="p">20:複合材料</p>
        <p type="p">21:活性物質</p>
        <p type="p">31:第1表面層</p>
        <p type="p">32:第2表面層</p>
        <p type="p">100:電極</p>
        <p type="p">T:厚度</p>
        <p type="p">Tc:厚度</p>
        <p type="p">T1:厚度</p>
        <p type="p">T2:厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="992" publication-number="202624551">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624551</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126533</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有氧化還原穩定燃料電極支撐體之電化學電池</chinese-title>
        <english-title>ELECTROCHEMICAL CELLS WITH REDOX STABLE FUEL ELECTRODE SUPPORTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260313B">C25B9/23</main-classification>
        <further-classification edition="202101120260313B">C25B13/07</further-classification>
        <further-classification edition="202101120260313B">C25B1/042</further-classification>
        <further-classification edition="202101120260313B">C25B9/63</further-classification>
        <further-classification edition="200601120260313B">C04B35/48</further-classification>
        <further-classification edition="201601120260313B">H01M8/12</further-classification>
        <further-classification edition="201601120260313B">H01M8/1226</further-classification>
        <further-classification edition="200601120260313B">H01M4/86</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商博隆能源股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BLOOM ENERGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寇斯　道爾頓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COX, DALTON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾爾　巴塔維　伊瑪德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EL BATAWI, EMAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘　可及</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, KEJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施莫斯　托維斯　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHMAUSS, TRAVIS A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電化學電池，其包含具有第一側及相對第二側之電解質、位於該電解質之該第一側之氧電極、燃料電極支撐體、及位於該燃料電極支撐體與該電解質之該第二側之間的活性燃料電極。該燃料電極支撐體包含含有含鎳相及陶瓷相之金屬陶瓷。該陶瓷相可包含4至10 莫耳百分比(mol%)氧化釔穩定之氧化鋯((4-10)-YSZ))或摻雜有氧化鋁、氧化鈰或氧化鈦中之至少一者之氧化鋯。替代地或另外，該含鎳相可包含摻雜有氧化鎂、氧化鈣或氧化鈦中之至少一者之鎳。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrochemical cell includes an electrolyte having a first side and an opposing second side, an oxygen electrode located on the first side of the electrolyte, a fuel electrode support, and an active fuel electrode located between the fuel electrode support and the second side of the electrolyte. The fuel electrode support includes a cermet containing a nickel containing phase and a ceramic phase. The ceramic phase may include 4 to 10 mol percent (mol%) yttria stabilized zirconia ((4-10)-YSZ)) or zirconia doped with at least one of alumina, ceria or titania. Alternatively or in addition, the nickel containing phase may include nickel doped with at least one of magnesium oxide, calcium oxide, or titanium oxide.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100A:電極支撐之電化學電池</p>
        <p type="p">200:電解質</p>
        <p type="p">210:障壁層</p>
        <p type="p">300:燃料電極</p>
        <p type="p">310:活性燃料電極</p>
        <p type="p">312:第一功能梯度電極層/第一FGE層</p>
        <p type="p">314:第二FGE層</p>
        <p type="p">320:燃料電極支撐體</p>
        <p type="p">400:氧電極</p>
        <p type="p">410:氧電極功能層</p>
        <p type="p">420:氧電極接觸層</p>
        <p type="p">T1:厚度</p>
        <p type="p">T2:厚度</p>
        <p type="p">T3:厚度</p>
        <p type="p">T4:厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="993" publication-number="202624172">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624172</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126553</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用氧化作用的鈦碳化物材料之選擇性蝕刻</chinese-title>
        <english-title>SELECTIVE ETCH OF TITANIUM CARBIDE MATERIALS USING OXIDATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">C04B41/53</main-classification>
        <further-classification edition="200601120260306B">C04B35/56</further-classification>
        <further-classification edition="200601120260306B">C04B41/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝　穩儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, WENYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧圖四世　伊芙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTTO IV, IVO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泰伯利　坎達巴拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAPILY, KANDABARA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗勞　馬修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLAUGH, MATTHEW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡爾　蘇巴迪普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAL, SUBHADEEP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種乾蝕刻基板的鈦碳化物材料的方法包括執行一氧化步驟以及一氟化步驟。該氧化步驟包括將該鈦碳化物材料暴露於一氧化劑，以形成包括氧化鈦物種的氧化層，並透過形成揮發性氧化碳物種來移除該鈦碳化物材料中的碳。該氟化步驟包括將該氧化層的該氧化鈦物種暴露於一氟化劑，以透過形成揮發性氟化氧化鈦物種來移除該鈦碳化物材料中的鈦。該方法可在一處理腔室內原位作為一循環重複進行。該方法可更包括一置換步驟，其包括將氟化步驟期間所形成的該金屬氟化物物種暴露於一置換劑，以透過形成揮發性金屬氟化物物種來移除該鈦碳化物材料中的該金屬物種。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of dry etching a titanium carbide material of a substrate includes performing an oxidation step and a fluorination step. The oxidation step includes exposing the titanium carbide material to an oxidizing agent to form an oxidized layer including titanium oxide species and remove carbon from the titanium carbide material by forming volatilized carbon oxide species. The fluorination step includes exposing the titanium oxide species of the oxidized layer to a fluorinating agent to remove titanium from the titanium carbide material by forming volatilized fluorinated titanium oxide species. The method may be repeated as a cycle in situ within a processing chamber. The method may further include a substitution step that includes exposing a metallic fluoride species formed during the fluorination step to a substitution agent to remove metallic species from the titanium carbide material by forming volatilized metallic fluoride species.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:乾蝕刻製程</p>
        <p type="p">101:氧化步驟</p>
        <p type="p">102:氟化步驟</p>
        <p type="p">108:循環</p>
        <p type="p">109:初始狀態</p>
        <p type="p">110:基板</p>
        <p type="p">112:TiC材料</p>
        <p type="p">113:次要材料</p>
        <p type="p">114:氧化層</p>
        <p type="p">115:TiO&lt;sub&gt;x&lt;/sub&gt;物種</p>
        <p type="p">117:揮發性氧化碳物種</p>
        <p type="p">118:氧化劑</p>
        <p type="p">127:揮發性TiO&lt;sub&gt;x&lt;/sub&gt;F&lt;sub&gt;y&lt;/sub&gt;物種</p>
        <p type="p">128:氟化劑</p>
        <p type="p">170:處理腔室</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="994" publication-number="202624901">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624901</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126580</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂遮罩剝離劑組合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">G03F7/42</main-classification>
        <further-classification edition="200601120260303B">C11D7/06</further-classification>
        <further-classification edition="200601120260303B">C11D7/32</further-classification>
        <further-classification edition="202601120260303B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商花王股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭敬騰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHING TENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田晃平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, KOUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHI, ISAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明於一態樣中提供一種樹脂遮罩剝離劑組合物，其能夠減少樹脂遮罩剝離後之洗淨中之殘留物。  &lt;br/&gt;於一態樣中，本發明係關於一種樹脂遮罩剝離劑組合物，其含有氫氧化物(成分A)、烷醇胺(成分B)、2種以上之唑系化合物(成分C)、有機溶劑(成分D)及水(成分E)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="995" publication-number="202625861">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625861</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126616</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W74/00</main-classification>
        <further-classification edition="202601120260302B">H10W72/20</further-classification>
        <further-classification edition="202601120260302B">H10W72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大塚靖夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKA, YASUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據一實施形態，半導體裝置具備基板、與包含積層於上述基板上之複數個晶片之晶片積層體。上述複數個晶片包含第1記憶體晶片、種類與上述第1記憶體晶片不同之第2記憶體晶片、及將上述第1記憶體晶片與上述第2記憶體晶片電性連接之第1橋接晶片。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">3:存儲設備(半導體裝置)</p>
        <p type="p">11:記憶體晶片</p>
        <p type="p">12:記憶體晶片</p>
        <p type="p">13:橋接晶片</p>
        <p type="p">14:IF晶片</p>
        <p type="p">21:貫通電極</p>
        <p type="p">22:貫通電極</p>
        <p type="p">23:貫通電極</p>
        <p type="p">24:貫通電極</p>
        <p type="p">25:貫通電極</p>
        <p type="p">26:貫通電極</p>
        <p type="p">31:金屬焊墊</p>
        <p type="p">32:金屬焊墊</p>
        <p type="p">33:金屬焊墊</p>
        <p type="p">34:金屬焊墊</p>
        <p type="p">41:基板</p>
        <p type="p">41a:絕緣基板</p>
        <p type="p">41b:配線層</p>
        <p type="p">41c:樹脂層</p>
        <p type="p">42:凸塊</p>
        <p type="p">43:凸塊</p>
        <p type="p">44:外部連接端子</p>
        <p type="p">51:配線</p>
        <p type="p">52:樹脂層</p>
        <p type="p">53:樹脂層</p>
        <p type="p">C:晶片積層體</p>
        <p type="p">S1:上表面</p>
        <p type="p">S2:下表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="996" publication-number="202625235">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625235</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126617</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具同軸氣體導管之離子植入機與離子源</chinese-title>
        <english-title>ION IMPLANTER AND ION SOURCE WITH COAXIAL GAS CONDUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">H01J27/02</main-classification>
        <further-classification edition="200601120260309B">H01J27/08</further-classification>
        <further-classification edition="200601120260309B">H01J37/08</further-classification>
        <further-classification edition="200601120260309B">H01J37/317</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝克　可勞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BECKER, KLAUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥勞克林　亞當　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCLAUGHLIN, ADAM M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊特　格拉漢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WRIGHT, GRAHAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露包括同軸氣體導管的離子源。同軸氣體導管包括兩個導管，其中內導管定義傳送受到分解的氣體的內通道。外導管和內導管定義傳送較不易受到分解的氣體（例如惰性或稀釋氣體）的外環形通道。此同軸氣體導管配置為僅外導管物理接觸離子源的壁。這用作降低內導管和流過其中的氣體的溫度。此外，在一些實施例中，內導管可與散熱器熱接觸以進一步降低其溫度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An ion source includes a coaxial gas conduit is disclosed. The coaxial gas conduit includes two conduits, where the inner conduit defines an inner channel that delivers the gas that is subject to decomposition. The outer conduit and the inner conduit define an outer annular channel that delivers a gas that is less susceptible to decomposition, such as an inert or diluent gas. This coaxial gas conduit is configured such that only the outer conduit physically contacts the walls of the ion source. This serves to lower the temperature of the inner conduit and the gas flowing therethrough. Further, in some embodiments, the inner conduit may be in thermal contact with a heat sink to further lower its temperature.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:IHC離子源</p>
        <p type="p">100:電弧室</p>
        <p type="p">101:壁</p>
        <p type="p">103:擷取板</p>
        <p type="p">104:第一端</p>
        <p type="p">105:第二端</p>
        <p type="p">110:陰極</p>
        <p type="p">111:偏壓電源供應器</p>
        <p type="p">115:陰極偏壓電源供應器</p>
        <p type="p">120:排斥極</p>
        <p type="p">123:排斥極偏壓電源供應器</p>
        <p type="p">140:擷取孔</p>
        <p type="p">150:散熱器</p>
        <p type="p">151:冷卻器</p>
        <p type="p">152:流體出口</p>
        <p type="p">153:流體入口</p>
        <p type="p">160:燈絲</p>
        <p type="p">165:燈絲電源供應器</p>
        <p type="p">170:第一氣體源</p>
        <p type="p">180:第二氣體源</p>
        <p type="p">190:同軸氣體導管</p>
        <p type="p">191:內導管</p>
        <p type="p">192:外導管</p>
        <p type="p">193:內通道</p>
        <p type="p">194:外環形通道</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="997" publication-number="202625337">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625337</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126666</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>減速機馬達一體機</chinese-title>
        <english-title>REDUCER-AND-MOTOR INTEGRATED MACHINE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">H02K7/11</main-classification>
        <further-classification edition="201601120260309B">H02K11/21</further-classification>
        <further-classification edition="200601120260309B">F16H1/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鐘啟聞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, CHI-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡弦龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, HSIEN-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱威穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, WEI-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡宛佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAI, WAN-YOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案揭露一種減速機馬達一體機包括電機、減速機齒輪組、主軸承以及力矩感測器。電機沿軸向配置，組配提供動力輸入源。減速機齒輪組沿軸向連接於電機和固定端之間，並接收動力輸入源，其中減速機齒輪組接收動力輸入源後，通過嚙合作用帶動輸出端轉動負載。主軸承設置於固定端和輸出端之間。力矩感測器設置於減速機齒輪組和主軸承之間，組配量測負載之轉動力矩。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A reducer-and-motor integrated machine is disclosed and includes a motor, a reducer gear set, a main bearing and a torque sensor. The motor is arranged along an axial direction and configured to provide a power input source. The reducer gear set is axially connected between the motor and a fixed end, and receives the power input source. After the reducer gear set receives the power input source, an output end is driven to rotate a load through an engagement action. The main bearing is arranged between the fixed end and the output end. The torque sensor is disposed between the reducer gear set and the main bearing to measure a torque of the load.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:減速機馬達一體機</p>
        <p type="p">2:電機</p>
        <p type="p">20:基座</p>
        <p type="p">21:驅動軸</p>
        <p type="p">22:轉子</p>
        <p type="p">23:定子</p>
        <p type="p">3:主軸承</p>
        <p type="p">31:殼體</p>
        <p type="p">4:減速機齒輪組</p>
        <p type="p">40:輸入軸</p>
        <p type="p">41:輸出輪</p>
        <p type="p">410:內齒部</p>
        <p type="p">42:輸入輪</p>
        <p type="p">420:外齒部</p>
        <p type="p">43:波產生器</p>
        <p type="p">44:輸出端中空軸</p>
        <p type="p">5:力矩感測器</p>
        <p type="p">51:後端</p>
        <p type="p">52:前端</p>
        <p type="p">61:第一編碼器模組</p>
        <p type="p">62:編碼器</p>
        <p type="p">63:編碼器讀頭</p>
        <p type="p">64:第二編碼器模組</p>
        <p type="p">65:編碼器</p>
        <p type="p">66:編碼器讀頭</p>
        <p type="p">67:電路板</p>
        <p type="p">68:控制模組</p>
        <p type="p">71:第一轉子軸承</p>
        <p type="p">72:第二轉子軸承</p>
        <p type="p">C:軸向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="998" publication-number="202624346">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624346</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126667</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體元件之製造方法及半導體元件、以及聚醯亞胺前驅物之合成方法及聚醯亞胺前驅物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08G73/10</main-classification>
        <further-classification edition="200601120260302B">C08G73/12</further-classification>
        <further-classification edition="200601120260302B">C08G81/00</further-classification>
        <further-classification edition="200601120260302B">C08L79/08</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/027</further-classification>
        <further-classification edition="200601120260302B">G03F7/038</further-classification>
        <further-classification edition="200601120260302B">B32B15/08</further-classification>
        <further-classification edition="200601120260302B">B32B27/28</further-classification>
        <further-classification edition="202601120260302B">H10P14/68</further-classification>
        <further-classification edition="202601120260302B">H10W70/05</further-classification>
        <further-classification edition="202601120260302B">H10W74/47</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浅川大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAKAWA, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種樹脂組成物、由上述樹脂組成物硬化而成之硬化物、包含上述硬化物之積層體、上述硬化物之製造方法、上述積層體之製造方法、包括上述硬化物之製造方法之半導體元件之製造方法及包含上述硬化物之半導體元件、以及新穎的聚醯亞胺前驅物之合成方法及新穎的聚醯亞胺前驅物，上述樹脂組成物包含：聚醯亞胺前驅物，其係包含由式（1-1）所表示之重複單元形成之嵌段和由式（1-2）所表示之重複單元形成之嵌段之共聚物。  &lt;br/&gt;&lt;img align="absmiddle" height="150px" width="594px" file="ed10063.JPG" alt="ed10063.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="999" publication-number="202625508">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625508</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126668</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>離子植入機、控制裝置和操作離子植入機的方法</chinese-title>
        <english-title>ION IMPLANTER, CONTROL ARRANGEMENT AND METHOD OF OPERATING ION IMPLANTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">H05H7/04</main-classification>
        <further-classification edition="200601120260312B">H01J37/08</further-classification>
        <further-classification edition="200601120260312B">H01J37/317</further-classification>
        <further-classification edition="200601120260312B">H05H7/22</further-classification>
        <further-classification edition="200601120260312B">H05H9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>譚　偉明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAM, WAI-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕克　威廉　赫倫　Ｊｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, WILLIAM HERRON JR.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佩茨施　史考特　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEITZSCH, SCOTT E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">離子植入機。離子植入機可包括離子源，以產生連續離子束。離子植入機可更包括線性加速器，包含聚束器，以接收連續離子束並產生聚束離子束，並更包含多個加速級，配置以接收聚束離子束並加速聚束離子束。離子植入機亦可包括多個四極，以交替方式與多個加速級配置；以及多個四極開關組件，分別耦合至多個四極，其中給定的四極開關組件包含極性開關電路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An ion implanter. The ion implanter may include an ion source, to generate a continuous ion beam. The ion implanter may further include a linear accelerator, comprising a buncher, to receive the continuous ion beam and generate a bunched ion beam, and further comprising a plurality of acceleration stages, arranged to receive the bunched ion beam and accelerate the bunched ion beam. The ion implanter may also include a plurality of quadrupoles, arranged in alternating fashion with the plurality of acceleration stages; and a plurality of quadrupole switch assemblies, coupled to the plurality of plurality of quadrupoles, respectively, wherein a given quadrupole switch assembly comprises a polarity switching circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">126A-1,126A-2,126A-3,126A-4:電極</p>
        <p type="p">126A:四極</p>
        <p type="p">202:開關控制器</p>
        <p type="p">204:正電壓供應</p>
        <p type="p">206:負電壓供應</p>
        <p type="p">208:機殼接地</p>
        <p type="p">210:四極極性開關電路</p>
        <p type="p">212A,214A:常閉輸入</p>
        <p type="p">212B,214B:常開輸入</p>
        <p type="p">212:第一開關</p>
        <p type="p">214:第二開關</p>
        <p type="p">224:四極開關組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1000" publication-number="202624299">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624299</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126669</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>混合物、硬化性樹脂組成物及其硬化物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">C08F212/34</main-classification>
        <further-classification edition="200601120260304B">C08L25/00</further-classification>
        <further-classification edition="200601120260304B">C08L65/00</further-classification>
        <further-classification edition="202601120260304B">H10W74/47</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本化藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON KAYAKU KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠島隆行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOHJIMA, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鳥庭俊孝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORINIWA, TOSHITAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中西政隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANISHI, MASATAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋本昌典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIMOTO, MASANORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>前原拓哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAEHARA, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種兼顧硬化性與含浸性並且具有優異的低介電特性的混合物、硬化性樹脂組成物及其硬化物。一種混合物，是下述式（1）所表示的化合物與下述式（2）所表示的化合物的混合物，所述下述式（1）所表示的化合物的含量α除以所述下述式（2）所表示的化合物的含量β而得的值（α/β）為9以上且小於40。  &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="205px" width="371px" file="ed10012.JPG" alt="ed10012.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;（式（1）中，存在多個的R分別獨立地存在，且表示氫原子、碳數1～10的烴基或碳數1～10的鹵化烷基；p、r表示0～4的整數，q表示0～3的整數，n為重複數的平均值且1≦n≦20）  &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="198px" width="202px" file="ed10013.JPG" alt="ed10013.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;（式（2）中，R表示氫原子、碳數1～10的烴基或鹵化烷基；s為0～5的整數）</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1001" publication-number="202624476">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624476</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126736</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>組成物、原液、清洗完畢被處理物的製造方法、電子器件的製造方法</chinese-title>
        <english-title>COMPOSITION, STOCK SOLUTION, METHOD OF MANUFACTURING CLEANED TREATED PRODUCTS, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">C11D7/26</main-classification>
        <further-classification edition="200601120260303B">C11D3/20</further-classification>
        <further-classification edition="200601120260303B">C11D3/36</further-classification>
        <further-classification edition="202601120260303B">H10P52/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商美國富士電子材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM ELECTRONIC MATERIALS U.S.A., INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上村哲也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMIMURA, TETSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大内直子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OUCHI, NAOKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹下祐太朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKESHITA, YUTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土橋徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUCHIHASHI, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡　斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳弘杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HOUNG-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王允齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YUN-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂新賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, HSIN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡林松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI LIN, SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種組成物，其殘渣去除性優異、於長期保管時亦可維持優異的殘渣去除性、進而於應用於重複進行CMP處理及其後所實施的使用墊的清洗處理的處理中的清洗處理時CMP處理的研磨速度的劣化少，以及提供一種原液、清洗完畢被處理物的製造方法、及電子器件的製造方法。本發明的組成物是於施加了化學機械研磨處理的被處理物的使用墊的清洗中所使用的組成物，包含具有聚氧伸烷基鏈且不具有酸性基、鹼性基及該些的鹽中的任一種的化合物、以及抗菌劑，相對於所述組成物的總質量，所述化合物的含量為0.3質量%～5.0質量%，所述化合物的含量相對於所述抗菌劑的含量的質量比為5～10000。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:帶圖案的晶圓</p>
        <p type="p">12:矽晶圓</p>
        <p type="p">14:絕緣層</p>
        <p type="p">16:TiN層</p>
        <p type="p">18:W層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1002" publication-number="202625717">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625717</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126772</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>紫外線照射裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P54/00</main-classification>
        <further-classification edition="202601120260302B">H10P70/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東芝照明技術股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOSHIBA LIGHTING &amp; TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中川幸信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAGAWA, YUKINOBU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松本卓馬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO, TAKUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>越智洋輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OCHI, YOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>服部康弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATTORI, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種紫外線照射裝置，可抑制在使腔室的開口露出時粒子經由腔室的開口而侵入到腔室內部。實施形態的紫外線照射裝置包括：腔室，在內部具有收納處理物的空間，在端部設置有開口；光源部，能夠經由設置在所述腔室的窗向所述腔室的內部照射紫外線；輸送部，呈筒狀，其中一個端部與所述腔室的所述開口相向；以及擋板，設置成能夠經由間隙而在所述腔室的所述端部與所述輸送部的所述端部之間移動，呈板狀，且具有貫通厚度方向的孔。在所述擋板的所述孔與所述腔室的所述開口相向的情況下，所述擋板的所述孔的周圍部分位於所述腔室的所述端部與所述輸送部的所述端部之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">31:腔室</p>
        <p type="p">31a:開口</p>
        <p type="p">32:窗</p>
        <p type="p">33:載置部</p>
        <p type="p">35:輸送部</p>
        <p type="p">36:開閉部</p>
        <p type="p">36a:擋板</p>
        <p type="p">36a1:孔</p>
        <p type="p">36b:移動部</p>
        <p type="p">100:處理物</p>
        <p type="p">S1、S2:間隙</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1003" publication-number="202624205">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624205</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126887</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阻劑材料及圖型形成方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07C381/12</main-classification>
        <further-classification edition="200601120260302B">C07F7/18</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/039</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="202601120260302B">H10P76/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稲荷宇俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INARI, TAKATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西澤彰人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIZAWA, AKITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村謙太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, KENTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弥
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGATA, MASAYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>衣幡慶一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IBATA, KEIICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種新穎的阻劑材料，其為含有經修飾缺損部位之雜多酸鹽或其混合物之阻劑材料，其特徵為前述經修飾缺損部位之雜多酸鹽之陰離子部，包含複數個具有酸解離性基之極性基；及圖型形成方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1004" publication-number="202625280">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625280</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126905</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於準固態鋰硫電池的複合凝膠電解質</chinese-title>
        <english-title>COMPOSITE GEL ELECTROLYTE FOR QUASI-SOLID-STATE LITHIUM SULFUR BATTERY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260306B">H01M10/0565</main-classification>
        <further-classification edition="201001120260306B">H01M10/058</further-classification>
        <further-classification edition="200601120260306B">C08K3/36</further-classification>
        <further-classification edition="200601120260306B">C08K9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商贏創運營有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EVONIK OPERATIONS GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱立華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, LIHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牛蕭峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIU, XIAOFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田曉偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIAN, XIAOWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘聖陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, SHENGYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>左偲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZUO, CAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明有關二氧化矽組成物在鋰-硫電池的複合凝膠電解質的製備中的用途，其中所述二氧化矽組成物包含以下或由以下組成：表面修飾的膠態二氧化矽分散體或所述分散體的蒸發產物。還提供用於製備鋰-硫電池的複合凝膠電解質的聚合物前體組成物、聚合物前體組成物在鋰-硫電池的複合凝膠電解質的製備中的用途、製備鋰-硫電池的複合凝膠電解質的方法、和電化學裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Use of a silica composition in preparation of a composite gel electrolyte of a lithium-sulfur battery, wherein the silica composition comprises or consists of: a surface-modified colloidal silica dispersion, or an evaporated product of the dispersion. A polymer precursor composition for preparation of a composite gel electrolyte of a lithium-sulfur battery, use of the polymer precursor composition in preparation of a composite gel electrolyte of a lithium sulfur battery, a method to prepare composite gel electrolyte of a lithium-sulfur battery, and an electrochemical device are also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1005" publication-number="202624091">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624091</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126928</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂複合構件</chinese-title>
        <english-title>RESIN COMPOSITE MEMBER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">B65D41/62</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＥＮ大塚製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EN OTSUKA PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>相原貴裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIHARA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石川啓太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIKAWA, KEITA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於提供一種可將樹脂成形體予以無縫隙地輕易且確實地密封的樹脂複合構件。  &lt;br/&gt;本發明係具備閉塞部23及包覆材21，該閉塞部23具有船形形狀部23、24，該包覆材21係由使用了可撓性熱塑性樹脂之氣體阻隔性包材所構成，且包覆船形形狀部23、24的一側；船形形狀部23、24具有：設成為中間部隆起而於兩端縮窄的一對側面23b、24b；以及設於位在一側中的一對側面23b之間的一端面23c、24c；前述一端面23c、24c係具有側視觀看時以朝向中間部凹入之方式傾斜的凹形狀，包覆材21係由一張片材所構成，且接續地接合於一端面23c、24c以及各側面23b、24b當中與端面23c、24c鄰接的區域，且與一端面23c、24c及各側面23b、24b無縫隙地密接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention aims to provide a resin composite member capable of easily and reliably sealing resin molded bodies without any gap. &lt;br/&gt;A resin composite member provided as a solution in the present invention includes a closure part 23 having boat-shaped portions 23, 24, and a covering material 21 that is made of a gas barrier packaging material using a flexible thermoplastic resin and that covers one side of the boat-shaped portions 23, 24. The boat-shaped portions 23, 24 have a pair of side surfaces 23b, 24b that bulge in the middle and narrow at both ends, and one end surface 23c, 24c that is provided between the pair of side surfaces 23b on one side, wherein the one end surface 23c, 24c has a concave shape that slopes downward toward the middle in a side view. The covering material 21 is made of a single sheet material, and is continuously bonded to the one end surface 23c, 24c and the area of each side surface 23b, 24b adjacent to the end surface 23c, 24c, such that it is in close contact with the one end surface 23c, 24c and each side surface 23b, 24b without any gap.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:容器壁</p>
        <p type="p">13:周緣密封件</p>
        <p type="p">14:缺口</p>
        <p type="p">20:注入嘴</p>
        <p type="p">21:包覆材</p>
        <p type="p">22:注入嘴本體</p>
        <p type="p">23:閉塞部(船形形狀部)</p>
        <p type="p">23b:側面</p>
        <p type="p">23c:上端面(一端面)</p>
        <p type="p">24:基礎部(船形形狀部)</p>
        <p type="p">27:凹凸形狀部</p>
        <p type="p">28:中空部</p>
        <p type="p">29:貫通孔</p>
        <p type="p">33:螺合部</p>
        <p type="p">34:收納部</p>
        <p type="p">35:關閉部</p>
        <p type="p">36:插入部</p>
        <p type="p">37:貫通孔</p>
        <p type="p">37a:開口</p>
        <p type="p">38:交界</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1006" publication-number="202624331">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624331</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127009</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂、硬化性樹脂材料、預浸體、樹脂膜、金屬被覆積層板、印刷配線板、及半導體封裝</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08G61/02</main-classification>
        <further-classification edition="200601120260302B">C08J5/18</further-classification>
        <further-classification edition="200601120260302B">C08J5/24</further-classification>
        <further-classification edition="200601120260302B">B32B15/08</further-classification>
        <further-classification edition="200601120260302B">H05K1/03</further-classification>
        <further-classification edition="202601120260302B">H10W70/69</further-classification>
        <further-classification edition="202601120260302B">H10W74/40</further-classification>
        <further-classification edition="202601120260302B">H10W74/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上井浩志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEI, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石川洋平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIKAWA, YOUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荻原和重</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGIWARA, KAZUSHIGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種樹脂，在反應原料中包含茚化合物（A）、通式（1）所表示的化合物（B）及通式（2）所表示的化合物（C），所述樹脂中，在高效液相層析儀（HPLC）分析的圖中，在32分鐘～35分鐘之間檢測出的四個峰值的合計面積的比例為30面積%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1007" publication-number="202624888">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624888</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127028</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性樹脂組成物、感光性元件、印刷線路板及印刷線路板之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">G03F7/004</main-classification>
        <further-classification edition="200601120260306B">G03F7/028</further-classification>
        <further-classification edition="200601120260306B">C08G59/14</further-classification>
        <further-classification edition="200601120260306B">H05K1/03</further-classification>
        <further-classification edition="200601120260306B">H05K3/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤亮太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡出翔太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKADE, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>増田直彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASUDA, NAOAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之感光性樹脂組成物含有酸改質含乙烯基樹脂、光聚合性化合物、光聚合起始劑及熱固化性樹脂，前述光聚合起始劑包含具有茀骨架之光聚合起始劑，前述熱固化性樹脂包含選自由雙酚F型環氧樹脂及酚醛清漆型環氧樹脂組成的組中之至少1種。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:感光性元件</p>
        <p type="p">10:支撐膜</p>
        <p type="p">20:感光層</p>
        <p type="p">30:保護膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1008" publication-number="202623886">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623886</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127042</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多孔質膜、液體的純化方法、過濾介質及過濾裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">B01D71/64</main-classification>
        <further-classification edition="200601120260305B">B01D69/02</further-classification>
        <further-classification edition="200601120260305B">C08J5/18</further-classification>
        <further-classification edition="200601120260305B">B32B3/24</further-classification>
        <further-classification edition="200601120260305B">B01D39/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金丸拓磨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANAMARU, TAKUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種孔徑小且流體的穿透性優良之多孔質膜、使用該多孔質膜之液體的純化方法、由前述多孔質膜所構成的過濾介質及包含前述多孔質膜的過濾裝置。  &lt;br/&gt;　　本發明使用一種多孔質膜，其係由選自由聚醯亞胺及聚醯胺醯亞胺所成群組之至少1種樹脂成分(A)或包含樹脂成分(A)之樹脂組成物所構成的多孔質膜，其平均孔徑為5nm以上40nm以下，且具有特定的細孔分布。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1009" publication-number="202623887">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623887</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127045</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多孔質膜、液體的純化方法、過濾介質及過濾裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">B01D71/64</main-classification>
        <further-classification edition="200601120260305B">B01D69/12</further-classification>
        <further-classification edition="200601120260305B">C08J9/26</further-classification>
        <further-classification edition="201801120260305B">C08K3/01</further-classification>
        <further-classification edition="200601120260305B">C08J5/18</further-classification>
        <further-classification edition="200601120260305B">B32B3/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金丸拓磨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANAMARU, TAKUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供能夠製造孔徑小且流體透過性優異之多孔質膜的多孔質膜製造方法，以及以該多孔質膜製造方法所製造之多孔質膜。  &lt;br/&gt;　　使用含有樹脂成分(A)、微粒子(B)及溶媒(S)之樹脂組成物的特定步驟，樹脂成分(A)為選自由聚醯胺酸、聚醯亞胺、聚醯胺醯亞胺前驅物及聚醯胺醯亞胺所構成之群中的至少1種；微粒子(B)包含微粒子(B1)與微粒子(B2)；微粒子(B1)及前述微粒子(B2)分別為平均粒徑100nm以下之微粒子；微粒子(B2)之平均粒徑大於微粒子(B1)之平均粒徑的多孔質膜製造方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1010" publication-number="202624787">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624787</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127067</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>測距裝置、電子機器、移動體、防反射膜及透光罩之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G01S7/481</main-classification>
        <further-classification edition="200601120260302B">G01S17/08</further-classification>
        <further-classification edition="201501120260302B">G02B1/111</further-classification>
        <further-classification edition="200601120260302B">G02B5/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商索馬龍股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOMAR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂爪直樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAZUME, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">目的為提供一種有效提升測距裝置1的測定精度的技術。將黏合劑樹脂設為A成分，將聚乙烯縮醛樹脂設為A1成分，將黑色材料設為B成分，黑色顏料和樹脂的複合物設為B1成分。測距裝置1於外裝構件2內部分隔的收容室5中具有LiDAR感測器單元7。LiDAR感測器單元7包括：發光元件71，其發射用於測定與物體之間的距離的檢測光L1；受光元件73，其根據入射光量輸出受光訊號S1；以及透光罩3，其覆蓋發光元件71和受光元件73。透光罩3的至少一個主面側上設有防反射膜9a、9b。防反射膜9a、9b由樹脂組成物形成，至少包含A成分和B成分。A成分包含A1成分。B成分包含平均粒徑為2μm以上且6μm以下的B1成分。B成分相對於A成分的質量比為7以上且14以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">200:物體(測定對象)</p>
        <p type="p">L1:檢測光</p>
        <p type="p">L2:反射光</p>
        <p type="p">L3:反射光</p>
        <p type="p">L4:反射光</p>
        <p type="p">L5:反射光</p>
        <p type="p">L6:反射光</p>
        <p type="p">3:透光罩</p>
        <p type="p">3a:透光罩的裏面</p>
        <p type="p">3b:透光罩的表面</p>
        <p type="p">9、9a、9b:防反射膜</p>
        <p type="p">7:LiDAR感測器單元</p>
        <p type="p">71:發光元件</p>
        <p type="p">73:受光元件</p>
        <p type="p">S0:控制訊號S0</p>
        <p type="p">S1:受光訊號S1</p>
        <p type="p">8:處理器(控制部)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1011" publication-number="202625183">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625183</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127135</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體記憶裝置及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G11C11/4063</main-classification>
        <further-classification edition="200601120260302B">G11C11/4094</further-classification>
        <further-classification edition="200601120260302B">G11C11/4097</further-classification>
        <further-classification edition="202301120260302B">H10B12/00</further-classification>
        <further-classification edition="202601120260302B">H10D88/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石坂守</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIZAKA, MAMORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可靠性較高之記憶體。第1配線連接於沿第1方向排列之單元。第2配線連接於沿第2方向排列之單元。第3配線設置於沿第3方向排列之第2配線。第1驅動線對於沿第3方向排列之第1配線共通。第1電晶體連接於第1配線與第1驅動線之間。第4配線連接於沿第2方向排列之第1電晶體之閘極。第2驅動線對於沿第2方向排列之第1配線設置。第2電晶體連接於第1配線與第2驅動線之間。第5配線共通地連接於沿第2方向排列之第2電晶體之閘極。驅動電路驅動第4及第5配線之電壓。驅動器對與選擇記憶體組之非選擇之第1配線對應之第5配線施加第1電壓，對非選擇記憶體組之第5配線施加第2電壓，該第2電壓具有較上述第1電壓之絕對值小之絕對值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">ARR:單元陣列</p>
        <p type="p">BA:記憶體組位址</p>
        <p type="p">BAD:記憶體組位址解碼器</p>
        <p type="p">BK:記憶體組</p>
        <p type="p">DRV:主字元線驅動器</p>
        <p type="p">IN1:反相器電路</p>
        <p type="p">IN2:反相器電路</p>
        <p type="p">IN3:反相器電路</p>
        <p type="p">IN4:反相器電路</p>
        <p type="p">MWL,bMWL:主字元線</p>
        <p type="p">PS1:電源端子</p>
        <p type="p">PS2:電源端子</p>
        <p type="p">PS3:電源端子</p>
        <p type="p">PSL1:電源線</p>
        <p type="p">RD:列解碼器</p>
        <p type="p">SUBARR:子陣列</p>
        <p type="p">SWC1:開關電路</p>
        <p type="p">SWC2:開關電路</p>
        <p type="p">SWC3:開關電路</p>
        <p type="p">Tp1:電晶體</p>
        <p type="p">Tp2:電晶體</p>
        <p type="p">VD:信號</p>
        <p type="p">WA:字元線位址</p>
        <p type="p">WAD:字元線位址解碼器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1012" publication-number="202624325">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624325</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127171</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物、液晶密封劑及液晶顯示面板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">C08G59/22</main-classification>
        <further-classification edition="200601120260304B">C08G59/50</further-classification>
        <further-classification edition="200601120260304B">C09K3/10</further-classification>
        <further-classification edition="200601120260304B">G02F1/1339</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI CHEMICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小酒井一輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOZAKAI, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於提供一種樹脂組成物，其於作為液晶密封劑使用時，能夠形成與各種基板的密接性高、且耐濕性優異的密封材。解決所述課題的樹脂組成物含有：於分子內具有兩個以上的環氧基的環氧樹脂（其中，將於分子內具有(甲基)丙烯醯基的樹脂除外）、於分子內具有環氧基及(甲基)丙烯醯基的(甲基)丙烯酸改質環氧樹脂、於分子內具有一個以上的(甲基)丙烯醯基的(甲基)丙烯酸系化合物（其中，將於分子內具有環氧基的樹脂除外）、以及咪唑系化合物，所述樹脂組成物中，所述咪唑系化合物的量為4.0質量%以上，所述樹脂組成物中的環氧基的總數相對於所述樹脂組成物中的咪唑基的總數的比為4.0以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1013" publication-number="202624686">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624686</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127172</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>帶有可重複使用外殼的多管壓縮氣體炮</chinese-title>
        <english-title>MULTI BARRELED COMPRESSED GAS CANNON WITH REUSABLE HOUSING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120260309B">F41B11/54</main-classification>
        <further-classification edition="201301120260309B">F41B11/681</further-classification>
        <further-classification edition="201301120260309B">F41B11/89</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商烏瑪雷克斯美國股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UMAREX USA, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特納　理查德　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TURNER, RICHARD R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普弗勞默　埃克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PFLAUMER, EYCK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種彩紙炮是一種被配置爲發射彩紙和/或彩帶有效載荷的氣槍。氣槍的扳機響應於用戶的輸入，選擇性地將來自壓縮氣瓶的壓縮空氣提供到氣槍的出口。旋轉外殼具有多個基座配件，每個基座配件被配置爲接收來自發射管或罐的端部配件。發射管端部配件鎖定到旋轉外殼的基座配件中。當發射時，來自氣槍出口的壓縮氣體進入與出口對齊的罐中，將有效載荷從與端部配件相對的罐的一端推出。旋轉外殼可相對於出口旋轉，以將第二個罐與氣槍的出口對齊，從而氣槍準備好從第二個罐中噴射出有效載荷。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A confetti cannon is an air gun configured to launch a payload of confetti and/or streamers. A trigger of the air gun selectively provides compressed air from a compressed gas cylinder to an outlet of the air gun in response to input from a user. A rotary housing has a plurality of base fittings, each configured to receive an end fitting from a shot tube or canister. The shot tube end fitting locks into the base fitting of the rotary housing. When fired, compressed gas from the outlet of the air gun passes into a canister aligned with the outlet, forcing a payload out of an end of the canister opposite the end fitting. The rotary housing is rotatable relative to the outlet to align a second canister with the outlet of the air gun such that the air gun is ready to expel a payload from the second canister.</p>
      </isu-abst>
      <representative-img>
        <p type="p">107:扳機</p>
        <p type="p">131:主外殼</p>
        <p type="p">133:旋轉外殼</p>
        <p type="p">303:接收罐；罐；彩帶的罐</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1014" publication-number="202625796">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625796</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127181</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>堆疊式絕緣體、其形成方法及包含該絕緣體的半導體元件</chinese-title>
        <english-title>STACKED INSULATOR, METHOD OF FORMING THE SAME AND SEMICONDUCTOR DEVICE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W10/00</main-classification>
        <further-classification edition="202601120260302B">H10P14/60</further-classification>
        <further-classification edition="202601120260302B">H10D88/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商圓益ＩＰＳ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONIK IPS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴又永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, WOO YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅敬弼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NA, KYOUNG PIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李仁奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, IN GYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李成煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SUNG HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓在鎮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, JAE JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李韓妃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HAN BEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供的堆疊式絕緣體的形成方法包括以下步驟：在基板上形成包括第一金屬氧化物的第一高介電層的步驟；在所述第一高介電層上形成第一介面層的步驟；以及在所述第一介面層上形成包括第二金屬氧化物的第二高介電層的步驟，其中，所述第一介面層包括第一金屬氧化物與第二金屬氧化物的複合氧化物，以減少所述第一高介電層與所述第二高介電層之間的晶格失配。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">120:堆疊式絕緣體</p>
        <p type="p">122:第一高介電層</p>
        <p type="p">123:第一介面層</p>
        <p type="p">124:第二高介電層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1015" publication-number="202624413">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624413</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127189</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顏料分散劑</chinese-title>
        <english-title>DISPERSANT FOR PIGMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">C09C1/62</main-classification>
        <further-classification edition="202201120260311B">C09K23/46</further-classification>
        <further-classification edition="201801120260311B">C09D7/43</further-classification>
        <further-classification edition="201801120260311B">C09D7/47</further-classification>
        <further-classification edition="200601120260311B">C09D17/00</further-classification>
        <further-classification edition="200601120260311B">C09B67/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商高級醇工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKYU ALCOHOL KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>工藤彩夢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUDO, AMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡清福</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馭理</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於提供一種能良好分散顏料的新型分散劑、包含顏料及分散劑的顏料分散組合物、以及顏料分散方法。本發明提供包含醯胺醇的顏料分散劑、包含顏料及該分散劑的顏料分散組合物、以及顏料分散方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1016" publication-number="202624307">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624307</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127199</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>閘極絕緣膜形成用感放射線性組成物、圖案及其製造方法、閘極絕緣膜用硬化膜、半導體元件、有機電化學電晶體、有機EL顯示裝置、液晶顯示裝置、微LED顯示裝置、量子點發光型顯示裝置、可穿戴設備、電子皮膚設備、生物體感測器、以及神經形態設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08F220/34</main-classification>
        <further-classification edition="200601120260302B">C08F220/38</further-classification>
        <further-classification edition="200601120260302B">C08G77/392</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/023</further-classification>
        <further-classification edition="200601120260302B">G03F7/038</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="200601120260302B">G02B5/20</further-classification>
        <further-classification edition="200601120260302B">G02F1/1333</further-classification>
        <further-classification edition="200601120260302B">G02F1/1368</further-classification>
        <further-classification edition="200601120260302B">G09F9/30</further-classification>
        <further-classification edition="200601120260302B">G09F9/33</further-classification>
        <further-classification edition="200601120260302B">H05B33/14</further-classification>
        <further-classification edition="202301120260302B">H10K50/115</further-classification>
        <further-classification edition="202301120260302B">H10K50/135</further-classification>
        <further-classification edition="202301120260302B">H10K59/12</further-classification>
        <further-classification edition="202301120260302B">H10K71/12</further-classification>
        <further-classification edition="202301120260302B">H10K71/20</further-classification>
        <further-classification edition="202301120260302B">H10K85/10</further-classification>
        <further-classification edition="202301120260302B">H10K85/40</further-classification>
        <further-classification edition="202301120260302B">H10K85/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三村時生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIMURA, TOKIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供一種能夠形成具有伸縮性且以充分的水準發揮圖案形成性及電容、進而滲出得到抑制的閘極絕緣膜的感放射線性組成物、由該感放射線性組成物形成的圖案（硬化膜）及其製造方法、閘極絕緣膜用硬化膜、包括該硬化膜的半導體元件、有機電化學電晶體、有機EL顯示裝置、液晶顯示裝置、微LED顯示裝置、量子點發光型顯示裝置、可穿戴設備、電子皮膚設備、生物體感測器、以及神經形態設備。本發明是有關於一種閘極絕緣膜形成用感放射線性組成物，其含有：選自由包含具有酸基的結構單元（I）的聚合物（A1）、矽氧烷聚合物（A2）及聚醯胺酸或聚醯胺酸酯（A3）所組成的群組中的至少一種聚合物（A）、感放射線性化合物（B）、以及玻璃轉移溫度為0℃以下的多聚化離子液體（C）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1017" publication-number="202624761">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624761</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127203</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>探針卡以及探針卡的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260310B">G01R1/073</main-classification>
        <further-classification edition="200601120260310B">G01R3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本麥克隆尼股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICRONICS JAPAN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原正登</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARA, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">探針卡(1)係具備：配線基板(10)，係具有複數個端子部(11)；導引構件(20)，係固定於配線基板(10)，且於與複數個端子部(11)對向的位置形成有複數個貫通孔(20a)；以及複數個探針(30)，係能夠插拔地插入至複數個貫通孔(20a)，且與複數個端子部(11)接合；導引構件(20)係具備：凹陷部(50)，係圍繞接合有複數個端子部(11)與複數個探針(30)之複數個接合部(40)；以及連通部(51)，係連通凹陷部(50)的內側與導引構件(20)的外側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:探針卡</p>
        <p type="p">10:配線基板</p>
        <p type="p">11:端子部</p>
        <p type="p">20:導引構件</p>
        <p type="p">20a:貫通孔</p>
        <p type="p">21:導引本體</p>
        <p type="p">21A:對向面</p>
        <p type="p">21B:非對向面</p>
        <p type="p">22:腳部</p>
        <p type="p">30:探針</p>
        <p type="p">40:接合部</p>
        <p type="p">41:接合材料</p>
        <p type="p">50:凹陷部</p>
        <p type="p">51:連通部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1018" publication-number="202624300">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624300</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127222</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>成形材料</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">C08F214/26</main-classification>
        <further-classification edition="200601120260304B">C08L27/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＡＧＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡貫俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANUKI, SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田島信哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAJIMA, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明課題在於提供一種加熱初始黏度降低速度大之成形材料。&lt;br/&gt;  本發明成形材料包含含氟樹脂，該含氟樹脂包含以四氟乙烯為主體之單元、以全氟(烷基乙烯基醚)為主體之單元及以六氟丙烯為主體之單元；相對於上述含氟樹脂之全部單元，上述以全氟(烷基乙烯基醚)為主體之單元之含量為1.0~4.8質量%；相對於上述含氟樹脂之全部單元，上述以六氟丙烯為主體之單元之含量為0.9~4.8質量%；遵循ASTM D1238，在溫度372℃之條件下測定之上述成形材料的熔體流動速率為10.0~16.9g/10分鐘；上述含氟樹脂之熔點為295.0℃以下；以每10&lt;sup&gt;6&lt;/sup&gt;個上述含氟樹脂之主鏈碳數計，上述含氟樹脂所具有之官能基數的合計小於100個；且，預定參數A為0.005(h&lt;sup&gt;-1&lt;/sup&gt;)以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1019" publication-number="202623881">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623881</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127245</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於半導體製造設施之廢氣電漿處理設備</chinese-title>
        <english-title>EXHAUST GAS PLASMA TREATMENT EQUIPMENT FOR SEMICONDUCTOR MANUFACTURING FACILITY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">B01D53/80</main-classification>
        <further-classification edition="200601120260302B">H01J37/32</further-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＯＴ　ＣＥＳ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOT CES CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裵辰鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE, JIN HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金旻材</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MIN JAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李泰炯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TAE HYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金道元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DO WON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明，提供一種用於半導體製造設施之廢氣電漿處理設備，其作為處理從半導體製程腔室排出的廢氣的設備，其中係在半導體製程腔室中執行使用製程氣體的半導體製造製程，且藉由使用真空幫浦使廢氣流動而通過連接半導體製程室至真空幫浦之腔室排氣管路，廢氣電漿處理設備包含：電感耦合電漿反應器，其安裝於腔室排氣管路上、於廢氣中產生電漿並去除廢氣中所含有之待去除成分；以及電漿監測單元，其監測在電漿反應器中所產生之電漿，其中電感耦合電漿反應器包含：電漿反應室，其於內部提供具有環形形狀的電漿放電通道；磁芯，其環繞電漿反應室；以及線圈，其繞設於磁芯上；且電漿監測單元分析自該電漿反應室向外照射之光強度並計算在電漿反應室中所產生之電漿密度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">According to the present invention, there is provided exhaust gas plasma treatment equipment for a semiconductor manufacturing facility, as equipment that treats an exhaust gas discharged from a semiconductor process chamber in which a semiconductor manufacturing process using a process gas is to be performed, through a chamber exhaust pipe connecting the semiconductor process chamber and a vacuum pump using plasma by the vacuum pump, the exhaust gas plasma treatment equipment including: an inductively coupled plasma reactor installed on the chamber exhaust pipe, generating plasma in the exhaust gas and removing ingredients to be removed, contained in the exhaust gas; and a plasma monitoring unit monitoring plasma generated in the plasma reactor, wherein the inductively coupled plasma reactor includes a plasma reaction chamber providing a plasma discharge channel having a toroidal shape inside, a magnetic core surrounding the plasma reaction chamber, and a coil wound on the magnetic core, and the plasma monitoring unit analyzes an intensity of light irradiated from the plasma reaction chamber to the outside and calculates a density of plasma generated in the plasma reaction chamber.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:電漿反應器</p>
        <p type="p">120:電漿反應室</p>
        <p type="p">121:氣體入口</p>
        <p type="p">122:反應器入口</p>
        <p type="p">123:氣體出口</p>
        <p type="p">124:反應器出口</p>
        <p type="p">125:電漿反應單元</p>
        <p type="p">126:第一連接管部</p>
        <p type="p">127:第二連接管部</p>
        <p type="p">130:磁芯</p>
        <p type="p">17a:上游部</p>
        <p type="p">17b:下游部</p>
        <p type="p">190:電漿監測單元</p>
        <p type="p">191:發光窗</p>
        <p type="p">194:光感測器</p>
        <p type="p">197:電漿密度計算器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1020" publication-number="202625241">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625241</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127250</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>經由分束教導帶電粒子顯微術機器人夾爪</chinese-title>
        <english-title>TEACHING OF CHARGED-PARTICLE MICROSCOPY ROBOTIC GRIPPERS VIA BEAMSPLITTING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">H01J37/26</main-classification>
        <further-classification edition="200601120260304B">H01J37/22</further-classification>
        <further-classification edition="200601120260304B">H01J37/02</further-classification>
        <further-classification edition="200601120260304B">B25J9/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商ＦＥＩ公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FEI COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴希奇　大衛　尼可拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARSIC, DAVID NICHOLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　宰弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JAE HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史密斯　西蒙　皮埃爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMITH, SIMON-PIERRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鐘　龍　Ｂ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, LUON B.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿拉米達　德　拉　莫拉　埃索</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALAMEDA DE LA MORA,ESAU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MX</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔珀特　伊莉莎白　蘇珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAPPERT, ELISABETH SUSAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼利　羅納德　愛德華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEELY, RONALD EDWARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菲舍爾　卡梅倫　伊凡斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FISCHER, CAMERON IVANS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡留金　安德烈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARYUKIN, ANDREI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古澤爾德雷　阿里　克里姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUZELDERE, ALI KERIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供用於促進經由分束教導帶電粒子顯微術機器人夾爪的系統/技術。在各種實施例中，一系統可存取具有一真空室的一帶電粒子顯微鏡，其中該真空室可包含一機器人夾爪及一顯微術網格收容器。在各種態樣中，該系統可基於耦接至該機器人夾爪的一配備分光鏡的光源來教導該機器人夾爪將其軸心軸與該顯微術網格收容器的一孔軸角對準或平移對準。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems/techniques are provided for facilitating teaching of charged-particle microscopy robotic grippers via beamsplitting. In various embodiments, a system can access a charged-particle microscope having a vacuum chamber, wherein the vacuum chamber can comprise a robotic gripper and a microscopy grid receptacle. In various aspects, the system can teach the robotic gripper to angularly or translationally align its shaft-axis with a bore-axis of the microscopy grid receptacle, based on a beamsplitter-equipped light source coupled to the robotic gripper.</p>
      </isu-abst>
      <representative-img>
        <p type="p">302:帶電粒子顯微鏡</p>
        <p type="p">304:真空室</p>
        <p type="p">306:顯微術網格收容器</p>
        <p type="p">308:機器人夾爪</p>
        <p type="p">310:對準硬體</p>
        <p type="p">312:光源</p>
        <p type="p">314:準直器透鏡</p>
        <p type="p">316:分光鏡</p>
        <p type="p">318:反射器</p>
        <p type="p">320:攝影機</p>
        <p type="p">322:系統</p>
        <p type="p">324:處理器</p>
        <p type="p">326:非暫時性電腦可讀取記憶體</p>
        <p type="p">327:軟體組件</p>
        <p type="p">328:存取組件</p>
        <p type="p">330:重疊組件</p>
        <p type="p">332:校正組件</p>
        <p type="p">334:執行組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1021" publication-number="202624498">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624498</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127316</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>來自製造脫脂前之未燒成廢棄物或製造脫脂後之未燒成廢棄物之稀土類成分及金屬成分之分離回收方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C22B1/00</main-classification>
        <further-classification edition="200601120260302B">C22B3/08</further-classification>
        <further-classification edition="200601120260302B">C22B3/20</further-classification>
        <further-classification edition="200601120260302B">C22B23/00</further-classification>
        <further-classification edition="200601120260302B">C22B23/06</further-classification>
        <further-classification edition="200601120260302B">C22B59/00</further-classification>
        <further-classification edition="200601120260302B">C22B7/00</further-classification>
        <further-classification edition="200601120260302B">C25C1/08</further-classification>
        <further-classification edition="200601120260302B">B03C1/00</further-classification>
        <further-classification edition="202201120260302B">B09B3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商村田製作所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURATA MANUFACTURING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口健一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, KENICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>濱田大介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMADA, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種來自未燒成廢棄物之稀土類成分及金屬成分之分離回收方法。  本發明之分離回收方法包括如下步驟：(A)準備製造脫脂前之未燒成廢棄物之步驟，該製造脫脂前之未燒成廢棄物包含具有磁性之金屬粉末、陶瓷粉末、稀土類粉末、及樹脂成分，且金屬粉末與陶瓷粉末至少部分地相互附著在一起；(B)將製造脫脂前之未燒成廢棄物微細化之步驟；(C)於經過步驟(B)後，使用磁鐵，分離為金屬粉末含有物、稀土類粉末含有物並回收之步驟；(H)藉由電解精煉自金屬粉末含有物中回收構成金屬粉末之金屬成分之步驟；及(E)於步驟(A)與步驟(C)之後及與步驟(H)之間，自製造脫脂前之未燒成廢棄物中將樹脂成分再生脫脂之步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">BT&lt;sub&gt;1&lt;/sub&gt;:第1陶瓷粉末</p>
        <p type="p">BT&lt;sub&gt;2&lt;/sub&gt;:第2陶瓷粉末</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1022" publication-number="202624553">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624553</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127338</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鹼性水電解用隔膜及其製造方法、以及鹼性水電解槽</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">C25B13/02</main-classification>
        <further-classification edition="200601120260311B">C25B13/08</further-classification>
        <further-classification edition="202101120260311B">C25B9/19</further-classification>
        <further-classification edition="202101120260311B">C25B1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商川崎重工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASAKI JUKOGYO KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤隆文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, TAKAFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石川七彩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIKAWA, NANASE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>下村育生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMOMURA, IKUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亀井裕次</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMEI, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">將鹼性水電解槽之陽極室與陰極室隔開之鹼性水電解用隔膜具備高分子多孔質膜，該高分子多孔質膜一體地具有於鹼性水電解槽中被槽構成構件夾住之密封區域、配置於密封區域之外周側之邊緣區域、及配置於密封區域之內周側之隔離件（seperator）區域，密封區域具有塊狀部，該塊狀部呈圍繞隔離件區域之形狀，並阻止電解液通過高分子多孔質膜之細孔滲透。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:槽本體</p>
        <p type="p">4:鹼性水電解用隔膜</p>
        <p type="p">21:陽極室框</p>
        <p type="p">21a,22a:框面</p>
        <p type="p">22:陰極室框</p>
        <p type="p">23:分隔件</p>
        <p type="p">24,25,26:襯墊</p>
        <p type="p">31:陽極</p>
        <p type="p">32:陽極導電板</p>
        <p type="p">42:塊狀部</p>
        <p type="p">71:陰極</p>
        <p type="p">72:陰極導電板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1023" publication-number="202624398">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624398</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127427</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬化性組成物及電子零件裝置</chinese-title>
        <english-title>CURABLE COMPOSITION AND ELECTRONIC COMPONENT DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">C08L63/00</main-classification>
        <further-classification edition="200601120260311B">C08G59/40</further-classification>
        <further-classification edition="201801120260311B">C08K3/013</further-classification>
        <further-classification edition="200601120260311B">C08K5/00</further-classification>
        <further-classification edition="202601120260311B">H10W76/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳立欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LI-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種硬化性組成物，包含硬化性成分，所述硬化性組成物中，對於將所述硬化性組成物於模具溫度175℃、硬化時間150秒的條件下成形後的成形物，於將藉由在175℃、3小時的條件下進行後硬化而獲得的硬化物的玻璃轉移溫度設為Tg1且將藉由在175℃、5小時的條件下進行後硬化而獲得的硬化物的玻璃轉移溫度設為Tg2時，Tg1/Tg2為0.9以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A curable composition contains a curable component and in a molded product obtained by forming the curable composition under the condition of a mold temperature at 175°C and a cure time of 150 seconds, when a glass transition temperature of a cured product obtained by performing after-cure under the condition of 175°C and 3 hours is Tg1 and a glass transition temperature of a cured product obtained by performing after-cure under the condition of 175°C and 5 hours is Tg2, Tg1/Tg2 is 0.9 or more.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1024" publication-number="202624532">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624532</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127456</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有氣幕模組的化學氣相沉積系統和方法</chinese-title>
        <english-title>CHEMICAL VAPOR DEPOSITION SYSTEM WITH GAS CURTAIN MODULE AND A METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C23C16/455</main-classification>
        <further-classification edition="200601120260302B">C23C16/458</further-classification>
        <further-classification edition="200601120260302B">F16K3/00</further-classification>
        <further-classification edition="202601120260302B">H10P14/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬蘭商卡納圖芬蘭有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANATU FINLAND OY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科斯內　湯米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSKINEN, TOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>君圖寧　塔內利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNTUNEN, TANELI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭妮　瑞斯多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAINE, RISTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩爾米　艾瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SALMI, EMMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波薩　派米羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PLAZA, PRZEMYSLAW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孚竹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種化學氣相沉積系統、一種用於化學氣相沉積系統的氣體分配系統的氣幕模組，以及一種用於此系統的閥控制方法。用於將沉積產物自反應器轉移至收集室的氣體分配系統包括位於氣體流動入口和收集閥之間的管線中的氣幕模組，其中，氣幕模組包括一個或多個吹掃氣體入口，並且配置為在其位置將吹掃氣體引入管線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are a chemical vapor deposition system, a gas curtain module for a gas distribution system of a chemical vapor deposition system, and a method of valve control for such system. The gas distribution system for transferring the deposition product from the reactor to the collection chamber comprises a gas curtain module positioned in the pipeline between the gas flow inlet and the collection valve, wherein the gas curtain module comprises one or more purging gas inlets and is configured to introduce a purging gas into the pipeline at its position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">130:氣體分配系統</p>
        <p type="p">131:氣體流動入口</p>
        <p type="p">138:視窗</p>
        <p type="p">140:收集閥</p>
        <p type="p">142:氣幕模組</p>
        <p type="p">210:氣體流動出口閥</p>
        <p type="p">242:緩衝區</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1025" publication-number="202623913">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623913</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127459</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>洗淨裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">B08B11/00</main-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商龍雲股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAZMO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田邊雅明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANABE, MASAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之洗淨裝置係將經由膠帶或平板即保持構件而被固定於框架之內側的工件加以洗淨的裝置，其具備：載台部，其具有將工件與框架一併載置的載置面；及保護蓋，其保護被載置於該載置面之框架免受洗淨液污染。保護蓋具有蓋本體及密封部。此處，蓋本體係呈環狀構成之部分，於洗淨工件時，在使該工件露出的同時，於該工件之周圍覆蓋整個框架。密封部係藉由將環狀之密封構件設置於蓋本體之內周緣而構成的部分，保護蓋構成為於洗淨工件時，密封部於工件與框架之間接觸保持構件，或者密封部接觸工件之周緣部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:載台部</p>
        <p type="p">2:保護蓋</p>
        <p type="p">3:第1升降機構</p>
        <p type="p">4:第2升降機構</p>
        <p type="p">5:固定機構</p>
        <p type="p">10a:載置面</p>
        <p type="p">10b:背面</p>
        <p type="p">11:中央部分</p>
        <p type="p">12:周緣部分</p>
        <p type="p">13:密封部</p>
        <p type="p">21:蓋本體</p>
        <p type="p">21a:背面</p>
        <p type="p">22:密封部</p>
        <p type="p">31:臂部</p>
        <p type="p">32:第1可動部</p>
        <p type="p">32a:上表面</p>
        <p type="p">201:旋轉軸</p>
        <p type="p">202:軸承</p>
        <p type="p">210:開口部</p>
        <p type="p">D1:第1方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1026" publication-number="202624910">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624910</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127468</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>搬送設備</chinese-title>
        <english-title>TRANSPORT FACILITY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120260306B">G05D1/43</main-classification>
        <further-classification edition="202401120260306B">G05D1/69</further-classification>
        <further-classification edition="202401120260306B">G05D1/644</further-classification>
        <further-classification edition="202401320260306B">G05D107/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大福股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIFUKU CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀江智史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORIE, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石原步實</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIHARA, AYUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩田昌重</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWATA, MASASHIGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在搬送設備100中，行走路徑2包含沿著Y方向延伸之複數個Y方向路徑21及沿著X方向延伸且連接複數個Y方向路徑21之至少1個X方向路徑22，複數個Y方向路徑21配置成在X方向上隔著間隔而在X方向上排列，在於X方向上相鄰之2個Y方向路徑21之間設有收納物品W的收納部5，將Y方向之未配置有收納部5及X方向路徑22之任一者的區域定為特定區域A，供在搬送車1與搬送裝置3之間的物品W的交接進行的交接區4配置在特定區域A內之複數個Y方向路徑21的每一者，在特定區域A內的於X方向上相鄰之2個交接區4之間設有可供搬送車1待機的待機區6。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:搬送設備</p>
        <p type="p">1:搬送車</p>
        <p type="p">2:行走路徑</p>
        <p type="p">21:Y方向路徑</p>
        <p type="p">21A:第1Y方向路徑</p>
        <p type="p">21B:第2Y方向路徑</p>
        <p type="p">21C:第3Y方向路徑</p>
        <p type="p">22:X方向路徑</p>
        <p type="p">22A:第1X方向路徑</p>
        <p type="p">22B:第2X方向路徑</p>
        <p type="p">22C:第3X方向路徑</p>
        <p type="p">22S:特定X方向路徑</p>
        <p type="p">23:待機路徑</p>
        <p type="p">3:搬送裝置</p>
        <p type="p">31:入庫輸送帶</p>
        <p type="p">32:出庫輸送帶</p>
        <p type="p">4:交接區</p>
        <p type="p">5:收納部</p>
        <p type="p">6:待機區</p>
        <p type="p">7:充電裝置</p>
        <p type="p">A:特定區域</p>
        <p type="p">W:物品</p>
        <p type="p">X:X方向</p>
        <p type="p">X1:X方向第1側</p>
        <p type="p">X2:X方向第2側</p>
        <p type="p">Y:Y方向</p>
        <p type="p">Y1:Y方向第1側</p>
        <p type="p">Y2:Y方向第2側</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1027" publication-number="202625226">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625226</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127494</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>變壓器及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251030B">H01F27/28</main-classification>
        <further-classification edition="200601120251030B">H01F27/32</further-classification>
        <further-classification edition="201601120251030B">H01F41/06</further-classification>
        <further-classification edition="200601120251030B">H01F41/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商矽力杰半導體技術（杭州）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>代克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>危建</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏佳佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種變壓器，包括相互間隔設置的一次側繞組和二次側繞組，以及包覆住所述一次側繞組和二次側繞組的絕緣基板，還包括位於所述絕緣基板上的一個第一開孔和多個第二開孔，所述一次側繞組和二次側繞組環繞在所述第一開孔的外側，所述多個第二開孔環繞在所述一次側繞組和二次側繞組的四周；以及還包括位於所述第一開孔中的中柱，以及位於所述第二開孔中的邊柱；其中，所述中柱和所述邊柱包括非金屬的磁性材料和塑封材料。與習知技術相比，本發明的變壓器能夠更好的集中和引導磁場，大大的提高了磁感應強度，從而提高變壓器的效率和穩定性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:絕緣基板</p>
        <p type="p">2:繞組</p>
        <p type="p">6:外接腳</p>
        <p type="p">51:出頭</p>
        <p type="p">52:出頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1028" publication-number="202625491">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625491</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127505</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於非主通道存取（ＮＰＣＡ）通訊的主要通道指示</chinese-title>
        <english-title>PRIMARY CHANNEL INDICATION FOR NON-PRIMARY CHANNEL ACCESS (NPCA) COMMUNICATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120260312B">H04W74/0816</main-classification>
        <further-classification edition="202401120260312B">H04W74/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奈克　高朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAIK, GAURANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕提爾　雅伯西斯克普拉蒙德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATIL, ABHISHEK PRAMOD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾斯特傑迪　阿爾佛瑞德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASTERJADHI, ALFRED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伽里恩　喬治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHERIAN, GEORGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何　世耀當肯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, SAI YIU DUNCAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赫爾瓦　謝里夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HELWA, SHERIEF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>EG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齊希　喬瓦尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHISCI, GIOVANNI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡拉姆卡　桑凱特桑傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KALAMKAR, SANKET SANJAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露之某些態樣係關於一種無線通訊裝置。該無線通訊裝置大致上包括一處理系統，其包括一或多個處理器及與該一或多個處理器耦接的一或多個記憶體，該處理系統經組態以使該無線通訊裝置：經由一第一主通道或一第二主通道獲得一第一訊框傳輸，其中該第一訊框傳輸包括該第一訊框傳輸係經由該第一主通道或該第二主通道的一指示；及回應於獲 得該第一訊框傳輸而導致一第二訊框傳輸，其中該第二訊框傳輸基於該指示而係經由該第一主通道或該第二主通道。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Certain aspects of the present disclosure are directed towards a wireless communication device. The wireless communication device generally includes a processing system that includes one or more processors and one or more memories coupled with the one or more processors, the processing system configured to cause the wireless communication device to: obtain a first frame transmission via a first primary channel or a second primary channel, wherein the first frame transmission includes an indication of whether the first frame transmission is via the first primary channel or the second primary channel; and cause a second frame transmission in response to obtaining the first frame transmission, wherein the second frame transmission is via the first primary channel or the second primary channel based on the indication.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1100:圖</p>
        <p type="p">1102:觸發訊框</p>
        <p type="p">1103:所預期回應</p>
        <p type="p">1104:所推斷回應</p>
        <p type="p">1150:圖</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1029" publication-number="202623800">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623800</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127512</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阿伐可泮配製物</chinese-title>
        <english-title>AVACOPAN FORMULATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/451</main-classification>
        <further-classification edition="200601120260302B">A61K31/44</further-classification>
        <further-classification edition="200601120260302B">A61K31/675</further-classification>
        <further-classification edition="200601120260302B">A61K47/14</further-classification>
        <further-classification edition="200601120260302B">A61K9/08</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
        <further-classification edition="200601120260302B">A61P37/00</further-classification>
        <further-classification edition="200601120260302B">C07K16/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商安進公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMGEN INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝杰古姆　巴哈努　強德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEJGUM, BHANU CHANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康　袁宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIANG, YUAN-HON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾爾瑞茲　努尼茲　菲爾南多　安東尼歐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALVAREZ-NUNEZ, FERNANDO ANTONIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐貝羅伊　拉吉尼特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OBEROI, RAJNEET</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴巴爾　史密里　法堤瑪　阿瑪德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARBAR-SMILEY, FATIMA AHMAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江美寶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONG, STEPHANIE MABEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩拉比亞　雷菲爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SARABIA, RAFAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供了包含阿伐可泮和一種或多種中鏈甘油三酯的配製物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure provides formulations comprising avocapan and one or more medium-chain triglycerides.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1030" publication-number="202624303">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624303</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127572</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>活性能量線硬化性組成物及其硬化物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">C08F220/10</main-classification>
        <further-classification edition="200601120260304B">C08K3/22</further-classification>
        <further-classification edition="200601120260304B">C08F2/44</further-classification>
        <further-classification edition="200601120260304B">C08F2/50</further-classification>
        <further-classification edition="200601120260304B">G02B1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三洋化成工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANYO CHEMICAL INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>前田和哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAEDA, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>児島俊貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOJIMA, TOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之活性能量線硬化性組成物含有為具有碳-碳雙鍵且折射率為1.59以上之單體的活性能量線聚合性化合物（A）、無機粒子（B）及光聚合起始劑（C），亦可含有為具有碳-碳雙鍵且折射率未達1.59之單體的活性能量線聚合性化合物（A'），上述無機粒子（B）為數量平均粒徑為5～50 nm且折射率為2.2～2.5之粒子，上述活性能量線聚合性化合物（A）與上述活性能量線聚合性化合物（A'）之混合物於25℃之黏度為300 mPa・s以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1031" publication-number="202624509">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624509</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127629</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於沉積的脈衝電壓波形輸送</chinese-title>
        <english-title>PULSED VOLTAGE WAVEFORM DELIVERY FOR DEPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C23C14/14</main-classification>
        <further-classification edition="200601120260302B">C23C14/34</further-classification>
        <further-classification edition="200601120260302B">C23C14/35</further-classification>
        <further-classification edition="200601120260302B">C23C14/56</further-classification>
        <further-classification edition="200601120260302B">H01J37/32</further-classification>
        <further-classification edition="200601120260302B">H01J37/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>房裴嬌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, PEIJIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉程玉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHENGYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施例描述了一種方法，該方法包括從設置於處理腔室內的物理氣相沉積（PVD）靶材濺射材料。經濺射的材料由電極過濾。過濾該經濺射的材料使得該經濺射的材料的第一部分穿過在該電極中形成的孔隙並朝向設置於基板支撐件上的基板。該經濺射的材料的該第一部分沉積在該基板的表面上。沉積該經濺射的材料的該第一部分包括向設置於該基板支撐件內的額外電極輸送脈衝電壓（PV）波形。該基板支撐件設置於該處理腔室內。該PV波形被配置為對該額外電極施加脈衝DC偏壓。該脈衝DC偏壓的該施加包括形成大於或等於0.5的蝕刻與沉積比。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the disclosure describe a method including sputtering material from a physical vapor deposition (PVD) target disposed within a processing chamber. The sputtered material is filtered by an electrode. Filtering the sputtered material causes a first portion of the sputtered material to pass through apertures formed in the electrode and towards a substrate disposed on a substrate support. The first portion of the sputtered material is deposited on a surface of the substrate. Depositing the first portion of the sputtered material includes delivering a pulsed voltage (PV) waveform to an additional electrode that is disposed within the substrate support. The substrate support is disposed within the processing chamber. The PV waveform is configured to apply a pulsed DC bias to the additional electrode. The application of the pulsed DC bias includes forming an etch-to-deposition ratio greater than or equal to 0.5.</p>
      </isu-abst>
      <representative-img>
        <p type="p">600:方法</p>
        <p type="p">602:操作</p>
        <p type="p">604:操作</p>
        <p type="p">606:操作</p>
        <p type="p">608:操作</p>
        <p type="p">610:操作</p>
        <p type="p">612:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1032" publication-number="202624195">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624195</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127638</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>作為氫氟烯烴穩定聚胺基甲酸酯催化劑之三級胺</chinese-title>
        <english-title>TERTIARY AMINES AS HYDROFLUOROOLEFIN STABLE POLYURETHANE CATALYST</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07C211/14</main-classification>
        <further-classification edition="200601120260302B">C07C217/08</further-classification>
        <further-classification edition="200601120260302B">C08G18/18</further-classification>
        <further-classification edition="200601120260302B">C08G18/20</further-classification>
        <further-classification edition="200601120260302B">C08G18/38</further-classification>
        <further-classification edition="200601120260302B">C08G18/40</further-classification>
        <further-classification edition="200601120260302B">C08G18/42</further-classification>
        <further-classification edition="200601120260302B">C08G18/48</further-classification>
        <further-classification edition="200601120260302B">C08G18/50</further-classification>
        <further-classification edition="200601120260302B">C08G18/76</further-classification>
        <further-classification edition="200601120260302B">C08L75/04</further-classification>
        <further-classification edition="200601120260302B">C08J9/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商漢士門石油化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNTSMAN PETROCHEMICAL LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙　海波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, HAIBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周　景鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, JINGJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>里特邁爾　西爾維亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RIETHMEYER, SYLVIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳致豫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於在使用氫鹵烯烴發泡劑產生聚胺基甲酸酯及/或聚異氰脲酸酯發泡體中有用之催化劑及催化劑系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A catalyst and catalyst system useful in the production of polyurethane and/or polyisocyanurate foams using hydrohaloolefin blowing agents.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1033" publication-number="202624338">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624338</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127662</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>保護膜形成用組成物、保護膜、基板之製造方法及半導體裝置之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08G63/685</main-classification>
        <further-classification edition="200601120260302B">C08G63/688</further-classification>
        <further-classification edition="200601120260302B">G03F7/11</further-classification>
        <further-classification edition="200601120260302B">G03F7/16</further-classification>
        <further-classification edition="200601120260302B">G03F7/40</further-classification>
        <further-classification edition="202601120260302B">H10P50/60</further-classification>
        <further-classification edition="202601120260302B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日產化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>窪寺俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUBODERA, SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之保護膜形成用組成物，係用以形成可保護表面形成有無機膜之半導體基板的前述無機膜免受濕蝕刻之保護膜，且含有：  &lt;br/&gt;具有由下述式（A-1）表示之部分結構及由下述式（A-2）表示之部分結構之化合物（A）、  &lt;br/&gt;由下述式（B）表示之化合物（B）、以及  &lt;br/&gt;溶劑。  &lt;br/&gt;&lt;img align="absmiddle" height="247px" width="338px" file="ed10080.JPG" alt="ed10080.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;（式（A-1）中，X&lt;sup&gt;1&lt;/sup&gt;及X&lt;sup&gt;2&lt;/sup&gt;各自獨立表示單鍵、或羰基。Q&lt;sup&gt;1&lt;/sup&gt;表示碳原子數1～20的二價有機基。＊表示鍵結鍵。  &lt;br/&gt;式（A-2）中，A各自獨立表示氫原子、甲基、或乙基。Q&lt;sup&gt;2&lt;/sup&gt;表示碳原子數1～20的二價有機基。＊表示鍵結鍵。）  &lt;br/&gt;&lt;img align="absmiddle" height="129px" width="241px" file="ed10081.JPG" alt="ed10081.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;（式（B）中，n表示2～10的整數。  &lt;br/&gt;當n為2之情形時，X表示亞磺醯基、磺醯基、醚基、或碳原子數2～50的二價有機基。  &lt;br/&gt;當n為2以外的整數之情形時，X表示碳原子數2～50的n價有機基。）</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1034" publication-number="202624327">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624327</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127663</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>保護膜形成用組成物、保護膜、基板之製造方法及半導體裝置之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08G59/42</main-classification>
        <further-classification edition="200601120260302B">C08G63/685</further-classification>
        <further-classification edition="200601120260302B">G03F7/11</further-classification>
        <further-classification edition="200601120260302B">G03F7/16</further-classification>
        <further-classification edition="200601120260302B">G03F7/40</further-classification>
        <further-classification edition="202601120260302B">H10P50/60</further-classification>
        <further-classification edition="202601120260302B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日產化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西田登喜雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHITA, TOKIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>窪寺俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUBODERA, SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠藤勇樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENDO, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種可形成對於半導體用濕蝕刻液耐性優異、且對於光阻組成物中所含之溶劑耐性優異之保護膜之保護膜形成用組成物，其係可形成蝕刻速度快之保護膜，而且可形成對於高低差基板亦具有良好的覆蓋性、埋入後的膜厚差異小、且為平坦的膜之保護膜之保護膜形成用組成物。此外，本發明係提供一種可理想用於前述保護膜形成用組成物之化合物。&lt;br/&gt;  前述化合物係使含有具有至少兩個環氧基之環氧化合物、及二羧酸化合物之反應原料反應所獲得，且具有下述式（3）所表示之部分結構、及下述式（4）所表示之部分結構作為源自前述二羧酸化合物之結構。&lt;br/&gt;&lt;img align="absmiddle" height="295px" width="356px" file="ed10070.JPG" alt="ed10070.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;  （式（3）中，R&lt;sup&gt;11&lt;/sup&gt;表示碳數1～10的伸烷基。＊表示鍵結鍵。&lt;br/&gt;  式（4）中，Q&lt;sup&gt;11&lt;/sup&gt;表示於主鏈具有至少一個選自氧、硫、及氮所成群之雜原子之二價有機基。）</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1035" publication-number="202625819">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625819</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127664</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氮化鋁接合層</chinese-title>
        <english-title>ALUMINUM NITRIDE BONDING LAYER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260309B">H10W40/25</main-classification>
        <further-classification edition="202601120260309B">H10P95/70</further-classification>
        <further-classification edition="202601120260309B">H10P10/00</further-classification>
        <further-classification edition="202601120260309B">H10W70/698</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　裕燦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, YOOCHARN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾爾庫里馬龍　米歇爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EL KHOURY MAROUN, MICHEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">方法和結構係關於使用氮化鋁接合層接合晶圓。在一些實施例中，該方法可包括在第一晶圓上形成氮化鋁接合層，其中氮化鋁磊晶生長到第一晶圓上，並使用低於攝氏400度的低溫接合製程將第一晶圓接合到第二晶圓或晶粒。氮化鋁可使用物理氣相沉積(PVD)製程、金屬有機化學氣相沉積(MOCVD)製程或分子束磊晶(MBE)製程進行磊晶生長。載體晶圓可為具有(111)晶體結構定向的矽或在與接合層的界面上具有(001)晶體結構定向的4H-碳化矽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and structures relating to bonding wafers using an aluminum nitride bonding layer. In some embodiments, the method may comprise forming a bonding layer of aluminum nitride on a first wafer where the aluminum nitride is grown epitaxially onto the first wafer and bonding the first wafer to a second wafer or die using a low temperature bonding process of less than 400 degrees Celsius. The aluminum nitride may be epitaxially grown using a physical vapor deposition (PVD) process, a metal organic chemical vapor deposition (MOCVD) process, or a molecular-beam epitaxy (MBE) process. The carrier wafer may be silicon with a (111) crystal structure orientation or 4H-silicon carbide with a (001) crystal structure orientation at the interface with the bonding layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">202:晶圓</p>
        <p type="p">502:晶圓</p>
        <p type="p">700:圖表</p>
        <p type="p">702:X軸</p>
        <p type="p">704:Y軸</p>
        <p type="p">706:界面</p>
        <p type="p">708:界面</p>
        <p type="p">710:層材料</p>
        <p type="p">712:氮化鋁</p>
        <p type="p">720:層</p>
        <p type="p">722:晶圓</p>
        <p type="p">724:點A</p>
        <p type="p">726:點B</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1036" publication-number="202623980">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623980</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127666</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>不溶性原料及聚醯胺或聚酯之分離方法、再生單體及聚合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">B29B17/02</main-classification>
        <further-classification edition="202201120260306B">B09B3/00</further-classification>
        <further-classification edition="200601120260306B">C08J11/10</further-classification>
        <further-classification edition="200601320260306B">B29K101/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORAY INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢野稜人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANO, RYOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青木一史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOKI, KAZUFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>市場元貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ICHIBA, GENKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡崎修平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAZAKI, SHUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下浩平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHITA, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤正樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種不溶性原料及聚醯胺或聚酯之分離方法，其係用以從包含聚醯胺或聚酯(A)及不溶性原料(B)之組成物連續地分離不溶性原料(B)之方法，其依序進行下述(a)步驟及(b)步驟：&lt;br/&gt;  (a)將前述組成物加熱至聚醯胺或聚酯(A)的熔融溫度以上之步驟；&lt;br/&gt;  (b)自前述組成物連續地分離不溶性原料(B)之步驟&lt;br/&gt;  提供一種從包含聚醯胺或聚酯、及不溶性原料之組成物連續地分離不溶性原料之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1037" publication-number="202625246">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625246</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127681</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電漿處理裝置及電漿處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">H01J37/32</main-classification>
        <further-classification edition="202601120260304B">H10P50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉　如彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YE, RUBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及半導體加工設備技術領域，公開一種電漿處理裝置及電漿處理方法。其中，所述電漿處理裝置，包括：處理腔室，包括用於承載基片的下電極以及與所述下電極相對設置的上電極；邊緣源射頻功率源，用於向上電極和/或下電極的邊緣區域施加第一射頻訊號，其中，所述第一射頻訊號用於在所述上電極和下電極之間的邊緣區域產生電漿；上電極偏置射頻功率源，用於向所述上電極施加第二射頻訊號；邊緣偏置射頻功率源，用於向所述下電極的邊緣區域施加第三射頻訊號；其中，所述第二射頻訊號與所述第三射頻訊號為反向脈衝訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:上電極</p>
        <p type="p">11:靜電夾盤</p>
        <p type="p">12:電漿區域</p>
        <p type="p">13:內電極</p>
        <p type="p">14:邊緣電極</p>
        <p type="p">15:金屬基座</p>
        <p type="p">16:邊緣環</p>
        <p type="p">17:陶瓷層</p>
        <p type="p">18:射頻匹配器</p>
        <p type="p">19:脈衝訊號控制單元</p>
        <p type="p">20:邊緣源射頻功率源</p>
        <p type="p">21:上電極偏置射頻功率源</p>
        <p type="p">22:邊緣偏置射頻功率源</p>
        <p type="p">23:中心源射頻功率源</p>
        <p type="p">24:中心偏置射頻功率源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1038" publication-number="202625733">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625733</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127682</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>測溫組件、控溫組件、靜電卡盤組件及半導體處理設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260304B">H10P72/00</main-classification>
        <further-classification edition="202601120260304B">H10P72/72</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顧繼強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種測溫組件、控溫組件、靜電卡盤組件及半導體處理設備，所述測溫組件包括：基座，用於承載晶圓；至少一通道，貫穿基座設置；耐電漿腐蝕的光學窗片，密封設置在通道中；測溫光纖，其一端設置在通道內，用於接收晶圓輻射或反射的光訊號；另一端與外部測溫裝置連接；測溫光纖用於將晶圓輻射或反射的光訊號傳輸至外部測溫裝置。本發明實現對晶圓溫度的直接測量，晶圓上各個區域相對精細的溫度差異可以得到較好的呈現，為後續對晶圓上各個區域進行精準溫控提供了調節基礎。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基座</p>
        <p type="p">11:上表面</p>
        <p type="p">200:通道</p>
        <p type="p">201:光學窗片</p>
        <p type="p">202:測溫光纖</p>
        <p type="p">203:轉接光纖</p>
        <p type="p">204:填充物</p>
        <p type="p">205:頂部開口</p>
        <p type="p">W:晶圓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1039" publication-number="202624173">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624173</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127688</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>燒成用托架的再製方法及燒成用托架的使用方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">C04B41/91</main-classification>
        <further-classification edition="200601120260311B">C04B41/85</further-classification>
        <further-classification edition="200601120260311B">C04B41/89</further-classification>
        <further-classification edition="200601120260311B">F27D3/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本碍子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGK INSULATORS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＮＧＫ阿德列克股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGK ADREC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古宮山常夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMIYAMA, TSUNEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>各務欣哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAKAMU, KINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松葉浩臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUBA, HIROOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臼杵裕樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>USUKI, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">燒成用托架的再製方法包含：除去步驟，從具備陶瓷製的基材與形成在基材的表面上的塗佈層的再製對象的燒成用托架除去塗佈層；以及塗佈步驟，在基材之中除去塗佈層的除去後表面上形成新的塗佈層；在除去步驟中，在滿足以下條件(1)～(3)之中的一個以上的條件下除去塗佈層。(1)除去後表面的表面粗糙度Ra是0.005 mm以上、0.1 mm以下。(2)除去後表面的表面粗糙度Rz是0.01 mm以上、0.5 mm以下。(3)從除去步驟前的基材的厚度減去除去步驟後的基材的厚度所得到的值，即，減薄量是0.001 mm以上、0.05 mm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:燒成用托架</p>
        <p type="p">10b:再製後的燒成用托架</p>
        <p type="p">12:基材</p>
        <p type="p">12b:除去後表面</p>
        <p type="p">13:塗佈層</p>
        <p type="p">13b:新的塗佈層</p>
        <p type="p">14:中間層</p>
        <p type="p">14b:新的中間層</p>
        <p type="p">16:最外層</p>
        <p type="p">16b:新的最外層</p>
        <p type="p">20:噴砂裝置</p>
        <p type="p">22:噴砂材料</p>
        <p type="p">30:噴塗裝置</p>
        <p type="p">32:陶瓷粉末</p>
        <p type="p">34:原料</p>
        <p type="p">36:原料層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1040" publication-number="202624459">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624459</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127715</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於選擇性蝕刻矽鍺層的組成物、其用途及方法</chinese-title>
        <english-title>COMPOSITION, ITS USE AND A PROCESS FOR SELECTIVELY ETCHING SILICON-GERMANIUM LAYERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C09K13/00</main-classification>
        <further-classification edition="202601120260302B">H10P50/64</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商巴斯夫歐洲公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASF SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅培茲　維拉努維亞　弗朗西斯科　札維爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOPEZ VILLANUEVA, FRANCISCO JAVIER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬爾克斯　馬錫米利安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARX, MAXIMILIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅智暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, CHIH HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克里普　安卓亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLIPP, ANDREAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈美卿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, MEI CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種用於在矽層或具有第二鍺含量之第二矽鍺層之存在下選擇性蝕刻具有第一鍺含量之第一矽鍺層之組成物，其中第一鍺含量高於第二鍺含量，該組成物包含：  &lt;br/&gt;（a）0.1至10 wt%之氧化劑，其中氧化劑為過氧化物；  &lt;br/&gt;（b）1至14 wt%之包含氟化物離子源之蝕刻劑；  &lt;br/&gt;（c）0.0005至4 wt%之Si保護劑  &lt;br/&gt;（d）0 wt%或0.001至3 wt%之SiO&lt;sub&gt;x&lt;/sub&gt;保護劑；及  &lt;br/&gt;（e）水。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a composition for selectively etching a first silicon germanium layer having a first germanium content in the presence of a silicon layer or a second silicon germanium layer having a second germanium content, wherein the first germanium content is higher than the second germanium content, the composition comprising: &lt;br/&gt;(a) 0.1 to 10 % by weight of an oxidizing agent, wherein the oxidizing agent is a peroxide; &lt;br/&gt;(b) 1 to 14 % by weight of an etchant comprising a source of fluoride ions; &lt;br/&gt;(c) 0.0005 to 4 % by weight of an Si protecting agent &lt;br/&gt;(d) 0 % or 0.001 to 3 % by weight of an SiO&lt;sub&gt;x&lt;/sub&gt; protecting agent; and &lt;br/&gt;(e) water.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1041" publication-number="202624486">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624486</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127747</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有經改良之穩定性的三股螺旋結構核酸分子及其用途</chinese-title>
        <english-title>A TRIPLE HELIX STRUCTURED NUCLEIC ACID MOLECULE WITH IMPROVED STABILITY AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260304B">C12N15/113</main-classification>
        <further-classification edition="200601120260304B">C12N15/67</further-classification>
        <further-classification edition="200601120260304B">A61K31/7105</further-classification>
        <further-classification edition="200601120260304B">A61K48/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商綠十字股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GREEN CROSS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李潤錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YOON SUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>禹志受</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOO, JISU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭在成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, JAESUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金聖根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNG GEUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金成喆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SEONGCHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔志先</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, JISUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金岷奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MINKYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關一種在活體內或生物樣本中表現出延長的結構穩定性的經修飾之mRNA分子。本發明藉由探索可使poly(A)尾之腺嘌呤鹼基形成胡斯坦(Hoogsteen)三股螺旋的富含U之環區的最佳結構以及優化三股螺旋形成之位置的主幹區結構，而最大化對poly(A)尾的保護作用，並穩健地維持其作為遺傳物質的生物功能。因此，本發明可用於經由最佳的mRNA分子構築體而穩定地產生治療上有效量之目標蛋白質，使得在活體內及活體外皆能有效表現該蛋白質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a modified mRNA molecule that exhibits prolonged structural stability &lt;i&gt;in vivo&lt;/i&gt; or in a biological sample. The present invention maximizes the protective effect on the poly(A) tail and robustly maintains its biological function as genetic material by exploring the optimal structure of a U-rich loop region with which the adenine bases of the poly(A) tail can form Hoogsteen triple helices, as well as the structure of a stem region that optimizes the position of triple helix formation. Accordingly, the present invention may be useful for stably producing therapeutically effective amounts of a target protein via optimal mRNA molecular constructs that allow for efficient expression of the protein &lt;i&gt;in vivo&lt;/i&gt;and &lt;i&gt;in vitro&lt;/i&gt;.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1042" publication-number="202623979">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623979</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127748</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於處理苯乙烯-丙烯腈的方法和處理設備</chinese-title>
        <english-title>METHOD AND PROCESSING FACILITY FOR PROCESSING STYRENE ACRYLONITRILE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">B29B7/72</main-classification>
        <further-classification edition="200601120260306B">B29B7/48</further-classification>
        <further-classification edition="200601120260306B">B29B7/84</further-classification>
        <further-classification edition="200601120260306B">B29B13/06</further-classification>
        <further-classification edition="200601120260306B">C08F6/14</further-classification>
        <further-classification edition="200601120260306B">C08L25/12</further-classification>
        <further-classification edition="200601120260306B">C08J3/00</further-classification>
        <further-classification edition="200601320260306B">B29K25/00</further-classification>
        <further-classification edition="200601320260306B">B29K55/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商科倍隆公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COPERION GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷納　法蘭克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LECHNER, FRANK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝瑟　奧利華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEISER, OLIVER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及用於處理苯乙烯-丙烯腈的方法和處理設備。該處理設備包括：處理螺桿機(4)，用於處理脫水後的橡膠(7)和苯乙烯-丙烯腈；脫水螺桿機(2)，用於對濕橡膠(6)進行脫水並且用於提供該脫水後的橡膠(7)；和送入裝置(3)，用於將該脫水後的橡膠(7)送入該至少一個處理螺桿機(4)。由於脫水和處理在機械技術上是分開的，因此能夠實現簡單靈活且高效的處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A processing facility (1) comprises a processing screw machine (4) for processing&lt;br/&gt; dewatered rubber (7) and styrene acrylonitrile, a dewatering screw&lt;br/&gt; 5 machine (2) for dewatering wet rubber (6) and providing the dewatered&lt;br/&gt; rubber (7), and a feed device (3) for feeding the dewatered rubber (7) into&lt;br/&gt; the processing screw machine (4). Because the dewatering and the processing&lt;br/&gt; are mechanically decoupled, simple, flexible and efficient processing&lt;br/&gt; can be achieved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:處理設備</p>
        <p type="p">2:脫水螺桿機</p>
        <p type="p">3:第一送入裝置</p>
        <p type="p">4:螺杆机；處理螺桿機；第一處理螺桿機；送入處理螺桿機</p>
        <p type="p">6:濕橡膠</p>
        <p type="p">7:橡膠；脫水後的橡膠</p>
        <p type="p">8:殼體</p>
        <p type="p">10:殼體孔</p>
        <p type="p">11:第一輸送方向；輸送方向</p>
        <p type="p">12:殼體部分；第一殼體部分</p>
        <p type="p">13至17:殼體部分</p>
        <p type="p">18:排出板</p>
        <p type="p">19:排出口</p>
        <p type="p">20:送入口</p>
        <p type="p">21:送入料斗</p>
        <p type="p">23:脫水軸</p>
        <p type="p">25:旋轉軸線</p>
        <p type="p">26:電動驅動電機</p>
        <p type="p">27:聯軸器</p>
        <p type="p">28:分支齒輪箱</p>
        <p type="p">29:進料區</p>
        <p type="p">30:脫水區；第一脫水區</p>
        <p type="p">31:脫水區；第二脫水區</p>
        <p type="p">32:排出區</p>
        <p type="p">33':輸送元件</p>
        <p type="p">34':捏合元件</p>
        <p type="p">35':阻流元件</p>
        <p type="p">36:第一脫水口</p>
        <p type="p">38':捏合元件</p>
        <p type="p">39':阻流元件</p>
        <p type="p">40:第二脫水口</p>
        <p type="p">42':輸送元件</p>
        <p type="p">43:送入管道</p>
        <p type="p">44:殼體；長度L&lt;sub&gt;E&lt;/sub&gt;</p>
        <p type="p">45,46:殼體孔</p>
        <p type="p">47:兩個處理元件軸；處理元件軸</p>
        <p type="p">48:處理元件軸</p>
        <p type="p">49,50:旋轉軸線</p>
        <p type="p">54:殼體部分</p>
        <p type="p">63:第二輸送方向；輸送方向</p>
        <p type="p">73:第一送入口</p>
        <p type="p">T&lt;sub&gt;K&lt;/sub&gt;:温度</p>
        <p type="p">D&lt;sub&gt;A&lt;/sub&gt;,D&lt;sub&gt;E&lt;/sub&gt;:外徑；比率</p>
        <p type="p">d&lt;sub&gt;A&lt;/sub&gt;,d&lt;sub&gt;E&lt;/sub&gt;:內徑；比率</p>
        <p type="p">n&lt;sub&gt;E&lt;/sub&gt;:轉速</p>
        <p type="p">L&lt;sub&gt;E&lt;/sub&gt;:長度；比率</p>
        <p type="p">W&lt;sub&gt;1&lt;/sub&gt;:第一含水量</p>
        <p type="p">W&lt;sub&gt;2&lt;/sub&gt;:第二含水量</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1043" publication-number="202625344">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625344</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127754</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>CLLC諧振轉換器的控制方法</chinese-title>
        <english-title>CONTROL METHOD OF CLLC RESONANT CONVERTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">H02M1/08</main-classification>
        <further-classification edition="200601120260305B">H02M7/75</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商光寶科技新加坡私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITE-ON SINGAPORE PTE LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南洋理工大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYANG TECHNOLOGICAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肖子衡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIAO, ZIHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐燚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENG, FEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, ZHIGANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　菁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳世明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHIH-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　翊勤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, YI CHYN CASSANDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種CLLC諧振轉換器的控制方法，包括：當在操作模式的半橋-全橋模式中啟動第一軟變形時，在轉換區間中調整第一全橋逆變器的交流端子的跨壓以調整第一諧振電容器的跨壓；當在操作模式的全橋-半橋模式中啟動第一軟變形時，在轉換區間中調整第二全橋逆變器的交流端子的跨壓以調整第二諧振電容器的跨壓；以及當在半橋-全橋模式和全橋-全橋模式之間啟動第二軟變形時，在轉換區間中調整第一全橋逆變器和第二全橋逆變器的交流端子的跨壓以增加第一諧振電容器和第二諧振電容器的跨壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A control method of a CLLC resonant converter is provided. The control method includes: when a first soft-morphing is activated in a HB-FB mode of the operating modes, adjusting a voltage across ac terminals of the first FB inverter to adjust the voltage across the first resonant capacitor in transition intervals; when the first soft-morphing is activated in a FB-HB mode of the operating modes, adjusting a voltage across ac terminals of the second FB inverter to adjust a voltage across the second resonant capacitor in the transition intervals; and when a second soft-morphing is activated between the HB-FB mode and the FB-FB mode, adjusting the voltages across ac terminals of the first FB inverter and the second FB inverter to increase the voltages across the first resonant capacitor and the second resonant capacitor in the transition intervals.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100、S110、S120:方法步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1044" publication-number="202624353">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624353</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127778</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體元件之製造方法及半導體元件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08G73/12</main-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/027</further-classification>
        <further-classification edition="200601120260302B">G03F7/038</further-classification>
        <further-classification edition="200601120260302B">G03F7/16</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="200601120260302B">G03F7/32</further-classification>
        <further-classification edition="200601120260302B">B32B15/08</further-classification>
        <further-classification edition="200601120260302B">B32B27/28</further-classification>
        <further-classification edition="202601120260302B">H10P14/68</further-classification>
        <further-classification edition="202601120260302B">H10W70/05</further-classification>
        <further-classification edition="202601120260302B">H10W74/47</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浅川大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAKAWA, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種樹脂組成物、將上述樹脂組成物硬化而成的硬化物、包含上述硬化物之積層體、上述硬化物之製造方法、上述積層體之製造方法、包括上述硬化物之製造方法之半導體元件之製造方法及包含上述硬化物之半導體元件，該樹脂組成物含有具有式（P-1）所表示之重複單元之樹脂，式中，X&lt;sup&gt;1&lt;/sup&gt;表示4價連結基，Y&lt;sup&gt;1&lt;/sup&gt;表示2價連結基，X&lt;sup&gt;1&lt;/sup&gt;及Y&lt;sup&gt;1&lt;/sup&gt;中的至少一者包含特定結構，A&lt;sup&gt;1&lt;/sup&gt;及A&lt;sup&gt;2&lt;/sup&gt;分別獨立地為-O-、-S-或-NR&lt;sup&gt;N&lt;/sup&gt;-，R&lt;sup&gt;N&lt;/sup&gt;為有機基，R&lt;sup&gt;1&lt;/sup&gt;及R&lt;sup&gt;2&lt;/sup&gt;分別獨立地為1價有機基。  &lt;br/&gt;&lt;img align="absmiddle" height="150px" width="249px" file="ed10076.JPG" alt="ed10076.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1045" publication-number="202624347">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624347</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127833</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>改質馬來醯亞胺樹脂溶液的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">C08G73/10</main-classification>
        <further-classification edition="200601120260304B">B32B27/34</further-classification>
        <further-classification edition="200601120260304B">C08J5/18</further-classification>
        <further-classification edition="200601120260304B">C08J5/24</further-classification>
        <further-classification edition="200601120260304B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村田裕太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURATA, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大橋健一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHHASHI, KENICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴華子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YORI, HANAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂井和永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAI, KAZUNAGA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>船川修司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUNAKAWA, SHUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種改質馬來醯亞胺樹脂溶液的製造方法、使用藉由該製造方法所製成之改質馬來醯亞胺樹脂溶液之樹脂組成物的製造方法、預浸體的製造方法、積層板的製造方法、樹脂膜的製造方法、印刷線路板的製造方法及半導體封裝體的製造方法，該改質馬來醯亞胺樹脂溶液的製造方法使下述成分在有機溶劑中進行反應：(A)酸價為3.50 mg KOH/g以上、具有2個以上的N-取代馬來醯亞胺基之馬來醯亞胺樹脂；(B)具有2個以上的一級胺基之胺化合物；(C)具有酸性取代基之單胺化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1046" publication-number="202624644">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624644</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127842</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>密封總成</chinese-title>
        <english-title>SEAL ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260310B">F16J15/18</main-classification>
        <further-classification edition="200601120260310B">F25B9/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾德華真空有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EDWARDS VACUUM LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯札雷克　傑拉德　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SZAREK, GERARD M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示用於一低溫冷卻器之一置換器(displacer)之密封總成，其包括一第一環形元件及至少一個單獨第二環形元件。其中，各環形元件包括一第一軸向表面及一相對第二軸向表面、接納該置換器之一置換器主體之一中心開口、及提供與該置換器之一外殼接觸之一密封表面之一徑向外表面。該第一環形元件之該第二軸向表面與該第二環形元件之該第一軸向表面直接接觸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Seal assembly for a displacer of a cryo-cooler, comprising a first ring element and at least one separate second ring element. Therein, each ring element comprise a first axial surface and an opposite second axial surface, a central opening to receive a displacer body of the displacer, and a radial outer surface to provide a seal surface in contact with a housing of the displacer. The second axial surface of the first ring element is in direct contact with the first axial surface of the second ring element.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:密封總成</p>
        <p type="p">12:第一環形元件</p>
        <p type="p">14:第二環形元件</p>
        <p type="p">16:間隙</p>
        <p type="p">18:間隙</p>
        <p type="p">44A:定向特徵</p>
        <p type="p">44B:定向特徵</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1047" publication-number="202623949">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623949</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127856</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在渦流監測中使用訊號極小值</chinese-title>
        <english-title>USING SIGNAL MINIMA IN EDDY CURRENT MONITORING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260311B">B24B37/013</main-classification>
        <further-classification edition="201201120260311B">B24B37/10</further-classification>
        <further-classification edition="201201120260311B">B24B37/34</further-classification>
        <further-classification edition="200601120260311B">B24B49/02</further-classification>
        <further-classification edition="200601120260311B">B24B49/10</further-classification>
        <further-classification edition="202601120260311B">H10P52/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許　昆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　哈利Ｑ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HARRY Q.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錢　駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIAN, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希賈許　派翠克Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIGASHI, PATRICK A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑瑞安　班傑明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHERIAN, BENJAMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張朕瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHEN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在拋光背側導電層的過程中，現場渦流監測系統的感測器會反覆掃過基板，使得每次感測器的掃描產生各自的訊號跡線，該訊號跡線包含一系列的訊號值。對於每個各自的訊號跡線，訊號值的序列會轉換為相應的厚度跡線，該厚度跡線包含基板上不同位置的厚度值序列，從而生成一系列的厚度跡線。對於該系列厚度跡線中的每個各自厚度跡線，識別出相應厚度跡線中的複數個極小值。根據該系列厚度跡線的各自跡線中的複數個極小值計算出一系列隨時間變化的層厚度值。導電通孔穿過基板的半導體晶圓，以便將背側導電層電連接至前側導電層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">During polishing of a backside conductive layer, a sensor of an in-situ eddy current monitoring system is repeatedly swept across the substrate so that each respective sweep of the sensor generates a respective signal trace that includes a sequence of signal values. For each respective signal trace, the sequence of signal values is converted to a corresponding thickness trace that includes sequence of thickness values for different locations on the substrate, thus generating a sequence of thickness traces. For each respective thickness trace in the sequence of thickness traces, a plurality of minima in the respective thickness trace are identified. A sequence of layer thickness values over time is calculated based on the plurality of minima from the respective traces in the sequence of thickness traces. Conductive vias extend through the semiconductor wafer of the substrate to electrically connect the backside conductive layer to a front-side conductive layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">32:背襯層</p>
        <p type="p">50:針腳/磁場</p>
        <p type="p">100:基板</p>
        <p type="p">102:晶圓</p>
        <p type="p">104:前側表面</p>
        <p type="p">106:背側表面</p>
        <p type="p">108:金屬層/前側層</p>
        <p type="p">110:半導體晶圓</p>
        <p type="p">112:介電層</p>
        <p type="p">114:導電通孔</p>
        <p type="p">116:導電通孔</p>
        <p type="p">120:背側導電層</p>
        <p type="p">M1:金屬層</p>
        <p type="p">M2:金屬層</p>
        <p type="p">T:差值</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1048" publication-number="202625706">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625706</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127874</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>蝕刻方法、半導體裝置的製造方法、及蝕刻裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P50/24</main-classification>
        <further-classification edition="202601120260302B">H10P58/00</further-classification>
        <further-classification edition="200601120260302B">C23F1/24</further-classification>
        <further-classification edition="200601120260302B">C09K13/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤寛暢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, HIRONOBU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤勇介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松永健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUNAGA, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之一實施形態中，提供一種使用於觸媒之HF氣體的蝕刻方法。  &lt;br/&gt;　　實施形態相關的蝕刻方法係包含：在以矽作為主成分的基板上設置觸媒層之步驟；使設置有觸媒層之基板曝露於HF氣體環境之步驟；及對在HF氣體環境中的基板照射光，並蝕刻接觸於觸媒層的基板之步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1049" publication-number="202624542">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624542</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127907</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>組合物、藉由使用其處理含金屬層的方法及藉由使用其製造半導體裝置的方法</chinese-title>
        <english-title>COMPOSITION, METHOD OF TREATING METAL-CONTAINING LAYER BY USING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C23F1/26</main-classification>
        <further-classification edition="202601120260302B">H10P50/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴仁仙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, INSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜炳俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, BYUNGJOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金聖玟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNGMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金貞兒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JUNGAH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文珠姬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOON, JUHEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>成旼哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNG, MINJAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁師碧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SABYUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李錦喜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KUM HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃圭榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, KYUYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種組合物、藉由使用其處理含金屬層的方法及/或藉由使用其製造半導體裝置的方法。該組合物可包括氧化劑、酸及蝕刻控制劑，其中該蝕刻控制劑可包括至少一種由式1表示之化合物：&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="136px" width="267px" file="ed10029.JPG" alt="ed10029.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。&lt;br/&gt;  在本申請案之說明書中提供式1之描述。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are a composition, a method of treating a metal-containing layer by using the same, and/or a method of manufacturing a semiconductor device by using the same. The composition may include an oxidizing agent, an acid, and an etching controller, wherein the etching controller may include at least one compound represented by Formula 1:&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="128px" width="256px" file="ed10030.JPG" alt="ed10030.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;.&lt;br/&gt; A description of Formula 1 is provided in the specification of the present application.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1050" publication-number="202625523">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625523</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127928</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體封裝用電路基板的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">H05K3/46</main-classification>
        <further-classification edition="202601120260304B">H10W70/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商味之素股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AJINOMOTO CO., INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡崎大地</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAZAKI, DAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小椋一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGURA, ICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供可在半導體晶片搭載面以微細的圖案形成絕緣可靠性良好的導體電路之新穎的半導體封裝用電路基板的製造方法。該製造方法包含：  &lt;br/&gt;　　(X)以該順序實施下述(X1)至(X3)，在附有金屬層的基材上形成在第1主面側具備附有障壁膜的第1導體電路之第1電路基板的步驟：  &lt;br/&gt;　　(X1)在附有金屬層的基材之該金屬層上，形成第1導體電路；  &lt;br/&gt;　　(X2)在形成於前述金屬層上的第1導體電路的表面形成障壁膜而形成附有障壁膜的第1導體電路；及  &lt;br/&gt;　　(X3)以埋入形成於前述金屬層上之附有障壁膜的第1導體電路之方式，以包含硬化性樹脂的樹脂組成物形成樹脂組成物層，並使該樹脂組成物層硬化而形成絕緣層；  &lt;br/&gt;　　(Y)以該順序實施下述(Y1)及(Y2)，形成在第1主面側具備以障壁膜覆蓋的第1導體電路之第1電路基板的步驟：  &lt;br/&gt;　　(Y1)去除附有金屬層的基材，形成具有第1導體電路露出的第1主面之第1電路基板；  &lt;br/&gt;　　(Y2)在露出的第1導體電路的表面形成障壁膜；及  &lt;br/&gt;　　(Z)以使與第1電路基板的第1主面相反側之第2主面與核心電路基板的第1主面相對向之方式，接合核心電路基板與第1電路基板的步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1051" publication-number="202625110">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625110</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127940</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬幣處理裝置及硬幣之排出方法</chinese-title>
        <english-title>COIN PROCESSING DEVICE AND COIN DISCHARGING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260312B">G07D11/16</main-classification>
        <further-classification edition="200601120260312B">G07D1/00</further-classification>
        <further-classification edition="201901120260312B">G07D11/12</further-classification>
        <further-classification edition="201901120260312B">G07D11/18</further-classification>
        <further-classification edition="201901120260312B">G07D11/23</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本金錢機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAPAN CASH MACHINE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>志原開</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIHARA, KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西村文秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMURA, FUMIHIDE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種硬幣處理裝置(100)，其具備：搬運待排出的硬幣(10)用之皮帶(154)、配置於皮帶之側方的上方或下方之硬幣偵測感測器(158Y)、配置於皮帶之側方的上方且藉由上下移動來阻止硬幣(10)的搬運用之第1構件(159R)、配置於皮帶的上方且藉由上下移動而將硬幣(10)推擠到皮帶用之第2構件(159L)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a coin processing device (100) which comprises a belt (154) for transporting coins (10) to be discharged, a coin detection sensor (158Y) arranged above or below the side of the belt, a first component (159R) arranged above the side of the belt and moving up and down to stop the transport of the coins (10), and a second component (159L) arranged above the belt and moving up and down to press the coins (10) against the belt.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:硬幣</p>
        <p type="p">10X:硬幣</p>
        <p type="p">152:下收納單元</p>
        <p type="p">1511:第1收納空間</p>
        <p type="p">1512:第2收納空間</p>
        <p type="p">1513:第3收納空間</p>
        <p type="p">1514:第4收納空間</p>
        <p type="p">153H:水平蓋體</p>
        <p type="p">153V:垂直蓋體</p>
        <p type="p">154:搬運皮帶</p>
        <p type="p">155:處理輥</p>
        <p type="p">159L:銷</p>
        <p type="p">159R:銷</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1052" publication-number="202625111">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625111</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127941</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬幣處理裝置</chinese-title>
        <english-title>COIN PROCESSING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260312B">G07D11/16</main-classification>
        <further-classification edition="200601120260312B">G07D1/00</further-classification>
        <further-classification edition="201901120260312B">G07D11/14</further-classification>
        <further-classification edition="201901120260312B">G07D11/18</further-classification>
        <further-classification edition="201901120260312B">G07D11/23</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本金錢機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAPAN CASH MACHINE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西村文秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMURA, FUMIHIDE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>志原開</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIHARA, KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種硬幣處理裝置(100)，其具備有：用以接收複數個硬幣(10)並一個一個分別間隔地送出之接收處理部(120)；一個一個地接收來自接收處理部的硬幣，判斷硬幣的種類並引導到各個種類的通路之選別部(130)；收納各個種類的硬幣之收納部(150)、用以將從收納部排出的硬幣送出到排出盤(165)用之貯放箱(160)；構成為：透過貯放箱，將被選別部拒收的硬幣排出到排出盤。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a coin processing device (100), which includes a handling section (120) for receiving a plurality of coins (10) and sending them out one by one at intervals, a sorting section (130) for receiving coins one by one from the handling section, determining the type of coin, and guiding them to a path for each type, a storage section (150) for storing coins by type, and a bucket (160) for sending coins discharged from the storage section to a discharge tray (165), and is configured to discharge coins rejected from the sorting section to the discharge tray via the bucket.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:硬幣處理裝置</p>
        <p type="p">102:硬幣投入口</p>
        <p type="p">105:貯放箱蓋體</p>
        <p type="p">107:開關快門</p>
        <p type="p">108:傾斜面</p>
        <p type="p">160:貯放箱</p>
        <p type="p">160X:傾斜面</p>
        <p type="p">165:排出盤體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1053" publication-number="202625112">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625112</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127942</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬幣收納單元、硬幣處理裝置、及輥之更換方法</chinese-title>
        <english-title>COIN STORAGE UNIT, COIN PROCESSING DEVICE, AND ROLLER REPLACEMENT METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260312B">G07D11/16</main-classification>
        <further-classification edition="200601120260312B">G07D1/00</further-classification>
        <further-classification edition="201901120260312B">G07D11/12</further-classification>
        <further-classification edition="201901120260312B">G07D11/18</further-classification>
        <further-classification edition="201901120260312B">G07D11/23</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本金錢機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAPAN CASH MACHINE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>志原開</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIHARA, KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西村文秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMURA, FUMIHIDE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種硬幣收納單元(151)、(152)，其為具備：為各個種類之硬幣(10)設置的複數個收納空間(1511)、(1512)・・・、以及在與複數個收納空間之每一個相對應的複數個排出部之每一個所設置的複數個輥(154)、(154)・・・；且構成為能夠更換複數個輥。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides coin storage units (151), (152) which comprise a plurality of storage spaces (1511), (1512)... provided for each type of coin (10), and a plurality of rollers (154), (154)... provided in each of a plurality of discharge sections corresponding to each of the plurality of storage spaces, and the plurality of rollers are configured to be replaceable.</p>
      </isu-abst>
      <representative-img>
        <p type="p">152:下收納單元</p>
        <p type="p">152U:孔部</p>
        <p type="p">1511:第1收納空間</p>
        <p type="p">1512:第2收納空間</p>
        <p type="p">1513:第3收納空間</p>
        <p type="p">1514:第4收納空間</p>
        <p type="p">155:處理輥</p>
        <p type="p">156:墊片</p>
        <p type="p">176A:齒輪</p>
        <p type="p">176B:傳達齒輪</p>
        <p type="p">176C:皮帶齒輪</p>
        <p type="p">176D:輥齒輪</p>
        <p type="p">177:框架</p>
        <p type="p">177X:突起部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1054" publication-number="202625113">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625113</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127943</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬幣收納單元、硬幣處理裝置、及導引件更換方法</chinese-title>
        <english-title>COIN STORAGE UNIT, COIN PROCESSING DEVICE, AND GUIDE REPLACEMENT METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260312B">G07D11/16</main-classification>
        <further-classification edition="200601120260312B">G07D1/00</further-classification>
        <further-classification edition="201901120260312B">G07D11/10</further-classification>
        <further-classification edition="201901120260312B">G07D11/18</further-classification>
        <further-classification edition="201901120260312B">G07D11/23</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本金錢機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAPAN CASH MACHINE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>志原開</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIHARA, KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西村文秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMURA, FUMIHIDE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種硬幣收納單元(151)、(152)，其為具備：為硬幣(10)的每個種類所設置之複數個收納空間(1511)、(1512)・・・；以及與複數個收納空間之每一個相對應的複數個排出部之每一個設置的複數個寬度調節導引構件(161)、(161)・・・；複數個寬度調節導引構件之各個構成為能夠更換成：符合所對應之硬幣的直徑之尺寸的物件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides coin storage units (151), (152), which comprise a plurality of storage spaces (1511), (1512)... provided for each type of coin (10), and a plurality of width-adjusting guide components (161), (161)... provided in each of a plurality of discharge sections corresponding to each of the plurality of storage spaces, and each of the plurality of width-adjusting guide components is configured to be replaceable with one of a size that matches the diameter of the corresponding coin.</p>
      </isu-abst>
      <representative-img>
        <p type="p">152:下收納單元</p>
        <p type="p">1511:第1收納空間</p>
        <p type="p">1512:第2收納空間</p>
        <p type="p">1513:第3收納空間</p>
        <p type="p">1514:第4收納空間</p>
        <p type="p">161:側面導引塊</p>
        <p type="p">161X:卡止部</p>
        <p type="p">162:頂部導引件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1055" publication-number="202625324">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625324</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127945</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>纜線連接構造、連結電力纜線及纜線連接構造之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">H02G1/14</main-classification>
        <further-classification edition="200601120260202B">H02G15/08</further-classification>
        <further-classification edition="200601120260202B">H01R4/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住電機器股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMIDEN TRANSMISSION AND DISTRIBUTION SYSTEM PRODUCTS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>風間達也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAZAMA, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之纜線連接構造具備：第1電力纜線及第2電力纜線，其等分別自導體之中心軸朝向外周而依序具有導體、纜線內部半導電層、纜線絕緣層及纜線外部半導電層；筒狀之套筒，其將第1電力纜線之導體及第2電力纜線之導體連接；及絕緣單元，其構成為筒狀構件，以覆蓋包含套筒之區域之外周之方式設置，保持套筒之周邊之絕緣性；且第1電力纜線及第2電力纜線之各者具有露出纜線絕緣層之絕緣露出部；絕緣露出部具有滿足式(1)之外周面。1.1≦Raa/Rac≦6…(1)，此處，Raa係導體之軸向上之絕緣露出部之外周面之算術平均粗糙度，單位為μm，Rac係導體之周向上之絕緣露出部之外周面之算術平均粗糙度，單位為μm。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:連結電力纜線</p>
        <p type="p">20:纜線連接構造</p>
        <p type="p">100:電力纜線</p>
        <p type="p">100a:第1電力電纜</p>
        <p type="p">100b:第2電力電纜</p>
        <p type="p">110:導體</p>
        <p type="p">130:纜線絕緣層</p>
        <p type="p">132:絕緣露出部</p>
        <p type="p">135:斜坡部</p>
        <p type="p">140:纜線外部半導電層</p>
        <p type="p">142:外部半導電露出部</p>
        <p type="p">160:纜線鎧裝</p>
        <p type="p">200:套筒</p>
        <p type="p">300:絕緣單元</p>
        <p type="p">320:絕緣單元內部半導電層</p>
        <p type="p">340:絕緣單元絕緣層</p>
        <p type="p">360:絕緣單元外部半導電層</p>
        <p type="p">380:應力錐部</p>
        <p type="p">382:內周面</p>
        <p type="p">IE:最內端</p>
        <p type="p">OE:最外端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1056" publication-number="202623809">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623809</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127946</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用雙環化合物作為骨髓細胞上表現之觸發受體（ＴＲＥＭ２）促效劑的方法</chinese-title>
        <english-title>METHODS OF USING BICYCLIC COMPOUNDS AS TRIGGERING RECEPTOR EXPRESSED ON MYELOID CELLS (TREM2) AGONISTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/5375</main-classification>
        <further-classification edition="200601120260302B">A61K31/519</further-classification>
        <further-classification edition="200601120260302B">A61K31/502</further-classification>
        <further-classification edition="200601120260302B">A61K31/4985</further-classification>
        <further-classification edition="200601120260302B">A61K31/4375</further-classification>
        <further-classification edition="200601120260302B">A61K31/4196</further-classification>
        <further-classification edition="200601120260302B">A61K31/4192</further-classification>
        <further-classification edition="200601120260302B">A61K31/4155</further-classification>
        <further-classification edition="200601120260302B">A61K31/351</further-classification>
        <further-classification edition="200601120260302B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商維佳神經科學有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIGIL NEUROSCIENCE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉賈戈文丹　拉賈辛漢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAJAGOVINDAN, RAJASIMHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐瑪拉　萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>O'MARA, RYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>考夫曼　派翠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAUFMANN, PETRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示提供使用小分子TREM2促效劑或其醫藥學上可接受之鹽治療人類個體之阿茲海默氏病的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides methods of using a small molecule TREM2 agonist or a pharmaceutically acceptable salt thereof to treat Alzheimer's Disease in a human subject.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1057" publication-number="202625333">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625333</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127954</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有可移位軸向感測器的轉子組件</chinese-title>
        <english-title>ROTOR ASSEMBLY WITH DISPLACEABLE AXIAL SENSORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260309B">H02K1/2733</main-classification>
        <further-classification edition="200601120260309B">H02K5/04</further-classification>
        <further-classification edition="200601120260309B">H02K7/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商斯凱孚加拿大有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SKF CANADA LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔梅恩　戴倫　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TREMAINE, DAREN PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈里斯　蒂莫西　安德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARRIS, TIMOTHY ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯特琳姆　翠西　凱瑟琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STREM, TRACY KATHRYN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一轉子組件包括一轉子，該轉子可圍繞一中心部件安置、可與一固持器連接且具有上部及下部軸向端。一定子組件包括一外殼及多個電磁線圈組件，該外殼具有一中心孔，該轉子及該中心部件安置於該孔內，該等電磁線圈組件安置於該外殼內、圍繞該軸線間隔開且經配置以向該轉子施加磁轉矩，使得該轉子圍繞該中心軸線成角度地移位。一或多個致動器經配置以使該定子組件及該轉子相對於該中心部件沿著該中心軸線線性地移位。一感測器組件與該定子外殼連接且包括一軸向位置感測器，該軸向位置感測器與該轉子之該下部軸向端軸向間隔開且經配置以感測該轉子沿著該中心軸線的位置，當該致動器使該定子外殼移位時，該軸向位置感測器可軸向移位。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A rotor assembly includes a rotor disposable around a central member, connectable with a holder and having upper and lower axial ends. A stator assembly includes a housing having a central bore, the rotor and central member being disposed within the bore, and electromagnetic coil assemblies disposed within the housing, spaced around the axis and configured to exert magnetic torque on the rotor such that the rotor angularly displaces about the central axis. One or more actuators are configured to linearly displace the stator assembly and the rotor along the central axis relative to the central member. A sensor assembly is connected with the stator housing and includes an axial position sensor spaced axially from the lower axial end of the rotor and configured to sense the position of the rotor along the central axis, the axial position sensor being displaceable axially when the actuator displaces the stator housing.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2a:環形孔</p>
        <p type="p">3:主框架</p>
        <p type="p">4:台/主框架台</p>
        <p type="p">4a:中心孔</p>
        <p type="p">5:支撐柱</p>
        <p type="p">6:內圓柱形主體/內主體</p>
        <p type="p">7:外圓柱形側壁/外側壁</p>
        <p type="p">8:環形底壁</p>
        <p type="p">9:徑向支撐表面</p>
        <p type="p">10:轉子組件</p>
        <p type="p">12:環形轉子</p>
        <p type="p">12a:上部軸向端</p>
        <p type="p">12b:下部軸向端</p>
        <p type="p">14:定子組件</p>
        <p type="p">16:提昇致動器</p>
        <p type="p">18:感測器組件</p>
        <p type="p">20:外殼</p>
        <p type="p">21:中心孔</p>
        <p type="p">30:環形下部底板</p>
        <p type="p">32:環形上部底板</p>
        <p type="p">34:圓柱形外側壁</p>
        <p type="p">40:電力驅動馬達</p>
        <p type="p">42:動力螺桿</p>
        <p type="p">44:螺母塊</p>
        <p type="p">A&lt;sub&gt;C&lt;/sub&gt;:中心軸線</p>
        <p type="p">M:處理機</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1058" publication-number="202625247">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625247</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127995</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於半導體製造設施之廢氣處理設備</chinese-title>
        <english-title>EXHAUST GAS TREATMENT EQUIPMENT FOR SEMICONDUCTOR MANUFACTURING FACILITY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">H01J37/32</main-classification>
        <further-classification edition="200601120260202B">B01D53/70</further-classification>
        <further-classification edition="200601120260202B">B01D53/74</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＯＴ　ＣＥＳ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOT CES CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裵辰鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE, JIN HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金旻材</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MIN JAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李侑珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YU JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金亨俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HYUNG JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明，提供一種用於半導體製造設施之廢氣處理設備，其作為處理從半導體製程腔室排出的廢氣的設備，其中係在半導體製程腔室中執行使用製程氣體的半導體製造製程，且藉由使用真空幫浦使廢氣流動而通過連接半導體製程腔室至真空幫浦之腔室排氣管路以及從該真空幫浦之出口延伸出之幫浦排氣管路，廢氣處理設備包含：使用電漿來處理自真空幫浦排出的廢氣之排氣管路下游電漿處理單元，其中排氣管路下游電漿處理單元包含：幫浦排氣管路電漿反應器，其連接至幫浦排氣管路並對廢氣進行電漿反應；以及幫浦排氣管路反應器電源供應單元，其將電源供應至幫浦排氣管路電漿反應器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">According to the present invention, there is provided exhaust gas treatment equipment for a semiconductor manufacturing facility, as equipment that treats an exhaust gas discharged from a semiconductor process chamber in which a semiconductor manufacturing process using a process gas is to be performed, through a chamber exhaust pipe connecting the semiconductor process chamber and a vacuum pump and a pump exhaust pipe extending from an outlet of the vacuum pump by the vacuum pump, the exhaust gas treatment equipment including an exhaust pipe downstream plasma treatment unit that treats the exhaust gas discharged from the vacuum pump using plasma, wherein the exhaust pipe downstream plasma treatment unit includes a pump exhaust pipe plasma reactor that is connected to the pump exhaust pipe and causes a plasma reaction with respect to the exhaust gas, and a pump exhaust pipe reactor power supply unit supplying power to the pump exhaust pipe plasma reactor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體製造設施</p>
        <p type="p">101:半導體製造設備</p>
        <p type="p">102:半導體製程腔室</p>
        <p type="p">103:氣體淨化設備</p>
        <p type="p">104:洗滌器</p>
        <p type="p">105:排氣設備</p>
        <p type="p">106:真空幫浦</p>
        <p type="p">107:腔室排氣管路</p>
        <p type="p">108:幫浦排氣管路</p>
        <p type="p">109:腔室排氣管路電漿處理單元</p>
        <p type="p">110:腔室排氣管路電漿反應器</p>
        <p type="p">145:腔室排氣管路反應器電源供應單元</p>
        <p type="p">147:排氣管路電漿來源氣體供應器</p>
        <p type="p">148:粉末收集阱</p>
        <p type="p">150:遠端電漿反應器</p>
        <p type="p">150a:遠端電漿處理單元</p>
        <p type="p">180:遠端反應器電源供應單元</p>
        <p type="p">186:氣體入口管路</p>
        <p type="p">187:排放管路</p>
        <p type="p">188:遠端電漿來源氣體供應器</p>
        <p type="p">190:幫浦排氣管路電漿處理單元</p>
        <p type="p">191:幫浦排氣管路電漿反應器</p>
        <p type="p">197:幫浦排氣管路反應器電源供應單元</p>
        <p type="p">198:監測單元</p>
        <p type="p">199:控制器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1059" publication-number="202624265">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624265</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128018</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療結腸直腸癌之組合療法</chinese-title>
        <english-title>COMBINATION THERAPIES FOR THE TREATMENT OF COLORECTAL CANCER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07K16/28</main-classification>
        <further-classification edition="200601120260302B">A61K39/395</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商健生生物科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANSSEN BIOTECH, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史內普　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHNEPP, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩澤遼太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWASAWA, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示（例如，在第二線情況下）用雙特異性抗EGFR/c-Met抗體及FOLFIRI治療轉移性結腸直腸癌之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are methods of treating metastatic colorectal cancer (e.g., in the second-line setting) with a bispecific anti-EGFR/c-Met antibody and FOLFIRI.&lt;b&gt;  &lt;/b&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1060" publication-number="202625355">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625355</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128042</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電源轉換電路及其控制方法</chinese-title>
        <english-title>POWER CONVERSION CIRCUIT AND CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250801B">H02M3/335</main-classification>
        <further-classification edition="200701120250801B">H02M1/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立錡科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHTEK TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林梓誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TZU-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊大勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, TA-YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電源轉換電路，包括變壓器、諧振電容、上橋電晶體、下橋電晶體、輔助電容、輔助開關以及控制電路。變壓器包括初級線圈以及次級線圈，其中初級線圈耦接於切換節點以及諧振節點之間。諧振電容耦接於諧振節點以及接地端之間。上橋電晶體將輸入電壓提供至切換節點，下橋電晶體將切換節點耦接至接地端。輔助電容耦接至諧振節點。輔助開關耦接於輔助電容以及接地端之間。控制電路驅動上橋電晶體以及下橋電晶體，且基於流經諧振電容之電流而導通輔助開關，使得輔助電容與諧振電容並聯。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power conversion circuit includes a transformer, a resonant capacitor, a high-side transistor, a low-side transistor, an auxiliary capacitor, an auxiliary switch, and a control circuit. The transformer includes a primary coil coupled between a switch node and a resonant node and a secondary coil. The resonant capacitor is coupled between the resonant node and a ground. The high-side transistor provides an input voltage to the switch node, and the low-side transistor couples the switch node to the ground. The auxiliary capacitor is coupled to the resonant node. The auxiliary switch is coupled between the auxiliary capacitor and the ground. The control circuit drives the high-side transistor and the low-side transistor, and turns on the auxiliary switch based on a current flowing through the resonant capacitor, so that the auxiliary capacitor is coupled in parallel with the resonant capacitor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:電源轉換電路</p>
        <p type="p">111:上橋電晶體</p>
        <p type="p">111D:上橋寄生二極體</p>
        <p type="p">112:下橋電晶體</p>
        <p type="p">112D:下橋寄生二極體</p>
        <p type="p">120:整流電路</p>
        <p type="p">130:次級控制電路</p>
        <p type="p">140:控制電路</p>
        <p type="p">150:位準移位電路</p>
        <p type="p">CR:諧振電容</p>
        <p type="p">TM:變壓器</p>
        <p type="p">PD:光耦合元件</p>
        <p type="p">HSD:上橋驅動電路</p>
        <p type="p">LSD:下橋驅動電路</p>
        <p type="p">HSG:上橋閘極驅動信號</p>
        <p type="p">LSG:下橋閘極驅動信號</p>
        <p type="p">VIN:輸入電壓</p>
        <p type="p">SW:切換節點</p>
        <p type="p">NR:諧振節點</p>
        <p type="p">VCR:諧振電壓</p>
        <p type="p">PS:初級線圈</p>
        <p type="p">SS:次級線圈</p>
        <p type="p">IOUT:輸出電流</p>
        <p type="p">IP:初級電流</p>
        <p type="p">VOUT:輸出電壓</p>
        <p type="p">TR:整流電晶體</p>
        <p type="p">COUT:輸出電容</p>
        <p type="p">VD:汲極電壓</p>
        <p type="p">DR:整流寄生二極體</p>
        <p type="p">IFB:回授電流</p>
        <p type="p">SG:閘極信號</p>
        <p type="p">VFB:回授電壓</p>
        <p type="p">SH:上橋驅動信號</p>
        <p type="p">SL:下橋驅動信號</p>
        <p type="p">310:電流偵測電路</p>
        <p type="p">CX:輔助電容</p>
        <p type="p">SWX:輔助開關</p>
        <p type="p">CS:電流偵測信號</p>
        <p type="p">C1:第一電容</p>
        <p type="p">R1:第一電阻</p>
        <p type="p">NX:輔助節點</p>
        <p type="p">SX:輔助信號</p>
        <p type="p">SWXD:輔助寄生二極體</p>
        <p type="p">VCX:輔助電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1061" publication-number="202624382">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624382</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128043</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無機微粒子分散液</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">C08K9/06</main-classification>
        <further-classification edition="200601120260305B">C08K3/22</further-classification>
        <further-classification edition="200601120260305B">C01G25/02</further-classification>
        <further-classification edition="200601120260305B">C01G23/04</further-classification>
        <further-classification edition="200601120260305B">C08L101/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商長瀨化成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGASE CHEMTEX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松村祐美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMURA, YUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>折口和希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORIGUCHI, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠製作壓印（imprint）性優異，且硬化後之耐UV性優異之硬化性樹脂組成物的無機微粒子分散液。本發明係關於一種含有無機微粒子與有機溶劑之無機微粒子分散液，該無機微粒子之平均分散粒徑為50nm以下，且以下述通式（1）所示之烷氧基矽烷化合物1及下述通式（2）所示之烷氧基矽烷化合物2進行過表面處理。  &lt;br/&gt;(R&lt;sup&gt;2&lt;/sup&gt;)&lt;sub&gt;（&lt;/sub&gt;&lt;sub&gt;4&lt;/sub&gt;&lt;sub&gt;－&lt;/sub&gt;&lt;sub&gt;m&lt;/sub&gt;&lt;sub&gt;）&lt;/sub&gt;－Si－（OR&lt;sup&gt;1&lt;/sup&gt;）&lt;sub&gt;m&lt;/sub&gt;　（1）  &lt;br/&gt;[通式（1）中，m表示1～3之整數，R&lt;sup&gt;1&lt;/sup&gt;表示碳數1～3之一價烴基，R&lt;sup&gt;2&lt;/sup&gt;表示碳數1～3之一價烴基。]  &lt;br/&gt;(R&lt;sup&gt;4&lt;/sup&gt;)&lt;sub&gt;（&lt;/sub&gt;&lt;sub&gt;4&lt;/sub&gt;&lt;sub&gt;－&lt;/sub&gt;&lt;sub&gt;n&lt;/sub&gt;&lt;sub&gt;）&lt;/sub&gt;－Si－（OR&lt;sup&gt;3&lt;/sup&gt;）&lt;sub&gt;n&lt;/sub&gt;　（2）  &lt;br/&gt;[通式（2）中，n表示1～3之整數，R&lt;sup&gt;3&lt;/sup&gt;表示碳數1～3之一價烴基，R&lt;sup&gt;4&lt;/sup&gt;表示R&lt;sup&gt;5&lt;/sup&gt;－（OCHR&lt;sup&gt;6&lt;/sup&gt;CH&lt;sub&gt;2&lt;/sub&gt;）&lt;sub&gt;k&lt;/sub&gt;－OR&lt;sup&gt;7&lt;/sup&gt;、R&lt;sup&gt;5&lt;/sup&gt;－OC（＝O）C（＝CH&lt;sub&gt;2&lt;/sub&gt;）－R&lt;sup&gt;6&lt;/sup&gt;或R&lt;sup&gt;8&lt;/sup&gt;（式中，k表示1～10之整數，R&lt;sup&gt;5&lt;/sup&gt;表示碳數1～20之二價烴基，R&lt;sup&gt;6&lt;/sup&gt;表示H或CH&lt;sub&gt;3&lt;/sub&gt;，R&lt;sup&gt;7&lt;/sup&gt;表示碳數1～20之一價烴基，R&lt;sup&gt;8&lt;/sup&gt;表示碳數4～20之一價烴基）。]</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1062" publication-number="202625694">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625694</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128048</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>防止二維材料薄膜剝離的藥液及其用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P50/00</main-classification>
        <further-classification edition="202601120260302B">H10P50/24</further-classification>
        <further-classification edition="202601120260302B">H10P76/00</further-classification>
        <further-classification edition="202501120260302B">H10D30/01</further-classification>
        <further-classification edition="202501120260302B">H10D30/47</further-classification>
        <further-classification edition="202501120260302B">H10D48/01</further-classification>
        <further-classification edition="202501120260302B">H10D62/80</further-classification>
        <further-classification edition="202501120260302B">H10D62/83</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木文陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, FUMIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀江宏彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORIE, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>島田憲司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMADA, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林郁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於防止二維材料薄膜剝離的藥液及其用途。更詳細而言，本發明關於防止半導體的二維材料薄膜剝離的藥液及其用途。本發明提供：包含選自於由陽離子性界面活性劑、水溶性有機溶劑、及烷胺構成之群組中的至少2種且任意地包含水之用於防止二維材料半導體薄膜剝離的組成物；以及包含接觸二維材料半導體薄膜之用於防止二維材料半導體薄膜剝離的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1063" publication-number="202624239">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624239</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128121</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>有機矽化合物、表面處理劑及樹脂添加劑</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07F7/18</main-classification>
        <further-classification edition="200601120260302B">C08K5/544</further-classification>
        <further-classification edition="200601120260302B">C23C26/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀莉里花</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORI, RIRIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高木一憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAGI, KAZUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣神宗直</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIROKAMI, MUNENAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">下述式(1)所示的有機矽化合物係耐熱性及與金屬表面的接著性優異，可將耐蝕性賦予至金屬表面。  &lt;br/&gt;&lt;img align="absmiddle" height="65px" width="223px" file="ed10018.JPG" alt="ed10018.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　式中，R&lt;sup&gt;1&lt;/sup&gt;各自獨立地表示氫原子、碳數1~10的烷基或碳數6~10的芳基，R&lt;sup&gt;2&lt;/sup&gt;各自獨立地表示碳數1~10的烷基或碳數1~10的芳基，X表示具有含氮雜環的一價基，m為6~10之整數，n為1~3之整數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1064" publication-number="202624544">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624544</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128122</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>防鏽處理劑組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C23F11/14</main-classification>
        <further-classification edition="200601120260302B">C07F7/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀莉里花</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORI, RIRIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高木一憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAGI, KAZUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣神宗直</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIROKAMI, MUNENAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種由包含下述(i)、(ii)或該兩者之水溶液所構成的防鏽處理劑組成物，其係由有機矽化合物之水溶液所構成，是保存安定性良好的組成物。  &lt;br/&gt;　　(i)下述式(1)所示的有機矽化合物及下述式(2)所示的有機矽化合物  &lt;br/&gt;　　(ii)下述式(1)所示的有機矽化合物與下述式(2)所示的有機矽化合物之共縮合物  &lt;br/&gt;&lt;img align="absmiddle" height="142px" width="322px" file="ed10013.JPG" alt="ed10013.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;　　式中，R&lt;sup&gt;1&lt;/sup&gt;各自獨立地表示氫原子、碳數1～10的烷基或碳數6～10的芳基，R&lt;sup&gt;2&lt;/sup&gt;各自獨立地表示碳數1～10的烷基或碳數6～10的芳基，X表示具有含氮雜環的一價基，m各自獨立地為1～20之整數，n各自獨立地為1～3之整數，p為1～10之整數，q為0～5之整數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1065" publication-number="202624359">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624359</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128123</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>有機聚矽氧烷及表面處理劑</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">C08G77/26</main-classification>
        <further-classification edition="200601120260306B">C09K3/00</further-classification>
        <further-classification edition="200601120260306B">C23C26/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀莉里花</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORI, RIRIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高木一憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAGI, KAZUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣神宗直</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIROKAMI, MUNENAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有式(1)所示的構成單元比之有機聚矽氧烷，其耐熱性優異，可將耐蝕性賦予至金屬表面。  &lt;br/&gt;&lt;img align="absmiddle" height="78px" width="613px" file="ed10021.JPG" alt="ed10021.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　R&lt;sup&gt;1&lt;/sup&gt;為氫原子或碳數1～10的1價烴基，R&lt;sup&gt;2&lt;/sup&gt;為-(CH&lt;sub&gt;2&lt;/sub&gt;)&lt;sub&gt;m&lt;/sub&gt;-X(X為具有含氮雜環的一價基，m為1～20之整數)所示的基，R&lt;sup&gt;3&lt;/sup&gt;為氫原子、甲基、乙基、n-丙基、i-丙基或乙醯基，a、b1、b2、c1、c2、d1、d2為滿足0≦a＜1、0≦b1＜1、0＜b2≦1、0≦c1＜1、0≦c2＜1、0≦d1＜1、0≦d2＜1且a+b1+b2+c1+c2+d1+d2=1之數，e為滿足0≦e≦2之數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1066" publication-number="202623931">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623931</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128133</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用摩擦攪拌銲接的傳導冷卻板</chinese-title>
        <english-title>CONDUCTION COOLING PLATE USING FRICTION STIR WELDING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">B23K20/12</main-classification>
        <further-classification edition="200601120260312B">C23C14/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈文達薩米　薩蒂亞穆爾蒂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOVINDASAMY, SATHIYAMURTHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉朱　布里傑什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAJU, BRIJESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕拉尼薩米　蘇雷什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PALANISAMY, SURESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭梅薩　哈里什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENMETHSA, HARISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">於一實施例中，提出一種用於半導體處理的冷卻板組件。冷卻板組件包括一第一板、一第二板、及一中間板。第一板包括一第一表面；一入口，設置於第一表面上；一出口，設置於第一表面上；及一第一通道表面，相反於第一表面。第二板包括一第二表面及一第二通道表面。第二通道表面相反於第二表面。中間板設置於第一板與第二板之間。中間板包括一通道壁，分隔第一通道表面及第二通道表面。第一通道表面、第二通道表面、及通道壁定義從入口到出口的一流動路徑。第一板、第二板、及中間板包括銅。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In one embodiment, a cooling plate assembly for semiconductor processing is provided. The cooling plate assembly includes a first plate, a second plate, and a middle plate. The first plate includes a first surface, an inlet disposed on the first surface, an outlet disposed on the first surface, and a first channel surface disposed opposite the first surface. The second plate includes a second surface, and a second channel surface. The second channel surface is disposed opposite the second surface. The middle plate is disposed between the first plate and the second plate. The middle plate includes a channel wall separating the first channel surface from the second channel surface. The first channel surface, the second channel surface, and the channel wall define a flow path from the inlet to the outlet. The first plate, the second plate, and the middle plate comprise copper.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:冷卻板組件</p>
        <p type="p">301:第一板</p>
        <p type="p">303:第一表面</p>
        <p type="p">305:入口</p>
        <p type="p">307:出口</p>
        <p type="p">309:第一通道表面</p>
        <p type="p">321:第二板</p>
        <p type="p">323:第二表面</p>
        <p type="p">325:第二通道表面</p>
        <p type="p">331:中間板</p>
        <p type="p">333:流動路徑</p>
        <p type="p">335:通道壁</p>
        <p type="p">351:固定孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1067" publication-number="202624266">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624266</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128149</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>靶向前列腺特異性膜抗原（ＰＳＭＡ）與雄激素受體拮抗劑之組合的組成物</chinese-title>
        <english-title>COMPOSITIONS TARGETING PROSTATE-SPECIFIC MEMBRANE ANTIGEN (PSMA) IN COMBINATION WITH ANDROGEN RECEPTOR ANTAGONISTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07K16/28</main-classification>
        <further-classification edition="200601120260302B">A61K39/395</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商亞穆尼克斯製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMUNIX PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>琴　勞倫斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINN, LAWRENCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜布羅夫斯克亞　維多利亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUBROVSKAYA, VIKTORIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費里曼　傑瑞米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FREEMAN, JEREMY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>約翰森　艾瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOHANSEN, ERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樂葛蘭德　法特瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEGRAND, FATEMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　奕良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, LUCAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥肯　達拉格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACCANN, DARRAGH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝倫伯格　沃爾克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHELLENBERGER, VOLKER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜　彌爾頓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TO, MILTON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游　韋樂汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEUNG, VALENTINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李允中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文尤其提供治療對象之前列腺癌的方法，其係藉由向該對象投予包含以下之組合來進行：i)靶向PSMA及CD3之嵌合多肽，及ii)雄激素受體拮抗劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are, &lt;i&gt;inter alia&lt;/i&gt;, methods of treating prostate cancer in a subject by administering to the subject a combination comprising i) a chimeric polypeptide targeting PSMA and CD3, and ii) an androgen receptor antagonist.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1068" publication-number="202624909">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624909</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128169</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>缺陷候選檢測裝置</chinese-title>
        <english-title>DEFECT CANDIDATE DETECTION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">G05B23/02</main-classification>
        <further-classification edition="200601120260311B">G05B19/418</further-classification>
        <further-classification edition="202601120260311B">H10P74/00</further-classification>
        <further-classification edition="202301120260311B">G06N5/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, WOOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭至媛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, JIWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種缺陷候選檢測裝置可包括經組態以執行電腦程式指令的處理器，處理器包括：良率預測模型，經組態以接收複數個製程資料並基於複數個製程資料產生指示晶圓的預測良率的預測良率資料，良率預測模型分析電路，經組態以基於複數個製程資料和預測良率資料產生良率貢獻資料，其中良率貢獻資料指示複數個製程資料中的每一者對晶圓的良率的影響程度，以及缺陷致因檢測電路，經組態以基於複數個製程資料和良率貢獻資料在複數個製程資料中檢測缺陷候選資料並經組態以基於缺陷候選資料選擇性地控制製程設備。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A defect candidate detection device may include a processor configured to execute computer program instructions, the processor including: a yield prediction model configured to receive a plurality of process data and generate a predicted yield data indicating a predicted yield of a wafer based on the plurality of process data, a yield prediction model analysis circuit configured to generate a yield contribution data based on the plurality of process data and the predicted yield data, wherein the yield contribution data indicates a degree of influence on a yield of the wafer by each of the plurality of process data, and a defect-causing factor detection circuit that is configured to detect a defect candidate data among the plurality of process data based on the plurality of process data and the yield contribution data and is configured to selectively control a process facility based on the defect candidate data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10、10_2、10_n:製程設備</p>
        <p type="p">10_1:第一製程設備、製程設備</p>
        <p type="p">20:缺陷候選檢測裝置</p>
        <p type="p">30:缺陷候選檢測系統</p>
        <p type="p">EQU_DATA、EQU_DATA1、EQU_DATA2、EQU_DATAn:製程資料</p>
        <p type="p">DEF_CAN:缺陷候選資料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1069" publication-number="202625607">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625607</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128174</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250902B">H10D64/27</main-classification>
        <further-classification edition="202501120250902B">H10D62/17</further-classification>
        <further-classification edition="202501120250902B">H10D30/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李正薰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JEONGHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭秀眞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, SOOJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜明吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, MYUNG GIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權旭炫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, WOOKHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金範哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, BUMCHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安賢珉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHN, HYUNMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪炳鶴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, BYOUNG HAK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置可包括包含第一區和第二區的基底、第一區上的第一裝置以及第二區上的第二裝置。第一裝置可包括第一通道層、第一內部閘極電極、第一源極/汲極區以及第一內部間隔件。第二裝置可包括第二通道層、第二內部閘極電極、第二源極/汲極區以及第二內部間隔件。第一內部閘極電極在平行於基底的表面的第二方向上的長度可短於第二內部閘極電極在第二方向上的長度。第二內部間隔件在第二方向上的長度可短於第一內部間隔件在第二方向上的長度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device may include a substrate including a first area and a second area, a first device on the first area, and a second device on the second area. The first device may include a first channel layer, a first inner gate electrode, a first source/drain area, and a first inner spacer. The second device may include a second channel layer, a second inner gate electrode, a second source/drain area, and a second inner spacer. A length of the first inner gate electrode in a second direction parallel to a surface of the substrate may be shorter than a length of the second inner gate electrode in the second direction. A length of the second inner spacer in the second direction may be shorter than a length of the first inner spacer in the second direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體裝置</p>
        <p type="p">100:基底</p>
        <p type="p">120-1:第一閘極電極</p>
        <p type="p">120-1I:第一內部閘極電極/內部閘極電極</p>
        <p type="p">120-1O:第一外部閘極電極</p>
        <p type="p">130-1:第一源極/汲極區</p>
        <p type="p">140-1:第一通道層</p>
        <p type="p">150:層間絕緣膜</p>
        <p type="p">AP1:第一主動圖案</p>
        <p type="p">AR1:第一區</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">GD_1:第一閘極絕緣膜</p>
        <p type="p">GP_1:第一閘極頂蓋膜</p>
        <p type="p">IFL_1:第一界面膜</p>
        <p type="p">IGS_1:第一內部間隔件</p>
        <p type="p">L&lt;sub&gt;120-1I&lt;/sub&gt;、L&lt;sub&gt;120-1O&lt;/sub&gt;、L&lt;sub&gt;IGS_1&lt;/sub&gt;:長度</p>
        <p type="p">TR1:第一裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1070" publication-number="202624442">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624442</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128237</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學零件接著用組成物、硬化物、及光纖陣列</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">C09J183/04</main-classification>
        <further-classification edition="200601120260304B">C09J11/06</further-classification>
        <further-classification edition="200601120260304B">G02B6/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商納美仕股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAMICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口喬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梶原雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAJIWARA, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種提供耐黃變性優異的硬化物的光學零件接著用組成物。另外，提供一種藉由耐黃變性優異而具有良好的外觀的硬化物、及包括其的光纖陣列。一種光學零件接著用組成物，包含：具有反應性官能基的矽氧烷化合物（A）、聚合起始劑（B）、填充材（C）、及抗氧化劑（D）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光纖陣列</p>
        <p type="p">10:光纖</p>
        <p type="p">20:接著劑層</p>
        <p type="p">31:基板</p>
        <p type="p">32:光波導</p>
        <p type="p">33:V槽(槽部)</p>
        <p type="p">40:壓板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1071" publication-number="202624718">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624718</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128259</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>信號處理方法、資訊處理裝置、光學同調斷層掃描裝置及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G01N21/17</main-classification>
        <further-classification edition="201401120260302B">G01N21/35</further-classification>
        <further-classification edition="200601120260302B">G01B9/00</further-classification>
        <further-classification edition="200601120260302B">G01B11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大金工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIKIN INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北村広喜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAMURA, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>能美政男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOMI, MASAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種獲得擴散度強的界面的形狀的技術。 本信號處理方法是由具有控制部的資訊處理裝置執行的信號處理方法，其中，上述控制部輸入藉由光學同調斷層掃描法得到的光學相干斷層信號，在上述光學相干斷層信號中，確定在包含一個或複數個層的第一層組與包含一個或複數個層的第二層組之間的第一界面、 以及上述第二層組與包含一個或複數個層的第三層組之間的第二界面之中僅與上述第二界面對應的目標信號區域，輸出與基於上述目標信號區域而獲取的上述第二界面的形狀有關的資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:資訊處理裝置</p>
        <p type="p">20:輸入部</p>
        <p type="p">21:目標信號區域確定部</p>
        <p type="p">22:第一峰值位置確定部</p>
        <p type="p">23:形狀獲取部</p>
        <p type="p">24:輸出部</p>
        <p type="p">Ps1:第一峰值位置</p>
        <p type="p">Sg:光學相干斷層信號</p>
        <p type="p">Tg:目標信號區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1072" publication-number="202625269">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625269</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128276</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電極合劑糊料和固態電池用電極</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260310B">H01M4/62</main-classification>
        <further-classification edition="201001120260310B">H01M4/13</further-classification>
        <further-classification edition="201001120260310B">H01M4/139</further-classification>
        <further-classification edition="201001120260310B">H01M10/0562</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商山陽色素股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANYO COLOR WORKS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>植村由</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEMURA, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中祐樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖俊龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供能夠製作即便反復充放電也可維持放電容量的固態電池用電極的電極合劑糊料及其製造方法、以及即便反復充放電也可維持放電容量的固態電池用電極及其製造方法。一種電極合劑糊料和由上述電極合劑糊料製作的固態電池用電極，其中，該電極合劑糊料的特徵在於，含有：包含分散劑和CNT的含CNT粉末、電極活性物質、電解質和溶劑A，上述分散劑與上述溶劑A之間的相互作用參數χ的範圍為0.6～2.2。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1073" publication-number="202624324">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624324</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128279</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>環氧樹脂組成物、灌注劑、功率模組、底部填充劑、倒裝晶片封裝、環氧樹脂接著劑、及半導體裝置</chinese-title>
        <english-title>EPOXY RESIN COMPOSITION, POTTING AGENT, POWER MODULE, UNDERFILL AGENT, FLIP CHIP PACKAGE, EPOXY RESIN ADHESIVE, AND SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">C08G59/20</main-classification>
        <further-classification edition="200601120260306B">C08G59/50</further-classification>
        <further-classification edition="200601120260306B">C08G59/14</further-classification>
        <further-classification edition="200601120260306B">C08L63/00</further-classification>
        <further-classification edition="200601120260306B">C08K5/5419</further-classification>
        <further-classification edition="200601120260306B">C09J163/00</further-classification>
        <further-classification edition="202601120260306B">H10W74/47</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茂木稜平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOTEGI, RYOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>串原直行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUSHIHARA, NAOYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊東優理</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, YURI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供一種環氧樹脂組成物，其雖然能夠在低溫下、短時間內硬化，但保存穩定性或硬化物性優異。一種環氧樹脂組成物，包含：（A）在一分子中具有兩個以上的環氧基的未經矽酮改性的環氧樹脂；（B）在一分子中具有兩個以上的胺基的芳香族胺系硬化劑：使環氧樹脂硬化的有效量；（C）矽酮改性環氧樹脂：相對於（A）成分100質量份而為1質量份～200質量份；（D）鋁螯合化合物：相對於（A）成分、（B）成分、及（C）成分的合計100質量份而為0.05質量份以上且小於3.0質量份；（E）選自在一分子中具有一個以上的苯基且在一分子中具有一個以上的烷氧基的烷氧基矽烷、及所述烷氧基矽烷的部分水解縮合物中的一種以上：相對於（A）成分、（B）成分、及（C）成分的合計100質量份而為0.5質量份以上且小於3.0質量份；以及（F）無機填充材：相對於（A）成分、（B）成分、及（C）成分的合計100質量份而為10質量份以上且1,000質量份以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1074" publication-number="202624267">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624267</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128289</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗TNFR2抗體</chinese-title>
        <english-title>ANTI-TNFR2 ANTIBODIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07K16/28</main-classification>
        <further-classification edition="200601120260302B">A61K39/395</further-classification>
        <further-classification edition="200601120260302B">C12N15/13</further-classification>
        <further-classification edition="200601120260302B">A61P37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商健生生物科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANSSEN BIOTECH, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝卡特　史提芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BECART, STEPHANE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　雲翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEUNG, WAN CHEUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格拉西亞斯　唐納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRACIAS, DONALD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史威奇　梅麗莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SWIECKI, MELISSA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威克斯特德　約瑟芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIXTED, JOSEPHINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於與腫瘤壞死因子(TNF)受體2 (TNFR2)特異性結合的抗體及其抗原結合片段。本發明亦提供包含該等抗體及其抗原結合片段的組成物及醫藥組成物，以及治療方法及各種其他態樣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to antibodies and antigen-binding fragments thereof that specifically bind to tumor necrosis factor (TNF) receptor 2 (TNFR2). The present invention also provides compositions and pharmaceutical compositions comprising the same, as well as methods of treatment and various other aspects.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1075" publication-number="202623997">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623997</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128294</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>手提袋的袋體成型系統、方法及袋體成型模具</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120251031B">B31B70/00</main-classification>
        <further-classification edition="201701120251031B">B31B70/04</further-classification>
        <further-classification edition="201701120251031B">B31B70/64</further-classification>
        <further-classification edition="201701120251031B">B31B70/74</further-classification>
        <further-classification edition="201701120251031B">B31B70/81</further-classification>
        <further-classification edition="200601120251031B">B65D30/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商浙江歐諾機械科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHEJIANG OUNUO MACHINERY TECHNOLOGY CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, XING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冠賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇建太</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種手提袋的袋體成型系統、方法及袋體成型模具，該種袋體成型系統包括可沿豎直方向移動的成型模具、以及位於成型模具下方的承接平臺。其中，成型模具包括模具本體、以及與手提袋的兩個側面分別對應之兩個第一側壁。在生產過程中，預先形成折邊的基材在被成型模具按壓後，利用成型模具的至少一個第一側壁的抓取部抓取相應的一側基材側面、並帶動一側基材側面相對於成型模具的模具本體沿模具本體的高度方向往復移動，以使得基材兩端的折邊在模具本體的高度方向上相互插接，利用該種袋體成型系統能夠以精簡的工序生產出支撐強度較高的袋體，並且袋體的袋口強度透過一體式的袋口折邊進行增強。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">30:袋體成型系統</p>
        <p type="p">310:成型模具</p>
        <p type="p">320:承接平臺</p>
        <p type="p">330:模具驅動機構</p>
        <p type="p">340:底托件</p>
        <p type="p">40:機架</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1076" publication-number="202623996">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623996</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128295</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>手提袋的成型模具及成型模具總成</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">B30B15/02</main-classification>
        <further-classification edition="200601120260128B">B30B9/28</further-classification>
        <further-classification edition="201701120260128B">B31B70/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商浙江歐諾機械科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHEJIANG OUNUO MACHINERY TECHNOLOGY CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, XING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冠賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇建太</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案公開了一種手提袋的成型模具及成型模具總成，成型模具包括模具本體，以及設置於模具本體之兩個第一側壁、兩個第二側壁、底壁、兩個袋體限位組件；其中，兩個第一側壁分別與手提袋的兩個正面相適配，兩個第二側壁分別與手提袋的兩個側面相適配，底壁與手提袋的底面相適配，兩個袋體限位組件與兩個第一側壁分別適配，可以實現手提袋之袋口折邊插接，在應用於手提袋之成型設備中時，能夠實現袋體和袋口折邊的同步成型，可同時提昇手提袋之生產效率和成品率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">110:模具本體</p>
        <p type="p">111:高度方向</p>
        <p type="p">113:連接板</p>
        <p type="p">120:第一側壁</p>
        <p type="p">1201:右側第一側壁</p>
        <p type="p">1202:左側第一側壁</p>
        <p type="p">121:透氣孔</p>
        <p type="p">130:第二側壁</p>
        <p type="p">140:底壁</p>
        <p type="p">150:袋體限位組件</p>
        <p type="p">160:折邊打開部件</p>
        <p type="p">191:電磁閥</p>
        <p type="p">192:真空發生器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1077" publication-number="202624711">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624711</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128305</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資訊處理方法、程式、以及資訊處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260223B">G01M13/028</main-classification>
        <further-classification edition="201901120260223B">G01M13/045</further-classification>
        <further-classification edition="200601120260223B">G06F11/32</further-classification>
        <further-classification edition="201901120260223B">B29C48/92</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本製鋼所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE JAPAN STEEL WORKS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>內門純</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UCHIKADO, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沖本翼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKIMOTO, TASUKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>風呂川幹央</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUROKAWA, MIKIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠藤大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENDO, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的一實施例的資訊處理方法，是用於顯示與減速機的異常相關的資訊的資訊處理方法；於前述減速機中，安裝用以偵測前述減速機之振動的第1振動感測器、第2振動感測器、和第3振動感測器；取得表示前述第1振動感測器、前述第2振動感測器、和前述第3振動感測器各自所偵測到之振動值的振動資料；以及，將由前述第1振動感測器、前述第2振動感測器、和前述第3振動感測器所取得的振動資料，以分別對應的長條圖並排顯示。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:成型機</p>
        <p type="p">2:偵測器</p>
        <p type="p">3:資料收集裝置</p>
        <p type="p">4:路由器</p>
        <p type="p">5:異常判斷裝置</p>
        <p type="p">6a:終端裝置</p>
        <p type="p">6b:終端裝置</p>
        <p type="p">10:圓筒</p>
        <p type="p">10a:料斗</p>
        <p type="p">11:螺桿</p>
        <p type="p">12:模具</p>
        <p type="p">13:馬達</p>
        <p type="p">14:減速機</p>
        <p type="p">15:控制裝置</p>
        <p type="p">21:第1偵測器(振動感測器)</p>
        <p type="p">22:第2偵測器</p>
        <p type="p">23:第3偵測器</p>
        <p type="p">24:第4偵測器</p>
        <p type="p">6a,6b:終端裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1078" publication-number="202623989">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623989</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128307</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>異常偵測系統以及異常偵測方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260102B">B29C48/92</main-classification>
        <further-classification edition="200601120260102B">B29C33/40</further-classification>
        <further-classification edition="201901120260102B">G01M13/028</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本製鋼所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE JAPAN STEEL WORKS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>內門純</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UCHIKADO, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沖本翼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKIMOTO, TASUKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>風呂川幹央</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUROKAWA, MIKIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福士雄祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHI, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藏重昂平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURASHIGE, KOUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">依據本揭露一實施形態的異常偵測系統為用以偵測減速機的異常的異常偵測系統，包括：第一振動感測器、第二振動感測器、以及第三振動感測器，安裝於前述減速機的機殼表面，用以檢測在前述減速機的機殼表面的振動；以及異常判定部，基於藉由前述第一振動感測器、前述第二振動感測器、及前述第三振動感測器的各者檢測出的振動，判定前述減速機有無異常。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:成型機</p>
        <p type="p">2:檢測器</p>
        <p type="p">3:資料收集裝置</p>
        <p type="p">4:路由器</p>
        <p type="p">5:異常判定裝置</p>
        <p type="p">6a:終端裝置</p>
        <p type="p">6b:終端裝置</p>
        <p type="p">10:料管</p>
        <p type="p">11:螺桿</p>
        <p type="p">12:模具</p>
        <p type="p">13:馬達</p>
        <p type="p">14:減速機</p>
        <p type="p">15:控制裝置</p>
        <p type="p">21:第一檢測器(振動感測器)</p>
        <p type="p">22:第二檢測器</p>
        <p type="p">23:第三檢測器</p>
        <p type="p">24:第四檢測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1079" publication-number="202625833">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625833</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128368</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體晶片</chinese-title>
        <english-title>SEMICONDUCTOR CHIP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W70/60</main-classification>
        <further-classification edition="202601120260302B">H10W20/43</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金光泳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KWANGYEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曺永宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, YOUNGWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃舜圭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, SOONGYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體晶片包括：半導體基體，其包括主動表面及與主動表面相對之非主動表面；以及互連結構，其定位於半導體基體之主動表面上，互連結構包括複數個互連層及一互連絕緣層，該等複數個互連層分別包括複數個互連線及複數個互連通孔，互連絕緣層環繞該等複數個互連層，其中該等複數個互連層包括上層互連層，上層互連層包括複數個上層互連線，該等複數個上層互連線在第一水平方向上延伸且在垂直於該第一水平方向之第二水平方向上彼此分開，且上層互連層進一步包括複數個上層互連通孔，該等複數個上層互連通孔包括至少一個上層不對稱通孔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor chip includes a semiconductor substrate including an active surface and an inactive surface opposite to the active surface and an interconnection structure positioned on the active surface of the semiconductor substrate, the interconnection structure including a plurality of interconnection layers respectively including a plurality of interconnection lines and a plurality of interconnection vias and an interconnection insulating layer surrounding the plurality of interconnection layers, wherein the plurality of interconnection layers include an upper layer interconnection layer including a plurality of upper layer interconnection lines extending in a first horizontal direction and apart from each other in a second horizontal direction perpendicular to the first horizontal direction, and the upper layer interconnection layer further includes a plurality of upper layer interconnection vias including at least one upper layer asymmetric via.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體基體</p>
        <p type="p">100_A:主動表面</p>
        <p type="p">200:互連結構</p>
        <p type="p">210:互連層</p>
        <p type="p">210_L:互連線</p>
        <p type="p">210_V:互連通孔</p>
        <p type="p">220:互連絕緣層</p>
        <p type="p">1000:半導體晶片</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1080" publication-number="202624277">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624277</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128404</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>靶向血管生成因子及炎性因子之多特異性融合蛋白</chinese-title>
        <english-title>MULTISPECIFIC FUSION PROTEINS TARGETING ANGIOGENIC AND INFLAMMATORY FACTORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07K19/00</main-classification>
        <further-classification edition="200601120260302B">C07K16/22</further-classification>
        <further-classification edition="200601120260302B">C07K16/24</further-classification>
        <further-classification edition="200601120260302B">C12N15/13</further-classification>
        <further-classification edition="200601120260302B">C12N15/63</further-classification>
        <further-classification edition="200601120260302B">A61K39/395</further-classification>
        <further-classification edition="200601120260302B">A61P9/00</further-classification>
        <further-classification edition="200601120260302B">A61P27/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>開曼群島商五角星生物有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENTAVISION BIOSCIENCES LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KY</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申　維勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, WEI YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　金忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JINZHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉仁傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種融合蛋白或其抗原結合片段或抗原結合域，其包含靶向且能夠結合Ang-2、IL-6及至少一個VEGF家族成員的結合構築體。該融合蛋白包含針對Ang-2之抗體或結合多肽、針對IL-6之抗體及VEGF受體之複數個細胞外域作為結合組分。該融合蛋白可用於治療或控制病因在於異常過度血管生成、血管滲漏增加及發炎之一的眼部或全身性疾病、病況或病症。&lt;b&gt;  &lt;/b&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fusion protein, or an antigen-binding fragment, or antigen-binding domain thereof comprises a binding construct targeting and being capable of binding Ang-2, IL-6, and at least one of the VEGF family members. The fusion protein comprises, as binding components, an antibody or binding polypeptide directed against Ang-2, an antibody directed against IL-6, and a plurality of extracellular domains of VEGF receptors. The fusion protein is useful in treating or controlling an ocular or systemic disease, condition, or disorder that has etiology in one of aberrant, excessive angiogenesis, increased vascular leakage, and inflammation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1081" publication-number="202624569">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624569</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128431</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>模型導向之熔體與晶體在生長界面軸向梯度集總參數估算之系統及方法</chinese-title>
        <english-title>SYSTEMS AND METHODS FOR MODEL BASED LUMPED PARAMETER ESTIMATION OF AXIAL GRADIENTS IN MELT AND CRYSTAL AT THE GROWING INTERFACE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C30B15/20</main-classification>
        <further-classification edition="200601120260302B">C30B29/06</further-classification>
        <further-classification edition="200601120260302B">G05B13/04</further-classification>
        <further-classification edition="200601120260302B">G05B23/02</further-classification>
        <further-classification edition="200601120260302B">G06F17/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>環球晶圓股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLOBALWAFERS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>努伯特　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEUBERT, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪榮宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種電腦裝置，其包含與至少一個記憶體裝置通訊之至少一個處理器。該至少一個處理器經程式化以：a)接收用於在該裝置上模擬一程序之資料；b)判定複數個梯度變數；c)判定該複數個梯度變數之複數個擬合係數；d)對該複數個擬合係數及該複數個梯度變數執行擬合運算以判定該複數個擬合係數之疊加；e)將該複數個擬合係數之該等疊加傳輸至該裝置之一控制器；f)擷取該裝置之操作參數；g)判定未被直接測量之一或多個屬性；h)基於該複數個擬合係數之該等疊加判定該一或多個屬性之值；及i)控制該裝置執行該程序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A computer device includes at least one processor in communication with at least one memory device. The at least one processor is programmed to: a) receive data for simulating a process on the device; b) determine a plurality of gradient variables; c) determine a plurality of fit coefficients for the plurality of gradient variables; d) perform fitting operations on the plurality of fit coefficients and the plurality of gradient variable to determine superpositions for the plurality of fit coefficients; e) transmit the superpositions for the plurality of fit coefficients to a controller of the device; f) retrieve operating parameters of the device; g) determine one or more attributes that are not directly measured; h) determine values for the one or more attributes based on the superpositions of the plurality of fit coefficients; and i) control the device to perform the process.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:拉錠設備/拉錠器/拉錠器裝置</p>
        <p type="p">102:矽熔體</p>
        <p type="p">104:坩堝</p>
        <p type="p">106:外殼</p>
        <p type="p">108:晶體生長腔室</p>
        <p type="p">110:提拉腔室</p>
        <p type="p">112:大體上圓頂形上壁</p>
        <p type="p">114:入口埠</p>
        <p type="p">116:出口埠</p>
        <p type="p">118:承座</p>
        <p type="p">120:可旋轉軸件</p>
        <p type="p">122:加熱系統/加熱器</p>
        <p type="p">124:提拉纜線</p>
        <p type="p">126:提拉總成</p>
        <p type="p">128:晶種卡盤</p>
        <p type="p">130:晶種</p>
        <p type="p">150:控制器</p>
        <p type="p">151:連接</p>
        <p type="p">155:感測器/測量裝置</p>
        <p type="p">X:中心縱向軸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1082" publication-number="202624268">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624268</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128443</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阿米維單抗與卡鉑及吡咯葉酸組合以用於治療非小細胞肺癌（ＮＳＣＬＣ）</chinese-title>
        <english-title>AMIVANTAMAB IN COMBINATION WITH CARBOPLATIN AND PEMETREXED FOR THE TREATMENT OF NON-SMALL CELL LUNG CANCER (NSCLC)</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07K16/28</main-classification>
        <further-classification edition="200601120260302B">A61K39/395</further-classification>
        <further-classification edition="201901120260302B">A61K33/243</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商健生生物科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANSSEN BIOTECH, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>包姆爾　約書亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAUML, JOSHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫馬爾　桑迪普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, SANDEEP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐賀達　萊拉　卡莉娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OJEDA, LAHILA-CARINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙賀　蘇傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAH, SUJAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示使用阿米維單抗與卡鉑及吡咯葉酸組合以用於治療非小細胞肺癌(NSCLC)之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are methods of using amivantamab in combination with carboplatin and pemetrexed for the treatment of non-small cell lung cancer (NSCLC).</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1083" publication-number="202623820">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623820</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128487</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療面肩肱型肌營養不良的腺相關病毒組成物</chinese-title>
        <english-title>ADENO-ASSOCIATED VIRUS COMPOSITIONS FOR THE TREATMENT OF FACIOSCAPULOHUMERAL MUSCULAR DYSTROPHY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/7088</main-classification>
        <further-classification edition="200601120260302B">C12N15/861</further-classification>
        <further-classification edition="200601120260302B">C12N15/11</further-classification>
        <further-classification edition="200601120260302B">A61P21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商凱特治療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATE THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯謝德里　沙奧拉夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SESHADRI, SAURAV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔必包德巴爾　謝里夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TABEBORDBAR, SHARIF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔必包德巴爾　沙雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TABEBORDBAR, SHAYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉　西蒙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YE, SIMON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了用於在治療面肩肱型肌營養不良（FSHD）中使用的新穎的基因療法組成物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides novel gene therapy compositions for use in treatment of facioscapulohumeral muscular dystrophy (FSHD).</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1084" publication-number="202624281">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624281</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128502</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬化性組成物及硬化物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08F2/38</main-classification>
        <further-classification edition="200601120260302B">C08F2/44</further-classification>
        <further-classification edition="200601120260302B">C08F12/00</further-classification>
        <further-classification edition="200601120260302B">C08K5/01</further-classification>
        <further-classification edition="200601120260302B">C08L101/02</further-classification>
        <further-classification edition="202601120260302B">H10W74/47</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長島和史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGASHIMA, KAZUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山浦格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAURA, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的一實施形態是有關於一種含有具有乙烯基苯基的化合物以及聚合抑制劑的硬化性組成物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1085" publication-number="202624423">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624423</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128503</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗反射黒色塗料組合物及光學機器</chinese-title>
        <english-title>ANTI-REFLECTIVE BLACK PAINT COMPOSITION AND OPTICAL DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">C09D163/00</main-classification>
        <further-classification edition="200601120260309B">C08K3/04</further-classification>
        <further-classification edition="201801120260309B">C09D7/61</further-classification>
        <further-classification edition="200601120260309B">C09D5/00</further-classification>
        <further-classification edition="201501120260309B">G02B1/111</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商迪睿合股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEXERIALS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林亨至</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, YUKINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種抗反射黑色塗料組合物，其尤其是於LiDAR機器等中使用之紅外線區域中具有良好之抗反射特性，且對主要包含鋁之上述機器之殼體之密接性優異。  本發明之抗反射黑色塗料組合物含有溶劑、環氧樹脂、陽離子型熱反應起始劑、黑色顏料、及二氧化矽填料，上述二氧化矽填料於內部包含空氣層，於製成硬化乾燥塗膜之情形時，於入射角8°下之全光線反射率測定中，對波長1500 nm之光之反射率為2.5%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1086" publication-number="202625846">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625846</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128509</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W72/00</main-classification>
        <further-classification edition="202501120260302B">H10D30/60</further-classification>
        <further-classification edition="202501120260302B">H10D30/01</further-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穩懋半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIN SEMICONDUCTORS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>花長煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUA, CHANG-HWANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁耀仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, YAO-REN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊嘉峻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIA-JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置，包括：基板，具有第一表面及第二表面。此裝置亦包括金屬堆疊，位於第一表面上。金屬堆疊包括交互堆疊的附著層及至少一抵抗層。此裝置亦包括開口，形成於基板之中，且從第二表面延伸至第一表面。此裝置亦包括導電金屬，位於開口之中，且連接至金屬堆疊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a substrate having a first surface and a second surface. The device also includes a metal stack disposed on the first surface. The metal stack includes a plurality of adhesion layers and at least one resistant layer alternately stacked. The device also includes an opening formed within the substrate and extending from the second surface to the first surface. The device also includes a conductive metal disposed in the opening and connected to the metal stack.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10a:半導體結構</p>
        <p type="p">102:基板</p>
        <p type="p">102f:第一表面</p>
        <p type="p">102b:第二表面</p>
        <p type="p">104:磊晶層</p>
        <p type="p">116:源極電極</p>
        <p type="p">118:汲極電極</p>
        <p type="p">120a:第一介電層</p>
        <p type="p">120b:第二介電層</p>
        <p type="p">120c:第三介電層</p>
        <p type="p">122:閘極電極</p>
        <p type="p">124:金屬堆疊</p>
        <p type="p">132a:第一金屬層</p>
        <p type="p">132b:第二金屬層</p>
        <p type="p">132c:第三金屬層</p>
        <p type="p">133:溝槽</p>
        <p type="p">134:場板</p>
        <p type="p">135:開口</p>
        <p type="p">136:背面開口</p>
        <p type="p">137:溝槽</p>
        <p type="p">138:金屬結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1087" publication-number="202624177">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624177</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128513</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬化性組成物的製造方法及硬化性組成物用混合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07C13/45</main-classification>
        <further-classification edition="200601120260302B">C07C7/20</further-classification>
        <further-classification edition="200601120260302B">C08F2/44</further-classification>
        <further-classification edition="200601120260302B">C08F12/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長島和史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGASHIMA, KAZUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山浦格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAURA, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一實施形態是有關於一種硬化性組成物的製造方法，包括：將含有具有乙烯基苯基的化合物及溶劑的液體A與聚合抑制劑B混合，獲得液體B，自所述液體B中去除溶劑，獲得含有具有乙烯基苯基的化合物以及所述聚合抑制劑B的混合物；及使用所述混合物獲得硬化性組成物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1088" publication-number="202625821">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625821</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128533</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子總成、建構電子總成之方法、及功率逆變器總成</chinese-title>
        <english-title>ELECTRONIC ASSEMBLY, METHOD OF CONSTRUCTING ELECTRONIC ASSEMBLIES, AND POWER INVERTER ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W40/30</main-classification>
        <further-classification edition="202601120260302B">H10W40/47</further-classification>
        <further-classification edition="202601120260302B">H05K1/185</further-classification>
        <further-classification edition="202601120260302B">H10W70/04</further-classification>
        <further-classification edition="202501120260302B">H10D30/60</further-classification>
        <further-classification edition="202501120260302B">H10D62/83</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商半導體組件工業公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林承園</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IM, SEUNGWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述一種執行嵌入式電子組件之浸入式冷卻的電子總成及其建構方法。一實例電子總成包括一第一載體及一第二載體，其等結合在一起，以形成一複合載體。形成一電子電路的一組件集合係嵌入在此複合載體內而位在此第一載體與此第二載體之間。與此複合載體整合的複數個引線係配置以提供對此電子電路的複數個電路節點的外部接取。至少部分地包圍此複合載體的一浸入式冷卻總成係配置以引導一冷卻流體流過此複合載體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Electronic assemblies that perform immersion cooling of embedded electronic components are described herein, as well as methods for constructing the same. An example electronic assembly includes a first carrier and a second carrier joined together to form a composite carrier. A set of components forming an electronic circuit are embedded within this composite carrier between the first carrier and the second carrier. A plurality of leads integrated with the composite carrier are configured to provide external access to a plurality of circuit nodes of the electronic circuit. An immersive cooling assembly at least partially enclosing the composite carrier is configured to guide a cooling fluid over the composite carrier.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電子總成</p>
        <p type="p">102:複合載板</p>
        <p type="p">102-1:第一載板</p>
        <p type="p">102-2:第一載板</p>
        <p type="p">104:組件集合</p>
        <p type="p">106:電性連接</p>
        <p type="p">108:引線</p>
        <p type="p">110:沉浸式冷卻總成</p>
        <p type="p">110-1:第一部分</p>
        <p type="p">110-2:第二部分</p>
        <p type="p">112-1:組裝步驟，步驟</p>
        <p type="p">112-2:組裝步驟，步驟</p>
        <p type="p">114:連接埠</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1089" publication-number="202625416">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625416</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128548</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於在分段路由網路上實施行動用戶平面的外部控制器之系統及其方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR EXTERNAL CONTROLLER FOR IMPLEMENTING A MOBILE USER PLANE (MUP) OVER SEGMENT ROUTING NETWORK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260305B">H04L45/302</main-classification>
        <further-classification edition="202201120260305B">H04L45/03</further-classification>
        <further-classification edition="202201120260305B">H04L45/74</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商阿爾克斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARRCUS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>派德　凱優</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATEL, 　KEYUR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村上　哲也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAKAMI, 　TETSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>派　納林納許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, 　NALINAKSH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　民傑德瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEUNG, MAN-KIT DEREK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鼎鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">行動使用者平面（Mobile User Plane, MUP）係與由外部運作系統決定的路由（例如：轉發策略）相結合。網路環境包含連接至資料網路的MUP供應商邊緣路由器（MUP-PE）及連接至蜂巢式通訊基地台的MUP閘道路由器（MUP-GW），MUP-PE及MUP-GW藉由存取網路連接。MUP控制器（MUP-C）獲取用於連接至基地台之使用者設備的行動會話資訊，且運作系統修改行動會話資訊以獲得一個經修改行動會話資訊，所述經修改行動會話資訊係由MUP-C使用以產生第一類型會話轉換（ST1）路由及第二類型會話轉換（ST2）路由。所述經修改行動會話資訊可包含轉發策略。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Mobile User Plane (MUP) is combined with routing, e.g., a forwarding policy, determined by an external operation system. A network environment includes an MUP-PE connected to a data network and an MUP-GW connected to a cellular communication base station, the MUP-PE and MUP-GW connected by an access network. An MUP-C obtains mobile session information for user equipment connected to the base station and an operation system modifies the mobile session information to obtain modified mobile session information, which is used by MUP-C to generate ST1 and ST2 routes. The modified mobile session information may include a forwarding policy.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:網路環境</p>
        <p type="p">102:使用者設備</p>
        <p type="p">104:資料網路</p>
        <p type="p">106:存取網路</p>
        <p type="p">108:控制器</p>
        <p type="p">110:基地台</p>
        <p type="p">112:MUP閘道器</p>
        <p type="p">114:MUP供應商邊緣路由器</p>
        <p type="p">118:MUP控制器</p>
        <p type="p">120:運作系統</p>
        <p type="p">122:發布者與訂閱者資料庫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1090" publication-number="202624568">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624568</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128570</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含具有控制熱性質之絕熱塗層的熱區部件之拉錠器設備</chinese-title>
        <english-title>INGOT PULLER APPARATUS INCLUDING HOTZONE COMPONENTS HAVING REFRACTORY COATINGS FOR CONTROLLING THERMAL PROPERTIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">C30B15/14</main-classification>
        <further-classification edition="200601120260304B">C30B35/00</further-classification>
        <further-classification edition="200601120260304B">C30B29/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>環球晶圓股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLOBALWAFERS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菲利浦　理查　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PHILLIPS, RICHARD J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>路特　威廉　Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUTER, WILLIAM L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈德森　卡瑞喜瑪　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUDSON, CARISSIMA M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪榮宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於產生一單晶矽晶錠之拉錠器設備包含：一拉錠器殼體，其界定一生長室；一坩堝總成，其定位於該生長室內以用於固持矽熔體；一基座，其支撐該生長室內之該坩堝總成；以及至少一個熱區部件，其定位於該生長室內。該至少一個熱區部件包含：一基板，其具有一表面發射率；及一絕熱材料塗層，其被施加至該基板，該絕熱材料塗層修改該表面發射率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An ingot puller apparatus for producing a single crystal silicon ingot includes an ingot puller housing that defines a growth chamber, a crucible assembly positioned within the growth chamber for holding a silicon melt, a susceptor supporting the crucible assembly within the growth chamber, and at least one hotzone component positioned within the growth chamber. The at least one hotzone component includes a substrate having a surface emissivity and a refractory material coating applied to the substrate that modifies the surface emissivity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:熱區部件</p>
        <p type="p">202:絕熱材料塗層/塗層/經圖案化塗層</p>
        <p type="p">204:基板/熱區部件基板</p>
        <p type="p">206:第一表面</p>
        <p type="p">208:第二表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1091" publication-number="202624429">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624429</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128679</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光硬化性黏著劑組合物、黏著劑、附黏著劑之構件、黏著劑之製造方法、硬化體、構件及硬化體之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">C09J4/02</main-classification>
        <further-classification edition="200601120260304B">C09J11/06</further-classification>
        <further-classification edition="200601120260304B">C09J11/04</further-classification>
        <further-classification edition="200601120260304B">C09J133/08</further-classification>
        <further-classification edition="200601120260304B">C08F2/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>笹原一輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAHARA, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供之光硬化性黏著劑組合物包含單體成分M、光起始劑、及著色劑。光起始劑之波長380 nm之光之吸收率為0.05%以上。著色劑之波長380 nm之光之吸收率為0.21%以下。該光硬化性黏著劑組合物雖包含著色劑，但亦適於抑制硬化不要。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:基材</p>
        <p type="p">12:(黏著劑組合物A之)塗佈物</p>
        <p type="p">13:光</p>
        <p type="p">14:黏著劑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1092" publication-number="202624435">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624435</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128680</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光硬化性黏著劑組合物、黏著劑、附黏著劑之構件、黏著劑之製造方法、硬化體、構件及硬化體之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">C09J133/08</main-classification>
        <further-classification edition="200601120260313B">C09J4/04</further-classification>
        <further-classification edition="200601120260313B">C08F2/50</further-classification>
        <further-classification edition="200601120260313B">C08L23/32</further-classification>
        <further-classification edition="200601120260313B">C09J11/06</further-classification>
        <further-classification edition="202201120260313B">C09K23/18</further-classification>
        <further-classification edition="202201120260313B">C09K23/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>笹原一輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAHARA, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供之光硬化性黏著劑組合物包含單體成分M、光起始劑、及熱起始劑。該光硬化性黏著劑組合物適於抑制硬化不良。單體成分M中之(甲基)丙烯酸單體之含有率可為50重量%以上。單體成分M可包含具有含雙鍵環之單體。光硬化性黏著劑組合物可進而包含著色劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:基材</p>
        <p type="p">12:(黏著劑組合物A之)塗佈物</p>
        <p type="p">13:光</p>
        <p type="p">14:黏著劑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1093" publication-number="202625286">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625286</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128719</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>非水電解液二次電池用積層隔離件形成用之組成物及其利用</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260302B">H01M50/423</main-classification>
        <further-classification edition="200601120260302B">C08G75/30</further-classification>
        <further-classification edition="200601120260302B">C08L77/10</further-classification>
        <further-classification edition="202101120260302B">H01M50/138</further-classification>
        <further-classification edition="201001120260302B">H01M10/0563</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古川洵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUKAWA, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石井大雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHII, TAIGA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 提供一種非水電解液二次電池用積層隔離件形成用之組成物，其可減低積層隔離件之透氣度提升量，且可提升耐熱性。  &lt;br/&gt;　　[解決手段] 本揭示之非水電解液二次電池用積層隔離件形成用之組成物，包含具備醯胺鍵之樹脂，前述具備醯胺鍵之樹脂包含溶出至N-甲基-2-吡咯啶酮之成分，前述溶出至N-甲基-2-吡咯啶酮之成分的含量，相對於前述具備醯胺鍵之樹脂全體的重量而言，為超過25.0重量%且45.0重量%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1094" publication-number="202625620">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625620</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128724</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包括填充胞元的積體電路</chinese-title>
        <english-title>INTEGRATED CIRCUIT INCLUDING FILLER CELL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251103B">H10D89/10</main-classification>
        <further-classification edition="202001120251103B">G06F30/392</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金柄成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, BYUNGSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, SEUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容係關於一種具有一改良之集積度的積體電路。一種示例性積體電路包含：一第一胞元及一第二胞元，其各自包含一第一作用區及一第二作用區；以及一單節距尺寸填充胞元，其配置於該第一胞元與該第二胞元之間且在一第一方向上鄰近於該第一胞元及該第二胞元。該填充胞元包含：一第一閘極堆疊及一第二閘極堆疊，其在該第一方向上彼此鄰近；以及一分離結構，其配置於該第一閘極堆疊與該第二閘極堆疊之間。該分離結構至少部分地分裂該第一作用區及該第二作用區。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to an integrated circuit having an improved degree of integration. An example integrated circuit comprises a first cell and a second cell each comprising a first active region and a second active region, and a one-pitch dimension filler cell arranged between the first cell and the second cell and adjacent to the first and second cells in a first direction. The filler cell comprises a first gate stack and a second gate stack that are adjacent to each other in the first direction, and a separation structure arranged between the first and second gate stacks. The separation structure at least partially splits the first active region and the second active region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:第一填充胞元</p>
        <p type="p">10a:第一胞元</p>
        <p type="p">10b:第二胞元</p>
        <p type="p">105:作用區分離膜</p>
        <p type="p">106:胞元分離膜</p>
        <p type="p">112:第一作用區</p>
        <p type="p">114:第二作用區</p>
        <p type="p">120:閘極堆疊</p>
        <p type="p">132_1:第一p型電晶體</p>
        <p type="p">132_2:第二p型電晶體</p>
        <p type="p">134_1:第一n型電晶體</p>
        <p type="p">134_2:第二n型電晶體</p>
        <p type="p">150:絕緣閘極</p>
        <p type="p">160:胞元閘極切割圖案</p>
        <p type="p">1000:積體電路佈局圖</p>
        <p type="p">1CPP:接觸多晶矽節距</p>
        <p type="p">A-A':線</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:方向</p>
        <p type="p">DB:分離結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1095" publication-number="202623860">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623860</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128749</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高爾夫球材料、高爾夫球及組成物</chinese-title>
        <english-title>GOLF BALL MATERIAL, GOLF BALL, AND COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">A63B37/00</main-classification>
        <further-classification edition="200601120260302B">C08L101/00</further-classification>
        <further-classification edition="202501120260302B">C08L23/08</further-classification>
        <further-classification edition="202501120260302B">C08L23/26</further-classification>
        <further-classification edition="200601120260302B">C08L75/04</further-classification>
        <further-classification edition="200601120260302B">C08L83/04</further-classification>
        <further-classification edition="200601120260302B">C08L9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井　陶氏聚合化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOW-MITSUI POLYCHEMICALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水貴廣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西村圭司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMURA, KEIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>礒川素朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISOKAWA, MOTOAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大木和幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OOGI, KAZUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之高爾夫球材料含有：乙烯/不飽和羧酸系共聚合體之羧基藉由金屬離子中和20%~90%而成的離子聚合物(A)；與液狀彈性體(B)；相對於上述離子聚合物(A)與上述液狀彈性體(B)之合計含量100質量份，上述離子聚合物(A)之含量為70質量份~99質量份；相對於上述離子聚合物(A)與上述液狀彈性體(B)之合計含量100質量份，上述液狀彈性體(B)之含量為1質量份~30質量份。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1096" publication-number="202625699">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625699</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128753</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電漿處理方法</chinese-title>
        <english-title>PLASMA PROCESSING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P50/20</main-classification>
        <further-classification edition="202601120260302B">H10B80/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日立全球先端科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞曼　安德烈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMEND, ANDRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑原謙一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUWAHARA, KENICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種使用電漿蝕刻設備用於半導體元件製造之方法，以藉由在電漿製程期間施加壓力梯度及降低電漿密度來控制高深寬比(HAR)結構下的氣體交換並防止深寬比(AR)相依效應，諸如過度的壁蝕刻及損壞。在蝕刻與鈍化步驟之間應用了氣體交換步驟，在此期間，氣壓取決於其他步驟的壓力及樣品AR而降低，且電漿功率降低並至少暫時熄滅。此方法能夠在HAR結構的蝕刻與鈍化步驟之間實現快速氣體交換及快速蝕刻劑自由基去除，從而補償因AR所致之較慢氣體傳導。此舉可避免過度的壁蝕刻，並改善HAR結構的保護性階梯覆蓋。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a method, for semiconductor device fabrication using plasma etching equipment, to control gas exchange at HAR (High Aspect-Ratio) structures and prevent aspect-ratio (AR) dependent effects, such as excessive wall etching and damage, by applying a pressure gradient and reducing plasma density during a plasma process. A gas exchange step is applied between an etching and passivation step, during which the gas pressure is reduced depending on the other steps’ pressures and on the sample AR, and during which the plasma power is lowered and at least temporarily extinguished. This method enables fast gas exchange and fast etchant radical removal between etching and passivation steps at HAR structures, compensating for the slower gas conduction due to AR. This prevents excessive wall etching and improves protective step-coverage at HAR structures.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:真空容器</p>
        <p type="p">102:噴淋板</p>
        <p type="p">103:介電窗</p>
        <p type="p">104:處理室</p>
        <p type="p">105:氣體供應裝置</p>
        <p type="p">106:真空排氣裝置</p>
        <p type="p">107:波導</p>
        <p type="p">108:電磁波產生電源</p>
        <p type="p">109:磁場產生線圈</p>
        <p type="p">110:樣品安裝電極</p>
        <p type="p">111:晶圓</p>
        <p type="p">112:匹配電路</p>
        <p type="p">113:射頻偏壓電源</p>
        <p type="p">114:射頻濾波器</p>
        <p type="p">115:DC電源</p>
        <p type="p">116:排氣開關閥</p>
        <p type="p">117:排氣速率可變閥</p>
        <p type="p">118:匹配單元</p>
        <p type="p">119:控制單元</p>
        <p type="p">120:脈衝產生單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1097" publication-number="202624083">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624083</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128761</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>移動體及切換機構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260312B">B64D35/08</main-classification>
        <further-classification edition="202301120260312B">B64U50/20</further-classification>
        <further-classification edition="201201120260312B">F16H57/023</further-classification>
        <further-classification edition="200601120260312B">F16D11/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>一般財團法人電力中央研究所</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CENTRAL RESEARCH INSTITUTE OF ELECTRIC POWER INDUSTRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米澤宏一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONEZAWA, KOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝祥揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王信傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之移動體具備：具有驅動軸，可藉由前述驅動軸驅動而產生推進力之推進部；可產生馬達驅動力而使前述驅動軸驅動之馬達；可產生引擎驅動力而使前述驅動軸驅動之引擎；可將前述馬達驅動力傳達至前述引擎之傳達部；及可控制前述傳達部之控制部；前述控制部控制前述傳達部，可切換前述傳達部將前述馬達驅動力傳達至前述引擎之傳達狀態；與前述傳達部不將前述馬達驅動力傳達至前述引擎的切斷狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">29:驅動軸</p>
        <p type="p">29b:第二驅動齒輪</p>
        <p type="p">30:馬達</p>
        <p type="p">31:馬達軸部</p>
        <p type="p">31a:第一馬達齒輪</p>
        <p type="p">31b:第二馬達齒輪</p>
        <p type="p">32:馬達本體</p>
        <p type="p">33:馬達皮帶</p>
        <p type="p">40:引擎</p>
        <p type="p">41:引擎軸部</p>
        <p type="p">41a:第一引擎齒輪</p>
        <p type="p">41b:第二引擎齒輪</p>
        <p type="p">41c:引擎軸前端部</p>
        <p type="p">42:引擎本體</p>
        <p type="p">50:傳達部</p>
        <p type="p">51:傳達軸</p>
        <p type="p">51a:第一離合器</p>
        <p type="p">52:馬達傳達部</p>
        <p type="p">53:引擎傳達部</p>
        <p type="p">53a:第二離合器</p>
        <p type="p">O1~O7:第一軸~第七軸</p>
        <p type="p">OC1:引擎遮斷部</p>
        <p type="p">OC2:馬達遮斷部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1098" publication-number="202624566">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624566</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128762</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用冷凍乾燥法製造半導體錠生長製程之摻雜劑</chinese-title>
        <english-title>USE OF FREEZE DRYING TO MANUFACTURE A DOPANT FOR SEMICONDUCTOR INGOT GROWTH PROCESSES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">C30B15/04</main-classification>
        <further-classification edition="200601120260305B">C30B15/20</further-classification>
        <further-classification edition="200601120260305B">C30B29/06</further-classification>
        <further-classification edition="200601120260305B">C30B31/00</further-classification>
        <further-classification edition="200601120260305B">B01J2/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>環球晶圓股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLOBALWAFERS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菲利浦　理查　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PHILLIPS, RICHARD J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈德森　卡瑞喜瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUDSON, CARISSIMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格雷比　艾利西斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRABBE, ALEXIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓊　猷吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, YOUNGGIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪榮宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於利用一冷凍乾燥摻雜劑生長一單晶錠之方法包含將半導體材料添加至一拉錠器之一坩堝，加熱該半導體材料以形成一熔體，將一冷凍乾燥摻雜劑添加至該熔體，及自該熔體提拉一單晶錠。利用該冷凍乾燥摻雜劑控制該單晶錠之一摻雜濃度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods for growing a single crystal ingot using a freeze dried dopant include adding semiconductor material to a crucible of an ingot puller, heating the semiconductor material to form a melt, adding a freeze dried dopant to the melt, and pulling a single crystal ingot from the melt. A doping concentration of the single crystal ingot is controlled using the freeze dried dopant.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:方法</p>
        <p type="p">302:混合包括一電活性摻雜劑之一水性前驅體混合物</p>
        <p type="p">304:由該水性前驅體混合物形成一或多個液體微滴</p>
        <p type="p">306:冷凍該水性前驅體混合物之該一或多個液體微滴之各者以形成該水性前驅體混合物之一或多個固化微滴</p>
        <p type="p">308:藉由昇華自該一或多個固化微滴之各者移除水以形成一對應數目之一或多個冷凍乾燥摻雜劑顆粒</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1099" publication-number="202623838">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623838</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128763</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>脂質奈米顆粒及其製造和使用方法</chinese-title>
        <english-title>LIPID NANOPARTICLES AND METHODS OF MANUFACTURE AND USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260305B">A61K47/68</main-classification>
        <further-classification edition="201701120260305B">A61K47/50</further-classification>
        <further-classification edition="202501120260305B">A61K9/127</further-classification>
        <further-classification edition="200601120260305B">A61K31/7088</further-classification>
        <further-classification edition="200601120260305B">A61K39/395</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商健臻公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENZYME CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比利時商艾伯霖克斯公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABLYNX N.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿里　米爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALI, MIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴塔拉博斯凱　皮拉爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BATALLA BOSQUET, PILAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑布羅維奇　皮奧特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOBROWICZ, PIOTR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博施　奧斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOESCH, AUSTIN WAYNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克魯爾　利澤洛特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CRUL, LIESELOTTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德斯坎普　法蘭西斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DESCAMPS, FRANCIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德拉蒙德　戴瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DRUMMOND, DARYL CLARK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格里塞特　亞倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRISET, AARON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈爾莫斯　薩拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HALMOS, SARA MARIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫爾曼　威廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUHLMAN, WILLIAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勒姆加特　維克多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEMGART, VIKTOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利霍拉多娃　奧爾加</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIHORADOVA, OLGA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　志前</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, ZHIQUIAN LUCY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="14">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼爾森　烏爾里克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIELSEN, ULRIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="15">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索耶　安德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAWYER, ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="16">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡茵沛　尤爾根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN IMPE, JURGEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露總體上關於用於基因療法的組成物和方法，以及更特別地關於在體內將基於mRNA的治療劑遞送至免疫細胞。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates generally to compositions and methods for gene therapy、and more specifically to delivering mRNA-based therapeutics to immune cells &lt;i&gt;in vivo&lt;/i&gt;.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1100" publication-number="202623806">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623806</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128775</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>吡唑并嘧啶化合物及其醫藥用途</chinese-title>
        <english-title>PYRAZOLOPYRIMIDINE COMPOUNDS AND THE MEDICAL USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">A61K31/519</main-classification>
        <further-classification edition="200601120260312B">A61K31/4155</further-classification>
        <further-classification edition="200601120260312B">A61K31/5383</further-classification>
        <further-classification edition="200601120260312B">C07D231/12</further-classification>
        <further-classification edition="200601120260312B">C07D263/32</further-classification>
        <further-classification edition="200601120260312B">C07D487/04</further-classification>
        <further-classification edition="200601120260312B">C07D519/00</further-classification>
        <further-classification edition="200601120260312B">A61P3/00</further-classification>
        <further-classification edition="200601120260312B">A61P35/00</further-classification>
        <further-classification edition="200601120260312B">A61P37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本煙草產業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAPAN TOBACCO INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山崎貴之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASAKI, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上山和人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEYAMA, KAZUHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赤木祐介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKAGI, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小川博之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGAWA, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山中浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMANAKA, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供具有NF-κB誘導激酶抑制活性之化合物。本發明提供下述式［I］化合物或其製藥上可容許的鹽。  &lt;br/&gt;&lt;img align="absmiddle" height="277px" width="212px" file="ed10165.JPG" alt="ed10165.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a compound having NF-κB-inducing kinase inhibitory activity. The present invention provides a compound of the following formula [I] or a pharmaceutically acceptable salt thereof. &lt;br/&gt;&lt;img align="absmiddle" height="282px" width="206px" file="ed10166.JPG" alt="ed10166.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">本案無圖式。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1101" publication-number="202623818">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623818</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128788</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>蒽環類衍生物及其製備方法和應用</chinese-title>
        <english-title>ANTHRACYCLINE DERIVATIVES AND PREPARATION METHODS AND APPLICATIONS THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/704</main-classification>
        <further-classification edition="200601120260302B">A61K31/535</further-classification>
        <further-classification edition="200601120260302B">A61K31/506</further-classification>
        <further-classification edition="200601120260302B">A61K31/497</further-classification>
        <further-classification edition="200601120260302B">A61K31/351</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海齊魯製藥研究中心有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI QILU PHARMACEUTICAL RESEARCH AND DEVELOPMENT CENTRE LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐永金</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, YONGJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>覃肯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIN, KEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃文淑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WENSHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王新美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, XINMEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊利生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, LISHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏巍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陶　維康</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAO, WEIKANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種新的細胞毒化合物、其製備方法和用途。具體而言，本申請提供一種通式(I)所示的蒽環類衍生物及其製備方法和在製備治療和/或預防腫瘤藥物中的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides a class of novel cytotoxic compounds, preparation methods and applications thereof. Specifically, the present application provides anthracycline derivatives represented by the general formula (I), preparation methods and uses thereof in the preparation of drugs for treating and/or preventing tumors.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1102" publication-number="202625756">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625756</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128800</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>教示方法及半導體製造裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/50</main-classification>
        <further-classification edition="200601120260302B">G01B21/00</further-classification>
        <further-classification edition="200601120260302B">B65G49/07</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平野拓己</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRANO, TAKUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松田勢竜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUDA, SEIRYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>兒玉俊昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KODAMA, TOSHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種教示方法及半導體製造裝置。該教示方法，於半導體製造裝置中教示圓形的測定對象之位置；該半導體製造裝置包含：搬運裝置，具有可將基板搬運之牙叉；以及控制裝置，控制搬運裝置之動作。該教示方法，具有如下步驟：(A)藉由設置在該牙叉之感測器，將圓形的測定對象之緣部測定複數次；(B)依據藉由感測器測定出的複數測定點，製作測定假想圓；(C)將測定假想圓與複數測定點之誤差算出；(D)依據誤差，將複數測定點中之離群值的測定點排除，製作抽出假想圓；以及(E)比較抽出假想圓與排除之離群值的測定點，將可追加之離群值的測定點追加至抽出假想圓，將最終的圓之中心位置算出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S101~S110:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1103" publication-number="202624819">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624819</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128813</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學元件及包含光學元件的相機模組</chinese-title>
        <english-title>OPTICAL ELEMENT AND CAMERA MODULE INCLUDING OPTICAL ELEMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120250915B">G02B7/182</main-classification>
        <further-classification edition="200601120250915B">G02B17/08</further-classification>
        <further-classification edition="202101120250915B">G03B17/28</further-classification>
        <further-classification edition="202101120250915B">G03B30/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁召渼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SO MI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高昊彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GO, HO BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金炳賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, BYUNG HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許宰赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUH, JAE HYUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學元件包括自光學元件的物體側朝向光學元件的影像側依序設置的入射表面、第一反射表面、第二反射表面、第三反射表面及出射表面。入射表面在第一方向上的長度不同於出射表面在與第一方向相交的第二方向上的長度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical element includes an incident surface, a first reflective surface, a second reflective surface, a third reflective surface, and an exit surface sequentially disposed from an object side of the optical element toward an image side of the optical element. A length of the incident surface in a first direction is different from a length of the exit surface in a second direction intersecting the first direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光學元件</p>
        <p type="p">110:入射表面</p>
        <p type="p">120:出射表面</p>
        <p type="p">130:反射表面/第一反射表面</p>
        <p type="p">140:反射表面/第二反射表面</p>
        <p type="p">150:反射表面/第三反射表面</p>
        <p type="p">A1、A2、A3:面積</p>
        <p type="p">C1:光軸/第一光軸</p>
        <p type="p">C2:第二光軸</p>
        <p type="p">C3:第三光軸</p>
        <p type="p">C4:光軸/第四光軸</p>
        <p type="p">X1、X2、Y1、Y2:長度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1104" publication-number="202624191">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624191</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128832</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>低介電常數樹脂形成用組成物、低介電常數樹脂絕緣膜、低介電常數樹脂膜、低介電常數樹脂片、低介電常數樹脂零件及電子機器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">C07C69/653</main-classification>
        <further-classification edition="200601120260309B">C07D303/02</further-classification>
        <further-classification edition="200601120260309B">C08L33/04</further-classification>
        <further-classification edition="200601120260309B">H01B3/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商捷恩智股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JNC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐郷弘毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAGO, KOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高田章博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKATA, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤原武</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIWARA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種低介電常數樹脂形成用組成物，其維持高散熱性（熱傳導性），可能的話提高該些特性，並且於維持在溶媒或其他低介電樹脂中的溶解性的狀態下提高低介電特性。一種低介電常數樹脂形成用組成物，為含有式（1）所表示的於兩末端具有聚合性基的液晶性化合物的組成物，且於該組成物中不添加無機填充劑而硬化時的硬化物於10 GHz下的相對介電常數低於3.0。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="111px" width="379px" file="ed10050.JPG" alt="ed10050.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;Z&lt;sup&gt;1&lt;/sup&gt;及Z&lt;sup&gt;2&lt;/sup&gt;為單鍵或碳數1～2的伸烷基；A&lt;sup&gt;1&lt;/sup&gt;、A&lt;sup&gt;2&lt;/sup&gt;及A&lt;sup&gt;3&lt;/sup&gt;為1,4-伸環己基或1,4-伸苯基；R&lt;sup&gt;1a&lt;/sup&gt;及R&lt;sup&gt;1b&lt;/sup&gt;為選自式（PG-1a）、式（PG-1b）及式（PG-1c）所表示的聚合性基中的基，p為0～2的整數。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="318px" width="373px" file="ed10051.JPG" alt="ed10051.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;m為1～12的整數，n為0～12的整數，Y為氫或甲基。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:帶有脫模劑的聚醯亞胺膜(150mm×150mm×0.05mm)</p>
        <p type="p">12:耐熱聚醯亞胺黏著帶(80mm×12mm×0.05mm)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1105" publication-number="202624244">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624244</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128840</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於極紫外圖案化之具有膦酸酯添加劑之有機金屬組合物</chinese-title>
        <english-title>ORGANOMETALLIC COMPOSITIONS WITH PHOSPHONATE ADDITIVES FOR EUV PATTERNING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07F7/22</main-classification>
        <further-classification edition="200601120260302B">C07F9/40</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="202601120260302B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商英培雅股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INPRIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃斯　馬修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VOSS, MATTHEW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡迪諾　布萊恩Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARDINEAU, BRIAN J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾伯勒　法比安　菲利克斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EBERLE, FABIAN FELIX</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳翠華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">闡述了含有例如甲基膦酸、三級丁基膦酸、烯丙基膦酸二乙酯、苄基膦酸及苯基膦酸等一或多種膦酸酯之有機金屬前驅物溶液。亦闡述了用於形成可輻射圖案化塗層之對應方法以及用於使用一無溶劑顯影製程來形成一圖案之方法。將膦酸酯併入例如一有機錫光阻組合物等有機金屬光阻組合物中被闡述為增加有機金屬前驅物溶液之穩定性、改善有機金屬光阻膜之均質性及／或改善有機金屬光阻塗層之圖案化效能之一種方式。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Organometallic precursor solutions containing one or more phosphonate, such as methylphosphonic acid, tert-butylphosphonic acid, diethoxyalyllphosphonate, benzylphosphonic acid, and phenylphosphonic acid, are described. Corresponding methods for forming radiation patternable coatings as well as methods for forming a pattern using a solventless developing process are also described. The incorporation of a phosphonate into an organometallic photoresist composition, such as an organotin photoresist composition, is described as a way to increase stability of organometallic precursor solutions, to improve the homogeneity of organometallic photoresist films, and/or to improve the patterning performance of organometallic photoresist coatings.</p>
      </isu-abst>
      <representative-img>
        <p type="p">PRX:非膦酸酯增強的光阻</p>
        <p type="p">PRX-P1、PRX-P2:膦酸酯增強的光阻</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1106" publication-number="202624403">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624403</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128844</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液晶性樹脂組合物及使用此之連接器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">C08L67/00</main-classification>
        <further-classification edition="200601120260305B">C08G63/60</further-classification>
        <further-classification edition="200601120260305B">C08K7/14</further-classification>
        <further-classification edition="201801120260305B">C08K3/013</further-classification>
        <further-classification edition="200601120260305B">H01R13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商寶理塑料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POLYPLASTICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>望月光博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOCHIZUKI, MITSUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青藤宏光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEITOH, HIROMITSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長永昭宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAE, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川原俊紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAHARA, TOSHINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供賦予低翹曲性優良、起泡的發生受到抑制的成形品之流動性良好的液晶性樹脂組合物及使用此之連接器。  &lt;br/&gt;本發明之液晶性樹脂組合物含有（A）全芳香族聚酯、（B）板狀填充劑、及（C）纖維狀填充劑，其中，上述（A）全芳香族聚酯含有指定量的下列結構單元（I）～（V）為必要結構成分，上述（C）纖維狀填充劑的重量平均纖維長度為500μm以下，相對於上述液晶性樹脂組合物全體，上述（A）全芳香族聚酯的含量為70～85質量%，上述（B）板狀填充劑的含量為10～25質量%，上述（C）纖維狀填充劑的含量為1.5～8.5質量%，上述（B）板狀填充劑及上述（C）纖維狀填充劑的總和含量為15～30質量%。本發明之連接器包含上述液晶性樹脂組合物的成形品。  &lt;br/&gt;&lt;img align="absmiddle" height="571px" width="479px" file="ed10007.JPG" alt="ed10007.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1107" publication-number="202625283">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625283</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128859</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池單體組件</chinese-title>
        <english-title>BATTERY CELL ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260311B">H01M10/6554</main-classification>
        <further-classification edition="202101120260311B">H01M50/289</further-classification>
        <further-classification edition="201401120260311B">H01M10/625</further-classification>
        <further-classification edition="201401120260311B">H01M10/643</further-classification>
        <further-classification edition="202101120260311B">H01M50/213</further-classification>
        <further-classification edition="202101120260311B">H01M50/224</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安志明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AN, JI MYONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">與本示例相關的一種電池單體組件可包括多個電池單體、多個電池單體安裝於其上的框架、耦接至框架的下表面的下蓋、具有多個端子孔的下軟質部，端子孔布置成使得各電池單體的端子分別被暴露且介於框架和下蓋之間，因此下軟質部布置成壓接固定至框架和下蓋，以及多個散熱墊，多個散熱墊插入端子孔中、結合至多個電池單體的多個端子，並布置成將各電池單體的端子的熱量傳遞至下蓋的側邊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A battery cell assembly related to the present example may comprise a plurality of battery cells, a frame on which the plurality of battery cells is mounted, a lower cover coupled to a lower surface of the frame, a lower soft portion having a plurality of terminal holes arranged so that terminals of the respective battery cells are individually exposed, and interposed between the frame and the lower cover, and thus arranged to be press-fixed to the frame and the lower cover, and a plurality of heat dissipation pads inserted into the terminal holes, bonded to the terminals of the battery cells, and arranged to transfer heat of the terminals of the respective battery cells to the side of the lower cover.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電池單體組件</p>
        <p type="p">110:電池單體</p>
        <p type="p">111:正極端子</p>
        <p type="p">112:捲邊槽</p>
        <p type="p">113:端子、負極端子</p>
        <p type="p">115:負極連接部</p>
        <p type="p">121:第一本體</p>
        <p type="p">121a、125a:上表面</p>
        <p type="p">122:第一槽</p>
        <p type="p">124:第二槽</p>
        <p type="p">125:第二本體</p>
        <p type="p">126:單體空間</p>
        <p type="p">127:第一固定突起</p>
        <p type="p">128:第二固定突起</p>
        <p type="p">130:上軟質部</p>
        <p type="p">131:第一軟孔</p>
        <p type="p">133:第一固定孔</p>
        <p type="p">135:第一安裝孔</p>
        <p type="p">140:上蓋</p>
        <p type="p">141:第一蓋孔</p>
        <p type="p">142:第二蓋孔</p>
        <p type="p">143:電極端子塊</p>
        <p type="p">150:中間軟質部</p>
        <p type="p">151:第三軟孔</p>
        <p type="p">153:第三固定孔</p>
        <p type="p">155:第三安裝孔</p>
        <p type="p">160:下軟質部</p>
        <p type="p">161:軟槽</p>
        <p type="p">170:下蓋</p>
        <p type="p">180:散熱墊</p>
        <p type="p">190:網板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1108" publication-number="202624444">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624444</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128874</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶圓加工用暫時接著劑、晶圓積層體及薄型晶圓之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">C09J183/05</main-classification>
        <further-classification edition="200601120260305B">C09J183/07</further-classification>
        <further-classification edition="200601120260305B">B01J27/13</further-classification>
        <further-classification edition="200601120260305B">C09D183/07</further-classification>
        <further-classification edition="202601120260305B">H10P95/60</further-classification>
        <further-classification edition="201801120260305B">C09J7/20</further-classification>
        <further-classification edition="200601120260305B">C09J11/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石﨑伸一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIZAKI, SHINICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武藤光夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUTO, MITSUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菅生道</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGO, MICHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種晶圓加工用暫時接著劑，用以將晶圓暫時接著於支撐體，前述晶圓加工用暫時接著劑係由可透過矽氫化反應硬化之硬化性聚矽氧樹脂組成物所構成，前述硬化性聚矽氧樹脂組成物係含有於1分子中僅具有1個烯基或僅具有1個與矽原子鍵結之氫原子(SiH基)之有機聚矽氧烷。因此即使使用高段差基板也具有充分之接合後基板保持性，對晶圓背面磨削步驟、TSV形成步驟、晶圓背面配線步驟具有高步驟適合性，且即使在接合後於空氣中經過高溫且長時間之熱製程後，剝離步驟中之剝離也容易，且剝離後基板之殘渣洗淨性也優異等，可提供有助於提升薄型晶圓生產性之晶圓加工用暫時接著劑、晶圓積層體，以及使用其之薄型晶圓之製造方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1109" publication-number="202623898">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623898</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128898</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>離子交換膜、離子交換膜之製造方法、膜電極接合體及氫製造裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260309B">B01J47/12</main-classification>
        <further-classification edition="200601120260309B">C08J5/22</further-classification>
        <further-classification edition="200601120260309B">C08J3/28</further-classification>
        <further-classification edition="200601120260309B">C08F12/18</further-classification>
        <further-classification edition="200601120260309B">C08F2/50</further-classification>
        <further-classification edition="200601120260309B">B01D71/28</further-classification>
        <further-classification edition="200601120260309B">B01D69/10</further-classification>
        <further-classification edition="202101120260309B">C25B9/19</further-classification>
        <further-classification edition="202101120260309B">C25B1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商德山股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKUYAMA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浅田陽亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASADA, YOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上森理弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UWAMORI, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種離子交換膜，其係具有短邊及80m以上的長邊之離子交換膜，以特定方法算出的膜厚偏差率A、離子交換容量偏差率B及離子交換基殘存率C為特定數值範圍內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:氫製造裝置</p>
        <p type="p">2:第1電極室</p>
        <p type="p">3:第2電極室</p>
        <p type="p">4:膜電極接合體</p>
        <p type="p">5:陰離子交換膜</p>
        <p type="p">6:第1電極</p>
        <p type="p">7:第2電極</p>
        <p type="p">8:氫排出管</p>
        <p type="p">9:氧排出管</p>
        <p type="p">10:水供給管</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1110" publication-number="202625248">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625248</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128917</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電漿處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">H01J37/32</main-classification>
        <further-classification edition="202601120260302B">H10P72/70</further-classification>
        <further-classification edition="200601120260302B">H02N13/00</further-classification>
        <further-classification edition="200601120260302B">H05H1/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日立全球先端科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翠和志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIDORI, KAZUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田原正太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAHARA, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溝脇悠展</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZOWAKI, HIRONOBU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種電漿處理裝置，其執行無需降溫工程即可提升試料溫度並能減少對靜電吸盤之損害的試料分離方法。電漿處理裝置的控制裝置，在藉由溫度調節裝置維持試料台的溫度不超過0℃進行試料的電漿處理時，藉由所定值的高頻電力生成用於使靜電吸附在試料台上的試料從試料台分離的電漿，在生成用於使靜電吸附在試料台上的試料從試料台分離的電漿後，將試料升高至試料台上方，在將試料升高至試料台上方後經過所定時間後，停止高頻電源的輸出，在停止高頻電源的輸出後，將該試料從該處理室搬出。所定值為高於用於生成試料電漿處理之電漿的高頻電力值之高頻電力值，所定時間為試料溫度到達所定溫度的時間。所定溫度為附著在試料上的附著物揮發的溫度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1111" publication-number="202624519">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624519</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128941</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>釕薄膜的形成方法</chinese-title>
        <english-title>METHOD FOR FORMING RUTHENIUM THIN FILM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C23C16/16</main-classification>
        <further-classification edition="200601120260302B">C23C16/44</further-classification>
        <further-classification edition="200601120260302B">C23C16/455</further-classification>
        <further-classification edition="202601120260302B">H10P14/40</further-classification>
        <further-classification edition="202601120260302B">H10P14/43</further-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔚山科學技術院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNIST (ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商田中貴金屬工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA PRECIOUS METAL TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金秀賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SOO-HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金廷河</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JEONGHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫藝瑟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SON, YESEUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小次洋平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOTSUGI, YOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原田了輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARADA, RYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>津川智広</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUGAWA, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種藉由原子層蒸鍍法形成釕薄膜之方法。本發明中，在釕前驅物於高溫下易產生熱分解之情況時，注入作為追加反應氣體之氨，以進行釕薄膜之成膜。本發明係關於可維持優異薄膜特性之高性能6-step(6階段)原子層蒸鍍法。於本發明中，於作為主要反應氣體之氧之注入及清除階段之後，注入並清除作為追加反應氣體之氨，即可達到增大釕之結晶粒及降低雜質濃度之效果，藉此減少薄膜之比電阻。在本發明中成膜之釕薄膜比僅藉由既存氧反應氣體之釕薄膜更可提高特性。藉此本發明可作為代替銅配線之新型金屬配線原料及成膜技術而加以利用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for forming a ruthenium thin film by atomic layer deposition, in which ammonia is injected as an additional reactive gas under high temperature where a thermal decomposition of a ruthenium precursor occurs, to form a ruthenium thin film. This is a high-performance 6-step atomic layer deposition that can maintain excellent thin film properties, in which after steps of injecting and purging oxygen as a main reactive gas, ammonia as an additional reactive gas is injected and purged, thereby increasing the ruthenium crystal grains and reduces the impurity concentration, and reducing the specific resistance of the thin film. The ruthenium thin film formed by the present invention has improved properties compared to existing ruthenium thin films formed only with oxygen reactive gas, and can be used as a new metal wiring material and film formation technology to replace copper wiring.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1112" publication-number="202623823">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623823</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128987</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含類脂質化合物之組成物及相關用途</chinese-title>
        <english-title>COMPOSITIONS COMPRISING LIPIDOID COMPOUNDS AND RELATED USES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/711</main-classification>
        <further-classification edition="200601120260302B">A61K31/7088</further-classification>
        <further-classification edition="200601120260302B">A61K31/7024</further-classification>
        <further-classification edition="202501120260302B">A61K9/127</further-classification>
        <further-classification edition="200601120260302B">A61K47/18</further-classification>
        <further-classification edition="200601120260302B">A61K47/24</further-classification>
        <further-classification edition="200601120260302B">A61K47/14</further-classification>
        <further-classification edition="200601120260302B">A61K48/00</further-classification>
        <further-classification edition="200601120260302B">A61P1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商波西達治療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POSEIDA THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐明皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, MINGHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃麗君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, LIJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴維斯　艾莉西亞　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAVIS, ALICIA M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維穆里　戈皮　納特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VEMURI, GOPI NATH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈吉　可哈立德　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAJJ, KHALID A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示包含類脂質化合物的組成物、製備此等組成物之方法以及此等組成物在基因遞送應用中之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Compositions comprising lipidoid compounds, methods of preparing such compositions, and the use of these compositions in gene delivery applications are disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1113" publication-number="202624893">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624893</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128989</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＥＵＶ光源模組、ＥＵＶ聚光鏡及其光圈插件</chinese-title>
        <english-title>LIGHT SOURCE MODULE FOR EUV LIGHT, EUV COLLECTOR MIRROR AND APERTURE INSERT THEREFOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">G03F7/20</main-classification>
        <further-classification edition="200601120260304B">H05G2/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARL ZEISS SMT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B. V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈里森　克萊默　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARRISON, KRAMER DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維恩　保羅　范　德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VEEN, PAUL VAN DER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱納　馬丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JURNA, MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科克羅爾斯　吉恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOCKEROLS, JEAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案揭示一種EUV光源模組（2），其具有一個或更多用以產生泵浦光（26）的泵浦光源（27）、一EUV聚光鏡（22）、用於遮蔽EUV光學器件免受該泵浦光（26）影響的一遮擋結構（30），以及用於將遮擋結構（30）安裝在主焦點（PF）和中間焦點（IF）之間的一安裝桿（31）。所述EUV聚光鏡（22）具有帶一主焦點（PF）和一中間焦點（IF）的一反射表面（23），用於將從主焦點（PF）周圍的源區域（24）照射到反射表面（23）上的可用EUV光反射到中間焦點（IF）之外的一後續EUV光學器件，並且具有用於泵浦光（26）的一內光圈（29）。所述遮擋結構（30）配置為不阻擋源自該主焦點（PF）並被該反射表面（23）反射朝向該中間焦點（IF）的任何光路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light source module (2) for EUV light has one or more pump light sources (27) to produce pump light (26), an EUV collector mirror(22), an obscuration structure (30) for shielding the EUV optics from the pump light (26), and a mounting rod (31) for mounting the obscuration structure (30) between the primary focus (PF) and the intermediate focus (IF). The EUV collector mirror (22) has a reflection surface (23) having a primary focus (PF) and an intermediate focus (IF) for reflecting usable EUV light, which impinges on the reflection surface (23) from a source region (24) around the primary focus (PF), to a subsequent EUV optics beyond the intermediate focus (IF), and an inner aperture (29) for the pump light (26). The obscuration structure (30) is configured not to block any light path originating in the primary focus (PF) and being reflected by the reflection surface (23) towards the intermediate focus (IF).</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:光源模組</p>
        <p type="p">20:光源外殼</p>
        <p type="p">21:源光圈</p>
        <p type="p">22:EUV聚光鏡</p>
        <p type="p">23:反射表面</p>
        <p type="p">24:源區域</p>
        <p type="p">25:光軸</p>
        <p type="p">26:泵浦光</p>
        <p type="p">27:泵浦光源</p>
        <p type="p">28:泵浦光聚焦單元</p>
        <p type="p">29:內光圈</p>
        <p type="p">30:遮擋結構</p>
        <p type="p">31:安裝桿</p>
        <p type="p">A:聚光光圈</p>
        <p type="p">B:直徑</p>
        <p type="p">IF:中間焦點</p>
        <p type="p">L:距離</p>
        <p type="p">PF:主焦點</p>
        <p type="p">III:細部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1114" publication-number="202624075">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624075</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129065</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>跨坐型車輛</chinese-title>
        <english-title>STRADDLED VEHICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120251121B">B62M6/80</main-classification>
        <further-classification edition="201001120251121B">B62M6/90</further-classification>
        <further-classification edition="200601120251121B">B62K11/02</further-classification>
        <further-classification edition="200601120251121B">B62K11/04</further-classification>
        <further-classification edition="202001120251121B">B62J43/20</further-classification>
        <further-classification edition="202001120251121B">B62J43/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商山葉發動機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAHA HATSUDOKI KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北村直樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAMURA, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠不損及行駛性地搭載大型之電池組之跨坐型車輛。  &lt;br/&gt;本發明之跨坐型車輛1具備車體框架2、座部5、左右一對擱腳台8、車體外殼9及電池組10。左右一對擱腳台8配置於較座部5更靠前方且較座部5更靠下方。車體外殼9包含通道T。通道T形成於前後方向上之頭管11與座部5之間且左右一對擱腳台8之間。電池組10配置於通道T。電池組10配置於車體框架2之左右一對上框架14之間及車體框架2之左右一對下框架13之間。電池組10之上端配置於較左右一對上框架14之上緣更靠上方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:車體框架</p>
        <p type="p">10:電池組</p>
        <p type="p">10a:組中央部</p>
        <p type="p">10b:組上部</p>
        <p type="p">10c:組下部</p>
        <p type="p">11:頭管</p>
        <p type="p">12:左右一對向下框架</p>
        <p type="p">12a:左向下框架</p>
        <p type="p">12b:右向下框架</p>
        <p type="p">13a:左下框架</p>
        <p type="p">13b:右下框架</p>
        <p type="p">14:左右一對上框架</p>
        <p type="p">14a:左上框架</p>
        <p type="p">14b:右上框架</p>
        <p type="p">15:左右一對座部框架</p>
        <p type="p">15a:左座部框架</p>
        <p type="p">15b:右座部框架</p>
        <p type="p">16:後框架</p>
        <p type="p">16a:左後框架</p>
        <p type="p">17:補強框架</p>
        <p type="p">37:第1托架</p>
        <p type="p">37a:第1左托架</p>
        <p type="p">37b:第1右托架</p>
        <p type="p">38:第2托架</p>
        <p type="p">41:外部電源連接部</p>
        <p type="p">42:充電器</p>
        <p type="p">43:冷卻部</p>
        <p type="p">45:散熱器</p>
        <p type="p">N:開口部</p>
        <p type="p">T:通道</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1115" publication-number="202624076">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624076</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129066</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>跨坐型車輛</chinese-title>
        <english-title>STRADDLED VEHICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">B62M7/04</main-classification>
        <further-classification edition="200601120251201B">B62M7/06</further-classification>
        <further-classification edition="202001120251201B">B62J43/28</further-classification>
        <further-classification edition="200601120251201B">B62K11/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商山葉發動機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAHA HATSUDOKI KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北村直樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAMURA, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>春名椋太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARUNA, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠不損及行駛性及便利性地搭載大型之電池組之跨坐型車輛。  &lt;br/&gt;本發明之跨坐型車輛1具備車體框架2、左右一對擱腳台8、車體外殼9、電池組10、收納箱50及驅動馬達單元6。車體外殼9包含通道T。通道T形成於前後方向上之頭管11與座部5之間且左右一對擱腳台8之間。電池組10配置於通道T。收納箱50於座部5之下方與電池組10之上部於前後方向上重疊。收納箱50配置於左右一對座部框架15之間。驅動馬達單元6與電池組10之下部於前後方向上重疊，且配置於較收納箱50更靠下方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:車體框架</p>
        <p type="p">5:座部</p>
        <p type="p">5a:座部之前部之上表面</p>
        <p type="p">6:驅動馬達單元</p>
        <p type="p">6a:第1安裝部</p>
        <p type="p">6b:第2安裝部</p>
        <p type="p">6c:凹部</p>
        <p type="p">10:電池組</p>
        <p type="p">10a:組中央部</p>
        <p type="p">10b:組上部</p>
        <p type="p">10c:組下部</p>
        <p type="p">11:頭管</p>
        <p type="p">12:左右一對向下框架</p>
        <p type="p">13:左右一對下框架</p>
        <p type="p">13a:左下框架</p>
        <p type="p">14a:左上框架</p>
        <p type="p">15:左右一對座部框架</p>
        <p type="p">15a:左座部框架</p>
        <p type="p">16:後框架</p>
        <p type="p">16a:左後框架</p>
        <p type="p">23:座部開閉構造</p>
        <p type="p">24:擺動部</p>
        <p type="p">25:擺動限制部</p>
        <p type="p">27:單元支持構件</p>
        <p type="p">34:左右一對後側外殼</p>
        <p type="p">34b:右後側外殼</p>
        <p type="p">35:上外殼</p>
        <p type="p">35a:上表面</p>
        <p type="p">35b:上表面</p>
        <p type="p">41:外部電源連接部</p>
        <p type="p">42:充電器</p>
        <p type="p">43:冷卻部</p>
        <p type="p">44:電壓轉換器</p>
        <p type="p">50:收納部</p>
        <p type="p">60:馬達控制器單元</p>
        <p type="p">P1:馬達輸出軸</p>
        <p type="p">T:通道</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1116" publication-number="202624049">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624049</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129067</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>跨坐型車輛</chinese-title>
        <english-title>STRADDLED VEHICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251121B">B60R16/03</main-classification>
        <further-classification edition="200601120251121B">B60R16/04</further-classification>
        <further-classification edition="201001120251121B">B62M6/80</further-classification>
        <further-classification edition="201001120251121B">B62M6/90</further-classification>
        <further-classification edition="200601120251121B">B62K11/02</further-classification>
        <further-classification edition="200601120251121B">B62K11/04</further-classification>
        <further-classification edition="202001120251121B">B62J43/20</further-classification>
        <further-classification edition="202001120251121B">B62J43/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商山葉發動機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAHA HATSUDOKI KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北村直樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAMURA, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浦野康太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>URANO, KOUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠高效率地進行佈局之跨坐型車輛。  &lt;br/&gt;本發明之跨坐型車輛1係速克達型之跨坐型車輛，且具備充電器42、電池組43、頭管11、護腿板33、擱腳台36、座部5、向下框架12、上框架14及下框架13。充電器42將交流電轉換為直流電。電池組43被充電器42供給直流電。在護腿板33與座部5之間、且一對擱腳台36之間形成有通道T。充電器42與電池組43配置於沿著車輛前後方向之通道T之內部空間。充電器42配置於電池組43之上方。充電器43配置於較一對上框架14更靠上方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:車體框架</p>
        <p type="p">5:座部</p>
        <p type="p">5a:座部之前端</p>
        <p type="p">6:動力單元</p>
        <p type="p">10:儲物箱</p>
        <p type="p">11:頭管</p>
        <p type="p">11a:前端</p>
        <p type="p">12:向下框架</p>
        <p type="p">13:下框架</p>
        <p type="p">13a:第1下框架</p>
        <p type="p">14a:第1上框架</p>
        <p type="p">14ae:彎折部分</p>
        <p type="p">15:座架</p>
        <p type="p">15a:第1座架</p>
        <p type="p">16:後框架</p>
        <p type="p">16a:第1後框架</p>
        <p type="p">35:上外殼</p>
        <p type="p">41:外部電源連接部</p>
        <p type="p">42:充電器</p>
        <p type="p">43:電池組</p>
        <p type="p">43b:下表面</p>
        <p type="p">43f:電池組之前端</p>
        <p type="p">43r:電池組之後端</p>
        <p type="p">44:電壓轉換器</p>
        <p type="p">60:充電器本體</p>
        <p type="p">61:外部側連接部</p>
        <p type="p">62:電池組連接部</p>
        <p type="p">63:冷卻部</p>
        <p type="p">71:充電器連接部</p>
        <p type="p">F:箭頭</p>
        <p type="p">L1:鉛直線</p>
        <p type="p">L2:鉛直線</p>
        <p type="p">R:區域</p>
        <p type="p">T:通道</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1117" publication-number="202624068">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624068</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129068</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>跨坐型電動車輛</chinese-title>
        <english-title>ELECTRIC STRADDLED VEHICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120251121B">B62J11/10</main-classification>
        <further-classification edition="202001120251121B">B62J11/19</further-classification>
        <further-classification edition="202001120251121B">B62J50/30</further-classification>
        <further-classification edition="201001120251121B">B62M6/80</further-classification>
        <further-classification edition="201001120251121B">B62M6/90</further-classification>
        <further-classification edition="201001120251121B">B62M9/127</further-classification>
        <further-classification edition="201001120251121B">B62M9/137</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商山葉發動機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAHA HATSUDOKI KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北村直樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAMURA, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係在電池配置於中央通道之跨坐型電動車輛中，提高連接電池與馬達控制單元之纜線之走線佈局之自由度。  &lt;br/&gt;本發明之跨坐型電動車輛1具備電池10、電動動力單元6及第1纜線45。電池10配置於中央通道37，該中央通道37配置於左右一對擱腳台8之間。電動動力單元6包含配置於電池10之後方之馬達控制單元19。第1纜線45連接馬達控制單元19與電池10。馬達控制單元19包含連接於第1纜線45之連接器19a。連接器19a相對於車寬方向之中心配置於車寬方向之一側。第1纜線45相對於車寬方向之中心，於車寬方向之另一側沿著電池10之側面在車輛前後方向延伸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電池</p>
        <p type="p">19:馬達控制單元</p>
        <p type="p">19a:連接器(第1連接器之一例)</p>
        <p type="p">24:電池殼體</p>
        <p type="p">24a:第1部分</p>
        <p type="p">24b:第2部分</p>
        <p type="p">24c:第3部分</p>
        <p type="p">41:外部電源連接部</p>
        <p type="p">42:充電器</p>
        <p type="p">42a:第1充電器連接器</p>
        <p type="p">42b:第2充電器連接器</p>
        <p type="p">44:DC/DC轉換器</p>
        <p type="p">44a:連接器</p>
        <p type="p">45:第1纜線</p>
        <p type="p">45a:第1延伸部</p>
        <p type="p">45b:第2延伸部</p>
        <p type="p">46:第2纜線</p>
        <p type="p">47:纜線</p>
        <p type="p">48:纜線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1118" publication-number="202623781">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623781</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129092</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化妝料</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">A61K8/34</main-classification>
        <further-classification edition="200601120260303B">A61K8/891</further-classification>
        <further-classification edition="200601120260303B">A61K8/81</further-classification>
        <further-classification edition="200601120260303B">A61K8/63</further-classification>
        <further-classification edition="200601120260303B">A61K8/46</further-classification>
        <further-classification edition="200601120260303B">A61Q5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商高絲股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>有村理佐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARIMURA, RISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下美年雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHITA, MINEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供一種濕髮之相容良好度優異，進而具有優異之使用性及經時安定性之化妝料。  &lt;br/&gt;　　作為解決手段，本發明為一種化妝料，其係含有下述成分(A)~(E)；  &lt;br/&gt;　　(A)折射率為1.42~1.47之多元醇，  &lt;br/&gt;　　(B)矽氧油，  &lt;br/&gt;　　(C)HLB為7以上之非離子性界面活性劑 1質量%以下，  &lt;br/&gt;　　(D)兩親媒性高分子，  &lt;br/&gt;　　(E)水 10質量%以下，  &lt;br/&gt;　　且相對於前述成分(A)之前述成分(B)之含有質量比例(B)/(A)為1~30。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1119" publication-number="202624546">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624546</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129093</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水電解裝置、控制方法及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260302B">C25B1/04</main-classification>
        <further-classification edition="202101120260302B">C25B15/02</further-classification>
        <further-classification edition="202101120260302B">C25B15/021</further-classification>
        <further-classification edition="202101120260302B">C25B15/025</further-classification>
        <further-classification edition="202101120260302B">C25B15/027</further-classification>
        <further-classification edition="200601120260302B">C25B15/08</further-classification>
        <further-classification edition="202101120260302B">C25B9/23</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱重工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI HEAVY INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡辺悠太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浦下靖崇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>URASHITA, YASUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弦卷茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSURUMAKI, SHIGERU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>本大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUKAMOTO, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種水電解裝置，具備：水電解堆，其係具有在一對分離器之間配置了固體高分子電解質膜的水電解單元，使用水電解單元來電解電解液；電力供給部，其係與水電解堆電性連接；電解液路徑，其係循環供給電解液到水電解單元；第1溫度感測器，其係可以量測在水電解堆的入口流動的電解液的入口溫度；第2溫度感測器，其係可以量測在分離器的電解部形成的多個流路的出口流動的電解液的流路出口溫度；以及控制部，其係根據第1溫度感測器的入口溫度及第2溫度感測器的流路出口溫度，來進行調整電解部的電解液的流量、溫度及電流量中至少其中一個的控制，使得在分離器的電解部的一部分已提升的溫度降低。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:水電解裝置</p>
        <p type="p">11:水電解單元</p>
        <p type="p">12:電力供給部</p>
        <p type="p">14:第1電解液路徑</p>
        <p type="p">14a,17a:入口路徑</p>
        <p type="p">14b,17b:出口路徑</p>
        <p type="p">15:第1氣液分離槽</p>
        <p type="p">15a,18a:過濾器</p>
        <p type="p">16:氧氣提取路徑</p>
        <p type="p">17:第2電解液路徑</p>
        <p type="p">18:第2氣液分離槽</p>
        <p type="p">19:氫氣提取路徑</p>
        <p type="p">21:水電解堆</p>
        <p type="p">22:固體高分子電解質膜</p>
        <p type="p">23:陽極側</p>
        <p type="p">24:陰極側</p>
        <p type="p">31:第1循環泵</p>
        <p type="p">32:第2循環泵</p>
        <p type="p">33:氫控制閥</p>
        <p type="p">34:輔助路徑</p>
        <p type="p">35:緩衝罐</p>
        <p type="p">36:水排出閥</p>
        <p type="p">41:第1供水路徑</p>
        <p type="p">42:第1供水閥</p>
        <p type="p">43:第2供水路徑</p>
        <p type="p">44:第2供水閥</p>
        <p type="p">60:調整部</p>
        <p type="p">70:控制部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1120" publication-number="202624249">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624249</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129098</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用環磷核苷的寡核苷酸合成法</chinese-title>
        <english-title>OLIGONUCLEOTIDE SYNTHESIS USING CYCLIC-PHOSPHOROUS NUCLEOSIDES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07H1/00</main-classification>
        <further-classification edition="200601120260302B">C07H21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商美國禮來大藥廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELI LILLY AND COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美國麻省理工學院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASSACHUSETTS INSTITUTE OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬汀里　約瑟夫　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARTINELLI, JOSEPH R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅伊　史考特　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAY, SCOTT A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉小凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, XIAOFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴克沃德　史蒂芬　Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUCHWALD, STEPHEN L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕蘇卡　馬赫什　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARSUTKAR, MAHESH M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘保龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, BAOLONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供製備寡核苷酸之方法。在某些實施例中，本發明提供使用環磷酸酯或環硫代磷酸酯核苷製備寡核苷酸之方法。在某些實施例中，本發明提供使用選自經取代硫醇親核劑、經取代氮基親核劑、經取代膦親核劑、鹵化物、假鹵化物、疊氮化物及經取代鋰基親核劑之親核劑製備寡核苷酸之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides methods for preparing oligonucleotides. In certain embodiments, the present disclosure provides methods for preparing oligonucleotides using cyclic- phosphate or cyclic-thiophosphate nucleosides. In certain embodiments, the present disclosure provides methods for preparing oligonucleotides using nucleophiles selected from substituted thiol nucleophiles, substituted nitrogen-based nucleophiles, substituted phosphine nucleophiles, halides, pseudohalides, azides, and substituted lithium-based nucleophiles.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1121" publication-number="202624404">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624404</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129106</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>黃變減少之液體聚矽氧組成物</chinese-title>
        <english-title>LIQUID SILICONE COMPOSITION WITH REDUCED YELLOWING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08L71/02</main-classification>
        <further-classification edition="200601120260302B">C08L83/05</further-classification>
        <further-classification edition="200601120260302B">C08L83/07</further-classification>
        <further-classification edition="200601120260302B">C08K5/01</further-classification>
        <further-classification edition="200601120260302B">C08K5/39</further-classification>
        <further-classification edition="200601120260302B">C08K5/40</further-classification>
        <further-classification edition="200601120260302B">C09K5/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商陶氏有機矽公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOW SILICONES CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張淑華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, SHUHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳葉君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YEJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　佔傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, ZHANJIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於製備包含線性有機聚矽氧烷之液體聚矽氧組成物的程序，其包括下列步驟：(a)將(A)每分子平均具有一或多個SiH基團之聚有機氫矽氧烷、(B)平均具有一或多個烯基之特定烯基官能性化合物、及(C)鉑(0)錯合物催化劑合併在一起，以形成反應混合物；其限制條件為若(A)含有超過一個SiH基團，則(B)含有一個烯基；(b)使由步驟(a)獲得之該反應混合物在使得至少部分(A)及至少部分(B)反應以形成該線性有機聚矽氧烷的條件下反應；及(c)在(A)之該等SiH基團之轉化率大於95%時，將由步驟(b)獲得之該反應混合物與二硫化秋蘭姆(thiuram)化合物以特定莫耳當量比合併，以獲得該液體聚矽氧組成物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A process for preparing a liquid silicone composition comprising a linear organopolysiloxane includes the steps of: (a) combining (A) a polyorganohydrogensiloxane having an average of one or more SiH groups per molecule, (B) a specific alkenyl-functional compound having an average of one or more alkenyl groups, and (C) a platinum(0) complex&lt;b/&gt;catalyst together to form a reaction mixture; provided that, if (A) contains more than one SiH group, (B) contains one alkenyl group; (b) reacting the reaction mixture obtained from step (a) under conditions such that at least part of (A) and at least part of (B) react to form the linear organopolysiloxane; and (c) upon conversion of greater than 95% of the SiH groups of (A), combining the reaction mixture obtained from step (b) with a thiuram disulfide compound at a specific molar equivalent ratio to obtain the liquid silicone composition.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1122" publication-number="202625267">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625267</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129109</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>陰極活性材料之鋰化前驅物</chinese-title>
        <english-title>LITHIATED PRECURSOR FOR CATHODE ACTIVE MATERIALS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">H01M4/36</main-classification>
        <further-classification edition="200601120260306B">H01M4/04</further-classification>
        <further-classification edition="200601120260306B">H01M4/02</further-classification>
        <further-classification edition="201001120260306B">H01M4/139</further-classification>
        <further-classification edition="201001120260306B">H01M10/0525</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商亞比馬利股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALBEMARLE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡馨郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, SINGYUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊斯塔普　布蘭迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EASTUP, BRANDY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供製造一經過氧化鋰塗佈之過渡金屬前驅物之方法，該等方法包含：混合氫氧化鋰及過氧化氫以形成一懸浮液；向該懸浮液添加一沉澱劑以加速過氧化鋰之沉澱；及將一過渡金屬前驅物添加至該懸浮液中以形成一經過氧化鋰塗佈之過渡金屬前驅物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are methods of making a lithium peroxide-coated transition metal precursor comprising: mixing lithium hydroxide and hydrogen peroxide to form a suspension; adding a precipitant to the suspension to accelerate precipitation of lithium peroxide; and adding a transition metal precursor into the suspension to form a lithium peroxide-coated transition metal precursor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1123" publication-number="202623858">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623858</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129135</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>分析高爾夫揮桿的方法和系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR ANALYZING GOLF SWING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">A63B24/00</main-classification>
        <further-classification edition="200601120260302B">A63B71/06</further-classification>
        <further-classification edition="201701120260302B">G06T7/20</further-classification>
        <further-classification edition="201501320260302B">A63B102/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商可利愛馳有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CREATZ INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金鍾澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JONG TACK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪基皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, KI HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李正奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JUNG KYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁東恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, DON GEUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴淵旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, YOUN UK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明之一個態樣，提供一種用於分析一高爾夫揮桿之方法，該方法包含以下步驟：獲取一使用者之高爾夫揮桿之一視訊；自該高爾夫揮桿視訊取樣視訊圖框；以及自這些視訊圖框提取關於一球桿頭部之一位置之第一資訊，且基於該第一資訊顯示該球桿頭部之一揮桿軌跡，其中在取樣步驟中，針對根據使用者動作而拆分的至少兩個揮桿區段所應用的取樣間隔為不同的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">According to one aspect of the present invention, there is provided a method for analyzing a golf swing, the method comprising the steps of: acquiring a video of a user's golf swing; sampling video frames from the golf swing video; and extracting first information on a position of a club head from the video frames, and displaying a swing trajectory of the club head on the basis of the first information, wherein in the sampling step, sampling intervals applied to at least two swing segments separated according to the user's motion are different.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:高爾夫揮桿分析系統</p>
        <p type="p">210:視訊獲取單元</p>
        <p type="p">220:圖框取樣單元</p>
        <p type="p">230:揮桿軌跡顯示單元</p>
        <p type="p">240:揮桿軌跡校正單元</p>
        <p type="p">250:回饋資訊產生單元</p>
        <p type="p">260:資訊提供單元</p>
        <p type="p">270:通訊單元</p>
        <p type="p">280:控制單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1124" publication-number="202625685">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625685</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129167</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>噴灑頭總成及方法</chinese-title>
        <english-title>SHOWERHEAD ASSEMBLY AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260310B">H10P14/43</main-classification>
        <further-classification edition="200601120260310B">C23C16/455</further-classification>
        <further-classification edition="200601120260310B">C23C16/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬蘭商皮寇桑公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PICOSUN OY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏爾馬　瓦倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHARMA, VARUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆罕默德　薩夫達爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUHAMMAD, SAFDAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於基體處理設備(200)的方法和噴灑頭總成(100)，其包含界定一第一容積(115)於其間的一底壁(130)與一頂壁(120)；饋送前驅物流(Fp)至該第一容積(115)的一或多個前驅物入口(150)；在該底壁(130)中的一注射開口(140)，其形成從該第一容積(115)朝向該基體處理設備(200)之一反應容積(215)的一流體連通路徑；及在該第一容積(115)內的一環狀噴灑頭元件(110)，其從該底壁(130)延伸到頂壁(120)且包圍該注射開口(140)以分佈該前驅物流(Fp)到該注射開口(140)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and a showerhead assembly (100) for a substrate processing apparatus (200), comprisinga bottom wall(130) and a top wall (120) defining a first volume (115) therebetween, one or more precursor inlets (150) to feed precursor flow (Fp) to the first volume (115), an injection opening (140) in the bottom wall (130) forming a fluid communication path from the first volume (115) towards a reaction volume (215) of the substrate processing apparatus (200), and a ringlike showerhead element (110) within the first volume (115) extending from the bottom wall(130) to the top wall(120) and surrounding the injection opening (140) to distribute the precursor flow (Fp) to the injection opening (140).</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:噴灑頭總成</p>
        <p type="p">110:環狀噴灑頭元件</p>
        <p type="p">110h:孔</p>
        <p type="p">130:底壁</p>
        <p type="p">140:注射開口</p>
        <p type="p">150:前驅物入口</p>
        <p type="p">160:流體出口</p>
        <p type="p">170:惰性流體入口</p>
        <p type="p">180:分離元件</p>
        <p type="p">Fi:惰性流體流</p>
        <p type="p">Fo:出口流</p>
        <p type="p">Fp:前驅物流</p>
        <p type="p">Fr:旋轉流</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1125" publication-number="202624126">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624126</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129193</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>單晶膜、積層構造體、半導體裝置、電子儀器及系統</chinese-title>
        <english-title>SINGLE CRYSTAL FILMS, LAYERED STRUCTURES, SEMICONDUCTOR DEVICES, ELECTRONIC DEVICES, AND SYSTEMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">C01G17/02</main-classification>
        <further-classification edition="200601120260312B">C23C14/16</further-classification>
        <further-classification edition="200601120260312B">C23C16/455</further-classification>
        <further-classification edition="200601120260312B">C30B29/16</further-classification>
        <further-classification edition="202001320260312B">G06F115/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商帕天媞股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATENTIX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水悠吏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, YURI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢倉藤也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAGURA, TOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋勲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, ISAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金子健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANEKO, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於提供適合用於半導體裝置等的結晶性優異的單晶膜。作為本發明的解決手段的單晶膜係面積50mm&lt;sup&gt;2&lt;/sup&gt;以上、膜厚30μm以下之包含二氧化鍺或其混晶作為主成分的半導體膜，且錯位密度為1.0×10&lt;sup&gt;10&lt;/sup&gt;/cm&lt;sup&gt;2&lt;/sup&gt;以下，前述半導體膜係具有金紅石型結晶構造，前述半導體膜的膜厚係1μm以上，此外，前述半導體膜的面積係100mm&lt;sup&gt;2&lt;/sup&gt;以上。使用該單晶膜適合用於例如半導體裝置等。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a single crystal film with excellent crystallinity useful for semiconductor devices and the like. A single crystal film according to the present invention has an area of 50 mm&lt;sup&gt;2&lt;/sup&gt; or more and a thickness of 30 μm or less. The single crystal film is a semiconductor film primarily composed of germanium dioxide or alloy thereof, and has a dislocation density of 1.0 x 10&lt;sup&gt;10&lt;/sup&gt;/cm&lt;sup&gt;2&lt;/sup&gt; or less. The semiconductor film has a rutile crystal structure and a thickness of 1 μm or more. Further, the single crystal film that is a semiconductor film having an area of 100 mm&lt;sup&gt;2&lt;/sup&gt; or more is applied to, for example, semiconductor devices.</p>
      </isu-abst>
      <representative-img>
        <p type="p">19:製膜用裝置</p>
        <p type="p">20:被製膜試料</p>
        <p type="p">21:試料台</p>
        <p type="p">22a,22b:載氣源</p>
        <p type="p">23a,23b:流量調節閥</p>
        <p type="p">24:原料隔板</p>
        <p type="p">24a:霧化用原料溶液</p>
        <p type="p">24b:超音波透過基材</p>
        <p type="p">24c:台</p>
        <p type="p">26:超音波振動器</p>
        <p type="p">27:製膜室</p>
        <p type="p">28:加熱器</p>
        <p type="p">30:霧化裝置</p>
        <p type="p">31:引導隔板</p>
        <p type="p">35:超音波傳達液槽</p>
        <p type="p">36:超音波傳達液</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1126" publication-number="202624226">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624226</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129196</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療疼痛之劑型及給藥方案</chinese-title>
        <english-title>DOSAGE FORMS AND DOSING REGIMENS FOR TREATING PAIN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">C07D471/04</main-classification>
        <further-classification edition="200601120260303B">A61K31/4375</further-classification>
        <further-classification edition="200601120260303B">A61P25/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商維泰克斯製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERTEX PHARMACEUTICALS INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉思穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU,SIYING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海爾　布萊恩Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARE,BRIAN J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>札卡萊斯　伊莎貝爾Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZACHARIAS,ISABEL A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示治療疼痛之方法，其包含投與化合物1或其醫藥學上可接受之鹽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are methods of treating pain, comprising administering Compound 1 or a pharmaceutically acceptable salt thereof.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1127" publication-number="202624877">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624877</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129228</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>碳奈米管防護膜、防護膜、曝光原版、曝光裝置及碳奈米管防護膜的製造方法</chinese-title>
        <english-title>CARBON NANOTUBE PELLICLE FILM, PELLICLE, ORIGINAL PLATE FOR EXPOSURE, EXPOSURE DEVICE AND METHOD FOR PRODUCING CARBON NANOTUBE PELLICLE FILM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260302B">G03F1/22</main-classification>
        <further-classification edition="201201120260302B">G03F1/62</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="202601120260302B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI CHEMICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤村真史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIMURA, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水那弥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, TOMOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尾崎弘人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OZAKI, HIROTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飯場康三</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IIBA, KOZO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示的碳奈米管防護膜的碎形維度為2.70以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1128" publication-number="202624578">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624578</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129231</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積層構造體、結晶薄膜、半導體裝置、電子儀器及系統</chinese-title>
        <english-title>LAYERED STRUCTURE, CRYSTALLINE FILM, SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE AND SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">C30B29/16</main-classification>
        <further-classification edition="200601120260312B">C23C16/40</further-classification>
        <further-classification edition="200601120260312B">C30B25/20</further-classification>
        <further-classification edition="202501120260312B">H10D8/50</further-classification>
        <further-classification edition="202501120260312B">H10D8/60</further-classification>
        <further-classification edition="202501120260312B">H10D12/00</further-classification>
        <further-classification edition="202501120260312B">H10D30/47</further-classification>
        <further-classification edition="202501120260312B">H10D30/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商帕天媞股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATENTIX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水悠吏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, YURI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川西健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWANISHI, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋勲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, ISAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金子健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANEKO, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於提供適合用於半導體裝置等的結晶性優異的積層構造體。作為本發明的解決手段的積層構造體係於由第一結晶構成的結晶基板上直接或隔著其他層而積層由第二結晶構成的結晶薄膜，前述第一結晶及前述第二結晶皆包含二氧化鍺或其混晶作為主成分，且前述第一結晶及前述第二結晶係具有相同的結晶構造。使用該積層構造體適合用於例如半導體裝置等。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a layered structure with excellent crystallinity useful for semiconductor devices and the like. A layered structure according to the present disclosure is formed by layering a crystal thin film made of a second crystal on a crystal substrate made of a first crystal directly or via another layer; both the first crystal and the second crystal contain germanium dioxide or a germanium dioxide alloy as a primary component; and both the first crystal and the second crystal have the same crystal structure. This layered structure is suitable for use in, for example, semiconductor devices.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1100:反應裝置</p>
        <p type="p">1110:蓋</p>
        <p type="p">1120:培養容器</p>
        <p type="p">1130:原料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1129" publication-number="202624314">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624314</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129263</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬化性樹脂組成物、積層體、積層體的製造方法及積層體的處理方法</chinese-title>
        <english-title>CURABLE RESIN COMPOSITION, LAYERED PRODUCT, METHOD FOR MANUFACTURING LAYERED PRODUCT, AND METHOD FOR PROCESSING LAYERED PRODUCT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08F283/10</main-classification>
        <further-classification edition="200601120260302B">C08L63/00</further-classification>
        <further-classification edition="200601120260302B">C09J163/10</further-classification>
        <further-classification edition="200601120260302B">C09J4/02</further-classification>
        <further-classification edition="200601120260302B">B32B37/12</further-classification>
        <further-classification edition="200601120260302B">B32B37/26</further-classification>
        <further-classification edition="200601120260302B">B32B38/00</further-classification>
        <further-classification edition="201901120260302B">B32B7/06</further-classification>
        <further-classification edition="200601120260302B">B32B7/12</further-classification>
        <further-classification edition="202601120260302B">H10P72/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日鐵化學材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON STEEL CHEMICAL &amp; MATERIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渋谷佳佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBUYA, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>内田一幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UCHIDA, KAZUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種在形成黏著劑層時從其他基板轉印的被黏附體的轉印精度高的硬化性樹脂組成物、使用所述硬化性樹脂組成物形成的積層體、以及所述積層體的製造方法及處理方法。硬化性樹脂組成物用於在保持基板形成黏著劑層，所述黏著劑層用於保持通過向轉印源基板照射光而從所述轉印源基板剝離的被黏附體，所述保持基板保持所述剝離後的被黏附體，所述硬化性樹脂組成物包含（A）含不飽和基的聚合性樹脂、以及（B）溶劑。在規定的條件下獲得的所述（A）成分的儲存彈性模量為200 kPa以下。在規定的條件下獲得的所述（A）成分的硬化膜的波長266 nm的光的吸光度為0.50以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">101、102:被黏附體</p>
        <p type="p">103:黏著劑層</p>
        <p type="p">104:保持基板</p>
        <p type="p">201:轉印源基板</p>
        <p type="p">202:通過光照射而變質、分解的樹脂</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1130" publication-number="202624984">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624984</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129281</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>近似最近鄰搜索方法及近似最近鄰搜索系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120251103B">G06F16/2453</main-classification>
        <further-classification edition="201901120251103B">G06F16/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菅野伸一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANNO, SHINICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡部徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATABE, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>栗田貴宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURITA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實現一種可使針對向量資料庫的近似最近鄰搜索效率化的近似最近鄰搜索方法。根據實施形態，一種針對存儲有N個D維向量的向量資料庫的近似最近鄰搜索方法，包括：對分別表示自D維的第一基準向量至所述N個D維向量的各者的方位、且事先獲取的N個第一方位資訊進行管理；接收D維的查詢向量；計算表示自所述第一基準向量至所述查詢向量的方位的第二方位資訊；以及使用所述N個第一方位資訊及所述第二方位資訊，自所述N個D維向量中搜索所述查詢向量的近似最近鄰向量。所述N為2以上的整數。所述D為2以上的整數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">701:搜索範圍(範圍)</p>
        <p type="p">707:搜索範圍</p>
        <p type="p">702、703、704、705、706:範圍</p>
        <p type="p">711:臨時最近鄰向量(向量)</p>
        <p type="p">712、713、714、715、716、717、718、719:向量</p>
        <p type="p">Bn:基準點</p>
        <p type="p">Ln4、2Ln4、Ln6:距離(半徑)</p>
        <p type="p">Ln5:距離(半徑、臨時最近鄰距離)</p>
        <p type="p">2Ln5:半徑</p>
        <p type="p">Q:查詢(查詢向量)</p>
        <p type="p">γ:方位資訊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1131" publication-number="202624109">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624109</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129284</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有包括有機半導體之複數個感測器單元的晶圓及製造晶圓之方法</chinese-title>
        <english-title>WAFER WITH A PLURALITY OF SENSOR UNITS THAT INCLUDE AN ORGANIC SEMICONDUCTOR AND METHOD OF MAKING THE WAFER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">B81B7/00</main-classification>
        <further-classification edition="200601120260313B">B81C1/00</further-classification>
        <further-classification edition="202301120260313B">H10K99/00</further-classification>
        <further-classification edition="200601120260313B">G01N27/414</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立陽明交通大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL YANG MING CHIAO TUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝爾曼　羅伯特艾倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BELLMAN, ROBERT ALAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧　華雲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENG, HUAYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賀　明謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, MINGQIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉建偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, JIANWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈕渭鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIU, WEIJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>冉曉雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZAN, HSIAO-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種晶圓，該晶圓包括：複數個感測器單元，各感測器單元包括：（a）一基板，其具有一主表面；（b）一第一導電材料之一第一層，其安置於該基板之該主表面上方；（c）複數個突出部，其自該第一導電材料之該第一層延伸遠離該基板之該主表面，該等突出部中之各者包括（i）一絕緣體之一層，其安置於該第一導電材料之該第一層上方；及（ii）一第二導電材料之一第二層，其安置於該絕緣體之該層上方；及（d）一有機半導體，其安置於該第一導電材料之該第一層以及該等突出部上方。本揭露亦提供一種製造感測器單元之方法。該方法包括一切割步驟，該切割步驟包括自該晶圓分離該複數個感測器單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wafer including a plurality of sensor units, each sensor unit including (a) a substrate with a primary surface; (b) a first layer of a first conductive material disposed over the primary surface of the substrate; (c) a plurality of projections extending from the first layer of the first conductive material away from the primary surface of the substrate, each of the projections including (i) a layer of an insulator disposed over the first layer of the first conductive material and (ii) a second layer of a second conductive material disposed over the layer of the insulator; and (d) an organic semiconductor disposed over the first layer of the first conductive material and the projections. A method of manufacturing sensor units. The method includes a dicing step that includes separating the plurality of sensor units from the wafer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:晶圓</p>
        <p type="p">12:感測器單元</p>
        <p type="p">14:最大尺寸/直徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1132" publication-number="202624332">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624332</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129292</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>乙烯基樹脂、乙烯基樹脂的製造方法、乙烯基樹脂組成物、硬化物、預浸體、樹脂片及積層板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08G61/02</main-classification>
        <further-classification edition="200601120260302B">C08F299/02</further-classification>
        <further-classification edition="200601120260302B">C08J5/24</further-classification>
        <further-classification edition="200601120260302B">B32B27/00</further-classification>
        <further-classification edition="200601120260302B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日鐵化學材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON STEEL CHEMICAL &amp; MATERIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商國都化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUKDO CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宗正浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOH, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池仲輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEE, JOONGHWI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳起煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, KIHWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹海璃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOUN, HAERRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金智雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JIWOONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓恩智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, EUNJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘裕靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAN, YOOJUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種低熔融黏度性優異、同時顯示低的介電常數、低的介電損耗正切的樹脂材料。一種下述通式（1）所表示的乙烯基樹脂及其製造方法。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="248px" width="380px" file="ed10027.JPG" alt="ed10027.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;此處，R&lt;sup&gt;1&lt;/sup&gt;獨立地表示氫原子或碳數1～8的烴基。R&lt;sup&gt;2&lt;/sup&gt;獨立地表示氫原子或可具有碳數1～8的烴基的二環戊烯基，至少一個為可具有碳數1～8的烴基的二環戊烯基。R&lt;sup&gt;3&lt;/sup&gt;、R&lt;sup&gt;4&lt;/sup&gt;獨立地表示氫原子或碳數1～8的烴基，a、b為0～2。X獨立地表示氫原子或者所述式（1a）或式（1b）所表示的含乙烯基的基，至少一個為所述含乙烯基的基。R&lt;sup&gt;5&lt;/sup&gt;為氫原子或者碳數1～8的烷基或烯基。Ar表示芳香環。n表示重複數，其平均值為小於1的數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1133" publication-number="202624457">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624457</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129304</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>內核/外殼型半導體奈米粒子及其製造方法</chinese-title>
        <english-title>METHOD FOR PRODUCING CORE/SHELL TYPE QUANTIUM DOT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C09K11/70</main-classification>
        <further-classification edition="200601120260302B">C09K11/56</further-classification>
        <further-classification edition="200601120260302B">C09K11/88</further-classification>
        <further-classification edition="200601120260302B">G02B5/20</further-classification>
        <further-classification edition="202501120260302B">H10H20/01</further-classification>
        <further-classification edition="202501120260302B">H10H20/812</further-classification>
        <further-classification edition="202501120260302B">H10H20/851</further-classification>
        <further-classification edition="201101120260302B">B82Y20/00</further-classification>
        <further-classification edition="201101120260302B">B82Y40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商昭榮化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHOEI CHEMICAL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森山喬史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIYAMA, TAKAFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>城戶信人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIDO, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三津家由子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUKA, YUKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小原木美緒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOHARAGI, MIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的內核/外殼型半導體奈米粒子，係至少具有含In與P之內核、以及含Zn與S及/或Se之外殼的內核/外殼型半導體奈米粒子；其中，該內核/外殼型半導體奈米粒子係具有積層缺陷，且該內核/外殼型半導體奈米粒子係含有鹵素，依原子換算，鹵素相對於In的莫耳比係超過15且在500以下；由掃描穿透式電子顯微鏡觀察所獲得的STEM影像中，該內核/外殼型半導體奈米粒子的平均正圓度係0.820~1.000。根據本發明可提供由含有In與P之內核、及含有Zn與S及/或Se之外殼構成的內核/外殼型半導體奈米粒子，因為外殼的形成均勻性高、形狀整齊，因而即使有積層缺陷，但發光效率仍高、FWHM狹窄的內核/外殼型半導體奈米粒子及其製造方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1134" publication-number="202625243">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625243</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129313</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>
        <english-title>SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">H01J37/304</main-classification>
        <further-classification edition="200601120260313B">H01J37/317</further-classification>
        <further-classification edition="202601120260313B">H10P95/90</further-classification>
        <further-classification edition="202601120260313B">H10P72/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷川紘太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANIKAWA, KOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田鎖学</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKUSARI, MANABU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>屋敷啓之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YASHIKI, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠降低基板受到金屬污染之可能性並且對基板進行處理之技術。  &lt;br/&gt;基板處理裝置具備帶電單元20及處理單元30。帶電單元20包含使基板W之第1主面Wa帶正電之帶電器21。處理單元30具有處理腔室31，且進行以下處理，該處理包含針對處理腔室31內之基板W進行之加熱及處理氣體供給中之至少任一種，且伴隨著處理腔室31內之金屬離子之產生。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:帶電單元</p>
        <p type="p">21:帶電器</p>
        <p type="p">21A:第1離子發生器</p>
        <p type="p">22:基板被配置部</p>
        <p type="p">22a:上表面</p>
        <p type="p">25:冷卻器</p>
        <p type="p">26:升降銷</p>
        <p type="p">29:冷卻單元</p>
        <p type="p">30:氣體烘烤單元(處理單元)</p>
        <p type="p">31:處理腔室</p>
        <p type="p">32:基板被配置部</p>
        <p type="p">33:加熱器</p>
        <p type="p">34:處理氣體供給部</p>
        <p type="p">35:整流板</p>
        <p type="p">35a:貫通孔</p>
        <p type="p">36:升降銷</p>
        <p type="p">37:排出部</p>
        <p type="p">40:搬送單元</p>
        <p type="p">41:搬送板</p>
        <p type="p">42:搬送驅動部</p>
        <p type="p">121D:乾式處理單元</p>
        <p type="p">251:冷卻板</p>
        <p type="p">261:銷驅動部</p>
        <p type="p">311:上構件</p>
        <p type="p">312:下構件</p>
        <p type="p">313:開閉驅動部</p>
        <p type="p">341:供給管</p>
        <p type="p">341a:供氣口</p>
        <p type="p">342:壓力調整部</p>
        <p type="p">343:供給閥</p>
        <p type="p">344:臭氧產生器</p>
        <p type="p">361:銷驅動部</p>
        <p type="p">362:波紋管</p>
        <p type="p">371:排出管</p>
        <p type="p">372:排出閥</p>
        <p type="p">G1:定位銷</p>
        <p type="p">W:基板</p>
        <p type="p">Wa:第1主面</p>
        <p type="p">Wb:第2主面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1135" publication-number="202624710">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624710</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129316</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具備背隙測定裝置之旋轉定位裝置、及旋轉定位裝置之背隙測定方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120250908B">G01M13/02</main-classification>
        <further-classification edition="200601120250908B">G01B13/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日立製作所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITACHI, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大野耕作</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONO, KOSAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平野正博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRANO, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於在裝置之運轉中執行由於磨耗等產生之背隙之測定、評估，提高裝置之運轉率。  &lt;br/&gt;本發明具備驅動小齒輪24之電動機22、控制電動機22之運轉控制裝置21、及測定於大齒輪25與小齒輪24之間產生之背隙之背隙測定裝置43。背隙測定裝置43由以下構成：輸入軸角度感測器12，其取得電動機22之旋轉角之資料；角度轉矩測定部13，其基於自輸入軸角度感測器12及運轉控制裝置21取得之資料，測量電動機22之旋轉角及轉矩；資料選擇部14，其自角度轉矩測定部13選擇運轉中之電動機22之旋轉角及轉矩相關之資料；及背隙評估部15，其基於由資料選擇部14選擇之資料，運算於大齒輪25與小齒輪24之間產生之背隙之測定值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">12:輸入軸角度感測器</p>
        <p type="p">13:角度轉矩測定部</p>
        <p type="p">14:資料選擇部</p>
        <p type="p">15:背隙評估部</p>
        <p type="p">21:運轉控制裝置</p>
        <p type="p">22:電動機</p>
        <p type="p">22a:電動機軸</p>
        <p type="p">23:減速機</p>
        <p type="p">24:小齒輪</p>
        <p type="p">25:大齒輪</p>
        <p type="p">26:輸出軸</p>
        <p type="p">27:齒輪箱</p>
        <p type="p">28:輸出軸軸承</p>
        <p type="p">29:輸出軸制動器</p>
        <p type="p">30:旋轉載物台</p>
        <p type="p">41:動力傳遞機構</p>
        <p type="p">42:旋轉定位裝置</p>
        <p type="p">43:背隙測定裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1136" publication-number="202623777">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623777</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129326</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>空氣按摩裝置、控制方法及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">A61H9/00</main-classification>
        <further-classification edition="200601120260312B">A61H39/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下知識產權經營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>兒島猛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOJIMA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倉田陽介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURATA, YOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林稔彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, TOSHIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河本實</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAMOTO, MINORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示提供一種謀求按摩的壓力以及節奏(rhythm)的維持之空氣按摩裝置。本揭示之空氣按摩裝置是按摩使用者的腳之空氣按摩裝置。空氣按摩裝置具備氣囊、空氣供給裝置與空氣軟管。氣囊是藉由空氣的供氣排氣而膨脹收縮。氣囊是筒狀。空氣供給裝置是對氣囊進行空氣的供氣排氣。空氣軟管是連接空氣供給裝置與氣囊。空氣供給裝置會進行至少包含第1供氣排氣步驟以及第2供氣排氣步驟之複數個供氣排氣步驟。空氣供給裝置在第1供氣排氣步驟中，是計測執行時間與氣囊的壓力，並在執行時間已達到預定時間之情況下或氣囊的壓力已達到預定壓力之情況下，執行第2供氣排氣步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S8:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1137" publication-number="202625714">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625714</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129338</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於半導體裝置的清潔漿料及製造半導體裝置的方法</chinese-title>
        <english-title>CLEANING SLURRY FOR SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260309B">H10P52/40</main-classification>
        <further-classification edition="202601120260309B">H10P70/00</further-classification>
        <further-classification edition="200601120260309B">C09G1/02</further-classification>
        <further-classification edition="200601120260309B">C09K3/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡利霖納　費多西亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KALININA, FEDOSYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜娟花</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, YOUNHWA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李政勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JUNG HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池尙洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEE, SANG SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高允錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, YOONSEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昡在</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HYUNE JEA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種製造一半導體裝置之方法包括：使用包括磨料之一拋光漿料對一表面執行化學機械拋光；以及藉由供應包括軟粒及一分散介質之一清潔漿料來進行第一清潔以自被執行該化學機械拋光之一經拋光表面移除該等磨料，該等軟粒具有比該經拋光表面低之一硬度，其中該等軟粒及該等磨料中之一者在該清潔漿料之一pH值下的一ζ電位大於0，且該等軟粒及該等磨料中之另一者在該清潔漿料之該pH值下的一ζ電位小於0。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of manufacturing a semiconductor device includes performing chemical mechanical polishing on a surface using a polishing slurry including abrasives, and first cleaning by supplying a cleaning slurry including soft particles and a dispersion medium to remove the abrasives from a polished surface on which the chemical mechanical polishing is performed he soft particles having a lower hardness than the polished surface, wherein a zeta potential of one of the soft particles and the abrasives at a pH of the cleaning slurry is greater than 0, and a zeta potential of the other of the soft particles and the abrasives at the pH of the cleaning slurry is less than 0.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1138" publication-number="202624930">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624930</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129345</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於半導體裝置之最小電壓之動態控制</chinese-title>
        <english-title>DYNAMIC CONTROL OF MINIMUM VOLTAGE FOR SEMICONDUCTOR DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">G06F1/28</main-classification>
        <further-classification edition="200601120260309B">G06F17/10</further-classification>
        <further-classification edition="200601120260309B">G06F11/34</further-classification>
        <further-classification edition="201801120260309B">G06F9/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商谷歌有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOOGLE LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海達琳賈德　莫森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEIDARINEJAD, MOHSEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米塔爾　阿爾皮特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITTAL, ARPIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示了用於半導體裝置之最小電壓之動態控制之態樣。舉例而言，一種用於最小電壓動態控制之方法包括自預測模型接收預測溫度及預測功耗。該預測溫度及該預測功耗係基於在操作點處操作之半導體裝置之元件之功耗、效能狀態駐留率及溫度來判定。在邏輯處接收基於元件之溫度判定之基於溫度的最小電壓及基於元件之功耗判定之基於功耗的最小電壓。該邏輯產生基於該元件之基於溫度的最小電壓、預測溫度、預測功耗、基於功耗的最小電壓及效能狀態駐留率判定之最小電壓。元件之電壓可基於由邏輯產生之最小電壓來調整。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Aspects of dynamic control of minimum voltage for semiconductor devices are disclosed. For example, a method for minimum voltage dynamic control includes receiving a predictive temperature and a predictive power consumption from a predictive model. The predictive temperature and the predictive power consumption are determined based on power consumption, performance state residency, and temperature of an element of a semiconductor device operating at an operation point. A temperature-based minimum voltage, determined based on the temperature of the element, and a power-consumption-based minimum voltage, determined based on the power consumption of the element, are received at a logic. The logic generates a minimum voltage determined based on the temperature-based minimum voltage, the predictive temperature, the predictive power consumption, the power-consumption-based minimum voltage, and the performance state residency of the element. The voltage of the element may be adjusted based on the minimum voltage generated by the logic.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">102:元件</p>
        <p type="p">104:溫度</p>
        <p type="p">106:功耗</p>
        <p type="p">108:效能狀態駐留率</p>
        <p type="p">110:預測模型</p>
        <p type="p">112:預測溫度</p>
        <p type="p">114:預測功耗</p>
        <p type="p">116:邏輯</p>
        <p type="p">118:基於溫度的最小電壓</p>
        <p type="p">120:基於功耗的最小電壓</p>
        <p type="p">122:動態最小電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1139" publication-number="202624650">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624650</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129365</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用連接固定件的纜線保護系統</chinese-title>
        <english-title>CABLE PROTECTION SYSTEM USING COUPLING FASTENERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">F16L1/12</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商班狄特公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANDUIT CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勞力　羅得尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROULEAU, RODNEY G.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米茲　諾亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZE, NOAH C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛斯　加布里拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIMS, GABRIELA R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫　艦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴克維爾　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASKERVILLE, STEVEN J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種纜線保護系統，其包括配接特徵，用於使高效以及有效地組裝能圍繞待保護纜線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cable protection system is provided that includes mating features for enabling efficient and effective assembly around a cable to be protected.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100A:連接箍</p>
        <p type="p">100B:連接箍</p>
        <p type="p">200A:半套管</p>
        <p type="p">200B:半套管</p>
        <p type="p">201:通道</p>
        <p type="p">1000:纜線保護系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1140" publication-number="202625236">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625236</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129424</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>線性加速器、離子植入機及其操作方法</chinese-title>
        <english-title>LINEAR ACCELERATOR, ION IMPLANTER AND METHOD OF OPERATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">H01J37/08</main-classification>
        <further-classification edition="200601120260309B">H01J37/317</further-classification>
        <further-classification edition="200601120260309B">H05H7/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>譚　偉明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAM, WAI-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克萊因　傑弗裡　勞倫斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLEIN, JEFFREY LAURENCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛克萊　法蘭克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINCLAIR, FRANK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">離子植入機，包括離子源和萃取系統，配置為在第一離子能量下產生離子束，以及線性加速器，配置為將離子束加速到第二離子能量，其中線性加速器包含複數個加速級，分別耦合以從複數個功率組件接收複數個射頻訊號。線性加速器可配置為其中複數個加速級中的至少一級耦合以：可逆地連接到第一功率組件，包含含有共振器腔體的共振器，第一功率組件在第一頻率下產生第一射頻訊號；從第一功率組件斷開；以及連接到第二功率組件，在大於第一頻率的第二頻率下產生第二射頻訊號，同時不改變共振器腔體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An ion implanter, including an ion source and extraction system, arranged to generate an ion beam at a first ion energy, and a linear accelerator, arranged to accelerate the ion beam to a second ion energy, wherein the linear accelerator comprises a plurality of acceleration stages coupled to receive a plurality of RF signals from a plurality of power assemblies, respectively. The linear accelerator may be configured wherein at least one stage of the plurality of acceleration stages is coupled to: reversibly connect to a first power assembly, comprising a resonator that contains a resonator enclosure, the first power assembly generating a first RF signal at a first frequency; to disconnect from the first power assembly; and to connect to a second power assembly, generating a second RF signal at a second frequency, greater than the first frequency, while not changing the resonator enclosure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:離子植入機</p>
        <p type="p">102:離子源</p>
        <p type="p">104:分析器</p>
        <p type="p">106:線性加速器</p>
        <p type="p">108:掃描器</p>
        <p type="p">110:校正器</p>
        <p type="p">112:終端站</p>
        <p type="p">120:真空腔體</p>
        <p type="p">122A、122B、123、124A、124B、124C、124D、124E、124F、124G、124H、124I、124J:功率組件</p>
        <p type="p">126:介面</p>
        <p type="p">138:功率組件配置</p>
        <p type="p">A1、A2、A3、A4、A5、A6、A7、A8、A9、A10、A11、A12:級/加速級</p>
        <p type="p">B1:聚束器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1141" publication-number="202623807">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623807</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129430</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有中樞神經系統轉移之癌症之治療</chinese-title>
        <english-title>TREATMENT OF CANCER WITH METASTASES IN THE CENTRAL NERVOUS SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">A61K31/519</main-classification>
        <further-classification edition="200601120260304B">A61K9/16</further-classification>
        <further-classification edition="200601120260304B">A61P35/00</further-classification>
        <further-classification edition="200601120260304B">A61P35/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商百靈佳殷格翰國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOEHRINGER INGELHEIM INTERNATIONAL GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿巴斯　穆罕默德　瑞查</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABBASI, MOHAMMAD REZA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿曼德　馬利歐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMEND, MARIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩德羅爾赫法齊　貝布德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SADROLHEFAZI, BEHBOOD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施羅特　盧卡斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHROETER, LUKAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雅雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於使用HER2酪胺酸激酶抑制劑宗格替尼(zongertinib)治療具有中樞神經系統(central nervous system；CNS)(特定言之腦)轉移之癌症。因此，在此提供供使用之化合物、預防及/或治療方法及與該治療相關之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to the treatment of cancer with metastases in the central nervous system (CNS), in particular in the brain, using the HER2 tyrosine kinase inhibitor zongertinib. Accordingly, compounds for use, methods of prevention and/or treatment and uses related to said treatment are herewith provided.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1142" publication-number="202624425">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624425</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129509</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>漿料及研磨方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C09G1/02</main-classification>
        <further-classification edition="200601120260302B">C09K3/14</further-classification>
        <further-classification edition="201201120260302B">B24B37/00</further-classification>
        <further-classification edition="202601120260302B">H10P52/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>織田明博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORITA, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>髙橋健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, KEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種漿料，其含有：磨粒；及包含選自由氮原子及磷原子組成的組中之至少一種之化合物A，前述化合物A的辛醇/水分配係數AlogP為2.00以上，前述漿料的pH為5.0以上。一種研磨方法，其包括使用該漿料對被研磨構件進行研磨之步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1143" publication-number="202625669">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625669</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129514</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資料處理裝置</chinese-title>
        <english-title>DATA PROCESSING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260226B">H10K77/10</main-classification>
        <further-classification edition="202301120260226B">H10K59/123</further-classification>
        <further-classification edition="202301120260226B">H10K59/35</further-classification>
        <further-classification edition="201601120260226B">G09G3/3208</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商半導體能源研究所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松本博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的一個目的是提供一種一覽性強的資料處理裝置。或者，本發明的一個目的是提供一種可攜性好的資料處理裝置。該資料處理裝置包括：包括能夠展開及折疊的顯示部以及能夠檢測其狀態而供應折疊資料的檢測部的輸入/輸出單元；以及儲存根據折疊資料使運算部執行不同處理的程式的運算單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">To provide a highly browsable data processing device or a highly portable data processing device, a data processing device including the following is devised: an input/output unit provided with a display portion which can be folded and unfolded and a sensor portion that can sense the folded and unfolded states of the display portion and can supply data on fold, and an arithmetic unit that stores a program for executing different processing depending on the data on fold.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:資料處理裝置</p>
        <p type="p">122:顯示部</p>
        <p type="p">123L:感測器</p>
        <p type="p">123U:感測器</p>
        <p type="p">129(1):第一標記</p>
        <p type="p">129(2):第二標記</p>
        <p type="p">129(5):第五標記</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1144" publication-number="202625775">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625775</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129523</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於檢查系統中的上游吹掃之系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR UPSTREAM PURGING IN INSPECTION SYSTEMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260309B">H10P74/20</main-classification>
        <further-classification edition="202601120260309B">H10P72/78</further-classification>
        <further-classification edition="200601120260309B">B08B5/02</further-classification>
        <further-classification edition="200601120260309B">G01N21/17</further-classification>
        <further-classification edition="201801120260309B">G06F9/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郝益華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAO, YIHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙　國衡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, GUOHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　春翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHUNHAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種檢查系統，其可包含一物鏡外殼，其中該物鏡外殼經組態以容置一物鏡。該檢查系統可包含經組態以在掃描一樣本時將一氣體遞送至該樣本之一吹掃子系統。該吹掃子系統可包含：一氣體源，其經組態以提供該氣體；一或多個流量閥；一或多個流量控制器；一上游吹掃通道，其在該物鏡之該物鏡外殼內；及一上游吹掃出口，其連接至該上游吹掃通道且經組態以吹掃該氣體。該上游吹掃出口可定位於該樣本之一掃描方向之上游，使得在掃描該樣本時，該氣體朝向該物鏡之一視場移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An inspection system may include an objective lens housing, where the objective lens housing is configured to house an objective lens. The inspection system may include a purging sub-system configured to deliver a gas to a sample as the sample is scanned. The purging sub-system may include a gas source configured to provide the gas, one or more flow valves, one or more flow controllers, an upstream purging channel within the objective lens housing of the objective lens, and an upstream purging outlet connected to the upstream purging channel and configured to purge the gas. The upstream purging outlet may be positioned upstream from a scan direction of the sample, such that as the sample is scanned, the gas is moved towards a field of view of the objective lens.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:檢查系統</p>
        <p type="p">104:樣本</p>
        <p type="p">106:照明子系統</p>
        <p type="p">108:集光子系統</p>
        <p type="p">110:運動子系統</p>
        <p type="p">112:吹掃子系統</p>
        <p type="p">114:電腦子系統</p>
        <p type="p">116:處理器</p>
        <p type="p">118:記憶體</p>
        <p type="p">120:照明源</p>
        <p type="p">122:照明/照明光束</p>
        <p type="p">123:經收集光</p>
        <p type="p">124:照明控制光學器件</p>
        <p type="p">126:照明透鏡</p>
        <p type="p">128:物鏡</p>
        <p type="p">130:光學元件</p>
        <p type="p">132:偵測器</p>
        <p type="p">134:真空卡盤</p>
        <p type="p">136:邊緣處置卡盤</p>
        <p type="p">138:線性載物台</p>
        <p type="p">139:心軸</p>
        <p type="p">140:氣體源</p>
        <p type="p">142:控制閥</p>
        <p type="p">144:流量控制器</p>
        <p type="p">146:上游吹掃通道</p>
        <p type="p">148:邊緣吹掃模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1145" publication-number="202625579">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625579</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129556</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>環繞式閘極裝置及其形成方法</chinese-title>
        <english-title>GATE-ALL-AROUND DEVICE AND METHOD OF FORMING SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260306B">H10D30/40</main-classification>
        <further-classification edition="202501120260306B">H10D62/832</further-classification>
        <further-classification edition="202501120260306B">H10D64/27</further-classification>
        <further-classification edition="202601120260306B">H10P50/24</further-classification>
        <further-classification edition="202601120260306B">H10P50/64</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧圖四世　伊芙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTTO IV, IVO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡爾　蘇巴迪普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAL, SUBHADEEP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金木俊樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANAKI, TOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">方法包括在基板上形成半導體層堆疊。該堆疊包括在基板上之第一半導體材料的第一層、包括在第一層上之第二半導體材料的第二層；包括在第二層上之第一半導體材料的第三層；以及在第三層上之第三半導體材料的第四層。該方法進一步包括對堆疊圖案化以形成半導體結構、在半導體結構上形成犧牲閘極、形成與犧牲閘極相鄰的磊晶區域、去除犧牲閘極以形成凹部、透過凹部從半導體結構選擇性地去除第一層及第三層以形成開口、透過凹部從半導體結構選擇性地去除第二層以擴大開口、以及在凹部及開口中形成替換閘極。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes forming a stack of semiconductor layers over a substrate. The stack includes a first layer including a first semiconductor material over the substrate, a second layer including a second semiconductor material over the first layer, a third layer including the first semiconductor material over the second layer, and a fourth layer including a third semiconductor material over the third layer. The method further includes patterning the stack to form a semiconductor structure, forming a sacrificial gate over the semiconductor structure, forming epitaxial regions adjacent to the sacrificial gate, removing the sacrificial gate to form a recess, selectively removing the first layer and the third layer from the semiconductor structure through the recess to form an opening, selectively removing the second layer from the semiconductor structure through the recess to expand the opening, and forming a replacement gate in the recess and the opening.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">100A:環繞式閘極裝置、GAA裝置</p>
        <p type="p">100B:環繞式閘極裝置、GAA裝置</p>
        <p type="p">102:基板</p>
        <p type="p">102A:第一區域</p>
        <p type="p">102B:第二區域</p>
        <p type="p">112:第四層</p>
        <p type="p">502A:第一閘極間隔物</p>
        <p type="p">502B:第二閘極間隔物</p>
        <p type="p">702A:第一內間隔物</p>
        <p type="p">702B:第二內間隔物</p>
        <p type="p">802A:第一磊晶區域</p>
        <p type="p">802B:第二磊晶區域</p>
        <p type="p">902:層間介電(ILD)層、介電層</p>
        <p type="p">1302A:第一替換閘極</p>
        <p type="p">1302B:第二替換閘極</p>
        <p type="p">1304A:第一替換閘極介電層</p>
        <p type="p">1304B:第二替換閘極介電層</p>
        <p type="p">1306A:第一替換閘極電極層</p>
        <p type="p">1306B:第二替換閘極電極層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1146" publication-number="202624434">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624434</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129599</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>黏著劑組合物及黏著片</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">C09J133/04</main-classification>
        <further-classification edition="200601120260306B">C09J11/06</further-classification>
        <further-classification edition="201801120260306B">C09J7/30</further-classification>
        <further-classification edition="200601120260306B">B32B27/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀内佳之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORIUCHI, YOSHIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴野匡哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBANO, MASAYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秋山千絵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKIYAMA, CHIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松岡徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUOKA, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中山純一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAYAMA, JUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種黏著劑組合物，其能夠形成黏著劑層，該黏著劑層之加工性優異，剛與被黏著體貼合後容易剝離，藉由在與被黏著體貼合後使黏著劑光硬化，能夠與被黏著體牢固地接著，且於彎曲部位不易產生剝離。  &lt;br/&gt;本發明之黏著劑組合物之光硬化後之25℃下之剪切儲存彈性模數(G'&lt;sub&gt;1(25)&lt;/sub&gt;)相對於光硬化前之25℃下之剪切儲存彈性模數(G'&lt;sub&gt;0(25)&lt;/sub&gt;)的比率ΔG'&lt;sub&gt;(25)&lt;/sub&gt;為200%以下。又，於光硬化前在溫度25℃、相對濕度50%、拉伸速度300 mm/min之剝離條件下對聚醯亞胺之180°剝離接著力(F&lt;sub&gt;0&lt;/sub&gt;)為0.01～1 N/25 mm，且於光硬化後在溫度25℃、相對濕度50%、拉伸速度300 mm/min之剝離條件下對聚醯亞胺之180°剝離接著力(F&lt;sub&gt;1&lt;/sub&gt;)超過1 N/25 mm。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基材</p>
        <p type="p">10:黏著片</p>
        <p type="p">21:本發明之黏著劑層</p>
        <p type="p">31:剝離襯墊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1147" publication-number="202624236">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624236</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129610</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>表面處理劑組成物、顆粒及物品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07F7/10</main-classification>
        <further-classification edition="200601120260302B">C07F7/18</further-classification>
        <further-classification edition="200601120260302B">C07F7/21</further-classification>
        <further-classification edition="200601120260302B">C08G77/04</further-classification>
        <further-classification edition="200601120260302B">C08G77/16</further-classification>
        <further-classification edition="200601120260302B">C08G77/18</further-classification>
        <further-classification edition="200601120260302B">C08G77/26</further-classification>
        <further-classification edition="200601120260302B">C08G77/28</further-classification>
        <further-classification edition="200601120260302B">C09D183/04</further-classification>
        <further-classification edition="200601120260302B">C09D183/06</further-classification>
        <further-classification edition="200601120260302B">C09D183/08</further-classification>
        <further-classification edition="200601120260302B">C09D5/16</further-classification>
        <further-classification edition="200601120260302B">C09K3/18</further-classification>
        <further-classification edition="201501120260302B">G02B1/10</further-classification>
        <further-classification edition="201501120260302B">G02B1/14</further-classification>
        <further-classification edition="201501120260302B">G02B1/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森聖矢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORI, SEIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>酒匈隆介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKOH, RYUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種由不含有氟原子的材料所構成的表面處理劑組成物，其包含有機矽烷化合物(α)及/或其部分反應縮合物與溶劑，其中，有機矽烷化合物(α)為非氟系化合物並具有至少1個碳數3~60的直鏈狀、分支鏈狀或環狀的1價的烴基及反應性矽基，該1價的烴基可包含選自氧原子、硫原子、氮原子及矽原子之至少1種；溶劑為非氟系溶劑；使用卡爾費休法所測定的組成物中的水分含有量為1,000質量ppm以下；該表面處理劑組成物可形成撥水性、耐磨損性為優異的硬化被膜，且即使是長時間的保存後亦能夠維持性能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1148" publication-number="202625642">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625642</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129624</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>整合於具有高強度光源之顯示基板之色彩轉換層</chinese-title>
        <english-title>COLOR CONVERSION LAYER INTEGRATION INTO DISPLAY SUBSTRATE WITH HIGH INTENSITY LIGHT SOURCES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10H29/10</main-classification>
        <further-classification edition="202301120260302B">H10K50/80</further-classification>
        <further-classification edition="200601120260302B">G02B5/20</further-classification>
        <further-classification edition="200601120260302B">G02F1/017</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商弗瑞爾公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VUEREAL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查吉　格拉姆瑞札</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAJI, GHOLAMREZA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於藉由分配光源之光輸出而將色彩轉換層配置整合於一像素結構中，及使用一衰減器來減小由一直接視點處之高光強度光引起之熱點效應。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure is related to arranging integrating color conversion layer into a pixel structure by distributing the light output of the light source, and using an attenuator to reduce the hot spot effect caused by high light intensity light at a direct point of sight.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:像素結構</p>
        <p type="p">11:基板/顯示基板/施體基板</p>
        <p type="p">12-1:光源/子像素/微裝置</p>
        <p type="p">12-2:光源/子像素/微裝置</p>
        <p type="p">12-3:光源/子像素</p>
        <p type="p">14-1:色彩轉換層/光轉換層</p>
        <p type="p">14-2:色彩轉換層</p>
        <p type="p">14-3:色彩轉換層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1149" publication-number="202625612">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625612</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129687</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260313B">H10D84/03</main-classification>
        <further-classification edition="202601120260313B">H10P34/42</further-classification>
        <further-classification edition="202601120260313B">H10P30/20</further-classification>
        <further-classification edition="202601120260313B">H10P50/00</further-classification>
        <further-classification edition="201401120260313B">B23K26/57</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松岡遼太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUOKA, RYOTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下陽平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHITA, YOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮城有佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAGI, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溝本康隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZOMOTO, YASUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之半導體裝置之製造方法，包含以下步驟：在第一基板之表面上藉由磊晶成長而形成分離層、在該分離層上藉由磊晶成長而形成磊晶膜、在該磊晶膜形成第一元件層，藉此準備第一基板、準備包含第二元件層的第二基板、藉由將該第一基板及該第二基板接合而形成疊合基板，及藉由對該疊合基板所包含的該第一基板中的該分離層照射雷射光而將該第一基板從該第二基板分離，藉此將該第一元件層轉印至該第二基板；該分離層包含雷射吸收層，該雷射吸收層包含摻雜有摻雜物的至少一個磊晶膜；該第一元件層及該第二元件層包含作為用於形成CFET之pMOS或是nMOS中任一者之形成預定區域的交互疊層設置之複數Si膜及SiGe膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">St1~St7:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1150" publication-number="202624463">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624463</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129689</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液晶性化合物、液晶組成物及其應用、元件</chinese-title>
        <english-title>LIQUID CRYSTALLINE COMPOUND, LIQUID CRYSTAL COMPOSITION AND APPLICATIONS THEREOF, AND ELEMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C09K19/18</main-classification>
        <further-classification edition="200601120260202B">C09K19/42</further-classification>
        <further-classification edition="200601120260202B">G02F1/1337</further-classification>
        <further-classification edition="200601120260202B">G02B3/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商捷恩智股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JNC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商捷恩智石油化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JNC PETROCHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡部英二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKABE, EIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森崇徳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORI, TAKANORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>枝連一志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIREN, KAZUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>片野裕子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATANO, YUKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小口雄二郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGUCHI, YUJIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>峯幸佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINE, KOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種作為頻率為1 GHz至10 THz的範圍的電磁波控制用的元件中所使用的材料的、具有對於熱的穩定性、透明點高、液晶相的下限溫度低、黏度小、折射率各向異性非常大、與其他液晶性化合物的相容性優異的至少一種物性的液晶性化合物。提供一種含有所述化合物的液晶組成物、使用所述組成物的可在廣的溫度範圍內進行電磁波控制的元件。一種化合物，由式（1）表示。  &lt;br/&gt;&lt;img align="absmiddle" height="96px" width="409px" file="ed10049.JPG" alt="ed10049.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;例如，R&lt;sup&gt;1&lt;/sup&gt;為碳數1至12的烷基；L&lt;sup&gt;1&lt;/sup&gt;為氟；L&lt;sup&gt;2&lt;/sup&gt;為氫；L&lt;sup&gt;3&lt;/sup&gt;為氟；L&lt;sup&gt;4&lt;/sup&gt;為甲基；Y&lt;sup&gt;1&lt;/sup&gt;為氫；Y&lt;sup&gt;2&lt;/sup&gt;為氫；n為0。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A liquid crystalline compound having at least one physical property of stability against heat, a high clearing point, a low lower limit temperature of a liquid crystal phase, a small viscosity, a very large refractive index anisotropy, and excellent compatibility with other liquid crystalline compounds is provided as a material used in elements for electromagnetic wave control in a frequency range from 1 GHz to 10 THz. A liquid crystal composition containing this compound, and an element using this composition and capable of controlling electromagnetic waves in a wide temperature range are provided. The compound is represented by Formula (1). &lt;br/&gt;&lt;img align="absmiddle" height="109px" width="404px" file="ed10050.JPG" alt="ed10050.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;For example, R&lt;sup&gt;1&lt;/sup&gt; is alkyl having 1 to 12 carbon atoms; L&lt;sup&gt;1&lt;/sup&gt; is fluorine; L&lt;sup&gt;2&lt;/sup&gt; is hydrogen; L&lt;sup&gt;3&lt;/sup&gt; is fluorine; L&lt;sup&gt;4&lt;/sup&gt; is methyl; Y&lt;sup&gt;1&lt;/sup&gt; is hydrogen; Y&lt;sup&gt;2&lt;/sup&gt; is hydrogen; and n is 0.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1151" publication-number="202625761">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625761</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129770</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用靜電吸座的基板對基板接合</chinese-title>
        <english-title>SUBSTRATE-TO-SUBSTRATE BONDING USING ELECTROSTATIC CHUCKS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260311B">H10P72/72</main-classification>
        <further-classification edition="202601120260311B">H10W80/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛　雷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XUE, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泰德斯基　倫納德Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEDESCHI, LEONARD M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕克　維傑Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARKHE, VIJAY D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科拉西達拉邁亞　昂卡拉斯瓦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KORASIDDARAMAIAH, ONKARA SWAMY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉馬斯瓦米　卡爾蒂克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMASWAMY, KARTIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的數個實施例說明一種設備。此設備包括設置於一處理區域中的一第一ESC。第一ESC包括一或多個區段，及第一ESC的此一或多個區段的各者的一表面定義一第一吸附表面，第一吸附表面定向於一第一方向中。一第一吸附力致使一第一基板緊靠於第一吸附表面。設置於處理區域中一第二ESC包括一或多個區段，及第二ESC的此一或多個區段的各者的一表面定義一第二吸附表面，第二吸附表面定向於一第二方向中，第二方向相反於第一方向。一第二吸附力致使一第二基板緊靠於第二吸附表面。一致動器配置以相對於第二ESC定位第一ESC。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the disclosure describe an apparatus including a first electrostatic chuck (ESC) disposed in a processing region includes one or more segments and a surface of each of the one or more segments of the first ESC defines a first chucking surface that is oriented in a first direction. A first chucking force causes a first substrate to be urged against the first chucking surface. A second ESC disposed in the processing region includes one or more segments and a surface of each of the one or more segments of the second ESC defines a second chucking surface that is oriented in a second direction that is opposite the first direction. A second chucking force causes a second substrate to be urged against the second chucking surface. An actuator is configured to position the first ESC relative to the second ESC.</p>
      </isu-abst>
      <representative-img>
        <p type="p">105A:第一基板</p>
        <p type="p">105A-1,105B-1:上側</p>
        <p type="p">105A-2,105B-2:下側</p>
        <p type="p">105B:第二基板</p>
        <p type="p">112:系統控制器</p>
        <p type="p">302-2:剖面側視圖</p>
        <p type="p">306:處理腔室</p>
        <p type="p">303:處理區域</p>
        <p type="p">304:底座</p>
        <p type="p">305,341:致動器</p>
        <p type="p">307:壁</p>
        <p type="p">308:外部區域</p>
        <p type="p">309:狹縫閥</p>
        <p type="p">310a:第一ESC</p>
        <p type="p">310b:第二ESC</p>
        <p type="p">312:旋轉系統</p>
        <p type="p">313:旋轉臂</p>
        <p type="p">321b:接線組件</p>
        <p type="p">326a:第一電壓源</p>
        <p type="p">326b:第二電壓源</p>
        <p type="p">327,342:方向</p>
        <p type="p">328:旋轉方向</p>
        <p type="p">340:旋轉密封件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1152" publication-number="202624207">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624207</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129771</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>純化包含單體ε—己內醯胺的水性液體流的程序</chinese-title>
        <english-title>PROCESS FOR PURIFYING AN AQUEOUS LIQUID STREAM COMPRISING MONOMERIC ε-CAPROLACTAM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D201/12</main-classification>
        <further-classification edition="200601120260302B">C07D201/16</further-classification>
        <further-classification edition="200601120260302B">C07D223/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商巴斯夫歐洲公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASF SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布莱　史蒂凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BLEI, STEFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉維庫瑪　維克拉姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAVIKUMAR, VIKRAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾　圖發里　費索　阿里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EL-TOUFAILI, FAISSAL-ALI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉瑞亞　伊斯特　馬特卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LARYEA, ESTHER MATYKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉寶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, BAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高爾　約亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAUER, JOCHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科爾施　菲利浦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COELSCH, PHILIPP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格細亞　羅密羅　艾文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARCIA ROMERO, IVAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">純化包含單體ε-己內醯胺、聚醯胺6及一或多種有機化合物X的水性液體流的程序，其中單體ε-己內醯胺具有沸點T&lt;sub&gt;C&lt;/sub&gt;且該一或多種有機化合物X具有沸點T&lt;sub&gt;X&lt;/sub&gt; ＞ T&lt;sub&gt;C&lt;/sub&gt;。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A process for purifying an aqueous liquid stream comprising monomeric ε-caprolactam, polyamide 6 and one or more organic compounds X, wherein monomeric ε-caprolactam has a boiling point TC and the one or more one organic compounds X have a boiling point T&lt;sub&gt;X&lt;/sub&gt; ＞ T&lt;sub&gt;C&lt;/sub&gt;.</p>
      </isu-abst>
      <representative-img>
        <p type="p">M&lt;sub&gt;D1&lt;/sub&gt;:水性解聚混合物</p>
        <p type="p">S&lt;sub&gt;M&lt;/sub&gt;:流</p>
        <p type="p">S&lt;sub&gt;P-HS1&lt;/sub&gt;:水性產物流</p>
        <p type="p">S&lt;sub&gt;P-HS2&lt;/sub&gt;:水性產物流</p>
        <p type="p">S&lt;sub&gt;R-HS1&lt;/sub&gt;:水性殘餘物流</p>
        <p type="p">S&lt;sub&gt;R-HS2&lt;/sub&gt;:水性殘餘物流</p>
        <p type="p">S&lt;sub&gt;R-WS1&lt;/sub&gt;:水性殘餘物流</p>
        <p type="p">S&lt;sub&gt;R-WS2&lt;/sub&gt;:水性殘餘物流</p>
        <p type="p">S&lt;sub&gt;R1&lt;/sub&gt;:液體水性產物流</p>
        <p type="p">S&lt;sub&gt;R2&lt;/sub&gt;:液體水性流</p>
        <p type="p">S&lt;sub&gt;WS1&lt;/sub&gt;:液體水性產物流</p>
        <p type="p">S&lt;sub&gt;WS2&lt;/sub&gt;:液體水性產物流</p>
        <p type="p">U&lt;sub&gt;HS1&lt;/sub&gt;:高沸物分離單元</p>
        <p type="p">U&lt;sub&gt;HS2&lt;/sub&gt;:高沸物分離單元</p>
        <p type="p">U&lt;sub&gt;R1&lt;/sub&gt;:第一解聚單元</p>
        <p type="p">U&lt;sub&gt;R2&lt;/sub&gt;:第二解聚單元</p>
        <p type="p">U&lt;sub&gt;WS1&lt;/sub&gt;:第一水分離單元</p>
        <p type="p">U&lt;sub&gt;WS2&lt;/sub&gt;:第二水分離單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1153" publication-number="202624987">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624987</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129818</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>檢索擴增生成系統、檢索擴增生成方法、檢索擴增生成所需之電腦程式產品及自然語言處理模型之生成方法</chinese-title>
        <english-title>RETRIEVAL-AUGMENTED GENERATION SYSTEM, RETRIEVAL-AUGMENTED GENERATION METHOD, COMPUTER PROGRAM PRODUCT FOR RETRIEVAL-AUGMENTED GENERATION, AND METHOD FOR GENERATING NATURAL LANGUAGE PROCESSING MODEL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260102B">G06F16/33</main-classification>
        <further-classification edition="202501120260102B">G06F16/3329</further-classification>
        <further-classification edition="201901120260102B">G06F16/338</further-classification>
        <further-classification edition="202001120260102B">G06F40/30</further-classification>
        <further-classification edition="202301120260102B">G06Q30/0251</further-classification>
        <further-classification edition="202301120260102B">G06Q30/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商樂天集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAKUTEN GROUP, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平𤥨海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIRA, TAKUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辻畑駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUJIHATA, SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 藉由將符合使用者之需求的適切檢索用之關鍵字進行提案，以抑制廣告績效指標的降低。  &lt;br/&gt;　　[解決手段] 檢索支援伺服器(11)，係將包含有藉由將檢索要求及使用者之使用者帳號綁定之檢索而被輸入的1個以上的詞在內的輸入詞組，予以受理；將含有檢索詞組及廣告績效指標值在內的廣告實績資料，加以取得；對自然語言處理模型而將包含有：輸入詞組、檢索詞組、檢索詞組所被建立關連之廣告績效指標值及指示文在內的提詞進行輸入，並將被預測為高廣告績效指標值的推薦詞組，加以取得；將用來令含有推薦詞組在內的檢索結果頁面做顯示所需之資料，發送至使用者終端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:資訊處理系統</p>
        <p type="p">10:檢索擴增生成系統</p>
        <p type="p">11:檢索支援伺服器</p>
        <p type="p">11A:處理器</p>
        <p type="p">11B:記憶體</p>
        <p type="p">11C:通訊介面</p>
        <p type="p">13:檢索伺服器</p>
        <p type="p">13A:處理器</p>
        <p type="p">13B:記憶體</p>
        <p type="p">13C:通訊介面</p>
        <p type="p">14:廣告伺服器</p>
        <p type="p">14A:處理器</p>
        <p type="p">14B:記憶體</p>
        <p type="p">14C:通訊介面</p>
        <p type="p">15:使用者管理伺服器</p>
        <p type="p">15A:處理器</p>
        <p type="p">15B:記憶體</p>
        <p type="p">15C:通訊介面</p>
        <p type="p">16:LLM伺服器</p>
        <p type="p">16A:LLM</p>
        <p type="p">17:網路</p>
        <p type="p">20:使用者終端裝置</p>
        <p type="p">20A:處理器</p>
        <p type="p">20B:記憶體</p>
        <p type="p">20C:通訊介面</p>
        <p type="p">20D:輸入裝置</p>
        <p type="p">20E:顯示裝置</p>
        <p type="p">30:廣告DB</p>
        <p type="p">31:廣告實績DB</p>
        <p type="p">32:使用者管理DB</p>
        <p type="p">110:程式</p>
        <p type="p">130:網路爬蟲</p>
        <p type="p">131:索引</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1154" publication-number="202624592">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624592</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129825</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>處理製漿製程所產生之黑液的方法</chinese-title>
        <english-title>METHOD FOR PROCESSING BLACK LIQUOR IN PULPING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">D21C11/00</main-classification>
        <further-classification edition="200601120260302B">D21C3/02</further-classification>
        <further-classification edition="200601120260302B">D21C3/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華紙漿股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG HWA PULP CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何壽川</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, SHOW CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃鯤雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, KWENG-SHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡樹勲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, SHU-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>隋壽齡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種處理黑液的方法，包含以下操作： (A1)對黑液進行超過濾；(A2)將超濾濃縮液與硫酸及/或二氧化碳混合，使超濾濃縮液中的木質素沉澱，並得到第一無機水溶液；(A3)混合第一無機水溶液與超濾濾液得到混合液，並對混合液進行奈米過濾；(A4)將奈濾濃縮液與二氧化碳及/或硫酸混合，使奈濾濃縮液中的木質素沉澱，並得到第二無機水溶液； (A5)將第二無機水溶液進行第一電透析處理或逆滲透處理，並得到殘餘無機水溶液；(A6)混合殘餘無機水溶液與操作(A2)及/或操作(A4)所得的木質素，得到第一燃料液；及(A7)處理第一燃料液，產生硫化鈉、碳酸鈉、二氧化碳及水蒸氣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for processing black liquor includes the operations of: (A1) ultrafiltering the black liquor; (A2) mixing the ultrafiltration concentrate with sulfuric acid and/or carbon dioxide to precipitate lignin in the ultrafiltration concentrate, and obtaining a first inorganic aqueous solution; (A3) mixing the first inorganic aqueous solution with the ultrafiltration permeate to obtain a mixture, and nanofiltering the mixture; (A4) mixing the nanofiltration concentrate with sulfuric acid and/or carbon dioxide to precipitate lignin in the nanofiltration concentrate, and obtaining a second inorganic aqueous solution; (A5) performing a first electrodialysis treatment or reverse osmosis treatment on the second inorganic aqueous solution, and obtaining a remaining inorganic aqueous solution; (A6) mixing the remaining inorganic aqueous solution with the lignin obtained from operation (A2) and/or operation (A4) to obtain a first fuel liquid; and (A7) processing the first fuel liquid to produce sodium sulfide, sodium carbonate, carbon dioxide, and steam.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:方法</p>
        <p type="p">A1、A2、A3、A4、A5、A6、A7、A8、A9、A10、A11、A12:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1155" publication-number="202624309">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624309</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129830</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬化性樹脂組成物、製造樹脂硬化體的方法及製造電路連接體的方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08F222/40</main-classification>
        <further-classification edition="202601120260302B">H10W70/67</further-classification>
        <further-classification edition="202601120260302B">H10W74/10</further-classification>
        <further-classification edition="202601120260302B">H10W74/47</further-classification>
        <further-classification edition="202601120260302B">H10W90/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>太郎
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAYAMA, SHINTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野口和也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOGUCHI, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種硬化性樹脂組成物，包含：具有被通過加熱而解離的封閉劑封閉的馬來醯亞胺基的封閉馬來醯亞胺化合物；以及反應性成分，其為具有與馬來醯亞胺基反應的反應性基的化合物、或通過加熱而生成反應性基的化合物。封閉劑可為通過220℃以下的加熱而從馬來醯亞胺基解離且具有250℃以下的沸點的化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電路連接體</p>
        <p type="p">10:第一電路構件</p>
        <p type="p">11:第一基板</p>
        <p type="p">12:第一電極</p>
        <p type="p">13:第一絕緣膜</p>
        <p type="p">20:第二電路構件</p>
        <p type="p">21:第二基板</p>
        <p type="p">22:第二電極</p>
        <p type="p">23:第二絕緣膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1156" publication-number="202624200">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624200</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129856</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光硬化性組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體元件之製造方法、半導體元件及化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07C251/64</main-classification>
        <further-classification edition="200601120260302B">C07C323/47</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/027</further-classification>
        <further-classification edition="200601120260302B">G03F7/031</further-classification>
        <further-classification edition="200601120260302B">G03F7/038</further-classification>
        <further-classification edition="200601120260302B">G03F7/16</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="200601120260302B">G03F7/32</further-classification>
        <further-classification edition="202601120260302B">H10P14/68</further-classification>
        <further-classification edition="202601120260302B">H10P76/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牧野雅臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAKINO, MASAOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種包含化合物A及化合物B之光硬化性組成物、將上述組成物硬化而成之硬化物及其製造方法、包含硬化物之積層體及其製造方法、半導體元件及其製造方法、以及新型化合物，前述化合物A為具有聯苯結構或茀結構且具有式（1）所表示之取代基及式（2）所表示之取代基這兩者鍵結而成之結構之化合物，前述化合物B為具有聚合性基之化合物。  &lt;br/&gt;&lt;img align="absmiddle" height="183px" width="223px" file="ed10089.JPG" alt="ed10089.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1157" publication-number="202623808">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623808</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129934</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>透過投予BTK抑制劑治療鐮狀細胞疾病之方法</chinese-title>
        <english-title>METHODS FOR TREATING SICKLE CELL DISEASE BY ADMINISTERING A BTK INHIBITOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">A61K31/519</main-classification>
        <further-classification edition="200601120260306B">A61K31/497</further-classification>
        <further-classification edition="200601120260306B">A61K31/44</further-classification>
        <further-classification edition="200601120260306B">A61P7/00</further-classification>
        <further-classification edition="200601120260306B">A61P7/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商普林斯匹亞生物製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRINCIPIA BIOPHARMA INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達克　艾哈邁德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAAK, AHMED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SD</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米科爾　文森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIKOL, VINCENT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊特　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIGHT, DAVID RICHARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝爾徹　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BELCHER, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韋爾切洛蒂　葛雷戈里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERCELLOTTI, GREGORY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露了用於治療鐮狀細胞疾病（Sickle Cell Disease，SCD）之方法，該等方法包括投予BTKi，如選自(R)-2-[3-[4-胺基-3-(2-氟-4-苯氧基-苯基)吡唑並[3,4-d]嘧啶-1-基]哌啶-1-羰基]-4-甲基-4-[4-(氧雜環丁烷-3-基)哌𠯤-1-基]戊-2-烯腈（瑞紮布魯替尼（rilzabrutinib））及其醫藥上可接受的鹽的至少一種化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods for treating Sickle Cell Disease (SCD) comprising administering a BTKi, such as at least one compound chosen from (R)-2-[3-[4-amino-3-(2-fluoro-4-phenoxy-phenyl)pyrazolo[3,4-d]pyrimidin-1-yl]piperidine-1-carbonyl]-4-methyl-4-[4-(oxetan-3-yl)piperazin-1-yl]pent-2-enenitrile (rilzabrutinib) and pharmaceutically acceptable salts thereof, are disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1158" publication-number="202624889">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624889</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129953</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性組合物、樹脂硬化膜之製造方法、阻隔壁、發光元件、顯示裝置、光轉換像素、彩色濾光片及圖像顯示裝置</chinese-title>
        <english-title>PHOTOSENSITIVE COMPOSITION, METHOD OF PRODUCING CURED RESIN FILM, BANK, LIGHT-EMITTING DEVICE, DISPLAY DEVICE, LIGHT CONVERSION PIXEL, COLOR FILTER AND IMAGE DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">G03F7/004</main-classification>
        <further-classification edition="200601120260306B">G03F7/027</further-classification>
        <further-classification edition="200601120260306B">G03F7/20</further-classification>
        <further-classification edition="202301120260306B">H10K59/122</further-classification>
        <further-classification edition="202301120260306B">H10K59/38</further-classification>
        <further-classification edition="200601120260306B">G02B5/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商中央硝子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CENTRAL GLASS COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>兼子譲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANEKO, YUZURU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂井田悠太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAIDA, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古屋勇希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUYA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之感光性組合物包含具有乙烯性碳-碳雙鍵之化合物(A)、選自由硫醇及硫醇前驅物所組成之群中之1種或2種以上之硫醇系化合物(B)、光自由基起始劑(C)、及氧化鈦(D)，且全部非揮發成分中之氧化鈦(D)之比率為5質量%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1159" publication-number="202624354">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624354</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129954</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性組合物、樹脂硬化膜之製造方法、阻隔壁、發光元件、顯示裝置、光轉換像素、彩色濾光片及圖像顯示裝置</chinese-title>
        <english-title>PHOTOSENSITIVE COMPOSITION, METHOD OF PRODUCING CURED RESIN FILM, BANK, LIGHT-EMITTING DEVICE, DISPLAY DEVICE, LIGHT CONVERSION PIXEL, COLOR FILTER AND IMAGE DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260302B">C08G75/045</main-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/038</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="200601120260302B">G03F7/40</further-classification>
        <further-classification edition="200601120260302B">G02B5/20</further-classification>
        <further-classification edition="200601120260302B">G02B5/22</further-classification>
        <further-classification edition="200601120260302B">G09F9/30</further-classification>
        <further-classification edition="200601120260302B">H05B33/14</further-classification>
        <further-classification edition="202301120260302B">H10K59/122</further-classification>
        <further-classification edition="202301120260302B">H10K59/173</further-classification>
        <further-classification edition="202301120260302B">H10K59/38</further-classification>
        <further-classification edition="202301120260302B">H10K71/12</further-classification>
        <further-classification edition="202301120260302B">H10K71/20</further-classification>
        <further-classification edition="202301120260302B">H10K71/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商中央硝子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CENTRAL GLASS COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>兼子譲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANEKO, YUZURU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂井田悠太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAIDA, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古屋勇希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUYA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之感光性組合物包含具有乙烯性碳-碳雙鍵之化合物(A)、選自由硫醇及硫醇前驅物所組成之群中之1種或2種以上之硫醇系化合物(B)、及光自由基起始劑(C)。  &lt;br/&gt;將於25℃下使用B型黏度計於旋轉速度5 rpm之條件下對該感光性組合物進行測定所得之黏度設為η&lt;sub&gt;0&lt;/sub&gt;。又，將該感光性組合物於100℃下靜置5小時，其後於25℃下進行自然冷卻，將於25℃下使用B型黏度計於旋轉速度5 rpm之條件下對上述自然冷卻後之感光性組合物進行測定所得之黏度設為η&lt;sub&gt;1&lt;/sub&gt;。此時，{(η&lt;sub&gt;1&lt;/sub&gt;－η&lt;sub&gt;0&lt;/sub&gt;)/η&lt;sub&gt;0&lt;/sub&gt;}×100(%)所表示之增黏率為5.0%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1160" publication-number="202623812">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623812</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129980</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化合物</chinese-title>
        <english-title>COMPOUNDS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">A61K31/5415</main-classification>
        <further-classification edition="200601120260305B">A61K31/5355</further-classification>
        <further-classification edition="200601120260305B">A61K31/55</further-classification>
        <further-classification edition="200601120260305B">A61K31/497</further-classification>
        <further-classification edition="200601120260305B">A61K31/44</further-classification>
        <further-classification edition="200601120260305B">A61P37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商葛蘭素史密斯克藍智慧財產發展有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLAXOSMITHKLINE INTELLECTUAL PROPERTY DEVELOPMENT LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾克斯坦　傑弗瑞　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AXTEN, JEFFREY MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊凡斯　凱倫　安德森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EVANS, KAREN ANDERSON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬特　卡斯柏特　卡休斯　唐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARTYR, CUTHBERT CASSEUS DON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫拉里斯　雷默斯　安琪兒　伊凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORALES-RAMOS, ANGEL IVAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉爾夫　傑弗瑞　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RALPH, JEFFREY MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅賓森　森菲亞　葛瑞絲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROBINSON, SOPHIA GRACE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>譚　興隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIAN, XINRONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示式(I)之化合物：  &lt;br/&gt;&lt;img align="absmiddle" height="245px" width="348px" file="ed10232.JPG" alt="ed10232.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;其為MRGX2之拮抗劑，且因此適用於治療MRGX2介導之疾病及病症。本發明亦揭示包含式(I)之化合物的醫藥組合物、使用該等化合物的方法及製備該等化合物的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are chemical compounds of Formula (I): &lt;br/&gt;&lt;img align="absmiddle" height="246px" width="353px" file="ed10233.JPG" alt="ed10233.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;which are antagonists of MRGX2 and therefore useful in the treatment of MRGX2-mediated diseases and disorders. Also disclosed are pharmaceutical compositions comprising chemical compounds of Formula (I), methods of using such compounds and methods of making the same.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1161" publication-number="202624137">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624137</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130048</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水處理裝置及水處理監視方法</chinese-title>
        <english-title>WATER TREATMENT DEVICE AND WATER TREATMENT MONITORING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260306B">C02F1/32</main-classification>
        <further-classification edition="202301120260306B">C02F1/42</further-classification>
        <further-classification edition="202301120260306B">C02F9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商奧璐佳瑙股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORGANO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫渤宸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, BORCHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉永尚哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHINAGA, NAOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村勇規</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種水處理裝置，具有：複數個裝置組，該裝置組係對供應的被處理水進行指定處理的UV與CP以UV、CP之順序串聯連接而成；該複數個裝置組（110-1）、（110-2）彼此之間僅藉由管路、或僅藉由滯留時間在15分鐘以內的裝置及管路串聯連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A water treatment device of the invention has a plurality of device sets each containing a UV and CP device, connected in series in that order, which subject a supplied water to be treated to predetermined processing, wherein the plurality of device sets (110-1), (110-2) are connected in series to each other via piping only, or via a device and piping in which the retention time is 15 minutes or less.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:RO(逆滲透膜裝置)</p>
        <p type="p">11:EDI(無機碳去除裝置)</p>
        <p type="p">12:MD(脫氣膜裝置)</p>
        <p type="p">13-1:UV(紫外線照射裝置)</p>
        <p type="p">13-2:UV(紫外線照射裝置)</p>
        <p type="p">14-1:CP(離子交換樹脂填充裝置)</p>
        <p type="p">14-2:CP(離子交換樹脂填充裝置)</p>
        <p type="p">20-1:閥門</p>
        <p type="p">20-2:閥門</p>
        <p type="p">20-3:閥門</p>
        <p type="p">20-4:閥門</p>
        <p type="p">30:閥門</p>
        <p type="p">40:TOC計</p>
        <p type="p">50:控制部</p>
        <p type="p">100:水處理裝置</p>
        <p type="p">110-1:裝置組</p>
        <p type="p">110-2:裝置組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1162" publication-number="202624278">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624278</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130077</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製造超吸收劑之方法</chinese-title>
        <english-title>PROCESS FOR PRODUCING SUPERABSORBENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">C08F2/04</main-classification>
        <further-classification edition="200601120260306B">C08J3/24</further-classification>
        <further-classification edition="200601120260306B">C08J3/12</further-classification>
        <further-classification edition="200601120260306B">A61L15/22</further-classification>
        <further-classification edition="200601120260306B">A61L15/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商巴地斯顏料化工廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASF SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史羅德　喬根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHROEDER, JUERGEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威斯曼特爾　瑪夏斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEISMANTEL, MATTHIAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美梅克　馬克思</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAEMECKE, MARCUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方克　魯迪格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUNK, RUEDIGER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李允中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於製造超吸收劑之方法，其中使具有酸基之烯系不飽和單體至少部分地經氫氧化鈉溶液中和，該氫氧化鈉溶液包括0.001重量%至0.05重量%之氯化鈉，該氫氧化鈉溶液係儲存於該中和直接上游之容器中，且該容器之內表面係由鋼製成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a process for producing superabsorbents, wherein an ethylenically unsaturated monomer bearing acid groups is at least partly neutralized with sodium hydroxide solution, the sodium hydroxide solution comprises from 0.001% to 0.05% by weight of sodium chloride, the sodium hydroxide solution is stored in a vessel directly upstream of the neutralization, and the interior surface of the container is made of steel.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1163" publication-number="202624279">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624279</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130078</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製造超吸收劑之方法</chinese-title>
        <english-title>PROCESS FOR PRODUCING SUPERABSORBENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">C08F2/04</main-classification>
        <further-classification edition="200601120260306B">C08J3/24</further-classification>
        <further-classification edition="200601120260306B">C08J3/12</further-classification>
        <further-classification edition="200601120260306B">A61L15/22</further-classification>
        <further-classification edition="200601120260306B">A61L15/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商巴地斯顏料化工廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASF SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美梅克　馬克思</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAEMECKE, MARCUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威斯曼特爾　瑪夏斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEISMANTEL, MATTHIAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德　凱　羅尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE KAEY, RONNY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波塞米爾　卡爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POSSEMIERS, KARL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方克　魯迪格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUNK, RUEDIGER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史羅德　喬根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHROEDER, JUERGEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李允中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於製造超吸收劑之方法，其中使具有酸基之烯系不飽和單體至少部分地經氫氧化鈉溶液中和，該氫氧化鈉溶液係儲存於該中和直接上游之容器中，且該容器之內表面係由沃斯田鋼(austenitic steel)製成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a process for producing superabsorbents, wherein an ethylenically unsaturated monomer bearing acid groups is at least partly neutralized with sodium hydroxide solution, the sodium hydroxide solution is stored in a vessel directly upstream of the neutralization, and the interior surface of the container is made of austenitic steel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1164" publication-number="202624348">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624348</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130087</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚醯亞胺樹脂前驅物清漆及聚醯亞胺薄膜</chinese-title>
        <english-title>POLYIMIDE RESIN PRECURSOR VARNISH AND POLYIMIDE FILM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">C08G73/10</main-classification>
        <further-classification edition="200601120260309B">C09D179/08</further-classification>
        <further-classification edition="201801120260309B">C09D7/20</further-classification>
        <further-classification edition="200601120260309B">C08J5/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安孫子洋平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABIKO, YOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>近藤利樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONDO, RIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石井健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHII, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米浜伸一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONEHAMA, SHINICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林郁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種聚醯亞胺樹脂前驅物清漆，包含：具有來自四羧酸二酐之構成單元A及來自二胺之構成單元B的聚醯亞胺樹脂前驅物及溶劑，構成單元A包含：選自由來自式(a11)表示之化合物的構成單元及來自式(a12)表示之化合物的構成單元(A12)構成之群組中之至少1種的構成單元，構成單元B包含：來自式(b1)表示之化合物的構成單元，該溶劑包含：沸點為190~250℃之溶劑及沸點為110~160℃之溶劑。  &lt;br/&gt;&lt;img align="absmiddle" height="125px" width="656px" file="ed10013.JPG" alt="ed10013.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;X為碸基等。Y為六氟亞異丙基或亞茀基。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A polyimide resin precursor varnish comprising a polyimide resin precursor having structural unit A derived from a tetracarboxylic acid dianhydride and structural unit B derived from a diamine, and a solvent, &lt;br/&gt;wherein the structural unit A includes at least one structural unit selected from the group consisting of a structural unit derived from a compound represented by formula (a11) and a structural unit (A12) derived from a compound represented by formula (a12); &lt;br/&gt;the structural unit B includes a structural unit derived from a compound represented by formula (b1); and &lt;br/&gt;the solvent includes a solvent having a boiling point of 190–250°C and a solvent having a boiling point of 110–160°C. &lt;br/&gt;&lt;img align="absmiddle" height="107px" width="572px" file="ed10014.JPG" alt="ed10014.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(X is a sulfonyl group or the like. Y is a hexafluoroisopropylidene group or a fluorenylidene group.)</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1165" publication-number="202623810">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623810</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130098</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療癌症的端粒酶抑制化合物及其單離之鏡像異構物</chinese-title>
        <english-title>TELOMERASE-INHIBITING COMPOUNDS AND ISOLATED ENANTIOMERS FOR TREATING CANCER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/5375</main-classification>
        <further-classification edition="200601120260302B">A61K31/44</further-classification>
        <further-classification edition="200601120260302B">A61K31/4155</further-classification>
        <further-classification edition="200601120260302B">A61K31/351</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商傑龍公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GERON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱拉　瑪諾傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHERA, MANOJ KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索尼　阿傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONI, AJAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴傑派　馬里尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAJPAI, MALINI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供可用於抑制端粒酶的化合物及單離鏡像異構物，其藥學上可接受的鹽，以及包含至少一種此類化合物、單離鏡像異構物或其藥學上可接受的鹽的醫藥組合物。本發明還描述了此類化合物、單離鏡像異構物或其藥學上可接受的鹽，以及包含至少一種此類化合物、單離鏡像異構物或其藥學上可接受的鹽的醫藥組合物在治療如癌症等疾病或病症中的用途，其中所述的癌症可能是血液學惡性腫瘤或實體瘤。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are compounds and isolated enantiomers useful for inhibiting telomerase, pharmaceutically acceptable salts thereof, and pharmaceutical compositions comprising at least one such compound, isolated enantiomer, or pharmaceutically acceptable salt thereof. Also described is the use of such compounds, isolated enantiomers, or pharmaceutically acceptable salts thereof, and the use of pharmaceutical compositions comprising at least one such compound, isolated enantiomer, or pharmaceutically acceptable salt thereof, in methods of treating disorders or conditions such as cancer, where the cancer may be a hematological malignancy or a solid tumor.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1166" publication-number="202625764">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625764</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130129</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鍵合裝置、鍵合系統及利用其的裸片鍵合方法</chinese-title>
        <english-title>BONDING DEVICE, BONDING SYSTEM AND DIE BONDING METHOD USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/76</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商細美事有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李東和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DONG HWA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫尙郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SON, SANG UK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李壽洪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SOO HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉同眞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOO, DONG JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李相和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SANG HWA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於穩定鍵合裸片的鍵合裝置。所述鍵合裝置包括：鍵合塊，包括真空線及空氣線，所述真空線用於提供真空，所述空氣線用於提供空氣；以及夾頭，包括主體、吸附線及腔體，所述吸附線設置在所述主體內，與所述真空線相連接，所述腔體設置在所述主體內，與所述空氣線相連接，隨著所述腔體的形狀因向所述腔體供給的空氣的壓力而變形，所述夾頭的底面形狀也產生變形。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:鍵合裝置</p>
        <p type="p">110:鍵合塊</p>
        <p type="p">111:本體</p>
        <p type="p">121:第二真空線</p>
        <p type="p">122:空氣線</p>
        <p type="p">123:第一真空線</p>
        <p type="p">130:夾頭</p>
        <p type="p">131:底板</p>
        <p type="p">141:主體</p>
        <p type="p">143:腔體</p>
        <p type="p">145:吸附線</p>
        <p type="p">147:底面</p>
        <p type="p">149:空氣孔</p>
        <p type="p">161:下表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1167" publication-number="202624440">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624440</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130145</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>反應性聚胺基甲酸酯熱熔黏著劑組合物及製品</chinese-title>
        <english-title>REACTIVE POLYURETHANE HOT-MELT ADHESIVE COMPOSITION AND ARTICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260310B">C09J175/06</main-classification>
        <further-classification edition="200601120260310B">C09J175/08</further-classification>
        <further-classification edition="200601120260310B">C08G18/40</further-classification>
        <further-classification edition="200601120260310B">C08G18/48</further-classification>
        <further-classification edition="200601120260310B">C08G18/62</further-classification>
        <further-classification edition="200601120260310B">C08G18/76</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商波士提克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOSTIK SA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹盛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAO, SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈成良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIA, CHENGLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於反應性聚胺基甲酸酯熱熔黏著劑組合物及包括由其形成之黏著劑層之製品。該反應性聚胺基甲酸酯熱熔黏著劑組合物係由包括下列組分之原材料製備：  &lt;br/&gt;-包括至少一種聚醚多元醇之聚醚多元醇組分(A)；  &lt;br/&gt;-包括以下物質之聚酯多元醇組分(B)：  &lt;br/&gt;○ 起始結晶溫度介於35℃至55℃之間之至少一種結晶聚酯多元醇(B1)；  &lt;br/&gt;○ 起始結晶溫度低於30℃之至少一種結晶聚酯多元醇(B2)；  &lt;br/&gt;○ 至少一種非結晶聚酯多元醇(B3)；  &lt;br/&gt;-包括至少一種丙烯酸樹脂(C1)之丙烯酸樹脂組分(C)，該丙烯酸樹脂(C1)包括與異氰酸酯基團反應之活性官能基，該丙烯酸樹脂(C1)之數量平均D90粒度不大於350 µm；及  &lt;br/&gt;-包括至少一種聚異氰酸酯之聚異氰酸酯組分(D)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a reactive polyurethane hot-melt adhesive composition and an article comprising an adhesive layer formed therefrom. The reactive polyurethane hot-melt adhesive composition is prepared by a raw material comprising the following components: &lt;br/&gt;- a polyether polyol component (A) comprising at least one polyether polyol; &lt;br/&gt;- a polyester polyol component (B) comprising : &lt;br/&gt;○ at least one crystalline polyester polyol (B1) having an onset crystallization temperature ranging from 35°C to 55°C; &lt;br/&gt;○ at least one crystalline polyester polyol (B2) having an onset crystallization temperature lower than 30°C; &lt;br/&gt;○ at least one non-crystalline polyester polyol (B3); &lt;br/&gt;- an acrylic resin component (C) comprising at least one acrylic resin (C1), the acrylic resin (C1) comprising an active functional group which is reactive with an isocyanate group, the acrylic resin (C1) having a number average D90 particle size of no greater than 350 µm; and &lt;br/&gt;- a polyisocyanate component (D) comprising at least one polyisocyanate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1168" publication-number="202624508">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624508</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130149</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ｐ型氧化錫膜的形成方法及成膜裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">C23C14/08</main-classification>
        <further-classification edition="200601120260304B">C23C14/40</further-classification>
        <further-classification edition="200601120260304B">C23C14/58</further-classification>
        <further-classification edition="201001120260304B">H01M4/48</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉松孝宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIMATSU, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中林肇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKABAYASHI, HAJIME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 容易生成p型氧化錫(II)。  &lt;br/&gt;　　[解決手段] 交互層積由金屬錫組成的第1膜、與由氧化錫(IV)組成的第2膜形成層積體，對層積體施加熱處理從層積體生成p型氧化錫(II)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1169" publication-number="202624800">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624800</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130151</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光連接組件、光連接零件、及光連接組件之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">G02B6/02</main-classification>
        <further-classification edition="200601120260313B">H01R13/20</further-classification>
        <further-classification edition="200601120260313B">H01R4/01</further-classification>
        <further-classification edition="200601120260313B">H01R4/18</further-classification>
        <further-classification edition="200601120260313B">A61M25/092</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友電氣工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO ELECTRIC INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田英一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, EIICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤原悠人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIHARA, YUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠提高定位精度之光連接組件、光連接零件、及光連接組件之製造方法。  &lt;br/&gt;本發明之光連接組件具備：第1光連接零件；第2光連接零件，其連接於第1光連接零件；及定位構造，其維持第1光連接零件與第2光連接零件之相對位置。定位構造包含：突起部，其從第1光連接零件突出；及孔部，其形成於第2光連接零件，供突起部插入。於孔部之內表面，形成有從內表面朝向突起部突出之至少一個凸部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光連接組件</p>
        <p type="p">10:光連接器(第1光連接零件)</p>
        <p type="p">11:光纖(光波導)</p>
        <p type="p">12:保護材</p>
        <p type="p">12a:末端面</p>
        <p type="p">13:套圈</p>
        <p type="p">13a:表面</p>
        <p type="p">13b:背面</p>
        <p type="p">13d:導孔(孔部)</p>
        <p type="p">15:夾具</p>
        <p type="p">20:配接器(第2光連接零件)</p>
        <p type="p">20a:上表面</p>
        <p type="p">20b:底面</p>
        <p type="p">20c:導孔(孔部)</p>
        <p type="p">30:電路基板</p>
        <p type="p">30a:主面</p>
        <p type="p">40:導銷(突起部)</p>
        <p type="p">D1:垂直方向</p>
        <p type="p">M:定位構造</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1170" publication-number="202625652">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625652</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130214</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251114B">H10K50/856</main-classification>
        <further-classification edition="202301120251114B">H10K59/126</further-classification>
        <further-classification edition="202301120251114B">H10K59/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ顯示器股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜京潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, KYUNGYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安智煐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHN, JIYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金安基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, AHNKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申懸淨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, HYEONJEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置，包括：基板，包含佈置有複數個像素的顯示區以及圍繞該顯示區的非顯示區，其中，該複數個像素中的每一個均具有複數個子像素；陰極電極，位於該基板上，並設置在該非顯示區的一部分及該顯示區中；有機層，位於該非顯示區的一部分及該顯示區中的該陰極電極下方；有機層遮蔽部，位於該非顯示區中，其中，該有機層設置於該非顯示區的該部分中而不設置於該有機層遮蔽部中；以及低反射結構，與該有機層遮蔽部的至少一部分重疊，並位於該非顯示區中的該陰極電極與該基板之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display apparatus comprising: a substrate including a display area in which a plurality of pixels are arranged and a non-display area around the display area, each of the plurality of pixels having a plurality of subpixels; a cathode electrode on the substrate, the cathode electrode disposed in the display area and in a part of the non-display area; an organic layer under the cathode electrode in the display area and in a portion of the non-display area; an organic layer shielding portion in the non-display area, wherein the organic layer is disposed in the portion of the non-display area without being disposed in the organic layer shielding portion; and a low-reflection structure overlapping at least a part of the organic layer shielding portion, the low-reflection structure between the cathode electrode and the substrate in the non-display area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示裝置</p>
        <p type="p">110:基板</p>
        <p type="p">117:陰極電極</p>
        <p type="p">130:源極驅動IC</p>
        <p type="p">140:可撓性膜</p>
        <p type="p">150:電路板</p>
        <p type="p">160:時序控制器</p>
        <p type="p">GD:閘極驅動器</p>
        <p type="p">NDA:非顯示區</p>
        <p type="p">OCP:有機層遮蔽部</p>
        <p type="p">OCP2:第二有機層遮蔽部</p>
        <p type="p">P:像素</p>
        <p type="p">PA:焊墊部</p>
        <p type="p">SP:子像素</p>
        <p type="p">SP1:紅色子像素、第一子像素</p>
        <p type="p">SP2:白色子像素、第二子像素</p>
        <p type="p">SP3:綠色子像素、第三子像素</p>
        <p type="p">SP4:藍色子像素、第四子像素</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1171" publication-number="202625675">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625675</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130232</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板接合裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260313B">H10P10/00</main-classification>
        <further-classification edition="202601120260313B">H10P72/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>作山努</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKUYAMA, TSUTOMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在基板接合裝置中，控制部係在於藉由對準標記拍攝部所拍攝的圖像中無法檢測對準標記之情形中，基於記憶於記憶部之周邊特徵部分的資訊推定對準標記的位置，並基於所推定的對準標記的位置執行對準處理，該對準處理係進行用於一對基板的接合之位置對合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">AM1:上側對準標記</p>
        <p type="p">F:周邊特徵部分</p>
        <p type="p">L11:隔開距離</p>
        <p type="p">PT:周邊圖案</p>
        <p type="p">P11:視野中心</p>
        <p type="p">P12:中心</p>
        <p type="p">W1:第一基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1172" publication-number="202624887">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624887</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130271</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用ＳＣＨＥＩＭＰＦＬＵＧ光學元件之反射系統</chinese-title>
        <english-title>CATOPTRIC SYSTEM USING SCHEIMPFLUG OPTICS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">G03F7/00</main-classification>
        <further-classification edition="200601120260312B">G02B17/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日高康弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIDAKA, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　晙源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JUNWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種反射(基於鏡之)光學系統使用Scheimpflug光學元件及非同心光學元件來在EUV倍縮光罩檢測工具中產生未遮蔽之經高度放大影像(例如，＞100倍)。該等Scheimpflug光學元件收集來自一物件平面之光束且沿著一第一光軸引導該等光束以在相對於該物件平面傾斜之一中間影像平面處產生一中間影像。該等非同心光學元件將該等光束自該第一光軸重新引導至垂直於該中間影像平面之一第二光軸，且在平行於該中間影像平面之一最終影像平面上產生一經放大影像。該等Scheimpflug光學元件可包含經定位以收集法向於該物件平面重新引導之光束之一第一鏡及經定位為鄰近於該法向方向且經組態以將該等光束重新引導至該第一光軸上之一第二鏡。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A catoptric (mirror-based) optical system uses Scheimpflug optics and non-concentric optics to generate unobscured highly magnified images (e.g., ＞100x) in EUV reticle inspection tools. The Scheimpflug optics collect light beams from an object plane and directs the light beams along a first optical axis to generate an intermediate image at an intermediate image plane that is oblique to the object plane. The non-concentric optics redirect the light beams from the first optical axis to a second optical axis that is perpendicular to the intermediate image plane and generates a magnified image on a final image plane that is parallel to the intermediate image plane. The Scheimpflug optics may include a first mirror positioned to collect light beams reflected normal to the object plane and a second mirror positioned adjacent to the normal direction and configured to redirect the light beams onto the first optical axis.</p>
      </isu-abst>
      <representative-img>
        <p type="p">80:倍縮光罩/物件</p>
        <p type="p">88:影像感測器</p>
        <p type="p">92-1:極紫外(EUV)光/反射光部分/經圖案化光束</p>
        <p type="p">92-1N:法向光束</p>
        <p type="p">92-2:第二光部分/反射(經重新引導)光束</p>
        <p type="p">92-3:第三光部分/經圖案化光束</p>
        <p type="p">92-4:第四光部分/經圖案化光束</p>
        <p type="p">92-5:第五光部分/聚焦光部分</p>
        <p type="p">100:反射(基於鏡之/反射光學)系統</p>
        <p type="p">120:Scheimpflug光學元件</p>
        <p type="p">130:非同心光學元件</p>
        <p type="p">D1:距離</p>
        <p type="p">D2:距離</p>
        <p type="p">FIP:最終(第二)影像平面</p>
        <p type="p">FP-M1:焦平面點/焦點</p>
        <p type="p">IA:經成像區域</p>
        <p type="p">IIM:中間影像</p>
        <p type="p">IIP:中間影像平面</p>
        <p type="p">M1:第一凹面鏡</p>
        <p type="p">M2:第二凹面鏡</p>
        <p type="p">M3:第三鏡</p>
        <p type="p">M4:第四鏡</p>
        <p type="p">MI:經聚焦、高度放大影像</p>
        <p type="p">N:法向方向</p>
        <p type="p">OA1:第一光軸</p>
        <p type="p">OA2:第二光軸</p>
        <p type="p">OP:物件平面</p>
        <p type="p">OP’:物件平面</p>
        <p type="p">P1:第一光學路徑</p>
        <p type="p">P2:第二光學路徑</p>
        <p type="p">WIM:寬度</p>
        <p type="p">WMI:寬度</p>
        <p type="p">α:第一傾斜角</p>
        <p type="p">β:第二傾斜角</p>
        <p type="p">γ:第三傾斜角</p>
        <p type="p">θ:第四傾斜角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1173" publication-number="202625103">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625103</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130284</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>缺陷檢查系統、缺陷檢查方法、計算機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120250902B">G06V10/774</main-classification>
        <further-classification edition="202201120250902B">G06V10/44</further-classification>
        <further-classification edition="202201120250902B">G06V10/778</further-classification>
        <further-classification edition="200601120250902B">H01J37/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日立全球先端科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>前田健宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAEDA, TAKEHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原田実</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARADA, MINORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川野源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWANO, HAJIME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金澤政和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANEZAWA, MASAKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明，係其目的在於在藉由機械學習器來檢查對象物之圖像的情況下，有效率地獲得機械學習模型用於學習的圖像。本發明之缺陷檢查系統，係將顯示試料之構造的佈局圖像分割成小區域圖像，並對前述小區域圖像進行分組，以前述佈局圖像以上的解析度來拍攝藉由前述分組所獲得之各群組內的前述小區域圖像(參閱圖2)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1174" publication-number="202623784">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623784</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130295</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>油中水型乳化化妝料</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">A61K8/85</main-classification>
        <further-classification edition="200601120260309B">A61K8/89</further-classification>
        <further-classification edition="200601120260309B">A61Q1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商高絲股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羽山慶一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYAMA, KEIICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>內山阿美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UCHIYAMA, AMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大谷紘平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTANI, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案發明之課題為提供一種紫外線防禦能及耐久性優異之油中水型乳化化妝料。  &lt;br/&gt;　　作為解決手段，本案為一種油中水型乳化化妝料，其係含有下述成分(A)~(D)；  &lt;br/&gt;　　(A)25℃中為固體之油溶性紫外線吸收劑及/或金屬氧化物，  &lt;br/&gt;　　(B)矽氧系皮膜形成劑，  &lt;br/&gt;　　(C)水溶性或水分散性之紫外線吸收劑，  &lt;br/&gt;　　(D)選自聚乙酸乙烯酯及(丙烯酸(酯)類/丙烯酸烷酯(C1-18)/烷基(C1-8)丙烯醯胺)共聚合物AMP中至少1種。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1175" publication-number="202624214">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624214</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130302</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>四氫異喹啉甲基苯甲醯胺化合物</chinese-title>
        <english-title>TETRAHYDROISOQUINOLINYLMETHYLBENZAMIDE COMPOUNDS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">C07D239/74</main-classification>
        <further-classification edition="200601120260303B">C07D401/12</further-classification>
        <further-classification edition="200601120260303B">C07D405/12</further-classification>
        <further-classification edition="200601120260303B">C07D409/12</further-classification>
        <further-classification edition="200601120260303B">A61K31/472</further-classification>
        <further-classification edition="200601120260303B">A61K31/4725</further-classification>
        <further-classification edition="200601120260303B">A61P25/04</further-classification>
        <further-classification edition="200601120260303B">A61P37/00</further-classification>
        <further-classification edition="200601120260303B">A61P1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人國家衛生研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL HEALTH RESEARCH INSTITUTES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁紹華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UENG, SHAU-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉修華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, SHIU-HWA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石　全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冠賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇建太</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示四氫異喹啉化合物用於阿片受體相關疾病包括疼痛、免疫性疾病、食道逆流、腹瀉、焦慮或海洛英成癮，並揭示其藥物組合物及治療方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are tetrahydroisoquinoline compounds useful for treating an opioid receptor-associated condition including pain, immune disease, esophageal reflux, diarrhea, anxiety, or heroin addiction. Also provided are pharmaceutical compositions and treatment methods.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1176" publication-number="202624543">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624543</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130330</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>蝕刻方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">C23F1/26</main-classification>
        <further-classification edition="202601120260311B">H10P50/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商花王股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡崎翔太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAZAKI, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村陽介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, YOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明於一態樣中提供一種蝕刻方法，其即便重複使用蝕刻液，亦可抑制蝕刻液之初次使用時之蝕刻速度、與蝕刻液之重複使用時之蝕刻速度之間的速度不均。  &lt;br/&gt;本發明於一態樣中係關於一種蝕刻方法，其包括使用包含磷酸、硝酸及下述成分A之蝕刻液，對包含第6族元素金屬之被蝕刻層進行蝕刻之步驟，於上述蝕刻液包含第6族元素金屬之情形時，於上述蝕刻之前包括向該蝕刻液添加下述成分A之步驟。  &lt;br/&gt;成分A：選自具有來自伸乙亞胺之重複單元之化合物、具有來自烯丙基胺之重複單元之化合物及具有來自二烯丙基胺之重複單元之化合物的至少1種化合物</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1177" publication-number="202625020">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625020</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130379</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>人工智能訓練系統、方法及其電腦可讀媒介</chinese-title>
        <english-title>ARTIFICIAL INTELLIGENCE TRAINING SYSTEM, METHOD, AND COMPUTER READABLE MEDIUM THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260312B">G06N3/08</main-classification>
        <further-classification edition="200601120260312B">G06F9/54</further-classification>
        <further-classification edition="201901120260312B">G06F16/22</further-classification>
        <further-classification edition="202301120260312B">G06N3/0475</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>捷思博科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JETSPARQ TECHNOLOGY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張修齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HSIU-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林長榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種人工智能訓練系統、方法及其電腦可讀媒介，係包括後端中控模組以及個人化向量資料庫，藉由該後端中控模組調用大語言模型，並取得對應使用者之模型參數對該大語言模型進行微調，使該大語言模型針對使用者之輸入資訊提供對應之回應資訊，且由該個人化向量資料庫對該回應資訊進行查詢以獲得查詢結果，俾於判斷該回應資訊與該查詢結果皆無法回應使用者時，由系統提示使用者提供對應之回應，更以回應之內容訓練大語言模型，進而優化該大語言模型。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This present invention discloses an artificial intelligence training system, method, and computer-readable medium thereof. The artificial intelligence training system includes a back-end central control module and a personalized vector database. The back-end central control module uses a large language model and obtains model parameters corresponding to a user to fine-tune the large language model, so that the large language model provides a response information corresponding to the user's input information. The personalized vector database then searches according to the response information to obtain a query result. If it is determined that neither the response information nor the searching result can respond to the user, the system prompts the user to provide a corresponding response. The response content is then used to train the large language model, thereby optimizing the large language model.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:人工智能訓練系統</p>
        <p type="p">11:後端中控模組</p>
        <p type="p">111:應用程式介面單元</p>
        <p type="p">12:個人化向量資料庫</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1178" publication-number="202625025">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625025</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130458</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含在具有局部資訊狀態之半導體中之發光局部缺陷之系統、裝置、製品及方法</chinese-title>
        <english-title>SYSTEMS, DEVICES, ARTICLES AND METHODS INCLUDING LUMINESCENT LOCAL DEFECTS IN SEMICONDUCTORS WITH LOCAL INFORMATION STATES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260310B">G06N10/00</main-classification>
        <further-classification edition="202501120260310B">H10H20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商光子公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PHOTONIC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賽門斯　史蒂芬尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIMMONS, STEPHANIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑟瓦特　麥可　Ｌ　Ｗ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THEWALT, MICHAEL L. W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種裝置(諸如一資訊處理或通信裝置)，其包含：半導體材料之一本體，其主要由矽組成；一或多個發光中心，其安置於半導體材料之該本體中；一或多個光學自由度，其與該一或多個發光中心相關聯；及一或多個局部自由度，其與該一或多個發光中心相關聯。一各自光學自由度與一各自發光中心相關聯。一各自局部自由度與一各自發光中心相關聯。該一或多個局部自由度修改該一或多個光學自由度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device, such as, an information processing or communications device, including a body of semiconductor material consisting principally of silicon, one or more luminescence centres disposed in the body of semiconductor material, one or more optical degrees of freedom associated with the one or more luminescence centres, and one or more local degrees of freedom associated with the one or more luminescence centres. A respective optical degree of freedom is associated with a respective luminescence centre. A respective local degree of freedom is associated with a respective luminescence centre. The one or more local degrees of freedom modify the one or more optical degrees of freedom.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1100:方法</p>
        <p type="p">1102:動作</p>
        <p type="p">1104:動作</p>
        <p type="p">1106:動作</p>
        <p type="p">1108:動作</p>
        <p type="p">1110:動作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1179" publication-number="202625249">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625249</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130469</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電漿處理裝置及組裝方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260310B">H01J37/32</main-classification>
        <further-classification edition="200601120260310B">H05H1/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹中涼介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKENAKA, RYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">電漿處理裝置，具備：噴淋頭；熱控制部，疊層於該噴淋頭；及墊片，配置在該噴淋頭與該熱控制部之間的熱界面。該墊片具有貫通孔。於該熱控制部安裝有固定構件。該固定構件具有：主體部，嵌套於該貫通孔而該墊片配置在其周圍；及頭部，可卡合於該貫通孔的周緣之該墊片。藉此，電漿處理裝置可簡單地在噴淋頭與熱控制部之間組裝墊片。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電漿處理腔室</p>
        <p type="p">10a:側壁</p>
        <p type="p">10s:電漿處理空間</p>
        <p type="p">50:噴淋頭組件</p>
        <p type="p">50a:氣體供給口</p>
        <p type="p">50b:氣體擴散室</p>
        <p type="p">50c:氣體導入口</p>
        <p type="p">50d:氣體流路</p>
        <p type="p">51:噴淋頭</p>
        <p type="p">51c:陷落部</p>
        <p type="p">51s1:一面</p>
        <p type="p">51s2:另一面</p>
        <p type="p">52:熱控制部</p>
        <p type="p">53:冷卻板</p>
        <p type="p">53a:氣體擴散室用凹部</p>
        <p type="p">53b:流路用凹部</p>
        <p type="p">53s1:一面</p>
        <p type="p">53s2:另一面</p>
        <p type="p">54:蓋板</p>
        <p type="p">55:支持構件</p>
        <p type="p">56:絕緣構件</p>
        <p type="p">57:墊片</p>
        <p type="p">60:固定構件</p>
        <p type="p">70:調溫模組</p>
        <p type="p">71:調溫媒體流路</p>
        <p type="p">531:凸部</p>
        <p type="p">531a:第1凸部</p>
        <p type="p">531b:第2凸部</p>
        <p type="p">531c:第3凸部</p>
        <p type="p">531d:第4凸部</p>
        <p type="p">541:連接件</p>
        <p type="p">BS:熱界面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1180" publication-number="202624183">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624183</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130498</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>從甘油產生丙烯醛</chinese-title>
        <english-title>PRODUCTION OF ACROLEIN FROM GLYCEROL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07C45/52</main-classification>
        <further-classification edition="200601120260302B">C07C47/22</further-classification>
        <further-classification edition="200601120260302B">B01J21/08</further-classification>
        <further-classification edition="200601120260302B">B01J27/02</further-classification>
        <further-classification edition="200601120260302B">B01J27/188</further-classification>
        <further-classification edition="202401120260302B">B01J35/30</further-classification>
        <further-classification edition="202401120260302B">B01J35/40</further-classification>
        <further-classification edition="202401120260302B">B01J35/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商德希尼布能源法國公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TECHNIP ENERGIES FRANCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩拉查　羅德里格斯瑪麗亞姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SALAZAR, RODRIGUEZ MARIAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示一種從甘油產生丙烯醛之方法。該方法可包括將非均質酸催化劑引入至反應器中。該非均質酸催化劑可係異種多重酸催化劑或磺酸催化劑。可在該反應器中將該非均質酸催化劑加熱至目標反應溫度。在一些情況下，可在加熱至該目標反應溫度之前在該反應器中預先加熱該非均質酸催化劑。一旦該非均質酸催化劑達到該目標反應溫度，則可將甘油引入至該反應器中以與該非均質酸催化劑接觸。該甘油與該非均質酸催化劑接觸會引起在該反應器中將該甘油脫水並產生含丙烯醛流出物的反應。該流出物可從該反應器排出並且可接受進一步的下游處理，包括將該丙烯醛轉化成丙烯酸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of producing acrolein from glycerol is disclosed. The method may include introducing a heterogenous acid catalyst into a reactor. The heterogenous acid catalyst may be a heteropoly acid catalyst or a sulfonic acid catalyst. The heterogenous acid catalyst may be heated to a target reaction temperature while in the reactor. In some cases, the heterogenous acid catalyst may be preheated in the reactor before being heated to the target reaction temperature. Once the heterogenous acid catalyst reaches the target reaction temperature, glycerol may be introduced into the reactor to contact the heterogenous acid catalyst. Contact of the glycerol with the heterogenous acid catalyst causes a reaction that dehydrates the glycerol in the reactor and produces an acrolein-containing effluent. The effluent may be discharged from the reactor and may be subjected to further downstream processing, including converting the acrolein into acrylic acid.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:先導工廠</p>
        <p type="p">102:反應器</p>
        <p type="p">104:固定催化劑床</p>
        <p type="p">106:催化劑</p>
        <p type="p">108:含水甘油</p>
        <p type="p">110:含水甘油來源</p>
        <p type="p">112:蒸發器</p>
        <p type="p">114:氣相甘油/甘油</p>
        <p type="p">116:含丙烯醛流出物/流出物/反應器流出物</p>
        <p type="p">118:蒸發器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1181" publication-number="202625180">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625180</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130530</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磁性記憶裝置</chinese-title>
        <english-title>MAGNETIC MEMORY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">G11C11/16</main-classification>
        <further-classification edition="202301120260304B">H10B61/00</further-classification>
        <further-classification edition="202301120260304B">H10N50/10</further-classification>
        <further-classification edition="202301120260304B">H10N50/85</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小池正浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOIKE, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅津信之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UMETSU, NOBUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李恬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, TIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村上俊也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAKAMI, TOSHIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉川将寿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIKAWA, MASATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">實施例提供一種縮短一寫入時間之磁性記憶裝置。  &lt;br/&gt;根據各實施例，一種磁性記憶裝置包含：一導電層；一磁阻效應元件，其設置在該導電層上並包含接觸該導電層之一第一端部分及與該第一端部分相對之一第二端部分；及一控制電路，其經組態以執行一寫入操作以便將資料寫入至該磁阻效應元件中。該寫入操作包含：在一第一週期中，致使一電流在該導電層中流動；及在該第一週期之後的一第二週期中，停止該電流且相對於該第一端部分將一負電壓施加至該第二端部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments provide a magnetic memory device that shortens a write time. &lt;br/&gt;According to embodiments, a magnetic memory device includes a conductive layer, a magnetoresistive effect element provided on the conductive layer and including a first end portion that contacts the conductive layer and a second end portion that is opposite to the first end portion, and a control circuit configured to perform a write operation to write data into the magnetoresistive effect element. The write operation including, in a first period, causing a current to flow in the conductive layer, and in a second period subsequent to the first period, stopping the current and applying a negative voltage to the second end portion with respect to the first end portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:導電層</p>
        <p type="p">30:堆疊式結構</p>
        <p type="p">31:鐵磁性層</p>
        <p type="p">32:非磁性層</p>
        <p type="p">33:鐵磁性層</p>
        <p type="p">34:非磁性層</p>
        <p type="p">35:鐵磁性層</p>
        <p type="p">Ic1:寫入電流</p>
        <p type="p">SOTL:佈線</p>
        <p type="p">V1:電壓</p>
        <p type="p">V2:電壓</p>
        <p type="p">VDD:電壓/電位差</p>
        <p type="p">VDD/2:電壓/電位差</p>
        <p type="p">Vg1:電位差/正電位差</p>
        <p type="p">Vg2:電位差/負電位差</p>
        <p type="p">VSS:電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1182" publication-number="202625686">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625686</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130536</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>填充基板上的高深寬比特徵部</chinese-title>
        <english-title>FILLING HIGH ASPECT RATIO FEATURES ON SUBSTRATES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260309B">H10P14/43</main-classification>
        <further-classification edition="202601120260309B">H10P72/76</further-classification>
        <further-classification edition="202601120260309B">H10P95/00</further-classification>
        <further-classification edition="200601120260309B">C23C16/04</further-classification>
        <further-classification edition="200601120260309B">C23C16/06</further-classification>
        <further-classification edition="200601120260309B">C23C16/02</further-classification>
        <further-classification edition="200601120260309B">C23C16/458</further-classification>
        <further-classification edition="200601120260309B">C23C16/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嘉德瑞什卡　阿南德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANDRASHEKAR, ANAND</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳希同</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, XITONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嬈　斯麗沙　尤吉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAO, SHREESHA YOGISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比魯　克里希那</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIRRU, KRISHNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許偉峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHO, LEONARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種系統包含台座及控制器。該台座包含基部及複數個凹穴部，該等凹穴部位於基部的周邊周圍。該等凹穴部包含配置成接收載有基板之載環的槽。基板係部份地延伸於凹穴部中之槽上方。該台座包含定義於基部中的充氣室。該充氣室包含通往凹穴部中之槽的斜角孔。控制器係配置成在基板之頂表面上沉積抑制劑控制增強(ICE)層；及在沉積ICE層之後，供給氣體經由斜角孔至位於槽上方的基板之底表面上之區域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system includes a pedestal and a controller. The pedestal includes a base portion and a plurality of pockets located around a periphery of the base portion. The pockets include slots configured to receive a carrier ring carrying a substrate. The substrate partially extends over the slots in the pockets. The pedestal includes a plenum defined in the base portion. The plenum includes angular holes opening into the slots in the pockets. The controller is configured to deposit an inhibitor controlled enhanced (ICE) layer on a top surface of the substrate; and to supply, after depositing the ICE layer, a gas through the angular holes to areas on a bottom surface of the substrate that lie above the slots.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:方法</p>
        <p type="p">502、504、506、508、510:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1183" publication-number="202625671">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625671</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130560</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法</chinese-title>
        <english-title>METHOD FOR PROCESSING A SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260310B">H10N30/076</main-classification>
        <further-classification edition="202301120260310B">H10N30/082</further-classification>
        <further-classification edition="202301120260310B">H10N30/09</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商東京威力科創美國製造與工程公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEL MANUFACTURING AND ENGINEERING OF AMERICA, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴韋仲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, WEI-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭德弗里德　杰弗里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANDFRIED, JEFFREY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊斯　艾倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEITH, ALLEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於處理基板的方法包括使用局部基板處理工具轟擊基板。基板的頂面包括鋰。在使用局部基板處理工具轟擊頂面之後，於基板上流動包括酸性氣體的共混氣體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for processing a substrate includes bombarding the substrate with a local substrate processing tool. A top surface of the substrate includes lithium. After bombarding the top surface with the local substrate processing tool, a co-gas including an acidic gas is flowed over the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:基板</p>
        <p type="p">402:底層</p>
        <p type="p">404:含鋰層</p>
        <p type="p">408:副產物層</p>
        <p type="p">410:共混氣體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1184" publication-number="202625683">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625683</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130565</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>金屬沉積用電漿處理</chinese-title>
        <english-title>PLASMA TREATMENT FOR DEPOSITION OF METALS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260313B">H10P14/40</main-classification>
        <further-classification edition="202601120260313B">H10W20/00</further-classification>
        <further-classification edition="200601120260313B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大槻友志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKI, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一例中提供了一種沉積釕的方法，該方法包含在位於基板上方的介電層中形成開口，將包含開口的基板暴露至電漿處理室中的第一電漿，該電漿處理室包含氮氣和氫氣，以及將包含開口的基板暴露至電漿處理室中的第二電漿。第二電漿不含氫氣。該方法包含在將基板暴露至第二電漿之後，沉積釕至開口中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In one example, a method for depositing ruthenium includes forming an opening in a dielectric layer disposed over a substrate, exposing the substrate including the opening to a first plasma in a plasma processing chamber including nitrogen and hydrogen, and exposing the substrate including the opening to a second plasma in the plasma processing chamber. The second plasma is hydrogen free. The method includes depositing ruthenium into the opening after exposing the substrate to the second plasma.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板</p>
        <p type="p">105:導電區域</p>
        <p type="p">110:第一絕緣層</p>
        <p type="p">120:第一蝕刻停止襯墊</p>
        <p type="p">130:第二絕緣層</p>
        <p type="p">140:第二蝕刻停止襯墊</p>
        <p type="p">150:開口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1185" publication-number="202625239">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625239</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130636</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>帶電粒子束系統中之磁場洩漏消除</chinese-title>
        <english-title>MAGNETIC FIELD LEAKAGE CANCELATION IN A CHARGED-PARTICLE BEAM SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">H01J37/24</main-classification>
        <further-classification edition="200601120260305B">H01J37/26</further-classification>
        <further-classification edition="202601120260305B">H02J1/10</further-classification>
        <further-classification edition="202601120260305B">H02J4/00</further-classification>
        <further-classification edition="202201120260305B">G06N10/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡　李歐納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, LEONARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明所揭示之實施例包括一種電力系統，其包括：複數個DC電力供應器，其經組態以接收AC電力並將DC電力提供至帶電粒子系統之組件；複數個AC電力供應器，其經組態以將AC電力提供至該複數個DC電力供應器；及一控制器，其包含經組態以執行操作之電路系統，該等操作包括：接收感測器資訊；及對於該複數個DC電力供應器中之各DC電力供應器：基於該感測器資訊判定該DC電力供應器之一負載特性；基於該經判定負載特性判定與對應於該DC電力供應器之一AC電力供應器相關聯之一值，其中該經判定值促進減少來自該複數個DC電力供應器之一組合磁場洩漏；及產生一控制信號以使該AC電力供應器以該經判定值驅動一輸出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosed embodiments include a power system that includes a plurality of DC power supplies configured to receive AC power and to provide DC power to components of the charged particle system, a plurality of AC power supplies configured to provide AC power to the plurality of DC power supplies, and a controller comprising circuitry configured to perform operations that includes receiving sensor information; and for each DC power supply of the plurality of DC power supplies: determining, based on the sensor information, a load characteristic for said DC power supply, determining, based on the determined load characteristic, a value associated with an AC power supply corresponding to said DC power supply, wherein the determined value facilitates reducing a combined magnetic field leakage from the plurality of DC power supplies, and generating a control signal to cause the AC power supply to drive an output with the determined value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:電力系統</p>
        <p type="p">410:UPS單元</p>
        <p type="p">420:電力分配單元</p>
        <p type="p">430:AC至DC轉換器</p>
        <p type="p">440:電池</p>
        <p type="p">450:反相器</p>
        <p type="p">451:反相器</p>
        <p type="p">452:反相器</p>
        <p type="p">453:反相器</p>
        <p type="p">454:反相器</p>
        <p type="p">460:DC電力供應器</p>
        <p type="p">461:DC電力供應器</p>
        <p type="p">462:DC電力供應器</p>
        <p type="p">463:DC電力供應器</p>
        <p type="p">464:DC電力供應器</p>
        <p type="p">470:連接板</p>
        <p type="p">480:控制器</p>
        <p type="p">481:回饋信號</p>
        <p type="p">490:負載感測器</p>
        <p type="p">491:磁場感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1186" publication-number="202624415">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624415</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130658</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>安全文件的輻射可固化混合式保護性清漆</chinese-title>
        <english-title>RADIATION-CURABLE HYBRID PROTECTIVE VARNISHES FOR SECURITY DOCUMENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260309B">C09D11/101</main-classification>
        <further-classification edition="200601120260309B">B41M7/00</further-classification>
        <further-classification edition="200601120260309B">B41M3/14</further-classification>
        <further-classification edition="200601120260309B">B42D15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商西克帕控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SICPA HOLDING SA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍夫斯特　皮爾伊夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOFSTETTER, PIERRE-YVES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡拉蘇基利奇　菲扎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARASU KILIC, FEYZA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維亞　派翠克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VEYA, PATRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供顯示良好保護效應及耐久性特性之輻射可固化混合式保護性清漆。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a radiation-curable hybrid protective varnish showing good protective effect and durability characteristics.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1187" publication-number="202624416">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624416</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130677</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於安全文件的輻射可固化自由基固化保護清漆</chinese-title>
        <english-title>RADIATION-CURABLE RADICAL-CURING PROTECTIVE VARNISHES FOR SECURITY DOCUMENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260309B">C09D11/101</main-classification>
        <further-classification edition="200601120260309B">B41M3/14</further-classification>
        <further-classification edition="200601120260309B">B42D15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商西克帕控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SICPA HOLDING SA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍夫斯特　皮爾伊夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOFSTETTER, PIERRE-YVES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡拉蘇基利奇　菲扎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARASU KILIC, FEYZA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維亞　派翠克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VEYA, PATRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供顯示良好抗污及耐久性特性之輻射可固化保護清漆。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a radiation-curable protective varnish showing good anti-soiling and durability characteristics.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1188" publication-number="202624554">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624554</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130721</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氧化還原裝置用分隔件及氧化還原裝置用分隔件之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260310B">C25B13/04</main-classification>
        <further-classification edition="201601120260310B">H01M8/0206</further-classification>
        <further-classification edition="201601120260310B">H01M8/0213</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹下翔也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKESHITA, SHOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之氧化還原裝置用分隔件1具備：金屬基材2；及防蝕層3，其配置於金屬基材2之厚度方向之一面，且包含鈦。金屬基材之厚度方向之一面係經陽極層離子源法處理之處理面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:氧化還原裝置用分隔件</p>
        <p type="p">2:金屬基材</p>
        <p type="p">3:防蝕層</p>
        <p type="p">4:含碳層</p>
        <p type="p">5:上表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1189" publication-number="202624590">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624590</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130763</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>適用於水可崩解基底的塗層組成物及方法</chinese-title>
        <english-title>COATING COMPOSITIONS AND PROCESSES TAILORED FOR WATER-DISINTEGRABLE SUBSTRATES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">D06N3/00</main-classification>
        <further-classification edition="200601120260311B">D06N3/04</further-classification>
        <further-classification edition="200601120260311B">C11D17/04</further-classification>
        <further-classification edition="200601120260311B">C11D3/14</further-classification>
        <further-classification edition="200601120260311B">C11D3/22</further-classification>
        <further-classification edition="200601120260311B">C11D3/37</further-classification>
        <further-classification edition="200601120260311B">C11D7/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商3Ｍ新設資產公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>3M INNOVATIVE PROPERTIES COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　亦帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YIFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋　禮明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, LIMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　麗蓮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, LYLIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費納　薩拉　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FEINER, SARAH J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡偉立</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, WEI LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李鉉濬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HYUNJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寇瑞根　湯瑪士　瑞查德　強史東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORRIGAN, THOMAS RICHARD JOHNSTONE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝爾　肖恩　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BELL, SHAWN C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澤林斯基　傑佛瑞　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZELINSKY, JEFFREY E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安德森　蒂莫西　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANDERSON, TIMOTHY J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是一種製品，該製品包括水可崩解基底及施加至該基底的表面上的組成物。該組成物包含約0.01重量%至約5重量%的水溶性增稠劑、約0.01重量%至約10重量%的水溶性黏結劑、及約0.5重量%至約55重量%的磨料。該製品具有根據INDA FG502.R1(18)晃動箱測試方法的至少約40%的崩解因子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is an article including a water-disintegrable substrate and a composition applied onto a surface of the substrate. The composition includes between about 0.01% to about 5% by weight of a water-soluble thickener, between about 0.01% to about 10% by weight of water-soluble binding agent, and between about 0.5% to about 55% by weight of an abrasive. The article has a disintegration factor according to the INDA FG502.R1(18) Slosh Box Test Method of at least about 40%.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1190" publication-number="202624831">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624831</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130815</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>沃爾特（ＷＯＬＴＥＲ）鏡子總成</chinese-title>
        <english-title>WOLTER MIRROR ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">G02B17/06</main-classification>
        <further-classification edition="201801120260309B">G01N23/04</further-classification>
        <further-classification edition="200601120260309B">G02B5/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦許　喬瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WALSH, JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉爾　亞曼喬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GILL, AMANJOT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王悅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭舒琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, SHUQI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　晙源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JUNWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種鏡子總成。該鏡子總成包含一橢球面光學表面。該鏡子總成包含一雙曲面光學表面，其中該橢球面光學表面及該雙曲面光學表面經配置成一沃爾特鏡子組態。該鏡子總成包含一基板。該基板包含一第一部分，其中該橢球面光學表面定位於該基板之該第一部分上。該基板包含一第二部分，其中該雙曲面光學表面定位於該基板之該第二部分上，其中該第一部分及該第二部分形成一單塊本體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A mirror assembly is disclosed. The mirror assembly includes an ellipsoid optical surface. The mirror assembly includes a hyperboloid optical surface, wherein the ellipsoid optical surface and the hyperboloid optical surface are arranged in a Wolter mirror configuration. The mirror assembly includes a substrate. The substrate includes a first portion, wherein the ellipsoid optical surface is located on the first portion of the substrate. The substrate includes a second portion, wherein the hyperboloid optical surface is located on the second portion of the substrate, wherein the first portion and the second portion form a monolithic body.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:鏡子總成</p>
        <p type="p">102:橢球面光學表面</p>
        <p type="p">104:雙曲面光學表面</p>
        <p type="p">106:基板</p>
        <p type="p">108:第一部分</p>
        <p type="p">110:第二部分</p>
        <p type="p">112:自由空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1191" publication-number="202624913">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624913</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130833</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>搬送車系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120260302B">G05D1/639</main-classification>
        <further-classification edition="202401120260302B">G05D1/43</further-classification>
        <further-classification edition="202401120260302B">G05D1/221</further-classification>
        <further-classification edition="200601120260302B">B61B13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商村田機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURATA MACHINERY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>前田睦人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAEDA, MUTSUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江口裕也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EGUCHI, YUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之搬送車系統(1)具備有：搬送車(3)、使待機搬送車(3)按照基本路徑移行之控制器(20)、及記憶有設定基本路徑之複數個區間之記憶部(23)。於記憶部(23)中，對複數個區間之至少一個，建立關聯地記憶有於區間封閉時成為代替區間之區間，而控制器(20)當偵測到被設定為基本路徑之至少一個區間封閉時，則自記憶部(23)讀出成為封閉之區間的代替區間之區間，並設定將封閉之區間替換為自記憶部(23)讀出之區間的代替路徑，而使待機搬送車(3)按照代替路徑移行。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:搬送車系統</p>
        <p type="p">3:搬送車</p>
        <p type="p">20:搬送車控制裝置</p>
        <p type="p">21:控制器</p>
        <p type="p">21A:搬送車控制部</p>
        <p type="p">21B:路徑封閉檢測部</p>
        <p type="p">21C:代替路徑產生部</p>
        <p type="p">23:記憶部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1192" publication-number="202625024">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625024</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130867</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於虛擬人模擬的基於人工智慧的加權圖生成模型的訓練系統</chinese-title>
        <english-title>A LEARNING SYSTEM OF AI-BASED WEIGHTED MAP GENERATION MODEL FOR VIRTUAL HUMAN SIMULATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251112B">G06N3/10</main-classification>
        <further-classification edition="200601120251112B">G06T1/20</further-classification>
        <further-classification edition="201101120251112B">G06T13/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商州境動科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>5MOTION INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔賢美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, HYUNMEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金陳謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JIN-KYUM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張睿洹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, YE-WON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示用於虛擬人模擬的基於人工智慧的加權圖生成模型的訓練系統，其生成依據姿勢生成加權圖的權重生成模型並利用二維影像資料訓練該模型，包含：影像處理單元，從二維影像資料的幀中分離出二維參考物件；物件模型處理單元，預先設定所述二維影像資料所含參考物件的三維物件模型；姿勢推斷單元，在所述幀或所述幀的分離出來的二維參考物件推斷該參考物件的三維姿勢資料；地圖生成模型，作為人工智慧模型，接收三維姿勢資料的輸入後生成加權圖；物理模擬器，為了獲得採取所述三維姿勢的三維物件模型(以下稱為三維物件)而實行物理模擬，但利用所述加權圖實行物理模擬；二維物件提取單元，從所述物理模擬器所生成的三維物件提取二維物件(以下稱為二維結果物件)；及，變數調節單元，利用損失函數調節所述地圖生成模型的複數個內部變數，但利用從所述幀分離出來的參考物件與所述二維結果物件之間的損失進行調節；生成用於生成加權圖的AI模型並對其訓練，從而能自動生成用於虛擬人的物理模擬的加權圖。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">31:影像處理單元</p>
        <p type="p">32:物件模型處理單元</p>
        <p type="p">33:姿勢推斷單元</p>
        <p type="p">34:地圖生成模型</p>
        <p type="p">35:物理模擬器</p>
        <p type="p">36:二維物件提取單元</p>
        <p type="p">37:變數調節單元</p>
        <p type="p">341:編碼器</p>
        <p type="p">342:解碼器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1193" publication-number="202624142">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624142</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130959</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水處理設備、控制裝置、運轉方法及電腦程式</chinese-title>
        <english-title>WATER TREATMENT FACILITY, CONTROL DEVICE, OPERATION METHOD, AND COMPUTER PROGRAM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260312B">C02F1/44</main-classification>
        <further-classification edition="200601120260312B">B01D61/08</further-classification>
        <further-classification edition="200601120260312B">B01D61/12</further-classification>
        <further-classification edition="200601120260312B">B01D61/58</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商奧璐佳瑙股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORGANO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀧口佳介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKIGUCHI, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村勇規</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種水處理設備，具有：被供應被處理水之RO裝置(20)；主路徑(30)，用以往後段供應來自RO裝置(20)之處理水；循環路徑(40)，用以將來自RO裝置(20)之處理水送回RO裝置(20)之前段；三通閥(70)，調整從RO裝置(20)往主路徑(30)之處理水之流量與從RO裝置(20)往循環路徑(40)之處理水之流量；以及控制裝置(100)，當要讓往RO裝置(20)的後段供應之處理水之流量增加至第一供應流量時，控制三通閥(70)，以使往主路徑(30)之流量值之變化量在第一期間內成為預先設定之值以下，並在經過第一期間後，控制三通閥(70)，以使往主路徑(30)之流量值變成第一供應流量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A water treatment facility having an RO device (20) to which a water to be treated is supplied, a main channel (30) for supplying the treated water from the RO device (20) to a subsequent stage, a recirculation channel (40) for returning the treated water from the RO device (20) to a stage prior to the RO device (20), a three-way valve (70) which adjusts the flow rate of the treated water from the RO device (20) to the main channel (30) and the flow rate of the treated water from the RO device (20) to the recirculation channel (40), and a control device (100) which, when increasing the flow rate of the treated water supplied to a subsequent stage from the RO device (20) to a first supply flow rate, controls the three-way valve (70) such that the amount of variation in the flow rate to the main channel (30) is a value equal to or less than a preset value within a first period, and after the first period has elapsed, controls the three-way valve (70) such that the flow rate to the main channel (30) is adjusted to the first supply flow rate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:RO水槽</p>
        <p type="p">20:RO裝置</p>
        <p type="p">30:主路徑</p>
        <p type="p">40:循環路徑</p>
        <p type="p">50:流量計</p>
        <p type="p">60:流量計</p>
        <p type="p">70:三通閥</p>
        <p type="p">80:水質測定器</p>
        <p type="p">100:控制裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1194" publication-number="202624121">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624121</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130973</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用過熱蒸汽噴霧乾燥技術的二氧化矽分散改進</chinese-title>
        <english-title>SILICA DISPERSION IMPROVEMENT USING SUPERHEATED STEAM SPRAY DRYING TECHNOLOGY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C01B33/18</main-classification>
        <further-classification edition="200601120260302B">C01B33/193</further-classification>
        <further-classification edition="200601120260302B">C08K3/36</further-classification>
        <further-classification edition="200601120260302B">F26B3/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商羅地亞經營管理公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RHODIA OPERATIONS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮諾　安勞爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PINAULT, ANNE-LAURE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>內沃　西爾萬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEVEU, SYLVAINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布特里夫　阿卜杜勒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOUTRIF, ABDEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史塔克　法比安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STOCKLOUSER, FABIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種用於使用過熱蒸汽作為乾燥氣體噴霧乾燥包含沈澱二氧化矽的水性懸浮液之方法。本發明還涉及一種用於製備沈澱二氧化矽之方法，該方法涉及本發明之方法。此外，本發明涉及一種藉由本發明之方法可獲得的沈澱二氧化矽，並且涉及一種聚合物組成物和一種包含該沈澱二氧化矽的製品。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a method for spray drying an aqueous suspension comprising precipitated silica using superheated steam as a drying gas. It relates also to a process for preparing precipitated silica that involves the invented method. Moreover, the present invention relates to a precipitated silica obtainable by the invented process, and to a polymer composition and to an article comprising this precipitated silica.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(1):產物的入口</p>
        <p type="p">(2):乾燥腔室</p>
        <p type="p">(3):旋風分離器</p>
        <p type="p">(4):氣體出口</p>
        <p type="p">(5):吹掃出口</p>
        <p type="p">(6):加熱系統</p>
        <p type="p">(7):收集腔室</p>
        <p type="p">(8):泵</p>
        <p type="p">(9):進料泵</p>
        <p type="p">(10):進料罐</p>
        <p type="p">(11):冷凝器</p>
        <p type="p">(12):加壓空氣</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1195" publication-number="202623711">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623711</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130977</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>紡車式捲線器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">A01K89/01</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商島野股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMANO INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川俣敦史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAMATA, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於，於紡車式捲線器中獲取與線擋之打開及關閉以及轉子之旋轉有關的實際釣魚資料。  &lt;br/&gt;本發明之紡車式捲線器10具備捲線器本體11、轉子14、線擋15及感測機構18。轉子14具有支持體29及導環臂32。支持體29中內置有移動構件51。移動構件51與導環臂32之打開及關閉連動而於前後方向7移動。感測機構18具備：安裝於移動構件51之磁鐵19、及固定於捲線器本體11之感測器單元70。磁鐵19與轉子14一起旋轉，並與線擋15之打開及關閉連動而於前後方向7位移。感測器單元70具備：圓環狀之基板71、及安裝於基板71之複數個磁感測器72。複數個磁感測器72以相等間隔排列設置。磁感測器72感測磁鐵19之位移及轉子14之旋轉。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">7:前後方向</p>
        <p type="p">8:上下方向</p>
        <p type="p">9:左右方向</p>
        <p type="p">10:紡車式捲線器</p>
        <p type="p">11:捲線器本體</p>
        <p type="p">12:手柄</p>
        <p type="p">14:轉子</p>
        <p type="p">15:線擋</p>
        <p type="p">16:切換機構</p>
        <p type="p">17:線擋反轉機構</p>
        <p type="p">18:感測機構</p>
        <p type="p">19:磁鐵(被檢測部)</p>
        <p type="p">22:殼體</p>
        <p type="p">23:手柄軸</p>
        <p type="p">24:捲筒軸</p>
        <p type="p">29:支持體</p>
        <p type="p">32:導環臂</p>
        <p type="p">35:保護罩</p>
        <p type="p">37:支持銷</p>
        <p type="p">38:心軸</p>
        <p type="p">39:手柄安裝部</p>
        <p type="p">41:旋動構件</p>
        <p type="p">42:軸</p>
        <p type="p">44:支持構件</p>
        <p type="p">45:第1嵌合孔</p>
        <p type="p">46:第2嵌合孔</p>
        <p type="p">51:移動構件</p>
        <p type="p">52:嵌合端部</p>
        <p type="p">53:第1連結部</p>
        <p type="p">54:滑動接觸部</p>
        <p type="p">55:第2連結部</p>
        <p type="p">56:卡合端部</p>
        <p type="p">57:滑動接觸部</p>
        <p type="p">61:筒狀部</p>
        <p type="p">63:制動構件</p>
        <p type="p">65:卡合突起</p>
        <p type="p">69:凹部</p>
        <p type="p">70:感測器單元(第1檢測部、第2檢測部)</p>
        <p type="p">71:基板</p>
        <p type="p">72:磁感測器</p>
        <p type="p">101:前方</p>
        <p type="p">102:後方</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1196" publication-number="202624691">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624691</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130983</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>位準感測系統及方法</chinese-title>
        <english-title>LEVEL SENSING SYSTEMS AND METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">G01B11/06</main-classification>
        <further-classification edition="200601120260309B">G03F9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴賽曼　喬納斯　喬可巴斯　麥修斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASELMANS, JOHANNES JACOBUS MATHEUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王莉蓉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LIRONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種位準感測器，其為量測一基板表面之高度的一光學感測器。當前位準感測器具有一相對有限範圍，該相對有限範圍取決於此等感測器中所使用之光柵的週期或節距。本發明描述一種具有高解析度及增強範圍之增強型位準感測器。在一實施例中，該增強型位準感測器併有一干涉量測方案，且包括：至少三個偵測器，其各自量測成像光柵之週期的一不同部分；專用偶極照明，其確保一成像光柵(在一偵測光柵處)在輻射之所有波長下包含一純正弦波；及干涉量測軟體，其基於來自該至少三個偵測器之輸出信號而判定經反射輻射在各時刻之相位，基於該等相位而判定該高度，且使用相位解包裹演算法來適應自該表面接收之經反射輻射的相位跳躍。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A level sensor is an optical sensor that measures the height of a substrate surface. Current level sensors have a relatively limited range, which depends on the period or pitch of gratings used in these sensors. An enhanced level sensor with high resolution and enhanced range is described. In an embodiment, the enhanced level sensor incorporates an interferometric measurement scheme, and includes at least three detectors, each measuring a different part of the period of the imaged grating; dedicated dipole illumination, which ensures that an imaged grating (at a detection grating) comprises a pure sine wave for all wavelengths of radiation; and interferometry software, which determines phases of the reflected radiation at each moment in time based on the output signals from the at least three detectors, determines the height based on the phases, and uses phase unwrapping algorithms to accommodate phase jumps in reflected radiation received from the surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:干涉式位準感測系統</p>
        <p type="p">302:輻射源</p>
        <p type="p">303:基板</p>
        <p type="p">304:偵測器</p>
        <p type="p">305:基板表面</p>
        <p type="p">306:偵測器</p>
        <p type="p">308:偵測器</p>
        <p type="p">310:偵測器</p>
        <p type="p">312:光學組件</p>
        <p type="p">320:物件光柵</p>
        <p type="p">322:偵測光柵</p>
        <p type="p">324:輻射</p>
        <p type="p">326:產生器</p>
        <p type="p">328:收集光學器件</p>
        <p type="p">330:光導</p>
        <p type="p">332:整形器</p>
        <p type="p">333:透鏡</p>
        <p type="p">334:反射器</p>
        <p type="p">336:反射器</p>
        <p type="p">350:光瞳</p>
        <p type="p">360:偶極輻射</p>
        <p type="p">362:濾光器</p>
        <p type="p">364:葉形開口</p>
        <p type="p">366:葉形開口</p>
        <p type="p">368:成像透鏡</p>
        <p type="p">370:成像透鏡</p>
        <p type="p">380:繞射元件</p>
        <p type="p">382:場平面</p>
        <p type="p">PRO:處理器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1197" publication-number="202624438">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624438</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130984</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱固化性接著劑組成物、積層膜、以及連接體及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">C09J163/00</main-classification>
        <further-classification edition="200601120260309B">C09J161/06</further-classification>
        <further-classification edition="200601120260309B">C09J11/06</further-classification>
        <further-classification edition="200601120260309B">C09J11/04</further-classification>
        <further-classification edition="200601120260309B">B32B7/12</further-classification>
        <further-classification edition="200601120260309B">B32B27/38</further-classification>
        <further-classification edition="202601120260309B">H10W72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秋吉利泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKIYOSHI, TOSHIYASU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷口紘平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANIGUCHI, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小菅洋輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSUGA, YOHSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種含有環氧樹脂、酚醛樹脂、彈性體、及固化促進劑之熱固化性接著劑組成物。在95℃下經3小時加熱後，該熱固化性接著劑組成物的反應率為50%以上，並且在35℃下的儲存彈性模數相對於在85℃下的儲存彈性模數之比為20以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">
        </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1198" publication-number="202624829">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624829</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131000</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學系統及相機模組</chinese-title>
        <english-title>OPTICAL SYSTEM AND CAMERA MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">G02B15/14</main-classification>
        <further-classification edition="200601120260306B">G02B13/00</further-classification>
        <further-classification edition="200601120260306B">G02B9/64</further-classification>
        <further-classification edition="200601120260306B">G02B3/00</further-classification>
        <further-classification edition="200601120260306B">G02B15/22</further-classification>
        <further-classification edition="200601120260306B">G02B1/04</further-classification>
        <further-classification edition="202301120260306B">H04N23/55</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG INNOTEK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金江珉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KANG MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之實施例中所揭露之光學系統包含：一第一透鏡群組，其具有在一第一光軸上具有一正折射力之一第一透鏡；第二透鏡群組至第四透鏡群組，其具有在一第二光軸上之複數個透鏡；以及一反射構件，其在該第一透鏡群組與該第二透鏡群組之間，其中該第二透鏡群組至該第四透鏡群組中之每一者具有至少兩個透鏡，該第三透鏡群組具有一透鏡，該透鏡在該等透鏡之中心厚度當中具有一最厚中心厚度，該第一透鏡之一物體側表面具有一凸形形狀，該第一透鏡之一有效長度大於該第二透鏡群組至該第四透鏡群組之該等透鏡之有效長度，該第一透鏡與該反射構件之間的一第一光軸距離係MG1，該反射構件與相鄰於該反射構件之一輸出側之一透鏡之間的一第二光軸距離係MG2，且可滿足一條件：2 ＜ MG1/MG2 ＜ 6。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The optical system disclosed in the embodiment of the invention comprises: a first lens group having a first lens having a positive refractive power on a first optical axis; second to fourth lens groups having a plurality of lenses on a second optical axis; and a reflective member between the first and second lens groups, wherein each of the second to fourth lens groups has at least two lenses, the third lens group has a lens having a thickest center thickness among the center thicknesses of the lenses, an object-side surface of the first lens has a convex shape, an effective length of the first lens is greater than the effective lengths of the lenses of the second to fourth lens groups, a first optical axis distance between the first lens and the reflective member is MG1, a second optical axis distance between the reflective member and a lens adjacent to an output side of the reflective member is MG2, and a condition: 2 ＜ MG1/MG2 ＜ 6 may be satisfied.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光學系統</p>
        <p type="p">111:第一透鏡</p>
        <p type="p">112:第二透鏡</p>
        <p type="p">113:第三透鏡</p>
        <p type="p">114:第四透鏡</p>
        <p type="p">115:第五透鏡</p>
        <p type="p">116:第六透鏡</p>
        <p type="p">117:第七透鏡</p>
        <p type="p">118:透鏡/第八透鏡</p>
        <p type="p">190:影像感測器</p>
        <p type="p">192:光學濾波器</p>
        <p type="p">BFL:光軸距離/中心距離/後焦距</p>
        <p type="p">CG4:中心距離</p>
        <p type="p">CG6:光軸距離/中心距離</p>
        <p type="p">CT1:中心厚度</p>
        <p type="p">CT5:中心厚度</p>
        <p type="p">CT6:中心厚度</p>
        <p type="p">CT7:中心厚度</p>
        <p type="p">ImgH:長度</p>
        <p type="p">LG1:透鏡群組/第一透鏡群組</p>
        <p type="p">LG2:透鏡群組/可移動透鏡群組/第二透鏡群組</p>
        <p type="p">LG3:透鏡群組/第三透鏡群組/可移動透鏡群組</p>
        <p type="p">LG4:第四透鏡群組/透鏡群組</p>
        <p type="p">MG1:第一光軸距離/中心距離</p>
        <p type="p">MG2:第二光軸距離/中心距離/距離</p>
        <p type="p">OA1:光軸/第一光軸</p>
        <p type="p">OA2:光軸/第二光軸</p>
        <p type="p">PS2:出射表面</p>
        <p type="p">S1:透鏡表面/物體側第一表面/第一表面</p>
        <p type="p">S2:透鏡表面/感測器側第二表面/第二表面</p>
        <p type="p">S3:透鏡表面/第三表面/物體側第三表面</p>
        <p type="p">S4:透鏡表面/第四表面/感測器側第四表面</p>
        <p type="p">S5:透鏡表面/第五表面</p>
        <p type="p">S6:透鏡表面/第六表面</p>
        <p type="p">S7:透鏡表面/物體側第七表面</p>
        <p type="p">S8:透鏡表面/感測器側第八表面/第八表面</p>
        <p type="p">S9:透鏡表面/第九表面</p>
        <p type="p">S10:透鏡表面/第十表面</p>
        <p type="p">S11:透鏡表面/第十一表面</p>
        <p type="p">S12:透鏡表面/第十二表面</p>
        <p type="p">S13:透鏡表面/第十三表面</p>
        <p type="p">S14:透鏡表面/第十四表面</p>
        <p type="p">S15:透鏡表面/第十五表面</p>
        <p type="p">S16:透鏡表面/感測器側表面/第十六表面/感測器側第十六表面</p>
        <p type="p">TD3:光軸距離</p>
        <p type="p">TD4:光軸距離</p>
        <p type="p">TTL1:距離</p>
        <p type="p">TTL2:距離</p>
        <p type="p">X:第一方向</p>
        <p type="p">Y:第二方向</p>
        <p type="p">Z:第三方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1199" publication-number="202625814">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625814</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131005</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體裝置</chinese-title>
        <english-title>MEMORY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W20/49</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商愛思開海力士有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK HYNIX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>元拏識</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WON, NA HYE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金星壽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNG SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭禹泳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, WOO YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李民永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MIN YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本揭示內容的實施例的記憶體裝置可以包括：字線，其埋入基板中並沿第一方向延伸；位元線接觸件，其設置在字線之間，與基板的主動區接觸，並且具有在垂直於第一方向的第二方向上朝向中心凹陷的至少一部分側表面；閘極覆蓋層，其包括與字線的上表面接觸的第一覆蓋部分和位於第一覆蓋部分上的第二覆蓋部分，第二覆蓋部分在第二方向上與位元線接觸件的側表面的至少一部分重疊，並且其寬度與第一覆蓋部分的寬度不同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory device according to embodiments of the present disclosure may comprise a word line buried in a substrate and extending in a first direction, a bit line contact disposed between word lines, contacting an active area of the substrate, and having at least a portion of a side surface concave toward a center in a second direction perpendicular to the first direction, and a gate capping layer including a first capping portion contacting an upper surface of the word line and a second capping portion positioned on the first capping portion, overlapping with at least a portion of the side surface of the bit line contact in the second direction, and having a width different from a width of the first capping portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:部分</p>
        <p type="p">110:主動區</p>
        <p type="p">120:字線</p>
        <p type="p">130:位元線結構</p>
        <p type="p">200:基板</p>
        <p type="p">202:第一絕緣層</p>
        <p type="p">203:元件隔離層</p>
        <p type="p">210:閘極結構</p>
        <p type="p">211:閘極絕緣層</p>
        <p type="p">212:下字線</p>
        <p type="p">213:上字線</p>
        <p type="p">221:閘極覆蓋層</p>
        <p type="p">221a:第一覆蓋部分</p>
        <p type="p">221b:第二覆蓋部分</p>
        <p type="p">222:緩衝層</p>
        <p type="p">230:位元線接觸件</p>
        <p type="p">231:第一間隔件</p>
        <p type="p">241:第一位元線</p>
        <p type="p">242:第二位元線</p>
        <p type="p">243:第三位元線</p>
        <p type="p">244:位元線覆蓋層</p>
        <p type="p">251:位元線間隔件</p>
        <p type="p">CNT:位元線接觸件孔</p>
        <p type="p">I-I':部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1200" publication-number="202624087">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624087</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131006</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有組合式張緊密封子組件的捆紮裝置</chinese-title>
        <english-title>STRAPPING DEVICE WITH A COMBINED TENSIONING-AND-SEALING SUBASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">B65B13/18</main-classification>
        <further-classification edition="200601120260302B">B65B13/02</further-classification>
        <further-classification edition="200601120260302B">B29C65/78</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商賽諾得工業集團有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIGNODE INDUSTRIAL GROUP LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赫伯薛米德　班傑明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUBSCHMID, BENJAMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露案的各種實施例提供了一種捆紮裝置，其包括張緊密封板件、相鄰於張緊密封板件且可圍繞第一軸旋轉的張緊密封輪件及可操作地連接至張緊密封輪件的馬達，前述馬達可被配置為導致張緊密封輪件沿相反的第一及第二旋轉方向圍繞第一軸旋轉地振盪。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various embodiments of the present disclosure provide a strapping device including a tensioning-and-sealing plate, a tensioning-and-sealing wheel adjacent to the tensioning-and-sealing plate and rotatable about a first axis, and a motor operably connected to the tensioning-and-sealing wheel and configured to cause the tensioning-and-sealing wheel to rotationally oscillate about the first axis in opposing first and second rotational directions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:捆紮工具</p>
        <p type="p">100:外殼</p>
        <p type="p">150:運作組件</p>
        <p type="p">800:搖桿</p>
        <p type="p">810:底板</p>
        <p type="p">850:張緊密封板件</p>
        <p type="p">900:手柄</p>
        <p type="p">1410:第一按鈕致動器</p>
        <p type="p">1440:第二按鈕致動器</p>
        <p type="p">1500:電源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1201" publication-number="202624365">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624365</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131011</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液晶聚合物薄膜及其製造方法、覆金屬積層板之製造方法、以及電路基板之製造方法</chinese-title>
        <english-title>LIQUID CRYSTAL POLYMER FILM AND METHOD FOR PRODUCING SAME, METHOD FOR PRODUCING METAL-CLAD LAMINATE, AND METHOD FOR PRODUCING CIRCUIT BOARD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">C08J5/18</main-classification>
        <further-classification edition="200601120260311B">B32B27/36</further-classification>
        <further-classification edition="200601120260311B">B29C55/12</further-classification>
        <further-classification edition="200601120260311B">C09K19/38</further-classification>
        <further-classification edition="200601120260311B">H05K3/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商可樂麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURARAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中和幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, KAZUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐佐木翔真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKI, SHOMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中島崇裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKASHIMA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種在與金屬片積層而作成覆金屬積層板的情形，可製造積層後之液晶聚合物薄膜的相對介電常數為各向同性的覆金屬積層板的液晶聚合物薄膜。前述液晶聚合物薄膜係包含液晶聚合物之薄膜，在20℃、15GHz中的機械方向之相對介電常數ε&lt;sub&gt;MD&lt;/sub&gt;與橫向方向之相對介電常數ε&lt;sub&gt;TD&lt;/sub&gt;的比(ε&lt;sub&gt;MD&lt;/sub&gt;/ε&lt;sub&gt;TD&lt;/sub&gt;)為1.01以上1.40以下，銲料槽中，在前述薄膜的熔點加熱3分鐘之際被釋放的機械方向及橫向方向的應變係任一者皆為負。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a liquid crystal polymer film which can be used to produce a metal-clad laminate in which the liquid crystal polymer film and a metal sheet are laminated together, wherein the laminated liquid crystal polymer film has an isotropic relative dielectric constant. The liquid crystal polymer film is a film including a liquid crystal polymer, wherein a ratio (ε&lt;sub&gt;MD&lt;/sub&gt;/ε&lt;sub&gt;TD&lt;/sub&gt;) of a relative dielectric constant ε&lt;sub&gt;MD&lt;/sub&gt; in the machine direction to a relative dielectric constant ε&lt;sub&gt;TD&lt;/sub&gt; in the transverse direction at 20°C and 15 GHz is 1.01 or more and 1.40 or less, and wherein the liquid crystal polymer film releases negative strains in the machine direction and the transverse direction when the film is heated for 3 minutes at a melting point of the film in a solder bath.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:捲出輥</p>
        <p type="p">2:捲取輥</p>
        <p type="p">3,4:加熱輥</p>
        <p type="p">5,6:S字輥</p>
        <p type="p">7:拉幅機裝置</p>
        <p type="p">8:送風機</p>
        <p type="p">9:前驅體薄膜</p>
        <p type="p">10:液晶聚合物薄膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1202" publication-number="202624846">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624846</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131017</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>調光膜</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">G02F1/13</main-classification>
        <further-classification edition="200601120260313B">G02F1/1333</further-classification>
        <further-classification edition="200601120260313B">G02F1/1334</further-classification>
        <further-classification edition="200601120260313B">G02F1/1339</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大塚雅徳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKA, MASANORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野本知宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOMOTO, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明，提供一種調光膜，其係依序包括第一透明導電性膜、包含高分子基質及液晶成分之調光層、以及第二透明導電性膜者，且上述第一透明導電性膜包括第一透明基材、及配置於上述第一透明基材之上述調光層側之第一透明電極層，上述第二透明導電性膜包括第二透明基材、及配置於上述第二透明基材之上述調光層側之第二透明電極層，於上述調光膜之外周端部之至少一部分設有自上述第一透明基材至上述第二透明基材之上述調光層側之一部分被切除之切口部，且設有覆蓋上述切口部處之上述調光層及第二透明導電性膜之端面的密封部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:第一透明導電性膜</p>
        <p type="p">10a:端面</p>
        <p type="p">12:第一透明基材</p>
        <p type="p">12a:端面</p>
        <p type="p">12b:上表面</p>
        <p type="p">14:第一透明電極層</p>
        <p type="p">14a:端面</p>
        <p type="p">20:調光層</p>
        <p type="p">20a:端面</p>
        <p type="p">30:第二透明導電性膜</p>
        <p type="p">30a:端面</p>
        <p type="p">32:第二透明基材</p>
        <p type="p">32a:端面</p>
        <p type="p">32b:外周端面</p>
        <p type="p">34:第二透明電極層</p>
        <p type="p">34a:端面</p>
        <p type="p">40:密封部</p>
        <p type="p">40a:端面</p>
        <p type="p">50:切口部</p>
        <p type="p">L1:接觸長度</p>
        <p type="p">L2:長度</p>
        <p type="p">L3:長度</p>
        <p type="p">W1:寬度</p>
        <p type="p">W2:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1203" publication-number="202624894">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624894</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131024</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>曝光裝置、量測方法和物品的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">G03F7/20</main-classification>
        <further-classification edition="200601120260313B">G03F9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANON KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, TASUKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田實慎也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAJITSU, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稲村詠史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INAMURA, EISHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, HITOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, TOHRU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邉見和大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEMMI, KAZUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]高精度地量測原版標記。  &lt;br/&gt;　　[解決手段]一種轉印原版的圖案到基板之曝光裝置，具有：原版載臺，其係搭載有保持前述原版的原版支撐器；量測部，其係量測照射量測光到設置於前述原版的原版標記並被前述原版標記反射的前述量測光；遮光部，其係遮擋前述量測光；以及控制部，其係控制前述遮光部的驅動；其中，前述控制部控制配置於不遮擋前述量測光的位置的前述遮光部，以使得在由前述量測部量測前述原版標記的時序下前述遮光部遮擋穿過了前述原版標記的前述量測光。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1204" publication-number="202624153">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624153</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131025</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>減輕洩漏並改善散熱特性之熔融玻璃轉移總成</chinese-title>
        <english-title>MOLTEN GLASS TRANSFER ASSEMBLIES TO MITIGATE LEAKS AND IMPROVE HEAT LOSS PROPERTIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">C03B5/225</main-classification>
        <further-classification edition="200601120260312B">C03B5/18</further-classification>
        <further-classification edition="200601120260312B">C03B7/01</further-classification>
        <further-classification edition="200601120260312B">C03B19/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈佛　喬西Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOOVER, JOSIE R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>豪爾斯　傑森亞瑟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOWLES, JASON ARTHUR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑克森　傑森Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JACKSON, JASON A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金振洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JINSOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米勒　艾瑞克李</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MILLER, ERIC LEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕爾默　布萊恩邁克爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PALMER, BRIAN MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齊默爾曼　提圖斯李</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZIMMERMAN, TYTUS LEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示了一種玻璃製造系統，其包括一澄清容器、一攪拌室及一熔融玻璃轉移總成。該熔融玻璃轉移總成組態為將熔融玻璃自該澄清容器輸送至該攪拌室。該熔融玻璃轉移總成包括一托架、一可澆鑄材料及一導管。該托架包括包圍一內部托架容積之一內部托架表面。該可澆鑄材料位於該托架之該內部托架表面的內部，並且該可澆鑄材料在小於約1500℃之溫度下具有大於約2.0 W/(m·℃)之一熱導率。該可澆鑄材料還包括包圍一內部可澆鑄容積之一內部可澆鑄表面。該導管位於該內部可澆鑄表面的內部，並且該導管包含包圍一內部容積之一內部表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A glass manufacturing system that includes a fining vessel, a stir chamber, and a molten glass transfer assembly is disclosed. The molten glass transfer assembly is configured to convey molten glass from the fining vessel to the stir chamber. The molten glass transfer assembly includes a cradle, a castable material, and a conduit. The cradle includes an internal cradle surface that surrounds an internal cradle volume. The castable material is positioned inside of the internal cradle surface of the cradle, and the castable material has a thermal conductivity greater than about 2.0 W/(m·℃) at temperatures of less than about 1500 ℃. The castable material also includes an internal castable surface that surrounds an internal castable volume. The is conduit positioned inside of the internal castable surface, and the conduit comprises an internal surface that surrounds an internal volume.</p>
      </isu-abst>
      <representative-img>
        <p type="p">306:熔融玻璃轉移總成</p>
        <p type="p">308:托架</p>
        <p type="p">308A:開口</p>
        <p type="p">312C:第三電凸緣</p>
        <p type="p">314A:第一端</p>
        <p type="p">314B:第二端</p>
        <p type="p">316:內部容積</p>
        <p type="p">318:可澆鑄材料</p>
        <p type="p">348:導管</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1205" publication-number="202625250">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625250</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131031</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>諧振多反應器遠端電漿源</chinese-title>
        <english-title>RESONANT MULTI-REACTOR REMOTE PLASMA SOURCE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">H01J37/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雨暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YUHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何易凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, YIFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡拉　安尼爾庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KALAL, ANIL KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉馬斯瓦米　卡提克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMASWAMY, KARTIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫格達姆　法哈德Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOGHADAM, FARHAD K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝沙維亞加雅索莫西卡　維西瓦茲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASAVARAJAIAH SOMASHEKAR, VISHWAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭　岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, YUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">諸態樣大體而言係關於通過開發諧振多反應器遠端電漿源（RPS）來推進遠端電漿技術的方法和系統。該RPS系統包含至少第一RPS和第二RPS，其中第一RPS包含在由第二RPS所界定的邊界內，且第一組間隔物鄰接第一RPS，且第二組間隔物鄰接第二RPS。第一RPS具有垂直配置，且第二RPS具有水平配置。第一RPS和第二RPS均具有矩形形狀。第一RPS具有安置於其中心的第一輸入埠，且第二RPS具有安置於第二RPS的相對角落的第二輸入埠和第三輸入埠。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Aspects generally relate to methods and systems for advancing remote plasma technology by developing a resonant multi-reactor remote plasma source (RPS). The RPS system includes at least a first RPS and a second RPS, the first RPS contained within a boundary defined by the second RPS and a first set of spacers abutting the first RPS and a second set of spacers abutting the second RPS. The first RPS has a vertical configuration and the second RPS has a horizontal configuration. Both the first RPS and the second RPS have a rectangular shape. The first RPS has a first input port centrally disposed thereof and the second RPS has a second input port and a third input port disposed on opposed corners of the second RPS.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:RPS系統</p>
        <p type="p">102:第一輸入口</p>
        <p type="p">104:第二輸入口</p>
        <p type="p">106:第三輸入口</p>
        <p type="p">110:第一RPS</p>
        <p type="p">112A:第一間隔物/第二間隔物</p>
        <p type="p">112B:間隔物</p>
        <p type="p">115:第一電容器</p>
        <p type="p">120:第二RPS</p>
        <p type="p">122A:第一間隔物/第二間隔物</p>
        <p type="p">122B:第三間隔物/第四間隔物</p>
        <p type="p">125:第二電容器</p>
        <p type="p">130:阻抗匹配電路</p>
        <p type="p">132:激發線圈</p>
        <p type="p">134:圓形線圈段</p>
        <p type="p">136:矩形線圈段/金屬導體</p>
        <p type="p">140:RF產生器</p>
        <p type="p">150:導管</p>
        <p type="p">152:導管</p>
        <p type="p">160:底部腔室/腔室主體</p>
        <p type="p">162:接地連接</p>
        <p type="p">170:噴頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1206" publication-number="202624828">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624828</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131034</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於視訊直通成像的折疊光學元件</chinese-title>
        <english-title>FOLDED OPTICS FOR VIDEO PASS-THROUGH IMAGING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G02B13/00</main-classification>
        <further-classification edition="200601120260302B">G02B27/00</further-classification>
        <further-classification edition="200601120260302B">G02B27/01</further-classification>
        <further-classification edition="202101120260302B">G02B7/04</further-classification>
        <further-classification edition="202301120260302B">H04N23/55</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加勒格魯斯金　米查</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GALOR GLUSKIN, MICHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述用於重導向光之系統及技術。例如，一種用於重導向光之設備可包括沿著一第一光學軸定位的一顯示器。該第一光學軸穿過該顯示器的一觀看平面並與一觀看位置相交。該設備可包括沿著該第一光學軸定位的一第一光重導向元件。該第一光重導向元件經組態以將來自一場景的光朝向一第二光學軸重導向。該設備包括一影像感測器。該影像感測器經組態以接收來自該場景的該光。沿著該場景與該影像感測器之間的一光路徑包括該第一光重導向元件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and techniques are described for redirecting light. For example, an apparatus for redirecting light can include a display positioned along a first optical axis. The first optical axis passes through a viewing plane of the display and intersects with a viewing position. The apparatus can include a first light redirecting element positioned along the first optical axis. The first light redirecting element is configured to redirect light from a scene toward a second optical axis. The apparatus includes an image sensor. The image sensor is configured to receive the light from the scene. The first light redirecting element is included along an optical path between the scene and the image sensor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">600:攝影機系統</p>
        <p type="p">602A:第一觀看位置</p>
        <p type="p">602B:第二觀看位置</p>
        <p type="p">604A:顯示器</p>
        <p type="p">604B:顯示器</p>
        <p type="p">605A:光重導向元件</p>
        <p type="p">605B:光重導向元件</p>
        <p type="p">608A:光學軸</p>
        <p type="p">608B:光學軸</p>
        <p type="p">610:HMD</p>
        <p type="p">618A:經重導向光學軸</p>
        <p type="p">618B:經重導向光學軸</p>
        <p type="p">620A:影像感測器</p>
        <p type="p">620B:影像感測器</p>
        <p type="p">640A:攝影機埠</p>
        <p type="p">640B:攝影機埠</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1207" publication-number="202625049">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625049</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131052</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資訊提供裝置、方法及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260309B">G06Q30/0203</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商粉酷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANCREW INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口敬人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, TAKATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黑木勝巳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUROKI, KATSUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德田修治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKUDA, SHUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於，當使提升顧客之再來店意願、再購買意願、簽約意願、持續意願或推薦意願時，可視覺性地掌握相較於同一或類似業態之情形下較佳應優先改善的評價因子。  &lt;br/&gt;本發明之解決手段在於提供一種資訊提供裝置，其具備有：調查資料取得手段、多變量解析手段、基準值設定手段、優先度分析手段及分析結果輸出手段；該調查資料取得手段係取得包含有對對象商品或服務的評價項目之評價值的評價資料；該多變量解析手段係根據評價資料，將再來店意願等設為目的變數，並將評價值設為解釋變數，以進行多變量解析，藉此算出解釋變數對於目的變數的貢獻度；該基準值設定手段係對解釋變數設定基準值；該優先度分析手段係根據基準值與上述貢獻度，以分析努力優先度；該分析結果輸出手段係將藉由優先度分析手段所產生的分析結果予以顯示在資訊終端機。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1208" publication-number="202625700">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625700</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131059</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>處理薄膜的方法及製造記憶體裝置的方法</chinese-title>
        <english-title>METHOD OF TREATING THIN FILMS AND METHOD OF MANUFACTURING MEMORY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260309B">H10P50/20</main-classification>
        <further-classification edition="202601120260309B">H10P95/60</further-classification>
        <further-classification edition="200601120260309B">C23C16/455</further-classification>
        <further-classification edition="202301120260309B">H10B99/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＥＧＴＭ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EGTM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹圭鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, KYU HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭玹姝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, HYUN JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金哈娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HA NA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭主煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, JU HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹賢植</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, HYEON SIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金信範</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SHIN BEOM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金建希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KUN HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐德炫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, DUCK HYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓智娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, JI YEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露一種處理薄膜的方法，該方法包含：將一表面氧化劑供應至在其中放置有一基板的一腔室中以處理該基板；將一前驅物供應至該腔室中以將該前驅物吸附至該基板上；吹掃該腔室的內部；將一蝕刻引發劑供應至該腔室中；吹掃該腔室的內部；將一反應材料供應至該腔室中以形成一薄膜並且活化該蝕刻引發劑；以及吹掃該腔室的內部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a method of treating thin films, the method comprising: supplying a surface oxidizing agent into a chamber in which a substrate is placed to treat the substrate; supplying a precursor into the chamber to adsorb the precursor onto the substrate; purging the inside of the chamber; supplying an etch initiator into the chamber; purging the inside of the chamber; supplying a reaction material into the chamber to form a thin film and to activate the etch initiator; and purging the inside of the chamber.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1209" publication-number="202624585">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624585</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131069</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>玻璃布、預浸體及印刷電路板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260223B">D03D15/267</main-classification>
        <further-classification edition="200601120260223B">H05K1/03</further-classification>
        <further-classification edition="200601120260223B">B32B27/12</further-classification>
        <further-classification edition="201801120260223B">C03C25/1095</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商旭化成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣瀬周</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIROSE, AMANE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柿崎宏昂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAKIZAKI, HIROTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種能夠改善印刷電路板之偏移，且生產性及樹脂含浸性優異之玻璃布。  &lt;br/&gt;根據本發明，提供一種將包含複數根玻璃長絲之玻璃紗作為經紗及緯紗而構成之玻璃布。上述玻璃布之厚度為26～36 μm之範圍，且經紗寬度及緯紗寬度分別為211～300 μm及326～400 μm之範圍，或厚度為42～58 μm之範圍，且經紗寬度及緯紗寬度分別為267～385 μm及425～550 μm之範圍。而且，上述玻璃布之使用分裂圓筒共振器所測定之10 GHz下之介電常數之變異係數為8.0%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1210" publication-number="202624131">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624131</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131092</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>三氧化鉬粉體、三氧化鉬粉體的製造裝置及三氧化鉬粉體的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260204B">C01G39/02</main-classification>
        <further-classification edition="200601120260204B">C01G39/06</further-classification>
        <further-classification edition="200601120260204B">C23C24/00</further-classification>
        <further-classification edition="200601120260204B">C04B35/495</further-classification>
        <further-classification edition="200601120260204B">C01G23/08</further-classification>
        <further-classification edition="202201120260204B">C01F7/02</further-classification>
        <further-classification edition="202401120260204B">B01J35/45</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＤＩＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平林滉生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRABAYASHI, KOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高榕輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOU, YOUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁建軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, JIANJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村田秀之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURATA, HIDEYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹東穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種藉由BET法測定的比表面積更大、可較佳地用作硫化鉬的前驅物的三氧化鉬粉體。一種三氧化鉬粉體，藉由BET法測定的比表面積為100 m&lt;sup&gt;2&lt;/sup&gt;/g以上且500 m&lt;sup&gt;2&lt;/sup&gt;/g以下。三氧化鉬粉體的藉由動態光散射法求出的中值粒徑D&lt;sub&gt;50&lt;/sub&gt;可為5 nm以上且1000 nm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1211" publication-number="202624742">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624742</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131167</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>敲擊檢測的訓練方法、測試方法及敲擊檢測裝置</chinese-title>
        <english-title>TRAINING METHOD AND TESTING METHOD OF TAPPING DETECTION, AND TAPPING DETECTION APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260221B">G01N29/04</main-classification>
        <further-classification edition="200601120260221B">G01N33/02</further-classification>
        <further-classification edition="200601120260221B">G01N29/44</further-classification>
        <further-classification edition="202301120260221B">G06F18/24</further-classification>
        <further-classification edition="200601120260221B">G10L15/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仁寶電腦工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COMPAL ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅宇強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, YU-CHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張惟一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, WEI-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JIA-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王鎮城</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHEN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江志文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHIH-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種敲擊檢測的訓練方法、測試方法及敲擊檢測裝置。在訓練方法中，取得敲擊聲音訊號的聲音特徵，並取得將敲擊聲音訊號分類至蔬果品質類別的標記資訊。接著，使用聲音特徵及標記資訊訓練分類模型。在測試方法中，使用分類模型辨識待測聲音訊號對應的蔬果品質類別。藉此，可將專家的檢測經驗數位化，並提升農業分級的效率與客觀性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A training method and a testing method of tapping detection, and a tapping detection device are provided. In the training method, a sound feature of a tapping sound signal is obtained, and a corresponding labeling information for classifying the tapping sound signal into a fruit and vegetable quality category is obtained. Then, a classification model is trained using the sound feature and the labeling information. In the testing method, the classification model is used to identify a fruit and vegetable quality category corresponding to a test sound signal. Therefore, the inspection experience of experts can be digitized, and the efficiency and objectivity of agricultural grading can be improved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S510~S530:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1212" publication-number="202625765">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625765</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131172</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於升降框架的透射和吸收質量裝置以及相關處理腔室、腔室套件和方法</chinese-title>
        <english-title>TRANSMISSIVE AND ABSORPTIVE MASS ARRANGEMENTS FOR LIFT FRAMES, AND RELATED PROCESSING CHAMBERS, CHAMBER KITS, AND METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260310B">H10P72/76</main-classification>
        <further-classification edition="200601120260310B">C30B25/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙鎮瑤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAO, CHEN-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　成和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, SENG HOE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小橋和義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBASHI, KAZUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡　昌瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, RYAN SUNGBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石井　才人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHII, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈寬建</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, KUAN CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臧　科研</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZANG, KEYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高頓　瑞普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAUTAM, RIBHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施例大體而言係關於升降框架的質量裝置，以及相關的基板處理腔室、腔室套件和方法。在一或多個實施例中，一種處理腔室包含腔室主體，該腔室主體包含形成於該腔室主體中的複數個氣體注入通道。該腔室主體至少部分限定了內部空間。該處理腔室包含定位在內部空間中的基板支撐組件。該基板支撐組件包含升降框架。該升降框架包含複數個臂和由這些複數個臂支撐的環。該升降框架包含在方位上彼此間隔的複數個部分。這些複數個部分具有與環不同的透射率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure generally relate to mass arrangements for lift frames, and related substrate processing chambers, chamber kits, and methods. In one or more embodiments, a processing chamber includes a chamber body including a plurality of gas inject passages formed in the chamber body. The chamber body at least partially defines an internal volume. The processing chamber includes a substrate support assembly positioned in the internal volume. The substrate support assembly includes a lift frame. The lift frame includes a plurality of arms and a ring supported by the plurality of arms. The lift frame includes a plurality of sections azimuthally spaced from each other. The plurality of sections have a different transmissivity than the ring.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:基板</p>
        <p type="p">106:基板支撐</p>
        <p type="p">107:銷穿孔</p>
        <p type="p">108:上窗口</p>
        <p type="p">110:窗口</p>
        <p type="p">112:流動模組</p>
        <p type="p">116:排氣出口</p>
        <p type="p">118:軸</p>
        <p type="p">120:控制器</p>
        <p type="p">121:運動組件</p>
        <p type="p">123:支撐面</p>
        <p type="p">132:銷</p>
        <p type="p">136:處理空間</p>
        <p type="p">138:淨化空間</p>
        <p type="p">141:上熱源</p>
        <p type="p">143:下熱源</p>
        <p type="p">145:熱源模組</p>
        <p type="p">148:主體</p>
        <p type="p">151:製程氣體源</p>
        <p type="p">152:地板</p>
        <p type="p">153:清洗氣體源</p>
        <p type="p">154:蓋</p>
        <p type="p">155:上熱源模組</p>
        <p type="p">156:上主體</p>
        <p type="p">157:排氣泵</p>
        <p type="p">162:淨化氣體源</p>
        <p type="p">164:淨化氣體入口</p>
        <p type="p">178:排氣系統</p>
        <p type="p">302:預熱環</p>
        <p type="p">304:止動件</p>
        <p type="p">305a:臂</p>
        <p type="p">305b:臂</p>
        <p type="p">311:襯墊</p>
        <p type="p">1014:入口開口</p>
        <p type="p">1020:上襯墊</p>
        <p type="p">1021:環形部分</p>
        <p type="p">1027:第一延伸部</p>
        <p type="p">1028:第二延伸部</p>
        <p type="p">4000:處理腔室</p>
        <p type="p">4030:框架</p>
        <p type="p">4031:臂</p>
        <p type="p">4032:環</p>
        <p type="p">4033a:質量</p>
        <p type="p">4033b:質量</p>
        <p type="p">P1:製程氣體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1213" publication-number="202625701">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625701</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131181</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>降低介電常數的方法及半導體器件的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260308B">H10P50/20</main-classification>
        <further-classification edition="202601120260308B">H10W20/00</further-classification>
        <further-classification edition="202601120260308B">H10P14/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商中央硝子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CENTRAL GLASS COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒田忍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARATA, SHINOBU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>照井貴陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TERUI, YOSHIHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>片村友大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATAMURA, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種降低Low-K膜之介電常數的方法及半導體器件的製造方法，其即使對於例如可設想為空孔徑非常小之多孔膜的受損Low-K膜亦可合宜降低介電常數。本揭露係關於降低Low-K膜之介電常數的方法，其包含使用係為由下述通式（1）所示之化合物的矽化劑在超過100℃下對Low-K膜進行處理的工序。&lt;br/&gt;  SiR&lt;sup&gt;1&lt;/sup&gt;&lt;sub&gt;a&lt;/sub&gt;X&lt;sub&gt;4−a&lt;/sub&gt;　　　（1）&lt;br/&gt;  式中，R&lt;sup&gt;1&lt;/sup&gt;相同或相異表示氫原子或者烷基。X相同或相異表示N(R&lt;sup&gt;2&lt;/sup&gt;)&lt;sub&gt;2&lt;/sub&gt;基或者鹵原子，R&lt;sup&gt;2&lt;/sup&gt;相同或相異表示氫原子或者烷基，a表示1或2。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1214" publication-number="202624144">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624144</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131289</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種分解污染廢水中過氧化物之方法</chinese-title>
        <english-title>A METHOD FOR DECOMPOSING PEROXIDES IN CONTAMINATED WASTEWATERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260311B">C02F1/58</main-classification>
        <further-classification edition="200601320260311B">C02F103/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澳大利亞商無限水國際有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWI AUSTRALIA PTY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武　長明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VU, TRUONG MINH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳　植輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NG, MATTHEW CHIK-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴　龍登</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGHIEM, LONG D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿蒂提亞　麗莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADITYA, LISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ID</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示一種分解廢水中之過氧化物污染物之方法。該方法包含使流體與包含二氧化錳、氧化鐵及氧化矽之催化介質接觸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein is a method for decomposing a peroxide contaminant in a wastewater. The method comprises contacting the fluid with a catalytic media comprising manganese dioxide, iron oxide and silicon oxide.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:原廢水</p>
        <p type="p">2:調節</p>
        <p type="p">3:調節</p>
        <p type="p">4:接觸槽</p>
        <p type="p">5:經調節之廢水</p>
        <p type="p">6:中止反應器</p>
        <p type="p">7:催化介質床/催化介質</p>
        <p type="p">8:經處理之水</p>
        <p type="p">9:氧氣</p>
        <p type="p">10:反洗</p>
        <p type="p">11:氧化劑溶液</p>
        <p type="p">12:管線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1215" publication-number="202624032">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624032</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131292</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池模組、電池組和載具</chinese-title>
        <english-title>BATTERY MODULE, BATTERY PACK AND VEHICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260309B">B60L50/64</main-classification>
        <further-classification edition="200601120260309B">B60R16/033</further-classification>
        <further-classification edition="202101120260309B">H01M50/284</further-classification>
        <further-classification edition="202101120260309B">H01M50/298</further-classification>
        <further-classification edition="202101120260309B">H01M50/204</further-classification>
        <further-classification edition="202101120260309B">H01M50/273</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李旻珠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MINJU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許宰榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUR, JAE YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林正勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, JEONG HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">為了實現上述目的，根據本案的示例性實施例的電池模組可包括電池框架，配置以容納電池單元；支架，安裝於電池框架上；固定件，安裝至支架並配置以固定設置於支架上方的線束；以及緊固件，配置以緊固電池框架和支架。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">To achieve the above object, a battery module according to an exemplary embodiment of the present disclosure may include a cell frame configured to accommodate a battery cell; a bracket mounted on the cell frame; a fixing member mounted to the bracket and configured to secure a wire harness arranged above the bracket; and a fastening member configured to fasten the cell frame and the bracket.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:電池模組</p>
        <p type="p">100:電池組件</p>
        <p type="p">110:電池框架</p>
        <p type="p">200:支架</p>
        <p type="p">300:BMS電路板</p>
        <p type="p">400:線束</p>
        <p type="p">500:第一固定件</p>
        <p type="p">600:第二固定件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1216" publication-number="202624454">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624454</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131318</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>量子點分散液、半導體膜之製造方法、光檢測元件之製造方法、影像感測器之製造方法及量子點分散液之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C09K11/02</main-classification>
        <further-classification edition="200601120260302B">C09K11/75</further-classification>
        <further-classification edition="202301120260302B">H10K85/60</further-classification>
        <further-classification edition="202601120260302B">C01B3/00</further-classification>
        <further-classification edition="202501120260302B">H10F30/20</further-classification>
        <further-classification edition="202501120260302B">H10F39/12</further-classification>
        <further-classification edition="202501120260302B">H10F77/124</further-classification>
        <further-classification edition="202301120260302B">H10K30/35</further-classification>
        <further-classification edition="202301120260302B">H10K30/87</further-classification>
        <further-classification edition="202601120260302B">H10K39/32</further-classification>
        <further-classification edition="201101120260302B">B82Y15/00</further-classification>
        <further-classification edition="201101120260302B">B82Y20/00</further-classification>
        <further-classification edition="201101120260302B">B82Y40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高田真宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKATA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳下幸一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAGISHITA, KOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種量子點分散液及其製造方法，其包含：量子點，包含In元素及第15族元素，且第15族元素包含Sb元素；配位體；及溶劑，其中，配位體包含：碳數6以下的有機配位體，及包含鹵素元素的無機配位體。使用前述量子點分散液之半導體膜、光檢測元件及影像感測器之製造方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光檢測元件</p>
        <p type="p">11:第1電極</p>
        <p type="p">12:第2電極</p>
        <p type="p">13:光電轉換層</p>
        <p type="p">21:電子傳輸層</p>
        <p type="p">22:電洞傳輸層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1217" publication-number="202623796">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623796</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131324</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>CYP11A1抑制劑的藥物组合物及其製備方法和用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/4035</main-classification>
        <further-classification edition="200601120260302B">A61K31/454</further-classification>
        <further-classification edition="200601120260302B">A61K31/422</further-classification>
        <further-classification edition="200601120260302B">A61K31/4192</further-classification>
        <further-classification edition="200601120260302B">A61K31/407</further-classification>
        <further-classification edition="200601120260302B">A61K31/351</further-classification>
        <further-classification edition="200601120260302B">A61K31/4178</further-classification>
        <further-classification edition="200601120260302B">A61K9/00</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商遼寧海思科製藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAONING HAISCO PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳麗君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, LIJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蒲婷婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PU, TINGTING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肖華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIAO, HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, GUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林發立</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種配製成單劑量形式的口服藥物組合物或藥物製劑，所述的口服藥物組合物或藥物製劑包含活性成分M和藥用賦形劑，所述的活性成分M選自通式(I-a)、(I-b)所述的化合物或者其立體異構體、互變異構體、氘代物、溶劑化物、前藥、代謝產物、藥學上可接受的鹽或共晶，按照游離鹼形式的含量計，所述的口服藥物組合物或藥物製劑包含0.5mg-800mg活性成分M。本發明還涉及所述口服藥物組合物或藥物製劑在製備治療/預防CYP11A1介導的疾病的藥物中的用途。  &lt;br/&gt;&lt;img align="absmiddle" height="211px" width="387px" file="ed10026.JPG" alt="ed10026.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1218" publication-number="202625563">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625563</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131326</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>形成鐵電裝置電極的系統及低溫方法</chinese-title>
        <english-title>SYSTEMS AND LOW TEMPERATURE METHODS OF FORMING FERROELECTRIC DEVICE ELECTRODES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260304B">H10B53/30</main-classification>
        <further-classification edition="202301120260304B">H10B51/30</further-classification>
        <further-classification edition="202501120260304B">H10D1/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特里優索　蒂娜　Ｈ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRIYOSO, DINA H.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　德寶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TEK PO RINUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今北健一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMAKITA, KENICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大槻沙羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKI, SARA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種形成電子裝置的方法包括：在基板上形成第一金屬電極層，該第一金屬電極層包括第一金屬；在該第一金屬電極層上形成電性有序排列材料層；在低溫條件下，在該電性有序排列材料層上沉積第二金屬，以形成第二金屬電極層；以及對該第一金屬電極層、該電性有序排列材料層以及該第二金屬電極層進行圖案化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of forming an electronic device includes forming a first metal electrode layer over a substrate, the first metal electrode layer including a first metal; forming an electrically ordered material layer over the first metal electrode layer; depositing a second metal over the electrically ordered material layer under cryogenic conditions to form a second metal electrode layer; and patterning the first metal electrode layer, the electrically ordered material layer, and the second metal electrode layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:方法</p>
        <p type="p">301-304:方框</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1219" publication-number="202624908">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624908</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131329</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>應用程式、記錄媒體、電力管理裝置及電力管理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251001B">G05B19/418</main-classification>
        <further-classification edition="202401120251001B">G06Q50/06</further-classification>
        <further-classification edition="200601120251001B">G06F1/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商恩邁斯科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENIMAS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林昌純</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, MASAZUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係使包含電力使用設備之消耗電力的消耗電力資訊可在終端機器中被靈活運用者。  &lt;br/&gt;本發明設有一種應用程式，其係管理伺服器27可讀入並使管理伺服器27執行處理之非暫時性的應用程式，上述管理伺服器27具有輔助記憶體31且經由網路17而連接至終端機器13；上述應用程式使管理伺服器27執行如下處理：第1處理，其從連接至電力使用設備之電路中所設置之電力檢測感測器獲取信號；第2處理，其藉由處理從電力檢測感測器所獲取之信號，而獲取包含電力使用設備之消耗電力的資訊；第3處理，其根據第2處理中所獲取之資訊、及記憶於輔助記憶體31中之資訊，以產生將電力使用設備之類別與電力使用設備之狀態建立關聯後而得之設備資訊；以及第4處理，其朝向終端機器13發送設備資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電力管理系統</p>
        <p type="p">13:終端機器</p>
        <p type="p">14:控制伺服器</p>
        <p type="p">17:網路</p>
        <p type="p">24:母機</p>
        <p type="p">27:管理伺服器</p>
        <p type="p">28:中繼伺服器</p>
        <p type="p">29,50:處理器</p>
        <p type="p">30,51:主記憶體</p>
        <p type="p">31,52:輔助記憶體</p>
        <p type="p">32,53:通信裝置</p>
        <p type="p">33,54:匯流排</p>
        <p type="p">31A:記錄媒體</p>
        <p type="p">34:網站管理部</p>
        <p type="p">35:使用者資訊管理部</p>
        <p type="p">36:電氣機器管理部</p>
        <p type="p">37:電力使用設備管理部</p>
        <p type="p">38:電力資訊管理部</p>
        <p type="p">39:應對提案部</p>
        <p type="p">40:人工智能部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1220" publication-number="202625734">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625734</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131357</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>監測製程機台之方法及設備</chinese-title>
        <english-title>METHODS AND APPARATUS FOR MONITORING A PROCESSING TOOL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260312B">H10P72/00</main-classification>
        <further-classification edition="200601120260312B">H01J37/32</further-classification>
        <further-classification edition="202201120260312B">G01J5/00</further-classification>
        <further-classification edition="200601120260312B">G05D23/27</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙瓦拉尼　卡皮爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAWLANI, KAPIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王塞納克運　潘亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONGSENAKHUM, PANYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾許地安尼　凱翰　阿畢迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASHTIANI, KAIHAN ABIDI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗蘭森　保羅　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRANZEN, PAUL M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉比　拉福商</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RABBI, RAFSAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BD</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏爾馬　帕萬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHARMA, PAWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬丁　帕特金　約翰　埃爾斯沃思</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARTIN, PATGING JOHN ELSWORTH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供用於監測製程設備之方法及設備。在一些實施例中，技術可能包含基於從相對於製程設備的第一組件設置的至少一感測器獲得的一或多個量測值，來即時判定與製程設備的第一組件相關聯的第一溫度；以及至少基於與第一組件相關聯的第一溫度達到第一閾值，來執行減輕與製程設備相關聯的劣化或故障的至少一第一預防措施。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and apparatus for monitoring a processing apparatus are provided. In some embodiments, techniques may include determining, in real-time, a first temperature associated with a first component of the processing apparatus based on one or more measurements obtained from at least one sensor disposed relative to the first component of the processing apparatus; and based at least on the first temperature associated with the first component reaching a first threshold value, performing at least a first preventive measure that mitigates degradation or failure associated with the processing apparatus.</p>
      </isu-abst>
      <representative-img>
        <p type="p">d:規定距離</p>
        <p type="p">θ:規定角度</p>
        <p type="p">300:配置</p>
        <p type="p">301:紅外線感測器、IR感測器</p>
        <p type="p">302:氣體輸送管線</p>
        <p type="p">304:加熱元件</p>
        <p type="p">306:蚌殼式外殼</p>
        <p type="p">308:熱護套</p>
        <p type="p">310:部分</p>
        <p type="p">311:水平軸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1221" publication-number="202625251">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625251</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131365</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>分配頂部百萬赫功率的系統及方法</chinese-title>
        <english-title>SYSTEMS AND METHODS FOR SPLITTING TOP MHZ POWER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">H01J37/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑪瑞卡塔諾　艾力西　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARAKHTANOV, ALEXEI M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>智　賓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JI, BING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>露千西　肯尼斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUCCHESI, KENNETH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥斯　亞當　克利斯多夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACE, ADAM CHRISTOPHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍藍德　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOLLAND, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">系統包括產生RF波形的射頻(RF，radio frequency)產生器以及接收RF波形以輸出第一修正RF波形的阻抗匹配電路。RF連接部接收第一修正RF波形，並提供該第一修正RF波形給第一上電極段。參數電路經由電漿區域和第二上電極段接收第一修正RF波形的一部分RF功率，以輸出第二修正RF波形。參數電路將第二修正RF波形提供到接地連接部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system includes a radio frequency (RF) generator that generates an RF waveform and an impedance matching circuit that receives the RF waveform to output a first modified RF waveform. An RF connection receives the first modified RF waveform and provides the first modified RF waveform to a first upper electrode segment. A parameter circuit receives a portion of RF power of the first modified RF waveform via a plasma region and a second upper electrode segment to output a second modified RF waveform. The parameter circuit provides the second modified RF waveform to a ground connection.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">101:傳輸纜線</p>
        <p type="p">102:電極</p>
        <p type="p">103:傳輸纜線</p>
        <p type="p">104:RF產生器</p>
        <p type="p">105:控制訊號</p>
        <p type="p">106:RF波形</p>
        <p type="p">107:電流訊號</p>
        <p type="p">108:主電腦</p>
        <p type="p">109:中心區域</p>
        <p type="p">110:RF產生器</p>
        <p type="p">111:邊緣區域</p>
        <p type="p">112:匹配</p>
        <p type="p">113:左側</p>
        <p type="p">114:電漿腔室</p>
        <p type="p">115:右側</p>
        <p type="p">116:匹配</p>
        <p type="p">117:外邊緣</p>
        <p type="p">118:電容器</p>
        <p type="p">119:頂壁</p>
        <p type="p">120:處理器</p>
        <p type="p">121:側壁</p>
        <p type="p">122:記憶體裝置</p>
        <p type="p">123:底壁</p>
        <p type="p">124:RF波形</p>
        <p type="p">125:修正RF波形</p>
        <p type="p">126:電極</p>
        <p type="p">128:氣體分佈板</p>
        <p type="p">129:墊部</p>
        <p type="p">130:隔離環</p>
        <p type="p">132:隔離層</p>
        <p type="p">134:基板支撐件</p>
        <p type="p">136:驅動器</p>
        <p type="p">138:馬達</p>
        <p type="p">139:間隙</p>
        <p type="p">140:RF纜線</p>
        <p type="p">142:輸入端</p>
        <p type="p">144:輸出端</p>
        <p type="p">146:RF傳輸線</p>
        <p type="p">148:RF纜線</p>
        <p type="p">150:輸入端</p>
        <p type="p">152:輸出端</p>
        <p type="p">154:RF傳輸線</p>
        <p type="p">156-158:RF饋送部</p>
        <p type="p">160-162:配方訊號</p>
        <p type="p">164-166:修正RF波形</p>
        <p type="p">BS1-BS2:底面</p>
        <p type="p">P1-P2:點</p>
        <p type="p">S:基板</p>
        <p type="p">TS1-TS2:頂面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1222" publication-number="202624017">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624017</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131370</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有多個阻隔式分配通道的噴淋頭</chinese-title>
        <english-title>SHOWERHEAD WITH MULTIPLE BLIND DISTRIBUTION CHANNELS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120260309B">B33Y80/00</main-classification>
        <further-classification edition="200601120260309B">C23C16/44</further-classification>
        <further-classification edition="200601120260309B">C23C16/455</further-classification>
        <further-classification edition="200601120260309B">C23C16/50</further-classification>
        <further-classification edition="200601120260309B">C23C16/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>但丁　愛德華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DANTE, EDWARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查爾莫斯　傑佛瑞　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHALMERS, JEFFREY MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬德森　艾瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MADSEN, ERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多納利　肖恩　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONNELLY, SEAN M</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>托爾巴提沙拉佛　沙耶德哈米德瑞沙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORBATISARRAF, SEYEDHAMIDREZA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫馬爾　舒布哈姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, SHUBHAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米甚拉　阿比納夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MISHRA, ABHINAV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>本裕民　那魯達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BENYUHMIN, NARUDHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露的例示性噴淋頭包含管座中的阻隔式分配通道以配送處理化學物至噴淋頭的充氣部。一例子提供一噴淋頭，其包含一管座。該管座包含一處理化學物配送通道及複數阻隔式分配通道，該些阻隔式分配通道各自從該處理化學物配送通道延伸。每一阻隔式分配通道包含沿著該阻隔式分配通道的長度方向間隔設置的複數出口。該噴淋頭進一步包含固定於該管座的一面板以形成位於該管座及該面板之間的一充氣部，該充氣部設置以接收來自該出口的一處理化學物流。該面板包含複數出孔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Examples are disclosed that relate to showerheads including blind distribution channels in a stem to deliver processing chemicals to a plenum of the showerhead. One example provides a showerhead comprising a stem. The stem comprises a processing chemical delivery channel and a plurality of blind distribution channels each extending from the processing chemical delivery channel. Each blind distribution channel comprises a plurality of exit ports spaced along a length of the blind distribution channel. The showerhead further comprises a faceplate secured to the stem to form a plenum between the stem and the faceplate, the plenum configured to receive a processing chemical flow from the exit ports. The faceplate comprises a plurality of outlet holes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:噴淋頭</p>
        <p type="p">202:管座</p>
        <p type="p">204:面板</p>
        <p type="p">206:充氣部</p>
        <p type="p">210:處理化學物配送通道</p>
        <p type="p">212A、212B:阻隔式分配通道</p>
        <p type="p">214:出口</p>
        <p type="p">216A、216B:彎曲過渡通道</p>
        <p type="p">220:第一直徑</p>
        <p type="p">222:第二直徑</p>
        <p type="p">224:出孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1223" publication-number="202624587">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624587</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131387</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>不織布及包含其的物品</chinese-title>
        <english-title>NON-WOVEN FABRIC AND ARTICLE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260309B">D04H1/4382</main-classification>
        <further-classification edition="200601120260309B">D04H13/00</further-classification>
        <further-classification edition="200601120260309B">D06M11/83</further-classification>
        <further-classification edition="200601120260309B">D01D5/34</further-classification>
        <further-classification edition="200601120260309B">D01F8/14</further-classification>
        <further-classification edition="200601320260309B">D06M101/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商東麗先端素材股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORAY ADVANCED MATERIALS KOREA INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李賢祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HYUN WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申東昈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, DONG HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種不織布及一種包含其之物品。該不織布包含芯鞘型複合纖維，且該等芯鞘型複合纖維之一鞘部分包含一抗菌物質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are a non-woven fabric and an article including the same. The non-woven fabric includes core-sheath-type composite fibers, and a sheath portion of the core-sheath-type composite fibers includes an antibacterial substance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1224" publication-number="202625665">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625665</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131413</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260221B">H10K59/65</main-classification>
        <further-classification edition="202301120260221B">H10K59/10</further-classification>
        <further-classification edition="200601120260221B">G02B3/00</further-classification>
        <further-classification edition="200601120260221B">G02B27/40</further-classification>
        <further-classification edition="202301120260221B">H04N23/55</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ顯示器股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳領民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, YOUNGMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玄昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HYUNSEUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置，可以包括：顯示面板，包括：光學區域，包含複數個透射區域及複數個發光區域；以及正常區域，設置於該光學區域外側，並且包含複數個發光區域；光學電子裝置，設置於顯示面板下或下部，並且與光學區域重疊；以及複數個透鏡，設置於光學區域中，並且與該複數個透射區域重疊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device can include a display panel having an optical area including a plurality of transmissive areas and a plurality of light emitting areas, and a normal area disposed outside of the optical area and including a plurality of light emitting areas, an optical electronic device disposed under or in a lower portion of the display panel and overlapping with the optical area, and a plurality of lenses disposed in the optical area and overlapping with the plurality of transmissive areas.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:第一光學電子裝置</p>
        <p type="p">CL:透鏡</p>
        <p type="p">EA:發光區域</p>
        <p type="p">OA:光學區域</p>
        <p type="p">TA:透射區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1225" publication-number="202624790">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624790</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131416</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>協同環境中之低功率存在偵測</chinese-title>
        <english-title>LOW POWER PRESENCE DETECTION IN COLLABORATIVE ENVIRONMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">G01S15/04</main-classification>
        <further-classification edition="200601120260311B">G01S13/86</further-classification>
        <further-classification edition="201901120260311B">G06F1/3206</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索門　梅荷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOMAN, MEHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤迪言</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TENG, DIYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特里維迪　尼薩格凱尤爾巴伊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRIVEDI, NISARG KEYURBHAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一些實施方案中，一種感測裝置可藉由使用該感測裝置的一個或多個非超音波感測器執行一目標之一非超音波感測來執行存在偵測。此外，該感測裝置可根據一預定準則，基於該非超音波感測之一結果而判定該目標是否在該感測裝置之一或多個超音波感測器之一第一視場(FOV)內。該感測裝置亦可基於該目標是否在該第一FOV內之該判定而使用該一或多個超音波感測器執行該目標之一超音波感測。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In some implementations, a sensing device may perform presence detection by performing a non-ultrasound sensing of a target using one or more non-ultrasound sensors of the sensing device. In addition, the sensing device may determine whether the target is within a first field of view (FOV) of one or more ultrasound sensors of the sensing device based on a result of the non-ultrasound sensing, according to a predetermined criterion. The sensing device also may perform an ultrasound sensing for the target using the one or more ultrasound sensors based on the determination of whether the target is within the first FOV.</p>
      </isu-abst>
      <representative-img>
        <p type="p">900:存在偵測</p>
        <p type="p">910:方塊</p>
        <p type="p">920:方塊</p>
        <p type="p">930:方塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1226" publication-number="202624000">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624000</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131448</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬化樹脂層</chinese-title>
        <english-title>CURABLE RESIN LAYER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">B32B7/12</main-classification>
        <further-classification edition="200601120260313B">C09J4/02</further-classification>
        <further-classification edition="200601120260313B">C08L33/04</further-classification>
        <further-classification edition="200601120260313B">G02F1/1333</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商迪睿合股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEXERIALS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, TSUKASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARA, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明即便於使用同一成分之樹脂組合物作為障壁材料與填充材料之情形時，亦兼顧障壁材料之高黏度性與填充材料之低黏度性，使構件彼此之密接性良好。  &lt;br/&gt;本製造方法具有：步驟(A)，其係於第1構件之表面使用第1樹脂組合物形成第2樹脂組合物8之塗佈區域7；步驟(B)，其係於塗佈區域7塗佈第2樹脂組合物8；步驟(C)，其係將第1構件與第2構件經由第2樹脂組合物8貼合，使第2樹脂組合物8填充於塗佈區域7；及步驟(D)，其係對第2樹脂組合物8照射光而形成硬化樹脂層1。步驟(C)包括將第2樹脂組合物8進行加熱。第2樹脂組合物8含有於60℃下加熱30分鐘後之加熱殘分為95.0%以上之單官能單體。第2樹脂組合物8於80℃下加熱3小時後之加熱殘分為95.0%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:硬化樹脂層</p>
        <p type="p">2:圖像顯示構件</p>
        <p type="p">3:透光性構件</p>
        <p type="p">4:遮光層</p>
        <p type="p">5:圖像顯示裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1227" publication-number="202624636">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624636</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131449</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於自行車前叉及其他自行車組件之空氣彈簧</chinese-title>
        <english-title>AIR SPRINGS FOR BICYCLE FRONT FORKS AND OTHER BICYCLE COMPONENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">F16F9/02</main-classification>
        <further-classification edition="200601120260306B">F16F9/32</further-classification>
        <further-classification edition="200601120260306B">F16F9/36</further-classification>
        <further-classification edition="200601120260306B">F16F9/38</further-classification>
        <further-classification edition="200601120260306B">F16F9/44</further-classification>
        <further-classification edition="200601120260306B">B62K25/08</further-classification>
        <further-classification edition="200601120260306B">B62K25/04</further-classification>
        <further-classification edition="200601120260306B">B62J1/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商速聯有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SRAM, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅森伯里　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROSENBERRY, ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林奇　提摩西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LYNCH, TIMOTHY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文敘述用於自行車前叉及其他自行車組件之範例空氣彈簧。一種範例空氣彈簧包括：一管體，其具有一第一端及一第二端；一帽蓋，其在該第一端處或附近耦接於該管體；一密封頭，其在該管體中接近該第二端；一間隔體，其在該管體中，安置在該密封頭與該第二端之間；一第一扣持元件，其耦接於該管體之一內表面且由該間隔體之一端接合以防止該間隔體軸向地移出該管體之該第二端；以及一第二扣持元件，其耦接於該管體之該內表面。比起該第一扣持元件，該第二扣持元件係與該第二端間隔開更遠。該第二扣持元件具有比該密封頭之一最外直徑小的一內徑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Example air springs for bicycle front forks and other bicycles components are described herein. An example air spring includes a tube having a first end and a second end, a cap coupled to the tube at or near the first end, a sealhead in the tube near the second end such, a spacer in the tube, the spacer disposed between the sealhead and the second end, a first retaining element coupled to an inner surface of the tube and engaged by an end of the spacer to prevent the spacer from moving axially out of the second end of the tube, and a second retaining element coupled to the inner surface of the tube. The second retaining element is spaced further from the second end than the first retaining element. The second retaining element has an inner diameter that is less than an outer-most diameter of the sealhead.</p>
      </isu-abst>
      <representative-img>
        <p type="p">204:冠部</p>
        <p type="p">206:第一腳，腳</p>
        <p type="p">210:第一上管，上管，管體</p>
        <p type="p">214:第一下管，下管，管體</p>
        <p type="p">400:第一端</p>
        <p type="p">402:第二端</p>
        <p type="p">404:開口</p>
        <p type="p">406:帽蓋</p>
        <p type="p">408:第一端</p>
        <p type="p">410:第二端</p>
        <p type="p">412:中心軸線</p>
        <p type="p">414:空氣彈簧</p>
        <p type="p">416:密封壓力腔室</p>
        <p type="p">418:密封頭</p>
        <p type="p">420:間隔體</p>
        <p type="p">422:閥件</p>
        <p type="p">424:活塞</p>
        <p type="p">426:桿棒</p>
        <p type="p">427:裝設件，緩衝件</p>
        <p type="p">428:活塞密封件</p>
        <p type="p">430:內表面</p>
        <p type="p">432:正空氣腔室，第一腔室</p>
        <p type="p">434:負空氣腔室，第二腔室</p>
        <p type="p">436:達底墊</p>
        <p type="p">438:內部區</p>
        <p type="p">440:刮刷密封件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1228" publication-number="202624069">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624069</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131450</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於自行車之包括能量儲存裝置的系統</chinese-title>
        <english-title>SYSTEM FOR A BICYCLE INCLUDING AN ENERGY STORAGE DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260306B">B62J43/30</main-classification>
        <further-classification edition="202001120260306B">B62J43/28</further-classification>
        <further-classification edition="202001120260306B">B62J43/13</further-classification>
        <further-classification edition="202001120260306B">B62J43/20</further-classification>
        <further-classification edition="202001120260306B">B62J50/22</further-classification>
        <further-classification edition="202001120260306B">B62J6/24</further-classification>
        <further-classification edition="200601120260306B">B60L1/02</further-classification>
        <further-classification edition="200601120260306B">B60L15/20</further-classification>
        <further-classification edition="201901120260306B">B60L3/00</further-classification>
        <further-classification edition="201901120260306B">B60L50/20</further-classification>
        <further-classification edition="201901120260306B">B60L50/64</further-classification>
        <further-classification edition="201901120260306B">B60L53/16</further-classification>
        <further-classification edition="201901120260306B">B60L58/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商速聯有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SRAM, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓恩　賽吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAHN, SAGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塞申斯　謝爾比</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SESSIONS, SHELBY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何　幹毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, ALEXANDER KON-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪特瑪　卡拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DITMAR, CARA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於一電動自行車之系統包括一能量儲存裝置。該能量儲存裝置包括：一殼體，其可裝設至該電動自行車之一車架；電池胞元，其等安置在該殼體內；以及輸出電力端子，其等由該殼體支撐且可電氣連接至該等電池胞元。該能量儲存裝置包括一處理器及一第一無線通訊裝置。該系統包括一人/機介面(HMI)，其經由該等輸出電力端子來電氣連接至該能量儲存裝置。該HMI包括一第二無線通訊裝置。該處理器組配來基於由該第一無線通訊裝置從該第二無線通訊裝置所接收的一信號來改變該能量儲存裝置之一模式。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system for an electric bicycle includes an energy storage device. The energy storage device includes a housing that is mountable to a frame of the electric bicycle, battery cells disposed within the housing, and output power terminals supported by the housing and electrically connectable to the battery cells. The energy storage device includes a processor and a first wireless communication device. The system includes a human/machine interface (HMI) electrically connected to the energy storage device via the output power terminals. The HMI includes a second wireless communication device. The processor is configured to change a mode of the energy storage device based on a signal received by the first wireless communication device from the second wireless communication device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:自行車系統</p>
        <p type="p">302:能量儲存裝置，電池組</p>
        <p type="p">304:驅動單元</p>
        <p type="p">306:HMI</p>
        <p type="p">308:電源供應器</p>
        <p type="p">310:處理器</p>
        <p type="p">312:無線通訊裝置，無線電</p>
        <p type="p">314:感測器</p>
        <p type="p">314a:安裝感測器</p>
        <p type="p">314b:移動感測器</p>
        <p type="p">316:使用者介面</p>
        <p type="p">318:無線通訊系統</p>
        <p type="p">320:電氣通訊裝置，介面</p>
        <p type="p">322:無線通訊裝置，無線電</p>
        <p type="p">324:處理器</p>
        <p type="p">326:馬達</p>
        <p type="p">328:感測器</p>
        <p type="p">328a:扭矩感測器</p>
        <p type="p">328b:驅動單元感測器</p>
        <p type="p">329:使用者介面</p>
        <p type="p">330:電氣通訊裝置，介面</p>
        <p type="p">332:無線通訊裝置，無線電</p>
        <p type="p">334:處理器</p>
        <p type="p">336:使用者介面</p>
        <p type="p">337:殼體</p>
        <p type="p">338:有線電力系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1229" publication-number="202623758">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623758</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131493</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>關於膀胱內視鏡影像之程式及系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">A61B1/307</main-classification>
        <further-classification edition="200601120260303B">A61B1/00</further-classification>
        <further-classification edition="201701120260303B">G06T7/00</further-classification>
        <further-classification edition="201801120260303B">G16H30/20</further-classification>
        <further-classification edition="201801120260303B">G16H50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商朋股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上田朋宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEDA, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明由一種程式所構成，該程式用於使電腦作為如下手段發揮功能：檢測膀胱內視鏡影像中之新生血管之手段；計算所檢測到之新生血管於影像中之比率或量之手段；及輸出上述比率或量之手段。又，本發明由一種裝置或系統所構成，該裝置具備儲存程式之記憶體、及執行上述程式之處理器，且藉由執行程式，而使上述處理器作為如下手段發揮功能：檢測膀胱內視鏡影像中之膀胱表層之新生血管之手段；計算所檢測到之新生血管於膀胱內視鏡影像中之比率或量之手段；及輸出上述比率或量之手段。無論被診斷/未被診斷為疾病，本發明均能將患者之膀胱狀態客觀化，並實現視覺化、定量化及/或規格化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:步驟</p>
        <p type="p">S2:步驟</p>
        <p type="p">S3:步驟</p>
        <p type="p">S4:步驟</p>
        <p type="p">S5:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1230" publication-number="202624212">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624212</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131497</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雜環衍生物</chinese-title>
        <english-title>HETEROCYCLIC DERIVATIVE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">C07D231/20</main-classification>
        <further-classification edition="200601120260303B">C07D231/56</further-classification>
        <further-classification edition="200601120260303B">C07D403/06</further-classification>
        <further-classification edition="200601120260303B">C07D471/04</further-classification>
        <further-classification edition="200601120260303B">A61K31/4196</further-classification>
        <further-classification edition="200601120260303B">A61K31/437</further-classification>
        <further-classification edition="200601120260303B">A61K31/4152</further-classification>
        <further-classification edition="200601120260303B">A61K31/416</further-classification>
        <further-classification edition="200601120260303B">A61P31/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商塩野義製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIONOGI &amp; CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>増田眞大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASUDA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芝山啓允</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBAYAMA, HIROMITSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上野達彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UENO, TATSUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種作為抗病毒劑有用之以低用量顯示出較強之藥效且能夠安全地使用之具有反轉錄酶抑制活性之新穎化合物。  &lt;br/&gt;本發明提供一種式(II)所表示之化合物。  &lt;br/&gt;本發明係一種式(II)所表示之化合物、或其製藥上可容許之鹽：  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="157px" width="230px" file="ed10025.JPG" alt="ed10025.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式中，  &lt;br/&gt;R&lt;sup&gt;1a&lt;/sup&gt;為氫等；R&lt;sup&gt;1b&lt;/sup&gt;為鹵素等；R&lt;sup&gt;1c&lt;/sup&gt;為鹵素等；R&lt;sup&gt;2&lt;/sup&gt;為鹵素等，R&lt;sup&gt;3&lt;/sup&gt;為氫等，或R&lt;sup&gt;2&lt;/sup&gt;及R&lt;sup&gt;3&lt;/sup&gt;與相鄰之碳原子一起形成可經R&lt;sup&gt;C&lt;/sup&gt;取代之苯環等，  &lt;br/&gt;R&lt;sup&gt;C&lt;/sup&gt;為選自由鹵素及氰基所組成之群中之1種以上之基；  &lt;br/&gt;Z為  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="124px" width="310px" file="ed10026.JPG" alt="ed10026.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;或&lt;img align="absmiddle" height="104px" width="137px" file="ed10027.JPG" alt="ed10027.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式中，星號(*)表示Z與亞甲基之鍵結點；  &lt;br/&gt;R&lt;sup&gt;6&lt;/sup&gt;為-S(=O)&lt;sub&gt;2&lt;/sub&gt;NH&lt;sub&gt;2&lt;/sub&gt;；  &lt;br/&gt;R&lt;sup&gt;8&lt;/sup&gt;為氫等；  &lt;br/&gt;R&lt;sup&gt;9&lt;/sup&gt;為鹵素；  &lt;br/&gt;R&lt;sup&gt;10&lt;/sup&gt;為-S(=O)&lt;sub&gt;2&lt;/sub&gt;-NH&lt;sub&gt;2&lt;/sub&gt;))。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a novel compound having reverse transcriptase inhibitory activity, which is useful as an antiviral agent, exhibits strong drug efficacy at a low dose, and can be safely used. &lt;br/&gt;The present invention provides a compound of Formula (II): &lt;br/&gt;&lt;img align="absmiddle" height="128px" width="220px" file="ed10028.JPG" alt="ed10028.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;wherein &lt;br/&gt;R&lt;sup&gt;1a&lt;/sup&gt; is hydrogen or the like; R&lt;sup&gt;1b&lt;/sup&gt; is halogen or the like; R&lt;sup&gt;1c&lt;/sup&gt; is halogen or the like; R&lt;sup&gt;2&lt;/sup&gt; is halogen or the like; R&lt;sup&gt;3&lt;/sup&gt; is hydrogen or the like; or R&lt;sup&gt;2&lt;/sup&gt; and R&lt;sup&gt;3&lt;/sup&gt; forms, together with adjacent carbon atoms, a benzene ring optionally substituted with R&lt;sup&gt;C&lt;/sup&gt; or the like, R&lt;sup&gt;C&lt;/sup&gt; is at least one group selected from the group consisting of halogen and cyano; &lt;br/&gt;Z is &lt;br/&gt;&lt;img align="absmiddle" height="111px" width="307px" file="ed10029.JPG" alt="ed10029.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;or&lt;img align="absmiddle" height="88px" width="132px" file="ed10030.JPG" alt="ed10030.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;wherein asterisk(*) represents a bonding site between Z and methylene; and R&lt;sup&gt;6&lt;/sup&gt; is -S(=O)&lt;sub&gt;2&lt;/sub&gt;NH&lt;sub&gt;2&lt;/sub&gt;; R&lt;sup&gt;8&lt;/sup&gt; is hydrogen or the like; R&lt;sup&gt;9&lt;/sup&gt; is halogen; and R&lt;sup&gt;10&lt;/sup&gt; is -S(=O)&lt;sub&gt;2&lt;/sub&gt;-NH&lt;sub&gt;2&lt;/sub&gt;, &lt;br/&gt;or a pharmaceutically acceptable salt thereof.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1231" publication-number="202624762">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624762</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131499</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>細節距探針屏蔽</chinese-title>
        <english-title>FINE-PITCH PROBING SHIELD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">G01R1/073</main-classification>
        <further-classification edition="200601120260309B">G01R3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商萬國商業機器公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERNATIONAL BUSINESS MACHINES CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>提漢　尚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEEHAN, SEAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李凡　西奧多　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEVIN, THEODORE M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮賈瑞　魯圖拉吉　南德庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PUJARI, RUTURAJ NANDKUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈薩夕拉　亞瑟　羅伊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GASASIRA, ARTHUR ROY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧堤　大衛　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUDETTE, DAVID MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華格納　葛蘭特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAGNER, GRANT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>強森　馬克　克里斯托福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOHNSON, MARK CHRISTOPHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章典</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊名宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種探針總成，且該探針總成包括：一探針卡；一中介層主體，其安置於該探針卡之一表面上；探針銷，其以一分組配置且自該中介層主體延伸遠離該探針卡，各探針銷包括一細長元件及在該細長元件之一遠端處之一尖端；一模具，其可支撐於該中介層主體上以配合於該等探針銷之該分組周圍；及非導電彈性材料，其引入至由該模具界定之一內部區中且在該內部區內固化以包圍各探針銷之至少該細長元件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A probe assembly is provided and includes a probe card, an interposer body disposed on a surface of the probe card, probe pins arranged in a grouping and extending from the interposer body away from the probe card, each probe pin including an elongate element and a tip at a distal end of the elongate element, a mold supportable on the interposer body to fit around the grouping of the probe pins and non-conductive elastic material introduced into and cured within an interior region defined by the mold to surround at least the elongate element of each probe pin.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:探針總成</p>
        <p type="p">110:探針卡</p>
        <p type="p">111:表面</p>
        <p type="p">120:中介層主體</p>
        <p type="p">121:第一導引主體</p>
        <p type="p">122:第二導引主體</p>
        <p type="p">140:探針銷</p>
        <p type="p">141:細長元件</p>
        <p type="p">142:尖端</p>
        <p type="p">1211:表面</p>
        <p type="p">1221:表面</p>
        <p type="p">1401:分組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1232" publication-number="202625376">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625376</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131500</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>提升基於斜坡之類比至數位轉換器之精確度</chinese-title>
        <english-title>INCREASING PRECISION OF A RAMP-BASED ANALOG-TO-DIGITAL CONVERTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">H03M1/06</main-classification>
        <further-classification edition="200601120260304B">G06F7/544</further-classification>
        <further-classification edition="200601120260304B">G06N3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商萬國商業機器公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERNATIONAL BUSINESS MACHINES CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>那雷亞奈　佩里堤須</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NARAYANAN, PRITISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛格　阿布海拉吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGH, ABHAIRAJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章典</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊名宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種系統，其包括一類比至數位轉換器(ADC)、一電流源以及一控制器。該ADC包括具有一第一輸入及一第二輸入之一比較器，且該電流源包括一運算跨導放大器。該控制器經組態以運用一第一組電導對該運算跨導放大器進行組態；且使用該電流源以在該第一輸入處設定一DC電壓。該控制器經進一步組態以運用一第二組電導對該放大器進行重新組態；且啟用該比較器並使用該電流源以在該第二輸入處產生一電壓斜坡。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system includes an analog-to-digital converter (ADC), a current source, and a controller. The ADC includes a comparator having a first input and a second input, and the current source includes an operational transconductance amplifier. The controller is configured to configure the operational transconductance amplifier with a first set of conductances; and use the current source to set a DC voltage at the first input. The controller is further configured to reconfigure the amplifier with a second set of conductances; and enable the comparator and use the current source to create a voltage ramp at the second input.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電路</p>
        <p type="p">110:MAC單元</p>
        <p type="p">112:非揮發性記憶體單元</p>
        <p type="p">114:共同節點</p>
        <p type="p">116:啟動FET</p>
        <p type="p">120:基於斜坡之ADC</p>
        <p type="p">122:比較器</p>
        <p type="p">124:第一積分器</p>
        <p type="p">125:程式化電路</p>
        <p type="p">126:第二積分器</p>
        <p type="p">130:電流源</p>
        <p type="p">132:運算跨導放大器(OTA)</p>
        <p type="p">134:FET</p>
        <p type="p">136:電流鏡</p>
        <p type="p">140:時間至數位轉換器</p>
        <p type="p">142:振盪器</p>
        <p type="p">144:數位計數器</p>
        <p type="p">146:相位提取電路</p>
        <p type="p">150:第一開關</p>
        <p type="p">152:第二開關</p>
        <p type="p">154:FET</p>
        <p type="p">160:控制器</p>
        <p type="p">G&lt;sub&gt;i&lt;/sub&gt;:記憶體單元之第一子集</p>
        <p type="p">G&lt;sub&gt;r&lt;/sub&gt;:記憶體單元之第二子集</p>
        <p type="p">I(t):電流</p>
        <p type="p">V&lt;sub&gt;in&lt;/sub&gt;:第一輸入</p>
        <p type="p">V&lt;sub&gt;OTA&lt;/sub&gt;:電壓</p>
        <p type="p">V&lt;sub&gt;ref&lt;/sub&gt;:第二輸入</p>
        <p type="p">V&lt;sub&gt;READ&lt;/sub&gt;:恆定電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1233" publication-number="202624837">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624837</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131514</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>將多個部分光束聚焦在樣品內多個穿透深度的物鏡與方法</chinese-title>
        <english-title>OBJECTIVE AND METHOD FOR FOCUSING MULTIPLE PARTIAL BEAMS AT MULTIPLE PENETRATION DEPTHS WITHIN A SAMPLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">G02B27/10</main-classification>
        <further-classification edition="200601120260304B">G02B27/09</further-classification>
        <further-classification edition="200601120260304B">G02B13/00</further-classification>
        <further-classification edition="201201120260304B">G03F1/72</further-classification>
        <further-classification edition="200601120260304B">B23K26/067</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商卡爾蔡司ＳＭＳ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARL ZEISS SMS LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西賽博格　馬克斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEESSELBERG, MARKUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾波　亞歷安卓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EPPLE, ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史托克　喬哈尼斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STOCK, JOHANNES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種物鏡，其用於將入射到物鏡上的一光束的其中至少兩個部分光束聚焦在一像空間內的至少一預定深度處，該物鏡包含：(a) 具有至少一光學元件的一聚焦單元；(b) 至少一組合式分束和像差補償單元，其組態用於將進入物鏡的光束分成至少兩個部分光束，並預先補償聚焦單元的至少一光學元件的至少一像差；以及(c) 其中至少一光學元件係組態用於將離開組合式分束和像差補償單元的至少兩個部分光束聚焦在像空間內的至少一預定深度處。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application relates to an objective for focusing at least two partial beams of a light beam incident on the objective at at least one predetermined depth within an image space, comprising: (a) a focusing unit having at least one optical element; (b) at least one combined beam-splitting and aberration-compensating unit configured to split the light beam entering the objective into at least two partial beams and compensate at least one aberration of the at least one optical element of the focusing unit in advance; and (c) wherein the at least one optical element is configured to focus the at least two partial beams, which are leaving the combined beam-splitting and aberration-compensating unit, at the at least one predetermined depth within the image space.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:物鏡</p>
        <p type="p">202:示意圖</p>
        <p type="p">210:聚焦單元</p>
        <p type="p">213:透鏡</p>
        <p type="p">216:透鏡</p>
        <p type="p">219:透鏡</p>
        <p type="p">220:分束與像差補償單元/DOE</p>
        <p type="p">230:光瞳</p>
        <p type="p">235:直徑</p>
        <p type="p">240:光束</p>
        <p type="p">245:直徑</p>
        <p type="p">250:光軸</p>
        <p type="p">260:部分光束</p>
        <p type="p">265:部分光束</p>
        <p type="p">270:像空間</p>
        <p type="p">275:卡盤</p>
        <p type="p">280:樣品</p>
        <p type="p">285:工作距離</p>
        <p type="p">290:焦點</p>
        <p type="p">295:焦點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1234" publication-number="202623942">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623942</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131528</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>工具機的工具交換裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">B23Q3/157</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>五十部學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISOBE, GAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種工具機10的工具交換裝置，具備工具存放部35，前述工具存放部35對工具匣30被軸支撐成可進行旋動動作，並且可存放工具，前述工具機10的工具交換裝置具備動作組件，在從沿著工具存放部35的旋動中心軸J7的方向觀看的情況下，在工具存放部35與工具把持部26之間移交工具200時，前述動作組件使工具把持部26進行旋動動作，以使保持突起29c的頂點29d配置於凹部投影直線201Y上，前述凹部投影直線201Y是將在工具存放部35中存放有工具200之狀態下的工具200的凹部201朝沿著工具存放部35的旋動中心軸J7的方向投影的直線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">26:工具把持部</p>
        <p type="p">28:臂部</p>
        <p type="p">29:夾頭部</p>
        <p type="p">29d:頂點</p>
        <p type="p">29Y:凸部投影直線</p>
        <p type="p">35:工具存放部</p>
        <p type="p">200:工具</p>
        <p type="p">201Y:凹部投影直線</p>
        <p type="p">J4:工具中心軸</p>
        <p type="p">J8:存放中心軸</p>
        <p type="p">+X:+X側</p>
        <p type="p">-X:-X側</p>
        <p type="p">+Z:+Z側</p>
        <p type="p">-Z:-Z側</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1235" publication-number="202624448">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624448</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131533</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>漿料、複數液型漿料及研磨方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">C09K3/14</main-classification>
        <further-classification edition="200601120260303B">C09G1/02</further-classification>
        <further-classification edition="202601120260303B">H10P52/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小西友理惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONISHI, YURIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿久津利明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKUTSU, TOSHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安徳七海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANTOKU, NANAMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種漿料，其含有：包含鈰系粒子之磨粒；及選自由糖醇、糖類及不具有芳香環之聚伸烷基二醇化合物組成的組中之至少一種化合物A。一種複數液型漿料，其構成成分至少分為第1液及第2液而保存，前述第1液含有前述磨粒，前述第2液含有前述化合物A。一種研磨方法，其包括使用前述漿料對被研磨構件進行研磨之步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">
        </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1236" publication-number="202624227">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624227</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131534</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多環類衍生物抑制劑及其抗體偶聯物</chinese-title>
        <english-title>POLYCYCLIC DERIVATIVE INHIBITORS AND THEIR ANTIBODY CONJUGATES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">C07D471/04</main-classification>
        <further-classification edition="200601120260303B">C07D405/12</further-classification>
        <further-classification edition="200601120260303B">C07D409/12</further-classification>
        <further-classification edition="200601120260303B">C07D403/12</further-classification>
        <further-classification edition="200601120260303B">C07D417/12</further-classification>
        <further-classification edition="200601120260303B">C07D487/04</further-classification>
        <further-classification edition="200601120260303B">C07D491/147</further-classification>
        <further-classification edition="200601120260303B">C07D519/00</further-classification>
        <further-classification edition="201701120260303B">A61K47/68</further-classification>
        <further-classification edition="200601120260303B">A61P35/00</further-classification>
        <further-classification edition="200601120260303B">A61P37/00</further-classification>
        <further-classification edition="200601120260303B">A61P31/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商西雅圖免疫公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SYSTIMMUNE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬維李</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAN, WEILI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱貴莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, GUILI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛芳琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XUE, FANGLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請案係關於一種多環類衍生物抑制劑及其抗體偶聯物，並且在一個實施例中，提供了一種由式I表示的化合物，或其立體異構物、前藥、晶形、醫藥上可接受的鹽、醫藥上可接受的溶劑化物或醫藥上可接受的酯，以及一種其中包含該化合物的連接子-藥物偶聯物或抗體-藥物偶聯物。  &lt;br/&gt;&lt;img align="absmiddle" height="229px" width="163px" file="ed11001.JPG" alt="ed11001.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The application relates to a polycyclic derivative inhibitor and its antibody conjugate, and in one embodiment, provides a compound represented by formula I, or a stereoisomer, a prodrug, a crystal form, a pharmaceutically acceptable salt, a pharmaceutically acceptable solvate or a pharmaceutically acceptable ester thereof, and a linker-drug conjugate or an antibody-drug conjugate comprising the compound therein. &lt;br/&gt;&lt;img align="absmiddle" height="225px" width="172px" file="ed11002.JPG" alt="ed11002.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1237" publication-number="202623735">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623735</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131550</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>嬰兒照護裝置及藉由嬰兒照護裝置用於嬰兒照護的方法</chinese-title>
        <english-title>INFANT CARE APPARATUS AND METHOD FOR INFANT CARE WITH AN INFANT CARE APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">A47D9/02</main-classification>
        <further-classification edition="200601120260313B">A47D13/10</further-classification>
        <further-classification edition="200601120260313B">A47C1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商索利工業公司（亦以４ｍｏｍｓ名稱營業）</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THORLEY INDUSTRIES, LLC (DBA 4MOMS)</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱尼維奇　理查</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUCHNIEWICZ, RICHARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種嬰兒照護裝置包括嬰兒托架、驅動部、生物辨識感測器、以及控制器。驅動部被耦接到嬰兒托架，且具有馬達，其配置來產生嬰兒托架的行動和動作中的一者或多者。生物辨識感測器配置來觀察嬰兒托架中的嬰兒的至少一個特性。控制器配置為運用類神經網路或狀態機，其被可通信地耦接到生物辨識感測器及驅動部，其中，控制器登記來自生物辨識感測器的感測器數據，並透過類神經網路或狀態機造成嬰兒托架的行動和動作中的一者或多者的變化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An infant care apparatus includes an infant holder, a drive section, a biometric sensor, and a controller. The drive section is coupled to the infant holder and has a motor configured to generate one or more of an action and a motion of the infant holder. The biometric sensor is configured to observe at least one characteristic of an infant within the infant holder. The controller is configured to employ a neural network or state machine that is communicably coupled to the biometric sensor and the drive section, where the controller registers sensor data from the biometric sensor and effects, through the neural network or the state machine, a change in the one or more of the action and the motion of the infant holder.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:嬰兒照護裝置</p>
        <p type="p">2:嬰兒支撐件</p>
        <p type="p">3:基座</p>
        <p type="p">4:底支撐殼體</p>
        <p type="p">5:頂外殼</p>
        <p type="p">5A:表面</p>
        <p type="p">6:嬰兒床</p>
        <p type="p">9:腿</p>
        <p type="p">9A:腳</p>
        <p type="p">18:儲物籃</p>
        <p type="p">20:底面板</p>
        <p type="p">21:(連續)側壁</p>
        <p type="p">22:頂邊緣</p>
        <p type="p">23:封閉空間</p>
        <p type="p">50:控制系統</p>
        <p type="p">51:控制器</p>
        <p type="p">52:控制面板</p>
        <p type="p">53:顯示器</p>
        <p type="p">54:控制開關</p>
        <p type="p">55:可攜式音樂播放器底座</p>
        <p type="p">56:喇叭</p>
        <p type="p">57:輸入插孔</p>
        <p type="p">353A:標記</p>
        <p type="p">390:嬰兒</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1238" publication-number="202623951">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623951</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131559</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>修正研磨墊之形狀之方法、及經使用該方法研磨之工件</chinese-title>
        <english-title>METHOD FOR ADJUSTING SHAPE OF POLISHING PAD AND WORKPIECE POLISHED BY THE METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260310B">B24B37/08</main-classification>
        <further-classification edition="201201120260310B">B24B37/12</further-classification>
        <further-classification edition="200601120260310B">B24B53/00</further-classification>
        <further-classification edition="200601120260310B">C03C19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＡＧＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢川啓介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAGAWA, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, RYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楠下颯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUSUSHITA, HAYATE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布施歩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUSE, AYUMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠在不太降低工件之研磨處理效率之情況下，藉由修整處理適當地修正研磨墊之形狀的方法。本發明之方法係對藉由具備上壓盤(120)及下壓盤(130)之雙面研磨裝置研磨工件時所使用之研磨墊之形狀進行修正，且包含如下步驟：(1)在利用研磨墊研磨工件之過程中，從設置於雙面研磨裝置之複數個感測器獲取感測器資訊，該感測器資訊包括上壓盤(120)與下壓盤(130)之間之距離資訊及研磨墊之溫度資訊中之至少一者；(2)根據感測器資訊決定研磨墊之修整條件；以及(3)使用決定之修整條件，藉由修整器來調整研磨墊之形狀。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S110~S130:工序</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1239" publication-number="202625437">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625437</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131595</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有切片資訊的影像資料控制儲存單元</chinese-title>
        <english-title>IMAGE DATA CONTROL STORAGE UNIT WITH SLICE INFORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260304B">H04N19/174</main-classification>
        <further-classification edition="201401120260304B">H04N19/423</further-classification>
        <further-classification edition="201401120260304B">H04N19/70</further-classification>
        <further-classification edition="201401120260304B">H04N19/96</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金允貞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YOONJUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金宇英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, WOO YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權鎮模</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, JINMO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李東圭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DONG-KYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種裝置包括一第一記憶體，該第一記憶體經組態以包括與一影像框相關聯的一控制儲存單元。該裝置亦包括一處理器，該處理器經組態以接收表示該影像框中之多個圖塊的一位元串流。該多個圖塊之各者包括寫碼單元之複數個圖塊列。該處理器亦經組態以針對該多個圖塊之一圖塊之一圖塊列產生該控制儲存單元之一控制項。該控制項包括圖塊列資訊，該圖塊列資訊指示包括該圖塊列中之至少一部分的一切片之一切片識別符。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device includes a first memory configured to include a control storage unit associated with an image frame. The device also includes a processor configured to receive a bitstream representing multiple tiles of the image frame. Each of the multiple tiles includes a plurality of tile rows of coding units. The processor is also configured to, for a tile row of a tile of the multiple tiles, generate a control entry of the control storage unit. The control entry includes tile row information that indicates a slice identifier of a slice that includes at least a portion of the tile row.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">102:裝置</p>
        <p type="p">104:位元串流源</p>
        <p type="p">105:位元串流</p>
        <p type="p">108:實例</p>
        <p type="p">114:顯示裝置</p>
        <p type="p">116:使用者</p>
        <p type="p">120:影像框</p>
        <p type="p">122A~122D:實例</p>
        <p type="p">124A~124D:切片</p>
        <p type="p">126:圖塊列</p>
        <p type="p">126AA~126AB:圖塊列</p>
        <p type="p">126BA~126BB:圖塊列</p>
        <p type="p">126CA~126CB:圖塊列</p>
        <p type="p">126DA~126DB:圖塊列</p>
        <p type="p">138:熵解碼器</p>
        <p type="p">140:像素處理器</p>
        <p type="p">142:晶片上記憶體</p>
        <p type="p">144:晶片外記憶體</p>
        <p type="p">146:寫碼樹單元列光柵模式</p>
        <p type="p">150:控制儲存單元</p>
        <p type="p">152:控制項</p>
        <p type="p">162:圖塊列標頭位置資料</p>
        <p type="p">164:圖塊列係數位置資料</p>
        <p type="p">176:切片識別符</p>
        <p type="p">178:圖塊識別符</p>
        <p type="p">184:圖塊列係數資訊</p>
        <p type="p">186:切片資訊</p>
        <p type="p">190:處理器</p>
        <p type="p">192:影像處理引擎</p>
        <p type="p">196:切片標頭資料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1240" publication-number="202624572">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624572</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131609</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用誘導階躍變化以特徵化及校正熱區之熱性質之拉錠器及錠生長方法</chinese-title>
        <english-title>INGOT PULLERS AND INGOT GROWTH METHODS UTILIZING INDUCED STEP CHANGE TO CHARACTERIZE AND CALIBRATE THERMAL PROPERTIES OF HOT ZONES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">C30B15/22</main-classification>
        <further-classification edition="200601120260313B">C30B35/00</further-classification>
        <further-classification edition="200601120260313B">C30B29/06</further-classification>
        <further-classification edition="202601120260313B">H10P14/20</further-classification>
        <further-classification edition="202001320260313B">G06F119/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>環球晶圓股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLOBALWAFERS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸　徵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, ZHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴哈格維特　桑米特　Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHAGAVAT, SUMEET S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉恩　泰波斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAIN, TAPAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪榮宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於生長單晶錠之拉錠器設備及相關方法，其利用一紅外線(IR)高溫計監測關注的熱區組件之表面溫度，同時將階躍變化有意引入至氣體流量及爐壓力。熱模擬可與氣體流動能力一起用於模擬該氣體流量及爐壓力之該等階躍變化以獲得由經誘導階躍變化引起之模擬溫度升高或下降。一模擬技術可用於準確反算一丘克拉斯基晶體生長爐之實際熱場中之該關注的熱區組件之熱導率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Ingot puller apparatus and related methods for growing single crystal ingots utilize an infrared (IR) pyrometer to monitor surface temperatures of hot zone components of interest, while intentionally introducing step changes to gas flow and furnace pressure. Thermal simulation may be used with gas flow capability to simulate the step changes in the gas flow and furnace pressure to obtain simulated temperature increase or decrease caused by the induced step change. A simulation technique may be used to accurately back-calculate the thermal conductivity of the hot zone component of interest in the real thermal field of a Czochralski crystal growth furnace.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1241" publication-number="202624257">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624257</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131611</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多鏈嵌合多肽及其用途</chinese-title>
        <english-title>MULTI-CHAIN CHIMERIC POLYPEPTIDES AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07K14/54</main-classification>
        <further-classification edition="200601120260302B">C07K14/705</further-classification>
        <further-classification edition="200601120260302B">C07K14/71</further-classification>
        <further-classification edition="200601120260302B">C07K16/18</further-classification>
        <further-classification edition="200601120260302B">C12N15/13</further-classification>
        <further-classification edition="200601120260302B">C12N15/63</further-classification>
        <further-classification edition="200601120260302B">A61K39/395</further-classification>
        <further-classification edition="202501120260302B">A61K40/11</further-classification>
        <further-classification edition="202501120260302B">A61K40/32</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
        <further-classification edition="200601120260302B">A61P31/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商ＨＣＷ生物公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HCW BIOLOGICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　慶祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, HING C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李允中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供多鏈嵌合多肽，其包括：(a)第一嵌合多肽，其包括第一目標結合域、可溶性T細胞受體β鏈恆定區(TRβC)域及親和域對之第一域；以及(b)第二嵌合多肽，其包括親和域對之第二域及第二目標結合域，其中該第一嵌合多肽及該第二嵌合多肽透過該親和域對之該第一域與該第二域的結合而締合。本文亦提供使用此等多鏈嵌合多肽的方法及編碼此等多鏈嵌合多肽之核酸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are multi-chain chimeric polypeptides that include: (a) a first chimeric polypeptide including a first target-binding domain a soluble T cell receptor β-chain constant region (TRβC) domain, and a first domain of a pair of affinity domains; and (b) a second chimeric polypeptide including a second domain of a pair of affinity domains and a second target-binding domain, where the first chimeric polypeptide and the second chimeric polypeptide associate through the binding of the first domain and the second domain of the pair of affinity domains. Also provided here are methods of using these multi-chain chimeric polypeptides and nucleic acids encoding these multi-chain chimeric polypeptides.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1242" publication-number="202624651">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624651</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131640</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>穩定細長海底元件</chinese-title>
        <english-title>STABILISING ELONGATE SUBSEA ELEMENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260310B">F16L1/12</main-classification>
        <further-classification edition="200601120260310B">H02G9/02</further-classification>
        <further-classification edition="200601120260310B">H02G1/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商海底七有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUBSEA 7 LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈姆丹　納烏拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMDAN, NAWRAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅伊　艾倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAY, ALLAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">諸如電纜之細長海底元件具有埋入海床中且易受在縱向方向上作用之拉出負荷影響的部分。埋入部分由呈縱向串聯形式之錨定區段之細長鉸接管包圍、鎧裝及穩定。鄰接錨定區段呈相互互鎖和可相對樞轉的關係。  &lt;br/&gt;各錨定區段包含具有平截頭體形狀之縱向漸縮本體。本體具有一或多個側面，該一或多個側面經暴露以接觸周圍土壤或岩石且相對於中心縱軸傾斜，以在拉出負荷之方向上與該軸會聚。由於本體之漸縮設計，側面之長度得以延長，進而增大了與周圍土壤或岩石的介面面積，這有利於其抵抗側向、上舉及拉出負荷之穩定性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An elongate subsea element such as a cable has a portion that is buried in the seabed and that is susceptible to a pull-out load acting in a longitudinal direction. The buried portion is surrounded, armoured and stabilised by an elongate articulated tube of anchor segments in a longitudinal series. Adjoining anchor segments are in mutually interlocking and relatively pivotable relation. &lt;br/&gt;Each anchor segment comprises a longitudinally-tapering body that has a frustum shape. The body has one or more side faces that are exposed to contact surrounding soil or rock and that are inclined relative to a central longitudinal axis to converge with that axis in the direction of the pull-out load. By virtue of the taper of the body, the length of the side face and hence the interface area with the surrounding soil or rock is increased to the benefit of stability against lateral, uplift and pull-out loads.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:保護系統</p>
        <p type="p">12:電纜</p>
        <p type="p">14:風力發電機</p>
        <p type="p">16:海床</p>
        <p type="p">24:單樁</p>
        <p type="p">26:溝槽</p>
        <p type="p">28:彎曲加強器</p>
        <p type="p">30:孔口</p>
        <p type="p">32:基礎介面裝置</p>
        <p type="p">34:彎曲限制器</p>
        <p type="p">36:負浮力加重段</p>
        <p type="p">38:護堤</p>
        <p type="p">40:內懸浮部分</p>
        <p type="p">42:外懸浮部分</p>
        <p type="p">44:傾斜過渡段</p>
        <p type="p">46:鉸接式鎧裝導管或管</p>
        <p type="p">48:區段</p>
        <p type="p">50:錨定區段</p>
        <p type="p">52:縱向漸縮本體</p>
        <p type="p">54:外部面</p>
        <p type="p">56:中心縱軸</p>
        <p type="p">58:圓周脊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1243" publication-number="202625593">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625593</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131652</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D62/10</main-classification>
        <further-classification edition="202501120260302B">H10D64/20</further-classification>
        <further-classification edition="202601120260302B">H10D88/00</further-classification>
        <further-classification edition="200601120260302B">B82B1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋寅鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, INHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙槿彙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, KEUN HWI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭主護</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, JOOHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金東勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DONGHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴泰愚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UHM, TAEWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭銀國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, EUNGUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供半導體裝置，包括基板，基板包括具有第一導電類型的第一井以及具有與第一導電類型相反的第二導電類型的第二井；具有第一導電類型且設置在第一井上的第一雜質圖案；具有第二導電類型且設置在第二井上的第二雜質圖案；設置在基板的第一表面上的第一雜質圖案和第二雜質圖案之間的第一鈍化圖案；以及設置在與基板的第一表面相對的基板的第二表面上的第二鈍化圖案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a semiconductor device, including a substrate including a first well having a first conductivity type and a second well having a second conductivity type that is opposite the first conductivity type, a first impurity pattern having the first conductivity type disposed on the first well, a second impurity pattern having the second conductivity type disposed on the second well, a first passivation pattern disposed between the first impurity pattern and the second impurity pattern on a first surface of the substrate, and a second passivation pattern disposed on a second surface of the substrate opposite to the first surface of the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板</p>
        <p type="p">100_A:第一表面</p>
        <p type="p">100_B:第二表面</p>
        <p type="p">102:第一井/井</p>
        <p type="p">104:第二井/井</p>
        <p type="p">110:雜質圖案</p>
        <p type="p">112:第一雜質圖案/雜質圖案</p>
        <p type="p">114:第二雜質圖案/雜質圖案</p>
        <p type="p">120:第一層間絕緣膜</p>
        <p type="p">130:第一鈍化圖案/鈍化圖案</p>
        <p type="p">132:內部鈍化圖案</p>
        <p type="p">132_1:鈍化層</p>
        <p type="p">132_2:鈍化層</p>
        <p type="p">132_3:鈍化層</p>
        <p type="p">134:外部鈍化圖案</p>
        <p type="p">140:第二鈍化圖案/鈍化圖案</p>
        <p type="p">150:第二層間絕緣膜</p>
        <p type="p">OP1:第一部分</p>
        <p type="p">OP2:第二部分</p>
        <p type="p">OP3:第三部分</p>
        <p type="p">R1:區域</p>
        <p type="p">PL1:第一鈍化絕緣膜/鈍化絕緣膜</p>
        <p type="p">PL2:第二鈍化絕緣膜/鈍化絕緣膜</p>
        <p type="p">CA:接觸</p>
        <p type="p">CP:通道圖案</p>
        <p type="p">NS1、NS2、NS3:奈米片</p>
        <p type="p">IL1:第一絕緣圖案</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1244" publication-number="202623718">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623718</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131715</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有黏度穩定性的乳蛋白飲料</chinese-title>
        <english-title>MILK PROTEIN BEVERAGE WITH VISCOSITY STABILITY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260306B">A23L33/19</main-classification>
        <further-classification edition="200601120260306B">A23J3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商特亮食品營養有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRILLIANT FOOD AND NUTRITION LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福米奇　麥迪遜　Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOMICH, MADISON L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克爾布斯　蓋爾　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KERBS, GAYL M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝尼特斯　迭戈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BENITEZ, DIEGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧扎達利　費爾漢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OZADALI, FERHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索恩　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THON, BRIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建甫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種乳蛋白飲料，包含：乳蛋白；一或更多含多酚劑；以及一或更多鈣鍵結螯合劑化合物，其中乳蛋白飲料在跨越 2 至 30 °C 的溫度範圍具有小於 150 cP 的黏度差異。一種產生乳蛋白飲料的方法，方法包含：形成第一液體，包含水、一或更多含多酚劑、以及一或更多鈣鍵結螯合劑化合物；形成第二液體，包含乳濃縮液；結合第一液體與第二液體以形成第三液體；均質化第三液體；以及熱處理第三液體以形成乳蛋白飲料，熱處理包含 105 至 140 °C 的溫度。一種乳蛋白飲料，包含：乳蛋白；以及一或更多鈣鍵結螯合劑化合物，乳蛋白飲料在跨越溫度範圍具有小於 150 cP 的黏度差異。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A milk protein beverage, including: milk protein; one or more polyphenol-containing agent; and one or more calcium-binding chelator compound, wherein the milk protein beverage has a viscosity difference of less than 150 cP across a temperature range of 2 to 30 °C. A method of producing the milk protein beverage, the method including: forming a first liquid including water, one or more polyphenol-containing agent, and one or more calcium-binding chelator compound; forming a second liquid including a milk concentrate; combining the first liquid and the second liquid to form a third liquid; homogenizing the third liquid; and thermally processing the third liquid to form the milk protein beverage, the thermal processing including a temperature of 105 to 140 °C. A milk protein beverage, including: milk protein; and one or more calcium-binding chelator compound, the milk protein beverage having a viscosity difference of less than 150 cP across the temperature range.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:方法</p>
        <p type="p">12,14,16,18,20,22,24:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1245" publication-number="202623890">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623890</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131721</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>低排放烴裂解系統</chinese-title>
        <english-title>LOW-EMISSION HYDROCARBON CRACKING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">B01J19/00</main-classification>
        <further-classification edition="200601120260302B">C07C4/04</further-classification>
        <further-classification edition="200601120260302B">C10G9/18</further-classification>
        <further-classification edition="200601120260302B">F28D7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商德希尼布能源法國公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TECHNIP ENERGIES FRANCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維恩賈　傑勒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIJNJA, JELLE GARARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧德　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OUD, PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示了一種用於將烴原料轉化成經裂解流出氣體的低排放烴裂解系統。該低排放烴裂解系統可包括一裂解爐，該裂解爐具有由煙道氣體加熱且經組態以執行程序及非程序加熱操作的一對流區段、及可在內部藉由高溫加熱來使該烴原料裂解的一輻射區段。該低排放烴裂解系統可將該裂解爐對流區段之非程序負載最小化以確保即使透過使用高效輻射區段減少煙道氣體輸出仍有足夠的對流區段負載容量可用。可在一些情況下藉由部分地或完全地在該裂解爐之該對流區段外部使高壓蒸汽過熱，諸如藉由使用利用來自該經裂解流出氣體之廢熱之一或多個蒸汽流出物交換器來將該對流區段之該非程序負載最小化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A low-emission hydrocarbon cracking system for converting a hydrocarbon feedstock into cracked effluent gas is disclosed. The low-emission hydrocarbon cracking system can include a cracking furnace having a convection section heated by flue gas and configured to perform process and non-process heating operations, and a radiant section within which the hydrocarbon feedstock can be cracked by high temperature heating. The low-emission hydrocarbon cracking system may minimize the non-process duty of the cracking furnace convection section to ensure that sufficient convection section duty capacity is available even if flue gas output is reduced through use of a high efficiency radiant section. The non-process duty of the convection section may be minimized in some cases by superheating high pressure steam partly or completely outside of the convection section of the cracking furnace, such as by using one or more steam effluent exchangers that utilize waste heat from the cracked effluent gas.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:烴原料</p>
        <p type="p">2:稀釋蒸汽</p>
        <p type="p">3:鍋爐給水</p>
        <p type="p">4:高壓蒸汽</p>
        <p type="p">5:燃料</p>
        <p type="p">6:燃燒空氣</p>
        <p type="p">7:煙道氣體</p>
        <p type="p">8:經裂解流出氣體</p>
        <p type="p">9a:鍋爐水</p>
        <p type="p">9b:部分地汽化的鍋爐水</p>
        <p type="p">10:輻射區段/火箱</p>
        <p type="p">11:輻射盤管</p>
        <p type="p">12:底部燃燒器</p>
        <p type="p">14:燃燒區</p>
        <p type="p">20:對流區段</p>
        <p type="p">21:對流管束</p>
        <p type="p">22:進料預熱器</p>
        <p type="p">23:高溫盤管</p>
        <p type="p">24:稀釋蒸汽過熱器</p>
        <p type="p">25:高壓蒸汽過熱器</p>
        <p type="p">26:高溫盤管</p>
        <p type="p">27:空氣預熱器</p>
        <p type="p">30:煙道氣體風扇</p>
        <p type="p">31:堆疊</p>
        <p type="p">32:輸送線交換器</p>
        <p type="p">33:蒸汽鼓</p>
        <p type="p">34:減熱器</p>
        <p type="p">37:強制通風燃燒空氣風扇</p>
        <p type="p">60:蒸汽流出物交換器</p>
        <p type="p">100:低排放烴裂解系統/低排放烴裂解系統組態</p>
        <p type="p">101:裂解爐/爐</p>
        <p type="p">102:冷卻設備</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1246" publication-number="202624228">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624228</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131723</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>配體-蛋白降解劑複合體及其在醫藥上的應用</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">C07D471/04</main-classification>
        <further-classification edition="200601120260303B">C07D495/04</further-classification>
        <further-classification edition="200601120260303B">C07D401/04</further-classification>
        <further-classification edition="201701120260303B">A61K47/68</further-classification>
        <further-classification edition="200601120260303B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商海思科醫藥集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAISCO PHARMACEUTICAL GROUP CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張晨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙晨飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, CHENFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙明亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, MINGLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李瑤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴龐科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, PANGKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林發立</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種配體-蛋白降解劑複合體及其在醫藥上的應用，具體涉及一種通式(I)、(II)、(III)所述的化合物或者其立體異構體、消旋體、互變異構體、藥學上可接受的鹽，及其中間體和製備方法，以及在製備治療與GSPT1相關疾病的藥物中的應用。  &lt;br/&gt;&lt;img align="absmiddle" height="195px" width="287px" file="ed11161.JPG" alt="ed11161.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。        &lt;br/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1247" publication-number="202624138">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624138</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131740</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液體滅菌裝置</chinese-title>
        <english-title>FLUID STERILISATION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260302B">C02F1/32</main-classification>
        <further-classification edition="200601120260302B">A61L2/00</further-classification>
        <further-classification edition="202601120260302B">A61L2/10</further-classification>
        <further-classification edition="200601120260302B">A61L2/24</further-classification>
        <further-classification edition="200601120260302B">A61M1/36</further-classification>
        <further-classification edition="200601320260302B">C02F103/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澳大利亞商珍水有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENAQUA PTY LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高特　史考特甘迺迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOULTER, SCOTT KENNEDY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何崇熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>桃園市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐吉良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>桃園市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明有關一種液體滅菌裝置，該液體滅菌裝置包括一殼體，該殼體包括一流體入口、一流體出口及在該流體入口與該流體出口之間之一流體流動路徑；一UV處理模組設置於該流體入口與該流體出口之間，該UV處理模組包括一殺菌室，配置以殺菌其中所含之流體，該殺菌室包括第一及第二UVC LED陣列，其中該第一及第二UVC LED陣列之位置使得它們實質上彼此相對。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:液體滅菌裝置</p>
        <p type="p">12:殼體</p>
        <p type="p">14:流體入口</p>
        <p type="p">16:流體出口</p>
        <p type="p">18:流體流動路徑</p>
        <p type="p">20:UV處理模組</p>
        <p type="p">24a:第一UVC LED陣列</p>
        <p type="p">26a:上殼體壁</p>
        <p type="p">26b:下殼體壁</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1248" publication-number="202624550">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624550</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131741</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>催化劑、電化學電池裝置、方法</chinese-title>
        <english-title>Catalyst, electrochemical cell device, process</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">C25B5/00</main-classification>
        <further-classification edition="202101120260309B">C25B1/23</further-classification>
        <further-classification edition="200601120260309B">H01M4/92</further-classification>
        <further-classification edition="201601120260309B">H01M8/0232</further-classification>
        <further-classification edition="200601120260309B">B01J23/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商羅伯特　博世有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROBERT BOSCH GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米勒　提爾曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIEHLE, TILMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪　貝內德托　安德烈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DI BENEDETTO, ANDREA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種催化劑（100），其用於流體之催化轉化，尤其用於甲烷及/或氫之氧化，尤其用於電化學電池裝置（10），較佳燃料電池裝置（10）中，其中該催化劑（100）具有一第一區（118）及一第二區（120），其中該第二區（120）在該流體之流動方向上安置於該第一區（118）之下游，其中活性催化材料（108）安置於該第二區（120）中。  &lt;br/&gt;提議提供一種安置於該第一區（118）中之保護材料（110）以用於鉻之結合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a catalyst (100) for catalytic conversion of a fluid, especially for oxidation of methane and/or hydrogen, especially for use in electrochemical cell devices (10), preferably fuel cell devices (10), where the catalyst (100) has a first zone (118) and a second zone (120), where the second zone (120) is disposed downstream of the first zone (118) in a flow direction of the fluid, where active catalysis material (108) is disposed in the second zone (120). &lt;br/&gt;It is proposed that a protective material (110) disposed in the first zone (118) be provided for binding of chromium.</p>
      </isu-abst>
      <representative-img>
        <p type="p">26:後燃器/催化後燃器</p>
        <p type="p">100:催化劑</p>
        <p type="p">102:主體</p>
        <p type="p">104:流動方向</p>
        <p type="p">118:第一區</p>
        <p type="p">120:第二區</p>
        <p type="p">122:管狀殼體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1249" publication-number="202623852">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623852</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131744</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚焦超音波穴位保健裝置及其方法</chinese-title>
        <english-title>FOCUSED ULTRASOUND ACUPOINT HEALTH CARE DEVICE AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61N7/00</main-classification>
        <further-classification edition="200601120260302B">A61H39/00</further-classification>
        <further-classification edition="200601120260302B">A61F7/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人國家衛生研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL HEALTH RESEARCH INSTITUTES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬克沁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAXIM, SOLOVCHUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧宏安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENG, HONG AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡坤旺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種聚焦超音波穴位保健裝置，包括超音波輸出模組、控制模組、供能模組及人機介面模組。該裝置能將聚焦超音波精準作用於目標穴位，對穴位施加機械與熱刺激，並可依使用者年齡、體重、身高及穴位位置等條件，自動調整輸出功率與作用時間。裝置可採手持式或穿戴式結構，並可配置可更換探頭。部分實施例中，裝置具備溫度監控功能，當接觸區域溫度達到預設上限時停止輸出，降至預設下限時恢復輸出，以降低燙傷風險。本發明可用於人體穴位的保健、舒緩或促進身體機能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a focused ultrasound acupoint health-care device comprising an ultrasound output module, a control module, a power supply module, and a human-machine interface module. The device delivers focused ultrasound precisely to a target acupoint, applying mechanical and thermal stimulation, and may automatically adjust output power and treatment duration based on user-specific parameters such as age, weight, height, and acupoint location. The device can be configured as handheld or wearable and may include interchangeable transducers. In certain embodiments, a temperature monitoring function is provided to stop output when the contact area temperature reaches a preset upper limit and resume output when it falls below a preset lower limit, thereby reducing burn risks. The invention is applicable for health care, relaxation, and enhancement of body functions through acupoint stimulation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:超音波輸出模組</p>
        <p type="p">2:顯示幕</p>
        <p type="p">3:控制鍵</p>
        <p type="p">4:重置</p>
        <p type="p">5:電力/資料接口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1250" publication-number="202623789">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623789</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131748</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含熱回應性聚合物的藥物組合物及其用途</chinese-title>
        <english-title>PHARMACEUTICAL COMPOSITIONS COMPRISING THERMORESPONSIVE POLYMER AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">A61K31/06</main-classification>
        <further-classification edition="200601120260303B">A61K47/32</further-classification>
        <further-classification edition="201701120260303B">A61K47/34</further-classification>
        <further-classification edition="200601120260303B">A61K47/38</further-classification>
        <further-classification edition="200601120260303B">A61K9/20</further-classification>
        <further-classification edition="200601120260303B">A61K9/28</further-classification>
        <further-classification edition="200601120260303B">A61K9/32</further-classification>
        <further-classification edition="200601120260303B">A61P3/00</further-classification>
        <further-classification edition="200601120260303B">A61P9/00</further-classification>
        <further-classification edition="200601120260303B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商珀立康（美國）醫藥科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POLYKLEITOS PHARMACEUTICALS LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張詩宜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, SHIYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳兆宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, ZHAOYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中提供了包含熱回應性聚合物的藥物組合物及其用途。具體地，本文中提供了包含線粒體解偶聯劑和熱回應性聚合物的藥物組合物及其用途。此類藥物組合物可以用於治療疾病，諸如但不限於NASH、超重、肥胖、與超重或肥胖相關的醫學併發症、2型糖尿病(T2D)和阿爾茨海默病及相關癡呆(AD/ADRD)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are pharmaceutical compositions comprising thermoresponsive polymer and uses thereof. Specifically, provided herein are pharmaceutical compositions comprising a mitochondrial uncoupler and a thermoresponsive polymer and uses thereof. Such pharmaceutical compositions can be useful for treating diseases, such as but not limited to NASH, overweight, obesity, medical complications related to overweight or obesity, type 2 diabetes (T2D), and Alzheimer’s disease and related dementias (AD/ADRD).</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1251" publication-number="202625252">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625252</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131763</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電漿處理裝置及蝕刻方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">H01J37/32</main-classification>
        <further-classification edition="200601120260313B">H05H1/46</further-classification>
        <further-classification edition="202601120260313B">H10P50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤万葉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, MAYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀧野裕輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKINO, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田和弥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯瑤士　賽德里克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THOMAS, CEDRIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋正彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, MASAHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">電漿處理裝置係具備：腔室、基板支撐部、氣體供給部、第一高頻電源、電壓脈衝源、第二高頻電源及控制部。基板支撐部係被配置於腔室內，並支撐基板。控制部係以後述方式構成：於蝕刻基板時，將處理氣體自氣體供給部供給於腔室內，並以自第一高頻電源供給第一高頻電力從而將腔室內的處理氣體電漿化，自電壓脈衝源對基板支撐部供給電壓脈衝，並重疊於該電壓脈衝而自第二高頻電源供給第二高頻電力之方式來控制。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無 </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1252" publication-number="202623834">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623834</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131767</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種包含ＩＬ－３６Ｒ／ＩＬ－２３結合蛋白的醫藥組成物及其用途</chinese-title>
        <english-title>A PHARMACEUTICAL COMPOSITION COMPRISING IL-36R/IL-23 BINDING PROTEIN AND USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">A61K39/395</main-classification>
        <further-classification edition="200601120260303B">A61K47/22</further-classification>
        <further-classification edition="200601120260303B">A61K47/12</further-classification>
        <further-classification edition="200601120260303B">A61K47/26</further-classification>
        <further-classification edition="200601120260303B">A61K47/02</further-classification>
        <further-classification edition="200601120260303B">A61K47/18</further-classification>
        <further-classification edition="200601120260303B">A61K9/19</further-classification>
        <further-classification edition="200601120260303B">A61P29/00</further-classification>
        <further-classification edition="200601120260303B">A61P37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海邁晉生物醫藥科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI MABGEN BIOTECH LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國程悅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, CHENGYUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙志龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, ZHILONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及一種包含IL-36R/IL-23結合蛋白的醫藥組成物及其用途。具體而言，本揭露涉及一種包含IL-36R/IL-23結合蛋白的醫藥組成物、凍乾製劑、複溶溶液、製品及其用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure relates to a pharmaceutical composition comprising IL-36R/IL-23 binding protein and use thereof. Specifically, the disclosure relates to a pharmaceutical composition, lyophilized formulation, reconstitution solution, product, and use thereof comprising IL-36R/IL-23 binding protein.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1253" publication-number="202624294">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624294</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131773</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>共聚物、積層體及積層體的製造方法</chinese-title>
        <english-title>COPOLYMER, LAMINATE, AND METHOD FOR PRODUCING LAMINATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08F210/02</main-classification>
        <further-classification edition="200601120260302B">C08F220/32</further-classification>
        <further-classification edition="200601120260302B">C09J123/08</further-classification>
        <further-classification edition="201801120260302B">C09J7/24</further-classification>
        <further-classification edition="200601120260302B">B32B27/08</further-classification>
        <further-classification edition="200601120260302B">B32B27/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北川翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAGAWA, SHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種共聚物，係含有氟樹脂的成形體接著用的共聚物，共聚物含有衍生自碳數2至8烯烴單體的單體單元、及具有縮水甘油基的單體單元，在共聚物的具有縮水甘油基的單體單元的比例，以共聚物的全質量作為基準，為10質量%以上。一種積層體，係具備含有氟樹脂的樹脂層、及成形體的表面上形成的接著層，且接著層含有該共聚物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The copolymer of the present invention is a copolymer for bonding molded articles containing a fluororesin, the copolymer comprising monomer units derived from an olefin monomer having 2 to 8 carbon atoms and monomer units having a glycidyl group, wherein the proportion of the monomer units having a glycidyl group in the copolymer is 10 mass% or more based on the total mass of the copolymer.The laminate of the present invention comprises a resin layer containing a fluororesin and an adhesive layer formed on the surface of a molded article, the adhesive layer containing the copolymer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:樹脂層</p>
        <p type="p">2:接著層</p>
        <p type="p">10:積層體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1254" publication-number="202623816">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623816</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131786</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>肌纖維分化促進劑及肌纖維分化促進用食品組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/702</main-classification>
        <further-classification edition="201601120260302B">A23L33/125</further-classification>
        <further-classification edition="200601120260302B">C07H1/08</further-classification>
        <further-classification edition="200601120260302B">C07H5/04</further-classification>
        <further-classification edition="200601120260302B">A61P21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>學校企業　麻布獸醫教育協會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHOOL CORPORATION, AZABU VETERINARY MEDICINE EDUCATIONAL INSTITUTION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>Ｍ風格日本控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>M-STYLE JAPAN CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永根大幹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGANE, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下匡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAHISTA, TADASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤木結葉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIKI, YUHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小西良成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONISHI, YOSHINARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稻冨幹也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INATOMI, MIKIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志青</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供比以往更具效果的肌肉修復增強促進劑等。本發明的肌纖維分化促進劑含有燕窩所含的成分作為有效成分並且促進細胞分化成肌纖維。特別是透過對燕窩進行加水分解處理而萃取有效成分，與經由熱處理萃取的傳統方法相比，能在不損害燕窩所含有效成分的情況下進行萃取。因此，能夠提升燕窩所含有效成分所帶來的肌肉修復與增強促進的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1255" publication-number="202624269">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624269</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131795</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>新型抗ＣＤＨ６抗體及其用途</chinese-title>
        <english-title>NOVEL ANTI-CDH6 ANTIBODIES AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">C07K16/28</main-classification>
        <further-classification edition="200601120260303B">C07K14/705</further-classification>
        <further-classification edition="200601120260303B">C12N15/13</further-classification>
        <further-classification edition="200601120260303B">C12N15/63</further-classification>
        <further-classification edition="200601120260303B">A61K39/395</further-classification>
        <further-classification edition="200601120260303B">A61P35/00</further-classification>
        <further-classification edition="200601120260303B">G01N33/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商德琪生物有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANTENGENE BIOLOGICS LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李騰騰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, TENGTENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳朋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯冰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, BING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡灶順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, ZAOSHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閆佳琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, JIAQI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉惠玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HUILING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開提供抗CDH6抗體或其抗原結合片段、編碼該等CDH6抗體或其抗原結合片段之經分離聚核苷酸、包含該等CDH6抗體或其抗原結合片段之醫藥組合物以及其用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides anti-CDH6 antibodies or antigen-binding fragments thereof, isolated polynucleotides encoding the same, pharmaceutical compositions comprising the same and the uses thereof.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1256" publication-number="202624756">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624756</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131808</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>探針支持件、包括探針支持件之探針組合件、包括探針組合件之探針系統、以及相關方法</chinese-title>
        <english-title>PROBE SUPPORTS, PROBE ASSEMBLIES THAT INCLUDE THE PROBE SUPPORTS, PROBE SYSTEMS THAT INCLUDE THE PROBE ASSEMBLIES, AND RELATED METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">G01R1/067</main-classification>
        <further-classification edition="202001120260309B">G01R31/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商豐菲克特公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FORMFACTOR, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮫島正裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMESHIMA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>船床陽一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUNATOKO, YOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費席爾　格韋恩　尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FISHER, GAVIN NEIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">探針支持件、包含所述探針支持件的探針組合件、包含所述探針組合件的探針系統、以及相關的方法。所述探針組合件包含所述探針支持件、探針支持件安裝結構、以及探針。所述探針支持件可包含細長的支持件主體，其延伸在支持件座以及探針座之間。所述探針支持件亦可包含變形量測結構，其經配置以產生指出所述細長的支持件主體的變形的變形輸出。所述探針支持件安裝結構可以是在操作上附接至所述支持件座。所述探針可以是在操作上附接至所述探針座。所述探針系統包含夾頭、訊號產生及分析組合件、以及所述探針組合件。所述方法至少部分根據變形輸出來控制探針系統的操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Probe supports, probe assemblies that include the probe supports, probe systems that include the probe assemblies, and related methods. The probe assemblies include the probe support, a probe support mounting structure, and a probe. The probe support may include an elongate support body that extends between a support mount and a probe mount. The probe support also may include a deformation measurement structure configured to generate a deformation output indicative of deformation of the elongate support body. The probe support mounting structure may be operatively attached to the support mount. The probe may be operatively attached to the probe mount. The probe systems include a chuck, a signal generation and analysis assembly, and the probe assembly. The methods control the operation of a probe system based, at least in part, on a deformation output.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:探針系統</p>
        <p type="p">20:夾頭</p>
        <p type="p">22:支持表面</p>
        <p type="p">30:基板</p>
        <p type="p">32:受測裝置/DUT</p>
        <p type="p">40:訊號產生及分析組合件</p>
        <p type="p">42:電性測試訊號</p>
        <p type="p">44:所產生的電性訊號</p>
        <p type="p">50:運動控制組合件</p>
        <p type="p">60:光學組合件</p>
        <p type="p">70:物體</p>
        <p type="p">100:探針組合件</p>
        <p type="p">110:探針支持件安裝結構</p>
        <p type="p">112:平台</p>
        <p type="p">114:操縱器</p>
        <p type="p">120:探針卡</p>
        <p type="p">122:探針</p>
        <p type="p">124:針式/工程探針</p>
        <p type="p">130:激勵電壓源</p>
        <p type="p">132:激勵電壓差</p>
        <p type="p">140:量測電子設備</p>
        <p type="p">142:電壓量測裝置</p>
        <p type="p">144:放大器</p>
        <p type="p">146:數位化器</p>
        <p type="p">200:探針支持件</p>
        <p type="p">202:荷重元</p>
        <p type="p">204:力</p>
        <p type="p">206:力</p>
        <p type="p">210:細長的支持件主體</p>
        <p type="p">212:支持件座</p>
        <p type="p">214:探針座</p>
        <p type="p">216:支持件主體長度</p>
        <p type="p">220:細長的開口</p>
        <p type="p">222:矩形</p>
        <p type="p">224:圓柱形</p>
        <p type="p">230:相對的側主體表面對</p>
        <p type="p">232:上主體表面</p>
        <p type="p">234:下主體表面</p>
        <p type="p">240:變形量測結構</p>
        <p type="p">242:第一輸入端子</p>
        <p type="p">244:第二輸入端子</p>
        <p type="p">250:變形輸出</p>
        <p type="p">252:第一輸出端子</p>
        <p type="p">254:第二輸出端子</p>
        <p type="p">256:變形量測感測器</p>
        <p type="p">258:橋式電路</p>
        <p type="p">260:第一上方的變形量測感測器</p>
        <p type="p">266:第二上方的變形量測感測器</p>
        <p type="p">272:第一下方的變形量測感測器</p>
        <p type="p">278:第二下方的變形量測感測器</p>
        <p type="p">290:第一對橫向的變形量測感測器</p>
        <p type="p">292:第二對橫向的變形量測感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1257" publication-number="202623836">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623836</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131814</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>治療流感感染的組合物和方法</chinese-title>
        <english-title>COMPOSITIONS AND METHODS FOR TREATING INFLUENZA INFECTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260304B">A61K47/54</main-classification>
        <further-classification edition="200601120260304B">A61K31/351</further-classification>
        <further-classification edition="200601120260304B">A61K47/02</further-classification>
        <further-classification edition="200601120260304B">A61K47/26</further-classification>
        <further-classification edition="201701120260304B">A61K47/68</further-classification>
        <further-classification edition="200601120260304B">A61P31/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美國普度研究基金會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PURDUE RESEARCH FOUNDATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商埃迪韋有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ERADIVIR, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅　史都華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOW, STEWART</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼爾森　杰弗瑞　杰　霍華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIELSEN, JEFFERY JAY HOWARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼德勞爾　瑪麗　林恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIEDRAUER, MARY LYNN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示用於治療流感感染之醫藥組合物，其包含雙半抗原結合物；及用於治療流感感染之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Pharmaceutical compositions comprising a dual hapten conjugate for treating influenza infections; and methods for use for treating influenza infections are disclosed herein.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1258" publication-number="202624533">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624533</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131855</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於選擇性氣體活化的氣體注入和預熱及相關處理腔室、設備和方法</chinese-title>
        <english-title>GAS INJECTION AND PRE-HEATING FOR SELECTIVE GAS ACTIVATION, AND RELATED PROCESSING CHAMBERS, APPARATUS, AND METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">C23C16/455</main-classification>
        <further-classification edition="200601120260312B">C23C16/458</further-classification>
        <further-classification edition="200601120260312B">C30B25/10</further-classification>
        <further-classification edition="200601120260312B">C30B25/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　樹坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAU, SHU-KWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱　恩樂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOO, ENLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕拉帝　亞伯拉罕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PALATY, ABRAHAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕蒂爾　阿尼克尼汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATIL, ANIKETNITIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡吉爾　聖塔紐拉吉菲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GADGIL, SHANTANU RAJIV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫拉迪安　雅拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORADIAN, ALA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩理納斯　馬丁傑佛瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SALINAS, MARTIN JEFFREY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露係關於用於選擇性氣體活化的氣體注入和預熱，以及相關的腔室套組、方法及處理腔室。在一或多個實施例中，處理腔室包括腔室主體，其至少部分界定了內部容積。基板支撐件設置在內部容積中。氣體組件耦接到腔室主體。該氣體組件包括可操作以將氣體流入內部容積中的注入器。複數個氣體管線流體連接到注入器，且至少一個加熱器可操作以加熱該氣體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to gas injection and pre-heating for selective gas activation, and related chamber kits, methods, and processing chambers. In one or more embodiments, a processing chamber includes a chamber body at least partially defining an internal volume. A substrate support is disposed in the internal volume. A gas assembly is coupled to the chamber body. The gas assembly includes an injector operable to flow a gas into the internal volume. A plurality of gas lines are fluidly connected to the injector and at least one heater is operable to heat the gas.</p>
      </isu-abst>
      <representative-img>
        <p type="p">112:流動模組</p>
        <p type="p">151:製程氣體來源</p>
        <p type="p">153:清洗氣體來源</p>
        <p type="p">200:氣體供應組件</p>
        <p type="p">201:氣體歧管</p>
        <p type="p">202:主體</p>
        <p type="p">203:氣體通道</p>
        <p type="p">210:帽</p>
        <p type="p">230:加熱器</p>
        <p type="p">250:電源</p>
        <p type="p">1000:處理腔室</p>
        <p type="p">1015:注入器</p>
        <p type="p">1016:氣體管線</p>
        <p type="p">2016:加熱氣體管線</p>
        <p type="p">2017:氣體管線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1259" publication-number="202623831">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623831</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131865</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療動脈粥樣硬化性心血管疾病之藥物化合物</chinese-title>
        <english-title>PHARMACEUTICAL COMPOUND FOR THE TREATMENT OF ATHEROSCLEROTIC CARDIOVASCULAR DISEASE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260310B">A61K38/17</main-classification>
        <further-classification edition="200601120260310B">C07K14/715</further-classification>
        <further-classification edition="200601120260310B">A61P9/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商菲林公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FERRING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舒爾特　多明尼克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHULTE, DOMINIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渥特茲格　喬格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATZIG, GEORG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勞德斯　馬西斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAUDES, MATTHIAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛伯　史帝芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHREIBER, STEFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種多肽二聚體，該多肽二聚體包含兩個gp130-Fc融合肽，用於治療人類患者的ASCVD，較佳的是用於治療人類患者的高危ASCVD，更較佳的是用於治療人類患者的很高危ASCVD。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a polypeptide dimer comprising two gp130-Fc fusion peptides for use in the treatment of ASCVD in human patients, preferably of high-risk ASCVD in human patients, more preferably of very-high-risk ASCVD in human patients.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1260" publication-number="202625551">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625551</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131877</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有背側觸點的４Ｆ２　ＤＲＡＭ</chinese-title>
        <english-title>4F2 DRAM WITH BACKSIDE CONTACT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260312B">H10B12/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉同</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, TONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕爾　阿希什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAL, ASHISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦吉斯　索尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VARGHESE, SONY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科斯特里尼　葛雷戈里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COSTRINI, GREGORY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴吉吉　艾爾梅蒂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAZIZI, EL MEHDI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普拉納塔拉蒂哈蘭　巴拉蘇布拉馬尼安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRANATHARTHIHARAN, BALASUBRAMANIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本技術包括形成高階記憶體結構的方法、裝置及系統，以及由此產生的裝置。裝置包括電晶體，電晶體具有排列在第一水平方向上的一或多個位元線，排列在第二水平方向上的一或多個字線，以及以垂直方向延伸的一或多個通道，該垂直方向通常與第一和第二水平方向正交。裝置包括位於電晶體上方的電容器，其中電晶體從DRAM陣列的第一端延伸至電容器，而電容器則從電晶體延伸至DRAM陣列的第二端。裝置還包括具有接觸側和第二側的周邊電晶體，其中周邊電晶體的接觸側與DRAM陣列的第一端接合，且在電晶體與周邊電晶體之間形成一或多個著陸墊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present technology includes methods, devices and systems for forming advanced memory structures, and devices therefrom. Devices include a transistor having one or more bit lines arranged in a first horizontal direction, one or more word lines arranged in a second horizontal direction, and one or more channels extending in a vertical direction that is generally orthogonal to the first horizontal direction and the second horizontal direction. Devices include a capacitor overlying the transistor, where the transistor extends from a first end of a DRAM array to the capacitor, and the capacitor extends from the transistor to a second end of the DRAM array. Devices include a periphery transistor having a contact side and a second side, where the contact side of the periphery transistor is bonded to the first end of the DRAM array and one or more landing pads formed between the transistor and the periphery transistor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:結構</p>
        <p type="p">302:陣列</p>
        <p type="p">302a:陣列區域</p>
        <p type="p">304:DRAM單元</p>
        <p type="p">306:電容器</p>
        <p type="p">308:電晶體</p>
        <p type="p">309:通道</p>
        <p type="p">310:字線</p>
        <p type="p">310a:接觸</p>
        <p type="p">310b:著陸墊</p>
        <p type="p">312:位元線</p>
        <p type="p">312a:觸點</p>
        <p type="p">312b:著陸墊</p>
        <p type="p">314:背側</p>
        <p type="p">315:前側</p>
        <p type="p">316:介電材料</p>
        <p type="p">320:電晶體</p>
        <p type="p">322:電晶體元件/框</p>
        <p type="p">324:觸點</p>
        <p type="p">326:第一側</p>
        <p type="p">328:第二側</p>
        <p type="p">330:介電材料</p>
        <p type="p">332:氧化物鍵</p>
        <p type="p">340:板</p>
        <p type="p">342a:板觸點</p>
        <p type="p">342b:前側板觸點</p>
        <p type="p">344:互連</p>
        <p type="p">346:介電材料</p>
        <p type="p">350:載體</p>
        <p type="p">354:背側觸點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1261" publication-number="202624417">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624417</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131898</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於汽車內飾應用之光可固化油墨及包含其之玻璃製品</chinese-title>
        <english-title>PHOTOCURABLE INKS FOR AUTOMOTIVE INTERIOR APPLICATIONS AND GLASS ARTICLES COMPRISING SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260302B">C09D11/101</main-classification>
        <further-classification edition="200601120260302B">C03C17/32</further-classification>
        <further-classification edition="202401120260302B">B60K35/00</further-classification>
        <further-classification edition="202401120260302B">B60K37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛曼　柯瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FORMAN, COREY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格里森　亞倫布萊德利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLEASON, AARON BRADLEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛倫鄧　約翰沃特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRUNDEN, JOHN WALTER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡農戈　曼達基尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANUNGO, MANDAKINI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥達　曼努吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDA, MANOJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥爾斯　提摩西愛德華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MYERS, TIMOTHY EDWARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種紫外線可固化油墨組成物包括以該紫外線可固化油墨組成物之一總重量計：大於或等於7 wt%且小於或等於15 wt%之一顏料；大於0 wt%且小於或等於60 wt%之一雙官能單體；大於0 wt%且小於或等於30 wt%之一多官能單體；及大於或等於2 wt%且小於或等於10 wt%之一陽離子光起始劑。該紫外線油墨組成物不含溶劑且不含樹脂。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An ultraviolet curable ink composition includes, based on a total weight of the ultraviolet curable ink composition, greater than or equal to 7 wt% and less than or equal to 15 wt% of a pigment, greater than 0 wt% and less than or equal to 60 wt% of a difunctional monomer, greater than 0 wt% and less than or equal to 30 wt% of a multifunctional monomer, and greater than or equal to 2 wt% and less than or equal to 10 wt% of a cationic photoinitiator. The ultraviolet ink composition is free of solvent and free of resin.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2-2:線</p>
        <p type="p">100,200,300:車輛內飾系統</p>
        <p type="p">110:中控台底座</p>
        <p type="p">120,220,320:彎曲表面</p>
        <p type="p">130,230,330:顯示器</p>
        <p type="p">210:儀錶板底座</p>
        <p type="p">215:儀錶面板</p>
        <p type="p">310:儀錶板方向盤底座</p>
        <p type="p">2000:車輛內飾</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1262" publication-number="202625837">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625837</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131920</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>面板級半導體封裝結構及其製造方法</chinese-title>
        <english-title>PANEL-LEVEL SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260313B">H10W70/65</main-classification>
        <further-classification edition="202601120260313B">H10W70/652</further-classification>
        <further-classification edition="202601120260313B">H10W74/10</further-classification>
        <further-classification edition="202601120260313B">H10W74/01</further-classification>
        <further-classification edition="202601120260313B">H10D80/30</further-classification>
        <further-classification edition="202601120260313B">H10W70/05</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>銓心半導體異質整合股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ND-HI TECHNOLOGIES LAB, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈺創科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ETRON TECHNOLOGY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐和明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TONG, HO-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧超群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHAO-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏薇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝志勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHIH-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀佩君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種面板級半導體封裝結構。所述面板級半導體封裝結構包含面板級基板結構以及至少一個晶圓級封裝結構。面板級基板結構具有第一側以及與第一側相對的第二側。所述晶圓級封裝結構接合在面板級基板結構上。各該晶圓級封裝結構包含第一重分布層(RDL)，位於彈性連接件上，且多個第一半導體元件橫向設置於第一RDL上。本發明亦提出一種面板級基板結構之製造方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A panel-level semiconductor package structure is provided. The panel-level semiconductor package structure includes a panel-level substrate structure and at least one wafer-level package structure. The panel-level substrate structure has a first side and a second side opposite to the first side. The wafer-level package structure is bonded over the panel-level substrate structure. Each of the wafer-level package structures includes a first redistribution layer (RDL) over the elastomeric connector and a plurality of first semiconductor devices laterally disposed over the first RDL. A method for manufacturing a panel-level substrate structure is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:面板級半導體封裝結構</p>
        <p type="p">100:面板級基板結構</p>
        <p type="p">100A,1081A:第一側</p>
        <p type="p">100B,1081B:第二側</p>
        <p type="p">102:彈性連接件</p>
        <p type="p">104:第一重分布層(RDL)</p>
        <p type="p">106:晶圓級封裝結構</p>
        <p type="p">112:第一模封材料</p>
        <p type="p">117:熱介面材料</p>
        <p type="p">120:散熱結構</p>
        <p type="p">140:接合墊</p>
        <p type="p">142:凸塊</p>
        <p type="p">144:封裝材料</p>
        <p type="p">1091:前段製程(FEOL)結構</p>
        <p type="p">1092:後段製程(BEOL)結構</p>
        <p type="p">1093:導電墊</p>
        <p type="p">1081,1082:第一半導體元件</p>
        <p type="p">1161,1162,1163,1164:第二半導體元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1263" publication-number="202624489">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624489</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131922</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於遞送肌營養不良蛋白酬載之包含含ＲＧＤ之肽的ＡＡＶ顆粒</chinese-title>
        <english-title>AAV PARTICLES COMPRISING RGD-CONTAINING PEPTIDES FOR DELIVERING DYSTROPHIN PAYLOADS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">C12N15/86</main-classification>
        <further-classification edition="200601120260304B">C07K14/005</further-classification>
        <further-classification edition="200601120260304B">A61K48/00</further-classification>
        <further-classification edition="200601120260304B">A61P21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商渤健麻塞諸塞州股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIOGEN MA INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柏曼蒂爾　芭朵　安　蘇菲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARMENTIER-BATTEUR, ANNE-SOPHIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡柯洛　艾德萊達　帕拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CACHORRO, ADELAIDA PALLA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　威同</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI TONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉爾梅特　愛德華　雷門</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUILMETTE, EDWARD RAYMOND</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熊　嘉盈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, KA YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, QUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥道加　迪文　史考特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCDOUGALD, DEVIN SCOTT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史　雋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史派羅　榮格海依　蘇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPARROW, JUNGHAE SUH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁　圓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雅雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露係關於AAV顆粒，其包含：包含含RGD之肽之AAV衣殼及肌營養不良蛋白酬載。本文亦揭示使用所揭示之AAV顆粒來治療及/或預防肌營養不良症例如杜興氏肌營養不良症之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure pertains to AAV particles comprising: AAV capsids comprising a RGD-containing peptide, and a dystrophin payload. Also disclosed herein are methods of using the disclosed AAV particles for treating and/or preventing a muscular dystrophy, e.g., Duchenne muscular dystrophy.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1264" publication-number="202623865">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623865</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131928</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於在互動式遊戲中完全控制的相機的訓練系統</chinese-title>
        <english-title>TRAINING SYSTEMS FOR FULLY CONTROLLED CAMERAS IN INTERACTIVE GAMES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260302B">A63F13/525</main-classification>
        <further-classification edition="201401120260302B">A63F13/65</further-classification>
        <further-classification edition="201401120260302B">A63F13/67</further-classification>
        <further-classification edition="202201120260302B">G06F3/04847</further-classification>
        <further-classification edition="201901120260302B">G06N20/00</further-classification>
        <further-classification edition="201101120260302B">G06T19/00</further-classification>
        <further-classification edition="201701120260302B">G06T7/70</further-classification>
        <further-classification edition="200601120260302B">G11B27/028</further-classification>
        <further-classification edition="201101120260302B">H04N21/218</further-classification>
        <further-classification edition="201101120260302B">H04N21/472</further-classification>
        <further-classification edition="201101120260302B">H04N21/8545</further-classification>
        <further-classification edition="202301120260302B">H04N23/617</further-classification>
        <further-classification edition="202301120260302B">H04N23/62</further-classification>
        <further-classification edition="202301120260302B">H04N23/66</further-classification>
        <further-classification edition="202301120260302B">H04N23/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商天舞矽谷有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SKYDANCE SILICON VALLEY, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊薩克　傑瑞米　路克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISAAK, JEREMY LUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比克　朱利安　安東尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEAK, JULIAN ANTHONY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中所描述之具體實例包括用於包括電動遊戲之互動式環境內之一完全控制的相機系統之系統及方法。程序涉及橫跨諸如遊戲關卡或場景之複數個互動式環境初始化一相機設定。對於各環境，建立至少一個相機點，並添加一或多個相機特性以定義相機之行為及視覺風格。在一些具體實例中，此係由一開發者手動地執行。在額外具體實例中，利用一機器學習輔助方法，其中諸如遙測資料及限制參數之輸入資料係由機器學習模型處理。此等模型可自動產生一初始配置，為相機點之最佳位置及其相關聯的特性提供建議。此初始配置接著可經接收並透過手動調整進一步改進。在判定已經對所有環境皆進行配置後，部署具有一無縫電影相機系統之一互動式體驗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments described herein include systems and methods for a fully controlled camera system within interactive environments, including video games. The process involves initializing a camera setup across a plurality of interactive environments, such as game levels or scenes. For each environment, at least one camera point is established, and one or more camera characteristics are added to define the camera's behavior and visual style. In some embodiments, this is performed manually by a developer. In additional embodiments, a machine learning assisted approach is utilized, where input data such as telemetry data and restriction parameters are processed by machine learning models. These models can automatically generate an initial configuration, suggesting optimal locations for camera points and their associated characteristics. This initial configuration can then be received and further refined through manual adjustments. Upon determining that all environments have been configured, an interactive experience with a seamless, cinematic camera system is deployed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電動遊戲生態系統</p>
        <p type="p">110:中央伺服器</p>
        <p type="p">120:網際網路</p>
        <p type="p">130:個人電腦</p>
        <p type="p">140:行動遊戲控制台</p>
        <p type="p">145:家用遊戲控制台</p>
        <p type="p">150:路由器</p>
        <p type="p">160:智慧型手機</p>
        <p type="p">170:遊戲膝上型電腦</p>
        <p type="p">180:平板電腦</p>
        <p type="p">190:可穿戴裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1265" publication-number="202624586">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624586</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131955</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>不織布及不織布的製造方法</chinese-title>
        <english-title>NON-WOVEN FABRIC AND METHOD FOR MANUFACTURING NON-WOVEN FABRIC</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260302B">D04H1/4334</main-classification>
        <further-classification edition="201201120260302B">D04H1/732</further-classification>
        <further-classification edition="201201120260302B">D04H3/009</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井化學旭生活材料有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI CHEMICALS ASAHI LIFE MATERIALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江口大樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EGUCHI, DAIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北山秀超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAYAMA, HIDEKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江角真一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ESUMI, SHINICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種不織布及該不織布的製造方法，所述不織布含有以聚醯胺系樹脂為主要成分的纖維，所述纖維的相對黏度小於1.8，孔徑分佈滿足下述式（1）：Dmax/Dave＜1.5   …式（1）{式中，Dmax為最大孔徑（μm），而且Dave為平均孔徑（μm）}，質地指數為30以上且小於92。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:料斗</p>
        <p type="p">2:擠出機</p>
        <p type="p">3:三通閥</p>
        <p type="p">4:排出口</p>
        <p type="p">5:抽吸風扇</p>
        <p type="p">6:壓力機</p>
        <p type="p">7:聚攏器</p>
        <p type="p">8:自動驗布機</p>
        <p type="p">9:捲取機</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1266" publication-number="202625349">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625349</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131960</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>諧振轉換器及其控制方法</chinese-title>
        <english-title>RESONANT CONVERTER AND CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">H02M3/00</main-classification>
        <further-classification edition="200601120260302B">H02M1/08</further-classification>
        <further-classification edition="200601120260302B">H02M3/335</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王達開</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, DAKAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭德智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, TE-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫馬爾　美莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, MISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>包　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARBOSA, PETER MANTOVANELLI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種諧振轉換器及其控制方法。諧振轉換器包含初級電路、次級電路及變壓器。控制方法包含：於第一控制模式中，以可變切換頻率控制初級與次級電路的複數個初級開關及次級開關；於第二控制模式中，控制複數個初級開關與複數個次級開關之間的相位偏移；當輸入電壓在預設範圍內時，以第一控制模式控制諧振轉換器；當輸入電壓由預設範圍內變化至預設範圍外時，由第一控制模式過渡至第二控制模式，以維持輸出電壓在預定範圍內；以及當輸入電壓由預設範圍外變化至預設範圍內時，由第二控制模式過渡至第一控制模式。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A resonant converter and a control method thereof are provided. The resonant converter includes primary and secondary circuits and a transformer. The control method includes: in first control mode, controlling primary switches of the primary circuit and secondary switches of the secondary circuit with a variable switching frequency; in second control mode, controlling a phase shift between the primary switches and the secondary switches; when an input voltage is within a preset range, controlling the resonant converter with the first control mode; when the input voltage changes from within the preset range to outside the preset range, transiting from the first control mode to the second control mode to maintain an output voltage within a predetermined range; and when the input voltage changes from outside the preset range to within the preset range, transiting from the second control mode to the first control mode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:諧振轉換器</p>
        <p type="p">11:第一控制器</p>
        <p type="p">12:第一驅動器</p>
        <p type="p">13:第二控制器</p>
        <p type="p">14:第二驅動器</p>
        <p type="p">15:計算器</p>
        <p type="p">16:補償器</p>
        <p type="p">C&lt;sub&gt;r&lt;/sub&gt;:諧振電容</p>
        <p type="p">L&lt;sub&gt;r&lt;/sub&gt;:諧振電感</p>
        <p type="p">Q&lt;sub&gt;1&lt;/sub&gt;、Q&lt;sub&gt;2&lt;/sub&gt;、Q&lt;sub&gt;3&lt;/sub&gt;、Q&lt;sub&gt;4&lt;/sub&gt;:初級開關</p>
        <p type="p">S&lt;sub&gt;1&lt;/sub&gt;、S&lt;sub&gt;2&lt;/sub&gt;、S&lt;sub&gt;3&lt;/sub&gt;、S&lt;sub&gt;4&lt;/sub&gt;:次級開關</p>
        <p type="p">TR:變壓器</p>
        <p type="p">V&lt;sub&gt;in&lt;/sub&gt;:輸入電壓</p>
        <p type="p">V&lt;sub&gt;o&lt;/sub&gt;:輸出電壓</p>
        <p type="p">V&lt;sub&gt;ref&lt;/sub&gt;:參考電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1267" publication-number="202625245">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625245</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131961</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>離子植入裝置及離子植入方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">H01J37/317</main-classification>
        <further-classification edition="202601120260312B">H10P34/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友重機械離子科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO HEAVY INDUSTRIES ION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>院田佳昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDA, YOSHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川崎洋司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASAKI, YOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>月原光国</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUKIHARA, MITSUKUNI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">離子植入裝置(10)具備：保持裝置(50)，係構成為保持被處理物(W)；離子束生成裝置，係生成照射到被保持裝置(50)保持之被處理物(W)的處理面(S)之離子束(B)；及電磁束生成裝置(60)，係生成照射到被保持裝置(50)保持之被處理物(W)的處理面(S)之電磁束(62)，該電磁束(62)對處理面(S)進行退火。在離子束(B)照射到處理面(S)的第1照射範圍(72)時，電磁束(62)照射到處理面(S)的第2照射範圍(74)，第1照射範圍(72)位於第2照射範圍(74)的內側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:離子植入裝置</p>
        <p type="p">50:保持裝置</p>
        <p type="p">60:電磁束生成裝置</p>
        <p type="p">62:電磁束</p>
        <p type="p">64:輻射源</p>
        <p type="p">66:電磁束整形裝置</p>
        <p type="p">70:植入位置</p>
        <p type="p">72:第1照射範圍</p>
        <p type="p">74:第2照射範圍</p>
        <p type="p">A:射束線</p>
        <p type="p">B:離子束</p>
        <p type="p">S:處理面</p>
        <p type="p">W:被處理物</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1268" publication-number="202625304">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625304</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131977</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>板端連接器及包含該板端連接器的生物感測器裝置</chinese-title>
        <english-title>BOARD-END CONNECTOR AND BIOSENSOR DEVICE INCLUDING SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120250917B">H01R12/71</main-classification>
        <further-classification edition="200601120250917B">H01R13/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>實盈股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUYIN CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孟廣金</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENG, GUANG JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程夢麗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, MENG LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種板端連接器及包含板端連接器的生物感測器裝置，板端連接器包括具有凹陷部的絕緣體及若干固定於絕緣體上的導電件。每一個導電件均具有相互導通並分別用於與兩個電子裝置導接的第一彈臂、第二彈臂，第一彈臂上端的第一導接部顯露於絕緣體上端，第二彈臂上端的第二導接部顯露於凹陷部中，且凹陷部用於裝配或容置兩個電子裝置其中之一。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A board-end connector and a biosensor device including the same are provided. The board-end connector includes an insulator having a concave portion, and a plurality of conductive members fixed to the insulator. Each of the conductive members includes a first elastic arm and a second elastic arm that are mutually conductive and configured to connect to two electronic devices, respectively. A first conductive portion at an upper end of the first elastic arm is exposed at an upper end of the insulator, a second conductive portion at an upper end of the second elastic arm is exposed in the concave portion, and the concave portion is configured to assemble or accommodate one of the two electronic devices.</p>
      </isu-abst>
      <representative-img>
        <p type="p">201:第一視窗</p>
        <p type="p">202:第二視窗</p>
        <p type="p">204:第三視窗</p>
        <p type="p">21:底座</p>
        <p type="p">211:安裝槽</p>
        <p type="p">212:卡槽</p>
        <p type="p">213:卡勾</p>
        <p type="p">214:防呆槽</p>
        <p type="p">215:定位槽</p>
        <p type="p">216:防呆定位部</p>
        <p type="p">22:蓋體</p>
        <p type="p">221:凹陷部</p>
        <p type="p">222:倒扣</p>
        <p type="p">223:防呆凸部</p>
        <p type="p">3:導電件</p>
        <p type="p">31:第一彈臂</p>
        <p type="p">311:第一導接部</p>
        <p type="p">32:第二彈臂</p>
        <p type="p">321:第二導接部</p>
        <p type="p">33:主體部</p>
        <p type="p">34:彎折部</p>
        <p type="p">35:定位片</p>
        <p type="p">351:弧形卡持部</p>
        <p type="p">352:凸包</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1269" publication-number="202624232">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624232</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131979</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗體或抗體-藥物偶聯物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">C07D491/22</main-classification>
        <further-classification edition="200601120260304B">C07D513/22</further-classification>
        <further-classification edition="200601120260304B">C07K5/02</further-classification>
        <further-classification edition="200601120260304B">C07D493/22</further-classification>
        <further-classification edition="200601120260304B">C07K16/28</further-classification>
        <further-classification edition="200601120260304B">C07K16/32</further-classification>
        <further-classification edition="201701120260304B">A61K47/68</further-classification>
        <further-classification edition="200601120260304B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商勁方醫藥科技(上海)股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENFLEET THERAPEUTICS (SHANGHAI) INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙吉辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, JICHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何向宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, XIANGYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周福生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, FUSHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧彥冬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YANDONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>厲玉梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YUMEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊華彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, HUABIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭靈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭　炯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAN, JIONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂　強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, QIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種抗體或抗體-藥物偶聯物。本發明的抗體-藥物偶聯物如式(I)所示。本發明採用親水性的連接子用於抗體-藥物偶聯物，實現了疏水性較強的藥物載荷與抗體的高效偶聯，所獲得抗體-藥物偶聯物具有較高親水性和穩定性，藥用前景良好。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="68px" width="115px" file="ed12146.JPG" alt="ed12146.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1270" publication-number="202624674">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624674</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132029</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於熔化金屬之火焰控制之設備及方法</chinese-title>
        <english-title>APPARATUS AND METHOD FOR FLAME CONTROL TO MELT METAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260310B">F27D21/02</main-classification>
        <further-classification edition="200601120260310B">F27D19/00</further-classification>
        <further-classification edition="201001120260310B">F27D99/00</further-classification>
        <further-classification edition="200601120260310B">F27B3/20</further-classification>
        <further-classification edition="200601120260310B">F27B3/28</further-classification>
        <further-classification edition="200601120260310B">F27B3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商氣體產品及化學品股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIR PRODUCTS AND CHEMICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西歐　艾瑞克Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, ERIC R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杭德蕭特　烈德雅各</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HENDERSHOT, REED JACOB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬克瓦納　阿南德庫馬爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAKWANA, ANANDKUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩　瓦爾米羅科雷亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SA, VALMIRO CORREIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳展俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於熔化金屬之設備、系統、及方法可以經組態以利用用於火焰控制之一方案來改善廢金屬之加熱，同時亦避免火焰衝擊液化金屬。實施例可以利用一或多個感測器來偵測待熔化之金屬之固體狀態或液體狀態，並調節從一爐之一或多個燃燒器輸出之火焰（例如，調節火焰之長度及/或方向），以說明所偵測之金屬狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus, system, and process for melting a metal can be configured to utilize a scheme for flame control to improve heating of scrap metal while also avoid flame impingement on liquified metal. Embodiments can utilize one or more sensors to detect a solid or liquid state of the metal to be melted and adjust the flame (e.g. adjust the length and/or direction of the flame) output from one or more burners of a furnace to account for the detected state of the metal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:設備</p>
        <p type="p">2:浴</p>
        <p type="p">3:燃燒器</p>
        <p type="p">5:底部</p>
        <p type="p">6:間隔開的壁</p>
        <p type="p">7:前壁</p>
        <p type="p">8:後壁</p>
        <p type="p">11:煙道</p>
        <p type="p">13:氣氛</p>
        <p type="p">20:電腦裝置</p>
        <p type="p">HST:控制評估裝置</p>
        <p type="p">S:感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1271" publication-number="202625792">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625792</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132083</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>針對降低能耗的使用級聯熱泵之半導體處理平台</chinese-title>
        <english-title>SEMICONDUCTOR PROCESSING PLATFORM USING CASCADED HEAT PUMPS FOR REDUCED ENERGY CONSUMPTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260311B">H10P95/90</main-classification>
        <further-classification edition="200601120260311B">F25B7/00</further-classification>
        <further-classification edition="200601120260311B">F25B30/06</further-classification>
        <further-classification edition="200601120260311B">F25B27/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪莉婭　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>D'ELIA, PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納斯曼　羅那得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NASMAN, RONALD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雅各布森　諾曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JACOBSON, NORMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古魯特戈易　詹姆士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GROOTEGOED, JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">系統包括一或更多半導體處理腔室、及處理流體供應系統，處理流體供應系統包括配置以接收來自第一流體來源之第一流體之輸入部分、以及配置以輸送受加熱的處理流體至一或更多半導體處理腔室之受加熱的流動部分，受加熱的處理流體係包括第一流體。廢棄物系統係配置以接收來自受加熱的流動部分、及∕或一或更多半導體處理腔室之熱廢棄物流體。級聯熱泵係包括來源迴路、及負載迴路，來源迴路係熱耦合至外部熱源。第一熱交換器係包括與輸入部分為流體連通之第一供應端流動路徑、及與負載迴路為流體連通之第一熱輸送端流動路徑，俾使熱交換器在第一流體進入受加熱的流動部分之前加熱第一流體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system includes one or more semiconductor processing chambers, and a processing fluid supply system which includes an input portion configured to receive a first fluid from a first fluid source, and a heated flow portion configured to deliver a heated processing fluid including the first fluid to the one or more semiconductor processing chambers. A waste system is configured to receive hot waste fluid from the heated flow portion and/or the one or more semiconductor processing chambers. Cascaded heat pumps include a source loop and a load loop, the source loop being thermally coupled to an external heat source. A first heat exchanger includes a first supply-side flow path in fluid communication with the input portion, and a first heat delivery-side flow path in fluid communication with the load loop such that the heat exchanger heats the first fluid before the first fluid enters the heated flow portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">106:沖洗管線</p>
        <p type="p">108,110:管線</p>
        <p type="p">321:管線</p>
        <p type="p">704,706,708:管線</p>
        <p type="p">710:空氣熱交換器</p>
        <p type="p">712:公共管線</p>
        <p type="p">714:返回管線</p>
        <p type="p">720:處理冷卻熱交換器</p>
        <p type="p">730:排出冷卻熱交換器</p>
        <p type="p">740:廢棄物熱交換器</p>
        <p type="p">3202:半導體處理模組</p>
        <p type="p">C:腔室</p>
        <p type="p">DIW:去離子水</p>
        <p type="p">H2:內嵌加熱器</p>
        <p type="p">HE2:熱交換器</p>
        <p type="p">HP1,HP2:熱泵</p>
        <p type="p">IN:排氣部入</p>
        <p type="p">OUT:排氣部出</p>
        <p type="p">PCW IN:處理冷卻水入口</p>
        <p type="p">PCW OUT:處理冷卻水出口</p>
        <p type="p">PMP3,PMP4,PMP5:泵</p>
        <p type="p">RT:再循環槽</p>
        <p type="p">WSO:廢棄物輸出</p>
        <p type="p">XT1,XT2:膨脹槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1272" publication-number="202624739">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624739</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132087</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製程腔室導電膜增層偵測器</chinese-title>
        <english-title>PROCESS CHAMBER CONDUCTIVE FILM BUILD-UP DETECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">G01N27/02</main-classification>
        <further-classification edition="200601120260312B">C23C16/44</further-classification>
        <further-classification edition="200601120260312B">C23C16/52</further-classification>
        <further-classification edition="200601120260312B">B08B9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓蒙得四世　愛德華Ｐ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMMOND IV, EDWARD P.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>甘古德　阿布希吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANGUDE, ABHIJIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧比歐　湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUBIO, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嘉萊許誠柯　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARACHTCHENKO, ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">處理腔室，包括處理容積、內部表面、感測器和控制系統。內部表面與處理容積之間有流體連通。該感測器耦合至內部表面，並包括與控制系統進行通訊耦合的電極。控制系統設置為向電極提供訊號，並根據該訊號確定處理腔室內部表面的電容或阻抗中的至少一項。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A processing chamber, including a processing volume, an interior surface, a sensor, and a control system. The interior surface is in fluid communication with the processing volume. The sensor is coupled to the interior surface and includes an electrode communicatively coupled to the control system. The control system is configured to supply a signal to the electrode and determine, based on the signal, at least one of a capacitance or an impedance of the interior surface of the processing chamber.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:處理腔室</p>
        <p type="p">101:基板</p>
        <p type="p">110:腔室主體</p>
        <p type="p">111:處理容積</p>
        <p type="p">113:牆壁</p>
        <p type="p">114:底部</p>
        <p type="p">115:蓋子</p>
        <p type="p">116:排氣口</p>
        <p type="p">120:基板支撐組件</p>
        <p type="p">130:控制系統</p>
        <p type="p">150:前級</p>
        <p type="p">151:牆壁</p>
        <p type="p">152:前級容積</p>
        <p type="p">153:節流閥</p>
        <p type="p">154:插入物</p>
        <p type="p">155:感測器</p>
        <p type="p">156:電極</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1273" publication-number="202625788">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625788</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132099</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於降低能量消耗的使用多個熱泵之半導體處理平台</chinese-title>
        <english-title>SEMICONDUCTOR PROCESSING PLATFORM USING PLURAL HEAT PUMPS FOR REDUCED ENERGY CONSUMPTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260312B">H10P95/00</main-classification>
        <further-classification edition="200601120260312B">F25B27/02</further-classification>
        <further-classification edition="200601120260312B">F25B30/06</further-classification>
        <further-classification edition="200601120260312B">F25B25/00</further-classification>
        <further-classification edition="200601120260312B">F25B30/04</further-classification>
        <further-classification edition="200601120260312B">F28D21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納斯曼　羅那得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NASMAN, RONALD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪莉婭　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>D'ELIA, PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雅各布森　諾曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JACOBSON, NORMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古魯特戈易　詹姆士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GROOTEGOED, JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">系統包括一或更多半導體處理腔室、及處理流體供應系統，處理流體供應系統包括配置以接收第一流體之輸入部分、以及配置以輸送受加熱的處理流體至一或更多半導體處理腔室之受加熱的流動部分，受加熱的處理流體係包括第一流體。廢棄物系統係配置以接收來自受加熱的流動部分、及∕或半導體處理腔室之熱廢棄物流體。複數熱泵係以串聯及∕或並聯的配置而連接，以提供公共來源迴路及公共負載迴路。公共來源迴路係熱耦合至外部熱源。第一熱交換器係包括與輸入部分為流體連通之第一供應端流動路徑、及與公共負載迴路為流體連通之第一熱輸送端流動路徑，俾使第一熱交換器加熱第一流體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system including one or more semiconductor processing chambers, and a processing fluid supply system including an input portion configured to receive a first fluid, and a heated flow portion configured to deliver a heated processing fluid comprising the first fluid to the one or more semiconductor processing chambers. A waste system is configured to receive hot waste fluid from the heated flow portion and/or the semiconductor processing chambers. A plurality of heat pumps are connected in series and/or parallel configuration to provide a common source loop and a common load loop. The common source loop is thermally coupled to an external heat source. A first heat exchanger including a first supply-side flow path in fluid communication with the input portion, and a first heat delivery-side flow path in fluid communication with the common load loop such that the first heat exchanger heats the first fluid.</p>
      </isu-abst>
      <representative-img>
        <p type="p">106:沖洗管線</p>
        <p type="p">108,110:管線</p>
        <p type="p">311,312,313,314:管線</p>
        <p type="p">704,706,708:管線</p>
        <p type="p">710:空氣熱交換器</p>
        <p type="p">712:公共管線</p>
        <p type="p">714:返回管線</p>
        <p type="p">720:處理冷卻熱交換器</p>
        <p type="p">730:排出冷卻熱交換器</p>
        <p type="p">740:廢棄物熱交換器</p>
        <p type="p">3102:半導體處理模組</p>
        <p type="p">C:腔室</p>
        <p type="p">DIW:去離子水</p>
        <p type="p">H2:內嵌加熱器</p>
        <p type="p">HE2:熱交換器</p>
        <p type="p">HP1,HP2:熱泵</p>
        <p type="p">IN:排氣部入</p>
        <p type="p">OUT:排氣部出</p>
        <p type="p">PCW IN:處理冷卻水入口</p>
        <p type="p">PCW OUT:處理冷卻水出口</p>
        <p type="p">PMP3,PMP4:泵</p>
        <p type="p">RT:再循環槽</p>
        <p type="p">WSO:廢棄物輸出</p>
        <p type="p">XT1,XT2:膨脹槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1274" publication-number="202625253">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625253</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132111</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>維持用於電漿處理的電漿之方法</chinese-title>
        <english-title>METHOD OF SUSTAINING PLASMA FOR PLASMA PROCESSING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">H01J37/32</main-classification>
        <further-classification edition="200601120260312B">H05H1/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　智穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ZHIYING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡魯思　梅根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARRUTH, MEGAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布萊克尼　喬爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BLAKENEY, JOEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡特薩克　彼得　洛威爾　喬治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VENTZEK, PETER LOWELL GEORGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯里德哈蘭　希亞姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SRIDHAR, SHYAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大秦充敬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHATA, MITSUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於電漿處理一基板的方法，包含：在一電漿處理腔室之中維持電漿，該電漿處理腔室包含一第一電極及一第二電極，其中維持該電漿的步驟包含：耦合一源訊號至該第一電極；及施加一偏壓訊號至該第二電極，該偏壓訊號具有包含多數個偏壓脈衝的一尖波波形，該些偏壓脈衝各者包含一基底持續時間的一DC基底電壓、及一三角形電壓尖波，該三角形電壓尖波具有從該基底電壓至一峰值電壓的一上升時間、及從該峰值電壓至該基底電壓的一下降時間，該上升時間、該下降時間、及該基底持續時間的和係包含一脈衝週期，該施加步驟包含：獨立地調整該上升時間及下降時間，以取得在入射該基板的一離子通量的一離子能量分布函數（IEDF）之中於一高模態能量的一模式的一窄能量展開度，該窄能量展開度包含該IEDF的高能量模式的第一寬度，其小於使用一矩形脈衝波形可取得的該IEDF的高能量模式的第二寬度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for plasma processing a substrate includes: sustaining a plasma in a plasma processing chamber, the plasma processing chamber including a first electrode and a second electrode, where sustaining the plasma includes: coupling a source signal to the first electrode; and applying a bias signal to the second electrode, the bias signal having a spike waveform including a plurality of bias pulses, each of the bias pulses including a DC base voltage for a base duration and a triangular voltage spike having a rise time from the base voltage to a peak voltage and a fall time from the peak voltage to the base voltage, a sum of the rise time, the fall time, and the base duration including a pulse period, the applying including: independently adjusting the rise time and fall time to obtain a narrow energy spread of a mode at a high modal energy in an ion energy distribution function (IEDF) of an ion flux incident on the substrate, the narrow energy spread including a first width of the high energy mode of the IEDF that is smaller than a second width of the high energy mode of the IEDF obtainable using a rectangular pulse waveform.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電漿設備</p>
        <p type="p">110:電漿處理腔室</p>
        <p type="p">112:第一電極</p>
        <p type="p">114:介電窗</p>
        <p type="p">116:壁</p>
        <p type="p">120:第一電路</p>
        <p type="p">122:第二電路</p>
        <p type="p">132:氣體入口</p>
        <p type="p">134:氣體出口</p>
        <p type="p">136:真空泵</p>
        <p type="p">140:基板</p>
        <p type="p">150:台座</p>
        <p type="p">152:平台</p>
        <p type="p">154:桿</p>
        <p type="p">156:第二電極</p>
        <p type="p">158:夾持電極</p>
        <p type="p">160:熱系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1275" publication-number="202623848">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623848</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132113</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>患者介面</chinese-title>
        <english-title>PATIENT INTERFACE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">A61M16/08</main-classification>
        <further-classification edition="200601120260303B">A61M16/12</further-classification>
        <further-classification edition="200601120260303B">A61M16/16</further-classification>
        <further-classification edition="200601120260303B">A61M16/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紐西蘭商費雪派克保健有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FISHER &amp; PAYKEL HEALTHCARE LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范沙爾克維克　安德烈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN SCHALKWYK, ANDRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧唐納　凱文　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>O'DONNELL, KEVIN PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩蒙　安德魯　Ｐ　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SALMON, ANDREW PAUL MAXWELL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>冷　辛宜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LENG, ASHLEY XIN YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魯斯特　娜塔莎　Ｇ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUST, NATASHA GAIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鼻介面(100)，該鼻介面包括：介面主體(110)，該介面主體被配置為與患者的鼻氣道基本上形成密封，該介面主體包括：氣體流動通道(125)；第一輸送元件(111)或第一輸送元件部分；第二輸送元件(112)或第二輸送元件部分；第一氣體端口(121)，該第一氣體端口位於該介面主體中；和第二氣體端口(122)，該第二氣體端口位於該介面主體中。該第一氣體端口(121)和該第二氣體端口(122)具有基本上相同的配置，使得第一呼吸部件(331)能夠選擇性地連接到該第一氣體端口(121)和該第二氣體端口(122)中的每一者，並且使得第二呼吸部件(332)能夠選擇性地連接到該第一氣體端口(121)和該第二氣體端口(122)中的每一者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A nasal interface (100) comprising an interface body (110) configured to substantially form a seal with a patient’s nasal airways, the interface body comprising a gases flow channel (125), a first delivery element (111) or a first delivery element portion, a second delivery element (112) or a second delivery element portion, a first gases port (121) in the interface body and a second gases port (122) in the interface body. The first gases port (121) and the second gases port (122) have substantially the same configuration such that a first respiratory component (331) can be selectively connected to each of the first gases port (121) and the second gases port (122), and such that a second respiratory component (332) can be selectively connected to each of the first gases port (121) and to the second gases port (122).</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:患者介面</p>
        <p type="p">100:配置鼻介面；鼻介面</p>
        <p type="p">101:剛性側臂；一側上的結構</p>
        <p type="p">102:剛性側臂；一側上的結構</p>
        <p type="p">111:第一輸送元件；鼻輸送元件；輸送元件；第一鼻輸送元件；鼻輸送元件</p>
        <p type="p">112:第二輸送元件；鼻輸送元件；輸送元件；二鼻輸送元件；鼻輸送元件</p>
        <p type="p">120:氣體歧管；介面框架；框架部分；歧管；框架</p>
        <p type="p">121:第一氣體端口；氣體入口；氣體端口</p>
        <p type="p">122:第二氣體端口；氣體端口</p>
        <p type="p">200:聯接帶；帶；頭套；頭帶；頭套帶</p>
        <p type="p">201:端部部分；頭套端部部分</p>
        <p type="p">202:端部部分；頭套端部部分</p>
        <p type="p">300:呼吸導管；氣體導管；導管；第一氣體導管</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1276" publication-number="202625735">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625735</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132122</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶圓模擬板</chinese-title>
        <english-title>WAFER SIMULATION PLATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260312B">H10P72/00</main-classification>
        <further-classification edition="200601120260312B">G01L7/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡桑皮爾拜　阿利亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KASSAM PIRBHAI, ALIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施例描述了一種用於在處理期間模擬晶圓的設備。該設備包括具有頂表面和底表面的板。該設備包括一或多個光學應變計。一或多個光學應變計中的每一者的光纖被設置在頂表面與底表面之間的板內。每條光纖被配置為測量在晶圓清洗製程期間施加於板的一部分的壓力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the disclosure describe an apparatus for simulating a wafer during processing. The apparatus includes a plate having a top surface and a bottom surface. The apparatus includes one or more optical strain gauges. An optical fiber of each of the one or more optical strain gauges is disposed within the plate between the top surface and the bottom surface. Each optical fiber is configured to measure a pressure applied to a portion of the plate during a wafer cleaning process.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:晶圓模擬板</p>
        <p type="p">110:晶圓模擬板</p>
        <p type="p">120:光學應變計</p>
        <p type="p">120A:第一光學應變計</p>
        <p type="p">120B:第二光學應變計</p>
        <p type="p">122:光纖</p>
        <p type="p">122A:第一光纖</p>
        <p type="p">122B:第二光纖</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1277" publication-number="202625634">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625634</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132136</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有帶電子氣體層的陰極的ＵＶ－ＬＥＤ</chinese-title>
        <english-title>UV-LED WITH CATHODE WITH ELECTRON GAS LAYER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260309B">H10H20/833</main-classification>
        <further-classification edition="202501120260309B">H10H20/00</further-classification>
        <further-classification edition="202501120260309B">H10H20/831</further-classification>
        <further-classification edition="202501120260309B">H10H20/857</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商西拉娜ＵＶ科技私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILANNA UV TECHNOLOGIES PTE LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼科爾斯　喬丹　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NICHOLLS, JORDAN ROY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞坦艾柯維克　比塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ATANACKOVIC, PETAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種LED(例如，UV-LED)結構包括基板、第一陰極層、第二陰極層、發光層、陽極層、陽極接觸及陰極接觸。該第一陰極層具有第一鋁組成。該第二陰極層安置於該第一陰極層之頂部上，且具有大於該第一鋁組成的第二鋁組成。在LED結構的操作期間，在該第一陰極層與該第二陰極層之間的界面處形成二維電子氣體(2DEG)層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An LED (e.g., a UV-LED) structure includes a substrate, a first cathode layer, a second cathode layer, a light emitting layer, an anode layer, an anode contact, and a cathode contact. The first cathode layer has a first aluminum composition. The second cathode layer is disposed on top of the first cathode layer and has a second aluminum composition greater than the first aluminum composition. A two-dimensional electron gas (2DEG) layer is formed at an interface between the first cathode layer and the second cathode layer during operation of the LED structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體發光結構</p>
        <p type="p">102:基板</p>
        <p type="p">104:緩衝層</p>
        <p type="p">106:陰極下層</p>
        <p type="p">108:陰極接觸層</p>
        <p type="p">110:發光層</p>
        <p type="p">112:陽極層</p>
        <p type="p">114:陰極金屬層</p>
        <p type="p">116:陽極金屬層</p>
        <p type="p">118:2DEG層</p>
        <p type="p">120:陰極結構</p>
        <p type="p">122:部分</p>
        <p type="p">124:第一(側向)部分</p>
        <p type="p">126:第二(側向)部分</p>
        <p type="p">128:箭頭</p>
        <p type="p">130:箭頭</p>
        <p type="p">132:箭頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1278" publication-number="202623847">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623847</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132137</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>患者介面</chinese-title>
        <english-title>PATIENT INTERFACE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">A61M16/06</main-classification>
        <further-classification edition="200601120260304B">A61M16/08</further-classification>
        <further-classification edition="200601120260304B">A61M16/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紐西蘭商費雪派克保健有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FISHER &amp; PAYKEL HEALTHCARE LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范沙爾克維克　安德烈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN SCHALKWYK, ANDRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧唐納　凱文　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>O'DONNELL, KEVIN PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩蒙　安德魯　Ｐ　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SALMON, ANDREW PAUL MAXWELL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>冷　辛宜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LENG, ASHLEY XIN YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魯斯特　娜塔莎　Ｇ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUST, NATASHA GAIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鼻介面(100)，該鼻介面包括介面主體(110)，該介面主體包括：氣流通道(125)；第一鼻輸送元件(111)；第二鼻輸送元件(112)；和第一氣體端口(121)，該第一氣體端口位於該介面主體(110)中。該第一鼻輸送元件(111)和該第二鼻輸送元件(112)是非密封鼻輸送元件。偏流通氣口(340)用於使得呼出氣體能夠排出該介面主體(110)。其中該鼻介面(100)被配置爲在患者的鼻氣道處產生不對稱氣流。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A nasal interface (100) comprising an interface body (110) comprising a gases flow channel (125), a first nasal delivery element (111), a second nasal delivery element (112), and a first gases port (121) in the interface body (110). The first nasal delivery element (111) and second nasal delivery element (112) being a non-sealing nasal delivery element. A bias flow vent (340) for enabling exhaled gases to be expelled out of the interface body (110). Wherein the nasal interface (100) is configured to create an asymmetric flow of gases at a patient’s nasal airways.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:患者介面</p>
        <p type="p">100:鼻介面</p>
        <p type="p">101:側臂</p>
        <p type="p">102:側臂</p>
        <p type="p">110:介面主體</p>
        <p type="p">111:鼻輸送元件</p>
        <p type="p">112:鼻輸送元件</p>
        <p type="p">118:基底部分</p>
        <p type="p">120:框架</p>
        <p type="p">121:氣體入口端口</p>
        <p type="p">122:氣體出口端口</p>
        <p type="p">200:頭套</p>
        <p type="p">300:導管</p>
        <p type="p">1005:頭套連接部分</p>
        <p type="p">1006:頭套連接部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1279" publication-number="202624270">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624270</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132139</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>治療劑</chinese-title>
        <english-title>THERAPEUTIC AGENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">C07K16/28</main-classification>
        <further-classification edition="200601120260304B">C07K14/54</further-classification>
        <further-classification edition="200601120260304B">A61K39/395</further-classification>
        <further-classification edition="200601120260304B">A61K38/20</further-classification>
        <further-classification edition="200601120260304B">A61P1/04</further-classification>
        <further-classification edition="200601120260304B">A61P29/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商旗艦先鋒創新有限責任(ＶＩＩ)公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLAGSHIP PIONEERING INNOVATIONS VII, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布拉姆　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BLOM, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡爾森　史考特　摩爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARLSON, SCOTT MOORE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡馬特　維沙爾　戈帕爾克里希納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMAT, VISHAL GOPALKRISHNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯哈爾　維維克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOHAR, VIVEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　奇旺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHI-WANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, YUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邢常瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XING, CHANGRUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴　蜜雪兒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, MICHELLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恰斯拉夫斯庫　約瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CASLAVSKY, JOSEF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮圖爾　帕維爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PITULE, PAVEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熱佩茨基　尤里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RZHEPETSKYY, YURIY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>UA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了抗體及其抗原結合部分。還提供了含有該等抗體及其抗原結合部分的大分子。提供了使用該等抗體及其抗原結合部分以及使用該等大分子的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Antibodies and antigen binding portions thereof are described. Macromolecules containing the antibodies and antigen binding portions thereof are also provided. Methods of using the antibodies and antigen binding portions thereof, and of using the macromolecules are provided.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1280" publication-number="202624007">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624007</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132142</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積層體、光學元件積層體、光學物品、鏡片、眼鏡、及窗用薄膜</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">B32B27/08</main-classification>
        <further-classification edition="200601120260302B">B32B27/20</further-classification>
        <further-classification edition="200601120260302B">B32B27/40</further-classification>
        <further-classification edition="201901120260302B">B32B7/06</further-classification>
        <further-classification edition="200601120260302B">G02B3/00</further-classification>
        <further-classification edition="200601120260302B">G02B5/23</further-classification>
        <further-classification edition="200601120260302B">G02C7/10</further-classification>
        <further-classification edition="200601120260302B">G02C7/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商德山股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKUYAMA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水康智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, YASUTOMO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小野塚遼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONOZUKA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桐山萌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIRIYAMA, MOE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種積層體，其具備：功能性薄膜，其具有第1主面及第2主面且包含功能性色素及胺酯系樹脂；接著層，其與功能性薄膜的第1主面密合；第1剝離材料，其將接著層被覆且能夠從接著層剝離；及第2剝離材料，其將功能性薄膜的第2主面被覆且能夠從功能性薄膜剝離；且任意地進一步具備：保護層，其位於功能性薄膜與第2剝離材料之間且與功能性薄膜的第2主面密合；上述胺酯系樹脂包含：從由聚胺酯樹脂、聚胺酯脲樹脂、聚硫代胺酯樹脂及聚硫代胺酯脲樹脂所組成的群組中選出的至少1種樹脂。此外，提供一種能夠使用該積層體來製造的光學元件積層體、包含該光學元件積層體的光學物品、鏡片、及眼鏡、以及包含該積層體的窗用薄膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第1積層體</p>
        <p type="p">2:功能性薄膜</p>
        <p type="p">2a:第1主面</p>
        <p type="p">2b:第2主面</p>
        <p type="p">3:第1剝離材料</p>
        <p type="p">4:第2剝離材料</p>
        <p type="p">5:接著層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1281" publication-number="202623804">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623804</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132148</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種吡唑類衍生物抑制劑的醫藥組成物及製備方法</chinese-title>
        <english-title>A PHARMACEUTICAL COMPOSITION AND PREPARATION METHOD OF PYRAZOLE DERIVATIVE INHIBITORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">A61K31/4995</main-classification>
        <further-classification edition="200601120260304B">A61K47/38</further-classification>
        <further-classification edition="200601120260304B">A61K47/26</further-classification>
        <further-classification edition="200601120260304B">A61K47/36</further-classification>
        <further-classification edition="200601120260304B">A61K47/02</further-classification>
        <further-classification edition="200601120260304B">A61K47/12</further-classification>
        <further-classification edition="200601120260304B">A61K9/20</further-classification>
        <further-classification edition="200601120260304B">A61K9/48</further-classification>
        <further-classification edition="200601120260304B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商江蘇豪森藥業集團有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANGSU HANSOH PHARMACEUTICAL GROUP CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海翰森生物醫藥科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI HANSOH BIOMEDICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李靜靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JINGJING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑋琦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEIQI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬東偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAN, DONGWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳曉茹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, XIAORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐翰林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, HANLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種式(I)化合物或其藥學上可接受的鹽或晶型形式的醫藥組成物及製備方法。該醫藥組成物用於製備治療晚期實體瘤藥物中的用途。本發明醫藥組成物穩定性高、溶出速度快，並且具有良好的流動性，便於工業化生產。</p>
        <p type="p">
        &lt;figure&gt;
          &lt;img align="absmiddle" height="147px" width="373px" file="d10001.TIF" alt="化學式ed10001.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10001.png"&gt;
          &lt;/img&gt;
        &lt;/figure&gt;
      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a pharmaceutical composition and preparation method of a compound of formula (I) or a pharmaceutically acceptable salt or crystal form thereof. The drug combination is used for the preparation of drugs for the treatment of advanced solid tumors. The pharmaceutical composition of the present invention has high stability, fast dissolution rate, and good fluidity, making it easy for industrial production.</p>
        <p type="p">
        &lt;figure&gt;
          &lt;img align="absmiddle" height="143px" width="324px" file="d10003.TIF" alt="化學式ed10003.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10003.png"&gt;
          &lt;/img&gt;
        &lt;/figure&gt;
      </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1282" publication-number="202623793">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623793</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132180</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療阻塞性睡眠呼吸中止症的醫藥組合物</chinese-title>
        <english-title>PHARMACEUTICAL COMPOSITIONS FOR USE IN TREATING OBSTRUCTIVE SLEEP APNEA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">A61K31/21</main-classification>
        <further-classification edition="200601120260304B">A61K31/05</further-classification>
        <further-classification edition="200601120260304B">A61P11/00</further-classification>
        <further-classification edition="200601120260304B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康霈生技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CALIWAY BIOPHARMACEUTICALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凌玉芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LING, YU-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭志玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於緩解與阻塞性睡眠呼吸中止症（obstructive sleep apnea，OSA）相關症狀之方法，該方法包括對有此需要的個體施用有效量之醫藥組合物，該組合物包含：(a) 白藜蘆醇化合物及/或薑黃素化合物；及(b) 醫藥上可接受之載劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for alleviating a symptom associated with obstructive sleep apnea (OSA), the method comprising administering to a subject in need thereof an effective amount of a pharmaceutical composition, which comprises: (a) a resveratrol compound and/or a curcumin compound; and (b) a pharmaceutically acceptable carrier.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1283" publication-number="202624577">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624577</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132222</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>針對於氣體耗竭和氣體濃度可調節性的空間氣體注入，以及相關的處理腔室、設備和方法</chinese-title>
        <english-title>SPATIAL GAS INJECTION FOR GAS DEPLETION AND GAS CONCENTRATION ADJUSTABILITY, AND RELATED PROCESSING CHAMBERS, APPARATUS, AND METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">C30B25/14</main-classification>
        <further-classification edition="200601120260309B">C30B25/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　樹坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAU, SHU-KWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕蒂爾　阿尼克尼汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATIL, ANIKETNITIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩理納斯　馬丁傑佛瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SALINAS, MARTIN JEFFREY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達摩哈朗　拉傑穆拉里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DHAMODHARAN, RAJA MURALI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫拉迪安　雅拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORADIAN, ALA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>叢　者澎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CONG, ZHEPENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及用於氣體耗竭和氣體濃度可調節性的氣體注入，以及相關的腔室套件、方法和處理腔室。在一或多個實施例中，基板處理腔室包含至少部分限定內部體積的腔室主體。基板支撐件設置在該內部體積中。該處理腔室進一步包含注射器，該注射器可操作以將一或多種製程氣體注入該內部體積的處理體積中；以及空間注射器，該空間注射器可操作以在該基板支撐件的外邊緣的徑向向內的位置處，將一或多種第一補充氣體提供到該處理體積中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to gas injection for gas depletion and gas concentration adjustability, and related chamber kits, methods, and processing chambers. In one or more embodiments, a substrate processing chamber includes a chamber body at least partially defining an internal volume. A substrate support is disposed in the internal volume. The processing chamber further includes an injector operable to provide one or more process gases into a processing volume of the internal volume and a spatial injector operable to provide one or more first supplemental gases into the processing volume at a location radially inwardly of an outer edge of the substrate support.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:基板</p>
        <p type="p">106:基板支撐件</p>
        <p type="p">107:升舉銷穿孔</p>
        <p type="p">108:上板</p>
        <p type="p">110:下板</p>
        <p type="p">112:流動模組</p>
        <p type="p">116:排氣出口</p>
        <p type="p">118:軸</p>
        <p type="p">120:控制器</p>
        <p type="p">121:運動組件</p>
        <p type="p">132:升舉銷</p>
        <p type="p">136:處理體積</p>
        <p type="p">138:淨化體積</p>
        <p type="p">141:上加熱源</p>
        <p type="p">143:下加熱源</p>
        <p type="p">145:下加熱源模組</p>
        <p type="p">148:主體</p>
        <p type="p">151:製程氣體源</p>
        <p type="p">152:地板</p>
        <p type="p">153:清潔氣體源</p>
        <p type="p">154:蓋子</p>
        <p type="p">155:上加熱源模組</p>
        <p type="p">156:上部主體</p>
        <p type="p">157:排氣泵</p>
        <p type="p">162:淨化氣體源</p>
        <p type="p">164:淨化氣體入口</p>
        <p type="p">178:排氣系統</p>
        <p type="p">230:開口</p>
        <p type="p">302:預熱環</p>
        <p type="p">304:停止件</p>
        <p type="p">305a:臂</p>
        <p type="p">305b:臂</p>
        <p type="p">311:第二襯墊</p>
        <p type="p">1000:處理腔室</p>
        <p type="p">1010:板注射器</p>
        <p type="p">1011:突片延伸部</p>
        <p type="p">1015:注射器</p>
        <p type="p">1020:第一襯墊</p>
        <p type="p">1036:遠端體積</p>
        <p type="p">1111:第一面</p>
        <p type="p">1112:第二面</p>
        <p type="p">1113:通道</p>
        <p type="p">P1:製程氣體</p>
        <p type="p">P2:淨化氣體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1284" publication-number="202625254">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625254</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132229</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於處理腔室的電漿產生器和噴射器組件及相關方法</chinese-title>
        <english-title>PLASMA GENERATOR AND INJECTOR ASSEMBLY FOR A PROCESSING CHAMBER, AND RELATED METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">H01J37/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索旺　穆赫勒斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOWWAN, MUKHLES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JO</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　樹坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAU, SHU-KWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>昌德拉施卡爾　阿比謝科卡瑪克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANDRASHEKAR, ABHISHEK KALLMAKKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達摩哈朗　拉傑穆拉里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DHAMODHARAN, RAJA MURALI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯瑪士　尚恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THOMAS, SHAWN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬柏　索拉貝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOPRA, SAURABH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>烏魯爾　厄耐斯托Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ULLOA, ERNESTO J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴倫迪克　亨利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARANDICA, HENRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　勁文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, KELVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡　泰正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUA, THAI CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法札德　浩許曼德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FARZAD, HOUSHMAND</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的具體實施例通常涉及用於基板處理腔室的電漿產生器和噴射器組件。在一或多個實施例中，基板處理腔室包括腔室主體，腔室主體至少部分定義內部體積。處理腔室進一步包含電漿產生器，包括用以拆散弄產生電力的第一外殼以及耦合於第一外殼的第二外殼，以至少部分定義第二外殼和第一外殼之間的電漿體積。氣體進口通過第二外殼延伸至電漿體積。該氣體進口配置為能流體耦合至氣體源。噴射器與電漿產生器流體連接。噴射器包括一或多個開口，開口排列於一或多個通道中。安裝臂包括耦合至噴射器的第一端段，以及耦合至第二外殼的第二端段。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure generally relate to plasma generator and injector assembly for use in a processing chamber. In one or more embodiments, a substrate processing chamber includes a chamber body at least partially defining an internal volume. The processing chamber further includes a plasma generator including a first housing to deliver a generation power and a second housing coupled to the first housing to at least partially define a plasma volume between the second housing and the first housing. A gas inlet extends through the second housing to the plasma volume. The gas inlet is configured to be fluidly coupled to a gas source. An injector is fluidly connected to the plasma generator. The injector includes one or more openings arranged in one or more channels. A mount arm includes a first end section coupled to the injector and a second end section coupled to the second housing.</p>
      </isu-abst>
      <representative-img>
        <p type="p">170:電漿產生器</p>
        <p type="p">180:噴射器</p>
        <p type="p">212:通道</p>
        <p type="p">214:通道</p>
        <p type="p">215:前表面</p>
        <p type="p">216:通道</p>
        <p type="p">220:體</p>
        <p type="p">245:第二外殼</p>
        <p type="p">255:第一外殼</p>
        <p type="p">265:電漿管</p>
        <p type="p">280:擋板</p>
        <p type="p">300:噴射器組件</p>
        <p type="p">310:電源適配器部分</p>
        <p type="p">312:電源適配器區塊</p>
        <p type="p">315:電纜進口</p>
        <p type="p">317:冷卻液進口</p>
        <p type="p">318:冷卻液出口</p>
        <p type="p">320:電漿氣體進口部分</p>
        <p type="p">322:氣體適配塊</p>
        <p type="p">325:氣體進口適配器</p>
        <p type="p">330:噴射器氣體進口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1285" publication-number="202625580">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625580</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132230</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260306B">H10D30/40</main-classification>
        <further-classification edition="202501120260306B">H10D62/13</further-classification>
        <further-classification edition="202601120260306B">H10W20/40</further-classification>
        <further-classification edition="202501120260306B">H10D64/27</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAO, JIUN-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣裕和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, YU-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪文強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, WEN-CHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳亭綱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TING-GANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃淵聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YUAN-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JYH-HUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭价言</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, JYE-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種半導體結構的形成方法，包括形成鰭片；在鰭片中形成第一及第二源極/汲極溝槽；分別在第一及第二源極/汲極溝槽中形成第一及第二半導體材料層；及分別在第一及第二源極/汲極溝槽中於第一及第二半導體材料層上形成第一及第二源極/汲極特徵。上述方法更包括翻轉半導體結構；在基板後側上形成硬遮罩層；蝕刻硬遮罩層與基板以形成曝露第一半導體材料層的第一開口；在第一開口的側壁上形成絕緣層；移除第一半導體材料層以形成曝露第一源極/汲極特徵的第二開口；及在第一與第二開口中沉積導電材料以形成第一源極/汲極接點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of forming a semiconductor structure includes forming a fin structure; forming first and second source/drain trenches in the fin structure; forming first and second semiconductor material layers in the first and second source/drain trenches, respectively; and forming first and second source/drain features over the first and second semiconductor material layers in the first and second source/drain trenches, respectively. The method further includes flipping the semiconductor structure; forming a hard mask layer on a backside of the substrate; etching the hard mask layer and the substrate to form a first opening that exposes the first semiconductor material layer; forming an insulating layer on a sidewall of the first opening; removing the first semiconductor material layer to form a second opening that exposes the first source/drain feature; and depositing a conductive material in the first and second openings to form a first source/drain contact.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:工作件</p>
        <p type="p">102:基板</p>
        <p type="p">108:半導體層</p>
        <p type="p">124:閘極間隔物</p>
        <p type="p">128:內部間隔物</p>
        <p type="p">130:半導體材料層</p>
        <p type="p">132:底部隔離層</p>
        <p type="p">134:源極/汲極特徵</p>
        <p type="p">136:第一磊晶層</p>
        <p type="p">138:第二磊晶層</p>
        <p type="p">140:接觸蝕刻停止層</p>
        <p type="p">150:閘極結構</p>
        <p type="p">152:界面層</p>
        <p type="p">154:閘極介電層</p>
        <p type="p">156:閘極電極層</p>
        <p type="p">160:源極/汲極接點</p>
        <p type="p">162:矽化物層</p>
        <p type="p">170:硬遮罩層</p>
        <p type="p">178:絕緣層</p>
        <p type="p">184:側壁介電層</p>
        <p type="p">188:導電材料</p>
        <p type="p">190:源極/汲極接點</p>
        <p type="p">190A:第一部分</p>
        <p type="p">190B:第二部分</p>
        <p type="p">A-A’:線段</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1286" publication-number="202625506">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625506</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132251</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電漿處理裝置及RF產生器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">H05H1/46</main-classification>
        <further-classification edition="200601120260312B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鳥井夏実</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORII, NATSUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能高效產生RF信號之技術。本發明之電漿處理裝置具備腔室及RF產生器，該RF產生器構成為產生RF信號，且包含：DC電源；共振電路；隔離電路，其構成為自DC電源向共振電路供給電流，並且阻止共振能量自共振電路向DC電源傳遞；電容器，其電性連接於共振電路之輸出；及切換電路，其在斷開狀態下，共振能量儲蓄於共振電路，在接通狀態下，具有共振頻率之RF信號於共振電路與切換電路之間持續振盪。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電漿處理裝置</p>
        <p type="p">2:控制部</p>
        <p type="p">2a:電腦</p>
        <p type="p">2a1:處理部</p>
        <p type="p">2a2:記憶部</p>
        <p type="p">2a3:通信介面</p>
        <p type="p">10:電漿處理腔室</p>
        <p type="p">10a:側壁</p>
        <p type="p">10e:氣體排出口</p>
        <p type="p">10s:電漿處理空間</p>
        <p type="p">11:基板支持部</p>
        <p type="p">13:簇射頭</p>
        <p type="p">13a:氣體供給口</p>
        <p type="p">13b:氣體擴散室</p>
        <p type="p">13c:氣體導入口</p>
        <p type="p">20:氣體供給部</p>
        <p type="p">21:氣體源</p>
        <p type="p">22:流量控制器</p>
        <p type="p">30:電源系統</p>
        <p type="p">31:電源</p>
        <p type="p">31a:第1RF產生部</p>
        <p type="p">31b:第2RF產生部</p>
        <p type="p">32:電源</p>
        <p type="p">32a:第1電壓產生部</p>
        <p type="p">32b:第2電壓產生部</p>
        <p type="p">40:排氣系統</p>
        <p type="p">111:本體部</p>
        <p type="p">111a:中央區域(基板支持面)</p>
        <p type="p">111b:環狀區域(環支持面)</p>
        <p type="p">112:環組件</p>
        <p type="p">1110:基台</p>
        <p type="p">1110a:流路</p>
        <p type="p">1111:靜電吸盤</p>
        <p type="p">1111a:陶瓷構件</p>
        <p type="p">1111b:靜電吸盤電極</p>
        <p type="p">W:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1287" publication-number="202624052">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624052</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132267</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>車輛上坡保持控制系統及其方法</chinese-title>
        <english-title>A SYSTEM FOR HILL HOLD CONTROL IN A VEHICLE AND A METHOD FOR THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">B60T13/68</main-classification>
        <further-classification edition="200601120260309B">B60T13/66</further-classification>
        <further-classification edition="200601120260309B">B60T8/32</further-classification>
        <further-classification edition="200601120260309B">B60T1/06</further-classification>
        <further-classification edition="200601120260309B">B60T7/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商羅伯特　博世有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROBERT BOSCH GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>印度商博世全球軟體科技私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOSCH GLOBAL SOFTWARE TECHNOLOGIES PRIVATE LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維蘇瓦薩姆　班傑明　維傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VISUVASAM, BENJAMIN VIJAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫漢　克里希納斯瓦米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOHAN, KRISHNASWAMY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種車輛上坡保持控制系統122。該系統122包含至少一個液壓管路106，該至少一個液壓管路通過總泵(master cylinder)102及比例閥(proportionate valve)112將煞車致動器104流通地連接至車輪之煞車108，其特徵在於，開關閥118定位於該總泵102與該比例閥112之間。該開關閥118可由控制器120在閉合位置及打開位置中操作以保持及釋放該煞車108。駕駛員/騎行者通常依需要（使用者驅動）累積用於上坡保持功能之壓力且由該控制器120鎖定以實現該上坡保持功能。鎖定壓力後，駕駛員不再需要對煞車桿/踏板施加持續力來實現該上坡保持功能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system 122 for hill hold control in the vehicle is disclosed. The system 122 comprises at least one hydraulic circuit 106 fluidly connecting the brake actuator 104 to brake 108 of the wheel through the master cylinder 102 and the proportionate valve 112, characterized in that, a switching valve 118 positioned between the master cylinder 102 and the proportionate valve 112. The switching valve 118 operable by a controller 120 in a closed position and an open position to hold and release the brake 108. The driver/rider usually builds up pressure for hill hold function as appropriate (user driven) and is locked by the controller 120 for the hill hold function. Post locking of pressure, driver no longer need to apply sustained force on the brake lever/pedal for the hill hold function.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:習知設置</p>
        <p type="p">102:總泵</p>
        <p type="p">104:煞車致動器</p>
        <p type="p">106:液壓管路</p>
        <p type="p">108:煞車</p>
        <p type="p">110:車輪</p>
        <p type="p">112:比例閥</p>
        <p type="p">114:止回閥</p>
        <p type="p">116:馬達</p>
        <p type="p">118:開關閥</p>
        <p type="p">120:控制器</p>
        <p type="p">122:系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1288" publication-number="202624196">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624196</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132292</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於製備β－胺基醇之方法</chinese-title>
        <english-title>PROCESS FOR PREPARING β-AMINOALCOHOLS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07C213/04</main-classification>
        <further-classification edition="200601120260302B">C07C213/10</further-classification>
        <further-classification edition="200601120260302B">C07C215/08</further-classification>
        <further-classification edition="200601120260302B">C07C215/42</further-classification>
        <further-classification edition="200601120260302B">C07D207/04</further-classification>
        <further-classification edition="200601120260302B">C07D211/06</further-classification>
        <further-classification edition="200601120260302B">C07D295/084</further-classification>
        <further-classification edition="200601120260302B">C07D295/088</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商亞比馬利股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALBEMARLE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷曼　小威廉Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAYMAN, JR., WILLIAM J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示一種方法。該方法可包括自環氧化物及胺製備β-胺基醇。該方法可進一步包含集中之原子高效之工業規模方法，其中該胺與該環氧化物之比率介於約1.1:1.0與1.0:1.1之間或更窄。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A process is disclosed. The process can include the preparation of β-aminoalcohols from an epoxide and an amine. The process can further comprise a concentrated, atomefficient industrial scale process where the amine and the epoxide are in a ratio of between about 1.1:1.0 and 1.0:1.1, or narrower.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1289" publication-number="202625294">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625294</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132334</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>天線裝置及其製造方法</chinese-title>
        <english-title>ANTENNA DEVICE AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">H01Q1/38</main-classification>
        <further-classification edition="202601120260302B">H10W76/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>創未來科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRON FUTURE TECH INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠能</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN-NENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡瀚文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, HAN-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳道明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, DAO-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪榮宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃愷</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種形成天線裝置的方法，包括：接收由玻璃形成的基板；及形成重布層在該基板上。該重布層的該形成包括：沉積第一金屬化層在該基板的第一表面上；沉積第一圖案化介電層在該第一金屬化層上，其中該第一圖案化介電層具有第一厚度；及沉積第二金屬化層在該第一圖案化介電層上；及形成第二圖案化介電層在該第二金屬化層上。該第二圖案化介電層包含感光型介電材料。該第二圖案化介電層具有至少為該第一厚度的兩倍的第二厚度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of forming an antenna device includes: receiving a substrate formed of glass; and forming a redistribution layer (RDL) over the substrate. The formation of the RDL includes: depositing a first metallization layer over a first surface of the substrate; depositing a first patterned dielectric layer over the first metallization layer, wherein the first patterned dielectric layer has a first thickness; depositing a second metallization layer over the first patterned dielectric layer; and forming a second patterned dielectric layer over the second metallization layer. The second dielectric layer comprises a photoimageable dielectric (PID) material. The second patterned dielectric layer has a second thickness at least twice the first thickness.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:相位陣列天線</p>
        <p type="p">202:基板、基板單元</p>
        <p type="p">202C:訊號通道</p>
        <p type="p">204:重布層</p>
        <p type="p">206:天線貼片</p>
        <p type="p">210:連接件</p>
        <p type="p">D0:黏合層</p>
        <p type="p">D1:第一介電層</p>
        <p type="p">D2:第二介電層</p>
        <p type="p">D3:第三介電層</p>
        <p type="p">D4:第四介電層</p>
        <p type="p">H1,H2,H3:厚度</p>
        <p type="p">H&lt;sub&gt;M&lt;/sub&gt;:主要厚度</p>
        <p type="p">H&lt;sub&gt;S&lt;/sub&gt;:厚度總和</p>
        <p type="p">H&lt;sub&gt;T&lt;/sub&gt;:總厚度</p>
        <p type="p">M1:第一金屬化層</p>
        <p type="p">M2:第二金屬化層</p>
        <p type="p">M2V,M3V,M4V:導電通孔</p>
        <p type="p">M3:第三金屬化層</p>
        <p type="p">M4:第四金屬化層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1290" publication-number="202625513">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625513</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132336</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用金屬有機分解墨水膜所形成的金屬化結構及用於製備其之方法</chinese-title>
        <english-title>METALLIZED STRUCTURES FORMED USING METAL ORGANIC DECOMPOSITION INK FILMS AND METHODS FOR PREPARING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">H05K1/09</main-classification>
        <further-classification edition="201401120260312B">C09D11/52</further-classification>
        <further-classification edition="200601120260312B">C23C18/02</further-classification>
        <further-classification edition="202601120260312B">H10P14/46</further-classification>
        <further-classification edition="202601120260312B">H10P95/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商電子墨水股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELECTRONINKS INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃克　Ｓ　Ｂ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WALKER, S. BRETT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊米厄　墨爾本</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEMIEUX, MELBURNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文森　麥可　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VINSON, MICHAEL RILEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>漢納尼　西瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANNANI, SIMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邁思勤　伊森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUYSKENS, ETHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亨德森　勞倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HENDERSON, LAUREN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顧遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GU, YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>豪拉德　禪丹　Ｑ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOWLADER, CHANDAN QUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小澤和貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OZAWA, KAZUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供用於金屬化目標基體之材料及方法以及根據此等方法形成之金屬化結構。該等方法通常涉及在一目標基體上形成一導電晶種層。該導電晶種層使用一導電墨水組成物形成，該導電墨水組成物在該目標基體上轉化為一導電金屬膜。接著使用諸如電鍍之標準加成技術金屬化該導電金屬膜。該等方法可進一步包括掩蔽及去掩蔽步驟以及金屬化表面之任擇蝕刻以產生導電圖案化結構。亦提供金屬化結構，其包含位於該目標基體上之一導電晶種層及位於該導電晶種層上之一金屬化層。在一些情況下，該等金屬化結構根據所揭露之方法製備。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Materials and methods for metallizing target substrates and metallized structures formed according to these methods are provided. The methods generally involve the formation of a conductive seed layer on a target substrate. The conductive seed layer is formed using a conductive ink composition that is converted to a conductive metallic film on the target substrate. The conductive metallic film is then metallized using standard additive techniques such as electroplating. The methods can further include masking and unmasking steps and optional etching of the metallized surface to generate conductive patterned structures. Also provided are metallized structures that comprise a conductive seed layer on the target substrate and a metallized layer on the conductive seed layer. In some cases, the metallized structures are prepared according to the disclosed methods.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1291" publication-number="202625255">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625255</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132342</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基體處理裝置</chinese-title>
        <english-title>APPARATUS FOR PROCESSING SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">H01J37/32</main-classification>
        <further-classification edition="202601120260306B">H10P14/43</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商優吉尼科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EUGENE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳完錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, WAN SUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明之一實施例，一種用於處理一基體之裝置包括：一腔室，其形成一內部空間，在該內部空間中執行用於該基體之一程序；一氣體注入器，其安裝在該腔室之一上部部分上以朝向該內部空間供應氣體；以及一噴淋頭，其安裝在該內部空間之一上部部分上且位於該氣體注入器下方，該噴淋頭具有用於注入透過該注入器供應之該氣體之複數個注入孔，其中該氣體注入器包含：一主供應管線，其具有朝向該內部空間安置以排出該氣體之一個端部；以及第一分支管線及第二分支管線，其自該主供應管線分支且與該主供應管線隔離，並且第一反應氣體及第二反應氣體分別流經該第一分支管線及該第二分支管線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">According to an embodiment of the present invention, an apparatus for processing a substrate includes: a chamber forming an internal space in which a process for the substrate is performed; a gas injector installed on an upper portion of the chamber to supply gas toward the internal space; and a showerhead installed on an upper portion of the internal space and located below the gas injector, the showerhead having a plurality of injection holes for injecting the gas supplied through the injector, wherein the gas injector comprises: a main supply line having one end disposed toward the internal space to discharge the gas; and first and second branch lines which are branched from and isolated from the main supply line and through which first and second reaction gases respectively flow.</p>
      </isu-abst>
      <representative-img>
        <p type="p">12:下部腔室</p>
        <p type="p">12a,12b:元件</p>
        <p type="p">13:上部腔室</p>
        <p type="p">13a:注入器埠</p>
        <p type="p">15:噴淋頭</p>
        <p type="p">15a:注入孔</p>
        <p type="p">20:基座</p>
        <p type="p">22:支撐件</p>
        <p type="p">30:氣體注入器</p>
        <p type="p">32:第一分支管線</p>
        <p type="p">34:第二分支管線</p>
        <p type="p">36:主供應管線</p>
        <p type="p">40:第一供應管線</p>
        <p type="p">40a:第一閥</p>
        <p type="p">40b:第一流量控制器</p>
        <p type="p">40c:第一氣體源</p>
        <p type="p">50:第二供應管線</p>
        <p type="p">50a:第二閥</p>
        <p type="p">50b:第二流量控制器</p>
        <p type="p">50c:第二氣體源</p>
        <p type="p">52:第三供應管線</p>
        <p type="p">52a:第三閥</p>
        <p type="p">52b:第三流量控制器</p>
        <p type="p">52c:第三氣體源</p>
        <p type="p">B:緩衝空間</p>
        <p type="p">S:基體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1292" publication-number="202624349">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624349</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132361</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>接合體、接合體之製造方法、感光性樹脂組成物及半導體器件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08G73/10</main-classification>
        <further-classification edition="200601120260302B">C08G73/12</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/027</further-classification>
        <further-classification edition="200601120260302B">G03F7/031</further-classification>
        <further-classification edition="202601120260302B">H10W72/00</further-classification>
        <further-classification edition="202601120260302B">H10W72/90</further-classification>
        <further-classification edition="202601120260302B">H10W80/00</further-classification>
        <further-classification edition="202601120260302B">H10W99/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下広祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHITA, KOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種接合體、接合體之製造方法、接合體之製造方法中所使用之感光性樹脂組成物及包含上述接合體之半導體器件，前述接合體藉由接合第1構件和第2構件而成，其中，前述第1構件具有：第1基材；第1絕緣圖案，配置於前述第1基材上；及第1導電圖案，存在於前述第1絕緣圖案的圖案之間，前述第2構件具有：第2基材；第2絕緣圖案，配置於前述第2基材上；及第2導電圖案，存在於前述第2絕緣圖案的圖案之間，前述接合體中的、前述第1導電圖案的底面與前述第1導電圖案的側面所成之角的角度超過90°且為110°以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1293" publication-number="202625772">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625772</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132374</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P74/00</main-classification>
        <further-classification edition="202601120260302B">H10P70/00</further-classification>
        <further-classification edition="202501120260302B">H10F39/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商濱松赫德尼古斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMAMATSU PHOTONICS K.K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田仲史弥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, FUMIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高木慎一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAGI, SHIN-ICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之半導體裝置之製造方法包含：墊形成工序，其在第1基板上形成連接用電極墊、檢查用電極墊及電極墊連接部；檢查工序，其在墊形成工序之後，使檢查探針接觸檢查用電極墊而進行電性檢查；去除工序，其在檢查工序之後，至少去除檢查用電極墊之在檢查工序中被檢查探針接觸過之區域；連接工序，其在去除工序之後，將連接用電極墊經由凸塊電性連接於第2組件；及被覆工序，其在去除工序之後，至少將凸塊藉由具有絕緣性之被覆部被覆。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:第1組件</p>
        <p type="p">11:第1基板</p>
        <p type="p">12:絕緣層</p>
        <p type="p">14:連接用電極墊</p>
        <p type="p">15:絕緣層</p>
        <p type="p">15c:開口</p>
        <p type="p">16:電極墊連接部</p>
        <p type="p">16a:表面</p>
        <p type="p">16b:凹部</p>
        <p type="p">17:凸塊(電連接部)</p>
        <p type="p">18:檢查用電極墊</p>
        <p type="p">18a:表面</p>
        <p type="p">18b:凹部</p>
        <p type="p">18x:重疊部分</p>
        <p type="p">18y:外側部分</p>
        <p type="p">31:絕緣層</p>
        <p type="p">31a:開口</p>
        <p type="p">N:針痕(凹凸)</p>
        <p type="p">P:檢查探針</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1294" publication-number="202625216">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625216</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132377</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>全固體二次電池</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">H01B1/02</main-classification>
        <further-classification edition="200601120260309B">H01B3/08</further-classification>
        <further-classification edition="201001120260309B">H01M10/0562</further-classification>
        <further-classification edition="201001120260309B">H01M4/134</further-classification>
        <further-classification edition="202101120260309B">H01M50/333</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本電氣硝子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON ELECTRIC GLASS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>角田啓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUNODA, KEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山内英郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAUCHI, HIDEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>益田紀彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASUDA, NORIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永金知浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAKANE, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平塚雅史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRATSUKA, MASAFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種全固體二次電池，其能夠使集電體層與電極層確實地接觸，從而能夠獲得穩定之電池特性。  &lt;br/&gt;本發明之全固體二次電池1具備：蓄電元件2，其具有固體電解質層3、正極層4、及負極層5&lt;b&gt;；&lt;/b&gt;第1集電體層6，其設置於蓄電元件2之一側之主面2a上；第2集電體層7，其設置於蓄電元件2之另一側之主面2b上；及密封層8，其設置於第1集電體層6與第2集電體層7之間，將蓄電元件2密封；且構成由第1集電體層6、第2集電體層7及密封層8包圍之內部空間1a，將內部空間1a之25℃下之氣壓設為P&lt;sub&gt;1&lt;/sub&gt;，將外部空間之25℃下之氣壓設為P&lt;sub&gt;2&lt;/sub&gt;時，P&lt;sub&gt;2&lt;/sub&gt;與P&lt;sub&gt;1&lt;/sub&gt;之差(P&lt;sub&gt;2&lt;/sub&gt;－P&lt;sub&gt;1&lt;/sub&gt;)為10 kPa以上100 kPa以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1295" publication-number="202624527">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624527</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132380</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體處理系統及用於使用半導體處理系統形成超晶格結構之相關聯方法</chinese-title>
        <english-title>SEMICONDUCTOR PROCESSING SYSTEMS AND ASSOCIATED METHODS FOR FORMING SUPER-LATTICE STRUCTURES USING SEMICONDUCTOR PROCESSING SYSTEMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">C23C16/44</main-classification>
        <further-classification edition="200601120260313B">C23C16/455</further-classification>
        <further-classification edition="200601120260313B">C23C16/48</further-classification>
        <further-classification edition="200601120260313B">C23C16/52</further-classification>
        <further-classification edition="200601120260313B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇俊威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, JUNWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬明陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, MINGYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王文濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WENTAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬哈德文　克里希那斯瓦米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAHADEVAN, KRISHNASWAMY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕蒂爾　基肖爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATIL, KISHOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於半導體製造系統中之材料層沉積方法的方法及設備。控制器可將基板安置於基板支撐件上。可將一第一氣相反應物提供至一第一入口，且可將一第二氣相反應物提供至一遠端電漿單元，該遠端電漿單元可分解前驅物之至少一部分。包含矽之磊晶材料層係可使用分解產物而沉積至該基板上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and apparatuses for a material layer deposition method in a semiconductor manufacturing system. A controller may seat a substrate on a substrate support. A first vapor phase reactant may be provided to a first inlet, and a second vapor phase reactant may be provided to a remote plasma unit, which may decompose at least a portion of the precursor. An epitaxial material layer comprising silicon may be deposited onto the substrate using a decomposition product.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:氣體源總成</p>
        <p type="p">104:遠端電漿單元</p>
        <p type="p">106:腔室配置</p>
        <p type="p">108:排氣總成</p>
        <p type="p">118:腔室主體</p>
        <p type="p">120:第一入口</p>
        <p type="p">122:第二入口</p>
        <p type="p">132:前驅物入口</p>
        <p type="p">134:電漿出口</p>
        <p type="p">136:基板支撐件</p>
        <p type="p">138:基板</p>
        <p type="p">140:材料層</p>
        <p type="p">142:第一反應物流</p>
        <p type="p">144:電漿反應物流</p>
        <p type="p">146:隔離構件</p>
        <p type="p">202:上部加熱器元件陣列</p>
        <p type="p">204:下部加熱器元件陣列</p>
        <p type="p">206:上部壁</p>
        <p type="p">208:下部壁</p>
        <p type="p">210:外部肋狀物</p>
        <p type="p">212:注入端</p>
        <p type="p">214:排氣端</p>
        <p type="p">216:腔室內部</p>
        <p type="p">218:注入凸緣</p>
        <p type="p">222:正面</p>
        <p type="p">224:箭頭/腔室主體縱向軸線/縱向定向</p>
        <p type="p">226:電漿饋送管</p>
        <p type="p">228:第一端</p>
        <p type="p">230:第二端</p>
        <p type="p">232:角度</p>
        <p type="p">234:軸桿構件</p>
        <p type="p">236:旋轉軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1296" publication-number="202625232">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625232</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132381</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>壓力開關結構及安全壓力開關</chinese-title>
        <english-title>PRESSURE SWITCH STRUCTURE AND SAFETY PRESSURE SWITCH</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260310B">H01H35/26</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉朱　皮拉　阿南德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAJU, PILLA ANAND</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費斯勒　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FESSLER, MARK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">呈現一種安全壓力開關。為了避免壓力開關故障，本揭示呈現一種安全壓力開關，其包含：一容器，其塑形為一圓柱體，該容器包含包括一熔絲插口之一熔絲室、一開關室及包含一孔之一分隔器；一壓力開關，其安置於該開關室中；一熔絲，其安置於該熔絲插口中；及一第一電線及一第二電線，其通過該孔連接至該壓力開關，其中該分隔器分隔該熔絲室與該開關室，且其中該孔連接該熔絲室與該開關室，且其中該熔絲安裝於該第一電線中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A safety pressure switch is presented. For avoiding pressure switch malfunction, the present disclosure presents a safety pressure switch comprising: a container shaped as a cylinder, the container comprising a fuse room comprising a fuse socket, a switch room, and a separator comprises a hole; a pressure switch disposed in the switch room; a fuse disposed in the fuse socket; and a first electrical line and a second electrical line connected to the pressure switch through the hole, wherein the separator separates the fuse room and the switch room, and wherein the hole connects the fuse room and the switch room, and wherein the fuse is installed in the first electrical line.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:安全壓力開關結構</p>
        <p type="p">110:壓力開關</p>
        <p type="p">120:熔絲</p>
        <p type="p">121:第一電線</p>
        <p type="p">122:第二電線</p>
        <p type="p">123:報警單元</p>
        <p type="p">130:容器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1297" publication-number="202624421">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624421</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132401</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>保護片及具黏著劑之保護片</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260226B">C09D133/12</main-classification>
        <further-classification edition="201801120260226B">C09J7/22</further-classification>
        <further-classification edition="200601120260226B">B32B27/30</further-classification>
        <further-classification edition="201801120260226B">C09J7/40</further-classification>
        <further-classification edition="200601120260226B">C09D175/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商琳得科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤井結加</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJII, YUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋洋一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, YOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福田大貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUDA, DAIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">議題：提供一種易於順應曲面且於可施用性上優異，同時於損傷回復性上也優異的保護片及具黏著劑層的保護片。解決手段：一種保護片1，其為具備基材11及塗層12的保護片1，將保護片1在23℃、50%RH的環境下，以寬15 mm、測定長50 mm、拉伸速度200 mm/分鐘來伸長時，基材11不斷裂而塗層12裂開的拉伸伸長率為60%以上，且將於厚度為110~1000 μm的保護片1或保護片1的積層體中的塗層12側的表面，於5 mmϕ的面積下以0.01 mm/秒的速度壓入至深度100 μm時的壓入應力為1 N以上、8.8 N以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:保護片</p>
        <p type="p">11:基材</p>
        <p type="p">12:塗層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1298" publication-number="202625169">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625169</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132422</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體記憶裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G11C5/02</main-classification>
        <further-classification edition="200601120260302B">G11C11/40</further-classification>
        <further-classification edition="202501120260302B">H10D62/10</further-classification>
        <further-classification edition="202501120260302B">H10D64/20</further-classification>
        <further-classification edition="202501120260302B">H10D89/10</further-classification>
        <further-classification edition="202601120260302B">H10W20/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>妹尾駿一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SENO, SHUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松尾浩司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUO, KOUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仲田裕貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKATA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒井史隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAI, FUMITAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可高速動作之半導體記憶裝置。半導體記憶裝置具備：複數個記憶體塊區域，其等於第1方向上排列；連接區域，其相對於複數個記憶體塊區域於第1方向上排列；及配線區域，其於第1方向上延伸，於與第1方向交叉之第2方向上與複數個記憶體塊區域排列。複數個記憶體塊區域各自具備：複數個記憶體串，其等於第1方向上延伸，於第2方向上排列；及第1配線，其於第2方向上延伸，共通地連接於複數個記憶體串。配線區域係具備於第1方向上延伸，共通地連接於與複數個記憶體塊區域對應之複數個第1配線之第2配線。連接區域係具備於與第1方向及第2方向交叉之第3方向上延伸，電性連接於第2配線之接觸電極。於第1配線與第2配線之間之電流路徑設置第1電晶體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">CC:接觸電極</p>
        <p type="p">LBIX:局部塊連接線</p>
        <p type="p">LBIY:局部塊連接線</p>
        <p type="p">MC:記憶胞</p>
        <p type="p">MS:記憶體串</p>
        <p type="p">R&lt;sub&gt;BLK&lt;/sub&gt;:記憶體塊區域</p>
        <p type="p">R&lt;sub&gt;HU&lt;/sub&gt;:連接區域</p>
        <p type="p">R&lt;sub&gt;LBIY&lt;/sub&gt;:連接線區域</p>
        <p type="p">SWX1:局部塊選擇電晶體</p>
        <p type="p">SWY1:局部塊選擇電晶體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1299" publication-number="202625576">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625576</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132424</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有擴散阻障的磊晶襯墊超接面裝置</chinese-title>
        <english-title>EPI LINER SUPER JUNCTION DEVICES WITH DIFFUSION BARRIER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260309B">H10D30/01</main-classification>
        <further-classification edition="202501120260309B">H10D30/83</further-classification>
        <further-classification edition="202601120260309B">H10D62/00</further-classification>
        <further-classification edition="202501120260309B">H10D62/10</further-classification>
        <further-classification edition="202501120260309B">H10D62/17</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>能本許　葉門哈森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOURBAKHSH, AMIRHASAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓋爾　拉曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAIRE, RAMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">具有提高的電壓評級的超接面元件可以藉由在蝕刻到N型材料中的溝槽的側壁上創建P型襯墊，然後用額外的N型材料填充該溝槽來形成。此薄的P型襯墊可以以顯著高於周圍N型材料的濃度進行摻雜，以維持電荷平衡。然而，該等相對薄的尺寸和高摻雜濃度差異可能會導致P型摻雜物在隨後的高溫製造過程期間擴散進入N型材料。位於P型襯墊兩側的擴散阻障層防止摻雜物擴散到周圍的N型材料中。該等擴散阻障層在N型材料與P型材料之間創造出防止擴散的急劇界面，並改善超接面元件的效能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A super junction device with an increased voltage rating may be formed by creating a P liner on the sidewalls of a trench etched into N material, then filling the trench with additional N-type material. This thin P liner may be doped at a significantly higher concentration than the surrounding N material to maintain a charge balance. However, these relatively thin dimensions and the high doping concentration differential may cause P dopants to diffuse into the N material during subsequent high-temperature manufacturing processes. Diffusion barriers on either side of the P liner prevent diffusion of the dopants into the surrounding N material. The diffusion barriers create an abrupt interface between the N and P materials that prevents diffusion and improves the performance of the super junction devices.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:結構</p>
        <p type="p">508:N型區域</p>
        <p type="p">512:N型區域</p>
        <p type="p">516:N型區域</p>
        <p type="p">524:高度</p>
        <p type="p">526:基板</p>
        <p type="p">551:P型區域</p>
        <p type="p">553:溝槽</p>
        <p type="p">554:寬度</p>
        <p type="p">557:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1300" publication-number="202625194">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625194</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132437</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體系統及半導體記憶裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251204B">G11C16/32</main-classification>
        <further-classification edition="200601120251204B">G11C16/26</further-classification>
        <further-classification edition="200601120251204B">G11C16/10</further-classification>
        <further-classification edition="200601120251204B">G11C16/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菅原昭雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGAHARA, AKIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可削減電路面積之記憶體系統及半導體記憶裝置。記憶體系統具備複數個半導體記憶裝置及控制裝置。複數個半導體記憶裝置各自具備：第1記憶胞陣列；第2記憶胞陣列；第1資料信號輸入輸出端子，其可使用於自第1記憶胞陣列讀出之資料之輸出；第2資料信號輸入輸出端子，其可使用於自第2記憶胞陣列讀出之資料之輸出；及第1控制端子，其於輸出自第1記憶胞陣列及第2記憶胞陣列之至少一者讀出之資料時，可受理來自控制裝置之切換信號。控制裝置無論是否正在進行經由第1資料信號輸入輸出端子及第2資料信號輸入輸出端子之資料之輸入輸出，均以大致恆定之頻率切換第1控制端子之信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">Add:位址資料</p>
        <p type="p">ADD:指令資料</p>
        <p type="p">CA0(ALE):控制端子</p>
        <p type="p">CA1(CLE):控制端子</p>
        <p type="p">CA_clk(/WE):控制端子</p>
        <p type="p">CMD:指令資料</p>
        <p type="p">DQ0~DQ7:資料信號輸入輸出端子</p>
        <p type="p">DQS:資料選通信號輸入輸出端子</p>
        <p type="p">/RE:控制端子</p>
        <p type="p">RY//BY(PLN0):就緒/忙碌信號</p>
        <p type="p">RY//BY(PLN1):就緒/忙碌信號</p>
        <p type="p">t110~t115,t120~t127,t130~t135:時序</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1301" publication-number="202624088">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624088</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132448</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有多力致動器和機械致動抓取器的袋裝機</chinese-title>
        <english-title>BAGGING MACHINE WITH MULTIPLE-FORCE ACTUATOR AND MECHANICALLY-ACTUATED GRIPPERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">B65B43/12</main-classification>
        <further-classification edition="200601120260309B">B65B43/26</further-classification>
        <further-classification edition="200601120260309B">B65B43/30</further-classification>
        <further-classification edition="200601120260309B">B65B51/14</further-classification>
        <further-classification edition="200601120260309B">B65B61/00</further-classification>
        <further-classification edition="200601120260309B">B65B65/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商普里吉斯有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PREGIS LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿莫多瓦　阿格尼斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALMODOVAR, ARGENIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈西奧萊克　帕維爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JASIOLEK, PAWEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">袋裝機包括一密封機構，該密封機構具有一密封桿及相對於該密封桿可移動之一壓板，使該壓板與該密封桿可對一封套上之一密封區域施加壓力，以形成一封閉密封。該等袋裝機可包括一高力驅動器及一低力驅動器，經配置以根據該密封桿相對於該壓板之位置對該密封桿施加不同等級之力。該等袋裝機亦可包括一或多個夾持器，該一或多個夾持器用以分開該封套壁之上端，以提供對該封套之一內部口袋的開口。該等夾持器可以配置為，在當該等夾持器與該等封套壁接觸或脫離接觸的過程中遇到障礙物時，與該等夾持器的驅動機構脫離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Bagging machines include a sealing mechanism having a sealing bar and a pressure plate movable in relation to the sealing bar so that the pressure plate and the sealing bar can apply pressure to a sealing area on an envelope to form a closure seal. The bagging machines can include a high-force actuator and a low-force actuator configured to apply different levels of force to the sealing bar dependent upon the position of the sealing bar in relation to the pressure plate. The bagging machines also can include one or more grippers that separate the upper ends of the envelope walls to provide access to an interior pocket of the envelope. The grippers can be configured to disengage from their drive mechanism upon encountering an obstruction in their movement into and out of contact with the envelope walls.</p>
      </isu-abst>
      <representative-img>
        <p type="p">18:袋裝機</p>
        <p type="p">21:封套接收空間</p>
        <p type="p">50:封套帶</p>
        <p type="p">52:封套</p>
        <p type="p">54:封閉密封元件</p>
        <p type="p">55:封套口袋</p>
        <p type="p">56:穿孔</p>
        <p type="p">57:前壁</p>
        <p type="p">59:後壁</p>
        <p type="p">85:顯示器</p>
        <p type="p">89:按鈕</p>
        <p type="p">91:泡棉墊</p>
        <p type="p">202:夾持器</p>
        <p type="p">228:狹槽</p>
        <p type="p">250:密封機構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1302" publication-number="202624495">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624495</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132457</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高爐的作業方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">C21B5/00</main-classification>
        <further-classification edition="200601120260309B">C21B7/00</further-classification>
        <further-classification edition="200601120260309B">C21B7/16</further-classification>
        <further-classification edition="200601120260309B">C22B5/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本製鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中野薰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANO, KAORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中川二彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAGAWA, TSUGUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>酒井博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAI, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種高爐的作業方法，其特徵在於具有吹入工序，該吹入工序係從風口吹入依據碳中和方法生成之具有不飽和鍵之烴。前述烴源自生質或源自可再生能源。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1303" publication-number="202624105">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624105</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132459</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>捲盤構件、接著膜捲裝體</chinese-title>
        <english-title>REEL MEMBER AND ADHESIVE FILM WINDING REEL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">B65H75/14</main-classification>
        <further-classification edition="200601120260306B">B65D85/672</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商迪睿合股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEXERIALS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小平佳克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KODAIRA, YOSHIKATSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供於捲繞長度不同之接著膜時亦能夠以最佳捲芯徑捲繞之捲盤構件。  &lt;br/&gt;捲盤構件具備圓形之捲芯3、具有嵌合於捲芯3之嵌合孔6a且能夠裝卸地嵌合於捲芯3之外周的圓板狀之芯環6、及設置於捲芯3之兩側之一對捲盤凸緣4A、4B，於捲芯3之外周面，設置有卡合凹部8，於嵌合孔6a之內周面，設置有卡合於卡合凹部8之卡合凸部9，藉由卡合凹部8與卡合凸部9之卡合，而將芯環6卡合於捲芯，限制芯環6旋轉。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:捲盤構件</p>
        <p type="p">2:接著膜</p>
        <p type="p">3:捲芯</p>
        <p type="p">3a:插通孔</p>
        <p type="p">4:捲盤凸緣</p>
        <p type="p">6:芯環</p>
        <p type="p">6a:嵌合孔</p>
        <p type="p">20:凸緣肋條</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1304" publication-number="202625203">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625203</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132465</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>針對生理資訊及相關時間戳尋找通訊時序的方法與伺服器電腦</chinese-title>
        <english-title>METHOD AND SERVER COMPUTER FOR FINDING A TIMING OF COMMUNICATION WITH RESPECT TO PHYSIOLOGICAL INFORMATION AND ASSIOCIATED TIMESTAMPS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260305B">G16H20/10</main-classification>
        <further-classification edition="201801120260305B">G16H40/67</further-classification>
        <further-classification edition="201801120260305B">G16H50/20</further-classification>
        <further-classification edition="200601120260305B">G06N3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康濰醫慧有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURA CARE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康濰醫慧有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURA MED INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡明哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MING-TSE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱致維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張皓鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HAO-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布拉姆威爾　傑克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRAMWELL, JAKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　凱傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, KAI-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂正忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於針對生理資訊及相關時間戳尋找一通訊時序的方法。該方法包括：經由一網路接收來自一感測裝置之一第一使用者之生理測量資訊；根據該生理測量資訊及該對應時間戳獲得第一健康特定資訊之一第一通訊時序；及在該第一時序將該第一健康特定資訊傳輸至一用戶端電腦。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for finding a timing of communication with respect to physiological information and associated timestamps is provided. The method comprising: receiving physiological measurement information of a first user from a sensing device via a network; obtaining a first timing of communication of first health specific information according to the physiological measurement information and corresponding timestamp; and transmitting the first health specific information to a client computer at the first timing.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:網路系統</p>
        <p type="p">110:伺服器</p>
        <p type="p">112:人工智慧(AI)伺服器</p>
        <p type="p">120:網路</p>
        <p type="p">130:感測裝置</p>
        <p type="p">140:用戶端電腦</p>
        <p type="p">150:訊息伺服器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1305" publication-number="202625214">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625214</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132466</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>預測與病患溝通策略的方法及其伺服器電腦</chinese-title>
        <english-title>METHOD FOR PREDICTING COMMUNICATION STRATEGY WITH PATIENT AND SERVER COMPUTER THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260312B">G16H80/00</main-classification>
        <further-classification edition="201801120260312B">G16H10/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康濰醫慧有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURA CARE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康濰醫慧有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURA MED INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡明哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MING-TSE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱致維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, YU-HSIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　凱傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, KAI-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂正忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於預測與病患之一溝通策略之方法，其包括：接收一病患之人口統計資料；基於該病患之人口統計資料而在一人物資料庫中尋找一模型人物；基於滿足該人物資料庫中之該模型人物之屬性資料之一第一溝通策略而產生一或多個第一任務；經由一網路將基於該第一溝通策略之該一或多個第一任務依序發送至該病患之一用戶端電腦；自該用戶端電腦依序接收關於該一或多個第一任務之一或多個第一回應；及在該人物資料庫中記錄包含該一或多個第一任務及該對應一或多個第一回應之一第一互動歷史。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for predicting a communication strategy with patient, comprising: receiving a patient’s demographic data; finding a model persona in a persona database based on the patient’s demographic data; generating one or more first tasks based on a first communication strategy which meets attribute data of the model persona in the persona database; sending sequentially the one or more first tasks based on the first communication strategy to a client computer of the patient via a network; receiving sequentially one or more first responses with respect to the one or more first tasks from the client computer; and recording a first interaction history including the one or more first tasks and the corresponding one or more first responses in the persona database.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:網路系統</p>
        <p type="p">110:伺服器</p>
        <p type="p">112:選用人工智慧(AI)伺服器/資料庫管理系統(DBMS)伺服器</p>
        <p type="p">114:人工智慧(AI)伺服器</p>
        <p type="p">120:網路</p>
        <p type="p">130:診所電腦</p>
        <p type="p">140:用戶端電腦</p>
        <p type="p">150:選用訊息伺服器</p>
        <p type="p">152:SMS/MMS伺服器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1306" publication-number="202625430">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625430</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132497</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像系統和影像處理方法</chinese-title>
        <english-title>IMAGE SYSTEM AND IMAGE PROCESSING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">H04N7/18</main-classification>
        <further-classification edition="202301120260312B">H04N23/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於影像系統和影像處理方法。影像系統包括輸入器、輸入器和處理器。輸入器配置為輸入影像，所述影像攜帶預先設置的用於校正的資訊；輸出器配置為輸出影像；處理器配置為：接收由輸入器輸入的影像，並且從影像中獲取預先設置的用於校正的資訊；接收輸出器的姿態資訊；根據預先設置的用於校正的資訊和輸出器的姿態資訊計算影像校正角度；接收影像輸出的形狀和大小以進行框取；使框取後的影像由輸出器輸出。本發明的影像系統在影像採集現場無需顧慮畫面的水平角度；在重放時無論顯示器處於任何角度始終能夠保證獲得的畫面穩定水平；隨時適應顯示器畫框比例變化，保證對角線解析度不變。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to an image system and an image processing method. The image system comprises an inputter, an inputter and a processor. The inputter is configured to input an image, said image carries pre-set information for correction; the outputter is configured to output an image; the processor is configured to: receive an image input by the inputter and obtain pre-set information for correction from the image; receive attitude information of the outputter; calculate an image correction angle based on the pre-set information for correction and the attitude information of the outputter; receive the shape and size of the image output for edge selection; output the edge selective image using the outputter. The image system of the present invention does not need to concern the horizontal angle of the picture at the image acquisition site; always ensures the stable level of the acquired picture regardless of the angle of the displayer during playback; and adapts to changes in the ratio of the frame of the displayer at any time to ensure that the diagonal resolution remains unchanged.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:影像感測器</p>
        <p type="p">30:顯示器</p>
        <p type="p">41:水平角度感測器、角度感測器</p>
        <p type="p">42:俯仰角度感測器、角度感測器</p>
        <p type="p">43:地極角度感測器、角度感測器</p>
        <p type="p">50:編碼器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1307" publication-number="202625577">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625577</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132505</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用以製造具有減少的界面層厚度之半導體裝置的方法</chinese-title>
        <english-title>METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH REDUCED INTERFACIAL LAYER THICKNESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260306B">H10D30/01</main-classification>
        <further-classification edition="202501120260306B">H10D30/62</further-classification>
        <further-classification edition="202501120260306B">H10D64/68</further-classification>
        <further-classification edition="202601120260306B">H10P95/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李紳揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SHEN-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張翔筆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HSIANG-PI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張旭凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HSU-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧俊甫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHUN-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙皇麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAO, HUANG-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐野謙一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANO, KENICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林斌彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PINYEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於製造半導體裝置的方法包括：在一半導體基體上形成一半導體結構，該半導體結構包括第一及第二源極/汲極區，其等在第一方向上安置於該半導體基體上且在橫向於該第一方向之一第二方向上彼此間隔開，以及複數個通道形貌體，其等安置於該等第一及第二源極/汲極區之間且連接至該等第一及第二源極/汲極區且在該第一方向上彼此間隔開；形成一界面材料層以覆蓋該等通道形貌體；在該界面材料層上形成一金屬氧化物層；使該界面材料層之一部分轉換成一金屬矽酸鹽層，以便形成分別地覆蓋該等通道形貌體的複數個界面形貌體，該金屬矽酸鹽層係形成於該金屬氧化物層與該等界面形貌體之間；以及移除該金屬氧化物層及該金屬矽酸鹽層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for manufacturing a semiconductor device includes: forming a semiconductor structure on a semiconductor substrate, the semiconductor structure including first and second source/drain regions disposed on the semiconductor substrate in a first direction and spaced apart from each other in a second direction transverse to the first direction, and a plurality of channel features disposed between and connected to the first and second source/drain regions and spaced apart from one another in the first direction; forming an interfacial material layer to cover the channel features; forming a metal oxide layer on the interfacial material layer; converting a portion of the interfacial material layer into a metal silicate layer so as to form a plurality of interfacial features respectively covering the channel features, the metal silicate layer being formed between the metal oxide layer and the interfacial features; and removing the metal oxide layer and the metal silicate layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:半導體基體</p>
        <p type="p">14:虛設間隔體</p>
        <p type="p">16:內間隔體</p>
        <p type="p">17:第一層</p>
        <p type="p">18:第二層</p>
        <p type="p">19:源極/汲極形貌體</p>
        <p type="p">20:接觸蝕刻停止形貌體</p>
        <p type="p">21:層間介電(ILD)形貌體，ILD形貌體</p>
        <p type="p">24:界面形貌體</p>
        <p type="p">27:閘極介電質形貌體</p>
        <p type="p">28:金屬閘極形貌體</p>
        <p type="p">111:上部部分</p>
        <p type="p">112:下部部分</p>
        <p type="p">122:通道形貌體</p>
        <p type="p">141:內虛設間隔體</p>
        <p type="p">142:外虛設間隔體</p>
        <p type="p">200A:半導體裝置</p>
        <p type="p">I-I:線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1308" publication-number="202624830">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624830</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132532</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學系統及相機模組</chinese-title>
        <english-title>OPTICAL SYSTEM AND CAMERA MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">G02B15/14</main-classification>
        <further-classification edition="200601120260312B">G02B13/00</further-classification>
        <further-classification edition="202101120260312B">G03B17/12</further-classification>
        <further-classification edition="200601120260312B">G02B9/64</further-classification>
        <further-classification edition="200601120260312B">G02B13/18</further-classification>
        <further-classification edition="200601120260312B">G02B15/22</further-classification>
        <further-classification edition="200601120260312B">G02B3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG INNOTEK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申斗植</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIN, DOO SHIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種根據本揭露內容之一實施例之光學系統包括沿著一光軸安置之第一至第五透鏡群組，其中該第一透鏡群組具有正(+)折射力，該第三透鏡群組具有正(+)折射力，該第四透鏡群組具有負(-)折射力，該第二透鏡群組及該第五透鏡群組包括棱鏡透鏡，且該第一透鏡群組及該第二透鏡群組執行OIS移動，且該第四透鏡群組執行AF移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical system according to an embodiment of the present disclosure includes first to fifth lens groups disposed along an optical axis, in which the first lens group has positive (+) refractive power, the third lens group has positive (+) refractive power, the fourth lens group has negative (-) refractive power, the second lens group and the fifth lens group include prism lenses, and the first lens group and the second lens group perform OIS movement and the fourth lens group performs AF movement.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:第一透鏡</p>
        <p type="p">102:第二透鏡</p>
        <p type="p">103:棱鏡透鏡、第三透鏡</p>
        <p type="p">104:第四透鏡</p>
        <p type="p">105:第五透鏡</p>
        <p type="p">106:第六透鏡</p>
        <p type="p">107:第七透鏡</p>
        <p type="p">108:第八透鏡</p>
        <p type="p">109:第九透鏡</p>
        <p type="p">400:影像感測器</p>
        <p type="p">500:濾波器</p>
        <p type="p">1000:光學系統</p>
        <p type="p">ImgH:對角大小</p>
        <p type="p">LG1:第一透鏡群組</p>
        <p type="p">LG2:第二透鏡群組</p>
        <p type="p">LG3:第三透鏡群組</p>
        <p type="p">LG4:第四透鏡群組</p>
        <p type="p">LG5:第五透鏡群組</p>
        <p type="p">OA:光軸</p>
        <p type="p">RS1:反射表面</p>
        <p type="p">RS2:反射表面</p>
        <p type="p">S1:第一表面</p>
        <p type="p">S2:第二表面</p>
        <p type="p">S3:第三表面</p>
        <p type="p">S4:第四表面</p>
        <p type="p">S5:第五表面</p>
        <p type="p">S6:第六表面</p>
        <p type="p">S7:第七表面</p>
        <p type="p">S8:第八表面</p>
        <p type="p">S9:第九表面</p>
        <p type="p">S10:第十表面</p>
        <p type="p">S11:第十一表面</p>
        <p type="p">S12:第十二表面</p>
        <p type="p">S13:第十三表面</p>
        <p type="p">S14:第十四表面</p>
        <p type="p">S15:第十五表面</p>
        <p type="p">S16:第十六表面</p>
        <p type="p">S17:第十七表面、入射表面</p>
        <p type="p">S18:第十八表面、出射表面</p>
        <p type="p">x:第二軸、軸</p>
        <p type="p">y:第一軸、軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1309" publication-number="202624001">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624001</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132541</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阻擋膜、太陽電池、EL顯示裝置、阻擋膜的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">B32B9/00</main-classification>
        <further-classification edition="200601120260302B">C23C16/34</further-classification>
        <further-classification edition="200601120260302B">C23C16/40</further-classification>
        <further-classification edition="200601120260302B">C23C16/455</further-classification>
        <further-classification edition="202501120260302B">H10F77/30</further-classification>
        <further-classification edition="202501120260302B">H10H20/84</further-classification>
        <further-classification edition="200601120260302B">H05B33/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商尼康股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIKON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國分崇生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKUBUN, TAKAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種阻擋膜，其為於基材上具有多個層的阻擋膜，所述多個層自所述基材側起依次具有第一氮化矽層、ZAO層、以及第一氧化矽層至少三個層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:阻擋膜(三層結構)</p>
        <p type="p">101:基材</p>
        <p type="p">102-1:第一氮化矽層</p>
        <p type="p">103:ZAO層</p>
        <p type="p">104-1:第一氧化矽層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1310" publication-number="202623757">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623757</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132549</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>內視鏡定位系統及其使用方法</chinese-title>
        <english-title>POSITIONING SYSTEM FOR AN ENDOSCOPE AND A METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">A61B1/00</main-classification>
        <further-classification edition="200601120260306B">A61B1/04</further-classification>
        <further-classification edition="201601120260306B">A61B90/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商巧捷力醫療機器人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGILIS ROBOTICS LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭　嘉威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWOK, KA-WAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何　迪朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, JUSTIN DI-LANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂　家熾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUI, KA-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　尚民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, SHEUNG-MAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何美瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種內視鏡定位系統，包含：具有固定端的支撐臂，用於固定所述內視鏡的近端；所述支撐臂可自一基座水平伸展，以在包含y軸的水平平面內平移所述內視鏡的遠端；所述支撐件可移動，以在包含與y軸正交的y軸，以及與z軸和y軸均正交的x軸的垂直方向上平移所述內視鏡；所述支撐臂包含止擋器，用於阻擋所述固定端繞y軸的旋轉運動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An endoscope positioning system, comprising the support arm having a holder-end for holding an endoscope proximally of the endoscope; the support arm extendible horizontally from a base to translate the distal end of the endoscope in horizontal plane comprising a y-axis; the support movable to translate the endoscope in a vertical direction comprising a y-axis orthogonal the y-axis and an x-axis orthogonal to the z and y axes; the support arm comprising a stop resisting rotational movements of the holder about the y-axis.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2401:執行器平台</p>
        <p type="p">2403:機械臂</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1311" publication-number="202625676">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625676</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132567</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板接合裝置、基板處理裝置以及基板接合方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260309B">H10P10/00</main-classification>
        <further-classification edition="202601120260309B">H10P72/50</further-classification>
        <further-classification edition="202601120260309B">H10P72/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村知玄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, TOMOHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">基板接合裝置係具備：控制部，係控制用以移動台之移動機構；以及處理部，係基於在不同的複數個時刻中藉由拍攝部所拍攝的移動中之特徵部分的複數個圖像取得特徵部分的移動速度，並取得所取得的特徵部分的移動速度變成比預定的臨限值還要小的速度之特徵部分的低移動速度時座標。控制部係構成為：以特徵部分的低移動速度時座標與目標座標一致之方式，藉由移動機構使台移動並執行一對基板的位置對合處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">51:上台</p>
        <p type="p">61:下台</p>
        <p type="p">72:基準標記拍攝部</p>
        <p type="p">AM1:上側對準標記</p>
        <p type="p">AM2:下側對準標記</p>
        <p type="p">MA1:上側基準標記</p>
        <p type="p">MA2:下側基準標記</p>
        <p type="p">W1:上基板</p>
        <p type="p">W2:下基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1312" publication-number="202625542">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625542</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132569</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>直接到晶片的冷卻關閉解決方法</chinese-title>
        <english-title>DIRECT TO CHIP COOLED SHUTDOWN SOLUTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">H05K7/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商維諦公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERTIV CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱勒　馬修　格里菲思</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KELLER, MATTHEW GRIFFITH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅諾切　約翰　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENOCHE, JOHN PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓊斯　邁克爾　布魯斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JONES, MICHAEL BRUCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克汗　阿曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHAN, AMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　家凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, KAH KOI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明內容關於一種直接到晶片的冷卻關閉解決方法並揭示了一種液體冷卻系統。該液體冷卻系統包括機架內歧管，該機架內歧管被配置成使冷卻劑循環到機架內電子部件。機架內歧管包括定位在機架內歧管內的多個感測器。多個感測器被配置成：測量與冷卻劑相關聯的多個參數；以及生成指示多個參數的多個訊號。液體冷卻系統還包括控制單元。控制單元被配置成：從多個感測器接收多個訊號；以及基於多個訊號來檢測液體冷卻系統內的異常狀況。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:液體冷卻系統</p>
        <p type="p">102:機架內歧管</p>
        <p type="p">104:入口和出口端口</p>
        <p type="p">106:分配通道</p>
        <p type="p">108:閥</p>
        <p type="p">110:感測器</p>
        <p type="p">112:控制單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1313" publication-number="202625776">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625776</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132584</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於監測基板接合之方法及設備</chinese-title>
        <english-title>METHOD AND APPARATUS FOR MONITORING SUBSTRATE BONDING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260313B">H10P74/20</main-classification>
        <further-classification edition="202601120260313B">H10P10/00</further-classification>
        <further-classification edition="202601120260313B">H10W72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布吉思　羅賓　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUIJS, ROBIN DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布羅爾斯　桑迪爾　克里斯丁安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROERS, SANDER CHRISTIAAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德　賈格　皮耶特　威廉　荷曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE JAGER, PIETER WILLEM HERMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種基板接合設備，其包含：一供體基板支撐件；一受體基板支撐件；一光學度量衡感測器，其經組態以量測傳播通過待接合之一供體基板及/或受體基板之一輻射複合場，該輻射複合場係由該供體基板及/或該受體基板上所包含之一目標結構對照明輻射進行散射及/或反射所致；及一控制器，其經組態以：校正該經量測複合場之光學像差；及基於一經校正複合場監測一所關注接合參數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There is provided a substrate bonding apparatus comprising: a donor substrate support; an acceptor substrate support, an optical metrology sensor configured to measure a complex field of radiation propagating through a donor substrate and/or acceptor substrate to be bonded, said complex field of radiation the result of scattering and/or reflection of illumination radiation by a target structure comprised on the donor substrate and/or the acceptor substrate; and a controller configured to; correct the measured complex field for optical aberrations; and monitor a bonding parameter of interest based on a corrected complex field.</p>
      </isu-abst>
      <representative-img>
        <p type="p">901:照明器</p>
        <p type="p">902:供體基板/供體晶圓</p>
        <p type="p">903:受體基板/受體晶圓</p>
        <p type="p">904a:供體目標結構</p>
        <p type="p">904b:受體目標結構</p>
        <p type="p">905:供體基板支撐件</p>
        <p type="p">906:光學感測器</p>
        <p type="p">907:光學偵測單元</p>
        <p type="p">908:遞送光纖總成</p>
        <p type="p">909:反射及/或散射輻射</p>
        <p type="p">910:受體基板支撐件</p>
        <p type="p">911:感測器光學件</p>
        <p type="p">x:方向</p>
        <p type="p">y:方向</p>
        <p type="p">z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1314" publication-number="202624634">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624634</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132599</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>滾動軸承</chinese-title>
        <english-title>ROLLING BEARING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260310B">F16C33/78</main-classification>
        <further-classification edition="201601120260310B">F16J15/3204</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＮＴＮ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NTN CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, TAKERU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石田光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIDA, HIKARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種密封性穩定的滾動軸承。本發明之滾動軸承包含：內環（2）、外環（3）、夾設於內環（2）與外環（3）之間的複數滾動體，及將內環（2）及外環（3）間的軸承空間封閉的密封構件（6）。密封構件（6）的外周側部分（8）係固定於外環（3）的密封溝槽（9），並在密封構件（6）的內周側部分（13）設有與內環（2）之密封溝槽（7）中的外側面（7c）接觸的唇部（15）。密封構件（6）包含抑制內周側部分（13）往軸向內側傾倒的密封傾倒抑制手段（St）。密封傾倒抑制手段（St）係密封構件（6）的外周側部分（8）中，與外環（3）之密封溝槽（9）接觸的內側面（8a）具有越往軸向內側越朝內徑側傾斜的傾斜面（8aa）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a rolling bearing which makes the sealing performance stable. The rolling bearing includes: an inner ring (2); an outer ring (3); rolling elements interposed between the inner ring (2) and the outer ring (3); and a seal member (6) closing a bearing space between the inner ring (2) and the outer ring (3). An outer peripheral side part (8) of the seal member (6) is fixed to a seal groove (9), and an inner peripheral side part (13) of the seal member (6) includes a lip (15) which comes into contact with an outer surface (7c) of a seal groove (7). The seal member (6) includes a seal falling suppression means (St) to prevent the inner peripheral side part (13) from falling inward in an axial direction. The outer peripheral side part (8) of the seal member (6) includes an inner surface (8a) which comes into contact with the seal groove (9) of the outer ring (3). The inner surface (8a) includes an inclined surface (8aa) which is inclined toward the inner diametric side as it extends inward in the axial direction. The inclined surface (8aa) forms the seal falling suppression means (St).</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:內環</p>
        <p type="p">3:外環</p>
        <p type="p">6:密封構件</p>
        <p type="p">7:密封溝槽</p>
        <p type="p">7c:外側面</p>
        <p type="p">8:外周側部分</p>
        <p type="p">8a:內側面</p>
        <p type="p">8aa:傾斜面</p>
        <p type="p">9:密封溝槽</p>
        <p type="p">9a:內側面</p>
        <p type="p">9b:外側面</p>
        <p type="p">9c:溝底面</p>
        <p type="p">10:密封板</p>
        <p type="p">11:橡膠材</p>
        <p type="p">12:空氣孔</p>
        <p type="p">13:內周側部分</p>
        <p type="p">14:縮窄部</p>
        <p type="p">15:唇部</p>
        <p type="p">15c:內徑側前端部</p>
        <p type="p">16:副唇部</p>
        <p type="p">St:密封傾倒抑制手段</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1315" publication-number="202623923">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623923</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132613</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鋼胚之製造方法、鋼板之製造方法及連續鑄造機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">B22D11/22</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商杰富意鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JFE STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小田垣智也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ODAGAKI, TOMOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青木穗高</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOKI, HODAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茶谷悠喬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHATANI, HARUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>持田哲男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOCHIDA, TETSUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金子陽平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANEKO, YOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明所提供的鋼胚之製造方法，係在凝固末期不用強制性壓下鑄片，便可抑制鋼胚產生斷面缺陷的鋼胚之製造方法。  &lt;br/&gt;本發明的鋼胚之製造方法，係使用連續鑄造機進行製造的鋼胚之製造方法，將由鑄模冷卻而形成的鑄片利用複數個二次冷卻裝置進行冷卻，並將中心固相率為大於0.0且在1.0以下之範圍內的鑄片表面回熱量設定為預定目標值以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1316" publication-number="202623904">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623904</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132617</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>高速奈米液滴生成裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">B05B7/08</main-classification>
        <further-classification edition="200601120260309B">B05B7/24</further-classification>
        <further-classification edition="200601120260309B">B05B17/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人東北大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOHOKU UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤岳彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, TAKEHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中嶋智樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAJIMA, TOMOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉思維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, SIWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種高速奈米液滴生成裝置，係用以生成高速奈米液滴，前述高速奈米液滴係以1m/s至1000m/s之速度飛行且液滴的粒徑為1nm至1000nm之前述液滴的集團；前述高速奈米液滴生成裝置係具有：噴射部，係噴射高速奈米液滴；第一流體供給部，係朝向前述噴射部供給包含水蒸氣的第一流體；以及第二流體供給部，係朝向前述噴射部以超過一氣壓的供給壓力供給第二流體；前述噴射部係具備噴出前述第一流體之第一開口及噴出前述第二流體之第二開口而成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:高速奈米液滴生成裝置</p>
        <p type="p">11:第一流體供給部</p>
        <p type="p">12:第二流體供給部</p>
        <p type="p">13:噴射部</p>
        <p type="p">14:控制部</p>
        <p type="p">21:水槽</p>
        <p type="p">22,28b:加熱器</p>
        <p type="p">23:水蒸氣供給管</p>
        <p type="p">24,28c:溫度計</p>
        <p type="p">25:預熱氣體供給裝置</p>
        <p type="p">26:氣體源</p>
        <p type="p">27:壓力調整閥</p>
        <p type="p">28:氣體加熱裝置</p>
        <p type="p">28a:壓力容器</p>
        <p type="p">29:氣體供給管</p>
        <p type="p">31:第一開口</p>
        <p type="p">32:第二開口</p>
        <p type="p">33:第一流路</p>
        <p type="p">34:第二流路</p>
        <p type="p">35:殼體</p>
        <p type="p">81:粉體供給部</p>
        <p type="p">F:噴射距離</p>
        <p type="p">L:噴射方向</p>
        <p type="p">M:高速奈米液滴</p>
        <p type="p">R1:含水蒸氣氣體(第一流體)</p>
        <p type="p">R2:噴流氣體(第二流體)</p>
        <p type="p">S:噴射對象面</p>
        <p type="p">W:水</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1317" publication-number="202625797">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625797</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132625</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於功率元件之寬帶隙超接面結構</chinese-title>
        <english-title>WIDE-BANDGAP SUPER JUNCTION STRUCTURES FOR POWER DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260309B">H10W10/17</main-classification>
        <further-classification edition="202601120260309B">H10P95/90</further-classification>
        <further-classification edition="202601120260309B">H10P50/20</further-classification>
        <further-classification edition="202601120260309B">H10P32/10</further-classification>
        <further-classification edition="202501120260309B">H10D62/10</further-classification>
        <further-classification edition="202501120260309B">H10D62/60</further-classification>
        <further-classification edition="202501120260309B">H10D62/80</further-classification>
        <further-classification edition="202501120260309B">H10D64/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>能本許　葉門哈森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOURBAKHSH, AMIRHASAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">超接面元件可以藉由減少P型區域的寬度並增加摻雜濃度來形成，這樣可以增加元件的高度。然而，並不是單純刻蝕溝槽來填充P型材料，而是可以為P型和相鄰的N型區域同時刻蝕溝槽。這樣在增加元件高度的同時，還可以保持溝槽的可行深寬比。P型材料可以相對較薄地形成在溝槽的側壁上。然後，該溝槽可以填充N型材料，使得P型區域填充N型區域之間的空間，而不會形成任何空洞或接縫，同時其寬度是傳統刻蝕填充方法中無法僅用於P型區域達到的。還可以使用寬帶隙材料來提高電壓額定值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A super junction device may be formed by decreasing the width of the P-type region and increasing the doping concentration, allowing for an increased height of the device. However, instead of etching a trench to fill with the P-type material, a trench may be etched for both the P-type and adjacent N-type regions. This allows the height of the device to be increased while maintaining a feasible aspect ratio for the trench. The P-type material may be formed on the sidewall on the trench to be relatively thin. The trench may then be filled with N-type material such that the P-type region fills the space between the N-type regions without any voids or seams, while having a width that would be unattainable using traditional etch-and-fill methods for the P-type region alone. Wide bandgap materials may also be used to increase the voltage rating.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:結構</p>
        <p type="p">402:閘極區域</p>
        <p type="p">406:源極區域</p>
        <p type="p">408:N型寬帶隙區域</p>
        <p type="p">412:第二N型寬帶隙區域</p>
        <p type="p">416:其他N型寬帶隙區域</p>
        <p type="p">424:高度</p>
        <p type="p">426:基板</p>
        <p type="p">451:P型寬帶隙區域</p>
        <p type="p">453:P型寬帶隙區域</p>
        <p type="p">454:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1318" publication-number="202624980">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624980</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132632</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>分散式材料測試系統中的本端檔案存取</chinese-title>
        <english-title>LOCAL FILE ACCESS IN DISTRIBUTED MATERIAL TESTING SYSTEMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260312B">G06F16/178</main-classification>
        <further-classification edition="201301120260312B">G06F21/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商伊利諾工具工程公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ILLINOIS TOOL WORKS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱薩　丹尼爾文森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAESAR, DANIEL VINCENT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼可　史考特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NICOL, SCOTT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>摩斯　傑森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORSE, JASON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述分散式材料測試系統的實例，該等分散式材料測試系統儲存用於材料測試之選定檔案/資料的本端複本，以使得若中央資料儲存庫變得不可存取，則至少一些材料測試可以至少一定容量繼續進行。在一些實例中，在正常操作期間，用於材料測試之檔案/資料係儲存於該中央資料儲存庫中，使得連接至該中央資料儲存庫的若干材料測試系統可各自使用同一檔案/資料。然而，若對該中央資料儲存庫之存取變得暫時中斷，則可由本端材料測試系統使用該等本端檔案/資料複本以進行材料測試。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described herein are examples of distributed material testing systems that store local copies of selected files/data used for material testing, so that at least some material testing can continue in at least some capacity if a central data repository becomes inaccessible. In some examples, during normal operation, files/data used for material testing are stored in the central data repository so that the several material testing systems connected to the central data repository can each use the same files/data. However, if access to the central data repository becomes temporarily interrupted, the local file/data copies may be used by a local material testing system to conduct material tests.</p>
      </isu-abst>
      <representative-img>
        <p type="p">700b:GUI</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1319" publication-number="202625608">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625608</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132642</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260309B">H10D84/00</main-classification>
        <further-classification edition="202601120260309B">H10D84/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＸ半導體科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LX SEMICON CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔基埈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, KEE JOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本說明書揭露了一種包含雙溝槽之半導體裝置及其製造方法。半導體裝置包含：第一區域，其中於基板上提供多個第一半導體元件；第二區域，其中於基板上提供多個第二半導體元件；隔離區域，提供於第一區域與第二區域之間的基板中；淺溝槽，形成於第一區域及第二區域之基板中；淺溝槽絕緣膜，形成於該些淺溝槽之每一者內；深溝槽，形成於隔離區域之基板中；及深溝槽絕緣膜，形成於深溝槽內，其中在第一區域與第二區域之間之基板中未提供井接觸結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present specification discloses a semiconductor device including dual trenches and a method of fabricating the same. The semiconductor device includes a first region where a plurality of first semiconductor elements are provided on a substrate, a second region where a plurality of second semiconductor elements are provided on the substrate, an isolation region provided in the substrate between the first region and the second region, shallow trenches formed in the substrate of the first region and the second region, a shallow trench insulating film formed inside each of the shallow trenches, a deep trench formed in the substrate of the isolation region, and a deep trench insulating film formed inside the deep trench, in which a well tap structure is not provided in the substrate between the first region and the second region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:第一導電型基板</p>
        <p type="p">102:第一導電型高濃度第一井區域</p>
        <p type="p">103:第二導電型高濃度井區域</p>
        <p type="p">104:第一導電型高濃度第二井區域</p>
        <p type="p">105:淺溝槽</p>
        <p type="p">106:深溝槽</p>
        <p type="p">107:淺溝槽絕緣膜</p>
        <p type="p">108:深溝槽絕緣膜</p>
        <p type="p">110:第一閘極</p>
        <p type="p">111:第二閘極</p>
        <p type="p">112:側壁絕緣膜</p>
        <p type="p">113:第一導電型高濃度摻雜區域</p>
        <p type="p">114:第二導電型高濃度摻雜區域</p>
        <p type="p">115:井接觸</p>
        <p type="p">120:第一半導體元件</p>
        <p type="p">130:第二半導體元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1320" publication-number="202623849">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623849</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132643</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於病人呼吸裝置之導管接頭</chinese-title>
        <english-title>CONDUIT CONNECTOR FOR A PATIENT BREATHING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260315B">A61M39/10</main-classification>
        <further-classification edition="200601120260315B">A61M16/08</further-classification>
        <further-classification edition="200601120260315B">A61M16/16</further-classification>
        <further-classification edition="200601120260315B">A61M16/06</further-classification>
        <further-classification edition="200601120260315B">A61M16/00</further-classification>
        <further-classification edition="200601120260315B">A61B5/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紐西蘭商費雪　＆　佩凱爾關心健康有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FISHER &amp; PAYKEL HEALTHCARE LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古立佛　勞倫斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GULLIVER, LAURENCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>若娜亞　麥可　Ｐ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RONAYNE, MICHAEL PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>爾敏　查理斯　Ｗ　　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IRVING, CHARLES WILLIAM DOUGLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一實施方式中，一種用於將鼻插管與氣體輸送軟管進行附接的接頭或接頭元件包括用於一感測器探針的一感測器端口，該感測器探針被定位在一鼻插管的一端附近，該接頭或接頭元件與以前的接頭零件所允許的情況相比可以允許將該感測器探針被放置得更接近病人的鼻孔。在一實施方式中，該接頭被配置成用於有利地允許該鼻插管相對於該氣體輸送軟管而轉動，由此允許病人或醫療保健提供者解開或者以其他方式拉直該軟管或插管。在一實施方式中，該接頭元件被配置成用於自動地將一第一部件上的多個鎖定突起與一第二部件上的多個鎖定凹陷對準，其中該第二部件插入該第一部件內導致該第二部件相對於該第一部件而轉動，由此將該等鎖定突起與相關聯的鎖定凹陷對準。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In an embodiment, a connector or connector assembly for attaching a nasal cannula with a gas delivery hose includes a sensor port for a sensor probe positioned near an end of a nasal cannula, which can allow the sensor probe to be placed closer to the patient’s nostrils than previous connector parts allowed. In an embodiment, the connector is configured to advantageously allow the nasal cannula to rotate relative to the gas delivery hose, thereby allowing a patient or healthcare provider to untangle or otherwise straighten the hose or the cannula. In an embodiment, the connector assembly is configured to automatically align locking protrusions on a first component with locking recesses on a second component, where insertion of the second component within the first component causes the second component to rotate relative to the first component, thereby aligning the locking protrusions with associated locking recesses.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:氣體輸送導管</p>
        <p type="p">105:接頭</p>
        <p type="p">110:第一管道、鼻插管</p>
        <p type="p">115:第二管道</p>
        <p type="p">120:終端導管接頭</p>
        <p type="p">125:源導管接頭</p>
        <p type="p">130:感測器端口</p>
        <p type="p">135:感測器探針</p>
        <p type="p">140:連接適配器</p>
        <p type="p">145,155:源孔口</p>
        <p type="p">150,165:終端孔口</p>
        <p type="p">151:鎖定接片</p>
        <p type="p">152:對準接片</p>
        <p type="p">153:鎖定指形件</p>
        <p type="p">154:鎖定凹陷</p>
        <p type="p">160:通道</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1321" publication-number="202624419">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624419</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132654</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>銅錯合物墨水及銅膜之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260309B">C09D11/52</main-classification>
        <further-classification edition="200601120260309B">H01B1/22</further-classification>
        <further-classification edition="200601120260309B">H01B13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友金屬鑛山股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO METAL MINING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>半澤和樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANZAWA, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>狩敦
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IGARI, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戸倉凜太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKURA, RINTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供儲存安定性優良，可製造體積電阻率低且平滑性高的銅配線之銅錯合物墨水及銅膜之製造方法。  &lt;br/&gt;　　一種銅錯合物墨水，其含有通式  &lt;br/&gt;(HCOO)&lt;sub&gt;2&lt;/sub&gt;Cu((CH&lt;sub&gt;3&lt;/sub&gt;)&lt;sub&gt;2&lt;/sub&gt;C(NH&lt;sub&gt;2&lt;/sub&gt;)CH&lt;sub&gt;2&lt;/sub&gt;OH)&lt;sub&gt;2&lt;/sub&gt;表示之銅錯合物，自製造起30日之析出粒子的存在比例為未達50面積%，前述析出粒子之最大粒子徑為未達10μm。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1322" publication-number="202623884">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623884</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132658</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>膜分離裝置、膜分離系統、螺旋型膜元件用之端部構件及膜分離系統之運轉方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">B01D61/12</main-classification>
        <further-classification edition="200601120260306B">B01D61/22</further-classification>
        <further-classification edition="200601120260306B">B01D63/10</further-classification>
        <further-classification edition="200601120260306B">B01D65/02</further-classification>
        <further-classification edition="202301120260306B">C02F1/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平井智也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRAI, TOMOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小川知哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGAWA, TOMOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之膜分離裝置100具備：過濾構件10，其具有將包含固形物之供給流體F1分離為過濾流體F2與非過濾流體F3之過濾部11；及螺旋型膜元件20，其被供給過濾流體F2。膜元件20包含：中心管23，其具有貫通孔23h；及膜葉24，其具有分離膜24a，且捲繞於中心管23。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:過濾構件</p>
        <p type="p">11:過濾部</p>
        <p type="p">20:膜元件</p>
        <p type="p">20s:外周面</p>
        <p type="p">21:元件本體</p>
        <p type="p">21s:外周面</p>
        <p type="p">22:外裝材</p>
        <p type="p">23:中心管</p>
        <p type="p">23c:端蓋</p>
        <p type="p">23h:貫通孔</p>
        <p type="p">26:密封構件</p>
        <p type="p">26h:貫通孔</p>
        <p type="p">27:密封構件</p>
        <p type="p">30:外殼</p>
        <p type="p">30s:內周面</p>
        <p type="p">31:外殼本體</p>
        <p type="p">33a:端口</p>
        <p type="p">33b:端口</p>
        <p type="p">33c:端口</p>
        <p type="p">35:空間</p>
        <p type="p">35a:上游側空間</p>
        <p type="p">35b:下游側空間</p>
        <p type="p">40:端部構件</p>
        <p type="p">41g:槽部</p>
        <p type="p">50a:供給流體入口</p>
        <p type="p">50b:透過流體出口</p>
        <p type="p">50c:非處理流體出口</p>
        <p type="p">100:膜分離裝置</p>
        <p type="p">201s:端面</p>
        <p type="p">202s:端面</p>
        <p type="p">301:端部</p>
        <p type="p">302:端部</p>
        <p type="p">321:第1端板</p>
        <p type="p">321s:內側面</p>
        <p type="p">322:第2端板</p>
        <p type="p">322s:內側面</p>
        <p type="p">F1:供給流體</p>
        <p type="p">F2:過濾流體</p>
        <p type="p">F3:非過濾流體</p>
        <p type="p">F4:透過流體</p>
        <p type="p">F5:非透過流體</p>
        <p type="p">F6:非處理流體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1323" publication-number="202624329">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624329</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132670</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>外部電極用導電性膏、及具備使用該導電性膏形成之外部電極的積層陶瓷電子零件</chinese-title>
        <english-title>ELECTROCONDUCTIVE PASTE FOR EXTERNAL ELECTRODE, AND LAMINATED CERAMIC ELECTRONIC COMPONENT WITH EXTERNAL ELECTRODE FORMED USING THE CONDUCTIVE PASTE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08G59/62</main-classification>
        <further-classification edition="200601120260302B">C09D163/00</further-classification>
        <further-classification edition="201801120260302B">C09D7/61</further-classification>
        <further-classification edition="201801120260302B">C09D7/63</further-classification>
        <further-classification edition="200601120260302B">C09D5/24</further-classification>
        <further-classification edition="200601120260302B">H01B1/00</further-classification>
        <further-classification edition="200601120260302B">H01B1/22</further-classification>
        <further-classification edition="200601120260302B">H01G4/12</further-classification>
        <further-classification edition="200601120260302B">H01G4/232</further-classification>
        <further-classification edition="200601120260302B">H01G4/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商納美仕有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAMICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松原光明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUBARA, MITSUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種具備可承受高熔融溫度之焊料的熱之高耐熱性，且具備即使相對於吸濕物的急遽膨脹亦可進行應力緩和之柔軟性的導電性膏。  &lt;br/&gt;一種外部電極用導電性膏，係含有：(A)導電性粒子、(B)環氧樹脂、(C)硬化劑、及(D)雙順丁烯二醯亞胺化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides an electroconductive paste having high heat resistance capable of withstanding heat from high-melting-point solder, and also having softness that can relieve stress even against sudden swelling of a moisture-absorbed material. &lt;br/&gt;The electroconductive paste for external electrodes comprises: (A) conductive particles, (B) an epoxy resin, (C) a curing agent, and (D) a bismaleimide compound.</p>
      </isu-abst>
      <representative-img>
        <p type="p">本案無指定代表圖</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1324" publication-number="202625098">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625098</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132685</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用人工智慧模型分析指示劑的方法和系統</chinese-title>
        <english-title>METHODS AND SYSTEMS USING AN ARTIFICIAL INTELLIGENCE MODEL TO ANALYZE INDICATORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260310B">G06V10/26</main-classification>
        <further-classification edition="202201120260310B">G06V10/25</further-classification>
        <further-classification edition="202201120260310B">G06V10/56</further-classification>
        <further-classification edition="202201120260310B">G06V10/82</further-classification>
        <further-classification edition="202201120260310B">G06V10/98</further-classification>
        <further-classification edition="200601120260310B">G06K19/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商泰拉基因有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TERRAGENE LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>隆巴爾迪亞　埃斯特班</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOMBARDIA, ESTEBAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅韋托　阿德里安　赫蘇斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROVETTO, ADRIAN JESUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普拉蒂亞　馬克西米利亞諾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PLATIA, MAXIMILIANO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孔諾　希納西　華金</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONNO, HISASHI JOAQUIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種監測洗滌、消毒和滅菌過程中使用的化學指示劑的方法；執行所述方法的系統；一種用於量化經受超音波洗滌循環的空化指示劑中的空化能量的方法；以及執行所述用於量化空化能量的方法的系統，其中所述方法和系統中的每一個使用人工智慧模型來分析指示劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for monitoring chemical indicators used in washing, disinfection and sterilization processes; a system which carries out said method; a method for quantifying cavitation energy in a cavitation indicator subjected to an ultrasonic wash cycle; and a system which carries out said method for quantifying cavitation energy, wherein each of said methods and systems uses an artificial intelligence model to analyze indicators.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1325" publication-number="202624757">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624757</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132690</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>探針及插座</chinese-title>
        <english-title>PROBE AND SOCKET</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">G01R1/067</main-classification>
        <further-classification edition="200601120260312B">G01R1/073</further-classification>
        <further-classification edition="202001120260312B">G01R31/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商友華股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOKOWO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>軣木岳史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TODOROKI, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題為提供一種可謀求提升探針的前端位置精度之探針及插座。本發明的探針係具有可插入機殼之探針孔的柱塞，其中，前述柱塞的外周的一部分或整體的外徑係與前述探針孔的內徑一致，或比前述內徑更大；於前述柱塞形成有能夠使前述外徑彈性地縮小的狹縫。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The objective of the present invention is to provide a probe and a socket that is capable of improving the accuracy of the tip position of the probe. &lt;br/&gt;A probe includes a plunger inserted into a probe hole of a housing, wherein an outer diameter of a part or the entirety of the outer periphery of the plunger is equal to or greater than an inner diameter of the probe hole, and a slit configured to allow the outer diameter to elastically contract is formed in the plunger.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:探針</p>
        <p type="p">5:插座</p>
        <p type="p">10:第一柱塞</p>
        <p type="p">11:狹縫</p>
        <p type="p">12:前端部</p>
        <p type="p">13:凸部</p>
        <p type="p">13a:周面</p>
        <p type="p">13b:錐面</p>
        <p type="p">15:凸緣部</p>
        <p type="p">16:中空部</p>
        <p type="p">17:防止脫落用卡止部</p>
        <p type="p">20:第二柱塞</p>
        <p type="p">21:入管部</p>
        <p type="p">22:中間柱狀部</p>
        <p type="p">23:後端柱狀部</p>
        <p type="p">30:彈簧</p>
        <p type="p">40:機殼</p>
        <p type="p">41:第一機殼部</p>
        <p type="p">42:第二機殼部</p>
        <p type="p">43:探針孔</p>
        <p type="p">43a,43b:孔部</p>
        <p type="p">43c:大徑部</p>
        <p type="p">43d:小徑部</p>
        <p type="p">45:段差面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1326" publication-number="202625832">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625832</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132703</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>功率半導體裝置封裝</chinese-title>
        <english-title>POWER SEMICONDUCTOR DEVICE PACKAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260312B">H10W70/40</main-classification>
        <further-classification edition="202601120260312B">H10W74/01</further-classification>
        <further-classification edition="202601120260312B">H10W29/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商沃孚半導體有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOLFSPEED, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩勒曼　阿迪爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SALMAN, ADIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德西　蓋扎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEZSI, GEZA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴克利　亞當　班傑明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARKLEY, ADAM BENJAMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝祥遇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供功率半導體裝置封裝及其製造方法。在一個實例中，一種功率半導體裝置封裝可包含界定一外殼平面之一外殼、一第一基台上之一第一半導體晶粒、一第二基台上之一第二半導體晶粒及該外殼中之一爬電延伸結構。該第一基台可與該第二基台電隔離。在一個實例中，該功率半導體裝置封裝可進一步包含自該外殼延伸之第一複數個電引線及自該外殼延伸之第二複數個電引線。在一個實例中，該第二複數個電引線可相對於該第一複數個電引線圍繞該外殼平面旋轉180º。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Power semiconductor device packages and method for manufacturing the same are provided. In one example, a power semiconductor device package may include a housing that defines a housing plane, a first semiconductor die on a first submount, a second semiconductor die on a second submount, and a creepage extension structure in the housing. The first submount may be electrically isolated from the second submount. In one example, the power semiconductor device package may further include a first plurality of electrical leads extending from the housing and a second plurality of electrical leads extending from the housing. In one example, the second plurality of electrical leads may be rotated 180-degrees about the housing plane relative to the first plurality of electrical leads.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:功率半導體裝置封裝</p>
        <p type="p">102:外殼</p>
        <p type="p">102':第一周邊端</p>
        <p type="p">102":第二周邊端</p>
        <p type="p">102A:第一部分</p>
        <p type="p">102B:第二部分</p>
        <p type="p">104A:第一主側</p>
        <p type="p">106A:第一副側</p>
        <p type="p">106B:第二副側</p>
        <p type="p">106C:第三副側</p>
        <p type="p">106D:第四副側</p>
        <p type="p">120-1:第一引線</p>
        <p type="p">120-2:第二引線</p>
        <p type="p">120-3:第三引線</p>
        <p type="p">120-4:第四引線</p>
        <p type="p">130-1:第一引線</p>
        <p type="p">130-2:第二引線</p>
        <p type="p">130-3:第三引線</p>
        <p type="p">130-4:第四引線</p>
        <p type="p">H:外殼平面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1327" publication-number="202623973">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623973</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132733</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資訊處理系統及資訊處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260223B">B25J13/08</main-classification>
        <further-classification edition="200601120260223B">B25J9/16</further-classification>
        <further-classification edition="200601120260223B">G05B19/409</further-classification>
        <further-classification edition="200601120260223B">C12M3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日立全球先端科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小坂淳也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSAKA, JUNYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原聡
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEHARA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石上幸彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIGAMI, YUKIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種能夠藉由使用者之操作來對於機械之動作進行修正並讓使用者實現所期望之機械之動作的技術。  &lt;br/&gt;　　[解決手段]資訊處理系統，係具備有：操作裝置，係保持用以進行對象物之處理之處理器具，並進行處理器具之操作；和控制裝置，係對於操作裝置之動作進行控制，該資訊處理系統，並具備有：力覺感測器，係被設置在操作裝置處，並檢測出當伴隨著操作裝置之動作而處理器具與對象物作接觸時所產生之壓力，控制裝置，係根據由力覺感測器所致之檢測結果，來取得在相對於對象物之表面之法線方向上所產生之法線壓力，並基於法線壓力來對於操作裝置之動作進行控制。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1328" publication-number="202623748">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623748</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132754</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔組件、清潔設備、清潔設備的控制方法和清潔系統</chinese-title>
        <english-title>CLEANING ASSEMBLY, CLEANING EQUIPMENT, CONTROL METHOD OF THE CLEANING EQUIPMENT AND CLEANING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260310B">A47L11/40</main-classification>
        <further-classification edition="200601120260310B">A47L11/293</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉瀾濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, LANTAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡彩云</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, CAIYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>單建強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAN, JIANQIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請實施例提供了一種清潔組件、清潔設備、清潔設備的控制方法和清潔系統，清潔組件包括拖板和拖布。拖布設於所述拖板上，所述拖板的頂側包括第一導流面；所述拖板靠近所述第一導流面的部分區域鏤空，以形成連通所述拖板的頂部和底部的鏤空區；所述第一導流面至少部分地引導清潔液通過所述鏤空區。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The embodiments of the application provide a cleaning assembly, cleaning equipment, control method of the cleaning equipment and cleaning system, wherein the cleaning assembly comprises a mop board and a mop. The mop is installed on the mop board, and the top side of the mop board includes a first guide surface; the part areas of the mop board near the first guide surface is hollowed out to form a hollow area connecting the top and bottom of the mop board; the first guide surface at least partially guides the cleaning liquid through the hollow area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:殼體組件</p>
        <p type="p">20:清潔組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1329" publication-number="202623933">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623933</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132841</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>定量化以雷射標記在對象物上形成的刻印的評估指標的方法、以雷射標記在對象物上形成的刻印的評估方法以及以雷射標記在對象物上形成刻印用的最適雷射照射條件的預測方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260312B">B23K26/00</main-classification>
        <further-classification edition="200601120260312B">G06K19/06</further-classification>
        <further-classification edition="201701120260312B">G06T7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商寶理塑料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POLYPLASTICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仲絢香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKA, AYAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山﨑修幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASAKI, NAOYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青沼友美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AONUMA, TOMOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大井和樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHI, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種可以定量化以雷射標記在對象物上形成的刻印的評估指標的方法。根據本發明一態樣，是提供定量化以雷射標記在對象物上形成的刻印的評估指標的方法，前述評估指標包含至少對比度、色變異、色調及刻印密度，包含：算出前述雷射照射區域的眾數與前述雷射非照射區域的眾數之差的絕對值而作為前述對比度的步驟；算出前述雷射照射區域的標準差作為前述色變異的步驟；算出紅色、綠色、藍色各色的前述雷射照射區域的眾數對於前述各色的前述雷射照射區域的眾數的合計的占比作為前述色調的步驟；以及算出對於前述雷射照射區域中的雷射標記良品區域與雷射標記不良區域的合計面積之前述雷射標記良品區域的占比作為刻印密度的步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1-1,S1-2,S1-3,S1-4:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1330" publication-number="202625822">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625822</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132847</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於半導體冷卻應用的冷板之製造方法以及冷板</chinese-title>
        <english-title>PROCESS OF MANUFACTURING A COLDPLATE FOR SEMICONDUCTOR COOLING APPLICATIONS AND COLDPLATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260312B">H10W40/47</main-classification>
        <further-classification edition="200601120260312B">G06F1/20</further-classification>
        <further-classification edition="201501120260312B">B33Y10/00</further-classification>
        <further-classification edition="200601120260312B">B22F5/10</further-classification>
        <further-classification edition="202601120260312B">H10W40/00</further-classification>
        <further-classification edition="202601120260312B">H10W40/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商科林堤斯公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORINTIS SA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法蘭西斯康　安德烈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRANCESCON, ANDREA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范　俄普　雷姆科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN ERP, REMCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希門尼斯　阿爾瓦雷斯　德　西恩富戈斯　耶穌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIMENEZ ALVAREZ DE CIENFUEGOS,JESUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明有關於一種用於半導體冷卻應用的冷板的製造方法，包含步驟：&lt;br/&gt;  提供一基底板(102)，&lt;br/&gt;  以每小時15和8500平方公分的建造速度在基底板(102)的頂部3D網印一冷卻結構層(104)，以在冷板(100)內形成具有25和200微米之間的臨界尺寸以及1和80之間的長寬比的一第一三維冷卻結構(106)，其中第一三維冷卻結構(106)包括具有微結構的至少一區域(108)，包括：&lt;br/&gt;  多個通道(110)一網格，用於導引一冷卻劑，以及&lt;br/&gt;  兩個或更多的三維結構(112)，其有助於通道的網格的通道邊界的形成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a process of manufacturing a coldplate (100) for semiconductor cooling applications, with the steps&lt;br/&gt; providing a base plate (102),&lt;br/&gt; 3D screen printing a cooling structure layer (104) on top of the base plate (102) with a build rate between 15 and 8,500 cm³ per hour to form a first three-dimensional cooling structure (106) within the coldplate (100) having critical dimensions between 25 and 200 µm and an aspect ratio between 1 and 80, wherein the first three-dimensional cooling structure (106) comprises at least one area (108) with a microstructure including&lt;br/&gt; a network of channels (110) for guiding a cooling agent, and&lt;br/&gt; two or more three-dimensional features (112) which contribute to the formation of boundaries of the channels of the network of channels (110).</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:冷板</p>
        <p type="p">101:支持板/支持層</p>
        <p type="p">102:基底板/基底層</p>
        <p type="p">103:模板</p>
        <p type="p">104:冷卻結構層/冷卻結構</p>
        <p type="p">105:空間</p>
        <p type="p">106:第一三維冷卻結構/三維冷卻結構/冷卻結構</p>
        <p type="p">107:刮刀</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1331" publication-number="202623920">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623920</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132858</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>輥壓裝置及製造加工品之方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">B21B29/00</main-classification>
        <further-classification edition="200601120260306B">B21B37/38</further-classification>
        <further-classification edition="200601120260306B">B21B38/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商新東工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINTOKOGIO, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古川恭治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUKAWA, KYOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中島章五</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAJIMA, SHOGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡南成幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKANAMI, NARIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示提供一種可減少寬度方向之厚度不均勻之工件之產生量之技術。輥壓裝置具備：感測器單元，其量測第一輥及第二輥之形狀而檢測第一輥及第二輥之撓曲；及控制部，其根據由感測器單元檢測出之撓曲，以對第一輥及第二輥賦予逆撓曲之方式，使第一彎曲單元及第二彎曲單元之至少一者動作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:輥壓裝置</p>
        <p type="p">2:上輥</p>
        <p type="p">3:下輥</p>
        <p type="p">4:捲出軸</p>
        <p type="p">5:捲繞軸</p>
        <p type="p">6:本體框架</p>
        <p type="p">20:上旋轉軸</p>
        <p type="p">21:第一主軸承</p>
        <p type="p">23:第一彎曲軸承</p>
        <p type="p">30:下旋轉軸</p>
        <p type="p">31:第三主軸承</p>
        <p type="p">33:第三彎曲軸承</p>
        <p type="p">42:第二加壓缸</p>
        <p type="p">51:第一彎曲缸</p>
        <p type="p">70:厚度感測器單元</p>
        <p type="p">W:工件</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1332" publication-number="202625517">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625517</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132860</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>配線電路基板之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">H05K3/00</main-classification>
        <further-classification edition="200601120260302B">H05K3/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島健太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, KENTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴田周作</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBATA, SHUSAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>玉木優作</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAMAKI, YUSAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">於本發明之配線電路基板1之製造中，首先，準備金屬支持基板2。繼而，於金屬支持基板2之厚度方向上之一面形成基底絕緣層3。繼而，於基底絕緣層3之厚度方向上之一面形成導體層4。繼而，於準備金屬支持基板2之步驟中，對金屬支持基板2進行預熱。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:配線電路基板</p>
        <p type="p">2:金屬支持基板</p>
        <p type="p">3:基底絕緣層</p>
        <p type="p">3A:基底絕緣層</p>
        <p type="p">3B:基底絕緣層</p>
        <p type="p">4:導體層</p>
        <p type="p">4A:導體層</p>
        <p type="p">4B:導體層</p>
        <p type="p">5:覆蓋絕緣層</p>
        <p type="p">5A:覆蓋絕緣層</p>
        <p type="p">5B:覆蓋絕緣層</p>
        <p type="p">11A:分割體</p>
        <p type="p">11B:分割體</p>
        <p type="p">20:原片</p>
        <p type="p">21:被加熱基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1333" publication-number="202623950">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623950</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132864</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有在化學機械拋光中由載具保持的基板的原位監測系統</chinese-title>
        <english-title>IN-SITU MONITORING SYSTEM WITH SUBSTRATE HELD BY CARRIER IN CHEMICAL MECHANICAL POLISHING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260312B">B24B37/013</main-classification>
        <further-classification edition="201201120260312B">B24B37/04</further-classification>
        <further-classification edition="201201120260312B">B24B37/10</further-classification>
        <further-classification edition="200601120260312B">B24B49/02</further-classification>
        <further-classification edition="200601120260312B">B24B53/007</further-classification>
        <further-classification edition="201201120260312B">B24B53/017</further-classification>
        <further-classification edition="202601120260312B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　永豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAU, ERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑瑞安　班傑明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHERIAN, BENJAMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利希堤納　艾琳恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LISTIANA, EILIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ID</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種技術包括：在將基板吸附至承載頭以防止該基板相對於該承載頭旋轉的同時，旋轉該承載頭並移動平臺；使該基板與拋光墊接觸；在該基板被吸附至該承載頭且與該拋光墊接觸的同時，藉由使原位監測系統的感測器掃掠來監測該基板，以生成軌跡序列，每個相應軌跡對應於由該感測器進行的相應掃掠，每個相應軌跡包括訊號值序列；追蹤該承載頭的角度定向；對於每個相應訊號值，使用該承載頭的該角度定向確定該相應訊號值的該基板的角度和徑向位置；以及使用厚度值構建該基板上的層的厚度的二維圖。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A technique includes: while chucking a substrate to a carrier head to prevent rotation of the substrate relative to the carrier head, rotating the carrier head and moving a platen; bringing the substrate into contact with a polishing pad; while the substrate is chucked to the carrier head and in contact with the polishing pad, monitoring the substrate by sweeping a sensor of an in-situ monitoring system to generate a sequence of traces with each respective trace corresponding to a respective sweep by the sensor, each respective trace including a sequence of signal values; tracking an angular orientation of the carrier head; for each respective signal value, determining, using the angular orientation of the carrier head, an angular and radial position of the substrate for the respective signal value; and constructing, using the thickness values, a two-dimensional map of a thickness of a layer on the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板</p>
        <p type="p">110:拋光站</p>
        <p type="p">120:平臺</p>
        <p type="p">122:中心軸</p>
        <p type="p">123:旋轉電氣聯結裝置</p>
        <p type="p">124:馬達</p>
        <p type="p">125:編碼器</p>
        <p type="p">126:驅動軸</p>
        <p type="p">130:拋光墊</p>
        <p type="p">132:拋光層</p>
        <p type="p">133:背襯層</p>
        <p type="p">136:拋光表面</p>
        <p type="p">140:承載頭</p>
        <p type="p">142:扣環</p>
        <p type="p">144:膜</p>
        <p type="p">146a:腔室</p>
        <p type="p">146b:腔室</p>
        <p type="p">146c:腔室</p>
        <p type="p">150:支撐結構</p>
        <p type="p">152:中央軸</p>
        <p type="p">154:驅動軸</p>
        <p type="p">156:馬達</p>
        <p type="p">158:編碼器</p>
        <p type="p">165:端口</p>
        <p type="p">167:臂</p>
        <p type="p">169:拋光液</p>
        <p type="p">180:監測系統</p>
        <p type="p">181:感測器頭</p>
        <p type="p">183:凹槽</p>
        <p type="p">184:凹槽</p>
        <p type="p">185:參考點</p>
        <p type="p">186:感測電路系統</p>
        <p type="p">187:接線</p>
        <p type="p">188:感測器</p>
        <p type="p">189:旗標</p>
        <p type="p">190:控制器</p>
        <p type="p">192:中央處理單元(CPU)</p>
        <p type="p">193:輸出裝置</p>
        <p type="p">194:記憶體</p>
        <p type="p">196:支援電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1334" publication-number="202625552">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625552</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132874</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於近記憶體運算的堆疊三維動態隨機存取記憶體（３Ｄ　ＤＲＡＭ）上的彈性處理單元放置</chinese-title>
        <english-title>FLEXIBLE PROCESSING UNIT PLACEMENT ON STACKED THREE-DIMENSIONAL DYNAMIC RANDOM-ACCESS MEMORY (3D DRAM) FOR NEAR-MEMORY COMPUTING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260313B">H10B12/00</main-classification>
        <further-classification edition="202601120260313B">H10W90/00</further-classification>
        <further-classification edition="202601120260313B">H10D88/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝達羅格魯　默斯塔法</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BADAROGLU, MUSTAFA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康　宇泰格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, WOO TAG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔　智弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, JIHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　中澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZHONGZE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>娜拉帕帝　吉里德爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NALLAPATI, GIRIDHAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曲丹巴瑞　派瑞安南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIDAMBARAM, PERIANNAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述一種三維(3D)堆疊記憶體封裝。該3D堆疊記憶體封裝包括堆疊在該基底晶粒上的複數個記憶體晶粒。該3D堆疊記憶體封裝亦包括支撐該基底晶粒的封裝基材。該3D堆疊記憶體封裝進一步包括配置在該基底晶粒上的複數個處理單元(PU)。該複數個處理單元位於該基底晶粒的不同位置處。該3D堆疊記憶體封裝亦包括一或多個系統匯流排，其等位於該基底晶粒上並耦接在該一或多個PU與該複數個記憶體晶粒的落在該基底晶粒上的矽穿孔(TSV)群組之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A three-dimensional (3D) stacked memory package is described. The 3D stacked memory package includes a plurality of memory dies stacked on the base die. The 3D stacked memory package also includes a package substrate supporting the base die. The 3D stacked memory package further includes a plurality of processing units (PUs) arranged on the base die. The plurality of processing units are located at different locations of the base die. The 3D stacked memory package also includes one or more system buses on the base die and coupled between the one or more PUs and through silicon via (TSV) groups of the plurality of memory dies landing on the base die.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:主機系統單晶片</p>
        <p type="p">130:主動層</p>
        <p type="p">300:極端頻寬3D堆疊記憶體晶片</p>
        <p type="p">302:封裝基材</p>
        <p type="p">304:封裝凸塊</p>
        <p type="p">310:基底晶粒</p>
        <p type="p">312:邏輯/信號TSV</p>
        <p type="p">314:主動層</p>
        <p type="p">320:實體IO模組</p>
        <p type="p">330:記憶體晶粒</p>
        <p type="p">334:主動層</p>
        <p type="p">340:TSV群組</p>
        <p type="p">350:系統匯流排</p>
        <p type="p">352,354:微庫連接</p>
        <p type="p">360-1:處理單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1335" publication-number="202625504">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625504</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132883</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有磁濾波器的減速場能量分析儀</chinese-title>
        <english-title>RETARDING FIELD ENERGY ANALYZER WITH MAGNETIC FILTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">H05H1/10</main-classification>
        <further-classification edition="200601120260309B">G01R29/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>烏梅許　蘇哈斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UMESH, SUHAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黑爾米希　安科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HELLMICH, ANKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴亞蒂　阿米爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAYATI, AMIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬爾姆斯　克里斯多福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MALMS, CHRISTOPHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈迪森　林賽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARDISON, LINDSAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本披露的實施例涉及一種裝置，包括具有開口的外殼，以及在外殼內垂直堆疊排列的複數個網格。在一個實施例中，外殼內的複數個網格下方設有收集板，並且有磁模組鄰近於開口。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments described herein relate to an apparatus that includes a housing with an opening, and a plurality of grids within the housing that are arranged in a vertical stack. In an embodiment, a collector plate is provided below the plurality of grids within the housing, and a magnetic module is adjacent to the opening.</p>
      </isu-abst>
      <representative-img>
        <p type="p">201:離子</p>
        <p type="p">202:虛線</p>
        <p type="p">205:電漿</p>
        <p type="p">218:板</p>
        <p type="p">219:襯墊</p>
        <p type="p">221:外殼</p>
        <p type="p">222:板</p>
        <p type="p">223:板</p>
        <p type="p">224:板</p>
        <p type="p">225:板</p>
        <p type="p">226:收集板</p>
        <p type="p">227:絕緣層</p>
        <p type="p">228:開口</p>
        <p type="p">229:網格</p>
        <p type="p">236:RFEA感測器</p>
        <p type="p">V1:電壓</p>
        <p type="p">V2:電壓</p>
        <p type="p">V3:電壓</p>
        <p type="p">V4:電壓</p>
        <p type="p">V5:電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1336" publication-number="202625238">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625238</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132890</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>控制方法，帶電粒子束裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120250911B">H01J37/153</main-classification>
        <further-classification edition="200601120250911B">H01J37/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日立全球先端科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>代爾夫特理工大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TECHNISCHE UNIVERSITEIT DELFT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>数見秀之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAZUMI, HIDEYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬斯　迪德里克　揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAAS, DIEDERIK JAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克爾特　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRUIT, PIETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>範維爾岑　萊昂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN VELZEN, LEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示，目的在於在具備像差修正器的帶電粒子束裝置中，提供一種能夠適當地評估像差之技術。本揭示之控制方法，於藉由掃描帶電粒子束而從前述光學元件反射或通過前述光學元件的帶電粒子進一步通過射束限制孔徑後，檢測前述帶電粒子，基於前述射束限制孔徑的開口部的投影像的特徵量而評估前述帶電粒子束的像差。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S801~S805:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1337" publication-number="202623749">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623749</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132923</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>殼體組件和清潔設備</chinese-title>
        <english-title>SHELL COMPONENT AND CLEANING EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">A47L11/40</main-classification>
        <further-classification edition="200601120260312B">A47L11/24</further-classification>
        <further-classification edition="200601120260312B">A47L11/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐洪亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, HONGLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供了一種殼體組件和清潔設備。其中，殼體組件包括：基體，基體開設有安裝倉，清潔設備的機械臂可折疊收納在安裝倉內，安裝倉設置有倉口；門體，門體相對於基體可活動以打開或閉合倉口。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a shell component and cleaning equipment. The shell component includes: a base body, which is equipped with an installation chamber. The mechanical arm of the cleaning equipment can be folded and stored within the installation chamber, which is provided with a chamber opening; a door body, which is movable relative to the base body to open or close the chamber opening.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:殼體組件</p>
        <p type="p">110:基體</p>
        <p type="p">111:安裝倉</p>
        <p type="p">1111:倉口</p>
        <p type="p">112:避讓口</p>
        <p type="p">113:連接座</p>
        <p type="p">120:門體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1338" publication-number="202624251">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624251</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132947</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>白介素-　23受體的肽抑制劑的藥物組合物及其製備方法和用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07K7/64</main-classification>
        <further-classification edition="200601120260302B">A61K38/12</further-classification>
        <further-classification edition="200601120260302B">A61P37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商西藏海思科製藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIZANG HAISCO PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李小平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XIAOPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅靈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>關琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUAN, LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REN, DONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林發立</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯春岑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明屬於藥物製劑領域，具體涉及一種配製成單劑量形式的藥物組合物或藥物製劑，所述的藥物組合物或藥物製劑包含活性成分M和藥用賦形劑，所述的活性成分M選自環肽化合物，其立體異構體或者其藥學上可接受的鹽或溶劑化物或二聚體，其中所述肽化合物具有式(I)的氨基酸序列：  &lt;br/&gt;&lt;img align="absmiddle" height="56px" width="496px" file="ed10201.JPG" alt="ed10201.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;       ，按照游離鹼形式的含量計，所述藥物組合物或藥物製劑包含1mg-1000mg活性成分M。本發明還涉及所述藥物組合物或藥物製劑在製備預防和治療受試者患病組織中過度表達 IL-23的疾病或病症藥物中的應用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1339" publication-number="202624649">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624649</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132949</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具感測功能之電磁閥裝置</chinese-title>
        <english-title>SOLENOID VALVE DEVICE WITH SENSING FUNCTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251017B">F16K31/10</main-classification>
        <further-classification edition="200601120251017B">F16K31/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>合通先進股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HETONE EV VANGUARD CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>信統電產股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOLEN ELECTRIC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張維正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, WEI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬培盛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, PEI-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝豐吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, FENG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許信裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHU, HSIN YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種具感測功能之電磁閥裝置，包含：一電磁閥，設有一電磁閥線圈以及一閥芯，其中該電磁閥線圈用以產生一磁力以使該閥芯產生一位移；一閥體，設有一進水口與一出水口，並形成一液體流道，該閥芯設置於該閥體中，用以控制該液體流道之開啟及關閉；以及一感測元件，耦接該閥體，用以感測該電磁閥之一開啟或關閉狀態。本發明之具感測功能之電磁閥裝置，透過配置於電磁閥閥體中之一感測元件，以即時感測該電磁閥之開啟或關閉狀態，進而提升系統控制之精準度與可靠性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a solenoid valve device with sensing function, comprising: a solenoid valvecomprising a solenoid coil and a valve core, wherein the solenoid coil is configured to generate a magnetic force to cause displacement of the valve core; a valve body, provided with an inlet and an outlet and forming a fluid flow passage, wherein the valve core is disposed within the valve body and configured to control the opening and closing of the fluid flow passage; and a sensing elementcoupled to the valve body and configured to detect whether the solenoid valve is in an open or closed state. The solenoid valve device with sensing function of the present invention enables real-time detection of the open or closed state of the solenoid valve through the sensing element disposed in the valve body, thereby enhancing the accuracy and reliability of system control.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:具感測功能之電磁閥裝置</p>
        <p type="p">11:電磁閥</p>
        <p type="p">111:電磁閥線圈</p>
        <p type="p">112:閥芯</p>
        <p type="p">12:閥體</p>
        <p type="p">121:進水口</p>
        <p type="p">122:出水口</p>
        <p type="p">123:液體流道</p>
        <p type="p">13:感測元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1340" publication-number="202624834">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624834</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132958</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有光線阻擋重影抑制元件的光導顯示器</chinese-title>
        <english-title>LIGHTGUIDE DISPLAY WITH RAY-BLOCKING GHOST SUPPRESSION ELEMENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">G02B27/01</main-classification>
        <further-classification edition="200601120260309B">G06F3/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商魯姆斯有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUMUS LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅寧　埃坦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RONEN, EITAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖俊龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">光學顯示裝置包括具有主表面的光導光學元件，主表面通過全內反射引導圖像光。投影儀注入圖像光；第一區域使用反射或衍射佈置將被引導的光從第一方向重定向至第二方向，並且第二區域將被引導的光朝向眼動箱耦出。為了抑制來自遵循穿過光導光學元件（Lightguide Optical Element，LOE）的路徑的外部光的真實世界重影，多個光線阻擋元件形成為部署在鄰近於內表面或介面延伸的光導表面中的一個光導表面或兩個光導表面上的細長的條，該路徑包括在內部部分反射表面或其他介面處的單次反射。光線阻擋條可以是墨線。如果需要保持光導內反射，則低折射率層可以位於光線阻擋元件的下方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical display apparatus includes a lightguide optical element with major surfaces that guide image light by total internal reflection. A projector injects image light; a first region redirects the guided light from a first to a second direction using reflective or diffractive arrangements, and a second region out-couples the guided light toward an eye-motion box. To suppress real-world ghosts from external light that follows a path through the LOE including a single reflection at an internal partially reflective surface or other interface, a plurality of ray-blocking elements are formed as elongate strips deployed on one or both of the lightguide surfaces running adjacent to the internal surfaces or interfaces. The ray-blocking strips may be lines of ink. A low-index layer may underlie the ray- blocking elements if needed to preserve lightguide internal reflection.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:近眼顯示裝置</p>
        <p type="p">12:光導光學元件(LOE，也被稱為波導、基板或平板)</p>
        <p type="p">14:圖像投影儀元件</p>
        <p type="p">16:第一區域</p>
        <p type="p">18:第二區域</p>
        <p type="p">20:支承結構</p>
        <p type="p">22:控制器</p>
        <p type="p">X,Y:軸(方向)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1341" publication-number="202624647">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624647</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133015</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>閘閥組件、受控閘閥組件及使用其控制高溫加壓氣體的流動的方法</chinese-title>
        <english-title>GATE VALVE ASSEMBLY, CONTROLLED GATE VALVE AND METHOD FOR CONTROLLING THE FLOW OF HOT PRESSURIZED GASES USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">F16K3/16</main-classification>
        <further-classification edition="200601120260302B">F16K37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧森堡商保羅伍斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAUL WURTH S.A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LU</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德其優　威利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEKKIL, WILLY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克蘭摩　菲利浦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRAMER, PHILIPP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪克魯伊特　克里斯提恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE GRUITER, CHRISTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於高溫加壓氣體的閘閥組件，包括：閥殼體，具有第一開口和相對的第二開口，第一開口具有第一密封座，第二開口具有第二密封座；閥閘門，包括用於阻斷第一開口與第二開口之間的氣體路徑的阻斷區域，其中，閥閘門能在關閉閥位置與打開閥位置之間移動地設置在閥殼體內，在關閉閥位置中，閥閘門阻斷氣體路徑，在打開閥位置中，阻斷區域位於氣體路徑之外的位置；閥殼體包括夾持機構，每個夾持機構包括樞轉桿，其中，夾持執行器作用於樞轉桿，以將阻斷區域密封地接合抵靠第一密封座和第二密封座中的任一者，使得閥閘門處於密封閥位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A gate valve assembly for hot pressurized gases, comprising: a valve housing having a first opening with a first sealing seat and an opposite second opening with a second sealing seat; a valve gate comprising a blocking region for blocking a gas path between the first and second openings, wherein the valve gate is movably disposed within said valve housing between a closed valve position, thereby blocking said gas path and an open valve position wherein said blocking region is in a position outside said gas path; the valve housing comprises clamping mechanisms, each comprising a pivoting lever , wherein the clamping actuators act on the pivoting levers to sealingly engage the blocking region against either of the first or second sealing seat in a sealed valve position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:閘閥組件</p>
        <p type="p">2:閥殼體</p>
        <p type="p">2.0:氣體路徑</p>
        <p type="p">2.20:第二開口</p>
        <p type="p">2.21:第二密封座</p>
        <p type="p">2.30:第一夾持機構</p>
        <p type="p">2.31:樞轉桿</p>
        <p type="p">2.32:驅動端</p>
        <p type="p">2.33:致動端</p>
        <p type="p">2.40:第二夾持機構</p>
        <p type="p">2.41:樞轉桿</p>
        <p type="p">2.42:驅動端</p>
        <p type="p">2.43:致動端</p>
        <p type="p">2.44:夾持執行器</p>
        <p type="p">2.50:可選導向軌或導向槽的位置</p>
        <p type="p">2.51:(打開閥位置的)端部位置止擋件</p>
        <p type="p">2.52:(關閉閥位置的)端部位置止擋件</p>
        <p type="p">2.60:安裝法蘭</p>
        <p type="p">3:閥閘門</p>
        <p type="p">3.10:阻斷區域</p>
        <p type="p">3.13:周向邊緣</p>
        <p type="p">3.21:第一側向凸起</p>
        <p type="p">3.22:第二側向凸起</p>
        <p type="p">3.30:致動構件</p>
        <p type="p">3.50:冷卻通道</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1342" publication-number="202624635">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624635</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133016</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>滾動軸承</chinese-title>
        <english-title>ROLLING BEARING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260310B">F16C33/78</main-classification>
        <further-classification edition="200601120260310B">F16C19/04</further-classification>
        <further-classification edition="200601120260310B">F16C19/06</further-classification>
        <further-classification edition="200601120260310B">F16C33/80</further-classification>
        <further-classification edition="201601120260310B">F16J15/3204</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＮＴＮ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NTN CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, TAKERU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石田光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIDA, HIKARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種滾動軸承，具備：內環（2）；外環；複數個滾動體，介設於內環（2）與外環之間；以及，密封構件（6），封塞住內環（2）及外環間的軸承空間。密封構件（6），包含：核心金屬（10）；以及，位於較該核心金屬更徑向內側的接觸式的主密封唇（15）。該主密封唇（15），包含：以具有干涉量的方式接觸於內環（2）的密封溝槽（7）的接觸部（15c）。密封構件（6），具備：在干涉量範圍內，減低接觸部（15c）的徑向變化量至預定值以下的徑向變化量減低手段（Rcr）。干涉量最大時，在彎曲部（Be）之軸向外側的最大突出位置（Pk），比在縮窄部（14）之軸向外側部分的底部（Ks）更軸向外側，並且，相對於內環（2）或外環的端面的軸向位置（Tm）在相同或是軸向內側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The rolling bearing includes: an inner ring (2); an outer ring (3); rolling elements interposed between the inner ring (2) and the outer ring; and a seal member (6) closing a bearing space between the inner ring (2) and the outer ring (3). The seal member (6) includes a metal core (10) and a contact-type main lip (15) located inward in a radial direction from the metal core (10). The main lip (15) includes a contact part (15c) which comes into contact with a seal groove (7) of the inner ring (2) with interference. The seal member (6) includes a radial direction variation reducing means (Rcr) which reduce a variation of the contact part (15c) in the radial direction to a predetermined value or less within a range of interference. When the radial direction variation reducing means (Rcr) has a maximum interference, a maximum protrusive position (Pk) of a bend part (Be) on an outer side in an axial direction is located outward in the axial direction from a bottom part (Ks) of a constricted part (14) on the outer side in the axial direction, and the maximum protrusive position (Pk) is located at the same position as or an inward position in the axial direction from an axial position (Tm) on an end surface of the inner ring (2) or the outer ring (3).</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:內環</p>
        <p type="p">6:密封構件</p>
        <p type="p">7:密封溝槽</p>
        <p type="p">7b:溝槽底面</p>
        <p type="p">7c:外側溝槽壁面(外側面)</p>
        <p type="p">10:核心金屬</p>
        <p type="p">13:內周側部分</p>
        <p type="p">14:縮窄部</p>
        <p type="p">15:主密封唇</p>
        <p type="p">15b:密封唇本體部</p>
        <p type="p">15c:接觸部(前端部)(密封唇前端部)</p>
        <p type="p">15ca:外徑面</p>
        <p type="p">16:副密封唇</p>
        <p type="p">Be:彎曲部</p>
        <p type="p">Bea:傾斜面</p>
        <p type="p">Beb:內周面</p>
        <p type="p">Pk:最大突出位置</p>
        <p type="p">Rcr:徑向變化量減低手段</p>
        <p type="p">Ta:壁厚</p>
        <p type="p">Tb:壁厚</p>
        <p type="p">Tm:軸向位置</p>
        <p type="p">α1:夾角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1343" publication-number="202625751">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625751</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133025</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板搬送裝置、基板處理裝置及基板搬送方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260312B">H10P72/30</main-classification>
        <further-classification edition="202601120260312B">H10P72/50</further-classification>
        <further-classification edition="200601120260312B">B65G49/07</further-classification>
        <further-classification edition="200601120260312B">G01B11/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友田元貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMODA, GENKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森住涼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIZUMI, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河原啓之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAHARA, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種基板搬送裝置、基板處理裝置及基板搬送方法。投光部27A及受光部27B介隔於直線LNE上設定在中心CR與端ED之間之第1量測點MP1而對向。投光部28A及受光部28B介隔於直線LNE上設定在第1量測點MP1與端ED之間之第2量測點MP2而對向。控制部利用旋轉編碼器量測自第1映射感測器27輸出之第1信號波形中、第1谷部之第1寬度，藉此量測基板之第1翹曲量。控制部利用旋轉編碼器量測自第2映射感測器28輸出之第2信號波形中、第2谷部之第2寬度，藉此量測基板之第2翹曲量。控制部基於第1翹曲量與第2翹曲量算出基板之翹曲形狀。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:蓋裝卸部</p>
        <p type="p">13:容器</p>
        <p type="p">13A:內壁</p>
        <p type="p">13B:內壁</p>
        <p type="p">14:開口</p>
        <p type="p">17:蓋部</p>
        <p type="p">27:映射感測器</p>
        <p type="p">27A:投光部</p>
        <p type="p">27B:受光部</p>
        <p type="p">28:映射感測器</p>
        <p type="p">28A:投光部</p>
        <p type="p">28B:受光部</p>
        <p type="p">29:感測器移動部</p>
        <p type="p">31:感測器支持構件</p>
        <p type="p">C:載體</p>
        <p type="p">CT:中心</p>
        <p type="p">ED:端</p>
        <p type="p">LNE:直線</p>
        <p type="p">LT1:光軸</p>
        <p type="p">LT2:光軸</p>
        <p type="p">MP1:第1量測點</p>
        <p type="p">MP2:第2量測點</p>
        <p type="p">TD:取出放入方向</p>
        <p type="p">W:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1344" publication-number="202624073">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624073</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133027</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自行車踏板總成</chinese-title>
        <english-title>BICYCLE PEDAL ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260310B">B62M3/08</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商Ｄ3創新公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>D3 INNOVATION INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯卡斯加德　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SKARSGARD, PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史戴博斯　強納森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STAPLES, JONATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自行車踏板總成可包含具有一旋轉軸線及一扣片區之一踏板本體。一扣片結合總成可包含安置於該扣片區之一第一部分處之一第一結合部分及在該旋轉軸線之一第二側上與該第一結合部分縱向間隔開之一第二結合部分。該扣片結合總成可釋放地保持一扣片。一扣片支撐總成可包含一第一支撐板，其覆蓋該踏板本體之一第一部分以在該扣片被保持時頂住及支撐該扣片之一第一部分。一第二支撐板可安置於該旋轉軸線與該第二結合部分之間且與該第一支撐板間隔且可經構形以在該扣片由該扣片結合總成保持時頂住及支撐該扣片之一第二部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bicycle pedal assembly may include a pedal body with a rotation axis and a cleat region. A cleat binding assembly may include a first binding portion disposed at a first portion of the cleat region and a second binding portion longitudinally spaced apart from the first binding portion on a second side of the rotation axis. The cleat binding assembly may releasably retain a cleat A cleat support assembly may include a first support plate covering a first portion of the pedal body to bear against and support a first portion of the cleat when the cleat is retained. A second support plate may be disposed between the rotation axis and the second binding portion and spaced from the first support plate and may be configured to bear against and support a second portion of the cleat when the cleat is retained by the cleat binding assembly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:自行車踏板總成</p>
        <p type="p">102:踏板本體</p>
        <p type="p">104:連接部分</p>
        <p type="p">106:第一側</p>
        <p type="p">110:連接機構</p>
        <p type="p">112:旋轉軸線</p>
        <p type="p">120:扣片區</p>
        <p type="p">122:扣片結合總成</p>
        <p type="p">124:前向結合總成</p>
        <p type="p">126:後向結合總成</p>
        <p type="p">130:扣片支撐總成</p>
        <p type="p">132:前向支撐板</p>
        <p type="p">134:後向支撐板</p>
        <p type="p">140:緊固件</p>
        <p type="p">612:外側部分</p>
        <p type="p">614:中心部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1345" publication-number="202625479">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625479</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133049</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種無線通訊方法及相關的接入點多鏈路設備</chinese-title>
        <english-title>WIRELESS COMMUNICATION METHOD AND RELATED ACCESS POINT MULTI-LINK DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260302B">H04W36/18</main-classification>
        <further-classification edition="200901120260302B">H04W36/02</further-classification>
        <further-classification edition="200901120260302B">H04W92/20</further-classification>
        <further-classification edition="202301120260302B">H04L1/1825</further-classification>
        <further-classification edition="200901120260302B">H04W84/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭陽洪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, YANG-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐建芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIEN-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">公開了一種用於在無線漫遊過程中協調下行傳輸的方法和設備。第一接入點多鏈路設備（AP MLD）與非接入點多鏈路設備（non-AP MLD）進行幀交換。在non-AP MLD切換到第二AP MLD的漫遊過程中，第一AP MLD向第二AP MLD發送用於指示序列號（SN）限制的第一資訊。作為回應，第二AP MLD基於第一資訊控制其下行傳輸。該控制的執行是為了確保從第二AP MLD傳輸到non-AP MLD的MAC協定資料單元（MPDUs）處於non-AP MLD的重排序緩衝窗口內，從而防止資料丟失並提高通信可靠性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and apparatus for coordinating downlink transmission during a wireless roaming process are disclosed. A first access point multi-link device (AP MLD) performs frame exchanges with a non-AP MLD. During a roaming process where the non-AP MLD transitions to a second AP MLD, the first AP MLD transmits first information indicative of sequence number (SN) limitation to the second AP MLD. In response, the second AP MLD controls its downlink transmission based on the first information. The control is performed to ensure that MAC Protocol Data Units (MPDUs) transmitted from the second AP MLD to the non-AP MLD are within a reordering buffer window of the non-AP MLD, thereby preventing data loss and increasing communication reliability.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:無線通訊系統</p>
        <p type="p">Q3:傳輸窗口</p>
        <p type="p">Q1,Q2:傳輸隊列</p>
        <p type="p">10:第一AP MLD</p>
        <p type="p">20:第二AP MLD</p>
        <p type="p">30:non-AP MLD</p>
        <p type="p">10b,20b:記憶體</p>
        <p type="p">10c,20c:處理器</p>
        <p type="p">10a,20a:收發器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1346" publication-number="202625256">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625256</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133055</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>混合式電漿源</chinese-title>
        <english-title>HYBRID PLASMA SOURCE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260315B">H01J37/32</main-classification>
        <further-classification edition="200601120260315B">H05H1/46</further-classification>
        <further-classification edition="200601120260315B">H05H1/34</further-classification>
        <further-classification edition="200601120260315B">C23C16/505</further-classification>
        <further-classification edition="200601120260315B">H01J37/244</further-classification>
        <further-classification edition="202601120260315B">H10P95/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙　建平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, JIANPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡羅爾　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARROLL, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連恩　巴頓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANE, BARTON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據一實施例，提出一種用於產生一電感式耦合電漿的混合式電漿處理系統。該混合式電漿處理系統包含一電漿腔室、一噴淋頭電極、一RF供給結構，及一電感單元。該電漿腔室包含一中置電極、一噴淋頭，及一同軸RF功率供給件。該電漿腔室係設置為一電容式耦合電漿（CCP）腔室。該噴淋頭電極係設置以控制該電容式耦合電漿腔室中的氣流。該噴淋頭電極係耦合接地。該RF供給結構係可以耦合至一RF源。該電感單元係耦合至該RF供給結構， 該RF供給結構設置以形成一共振電路，以產生一磁場以維持該電容式耦合電漿腔室中產生的該電感式耦合電漿。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">According to an embodiment, a hybrid plasma processing system for generating an inductively coupled plasma is proposed. The hybrid plasma processing system includes a plasma chamber, a showerhead electrode, an RF feed structure, and an inductive element. The plasma chamber includes a center electrode, showerhead, and a coaxial RF power feed. The plasma chamber is configured as a capacitively coupled plasma (CCP) chamber. The showerhead electrode is configured to control gas flow within the capacitively coupled plasma chamber. The showerhead electrode is coupled to ground. The RF feed structure is couplable to an RF source. The inductive element is coupled to the RF feed structure configured to form a resonant circuit to generate a magnetic field to sustain the inductively coupled plasma generated within the capacitively coupled plasma chamber.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:混合式電漿處理系統</p>
        <p type="p">301:側壁</p>
        <p type="p">302:RF源</p>
        <p type="p">303:小孔</p>
        <p type="p">304:噴淋頭電極</p>
        <p type="p">305:頂蓋</p>
        <p type="p">306:電漿腔室</p>
        <p type="p">310:基板</p>
        <p type="p">312:電漿</p>
        <p type="p">314:介電盤</p>
        <p type="p">322:RF供給結構</p>
        <p type="p">324:第一電容單元</p>
        <p type="p">326:電感單元</p>
        <p type="p">328:第二電容單元</p>
        <p type="p">330A:第一環部</p>
        <p type="p">330B:第二環部</p>
        <p type="p">332A:垂直部(管件)</p>
        <p type="p">332B:水平部</p>
        <p type="p">334:接地金屬</p>
        <p type="p">340:入口</p>
        <p type="p">341:介電質</p>
        <p type="p">342:第二RF線</p>
        <p type="p">344:介電質</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1347" publication-number="202624911">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624911</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133081</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>搬送設備</chinese-title>
        <english-title>TRANSPORT FACILITY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120260306B">G05D1/43</main-classification>
        <further-classification edition="202401120260306B">G05D1/69</further-classification>
        <further-classification edition="202401120260306B">G05D1/644</further-classification>
        <further-classification edition="202401320260306B">G05D107/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大福股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIFUKU CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武內啓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEUCHI, AKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古長谷徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONAGAYA, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種搬送設備，具備有複數台搬送車與控制系統，行走路徑包含環繞路徑，控制系統會在無法藉由第1停頓解除處理的執行來解除停頓狀態之情況下，執行第2停頓解除處理，前述第1停頓解除處理是如下之處理：在已產生停頓狀態之情況下，將成為停頓狀態的要因之複數台搬送車的各者設為要因搬送車，並將複數台要因搬送車當中的一部分的目的地從原初目的地變更，藉此解除停頓狀態，前述第2停頓解除處理是如下之處理：使全部的要因搬送車前往環繞路徑移動並且在環繞路徑中環繞，之後，使各個要因搬送車前往原初目的地移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S01,S04:處理(進行判定之處理)</p>
        <p type="p">S02:依序選擇處理</p>
        <p type="p">S03:目的地變更處理</p>
        <p type="p">S05:解除移動處理</p>
        <p type="p">S06:第1再出發處理</p>
        <p type="p">S07:環繞路徑移動處理</p>
        <p type="p">S08:出發順序判定處理</p>
        <p type="p">S09:第2再出發處理</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1348" publication-number="202625195">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625195</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133082</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於包括基底晶粒以用於近記憶體運算的極端頻寬三維（３Ｄ）堆疊動態隨機存取記憶體（ＤＲＡＭ）的修復結構</chinese-title>
        <english-title>REPAIR STRUCTURE FOR EXTREME-BANDWIDTH THREE-DIMENSIONAL (3D) STACKED DYNAMIC RANDOM-ACCESS MEMORY (DRAM) INCLUDING BASE DIE FOR NEAR-MEMORY COMPUTING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">G11C29/00</main-classification>
        <further-classification edition="200601120260309B">G11C29/12</further-classification>
        <further-classification edition="200601120260309B">G11C29/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝達羅格魯　默斯塔法</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BADAROGLU, MUSTAFA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　中澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZHONGZE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康　宇泰格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, WOO TAG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔　智弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, JIHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>娜拉帕帝　吉里德爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NALLAPATI, GIRIDHAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曲丹巴瑞　派瑞安南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIDAMBARAM, PERIANNAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述一種三維(3D)堆疊記憶體封裝。該3D堆疊記憶體封裝包括基底晶粒，該基底晶粒具有包括至少一個備用處理單元(PU)的PU陣列。該3D堆疊記憶體封裝亦包括堆疊在該基底晶粒上且具有庫塊的記憶體晶粒，該等庫塊包括至少一個備用庫塊。該3D堆疊記憶體封裝進一步包括封裝基材，該封裝基材支撐該基底晶粒。該3D堆疊記憶體封裝亦包括穿基材通孔(TSV)，其等延伸在該等記憶體晶粒之間且落在該基底晶粒上，且具有每庫塊至少一個備用TSV。該3D堆疊記憶體封裝進一步包括修復結構，其經組態以重選路由資料/控制匯流排，以用該備用庫塊替換損壞庫塊、用該至少一個備用TSV替換損壞TSV、及/或用該備用PU替換損壞PU中之一者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A three-dimensional (3D) stacked memory package is described. The 3D stacked memory package includes a base die having an array of processing units (PUs) including at least one spare PU. The 3D stacked memory package also includes memory dies stacked on the base die and having bank tiles, including at least one spare bank tile. The 3D stacked memory package further includes a package substrate supporting the base die. The 3D stacked memory package also includes through substrate vias (TSVs) extending between the memory dies and landing on the base die and having at least one spare TSV per bank tile. The 3D stacked memory package further includes a repair structure configured to reroute a data/control bus to replace one of a failed bank tile with the spare bank tile, a failed TSV with the at least one spare TSV, and/or a failed PU with the spare PU.</p>
      </isu-abst>
      <representative-img>
        <p type="p">310:基底晶粒</p>
        <p type="p">330:記憶體晶粒</p>
        <p type="p">332-1 </p>
        <p type="p">332-1,332-2,...,332-N:庫塊</p>
        <p type="p">336:備用庫塊</p>
        <p type="p">340:TSV群組</p>
        <p type="p">342:備用TSV</p>
        <p type="p">350:共用資料/控制匯流排</p>
        <p type="p">352:庫修復MUX</p>
        <p type="p">354:TSV MUX</p>
        <p type="p">360-1,360-2,360-3:處理單元</p>
        <p type="p">362:PU修復多工器</p>
        <p type="p">364:PU映射器</p>
        <p type="p">400:修復結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1349" publication-number="202624615">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624615</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133132</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>低溫泵</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260310B">F04B37/08</main-classification>
        <further-classification edition="200601120260310B">F04B39/10</further-classification>
        <further-classification edition="200601120260310B">F04B53/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友重機械工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO HEAVY INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金子佑真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANEKO, YUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松本裕貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO, YUUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木正志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提高低溫泵的安全吹掃功能的實用性。  &lt;br/&gt;　　[解決手段]低溫泵(10)具備吹掃閥，該吹掃閥具備：主閥(60)，係藉由來自流體源的流體供給而被關閉並阻斷吹掃氣體，藉由流體排出而被打開並供給吹掃氣體；及先導閥(70)，係切換從流體源向主閥(60)供給流體之第1狀態和從主閥(60)排出流體之第2狀態。吹掃閥構成為，在先導閥(70)的第1狀態下來自流體源的流體供給被中斷時，限制來自主閥(60)的流體排出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:低溫泵</p>
        <p type="p">16:低溫泵容器</p>
        <p type="p">20:主體吹掃閥</p>
        <p type="p">48:吹掃氣體源</p>
        <p type="p">54:流體源</p>
        <p type="p">60:主閥</p>
        <p type="p">62:閥殼</p>
        <p type="p">62a:吹掃氣體入口</p>
        <p type="p">62b:吹掃氣體出口</p>
        <p type="p">62c:流體埠</p>
        <p type="p">64:閥活塞</p>
        <p type="p">66:流體室</p>
        <p type="p">67:復位彈簧</p>
        <p type="p">68:配管</p>
        <p type="p">70:先導閥</p>
        <p type="p">71:供給埠</p>
        <p type="p">72:排出埠</p>
        <p type="p">73:主閥埠</p>
        <p type="p">75:止回閥</p>
        <p type="p">77:箭頭</p>
        <p type="p">78:箭頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1350" publication-number="202625257">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625257</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133134</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有感測器的靜電吸盤用於偵測基板變形</chinese-title>
        <english-title>ELECTROSTATIC CHUCKS WITH SENSORS TO DETECT SUBSTRATE DEFORMATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">H01J37/32</main-classification>
        <further-classification edition="202601120260313B">H10P72/72</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查達　阿文德曼莫漢辛格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHADHA, ARVINDER MANMOHAN SINGH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賽德法　阿明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAEEDFAR, AMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">系統包括靜電吸盤。靜電吸盤包括陶瓷圓盤，其配置用於支撐基板。靜電吸盤進一步包括設置在陶瓷圓盤內的夾持電極，該夾持電極配置為在施加夾持電壓時靜電地將基板夹持到陶瓷圓盤上。靜電吸盤進一步包括一或多個設置在陶瓷圓盤內的感測電極。該系統進一步包括一或多個與這些一或多個感測電極相耦接的電子電路。該系統還包括處理裝置。該處理裝置配置為接收來自這些一或多個電子電路的訊號，以表示基板變形。該處理裝置進一步配置為根據該訊號調整夾持電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system includes an electrostatic chuck. The electrostatic chuck includes a ceramic puck configured to support a substrate. The electrostatic chuck further includes a clamping electrode disposed within the ceramic puck and configured to electrostatically clamp the substrate to the ceramic puck responsive to being energized with a clamping voltage. The electrostatic chuck further includes one or more sensor electrodes disposed within the ceramic puck. The system further includes one or more electronic circuits coupled with the one or more sensor electrodes. The system further includes a processing device. The processing device is configured to receive, from the one or more electronic circuits, a signal indicative of substrate deformation. The processing device is further configured to adjust the clamping voltage based on the signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400A:部分側面切割視圖</p>
        <p type="p">402:基板</p>
        <p type="p">410:靜電吸盤</p>
        <p type="p">412:臺面</p>
        <p type="p">420:夾持電極</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1351" publication-number="202625804">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625804</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133141</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用角度光束之選擇性材料移除</chinese-title>
        <english-title>SELECTIVE MATERIAL REMOVAL WITH ANGULAR BEAM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260312B">H10W20/20</main-classification>
        <further-classification edition="202601120260312B">H10P50/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔瓦柯利　穆罕默德麥赫迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAVAKOLI, MOHAMMAD MAHDI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黎戈爾　喬爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RIGOR, JOEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑拉多斯　艾夫傑尼諾斯Ｖ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GELATOS, AVGERINOS V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　正周</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JOUNG JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江　雷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高德　路迪維奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GODET, LUDOVIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了一種填充半導體基板間隙的方法。第一材料形成於基板上及基板表面內的間隙中。基板暴露於角度蝕刻製程，以移除第一材料，這些材料位於基板的場地(field)及間隙側壁的上部，留下第一材料在間隙的底部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods of filling a gap in a semiconductor substrate are described. A first material is formed on the substrate and in a gap formed in the substrate surface. The substrate is exposed to an angular etching process to remove the first material from the field of the substrate and a top portion of the sidewalls of the gap, leaving the first material in the bottom of the gap.</p>
      </isu-abst>
      <representative-img>
        <p type="p">125:角度蝕刻製程</p>
        <p type="p">150:半導體基板</p>
        <p type="p">160:介電材料</p>
        <p type="p">170:導電材料</p>
        <p type="p">180:間隙</p>
        <p type="p">182:底部</p>
        <p type="p">184:側壁</p>
        <p type="p">205:襯墊</p>
        <p type="p">210:第一材料</p>
        <p type="p">230:第二材料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1352" publication-number="202624441">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624441</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133149</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含馬來醯亞胺部份之黏著劑組成物及濕式蝕刻之方法</chinese-title>
        <english-title>ADHESIVE COMPOSITION COMPRISING MALEIMIDE MOIETIES AND METHODS OF WET ETCHING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C09J179/08</main-classification>
        <further-classification edition="200601120260302B">C09J11/06</further-classification>
        <further-classification edition="200601120260302B">B32B15/08</further-classification>
        <further-classification edition="200601120260302B">B32B7/12</further-classification>
        <further-classification edition="200601120260302B">H05K3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商3Ｍ新設資產公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>3M INNOVATIVE PROPERTIES COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈特曼　湯普森　克萊兒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARTMANN-THOMPSON, CLAIRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索羅森　葛羅葛瑞　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SORENSON, GREGORY PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述一種濕式蝕刻之方法，其包含提供物品，該物品包含：i)導電金屬基材；ii)絕緣樹脂層；及iii)經固化黏著劑層，其設置在該基材與絕緣樹脂層之間。該經固化黏著劑層包含下列之反應產物：至少50wt.%的包含馬來醯亞胺部份之聚醯亞胺樹脂；至少0.25wt.%的胺及/或硫醇化合物、及可選地自由基起始劑。該方法進一步包含使該物品與至少一種液體接觸，其中該液體包含有機溶劑、鹼性溶液、或酸性溶液。該物品可為印刷電路板或積體電路之組件，其包含(例如，通)孔及在該等孔內之殘留絕緣樹脂。使該物品與至少一種液體接觸之步驟可移除該等孔中之該殘留絕緣樹脂。亦描述物品、製造物品之方法、及黏著劑組成物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of wet etching is described comprising providing an article comprising: i) a conductive metallic substrate; ii) an insulating resin layer; and iii) a cured adhesive layer disposed between the substrate and insulating resin layer. The cured adhesive layer comprises the reaction product of at least 50 wt.% of polyimide resin comprising maleimide moieties; at least 0.25 wt.% of amine and/or thiol compound(s), and optionally a free-radical initiator. The method further comprises contacting the article with at least one liquid, wherein the liquid comprises an organic solvent, an alkaline solution, or an acidic solution. The article may be a component of a printed circuit board or integrated circuit comprising (e.g., through) holes and residual insulating resin within the holes. The step of contacting the article with at least one liquid may remove the residual insulating resin from the holes. Also described are articles, methods of making articles, and adhesive compositions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:三層物品</p>
        <p type="p">221:第一基材</p>
        <p type="p">222:第二基材</p>
        <p type="p">230:黏著劑層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1353" publication-number="202624027">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624027</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133159</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自行車組件</chinese-title>
        <english-title>BICYCLE COMPONENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">B60B27/02</main-classification>
        <further-classification edition="200601120260312B">B60B27/00</further-classification>
        <further-classification edition="200601120260312B">F16D41/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商ＤＴ瑞士公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DT SWISS AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓋瑟　湯姆斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GASSER, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧米林　尼可拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OMLIN, NICOLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查茲　安德烈亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSCHANZ, ANDREAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普里斯　堤摩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRIES, TIMO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於自行車(100)之自行車組件(80)，&lt;br/&gt;  具有自由輪裝置(9)之自由輪單元(9a，9b)&lt;br/&gt;  其中該自由輪單元(9a，9b)包括旋轉單元(2d，10d)及可與該旋轉單元(2d，10d)耦合之牙盤裝置(20，30)。該牙盤裝置(20，30)包括具有軸向嚙合元件(22e，32e)之正齒系(22，32)，該正齒系適於與另一牙盤裝置(30，20)之對應的嚙合元件(32e，22e)嚙合。該牙盤裝置(20，30)及該旋轉單元(2d，10d)構建為可彼此耦合的耦合組件(9c-9f)且各具一用於彼此嚙合之徑向齒系(23，33)，且可共同繞中心旋轉軸(5b)旋轉。該旋轉單元(2d，10d)及該牙盤裝置(20，30)可沿周向相對彼此在驅動位置(A)與靜止位置(R)之間運動，因此，在開始扭矩傳遞之前，必須先將耦合組件(9c-9f)沿驅動方向旋轉至少5°之離隙角(FW)，在該二徑向齒系(33，43)之前處於靜止位置(R)的情況下直至可實施扭矩傳遞。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">9a,9b:自由輪單元</p>
        <p type="p">20:轉子側牙盤裝置</p>
        <p type="p">30:輪轂側牙盤裝置</p>
        <p type="p">40:容置環，螺紋環</p>
        <p type="p">41:外螺紋</p>
        <p type="p">80:螺旋彈簧</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1354" publication-number="202625237">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625237</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133166</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於帶電粒子束裝置的設備、帶電粒子束裝置、分析用於帶電粒子束裝置的磁透鏡的方法及非暫時性媒體</chinese-title>
        <english-title>APPARATUS FOR A CHARGED PARTICLE BEAM DEVICE, CHARGED PARTICLE BEAM DEVICE, METHOD OF ANALYZING A MAGNETIC LENS FOR A CHARGED PARTICLE BEAM DEVICE, AND NON-TRANSITORY MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">H01J37/141</main-classification>
        <further-classification edition="200601120260312B">H01J37/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商ＩＣＴ積體電路測試股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ICT INTEGRATED CIRCUIT TESTING GESELLSCHAFT FUR HALBLEITERPRUFTECHNIK MBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布雷爾　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BREUER, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>考普　漢諾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAUPP, HANNO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛格爾　馬庫斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGER, MARKUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐榮　卡迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORON, GADI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊丹　塔米爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IDAN, TAMIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案描述了帶電粒子束裝置的設備。該帶電粒子束裝置包括：具有線圈載體的磁透鏡；至少一個極靴；及電絕緣體，該電絕緣體經配置以將線圈載體和至少一個極靴電絕緣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus for a charged particle beam device is described. The charged particle beam device includes: a magnetic lens with a coil carrier; at least one pole piece; and an electrical insulator configured to electrically insulate the coil carrier and the at least one pole piece from each other.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:透鏡</p>
        <p type="p">100:磁透鏡</p>
        <p type="p">101:光軸</p>
        <p type="p">110:線圈載體</p>
        <p type="p">115:線圈</p>
        <p type="p">121:第一極靴</p>
        <p type="p">122:第二極靴</p>
        <p type="p">130:電絕緣體</p>
        <p type="p">140:間隙</p>
        <p type="p">151:電極</p>
        <p type="p">152:另一電極</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1355" publication-number="202625082">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625082</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133192</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自操作基板測量</chinese-title>
        <english-title>SELF-OPERATING SUBSTRATE MEASUREMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260312B">G06T7/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫馬爾　阿比納夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, ABHINAV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕帕基斯　伊歐尼斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAPAKIS, IOANNIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕特拉　安詹庫馬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATRA, ANJAN KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>ＫＶ　桑尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>K.V., SUNIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伯格　艾德麗安梅麗莎馬汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BERGH, ADRIENNE MELISSA MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種方法包括由處理裝置獲取第一基板的第一影像，該第一基板包括第一組基板結構。該方法進一步包括獲取與第一組基板結構相關的第一組測量。該方法進一步包括獲取第二基板的第二影像，該第二基板包括與第一組基板結構相對應的第二組基板結構。該方法進一步包括決定第二影像的單位結構集。每個單位結構與第二組基板結構中的一個相關。決定單位結構集是基於第一組測量進行的。該方法進一步包括決定第二組測量。第二組測量與第一組測量相對應。第二組測量與單位結構集相關。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes obtaining, by a processing device, a first image of a first substrate including a first set of substrate structures. The method further includes obtaining a first set of measurements in association with the first set of substrate structures. The method further includes obtaining a second image of a second substrate including a second set of substrate structures corresponding to the first set of substrate structures. The method further includes determining a set of unit structures of the second image. Each of the unit structures is associated with one of the second set of substrate structures. Determining the set of unit structures is performed based on the first set of measurements. The method further includes determining a second set of measurements. The second set of measurements correspond to the first set of measurements. The second set of measurements are in association with the set of unit structures.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:流程</p>
        <p type="p">202:加工程序</p>
        <p type="p">204:影像處理</p>
        <p type="p">206:示例創建</p>
        <p type="p">208:手動測量</p>
        <p type="p">210:邊界框標籤</p>
        <p type="p">212:材料標記</p>
        <p type="p">214:配方創建</p>
        <p type="p">216:代表性單位結構識別</p>
        <p type="p">218:結構偵測</p>
        <p type="p">220:配準</p>
        <p type="p">222:最佳配對</p>
        <p type="p">224:自操作測量</p>
        <p type="p">226:配方選擇</p>
        <p type="p">228:測量</p>
        <p type="p">230:反饋</p>
        <p type="p">232:配方儲存器</p>
        <p type="p">234:分析</p>
        <p type="p">236:修正行動</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1356" publication-number="202623750">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623750</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133196</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>拖板結構、清潔機器人及清潔系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">A47L11/40</main-classification>
        <further-classification edition="200601120260312B">A47L11/284</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郝旭昶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡彩云</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙立棟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘潤偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露實施例涉及一種拖板結構、清潔機器人及清潔系統。其中，拖板結構包括：殼體；拖板本體；移動組件，設置於殼體內，移動組件用於和拖板本體相連接；限位件，設置於殼體朝向拖板本體的一端；其中，設定拖板組件朝向殼體的方向為第一方向，隨著移動組件帶動拖板本體向第一方向移動，限位件頂壓拖板本體，限制拖板本體繼續向第一方向移動，直至拖板本體和移動組件分離。如此設置，實現拖板本體從清潔機器人處分離的自動化，減少人工干預，提高使用者體驗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:拖板結構</p>
        <p type="p">110:殼體</p>
        <p type="p">120:拖板本體</p>
        <p type="p">130:移動組件</p>
        <p type="p">140:限位件</p>
        <p type="p">150:彈性件</p>
        <p type="p">160:傳動軸</p>
        <p type="p">170:軸承</p>
        <p type="p">180:扭簧</p>
        <p type="p">111:開口</p>
        <p type="p">121:板體</p>
        <p type="p">122:第三套筒</p>
        <p type="p">123:連接柄</p>
        <p type="p">131:第一移動件</p>
        <p type="p">132:第一連接件</p>
        <p type="p">141:第四套筒</p>
        <p type="p">142:第二連接件</p>
        <p type="p">1311:第一套筒</p>
        <p type="p">1312:連接杆</p>
        <p type="p">1313:第二套筒</p>
        <p type="p">1321:第一磁性件</p>
        <p type="p">1322:第一金屬件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1357" publication-number="202625847">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625847</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133207</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含透過混合接合及熔融接合耦接在一起的多個晶片的記憶體裝置</chinese-title>
        <english-title>MEMORY DEVICE COMPRISING MULTIPLE CHIPS COUPLED TOGETHER THROUGH HYBRID BONDING AND FUSION BONDING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260312B">H10W72/00</main-classification>
        <further-classification edition="202601120260312B">H10W29/00</further-classification>
        <further-classification edition="202601120260312B">H10W90/00</further-classification>
        <further-classification edition="200601120260312B">G11C5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔　智弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, JIHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝達羅格魯　默斯塔法</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BADAROGLU, MUSTAFA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康　宇泰格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, WOO TAG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>娜拉帕帝　吉里德爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NALLAPATI, GIRIDHAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　中澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZHONGZE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曲丹巴瑞　派瑞安南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIDAMBARAM, PERIANNAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種裝置包含一記憶體裝置，其包含：一第一記憶體晶片；一第二記憶體晶片，其耦接至該第一記憶體晶片，其中該第一記憶體晶片的一前側耦接至該第二記憶體晶片的一前側；一第三記憶體晶片，其耦接至該第二記憶體晶片，其中該第二記憶體晶片的一背側透過混合接合耦接至該第三記憶體晶片的一背側；及一第四記憶體晶片，其耦接至該第三記憶體晶片，其中該第三記憶體晶片的一前側耦接至該第四記憶體晶片的一前側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device comprising a memory device comprising: a first memory chip; a second memory chip coupled to the first memory chip, wherein a front side of the first memory chip is coupled to a front side of the second memory chip; a third memory chip coupled to the second memory chip, wherein a back side of the second memory chip is coupled to a back side of the third memory chip through hybrid bonding; and a fourth memory chip coupled to the third memory chip, wherein a front side of the third memory chip is coupled to a front side of the fourth memory chip.</p>
      </isu-abst>
      <representative-img>
        <p type="p">402a:晶粒基材部分</p>
        <p type="p">402b:晶粒基材部分</p>
        <p type="p">402c:晶粒基材部分</p>
        <p type="p">402d:晶粒基材部分</p>
        <p type="p">403a:墊互連件</p>
        <p type="p">403b:墊互連件</p>
        <p type="p">403c:墊互連件</p>
        <p type="p">403d:墊互連件</p>
        <p type="p">404a:晶粒互連部分</p>
        <p type="p">404b:晶粒互連部分</p>
        <p type="p">404c:晶粒互連部分</p>
        <p type="p">404d:晶粒互連部分</p>
        <p type="p">406a:鈍化層</p>
        <p type="p">406b:鈍化層</p>
        <p type="p">406c:鈍化層</p>
        <p type="p">406d:鈍化層</p>
        <p type="p">407a:介電層</p>
        <p type="p">407b:介電層</p>
        <p type="p">407c:介電層</p>
        <p type="p">407d:介電層</p>
        <p type="p">420a:晶粒基材</p>
        <p type="p">420b:晶粒基材</p>
        <p type="p">420c:晶粒基材</p>
        <p type="p">420d:晶粒基材</p>
        <p type="p">422a:主動區</p>
        <p type="p">422b:主動區</p>
        <p type="p">422c:主動區</p>
        <p type="p">422d:主動區</p>
        <p type="p">423a:通孔互連件</p>
        <p type="p">423b:通孔互連件</p>
        <p type="p">423c:通孔互連件</p>
        <p type="p">423d:通孔互連件</p>
        <p type="p">423e:通孔互連件</p>
        <p type="p">423f:通孔互連件</p>
        <p type="p">440b:介電層</p>
        <p type="p">442a:晶粒互連件</p>
        <p type="p">442b:晶粒互連件</p>
        <p type="p">442c:晶粒互連件</p>
        <p type="p">442d:晶粒互連件</p>
        <p type="p">500:記憶體裝置</p>
        <p type="p">501:晶片</p>
        <p type="p">502:晶片</p>
        <p type="p">503:晶片</p>
        <p type="p">504:晶片</p>
        <p type="p">505b:背側互連件</p>
        <p type="p">505ba:背側互連件</p>
        <p type="p">505bb:背側互連件</p>
        <p type="p">505c:背側互連件</p>
        <p type="p">505cd:背側互連件</p>
        <p type="p">505d:背側互連件</p>
        <p type="p">550b:鈍化層</p>
        <p type="p">550c:鈍化層</p>
        <p type="p">550d:鈍化層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1358" publication-number="202624576">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624576</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133213</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於EPI腔室熱分佈調節之具有分區控制的主動SIC加熱</chinese-title>
        <english-title>ACTIVE SIC HEATING WITH ZONALITY CONTROL FOR EPI CHAMBER THERMAL PROFILE ADJUSTING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">C30B25/10</main-classification>
        <further-classification edition="200601120260312B">C30B25/16</further-classification>
        <further-classification edition="202601120260312B">H10P74/00</further-classification>
        <further-classification edition="202601120260312B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>叢　者澎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CONG, ZHEPENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種處理腔室包括腔室主體、設置於該腔室主體上方的蓋子，以及一或多個設置於該蓋子上方的第一雷射裝置。該一或多個第一雷射裝置被配置為發出波長為約380nm至約600nm的光。第一隔離板設置於由該腔室主體至少部分限定的內部體積中。半透明層設置於第一隔離板上方。該半透明層被配置為吸收由該一或多個第一雷射裝置發出的該光的至少部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A processing chamber includes a chamber body, a lid disposed over the chamber body, and one or more first laser devices disposed over the lid. The one or more first laser devices are configured to emit light having a wavelength of about 380 nm to about 600 nm. A first isolation plate is disposed within an internal volume that is at least partially defined by the chamber body. A semi-translucent layer is disposed over the first isolation plate. The semi-translucent layer configured to absorb at least part of the light emitted from the one or more first laser devices.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:處理腔室</p>
        <p type="p">202:基板</p>
        <p type="p">203:棱鏡/反射鏡</p>
        <p type="p">206:感受器</p>
        <p type="p">207:升舉銷孔</p>
        <p type="p">208:上窗</p>
        <p type="p">209:中央部分</p>
        <p type="p">210:下窗</p>
        <p type="p">211:襯墊</p>
        <p type="p">212:流量模組</p>
        <p type="p">213:雷射裝置</p>
        <p type="p">214:氣體入口</p>
        <p type="p">215:基板支撐件</p>
        <p type="p">216:氣體排放出口</p>
        <p type="p">217:預熱環</p>
        <p type="p">218:軸</p>
        <p type="p">219:冷卻器</p>
        <p type="p">221:運動組件</p>
        <p type="p">223:半透明層</p>
        <p type="p">226:通道</p>
        <p type="p">227:內部反射器</p>
        <p type="p">228:氣體排放出口</p>
        <p type="p">229:臂</p>
        <p type="p">230:入口/冷卻管線</p>
        <p type="p">231:冷卻管線/出口</p>
        <p type="p">232:升舉銷</p>
        <p type="p">233:源</p>
        <p type="p">234:升舉銷停止件</p>
        <p type="p">235:軸</p>
        <p type="p">236a:下部分</p>
        <p type="p">236b:上部分</p>
        <p type="p">237:處置站點</p>
        <p type="p">238:淨化體積</p>
        <p type="p">239:臂</p>
        <p type="p">241:上熱源</p>
        <p type="p">243:下熱源</p>
        <p type="p">245:熱源模組</p>
        <p type="p">248:主體</p>
        <p type="p">250:頂表面</p>
        <p type="p">251:製程氣體源</p>
        <p type="p">252:地板</p>
        <p type="p">253:清潔氣體源</p>
        <p type="p">254:蓋子</p>
        <p type="p">255:上熱源模組</p>
        <p type="p">256:上部主體</p>
        <p type="p">257:排氣泵</p>
        <p type="p">258:下半部</p>
        <p type="p">262:淨化氣體源</p>
        <p type="p">263:襯墊</p>
        <p type="p">264:淨化氣體入口</p>
        <p type="p">271a:第一隔離板</p>
        <p type="p">271b:任選的第二隔離板</p>
        <p type="p">272:第一面</p>
        <p type="p">273:第二面</p>
        <p type="p">275:第二氣體入口</p>
        <p type="p">276:淨化氣體入口</p>
        <p type="p">281:環形區段</p>
        <p type="p">282:凸耳</p>
        <p type="p">283:入口開口</p>
        <p type="p">285:出口開口</p>
        <p type="p">290:控制器</p>
        <p type="p">291:記憶體</p>
        <p type="p">292:支援電路</p>
        <p type="p">293:CPU</p>
        <p type="p">295:感測器裝置</p>
        <p type="p">296:感測器裝置</p>
        <p type="p">297:感測器裝置</p>
        <p type="p">298:感測器裝置</p>
        <p type="p">299:感測器裝置</p>
        <p type="p">P1:製程氣體</p>
        <p type="p">P2:淨化氣體</p>
        <p type="p">P3:淨化氣體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1359" publication-number="202624803">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624803</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133222</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含位於蝕刻溝槽上之薄膜之波導及加熱器及製造其之方法</chinese-title>
        <english-title>WAVEGUIDE AND HEATER CONTAINING MEMBRANE LOCATED OVER ETCHED TRENCH AND METHOD OF MAKING THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">G02B6/12</main-classification>
        <further-classification edition="200601120260312B">G02B6/24</further-classification>
        <further-classification edition="200601120260312B">G02B6/26</further-classification>
        <further-classification edition="200601120260312B">G02B6/10</further-classification>
        <further-classification edition="200601120260312B">G02F1/01</further-classification>
        <further-classification edition="200601120260312B">G02F1/015</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商沛思量子公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PSIQUANTUM, CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韋爾特　阿列克謝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERT, ALEXEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布爾戈斯　史丹利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BURGOS, STANLEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡米奈尼　維默爾　庫馬爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMINENI, VIMAL KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種光學裝置，其含有一基板、位於該基板上之一薄膜、嵌入該薄膜中之一第一波導芯及至少一個加熱器元件、在該薄膜之對置橫向側上平行於該薄膜延伸之溝槽及位於該薄膜之至少一部分下方且連接至該等溝槽之一底切。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical device includes a substrate, a membrane located over the substrate, a first waveguide core and at least one heater element embedded in the membrane, trenches extending parallel to the membrane on opposite lateral sides of membrane, and an undercut located under at least a portion of the membrane and connected to the trenches.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2112:底切</p>
        <p type="p">2126:薄膜</p>
        <p type="p">2135A:溝槽</p>
        <p type="p">2137:凹槽</p>
        <p type="p">2140:周邊絕緣層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1360" publication-number="202625170">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625170</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133223</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含在記憶體部分中的處理器中具有電容器的多個晶片的記憶體裝置</chinese-title>
        <english-title>MEMORY DEVICE COMPRISING MULTIPLE CHIPS WITH CAPACITOR IN PROCESSOR IN MEMORY PORTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">G11C5/02</main-classification>
        <further-classification edition="202601120260312B">H10W72/00</further-classification>
        <further-classification edition="202601120260312B">H10W29/00</further-classification>
        <further-classification edition="202601120260312B">H10W90/00</further-classification>
        <further-classification edition="200601120260312B">G11C7/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴　繼紅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, JIHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴達羅格魯　穆斯塔法</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BADAROGLU, MUSTAFA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康　佑　達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, WOO TAG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納拉帕蒂　吉里達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NALLAPATI, GIRIDHAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　忠澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZHONGZE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇丹巴拉姆　佩里安南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIDAMBARAM, PERIANNAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種包含一記憶體裝置的裝置，該記憶體裝置包含：一第一記憶體晶片，該第一記憶體晶片包含：一第一記憶體部分；及記憶體部分中的一第一處理器，其中記憶體部分中的該第一處理器包括第一複數個邏輯單元及至少一個第一電容器；及一第二記憶體晶片，其耦接至該第一記憶體晶片。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device comprising a memory device comprising a first memory chip comprising a first memory portion; and a first processor in memory portion, wherein the first processor in memory portion includes a first plurality of logic cells and at least one first capacitor; and a second memory chip coupled to the first memory chip.</p>
      </isu-abst>
      <representative-img>
        <p type="p">403b:墊互連件</p>
        <p type="p">403c:墊互連件</p>
        <p type="p">403d:墊互連件</p>
        <p type="p">406b:鈍化層</p>
        <p type="p">406c:鈍化層</p>
        <p type="p">406d:鈍化層</p>
        <p type="p">445a:電容器</p>
        <p type="p">445b:電容器</p>
        <p type="p">445c:電容器</p>
        <p type="p">445d:電容器</p>
        <p type="p">500:記憶體裝置</p>
        <p type="p">501:晶片</p>
        <p type="p">502:晶片</p>
        <p type="p">503:晶片</p>
        <p type="p">504:晶片</p>
        <p type="p">505a:背側互連件</p>
        <p type="p">505b:背側互連件</p>
        <p type="p">505c:背側互連件</p>
        <p type="p">508:記憶體部分</p>
        <p type="p">509:記憶體部分中的處理器</p>
        <p type="p">550a:鈍化層</p>
        <p type="p">550b:鈍化層</p>
        <p type="p">550c:鈍化層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1361" publication-number="202625266">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625266</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133250</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含鋰釩氧化物和矽的鋰離子電池陽極材料</chinese-title>
        <english-title>LITHIUM-ION-BATTERY ANODE MATERIALS CONTAINING LITHIUM VANADIUM OXIDE AND SILICON</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260310B">H01M4/131</main-classification>
        <further-classification edition="201001120260310B">H01M4/133</further-classification>
        <further-classification edition="201001120260310B">H01M10/0525</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商泰法斯特公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TYFAST</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉豪東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HAODONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉奥　杰拉爾多•約瑟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LA O', GERARDO JOSE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金鋼云</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KANGWOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡清福</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馭理</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一些變型提供了一種陽極材料，該陽極材料包含：一氧化矽，其呈第一顆粒的形式；以及鋰釩氧化物(LVO)，其具有由Li&lt;i&gt;&lt;sub&gt;a&lt;/sub&gt;&lt;/i&gt;V&lt;i&gt;&lt;sub&gt;b&lt;/sub&gt;&lt;/i&gt;O&lt;i&gt;&lt;sub&gt;c&lt;/sub&gt;&lt;/i&gt;給出的組成，其中&lt;i&gt;a&lt;/i&gt; = 0.1–10，&lt;i&gt;b&lt;/i&gt; = 1–3，&lt;i&gt;c&lt;/i&gt; = 1–9，其中Li&lt;i&gt;&lt;sub&gt;a&lt;/sub&gt;&lt;/i&gt;V&lt;i&gt;&lt;sub&gt;b&lt;/sub&gt;&lt;/i&gt;O&lt;i&gt;&lt;sub&gt;c&lt;/sub&gt;&lt;/i&gt;能夠可逆地鋰化，其中LVO以與第一顆粒物理混合的第二顆粒的形式存在。其他變型提供了一種陽極材料，該陽極材料包含：Si/C複合物，其呈第一顆粒的形式；鋰釩氧化物，其呈第二顆粒的形式，其中第一顆粒和第二顆粒物理混合在一起，其中Si/C複合物以從約1 wt%至約99 wt%的Si/C濃度存在，並且其中LVO以從約1 wt%至約99 wt%的LVO濃度存在。提供了實施例，證明了所揭露的技術的實用性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Some variations provide an anode material comprising: silicon monoxide in the form of first particles; and lithium vanadium oxide (LVO) with a composition given by Li&lt;i&gt;&lt;sub&gt;a&lt;/sub&gt;&lt;/i&gt;V&lt;i&gt;&lt;sub&gt;b&lt;/sub&gt;&lt;/i&gt;O&lt;i&gt;&lt;sub&gt;c&lt;/sub&gt;&lt;/i&gt;, wherein &lt;i&gt;a&lt;/i&gt; = 0.1–10, &lt;i&gt;b&lt;/i&gt; = 1–3, &lt;i&gt;c&lt;/i&gt; = 1–9, wherein the Li&lt;i&gt;&lt;sub&gt;a&lt;/sub&gt;&lt;/i&gt;V&lt;i&gt;&lt;sub&gt;b&lt;/sub&gt;&lt;/i&gt;O&lt;i&gt;&lt;sub&gt;c&lt;/sub&gt;&lt;/i&gt; is capable of being reversibly lithiated, wherein the LVO is present in the form of second particles that are physically mixed with the first particles. Other variations provide an anode material comprising: a Si/C composite in the form of first particles; lithium vanadium oxide in the form of second particles, wherein the first particles and the second particles are physically mixed together, wherein the Si/C composite is present in a Si/C concentration from about 1 wt% to about 99 wt%, and wherein the LVO is present in a LVO concentration from about 1 wt% to about 99 wt%. Examples are provided, demonstrating the utility of the disclosed technology.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1362" publication-number="202625022">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625022</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133262</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＶＦＬ配置協調方法</chinese-title>
        <english-title>METHODS FOR VFL CONFIGURATION COORDINATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260313B">G06N3/098</main-classification>
        <further-classification edition="202201120260313B">H04L67/51</further-classification>
        <further-classification edition="200901120260313B">H04W8/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商內數位專利控股公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERDIGITAL PATENT HOLDINGS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫仲濟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SON, JUNG JE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧維拉　赫恩安德茨　烏利斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OLVERA-HERNANDEZ, ULISES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洛伊　米契爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROY, MICHEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　志必</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZHIBI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邁森尼　阿赫雷夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METHENNI, ACHREF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　光州</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, GUANZHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡清福</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馭理</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">縱向聯邦學習（VFL）伺服器可將發現請求發送至網路儲存庫功能（NRF）。VFL伺服器可將發現請求發送至網路儲存庫功能（NRF）。發現請求可包括VFL配置識別符（ID）。VFL配置ID可由VFL伺服器支援。發現請求可指示VFL伺服器被配置為發現一或更多個VFL用戶端。一或更多個VFL用戶端可支援VFL配置ID。VFL伺服器可接收發現回應。發現回應可包括支援VFL配置ID的一或更多個VFL用戶端的清單。WTRU可從VFL用戶端清單中選擇一或更多個VFL用戶端。WTRU可在所選一或更多個VFL用戶端上執行樣本對齊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A vertical federated learning (VFL) server may send a discovery request to a network repository function (NRF). The VFL server may send a discovery request to a network repository function (NRF). The discovery request may comprise a VFL configuration identifier (ID). The VFL configuration ID may be supported by the VFL server. The discovery request may indicate that the VFL server is configured to discover one or more VFL clients. The one or more VFL clients may support the VFL configuration ID. The VFL server may receive a discovery response. The discovery response may comprise a list of one or more VFL clients that support the VFL configuration ID. The WTRU may select one or more VFL clients from the list of VFL clients. The WTRU may perform sample alignment on the selected one or more VFL clients.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:呼叫流程</p>
        <p type="p">304、308:發現請求</p>
        <p type="p">312、320:發現回應</p>
        <p type="p">316:選擇支援作為資料來源的關聯NF類型的VFL用戶端</p>
        <p type="p">324:樣本對齊</p>
        <p type="p">328:基於VFL配置ID(經由NEF)與VFL用戶端執行VFL</p>
        <p type="p">AF:應用功能</p>
        <p type="p">ID:識別符</p>
        <p type="p">ML:機器學習</p>
        <p type="p">NEF:網路暴露功能</p>
        <p type="p">NF:網路功能</p>
        <p type="p">NRF:網路儲存庫功能</p>
        <p type="p">VFL:縱向聯邦學習</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1363" publication-number="202624794">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624794</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133305</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>防眩光片材、片材物品、偏光板、顯示裝置及面板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120260306B">G02B1/10</main-classification>
        <further-classification edition="201901120260306B">B32B7/023</further-classification>
        <further-classification edition="200601120260306B">G02B5/30</further-classification>
        <further-classification edition="200601120260306B">G02F1/1335</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大日本印刷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古井玄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUI, GEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>成川隆史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NARIKAWA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山根幹寛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMANE, MIKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">壓痕硬度HS、第1層之剖面之壓痕硬度H1及第2層之剖面之壓痕硬度H2滿足如下關係。  &lt;br/&gt;HS＜H2且H1＜H2  &lt;br/&gt;基材層之剖面之複合彈性模數ES、第1層之剖面之複合彈性模數E1及第2層之剖面之複合彈性模數E2滿足如下關係。  &lt;br/&gt;E1＜ES且E2＜ES</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:防眩光片材</p>
        <p type="p">11:第1面</p>
        <p type="p">11X:凹凸面</p>
        <p type="p">12:第2面</p>
        <p type="p">20:第2層</p>
        <p type="p">21:第1面</p>
        <p type="p">21X:凹凸面</p>
        <p type="p">22:第2面</p>
        <p type="p">26:黏合劑成分</p>
        <p type="p">27:粒子</p>
        <p type="p">30:第1層</p>
        <p type="p">40:基材層</p>
        <p type="p">D1:第1方向</p>
        <p type="p">D2:第2方向</p>
        <p type="p">D3:第3方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1364" publication-number="202625702">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625702</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133318</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>蝕刻方法及蝕刻裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260308B">H10P50/20</main-classification>
        <further-classification edition="202601120260308B">H10P50/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倉本蕗人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURAMOTO, FUKITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋信博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, NOBUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今村健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMAMURA, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在對形成在基板的表面的凹部內之氧化矽膜的一部分進行蝕刻時抑制在基板的各部位上的處理不均。  &lt;br/&gt;本揭露之蝕刻方法，係包含下述工序：反覆由第1工序與第2工序構成的循環，該第1工序係對收納有基板之處理容器內供給處理氣體以生成氧化矽膜與該處理氣體的反應生成物，該第2工序係在停止對該處理容器內供給該處理氣體的狀態下對該處理容器內進行排氣以去除該反應生成物，該基板係在藉由第1層形成的凹部內設有該氧化矽膜，且在該凹部的開口方向上對形成該凹部之側壁層積有由氮化矽構成的第2層；以及使各該循環中第1次循環的第1工序以與後續循環的第1工序不同的處理條件來進行以去除該第2層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1365" publication-number="202624541">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624541</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133319</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法及基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">C23F1/24</main-classification>
        <further-classification edition="202601120260311B">H10P50/28</further-classification>
        <further-classification edition="202601120260311B">H10W76/05</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河村駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAMURA, SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今村健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMAMURA, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中込健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAGOMI, KEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戶田聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TODA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">縮短氣體蝕刻時殘留在膜上的氣體或副生成物的殘留時間。  &lt;br/&gt;  基板處理裝置，係具備：第1儲藏部分；第2儲藏部分；第3儲藏部分；第1上游閥，係連接於第1蝕刻氣體的供給源與第1儲藏部分的上游；第2上游閥，係連接於第2蝕刻氣體的供給源與第2儲藏部分的上游；第3上游閥，係連接於第1非活性氣體的供給源與第3儲藏部分的上游；第1下游閥，係連接於第1儲藏部分的下游與氣體供給口；第2下游閥，係連接於第2儲藏部分的下游與氣體供給口；第3下游閥，係連接於第3儲藏部分的下游與氣體供給口；第1壓力感測器，係測定第1儲藏部分內的壓力；第2壓力感測器，係測定第2儲藏部分內的壓力；以及第3壓力感測器，係測定第3儲藏部分內的壓力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1366" publication-number="202625326">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625326</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133320</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>穩定細長海下元件</chinese-title>
        <english-title>STABILISING ELONGATE SUBSEA ELEMENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">H02G9/02</main-classification>
        <further-classification edition="200601120260306B">F16L1/12</further-classification>
        <further-classification edition="200601120260306B">H02G1/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商海底七有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUBSEA 7 LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈姆丹　納烏拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMDAN, NAWRAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種例如為電纜的細長海下元件係透過將此元件的一段長度耦接至放置於海床上的互連槽體的陣列而被穩定。此細長元件的耦接的長度設置於此陣列中的槽體群組之間，其便利地耦接至此陣列中的連接槽體之群組的連接件。  &lt;br/&gt;在將此元件安置至海床上之後，此陣列與此元件可於海床上耦接，或者，此陣列與此元件可在海床上方被耦接並一起安置至海床上。此陣列中的此些槽體經由連接件達成流體連通，且在安置後可被密度高於水的流體壓載。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An elongate subsea element such as a cable is stabilised by coupling a length of the element to an array of interconnected tanks placed on a seabed. The coupled length of the elongate element is disposed between groups of tanks of the array, conveniently being coupled to connectors of the array that interconnect those groups of tanks. &lt;br/&gt;The array and the element can be coupled on the seabed, hence after landing the element on the seabed, or the array and the element can be coupled above the seabed and landed on the seabed together. The tanks of the array are in fluid communication via the connectors and may be ballasted, after landing, with a fluid of greater density than water.</p>
      </isu-abst>
      <representative-img>
        <p type="p">12:電纜</p>
        <p type="p">14:風力發電機</p>
        <p type="p">16:海床</p>
        <p type="p">32:壩</p>
        <p type="p">36:埋設點</p>
        <p type="p">40:陣列</p>
        <p type="p">42:槽體</p>
        <p type="p">60:列</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1367" publication-number="202625578">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625578</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133332</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於缺陷減少的循環處理方法以及相關設備、裝置及處理腔室</chinese-title>
        <english-title>CYCLIC PROCESSING METHODS FOR DEFECT REDUCTION, AND RELATED APPARATUS, DEVICES, AND PROCESSING CHAMBERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260313B">H10D30/01</main-classification>
        <further-classification edition="202601120260313B">H10D62/00</further-classification>
        <further-classification edition="202601120260313B">H10P14/24</further-classification>
        <further-classification edition="202601120260313B">H10P50/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　學斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XUEBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿蘿拉　希瑪尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARORA, HIMANI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任　河</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REN, HE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊天辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, TIANCHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓋爾　拉曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAIRE, RAMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉翔宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, XIANGYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>托勒　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOLLE, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑪格提斯　喬伊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARGETIS, JOE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>督比　阿布希雪克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUBE, ABHISHEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬普拉　索拉布</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOPRA, SAURABH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了製造半導體元件的系統和方法，特別專注於在半導體結構內的循環磊晶生長和蝕刻。該方法包括在基板的結構上形成源極和汲極材料並蝕刻源極和汲極材料。該蝕刻是在複數個蝕刻循環中進行，這些循環分別包括流動淨化氣體和流動蝕刻氣體以蝕刻源極和汲極材料。源極和汲極材料可以是n型摻雜的含矽層，該層是使用包括有機磷的摻雜源形成的。這個循環重複進行，以達到目標厚度。該製程藉由減少缺陷和改善均勻性，提升多閘極裝置如環繞閘極電晶體的質量和性能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and methods for manufacturing semiconductor devices, specifically focusing on cyclic epitaxial growth and etching within a semiconductor structure are provided. The method includes forming a source and drain material on a structure of a substrate and etching the source and drain material. The etching is conducted in a plurality of etch cycles that respectively include flowing a purge gas and flowing an etch gas to etch the source and drain material. The source and drain material can be an n-type doped silicon-containing layer formed using a dopant source including an organophosphine. This cycle is repeated to achieve the targeted thickness. The process enhances the quality and performance of multi-gate devices like gate-all-around transistors by reducing defects and improving uniformity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:方法</p>
        <p type="p">302:操作</p>
        <p type="p">304:操作</p>
        <p type="p">306:操作</p>
        <p type="p">308:操作</p>
        <p type="p">314:操作</p>
        <p type="p">316:操作</p>
        <p type="p">317:操作</p>
        <p type="p">318:操作</p>
        <p type="p">320:操作</p>
        <p type="p">321:操作</p>
        <p type="p">322:操作</p>
        <p type="p">323:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1368" publication-number="202624528">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624528</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133350</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化學氣相沉積裝置</chinese-title>
        <english-title>CHEMICAL VAPOR DEPOSITION APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">C23C16/44</main-classification>
        <further-classification edition="200601120260311B">C23C16/458</further-classification>
        <further-classification edition="200601120260311B">C23C16/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＴＥＳ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TES CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李承俱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEOUNG-GU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種化學氣相沉積裝置，更詳細地涉及一種當將氣體被排出的排氣流路的一部分使用為基板的裝載/卸載路徑時可以阻斷排氣氣體向基板的移動路徑流入而防止基板的汙染的化學氣相沉積裝置。化學氣相沉積裝置具備：腔體，提供對基板的處理空間；排氣管，在所述腔體內部中與所述處理空間連接而排出所述處理空間的氣體，並形成有供所述基板進出的基板投入口；基板移動通路，藉由所述基板投入口與所述排氣管連接；以及開閉單元，開閉所述基板投入口。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:腔體</p>
        <p type="p">102:排氣口</p>
        <p type="p">110:容納空間</p>
        <p type="p">200:氣體供應部</p>
        <p type="p">210:供應口</p>
        <p type="p">220:氣體流入管</p>
        <p type="p">300:內部腔體</p>
        <p type="p">310:上殼體</p>
        <p type="p">312:處理空間</p>
        <p type="p">320:下板</p>
        <p type="p">322:凹部</p>
        <p type="p">324:基座</p>
        <p type="p">340:下加熱器</p>
        <p type="p">400:氣體排氣管</p>
        <p type="p">404:彎曲部</p>
        <p type="p">410:上蓋</p>
        <p type="p">412:連接槽</p>
        <p type="p">414:基板投入口</p>
        <p type="p">420:下蓋</p>
        <p type="p">432,434:傳熱防止構件</p>
        <p type="p">435:臺階部</p>
        <p type="p">500:基板移動通路</p>
        <p type="p">502:移動空間</p>
        <p type="p">600:開閉單元</p>
        <p type="p">610:第一升降擋板</p>
        <p type="p">612:連接部</p>
        <p type="p">620:阻熱部</p>
        <p type="p">630:第一軸</p>
        <p type="p">640:第一波紋管</p>
        <p type="p">650:第一驅動部</p>
        <p type="p">662:升降板</p>
        <p type="p">664:支承板</p>
        <p type="p">1000:化學氣相沉積裝置</p>
        <p type="p">W:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1369" publication-number="202625672">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625672</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133358</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>壓電感測線</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260304B">H10N30/09</main-classification>
        <further-classification edition="202301120260304B">H10N30/08</further-classification>
        <further-classification edition="202301120260304B">H10N30/06</further-classification>
        <further-classification edition="202301120260304B">H10N30/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友電氣工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO ELECTRIC INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉村和昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIMURA, KAZUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮部直昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYABE, TADAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山崎一帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASAKI, KAZUHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩本力俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWAMOTO, KATSUTOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河部望</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWABE, NOZOMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之目的在於提供一種檢測精度較高且應答速度較高之壓電感測線。  &lt;br/&gt;本揭示之壓電感測線具備芯線、有機壓電體層、及電極區域。芯線包含鋼線、與被覆鋼線之銅製或銅合金製之被覆層。芯線之線徑為30 μm以上200 μm以下。有機壓電體層以與芯線之外周面接觸之方式覆蓋外周面。有機壓電體層之平均厚度為2.5 μm以上7.5 μm以下。電極區域與有機壓電體層接觸，且與芯線分開而包圍芯線。壓電感測線之線徑為300 μm以下。被覆層遍及全域與鋼線之外周面即第1外周面接觸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:壓電感測線</p>
        <p type="p">2:芯線</p>
        <p type="p">3:有機壓電體層</p>
        <p type="p">4:電極區域</p>
        <p type="p">5:絕緣層</p>
        <p type="p">21:鋼線</p>
        <p type="p">22:被覆層</p>
        <p type="p">31:第2內周面(有機壓電體層)</p>
        <p type="p">32:第3外周面(有機壓電體層)</p>
        <p type="p">41:電極線</p>
        <p type="p">42:第4外周面(電極線)</p>
        <p type="p">51:外周面(絕緣層)</p>
        <p type="p">211:第1外周面(鋼線)</p>
        <p type="p">221:內周面(被覆層)</p>
        <p type="p">222:第2外周面(被覆層)</p>
        <p type="p">321:凹部</p>
        <p type="p">322:連結部</p>
        <p type="p">421:第1部分(第4外周面)</p>
        <p type="p">422:第2部分(第4外周面)</p>
        <p type="p">C1:軸</p>
        <p type="p">C2:軸</p>
        <p type="p">L:最小厚度</p>
        <p type="p">R1:線徑(壓電感測線)</p>
        <p type="p">R2:線徑(芯線)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1370" publication-number="202625204">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625204</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133412</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種憂鬱的檢測方法及其系統</chinese-title>
        <english-title>METHOD OF DEPRESSION DETECTION AND SYSTEM THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260126B">G16H20/70</main-classification>
        <further-classification edition="201801120260126B">G16H50/30</further-classification>
        <further-classification edition="202001120260126B">G06F40/30</further-classification>
        <further-classification edition="202201120260126B">G06V40/16</further-classification>
        <further-classification edition="201801120260126B">G16H30/00</further-classification>
        <further-classification edition="200601120260126B">A61B5/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立成功大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林梅鳳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, MEI-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈鴻儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, HONG-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許嘉峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIA-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘怡謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, YI-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉非比</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, FEI-PI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許智為</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李威聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種憂鬱的檢測方法及其系統，該方法之步驟包括：人臉標記步驟、情感分類運算步驟、憂鬱辨識步驟及驗證步驟，並結合語意分析步驟及綜合憂鬱步驟以判斷憂鬱程度；本發明的憂鬱檢測方法對乳癌婦女的臉部情感預測具高準確率及穩定性，且其檢測結果與傳統憂鬱量表間有明顯相關性，並容易察覺細微情感。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a method of depression detection and system thereof, wherein the method comprises steps of: a face marking step, an emotion classification and calculation step, a depression identification step and a verification step.; the method of depression detection also comprises a semantic analyzing step and a comprehensive depression step to determine level of depression. The method of depression detection has high accuracy and stability in predicting facial emotions of women with breast cancer, and its results show a significant correlation with traditional depression scales and are more sensitive to subtle emotions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(步驟S10至S40)</p>
        <p type="p">(步驟S01至S42)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1371" publication-number="202624009">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624009</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133419</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>轉印薄膜、樹脂圖案之製造方法及導電圖案之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">B32B27/18</main-classification>
        <further-classification edition="200601120260302B">C08K5/353</further-classification>
        <further-classification edition="200601120260302B">C08L101/00</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/038</further-classification>
        <further-classification edition="200601120260302B">G03F7/09</further-classification>
        <further-classification edition="200601120260302B">G03F7/16</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="200601120260302B">G03F7/40</further-classification>
        <further-classification edition="200601120260302B">H05K3/06</further-classification>
        <further-classification edition="200601120260302B">H05K3/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>片山晃男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATAYAMA, AKIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示提供一種轉印薄膜等，該轉印薄膜具有比以往更高的靈敏度，並且在藉由使用直接描繪法之曝光在基板上形成樹脂圖案時，能夠形成高解析度的樹脂圖案。本揭示提供一種轉印薄膜及其應用，該轉印薄膜具備臨時支撐體及配置於臨時支撐體上之感光性樹脂層，感光性樹脂層包含鹼可溶性樹脂、聚合性化合物、光聚合起始劑及下述式（1）所表示之化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:臨時支撐體</p>
        <p type="p">12:轉印層</p>
        <p type="p">13:熱塑性樹脂層</p>
        <p type="p">15:中間層</p>
        <p type="p">17:感光性樹脂層</p>
        <p type="p">19:保護膜</p>
        <p type="p">20:轉印薄膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1372" publication-number="202625590">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625590</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133482</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於FINFET與GAA源極/汲極EPI膜生長控制之脈衝蝕刻</chinese-title>
        <english-title>PULSE ETCHING FOR FINFET AND GAA SOURCE/DRAIN EPI FILM GROWTH CONTROL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260313B">H10D62/00</main-classification>
        <further-classification edition="202601120260313B">H10P14/24</further-classification>
        <further-classification edition="202601120260313B">H10P50/24</further-classification>
        <further-classification edition="200601120260313B">C30B33/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　學斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XUEBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>托勒　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOLLE, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>叢　者澎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CONG, ZHEPENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一種製造半導體元件的方法和系統，該等方法和系統使用循環脈衝蝕刻淨化製程，特別是在磊晶膜沉積之後。該製程涉及交替流動的蝕刻氣體和淨化氣體（如H2、N2、HCl、Cl2等）以及可選的沉積氣體，以選擇性移除不需要的摻雜含矽材料，塑造具有精確剖面的磊晶特徵形狀，並最小化如孔隙一般的缺陷。該方法可以在與沉積相同的腔室中進行原位操作，並使用控制的氣體脈衝循環以達成目標的源極/汲極特徵形成。支援各種製程參數和化學環境，與標準的nMOS和pMOS條件相容，並可在自動化的半導體製造環境中實施。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and systems for fabricating semiconductor devices that use a cyclic pulse-etch-purge process, particularly after epitaxial film deposition, are provided. The process involves alternating flows of etch and purge gases (such as H2, N2, HCl, Cl2, and others) and optionally deposition gases to selectively remove unwanted doped silicon-containing material, shaping epitaxial features with precise profiles and minimizing defects like voids. The method can be performed in-situ in the same chamber as deposition and uses controlled cycles of gas pulses to achieve targeted source/drain feature formation. It supports various process parameters and chemistries, is compatible with standard nMOS and pMOS conditions, and can be implemented in automated semiconductor manufacturing environments.</p>
      </isu-abst>
      <representative-img>
        <p type="p">350:操作</p>
        <p type="p">400:半導體元件結構</p>
        <p type="p">402:第一半導體區域</p>
        <p type="p">404:第二半導體區域</p>
        <p type="p">406:基板</p>
        <p type="p">408:溝槽</p>
        <p type="p">410:第一半導體層</p>
        <p type="p">412:第二半導體層</p>
        <p type="p">414:內部間隔墊</p>
        <p type="p">416:假閘極結構</p>
        <p type="p">418:假閘極</p>
        <p type="p">419:間隔墊</p>
        <p type="p">420:摻雜含矽材料</p>
        <p type="p">430:凹槽</p>
        <p type="p">430B:底表面</p>
        <p type="p">430S:側壁表面</p>
        <p type="p">431:底部介電隔離(BDI)層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1373" publication-number="202624619">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624619</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133509</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有軸襯與阻尼器之泵</chinese-title>
        <english-title>PUMP WITH BUSHING AND DAMPENER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260310B">F04D29/058</main-classification>
        <further-classification edition="200601120260310B">F04D29/00</further-classification>
        <further-classification edition="200601120260310B">F04D13/06</further-classification>
        <further-classification edition="200601120260310B">F04D29/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商伊萊克崔西有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELECTROSEA, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈登　布萊恩艾倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOLDEN, BRIAN ALAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬澤爾　彼得山繆爾布羅恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FINZELL, PETER SAMUEL BROEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示涉及一種磁性驅動泵，其包含可繞由一葉輪軸所定義之一旋轉軸線而旋轉的一葉輪。提供一彈性體阻尼器，用以降低在泵於用以冷卻之液體供應不足的一乾轉狀態下運行時，因振動/熱造成之潛在損壞。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a magnetic drive pump including an impeller rotatable about an axis of rotation defined by an impeller shaft. An elastomeric dampener is provided for reducing vibration/heat related damage that may otherwise occur when the pump is operated in a dry statewhere insufficient liquid is provided for cooling.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:磁性驅動泵</p>
        <p type="p">101:馬達</p>
        <p type="p">102:驅動軸</p>
        <p type="p">104:磁性驅動外殼</p>
        <p type="p">106:磁鐵</p>
        <p type="p">108:旋轉軸線</p>
        <p type="p">110:磁鐵配置</p>
        <p type="p">112:第一磁鐵</p>
        <p type="p">114:葉輪</p>
        <p type="p">116:磁鐵支撐體</p>
        <p type="p">118:葉輪軸</p>
        <p type="p">120:軸襯與阻尼器組件</p>
        <p type="p">122:軸襯</p>
        <p type="p">124:阻尼器</p>
        <p type="p">126:入口</p>
        <p type="p">127:出口</p>
        <p type="p">128:主外殼體</p>
        <p type="p">130:泵室</p>
        <p type="p">132:隔離殼</p>
        <p type="p">134:密封墊</p>
        <p type="p">136:套筒</p>
        <p type="p">138:推力軸承</p>
        <p type="p">142:蓋</p>
        <p type="p">144:密封墊</p>
        <p type="p">146:中央開口</p>
        <p type="p">148:外部連接套筒</p>
        <p type="p">150:外殼</p>
        <p type="p">152:支腳</p>
        <p type="p">154:套筒</p>
        <p type="p">156:套筒</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1374" publication-number="202624584">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624584</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133511</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於引導紗的裝置</chinese-title>
        <english-title>DEVICE FOR GUIDING A YARN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">D02G1/00</main-classification>
        <further-classification edition="200601120260312B">D02G3/00</further-classification>
        <further-classification edition="200601120260312B">D02G3/22</further-classification>
        <further-classification edition="200601120260312B">D02G1/20</further-classification>
        <further-classification edition="200601120260312B">D02G3/34</further-classification>
        <further-classification edition="200601120260312B">B65H49/00</further-classification>
        <further-classification edition="200601120260312B">B65H59/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商ＳＳＭ恰特斯威特美特勒公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SSM SCHARER SCHWEITER METTLER AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科瑞司帝　馬塞爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHRISTE, MARCEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕瑞斯　塞繆爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARIS, SAMUEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李敦維</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於引導至少一紗(1)來生產一飾紗的方法及裝置，亦係關於一種具有此一裝置的紡織機，其中該裝置具有一控制器(3)以及固定地保持在一基板(4)中的至少三個導紗器(5)。該等導紗器(5)係一個接另一個地配置在一導軸(6, 7)上。在該等固定地保持的導紗器(5)的各者之間提供一導紗元件(8)，其中該等導紗元件(8)經配置在一元件軸(9)上且經緊固至一樞軸元件(10, 11)上，該樞軸元件具備一驅動器(16)且保持在一樞軸(12)上，其中在該樞軸元件(10, 11)的一基本位置中，該元件軸(9)經配置在該導軸(6, 7)上或平行於該導軸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a method and a device for guiding at least one yarn (1) for producing an effect yarn, as well as to a textile machine with such a device, wherein the device has a controller (3) and at least three yarn guides (5) fixedly held in a base plate (4). The yarn guides (5) are arranged one behind the other in a guide axis (6, 7). A yarn guide element (8) is provided between each of the fixedly held yarn guides (5), wherein the yarn guide elements (8) are arranged in an element axis (9) and are fastened to a pivot element (10, 11) provided with a drive (16) and held in a pivot axis (12), wherein, in a basic position of the pivot element (10, 11), the element axis (9) is arranged in or parallel to the guide axis (6, 7).</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:紗；第一紗</p>
        <p type="p">4:基板</p>
        <p type="p">5:導紗器</p>
        <p type="p">6:導軸</p>
        <p type="p">8:導紗元件</p>
        <p type="p">9:元件軸</p>
        <p type="p">10:樞軸臂</p>
        <p type="p">12:樞軸</p>
        <p type="p">13:樞轉運動</p>
        <p type="p">14:方向；第一方向</p>
        <p type="p">16:驅動器</p>
        <p type="p">25:狀態；樞轉狀態；第一樞轉狀態；第一狀態</p>
        <p type="p">α:樞軸角度；第一樞軸角度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1375" publication-number="202625543">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625543</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133523</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>散熱結構及其散熱方法</chinese-title>
        <english-title>HEAT DISSIPATING STRUCTURE AND HEAT DISSIPATING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">H05K7/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商知微電子有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XMEMS LABS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔特爾　湯瑪斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TARTER, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁　振宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, JEMM YUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種散熱結構及一種散熱方法。散熱結構包括一管道以及一氣流產生裝置。管道具有形成於管道內的一通道。散熱結構設置在一半導體元件上、旁邊或上方，且用來消散半導體元件產生的熱量。氣流產生裝置用來產生流經管道內的通道的氣流，以消散半導體元件產生的熱量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A heat dissipating structure and a heat dissipating method are disclosed. The heat dissipating structure includes a duct, which has a channel formed in the duct, and an airflow generating device. The heat dissipating structure is disposed on, by or over a semiconductor device and configured to dissipate heat generated from the semiconductor device. The airflow generating device is configured to generate an airflow flowing through the channel within the duct to dissipate the heat generated from the semiconductor device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:散熱結構</p>
        <p type="p">100a,100b:AFG裝置</p>
        <p type="p">150:管道</p>
        <p type="p">190:記憶體模組</p>
        <p type="p">191:記憶體晶片</p>
        <p type="p">192:印刷電路板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1376" publication-number="202625003">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625003</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133530</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板製程資料標記</chinese-title>
        <english-title>SUBSTRATE PROCESS DATA LABELING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260313B">G06F30/31</main-classification>
        <further-classification edition="202001120260313B">G06F30/327</further-classification>
        <further-classification edition="200601120260313B">G05B23/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑達　巴拉斯拉姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNDAR, BHARATH RAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紐拉尼　拉曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NURANI, RAMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納安能　拉瑪史瓦美梅拉圖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NARAYANAN, RAMASWAMY MELATOOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森凱瑞拉南　格那帕西洛門</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANKARANARAYANAN, GANAPATHI RAMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇拉瑪尼安　拉瑪尚德倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUBRAMANIAN, RAMACHANDRAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗里德　里賈納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FREED, REGINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周怡全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, YI-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維奇能森　安能得拉曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VITHYANANTHAN, ANANDARAMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>素洛曼尼恩　羅吉洛曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUBRAMANIAN, RAJARAMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛文達瑞　傑格迪許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOVINDARAJ, JAGADEESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索里恩莫堤　麥立史瓦曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOORIAMOORTHY, MAREESWARAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古塔　奧堤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUPTA, ADITI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種方法包括獲取包括在複數個基板上執行的一或多個製程的製程資料的第一複數個資料條目。該方法進一步包括從第一複數個資料條目中確定感興趣操作。該方法進一步包括藉由跨第一複數個資料條目標準化感興趣操作來更新第一複數個資料條目的第一資料條目子集。該方法進一步包括用共同標籤標記第一資料條目子集。該方法進一步包括獲取包括計量資料的第二複數個資料條目。該方法進一步包括將更新的第一資料條目子集的製程資料與計量資料進行連結。該方法進一步包括準備更新的第一資料條目子集以用於基於共同標籤的一或多個資料分析操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes obtaining a first plurality of data entries comprising process data of one or more processes performed on a plurality of substrates. The method further includes determining an operation of interest from the first plurality of data entries. The method further includes updating a first subset of data entries of the first plurality of data entries by normalizing the operation of interest across the first plurality of data entries. The method further includes labeling the first subset of data entries with a common label. The method further includes obtaining a second plurality of data entries comprising metrology data. The method further includes linking the process data of the updated first subset of data entries to the metrology data. The method further includes preparing the updated first subset of data entries for one or more data analysis operations based on the common label.</p>
      </isu-abst>
      <representative-img>
        <p type="p">122:資料標記部件</p>
        <p type="p">142:感測器資料</p>
        <p type="p">144:配方資料</p>
        <p type="p">150:製造參數</p>
        <p type="p">160:計量資料</p>
        <p type="p">200:資料流</p>
        <p type="p">206:資料選擇</p>
        <p type="p">208:資料標記</p>
        <p type="p">210:資料準備</p>
        <p type="p">212:虛擬模型建構</p>
        <p type="p">214:機器學習模型訓練</p>
        <p type="p">216:資料儲存</p>
        <p type="p">223:使用者輸入</p>
        <p type="p">230:資料分析</p>
        <p type="p">240:資料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1377" publication-number="202625258">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625258</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133535</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>帶有電動磁環的感應耦合電漿腔室</chinese-title>
        <english-title>INDUCTIVELY COUPLED PLASMA CHAMBER WITH ELECTRICALLY POWERED MAGNET RING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">H01J37/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉馬斯瓦米　卡提克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMASWAMY, KARTIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威爾維斯　麥克Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WILLWERTH, MICHAEL D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江　志明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, ZHIMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雨暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YUHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王欣欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, XINGXING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩羅德比許瓦那　尤甘南達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SARODE VISHWANATH, YOGANANDA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供配置用於產生感應耦合電漿的基板處理腔室。在一個實施例中，基板處理腔室具有腔室主體和置於腔室主體內的基板支撐組件。基板處理腔室有蓋組件，封閉腔室主體內的處理區域。該蓋組件具有配置用以在腔室主體的處理區域內產生電漿的感應線圈。射頻屏蔽罩封閉感應線圈，且至少一個磁鐵連接至磁鐵電源並置於射頻屏蔽罩外部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a substrate processing chamber configured to produce an inductively coupled plasma. In one example, the substrate processing chamber has a chamber body and a substrate support assembly disposed within the chamber body. The substrate processing chamber has a lid assembly enclosing a processing region within the chamber body. The lid assembly has an inductive coil configured to generate a plasma within the processing region of the chamber body. A radio frequency shield encloses the inductive coil and at least one magnet is coupled to a magnet power source and disposed outside of the radio frequency shield.</p>
      </isu-abst>
      <representative-img>
        <p type="p">126:處理區域</p>
        <p type="p">200:部分</p>
        <p type="p">202:RF屏蔽罩</p>
        <p type="p">204:RF網格部分</p>
        <p type="p">206:一個磁鐵</p>
        <p type="p">208:磁鐵電源</p>
        <p type="p">210:磁鐵屏蔽罩</p>
        <p type="p">212:磁場</p>
        <p type="p">214:感應線圈</p>
        <p type="p">216:電漿</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1378" publication-number="202623751">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623751</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133543</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔設備和清潔系統</chinese-title>
        <english-title>CLEANING DEVICE AND CLEANING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">A47L11/40</main-classification>
        <further-classification edition="200601120260312B">A47L11/24</further-classification>
        <further-classification edition="200601120260312B">A47L11/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐洪亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, HONGLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請實施例涉及智慧家居技術領域公開了一種清潔設備和清潔系統，清潔設備包括了清潔設備主體、線束彙集板、轉接板和主板，多個功能器件先通過線纜與線束彙集板連接，再通過轉接板與主板進行連接，通過線束彙集板的設置能夠先對線束進行統一的連接，而後再通過轉接板與主板進行連接，能夠使線束的連接佈局更加方便，清潔設備內部線束分佈更加整潔，且通過轉接板可以對功能器件進行避讓，利於多個功能器件在清潔設備主體內的佈局。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application relates to the field of smart home technology and discloses a cleaning device and a cleaning system. The cleaning device includes the main body of the cleaning device, a wire harness collection board, an adapter board, and a mainboard. Multiple functional devices are first connected to the wire harness collection board via cables, and then connected to the mainboard through the adapter board. By arranging the wire harness collection board, the wire harness can be unifiedly connected first, and then connected to the mainboard via the adapter board. This makes the wiring layout more convenient, the internal wire harness distribution of the cleaning device more orderly, and through the adapter board, functional devices can be avoided, facilitating the layout of multiple functional devices within the main body of the cleaning device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:清潔設備主體</p>
        <p type="p">130:線束彙集板</p>
        <p type="p">140:轉接板</p>
        <p type="p">160:抓取組件</p>
        <p type="p">111:限位件</p>
        <p type="p">112:支撐件</p>
        <p type="p">113:殼體</p>
        <p type="p">121:集塵風機</p>
        <p type="p">122:驅動件</p>
        <p type="p">123:充電模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1379" publication-number="202623742">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623742</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133545</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液體加熱調理器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">A47J37/12</main-classification>
        <further-classification edition="200601120260312B">H05B6/64</further-classification>
        <further-classification edition="201601120260312B">A23L5/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商泰寧凱股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANICO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小出宏之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOIDE, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>也
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAKINO, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國井和明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNII, KAZUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>下山田光宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMOYAMADA, MITSUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>水野竜太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZUNO, RYUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 目的在提供一種液體加熱調理器，是在微波所為的加熱調理中，不會因為在調理單元內使用的金屬製零件而產生放電情況。  &lt;br/&gt;　　[解決手段] 本發明的液體加熱調理器，是在最容易火花四濺的頂板的孔的位置處配置陶瓷材料等的非導電性構件、或者將懸吊構件的全部或至少一部分製作成非導電性材料。藉由使用非導電性構件，即使放射出微波，也不會因金屬零件彼此形成不完全接觸部分所致的放電，所以，可避免液體加熱調理器的損傷。當懸吊構件的至少一部分為非導電性材料時，邊考慮到液體槽、食品籃的大小，邊控制非導電性部分的位置，以使為了加熱調理食材而將食品籃下降到液體槽中時的懸吊構件的非導電性部分與頂板的孔相吻合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:油炸鍋</p>
        <p type="p">1a:上段部分</p>
        <p type="p">1b:中段部分</p>
        <p type="p">1c:下段部分</p>
        <p type="p">12:食品籃</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1380" publication-number="202623752">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623752</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133546</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔設備和清潔系統</chinese-title>
        <english-title>CLEANING DEVICE AND CLEANING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">A47L11/40</main-classification>
        <further-classification edition="200601120260312B">A47L11/24</further-classification>
        <further-classification edition="200601120260312B">A47L11/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐洪亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, HONGLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請實施例涉及智慧家居技術領域，公開了一種清潔設備和清潔系統，清潔設備包括清潔設備主體、抓取件、功能調節模組和急停模組，清潔設備通過功能調節模組和急停模組的設置，通過功能調節模組可以調節清潔設備主體的作業模式，使得清潔設備主體的控制更加便捷，當清潔設備出現異常工作狀態，可以通過急停模組直接控制抓取件執行安全作業模式，以防止因清潔設備主體因搭載抓取件而引發危險。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application relates to the field of smart home technology and discloses a cleaning device and cleaning system. The cleaning device includes the main body of the cleaning device, a gripping component, a function adjustment module, and an emergency stop module. With the installation of the function adjustment module and emergency stop module, the operating mode of the cleaning device can be adjusted through the function adjustment module, making the control of the cleaning device more convenient. When the cleaning device encounters an abnormal working state, the gripping component can be directly controlled through the emergency stop module to execute a safe operating mode, preventing potential dangers caused by the gripping component mounted on the cleaning device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:清潔設備主體</p>
        <p type="p">1111:邊框</p>
        <p type="p">120:抓取件</p>
        <p type="p">130:功能調節模組</p>
        <p type="p">140:急停模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1381" publication-number="202625720">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625720</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133661</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法、基板處理裝置、程式及電腦記錄媒體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260309B">H10P54/90</main-classification>
        <further-classification edition="202601120260309B">H10P54/00</further-classification>
        <further-classification edition="202601120260309B">H10P74/20</further-classification>
        <further-classification edition="202601120260309B">H10P72/50</further-classification>
        <further-classification edition="202601120260309B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長田創</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSADA, SO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔光恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, KWANGEUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村洋介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, YOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下陽平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHITA, YOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>関泰士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKI, TAIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福永信貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUNAGA, NOBUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>酒井文也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAI, FUMIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種基板處理方法，於基板處理裝置中，將由第1基板與第2基板接合成的重合基板中之該第1基板的周緣部去除；該基板處理裝置，具有：基板固持部，將該重合基板固持；馬達，使該基板固持部旋轉；接觸構件；固持構件，將該接觸構件固持；以及水平移動機構，構成為可使該固持構件相對於該基板固持部沿水平方向移動；該基板處理方法，具有如下程序：藉由使該固持構件移動，而使該接觸構件，和固持在該基板固持部的該重合基板之接觸對象部接觸；在該接觸構件接觸到該接觸對象部的狀態下，以第1控制條件控制該接觸構件，並使該基板固持部旋轉第1旋轉量；以及以與該第1控制條件不同的第2控制條件控制該接觸構件，並使該基板固持部旋轉第2旋轉量；包含該第1旋轉量與該第2旋轉量之旋轉量的總和，較旋轉一周更大。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">MT1:邊緣修整</p>
        <p type="p">St101~St106:邊緣修整MT1所包含之步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1382" publication-number="202624954">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624954</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133685</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>分散式材料測試系統中的有效檔案管理</chinese-title>
        <english-title>ACTIVE FILE MANAGEMENT IN DISTRIBUTED MATERIAL TESTING SYSTEMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260305B">G06F8/71</main-classification>
        <further-classification edition="200601120260305B">G05B19/416</further-classification>
        <further-classification edition="201901120260305B">G06F16/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商伊利諾工具工程公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ILLINOIS TOOL WORKS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱薩　丹尼爾文森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAESAR, DANIEL VINCENT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼可　史考特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NICOL, SCOTT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>摩斯　傑森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORSE, JASON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述了分散式材料測試系統的實例，該等分散式材料測試系統允許具有更高級別及/或管理權限的使用者回退使用測試檔案（及/或其他檔案）的較舊（及/或過時）版本作為用於測試的「有效」檔案版本。在一些實例中，將具有較低級別權限的使用者限制為使用測試檔案的「有效」版本用於測試，以確保大多數使用者及/或材料測試系統使用相同的測試檔案版本。然而，一些使用者經授權使較舊的、過時的測試檔案版本成為「有效」測試檔案版本，例如，在當前有效測試檔案版本存在一些問題的情況下如此。透過此回退，在準備新測試檔案及/或解決先前有效測試檔案的問題時，測試可能夠以至少一些容量繼續。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described herein are examples of distributed material testing systems that allow users with higher level and/or administrative permissions to revert to use of an older (and/or obsolete) version of a test file (and/or other file) as the “active” file version for testing. In some examples, users with lower level permissions are restricted to using the “active” version of a test file for testing, so as to ensure that most users and/or material testing systems use the same test file version. However, some users are authorized to make an older, obsolete, test file version the “active” test file version in case, for example, there is some issue with the current active test file version. Through this reversion, testing may be able to continue in at least some capacity while a new test file is prepared and/or the issues with the prior active test file are resolved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">600c:第一檔案版本GUI</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1383" publication-number="202624621">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624621</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133729</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>散熱裝置</chinese-title>
        <english-title>HEAT DISSIPATION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260215B">F04D29/60</main-classification>
        <further-classification edition="200601120260215B">F04D29/00</further-classification>
        <further-classification edition="200601120260215B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞市宸精電子科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN CHENJING ELECTRONIC TECHNOLOGY CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林振華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, ZHENHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, NA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佳琦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JIAQI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種散熱裝置，包括外殼架、支撐件及至少一風扇。支撐件固定至外殼架，且包括導電線路及電性連接於導電線路的至少一導電區。至少一風扇中的每一者包括固定結構、相對固定結構轉動的輪轂與延伸自輪轂的多個扇葉，各風扇的固定結構固定於支撐件，固定結構包括與對應的導電區導電接觸的導通部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A heat dissipation device includes an outer housing, a support member, and at least one fan. The support member is fixed to the outer housing and includes a conductive circuit and at least one conductive area electrically connected to the conductive circuit. Each of the least one fan includes a fixed structure, a hub that rotates relative to the fixed structure, and blades extending from the hub. The fixed structure of each fan is fixed to the support member and includes a conductive portion conductively in contact with the corresponding conductive area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">A:區域</p>
        <p type="p">1:風扇</p>
        <p type="p">100:散熱裝置</p>
        <p type="p">11:扇葉</p>
        <p type="p">125:卡扣部</p>
        <p type="p">2:支撐件</p>
        <p type="p">211:卡位孔</p>
        <p type="p">22:導電線路</p>
        <p type="p">3:外殼架</p>
        <p type="p">4:理線結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1384" publication-number="202624357">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624357</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133733</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含有助黏劑層的層板與製造該層板的方法</chinese-title>
        <english-title>LAMINATE CONTAINING AN ADHESION PROMOTER LAYER AND METHOD OF MAKING THE LAMINATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08G77/18</main-classification>
        <further-classification edition="202601120260302B">H10P76/20</further-classification>
        <further-classification edition="201801120260302B">C09J7/20</further-classification>
        <further-classification edition="200601120260302B">B32B7/12</further-classification>
        <further-classification edition="200601120260302B">B32B27/08</further-classification>
        <further-classification edition="200601120260302B">G03F7/038</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANON KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAN, FEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉衛軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, WEIJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克洛恩　艾米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLOHN, AMY R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤俊樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, TOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種層板可包含基板、助黏劑層、與覆蓋層，其中助黏劑層可包括式(1)之矽烷化合物：&lt;img align="absmiddle" height="60px" width="155px" file="ed10012.JPG" alt="ed10012.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，其中X為C&lt;sub&gt;1~&lt;/sub&gt;C&lt;sub&gt;3&lt;/sub&gt;烷基，n為1~5，並且R&lt;sub&gt;1&lt;/sub&gt;與R&lt;sub&gt;2&lt;/sub&gt;係獨立地為烷基、或芳基、或烷氧基、或芳氧基。助黏劑層可藉由與基板形成共價鍵以及與覆蓋層形成共價鍵而提供覆蓋層對基板的強黏著性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A laminate can comprise a substrate, an adhesion promoter layer, and a coating layer, wherein the adhesion promoter layer may include a silane compound of formula (1): &lt;img align="absmiddle" height="67px" width="152px" file="ed10013.JPG" alt="ed10013.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; ,8 wherein X is C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;3&lt;/sub&gt;- alkyl, n is 1-5, and R&lt;sub&gt;1&lt;/sub&gt; and R&lt;sub&gt;2&lt;/sub&gt; are independently alkyl, or aryl, or alkoxy, or aryloxy. The adhesion promoter layer can provide strong adhesion of the coating layer to the substrate by forming covalent bonds with the substrate and covalent bonds with the coating layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:層板</p>
        <p type="p">12:基板</p>
        <p type="p">13:助黏劑層</p>
        <p type="p">14:覆蓋層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1385" publication-number="202625644">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625644</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133751</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發光二極體以及包含其之顯示裝置</chinese-title>
        <english-title>LIGHT EMITTING DIODE AND DISPLAY DEVICE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120250915B">H10H29/34</main-classification>
        <further-classification edition="202501120250915B">H10H20/819</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權奎吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, KYU-OH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林周相</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RHIM, JUSANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊起龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, KI-YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李承峻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEUNG-JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供了一種發光二極體和包含此發光二極體的顯示裝置。這種顯示裝置可包含：基板；基板上的第一子像素、一第二子像素及一第三子像素；設置於第一子像素中並發出第一色光之第一發光二極體、設置於第二子像素中並發出第二色光之第二發光二極體，及設置於第三子像素中並發出第三色光之第三發光二極體，其中第一發光二極體具有第一底部圖案，第二發光二極體具有第二底部圖案，且第三發光二極體具有第三底部圖案，並且其中第一底部圖案、第二底部圖案及第三底部圖案被形成為彼此不同以具有專屬性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a light emitting diode and a display device including the same. The display device may include: a substrate; first, second and third subpixels on the substrate; and a first light emitting diode in the first subpixel and emitting a first colored light, a second light emitting diode in the second subpixel and emitting a second colored light, and a third light emitting diode in the third subpixel and emitting a third colored light, wherein the first light emitting diode may have a first bottom pattern, the second light emitting diode may have a second bottom pattern, and the third light emitting diode may have a third bottom pattern, and wherein the first bottom pattern, the second bottom pattern and the third bottom pattern may be formed to be different from each other to have an exclusivity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">162:第一半導體層</p>
        <p type="p">164:主動層</p>
        <p type="p">166:第二半導體層</p>
        <p type="p">168:第一電極</p>
        <p type="p">170:第二電極</p>
        <p type="p">180:第一底部圖案</p>
        <p type="p">182:第二底部圖案</p>
        <p type="p">184:第三底部圖案</p>
        <p type="p">210:組裝基板</p>
        <p type="p">212:第一組裝圖案</p>
        <p type="p">214:第二組裝圖案</p>
        <p type="p">216:第三組裝圖案</p>
        <p type="p">Del1:第一發光二極體</p>
        <p type="p">Del2:第二發光二極體</p>
        <p type="p">Del3:第三發光二極體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1386" publication-number="202624883">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624883</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133768</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>儲存盒、外部盒、儲存存放器、雙盒</chinese-title>
        <english-title>STORAGE POD, OUTER POD, STORAGE STOCKER, DUAL POD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260306B">G03F1/66</main-classification>
        <further-classification edition="201201120260306B">G03F1/82</further-classification>
        <further-classification edition="200601120260306B">G03F7/00</further-classification>
        <further-classification edition="202601120260306B">H10P72/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商布魯克斯自動化(德國)有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROOKS AUTOMATION (GERMANY) GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施密特　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHMIDT, ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施韋茨　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHWETZ, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅爾　卡爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEIER, KARL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬納　伊夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENNER, YVES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種儲存盒(110)，其用於儲存一單個倍縮光罩(200)，特別是一EUV倍縮光罩，該儲存盒(110)包含一基板(112)及界定一內部空間(111)之一蓋體(114)，該內部空間(111)係組配來及適於固持該單個倍縮光罩，該儲存盒(110)進一步包含用於提供一吹掃氣體(210)至該內部空間(111)之至少一個氣體入口介面(120)，其中進入該內部空間(111)中的該吹掃氣體(210)之一氣體流係獨立於該儲存盒(110)的周圍環境。此外，揭露用於收容此一儲存盒(110)的一外部盒(300)及用於儲存具有或不具有此等外部盒(300)之儲存盒(110)的一儲存存放器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a storage pod (110) for storage of a single reticle (200), especially an EUV reticle, the storage pod (110) comprising a base plate (112) and a cover (114) defining an interior space (111) the interior space (111) being configured and adapted to hold said single reticle, the storage pod (110) further comprising at least one gas inlet interface (120) for providing a purge gas (210) to the interior space (111), wherein a gas flow of the purge gas (210) into the interior space (111) is independent from an atmosphere surrounding the storage pod (110). Further, an outer pod (300) for containing such a storage pod (110) and a storage stocker for storing storage pods (110) with or without such outer pods (300) are disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:儲存盒</p>
        <p type="p">111:內部空間</p>
        <p type="p">112:基板</p>
        <p type="p">114:蓋體</p>
        <p type="p">115:處置構件</p>
        <p type="p">116:閂鎖機構，機構</p>
        <p type="p">120:氣體入口介面，入口介面</p>
        <p type="p">122:壓力埠</p>
        <p type="p">124:氣體入口連接線路</p>
        <p type="p">126:入口孔</p>
        <p type="p">130:氣體出口介面，專用出口介面</p>
        <p type="p">132:抽吸埠</p>
        <p type="p">134:出口連接線路</p>
        <p type="p">136:出口孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1387" publication-number="202624745">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624745</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133771</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>皮膚內部纖維的形狀推測方法</chinese-title>
        <english-title>METHODS FOR ESTIMATING THE SHAPE OF THE INTERNAL FIBERS WITHIN THE SKIN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">G01N33/50</main-classification>
        <further-classification edition="200601120260129B">G01N33/48</further-classification>
        <further-classification edition="200601120260129B">G01N33/53</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商芳珂股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANCL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東崎健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOHGASAKI, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上麻佑子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMI, MAYUKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大石奈帆子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OISHI, NAOKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係提供一種簡便地推測皮膚內部纖維的形狀之方法。作為本發明之解決手段為提供一種推測方法，其係將從臉的拍攝影像所得之臉形狀參數作為指標，並推測皮膚內部纖維的纖維形狀指標。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the present invention is to provide a method for estimating the shape of the internal fibers within the skin. As a means for achieving this object, the present invention provides an estimation method that uses facial shape parameters obtained from captured facial images as indicators to estimate the shape of the internal fibers within the skin.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1388" publication-number="202625827">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625827</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133835</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置中用於高電壓之電路</chinese-title>
        <english-title>CIRCUIT FOR HIGH VOLTAGE IN SEMICONDUCTOR DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260309B">H10W42/80</main-classification>
        <further-classification edition="202601120260309B">H10W10/10</further-classification>
        <further-classification edition="202601120260309B">H10W20/43</further-classification>
        <further-classification edition="202601120260309B">H10D88/00</further-classification>
        <further-classification edition="202501120260309B">H10D62/10</further-classification>
        <further-classification edition="202501120260309B">H10D64/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商萬國商業機器公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERNATIONAL BUSINESS MACHINES CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　保振</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, BAOZHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荻野淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGINO, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安哥亞　馬修　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANGYAL, MATTHEW STEPHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章典</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊名宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體裝置，其包括一高電壓電極。一高電壓柱連接至該高電壓電極。該高電壓柱包括堆疊式金屬結構，該等堆疊式金屬結構經層疊以提供一豎直導線，該豎直導線具有與該等堆疊式金屬結構之一堆疊方向實質上垂直的一縱向軸線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a high voltage electrode. A high voltage column is connected to the high voltage electrode. The high voltage column includes stacked metal structures layered to provide a vertical wire having a longitudinal axis substantially perpendicular with a stacking direction of the stacked metal structures.</p>
      </isu-abst>
      <representative-img>
        <p type="p">104:高電壓柱</p>
        <p type="p">106:通孔</p>
        <p type="p">108:金屬線</p>
        <p type="p">112:第二金屬層級</p>
        <p type="p">114:第四金屬層級</p>
        <p type="p">116:第六金屬層級</p>
        <p type="p">118:第八金屬層級</p>
        <p type="p">140:區</p>
        <p type="p">142:金屬線</p>
        <p type="p">143:金屬線</p>
        <p type="p">144:通孔</p>
        <p type="p">148:層級間間隔</p>
        <p type="p">150:金屬結構</p>
        <p type="p">152:介電柱</p>
        <p type="p">d:高電壓介電距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1389" publication-number="202623747">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623747</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133857</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔機器人的控制方法及裝置、計算機可讀儲存介質及電子設備</chinese-title>
        <english-title>METHOD AND APPARATUS FOR CONTROLLING CLEANING ROBOT, COMPUTER-READABLE STORAGE MEDIUM, AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">A47L11/24</main-classification>
        <further-classification edition="200601120260312B">A47L11/32</further-classification>
        <further-classification edition="200601120260312B">A47L11/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國商北京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>罗龙跃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, LONGYUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金国军</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, GUOJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>张振东</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, ZHENDONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種清潔機器人的控制方法、清潔機器人的控制裝置、計算機可讀儲存介質及電子設備，所述清潔機器人包括可升降清潔器，可升降清潔器具有第一狀態和第二狀態，所述可升降清潔器在所述第一狀態下與地面的距離小於在所述第二狀態下與地面的距離；方法包括：響應於接收到非清潔移動指令和/或檢測到工作環境中包括預設目標時，控制所述清潔機器人將所述可升降清潔器從第一狀態切換至第二狀態；在所述可升降清潔器處於所述第二狀態時，控制所述清潔機器人在所述工作環境中進行移動。此方法可以準確、靈活的控制清潔機器人，提高清潔機器人的清潔效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a method and an apparatus for controlling a cleaning robot, a computer-readable storage medium, and an electronic device. The cleaning robot comprises a liftable cleaner, and the liftable cleaner has a first state and a second state. A distance between the liftable cleaner and a ground in a first state is less than in a second state. The method includes: in response to receiving a non-cleaning movement instruction and/or detecting a preset target in a work environment, controlling the cleaning robot to switch the liftable cleaner from the first state to the second state. When the liftable cleaner is in the second state, controlling the cleaning robot to move in the working environment. The method can accurately and flexibly control the cleaning robot, and improve the cleaning efficiency of the cleaning robot.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S310,S320:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1390" publication-number="202623924">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623924</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133876</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>銅微粒子分散體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260302B">B22F1/052</main-classification>
        <further-classification edition="202201120260302B">B22F1/054</further-classification>
        <further-classification edition="202201120260302B">B22F1/0545</further-classification>
        <further-classification edition="202201120260302B">B22F1/107</further-classification>
        <further-classification edition="200601120260302B">C09J1/00</further-classification>
        <further-classification edition="200601120260302B">C09J11/08</further-classification>
        <further-classification edition="200601120260302B">C09J9/02</further-classification>
        <further-classification edition="200601120260302B">H01B1/00</further-classification>
        <further-classification edition="200601120260302B">H01B1/22</further-classification>
        <further-classification edition="200601120260302B">H01R11/01</further-classification>
        <further-classification edition="200601120260302B">H01R43/00</further-classification>
        <further-classification edition="202601120260302B">H05K3/32</further-classification>
        <further-classification edition="202601120260302B">H10W72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商花王股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福田泰紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUDA, TAIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稲家修一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INAYA, SHUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中西亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANISHI, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明於一態樣中，係關於一種銅微粒子分散體。銅微粒子分散體係包含銅微粒子A及分散介質C者。該分散介質C之含量為3質量%以上且40質量%以下，該分散介質C包含沸點為200℃以上且270℃以下之分散介質C1、及沸點超過270℃之分散介質C2。該分散介質C1相對於該分散介質C2之質量比C1/C2超過1。該分散介質C中之該分散介質C2之含量為10質量%以上且48質量%以下。銅微粒子A較佳為選自銅奈米粒子A1及銅微米粒子A2中之至少1種。銅奈米粒子A1較佳為使用分散劑B分散而成者。銅奈米粒子A1之平均粒徑較佳為105 nm以上且270 nm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1391" publication-number="202624885">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624885</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133878</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法及基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260302B">G03F1/84</main-classification>
        <further-classification edition="201201120260302B">G03F1/72</further-classification>
        <further-classification edition="200601120260302B">G03F7/26</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="200601120260302B">G05G1/24</further-classification>
        <further-classification edition="202601120260302B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢崎晃平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAZAKI, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達文多爾發　阿諾　艾倫　吉恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAUENDORFFER, ARNAUD ALAIN JEAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土橋和也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOBASHI, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉田圭佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIDA, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>志村悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMURA, SATORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於令由金屬氧化物光阻所形成的圖案為吾人所期望者。為了達成上述目的，本發明之基板處理方法，包含以下步驟：將由金屬氧化物光阻所構成同時在曝光後顯影而形成為圖案的光阻膜形成於基板，並對該基板實行用以令該光阻膜所含有的碳氫化合物減少的減少處理；以及對實行過該減少處理的該光阻膜，實行用以令粗糙度降低的處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S8:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1392" publication-number="202624079">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624079</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133879</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>便於存取電池的整合式自行車控制</chinese-title>
        <english-title>INTEGRATED BICYCLE CONTROL WITH EASY ACCESS TO THE BATTERY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">B62M25/08</main-classification>
        <further-classification edition="202101120260306B">H01M50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義大利商坎帕克諾羅公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAMPAGNOLO S.R.L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>明托　馬可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINTO, MARCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">整合式控制包括：&lt;br/&gt;  -    一控制主體(11)，&lt;br/&gt;  -    該控制主體(11)之一後抵接區(12)，該後抵接區(12)意欲在該控制安裝在該自行車之一手把上時與該手把接觸，&lt;br/&gt;  -    一制動桿(18)，該制動桿(18)根據與該後抵接區(12)間隔開之橫向於該控制主體(11)之一樞軸線(X)樞接至該控制主體(11)，&lt;br/&gt;  -    一致動器(35)，該致動器(35)用於驅動該換檔機構，&lt;br/&gt;  -    一腔(20)，該腔(20)形成在該控制主體(11)內部，&lt;br/&gt;  -    一換檔機構驅動電子板(32)，該換檔機構驅動電子板(32)裝納在該腔(20)內部、在一第一座(31)中，&lt;br/&gt;  -    一電池(53)，該電池(53)用於給該電子板(32)供電，裝納在該腔(20)內部，&lt;br/&gt;  -    該腔(20)之一第一開口(30)，對該電子板(32)之存取透過該第一開口是可能的，&lt;br/&gt;  -    該腔(20)之一第二開口(50)，該第二開口(50)與該第一開口(30)不同且分開，對該電池(53)之存取透過該第二開口是可能的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The integrated control comprises:&lt;br/&gt; - a control body (11),&lt;br/&gt; - a rear abutment zone (12) of the control body (11), intended to be in contact with a handlebar of the bicycle when the control is mounted on the handlebar,&lt;br/&gt; - a brake lever (18) pivoted to the control body (11) according to a pivot axis (X) transverse to the control body (11), spaced from the rear abutment zone (12),&lt;br/&gt; - an actuator (35) for driving the gearshift,&lt;br/&gt; - a cavity (20) formed inside the control body (11),&lt;br/&gt; - a gearshift drive electronic board (32), housed inside the cavity (20) in a first seat (31),&lt;br/&gt; - a battery (53) for powering the electronic board (32), housed inside the cavity (20),&lt;br/&gt; - a first opening (30) of the cavity (20), through which access to the electronic board (32) is possible,&lt;br/&gt; - a second opening (50) of the cavity (20), distinct and separate from the first opening (30), through which access to the battery (53) is possible.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:控制主體</p>
        <p type="p">13:內側面</p>
        <p type="p">15:下側</p>
        <p type="p">16:上側</p>
        <p type="p">19:塗層護套、護套</p>
        <p type="p">20:腔</p>
        <p type="p">30:第一開口</p>
        <p type="p">31:第一座、座</p>
        <p type="p">34:第一板、板</p>
        <p type="p">44:孔</p>
        <p type="p">50:第二開口</p>
        <p type="p">51:第二座</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1393" publication-number="202623966">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623966</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133880</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子零件拆卸工具</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">B25B27/14</main-classification>
        <further-classification edition="200601120260306B">H05K7/12</further-classification>
        <further-classification edition="200601120260306B">H01R13/629</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商古河電氣工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUKAWA ELECTRIC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>内村泰博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UCHIMURA, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤裕士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青木博史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOKI, HIROFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種電子零件拆卸工具，能夠將被安裝於已設置在基板上的插槽中的板狀的電子零件，容易地從插槽拆卸。&lt;br/&gt;      一種電子零件拆卸工具100，用於將被安裝於已設置在基板10上的插槽20中的板狀的記憶體模組30拆卸時，該電子零件拆卸工具100，具有：拆卸工具本體110；一對臂120，被設置在拆卸工具本體110上，將卡合部22a與已被插入溝21a中的記憶體模組30卡合的狀態之一對桿22的各者，往解除卡合部22a與記憶體模組30的卡合的方向進行操作；及，保持部140，被設置在拆卸工具本體110上，將藉由一對臂120而被解除了卡合部22a的卡合之記憶體模組30加以保持。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板</p>
        <p type="p">20:插槽</p>
        <p type="p">21:插槽本體</p>
        <p type="p">22:桿</p>
        <p type="p">22a:卡合部</p>
        <p type="p">30:記憶體模組</p>
        <p type="p">31:基板</p>
        <p type="p">32:記憶體</p>
        <p type="p">40:冷卻裝置</p>
        <p type="p">41:冷卻水流通管</p>
        <p type="p">42:流入側歧管</p>
        <p type="p">43:流出側歧管</p>
        <p type="p">100:電子零件拆卸工具</p>
        <p type="p">110:拆卸工具本體</p>
        <p type="p">111:把持部</p>
        <p type="p">112:收容部</p>
        <p type="p">120:臂</p>
        <p type="p">121:支持部</p>
        <p type="p">122:抵接部</p>
        <p type="p">130:姿勢保持構件</p>
        <p type="p">140:保持部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1394" publication-number="202624804">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624804</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133987</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於電子封裝中的矽光子橋接器之系統與方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR A SILICON PHOTONIC BRIDGE IN AN ELECTRONIC PACKAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">G02B6/12</main-classification>
        <further-classification edition="200601120260305B">G02B6/255</further-classification>
        <further-classification edition="200601120260305B">G02B6/26</further-classification>
        <further-classification edition="202601120260305B">H10P74/20</further-classification>
        <further-classification edition="202601120260305B">H10W70/60</further-classification>
        <further-classification edition="202601120260305B">H10W72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商覓可思科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIXX TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙維茲　瑞貝卡　凱拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHAEVITZ, REBECCA KAYLA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉古拉曼　維維克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAGHURAMAN, VIVEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明可提供一種矽光子橋接器及製造一積體電路半導體封裝之方法。系統可包含由有機及無機材料之一組合形成之一中介層。該矽光子橋接器可嵌入在該中介層內。該矽光子橋接器可包含經組態以處理電信號並驅動該光子IC (PIC)之一電積體電路(IC)、及經組態以處理光學信號之一PIC、經組態以將該PIC與光纖介接之一光學連接器元件及經組態以在整合在該中介板之頂部上之一ASIC與該EIC之間介接之一矽橋接器。一矽光子橋接器可在電學上及光學上經實現以將來自該中介板上方之該ASIC之該電信號轉換成進入光纖之一光學信號，且反之亦然。穿矽導通孔(Through-silicon vias；TSV)可延伸穿過該光學引擎。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A silicon photonic bridge and method of manufacturing an integrated circuit semiconductor package may be provided. The system may include an interposer layer formed from a combination of organic and inorganic materials. The silicon photonic bridge may be embedded within the interposer layer. The silicon photonic bridge may include an electrical integrated circuit (IC) configured to process electrical signals and drive the photonic IC (PIC), and a PIC configured to process optical signals, an optical connector element(s) configured to interface the PIC with fiber and a silicon bridge configured to interface between an ASIC integrated on top of the interposer with the EIC. A silicon photonic bridge may be electrically and optically enabled to convert the electrical signal from the ASIC above the interposer to an optical signal going into fiber, and vice versa. Through-silicon vias (TSVs) may extend through the optical engine.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:光子電路</p>
        <p type="p">104:光學連接</p>
        <p type="p">106:電積體電路(EIC)</p>
        <p type="p">110:嵌入式矽橋接器</p>
        <p type="p">200:半導體封裝</p>
        <p type="p">208:ASIC</p>
        <p type="p">220:基板</p>
        <p type="p">230:中介層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1395" publication-number="202625361">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625361</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133992</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於電機閉環自校準的校準系統及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">H02P23/14</main-classification>
        <further-classification edition="201601120260312B">H02K11/215</further-classification>
        <further-classification edition="201601120260312B">H02K11/33</further-classification>
        <further-classification edition="200601120260312B">G01B21/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商泉州昆泰芯微電子科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUANZHOU KTSENSE MICROELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錢振煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIAN, ZHENHUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張開新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, KAIXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉大權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, DAQUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及編碼器領域，特別是涉及用於電機閉環自校準的校準系統及方法，該系統包括角度傳感器和控制器，角度傳感器用於檢測電機的旋轉角度，其中，角度傳感器包含角度修正模組，用於根據角度修正參數對旋轉角度進行修正後輸出實時角度，且角度修正模組具有角度修正參數自校準功能，以根據預設校準模式對角度修正參數進行自校準；控制器被配置為接收實時角度，根據實時角度生成驅動信號，並將驅動信號發送到驅動器，驅動信號用於控制驅動器調整至少一個物理參數以調整電機的轉動。本發明不需要暫停電機運行，更不需要加裝或拆除參考編碼器、上位機等額外設備等過程，就能夠在電機閉環控制過程的正常工作狀態中啟動並完成角度修正參數的自校準。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1396" publication-number="202624744">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624744</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133997</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水質之測定裝置、水處理系統、離子交換樹脂之清洗系統及水質測定方法</chinese-title>
        <english-title>WATER QUALITY MEASUREMENT DEVICE, WATER TREATMENT SYSTEM, WASHING SYSTEM FOR ION EXCHANGE RESIN, AND WATER QUALITY MEASUREMENT METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">G01N33/18</main-classification>
        <further-classification edition="200601120260303B">G01N21/27</further-classification>
        <further-classification edition="201401120260303B">G01N21/3563</further-classification>
        <further-classification edition="202301120260303B">C02F9/00</further-classification>
        <further-classification edition="202301120260303B">C02F1/42</further-classification>
        <further-classification edition="202301120260303B">C02F1/32</further-classification>
        <further-classification edition="202301120260303B">C02F1/44</further-classification>
        <further-classification edition="200601320260303B">C02F103/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商奧璐佳瑙股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORGANO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川島友里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASHIMA, YURI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>市原史貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ICHIHARA, FUMITAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的係適當地管理流過水處理系統等之測定對象水包含的非揮發性溶解物濃度。  &lt;br/&gt;進行測定對象水之水質測定的測定裝置5具有：蒸發部52，其使測定對象水蒸發以形成殘留粒子；及量測部53，其量測殘留粒子之個數。水處理系統1具有導入流過水處理系統1之水作為測定對象水，進行該測定對象水之水質測定的測定裝置5。離子交換樹脂之清洗系統101具有：容器102，其清洗離子交換樹脂103；清洗水供給配管L102，其供給清洗水至容器102；排出配管L104，其排出清洗排水；及測定裝置5，其連接於排出配管L104，進行清洗排水之水質測定。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the invention is to appropriately manage the concentration of nonvolatile solutes contained in a water to be measured flowing through a water treatment system or the like. &lt;br/&gt;A measurement device 5 which performs water quality measurement of a water to be measured has an evaporation section 52 which forms residue particles by evaporating the water to be measured, and a measurement section 53 which measures the number of residue particles. A water treatment system 1 has a measurement device 5 into which a water flowing through the water treatment system 1 is introduced as a water to be measured, and which conducts a water quality measurement of the water to be measured. An ion exchange resin washing system 101 has a container 102 in which an ion exchange resin 103 is washed, a washing water supply pipe L102 which supplies a washing water to the container 102, a discharge pipe L104 which discharges washing wastewater, and a measurement device 5 which is connected to the discharge pipe L104 and conducts a water quality measurement of the washing wastewater.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:水處理系統</p>
        <p type="p">2:1次純水系統</p>
        <p type="p">3:2次純水系統；子系統</p>
        <p type="p">4:使用點</p>
        <p type="p">5:測定裝置</p>
        <p type="p">31:純水槽</p>
        <p type="p">32:純水供給泵</p>
        <p type="p">33:紫外線氧化裝置</p>
        <p type="p">34:過氧化氫去除裝置</p>
        <p type="p">35:第1離子交換裝置</p>
        <p type="p">36:膜脫氣裝置</p>
        <p type="p">37:增壓泵</p>
        <p type="p">38:第2離子交換裝置</p>
        <p type="p">39:超過濾膜裝置</p>
        <p type="p">51:噴霧部</p>
        <p type="p">52:蒸發部</p>
        <p type="p">53:量測部</p>
        <p type="p">54:判定部</p>
        <p type="p">D:被處理水之流通方向</p>
        <p type="p">L1:母管</p>
        <p type="p">L2:返回管線</p>
        <p type="p">L3:取樣管線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1397" publication-number="202625520">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625520</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134002</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>修復裝置、缺陷處理系統、缺陷處理裝置以及修復方法</chinese-title>
        <english-title>REPAIR APPARATUS, DEFECT TREATMENT SYSTEM, DEFECT TREATMENT APPARATUS, AND REPAIR METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">H05K3/22</main-classification>
        <further-classification edition="201401120260309B">B23K26/36</further-classification>
        <further-classification edition="200601120260309B">G01N21/88</further-classification>
        <further-classification edition="201801120260309B">G06F9/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木瀬一夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINOSE, KAZUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永田泰史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGATA, YASUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">修復裝置為用以修補形成於基板9的上表面91上之圖案93的缺損部94之裝置。基板保持部係保持於上表面91上形成有圖案93的基板9。施予部32係對圖案93的缺損部94施予液滴狀的導電性漿料。硬化部33係加熱導電性漿料並使導電性漿料乾燥，藉此使導電性漿料硬化。壓縮部34係一邊加熱經過硬化的導電性漿料一邊朝向基板9按壓。藉此，能使以填補缺損部94之方式所設置的修補部中的金屬的密度增大。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The repair apparatus is an apparatus for repairing a defective portion 94 of a pattern 93 formed on an upper surface 91 of a substrate 9. The substrate holding part holds a substrate 9 on which a pattern 93 is formed on the upper surface 91. The applying part 32 applies droplets of conductive paste to the defective portion 94 of the pattern 93. The solidifying part 33 solidifies the conductive paste by heating and drying it. The compressing part 34 presses the solidified conductive paste toward the substrate 9 while heating it. This increases the density of the metal in the repair part provided to fill the defective portio 94.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:修復頭</p>
        <p type="p">9:基板</p>
        <p type="p">31:頭罩</p>
        <p type="p">32:施予部</p>
        <p type="p">33:硬化部</p>
        <p type="p">35:去除部</p>
        <p type="p">91:(基板的)上表面</p>
        <p type="p">93:圖案</p>
        <p type="p">94:缺損部</p>
        <p type="p">95:基材</p>
        <p type="p">321:分注器</p>
        <p type="p">331:氣體噴出部</p>
        <p type="p">341:壓縮件</p>
        <p type="p">342:按壓機構</p>
        <p type="p">351:雷射光源</p>
        <p type="p">352:攝像器件</p>
        <p type="p">353:光學元件</p>
        <p type="p">931:圖案要素</p>
        <p type="p">J1:光軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1398" publication-number="202624271">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624271</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134064</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於條件性活化受體訊息傳導之標的結合分子之組合</chinese-title>
        <english-title>COMBINATION OF TARGET-BINDING MOLECULES FOR CONDITIONALLY ACTIVATED RECEPTOR SIGNALING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">C07K16/28</main-classification>
        <further-classification edition="200601120260306B">A61K39/395</further-classification>
        <further-classification edition="200601120260306B">A61P35/00</further-classification>
        <further-classification edition="200601120260306B">A61P37/00</further-classification>
        <further-classification edition="200601120260306B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商中外製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUGAI SEIYAKU KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溝呂木暁彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZOROKI, AKIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫　揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黄　思亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NG, SEE LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種標的結合分子之組合，包括一第一標的結合分子，第一標的結合分子包括至少兩個結合結構域[S1]，每個結合結構域[S1]具有與一支架蛋白結合之能力，並且包括至少一個結合結構域[R1]，結合結構域[R1]具有與一第一受體蛋白結合之能力，以及包括一第二標的結合分子，第二標的結合分子包括至少一個結合結構域[S2]，結合結構域[S2]具有與一支架蛋白結合之能力，並且包括至少一個結合結構域[R2]，結合結構域[R2]具有與一第二受體蛋白結合之能力。標的結合分子之組合具有在與支架蛋白結合下條件性誘導一受體複合物的受體訊息傳導之能力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a combination of target-binding molecules comprising a first target-binding molecule, comprising at least two binding domains [S1] that are each capable of binding to a scaffold protein and at least one binding domain [R1] that is capable of binding to a first receptor protein, and a second target-binding molecule, comprising at least one binding domain [S2] that is capable of binding to the scaffold protein and at least one binding domain [R2] that is capable of binding to a second receptor protein. The combination of target-binding molecules is capable of inducing receptor signaling of a receptor complex, conditioned upon binding to a scaffold protein.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1399" publication-number="202624374">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624374</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134073</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含非PFAS彈性體組合物製品及其製備方法</chinese-title>
        <english-title>ARTICLES COMPRISING NON-PFAS ELASTOMER COMPOSITIONS AND THE METHODS OF PREPARING SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260310B">C08K3/013</main-classification>
        <further-classification edition="200601120260310B">C08K5/375</further-classification>
        <further-classification edition="200601120260310B">C09J109/00</further-classification>
        <further-classification edition="200601120260310B">C08F291/02</further-classification>
        <further-classification edition="200601120260310B">C08L9/08</further-classification>
        <further-classification edition="200601120260310B">C08L23/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商格林威德科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GREENE, TWEED TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>派瑞亞沙米　穆克坎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PERIYASAMY, MOOKKAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坎貝爾　羅納德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAMPBELL, RONALD R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆巴席爾　ＡＡ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUBASSHIR, AA.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BD</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥克格林　文森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCGLYNN, VINCENT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡清福</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馭理</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">製品可至少包含非PFAS彈性體及添加劑。非PFAS彈性體可包含聚丙烯酸酯彈性體（ACM）、聚乙烯丙烯酸酯彈性體（AEM）、乙烯丙烯二烯單體 （EPDM）彈性體、乙烯丙烯單體（EPM）、丁腈橡膠（NBR）和氫化丁腈橡膠（HNBR）彈性體中的至少一種。在150°C的6小時遠程NF&lt;sub&gt;3&lt;/sub&gt;電漿曝露下，非PFAS彈性體具有的重量變化可小於或等於約2%。添加劑可包含填料，填料包含碳黑、碳化矽、二氧化矽、硫酸鋇、碳、黏土、滑石粉、金屬填料、金屬氮化物、及/或有機填料中的至少一種。有機填料可包含聚醚醚酮（PEEK）、聚芳醚酮（PAEK）、或尼龍。非PFAS彈性體可具有約25%至約99%的重量百分比。添加劑的重量百分比約為1%至67%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Articles may include at least non-PFAS elastomers and additives. The non-PFAS elastomers may include at least one of polyacrylate elastomer (ACM), polyethylene acrylate elastomer (AEM), ethylene propylene diene monomers (EPDM) elastomer, ethylene propylene monomers (EPM), nitrile butadiene rubbers (NBR) and hydrogenated nitrile butadiene rubbers (HNBR) elastomer. Under a six-hour remote NF&lt;sub&gt;3&lt;/sub&gt; plasma exposure at 150°C, the non-PFAS elastomers may have a weight change less than or equal to about 2%. The additives may include fillers, which include at least one of carbon black, silicon carbide, silica, barium sulfate, carbon, clay, talc, metallic fillers, metallic nitrides, and/or organic fillers. The organic fillers may include polyether ether ketone (PEEK), polyaryl ether ketone (PAEK), or nylon. The non-PFAS elastomer may have a weight percentage from about 25% to about 99%. The additives have a weight percentage from about 1% to about 67%.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100、102、104、106、108、110、112、114、116、118、120、122、124、126:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1400" publication-number="202624182">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624182</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134094</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>圖案形成方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07C43/215</main-classification>
        <further-classification edition="200601120260302B">C07C69/22</further-classification>
        <further-classification edition="200601120260302B">C07C69/90</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/038</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人山口大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大和田伸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OOWADA, SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浅子竜一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAKO, RYUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村松誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAMATSU, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鬼村謙二郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONIMURA, KENJIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠以更高之自由度形成圖案之技術。  &lt;br/&gt;本發明之圖案形成方法包括：成膜工序，其係藉由使包含二乙炔衍生物之物質附著於基板而於基板形成包含二乙炔衍生物之物質之膜；聚合工序，其係藉由於包含二乙炔衍生物之物質之膜之至少一部分引起二乙炔衍生物之聚合反應而於基板生成二乙炔衍生物之聚合物；以及去除工序，其係藉由去除形成於基板之包含二乙炔衍生物之物質之膜而於基板形成二乙炔衍生物之聚合物之圖案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S101~S104:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1401" publication-number="202625521">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625521</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134100</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>通過印刷電路板核心之高密度各向異性導電基板(ASC)</chinese-title>
        <english-title>HIGH DENSITY ANISOTROPIC CONDUCTIVE SUBSTRATE (ASC) VIA PRINTED CIRCUIT BOARD CORE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">H05K3/36</main-classification>
        <further-classification edition="200601120260306B">H01R43/00</further-classification>
        <further-classification edition="202601120260306B">H10W74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商ＢＡＥ系統資訊及電子系統整合公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>摩爾曼　雅各Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAUERMANN, JACOB R</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威考夫　納旦尼爾Ｐ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WYCKOFF, NATHANIEL P</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於印刷電路板(PCB)封裝體的通用基板。該通用基板包括：一第一端及與該第一端相對的一第二端；複數個導體，其位於該第一端與該第二端之間；以及一非導電基質。該複數個導體具有一第一連接端、與該第一連接端相對的一第二連接端及限定在該第一連接端與該第二連接端之間的複數條導電路徑。該非導電基質圍繞該複數個導體且配置成沿著垂直於該複數條路徑的一軸線使該複數個導體中的每個導體彼此隔離。該通用基板亦包括限定在該第一連接端與該第二連接端之間的至少一個非線性部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A universal substrate for a printed circuit board (PCB) package. The universal substrate includes a first end and a second end opposite to the first end, a plurality of conductors located between the first end and the second end, and a nonconductive matrix. The plurality of conductors has a first connection end, a second connection end opposite to the first connection end, and a plurality of conductive pathways defined between the first connection end and the second connection end. The nonconductive matrix surrounds the plurality of conductors and configured to isolate each conductor of the plurality of conductors from one another along an axis that is perpendicular to the plurality of pathways. The universal substrate also includes at least one non-linear section defined between the first connection end and the second connection end.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1402" publication-number="202624388">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624388</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134109</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性元件、印刷線路板及印刷線路板之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260313B">C08L23/0869</main-classification>
        <further-classification edition="200601120260313B">C08L63/02</further-classification>
        <further-classification edition="200601120260313B">G03F7/028</further-classification>
        <further-classification edition="200601120260313B">C08K3/22</further-classification>
        <further-classification edition="200601120260313B">C08K3/36</further-classification>
        <further-classification edition="200601120260313B">C09D5/08</further-classification>
        <further-classification edition="200601120260313B">B32B27/30</further-classification>
        <further-classification edition="200601120260313B">H05K3/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部宏平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雪岡諒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUKIOKA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下直輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHITA, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之一種永久抗蝕劑用之感光性元件，其具備支撐膜和形成於支撐膜上之感光層，感光層含有（A）酸改質含乙烯基樹脂、（B）光聚合性化合物、（C）光聚合起始劑及（D）無機填料，（D）無機填料包含折射率為1.500～1.700的無機填料，感光層的厚度為5～35μm，感光層對波長380nm的光之吸光度為0.40～1.00。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:感光性元件</p>
        <p type="p">10:支撐膜</p>
        <p type="p">20:感光層</p>
        <p type="p">30:保護膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1403" publication-number="202624204">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624204</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134150</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鎓鹽化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07C317/04</main-classification>
        <further-classification edition="200601120260302B">C07D277/16</further-classification>
        <further-classification edition="200601120260302B">C07D277/74</further-classification>
        <further-classification edition="200601120260302B">C07D285/15</further-classification>
        <further-classification edition="200601120260302B">C07D417/12</further-classification>
        <further-classification edition="200601120260302B">C07F5/00</further-classification>
        <further-classification edition="200601120260302B">C07F5/02</further-classification>
        <further-classification edition="200601120260302B">C07F7/10</further-classification>
        <further-classification edition="200601120260302B">C07F9/54</further-classification>
        <further-classification edition="200601120260302B">C08K5/47</further-classification>
        <further-classification edition="200601120260302B">C09K3/00</further-classification>
        <further-classification edition="200601120260302B">C08F4/00</further-classification>
        <further-classification edition="200601120260302B">C09K3/10</further-classification>
        <further-classification edition="200601120260302B">C09J11/06</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/029</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三新化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANSHIN CHEMICAL INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中所亮輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAJO, RYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡本智美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMOTO, TOMOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寺田直樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TERADA, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案之目的在於提供一種溶劑適合性優異，且保存穩定性優異的鎓鹽化合物。本案係有關於一種通式(1)所表示的鎓鹽化合物：  &lt;br/&gt;&lt;img align="absmiddle" height="137px" width="368px" file="ed10105.JPG" alt="ed10105.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式中，  &lt;br/&gt;R&lt;sup&gt;A&lt;/sup&gt;表示亦可具有取代基的C1~15烷基等。  &lt;br/&gt;R&lt;sup&gt;4&lt;/sup&gt;表示氫原子等。  &lt;br/&gt;R&lt;sup&gt;5&lt;/sup&gt;及R&lt;sup&gt;6&lt;/sup&gt;係相同或不同，表示氫原子等；  &lt;br/&gt;或者，前述R&lt;sup&gt;5&lt;/sup&gt;及R&lt;sup&gt;6&lt;/sup&gt;亦可與此等2個基團所分別鄰接的碳原子一起互相鍵結，而形成飽和或不飽和碳環。前述飽和或不飽和碳環亦可進一步具有取代基。  &lt;br/&gt;虛線表示單鍵或雙鍵。  &lt;br/&gt;X&lt;sup&gt;-&lt;/sup&gt;表示含有含氟芳香環的硼陰離子等。)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1404" publication-number="202625746">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625746</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134170</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>固定組件及應用其之基板載具</chinese-title>
        <english-title>FIXING ASSEMBLY AND SUBSTRATE CARRIER USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/10</main-classification>
        <further-classification edition="200601120260302B">B65G49/07</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>家登精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUDENG PRECISION INDUSTRIAL CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱銘乾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, MING-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李奇霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林家齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIA-CH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘詠晉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, YUNG-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉家良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIA-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳慧玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種固定組件，適用於一基板載具，固定組件用於將基板載具之一定位元件固定至基板載具之一底座上。固定組件包括一套筒件以及一插銷件，套筒件用以插入定位元件之一固定孔和底座上之一通孔，插銷件用以楔入套筒件內，以使套筒件發生形變而與定位元件和底座鎖定。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板載具</p>
        <p type="p">110:底座</p>
        <p type="p">130:定位元件</p>
        <p type="p">140:固定組件</p>
        <p type="p">150:按壓鎖扣機構</p>
        <p type="p">151:插銷件</p>
        <p type="p">152:套筒件</p>
        <p type="p">170:殼體</p>
        <p type="p">179:底部</p>
        <p type="p">110a:通孔</p>
        <p type="p">130a:固定孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1405" publication-number="202625419">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625419</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134174</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感測器介面架構及系統</chinese-title>
        <english-title>SENSOR INTERFACE ARCHITECTURE AND SYSTEMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260309B">H04L51/10</main-classification>
        <further-classification edition="202201120260309B">H04L49/10</further-classification>
        <further-classification edition="202501120260309B">H10F39/12</further-classification>
        <further-classification edition="200601120260309B">G06F3/041</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘋果公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩卡爾　坦梅　Ｔ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAPKAL, TANMAY T.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱雷姆　奧倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KEREM, OREN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柏克　韋恩　艾瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BURK, WAYNE ERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章典</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露描述一種置放在感測器來源與信號處理器之間的感測器介面(SIF)系統。該SIF系統可包括耦接至一第一感測器來源及一第二感測器來源，並進一步耦接至一第一資料組裝器及一第二資料組裝器的一感測器介面佇列(SIFQ)。該SIFQ可包括用以儲存從該第一感測器來源接收的一第一組資料封包的一第一佇列，及用以儲存從該第二感測器來源接收的一第二組資料封包一第二佇列。該第一組資料封包及該第二組資料封包可共用該相同資料封包格式。該第一資料組裝器可以一第一框格式將該第一組資料封包組裝成第一資料，且該第二資料組裝器可以一第二框格式將該第二組資料封包組裝成第二資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure describes a sensor interface (SIF) system placed between sensor sources and signal processors. A SIF system can include a sensor interface queue (SIFQ) coupled to a first sensor source and a second senor source, and further coupled to a first data assembler and a second data assembler. The SIFQ can include a first queue to store a first set of data packets received from the first sensor source, and a second queue to store a second set of data packets received from the second sensor source. The first set of data packets and the second set of data packets can share the same data packet format. The first data assembler can assemble the first set of data packets into first data in a first frame format, and the second data assembler can assemble the second set of data packets into second data in a second frame format.</p>
      </isu-abst>
      <representative-img>
        <p type="p">303:感測器介面(SIF)；組件</p>
        <p type="p">309:輔助資料儲存器；組件</p>
        <p type="p">400:SIF系統</p>
        <p type="p">401:SIF佇列(SIFQ)</p>
        <p type="p">402a:感測器來源</p>
        <p type="p">402b:感測器來源</p>
        <p type="p">402g:感測器來源</p>
        <p type="p">402h:感測器來源</p>
        <p type="p">403:後處理裝置</p>
        <p type="p">404a:封包轉換器</p>
        <p type="p">404b:封包轉換器</p>
        <p type="p">404g:封包轉換器</p>
        <p type="p">404h:封包轉換器</p>
        <p type="p">405a:資料組裝器</p>
        <p type="p">405b:資料組裝器</p>
        <p type="p">405n:資料組裝器</p>
        <p type="p">406a:感測器鏈路</p>
        <p type="p">406b:感測器鏈路</p>
        <p type="p">406g:感測器鏈路</p>
        <p type="p">406h:感測器鏈路</p>
        <p type="p">407a:ISP處理器</p>
        <p type="p">407aa:ISP記憶體</p>
        <p type="p">407b:ISP處理器</p>
        <p type="p">407bb:ISP記憶體</p>
        <p type="p">407n:ISP處理器</p>
        <p type="p">407nn:ISP記憶體</p>
        <p type="p">408:預處理裝置</p>
        <p type="p">409a:虛擬通道；虛擬通道識別符</p>
        <p type="p">409b:虛擬通道；虛擬通道識別符</p>
        <p type="p">409n:虛擬通道</p>
        <p type="p">410:子系統</p>
        <p type="p">411a:輔助資料</p>
        <p type="p">411b:輔助資料</p>
        <p type="p">411g:輔助資料</p>
        <p type="p">411h:輔助資料</p>
        <p type="p">412a:框</p>
        <p type="p">412b:框</p>
        <p type="p">412g:框</p>
        <p type="p">412h:框</p>
        <p type="p">413a:輔助資料封包</p>
        <p type="p">413b:輔助資料封包</p>
        <p type="p">413g:輔助資料封包</p>
        <p type="p">413h:輔助資料封包</p>
        <p type="p">414a:資料封包</p>
        <p type="p">414b:資料封包</p>
        <p type="p">414g:資料封包</p>
        <p type="p">414h:資料封包</p>
        <p type="p">415a:佇列</p>
        <p type="p">415b:佇列</p>
        <p type="p">415k:佇列</p>
        <p type="p">416a:影像資料組裝器；資料組裝器</p>
        <p type="p">416b:影像資料組裝器；資料組裝器</p>
        <p type="p">416n:影像資料組裝器</p>
        <p type="p">417:佇列分配器</p>
        <p type="p">418a:佇列啟用器；輔助資料組裝器</p>
        <p type="p">418b:佇列啟用器；輔助資料組裝器</p>
        <p type="p">418k:佇列啟用器；輔助資料組裝器</p>
        <p type="p">418n:輔助資料組裝器</p>
        <p type="p">420:子系統</p>
        <p type="p">421:佇列計數器暫存器</p>
        <p type="p">423:佇列分配暫存器</p>
        <p type="p">425:路由表</p>
        <p type="p">427:輸出分叉裝置</p>
        <p type="p">429:縱橫式路由器；交叉開關</p>
        <p type="p">430:子系統</p>
        <p type="p">431a:第一資料</p>
        <p type="p">431b:第二資料</p>
        <p type="p">441:控制器</p>
        <p type="p">443a:溢出偵測器</p>
        <p type="p">443b:溢出偵測器</p>
        <p type="p">445:封包完整性偵測器</p>
        <p type="p">447:組態暫存器；控制器</p>
        <p type="p">451:時脈</p>
        <p type="p">453:時脈</p>
        <p type="p">455:時脈</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1406" publication-number="202623753">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623753</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134176</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>濕式清潔系統、清潔機器人和控制方法</chinese-title>
        <english-title>WET CLEANING SYSTEM, CLEANING ROBOT, AND CONTROL METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">A47L11/40</main-classification>
        <further-classification edition="200601120260312B">A47L11/284</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧遙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開了一種濕式清潔系統、清潔機器人和控制方法。其中，濕式清潔系統，設置為清潔機器人的一部分，濕式清潔系統包括：第一濕式清潔件，第一濕式清潔件上設有缺口，缺口位於第一濕式清潔件的邊沿處，缺口位於第一濕式清潔件對稱軸的一側；第二濕式清潔件，第二濕式清潔件位於第一位置時，第二濕式清潔件全部位於缺口內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application discloses a wet cleaning system, a cleaning robot, and a control method. The wet cleaning system is configured as part of the cleaning robot and includes: a first wet cleaning component, which has a notch located at the edge of the first wet cleaning component, with the notch positioned on one side of the symmetry axis of the first wet cleaning component; and a second wet cleaning component, which, when positioned at the first location, is entirely within the notch.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:濕式清潔系統</p>
        <p type="p">120:第一濕式清潔件</p>
        <p type="p">121:缺口</p>
        <p type="p">122:第一拖板</p>
        <p type="p">123:第一拖布</p>
        <p type="p">130:第二濕式清潔件</p>
        <p type="p">131:第二拖板</p>
        <p type="p">132:第二拖布</p>
        <p type="p">150:擺臂</p>
        <p type="p">160:第一連接軸</p>
        <p type="p">161:第二連接軸</p>
        <p type="p">170:第一馬達</p>
        <p type="p">180:第二馬達</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1407" publication-number="202625777">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625777</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134236</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在積體電路總成內形成之表面聲波感測器</chinese-title>
        <english-title>A SURFACE ACOUSTIC WAVE SENSOR FORMED WITHIN AN INTEGRATED CIRCUIT ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260309B">H10P74/20</main-classification>
        <further-classification edition="202601120260309B">H10W20/40</further-classification>
        <further-classification edition="202601120260309B">H10W10/10</further-classification>
        <further-classification edition="202601120260309B">H10W72/30</further-classification>
        <further-classification edition="202301120260309B">H10N30/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商萬國商業機器公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERNATIONAL BUSINESS MACHINES CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈亞南　基斯翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAYANAND, KISHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕拉莫夫　尼可拉斯　亞歷山卓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POLOMOFF, NICHOLAS ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬杜里　莎拉　內海爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOWDHURY, SARAH NAHAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BD</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>度塔　艾西瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUTTA, ASHIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　智超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIH-CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章典</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊名宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種總成及用以形成一積體電路總成之方法，該積體電路總成包括一第一晶粒，該第一晶粒具有耦接至該第一晶粒上之第一金屬連接件的一第一感測器部分。一第二晶粒具有耦接至該第二底部晶粒上之第二金屬連接件的一第二晶粒感測器部分。一接合界面機電耦接該等第一金屬連接件及該等第二金屬連接件以耦接該第一感測器部分及該第二感測器部分。該第一感測器部分及該第二感測器部分在通過該接合界面機電耦接時一起操作以產生用於判定該接合界面之條件的信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are an assembly and method to form an integrated circuit assembly including a first die having a first sensor portion coupled to first metal connections on the first die. A second die has a second die sensor portion coupled to second metal connections on the second bottom die. A bond interface electromechanically couples the first metal connections and the second metal connections to couple the first and the second sensor portions. The first and the second sensor portions when electromechanically coupled through the bond interface operate together to produce signals used to determine conditions of the bond interface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:積體電路總成</p>
        <p type="p">102:頂部晶粒</p>
        <p type="p">104:底部晶粒</p>
        <p type="p">108:裝置層</p>
        <p type="p">110:裝置層</p>
        <p type="p">112:裝置</p>
        <p type="p">114:裝置</p>
        <p type="p">116&lt;sub&gt;1&lt;/sub&gt;:混合接合互連結構</p>
        <p type="p">116&lt;sub&gt;2&lt;/sub&gt;:混合接合互連結構</p>
        <p type="p">116&lt;sub&gt;7&lt;/sub&gt;:混合接合互連結構</p>
        <p type="p">116&lt;sub&gt;8&lt;/sub&gt;:混合接合互連結構</p>
        <p type="p">118&lt;sub&gt;1&lt;/sub&gt;:混合接合襯墊</p>
        <p type="p">118&lt;sub&gt;2&lt;/sub&gt;:混合接合襯墊</p>
        <p type="p">118&lt;sub&gt;7&lt;/sub&gt;:混合接合襯墊</p>
        <p type="p">118&lt;sub&gt;8&lt;/sub&gt;:混合接合襯墊</p>
        <p type="p">120:混合接合介電層</p>
        <p type="p">122&lt;sub&gt;1&lt;/sub&gt;:混合接合襯墊</p>
        <p type="p">122&lt;sub&gt;2&lt;/sub&gt;:混合接合襯墊</p>
        <p type="p">122&lt;sub&gt;7&lt;/sub&gt;:混合接合襯墊</p>
        <p type="p">122&lt;sub&gt;8&lt;/sub&gt;:混合接合襯墊</p>
        <p type="p">124:混合接合層</p>
        <p type="p">126&lt;sub&gt;1&lt;/sub&gt;:頂部金屬連接件</p>
        <p type="p">126&lt;sub&gt;2&lt;/sub&gt;:頂部金屬連接件</p>
        <p type="p">126&lt;sub&gt;8&lt;/sub&gt;:頂部金屬連接件</p>
        <p type="p">128:頂部後段製程層</p>
        <p type="p">130&lt;sub&gt;1&lt;/sub&gt;:底部金屬連接件</p>
        <p type="p">130&lt;sub&gt;2&lt;/sub&gt;:底部金屬連接件</p>
        <p type="p">130&lt;sub&gt;7&lt;/sub&gt;:底部金屬連接件</p>
        <p type="p">130&lt;sub&gt;8&lt;/sub&gt;:底部金屬連接件</p>
        <p type="p">132:底部BEOL層</p>
        <p type="p">134:輸出指叉式轉換器</p>
        <p type="p">136:介電層</p>
        <p type="p">138:輸入指叉式轉換器</p>
        <p type="p">140:介電層</p>
        <p type="p">142:輸入射頻傳輸線</p>
        <p type="p">144:輸出RF傳輸線</p>
        <p type="p">146:接地結構</p>
        <p type="p">148:接地結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1408" publication-number="202625757">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625757</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134251</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>接合設備、接合方法及物品製造方法</chinese-title>
        <english-title>BONDING APPARATUS, BONDING METHOD, AND ARTICLE MANUFACTURING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260306B">H10P72/50</main-classification>
        <further-classification edition="202601120260306B">H10W72/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANON KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村正浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了接合設備、接合方法和物品製造方法。該接合設備執行將第二構件接合到第一構件的多個區域的接合處理，該接合設備包括：觀測器；接合機構，其被構造為將多個第二構件中的各個接合到該多個區域中的一個；以及控制器，其被構造為透過使用該觀測器測量該多個區域當中的所選區域的位置來執行決定該多個區域的位置的決定處理，並且基於該多個區域的位置來控制該接合處理。控制器根據接合處理的狀況來決定重新執行決定處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bonding apparatus that executes a bonding process of bonding a second member to a plurality of regions of a first member, comprising a scope, a bonding mechanism configured to bond each of a plurality of second members to one of the plurality of regions, and a controller configured to execute a decision process of deciding positions of the plurality of regions by measuring, using the scope, a position of a selected region among the plurality of regions and control the bonding process based on the positions of the plurality of regions. The controller decides to re-execute the decision process in accordance with a situation of the bonding process.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1409" publication-number="202624816">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624816</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134256</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學系統、微影設備、光學系統的製造方法和用於設計光學系統減振器的方法</chinese-title>
        <english-title>OPTICAL SYSTEM, LITHOGRAPHY APPARATUS, METHOD FOR PRODUCING AN OPTICAL SYSTEM, AND METHOD FOR DESIGNING A VIBRATION DAMPER OF AN OPTICAL SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260302B">G02B7/00</main-classification>
        <further-classification edition="202101120260302B">G02B7/182</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="200601120260302B">G02B5/09</further-classification>
        <further-classification edition="200601120260302B">F16F15/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARL ZEISS SMT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高里尤斯　湯瑪斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GORIUS, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種光學系統(200)，其包含：一部件(202)，一承載結構(204)，用於承載該部件(202)，一振動解耦單元(206)，用於將該部件(202)與該承載結構(204)的振動解耦，其中該振動解耦單元(206)包含連接至該部件(202)的第一彈簧元件(208)、連接至該承載結構(204)的第二彈簧元件(210)以及連接至該第一彈簧元件(208)和該第二彈簧元件(210)的中間質量塊(212)，其中與該第一彈簧元件(208)並聯的減振器(214)連接到該中間質量塊(212)和該部件(202)，或其中與該第二彈簧元件(210)並聯的減振器(214)連接到該中間質量塊(212)和該承載結構(204)，其中該減振器(214)包含至少一個避震元件(216)，透過該元件可抑制該中間質量塊(212)的固有振動，其中該減振器(214)包含避震器解耦單元(300)，該單元與該至少一個避震元件(216)串聯。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to an optical system (200), comprising a component (202), a load-bearing structure (204) for carrying the component (202), a vibration decou-pling unit (206) for decoupling the component (202) from a vibration of the load-bearing structure (204), wherein the vibration decoupling unit (206) comprises a first spring element (208) connected to the component (202), a second spring ele-ment (210) connected to the load-bearing structure (204) and an intermediate mass (212) connected to the first spring element (208) and the second spring ele-ment (210), wherein a vibration damper (214) connected in parallel with the first spring element (208) is connected to the intermediate mass (212) and the compo-nent (202) or wherein a vibration damper (214) connected in parallel with the sec-ond spring element (210) is connected to the intermediate mass (212) and the load-bearing structure (204), wherein the vibration damper (214) comprises at least one damping element (216), by means of which a natural vibration of the intermediate mass (212) can be damped, wherein the vibration damper (214) com-prises a damper decoupling unit (300), which is connected in series with the at least one damper element (216).</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:光學系統</p>
        <p type="p">202:部件</p>
        <p type="p">204:承載結構</p>
        <p type="p">206:振動解耦單元</p>
        <p type="p">208:第一彈簧元件</p>
        <p type="p">210:第二彈簧元件</p>
        <p type="p">212:中間質量塊</p>
        <p type="p">214:減振器</p>
        <p type="p">216:避震元件</p>
        <p type="p">218:可釋放的連接</p>
        <p type="p">d:避震器元件的避震常數</p>
        <p type="p">k&lt;sub&gt;int&lt;/sub&gt;:剛性</p>
        <p type="p">m&lt;sub&gt;int&lt;/sub&gt;:中間質量塊的質量</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1410" publication-number="202625561">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625561</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134295</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體記憶裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260302B">H10B43/20</main-classification>
        <further-classification edition="202301120260302B">H10B43/30</further-classification>
        <further-classification edition="202501120260302B">H10D62/80</further-classification>
        <further-classification edition="202601120260302B">H10P32/00</further-classification>
        <further-classification edition="202601120260302B">H10P30/40</further-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>下城義朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMOJO, YOSHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提高半導體記憶裝置的積集度。一實施形態的半導體記憶裝置包括：兩個第一導電柱，在與基板交叉的第一方向延伸，並在與第一方向交叉的第二方向排列；第一半導體層及第二半導體層，在與基板平行的第一平面中，設置為在與第一方向及第二方向交叉的第三方向夾持兩個第一導電柱；第一絕緣體，設置在兩個第一導電柱之間，將兩個第一導電柱彼此絕緣，且在第一平面中將第一半導體層及第二半導體層絕緣；兩個第一電荷蓄積膜，在第一平面中，分別設置在兩個第一導電柱與第一半導體層之間；以及兩個第二電荷蓄積膜，在第一平面中，分別設置在兩個第一導電柱與第二半導體層之間，其中第一絕緣體在第一平面中與第一半導體層及第二半導體層接觸的部分，形成為在兩個第一導電柱之間具有中心的同心圓狀或同心橢圓狀。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">30:導電體膜</p>
        <p type="p">31:絕緣體膜</p>
        <p type="p">32:機能膜</p>
        <p type="p">40、INS:絕緣體</p>
        <p type="p">40-1:第一部分</p>
        <p type="p">40-2:第二部分</p>
        <p type="p">MPP:接觸</p>
        <p type="p">CH:通道</p>
        <p type="p">CL:通道層</p>
        <p type="p">GP、CGP、SGP:導電柱</p>
        <p type="p">DL1、DL2:擴散層</p>
        <p type="p">LB、RP:絕緣柱</p>
        <p type="p">LBI:配線層</p>
        <p type="p">LU:層單位</p>
        <p type="p">MCR:記憶體單元區域</p>
        <p type="p">MT0~MT7:記憶體單元電晶體</p>
        <p type="p">NS:NAND串</p>
        <p type="p">PL:柱列</p>
        <p type="p">R1、R2、R3、R4:半徑</p>
        <p type="p">SL:源極線</p>
        <p type="p">SLR:源極線區域</p>
        <p type="p">ST1、ST2:選擇電晶體</p>
        <p type="p">V-V、VI-VI:線</p>
        <p type="p">X:方向</p>
        <p type="p">Y:方向</p>
        <p type="p">Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1411" publication-number="202625102">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625102</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134367</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用以產生用於識別工程化木板的資料集之方法及用以識別工程化木板之方法</chinese-title>
        <english-title>METHOD FOR GENERATING A DATA SET FOR IDENTIFYING ENGINEERED-WOOD BOARDS AND METHOD FOR IDENTIFYING ENGINEERED-WOOD BOARDS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260309B">G06V10/764</main-classification>
        <further-classification edition="201701120260309B">G06T7/60</further-classification>
        <further-classification edition="201701120260309B">G06T7/70</further-classification>
        <further-classification edition="200601120260309B">G01B11/06</further-classification>
        <further-classification edition="201901120260309B">G06F16/55</further-classification>
        <further-classification edition="201801120260309B">G06F9/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧地利商弗瑞茲艾格有限及兩合公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRITZ EGGER GMBH &amp; CO. OG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魯姆　馬庫斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUHM, MARKUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種用於產生一資料集以供識別工程化木板之方法，其中至少兩個工程化木板，尤其是複數個工程化木板，形成一板材包裝體，其中錄製該板材包裝體之一部分之至少一個數位影像，該部分帶有該等工程化木板之側緣之區段，其中，從該數位影像，確定帶有該等個別側緣之該等區段的影像區段，其中以該等工程化木材元件之結構為基礎，為各影像區段確定一比較資料集，其中儲存用於各工程化木板之比較資料集，以及其中關於該相應工程化木板及關於該相應板材包裝體之至少一件資訊係連結至各工程化木板之該比較資料集，並且儲存在一資料庫中。本發明係有關於一種用於識別一工程化木板之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a method for generating a data set for identifying engineered-wood boards, in which at least two engineered-wood boards, in particular a plurality of engineered-wood boards, form a board package, in which at least one digital image of a part of the board package with sections of the side edges of the engineered-wood boards is recorded, in which, from the digital image, image sections with the sections of the individual side edges are determined, in which a comparison data set is determined for each image section on the basis of the structure of the engineered-wood elements, in which the comparison data set for each engineered-woo board is stored, and in which at least one piece of information about the respective engineered-wood board and about the respective board package is linked to the comparison data set of each engineered-wood board and stored in a database. The invention also relates to a method for identifying an engineered-wood board.</p>
      </isu-abst>
      <representative-img>
        <p type="p">12:工程化木板</p>
        <p type="p">16:板材包裝體</p>
        <p type="p">20:側緣</p>
        <p type="p">22:相機裝置</p>
        <p type="p">24:照射螢幕；照明螢幕</p>
        <p type="p">26:數位相機</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1412" publication-number="202624697">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624697</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134433</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用Ｘ射線螢光測量及製程控制技術之形成矽／矽鍺超晶格結構的方法</chinese-title>
        <english-title>METHOD OF FORMING SI/SIGE SUPERLATTICE STRUCTURES USING XRF MEASUREMENTS AND PROCESS CONTROL TECHNIQUES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">G01B15/02</main-classification>
        <further-classification edition="202601120260306B">H10P74/00</further-classification>
        <further-classification edition="200601120260306B">C23C16/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　彪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, BIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘鋮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡　曼平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAI, MAN-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菲利普斯　麥克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PHILLIPS, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕卡拉　瑪亨德拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAKALA, MAHENDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威奇　史蒂芬Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WELCH, STEVEN R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了用於使用X射線螢光（XRF）測量和製程控制技術進行磊晶沉積的方法和系統。該方法涉及執行磊晶沉積製程，以在基板上沉積交替的矽（Si）和矽鍺（SiGe）層。XRF測量確定該等層的厚度和組成，從而允許對層的厚度和組成進行精確控制。該製程幫助維持目標應變並防止缺陷，從而改善元件效能。XRF測量可以在原位或在移送腔室中進行，使得能夠實現對沉積參數的即時調整。該方法適用於各種半導體元件，包括3D DRAM和環繞式閘極（GAA）電晶體元件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and systems for epitaxial deposition using X-ray fluorescence (XRF) measurements and process control techniques are provided. The method involves performing an epitaxial deposition process to deposit alternating layers of silicon (Si) and silicon germanium (SiGe) on a substrate. XRF measurements determine the thickness and composition of these layers, allowing for precise control over layer thickness and composition. The process helps maintain the targeted strain and prevents defects, improving device performance. The XRF measurements can be performed in-situ or in a transfer chamber, enabling real-time adjustments to the deposition parameters. The method is applicable to various semiconductor devices, including 3D DRAM and gate-all-around (GAA) transistor devices.</p>
      </isu-abst>
      <representative-img>
        <p type="p">310:操作</p>
        <p type="p">320:操作</p>
        <p type="p">330:操作</p>
        <p type="p">340:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1413" publication-number="202624941">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624941</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134520</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260121B">G06F3/041</main-classification>
        <further-classification edition="202301120260121B">H10K59/40</further-classification>
        <further-classification edition="202301120260121B">H10K59/82</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ顯示器股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金承玄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SEUNGHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例可提供一種顯示裝置，包括：基板，其包含能夠顯示影像的顯示區域，顯示區域包含具有複數個透射區域的第一顯示區域、以及位於第一顯示區域外側的第二顯示區域；觸控感測器金屬，設置在第一顯示區域中，並位於該複數個透射區域的外側；第一信號線，設置在第一顯示區域中，並與觸控感測器金屬的一部分至少部分地重疊；以及第二信號線，設置在第一顯示區域中，並與觸控感測器金屬的另一部分至少部分地重疊。因此，本發明實施例可提供一種顯示裝置，其具有光學透射結構，使得設置在顯示面板下方的光電裝置能夠適當地接收光線，同時維持光學區域中的觸控性能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The embodiments of the present disclosure may provide a display device comprising: a substrate including a display area capable of displaying an image, the display area including a first display area having a plurality of transmissive areas and a second display area positioned outside the first display area; a touch sensor metal disposed in the first display area and positioned outside the plurality of transmissive areas; a first signal line disposed in the first display area and at least partially overlapping with a portion of the touch sensor metal; and a second signal line disposed in the first display area and at least partially overlapping with another portion of the touch sensor metal. Accordingly, the embodiments of the present disclosure may provide a display device having an optical transmission structure that allows an optoelectronic device disposed below the display panel to properly receive light while maintaining touch performance in an optical area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電子裝置</p>
        <p type="p">ABUF:主動緩衝層</p>
        <p type="p">BK:堤部</p>
        <p type="p">BUF1:第一緩衝層</p>
        <p type="p">BUF2:第二緩衝層</p>
        <p type="p">CE:共用電極</p>
        <p type="p">EL:中間層</p>
        <p type="p">ENCAP:封裝層</p>
        <p type="p">GI1:第一閘極絕緣層</p>
        <p type="p">GI2:第二閘極絕緣層</p>
        <p type="p">ILD1:第一層間絕緣層</p>
        <p type="p">ILD2:第二層間絕緣層</p>
        <p type="p">INTL:中間層</p>
        <p type="p">LTA:低透射率區域</p>
        <p type="p">MBUF:多緩衝層</p>
        <p type="p">MPL:金屬圖案層</p>
        <p type="p">OA:光學區域</p>
        <p type="p">PAS1:第一封裝層</p>
        <p type="p">PCL:第二封裝層</p>
        <p type="p">PAS2:第三封裝層</p>
        <p type="p">PLN:平坦化層</p>
        <p type="p">PLN1:第一平坦化層</p>
        <p type="p">PLN2:第二平坦化層</p>
        <p type="p">S-BUF:感測器緩衝層</p>
        <p type="p">S-ILD:感測器層間絕緣層</p>
        <p type="p">SL1:第一信號線</p>
        <p type="p">SL2:第二信號線</p>
        <p type="p">S-PAC:感測器保護層</p>
        <p type="p">SUB:基板</p>
        <p type="p">SUB1:第一基板</p>
        <p type="p">SUB2:第二基板</p>
        <p type="p">TA:透射區域</p>
        <p type="p">TSL:觸控感測器層</p>
        <p type="p">TSM:觸控感測器金屬</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1414" publication-number="202624460">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624460</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134533</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>乾式蝕刻方法、半導體裝置之製造方法、蝕刻裝置及蝕刻氣體組合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C09K13/00</main-classification>
        <further-classification edition="202601120260302B">H10P50/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商中央硝子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CENTRAL GLASS COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊池亜紀応</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUCHI, AKIOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>品川誠人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINAGAWA, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種能夠選擇性地蝕刻矽之乾式蝕刻方法、半導體裝置之製造方法、蝕刻裝置及蝕刻氣體組合物。  &lt;br/&gt;本發明係關於一種乾式蝕刻方法，其利用含氟化合物氣體及有機胺氣體，從矽和選自由矽鍺、鍺、氧化矽、氮化矽、矽氮氧化物、矽碳氧化物、矽碳氮化物及矽碳氮氧化物所組成之群中之至少1種之中選擇性地蝕刻矽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:被處理體</p>
        <p type="p">100:蝕刻裝置</p>
        <p type="p">110:處理容器</p>
        <p type="p">111:載置部</p>
        <p type="p">121:配管</p>
        <p type="p">130:含氟化合物氣體供給部</p>
        <p type="p">131,132:配管</p>
        <p type="p">140:有機胺氣體供給部</p>
        <p type="p">141,142:配管</p>
        <p type="p">150:惰性氣體供給部</p>
        <p type="p">151,152:配管</p>
        <p type="p">190:溫度調整機構</p>
        <p type="p">191,192:配管</p>
        <p type="p">193:真空泵</p>
        <p type="p">194:液氮冷阱</p>
        <p type="p">MFC1,MFC2,MFC3:流量調整機構</p>
        <p type="p">PI1,PI2:壓力計</p>
        <p type="p">V1,V2,V3,V4,V5,V6,V7,V8:閥</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1415" publication-number="202625014">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625014</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134553</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於擴展容忍型可再程式化類比之靈活且高效的神經嵌入</chinese-title>
        <english-title>FLEXIBLE AND EFFICIENT NEURAL EMBEDDINGS FOR SCALING TOLERANT REPROGRAMMABLE ANALOG</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260306B">G06N3/063</main-classification>
        <further-classification edition="200601120260306B">G11C27/02</further-classification>
        <further-classification edition="200601120260306B">G06F13/40</further-classification>
        <further-classification edition="201801120260306B">G06F9/38</further-classification>
        <further-classification edition="200601120260306B">G06F15/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商亞斯皮尼提公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASPINITY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藍伯格　布蘭登</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUMBERG, BRANDON DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供系統、方法和電腦程式碼，以編譯用於在類比神經處理單元(NPU)上執行的模型，並操作類比NPU。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems, methods and computer program code are provided to compile a model for execution on an analog neural processing unit (NPU) and to operate an analog NPU.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:檢測系統</p>
        <p type="p">102:警報系統</p>
        <p type="p">104:類比NPU</p>
        <p type="p">106:通訊裝置</p>
        <p type="p">108:電池</p>
        <p type="p">110:相機</p>
        <p type="p">120:人員</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1416" publication-number="202624446">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624446</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134634</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置的製造方法</chinese-title>
        <english-title>METHOD FOR MANUFACTURING ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C09J201/00</main-classification>
        <further-classification edition="200601120260302B">C09J11/08</further-classification>
        <further-classification edition="201801120260302B">C09J7/20</further-classification>
        <further-classification edition="202601120260302B">H10P72/70</further-classification>
        <further-classification edition="202601120260302B">H10W74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井化學艾喜緹瑪蒂莉亞股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI CHEMICALS ICT MATERIA, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三浦徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIURA, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置的製造方法，包含：準備結構體（100）的步驟，所述結構體（100）包括黏著性膜（10）、加工對象物（20）及支撐構件（30），所述黏著性膜（10）包括基材層（A）、黏著性樹脂層（B）及黏著性樹脂層（C），所述加工對象物（20）暫時固定於所述黏著性樹脂層（B），所述支撐構件（30）暫時固定於所述黏著性樹脂層（C）；以及對暫時固定於所述黏著性樹脂層（B）的所述加工對象物（20）進行加工的步驟，所述基材層（A）位於所述黏著性樹脂層（B）與所述黏著性樹脂層（C）之間，所述黏著性樹脂層（C）包含熱膨脹性微小球，所述熱膨脹性微小球的藉由規定的式子算出的真球度R為0.93以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for manufacturing an electronic device includes: a step of preparing a structure (100) that includes an adhesive film (10), an object to be processed (20) and a support member (30), the adhesive film (10) including a substrate layer (A), an adhesive resin layer (B), and an adhesive resin layer (C), the object to be processed (20) being temporarily fixed to the adhesive resin layer (B), the support member (30) being temporarily fixed to the adhesive resin layer (C); and a step of processing the object to be processed (20) that is temporarily fixed to the adhesive resin layer (B), in which the substrate layer (A) is located between the adhesive resin layer (B) and the adhesive resin layer (C), the adhesive resin layer (C) includes thermally expandable microspheres, and a sphericity R of the thermally expandable microspheres, which is calculated by a predetermined formula, is 0.93 or more.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:黏著性膜</p>
        <p type="p">20:加工對象物</p>
        <p type="p">30:支撐構件</p>
        <p type="p">40:加工後的加工對象物</p>
        <p type="p">100:結構體</p>
        <p type="p">A:基材層</p>
        <p type="p">B:黏著性樹脂層</p>
        <p type="p">C:黏著性樹脂層</p>
        <p type="p">Y1:步驟</p>
        <p type="p">Y2:步驟</p>
        <p type="p">Y3:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1417" publication-number="202624918">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624918</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134771</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>低壓降調節器及低壓降調節器的壓降偵測方法</chinese-title>
        <english-title>LOW-DROPOUT REGULATOR AND DROPOUT DETECTION METHOD OF A LOW-DROPOUT REGULATOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">G05F1/565</main-classification>
        <further-classification edition="200601120260112B">H02M3/156</further-classification>
        <further-classification edition="200601120260112B">H02M1/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金世基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SEKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野見山貴弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOMIYAMA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種低壓降（low-dropout，LDO）調節器包括：傳輸電晶體，具有被施加輸入電壓的一個端子及經由其輸出輸出電壓的另一端子；以及壓降偵測電路，被配置成對壓降進行偵測。壓降偵測電路可包括：電壓複製電路，被配置成藉由對輸出電壓進行複製來產生複製電壓；第一電阻器，電性連接於傳輸電晶體的所述一個端子與電壓複製電路之間；電流複製電路，被配置成藉由對流經第一電阻器的電流進行複製來產生複製電流；第二電阻器，電性連接於接地端子與電流複製電路之間；以及旁路比較器，電性連接至電流複製電路及第二電阻器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A low-dropout (LDO) regulator includes a pass transistor having one terminal to which an input voltage is applied and another terminal through which an output voltage is output, and a dropout detection circuit configured to detect dropout. The dropout detection circuit may include a voltage copy circuit configured to generate a copy voltage by copying the output voltage, a first resistor electrically connected between the one terminal of the pass transistor and the voltage copy circuit, a current copy circuit configured to generate a copy current by copying a current flowing through the first resistor, a second resistor electrically connected between a ground terminal and the current copy circuit, and a bypass comparator electrically connected to the current copy circuit and the second resistor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:第一電源/電源</p>
        <p type="p">20:負載區塊</p>
        <p type="p">100:LDO調節器</p>
        <p type="p">110:回饋電路</p>
        <p type="p">120:誤差放大器</p>
        <p type="p">130:傳輸電晶體</p>
        <p type="p">140:壓降偵測電路</p>
        <p type="p">141:電壓複製電路</p>
        <p type="p">142:第一電阻器</p>
        <p type="p">143:電流複製電路</p>
        <p type="p">144:第二電阻器</p>
        <p type="p">145:旁路比較器</p>
        <p type="p">BP_EN:旁路比較訊號/第一比較訊號</p>
        <p type="p">GND:接地端子</p>
        <p type="p">I1:第一電流/電流</p>
        <p type="p">I2:第二電流/複製電流</p>
        <p type="p">NB:旁路節點</p>
        <p type="p">ND:汲極節點</p>
        <p type="p">NG:閘極節點</p>
        <p type="p">Nout:輸出節點</p>
        <p type="p">NS:源極節點</p>
        <p type="p">OS:驅動訊號</p>
        <p type="p">Vbp:旁路電壓/輸入電壓</p>
        <p type="p">Vcopy:複製電壓</p>
        <p type="p">Vf:回饋電壓</p>
        <p type="p">Vin:輸入電壓/第一輸入電壓</p>
        <p type="p">Vout:輸出電壓</p>
        <p type="p">Vr:參考電壓</p>
        <p type="p">Vrbp:旁路參考電壓/輸入電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1418" publication-number="202624986">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624986</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134811</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>產業群聚分析方法及系統</chinese-title>
        <english-title>INDUSTRIAL CLUSTER ANALYSIS METHOD AND SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120251201B">G06F16/29</main-classification>
        <further-classification edition="202301120251201B">G06Q10/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中興工程顧問股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINOTECH ENGINEERING CONSULTANTS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳逸歆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱琦文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王珮琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳郁倩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種產業群聚分析方法及系統。該方法包括一資料取得步驟：取得一統計資料；一資料處理步驟：進行一區位商數法計算，以產出一計算結果；一空間處理步驟：將行政區與該計算結果串接並進行一產業核密度分析，並將該計算結果空間化，以產出一分析結果；以及一資料庫建置步驟：創建一資料庫並將該分析結果儲存在該資料庫中。藉此，透過網路爬蟲技術、區位商數法、核密度分析、地理資訊系統軟體以及動態地圖軟體，以自動抓取開放資料並自動進行統計分析，以節省時間與人力，並減少人工操作的錯誤。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to an industrial cluster analysis method and system. The method involves a data obtaining steps: obtaining a statistical data; a data processing steps: performing a calculation of a location quotient method to produce a calculation result; a spatial processing step: concatenating the administrative area with the calculation result and performing an industry kernel density analysis, and spatializing the calculation result to produce an analysis result; and a database creation steps: creating a database and store the analysis results in the database. In this way, through web crawler technology, location quotient method, kernel density analysis, geographical information system software and dynamic map software, open data can be automatically captured and statistical analysis can be automatically performed to save time and manpower and reduce manual errors.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100:產業群聚分析方法</p>
        <p type="p">S110~S160:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1419" publication-number="202624796">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624796</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134829</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學成像系統</chinese-title>
        <english-title>OPTICAL IMAGING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251128B">G02B5/04</main-classification>
        <further-classification edition="202101120251128B">G02B7/02</further-classification>
        <further-classification edition="202101120251128B">G02B7/18</further-classification>
        <further-classification edition="200601120251128B">G02B9/64</further-classification>
        <further-classification edition="200601120251128B">G02B11/34</further-classification>
        <further-classification edition="200601120251128B">G02B13/02</further-classification>
        <further-classification edition="200601120251128B">G02B13/18</further-classification>
        <further-classification edition="200601120251128B">G02B15/14</further-classification>
        <further-classification edition="200601120251128B">G02B17/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曺聖日</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, SEONG IL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林台淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, TAE YEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金宇英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, WOO YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許宰赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUH, JAE HYUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學成像系統包括第一透鏡組，包括沿著第一光軸依序設置的第一透鏡和第二透鏡，第二透鏡組，包括沿著垂直於第一光軸的第二光軸依序設置的第三透鏡、第四透鏡、第五透鏡、第六透鏡、以及第七透鏡，以及光路轉換元件，設置在第一透鏡組和第二透鏡組之間，光路轉換元件配置為改變光的傳播方向從第一光軸的方向到第二光軸的方向，其中滿足條件表達式0.5 ≤ |f/f1| + |f/f2| ≤ 1.5，其中f為光學成像系統的焦距，f1為第一透鏡的焦距，以及f2為第二透鏡的焦距。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical imaging system includes a first lens group including a first lens and a second lens sequentially disposed along a first optical axis, a second lens group including a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens sequentially disposed along a second optical axis perpendicular to the first optical axis, and an optical path conversion member disposed between the first lens group and the second lens group, the optical path conversion member being configured to change a traveling direction of light from a direction of the first optical axis to a direction of the second optical axis, wherein a conditional expression 0.5 ≤ |f/f1| + |f/f2| ≤ 1.5 is satisfied, where f is a focal length of the optical imaging system, f1 is a focal length of the first lens, and f2 is a focal length of the second lens.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光學成像系統</p>
        <p type="p">110:第一透鏡</p>
        <p type="p">120:第二透鏡</p>
        <p type="p">130:第三透鏡</p>
        <p type="p">140:第四透鏡</p>
        <p type="p">150:第五透鏡</p>
        <p type="p">160:第六透鏡</p>
        <p type="p">170:第七透鏡</p>
        <p type="p">F:濾光片</p>
        <p type="p">h1、h2:尺寸</p>
        <p type="p">IP:成像平面</p>
        <p type="p">IS:影像感測器</p>
        <p type="p">LG1:第一透鏡組</p>
        <p type="p">LG2:第二透鏡組</p>
        <p type="p">OA1:第一光軸</p>
        <p type="p">OA2:第二光軸</p>
        <p type="p">P:光路轉換元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1420" publication-number="202624108">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624108</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134887</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>搬送車</chinese-title>
        <english-title>TRANSPORT VEHICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">B66F9/24</main-classification>
        <further-classification edition="202401120260306B">G05D1/622</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大福股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIFUKU CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉永和治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHINAGA, KAZUHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村和誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, KAZUNARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是在具備叉件的構成中，可藉由障礙物感測器適當地檢測障礙物之搬送車，在搬送車100中，叉件1是配置成從升降裝置2朝向後側D2突出，車體3具備：本體部31，支撐行走驅動裝置；及一對腳部32，相對於叉件1的升降軌跡在寬度方向的兩側中，配置成從本體部31朝向後側D2突出，第1障礙物感測器91配置於一對腳部32之至少一者，將叉件1及被叉件1所支撐的托板P成為比第1障礙物感測器91的檢測面S1更上側之叉件1的上下方向的位置的範圍設為感測器迴避範圍，控制裝置10在使行走驅動裝置驅動驅動輪41以使車體3至少朝後側D2移動的情況下，執行行走時迴避控制，前述行走時迴避控制是控制升降裝置2以使叉件1位於感測器迴避範圍內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:叉件</p>
        <p type="p">2:升降裝置</p>
        <p type="p">3:車體</p>
        <p type="p">4:車輪</p>
        <p type="p">10:控制裝置</p>
        <p type="p">21:升降軌道</p>
        <p type="p">24:叉件連結構件</p>
        <p type="p">26:升降驅動裝置</p>
        <p type="p">28:配重件</p>
        <p type="p">31:本體部</p>
        <p type="p">32:腳部</p>
        <p type="p">33:罩蓋</p>
        <p type="p">41:驅動輪</p>
        <p type="p">42:從動輪</p>
        <p type="p">91:第1障礙物感測器</p>
        <p type="p">92:第2障礙物感測器</p>
        <p type="p">93:測域感測器</p>
        <p type="p">94:第1托板檢測感測器(托板檢測感測器)</p>
        <p type="p">95:第2托板檢測感測器</p>
        <p type="p">96:第3托板檢測感測器</p>
        <p type="p">97:第1衝撞偵測感測器</p>
        <p type="p">98:第2衝撞偵測感測器</p>
        <p type="p">100:搬送車</p>
        <p type="p">312:下側軌道支撐部</p>
        <p type="p">313:上側軌道支撐部</p>
        <p type="p">951:第1止擋件</p>
        <p type="p">952:第1微動開關</p>
        <p type="p">961:第2止擋件</p>
        <p type="p">962:第2微動開關</p>
        <p type="p">B:雷射光</p>
        <p type="p">D:前後方向</p>
        <p type="p">D1:前側</p>
        <p type="p">D2:後側</p>
        <p type="p">P:托板</p>
        <p type="p">S1:第1檢測面(檢測面)</p>
        <p type="p">S2:第2檢測面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1421" publication-number="202624995">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624995</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134935</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資訊處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120251001B">G06F21/44</main-classification>
        <further-classification edition="201301120251001B">G06F21/45</further-classification>
        <further-classification edition="201801120251001B">G06F8/65</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日立全球先端科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴昶玟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, CHANGMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦野康生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATANO, YASUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢戸晃史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YATO, AKIFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種技術，能在更新軟體的認證資訊的方法各不相同之情形，自動更新各軟體的認證資訊，並整合管理更新程序。  &lt;br/&gt;　　本發明之資訊處理裝置，決定更新認證資訊的更新對象軟體，生成前述更新對象軟體的認證資訊，並藉由執行將生成之認證資訊反映到前述更新對象軟體的更新程式來完成反映。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:資訊處理裝置</p>
        <p type="p">101:決定數據庫</p>
        <p type="p">102:決定部</p>
        <p type="p">103:管理數據庫</p>
        <p type="p">104:控制部</p>
        <p type="p">105:生成部</p>
        <p type="p">106:生成數據庫</p>
        <p type="p">107:更新數據庫</p>
        <p type="p">108:更新部</p>
        <p type="p">109:第一軟體群</p>
        <p type="p">110:外部裝置</p>
        <p type="p">111:第二軟體群</p>
        <p type="p">112:電子郵件伺服器</p>
        <p type="p">113:網路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1422" publication-number="202625556">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625556</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134974</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體記憶裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260223B">H10B41/27</main-classification>
        <further-classification edition="202301120260223B">H10B43/27</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野土翔登</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NODO, SHOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>妹尾駿一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SENO, SHUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松尾浩司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUO, KOUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>内藤慎哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAITO, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>来栖貴史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURUSU, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒井史隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAI, FUMITAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種適當動作之半導體記憶裝置。半導體記憶裝置具備：複數個半導體層及複數個絕緣層，其等沿積層方向交替積層，且於第1方向上延伸；複數個導電層，其等沿積層方向積層，且連接於複數個半導體層之端部；複數個第1通孔電極，其等排列於第1方向上，且與複數個半導體層對向；複數個電荷蓄積層，其等設置於複數個半導體層與複數個第1通孔電極之間；及複數個第2通孔電極，其等設置於複數個導電層與複數個第1通孔電極之間，排列於第1方向上，且與複數個半導體層對向。於第1剖面中，第2通孔電極之與複數個半導體層中之一者對向之面沿著第1圓，第2通孔電極之與複數個半導體層為相反側之面沿著第2圓。於第2剖面中，第2通孔電極之外周面沿著第3圓。第1圓及第2圓中之至少一者之半徑與第3圓之半徑不同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">110:半導體層</p>
        <p type="p">111:開口</p>
        <p type="p">120:通孔電極</p>
        <p type="p">130:閘極絕緣層</p>
        <p type="p">140,141:通孔電極</p>
        <p type="p">150:通孔配線</p>
        <p type="p">160:半導體層</p>
        <p type="p">170:導電層</p>
        <p type="p">171:絕緣層</p>
        <p type="p">BL:位元線</p>
        <p type="p">c1:圓</p>
        <p type="p">c2:圓</p>
        <p type="p">c3:圓</p>
        <p type="p">c4:圓</p>
        <p type="p">SGD:汲極側選擇閘極線</p>
        <p type="p">WL:字元線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1423" publication-number="202625374">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625374</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134986</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>射頻開關</chinese-title>
        <english-title>RADIO FREQUENCY SWITCH</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">H03K17/74</main-classification>
        <further-classification edition="200601120260304B">H03K17/687</further-classification>
        <further-classification edition="200601120260304B">H03K17/12</further-classification>
        <further-classification edition="202601120260304B">H10D80/20</further-classification>
        <further-classification edition="201801120260304B">G06F9/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商ＡＥＳ全球公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AES GLOBAL HOLDINGS PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>封扎爾　吉狄翁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN ZYL, GIDEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ZA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示描述用於RF開關之系統、方法及設備，該RF開關包含串聯耦合於RF端子之間的一或多個單元。每個單元具有由互補驅動器經由耦合電感器來控制的PIN二極體或三端開關之電橋。旁路電感器可佈置於每個電橋上。該RF開關可包括補償電容器，以在該RF開關處於切離狀態中時更好地達成電壓在該些開關上之均勻分佈。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure describes systems, methods, and apparatuses for an RF switch comprising one or more cells coupled in series between RF terminals. Each cell having a bridge of PIN diodes or three-terminal switches controlled by complementary drivers through a coupled inductor. A bypass inductor can be arranged across each bridge. The RF switch may include compensation capacitors to better achieve equal distribution of voltage over the switches when the RF switch is in the off state.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電路/開關電路</p>
        <p type="p">102:PIN二極體</p>
        <p type="p">104:電容器</p>
        <p type="p">106:端子</p>
        <p type="p">108:端子</p>
        <p type="p">110:電感器</p>
        <p type="p">112:開關</p>
        <p type="p">114:開關</p>
        <p type="p">116:源極/反向偏壓電源</p>
        <p type="p">118:源極</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1424" publication-number="202624513">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624513</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135109</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於使用具有低Ａｒ或低ＡｒＦ或低Ａｒ／ＡｒＦ含量的Ｆ／Ａｒ／Ｎ或Ｆ／ＡｒＦ／Ｎ或Ｆ／Ａｒ／ＡｒＦ／Ｎ混合物清洗具有原位電漿源的ＣＶＤ工具之方法</chinese-title>
        <english-title>METHOD FOR CLEANING OF CVD TOOLS WITH IN SITU PLASMA SOURCES USING A F/AR/N OR F/ARF/N OR F/AR/ARF/N MIXTURE WITH LOW AR OR LOW ARF OR LOW AR/ARF CONTENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C23C14/56</main-classification>
        <further-classification edition="200601120260302B">C23C16/44</further-classification>
        <further-classification edition="200601120260302B">B08B5/00</further-classification>
        <further-classification edition="200601120260302B">B08B7/00</further-classification>
        <further-classification edition="200601120260302B">B08B9/08</further-classification>
        <further-classification edition="200601120260302B">H01J37/32</further-classification>
        <further-classification edition="202601120260302B">H10P50/26</further-classification>
        <further-classification edition="202601120260302B">H10P50/28</further-classification>
        <further-classification edition="202601120260302B">H10P70/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比利時商首威公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOLVAY S.A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>匹特羅夫　麥克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PITTROFF, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舒瓦茲　湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHWARZE, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威廉德　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIELAND, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種用於清洗用於半導體、光伏打或平板製造的設備的腔室，特別是包括原位電漿源的CVD腔室之方法，該方法包括用清洗氣體清洗該腔室的步驟，其特徵在於該清洗氣體包含氣體混合物M，該氣體混合物M基本上由按體積計10%-35%的量的F&lt;sub&gt;2&lt;/sub&gt;、按體積計50%-75%的量的N&lt;sub&gt;2&lt;/sub&gt;、以及按體積計5%-15%的量的Ar和/或ArF組成，其中F&lt;sub&gt;2&lt;/sub&gt;、Ar和/或ArF、以及N&lt;sub&gt;2&lt;/sub&gt;的量總計為按體積計100%。此外，本發明關於這種清洗氣體用於清洗用於半導體、光伏打或平板製造的設備的腔室的用途。此外，本發明關於一種用於清洗用於半導體、光伏打或平板製造的設備的腔室的清洗氣體，其特徵在於該清洗氣體包含氣體混合物M，該氣體混合物M基本上由按體積計27%-32%的量的F&lt;sub&gt;2&lt;/sub&gt;、按體積計57%-66%的量的N&lt;sub&gt;2&lt;/sub&gt;、以及按體積計7%-11%的量的Ar和/或ArF組成，其中該氣體混合物M中F&lt;sub&gt;2&lt;/sub&gt;、Ar和/或ArF、以及N&lt;sub&gt;2&lt;/sub&gt;的量總計為按體積計100%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a method for cleaning the chamber of an apparatus used for semiconductor, photovoltaic or flat panel manufacturing, in particular a CVD chamber comprising an in-situ plasma source, comprising the step of cleaning the chamber with a cleaning gas, characterized in that the cleaning gas comprises a gas mixture M consisting essentially of F&lt;sub&gt;2&lt;/sub&gt; in an amount of 10 - 35% by volume, N&lt;sub&gt;2&lt;/sub&gt; in an amount of 50 - 75% by volume, and Ar and/or ArF in an amount of 5 - 15% by volume, wherein the amounts of F&lt;sub&gt;2&lt;/sub&gt;, Ar and/or ArF, and N&lt;sub&gt;2&lt;/sub&gt; add up to 100% by volume. Further, the present invention relates to a use of this cleaning gas for cleaning the chamber of an apparatus used for semiconductor, photovoltaic or flat panel manufacturing. Further, the present invention relates to a cleaning gas for cleaning the chamber of an apparatus used for semiconductor, photovoltaic or flat panel manufacturing, characterized in that the cleaning gas comprises a gas mixture M, the gas mixture M consisting essentially of F&lt;sub&gt;2&lt;/sub&gt; in an amount of 27 - 32% by volume, N&lt;sub&gt;2&lt;/sub&gt; in an amount of 57 - 66% by volume, and Ar and/or ArF in an amount of 7 - 11% by volume, wherein the amounts of F&lt;sub&gt;2&lt;/sub&gt;, Ar and/or ArF, and N&lt;sub&gt;2&lt;/sub&gt; in the gas mixture M add up to 100% by volume.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1425" publication-number="202624410">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624410</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135123</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於微影圖案化之支鏈組合物</chinese-title>
        <english-title>BRANCHED COMPOSITIONS FOR LITHOGRAPHIC PATTERNING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08L101/08</main-classification>
        <further-classification edition="200601120260302B">C08L51/00</further-classification>
        <further-classification edition="200601120260302B">C08K5/00</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/039</further-classification>
        <further-classification edition="200601120260302B">G03F7/16</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="200601120260302B">G03F7/32</further-classification>
        <further-classification edition="202601120260302B">H10P76/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商維奧納諾創新有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIONANO INNOVATIONS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈斯泰　菲利浦　丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUSTAD, PHILLIP DENE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示用於光微影之組合物及方法，該等組合物及方法採用支鏈組合物，諸如接枝或瓶刷聚合物。在一個實施例中，光阻劑組合物包括接枝聚合物，其由於較低表面能及減少之鏈纏結而在施用期間遷移至抗蝕劑層之上區域以形成原位障壁，該原位障壁將光阻劑組分至浸沒式微影流體中之浸出最小化，由此減少暴露工具之污染而不需要單獨頂塗層。該等接枝聚合物亦可調配成頂塗層、頂部抗反射塗層，或用作沖洗溶液中之表面活性劑以防止圖案塌縮。此等組合物可經調配成不含全氟及多氟烷基物質(PFAS)，從而提供環境更安全之用於先進微影製程之替代方案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are compositions and methods for photolithography that employ branched compositions, such as graft or bottlebrush polymers. In one embodiment, a photoresist composition includes a graft polymer that, due to lower surface energy and reduced chain entanglement, migrates to the upper region of the resist layer during application to form an &lt;i&gt;in-situ&lt;/i&gt; barrier that minimizes the leaching of photoresist components into an immersion lithography fluid, thereby reducing contamination of the exposure tool without requiring a separate topcoat. The graft polymers can also be formulated into top coats, top anti-reflective coatings, or used as surfactants in rinse solutions to prevent pattern collapse. These compositions can be formulated to be free of per- and polyfluoroalkyl substances (PFAS), offering an environmentally safer alternative for advanced lithographic processes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">202:基板</p>
        <p type="p">204:待圖案化層</p>
        <p type="p">206:光阻劑；光阻劑層</p>
        <p type="p">208:接枝聚合物</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1426" publication-number="202624369">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624369</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135163</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含有再循環原料之聚酯共聚物</chinese-title>
        <english-title>POLYESTER COPOLYMER CONTAINING RECYCLED RAW MATERIALS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">C08J11/04</main-classification>
        <further-classification edition="200601120260306B">C08J11/26</further-classification>
        <further-classification edition="200601120260306B">C08L67/02</further-classification>
        <further-classification edition="200601120260306B">C08G63/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＳＫ化學公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK CHEMICALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慎鏞埈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, YONG-JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金度均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DO-KYOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金聖基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNG-GI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金亥里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HAE-RI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SE-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種聚酯共聚物，其具有極佳物理特性及生物降解性，同時具有高含量之再循環原料。具體言之，該聚酯共聚物包含衍生自再循環原料之重複單元；衍生自二羧酸組分之重複單元；以及衍生自二醇組分之重複單元，其中該二羧酸組分包含環己烷二甲酸(CHDA)、環己烷二甲酸二甲酯(DMCD)或其組合。該聚酯共聚物由於其高含量之再循環原料而為環境友好的，且具有極佳物理特性及生物降解性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a polyester copolymer having excellent physical properties and biodegradability while it has a high content of a recycled raw material. Specifically, the polyester copolymer comprises a repeat unit derived from a recycled raw material; a repeat unit derived from a dicarboxylic acid component; and a repeat unit derived from a diol component, wherein the dicarboxylic acid component comprises cyclohexanedicarboxylic acid (CHDA), dimethyl cyclohexanedicarboxylate (DMCD), or a combination thereof. It is environmentally friendly by virtue of its high content of a recycled raw material and has excellent physical properties and biodegradability.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1427" publication-number="202625658">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625658</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135169</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發光顯示裝置</chinese-title>
        <english-title>LIGHT EMITTING DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251229B">H10K59/121</main-classification>
        <further-classification edition="202301120251229B">H10K59/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴栽賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JAE-HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭東烈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, DONG-RYUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁志碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JI-SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴濟範</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JE-BEOM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種發光顯示裝置，可包含位於一絕緣層之對應於一非發光區域之一表面上的多個下方凹凸圖案及位於一黑色矩陣之一表面上的多個上方凹凸圖案。此發光顯示裝置更可包含位於絕緣層之對應於一發光區域之一表面上的光控制凹凸圖案。下方凹凸圖案及/或上方凹凸圖案之形狀可根據一子像素區域而改變。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light emitting display device can include a plurality of lower uneven patterns on a surface of an insulating layer corresponding to a non-emission area and a plurality of upper uneven patterns on a surface of a black matrix. The light emitting display device can further include a light control uneven pattern on a surface of the insulating layer corresponding to an emission area. The shapes of the lower uneven pattern and/or the upper uneven pattern can be changed according to a sub-pixel region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:發光顯示裝置</p>
        <p type="p">110:半導體層</p>
        <p type="p">114:閘極電極</p>
        <p type="p">122:第一半導體接觸孔</p>
        <p type="p">124:第二半導體接觸孔</p>
        <p type="p">130:源極電極</p>
        <p type="p">132:汲極電極</p>
        <p type="p">140:第一電極</p>
        <p type="p">142:發光層</p>
        <p type="p">144:第二電極</p>
        <p type="p">147:側面</p>
        <p type="p">170:絕緣層</p>
        <p type="p">172:下方凹凸圖案</p>
        <p type="p">181:黑色矩陣之側面</p>
        <p type="p">190:色彩控制圖案</p>
        <p type="p">D:發光二極體</p>
        <p type="p">EA:發光區域</p>
        <p type="p">NEA:非發光區域</p>
        <p type="p">Tr:薄膜電晶體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1428" publication-number="202623871">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623871</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135198</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於重質進料以生產烯烴之電裂解加熱器</chinese-title>
        <english-title>ELECTRICAL CRACKING HEATER FOR HEAVY FEEDS TO PRODUCE OLEFINS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">B01D1/00</main-classification>
        <further-classification edition="200601120260302B">B01J19/00</further-classification>
        <further-classification edition="200601120260302B">B01J19/24</further-classification>
        <further-classification edition="200601120260302B">C10G9/24</further-classification>
        <further-classification edition="200601120260302B">C10G9/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商魯瑪斯科技有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUMMUS TECHNOLOGY LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑達蘭　肯達沙米　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNDARAM, KANDASAMY M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪亞勒　桑賈納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIALLE, SANJANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾爾薩伊德　謝里夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELSAYED, SHERIF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉伯　理察</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIBB, RICHARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙　寶終</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, BAOZHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥肯齊　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCKENZIE, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坎菲斯　瑪麗珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMPHUIS, MARIJN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於用於轉化烴混合物以生產烯烴之方法及系統，其包括第一預熱器、一或多個分離系統、次級傳輸管線交換器、熱裂解加熱器、初級傳輸管線交換器及流動管線。該方法包括預熱烴進料、分離經預熱烴流、加熱經蒸發烴且加熱液體烴流。該方法包括裂解經加熱烴流及第二經蒸發烴流，將經裂解烴產物流進料至初級傳輸管線交換器，且將經冷卻烴產物流進料至該次級傳輸管線交換器。用於靈活地轉化烴進料之方法包括預熱第二烴進料，繞過分離系統，且加熱並裂解烴流，將經裂解烴產物流進料至初級傳輸管線交換器進行驟冷，且將經冷卻烴產物流進料至該次級傳輸管線交換器以回收烴產物流。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Processes and systems for converting a hydrocarbon mixture to produce olefins including a first preheater, one or more separation systems, a secondary transferline exchanger, a thermal cracking heater, a primary transferline exchanger, and a flow line. The process includes preheating a hydrocarbon feed, separating the preheated hydrocarbon stream, heating the vaporized hydrocarbon, and heating the liquid hydrocarbon stream. The process includes cracking the heated hydrocarbon stream and the second vaporized hydrocarbon stream, feeding the cracked hydrocarbon product stream to a primary transferline exchanger, and feeding the cooled hydrocarbon product stream to the secondary transferline exchanger. The method for flexibly converting hydrocarbon feeds includes preheating a second hydrocarbon feed, bypassing a separation system, and heating and cracking the hydrocarbon stream, feeding the cracked hydrocarbon product stream to a primary transferline exchanger for quenching, and feeding the cooled hydrocarbon product stream to the secondary transferline exchanger to recover the hydrocarbon product stream.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:系統</p>
        <p type="p">201:烴進料</p>
        <p type="p">203:第一預熱器</p>
        <p type="p">206:經預熱烴流</p>
        <p type="p">209:稀釋蒸汽流</p>
        <p type="p">212:第二預熱器</p>
        <p type="p">215:經預熱稀釋蒸汽流</p>
        <p type="p">218:液體烴流</p>
        <p type="p">221:第三預熱器</p>
        <p type="p">224:第二經加熱烴流</p>
        <p type="p">227:分離系統</p>
        <p type="p">230:經蒸發烴流</p>
        <p type="p">233:次級傳輸管線交換器</p>
        <p type="p">236:烴產物流</p>
        <p type="p">239:經加熱之蒸發烴流</p>
        <p type="p">242:混合物</p>
        <p type="p">245:熱裂解加熱器</p>
        <p type="p">248:經裂解烴產物流</p>
        <p type="p">251:初級傳輸管線交換器</p>
        <p type="p">253:經冷卻烴產物流</p>
        <p type="p">E1,E2,E3:元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1429" publication-number="202623790">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623790</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135220</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有優異藍光吸收功效之蟲草黃烯</chinese-title>
        <english-title>CORDYLUTENES WITH EXTRAORDINARY EFFECT IN BLUE LIGHT ABSORPTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">A61K31/11</main-classification>
        <further-classification edition="200601120260309B">A61K31/12</further-classification>
        <further-classification edition="200601120260309B">A61K31/16</further-classification>
        <further-classification edition="200601120260309B">A61K31/19</further-classification>
        <further-classification edition="200601120260309B">A61K31/21</further-classification>
        <further-classification edition="200601120260309B">A61P27/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>百鵬天翔股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOINCARING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余浡維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, PO-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雅琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YA-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱順慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, SCHUNG-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭志玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及新穎化合物，其具有獨特結構特徵，且有效吸收藍光。此類化合物命名為蟲草黃烯，在預防及/或治療藍光引起的眼部損傷方面具有顯著的生物活性。本發明亦提供用於預防或治療眼部疾病（如乾眼症、白內障、青光眼或黃斑部病變）之方法及醫藥、化妝品或食品組合物，包含蟲草黃烯或其醫藥上、化妝品上或食品上可接受之鹽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention pertains to new compounds, possessing unique structural features, effective in blue light absorption. The compounds, named as Cordylutenes, show significant biological activity in the prevention and/or treatment of blue light-induced ocular damage. Also provided includes a method and a pharmaceutical, cosmetical or edible composition for preventing or treating an ocular disease, such as dry eye disease, cataracts, glaucoma, or macular degeneration, comprising the Cordylutenes or a pharmaceutically, cosmetically, or edibly acceptable salt thereof.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1430" publication-number="202625785">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625785</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135298</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多帶電粒子束描繪方法，及多帶電粒子束描繪裝置</chinese-title>
        <english-title>MULTI-CHARGED PARTICLE BEAM WRITING METHOD, AND MULTI-CHARGED PARTICLE BEAM WRITING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P76/00</main-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="200601120260302B">H01J37/305</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商紐富來科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUFLARE TECHNOLOGY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松本裕史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">多帶電粒子束描繪方法，其特徵為，運用第1係數算出射束陣列形狀的倍率修正量，其中該第1係數示意該取得的射束陣列形狀的平行於一面使供試料載置的平台連續移動一面做描繪的方向之第1方向的和設計座標呈比例而於第1方向偏離的偏離成分，運用第2係數算出射束陣列形狀的旋轉修正量，其中該第2係數示意和第1方向的取得的射束陣列形狀的設計座標呈比例而於和第1方向正交之第2方向偏離的偏離成分，基於第3係數與第4係數的至少任一者算出複數個單位區域的每一單位區域的調變劑量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multi-charged-particle-beam writing method includes calculating a magnification correction amount of an acquired beam array shape by using a first coefficient indicating a displacement component which deviates in a first direction in proportion to a design coordinate in the first direction of the acquired beam array shape, where the first direction is parallel to a direction of writing performed while continuously moving a stage with a target object thereon; calculating a rotation correction amount of the acquired beam array shape by using a second coefficient indicating a displacement component which deviates in a second direction, being orthogonal to the first direction, in proportion to a design coordinate in the first direction of the acquired beam array shape; and calculating a modulation dose amount for each unit region of a plurality of unit regions, based on at least one of a third coefficient, and a fourth coefficient.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S102~S140:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1431" publication-number="202623929">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623929</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135304</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>流體蒸發器</chinese-title>
        <english-title>FLUID VAPORIZERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">B23K1/20</main-classification>
        <further-classification edition="200601120260302B">F22B1/28</further-classification>
        <further-classification edition="202601120260302B">H10W99/00</further-classification>
        <further-classification edition="200601220260302B">B23K1/008</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商易爾德工程系統股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIELD ENGINEERING SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥考伊　克雷格　Ｗ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCCOY, CRAIG W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉克索寧　塔帕尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAAKSONEN, TAPANI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫德里阿夫采夫　弗拉基米爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUDRIAVTSEV, VLADIMIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加維　何塞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARVEY, JOSE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種蒸發器設備包含：一液體入口；複數個板，其等呈一堆疊配置且組態有界定使一液體通過該複數個板之一曲折路徑之開口及表面；一霧化器，其經組態以使來自該液體入口之液體霧化且使該液體之一噴霧朝向該複數個板之一第一板注射，其中該複數個板經組態以引導該液體自對應於該第一板之一第一端流動通過該曲折路徑且在對應於該複數個板之最後一板之該曲折路徑之一第二端處輸出該液體之一蒸汽；及至少一個加熱元件，其等經組態以加熱該複數個板以使該液體沿其通過該曲折路徑之流動蒸發且產生該蒸汽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A vaporizer apparatus includes a liquid inlet; a plurality of plates in a stacked arrangement and configured with openings and surfaces defining a tortuous path for a liquid through the plurality of plates; an atomizer configured to atomize liquid from the liquid inlet and inject a spray of the liquid toward a first plate of the plurality of plates, wherein the plurality of plates is configured to direct a flow of the liquid through the tortuous path from a first end corresponding to the first plate and output a vapor of the liquid at a second end of the tortuous path corresponding to a last plate of the plurality of plates; and at least one heating element configured to heat the plurality of plates to vaporize the liquid along its flow through the tortuous path and generate the vapor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">204:擋板總成</p>
        <p type="p">222:中心加熱器槽</p>
        <p type="p">232:加熱器槽</p>
        <p type="p">302-1:半球</p>
        <p type="p">302-2:半球</p>
        <p type="p">304-1:板</p>
        <p type="p">304-2:板</p>
        <p type="p">306:開口</p>
        <p type="p">320:分隔物</p>
        <p type="p">338:螺釘</p>
        <p type="p">340:螺母</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1432" publication-number="202624197">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624197</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135358</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包括胺基醇之金屬工作流體組成物及其用途</chinese-title>
        <english-title>METALWORKING FLUID COMPOSITIONS INCLUDING AMINO ALCOHOLS AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07C215/08</main-classification>
        <further-classification edition="200601120260302B">C07C217/08</further-classification>
        <further-classification edition="200601120260302B">C10M133/08</further-classification>
        <further-classification edition="200601120260302B">C10M169/04</further-classification>
        <further-classification edition="200601320260302B">C10N30/12</further-classification>
        <further-classification edition="200601320260302B">C10N30/16</further-classification>
        <further-classification edition="200601320260302B">C10N40/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商安達偉勝公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCION CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈維爾卡　凱瑟琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAVELKA, KATHLEEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴菲耶爾　丹尼斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUFFIERE, DENIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奎恩　喬丹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUINN, JORDAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雪佛　安德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHIFFER, ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁勝穩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, SHENGWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佩蒂特　馬克士威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PETIT, MAXWELL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明技術大體上係關於包括一式I化合物之金屬工作流體組成物，&lt;br/&gt;&lt;img align="absmiddle" height="133px" width="174px" file="ed10066.JPG" alt="ed10066.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;  其中R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;及R&lt;sup&gt;4&lt;/sup&gt;各自獨立地為H或C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;6&lt;/sub&gt;未經取代之烷基；其限制條件為R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;及R&lt;sup&gt;4&lt;/sup&gt;中之至少一者不為H；且其限制條件為該化合物具有4、5、6、7、8、9或10個碳原子。舉例而言，在具有一至少約7之pH的一金屬工作流體中包括一式I化合物可藉由提供多金屬腐蝕抑制、維持pH控制及/或穩定該金屬工作流體來增強該金屬工作流體之潤滑、清潔及/或處理特性。當包括一除生物劑時，該金屬工作流體可與該除生物劑協同作用，以抑制微生物生長且破壞現有的生物膜，從而延長金屬工作流體使用壽命，減少設備磨損，保持零件品質穩定，且降低流體處置對環境的負荷。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present technology relates generally to metalworking fluid compositions including a compound of Formula I&lt;br/&gt;&lt;img align="absmiddle" height="134px" width="173px" file="ed10067.JPG" alt="ed10067.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; where R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, R&lt;sup&gt;3&lt;/sup&gt;, and R&lt;sup&gt;4&lt;/sup&gt; are each independently H or C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;6&lt;/sub&gt; unsubstituted alkyl; provided at least one of R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, R&lt;sup&gt;3&lt;/sup&gt;, and R&lt;sup&gt;4&lt;/sup&gt; is not H; and provided that the compound has 4, 5, 6, 7, 8, 9, or 10 carbon atoms. For example, including a compound of Formula I in a metalworking fluid having a pH of at least about 7 may enhance the metalworking fluid's lubricating, cleaning, and/or handling properties by providing multi-metal corrosion inhibition, maintaining pH control, and/or stabilizing the metalworking fluid. When including a biocide, it may act synergistically with the biocide to inhibit microbial growth and disrupt existing biofilms, resulting in extended metalworking fluid life, reduced equipment wear, consistent part quality, and lower environmental load from fluid disposal.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1433" publication-number="202623821">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623821</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135382</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療神經性病症之反義寡核苷酸</chinese-title>
        <english-title>ANTISENSE OLIGONUCLEOTIDES FOR THE TREATMENT OF NEUROLOGICAL DISORDERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/7088</main-classification>
        <further-classification edition="201001120260302B">C12N15/113</further-classification>
        <further-classification edition="200601120260302B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＰＲＯＱＲ治療上市公司ＩＩ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PROQR THERAPEUTICS II B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商美國禮來大藥廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELI LILLY AND COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯斯　艾隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOS, ARON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史密斯　萊恩　馬修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMITH, RYAN MATTHEW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董　素才</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONG, SUCAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於由降低之突觸抑制所引起之疾病、較佳地由鉀(K) /氯(Cl)共同運輸蛋白2 (KCC2)之減小活性所引起之疾病之領域。本發明涉及寡核苷酸及其在RNA編輯方法中靶向編碼KCC2之人類&lt;i&gt;SLC12A5&lt;/i&gt;轉錄物分子中之各種靶腺苷的用途。該轉錄物分子經編輯，使得所得KCC2蛋白質具有獲得功能(gain-of-function)及/或不同功能，例如減小之自抑制。本發明係關於寡核苷酸，及其治療神經發育病症、神經精神性病症、慢性疼痛病症及/或癲癇之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure relates to the field of diseases caused by a lowered synaptic inhibition, preferably those that are caused by a diminished activity of the potassium (K) / chloride (Cl) Cotransporter 2 (KCC2). The disclosure involves oligonucleotides and the use thereof in RNA editing methods in targeting a variety of target adenosines in the human &lt;i&gt;SLC12A5&lt;/i&gt; transcript molecule that encodes KCC2. The transcript molecule is edited such that the resulting KCC2 protein has a gain-of-function and/or different function, for example reduced autoinhibition. The disclosure relates to oligonucleotides and their use in the treatment of neurodevelopment disorders, neuropsychiatric disorders, chronic pain disorders, and/or epilepsy.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1434" publication-number="202624198">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624198</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135443</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體器件之製造方法、半導體器件、樹脂及化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07C217/90</main-classification>
        <further-classification edition="200601120260302B">C07C229/64</further-classification>
        <further-classification edition="200601120260302B">C07C233/55</further-classification>
        <further-classification edition="200601120260302B">C07D311/86</further-classification>
        <further-classification edition="200601120260302B">C08F2/44</further-classification>
        <further-classification edition="200601120260302B">C08F222/10</further-classification>
        <further-classification edition="200601120260302B">C08F222/20</further-classification>
        <further-classification edition="200601120260302B">C08F222/22</further-classification>
        <further-classification edition="200601120260302B">C08F290/14</further-classification>
        <further-classification edition="200601120260302B">C08G73/10</further-classification>
        <further-classification edition="200601120260302B">C08G73/12</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/027</further-classification>
        <further-classification edition="200601120260302B">G03F7/038</further-classification>
        <further-classification edition="200601120260302B">G03F7/16</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="200601120260302B">G03F7/32</further-classification>
        <further-classification edition="202601120260302B">H10P76/20</further-classification>
        <further-classification edition="202601120260302B">H10W70/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野崎敦靖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOZAKI, ATSUYASU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種包含具有由下述式（A-1）表示之結構之樹脂之樹脂組成物、硬化上述組成物而成之硬化物及其製造方法、包含硬化物之積層體及其製造方法、半導體器件及其製造方法、以及新型樹脂及化合物。  &lt;br/&gt;&lt;img align="absmiddle" height="154px" width="365px" file="ed10110.JPG" alt="ed10110.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1435" publication-number="202624343">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624343</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135448</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬化性樹脂組成物、乾膜及硬化物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08G69/40</main-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/027</further-classification>
        <further-classification edition="200601120260302B">G03F7/031</further-classification>
        <further-classification edition="200601120260302B">G03F7/038</further-classification>
        <further-classification edition="200601120260302B">H05K3/28</further-classification>
        <further-classification edition="202601120260302B">H10W70/695</further-classification>
        <further-classification edition="202601120260302B">H10W74/47</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商太陽控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIYO HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴崎香帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBASAKI, KAHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石川信広</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIKAWA, NOBUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">議題：提供一種對矽基板顯示優異密接性之硬化性樹脂組成物；一種具備藉由該硬化性樹脂組成物所形成之樹脂層的乾膜；一種將該硬化性樹脂組成物或該乾膜之樹脂層硬化而成之硬化物。  &lt;br/&gt;　　解決方式：一種硬化性樹脂組成物，該硬化性樹脂組成物包含：(A)聚羥基醯胺化合物、(B)交聯劑、(C)具有酚性羥基及反應性雙鍵的化合物，及(D)光酸產生劑，前述(B)交聯劑包含於分子結構內具有選自由甲氧基甲基及羥甲基所組成的群組中至少一種的化合物，前述(A)聚羥基醯胺化合物包含下述式(1)及(2)表示之結構單元的化合物。  &lt;br/&gt;&lt;img align="absmiddle" height="172px" width="503px" file="ed10029.JPG" alt="ed10029.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　{式(1)中，R&lt;sup&gt;1&lt;/sup&gt;為2價之有機基，R&lt;sup&gt;2&lt;/sup&gt;為4價之有機基。}  &lt;br/&gt;&lt;img align="absmiddle" height="172px" width="507px" file="ed10030.JPG" alt="ed10030.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　{式(2)中，R&lt;sup&gt;3&lt;/sup&gt;為2價之有機基，R&lt;sup&gt;4&lt;/sup&gt;為不含羥基之2價之有機基。}</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1436" publication-number="202624344">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624344</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135450</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚羥基醯胺化合物、硬化性樹脂組成物、乾膜及硬化物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08G69/40</main-classification>
        <further-classification edition="200601120260302B">C08L77/06</further-classification>
        <further-classification edition="200601120260302B">C08K5/3492</further-classification>
        <further-classification edition="200601120260302B">C08K5/42</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/038</further-classification>
        <further-classification edition="200601120260302B">G03F7/039</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商太陽控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIYO HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴崎香帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBASAKI, KAHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石川信広</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIKAWA, NOBUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供：可對應PFAS規範，且顯示優異i線穿透率之聚羥基醯胺化合物；包含該聚羥基醯胺化合物之硬化性樹脂組成物；具有藉由該硬化性樹脂組成物所形成之樹脂層的乾膜；藉由該硬化性樹脂組成物或該乾膜之樹脂層所形成之硬化物。本發明之一形態係一種聚羥基醯胺化合物，其包含下述式(1)及(2)之結構單元，且不具有全氟烷基骨架。  &lt;br/&gt;&lt;img align="absmiddle" height="186px" width="496px" file="ed10029.JPG" alt="ed10029.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　{式(1)中，R&lt;sup&gt;1&lt;/sup&gt;為2價之有機基，R&lt;sup&gt;2&lt;/sup&gt;為4價之有機基。}  &lt;br/&gt;&lt;img align="absmiddle" height="190px" width="501px" file="ed10030.JPG" alt="ed10030.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　{式(2)中，R&lt;sup&gt;3&lt;/sup&gt;為2價之有機基，R&lt;sup&gt;4&lt;/sup&gt;為不含羥基之2價之有機基。}</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1437" publication-number="202623954">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623954</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135493</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>研磨墊</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260312B">B24B37/26</main-classification>
        <further-classification edition="201201120260312B">B24B37/24</further-classification>
        <further-classification edition="202601120260312B">H10P52/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士紡控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIBO HOLDINGS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>笹谷健太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASATANI, KENTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高見沢大和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAMIZAWA, YAMATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川崎哲明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASAKI, TETSUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>越智恵介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OCHI, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉本航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIMOTO, KOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳薏如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YIJU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於抑制於保持壓盤中之氣囊之邊界部分產生之波紋（Wavy）。  &lt;br/&gt;本發明之解決手段為一種研磨墊3，其具備：研磨層11，其形成有對被研磨物2進行研磨之研磨面；及基材層12，其設置於研磨層11之與研磨面相反之側。研磨層11之研磨面具備選自由格子槽、輻射槽、螺旋槽、同心圓槽及貫通孔所組成之群之至少一種表面結構，基材層12之研磨層側之接著面具備選自由格子槽、輻射槽、螺旋槽、同心圓槽及貫通孔所組成之群之至少一種表面結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:研磨裝置</p>
        <p type="p">2:被研磨物</p>
        <p type="p">3:研磨墊</p>
        <p type="p">4:研磨壓盤</p>
        <p type="p">5:保持壓盤</p>
        <p type="p">5a:頂環</p>
        <p type="p">5b:保持器</p>
        <p type="p">11:研磨層</p>
        <p type="p">11a:研磨層之研磨面之表面結構之槽(凹部)</p>
        <p type="p">12:基材層</p>
        <p type="p">12a:基材層之研磨層側之接著面之槽(凹部)</p>
        <p type="p">13:接著層</p>
        <p type="p">A:氣囊</p>
        <p type="p">A1~A6:第1~第6氣囊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1438" publication-number="202624297">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624297</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135500</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚合物、光阻劑組成物和形成圖案之方法</chinese-title>
        <english-title>POLYMERS, PHOTORESIST COMPOSITIONS AND METHODS OF FORMING PATTERNS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08F212/14</main-classification>
        <further-classification edition="200601120260302B">C08F220/28</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/039</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="202601120260302B">H10P76/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商杜邦電子材料國際有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔　莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUI, LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿卡德　埃馬德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AQAD, EMAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩欽塔尼　Ｋ　Ａ　尼拉達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SACHINTHANI, K. A. NIRADHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴鍾根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JONG KEUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李忠奉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHOONG-BONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜弼宰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, PHILJAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種聚合物，其包含衍生自包含芳香族基團的可聚合化合物的第一重複單元，其中該芳香族基團被以下取代：包含烯系不飽和雙鍵的第一取代基；第二取代基，其係羥基；以及包含羰基的第三取代基，其中第一取代基、第二取代基和第三取代基的羰基各自鍵結至芳香族基團的不同碳原子上；以及包含鹼不穩定基團的第二重複單元，其中第一重複單元和第二重複單元在結構上不同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A polymer comprising a first repeating unit derived from a polymerizable compound comprising an aromatic group, wherein the aromatic group is substituted with: a first substituent group comprising an ethylenically unsaturated double bond; a second substituent group that is a hydroxyl group; and a third substituent group comprising a carbonyl group, wherein the first substituent group, the second substituent group, and the carbonyl group of the third substituent group are each bonded to a different carbon atom of the aromatic group; and a second repeating unit comprising a base-labile group, wherein the first repeating unit and the second repeating unit are structurally different.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1439" publication-number="202624285">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624285</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135526</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬塗層形成用組成物、硬塗層、偏光板及圖像顯示裝置</chinese-title>
        <english-title>HARD COAT LAYER FORMING COMPOSITION, HARD COAT LAYER, POLARIZER, AND IMAGE DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08F2/44</main-classification>
        <further-classification edition="200601120260302B">C08F220/32</further-classification>
        <further-classification edition="200601120260302B">C08F222/10</further-classification>
        <further-classification edition="200601120260302B">C09D4/02</further-classification>
        <further-classification edition="201801120260302B">C09D7/63</further-classification>
        <further-classification edition="200601120260302B">C09D5/00</further-classification>
        <further-classification edition="201501120260302B">G02B1/14</further-classification>
        <further-classification edition="200601120260302B">G02B5/30</further-classification>
        <further-classification edition="200601120260302B">G09F9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福田謙一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUDA, KENICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萩原慎也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAGIHARA, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>太田裕史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTA, HIROFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仲西雄亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANISHI, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係提供一種硬塗層形成用組成物，其係用以形成可抑制於偏光板中紅變產生的硬塗層。  &lt;br/&gt;就解決手段而言，本發明係提供一種硬塗層形成用組成物，其包含單體成分與自由基聚合起始劑，其中，含有前述單體成分為具有(甲基)丙烯醯基之丙烯酸系單體(a)，前述丙烯酸系單體(a)的至少一部份為具有環氧基之單體(a1)，前述丙烯酸系單體(a)的至少一部份為具有2個以上(甲基)丙烯醯基之單體(a2)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the present invention is to provide a hard coat layer forming composition that is used to form a hard coat layer capable of suppressing red color shift when used in a polarizer. &lt;br/&gt;As a means for achieving the object, the present invention provides a hard coat layer forming composition, which comprises a monomer component and a radical polymerization initiator, wherein the monomer component contains an acrylic monomer (a) having a (meth)acryloyl group, and at least a part of the acrylic monomer (a) is a monomer (a1) having an epoxy group, and at least a part of the acrylic monomer (a) is a monomer (a2) having two or more (meth)acryloyl groups.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:偏光板</p>
        <p type="p">11:偏光片</p>
        <p type="p">12:第一保護膜</p>
        <p type="p">13:第二保護膜</p>
        <p type="p">14:第一貼合層</p>
        <p type="p">15:第二貼合層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1440" publication-number="202625096">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625096</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135536</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>經組態以判定影像圖框之姿態之定位模型之集成之校準</chinese-title>
        <english-title>CALIBRATION OF ENSEMBLE OF LOCALIZATION MODELS CONFIGURED TO DETERMINE POSE OF IMAGE FRAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120260305B">G06T19/00</main-classification>
        <further-classification edition="201701120260305B">G06T7/73</further-classification>
        <further-classification edition="202201120260305B">G06V20/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商尼安蒂克空間股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIANTIC SPATIAL, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布萊奇曼　艾利克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRACHMANN, ERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡瓦萊利　圖瑪索</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAVALLARI, TOMMASO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布里沙卡劉　維克多　艾德里安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRISACARIU, VICTOR ADRIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊名宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種系統利用定位器之一集成來執行基於影像之定位。系統接收來自由一用戶端裝置之一相機總成擷取之影像資料之一目標圖框。系統部署定位器之一集成，每一定位器經不同方式訓練以輸出目標圖框之一姿態以及該姿態之一模型特定置信度。系統藉由應用一模型特定校準變換以將每一模型特定置信度變換為一經校準置信度而校準該模型特定置信度。系統藉由基於經校準置信度而彙總由集成輸出之姿態來判定目標圖框之一最終姿態。系統可利用基於影像之定位來提供一視覺位置測定服務(VPS)。系統亦可利用基於影像之定位來產生擴增實境內容以呈現給一使用者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system performs image-based localization with an ensemble of localizers. The system receives a target frame from image data captured by a camera assembly of a client device. The system deploys an ensemble of localizers, each disparately trained to output a pose of the target frame and a model-specific confidence for the pose. The system calibrates each model-specific confidence by applying a model-specific calibration transformation to transform the model-specific confidence to a calibrated confidence. The system determines a final pose for the target frame by aggregating the poses output by the ensemble based on the calibrated confidences. The system may provide a visual positioning service (VPS) with the image-based localization. The system may also leverage the image-based localization to generate augmented reality content for presentation to a user.</p>
      </isu-abst>
      <representative-img>
        <p type="p">700:校準</p>
        <p type="p">710:步驟</p>
        <p type="p">720:步驟</p>
        <p type="p">730:步驟</p>
        <p type="p">740:步驟</p>
        <p type="p">750:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1441" publication-number="202625387">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625387</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135581</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>家用網路系統及其高速家用網路傳送裝置以及高速家用網路接收裝置</chinese-title>
        <english-title>HOME NETWORK SYSTEM AND HIGH-SPEED HOME NETWORK TRANSMISSION DEVICE AND HIGH-SPEED HOME NETWORK RECEIVING DEVICE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H04B1/02</main-classification>
        <further-classification edition="200601120260102B">H04B3/03</further-classification>
        <further-classification edition="200601120260102B">H04L27/28</further-classification>
        <further-classification edition="200601120260102B">H04B1/16</further-classification>
        <further-classification edition="200601120260102B">H04L12/40</further-classification>
        <further-classification edition="201301120260102B">H04B10/278</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜　至真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, ZHI-ZHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹　孟頡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAO, MENG-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種家用網路系統。第一網路節點的高速家用網路傳送裝置將資料流的資料訊號進行分流、處理與升頻產生對應獨立的射頻頻帶的升頻資料訊號，再合併產生傳送資料訊號透過有線傳輸媒介進行傳送。第二網路節點的高速家用網路接收裝置對傳送資料訊號進行分離、降頻以及處理以產生處理資料訊號，再重組以產生資料訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A home network system is provided. A first network node includes a high-speed home network transmitting device to split, process and perform frequency up-shifting on a data signal to generate up-shifted data signals corresponding to radio frequency bands different and independent from each other so as to be combined to generate a transmitting data signal to be transmitted through a wired transmission media. A second network node includes a high-speed home network receiving device to separate, perform frequency down-shifting on and process the transmitting data signal to generate processed data signals to be reconstructed to generate the data signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">220:高速家用網路傳送裝置</p>
        <p type="p">300:流量分流電路</p>
        <p type="p">310:傳送電路</p>
        <p type="p">320:混頻電路</p>
        <p type="p">330:合併電路</p>
        <p type="p">DS:資料訊號</p>
        <p type="p">FPS&lt;sub&gt;1&lt;/sub&gt;~FPS&lt;sub&gt;N&lt;/sub&gt;:第一處理資料訊號</p>
        <p type="p">SDS&lt;sub&gt;1&lt;/sub&gt;~SDS&lt;sub&gt;N&lt;/sub&gt;:分流資料訊號</p>
        <p type="p">TC&lt;sub&gt;1&lt;/sub&gt;~TC&lt;sub&gt;N&lt;/sub&gt;:傳送電路</p>
        <p type="p">TDS:傳送資料訊號</p>
        <p type="p">TMC&lt;sub&gt;1&lt;/sub&gt;~TMC&lt;sub&gt;N&lt;/sub&gt;:混頻電路</p>
        <p type="p">UDS&lt;sub&gt;1&lt;/sub&gt;~UDS&lt;sub&gt;N&lt;/sub&gt;:升頻資料訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1442" publication-number="202624552">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624552</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135587</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於電氯化的陽極及其製造方法</chinese-title>
        <english-title>ANODE FOR ELECTROCHLORINATION AND METHOD FOR MAKING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260302B">C25B11/052</main-classification>
        <further-classification edition="202101120260302B">C25B11/093</further-classification>
        <further-classification edition="200601120260302B">C25B1/26</further-classification>
        <further-classification edition="200601120260302B">C25B1/34</further-classification>
        <further-classification edition="202101120260302B">C25B9/00</further-classification>
        <further-classification edition="202301120260302B">C02F1/461</further-classification>
        <further-classification edition="202301120260302B">C02F1/467</further-classification>
        <further-classification edition="202301120260302B">C02F1/50</further-classification>
        <further-classification edition="200601120260302B">A01N59/00</further-classification>
        <further-classification edition="200601120260302B">A01P1/00</further-classification>
        <further-classification edition="200601320260302B">C02F103/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義商第諾拉工業公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIE DE NORA S. P. A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堤帕諾　法比歐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIMPANO, FABIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉恩廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <address></address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種陽極，包括基材及催化塗層，該催化塗層基本上由氧化釕及氧化錫組成，其中該氧化釕的含量依金屬重量計為該氧化釕及氧化錫總重量的20%至60%，其中該氧化錫的含量以金屬重量計為該氧化釕及氧化錫總重量的40%至80%。本發明也涉及包括本發明陽極的電解器在海水電氯化中的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention related to an anode comprising a substrate and a catalytic coating, said catalytic coating consisting essentially of ruthenium oxide and tin oxide, wherein said ruthenium oxide is present in an amount comprised between 20% and 60% by weight referred to metals with respect to the total weight of said ruthenium oxide and tin oxide, wherein said tin oxide is present in an amount comprised between 40% and 80% by weight referred to metals with respect to the total weight of said ruthenium oxide and tin oxide. The present invention also related to the use of an electrolyser comprising the anode of the present invention in seawater electrochlorination.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1443" publication-number="202624774">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624774</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135591</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多模式感測器、安裝於系統單晶片上的感測器的多模式感測方法及系統單晶片</chinese-title>
        <english-title>MULTI-MODE SENSOR, MULTI-MODE SENSING METHOD OF A SENSOR MOUNTED ON A SYSTEM-ON-CHIP AND SYSTEM-ON-CHIP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260223B">G01R31/3187</main-classification>
        <further-classification edition="200601120260223B">G01R29/02</further-classification>
        <further-classification edition="201401120260223B">H03K5/13</further-classification>
        <further-classification edition="201401120260223B">H03K5/133</further-classification>
        <further-classification edition="200601120260223B">H03K21/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭賢基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, HYUNKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜在旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, JAEWOOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴泳勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, YOUNG HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴熙昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EOM, HUICHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金昇辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SEUNGJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳承賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, SEUNGHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露一種多模式感測器。感測器包括脈衝產生器，經組態以基於選擇的感測模式產生時鐘信號、階躍脈衝信號、以及視窗信號中的至少一者。感測器更包括延遲鏈，經組態以回應時鐘信號或階躍脈衝信號輸出通過複數個延遲元件傳輸的延遲時鐘信號，以及定義選擇間隔的視窗信號。加法器經組態以計數選擇的延遲時鐘信號的數量並輸出對應的計數值。感測模式包括以下之一：用於檢測時鐘信號中的抖動的抖動感測模式、用於評估延遲元件的時序特性的處理器角感測模式、以及用於確定時鐘信號的工作比的工作比感測模式。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multi-mode sensor is disclosed. The sensor includes a pulse generator configured to generate at least one of a clock signal, a step pulse signal, and a window signal based on a selected sensing mode. The sensor further includes a delay chain configured to output delay clock signals transmitted through a plurality of delay elements in response to the clock signal or the step pulse signal, and a window signal defining a selection interval. An adder is configured to count the number of selected delay clock signals and output a corresponding count value. The sensing mode includes one of: a jitter sensing mode for detecting jitter in the clock signal, a processor corner sensing mode for evaluating a timing characteristic of the delay elements, and a duty ratio sensing mode for determining a duty ratio of the clock signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1400:多模式感測器</p>
        <p type="p">1420:脈衝產生器</p>
        <p type="p">1440:延遲鏈</p>
        <p type="p">1460:加法器</p>
        <p type="p">FIN:輸入時鐘信號</p>
        <p type="p">OUT:輸出信號</p>
        <p type="p">Q[0]、Q[1]、Q[i]:鎖存信號</p>
        <p type="p">S_Mode:感測模式</p>
        <p type="p">DIV2:分割時鐘信號</p>
        <p type="p">WIN:視窗信號</p>
        <p type="p">RST:重置信號</p>
        <p type="p">SP:階躍脈衝</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1444" publication-number="202624272">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624272</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135608</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>群落刺激因子1受體抗體及其使用方法</chinese-title>
        <english-title>COLONY STIMULATING FACTOR 1 RECEPTOR ANTIBODIES AND METHODS OF USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07K16/28</main-classification>
        <further-classification edition="200601120260302B">A61K39/395</further-classification>
        <further-classification edition="200601120260302B">C12N15/861</further-classification>
        <further-classification edition="200601120260302B">A61P27/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大塚製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKA PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錦織伸吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIKORI, SHINGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫吉　阿敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURJI, AMYN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布勞西　尼可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROSSI, NICOLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維斯瓦納譚　卡地克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VISWANATHAN, KARTHIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉瑪克里斯奈　蘭基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMAKRISHNAN, RAMKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伍鐸　尼可拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOODALL, NICHOLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渥拉寇特　安德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOLLACOTT, ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹燡周</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIN, YIZHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴柏考克　葛列格里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BABCOCK, GREGORY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黒岩善巳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUROIWA, YOSHIMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大本浩嗣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHMOTO, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明尤其提供對CSF1R具有高親和力(例如K&lt;sub&gt;D&lt;/sub&gt;為pM至低nM)的抗CSF1R單域抗體(single-domain antibody；sdAb)，以及此等sdAb有效地治療CSF1R介導之疾病(諸如老年性黃斑部病變(age-related macular degeneration；AMD))的治療用途。在一些實施例中，抗CSF1R sdAb與Fc區融合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides, among other things, anti-CSF1R single-domain antibodies (sdAbs) with high affinity to CSF1R (e.g., K&lt;sub&gt;D&lt;/sub&gt; of pM to low nM) and therapeutic uses of such sdAbs in effectively treating CSF1R mediated diseases, such as age-related macular degeneration (AMD). In some embodiments, an anti-CSF1R sdAb is fused to an Fc region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1445" publication-number="202624372">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624372</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135692</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚酯分解物的製造方法及聚酯的製造方法</chinese-title>
        <english-title>METHOD FOR PRODUCING POLYESTER DECOMPOSITION PRODUCT AND METHOD FOR PRODUCING POLYESTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08J11/24</main-classification>
        <further-classification edition="200601120260302B">C08J11/26</further-classification>
        <further-classification edition="200601120260302B">C07C67/03</further-classification>
        <further-classification edition="200601120260302B">C07C67/48</further-classification>
        <further-classification edition="200601120260302B">C07C69/82</further-classification>
        <further-classification edition="200601120260302B">C07C29/128</further-classification>
        <further-classification edition="200601120260302B">C07C29/74</further-classification>
        <further-classification edition="200601120260302B">C07C31/20</further-classification>
        <further-classification edition="202001120260302B">C07C68/06</further-classification>
        <further-classification edition="200601120260302B">C07C69/96</further-classification>
        <further-classification edition="200601120260302B">C08G63/78</further-classification>
        <further-classification edition="200601120260302B">C08G63/183</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商旭化成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高垣和弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAGAKI, KAZUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本實施型態之聚酯分解物的製造方法係具有下列步驟：分解步驟，其係使包含鹼、一元醇及碳酸二酯的聚酯分解用組成物與含聚酯之材料接觸，分解前述含聚酯之材料中的聚酯，從而獲得聚酯分解物；鹼減除步驟，其係減除前述聚酯分解物中所包含的前述鹼之含量；脫水步驟，其係於前述鹼減除步驟後，脫水前述聚酯分解物；以及，精製步驟，其係於前述脫水步驟後，從前述聚酯分解物分離環狀碳酸酯。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for producing a polyester decomposition product according to the present embodiment comprises: a decomposition step of bringing a polyester-decomposing composition containing a base, a monohydric alcohol, and a carbonic acid diester into contact with a polyester-containing material to decompose the polyester in the polyester-containing material, thereby obtaining a polyester decomposition product; a base reduction step of reducing the content of the base contained in the polyester decomposition product; a dehydration step of dehydrating the polyester decomposition product after the base reduction step; and a purification step of separating a cyclic carbonic acid ester from the polyester decomposition product after the dehydration step.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1446" publication-number="202624817">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624817</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135703</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>混合折射和超穎光學鏡頭相機模組</chinese-title>
        <english-title>HYBRID REFRACTIVE AND META-OPTICAL LENS CAMERA MODULE FIELD OF INVENTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260312B">G02B7/02</main-classification>
        <further-classification edition="200601120260312B">G02B3/06</further-classification>
        <further-classification edition="201101120260312B">B82Y20/00</further-classification>
        <further-classification edition="202101120260312B">G03B17/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹麥商尼爾技術有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIL TECHNOLOGY APS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈什米　艾赫桑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHEMI, EHSAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬廷森　弗雷德裏克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATTINSON, FREDRIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施密德林　莫里茨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHMIDLIN, MORITZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>誇德　烏爾裏希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUAADE, ULRICH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供了混合鏡頭光學成像系統。混合鏡頭光學成像系統包括具有彎曲的前表面和平坦的後表面的折射鏡頭，具有設置在基底上的至少一個超穎光學元件結構的超穎光學元件堆疊，以及具有最大成像圓直徑的影像感測器。折射鏡頭的平坦的後表面黏接到超穎光學元件堆疊的前側，並且超穎光學元件堆疊的後側黏接到影像感測器。此外，混合鏡頭光學成像系統的總光路長度與影像感測器的最大成像圓直徑的比率小於1.3。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A hybrid lens optical imaging system is provided herein. The hybrid lens optical imaging system includes a refractive lens having a curved front surface and a planar rear surface, a meta-optical element stack having at least one meta-optical element structure disposed on a substrate, and an image sensor having a maximum image circle diameter. The planar rear surface of the refractive lens is bonded to a front side of the meta-optical element stack, and a rear side of the meta-optical element stack is bonded to the image sensor. Additionally, a ratio of a total track length of the hybrid lens optical imaging system to the maximum image circle diameter of the image sensor is less than 1.3.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1447" publication-number="202623716">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623716</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135849</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>巧克力樣食品、組合有巧克力樣食品之飲食品，以及巧克力樣食品之保管適應性及作業適應性之改善方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">A23G1/36</main-classification>
        <further-classification edition="200601120260309B">A23D9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商不二製油股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJI OIL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村太喜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, TAIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓孟儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]  &lt;br/&gt;本發明之課題在於提供一種於常溫溫度範圍內作業性優異、不滲出之巧克力樣食品。  &lt;br/&gt;[解決手段]  &lt;br/&gt;藉由本發明，發現藉由滿足以下(a)至(e)之所有條件：  &lt;br/&gt;(a)  所含油分中之構成脂肪酸中碳數12及14之飽和脂肪酸所佔之總量為20至48質量%，  &lt;br/&gt;(b)  所含油分中之構成脂肪酸中碳數18之不飽和脂肪酸所佔之總量為37至59質量%，  &lt;br/&gt;(c)  水分低於3質量%，  &lt;br/&gt;(d)  油分為35至70質量%，  &lt;br/&gt;(e)  包含含有40質量%以上山崳酸之甘油脂肪酸酯0.5至2質量%，  &lt;br/&gt;可提供於常溫溫度範圍內作業性優異、不滲出之巧克力樣食品。  &lt;br/&gt;本發明亦提供一種組合有巧克力樣食品之飲食品，以及巧克力樣食品之保管適應性及作業適應性之改善方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1448" publication-number="202623895">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623895</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135853</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>二矽烷之催化製備</chinese-title>
        <english-title>CATALYTIC PREPARATION OF DISILANES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">B01J31/12</main-classification>
        <further-classification edition="200601120260302B">B01J37/00</further-classification>
        <further-classification edition="200601120260302B">C07F7/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加州大學董事會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE REGENTS OF THE UNIVERSITY OF CALIFORNIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菲格羅亞　約書亞　Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FIGUEROA, JOSHUA S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧菲　肖恩　Ｐ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUNPHY, SEAN P.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種式(I)之催化劑：  &lt;br/&gt;&lt;img align="absmiddle" height="159px" width="216px" file="ed10021.JPG" alt="ed10021.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;其中Ar為經取代或未經取代之芳基；且E&lt;sup&gt;1&lt;/sup&gt;及E&lt;sup&gt;2&lt;/sup&gt;個別地為具有雙鍵或參鍵之部分，或其中E&lt;sup&gt;1&lt;/sup&gt;與E&lt;sup&gt;2&lt;/sup&gt;接合在一起以與其所鍵結的Ni形成環狀結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A catalyst of formula (I): &lt;br/&gt;&lt;img align="absmiddle" height="156px" width="234px" file="ed10022.JPG" alt="ed10022.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;where Ar is a substituted or unsubstituted aryl group; and E&lt;sup&gt;1&lt;/sup&gt; and E&lt;sup&gt;2&lt;/sup&gt; are, individually, a moiety having a double or triple bond, or where E&lt;sup&gt;1&lt;/sup&gt; and E&lt;sup&gt;2&lt;/sup&gt; join together to form a cyclic structure with the Ni to which they are bound.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1449" publication-number="202624145">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624145</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135907</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>臭氧水生成裝置以及臭氧水生成方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260302B">C02F1/68</main-classification>
        <further-classification edition="202201120260302B">B01F21/00</further-classification>
        <further-classification edition="202201120260302B">B01F23/2326</further-classification>
        <further-classification edition="202201120260302B">B01F25/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商明電舍股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEIDENSHA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三浦敏徳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIURA, TOSHINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉本啓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIMOTO, KEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樹
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>花倉満</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KEKURA, MITSURU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清家聡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEIKE, SATORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">於臭氧水生成裝置(1)中，儲槽(2)係儲留水。泵浦(3)係配置於儲槽(2)之下方。噴射器(4)，係垂直配置於儲槽(2)與泵浦(3)之間，對於自該儲槽(2)導入之前述水注入自外部吸引之臭氧氣體，並吐出臭氧水。送回管線(5)，係將前述吐出之前述臭氧水送回儲槽(2)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:臭氧水生成裝置</p>
        <p type="p">2:儲槽</p>
        <p type="p">21:供水管線</p>
        <p type="p">22:排水管線</p>
        <p type="p">23:排氣管線</p>
        <p type="p">24,25:氣體供給管線</p>
        <p type="p">26:壓力計</p>
        <p type="p">3:泵浦</p>
        <p type="p">4:噴射器</p>
        <p type="p">41:注入管線</p>
        <p type="p">5:送回管線</p>
        <p type="p">51:流量計</p>
        <p type="p">6:臭氧水吸引管線</p>
        <p type="p">7:排出管線</p>
        <p type="p">71:濃度計</p>
        <p type="p">8:臭氧分解器</p>
        <p type="p">V1,V2,V3,V4,V5,V6,V7:流量控制閥</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1450" publication-number="202624811">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624811</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135912</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光連接器插頭</chinese-title>
        <english-title>OPTICAL CONNECTOR PLUG</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">G02B6/36</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商本多通信工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONDA TSUSHIN KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>関真二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKI, SHINJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大久保靖明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHKUBO, YASUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉崎毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIZAKI, TSUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光連接器插頭，具有：套管，用以保持光纖；插頭框架，其相對地配置有一對彈性卡止片，並位於該套管的後端側；耦合器，其可相對滑動地設置於插頭框架，並包括：用以限制該套管朝前端側移動的擋塊；用以限制插頭框架朝後端側移動的開口的內周面；以及施力部，其抵接於彈性卡止片，並藉由相對於插頭框架朝後端側滑動，以對一對彈性卡止片施力，使其朝外側彈性變形；以及螺旋彈簧，其以收縮狀態設置於插頭框架與套管之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical connector plug has a ferrule for holding an optical fiber, a plug frame located on a rear side of the ferrule and including a pair of elastic locking pieces disposed so as to face each other, a coupling provided so as to be slidable with respect to the plug frame and including a stopper for restricting movement of the ferrule toward a tip side, an inner peripheral surface of an opening for restricting movement of the plug frame toward the rear side, and biasing portions configured to abut against the elastic locking pieces and slide with respect to the plug frame toward the rear side end to bias the pair of elastic locking pieces and thereby elastically deform the pair of elastic locking pieces toward an outer side, and a coil spring provided between the plug frame and the ferrule in a contracted state.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:光連接器插頭</p>
        <p type="p">3:光纖</p>
        <p type="p">21:套管</p>
        <p type="p">21a:前端面</p>
        <p type="p">21b:後端面</p>
        <p type="p">22:密封構件</p>
        <p type="p">23:導引銷</p>
        <p type="p">24:銷擋塊</p>
        <p type="p">25:螺旋彈簧</p>
        <p type="p">26:插頭框架</p>
        <p type="p">27:護套</p>
        <p type="p">28:耦合器</p>
        <p type="p">29:護蓋</p>
        <p type="p">35:露出部</p>
        <p type="p">211:前端部</p>
        <p type="p">212:後端部</p>
        <p type="p">214:孔</p>
        <p type="p">218:凹部</p>
        <p type="p">261d:突起</p>
        <p type="p">269:彈性卡止片</p>
        <p type="p">269a:爪部</p>
        <p type="p">272:光纖插通孔</p>
        <p type="p">282:擋塊</p>
        <p type="p">283:開口</p>
        <p type="p">283a:內周面</p>
        <p type="p">284:開口</p>
        <p type="p">285:施力部</p>
        <p type="p">291:凸緣</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1451" publication-number="202625839">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625839</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135931</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及在空白區域中形成開口以減少晶圓翹曲的方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING OPENINGS IN BLANK AREA TO REDUCE WAFER WARPAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W70/68</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商星科金朋私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STATS CHIPPAC PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>左健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZUO, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭　明儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEH, BENG YEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　麗珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, LEE SUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種半導體裝置，其具有基板，其中該基板之一部分構成無導電層之空白區域。在該空白區域上方形成第一絕緣層。在該第一絕緣層上方形成第二絕緣層。在該空白區域上方之該第一絕緣層中形成複數個第一開口。在該空白區域上方之該第二絕緣層中形成複數個第二開口。這些第一開口與第二開口可排列成平行的列、橢圓形、圓形、蛇形、隨機或其他幾何形狀。這些第二開口之一部分與這些第一開口對準。這些第二開口之一部分相對於這些第一開口偏移。可在該空白區域內之該基板上方形成排列為複數個絕緣材料島狀物之第三絕緣層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device has a substrate where a portion of the substrate constitutes a blank area absent a conductive layer. A first insulating layer is formed over the blank area. A second insulating layer is formed over the first insulating layer. A plurality of first openings is formed in the first insulating layer over the blank area. A plurality of second openings is formed in the second insulating layer over the blank area. The first openings and second openings can be arranged in parallel rows, oval, circular, serpentine, random, or other geometric shape. A portion of the second openings is aligned with the first openings. A portion of the second openings is offset with respect to the first openings. A third insulating layer, arranged as a plurality of islands of insulating material, can be formed over the substrate within the blank area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體晶圓</p>
        <p type="p">102:基礎基板材料/基礎半導體材料</p>
        <p type="p">108:背表面/非主動表面</p>
        <p type="p">110:主動層</p>
        <p type="p">112:導電層</p>
        <p type="p">120:囊封物</p>
        <p type="p">122:絕緣層/鈍化層</p>
        <p type="p">124:導電層</p>
        <p type="p">125:表面</p>
        <p type="p">126:空白區域/非導電區域</p>
        <p type="p">136:絕緣層/鈍化層</p>
        <p type="p">137:開口</p>
        <p type="p">138:導電層</p>
        <p type="p">139:表面</p>
        <p type="p">140:開口</p>
        <p type="p">144:圖案</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1452" publication-number="202624485">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624485</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135946</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>突變型蔗糖合成酶、編碼突變型蔗糖合成酶之核酸、表達載體、轉形體、突變型蔗糖合成酶之製造方法、包含突變型蔗糖合成酶之組成物、尿核苷二磷酸－葡萄糖之製造方法、糖化合物之製造方法</chinese-title>
        <english-title>MUTANT SUCROSE SYNTHASE, NUCLEIC ACID ENCODING MUTANT SUCROSE SYNTHASE, EXPRESSION VECTOR, TRANSFORMANT, METHOD FOR PRODUCING MUTANT SUCROSE SYNTHASE, COMPOSITION CONTAINING MUTANT SUCROSE SYNTHASE, METHOD FOR PRODUCING URIDINE DIPHOSPHATE-GLUCOSE, METHOD FOR PRODUCING SUGAR COMPOUND</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C12N9/10</main-classification>
        <further-classification edition="200601120260302B">C12N15/63</further-classification>
        <further-classification edition="200601120260302B">C12N15/64</further-classification>
        <further-classification edition="200601120260302B">C12P19/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木下恭子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINOSHITA, KYOKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>園田雄輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONODA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寺田大介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TERADA, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>髙橋基将</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, MOTOMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">突變型蔗糖合成酶滿足以下（1）和/或（2），並且具有相對於序列編號1的胺基酸序列具有70%以上的同一性之胺基酸序列。（1）將與序列編號1的胺基酸序列中的從N末端起第348個對應之胺基酸殘基取代為作為該胺基酸殘基以外的胺基酸且與取代前相比酶活性提高之胺基酸。（2）將與序列編號1的胺基酸序列中的從N末端起第618個對應之胺基酸殘基取代為作為該胺基酸殘基以外的胺基酸且與取代前相比酶活性提高之胺基酸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1453" publication-number="202625353">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625353</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135969</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有電壓調節單元及共用參考電壓之可組態電力管理積體電路</chinese-title>
        <english-title>CONFIGURABLE POWER MANAGEMENT INTEGRATED CIRCUIT WITH VOLTAGE REGULATION UNITS AND SHARED REFERENCE VOLTAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">H02M3/158</main-classification>
        <further-classification edition="200601120260309B">H02M3/00</further-classification>
        <further-classification edition="200601120260309B">G06F1/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商能源萊堤斯科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWERLATTICE TECHNOLOGIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任　剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REN, GANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒　鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZOU, PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德莫　蘇吉斯　Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DERMAL, SUJITH S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂正忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請案係關於為一電子系統提供導軌電壓。一電子系統包括第一小晶片及第二小晶片。該第一小晶片及該第二小晶片中之各者包括經組態以提供一電壓調節器集合之複數個電壓調節單元。該第一小晶片亦包括一參考電路，該參考電路電耦接至該電壓調節器集合且經組態以產生一參考電壓。此外，該第一小晶片之電壓調節器集合經組態以基於來自該參考電路之該參考電壓而產生一導軌電壓。另外，該第一小晶片之該電壓調節器集合經組態以將該導軌電壓提供至一電力導軌，且將該參考電壓提供至該第二小晶片之該調電壓節器集合以產生相同或不同的導軌電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application is directed to providing rail voltages for an electronic system. In some examples, an electronic system includes a first chiplet and a second chiplet. Each of the first chiplet and second chiplet include a plurality of voltage regulation units configured to provide a voltage regulator set. The first chiplet also includes a reference circuit electrically coupled to the voltage regulator set and configured to generate a reference voltage. Further, the first voltage regulator set of the first chiplet is configured to generate a rail voltage based on the reference voltage from the reference circuit. In addition, the voltage regulator set of the first chiplet is configured to provide the rail voltage to a power rail, and provide the reference voltage to the regulator set of the second chiplet to generate the same or different rail voltage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">800:電子系統</p>
        <p type="p">802:第一電壓調節小晶片</p>
        <p type="p">803:電壓調節單元</p>
        <p type="p">807,807-A,827,827-A,827-D,847,847-C,847-D:接腳</p>
        <p type="p">822:第二電壓調節小晶片</p>
        <p type="p">823:電壓調節單元</p>
        <p type="p">842:第三電壓調節小晶片</p>
        <p type="p">843:電壓調節單元</p>
        <p type="p">855:第一分組</p>
        <p type="p">865:第二分組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1454" publication-number="202623713">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623713</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135972</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>作為除草劑的取代的二環醯胺衍生物</chinese-title>
        <english-title>SUBSTITUTED BICYCLIC AMIDE DERIVATIVES AS HERBICIDES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">A01N43/653</main-classification>
        <further-classification edition="200601120260302B">A01N43/32</further-classification>
        <further-classification edition="200601120260302B">A01N43/26</further-classification>
        <further-classification edition="200601120260302B">A01N43/84</further-classification>
        <further-classification edition="200601120260302B">A01P13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商富曼西公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FMC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科米里謝蒂　卡希納特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMIRISHETTY, KASHINATH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德　薩普塔什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE, SAPTARSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林發立</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露了式&lt;b&gt;1&lt;/b&gt;的化合物，包括其所有立體異構物、&lt;i&gt;N&lt;/i&gt;-氧化物和鹽，  &lt;br/&gt;&lt;img align="absmiddle" height="172px" width="298px" file="ed10157.JPG" alt="ed10157.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;其中  &lt;br/&gt;Q、X&lt;sup&gt;1&lt;/sup&gt;、X&lt;sup&gt;2&lt;/sup&gt;、X&lt;sup&gt;3&lt;/sup&gt;、X&lt;sup&gt;4&lt;/sup&gt;和X&lt;sup&gt;5&lt;/sup&gt;、A、V、R&lt;sup&gt;1&lt;/sup&gt;、Y&lt;sup&gt;1&lt;/sup&gt;、W、Y&lt;sup&gt;2&lt;/sup&gt;以及R&lt;sup&gt;2&lt;/sup&gt;係如本揭露中所定義的。還揭露了含有該等式&lt;b&gt;1&lt;/b&gt;的化合物的組成物，以及用於控制不希望植被之方法，該等方法包括使該不希望植被或其環境與有效量的本發明的化合物或組成物接觸&lt;b&gt;。&lt;/b&gt;&lt;b&gt;  &lt;/b&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are compounds of Formula &lt;b&gt;1&lt;/b&gt;, including all stereoisomers, &lt;i&gt;N&lt;/i&gt;‑oxides, and salts thereof &lt;br/&gt;&lt;img align="absmiddle" height="221px" width="381px" file="ed10158.JPG" alt="ed10158.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;wherein &lt;br/&gt;Q, X&lt;sup&gt;1&lt;/sup&gt;, X&lt;sup&gt;2&lt;/sup&gt;, X&lt;sup&gt;3&lt;/sup&gt;, X&lt;sup&gt;4&lt;/sup&gt; and X&lt;sup&gt;5&lt;/sup&gt;, A, V, R&lt;sup&gt;1&lt;/sup&gt;, Y&lt;sup&gt;1&lt;/sup&gt;, W, Y&lt;sup&gt;2&lt;/sup&gt;, and R&lt;sup&gt;2&lt;/sup&gt; are as defined in the disclosure. Also disclosed are compositions containing the compounds of Formula &lt;b&gt;1&lt;/b&gt; and methods for controlling undesired vegetation comprising contacting the undesired vegetation or its environment with an effective amount of a compound&lt;b/&gt;or a composition of the invention.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1455" publication-number="202623817">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623817</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135986</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於增加脂肪移植物之存活率及脂肪體積的方法</chinese-title>
        <english-title>METHODS FOR INCREASING SURVIVAL RATE AND FAT VOLUME OF A FAT GRAFT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/7032</main-classification>
        <further-classification edition="200601120260302B">A61K31/16</further-classification>
        <further-classification edition="201501120260302B">A61K35/28</further-classification>
        <further-classification edition="200601120260302B">C07H1/08</further-classification>
        <further-classification edition="200601120260302B">C07H15/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長庚醫療財團法人林口長庚紀念醫院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG GUNG MEMORIAL HOSPITAL, LINKOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游正博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鈴津</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, ALICE L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪榮堂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, JUNG-TUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃大維</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於增加接受脂肪移植物之個體的移植物存活率或脂肪體積的方法，其包含向該有需要之個體投與治療有效量之包含醣神經鞘脂質之組合物的步驟。本發明亦提供用於治療或預防接受脂肪移植物之個體之移植排斥的方法，其包含向該有需要之個體投與治療有效量之包含醣神經鞘脂質之組合物的步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides methods for increasing graft survival or fat volume in a subject who received a fat graft, comprising the step of administering to the subject in need thereof of a therapeutic effective amount of a composition comprising a glycosphingolipid. Also provided are methods for treating or preventing graft rejection in a subject who received a fat graft, comprising the step of administering to the subject in need thereof of a therapeutic effective amount of a composition comprising a glycosphingolipid.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1456" publication-number="202624217">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624217</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136001</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>茀系化合物、茀系化合物之製造方法、及聚合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D307/68</main-classification>
        <further-classification edition="200601120260302B">C08G63/672</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>外山瑛章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYAMA, EISHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>箱田和也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAKODA, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹田有佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEDA, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平川学</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRAKAWA, MANABU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林郁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為下式(1)表示之茀系化合物。  &lt;br/&gt;&lt;img align="absmiddle" height="218px" width="246px" file="ed10015.JPG" alt="ed10015.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;上式中，R&lt;sup&gt;1&lt;/sup&gt;分別獨立地表示氫原子、碳數1～8之烷基、碳數6～10之芳基或也可經取代之苄基，  &lt;br/&gt;R&lt;sup&gt;2&lt;/sup&gt;及R&lt;sup&gt;3&lt;/sup&gt;分別獨立地表示氫原子、碳數1～8之烷基或碳數6～10之芳基。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1457" publication-number="202624737">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624737</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136006</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>偵測玻璃板中的產品缺陷的方法及裝置</chinese-title>
        <english-title>METHOD AND APPARATUS FOR DETECTING PRODUCT DEFECTS IN GLASS PANELS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260302B">G01N23/16</main-classification>
        <further-classification edition="201801120260302B">G01N23/18</further-classification>
        <further-classification edition="200601120260302B">G01N33/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商首德公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHOTT AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐爾森　艾文德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OLSEN, EJVIND</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種檢查玻璃板(1)的方法，其中，提供玻璃板(1)並檢查是否存在直徑較佳小於10 μm之夾雜在玻璃中的粒子(3)，其中，  &lt;br/&gt;-  藉由X射線源(5)對該玻璃板(1)進行透視，該X射線源具有沿至少一個方向的橫向尺寸不超過10 μm之源光斑(7)，並且  &lt;br/&gt;-  在偵測器螢幕(9)上接收透射穿過該玻璃板(1)的X射線輻射並根據該偵測器螢幕(9)的X射線強度訊號生成透射穿過該玻璃板(1)的X射線輻射之強度的影像(11)，其中，  &lt;br/&gt;-  使該玻璃板(1)及該源光斑(7)相對於彼此而移動，以便透過該測量偵測該玻璃板(1)的一個區域，該區域總體上大於在該偵測器螢幕(9)上所偵測之局部(13)，且其中，  &lt;br/&gt;-  偵測夾雜在該玻璃板(1)之玻璃中的密度高於該玻璃的粒子作為該影像(11)中的強度波動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Method for inspecting glass panels (1), in which a glass panel (1) is provided and examined for the presence of particles (3) embedded in the glass with a diameter of less than 10 µm, wherein &lt;br/&gt;- the glass panel (1) is X-rayed using an X-ray source (5) which has a source spot (7) with a lateral dimension in at least one direction of no more than 10 µm, and &lt;br/&gt;- the X-rays transmitted through the glass panel (1) are collected on a detector screen (9) and an image (11) of the intensity of the X-rays transmitted through the glass panel (1) is generated from the X-ray intensity signals of the detector screen (9), wherein &lt;br/&gt;- the glass panel (1) and the source spot (7) are moved relative to each other so that the measurement covers an area of the glass panel (1) which is in total larger than a section (13) detected on the detector screen (9), and wherein &lt;br/&gt;- a particle embedded in the glass of the glass panel (1) with a higher density than the glass is detected as an intensity variation in the image (11).</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:玻璃板</p>
        <p type="p">2:用於X射線檢查的裝置</p>
        <p type="p">3:粒子</p>
        <p type="p">5:X射線源</p>
        <p type="p">7:源光斑</p>
        <p type="p">9:偵測器螢幕</p>
        <p type="p">10:1的側面</p>
        <p type="p">12:1的側面</p>
        <p type="p">15:X射線束</p>
        <p type="p">18:源光斑距玻璃板的距離</p>
        <p type="p">19:玻璃板距偵測器螢幕的距離</p>
        <p type="p">20:用於支承或導引1的裝置</p>
        <p type="p">21:用於相對於5移動1的裝置</p>
        <p type="p">45:用於改變距離的裝置</p>
        <p type="p">90:模/數轉換介面</p>
        <p type="p">91:計算裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1458" publication-number="202624719">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624719</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136049</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>透過離子背景消除之奈米粒子檢測臨界值判定</chinese-title>
        <english-title>NANOPARTICLE DETECTION THRESHOLD DETERMINATION THROUGH IONIC BACKGROUND REMOVAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">G01N21/17</main-classification>
        <further-classification edition="200601120260309B">G01J3/28</further-classification>
        <further-classification edition="200601120260309B">G06F17/10</further-classification>
        <further-classification edition="201801120260309B">G06F9/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商自然科學公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELEMENTAL SCIENTIFIC, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　明桓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MYUNG HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>什拉帕克　尤里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHLAPAK, YURIY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述用於分析光譜測定資料以判定奈米粒子檢測臨界值之系統及方法。在一態樣中，一種方法實施例包含(但不限於)將含有奈米粒子之一流體樣品轉移至一光譜測定樣品分析器；經由該光譜測定樣品分析器產生與隨時間變化之檢測到之離子信號強度相關聯之一光譜測定資料集；藉由用該光譜測定資料集之一頻率-強度直方圖之一部分經由回歸分析將一離子雜訊模型化為一指數曲線來建立與背景離子信號強度相關聯之該離子雜訊資料集；及自該光譜測定資料集減去該離子雜訊資料集以獲得一奈米粒子資料集。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and methods for analyzing spectrometry data for the determination of nanoparticle detection thresholds are described. In an aspect, a method embodiment includes, but is not limited to, transferring a fluid sample containing nanoparticles to a spectrometry sample analyzer; generating a spectrometry data set via the spectrometry sample analyzer associated with detected ion signal intensity over time; establishing an ionic noise data set associated with background ion signal intensity by modeling the ionic noise as an exponential curve via regression analysis with a part of a frequency-intensity histogram of the spectrometry data set; and subtracting the ionic noise data set from the spectrometry data set to obtain a nanoparticle data set.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:初始頻率與強度曲線</p>
        <p type="p">302:離子雜訊曲線</p>
        <p type="p">304:奈米粒子分佈曲線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1459" publication-number="202625295">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625295</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136063</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有鄰近輻射部分的導電層上形成的天線裝置</chinese-title>
        <english-title>ANTENNA DEVICE WITH ADJACENT RADIATING PORTIONS FORMED ON A CONDUCTIVE LAYER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">H01Q1/38</main-classification>
        <further-classification edition="200601120260309B">H01Q1/48</further-classification>
        <further-classification edition="200601120260309B">H01Q1/52</further-classification>
        <further-classification edition="201501120260309B">H01Q5/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江忠信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHUNG-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種天線裝置可以包括一第一導電部分、一第二導電部分、一第一輻射部分和一第二輻射部分。該第一導電部分形成於一第一導電層的上部區域。該第二導電部分形成於該第一導電層的下部區域。該第一輻射部分形成於該第一導電層的左部區域。該第二輻射部分形成於該第一導電層的右部區域。該第一導電層具有一第一槽，形成於該第一導電部分與該第一輻射部分之間，且一第二槽，形成於該第二導電部分與該第一輻射部分之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An antenna device may include a first conductive portion, a second conductive portion, a first radiating portion, and a second radiating portion. The first conductive portion is formed at an upper region of a first conductive layer. The second conductive portion is formed at a lower region of the first conductive layer. The first radiating portion is formed at a left region of the first conductive layer. The second radiating portion is formed at a right region of the first conductive layer. The first conductive layer has a first slot formed between the first conductive portion and the first radiating portion, and a second slot formed between the second conductive portion and the first radiating portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:天線裝置</p>
        <p type="p">110:第一導電部分</p>
        <p type="p">120:第二導電部分</p>
        <p type="p">130:第一輻射部分</p>
        <p type="p">140:第二輻射部分</p>
        <p type="p">160:第一導電通孔</p>
        <p type="p">170:第二導電通孔</p>
        <p type="p">182、184、186、188:邊緣通孔</p>
        <p type="p">192:第一饋入元件</p>
        <p type="p">194:第二饋入元件</p>
        <p type="p">L1:第一導電層</p>
        <p type="p">L2:第二導電層</p>
        <p type="p">S1:第一槽</p>
        <p type="p">S2:第二槽</p>
        <p type="p">S3:第三槽</p>
        <p type="p">S4:第四槽</p>
        <p type="p">M1:層</p>
        <p type="p">SC1:第一電容槽</p>
        <p type="p">SC2:第二電容槽</p>
        <p type="p">SC3:第三電容槽</p>
        <p type="p">SC4:第四電容槽</p>
        <p type="p">La:長度</p>
        <p type="p">SC11:第一部分</p>
        <p type="p">SC12:第二部分</p>
        <p type="p">D1:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1460" publication-number="202623795">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623795</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136077</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>明膠酶抑制劑及其用途</chinese-title>
        <english-title>GELATINASE INHIBITORS AND USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/40</main-classification>
        <further-classification edition="200601120260302B">A61K31/145</further-classification>
        <further-classification edition="200601120260302B">A61P25/00</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
        <further-classification edition="200601120260302B">A61P9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西班牙商艾庫爾治療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACCURE THERAPEUTICS, S.L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普拉德科薩諾　羅傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRADES COSANO, ROGER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">新明膠酶抑制劑、其製備方法、包含彼等的醫藥組成物、及彼等在治療及/或預防其中抑制明膠酶是有益的病況(例如癲癇、思覺失調症、阿茲海默症、自閉症(特別是與脆弱X染色體症候群有關)、智能障礙、情感疾病諸如躁鬱症、抑鬱、血管疾病諸如缺血性中風和動脈粥狀硬化、發炎性疾病諸如多發性硬化症和類風濕關節炎、藥物成癮、神經性病變疼痛、肺部疾病諸如氣喘和慢性阻塞性肺病、癌症和敗血症)之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">New gelatinase inhibitors, processes for their preparation, pharmaceutical compositions comprising them, and their use in therapy and/or prophylaxis of conditions wherein inhibition of gelatinases is useful such as epilepsy, schizophrenia, Alzheimer disease, autism (in particular associated to fragile X syndrome), mental retardation, mood disorders such as bipolar disorders, depression, vascular diseases such as ischemic stroke and atherosclerosis, inflammatory diseases such as multiple sclerosis and rheumatoid arthritis, drug addiction, neuropathic pain, lung diseases such as asthma and chronic obstructive pulmonary disease, cancer and sepsis.&lt;b&gt;  &lt;/b&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1461" publication-number="202624240">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624240</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136105</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>表面處理玻璃布、預浸體、印刷電路板、及玻璃布表面處理劑</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07F7/18</main-classification>
        <further-classification edition="200601120260302B">C03C25/40</further-classification>
        <further-classification edition="200601120260302B">D06M13/513</further-classification>
        <further-classification edition="200601120260302B">C08K9/06</further-classification>
        <further-classification edition="200601120260302B">C08L101/00</further-classification>
        <further-classification edition="200601120260302B">C08J5/24</further-classification>
        <further-classification edition="200601120260302B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商旭化成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商陶氏東麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOW TORAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中橋惇貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAHASHI, JUNKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷口佳範</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANIGUCHI, YOSHINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>櫻井悠生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKURAI, YUSEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉沢武</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIZAWA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種觸感硬挺、即彎曲剛性高、可抑制卷對卷(Roll-to-Roll)輸送時皺褶之產生、且印刷電路板中不易殘留空隙、可提高絕緣可靠性之表面處理玻璃布、預浸體、印刷電路板及玻璃布表面處理劑。  &lt;br/&gt;一種表面處理玻璃布，其係於由多根玻璃長絲構成之玻璃紗作為經紗及緯紗構成之玻璃布之表面具備表面處理層的表面處理玻璃布，  &lt;br/&gt;前述表面處理層係用下述通式(1)：  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="117px" width="431px" file="ed10009.JPG" alt="ed10009.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;[式(1)中，  &lt;br/&gt;R&lt;sup&gt;1&lt;/sup&gt;表示伸芳基或C&lt;sub&gt;1&lt;/sub&gt;至C&lt;sub&gt;10&lt;/sub&gt;之環狀或非環狀二價烴基，  &lt;br/&gt;R&lt;sup&gt;2&lt;/sup&gt;及R&lt;sup&gt;3&lt;/sup&gt;分別獨立地表示選自氫及C&lt;sub&gt;1&lt;/sub&gt;至C&lt;sub&gt;10&lt;/sub&gt;之一價烴基所組成之群組之基團，  &lt;br/&gt;R&lt;sup&gt;4&lt;/sup&gt;表示伸芳基或C&lt;sub&gt;1&lt;/sub&gt;至C&lt;sub&gt;10&lt;/sub&gt;之環狀或非環狀二價烴基，  &lt;br/&gt;n表示0、1或2之整數，  &lt;br/&gt;Q&lt;sup&gt;1&lt;/sup&gt;、Q&lt;sup&gt;2&lt;/sup&gt;、及Q&lt;sup&gt;3&lt;/sup&gt;分別獨立地表示選自氫原子、苄基、及乙烯基苄基所組成之群組之官能基]  &lt;br/&gt;所表示之含胺基之有機矽化合物或其鹽之混合物處理過之層，  &lt;br/&gt;前述通式(1)所表示之含胺基之有機矽化合物或其鹽1莫耳中，苄基之含量為0.1莫耳以上0.8莫耳以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1462" publication-number="202624241">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624241</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136106</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含胺基之有機矽化合物或其鹽之混合物及其製造方法、以及含有含胺基之有機矽化合物或其鹽之混合物之表面處理劑</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07F7/18</main-classification>
        <further-classification edition="200601120260302B">C03C25/40</further-classification>
        <further-classification edition="200601120260302B">D06M13/513</further-classification>
        <further-classification edition="200601120260302B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商陶氏東麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOW TORAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商旭化成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷口佳範</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANIGUCHI, YOSHINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>櫻井悠生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKURAI, YUSEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉沢武</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIZAWA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中橋惇貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAHASHI, JUNKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於製造手感硬挺、即彎曲剛性高、可抑制卷對卷輸送時皺褶之產生、且印刷電路板中不易殘留空洞、可提升絕緣可靠性之表面處理劑的含胺基之有機矽化合物或其鹽之混合物及其製造方法、以及含有含胺基之有機矽化合物或其鹽之混合物之表面處理劑。  &lt;br/&gt;一種含胺基之有機矽化合物或其鹽之混合物，其以下述通式(1)表示：  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="122px" width="420px" file="ed10011.JPG" alt="ed10011.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;[式(1)中，  &lt;br/&gt;R&lt;sup&gt;1&lt;/sup&gt;表示伸芳基或C&lt;sub&gt;1&lt;/sub&gt;至C&lt;sub&gt;10&lt;/sub&gt;之環狀或非環狀之二價烴基，  &lt;br/&gt;R&lt;sup&gt;2&lt;/sup&gt;及R&lt;sup&gt;3&lt;/sup&gt;分別獨立地表示選自氫及C&lt;sub&gt;1&lt;/sub&gt;至C&lt;sub&gt;10&lt;/sub&gt;之一價烴基所組成之群組之基團，  &lt;br/&gt;R&lt;sup&gt;4&lt;/sup&gt;表示伸芳基或C&lt;sub&gt;1&lt;/sub&gt;至C&lt;sub&gt;10&lt;/sub&gt;之環狀或非環狀之二價烴基，  &lt;br/&gt;n表示0、1或2之整數，  &lt;br/&gt;Q&lt;sup&gt;1&lt;/sup&gt;、Q&lt;sup&gt;2&lt;/sup&gt;、及Q&lt;sup&gt;3&lt;/sup&gt;分別獨立地表示選自氫原子、苄基、及乙烯基苄基所組成之群組之官能基]  &lt;br/&gt;前述通式(1)所表示之含胺基之有機矽化合物或其鹽1莫耳中，苄基之含量為0.1莫耳以上0.8莫耳以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1463" publication-number="202624242">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624242</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136107</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含胺基之有機矽化合物或其鹽之混合物及其製造方法、以及含有含胺基之有機矽化合物或其鹽之混合物之表面處理劑</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07F7/18</main-classification>
        <further-classification edition="200601120260302B">D06M13/513</further-classification>
        <further-classification edition="200601120260302B">C08K7/14</further-classification>
        <further-classification edition="200601120260302B">C08K9/06</further-classification>
        <further-classification edition="200601120260302B">C08J5/08</further-classification>
        <further-classification edition="200601120260302B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商陶氏東麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOW TORAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷口佳範</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANIGUCHI, YOSHINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米田裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMEDA, YUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉沢武</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIZAWA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於製造手感硬挺、即彎曲剛性高、可抑制卷對卷輸送時皺褶之產生、且印刷電路板中不易殘留空洞、可提升絕緣可靠性之表面處理劑的具有優異水稀釋性之含胺基之有機矽化合物或其鹽之混合物及其製造方法、以及含有該含胺基之有機矽化合物或其鹽之混合物之表面處理劑，以及進一步提供一種具有優異之水稀釋性、不會於水性溶劑中凝膠化而形成均勻之溶液的含胺基之有機矽化合物或其鹽之混合物及其製造方法、及含有其鹽之混合物之表面處理劑。  &lt;br/&gt;一種含胺基之有機矽化合物或其鹽之混合物，其以下述通式(1)表示：  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="125px" width="502px" file="ed10015.JPG" alt="ed10015.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;[式(1)中，  &lt;br/&gt;R&lt;sup&gt;1&lt;/sup&gt;表示伸芳基或C&lt;sub&gt;1&lt;/sub&gt;至C&lt;sub&gt;10&lt;/sub&gt;之環狀或非環狀之二價烴基，  &lt;br/&gt;R&lt;sup&gt;2&lt;/sup&gt;及R&lt;sup&gt;3&lt;/sup&gt;分別獨立地表示選自氫及C&lt;sub&gt;1&lt;/sub&gt;至C&lt;sub&gt;10&lt;/sub&gt;之一價烴基所組成之群組之基團，  &lt;br/&gt;R&lt;sup&gt;4&lt;/sup&gt;表示伸芳基或C&lt;sub&gt;1&lt;/sub&gt;至C&lt;sub&gt;10&lt;/sub&gt;之環狀或非環狀之二價烴基，  &lt;br/&gt;n表示0、1或2之整數，  &lt;br/&gt;Q&lt;sup&gt;1&lt;/sup&gt;、Q&lt;sup&gt;2&lt;/sup&gt;、及Q&lt;sup&gt;3&lt;/sup&gt;分別獨立地表示選自氫原子、苄基、乙烯基苄基、及經1或多個羥基取代之C&lt;sub&gt;1&lt;/sub&gt;至C&lt;sub&gt;10&lt;/sub&gt;之一價烴基所組成之群組，其中Q&lt;sup&gt;1&lt;/sup&gt;、Q&lt;sup&gt;2&lt;/sup&gt;、及Q&lt;sup&gt;3&lt;/sup&gt;中之至少一個為經1或多個羥基取代之C&lt;sub&gt;1&lt;/sub&gt;至C&lt;sub&gt;10&lt;/sub&gt;&lt;br/&gt;之一價烴基的官能基]。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1464" publication-number="202624133">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624133</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136109</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>處理系統及處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260302B">C02F1/00</main-classification>
        <further-classification edition="200601120260302B">G01N33/18</further-classification>
        <further-classification edition="200601120260302B">G05B19/418</further-classification>
        <further-classification edition="202601120260302B">H10P76/00</further-classification>
        <further-classification edition="200601320260302B">C02F101/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>二
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, SHINJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]根據半導體製造裝置的廢液中有機氟化合物的濃度來執行適當的處理。  &lt;br/&gt;　　[解決手段]PFAS無毒化系統(1)具備：從半導體製造裝置100被排出的含PFAS的廢液的流路；被配置在流路上，計測廢液所含的PFAS之濃度的一個或複數測量器(400)；以及控制部(10)。測量器(400)係藉由計測廢液的pH或比電阻值，來計測PFAS的濃度，控制部(10)則實行因應藉由測量器(400)所計測到的PFAS的濃度的處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:PFAS無毒化系統(處理系統)</p>
        <p type="p">2:濾液</p>
        <p type="p">10:控制部</p>
        <p type="p">11:濃縮器</p>
        <p type="p">11a:聚合物濃縮器</p>
        <p type="p">11b:單體濃縮器(第3儲存槽)</p>
        <p type="p">15:廢液供給路</p>
        <p type="p">16:循環流路</p>
        <p type="p">17:濾液流路</p>
        <p type="p">18:第3濾液流路</p>
        <p type="p">20x:儲存槽</p>
        <p type="p">20y:第3儲存槽</p>
        <p type="p">39:過濾器(第1過濾器)</p>
        <p type="p">40b:過濾器(第2過濾器)</p>
        <p type="p">71,72,73,74:流路</p>
        <p type="p">151:泵浦</p>
        <p type="p">161:泵浦</p>
        <p type="p">171:泵浦</p>
        <p type="p">301:聚合物用過濾器</p>
        <p type="p">400:測量器</p>
        <p type="p">401:測量感測器(第2測量感測器)</p>
        <p type="p">402:測量感測器(第1測量感測器)</p>
        <p type="p">403:測量感測器(第4測量感測器)</p>
        <p type="p">404:測量感測器(第3測量感測器)</p>
        <p type="p">501:閥門</p>
        <p type="p">601,602,603:背壓閥</p>
        <p type="p">701,702,703:壓力計</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1465" publication-number="202624547">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624547</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136117</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氧生成用陽極及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260302B">C25B1/04</main-classification>
        <further-classification edition="202101120260302B">C25B11/031</further-classification>
        <further-classification edition="202101120260302B">C25B11/052</further-classification>
        <further-classification edition="202101120260302B">C25B11/061</further-classification>
        <further-classification edition="202101120260302B">C25B11/089</further-classification>
        <further-classification edition="200601120260302B">C23C4/02</further-classification>
        <further-classification edition="201601120260302B">C23C4/08</further-classification>
        <further-classification edition="201601120260302B">C23C4/134</further-classification>
        <further-classification edition="200601120260302B">C23C4/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義大利商第諾拉工業公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIE DE NORA S.P.A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴納爾　阿瓦勒丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZAENAL, AWALUDIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ID</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤昭博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>包贇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAO, YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>有元修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARIMOTO, OSAMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種氧生成用陽極，其具備不使用貴金屬，氧生成過電壓較低且機械穩定之觸媒層。本發明係一種氧生成用陽極(10)，其具備：導電性基材(2)，其係至少其表面包含鎳或鎳基合金；及觸媒層(4)，其配置於基材(2)之表面上，由鎳-鐵合金形成且具有多孔質結構；且於鎳-鐵合金中，鎳之比率為35～95質量%，鐵之比率為5～65質量%，鎳之比率與鐵之比率之和為100質量%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:導電性基材</p>
        <p type="p">4:觸媒層</p>
        <p type="p">10:氧生成用陽極</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1466" publication-number="202623754">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623754</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136170</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>提示詞生成方法、控制系統、清潔機器人、終端以及介質</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260310B">A47L11/40</main-classification>
        <further-classification edition="200601120260310B">A47L11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁佳波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>烏爾奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供了一種提示詞生成方法、控制系統、機器人、終端以及介質，該方法包括：獲取指令描述資訊；基於指令描述資訊，生成與指令描述資訊適配的提示詞，並確定提示詞關聯的行為策略，以使得清潔機器人基於提示詞執行該提示詞關聯的行為策略。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S101:步驟</p>
        <p type="p">S102:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1467" publication-number="202625009">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625009</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136183</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資訊處理方法、資訊處理裝置及電腦程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260309B">G06F40/10</main-classification>
        <further-classification edition="202001120260309B">G06F40/12</further-classification>
        <further-classification edition="202001120260309B">G06F40/20</further-classification>
        <further-classification edition="202001120260309B">G06F40/279</further-classification>
        <further-classification edition="201801120260309B">G06F9/44</further-classification>
        <further-classification edition="202301120260309B">G06N3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川人大希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAHITO, DAIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小川裕亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGAWA, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種資訊處理方法、資訊處理裝置及電腦程式。  &lt;br/&gt;本發明係藉由電腦執行如下處理：受理基板處理裝置之裝置資訊及/或使用目的；使用語言模型來產生與所受理之裝置資訊及/或使用目的相應之答覆文本，該語言模型參考藉由執行基板處理所涉及之模擬所獲得之輸出資料群；輸出所產生之答覆文本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">200:LLM伺服器</p>
        <p type="p">MD:語言模型</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1468" publication-number="202624394">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624394</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136263</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚合物組成物、相位差膜形成用組成物、配向膜形成用組成物及相位差材</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08L33/14</main-classification>
        <further-classification edition="200601120260302B">C08K5/12</further-classification>
        <further-classification edition="200601120260302B">G02B1/04</further-classification>
        <further-classification edition="200601120260302B">G02B5/30</further-classification>
        <further-classification edition="200601120260302B">G02F1/1335</further-classification>
        <further-classification edition="200601120260302B">G02F1/1337</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日產化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>風間茜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAZAMA, AKANE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>櫻葉汀丹尼爾　安東尼奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAHADE, DANIEL ANTONIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種聚合物組成物，其含有以下的聚合物(P)與化合物(A)。聚合物(P)：在側鏈具有感光性基(p)之聚合物(P)，化合物(A)：下述式(a)表示之化合物，  &lt;br/&gt;&lt;img align="absmiddle" height="94px" width="525px" file="ed10053.JPG" alt="ed10053.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式(a)中，R&lt;sub&gt;1&lt;/sub&gt;表示-COORa(Ra表示氫原子或碳數1～4的烷基)。Sp表示二價鏈狀連結基。X表示具有環狀基之(m＋n)價基。Y表示-O-或-N(Rb)-(Rb表示氫原子或碳數1～4的烷基)。Z表示具有環狀基之一價基。m為0～2的整數。n為2～4的整數。R&lt;sub&gt;1&lt;/sub&gt;、Sp、Y及Z存在多個時，各R&lt;sub&gt;1&lt;/sub&gt;、Sp、Y及Z可相同亦可不同。)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1469" publication-number="202624971">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624971</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136289</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>經由晶片上網路互連在晶片上系統內的雙資料速率傳輸</chinese-title>
        <english-title>DOUBLE-DATA RATE TRANSMISSION WITHIN A SYSTEM-ON-CHIP VIA NETWORK-ON-CHIP INTERCONNECTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">G06F13/16</main-classification>
        <further-classification edition="200601120260305B">G06F13/42</further-classification>
        <further-classification edition="202201120260305B">H04L49/109</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商微軟技術授權有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICROSOFT TECHNOLOGY LICENSING, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉奧　哈里馬達瓦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAO, HARI MADHAVA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柏達　格雷戈里克里斯多夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BURDA, GREGORY CHRISTOPHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克萊因　安東尼戴爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLEIN, ANTHONY DALE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述經由晶片上網路（NOC）互連在晶片上系統（SoC）內的雙資料速率（DDR）傳輸。一種用於發送資料的方法包括以下步驟：利用區域可程式化延遲電路，接收來源同步時脈（SSC）訊號，並輸出經延遲的來源同步時脈（SSC）訊號。該方法進一步包括以下步驟：利用與第一NOC互連階段相關聯的區域脈衝產生器，接收該經延遲的SSC訊號，並回應於該經延遲的SSC訊號的第一相位而產生第一脈衝，以及回應於該經延遲的SSC訊號的第二相位而產生第二脈衝。該方法進一步包括以下步驟：利用與該第一NOC互連階段相關聯的正反器重複器電路，回應於該第一脈衝及該第二脈衝中之每一者，針對從該來源電路接收的資料進行擷取及發射。該方法進一步包括以下步驟：利用區域偏移電路，接收該經延遲的SSC訊號，並提供去偏斜的SSC訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Double-data rate (DDR) transmission within a system-on-chip (SoC) via network-on-chip (NOC) interconnects is described. A method for transmitting data includes a local programmable delay circuit receiving a source synchronous clock (SSC) signal and outputting a delayed source synchronous clock (SSC) signal. The method further includes a local pulse generator, associated with a first NOC interconnect stage, receiving the delayed SSC signal and generating a first pulse in response to a first phase of the delayed SSC signal and generating a second pulse in response to a second phase of the delayed SSC signal. The method further includes a flop-repeater circuit, associated with the first NOC interconnect stage, capturing and launching data received from the source circuit in response to each of the first pulse and the second pulse. The method further includes a local offset circuit receiving the delayed SSC signal and providing a de-skewed SSC signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:NOC互連</p>
        <p type="p">202:來源端</p>
        <p type="p">204:灌入端</p>
        <p type="p">210:互連階段</p>
        <p type="p">212:正反器重複器</p>
        <p type="p">214:LPG</p>
        <p type="p">222:LPROG DLY</p>
        <p type="p">224:偏移電路</p>
        <p type="p">230:互連階段</p>
        <p type="p">232:正反器重複器</p>
        <p type="p">234:LPG</p>
        <p type="p">242:LPROG DLY</p>
        <p type="p">244:偏移電路</p>
        <p type="p">250:互連階段</p>
        <p type="p">252:正反器重複器</p>
        <p type="p">254:LPG</p>
        <p type="p">262:LPROG DLY</p>
        <p type="p">264:偏移電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1470" publication-number="202625434">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625434</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136302</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於視訊寫碼的適應性迴路濾波器聯合最佳化</chinese-title>
        <english-title>ADAPTIVE LOOP FILTER JOINT OPTIMIZATION FOR VIDEO CODING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260311B">H04N19/117</main-classification>
        <further-classification edition="201401120260311B">H04N19/119</further-classification>
        <further-classification edition="201401120260311B">H04N19/85</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡　楠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王洪濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HONGTAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡爾切維奇　瑪塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARCZEWICZ, MARTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賽萊金　瓦迪姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEREGIN, VADIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種視訊寫碼器經組態以：針對該視訊資料的第一圖像或第一切片的一或多個濾波器導出介於最小類別索引與最大類別索引之間的類別的各別縮放因子；判定來自該第一圖像或該第一切片的濾波器資訊可針對該視訊資料的第二圖像或第二切片重複使用；判定該第二圖像或該第二切片的縮放因子，其中該第二圖像或該第二切片具有在介於來自該第一圖像或該第一切片的該最小類別索引與該最大類別索引之間的範圍之外的類別索引；及使用該縮放因子在該視訊資料的該第二切片的該第二圖像中對該視訊資料的一或多個區塊進行濾波。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A video coder is configured to derive a respective scaling factor for classes between a minimum class index and a maximum class index for one or more filters for a first picture or a first slice of the video data, determine that filter information from the first picture or the first slice may be reused for a second picture or a second slice of the video data, determine a scaling factor for the second picture or the second slice, wherein the second picture or the second slice has a class index outside of a range between the minimum class index and the maximum class index from the first picture or the first slice, and filter one or more blocks of the video data in the second picture of the second slice of the video data using the scaling factor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">800,802,804,806:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1471" publication-number="202624013">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624013</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136307</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>工件加工用黏著薄片及其製造方法及電子器件裝置的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">B32B27/36</main-classification>
        <further-classification edition="200601120260312B">B32B27/06</further-classification>
        <further-classification edition="201901120260312B">B32B7/025</further-classification>
        <further-classification edition="202601120260312B">H10P54/92</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商琳得科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂尻浩祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAJIRI, KOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長谷川裕也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASEGAWA, YUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">具有緩衝層、基材及黏著劑層，其中一表面具有前述黏著劑層，前述緩衝層為包含熱硬化性樹脂組成物之硬化物之層，前述熱硬化性樹脂組成物包含抗靜電劑之工件加工用黏著薄片及其之製造方法，及使用前述工件加工用黏著薄片之電子器件裝置之製造方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1472" publication-number="202624008">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624008</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136308</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>工件加工用黏著薄片及其製造方法及電子器件裝置的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">B32B27/08</main-classification>
        <further-classification edition="200601120260302B">B32B27/16</further-classification>
        <further-classification edition="200601120260302B">B32B27/18</further-classification>
        <further-classification edition="200601120260302B">B32B27/20</further-classification>
        <further-classification edition="200601120260302B">B32B27/30</further-classification>
        <further-classification edition="200601120260302B">B32B27/36</further-classification>
        <further-classification edition="200601120260302B">B32B27/40</further-classification>
        <further-classification edition="200601120260302B">C09J201/00</further-classification>
        <further-classification edition="201801120260302B">C09J7/29</further-classification>
        <further-classification edition="201801120260302B">C09J7/38</further-classification>
        <further-classification edition="202601120260302B">H10P52/00</further-classification>
        <further-classification edition="202601120260302B">H10P54/00</further-classification>
        <further-classification edition="202601120260302B">H10P72/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商琳得科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂尻浩祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAJIRI, KOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村美南海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, MINAMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">具有緩衝層、抗靜電層、基材及黏著劑層，其中一表面具有前述黏著劑層，前述緩衝層為包含熱硬化性樹脂組成物之硬化物之層，工件加工用黏著薄片及其之製造方法，及使用前述工件加工用黏著薄片之電子器件裝置之製造方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1473" publication-number="202625443">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625443</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136310</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於具有注意力模組的視訊寫碼的推論迴路內濾波的共用傳訊劃分區塊模式</chinese-title>
        <english-title>SPLIT BLOCK WITH SHARED SIGNALING MODE FOR INFERENCE IN-LOOP FILTER FOR VIDEO CODING WITH ATTENTION MODULES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260311B">H04N19/82</main-classification>
        <further-classification edition="201401120260311B">H04N19/117</further-classification>
        <further-classification edition="202301120260311B">G06N3/045</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　雲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧薩諾福斯基　迪米特羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUSANOVSKYY, DMYTRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>UA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡爾切維奇　瑪塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARCZEWICZ, MARTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種實例設備包括一或多個處理器，該一或多個處理器經組態以接收指示圖像的視訊資料、從該視訊資料產生用於推論的一輸入區塊、及對該輸入區塊執行基於神經網路(NN)的一濾波程序以產生一經濾波區塊。為了執行基於NN的該濾波程序，該一或多個處理器經組態以判定該輸入區塊之一大小至少與一第一預定大小一樣大。該一或多個處理器經組態以基於該輸入區塊之該大小至少與該第一預定大小一樣大，將該輸入區塊劃分成具有小於該第一預定大小的一第二預定大小的複數個子區塊。該一或多個處理器經組態以單獨對各子區塊進行一推論。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An example apparatus includes the one or more processors configured to receive video data indicative of the picture, generate an input block for inference from the video data, and perform a neural network (NN)-based filter process on the input block to generate a filtered block. To perform the NN-based filter process, the one or more processors are configured to determine that a size of the input block is at least as large as a first predetermined size. The one or more processors are configured to, based on the size of the input block being at least as large as the first predetermined size, split the input block into a plurality of sub-blocks of a second predetermined size smaller than the first predetermined size. The one or more processors are configured to conduct an inference for each sub-block separately.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3400:區塊</p>
        <p type="p">3402A~3402D:子區塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1474" publication-number="202624426">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624426</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136311</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於多晶矽和非晶矽的化學機械平坦化</chinese-title>
        <english-title>CHEMICAL MECHANICAL PLANARIZATION FOR POLYCRYSTALLINE SILICON AND AMORPHOUS SILICON</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C09G1/02</main-classification>
        <further-classification edition="200601120260302B">C09K3/14</further-classification>
        <further-classification edition="201201120260302B">B24B37/34</further-classification>
        <further-classification edition="200601120260302B">B24B57/02</further-classification>
        <further-classification edition="202601120260302B">H10P52/40</further-classification>
        <further-classification edition="202601120260302B">H10P90/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商慧盛材料美國責任有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERSUM MATERIALS US, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃熙珉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, HEE MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙俊衍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, JOON-YEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙永賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, YONG-HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉禎玧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, JEONG YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裵怜妵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE, YOUNGJU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周　鴻君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, HONGJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳展俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的化學機械平坦化(CMP)拋光組合物、方法和系統能夠提供較高的多晶矽和非晶矽去除速率，以及多晶矽/非晶矽去除速率相對於氮化矽去除速率的高選擇性。此CMP拋光組合物特別包含其他成分，包括用於提高非晶矽拋光速率的親水性矽酸鹽及用於提高多晶矽初始拋光量的至少兩種不同尺寸的磨料顆粒。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Present Chemical Mechanical Planarization (CMP) polishing compositions, methods and systems provide high polysilicon and high amorphous silicon removal rates, and a high selectivity of polysilicon/amorphous silicon removal rate to silicon nitride removal rate. The CMP polishing compositions comprise specifically in addition of other components, hydrophilic silicate to increase the polishing rate of amorphous silicon and at least two abrasive particles having different sizes to increase the initial polishing amount of polysilicon.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1475" publication-number="202625390">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625390</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136317</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>調整天線裝置的方法</chinese-title>
        <english-title>TUNING METHOD FOR AN ANTENNA DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">H04B1/04</main-classification>
        <further-classification edition="200601120260202B">H04B7/015</further-classification>
        <further-classification edition="200601120260202B">H01Q3/44</further-classification>
        <further-classification edition="200601120260202B">H03F1/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭博仲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, PO-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鈞翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許勁崴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一種天線裝置的調整方法。該天線裝置包括天線、阻抗匹配調諧器（IMT）和射頻前端（RFFE）。該天線裝置耦合至射頻發射器/接收器（射頻收發器）。在特徵化階段，特徵化該天線裝置以獲得多個映射資料，該映射資料是在發射（TX）頻率的第一負載阻抗和接收（RX）頻率的第二負載阻抗之間的映射，該映射與該阻抗匹配調諧器的多個配置和該天線裝置的多個操作條件相關。在調整階段，估算該阻抗匹配調諧器的當前配置下的第一負載阻抗。根據該映射資料，將該第一負載阻抗映射以獲得該當前配置下的第二負載阻抗。根據該阻抗匹配調諧器的當前配置下的第一負載阻抗和第二負載阻抗調整該阻抗匹配調諧器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A tuning method for an antenna device is provided. The antenna device includes an antenna, an impedance matching tuner (IMT) and a radio frequency front end (RFFE). The antenna device is coupled to a radio frequency transmitter/receiver (RF transceiver), In a characterization stage, the antenna device is characterized to obtain several mapping data between the first load impedances for transmitting (TX) frequencies and the second load impedances for receiving (RX) frequencies, corresponding to several configurations of the IMT and several operating conditions of the antenna device. In a tuning stage, the first load impedances at a current configuration of the IMT are estimated. The first load impedances are mapped to obtain the second load impedances at the current configuration based on the mapping data. The IMT is tuned based on the first load impedances and the second load impedances at the current configuration of the IMT</p>
      </isu-abst>
      <representative-img>
        <p type="p">S400~S408:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1476" publication-number="202624259">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624259</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136353</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>GLP-1受體促效劑組合物及其使用方法</chinese-title>
        <english-title>GLP-1 RECEPTOR AGONIST COMPOSITIONS AND METHODS OF USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07K14/605</main-classification>
        <further-classification edition="200601120260302B">A61K38/22</further-classification>
        <further-classification edition="200601120260302B">A61P3/00</further-classification>
        <further-classification edition="200601120260302B">A61P9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商茲希普有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZIHIPP LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑪索　史帝夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARSO, STEVE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈伯德　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUBBARD, BRIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯托布里克　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STOEKENBROEK, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伯內德　克里斯托夫　惠頓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BERNARD, CHRISTOPHER WHITTEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於在某些給藥方案中使用GLP-1受體促效劑以誘發或維持體重減輕或管理體重。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to use of GLP-1 receptor agonist in certain dosage regimes for inducing or maintaining weight loss or managing body weight.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1477" publication-number="202623876">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623876</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136361</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>脫氣系統及脫氣方法</chinese-title>
        <english-title>DEGASIFIER SYSTEM AND DEGASIFIER METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260121B">B01D19/00</main-classification>
        <further-classification edition="200601120260121B">B01D61/02</further-classification>
        <further-classification edition="202301120260121B">C02F9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商野村微科學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOMURA MICRO SCIENCE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本克美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, KATSUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種脫氣系統，藉由抑制板式熱交換器內的活菌等的增殖，以能維持板式熱交換器內的流速並穩定地運轉液封式真空泵。脫氣系統，具有：配置於用以處理被處理水以製造純水的純水製造裝置之脫氣裝置；用以對脫氣裝置的氣相側進行減壓的液封式真空泵；用以從液封式真空泵排出封液，並將被排出的封液循環至該液封式真空泵的循環流路；以及設於循環流路的板式熱交換器，其中板式熱交換器具有：積層的複數個傳熱板；設於複數個傳熱板的積層方向的一側，並具有該封液的入口的第一框架；以及設於複數個傳熱板的積層方向的另一側，並具有該封液的出口的第二框架。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A degasifier system maintains a flow speed within a plate-type heat exchanger and stably operates a liquid seal vacuum pump by suppressing the proliferation of viable bacteria and the like inside the heat exchanger. The degasifier system includes: a degassing device disposed in a pure water producing apparatus that produces pure water by treating water to be treated; a liquid seal vacuum pump configured to reduce the pressure on a gas-phase side of the degassing device; a circulation channel configured to discharge a sealing liquid from the liquid seal vacuum pump and circulate the discharged sealing liquid back to the liquid seal vacuum pump; and a plate-type heat exchanger disposed in the circulation channel. The plate-type heat exchanger includes: a plurality of stacked heat transfer plates; a first frame disposed on one side in a stacking direction of the plurality of heat transfer plates and having an inlet for the sealing liquid; and a second frame disposed on the other side in the stacking direction of the plurality of heat transfer plates and having an outlet for the sealing liquid.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:板式熱交換器，板型熱交換器</p>
        <p type="p">10:脫氣系統</p>
        <p type="p">16:脫氣裝置</p>
        <p type="p">18:液封式真空泵</p>
        <p type="p">19:真空配管</p>
        <p type="p">40:循環流路</p>
        <p type="p">40A:循環配管</p>
        <p type="p">40B:循環配管</p>
        <p type="p">40C:循環配管</p>
        <p type="p">42:氣液分離槽</p>
        <p type="p">47:封液排出配管</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1478" publication-number="202624134">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624134</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136363</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>純水的製造方法及純水製造裝置</chinese-title>
        <english-title>METHOD FOR PRODUCING PURE WATER AND APPARATUS FOR PRODUCING PURE WATER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251127B">C02F1/02</main-classification>
        <further-classification edition="200601120251127B">B01D61/04</further-classification>
        <further-classification edition="202201120251127B">F24H1/10</further-classification>
        <further-classification edition="202301120251127B">C02F9/00</further-classification>
        <further-classification edition="200601320251127B">C02F103/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商野村微科學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOMURA MICRO SCIENCE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本克美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, KATSUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種抑制了熱交換器內的水中活菌等的增加速度之純水的製造方法及製造裝置。一種藉由一個或二個以上的水處理機器來處理被處理水，同時具有調節被處理水溫度的步驟之純水的製造方法，其中，純水為醫藥用水或一次純水，水處理機器包括板式熱交換器，板式熱交換器具有第一框架與第二框架以及在該第一框架及該第二框架之間的複數個傳熱板，在該調節溫度的步驟中，對該板式熱交換器供應熱媒體的同時，從該第一框架側導入被處理水，並從該第二框架側導出被處理水，以進行與該熱媒體的熱交換，該板式熱交換器中的被處理水的導入壓力與導出壓力的壓差為0.05MPa以上0.3MPa以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and an apparatus for producing pure water suppress a growth speed of viable bacteria and the like in water within a heat exchanger. In a method for producing pure water, which includes a step of treating water to be treated by one or more water treating machines while adjusting its temperature, the pure water is pharmaceutical water or primary pure water, and the water treating machine includes a plate-type heat exchanger. The plate-type heat exchanger has a first frame, a second frame, and a plurality of heat transfer plates therebetween. In the temperature adjusting step, while a heat medium is supplied to the heat exchanger, the water to be treated is introduced from a side of the first frame and discharged from a side of the second frame to perform heat exchange with the heat medium. A pressure difference between an inlet pressure and an outlet pressure of the water to be treated in the plate-type heat exchanger is in a range of 0.05 MPa to 0.3 MPa.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2a:入口</p>
        <p type="p">2b:出口</p>
        <p type="p">3:墊圈</p>
        <p type="p">4:傳熱板</p>
        <p type="p">5a:流通孔，入口，流通孔(入口)</p>
        <p type="p">5b:流通孔，出口，流通孔(出口)</p>
        <p type="p">11:第一框架</p>
        <p type="p">12:第二框架</p>
        <p type="p">21a:被處理水通路</p>
        <p type="p">21b:熱媒體通路</p>
        <p type="p">22a:被處理水通路</p>
        <p type="p">22b:熱媒體通路</p>
        <p type="p">23a:被處理水通路</p>
        <p type="p">23b:熱媒體通路</p>
        <p type="p">24a:被處理水通路</p>
        <p type="p">24b:熱媒體通路</p>
        <p type="p">25a:被處理水通路</p>
        <p type="p">25b:熱媒體通路</p>
        <p type="p">26a:被處理水通路</p>
        <p type="p">26b:熱媒體通路</p>
        <p type="p">27b:熱媒體通路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1479" publication-number="202624148">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624148</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136368</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>超純水的製造方法及超純水製造裝置</chinese-title>
        <english-title>METHOD AND APPARATUS FOR PRODUCING ULTRAPURE WATER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251203B">C02F9/00</main-classification>
        <further-classification edition="202301120251203B">C02F1/02</further-classification>
        <further-classification edition="200601120251203B">F28F3/00</further-classification>
        <further-classification edition="201901120251203B">F24F1/0323</further-classification>
        <further-classification edition="200601120251203B">B01D61/02</further-classification>
        <further-classification edition="200601120251203B">B01D61/14</further-classification>
        <further-classification edition="202301120251203B">C02F1/20</further-classification>
        <further-classification edition="202301120251203B">C02F1/32</further-classification>
        <further-classification edition="202301120251203B">C02F1/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商野村微科學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOMURA MICRO SCIENCE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本克美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, KATSUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種抑制了水中的鐵（Fe）或鈣（Ca）、微粒子等的暫時性增加之超純水的製造方法及製造裝置。一種藉由一個或二個以上的水處理機器來處理被處理水，同時具有調節被處理水溫度的步驟之超純水的製造方法中，該水處理機器包括用以調節被處理水溫度的板型熱交換器，板型熱交換器具有第一框架與第二框架、以及在該第一框架及第二框架之間的複數個傳熱板，在該調節溫度的步驟中，對板型熱交換器供應熱媒體的同時，從第一框架側導入被處理水，並從第二框架側導出被處理水，以進行與熱媒體的熱交換，且板型熱交換器中的被處理水的導入壓力與導出壓力的壓差為0.05MPa以上0.3MPa以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and an apparatus for producing ultrapure water are provided, which suppress a temporary increase of impurities such as iron (Fe), calcium (Ca), and fine particles in water. In the method for producing ultrapure water, which includes a step of treating the water to be treated with one or more water treatment machines while adjusting the treating water’s temperature, the water treatment machine includes a plate-type heat exchanger configured to adjust the treating water’s temperature. The plate-type heat exchanger has a first frame, a second frame, and a plurality of heat transfer plates disposed therebetween. In the temperature adjusting step, while a heat medium is supplied to the heat exchanger, the water to be treated is introduced from a side of the first frame and discharged from a side of the second frame to perform heat exchange with the heat medium. A pressure difference between an inlet pressure and an outlet pressure of the water to be treated in the plate-type heat exchanger is maintained in a range of 0.05 MPa to 0.3 MPa.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2a:入口</p>
        <p type="p">2b:出口</p>
        <p type="p">3:墊圈</p>
        <p type="p">4:傳熱板</p>
        <p type="p">5a:流通孔，入口，流通孔(入口)</p>
        <p type="p">5b:流通孔，出口，流通孔(出口)</p>
        <p type="p">11:第一框架</p>
        <p type="p">12:第二框架</p>
        <p type="p">21a:被處理水通路</p>
        <p type="p">21b:熱媒體通路</p>
        <p type="p">22a:被處理水通路</p>
        <p type="p">22b:熱媒體通路</p>
        <p type="p">23a:被處理水通路</p>
        <p type="p">23b:熱媒體通路</p>
        <p type="p">24a:被處理水通路</p>
        <p type="p">24b:熱媒體通路</p>
        <p type="p">25a:被處理水通路</p>
        <p type="p">25b:熱媒體通路</p>
        <p type="p">26a:被處理水通路</p>
        <p type="p">26b:熱媒體通路</p>
        <p type="p">27b:熱媒體通路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1480" publication-number="202624466">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624466</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136371</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於減少的二氧化碳排放之改造乙烯設備熱解加熱器之技術</chinese-title>
        <english-title>REVAMPING ETHYLENE PLANT PYROLYSIS HEATERS FOR REDUCED CARBON DIOXIDE EMISSIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C10G9/14</main-classification>
        <further-classification edition="200601120260302B">C10G9/24</further-classification>
        <further-classification edition="200601120260302B">F23L15/00</further-classification>
        <further-classification edition="202501120260302B">F27D17/00</further-classification>
        <further-classification edition="200601120260302B">F28D20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商魯瑪斯科技有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUMMUS TECHNOLOGY LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑達蘭　肯達沙米　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNDARAM, KANDASAMY M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格羅勞爾　湯瑪斯　Ｗ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRONAUER, THOMAS W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坎菲斯　瑪麗珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMPHUIS, MARIJN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙　寶終</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, BAOZHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史丹利　史蒂芬　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STANLEY, STEPHEN J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德巴羅斯　喬瑟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE BARROS, JOSE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於轉化一烴混合物以產生烯烴之熱解方法，其包括：預熱一烴進料；將經預熱烴流與一蒸汽進料混合；將混合烴蒸汽流進料至一第二預熱區；加熱空氣；使燃燒供氣燃燒；使烴裂解；回收一經裂解烴產物；及使該經裂解烴產物驟冷。一種用於轉化一烴混合物以產生烯烴之熱解系統，其包括一熱解加熱器、一對流加熱區之一第一預熱區及一第二預熱區、一電加熱器、一熱傳送流體加熱盤管、一供氣電加熱器、一輻射加熱區及一進料管線。亦揭露一種用於改裝一現有熱解系統之方法，其包括：移除一次級傳送管線交換器；添加一電加熱器；添加一流動管線；替換或重新利用一或多個盤管；及添加一供氣電加熱器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pyrolysis process for converting a hydrocarbon mixture to produce olefins including preheating a hydrocarbon feed, mixing the pre-heated hydrocarbon stream with a steam feed, feeding the mixed hydrocarbon steam stream to a second preheat zone, heating air, combusting the combustion air feed, cracking hydrocarbons, recovering a cracked hydrocarbon product, and quenching the cracked hydrocarbon product. A pyrolysis system for converting a hydrocarbon mixture to produce olefins including a pyrolysis heater, a first and a second preheat zone of a convection heating zone, an electric heater, a heat transfer fluid heating coil, an air feed electric heater, a radiant heating zone, and a feed line. Also disclosed is a process for retrofitting an existing pyrolysis system including removing a secondary transfer line exchanger, adding an electric heater, adding a flow line, replacing or repurposing one or more coils, and adding an air feed electric heater.</p>
      </isu-abst>
      <representative-img>
        <p type="p">73:蒸汽</p>
        <p type="p">100:燃燒管式爐，系統</p>
        <p type="p">112:空氣</p>
        <p type="p">115:空氣預熱器區</p>
        <p type="p">117:經預熱空氣</p>
        <p type="p">118:對流區段</p>
        <p type="p">119:第一預熱區</p>
        <p type="p">120:烴進料流，烴進料管線，烴流</p>
        <p type="p">122:蒸汽流</p>
        <p type="p">123:經預熱烴流</p>
        <p type="p">126:稀釋蒸汽流</p>
        <p type="p">129,150:電加熱器</p>
        <p type="p">132:蒸汽進料</p>
        <p type="p">135:混合烴蒸汽流</p>
        <p type="p">137:第二預熱區</p>
        <p type="p">138:元件</p>
        <p type="p">141:處理管</p>
        <p type="p">144:輻射區段，輻射區</p>
        <p type="p">147:管線</p>
        <p type="p">153:燃燒器噴嘴，燃燒器</p>
        <p type="p">156:輻射區段</p>
        <p type="p">159:TLE</p>
        <p type="p">162:經冷卻烴產物流</p>
        <p type="p">165:鍋爐給水蒸汽產生系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1481" publication-number="202624273">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624273</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136376</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＣＤ１９抗個體遺傳型抗體</chinese-title>
        <english-title>CD19 ANTI-IDIOTYPIC ANTIBODIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07K16/28</main-classification>
        <further-classification edition="200601120260302B">A61K39/395</further-classification>
        <further-classification edition="200601120260302B">C12N15/13</further-classification>
        <further-classification edition="200601120260302B">C12N15/63</further-classification>
        <further-classification edition="200601120260302B">C12N15/64</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商異基因治療有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALLOGENE THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥爾頓　席</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MELTON, ZEA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭　心遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, HSIN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供抗個體遺傳型抗體，其特異性識別抗CD19抗體部分，具體而言，存在於重組受體，包括嵌合抗原受體(CAR)中之抗CD19抗體部分。本揭露進一步係關於該等抗個體遺傳型抗體用於特異性鑑別及/或選擇表現此類重組受體之細胞，諸如抗CD19 CAR T細胞之用途。本揭露進一步係關於該等抗個體遺傳型抗體用於特異性活化此類細胞之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are anti-idiotype antibodies that specifically recognize anti-CD19 antibody moieties, in particular, anti-CD19 antibody moieties present in recombinant receptors, including chimeric antigen receptors (CARs). The disclosure further relates to uses of anti-idiotype antibodies for specifically identifying and/or selecting cells expressing such recombinant receptors, such as anti-CD19 CAR T cells. The disclosure further relates to uses of anti-idiotype antibodies for specifically activating such cells.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1482" publication-number="202625095">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625095</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136381</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用區域記憶庫的三維語意場景重建方法與電子裝置</chinese-title>
        <english-title>METHOD AND ELECTRONIC DEVICE FOR 3D SEMANTIC SCENE RECONSTRUCTION USING REGIONAL MEMORY BABK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260316B">G06T17/00</main-classification>
        <further-classification edition="201701120260316B">G06T7/50</further-classification>
        <further-classification edition="202201120260316B">G06V10/82</further-classification>
        <further-classification edition="202201120260316B">G06V20/56</further-classification>
        <further-classification edition="202201120260316B">G06V20/64</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立陽明交通大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL YANG MING CHIAO TUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖宜斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, I-BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>栗永徽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YUNG-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾昱文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, YU-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊盛評</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHENG-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帥宏翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHUAI, HONG-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭文皇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, WEN-HUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種三維語意場景重建方法和電子裝置。此方法包含：取得二維影像，根據二維影像產生多個符記特徵以及多個體素特徵；將符記特徵加入至一區域記憶庫，其包含多個鍵值配對；根據二維影像產生深度圖，並根據深度圖以及符記特徵產生一重建遮罩，其包含多個不可視位置；根據不可視位置查詢區域記憶庫以得到第一符記特徵；以及根據第一符記特徵更新至少一個體素特徵，並根據更新後的體素特徵產生多個三維場景類別。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention proposes a method and an electronic device for 3D semantic scene reconstruction. The method includes: acquiring a 2D image and generating multiple token features and multiple voxel features based on the 2D image; adding the token features to a regional memory bank that includes multiple key-value pairs; generating a depth map based on the 2D image, and generating a reconstruction mask based on the depth map and the token features, wherein the reconstruction mask includes multiple invisible positions; querying the regional memory bank based on the invisible positions to obtain a first token feature; and updating at least one voxel feature based on the first token feature, and generating multiple 3D scene categories based on the updated voxel features.</p>
      </isu-abst>
      <representative-img>
        <p type="p">310:語意場景完成階段</p>
        <p type="p">311:二維影像</p>
        <p type="p">312:編碼器</p>
        <p type="p">313,318:體素特徵</p>
        <p type="p">314:二維多尺度特徵</p>
        <p type="p">315:符記特徵</p>
        <p type="p">316:解碼器</p>
        <p type="p">317:符記特徵</p>
        <p type="p">319,334:步驟</p>
        <p type="p">320:區域記憶庫</p>
        <p type="p">321:鍵值配對</p>
        <p type="p">330:再完成管道</p>
        <p type="p">331:深度圖</p>
        <p type="p">332:可視遮罩</p>
        <p type="p">333:重建遮罩</p>
        <p type="p">335:更新後的體素特徵</p>
        <p type="p">336:神經網路</p>
        <p type="p">337:第一輸出</p>
        <p type="p">338:第二輸出</p>
        <p type="p">340:頭部</p>
        <p type="p">341:三維場景類別</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1483" publication-number="202625450">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625450</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136389</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於無濾光片像素之色彩校正方法</chinese-title>
        <english-title>COLOR CORRECTION METHOD FOR FILTER-LESS PIXELS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260302B">H04N23/85</main-classification>
        <further-classification edition="201701120260302B">G06T7/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商豪威科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OMNIVISION TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡爾尼茨克　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KALNITSKY, ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種用於無濾光片像素之色彩校正方法。在一項實施例中，具有一像素陣列之一影像感測器包含複數個無濾光片像素。該複數個無濾光片像素中之每一像素包含一藍光區域、一綠光區域及一紅光區域。傳入光相繼通過該藍光區域、該綠光區域及該紅光區域。一讀出電路系統，其經組態以：接收色彩信號輸出，該等色彩信號輸出包括來自該藍光區域之藍色區域信號、來自該綠光區域之綠色區域信號、來自該紅光區域之紅色區域信號，且利用一校正演算法來校正色彩信號輸出，該校正演算法包含一藍光校正演算法、一紅光校正演算法及一綠光校正演算法。該方法經組態以輸出藉由該校正演算法提供之經校正色彩信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A color correction method for filter-less pixels is disclosed. In one embodiment, an image sensor, having a pixel array, includes a plurality of filter-less pixels. Each pixel of the plurality of filter-less pixels includes a blue light region, a green light region, and a red light region. Incoming light successively passes through the blue, green and red light regions. A readout circuitry is configured to receive color signal outputs comprising blue region signals from the blue light region, green region signals from the green light region, red region signals from the red light region, and correct color signal outputs with a correction algorithm, including a blue light correction algorithm, a red light correction algorithm, and a green light correction algorithm, The method is configured to output corrected color signals provided by the correction algorithm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:方法</p>
        <p type="p">405:方塊</p>
        <p type="p">410:方塊</p>
        <p type="p">410a:方塊</p>
        <p type="p">410b:方塊</p>
        <p type="p">410c:方塊</p>
        <p type="p">415:方塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1484" publication-number="202625594">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625594</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136442</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D62/10</main-classification>
        <further-classification edition="202501120260302B">H10D62/60</further-classification>
        <further-classification edition="202501120260302B">H10D62/80</further-classification>
        <further-classification edition="202501120260302B">H10D64/20</further-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
        <further-classification edition="202601120260302B">H10W20/20</further-classification>
        <further-classification edition="200601120260302B">G11C11/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李寧基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YOUNGKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋寅鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, INHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙槿彙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, KEUN HWI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置可包含基底，包括彼此面對的第一和第二表面，並具有包括導電雜質的第一區域和第二區域，通道圖案沿著第一方向在第一表面上間隔開，第一源極/汲極圖案定位在第一區域上以及第二源極/汲極圖案連接至通道圖案的兩側並定位在第二區域上，閘極結構包圍通道圖案並在與第一方向相交的第二方向中延伸，分離結構穿透定位在第一源極/汲極圖案兩側的閘極結構，以及下部配線結構定位在基底的第二表面上，其中第一區域和第二區域包括不同材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device may comprise a substrate including first and second surfaces facing each other, and having a first region including conductive impurities and a second region, a channel pattern spaced apart along a first direction on the first surface, a first source/drain pattern positioned on the first region and second source/drain patterns connected to both sides of the channel pattern and positioned on the second region, a gate structure surrounding the channel pattern and extending in a second direction intersecting the first direction, a separation structure penetrating the gate structure positioned on both sides of the first source/drain pattern, and a lower wiring structure positioned on the second surface of the substrate, wherein the first region and the second region include different materials.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:基底</p>
        <p type="p">111、112:區域</p>
        <p type="p">112a:突出區域</p>
        <p type="p">120:閘極電極</p>
        <p type="p">120M:主閘極電極</p>
        <p type="p">120S:子閘極電極</p>
        <p type="p">130M:主閘極絕緣膜</p>
        <p type="p">130S:子閘極絕緣膜</p>
        <p type="p">140:閘極間隔件</p>
        <p type="p">145:覆蓋層</p>
        <p type="p">160、170:層間絕緣層</p>
        <p type="p">210:上部配線結構</p>
        <p type="p">211:上部配線</p>
        <p type="p">212:上部絕緣層</p>
        <p type="p">400:第一下部絕緣層</p>
        <p type="p">410:下部配線結構</p>
        <p type="p">411:下部配線</p>
        <p type="p">412:第二下部絕緣層</p>
        <p type="p">BCA:下部接觸圖案</p>
        <p type="p">BP:下部圖案</p>
        <p type="p">CA1、CA2:接觸圖案</p>
        <p type="p">CAV1、CAV2:接觸通孔</p>
        <p type="p">CB:閘極接觸圖案</p>
        <p type="p">CP:通道圖案</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">GS:閘極結構</p>
        <p type="p">M_GS:主閘極結構</p>
        <p type="p">SD1、SD2:源極/汲極圖案</p>
        <p type="p">SDB:分離結構</p>
        <p type="p">S_GS:子閘極結構</p>
        <p type="p">TSV、TSV1、TSV2:通孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1485" publication-number="202625423">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625423</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136448</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種通信方法及相關裝置</chinese-title>
        <english-title>A COMMUNICATION METHOD AND RELATED APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260305B">H04L69/22</main-classification>
        <further-classification edition="200601120260305B">H04L1/00</further-classification>
        <further-classification edition="200901120260305B">H04W28/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商華為技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王碧釵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, BICHAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊鋭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, RUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李雪茹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XUERU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周永行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, YONGXING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開了一種通信方法及相關裝置，其中，該通信方法中第一裝置可以將需要傳輸的包頭組成包頭資訊，將需要傳輸的資料組成資料資訊，並採用不同的編碼方式分別對包頭資訊和資料資訊進行編碼，得到第一子傳輸塊和第二子傳輸塊。第二裝置可接收第一裝置發送的第一傳輸塊，並分別對第一子傳輸塊和第二子傳輸塊進行譯碼。不同的編碼方式可以保證第一子傳輸塊和第二子傳輸塊中重要性較高的資訊的傳輸可靠性，而第一子傳輸塊和第二子傳輸塊中重要性較低的資訊允許其譯碼存在一定錯誤率，從而第二裝置無需發起對重要性較低的資訊的重傳，進而有利於降低傳輸塊傳輸的整體時延，提升傳輸塊的傳輸效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application discloses a communication method and related apparatus, wherein the communication method allows a first device to compose a header information from the header of the packet to be transmitted, and to compose data information from the data to be transmitted. The first device then encodes the header information and the data information using different encoding methods, resulting in a first sub-transport block and a second sub-transport block. The second device can receive the first transport block sent by the first device and decode the first sub-transport block and the second sub-transport block separately. Different encoding methods ensure the transmission reliability of the more important information in the first sub-transport block and the second sub-transport block, while allowing a certain error rate in the decoding of the less important information in the first sub-transport block and the second sub-transport block, and the second device does not need to initiate retransmission of the less important information, thereby helping to reduce the overall transmission delay of the transport blocks and improve the transmission efficiency of the transport blocks.</p>
      </isu-abst>
      <representative-img>
        <p type="p">501、502、503:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1486" publication-number="202625670">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625670</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136465</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多模態基於電荷之感測</chinese-title>
        <english-title>MULTIMODAL CHARGE BASED SENSING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260309B">H10N30/01</main-classification>
        <further-classification edition="202301120260309B">H10N30/06</further-classification>
        <further-classification edition="202301120260309B">H10N30/073</further-classification>
        <further-classification edition="200601120260309B">G01R29/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商忒克塔系統股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TACTA SYSTEMS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈爾傑　納西德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARJEE, NAHID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多爾　約瑟夫　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOLL, JOSEPH C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇　哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, HARRY ZHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱日嵩</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種多模態感測器可包括一第一壓電裝置、一第二壓電裝置、選擇電路系統、及讀出電路系統。該選擇電路系統可與該第一壓電裝置及該第二壓電裝置耦接。該選擇電路系統可經控制處於一第一狀態，以連接該等裝置的一個極性來指示一溫度變化，且可經控制處於一第二狀態，以連接該等壓電裝置的一相對極性來指示一力變化。該讀出電路系統可與該等壓電裝置耦接，以產生指示該溫度變化或該力變化之一輸出。在一些實施方案中，該選擇電路系統可經控制處於另一狀態，以斷開該等壓電裝置與該讀出電路系統之連接，並連接一光敏元件與該讀出電路系統。亦描述並主張其他態樣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multimodal sensor may include a first piezoelectric device, a second piezoelectric device, selection circuitry, and readout circuitry. The selection circuitry may be coupled with the first piezoelectric device and the second piezoelectric device. The selection circuitry may be controlled in a first state to connect one polarity of the devices to indicate a temperature change and may be controlled in a second state to connect an opposite polarity of the piezoelectric devices to indicate a force change. The readout circuitry may be coupled with the piezoelectric devices to generate an output indicating either the temperature change or the force change. In some implementations, the selection circuitry may be controlled in another state to disconnect the piezoelectric devices, and connect a photo sensitive element, with the readout circuitry. Other aspects are also described and claimed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:感測器</p>
        <p type="p">102:第一壓電裝置</p>
        <p type="p">104:第二壓電裝置</p>
        <p type="p">106:光敏元件</p>
        <p type="p">108:選擇電路系統</p>
        <p type="p">110:讀出電路系統</p>
        <p type="p">112:膜片</p>
        <p type="p">114:感測器晶粒</p>
        <p type="p">116:層或膜</p>
        <p type="p">118:空腔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1487" publication-number="202625747">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625747</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136466</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板資訊取得裝置及基板處理裝置</chinese-title>
        <english-title>SUBSTRATE INFORMATION ACQUISITION APPARATUS AND SUBSTRATE PROCESSING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260309B">H10P72/10</main-classification>
        <further-classification edition="202601120260309B">H10P72/30</further-classification>
        <further-classification edition="200601120260309B">B25J13/08</further-classification>
        <further-classification edition="201701120260309B">G06T7/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北村藤和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAMURA, FUJIKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">基板資訊取得裝置(60)的光出射部(61)係經由被設置在收納容器(7)之前側側面的容器開口(71)而朝向收納容器(7)的內部出射照明光(610)，該照明光(610)構成為與上下方向垂直之面狀。照明光(610)在上下方向之厚度係比複數片基板(9)在上下方向之間距(P1)為小。受光部(62)接收在收納容器(7)的內側面(73)所反射的反射光。受光部(62)具有與照明光(610)在上下方向之位置相同的光軸。移動機構使照明光(610)及受光部(62)相對於收納容器(7)而於上下方向相對地移動。資訊取得部根據與移動機構所進行之照明光(610)及受光部(62)的相對移動並行地從受光部(62)持續地輸出之輸出內容，而取得複數片基板(9)的形狀及位置之資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The light emitting part (61) of the substrate information acquiring apparatus (60) emits illumination light (610) configured as a plane perpendicular to the vertical direction toward the inside of the storage container (7) through the container opening (71) provided on the front side of the storage container (7). The thickness of the illumination light (610) in the vertical direction is smaller than the pitch (P1) in the vertical direction of the plurality of substrates (9). The light receiving part (62) receives the reflected light reflected by the inner surface (73) of the storage container (7). The light receiving part (62) has an optical axis that is in the same position as the illumination light (610) in the vertical direction. The moving mechanism moves the illumination light (610) and the light receiving part (62) relatively in the vertical direction with respect to the storage container (7). The information acquiring part acquires information on the shapes and positions of the plurality of substrates (9) based on the output continuously output from the light receiving part (62) in parallel with the relative movement of the illumination light (610) and the light receiving part (62) by the moving mechanism.</p>
      </isu-abst>
      <representative-img>
        <p type="p">7:收納容器</p>
        <p type="p">9:基板</p>
        <p type="p">12:索引器機器人</p>
        <p type="p">60:基板資訊取得裝置</p>
        <p type="p">61:光出射部</p>
        <p type="p">62:受光部</p>
        <p type="p">70:內部空間</p>
        <p type="p">71:容器開口</p>
        <p type="p">73:內側面</p>
        <p type="p">120:基板支撐部</p>
        <p type="p">121:搬送手部</p>
        <p type="p">610:照明光</p>
        <p type="p">611:薄片雷射光源</p>
        <p type="p">621:受光元件</p>
        <p type="p">P1:間距</p>
        <p type="p">X、Y、Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1488" publication-number="202625356">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625356</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136482</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於非對稱半橋功率轉換器的高側導通時間控制電路和方法</chinese-title>
        <english-title>A HIGH SIDE ON-TIME CONTROL CIRCUIT AND METHOD FOR AN ASYMMETRICAL HALF-BRIDGE POWER CONVERTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">H02M3/335</main-classification>
        <further-classification edition="200601120260313B">H03K5/22</further-classification>
        <further-classification edition="200601120260313B">H03K7/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商電源整合公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWER INTEGRATIONS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　晟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧德爾　阿瑟　Ｂ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ODELL, ARTHUR B.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聖皮埃爾　羅蘭　西爾維　二世</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAINT-PIERRE JR., ROLAND SYLVERE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑德瑞拉　桑德瑞森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNDARARAJ, SUNDARESAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　清</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, QING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　越明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YUEMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳翠華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開內容的電路和方法控制有效斷開時間（高側開關導通時間）以確保：在每個開關循環中，非對稱半橋（AHB）轉換器中的磁化能量釋放和諧振電容器能量釋放同時完成，並且所有儲存的能量都被遞送到輸出。例示了用以控制高側開關導通時間的多種並行的技術。一種是追蹤在儲存循環期間施加的伏秒，並允許有效釋放斷開時間被限制為相同的伏秒。第二種選項是提供與該開關循環中低側開關的導通時間成比例的高側開關導通時間。第三種選項是提供可以被程式設計以確保高側導通時間等於或小於諧振週期的一半的最大高側開關導通時間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The circuits and methods of the present disclosure control the active off-time (high side switch on-time) to ensure the magnetization energy release and resonant capacitor energy release in an asymmetrical half-bridge (AHB) converter finish at the same time and all the stored energy is delivered to the output in each switching cycle. Multiple, parallel, techniques to control the high side switch on-time are illustrated. One is to track the volt-seconds applied during the storage cycle and allow the active release off-time to be limited to the same volt-seconds. A second option is to provide a high side switch on-time that is proportional to the on-time of the low side switch in that switching cycle. A third option is to provide a maximum high side switch on-time that can be programmed to ensure the high side on-time is equal to or smaller than half of the resonant period.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:AHB功率轉換器</p>
        <p type="p">101、V&lt;sub&gt;IN&lt;/sub&gt;:輸入電壓源</p>
        <p type="p">102、C&lt;sub&gt;IN&lt;/sub&gt;:輸入電容器</p>
        <p type="p">103、C&lt;sub&gt;R&lt;/sub&gt;:諧振電容器</p>
        <p type="p">104:初級繞組</p>
        <p type="p">105:次級繞組</p>
        <p type="p">106:輔助繞組</p>
        <p type="p">107:初級接地</p>
        <p type="p">110、I&lt;sub&gt;P&lt;/sub&gt;:初級側電流</p>
        <p type="p">120、HB:半橋節點</p>
        <p type="p">130、AUX:輸入</p>
        <p type="p">134、U&lt;sub&gt;SR&lt;/sub&gt;:同步整流器控制訊號</p>
        <p type="p">150:初級控制器</p>
        <p type="p">151:高側開關</p>
        <p type="p">152:高側驅動器</p>
        <p type="p">153:低側開關</p>
        <p type="p">154:低側驅動器</p>
        <p type="p">155:初級控制塊</p>
        <p type="p">156、I&lt;sub&gt;SNS&lt;/sub&gt;:輸入</p>
        <p type="p">157:通訊路徑</p>
        <p type="p">160、FL:輸入</p>
        <p type="p">161、HMX:輸入</p>
        <p type="p">162、D(HS):汲極端子</p>
        <p type="p">163、S(LS):源極端子</p>
        <p type="p">171、R&lt;sub&gt;HMX&lt;/sub&gt;:電阻器</p>
        <p type="p">172、173、C&lt;sub&gt;HBias&lt;/sub&gt;、C&lt;sub&gt;LBias&lt;/sub&gt;:電容器</p>
        <p type="p">174、187:二極體</p>
        <p type="p">175:電阻器</p>
        <p type="p">180、I&lt;sub&gt;S&lt;/sub&gt;:次級電流</p>
        <p type="p">181、C&lt;sub&gt;O&lt;/sub&gt;:輸出電容器</p>
        <p type="p">182、V&lt;sub&gt;O&lt;/sub&gt;:輸出電壓</p>
        <p type="p">183、I&lt;sub&gt;O&lt;/sub&gt;:輸出電流</p>
        <p type="p">184、U&lt;sub&gt;O&lt;/sub&gt;:輸出量</p>
        <p type="p">185:負載</p>
        <p type="p">186:同步整流器</p>
        <p type="p">188:電晶體</p>
        <p type="p">190:次級接地</p>
        <p type="p">191:感測電路</p>
        <p type="p">192、U&lt;sub&gt;OS&lt;/sub&gt;:輸出感測訊號</p>
        <p type="p">193:次級控制塊</p>
        <p type="p">194、U&lt;sub&gt;REQ&lt;/sub&gt;:請求訊號</p>
        <p type="p">195:接收器</p>
        <p type="p">196:次級控制器</p>
        <p type="p">IA:電阻器電流</p>
        <p type="p">T1:變壓器</p>
        <p type="p">VA:偏壓電壓</p>
        <p type="p">VAUX:電壓</p>
        <p type="p">VGH:高側閘極電壓</p>
        <p type="p">VGL:低側閘極電壓</p>
        <p type="p">VRES:電阻器電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1489" publication-number="202624478">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624478</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136493</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>蒸餾酒之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C12G3/08</main-classification>
        <further-classification edition="201901120260302B">C12H6/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商你可威士忌股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE NIKKA WHISKY DISTILLING CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森暁平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORI, GYOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤拓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之一實施方式提供一種蒸餾酒之製造方法，其包括以下步驟：準備冷凝液，該冷凝液係藉由對作為選自由薯類及穀物所組成之群中之至少1種之第1原材料進行直接加熱之水蒸氣之冷凝而生成；使用上述冷凝液進行醱酵，獲得乙醇含有物；及對上述乙醇含有物進行蒸餾，獲得蒸餾酒。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1490" publication-number="202624011">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624011</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136494</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗反射膜、及眼罩</chinese-title>
        <english-title>ANTI-REFLECTION FILM AND EYE SHIELD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">B32B27/30</main-classification>
        <further-classification edition="200601120260302B">B32B3/30</further-classification>
        <further-classification edition="201501120260302B">G02B1/18</further-classification>
        <further-classification edition="200601120260302B">A61F9/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商迪睿合股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEXERIALS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西川智弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIKAWA, CHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池田優花</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEDA, YUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">抑制由吸水所導致之微細凹凸構造之變形，兼具防霧功能及抗反射功能。  &lt;br/&gt;本發明提供一種抗反射膜1，其具備由樹脂形成之光學功能層11，光學功能層11具有包含以可見光之波長以下之間距排列之凸部13或凹部14的微細凹凸構造12，光學功能層11之壓入彈性模數為130 MPa以上，且光學功能層11之吸水率為11質量%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:抗反射膜</p>
        <p type="p">10:基材</p>
        <p type="p">10A:正面</p>
        <p type="p">10B:背面</p>
        <p type="p">11:光學功能層</p>
        <p type="p">12:微細凹凸構造</p>
        <p type="p">13:凸部</p>
        <p type="p">14:凹部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1491" publication-number="202624237">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624237</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136504</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>成膜組合物、其形成方法與包含其的蒸氣遞送容器以及沉積含碳摻雜矽膜的方法</chinese-title>
        <english-title>FILM FORMING COMPOSITIONS, METHODS FOR FORMING THE SAME, VAPOR DELIVERY VESSELS INCLUDING THE SAME, AND METHODS FOR DEPOSITING CARBON DOPED SILICON CONTAINING FILM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07F7/10</main-classification>
        <further-classification edition="200601120260302B">C07F7/18</further-classification>
        <further-classification edition="200601120260302B">C07F7/30</further-classification>
        <further-classification edition="200601120260302B">C07F9/09</further-classification>
        <further-classification edition="200601120260302B">C23C16/30</further-classification>
        <further-classification edition="200601120260302B">C23C16/455</further-classification>
        <further-classification edition="202601120260302B">H10P14/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅梅羅　帕特里西奧　愛德華多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROMERO, PATRICIO EDUARDO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利馬泰寧　維爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIIMATAINEN, VILLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波爾　維爾傑米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PORE, VILJAMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維爾沃特　蕾尼　亨里克斯　約瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERVUURT, RENE HENRICUS JOZEF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬里安皮萊　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARIAMPILLAI, BRIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種成膜組合物。該成膜組合物包含具有根據通式(1)之結構的矽前驅物：&lt;br/&gt;&lt;img align="absmiddle" height="99px" width="223px" file="ed10031.JPG" alt="ed10031.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;  其中Q&lt;sup&gt;1&lt;/sup&gt;為選自以下之取代基：乙醯氧基、丙烯醯氧基、C&lt;sub&gt;1&lt;/sub&gt;至C&lt;sub&gt;6&lt;/sub&gt;烷氧基、矽烷氧基、鍺烷氧基、膦醯氧基及烷基胺基；且Q&lt;sup&gt;2&lt;/sup&gt;、Q&lt;sup&gt;3&lt;/sup&gt;及Q&lt;sup&gt;4&lt;/sup&gt;各自為獨立地選自以下之取代基：氫原子、C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;6&lt;/sub&gt;烷基及Q&lt;sup&gt;1&lt;/sup&gt;之取代基。亦提供形成該成膜組合物之方法以及使用該成膜組合物在基板上沉積含碳摻雜矽膜之方法及系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A film forming composition is provided. The film forming composition comprises a silicon precursor having a structure according to general Formula (1): &lt;br/&gt;&lt;img align="absmiddle" height="107px" width="209px" file="ed10032.JPG" alt="ed10032.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; wherein, Q&lt;sup&gt;1&lt;/sup&gt; is a substituent selected from an acetoxy group, an acryloyloxy group, a C&lt;sub&gt;1&lt;/sub&gt; to C&lt;sub&gt;6&lt;/sub&gt; alkoxy group, a silyloxy group, a germyloxy group, a phosphonooxy group, and an alkyl amine group; and Q&lt;sup&gt;2&lt;/sup&gt;, Q&lt;sup&gt;3&lt;/sup&gt;, and Q&lt;sup&gt;4&lt;/sup&gt; are each a substituent independently selected from a hydrogen atom, a C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;6&lt;/sub&gt; alkyl group, and the substituent group of Q&lt;sup&gt;1&lt;/sup&gt;. Methods for forming the film forming composition and methods and systems for using the film forming composition to deposit a carbon doped silicon containing film on a substrate are also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:製程流程圖</p>
        <p type="p">410:步驟</p>
        <p type="p">420:循環沉積製程</p>
        <p type="p">430:步驟</p>
        <p type="p">440:步驟</p>
        <p type="p">450:步驟</p>
        <p type="p">460:步驟</p>
        <p type="p">470:步驟</p>
        <p type="p">480:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1492" publication-number="202625492">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625492</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136527</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>通信方法及裝置</chinese-title>
        <english-title>A COMMUNICATION METHOD AND APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120260305B">H04W74/0816</main-classification>
        <further-classification edition="200601120260305B">H04L5/00</further-classification>
        <further-classification edition="200901120260305B">H04W84/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商華為技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙悦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, YUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史振鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, ZHENPENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李云波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YUNBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及無線通訊技術領域，尤其涉及一種通信方法及裝置。可以支援IEEE協定，如IEEE 802.11be協定、IEEE 802.11bn協定、IEEE集成毫米波協定、IEEE 802.15協定、或IEEE 802.11bf /感知協議；也可以應用於星閃系統，支援星閃標準協定。站點在接收到不是發送給自己的無線幀的情況下，根據該無線幀維護N組NAV，這N組NAV分別對應不同的頻寬，N為大於或等於2的整數。由此，可使得站點能夠結合不同NAV對應的頻寬確定其可以切換到目的次通道的時間，提高目的次通道的利用率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application relates to the field of wireless communication technologies, and in particular, to a communication method and apparatus, which can support the IEEE protocol such as the IEEE 802.11be protocol, the IEEE 802.11bn protocol, the IEEE integrated millimeter wave protocol, the IEEE 802.15 protocol, or the IEEE 802.11bf/sensing protocol; and can be applied to a Starlink system, supporting the Starlink standard protocol. When receiving a radio frame that is not sent to a station, the station maintains N groups of NAVs based on the radio frame, where the N groups of NAVs respectively correspond to different bandwidths, and N is an integer greater than or equal to 2. Therefore, the station can determine, with reference to bandwidths corresponding to different NAVs, a time for the station to switch to a destination secondary channel, thereby improving utilization of the destination secondary channel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">801、802、803:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1493" publication-number="202624317">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624317</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136550</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>全像光聚合物之網目尺寸控制及其製造方法</chinese-title>
        <english-title>MESH SIZE CONTROL OF HOLOGRAPHIC PHOTOPOLYMER AND METHOD FOR MAKING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08G18/24</main-classification>
        <further-classification edition="200601120260302B">C08G18/48</further-classification>
        <further-classification edition="200601120260302B">C08G18/72</further-classification>
        <further-classification edition="200601120260302B">C08L75/08</further-classification>
        <further-classification edition="200601120260302B">C08J5/18</further-classification>
        <further-classification edition="200601120260302B">G03F7/00</further-classification>
        <further-classification edition="200601120260302B">G03F7/027</further-classification>
        <further-classification edition="200601120260302B">G03F7/035</further-classification>
        <further-classification edition="200601120260302B">G02B27/01</further-classification>
        <further-classification edition="200601120260302B">G03H1/02</further-classification>
        <further-classification edition="200601120260302B">G03H1/04</further-classification>
        <further-classification edition="201301120260302B">G11B7/24044</further-classification>
        <further-classification edition="200601120260302B">G11B7/245</further-classification>
        <further-classification edition="201301120260302B">G11B7/2533</further-classification>
        <further-classification edition="201301120260302B">G11B7/2535</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡楠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>細山田将士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSOYAMADA, MASANORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　洪喜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, HONGXI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西馬沃里安　謝爾蓋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIMAVORYAN, SERGEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿奇南　馬撒拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALKINANI, MASSARRAH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種新穎全像光聚合物及其製造方法。在一些實施例中，該全像光聚合物可包含聚胺甲酸酯基質、書寫單體(writing monomer)及染料系統。在一些實施例中，該聚胺甲酸酯基質可包含網目尺寸及儲存模數。在一些實施例中，該聚胺甲酸酯基質可包含液體添加劑。在一些實施例中，隨著網目尺寸減小，該聚胺甲酸酯基質之儲存模數自約10² Pa增加至約5x10⁵ Pa。在一些實施例中，描述包含該全像光聚合物之擴增實境/虛擬實境(AR/VR)設備。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a novel holographic photopolymer and method for making the same. In some embodiments, the holographic photopolymer may comprise a polyurethane matrix, a writing monomer, and a dye system. In some embodiments, the polyurethane matrix may comprise a mesh size and a storage modulus. In some embodiments, the polyurethane matrix may comprise a liquid additive. In some embodiments, the storage modulus of the polyurethane matrix increases from about 10² Pa to about 5x10⁵ Pa as the mesh size decreases. In some embodiments, an augmented reality/virtual reality (AR/VR) apparatus comprising the holographic photopolymer is described.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1494" publication-number="202624116">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624116</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136556</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>球形石墨粉之生產</chinese-title>
        <english-title>PRODUCTION OF SPHERICAL GRAPHITE POWDER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260302B">C01B32/205</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENTEGRIS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英嘉　娟　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INGA, JUAN R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班杜爾　陶德　Ｗ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BENDURE, TODD W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史考金斯　特洛伊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCOGGINS, TROY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈特　愛蜜莉亞　Ｈ　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HART, AMELIA H. C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示用於生產球形石墨顆粒之方法及系統。該方法包括將一漿料進料至一噴霧乾燥器。該漿料包括複數個第一顆粒及一石油瀝青。該漿料自該噴霧乾燥器之一噴嘴施配以產生第二複數個顆粒。該第二複數個顆粒之球形度不同於該第一複數個顆粒之一球形度。將該第二複數個顆粒自該噴霧乾燥器進料至一垂直石墨化柱，其中加熱該第二複數個顆粒以生產第三複數個顆粒。該第三複數個顆粒之球形度不同於該第一複數個顆粒之球形度。該第三複數個顆粒可為複數個球形石墨顆粒。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and systems for producing spherical graphite particles is disclosed. The method comprises feeding a slurry to a spray dryer. The slurry comprises a plurality of first particles and a petroleum pitch. The slurry is dispensed from a nozzle of the spray dryer to produce a second plurality of particles. The sphericity of the second plurality of particles is different from a sphericity of the first plurality of particles. The second plurality of particles is fed from the spray dryer to a vertical graphitization column, where the second plurality of particles are heated to produce a third plurality of particles. The sphericity of the third plurality of particles is different from the sphericity of the first plurality of particles. The third plurality of particles can be a plurality of spherical graphite particles.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102:步驟</p>
        <p type="p">104:步驟</p>
        <p type="p">106:步驟</p>
        <p type="p">108:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1495" publication-number="202624875">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624875</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136573</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有不同感知硬體配置以用於提供不同視野的視覺系統</chinese-title>
        <english-title>VISION SYSTEMS WITH DIFFERENT PERCEPTION HARDWARE CONFIGURATIONS FOR PROVIDING DIFFERENT FIELDS OF VIEW</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260309B">G03B35/00</main-classification>
        <further-classification edition="202101120260309B">G03B17/02</further-classification>
        <further-classification edition="202101120260309B">G03B17/55</further-classification>
        <further-classification edition="202101120260309B">G03B5/00</further-classification>
        <further-classification edition="202501120260309B">H05K5/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商薩羅尼克科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SARONIC TECHNOLOGIES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福克斯　拉比諾維茨　約瑟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOX-RABINOVITZ, JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維蘭德　達娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIELAND, DANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯坎德拉　亞伯拉罕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SKANDERA, ABRAHAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭格　傑森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANG, JASON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅里曼　雅各布</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FREEMAN, JACOB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭伯特　道格拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAMBERT, DOUGLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李貞儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">視覺系統包括：框架，其包括第一開口及第二開口；以及立體視覺攝影機，其安置於框架內。立體視覺攝影機包括：第一影像感測器，其具有第一視野(FOV)，第一視野具有第一光軸，第一影像感測器緊鄰第一開口安置；以及第二影像感測器，其具有第二FOV，第二FOV具有第二光軸，第二影像感測器緊鄰第二開口安置。第一影像感測器及第二影像感測器兩者均為被動感測器。第二光軸不與第一光軸平行及/或第一FOV大於第二FOV。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A vision system including a frame including first and second openings and a stereovision camera disposed within the frame. The stereovision camera includes a first image sensor with a first field of view (FOV) having a first optical axis, the first image sensor being disposed immediately adjacent to the first opening, and a second image sensor with a second FOV having a second optical axis, the second image sensor being disposed immediately adjacent to the second opening. Both the first image sensor and the second image sensor are passive sensors. The second optical axis is not parallel with the first optical axis and/or the first FOV is larger than the second FOV.</p>
      </isu-abst>
      <representative-img>
        <p type="p">330:第一示例性感知硬體配置</p>
        <p type="p">331:框架</p>
        <p type="p">332:立體視覺攝影機</p>
        <p type="p">332a:第一IR影像感測器</p>
        <p type="p">332b:第二IR影像感測器</p>
        <p type="p">332c:第一EO影像感測器</p>
        <p type="p">332d:第二EO影像感測器</p>
        <p type="p">334:基線距離</p>
        <p type="p">336a:IR影像感測器FOV/第一FOV</p>
        <p type="p">336a1:光軸</p>
        <p type="p">336b:IR影像感測器FOV/第二FOV</p>
        <p type="p">336b1:光軸</p>
        <p type="p">336c:複合FOV/組合FOV</p>
        <p type="p">336d:盲點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1496" publication-number="202625441">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625441</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136574</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>圖像處理裝置、圖像處理方法、及攝像系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260305B">H04N19/587</main-classification>
        <further-classification edition="201401120260305B">H04N19/51</further-classification>
        <further-classification edition="201401120260305B">H04N19/132</further-classification>
        <further-classification edition="201401120260305B">H04N19/187</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商索尼半導體解決方案公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋秀和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, HIDEKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>名雲武文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGUMO, TAKEFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>城堅誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JO, KENSEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>本田元就</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONDA, MOTONARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉德　賽義德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAD, SAEED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧米勒　安德烈亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUMILLER, ANDREAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之圖像處理裝置包含控制部。控制部將第1訊框圖像編碼化來產生第1碼字。控制部自訊框率較第1訊框圖像高之第2訊框圖像產生運動向量。控制部根據運動向量產生內插第1訊框圖像之內插訊框圖像之第2碼字。控制部將第1碼字及第2碼字合成來產生合成碼字。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:圖像處理系統</p>
        <p type="p">11:攝像系統</p>
        <p type="p">12:顯示系統</p>
        <p type="p">100:攝像裝置</p>
        <p type="p">200:圖像處理裝置</p>
        <p type="p">300:重現裝置</p>
        <p type="p">400:顯示裝置</p>
        <p type="p">S1~S5:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1497" publication-number="202624895">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624895</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136575</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微影遮罩方法及組成物</chinese-title>
        <english-title>LITHOGRAPHY MASK METHODS AND COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G03F7/20</main-classification>
        <further-classification edition="201201120260302B">G03F1/22</further-classification>
        <further-classification edition="202601120260302B">H10P76/00</further-classification>
        <further-classification edition="201101120260302B">B82Y30/00</further-classification>
        <further-classification edition="201101120260302B">B82Y40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商奈尼平版印刷公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANI LITHOGRAPHY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞米拉　利萊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMIRAV, LILAC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露係關於用於半導體製造的微影系統、方法、及遮罩，聚焦於克服光學微影中被繞射限制的臨界尺寸。目前的極紫外線(extreme ultraviolet, EUV)系統一般可達成~12至20 nm的臨界尺寸。然而，更精細的臨界尺寸良率受到隨機效應的限制，包括光子散粒雜訊(photon shot noise)、不可接受的線邊緣粗糙度、及不可接受的隨機橋接或斷裂缺陷。這些隨機失效（而非系統性異常）主導著12至20 nm特徵技術的良率損失。藉由增加源功率或光阻劑敏感度來減少缺陷的嘗試使解析度/粗糙度/敏感度的權衡惡化，進一步縮小程序窗。因此，提供新的微影方法，生成具有高保真度、低隨機缺陷機率、及與300 mm及關注不足的200 mm製造基礎設施兩者相容的10 nm以下特徵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure relates to photolithography systems, methods and masks for semiconductor fabrication, focusing on overcoming diffraction-limited critical dimensions in optical lithography. Current extreme ultraviolet (EUV) systems typically achieve critical dimensions of ~12–20 nm. However, finer critical dimension yields are constrained by stochastic effects including photon shot noise, unacceptable line-edge roughness, and unacceptable random bridging or break defects. These random failures, rather than systematic aberrations, dominate yield loss for the 12-20 nm features’ technologies. Attempts to reduce defects by increasing source power or resist sensitivity worsen the resolution/roughness/sensitivity trade-off, further narrowing the process window. Therefore, new lithographic methods are provided, producing sub-10 nm features with high fidelity, low probability of stochastic defectivity, and compatibility with both 300 mm and the underserved 200 mm fabrication infrastructures.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:步驟</p>
        <p type="p">11:步驟</p>
        <p type="p">12:步驟</p>
        <p type="p">13:步驟</p>
        <p type="p">14:步驟</p>
        <p type="p">100:晶圓</p>
        <p type="p">110:光阻劑基材</p>
        <p type="p">120:吸盤</p>
        <p type="p">200:載體</p>
        <p type="p">210:光刻光罩</p>
        <p type="p">220:奈米級圖案；電漿子天線；電漿子天線奈米結構</p>
        <p type="p">221:透明且惰性材料</p>
        <p type="p">230:間隔物</p>
        <p type="p">300:電磁輻射(EMR)源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1498" publication-number="202625046">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625046</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136582</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>支付過程中身份標識的輸入方法和相關設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120251103B">G06Q20/40</main-classification>
        <further-classification edition="201901120251103B">G06F16/51</further-classification>
        <further-classification edition="201301120251103B">G06F21/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中國銀聯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA UNIONPAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史顏丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孟宏文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金可威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹成初</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁林潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖俊龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種支付過程中身份標識的輸入方法和相關設備，可用於支付處理領域；上述方法包括：接收用戶端發送的身份標識的輸入請求，並生成多張圖片以及關聯的索引；將各張圖片以及關聯的索引發送至用戶端，並接收用戶端發送的用戶選定的圖片的輸入位置及數值；根據數值確定選定的圖片對應的圖片名稱，並確定圖片名稱對應的索引值；根據各個索引值確定用戶在用戶端輸入的各個數字，並按照各個輸入位置，對各個數字進行組合，得到身份標識，並將身份標識與用戶端進行交易的交易流水號進行關聯，以供交易處理系統使用。本發明中，通過用戶選定的圖片、索引值以及索引關聯的陣列的三重映射，實現了用戶對身份標識的安全輸入，提高了支付的安全性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S201、S202、S203、S204:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1499" publication-number="202623813">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623813</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136587</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>KRAS　G12D中間體的製備方法</chinese-title>
        <english-title>METHOD FOR PREPARING KRAS G12D INTERMEDIATES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/553</main-classification>
        <further-classification edition="200601120260302B">A61K31/519</further-classification>
        <further-classification edition="200601120260302B">A61K31/5025</further-classification>
        <further-classification edition="200601120260302B">A61K31/428</further-classification>
        <further-classification edition="200601120260302B">A61K31/4184</further-classification>
        <further-classification edition="200601120260302B">A61K31/381</further-classification>
        <further-classification edition="200601120260302B">A61K31/535</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商江蘇恒瑞醫藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANGSU HENGRUI PHARMACEUTICALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王入志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, RUZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIN, HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳福立</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, FULI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓飛朋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, FEIPENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開提供了KRAS G12D中間體的製備方法。具體而言，本公開提供了一種製備式IV-1所示化合物的方法。該製備工藝路線簡單，整體收率較高，並且可以顯著降低成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a method for preparing KRAS G12D intermediates. Specifically, the present disclosure provides a method for preparing the compounds shown in Formula IV-1. The preparation routes are simple, have a high overall yield, and can significantly reduce costs.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1500" publication-number="202623786">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623786</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136593</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可離子化陽離子脂質和脂質奈米顆粒、及其合成方法和用途</chinese-title>
        <english-title>IONIZABLE CATIONIC LIPIDS AND LIPID NANOPARTICLES, AND METHODS OF SYNTHESIS AND USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260302B">A61K9/1273</main-classification>
        <further-classification edition="202501120260302B">A61K9/127</further-classification>
        <further-classification edition="200601120260302B">A61K31/7088</further-classification>
        <further-classification edition="200601120260302B">A61K48/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商健臻公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENZYME CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　兆華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, ZHAOHUA RICHARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　雪莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHERYL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了用於將核酸遞送至例如免疫細胞和造血幹細胞的靶細胞的可離子化陽離子脂質和脂質奈米顆粒，以及製備和使用這樣的脂質和靶向脂質奈米顆粒之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides ionizable cationic lipids and lipid nanoparticles for the delivery of nucleic acids to target cells, such as immune cells and hematopoietic stem cells, and methods of making and using, such lipids and targeted lipid nanoparticles.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1501" publication-number="202624178">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624178</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136634</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化合物、樹脂組成物、硬化物、預浸體、樹脂複合片、印刷配線板、半導體裝置、及低介電填料</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07C13/62</main-classification>
        <further-classification edition="200601120260302B">C08K5/01</further-classification>
        <further-classification edition="200601120260302B">C08L101/00</further-classification>
        <further-classification edition="200601120260302B">C08J5/24</further-classification>
        <further-classification edition="200601120260302B">B32B15/08</further-classification>
        <further-classification edition="200601120260302B">B32B27/18</further-classification>
        <further-classification edition="200601120260302B">H05K1/03</further-classification>
        <further-classification edition="202601120260302B">H10W70/695</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮本真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAMOTO, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>二村圭亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUTAMURA, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東田和之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIGASHITA, KAZUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飛田健司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIDA, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林郁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供化合物、以及樹脂組成物、硬化物、預浸體、樹脂複合片、印刷配線板、半導體裝置、及低介電填料。本發明內容之化合物係以式(1A)表示。  &lt;br/&gt;&lt;img align="absmiddle" height="276px" width="273px" file="ed10072.JPG" alt="ed10072.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1502" publication-number="202624409">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624409</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136635</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物、硬化膜及包括該硬化膜的電子器件、資訊終端機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">C08L83/07</main-classification>
        <further-classification edition="200601120260313B">C08G77/26</further-classification>
        <further-classification edition="200601120260313B">C08G77/28</further-classification>
        <further-classification edition="200601120260313B">G03F7/028</further-classification>
        <further-classification edition="200601120260313B">C08F2/50</further-classification>
        <further-classification edition="201801120260313B">C08K3/011</further-classification>
        <further-classification edition="200601120260313B">C08K5/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORAY INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芦部友樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASHIBE, TOMOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林秀行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, HIDEYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諏訪充史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUWA, MITSUHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供一種樹脂組成物，其可獲得耐化學品性優異、能夠抑制藥液接觸時的膜厚變動的硬化膜，且保存穩定性優異。本發明為一種樹脂組成物，其含有：（A）矽氧烷樹脂、（B）熱交聯劑、（C）熱鹼產生劑，該（B）熱交聯劑為於分子內具有四個以上的羥甲基或甲氧基甲基的化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:顯示裝置</p>
        <p type="p">2:發光元件</p>
        <p type="p">3:層間絕緣層</p>
        <p type="p">4:配線</p>
        <p type="p">5:相向基板</p>
        <p type="p">6:電極端子</p>
        <p type="p">7:配線層</p>
        <p type="p">8:驅動基板</p>
        <p type="p">11:隔離壁層</p>
        <p type="p">21:平坦化層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1503" publication-number="202624333">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624333</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136645</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物、硬化物、預浸體、樹脂複合片、及印刷配線板、半導體裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08G61/02</main-classification>
        <further-classification edition="200601120260302B">C08L65/00</further-classification>
        <further-classification edition="200601120260302B">C08J5/24</further-classification>
        <further-classification edition="200601120260302B">B32B15/08</further-classification>
        <further-classification edition="200601120260302B">B32B27/00</further-classification>
        <further-classification edition="200601120260302B">H05K1/03</further-classification>
        <further-classification edition="202601120260302B">H10W70/695</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮本真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAMOTO, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>二村圭亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUTAMURA, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東田和之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIGASHITA, KAZUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飛田健司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIDA, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林郁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種樹脂組成物、以及硬化物、預浸體、樹脂複合片、及印刷配線板、半導體裝置。本揭示的樹脂組成物含有：具有式(T1)表示之末端基且具有二氫茚骨架之樹脂(A)、及溶劑，前述樹脂(A)100質量份中含有0.01~0.16質量份之式(B)表示之化合物(B)。  &lt;br/&gt;&lt;img align="absmiddle" height="284px" width="442px" file="ed10093.JPG" alt="ed10093.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1504" publication-number="202623841">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623841</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136647</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>生物體用黏著劑組成物及生物體用黏著劑組成物套組</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61L15/00</main-classification>
        <further-classification edition="200601120260302B">A61L15/20</further-classification>
        <further-classification edition="200601120260302B">A61L15/24</further-classification>
        <further-classification edition="200601120260302B">A61L15/58</further-classification>
        <further-classification edition="200601120260302B">A61L24/00</further-classification>
        <further-classification edition="200601120260302B">A61L24/04</further-classification>
        <further-classification edition="200601120260302B">A61L24/06</further-classification>
        <further-classification edition="200601120260302B">A61L26/00</further-classification>
        <further-classification edition="200601120260302B">A61K47/06</further-classification>
        <further-classification edition="200601120260302B">A61K47/32</further-classification>
        <further-classification edition="200601120260302B">A61K9/70</further-classification>
        <further-classification edition="200601120260302B">A61P17/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI CHEMICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古戶大芽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KODO, TAIGA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊東祐一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, YUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種生物體用黏著劑組成物，係含有：包含具有聚合性不飽和鍵之化合物(A)、與聚合體(B)之摻合組成物；及含有有機硼化合物之聚合起始劑組成物(C)；上述生物體用黏著劑組成物藉由特定之[測定條件]所記載之方法，其測定結果所得之玻璃轉移溫度為未滿80℃。上述玻璃轉移溫度較佳為10℃以上且未滿80℃。上述化合物(A)較佳係一般式(A)-1所示化合物、且具有醯胺構造並具有至少1個以上聚合性雙鍵之化合物的任一者或兩者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1505" publication-number="202625357">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625357</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136654</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>切換式驅動器電路、積體電路與主機裝置</chinese-title>
        <english-title>SWITCHING DRIVER CIRCUITRY, INTEGRATED CIRCUIT AND HOST DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">H02M3/335</main-classification>
        <further-classification edition="200601120260309B">H02M1/08</further-classification>
        <further-classification edition="200601120260309B">H03F3/217</further-classification>
        <further-classification edition="200601120260309B">H03K17/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商思睿邏輯國際半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CIRRUS LOGIC INTERNATIONAL SEMICONDUCTOR LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>里索　約翰　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LESSO, JOHN PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃里克　斯科特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WARRICK, SCOTT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴爾司　詹姆士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEAS, JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">切換式驅動器電路包含：一第一半橋，該第一半橋配置以切換具有一第一量值之一第一供應電壓；一第二半橋，該第二半橋配置以切換具有一第二量值之一第二供應電壓，其中該第一量值大於該第二量值；以及一隔離開關，該隔離開關耦接至該第一半橋及該第二半橋，且可操作以將該第二半橋與該第一半橋隔離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Switching driver circuitry comprising: a first half-bridge configured to switch a first supply voltage having a first magnitude; a second half-bridge configured to switch a second supply voltage having a second magnitude, wherein the first magnitude is greater than the second magnitude; and an isolation switch coupled to the first and second half-bridges and operable to isolate the second half-bridge from the first half-bridge.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:切換式驅動器電路</p>
        <p type="p">410:第一半橋</p>
        <p type="p">412:第一高側開關</p>
        <p type="p">414:第一低側開關</p>
        <p type="p">416、436:輸出節點</p>
        <p type="p">422:第一正電源供應軌/第一正供應軌</p>
        <p type="p">424:第一負電源供應軌/第一負供應軌</p>
        <p type="p">430:第二半橋</p>
        <p type="p">432:第二高側開關</p>
        <p type="p">434:第二低側開關</p>
        <p type="p">442:第二正電源供應軌</p>
        <p type="p">444:第二負電源供應軌</p>
        <p type="p">450:接地開關</p>
        <p type="p">452、478:接地軌</p>
        <p type="p">460:隔離開關</p>
        <p type="p">470:低通濾波器</p>
        <p type="p">472:電感器</p>
        <p type="p">474:電容器</p>
        <p type="p">476:負載</p>
        <p type="p">480:控制電路</p>
        <p type="p">490:積體電路(IC)</p>
        <p type="p">492:半橋輸出端子</p>
        <p type="p">494a、494b、494c:控制輸出端子</p>
        <p type="p">C1~C6:控制信號</p>
        <p type="p">GND:接地電源供應電壓</p>
        <p type="p">SIn:輸入信號</p>
        <p type="p">Vout:輸出電壓</p>
        <p type="p">-VSup1:第一負電源供應電壓/第一負供應電壓</p>
        <p type="p">+VSup1:第一正電源供應電壓/第一正供應電壓</p>
        <p type="p">+VSup2:第二正電源供應電壓/第二正供應電壓</p>
        <p type="p">-VSup2:第二負電源供應電壓/第二負供應電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1506" publication-number="202625109">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625109</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136656</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬幣處理裝置</chinese-title>
        <english-title>COIN PROCESSING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260204B">G07D3/06</main-classification>
        <further-classification edition="200601120260204B">G07D3/12</further-classification>
        <further-classification edition="201901120260204B">G07D11/16</further-classification>
        <further-classification edition="201901120260204B">G07D11/18</further-classification>
        <further-classification edition="201901120260204B">G07D11/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本金錢機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAPAN CASH MACHINE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西村和也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMURA, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種硬幣處理裝置（100），其為具備：接收並1個1個地送出硬幣（10）用之收發部（110），一邊從收發部1個1個地接收硬幣並且使硬幣沿著圓弧移動，一邊判斷硬幣或金幣的種類並且 誘導到各個種類的通路之選別部（120），將驅動力提供給收發部與選別部的共通之驅動馬達（106），以及當收發部停止旋轉時，使馬達逆旋轉的微電腦（190）。在收發部進行逆旋轉的期間，選別部為停止的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a coin processing device (100), which comprises a handling unit (110) for receiving coins (10) and sending them out one by one, a sorting unit (120) for receiving coins one by one from the handling unit and moving the coins along an arc while determining the type of coin or medal and guiding them to a path for each type, a common drive motor (106) for providing driving force to the handling unit and the sorting unit, and a computer (190) for rotating the motor in the reverse direction when the rotation of the handling unit stops. The sorting unit stops while the handling unit is rotating in the reverse direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">106:馬達</p>
        <p type="p">107:齒輪群</p>
        <p type="p">113:輸入旋轉盤</p>
        <p type="p">123:搬運旋轉體</p>
        <p type="p">1081:共通軸</p>
        <p type="p">1082:中間齒輪</p>
        <p type="p">1083:時滯齒輪</p>
        <p type="p">1131:輸入旋轉軸</p>
        <p type="p">1135:操作齒輪</p>
        <p type="p">1232:搬運旋轉軸</p>
        <p type="p">1234:壓縮彈簧</p>
        <p type="p">1235:棘輪齒輪</p>
        <p type="p">1236:煞車件</p>
        <p type="p">1239:時序皮帶</p>
        <p type="p">1284:第2滑輪</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1507" publication-number="202625659">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625659</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136674</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置及顯示裝置之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260304B">H10K59/121</main-classification>
        <further-classification edition="202301120260304B">H10K59/30</further-classification>
        <further-classification edition="202301120260304B">H10K59/38</further-classification>
        <further-classification edition="202301120260304B">H10K59/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商索尼半導體解決方案公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田村一裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAMURA, KAZUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之目的在於可高精細化。  &lt;br/&gt;本揭示之顯示裝置具備以2維陣列狀配置，各自輸出對應色之光之複數個子像素，複數個子像素各自包含發出該子像素之色之光的發光區域，且彼此相鄰之不同色子像素之發光區域彼此間之距離、與彼此相鄰之同色子像素之發光區域彼此間之距離，互不相同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:像素區域</p>
        <p type="p">3:像素</p>
        <p type="p">4:絕緣層</p>
        <p type="p">5:陽極電極</p>
        <p type="p">5B:陽極電極</p>
        <p type="p">5G:陽極電極</p>
        <p type="p">6:發光體</p>
        <p type="p">6B:發光層</p>
        <p type="p">6Ba:端部</p>
        <p type="p">6G:發光層</p>
        <p type="p">6Ga:端部</p>
        <p type="p">30B:子像素</p>
        <p type="p">30G:子像素</p>
        <p type="p">40:通孔</p>
        <p type="p">50:絕緣部</p>
        <p type="p">60B:發光區域</p>
        <p type="p">60G:發光區域</p>
        <p type="p">D1:距離</p>
        <p type="p">D2:距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1508" publication-number="202624274">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624274</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136685</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙特異性結合分子</chinese-title>
        <english-title>BISPECIFIC BINDING MOLECULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">C07K16/28</main-classification>
        <further-classification edition="200601120260306B">A61K39/395</further-classification>
        <further-classification edition="200601120260306B">C07K16/46</further-classification>
        <further-classification edition="200601120260306B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞典商生物極公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIOARCTIC AB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛克　朗尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FALK, RONNY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗雷斯科加爾德　波　歐拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRESKGARD, PER-OLA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍內克　肯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONEK, KEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉哈馬爾　馬汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LARHAMMAR, MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勞登　漢娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAUDON, HANNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅斯特爾　賽巴斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEISTER, SEBASTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑德斯朱　麗莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANDERSJOO, LISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種雙特異性結合分子，其結合類澱粉蛋白β基原纖維及人類運鐵蛋白受體1 (hTfR1)之蛋白酶樣域，以及該雙特異性結合分子之治療及診斷用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a bispecific binding molecule, which binds to protofibrils of amyloid beta and to the protease-like domain of human transferrin receptor 1 (hTfR1), as well as therapeutic and diagnostic uses thereof.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1509" publication-number="202624731">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624731</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136703</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學薄膜之檢查方法及製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260114B">G01N21/88</main-classification>
        <further-classification edition="200601120260114B">G06T5/50</further-classification>
        <further-classification edition="201701120260114B">G06T7/70</further-classification>
        <further-classification edition="200601120260114B">B29D7/01</further-classification>
        <further-classification edition="200601120260114B">B29D11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松林恭平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUBAYASHI, KYOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小西雄太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONISHI, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下裕司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHITA, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐佐木俊介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKI, SHUNSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種光學薄膜之檢查方法，其能夠高精度且效率良好地檢查光學薄膜，而且還能夠特定出缺陷在光學薄膜的厚度方向上的位置資訊。&lt;br/&gt;  [解決手段]本發明具有使用第1拍攝機構1來檢查光學薄膜F的巨觀檢查工序ST1、及使用第2拍攝機構5來檢查光學薄膜的微觀檢查工序ST2。微觀檢查工序根據在巨觀檢查工序特定出的缺陷D的位置資訊，將第2拍攝機構的拍攝視野VF2的位置控制成可以拍攝到缺陷，使第2拍攝機構的焦點位置移動至光學薄膜的厚度方向的複數處，並分別進行拍攝，藉此生成複數個拍攝圖像，特定出合成了複數個拍攝圖像之合成圖像中的與缺陷及其附近相當的評價對象區域EA，根據與評價對象區域相同的像素區域內的亮度值，在複數個拍攝圖像當中特定出對焦圖像，根據對焦圖像，取得缺陷的詳細資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">ST1:巨觀檢查工序(工序)</p>
        <p type="p">ST2:微觀檢查工序(工序)</p>
        <p type="p">ST21:拍攝視野控制步驟(步驟)</p>
        <p type="p">ST22:拍攝圖像生成步驟(步驟)</p>
        <p type="p">ST23:評價對象區域特定步驟(步驟)</p>
        <p type="p">ST24:對焦圖像特定步驟(步驟)</p>
        <p type="p">ST25:詳細資訊取得步驟(步驟)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1510" publication-number="202624275">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624275</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136711</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雙特異性結合分子</chinese-title>
        <english-title>BISPECIFIC BINDING MOLECULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">C07K16/28</main-classification>
        <further-classification edition="200601120260306B">A61K39/395</further-classification>
        <further-classification edition="200601120260306B">C07K16/46</further-classification>
        <further-classification edition="200601120260306B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞典商生物極公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIOARCTIC AB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾瑞克森　佛德瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ERIKSSON, FREDRIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛克　朗尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FALK, RONNY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗雷斯科加爾德　波　歐拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRESKGARD, PER-OLA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍內克　肯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONEK, KEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉哈馬爾　馬汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LARHAMMAR, MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勞登　漢娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAUDON, HANNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅斯特爾　賽巴斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEISTER, SEBASTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑德斯朱　麗莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANDERSJOO, LISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種雙特異性結合分子，其結合α-突觸核蛋白基原纖維(α-突觸核蛋白聚集體)及人類運鐵蛋白受體1 (hTfR1)之蛋白酶樣域，以及該雙特異性結合分子之治療及診斷用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a bispecific binding molecule, which binds to α-synuclein protofibrils (α-synuclein aggregates) and to the protease-like domain of human transferrin receptor 1 (hTfR1), as well as therapeutic and diagnostic uses thereof.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1511" publication-number="202624387">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624387</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136714</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚烯烴薄膜、黏著薄膜、切割膠帶、半導體晶片之製造方法、製造裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">C08L23/06</main-classification>
        <further-classification edition="201801120260311B">C09J7/22</further-classification>
        <further-classification edition="200601120260311B">C08J5/22</further-classification>
        <further-classification edition="200601120260311B">B32B5/04</further-classification>
        <further-classification edition="200601120260311B">B32B27/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東麗薄膜先端加工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORAY ADVANCED FILM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田邨奈穗子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAMURA, NAOKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>濱崎莉沙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMASAKI, RISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂本光隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAMOTO, MITSUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田崎龍幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TASAKI, TATSUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石井聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHII, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧山太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKUYAMA, FUTOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>町田哲也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACHIDA, TETSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井上則英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOUE, NORIHIDE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種聚烯烴薄膜，其在作為切割膠帶來使用時，伸展步驟之加工性與半導體用晶片之拾取性優異，甚至均勻延伸性也優異。一種聚烯烴薄膜，其在將長邊方向之降伏點延伸度(%)、降伏點應力(MPa)、300%伸長時之應力(MPa)分別設為LA1、FA1、FB1，將寬度方向之降伏點延伸度(%)、降伏點應力(MPa)、300%伸長時之應力(MPa)分別設為LA2、FA2、FB2時，滿足式(1)~式(4)。&lt;br/&gt;  0.8≦(FB1/FA1)≦1.2 …式(1)&lt;br/&gt;  0.8≦(FB2/FA2)≦1.2 …式(2)&lt;br/&gt;  │FA1-FA2│≦1.0MPa …式(3)&lt;br/&gt;  │LA1-LA2│≦20% …式(4)</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1512" publication-number="202624740">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624740</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136768</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於電化學氣體感測器的多偏壓方案</chinese-title>
        <english-title>MULTI-BIAS SCHEME FOR AN ELECTROCHEMICAL GAS SENSOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">G01N27/26</main-classification>
        <further-classification edition="200601120260309B">G01N33/00</further-classification>
        <further-classification edition="200601120260309B">G01R19/25</further-classification>
        <further-classification edition="200601120260309B">G01R19/165</further-classification>
        <further-classification edition="200601120260309B">G01R19/04</further-classification>
        <further-classification edition="202301120260309B">G06N3/08</further-classification>
        <further-classification edition="200601120260309B">G06F17/10</further-classification>
        <further-classification edition="201801120260309B">G06F9/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐昌廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, CHANGTING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊杰智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JIEZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕帕喬吉歐　埃夫西米奧斯菲利普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAPAGEORGIOU, EFTHYMIOS PHILIP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　金志敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, JIM CHIH-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬爾傑夫　科斯塔丁季米特洛夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DJORDJEV, KOSTADIN DIMITROV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的各種態樣大致上係關於氣體偵測。在一些態樣中，一氣體偵測系統可經由一電化學裝置中的一或多個氣體孔隙接收一或多種氣體的一組成物。該氣體偵測系統可施加一組偏壓子循環，其中，對於各偏壓子循環，一施加電壓在一對應穩定電壓與以該對應穩定電壓為中心的複數個時變電壓之間交替。該氣體偵測系統可在施加該組偏壓子循環的同時偵測一電流或一電壓中之至少一者。該氣體偵測系統可至少部分地基於該經偵測電流或該經偵測電壓中之該至少一者而識別各氣體的一存在或各氣體的一濃度中之至少一者。描述多種其他態樣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various aspects of the present disclosure generally relate to gas detection. In some aspects, a gas detection system may receive, via one or more gas apertures in an electrochemical device, a composition of one or more gases. The gas detection system may apply a set of bias voltage sub-cycles, wherein, for each bias voltage sub-cycle, an applied voltage alternates between a corresponding steady voltage and a plurality of time-varying voltages centered about the corresponding steady voltage. The gas detection system may detect at least one of a current or a voltage while applying the set of bias voltage sub-cycles. The gas detection system may identify at least one of a presence of each gas or a concentration of each gas based at least in part on the at least one of the detected current or the detected voltage. Numerous other aspects are described.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:實例</p>
        <p type="p">405:偏壓循環</p>
        <p type="p">410-1:第一偏壓子循環</p>
        <p type="p">410-2:第二偏壓子循環</p>
        <p type="p">410-3:第三偏壓子循環</p>
        <p type="p">410-4:第四偏壓子循環</p>
        <p type="p">410-5:第五偏壓子循環</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1513" publication-number="202623819">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623819</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136770</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>合成２＇，４＇－ＢＮＡ（ＮＣ）核苷類似物之新方法</chinese-title>
        <english-title>NEW PROCESS FOR THE SYNTHESIS OF 2',4'-BNA(NC) NUCLEOSIDE ANALOGUES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/7042</main-classification>
        <further-classification edition="200601120260302B">C07H19/04</further-classification>
        <further-classification edition="200601120260302B">C07H19/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商施維雅藥廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LES LABORATOIRES SERVIER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大塞門夫拉則河大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIMON FRASER UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布里頓　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRITTON, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛格　巴拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGH, BARA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>百卡比　蘇賓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAIKABI, SUPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡瓦列羅　加西亞　吉列爾莫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CABALLERO GARCIA, GUILLERMO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MX</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嬌納得　拉斐爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUIGNARD, RAPHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔泰　傑諾斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TATAI, JANOS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倪兒祺　米克羅司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NYERGES, MIKLOS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種合成核苷類似物之方法。  &lt;br/&gt;更特定言之，本發明係關於一種製備式(IV)化合物之方法，該式(IV)化合物為用於產生式A之2',4'-BNA&lt;sup&gt;NC&lt;/sup&gt;的中間物。  &lt;br/&gt;本發明係關於一種製備式A之2',4'-BNA&lt;sup&gt;NC&lt;/sup&gt;之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a method for the synthesis of nucleoside analogues. &lt;br/&gt;More specifically, the present invention relates to a process for the preparation of a compound of formula (IV) which is an intermediate for producing the 2',4'-BNA&lt;sup&gt;NC&lt;/sup&gt; of formula A. &lt;br/&gt;The present invention relates to a process for the preparation of the 2',4'-BNA&lt;sup&gt;NC&lt;/sup&gt; of formula A.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1514" publication-number="202624810">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624810</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136772</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>波長交叉連接電路</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G02B6/35</main-classification>
        <further-classification edition="200601120260302B">G02B6/124</further-classification>
        <further-classification edition="201301120260302B">H04B10/291</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立研究開發法人產業技術總合研究所</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池田和浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEDA, KAZUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻池遼太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONOIKE, RYOTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木恵治郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, KEIJIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">為了能夠進行更寬頻帶動作，本發明之波長交叉連接電路具有：M條第1光波導，其等依照波長自短至長之順序各自串聯形成有N&lt;sub&gt;λ&lt;/sub&gt;個波長擷取濾波器，該等N&lt;sub&gt;λ&lt;/sub&gt;個波長擷取濾波器各自擷取第1至第N&lt;sub&gt;λ&lt;/sub&gt;波長中之任一波長之光信號，且僅於該1波長之短波長側產生對於該1波長以外之波長之繞射之模式；N條第2光波導，其等依照波長自短至長之順序各自串聯形成有N&lt;sub&gt;λ&lt;/sub&gt;個波長擷取濾波器；及N&lt;sub&gt;λ&lt;/sub&gt;個M輸入N輸出光開關，其等將在M條第1光波導中擷取同一波長之光信號之波長擷取濾波器之M個擷取埠、與在N條第2光波導中擷取與上述同一波長相同波長之光信號之波長擷取濾波器之N個擷取埠一對一地且以1或複數個組合連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1~4:輸入用光波導</p>
        <p type="p">5~8:輸出用光波導</p>
        <p type="p">11~14,21~24,31~34,41~44,51~54,61~64,71~74,81~84:波長選擇耦合器</p>
        <p type="p">16~19,26~29,36~39,46~49,56~59,66~69,76~79,86~89:擷取埠</p>
        <p type="p">101~104:光開關</p>
        <p type="p">150:控制部</p>
        <p type="p">λ&lt;sub&gt;1&lt;/sub&gt;~λ&lt;sub&gt;4&lt;/sub&gt;:波長</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1515" publication-number="202624202">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624202</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136807</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光化射線性或感放射線性樹脂組成物、感光化射線性或感放射線性膜、圖案形成方法、及電子器件之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07C309/46</main-classification>
        <further-classification edition="200601120260302B">C08F212/14</further-classification>
        <further-classification edition="200601120260302B">C08F212/32</further-classification>
        <further-classification edition="200601120260302B">C08F220/18</further-classification>
        <further-classification edition="200601120260302B">C08F220/30</further-classification>
        <further-classification edition="200601120260302B">C08F220/32</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/039</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="200601120260302B">G03F7/32</further-classification>
        <further-classification edition="202601120260302B">H10P76/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上農悠花</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMINO, YUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉岡知昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIOKA, TOMOAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口修平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, SHUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種感光化射線性或感放射線性樹脂組成物、使用上述感光化射線性或感放射線性樹脂組成物的感光化射線性或感放射線性膜、圖案形成方法、及電子器件之製造方法，上述感光化射線性或感放射線性樹脂組成物含有樹脂（A）及化合物（B），所述樹脂（A）包含具有藉由酸的作用分解而極性增大之基團的重複單元，所述化合物（B）具有特定結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1516" publication-number="202624319">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624319</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136810</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於化學機械拋光之墊</chinese-title>
        <english-title>PAD FOR CHEMICAL MECHANICAL POLISHING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08G18/48</main-classification>
        <further-classification edition="200601120260302B">C08G18/61</further-classification>
        <further-classification edition="200601120260302B">C08G18/75</further-classification>
        <further-classification edition="200601120260302B">C08G18/76</further-classification>
        <further-classification edition="200601120260302B">C08G77/46</further-classification>
        <further-classification edition="200601120260302B">C08L75/04</further-classification>
        <further-classification edition="200601120260302B">C08L101/00</further-classification>
        <further-classification edition="200601120260302B">C08K5/375</further-classification>
        <further-classification edition="200601120260302B">C08K7/22</further-classification>
        <further-classification edition="201201120260302B">B24B37/04</further-classification>
        <further-classification edition="201201120260302B">B24B37/20</further-classification>
        <further-classification edition="201201120260302B">B24B37/24</further-classification>
        <further-classification edition="200601120260302B">B24D3/28</further-classification>
        <further-classification edition="200601120260302B">B24D11/00</further-classification>
        <further-classification edition="202601120260302B">H10P52/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商杜邦電子材料控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUPONT ELECTRONIC MATERIALS HOLDING, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加丁斯基　馬修Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GADINSKI, MATTHEW R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克里華斯　安妮特Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CREVASSE, ANNETTE M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種拋光墊，用於對半導體、光學、磁性或機電襯底中的至少一種進行拋光。拋光墊包含拋光層，該拋光層進而包含胺基甲酸酯-脲共聚物的基質聚合物。該胺基甲酸酯-脲共聚物係含胺基甲酸酯的多元醇預聚物和胺固化固化劑的固化產物。該含胺基甲酸酯的多元醇預聚物係組分包括一種或多種多元醇、具有矽酮重複單元並用醚醇封端的矽酮低聚物、和多異氰酸酯化合物的含胺基甲酸酯的反應產物，並且矽酮低聚物用甲醇基團封端並與多異氰酸酯化合物反應以形成含胺基甲酸酯的多元醇預聚物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The polishing pad is for polishing at least one of semiconductor, optical, magnetic or electromechanical substrates. The polishing pad includes a polishing layer that in turn includes a matrix polymer of a urethane-urea copolymer. The urethane-urea copolymer is the cured product of a urethane-containing polyol prepolymer and an amine cure curing agent. The urethane-containing polyol prepolymer is a urethane-containing reaction product of components comprising one or more polyols, a silicone oligomer having silicone repeat units and end capped with ether alcohol, and a polyisocyanate compound and the silicone oligomers are end capped with carbinol groups and reacted with the polyisocyanate compound to form the urethane-containing polyol prepolymer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:低矽酮聚胺酯域</p>
        <p type="p">12:膨脹的聚合物微球</p>
        <p type="p">14:富矽酮相分離域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1517" publication-number="202624179">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624179</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136819</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光化射線性或感放射線性樹脂組成物、光阻膜、圖案形成方法、電子器件之製造方法、以及鎓鹽化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07C25/18</main-classification>
        <further-classification edition="200601120260302B">C07C311/16</further-classification>
        <further-classification edition="200601120260302B">C07C311/48</further-classification>
        <further-classification edition="200601120260302B">C07C311/29</further-classification>
        <further-classification edition="200601120260302B">C07C381/12</further-classification>
        <further-classification edition="200601120260302B">C07D327/06</further-classification>
        <further-classification edition="200601120260302B">C07D333/76</further-classification>
        <further-classification edition="200601120260302B">C07D409/12</further-classification>
        <further-classification edition="200601120260302B">C07D493/08</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/038</further-classification>
        <further-classification edition="200601120260302B">G03F7/039</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="200601120260302B">G03F7/32</further-classification>
        <further-classification edition="202601120260302B">H10P76/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小島雅史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOJIMA, MASAFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉村務</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIMURA, TSUTOMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森貴大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORI, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種感光化射線性或感放射線性樹脂組成物、使用上述感光化射線性或感放射線性樹脂組成物的光阻膜、圖案形成方法及電子器件之製造方法、以及鎓鹽化合物，上述感光化射線性或感放射線性樹脂組成物包含由說明書中所記載的通式（N-1）表示的鎓鹽化合物（N）、藉由酸的作用而極性變化的樹脂、及溶劑，上述鎓鹽化合物係由說明書中所記載的通式（N-1）表示的鎓鹽化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1518" publication-number="202624298">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624298</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136823</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光化射線性或感放射線性樹脂組成物、光阻膜、圖案形成方法、及電子器件之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08F212/14</main-classification>
        <further-classification edition="200601120260302B">C08F212/32</further-classification>
        <further-classification edition="200601120260302B">C08F220/18</further-classification>
        <further-classification edition="200601120260302B">C08F220/28</further-classification>
        <further-classification edition="200601120260302B">C08F220/30</further-classification>
        <further-classification edition="200601120260302B">C08F220/32</further-classification>
        <further-classification edition="200601120260302B">C08F220/36</further-classification>
        <further-classification edition="200601120260302B">C08F220/38</further-classification>
        <further-classification edition="200601120260302B">C08F220/40</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/038</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="200601120260302B">G03F7/32</further-classification>
        <further-classification edition="202601120260302B">H10P76/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畠山直也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATAKEYAMA, NAOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小島雅史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOJIMA, MASAFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種感光化射線性或感放射線性樹脂組成物、使用上述感光化射線性或感放射線性樹脂組成物的光阻膜、圖案形成方法、及電子器件之製造方法，上述感光化射線性或感放射線性樹脂組成物包含樹脂、藉由光化射線或放射線之照射而產生酸的化合物、及溶劑，上述樹脂的由說明書中所記載之式（A）表示的P（10%）為0.40以上，上述P（10%）根據藉由凝膠滲透層析測定獲得之積分分子量分佈曲線求得。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1519" publication-number="202624296">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624296</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136828</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光化射線性或感放射線性樹脂組成物、感光化射線性或感放射線性膜、圖案形成方法、及電子器件之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08F212/12</main-classification>
        <further-classification edition="200601120260302B">C08F212/14</further-classification>
        <further-classification edition="200601120260302B">C08F212/32</further-classification>
        <further-classification edition="200601120260302B">C08F220/06</further-classification>
        <further-classification edition="200601120260302B">C08F220/18</further-classification>
        <further-classification edition="200601120260302B">C08F220/30</further-classification>
        <further-classification edition="200601120260302B">C08F220/32</further-classification>
        <further-classification edition="200601120260302B">C08F230/08</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/039</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="200601120260302B">G03F7/32</further-classification>
        <further-classification edition="202601120260302B">H10P76/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上農悠花</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMINO, YUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉岡知昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIOKA, TOMOAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口修平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, SHUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種感光化射線性或感放射線性樹脂組成物、使用上述感光化射線性或感放射線性樹脂組成物的感光化射線性或感放射線性膜、圖案形成方法及電子器件之製造方法，上述感光化射線性或感放射線性樹脂組成物含有：樹脂（A），其包含具有選自由酚性羥基及具有羧基的芳香環基所組成之群組中的至少一者的重複單元、和具有酸分解性基的重複單元；樹脂（B），其滿足特定式且不包含具有氟化烷基的重複單元；以及溶劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1520" publication-number="202625856">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625856</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136882</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微孔填裝系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR FILLING MICRO CONDUCTIVE BODIES IN MICROPORES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W72/50</main-classification>
        <further-classification edition="202601120260302B">H10W76/05</further-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
        <further-classification edition="200601120260302B">G01N21/25</further-classification>
        <further-classification edition="200601120260302B">G01N29/04</further-classification>
        <further-classification edition="200601120260302B">G01N29/46</further-classification>
        <further-classification edition="200601120260302B">B81C1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聚嶸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COHPROS INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林士聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIH-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游智偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種微孔填裝系統及方法，適用於將具磁性的複數個微導電體填裝於一基板的複數個微孔中。本發明的微孔填裝系統包含：一處理模組、一磁力模組以及一振動模組；其中，所述磁力模組係電性連接於所述處理模組，通過接收所述處理模組的訊號，在所述基板上方提供一磁力，以使所述微導電體受所述磁力影響而移動；所述振動模組係電性連接於所述處理模組，用以振動所述基板，使所述微導電體填入於所述微孔中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a system and a method of filling micro conductive bodies in micropores of a substrate. The system includes a processing module, a magnetic module and a vibration module. The magnetic, electrically connected to the processing module, provides a magnetic force above the substrate through receiving a signal of the processing module so that the micro conductive bodies moves under the influence of the magnetic force. The vibration module, electrically connected to the processing module, vibrates the substrate and makes the micro conductive bodies be filled in the micropores.</p>
      </isu-abst>
      <representative-img>
        <p type="p">Z:微孔填裝系統</p>
        <p type="p">21:處理模組</p>
        <p type="p">22:監測模組</p>
        <p type="p">23:振動模組</p>
        <p type="p">24:磁力模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1521" publication-number="202625722">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625722</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136887</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>
        <english-title>SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260309B">H10P70/00</main-classification>
        <further-classification edition="202601120260309B">H10P72/00</further-classification>
        <further-classification edition="200601120260309B">B08B3/04</further-classification>
        <further-classification edition="200601120260309B">F26B3/02</further-classification>
        <further-classification edition="200601120260309B">G01N21/86</further-classification>
        <further-classification edition="201801120260309B">G06F9/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>篠原敬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINOHARA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之基板處理裝置構成為能夠進行朝基板之上表面供給沖洗液之沖洗處理、及使沖洗處理後之基板乾燥之乾燥處理。基板處理裝置包含：狀態檢測裝置，其檢測表示基板之上表面之狀態之物理量；及判定部，其判定基板之上表面是否乾燥。狀態檢測裝置將沖洗處理前之基板之物理量，作為第1物理量而檢測。又，狀態檢測裝置將沖洗處理後之基板之物理量，作為第2物理量而檢測。判定部基於檢測到之第1物理量及檢測到之第2物理量，判定基板之上表面是否乾燥。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板洗淨裝置</p>
        <p type="p">2:殼體</p>
        <p type="p">2a:前壁部</p>
        <p type="p">2b:後壁部</p>
        <p type="p">2c:左壁部</p>
        <p type="p">2d:右壁部</p>
        <p type="p">3:搬入搬出口</p>
        <p type="p">10:基板保持裝置</p>
        <p type="p">11:基板保持部</p>
        <p type="p">20:杯裝置</p>
        <p type="p">21:杯</p>
        <p type="p">30:刷裝置</p>
        <p type="p">31:導軌</p>
        <p type="p">32:刷驅動部</p>
        <p type="p">33:支持軸</p>
        <p type="p">34:臂</p>
        <p type="p">35:刷單元</p>
        <p type="p">40:噴灑裝置</p>
        <p type="p">41:噴灑驅動部</p>
        <p type="p">42:旋轉軸</p>
        <p type="p">43:臂</p>
        <p type="p">44:噴灑噴嘴</p>
        <p type="p">50:沖洗裝置</p>
        <p type="p">51:沖洗噴嘴</p>
        <p type="p">60:氣體供給裝置</p>
        <p type="p">61:噴嘴驅動部</p>
        <p type="p">62:旋轉軸</p>
        <p type="p">63:臂</p>
        <p type="p">64:氣體噴嘴</p>
        <p type="p">70:狀態檢測裝置</p>
        <p type="p">71:頭驅動部</p>
        <p type="p">72:旋轉軸</p>
        <p type="p">73:臂</p>
        <p type="p">74:頭部</p>
        <p type="p">80:開閉裝置</p>
        <p type="p">81:擋門</p>
        <p type="p">82:擋門驅動部</p>
        <p type="p">900:控制裝置</p>
        <p type="p">A30,A40,A60,A70,AA,AB:箭頭</p>
        <p type="p">p61:氣體噴嘴待機位置</p>
        <p type="p">p62:氣體供給位置</p>
        <p type="p">p71:頭待機位置</p>
        <p type="p">p72:檢測位置</p>
        <p type="p">W:基板</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1522" publication-number="202624467">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624467</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136889</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電絕緣油組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">C10M101/02</main-classification>
        <further-classification edition="200601120260303B">H01B3/20</further-classification>
        <further-classification edition="200601120260303B">H01B1/02</further-classification>
        <further-classification edition="201801120260303B">C08K3/014</further-classification>
        <further-classification edition="200601120260303B">C08L71/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商出光興產股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IDEMITSU KOSAN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大野高志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONO, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後藤健治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOTO, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電絕緣油組成物，其滿足下述要件(1)～(3)。&lt;br/&gt;  ・要件(1)：藉由環分析(n-d-M法)所得之%CA為5.5%以下。&lt;br/&gt;  ・要件(2)：以前述電絕緣油組成物之總量為基準計，硫原子之含量為20質量ppm以上。&lt;br/&gt;  ・要件(3)：流動點為-50.0℃以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1523" publication-number="202625778">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625778</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136891</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於半導體量測中照明角度之現場發現之方法及系統</chinese-title>
        <english-title>METHODS AND SYSTEMS FOR IN-SITU DISCOVERY OF ILLUMINATION ANGLES IN SEMICONDUCTOR MEASUREMENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260309B">H10P74/20</main-classification>
        <further-classification edition="202601120260309B">H10P72/50</further-classification>
        <further-classification edition="202601120260309B">H10P72/70</further-classification>
        <further-classification edition="201801120260309B">G01N23/20</further-classification>
        <further-classification edition="200601120260309B">G06F17/10</further-classification>
        <further-classification edition="201801120260309B">G06F9/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳博學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, BOXUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉非　尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEFET, NIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞爾　吉姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REAL, JIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王天含</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TIANHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張廣琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, GUANGQI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>里曼　克里斯多福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIMAN, CHRISTOPHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林永一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUNG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮　輝　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, HUY M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普雷斯　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRESS, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中描述用於補償照明入射角之不確定性以實現半導體結構之準確量測之方法及系統。在一個態樣中，依一或多個標稱入射角執行量測，估計對應於各量測之一實際入射角，且至少部分基於經收集量測資料及該實際入射角估計特性化一經量測結構之一所關注參數之一值。在一些實例中，直接量測一實際入射角。在一些其他實例中，自在一標稱照明入射角範圍內收集之量測資料估計一實際入射角。在一些其他實例中，自在一標稱照明入射角範圍內收集之量測資料估計相對於一傾斜結構之一實際入射角。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and systems for compensating for uncertainty in illumination angle of incidence to enable accurate measurements of semiconductor structures are described herein. In one aspect, measurements are performed at one or more nominal angles of incidence, an actual angle of incidence corresponding to each measurement is estimated, and a value of a parameter of interest characterizing a measured structure is estimated based at least in part on the collected measurement data and the actual angle of incidence. In some examples, an actual angle of incidence is directly measured. In some other examples, an actual angle of incidence is estimated from measurement data collected over a range of nominal illumination angles of incidence. In some other examples, an actual angle of incidence with respect to a tilted structure is estimated from measurement data collected over a range of nominal illumination angles of incidence.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:計量系統</p>
        <p type="p">101:橢偏計子系統/橢偏計</p>
        <p type="p">110:照明源/照明光源</p>
        <p type="p">111:光學濾光片</p>
        <p type="p">112:偏光組件</p>
        <p type="p">113:場光闌</p>
        <p type="p">114:光瞳孔徑光闌</p>
        <p type="p">115:照明光學器件</p>
        <p type="p">116:量測點</p>
        <p type="p">117:照明光束/照明光/入射照明光束</p>
        <p type="p">120:晶圓/樣品</p>
        <p type="p">122:集光光學器件</p>
        <p type="p">123:光瞳孔徑光闌</p>
        <p type="p">124:偏光元件</p>
        <p type="p">125:集光場光闌</p>
        <p type="p">126:光譜計/偵測器</p>
        <p type="p">127:經收集光束/經收集光/經收集輻射</p>
        <p type="p">128:輸出信號/量測資料</p>
        <p type="p">129:所關注參數</p>
        <p type="p">130:電腦系統/運算系統</p>
        <p type="p">131:處理器</p>
        <p type="p">132:記憶體</p>
        <p type="p">133:匯流排</p>
        <p type="p">134:程式指令</p>
        <p type="p">140:晶圓載物台</p>
        <p type="p">141:運動命令信號/控制命令</p>
        <p type="p">147:晶圓夾頭</p>
        <p type="p">150:晶圓定向量測子系統</p>
        <p type="p">151:光學照明源</p>
        <p type="p">152:光學偵測器</p>
        <p type="p">153:聚焦光學器件</p>
        <p type="p">154:光學照明光束</p>
        <p type="p">155:光</p>
        <p type="p">156:信號</p>
        <p type="p">AZ:方位角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1524" publication-number="202625092">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625092</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136907</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資料處理裝置、電腦程式元件、電腦可讀介質以及產生環境視覺表示的方法</chinese-title>
        <english-title>DATA PROCESSING DEVICE, COMPUTER PROGRAM ELEMENT, COMPUTER-READABLE MEDIUM AND METHOD FOR GENERATING A VISUAL REPRESENTATION OF AN ENVIRONMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120260305B">G06T15/06</main-classification>
        <further-classification edition="201701120260305B">G06T7/73</further-classification>
        <further-classification edition="202001120260305B">G01S17/89</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商新創智能私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DCONSTRUCT TECHNOLOGIES PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭继宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, JIZONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庄　家逸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHONG, JIA YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>许凯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝　知澔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSE, TZE HO ELDEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種產生環境視覺表示的方法，包含針對在一環境中多個裝置姿態的每一者，接收由一光學雷達資料和多個圖像產生的一光學雷達點雲，其中在環境中具有多個裝置姿態的一者的一裝置記錄光學雷達資料和多個圖像，以及多個裝置姿態的一者的一估計；針對一視覺表示模型的多個模型參數以及多個裝置姿態的每一者的多個裝置姿態補償進行一目標函數的一優化，視覺表示模型係針對接收到的多個圖像所顯示的一環境進行建模，其中一或多個學習率用於多個裝置姿態補償，多個學習率取決於光學雷達點雲相對於多個裝置姿態補償的靈敏度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Aspects concern a method for generating a visual representation of an environment, the method comprising receiving, for each device pose of a plurality of device poses within the environment, a lidar point cloud generated from lidar data and multiple images, wherein the lidar data and the multiple images are recorded by a device having the device pose in the environment, and an estimate of the device pose and optimizing an objective function over model parameters of a visual representation model modelling an environment shown by the received images and over, for each device pose, device pose compensations of the device pose, wherein, one or more learning rates are used for the device pose compensations which depend on the sensitivity of the lidar point cloud with respect to the device pose compensations.</p>
      </isu-abst>
      <representative-img>
        <p type="p">501,502:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1525" publication-number="202623926">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623926</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136926</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>金屬粉末之製造方法及金屬粉末</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">B22F9/24</main-classification>
        <further-classification edition="202201120260302B">B22F1/052</further-classification>
        <further-classification edition="202201120260302B">B22F1/054</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商昭榮化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHOEI CHEMICAL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秋本裕二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKIMOTO, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩崎峰人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWASAKI, MINETO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>家田秀康</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IEDA, HIDENORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邊真司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青木陽輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOKI, YOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種金屬粉末之製造方法，其具有以下步驟：第1步驟，其使藉由在液相中使金屬離子進行化學反應而生成，且另外定義之CV值為0.40以下的原料粉末，藉由載體氣體在氣相中以1.0g/L以下的濃度進行分散；第2步驟，其將分散於前述氣相中之狀態的前述原料粉末，以(Tm-100)℃以上小於Tb℃的溫度(惟，Tm℃為原料粉末所含之由金屬原子組成的金屬之熔點，Tb℃為原料粉末所含之由金屬原子組成的金屬之沸點。)進行熱處理，藉以生成分散於前述氣相中之狀態的金屬粉末前驅物；以及第3步驟，其藉由將分散於前述氣相中之狀態的前述金屬粉末前驅物進行冷卻而生成金屬粉末。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1526" publication-number="202624520">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624520</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136936</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於碳間隙填充製程的沉積蝕刻物種IADF及IEDF控制</chinese-title>
        <english-title>DEPOSITION-ETCH SPECIES IADF AND IEDF CONTROL FOR CARBON GAPFILL PROCESSES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">C23C16/26</main-classification>
        <further-classification edition="200601120260304B">C23C16/50</further-classification>
        <further-classification edition="200601120260304B">C23C16/455</further-classification>
        <further-classification edition="200601120260304B">H05H1/24</further-classification>
        <further-classification edition="202601120260304B">H10W10/17</further-classification>
        <further-classification edition="202601120260304B">H10W76/05</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布伊揚　沙里夫伊斯蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHUIYAN, SHARIFUL ISLAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BD</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡賈　阿卜杜勒阿齊茲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHAJA, ABDUL AZIZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王珮琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, PEIQI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加達米迪　瓦姆西克里希納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GADDAMEDI, VAMSHI KRISHNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納加拉詹　阿南沙文卡塔拉曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGARAJAN, ANANTHA VENKATARAMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">此處所描述的實施例包括裝置及用於沉積膜的方法。該方法包括在製程空間內接收基板。該基板上包括具有不同的臨界尺寸的結構。在製程空間內使用製程氣體形成電漿。該電漿是藉由脈衝化高頻（HF）功率及低頻（LF）功率的組合所形成。該膜沉積在基板的表面上。該膜在相鄰結構之間的溝槽內沉積，且其中膜是由前驅物氣體所形成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments described herein include a device and method of for depositing a film. The method includes receiving a substrate in a process volume. The substrate includes structures thereon having varying critical dimensions. A plasma is formed in the process volume using a process gas. The plasma is formed by pulsing a combination of high frequency (HF) power and low frequency (LF) power. The film is deposited over a surface of the substrate. The film is deposited in a trench between adjacent structures, and wherein the film is formed from a precursor gas.</p>
      </isu-abst>
      <representative-img>
        <p type="p">126:基板</p>
        <p type="p">302:結構</p>
        <p type="p">306:膜</p>
        <p type="p">308:平坦化襯墊</p>
        <p type="p">310:第一材料</p>
        <p type="p">312:第二材料</p>
        <p type="p">d&lt;sub&gt;1&lt;/sub&gt;:高度差/距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1527" publication-number="202625736">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625736</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136991</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>內藏加熱器式拆裝罩</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260305B">H10P72/00</main-classification>
        <further-classification edition="202601120260305B">H10P72/70</further-classification>
        <further-classification edition="200601120260305B">H05B3/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緑川洋平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIDORIKAWA, YOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]在將附有外裝罩的內藏加熱器式拆裝罩安裝於基板處理裝置的配管時，能夠確實地緊固內周側，且不需緊固外周側，而可維持隔熱性。  &lt;br/&gt;　　[解決手段]一種內藏加熱器式拆裝罩，安裝於處理基板的基板處理裝置的配管，含有：接近上述配管的外周面而配置的內皮部、及以於內部具有空間的方式配置於上述內皮部的外側的外皮部，於上述空間，設置有：配置為覆蓋上述內皮部的周面的加熱器部、及可彈性變形的隔熱材，並具備有：內側緊固構件，構成為能夠將上述內皮部及上述加熱器部對上述配管進行一體式地緊固；及外側緊固構件，構成為能夠將上述外皮部對上述配管進行緊固，以固定於該配管。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">150a:側端部</p>
        <p type="p">150b:側端部</p>
        <p type="p">200:內藏加熱器式拆裝罩</p>
        <p type="p">210b:內側用固定部</p>
        <p type="p">210c:內側用貼附部</p>
        <p type="p">220a:外側用固定部</p>
        <p type="p">220b:外側用貼附部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1528" publication-number="202624210">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624210</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137005</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於改善聚合物或樹脂穩定性之低熔點羧醯胺受阻胺光穩定劑（ＨＡＬＳ）</chinese-title>
        <english-title>LOW MELTING CARBOXAMIDE HALS FOR IMPROVED STABILIZATION OF POLYMERS OR RESINS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D211/58</main-classification>
        <further-classification edition="200601120260302B">C08K5/3435</further-classification>
        <further-classification edition="200601120260302B">C08L77/00</further-classification>
        <further-classification edition="200601120260302B">C08L101/00</further-classification>
        <further-classification edition="200601120260302B">C08J3/20</further-classification>
        <further-classification edition="200601120260302B">C08J3/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商克萊瑞特國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CLARIANT INTERNATIONAL LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝伯倫　克里斯多夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHEIBELEIN, CHRISTOPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史提夫納　帕斯寇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEFFANUT, PASCAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾努普利　蘇利魯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMNUAYPORNSRI, SUREERUT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史凱勒　湯瑪斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHALLER, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種低分子量HALS穩定劑(LMW-HALS)，用於增強聚合物或樹脂的加工與長期穩定性，以及耐熱性、耐光性及耐化學性。本發明亦關於一種穩定劑母粒及包含此穩定劑和聚合物或樹脂的組成物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a low molecular weight HALS stabilizer (LMW-HALS) for enhancing the processing and long-term stability and the heat resistance, light resistance and chemical resistance of polymer or resin.&lt;u/&gt;The present invention also relates to a stabilizer masterbatch and a composition comprising such stabilizer and a polymer or resin.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1529" publication-number="202624337">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624337</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137043</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚酯系樹脂以及其製造方法及用途</chinese-title>
        <english-title>POLYESTER RESINS, PRODUCTION METHOD AND USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08G63/672</main-classification>
        <further-classification edition="200601120260302B">C08G63/78</further-classification>
        <further-classification edition="200601120260302B">G02B1/04</further-classification>
        <further-classification edition="200601120260302B">G02B3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大阪瓦斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSAKA GAS CHEMICALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中田梨香子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKADA, RIKAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤成美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, NARUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安田理恵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YASUDA, RIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮内信輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAUCHI, SHINSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">係調製一種聚酯系樹脂，係含有：含有式(A-1)的二羧酸單元(A1)之二羧酸單元(A)、及二醇單元(B)，且更含有式(A-2)的二羧酸單元(A2)及/或式(B-1)的二醇單元(B1)，  &lt;br/&gt;&lt;img align="absmiddle" height="347px" width="669px" file="ed10026.JPG" alt="ed10026.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;式中，R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;3a&lt;/sup&gt;、R&lt;sup&gt;3b&lt;/sup&gt;、R&lt;sup&gt;4a&lt;/sup&gt;、R&lt;sup&gt;4b&lt;/sup&gt;表示取代基，m1表示0至8，m3a、m3b、m4a、m4b表示0以上，Z&lt;sup&gt;1a&lt;/sup&gt;、Z&lt;sup&gt;1b&lt;/sup&gt;、Z&lt;sup&gt;2a&lt;/sup&gt;、Z&lt;sup&gt;2b&lt;/sup&gt;表示芳烴環(Arene Ring)，A&lt;sup&gt;1a&lt;/sup&gt;、A&lt;sup&gt;1b&lt;/sup&gt;表示伸烷基，n1a、n1b表示0以上，R&lt;sup&gt;2a&lt;/sup&gt;、R&lt;sup&gt;2b&lt;/sup&gt;表示取代或未取代的2價烴基，p表示0或1；  &lt;br/&gt;A&lt;sup&gt;2&lt;/sup&gt;表示直接鍵結或伸烷基，A&lt;sup&gt;3a&lt;/sup&gt;、A&lt;sup&gt;3b&lt;/sup&gt;、A&lt;sup&gt;4a&lt;/sup&gt;、A&lt;sup&gt;4b&lt;/sup&gt;表示伸烷基，n3a、n3b表示0以上，R&lt;sup&gt;5a&lt;/sup&gt;、R&lt;sup&gt;5b&lt;/sup&gt;表示取代基，m5a、m5b表示0至6；  &lt;br/&gt;A&lt;sup&gt;5&lt;/sup&gt;表示直接鍵結或伸烷基，A&lt;sup&gt;6a&lt;/sup&gt;、A&lt;sup&gt;6b&lt;/sup&gt;表示伸烷基，n6a、n6b表示0以上，R&lt;sup&gt;6a&lt;/sup&gt;、R&lt;sup&gt;6b&lt;/sup&gt;表示取代基，m6a、m6b表示0至6。  &lt;br/&gt;前述聚酯系樹脂即使折射率較高(或阿貝數較低)，異常分散特性(部分分散比θgF或ΔθgF)的過度增加亦受到抑制(或是亦顯現未過高或過低之適度的異常分散特性)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Prepared is a polyester resin which contains dicarboxylic acid units (A) including dicarboxylic acid units (A1) of formula (A-1), diol units (B), and further contains dicarboxylic acid units (A2) of formula (A-2) and/or diol units (B1) of formula (B-1). &lt;br/&gt;&lt;img align="absmiddle" height="333px" width="698px" file="ed10027.JPG" alt="ed10027.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(In formula, R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;3a&lt;/sup&gt;, R&lt;sup&gt;3b&lt;/sup&gt;, R&lt;sup&gt;4a&lt;/sup&gt;, R&lt;sup&gt;4b &lt;/sup&gt;are substituents; m1 is 0~8; m3a, m3b, m4a, m4b are 0 or more; Z&lt;sup&gt;1a&lt;/sup&gt;, Z&lt;sup&gt;1b&lt;/sup&gt;, Z&lt;sup&gt;2a&lt;/sup&gt;, Z&lt;sup&gt;2b&lt;/sup&gt; are arene ring; A&lt;sup&gt;1a&lt;/sup&gt;，A&lt;sup&gt;1b&lt;/sup&gt; are alkylene group; n1a, n1b are 0 or more; R&lt;sup&gt;2a&lt;/sup&gt;, R&lt;sup&gt;2b &lt;/sup&gt;are substituted or unsubstituted divalent hydrocarbon group; p is 0 or 1; &lt;br/&gt;A&lt;sup&gt;2&lt;/sup&gt; is a direct bond or an alkylene group; A&lt;sup&gt;3a&lt;/sup&gt;, A&lt;sup&gt;3b&lt;/sup&gt;, A&lt;sup&gt;4a&lt;/sup&gt;, A&lt;sup&gt;4b&lt;/sup&gt; are alkylene group; n3a，n3b are 0 or more; R&lt;sup&gt;5a&lt;/sup&gt;, R&lt;sup&gt;5b &lt;/sup&gt;are substituents; m5a, m5b are 0~6； &lt;br/&gt;A&lt;sup&gt;5&lt;/sup&gt; is a direct bond or an alkylene group; A&lt;sup&gt;6a&lt;/sup&gt;, A&lt;sup&gt;6b&lt;/sup&gt; are alkylene group;n6a，n6b are 0 or more; R&lt;sup&gt;6a&lt;/sup&gt;, R&lt;sup&gt;6b &lt;/sup&gt;are subsitutents; m6a, m6b represent 0~6.) &lt;br/&gt;Even if the polyester resin has a high refractive index (or a low Abbe number), an excessive increase in the anomalous dispersion characteristic (partial dispersion ratio θgF or ΔθgF) is suppressed (or the polyester resin exhibits a moderate anomalous dispersion characteristic that is neither too high nor too low).</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1530" publication-number="202624411">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624411</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137054</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>染料系偏光膜及偏光板、以及具備該偏光板的顯示裝置</chinese-title>
        <english-title>DYE-BASED POLARIZING FILM AND POLARIZING PLATE, AND DISPLAY DEVICE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C09B45/28</main-classification>
        <further-classification edition="200601120260302B">C08K5/42</further-classification>
        <further-classification edition="200601120260302B">C08L29/04</further-classification>
        <further-classification edition="200601120260302B">C08J5/18</further-classification>
        <further-classification edition="200601120260302B">G02B5/30</further-classification>
        <further-classification edition="200601120260302B">G02F1/1335</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本化藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON KAYAKU KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤原大地</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIWARA, DAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久住貴大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUSUMI, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松宮卓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMIYA, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樋下田貴大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIGETA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森田陵太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORITA, RYOUTAROU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中興一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, KOUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之偏光膜及偏光板，係在親水性高分子膜含有銅化偶氮化合物，在750nm之偏光度(ρ)為70%以上，且在700至750nm之平均偏光度(Aveρ)為90%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A polarizing film and a polarizing plate according to the present invention are made of a hydrophilic polymer film containing a copper-containing azo compound, having a polarization degree (ρ) of 70% or more at 750 nm and an average polarization degree (Ave ρ) of 90% or more from 700 to 750 nm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1531" publication-number="202624391">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624391</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137085</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬化性樹脂組成物、接著劑、密封材、硬化物、半導體裝置及電子零件</chinese-title>
        <english-title>CURABLE RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">C08L33/10</main-classification>
        <further-classification edition="200601120260303B">C08F2/50</further-classification>
        <further-classification edition="201601120260303B">C08G75/04</further-classification>
        <further-classification edition="200601120260303B">C08G59/17</further-classification>
        <further-classification edition="200601120260303B">C08K5/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商納美仕有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAMICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>五十嵐広龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKARASHI, HIROTATSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光主幸紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUNUSHI, KOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>根岸裕太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEGISHI, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩下帆香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWASHITA, HONOKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於：提供一種可降低硬化物自被附著體之位置偏移或剝離之硬化性樹脂組成物、包含其之接著劑或密封材、其硬化物、包含其硬化物之半導體裝置及電子零件。  &lt;br/&gt;本發明提供一種硬化性樹脂組成物，其係包含以下成分者：  &lt;br/&gt;(A)(甲基)丙烯酸酯化合物、  &lt;br/&gt;(B)聚硫醇化合物、及  &lt;br/&gt;(C)作為活性種而產生甲基自由基或苯基自由基之光自由基聚合起始劑，並且，  &lt;br/&gt;相對於硬化性樹脂組成物之總質量，上述成分(C)之含量為0.01至10質量%，  &lt;br/&gt;硬化性樹脂組成物為可包含(D)熱聚合起始劑，且相對於硬化性樹脂組成物之總質量，(D)熱聚合起始劑之含量為0至10質量%。本發明亦提供一種包含其之接著劑或密封材、其硬化物、包含其硬化物之半導體裝置及電子零件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The object of the present invention is to provide a curable resin composition capable of reducing displacement or peeling of a cured product from an adherend, an adhesive or a sealing material comprising the same, a cured product thereof, and a semiconductor device and an electronic component comprising the cured product. &lt;br/&gt;The present invention provides a curable resin composition comprising the following components: (A) a (meth)acrylate compound; (B) a polythiol compound; and (C) a photo-radical polymerization initiator which generates a methyl radical or a phenyl radical as an active species; wherein a content of the component (C) is 0.01 to 10% by mass relative to the total mass of the curable resin composition. &lt;br/&gt;The curable resin composition may comprise (D) a thermal polymerization initiator, and a content of the (D) thermal polymerization initiator is 0 to 10% by mass relative to the total mass of the curable resin composition. The present invention also provides an adhesive or a sealing material comprising the same, a cured product thereof, and a semiconductor device and an electronic component comprising the cured product.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1532" publication-number="202623822">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623822</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137111</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>靶向抑制AGT基因表達的siRNA及其在治療高血壓中的應用</chinese-title>
        <english-title>SIRNA FOR TARGETED INHIBITION OF AGT GENE EXPRESSION AND USE THEREOF IN TREATING HYPERTENSION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/7088</main-classification>
        <further-classification edition="201001120260302B">C12N15/113</further-classification>
        <further-classification edition="200601120260302B">A61P9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商杭州天龍藥業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANGZHOU TIANLONG PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋更申</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, GENGSHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃澤傲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, ZEAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姬廣屾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JI, GUANGSHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田志康</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIAN, ZHIKANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳玉成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YUCHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高中才</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, ZHONGCAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張蔓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, MAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種修飾寡核苷酸序列及其應用。基於血管收縮素原（AGT）信使核糖核酸（mRNA）序列設計了一系列siRNA，並進行交替修飾和利用一組特定的修飾範本進行修飾。細胞及動物實驗結果顯示，一些交替修飾和特定範本修飾的寡核苷酸序列，能夠顯著抑制AGT基因的表達，可用於開發治療高血壓等相關疾病的藥物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a modified oligonucleotide sequence and use thereof. A series of siRNAs were designed based on the angiotensinogen (AGT) messenger ribonucleic acid (mRNA) sequence, and were modified alternately and using a specific set of modification templates. Cellular and animal experimental results show that some alternately modified and template-modified oligonucleotide sequences can significantly inhibit the expression of the AGT gene and can be used to develop drugs for treatment of hypertension and related diseases.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1533" publication-number="202624514">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624514</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137129</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於減少垂直溝槽中由下而上的氧化物沉積之表面抑制</chinese-title>
        <english-title>SURFACE INHIBITION TO REDUCE BOTTOM UP OXIDE DEPOSITION IN VERTICAL TRENCH</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C23C16/02</main-classification>
        <further-classification edition="200601120260302B">C23C16/04</further-classification>
        <further-classification edition="200601120260302B">C23C16/40</further-classification>
        <further-classification edition="200601120260302B">C23C16/455</further-classification>
        <further-classification edition="202601120260302B">H10W10/00</further-classification>
        <further-classification edition="202601120260302B">H10W10/17</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維尼拉西加瑪尼　桑克吉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VENNILA SIGAMANI, SANKGEETH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈因　阿克夏特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAIN, AKSHAT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳育偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕迪特　瑪達爾Ｂ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANDIT, MANDAR B.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加　普拉凱特普拉卡什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JHA, PRAKET PRAKASH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁　璟梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, JINGMEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施例一般涉及基板特徵間隙填充的方法。特別地，本揭露的實施例針對改善側向間隙填充的方法。在一個實施例中，方法包括在處理腔室中定位在其中形成有特徵的基板，特徵包括垂直溝槽及一或多個從垂直溝槽延伸的側向溝槽；將基板暴露於至少一個預處理前驅物以對基板進行預處理，其中對基板進行預處理增強了基板中特徵的一或多個表面的疏水性；並在基板及其內形成的特徵上沉積間隙填充材料，以填充特徵的垂直溝槽及一或多個側向溝槽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the disclosure generally relate to methods for filling substrate features. Particularly, embodiments of the disclosure are directed to methods improving lateral gap fill. In one embodiment, a method includes positioning a substrate having a feature formed therein within a processing chamber, the feature comprising a vertical trench and one or more lateral trenches extending from the vertical trench; exposing the substrate to at least one pretreatment precursor to pretreat the substrate, wherein pretreating the substrate increases a hydrophobicity of one or more surfaces of the feature in the substrate; and depositing a gapfill material on the substrate and the feature formed therein to gapfill the vertical trench and the one or more lateral trenches of the feature.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:方法</p>
        <p type="p">202:操作</p>
        <p type="p">204:操作</p>
        <p type="p">206:操作</p>
        <p type="p">208:操作</p>
        <p type="p">210:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1534" publication-number="202625085">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625085</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137135</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>追蹤裝置及方法</chinese-title>
        <english-title>TRACKING APPARATUS AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120251103B">G06T7/20</main-classification>
        <further-classification edition="201701120251103B">G06T7/70</further-classification>
        <further-classification edition="202301120251103B">H04N23/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏達國際電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HTC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹志安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAO, CHIH-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種追蹤裝置及方法。該裝置基於對應一時間段的多張連續影像以及多個過去結構光強度，計算在一追蹤時間點於多個假想結構光強度下的多個追蹤誤差，其中該追蹤時間點晚於該時間段。該裝置基於該些追蹤誤差中的一最小誤差，決定一最佳結構光強度。該裝置產生一控制訊號以控制一發光元件在該追蹤時間點以該最佳結構光強度發出該結構光。該裝置自一相機取得在該追蹤時間點擷取的一追蹤影像。該裝置基於該追蹤影像，追蹤一物件的一姿態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A tracking apparatus and method are provided. The apparatus calculates tracking errors under hypothetical structured light intensities at a tracking time point based on continuous images and past structured light intensities corresponding to a time period, wherein the tracking time point is later than the time period. The apparatus determines an optimum structured light intensity based on a minimum error among the tracking errors. The apparatus generates a control signal to control a light emitting unit to emit structured light with the optimum structured light intensity at the tracking time point. The apparatus obtains a tracking image captured at the tracking time point from a camera. The apparatus tracks a pose of an object based on the tracking image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:追蹤裝置</p>
        <p type="p">12:處理器</p>
        <p type="p">14:相機</p>
        <p type="p">16:發光元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1535" publication-number="202624175">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624175</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137137</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>烴之製造方法及漿液床式反應器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C1/04</main-classification>
        <further-classification edition="200601120260102B">C10G2/00</further-classification>
        <further-classification edition="200601120260102B">C07C9/04</further-classification>
        <further-classification edition="200601120260102B">C07C9/06</further-classification>
        <further-classification edition="200601120260102B">C07C9/08</further-classification>
        <further-classification edition="200601120260102B">C07C9/10</further-classification>
        <further-classification edition="200601120260102B">C07C11/04</further-classification>
        <further-classification edition="200601120260102B">C07C11/06</further-classification>
        <further-classification edition="200601120260102B">C07C11/08</further-classification>
        <further-classification edition="200601120260102B">B01J8/22</further-classification>
        <further-classification edition="200601120260102B">B01J19/18</further-classification>
        <further-classification edition="200601120260102B">B01J21/08</further-classification>
        <further-classification edition="200601120260102B">B01J23/75</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友重機械工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO HEAVY INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堅田有信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATADA, ARINOBU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木崇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川崎康晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASAKI, YASUHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋本勇輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIMOTO, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]本發明提供一種在基於FT法之烴的製造中改善反應效率之技術。  &lt;br/&gt;　　[解決手段]一種藉由費托法製造烴之方法，其包括如下工序：(a)在具備反應器本體及攪拌機構之漿液床式反應器內，使包含觸媒和有機溶劑之漿液與從前述反應器本體的側部或底部供給之原料氣體接觸，前述攪拌機構配置於前述反應器本體的內部且具有軸部和與前述軸部連結之攪拌翼；及(b)藉由前述攪拌機構，攪拌前述漿液。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:向反應器供給漿液</p>
        <p type="p">S2:向反應器供給原料氣體</p>
        <p type="p">S3:藉由攪拌機構攪拌漿液</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1536" publication-number="202624215">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624215</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137188</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚合性液晶化合物及其製造方法、聚合性組合物、聚合體、相位差膜及其製造方法、轉印用積層體、光學構件及其製造方法、以及顯示裝置</chinese-title>
        <english-title>POLYMERIZABLE LIQUID CRYSTAL COMPOUND, METHOD FOR PRODUCING THE POLYMERIZABLE LIQUID CRYSTAL COMPOUND, POLYMERIZABLE COMPOSITION, POLYMER, RETARDATION FILM, METHOD FOR PRODUCING THE RETARDATION FILM, TRANSFER LAMINATE, OPTICAL MEMBER, METHOD FOR PRODUCING THE OPTICAL MEMBER, AND DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D277/68</main-classification>
        <further-classification edition="200601120260302B">C07D333/64</further-classification>
        <further-classification edition="200601120260302B">C07D409/04</further-classification>
        <further-classification edition="200601120260302B">C07D417/04</further-classification>
        <further-classification edition="200601120260302B">C09K19/34</further-classification>
        <further-classification edition="200601120260302B">C09K19/38</further-classification>
        <further-classification edition="200601120260302B">C08F22/24</further-classification>
        <further-classification edition="200601120260302B">G02B5/30</further-classification>
        <further-classification edition="200601120260302B">G02F1/13</further-classification>
        <further-classification edition="200601120260302B">G02F1/13363</further-classification>
        <further-classification edition="200601120260302B">G02F1/1337</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大日本印刷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>天野寛子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMANO, HIROKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡田和之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKADA, KAZUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種聚合性液晶化合物，其係以下述通式(I)表示：          &lt;img align="absmiddle" height="317px" width="462px" file="ed10066.JPG" alt="ed10066.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;                 [通式(I)中，Ar表示通式(Ar-1)所表示之二價之基，通式(I)及通式(Ar-1)中之各符號如說明書所記載]。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A polymerizable liquid crystal compound represented by the following general formula (I):         &lt;img align="absmiddle" height="291px" width="473px" file="ed10067.JPG" alt="ed10067.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;         (in the general formula (I), Ar represents a divalent group represented by the general formula (Ar-1), and the symbols in the general formulae (I) and (Ar-1) are as described in the Description.)</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1537" publication-number="202624199">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624199</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137189</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚合性液晶化合物及其製造方法、聚合性組合物、聚合體、相位差膜及其製造方法、轉印用積層體、光學構件及其製造方法、以及顯示裝置</chinese-title>
        <english-title>POLYMERIZABLE LIQUID CRYSTAL COMPOUND, METHOD FOR PRODUCING THE POLYMERIZABLE LIQUID CRYSTAL COMPOUND, POLYMERIZABLE COMPOSITION, POLYMER, RETARDATION FILM, METHOD FOR PRODUCING THE RETARDATION FILM, TRANSFER LAMINATE, OPTICAL MEMBER, METHOD FOR PRODUCING THE OPTICAL MEMBER, AND DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07C249/16</main-classification>
        <further-classification edition="200601120260302B">C07C251/76</further-classification>
        <further-classification edition="200601120260302B">C07C251/84</further-classification>
        <further-classification edition="200601120260302B">C07D307/68</further-classification>
        <further-classification edition="200601120260302B">C08F22/22</further-classification>
        <further-classification edition="200601120260302B">C09K19/30</further-classification>
        <further-classification edition="200601120260302B">C09K19/32</further-classification>
        <further-classification edition="200601120260302B">C09K19/34</further-classification>
        <further-classification edition="200601120260302B">C09K19/38</further-classification>
        <further-classification edition="200601120260302B">B32B27/00</further-classification>
        <further-classification edition="201901120260302B">B32B7/06</further-classification>
        <further-classification edition="200601120260302B">G02B5/30</further-classification>
        <further-classification edition="200601120260302B">G02F1/13363</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大日本印刷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>天野寛子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMANO, HIROKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡田和之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKADA, KAZUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種聚合性液晶化合物，其係以下述通式(I)表示：         &lt;img align="absmiddle" height="318px" width="451px" file="ed10089.JPG" alt="ed10089.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;          [通式(I)中，J&lt;sup&gt;1&lt;/sup&gt;表示通式(J-1)所表示之一價之基，通式(I)及通式(J-1)中之各符號如說明書所記載]。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A polymerizable liquid crystal compound represented by the following general formula (I):         &lt;img align="absmiddle" height="326px" width="412px" file="ed10090.JPG" alt="ed10090.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(in the general formula (I), J&lt;sup&gt;1&lt;/sup&gt; represents a monovalent group represented by the general formula (J-1), and the symbols in the general formulae (I) and (J-1) are as described in the Description.)</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1538" publication-number="202625015">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625015</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137191</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於神經網路之稀疏編解碼器</chinese-title>
        <english-title>SPARSE CODEC FOR NEURAL NETWORK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260305B">G06N3/063</main-classification>
        <further-classification edition="200601120260305B">G06F17/16</further-classification>
        <further-classification edition="200601120260305B">H03M7/30</further-classification>
        <further-classification edition="200601120260305B">G06F7/48</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商墨子國際有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOFFETT INTERNATIONAL CO., LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張昶旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, CHANGXU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種用於稀疏張量資料之高效處置之進階處理器。該處理器包括：一輸入緩衝器，其經組態以接收一輸入張量；一收集電路，其收集來自一密集張量之高量值張量資料以形成一壓縮張量；及一分散電路，其基於一給定遮罩將來自一壓縮張量之張量資料分佈至一稀疏非壓縮張量中。該處理器經組態以執行稀疏編碼，而產生該輸入張量之一稀疏表示，該稀疏表示包含：(1)含有由該收集電路收集之高量值張量資料之該壓縮張量，及(2)指示該輸入張量中之高量值張量資料之位置資訊之一稀疏遮罩。另外，該處理器藉由使用該分散電路及該稀疏遮罩將該壓縮張量分散至該稀疏非壓縮張量中而執行稀疏解碼。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An advanced processor is disclosed for efficient handling of sparse tensor data. The processor comprises an input buffer configured to receive an input tensor, a gather circuit that collects high-magnitude tensor data from a dense tensor to form a condensed tensor, and a scatter circuit that distributes tensor data from a condensed tensor into a sparse uncondensed tensor based on a given mask. The processor is configured to perform sparse encoding, generating a sparse representation of the input tensor that includes: (1) the condensed tensor containing high-magnitude tensor data gathered by the gather circuit, and (2) a sparse mask indicating the position information of high-magnitude tensor data in the input tensor. Additionally, the processor performs sparse decoding by scattering the condensed tensor into the sparse uncondensed tensor using the scatter circuit and the sparse mask.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:控制模組</p>
        <p type="p">240:共用記憶體</p>
        <p type="p">250:稀疏編解碼器模組</p>
        <p type="p">251:量化參數電路</p>
        <p type="p">252:輸入值緩衝器</p>
        <p type="p">253:輸入遮罩緩衝器</p>
        <p type="p">254:遮罩產生電路</p>
        <p type="p">255:輸入量化緩衝器</p>
        <p type="p">256:輸出遮罩緩衝器</p>
        <p type="p">257:輸出量化緩衝器</p>
        <p type="p">258:輸出值緩衝器</p>
        <p type="p">260:收集電路</p>
        <p type="p">270:分散電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1539" publication-number="202625016">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625016</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137195</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於加速神經網路運算之晶片及系統架構</chinese-title>
        <english-title>CHIP AND SYSTEM ARCHITECTURE FOR ACCELERATING NEURAL NETWORK COMPUTATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260305B">G06N3/063</main-classification>
        <further-classification edition="201801120260305B">G06F9/38</further-classification>
        <further-classification edition="200601120260305B">G06F13/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商墨子國際有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOFFETT INTERNATIONAL CO., LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張昶旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, CHANGXU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張曉謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XIAOQIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種用於加速神經網路運算之晶片架構及系統設計。晶片包含經由一環形晶片上網路(NoC)互連之複數個核心，各核心包括具有階層式基於軟體及硬體之排程器之一2D處理元件(PE)網。各PE包含專用運算引擎、本端記憶體及動態精度轉換邏輯。該架構支援靈活指令調度、可擴展記憶體存取及運行時間排程最佳化。該晶片可部署成基於小晶片之組態、具有成對晶片之PCIe卡或具有單晶片封裝之模組化OAM卡。多卡系統利用縱橫交換機結構及直接卡間鏈路以實現高效、低延時通信及高頻寬可擴展性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A chip architecture and system design for accelerating neural network computation is disclosed. The chip includes a plurality of cores interconnected via a ring-shaped network-on-chip (NoC), each core comprising a 2D mesh of processing elements (PEs) with hierarchical software- and hardware-based schedulers. Each PE includes specialized compute engines, local memory, and dynamic precision conversion logic. The architecture supports flexible instruction dispatch, scalable memory access, and runtime scheduling optimization. The chip can be deployed in chiplet-based configurations, PCIe cards with paired chips, or modular OAM cards with single-chip packaging. Multi-card systems utilize crossbar switch fabrics and direct inter-card links to enable efficient, low-latency communication and high-bandwidth scalability.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:核心</p>
        <p type="p">140:處理實體(PE)</p>
        <p type="p">310:處理實體(PE)級RISC-V向量(RVV)</p>
        <p type="p">320:處理實體(PE)排程器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1540" publication-number="202623829">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623829</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137200</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>結合物及其用途</chinese-title>
        <english-title>CONJUGATES AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">A61K38/10</main-classification>
        <further-classification edition="200601120260309B">A61K31/198</further-classification>
        <further-classification edition="201701120260309B">A61K47/68</further-classification>
        <further-classification edition="200601120260309B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商解方治療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOLVE THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭努蒂　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANNUTTI, BRIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃特金斯　傑夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATKINS, JEFF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑森　凱蒂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JESSEN, KATTI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供式(X*)之藥物-連接基團：  &lt;br/&gt;&lt;img align="absmiddle" height="186px" width="431px" file="ed11365.JPG" alt="ed11365.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; ，  &lt;br/&gt;或其醫藥學上可接受之鹽，其中式(X*)之變數如本申請案中所定義。此類化合物可適用於製備抗癌劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein is a Drug-Linker of Formula (X*): &lt;br/&gt;&lt;img align="absmiddle" height="190px" width="475px" file="ed11366.JPG" alt="ed11366.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; , &lt;br/&gt;or a pharmaceutically acceptable salt thereof, wherein the variables of Formula (X*) are as defined in the application. Such compounds can be useful for preparation of anti-cancer agents.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1541" publication-number="202623805">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623805</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137203</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>６，５－雙環５－ＨＴ２ＡＲ促效劑及其用途</chinese-title>
        <english-title>6,5-BICYCLIC 5-HT2AR AGONISTS AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/5025</main-classification>
        <further-classification edition="200601120260302B">A61K31/519</further-classification>
        <further-classification edition="200601120260302B">A61K31/4365</further-classification>
        <further-classification edition="200601120260302B">A61K31/421</further-classification>
        <further-classification edition="200601120260302B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商布蘭達里斯治療私人有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRANDARIS THERAPEUTICS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛洛斯普　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLOSSOP, PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孟特拿　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONTANA, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希爾　強納森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEAL, JONATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雪瑞丹　喬瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHERIDAN, JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露係關於適用於活化5-羥基色胺2A受體(5-HT2AR)之化合物、其醫藥學上可接受之組合物以及使用該等化合物及組合物之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to compounds useful for activating the 5-hydroxytryptamine 2A receptor (5-HT2AR), pharmaceutically acceptable compositions thereof, and methods of using said compounds and compositions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1542" publication-number="202624487">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624487</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137204</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>丹農（Ｄａｎｏｎ）病的治療</chinese-title>
        <english-title>TREATMENT OF DANON DISEASE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C12N15/13</main-classification>
        <further-classification edition="200601120260302B">C12N15/861</further-classification>
        <further-classification edition="200601120260302B">A61K31/7088</further-classification>
        <further-classification edition="200601120260302B">A61K48/00</further-classification>
        <further-classification edition="200601120260302B">A61P9/00</further-classification>
        <further-classification edition="200601120260302B">A61P21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商航天七號有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPACECRAFT SEVEN, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>里克斯　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICKS, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙阿　高拉夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAH, GAURAV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施瓦茨　喬納森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHWARTZ, JONATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伯恩　巴里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BYRNE, BARRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於治療經識別為罹患丹農(Danon)病或處於丹農病風險中及/或在&lt;i&gt;LAMP-2&lt;/i&gt;基因之一或多種同功異型物中具有失活突變之個體中之丹農病的方法。該等方法可包括向該個體投與治療有效量之包含衣殼及載體基因組之重組腺相關病毒(recombinant adeno-associated virus；rAAV)病毒粒子，其中該載體基因組包含編碼LAMP-2蛋白(較佳係LAMP-2B蛋白)之多核苷酸序列。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods for treating Danon disease in a subject identified as suffering from or at risk for Danon disease and/or having an inactivating mutation in one or more isoforms of the &lt;i&gt;LAMP-2&lt;/i&gt; gene and provided. The methods may comprise administering to the subject a therapeutically effective amount of a recombinant adeno-associated virus (rAAV) virion comprising a capsid and a vector genome where the vector genome comprises a polynucleotide sequence encoding a LAMP-2 protein, preferably a LAMP-2B protein.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1543" publication-number="202624720">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624720</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137217</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於處理腔室的磁光化學感測器</chinese-title>
        <english-title>MAGNETO-OPTICAL CHEMICAL SENSORS FOR PROCESS CHAMBERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">G01N21/17</main-classification>
        <further-classification edition="200601120260309B">C23C16/50</further-classification>
        <further-classification edition="202601120260309B">H10P34/40</further-classification>
        <further-classification edition="202601120260309B">H10P74/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　提摩西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TIMOTHY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了用於製程或處理腔室條件監測的磁光感測器。在實例中，一種系統包含處理腔室。該系統還包含雷射源，以提供具有初始極化的雷射束，該雷射束被引導經過第一偏振器，並隨後進入處理腔室。該系統還包含圍繞處理腔室的磁體，該磁體提供雷射束的法拉第旋轉，雷射束離開處理腔室，並進入第二偏振器，再進入偵測器以提供偵測到的極化旋轉用於鎖相偵測。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Magneto-optical sensors for process or process chamber condition monitoring are described. In an example, a system includes a process chamber. The system also includes a laser source to provide a laser beam having an initial polarization, the laser beam to be directed through a first polarizer and then into the process chamber. The system also includes a magnet surrounding the process chamber, the magnet to provide a Faraday rotation of the laser beam, the laser beam to exit the process chamber and enter a second polarizer and then a detector to provide a detected polarization rotation for lock-in detection.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">102:處理腔室</p>
        <p type="p">104:遠端電漿源</p>
        <p type="p">106:雷射</p>
        <p type="p">108:初始極化</p>
        <p type="p">110:偏振器</p>
        <p type="p">112:磁體</p>
        <p type="p">113:法拉第旋轉</p>
        <p type="p">114:偏振器</p>
        <p type="p">116:偵測器/板</p>
        <p type="p">118:極化旋轉</p>
        <p type="p">120:鎖相偵測</p>
        <p type="p">122:功能產生器</p>
        <p type="p">124:音訊放大器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1544" publication-number="202624515">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624515</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137219</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氮化矽的選擇性沉積</chinese-title>
        <english-title>SELECTIVE DEPOSITION OF SILICON NITRIDE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C23C16/02</main-classification>
        <further-classification edition="200601120260302B">C23C16/04</further-classification>
        <further-classification edition="200601120260302B">C23C16/34</further-classification>
        <further-classification edition="200601120260302B">C23C16/44</further-classification>
        <further-classification edition="200601120260302B">C23C16/455</further-classification>
        <further-classification edition="202601120260302B">H10P70/00</further-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝卡瓦特　安妮魯杜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEKHAWAT, ANIRUDDH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高立剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, LIGANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯林吉瓦迪　卡爾提克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COLINJIVADI, KARTHIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈德西卡爾巴斯德西　瓦希迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GHODSI KARBASDEHI, VAHID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布洋　巴斯卡爾喬帝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHUYAN, BHASKAR JYOTI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">藉由在第一氮化物材料上選擇性沉積第二氮化物材料，再在該第二氮化物材料上沉積第三氮化物材料以形成設備的方法。使用抑制劑選擇性地對該第一氮化物材料進行鈍化，使該第三氮化物材料能夠在該第二氮化物材料上形成。沉積該第三氮化物材料後，可以去除該抑制劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods of forming devices by selective deposition of a third nitride material on a second nitride material over a first nitride material. An inhibitor is used to selectively passivate the first nitride material so that the third nitride material forms on the second nitride material. The inhibitor may be removed after deposition of the third nitride material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電子設備</p>
        <p type="p">110:基板</p>
        <p type="p">120:阻障層</p>
        <p type="p">130:金屬層</p>
        <p type="p">135:第一氮化物材料/層</p>
        <p type="p">140:導電間隙</p>
        <p type="p">142:蝕刻終止層</p>
        <p type="p">145:介電層/第二氮化物材料</p>
        <p type="p">146:間隙</p>
        <p type="p">146L:接線</p>
        <p type="p">146V:通孔</p>
        <p type="p">149:底部</p>
        <p type="p">160:第三氮化物材料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1545" publication-number="202624286">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624286</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137225</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於氰基丙烯酸酯及(甲基)丙烯酸酯之組合物的用途</chinese-title>
        <english-title>USE OF A COMPOSITION BASED ON CYANOACRYLATE AND (METH)ACRYLATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08F2/44</main-classification>
        <further-classification edition="200601120260302B">C08F220/18</further-classification>
        <further-classification edition="200601120260302B">C08F222/32</further-classification>
        <further-classification edition="200601120260302B">C09J4/00</further-classification>
        <further-classification edition="200601120260302B">C09J5/00</further-classification>
        <further-classification edition="200601120260302B">C09D4/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商波士提克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOSTIK SA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓋拉　帕西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARRA, PATXI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坎潘亞　Ｉ　羅維特　馬里亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAMPANYA I LLOVET, MARIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克魯斯　巴拉斯　瑪麗亞　喬斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CRUZ BALAZ, MARIA JOSE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種組合物，其包括：  &lt;br/&gt;-  氰基丙烯酸酯C；  &lt;br/&gt;-  光起始劑P；  &lt;br/&gt;-  (甲基)丙烯酸酯A；  &lt;br/&gt;其特徵在於，該組合物不包括具有式(M)之化合物且不包括具有式(N)之化合物：  &lt;br/&gt;用於製備塗層，該塗層具有至少150微米之厚度；或  &lt;br/&gt;用於間隙填充，該間隙為至少150微米；或  &lt;br/&gt;用於黏合至少兩個基板，該等基板之間之間隙為至少150微米。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a composition comprising: &lt;br/&gt;- a cyanoacrylate C; &lt;br/&gt;- a photoinitiator P; &lt;br/&gt;- a (meth)acrylate A; &lt;br/&gt;characterized in that the composition does not comprise a compound having formula (M) and does not comprise a compound having formula (N): &lt;br/&gt;for preparing a coating, said coating having a thickness of at least 150 microns; or &lt;br/&gt;for gap filling, said gap being of at least 150 microns; or &lt;br/&gt;for bonding at least two substrates having a gap between said substrates of at least 150 microns.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1546" publication-number="202624469">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624469</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137234</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>表面處理組合物、表面處理組合物的濃縮液及表面處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">C11D1/62</main-classification>
        <further-classification edition="200601120260303B">C11D1/68</further-classification>
        <further-classification edition="200601120260303B">C11D3/04</further-classification>
        <further-classification edition="200601120260303B">C11D9/16</further-classification>
        <further-classification edition="200601120260303B">C08F116/06</further-classification>
        <further-classification edition="202301120260303B">C02F1/66</further-classification>
        <further-classification edition="200601120260303B">C09G1/02</further-classification>
        <further-classification edition="200601120260303B">C09G1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商福吉米股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIMI INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>髙間大輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAMA, DAIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後藤修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOTO, OSAMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供一種表面處理組合物，可降低在進行矽晶圓的表面處理之後的矽晶圓表面之缺陷及霧度。本揭露是關於一種表面處理組合物，其含有含硼化合物、水溶性高分子、鹼性化合物及水，使用於對矽晶圓進行表面處理之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1547" publication-number="202625779">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625779</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137250</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於基板形貌校正之灰階微影術</chinese-title>
        <english-title>GREYSCALE LITHOGRAPHY FOR SUBSTRATE TOPOGRAPHY CORRECTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260309B">H10P74/20</main-classification>
        <further-classification edition="200601120260309B">G03F7/20</further-classification>
        <further-classification edition="201201120260309B">G03F1/70</further-classification>
        <further-classification edition="201201120260309B">G03F1/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布里格斯　班傑明Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRIGGS, BENJAMIN D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈因　舒本德拉庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAIN, SHUBHENDRA KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫瑪　安伽那</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, ARCHANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷　萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEY, RYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基板形貌校正的方法。該方法可能包括接收一張基板的厚度圖，該厚度圖定義了基板上的總厚度變化，並在基板的第一表面上提供一層灰階光阻劑。該方法可能進一步包括根據厚度圖對灰階光阻劑層執行灰階微影術操作，其中該灰階微影術操作旨在減少總厚度變化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of substrate topography correction. The method may include receiving a thickness map of a substrate, the thickness map defining a total thickness variation across the substrate, and providing a greyscale photoresist layer on a first surface of the substrate. The method may further include performing a greyscale lithography operation on the greyscale photoresist layer, based upon the thickness map, wherein the greyscale lithography operation is to reduce the total thickness variation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">102:基板</p>
        <p type="p">104:灰階光阻劑層</p>
        <p type="p">106:厚度圖</p>
        <p type="p">110:照明源</p>
        <p type="p">112:掃描束</p>
        <p type="p">120:控制器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1548" publication-number="202623798">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623798</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137258</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>補體因子Ｂ抑制劑及其用途</chinese-title>
        <english-title>COMPLEMENT FACTOR B INHIBITORS AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/44</main-classification>
        <further-classification edition="200601120260302B">A61K31/403</further-classification>
        <further-classification edition="200601120260302B">A61K51/04</further-classification>
        <further-classification edition="200601120260302B">A61P37/00</further-classification>
        <further-classification edition="200601120260302B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商諾華公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVARTIS AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查巴紐克　蘿拉　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CZABANIUK, LARA C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海帝格　麥可　克里斯多夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEDIGER, MICHAEL CHRISTOPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>厄斯　康斯坦斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HURTH, KONSTANZE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈克貴爾　賽巴斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JACQUIER, SEBASTIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉喬爾　茱麗葉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LACHAL, JULIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬格雷　凱拉　阿什利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARGREY, KAILA ASHLEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐瑞　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORAIN, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舍恩　艾德琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHOEN, ADELINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>珊蒂斯克　馬汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SENDZIK, MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供了可用於治療由補體因子B介導的疾病或障礙的具有式 (I) 的化合物及其藥物組成物。  &lt;br/&gt;&lt;img align="absmiddle" height="282px" width="170px" file="ed10444.JPG" alt="ed10444.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are compounds of Formula (I) and pharmaceutical compositions thereof useful for treating diseases or disorders mediated by the complement factor B. &lt;br/&gt;&lt;img align="absmiddle" height="267px" width="157px" file="ed10445.JPG" alt="ed10445.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1549" publication-number="202624488">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624488</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137264</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＣＨＯ細胞衍生之支架／基質結合區（Ｓ／ＭＡＲ）及使用其之表現載體</chinese-title>
        <english-title>CHO CELL-DERIVED S/MAR AND EXPRESSION VECTOR USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C12N15/63</main-classification>
        <further-classification edition="200601120260302B">C12N15/64</further-classification>
        <further-classification edition="200601120260302B">C12N15/85</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG CHEM, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方駿鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANG, JUNHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴暻蕙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, KYUNGHYE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閔丙恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIN, BYEONG EUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許廷桓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEO, JUNGHWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露係關於表現匣，其包含支架/基質結合區(S/MAR)；表現載體，其用於表現包含該表現匣之目標蛋白質；轉形體細胞，其中該表現載體經引入宿主細胞中；及用於產生目標蛋白質之方法，該方法包含培養該轉形體細胞。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to an expression cassette comprising a scaffold/matrix attached region (S/MAR); an expression vector for expressing a target protein comprising the expression cassette; a transformant cell in which the expression vector is introduced into a host cell; and a method for producing a target protein comprising culturing the transformant cell.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1550" publication-number="202624400">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624400</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137275</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂材料、樹脂膜、積層膜及多層印刷電路板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">C08L63/02</main-classification>
        <further-classification edition="200601120260303B">C08G59/08</further-classification>
        <further-classification edition="200601120260303B">C08K5/07</further-classification>
        <further-classification edition="200601120260303B">C08K5/10</further-classification>
        <further-classification edition="200601120260303B">C07D207/448</further-classification>
        <further-classification edition="200601120260303B">B32B27/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商積水化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河田祐希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWATA, YUUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國澤優奈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNISAWA, YUUNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, KENTAROU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三好久美子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYOSHI, KUMIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林達史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHI, TATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種樹脂材料，其1)能夠減小硬化物之介電損耗因數，2)能夠減小除膠渣處理後之表面粗糙度，3)能夠增大鍍覆剝離強度，4)能夠抑制龜裂之產生。  &lt;br/&gt;本發明之樹脂材料包含硬化性化合物、絕緣性填料、及溶劑，上述溶劑包含酮化合物，上述酮化合物之沸點為90℃以上150℃以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1551" publication-number="202624380">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624380</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137279</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阻劑下層膜形成用組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08K5/55</main-classification>
        <further-classification edition="200601120260302B">C08L33/14</further-classification>
        <further-classification edition="200601120260302B">G03F7/11</further-classification>
        <further-classification edition="200601120260302B">G03F7/40</further-classification>
        <further-classification edition="202601120260302B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日產化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>板岡康平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITAOKA, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緒方裕斗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGATA, HIROTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田村護</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAMURA, MAMORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為提供一種阻劑下層膜形成用組成物，其係用以形成含有金屬之阻劑膜與基板之間所形成之阻劑下層膜的阻劑下層膜形成用組成物，其特徵為包含樹脂(A)、光鹼產生劑(B)及溶劑(C)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1552" publication-number="202624523">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624523</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137307</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多晶碳化矽成形體及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">C23C16/32</main-classification>
        <further-classification edition="200601120260303B">C30B29/36</further-classification>
        <further-classification edition="201701120260303B">C01B32/956</further-classification>
        <further-classification edition="200601120260303B">C04B35/565</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東海碳素股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKAI CARBON CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今川真百合</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMAGAWA, MAYURI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大石昇平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OISHI, SHOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池田柊人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEDA, SHUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種板狀體之多晶碳化矽成形體及其製造方法，前述板狀體之多晶碳化矽成形體之氮含量大於1000質量ppm且在5000質量ppm以下，電阻率為0.0100Ω・cm以下，藉由X射線繞射法所測得之第1主表面之殘留應力與第2主表面之殘留應力之差的平均值為10MPa～80MPa，厚度為200μm～1000μm，及翹曲量為50μm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1553" publication-number="202624311">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624311</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137349</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光化射線性或感放射線性樹脂組成物、感光化射線性或感放射線性膜、圖案形成方法、電子器件之製造方法、及樹脂</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08F230/04</main-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/038</further-classification>
        <further-classification edition="200601120260302B">G03F7/039</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="200601120260302B">G03F7/32</further-classification>
        <further-classification edition="200601120260302B">G03F7/38</further-classification>
        <further-classification edition="202601120260302B">H10P76/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石地洋平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIJI, YOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡宏哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKA, HIRONORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>椿英明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUBAKI, HIDEAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後藤研由</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOTO, AKIYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土村智孝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUCHIMURA, TOMOTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種感光化射線性或感放射線性樹脂組成物、使用上述感光化射線性或感放射線性樹脂組成物而形成的感光化射線性或感放射線性膜、使用上述感光化射線性或感放射線性樹脂組成物的圖案形成方法、及電子器件之製造方法、以及樹脂，上述感光化射線性或感放射線性樹脂組成物含有上述樹脂，其中，上述樹脂具有酸分解性基，上述酸分解性基含有金屬原子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1554" publication-number="202624258">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624258</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137367</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>脂化促性腺激素釋放激素類似物</chinese-title>
        <english-title>LIPIDATED GONADOTROPIN RELEASING HORMONE ANALOGUES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07K14/575</main-classification>
        <further-classification edition="200601120260302B">A61K38/22</further-classification>
        <further-classification edition="200601120260302B">A61P15/00</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商菲林公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FERRING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾迪爾　喬納斯　Ｎ　Ｎ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EILDAL, JONAS NII NORTEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>休格斯　安德烈亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUGERTH, ANDREAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比耶雷加德　西蒙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BJERREGAARD, SIMON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史塔沃斯基　傑西克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STALEWSKI, JACEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了脂化GnRH類似物，其中該等GnRH類似物在GnRH類似物肽骨架的胺基酸位置，諸如胺基酸位置1、5、6和/或8中的一或多個處被脂化。還描述了製備該等脂化化合物之方法、包含該等脂化化合物的藥物組成物及其在治療方法中之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described are lipidated GnRH analogues, wherein the GnRH analogues are lipidated at one or more of amino acid positions, such as amino acid position 1, 5, 6 and/or 8 of a GnRH analogue peptide backbone. Also described are methods of making the lipidated compounds, pharmaceutical compositions comprising the lipidated compounds, and their use in methods of treatment.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1555" publication-number="202624261">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624261</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137383</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用抗ＴＬ１Ａ抗體治療代謝功能障礙相關脂肪性肝炎之方法</chinese-title>
        <english-title>METHODS FOR TREATMENT OF METABOLIC DYSFUNCTION-ASSOCIATED STEATOHEPATITIS WITH AN ANTI-TL1A ANTIBODY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07K16/18</main-classification>
        <further-classification edition="200601120260302B">C07K14/525</further-classification>
        <further-classification edition="200601120260302B">A61K39/395</further-classification>
        <further-classification edition="200601120260302B">A61P1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商建南德克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENENTECH, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商輝瑞大藥廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PFIZER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿方索　羅斯　特雷斯　喬治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALFONSO ROSS TERRES, JORGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯林森　尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COLLINSON, NEIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾斯比　派斯可　傑科斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ESPIE, PASCAL JACQUES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱易夫　皮兒　艾瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUIF, PIERRE-ERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供利用治療劑量之抗類 TNF 配體 1A (TL1A) 抗體來治療涉及肝臟的發炎及/或纖維化的疾病及病況之方法及組成物，該疾病及病況例如，代謝功能障礙相關脂肪性肝炎 (MASH)、代謝功能障礙相關脂肪性肝病 (MASLD)、原發性膽汁性膽管炎、原發性硬化性膽管炎、酒精性肝硬化、肝炎性肝硬化、膽汁鬱積、自體免疫性肝炎、病毒性 B 型肝炎、病毒性 C&lt;b/&gt;型肝炎、血色素沉著症、威爾森氏病或酒精性脂肪性肝炎。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides methods and compositions for treating a disease or condition involving inflammation and/or fibrosis in the liver, e.g., metabolic dysfunction-associated steatohepatitis (MASH), metabolic dysfunction-associated steatotic liver disease (MASLD), primary biliary cholangitis, primary sclerosing cholangitis, alcoholic cirrhosis, hepatitis cirrhosis, cholestasis, autoimmune hepatitis, viral hepatitis B, viral hepatitis C, hemochromatosis, Wilson’s disease, or alcoholic steatohepatitis,&lt;b/&gt;with a therapeutic dose of an anti-TNF-like ligand 1A (TL1A) antibody.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1556" publication-number="202625414">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625414</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137385</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>通信方法及通信裝置</chinese-title>
        <english-title>COMMUNICATION METHOD AND COMMUNICATION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260305B">H04L43/08</main-classification>
        <further-classification edition="202301120260305B">H04W72/12</further-classification>
        <further-classification edition="200901120260305B">H04W28/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商華為技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張彥清</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YANQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張夢晨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, MENGCHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐海博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, HAIBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　曉翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, SEAU SIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種通信方法及通信裝置，可以應用於通信領域。本申請提出的技術方案中，網路設備為終端設備配置多個時延上報門限，以使得終端設備可以基於這多個時延上報門限上報多個時延資訊，以實現時延狀態能夠準確上報的同時還能降低上報開銷。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a communication method and a communication device that can be applied in the field of communications. In the technical solution proposed by this application, a network device configures multiple delay reporting thresholds for terminal devices, enabling the terminal devices to report multiple delay information based on these thresholds. This approach ensures accurate reporting of delay status while also reducing the reporting overhead.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S810、S820:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1557" publication-number="202624758">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624758</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137400</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>靜電消除裝置、靜電消除方法及具有該裝置的製造系統</chinese-title>
        <english-title>DEVICE AND METHOD FOR DISCHARGING STATIC ELECTRICITY AND MANUFACTURING SYSTEM HAVING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251020B">G01R1/067</main-classification>
        <further-classification edition="200601120251020B">H05F3/00</further-classification>
        <further-classification edition="200601120251020B">H05F3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>衡陞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MESOSCOPE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>衡通工業科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUATERNITY INDUSTRIAL TECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>衡信分析科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRINITY ANALYSIS TECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃信豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HSIN-HAU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀畊宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種靜電消除裝置。該靜電消除裝置包含一容置腔體、一電池組、一導接件、一開關件以及一電性連接件。該容置腔體用於容納承載該電池組的一載板。該電池組包括相互串聯之一第一電池及一第二電池。該導接件包含位於該第一電池之一第一電極及該第二電池之一第二電極之間的一零電位節點。該開關件經組態以切換該電性連接件與該電池組間之一電性連接狀態。該電性連接件電性連接至該零電位節點並與一檢測裝置耦合，以使該零電位節點與該檢測裝置之間形成一靜電釋放路徑，本案另披露一種用於製造探針領域或半導體檢測或分析的製造系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a static electricity discharging device for discharging static electricity. The static electricity discharging device comprises an inner chamber, a battery pack, a conductor, a switch, and an electrical connecting member. The inner chamber receives a carrier substrate on which the battery pack is arranged. The battery pack includes a first battery and a second battery connected in series with each other. The conductor comprises a zero potential node located between a first electrode of the first battery and a second electrode of the second battery. The switch is configured to switch a state of electrical connection between the electrical connector and the battery pack. The electrical connection is electrically coupled to the zero potential node and coupled to a detection device to form an electrostatic discharge path between the zero potential node and the detection device. The present also discloses a manufacturing system for the field of probe manufacturing or semiconductor testing or analysis.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:檢測裝置</p>
        <p type="p">100:靜電消除裝置</p>
        <p type="p">110a:外盒體</p>
        <p type="p">110b:容置腔體</p>
        <p type="p">111:開關元件</p>
        <p type="p">112:電性連接件</p>
        <p type="p">113:指示光源</p>
        <p type="p">120:載板</p>
        <p type="p">130:電池組</p>
        <p type="p">131:第一電池</p>
        <p type="p">132:第二電池</p>
        <p type="p">140:導接件</p>
        <p type="p">1311:第一電極</p>
        <p type="p">1312:第二電極</p>
        <p type="p">1321:第一電極</p>
        <p type="p">1322:第二電極</p>
        <p type="p">N:零電位節點</p>
        <p type="p">PA:靜電釋放路徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1558" publication-number="202624250">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624250</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137421</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗氧化組成物</chinese-title>
        <english-title>ANTIOXIDANT COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07K5/06</main-classification>
        <further-classification edition="200601120260302B">A61K38/05</further-classification>
        <further-classification edition="200601120260302B">A61K8/64</further-classification>
        <further-classification edition="201601120260302B">A23L33/18</further-classification>
        <further-classification edition="200601120260302B">A61P17/00</further-classification>
        <further-classification edition="200601120260302B">A61Q19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱商事生命科學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI CORPORATION LIFE SCIENCES LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐久間絢子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKUMA, AYAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>櫻井敬展</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKURAI, TAKANOBU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種可內服或外用，並具有優異抗氧化能力，特別是具有自由基消去效果的組成物。該組成物併用含有半胱胺酸的胜肽之γ-Glu-Cys-Gly（GSH）、γ-Glu-Cys（γ-GC）、Cys-Gly（CG）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">To provide a composition that can be used internally or externally and has excellent antioxidant ability, particularly a free radical scavenging effect. The composition includes γ-Glu-Cys-Gly （GSH）, γ-Glu-Cys （γ-GC）, and Cys-Gly （CG）in combination, which are cysteine-containing peptides.</p>
      </isu-abst>
      <representative-img>
        <p type="p">（無）</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1559" publication-number="202623797">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623797</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137435</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＪＡＫ２　Ｖ６１７Ｆ抑制劑</chinese-title>
        <english-title>JAK2 V617F INHIBITORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/437</main-classification>
        <further-classification edition="200601120260302B">A61K31/4188</further-classification>
        <further-classification edition="200601120260302B">A61K31/357</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科俊生物科學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COGENT BIOSCIENCES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查特吉　帕亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHATTERJEE, PAYAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈魯里　拉維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JALLURI, RAVI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維恩　羅根　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VINE, LOGAN E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紐豪斯　布萊德利　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEWHOUSE, BRADLEY J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菲舍爾　約翰　Ｐ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FISCHER, JOHN P.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩力圖羅　利亞　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SALITURO, LEAH J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾莉　金百莉　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALLEY, KIMBERLY A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡爾森　保羅　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARLSON, PAUL R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼曼　史考特　Ｗ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIMAN, SCOTT W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬林基　科里　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MALINKY, CORI A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楚希洛　約翰　Ｉ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRUJILLO, JOHN I.</last-name>
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                <last-name>富爾頓　珍妮佛</last-name>
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              <english-name name-type="organization">
                <last-name>FULTON, JENNIFER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅德里格斯　瑪莎　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RODRIGUEZ, MARTHA E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費爾　傑　布萊德福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FELL, JAY BRADFORD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅賓森　約翰　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROBINSON, JOHN E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>US</english-country>
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              <chinese-name name-type="organization">
                <last-name>奇卡爾利　馬克　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHICARELLI, MARK J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汎泰契爾　布魯克林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VENTEICHER, BROOKLYNN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>US</english-country>
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          <inventor app-type="applicant" sequence="18">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫瑪　維傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, VIJAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
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          <inventor app-type="applicant" sequence="19">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝騰多夫　塔娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BETTENDORF, TANNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
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          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
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    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有以下式(I)結構的化合物：  &lt;br/&gt;&lt;img align="absmiddle" height="190px" width="203px" file="ed10719.JPG" alt="ed10719.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; ，  &lt;br/&gt;或其醫藥學上可接受之鹽，其中變數R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;4&lt;/sup&gt;、R&lt;sup&gt;5&lt;/sup&gt;、R&lt;sup&gt;6&lt;/sup&gt;、n及A如本文所定義。亦描述了包含該等化合物之醫藥組合物及其在治療疾病之方法中的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A compound having the following structure of Formula (I): &lt;br/&gt;&lt;img align="absmiddle" height="198px" width="207px" file="ed10720.JPG" alt="ed10720.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; , &lt;br/&gt;or a pharmaceutically acceptable salt thereof, wherein variables R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;4&lt;/sup&gt;, R&lt;sup&gt;5&lt;/sup&gt;, R&lt;sup&gt;6&lt;/sup&gt;, n, and A are as defined herein. Pharmaceutical compositions comprising the compounds, and their use in methods of treating diseases are also described.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1560" publication-number="202625027">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625027</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137443</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>量子退火器之加密系統及方法</chinese-title>
        <english-title>AN ENCRYPTION SYSTEM AND METHOD FOR QUANTUM ANNEALERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260305B">G06N10/60</main-classification>
        <further-classification edition="200601120260305B">H04L9/08</further-classification>
        <further-classification edition="201301120260305B">G06F21/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西班牙商多元宇宙運算公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MULTIVERSE COMPUTING S.L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>真蒂萊　法比奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENTILE, FABIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪布　穆罕默德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIB, MOHAMMAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦耶霍　貝尼特斯　卡諾　哈伊梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VALLEJO BENITEZ-CANO, JAIME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科爾蒂內斯　阿塞爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORTINES, ASER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧羅斯　羅曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORUS, ROMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於在量子退火或基於QUBO之常式期間對裝置之間之安全通信進行加密之電腦實施方法，該等常式在具有由至少一個典型運算裝置判定或支援之組態之一量子裝置上執行，其中資料之加密及解密由該典型運算裝置管理，該方法之特徵在於，在一基於QUBO之常式內，該基於QUBO之常式包含提供測試值之輸出之預訓練弱學習器組及用於此等弱學習器之權重調整程序，且在離散化以將該基於QUBO之常式模型化為一QUBO之後；藉由根據該等弱學習器之間之相關性隨機指派不同權重來對該等權重使用不同編碼深度，並註冊此編碼資訊；隨機混洗變數之順序並註冊此順序資訊；轉換儲存於至少一個儲存媒體中之QUBO矩陣，且產生包含其長度匹配解空間維度之兩個不同數字之一字串，並藉由自旋翻轉此等數字來註冊該等字串；根據該加密藉由使用編碼資訊、順序資訊、自旋翻轉結果、組合順序資訊或其等之合適組合對自至少一個量子裝置接收之該資料進行解密，該資料在傳送程序之前藉由典型運算裝置進行加密。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A computer-implemented method for an encryption for secure communication between devices during quantum annealing or QUBO-based routines, which are executed on a quantum device with configurations determined or supported by at least one classical computing device, wherein the encryption and decryption of data are managed by the classical computing device, the method characterized by within a QUBO based routine that includes set of pre-trained weak learners that provide output for test values and weight adjustment process for these weak learners and after the discretized to model it as a QUBO; using different encoding depths for different weights with the assigning the weights randomly according to the correlation in between the weak learners with the registration of this encoding information; shuffling the order of the variables randomly with the registering this order information; converting the QUBO matrix, which is stored in at least one storage medium and generating a string which includes two different number whose length matches the solution space dimensionality and registering the strings with spin flipping these numbers; decryption of the data which is received from at least one quantum device with encrypted by classical computing device before the transfer procedure with using encoding information, order information, spin flipped result, combination order information or suitable combination of them according to the encryption.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
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  <tw-patent-application no="1561" publication-number="202624539">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624539</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137450</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>結構構件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C23C24/04</main-classification>
        <further-classification edition="202001120260302B">C01F17/224</further-classification>
        <further-classification edition="200601120260302B">H01J37/32</further-classification>
        <further-classification edition="202601120260302B">H10P95/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＯＴＯ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOTO LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>片岡駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATAOKA, SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂元千里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAMOTO, SENRI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>滝沢亮人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKIZAWA, RYOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題為提供一種具有對電漿的足夠的耐久性之結構構件。 &lt;br/&gt;  本發明的解決手段為一種結構構件10，包含：基材100；覆蓋基材100的表面110之保護膜200。保護膜200包含以氧化鐿作為主成分，保護膜200的壓痕硬度大於8.6GPa。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
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  <tw-patent-application no="1562" publication-number="202624164">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624164</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137451</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>結構構件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C04B35/01</main-classification>
        <further-classification edition="202601120260302B">H10P50/20</further-classification>
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      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＯＴＯ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOTO LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>片岡駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATAOKA, SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂元千里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAMOTO, SENRI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>滝沢亮人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKIZAWA, RYOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題為提供一種具有對電漿的足夠的耐久性之結構構件。 &lt;br/&gt;  本發明的解決手段為一種結構構件10，包含：基材100；覆蓋基材100的表面110之保護膜200。保護膜200包含以氧化鐿作為主成分的結晶，該結晶的晶格常數為10.530×10&lt;sup&gt;-10&lt;/sup&gt;m以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1563" publication-number="202624165">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624165</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137452</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>結構構件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C04B35/01</main-classification>
        <further-classification edition="201801120260302B">G01N23/207</further-classification>
        <further-classification edition="202601120260302B">H10P50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＯＴＯ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOTO LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>片岡駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATAOKA, SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂元千里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAMOTO, SENRI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>滝沢亮人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKIZAWA, RYOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題為提供一種具有對電漿的足夠的耐久性之結構構件。 &lt;br/&gt;  本發明的解決手段為一種結構構件10，包含：基材100；覆蓋基材100的表面110之保護膜200。保護膜200包含以氧化鐿作為主成分。在利用X射線繞射分析保護膜200得到的繞射圖樣中，當歸屬於單斜晶的(401)面的尖峰的最大強度為PM，歸屬於立方晶的(222)面的尖峰的最大強度為PC時，在結構構件10中PM/PC＞0.38成立。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1564" publication-number="202625475">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625475</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137465</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於多事件組態之ＷＴＲＵ發起的波束報告</chinese-title>
        <english-title>WTRU-INITIATED BEAM REPORTING BASED ON MULTI-EVENT CONFIGURATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260305B">H04W24/10</main-classification>
        <further-classification edition="202301120260305B">H04W72/21</further-classification>
        <further-classification edition="202301120260305B">H04W72/23</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商內數位專利控股公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERDIGITAL PATENT HOLDINGS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴鍾賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JONGHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈格海爾特　愛辛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAGHIGHAT, AFSHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李汶一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MOON IL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康沙　維吉爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COMSA, VIRGIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡諾納　貝拉斯克斯　盧瓦克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANONNE-VELASQUEZ, LOIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊爾凡　穆罕默德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IRFAN, MOHAMMAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡清福</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馭理</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一無線傳輸/接收單元(WTRU)經配置以接收具有基於事件之上鏈(UL)資源選擇之配置資訊。該配置資訊中之複數個UL指示資源中之每一UL指示資源經配置用於指示可在該WTRU處偵測到之對應的一或多個適用事件。該WTRU可基於一經配置適用事件定義來偵測該一或多個適用事件中之至少一者之一觸發條件。該WTRU可回應於偵測到該觸發條件而基於該配置資訊中之該一或多個適用事件來確定對應之UL指示資源。該WTRU可在該UL指示資源上向一gNB進行傳輸以指示偵測到該一或多個適用事件中之該至少一者之該觸發條件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wireless transmit/receive unit (WTRU) configured to receive configuration information with event-based uplink (UL) resource selection. Each UL indication resource of a plurality of UL indication resources in the configuration information is configured for indicating a corresponding one or more applicable events detectable at the WTRU. The WTRU may detect a triggering condition for at least one of the one or more applicable events based on a configured applicable event definition. The WTRU may determine, in response to the triggering condition being detected, the corresponding UL indication resource based on the one or more applicable events in the configuration information. The WTRU may transmit, to a gNB, on the UL indication resource to indicate the detection of the triggering condition for the at least one of the one or more applicable events.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:系統圖</p>
        <p type="p">303:事件</p>
        <p type="p">310、320、330:步驟</p>
        <p type="p">gNB、302:g節點B</p>
        <p type="p">WTRU、301:無線傳輸/接收單元</p>
        <p type="p">WTRU-IBR:波束報告</p>
        <p type="p">UL:上鏈</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1565" publication-number="202624220">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624220</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137474</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阻劑組成物、疊層體及圖案形成方法</chinese-title>
        <english-title>RESIST COMPOSITION, LAMINATE, AND PATTERNING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D347/00</main-classification>
        <further-classification edition="200601120260302B">C08F212/08</further-classification>
        <further-classification edition="200601120260302B">C08F212/14</further-classification>
        <further-classification edition="200601120260302B">C08F212/32</further-classification>
        <further-classification edition="200601120260302B">C08F220/06</further-classification>
        <further-classification edition="200601120260302B">C08F220/18</further-classification>
        <further-classification edition="200601120260302B">C08F220/22</further-classification>
        <further-classification edition="200601120260302B">C08F220/30</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/038</further-classification>
        <further-classification edition="200601120260302B">G03F7/039</further-classification>
        <further-classification edition="200601120260302B">G03F7/09</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="200601120260302B">G03F7/32</further-classification>
        <further-classification edition="202601120260302B">H10P76/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊地駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUCHI, SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大山皓介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHYAMA, KOUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>草間理志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUSAMA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西川諒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIKAWA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大橋正樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHASHI, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供在EB及EUV微影等使用高能射線之光微影中，感度及解析度優良的阻劑組成物、以及使用了該阻劑組成物之疊層體及圖案形成方法。  &lt;br/&gt;該課題之解決手段為一種阻劑組成物，其特徵為含有：下式(1)表示之超原子價碘化合物、含羧基之化合物及溶劑。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="154px" width="203px" file="ed10115.JPG" alt="ed10115.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;式中，R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;分別獨立地為鹵素原子、或也可含有雜原子之碳數1~10之烴基，且也可互相鍵結並和它們所鍵結的羰基氧基及該羰基氧基間之原子一起形成環。R&lt;sup&gt;3&lt;/sup&gt;、R&lt;sup&gt;4&lt;/sup&gt;分別獨立地為鹵素原子、或也可含有雜原子之烴基，且也可互相鍵結並和它們所鍵結的碘原子及該碘原子間之原子一起形成環。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is a resist composition containing: a hypervalent iodine compound represented by the following formula (1); a carboxy-group-containing compound; and a solvent, where R&lt;sup&gt;1&lt;/sup&gt; and R&lt;sup&gt;2&lt;/sup&gt; each independently represent a halogen atom or a hydrocarbyl group having 1 to 10 carbon atoms and optionally containing a heteroatom and may be bonded to each other to form a ring together with the carbonyloxy groups bonded thereto and the atoms between the carbonyloxy groups, and R&lt;sup&gt;3&lt;/sup&gt; and R&lt;sup&gt;4&lt;/sup&gt; each independently represent a halogen atom or a hydrocarbyl group optionally containing a heteroatom and may be bonded to each other to form a ring together with the iodine atoms bonded thereto and the atom between the iodine atoms. This can provide: a resist composition excellent in sensitivity and resolution in photolithography using a high-energy beam, such as EB and EUV lithography; a laminate including the resist composition; and a patterning process using the resist composition. &lt;br/&gt;&lt;img align="absmiddle" height="113px" width="167px" file="ed10116.JPG" alt="ed10116.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1566" publication-number="202625684">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625684</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137477</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於基板處理之方法及裝置</chinese-title>
        <english-title>METHODS AND APPARATUS FOR SUBSTRATE PROCESSING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260304B">H10P14/42</main-classification>
        <further-classification edition="202601120260304B">H10P14/60</further-classification>
        <further-classification edition="202601120260304B">H10W40/25</further-classification>
        <further-classification edition="202601120260304B">H10W74/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布里格斯　班傑明Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRIGGS, BENJAMIN D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於基板處理的方法和裝置包括：將包含金屬的介電材料的主體層沉積於附著於裝置基板的裝置上；將具有成分梯度的介電材料的梯度層沉積在主體層上；以及將金屬的接合蓋層沉積在梯度層上，該金屬的純度至少為99重量%，其中梯度層具有從鄰近主體層之實質上介電性至鄰近接合蓋層之實質上導電性之介電梯度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and apparatus for substrate processing include: depositing a bulk layer of a dielectric material comprising a metal onto a device attached to a device substrate; depositing a graded layer of the dielectric material with a compositional gradient, onto the bulk layer; and depositing a bonding cap layer of the metal, having a purity of at least 99% by weight, onto the graded layer, wherein the graded layer has a dielectric gradient from substantially dielectric adjacent to the bulk layer to substantially conductive adjacent the bonding cap layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102~122:區塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1567" publication-number="202625830">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625830</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137484</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>複合基板、複合基板的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260309B">H10W70/05</main-classification>
        <further-classification edition="202601120260309B">H10W70/01</further-classification>
        <further-classification edition="202601120260309B">H10W10/10</further-classification>
        <further-classification edition="202601120260309B">H10P95/90</further-classification>
        <further-classification edition="202601120260309B">H10P52/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本碍子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGK INSULATORS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本岳士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅田颯志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UMEDA, SOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林郁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">［課題］謀求在接合功能性基板以及支撐基板而成的複合基板之中，接合強度的更進一步的提升。  &lt;br/&gt;［解決手段］複合基板100，具有：包含功能性材料而構成之功能性基板10；支撐基板30，由半導體材料或是絕緣體材料組成，與功能性基板10接合並支持功能性基板10；以及，接合層20，配置於功能性基板10與支撐基板30之間。接合層20，或是，支撐基板30或功能性基板10的其中任一方及接合層20，在內部包含不純物，此不純物的含有率的極大值，於深度方向上存在於2處。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:功能性基板</p>
        <p type="p">20:接合層</p>
        <p type="p">30:支撐基板</p>
        <p type="p">40:介電層</p>
        <p type="p">100:複合基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1568" publication-number="202624579">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624579</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137486</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>矽(110)基板及矽(110)基板的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">C30B33/02</main-classification>
        <further-classification edition="200601120260309B">C30B33/08</further-classification>
        <further-classification edition="202601120260309B">H10P95/90</further-classification>
        <further-classification edition="202601120260309B">H10P50/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU HANDOTAI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大槻剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHTSUKI, TSUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上東洋太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEHIGASHI, YOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松原壽樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUBARA, TOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木温</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部達夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, TATSUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的矽(110)基板的特徵在於前述矽(110)基板具有偏角，該偏角大於2ﾟ且小於36ﾟ。藉此，本發明提供一種抑制表面的突起狀缺陷的產生的矽(110)基板、及抑制表面的突起狀缺陷的產生的矽(110)基板的處理方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1569" publication-number="202624363">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624363</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137515</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>接著物之拆解方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08J5/00</main-classification>
        <further-classification edition="200601120260302B">C09J163/00</further-classification>
        <further-classification edition="200601120260302B">C09J11/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＤＩＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田駿介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, SHUNSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新川高見</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAKAWA, TAKAMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大津理人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSU, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的係提供具有充分接著性並且在不需要時其拆解性優良的接著物之拆解方法。本發明之接著物之拆解方法，係將基材A與基材B隔著由環氧樹脂組成物之硬化物構成的接著劑層接合而成的接著物拆解的方法，其中該接著劑層中包含導電性材料(D)，該拆解方法包含對該接著物進行通電的步驟。尤其，該接著劑層具有相分離結構者為較佳。該通電步驟中的電流較佳為直流或20kHz以下的交流，又，施加之電壓較佳為24V以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1570" publication-number="202624341">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624341</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137524</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚合物、組成物、乾膜、光波導、光電複合基板及電子零件</chinese-title>
        <english-title>POLYMER, COMPOSITION, DRY FILM, OPTICAL WAVEGUIDE, PHOTOELECTRIC COMPOSITE SUBSTRATE AND ELECTRONIC COMPONENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">C08G65/26</main-classification>
        <further-classification edition="200601120260306B">C08F212/08</further-classification>
        <further-classification edition="200601120260306B">G02F1/361</further-classification>
        <further-classification edition="200601120260306B">G01N21/41</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友電木股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO BAKELITE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西田健人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIDA, KENTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川瀬瑛大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASE, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中裕馬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, YUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種聚合物，其含有下述式（1）所表示之結構單元、下述式（2）所表示之結構單元及下述式（3）所表示之結構單元，在測量溫度25℃、測量波長632nm條件下的折射率為1.550以上且1.600以下。  &lt;br/&gt;&lt;img align="absmiddle" height="170px" width="392px" file="ed10014.JPG" alt="ed10014.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;前述式（1）中，a表示0以上且6以下的整數，R&lt;sup&gt;11&lt;/sup&gt;表示芳基，  &lt;br/&gt;&lt;img align="absmiddle" height="144px" width="404px" file="ed10015.JPG" alt="ed10015.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;前述式（2）中，R&lt;sup&gt;21&lt;/sup&gt;表示含有環氧基之基，  &lt;br/&gt;&lt;img align="absmiddle" height="203px" width="405px" file="ed10016.JPG" alt="ed10016.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;前述式（3）中，b表示0以上且15以下的整數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:第1包層</p>
        <p type="p">30:芯層</p>
        <p type="p">40:第2包層</p>
        <p type="p">100:光波導</p>
        <p type="p">110:基板</p>
        <p type="p">200:光電複合基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1571" publication-number="202624451">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624451</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137535</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>冷凍機油用酯組合物及冷凍機用工作流體組合物</chinese-title>
        <english-title>ESTER COMPOSITION FOR REFRIGERATING MACHINE OILS AND WORKING FLUID COMPOSITION FOR REFRIGERATING MACHINES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C09K5/04</main-classification>
        <further-classification edition="200601120260302B">C10M105/38</further-classification>
        <further-classification edition="200601320260302B">C10N30/06</further-classification>
        <further-classification edition="200601320260302B">C10N30/08</further-classification>
        <further-classification edition="200601320260302B">C10N40/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日油股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOF CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山中友葵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMANAKA, TOMOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小田和裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ODA, KAZUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文字山峻輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONJIYAMA, SHUNSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種冷凍機油用酯組合物，其為具有優異的潤滑性及熱穩定性，即使在高溫且空氣存在下潤滑性仍不易變差的冷凍機油用酯組合物，其含有酯(A)及酯(B)，所述酯(A)為具有新戊基骨架的三元醇與油酸的三酯，所述酯(B)為具有新戊基骨架的三元醇與油酸的二酯，所述酯(A)與所述酯(B)的質量比((A)：(B))為99.9：0.1~95.0：5.0，所述酯組合物的過氧化值為0.1~10.0meq/kg。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An ester composition for refrigerating machine oils which has excellent lubricity and thermal stability and which the lubricity is less likely to deteriorate even at high temperature and in the presence of air, the ester composition includes an ester(A) which is a triester of oleic acid and a trihydric alcohol having a neopentyl skeleton, and an ester(B) which is a diester of oleic acid and a trihydric alcohol having a neopentyl skeleton; the mass ratio ((A):(B)) of the ester (A) to the ester (B) is from 99.9:0.1 to 95.0:5.0; and the ester composition has a peroxide value of from 0.1 meq/kg to 10.0 meq/kg.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1572" publication-number="202624839">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624839</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137543</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>投影光機及車輛</chinese-title>
        <english-title>PROJECTION LIGHT MACHINE AND VEHICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G02B27/18</main-classification>
        <further-classification edition="200601120260102B">G02B27/30</further-classification>
        <further-classification edition="200601120260102B">G02B5/22</further-classification>
        <further-classification edition="200601120260102B">G02F1/1335</further-classification>
        <further-classification edition="200601120260102B">G03B21/28</further-classification>
        <further-classification edition="200601120260102B">B60R11/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商比亞迪股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BYD COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮鋭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUAN, RUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜莉莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, LILI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賀曉旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, XIAOXU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖培東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, PEIDONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴由鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, YOUPENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供投影光機及車輛，涉及投影設備的領域。該投影光機包括沿投影光路依次設置的光源元件和成像結構；光源元件向成像結構發出光線，至少部分光線沿投影光路透過成像結構後形成投影光；投影光機還包括至少一個雜光吸收結構，雜光吸收結構用於吸收來自光源元件的雜光。本申請能夠減小雜光對沿投影光路傳播的投影光的干擾，改善投影光機的成像效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides a projection light machine and a vehicle, and relates to the field of projection devices. The projection light machine includes a light source assembly and an imaging structure arranged in sequence along a projection optical path. The light source assembly emits light towards the imaging structure, and at least part of the light passes through, along the projection optical path, the imaging structure to form projection light. The projection light machine further includes at least one stray light absorption structure, and the stray light absorption structure is configured to absorb stray light from the light source assembly. The present application can reduce the interference of stray light on the projection light propagating along the projection optical path, and improve the imaging effect of the projection light machine.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光源元件</p>
        <p type="p">110:光源</p>
        <p type="p">120:准直器</p>
        <p type="p">130:二向色鏡</p>
        <p type="p">200:第一成像元件</p>
        <p type="p">300:勻光件</p>
        <p type="p">400:第二成像元件</p>
        <p type="p">500:雜光吸收結構</p>
        <p type="p">600:殼體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1573" publication-number="202624304">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624304</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137545</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>圖案形成方法</chinese-title>
        <english-title>PATTERNING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08F220/10</main-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/039</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="200601120260302B">G03F7/36</further-classification>
        <further-classification edition="200601120260302B">G03F7/38</further-classification>
        <further-classification edition="202601120260302B">H10P76/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口秀範</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, HIDENORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>須田祐貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUDA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>前田和規</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAEDA, KAZUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橘誠一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TACHIBANA, SEIICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供一種將可使用於ArF圖案化之(甲基)丙烯酸聚合物使用於主骨架，藉由乾式顯影(乾顯影)而非矽基化，來得到窄節距的微細圖案的圖案形成方法。該課題之解決手段為一種圖案形成方法，其包含以下步驟：在被加工基板上形成多層、使用ArF準分子用正型化學增幅系阻劑組成物形成阻劑上層膜，藉由曝光及曝光後烘烤使前述阻劑上層膜的曝光部的酸不穩定基脫離、實施比前述曝光後烘烤更高溫且更短時間的硬烘烤(hard bake)，使前述脫離後的酸不穩定基揮發至前述阻劑上層膜外，在未曝光部與曝光部產生碳數之差、以含有氧之氣體電漿，將前述曝光部的阻劑上層膜以乾式顯影去除來分離圖案、及將前述阻劑上層膜的圖案蝕刻轉印至下層的前述多層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is a patterning process including: forming a multilayer on a substrate to be processed; forming a resist upper layer film by using a positive chemically-amplified resist composition for ArF excimer; removing the acid-labile group in an exposed portion of the resist upper layer film by exposure and a post-exposure bake; performing a hard bake at a higher temperature and for a shorter time than the post-exposure bake to allow the removed acid-labile group to volatilize out of the resist upper layer film and cause a difference in a number of carbon atoms between an unexposed portion and the exposed portion; removing the resist upper layer film in the exposed portion with a gas plasma containing oxygen by dry development to separate a pattern; and transferring the pattern of the resist upper layer film to the multilayer underneath by etching. This can provide a patterning process that makes it possible to obtain a fine pattern having a narrow pitch by dry development using a (meth) acrylic polymer usable for ArF patterning as the main skeleton and without silylation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:晶圓基板</p>
        <p type="p">2:被加工膜</p>
        <p type="p">3:塗佈型碳膜</p>
        <p type="p">3a:塗佈型碳膜圖案</p>
        <p type="p">4:塗佈型含Si抗反射膜</p>
        <p type="p">4a:塗佈型含Si抗反射膜圖案</p>
        <p type="p">5:ArF正型化學增幅系阻劑上層膜</p>
        <p type="p">5a:酸不穩定基已脫保護之阻劑曝光部</p>
        <p type="p">5b:阻劑圖案(未曝光部)</p>
        <p type="p">6:光罩(reticle)</p>
        <p type="p">7:ArF曝光之光</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1574" publication-number="202623934">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623934</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137556</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用基於液體輔助介質之表面張力之雷射重複率的液體輔助雷射微加工方法及系統</chinese-title>
        <english-title>METHOD AND SYSTEM OF LIQUID-ASSISTED LASER MICROMACHINING USING LASER REPETITION RATE BASED ON SURFACE TENSION OF LIQUID-ASSIST MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260306B">B23K26/042</main-classification>
        <further-classification edition="200601120260306B">C03C15/02</further-classification>
        <further-classification edition="201701120260306B">B29C64/268</further-classification>
        <further-classification edition="200601120260306B">C11D1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藍斯　大衛馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANCE, DAVID MARK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯特列利佐夫　亞歷山大米哈伊洛維奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STRELTSOV, ALEXANDER MIKHAILOVICH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於一基板之液體輔助雷射微加工的方法及系統之實施例。將一雷射之一雷射光束引導至安置於一液體輔助介質中之一基板處。該基板具有一第一主表面、一第二主表面及自該第一主表面延伸至該第二主表面之一本體。該液體輔助介質至少部分地覆蓋該第二主表面。該雷射光束之一焦點沿著穿過該本體之一路徑自該第二主表面朝向該第一主表面移動。沿著該路徑移除該基板之該本體以界定一空腔。該液體輔助介質具有一表面張力，且該雷射以基於該表面張力（σ）之一重複率（F）脈衝式發射該雷射光束，該表面張力以達因/公分為單位，該重複率以kHz為單位，該重複率的計算式為&lt;img align="absmiddle" height="45px" width="366px" file="ed10009.JPG" alt="ed10009.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="15px" width="28px" file="ed10010.JPG" alt="ed10010.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of methods and systems for liquid-assisted laser micromachining of a substrate are provided. A laser beam of a laser is directed at a substrate disposed in a liquid-assist medium. The substrate has a first major surface, a second major surface, and a body extending from the first major surface to the second major surface. The liquid-assist medium at least partially covers the second major surface. A focal point of the laser beam is moved along a path through the body from the second major surface toward the first major surface. The body of the substrate is removed along the path to define a cavity. The liquid-assist medium has a surface tension, and the laser pulses the laser beam at a repetition rate (F), in kHz, based on the surface tension (σ), in dyn/cm, according to &lt;img align="absmiddle" height="14px" width="33px" file="ed10011.JPG" alt="ed10011.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="44px" width="361px" file="ed10012.JPG" alt="ed10012.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:液體輔助的基於雷射之微加工系統(「系統」)</p>
        <p type="p">20:雷射</p>
        <p type="p">22:實質上準直之雷射光束/脈衝式雷射光束</p>
        <p type="p">22F:聚焦雷射光束</p>
        <p type="p">22P:雷射光束脈衝</p>
        <p type="p">40:聚焦光學系統</p>
        <p type="p">44:可移動載物台</p>
        <p type="p">50:基板固持器</p>
        <p type="p">56:內部</p>
        <p type="p">57:透明視窗基板</p>
        <p type="p">60:液體輔助介質</p>
        <p type="p">70:可移動的精密載物台</p>
        <p type="p">75:支撐基座</p>
        <p type="p">80:電腦控制器</p>
        <p type="p">100:透明介電基板/工作基板</p>
        <p type="p">101:本體</p>
        <p type="p">102:第一主表面</p>
        <p type="p">104:第二主表面</p>
        <p type="p">AZ:系統軸線</p>
        <p type="p">FP:初始聚焦位置</p>
        <p type="p">FS:焦斑</p>
        <p type="p">x,y,z:軸/方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1575" publication-number="202624436">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624436</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137560</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>黏著帶、及電子機器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">C09J133/10</main-classification>
        <further-classification edition="202501120260303B">C08L23/08</further-classification>
        <further-classification edition="201801120260303B">C09J7/26</further-classification>
        <further-classification edition="201801120260303B">C08K3/014</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商積水化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷元貴幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANIMOTO, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>市川大翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ICHIKAWA, HIROTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緒方雄大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGATA, YUDAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西山綾音</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIYAMA, AYANE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平田稔朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRATA, TOSHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中島慶人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAJIMA, KEITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀧尻絢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKIJIRI, AYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土居智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOI, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種能夠兼具優異之追隨性與優異之強黏著性之黏著帶。又，本發明之目的在於提供一種包含該黏著帶之電子機器。  &lt;br/&gt;本發明係一種黏著帶，其具備發泡體層，上述發泡體層含有丙烯酸系共聚物，該丙烯酸系共聚物具有源自(甲基)丙烯酸酯之構成單元、與源自在末端具有聚合性不飽和雙鍵之烯烴系聚合物之構成單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1576" publication-number="202624113">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624113</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137575</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>碳奈米管漿料、電極用碳奈米管漿料及電極膜</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260302B">C01B32/174</main-classification>
        <further-classification edition="201001120260302B">H01M4/133</further-classification>
        <further-classification edition="200601120260302B">H01M4/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱鉛筆股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI PENCIL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中田有亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKATA, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>門端孝太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KADOHASHI, KOUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田後慶一朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAGO, KEIICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀧本恵莉子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKIMOTO, ERIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">包含碳奈米管、重量平均分子量為5萬以上60萬以下的羧基甲基纖維素或其金屬鹽或銨鹽，與水，前述碳奈米管係纖維長度為50μm以上、平均直徑為3nm以上20nm以下，進而，拉曼光譜法中之峰強度比G/D為1.0以上2.6以下。  &lt;br/&gt;　　(其中，前述強度比G/D係以使用前述拉曼光譜法而得之拉曼光譜中，將位於1570cm&lt;sup&gt;-1&lt;/sup&gt;~1620cm&lt;sup&gt;-1&lt;/sup&gt;範圍之G頻帶散射光峰之最大強度設為G，將位於1320cm&lt;sup&gt;-1&lt;/sup&gt;~1370cm&lt;sup&gt;-1&lt;/sup&gt;範圍之D頻帶散射光峰之最大強度設為D時，表示其之比)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1577" publication-number="202625233">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625233</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137577</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>保護元件</chinese-title>
        <english-title>PROTECTION ELEMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">H01H37/76</main-classification>
        <further-classification edition="200601120260309B">H02H3/08</further-classification>
        <further-classification edition="200601120260309B">H02H7/18</further-classification>
        <further-classification edition="200601120260309B">H02H7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商迪睿合股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEXERIALS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米田吉弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONEDA, YOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種能夠在不使保護元件之尺寸大型化的情況下，於200 V以上之過電流阻斷中使電弧放電在短時間內停止的保護元件。  本發明之保護元件1具備：發熱基板10，其具有絕緣基板11、形成於絕緣基板11之發熱體12、形成於絕緣基板11之表面且與發熱體12電性連接之第1連接電極14及第2連接電極15、及形成於絕緣基板11之端面且不與發熱體電性連接之端面電極16；第1饋電構件21及第2饋電構件22，該第1饋電構件21連接於第1連接電極14，該第2饋電構件22連接於第2連接電極15；可熔導體30，其連接於端面電極16；第1端子41及第2端子42，其等連接於可熔導體30之兩端；以及殼體50，其收容發熱基板10、可熔導體30、第1饋電構件21之一部分、第2饋電構件22之至少一部分、第1端子41之一部分、第2端子42之一部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:保護元件</p>
        <p type="p">10:發熱基板</p>
        <p type="p">11:絕緣基板</p>
        <p type="p">12:發熱體</p>
        <p type="p">14:第1連接電極</p>
        <p type="p">15:第2連接電極</p>
        <p type="p">16:端面電極</p>
        <p type="p">21:第1饋電構件</p>
        <p type="p">22:第2饋電構件</p>
        <p type="p">30:可熔導體</p>
        <p type="p">41:第1端子</p>
        <p type="p">42:第2端子</p>
        <p type="p">50:殼體</p>
        <p type="p">51:第1殼體</p>
        <p type="p">51a:端子載置面</p>
        <p type="p">51c:導體對向凹部</p>
        <p type="p">52:第2殼體</p>
        <p type="p">52a:端子按壓面</p>
        <p type="p">53:第3殼體</p>
        <p type="p">54:第4殼體</p>
        <p type="p">60:導體收容空間</p>
        <p type="p">61:內壓緩衝空間</p>
        <p type="p">62:洩漏空間</p>
        <p type="p">63:基板收容空間</p>
        <p type="p">70:填充材</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1578" publication-number="202624517">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624517</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137582</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>前驅物輸送系統</chinese-title>
        <english-title>PRECURSOR DELIVERY SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C23C16/08</main-classification>
        <further-classification edition="200601120260302B">C23C16/455</further-classification>
        <further-classification edition="200601120260302B">C23C16/52</further-classification>
        <further-classification edition="202601120260302B">H10P14/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴魯札　桑傑夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BALUJA, SANJEEV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛瑞芬　凱文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRIFFIN, KEVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐翼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷　雨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEI, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露描述了與現有前驅物輸送系統相比，能夠實現更強劑量輪廓控制的前驅物輸送系統。也描述了使用前驅物輸送系統來沉積膜的處理方法。前驅物輸送系統包括第一前驅物出口管線和第二前驅物出口管線，第一前驅物出口管線和第二前驅物出口管線均被配置為允許將前驅物從壓力控制前驅物儲器輸送至處理腔室，其中第一前驅物出口管線配置為以第一流動速率輸送前驅物，而第二前驅物出口管線配置為以第二流動速率輸送前驅物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Precursor delivery systems that can achieve increased dose profile control compared to current precursor delivery systems are described. Processing methods that include using the precursor delivery system to deposit a film are also described. The precursor delivery system comprises a first precursor outlet line and a second precursor outlet line, each of the first precursor outlet line and the second precursor outlet line configured to allow the precursor to be delivered from a pressure-controlled precursor reservoir to a processing chamber, wherein the first precursor outlet line is configured to deliver the precursor at a first flow rate and the second precursor outlet line is configured to deliver the precursor at a second flow rate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:前驅物輸送系統</p>
        <p type="p">101:化學輸送系統</p>
        <p type="p">102:安瓿</p>
        <p type="p">102A:前驅物進口管線</p>
        <p type="p">105:熱罩</p>
        <p type="p">130:進口閥</p>
        <p type="p">140:壓力計</p>
        <p type="p">150:前驅物儲器</p>
        <p type="p">151:第一前驅物出口管線</p>
        <p type="p">151A:第一孔口</p>
        <p type="p">152:第二前驅物出口管線</p>
        <p type="p">152A:第二孔口</p>
        <p type="p">155:第一惰性氣體儲器</p>
        <p type="p">155A:第一惰性氣體進口管線</p>
        <p type="p">155B:第一惰性氣體出口管線</p>
        <p type="p">155C:第一惰性氣體源</p>
        <p type="p">155D:孔口</p>
        <p type="p">160:反應性氣體儲器</p>
        <p type="p">161:反應性氣體進口管線</p>
        <p type="p">162:反應性氣體出口管線</p>
        <p type="p">162A:孔口</p>
        <p type="p">165:第二惰性氣體儲器</p>
        <p type="p">165A:第二惰性氣體進口管線</p>
        <p type="p">165B:第二惰性氣體出口管線</p>
        <p type="p">165D:孔口</p>
        <p type="p">170:閥</p>
        <p type="p">172:三通流通閥</p>
        <p type="p">180:閥</p>
        <p type="p">200:氣體分配系統</p>
        <p type="p">300:處理腔室</p>
        <p type="p">301:腔室主體</p>
        <p type="p">302:基板</p>
        <p type="p">303:基板支撐表面</p>
        <p type="p">305:上壁</p>
        <p type="p">306:狹縫閥</p>
        <p type="p">306A:狹縫蓋</p>
        <p type="p">307:下壁</p>
        <p type="p">308:側壁</p>
        <p type="p">309:內部空間</p>
        <p type="p">310:基板支撐座</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1579" publication-number="202624663">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624663</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137612</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>空調系統、空調方法以及空調室設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120251231B">F24F1/0083</main-classification>
        <further-classification edition="200601120251231B">B01D53/26</further-classification>
        <further-classification edition="200601120251231B">F24F3/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日立成套設備服務股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITACHI PLANT SERVICES CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉政昌俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIMASA, MASATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蒲生弘行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAMO, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奥村壮文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKUMURA, TAKEFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大橋章宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHASHI, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種空調系統，係能夠精細地控制成為除濕對象的對象空氣的除濕量。空調系統10係具備：除濕裝置1，係藉由除濕成為除濕對象的對象空氣TA從而製造具有超低露點的乾燥空氣DA；以及供給裝置2，係將對象空氣TA供給至除濕裝置1。除濕裝置1係具備：電解裝置1A，係化學性地分解(電解)對象空氣TA中的水分。電解裝置1A係具備：一對電極1c1，係接觸對象空氣TA並藉由水的電解而產生氫；以及電解質1c2，係由一對電極1c1夾著且具有離子傳導性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:除濕裝置</p>
        <p type="p">1a:流入口</p>
        <p type="p">1A:電解裝置</p>
        <p type="p">1b:流出口</p>
        <p type="p">1C:水解裝置</p>
        <p type="p">1c1:電極</p>
        <p type="p">1c2:電解質</p>
        <p type="p">2:供給裝置</p>
        <p type="p">3:控制裝置</p>
        <p type="p">4:感測器</p>
        <p type="p">5:分離機構</p>
        <p type="p">10:空調系統</p>
        <p type="p">30:空調室</p>
        <p type="p">40:空調室設備</p>
        <p type="p">55:流路</p>
        <p type="p">DA:乾燥空氣</p>
        <p type="p">TA:對象空氣</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1580" publication-number="202624407">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624407</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137648</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>共聚物聚合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08L83/05</main-classification>
        <further-classification edition="200601120260302B">C08L83/10</further-classification>
        <further-classification edition="200601120260302B">C08L83/14</further-classification>
        <further-classification edition="200601120260302B">C08G77/52</further-classification>
        <further-classification edition="200601120260302B">C08K3/04</further-classification>
        <further-classification edition="200601120260302B">C08K3/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商積水化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渋田薫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBUTA, KAORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱亞爾　馬尼許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAYAL, MANISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>門脇和生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KADOWAKI, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石田圭一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIDA, KEIICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石田浩也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIDA, HIROYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之共聚物聚合物具有特定之聚矽氧巨單體單元、含芳香環之單元、及含反應性官能基之單元，且上述聚矽氧巨單體單元之數量平均分子量（Mn）為1,500以上。  &lt;br/&gt;根據本發明，可提供一種共聚物聚合物，其對π共軛填料之吸附性較高，且能夠使π共軛填料於聚矽氧樹脂中之流動性提高。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1581" publication-number="202623774">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623774</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137660</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>眼罩</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">A61F9/04</main-classification>
        <further-classification edition="200601120260303B">A61H33/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商花王股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡本拓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMOTO, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>市場智久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ICHIBA, TOMOHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種眼罩，其能提高佩戴時之服貼性，從而進一步提高給予佩戴者之舒適感。  &lt;br/&gt;本發明之眼罩具備：被覆部，其於佩戴時，覆蓋佩戴者之眼部及/或眼部之周邊、以及太陽穴；一對戴耳部，其等能佩戴於佩戴者之耳部；及發熱體，其設置於被覆部；且發熱體以佩戴時與佩戴者之眼部及/或眼部之周邊直接或間接對向之方式，配置於被覆部；構成被覆部之材料及構成戴耳部之材料分別構成為能於寬度方向上伸長，構成上述戴耳部之材料之伸長50%時之荷重相對於構成被覆部之材料之伸長50%時之荷重的比為0.2以上且1.2以下，上述一對戴耳部與上述被覆部形成為一體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:眼罩</p>
        <p type="p">10:本體部</p>
        <p type="p">11:上緣部</p>
        <p type="p">12:下緣部</p>
        <p type="p">13:側緣部</p>
        <p type="p">20:被覆部</p>
        <p type="p">22:中央部</p>
        <p type="p">23:縱向中心線</p>
        <p type="p">24:通鼻部</p>
        <p type="p">30:戴耳部</p>
        <p type="p">31:穿耳孔</p>
        <p type="p">40:發熱體</p>
        <p type="p">40A:發熱體</p>
        <p type="p">40B:發熱體</p>
        <p type="p">50:內面片材</p>
        <p type="p">50a:端部</p>
        <p type="p">60:外面片材</p>
        <p type="p">D1:長度</p>
        <p type="p">D2:距離</p>
        <p type="p">L1:長度</p>
        <p type="p">L2:長度</p>
        <p type="p">VL3:一對假想線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1582" publication-number="202624375">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624375</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137663</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>導熱性片</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260302B">C08K3/014</main-classification>
        <further-classification edition="200601120260302B">C09K5/14</further-classification>
        <further-classification edition="200601120260302B">C08G77/38</further-classification>
        <further-classification edition="200601120260302B">C08K3/04</further-classification>
        <further-classification edition="200601120260302B">C08L101/12</further-classification>
        <further-classification edition="200601120260302B">C08L83/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商積水化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浦山貴大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>URAYAMA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>足羽剛児</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASHIBA, KOUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種導熱性片，其為包含高分子基質及各向異性碳材料之導熱性片，且上述各向異性碳材料之含量相對於導熱性片總量為20體積%以上40體積%以下，上述各向異性碳材料於上述導熱性片之表面露出，於上述導熱性片之表面之碳材料被覆率為65%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1583" publication-number="202624870">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624870</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137702</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>虹膜模組及包括該虹膜模組之相機模組</chinese-title>
        <english-title>IRIS MODULE AND CAMERA MODULE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260313B">G03B5/00</main-classification>
        <further-classification edition="202101120260313B">G03B9/02</further-classification>
        <further-classification edition="202101120260313B">G03B30/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG INNOTEK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李泰勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TAE HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高重烈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, JOONG YEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權宰煜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, JAE WOOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露一種包括第一磁體單元及一虹膜模組之相機模組。該虹膜模組包括：線圈；以及一環形第二磁體，其經組態以圍繞一第一軸線旋轉且包括交替安置之N極及S極。該等S極包括第一及第二S極。該等第一磁體單元包括第1-1及第1-2磁體單元。當在俯視圖中觀看時，若垂直於該第一軸線且穿過該第1-1磁體單元之中心之一虛擬第1-1線與垂直於該第一軸線且穿過該第一S極之中心之一虛擬第2-1線彼此重疊，則垂直於該第一軸線且穿過該第1-2磁體單元之中心之一虛擬第1-2線與垂直於該第一軸線且穿過該第二S極之中心之一虛擬第2-2線不彼此重疊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a camera module including first magnet units and an iris module. The iris module includes coils and a ring-shaped second magnet configured to rotate about a first axis and including N poles and S poles alternately disposed. The S poles include first and second S poles. The first magnet units include 1-1&lt;sup&gt;st&lt;/sup&gt; and 1-2&lt;sup&gt;nd&lt;/sup&gt; magnet units. When viewed in top view, if a virtual 1-1&lt;sup&gt;st&lt;/sup&gt; line perpendicular to the first axis and passing through the center of the 1-1&lt;sup&gt;st&lt;/sup&gt; magnet unit and a virtual 2-1&lt;sup&gt;st&lt;/sup&gt; line perpendicular to the first axis and passing through the center of the first S pole overlap each other, a virtual 1-2&lt;sup&gt;nd&lt;/sup&gt; line perpendicular to the first axis and passing through the center of the 1-2&lt;sup&gt;nd&lt;/sup&gt; magnet unit and a virtual 2-2&lt;sup&gt;nd&lt;/sup&gt; line perpendicular to the first axis and passing through the center of the second S pole do not overlap each other.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:透鏡移動設備</p>
        <p type="p">101:第一蓋、第一開口</p>
        <p type="p">102:第二蓋</p>
        <p type="p">103:第三蓋</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1584" publication-number="202625410">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625410</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137715</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於經調變信號識別之方法及設備</chinese-title>
        <english-title>METHOD AND APPARATUS FOR MODULATED SIGNAL IDENTIFICATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">H04L27/00</main-classification>
        <further-classification edition="202301120260305B">G06N3/0464</further-classification>
        <further-classification edition="202301120260305B">G06N3/044</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西班牙商多元宇宙運算公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MULTIVERSE COMPUTING S.L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉努阿迪　奧昆多　亞歷珊卓　達尼埃萊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENUARDI OQUENDO, ALESSANDRO DANIELE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛哈　尼洛特帕爾　坎蒂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINHA, NILOTPAL KANTI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安德烈亞　洛克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANDREA, LUC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆格爾　塞繆爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUGEL, SAMUEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧羅斯　羅曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORUS, ROMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種用於自動調變辨識之電腦實施方法及設備，該電腦實施方法及設備能夠在不具有關於原始信號細節之先驗資訊之情況下用一信號接收單元(70)偵測及識別經接收原始信號中之調變方案，其特徵在於；包括至少一個運算單元(10)，該至少一個運算單元(10)經組態以藉由對該信號進行分割且用頻譜圖提取程序運算其在多個影像中之調變來將經接收原始信號自時域變換為包含該信號中之雜訊之頻域，以便藉由將自信號接收單元(70)接收之該等原始信號視為影像來擷取時間相依性及循序資訊；擴增資料用於增加資料集大小，以用於依有限資料增加準確度；訓練該資料以用於使網路能夠基於一預定義或一預計算信雜比(SNR)位準學習時空關係；將該資料應用於卷積神經網路(CNN)及卷積神經網路(CNN)長短期記憶體網路(LSTM)混合演算法兩者中之一種演算法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A computer-implemented method and an apparatus for automatic modulation recognition that enables the detection and identification of modulation schemes in received raw signals with a signal receiving unit (70) without prior information about the raw signal detail, characterized by; comprising at least one computing unit (10) configured to transforming received raw signals from time domain to frequency domain including the noise in the signal with segmenting the signal and computing its modulation in multiple image with the spectrogram extraction process in order to capture temporal dependencies and sequential information by treating the raw signals received from signal receiving unit (70) as images; augmentation of the data for increasing the dataset size for increasing the accuracy with the limited data; training the data for enabling the network to learn spatiotemporal relationships based on a predefined or a precalculated signal-to-noise ratio (SNR) level; applying the data to one algorithm of two, which are convolutional neural network (CNN) and convolutional neural network (CNN) long short-term memory network (LSTM) hybrid algorithm.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1585" publication-number="202623775">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623775</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137720</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>眼罩</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260315B">A61F9/04</main-classification>
        <further-classification edition="200601120260315B">A61F7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商花王股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡本拓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMOTO, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>市場智久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ICHIBA, TOMOHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種眼罩，其能不拘於臉部之尺寸而給予佩戴者更高之舒適感。  &lt;br/&gt;本發明之眼罩具備：本體部，其於佩戴時，覆蓋佩戴者之眼部及/或眼部之周邊、以及太陽穴；一對戴耳部，其等能佩戴於佩戴者之耳部；及一對發熱體，其等設置於被覆部；且一對發熱體以佩戴時與佩戴者之眼部及/或眼部之周邊直接或間接對向之方式，以被覆部之寬度方向上之中央部為界，於寬度方向上相隔而配置；一對發熱體之近位側端部均未對於被覆部而固定，被覆部構成為能於寬度方向上伸長，於一對發熱體之遠位側端部至一對戴耳部間，未設置用以將戴耳部連接於被覆部之連接部，被覆部與戴耳部設置為一體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:眼罩</p>
        <p type="p">10:本體部</p>
        <p type="p">11:上緣部</p>
        <p type="p">12:下緣部</p>
        <p type="p">13:側緣部</p>
        <p type="p">20:被覆部</p>
        <p type="p">22:中央部</p>
        <p type="p">23:縱向中心線</p>
        <p type="p">24:通鼻部</p>
        <p type="p">30:戴耳部</p>
        <p type="p">31:穿耳孔</p>
        <p type="p">40:發熱體</p>
        <p type="p">40A:發熱體</p>
        <p type="p">40B:發熱體</p>
        <p type="p">50:內面片材</p>
        <p type="p">50a:端部</p>
        <p type="p">60:外面片材</p>
        <p type="p">D1:長度</p>
        <p type="p">D2:距離</p>
        <p type="p">L1:長度</p>
        <p type="p">L2:長度</p>
        <p type="p">VL3:一對假想線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1586" publication-number="202625200">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625200</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137728</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於減少預測計算模型之佔用量，特別是用於預測生物蛋白質結構之一結構，的方法及系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR REDUCING A FOOTPRINT OF A PREDICTIVE COMPUTATIONAL MODEL, IN PARTICULAR FOR PREDICTING A STRUCTURE OF BIOLOGICAL PROTEIN STRUCTURES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260305B">G16B15/00</main-classification>
        <further-classification edition="202301120260305B">G06N3/082</further-classification>
        <further-classification edition="200601120260305B">G06F17/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西班牙商多元宇宙運算公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MULTIVERSE COMPUTING S.L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐瑞斯　羅曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORUS, ROMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈羅米　薩伊德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAHROMI, SAEED S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出了一種減少預測計算模型之佔用量的系統及方法，以及一種利用此減少預測模型之佔用量的方法來預測蛋白質結構的方法。該減少預測計算模型之佔用量的方法包含：使用基於先進網路結構的模型壓縮器，壓縮該預測計算模型，以提供壓縮模型；以及重新訓練該壓縮模型，以調整該壓縮模型，從而產生具有減少的佔用量之最佳化預測計算模型。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention proposes a system and method of reducing a footprint of a predictive computational model, and a method of predicting a protein structure using such a method of reducing footprint of the predictive model. The method of reducing a footprint of a predictive computational model comprises compressing the predictive computational model to come up with a compressed model, using a model compressor based on advanced network structures, and retraining the compressed model to adjust the compressed model and thereby produce an optimised predictive computational model with a reduced footprint.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:機器學習系統</p>
        <p type="p">1000:預測計算模型</p>
        <p type="p">1050:壓縮模型</p>
        <p type="p">1060:最佳化的壓縮預測計算模型</p>
        <p type="p">2020:處理單元</p>
        <p type="p">2040:參數</p>
        <p type="p">2050:計算層</p>
        <p type="p">2060:資料矩陣</p>
        <p type="p">S100:步驟</p>
        <p type="p">S102:步驟</p>
        <p type="p">S103:步驟</p>
        <p type="p">S104:步驟</p>
        <p type="p">S110:步驟</p>
        <p type="p">S112:步驟</p>
        <p type="p">S114:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1587" publication-number="202624608">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624608</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137729</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>渦輪風力發電機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120251029B">F03D9/25</main-classification>
        <further-classification edition="201601120251029B">F03D15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施春雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施奕伶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施春雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作渦輪風力發電機係於框架內部設有渦輪風扇及動力轉換輸出模組，該框架呈中空且該框架內部的集風罩及端板區隔形成複數集風空間，渦輪風扇包含樞設於框架中的中心軸及設置於中心軸的扇葉組件，扇葉組件包含有沿中心軸的軸向方向延伸的多數葉片，動力轉換輸出模組連接中心軸。當受風吹時，不論風向，氣流皆可進入該複數集風空間中並接觸扇葉組件的葉片，且渦輪風扇能夠被從各方向而來的風帶動，再透過動力轉換輸出模組將中心軸轉動產生的動力轉換為電力並輸出，而提升產生電力的效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:框架</p>
        <p type="p">101:邊條</p>
        <p type="p">11:集風罩</p>
        <p type="p">111:受風部</p>
        <p type="p">112:導引部</p>
        <p type="p">12:端板</p>
        <p type="p">13:集風空間</p>
        <p type="p">20:渦輪風扇</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1588" publication-number="202625004">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625004</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137755</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>產生用以促進電路設計、開發及驗證之文字與碼的系統與方法</chinese-title>
        <english-title>SYSTEMS AND METHODS FOR GENERATING TEXT AND CODE TO FACILITATE CIRCUIT DESIGN, DEVELOPMENT, AND VERIFICATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260310B">G06F30/32</main-classification>
        <further-classification edition="202301120260310B">G06N3/045</further-classification>
        <further-classification edition="202001120260310B">G06F30/3308</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商阿爾發設計人工智慧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALPHA DESIGN AI, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　瑒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿羅拉　梅希爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARORA, MEHIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一非暫態處理器可讀取媒體儲存指令，當由一處理器執行時該等指令造成該處理器接收與複數信號相關聯的多模態資料。該多模態資料被提供為一第一機器學習模型之輸入以產生表示該等複數信號之信號資料，且與該多模態資料相關聯的碼被執行以檢測該多模態資料中之一異常。藉由提供該多模態資料及該信號資料為一第二機器學習模型之輸入來找出該多模態資料內之異常。結果，由該多模態資料所界定之複數傳播路徑被判定，且該等複數傳播路徑被追蹤以找出該多模態資料內之該異常。該多模態資料被接著提供為一第三機器學習模型之輸入以產生排除該異常之經修改多模態資料。&lt;b&gt;  &lt;/b&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A non-transitory, processor-readable medium stores instructions that, when executed by a processor, cause the processor to receive multimodal data associated with a plurality of signals. The multimodal data is provided as input to a first machine learning model to produce signal data that represents the plurality of signals, and code associated with the multimodal data is executed to detect an anomaly in the multimodal data. The anomaly is located within the multimodal data by providing the multimodal data and the signal data as input to a second machine learning model. As a result, a plurality of propagation paths defined by the multimodal data is determined, and the plurality of propagation paths is traced to locate the anomaly within the multimodal data. The multimodal data is then provided as input to a third machine learning model to produce modified multimodal data that excludes the anomaly.&lt;b&gt;&lt;u&gt;  &lt;/u&gt;&lt;/b&gt;</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1589" publication-number="202625494">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625494</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137758</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>NR中繼　-　網狀網路中繼發現及選擇方法</chinese-title>
        <english-title>NR RELAY - METHODS FOR RELAY DISCOVERY AND SELECTION FOR MESH NETWORK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260305B">H04W88/04</main-classification>
        <further-classification edition="200901120260305B">H04W8/00</further-classification>
        <further-classification edition="202201120260305B">H04L67/51</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商內數位專利控股公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERDIGITAL PATENT HOLDINGS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　祥德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOANG, TUONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法瑞達　馬提諾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FREDA, MARTINO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪鍾宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, JONGWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>基尼　阿納特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINI, ANATH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡清福</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馭理</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一第一無線傳輸/接收單元(WTRU)可自一第二WTRU接收一第一發現訊息。該第一發現訊息可指出與一胞元之一源性質相關聯之一較佳源性質或與該胞元之一目的地性質相關聯之一較佳目的地性質。該第一WTRU可確定該源性質是否滿足該較佳源性質或該目的地性質是否滿足該較佳目的地性質。該第一WTRU可基於該源性質滿足該較佳源性質或該目的地性質滿足該較佳目的地性質而向該第二WTRU發送一第二發現訊息。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A first wireless transmit/receive unit (WTRU) may receive, from a second WTRU, a first discovery message. The first discovery message may indicate a preferred source property associated with a source property of a cell or a preferred destination property associated with a destination property of the cell. The first WTRU may determine whether the source property satisfies the preferred source property or the destination property satisfies the preferred destination property. The first WTRU may send, to the second WTRU, a second discovery message based on the source property satisfying the preferred source property or the destination property satisfying the preferred destination property.</p>
      </isu-abst>
      <representative-img>
        <p type="p">204:中繼UE1</p>
        <p type="p">208:發現懇求訊息</p>
        <p type="p">212:遠端無線傳輸/接收單元(WTRU)</p>
        <p type="p">216:中繼UE2</p>
        <p type="p">220a、220b:PLMN ID</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1590" publication-number="202625719">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625719</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137792</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法、程式、電腦記錄媒體及基板處理系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260309B">H10P54/20</main-classification>
        <further-classification edition="201401120260309B">B23K26/02</further-classification>
        <further-classification edition="201401120260309B">B23K26/57</further-classification>
        <further-classification edition="201801120260309B">G06F9/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>笹井陸杜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAI, RIKUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下陽平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHITA, YOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮城有佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAGI, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長田創</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSADA, SO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種基板處理方法，其對由第1基板與第2基板接合成之疊合基板進行處理，其特徵為：於該第2基板，堆疊了堆疊膜，該堆疊膜包含構成雷射光照射對象的照射對象層；該基板處理方法，包含以下步驟：從該第2基板側，對該照射對象層中的各照射對象位置照射複數個脈衝的該雷射光，以令該堆疊膜所包含的其中任一層中的該照射對象位置的周圍氣化，藉此形成複數個氣化區域；以及從該第1基板將該第2基板分離；一該照射對象位置的該脈衝的該雷射光的光軸的面內位置，在俯視下，與其他該照射對象位置的該氣化區域並未重疊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">Lx:光軸</p>
        <p type="p">L:雷射光</p>
        <p type="p">P:雷射吸收層</p>
        <p type="p">Q:反射層</p>
        <p type="p">Sa:表面</p>
        <p type="p">Sb:背面</p>
        <p type="p">S:第2晶圓</p>
        <p type="p">V:氣化區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1591" publication-number="202625179">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625179</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137802</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於三維記憶體電路中字線的接觸墊結構的裝置、系統與方法</chinese-title>
        <english-title>DEVICE, SYSTEM AND METHOD FOR CONTACT PAD STRUCTURES FOR WORDLINES IN THREE-DIMENSIONAL MEMORY CIRCUITS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">G11C8/14</main-classification>
        <further-classification edition="200601120260309B">G11C5/02</further-classification>
        <further-classification edition="202601120260309B">H10D88/00</further-classification>
        <further-classification edition="202601120260309B">H10P14/40</further-classification>
        <further-classification edition="202601120260309B">H10P50/20</further-classification>
        <further-classification edition="202601120260309B">H10W10/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金東完</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DONGWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李重建</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DON KOUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿格拉瓦爾　尼迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGRAWAL, NIDHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭榮頭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, YOUNG DOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諾辛　瑪莉哈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOSHIN, MALIHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BD</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡納戈　安東尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANAGO, ANTHONY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿赫塔爾　穆罕默德　卡姆蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKHTAR, MOHD KAMRAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金度亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DOHYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李施優</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SIWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露了用於接觸墊結構的系統和方法。接觸墊結構包括至少第一襯墊和第二襯墊。第一襯墊在第一接觸點上並連接到第一字元線，第一字元線縱向定位在第一方向上並與第一接觸點相距第一距離。第二襯墊在第二接觸點上並連接到第二字元線，第二字元線縱向定位在第一方向上並與第二接觸點相距第二距離。第一和第二襯墊基於第一和第二接觸點在第二方向上對齊。第一和第二字元線對應到記憶體電路的列線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and a method for a contact pad structure are disclosed. The contact pad structure includes at least a first pad and a second pad. The first pad is on a first contact point and connected to a first wordline (WL) that is positioned lengthwise in a first direction and at a first distance from the first contact point. The second pad is on a second contact point and connected to a second WL that is positioned lengthwise in the first direction and at a second distance from the second contact point. The first and second pads are aligned in a second direction based on the first and second contact points. The first and second WLs correspond to row lines of a memory circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">422,424:字元線</p>
        <p type="p">1210,1250:視圖</p>
        <p type="p">1212,1214,1252,1254:接墊</p>
        <p type="p">1215:接墊區</p>
        <p type="p">1255:墊結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1592" publication-number="202625404">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625404</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137814</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>串列資料介面中之時序管理</chinese-title>
        <english-title>TIMING MANAGEMENT IN SERIAL DATA INTERFACES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">H04L7/04</main-classification>
        <further-classification edition="200601120260313B">H03K5/156</further-classification>
        <further-classification edition="200601120260313B">G06F1/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商美超微電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUPER MICRO COMPUTER, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳　榮華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, RONGHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊名宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請案係針對管理電子裝置之串列資料介面上的信號時序。該電子裝置包括經組態以驅動輸出介面之介面控制器。該介面控制器接收第一時鐘信號，且判定該第一時鐘信號之低循環長度。該介面控制器基於該第一時鐘信號之該低循環長度而動態地判定第二時鐘信號之占空比。具有該占空比之該第二時鐘信號由該介面控制器產生，且提供至該輸出介面。在一些實施例中，該介面控制器判定傳出延遲、傳入延遲及取樣容許時間。可進一步判定該第一時鐘信號之該低循環長度與該傳入延遲及該傳出延遲之總和之間的差，且應用該差以控制該第二時鐘信號之該占空比。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application is directed to managing signal timing on a serial data interface of an electronic device. The electronic device includes an interface controller configured to drive an output interface. The interface controller receives a first clock signal, and determines a low cycle length of the first clock signal. The interface controller dynamically determines a duty cycle of a second clock signal based on the low cycle length of the first clock signal. The second clock signal having the duty cycle is generated by the interface controller, and provided to the output interface. In some embodiments, the interface controller determines an outgoing delay, an incoming delay, and a sampling tolerance time. A difference may be further determined between the low cycle length of the first clock signal and a sum of the incoming delay and the outgoing delay, and applied to control the duty cycle of the second clock signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">700:方法</p>
        <p type="p">701:操作</p>
        <p type="p">702:操作</p>
        <p type="p">704:操作</p>
        <p type="p">706:操作</p>
        <p type="p">708:操作</p>
        <p type="p">710:操作</p>
        <p type="p">712:操作</p>
        <p type="p">714:操作</p>
        <p type="p">716:操作</p>
        <p type="p">718:操作</p>
        <p type="p">720:操作</p>
        <p type="p">722:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1593" publication-number="202624496">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624496</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137820</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>冶金工廠之操作方法</chinese-title>
        <english-title>METHOD FOR OPERATING A METALLURGICAL PLANT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C21B13/00</main-classification>
        <further-classification edition="200601120260302B">C21B13/02</further-classification>
        <further-classification edition="200601120260302B">C21B5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧森堡商保爾伍斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAUL WURTH S.A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LU</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金瑟爾　克勞斯　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINZEL, KLAUS PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀　濟宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JI, JIHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LU</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於操作包括儲氨裝置、用氨設備和冶金加工設備之冶金工廠之方法，該方法包括以下步驟：（a）將第一氨流從儲氨裝置輸送到用氨設備，（b）優選從冶金工廠之裝置收集第二流體流，（c）從第一流中提取冷量並將所提取之冷量至少部分傳遞至第二流中以冷卻第二流和/或從第二流中提取熱量並將所提取之熱量至少部分傳遞至第一流，優選加熱和/或氣化第一流，其中該方法還包括步驟（d）將來自用氨設備中之第一流之氨進行化學和/或熱轉化，以產生第三流，和（e）將第三流供給至冶金加工設備。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">201:流</p>
        <p type="p">204:第一液氨流</p>
        <p type="p">205:氣態氨流</p>
        <p type="p">209:第三富氫氣體流</p>
        <p type="p">230:第二流</p>
        <p type="p">231:流體流</p>
        <p type="p">310:冶金工廠</p>
        <p type="p">312:儲液氨裝置</p>
        <p type="p">314:熱交換器</p>
        <p type="p">316:氨設備</p>
        <p type="p">318:設備</p>
        <p type="p">326:冷氨輸送系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1594" publication-number="202625595">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625595</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137831</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260309B">H10D62/10</main-classification>
        <further-classification edition="202501120260309B">H10D62/80</further-classification>
        <further-classification edition="202501120260309B">H10D64/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商半導體能源研究所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森若智昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIWAKA, TOMOAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倉田求</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURATA, MOTOMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村川努</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAKAWA, TSUTOMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種電特性良好的半導體裝置。半導體裝置包括第一至第三電極、半導體層及第一至第三絕緣層。第一絕緣層位於第一電極上，第二電極位於第一絕緣層上。第二電極及第一絕緣層具有到達第一電極的第一開口部。半導體層具有與第二電極接觸的區域、與第一開口部的第一絕緣層的側面接觸的區域以及與第一電極接觸的區域。第三電極在第一開口部中隔著第二絕緣層與半導體層對置。第一電極具有第一導電層、第二導電層及第三導電層。第三絕緣層具有第二開口部。第一導電層、第二導電層及第三導電層位於第二開口部中。第一導電層與第二導電層的側面及底面接觸。第三導電層位於第二導電層上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10A:電晶體</p>
        <p type="p">11:絕緣層</p>
        <p type="p">12:絕緣層</p>
        <p type="p">13:絕緣層</p>
        <p type="p">14:導電層</p>
        <p type="p">14_1:導電層</p>
        <p type="p">14_2:導電層</p>
        <p type="p">14_3:導電層</p>
        <p type="p">15:絕緣層</p>
        <p type="p">16:絕緣層</p>
        <p type="p">17:絕緣層</p>
        <p type="p">18:導電層</p>
        <p type="p">18_1:導電層</p>
        <p type="p">18_2:導電層</p>
        <p type="p">19:半導體層</p>
        <p type="p">20:絕緣層</p>
        <p type="p">21:導電層</p>
        <p type="p">21_1:導電層</p>
        <p type="p">21_2:導電層</p>
        <p type="p">22:絕緣層</p>
        <p type="p">23:絕緣層</p>
        <p type="p">90:開口部</p>
        <p type="p">91:開口部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1595" publication-number="202624326">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624326</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137837</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>絕緣性樹脂組成物及電路基板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08G59/38</main-classification>
        <further-classification edition="200601120260302B">C08G59/68</further-classification>
        <further-classification edition="200601120260302B">C08L63/00</further-classification>
        <further-classification edition="200601120260302B">C08K3/38</further-classification>
        <further-classification edition="200601120260302B">B32B15/092</further-classification>
        <further-classification edition="200601120260302B">B32B27/20</further-classification>
        <further-classification edition="200601120260302B">B32B27/38</further-classification>
        <further-classification edition="200601120260302B">B32B5/18</further-classification>
        <further-classification edition="200601120260302B">H05K1/02</further-classification>
        <further-classification edition="200601120260302B">H05K1/03</further-classification>
        <further-classification edition="200601120260302B">H05K1/05</further-classification>
        <further-classification edition="200601120260302B">H05K3/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本發條股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NHK SPRING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河上岳志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAKAMI, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丸市俊明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARUICHI, TOSHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種熱傳導性及耐熱性優異並且能夠高度填充熱傳導性填料之絕緣性樹脂組成物、以及使用其之電路基板。&lt;br/&gt;  本實施型態之電路基板依序具備第1金屬層、絕緣層及第2金屬層，上述第1金屬層及上述第2金屬層中之一者為金屬基板，另一者為電路。上述絕緣層包含多孔質絕緣層及接著劑，上述多孔質絕緣層含有包含液晶原骨架之環氧樹脂均聚物與第1聚合觸媒，上述接著劑含有熱硬化性樹脂與第2聚合觸媒；上述接著劑滲透至上述多孔質絕緣層，已滲透之上述接著劑之一部分於上述第1金屬層與上述多孔質絕緣層之間不連續地形成接著劑層；相對於上述多孔質絕緣層與上述接著劑中所含有之樹脂成分之合計，上述絕緣層所含有之包含液晶原骨架之環氧樹脂均聚物之質量比為80質量%以上；上述第1聚合觸媒與上述第2聚合觸媒為鹼性聚合觸媒。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1A:電路基板</p>
        <p type="p">10:金屬基板</p>
        <p type="p">11:電路</p>
        <p type="p">12:絕緣層</p>
        <p type="p">12a:多孔質絕緣層</p>
        <p type="p">12b:接著劑層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1596" publication-number="202625464">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625464</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137840</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>禁傳送區域執行之應用層支援</chinese-title>
        <english-title>APPLICATION LAYER SUPPORT FOR NO-TRANSMIT ZONE ENFORCEMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260305B">H04W4/021</main-classification>
        <further-classification edition="202301120260305B">H04W72/541</further-classification>
        <further-classification edition="200901120260305B">H04W24/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商內數位專利控股公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERDIGITAL PATENT HOLDINGS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿巴斯　泰穆爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABBAS, TAIMOOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛迪　沙米爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FERDI, SAMIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洛伊　米契爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROY, MICHEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫仲濟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SON, JUNG JE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　冠宙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, GUANZHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賽堤　安裘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SETHI, ANUJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蒙拉德　阿特勒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONRAD, ATLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NO</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡清福</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馭理</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於非傳送區域(NTZ)執行之應用層支援之系統、方法及工具。一無線傳送/接收單元(WTRU)可包含一處理器，該處理器可經配置以執行多個動作。可確定一非傳送區域(NTZ)配置資訊。可確定該WTRU正接近一NTZ區域。可向一網路節點發送一第一通知訊息。該第一通知訊息可指示該WTRU正接近該NTZ區域且可指示與進入該NTZ區域相關聯之一第一時間。在進入該NTZ區域後，可基於該NTZ配置資訊而應用一NTZ執行。可確定與該WTRU離開該NTZ區域相關聯之一第二時間。可向該網路節點發送一第二通知訊息，該第二通知訊息可指示與離開該NTZ區域相關聯之一第二時間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems, methods, and instrumentalities for application layer support for non-transmit zone (NTZ) enforcement. A wireless transmit/receive unit (WTRU) may comprise a processor that may be configured to perform a number of actions. A non-transmit zone (NTZ) configuration information may be determined. It may be determined that the WTRU is approaching an NTZ area. A first notification message may be sent to a network node. The first notification message may indicate that the WTRU is approaching the NTZ area and may indicate a first time associated with entering the NTZ area. An NTZ enforcement may be applied based on the NTZ configuration information upon entering the NTZ area. A second time associated with the WTRU leaving the NTZ area may be determined. A second notification message may be sent to the network node, which may indicate a second time associated with leaving the NTZ area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">gNB:g節點B</p>
        <p type="p">NTZ:非傳送區域</p>
        <p type="p">TA:追蹤區域</p>
        <p type="p">WTRU:無線傳送/接收單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1597" publication-number="202625708">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625708</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137852</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>選擇性蝕刻矽之方法</chinese-title>
        <english-title>METHODS OF SELECTIVELY ETCHING SILICON</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P50/26</main-classification>
        <further-classification edition="200601120260302B">C09K13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　瑋盈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONG, DOREEN WEI YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉　秋華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAP, CHIEW WAH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯羅立克　米克海爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOROLIK, MIKHAIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉　保羅Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GEE, PAUL E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施例旨在提供選擇性蝕刻矽的方法。這些方法包括將包含鹵素間物質、含鹵素物種、擬鹵素物種中的一或多者、鹵素間物質、含鹵素物種或擬鹵素物種中的一或多者的混合物，及胺、膦、醇或酸中的一或多者，或鹵素間物質、含鹵素物種、擬鹵素物種及含硫物種中的一或多者的種混合物的前驅物，流入含有基板的半導體處理腔室；形成前驅物的活化物種；以及將基板暴露於活化物種以蝕刻基板。這些方法相對於矽鍺、氧化矽及/或氮化矽選擇性蝕刻矽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure are directed to methods of selectively etching silicon. The methods include flowing a precursor comprising one or more of an interhalogen, a halogen-containing species, a pseudohalogen species, a mixture of one or more of the interhalogen, the halogen-containing species, or the pseudohalogen species and one or more of an amine, a phosphine, a glycol, or an acid, or a mixture of one or more of the interhalogen, the halogen-containing species, the pseudohalogen species and a sulfur-containing species, into a semiconductor processing chamber containing a substrate; forming an activated species of the precursor; and exposing the substrate to the activated species to etch the substrate. The methods selectively etch silicon relative to silicon germanium, silicon oxide, and/or silicon nitride.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:方法</p>
        <p type="p">11:操作</p>
        <p type="p">12:操作</p>
        <p type="p">13:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1598" publication-number="202625813">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625813</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137862</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>藉由形成保護層防止鉬氮化</chinese-title>
        <english-title>PREVENTING MOLYBDENUM NITRIDATION BY FORMING A PROTECTIVE LAYER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260313B">H10W20/44</main-classification>
        <further-classification edition="202601120260313B">H10W20/41</further-classification>
        <further-classification edition="202601120260313B">H10W20/48</further-classification>
        <further-classification edition="202601120260313B">H10P14/42</further-classification>
        <further-classification edition="202601120260313B">H10P14/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡利亞班　姆蘇庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KALIAPPAN, MUTHUKUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑拉多斯　艾夫傑尼諾斯Ｖ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GELATOS, AVGERINOS V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈維提　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAVERTY, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹爵菲德　艾倫麥克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DANGERFIELD, AARON MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃信宰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, SHINJAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳智遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, ZHIYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種方法及相應的裝置結構包括在半導體元件結構的第一介電層內形成的特徵上，沉積金屬填充材料於至少一個電連接，其中該金屬填充材料完全填充該特徵。該方法還包括在金屬填充材料的上表面上沉積保護層，並在保護層上沉積阻障層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and corresponding device structure includes depositing a metal fill material on at least one electrical connection formed in a feature formed within a first dielectric layer of a semiconductor device structure, wherein the metal fill material completely fills the feature. The method further includes depositing a protective layer over an upper surface of the metal fill material, and depositing a barrier layer over the protective layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:半導體元件結構</p>
        <p type="p">301:介電層</p>
        <p type="p">302:元件基板</p>
        <p type="p">302b:背部</p>
        <p type="p">303:底部金屬層</p>
        <p type="p">304:介電層</p>
        <p type="p">304u:上表面/場域區域</p>
        <p type="p">305:蝕刻終止層</p>
        <p type="p">307:電連接</p>
        <p type="p">320:金屬填充材料</p>
        <p type="p">325:蝕刻終止層</p>
        <p type="p">326:介電層</p>
        <p type="p">327:保護層</p>
        <p type="p">328:阻障層</p>
        <p type="p">330:覆蓋材料</p>
        <p type="p">D1:深度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1599" publication-number="202624158">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624158</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137872</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>強化玻璃基板及其玻璃組合物</chinese-title>
        <english-title>STRENGTHENED GLASS SUBSTRATES AND GLASS COMPOSITIONS THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C03C3/091</main-classification>
        <further-classification edition="200601120260302B">C03C3/093</further-classification>
        <further-classification edition="200601120260302B">C03C3/11</further-classification>
        <further-classification edition="200601120260302B">C03C15/00</further-classification>
        <further-classification edition="200601120260302B">C03C21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格雷尼爾　傑森羅伊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRENIER, JASON ROY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯瑞許可夫　康士坦丁謝爾蓋耶維奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KORESHKOV, KONSTANTIN SERGEEVICH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藍伯森　里沙安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAMBERSON, LISA ANN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷奇　彼德約瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEZZI, PETER JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史喬特　羅伯特安東尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHAUT, ROBERT ANTHONY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莎羅法　瑪莉亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEROVA, MARIIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西古史凱伊　史坦尼拉芙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIKULSKYI, STANISLAV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>UA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史密斯　尼可拉斯詹姆士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMITH, NICHOLAS JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威勒　馬克歐恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WELLER, MARK OWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種玻璃基板，其包括延伸穿過該玻璃基板之複數個玻璃穿孔，鄰近的玻璃穿孔以一最小平均距離D&lt;sub&gt;M&lt;/sub&gt;分離。該玻璃基板進一步包括一化學強化區，該化學強化區具有一層深度，使得該層深度自該玻璃基板之一表面延伸至該玻璃基板之一主體內的一距離，該化學強化區具有比該玻璃基板之一剩餘部分更高的一壓縮應力，且其中該化學強化區之該層深度為該距離D&lt;sub&gt;M&lt;/sub&gt;之約30%或更小。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A glass substrate that includes a plurality of through-glass vias extending through the glass substrate, adjacent through-glass vias being separated by a minimum average distance DM. The glass substrate further including a chemically strengthened region with a depth of layer such that the depth of layer extends from a surface of the glass substrate to a distance within a bulk of the glass substrate, the chemically strengthened region having a higher compressive stress than a remainder of the glass substrate, and wherein the depth of layer of the chemically strengthened region is about 30% or less of the distance DM.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:玻璃中介層面板</p>
        <p type="p">12:分界線</p>
        <p type="p">20:玻璃基板</p>
        <p type="p">30:玻璃穿孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1600" publication-number="202623987">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623987</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137873</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>充氣成形裝置及充氣成形方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260223B">B29C48/10</main-classification>
        <further-classification edition="201901120260223B">B29C48/76</further-classification>
        <further-classification edition="201901120260223B">B29C48/355</further-classification>
        <further-classification edition="200601120260223B">B26F1/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友重機械摩登股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO HEAVY INDUSTRIES MODERN, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塩田𨺓宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIOTA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]使得能夠自動抑制或消除在折疊充氣成形之圓筒狀的薄膜時可能產生之氣穴。  &lt;br/&gt;　　[解決手段]充氣成形裝置(1)具有開孔輥(10)，在圓筒狀的薄膜(200)為了被一對夾送輥(100)折疊而縮小寬度之位置且比薄膜(200)開始縮小寬度之位置更靠近一對夾送輥(100)的位置，作為用於將被吸入到薄膜(200)的內側之空氣抽出到外部之事前處理，前述開孔輥(10)一邊隨著薄膜(200)的移動進行旋轉，一邊在薄膜(200)上開設孔，前述圓筒狀的薄膜(200)係藉由向擠壓成圓筒狀之熔融樹脂送出空氣而成形。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:充氣成形裝置</p>
        <p type="p">10:開孔輥</p>
        <p type="p">100:一對夾送輥</p>
        <p type="p">101:傾斜度變更用輥</p>
        <p type="p">110:一對導引部</p>
        <p type="p">200:薄膜</p>
        <p type="p">d1:距離</p>
        <p type="p">w:薄膜寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1601" publication-number="202623878">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623878</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137882</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氣體中的酸成分或鹼成分捕集用吸附管柱及其使用</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">B01D53/02</main-classification>
        <further-classification edition="200601120260302B">B01D53/04</further-classification>
        <further-classification edition="200601120260302B">B01D53/40</further-classification>
        <further-classification edition="200601120260302B">B01D53/42</further-classification>
        <further-classification edition="200601120260302B">B01J20/28</further-classification>
        <further-classification edition="200601120260302B">G01G17/00</further-classification>
        <further-classification edition="200601120260302B">G01L13/00</further-classification>
        <further-classification edition="200601120260302B">G01N5/02</further-classification>
        <further-classification edition="200601120260302B">G01N30/00</further-classification>
        <further-classification edition="200601120260302B">G01N30/96</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住化分析中心股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMIKA CHEMICAL ANALYSIS SERVICE, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安倍聡彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, TOSHIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤佳美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, YOSHIMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長谷郁枝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGATANI, IKUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種能短時間且高靈敏度地定量氣體中的酸成分或鹼成分的捕集用吸附管柱。如此一來，會使用後述氣體中的酸成分或鹼成分捕集用吸附管柱，其填充有會保持用以吸附酸成分之鹼性吸附劑或用以吸附鹼成分之酸性吸附劑的非多孔質基材，且以2.0L/min之吸引速度來吸引內部氣體時的壓力損失為10kPa以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1602" publication-number="202624291">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624291</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137892</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>補強膜、附補強膜之裝置及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">C08F2/50</main-classification>
        <further-classification edition="200601120260303B">C08F265/06</further-classification>
        <further-classification edition="201801120260303B">C09J7/40</further-classification>
        <further-classification edition="200601120260303B">C09J133/12</further-classification>
        <further-classification edition="201801120260303B">C08K3/017</further-classification>
        <further-classification edition="201901120260303B">B32B7/025</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秋山千絵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKIYAMA, CHIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴野匡哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBANO, MASAYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀内佳之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORIUCHI, YOSHIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福富秀平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUTOMI, SHUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之補強膜(10)具備固著積層於膜基材(1)之一主面上之黏著劑層(2)。黏著劑層由光硬化性組合物形成，上述光硬化性組合物包含具有交聯結構之丙烯酸系基礎聚合物、光硬化劑、及光聚合起始劑。丙烯酸系基礎聚合物包含具有碳數3～6之鏈狀烷基之(甲基)丙烯酸烷基酯、具有碳數7～9之鏈狀烷基之(甲基)丙烯酸烷基酯、及具有氧化伸烷基鏈之(甲基)丙烯酸酯，進而包含選自由含羥基之單體及含羧基之單體所組成之群中之一種以上作為構成單體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:膜基材</p>
        <p type="p">2:黏著劑層</p>
        <p type="p">10:補強膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1603" publication-number="202624157">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624157</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137921</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>玻璃纖維用玻璃組成物、玻璃纖維、玻璃纖維強化樹脂組成物及成形品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">C03C3/076</main-classification>
        <further-classification edition="200601120260303B">C03C3/087</further-classification>
        <further-classification edition="200601120260303B">C03C3/089</further-classification>
        <further-classification edition="200601120260303B">C03C3/091</further-classification>
        <further-classification edition="200601120260303B">C03C13/06</further-classification>
        <further-classification edition="200601120260303B">B32B5/02</further-classification>
        <further-classification edition="202201320260303B">B09B101/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東紡績股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO BOSEKI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貫井洋佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUKUI, YOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原島俊介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARASHIMA, SYUNSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種玻璃纖維用玻璃組成物，其中Na&lt;sub&gt;2&lt;/sub&gt;O及K&lt;sub&gt;2&lt;/sub&gt;O之總計為4.10~12.85質量%、比(Na&lt;sub&gt;2&lt;/sub&gt;O/B&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;)為0.81~8.1、比(Na&lt;sub&gt;2&lt;/sub&gt;O/Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;)為0.30~4.00、比(MgO/Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;)為0.16~1.44，將SiO&lt;sub&gt;2&lt;/sub&gt;的含量設為S(質量%)、Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;的含量設為A(質量%)、CaO的含量設為C(質量%)、B&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;的含量設為B(質量%)時，滿足式(1)。  &lt;br/&gt;　　0.010≦B/(S+A+C)≦0.070･･･(1)</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1604" publication-number="202624389">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624389</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137952</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚丙烯膜、包裝材料、包裝體以及聚丙烯膜之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">C08L23/14</main-classification>
        <further-classification edition="200601120260305B">C08L101/16</further-classification>
        <further-classification edition="200601120260305B">C08J5/22</further-classification>
        <further-classification edition="201801120260305B">C08K3/013</further-classification>
        <further-classification edition="200601120260305B">B32B27/06</further-classification>
        <further-classification edition="200601120260305B">B32B27/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商王子控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OJI HOLDINGS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山川卓真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAKAWA, TAKUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>深谷吾郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKATANI, GORO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡安俊樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAYASU, TOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松井章光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUI, AKIMITSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種聚丙烯膜，係具備：核心層、及第1表皮層；前述核心層包含聚丙烯；前述第1表皮層包含聚丙烯與抗黏連劑；前述第1表皮層中的前述抗黏連劑的粒徑分布具有2個以上的峰值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1605" publication-number="202625648">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625648</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137963</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示設備</chinese-title>
        <english-title>DISPLAY APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251229B">H10K50/19</main-classification>
        <further-classification edition="202301120251229B">H10K59/32</further-classification>
        <further-classification edition="201601120251229B">G09G3/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申相一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, SANG-IL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金泰均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, TAEKYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本說明書揭露一種顯示設備。該顯示設備可包含串聯發光元件，其包含串聯連接之第一及第二發光元件；及重置電晶體，其配置以將重置電壓施加至對應串聯發光元件之電荷產生層的第一及第二發光元件之間的節點。透過重置串聯發光元件之電荷產生層，可防止電荷產生層之電壓波動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This specification discloses a display apparatus. The display apparatus may include a tandem light-emitting element including a first and second light-emitting element connected in series, and a reset transistor configured to apply a reset voltage to a node between the first and second light-emitting elements corresponding to a charge generation layer of the tandem light-emitting element. By resetting the charge generation layer of the tandem light-emitting element, it is possible to prevent voltage fluctuation of the charge generation layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">CGL:電荷產生層</p>
        <p type="p">CST:儲存電容器</p>
        <p type="p">DT:驅動電晶體</p>
        <p type="p">EL1:第一發光元件</p>
        <p type="p">EL2:第二發光元件</p>
        <p type="p">EM:發光控制訊號</p>
        <p type="p">EVDD:高電位驅動電壓</p>
        <p type="p">EVSS:低電位驅動電壓</p>
        <p type="p">GE1:第一閘極電極</p>
        <p type="p">GE2:第二閘極電極</p>
        <p type="p">GE3:第三閘極電極</p>
        <p type="p">GE4:第四閘極電極</p>
        <p type="p">N1:第一節點</p>
        <p type="p">N2:第二節點</p>
        <p type="p">N3:第三節點</p>
        <p type="p">N4:第四節點</p>
        <p type="p">SC:掃描訊號</p>
        <p type="p">SD1:第一源極及汲極電極</p>
        <p type="p">SD2:第二源極及汲極電極</p>
        <p type="p">SCL:掃描線</p>
        <p type="p">SC1:第一掃描訊號</p>
        <p type="p">SC2:第二掃描訊號</p>
        <p type="p">SC3:第三掃描訊號</p>
        <p type="p">SC4:第四掃描訊號</p>
        <p type="p">T1:第一電晶體</p>
        <p type="p">T2:第二電晶體</p>
        <p type="p">T3:第三電晶體</p>
        <p type="p">T4:第四電晶體</p>
        <p type="p">T5:第五電晶體</p>
        <p type="p">T6:第六電晶體</p>
        <p type="p">T7:第七電晶體</p>
        <p type="p">T8:第八電晶體</p>
        <p type="p">T_OLED:串聯發光元件</p>
        <p type="p">TR1:第一電晶體</p>
        <p type="p">TR2:第二電晶體</p>
        <p type="p">Vdata:資料電壓</p>
        <p type="p">Vobs:偏壓</p>
        <p type="p">Vini:初始化電壓</p>
        <p type="p">Var:陽極重置電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1606" publication-number="202624180">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624180</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138008</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感放射線性組成物、圖案形成方法、鎓鹽化合物及聚合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07C25/18</main-classification>
        <further-classification edition="200601120260302B">C07C43/29</further-classification>
        <further-classification edition="200601120260302B">C07C69/76</further-classification>
        <further-classification edition="200601120260302B">C07C69/90</further-classification>
        <further-classification edition="200601120260302B">C07C309/17</further-classification>
        <further-classification edition="200601120260302B">C07C313/04</further-classification>
        <further-classification edition="200601120260302B">C07D317/62</further-classification>
        <further-classification edition="200601120260302B">C08F212/14</further-classification>
        <further-classification edition="200601120260302B">C08F220/38</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/039</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="200601120260302B">G03F7/32</further-classification>
        <further-classification edition="202601120260302B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錦織克聡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIKORI, KATSUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷口拓弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANIGUCHI, TAKUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供一種於圖案形成時可以與先前同等以上的水準發揮感度、CDU、曝光不足CDU、及顯影缺陷數的感放射線性組成物、圖案形成方法、鎓鹽化合物及聚合物。一種感放射線性組成物，含有：聚合物（A），包含具有酸解離性基的結構單元（I）；以及溶劑（E），所述感放射線性組成物中，所述感放射線性組成物含有具有下述式（1）所表示的鎓陽離子、以及特定的一價陰離子的鎓鹽化合物（P），或者所述聚合物（A）包含含有具有下述式（1）所表示的鎓陽離子與有機酸根陰離子並藉由曝光而產生酸的酸產生結構的結構單元（II）。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="207px" width="460px" file="ed10076.JPG" alt="ed10076.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1607" publication-number="202625807">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625807</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138009</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>導電性接腳組裝裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260304B">H10W20/40</main-classification>
        <further-classification edition="202601120260304B">H10W20/44</further-classification>
        <further-classification edition="202601120260304B">H10W90/00</further-classification>
        <further-classification edition="202601120260304B">H10P72/50</further-classification>
        <further-classification edition="202601120260304B">H10P72/70</further-classification>
        <further-classification edition="200601120260304B">H05K13/02</further-classification>
        <further-classification edition="200601120260304B">H05K13/04</further-classification>
        <further-classification edition="200601120260304B">H05K13/08</further-classification>
        <further-classification edition="202601120260304B">H10D80/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商海上股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAIJO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤澤辰一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJISAWA, SHINICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝祥揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾文岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種導電性接腳組裝裝置，能更有效率地組裝導電性接腳。一種具備組裝頭12的導電性接腳組裝裝置，組裝頭12用來將導電性接腳P組裝於電子電路基板，組裝頭12具備：輸入口14，用來輸入導電性接腳P；物品直立裝置16，使輸入的導電性接腳P直立；彈出軸18，將直立的導電性接腳P彈出；以及彈出軸驅動用馬達20，驅動彈出軸18。在彈出軸18的下方設有彈出噴嘴22，彈出軸18將物品直立裝置16直立的導電性接腳P經由彈出噴嘴22彈出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:導電性接腳組裝裝置</p>
        <p type="p">12:組裝頭</p>
        <p type="p">12A:底面</p>
        <p type="p">14:輸入口</p>
        <p type="p">18:彈出軸</p>
        <p type="p">20:彈出軸驅動馬達</p>
        <p type="p">20A、26A、28A:旋轉軸</p>
        <p type="p">22:彈出噴嘴</p>
        <p type="p">24:轉盤</p>
        <p type="p">26:轉盤旋轉用馬達</p>
        <p type="p">28:平面部</p>
        <p type="p">28B:孔部</p>
        <p type="p">29:編碼器</p>
        <p type="p">30:傾斜部</p>
        <p type="p">30A:溝</p>
        <p type="p">30B:孔</p>
        <p type="p">31:軸承</p>
        <p type="p">32:軸保持部</p>
        <p type="p">34:推桿</p>
        <p type="p">34A:推頭</p>
        <p type="p">36、40:線圈彈簧</p>
        <p type="p">42:偏心凸輪</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1608" publication-number="202625164">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625164</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138012</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用以判定用於描述將振幅變化對應為２之指數之非差分增益值之表示之最低整數位元數以用於ＨＯＡ資料框表示壓縮之方法及裝置以及用於執行其的電腦程式產品、編碼之ＨＯＡ資料框表示以及用於儲存其的儲存媒體，以及解碼聲音或聲場之壓縮高階保真立體音響（ＨＯＡ）聲音表示之方法及裝置</chinese-title>
        <english-title>METHOD AND APPARATUS FOR DETERMINING FOR THE COMPRESSION OF AN HOA DATA FRAME REPRESENTATION A LOWEST INTEGER NUMBER OF BITS FOR DESCRIBING REPRESENTATIONS OF NON-DIFFERENTIAL GAIN VALUES CORRESPONDING TO AMPLITUDE CHANGES AS AN EXPONENT OF TWO AND COMPUTER PROGRAM PRODUCT FOR PERFORMING THE SAME, CODED HOA DATA FRAME REPRESENTATION AND STORAGE MEDIUM FOR STORING THE SAME, AND METHOD AND APPARATUS FOR DECODING A COMPRESSED HIGHER ORDER AMBISONICS (HOA) SOUND REPRESENTATION OF A SOUND OR SOUND FIELD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120260305B">G10L19/008</main-classification>
        <further-classification edition="200601120260305B">H04S7/00</further-classification>
        <further-classification edition="200601120260305B">H04S5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞典商杜比國際公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOLBY INTERNATIONAL AB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克魯格　亞歷山德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRUEGER, ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科登　斯凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KORDON, SVEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係為一種判定非差分增益值表示所需最低整數位元數以用於高階保真立體音響(HOA)資料框表示壓縮之方法及裝置，當壓縮一HOA資料框表示時，於進行知覺編碼(16)前，應用一增益控制(15、151)用於各聲道信號，依一差分方式傳送增益值作為邊資訊。然而，用以開始此類串流壓縮HOA資料框表示之解碼，需要絕對增益值，其應以最小位元數編碼。用以判定此類最低整數位元數，將HOA資料框表示(&lt;b&gt;&lt;i&gt;C&lt;/i&gt;&lt;/b&gt;(&lt;i&gt;k&lt;/i&gt;))於空間域中呈現至位於一單位球面上之虛擬揚聲器信號，隨後進行HOA資料框表示(&lt;b&gt;&lt;i&gt;C&lt;/i&gt;&lt;/b&gt;(&lt;i&gt;k&lt;/i&gt;))之正規化，接著將最低整數位元數設成&lt;figure&gt;&lt;img align="absmiddle" height="43px" width="328px" file="d10007.TIF" alt="數學式ed10007.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10007.png"/&gt;&lt;/figure&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">When compressing an HOA data frame representation, a gain control (15, 151) is applied for each channel signal before it is perceptually encoded (16). The gain values are transferred in a differential manner as side information. However, for starting decoding of such streamed compressed HOA data frame representation absolute gain values are required, which should be coded with a minimum number of bits. For determining such lowest integer number (&lt;i&gt;β&lt;/i&gt;&lt;sub&gt;e&lt;/sub&gt;) of bits the HOA data frame representation (&lt;b&gt;&lt;i&gt;C&lt;/i&gt;&lt;/b&gt;(&lt;i&gt;k&lt;/i&gt;)) is rendered in spatial domain to virtual loudspeaker signals lying on a unit sphere, followed by normalisation of the HOA data frame representation (&lt;b&gt;&lt;i&gt;C&lt;/i&gt;&lt;/b&gt;(&lt;i&gt;k&lt;/i&gt;)). Then the lowest integer number of bits is set to &lt;img align="absmiddle" height="41px" width="290px" file="d10053.TIF" alt="其他非圖式ed10053.png" img-content="character" orientation="portrait" inline="no" giffile="ed10053.png"/&gt;.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:方向及向量估計處理步驟</p>
        <p type="p">12:HOA分解處理步驟</p>
        <p type="p">13:周圍分量修改處理步驟</p>
        <p type="p">14:聲道指定步驟</p>
        <p type="p">15,151:增益控制處理步驟</p>
        <p type="p">16:知覺編碼器步驟</p>
        <p type="p">17:邊資訊信號源編碼器步驟</p>
        <p type="p">18:多工器</p>
        <p type="p">
        &lt;img align="absmiddle" height="28px" width="78px" file="d10058.TIF" alt="其他非圖式ed10058.png" img-content="character" orientation="portrait" inline="no" giffile="ed10058.png"&gt;
        &lt;/img&gt;:輸出訊框</p>
        <p type="p">
        &lt;b&gt;
          &lt;i&gt;C&lt;/i&gt;
        &lt;/b&gt;(&lt;i&gt;k&lt;/i&gt;):初始訊框</p>
        <p type="p">C&lt;sub&gt;AMB&lt;/sub&gt;(&lt;i&gt;k&lt;/i&gt;-1):周圍HOA分量之訊框</p>
        <p type="p">
        &lt;b&gt;
          &lt;i&gt;C&lt;/i&gt;
        &lt;/b&gt;
        &lt;sub&gt;M,A&lt;/sub&gt;(&lt;i&gt;k&lt;/i&gt;-1):修改周圍HOA分量</p>
        <p type="p">
        &lt;b&gt;
          &lt;i&gt;C&lt;/i&gt;
        &lt;/b&gt;
        &lt;sub&gt;P,M,A&lt;/sub&gt;(&lt;i&gt;k&lt;/i&gt;-1):暫預測修改周圍HOA分量</p>
        <p type="p">
        &lt;i&gt;e&lt;/i&gt;
        &lt;sub&gt;1&lt;/sub&gt;(&lt;i&gt;k&lt;/i&gt;-2),...,&lt;i&gt;e&lt;/i&gt;&lt;sub&gt;&lt;i&gt;I&lt;/i&gt;&lt;/sub&gt;(&lt;i&gt;k&lt;/i&gt;-2):指數</p>
        <p type="p">
        &lt;i&gt;β&lt;/i&gt;
        &lt;sub&gt;1&lt;/sub&gt;(&lt;i&gt;k&lt;/i&gt;-2),...,&lt;i&gt;β&lt;/i&gt;&lt;sub&gt;&lt;i&gt;I&lt;/i&gt;&lt;/sub&gt;(&lt;i&gt;k&lt;/i&gt;-2):異常旗標</p>
        <p type="p">
        &lt;img align="absmiddle" height="27px" width="75px" file="d10054.TIF" alt="其他非圖式ed10054.png" img-content="character" orientation="portrait" inline="no" giffile="ed10054.png"&gt;
        &lt;/img&gt;,&lt;img align="absmiddle" height="25px" width="82px" file="d10055.TIF" alt="其他非圖式ed10055.png" img-content="character" orientation="portrait" inline="no" giffile="ed10055.png"/&gt;,&lt;img align="absmiddle" height="25px" width="109px" file="d10056.TIF" alt="其他非圖式ed10056.png" img-content="character" orientation="portrait" inline="no" giffile="ed10056.png"/&gt;,&lt;img align="absmiddle" height="28px" width="109px" file="d10057.TIF" alt="其他非圖式ed10057.png" img-content="character" orientation="portrait" inline="no" giffile="ed10057.png"/&gt;:元組集</p>
        <p type="p">
        &lt;b&gt;
          &lt;i&gt;v&lt;/i&gt;
        &lt;/b&gt;
        &lt;sub&gt;A,T&lt;/sub&gt;(&lt;i&gt;k&lt;/i&gt;-1):目標指定向量</p>
        <p type="p">
        &lt;b&gt;
          &lt;i&gt;v&lt;/i&gt;
        &lt;/b&gt;
        &lt;sub&gt;A&lt;/sub&gt;(&lt;i&gt;k&lt;/i&gt;-2):最終指定向量</p>
        <p type="p">
        &lt;b&gt;
          &lt;i&gt;X&lt;/i&gt;
        &lt;/b&gt;
        &lt;sub&gt;PS&lt;/sub&gt;(&lt;i&gt;k&lt;/i&gt;-1):所有主要聲音信號框</p>
        <p type="p">
        &lt;b&gt;
          &lt;i&gt;y&lt;/i&gt;
        &lt;/b&gt;
        &lt;sub&gt;1&lt;/sub&gt;(&lt;i&gt;k&lt;/i&gt;-2),...,&lt;b&gt;&lt;i&gt;y&lt;/i&gt;&lt;/b&gt;&lt;sub&gt;&lt;i&gt;I&lt;/i&gt;&lt;/sub&gt;(&lt;i&gt;k&lt;/i&gt;-2):信號框</p>
        <p type="p">
        &lt;b&gt;
          &lt;i&gt;y&lt;/i&gt;
        &lt;/b&gt;
        &lt;sub&gt;P,1&lt;/sub&gt;(&lt;i&gt;k&lt;/i&gt;-1),...,&lt;b&gt;&lt;i&gt;y&lt;/i&gt;&lt;/b&gt;&lt;sub&gt;P,&lt;i&gt;I&lt;/i&gt;&lt;/sub&gt;(&lt;i&gt;k&lt;/i&gt;-1)):預測信號框</p>
        <p type="p">
        &lt;b&gt;
          &lt;i&gt;z&lt;/i&gt;
        &lt;/b&gt;
        &lt;sub&gt;1&lt;/sub&gt;(&lt;i&gt;k&lt;/i&gt;-2),...,&lt;b&gt;&lt;i&gt;z&lt;/i&gt;&lt;/b&gt;&lt;sub&gt;&lt;i&gt;I&lt;/i&gt;&lt;/sub&gt;(&lt;i&gt;k&lt;/i&gt;-2):信號</p>
        <p type="p">
        &lt;img align="absmiddle" height="25px" width="85px" file="d10059.TIF" alt="其他非圖式ed10059.png" img-content="character" orientation="portrait" inline="no" giffile="ed10059.png"&gt;
        &lt;/img&gt;,...,&lt;img align="absmiddle" height="25px" width="82px" file="d10060.TIF" alt="其他非圖式ed10060.png" img-content="character" orientation="portrait" inline="no" giffile="ed10060.png"/&gt;:編碼信號</p>
        <p type="p">
        &lt;img align="absmiddle" height="27px" width="78px" file="d10061.TIF" alt="其他非圖式ed10061.png" img-content="character" orientation="portrait" inline="no" giffile="ed10061.png"&gt;
        &lt;/img&gt;:編碼邊資訊</p>
        <p type="p">ζ(&lt;i&gt;k&lt;/i&gt;-1):預測參數</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1609" publication-number="202625340">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625340</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138015</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於軸向磁通馬達總成之殼體</chinese-title>
        <english-title>HOUSING FOR AXIAL FLUX MOTOR ASSEMBLIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260313B">H02K15/90</main-classification>
        <further-classification edition="200601120260313B">H02K5/16</further-classification>
        <further-classification edition="202501120260313B">H02K15/40</further-classification>
        <further-classification edition="200601120260313B">H02K5/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商Ｅ電路馬達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>E-CIRCUIT MOTORS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米爾漢姆　喬治　哈迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MILHEIM, GEORGE HARDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種所揭露之設備包含用於一軸向磁通機器之一總成之一殼體，該總成至少包含一定子、一轉子及附接至該轉子之軸承。該殼體經組態以將該等軸承及該定子支撐並定位在承窩內，該等承窩在一側上敞口，以允許該總成在垂直於該轉子之一旋轉軸線之一方向上被插入至該殼體中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A disclosed apparatus includes a housing for an assembly of an axial flux machine, the assembly including at least a stator, a rotor, and bearings attached to the rotor. The housing is configured to support and locate the bearings and the stator within pockets that are open on one side to allow the assembly to be inserted into the housing in a direction perpendicular to a rotational axis of the rotor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:軸件</p>
        <p type="p">106:鋼製磁通環</p>
        <p type="p">108:定子</p>
        <p type="p">110:軸承</p>
        <p type="p">112:無框架馬達總成</p>
        <p type="p">402:殼體/平衡殼體</p>
        <p type="p">404:軸承承窩</p>
        <p type="p">406:定子承窩</p>
        <p type="p">408:唇緣</p>
        <p type="p">410:箭頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1610" publication-number="202625444">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625444</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138017</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於視訊寫碼的基於神經網路的迴路內濾波器與多級適應性迴路濾波之整合</chinese-title>
        <english-title>INTEGRATION OF NEURAL NETWORK-BASED IN LOOP FILTER WITH MULTI-STAGE ADAPTIVE LOOP FILTERING FOR VIDEO CODING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260313B">H04N19/82</main-classification>
        <further-classification edition="201401120260313B">H04N19/117</further-classification>
        <further-classification edition="201401120260313B">H04N19/70</further-classification>
        <further-classification edition="200601120260313B">G06N3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧薩諾福斯基　迪米特羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUSANOVSKYY, DMYTRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>UA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡爾切維奇　瑪塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARCZEWICZ, MARTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　雲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於編碼或解碼視訊資料的裝置，該裝置包含一或多個處理器，其經組態以：作為一適應性迴路濾波器(adaptive loop filter, ALF)的一初始級，應用一基於神經網路的迴路內濾波器以產生第一經濾波視訊資料；作為該ALF的部分，將一或多個額外濾波器應用於經重建視訊資料或經預測視訊資料以產生一或多組額外經濾波視訊資料；作為該ALF的一後續級，基於該第一經濾波視訊資料及該一或多組額外經濾波視訊資料產生第二經濾波視訊資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device for encoding or decoding video data, the device comprising one or more processors configured to: apply, as an initial stage of an adaptive loop filter (ALF), a neural network-based in-loop filter to generate first filtered video data; apply, as part of the ALF, one or more additional filters to reconstructed video data or predicted video data to generate one or more sets of additional filtered video data; generate, as a subsequent stage of the ALF, second filtered video data based on the first filtered video data and the one or more sets of additional filtered video data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1400:操作</p>
        <p type="p">1402,1404,1406:方塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1611" publication-number="202625773">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625773</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138047</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>檢查裝置及溫度調整方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260313B">H10P74/00</main-classification>
        <further-classification edition="200601120260313B">G05D23/30</further-classification>
        <further-classification edition="200601120260313B">G01R31/28</further-classification>
        <further-classification edition="200601120260313B">G01R1/073</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小西顯太朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONISHI, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種能夠適當地調整探針卡的溫度以使半導體元件與探針穩定地接觸之技術。  &lt;br/&gt;檢查裝置係包含：測試器；吸盤，係支撐半導體元件；以及探針卡，係連接於測試器，具有會接觸被支撐在吸盤的半導體元件的多個探針。檢查裝置係具備：上側溫度調整部，係設置在較吸盤更靠鉛直方向上側，會調整探針卡的溫度；以及溫度控制器，係控制上側溫度調整部的動作。溫度控制器係根據在半導體元件的檢查時從測試器供應至半導體元件的電量來調整上側溫度調整部的溫度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">30:測試器</p>
        <p type="p">31:介面</p>
        <p type="p">32:探針卡</p>
        <p type="p">33:探針</p>
        <p type="p">45:載置台</p>
        <p type="p">45s:載置面</p>
        <p type="p">46:吸盤</p>
        <p type="p">47:中間板</p>
        <p type="p">48:底板</p>
        <p type="p">481:凹部</p>
        <p type="p">50:溫度調整系統</p>
        <p type="p">51:溫度控制器</p>
        <p type="p">60:下側溫度調整部</p>
        <p type="p">61:流道</p>
        <p type="p">62:下側加熱器</p>
        <p type="p">63:下側溫度感測器</p>
        <p type="p">64:外部循環機構</p>
        <p type="p">65:冷媒供應道</p>
        <p type="p">66:冷媒排出道</p>
        <p type="p">67:冷卻器</p>
        <p type="p">70:上側溫度調整部</p>
        <p type="p">71:上側加熱器</p>
        <p type="p">72:上側溫度感測器</p>
        <p type="p">W:晶圓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1612" publication-number="202624366">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624366</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138078</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>纖維材料</chinese-title>
        <english-title>FIBROUS MATERIAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">C08J5/24</main-classification>
        <further-classification edition="200601120260303B">B29C70/20</further-classification>
        <further-classification edition="200601120260303B">B29C51/02</further-classification>
        <further-classification edition="200601120260303B">D01F9/00</further-classification>
        <further-classification edition="200601120260303B">D01F9/12</further-classification>
        <further-classification edition="200601120260303B">D01F6/60</further-classification>
        <further-classification edition="200601120260303B">D01F6/74</further-classification>
        <further-classification edition="200601320260303B">B29K67/00</further-classification>
        <further-classification edition="200601320260303B">B29K77/00</further-classification>
        <further-classification edition="200601320260303B">B29K86/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商帝人碳歐洲有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEIJIN CARBON EUROPE GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史扥茲　雅各</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STOLZ, JACOB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立克特　薇拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHTER, VERA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克拉瓦耶夫　普拉曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRAVAEV, PLAMEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特爾史提格　威廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TER STEEG, WILLEM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於用於以聚合基質材料浸漬、浸潤或注射之單層纖維材料。該纖維材料包含單向強化纖維層及本質上垂直該強化纖維之輔助線。該輔助線包含第一聚合材料及第二聚合材料。第一聚合材料可溶於基質材料，而第二聚合材料的熔點比第一聚合材料的熔點或軟化點低至少50 K。該輔助線為未絞撚或每米絞撚最多300圈。該輔助線顯示當被加熱到高於第二聚合物的熔化溫度時收縮不超過5%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The application pertains to a single-layered fibrous material for impregnation, infiltration or injection with a polymeric matrix material. The fibrous material comprises a unidirectional layer of reinforcement fibers and auxiliary threads essentially perpendicular to the reinforcement fibers. The auxiliary threads comprise a first polymeric material and a second polymeric material. The first polymeric material is dissolvable in the matrix material, while the second polymeric material has a melting point which is at least 50 K below the melting point or the softening point of the first polymeric material. The auxiliary threads are untwisted or twisted by at most 300 turns per meter. The auxiliary threads show a shrink of not more than 5% when heated above the melting temperature of the second polymer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1613" publication-number="202625596">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625596</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138115</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260309B">H10D62/10</main-classification>
        <further-classification edition="202501120260309B">H10D62/80</further-classification>
        <further-classification edition="202601120260309B">H10D88/00</further-classification>
        <further-classification edition="202601120260309B">H10P14/694</further-classification>
        <further-classification edition="202601120260309B">H10P14/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商半導體能源研究所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳澤悠一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANAGISAWA, YUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣瀬貴史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIROSE, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安藤善範</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANDO, YOSHINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種具有良好的電特性的半導體裝置。該半導體裝置包括氧化物半導體、氧化物半導體上的第一及第二導電體、配置在該第一及第二導電體上且包括重疊於第一導電體與第二導電體之間的區域的開口部的第一絕緣體、配置在第一絕緣體的開口部內的第二絕緣體及第三導電體、配置在第三導電體及第一絕緣體上的第三絕緣體、配置在形成於第一絕緣體及第三絕緣體中的到達第一導電體的開口部內的第四導電體以及同樣地配置在到達第二導電體的開口部內的第五導電體，第四導電體及第五導電體都包括第六導電體、與第六導電體的底面及側面接觸的第七導電體以及與第六導電體的底面及側面接觸的第八導電體，第八導電體的底面的一部分的厚度大於其側面的一部分的厚度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">200:電晶體</p>
        <p type="p">205:導電體</p>
        <p type="p">212:絕緣體</p>
        <p type="p">214:絕緣體</p>
        <p type="p">216:絕緣體</p>
        <p type="p">221:絕緣體</p>
        <p type="p">222:絕緣體</p>
        <p type="p">224:絕緣體</p>
        <p type="p">230:氧化物</p>
        <p type="p">240a:導電體</p>
        <p type="p">240b:導電體</p>
        <p type="p">241a:絕緣體</p>
        <p type="p">241b:絕緣體</p>
        <p type="p">242a:導電體</p>
        <p type="p">242b:導電體</p>
        <p type="p">250:絕緣體</p>
        <p type="p">260:導電體</p>
        <p type="p">271a:絕緣體</p>
        <p type="p">271b:絕緣體</p>
        <p type="p">275:絕緣體</p>
        <p type="p">280:絕緣體</p>
        <p type="p">282:絕緣體</p>
        <p type="p">283:絕緣體</p>
        <p type="p">285:絕緣體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1614" publication-number="202624302">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624302</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138122</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>吸水性樹脂粒子之製造方法、吸收體之製造方法、及吸收性物品之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">C08F220/06</main-classification>
        <further-classification edition="200601120260305B">C08J3/09</further-classification>
        <further-classification edition="200601120260305B">C08F2/06</further-classification>
        <further-classification edition="200601120260305B">C08J11/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友精化股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO SEIKA CHEMICALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>栗木均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURIKI, HITOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種含有交聯聚合物之吸水性樹脂粒子之製造方法，其具備：準備步驟，準備含有聚合物及溶劑之聚合物混合物；成形步驟，將聚合物混合物以比表面積變大之方式成形而獲得成形後的聚合物混合物；及交聯步驟，對成形後的聚合物混合物進行加熱並使聚合物交聯，藉此獲得含有交聯聚合物之交聯聚合物混合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1615" publication-number="202625042">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625042</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138124</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>支付方法、裝置、設備、系統、介質及程式產品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120251103B">G06Q20/08</main-classification>
        <further-classification edition="201201120251103B">G06Q20/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中國銀聯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA UNIONPAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>才華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郜書鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭靖宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖俊龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種支付方法、裝置、設備、系統、介質及程式產品，涉及支付技術領域。該方法包括接收第一電子設備發送的包括第一用戶的第一身份資訊、第一用戶設置的第一授信金額和第一金額使用時效的第一支付授權請求，第一授信金額為第一用戶授權第二用戶使用第一用戶的支付帳戶中資源的信用額度；根據第一支付授權請求，確定與第一電子設備對應的用於作為第一用戶授權第二用戶進行交易的支付憑證的臨時支付令牌；向第一電子設備發送臨時支付令牌，以使第一電子設備通過近場通信的點對點模式向第二用戶的第二電子設備同步臨時支付令牌。如此，無需未成年人辦理銀行卡和安裝支付平臺，簡化支付過程，並加強對未成年人的支付管控，減低支付風險。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">210,220,230:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1616" publication-number="202623856">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623856</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138129</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>滑動裝置及使用該裝置之運動用具</chinese-title>
        <english-title>SLIDE DEVICE AND EXERCISE TOOL USING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">A63B21/062</main-classification>
        <further-classification edition="200601120260305B">A63B21/00</further-classification>
        <further-classification edition="200601120260305B">F16C29/02</further-classification>
        <further-classification edition="200601120260305B">F16C29/04</further-classification>
        <further-classification edition="200601120260305B">F16C29/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商四維伸展股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>4D-STRETCH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, GEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供可對滾輪夾住軌道構件的夾住強度進行微調的滑動裝置及具備該裝置之運動用具。作為解決手段的本發明的滑動裝置係使用於運動用具的可動機構；滑動裝置係具備：長條的軌道構件；及二個以上的導引滾輪，係從二方向夾住軌道構件的側面；導引滾輪係沿著軌道構件滑動自如；導引滾輪之中的至少一者係可調整夾住軌道構件的強度的第一導引滾輪；第一導引滾輪係具備偏心機構；藉由偏心機構可調整第一導引滾輪相對於軌道構件的位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure aims to provide a slide device that allows fine adjustments of the clamping strength of a rail member by rollers, and an exercise tool equipped with the same. &lt;br/&gt;　　Provided as a solution in the present disclosure is a slide device used in a movable mechanism of an exercise tool, including a long rail member and two or more guide rollers that clamp the sides of the rail member from two directions. The guide rollers are slidable along the rail member, and at least one of the guide rollers is a first guide roller whose clamping strength against the rail member is adjustable. The first guide roller has an eccentric mechanism that allows the position of the first guide roller relative to the rail member to be adjusted.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:滑動裝置</p>
        <p type="p">2:軌道構件</p>
        <p type="p">3:基板</p>
        <p type="p">4:滾輪部</p>
        <p type="p">5:第一導引滾輪</p>
        <p type="p">6:第二導引滾輪</p>
        <p type="p">41:軸承</p>
        <p type="p">52:銷構件</p>
        <p type="p">61:螺栓</p>
        <p type="p">511:螺栓頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1617" publication-number="202623855">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623855</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138144</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>配重片及運動器具</chinese-title>
        <english-title>WEIGHT PLATE AND EXERCISE EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">A63B21/00</main-classification>
        <further-classification edition="200601120260305B">A63B21/06</further-classification>
        <further-classification edition="200601120260305B">A63B22/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商四維伸展股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>4D-STRETCH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, GEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於防止運動器具中的複數個配重片發生水平方向的位置偏移。作為解決手段的運動器具係具備：操作機構，係用以供使用者操作以進行訓練；以及配重機構，係連接於前述操作機構，並包含堆疊的複數個配重片；複數個前述配重片可調整要連接於前述操作機構的片數，前述配重片分別具有：片部；N個第一嵌合部，係設於前述片部的下面，其中N為3以上的整數；以及N個第二嵌合部，係於前述片部的上面，設於分別與N個前述第一嵌合部對應的位置；並且，堆疊方向相互鄰接的二片前述配重片中，位於上方的配重片的N個前述第一嵌合部各者分別嵌入位於下方的配重片的N個前述第二嵌合部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An exercise equipment, capable of preventing a plurality of weight plates from being displaced in a horizontal direction, includes: an operation mechanism operated by a user for training; and a weight mechanism connected to the operation mechanism and including a plurality of stacked weight plates. The number of the plurality of weight plates connected to the operation mechanism is adjustable. Each of the weight plates includes: a plate portion; N (an integer of 3 or more) first fitting portions provided on a lower surface of the plate portion; and N second fitting portions provided on an upper surface of the plate portion at positions corresponding to the N first fitting portions, respectively. In two weight plates adjacent to each other in a stacking direction, each of the N first fitting portions of the upper weight plate is fitted into each of the N second fitting portions of the lower weight plate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:配重機構</p>
        <p type="p">21:配重片</p>
        <p type="p">25:連結件</p>
        <p type="p">90:保持件</p>
        <p type="p">91:第一軸部</p>
        <p type="p">92:第二軸部</p>
        <p type="p">93:握持部</p>
        <p type="p">220:片部</p>
        <p type="p">230:固著件</p>
        <p type="p">231:軸部</p>
        <p type="p">233:凸出部</p>
        <p type="p">B:拉引構件</p>
        <p type="p">F1:下面</p>
        <p type="p">F2:上面</p>
        <p type="p">L1:第一支柱</p>
        <p type="p">L2:第二支柱</p>
        <p type="p">U1:卡合部</p>
        <p type="p">U2:卡合部</p>
        <p type="p">W1:第一嵌合部</p>
        <p type="p">W2:第二嵌合部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1618" publication-number="202624534">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624534</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138145</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基體處理設備、閥及方法</chinese-title>
        <english-title>SUBSTRATE PROCESSING APPARATUS, VALVE AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C23C16/455</main-classification>
        <further-classification edition="200601120260302B">F16K31/12</further-classification>
        <further-classification edition="200601120260302B">B08B17/02</further-classification>
        <further-classification edition="202601120260302B">H10P95/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬蘭商皮寇桑公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PICOSUN OY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布隆伯格　湯姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BLOMBERG, TOM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦哈奧賈拉　蒂莫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAHA-OJALA, TIMO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種基體處理設備(100)，其包含：一反應腔室(110)，其用於處理至少一個基體(120)；一前級管線(150)，其用於自該反應腔室(110)移除處理流體；一閥(200)，其包含用以調整該閥(200)之一致動器(260)，該閥配置於該前級管線(150)中以用於控制該處理流體、即第一流體流(F1)通過該閥(200)之流動，其中該閥(200)經組配以提供清潔氣體、即第二流體流(F2)自該致動器(260)至該閥(200)中之一故意洩漏。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A substrate processing apparatus (100) comprising, a reaction chamber (110) for processing at least one substrate (120), a foreline (150) for removing processing fluid from the reaction chamber (110), a valve (200), comprising an actuator (260) to adjust the valve (200), arranged in the foreline (150) for controlling flow of the processing fluid, the first fluid flow (F1), through the valve (200), wherein the valve (200) is configured to provide a deliberate leak of cleaning gas, second fluid flow (F2), from the actuator (260) into the valve (200).</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:閥</p>
        <p type="p">210:閥體</p>
        <p type="p">215:閥流動通道</p>
        <p type="p">220:第一入口</p>
        <p type="p">230:出口</p>
        <p type="p">240:可移動封閉構件，封閉構件</p>
        <p type="p">241:穿孔</p>
        <p type="p">243:導桿</p>
        <p type="p">246:密封元件</p>
        <p type="p">250:閥座</p>
        <p type="p">255:後座</p>
        <p type="p">260:致動器，氣動致動器</p>
        <p type="p">265:致動器腔室</p>
        <p type="p">270:彈簧元件</p>
        <p type="p">280:第二入口</p>
        <p type="p">F1:第一流體流</p>
        <p type="p">F2:第二流體流，第二流，第二氣體流</p>
        <p type="p">F3:輸出流</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1619" publication-number="202624726">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624726</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138155</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積層體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">G01N21/64</main-classification>
        <further-classification edition="201101120260313B">B82Y15/00</further-classification>
        <further-classification edition="200601120260313B">B32B3/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福浦知浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUURA, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之積層體具備具有凹凸面之基板、及形成於凹凸面上之金屬系粒子集合體層，金屬系粒子集合體層為將複數個金屬系粒子相互分開配置而成之層。複數個金屬系粒子之平均粒徑為200～1600 nm，平均高度為55～500 nm，且平均粒徑相對於平均高度之比可為1～8。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板</p>
        <p type="p">10a:凹凸面</p>
        <p type="p">20:金屬系粒子集合體層</p>
        <p type="p">30:保護層</p>
        <p type="p">100:積層體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1620" publication-number="202624295">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624295</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138180</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬化性樹脂組成物、及其硬化物之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">C08F212/08</main-classification>
        <further-classification edition="200601120260305B">C08F290/12</further-classification>
        <further-classification edition="201801120260305B">C08K3/011</further-classification>
        <further-classification edition="200601120260305B">C08L63/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大賽璐股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAICEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>學校法人北海道科學大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOKKAIDO UNIVERSITY OF SCIENCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三宅弘人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAKE, HIROTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>見山克己</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAMA, KATSUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供硬化性樹脂組成物，其能夠形成呈現低介電損耗正切之硬化物；呈現低介電損耗正切之硬化物之製造方法；使用該硬化物之印刷配線板之製造方法；及使用該硬化物之天線構件之製造方法。  &lt;br/&gt;本發明係一種硬化性樹脂組成物，其包含聚合物及交聯劑，且實質上不含聚合起始劑。構成上述聚合物之單體及/或低聚物、以及上述交聯劑之至少一者較佳為包含非極性單體及/或非極性低聚物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1621" publication-number="202624168">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624168</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138222</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氮化鋁燒結體</chinese-title>
        <english-title>ALUMINUM NITRIDE SINTERED BODY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C04B35/581</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本碍子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGK INSULATORS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山名啓太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMANA, KEITA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>昇和宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOBORI, KAZUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村圭一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, KEIICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村上幸佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAKAMI, KOYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白木佑樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIRAKI, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林郁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種氮化鋁燒結體，能抑制脫粒，且可合宜使用於應用JR力之靜電夾盤。  &lt;br/&gt;本發明之一實施形態所成之氮化鋁燒結體，包括複數之結晶粒與粒界。該複數之結晶粒各自含有氮化鋁。該粒界位在該複數之結晶粒中之彼此相鄰之結晶粒之間。該複數之結晶粒的平均粒徑係1.5μm～3.0μm。該粒界包括含鈣之氧氮化鋁以孤立狀態存在之部分。該氮化鋁燒結體之中，鋁以外的金屬元素的含有比率超過30ppm且係300ppm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the invention is to provide an aluminum nitride sintered body that can suppress shedding and is suitable for use in a static chuck that uses JR force. &lt;br/&gt;An aluminum nitride sintered body according to one embodiment of the present invention comprises a plurality of crystal grains and a grain boundary. Each of the plurality of crystal grains contains aluminum nitride. The grain boundary is positioned between adjacent crystal grains. The average grain size of the plurality of crystal grains is within a range from 1.5 µm to 3.0 µm. The grain boundary includes a portion in which aluminum oxynitride that contains calcium exists in an isolated state. In the aluminum nitride sintered body, the amount of metal elements other than aluminum is greater than 30 ppm but does not exceed 300 ppm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:氮化鋁燒結體</p>
        <p type="p">1a:陶瓷基板</p>
        <p type="p">11:結晶粒</p>
        <p type="p">12:晶界</p>
        <p type="p">13:含鈣的氧氮化鋁</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1622" publication-number="202625083">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625083</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138225</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>圖像處理方法、圖像處理裝置以及學習方法</chinese-title>
        <english-title>IMAGE PROCESSING METHOD, IMAGE PROCESSING APPARATUS, AND LEARNING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260309B">G06T7/00</main-classification>
        <further-classification edition="202301120260309B">G06N3/045</further-classification>
        <further-classification edition="201901120260309B">G06N20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商雷射科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LASERTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣瀬蒼矢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIROSE, SOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種新穎的技術，係能有助於實現使用考慮了比較對象的拍攝圖像的拍攝位置之參照圖像的檢查。圖像處理方法係具備下述工序：取得檢查用圖像，前述檢查用圖像為藉由具有預定的拍攝範圍之檢測器對檢查對象物進行拍攝所得的圖像所包含的對前述檢查對象物的檢查對象區域進行拍攝所得的圖像；取得位置資料，前述位置資料係顯示前述預定的拍攝範圍中作為前述檢查用圖像的位置之拍攝位置；基於前述檢查對象物的設計資訊生成參照圖像；以及將前述檢查用圖像與前述參照圖像進行比較，藉此檢查前述檢查對象區域；在生成前述參照圖像的工序中，使用前述位置資料，藉此針對前述設計資訊中顯示共通的構造之區域生成不同的前述參照圖像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">200:圖像處理裝置</p>
        <p type="p">201:圖像取得部</p>
        <p type="p">202:位置資料取得部</p>
        <p type="p">203:設計圖像生成部</p>
        <p type="p">204:參照圖像生成部</p>
        <p type="p">205:檢查部</p>
        <p type="p">206:學習資料取得部</p>
        <p type="p">207:模型學習部</p>
        <p type="p">208:模型記憶部</p>
        <p type="p">209:設計資訊記憶部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1623" publication-number="202625558">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625558</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138228</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於非揮發性記憶體陣列中電流洩漏補償的追蹤型記憶體胞元</chinese-title>
        <english-title>TRACKING MEMORY CELLS FOR CURRENT LEAKAGE COMPENSATION IN NON-VOLATILE MEMORY ARRAY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260309B">H10B41/40</main-classification>
        <further-classification edition="200601120260309B">G11C5/02</further-classification>
        <further-classification edition="200601120260309B">G11C7/18</further-classification>
        <further-classification edition="200601120260309B">G11C7/22</further-classification>
        <further-classification edition="200601120260309B">G11C7/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商超捷公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICON STORAGE TECHNOLOGY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邢精成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XING, LEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張建華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JIANHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張培忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, BRAIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王銀帥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YIN SHUAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曲傳浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QU, CHUAN HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多布里　亞當</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOBRI, ADAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卞麗舫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIAN, LI FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮小燕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PI, XIAOYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錢曉州</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIAN, XIAOZHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　嫻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, XIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜　恩漢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DO, NHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用來讀取成列及成行設置之記憶體胞元的方法及裝置，其具有：各自電連接至其中一行中之記憶體胞元的位元線，各自電連接至其中一列中之記憶體胞元的選擇閘極線，一行追蹤型記憶體胞元，及電連接至追蹤型記憶體胞元的追蹤型位元線。記憶體胞元儲存使用者資料，而追蹤型記憶體胞元則不儲存。該方法包括經由向記憶體胞元的選擇閘極線施加正電壓而在其中一個記憶體胞元上執行初級讀取操作，從而在該記憶體胞元的位元線上產生初級讀取電流，在追蹤型記憶體胞元上執行次級讀取操作，從而在追蹤型位元線上產生次級讀取電流，檢測初級讀取電流並基於次級讀取電流來補償該初級讀取電流。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and device for reading memory cells arranged in rows and columns, with bit lines each electrically connected to the memory cells in one of the columns, select gate lines each electrically connected to the memory cells in one of the rows, a column of tracking memory cells, and a tracking bit line electrically connected to the tracking memory cells. The memory cells store user data and the tracking memory cells do not. The method includes performing a primary read operation on one of the memory cells by applying a positive voltage to the memory cell’s select gate line resulting in a primary read current on the memory cell’s bit line, performing a secondary read operation on the tracking memory cells resulting in a secondary read current on the tracking bit line, detecting the primary read current and compensating the primary read current based on the secondary read current.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:分離閘極非揮發性記憶體胞元</p>
        <p type="p">10a1:記憶體胞元</p>
        <p type="p">10r:參考記憶體胞元</p>
        <p type="p">16a:位元線</p>
        <p type="p">16a1:位元線</p>
        <p type="p">16a2:位元線</p>
        <p type="p">24a:選擇閘極線</p>
        <p type="p">24a1:選擇閘極線</p>
        <p type="p">30:記憶體胞元10的陣列</p>
        <p type="p">30a:第一陣列</p>
        <p type="p">30b:第二陣列</p>
        <p type="p">50:感測放大器電路系統</p>
        <p type="p">52:追蹤型位元線</p>
        <p type="p">54:追蹤型記憶體胞元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1624" publication-number="202625084">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625084</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138231</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>圖像處理方法、圖像處理裝置以及學習方法</chinese-title>
        <english-title>IMAGE PROCESSING METHOD, IMAGE PROCESSING APPARATUS, AND LEARNING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260309B">G06T7/00</main-classification>
        <further-classification edition="202301120260309B">G06N3/045</further-classification>
        <further-classification edition="201901120260309B">G06N20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商雷射科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LASERTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林瑞基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, MIZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種新穎的技術，係能有助於實現使用了考慮了使用臨界照明光學系統之裝置中的亮點變動的參照圖像之檢查。一種圖像處理方法，係具備下述工序：取得檢查用圖像，前述檢查用圖像為藉由臨界照明對檢查對象物的檢查對象區域進行照明並拍攝所得的圖像；取得照明輪廓資訊，前述照明輪廓資訊係顯示拍攝時的照明輪廓；基於前述檢查對象物的設計資訊生成參照圖像；以及比較前述檢查用圖像與前述參照圖像，藉此檢查前述檢查對象區域；在生成前述參照圖像的工序中，使用前述照明輪廓資訊，藉此針對前述設計資訊中顯示共通的構造之區域生成不同的前述參照圖像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">200:圖像處理裝置</p>
        <p type="p">201:圖像取得部</p>
        <p type="p">202:輪廓取得部</p>
        <p type="p">203:設計圖像生成部</p>
        <p type="p">204:參照圖像生成部</p>
        <p type="p">205:檢查部</p>
        <p type="p">206:學習資料取得部</p>
        <p type="p">207:模型學習部</p>
        <p type="p">208:模型記憶部</p>
        <p type="p">209:設計資訊記憶部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1625" publication-number="202625818">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625818</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138250</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於散熱的覆晶玻璃架構</chinese-title>
        <english-title>CHIP-ON-GLASS ARCHITECTURE FOR THERMAL DISSIPATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260309B">H10W40/22</main-classification>
        <further-classification edition="202601120260309B">H10W44/20</further-classification>
        <further-classification edition="202601120260309B">H10W20/40</further-classification>
        <further-classification edition="200601120260309B">G02B6/00</further-classification>
        <further-classification edition="200601120260309B">G02B6/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法蘭希斯　柏特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRANSIS, BERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於安裝RF元件的玻璃基板架構可配置為散熱。現有的毫米波射頻（RF）系統將射頻積體電路（RFIC）安裝在散熱器對面側的印刷電路板上，這使得在操作過程中難以有效地從RFIC散發熱量。此架構將RFIC直接安裝在玻璃波導基板的背面，並將RFIC的頂面熱耦合至下方印刷電路板上的導電墊，通過熱路徑連接到散熱器。這使得RFIC的熱散發更為有效，並消除了對額外冷卻系統的需求或限制雷達系統性能的必要性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A glass substrate architecture for mounting RF components may be configured for heat dissipation. Existing millimeter wave radiofrequency (RF) systems mount the radiofrequency integrated circuits (RFICs) on a printed circuit board on the opposite side of a heat sink, making it difficult to dissipate heat away from the RFICs during operation. This architecture mounts the RFICs directly to a back side of a glass waveguide substrate, and thermally couples the top side of the RFICs to a conductive pad on the underlying printed circuit board with a thermal pathway to the heatsink. This leads to a much more effective dissipation of heat away from the RFICs and eliminates the need for additional cooling systems or throttling the performance of the radar system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:系統</p>
        <p type="p">302:PCB</p>
        <p type="p">304:散熱器</p>
        <p type="p">310:功率管理電路</p>
        <p type="p">312:雷達處理單元</p>
        <p type="p">320:波導結構</p>
        <p type="p">322:互連層</p>
        <p type="p">324:分佈層</p>
        <p type="p">326:輻射層</p>
        <p type="p">330:RX IC</p>
        <p type="p">331:TX IC</p>
        <p type="p">350:導熱柱</p>
        <p type="p">351:導熱柱</p>
        <p type="p">352:導熱墊</p>
        <p type="p">353:導熱墊</p>
        <p type="p">356:導導熱膏</p>
        <p type="p">358:柱</p>
        <p type="p">360:底部填充</p>
        <p type="p">362:連接</p>
        <p type="p">363:空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1626" publication-number="202624229">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624229</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138255</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雜環GLP-1促效劑</chinese-title>
        <english-title>HETEROCYCLIC GLP-1 AGONISTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">C07D471/04</main-classification>
        <further-classification edition="200601120260305B">C07F9/53</further-classification>
        <further-classification edition="200601120260305B">A61K31/437</further-classification>
        <further-classification edition="200601120260305B">A61K31/444</further-classification>
        <further-classification edition="200601120260305B">A61K31/5377</further-classification>
        <further-classification edition="200601120260305B">A61K31/662</further-classification>
        <further-classification edition="200601120260305B">A61K31/675</further-classification>
        <further-classification edition="200601120260305B">A61P3/00</further-classification>
        <further-classification edition="200601120260305B">A61P9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商迦舒布魯姆生物有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GASHERBRUM BIO, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孟慶華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENG, QINGHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　熹晨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, XICHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張海珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, HAIZHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邢唯強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XING, WEIQIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷　暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEI, HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>珍寧斯　安德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JENNINGS, ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示案係關於式（&lt;b&gt;I&lt;/b&gt;）之GLP-1促效劑：  &lt;br/&gt;&lt;img align="absmiddle" height="221px" width="265px" file="ed10295.JPG" alt="ed10295.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，        &lt;br/&gt;&lt;br/&gt;包含其醫藥學上可接受之鹽及溶劑化物，及包含其之醫藥組合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure relates to GLP-1 agonists of Formula (&lt;b&gt;I&lt;/b&gt;): &lt;br/&gt;&lt;img align="absmiddle" height="217px" width="277px" file="ed10296.JPG" alt="ed10296.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;,        &lt;br/&gt;&lt;br/&gt;including pharmaceutically acceptable salts and solvates thereof, and pharmaceutical compositions including the same.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1627" publication-number="202624208">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624208</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138265</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>有機膜形成用材料、半導體裝置製造用基板、有機膜之形成方法、圖案形成方法、有機膜形成用化合物、及芳香族羧酸酐</chinese-title>
        <english-title>MATERIAL FOR FORMING ORGANIC FILM, SUBSTRATE FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR FORMING ORGANIC FILM, PATTERNING PROCESS, COMPOUND FOR FORMING ORGANIC FILM, AND AROMATIC CARBOXYLIC ANHYDRIDE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D209/48</main-classification>
        <further-classification edition="200601120260302B">C07D307/89</further-classification>
        <further-classification edition="200601120260302B">G03F7/11</further-classification>
        <further-classification edition="200601120260302B">G03F7/16</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="200601120260302B">G03F7/40</further-classification>
        <further-classification edition="202601120260302B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郡大佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KORI, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澤村昂志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAWAMURA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飯尾匡史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IIO, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係提供不僅在空氣中，即使於鈍性氣體中之成膜條件仍進行硬化，不僅耐熱性、形成於基板之圖案的填埋或平坦化特性優良，且可形成對於基板之成膜性、密接性良好之有機膜的有機膜形成用化合物、含有該化合物之有機膜形成用材料、使用了該材料之半導體裝置製造用基板、有機膜之形成方法、圖案形成方法、及期待作為電子材料、航太材料等產業上有用之原料之具有交聯性部位的芳香族羧酸酐。  &lt;br/&gt;本發明之解決手段係一種有機膜形成用材料，含有(A)下述通式(1A)表示之化合物、及(B)有機溶劑。  &lt;br/&gt;&lt;img align="absmiddle" height="73px" width="213px" file="ed10095.JPG" alt="ed10095.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;         &lt;br/&gt;式中，W&lt;sub&gt;1&lt;/sub&gt;係n1價之有機基，n1表示2~4之整數，X&lt;sub&gt;1&lt;/sub&gt;係下述通式(1B)表示之基。  &lt;br/&gt;&lt;img align="absmiddle" height="213px" width="659px" file="ed10096.JPG" alt="ed10096.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;式中，n2係1或2，R&lt;sub&gt;1&lt;/sub&gt;係下式(1C)表示之基之任一者。  &lt;br/&gt;&lt;img align="absmiddle" height="68px" width="517px" file="ed10097.JPG" alt="ed10097.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is a material for forming an organic film, containing: (A) a compound represented by the following general formula (1A); and (B) an organic solvent, where W&lt;sub&gt;1&lt;/sub&gt; represents an n1-valent organic group, “n1” represents an integer of 2 to 4, X&lt;sub&gt;1&lt;/sub&gt; represents a group represented by the following general formula (1B), “n2” represents 1 or 2, and R&lt;sub&gt;1&lt;/sub&gt; represents any of groups represented by the following formulae (1C). This can provide: a compound for forming an organic film that cures under film formation conditions in an inert gas as well as in air, and makes it possible to form an organic film that is not only excellent in heat resistance and properties of filling and planarizing a pattern formed in a substrate, but also has favorable film-formability on and adhesiveness to a substrate; a material for forming an organic film, containing the compound; a substrate for manufacturing a semiconductor device including the material; a method for forming an organic film, using the material; a patterning process using the material; and an aromatic carboxylic anhydride having a crosslinkable moiety, expected to be an industrially useful raw material such as electronic materials and aerospace materials. &lt;br/&gt;&lt;img align="absmiddle" height="234px" width="547px" file="ed10098.JPG" alt="ed10098.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板</p>
        <p type="p">3:有機膜</p>
        <p type="p">3’:有機膜形成用材料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1628" publication-number="202624896">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624896</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138271</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感測器頭、度量衡系統及微影設備</chinese-title>
        <english-title>SENSOR HEAD, METROLOGY SYSTEM AND LITHOGRAPHIC APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">G03F7/20</main-classification>
        <further-classification edition="200601120260304B">G03F9/00</further-classification>
        <further-classification edition="202201120260304B">G01B9/02</further-classification>
        <further-classification edition="200601120260304B">G01B11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比奇曼　阿爾罕　約翰尼斯　安敦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEUKMAN, ARJAN JOHANNES ANTON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范　英葛　喬恩　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN ENGELEN, JORN PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種光子積體電路度量衡感測器頭，其包含：一輻射分裂器；複數個量測單元，其包含複數個通道中之每通道一量測單元；及一輻射組合器，其可操作以在干涉之後組合所捕捉輻射；其中該複數個量測單元包含：複數個第一類型量測單元，各第一類型量測單元用於在一第一方向上或一第二方向上執行度量衡，各該第一方向及該第二方向平行於參考平面；以及複數個第二類型量測單元，各第二類型量測單元用於在一第三方向上執行度量衡，該第三方向垂直於該第一方向及該第二方向。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a photonic integrated circuit metrology sensor head comprising a radiation splitter, a plurality of measurement units, comprising a measurement unit per channel of said plurality of channels, and a radiation combiner operable to combine the captured radiation subsequent to said interfering; wherein said plurality of measurement units comprise: a plurality of first type measurement units, each first type measurement unit for performing metrology in a first direction or a second direction, each said first direction and second direction being parallel to said reference plane; and a plurality of second type measurement units, each second type measurement unit for performing metrology in a third direction, said third direction being perpendicular to said first direction and second direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:檢測設備</p>
        <p type="p">412:照明系統</p>
        <p type="p">413:輻射光束</p>
        <p type="p">414:光束分光器</p>
        <p type="p">415:輻射子光束</p>
        <p type="p">417:輻射子光束</p>
        <p type="p">418:對準標記/目標</p>
        <p type="p">419:繞射輻射光束</p>
        <p type="p">420:基板</p>
        <p type="p">421:對準軸</p>
        <p type="p">422:載物台</p>
        <p type="p">424:方向</p>
        <p type="p">426:干涉計</p>
        <p type="p">427:干涉計信號</p>
        <p type="p">428:偵測器</p>
        <p type="p">429:經繞射輻射子光束</p>
        <p type="p">430:光束分析器</p>
        <p type="p">432:處理器</p>
        <p type="p">439:經繞射輻射子光束</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1629" publication-number="202624851">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624851</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138273</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於製造液晶顯示面板的光學貼合製程及其製造的液晶顯示面板</chinese-title>
        <english-title>OPTICAL BONDING PROCESS FOR PRODUCING LCD PANEL AND LCD PANEL PRODUCED</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">G02F1/133</main-classification>
        <further-classification edition="200601120260305B">G06F3/041</further-classification>
        <further-classification edition="201901120260305B">B32B7/023</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商電腦速達有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COMPUTER EXPRESS, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普西拉斯　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PSILLAS, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種液晶顯示器（LCD）及LCD的製造方法，其中，以至少一片膠帶（例如黑色聚酯膠帶）固定元件的層狀堆疊。該層狀堆疊透過光學透明黏合劑（OCA）貼合於蓋板玻璃以及可選的觸控面板/感測器。該方法和裝置包括將至少一片膠帶固定到該層狀堆疊的前側，使得該至少一片膠帶摺過以覆蓋該層狀堆疊的周緣，並固定到該層狀堆疊的後側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Liquid crystal displays (LCDs) and methods of making LCDs are provided where a layered stack of components is secured with at least one piece of tape, such as black mylar tape. The layered stack is bonded to a cover glass and optionally a touch panel/sensor with an optically clear adhesive (OCA). Methods and apparatuses include at least one piece of tape secured to a front side of the layered stack such that the at least one piece of tape folds over the perimeter of the layered stack and is secured to a rear side of the layered stack.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:液晶顯示面板</p>
        <p type="p">202:板上可撓性電路印刷電路</p>
        <p type="p">203A,203B,203C,203D,203E:膠帶</p>
        <p type="p">210:殼體</p>
        <p type="p">212:上擴散膜</p>
        <p type="p">214:上稜鏡膜</p>
        <p type="p">216:光條</p>
        <p type="p">218:導光元件</p>
        <p type="p">220:反射膜</p>
        <p type="p">222:背蓋</p>
        <p type="p">226:下擴散膜</p>
        <p type="p">228:下稜鏡膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1630" publication-number="202624014">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624014</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138285</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積層體及其製造方法</chinese-title>
        <english-title>LAMINATE AND ITS MANUFACTURING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">B32B27/36</main-classification>
        <further-classification edition="200601120260302B">B32B37/06</further-classification>
        <further-classification edition="200601120260302B">B32B37/10</further-classification>
        <further-classification edition="200601120260302B">C08G63/06</further-classification>
        <further-classification edition="200601120260302B">C09K19/38</further-classification>
        <further-classification edition="200601120260302B">H04R7/02</further-classification>
        <further-classification edition="200601120260302B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商可樂麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURARAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中島崇裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKASHIMA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮內知嘉子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAUCHI, CHIKAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池田啟輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEDA, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏目崇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATSUME, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示提供一種積層體，其能比較低成本地製造，含有液晶聚合物，且內部損耗大。&lt;br/&gt;  本揭示之積層體(LA)為薄膜狀或薄片狀的積層體，其具有將含有熱塑性液晶聚合物且厚度為15～200μm的複數個液晶聚合物薄膜(F1、F2)以互相相鄰的2個液晶聚合物薄膜相接之方式積層而成之積層構造，該積層體係總厚度為30～1000μm，至少一方向的頻率10Hz、溫度25℃下的損失正切(tanδ)為0.08～0.50。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">F1,F2:液晶聚合物薄膜</p>
        <p type="p">F1M,F2M:主部</p>
        <p type="p">LA,LA1-LA3:積層體</p>
        <p type="p">S12:積層界面</p>
        <p type="p">L12:積層界面層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1631" publication-number="202625762">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625762</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138309</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>彎曲的靜電夾持</chinese-title>
        <english-title>CURVED ELECTROSTATIC CHUCKS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260306B">H10P72/72</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　建</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法蘇德夫　安納德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VASUDEV, ANAND</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴拉蘇拔馬尼安　葛尼斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BALASUBRAMANIAN, GANESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅恰　朱安Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROCHA, JUAN C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MX</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高若特拉　安奇特艾托</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GORATELA, ANKIT ATUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本說明書中描述的實施例通常與基板處理設備有關。更具體地說，本說明書中描述的實施例涉及用於限制或防止基板後側損壞的基板支撐設計。在至少一個實施例中，提供了一種基板支撐組件。該基板支撐組件包括一個基板支撐主體，其中具有彎曲的表面，該彎曲表面具有彎曲輪廓，該彎曲輪廓的彎曲深度約為0.5mm或更大，並且在基板支撐主體中，在彎曲表面下方設置了一個電極，該電極的形狀彎曲以實質上匹配彎曲表面的彎曲輪廓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments described herein generally relate to substrate processing apparatuses. More specifically, embodiments described herein relate to substrate support designs used to limit or prevent damage to the back side of a substrate. In at least one embodiment, a substrate support assembly is provided. The substrate support assembly includes a substrate support body including a curved surface having a curve profile, the curve profile having a curve depth of about 0.5 mm or greater, and an electrode disposed in the substrate support body below the curved surface, the electrode being curved to substantially match the curve profile of the curved surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">118:基板</p>
        <p type="p">122:後側</p>
        <p type="p">202:基板支撐主體</p>
        <p type="p">204:外緣</p>
        <p type="p">206:第一表面</p>
        <p type="p">210:凸點</p>
        <p type="p">212:加熱器</p>
        <p type="p">216:電極</p>
        <p type="p">220:真空源</p>
        <p type="p">222:孔</p>
        <p type="p">224:導管</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1632" publication-number="202625471">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625471</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138323</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於在身份驗證拒絕時處理用戶設備參數系統、裝置和方法</chinese-title>
        <english-title>SYSTEMS, APPARATUS AND METHODS FOR HANDLING USER EQUIPMENT PARAMETERS UPON AUTHENTICATION REJECTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260309B">H04W12/06</main-classification>
        <further-classification edition="200901120260309B">H04W48/18</further-classification>
        <further-classification edition="200901120260309B">H04W60/00</further-classification>
        <further-classification edition="201801120260309B">H04W76/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邦尼特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PUNEET</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納耶米　馬各</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIEMI, MARKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示了一種無線通信的系統、裝置和方法。在一實施例中，一無線通信裝置從一無線通信節點接收作為一程序之一部分的身份驗證拒絕消息。響應於接收該身份驗證拒絕消息，該無線通信裝置刪除該無線通信節點所屬的一網路列表。該網路列表可能包含一公共陸地移動網路（PLMN）列表或一等效的獨立非公共網路（SNPN）列表。此外，該無線通信裝置可能重置各種計數器，包含一註冊嘗試計數器、一附加嘗試計數器、一服務嘗試計數器和一跟踪區域更新（TAU）嘗試計數器。該程序可能是一註冊程序、一附加程序或一跟踪區域更新（TAU）程序。該系統和方法也可以在一裝置中實施，該裝置包含一收發器和一配置為執行所述操作的處理器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system, apparatus and method for wireless communication are disclosed herein. In one embodiment, a wireless communication device receives an authentication reject message from a wireless communication node as part of a procedure. In response to receiving the authentication reject message, the wireless communication device deletes a network list to which the wireless communication node belongs. The network list may include a Public Land Mobile Network (PLMN) list or an equivalent Standalone Non-Public Network (SNPN) list. Additionally, the wireless communication device may reset various counters, including a registration attempt counter, an attach attempt counter, a service attempt counter, and a Tracking Area Update (TAU) attempt counter. The procedure may be a registration procedure, an attach procedure, or a Tracking Area Update (TAU) procedure. The system and method may also be implemented in an apparatus comprising a transceiver and a processor configured to perform the described operations.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:通信方法</p>
        <p type="p">302:步驟</p>
        <p type="p">304:步驟</p>
        <p type="p">306:決策點</p>
        <p type="p">308A:步驟</p>
        <p type="p">308B:步驟</p>
        <p type="p">308C:步驟</p>
        <p type="p">308D:步驟</p>
        <p type="p">310:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1633" publication-number="202624526">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624526</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138337</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>低Ｋ介電阻障膜的氫添加</chinese-title>
        <english-title>HYDROGEN ADDITION TO LOW-K DIELECTRIC BARRIER FILMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C23C16/36</main-classification>
        <further-classification edition="200601120260302B">C23C16/40</further-classification>
        <further-classification edition="200601120260302B">C23C16/455</further-classification>
        <further-classification edition="200601120260302B">C23C16/50</further-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙　求景</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, KENT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　阿爾伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, ALBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝　波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郎　紀一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANG, CHI-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏　立群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIA, LI-QUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案揭露了一種形成具有阻障特性的低K介電層的方法。該方法包括在電漿輔助化學氣相沉積（PECVD）製程中添加氫（H&lt;sub&gt;2&lt;/sub&gt;）氣體來形成介電層。在PECVD製程中添加氫（H&lt;sub&gt;2&lt;/sub&gt;）可提供具有更高密度的低K阻障層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of forming a low-k dielectric layer with barrier properties is disclosed. The method includes forming a dielectric layer by plasma enhanced chemical vapor deposition (PECVD) with the addition of hydrogen (H&lt;sub&gt;2&lt;/sub&gt;) gas during the process. The addition of hydrogen (H&lt;sub&gt;2&lt;/sub&gt;) during the PECVD process provides a low-k barrier layer with increased density.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:基板</p>
        <p type="p">120:基板表面</p>
        <p type="p">130:低K介電阻障層/膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1634" publication-number="202625811">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625811</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138338</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>配線基板的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260309B">H10W20/42</main-classification>
        <further-classification edition="202601120260309B">H10W20/46</further-classification>
        <further-classification edition="202601120260309B">H10P50/60</further-classification>
        <further-classification edition="202601120260309B">H10P95/90</further-classification>
        <further-classification edition="200601120260309B">H01B3/38</further-classification>
        <further-classification edition="202501120260309B">H10D62/80</further-classification>
        <further-classification edition="200601120260309B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日產化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畑中真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATANAKA, TADASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種配線基板的製造方法，其包含：第一步驟，其對已形成晶種層之基板的前述晶種層上所形成之抗蝕膜進行曝光及顯影，在前述抗蝕膜的底部形成間隙部，在前述抗蝕膜的頂部形成孔部；第二步驟，其在前述第一步驟之後，進行電解電鍍，將金屬填充至前述間隙部及前述孔部，形成金屬圖案；第三步驟，其在前述第二步驟之後，去除前述抗蝕膜；以及第四步驟，其在前述第三步驟之後，去除前述晶種層，並且，前述孔部為在前述抗蝕膜的上表面具有開口之孔，前述孔部的下表面連接前述間隙部，在前述抗蝕膜的厚度方向的剖面亦即連通前述孔部及前述間隙部之剖面中，前述間隙部的寬度比前述孔部的寬度長。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板</p>
        <p type="p">6:絕緣膜</p>
        <p type="p">11a:貫通電極</p>
        <p type="p">11b:貫通電極</p>
        <p type="p">13a:基座部</p>
        <p type="p">13b:配線部</p>
        <p type="p">14a:柱部</p>
        <p type="p">14b:柱部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1635" publication-number="202624738">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624738</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138384</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於對至少一個晶棒段進行晶向固定的方法和裝置</chinese-title>
        <english-title>METHOD AND DEVICE FOR CRYSTALLOGRAPHICALLY ORIENTED FIXING OF AT LEAST ONE CRYSTAL ROD SECTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260302B">G01N23/20025</main-classification>
        <further-classification edition="201801120260302B">G01N23/20008</further-classification>
        <further-classification edition="201801120260302B">G01N23/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商世創電子材料公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILTRONIC AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑爾　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAUER, STEFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格馬赫　沃夫岡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GMACH, WOLFGANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克魯澤德　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KREUZEDER, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅斯卡　班尼迪克特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROESKA, BENEDIKT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施泰德　法比安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STADLER, FABIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳翠華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種取向固定裝置（100），其被設計為對至少一個晶棒段（1）提供特定晶向固定。通過取向固定裝置（100）的夾持裝置（102）實現目標對準狀態下的固定。本發明還關於一種通過取向固定裝置（100）對至少一個晶棒段進行晶向固定的方法，並且基於此，關於一種將至少一個晶棒段（1）分離成多個半導體材料晶圓的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to an orientation fixing device (100) designed to provide a specifically crystallographically oriented fixing of at least one crystal rod section (1). The fixing in a target alignment is effected by means of a clamping device (102) of the orientation fixing device (100). The invention further relates to a method of crystallographically oriented fixing of at least one crystal rod section by means of the orientation fixing device (100), and, on that basis, to a method of separating at least one crystal rod section (1) into a multitude of wafers of semiconductor material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:晶棒段</p>
        <p type="p">10:參考平面</p>
        <p type="p">100:固定裝置</p>
        <p type="p">101:放置裝置</p>
        <p type="p">101.1、101.2:放置單元</p>
        <p type="p">102:夾持裝置</p>
        <p type="p">102.1:夾持單元</p>
        <p type="p">103:控制裝置</p>
        <p type="p">104:調整螺絲</p>
        <p type="p">105:凹槽</p>
        <p type="p">200:安裝載具</p>
        <p type="p">200.1:接合平面</p>
        <p type="p">300:接合手段</p>
        <p type="p">400:輥輪單元</p>
        <p type="p">400.1、400.2:輥輪</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1636" publication-number="202625655">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625655</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138394</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>透明顯示設備</chinese-title>
        <english-title>TRANSPARENT DISPLAY APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251110B">H10K59/10</main-classification>
        <further-classification edition="202301120251110B">H10K59/32</further-classification>
        <further-classification edition="202301120251110B">H10K59/35</further-classification>
        <further-classification edition="202301120251110B">H10K59/38</further-classification>
        <further-classification edition="202301120251110B">H10K59/82</further-classification>
        <further-classification edition="202301120251110B">H10K50/805</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金東潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DONGYOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權多慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, DAHYE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高兌熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, TAEHEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種透明顯示設備包含：包含顯示區域的基板，顯示區域設置有透光區域及與透光區域相鄰且其中佈置有多個子像素之非透光區域；多個無機膜，設置於非透光區域中並具有階梯；以及平坦化層，覆蓋該些無機膜，其中平坦化層部分包含光路改變部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A transparent display apparatus according to one embodiment of the present disclosure comprises a substrate including a display area, each of which is provided with a transmissive area and a non-transmissive area adjacent to the transmissive area and having a plurality of subpixels arranged therein; a plurality of inorganic films provided in the non-transmissive area and having a step; and a planarization layer covering the plurality of inorganic films, wherein the planarization layer partially includes an light path changing portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:基板</p>
        <p type="p">111a:閘極絕緣層</p>
        <p type="p">112:薄膜電晶體</p>
        <p type="p">114:像素電極</p>
        <p type="p">114a:第一像素電極</p>
        <p type="p">114b:第二像素電極</p>
        <p type="p">115:堤岸</p>
        <p type="p">115a:第一堤岸</p>
        <p type="p">116:有機發光層</p>
        <p type="p">117:對置電極</p>
        <p type="p">118:封裝層</p>
        <p type="p">120:光路改變部分</p>
        <p type="p">T1:第一厚度</p>
        <p type="p">EA2:第二發光區域</p>
        <p type="p">BL:緩衝層</p>
        <p type="p">BM:黑色矩陣</p>
        <p type="p">EXL3:第三外部光</p>
        <p type="p">CF:彩色濾光片</p>
        <p type="p">CF3:紅色濾光片</p>
        <p type="p">EXL1:第一外部光</p>
        <p type="p">EXL2:第二外部光</p>
        <p type="p">NTA:非發光區域</p>
        <p type="p">SP4:紅色子像素/第四子像素</p>
        <p type="p">TA:透光區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1637" publication-number="202624503">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624503</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138427</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>超硬合金及使用該合金之工具基體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">C22C29/08</main-classification>
        <further-classification edition="200601120260304B">B23B27/14</further-classification>
        <further-classification edition="200601120260304B">B23B51/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱綜合材料硬質合金股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI MATERIALS HARDMETAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>知野広太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINO, KOTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松谷勇也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUTANI, YUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>市川洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ICHIKAWA, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種超硬合金，其含有Co、Ni之1種以上1.00~15.00質量%、(Cr質量%)/(Co質量%+Ni質量%)比為0.020~0.200，(V質量%)/(Co質量%+Ni質量%)比為0.080以下，(Cr質量%+V質量%)/(Co質量%+Ni質量%)比為0.020~0.200，且含有C 5.20~6.30質量%，剩餘部分係由W及不可避免的雜質所構成，  &lt;br/&gt;　　主硬質相其平均粒徑(d50：μm)為1.00μm以下，(Ti質量%)/(W質量%)×(主硬質相之平均粒徑(d50：μm))係數為0.00010~0.00110，  &lt;br/&gt;　　(Ti質量%)/((W質量%)×(主硬質相之平均粒徑粒徑[d50：μm]))為0.00010~0.0011，於48μm×64μm之長方形區域所存在的等效圓直徑為1μm以上之副硬質相之個數為2.0以下；及使用該超硬合金之工具基體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1638" publication-number="202624518">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624518</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138429</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於高階純化的裝置及系統以及相關方法</chinese-title>
        <english-title>DEVICES AND SYSTEMS FOR ADVANCED PURIFICATION AND RELATED METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C23C16/14</main-classification>
        <further-classification edition="200601120260302B">C01G25/04</further-classification>
        <further-classification edition="200601120260302B">C01G27/04</further-classification>
        <further-classification edition="200601120260302B">C01G23/02</further-classification>
        <further-classification edition="200601120260302B">B01D53/04</further-classification>
        <further-classification edition="200601120260302B">B01D53/68</further-classification>
        <further-classification edition="201001120260302B">H01M4/1315</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENTEGRIS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>懷特　羅柏茲　Ｌ　二世</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WRIGHT, ROBERT L. JR.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亨德森　盧卡斯　Ｂ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HENDERSON, LUCAS B.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>漢迪克斯　布萊恩　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HENDRIX, BRYAN C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾曼特　大衛　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ERMERT, DAVID M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉伯森　洛基　狄恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIPSON, ROCKY DEAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於前軀體材料之高階純化的裝置及系統以及相關方法。一種容器總成包括一容器。該容器經組態以含有一前軀體材料。該前軀體材料包括至少一種雜質。該容器總成包括一吸附劑介質。當蒸發該前軀體材料以獲得包括該至少一種雜質之一蒸發前軀體時，該吸附劑介質含於該容器中該蒸發前軀體之一流動路徑中之一位置。該吸附劑介質經組態以吸附該至少一種雜質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Devices and systems for the advanced purification of precursor material and related methods are provided. A vessel assembly comprises a vessel. The vessel is configured to contain a precursor material. The precursor material comprises at least one impurity. The vessel assembly comprises a sorbent medium. When the precursor material is vaporized to obtain a vaporized precursor comprising the at least one impurity, the sorbent medium is contained in the vessel in a location that is in a flow path of the vaporized precursor. The sorbent medium is configured to sorb the at least one impurity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:容器</p>
        <p type="p">102:托盤總成</p>
        <p type="p">104:內部體積</p>
        <p type="p">106:內壁表面</p>
        <p type="p">108:托盤</p>
        <p type="p">110:隔板</p>
        <p type="p">112:吸附劑介質</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1639" publication-number="202624477">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624477</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138479</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體處理液、被處理物的處理方法、電子元件之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C11D17/08</main-classification>
        <further-classification edition="200601120260302B">C11D3/04</further-classification>
        <further-classification edition="200601120260302B">C11D3/20</further-classification>
        <further-classification edition="200601120260302B">C11D3/28</further-classification>
        <further-classification edition="200601120260302B">C11D3/30</further-classification>
        <further-classification edition="200601120260302B">C11D3/34</further-classification>
        <further-classification edition="200601120260302B">C11D3/36</further-classification>
        <further-classification edition="200601120260302B">C11D3/37</further-classification>
        <further-classification edition="200601120260302B">C11D7/08</further-classification>
        <further-classification edition="200601120260302B">C11D7/26</further-classification>
        <further-classification edition="200601120260302B">C11D7/32</further-classification>
        <further-classification edition="200601120260302B">C11D7/34</further-classification>
        <further-classification edition="200601120260302B">C11D7/36</further-classification>
        <further-classification edition="202601120260302B">H10P52/40</further-classification>
        <further-classification edition="202601120260302B">H10P70/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>濱砂碧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMASUNA, AOI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上村哲也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMIMURA, TETSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種抑制鎢的溶解且WO&lt;sub&gt;3&lt;/sub&gt;/W的溶解選擇比（蝕刻速度比）大的半導體處理液。又，提供一種使用了上述半導體處理液之被處理物的處理方法及電子元件之製造方法。本發明的半導體處理液含有水、式（1）及式（2）中的任一個所表示之特定化合物及pH調節劑，pH為9以下。  &lt;br/&gt;&lt;img align="absmiddle" height="133px" width="523px" file="ed10028.JPG" alt="ed10028.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1640" publication-number="202624321">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624321</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138489</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性樹脂組成物、感光性元件、印刷配線板及印刷配線板之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">C08G59/08</main-classification>
        <further-classification edition="200601120260311B">C08F36/06</further-classification>
        <further-classification edition="200601120260311B">C08F20/18</further-classification>
        <further-classification edition="200601120260311B">C08F2/50</further-classification>
        <further-classification edition="200601120260311B">C08L63/10</further-classification>
        <further-classification edition="200601120260311B">G03F7/028</further-classification>
        <further-classification edition="200601120260311B">H05K3/28</further-classification>
        <further-classification edition="200601120260311B">C08F212/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部宏平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雪岡諒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUKIOKA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下直輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHITA, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之永久抗蝕劑用之感光性樹脂組成物含有酸改質含乙烯基樹脂、光聚合性化合物、光聚合起始劑及彈性體，前述彈性體含有酸酐改質聚丁二烯化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">
        </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1641" publication-number="202624323">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624323</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138495</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含經硫醇封端之環氧可固化聚合物及光潛性鹼之密封劑</chinese-title>
        <english-title>SEALANTS COMPRISING THIOL-TERMINATED, EPOXY-CURABLE POLYMERS AND PHOTO-LATENT BASES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08G59/18</main-classification>
        <further-classification edition="200601120260302B">C08L63/00</further-classification>
        <further-classification edition="200601120260302B">C08L81/02</further-classification>
        <further-classification edition="200601120260302B">C08K5/3462</further-classification>
        <further-classification edition="200601120260302B">C09D163/00</further-classification>
        <further-classification edition="200601120260302B">C09D181/02</further-classification>
        <further-classification edition="201801120260302B">C09D7/63</further-classification>
        <further-classification edition="200601120260302B">C09K3/10</further-classification>
        <further-classification edition="200601120260302B">B05D3/06</further-classification>
        <further-classification edition="200601120260302B">B05D5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商開麥妥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEMETALL GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧波夫雷　喬納斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEMPFLE, JONAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西佛斯　比約恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIEVERS, BJOERN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種密封劑系統，其包含至少一種包含選自由多硫化物、聚硫醚、聚醚及其共聚物組成之群之至少一種經硫醇封端之聚合物之基礎組分；及至少一種包含至少一種聚環氧化物之硬化劑組分，其中該基礎組分進一步包含至少一種具有通式(PCG)-(BG)&lt;sub&gt;n&lt;/sub&gt;之非離子光潛性鹼，其中PCG代表光可裂解基團；BG代表鹼基團；n係1或2；在裂解PCG及BG之間之鍵之後形成之該鹼係非離子鹼，且擁有≥ 10.0之共軛酸pK&lt;sub&gt;a&lt;/sub&gt;值；且該非離子光潛性鹼具有在300 nm至420 nm之範圍內用於裂解PCG及BG之間之該鍵之光活化波長。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a sealant system comprising at least one base component, comoprising at least one thiol-terminated polymer selected from the group consisting of polysulfides, polythioethers, polyethers and copolymers thereof; and at least one hardener component, comprising at least one polyepoxide, wherein the base component further comprises at least one non-ionic photo-latent base having the general formula (PCG)-(BG)&lt;sub&gt;n&lt;/sub&gt;, wherein PCG stands for a photocleavable group; BG stands for a base group; n is 1 or 2; the base formed after cleaving the bond between PCG and BG is a non-ionic base, and possesses a pK&lt;sub&gt;a&lt;/sub&gt; value of the conjugate acid of ≥ 10.0; and the non-ionic photo-latent base has a photoactivation wavelength for cleaving the bond between PCG and BG in the range of 300 nm to 420 nm.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1642" publication-number="202625242">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625242</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138503</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於陣列掃描的導航精度</chinese-title>
        <english-title>NAVIGATION ACCURACY FOR ARRAY SCANNING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">H01J37/28</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商應用材料以色列公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS ISRAEL LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛林伯格　歐斐爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GREENBERG, OFIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏梅　貝尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAMAY, BENNY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於導航精度的系統，該系統包括一個記憶單元和一個位置電路。記憶單元配置為儲存樣品的瓷磚的掃描電子顯微鏡（SEM）影像。這些瓷磚屬於展現至少一個微觀尺寸的結構元素的週期性陣列。這些瓷磚包括一個已知位置的參考瓷磚以及容易產生位置誤差的瓷磚。在每組相鄰瓷磚之間存在重疊區域。每個重疊區域包含結構元素之一者的重疊段。位置電路配置為根據相鄰瓷磚組的位置來確定瓷磚的位置。每組的位置基於（i）出現在該組的重疊段的製程變化，（ii）已知位置，以及（iii）該組的重疊段在該組的每個瓷磚內的存在來確定。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system for navigation accuracy, the system includes a memory unit and a location circuit. The memory unit is configured to store scanning electron microscope (SEM) images of tiles of a sample. The tiles belong to a periodic array of structural elements that exhibit at least one microscopic dimension. The tiles include a reference tile of a known location and location error prone tiles. There is an overlap region between each set of adjacent tiles. Each overlap region includes an overlap segment of one of the structural elements. The location circuit is configured to determine locations of the tiles based on locations of sets of adjacent tiles. The location of each set is determined based on (i) a process variation that appears in an overlap segment of the set, (ii) the known location, and (iii) a presence of the overlap segment of the set within each tile of the set.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:SEM</p>
        <p type="p">11:處理器</p>
        <p type="p">12:控制器</p>
        <p type="p">13:SEM光學系統</p>
        <p type="p">14:感測單元</p>
        <p type="p">15:SEM記憶單元</p>
        <p type="p">16:SEM通訊單元</p>
        <p type="p">20:系統</p>
        <p type="p">21:記憶單元</p>
        <p type="p">22:電路/單元</p>
        <p type="p">23:通訊單元</p>
        <p type="p">30:網路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1643" publication-number="202625877">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625877</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138511</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>內藏零件基板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260312B">H10W90/20</main-classification>
        <further-classification edition="202501120260312B">H10D30/66</further-classification>
        <further-classification edition="202601120260312B">H10D80/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商新唐科技日本股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION JAPAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋直樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本興輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, KOUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大河亮介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAWA, RYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種內藏零件基板(1)具備：互相平行的第1配線層(11)及第2配線層(21)、及密封於第1配線層(11)與第2配線層(21)之間且具備第1縱型MOS電晶體(60)的第1半導體裝置(40)及具備第2縱型MOS電晶體(60A)的第2半導體裝置(40A)，在內藏零件基板(1)的剖面視角下，依序積層有第1配線層(11)、第1半導體裝置(40)、第2半導體裝置(40A)、及第2配線層(21)，零件內藏零件基板(1)更具備：第1樹脂(31)，密封第1半導體裝置(40)；及第2樹脂(32)，密封第2半導體裝置(40A)，第1樹脂(31)與第2樹脂(32)是在第1樹脂(31)與第2樹脂(32)的界面為不連續。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:內藏零件基板</p>
        <p type="p">11:第1配線層</p>
        <p type="p">12:第1配線</p>
        <p type="p">13:第1源極通路</p>
        <p type="p">14,16,24,26:配線</p>
        <p type="p">15:第1汲極通路</p>
        <p type="p">17:第1閘極通路</p>
        <p type="p">21:第2配線層</p>
        <p type="p">22:第2配線</p>
        <p type="p">23:第2源極通路</p>
        <p type="p">25:第2汲極通路</p>
        <p type="p">27:第2閘極通路</p>
        <p type="p">31:第1樹脂</p>
        <p type="p">32:第2樹脂</p>
        <p type="p">40:第1半導體裝置</p>
        <p type="p">40A:第2半導體裝置</p>
        <p type="p">60:第1縱型MOS電晶體</p>
        <p type="p">60A:第2縱型MOS電晶體</p>
        <p type="p">110:第1主面</p>
        <p type="p">110A:第3主面</p>
        <p type="p">120:第2主面</p>
        <p type="p">120A:第4主面</p>
        <p type="p">160:元件重疊區域</p>
        <p type="p">161:活性區域重疊區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1644" publication-number="202624499">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624499</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138513</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>稀土族元素之回收方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C22B3/10</main-classification>
        <further-classification edition="200601120260302B">C22B3/26</further-classification>
        <further-classification edition="200601120260302B">C22B3/40</further-classification>
        <further-classification edition="200601120260302B">C22B7/04</further-classification>
        <further-classification edition="200601120260302B">C22B59/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本製鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小泉匠平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOIZUMI, SHOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>相本道宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIMOTO, MICHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辻典宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUJI, NORIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村尾玲子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAO, REIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明目的在於提供一種新穎稀土族元素之回收方法，其可分離鋼鐵爐渣所含稀土族元素Sc(鈧)與其他稀土族元素，並回收該等稀土族元素。&lt;br/&gt;  一種方法，係回收鋼鐵爐渣所含稀土族元素之方法，其包含以下步驟：&lt;br/&gt;  浸出步驟，係使鋼鐵爐渣接觸酸而獲得浸出液1；&lt;br/&gt;  溶劑萃取步驟1，係調整浸出液1之pH，並添加有機溶劑而分離成有機相1與水相並萃取；&lt;br/&gt;  逆萃取步驟1，係將從有機相1逆萃取出之水相作為回收液1進行分離並萃取；&lt;br/&gt;  析出步驟，係調整水相1之pH，使水相1中析出析出物；&lt;br/&gt;  固液分離步驟，係從水相1固液分離前述析出物，而獲得水相1’；&lt;br/&gt;  溶劑萃取步驟2，係調整水相1’之pH，並添加有機溶劑而分離成有機相2與水相2並萃取；及&lt;br/&gt;  逆萃取步驟2，係將從有機相2逆萃取出之水相作為回收液2進行分離並萃取。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1645" publication-number="202624350">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624350</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138516</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚醯亞胺樹脂、聚醯亞胺清漆、聚醯亞胺薄膜、及暫時固定材組成物</chinese-title>
        <english-title>POLYIMIDE RESIN, POLYIMIDE VARNISH, POLYIMIDE FILM, AND TEMPORARY FIXING MATERIAL COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">C08G73/10</main-classification>
        <further-classification edition="200601120260309B">C09D179/08</further-classification>
        <further-classification edition="200601120260309B">C09J179/08</further-classification>
        <further-classification edition="200601120260309B">C08J5/18</further-classification>
        <further-classification edition="202601120260309B">H10P72/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安福悠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YASUFUKU, HARUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石井健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHII, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安孫子洋平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABIKO, YOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米浜伸一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONEHAMA, SHINICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林郁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供具有低彈性模量，且兼顧低玻璃轉移溫度及耐熱性，耐藥品性優良，於室溫溶解於比NMP等更安全的溶劑之聚醯亞胺樹脂、聚醯亞胺薄膜、含有前述聚醯亞胺樹脂的聚醯亞胺清漆及含有前述聚醯亞胺樹脂的暫時固定材組成物。  &lt;br/&gt;本發明為一種聚醯亞胺樹脂，具有來自四羧酸二酐之構成單元A及來自二胺之構成單元B，構成單元A包含來自選自於由下式(a1)表示之化合物及下式(a2)表示之化合物構成之群組中之1種以上之構成單元(A1’)，  &lt;br/&gt;&lt;img align="absmiddle" height="122px" width="343px" file="ed10015.JPG" alt="ed10015.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;構成單元B包含來自下式(B1)表示之化合物之構成單元(B1’)。  &lt;br/&gt;&lt;img align="absmiddle" height="96px" width="290px" file="ed10016.JPG" alt="ed10016.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;式(B1)中，X&lt;sup&gt;1&lt;/sup&gt;分別獨立地為碳數1~7之2價烴基、-O-、-S-、-SO&lt;sub&gt;2&lt;/sub&gt;-或-CO-，n為4~10之整數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a polyimide resin having a low elastic modulus, combining a low glass transition temperature with heat resistance, exhibiting excellent chemical resistance, and being soluble at room temperature in a solvent safer than NMP or the like; a polyimide film; a polyimide varnish containing the polyimide resin; and a temporary fixing material composition containing the polyimide resin. &lt;br/&gt;The polyimide resin comprises a structural unit (A) derived from a tetracarboxylic dianhydride and a structural unit (B) derived from a diamine, wherein the structural unit (A) includes a structural unit (A1’) derived from one or more compounds selected from the group consisting of a compound represented by formula (a1) and a compound represented by formula (a2) below, and the structural unit (B) includes a structural unit (B1’) derived from a compound represented by formula (B1) below: &lt;br/&gt;&lt;img align="absmiddle" height="201px" width="343px" file="ed10017.JPG" alt="ed10017.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;In formula (B1), each X&lt;sup&gt;1&lt;/sup&gt; independently represents a divalent hydrocarbon group having 1 to 7 carbon atoms, -O-, -S-, -SO₂-, or -CO-, and n is an integer of 4 to 10.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1646" publication-number="202625507">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625507</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138522</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於電漿診斷的共振器探針</chinese-title>
        <english-title>RESONATOR PROBE FOR PLASMA DIAGNOSTICS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260315B">H05H1/46</main-classification>
        <further-classification edition="200601120260315B">H01J37/32</further-classification>
        <further-classification edition="200601120260315B">H01P7/08</further-classification>
        <further-classification edition="200601120260315B">G01R27/26</further-classification>
        <further-classification edition="200601120260315B">G01K11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彼德森　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PETERSON, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　勁文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, KELVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布伊揚　沙里夫伊斯蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHUIYAN, SHARIFUL ISLAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BD</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肖煜華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIAO, YUHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普提　拉傑許庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PUTTI, RAJESH KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦尼　蘇巴翰奇瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANI, SHUBHAM KIRAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">實施例包括一種電漿處理設備，該電漿處理設備包括具有內部腔室壁的腔室。工作件支撐位於內部腔室壁內，該工作件支撐用於在腔室的處理區域中支撐工作件。共振器探針與內部腔室壁耦合。共振器探針包括暴露的共振器和埋藏的共振器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments include a plasma processing apparatus including a chamber with an inner chamber wall. A workpiece support is within the inner chamber wall, the workpiece support for supporting a workpiece in a processing region of the chamber. A resonator probe is coupled to the inner chamber wall. The resonator probe includes an exposed resonator and a buried resonator.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:電漿處理設備</p>
        <p type="p">302:腔室</p>
        <p type="p">304:工作件支撐</p>
        <p type="p">306:工作件</p>
        <p type="p">308:共振器探針</p>
        <p type="p">308A:探針尖端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1647" publication-number="202624043">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624043</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138542</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>兒童汽車座椅之可移動底座</chinese-title>
        <english-title>MOVABLE BASE FOR CHILD CAR SEAT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">B60N2/28</main-classification>
        <further-classification edition="200601120260311B">B60N2/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塞繆爾　吉爾哈特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMUEL, GEARHART</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茱莉亞　彭澤克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JULIA, PONZEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>派崔克Ｊ　Ｇ鮑爾斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATRICK J, G,BOWERS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科林Ｆ　埃格特　克羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COLIN F, EGGERT-CROWE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯蒂斯Ｍ　哈滕斯坦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CURTIS M, HARTENSTINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾立克斯　麥爾斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALEX, MYERS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於一車輛中之兒童座椅系統包含可安裝至一車輛座椅之一支撐底座。該支撐底座包含一第一底座部分及一第二底座部分。該第一底座部分可相對於該第二底座部分移動。一兒童座椅可以可拆卸方式連接至該第一底座部分。一後傾腳可相對於該支撐底座在包含複數個延伸位置之複數個位置之間移動，以調整該兒童座椅相對於該車輛座椅之一傾斜角度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A child seat system for use in a vehicle includes a support base mountable to a vehicle seat. The support base includes a first base portion and a second base portion. The first base portion is movable relative to the second base portion. A child seat is removably connectable to the first base portion. A recline foot is movable relative to the support base between a plurality of positions including a plurality of extended positions to adjust an angle of incline of the child seat relative to the vehicle seat.</p>
      </isu-abst>
      <representative-img>
        <p type="p">22:兒童座椅系統20之支撐底座</p>
        <p type="p">30:兒童座椅系統20之底座座椅部分</p>
        <p type="p">32:底座靠背部分</p>
        <p type="p">60:支撐底座22之第一底座部分</p>
        <p type="p">62:支撐底座22之第二底座部分</p>
        <p type="p">74:第二底座部分62之前端</p>
        <p type="p">76:第二底座部分62之後端</p>
        <p type="p">80:旋轉鎖定件</p>
        <p type="p">82a:鎖定構件/第一鎖定構件</p>
        <p type="p">84a:開口/第一開口</p>
        <p type="p">86:開口</p>
        <p type="p">88:旋轉鎖定件80之旋轉樞軸</p>
        <p type="p">90a:第一偏置構件</p>
        <p type="p">90b:第二偏置構件</p>
        <p type="p">100a:轉動致動器/第一轉動致動器</p>
        <p type="p">100b:轉動致動器/第二轉動致動器</p>
        <p type="p">102a:第一軸/軸</p>
        <p type="p">170:座椅保持總成</p>
        <p type="p">172a:容納組件/第一容納組件</p>
        <p type="p">172b:容納組件/第二容納組件</p>
        <p type="p">180:釋放致動器</p>
        <p type="p">182b:致動機構/第二致動機構</p>
        <p type="p">258:唇緣</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1648" publication-number="202624749">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624749</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138544</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電極及用於製備電極之方法</chinese-title>
        <english-title>ELECTRODE AND METHOD FOR MAKING AN ELECTRODE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">G01N33/66</main-classification>
        <further-classification edition="200601120260304B">G01N33/49</further-classification>
        <further-classification edition="200601120260304B">A61B5/1468</further-classification>
        <further-classification edition="200601120260304B">C23C14/34</further-classification>
        <further-classification edition="200601120260304B">G01N27/327</further-classification>
        <further-classification edition="200601120260304B">C01B23/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商聖高拜塑膠製品公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉世偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, SHIWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧羅茲科梁　薩布麗娜Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OROZCO, SABRINA D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>模　約翰Ｖ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VO, JOHN V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>摩爾科基　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOERKERKE, ROBRECHT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉維錢德蘭　塞圖馬達文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAVICHANDRAN, SETHUMADHAVAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>珍　托馬斯　馮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEAN-THOMAS, FONNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范登伯格　昆汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN DEN BERGHE, QUINTEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種電化學生物感測器電極，其包括基材；相鄰於該基材之基底層，該基底層包括惰性非貴金屬；及相鄰於該基底層之頂層，該頂層包括貴金屬，其中該頂層具有不大於15奈米(nm)之厚度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrochemical biosensor electrode includes a substrate; a base layer adjacent to the substrate, the base layer including an inert, non-noble metal; and a top layer adjacent to the base layer, the top layer including a noble metal, wherein the top layer has a thickness of not greater than 15 nanometers (nm).</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電極</p>
        <p type="p">20:基材</p>
        <p type="p">22:表面</p>
        <p type="p">30:基底層</p>
        <p type="p">35:中間層</p>
        <p type="p">40:頂層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1649" publication-number="202624449">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624449</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138557</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磨粒、漿料、研磨方法、零件之製造方法及半導體零件之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">C09K3/14</main-classification>
        <further-classification edition="200601120260311B">C07F17/00</further-classification>
        <further-classification edition="200601120260311B">C08K3/22</further-classification>
        <further-classification edition="201201120260311B">B24B37/00</further-classification>
        <further-classification edition="202601120260311B">H10P52/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木快</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">第1實施形態之磨粒包含鈰系粒子，前述鈰系粒子經以具有選自由二級胺基及三級胺基組成的組中之至少一種之矽烷化合物進行表面處理。第2實施形態之磨粒包含鈰系粒子，前述鈰系粒子經以具有雜環之矽烷化合物進行表面處理。一實施形態之漿料含有前述磨粒。一實施形態之研磨方法包括使用前述漿料對被研磨構件進行研磨之步驟。一實施形態之零件之製造方法包括使用藉由前述研磨方法進行了研磨之被研磨構件來獲得零件之步驟。一實施形態之半導體零件之製造方法包括使用藉由前述研磨方法進行了研磨之被研磨構件來獲得半導體零件之步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1650" publication-number="202623885">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623885</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138595</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>中空絲膜元件之製造方法、中空絲膜元件、及中空絲膜模組</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260310B">B01D63/02</main-classification>
        <further-classification edition="200601120260310B">B01D19/00</further-classification>
        <further-classification edition="200601120260310B">B01D69/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＤＩＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小野寺宥哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONODERA, YUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, WATARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村敏樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, TOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於降低液體之壓力損失。  &lt;br/&gt;本發明之中空絲膜元件之製造方法具備：  &lt;br/&gt;膜束形成步驟：形成複數個中空絲膜122呈圓筒狀束集而成之中空絲膜束123；  &lt;br/&gt;第一固定步驟：利用樹脂將為中空絲膜束之一端部之第一膜束端部123a固定；及  &lt;br/&gt;第二固定步驟：利用樹脂將為中空絲膜束123之另一端部之第二膜束端部123b固定。  &lt;br/&gt;於第一固定步驟中，向筒狀容器101插入第一膜束端部123a，並向筒狀容器101注入樹脂，一面對筒狀容器101進行冷卻一面使樹脂硬化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">101:筒狀容器</p>
        <p type="p">102:凸座</p>
        <p type="p">121:液體流通管</p>
        <p type="p">122:中空絲膜</p>
        <p type="p">123:中空絲膜束</p>
        <p type="p">123a:第一膜束端部</p>
        <p type="p">123b:第二膜束端部</p>
        <p type="p">124:第一固定部</p>
        <p type="p">D:延伸方向</p>
        <p type="p">D1:第一延伸方向</p>
        <p type="p">D2:第二延伸方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1651" publication-number="202624607">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624607</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138597</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>波浪發電效率增益系統</chinese-title>
        <english-title>WEC EFFICIENCY IMPROVEMENT SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251121B">F03B13/14</main-classification>
        <further-classification edition="200601120251121B">F03B13/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃子鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TZU-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾揚棋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, YANG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宏銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUNG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王柏翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, BO-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種波浪發電效率增益系統包含基台、擺臂、能量轉換裝置及浮體。擺臂繞第一軸線樞接基台，並具有遠離第一軸線的第一端及第二端。能量轉換裝置連接第一端與基台。浮體包含空心殼體、擺盪裝置、固定裝置、量測裝置及處理器。空心殼體連接第二端並具有容置空間。擺盪裝置位於容置空間。擺盪裝置包含擺動件及配重件。擺動件繞第二軸線樞接空心殼體，第二軸線平行於第一軸線。配重件連接擺動件並遠離第二軸線。固定裝置設置於空心殼體並連接擺動件。量測裝置位於容置空間並設置於空心殼體。處理器訊號連接量測裝置與固定裝置，並控制固定裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A WEC efficiency improvement system includes a platform, a swing arm, an energy conversion device and a floating structure. The swing arm connects the platform about a first axis and has a first end and a second end. The energy conversion device connects the first end and the platform. The floating structure includes a hollow housing, an oscillating device, a fixing device, a measuring device and a processor. The hollow housing connects the second end and has a space. The oscillating device is in the space. The oscillating device includes an oscillating piece and a counterweight connected with the oscillating piece. The oscillating piece connects the hollow housing about a second axis parallel with the first axis. The fixing device connects the oscillating piece. The measuring device is in the space. The processor signally connects with the measuring device and the fixing device, and controls the fixing device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">120:擺臂</p>
        <p type="p">120b:第二端</p>
        <p type="p">1211:延伸段</p>
        <p type="p">122:第一支撐件</p>
        <p type="p">140:浮體</p>
        <p type="p">141:空心殼體</p>
        <p type="p">142:擺盪裝置</p>
        <p type="p">1421:配重件</p>
        <p type="p">1422:擺動件</p>
        <p type="p">143:固定裝置</p>
        <p type="p">144:量測裝置</p>
        <p type="p">145:處理器</p>
        <p type="p">X2:第二軸線</p>
        <p type="p">SP:容置空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1652" publication-number="202623939">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623939</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138601</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>工作台裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">B23Q1/44</main-classification>
        <further-classification edition="200601120251201B">B23Q1/48</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本東晟股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON THOMPSON CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡村大壽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMURA, DAIJYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂井哲也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAI, TETSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種工作台裝置包括：基座部、第1線性運動機構、移動部、驅動部、第2線性運動機構、第2線性運動機構和工作台部。驅動部包括：沿著第1方向延伸的螺桿軸和安裝在螺桿軸上並隨著螺桿軸旋轉而沿第1方向移動的螺帽。移動部具有沿第1方向從第1表面延伸至第2表面的軸通孔，並讓螺桿軸的一部分穿過。用於旋轉螺桿軸的機構可安裝在螺桿軸的一端部側。第1表面配置於與螺桿軸一端部側相反側的另一端部側。螺帽安裝在靠近螺桿軸另一端部的第1表面上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10a:工作台裝置</p>
        <p type="p">11a:基座部</p>
        <p type="p">12a:基座板</p>
        <p type="p">13a:支架(工作台裝置用支架)</p>
        <p type="p">14a:第1基座面</p>
        <p type="p">15a:第1底面</p>
        <p type="p">16a:第1側面</p>
        <p type="p">17a:第2側面</p>
        <p type="p">18a:第3側面</p>
        <p type="p">19a:第4側面</p>
        <p type="p">22a:第2基座面</p>
        <p type="p">23a,23b:第3基座面</p>
        <p type="p">24a:第4基座面</p>
        <p type="p">26a:第2底面</p>
        <p type="p">27a,27b:凹槽</p>
        <p type="p">29a:蓋體</p>
        <p type="p">31a,31b:第1直線運動機構</p>
        <p type="p">32a,32b:第1導軌</p>
        <p type="p">33a,33b:第1滑塊</p>
        <p type="p">34a,34b:第2直線運動機構</p>
        <p type="p">35a,35b:第2導軌</p>
        <p type="p">36a,36b:第2滑塊</p>
        <p type="p">38a,38b:第3導軌</p>
        <p type="p">40a:移動部</p>
        <p type="p">41a:第1安裝面</p>
        <p type="p">42a:第1表面</p>
        <p type="p">43a:第2表面</p>
        <p type="p">44a:第1傾斜面</p>
        <p type="p">45a:軸通孔</p>
        <p type="p">50a:驅動部</p>
        <p type="p">51a:螺桿軸</p>
        <p type="p">52a:螺帽</p>
        <p type="p">53a:馬達</p>
        <p type="p">54a:附件</p>
        <p type="p">60a:工作台部</p>
        <p type="p">61a:第1部分</p>
        <p type="p">62a:第2部分</p>
        <p type="p">63a:工作台面</p>
        <p type="p">64a:第2傾斜面</p>
        <p type="p">65a:第2安裝面</p>
        <p type="p">66a:第3安裝面</p>
        <p type="p">67a:第4安裝面</p>
        <p type="p">70a:感測器部</p>
        <p type="p">71a:第1檢測部</p>
        <p type="p">72a:第2檢測部</p>
        <p type="p">73a:第1板部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1653" publication-number="202623873">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623873</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138621</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於純化丙酮之系統</chinese-title>
        <english-title>SYSTEMS FOR PURIFYING ACETONE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">B01D3/14</main-classification>
        <further-classification edition="200601120260302B">B01D3/32</further-classification>
        <further-classification edition="200601120260302B">B01J19/00</further-classification>
        <further-classification edition="200601120260302B">C07C45/80</further-classification>
        <further-classification edition="200601120260302B">C07C45/82</further-classification>
        <further-classification edition="200601120260302B">C07C49/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商泰洛格布朗鹿特有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KELLOGG BROWN &amp; ROOT LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　艾瑞克　溫　塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, ERIC WING-TAK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳　特　帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VU, TRUC VAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於自一第一進料流及一第二進料流純化丙酮之系統及方法。該系統可包括用於接收該第一進料流之一第一蒸餾塔。一第二蒸餾塔可與該第一蒸餾塔流體連通。該第二蒸餾塔可包括用於用鹼處理該第二蒸餾塔之內容物的一鹼入口，且輸出經純化丙酮。一第三蒸餾塔可與該第二蒸餾塔流體連通。一鹼處理容器可與該第二蒸餾塔流體連通且提供一鹼處理。該第一蒸餾塔可與該第二進料流直接流體連通，該第二蒸餾塔可與該第二進料流流體連通，及/或該鹼處理容器可在該鹼入口與該第二進料流之間流體連通。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and method for purifying acetone from a first feed stream and a second feed stream. The system may include a first distillation column for receiving the first feed stream. A second distillation column may be in fluid communication with the first distillation column. The second distillation column may include a caustic inlet to treat contents of the second distillation column with caustic, and outputs purified acetone. A third distillation column may be in a fluid communication with the second distillation column. A caustic treatment vessel may be in fluid communication with the second distillation column and provides a caustic treatment. The first distillation column can be in direct fluid communication with the second feed stream, the second distillation column can be in fluid communication with the second feed stream, and/or the caustic treatment vessel can be in fluid communication between the caustic inlet and the second feed stream.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100A:丙酮純化系統</p>
        <p type="p">108:第一進料流</p>
        <p type="p">109:第二進料流</p>
        <p type="p">110:第一蒸餾塔</p>
        <p type="p">112:第一進料流入口</p>
        <p type="p">114:第一蒸餾塔頂部出口</p>
        <p type="p">116:第一蒸餾塔底部出口</p>
        <p type="p">120:第二蒸餾塔</p>
        <p type="p">121:第二蒸餾塔丙酮富集入口</p>
        <p type="p">122:鹼入口</p>
        <p type="p">123:丙酮產物出口</p>
        <p type="p">124:側取出口</p>
        <p type="p">125:不純丙酮出口</p>
        <p type="p">126:第二蒸餾塔頂部輕物質出口</p>
        <p type="p">127:第二蒸餾塔底部出口</p>
        <p type="p">128:第二蒸餾塔輔助入口</p>
        <p type="p">130:第三蒸餾塔</p>
        <p type="p">132:第三蒸餾塔入口</p>
        <p type="p">134:第三蒸餾塔頂部輕物質出口</p>
        <p type="p">136:第三蒸餾塔底部出口</p>
        <p type="p">140:鹼處理容器</p>
        <p type="p">150:鹼</p>
        <p type="p">160:丙酮富集流出物</p>
        <p type="p">162:粗物質流</p>
        <p type="p">164:底部出口流體</p>
        <p type="p">166:經鹼處理之流體</p>
        <p type="p">170:苯酚富集流出物</p>
        <p type="p">172:低沸點雜質</p>
        <p type="p">174:經純化丙酮流</p>
        <p type="p">176:不純丙酮排出流/不純丙酮流</p>
        <p type="p">178:低沸點雜質</p>
        <p type="p">179:苯酚鈉</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1654" publication-number="202623882">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623882</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138644</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>直接水界面滲濾(PERCOLATION)歧管及其相關方法</chinese-title>
        <english-title>DIRECT WATER INTERFACE PERCOLATION MANIFOLDS AND METHODS PERTAINING THERETO</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">B01D61/02</main-classification>
        <further-classification edition="200601120260306B">B01D11/02</further-classification>
        <further-classification edition="200601120260306B">A47J31/043</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商酷帕客濾公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COLD PERCOLATION, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格林　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GREEN, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安德森　蘭德爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANDERSON, RANDALL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史考特　傑佛瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCOTT, JEFFREY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克爾林　衛斯理</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KERLIN, WESLEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於直接水界面滲濾植物物質之系統，其包含主體、水合界面歧管及貯存器。一些系統包含分散歧管。該水合界面歧管或該分散歧管與該植物物質接觸。該主體包含與入口部分相對之出口部分及位於該等入口與出口部分之間之主軸。該主體包含位於該等入口與出口部分之間之該植物物質之沖泡室。該水合界面歧管靠近該入口部分並至少部分地位於該主體內，該水合界面歧管包含穿孔出口。該貯存器靠近該水合界面歧管並與其流體連通，該貯存器具有複數個孔口。該分散歧管(若存在)定位於該主體內，該分散歧管可沿該主軸移動以與該植物物質共用邊界。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system for direct water interface percolation of botanical substances includes a body, a hydration interface manifold, and a reservoir. Some systems include a dispersion manifold. Either the hydration interface manifold or the dispersion manifold contacts the botanical substance. The body includes an exit portion opposite an inlet portion and a major axis between the inlet and exit portions. The body includes a brew chamber between the inlet and exit portions for the botanical substance. The hydration interface manifold is proximal to the inlet portion and at least partially within the body, the hydration interface manifold includes a perforated exit. The reservoir is proximal to, and in fluid communication with, the hydration interface manifold, the reservoir having a plurality of apertures. The dispersion manifold, if present, is positioned within the body, the dispersion manifold is movable along the major axis to share the boundary with the botanical substance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:主體</p>
        <p type="p">4:水合界面歧管</p>
        <p type="p">6:入口部分</p>
        <p type="p">8:出口部分</p>
        <p type="p">10:主軸</p>
        <p type="p">12:沖泡室</p>
        <p type="p">14:出口部分</p>
        <p type="p">16:貯存器</p>
        <p type="p">18:提取液</p>
        <p type="p">100:系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1655" publication-number="202624878">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624878</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138645</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於硬遮罩開口和降低線寬粗糙度的定向斜角蝕刻的方法、用於最小化沿著多個圖案化特徵存在的表面缺陷的方法及半導體處理裝置</chinese-title>
        <english-title>METHOD FOR DIRECTIONAL ANGLED ETCHING FOR HARDMASK OPENING AND LWR REDUCTION, METHOD FOR MINIZING SURFACE DEFECTS PRESENT ALONG PATTERNING FEATURES AND SEMICONDUCTOR PROCESSING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260306B">G03F1/22</main-classification>
        <further-classification edition="200601120260306B">G03F7/20</further-classification>
        <further-classification edition="202601120260306B">H10P30/22</further-classification>
        <further-classification edition="202601120260306B">H10P50/20</further-classification>
        <further-classification edition="202001320260306B">G06F115/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許　振志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHEN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　永振</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUNG-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁　樹榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, SHURONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舍曼　絲特芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHERMAN, STEVEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭露用於定向傾斜蝕刻以形成硬遮罩開口並減少圖案化線路的線寬粗糙度（line-width-roughness，LWR）的方法。在此方法中，可包括在層堆疊上形成多個光罩線路，其中多個光罩線路中的每一個包括第一側壁和第二側壁，並且其中表面缺陷存在於第一側壁或第二側壁上。方法可更包括藉由以相對於由多個光罩線路的上表面所定義的平面的垂直線的非零角度將反應性電漿束傳送到多個光罩線路來移除表面缺陷。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are approaches for directional angled etching to form hardmask openings and to reduce line-width-roughness (LWR) of patterning lines. In one approach, a method may include forming a plurality of mask lines over a stack of layers, wherein each of the plurality of mask lines includes a first sidewall and a second sidewall, and wherein a surface defect is present along the first sidewall or the second sidewall. The method may further include removing the surface defect by delivering a reactive plasma beam to the plurality of mask lines at a non-zero angle relative to a perpendicular to a plane defined by an upper surface of the plurality of mask lines.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置/裝置</p>
        <p type="p">103:層堆疊</p>
        <p type="p">104:線路</p>
        <p type="p">105、116:上表面</p>
        <p type="p">106:第一底層</p>
        <p type="p">108:薄膜層</p>
        <p type="p">110:第二底層</p>
        <p type="p">112:第一側壁</p>
        <p type="p">114:第二側壁</p>
        <p type="p">120:溝槽</p>
        <p type="p">TW:溝槽寬度</p>
        <p type="p">X、Y、Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1656" publication-number="202623877">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623877</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138657</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於投入油水分離槽或原水槽之裝置的水面追隨用滑塊機構</chinese-title>
        <english-title>WATER SURFACE-FOLLOWING SLIDER MECHANISM FOR USE IN DEVICES INTRODUCED INTO OIL/WATER SEPARATION TANKS OR RAW WATER TANKS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">B01D21/24</main-classification>
        <further-classification edition="200601120260303B">B01D17/02</further-classification>
        <further-classification edition="200601120260303B">B01D36/00</further-classification>
        <further-classification edition="202301120260303B">C02F1/40</further-classification>
        <further-classification edition="200601320260303B">C02F103/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＢＭ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TBM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐原邦宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAHARA, KUNIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫大龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種即時回收積存於大型且水面變動幅度大之油水分離槽及原水槽的浮油時，浮油回收裝置等之各裝置仍可確實追隨水面變動的水面追隨用滑塊機構。用於投入油水分離槽之裝置的水面追隨用滑塊機構包含：一端與浮油回收裝置之吸引泵浦連結，並在水平方向延伸的第一桿；與第一桿之另一端連結，並在垂直方向延伸之第二桿；沿著油水分離槽之內壁配置，藉由第二桿插通可沿著上下方向平滑地收容第二桿之筒狀體；及連接至第一桿及第二桿，並固定在油水分離槽之水面漂浮的浮板之浮板固定具。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Even when recovering floating oil accumulated in large oil/water separation tanks or raw water tanks with significant water surface fluctuation ranges, a water surface-following slider mechanism, which enables devices such as a floating oil collecting device to reliably follow water surface fluctuations, is provided.&lt;br/&gt;The water surface-following slider mechanism 6 for use with a device introduced into an oil/water separation tank T comprises: a first bar 6a extending horizontally, one end of which is connected to a suction pump 8 of the floating oil collecting device 1; a second bar 6b extending vertically, connected to the other end of the first bar 6a; a tubular body 6c arranged along the inner wall of the oil/water separation tank T, wherein the tubular body 6c accommodates the second bar 6b so that it can slide vertically by being inserted through the tubular body 6c; and a float plate fixing member 70 connected to the first bar 6a and the second bar 6b, wherein the float plate fixing member 70 fixes a float plate 7 floating on the water surface of the oil/water separation tank T.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:浮油回收裝置</p>
        <p type="p">2:渦流回收杯</p>
        <p type="p">3:第一配管</p>
        <p type="p">4:第二配管</p>
        <p type="p">4a:L字形管</p>
        <p type="p">5a:L字形配管</p>
        <p type="p">6:水面追隨用滑塊機構</p>
        <p type="p">6a:第一桿</p>
        <p type="p">6b:第二桿</p>
        <p type="p">6c:筒狀體</p>
        <p type="p">6d:卡住構件</p>
        <p type="p">6da:下邊</p>
        <p type="p">6db:上邊</p>
        <p type="p">6e:雙頭螺拴</p>
        <p type="p">7:浮板</p>
        <p type="p">8:吸引泵浦</p>
        <p type="p">24:管道耐油軟管</p>
        <p type="p">70:浮板固定具</p>
        <p type="p">71:浮板支撐用桿</p>
        <p type="p">72:浮板支撐面</p>
        <p type="p">T:油水分離槽</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1657" publication-number="202625172">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625172</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138708</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>神經網路中類比記憶體胞元的溫度補償</chinese-title>
        <english-title>TEMPERATURE COMPENSATION FOR ANALOG MEMORY CELLS IN A NEURAL NETWORK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">G11C7/04</main-classification>
        <further-classification edition="200601120260313B">G11C16/28</further-classification>
        <further-classification edition="202301120260313B">G06N3/063</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商超捷公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICON STORAGE TECHNOLOGY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武　華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VU, HOA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪　史丹利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, STANLEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　曉萬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRAN, HIEU VAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武　順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VU, THUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRINH, STEPHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一個實施例中，一種方法包含：回應於非揮發記憶體胞元的一陣列之操作溫度的一變化而判定一偏壓電壓，記憶體胞元的該陣列中之該非揮發記憶體胞元中之各者包含一控制閘極端子及一抹除閘極端子；及在讀取記憶體胞元的該陣列中之一所選記憶體胞元的同時，將該偏壓電壓施加至該所選記憶體胞元的一控制閘極端子及一抹除閘極端子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In one example, a method comprises determining a bias voltage in response to a change in operating temperature of an array of non-volatile memory cells, each of the non-volatile memory cells in the array of memory cells comprising a control gate terminal and an erase gate terminal; and applying the bias voltage to a control gate terminal and an erase gate terminal of a selected memory cell in the array of memory cells while reading the selected memory cell.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1300:CG-EG偏壓產生電路</p>
        <p type="p">1301:電流數位至類比轉換器</p>
        <p type="p">1302:運算放大器</p>
        <p type="p">1303:參考記憶體胞元</p>
        <p type="p">1304:CG-EG偏壓電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1658" publication-number="202625850">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625850</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138718</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>處理系統及處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260313B">H10W72/30</main-classification>
        <further-classification edition="200601120260313B">G05D23/19</further-classification>
        <further-classification edition="202601120260313B">H10W74/01</further-classification>
        <further-classification edition="202601120260313B">H10P72/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三根陽介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINE, YOUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於將複數裸晶效率良好地安裝於基板。  &lt;br/&gt;本發明之將複數裸晶安裝於基板的處理系統，包含：將裸晶載具所固持的該裸晶接合於該基板的複數接合裝置，及對複數該接合裝置供給氣體的氣體供給裝置；該氣體供給裝置係以共通於複數該接合裝置的方式設置，並包含調整至少該氣體之溫度的氣體調整部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:處理系統</p>
        <p type="p">110:搬運裝置</p>
        <p type="p">130A~130D:接合裝置</p>
        <p type="p">140:氣體供給裝置</p>
        <p type="p">400:氣體調整部</p>
        <p type="p">410:主線路</p>
        <p type="p">420A~420E:分支線路</p>
        <p type="p">421A~421E:分支線路調整部</p>
        <p type="p">422A~422E:分支線路測量部</p>
        <p type="p">440A~440E:內部溫度測量部</p>
        <p type="p">441:主線路溫度測量部</p>
        <p type="p">430:蓋體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1659" publication-number="202625017">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625017</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138720</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>神經網路中非揮發記憶體陣列的偏壓電路</chinese-title>
        <english-title>BIAS CIRCUIT FOR NON-VOLATILE MEMORY ARRAY IN A NEURAL NETWORK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260313B">G06N3/063</main-classification>
        <further-classification edition="200601120260313B">G11C11/54</further-classification>
        <further-classification edition="200601120260313B">G11C16/08</further-classification>
        <further-classification edition="200601120260313B">G11C7/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商超捷公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICON STORAGE TECHNOLOGY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武　華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VU, HOA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　曉萬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRAN, HIEU VAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武　順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VU, THUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪　史丹利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, STANLEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRINH, STEPHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一個實施例中，一種系統包含：一非揮發記憶體胞元陣列，按列及行配置，其中，各非揮發記憶體胞元包含一字元線端子及一位元線端子；以及，一列電路，用以接收一列位址及一偏壓電壓，且在該列位址對應於該陣列之與該列電路聯結之一列時輸出該偏壓電壓，其中，該偏壓電壓被提供至該陣列之與該列電路聯結之該列中的非揮發記憶體胞元之端子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In one example, a system comprises an array of non-volatile memory cells arranged in rows and columns, wherein each non-volatile memory cell comprises a word line terminal and a bit line terminal; and a row circuit to receive a row address and a bias voltage and to output the bias voltage when the row address corresponds to a row of the array associated with the row circuit, wherein the bias voltage is provided to terminals of non-volatile memory cells in the row of the array associated with the row circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">901:VMM陣列</p>
        <p type="p">1000:輸入區塊</p>
        <p type="p">1001-0、1001-1、1001-n:列電路</p>
        <p type="p">1002-0、1002-1、1002-n:位址解碼器</p>
        <p type="p">1003-0、1003-1、1003-n:列暫存器</p>
        <p type="p">1004-0、1004-1、1004-n:標籤位元</p>
        <p type="p">1005-0、1005-1、1005-n:選擇器</p>
        <p type="p">1006-0、1006-1、1006-n:緩衝器</p>
        <p type="p">1007:GDAC</p>
        <p type="p">1050:字元線偏壓(WL偏壓)</p>
        <p type="p">ADDR:位址</p>
        <p type="p">CG0、WL0、WL1、WLn:輸出</p>
        <p type="p">DIN-0:資料輸入</p>
        <p type="p">EN:啟用信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1660" publication-number="202625264">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625264</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138722</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光電陰極電流的測量</chinese-title>
        <english-title>MEASUREMENT OF A PHOTOCATHODE CURRENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">H01J43/30</main-classification>
        <further-classification edition="200601120260313B">G01J1/44</further-classification>
        <further-classification edition="200601120260313B">G01R19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商應用材料以色列公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS ISRAEL LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅斯特茲基　阿列克謝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MESTEZKY, ALEXEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於測量光電倍增管光電陰極電流的測量裝置，該測量裝置包括：（a）電壓放大器，該電壓放大器被配置用於放大與該光電陰極電流成比例的分流電阻電壓；（b）漏電容限電路，該漏電容限電路被配置用於基於第一放大電壓和絕對值超過與該測量裝置相關聯的漏電流的絕對值的第一參考電壓產生第一漏電容限電壓；（c）電壓到電流換能器，該電壓到電流換能器被配置用於將該第一漏電容限電壓轉換為第一漏電容限電流；及（d）輸出單位，該輸出單位被配置用於將該第一漏電容限電流轉換為指示該光電陰極電流的輸出電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A measurement device for measuring a photocathode current of a photomultiplier tube, the measurement device includes: (a) a voltage amplifier configured to amplify a shunt resistor voltage proportional to the photocathode current; (b) a leakage tolerant circuit configured to generate a first leakage tolerant voltage, based on a first amplified voltage and a first reference voltage having an absolute value that exceeds an absolute value of a leakage associated with the measurement device; (c) a voltage to current transducer that is configured to convert the first leakage tolerant voltage to a first leakage tolerant current; and (d) an output unit that is configured to convert the first leakage tolerant current to an output voltage that is indicative of the photocathode current.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:光電倍增管</p>
        <p type="p">11:光電陰極</p>
        <p type="p">12:陽極</p>
        <p type="p">13:倍增極</p>
        <p type="p">20:電阻網路</p>
        <p type="p">30:HV電源</p>
        <p type="p">43:第一放大電壓</p>
        <p type="p">45:第一參考電壓</p>
        <p type="p">46:第一漏電容限電壓</p>
        <p type="p">47:第一漏電容限電流</p>
        <p type="p">51:電壓放大器</p>
        <p type="p">52:漏電容限電路</p>
        <p type="p">53:加法器</p>
        <p type="p">54:第一參考電壓源</p>
        <p type="p">55:電壓到電流換能器</p>
        <p type="p">59:輸出電路</p>
        <p type="p">598:輸出單位</p>
        <p type="p">661:第一運算放大器輸入</p>
        <p type="p">662:第二運算放大器輸入</p>
        <p type="p">669:電晶體</p>
        <p type="p">900:測量裝置</p>
        <p type="p">Ipc 42:光電陰極電流</p>
        <p type="p">Rout 29:輸出電阻</p>
        <p type="p">Rpc 21:分流電阻</p>
        <p type="p">Vpc 41:分流電阻電壓</p>
        <p type="p">OP-AMP 660:運算放大器</p>
        <p type="p">R8 68:電阻</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1661" publication-number="202624884">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624884</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138727</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>前饋校正方法以及用於前饋校正之電腦程式</chinese-title>
        <english-title>METHOD OF FEED-FORWARD CORRECTION, AND COMPUTER PROGRAM FOR FEED-FORWARD CORRECTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260305B">G03F1/70</main-classification>
        <further-classification edition="201201120260305B">G03F1/22</further-classification>
        <further-classification edition="200601120260305B">G03F7/20</further-classification>
        <further-classification edition="202601120260305B">H10P76/00</further-classification>
        <further-classification edition="201801120260305B">G06F9/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝克斯　賈斯柏　皮埃爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BECKERS, JASPER PIERRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴約納　卡諾尼科　埃米利奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAJONERO CANONICO, EMILIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹森　瑞可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANSEN, RICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉德梅克　賈斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RADEMAKER, JUSTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種前饋校正方法，其包含：基於對一微影設備之一圖案化裝置之一變形參數的量測來判定前饋校正，該變形參數指示在由該微影設備對一第一系列基板中之一基板的曝光之前及之後的該圖案化裝置之變形，其中該等前饋校正將應用在由該微影設備對一第二系列基板中之一基板曝光的期間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of feed-forward correction comprising: determining feed-forward corrections based on measurements on a patterning device of a lithographic apparatus of a deformation parameter indicative of deformation of the patterning device before and after exposure by the lithographic apparatus of a substrate of a first series of substrates, wherein the feed-forward corrections are to be applied during exposure by the lithographic apparatus of a substrate of a second series of substrates.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:量測</p>
        <p type="p">20:箭頭</p>
        <p type="p">30:箭頭</p>
        <p type="p">100:時段</p>
        <p type="p">200:第二時段</p>
        <p type="p">210:第一系列</p>
        <p type="p">211:第一基板</p>
        <p type="p">212:第二基板</p>
        <p type="p">213:基板</p>
        <p type="p">220:系列</p>
        <p type="p">221:第一基板</p>
        <p type="p">300:第三時段</p>
        <p type="p">400:時段</p>
        <p type="p">410:第二系列</p>
        <p type="p">411:第一基板</p>
        <p type="p">412:第二基板</p>
        <p type="p">413:基板</p>
        <p type="p">420:系列</p>
        <p type="p">421:第一基板</p>
        <p type="p">500:第五時段</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1662" publication-number="202624497">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624497</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138730</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熔鋼之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">C21C7/00</main-classification>
        <further-classification edition="201901120260306B">G06N20/00</further-classification>
        <further-classification edition="202301120260306B">G06N3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商杰富意鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JFE STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溝端圭介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZOBATA, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大東祐汰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHIGASHI, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>根岸秀光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEGISHI, HIDEMITSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川畑涼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWABATA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明所提供的熔鋼之製造方法係在二次精煉步驟中可以比習知方法更高精度地控制熔鋼的成分濃度與溫度。  &lt;br/&gt;本發明的熔鋼之製造方法，係在二次精煉步驟中利用成分調整步驟與溫度調整步驟，以製造在目標之成分濃度之範圍內與目標之溫度之範圍內之熔鋼的熔鋼之製造方法，其使用溫度調整步驟的溫度操作量，以修正成分調整步驟的成分操作量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1663" publication-number="202624345">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624345</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138746</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>成形體及其製造方法、加飾薄膜、顯示裝置用薄膜、以及顯示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08G71/02</main-classification>
        <further-classification edition="201501120260302B">G02B1/14</further-classification>
        <further-classification edition="200601120260302B">G09F9/00</further-classification>
        <further-classification edition="200601120260302B">G09F9/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商可樂麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURARAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>笹野龍也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASANO, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋宏昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, HIROMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福原忠仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUHARA, TADAHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中原淳裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAHARA, ATSUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種成形體，其係包含聚脲之成形體，以廣角X射線散射測定前述成形體而得到之2θ為3～15(deg.)的範圍中之結晶峰的2θ半高寬為1.3(deg.)以上且小於3.5(deg.)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1664" publication-number="202623802">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623802</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138751</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療內皮素相關疾病之齊泊騰坦和達格列淨的組合</chinese-title>
        <english-title>COMBINATION OF ZIBOTENTAN AND DAPAGLIFLOZIN FOR THE TREATMENT OF ENDOTHELIN RELATED DISEASES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">A61K31/497</main-classification>
        <further-classification edition="200601120260304B">A61K31/7034</further-classification>
        <further-classification edition="200601120260304B">A61P13/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞典商阿斯特捷利康公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASTRAZENECA AB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛斯利　彼德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GREASLEY, PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾爾斯壯　克里斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHLSTROM, CHRISTINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯柯提克　斯坦科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SKRTIC, STANKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曼茲斯　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENZIES, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑納克　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNNAKER, MIKAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅希爾　安　克利斯汀娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERCIER, ANNE-KRISTINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露關於內皮素受體拮抗劑（ERA）齊泊騰坦與鈉依賴性葡萄糖協同載體蛋白2（SGLT-2）抑制劑達格列淨組合，用於在治療某些內皮素相關疾病中使用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to the endothelin receptor antagonist (ERA) zibotentan in combination with the sodium-dependent glucose cotransporter 2 (SGLT-2) inhibitor dapagliflozin for use in the treatment of certain endothelin related diseases.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1665" publication-number="202624843">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624843</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138752</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於減少、最小化、及／或消除由失焦光對對焦影像之干涉的眼用鏡片</chinese-title>
        <english-title>OPHTHALMIC LENSES FOR REDUCING, MINIMIZING, AND/OR ELIMINATING INTERFERENCE ON IN-FOCUS IMAGES BY OUT-OF-FOCUS LIGHT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">G02C7/02</main-classification>
        <further-classification edition="200601120260304B">G02C7/06</further-classification>
        <further-classification edition="200601120260304B">G02B3/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布萊恩荷登視覺協會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRIEN HOLDEN VISION INSTITUTE LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝克　亞瑟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BACK, ARTHUR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾斯范迪阿瑞佳赫洛米　哈珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ESFANDIARIJAHROMI, HASSAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種眼用鏡片，其包括：至少一個第一光學區帶，其具有一第一軸，該至少一個第一光學區帶經組態使得，在與一眼睛一起使用時，通過至少一個第一光學區帶之光之至少一部分被屈折至第一軸上之一第一焦點；及至少一個第二光學區帶，其經組態使得，在與眼睛一起使用時，通過至少一個第二光學區帶之光之至少一部分被屈折至一或多個焦點，該一或多個焦點相對於第一焦點而離軸定位且定位於不同於與第一焦點對應之一焦平面之至少一個焦平面上；其中該至少一個第二光學區帶經組態使得擴展超出一或多個焦點之光提供經擴展聚焦深度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An ophthalmic lens comprising: at least one first optical zone with a first axis, the at least one first optical zone being configured such that, in use with an eye, at least a portion of light passing through the at least one first optical zone is refracted to a first focal point on the first axis; and at least one second optical zone configured such that, in use with the eye, at least a portion of light passing through the at least one second optical zone is refracted to one or more focal points positioned off-axis relative to the first focal point and on at least one focal plane different than a focal plane corresponding to the first focal point; wherein the at least one second optical zone is configured such that the light extending beyond the one or more focal points provides extended depth of focus.</p>
      </isu-abst>
      <representative-img>
        <p type="p">DF1:焦點</p>
        <p type="p">DF2:焦點</p>
        <p type="p">DF3:焦點</p>
        <p type="p">OP1:物點/中心物點/遠距物點/遠距物體/近距物體/近距物點</p>
        <p type="p">OP2:點/物點/遠距物點/遠距物體/近距物體/近距物點</p>
        <p type="p">OP3:點/物點/遠距物點/遠距物體/近距物體/近距物點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1666" publication-number="202624516">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624516</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138753</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>控制磊晶生長含矽材料中的自摻雜</chinese-title>
        <english-title>CONTROLLING AUTO-DOPING IN EPITAXIALLY GROWN SILICON-CONTAINING MATERIALS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">C23C16/04</main-classification>
        <further-classification edition="200601120260304B">C23C16/42</further-classification>
        <further-classification edition="200601120260304B">H01J37/08</further-classification>
        <further-classification edition="202501120260304B">H10D30/00</further-classification>
        <further-classification edition="202501120260304B">H10D1/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫瑪　阿爾文德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, ARVIND</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴塔查里亞　阿卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHATTACHARYYA, ARKKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱　作明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, ZUOMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜貝　阿彼錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUBE, ABHISHEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">例示性的半導體處理方法可包括在位於半導體處理腔室之處理區域內的基板上所設置的第一源極/汲極材料上形成阻障層。第一源極/汲極材料可被摻雜物摻雜。方法可包括在阻障層上生長磊晶含矽材料。阻障層可減少摻雜物從第一源極/汲極材料擴散到磊晶含矽材料中的量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Exemplary semiconductor processing methods may include forming a barrier layer on a first source/drain material disposed on a substrate housed within a processing region of a semiconductor processing chamber. The first source/drain material may be doped with a dopant. The methods may include growing an epitaxial silicon-containing material on the barrier layer. The barrier layer may reduce an amount of diffusion of the dopant from the first source/drain material into the epitaxial silicon-containing material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:方法</p>
        <p type="p">305:操作</p>
        <p type="p">310:操作</p>
        <p type="p">315:操作</p>
        <p type="p">320:操作</p>
        <p type="p">325:操作</p>
        <p type="p">330:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1667" publication-number="202623978">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623978</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138755</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體鑄錠的切片方法</chinese-title>
        <english-title>SEMICONDUCTOR INGOT SLICING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">B28B5/04</main-classification>
        <further-classification edition="202601120260305B">H10P54/40</further-classification>
        <further-classification edition="200601120260305B">B23D55/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＳＵＭＣＯ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMCO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋本大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIMOTO, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">議題：提供一種半導體鑄錠的切片方法，其無需改變線鋸裝置的結構，並能抑制起因於線的扭轉的晶圓的平坦度的劣化。解決手段：於作為新線供給捲盤的第一捲盤10A及作為舊線回收捲盤的第二捲盤10B之間，經由主要滾輪30A~C線變為被張設的狀態。接著，於切片步驟前進行空運行步驟，其為自第一捲盤10A將線僅以既定的長度送出，並使其捲取至第二捲盤10B。接著，將第二捲盤10B作為新線供給捲盤，將第一捲盤10A作為舊線回收捲盤，一邊使線在第二捲盤10B與第一捲盤10A之間來回行進，一邊進行半導體鑄錠的切片步驟。藉由空運行步驟，被捲取至第二捲盤10B的線漸漸地被捲回至第一捲盤10A。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">ISSUE: A semiconductor ingot slicing method is provided that is capable of suppressing deterioration of wafer flatness caused by twisting of a wire, without modifying the configuration of a wire saw device. SOLUTION: A state is set in which a wire is stretched between a first reel 10A serving as a new-wire supply reel and a second reel 10B serving as an old-wire recovery reel via main rollers 30A-C. Next, before the slicing step, an idling step is performed, in which the wire is fed out from the first reel 10A by a predetermined length and wound onto the second reel 10B. Next, with the second reel serving as the new-wire supply reel and the first reel serving as the old-wire recovery reel, while making the wire to reciprocate between the second reel 10B and the first reel 10A, a slicing step of a semiconductor ingot is performed. By the idling step, the wire wound onto the second reel 10B is gradually rewound onto the first reel 10A.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10A:第一捲盤(新線供給捲盤→舊線回收捲盤)</p>
        <p type="p">10B:第二捲盤(舊線回收捲盤→新線供給捲盤)</p>
        <p type="p">30A:第一主要滾輪</p>
        <p type="p">30B:第二主要滾輪</p>
        <p type="p">30C:第三主要滾輪</p>
        <p type="p">40:線</p>
        <p type="p">I:半導體鑄錠</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1668" publication-number="202625461">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625461</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138756</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>音訊設備及其操作方法</chinese-title>
        <english-title>AUDIO APPARATUS AND METHOD OF OPERATION THEREFOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">H04S7/00</main-classification>
        <further-classification edition="201101120260309B">H04N21/439</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商皇家飛利浦有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONINKLIJKE PHILIPS N.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維爾甘　克莉斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAREKAMP, CHRISTIAAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑夫斯　山姆　馬汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JELFS, SAM MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>珍斯　柯尼里斯　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANSE, CORNELIS PIETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種音訊設備包含從擷取一場景之攝影機接收視訊信號之一視訊信號接收器(201)，且一音訊信號接收器(203)從擷取該場景之音訊之麥克風接收音訊信號。一物體選擇器(205)藉由選擇一視訊信號中之一影像物體來選擇該場景之一物體，且一物體位置判定器(207)從對該等視訊信號之影像中之該物體之偵測及從該等攝影機之已知姿勢來判定該場景中之該物體之一物體位置。從該物體位置至該等音訊擷取姿勢之距離不超過該等姿勢之間之最大距離的五倍。一音訊混合器(209)藉由混合該等音訊信號來產生一音訊混合信號。該等音訊信號之至少一些混合權重係隨著相對於該等音訊信號之音訊擷取姿勢之第一物體位置變動而判定。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An audio apparatus comprises a video signal receiver (201) receiving video signals from cameras capturing a scene, and an audio signal receiver (203) receives audio signals from microphones capturing audio of the scene. An object selector (205) selects an object of the scene by selecting an image object in a video signal and an object position determiner (207) determines an object position for the object in the scene from detections of the object in images of the video signals and from known poses of the cameras. The distance from the object position to the audio capture poses does not exceed five times the largest distance between the poses. An audio mixer (209) generates an audio mix signal by mixing the audio signals. At least some mixing weights for the audio signals are determined as a function of the first object position relative to audio capture poses for the audio signals.</p>
      </isu-abst>
      <representative-img>
        <p type="p">201:視訊信號接收器</p>
        <p type="p">203:音訊信號接收器</p>
        <p type="p">205:物體選擇器</p>
        <p type="p">207:物體位置判定器；物體位置偵測器</p>
        <p type="p">209:音訊混合器</p>
        <p type="p">211:使用者介面</p>
        <p type="p">213:音訊物體來源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1669" publication-number="202623803">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623803</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138763</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療慢性腎病及肝纖維化的齊泊騰坦及達格列淨之組合</chinese-title>
        <english-title>COMBINATION OF ZIBOTENTAN AND DAPAGLIFLOZIN FOR THE TREATMENT OF CHRONIC KIDNEY DISEASE AND LIVER FIBROSIS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">A61K31/497</main-classification>
        <further-classification edition="200601120260309B">A61K31/44</further-classification>
        <further-classification edition="200601120260309B">C07D401/12</further-classification>
        <further-classification edition="200601120260309B">C07D401/14</further-classification>
        <further-classification edition="200601120260309B">C07D413/14</further-classification>
        <further-classification edition="200601120260309B">A61P1/16</further-classification>
        <further-classification edition="200601120260309B">A61P13/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞典商阿斯特捷利康公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASTRAZENECA AB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安伯里　菲利普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMBERY, PHILIP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示了一種使用齊泊騰坦及達格列淨之固定劑量組合治療患者的慢性腎病及肝纖維化之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods for treating chronic kidney disease and liver fibrosis in patients using a fixed-dose combination of zibotentan and dapagliflozin are disclosed.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1670" publication-number="202625780">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625780</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138770</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於基板邊緣輪廓的互動式使用者介面</chinese-title>
        <english-title>INTERACTIVE USER INTERFACE FOR SUBSTRATE EDGE PROFILE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260309B">H10P74/20</main-classification>
        <further-classification edition="202601120260309B">H10P72/30</further-classification>
        <further-classification edition="202601120260309B">H10P72/50</further-classification>
        <further-classification edition="200601120260309B">G06F17/10</further-classification>
        <further-classification edition="200601120260309B">G01B21/20</further-classification>
        <further-classification edition="200601120260309B">G01B21/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　晨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寇爾通斯基　麥克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOLTONSKI, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祝昭釗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, ZHAOZHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露中描述了一種用於校準邊緣環高度的方法。該方法包括使用基板處理系統的基板測量系統在基板的複數個位置測量第一厚度，並在包含圍繞基板的邊緣環的處理腔室內對基板執行一個製程。該方法還包括測量複數個位置的第二厚度，並估算邊緣環的速度和邊緣環高度，並根據估算的邊緣環高度校準邊緣環的高度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for calibrating an edge ring height is described herein. The method includes measuring first thicknesses at a plurality of locations of a substrate using a substrate measurement system of a substrate processing system, and performing a process on the substrate in a process chamber including an edge ring that surrounds the substrate. The method also includes measuring second thicknesses the plurality of locations and estimating a rate and edge ring height of the edge ring and calibrating the edge ring height based on the estimated edge ring height.</p>
      </isu-abst>
      <representative-img>
        <p type="p">205:邊緣環</p>
        <p type="p">210:靜電吸盤</p>
        <p type="p">215:晶圓/基板</p>
        <p type="p">218C:電漿鞘</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1671" publication-number="202624074">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624074</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138774</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於控制自行車之電子變速之方法</chinese-title>
        <english-title>METHOD FOR CONTROLLING ELECTRONIC SHIFTING OF A BICYCLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260306B">B62M6/45</main-classification>
        <further-classification edition="202001120260306B">B62J45/41</further-classification>
        <further-classification edition="202001120260306B">B62J45/411</further-classification>
        <further-classification edition="201001120260306B">B62M6/50</further-classification>
        <further-classification edition="200601120260306B">B62M9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商速聯有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SRAM, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓恩　賽吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAHN, SAGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬丹　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JORDAN, BRIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>衛斯林　凱文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WESLING, KEVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有能夠獨立於曲柄而驅動一鏈環之一電動踏板輔助馬達的自行車包括車輪速度感測器及曲柄踏頻感測器。該等車輪速度感測器及該等曲軸踏頻感測器分別量測車輪速度及曲軸踏頻，且將測得之車輪速度及曲軸踏頻提供至該自行車之控制器。該控制器基於該測得之車輪速度及/或該測得之曲軸踏頻來激活馬達增速傳動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bicycle with an electric pedal assist motor capable of driving a chainring independent of cranks includes wheel speed sensors and crank cadence sensors. The wheel speed sensors and the crank cadence sensors measure wheel speed and crank cadence, respectively, and provide the measured wheel speed and crank cadence to controller of the bicycle. The controller activates motor overdrive based on the measured wheel speed and/or the measured crank cadence.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:後撥鏈器</p>
        <p type="p">140:動力輔助裝置</p>
        <p type="p">300:控制系統</p>
        <p type="p">302:電動自行車控制器</p>
        <p type="p">304:踏板速度感測器</p>
        <p type="p">306:車輪速度感測器</p>
        <p type="p">308:扭矩感測器</p>
        <p type="p">310:通信鏈路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1672" publication-number="202625774">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625774</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138778</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>管理裝置、基板處理裝置、管理程式及溫度控制程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260315B">H10P74/00</main-classification>
        <further-classification edition="200601120260315B">G05D23/27</further-classification>
        <further-classification edition="202201120260315B">G01J5/80</further-classification>
        <further-classification edition="200601120260315B">G01K15/00</further-classification>
        <further-classification edition="201901120260315B">G06F16/21</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樋口卓哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIGUCHI, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大內未來</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OUCHI, MIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉村崇志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIMURA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赤間裕之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKAMA, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤隆司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, RYUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在基板處理裝置上安裝輻射溫度測定器來執行晶圓的溫度控制時，避免設定錯誤的修正值。  &lt;br/&gt;管理裝置，係具有：登錄部，係登錄修正表，該修正表使各輻射溫度測定器的相對於基準輻射溫度測定器的器差數據與用於識別各輻射溫度測定器的資訊係分別具有對應關係；以及傳送部，係在從安裝有特定輻射溫度測定器的基板處理裝置接收了包含用於識別該特定輻射溫度測定器的資訊的修正表的請求時，將與用於識別該特定輻射溫度測定器的資訊相對應的修正表傳送到請求來源的基板處理裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:管理系統</p>
        <p type="p">110:管理裝置</p>
        <p type="p">120_1~120_N:基板處理裝置</p>
        <p type="p">130_0:基準輻射溫度測定器</p>
        <p type="p">130_1~130_M:輻射溫度測定器</p>
        <p type="p">140:網路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1673" publication-number="202624393">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624393</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138788</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>二次電池</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">C08L33/12</main-classification>
        <further-classification edition="200601120260304B">C25B5/00</further-classification>
        <further-classification edition="201001120260304B">H01M10/052</further-classification>
        <further-classification edition="201001120260304B">H01M10/0587</further-classification>
        <further-classification edition="202101120260304B">H01M50/463</further-classification>
        <further-classification edition="202101120260304B">H01M50/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下知識產權經營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井上智哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOUE, TOMOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">二次電池之特徵在於：具備：電極體，隔著分隔件(13)捲繞有正極及負極；及外裝罐，容置前述電極體，前述電極體的最外周配置分隔件(13)，分隔件(13)具有：基材層(50)；及表面層(52)，配置於基材層(50)上，表面層(52)具有樹脂材料，前述樹脂材料在表面層(52)的表面形成凸部(58)，在分隔件(13)中，將位於前述電極體的最外周之區域設為第1區域(54)，將比第1區域(54)更靠向前述電極體的內周側，且位於與前述正極及前述負極相向的位置之區域設為第2區域(56)的情況下，在分隔件(13)的表面層(52)側的表面中，第1區域(54)中的凸部(58)的面積所佔之面積比大於第2區域(56)中的凸部(58)的面積所佔之面積比。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">13:分隔件</p>
        <p type="p">50:基材層</p>
        <p type="p">52:表面層</p>
        <p type="p">54:第1區域</p>
        <p type="p">56:第2區域</p>
        <p type="p">58:凸部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1674" publication-number="202625435">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625435</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138809</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>較高內部位元深度寫碼</chinese-title>
        <english-title>HIGHER INTERNAL BIT-DEPTH CODING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260305B">H04N19/117</main-classification>
        <further-classification edition="201401120260305B">H04N19/119</further-classification>
        <further-classification edition="201401120260305B">H04N19/82</further-classification>
        <further-classification edition="201401120260305B">H04N19/136</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>于若陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, RUOYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賽萊金　瓦迪姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEREGIN, VADIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克班　莫哈美德塞伊德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COBAN, MUHAMMED ZEYD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡爾切維奇　瑪塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARCZEWICZ, MARTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡　楠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於解碼視訊資料之裝置經組態以：判定該視訊資料之一內部位元深度，其中該視訊資料之該內部位元深度與該視訊資料之一輸出位元深度不同；判定該視訊資料之一區塊之一或多個樣本的一特性值；基於該內部位元深度而修改該特性值以判定一經修改特性值；基於該經修改特性值而選擇一濾波器；將該濾波器應用於該一或多個樣本以判定視訊資料之一經濾波區塊；基於該經濾波區塊而判定視訊資料之一經解碼區塊；及輸出包括視訊資料之該經解碼區塊的視訊資料之一經解碼圖像，其中視訊資料之該經解碼圖像的樣本值具有該輸出位元深度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device for decoding video data is configured to determine an internal bit depth for the video data, wherein the internal bit depth for the video data is different than an output bit depth for the video data; determine a characteristic value for one or more samples of a block of the video data; modify the characteristic value based on the internal bit depth to determine a modified characteristic value; select a filter based on the modified characteristic value; apply the filter to the one or more samples to determine a filtered block of video data; determine a decoded block of video data based on the filtered block; and output a decoded picture of video data that includes the decoded block of video data, wherein sample values of the decoded picture of video data have the output bit depth.</p>
      </isu-abst>
      <representative-img>
        <p type="p">602,604,606,608,610,612,614:方塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1675" publication-number="202625790">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625790</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138837</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>接合頭單元、晶粒接合裝置、晶粒接合方法及半導體裝置的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260304B">H10P95/60</main-classification>
        <further-classification edition="202601120260304B">H10P10/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商捷進科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FASFORD TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松添明央</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUZOE, AKIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>星野優人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSHINO, YUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>
                </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAEGUSA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 提供可以使晶粒所承受的荷重安定的技術。  &lt;br/&gt;　　[解決手段] 一種接合頭單元，具有：接合頭；負載單元，被設置在前述接合頭的中心軸上、且在前述接合頭之上；缸體，被設置在前述負載單元的中心軸上、且在前述負載單元之上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">41:接合頭單元</p>
        <p type="p">47:Z驅動部</p>
        <p type="p">80:控制部</p>
        <p type="p">411:接合頭</p>
        <p type="p">412:軸</p>
        <p type="p">413:支承部</p>
        <p type="p">414:殼體部</p>
        <p type="p">415:第一固定部</p>
        <p type="p">416:第二固定部</p>
        <p type="p">417:彈簧</p>
        <p type="p">418:缸體</p>
        <p type="p">418a:桿</p>
        <p type="p">419:負載單元</p>
        <p type="p">421:位移計</p>
        <p type="p">421a:位移計</p>
        <p type="p">421b:位移計</p>
        <p type="p">422:配管</p>
        <p type="p">423:電磁閥</p>
        <p type="p">424a:配管</p>
        <p type="p">424b:配管</p>
        <p type="p">425a:調節器</p>
        <p type="p">425b:調節器</p>
        <p type="p">471:昇降部</p>
        <p type="p">472:螺帽</p>
        <p type="p">473:螺桿軸</p>
        <p type="p">474:馬達</p>
        <p type="p">DS:位移訊號</p>
        <p type="p">F:按壓力</p>
        <p type="p">LD:荷重訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1676" publication-number="202624633">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624633</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138868</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>空氣靜壓軸承</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">F16C32/06</main-classification>
        <further-classification edition="200601120260309B">F16C39/04</further-classification>
        <further-classification edition="200601120260309B">F16C41/00</further-classification>
        <further-classification edition="200601120260309B">G05D5/02</further-classification>
        <further-classification edition="200601120260309B">G05D5/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商芝浦機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBAURA MACHINE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤智之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, TOMOYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">空氣靜壓軸承(1)，具有：對軸承部(11)供給空氣(A)的供氣裝置(30)、控制供氣裝置(30)的控制裝置(40)，供氣裝置(30)，具有複數個供氣系統(31、32)，供氣系統(31、32)，可各自切換供氣狀態或停止狀態，控制裝置(40)，在軸承間隙減少之際減少處於供氣狀態之供氣系統的數量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:空氣靜壓軸承</p>
        <p type="p">10:軸構件</p>
        <p type="p">11:軸承部</p>
        <p type="p">20:軸承構件</p>
        <p type="p">21:通氣管路</p>
        <p type="p">22:供氣口</p>
        <p type="p">23:限縮部</p>
        <p type="p">30:供氣裝置</p>
        <p type="p">31:供氣系統</p>
        <p type="p">32:供氣系統</p>
        <p type="p">39:空氣供給源</p>
        <p type="p">40:控制裝置</p>
        <p type="p">41:間隙感測器</p>
        <p type="p">221:供氣口</p>
        <p type="p">222:供氣口</p>
        <p type="p">311:分配管路</p>
        <p type="p">321:分配管路</p>
        <p type="p">322:電磁閥</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1677" publication-number="202624252">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624252</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138879</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於重組痘病毒之抗SARS-CoV-2病毒疫苗</chinese-title>
        <english-title>RECOMBINANT POXVIRUS BASED VACCINE AGAINST SARS-COV-2 VIRUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260310B">C07K14/165</main-classification>
        <further-classification edition="200601120260310B">A61K39/215</further-classification>
        <further-classification edition="200601120260310B">C12N15/863</further-classification>
        <further-classification edition="200601120260310B">A61P31/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大亞伯大州立大學理事會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE GOVERNORS OF THE UNIVERSITY OF ALBERTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>愛爾蘭商托尼克斯製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TONIX PHARMA LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊德曼　賽斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEDERMAN, SETH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈貝爾　史考特　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOEBEL, SCOTT J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊凡斯　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EVANS, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諾伊斯　芮恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOYCE, RYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明在各種態樣中係關於一種重組痘病毒，其包含編碼SARS-CoV-2病毒蛋白質之核酸；用於產生此類病毒之方法及此類病毒之用途。該等重組痘病毒尤其適用作抗SARS-CoV-2病毒之保護性病毒疫苗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates in various aspects to a recombinant poxvirus comprising a nucleic acid encoding a SARS-CoV-2 virus protein, methods for producing such viruses and the use of such viruses. The recombinant poxviruses are well suited, among others, as protective virus vaccines against SARS-CoV-2 virus.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1678" publication-number="202625689">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625689</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138887</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用石墨烯作為抑制劑的選擇性沉積</chinese-title>
        <english-title>SELECTIVE DEPOSITION USING GRAPHENE AS AN INHIBITOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260306B">H10P14/61</main-classification>
        <further-classification edition="202601120260306B">H10W20/20</further-classification>
        <further-classification edition="200601120260306B">C23C16/04</further-classification>
        <further-classification edition="200601120260306B">C23C16/26</further-classification>
        <further-classification edition="200601120260306B">C23C16/40</further-classification>
        <further-classification edition="200601120260306B">C23C16/505</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>那可維西域第　伊娃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NARKEVICIUTE, IEVA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡拉德拉彥　巴德里　Ｎ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VARADARAJAN, BHADRI N.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙瑪　卡希什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHARMA, KASHISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">石墨烯係相對於半導體基板的介電層而選擇性地沉積在金屬層上。介電材料係相對於半導體基板的金屬層而選擇性地沉積在介電層上。石墨烯是一種高品質的石墨烯膜，其在介電材料的沉積期間用作抑制劑。在一些實施方式中，介電材料可以是金屬氧化物。在一些實施方式中，介電材料可以是低k介電材料。石墨烯在整個半導體整合過程中保持不變。在一些實施方式中，石墨烯可以隨後被改質以允許在石墨烯的表面上的沉積，或者石墨烯可以隨後被去除。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Graphene is selectively deposited on a metal layer relative to a dielectric layer of a semiconductor substrate. Dielectric material is selectively deposited on the dielectric layer relative to the metal layer of the semiconductor substrate. The graphene is a high-quality graphene film that serves as an inhibitor during deposition of the dielectric material. In some implementations, the dielectric material may be a metal oxide. In some implementations, the dielectric material may be a low-k dielectric material. The graphene remains throughout semiconductor integration processes. In some implementations, the graphene may be subsequently modified by to permit deposition on the surface of the graphene or the graphene may be subsequently removed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">800:半導體基板</p>
        <p type="p">802:金屬層</p>
        <p type="p">804:介電層</p>
        <p type="p">806:石墨烯膜</p>
        <p type="p">808:第一介電材料</p>
        <p type="p">810:處理條件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1679" publication-number="202625781">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625781</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138964</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用基於傾斜的反射量測術測量關鍵尺寸之系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR MEASURING CRITICAL DIMENSIONS USING TILT-BASED REFLECTOMETRY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260309B">H10P74/20</main-classification>
        <further-classification edition="202601120260309B">H10P72/70</further-classification>
        <further-classification edition="202601120260309B">H10P72/50</further-classification>
        <further-classification edition="200601120260309B">G01N21/17</further-classification>
        <further-classification edition="200601120260309B">G01J3/28</further-classification>
        <further-classification edition="201801120260309B">G06F9/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納斯　賈納爾丹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATH, JANARDAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿金斯　菲利浦　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ATKINS, PHILLIP R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史津川</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, JINCHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克里許南　桑卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRISHNAN, SHANKAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種計量系統包含產生照明射束之一照明源。照明光學器件將該等射束以非零入射角引導至一樣本表面。偵測器收集來自該樣本表面之光，其中收集光學器件將此光引導至該等偵測器。具有處理器之一控制器執行程式指令以基於經收集光而自偵測器接收計量資料。該計量資料包含在基於非零入射之多個傾斜角下之測量值。該等處理器藉由對在該多個傾斜角下收集之測量資料進行外推來判定零度入射下之一底部關鍵尺寸值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A metrology system includes an illumination source generating illumination beams. Illumination optics direct the beams to a sample surface at non-zero incidence angles. Detectors collect light from the sample surface, with collection optics directing this light to the detectors. A controller with processors executes program instructions to receive metrology data from detectors based on collected light. The metrology data includes measurements at multiple tilt angles based on non-zero incidence. The processors determine a bottom critical dimension value at zero-degree incidence by extrapolating measurement data collected at the multiple tilt angles.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基於傾斜的反射量測術系統/系統</p>
        <p type="p">102:計量子系統</p>
        <p type="p">104:樣本</p>
        <p type="p">106:樣本載台</p>
        <p type="p">108:控制器</p>
        <p type="p">110:處理器</p>
        <p type="p">112:記憶體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1680" publication-number="202624167">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624167</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138971</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多晶稀土鋁鈣鈦礦材料及其製造方法</chinese-title>
        <english-title>POLYCRYSTALLINE RARE EARTH ALUMINUM PEROVSKITE MATERIALS AND METHODS OF MAKING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C04B35/50</main-classification>
        <further-classification edition="200601120260302B">C04B35/622</further-classification>
        <further-classification edition="200601120260302B">C04B35/626</further-classification>
        <further-classification edition="200601120260302B">C04B35/64</further-classification>
        <further-classification edition="200601120260302B">H01J37/32</further-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商闊斯泰公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COORSTEK, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭丁　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANDIN, STEVEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科利根　克蘿伊　艾琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COLLIGAN, CHLOE EILEEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳致豫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述包含稀土鋁鈣鈦礦之新穎多晶材料。在一個態樣中，該等新穎多晶材料包括：(a)至少50重量%的稀土鋁鈣鈦礦相，其中該稀土鋁鈣鈦礦相包括至少第一稀土元素及第二稀土元素，(b)不超過25重量%的稀土鋁單斜相，以及(c)可偵測量之以下中之一或兩者：(i)至少一種稀土氧化物相及(ii)至少一種稀土鋁石榴石相。此類多晶材料可實現改良之特性組合，諸如改良之密度、破裂模數(MOR)、斷裂韌性及耐電漿蝕刻性等中之兩者或更多者的組合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">New polycrystalline materials comprising rare earth aluminum perovskite are described. In one aspect, the new polycrystalline materials include: (a) at least 50 wt. % rare earth aluminum perovskite phase, wherein the rare earth aluminum perovskite phase includes at least a first rare earth element and a second rare earth element, (b) not greater than 25 wt. % of rare earth aluminum monoclinic phase, and (c) a detectable amount of one or both of: (i) at least one rare earth oxide phase and (ii) at least one rare earth aluminum garnet phase. Such polycrystalline materials may realize an improved combination of properties, such as an improved combination of two or more of density, modulus of rupture (MOR), fracture toughness, and plasma etch resistance, among others.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:方法</p>
        <p type="p">100:步驟</p>
        <p type="p">200:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1681" publication-number="202624005">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624005</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138981</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於汽車內飾應用之可固化油墨堆疊及包含其之玻璃製品</chinese-title>
        <english-title>CURABLE INK STACKS FOR AUTOMOTIVE INTERIOR APPLICATIONS AND GLASS ARTICLES COMPRISING SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">B32B17/10</main-classification>
        <further-classification edition="200601120260302B">B32B27/08</further-classification>
        <further-classification edition="200601120260302B">B32B27/16</further-classification>
        <further-classification edition="200601120260302B">B32B27/38</further-classification>
        <further-classification edition="201901120260302B">B32B7/025</further-classification>
        <further-classification edition="200601120260302B">C03C17/34</further-classification>
        <further-classification edition="202401120260302B">B60K35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱凌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIU, LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵根榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAO, GENRONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可固化油墨堆疊包括絕緣油墨層、安置於該絕緣油墨層之至少一部分上的導電油墨層及安置於該導電油墨層上之覆蓋油墨層。該絕緣油墨層包括第一表面電阻率，且該導電油墨層包括第二表面電阻率。該第二表面電阻率小於該第一表面電阻率。該覆蓋油墨層包括基於環氧樹脂之油墨。當該可固化油墨堆疊安置且固化於玻璃基板上以形成固化油墨堆疊時，該固化油墨堆疊展現出大於或等於1.00×10&lt;sup&gt;8&lt;/sup&gt; Ω之整體表面電阻率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A curable ink stack includes an insulated ink layer, a conductive ink layer disposed on at least a portion of the insulated ink layer, and a covered ink layer disposed on the conductive ink layer. The insulated ink layer includes a first surface resistivity and the conductive ink layer includes a second surface resistivity. The second surface resistivity is less than the first surface resistivity. The covered ink layer includes an epoxy-based ink. When the curable ink stack is disposed and cured on a glass substrate to form a cured ink stack, the cured ink stack exhibits an overall surface resistivity greater than or equal to 1.00×10&lt;sup&gt;8&lt;/sup&gt; Ω.</p>
      </isu-abst>
      <representative-img>
        <p type="p">230,540:顯示器</p>
        <p type="p">400:玻璃製品</p>
        <p type="p">450:基板</p>
        <p type="p">460:光管理層</p>
        <p type="p">470:第一主表面</p>
        <p type="p">480:第二主表面</p>
        <p type="p">490:功能表面層</p>
        <p type="p">500:固化油墨堆疊</p>
        <p type="p">520:顯示區</p>
        <p type="p">550:邊緣</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1682" publication-number="202623927">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623927</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138987</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>銀顆粒球狀凝集體的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">B22F9/24</main-classification>
        <further-classification edition="202201120260302B">B22F1/052</further-classification>
        <further-classification edition="202201120260302B">B22F1/10</further-classification>
        <further-classification edition="200601120260302B">H01B1/22</further-classification>
        <further-classification edition="201101120260302B">B82Y40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商福田金屬箔粉工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUDA METAL FOIL &amp; POWDER CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原田卓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARADA, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西條朱毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAIJO, SHUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種銀顆粒球狀凝集體的製造方法，能夠以簡便的方法製造奈米銀顆粒凝集成球狀的凝集體，所製造的奈米銀顆粒的球狀凝集體的分散性優異，另外，操作性優異，並且在低溫下燒結而顯現導電性，能夠適宜用作導電填料。銀顆粒球狀凝集體的製造方法是向銀化合物溶液和還原劑溶液中添加選自下述A組中的一種以上的添加劑來製造銀顆粒球狀凝集體，A組：檸檬酸、檸檬酸酐、檸檬酸鹽、偏苯三酸、偏苯三酸酐、偏苯三酸鹽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1683" publication-number="202624427">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624427</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139003</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於提升碳化矽材料移除速率之組合物及相關方法</chinese-title>
        <english-title>COMPOSITIONS FOR INCREASING MATERIAL REMOVAL RATE OF SILICON CARBIDE AND RELATED METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">C09G1/02</main-classification>
        <further-classification edition="200601120260311B">C09K3/14</further-classification>
        <further-classification edition="202001120260311B">C01F17/206</further-classification>
        <further-classification edition="202001120260311B">C01F17/276</further-classification>
        <further-classification edition="200601120260311B">C30B29/36</further-classification>
        <further-classification edition="202601120260311B">H10P52/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENTEGRIS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李臣軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHENXUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方　瑞石</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, STONE RAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金聲宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, SHENGYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃禾琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HELIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於在CMP拋光期間提升材料移除速率之組合物及相關方法。該組合物包含氧化劑。該組合物包含複數個粒子。該組合物包含以該組合物之總重量計0.01重量%至5重量%之至少一種稀土金屬鹽化合物。當將該組合物施加至碳化矽基板時且當拋光該碳化矽基板時，該至少一種稀土金屬鹽化合物以足以使材料移除速率相對於對照組合物提升的量存在。該對照組合物不包含該至少一種稀土金屬鹽化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Compositions for increasing material removal rate during CMP polishing and related methods are provided. The composition comprises an oxidizer. The composition comprises a plurality of particles. The composition comprises 0.01% to 5% by weight of at least one rare earth metal salt compound based on a total weight of the composition. When the composition is applied to a silicon carbide substrate and when the silicon carbide substrate is polished, the at least one rare earth metal salt compound is present in an amount sufficient to result in an increase in a material removal rate relative to a control composition. The control composition does not comprise the at least one rare earth metal salt compound.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1684" publication-number="202624355">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624355</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139004</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>組合物及其硬化物、成形物、顯示裝置以及固體攝像元件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08G75/06</main-classification>
        <further-classification edition="200601120260302B">C08L81/02</further-classification>
        <further-classification edition="200601120260302B">C08K5/50</further-classification>
        <further-classification edition="200601120260302B">G02B1/04</further-classification>
        <further-classification edition="200601120260302B">G09F9/00</further-classification>
        <further-classification edition="202501120260302B">H10F39/12</further-classification>
        <further-classification edition="202301120260302B">H10K59/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>淺津悠司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASATSU, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>出崎光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEZAKI, HIKARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種能夠提供顯示出高折射率及高密接性之硬化物，進而具有良好之製膜性之組合物。  &lt;br/&gt;本發明提供一種組合物，其含有：具有環硫乙烷基或硫環丁烷基之化合物(A)、及式(B)所表示之化合物(B)。  &lt;br/&gt;&lt;img align="absmiddle" height="157px" width="312px" file="ed10051.JPG" alt="ed10051.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[式(B)中，  &lt;br/&gt;x、y、及z表示1～5；  &lt;br/&gt;R&lt;sup&gt;x&lt;/sup&gt;、R&lt;sup&gt;y&lt;/sup&gt;、及R&lt;sup&gt;z&lt;/sup&gt;表示一價烴基，於R&lt;sup&gt;x&lt;/sup&gt;、R&lt;sup&gt;y&lt;/sup&gt;、及R&lt;sup&gt;z&lt;/sup&gt;存在複數個之情形時，存在複數個之R&lt;sup&gt;x&lt;/sup&gt;、R&lt;sup&gt;y&lt;/sup&gt;、及R&lt;sup&gt;z&lt;/sup&gt;分別可相同亦可不同；  &lt;br/&gt;bx、by、及bz表示0～4，x與bx之和為5以下，y與by之和為5以下，z與bz之和為5以下；  &lt;br/&gt;R&lt;sup&gt;bx&lt;/sup&gt;、R&lt;sup&gt;by&lt;/sup&gt;、及R&lt;sup&gt;bz&lt;/sup&gt;表示一價取代基，於R&lt;sup&gt;bx&lt;/sup&gt;、R&lt;sup&gt;by&lt;/sup&gt;、及R&lt;sup&gt;bz&lt;/sup&gt;存在複數個之情形時，存在複數個之R&lt;sup&gt;bx&lt;/sup&gt;、R&lt;sup&gt;by&lt;/sup&gt;、及R&lt;sup&gt;bz&lt;/sup&gt;分別可相同亦可不同]</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1685" publication-number="202625848">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625848</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139005</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>接合裝置、處理系統及接合方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260308B">H10W72/00</main-classification>
        <further-classification edition="202601120260308B">H10B80/00</further-classification>
        <further-classification edition="202601120260308B">H10D80/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三根陽介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINE, YOUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溝本康隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZOMOTO, YASUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]  &lt;br/&gt;將複數個晶粒效率良好地裝設於基板。  &lt;br/&gt;[解決手段]  &lt;br/&gt;一種將由晶粒載具所固持之複數個晶粒接合於基板的接合裝置，具有：晶粒載具固持部，其在前述複數個晶粒之接合面朝上的狀態下，從前述晶粒載具之下方固持該晶粒載具；基板固持部，其在前述基板之接合面朝下的狀態下，從前述基板之上方固持該基板；晶粒輸送部，其從前述晶粒載具接收前述晶粒，並在前述晶粒之接合面朝上的狀態下輸送前述晶粒；以及晶粒接合部，其從前述晶粒輸送部接收前述晶粒，並在前述晶粒之接合面朝上的狀態下將前述晶粒接合於前述基板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">130:接合裝置</p>
        <p type="p">200:架台</p>
        <p type="p">201:第1架台</p>
        <p type="p">202:第2架台</p>
        <p type="p">210:制震機構</p>
        <p type="p">211:支持台</p>
        <p type="p">212:阻尼器</p>
        <p type="p">220:載具固持部</p>
        <p type="p">221:移動機構</p>
        <p type="p">230:脫離部</p>
        <p type="p">240:晶粒輸送部</p>
        <p type="p">250:移動機構</p>
        <p type="p">251:支持部</p>
        <p type="p">252:臂</p>
        <p type="p">253:軌道</p>
        <p type="p">254:支柱</p>
        <p type="p">260:晶圓固持部</p>
        <p type="p">270:移動機構</p>
        <p type="p">271:軌道</p>
        <p type="p">272:支柱</p>
        <p type="p">280:晶粒接合部</p>
        <p type="p">290:移動機構</p>
        <p type="p">291:支持部</p>
        <p type="p">292:平台</p>
        <p type="p">293:第1軌道</p>
        <p type="p">294:第2軌道</p>
        <p type="p">300:第1拍攝部</p>
        <p type="p">301:第2拍攝部</p>
        <p type="p">302:第3拍攝部</p>
        <p type="p">310:玻璃板</p>
        <p type="p">311:標記</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1686" publication-number="202625462">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625462</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139035</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於人工智慧／機器學習（ＡＩＭＬ）側鏈路定位的非無線電存取網路（ＲＡＮ）輔助訓練資料產生</chinese-title>
        <english-title>NON-RADIO ACCESS NETWORK (RAN)-AIDED TRAINING DATA GENERATION FOR ARTIFICIAL INTELLIGENCE/MACHINE LEARNING (AIML) SIDELINK POSITIONING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260305B">H04W4/02</main-classification>
        <further-classification edition="200901120260305B">H04W64/00</further-classification>
        <further-classification edition="200601120260305B">G01S5/00</further-classification>
        <further-classification edition="201001120260305B">G01S19/48</further-classification>
        <further-classification edition="201901120260305B">G06N20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯特凡諾斯　斯泰利奧斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEFANATOS, STELIOS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古拉帝　卡皮爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GULATI, KAPIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦西拉夫斯基　丹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VASSILOVSKI, DAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示用於無線定位之技術。在一些態樣中，一第一使用者設備(UE)可獲得一或多個測距或側鏈路定位測量。該第一UE可獲得該第一UE的一或多個非無線電存取網路（非RAN）定位結果。該第一UE可獲得對應於該第一UE的該一或多個非RAN定位結果的一或多個基準真實標籤。該第一UE可基於該一或多個測距或側鏈路定位測量及該一或多個基準真實標籤來訓練一人工智慧/機器學習(AIML)模型。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are techniques for wireless positioning. In some aspects, a first user equipment (UE) may obtain one or more ranging or sidelink positioning measurements. The first UE may obtain one or more non-radio access network (non-RAN) positioning results of the first UE. The first UE may obtain one or more ground truth labels corresponding to the one or more non-RAN positioning results of the first UE. The first UE may train an artificial intelligence/machine learning (AIML) model based on the one or more ranging or sidelink positioning measurements and the one or more ground truth labels.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1500:方法</p>
        <p type="p">1510,1520,1530,1540:方塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1687" publication-number="202624838">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624838</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139041</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>偏振光束操縱背景</chinese-title>
        <english-title>POLARIZING BEAM MANIPULATION BACKGROUND</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">G02B27/10</main-classification>
        <further-classification edition="200601120260311B">G02B27/28</further-classification>
        <further-classification edition="200601120260311B">G02B13/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商應用材料以色列公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS ISRAEL LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>那狄斯　羅曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAIDIS, ROMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉皮德　梅納薛姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAPID, MENACHEM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡波安諾　葉契爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAPOANO, YECHIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉克曼　伊恩農</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLICKMAN, YINNON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">偏振光束操縱單元，該偏振光束操縱單元包括：（i）偏振分束器，該偏振分束器表現出基於輻射光線的入射角度的偏振消光比；及（ii）位於偏振分束器之前的遠心透鏡，該遠心透鏡配置為：（a）接收包括不同入射角度的光線的非準直輸入光束，以及（b）將該非準直輸入光束轉換為準直輸入光束，該準直輸入光束包括在入射到該偏振分束器時彼此平行的光線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A polarizing beam manipulation unit, that includes: (i) a polarizing beam splitter that exhibits polarization extinction ratios that are based on angles of impingement of rays of radiation; and (ii) a telecentric lens that precedes the polarization beam splitter and is configured to: (a) receive a non-collimated input beam that comprises rays of different angles of impingement, and (b) convert the non-collimated input beam to a collimated input beam that comprises rays that are parallel to each other when impinging on the polarization beam splitter.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:偏振光束操縱單元</p>
        <p type="p">101:焦後平面</p>
        <p type="p">102:偏振分束器</p>
        <p type="p">104:遠心透鏡</p>
        <p type="p">111:第一直角稜鏡</p>
        <p type="p">112:第二直角稜鏡</p>
        <p type="p">113:斜邊表面</p>
        <p type="p">119:縱軸</p>
        <p type="p">121:非準直輸入光束</p>
        <p type="p">123:準直輸入光束</p>
        <p type="p">126:點光源</p>
        <p type="p">127:第一面</p>
        <p type="p">128:第二面</p>
        <p type="p">129:輸入面</p>
        <p type="p">119-1:視場段</p>
        <p type="p">121-1:點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1688" publication-number="202624188">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624188</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139052</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>酯寡聚物之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">C07C67/465</main-classification>
        <further-classification edition="200601120260311B">C08G2/36</further-classification>
        <further-classification edition="200601120260311B">C08F4/10</further-classification>
        <further-classification edition="200601120260311B">C08J11/24</further-classification>
        <further-classification edition="200601120260311B">C08J11/04</further-classification>
        <further-classification edition="200601120260311B">B29B17/02</further-classification>
        <further-classification edition="202201120260311B">B09B3/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東洋紡股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOBO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樋口諒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIGUCHI, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐佐井珠世</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAI, TAMAYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>太田絹華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTA, KINUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維琴西奧　萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VICENCIO, RYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">使用分解酵素將聚酯予以直接解聚合的步驟中，即使延長解聚合反應時間，使原料聚酯之解聚合完全地進行仍是困難的。  &lt;br/&gt;藉由將聚酯(A)、解聚合觸媒(B)及含羥基的有機化合物(C)予以混合來製造酯寡聚物組成物，並將前述酯寡聚物組成物予以酵素分解，能夠在沒有聚酯殘渣的情況下將聚酯(A)予以解聚合。含羥基的有機化合物(C)較佳為選自於一元醇及二元醇中之1種或2種以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1689" publication-number="202625712">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625712</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139058</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化學機械拋光漿料堆積清洗</chinese-title>
        <english-title>CHEMICAL MECHANICAL POLISHING SLURRY BUILDUP CLEANING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260310B">H10P52/00</main-classification>
        <further-classification edition="202601120260310B">H10P52/40</further-classification>
        <further-classification edition="202601120260310B">H10P70/00</further-classification>
        <further-classification edition="202601120260310B">H10P72/00</further-classification>
        <further-classification edition="200601120260310B">B24B49/12</further-classification>
        <further-classification edition="200601120260310B">B24B57/02</further-classification>
        <further-classification edition="201701120260310B">G06T7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳　昊晟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HAOSHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡德芬　蕭恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN DER VEEN, SHAUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭　迪芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PON, DEVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾　艾爾頓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHONG, ELTON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛洛德　愛德華Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLOYD, EDWARD L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧加森伊林斯基　艾米麗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUGASON ILINSKY, EMILY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　浩權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, JUSTIN H.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多明　強納森Ｐ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOMIN, JONATHAN P.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　菲利普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, PHILLIP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德什潘德　山彌爾Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DESHPANDE, SAMEER A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>真　阿希許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAIN, ASHEESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>努尼佳　史帝文Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZUNIGA, STEVEN M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">基板拋光裝置具有安裝於拋光裝置外殼壁上的清洗站。清洗站包括相對於壁可移動的噴嘴，噴嘴被配置為噴灑清洗液。該裝置還包括影像感測器，其被配置為生成拋光裝置表面的影像。與噴嘴耦接的控制器被配置為將噴嘴指向表面，並被配置為使用該影像監控表面上的漿料堆積。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A substrate polishing apparatus having a cleaning station mounted to a wall of a housing of the polishing apparatus. The cleaning station includes a nozzle movable relative to the wall, and the nozzle configured to spray a cleaning fluid. The apparatus also include an image sensor configured to generate an image of a surface of the polishing apparatus. A controller coupled to the nozzle is configured to direct the nozzle to the surface and configured to monitor slurry buildup on the surface using the image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:拋光裝置</p>
        <p type="p">102:基座</p>
        <p type="p">108:載具</p>
        <p type="p">110:轉移機器人</p>
        <p type="p">112:墊片調節裝置</p>
        <p type="p">122:轉移站</p>
        <p type="p">123a:裝載杯</p>
        <p type="p">123b:裝載杯</p>
        <p type="p">124a:第一拋光站</p>
        <p type="p">124b:第二拋光站</p>
        <p type="p">124c:第三拋光站</p>
        <p type="p">124d:第四拋光站</p>
        <p type="p">126:承載頭</p>
        <p type="p">128:上方軌道</p>
        <p type="p">130:拋光墊片</p>
        <p type="p">134:噴灑桿</p>
        <p type="p">190:控制器</p>
        <p type="p">192:CPU</p>
        <p type="p">194:記憶體</p>
        <p type="p">196:支援電路</p>
        <p type="p">300:清洗站</p>
        <p type="p">302:清洗液源</p>
        <p type="p">310:清洗噴嘴</p>
        <p type="p">320:平臺</p>
        <p type="p">330:照相機</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1690" publication-number="202624351">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624351</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139065</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性樹脂組合物及硬化浮凸圖案之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08G73/10</main-classification>
        <further-classification edition="200601120260302B">C08G73/12</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/027</further-classification>
        <further-classification edition="200601120260302B">G03F7/031</further-classification>
        <further-classification edition="200601120260302B">G03F7/037</further-classification>
        <further-classification edition="200601120260302B">G03F7/038</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="200601120260302B">G03F7/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商旭化成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水建樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, TAKEKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種感光性樹脂組合物，其用於面板級封裝製程，且包含：  &lt;br/&gt;(A)選自由(A-1)聚醯亞胺前驅物及(A-2)聚醯亞胺所組成之群中之至少1種；  &lt;br/&gt;(B)光聚合起始劑；及  &lt;br/&gt;(C)有機溶劑；  &lt;br/&gt;上述(C)有機溶劑包含選自由N-乙基-2-吡咯啶酮、1,3-二甲基-2-咪唑啶酮、3-甲氧基-N,N-二甲基丙醯胺、及3-丁氧基-N,N-二甲基丙醯胺所組成之群中之至少1者，且  &lt;br/&gt;於23℃下利用E型黏度計測得之黏度為0.02～1.5 Pa・s。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1691" publication-number="202623745">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623745</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139102</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>吸入具及電動吸塵器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">A47L9/06</main-classification>
        <further-classification edition="200601120260311B">A47L9/28</further-classification>
        <further-classification edition="200601120260311B">A47L7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商愛麗思歐雅瑪股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IRIS OHYAMA INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福元大地</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUMOTO, DAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤有輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實現一種容易去除吸入口的左右側的至少一側的塵埃的吸入具。  &lt;br/&gt;　　本發明之吸入具，具備吸入具本體，該吸入具本體與產生吸引力的電動送風機連通且具有設置於底側的吸入口，吸入具本體於底壁(601、602)具有第1固定清掃部(71、72)，第1固定清掃部(71、72)設置成與吸入口(6a)在左右方向上並排，第1固定清掃部(71、72)以隨著從前側朝向後側而靠近吸入口(6a)的方式延伸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">4:旋轉清掃體</p>
        <p type="p">6:吸入具本體</p>
        <p type="p">6a:吸入口</p>
        <p type="p">6b:旋轉清掃體室</p>
        <p type="p">6c:連通口</p>
        <p type="p">6c1:突出部</p>
        <p type="p">6d:突出體</p>
        <p type="p">6d1:前端</p>
        <p type="p">6d2:後端</p>
        <p type="p">6d3:第1部分</p>
        <p type="p">6d4:第2部分</p>
        <p type="p">41:旋轉體</p>
        <p type="p">42:清掃體</p>
        <p type="p">43:被驅動具</p>
        <p type="p">44:被支撐具</p>
        <p type="p">44a:凸部</p>
        <p type="p">60:本體</p>
        <p type="p">60b:後壁</p>
        <p type="p">60b1:壁部</p>
        <p type="p">60b2:突出部</p>
        <p type="p">60b3:突出部</p>
        <p type="p">60b21:第1區域</p>
        <p type="p">60b22:第2區域</p>
        <p type="p">60c:上壁</p>
        <p type="p">71:第1固定清掃部(固定清掃部)</p>
        <p type="p">71a:前端部</p>
        <p type="p">71b:後端部</p>
        <p type="p">72:第1固定清掃部(固定清掃部)</p>
        <p type="p">72a:前端部</p>
        <p type="p">72b:後端部</p>
        <p type="p">73:第2固定清掃部(固定清掃部)</p>
        <p type="p">73b:左端部</p>
        <p type="p">76,77:溝部</p>
        <p type="p">601,602:底壁部</p>
        <p type="p">622,623:防撞條</p>
        <p type="p">693:卡合部</p>
        <p type="p">B,C:角度</p>
        <p type="p">C1:中心線</p>
        <p type="p">L1:軸線</p>
        <p type="p">L2:延伸方向</p>
        <p type="p">L3:虛擬線</p>
        <p type="p">H:虛擬平面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1692" publication-number="202624107">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624107</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139104</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電梯異常檢測裝置及電梯異常檢測方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">B66B5/02</main-classification>
        <further-classification edition="200601120260128B">B66B3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東芝電梯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOSHIBA ELEVATOR KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倉持宙斗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURAMOCHI, HIROTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 特定電梯裝置中使用的水冷式冷卻裝置的損壞原因。  &lt;br/&gt;　　[解決手段] 實施形態的電梯異常檢測裝置，是檢測冷卻向驅動乘載廂升降的馬達供給電力的電源的水冷式冷卻裝置的異常的電梯異常檢測裝置。實施形態的電梯異常檢測裝置具有溫度感測器與記憶部和異常檢測部。溫度感測器，是量測構成乘載廂進行升降運轉時的電源的發熱元件的溫度。記憶部，是在構成水冷式冷卻裝置的用品為正常時從乘載廂的升降開始到升降停止為止的預定的時序，將利用溫度感測器量測到的發熱元件的溫度作為正常時的基準值進行記憶。異常檢測部，是比較基準值和乘載廂每次升降時所量測到的發熱元件的溫度，當兩者的溫度的差超過預定的值時，檢測到水冷式冷卻裝置的異常。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">36:操作面板</p>
        <p type="p">37:荷重感測器</p>
        <p type="p">38:第2溫度感測器</p>
        <p type="p">71:驅動單元控制部</p>
        <p type="p">72:異常檢測裝置</p>
        <p type="p">80:控制單元</p>
        <p type="p">90:驅動單元</p>
        <p type="p">96:電力感測器</p>
        <p type="p">97:溫度感測器</p>
        <p type="p">100:輸入輸出裝置</p>
        <p type="p">721:運轉狀況監視部</p>
        <p type="p">722:曲線製作部</p>
        <p type="p">723:異常檢測部</p>
        <p type="p">724:記憶部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1693" publication-number="202625463">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625463</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139107</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資訊處理裝置、資訊處理方法、程式及無線通訊裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260305B">H04W4/02</main-classification>
        <further-classification edition="201801120260305B">H04W4/029</further-classification>
        <further-classification edition="202301120260305B">H04W72/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商豐田自動車股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOTA JIDOSHA KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵校</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAO, XIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, AKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本賢一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, KENICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">作為核心網路中的第一NF(Network Function)發揮功能的資訊處理裝置，取得關於第一區域內的天候之天候關連數據，基於前述天候關連數據，將指示對應了前述天候的通訊控制之第一數據，發送至位於前述第一區域內的，構成無線存取網路的無線通訊裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:SF</p>
        <p type="p">6:AMF</p>
        <p type="p">9:UDM</p>
        <p type="p">10:UE</p>
        <p type="p">20:RAN</p>
        <p type="p">30:UPF</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1694" publication-number="202624879">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624879</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139108</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>極紫外光曝光用防塵薄膜、附防塵薄膜的曝光原版、曝光方法、以及半導體的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260302B">G03F1/22</main-classification>
        <further-classification edition="201201120260302B">G03F1/38</further-classification>
        <further-classification edition="201201120260302B">G03F1/62</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="202601120260302B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簗瀬優</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANASE, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供容易更換的極紫外光曝光用防塵薄膜。將極紫外光曝光用防塵薄膜的黏著劑層貼附於基板上，基板包括形成貼附極紫外光曝光用防塵薄膜的曝光原版的吸收膜的最表面的材料，當以0.1mm/s的速度將極紫外光曝光用防塵薄膜從所述基板進行90度剝離時的剝離強度為30N～70N。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1695" publication-number="202625482">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625482</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139153</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>終端、方法、基地台及通訊系統</chinese-title>
        <english-title>TERMINAL, METHOD, BASE STATION AND COMMUNICATION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260305B">H04W48/12</main-classification>
        <further-classification edition="200901120260305B">H04W48/06</further-classification>
        <further-classification edition="200601120260305B">H04B7/185</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商豐田自動車股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOTA JIDOSHA KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇內爾　凱埃里克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNELL, KAI-ERIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水崇之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿澤利爾　克勞德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARZELIER, CLAUDE J.F.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本揭露一態樣之終端，包括：接收器，配置為接收指定對一頻段之限制的頻段特定限制資訊；以及處理器，配置為基於該頻段特定限制資訊是否可被該終端理解來控制使用該頻段的通訊。根據本揭露一態樣，可適當地實現向前相容及/或節能的通訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A terminal according to one aspect of the present disclosure comprising: a receiver configured to receive band-specific restriction information specifying a restriction for a frequency band; and a processor configured to control communication using the frequency band based on whether the band-specific restriction information is comprehensible by the terminal. According to one aspect of the present disclosure, forward-compatible and/or energy-efficient communication can be achieved appropriately.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1696" publication-number="202625465">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625465</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139155</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>終端、方法、基地台及通訊系統</chinese-title>
        <english-title>TERMINAL, METHOD, BASE STATION AND COMMUNICATION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260305B">H04W4/06</main-classification>
        <further-classification edition="200601120260305B">H04L12/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商豐田自動車股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOTA JIDOSHA KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿澤利爾　克勞德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARZELIER, CLAUDE J.F.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇內爾　凱埃里克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNELL, KAI-ERIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水崇之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肯尼　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KENNEY, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿爾丁塔斯　奧努爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALTINTAS, ONUR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本揭露的一個態樣的一種終端包括：傳送器，配置為傳送包含終端識別碼的第一訊息；接收器，配置為接收包含多個容器的非單播訊息，其中，該多個容器中的每一者分別與一終端識別碼相關聯；以及處理器，配置為從該多個容器中讀取與該第一訊息中傳送的該終端識別碼相關聯的容器。根據本揭露的一個態樣，可以減少系統效能的劣化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A terminal according to one aspect of the present disclosure comprising: a transmitter configured to transmit a first message including a terminal identifier; a receiver configured to receive a non-unicast message including a plurality of containers, wherein each of the plurality of containers is associated with a respective terminal identifier; and a processor configured to read, from the plurality of containers, a container associated with the terminal identifier transmitted in the first message. According to one aspect of the present disclosure, deterioration of system performance can be reduced.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101:步驟</p>
        <p type="p">S102:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1697" publication-number="202625259">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625259</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139176</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電漿處理裝置及排氣環</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">H01J37/32</main-classification>
        <further-classification edition="200601120260313B">F15D1/08</further-classification>
        <further-classification edition="200601120260313B">F15D1/14</further-classification>
        <further-classification edition="200601120260313B">C23C16/455</further-classification>
        <further-classification edition="200601120260313B">C23C16/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水勇佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電漿處理裝置，利用電漿處理基板，包含：腔室；基板支持部：配置於該腔室內且支持該基板；排氣部，使該腔室內排氣；及排氣環，配置於該基板支持部的周圍；該腔室內的空間包含：支持有該基板之第1空間、及連接有該排氣部之第2空間。該排氣環係設於該第1空間與該第2空間之間，且具有：複數個貫通孔，於該第1空間側與該第2空間側之間貫通；及凸部，從形成有該複數個貫通孔的開口部之面突出。該凸部以於俯視下與該貫通孔的開口部的至少一部分重疊之方式，形成為從該開口部的周邊斜向地延伸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">200e:第2面</p>
        <p type="p">200p:第1面</p>
        <p type="p">210:貫通孔</p>
        <p type="p">210a:開口部</p>
        <p type="p">210b:開口部的邊緣(周緣)</p>
        <p type="p">220:凸部</p>
        <p type="p">L1:開口部的邊緣(周緣)至凸部的最短距離</p>
        <p type="p">L2:開口部的寬度</p>
        <p type="p">Se:排氣空間</p>
        <p type="p">Sp:電漿處理空間</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1698" publication-number="202625029">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625029</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139195</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種用於產生數位格式的法律條文之方法、裝置、電腦可讀取媒體、及電腦程式產品</chinese-title>
        <english-title>A METHOD, DEVICE, COMPUTER READABLE MEDIA, AND COMPUTER PROGRAM PRODUCT FOR GENERATING ARTICLES OF LAWS IN DIGITAL FORMATS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260305B">G06Q10/00</main-classification>
        <further-classification edition="201201120260305B">G06Q50/18</further-classification>
        <further-classification edition="202001120260305B">G06F40/151</further-classification>
        <further-classification edition="202001120260305B">G06F40/186</further-classification>
        <further-classification edition="202001120260305B">G06F40/106</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂嘉雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIAHSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂嘉雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIAHSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">將法律的條文單體拆解成項款目單體，對項款目單體進行條項間處理及/或項內處理，以針對項款目單體分別產生項款目外觀控制子和語意輔助子，以改善讀者閱讀法律的體驗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Article bodies of laws would be divided into Paragraph-Subsection-Item (PSI) bodies, which would be intra Article-Paragraph (AP) processed and inter AP processed for generating PSI appearance codes and semanteme assistance codes such that experiences for reading laws is improved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:資料獲取</p>
        <p type="p">104:資料拆解</p>
        <p type="p">106:資料處理</p>
        <p type="p">108:資料整併</p>
        <p type="p">110:資料寫入</p>
        <p type="p">1061:條項間處理</p>
        <p type="p">1063:條項內處理</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1699" publication-number="202625260">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625260</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139208</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理系統、其氣體分配板及氣體分配組件</chinese-title>
        <english-title>A SUBSTRATE PROCESSING SYSTEM, A GAS DISTRIBUTION PLATE THEREOF, AND A GAS DISTRIBUTION ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">H01J37/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭　文胤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, GORDON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝赫　穆罕默德　索海爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAIK, MOHAMMAD SOHAIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅斯理　克雷格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROSSLEE, CRAIG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬霍爾　丹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAROHL, DAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基板處理系統所用的氣體分配板，包括：外部環，包括位於其徑向內表面上的階狀界面；以及N個內部環，其中N為大於零的整數。該N個內部環的至少一者係環周向分段的，並包括內部階狀界面及外部階狀界面。該N個內部環的徑向外側一者的該外部階狀界面係配置以置放在該外部環的該內側階狀界面上，並與該內側階狀界面嚙合。中心部分包括位於其徑向外表面上的外部階狀界面，該外部階狀界面係配置以置放在該N個內部環的徑向內側一者的該內部階狀界面上，並與該內部階狀界面嚙合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A gas distribution plate for a substrate processing system includes an outer ring including a stepped interface on a radially inner surface thereof and N inner rings, where N is an integer greater than zero. At least one of the N inner rings is circumferentially segmented and includes an inner stepped interface and an outer stepped interface. An outer stepped interface of a radially outer one of the N inner rings is configured to rest on and mate with the inner stepped interface of the outer ring. A center portion includes an outer stepped interface on a radially outer surface thereof that is configured to rest on and mate with an inner stepped interface of a radially inner one of the N inner rings.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:分段式氣體分配板</p>
        <p type="p">210:外部環</p>
        <p type="p">214,215:環狀開槽</p>
        <p type="p">220:第一階狀內部環</p>
        <p type="p">222:階狀界面</p>
        <p type="p">226:箭頭</p>
        <p type="p">230:第二階狀內部環</p>
        <p type="p">232:階狀界面</p>
        <p type="p">236:箭頭</p>
        <p type="p">238:氣體貫穿孔</p>
        <p type="p">240:第三階狀內部環</p>
        <p type="p">242:階狀界面</p>
        <p type="p">246:箭頭</p>
        <p type="p">250:中心部分</p>
        <p type="p">252:階狀界面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1700" publication-number="202624750">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624750</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139212</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>流體觀察裝置</chinese-title>
        <english-title>FLUID OBSERVATION APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">G01P5/26</main-classification>
        <further-classification edition="200601120260313B">G01N21/41</further-classification>
        <further-classification edition="201701120260313B">G06T7/20</further-classification>
        <further-classification edition="202601120260313B">H10P74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大西葵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONISHI, AOI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古田智靖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUTA, TOMOYASU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種方法，其使用根據S-BOS法之解析方法，而可觀察不依存於解析方向之流體。  &lt;br/&gt;本發明為一種流體觀察裝置，其具備有：攝像部(50)，其係用於透過流體所存在之觀察區域(S)而對背景圖像(53)進行攝像；及電腦(60)，其使用由攝像部(50)所取得之圖像，藉由背景式施里倫法對流體之流動進行解析。背景圖像(53)具有在橫向及縱向兩者中濃淡重複變化之圖樣。電腦(60)被構成為，可對背景圖像(53)之橫向及縱向兩者，解析流體之流動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板處理裝置</p>
        <p type="p">10:腔室</p>
        <p type="p">11:處理空間</p>
        <p type="p">12:側壁</p>
        <p type="p">13:頂板部</p>
        <p type="p">14:底板部</p>
        <p type="p">15:窗</p>
        <p type="p">20:基板保持部</p>
        <p type="p">21:旋轉基座</p>
        <p type="p">22:夾持銷</p>
        <p type="p">30:旋轉機構</p>
        <p type="p">31:馬達</p>
        <p type="p">32:支撐軸</p>
        <p type="p">40:處理液供給部</p>
        <p type="p">41:供液源</p>
        <p type="p">42:供液配管</p>
        <p type="p">43:閥</p>
        <p type="p">44:泵</p>
        <p type="p">45:噴嘴</p>
        <p type="p">47:杯體</p>
        <p type="p">50:攝像部</p>
        <p type="p">53:背景圖像</p>
        <p type="p">60:電腦</p>
        <p type="p">320:軸心</p>
        <p type="p">A:光軸</p>
        <p type="p">S:觀察區域</p>
        <p type="p">W:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1701" publication-number="202625600">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625600</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139215</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>異質磊晶基板及異質磊晶基板的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260315B">H10D62/53</main-classification>
        <further-classification edition="202601120260315B">H10P95/40</further-classification>
        <further-classification edition="200601120260315B">C30B25/18</further-classification>
        <further-classification edition="202601120260315B">H10P95/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU HANDOTAI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大槻剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHTSUKI, TSUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松原壽樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUBARA, TOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上東洋太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEHIGASHI, YOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木温</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部達夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, TATSUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種異質磊晶基板，具備：基礎基板、在前述基礎基板上的成為差排發生源之差排層、與在前述差排層上的異質磊晶層，該異質磊晶基板的特徵在於：以前述差排層作為發生源而在前述基礎基板具有差排，藉由該差排，前述異質磊晶基板的破裂原因之前述基礎基板的裂紋之擴展會受到阻礙，從而提高破壞韌性。藉此，提供一種異質磊晶基板及異質磊晶基板的製造方法，其藉由施行活用延脆轉換(BDT)之具體對策，提高破壞韌性並抑制破裂。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:異質磊晶基板</p>
        <p type="p">2:基礎基板</p>
        <p type="p">3:差排層</p>
        <p type="p">4:異質磊晶層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1702" publication-number="202624287">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624287</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139238</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性樹脂積層體、光阻圖案之形成方法及配線板之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08F2/44</main-classification>
        <further-classification edition="200601120260302B">C08F2/50</further-classification>
        <further-classification edition="200601120260302B">C08F212/08</further-classification>
        <further-classification edition="200601120260302B">C08F220/06</further-classification>
        <further-classification edition="200601120260302B">C08F220/14</further-classification>
        <further-classification edition="200601120260302B">C08F220/18</further-classification>
        <further-classification edition="200601120260302B">C08F220/44</further-classification>
        <further-classification edition="200601120260302B">C08F257/02</further-classification>
        <further-classification edition="200601120260302B">C08F265/00</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/027</further-classification>
        <further-classification edition="200601120260302B">G03F7/031</further-classification>
        <further-classification edition="200601120260302B">G03F7/033</further-classification>
        <further-classification edition="200601120260302B">G03F7/038</further-classification>
        <further-classification edition="200601120260302B">G03F7/09</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="200601120260302B">G03F7/40</further-classification>
        <further-classification edition="200601120260302B">H05K3/06</further-classification>
        <further-classification edition="200601120260302B">H05K3/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商旭化成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松尾裕樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUO, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村祥汰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松本克久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO, KATSUHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秋山尚輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKIYAMA, YOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種光阻圖案之除去性、顯影性及剝離性優異之感光性樹脂積層體、光阻圖案形成方法及配線板之製造方法。  &lt;br/&gt;本發明係一種感光性樹脂積層體，其係具備：支撐膜、及含有感光性樹脂組成物之感光性樹脂層；並且  &lt;br/&gt;前述感光性樹脂組成物係含有以下成分：  &lt;br/&gt;（A）鹼可溶性高分子；  &lt;br/&gt;（B）具有乙烯性不飽和鍵之化合物；及  &lt;br/&gt;（C）聚合起始劑；  &lt;br/&gt;前述（A）成分係含有含單體成分作為構成單元之共聚物；  &lt;br/&gt;以前述共聚物之藉由Fox之式所算出之玻璃轉化溫度（Tg）之值為x（℃）、前述共聚物之酸值為y（mgKOH/g）時，x≧120，且3y／7＋60＜x；  &lt;br/&gt;前述（B）成分係含有以下成分：  &lt;br/&gt;（b-1）於一分子中含有各自至少1個以上之環氧乙烷結構及環氧丙烷結構之二(甲基)丙烯酸酯化合物；及  &lt;br/&gt;（b-2）4官能以上之(甲基)丙烯酸酯化合物；  &lt;br/&gt;相對於前述感光性樹脂組成物之總固體成分質量，前述（C）成分係含有聯咪唑化合物5.0～10質量%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1703" publication-number="202624339">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624339</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139240</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無孔酚類環氧樹脂</chinese-title>
        <english-title>POROSITY-FREE PHENOLIC EPOXIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">C08G65/02</main-classification>
        <further-classification edition="200601120260312B">C08G65/20</further-classification>
        <further-classification edition="200601120260312B">C08G59/02</further-classification>
        <further-classification edition="200601120260312B">C08L63/02</further-classification>
        <further-classification edition="202601120260312B">H10W76/45</further-classification>
        <further-classification edition="200601120260312B">B32B27/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼傑梅　馬可士艾立亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIJMEH, MARCUS ELIAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　振宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JENN-YUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐斯柏恩　強納森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORSBORN, JONATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑　珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, JANE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肖剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIAO, GANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格登　蘿拉馬班</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GORDON, LAURA MABEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用作奈米結構填充物的無孔酚類環氧樹脂，酚類環氧樹脂包括i)聚（四氫呋喃）；ii)酚醛聚縮水甘油醚；iii)乙基甲基酮；和iv)如異丙醇的溶劑。酚類環氧樹脂形成均勻、無孔隙的填充物，改善矽晶圓的處理、計量及TEM分析。以無孔酚類環氧樹脂填充奈米結構的方法，包括將四氫呋喃放入強酸中，使四氫呋喃的環被打開以產生四氫呋喃單體，聚合四氫呋喃單體以產生聚（四氫呋喃），將聚（四氫呋喃）與酚醛聚縮水甘油醚、乙基甲基酮及異丙醇混合，並將一或多層無孔酚類環氧樹脂沉積到奈米結構的表面上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A porosity-free phenolic epoxy to use as a fill for nanostructures, the phenolic epoxy including i) poly(tetrahydrofuran); ii) polyglycidyl ether of phenol-formaldehyde; iii) ethyl methyl ketone; and iv) a solvent such as isopropanol. The phenolic epoxy creates a uniform, void free fill that improves silicon wafer processing, metrology, and TEM analysis. A method to fill a nanostructure with a porosity-free phenolic epoxy, includes placing tetrahydrofuran in a strong acid such that a ring of the tetrahydrofuran is opened to create a tetrahydrofuran monomer, polymerizing the tetrahydrofuran monomer to create poly(tetrahydrofuran), mixing the poly(tetrahydrofuran) with polyglycidyl ether of phenol-formaldehyde, ethyl methyl ketone, and isopropanol, and depositing one or more layers of the porosity-free phenolic epoxy onto a surface of a nanostructure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:方法</p>
        <p type="p">104:方塊</p>
        <p type="p">106:區塊</p>
        <p type="p">108:區塊</p>
        <p type="p">110:區塊</p>
        <p type="p">112:區塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1704" publication-number="202624453">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624453</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139250</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有絕緣性之熱軟化性導熱性組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">C09K5/14</main-classification>
        <further-classification edition="200601120260311B">C08G77/38</further-classification>
        <further-classification edition="200601120260311B">C08G77/52</further-classification>
        <further-classification edition="200601120260311B">C08L83/14</further-classification>
        <further-classification edition="201801120260311B">C08K3/105</further-classification>
        <further-classification edition="200601120260311B">C08K3/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤崇則</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, TAKANORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西村一晟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMURA, ISSEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣中裕也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRONAKA, YUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠藤晃洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENDO, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種熱軟化性導熱性組成物，其包含：(A)苯基改質矽氧樹脂，其包含R&lt;sup&gt;1&lt;/sup&gt;SiO&lt;sub&gt;3/2&lt;/sub&gt;單元及R&lt;sup&gt;2&lt;/sup&gt;&lt;sub&gt;2&lt;/sub&gt;SiO&lt;sub&gt;2/2&lt;/sub&gt;單元且苯基改質率為30～60 mol％；(B)導熱性填充材料；且前述(B)成分包含：(B-1)平均粒徑為5～30 μm且開孔超過45 μm的留篩量為1質量％以下的氧化鋁或氮化鋁及(B-2)平均粒徑為0.3～5 μm的氧化鋁或氮化鋁或(B-3)平均粒徑為0.3～5 μm的氧化鋅；且質量比(B-1)/(B-2)＝1.0～4.0、或(B-1)/(B-3)＝1.0～4.0，體積電阻率為1.0×10&lt;sup&gt;10&lt;/sup&gt; Ω・cm以上。藉此，提供一種熱軟化性導熱性組成物，其在電子零件的運作溫度範圍內的溫度能夠充分低熱阻化且耐抽出性也優異且顯示良好的絕緣性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1705" publication-number="202625707">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625707</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139257</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>改善經蝕刻含矽及鍺材料表面性質之處理方法</chinese-title>
        <english-title>PROCESSING METHODS TO IMPROVE ETCHED SILICON-AND-GERMANIUM-CONTAINING MATERIAL SURFACE PROPERTIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260312B">H10P50/24</main-classification>
        <further-classification edition="202601120260312B">H10P14/00</further-classification>
        <further-classification edition="200601120260312B">H05H1/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李子匯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, ZIHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡長頤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHANG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　嘉瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, JIAYIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高　嘉玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, CHIA-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　安川</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ANCHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">示範性半導體處理方法可包括將含氟前驅物和含氮前驅物提供至半導體處理腔室的處理區域。基板可收容於處理區域內。含矽及鍺材料和含矽材料的交替層可設置於基板上。這些方法可包括形成含氟前驅物和含氮前驅物的電漿流出物。這些方法可包括將基板與含氟前驅物和含氮前驅物的電漿流出物接觸。該接觸可選擇性去除含矽及鍺材料的一部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Exemplary semiconductor processing methods may include providing a fluorine-containing precursor and a nitrogen-containing precursor to a processing region of a semiconductor processing chamber. A substrate may be housed within the processing region. Alternating layers of silicon-and-germanium-containing material and silicon-containing material may be disposed on the substrate. The methods may include forming plasma effluents of the fluorine-containing precursor and the nitrogen-containing precursor. The methods may include contacting the substrate with the plasma effluents of the fluorine-containing precursor and the nitrogen-containing precursor. The contacting may selectively remove a portion of the silicon-and-germanium-containing material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:方法</p>
        <p type="p">405:操作</p>
        <p type="p">410:操作</p>
        <p type="p">415:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1706" publication-number="202625079">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625079</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139260</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>圖形處理中的成對波的分割與重接合執行</chinese-title>
        <english-title>SPLITTING AND REJOINING EXECUTION OF PAIRED WAVES IN GRAPHICS PROCESSING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">G06T1/20</main-classification>
        <further-classification edition="201801120260305B">G06F9/38</further-classification>
        <further-classification edition="200601120260305B">G06F9/48</further-classification>
        <further-classification edition="201601120260305B">G06F12/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜　云</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DU, YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>應子琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YING, ZILIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIA, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃文峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WENFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格魯柏　安德魯艾文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRUBER, ANDREW EVAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游　純</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德莫斯　艾瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEMERS, ERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文呈現之態樣係關於用於圖形處理的方法及裝置，其包括一設備，例如GPU。該設備可起始執行包括一第一指令及一第二指令之一指令集。該設備亦可判定用於該第一指令或該第二指令之一者的資料是否待決。進一步地，該設備可基於用於該第一指令或該第二指令之一者的該資料待決，而暫停執行該第一指令及該第二指令。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Aspects presented herein relate to methods and devices for graphics processing including an apparatus, e.g., a GPU. The apparatus may initiate an execution of a set of instructions including a first instruction and a second instruction. The apparatus may also determine whether data is pending for one of the first instruction or the second instruction. Further, the apparatus may suspend the execution of the first instruction and the second instruction based on the data being pending for one of the first instruction or the second instruction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1100:通訊流程圖；圖</p>
        <p type="p">1102:GPU</p>
        <p type="p">1104:CPU/GPU</p>
        <p type="p">1106:記憶體</p>
        <p type="p">1110:步驟</p>
        <p type="p">1112:指示</p>
        <p type="p">1120:步驟</p>
        <p type="p">1130:步驟</p>
        <p type="p">1140:步驟</p>
        <p type="p">1150:步驟</p>
        <p type="p">1160:步驟</p>
        <p type="p">1170:步驟</p>
        <p type="p">1180:步驟</p>
        <p type="p">1182:步驟</p>
        <p type="p">1190:步驟</p>
        <p type="p">1192:指示</p>
        <p type="p">1194:指示</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1707" publication-number="202624955">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624955</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139265</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>操作特定控制資料</chinese-title>
        <english-title>OPERATION-SPECIFIC CONTROL DATA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260309B">G06F9/30</main-classification>
        <further-classification edition="200601120260309B">G06F9/54</further-classification>
        <further-classification edition="200601120260309B">G06F15/80</further-classification>
        <further-classification edition="200601120260309B">G06F15/82</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商ＡＲＭ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARM LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賽姆斯　多米尼克雨果</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SYMES, DOMINIC HUGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧爾森　傑斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OLSON, JENS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯摩倫斯克　賈雷德柯里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMOLENS, JARED COREY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍姆　魯恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOLM, RUNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NO</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種處理器，其包含儲存器、執行電路系統、及一處置單元。該處置單元經組態以獲得描述待執行之任務的任務資料。該任務包含可表示為操作之一有向圖之複數個操作，該等操作包含由對應於各別邏輯儲存位置之連接所連接之操作。在執行該任務時，該執行電路系統經組態以在一多維巢套迴圈上操作。該任務資料包含用於該等操作中之一操作的操作特定控制資料，該操作特定控制資料在一每維度之基礎上針對該多維巢套迴圈的複數個維度中之各個各別維度提供該操作是否待針對該各別維度上的複數個迭代中之各迭代執行的一指示。該處置單元使用該執行電路系統基於該操作特定控制資料來管理該操作的執行。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A processor comprising storage, execution circuitry and a handling unit. The handling unit is configured to obtain task data that describes a task to be executed. The task comprises a plurality of operations representable as a directed graph of operations comprising operations connected by connections corresponding to respective logical storage locations. In executing the task, the execution circuitry is configured to operate over a multi-dimensional nested loop. The task data comprises operation-specific control data for an operation of the operations, the operation-specific control data providing an indication, for each respective dimension of a plurality of dimensions of the multi-dimensional nested loop on a per-dimension basis, of whether the operation is to be executed for each iteration of a plurality of iterations over the respective dimension. The handling unit manages execution of the operation, using the execution circuitry, based on the operation-specific control data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:表</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1708" publication-number="202624891">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624891</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139285</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>正型感光性樹脂組成物、有機電致發光元件間隔壁、有機電致發光元件絕緣膜及有機電致發光元件</chinese-title>
        <english-title>POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, ORGANIC EL ELEMENT PARTITION WALL, ORGANIC EL ELEMENT INSULATING FILM, AND ORGANIC EL ELEMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">G03F7/039</main-classification>
        <further-classification edition="200601120260311B">G03F7/023</further-classification>
        <further-classification edition="200601120260311B">G03F7/075</further-classification>
        <further-classification edition="200601120260311B">H05B33/02</further-classification>
        <further-classification edition="200601120260311B">H05B33/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日保麗公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON POLYTECH CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀洋一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORI, YOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村和彌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口梓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, AZUSA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大森明日美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OMORI, ASUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳翠華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種正型感光性樹脂組成物、以及使用該正型感光性樹脂組成物製得之有機電致發光元件間隔壁、有機電致發光元件絕緣膜及有機電致發光元件，該正型感光性樹脂組成物含有：疏水性樹脂（A）、包含黑色染料之著色劑（E）、以及界面活性劑（D），其中疏水性樹脂（A）包含特定結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1709" publication-number="202624606">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624606</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139345</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於重型設備的多電壓輔助電力系統</chinese-title>
        <english-title>MULTI-VOLTAGE AUXILIARY POWER SYSTEM FOR HEAVY-DUTY EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">F02N11/08</main-classification>
        <further-classification edition="200601120260313B">H02J7/36</further-classification>
        <further-classification edition="200601120260313B">B60R16/033</further-classification>
        <further-classification edition="202601120260313B">H02J7/45</further-classification>
        <further-classification edition="200601120260313B">H01M10/48</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商ＯＸ合作夥伴有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OX PARTNERS, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭寶　史考特　Ｈ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUMBAUGH, SCOTT HAMILTON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍克　南森　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOCH, NATHAN ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫克　蒙特　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COOK, MONTE C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普魯特　亨利　Ｆ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRUETT, HENRY FRAZIER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於重型設備之多電壓輔助電力系統，該重型設備具有由一標稱12 V供應來供電之一起動器及車輛電子器件。該多電壓輔助電力系統具有一電池系統，該電池系統被組配用以提供彼此不同之第一及第二輸出電壓位準，其中該第一輸出電壓位準高於該第二輸出電壓位準；以及被組配用以進行下列動作之控制電路系統：偵測該重型設備中之一轉動曲柄發動事件；回應於偵測到該轉動曲柄發動事件，向該起動及電池系統施加該第一輸出電壓位準；以及在轉動曲柄發動動作完成時，切換成施加該第二輸出電壓位準，用來為該等車輛電子器件維持該標稱12 V供應。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multi-voltage auxiliary power system is for heavy-duty equipment having a starter and vehicle electronics powered by a nominal 12V supply. The multi-voltage auxiliary power system has a battery system configured to provide first and second output voltage levels that are different from each other, in which the first output voltage level is higher than the second output voltage level; and control circuitry configured to: detect a cranking event in the heavy-duty equipment; in response to detecting the cranking event, apply the first output voltage level to the starting and battery system; and switch to applying the second output voltage level to sustain the nominal 12V supply for the vehicle electronics when the cranking is complete.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:卡車</p>
        <p type="p">102:起動及電池系統</p>
        <p type="p">104:電池；鉛酸電池；內部電池</p>
        <p type="p">106:電子器件單元；車輛電子器件</p>
        <p type="p">108:引擎控制模組；ECM；車輛電子器件</p>
        <p type="p">110:起動器</p>
        <p type="p">112:截止開關</p>
        <p type="p">114,116:配線</p>
        <p type="p">118:交流發電機</p>
        <p type="p">120:電池箱</p>
        <p type="p">122:多電壓輔助電力系統；系統</p>
        <p type="p">124:電池纜線</p>
        <p type="p">126:跨接起動埠</p>
        <p type="p">128:引擎</p>
        <p type="p">130:監測系統</p>
        <p type="p">132:智慧型裝置</p>
        <p type="p">134:工作站遠端監測</p>
        <p type="p">136,158:網際網路連接</p>
        <p type="p">138:使用者介面</p>
        <p type="p">140:雇主或監測人員</p>
        <p type="p">142:遠端伺服器</p>
        <p type="p">144:無線個人區域網路(WPAN)連接</p>
        <p type="p">146:使用者設備</p>
        <p type="p">148:行動應用程式</p>
        <p type="p">150:蜂巢式無線廣域網路(WWAN)連接</p>
        <p type="p">152:蜂巢式接取系統</p>
        <p type="p">154:無線區域網路(WLAN)連接</p>
        <p type="p">156:Wi-Fi路由器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1710" publication-number="202625791">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625791</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139394</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體處理設備、前驅物氣體提供方法、及形成層之方法</chinese-title>
        <english-title>SEMICONDUCTOR PROCESSING APPARATUS, METHOD OF PROVIDING PRECURSOR GAS, AND METHOD OF FORMING LAYER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260315B">H10P95/70</main-classification>
        <further-classification edition="200601120260315B">C23C16/448</further-classification>
        <further-classification edition="200601120260315B">C23C16/455</further-classification>
        <further-classification edition="200601120260315B">G05D7/00</further-classification>
        <further-classification edition="200601120260315B">B01J4/00</further-classification>
        <further-classification edition="200601120260315B">F17C1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑迪拉　路西安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JDIRA, LUCIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班克瑞斯　瑞德寇　傑拉德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANKRAS, RADKO GERARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>優湯南渡　里札</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUKANANTO, RIZA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普羅塞爾皮奧　達維德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PROSERPIO, DAVIDE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特后司特　赫伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TERHORST, HERBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>烏斯特雷肯　西奧多羅斯　Ｇ　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OOSTERLAKEN, THEODORUS G.M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范　哈斯特　西蒙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN HAASTERT, SIMON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特拉貝爾西　法特瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRABELSI, FATMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾布勒德　伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JONGBLOED, BERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科納本　維爾納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KNAEPEN, WERNER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露揭露一種半導體處理設備。此半導體處理設備包含：一製程腔室，其配置以收納複數個基板；一儲積器容器，其與此製程腔室流體連通，配置以儲存呈氣體形式之一前驅物；以及至少兩個固態前驅物儲存容器，其各自配置以收納呈氣體形式之一前驅物，使此所收納氣體形式前驅物在此各別固態前驅物儲存容器內部轉換成一固態，且使此固態前驅物轉換成氣相。此至少兩個固態前驅物儲存容器中之各者與此儲積器容器流體連通。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor processing apparatus is disclosed. The semiconductor processing apparatus comprises a process chamber configured to receive a plurality of substrates; an accumulator vessel in fluid communication with the process chamber, configured to store a precursor in gas form; and at least two solid state precursor storage vessels, each being configured to receive a precursor in gas form, to cause said received gas form precursor to be converted to a solid state inside the respective solid state precursor storage vessel, and to cause said solid state precursor to be converted to gas phase. Each of the at least two solid state precursor storage vessels are in fluid communication with the accumulator vessel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:半導體處理設備</p>
        <p type="p">102:製程腔室</p>
        <p type="p">103:基板</p>
        <p type="p">104:製程腔室氣體流動入口</p>
        <p type="p">105:製程腔室氣體排出出口</p>
        <p type="p">106:儲積器容器</p>
        <p type="p">107:固態前驅物儲存容器</p>
        <p type="p">108:第一固態前驅物儲存容器</p>
        <p type="p">109:第二固態前驅物儲存容器</p>
        <p type="p">110:主體前驅物供應器</p>
        <p type="p">111:第一氣體管線</p>
        <p type="p">112:第二氣體管線</p>
        <p type="p">113:第一氣體流量控制閥，氣體流量控制閥</p>
        <p type="p">114:第二氣體流量控制閥，氣體流量控制閥</p>
        <p type="p">115:第三氣體管線</p>
        <p type="p">116:第四氣體管線</p>
        <p type="p">117:第三氣體流量控制閥</p>
        <p type="p">118:第四氣體流量控制閥</p>
        <p type="p">119:第五氣體流量控制閥</p>
        <p type="p">120:第六氣體流量控制閥</p>
        <p type="p">121:第二製程氣體源</p>
        <p type="p">122:第二製程氣體流量控制閥</p>
        <p type="p">123:吹掃氣體源</p>
        <p type="p">124:吹掃氣體流量控制閥</p>
        <p type="p">127:第五氣體管線</p>
        <p type="p">128:控制器</p>
        <p type="p">129:壓力轉換器</p>
        <p type="p">130:儲積器熱電偶</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1711" publication-number="202625288">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625288</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139403</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有用於非金屬表面和金屬表面應用的低輪廓天線組件的車用天線</chinese-title>
        <english-title>VEHICULAR ANTENNA HAVING A LOW-PROFILE ANTENNA ASSEMBLY FOR NON-METAL SURFACE AND METAL SURFACE APPLICATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">H01Q1/32</main-classification>
        <further-classification edition="200601120260309B">H01Q1/36</further-classification>
        <further-classification edition="200601120260309B">H01Q1/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商太谷康奈特提威提索洛訊有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TE CONNECTIVITY SOLUTIONS GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　國俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NG, KOKJIUNN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　培義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, POI NGEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　定喜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TINGHEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　建明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, KEANMENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳傳岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種車用天線包含一低輪廓殼體(110)，其具有一第一端部和一第二端部，該低輪廓殼體具有一第一側部和一第二側部。一天線組件(200)係設於該低輪廓殼體中。該天線組件包含在該第一端部(212)處的一第一蜂巢式天線(300)、以及在該第二端部(214)處的一第二蜂巢式天線(400)。該天線組件包含在該第一側部(216)處的一第一接地元件(240)、以及在該第二側部(218)處的一第二接地元件(260)。該第一蜂巢式天線係可操作地耦接至該第一接地元件，且該第二蜂巢式天線係可操作地耦接至該第二接地元件。該第一接地元件與該第二接地元件隔離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A vehicular antenna includes a low-profile housing (110) having a first end and a second end and having a first side and a second side. An antenna assembly (200) is provided in the low-profile housing. The antenna assembly includes a first cellular antenna (300) at the first end (212) and a second cellular antenna (400) at the second end (214). The antenna assembly includes a first ground element (240) at the first side (216) and a second ground element (260) at the second side (218). The first cellular antenna is operably coupled to the first ground element and the second cellular antenna is operably coupled to the second ground element. The first ground element is isolated from the second ground element.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:車用天線</p>
        <p type="p">120:基座；金屬基座</p>
        <p type="p">150:端部；第一端部</p>
        <p type="p">152:端部；第二端部</p>
        <p type="p">200:天線組件</p>
        <p type="p">210:基板</p>
        <p type="p">240:第一接地元件；接地元件</p>
        <p type="p">250:錐形邊緣；連接端部</p>
        <p type="p">252:連接端部；遠端；第一遠端</p>
        <p type="p">260:第二接地元件；接地元件</p>
        <p type="p">270:錐形邊緣；連接端部；第二連接端部</p>
        <p type="p">272:連接端部；遠端；第二遠端</p>
        <p type="p">300:蜂巢式天線；第一蜂巢式天線</p>
        <p type="p">310:貼片面板；第一貼片面板</p>
        <p type="p">360:短路引腳</p>
        <p type="p">400:蜂巢式天線；第二蜂巢式天線</p>
        <p type="p">410:貼片面板；第二貼片面板</p>
        <p type="p">430:饋源面板</p>
        <p type="p">432:饋源點</p>
        <p type="p">460:短路引腳</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1712" publication-number="202624970">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624970</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139416</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體裝置和系統</chinese-title>
        <english-title>MEMORY DEVICE AND SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G06F13/14</main-classification>
        <further-classification edition="200601120260302B">G06F13/38</further-classification>
        <further-classification edition="201601120260302B">G06F12/0866</further-classification>
        <further-classification edition="200601120260302B">G11C11/4063</further-classification>
        <further-classification edition="202601120260302B">H10W70/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張俊榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JOONYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴成哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SUNGCHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐永得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, YOUNGDUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張泰弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, TAEHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">記憶體裝置可包括記憶體晶粒堆疊，包括堆疊在其上的多個記憶體晶粒，以及位於記憶體晶粒堆疊下方的基底晶粒。基底晶粒可包括連接至記憶體晶粒堆疊的通孔介面電路；連接至處理器的晶粒對晶粒（D2D）介面電路；連接至外部記憶體裝置的記憶體介面電路；以及記憶體管理電路，用以控制記憶體晶粒堆疊和外部記憶體裝置之間的資料遷移；基於與儲存在記憶體晶粒堆疊中的第一資料相關的存取資訊，確定是否將第一資料從記憶體晶粒堆疊遷移至外部記憶體裝置，以及基於來自處理器的存取儲存在外部記憶體裝置上的第二資料的存取請求，將第二資料提供給處理器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory device may include a memory die stack including a plurality of memory dies stacked thereon、 and a base die under the memory die stack. The base die may include a via interface circuit connected to the memory die stack; a die-to-die (D2D) interface circuit connected to a processor; a memory interface circuit connected to an external memory device; and a memory management circuit configured to control data migration between the memory die stack and the external memory device、 based on access information related to first data stored in the memory die stack、 determine whether to migrate the first data from the memory die stack to the external memory device、 and based on an access request from the processor to access second data stored on the external memory device、 provide the second data to the processor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:系統</p>
        <p type="p">100:第一記憶體裝置</p>
        <p type="p">110:記憶體晶粒堆疊</p>
        <p type="p">120:基底晶粒</p>
        <p type="p">123:記憶體管理電路</p>
        <p type="p">124、320:D2D介面電路</p>
        <p type="p">126、220:記憶體介面電路</p>
        <p type="p">200:第二記憶體裝置</p>
        <p type="p">210:記憶體</p>
        <p type="p">300:邏輯晶粒</p>
        <p type="p">310:處理器</p>
        <p type="p">MD_1:第一記憶體晶粒</p>
        <p type="p">MD_2:第二記憶體晶粒</p>
        <p type="p">MD_N:第N記憶體晶粒</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1713" publication-number="202624881">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624881</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139442</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>反射型光罩空白基板、及反射型光罩的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260306B">G03F1/24</main-classification>
        <further-classification edition="201201120260306B">G03F1/26</further-classification>
        <further-classification edition="201201120260306B">G03F1/32</further-classification>
        <further-classification edition="201201120260306B">G03F1/54</further-classification>
        <further-classification edition="201201120260306B">G03F1/80</further-classification>
        <further-classification edition="200601120260306B">G03F7/20</further-classification>
        <further-classification edition="202601120260306B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川村亮人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAMURA, RYOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[解決手段] 一種反射型光罩空白基板，其具備：基板、反射曝光光的多層反射膜、多層反射膜的保護膜、及吸收曝光光並具有相位移功能的光吸收膜，光吸收膜含有5至15原子%的釕(Ru)及85至95原子%的鉻(Cr)，且不含有氧(O)及氮(N)，光吸收膜的厚度為40至56nm，光吸收膜之相對於曝光光的反射率為2至5%，相對於曝光光的相位差為200至230度。  &lt;br/&gt;　　[效果] 作為反射型光罩時，可提供具有晶圓轉印特性高(NILS之值大)、遮蔽效應之影響小之更薄的光吸收膜，且晶圓上之線與間隙圖案的間距之最佳焦點值的偏差小之反射型光罩空白基板，例如，在晶圓上之經微細化的線與間隙圖案中，賦予良好的圖案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板</p>
        <p type="p">2:多層反射膜</p>
        <p type="p">3:保護膜</p>
        <p type="p">4:光吸收膜</p>
        <p type="p">100:反射型光罩空白基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1714" publication-number="202624464">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624464</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139446</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>組成物、熱塑性液晶聚合物薄膜及彼等之製造方法</chinese-title>
        <english-title>COMPOSITION, THERMOPLASTIC LIQUID CRYSTAL POLYMER FILM, AND PRODUCTION METHODS THEREFOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C09K19/50</main-classification>
        <further-classification edition="200601120260302B">C08G63/547</further-classification>
        <further-classification edition="200601120260302B">C08L67/06</further-classification>
        <further-classification edition="200601120260302B">C08L101/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商可樂麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURARAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中島崇裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKASHIMA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>毛戶章博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KEDO, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種組成物，其係包含可形成光學異向性熔融相之聚合物的組成物，其中，&lt;br/&gt;  在前述組成物的熔點+15℃的溫度，使用裝設有平行板的旋轉流變儀，一邊使頻率從0.01rad/s開始增加一邊測定該組成物的熔融剪切黏度時，&lt;br/&gt;  在0.01rad/s至100rad/s的頻率範圍內，顯示出熔融剪切黏度η對測定頻率f增加之變化的微分值dη/df為0以上的熔融黏度特性區域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A composition including a polymer capable of forming optically anisotropic melt phase,&lt;br/&gt; wherein,&lt;br/&gt; when a melt shear viscosity of the composition is measured at a temperature of 15&lt;sup&gt;o&lt;/sup&gt;C higher than the melting point of the composition while increasing the frequency from 0.01 rad/s using a rotational rheometer equipped with a parallel plate,&lt;br/&gt; the composition shows a melt viscosity characteristics region observed in a frequency range of 0.01 rad/s to 100 rad/s such that a change of the melt shear viscosity η with increasing frequency f shown by a derivative dη/df of η with respect to f exhibits a dη/df value of not lower than 0 in the region.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1715" publication-number="202624293">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624293</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139451</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>硬化性樹脂組合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">C08F22/40</main-classification>
        <further-classification edition="200601120260306B">C08L79/08</further-classification>
        <further-classification edition="200601120260306B">C08L63/02</further-classification>
        <further-classification edition="200601120260306B">C07D207/448</further-classification>
        <further-classification edition="200601120260306B">C08K3/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井口洋之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IGUCHI, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堤吉弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUTSUMI, YOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>工藤雄貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUDO, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩真之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWASAKI, MASAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種硬化性樹脂組合物，可成為雖低相對介電常數、低介電損耗角正切，但以除膠渣溶液處理後與銅的剝離也少的硬化物。  &lt;br/&gt;一種硬化性樹脂組合物，含有：  &lt;br/&gt;(A)下述式(1)所示的環狀醯亞胺樹脂；  &lt;br/&gt;(B)下述式(2)所示的環狀醯亞胺樹脂；以及  &lt;br/&gt;(C)硬化觸媒。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="366px" width="647px" file="ed10023.JPG" alt="ed10023.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;式(1)及式(2)中，A獨立地表示包含環狀結構的4價有機基，Q獨立地表示碳數6以上的2價脂肪族烴基或源自二聚酸骨架的2價烴基，B獨立地表示碳數6以上伸芳基，X為氫原子或甲基，n&lt;sub&gt;1&lt;/sub&gt;為0～200，m&lt;sub&gt;1&lt;/sub&gt;為0～200，且n&lt;sub&gt;1&lt;/sub&gt;及m&lt;sub&gt;1&lt;/sub&gt;各自為滿足n&lt;sub&gt;1&lt;/sub&gt;+m&lt;sub&gt;1&lt;/sub&gt;為21～400的數，n&lt;sub&gt;2&lt;/sub&gt;為0～10，m&lt;sub&gt;2&lt;/sub&gt;為0～10，且n&lt;sub&gt;2&lt;/sub&gt;及m&lt;sub&gt;2&lt;/sub&gt;各自為滿足n&lt;sub&gt;2&lt;/sub&gt;+m&lt;sub&gt;2&lt;/sub&gt;為0～20的數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1716" publication-number="202624559">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624559</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139457</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>表面處理銅箔及使用該表面處理銅箔的覆銅層疊板以及印刷配線板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">C25D7/06</main-classification>
        <further-classification edition="200601120260311B">C25D5/12</further-classification>
        <further-classification edition="200601120260311B">C25D3/38</further-classification>
        <further-classification edition="200601120260311B">B32B15/20</further-classification>
        <further-classification edition="200601120260311B">B32B15/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商福田金屬箔粉工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUDA METAL FOIL &amp; POWDER CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡本健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMOTO, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮本健太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAMOTO, KENTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種表面處理銅箔，其具備耐熱處理層和鉻酸鹽處理層，不具備粗化處理層，其中，所述表面處理銅箔顯示優異的耐熱性及防鏽性，因為處理面的鎳及鉻的附著量少，所以異種金屬引起的導體損耗少，粗糙度低且也沒有粗化粒子引起的導體損耗，因此適用於在支持高速傳輸的印刷配線板中使用的覆銅層疊板。未處理銅箔表面的算術平均高度Sa低於0.27μm，展開界面面積率Sdr低於6%，將根據所述Sdr計算出的表面積比設為A、將所述表面處理銅箔處理面的每1m&lt;sup&gt;2&lt;/sup&gt;二維面積的鎳附著量(mg)設為B時的每1m&lt;sup&gt;2&lt;/sup&gt;表面積的鎳附著量[B/A]為5mg～31mg，將所述處理面的所述表面處理銅箔處理面的每1m&lt;sup&gt;2&lt;/sup&gt;二維面積的鉻附著量(mg)設為C時的每1m&lt;sup&gt;2&lt;/sup&gt;表面積的鉻附著量[C/A]為1mg～4mg。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1717" publication-number="202625385">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625385</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139479</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>錯誤校正碼解碼器中軟度量之壓縮</chinese-title>
        <english-title>COMPRESSION OF SOFT METRICS IN ECC DECODERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">H03M13/11</main-classification>
        <further-classification edition="200601120260305B">H03M13/00</further-classification>
        <further-classification edition="200601120260305B">H03M7/30</further-classification>
        <further-classification edition="200601120260305B">H04L1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商瑞泰姆公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RETYM, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施羅　班</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHILO, BEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡素圖　俞沃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CASSUTO, YUVAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恩霍　米查</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANHOLT, MICHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種設備(20)包含一壓縮器(40)、一記憶體(24)、一解壓縮器(32)及一解碼器(36)。該壓縮器經組態以接收一錯誤校正碼(ECC)之一碼字之位元之軟度量，且將一群組之該等軟度量轉換成一經壓縮表示(28)，該群組包含與同一符號相關聯之位元之兩個或更多個軟度量。該記憶體經組態以儲存該經壓縮表示。該解壓縮器經組態以自該記憶體讀取該經壓縮表示，且解壓縮該經壓縮表示以便產生經解壓縮軟度量。該解碼器經組態以使用該等經解壓縮軟度量來對該碼字進行解碼。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus (20) includes a compressor (40), a memory (24), a decompressor (32) and a decoder (36). The compressor is configured to receive soft metrics of bits of a codeword of an Error Correction Code (ECC), and to convert a group of the soft metrics, which includes two or more soft metrics of bits associated with the same symbol, into a compressed representation (28). The memory is configured to store the compressed representation. The decompressor is configured to read the compressed representation from the memory and to decompress the compressed representation so as to produce decompressed soft metrics. The decoder is configured to decode the codeword using the decompressed soft metrics.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:迭代錯誤校正碼(ECC)解碼器/迭代解碼器/解碼器</p>
        <p type="p">24:記憶體</p>
        <p type="p">28:經壓縮表示</p>
        <p type="p">32:解壓縮器</p>
        <p type="p">36:解碼器</p>
        <p type="p">40:壓縮器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1718" publication-number="202625493">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625493</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139488</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無線通訊設備、方法和系統</chinese-title>
        <english-title>WIRELESS COMMUNICATION DEVICE, METHOD AND SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120260305B">H04W74/0816</main-classification>
        <further-classification edition="200901120260305B">H04W28/06</further-classification>
        <further-classification edition="202301120260305B">H04W72/54</further-classification>
        <further-classification edition="202201120260305B">H04L47/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳國威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUO-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許家榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIA-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦頤隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIN, YI-LON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張致行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃坤聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, KUN-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種無線通訊方法和設備。第一無線通訊設備確定延遲敏感業務的發送時間邊界。接收來自第二無線通訊設備的業務傳輸請求幀，其中業務傳輸請求幀包含持續時間資訊，指示第二無線通訊設備期望佔用信道的持續時間段。回應於確定持續時間段超過發送時間邊界且從第二無線通訊設備至第一無線通訊設備的業務是延遲不敏感的，第一無線通訊設備決定不向第二無線通訊設備回應業務傳輸許可幀。在發送時間邊界之前，第一無線通訊設備向第二無線通訊設備或至少一個第三無線通訊設備發送延遲敏感業務。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The application discloses a wireless communication method and device. A first wireless communication device determines a transmission time boundary for latency sensitive traffic. A traffic transmission request frame from a second wireless communication device is received, wherein the traffic transmission request frame includes a duration information indicating a duration period during which the second wireless communication device expects to occupy a channel. In response to a determination that the duration period exceeds the transmission time boundary and traffic from the second wireless communication device to the first wireless communication device is latency non-sensitive, the first wireless communication device decides not to send a traffic transmission permission frame to the second wireless communication device. The latency sensitive traffic is transmitted from the first wireless communication device to the second wireless communication device or at least one third wireless communication device before the transmission time boundary.</p>
      </isu-abst>
      <representative-img>
        <p type="p">810、820、830、840:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1719" publication-number="202623944">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623944</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139561</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>異常檢測方法、異常檢測裝置及記錄媒體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260310B">B23Q17/22</main-classification>
        <further-classification edition="200601120260310B">G05B19/402</further-classification>
        <further-classification edition="200601120260310B">G05B23/02</further-classification>
        <further-classification edition="200601120260310B">G11C14/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商神戶製鋼所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KABUSHIKI KAISHA KOBE SEIKO SHO (KOBE STEEL, LTD.)</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人大阪大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE UNIVERSITY OF OSAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北一貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITA, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>司
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NARAZAKI, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斎藤原聡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO HARA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的異常檢測方法，係取得表示工作機械的加工工序時之主軸的負載之主軸負載資料及用以特定前述加工工序的工序特定資料，選擇對應於透過前述工序特定資料來特定的前述加工工序之表示正常時的時間與負載的關係之正常模型，並使用根據前述主軸負載資料與前述正常模型的差值來計算出的1或是多個特徵量，來檢測前述加工工序的異常。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:異常檢測裝置</p>
        <p type="p">2:工作機械</p>
        <p type="p">3:資料收集裝置</p>
        <p type="p">10:控制部</p>
        <p type="p">11:加工資料取得部</p>
        <p type="p">12:工序特定部</p>
        <p type="p">13:正常模型選擇部</p>
        <p type="p">14:位置偏移判定部</p>
        <p type="p">15:異常檢測部</p>
        <p type="p">16:簡易負載判定部</p>
        <p type="p">17:正常模型更新部</p>
        <p type="p">18:判定資訊記憶部</p>
        <p type="p">19:正常模型記憶部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1720" publication-number="202624512">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624512</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139571</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>循環帶電粒子束輔助濺鍍裝置及循環帶電粒子束輔助蝕刻裝置</chinese-title>
        <english-title>CYCLIC CHARGED PARTICLE BEAM ASSIST SPUTTERING APPARATUS AND CYCLIC CHARGED PARTICLE BEAM ASSIST ETCHING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">C23C14/34</main-classification>
        <further-classification edition="200601120260312B">C23C14/35</further-classification>
        <further-classification edition="200601120260312B">C23C14/46</further-classification>
        <further-classification edition="200601120260312B">C23C14/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商因福威恩股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INFOVION INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金容煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YONG HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金賢祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HYEON WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種循環帶電粒子束輔助濺鍍裝置及循環帶電粒子束輔助蝕刻裝置。循環帶電粒子束輔助濺鍍裝置具備：帶電粒子束源，其以向真空腔室之內部照射帶電粒子束之方式構成；及控制模組，其以如下方式構成，即，對分別施加至上述帶電粒子束源及上述靶材之第1及第2脈衝電壓進行控制，從而使離子生成週期與靶材濺鍍週期同步並彼此交替地進行。於離子生成週期內，向帶電粒子束源施加預先設定之帶電粒子束偏壓來提供帶電粒子束，藉由帶電粒子束與氣體粒子之碰撞而產生離子。於靶材濺鍍週期內，向靶材施加預先設定之靶材偏壓，從而將產生之上述離子吸引至靶材來濺鍍靶材，濺鍍之靶材粒子蒸鍍於基板上。施加至帶電粒子束源之第1脈衝電壓與施加至基板之第2脈衝電壓以同步並彼此交替之方式構成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:輔助濺鍍裝置</p>
        <p type="p">200:腔室</p>
        <p type="p">210:靶材</p>
        <p type="p">220:基板</p>
        <p type="p">230:帶電粒子束源</p>
        <p type="p">260:帶電粒子束路徑引導模組</p>
        <p type="p">262:電磁鐵</p>
        <p type="p">264:陽極</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1721" publication-number="202624306">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624306</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139638</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>研磨組合物和共聚物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08F220/30</main-classification>
        <further-classification edition="200601120260302B">C08F220/36</further-classification>
        <further-classification edition="200601120260302B">C08F220/54</further-classification>
        <further-classification edition="200601120260302B">C08F220/58</further-classification>
        <further-classification edition="200601120260302B">C08F220/60</further-classification>
        <further-classification edition="200601120260302B">C08F226/10</further-classification>
        <further-classification edition="200601120260302B">C09G1/02</further-classification>
        <further-classification edition="200601120260302B">C09K3/14</further-classification>
        <further-classification edition="201201120260302B">B24B37/00</further-classification>
        <further-classification edition="201201120260302B">B24B37/04</further-classification>
        <further-classification edition="202601120260302B">H10P52/00</further-classification>
        <further-classification edition="202601120260302B">H10P95/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大阪有機化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSAKA ORGANIC CHEMICAL INDUSTRY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>學校法人立命館</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE RITSUMEIKAN TRUST</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西山賢大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIYAMA, KENTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村田順二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURATA, JUNJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種研磨組合物，包含共聚物、磨粒和水系介質，該共聚物至少具有式（A）表示的結構單元（A）和具有親水性結構的結構單元（B），&lt;br/&gt;&lt;img align="absmiddle" height="272px" width="262px" file="ed10022.JPG" alt="ed10022.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;  ［式（A）中，&lt;br/&gt;  X&lt;sup&gt;1&lt;/sup&gt;表示-N（-H）-或-O-，&lt;br/&gt;  R&lt;sup&gt;1&lt;/sup&gt;～R&lt;sup&gt;5&lt;/sup&gt;各自獨立地表示氫原子或-OH，其中，R&lt;sup&gt;1&lt;/sup&gt;～R&lt;sup&gt;5&lt;/sup&gt;中的鄰接的至少2個表示-OH，&lt;br/&gt;  R&lt;sup&gt;6&lt;/sup&gt;表示可以具有取代基的碳原子數1～7的直鏈狀或支鏈狀的亞烷基或亞烯基，該亞烷基或亞烯基中包含的1個或2個以上的-CH&lt;sub&gt;2&lt;/sub&gt;-可以被-O-、-C（＝O）-O-、-O-C（＝O）-、-CH（-OH）-或-C（＝O）-取代，&lt;br/&gt;  R&lt;sup&gt;7&lt;/sup&gt;表示氫原子或甲基］。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1722" publication-number="202625789">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625789</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139648</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於乾蝕刻設備的保護襯墊構件及包括其的乾蝕刻設備</chinese-title>
        <english-title>PROTECTIVE LINER MEMBER FOR DRY ETCHING APPARATUS AND DRY ETCHING APPARATUS INCLUDING SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260312B">H10P95/00</main-classification>
        <further-classification edition="202601120260312B">H10P50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＡＰ系统股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AP SYSTEMS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張晋寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, JIN NYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>兪炯碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOO, HYEONG SUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李鍾和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JONG HWA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李相憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SANG HEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張潤成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, YUN SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金學來</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HAK RAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曺成俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, SEONG JOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提出一種用於乾蝕刻設備的保護性襯墊構件及包含該保護性襯墊構件的乾蝕刻設備。用於乾蝕刻設備的保護性襯墊構件可以設置在乾蝕刻設備的製程腔室中，使得保護性襯墊構件保護製程腔室的至少一內表面免於蝕刻製程環境的影響，並且可包括選自鈦及氫化鈦中的至少一種。選自鈦及氫化鈦中的至少一種可以經設置使得能被暴露於蝕刻製程環境或被定位相鄰於蝕刻製程環境。氫化鈦可包括TiH&lt;sub&gt;2&lt;/sub&gt;。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Proposed are a protective liner member for a dry etching apparatus and a dry etching apparatus including the protective liner member. The protective liner member for the dry etching apparatus may be disposed in a process chamber of the dry etching apparatus such that the protective liner member protects at least an inner surface of the process chamber from an etching process environment, and may include at least one selected from titanium and titanium hydride. At least one selected from the titanium and the titanium hydride may be disposed so as to be exposed to or positioned adjacent to the etching process environment. The titanium hydride may include TiH&lt;sub&gt;2&lt;/sub&gt;.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板結構</p>
        <p type="p">100:製程腔室</p>
        <p type="p">150:製程氣體供應部分</p>
        <p type="p">200:基板支架</p>
        <p type="p">210:溫度控制部分</p>
        <p type="p">220:電源供應裝置</p>
        <p type="p">230:匹配器</p>
        <p type="p">300:電漿產生單元</p>
        <p type="p">450:真空泵</p>
        <p type="p">500:保護性襯墊構件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1723" publication-number="202625417">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625417</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139665</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於保護資料之裝置及用於保護資料之方法</chinese-title>
        <english-title>APPARATUS FOR PROTECTING DATA AND METHOD FOR PROTECTING DATA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260305B">H04L47/24</main-classification>
        <further-classification edition="202201120260305B">H04L9/40</further-classification>
        <further-classification edition="202201120260305B">H04L69/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商瑞薩電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RENESAS ELECTRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬德穆勒　克里斯坦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARDMOLLER, CHRISTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝里茲　托比亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BELITZ, TOBIAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述一種用於在一基於訊框之通信鏈路之一傳輸側處保護資料訊框之裝置及方法。該裝置包含一密碼套件模組。該密碼套件模組接收該資料訊框，且若該資料訊框係一優先級資料訊框，則基於一第一密碼編譯金鑰保護該資料訊框，且若該資料訊框係一非優先級資料訊框，則基於一第二密碼編譯金鑰保護該資料訊框。該非優先級資料訊框係可由係該優先級資料訊框之一資料訊框中斷其傳輸之一資料訊框。在保護該資料訊框之後，該密碼套件模組提供該受保護資料訊框以透過該基於訊框之通信鏈路進行傳輸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Apparatus and method for protecting data frames at a transmission side of a frame-based communication link are described. The apparatus includes a cipher suite module. The cipher suite module receives the data frame and protects the data frame based on a first cryptographic key if the data frame is a priority data frame and protects the data frame based on a second cryptographic key if the data frame is a non-priority data frame. The non-priority data frame is a data frame for which transmission can be interrupted by a data frame that is the priority data frame. After protecting the data frame, the cipher suite module provides the protected data frame for transmission over the frame-based communication link.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:裝置</p>
        <p type="p">101:密碼套件模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1724" publication-number="202624872">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624872</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139666</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>相機裝置</chinese-title>
        <english-title>A CAMERA DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260309B">G03B17/28</main-classification>
        <further-classification edition="202101120260309B">G03B17/32</further-classification>
        <further-classification edition="202101120260309B">G03B17/55</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞典商安訊士有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AXIS AB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林德　法比恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIND, FABIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹奈里爾斯　瓊斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DANELIUS, JONS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澤伊努拉胡　阿爾比亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZEJNULLAHU, ARBIAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡里達　德斯皮娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARIDA, DESPINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韋德馬克　潔西卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEDMARK, JESSICA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳弈錡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種相機裝置，其包括：設置有一第一接地接觸面之一第一印刷電路板(PCB)段、設置有由形成一第二接地接觸面之一第二PCB段之一部分所限定之一開口之第二PCB段、由一導電材料製成之一機架、由一導電材料製成並卡扣配合至該機架之一夾子；其中該機架經構形以支撐一影像感測器及該第一及第二PCB段，其中該第一PCB段配置於該機架與該第二PCB段之間，  &lt;br/&gt;其中該夾子包括鄰接該第一PCB段之該第一接地接觸面之一第一接觸部分；及延伸穿過該第二PCB段之該開口並接合其之該第二接地接觸面之一第二接觸部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A camera device comprising a first printed circuit board (PCB) segment provided with a first grounding contact surface, a second PCB segment provided with an opening defined by a portion of the second PCB segment forming a second grounding contact surface, a chassis made of an electrically conductive material, a clip made of an electrically conductive material and snap fitted to the chassis; wherein the chassis is configured to support an image sensor and the first and second PCB segment, wherein the first PCB segment is arranged between the chassis and the second PCB segment, &lt;br/&gt;wherein the clip comprises a first contact portion abutting the first grounding contact surface of the first PCB segment; and a second contact portion extending through the opening of the second PCB segment and engaging the second grounding contact surface thereof.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:相機裝置</p>
        <p type="p">10:第一PCB段</p>
        <p type="p">12:第一接地接觸面</p>
        <p type="p">20:第二PCB段</p>
        <p type="p">21:開口</p>
        <p type="p">22:第二接地接觸面</p>
        <p type="p">30:第三PCB段</p>
        <p type="p">40:機架</p>
        <p type="p">50:夾子</p>
        <p type="p">51:第一接觸部分</p>
        <p type="p">52:第二接觸部分</p>
        <p type="p">60:散熱部件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1725" publication-number="202625808">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625808</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139676</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用自密封環之機械式無應力接觸以透過劃線通道測試核心晶粒</chinese-title>
        <english-title>TESTING CORE DIE THROUGH A SCRIBE LANE WITH MECHANICAL STRESS-FREE ACCESS FROM A SEAL RING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260309B">H10W20/40</main-classification>
        <further-classification edition="202601120260309B">H10W20/42</further-classification>
        <further-classification edition="202601120260309B">H10W72/00</further-classification>
        <further-classification edition="202601120260309B">H10W76/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝達羅格魯　默斯塔法</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BADAROGLU, MUSTAFA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布斯　羅傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOOTH, ROGER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　曉楠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, XIAONAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康　宇泰格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, WOO TAG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　中澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZHONGZE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曲丹巴瑞　派瑞安南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIDAMBARAM, PERIANNAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述一種晶粒。該晶粒包括在該晶粒的一周邊上的一第一密封環，該第一密封環包圍該晶粒的一核心。該晶粒亦包括一或多個橋接互連結構，其跨該第一密封環以將一信號從該第一密封環外部的一測試墊路由至該核心中的一電路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A die is described. The die includes a first seal ring on a periphery of the die, which encloses a core of the die. The die also includes one or more bridge interconnect structures across the first seal ring to route a signal from a test pad outside of the first seal ring to a circuit in the core.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:佈局圖</p>
        <p type="p">202:晶圓</p>
        <p type="p">204:劃線通道</p>
        <p type="p">206:習知晶圓測試結構</p>
        <p type="p">210:晶粒</p>
        <p type="p">220:密封環</p>
        <p type="p">230:核心晶粒</p>
        <p type="p">232:精細間距堆疊結構</p>
        <p type="p">240:橋接互連結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1726" publication-number="202624062">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624062</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139679</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於嬰兒載具之覆蓋物</chinese-title>
        <english-title>COVER FOR BABY CARRIER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">B62B9/12</main-classification>
        <further-classification edition="200601120260304B">A47D13/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉一平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, I-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭郁璇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, YU- HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾祖華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, CHU-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>珍妮弗Ｅ　雪兒德里克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JENNIFER E, SHELDRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛蒂　伯基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CINDY, BERKEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛蒂　雷伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CINDY, REPPERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種兒童載具系統包括一兒童載具及一覆蓋物，該兒童載具具有用於將該兒童載具連接至一看護者之身體的一攜帶背帶，該覆蓋物可附接至該兒童載具。該覆蓋物包括接近該覆蓋物之一第一橫向側的一第一耦接機構及接近該覆蓋物之一第二橫向側的一第二耦接機構。該第一耦接機構及該第二耦接機構中之各者皆可圍繞該兒童載具之一部分延伸以將該覆蓋物附接至該兒童載具。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A child carrier system includes a child carrier having a carrying harness for connecting the child carrier to a caregiver's body and a cover attachable to the child carrier. The cover includes a first coupling mechanism proximate a first lateral side of the cover and a second coupling mechanism proximate a second lateral side of the cover. Each of the first coupling mechanism and the second coupling mechanism is extendable about a portion of the child carrier to attach the cover to the child carrier.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:覆蓋物</p>
        <p type="p">102:主體</p>
        <p type="p">104:後部</p>
        <p type="p">110:第二橫向側</p>
        <p type="p">120:第一材料面板</p>
        <p type="p">130:縫線</p>
        <p type="p">132:底端</p>
        <p type="p">134:上端</p>
        <p type="p">144:兜帽</p>
        <p type="p">146:口袋</p>
        <p type="p">148:第一孔</p>
        <p type="p">150:第二孔</p>
        <p type="p">152:儲存口袋</p>
        <p type="p">154:耦接機構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1727" publication-number="202624112">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624112</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139686</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>束狀碳奈米管及其製造方法</chinese-title>
        <english-title>BUNDLE-TYPE CARBON NANOTUBES AND METHOD FOR MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260312B">C01B32/158</main-classification>
        <further-classification edition="201701120260312B">C01B32/162</further-classification>
        <further-classification edition="201701120260312B">C01B32/174</further-classification>
        <further-classification edition="201001120260312B">H01M4/583</further-classification>
        <further-classification edition="201001120260312B">H01M10/05</further-classification>
        <further-classification edition="200601120260312B">B82B3/00</further-classification>
        <further-classification edition="201101120260312B">B82Y30/00</further-classification>
        <further-classification edition="201101120260312B">B82Y40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG CHEM, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金成真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNG JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金世賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SE HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金緣伊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YEONYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金榮柱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YOUNG JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜賢俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, HYUN JOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金韓娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HANNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李東明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DONG MYEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃銖賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, SUHYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於新穎的碳奈米管，其具有優異的導電性以及優越的儲存及運輸效率，以及生產該碳奈米管之方法，碳奈米管分散液，含有該碳奈米管的電極結構，及包含該碳奈米管的二次電池。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to novel carbon nanotubes having excellent electrical conductivity as well as superior storage and transport efficiency, a method for producing the carbon nanotubes, a carbon nanotube dispersion, an electrode structure containing the carbon nanotubes, and a secondary battery comprising the carbon nanotubes.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1728" publication-number="202624222">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624222</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139687</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>CCR6受體調節劑</chinese-title>
        <english-title>CCR6 RECEPTOR MODULATORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">C07D401/14</main-classification>
        <further-classification edition="200601120260312B">C07D401/06</further-classification>
        <further-classification edition="200601120260312B">C07D405/14</further-classification>
        <further-classification edition="200601120260312B">C07D417/14</further-classification>
        <further-classification edition="200601120260312B">C07D413/14</further-classification>
        <further-classification edition="200601120260312B">A61K31/4439</further-classification>
        <further-classification edition="200601120260312B">A61K31/4433</further-classification>
        <further-classification edition="200601120260312B">A61K31/444</further-classification>
        <further-classification edition="200601120260312B">A61K31/4427</further-classification>
        <further-classification edition="200601120260312B">A61P29/00</further-classification>
        <further-classification edition="200601120260312B">A61P37/00</further-classification>
        <further-classification edition="200601120260312B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商愛杜西亞製藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IDORSIA PHARMACEUTICALS LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾利曼　奧莉薇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALLEMANN, OLIVER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡洛芙　伊娃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAROFF, EVA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查曼頓　阿沛爾　亞力克西亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAVANTON-ARPEL, ALEXIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克羅克斯福德　安卓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CROXFORD, ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡布勒　法蘭西斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUBLER, FRANCIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑克柏　路易克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JACOB, LOIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅耶　艾曼紐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEYER, EMMANUEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>理查　比得史登　席微亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHARD-BILDSTEIN, SYLVIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於式(I)化合物、其合成及其作為CCR6受體調節劑用於治療或預防各種疾病、病狀或病症之用途。  &lt;br/&gt;&lt;img align="absmiddle" height="131px" width="177px" file="ed10019.JPG" alt="ed10019.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to compounds of Formula (I), their synthesis and use as CCR6 receptor modulators for the treatment or prevention of various diseases, conditions or disorders. &lt;br/&gt;&lt;img align="absmiddle" height="134px" width="173px" file="ed10020.JPG" alt="ed10020.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1729" publication-number="202625752">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625752</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139723</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260310B">H10P72/30</main-classification>
        <further-classification edition="200601120260310B">B25J13/08</further-classification>
        <further-classification edition="200601120260310B">B25J18/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新藤健弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINDO, TAKEHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在具有垂直多關節臂之搬送機構中適當地修正在該垂直多關節臂產生熱膨脹時的基板的搬送狀態。  &lt;br/&gt;   一種基板處理裝置，係處理基板，具有：搬送機構，係搬送該基板；以及控制部，係控制該搬送機構；該搬送機構係具有：保持臂，係保持該基板；以及垂直多關節臂，係支撐該保持臂，且會往至少垂直方向移動；該控制部係在該垂直多關節臂產生熱膨脹時執行下述控制：修正該保持臂的基準位置，且修正該保持臂在保持面的水平度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">30:搬送機構</p>
        <p type="p">31:保持臂</p>
        <p type="p">32:水平多關節臂</p>
        <p type="p">33:垂直多關節臂</p>
        <p type="p">34:支撐構件</p>
        <p type="p">100:拾取器</p>
        <p type="p">110:第1水平臂</p>
        <p type="p">111:第2水平臂</p>
        <p type="p">140:連接構件</p>
        <p type="p">150:第1垂直臂</p>
        <p type="p">151:第2垂直臂</p>
        <p type="p">160:第1垂直關節</p>
        <p type="p">161:第2垂直關節</p>
        <p type="p">162:第3垂直關節</p>
        <p type="p">W:晶圓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1730" publication-number="202624645">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624645</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139744</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>旋轉缸及其使用方法</chinese-title>
        <english-title>ROTARY CYLINDER AND USING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260308B">F16J15/447</main-classification>
        <further-classification edition="200601120260308B">B23Q11/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商北川鐵工所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAGAWA IRON WORKS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西宮民和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMIYA, TAMIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案之課題為提供一種可降低能量損失之旋轉缸及其使用方法。根據本案，提供一種油壓式旋轉缸，具備基座以及構成為相對於該基座可相對旋轉之旋轉體，且具備空氣供給部，在該旋轉體與該基座對向之對向區域設有間隙，該空氣供給部構成為可經由該基座向該間隙供給加壓空氣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:旋轉缸</p>
        <p type="p">2AR、2AL:第一埠</p>
        <p type="p">2BR、2BL:第二埠</p>
        <p type="p">11:排出路徑</p>
        <p type="p">11A:分歧部</p>
        <p type="p">12:油箱</p>
        <p type="p">13:泵</p>
        <p type="p">14:作動油供給部</p>
        <p type="p">15:空氣供給部</p>
        <p type="p">15A:工廠氣源</p>
        <p type="p">15B:止回閥</p>
        <p type="p">16:排氣部</p>
        <p type="p">23:下部本體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1731" publication-number="202625234">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625234</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139770</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>保護元件及電池組</chinese-title>
        <english-title>PROTECTION ELEMENT AND BATTERY PACK</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">H01H85/18</main-classification>
        <further-classification edition="200601120260312B">H01H85/165</further-classification>
        <further-classification edition="202101120260312B">H01M50/583</further-classification>
        <further-classification edition="202101120260312B">H01M50/581</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商迪睿合股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEXERIALS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戶端真理奈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOBATA, MARINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>向幸市</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUKAI, KOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可確保保險絲元件熔斷後之絕緣性之保護元件。  &lt;br/&gt;本發明之保護元件具備絕緣基板2、設於絕緣基板2之發熱體6、被覆發熱體6之絕緣層7、設於絕緣基板2之表面且與發熱體6電性連接之中間電極4、搭載於中間電極4之保險絲元件3、及覆蓋絕緣基板2之表面2a側之蓋構件5，蓋構件5係含有絕緣性無機填充材料之樹脂組合物之成形品，絕緣性無機填充材料為玻璃纖維磨碎纖維，樹脂組合物中，玻璃纖維磨碎纖維之填充量為35重量%以上45重量%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:保護元件</p>
        <p type="p">2:絕緣基板</p>
        <p type="p">2a:表面</p>
        <p type="p">2b:背面</p>
        <p type="p">3:保險絲元件</p>
        <p type="p">4:中間電極</p>
        <p type="p">5:蓋構件</p>
        <p type="p">5a:頂面</p>
        <p type="p">6:發熱體</p>
        <p type="p">6a:一端部</p>
        <p type="p">6b:另一端部</p>
        <p type="p">7:絕緣層</p>
        <p type="p">8:第1發熱體電極</p>
        <p type="p">9:第2發熱體電極</p>
        <p type="p">10:第3外部連接電極</p>
        <p type="p">11:第1電極</p>
        <p type="p">12:第2電極</p>
        <p type="p">15:第1外部連接電極</p>
        <p type="p">16:第2外部連接電極</p>
        <p type="p">17:第2引出電極</p>
        <p type="p">18:第2引出電極</p>
        <p type="p">19:助焊劑</p>
        <p type="p">40:導電連接材料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1732" publication-number="202624424">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624424</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139774</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>阻燃熱塑性聚氨酯</chinese-title>
        <english-title>FLAME RETARDANT THERMOPLASTIC POLYURETHANE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">C09D175/14</main-classification>
        <further-classification edition="200601120260312B">C08L75/16</further-classification>
        <further-classification edition="200601120260312B">C07C265/14</further-classification>
        <further-classification edition="200601120260312B">C08K5/5317</further-classification>
        <further-classification edition="200601120260312B">C09D5/18</further-classification>
        <further-classification edition="200601120260312B">C09D5/25</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商巴斯夫歐洲公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASF SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亨茲　奧列佛　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HENZE, OLIVER STEFFEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆瑞恩　奧利弗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUEHREN, OLIVER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於組成物(C1)，其包含熱塑性聚氨酯(TPU-1)；至少一種含磷添加物(PA-1)，其選自由異次磷酸、異亞磷酸及磷酸之衍生物組成的群組；及至少一種層狀矽酸鹽(SA-1)。本發明另外關於包含所述組成物的模製體以及根據本發明的組成物之用於製造模製體（尤其電纜護套）的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a composition (C1) comprising a thermoplastic polyurethane (TPU-1); at least one phosphorous containing additive (PA-1) selected from the group consisting of derivatives of phosphinic acid, phosphonic acid and phosphoric acid; and at least one layered silicate (SA-1). The present invention furthermore relates to a molded body, comprising said composition as well as the use of the composition according to the present invention for producing a molded body, in particular a cable sheathing.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1733" publication-number="202624128">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624128</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139777</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氧化鈦膜及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">C01G23/047</main-classification>
        <further-classification edition="201501120260312B">G02B1/111</further-classification>
        <further-classification edition="201501120260312B">G02B1/115</further-classification>
        <further-classification edition="200601120260312B">C23C16/40</further-classification>
        <further-classification edition="200601120260312B">C23C14/14</further-classification>
        <further-classification edition="201301120260312B">G06F21/84</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林雄二郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHI, YUJIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中島一裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAJIMA, KAZUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荻田拓哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGITA, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉本皓輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIMOTO, KOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長命翔太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOMEI, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之氧化鈦膜(1)包含於利用穿透式電子顯微鏡觀察到之電子束繞射像中出現Ti&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;之繞射斑點群之結晶，且入射波長550 nm之光時之折射率超過2.50且為2.80以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:氧化鈦膜</p>
        <p type="p">2:基材</p>
        <p type="p">21:透明樹脂膜</p>
        <p type="p">22:硬化樹脂層</p>
        <p type="p">23:保護層</p>
        <p type="p">X:積層體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1734" publication-number="202624352">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624352</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139781</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感光性樹脂組合物及硬化浮凸圖案之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08G73/10</main-classification>
        <further-classification edition="200601120260302B">C08G73/12</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/027</further-classification>
        <further-classification edition="200601120260302B">G03F7/031</further-classification>
        <further-classification edition="200601120260302B">G03F7/038</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="200601120260302B">G03F7/40</further-classification>
        <further-classification edition="202601120260302B">H10P14/68</further-classification>
        <further-classification edition="202601120260302B">H10W20/48</further-classification>
        <further-classification edition="202601120260302B">H10W70/09</further-classification>
        <further-classification edition="202601120260302B">H10W70/60</further-classification>
        <further-classification edition="202601120260302B">H10W72/00</further-classification>
        <further-classification edition="202601120260302B">H10W74/01</further-classification>
        <further-classification edition="202601120260302B">H10W74/47</further-classification>
        <further-classification edition="202601120260302B">H10W90/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商旭化成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水建樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, TAKEKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種感光性樹脂組合物，其用於面板級封裝製程，且包含：  &lt;br/&gt;(A)選自由(A-1)聚醯亞胺前驅物及(A-2)聚醯亞胺所組成之群中之至少1種：100質量份；  &lt;br/&gt;(B)光聚合起始劑：0.5～20質量份；及  &lt;br/&gt;(C)有機溶劑：300～800質量份；  &lt;br/&gt;上述(B)光聚合起始劑包含下述通式(1)或通式(2)所表示之化合物：  &lt;br/&gt;&lt;img align="absmiddle" height="223px" width="620px" file="ed10059.JPG" alt="ed10059.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式中，Ra～Rf如說明書所定義)，於23℃下利用E型黏度計測得之黏度為0.02～1.0 Pa・s。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1735" publication-number="202625306">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625306</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139839</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接器、連接器單元、以及連接至連接器中之連接基板的方法</chinese-title>
        <english-title>CONNECTOR, CONNECTOR UNIT, AND METHOD FOR CONNECTING TO CONNECTION SUBSTRATE IN CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120251023B">H01R12/79</main-classification>
        <further-classification edition="200601120251023B">H01R13/639</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本航空電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAPAN AVIATION ELECTRONICS INDUSTRY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中幸貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, YUKITAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戶田健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TODA, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種連接器，其有助於改善訊號傳輸特性。根據本發明所揭示的連接器，其包括：接觸元件，其包括用於保持第一接觸件組及第二接觸件組的絕緣件。該絕緣件包括：用於保持該第一接觸件組及該第二接觸件組的本體、從該本體突出的突出部、與連接基板的卡合部卡合的被卡合部、以及與該連接基板的側表面接觸的接觸部。該被卡合部夾持該連接基板的側部。連接至該連接基板的該第一接觸件組及該第二接觸件組的各個端部，以該端部從該絕緣件突出的狀態設置於該突出部之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A connector that contributes to improving signal transmission characteristics is provided. A connector according to the present disclosure includes a contact assembly including an insulating member that holds a first contact group and a second contact group. The insulating member includes a main body holding the first contact group and the second contact group, protruding parts protruded from the main body, engaged parts with which engaging parts of the connection substrate are engaged, and contacting parts that are in contact with side surfaces of the connection substrate. The engaged parts sandwich side parts of the connection substrate. End parts of each of the first contact group and the second contact group connected to the connection substrate are disposed between the protruding parts in a state in which the end parts are protruded from the insulating member.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:連接器單元</p>
        <p type="p">11:殼體</p>
        <p type="p">12:接觸元件</p>
        <p type="p">2:連接器</p>
        <p type="p">21:第一接觸件組</p>
        <p type="p">23:絕緣件</p>
        <p type="p">23b:突出部</p>
        <p type="p">23f:被卡合部</p>
        <p type="p">24:接觸件</p>
        <p type="p">3:連接基板</p>
        <p type="p">3a:硬質柔性基板部</p>
        <p type="p">3b:柔性基板部</p>
        <p type="p">32a:焊盤</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1736" publication-number="202625515">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625515</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139841</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板及連接器單元</chinese-title>
        <english-title>SUBSTRATE AND CONNECTOR UNIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251124B">H05K1/11</main-classification>
        <further-classification edition="200601120251124B">H05K1/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本航空電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAPAN AVIATION ELECTRONICS INDUSTRY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中幸貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, YUKITAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戶田健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TODA, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種具有柔性的基板。本發明的一實施例的基板，其包括：第1基板部，其在折疊的柔性基板的折疊部之間設置有增強構件，所述柔性基板包括具有切口的第1部分及從所述第1部分延伸的第2部分，且所述第2部分的遠端部設置於所述第1部分的所述切口內；第2基板部，其所述第1部分的所述切口側的所述柔性基板部分及所述第2部分的所述遠端部的所述柔性基板重疊於剛性基板；以及柔性部，其設置於所述柔性基板中的所述第1基板部與所述第2基板部之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A substrate having flexibility is provided. A substrate according to one embodiment of the present disclosure includes: a first substrate part in which a reinforcing member is disposed between folded parts of a folded flexible substrate, the flexible substrate including a first part having a cutout and a second part extending from the first part, a distal end part of the second part being disposed inside the cutout of the first part; a second substrate part in which a part of the flexible substrate on a side of the cutout of the first part and the distal end part of the second part the flexible substrate overlap a rigid substrate; and a flexible part disposed between the first substrate part and the second substrate part in the flexible substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:連接器單元</p>
        <p type="p">11:柔性基板</p>
        <p type="p">11c:第1電極墊</p>
        <p type="p">11m:突出部</p>
        <p type="p">12:增強構件</p>
        <p type="p">12a:卡合部</p>
        <p type="p">13:剛性基板</p>
        <p type="p">13a:電極墊</p>
        <p type="p">2:基板</p>
        <p type="p">2a:第1基板部</p>
        <p type="p">2b:第2基板部</p>
        <p type="p">2c:柔性部</p>
        <p type="p">21:外殼</p>
        <p type="p">21a:第1部分</p>
        <p type="p">21b:第2部分</p>
        <p type="p">21c:被卡合部</p>
        <p type="p">21d:連結部</p>
        <p type="p">3:連接器</p>
        <p type="p">34:接觸件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1737" publication-number="202624209">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624209</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139913</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含氧碳系化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D209/56</main-classification>
        <further-classification edition="200601120260302B">C07D491/056</further-classification>
        <further-classification edition="200601120260302B">C08K5/3417</further-classification>
        <further-classification edition="200601120260302B">C08L101/00</further-classification>
        <further-classification edition="200601120260302B">C09B23/00</further-classification>
        <further-classification edition="200601120260302B">G02B5/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本觸媒股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON SHOKUBAI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>二村晋平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIMURA, SHIMPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀岡亜美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORIOKA, AMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青木正矩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOKI, MASANORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種由下式(1)或式(2)表示之含氧碳系化合物。式(3)中，環A表示10至18員之不飽和烴環，環B表示芳香族烴環、芳香族雜環、或包含該等環結構之縮合環，環A與環B可具有取代基，X表示烷基、芳基或芳烷基，*表示與式(1)中之4員環或式(2)中之5員環之鍵合部位。  &lt;br/&gt;&lt;img align="absmiddle" height="178px" width="545px" file="ed10031.JPG" alt="ed10031.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1738" publication-number="202624717">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624717</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139923</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>配置用於使用結構部件應變進行負載測量的材料測試系統</chinese-title>
        <english-title>MATERIAL TESTING SYSTEMS CONFIGURED FOR LOAD MEASUREMENT USING STRUCTURAL COMPONENT STRAIN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">G01N19/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商伊利諾工具工程公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ILLINOIS TOOL WORKS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯莫爾伍德　詹姆士Ｂ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMALLWOOD, JAMES B.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊爾　喬治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LYLE, GEORGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">所揭示的示例性材料測試系統包括：十字頭，該十字頭經配置以在材料測試期間被致動以將測試力傳送至測試試樣；橫樑，該橫樑經配置以固持該測試試樣之與該十字頭相對的一端；致動器，該致動器經配置以致動該十字頭並將該測試力施加至該測試試樣；感測器，該感測器經配置以測量該十字頭或該橫樑中至少一者中的偏轉；以及控制電路系統，該控制電路系統經配置以基於該已測量偏轉來判定由該十字頭施加至該測試試樣的力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed example material testing systems include: a crosshead configured to be actuated to transfer testing force to a test specimen during a material test; a beam configured to hold an end of the test specimen opposite the crosshead; an actuator configured to actuate the crosshead and to apply the testing force to the test specimen; a sensor configured to measure a deflection in at least one of the crosshead or the beam; and control circuitry configured to determine a force applied by the crosshead to the test specimen based on the measured deflection.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:材料測試系統</p>
        <p type="p">102:材料測試機器</p>
        <p type="p">106:纜線</p>
        <p type="p">112:框架</p>
        <p type="p">114:頂板</p>
        <p type="p">116:基座橫樑</p>
        <p type="p">118a:立柱</p>
        <p type="p">118b:立柱</p>
        <p type="p">120:可移動十字頭</p>
        <p type="p">122a:下部夾具</p>
        <p type="p">122b:上部夾具</p>
        <p type="p">124a:夾爪</p>
        <p type="p">124b:夾爪</p>
        <p type="p">126:測試感測器</p>
        <p type="p">128:測試試樣</p>
        <p type="p">200:計算系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1739" publication-number="202625661">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625661</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139934</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置以及電子裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260303B">H10K59/122</main-classification>
        <further-classification edition="202301120260303B">H10K59/121</further-classification>
        <further-classification edition="202301120260303B">H10K50/80</further-classification>
        <further-classification edition="202301120260303B">H10K50/30</further-classification>
        <further-classification edition="202501120260303B">H10H29/10</further-classification>
        <further-classification edition="202601120260303B">H10H29/20</further-classification>
        <further-classification edition="200601120260303B">G09F9/33</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商半導體能源研究所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山崎舜平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAZAKI, SHUNPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楠紘慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUSUNOKI, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楠本直人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUSUMOTO, NAOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種廉價且可靠性高的顯示裝置。該顯示裝置具有包括像素電路所包括的發光二極體、像素電路所包括的電晶體以及像素電路的驅動電路所包括的電晶體且它們以具有彼此重疊的區域的方式層疊的結構。藉由採用該結構，可以使顯示裝置小型化。另外，該顯示裝置可以以一個製程將多個發光二極體貼合到形成有電晶體等的電路板而製造。因此，可以降低顯示裝置的製造成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:層</p>
        <p type="p">12:層</p>
        <p type="p">13:層</p>
        <p type="p">14:層</p>
        <p type="p">100A:顯示裝置</p>
        <p type="p">102:絕緣層</p>
        <p type="p">103:絕緣層</p>
        <p type="p">104:絕緣層</p>
        <p type="p">110:發光二極體</p>
        <p type="p">113:半導體層</p>
        <p type="p">114:發光層</p>
        <p type="p">115:半導體層</p>
        <p type="p">120:電晶體</p>
        <p type="p">130:電晶體</p>
        <p type="p">132:元件分離層</p>
        <p type="p">133:低電阻區域</p>
        <p type="p">134:絕緣層</p>
        <p type="p">135:導電層</p>
        <p type="p">136:絕緣層</p>
        <p type="p">137:導電層</p>
        <p type="p">138:導電層</p>
        <p type="p">139:絕緣層</p>
        <p type="p">141:絕緣層</p>
        <p type="p">142:絕緣層</p>
        <p type="p">151:基板</p>
        <p type="p">161:導電層</p>
        <p type="p">162:絕緣層</p>
        <p type="p">163:絕緣層</p>
        <p type="p">164:絕緣層</p>
        <p type="p">165:金屬氧化物層</p>
        <p type="p">166:導電層</p>
        <p type="p">167:絕緣層</p>
        <p type="p">168:導電層</p>
        <p type="p">181:絕緣層</p>
        <p type="p">182:絕緣層</p>
        <p type="p">183:絕緣層</p>
        <p type="p">184a:導電層</p>
        <p type="p">184b:導電層</p>
        <p type="p">185:絕緣層</p>
        <p type="p">186:絕緣層</p>
        <p type="p">187:絕緣層</p>
        <p type="p">188:絕緣層</p>
        <p type="p">189:導電層</p>
        <p type="p">190a:導電層</p>
        <p type="p">190b:導電層</p>
        <p type="p">190c:導電層</p>
        <p type="p">191a:導電層</p>
        <p type="p">191b:導電層</p>
        <p type="p">191c:導電層</p>
        <p type="p">192:導電層</p>
        <p type="p">193:反射層</p>
        <p type="p">194:導電層</p>
        <p type="p">195:導電層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1740" publication-number="202625786">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625786</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139959</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有可重流底層之用於極紫外線（ＥＵＶ）微影術之膜堆疊</chinese-title>
        <english-title>FILM STACK FOR EXTREME ULTRAVIOLET (EUV) LITHOGRAPHY WITH REFLOWABLE UNDERLAYER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260312B">H10P76/20</main-classification>
        <further-classification edition="202601120260312B">H10P76/40</further-classification>
        <further-classification edition="200601120260312B">G03F7/16</further-classification>
        <further-classification edition="200601120260312B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃特基　魯迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOJTECKI, RUDY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡贊姆　納斯琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAZEM, NASRIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的實施例涉及在基板上顯影阻劑層的方法，基板經過微影製程選擇性曝光，並且在阻劑層下方有底層。在一個實施例中，方法包括使用乾式顯影製程來顯影阻劑層，以在阻劑層中形成開口，其中乾式顯影製程的溫度（使用克氏溫標）在底層的玻璃轉換溫度的±15%範圍內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments described herein relate to a method of developing a resist layer on a substrate that has been selectively exposed with a lithography process, where an underlayer is below the resist layer. In an embodiment, the method includes developing the resist layer with a dry develop process to form an opening in the resist layer, where a temperature of the dry develop process using the Kelvin scale is within ±15% of a glass transition temperature of the underlayer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:設備</p>
        <p type="p">105:基板</p>
        <p type="p">108:底層</p>
        <p type="p">110:阻劑層</p>
        <p type="p">111:線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1741" publication-number="202624504">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624504</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139973</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>超硬合金及切削工具</chinese-title>
        <english-title>CEMENTED CARBIDE AND CUTTING TOOL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260310B">C22C29/08</main-classification>
        <further-classification edition="200601120260310B">C22C19/07</further-classification>
        <further-classification edition="200601120260310B">C22C29/10</further-classification>
        <further-classification edition="200601120260310B">C22C29/16</further-classification>
        <further-classification edition="200601120260310B">B22F3/14</further-classification>
        <further-classification edition="200601120260310B">B27G13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友電氣工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO ELECTRIC INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村好博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, YOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>城戶保樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIDO, YASUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕索斯　阿儂薩克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PASEUTH, ANONGSACK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種超硬合金，其具備第1硬質相、第2硬質相、及結合相，且上述第1硬質相由複數個碳化鎢粒子所構成，上述第2硬質相由選自由TiNbC、TiNbN、TiNbCN、TiTaC、TiTaN、TiTaCN、TiTaNbC、TiTaNbN、及TiTaNbCN所組成之群中之至少1種第1化合物所構成，上述結合相包含50質量%以上之鈷，上述超硬合金之上述第1硬質相、上述第2硬質相、及上述結合相之合計含有率為94體積%以上，上述超硬合金之上述第1硬質相之含有率為65.0體積%以上95.0體積%以下，上述超硬合金之上述第2硬質相之含有率為0.1體積%以上5.0體積%以下，上述超硬合金之上述結合相之含有率為4.0體積%以上25.0體積%以下，上述碳化鎢粒子之Heywood徑之以體積基準計之粒度分佈中之標準偏差sd為0.10 μm以上0.25 μm以下，直徑為0.2 μm以下之上述第2硬質相之數量相對於全部之上述第2硬質相之數量之百分率為10%以上30%以下，直徑為0.6 μm以上之上述第2硬質相之數量相對於全部之上述第2硬質相之數量之百分率為10%以上30%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cemented carbide including: a first hard phase at a content of 65.0 vol% or more and 95.0 vol% or less composed of a plurality of tungsten carbide particles; a second hard phase at a content of 0.1 vol% or more and 5.0 vol% or less composed of at least one first compound selected from the group consisting of TiNbC, TiNbN, TiNbCN, TiTaC, TiTaN, TiTaCN, TiTaNbC, TiTaNbN, and TiTaNbCN; and a binder phase at a content of 4.0 vol% or more and 25.0 vol% or less containing cobalt at 50 mass% or more, wherein a standard deviation sd of Heywood diameters of the tungsten carbide particles in the particle size distribution on a volume basis is 0.10 μm or more and 0.25 μm or less, a percentage of the number of the second hard phases having a diameter of 0.2 μm or less relative to the number of all of the second hard phases is 10% or more and 30% or less, and a percentage of the number of the second hard phases having a diameter of 0.6 μm or more relative to the number of all of the second hard phases is 10% or more and 30% or less.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:切削工具</p>
        <p type="p">11:刀尖</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1742" publication-number="202625793">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625793</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140002</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製程腔室溫度控制方法、功率調節裝置及半導體製程設備</chinese-title>
        <english-title>PROCESS CHAMBER TEMPERATURE CONTROL METHOD, POWER REGULATION DEVICE AND SEMICONDUCTOR PROCESS EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P95/90</main-classification>
        <further-classification edition="202601120260302B">H10P34/00</further-classification>
        <further-classification edition="200601120260302B">G05D23/19</further-classification>
        <further-classification edition="200601120260302B">H05B1/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王歡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">製程腔室溫度控制方法、功率調節裝置及半導體製程設備，其中，每根燈管均設置有第一係數和第二係數集合，第二係數集合包括多個第二係數，根據功率設定值和當前功率值確定加熱元件所需的功率輸出值，並針對每一根燈管，根據當前溫度值和第二係數集合確定對應的第二目標係數；根據功率輸出值、每根燈管對應的第一係數以及每根燈管對應的第二目標係數生成每根燈管對應的控制信號，以根據控制信號驅動燈管工作。這種控制方式可根據控制信號驅動燈管工作，實現每根燈管的獨立動態調節，提升溫場分佈均勻性，從而提升快速退火製程的穩定性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A process chamber temperature control method, power adjustment device, and semiconductor process equipment are provided, wherein each lamp is provided with a first coefficient and a second coefficient set. The second coefficient set includes multiple second coefficients. The required power output value of a heating device is determined based on the power setting value and the current power value. For each lamp, a corresponding second target coefficient is determined based on the current temperature value and the second coefficient set. A control signal is generated for each lamp based on the power output value, the first coefficient corresponding to each lamp, and the second target coefficient corresponding to each lamp, to drive the lamp according to the control signal. This control method can drive the lamp according to the control signal, achieving independent dynamic adjustment of each lamp, improving the uniformity of the temperature field distribution, and thereby enhancing the stability of the rapid annealing process.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S402,S404,S406:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1743" publication-number="202624162">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624162</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140012</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱射線屏蔽膜、熱射線屏蔽膜的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260315B">C03C17/34</main-classification>
        <further-classification edition="200601120260315B">C03C17/23</further-classification>
        <further-classification edition="200601120260315B">G02B5/20</further-classification>
        <further-classification edition="200601120260315B">B32B17/06</further-classification>
        <further-classification edition="200601120260315B">E06B3/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友金屬礦山股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO METAL MINING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>本達也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUKAMOTO, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>足立健治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADACHI, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大上秀晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMI, HIDEHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種熱射線屏蔽膜，其具有：  &lt;br/&gt;玻璃基板、第1層、第2層和第3層，  &lt;br/&gt;該第1層包含具有結晶性的由通式WO&lt;sub&gt;3-x&lt;/sub&gt;(0≤x≤0.28)表示的鎢氧化物，  &lt;br/&gt;該第2層包含鎢青銅，  &lt;br/&gt;該第3層包含選自SiO&lt;sub&gt;2&lt;/sub&gt;、TiO&lt;sub&gt;2&lt;/sub&gt;、WO&lt;sub&gt;3&lt;/sub&gt;、Nb&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;5&lt;/sub&gt;、Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;、ZrO&lt;sub&gt;2&lt;/sub&gt;、Ta&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;5&lt;/sub&gt;、SnO&lt;sub&gt;2&lt;/sub&gt;、Si&lt;sub&gt;3&lt;/sub&gt;N&lt;sub&gt;4&lt;/sub&gt;、LaB&lt;sub&gt;6&lt;/sub&gt;、TiN的化合物群中的1種以上，  &lt;br/&gt;該熱射線屏蔽膜從靠近該玻璃基板的位置開始，以該第1層、該第2層、該第3層的順序配置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:熱射線屏蔽膜</p>
        <p type="p">11:玻璃基板</p>
        <p type="p">T11:平均厚度</p>
        <p type="p">12:第1層</p>
        <p type="p">T12:平均膜厚</p>
        <p type="p">13:第2層</p>
        <p type="p">T13:平均膜厚</p>
        <p type="p">14:第3層</p>
        <p type="p">T14:平均膜厚</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1744" publication-number="202625219">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625219</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140013</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>透明導電膜</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">H01B5/14</main-classification>
        <further-classification edition="200601120260313B">H01B1/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友金屬礦山股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO METAL MINING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>本達也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUKAMOTO, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>足立健治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADACHI, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大上秀晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMI, HIDEHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種透明導電膜，其具有：玻璃基板、第1層、第2層和第3層，  &lt;br/&gt;該第1層包含由通式WO&lt;sub&gt;3-x&lt;/sub&gt;(0≤x≤0.28)表示的鎢氧化物，  &lt;br/&gt;該第2層包含鎢青銅，  &lt;br/&gt;該第3層包含選自SiO&lt;sub&gt;2&lt;/sub&gt;、TiO&lt;sub&gt;2&lt;/sub&gt;、WO&lt;sub&gt;3&lt;/sub&gt;、Nb&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;5&lt;/sub&gt;、Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;、ZrO&lt;sub&gt;2&lt;/sub&gt;、Ta&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;5&lt;/sub&gt;、SnO&lt;sub&gt;2&lt;/sub&gt;、Si&lt;sub&gt;3&lt;/sub&gt;N&lt;sub&gt;4&lt;/sub&gt;、LaB&lt;sub&gt;6&lt;/sub&gt;、TiN的化合物群中的1種以上，  &lt;br/&gt;該透明導電膜從靠近該玻璃基板的位置開始，以該第1層、該第2層、該第3層的順序配置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:透明導電膜</p>
        <p type="p">11:玻璃基板</p>
        <p type="p">T11:平均厚度</p>
        <p type="p">12:第1層</p>
        <p type="p">T12:平均膜厚</p>
        <p type="p">13:第2層</p>
        <p type="p">T13:平均膜厚</p>
        <p type="p">14:第3層</p>
        <p type="p">T14:平均膜厚</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1745" publication-number="202625221">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625221</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140023</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>帶</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">H01B11/02</main-classification>
        <further-classification edition="200601120260305B">H01B7/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商阪東化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANDO CHEMICAL INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高原将人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHARA, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的一實施方式的帶包括：帶主體，主要成分為彈性體；以及多根芯線，在所述帶主體的寬度方向上隔開間隔地沿著長度方向埋設於所述帶主體，所述芯線的一部分或全部是由兩種以上不同材質的多根線材構成的混合芯線，所述多根線材中其電阻率小於所述芯線的電阻率的低電阻線材的合計剖面積相對於所述混合芯線的剖面積而為5%以上且80%以下，所述多根線材中其電阻率為所述芯線的電阻率以上且其斷裂強度高於所述低電阻線材的斷裂強度的高電阻線材在剖面觀察下包圍所述低電阻線材。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:帶</p>
        <p type="p">10:帶主體</p>
        <p type="p">11:帶孔</p>
        <p type="p">20:芯線</p>
        <p type="p">20a:混合芯線</p>
        <p type="p">20b:增強用芯線/芯線</p>
        <p type="p">23:連接器</p>
        <p type="p">30:蓋層</p>
        <p type="p">31:第一蓋層</p>
        <p type="p">32:第二蓋層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1746" publication-number="202624262">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624262</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140071</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>人類免疫球蛋白重鏈長CDR3轉殖基因構築體及其用途</chinese-title>
        <english-title>HUMAN IMMUNOGLOBULIN HEAVY CHAIN LONG CDR3 TRANSGENE CONSTRUCTS AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">C07K16/18</main-classification>
        <further-classification edition="200601120260311B">C12N15/13</further-classification>
        <further-classification edition="202401120260311B">A01K67/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商基利科學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GILEAD SCIENCES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅爾　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROHRER, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布萊姆斯　彼德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRAMS, PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供編碼長CDR3區之人類免疫球蛋白重鏈轉殖基因構築體。該等重鏈轉殖基因包含複數個比平均值長之VH區，可操作地連接至複數個D-D融合區段。亦提供包含該轉殖基因之基因轉殖動物。亦提供使用該等基因轉殖動物之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Human immunoglobulin heavy chain transgene constructs are provided that encode long CDR3 regions. The heavy chain transgenes comprise a plurality of longer than average VH regions operatively linked to a plurality of D-D fusion segments. Transgenic animals comprising the transgene are also provided. Methods of using the transgenic animals are also provided.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1747" publication-number="202625272">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625272</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140093</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電極之製造方法、以及用於其之電極的原料及漿體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">H01M4/98</main-classification>
        <further-classification edition="202101120260312B">C25B11/031</further-classification>
        <further-classification edition="200601120260312B">C22C19/03</further-classification>
        <further-classification edition="200601120260312B">C23C18/50</further-classification>
        <further-classification edition="202101120260312B">C25B9/17</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商豐田自動織機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KABUSHIKI KAISHA TOYOTA JIDOSHOKKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白井敬介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIRAI, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡西岳太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKANISHI, TAKEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河野聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONO, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤井海里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJII, KAIRI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">水電解裝置之電極包含基材、與擔載於基材上之雷氏鎳。一種電極之製造方法，其包含得到雷氏鎳的步驟，得到雷氏鎳的步驟包含藉由鹼性物質從NiAl合金中使鋁溶出的鹼處理步驟。NiAl合金除了不可避免的雜質外的成分組成係以下述組成式(I)表示。&lt;br/&gt;  Al&lt;sub&gt;3.00&lt;/sub&gt;Ni&lt;sub&gt;(2.00-(x+y))&lt;/sub&gt;Cu&lt;sub&gt;x&lt;/sub&gt;Fe&lt;sub&gt;y&lt;/sub&gt;   (I)&lt;br/&gt;  [組成式(I)中，&lt;br/&gt;  y為滿足0.00≦y≦0.30之值，&lt;br/&gt;  y為滿足y=0.00之值的情形下，x為滿足0.00＜x＜0.30之值，&lt;br/&gt;  y為滿足0.00＜y≦0.30之值的情形下，x及y為滿足0.00＜x+y≦0.45及0.00＜x≦0.40之值。]</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1748" publication-number="202623962">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623962</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140096</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>螺絲起子工具</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">B25B15/00</main-classification>
        <further-classification edition="200601120260304B">B25B23/16</further-classification>
        <further-classification edition="200601120260304B">B25G1/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商維拉維克催格有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WERA WERKZEUGE GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史坦梅茲　麥克斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEINMETZ, MAX</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種具有橫向柄部(1)及桿部(2)之螺絲起子工具。該柄部之空腔(3)中插有具有導電部件(25、35)之單向傳動裝置。空腔壁(3')由塑膠製成，且以材料接合絕緣方式用封閉件(6)之邊緣(6')封閉，如此便能用該螺絲起子工具在導電工件上工作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:柄部</p>
        <p type="p">1':芯件</p>
        <p type="p">2:桿部</p>
        <p type="p">3:空腔</p>
        <p type="p">3":開口邊緣</p>
        <p type="p">4:容置腔</p>
        <p type="p">5:傳動裝置殼體</p>
        <p type="p">6:封閉件</p>
        <p type="p">7:套管</p>
        <p type="p">7':空腔</p>
        <p type="p">7":底部</p>
        <p type="p">8:套管</p>
        <p type="p">8':空腔</p>
        <p type="p">9:套管</p>
        <p type="p">9':空腔</p>
        <p type="p">11:按鈕；操縱元件</p>
        <p type="p">11':頭部</p>
        <p type="p">12:桿部；操縱元件；傳遞元件</p>
        <p type="p">13:連接區</p>
        <p type="p">14:聯接點</p>
        <p type="p">15:壓力桿</p>
        <p type="p">16:芯部；管子</p>
        <p type="p">16':空腔</p>
        <p type="p">17:絕緣體</p>
        <p type="p">18:空腔區段</p>
        <p type="p">19:可旋轉套管；塑膠包套</p>
        <p type="p">22:蓋子；操縱元件</p>
        <p type="p">23:開口</p>
        <p type="p">24:周壁</p>
        <p type="p">24':緣邊</p>
        <p type="p">25:齒圈；導電部件</p>
        <p type="p">26:鎖定元件</p>
        <p type="p">27:彈簧元件</p>
        <p type="p">28:切換元件</p>
        <p type="p">31:凹槽</p>
        <p type="p">32:凸起</p>
        <p type="p">33:突出部</p>
        <p type="p">34:換向元件</p>
        <p type="p">35:換向撥桿；導電部件</p>
        <p type="p">36:傳動軸；操縱元件；傳遞元件</p>
        <p type="p">36':換向凸起</p>
        <p type="p">37:套筒</p>
        <p type="p">38:套管狀區段</p>
        <p type="p">39:壓縮彈簧</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1749" publication-number="202624189">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624189</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140106</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於蒸餾可聚合物質之方法</chinese-title>
        <english-title>PROCESS FOR DISTILLATION OF POLYMERIZABLE SUBSTANCES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07C67/54</main-classification>
        <further-classification edition="200601120260302B">C07C69/54</further-classification>
        <further-classification edition="200601120260302B">B01D3/00</further-classification>
        <further-classification edition="200601120260302B">B01D3/14</further-classification>
        <further-classification edition="200601120260302B">B01D3/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商巴地斯顏料化工廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASF SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克藍普　瑪賓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRAMP, MARVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彬　阿布杜拉　阿什拉芙　特汎卓恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIN ABDULLAH, ASYRAF THEVENDRAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華特　強納森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WALTER, JONATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李允中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於在用於生產可聚合物質之裝置中蒸餾包括該可聚合物質之進料混合物的方法，其中該用於生產可聚合物質之裝置包括至少一個蒸汽消耗器，特定而言至少一個再沸器，以及包括具有蒸氣冷凝器之精餾塔的蒸餾單元，其中包括該可聚合物質之該進料混合物提供於該蒸餾單元中，其中具有壓縮機之熱幫浦迴路流體連接該至少一個蒸汽消耗器與該蒸氣冷凝器，該至少一個蒸汽消耗器由該熱幫浦迴路加熱，且該蒸氣冷凝器由該熱幫浦迴路冷卻，且水用作該熱幫浦迴路中之工作介質，其中工作介質混合物被進料至該壓縮機，且該工作介質混合物係藉由自該蒸氣冷凝器抽取第一蒸汽流並向該第一蒸汽流中添加第二蒸汽流而產生，且其中該第二蒸汽流係自冷凝系統之收集容器抽取，其中至少一個液體冷凝物流經減壓且收集於該收集容器中。本發明進一步關於用於實施該方法之裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention is related to a process for distillation of a feed mixture, comprising a polymerizable substance, in a device for production of the polymerizable substance, wherein the device for production of the polymerizable substance comprises at least one steam consumer, in particular at least one reboiler, and a distillation unit comprising a rectification column having a vapor condenser, wherein the feed mixture comprising the polymerizable substance is provided in the distillation unit, wherein a heat pump circuit having a compressor which fluidically connects the at least one steam consumer and the vapor condenser, the at least one steam consumer is heated by the heat pump circuit and the vapor condenser is cooled by the heat pump circuit and water is used as working medium in the heat pump circuit, wherein a working medium mix is fed to the compressor and the working medium mix is generated by withdrawing a first steam stream from the vapor condenser and addition of a second steam stream to the first steam stream, and wherein the second steam stream is withdrawn from a collection vessel of a condensation system, wherein at least one liquid condensate stream is depressurized and collected in the collection vessel. The invention is further related to a device for carrying out the process.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:精餾塔</p>
        <p type="p">2:再沸器</p>
        <p type="p">3:第一蒸氣冷凝器</p>
        <p type="p">4:第二蒸氣冷凝器</p>
        <p type="p">5:相分離器</p>
        <p type="p">6:水分離器</p>
        <p type="p">7:壓縮機</p>
        <p type="p">8:混合元件</p>
        <p type="p">13:幫浦</p>
        <p type="p">16:膨脹閥</p>
        <p type="p">19:裝置</p>
        <p type="p">20:蒸汽消耗器</p>
        <p type="p">22:蒸餾單元</p>
        <p type="p">24:進料混合物</p>
        <p type="p">26:熱幫浦迴路</p>
        <p type="p">28:工作介質混合物</p>
        <p type="p">30:第一蒸汽流</p>
        <p type="p">32:第二蒸汽流</p>
        <p type="p">34:收集容器</p>
        <p type="p">36:冷凝系統</p>
        <p type="p">38:液體冷凝物流</p>
        <p type="p">40:額外蒸汽消耗器</p>
        <p type="p">42:剩餘液體冷凝物</p>
        <p type="p">44:進料管線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1750" publication-number="202625536">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625536</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140117</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於將電子模組組裝至伺服器機架上之方法及系統</chinese-title>
        <english-title>METHODS AND SYSTEMS FOR ASSEMBLING ELECTRONIC MODULES ONTO SERVER RACKS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">H05K7/14</main-classification>
        <further-classification edition="202501120260312B">H05K5/15</further-classification>
        <further-classification edition="200601120260312B">H05K7/12</further-classification>
        <further-classification edition="200601120260312B">G06F1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商美超微電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUPER MICRO COMPUTER,INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李冠良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KUAN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜成熹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, CHENG-SHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳家延</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIA-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請案係關於一種經組態以與一伺服器機架耦接之裝置。該裝置包括一殼體，該殼體經組態而以機械方式固定至該伺服器機架之一機架結構上。一釋放結構耦接在該殼體之一前側上。該釋放結構經組態以接收一激活力之一使用者輸入。一彈簧結構經圍封在該殼體中，並且具有固定至該殼體之一第一表面的一第一端部。該彈簧結構經組態以當該殼體以機械方式固定至該機架結構時，回應於該釋放結構上之該使用者輸入而自該殼體的該第一表面伸展以將該殼體自該機架結構鬆開。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application is directed to an apparatus configured to couple with a server rack. The apparatus includes a housing configured to be mechanically secured onto a rack structure of the server rack. A release structure is coupled on a front side of the housing. The release structure is configured to receive a user input of an activation force. A spring structure is enclosed in the housing and has a first end fixed a first surface of the housing. The spring structure is configured to extend from the first surface of the housing to unfasten the housing from the rack structure in response to the user input on the release structure, when the housing is mechanically secured to the rack structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">204-1:第一孔</p>
        <p type="p">204-2:第二孔</p>
        <p type="p">206:前側</p>
        <p type="p">210:釋放結構</p>
        <p type="p">220:彈簧結構</p>
        <p type="p">222:第一端部</p>
        <p type="p">224:第二端部</p>
        <p type="p">230:鎖機構</p>
        <p type="p">240:桿</p>
        <p type="p">300:彈簧控制機構</p>
        <p type="p">302:第一方向</p>
        <p type="p">304:第二方向</p>
        <p type="p">310:卡鉤結構</p>
        <p type="p">312:突出部/突出部分</p>
        <p type="p">320:托架結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1751" publication-number="202624724">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624724</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140136</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鉬前驅物中雜質之溶液相分析方法</chinese-title>
        <english-title>METHODS FOR SOLUTION-PHASE ANALYSIS OF IMPURITIES IN MOLYBDENUM PRECURSORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260302B">G01N21/3577</main-classification>
        <further-classification edition="200601120260302B">C01G39/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENTEGRIS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>都　慧仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DO, HYEIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芮欣　傑瑞米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUSHING, JERAMIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費齊特　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FITCHETT, BRIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供鉬前驅物中雜質之溶液相分析方法。該方法包括獲得固體組合物。該固體組合物包含第一鉬鹵氧化物化合物。該固體組合物包含基於該固體組合物之總重量計5重量%或更少之至少一種雜質。該至少一種雜質包括第二鉬鹵氧化物化合物。該第二鉬鹵氧化物化合物不同於該第一鉬鹵氧化物化合物。該方法包括將該固體組合物溶解於溶劑中以獲得包含該第一鉬鹵氧化物化合物及該第二鉬鹵氧化物化合物之溶液。該方法包括檢測該溶液中之該第二鉬鹵氧化物化合物之存在。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods for solution-phase analysis of impurities in molybdenum precursors are provided. The method comprises obtaining a solid composition. The solid composition comprises a first molybdenum oxyhalide compound. The solid composition comprises 5% or less by weight of at least one impurity based on a total weight of the solid composition. The at least one impurity comprises a second molybdenum oxyhalide compound. The second molybdenum oxyhalide compound is different from the first molybdenum oxyhalide compound. The method comprises dissolving the solid composition in a solvent to obtain a solution comprising the first molybdenum oxyhalide compound and the second molybdenum oxyhalide compound. The method comprises detecting a presence of the second molybdenum oxyhalide compound in the solution.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102:步驟</p>
        <p type="p">104:步驟</p>
        <p type="p">106:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1752" publication-number="202624818">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624818</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140149</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>投影系統及投影方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260309B">G02B7/02</main-classification>
        <further-classification edition="200601120260309B">G03B21/00</further-classification>
        <further-classification edition="200601120260309B">H04N5/74</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商高絲股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人東京科學大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INSTITUTE OF SCIENCE TOKYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑原晃大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUWAHARA, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柿本涼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAKIMOTO, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邊義浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, YOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭浩倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, HAOLUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之投影系統係具備：投影裝置，係具有第1透鏡，並在前述第1透鏡之光軸從第1圖像之中心偏離之狀態下，通過第1透鏡投影第1圖像；及攝像裝置，係具有第2透鏡，並通過前述第2透鏡，攝影被投影前述第1圖像之對象物之圖像作為第2圖像，並且藉由沿著與前述第2透鏡之光軸正交之方向位移前述第2透鏡，能夠調整前述第2透鏡之光軸相對於前述第2圖像之中心之偏差。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:投影系統</p>
        <p type="p">101:臉部</p>
        <p type="p">110:投影裝置</p>
        <p type="p">120:攝像裝置</p>
        <p type="p">130:照明裝置</p>
        <p type="p">140:鏡子</p>
        <p type="p">150:濾鏡</p>
        <p type="p">210:第1圖像</p>
        <p type="p">211:眼部化妝圖像</p>
        <p type="p">212:頰部化妝圖像</p>
        <p type="p">213:唇部化妝圖像</p>
        <p type="p">220:第2圖像</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1753" publication-number="202625748">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625748</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140171</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理系統載體</chinese-title>
        <english-title>SUBSTRATE PROCESSING SYSTEM CARRIER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260309B">H10P72/10</main-classification>
        <further-classification edition="202601120260309B">H10P72/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格林　亞倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GREEN, AARON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博甘茲　尼可拉斯麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BERGANTZ, NICHOLAS MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡克斯　戴蒙Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COX, DAMON K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史密德　安德列亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHMID, ANDREAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種載體，包含剛性主體與複數個緊固件，剛性主體形成複數個開口，複數個緊固件構造成經由複數個開口可移除地附接到剛性主體。第一組指狀物被配置為經由複數個緊固件和複數個開口可移除地附接到剛性主體。第一組指狀物被配置為在基板處理系統內的載體的第一運輸期間支撐第一內容物。第二組指狀物被配置為經由複數個緊固件和複數個開口可移除地附接到剛性主體。第二組指狀物被配置為在基板處理系統內的載體的第二運輸期間支撐第二內容物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A carrier includes a rigid body forming a plurality of openings and a plurality of fasteners configured to removably attach to the rigid body via the plurality of openings. A first set of fingers is configured to be removably attached to the rigid body via the plurality of fasteners and the plurality of openings. The first set of fingers is configured to support first content during first transportation of the carrier within a substrate processing system. A second set of fingers is configured to be removably attached to the rigid body via the plurality of fasteners and the plurality of openings. The second set of fingers is configured to support second content during second transportation of the carrier within the substrate processing system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:載體</p>
        <p type="p">210:剛性主體</p>
        <p type="p">220:開口</p>
        <p type="p">230:緊固件</p>
        <p type="p">240:指狀物</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1754" publication-number="202625649">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625649</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140194</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發光元件、發光裝置、電子裝置以及照明設備</chinese-title>
        <english-title>LIGHT-EMITTING ELEMENT, LIGHT-EMITTING DEVICE, ELECTRONIC APPLIANCE, AND LIGHTING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260311B">H10K50/80</main-classification>
        <further-classification edition="202301120260311B">H10K85/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商半導體能源研究所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川田琢也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWATA, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大澤信晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHSAWA, NOBUHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野中裕介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NONAKA, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石曽根崇浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHISONE, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀬尾哲史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的一個方式的目的是提供一種即使具有螢光發光層和磷光發光層被層疊的結構也得到高發光效率的發光元件。一種發光元件，在一對電極之間夾有EL層，該EL層包括發光層，該發光層至少具有發射螢光的第一發光層及發射磷光的第二發光層彼此接觸的疊層結構，第二發光層至少包括形成激態錯合物的多個層，在該多個層中的兩個層之間以接觸於該兩個層的方式夾有其發射峰波長比該兩個層的每一個長的層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light-emitting element includes a stack of a first light-emitting layer emitting fluorescent light and a second light-emitting layer emitting phosphorescent light between a pair of electrodes. The second light-emitting layer includes a first layer in which an exciplex is formed, a second layer in which an exciplex is formed, and a third layer in which an exciplex is formed. The second layer is located over the first layer, and the third layer is located over the second layer. An emission peak wavelength of the second layer is longer than an emission peak wavelength of the first layer and an emission peak wavelength of the third layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:第一電極</p>
        <p type="p">102:第二電極</p>
        <p type="p">103:EL層</p>
        <p type="p">104:電洞注入層</p>
        <p type="p">105:電洞傳輸層</p>
        <p type="p">106:發光層</p>
        <p type="p">106a:發光層(I)</p>
        <p type="p">106b:發光層(Ⅱ)</p>
        <p type="p">106(b1):第一層</p>
        <p type="p">106(b2):第二層</p>
        <p type="p">106(b3):第三層</p>
        <p type="p">107:電子傳輸層</p>
        <p type="p">108:電子注入層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1755" publication-number="202624815">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624815</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140229</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光纖電纜</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260212B">G02B6/44</main-classification>
        <further-classification edition="200601120260212B">G02B6/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商藤倉股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIKURA LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>向井興泉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUKAI, OKIMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鯰江彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAMAZUE, AKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">光纖電纜具備：至少1個的光纖單元、及覆蓋前述光纖單元的護套，前述光纖單元具有：複數根的光纖、及捲繞在前述複數根的光纖之周圍的捆紮材，前述捆紮材對前述光纖之長度的實際餘長率、與前述捆紮材對前述光纖之長度的理論餘長率之差即鬆弛率[%]大於0。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光纖電纜</p>
        <p type="p">1:光纖</p>
        <p type="p">2:捲壓件</p>
        <p type="p">4:中介物</p>
        <p type="p">5:護套</p>
        <p type="p">5a:標識部</p>
        <p type="p">6:抗張力體</p>
        <p type="p">7:撕裂繩</p>
        <p type="p">8:芯材</p>
        <p type="p">10:光纖單元</p>
        <p type="p">12:捆紮材(第1捆紮材)</p>
        <p type="p">13:捆紮材(第2捆紮材)</p>
        <p type="p">O:中心軸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1756" publication-number="202624677">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624677</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140263</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>變形網格熱接地平面</chinese-title>
        <english-title>DEFORMED MESH THERMAL GROUND PLANE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">F28D15/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美國商開文熱工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KELVIN THERMAL TECHNOLOGIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>路易斯　萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEWIS, RYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威斯特　傑森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEST, JASON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華格納　凱爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAGNER, KYLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥納利　狄倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCNALLY, DYLAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洛夫格倫　凱勒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOFGREN, KELLER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育竹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明主要揭示一種熱接地平面(TGP)，其利用第一外殼層與第二外殼層封裝而成，且兩者之外周邊相互鍵合，內部填充一工作流體。該熱接地平面進一步包含一可滲透毛細結構以及一變形網格，所述變形網格設置於第一外殼層與可滲透毛細結構之間，並具有變形區段與非變形區段。藉此設計，變形區段形成蒸氣通道，非變形區段則形成液體通道，從而在有限厚度內同時實現高效的蒸發與冷凝循環，提升整體散熱性能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention primarily discloses a thermal ground plane (TGP) formed by encapsulating a first casing layer and a second casing layer, with their outer peripheries bonded to each other and a working fluid filled therein. The thermal ground plane further includes a permeable wick structure and a deformed mesh, wherein the deformed mesh is disposed between the first casing layer and the permeable wick structure, and comprises deformed portions and nondeformed portions. With this design, the deformed portions form vapor channels, while the nondeformed portions form liquid channels, thereby enabling efficient evaporation and condensation cycles within a limited thickness and enhancing overall heat dissipation performance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:熱接地平面</p>
        <p type="p">305:變形網層</p>
        <p type="p">310:柱體</p>
        <p type="p">110:第一外殼層</p>
        <p type="p">115:第二外殼層</p>
        <p type="p">120:液體結構</p>
        <p type="p">125:蒸氣結構</p>
        <p type="p">210:平面網格</p>
        <p type="p">140:封合劑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1757" publication-number="202624897">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624897</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140264</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光源裝置、曝光裝置和物品的製作方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">G03F7/20</main-classification>
        <further-classification edition="201601120260312B">F21S2/00</further-classification>
        <further-classification edition="200601120260312B">G02B27/18</further-classification>
        <further-classification edition="200601120260312B">G02B27/10</further-classification>
        <further-classification edition="201601320260312B">F21Y115/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANON KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>八講学</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAKKO, MANABU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>豊田和輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYODA, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及光源裝置、曝光裝置和物品的製作方法。一種光源裝置，在將原版的圖案的像投影到基板的曝光裝置中使用，其中，前述光源裝置具有射出第1波長的光的第1 LED組、射出與前述第1波長不同的第2波長的光的第2 LED組以及對來自前述第1 LED組的光與來自前述第2 LED組的光進行合成的分色鏡，在將通過前述分色鏡合成後的光照射到前述原版時，前述分色鏡與前述原版之間的成像面處的每單位面積的照度是1000mW/cm&lt;sup&gt;2&lt;/sup&gt;以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">7:遮罩(原版)</p>
        <p type="p">8:照明光學系統</p>
        <p type="p">9:框體</p>
        <p type="p">10:光源單元(光源裝置)</p>
        <p type="p">11:LED陣列光源</p>
        <p type="p">11a:LED陣列光源</p>
        <p type="p">11b:LED陣列光源</p>
        <p type="p">12:會聚透鏡</p>
        <p type="p">13:光學積分器</p>
        <p type="p">14:光圈</p>
        <p type="p">15:第2會聚透鏡</p>
        <p type="p">16:波長合成部(分色鏡)</p>
        <p type="p">41:狹縫面</p>
        <p type="p">43:放大光學系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1758" publication-number="202625001">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625001</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140266</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>整合三維CAD之模擬工具</chinese-title>
        <english-title>3D CAD INTEGRATED SIMULATION TOOL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260305B">G06F30/25</main-classification>
        <further-classification edition="202001120260305B">G06F30/17</further-classification>
        <further-classification edition="200601120260305B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商電磁應用股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELECTRO MAGNETIC APPLICATIONS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紐菲爾德　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEUFELD, BRYON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威爾遜　格列高里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WILSON, GREGORY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅倫達　凱文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERENDA, KEVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露說明一種用於建模電漿放電及電磁現象之3D CAD整合式模擬工具。該系統將包括有限元素法(FEM)電磁求解器、粒子網格(PIC)動力學求解器、流體動態求解器、以及反應求解器在內之多個運算物理量求解器與協調式多時間步距積分方案整合。該軟體系統針對低溫電漿應用、電漿增強化學氣相沉積(PECVD)、電漿蝕刻、濺鍍沉積、太空船充電、真空放電、及RF電漿處理，為使用者互動及專業能力提供一整合式3D CAD環境。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure describes a 3D CAD integrated simulation tool for modeling plasma discharges and electromagnetic phenomena. The system integrates multiple computational physics solvers including finite element method (FEM) electromagnetic solvers, particle-in-cell (PIC) kinetic solvers, fluid dynamics solvers, and reaction solvers with coordinated multi-time-step integration schemes. The software system provides an integrated 3D CAD environment for user interaction and specialized capabilities for low-temperature plasma applications, plasma-enhanced chemical vapor deposition (PECVD), plasma etching, sputter deposition, spacecraft charging, vacuum discharges, and RF plasma processing.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:方法</p>
        <p type="p">1002；1004；1006；1008；1010；1012；1014；1016；1018；1020；1022；1024；1026:步驟</p>
        <p type="p">1028:模擬處理器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1759" publication-number="202625715">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625715</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140345</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板研磨方法</chinese-title>
        <english-title>SUBSTRATE POLISHING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260304B">H10P52/40</main-classification>
        <further-classification edition="201201120260304B">B24B37/005</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商荏原製作所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EBARA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍋谷治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NABEYA, OSAMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山木暁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAKI, SATORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳傳岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾文岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可更精確判定基板吸附之基板保持裝置及具備此種基板保持裝置之基板研磨裝置，此外，提供一種可更精確判定基板吸附之基板吸附判定方法、及利用此種基板吸附判定方法之基板研磨方法。本發明提供一種基板保持裝置，係具備：上方環形轉盤本體，其係可安裝具有可吸附基板之面的彈性膜，且安裝前述彈性膜時，在前述彈性膜與前述上方環形轉盤本體之間形成複數個區域；第一管線，其係連通於前述複數個區域中之第一區域；第二管線，其係連通於前述複數個區域中與前述第一區域不同的第二區域；壓力調整機構，其係藉由經由前述第一管線送入流體可將前述第一區域加壓，且可經由前述第二管線將前述第二區域形成負壓；及判定部，其係依據送入前述第一區域之流體的體積、或是對應於前述第一區域之壓力的量測值，判定是否已將前述基板吸附於前述彈性膜；進行前述判定時，不從前述第一區域進行排氣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:上方環形轉盤本體</p>
        <p type="p">13:隔膜</p>
        <p type="p">21:加壓側汽缸</p>
        <p type="p">21a:前端</p>
        <p type="p">21b:閉塞面</p>
        <p type="p">21c:開口</p>
        <p type="p">22:加壓用活塞</p>
        <p type="p">23:驅動側汽缸</p>
        <p type="p">23a:前端</p>
        <p type="p">23b:閉塞面</p>
        <p type="p">23c:開口</p>
        <p type="p">24:驅動壓力生成部</p>
        <p type="p">25:驅動用活塞</p>
        <p type="p">26:連結構件</p>
        <p type="p">27:板</p>
        <p type="p">28:位置感測器</p>
        <p type="p">28a:檢測原點感測器</p>
        <p type="p">28b:檢測有基板感測器</p>
        <p type="p">28c:檢測無基板感測器</p>
        <p type="p">131~135:區域</p>
        <p type="p">141:流路</p>
        <p type="p">150:加壓機構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1760" publication-number="202625028">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625028</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140350</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用量子電路增強大型語言模型之效能之方法及系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR ENHANCING PERFORMANCE OF LARGE LANGUAGE MODELS USING QUANTUM CIRCUITS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260305B">G06N10/60</main-classification>
        <further-classification edition="202301120260305B">G06N3/0455</further-classification>
        <further-classification edition="202301120260305B">G06N3/0464</further-classification>
        <further-classification edition="202301120260305B">G06N3/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西班牙商多元宇宙運算公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MULTIVERSE COMPUTING S.L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾茲普魯阿　博爾哈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIZPURUA, BORJA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛格　蘇赫賓德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGH, SUKHBINDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈赫魯米　賽義德　Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAHROMI, SAEED S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧羅斯　羅曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORUS, ROMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">方法透過混合經典量子處理來增強大型語言模型(LLM)之運算效率及效能。該方法涉及一經典電腦接收一輸入以供包括深度自注意力及多層感知器層之一所選擇LLM處理並將LLM之權重矩陣分解成一第一矩陣乘積運算子(MPO)。該經典電腦識別一或多個解纏繞器，該等解纏繞器將該MPO因式分解成一非么正張量網路及一組么正子分量。該非么正張量網路藉由區域化量子相關性來達成壓縮。該等么正子分量對應於經組態以在一量子電腦上依序運行之第一變分量子電路及第二變分量子電路。對第二量子電路之執行係以對第一量子電路之量測及來自張量網絡之輸出兩者為條件，從而達成經增強相關性擷取及高效模型表示。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The method enhances computational efficiency and performance of large language models (LLMs) through hybrid classical-quantum processing. The method involves a classical computer receiving an input for processing by a selected LLM comprising deep self-attention and multilayer perceptron layers and decomposing the LLM's weight matrices into a first Matrix Product Operator (MPO). The classical computer identifies one or more disentanglers which factorize the MPO into a non-unitary tensor network and a set of unitary subcomponents. The non-unitary tensor network enables compression by localizing quantum correlations. The unitary subcomponents correspond to first and second variational quantum circuits, configured to run sequentially on a quantum computer. The execution of the second quantum circuit is conditioned on both the measurements of the first quantum circuit and outputs from the tensor network, enabling enhanced correlation capture and efficient model representation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">22:非么正張量網路</p>
        <p type="p">211:第一變分量子電路</p>
        <p type="p">212:第二變分量子電路</p>
        <p type="p">MPO&lt;sub&gt;new&lt;/sub&gt;:非么正張量網路/新矩陣乘積運算子/第二矩陣乘積運算子</p>
        <p type="p">MPO&lt;sub&gt;old&lt;/sub&gt;:舊矩陣乘積運算子/第一矩陣乘積運算子/原始矩陣乘積運算子</p>
        <p type="p">
        &lt;i&gt;U&lt;/i&gt;:么正矩陣/解纏繞器之么正量子電路</p>
        <p type="p">
        &lt;i&gt;V&lt;/i&gt;:解纏繞器之么正量子電路</p>
        <p type="p">
        &lt;i&gt;W&lt;/i&gt;:權重矩陣/複雜權重矩陣</p>
        <p type="p">χ:鍵維數</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1761" publication-number="202624431">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624431</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140382</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>黏著帶</chinese-title>
        <english-title>PRESSURE-SENSITIVE ADHESIVE TAPE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260304B">C09J7/20</main-classification>
        <further-classification edition="202401120260304B">B01J35/53</further-classification>
        <further-classification edition="200601120260304B">C09J133/12</further-classification>
        <further-classification edition="200601120260304B">C08F2/22</further-classification>
        <further-classification edition="201801120260304B">C09J7/38</further-classification>
        <further-classification edition="200601120260304B">C08F220/18</further-classification>
        <further-classification edition="200601120260304B">C08F2/48</further-classification>
        <further-classification edition="200601120260304B">C09D5/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林博斗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHI, HIROTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>千葉瑞穗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIBA, MIZUHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種於加工後能夠容易地自被黏著體表面剝離且微粒子於被黏著體表面之殘留進一步被抑制之黏著帶。  &lt;br/&gt;本發明之實施方式之黏著帶具備基材、及包含活性能量線硬化型黏著劑之黏著劑層，活性能量線照射後之該黏著劑層之溶膠成分中所含的重量平均分子量為1000以下之成分為20%以下，活性能量線照射後之該黏著劑層之黏著力為0.04 N/20 mm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided a pressure-sensitive adhesive tape, which can be easily peeled from a surface of an adherend after processing, and further prevents fine particles from remaining on the surface of the adherend. The pressure-sensitive adhesive tape includes: a base material; and a pressure-sensitive adhesive layer formed of an active energy ray-curable pressure-sensitive adhesive. A ratio of a component having a weight-average molecular weight of 1,000 or less in a sol content of the pressure-sensitive adhesive layer after active energy ray irradiation is 20% or less. A pressure-sensitive adhesive strength of the pressure-sensitive adhesive layer after the active energy ray irradiation is 0.04 N/20 mm or less.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:黏著劑層</p>
        <p type="p">20:基材</p>
        <p type="p">100:黏著帶</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1762" publication-number="202624795">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624795</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140384</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>抗反射膜</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120260304B">G02B1/11</main-classification>
        <further-classification edition="201501120260304B">G02B1/14</further-classification>
        <further-classification edition="201901120260304B">B32B7/023</further-classification>
        <further-classification edition="200601120260304B">B32B27/00</further-classification>
        <further-classification edition="200601120260304B">B32B27/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邊聖彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, MASAHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林雄二郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHI, YUJIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮本幸大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAMOTO, KODAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">抗反射膜(1)於朝向厚度方向一側依序具備透明基材膜(2)、中間層(3)及抗反射層(4)。使波長550 nm之光入射至中間層(3)時之折射率為1.7以上1.9以下。抗反射層(4)包含2個以上之具備高折射率層(41)及低折射率層(42)之積層體(10)。使波長550 nm之光入射至高折射率層(41)時之折射率超過2.50且為2.80以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:抗反射膜</p>
        <p type="p">2:透明基材膜</p>
        <p type="p">3:中間層</p>
        <p type="p">4:抗反射層</p>
        <p type="p">5:防污層</p>
        <p type="p">10:積層體</p>
        <p type="p">10a:第1積層體</p>
        <p type="p">10b:第2積層體</p>
        <p type="p">21:透明樹脂膜</p>
        <p type="p">22:硬化樹脂層</p>
        <p type="p">41:高折射率層</p>
        <p type="p">41a:第1高折射率層</p>
        <p type="p">41b:第2高折射率層</p>
        <p type="p">42:低折射率層</p>
        <p type="p">42a:第1低折射率層</p>
        <p type="p">42b:第2低折射率層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1763" publication-number="202625737">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625737</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140417</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體處理設備及其多區加熱板和多區溫控驅動方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/00</main-classification>
        <further-classification edition="202601120260302B">H10P72/70</further-classification>
        <further-classification edition="202601120260302B">H10P95/90</further-classification>
        <further-classification edition="200601120260302B">H05H1/20</further-classification>
        <further-classification edition="200601120260302B">H05H1/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜銀鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜冰潔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體處理設備及其多區加熱板和多區溫控驅動方法，通過設置限流元件來連通位於半導體處理設備的多區加熱板中的不同加熱區內的加熱片，每個加熱片均會經歷主動加熱操作和被動加熱操作，每個加熱片均會被施加一次主動加熱功率和至少一次被動加熱功率，通過控制加熱片上的主動加熱功率的比例和被動加熱功率的比例，令施加到同一個加熱片上的主動加熱功率與所有的被動加熱功率的總和等於所述加熱片的預定加熱功率，實現對每個加熱片的獨立溫度控制，減少每個加熱片的瞬時發熱功率和電流，加熱片不易因頻繁快速加熱和降溫導致材料開裂。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">3:多區加熱板</p>
        <p type="p">G1:第一接地開關</p>
        <p type="p">G2:第二接地開關</p>
        <p type="p">G3:第三接地開關</p>
        <p type="p">G4:第四接地開關</p>
        <p type="p">R1:第一限流電阻</p>
        <p type="p">R2:第二限流電阻</p>
        <p type="p">R3:第三限流電阻</p>
        <p type="p">R4:第四限流電阻</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1764" publication-number="202625677">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625677</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140420</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>空腔結構的形成方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P10/00</main-classification>
        <further-classification edition="202601120260302B">H10P50/20</further-classification>
        <further-classification edition="202601120260302B">H10W20/40</further-classification>
        <further-classification edition="202601120260302B">H10W10/10</further-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
        <further-classification edition="200601120260302B">B81C1/00</further-classification>
        <further-classification edition="200601120260302B">B81B7/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃秋平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種空腔結構的形成方法。所述形成方法包括：首先根據遮罩層的開口圖形在矽襯底中蝕刻形成預設深度的第一溝槽，然後對第一溝槽執行第一橫向蝕刻步驟，形成寬度尺寸由上端至下端逐漸增大或逐漸減小的第二溝槽；再繼續執行第二橫向蝕刻步驟，調控第二溝槽的側壁，形成側壁垂直或類垂直的空腔結構。本發明採用兩次橫向蝕刻模式，對第一溝槽的側壁的角度和形貌進行分階段的調控，調控更具自由度和精準性，並結合兩次橫向蝕刻氣體種類的篩選，解決了傳統形成方法存在側壁形貌不平整、容易不必要擴大空腔結構較小的寬度尺寸的問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">101~104:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1765" publication-number="202625688">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625688</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140422</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體零部件、塗層密封方法及電漿處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P14/60</main-classification>
        <further-classification edition="202601120260302B">H10W74/40</further-classification>
        <further-classification edition="200601120260302B">C09D5/08</further-classification>
        <further-classification edition="202001120260302B">C01F17/20</further-classification>
        <further-classification edition="200601120260302B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱生華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>叢　海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CONG, HAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種半導體零部件、塗層密封方法及電漿處理裝置。所述方法包括：提供一零部件本體，其表面具有耐腐蝕塗層，耐腐蝕塗層具有微缺陷，微缺陷包括孔隙和微裂紋中的至少一種；提供一稀土金屬溶膠；將稀土金屬溶膠施加到零部件本體上，使稀土金屬溶膠完全覆蓋零部件本體的耐腐蝕塗層；高溫處理，使得所述稀土金屬溶膠固化並封閉在耐腐蝕塗層的微缺陷中；其中，所述稀土金屬溶膠包含稀土金屬絡合物。本發明方法可使耐腐蝕塗層的微缺陷數量可以降低至無限接近於0，且耐腐蝕性和耐溫性大幅提升，提高了半導體零部件的使用可靠性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">101、102、103、104:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1766" publication-number="202625718">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625718</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140427</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>促進晶片脫附的方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P54/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顧繼強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種促進晶片脫附的方法，以在工藝階段外的脫附階段中使晶片脫附，包括：升溫步驟，使得所述待脫附晶片至少升溫至第一溫度；降溫步驟，使得所述待脫附晶片至少降溫至第二溫度；N次循環進行所述升溫步驟、降溫步驟，直至所述待脫附晶片與所述承載基座脫離；其中，所述第一溫度＞所述第二溫度≥工藝溫度，在工藝階段內，處於工藝溫度下的晶片被沉積物黏結於所述承載基座上。本發明通過循環進行的交叉升降溫步驟，協同氦氣吹掃以促進低溫下黏結晶片脫附，可以大幅縮短晶片脫附時間，有利於縮短生產週期，降低生產成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S3:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1767" publication-number="202624945">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624945</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140435</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>終端的遠端控制方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260313B">G06F3/04812</main-classification>
        <further-classification edition="202201120260313B">G06F3/0488</further-classification>
        <further-classification edition="202201120260313B">H04L67/025</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ｔｅａｍＳ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEAMS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大野良治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHNO, RYOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">與在基於已被輸入之操作件之位置變化量的顯示畫面上之位置處顯示出滑鼠指標的第2終端(20)進行通訊並且將第2終端(20)的顯示畫面顯示於自終端的第1終端(10)，係將用來令指標從對方終端的顯示畫面上的指標之初始位置，移動至已被使用者所指定之自終端之顯示畫面上的位置所對應之對方終端之畫面上的位置所需之第1操作資訊，發送至第2終端(20)。又，第1終端(10)，係將用來令指標從使用者所做的指定是已被解除的自終端之顯示畫面內的位置移動至初始位置所需之第2操作資訊，發送至第2終端(20)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電腦系統</p>
        <p type="p">10:第1終端</p>
        <p type="p">20,20-1,20-2,20-3,20-4:第2終端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1768" publication-number="202625331">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625331</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140443</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電動機之多繞組定子總成及其運轉控制方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251208B">H02K1/16</main-classification>
        <further-classification edition="200601120251208B">H02K3/04</further-classification>
        <further-classification edition="200601120251208B">H02K5/04</further-classification>
        <further-classification edition="200601120251208B">H02K7/02</further-classification>
        <further-classification edition="200601120251208B">H02K9/19</further-classification>
        <further-classification edition="201601120251208B">H02P6/20</further-classification>
        <further-classification edition="200601120251208B">H02P1/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鵬任</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳豐田</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宏亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱謙成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種利用多定子繞組配合變頻器之電動機定子總成及其運轉控制方法。於啟動階段，多組繞組可依需求選擇同時供電或僅啟用其中之一繞組，以產生不同等級之起動轉矩，從而有效因應各種啟動負載條件。當電動機達到預定轉速後，藉由運轉控制模組，選擇僅保留其中一組繞組經由變頻器與外部電源連接，以維持穩定運轉並降低能量消耗。藉由此結構配置，可在不增加機構複雜度之情況下，同時兼顧啟動性能與節能效果，並實現運行階段之動態功率調控與能效最佳化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">32:第一繞組</p>
        <p type="p">320:R相第一繞組</p>
        <p type="p">3200:第一端</p>
        <p type="p">322:S相第一繞組</p>
        <p type="p">3220:第二端</p>
        <p type="p">324:T相第一繞組</p>
        <p type="p">3240:第三端</p>
        <p type="p">34:第二繞組</p>
        <p type="p">340:R相第二繞組</p>
        <p type="p">3400:第一端</p>
        <p type="p">342:S相第二繞組</p>
        <p type="p">3420:第二端</p>
        <p type="p">344:T相第二繞組</p>
        <p type="p">3440:第三端</p>
        <p type="p">40:變頻器</p>
        <p type="p">42:輸入端</p>
        <p type="p">44:輸出端</p>
        <p type="p">50:運轉控制模組</p>
        <p type="p">52:電氣控制單元</p>
        <p type="p">54:第一三相開關裝置</p>
        <p type="p">540:R相第一開關裝置</p>
        <p type="p">542:S相第一開關裝置</p>
        <p type="p">544:T相第一開關裝置</p>
        <p type="p">56:第二三相開關裝置</p>
        <p type="p">560:R相第二開關裝置</p>
        <p type="p">562:S相第二開關裝置</p>
        <p type="p">564:相第二開關裝置</p>
        <p type="p">58:第三三相開關裝置</p>
        <p type="p">580:R相第三開關裝置</p>
        <p type="p">582:S相第三開關裝置</p>
        <p type="p">584:T相第三開關裝置</p>
        <p type="p">60:三相交流電源</p>
        <p type="p">A:支路</p>
        <p type="p">B:支路</p>
        <p type="p">C:支路</p>
        <p type="p">D:支路</p>
        <p type="p">E:支路</p>
        <p type="p">F:支路</p>
        <p type="p">G:支路</p>
        <p type="p">H:支路</p>
        <p type="p">I:支路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1769" publication-number="202625857">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625857</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140453</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包括共享邏輯裸晶的多個單元裸晶的半導體設備</chinese-title>
        <english-title>SEMICONDUCTOR APPARATUS INCLUDING A PLURALITY OF CELL DIES SHARING A LOGIC DIE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260313B">H10W72/50</main-classification>
        <further-classification edition="202601120260313B">H10W70/62</further-classification>
        <further-classification edition="200601120260313B">G11C7/10</further-classification>
        <further-classification edition="202601120260313B">H10D88/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商愛思開海力士有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK HYNIX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李性柱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEONG JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體設備包括封裝基板、邏輯裸晶以及多個單元裸晶。邏輯裸晶和多個單元裸晶被設置在封裝基板上。邏輯裸晶通過封裝基板的訊號傳輸線而被耦接到封裝基板的銲盤。多個單元裸晶通過接合線而被耦接到封裝基板的銲盤，從而被耦接到邏輯裸晶。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor apparatus includes a package substrate, a logic die, and a plurality of cell dies. The logic die and the plurality of cell dies are disposed on the package substrate. The logic die is coupled to pads of the package substrate through signal transmission lines of the package substrate. The plurality of cell dies is coupled to the pads of the package substrate through bonding wires, thereby being coupled to the logic die.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:半導體設備</p>
        <p type="p">210:封裝基板</p>
        <p type="p">211:第一銲盤</p>
        <p type="p">212:第二銲盤</p>
        <p type="p">213:第一訊號傳輸線</p>
        <p type="p">214:第二訊號傳輸線</p>
        <p type="p">215:第三訊號傳輸線</p>
        <p type="p">216:封裝球</p>
        <p type="p">217:第三銲盤</p>
        <p type="p">218:第四銲盤</p>
        <p type="p">220:邏輯裸晶</p>
        <p type="p">221:凸塊</p>
        <p type="p">231:第一單元裸晶</p>
        <p type="p">231-1:資料銲盤</p>
        <p type="p">231-2:電源銲盤</p>
        <p type="p">232:第二單元裸晶</p>
        <p type="p">232-1:資料銲盤</p>
        <p type="p">232-2:電源銲盤</p>
        <p type="p">233:第三單元裸晶</p>
        <p type="p">233-1:資料銲盤</p>
        <p type="p">233-2:電源銲盤</p>
        <p type="p">234:第四單元裸晶</p>
        <p type="p">234-1:資料銲盤</p>
        <p type="p">234-2:電源銲盤</p>
        <p type="p">235:第五單元裸晶</p>
        <p type="p">235-1:資料銲盤</p>
        <p type="p">235-2:電源銲盤</p>
        <p type="p">236:第六單元裸晶</p>
        <p type="p">236-1:資料銲盤</p>
        <p type="p">236-2:電源銲盤</p>
        <p type="p">237:第七單元裸晶</p>
        <p type="p">237-1:資料銲盤</p>
        <p type="p">237-2:電源銲盤</p>
        <p type="p">238:第八單元裸晶</p>
        <p type="p">238-1:資料銲盤</p>
        <p type="p">238-2:電源銲盤</p>
        <p type="p">251:第一接合線</p>
        <p type="p">252:第二接合線</p>
        <p type="p">253-1、253-2、253-3、253-4:接合線</p>
        <p type="p">254-1、254-2、254-3、254-4:接合線</p>
        <p type="p">VDD:電源電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1770" publication-number="202625519">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625519</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140469</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電路基板的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">H05K3/18</main-classification>
        <further-classification edition="200601120260303B">H05K1/09</further-classification>
        <further-classification edition="200601120260303B">G09F11/10</further-classification>
        <further-classification edition="202601120260303B">H10P95/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商阿爾卑斯阿爾派股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALPS ALPINE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岸田克彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KISHIDA, KATSUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種“電路基板的製造方法”，能夠使用厚度為一定值以上的膜形成多個像素電路，並且利用適量的液體金屬將各像素電路的布線圖案之間適當地連接。在第1工序中在通過布線圖案(3)將像素間連接的狀態下將多個像素電路(2)形成於PI膜(1)上之後的第2-1工序至第2-4工序中，對PI膜(1)進行加工而使像素間的位置的厚度變薄，以成為在像素間的位置處PI膜(1)與布線圖案(3)一起被切斷的狀態的方式將PI膜(1)以像素單位進行單片化，由此在使像素間的液體金屬(6)附著的區域中，使形成於像素電路(2)上的布線圖案(3)與轉印單片(4)的柔性基板(5)的階梯差小於一定值，從而能夠通過適量的液體金屬(6)將各像素電路(2)的布線圖案(3)之間適當地連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:膜</p>
        <p type="p">2:像素電路</p>
        <p type="p">3:布線圖案</p>
        <p type="p">4:單片</p>
        <p type="p">12:元件</p>
        <p type="p">20:蝕刻液</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1771" publication-number="202625421">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625421</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140470</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用服務識別裝置、分析裝置、參照裝置以及由這些裝置執行的方法、程式和系統</chinese-title>
        <english-title>USED SERVICE IDENTIFICATION DEVICE, ANALYSIS DEVICE, REFERENCE DEVICE, AND METHODS, PROGRAMS, AND SYSTEMS EXECUTED BY THESE DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260311B">H04L67/53</main-classification>
        <further-classification edition="201901120260311B">G06F16/958</further-classification>
        <further-classification edition="201301120260311B">G06F21/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本網路倡議股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERNET INITIATIVE JAPAN INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>水谷雄太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZUTANI, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小川晋平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGAWA, SHIMPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中西康介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANISHI, KOHSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡冠彣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">利用服務識別裝置50具備：分析項目取得部51，其取得包含分析對象網站內的至少1個頁面的頁面URL與由至少1個頁面所發行之Cookie、所設定之網頁儲存器、或所發生之外部通訊的外部通訊URL之對應關係的分析項目；利用服務識別部52，其將分析項目與服務資料庫60進行比對，將分析項目中包含之Cookie、網頁儲存器、或外部通訊URL所對應之服務識別為在至少1個頁面利用之利用服務；及利用服務登錄部53，其使網站URL與利用服務對應並登錄，其中，服務資料庫登錄有將Cookie、網頁儲存器及外部通訊URL分別與服務彼此對應之資料。據此，可取得由分析裝置10所分析之每個分析對象網站的Cookie、網頁儲存器、或外部通訊URL，識別出對應之利用服務，並將所識別之利用服務登錄於利用服務資料庫70。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The used service identification device 50 includes an analysis item acquisition unit 51 that acquires analysis items including a correspondence between the page URL of at least one page within a site to be analyzed and the cookies issued on at least one page, the web storage set, or the external communication URL of the external communication that occurs on that page; a used service identification unit 52 that compares the analysis items with a service database 60 to identify services corresponding to the cookies, web storage, or external communication URL included in the analysis items as used services used on at least one page; and a used service registration unit 53 that registers the site URLs and the used services in correspondence with each other. The service database stores data in which cookies, web storage, and external communication URLs are each associated with a service. This makes it possible to acquire the cookies, web storage, or external communication URL for each site to be analyzed by the analysis device 10, identify the corresponding used services, and register the identified used services in the service database 70.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:系統(利用服務識別系統)</p>
        <p type="p">10:分析裝置</p>
        <p type="p">20:網站資料庫</p>
        <p type="p">30:分析對象伺服器</p>
        <p type="p">40:分析項目資料庫</p>
        <p type="p">50:利用服務識別裝置</p>
        <p type="p">60:服務資料庫</p>
        <p type="p">70:利用服務資料庫</p>
        <p type="p">80:參照裝置</p>
        <p type="p">90:用戶終端</p>
        <p type="p">91:顯示器</p>
        <p type="p">99:網路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1772" publication-number="202625422">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625422</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140475</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>觸發控制裝置、觸發控制方法、觸發控制程式、客戶終端及觸發控制系統</chinese-title>
        <english-title>TRIGGER CONTROL DEVICE, TRIGGER CONTROL METHOD, TRIGGER CONTROL PROGRAM, CLIENT TERMINAL AND TRIGGER CONTROL SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260311B">H04L67/53</main-classification>
        <further-classification edition="201301120260311B">G06F21/62</further-classification>
        <further-classification edition="201901120260311B">G06F16/958</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本網路倡議股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERNET INITIATIVE JAPAN INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>水谷雄太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZUTANI, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小川晋平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGAWA, SHIMPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中西康介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANISHI, KOHSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡冠彣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明之觸發控制裝置，其在從客戶終端90指定WEB頁面的URL並發送請求時，將回應回傳至客戶終端90而使其執行觸發控制功能單元10A，觸發控制功能單元10A具備：狀態取得部11，其從客戶終端90取得狀態；及標籤控制部12，其因應狀態，將請求所指定之Web頁面中的標籤啟用。藉此，僅將可從保存在客戶終端90之狀態確認到同意的標籤啟用，而可確實地防止未經同意之服務的標籤利用Cookie等個人資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The trigger control device of the present invention, a response is sent back to the client terminal 90 to cause it to execute a trigger control function unit 10A when a request is sent from a client terminal 90 specifying the URL of a web page. The trigger control function unit 10A includes a status acquisition unit 11, which acquires a status from the client terminal 90; and a tag control unit 12, which, in response to the status, enables tags in the requested web page. In this way, only tags for which consent can be confirmed from the status stored in the client terminal 90 are enabled, thus reliably preventing tags for services without consent from using personal information such as cookies.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:觸發控制裝置</p>
        <p type="p">10A:觸發控制功能單元</p>
        <p type="p">11:狀態取得部</p>
        <p type="p">12:標籤控制部</p>
        <p type="p">13:標籤資訊管理部</p>
        <p type="p">20:標籤資訊資料庫</p>
        <p type="p">50:伺服器</p>
        <p type="p">90:客戶終端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1773" publication-number="202624944">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624944</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140476</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>視窗控制裝置、客戶終端、視窗控制系統、視窗控制方法、視窗生成終端及電腦可讀取之記錄媒體</chinese-title>
        <english-title>WINDOWS CONTROL DEVICE, CLIENT TERMINAL, WINDOWS CONTROL SYSTEM, WINDOWS CONTROL METHOD, WINDOWS GENERATION TERMINAL, AND COMPUTER-READABLE RECORDING MEDIA</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260310B">G06F3/0481</main-classification>
        <further-classification edition="202201120260310B">G06F3/0484</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本網路倡議股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERNET INITIATIVE JAPAN INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>水谷雄太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZUTANI, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小川晋平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGAWA, SHIMPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中西康介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANISHI, KOHSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡冠彣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種視窗控制裝置，其在從客戶終端90向伺服器50發送請求時，將回應回傳至客戶終端90而使其執行視窗控制功能單元10A，其中，視窗控制功能單元10A係根據客戶終端90的用戶的選擇來顯示具有資訊提供功能之視窗910，而不自動顯示視窗910。藉此，在確保用戶針對個人資訊等的利用具有選擇退出的機會即可的情況下，可不顯示用於同意確認的視窗，而對用戶提供流暢的頁面操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The window control device is a window control device that, when a request is sent from the client terminal 90 to the server 50, returns a response to the client terminal 90 and executes the window control function unit 10A, and the window control function 10A displays a window 910 having an information provision function according to the selection of the user of the client terminal 90, but does not automatically display the window 910. As a result, if it is sufficient to ensure that the user has an opportunity to opt out of the use of personal information, etc., the window for confirming consent is hidden, and smooth page operation can be provided to the user.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:視窗控制裝置</p>
        <p type="p">11:視窗自動顯示確認部</p>
        <p type="p">12:資訊顯示元素生成部</p>
        <p type="p">13:資訊顯示元素顯示部</p>
        <p type="p">14:視窗生成部</p>
        <p type="p">15:視窗顯示部</p>
        <p type="p">16:利用狀態設定部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1774" publication-number="202625314">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625314</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140499</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接器及連接器安裝板</chinese-title>
        <english-title>CONNECTOR AND CONNECTOR MOUNTING BOARD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251103B">H01R13/639</main-classification>
        <further-classification edition="200601120251103B">H01R13/631</further-classification>
        <further-classification edition="201101120251103B">H01R12/72</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本航空電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAPAN AVIATION ELECTRONICS INDUSTRY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘆部健太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASHIBU, KENTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種可易於將連接器自基板裝卸的技術。根據本發明的連接器能夠自基板裝卸，前述基板包括能夠與對象連接器嵌合的複數個襯墊。前述連接器包括：複數個接觸件；外罩，配置為固持前述複數個接觸件；以及耦合部，配置為可裝卸地將前述外罩耦合至前述基板。前述外罩包括：外罩體、以及從前述外罩體突出的爪。前述爪包括：爪體、以及從前述爪體突出的突起。前述爪抓持前述基板，前述耦合部將前述外罩耦合至前述基板，據此，前述連接器裝設至前述基板並且安裝於前述基板的安裝面上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A technique for enabling a connector to be easily attached to and detached from a substrate is provided. A connector according to the present disclosure can be attached to and detached from a substrate including a plurality of pads, and can mate with an opponent connector. The connector includes a plurality of contacts, a shell that holds the plurality of contacts, and a coupling part that removably connects the shell to the substrate. The shell includes a shell body, and a claw protruded from the shell body. The claw includes a claw body, and a protrusion protruded from the claw body. The claw catches the substrate and the coupling part couples the shell to the substrate, whereby the connector is attached to the substrate and is mounted on a mounting surface of the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:連接器</p>
        <p type="p">110:外罩</p>
        <p type="p">111:外罩體</p>
        <p type="p">111A:嵌合開口</p>
        <p type="p">111B:基板側開口</p>
        <p type="p">111C:基板側端部</p>
        <p type="p">112:爪</p>
        <p type="p">113:爪體</p>
        <p type="p">114:突起</p>
        <p type="p">114A:延伸部</p>
        <p type="p">120:接觸件組</p>
        <p type="p">120A:接觸件排</p>
        <p type="p">120B:接觸件排</p>
        <p type="p">121A:接觸件</p>
        <p type="p">121a:接觸部</p>
        <p type="p">121B:接觸件</p>
        <p type="p">121b:接觸部</p>
        <p type="p">130:螺絲鎖固部</p>
        <p type="p">130A:貫穿孔</p>
        <p type="p">150:絕緣體</p>
        <p type="p">151:凸部</p>
        <p type="p">LL:距離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1775" publication-number="202624246">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624246</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140520</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有減少的（ＲＮ）Ｍ（ＯＲ）　和（ＲＮ）Ｍ（Ｎ（ＲＲ））　含量的含第Ｖ族金屬的配製物（ＲＮ）Ｍ（Ｎ（ＲＲ））ｘ（ＯＲ）　－ｘ的合成及應用</chinese-title>
        <english-title>SYNTHESIS AND APPLICATION OF GROUP V METAL-CONTAINING FORMULATIONS (RN)M(N(RR))X(OR) -X WITH REDUCED (RN)M(OR)  AND (RN)M(N(RR))  CONTENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07F9/00</main-classification>
        <further-classification edition="200601120260302B">C23C16/30</further-classification>
        <further-classification edition="200601120260302B">C23C16/34</further-classification>
        <further-classification edition="200601120260302B">C23C16/40</further-classification>
        <further-classification edition="200601120260302B">C23C16/455</further-classification>
        <further-classification edition="202601120260302B">H10P14/60</further-classification>
        <further-classification edition="202601120260302B">H10P14/692</further-classification>
        <further-classification edition="202601120260302B">H10P14/694</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商液態空氣喬治斯克勞帝方法研究開發股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼基弗洛夫　格里戈里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIKIFOROV, GRIGORY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　超元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHAO-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧爾班　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORBAN, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種化學品組成物，其具有(R&lt;sup&gt;1&lt;/sup&gt;N)M(N(R&lt;sup&gt;2&lt;/sup&gt;R&lt;sup&gt;3&lt;/sup&gt;))&lt;sub&gt;2&lt;/sub&gt;(OR&lt;sup&gt;4&lt;/sup&gt;)&lt;sub&gt;1&lt;/sub&gt;和(R&lt;sup&gt;1&lt;/sup&gt;N)M(N(R&lt;sup&gt;2&lt;/sup&gt;R&lt;sup&gt;3&lt;/sup&gt;))&lt;sub&gt;1&lt;/sub&gt;(OR&lt;sup&gt;4&lt;/sup&gt;)&lt;sub&gt;2&lt;/sub&gt;兩者，該化學品組成物進一步具有小於五莫耳百分比（5 Mol.%）的(R&lt;sup&gt;1&lt;/sup&gt;N)Nb(N R&lt;sup&gt;2&lt;/sup&gt;R&lt;sup&gt;3&lt;/sup&gt;)&lt;sub&gt;3&lt;/sub&gt;；和小於3 Mol.%的(R&lt;sup&gt;1&lt;/sup&gt;N)Nb(OR&lt;sup&gt;4&lt;/sup&gt;)&lt;sub&gt;3&lt;/sub&gt;。該化學品組成物作為氣相沈積前驅物以沈積含M材料如氧化鈮的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A chemical composition having both (R&lt;sup&gt;1&lt;/sup&gt;N)M(N(R&lt;sup&gt;2&lt;/sup&gt;R&lt;sup&gt;3&lt;/sup&gt;))&lt;sub&gt;2&lt;/sub&gt;(OR&lt;sup&gt;4&lt;/sup&gt;)&lt;sub&gt;1&lt;/sub&gt; and (R&lt;sup&gt;1&lt;/sup&gt;N)M(N(R&lt;sup&gt;2&lt;/sup&gt;R&lt;sup&gt;3&lt;/sup&gt;))&lt;sub&gt;1&lt;/sub&gt;(OR&lt;sup&gt;4&lt;/sup&gt;)&lt;sub&gt;2&lt;/sub&gt;, the chemical composition further having less than five molar percent (5 Mol.%) of (R&lt;sup&gt;1&lt;/sup&gt;N)Nb(N R&lt;sup&gt;2&lt;/sup&gt;R&lt;sup&gt;3&lt;/sup&gt;)&lt;sub&gt;3&lt;/sub&gt;; and less than 3 Mol.% of (R&lt;sup&gt;1&lt;/sup&gt;N)Nb(OR&lt;sup&gt;4&lt;/sup&gt;)&lt;sub&gt;3&lt;/sub&gt;. Use of the chemical composition as a vapor phase deposition precursor to deposit M containing materials such as Niobium Oxide.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1776" publication-number="202624920">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624920</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140529</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電壓控制電路及電壓產生裝置</chinese-title>
        <english-title>VOLTAGE CONTROL CIRCUIT AND VOLTAGE GENERATION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">G06F1/10</main-classification>
        <further-classification edition="200601120260309B">G09G3/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矽創電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SITRONIX TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃致閎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIH-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃立宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, LI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡秀玫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電壓控制電路及電壓產生裝置，電壓控制電路包含第一電壓端、第二電壓端及電壓調節單元，第一電壓端提供第一電壓，第二電壓端提供第二電壓 ，於充電階段第一電壓端及第二電壓端耦接一電容 ，使電容接收第一電壓及第二電壓，電壓調節單元於輸出階段調整電容的電壓，其中電壓控制電路透過電容於輸出階段產生複數倍的第一電壓或複數倍的第二電壓。電壓產生裝置包含第一電壓產生電路、第二電壓產生電路、電容及電壓控制電路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a voltage control circuit and a voltage generation device, voltage control circuit comprises a first voltage terminal, a second voltage terminal and a voltage adjustment unit. The first voltage terminal provides a first voltage, the first second terminal provides a second voltage, during a charging phase, a capacitor is coupled to the first and second voltage terminals so that the capacitor receives the first and second voltages. during a pushing phase, the voltage adjustment unit adjusts the voltage of the capacitor. A voltage control circuit generates multiples of the first voltage or multiples of the second voltage via the capacitor during the pushing phase. The voltage generation device comprises a first voltage generation circuit, a second voltage generation circuit, a capacitor, and a voltage control circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:電壓產生裝置</p>
        <p type="p">210:第一電壓產生電路</p>
        <p type="p">220:第二電壓產生電路</p>
        <p type="p">230:電壓控制電路</p>
        <p type="p">CF:電容</p>
        <p type="p">CS:儲存電容</p>
        <p type="p">Vpos:第一電壓</p>
        <p type="p">Vneg:第二電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1777" publication-number="202624455">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624455</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140550</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含量子點的感光組合物、包含此組合物的固化薄膜及顯示裝置</chinese-title>
        <english-title>QUANTUM DOT-CONTAINING PHOTOSENSITIVE COMPOSITION, AND CURED FILM AND DISPLAY DEVICE COMPRISING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C09K11/02</main-classification>
        <further-classification edition="200601120260302B">C09K11/56</further-classification>
        <further-classification edition="200601120260302B">C09K11/70</further-classification>
        <further-classification edition="200601120260302B">C09K11/88</further-classification>
        <further-classification edition="201801120260302B">C08K3/01</further-classification>
        <further-classification edition="200601120260302B">C08K9/04</further-classification>
        <further-classification edition="200601120260302B">C08L101/08</further-classification>
        <further-classification edition="200601120260302B">C08F2/44</further-classification>
        <further-classification edition="200601120260302B">C08F2/50</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/027</further-classification>
        <further-classification edition="200601120260302B">G03F7/031</further-classification>
        <further-classification edition="200601120260302B">G03F7/032</further-classification>
        <further-classification edition="202501120260302B">H10H20/80</further-classification>
        <further-classification edition="202501120260302B">H10H20/851</further-classification>
        <further-classification edition="202501120260302B">H10H20/855</further-classification>
        <further-classification edition="202301120260302B">H10K59/35</further-classification>
        <further-classification edition="202301120260302B">H10K59/38</further-classification>
        <further-classification edition="202301120260302B">H10K59/80</further-classification>
        <further-classification edition="200601120260302B">G09F9/33</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商韓松化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANSOL CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金成民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SEONG MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安昭妍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AN, SO YEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金吉蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, GIL RAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金京南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KYUNG NAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示一種含量子點的感光組合物、以及包括其的固化薄膜和顯示裝置。在含量子點的感光組合物中，量子點的配體層含有特定配體化合物的組合以改善與分子中具有羧基的黏合劑的混溶性，從而能夠實現具有正錐形的圖案，因此，可有效地應用於製造符合大面積和高解析度特性兩者的高品質顯示裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A quantum dot-containing photosensitive composition, and a cured film and a display device including the same are disclosed. In the quantum dot-containing photosensitive composition, a ligand layer of quantum dots contains a combination of specific ligand compounds to improve miscibility with a binder having carboxyl group in the molecule, thereby enabling realization of a pattern having a positive taper, and thus can be effectively applied to manufacture of high quality display devices satisfying both large area and high definition characteristics.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1778" publication-number="202624462">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624462</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140554</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>藥液、被處理物之處理方法、半導體器件之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C09K13/08</main-classification>
        <further-classification edition="202301120260302B">H10B12/00</further-classification>
        <further-classification edition="202601120260302B">H10P14/20</further-classification>
        <further-classification edition="202601120260302B">H10P14/40</further-classification>
        <further-classification edition="202601120260302B">H10P50/64</further-classification>
        <further-classification edition="202601120260302B">H10P50/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮崎広輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAZAKI, KOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋智威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, TOMONORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋和敬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, KAZUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種藥液，其能夠從具有鍺濃度不同的兩種含矽-鍺物的被處理物中選擇性地去除鍺濃度較高的含矽-鍺物。又，本發明提供一種上述藥液所涉及的被處理物之處理方法及半導體器件之製造方法。本發明之藥液用於具有鍺濃度不同的兩種含矽-鍺物的被處理物，其中，所述藥液含有氟化物離子源、氧化劑及水，在試驗1中測量的、腐蝕電位E（V vs. Ag/AgCl）與源自上述氟化物離子源的氟化物離子及含氟離子在上述藥液中的濃度C（mol/L）滿足下式（X）的關係。  &lt;br/&gt;　　E-0.05×C＞-0.20   式（X）</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1779" publication-number="202624206">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624206</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140561</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鋶鹽型單體、聚合物、化學增幅阻劑組成物及圖案形成方法</chinese-title>
        <english-title>SULFONIUM SALT MONOMER, POLYMER, CHEMICALLY AMPLIFIED RESIST COMPOSITION, AND PATTERN FORMING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">C07C381/12</main-classification>
        <further-classification edition="200601120260313B">C07C309/11</further-classification>
        <further-classification edition="200601120260313B">C07C309/12</further-classification>
        <further-classification edition="200601120260313B">C07C309/17</further-classification>
        <further-classification edition="200601120260313B">C07C309/73</further-classification>
        <further-classification edition="200601120260313B">C08F212/14</further-classification>
        <further-classification edition="200601120260313B">C08F212/32</further-classification>
        <further-classification edition="200601120260313B">C08F220/38</further-classification>
        <further-classification edition="200601120260313B">G03F7/004</further-classification>
        <further-classification edition="200601120260313B">G03F7/039</further-classification>
        <further-classification edition="200601120260313B">G03F7/20</further-classification>
        <further-classification edition="200601120260313B">G03F7/32</further-classification>
        <further-classification edition="202601120260313B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島将大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係提供在使用高能射線之光微影中，溶劑溶解性優良，為高感度、高對比度，且LWR、CDU、EL、DOF等微影性能優良之化學增幅阻劑組成物中使用之鋶鹽型單體、含有來自該鋶鹽型單體之重複單元之聚合物、含有該聚合物之化學增幅阻劑組成物、及使用該化學增幅阻劑組成物之圖案形成方法。  &lt;br/&gt;本發明之解決手段係下式(A)表示之鋶鹽型單體。  &lt;br/&gt;&lt;img align="absmiddle" height="225px" width="620px" file="ed10405.JPG" alt="ed10405.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A sulfonium salt monomer consists of a sulfonium cation having pentafluorosulfanyl and hydrocarbyloxycarbonyl groups and a fluorosulfonic acid anion having a polymerizable group. A resist composition comprising a polymer comprising repeat units derived from the monomer exhibits a high solvent solubility, high sensitivity and high contrast and forms a small-size pattern having satisfactory lithography properties such as LWR, CDU, EL and DOF.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1780" publication-number="202624253">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624253</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140583</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>大腸桿菌FIMH突變體及其用途</chinese-title>
        <english-title>E. COLI FIMH MUTANTS AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">C07K14/245</main-classification>
        <further-classification edition="200601120260305B">A61K39/108</further-classification>
        <further-classification edition="200601120260305B">A61P13/02</further-classification>
        <further-classification edition="200601120260305B">A61P31/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商輝瑞大藥廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PFIZER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>車　曄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHE, YE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丘洛　勞倫特　奧利佛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHORRO, LAURENT OLIVER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐納　羅伯特　喬治　康瑞德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONALD, ROBERT GEORGE KONRAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛里佛　馬修　克堤斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRIFFOR, MATTHEW CURTIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>席爾蒙　迪　蒙奈里　娜塔莉　克萊兒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILMON DE MONERRI, NATALIE CLARE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣大中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於具有經改良生物化學特性及免疫原性的經突變大腸桿菌(&lt;i&gt;E. coli&lt;/i&gt;) FimH多肽之設計，以及包含此類多肽之組合物及其用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure relates to the design of &lt;i&gt;E. coli&lt;/i&gt; mutated FimH polypeptides that result in improved biochemical properties and immunogenicity, compositions comprising such polypeptides, and uses thereof.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1781" publication-number="202625650">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625650</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140592</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發光裝置及包含該發光裝置的發光顯示裝置</chinese-title>
        <english-title>LIGHT EMITTING DEVICE AND LIGHT EMITTING DISPLAY DEVICE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251230B">H10K50/805</main-classification>
        <further-classification edition="202301120251230B">H10K50/12</further-classification>
        <further-classification edition="202301120251230B">H10K50/125</further-classification>
        <further-classification edition="202301120251230B">H10K59/32</further-classification>
        <further-classification edition="202301120251230B">H10K59/35</further-classification>
        <further-classification edition="202301120251230B">H10K59/80</further-classification>
        <further-classification edition="202301120251230B">H10K59/123</further-classification>
        <further-classification edition="202301120251230B">H10K59/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ顯示器股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金光鍾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KWANG JONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申桃榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, DO YEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權秀玟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GWON, SU MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種發光裝置以及一種包含該發光裝置的發光顯示裝置。該發光裝置可包括：面向彼此的第一電極及第二電極；以及第一共同層、第一發光層、及第二共同層，設置在第一電極與第二電極之間。第一發光層可包含第一層、第二層、及第三層，依序設置在第一共同層與第二共同層之間，各自含有摻雜劑。第一層可包含第一主體，第二層可包含第二主體，其具有低於第一主體的三重態能階，而第三層可僅包含摻雜劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light emitting device and a light emitting display device including the same are discussed. The light emitting device can include a first electrode and a second electrode facing each other, and a first common layer, a first light emitting layer, and a second common layer disposed between the first electrode and the second electrode. The first light emitting layer can include a first layer, a second layer, and a third layer sequentially disposed between the first common layer and the second common layer, each containing a dopant. The first layer can include a first host, the second layer can include a second host having a lower triplet energy level than the first host, and the third layer can include the dopant singly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">AND:第一電極</p>
        <p type="p">BD:摻雜劑</p>
        <p type="p">BH1:第一主體</p>
        <p type="p">BH2:第二主體</p>
        <p type="p">CAT:第二電極</p>
        <p type="p">CML1:第一共同層</p>
        <p type="p">CML2:第二共同層</p>
        <p type="p">ED:發光裝置</p>
        <p type="p">EMA1:第一層</p>
        <p type="p">EMA2:第二層</p>
        <p type="p">EMA3:第三層</p>
        <p type="p">EML:發光層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1782" publication-number="202625703">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625703</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140619</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>射頻濾波器和承載裝置</chinese-title>
        <english-title>RADIO FREQUENCY FILTER AND CARRIER DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P50/20</main-classification>
        <further-classification edition="202601120260302B">H10P72/76</further-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
        <further-classification edition="200601120260302B">H01F27/28</further-classification>
        <further-classification edition="200601120260302B">H01F27/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>付豔豔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, YAN YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例提供了一種射頻濾波器和承載裝置，包括原生電感和原生電容，原生電感的第一端作為濾波輸入端，原生電感的第二端作為濾波輸出端，並與原生電容的第一端連接，原生電容的第二端用於接地，原生電感和原生電容共同用於濾除第一目標頻率的信號；原生電感包括多匝電感線圈，多匝電感線圈的匝間距相同，匝間距被調整為預定值，以用於濾除第二目標頻率的信號，第二目標頻率大於第一目標頻率。藉由本發明實施例可以實現雙頻點濾波。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The embodiments of the present invention provide a radio frequency filter and a carrier device, comprising a primary inductor and a primary capacitor. A first end of the primary inductor serves as the filter input terminal, and a second end of the primary inductor serves as the filter output terminal and is connected to a first end of the primary capacitor. A second end of the primary capacitor is grounded. The primary inductor and the primary capacitor are jointly used to filter signals at a first target frequency. The primary inductor comprises a multi-turn inductor coil, wherein the spacing between the turns of the coil is uniform, and the turn spacing is adjusted to a predetermined value to filter signals at a second target frequency, the second target frequency being higher than the first target frequency. Through the embodiments of the present invention, dual-frequency filtering can be achieved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:原生電感</p>
        <p type="p">200:原生電容</p>
        <p type="p">300:環狀磁芯</p>
        <p type="p">310:第一磁棒</p>
        <p type="p">320:第二磁棒</p>
        <p type="p">400:樹脂膠</p>
        <p type="p">500:外殼</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1783" publication-number="202624867">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624867</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140627</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">G02F1/1362</main-classification>
        <further-classification edition="200601120260313B">G02F1/1335</further-classification>
        <further-classification edition="202501120260313B">H10D86/60</further-classification>
        <further-classification edition="200601120260313B">G09G3/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商半導體能源研究所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山崎舜平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAZAKI, SHUNPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉住健輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIZUMI, KENSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宍戸英明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHISHIDO, HIDEAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠降低耗電量的顯示裝置。本發明提高顯示裝置的開口率。顯示裝置包括具有第一子像素及第二子像素的像素。第一子像素包括第一彩色層及第一電晶體，第二子像素包括第二彩色層及第二電晶體。第一電晶體及第二電晶體所包括的半導體層的形成通道的部分至少以與第一彩色層重疊的方式配置。第一彩色層吸收其波長比第二彩色層吸收的波長的光短的光，構成電晶體的半導體層、電極及佈線等透過可見光。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device whose power consumption can be reduced is provided. Alternatively, the aperture ratio of a display device is increased. The display device includes a pixel having a first subpixel and a second subpixel. The first subpixel includes a first coloring layer and a first transistor, and the second subpixel includes a second coloring layer and a second transistor. At least regions where channels might be formed in semiconductor layers of the first and second transistors are positioned to overlap with the first coloring layer. The first coloring layer is likely to absorb light with a shorter wavelength than light absorbed by the second coloring layer. The semiconductor layers, electrodes, wirings, and the like included in the transistors transmit visible light.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:基板</p>
        <p type="p">12:基板</p>
        <p type="p">13B:顯示區域</p>
        <p type="p">13G:顯示區域</p>
        <p type="p">13R:顯示區域</p>
        <p type="p">20:液晶元件</p>
        <p type="p">21:導電層</p>
        <p type="p">22:液晶</p>
        <p type="p">23:導電層</p>
        <p type="p">24a:配向膜</p>
        <p type="p">24b:配向膜</p>
        <p type="p">25B:光</p>
        <p type="p">25G:光</p>
        <p type="p">25R:光</p>
        <p type="p">26:絕緣層</p>
        <p type="p">30B:電晶體</p>
        <p type="p">30G:電晶體</p>
        <p type="p">30R:電晶體</p>
        <p type="p">34:絕緣層</p>
        <p type="p">39a:偏光板</p>
        <p type="p">39b:偏光板</p>
        <p type="p">41B:彩色層</p>
        <p type="p">41G:彩色層</p>
        <p type="p">41R:彩色層</p>
        <p type="p">42:遮光層</p>
        <p type="p">81:絕緣層</p>
        <p type="p">90:背光單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1784" publication-number="202623910">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623910</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140660</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>排風管道清洗裝置及半導體製程設備</chinese-title>
        <english-title>EXHAUST DUCT CLEANING DEVICE AND SEMICONDUCTOR PROCESS EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251126B">B08B9/032</main-classification>
        <further-classification edition="200601120251126B">B08B13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張玉濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YU TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙宏宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, HONG YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋愛軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, AI JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王銳廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, RUI TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許璐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, LU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>屠楠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧夕生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, XI SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王岩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種排風管道清洗裝置及半導體製程設備，該裝置包括安裝基體、調節主體和鎖緊組件，安裝基體能在使用時安裝於排風管道；調節主體能夠伸入排風管道中，且具有用於輸送清洗流體的進流通道，進流通道的出流口用於與排風管道內部連通；鎖緊組件與調節主體螺旋配合，且可圍繞螺旋軸線轉動地連接於安裝基體；鎖緊組件能夠在鎖緊狀態和調節狀態之間切換，在鎖緊狀態，鎖緊組件用於將調節主體鎖緊於安裝基體；在調節狀態，鎖緊組件能夠圍繞螺旋軸線轉動，並帶動調節主體相對於安裝基體沿螺旋軸線移動。本方案可以減小清洗液體外泄風險。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides an exhaust duct cleaning device and a semiconductor process equipment. The device includes a mounting base, an adjustment body, and a locking component. The mounting base can be installed onto the exhaust duct during use. The adjustment body is capable of extending into the exhaust duct and is equipped with an inlet channel for delivering cleaning fluid. The outlet of the inlet channel is used to communicate with the interior of the exhaust duct. The locking component is threadedly engaged with the adjustment body and is rotatably connected to the mounting base around a helical axis. The locking component can switch between a locked state and an adjustment state. In the locked state, the locking component is used to secure the adjustment body to the mounting base. In the adjustment state, the locking component can rotate around the helical axis and drive the adjustment body to move along the helical axis relative to the mounting base. This solution can reduce the risk of cleaning fluid leakage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">30:製程腔室</p>
        <p type="p">50:供應管路</p>
        <p type="p">60:接頭</p>
        <p type="p">100:排風管道清洗裝置</p>
        <p type="p">101:頂部殼壁</p>
        <p type="p">102:周向殼壁</p>
        <p type="p">103:內部空間</p>
        <p type="p">104:定位凹槽</p>
        <p type="p">110:安裝基體</p>
        <p type="p">120:調節主體</p>
        <p type="p">121:第一柱體</p>
        <p type="p">122:第二柱體</p>
        <p type="p">123:進流通道</p>
        <p type="p">124:環形凹槽</p>
        <p type="p">130:鎖緊組件</p>
        <p type="p">200:排風管道</p>
        <p type="p">201:水平管段</p>
        <p type="p">202:垂直管段</p>
        <p type="p">203:定位凸起</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1785" publication-number="202624845">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624845</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140670</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>隱形眼鏡之設計方法</chinese-title>
        <english-title>DESIGN METHOD OF CONTACT LENS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">G02C7/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商實瞳股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEED CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>下元康督</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMOMOTO, YASUMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福田猛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUDA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]  &lt;br/&gt;　　可簡易地進行鞏膜隱形眼鏡的驗配。  &lt;br/&gt;[解決手段]  &lt;br/&gt;　　本揭示的隱形眼鏡之設計方法包含：設定間隙形成區域的三個區域各自的直徑的數值和貼合形成區域的二個區域各自的直徑的數值的工程，使用設定的間隙形成區域的三個區域各自的直徑的數值設定間隙形成區域的整體的矢狀深度的數值和間隙形成區域的三個區域各自的矢狀深度的數值的工程，以及使用設定的各直徑的數值和設定的各個矢狀深度的數值設定間隙形成區域的三個區域各自的曲率半徑的數值和貼合形成區域的二個區域各自的曲率半徑的數值的工程。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A design method of a contact lens of the present disclosure includes: setting values of respective diameters of three zones of a clearance formation area and values of respective diameters of two zones of a fitting formation area; setting a value of an entire sagittal depth of the clearance formation area and values of respective sagittal depths of the three zones of the clearance formation area, based on the values of respective diameters of the three zones of the clearance formation area thus set; and setting values of respective curvature radii of the three zones of the clearance formation area and values of respective curvature radii of the two zones of the fitting formation area, based on the value of each diameter thus set and the value of each sagittal depth thus set.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1786" publication-number="202625489">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625489</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140675</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在正交覆蓋碼期間內的上行鏈路重複</chinese-title>
        <english-title>UPLINK REPETITIONS WITHIN OCC PERIOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260309B">H04W72/1268</main-classification>
        <further-classification edition="200601120260309B">H04L1/08</further-classification>
        <further-classification edition="202301120260309B">H04L1/18</further-classification>
        <further-classification edition="200601120260309B">H04L5/00</further-classification>
        <further-classification edition="200901120260309B">H04W56/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬蘭商諾基亞科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOKIA TECHNOLOGIES OY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬可尼　阿里西歐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARCONE, ALESSIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗雷德里克森　法蘭克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FREDERIKSEN, FRANK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳遠興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YUAN XING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿扎里　馬赫迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AZARI, MAHDI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容係有關用於條件式拋棄正交覆蓋碼(OCC)週期內之上行鏈路重複的裝置、方法及電腦可讀媒體。於一方法中，一終端裝置自一網路設備接收有關一事件的組態資訊，該事件與該終端裝置之一操作相關聯。該事件在維持一OCC週期內之相位連貫性或功率恆定性其中至少一者上產生影響。接著，該終端裝置基於該組態資訊之接收時間或該事件之發生時間而針對在該OCC週期內的上行鏈路重複及/或針對該事件判定一傳輸方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to devices, methods and computer readable storage medium for conditional dropping of uplink repetitions within an Orthogonal Cover Code (OCC) period. In a method, a terminal device receives, from a network apparatus, configuration information about an event associated with an operation of the terminal device. The event influences on maintaining at least one of phase continuity or power consistency within an OCC period. Then, the terminal device determines a transmission method for uplink repetitions within the OCC period and/or for the event based on a reception time of the configuration information or an occurrence time of the event.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:終端裝置</p>
        <p type="p">120:網路設備</p>
        <p type="p">500:處理作業</p>
        <p type="p">510:發送</p>
        <p type="p">520:接收</p>
        <p type="p">530:判定</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1787" publication-number="202624002">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624002</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140929</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子紙用之光學積層體及使用其之電子紙</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">B32B9/00</main-classification>
        <further-classification edition="200601120260302B">B32B23/08</further-classification>
        <further-classification edition="200601120260302B">B32B27/36</further-classification>
        <further-classification edition="201901120260302B">G02F1/167</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大日本印刷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>春木暁人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARUKI, AKIHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山西祥多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMANISHI, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>工藤卓磨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUDO, TAKUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飯田祥人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IIDA, YOSHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茂木菜菜可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOKI, NANAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂本武士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAMOTO, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種抑制了阻隔性之經時性降低之電子紙用之光學積層體。本發明之電子紙用之光學積層體係一種具有第1面P1、及與上述第1面相反側之第2面P2之電子紙用之光學積層體200，且上述光學積層體具有第1基材11、及於第2基材12上具有無機氧化物層21之阻隔膜100，上述第1基材11較上述第2基材12位於更靠上述第1面P1側，上述無機氧化物層21位於上述第2基材12之上述第2面P2側，上述第1基材11為三乙醯纖維素膜，上述第2基材12為聚酯膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:第1基材</p>
        <p type="p">12:第2基材</p>
        <p type="p">13:第3基材</p>
        <p type="p">21:無機氧化物層</p>
        <p type="p">22:被覆層</p>
        <p type="p">31:第1接著劑層</p>
        <p type="p">32:第2接著劑層</p>
        <p type="p">100:阻隔膜</p>
        <p type="p">200:電子紙用之光學積層體</p>
        <p type="p">P1:第1面</p>
        <p type="p">P2:第2面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1788" publication-number="202625274">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625274</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140944</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於電解器系統之待命方法</chinese-title>
        <english-title>STANDBY METHOD FOR AN ELECTROLYSER SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260303B">H01M8/04298</main-classification>
        <further-classification edition="201601120260303B">H01M8/04694</further-classification>
        <further-classification edition="200601120260303B">C25B1/02</further-classification>
        <further-classification edition="202101120260303B">C25B9/17</further-classification>
        <further-classification edition="200601120260303B">C10L1/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商席瑞絲電力有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CERES POWER LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞利　約書亞　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RYLEY, JOSHUA CLAYDON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮萊　阿努帕瑪　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PILLAI, ANUPAMA RAMACHANDRAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種操作一電解器系統之方法，該電解器系統一或多個電解器電池單元之堆疊體。該一或多個堆疊體之各堆疊體具有燃料及氧體積。該方法包含下列步驟：藉由在一操作溫度供給燃料在一產物產生模式中操作該電解器系統或在一升溫模式中操作該電解器系統；決定一待命情況；及依據該待命情況轉換至一待命狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of operating an electrolyser system comprising one or more stacks of electrolyser cell units. Each of the one or more stacks having fuel and oxygen volumes. The method comprises operating the electrolyser system in a product-generating mode by supplying fuel at an operating temperature or operating the electrolyser system in a warm up mode, determining a standby condition, and transitioning to a standby state based on the standby condition.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:方法，待命方法</p>
        <p type="p">205,210,215,220,225,230:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1789" publication-number="202625476">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625476</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141010</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>處理通道狀態資訊報告的方法和用戶設備</chinese-title>
        <english-title>METHOD FOR HANDLING CHANNEL STATUS INFORMATION REPORT AND USER EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260315B">H04W24/10</main-classification>
        <further-classification edition="200901120260315B">H04W36/30</further-classification>
        <further-classification edition="201701120260315B">H04B7/0413</further-classification>
        <further-classification edition="202301120260315B">H04W72/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李建民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIEN-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅立中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, LI-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仁賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王鴻翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HUNG-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例提供一種處理通道狀態資訊（CSI）報告的方法和用戶設備。方法包括：根據第一參考信號集合判定第一CSI，其中第一參考信號集合根據由網路設備傳輸的第一配置來判定；根據第一配置將第一CSI傳輸到網路設備；根據第二參考信號集合判定第二CSI；根據由網路設備傳輸的第一資訊與目標候選細胞執行細胞切換；反應於判定第二CSI不包括無效CSI，將第二CSI傳輸到目標候選細胞；以及反應於判定第二CSI包括至少一個無效CSI，將包括至少一個對應於最低索引的通道品質指示（CQI）的第二CSI傳輸到目標候選細胞。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The embodiments of the disclosure provide a handling a channel status information (CSI) report and a user equipment (UE). The method includes: determining a first CSI according to a first set of reference signal, wherein the first set of reference signal is determined according to a first configuration transmitted by a network device; transmitting the first CSI according to the first configuration; determining a second CSI according to a second set of reference signal; performing a cell switch with a target candidate cell according to a first information transmitted by the network device; in response to determining that the second CSI does not comprise invalid CSI, transmitting the second CSI to the target candidate cell; and in response to determining that the second CSI comprises at least one invalid CSI, transmitting the second CSI comprising at least one CQI corresponding to a lowest index to the target candidate cell.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S310~S370:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1790" publication-number="202624456">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624456</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141013</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>內核/外殼型半導體奈米粒子之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">C09K11/06</main-classification>
        <further-classification edition="201101120260312B">B82Y40/00</further-classification>
        <further-classification edition="201101120260312B">B82Y20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商昭榮化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHOEI CHEMICAL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青山良正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOYAMA, YOSHIMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>城戶信人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIDO, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種內核/外殼型半導體奈米粒子之製造方法，其特徵在於具有：藉由將內核粒子或具有1個以上外殼之內核/外殼型半導體奈米粒子之中間體粒子、分散媒、與外殼前驅物混合並使該等反應，於內核粒子或具有1個以上外殼之內核/外殼型半導體奈米粒子之中間體粒子的表面之至少一部分形成外殼，而得到內核/外殼型半導體奈米粒子的外殼形成步驟；上述分散媒係含有酯化合物。根據本發明，可提供可提高內核/外殼型半導體奈米粒子之量子效率的內核/外殼型半導體奈米粒子之製造方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1791" publication-number="202624458">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624458</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141014</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>內核/外殼型半導體奈米粒子之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">C09K11/88</main-classification>
        <further-classification edition="201101120260312B">B82Y40/00</further-classification>
        <further-classification edition="201101120260312B">B82Y20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商昭榮化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHOEI CHEMICAL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青山良正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOYAMA, YOSHIMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>城戶信人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIDO, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種內核/外殼型半導體奈米粒子之製造方法，其特徵在於具有：藉由將內核粒子或具有1個以上外殼之內核/外殼型半導體奈米粒子之中間體粒子、分散媒、與外殼前驅物混合並使該等反應，於內核粒子或具有1個以上外殼之內核/外殼型半導體奈米粒子之中間體粒子的表面之至少一部分形成外殼，而得到內核/外殼型半導體奈米粒子的外殼形成步驟；上述分散媒係含有苄醇及/或其取代化合物。根據本發明，可提供可提高內核/外殼型半導體奈米粒子之量子效率的內核/外殼型半導體奈米粒子之製造方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1792" publication-number="202624185">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624185</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141021</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感放射線性組成物及圖案形成方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07C53/08</main-classification>
        <further-classification edition="200601120260302B">C07C53/124</further-classification>
        <further-classification edition="200601120260302B">C07C53/18</further-classification>
        <further-classification edition="200601120260302B">C07C55/06</further-classification>
        <further-classification edition="200601120260302B">C07C59/08</further-classification>
        <further-classification edition="200601120260302B">C07C59/19</further-classification>
        <further-classification edition="200601120260302B">C07C63/04</further-classification>
        <further-classification edition="200601120260302B">C07C63/06</further-classification>
        <further-classification edition="200601120260302B">C07C63/36</further-classification>
        <further-classification edition="200601120260302B">C07C63/70</further-classification>
        <further-classification edition="200601120260302B">C07C65/10</further-classification>
        <further-classification edition="200601120260302B">C07C65/21</further-classification>
        <further-classification edition="200601120260302B">C07C381/12</further-classification>
        <further-classification edition="200601120260302B">C08F112/14</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/039</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="200601120260302B">G03F7/32</further-classification>
        <further-classification edition="202601120260302B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ　股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錦織克聡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIKORI, KATSUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大宮拓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OMIYA, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林敦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江崎郁哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ESAKI, FUMIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供一種保存穩定性良好，並且於圖案形成時可以與先前同等以上的水準發揮感度、CDU及橋接裕度的感放射線性組成物及圖案形成方法。一種感放射線性組成物，含有：聚合物；一種以上的鎓鹽，包含有機酸根陰離子及感放射線性鎓陽離子；下述式（2）所表示的化合物；以及溶劑，所述鎓鹽中的至少一部分所述有機酸根陰離子為下述式（1）所表示的有機酸根陰離子（1）。  &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="391px" width="416px" file="ed10062.JPG" alt="ed10062.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="127px" width="387px" file="ed10063.JPG" alt="ed10063.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1793" publication-number="202624708">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624708</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141036</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>洩漏檢測組件及控制方法</chinese-title>
        <english-title>LEAK DETECTION ASSEMBLY AND CONTROL METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">G01M3/04</main-classification>
        <further-classification edition="200601120260312B">G01M3/20</further-classification>
        <further-classification edition="200601120260312B">G01M3/22</further-classification>
        <further-classification edition="200601120260312B">G01M3/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商普發真空公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PFEIFFER VACUUM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫倫　朱利安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COULOMB, JULIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諾米內　西里爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOMINE, CYRILLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種洩漏檢測組件(1)，包括洩漏檢測器(3)和高流量檢漏器配件(21)，高流量檢漏器配件(21)包含公共導管(22)，公共導管被配置以流體連接到檢漏器探針(2)，並且並行地，一方面流體連接到採樣導管(23)，採樣導管(23)連接到洩漏檢測器(3)的檢漏器閥(15)，另一方面流體連接到泵送導管(24)，泵送導管(24)連接到洩漏檢測器(3)的氣體入口閥(8,9)，使得在使用時，粗糙泵送裝置(6)經由氣體入口閥(8,9)將氣體抽入採樣導管(23)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Leak detection assembly (1) including a leak detector (3) and a high flow sniffer accessory (21) comprising a common duct (22) configured to be fluidically connected to a sniffer probe (2) and, in parallel, on the one hand, to a sampling duct (23) connected to a sniffer valve (15) of the leak detector (3) and, on the other hand, to a pumping duct (24) connected to a gas inlet valve (8, 9) of the leak detector (3), such that in use, the rough pumping device (6) draws into the sampling duct (23) via the gas inlet valve (8, 9).</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:洩漏檢測組件</p>
        <p type="p">2:檢漏器探針</p>
        <p type="p">3:洩漏檢測器</p>
        <p type="p">4:氣體分析單元</p>
        <p type="p">5:渦輪分子真空泵</p>
        <p type="p">6:粗糙泵送裝置</p>
        <p type="p">7:真空管路</p>
        <p type="p">8:進氣閥</p>
        <p type="p">9:吹掃閥</p>
        <p type="p">10:入口</p>
        <p type="p">11:流量限制器</p>
        <p type="p">12a:採樣閥</p>
        <p type="p">12b:採樣閥</p>
        <p type="p">12c:採樣閥</p>
        <p type="p">13:輸送閥</p>
        <p type="p">14:隔離閥</p>
        <p type="p">15:檢漏器閥</p>
        <p type="p">16:壓力感測器</p>
        <p type="p">17:校正洩漏</p>
        <p type="p">18:閥裝置</p>
        <p type="p">21:高流量檢漏器配件</p>
        <p type="p">22:公共導管</p>
        <p type="p">23:採樣導管</p>
        <p type="p">24:泵送導管</p>
        <p type="p">25:額外的隔離閥</p>
        <p type="p">26:流量限制器</p>
        <p type="p">27:流量限制器</p>
        <p type="p">28:額外的進氣閥</p>
        <p type="p">29:流體連接器</p>
        <p type="p">30:流體連接器</p>
        <p type="p">31:流體連接器</p>
        <p type="p">60:粗糙真空泵</p>
        <p type="p">61:粗糙真空泵</p>
        <p type="p">601:泵送段</p>
        <p type="p">602:泵送段</p>
        <p type="p">603:泵送段</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1794" publication-number="202624401">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624401</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141047</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>能量敏感性密著劑組合物、及積層體之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">C08L63/10</main-classification>
        <further-classification edition="200601120260312B">C08F2/48</further-classification>
        <further-classification edition="200601120260312B">C08G59/40</further-classification>
        <further-classification edition="200601120260312B">G03F7/004</further-classification>
        <further-classification edition="200601120260312B">C08J5/22</further-classification>
        <further-classification edition="201801120260312B">C09J7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>磯部信吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISOBE, SHINGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>星野元太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSHINO, GENTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秋澤健斗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKISAWA, KENTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題提供一種能量敏感性密著劑組合物、及積層體之製造方法，上述能量敏感性密著劑組合物係用於在具有基板、上層及位於基板與上層之間並且與上層接觸之密著劑層之積層體中形成密著劑層者，並且能夠降低密著劑層中之環氧基之量。  &lt;br/&gt;本發明之解決手段為用於在具有基板、上層及位於基板與上層之間並且與上層接觸之密著劑層之積層體中形成密著劑層之能量敏感性密著劑組合物，上述能量敏感性密著劑組合物含有樹脂(A)、熱產酸劑(B)及溶劑(C)，樹脂(A)含有包含具有環氧基之結構單元(a1)之樹脂(A1)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1795" publication-number="202625442">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625442</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141070</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>點雲之幾何的編碼及解碼</chinese-title>
        <english-title>ENCODING AND DECODING THE GEOMETRY OF A POINT CLOUD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260305B">H04N19/597</main-classification>
        <further-classification edition="201401120260305B">H04N19/13</further-classification>
        <further-classification edition="201401120260305B">H04N19/63</further-classification>
        <further-classification edition="201401120260305B">H04N19/18</further-classification>
        <further-classification edition="200601120260305B">G06T9/40</further-classification>
        <further-classification edition="200601120260305B">G06T9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商皇家飛利浦有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONINKLIJKE PHILIPS N.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉賽爾　賽巴斯欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LASSERRE, SEBASTIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔坤　喬納森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAQUET, JONATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示一種用於編碼及解碼一點雲幾何的概念。在一種編碼一點雲幾何之編碼方法中，其包含：基於表示與對一點雲之屬性進行寫碼之一區域適應性階層變換(RAHT)樹之一RAHT節點相關聯之一或多個RAHT權重之資訊而判定一組上下文之一索引；根據該索引自該組上下文選擇一上下文；及基於該經選擇上下文對該RAHT節點之一組RAHT係數進行熵編碼。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Concepts for encoding and decoding a point cloud geometry are disclosed. In an encoding method of encoding a point cloud geometry, it comprises determining, based on information representing one or more region-adaptive hierarchical transform (RAHT) weights associated with a RAHT node of a RAHT tree for coding attributes of a point cloud, an index for a set of contexts; selecting a context from the set of contexts according to the index; and entropy encoding, based on the selected context, a set of RAHT coefficients of the RAHT node.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2400:目前RAHT節點/目前節點</p>
        <p type="p">2410:逆變換</p>
        <p type="p">2411:集合{C&lt;sub&gt;k&lt;/sub&gt;}/RAHT係數</p>
        <p type="p">2420:步驟</p>
        <p type="p">2421:經選擇預測模式</p>
        <p type="p">2422:預測模式資訊</p>
        <p type="p">2430:步驟</p>
        <p type="p">2431:殘差RAHT係數</p>
        <p type="p">2440:解碼/熵寫碼</p>
        <p type="p">2442:係數資訊</p>
        <p type="p">2490:位元串流</p>
        <p type="p">2701:上下文</p>
        <p type="p">2702:方塊</p>
        <p type="p">2705:屬性</p>
        <p type="p">2710:資訊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1796" publication-number="202624522">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624522</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141076</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚晶鑽石膜及相關方法</chinese-title>
        <english-title>POLYCRYSTALLINE DIAMOND FILMS AND RELATED METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C23C16/27</main-classification>
        <further-classification edition="200601120260302B">C23C16/455</further-classification>
        <further-classification edition="200601120260302B">C23C16/56</further-classification>
        <further-classification edition="200601120260302B">C30B29/04</further-classification>
        <further-classification edition="200601120260302B">C30B25/02</further-classification>
        <further-classification edition="200601120260302B">C30B33/00</further-classification>
        <further-classification edition="201201120260302B">B24B37/005</further-classification>
        <further-classification edition="201001120260302B">G01Q60/24</further-classification>
        <further-classification edition="202601120260302B">H10W99/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENTEGRIS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛吉　雷傑　Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGH, RAJIV K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪　桑妮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE, SUNNY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維爾瑪　阿迪亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERMA, ADITYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉喬帕迪　艾克夏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAJOPADHYE, AKSHAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中描述用於經拋光塗佈基板之聚晶鑽石膜及相關方法。該製品包括一聚晶基板。該製品包括位於該聚晶基板上之一聚晶鑽石膜。該聚晶鑽石膜具有比該聚晶基板之一平均粒徑更小之一平均粒徑。如藉由原子力顯微鏡(AFM)量測，該聚晶鑽石膜具有50 nm或更小之一平均表面粗糙度R&lt;sub&gt;a&lt;/sub&gt;。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Polycrystalline diamond films and related μmethods for polished coated substrates are described herein. The article comprises a polycrystalline substrate. The article comprises a polycrystalline diamond film located on the polycrystalline substrate. The polycrystalline diamond film has an average grain size that is smaller than an average grain size of the polycrystalline substrate. The polycrystalline diamond film has an average surface roughness R&lt;sub&gt;a&lt;/sub&gt; of 50 nm or less as μmeasured by atomic force μmicroscopy (AFM).</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102:步驟</p>
        <p type="p">104:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1797" publication-number="202624892">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624892</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141097</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含矽之光阻下層膜形成用組成物及半導體元件之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">G03F7/11</main-classification>
        <further-classification edition="200601120260303B">G03F7/075</further-classification>
        <further-classification edition="200601120260303B">G03F7/26</further-classification>
        <further-classification edition="202601120260303B">H10P76/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日產化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武田諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEDA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古川優樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUKAWA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西條太規</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAIJO, TAIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之含矽之光阻下層膜形成用組成物，其係含有：  &lt;br/&gt;〔A〕成分：聚矽氧烷  &lt;br/&gt;〔B〕成分：聚醚改性矽油、以及  &lt;br/&gt;〔C〕成分：溶劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1798" publication-number="202624111">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624111</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141121</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>固態電池的新材料</chinese-title>
        <english-title>NEW MATERIAL IN SOLID STATE BATTERIES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260310B">C01B32/15</main-classification>
        <further-classification edition="201001120260310B">H01M4/583</further-classification>
        <further-classification edition="201001120260310B">H01M10/0525</further-classification>
        <further-classification edition="200601120260310B">C25B5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商碳素Ｘ　ＩＰ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARBONX IP B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索爾迪　丹尼拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SORDI, DANIELA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汎萊頓　路格亞歷山大大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN RAALTEN, RUTGER ALEXANDER DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於多孔、包含化學互連碳奈米纖維之碳網路作為電化學活性材料在固態電池之陽極中、作為電化學活性材料在無陽極固態電池之陰極中及/或作為基質材料在固態電池或無陽極固態電池之固態電解質中之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention pertains to the use of porous, chemically interconnected, carbon nanofibres-comprising carbon networks as electrochemically active material in an anode of a solid-state battery, as electrochemically active material in a cathode of an anode-less solid-state battery, and/or as matrix material in a solid-state electrolyte of a solid-state battery or of an anode-less solid-state battery.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1799" publication-number="202623936">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623936</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141126</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>雷射加壓鍵合裝置和方法</chinese-title>
        <english-title>LASER COMPRESSION BONDING DEVICE AND METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260302B">B23K26/21</main-classification>
        <further-classification edition="201401120260302B">B23K26/70</further-classification>
        <further-classification edition="202601120260302B">H10P72/70</further-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商星科金朋管理私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STATS CHIPPAC MANAGEMENT PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴鍾贊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JONGCHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閔炯碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIN, HYUNGSUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李泰根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TAEKEUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種雷射加壓鍵合方法，其包括：將基板放置在載體上；將加壓頭至少預熱到預定溫度；藉由所述預熱的加壓頭將電子元件經由焊接材料放置在基板上；藉由所述預熱的加壓頭將所述電子元件壓靠在所述基板上；以及從雷射源穿過所述預熱的加壓頭向所述基板照射雷射光束，以經由所述焊接材料將所述電子元件鍵合到所述基板上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">203:載體</p>
        <p type="p">205:基板</p>
        <p type="p">206:加壓頭</p>
        <p type="p">208:電子元件</p>
        <p type="p">210:焊接材料</p>
        <p type="p">212:雷射源</p>
        <p type="p">214:雷射光束</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1800" publication-number="202625871">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625871</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141127</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體封裝件和用於形成半導體封裝件的方法</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE, AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W76/01</main-classification>
        <further-classification edition="202601120260302B">H10W72/50</further-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
        <further-classification edition="202601120260302B">H10W74/01</further-classification>
        <further-classification edition="202601120260302B">H10W76/136</further-classification>
        <further-classification edition="202601120260302B">H10W20/43</further-classification>
        <further-classification edition="202601120260302B">H10W70/60</further-classification>
        <further-classification edition="202601120260302B">H10W74/10</further-classification>
        <further-classification edition="202601120260302B">H10W90/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＪＣＥＴ星科金朋韓國有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JCET STATS CHIPPAC KOREA LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元相</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RHEE, WONSANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴浚成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JOONSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權大鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, DAEHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供了一種半導體封裝件和一種用於形成半導體封裝件的方法。所述方法可包括：提供具有頂表面和底表面的基底，其中所述基底的頂表面具有第一區域和第二區域；將第一電子元件和第一互連結構安裝在所述第一區域上；形成第一密封劑以密封所述第一電子元件和所述第一互連結構，其中所述第一密封劑形成於所述第一區域中但在所述第二區域外部；在所述第一密封劑上形成導電圖形以與所述第一互連結構電連接；將第二電子元件安裝在所述第二區域上；以及將第三電子元件安裝在所述第一密封劑上以與所述導電圖形電連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體封裝件</p>
        <p type="p">110:基底</p>
        <p type="p">110a:頂表面</p>
        <p type="p">110b:底表面</p>
        <p type="p">112:重佈線結構(RDS)</p>
        <p type="p">121:第一電子元件</p>
        <p type="p">122:第二電子元件</p>
        <p type="p">123:第三電子元件</p>
        <p type="p">132:互連結構</p>
        <p type="p">134:導電圖形</p>
        <p type="p">141:第一密封劑</p>
        <p type="p">142:第二密封劑</p>
        <p type="p">I:第一區域</p>
        <p type="p">II:第二區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1801" publication-number="202624480">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624480</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141135</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>酵母培養用培養基及酵母的培養方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260309B">C12N1/16</main-classification>
        <further-classification edition="202201120260309B">C12P7/6427</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日清食品控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISSIN FOODS HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人神戶大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL UNIVERSITY CORPORATION KOBE UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松山秀人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUYAMA, HIDETO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熊谷和夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAGAI, KAZUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高城博也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKI, HIROYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三根健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINE, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宏亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱謙成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供無需將作為氮源的銨鹽與豆渣或豆渣提取液並用的產油脂酵母用培養基及產油脂酵母的培養方法。&lt;br/&gt;  在本發明中，使用濾膜將豆渣提取液濃縮到特定倍率，將該濃縮液添加到培養基中，由此即使不使用銨鹽也能夠培養酵母(特別是油脂酵母屬酵母)。本發明的酵母培養用培養基含有將豆渣提取液藉由濾膜而濃縮了氮成分的濃縮液。豆渣提取液是將豆渣和相對於豆渣乾燥重量為15倍以上且40倍以下的重量的水混合，用蛋白質分解酶進行酶處理後，對蛋白質分解酶進行失活處理，進行固液分離而得到的液體。來自濃縮液的培養基中的氮濃度在0.1重量%以上且0.4重量%以下的範圍內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1802" publication-number="202624418">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624418</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141160</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於形成有機薄膜的組成物和技術</chinese-title>
        <english-title>COMPOSITIONS AND TECHNIQUES FOR FORMING ORGANIC THIN FILMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260313B">C09D11/107</main-classification>
        <further-classification edition="201401120260313B">C09D11/03</further-classification>
        <further-classification edition="202501120260313B">H10H20/854</further-classification>
        <further-classification edition="202301120260313B">H10K50/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商凱特伊夫公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATEEVA, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅格吉那　伊雷娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROGOJINA, ELENA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉摩斯　泰瑞莎　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMOS, TERESA A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>優渥諾　斯特拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUWONO, CITRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>摩洛　羅紋娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORO, LORENZA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明教示係關於可固化墨水組成物之各種具體實例，該組成物在印刷及固化後即在諸如（但不限於）OLED裝置基板之基板上形成高玻璃轉移溫度聚合膜。該等可固化墨水組成物之各種具體實例包含二(甲基)丙烯酸酯單體，以及多官能交聯劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present teachings relate to various embodiments of a curable ink composition, which once printed and cured form high glass transition temperature polymeric films on a substrate such as, but not limited by, an OLED device substrate. Various embodiments of the curable ink compositions comprise di(meth)acrylate monomers, as well as multifunctional crosslinking agents.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:電子裝置</p>
        <p type="p">52:基板</p>
        <p type="p">54:作用區</p>
        <p type="p">56:電極部分</p>
        <p type="p">60A:無機障壁層</p>
        <p type="p">62A:聚合膜</p>
        <p type="p">60B:第二無機障壁層</p>
        <p type="p">62B:第二聚合膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1803" publication-number="202624213">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624213</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141172</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感放射線性組合物、硬化物、透鏡、平坦化膜、硬化物的製造方法及化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D235/28</main-classification>
        <further-classification edition="200601120260302B">C07D249/10</further-classification>
        <further-classification edition="200601120260302B">C07D257/04</further-classification>
        <further-classification edition="200601120260302B">C07D403/12</further-classification>
        <further-classification edition="200601120260302B">C08F2/44</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/027</further-classification>
        <further-classification edition="200601120260302B">G03F7/031</further-classification>
        <further-classification edition="200601120260302B">G03F7/038</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="200601120260302B">G03F7/40</further-classification>
        <further-classification edition="200601120260302B">G02B1/04</further-classification>
        <further-classification edition="200601120260302B">G02B3/00</further-classification>
        <further-classification edition="200601120260302B">G02F1/1333</further-classification>
        <further-classification edition="202501120260302B">H10F39/00</further-classification>
        <further-classification edition="202301120260302B">H10K59/12</further-classification>
        <further-classification edition="202301120260302B">H10K59/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木拓之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秋池利之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKIIKE, TOSHIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畑瀬一輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATASE, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木下芳徳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINOSHITA, YOSHINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種感放射線性組合物、硬化物、透鏡、平坦化膜、硬化物的製造方法及化合物，感放射線性組合物可獲得在能夠進行圖案化的同時，耐化學品性及耐高溫高濕性優異、而且折射率高的硬化物。設為一種感放射線性組合物，含有：芴化合物（A），具有作為選自由唑環結構及唑環與芳香環的縮合環結構所組成的群組中的至少一種的特定雜環結構；光聚合引發劑；以及化合物（C），具有聚合性碳-碳不飽和鍵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1804" publication-number="202625284">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625284</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141203</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池芯組件、以及包含電池芯組件的電池包及運輸裝置</chinese-title>
        <english-title>BATTERY CELL ASSEMBLY, AND BATTERY PACK AND MEANS OF TRANSPORTATION, COMPRISING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260309B">H01M50/289</main-classification>
        <further-classification edition="202101120260309B">H01M50/204</further-classification>
        <further-classification edition="202101120260309B">H01M50/514</further-classification>
        <further-classification edition="201001120260309B">H01M10/0525</further-classification>
        <further-classification edition="202601120260309B">H02J1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安泰善</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHN, TAE SUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹炯哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, HYOUNG CHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的電池芯組件包含容納多個第一電池芯的第一電池芯框架、容納多個第二電池芯並排列為層疊在第一電池芯框架的一側上的第二電池芯框架、以及設置在層疊的第一電池芯框架和第二電池芯框架之間的篩網片。第一電池芯框架和第二電池芯框架各自提供有第一耦合部件和第二耦合部件，其排列為在層疊時彼此耦合，並且篩網片形成有插入孔，排列為使得第一耦合部件和第二耦合部件中的至少一個插入其中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A battery cell assembly of the present invention comprises a first cell frame accommodating a plurality of first battery cells, a second cell frame accommodating a plurality of second battery cells and arranged to be laminated on one side of the first cell frame, and a screen sheet disposed between the first cell frame and the second cell frame as laminated. The first cell frame and the second cell frame are each provided with a first coupling part and a second coupling part, which are arranged to be coupled to each other upon lamination, and the screen sheet is formed with an insertion hole arranged so that at least one of the first coupling part and the second coupling part is inserted therein.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電池芯組件</p>
        <p type="p">120:第一電池芯框架</p>
        <p type="p">125、135:容納部分</p>
        <p type="p">126、136:蓋板</p>
        <p type="p">130:第二電池芯框架</p>
        <p type="p">140:篩網片</p>
        <p type="p">154:外部匯流排</p>
        <p type="p">X、Y、Z:軸方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1805" publication-number="202624777">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624777</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141219</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於保留記憶體設定及推導寄生損耗的設備、系統及方法</chinese-title>
        <english-title>APPARATUSES, SYSTEMS, AND METHODS FOR PRESERVING MEMORY SETTINGS AND DERIVING PARASITIC DRAW</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260305B">G01R31/36</main-classification>
        <further-classification edition="200601120260305B">G01R19/00</further-classification>
        <further-classification edition="200601120260305B">H02J9/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商寶紳電子集團公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWER PROBE GROUP, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴登　大衛　道格拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARDEN, DAVID DOUGLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史瓦基斯　丹尼　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SWERKES, DANNY J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於保留記憶體設定及推導車輛之電性系統之寄生損耗的設備、系統及方法包括電源，該電源在車輛電池斷開時向該電性系統供能。一或多個感測器檢測來自該電源之電流，並且分析器基於該檢測之電流來推導寄生損耗。該設備經由介面（諸如診斷埠連接器）連接至該車輛，並可包括用於輸出讀數之顯示器。此在沒有丟失記憶體設定的情況下實現了安全的電池斷開，並有助於進行準確的寄生損耗測量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Apparatuses, systems and methods for preserving memory settings and deriving parasitic draw of a vehicle’s electrical system include a power source that energizes the electrical system when the vehicle battery is disconnected. One or more sensors detect current flow from the power source, and an analyzer derives a parasitic draw based on the detected current flow. The apparatus connects to the vehicle via an interface, such as a diagnostic port connector, and may include a display for output readings. This enables safe battery disconnection without loss of memory settings and facilitates accurate parasitic draw measurement.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:車輛</p>
        <p type="p">102:前內部</p>
        <p type="p">104:車輛診斷埠</p>
        <p type="p">106:方向盤</p>
        <p type="p">150:設備</p>
        <p type="p">152:外殼</p>
        <p type="p">154:顯示器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1806" publication-number="202625305">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625305</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141226</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接器組件</chinese-title>
        <english-title>CONNECTOR ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120251127B">H01R12/72</main-classification>
        <further-classification edition="200601120251127B">H01R13/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本航空電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAPAN AVIATION ELECTRONICS INDUSTRY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋口徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIGUCHI, OSAMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能易於將連接器自基板裝卸的技術。本發明的連接器組件包括：框體，其可配置於包括複數個焊盤的基板；以及連接器，其以可裝卸的方式連接於前述框體。前述連接器包括：保持複數個接觸件的外殼、以及連接器接觸部。前述框體包括框體接觸部。當前述框體配置於基板、且前述連接器裝設於前述框體時，前述複數個接觸件被壓抵於複數個相對的焊盤，發生彈性變形，並與前述複數個相對的焊盤電性連接，並且，前述連接器接觸部接收來自前述複數個接觸件的反作用力並與前述框體接觸部接觸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A technique for easily attaching/detecting a connector to/from a substrate is provided. A connector assembly according to the present disclosure includes: a frame that can be disposed in a substrate including a plurality of pads; and a connector that is detachably connected to the frame. The connector includes a shell that holds a plurality of contacts, and a connector contacting part. The frame includes a frame contacting part. When the frame is disposed in the substrate and the connector is attached to the frame, the plurality of contacts are pushed against the plurality of respective pads, elastically deformed, and electrically connected to the plurality of respective pads, and the connector contacting part receives a reaction force from the plurality of contacts and contacts the frame contacting part.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:連接器</p>
        <p type="p">110:外殼</p>
        <p type="p">110A:嵌合開口</p>
        <p type="p">110C:基板側端部</p>
        <p type="p">110D:上表面</p>
        <p type="p">300:框體</p>
        <p type="p">302:刺片承接部</p>
        <p type="p">303:框體本體</p>
        <p type="p">303A:中央部</p>
        <p type="p">303B:側部</p>
        <p type="p">303C:側部</p>
        <p type="p">310:螺栓</p>
        <p type="p">500:連接器組件</p>
        <p type="p">700:基板</p>
        <p type="p">701:安裝面</p>
        <p type="p">704:端面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1807" publication-number="202623762">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623762</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141252</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於光聲體積描記法的非侵入式血壓估計和血管監測</chinese-title>
        <english-title>NON-INVASIVE BLOOD PRESSURE ESTIMATION AND BLOOD VESSEL MONITORING BASED ON PHOTOACOUSTIC PLETHYSMOGRAPHY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260315B">A61B5/021</main-classification>
        <further-classification edition="200601120260315B">A61B5/00</further-classification>
        <further-classification edition="200601120260315B">A61B5/0285</further-classification>
        <further-classification edition="200601120260315B">A61B5/07</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇辰司　傑克　康威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITCHENS, JACK CONWAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史科尼德　約翰　凱斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHNEIDER, JOHN KEITH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布雷洛夫　艾文　麥克爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRELOFF, EVAN MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布魯克斯　艾蜜莉　凱瑟琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROOKS, EMILY KATHRYN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哥傑維克　史蒂芬　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOJEVIC, STEPHEN MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>約翰　阿西巴爾德　菲茨杰拉德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOHN ARCHIBALD, FITZGERALD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯托亞諾夫　艾列克謝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STOIANOV, ALEXEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高爾　壽娜科　烏代</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GORE, SHOUNAK UDAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴肯　尼古拉　伊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUCHAN, NICHOLAS IAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一些所公開的方法涉及：經由控制系統來控制光源系統以脈衝重複頻率將多個光脈衝發射到生物組織中，生物組織包括該生物組織內各深度處的血液和血管。此類方法可涉及：由控制系統從壓電接收器接收與從生物組織的各部分發射的聲波相對應的信號，該聲波對應於由該多個光脈衝引起的來自血液和血管的光聲發射。此類方法可涉及：由控制系統檢測這些信號中的心率波形，由控制系統確定所檢測到的心率波形中對應於靜脈心率波形的第一子集，以及由控制系統確定所檢測到的心率波形中對應於動脈心率波形的第二子集。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Some disclosed methods involve controlling, via a control system, a light source system to emit a plurality of light pulses into biological tissue at a pulse repetition frequency, the biological tissue including blood and blood vessels at depths within the biological tissue. Such methods may involve receiving, by the control system, signals from the piezoelectric receiver corresponding to acoustic waves emitted from portions of the biological tissue, the acoustic waves corresponding to photoacoustic emissions from the blood and the blood vessels caused by the plurality of light pulses. Such methods may involve detecting, by the control system, heart rate waveforms in the signals, determining, by the control system, a first subset of detected heart rate waveforms corresponding to vein heart rate waveforms and determining, by the control system, a second subset of detected heart rate waveforms corresponding to artery heart rate waveforms.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:方法</p>
        <p type="p">305:方塊</p>
        <p type="p">310:方塊</p>
        <p type="p">315:方塊</p>
        <p type="p">320:方塊</p>
        <p type="p">325:方塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1808" publication-number="202623782">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623782</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141272</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>Ａ型肉毒桿菌毒素用於皺眉紋治療之新用途</chinese-title>
        <english-title>NOVEL USE OF CLOSTRIDIUM BOTULINUM TOXIN TYPE A FOR TREATMENT OF GLABELLAR LINES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K8/64</main-classification>
        <further-classification edition="200601120260302B">C07K14/33</further-classification>
        <further-classification edition="200601120260302B">A61Q19/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鼎晉生技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OBIGEN PHARMA, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹子文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAU, TZU-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐建志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OU, CHIEN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏均宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種A型肉毒桿菌神經毒素（OBI-858）於治療皺眉紋之新用途。劑量為10U、20U及30U的OBI-858經證實具有臨床上良好的安全性與療效表現。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a novel use of botulinum neurotoxin type A (OBI-858) for treatment of glabellar lines. It demonstrates that 10U, 20U and 30U of OBI-858 could have a clinically favorable profile of safety and efficacy.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1809" publication-number="202624362">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624362</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141343</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製備自由流動超吸收性顆粒之方法</chinese-title>
        <english-title>PROCESS FOR PRODUCING FREE-FLOWING SUPERABSORBENT PARTICLES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08J3/12</main-classification>
        <further-classification edition="200601120260302B">C08J3/24</further-classification>
        <further-classification edition="200601120260302B">C08J7/00</further-classification>
        <further-classification edition="200601120260302B">C08L101/14</further-classification>
        <further-classification edition="200601120260302B">B01J20/26</further-classification>
        <further-classification edition="200601120260302B">B01J20/28</further-classification>
        <further-classification edition="200601120260302B">B01J20/32</further-classification>
        <further-classification edition="200601120260302B">A61F13/53</further-classification>
        <further-classification edition="200601120260302B">A61L15/22</further-classification>
        <further-classification edition="200601120260302B">A61L15/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商巴地斯顏料化工廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASF SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓋格　托馬斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIEGER, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑曼　卡崔因</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAUMANN, KATRIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威斯曼特爾　瑪夏斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEISMANTEL, MATTHIAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李允中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於塗覆經表面後交聯之超吸收性顆粒之方法，其中該等超吸收性顆粒至少塗覆有水及至少一種平均莫耳質量為400 g/mol至8000 g/mol之聚乙二醇。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a process for coating surface postcrosslinked superabsorbent particles, wherein the superabsorbent particles are coated at least with water and at least one polyethylene glycol having an average molar mass of 400 to 8000 g/mol.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1810" publication-number="202624390">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624390</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141344</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含聚丙烯的阻燃物品</chinese-title>
        <english-title>FLAME RETARDANT ARTICLES COMPRISING POLYPROPYLENE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">C08L23/14</main-classification>
        <further-classification edition="200601120260303B">C08G18/70</further-classification>
        <further-classification edition="200601120260303B">C09K21/04</further-classification>
        <further-classification edition="200601120260303B">C08K5/18</further-classification>
        <further-classification edition="200601120260303B">C07F9/141</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商巴地斯顏料化工廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASF SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅諾茲　艾杜爾多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENOZZI, EDOARDO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑斯特　米榭爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GERSTER, MICHELE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>里普斯　傑瑞德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIPS, GERARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慕勒　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUELLER, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫德利希　威珀特　維布克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WUNDERLICH-WIPPERT, WIEBKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李允中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於包含阻燃聚丙烯聚合物組合物之物品，該物品係膜或纖維或膠帶，該組合物包含以下組分：(i)聚丙烯聚合物基材；及(ii)式(I)之硫基化合物；及(iii)至少一種空間受阻胺醚及/或(iv)至少一種選自次膦酸鹽、膦酸鹽、磷酸鹽及鹼金屬次磷酸鹽中之至少一者之磷化合物之一者或二者，  &lt;br/&gt;&lt;img align="absmiddle" height="109px" width="419px" file="ed10061.JPG" alt="ed10061.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;其中  &lt;br/&gt;A係基於有機異氰酸酯或(甲基)丙烯酸酯，其中基團-S–R係藉由與異氰酸酯基團或(甲基)丙烯酸酯基團反應引入，  &lt;br/&gt;R係視情況經取代及/或經間雜之C&lt;sub&gt;2&lt;/sub&gt;-C&lt;sub&gt;40&lt;/sub&gt;烷基，且  &lt;br/&gt;n等於或大於1。本發明亦包括製備該物品之方法。  &lt;br/&gt;亦主張(ii)式(I)之硫基化合物與(iii)至少一種空間受阻胺醚及/或(iv)至少一種磷化合物之一者或二者聯合之用途，該磷化合物係次膦酸鹽、膦酸鹽、磷酸鹽或鹼金屬次磷酸鹽中之至少一者。本發明進一步包括包含該三種組分之添加劑混合物且亦包括包含該添加劑混合物及聚丙烯聚合物基材(i)之組合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention concerns an article, the article being a film or a fibre or a tape, comprising a flame-retardant polypropylene polymer composition which comprises the components: (i) a polypropylene polymer substrate; and (ii) a thio- compound of formula (I); and either or both of (iii) at least one sterically hindered amine ether; and/or (iv) at least one phosphorus compound selected from at least one of phosphinate, phosphonate, phosphate and alkali metal hypophosphite, &lt;br/&gt;&lt;img align="absmiddle" height="95px" width="394px" file="ed10062.JPG" alt="ed10062.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;wherein &lt;br/&gt;A is based on an organic isocyanate or a (meth)acrylate, wherein the radical(s) -S–R are introduced by reaction with isocyanate groups or (meth)acrylate groups, &lt;br/&gt;R is C&lt;sub&gt;2&lt;/sub&gt;-C&lt;sub&gt;40&lt;/sub&gt; alkyl which is optionally substituted and/or interrupted, and &lt;br/&gt;n is equal to or greater than 1. The invention also includes a method for preparing the article. &lt;br/&gt;Also claimed is use of (ii) a thio compound of formula (I) in conjunction with either or both of (iii) at least one sterically hindered amine ether and/or (iv) at least one phosphorus compound, the phosphorus compound being at least one of phosphinate, phosphonate, phosphate or alkali metal hypophosphite. The invention further includes an additive mixture comprising these three components and also a composition comprising the additive mixture and a polypropylene polymer substrate (i).</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1811" publication-number="202624170">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624170</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141354</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>粉末成型體、燒結體及燒結體的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">C04B35/622</main-classification>
        <further-classification edition="200601120260311B">C01G25/02</further-classification>
        <further-classification edition="200601120260311B">C03C3/04</further-classification>
        <further-classification edition="200601120260311B">C04B35/64</further-classification>
        <further-classification edition="201701120260311B">A61C5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＧＣ　Ｒ&amp;Ｄ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GC R&amp;D CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>保木井悠介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOKII, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部喜史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, YOSHIFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小野寺瑞穂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONODERA, MIZUHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秋山茂範</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKIYAMA, SHIGENORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">粉末成型體是成型有粉末組合物的粉末成型體，該粉末組合物包含二氧化鋯粉末和玻璃粉末。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1812" publication-number="202624969">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624969</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141422</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於硬體加速器之命令訊息</chinese-title>
        <english-title>COMMAND MESSAGES FOR HARDWARE ACCELERATORS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">G06F13/10</main-classification>
        <further-classification edition="200601120260309B">G06F9/48</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商ＡＲＭ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARM LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>休格森　斯文奧拉約翰尼斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUGOSSON, SVEN OLA JOHANNES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅絲瑪琳　艾略特莫里斯西蒙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROSEMARINE, ELLIOT MAURICE SIMON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查爾芬　亞歷山大尤金</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHALFIN, ALEXANDER EUGENE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種設備，其包含處理電路系統，該處理電路系統經組態以產生用於組態一硬體加速器以執行一任務的一指令。該指令包含一組預定義欄位，該組預定義欄位包含一控制欄位，該控制欄位指示待提供給該硬體加速器的該組預定義欄位中的一組經選擇欄位，用以組態該硬體加速器以執行該任務。該設備包含加速器控制介面電路系統，其經組態以與該硬體加速器交換訊息，該等訊息各自具有小於或等於一預定義大小之一大小。為了組態該硬體加速器以執行該任務，該加速器控制介面電路系統經組態以使用具有大於該預定義大小之一組合大小之一組命令訊息將該組經選擇欄位發送至該硬體加速器。本申請案進一步係關於一種硬體加速器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus comprising processing circuitry configured to generate an instruction for configuring a hardware accelerator to perform a task. The instruction comprises a predefined set of fields comprising a control field indicative of a selected set of fields of the predefined set of fields to be provided to the hardware accelerator to configure the hardware accelerator to perform the task. The apparatus comprises accelerator control interface circuitry configured to exchange messages, each with a size less than or equal to a predefined size, with the hardware accelerator. To configure the hardware accelerator to perform the task, the accelerator control interface circuitry is configured to send the selected set of fields to the hardware accelerator, using a set of command messages with a combined size greater than the predefined size. The application further relates to a hardware accelerator.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102:方塊</p>
        <p type="p">104:方塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1813" publication-number="202624373">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624373</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141424</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於Si/C陽極之交聯聚丙烯酸組成物</chinese-title>
        <english-title>CROSSLINKED POLYACRYLIC ACID COMPOSITIONS FOR SI/C ANODES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260313B">C08K3/011</main-classification>
        <further-classification edition="200601120260313B">C08G18/02</further-classification>
        <further-classification edition="200601120260313B">C08L33/08</further-classification>
        <further-classification edition="200601120260313B">H01M4/66</further-classification>
        <further-classification edition="201001120260313B">H01M4/1395</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商陶氏全球科技有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOW GLOBAL TECHNOLOGIES LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳雪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, XUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉果</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JI, GUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張朝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何美佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, MEIJIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱夢瑤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, MENGYAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高悅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, YUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種組成物，其包含以下組份a)及b)：  &lt;br/&gt;a)    至少一種聚丙烯酸聚合物(PAA)，及  &lt;br/&gt;b)    至少一種具有以下結構B之化合物：  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="180px" width="357px" file="ed10017.JPG" alt="ed10017.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，  &lt;br/&gt;&lt;br/&gt;其中R1、R2、R3、R4、R5、R6、R7及R8中之各者獨立地係H、或烷基；且n1及n2各自獨立地係≥ 1之整數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A composition comprising the following components a) and b): &lt;br/&gt;a) at least one polyacrylic acid polymer (PAA), and &lt;br/&gt;b) at least one compound of Structure B below: &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="167px" width="354px" file="ed10018.JPG" alt="ed10018.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, &lt;br/&gt;&lt;br/&gt;wherein each of R1, R2, R3, R4, R5, R6, R7 and R8 is independently H, or an alkyl; and n1 and n2 are each independently an integer ≥ 1.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1814" publication-number="202625721">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625721</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141450</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於相對於載體暫時接合及脫離電子器件結構之方法及設備</chinese-title>
        <english-title>METHOD AND APPARATUS FOR TEMPORARILY BONDING AND DEBONDING ELECTRONICS STRUCTURES RELATIVE TO CARRIER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260309B">H10P54/94</main-classification>
        <further-classification edition="201801120260309B">C09J7/29</further-classification>
        <further-classification edition="200601120260309B">C09J9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商脈衝鍛造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PULSEFORGE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>圖爾卡尼　維克拉姆　Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TURKANI, VIKRAM S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿塔爾　瓦希德　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ATTAR, VAHID AKHAVAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施洛德　寇特　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHRODER, KURT A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於暫時承載一電子器件結構以供處理之暫時堆疊包括一可重複使用之載體結構及承載於該載體結構上之一電子器件結構。一接合層將該電子器件結構暫時接合至該載體結構。該載體結構包括經組態以產生用於弱化該接合層之脫離熱的一熱產生層。該接合層包含至少一種黏著材料。一種脫離該暫時堆疊之方法包括使該堆疊與一脫離能量源操作性嚙合以產生脫離熱。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A temporary stack for temporarily carrying an electronics structure for processing includes a reusable carrier structure and an electronics structure carried on the carrier structure. A bonding layer temporarily bonds the electronics structure to the carrier structure. The carrier structure includes a heat-generating layer configured to generate debonding heat for weakening the bonding layer. The bonding layer comprises at least one adhesive material. A method of debonding the temporary stack includes placing the stack in operative engagement with a source of debonding energy to generate debonding heat.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:堆疊</p>
        <p type="p">110:載體結構，對應結構，LAL載體結構</p>
        <p type="p">112:載體本體</p>
        <p type="p">114:LAL</p>
        <p type="p">116:接合表面</p>
        <p type="p">120:接合層</p>
        <p type="p">130:電子器件結構，對應結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1815" publication-number="202625438">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625438</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141463</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>Ｖ－ＤＭＣ變換相關寫碼</chinese-title>
        <english-title>V-DMC TRANSFORM RELATED CODING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260305B">H04N19/176</main-classification>
        <further-classification edition="201401120260305B">H04N19/597</further-classification>
        <further-classification edition="201401120260305B">H04N19/70</further-classification>
        <further-classification edition="200601120260305B">G06T9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汎　德　奧維拉　葛特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN DER AUWERA, GEERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡達　雷圖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOODA, REETU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿克塔　安尼克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKHTAR, ANIQUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞瑪蘇布雷蒙尼安　阿達許　克里許納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMASUBRAMONIAN, ADARSH KRISHNAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡茲維克茲　馬塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARCZEWICZ, MARTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種解碼網格補塊資料之方法，其包括：判定一第一網格的一第一網格補塊經寫碼為一網格間補塊；判定指示一變換的資訊未經傳訊，該變換應用於與該第一網格補塊相關聯的一第一位移；回應於指示該變換的該資訊未經傳訊，而基於包括在一圖集框參數集(AFPS)中的變換資訊來判定應用於與該第一網格補塊相關聯的該第一位移的該變換；及基於該變換解碼該第一網格補塊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of decoding meshpatch data includes determining that a first meshpatch of a first mesh is coded as an inter-meshpatch, determining that information indicative of a transform, applied to a first displacement associated with the first meshpatch, is not signaled, in response to the information indicative of the transform not being signaled, determining the transform, applied to the first displacement associated with the first meshpatch, based on transform information included in an atlas frame parameter set (AFPS), and decoding the first meshpatch based on the transform. &lt;br/&gt;&lt;b&gt;  &lt;/b&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000,1002,1004,1006:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1816" publication-number="202625440">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625440</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141464</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多層設定檔之子區塊時間運動向量預測</chinese-title>
        <english-title>SUBBLOCK TEMPORAL MOTION VECTOR PREDICTION FOR MULTILAYER PROFILE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260305B">H04N19/513</main-classification>
        <further-classification edition="201401120260305B">H04N19/50</further-classification>
        <further-classification edition="201401120260305B">H04N19/176</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張亨文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, HYEONGMUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金大淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DAE YEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塞瑞金　法迪姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEREGIN, VADIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種實例設備包括一或多個處理器，該一或多個處理器經組態以判定一目前圖像之一目前區塊的一空間鄰近候選之一參考圖像之一層識別符(identifier, ID)與該目前圖像之一共置圖像之一層ID相同。該共置圖像包含一共置區塊。該一或多個處理器經組態以判定在該空間鄰近候選之該參考圖像與該目前圖像之間的一圖像順序計數(picture order count, POC)差與在該共置圖像與該目前圖像之間的一POC差相同。該一或多個處理器經組態以基於該等層ID相同且該等POC差相同，而使用基於子區塊之時間運動向量預測來使用該共置區塊之一共置運動向量解碼該目前區塊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An example device includes one or more processors configured to determine that a layer identifier (ID) of a reference picture of a spatial neighbor candidate for a current block of a current picture is identical to a layer ID of a collocated picture of the current picture. The collocated picture includes a collocated block. The one or more processors are configured to determine that a picture order count (POC) difference between the reference picture of the spatial neighbor candidate and the current picture is identical to a POC difference between the collocated picture and the current picture. The one or more processors are configured to, based on the layer IDs being identical and the POC differences being identical, decode the current block using subblock-based temporal motion vector prediction using a collocated motion vector of the collocated block.</p>
      </isu-abst>
      <representative-img>
        <p type="p">350:目前CU(curCU)</p>
        <p type="p">351:空間鄰近者A1</p>
        <p type="p">352:TEMPMV</p>
        <p type="p">354:Mv-A1</p>
        <p type="p">356:Mv-expect</p>
        <p type="p">358:MV-COL</p>
        <p type="p">360:共置圖像</p>
        <p type="p">362:參考圖像</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1817" publication-number="202623783">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623783</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141550</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於促進神經醯胺產生或水通道蛋白3產生的組合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">A61K8/68</main-classification>
        <further-classification edition="200601120260309B">A61K8/64</further-classification>
        <further-classification edition="200601120260309B">A61Q19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商伊勢半股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISEHAN COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橫田壯真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOKOTA, SOMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種組合物，用於促進神經醯胺產生或水通道蛋白3產生的，上述組合物含有由紅花萃取色素後的殘渣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1818" publication-number="202624330">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624330</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141588</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>密封膜及電子零件裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08G59/62</main-classification>
        <further-classification edition="200601120260302B">C08L9/00</further-classification>
        <further-classification edition="200601120260302B">C08L63/00</further-classification>
        <further-classification edition="200601120260302B">C08L83/00</further-classification>
        <further-classification edition="200601120260302B">C08K3/36</further-classification>
        <further-classification edition="200601120260302B">C08K5/09</further-classification>
        <further-classification edition="200601120260302B">C08K9/06</further-classification>
        <further-classification edition="202601120260302B">H10W74/01</further-classification>
        <further-classification edition="202601120260302B">H10W74/10</further-classification>
        <further-classification edition="202601120260302B">H10W74/47</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蛯名直輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EBINA, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木雅彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, MASAHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土川佳之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUCHIKAWA, YOSHIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種密封膜，其含有熱固化性樹脂、固化劑、無機填充劑及具有酚性羥基及羧基之化合物。密封膜可以進一步含有彈性體。彈性體可以為選自由丁二烯系橡膠及矽酮系橡膠組成的組中之至少1種。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:支撐體</p>
        <p type="p">2:密封膜</p>
        <p type="p">2S:密封面</p>
        <p type="p">10:帶支撐體之密封膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1819" publication-number="202624181">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624181</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141589</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>作為光阻應用中的光酸產生劑之環狀磺酸鹽化合物</chinese-title>
        <english-title>CYCLIC SULFONATE COMPOUNDS AS PHOTOACID GENERATORS IN RESIST APPLICATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07C25/18</main-classification>
        <further-classification edition="200601120260302B">C07C309/10</further-classification>
        <further-classification edition="200601120260302B">C07C381/12</further-classification>
        <further-classification edition="200601120260302B">C09K3/00</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="202601120260302B">H10P76/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商賀利氏電子化學材料有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HERAEUS EPURIO LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩卡武伊　卡烏姆巴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAVUYI, KAUMBA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佩魯馬爾　卡爾蒂克揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PERUMAL, KARTHIKEYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供新穎光酸產生劑化合物。亦提供包括該新穎光酸產生劑化合物之組成物。本揭露進一步提供製備及使用本文所揭示之光酸產生劑化合物及組成物之方法。該等化合物及組成物可用作化學放大型光阻組成物中的光活性組分，供各種微製造應用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Novel photoacid generator compounds are provided. Compositions that include the novel photoacid generator compounds are also provided. The present disclosure further provides methods of making and using the photoacid generator compounds and compositions disclosed herein. The compounds and compositions are useful as photoactive components in chemically amplified resist compositions for various microfabrication applications.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1820" publication-number="202625377">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625377</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141632</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用可組態置換多工器之測溫DAC編碼錯誤之非線性校正</chinese-title>
        <english-title>NON-LINEARITY CORRECTION OF THERMOMETRIC DAC CODING ERRORS WITH CONFIGURABLE PERMUTATION MULTIPLEXERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">H03M1/06</main-classification>
        <further-classification edition="200601120260305B">H03M1/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商瑞泰姆公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RETYM, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米勒　亞維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MILLER, AVI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿迪　奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADIV, OR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種用於將一輸入測溫數位信號轉換為一類比輸出信號之數位轉類比轉換器(DAC-100)，其包含至少兩個可組態置換多工器(CPMUX-104)、一組單元DAC (106)及一求和器電路(108)。各CPMUX經組態以根據一CPMUX組態將該輸入測溫數位信號之位元之一各自部分子集映射至一經置換測溫數位信號之位元之一各自部分子集中。各單元DAC經組態以將該經置換測溫數位信號之一各自位元轉換為一類比信號。該求和器電路經組態以根據由該等單元DAC產生之該等類比信號之一和來產生該類比輸出信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A Digital-to-Analog Converter (DAC - 100), for converting an input thermometric digital signal to an analog output signal, includes at least two configurable permutation multiplexers (CPMUXes - 104), a bank of unit-DACs (106), and a summer circuit (108). Each CPMUX is configured to map a respective partial subset of bits of the input thermometric digital signal into a respective partial subset of bits of a permuted thermometric digital signal, according to a CPMUX configuration. Each unit-DAC is configured to convert a respective bit of the permuted thermometric digital signal into an analog signal. The summer circuit is configured to generate the analog output signal according to a sum of the analog signals produced by the unit-DACs.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:數位轉類比轉換器(DAC)</p>
        <p type="p">102:2位元二進位轉測溫代碼轉換電路</p>
        <p type="p">104:可組態置換多工器(CPMUX)</p>
        <p type="p">106:單元DAC</p>
        <p type="p">108:求和器電路/求和緩衝器</p>
        <p type="p">110:非揮發性記憶體(NVM)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1821" publication-number="202625177">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625177</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141634</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具備選擇性負位元線升壓的記憶體</chinese-title>
        <english-title>MEMORY WITH SELECTIVE NEGATIVE BIT LINE BOOST</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">G11C7/18</main-classification>
        <further-classification edition="200601120260309B">G11C7/06</further-classification>
        <further-classification edition="200601120260309B">G11C7/14</further-classification>
        <further-classification edition="200601120260309B">G11C7/22</further-classification>
        <further-classification edition="200601120260309B">G11C11/40</further-classification>
        <further-classification edition="200601120260309B">G11C16/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　基正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KEEJONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科塔　安尼爾喬杜里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOTA, ANIL CHOWDARY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　正丕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JUNG PILL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭　哲民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, CHULMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種記憶體，其包括用於在一寫入操作期間感測一位元的一感測放大器。該記憶體進一步包括一選擇性負位元線升壓啟用電路，該選擇性負位元線升壓啟用電路在一寫入操作期間使用該感測放大器將一經充電位元線與一參考電壓進行比較。取決於該比較，該感測放大器確立或解除確立一負位元線升壓啟用信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory is provided that is includes a sense amplifier for sensing a bit during a write operation. The memory further includes a selective negative bit line boost enable circuit that uses the sense amplifier during a write operation to compare a charged bit line to a reference voltage. Depending upon the comparison, the sense amplifier either asserts or de-asserts a negative bit line boost enable signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">330:負位元線升壓電路</p>
        <p type="p">335:負位元線升壓節點</p>
        <p type="p">800:選擇性負位元線升壓啟用電路</p>
        <p type="p">805:記憶體控制器</p>
        <p type="p">810:電荷轉移感測放大器；感測放大器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1822" publication-number="202624381">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624381</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141652</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>過敏原降低劑、過敏原降低纖維之製造方法、及過敏原降低方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260312B">C08L23/0869</main-classification>
        <further-classification edition="200601120260312B">C01G33/00</further-classification>
        <further-classification edition="200601120260312B">C08K7/02</further-classification>
        <further-classification edition="200601120260312B">C08K3/22</further-classification>
        <further-classification edition="200601120260312B">B32B27/18</further-classification>
        <further-classification edition="200601120260312B">B32B27/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商積水化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>定浪裕大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SADANAMI, YUDAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川村大地</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAMURA, DAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西原和也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIHARA, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木下拓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINOSHITA, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種發揮優異之過敏原降低效果之過敏原降低劑。本發明之過敏原降低劑之特徵在於含有氧化鈮及氫氧化鈮中之至少一種鈮化合物，因此藉由氧化鈮及氫氧化鈮中之至少一種鈮化合物之作用，發揮優異之過敏原降低效果，尤其是過敏原降低效果之耐水性優異。進而，本發明之過敏原降低劑無需光照射便發揮優異之過敏原降低效果，即便於暗處亦發揮優異之過敏原降低效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1823" publication-number="202624016">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624016</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141831</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>粒子組合物以及製備和使用粒子組合物之方法</chinese-title>
        <english-title>PARTICLE COMPOSITIONS AND METHODS OF PREPARING AND USING PARTICLE COMPOSITIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201501120260304B">B33Y10/00</main-classification>
        <further-classification edition="202201120260304B">B22F1/05</further-classification>
        <further-classification edition="202201120260304B">B22F1/10</further-classification>
        <further-classification edition="200601120260304B">B22F9/04</further-classification>
        <further-classification edition="202101120260304B">B22F10/20</further-classification>
        <further-classification edition="200601120260304B">C09J139/06</further-classification>
        <further-classification edition="200601120260304B">C09J171/02</further-classification>
        <further-classification edition="202201120260304B">C09K23/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENTEGRIS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡科技研究局</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古達蒂　蘇巴斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUDDATI, SUBHASH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪昂　得文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DION, DEVON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　蘇霞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, SU XIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖　彥翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIEW, YAN HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳　宇軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOO, YU XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述鎳粒子組合物，其等含有具有一分支狀不規則形態之鎳粒子、分散劑及黏結劑，且其等可用作積層製造方法中之一原料組合物；用於製備該等粒子組合物之方法；及使用該等粒子組合物作為原料以藉由一積層製造方法形成一多孔成形金屬本體之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described are nickel particle compositions that contain nickel particles that have a branch-like irregular morphogy, dispersant, and binder, and that are useful as a feedstock composition in additive manufacturing methods; methods for preparing the particle compositions; and methods of using the particle compositions as feedstock to form a porous shaped metal body by an additive manufacturing method.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1824" publication-number="202624129">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624129</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141852</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有經改善之流變的經處理之無機粒子及製備程序</chinese-title>
        <english-title>TREATED INORGANIC PARTICLES AND PROCESS OF MAKING WITH IMPROVED RHEOLOGY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">C01G23/047</main-classification>
        <further-classification edition="200601120260312B">C09C3/06</further-classification>
        <further-classification edition="202201120260312B">C01F7/021</further-classification>
        <further-classification edition="200601120260312B">C01B25/26</further-classification>
        <further-classification edition="202401120260312B">B01J35/51</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科慕ＦＣ有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE CHEMOURS COMPANY FC, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼登祖　菲利普　馬丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIEDENZU, PHILIPP MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗賴克斯　斯科特　里克貝爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRERICHS, SCOTT RICKBEIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉特利奇　瑞安　德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUTLEDGE, RYAN DREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克魯茲　阿爾弗雷多　克萊門特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CRUZ, ALFREDO CLEMENTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MX</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥科米甚　布萊恩　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCCOMISH, BRYAN E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>密西克　查爾斯　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUSICK, CHARLES DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳傳岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種具有約6.5至8.0的IEP的經處理之無機氧化物粒子，其具有無機氧化物粒子及混合表面處理物。該等粒子係藉由以下來製備：a.提供具有無機氧化物以及氧化鋁及/或二氧化矽的無機氧化物粒子；b.使該等無機氧化物粒子與檸檬酸在約5.0至約8.0的pH下接觸；c.使經檸檬酸處理之無機氧化物粒子與鹼性鋁化合物及選自硫酸、硫酸鹽、磷酸、或磷酸鹽的化合物在約6.5至約8.0的pH下接觸；d.將該pH維持一時間段；及e.用水洗滌經氧化鋁處理之無機氧化物粒子，以形成經處理之無機氧化物粒子，其中該混合表面處理物在同一處理層中具有約0.20重量%至5.00重量%的氧化鋁(Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;)、約0.03重量%至0.83重量%的檸檬酸、及約0.02重量%至0.50重量%的SO&lt;sub&gt;4&lt;/sub&gt;&lt;sup&gt;2-&lt;/sup&gt;或PO&lt;sub&gt;4&lt;/sub&gt;&lt;sup&gt;3-&lt;/sup&gt;。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a treated inorganic oxide particle having an IEP of about 6.5-8.0 having an inorganic oxide particle and a mixed surface treatment. The particles are made by a. providing inorganic oxide particles having inorganic oxide and alumina and/or silica; b. contacting the inorganic oxide particles with citric acid at a pH of about 5.0 to about 8.0; c. contacting the citric acid-treated inorganic oxide particles with an alkaline aluminum compound and compound selected from sulfuric acid, sulfate salt, phosphoric acid, or phosphate salt at a pH of about 6.5 to about 8.0; d. maintaining the pH for a period of time; and e. washing the alumina-treated inorganic oxide particles with water to form treated inorganic oxide particles, where the mixed surface treatment has about 0.20-5.00% by weight alumina (Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;), about 0.03-0.83% by weight citric acid, and about 0.02-0.50% by weight SO&lt;sub&gt;4&lt;/sub&gt;&lt;sup&gt;2-&lt;/sup&gt; or PO&lt;sub&gt;4&lt;/sub&gt;&lt;sup&gt;3-&lt;/sup&gt; in the same treatment layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1825" publication-number="202624238">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624238</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141866</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於不純物移除之交換樹脂</chinese-title>
        <english-title>EXCHANGE RESINS FOR IMPURITY REMOVAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07F7/10</main-classification>
        <further-classification edition="201701120260302B">B01J41/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENTEGRIS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布朗　克里斯多福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROWN, CHRISTOPHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩米恩托　阿爾拉諾　珍妮絲　塞西莉亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SARMIENTO ARELLANO, JANETH CECILIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CO</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷札伊　賽比德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REZAEI, SEPIDEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於不純物移除之組合物及方法。一種方法包括獲得包括胺基矽烷化合物及鹵化物不純物之一第一溶液。該方法包括使該第一溶液與一陰離子交換樹脂接觸以獲得一第二溶液。該第二溶液包括比該第一溶液更少之該鹵化物不純物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Compositions and methods for impurity removal are provided. A method comprises obtaining a first solution comprising an amino silane compound and a halide impurity. The method comprises contacting the first solution with an anion exchange resin to obtain a second solution. The second solution comprises less of the halide impurity than the first solution.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102:步骤</p>
        <p type="p">104:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1826" publication-number="202624871">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624871</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141903</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>照明裝置及觀測系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120251201B">G03B15/07</main-classification>
        <further-classification edition="202101120251201B">G03B15/05</further-classification>
        <further-classification edition="200601120251201B">G01N21/88</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商新光琅股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SYNQROA CO.,LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小山光広</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOYAMA, MITSUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>綾部華織</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AYABE, KAORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種照明裝置，包括：主體部，具有與觀測對象物相向的凹面形狀的反射鏡；以及光源部，朝向反射鏡照射光，在反射鏡形成有用於自觀測位置在第一方向上對觀測對象物進行觀測的第二觀測孔，反射鏡的凹面形狀為具有曲面的形狀，所述曲面使藉由反射鏡反射自光源部照射的光而得的反射光中的、與第一方向平行的平行光成分較向與第一方向不同的多個方向反射的擴散光成分多。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:照明裝置</p>
        <p type="p">11:主體部</p>
        <p type="p">12:反射鏡</p>
        <p type="p">13:第一觀測孔</p>
        <p type="p">14:第二觀測孔</p>
        <p type="p">15:光源部</p>
        <p type="p">A-A':剖面線</p>
        <p type="p">B-B':剖面線</p>
        <p type="p">X、Y、Z:軸/方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1827" publication-number="202625597">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625597</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141973</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電晶體及包含其之顯示裝置</chinese-title>
        <english-title>TRANSISTOR AND DISPLAY DEVICE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120251204B">H10D62/10</main-classification>
        <further-classification edition="202501120251204B">H10D62/60</further-classification>
        <further-classification edition="202501120251204B">H10D62/80</further-classification>
        <further-classification edition="202501120251204B">H10D64/20</further-classification>
        <further-classification edition="202301120251204B">H10K59/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭宇晳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, WOO SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李政燁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JEONG YEOP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐廷錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, JUNGSEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>玉敬喆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OK, KYUNGCHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金種昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JONG HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於顯示裝置之電晶體，可包含第一閘極電極、與第一閘極電極重疊之第一主動層、及與第一主動層接觸之第一源極電極與第一汲極電極。第一主動層包含與第一閘極電極重疊之第一通道部分、設置於第一通道部分兩側且摻雜有第一摻雜物並接觸第一源極電極與第一汲極電極之第一導電部分、及設置於第一導電部分與第一通道部分間且摻雜有第一摻雜物與不同於第一摻雜物之第二摻雜物之雙重摻雜部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A transistor for a display device can include a first gate electrode, a first active layer overlapping with the first gate electrode, and a first source electrode and a first drain electrode contacting the first active layer. Also, the first active layer includes a first channel portion overlapping with the first gate electrode, a first conductive portion positioned at opposite sides of the first channel portion, the first conductive portion being doped with a first dopant and contacting the first source electrode and the first drain electrode, and a dual doping portion positioned between the first conductive portion and the first channel portion, the dual doping portion being doped with the first dopant and a second dopant different from the first dopant.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:顯示面板</p>
        <p type="p">AA:主動區域</p>
        <p type="p">NA:非主動區域</p>
        <p type="p">SP:子像素</p>
        <p type="p">DL:資料線</p>
        <p type="p">GL:閘極線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1828" publication-number="202624805">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624805</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141978</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於光子積體電路中混合鍵合之裝置及方法</chinese-title>
        <english-title>DEVICE AND METHOD FOR HYBRID BONDING IN PHOTONIC INTEGRATED CIRCUITS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">G02B6/12</main-classification>
        <further-classification edition="200601120260309B">G02B6/13</further-classification>
        <further-classification edition="200601120260309B">G02B5/08</further-classification>
        <further-classification edition="202501120260309B">H10D84/00</further-classification>
        <further-classification edition="202601120260309B">H10P10/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商覓可思科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIXX TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙維茲　瑞貝卡　凱拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHAEVITZ, REBECCA KAYLA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉古拉曼　維維克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAGHURAMAN, VIVEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肖啟俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIAO, QIJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於光子積體電路之裝置及方法。一種裝置可包含：一矽晶圓基板，其具有一或多個成角度刻面；一塗層，其施加至該成角度刻面；及氧化物層，其用於形成一平坦表面以實現混合及/或熔融鍵合。一種方法可包含：蝕刻一第一矽晶圓以產生一或多個傾斜側壁，該一或多個傾斜側壁之一角度由該矽晶圓之一晶向及/或諸如灰階或奈米壓印微影之先進微影程序判定；在該一或多個傾斜側壁之至少一個傾斜側壁上沈積一塗層以產生用於操縱光子結構內之光之一表面；及實現允許透過混合及/或熔融鍵合來與一光子積體電路(PIC)整合之一最終表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Devices and methods for photonic integrated circuits are provided. A device may include a silicon wafer substrate having one or more angled facet(s); a coating applied to the angled facet; and an oxide layer to form a planar surface to enable hybrid and/or fusion bonding. A method may include: etching a first silicon wafer to create one or more sloped sidewalls, an angle of the one or more sloped sidewalls being determined by a crystallographic orientation of the silicon wafer and/or advanced lithography processes such as greyscale or nano-imprint lithography; depositing a coating on at least one sloped sidewall of the one or more sloped sidewalls to create a surface for manipulating the light within the photonic structure; and enabling a final surface that allows for integration with a photonic integrated circuit (PIC) through hybrid and/or fusion bonding.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400h:結構</p>
        <p type="p">406:額外氧化物層</p>
        <p type="p">410:成角度刻面</p>
        <p type="p">412:高反射率(HR)塗層</p>
        <p type="p">414:處置晶圓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1829" publication-number="202624154">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624154</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141981</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於控制玻璃生產之方法、系統及電腦程式產品</chinese-title>
        <english-title>METHOD, SYSTEM, AND COMPUTER PROGRAM PRODUCT FOR CONTROLLING GLASS PRODUCTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C03B18/06</main-classification>
        <further-classification edition="200601120260302B">G01B11/24</further-classification>
        <further-classification edition="201701120260302B">G06T7/13</further-classification>
        <further-classification edition="200601120260302B">G05B13/02</further-classification>
        <further-classification edition="200601120260302B">G05B23/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商維托平面玻璃有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VITRO FLAT GLASS LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐煒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜姆　艾倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUM, ALAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施里爾　羅素　Ｗ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHRIER, RUSSELL W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威爾森　卡爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WILSON, CARL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於控制玻璃生產之方法，其包括：將一玻璃熔體澆注至一玻璃生產浴槽上以形成一玻璃帶；利用一邊緣輥拉伸該玻璃生產浴槽上之該玻璃帶，該邊緣輥接近於該玻璃帶之一邊緣且與該玻璃帶之一空氣側表面接觸，該邊緣輥經組態以控制該玻璃帶之一寬度；自一攝影機接收視覺資料，該攝影機經定位成具有該玻璃帶之一視圖；處理該視覺資料以判定在接近該邊緣輥之一區中與該玻璃帶相關聯之一維度的一值；判定在接近該邊緣輥之該區中與該玻璃帶相關聯之該維度的該值及/或該值之一振盪頻率未能滿足一臨界值；以及產生與該邊緣輥相關聯之一警示。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for controlling glass production includes: pouring a glass melt onto a glass production bath to form a glass ribbon; stretching the glass ribbon on the glass production bath with an edge roll proximate to an edge of the glass ribbon and in contact with an air side surface of the glass ribbon, the edge roll configured to control a width of the glass ribbon; receiving visual data from a camera positioned with a view of the glass ribbon; processing the visual data to determine a value of a dimension associated with the glass ribbon in a region proximate the edge roll; determining that the value of the dimension associated with the glass ribbon and/or an oscillational frequency of the value in the region proximate the edge roll fails to satisfy a threshold value; and generating an alert associated with the edge roll.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">102:控制系統</p>
        <p type="p">104:爐閘門</p>
        <p type="p">106:攝影機</p>
        <p type="p">108:通訊網路</p>
        <p type="p">110:運算裝置</p>
        <p type="p">112:邊緣輥</p>
        <p type="p">114:加熱元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1830" publication-number="202625315">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625315</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142025</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>連接器組件</chinese-title>
        <english-title>CONNECTOR ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251128B">H01R13/648</main-classification>
        <further-classification edition="200601120251128B">H01R13/02</further-classification>
        <further-classification edition="200601120251128B">H01R13/40</further-classification>
        <further-classification edition="201101120251128B">H01R12/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞訊滔電子有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN XUNTAO ELECTRONIC CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黄斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾晨輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZENG, CHENHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚坤磷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, KUNLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宏基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HONGJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種連接器組件包括電連接器、屏蔽殼體以及導光管。電連接器包括殼體、設於殼體的導電端子以及與導電端子電性連接的線纜。屏蔽殼體配置為設置於電路板上，屏蔽殼體包括收容腔體，收容腔體與收容插槽相連通。屏蔽殼體設有固持臂。導光管包括第一管體部、第二管體部以及第一連接部，第一管體部以及第二管體部分別位於線纜的兩側。第一連接部設有安裝開槽，固持臂至少部分插入安裝開槽中以對導光管進行固定，從而簡化了固定結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A connector assembly includes an electrical connector, a shielding cage, and a light guide pipe. The electrical connector includes a housing, a conductive terminal mounted to the housing, and a cable electrically connected to the conductive terminal. The shielding cage is configured to be mounted to a circuit board. The shielding cage includes a receiving cavity. The shielding cage is provided with a holding arm. The light guide pipe includes a first pipe body portion, a second pipe body portion and a first connecting portion. The first pipe body portion and the second pipe body portion are located on two sides of the cable, respectively. The first connecting portion defines a mounting slot. The holding arm is at least partially inserted into the mounting slot so as to fix the light guide pipe, thereby simplifying the fixing structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:電路板</p>
        <p type="p">405:第一發光元件</p>
        <p type="p">51:第一線纜</p>
        <p type="p">52:第二線纜</p>
        <p type="p">55a:第五壁部</p>
        <p type="p">55a2:散熱開口</p>
        <p type="p">58:連接壁</p>
        <p type="p">59:固持臂</p>
        <p type="p">591:第一扣持臂</p>
        <p type="p">592:第二扣持臂</p>
        <p type="p">593:插板部</p>
        <p type="p">713:安裝凸柱</p>
        <p type="p">81:第一管體部</p>
        <p type="p">82:第二管體部</p>
        <p type="p">83:第一連接部</p>
        <p type="p">B:圖2中畫圈部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1831" publication-number="202624525">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624525</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142053</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>臨界尺寸相依的間隙填充及保形膜</chinese-title>
        <english-title>CD DEPENDENT GAP FILL AND CONFORMAL FILMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260310B">C23C16/34</main-classification>
        <further-classification edition="200601120260310B">C23C16/42</further-classification>
        <further-classification edition="200601120260310B">C23C16/455</further-classification>
        <further-classification edition="200601120260310B">C23C16/56</further-classification>
        <further-classification edition="202601120260310B">H10P14/40</further-classification>
        <further-classification edition="202601120260310B">H10P14/694</further-classification>
        <further-classification edition="202601120260310B">H10W10/17</further-classification>
        <further-classification edition="202001320260310B">G06F115/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李晶粲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JUNG CHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加　普拉凱特Ｐ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JHA, PRAKET P.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁　璟梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, JINGMEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭津睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, JINRUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, WENHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露了一種沉積含矽材料的方法。本揭露書的一些實施例提供填充窄CD特徵而沒有接縫或空隙的膜。本揭露書的一些實施例提供在具有更寬CD的特徵上保形地形成的膜。本揭露書的實施例還提供具有低粗糙度、低缺陷和有利地低沉積速率的優質膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of depositing a silicon-containing material is disclosed. Some embodiments of the disclosure provide films which fill narrow CD features without a seam or void. Some embodiments of the disclosure provide films which form conformally on features with wider CD. Embodiments of the disclosure alos provide superior quality films with low roughness, low defects and advantageously low deposition rates.</p>
      </isu-abst>
      <representative-img>
        <p type="p">240:含矽材料</p>
        <p type="p">500:方法</p>
        <p type="p">550:操作</p>
        <p type="p">560:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1832" publication-number="202625656">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625656</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142143</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251204B">H10K59/10</main-classification>
        <further-classification edition="202301120251204B">H10K59/84</further-classification>
        <further-classification edition="202301120251204B">H10K50/805</further-classification>
        <further-classification edition="202301120251204B">H10K59/82</further-classification>
        <further-classification edition="202301320251204B">H10K102/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻瑛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEO, JOON-YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金喆鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, CHUL-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置可包含第一顯示區域、包含多個第一透光區域之第二顯示區域、位於第一顯示區域中之第一發光裝置、位於第二顯示區域中且設置於該些第一透光區域之間的第二發光裝置、設置成圍繞第一發光裝置之側表面的第一鈍化層，及設置成圍繞第二發光裝置之側表面的第二鈍化層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device may include a first display area, a second display area including a plurality of first transmission areas, a first light emitting device located in the first display area, a second light emitting device located in the second display area and disposed between the plurality of first transmission areas, a first passivation layer disposed to surround a side surface of the first light emitting device, and a second passivation layer disposed to surround a side surface of the second light emitting device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:第一電子裝置</p>
        <p type="p">12:第二電子裝置</p>
        <p type="p">100:顯示裝置</p>
        <p type="p">110:顯示面板</p>
        <p type="p">DA:顯示區域</p>
        <p type="p">DA1:第一顯示區域</p>
        <p type="p">DA2:第二顯示區域</p>
        <p type="p">DA3:第三顯示區域</p>
        <p type="p">NDA:非顯示區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1833" publication-number="202624360">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624360</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142149</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>接著劑組成物、積層體、積層體之製造方法、及加工後之半導體基板或電子裝置基板之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">C08G77/38</main-classification>
        <further-classification edition="200601120260305B">C08G77/52</further-classification>
        <further-classification edition="201801120260305B">C08K3/012</further-classification>
        <further-classification edition="200601120260305B">C09J183/05</further-classification>
        <further-classification edition="200601120260305B">C09J183/07</further-classification>
        <further-classification edition="201801120260305B">C09J7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日產化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳井昌樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANAI, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岸岡高廣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KISHIOKA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臼井友輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>USUI, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之接著劑組成物，係用以形成設於支撐基板與半導體基板或電子裝置基板之間之接著劑層；  &lt;br/&gt;前述接著劑組成物係含有藉由矽氫化反應而硬化之接著劑成分（A）；且  &lt;br/&gt;藉由特定測定方法測定之前述接著劑層的蝕刻率為10μm/min以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1834" publication-number="202624445">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624445</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142150</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>接著劑組成物、積層體、積層體之製造方法、及加工後之半導體基板之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">C09J183/06</main-classification>
        <further-classification edition="201801120260306B">C09J7/20</further-classification>
        <further-classification edition="200601120260306B">C08F2/40</further-classification>
        <further-classification edition="201901120260306B">B32B7/06</further-classification>
        <further-classification edition="200601120260306B">C08G77/12</further-classification>
        <further-classification edition="200601120260306B">C08G77/20</further-classification>
        <further-classification edition="200601120260306B">C09J11/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日產化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳井昌樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANAI, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岸岡高廣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KISHIOKA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臼井友輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>USUI, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之接著劑組成物，係用以形成設於支撐基板、與具有凸塊之半導體基板之間之接著劑層；  &lt;br/&gt;前述接著劑組成物係含有藉由矽氫化反應而硬化之接著劑成分（A）；且  &lt;br/&gt;藉由動態黏彈性測定所測定之前述接著劑層的楊氏模數為5MPa以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1835" publication-number="202624500">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624500</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142158</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於處理來自垃圾焚化廠之爐渣的系統及方法</chinese-title>
        <english-title>SYSTEM AND PROCESS FOR TREATING SLAG FROM WASTE INCINERATION PLANTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C22B7/04</main-classification>
        <further-classification edition="200601120260302B">B03C1/02</further-classification>
        <further-classification edition="200601120260302B">B03B9/06</further-classification>
        <further-classification edition="200601120260302B">B65G47/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義大利商馬加帝電力公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAGALDI POWER S.P.A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬加帝　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAGALDI, PAOLO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥爾羅　馬蒂奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAIELLO, MATTEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱拉瑞茲雅　馬蒂奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CLARIZIA, MATTEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波尼　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOENI, JOHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種材料處理廠（1），其用於用包括一個單一渦電流分離器（4）之一個單一加工線從不同粒度級之部分經處理爐渣（2、3）中分離非鐵金屬（6），  &lt;br/&gt;該分離器具有用於未經處理爐渣之一入口（9）、用於一礦物爐渣部分（8）之一出口（7）及用於一經分離非鐵金屬部分（6）之一出口（5），  &lt;br/&gt;其中在用於未經處理爐渣之該入口（9）之前，兩個儲存緩衝器（10、11）與用於來自2個並行儲存緩衝器之未經處理爐渣（2、3）之一出口（12、13）並行配置，該2個並行儲存緩衝器具有從該兩個出口（12、13）至該渦電流分離器（4）之該入口（9）的一共用輸送線（14）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Material treatment plant (1) for separating non-ferrous metals (6) from partly-treated slag (2, 3) of different particle size fractions with one single processing line including one single eddy current separator (4), &lt;br/&gt;which separator has an inlet (9) for untreated slag, an outlet (7) for a mineral slag fraction (8), and an outlet (5) for a separated non-ferrous metal fraction (6), &lt;br/&gt;wherein before the inlet (9) for untreated slag, two storage buffers (10, 11) are arranged in parallel with an outlet (12, 13) for untreated slag (2, 3) from the 2 parallel storage buffers with a common conveying line (14) from the two outlets (12,13) to the inlet (9) of the eddy current separator (4).</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:材料處理廠</p>
        <p type="p">2:未經處理爐渣部分I</p>
        <p type="p">3:未經處理爐渣部分II</p>
        <p type="p">4:渦電流分離器</p>
        <p type="p">5:用於非鐵金屬之渦電流之出口</p>
        <p type="p">6:非鐵金屬</p>
        <p type="p">7:用於礦物爐渣部分之渦電流之出口</p>
        <p type="p">8:礦物爐渣部分</p>
        <p type="p">9:渦電流分離器之入口</p>
        <p type="p">10:儲存緩衝器I</p>
        <p type="p">11:儲存緩衝器II</p>
        <p type="p">12:儲存緩衝器之出口I</p>
        <p type="p">13:儲存緩衝器之出口II</p>
        <p type="p">14:輸送系統</p>
        <p type="p">100:控制單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1836" publication-number="202625090">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625090</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142161</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>通常化零樣本內容風格組成</chinese-title>
        <english-title>GENERALIZED ZERO-SHOT CONTENT-STYLE COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260305B">G06T11/00</main-classification>
        <further-classification edition="202301120260305B">G06N3/0455</further-classification>
        <further-classification edition="202201120260305B">G06V10/764</further-classification>
        <further-classification edition="202201120260305B">G06V10/82</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡里米達斯特傑爾迪　穆罕默德雷札</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARIMI DASTJERDI, MOHAMMAD REZA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴德瓦傑　卡提凱亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHARDWAJ, KARTIKEYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博爾斯　舒布漢卡爾曼格甚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BORSE, SHUBHANKAR MANGESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納亞克　安基塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAYAK, ANKITA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>提格　愛德華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEAGUE, EDWARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波里科利　費提穆瑞特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PORIKLI, FATIH MURAT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中描述用於生成一影像的系統及技術。例如，一種程序可包括：藉由一經預訓練機器學習模型的一風格調適器而基於一輸入風格影像來生成一風格嵌入；藉由該經預訓練機器學習模型的一內容調適器而基於一輸入內容影像來生成一內容嵌入；組合該風格嵌入及該內容嵌入以生成一經組合嵌入；及使用該經預訓練機器學習模型而基於該經組合嵌入來生成一輸出影像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and techniques are described herein for generating an image. For instance, a process can include generating, by a style adapter for a pretrained machine learning model, a style embedding based on an input style image; generating, by a content adapter for the pretrained machine learning model, a content embedding based on an input content image; combining the style embedding and the content embedding to generate a combined embedding; and generating, using the pretrained machine learning model, an output image based on the combined embedding.</p>
      </isu-abst>
      <representative-img>
        <p type="p">700:通常化零樣本內容風格組成</p>
        <p type="p">702:經預訓練生成式機器學習(ML)模型</p>
        <p type="p">704:雜訊影像</p>
        <p type="p">706:新影像</p>
        <p type="p">708:經估計生成影像</p>
        <p type="p">710:風格調適器</p>
        <p type="p">712:內容調適器</p>
        <p type="p">714:風格損失</p>
        <p type="p">716:內容損失</p>
        <p type="p">718:經預訓練編碼器</p>
        <p type="p">720:投影層</p>
        <p type="p">722:線性層</p>
        <p type="p">724:交叉注意力層</p>
        <p type="p">726:經預訓練編碼器</p>
        <p type="p">728:投影層</p>
        <p type="p">730:線性層</p>
        <p type="p">732:交叉注意力層</p>
        <p type="p">734:內容影像</p>
        <p type="p">736:風格影像</p>
        <p type="p">738:文字調適器</p>
        <p type="p">740:文字編碼器</p>
        <p type="p">742:交叉注意力層</p>
        <p type="p">744:組合器</p>
        <p type="p">746:對比風格描述符(CSD)</p>
        <p type="p">748:對比風格描述符(CSD)</p>
        <p type="p">750:DINO</p>
        <p type="p">752:經組合嵌入</p>
        <p type="p">754:資料集</p>
        <p type="p">756:資料集</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1837" publication-number="202624190">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624190</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142201</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>水性胺基甲酸酯樹脂用改質劑、水性胺基甲酸酯樹脂組成物、成形體、纖維基材、人工皮革</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C69/44</main-classification>
        <further-classification edition="200601120260102B">C08G63/16</further-classification>
        <further-classification edition="200601120260102B">C08K5/11</further-classification>
        <further-classification edition="200601120260102B">C08L67/02</further-classification>
        <further-classification edition="200601120260102B">C08L75/04</further-classification>
        <further-classification edition="200601120260102B">C08J5/24</further-classification>
        <further-classification edition="201801120260102B">C09D7/63</further-classification>
        <further-classification edition="201801120260102B">C09D7/65</further-classification>
        <further-classification edition="200601120260102B">C09D175/04</further-classification>
        <further-classification edition="200601120260102B">D06M13/224</further-classification>
        <further-classification edition="200601120260102B">D06M15/507</further-classification>
        <further-classification edition="200601120260102B">D06M15/564</further-classification>
        <further-classification edition="200601120260102B">D06N3/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＤＩＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅本哲朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UMEMOTO, TETSURO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩尾武志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWAO, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>所寛樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKORO, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>角谷凌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITANI, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹東穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可對水性胺基甲酸酯樹脂組成物成形體賦予手感與耐彎曲性的水性胺基甲酸酯樹脂用改質劑。一種水性胺基甲酸酯樹脂用改質劑，為下述通式（1-1）或下述通式（1-2）所表示的二酯或聚酯。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="180px" width="383px" file="ed10004.JPG" alt="ed10004.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1838" publication-number="202625316">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625316</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142205</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電連接器以及連接器組件</chinese-title>
        <english-title>ELECTRICAL CONNECTOR AND CONNECTOR ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120251201B">H01R13/6587</main-classification>
        <further-classification edition="201101120251201B">H01R13/6589</further-classification>
        <further-classification edition="200601120251201B">H01R13/426</further-classification>
        <further-classification edition="200601120251201B">H01R13/46</further-classification>
        <further-classification edition="200601120251201B">H01R13/05</further-classification>
        <further-classification edition="200601120251201B">H01R13/506</further-classification>
        <further-classification edition="200601120251201B">H01R13/504</further-classification>
        <further-classification edition="201101120251201B">H01R12/72</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞訊滔電子有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN XUNTAO ELECTRONIC CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾晨輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZENG, CHENHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚坤磷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, KUNLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宏基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HONGJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電連接器包括導電殼體、複數導電端子、第一線纜以及第一屏蔽片。導電端子包括複數第一導電端子以及複數第一板端端子。第一板端端子包括第一接地端子以及第一板端附加端子。每一個第一板端端子包括第一安裝尾部。第一接地端子包括第一抵接部。第一線纜與第一導電端子電性連接。第一屏蔽片與第一抵接部相接觸，使得第一屏蔽片能夠藉由第一接地端子的第一安裝尾部與電路板實現接地。本發明還揭示了一種具有電連接器的連接器組件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrical connector includes a conductive housing, a number of conductive terminals, a first cable and a first shielding plate. The conductive terminals include a number of first conductive terminals and a number of first board-end terminals. Each first board-end terminal includes a first ground terminal and a first board-end terminal additional terminal. Each first board-end terminal includes a first mounting tail portion. The first ground terminal includes a first abutting portion. The first cable is electrically connected to the first conductive terminal. The first shielding plate is in contact with the first abutting portion, so that the first shielding plate can be grounded with a circuit board through the first mounting tail portion of the first ground terminal. With this arrangement, the grounding structure of the electrical connector is optimized. A connector assembly having the electrical connector is also disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3521:第一抵接部</p>
        <p type="p">3522:第二抵接部</p>
        <p type="p">3523:第一延伸部</p>
        <p type="p">3621:第三抵接部</p>
        <p type="p">3622:第四抵接部</p>
        <p type="p">3623:第二延伸部</p>
        <p type="p">61:第一屏蔽片</p>
        <p type="p">63:第二屏蔽片</p>
        <p type="p">P:圖52中畫框部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1839" publication-number="202624288">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624288</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142292</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體器件之製造方法、半導體器件及樹脂</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08F2/44</main-classification>
        <further-classification edition="200601120260302B">C08F290/14</further-classification>
        <further-classification edition="200601120260302B">C08G73/10</further-classification>
        <further-classification edition="200601120260302B">C08G73/12</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/027</further-classification>
        <further-classification edition="200601120260302B">G03F7/031</further-classification>
        <further-classification edition="200601120260302B">G03F7/038</further-classification>
        <further-classification edition="200601120260302B">G03F7/16</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="200601120260302B">G03F7/40</further-classification>
        <further-classification edition="200601120260302B">B32B15/08</further-classification>
        <further-classification edition="202601120260302B">H10P76/20</further-classification>
        <further-classification edition="202601120260302B">H10W20/48</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牧野雅臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAKINO, MASAOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓孟儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種樹脂組成物、將上述組成物硬化而成之硬化物及其製造方法、包含硬化物之積層體及其製造方法、半導體器件及其製造方法、以及新型樹脂，該樹脂組成物含有具有聚合性基之樹脂及光聚合起始劑，上述樹脂具有式（A-1a）及式（A-1b）的至少1種部分結構，相對於上述樹脂中所包含之環丁烷環的總莫耳量，作為反式立體構型之環丁烷環的莫耳量之比例為80%以上。  &lt;br/&gt;&lt;img align="absmiddle" height="140px" width="546px" file="ed10090.JPG" alt="ed10090.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1840" publication-number="202624305">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624305</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142298</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚合性組成物、聚合物、硬化物、黏著劑、接著劑、密封劑、塗料、裝飾用材料、以及牙科用材料</chinese-title>
        <english-title>POLYMERIZABLE COMPOSITION, POLYMER, CURED PRODUCT, ADHESIVE, BONDING AGENT, SEALANT, COATING, DECORATIVE MATERIAL AND DENTAL MATERIAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">C08F220/18</main-classification>
        <further-classification edition="200601120260304B">C08L33/12</further-classification>
        <further-classification edition="200601120260304B">C08L33/26</further-classification>
        <further-classification edition="200601120260304B">C08K5/14</further-classification>
        <further-classification edition="200601120260304B">C08F2/50</further-classification>
        <further-classification edition="200601120260304B">C09J109/00</further-classification>
        <further-classification edition="200601120260304B">C09K3/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商科巨希化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KJ CHEMICALS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平田明理</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRATA, MEIRI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古莊晴香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUSHO, HARUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡田一歩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKADA, KAZUHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北村大地</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAMURA, DAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供一種聚合性組成物，具有優異之透明性、聚合性及硬化性，且對多種基材顯示出高密接性，並且熱聚合或熱硬化時之釋氣之產生量極少。另外，本發明的目的在於提供一種兼具先前難以兼顧之耐熱性、耐水性及耐衝擊性之聚合物或硬化物，進而提供一種兼備這些特性之適於各種用途之組成物及由這些組成物所構成之具有優異之耐熱性、耐釋氣性、耐水性、耐衝擊性之聚合物或硬化物。本案發明人發現，藉由使用含有於分子內具有醯胺基及環狀取代基之(甲基)丙烯酸酯(A)、及熱聚合起始劑(C)之聚合性組成物，能夠有效地解決上述課題。該組成物能夠形成如下硬化物，具有優異之透明性、密接性、硬化性，且抑制釋氣之產生，並且耐熱性、耐水性、耐衝擊性優異。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The objective of the present invention is to provide a polymerizable composition that exhibits excellent transparency, polymerizability, curability and high adhesion to various substrates, and extremely low gas generation during thermal polymerization or thermal curing. Another objective of the present invention is to provide a polymer or a cured product that combines heat resistance, water resistance, and impact resistance previously difficult to achieve simultaneously and further, to provide a composition suitable for various applications that possesses these characteristics, as well as a polymer or a cured product composed of such compositions which exhibits excellent heat resistance, outgas resistance, water resistance, and impact resistance. The inventors of the present invention discovered that the aforementioned problems can be effectively solved by using a polymerizable composition comprising a (meth)acrylate (A) having an amide group and a cyclic substituent within the molecule, and a thermal polymerization initiator (C). The composition is capable of forming a cured product that possesses excellent transparency, adhesion, and curability, suppresses the generation of outgas, and exhibits superior heat resistance, water resistance, and impact resistance.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1841" publication-number="202625089">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625089</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142308</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用以描述攜帶使用基於學習之編解碼器針對點雲內容所寫碼之資料的位元串流之高階語法設計之方法</chinese-title>
        <english-title>METHODS TO DESCRIBE THE HIGH-LEVEL SYNTAX DESIGN OF A BITSTREAM CARRYING DATA CODED USING LEARNING-BASED CODEC FOR POINT CLOUD CONTENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">G06T9/00</main-classification>
        <further-classification edition="201401120260309B">H04N19/597</further-classification>
        <further-classification edition="200601120260309B">G06T17/00</further-classification>
        <further-classification edition="201401120260309B">H04N19/119</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商內數位ＶＣ控股公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERDIGITAL VC HOLDINGS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布拉爾　哥迪普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHULLAR, GURDEEP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田　棟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIAN, DONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龐　家昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANG, JIAHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古都馬蘇　斯林凡斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUDUMASU, SRINIVAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈姆扎　亞曼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMZA, AHMED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種方法之一些實施例可包含：自一點雲資料位元串流獲得一存取單元；自該存取單元提取一切片資料單元，其中該切片資料單元包括一切片標頭及一切片有效負載；判定該切片資料單元之一切片資料單元類型；基於該切片資料單元類型而剖析該切片標頭；基於該切片資料單元類型而剖析該切片有效負載；及使用該經剖析之切片有效負載產生點雲資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Some embodiments of a method may include: obtaining an access unit from a point cloud data bitstream; extracting a slice data unit from the access unit, wherein the slice data unit comprises a slice header and a slice payload; determining a slice data unit type for the slice data unit; parsing the slice header based on the slice data unit type; parsing the slice payload based on the slice data unit type; and generating point cloud data using the parsed slice payload.</p>
      </isu-abst>
      <representative-img>
        <p type="p">700:位元串流結構</p>
        <p type="p">702:參數集</p>
        <p type="p">704:參數集</p>
        <p type="p">706:存取單元</p>
        <p type="p">708:切片資料單元</p>
        <p type="p">710:單元標頭</p>
        <p type="p">712:單元有效負載格式結構</p>
        <p type="p">714:存取單元</p>
        <p type="p">716:切片資料單元</p>
        <p type="p">718:切片資料單元</p>
        <p type="p">720:切片資料單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1842" publication-number="202625662">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625662</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142460</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置及顯示面板</chinese-title>
        <english-title>DISPLAY DEVICE AND DISPLAY PANEL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251117B">H10K59/122</main-classification>
        <further-classification edition="202301120251117B">H10K59/40</further-classification>
        <further-classification edition="201601120251117B">G09G3/3266</further-classification>
        <further-classification edition="201601120251117B">G09G3/3275</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李善美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SUNMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金容一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YONG-IL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李福永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, BOK-YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹琯植</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUN, KWANSIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露可提供一種顯示裝置，此顯示裝置可包含顯示面板，其中光學電子裝置設置於顯示區域內，其中顯示區域包含其中設置有包含發光層的多個子像素的正常區域、其中放置有此光學電子裝置的通孔；以及周邊區域，其中正常區域與通孔之間形成有一個或多個發光層斷連圖案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure may provide a display device including a display panel in which an optical electronic device is disposed within a display area, wherein the display area includes a normal area in which a plurality of subpixels including an emission layer are disposed, a through-hole in which the optical electronic device is located, and a surrounding area in which one or more emission layer disconnection patterns are formed between the normal area and the through-hole.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:光學電子裝置</p>
        <p type="p">ACT:主動層</p>
        <p type="p">AE:陽極電極</p>
        <p type="p">BANK:堤岸</p>
        <p type="p">BUF:緩衝層</p>
        <p type="p">ECP:發光層斷連圖案</p>
        <p type="p">EL:發光層</p>
        <p type="p">GI:閘極絕緣膜</p>
        <p type="p">ILD1:第一層間絕緣膜</p>
        <p type="p">ILD2:第二層間絕緣膜</p>
        <p type="p">IM:斷連絕緣層</p>
        <p type="p">NA:正常區域</p>
        <p type="p">PAS1:第一封裝層</p>
        <p type="p">PAS2:第三封裝層</p>
        <p type="p">PCL:第二封裝層</p>
        <p type="p">PLN1:第一平坦化層</p>
        <p type="p">PLN2:第二平坦化層</p>
        <p type="p">SA:周邊區域</p>
        <p type="p">SD1:第一源極-汲極電極圖案</p>
        <p type="p">SM1:第一遮蔽層</p>
        <p type="p">SM2:第二遮蔽層</p>
        <p type="p">SM3:第三遮蔽層</p>
        <p type="p">SUB:基板</p>
        <p type="p">TH:通孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1843" publication-number="202625664">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625664</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142462</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電致發光顯示裝置</chinese-title>
        <english-title>ELECTROLUMINESCENT DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251229B">H10K59/32</main-classification>
        <further-classification edition="202301120251229B">H10K50/19</further-classification>
        <further-classification edition="202301120251229B">H10K59/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔允曦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, YUNHEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電致發光顯示裝置，包含：基板，包含第一子像素、第二子像素及第三子像素；第一電極，位於基板上之第一子像素至第三子像素之每一者中；發光單元，位於第一電極上；及第二電極，位於發光單元上，其中發光單元包含包含第一發光層的第一疊層及包含第二發光層的第二疊層；及電荷產生層，設置於第一疊層與第二疊層之間，其中電荷產生層包含設置於第一子像素中的第一電荷產生層；及設置於第二子像素及第三子像素中的第二電荷產生層，且其中第二電荷產生層不與第一子像素重疊且橫跨第二子像素及第三子像素之第二電荷產生層是連續的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electroluminescent display device is provided, a substrate including a first sub-pixel, a second sub-pixel, and a third sub-pixel, a first electrode in each of the first to third sub-pixels on the substrate, a light emitting unit on the first electrode, and a second electrode on the light emitting unit, wherein the light emitting unit includes a first stack including a first light emitting layer, a second stack including a second light emitting layer, and a charge generation layer disposed between the first stack and the second stack, wherein the charge generation layer includes a first charge generation layer disposed in the first sub-pixel and a second charge generation layer disposed in the second sub-pixel and the third sub-pixel, and wherein the second charge generation layer does not overlap the first sub-pixel and is continuous across the second sub-pixel and the third sub-pixel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板</p>
        <p type="p">200:電路元件層</p>
        <p type="p">210:主動層</p>
        <p type="p">220:閘極絕緣層</p>
        <p type="p">230:閘極電極</p>
        <p type="p">240:層間絕緣層</p>
        <p type="p">250:源極電極</p>
        <p type="p">260:汲極電極</p>
        <p type="p">310:鈍化層</p>
        <p type="p">320:平坦化層</p>
        <p type="p">400:第一電極</p>
        <p type="p">450:堤</p>
        <p type="p">500:發光單元</p>
        <p type="p">600:第二電極</p>
        <p type="p">700:封蓋層</p>
        <p type="p">R sub-pixel:紅色子像素</p>
        <p type="p">G sub-pixel:綠色子像素</p>
        <p type="p">B sub-pixel:藍色子像素</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1844" publication-number="202624860">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624860</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142463</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示設備</chinese-title>
        <english-title>DISPLAY APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251114B">G02F1/1335</main-classification>
        <further-classification edition="200601120251114B">G02F1/13357</further-classification>
        <further-classification edition="200601120251114B">G02B5/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金鎭鍊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JIN RYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金地坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JI-GON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李敏珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MINJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金大用</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DAEYONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔恩憘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, EUNHEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露之實施例描述一種顯示設備可包含：背光單元，包含導光板、具有形成於其中之片孔的背光片，及被配置為將光發出至導光板之背光光源元件；液晶面板，其被置於背光單元之前表面上；及光學模組，其被置於背光單元之背表面之一部分上，此部分與片孔重疊。光學模組包含：稜鏡結構，包含朝向液晶面板之第一稜鏡表面、垂直於第一稜鏡表面之第二稜鏡表面，及被置於第一稜鏡表面與第二稜鏡表面之間之傾斜表面；光學元件，被置於第二稜鏡表面附近；及補償板，置於第一稜鏡表面與片孔之間，補償板具有光提取圖案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Implementations of the disclosure describe a display apparatus including a backlight unit including a light guide plate, a backlight sheet having a sheet hole formed therein, and a backlight light source element configured to emit light to the light guide plate, a liquid crystal panel positioned on a front surface of the backlight unit, and an optical module positioned on a portion of a back surface of the backlight unit, the portion overlapping the sheet hole. The optical module includes a prism structure including a first prism surface oriented toward the liquid crystal panel, a second prism surface perpendicular to the first prism surface, and an inclined surface provided between the first prism surface and the second prism surface, an optical element positioned adjacent to the second prism surface, and a compensation plate positioned between the first prism surface and the sheet hole, the compensation plate having a light extraction pattern.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:液晶面板</p>
        <p type="p">AA:主動區域</p>
        <p type="p">BZ:邊框區域</p>
        <p type="p">CH:相機孔</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">HA:感測區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1845" publication-number="202623875">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623875</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142556</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無反洗之液-液萃取芳香族的方法</chinese-title>
        <english-title>PROCESS FOR LIQUID-LIQUID EXTRACTION OF AROMATICS WITHOUT BACKWASHING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">B01D11/04</main-classification>
        <further-classification edition="200601120260302B">C07C7/10</further-classification>
        <further-classification edition="200601120260302B">C07C15/02</further-classification>
        <further-classification edition="200601120260302B">C10G21/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商ＩＦＰ新能源公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IFP ENERGIES NOUVELLES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洛賽特　海倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LORCET, HELENE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿爾　馬特哈吉　阿札爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AL-MATHEHHAJI, AZHAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>YE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫德克　蘇菲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUDERC, SOPHIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布拉斯　哈娜奈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOURAS, HANANE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古乃任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於自包含芳香族及非芳香族化合物之混合物之原料(1)分離芳香族化合物之方法及裝置，其中自進料溶劑(2)之液-液萃取器(T1)中之原料(1)萃取芳香族，以產生至少一種相對於該原料(1)濃縮芳香族化合物之萃取物(4)、及相對於該原料(1)之組成濃縮非芳香族化合物之萃餘物(3)；且其中在該液-液萃取器(T1)之配置於原料(1)進料點與溶劑(2)進料點之間之一或多個位置處對該液-液萃取器(T1)進料整個萃取物再循環(5)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a process and a device for the separation of aromatic compounds from a feedstock (1) comprising a mixture of aromatic and non-aromatic compounds in which aromatics are extracted from the feedstock (1) in a liquid-liquid extractor (T1) fed with a solvent (2), in order to produce at least one extract (4) concentrated in aromatic compounds with respect to the feedstock (1), and a raffinate (3) concentrated in non-aromatic compounds with respect to the composition of the feedstock (1); and in which the liquid-liquid extractor (T1) is fed with the entirety of an extract recycle (5) at a position or positions of the liquid-liquid extractor (T1) disposed between a feedstock (1) feed point and a solvent (2) feed point.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:原料</p>
        <p type="p">2:溶劑/溶劑物流</p>
        <p type="p">3:萃餘物</p>
        <p type="p">4:萃取物</p>
        <p type="p">5:萃取物再循環/萃取物再循環物流</p>
        <p type="p">T1:液-液萃取器</p>
        <p type="p">Z1:上部/萃取區</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1846" publication-number="202623909">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623909</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142586</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>分選設備以及分選方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">B07C5/02</main-classification>
        <further-classification edition="200601120260313B">B07C5/00</further-classification>
        <further-classification edition="200601120260313B">B07C5/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳市騰盛精密裝備股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENZHEN TENSUN PRECISION EQUIPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江岱平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, DAIPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>付黎明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, LIMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐家松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, JIASONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃學孟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, XUEMENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇功波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, GONGBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧國藝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, GUOYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧國明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, GUOMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明適用於分選設備技術領域，提供了一種分選設備及分選方法，上述分選方法包括如下步驟：產品放到運輸平臺上運輸、上相機從上方拍攝PAD面、擺盤段搬運臂取料、下相機拍攝整盤產品Mark面以及直線驅動平臺移動至分選機構處。與現有技術中的分選方法相比，可以在對產品進行分選之前，就可以通過上相機以及下相機與運輸平臺以及擺盤段搬運臂配合獲取所有產品的整體正面圖像與整體底面圖像，而不用在進行分選時對單個產品進行逐個單獨拍攝，在整個設備在具備較高自動化程度的前提下，提高了分選工作的效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1847" publication-number="202625480">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625480</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142652</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於條件胞元切換執行之定時提前供應</chinese-title>
        <english-title>TIMING ADVANCE PROVISIONING FOR CONDITIONAL CELL SWITCH EXECUTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260315B">H04W36/24</main-classification>
        <further-classification edition="200901120260315B">H04W36/36</further-classification>
        <further-classification edition="200901120260315B">H04W56/00</further-classification>
        <further-classification edition="202401120260315B">H04W74/0833</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬蘭商諾基亞科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOKIA TECHNOLOGIES OY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡克維斯　安納斯塔西奧斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAKKAVAS, ANASTASIOS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哥雅爾　山傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOYAL, SANJAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古爾蘇　哈立德　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GURSU, HALIT MURAT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史帕皮斯　潘納吉歐提斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPAPIS, PANAGIOTIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿什拉夫　沙扎德　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASHRAF, SHEHZAD ALI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波爾卡　大流士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PALKA, DARIUSZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種由一使用者裝備(UE)執行之方法。該方法包括自一源胞元接收用於一命令中指示之至少一個候選胞元之早期定時提前(TA)獲取的該命令。該方法包括作出該至少一個候選胞元為至少一個條件較低層觸發行動性(CLTM)候選胞元之一判定。該方法包括基於該判定監視該至少一個CLTM候選胞元之至少一個TA值。且該方法包括接收該至少一個TA值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method performed by a user equipment (UE) is provided. The method includes receiving, from a source cell, an order for early timing advance (TA) acquisition for at least one candidate cell indicated in the order. The method includes making a determination that the at least one candidate cell is at least one conditional lower-layer triggered mobility (CLTM) candidate cell. The method includes monitoring for at least one TA value for the at least one CLTM candidate cell based on the determination. And the method includes receiving the at least one TA value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">700:方法</p>
        <p type="p">702,704,706,708:方塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1848" publication-number="202625406">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625406</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142676</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>環境物聯網架構中的基於網路之認證</chinese-title>
        <english-title>NETWORK-BASED AUTHENTICATION IN AN AMBIENT INTERNET OF THINGS ARCHITECTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">H04L9/08</main-classification>
        <further-classification edition="200601120260305B">H04L9/32</further-classification>
        <further-classification edition="202101120260305B">H04W12/041</further-classification>
        <further-classification edition="202101120260305B">H04W12/069</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金洪日</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HONGIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秀　凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SOO BUM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史佩卻爾　賽巴斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPEICHER, SEBASTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的各種態樣大致上係關於無線通訊。在一些態樣中，一種環境物聯網(AIoT)裝置可與一網路功能執行一認證及金鑰協議程序以產生一根金鑰。該AIoT裝置可從一AIoT控制器接收一金鑰確認訊息。該AIoT裝置可使用該金鑰確認訊息及該根金鑰產生一保護金鑰。該AIoT裝置可使用該保護金鑰且回應於該金鑰確認訊息而將一金鑰確認應答傳輸至該AIoT控制器。描述多種其他態樣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various aspects of the present disclosure generally relate to wireless communication. In some aspects, an ambient Internet of Things (AIoT) device may perform an authentication and key agreement procedure with a network function to generate a root key. The AIoT device may receive, from an AIoT controller, a key confirmation message. The AIoT device may generate, using the key confirmation message and the root key, a protection key. The AIoT device may transmit, to the AIoT controller, a key confirmation acknowledgement using the protection key and in response to the key confirmation message. Numerous other aspects are described.</p>
      </isu-abst>
      <representative-img>
        <p type="p">205:環境物聯網(AIoT)裝置</p>
        <p type="p">208:環境物聯網(AIoT)讀取器</p>
        <p type="p">210:環境物聯網(AIoT)控制器</p>
        <p type="p">235:網路功能</p>
        <p type="p">400:與AIoT架構中的基於網路之認證相關聯的實例</p>
        <p type="p">405:元件符號</p>
        <p type="p">410:元件符號</p>
        <p type="p">415:元件符號</p>
        <p type="p">420:元件符號</p>
        <p type="p">425:元件符號</p>
        <p type="p">430:元件符號</p>
        <p type="p">435:元件符號</p>
        <p type="p">440:元件符號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1849" publication-number="202625468">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625468</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142692</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>環境物聯網環境中的通用引導架構認證</chinese-title>
        <english-title>GENERIC BOOTSTRAPPING ARCHITECTURE AUTHENTICATION IN AN AMBIENT INTERNET OF THINGS ENVIRONMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260313B">H04W12/04</main-classification>
        <further-classification edition="202101120260313B">H04W12/041</further-classification>
        <further-classification edition="202101120260313B">H04W12/06</further-classification>
        <further-classification edition="200601120260313B">H04L9/08</further-classification>
        <further-classification edition="201801120260313B">H04W4/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金洪日</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HONGIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秀　凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SOO BUM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史佩卻爾　賽巴斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPEICHER, SEBASTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的各種態樣大致上係關於無線通訊。在一些態樣中，一環境物聯網(AIoT)裝置可從一AIoT控制器接收通用引導架構(GBA)推送資訊(GPI)。該AIoT裝置可使用該GPI產生與該AIoT控制器相關聯的一根金鑰。該AIoT裝置可使用該根金鑰向該AIoT控制器傳輸一金鑰確認訊息。描述多種其他態樣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various aspects of the present disclosure generally relate to wireless communication. In some aspects, an ambient Internet of Things (AIoT) device may receive generic bootstrapping architecture (GBA) push information (GPI) from an AIoT controller. The AIoT device may generate, using the GPI, a root key associated with the AIoT controller. The AIoT device may transmit, to the AIoT controller, a key confirmation message using the root key. Numerous other aspects are described.</p>
      </isu-abst>
      <representative-img>
        <p type="p">205:AIoT裝置</p>
        <p type="p">208:AIoT讀取器</p>
        <p type="p">210:AIoT控制器</p>
        <p type="p">235:網路功能</p>
        <p type="p">300:實例</p>
        <p type="p">305:元件符號；步驟</p>
        <p type="p">310:元件符號；步驟</p>
        <p type="p">315:元件符號；步驟</p>
        <p type="p">320:元件符號；步驟</p>
        <p type="p">325:元件符號；步驟</p>
        <p type="p">330:元件符號；步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1850" publication-number="202625834">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625834</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142702</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路結構及其佈局規劃</chinese-title>
        <english-title>INTEGRATED CIRCUIT (IC) STRUCTURE AND FLOORPLAN THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W70/60</main-classification>
        <further-classification edition="202001120260302B">G06F30/392</further-classification>
        <further-classification edition="202001320260302B">G06F115/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英屬開曼群島商世芯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALCHIP TECHNOLOGIES, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KY</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林文熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEN-HSI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何闓廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, KAI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛澤夫　艾瑞司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAIZAF, EREZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊名宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種積體電路(IC)結構。該IC結構包含一載體及呈一陣列配置於該載體上之複數個群組。該複數個群組之各者包含一電子組件及透過該載體與該電子組件電連接之複數個記憶體。該IC結構進一步包含一第一孔，該第一孔由該載體界定且經組態以容納一第一固定元件以將該IC結構固持至另一表面。該孔安置於該陣列之兩列之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an integrated circuit (IC) structure. The IC structure includes a carrier and a plurality of groups arranged in an array on the carrier. Each of the plurality of groups includes an electronic component and a plurality of memories electrically connected with the electronic component through the carrier. The IC structure further includes a first hole defined by the carrier and configured to accommodate a first fixing element to hold the IC structure to another surface. The hole is disposed between two rows of the array.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1a:積體電路(IC)結構</p>
        <p type="p">10:載體</p>
        <p type="p">10h:孔</p>
        <p type="p">11:電子組件</p>
        <p type="p">12:記憶體</p>
        <p type="p">13:連接器</p>
        <p type="p">13b:電接觸件</p>
        <p type="p">13c:連接元件</p>
        <p type="p">13e:網路晶片</p>
        <p type="p">13p:印刷電路板(PCB)</p>
        <p type="p">113:表面</p>
        <p type="p">114:表面</p>
        <p type="p">XX:群組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1851" publication-number="202625621">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625621</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142704</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路結構及其佈局規劃</chinese-title>
        <english-title>INTEGRATED CIRCUIT (IC) STRUCTURE AND FLOORPLAN THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260105B">H10D89/10</main-classification>
        <further-classification edition="202001120260105B">G06F30/392</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英屬開曼群島商世芯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALCHIP TECHNOLOGIES, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KY</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林文熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEN-HSI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何闓廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, KAI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊名宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種積體電路(IC)結構。該IC結構包含一載體及安置於該載體上方之複數個群組。該複數個群組之各者包含複數個電子組件且具有一較長邊及一較短邊。該複數個群組中之一者之該較短邊與該複數個群組中之另一者之該較長邊對準。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an integrated circuit (IC) structure. The IC structure includes a carrier and a plurality of groups disposed over the carrier. Each of the plurality of groups includes a plurality of electronic components and having a longer side and a shorter side. The shorter side of one of the plurality of groups is aligned with the longer side of another one of the plurality of groups.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1a:積體電路(IC)結構</p>
        <p type="p">10:載體</p>
        <p type="p">10h:孔</p>
        <p type="p">10hs:空間</p>
        <p type="p">11:電子組件</p>
        <p type="p">11n:較長邊</p>
        <p type="p">11s:較短邊</p>
        <p type="p">12:橋接元件</p>
        <p type="p">13:連接器</p>
        <p type="p">13b:電接觸件</p>
        <p type="p">13c:連接元件</p>
        <p type="p">13e:網路晶片</p>
        <p type="p">13p:印刷電路板(PCB)</p>
        <p type="p">18:中介層</p>
        <p type="p">XX:群組</p>
        <p type="p">XXn:較長邊</p>
        <p type="p">XXs:較短邊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1852" publication-number="202624135">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624135</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142737</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>超純水製造系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260302B">C02F1/02</main-classification>
        <further-classification edition="202301120260302B">C02F1/20</further-classification>
        <further-classification edition="202301120260302B">C02F1/32</further-classification>
        <further-classification edition="202301120260302B">C02F1/42</further-classification>
        <further-classification edition="202301120260302B">C02F1/44</further-classification>
        <further-classification edition="202301120260302B">C02F9/00</further-classification>
        <further-classification edition="200601120260302B">B01D61/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商栗田工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURITA WATER INDUSTRIES LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>栩内優仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOCHINAI, MASAHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在本發明的超純水製造系統中，子系統1具有子罐2、供給配管3、泵4、設置於所述供給配管3的後級的膜式脫氣裝置5、以及紫外線氧化裝置6，在所述紫外線氧化裝置6的後級，供給配管3分支成兩個方向。其中一個方向是經由冷卻用的熱交換器7、非再生式的離子交換裝置8及超濾膜9向使用點10供給常溫的超純水W1，未使用的超純水W1回流至子罐2中。另一個方向是能夠經由非再生式的離子交換裝置12、預熱回收熱交換器13、加熱用的熱交換器14、超濾膜15向使用點16供給溫超純水W2，未使用的溫超純水W2自返回配管17經由預熱回收熱交換器13回流至子罐2中。根據此種超純水製造系統，可削減二次純水裝置中的動力成本，並減少伴隨被處理水的加熱/冷卻的能量使用量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:子系統(二次純水裝置)(二次純水製造裝置)</p>
        <p type="p">2:子罐</p>
        <p type="p">3:供給配管</p>
        <p type="p">4:泵</p>
        <p type="p">5:膜式脫氣裝置(水處理單元)</p>
        <p type="p">6:紫外線氧化裝置(水處理單元)</p>
        <p type="p">7:冷卻用的熱交換器</p>
        <p type="p">8:非再生式的離子交換裝置(熱交換機構)</p>
        <p type="p">9、15:超濾膜(UF膜)</p>
        <p type="p">10、16:使用點</p>
        <p type="p">11:溫超純水配管</p>
        <p type="p">12:非再生式的離子交換裝置(加熱用熱交換器)</p>
        <p type="p">13:預熱回收熱交換器</p>
        <p type="p">14:加熱用的熱交換器(熱交換機構)</p>
        <p type="p">17:返回配管</p>
        <p type="p">W:一次純水</p>
        <p type="p">W0:處理原水</p>
        <p type="p">W1:超純水</p>
        <p type="p">W2:溫超純水</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1853" publication-number="202625766">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625766</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142765</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於基板支撐件製造及/或修復之測試基板</chinese-title>
        <english-title>TEST SUBSTRATE FOR USE IN SUBSTRATE SUPPORT MANUFACTURING AND/OR RECONDITIONING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260311B">H10P72/76</main-classification>
        <further-classification edition="202601120260311B">H10P74/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利維　基恩　邁克爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEVY, KEANE MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德索薩　塞羅迪奧　保羅　圖森　邱　二世</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DESOUSA SERODIO, PAULO TUCYEN CHIU, JR.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種測試基板。該測試基板包括：一基板；及複數個突出物，其形成於該基板之主表面中之一者上。提供判定一微影設備之一基板夾具的一基板支撐件之主體的狀況之一方法。該方法包括：獲得一基板支撐件之一主體，其中該主體用於在其上形成突出物以藉此形成該基板支撐件；將一測試基板夾持至該主體；及當該測試基板經夾持至該主體時，量測該測試基板之一屬性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A test substrate is provided. The test substrate includes a substrate, and a plurality of projections formed on one of the major surfaces of the substrate. A method of determining the condition of the main body of a substrate support of a substrate clamp of a lithographic apparatus is provided. The method includes obtaining a main body of a substrate support, wherein the main body is for forming projections on to thereby form the substrate support; clamping a test substrate to the main body; and measuring a property of the test substrate when clamped to the main body.</p>
      </isu-abst>
      <representative-img>
        <p type="p">21:主體</p>
        <p type="p">301:電極</p>
        <p type="p">302:裂紋</p>
        <p type="p">400:測試基板</p>
        <p type="p">401:基板</p>
        <p type="p">402:突出物</p>
        <p type="p">501:電極</p>
        <p type="p">502:電源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1854" publication-number="202624356">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624356</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142790</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚矽氧組成物及固化物</chinese-title>
        <english-title>SILICONE COMPOSITION AND CURED PRODUCT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">C08G77/12</main-classification>
        <further-classification edition="200601120260313B">C08G77/26</further-classification>
        <further-classification edition="201801120260313B">C09J7/28</further-classification>
        <further-classification edition="201801120260313B">C09J7/24</further-classification>
        <further-classification edition="200601120260313B">C08F4/26</further-classification>
        <further-classification edition="201801120260313B">C08K3/011</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商陶氏東麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOW TORAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福井弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUI, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘　松泰安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PHAN, SON THANH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岸本典久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KISHIMOTO, NORIHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種聚矽氧組成物、及將該聚矽氧組成物固化而得之固化物。本揭露之聚矽氧組成物包含(A)每一分子中具有兩個以上之烯基之有機聚矽氧烷、(B)具有氰烷基與直接鍵合於矽原子之氫原子且具有規定化學構造之有機氫聚矽氧烷、及(C)熱固化催化劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1855" publication-number="202624844">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624844</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142832</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於眼部症狀之管理及／或減少夜間視覺障礙的眼科裝置、系統及／或方法</chinese-title>
        <english-title>OPHTHALMIC DEVICES, SYSTEMS AND/OR METHODS FOR MANAGEMENT OF OCULAR CONDITIONS AND/OR REDUCING NIGHT VISION DISTURBANCES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">G02C7/02</main-classification>
        <further-classification edition="200601120260311B">G02C7/04</further-classification>
        <further-classification edition="200601120260311B">A61F2/14</further-classification>
        <further-classification edition="200601120260311B">A61F2/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布萊恩荷登視覺協會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRIEN HOLDEN VISION INSTITUTE LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾斯范迪阿瑞佳赫洛米　哈珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ESFANDIARIJAHROMI, HASSAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝克　亞瑟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BACK, ARTHUR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種經構形以矯正及/或治療眼睛之至少一個症狀(例如老花眼、近視、遠視、散光、雙眼視覺障礙及/或視覺疲勞綜合症)之眼科透鏡，其包括：中心光學區；周邊光學區；基本屈光度分佈；及至少一個特徵，其經選擇以修改該基本屈光度分佈且使一或多個離軸焦點形成於視網膜影像平面前面、上及/或後面且降低一或多個影像平面處之焦點能階；其中該至少一個特徵可位於該中心光學區及該周邊光學區之至少一者之前表面及/或後表面上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An ophthalmic lens configured to correct and/or treat at least one condition of the eye (e.g., presbyopia, myopia, hyperopia, astigmatism, binocular vision disorders and/or visual fatigue syndrome) comprising: a central optical zone; a peripheral optical zone; a base power profile; and at least one feature selected to modify the base power profile and to form one or more off-axis focal points in front of, on, and/or behind a retinal image plane and reduce a focal point energy level at one or more image planes; wherein the at least one feature may be located on a front surface and/or a back surface of at least one of the central optical zone and the peripheral optical zone.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基本屈光度分佈</p>
        <p type="p">101:前表面</p>
        <p type="p">101a至101e:線曲率</p>
        <p type="p">102:後表面</p>
        <p type="p">103:中心區</p>
        <p type="p">104:周邊區</p>
        <p type="p">104a至104r:窄環形同心光學區</p>
        <p type="p">105:周邊區</p>
        <p type="p">106:表面曲率</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1856" publication-number="202625454">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625454</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142856</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鉗位控制電路及包括其的影像感測裝置</chinese-title>
        <english-title>CLAMP CONTROL CIRCUIT AND IMAGE SENSING DEVICE INCLUDING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251201B">H04N25/59</main-classification>
        <further-classification edition="202301120251201B">H04N25/772</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商愛思開海力士有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK HYNIX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金東柱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DONG JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴多煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, DA HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔禎益</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, JEONG IK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露關於鉗位控制電路及包括其的影像感測裝置。揭露了一種用於產生影像資料的影像感測裝置。該影像感測裝置中包括的鉗位控制電路包括：感測電路，其被配置為感測像素訊號的電壓位準以輸出感測訊號；以及鉗位電路，其耦接至行線，並被配置為回應於感測訊號的電壓位準來控制鉗位電壓控制訊號的電壓位準，以及回應於鉗位致能訊號來控制鉗位電壓的位準，其中，鉗位電壓是基於鉗位電壓控制訊號的電壓位準來控制並提供給行線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a clamp control circuit and an image sensing device including the same. An image sensing device for generating image data is disclosed. A clamp control circuit included in the image sensing device includes a sensing circuit configured to sense a voltage level of a pixel signal to output a sensing signal; and a clamping circuit coupled to a column line, and configured to control a voltage level of a clamp voltage control signal in response to a voltage level of the sensing signal, and control a level of a clamp voltage in response to a clamp enable signal, the clamp voltage controlled based on a voltage level of the clamp voltage control signal and provided to the column line.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:影像感測裝置</p>
        <p type="p">100:鉗位控制電路</p>
        <p type="p">200:斜坡產生器</p>
        <p type="p">300:類比至數位轉換器(ADC)</p>
        <p type="p">400:時序控制器</p>
        <p type="p">ADC_OUT:ADC資料</p>
        <p type="p">AZ:自動歸零訊號</p>
        <p type="p">C_EN:鉗位致能訊號</p>
        <p type="p">CL:行線</p>
        <p type="p">CLP:鉗位電壓</p>
        <p type="p">CNT_EN:計數器致能訊號</p>
        <p type="p">CON:控制訊號</p>
        <p type="p">PA:像素陣列</p>
        <p type="p">PX:像素</p>
        <p type="p">RCON:控制訊號</p>
        <p type="p">S_AZ:感測自動歸零訊號</p>
        <p type="p">S_EN:感測致能訊號</p>
        <p type="p">VB:偏置電壓</p>
        <p type="p">VRAMP:斜坡訊號</p>
        <p type="p">VPX:像素訊號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1857" publication-number="202625505">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625505</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142905</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電漿單元、電漿處理裝置、捕集裝置及電漿產生裝置</chinese-title>
        <english-title>PLASMA UNIT, PLASMA PROCESSING DEVICE, TRAP DEVICE, AND PLASMA GENERATING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">H05H1/24</main-classification>
        <further-classification edition="200601120251201B">H05H1/34</further-classification>
        <further-classification edition="200601120251201B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商堀場ＳＴＥＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORIBA STEC, CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邊義雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, YOSHIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種遠端電漿單元100，其使電漿單元中的自由基的生成量提高，且將氣體電漿化並導出，包括：塊體2，於內部形成有流路2S，於外表面形成有朝向互不相同的方向的多個搭載面2x；及電漿產生器3，搭載於多個搭載面2x的至少一個。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is a remote plasma unit 100 that improves the amount of radicals generated in a plasma unit, and converts gas into plasma and discharges the same. The remote plasma unit 100 includes a block body 2 having a flow path 2S formed therein and having multiple mounting surfaces 2x formed on an outer surface that face in different directions, and a plasma generator 3 mounted on at least one of the mounting surfaces 2x.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:塊體</p>
        <p type="p">2a:其中一面</p>
        <p type="p">2b:另一面</p>
        <p type="p">2S:流路</p>
        <p type="p">2x:搭載面</p>
        <p type="p">3:電漿產生器</p>
        <p type="p">21:連通部</p>
        <p type="p">32:波導管</p>
        <p type="p">33:天線</p>
        <p type="p">35:附件構件</p>
        <p type="p">100:電漿單元</p>
        <p type="p">331:天線主體</p>
        <p type="p">331a:內管</p>
        <p type="p">331b:外管</p>
        <p type="p">332:介電體構件</p>
        <p type="p">H1:氣體導入口</p>
        <p type="p">H2:氣體導出口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1858" publication-number="202625836">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625836</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142922</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於較厚核心基材之較細通孔節距</chinese-title>
        <english-title>FINER VIA PITCH FOR THICKER CORE SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260316B">H10W70/63</main-classification>
        <further-classification edition="202601120260316B">H10W70/652</further-classification>
        <further-classification edition="202601120260316B">H10W70/685</further-classification>
        <further-classification edition="200601120260316B">H05K3/42</further-classification>
        <further-classification edition="200601120260316B">H05K3/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>延在炫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEON, JAEHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴呂一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, YEOIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙賢哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, HYUNCHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　米雪兒　藝珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MICHELLE YEJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方　坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示半導體封裝。一種半導體封裝可包括一核心基材及位於該核心基材內的一或多個通孔。該核心基材可包括一基底核心及一上核心。該核心基材亦可包括一基底核心。該基底核心可相對地薄，使得可使用雷射鑽孔，並以導電材料來填充。如此一來，可達成緊密尺寸，例如小的通孔寬度、小的通孔墊寬度、及/或緊密的通孔節距。另外，藉由使用上核心及/或下核心來補強基底核心，可達成整體厚的核心，以增強機械穩定性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are semiconductor packages. A semiconductor package may include a core substrate and one or more vias within the core substrate. The core substrate may include a base core and an upper core. The core substrate may also include a base core. The base core may be relatively thin so that laser drilling may be used and filled with conductive material. In this way, tight dimensions – e.g., small via width, small via pad width, and/or tight via pitches – may be achieved. Also by supplementing the base core with the upper and/or lower cores, an overall thick core may be achieved to enhance mechanical stability.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:習知半導體封裝</p>
        <p type="p">210:核心基材</p>
        <p type="p">212:基底核心</p>
        <p type="p">214:上核心</p>
        <p type="p">216:下核心</p>
        <p type="p">230:通孔</p>
        <p type="p">232:基底通孔</p>
        <p type="p">234:上通孔</p>
        <p type="p">236:下通孔</p>
        <p type="p">244:上墊</p>
        <p type="p">246:下墊</p>
        <p type="p">A:墊寬度</p>
        <p type="p">B:通孔寬度</p>
        <p type="p">C:通孔節距</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1859" publication-number="202623843">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623843</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142955</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於輔助管理傷口敷料的使用狀況的負壓傷口治療系統</chinese-title>
        <english-title>NEGATIVE PRESSURE WOUND THERAPY SYSTEM FOR ASSISTING IN MANAGING THE USE OF WOUND DRESSINGS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61M1/00</main-classification>
        <further-classification edition="202401120260102B">A61F13/05</further-classification>
        <further-classification edition="201801120260102B">G16H40/60</further-classification>
        <further-classification edition="201801120260102B">G16H20/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富強醫材股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FORTUNE MEDICAL INSTRUMENT CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王泰力</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TAI-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐偉強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, WEI-CHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯佳玟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, CHIA-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於輔助管理傷口敷料的使用狀況的負壓傷口治療系統，包括傷口敷料、儲存媒體、導管、收集裝置、負壓源、監測裝置及管體。傷口敷料用以配置於傷口。儲存媒體設置於傷口敷料上並用以儲存傷口敷料資訊。導管連接於傷口敷料。收集裝置連接於導管。監測裝置通訊連接儲存媒體。管體延伸通過監測裝置，管體連接收集裝置和負壓源。監測裝置接收傷口敷料資訊，監測裝置根據傷口敷料資訊判定傷口敷料是否已經執行過治療，若是，則監測裝置顯示傷口敷料重複使用，若否，則監測裝置顯示傷口敷料首次使用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A negative pressure wound therapy system for assisting in managing the use of wound dressing includes a wound dressing, a storage medium, a catheter, a collection device, a vacuum pump, a monitoring device, and a tubing. The wound dressing is applied to a wound. The storage medium is disposed on the wound dressing and stores wound dressing information. The catheter is connected to the wound dressing. The collection device is connected to the catheter. The monitoring device is communicatively connected to the storage medium. The tubing extends through the monitoring device and connects the collection device and the vacuum pump. The monitoring device receives the wound dressing information and, based on the wound dressing information, determines whether the wound dressing has been used for treatment. If so, the monitoring device indicates that the wound dressing has been reused; otherwise, the monitoring device indicates that the wound dressing has been used for the first time.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:傷口敷料</p>
        <p type="p">11:泡棉敷料</p>
        <p type="p">12:膠膜</p>
        <p type="p">13:吸盤</p>
        <p type="p">20:儲存媒體</p>
        <p type="p">30:導管</p>
        <p type="p">31,32:管路</p>
        <p type="p">40:收集裝置</p>
        <p type="p">50:負壓源</p>
        <p type="p">60:監測裝置</p>
        <p type="p">70:管體</p>
        <p type="p">80:位置感測器</p>
        <p type="p">90:傷口環境感測器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1860" publication-number="202625202">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625202</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142977</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>排泄管理系統及程式</chinese-title>
        <english-title>EXCRETION CONTROL SYSTEM AND PROGRAM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120251201B">G16H10/60</main-classification>
        <further-classification edition="201801120251201B">G16H40/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下住空間股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC HOUSING SOLUTIONS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋達也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河合雅弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAI, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邉優</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荻野弘之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGINO, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>越智和弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OCHI, KAZUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種排泄管理系統及程式。本發明之排泄管理系統1，具備：就座資訊取得部22，取得包含管理對象者的往馬桶座5之就座時間的就座資訊；排便資訊取得部23，取得包含管理對象者的排便時間、排便量、排便次數及排便性狀中之至少一者的排便資訊；以及顯示資訊產生部24，依據該就座資訊及該排便資訊，產生使在每段既定時間之該就座資訊及該排便資訊顯示在顯示部34的排泄狀態經時資訊。  &lt;br/&gt;&lt;u&gt; &lt;/u&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An excretion management system 1 includes a seated information acquisition unit 22 that acquires seated information including the seated time of a target person on a toilet seat 5, a defecation information acquisition unit 23 that acquires defecation information including at least one of defecation time, defecation volume, number of defecations, and feces properties of the target person, and a display information generation unit 24 that generates information with time of defecation condition to display the seated information and the defecation information on a display portion 34 every predetermined time based on the seated information and the defecation information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:排泄管理系統</p>
        <p type="p">2:馬桶裝置</p>
        <p type="p">7:就座檢測部</p>
        <p type="p">10:排泄檢測部</p>
        <p type="p">11:照明部</p>
        <p type="p">12:拍攝部</p>
        <p type="p">15:控制單元</p>
        <p type="p">16:控制部</p>
        <p type="p">17:記憶部</p>
        <p type="p">18:通訊部</p>
        <p type="p">20:伺服器</p>
        <p type="p">21:控制部</p>
        <p type="p">22:就座資訊取得部</p>
        <p type="p">23:排泄資訊取得部(排便資訊取得部、排尿資訊取得部)</p>
        <p type="p">24:顯示資訊產生部</p>
        <p type="p">25:記憶部</p>
        <p type="p">26:通訊部</p>
        <p type="p">30:照護者終端機</p>
        <p type="p">31:控制部</p>
        <p type="p">32:記憶部</p>
        <p type="p">33:通訊部</p>
        <p type="p">34:顯示操作部(顯示部)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1861" publication-number="202625478">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625478</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143066</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於在無線區域網路系統中多存取點協作的協商的方法和裝置</chinese-title>
        <english-title>METHOD AND APPARATUS OF NEGOTIATION FOR MULTI-ACCESS POINT COORDINATION IN WIRELESS LAN SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260315B">H04W28/18</main-classification>
        <further-classification edition="200901120260315B">H04W92/20</further-classification>
        <further-classification edition="202301120260315B">H04W72/04</further-classification>
        <further-classification edition="200901120260315B">H04W88/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG ELECTRONICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白善熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAEK, SUNHEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔鎭洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, JINSOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李弘源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HONGWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仁善</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, INSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金虔煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, GEONHWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹藝隣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, YELIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>車東柱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHA, DONGJU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露用於在無線區域網路系統中多存取點協作的協商方法和裝置。根據本發明一實施例的方法可以包括：由第一存取點（access point，AP）從第二AP接收用於多AP協作的協商請求訊框；以及由第一AP向第二AP傳送用於多AP協作的協商回應訊框。該協商請求訊框可以包含至少一個請求資訊，其包含至少一個請求參數集。該協商回應訊框可以包含單一第一資訊，其對包含在協商回應訊框中的至少一個請求資訊的每一個表示接受、拒絕或替代。該單一第一資訊可以與特定的目標喚醒時間（target wake time，TWT）排程相關聯。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A negotiation method and apparatus for multi-access point coordination in a WLAN system are disclosed. A method according to an embodiment of the present disclosure may include receiving, by a first access point (AP) from a second AP, a negotiation request frame for multi-AP coordination; and transmitting, by the first AP to the second AP, a negotiation response frame for the multi-AP coordination. The negotiation request frame may include at least one request information including at least one request parameter set. The negotiation response frame may include single first information representing accept, reject, or alternate for each of the at least one request information included in the negotiation request frame. The single first information may be associated with a specific target wake time (TWT) schedule.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1510:步驟</p>
        <p type="p">S1520:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1862" publication-number="202624999">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624999</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143077</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>管路圖設計支援方法、管路圖設計支援裝置及管路圖設計支援程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260315B">G06F30/18</main-classification>
        <further-classification edition="202001120260315B">G06F30/20</further-classification>
        <further-classification edition="201101120260315B">G06T19/00</further-classification>
        <further-classification edition="202001320260315B">G06F113/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商久保田股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUBOTA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東脇正明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOWAKI, MASAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林光夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHI, MITSUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>下池昌廣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMOIKE, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>花植康一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANAUE, KOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種即使是經驗較淺的設計人員也可進行適當的繞道路徑的設計的管路圖設計支援方法。&lt;br/&gt;  [解決手段]一種管路圖設計支援方法，是用於使用電腦來設計以複數個管所構成之三維管路圖，前述管路圖設計支援方法具有以下步驟：三維管線圖取得步驟，取得三維管線圖；障礙物資訊輸入步驟，輸入包含已埋設於地下之障礙物的位置之障礙物資訊；干涉判定步驟，判定障礙物資訊與三維管線圖的干涉的有無；必要隔離區域算出步驟，在已藉由干涉判定步驟判斷為有干涉之情況下，算出對於障礙物之必要隔離區域；迴避圖案提示步驟，生成已確保必要隔離區域之管路的迴避圖案並提示給操作人員；及管線圖更新步驟，根據和由操作人員從迴避圖案選擇出之迴避圖案對應之管路來更新管線圖。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1863" publication-number="202623755">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623755</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143104</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔設備控制方法、裝置、程式產品、存儲介質及清潔設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">A47L11/40</main-classification>
        <further-classification edition="200601120260312B">A47L11/24</further-classification>
        <further-classification edition="200601120260312B">A47L11/283</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>單建強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種清潔設備控制方法、裝置、程式產品、存儲介質及清潔設備，所述清潔設備包括機械臂，所述機械臂遠離所述清潔設備底盤的一端用於夾持清潔件，所述方法包括：確定所述清潔設備或者其基站上待清潔器件的第一空間位置；根據所述第一空間位置，調節所述機械臂夾持的清潔件的位姿，以透過所述清潔件對所述待清潔器件進行清潔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">210:步驟</p>
        <p type="p">220:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1864" publication-number="202623947">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623947</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143118</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>玻璃板的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">B24B7/16</main-classification>
        <further-classification edition="200601120260309B">C03C19/00</further-classification>
        <further-classification edition="200601120260309B">B24D7/14</further-classification>
        <further-classification edition="200601120260309B">B24B9/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本電氣硝子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON ELECTRIC GLASS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小森悠紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMORI, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>星野愛信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSHINO, YOSHINOBU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松永大生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUNAGA, HIROO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>粟津晃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AWAZU, AKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">玻璃板的製造方法包括：粗研磨步驟S2，利用砂輪3對玻璃板G的端面Ga進行加工；以及精研磨步驟S3，在粗研磨步驟S2之後，利用砂輪4對玻璃板G的端面Ga進行加工。在粗研磨步驟S2中，利用混合了粒度號不同的磨粒的混合磨粒砂輪，對玻璃板G的端面Ga進行加工。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:磨削步驟</p>
        <p type="p">S2:第一研磨步驟(粗研磨步驟)</p>
        <p type="p">S3:第二研磨步驟(精研磨步驟)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1865" publication-number="202624979">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624979</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143153</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含多個晶片的系統單晶片及其操作方法</chinese-title>
        <english-title>SYSTEM-ON-CHIP INCLUDING A PLURALITY OF CHIPS AND METHOD OF OPERATING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">G06F15/78</main-classification>
        <further-classification edition="200601120260305B">G06F13/10</further-classification>
        <further-classification edition="202201120260305B">H04L49/109</further-classification>
        <further-classification edition="200601120260305B">G06F12/06</further-classification>
        <further-classification edition="202201120260305B">H04L45/74</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐永得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, YOUNGDUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴成哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SUNGCHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張俊榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JOONYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔根豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, GEUNHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">系統單晶片包括彼此連接的多個晶片。在多個晶片中，第一晶片可包括多個第一介面，分別設置於第一晶片的邊緣上、配置以執行第一程式的第一中央處理單元、以及配置以回應從第一中央處理單元接收到對應於第一程式的第一請求而將第一位址代碼傳輸到對應於儲存為對應於第一程式的第一位址代碼的第一數量的第一介面位元的第1-1介面的第一互連。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system-on-chip (SoC) includes a plurality of chips connected to each other. Among the plurality of chips, a first chip may include a plurality of first interfaces, respectively disposed on edges of the first chip, a first central processing unit (CPU) configured to execute a first program, and a first interconnect configured to transmit a first address code to a (1-1)-th interface corresponding to a first number of first interface bits of the first address code stored to correspond to the first program in response to a first request corresponding to the first program being received from the first CPU.</p>
      </isu-abst>
      <representative-img>
        <p type="p">121:第一晶片/晶片</p>
        <p type="p">122:第二晶片</p>
        <p type="p">123:第三晶片</p>
        <p type="p">124:第四晶片</p>
        <p type="p">ADDC1:第一位址代碼</p>
        <p type="p">CPU1:第一中央處理單元/第一CPU</p>
        <p type="p">CPU2:第二CPU</p>
        <p type="p">CPU3:第三CPU</p>
        <p type="p">CPU4:第四CPU</p>
        <p type="p">IC1:第一互連</p>
        <p type="p">IC2:第二互連</p>
        <p type="p">IC3:第三互連</p>
        <p type="p">IC4:第四互連</p>
        <p type="p">IT11:介面/第一介面/第1-1介面</p>
        <p type="p">IT12:第1-2介面</p>
        <p type="p">IT13:第(1-3)介面</p>
        <p type="p">IT14:第一介面/第1-4介面</p>
        <p type="p">IT21:第二介面/第2-1介面</p>
        <p type="p">IT22:第2-2介面</p>
        <p type="p">IT23:第2-3介面</p>
        <p type="p">IT24:第二介面/第2-4介面</p>
        <p type="p">IT31:第三介面/第3-1介面</p>
        <p type="p">IT34:操作第3-4介面</p>
        <p type="p">IT41:第四介面/第4-1介面</p>
        <p type="p">IT44:第四介面/第4-4介面</p>
        <p type="p">M1:第一記憶體</p>
        <p type="p">M2:第二記憶體</p>
        <p type="p">M3:第三記憶體</p>
        <p type="p">M4:第四記憶體</p>
        <p type="p">R1:第一請求</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1866" publication-number="202624396">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624396</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143249</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚甲醛樹脂組合物及由其製得的成型製品</chinese-title>
        <english-title>POLYOXYMETHYLENE RESIN COMPOSITION AND MOLDED ARTICLE PREPARED THEREFROM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">C08L59/04</main-classification>
        <further-classification edition="200601120260306B">C08K5/24</further-classification>
        <further-classification edition="200601120260306B">C08L61/24</further-classification>
        <further-classification edition="200601120260306B">C09B1/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商可隆賦能新材料有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOLON ENP, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭進亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, JINHYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">實施方式提供聚甲醛樹脂組合物，包括聚甲醛樹脂、二醯肼化合物、以及脲化合物，其中二醯肼化合物和脲化合物的重量比為1：3到1：5。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An embodiment provides a polyoxymethylene resin composition including a polyoxymethylene resin, a dihydrazide compound, and a urea compound, wherein a weight ratio of the dihydrazide compound and the urea compound is 1:3 to 1:5.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1867" publication-number="202624020">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624020</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143254</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>改進了範本分離的印刷操作</chinese-title>
        <english-title>PRINTING OPERATION WITH IMPROVED STENCIL SEPARATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260223B">B41F15/08</main-classification>
        <further-classification edition="200601120260223B">B41F15/18</further-classification>
        <further-classification edition="200601120260223B">B41M1/12</further-classification>
        <further-classification edition="200601120260223B">H05K3/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商先進裝配系統新加坡有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASMPT SMT SINGAPORE PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法爾康　湯姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FALCON, TOM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱昱宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在印刷操作後，通過有選擇地垂直驅動圍板來控制印刷絲網或範本與至少一個單一工件之間的分離。特別地，可以在印刷後、分離前和/或分離過程中向圍板施加向上的力。還設置有驅動裝置來控制圍板的移動，該驅動裝置可以便利地安置在該圍板和傳送單元之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Separation between a printing screen or stencil and at least one singulated workpiece following a printing operation is controlled by selective vertical actuation of a surround plate. In particular, an upward force may be supplied to the surround plate following printing, before and / or during separation. Drive means are provided to control movement of the surround plate, which may conveniently be located intermediate the surround plate and a conveyance unit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:工具台</p>
        <p type="p">2:工具塔</p>
        <p type="p">4:抵接構件</p>
        <p type="p">5:傳送單元</p>
        <p type="p">6:硬擋塊</p>
        <p type="p">7:圍板</p>
        <p type="p">9:印刷絲網</p>
        <p type="p">10:印刷頭</p>
        <p type="p">11:刮板</p>
        <p type="p">12:載體</p>
        <p type="p">14:工具底座</p>
        <p type="p">15:驅動裝置</p>
        <p type="p">W:工件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1868" publication-number="202625026">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625026</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143291</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用以對樣品的電磁場進行成像及量測的量子裝置及方法</chinese-title>
        <english-title>QUANTUM DEVICE AND METHODS FOR IMAGING OR MEASURING AN ELECTROMAGNETIC FIELD FROM A SAMPLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260315B">G06N10/40</main-classification>
        <further-classification edition="200601120260315B">G01R33/26</further-classification>
        <further-classification edition="200601120260315B">G01R33/60</further-classification>
        <further-classification edition="200601120260315B">G01R33/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商量子鑽石有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUANTUMDIAMONDS GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>漢克　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANKE, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種用以對樣品(12)的電磁場進行成像及/或量測的量子裝置，其中控制器(24)被配置來控制微波源(20)以用於在第一能階與該微波輻射共振之第一參數範圍及第二能階與該微波輻射共振之一第二參數範圍中改變複數個參數中之至少一個參數，針對每一像素記錄從該光學感測器(32)接收之針對該參數在該第一參數範圍中及在該第二參數範圍中之複數次改變的電子信號，藉由對第一參數範圍內產生之該等電子信號與第二參數範圍內產生之該等電子信號進行互相關，來針對每一像素確定該等電子信號中之變化，及基於互相關來計算樣品(12)的電磁場。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention refers to a quantum device for imaging and/or measuring an electromagnetic field from a sample (12), wherein a controller (24) is configured to control the microwave source (20) for varying at least one parameter of the plurality of parameters in a first parameter range in which the first energy level resonates with the microwave radiation and a second parameter range in which the second energy level resonates with the microwave radiation, record – for each pixel – the electronic signals received from the optical sensor (32) for a plurality of variations of the parameter in the first parameter range and the second parameter range, determine – for each pixel – changes in the electronic signals by cross-correlating the electronic signals generated over first parameter range with the electronic signals generated over second parameter range, and calculate the electromagnetic field of the sample (12) based on the cross-correlation.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1869" publication-number="202625187">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625187</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143355</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＲＲＡＭ儲存陣列及架構</chinese-title>
        <english-title>RRAM MEMORY ARRAY AND ARCHITECTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251127B">G11C13/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商廈門半導體工業技術研發有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIAMEN INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, WEN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘天龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, TIANLONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉美冬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, MEIDONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹家宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIN, JIAYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昱煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YUHUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白麗霞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAI, LIXIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭喆鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, ZHEXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃柏璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及隨機存取存儲器技術領域，公開了一種RRAM儲存陣列及架構，RRAM儲存陣列包括基本儲存單元，若干個基本儲存單元呈二維矩陣排列；BL位元線，BL位元線分別配置在二維矩陣的每一行中，二維矩陣的每一行的基本儲存單元對應與BL位線電性連接；WL字線，WL字線配置在二維矩陣的每一列中，二維矩陣的每一列的基本儲存單元對應與WL字線電性連接；LSL局部源線，LSL局部源線分別配置在二維矩陣的每一列中，二維矩陣的每一列的基本儲存單元對應與LSL局部源線電性連接；二維矩陣設置有若干個分組隔斷區，每一分組隔斷區內對應配置有一SL共用源線，SL共用源線平行於BL位線且依次連接分組隔斷區內的LSL局部源線。本發明可以提高RRAM器件的整體性能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention relates to the field of random access memory technology and discloses an RRAM memory array and architecture, the array includes: basic memory cells, with a plurality of basic memory cells arranged in a two-dimensional matrix; Bit Lines (BLs), where BLs are respectively disposed in each row of the two-dimensional matrix, and the basic memory cells in each row are correspondingly electrically connected to the BL; Word Lines (WLs), where WLs are disposed in each column of the two-dimensional matrix, and the basic memory cells in each column are correspondingly electrically connected to the WL; Local Source Lines (LSLs) , where LSLs are respectively disposed in each column of the two-dimensional matrix, and the basic memory cells in each column are correspondingly electrically connected to the LSLs. The two-dimensional matrix is provided with a plurality of group partition regions, with each group partition region correspondingly configured with a shared source line (SL). The SL is parallel to BLs and sequentially connect the LSLs within the respective group partition region. This invention can enhance the overall performance of RRAM device</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基本儲存單元</p>
        <p type="p">20:BL位線</p>
        <p type="p">30:WL字線</p>
        <p type="p">40:LSL局部源線</p>
        <p type="p">50:分組隔斷區</p>
        <p type="p">60:SL共用源線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1870" publication-number="202624119">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624119</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143432</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於製造及分類半導體材料的棒的方法</chinese-title>
        <english-title>METHOD FOR PRODUCING AND CLASSIFYING RODS OF SEMICONDUCTOR MATERIAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260221B">C01B33/035</main-classification>
        <further-classification edition="200601120260221B">C23C16/24</further-classification>
        <further-classification edition="200601120260221B">G01N21/88</further-classification>
        <further-classification edition="200601120260221B">G01B11/10</further-classification>
        <further-classification edition="201901120260221B">G06N20/00</further-classification>
        <further-classification edition="200601120260221B">B07C5/342</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商瓦克化學公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WACKER CHEMIE AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文賽斯　馬庫斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENZEIS, MARKUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿克曼　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACKERMANN, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菲拉　皮歐特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FILAR, PIOTR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索馬奧爾　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOMMERAUER, STEFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳翠華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種用於製造及分類半導體材料的棒的方法，其包含：&lt;br/&gt;  將除了氫氣之外更包含至少一種半導體組分的反應氣體引入到由反應器殼體和基板界定的氣相沉積反應器的反應室中，其中該反應室包含至少一個經加熱的載體主體，該載體主體被固定至該基板並且該半導體材料沉積在該載體主體上以形成棒，&lt;br/&gt;  藉由從該基板垂直升高該反應器殼體以開啟該氣相沉積反應器，其中在該升高期間及／或在該升高之後的該反應器殼體的下降期間，藉由附接到該反應器殼體的下邊緣的至少一個測量裝置生成該棒的二維及／或三維圖像，&lt;br/&gt;  視情況地從所獲得的該二維或三維圖像生成整體圖像，&lt;br/&gt;  分析該二維或三維圖像或該整體圖像，並確定至少一個分類參數，其中根據該分類參數將該棒供應至進一步的處理步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a method for producing and classifying rods of semiconductor material, comprising:&lt;br/&gt; introducing a reaction gas comprising, in addition to hydrogen, at least one semiconductor component into a reaction chamber of a vapor deposition reactor delimited by a reactor shell and a base plate, wherein the reaction chamber comprises at least one heated carrier body which is fastened to the base plate and on which the semiconductor material is deposited to form a rod,&lt;br/&gt; opening the vapor deposition reactor by vertically raising the reactor shell from the base plate, wherein two-dimensional and/or three-dimensional images of the rod are generated by at least one measuring device attached to a lower edge of the reactor shell during the raising and/or during a lowering of the reactor shell following the raising, &lt;br/&gt; optionally generating an overall image from the obtained two-dimensional or three-dimensional images,&lt;br/&gt; analyzing the two-dimensional or three-dimensional images or the overall image and determining at least one classification parameter, wherein the rod is supplied to a further processing step depending on the classification parameter.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:氣相沉積反應器</p>
        <p type="p">11:氣相沉積反應器的下部區域</p>
        <p type="p">12:反應器殼體</p>
        <p type="p">13:反應室</p>
        <p type="p">14:基板</p>
        <p type="p">15:冷卻回路</p>
        <p type="p">16:半導體棒</p>
        <p type="p">18:電極</p>
        <p type="p">19:孔</p>
        <p type="p">20:凸緣</p>
        <p type="p">30:測量裝置</p>
        <p type="p">32:外殼</p>
        <p type="p">33:具有距離感測器的銷</p>
        <p type="p">34:相機</p>
        <p type="p">35:光源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1871" publication-number="202625460">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625460</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143488</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於環境檢測的動態聲音輸出調整</chinese-title>
        <english-title>DYNAMIC SOUND OUTPUT ADJUSTMENT BASED ON ENVIRONMENTAL DETECTION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260315B">H04R29/00</main-classification>
        <further-classification edition="200601120260315B">H04S7/00</further-classification>
        <further-classification edition="200601120260315B">H04R3/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商六科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROKU, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許軒豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HSUAN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施翔耀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, HSIANG-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文公開了用於動態調整顯示裝置的多揚聲器配置的聲音輸出的系統、裝置、製品、方法和/或電腦程式產品實施例，和/或其組合及子組合。可以執行該調整以基於顯示裝置相對於物理環境內一個或更多個麥克風的物理位置來優化聲音輸出。示例性實施例藉由顯示裝置內的揚聲器發射校準聲波並接收與所述校準聲波相關聯的聲音資料來操作。所述聲音資料包括物理環境內校準聲波的特性。然後，顯示裝置可以基於聲音輸出特性來調整所述多揚聲器配置內的揚聲器的聲音輸出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are system, apparatus, article of manufacture, method and/or computer program product embodiments, and/or combinations and sub-combinations thereof, for dynamically adjusting sound output of a multi-speaker configuration of a display device. The adjustment may be performed to optimize the sound output based on the physical position of the display device in relation to one or more microphones within a physical environment. An example embodiment operates by the speakers within the display device emitting calibration sound waves and receiving sound data associated with the calibration sound waves. The sound data includes characteristics of the calibration sound waves within the physical environment. The display device may then adjust sound output of speakers within the multi-speaker configuration based on the sound output characteristics.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:方法</p>
        <p type="p">502~510:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1872" publication-number="202624096">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624096</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143571</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>支持裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">B65G1/14</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商豐田自動織機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KABUSHIKI KAISHA TOYOTA JIDOSHOKKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蛭川慎也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRUKAWA, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浅野正裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASANO, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之支持裝置包含：一對柱構件，其等沿高度方向延伸，且沿進深方向分開配置；安裝部，其無法移動地固定於柱構件；及一對支持構件，其經由安裝部而安裝於一對柱構件，支持物品；且一對支持構件各自具有：延伸部，其沿進深方向延伸，供載置物品；及臂部，其安裝於安裝部，且自一對支持構件之一者之延伸部向一對支持構件之另一者之延伸部沿橫向延伸，於前端部支持一對支持構件之另一者；臂部具有由平行於與高度方向正交之方向而配置之橫板及與高度方向平行地配置之縱板形成之L字形狀之剖面，縱板相對於橫板位於柱構件側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:支持裝置</p>
        <p type="p">3:柱部</p>
        <p type="p">4:安裝部</p>
        <p type="p">5:支持單元</p>
        <p type="p">7:緊固具</p>
        <p type="p">11,12:柱構件</p>
        <p type="p">11b,11c,12b:側面</p>
        <p type="p">21,22:安裝構件</p>
        <p type="p">21b,22b,32b,33b,42b,43b:橫板</p>
        <p type="p">30,40:支持構件</p>
        <p type="p">31,41:延伸部</p>
        <p type="p">31a,31b,41a,41b:端部</p>
        <p type="p">32,42:第1臂部(臂部)</p>
        <p type="p">32a,33a,42a,43a:縱板</p>
        <p type="p">32x,42x:基端部</p>
        <p type="p">32y,42y:前端部</p>
        <p type="p">33,43:第2臂部(臂部)</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1873" publication-number="202625038">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625038</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143645</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發送支援裝置</chinese-title>
        <english-title>SHIPPING SUPPORT DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260305B">G06Q10/087</main-classification>
        <further-classification edition="202401120260305B">G06Q10/083</further-classification>
        <further-classification edition="202401120260305B">G06Q10/08</further-classification>
        <further-classification edition="202301120260305B">G06Q30/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商Ｄ4Ａｌｌ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>D4ALL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西郷孝一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAIGO, TAKAHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池田雅人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEDA, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諸冨大樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOROTOMI, DAIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種發送支援裝置，使商品各自之發送時間點盡可能一致，減少折疊貨櫃數量、發送次數，並使折疊貨櫃載運量、配送車載運量最佳化，藉以追求商品發送流程之效率提升。  &lt;br/&gt;本發明之特徵在於具有：商品資訊儲存手段，對在店舖銷售之商品，各自儲存店舖庫存量與店舖銷售量的趨勢；發送閾值儲存手段，對商品，各自儲存與店舖庫存量相關之第1閾值、及較該第1閾值更大之第2閾值；庫存量預測手段，依據商品資訊儲存手段所儲存的資訊，對商品，各自算出既定期間後之店舖庫存量的預測值；第1候選抽出手段，將店舖庫存量低於第1閾值的商品抽出作為第1發送候選商品；第2候選抽出手段，將店舖庫存量的預測值低於第2閾值的商品抽出作為第2發送候選商品；以及發送手段，進行與第1發送候選商品及第2發送候選商品之發送相關的處理。&lt;u&gt;  &lt;/u&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">To reduce the number of folded boxes and the number of times of sending by arranging the sending timing of each commodity as much as possible, and to improve the efficiency of a commodity sending operation by optimizing the loading amount of the folded boxes and the loading amount of a delivery vehicle. &lt;br/&gt;The first candidate extraction unit extracts, as a first shipment candidate product, a product whose store inventory quantity is less than the first threshold value, the second candidate extraction unit extracts, as a second shipment candidate product, a product whose store inventory quantity is less than the second threshold value, and the shipment unit performs a process related to shipment of the first shipment candidate product and the second shipment candidate product.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:發送支援裝置</p>
        <p type="p">110:商品資訊儲存手段</p>
        <p type="p">120:發送閾值儲存手段</p>
        <p type="p">130:店內位置儲存手段</p>
        <p type="p">140:庫內位置儲存手段</p>
        <p type="p">150:庫存量預測手段</p>
        <p type="p">160:第1候選抽出手段</p>
        <p type="p">170:第2候選抽出手段</p>
        <p type="p">180:發送手段</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1874" publication-number="202624465">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624465</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143670</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>藉由使用至少一種加氫異構化催化劑之共製程中加氫處理將生物碳引入化石煤油燃料之方法</chinese-title>
        <english-title>PROCESS FOR INTRODUCING BIOGENIC CARBON INTO FOSSIL KEROSENE FUEL BY HYDROTREATMENT IN CO-PROCESSING USING AT LEAST ONE HYDROISOMERIZING CATALYST</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C10G3/00</main-classification>
        <further-classification edition="200601120260302B">C10G45/64</further-classification>
        <further-classification edition="200601120260302B">C10G65/04</further-classification>
        <further-classification edition="200601120260302B">C10L1/04</further-classification>
        <further-classification edition="200601120260302B">C10L1/18</further-classification>
        <further-classification edition="200601120260302B">C11C3/12</further-classification>
        <further-classification edition="200601120260302B">C11C3/14</further-classification>
        <further-classification edition="200601120260302B">B01J23/888</further-classification>
        <further-classification edition="200601120260302B">B01J27/19</further-classification>
        <further-classification edition="200601120260302B">B01J29/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商ＩＦＰ新能源公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IFP ENERGIES NOUVELLES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>道丹　安瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAUDIN, ANTOINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西蒙　勞倫特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIMON, LAURENT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅耶特　傑瑞米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAILLET, JEREMY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古乃任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述一種用於藉由共處理衍生自選自植物或動物來源之油及脂肪之可再生來源之原料、或在與化石原料之混合物中含有三酸甘油酯及/或游離脂肪酸及/或酯之此類原料之混合物來產生至少一種煤油餾分之方法，該方法包括在雙功能固定床加氫異構化催化劑之存在下加氫異構化該原料之至少一個步驟，該催化劑包含至少一種選自週期表之VIII族之金屬與至少一種選自VIB族之金屬之組合之硫化物相及包含至少一種選自IZM-2沸石及結構類型MTW之沸石的沸石(單獨或呈混合物)、及至少一種黏結劑之擔體，該加氫異構化步驟係在介於200℃與400℃之間之溫度下、在介於1 MPa與10 MPa之間之壓力下、在介於0.1 h&lt;sup&gt;-1&lt;/sup&gt;與10 h&lt;sup&gt;-1&lt;/sup&gt;之間之每小時空間速度下及在與原料混合使得氫氣/原料比在30與1500 Nm&lt;sup&gt;3&lt;/sup&gt;/m&lt;sup&gt;3&lt;/sup&gt;原料之間之總氫量之存在下進行，接著係分離該經加氫異構化之流出物以得到至少一種煤油餾分之步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention describes a process for production of at least one kerosene cut by co-treatment of a feedstock derived from a renewable source chosen from oils and fats of vegetable or animal origin, or mixtures of such feedstocks, containing triglycerides and/or free fatty acids and/or esters in a mixture with a fossil feedstock comprising at least one step of hydroisomerizing said feedstock in the presence of a bifunctional fixed bed hydroisomerization catalyst, said catalyst comprising a sulfide phase of at least one metal from group VIII in combination with at least one metal from group VIB of the Periodic Table and a support comprising at least one zeolite chosen from IZM-2 zeolites and zeolites of structure type MTW, alone or as a mixture, and at least one binder, said hydroisomerization step being carried out at a temperature of between 200°C and 400°C, at a pressure of between 1 MPa and 10 MPa, at an hourly space velocity of between 0.1 and 10 h&lt;sup&gt;-1&lt;/sup&gt; and in the presence of a total amount of hydrogen mixed with the feedstock such that the hydrogen/feedstock ratio is between 30 and 1500 Nm&lt;sup&gt;3&lt;/sup&gt;/m&lt;sup&gt;3&lt;/sup&gt; of feedstock, then a step of separating the hydroisomerized effluent to give at least one kerosene cut.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1875" publication-number="202624452">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624452</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143707</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱傳導性硬化型矽酮組合物及其硬化方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">C09K5/08</main-classification>
        <further-classification edition="200601120260309B">C09K5/12</further-classification>
        <further-classification edition="200601120260309B">C08G65/12</further-classification>
        <further-classification edition="200601120260309B">C08G77/44</further-classification>
        <further-classification edition="200601120260309B">C08L83/14</further-classification>
        <further-classification edition="201801120260309B">C08K3/105</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北沢啓太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAZAWA, KEITA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種即使為硬化型的散熱潤滑脂，也無須冷凍或冷藏保存及進行硬化時的加熱步驟之熱傳導性硬化型矽酮組合物及該組合物的硬化方法。  &lt;br/&gt;一種熱傳導性硬化型矽酮組合物，包含(A)有機聚矽氧烷，不具有烷氧矽基及矽烷醇基的任一者，於25℃的動黏度為60～100,000mm&lt;sup&gt;2&lt;/sup&gt;/s；(B)鎵或含鎵合金，熔點為-20～100℃；及(C)金屬烷氧化合物及/或其(部分)水解縮合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1876" publication-number="202625555">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625555</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143709</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體裝置和製造記憶體裝置的方法</chinese-title>
        <english-title>MEMORY DEVICE AND METHOD OF MANUFACTURING MEMORY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260202B">H10B41/20</main-classification>
        <further-classification edition="202301120260202B">H10B41/30</further-classification>
        <further-classification edition="200601120260202B">G11C16/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商愛思開海力士有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK HYNIX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓允哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, YUN CHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廉惠仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEOM, HYE IN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南相赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAM, SANG HYUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭淵午</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, YUN OH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體裝置包括：接觸件；以及多個支撐結構，所述多個支撐結構設置在所述接觸件周圍，其中，所述支撐結構中的每一個利用多個重疊孔形成。所述支撐結構包括設置在所述重疊孔內的絕緣層。所述支撐結構通過擴展多個第一開口並使其重疊而形成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory device includes a contact, and a plurality of support structures disposed around the contact, wherein each of the support structures is formed utilizing a plurality of overlapping holes. The support structures include an insulating layer disposed within the overlapping holes. The support structures are formed by expanding and overlapping a plurality of first openings.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:記憶體裝置</p>
        <p type="p">A-A’:線</p>
        <p type="p">CH:通道層</p>
        <p type="p">CPL:單元插塞</p>
        <p type="p">CR:單元區域</p>
        <p type="p">CTR:接觸區域</p>
        <p type="p">CT:接觸件</p>
        <p type="p">GF:間隙填充層</p>
        <p type="p">ML:記憶體層</p>
        <p type="p">SH:支撐孔</p>
        <p type="p">SPA:間隔件</p>
        <p type="p">SS:支撐結構</p>
        <p type="p">X:X方向</p>
        <p type="p">Y:Y方向</p>
        <p type="p">Z:Z方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1877" publication-number="202624021">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624021</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143746</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>套準誤差檢測裝置、印刷裝置、塗布裝置、套準誤差檢測方法、套準誤差檢測程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260223B">B41F33/14</main-classification>
        <further-classification edition="202201120260223B">G06V10/56</further-classification>
        <further-classification edition="202201120260223B">G06V30/186</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友重機械工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO HEAVY INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平山大介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRAYAMA, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 本發明提供一種能夠有效地檢測套準誤差之技術。  &lt;br/&gt;　　[解決手段] 套準誤差檢測裝置(30)具備印刷要素辨識部(33)，該印刷要素辨識部(33)辨識印刷於移動之被印刷物上之既定印刷要素。印刷要素辨識部(33)將至少一個印刷要素依據該印刷要素的顏色資訊進行辨識。套準誤差檢測裝置(30)進一步具備：相對距離運算部(39)，係運算包括依據顏色資訊所辨識出之印刷要素之兩個印刷要素沿移動方向之相對距離；及套準誤差檢測部(41)，係依據相對距離檢測套準誤差。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">30:套準誤差檢測裝置</p>
        <p type="p">31:控制部</p>
        <p type="p">33:印刷要素辨識部</p>
        <p type="p">35:基準選擇部</p>
        <p type="p">37:旋轉角度取得部</p>
        <p type="p">39:相對距離運算部</p>
        <p type="p">41:套準誤差檢測部</p>
        <p type="p">43:套準誤差校正部</p>
        <p type="p">49:記憶部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1878" publication-number="202623780">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623780</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143750</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>金屬有機骨架及其中疏水性吸附質之摻入</chinese-title>
        <english-title>METAL-ORGANIC FRAMEWORKS AND INCORPORATION OF HYDROPHOBIC ADSORBATES THEREIN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K8/02</main-classification>
        <further-classification edition="200601120260302B">A61K8/35</further-classification>
        <further-classification edition="200601120260302B">A61K8/362</further-classification>
        <further-classification edition="200601120260302B">A61K8/37</further-classification>
        <further-classification edition="200601120260302B">A61K8/44</further-classification>
        <further-classification edition="200601120260302B">A61K8/49</further-classification>
        <further-classification edition="200601120260302B">A61K8/73</further-classification>
        <further-classification edition="200601120260302B">A61Q17/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商ＥＬＣ管理公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELC MANAGEMENT LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈丁斯基　約翰卡爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HADYNSKI, JOHN CARL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納亞拉塞里　納拉亞南　阿達什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAYARASSERY-NARAYANAN, ADARSH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗里特　馬利歐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WRIEDT, MARIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏　斯內哈爾Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAH, SNEHAL M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多伊納　約翰羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOINA, JOHN ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳展俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">可製備金屬有機骨架(MOF)以在其中含有高負載之一或多種疏水性吸附質。合適的金屬有機骨架可展現疏水性吸附質在該MOF之孔空間內的穩定保留，諸如至少20%的MOF負載在24小時內無明顯的環境浸出。相較於各別遊離疏水性吸附質，某些疏水性吸附質可展現非預期的更高的光穩定性及UV吸收。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Metal-organic frameworks (MOFs) may be prepared to contain a high loading of one or more hydrophobic adsorbates therein. Suitable metal-organic frameworks may exhibit stable retention of hydrophobic adsorbates within the pore space of the MOF, such as MOF loadings of at least 20% without appreciable environmental leaching over 24 hours. Certain hydrophobic adsorbates may exhibit unexpectedly higher photostability and UV absorption as compared to the respective free hydrophobic adsorbates.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1879" publication-number="202624471">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624471</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143751</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光阻劑剝離組成物及方法</chinese-title>
        <english-title>PHOTORESIST STRIPPING COMPOSITIONS AND METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C11D3/43</main-classification>
        <further-classification edition="200601120260102B">C11D7/50</further-classification>
        <further-classification edition="200601120260102B">C09D9/00</further-classification>
        <further-classification edition="200601120260102B">G03F7/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商陶氏全球科技責任有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOW GLOBAL TECHNOLOGIES LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商陶氏化學韓國有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOW CHEMICAL KOREA LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桂秦源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUI, QINYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈澄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REN, HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金宗鐵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JONGCHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>築島新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUKISHIMA, SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳吉濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JITAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳展俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於光阻劑剝離的溶劑組成物包括：由至少二種芳族化合物所構成的低共熔溶劑(DES)組分，其中各芳族化合物獨立地由下式表示：  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="136px" width="186px" file="ed10007.JPG" alt="ed10007.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;其中R1、R2、及R3可獨立地為氫、直鏈或支鏈C1至C4烷基鏈、醯基、羥基、甲氧基、乙氧基、羥基乙氧基、或醛，其限制條件為R1、R2、及R3不能均係氫，該DES組分不能含有二種三取代芳族化合物；該DES組分不能含有含醛之芳族化合物及含羰基之芳族化合物；根據下式之一或多種二醇醚溶劑：&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="108px" width="193px" file="ed10008.JPG" alt="ed10008.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;其中R1為氫或C1至C4烷基鏈，R2為氫或甲基，n在1至4範圍內，且該一或多種二醇醚溶劑係以30 wt%至70 wt%存在。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Solvent compositions for photoresist stripping include a deep eutectic solvent (DES) component composed of at least two aromatic compounds, wherein each aromatic compound is independently represented by the formula:&lt;b&gt;  &lt;/b&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="119px" width="183px" file="ed10009.JPG" alt="ed10009.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;where R1, R2, and R3 can independently be hydrogen, linear or branched C1 to C4 alkyl chain, acyl group, hydroxyl, methoxy, ethoxy, hydroxyethoxy, or aldehyde, with the provisos that R1, R2, and R3 cannot all be hydrogen, the DES component cannot contain two trisubstituted aromatic compounds; the DES component cannot contain an aromatic compound containing an aldehyde and an aromatic compound containing a carbonyl; one or more glycol ether solvents according to the formula: &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="114px" width="212px" file="ed10010.JPG" alt="ed10010.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;where R1 is hydrogen or a C1 to C4 alkyl chain, R2 is hydrogen or methyl, n ranges from 1 to 4, and the one or more glycol ether solvent is present at 30 wt% to 70 wt%.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1880" publication-number="202625218">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625218</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143785</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於堆疊陶瓷電容器之電極用漿料組成物、用於堆疊陶瓷電容器之電極層及堆疊陶瓷電容器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">H01B1/22</main-classification>
        <further-classification edition="201301120260303B">H01G11/30</further-classification>
        <further-classification edition="200601120260303B">H01G4/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本瑞翁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZEON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐佐木智一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKI, TOMOKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供用於堆疊陶瓷電容器之電極用漿料組成物，其能夠形成得將優異的耐片材腐蝕性（sheet-attack resistance）賦予堆疊陶瓷電容器用堆疊體同時得減低堆疊陶瓷電容器用堆疊體之吸溼性的用於堆疊陶瓷電容器之電極層。本發明之用於堆疊陶瓷電容器之電極用漿料組成物包含導電性金屬粒子、水溶性聚合物與溶媒，前述水溶性聚合物包含交聯性單體單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1881" publication-number="202624432">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624432</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143821</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體用膜狀接著劑、半導體用膜狀接著劑的製造方法、接著劑帶、半導體裝置的製造方法及半導體裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260309B">C09J7/29</main-classification>
        <further-classification edition="200601120260309B">C09J163/02</further-classification>
        <further-classification edition="201801120260309B">C08K3/014</further-classification>
        <further-classification edition="200601120260309B">C08K3/36</further-classification>
        <further-classification edition="200601120260309B">C09J11/04</further-classification>
        <further-classification edition="202601120260309B">H10W74/15</further-classification>
        <further-classification edition="202601120260309B">H10W74/47</further-classification>
        <further-classification edition="202001320260309B">G06F113/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大畠真輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHATA, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>須田雄仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUDA, YUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤慎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體用膜狀接著劑，含有導熱性填料，所述半導體用膜狀接著劑中，以膜狀接著劑的總質量為基準，導熱性填料的含量為20質量%～70質量%，所述半導體用膜狀接著劑沿著厚度方向具有：第一區域，包含第一接著劑組成物；以及第二區域，包含第二接著劑組成物，且導熱性填料的質量濃度較第一區域低。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1882" publication-number="202624904">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624904</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143841</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具備控制裝置及驅動裝置之機械系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G05B19/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後藤大志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOTOU, DAISHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在先前之機械系統中，曾遇到希望將某種指令在控制裝置側產生、或在馬達驅動裝置側產生之情形。  &lt;br/&gt;本發明之機械系統10包含：控制裝置14，其具有產生第1指令之第1指令產生部22；驅動裝置16，其經由通訊網路18與控制裝置14可通訊地連接，依照來自控制裝置14之指令而驅動機械12，且具有產生第1指令之第2指令產生部24；及切換部20，其在第1指令產生部22與第2指令產生部24之間切換第1指令之產生源。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:機械系統</p>
        <p type="p">12:機械</p>
        <p type="p">14:控制裝置</p>
        <p type="p">16:驅動裝置</p>
        <p type="p">18:通訊網路</p>
        <p type="p">20:切換部</p>
        <p type="p">22:第1指令產生部</p>
        <p type="p">24:第2指令產生部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1883" publication-number="202625282">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625282</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143989</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>底蓋、電池包及車輛</chinese-title>
        <english-title>BOTTOM COVER AND BATTERY PACK AND VEHICLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260309B">H01M10/643</main-classification>
        <further-classification edition="202101120260309B">H01M50/148</further-classification>
        <further-classification edition="202101120260309B">H01M50/162</further-classification>
        <further-classification edition="202101120260309B">H01M50/204</further-classification>
        <further-classification edition="202101120260309B">H01M50/249</further-classification>
        <further-classification edition="202601120260309B">H02J1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭義澈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, EUICHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹仁世</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, INSE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭渽勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, JAEHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊鎭吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JINOH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張宰榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, JAEYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔泰雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, TAEWOONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明的一底蓋用於支撐一電池單元的一底面，且底蓋包括平坦的下蓋部和具有凸起圖案的上蓋部，凸起圖案面向電池單元的一底面並沿電池單元的方向突出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bottom cover according to the present invention is for supporting one bottom surface of a battery cell, and the bottom cover includes a flat cover lower portion and a cover upper portion having a raised pattern formed thereon, facing one bottom surface of the battery cell and protruding in a direction of the battery cell.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:電池單元</p>
        <p type="p">111:第一未塗覆部分</p>
        <p type="p">220:集流板</p>
        <p type="p">240:密封墊圈</p>
        <p type="p">412:側部</p>
        <p type="p">420:滾邊部</p>
        <p type="p">430:壓接部</p>
        <p type="p">450:蓋板</p>
        <p type="p">501:底蓋</p>
        <p type="p">510:蓋上部</p>
        <p type="p">511:凸起圖案</p>
        <p type="p">520:蓋下部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1884" publication-number="202624759">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624759</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144016</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>尖端替換型探針</chinese-title>
        <english-title>TIP-REPLACEABLE PROBE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251127B">G01R1/067</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商李諾工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEENO INDUSTRIAL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴熙一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UHM, HEE IL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可輕易地替換尖端部的尖端替換型探針。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1885" publication-number="202624736">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624736</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144073</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>集光系統及有圖形待檢測對象的光學缺陷檢測系統</chinese-title>
        <english-title>LIGHT COLLECTION SYSTEM, AND OPTICAL DEFECT DETECTION SYSTEM FOR PATTERNED OBJECT TO BE DETECTED</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">G01N21/95</main-classification>
        <further-classification edition="200601120260304B">G01N21/88</further-classification>
        <further-classification edition="200601120260304B">G01N21/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳中科飛測科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SKYVERSE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃有為</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YOU WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖俊龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例公開了一種集光系統，包括：前透鏡組、後透鏡組和鏡筒，前、後透鏡組分別安裝於鏡筒；掩模，用於實現空間濾波功能，設置於鏡筒內，位於前透鏡組的光瞳面。同時，本發明實施例中公開了一種有圖形待檢測對象的光學缺陷檢測系統，採用前述的集光系統。本發明實施例在原有物鏡的成像功能，又同時實現空間濾波，到達後透鏡組的背景雜訊信號強度已被空間濾波器衰減，則後透鏡組引起的殘留菲涅爾反射光信號顯著減弱到可以忽略的程度；因此有效降低了通過集光系統的殘留菲尼爾反射光強度總量，從而提升圖像中缺陷信號相對於背景信號的信噪比，改善了光學缺陷檢測系統對散射信號較弱缺陷的漏檢率，提高系統的檢測品質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light collection system is disclosed according to embodiments of the present disclosure, including: a front lens group, a rear lens group, an objective housing, and a mask. The front lens group and the rear lens group are respectively mounted in the objective housing. The mask is configured to achieve a spatial filtering function, which is arranged inside the objective housing and located at a pupil plane of the front lens group. Furthermore, an optical defect detection system for a patterned object to be detected is disclosed according to embodiments of the present disclosure, which includes the aforementioned light collection system. In the embodiments of the present disclosure, while maintaining an imaging function of an objective lens, the spatial filtering function is simultaneously achieved. An intensity of a background noise signal reaching the rear lens group is attenuated by a spatial filter, thereby significantly reducing a residual Fresnel reflected light signal caused by the rear lens group to a negligible level. As a result, a total intensity of the residual Fresnel reflected light passing through the light collection system is effectively reduced, thereby enhancing a signal-to-noise ratio of a defect signal relative to a background signal in an image, improving a missed detection rate of defects with weak scattering signals in the optical defect detection system, and enhancing a detection quality of the system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:空間濾波器</p>
        <p type="p">11:鏡筒</p>
        <p type="p">12:前透鏡組</p>
        <p type="p">13:後透鏡組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1886" publication-number="202624041">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624041</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144142</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電池交換方法及電池交換站</chinese-title>
        <english-title>BATTERY EXCHANGE METHOD THEREOF BATTERY EXCHANGE STATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120251118B">B60L53/80</main-classification>
        <further-classification edition="201901120251118B">B60L53/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英屬開曼群島商睿能創意公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOGORO INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KY</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭明義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, MING-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡彣娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, WEN CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳薇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張舒婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, SHU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅治閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, CHIH-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YEN-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐殷偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳春成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董浩宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUNG, HAO-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電池交換方法應用於電池交換站。電池交換站包含複數個電池槽以及分別上鎖電池槽的複數個門板模組。電池交換方法包含：接收換電請求資訊；偵測電池槽的空槽數；以及於換電請求資訊通過驗證且交換電池數大於空槽數時執行第一換電程序，並於交換電池數不大於空槽數時執行第二換電程序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A battery exchange method is applied to a battery exchange station. The battery exchange station includes a plurality of battery slots and a plurality of door modules respectively locking the battery slots. The battery exchange method includes: receiving battery exchange request information; detecting a number of empty slots of the battery slots; and executing a first battery exchange procedure when the battery exchange request information is verified and an exchanging number of battery is greater than the number of empty slots and executing a second battery exchange procedure when the exchanging number of battery is not greater than the number of empty slots.</p>
      </isu-abst>
      <representative-img>
        <p type="p">M:電池交換方法</p>
        <p type="p">S110,S120,S130,S1300,S1301:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1887" publication-number="202624289">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624289</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144190</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發光裝置的製造方法、負型感放射線性組合物、硬化膜及有機EL裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08F2/44</main-classification>
        <further-classification edition="200601120260302B">C08F212/14</further-classification>
        <further-classification edition="200601120260302B">C08F220/32</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/027</further-classification>
        <further-classification edition="200601120260302B">G03F7/031</further-classification>
        <further-classification edition="200601120260302B">G03F7/038</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="200601120260302B">G03F7/40</further-classification>
        <further-classification edition="200601120260302B">G06F3/041</further-classification>
        <further-classification edition="200601120260302B">G09F9/00</further-classification>
        <further-classification edition="200601120260302B">G09F9/30</further-classification>
        <further-classification edition="200601120260302B">H05B33/12</further-classification>
        <further-classification edition="200601120260302B">H05B33/22</further-classification>
        <further-classification edition="202301120260302B">H10K50/86</further-classification>
        <further-classification edition="202301120260302B">H10K59/40</further-classification>
        <further-classification edition="202301120260302B">H10K59/50</further-classification>
        <further-classification edition="202301120260302B">H10K59/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松村信司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMURA, NOBUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田崎太一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAZAKI, TAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秋池利之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKIIKE, TOSHIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>児玉誠一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KODAMA, SEIICHIROU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大友諒平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OOTOMO, RYOUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種具有充分的分辨力、即便通過相對較低的溫度（例如100℃以下）的加熱也可獲得具有充分的耐化學品性且密接性優異的硬化膜的負型感放射線性組合物、使用所述負型感放射線性組合物的發光裝置的製造方法、將所述負型感放射線性組合物硬化而成的硬化膜及包括所述硬化膜的有機EL裝置。一種發光裝置的製造方法，所述發光裝置具有基板、位於所述基板上的發光元件、位於所述發光元件上的密封層及直接或間接地位於所述密封層上的具有至少一層硬化樹脂層的硬化樹脂部，且所述發光裝置的製造方法依序包括：在基板上形成發光元件與位於所述發光元件上的密封層的工序；在所述密封層上直接或間接地塗布負型感放射線性組合物而形成塗膜的工序；對所述塗膜的至少一部分照射放射線的工序；對放射線照射後的塗膜進行堿顯影的工序；以及在100℃以下的溫度下進行加熱的工序，所述負型感放射線性組合物含有：堿可溶性樹脂（A），含有具有酸性基的結構單元與具有選自由氧雜環丙基及氧雜環丁基所組成的群組中的至少一個基的結構單元；多官能自由基聚合性化合物（B）；及光自由基聚合引發劑（C）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1888" publication-number="202623733">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623733</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144214</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包括拉出導引裝置和間隔件的配置</chinese-title>
        <english-title>ARRANGEMENT COMPRISING A PULL-OUT GUIDE AND A SPACER PIECE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">A47B96/07</main-classification>
        <further-classification edition="200601120260309B">E05D15/08</further-classification>
        <further-classification edition="201701120260309B">A47B88/427</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧地利商朱利葉斯百隆股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JULIUS BLUM GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布魯姆　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BLUM, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有至少一個用於傢俱元件（12）的拉出導引裝置（3）的配置（2），其中該拉出導引裝置（3）包含至少兩個軌道（31）以及用於固定傢俱元件（12）以防脫落的至少一個鎖緊裝置（32），其中該至少一個鎖緊裝置（32）包含至少一個鎖緊元件（33），其中該配置（2）包括至少一個間隔件（4）以延長該至少一個鎖緊裝置的至少一個鎖緊元件（33），其中該至少一個間隔件（4）包含至少一個用於將間隔件（4）支撐在拉出導引裝置（3）上的支撐元件（41）以及至少一個另外的鎖緊元件（42），其中該另外的鎖緊元件（42）被設計用於佈置在鎖緊裝置（32）的鎖緊元件（33）的延長部分中以及代替鎖緊裝置的鎖緊元件（33）被鎖定在傢俱元件（12）之中及/或之上，其中該等兩個鎖緊元件（33、42）有基本上相同的形狀以及/或者間隔件（4）的該至少一個支撐元件（41）和該另外的鎖緊元件（42）是一體成型。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:配置</p>
        <p type="p">4:間隔件</p>
        <p type="p">32:鎖緊裝置</p>
        <p type="p">42:鎖緊元件</p>
        <p type="p">53:緊固件</p>
        <p type="p">311:水準水平翼板</p>
        <p type="p">312:垂直翼板</p>
        <p type="p">313:軌道頂面</p>
        <p type="p">412:水準水平翼板</p>
        <p type="p">413:垂直翼板</p>
        <p type="p">421:鉤</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1889" publication-number="202625225">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625225</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144224</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>奈米顆粒磁性膜、磁性核心及電子構件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">H01F10/14</main-classification>
        <further-classification edition="200601120260309B">H01F10/16</further-classification>
        <further-classification edition="200601120260309B">H01F3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＤＫ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TDK CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>天野一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMANO, HAJIME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長谷川暁斗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASEGAWA, AKITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種奈米顆粒磁性膜，具有第一相分散於第二相中的結構。奈米顆粒磁性膜具有包含Fe及Co的奈米尺寸的金屬相作為第一相，在第二相具有氧及氮。金屬相具有一個以上晶粒。奈米顆粒磁性膜中以體積基準的前述晶粒的晶粒粒徑的眾數為1.5nm以上6.0nm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">111:旋轉部件</p>
        <p type="p">111a:旋轉板</p>
        <p type="p">111b:旋轉軸</p>
        <p type="p">113:基板</p>
        <p type="p">121:陰極</p>
        <p type="p">123:濺鍍靶材</p>
        <p type="p">131:斷續器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1890" publication-number="202625809">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625809</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144331</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包括在金屬線的軸上延伸的空氣間隙的積體電路裝置及其形成方法</chinese-title>
        <english-title>INTEGRATED CIRCUIT DEVICE INCLUDING AN AIRGAP EXTENDING ON AN AXIS OF A METAL LINE AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260309B">H10W20/40</main-classification>
        <further-classification edition="202601120260309B">H10W20/46</further-classification>
        <further-classification edition="202601120260309B">H10P14/24</further-classification>
        <further-classification edition="202601120260309B">H10P14/692</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金尊洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JOHNSOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭元根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, WONKEUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張相信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, SANGSHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐　康一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, KANG-ILL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供積體電路裝置及其形成方法。積體電路裝置包括：第一下部模製層和第二下部模製層，各自在第一方向上延伸並在垂直於第一方向的第二方向上彼此間隔開；下部金屬線，在第一下部模製層和第二下部模製層之間並在第一方向上延伸；中間模製層，在第一下部模製層和第二下部模製層上並通過空氣間隙與下部金屬線分離；以及通孔接觸件，在下部金屬線上並延伸通過在中間模製層中的開口，通孔接觸件包含鄰近於下部金屬線的第一部分，第一部分在第一方向上的第一寬度比在第二方向上的第二寬度更寬。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An integrated circuit device and a method of forming the same are provided. The integrated circuit device includes a first under mold layer and a second under mold layer each extending in a first direction and spaced apart from each other in a second direction, perpendicular to the first direction; an under metal line between the first under mold layer and the second under mold layer and extending in the first direction; an intermediate mold layer on the first under mold layer and the second under mold layer and separated from the under metal line by an air gap; and a via contact on the under metal line and extending through an opening in the intermediate mold layer, the via contact comprising a first portion adjacent to the under metal line having a first width in the first direction that is wider than a second width in the second direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:積體電路裝置</p>
        <p type="p">110:下部金屬線</p>
        <p type="p">112a:下部模製層</p>
        <p type="p">112b:中間模製層</p>
        <p type="p">114a:第一部分</p>
        <p type="p">114b:第二部分</p>
        <p type="p">116:空氣間隙</p>
        <p type="p">118:上部模製層</p>
        <p type="p">A-A':線</p>
        <p type="p">W1:寬度</p>
        <p type="p">X,Y,Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1891" publication-number="202624010">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624010</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144412</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學薄膜及包含其之顯示裝置</chinese-title>
        <english-title>OPTICAL FILM AND DISPLAY COMPRISING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">B32B27/20</main-classification>
        <further-classification edition="200601120260302B">G02B5/02</further-classification>
        <further-classification edition="200601120260302B">G02B5/30</further-classification>
        <further-classification edition="200601120260302B">G02F1/13363</further-classification>
        <further-classification edition="200601120260302B">G09F9/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商東麗先端素材股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORAY ADVANCED MATERIALS KOREA INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裵重碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE, JOONG SUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金潢龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HWANGYONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種光學薄膜，更詳細而言，係涉及一種可以改善顯示裝置之左右視角，且即使於大面積製造情況下，亦能均勻展現視角改善效果之光學薄膜，於改善視角之同時不降低正面亮度特性，並能在提升對比度之同時將色彩變動最小化之光學薄膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:各向異性擴散層</p>
        <p type="p">110:表層</p>
        <p type="p">200:光學薄膜</p>
        <p type="p">X-X':界線</p>
        <p type="p">Y-Y':界線</p>
        <p type="p">X:軸</p>
        <p type="p">Y:軸</p>
        <p type="p">Z:軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1892" publication-number="202624549">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624549</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144451</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>化學製程廢水之電化學處理方法</chinese-title>
        <english-title>PROCESS FOR ELECTROCHEMICAL TREATMENT OF CHEMICAL PROCESS WASTEWATERS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">C25B1/20</main-classification>
        <further-classification edition="200601120260304B">C25C7/04</further-classification>
        <further-classification edition="202301120260304B">C02F9/00</further-classification>
        <further-classification edition="202301120260304B">C02F1/461</further-classification>
        <further-classification edition="200601120260304B">G01N27/49</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商贏創運營有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EVONIK OPERATIONS GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅特尼奇　珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METTERNICH, JAN BENEDIKT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倫納茲　羅拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LENNARTZ, LAURA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史塔特米勒　托比亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STADTMUELLER, TOBIAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿恩特　塞巴斯蒂安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARNDT, SEBASTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬耶斯基　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAJEWSKI, ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史坦納　派翠克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STENNER, PATRIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科史崔克　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOHLSTRUK, STEPHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種在電化學槽中處理化學製程廢水之方法，該電化學槽包含至少一個BDD陽極、和至少一個鉑、石墨、不銹鋼、DSA、鈦或BDD陰極，其中該電化學槽為準隔離槽(quasi-divided cell)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a process for the treatment of chemical process wastewater in an electrochemical cell comprising at least one BDD anode and at least one platinum, graphite, stainless steel, DSA, titanium or BDD cathode, where the electrochemical cell is a quasi-divided cell.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1893" publication-number="202625496">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625496</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144485</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於網狀獨立通道前載最佳化之技術</chinese-title>
        <english-title>TECHNIQUES FOR MESH INDEPENDENT CHANNEL FRONTHAUL OPTIMIZATION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260311B">H04W88/08</main-classification>
        <further-classification edition="202301120260311B">H04W72/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕爾瑪　沙拉布</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARMAR, SHALABH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉瑪札亞姆　莫菲蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMAJAYAM, MUGHILAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆皮雷迪　普拉桑蒂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUPPIREDDY, PRASANTHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維塔爾　哈爾沙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VITTAL, HARSHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述用於無線通訊的方法、系統、及裝置。一種第一存取點(access point, AP)可經由以下與一第二AP通訊：一第一回載鏈路，其使用在一第一頻帶內的一第一通道上操作的一第一無線電；及一第二回載鏈路，其使用在一第二頻帶內的一第二通道上操作的一第二無線電。該第一AP可係在一集中式或分散式網路中操作的一控制器或代理AP。該第一AP可向該第二AP發送一回載鏈路重新組態訊息，該回載鏈路重新組態訊息指示一回載操作的一重新組態、該第二頻帶的終止、及至在該第二頻帶內的一第三通道上操作該第二無線電以用於前載通訊的一切換。該第一AP或該第二AP可使用該第二無線電且基於該回載鏈路重新組態而發送一前載訊息。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods, systems, and devices for wireless communications are described. A first access point (AP) may communicate with a second AP via a first backhaul link using a first radio that operates on a first channel within a first frequency band and via a second backhaul link using a second radio that operates on a second channel within a second frequency band. The first AP may be a controller or agent AP that operates in a centralized or decentralized network. The first AP may send the second AP a backhaul link reconfiguration message that indicates a reconfiguration of a backhaul operation, termination of the second backhaul link, and a switch to operate the second radio on a third channel within the second frequency band for fronthaul communication. The first AP or the second AP may send a fronthaul message using the second radio and based on the backhaul link reconfiguration.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102-a:控制器AP</p>
        <p type="p">102-b:代理AP</p>
        <p type="p">104-a:第一STA；STA</p>
        <p type="p">104-b:第二STA；STA</p>
        <p type="p">104-c:第三STA；STA</p>
        <p type="p">200:無線通訊網路</p>
        <p type="p">206-a:第一回載鏈路；回載鏈路</p>
        <p type="p">206-b:第二回載鏈路；回載鏈路</p>
        <p type="p">206-c:前載鏈路B1</p>
        <p type="p">206-d:前載鏈路B2</p>
        <p type="p">206-e:前載鏈路B3</p>
        <p type="p">206-f:前載鏈路A1</p>
        <p type="p">206-g:前載鏈路A2；第二前載鏈路A2</p>
        <p type="p">206-h:前載鏈路A3</p>
        <p type="p">206-k:通訊鏈路</p>
        <p type="p">206-l:通訊鏈路</p>
        <p type="p">207-a,207-b:RM控制器</p>
        <p type="p">209-a,209-b:EM控制器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1894" publication-number="202624024">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624024</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144501</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>帶副輪的購物車</chinese-title>
        <english-title>SHOPPING CART WITH SUBWHEEL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251127B">B60B19/02</main-classification>
        <further-classification edition="200601120251127B">B60B33/00</further-classification>
        <further-classification edition="200601120251127B">B62B5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三普股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMBO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴相昱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UM, SANG OOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及一種帶副輪的購物車，根據本揭露的帶副輪的購物車的特徵在於，包括：框體；前輪，在外周面上形成有能夠插入到自動人行道的上表面的軌道凹槽中的凸出部，並且佈置在該框體的前端部的下端兩側；制動部，在該前輪的凸出部插入於自動人行道的上表面的軌道凹槽中的狀態下限制前輪的滾動；副輪，為了與自動人行道的梳齒板接觸，佈置在與該前輪相比相對向前方凸出的位置上，該副輪的下端部與支撐該前輪的下端部的地面向上側隔開，該副輪的下端部與地面之間的相隔間隔設定為梳齒板的厚度以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">110:框體</p>
        <p type="p">111:橫杆</p>
        <p type="p">111a:第一結合部</p>
        <p type="p">120:前輪</p>
        <p type="p">121:凸出部</p>
        <p type="p">140:制動部</p>
        <p type="p">150:下端托盤</p>
        <p type="p">151:第二結合部</p>
        <p type="p">160:副輪</p>
        <p type="p">161:凸緣部</p>
        <p type="p">170:固定支架</p>
        <p type="p">171:第一板</p>
        <p type="p">171a:第三結合部</p>
        <p type="p">172:支撐杆</p>
        <p type="p">173:第二板</p>
        <p type="p">173a:第四結合部</p>
        <p type="p">B:結合部件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1895" publication-number="202625044">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625044</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144517</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>支付方法、支付裝置、設備及存儲介質</chinese-title>
        <english-title>PAYMENT METHOD, PAYMENT APPARATUS, DEVICE AND STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260102B">G06Q20/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中國銀聯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA UNIONPAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>于文海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, WENHAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳成錢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHENGQIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張琦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾望年</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZENG, WANGNIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種支付方法、支付裝置、設備及存儲介質。應用於支付裝置，支付裝置包括NFC標籤、外聯模組；該方法包括：當NFC標籤檢測到感應區域中存在終端設備時，調起終端設備中的支付程式，以申領付款碼；將付款碼採用動態回寫的方式寫入NFC標籤中，得到包含付款碼資訊的NFC標籤；通過外聯模組將NFC標籤中的付款碼資訊發送至收款方執行資訊系統，以進行支付。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides a payment method, a payment apparatus, a device and a storage medium. Applied in the payment apparatus, the payment apparatus includes an NFC label and an external connection module; the method includes: calling a payment program in a terminal device when the NFC label detects that there exists a terminal device in a sensing area, to apply for a payment code; writing the payment code into the NFC label in a dynamic back writing manner, to obtain the NFC label with payment code information; sending, through the external connection module, the payment code information in the NFC label to a payee side management information system, to perform payment.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101、S102、S103:方法</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1896" publication-number="202624379">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624379</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144544</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>熱硬化性樹脂組成物、硬化物及印刷配線板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">C08K5/521</main-classification>
        <further-classification edition="200601120260303B">C08K5/21</further-classification>
        <further-classification edition="200601120260303B">C08L63/00</further-classification>
        <further-classification edition="200601120260303B">C08G59/18</further-classification>
        <further-classification edition="200601120260303B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商太陽控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIYO HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池田篤哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEDA, ATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仲田和貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKADA, KAZUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>滝澤雅弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKIZAWA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋千夏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, CHIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種熱硬化性樹脂組成物，係能夠形成兼具高熱傳導性與耐絕緣破壞性，進而表面具有高平滑性之硬化物的熱硬化性樹脂組成物，且在常溫時之保存穩定性亦優異。&lt;br/&gt;  本發明之熱硬化性樹脂組成物係於熱硬化性樹脂中摻合環氧樹脂、熱傳導性填料、磷酸酯類濕潤分散劑以及尿素類流變調整劑，將磷酸酯類濕潤分散劑及尿素類流變調整劑的含量分別調整為特定範圍，並且將在25℃之觸變指數調整為1.0以上且未達1.4。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1897" publication-number="202625073">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625073</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144570</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>大客車用雲端數據整合與風險分析裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120251201B">G06Q50/40</main-classification>
        <further-classification edition="202301120251201B">G06Q10/0635</further-classification>
        <further-classification edition="200601120251201B">G08G1/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人中華顧問工程司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉又升</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王冠堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張建彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇昭銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宣諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張志鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐奉璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種大客車用雲端數據整合與風險分析裝置，係包括數個主機、一資料處理器、以及一大數據分析伺服器所構成。藉此，透過異質數據的即時整合與分析，顯著提高交通管理中駕駛行為監控的準確性與效率。所提大數據分析伺服器利用實時警示與數據可視化展示，幫助管理者及時識別與處理風險，有效提升交通運輸系統的安全性能。此外，本發明實現駕駛行為監控與風險管理的智能化與即時化，顯著提升數據處理效率與安全管理的精確性。此分析伺服器的大數據分析功能提供全面的風險預測與決策支持，進一步促進交通安全的提升。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:主機</p>
        <p type="p">11:資料傳輸介面</p>
        <p type="p">2:資料處理器</p>
        <p type="p">21:ADAS整合資料庫</p>
        <p type="p">22:外部資料庫</p>
        <p type="p">23:數據分析資料庫</p>
        <p type="p">3:數據分析伺服器</p>
        <p type="p">31:權限管理單元</p>
        <p type="p">32:資料檔案管理單元</p>
        <p type="p">33:參數設定單元</p>
        <p type="p">34:駕駛安全績效評分單元</p>
        <p type="p">35:輸出單元</p>
        <p type="p">36:控制單元</p>
        <p type="p">4:播放單元</p>
        <p type="p">5:行動通訊單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1898" publication-number="202624581">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624581</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144625</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚酯纖維類複合假撚紗及其製備方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">D01D5/34</main-classification>
        <further-classification edition="200601120260302B">D01F8/14</further-classification>
        <further-classification edition="200601120260302B">D02G1/02</further-classification>
        <further-classification edition="200601120260302B">D02G1/04</further-classification>
        <further-classification edition="200601120260302B">D02G1/18</further-classification>
        <further-classification edition="200601120260302B">D02G3/04</further-classification>
        <further-classification edition="200601120260302B">D02G3/36</further-classification>
        <further-classification edition="200601120260302B">D02J1/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商曉星天禧股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HYOSUNG TNC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金中烈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JOONG YEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳聖鎮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, SUNG JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉信金</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種聚酯纖維類複合假撚紗及其製備方法，其使用芯紗由聚對苯二甲酸乙二醇酯/聚對苯二甲酸丙二醇酯（PET/PTT）潛在卷曲絲作為芯紗，在複合假撚紗的製備過程中使拉伸比最小化，並使用預取向絲作為效果紗鬆散地排列在外表面上，本發明的聚酯纖維類複合假撚紗由於芯紗的波紋而可以提供與現有的複合假撚紗相比伸縮性提高的效果，並且由於效果紗的波紋而可以提供觸感提高的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1899" publication-number="202624974">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624974</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144704</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>執行預處理的系統、處理裝置和處理裝置的操作方法</chinese-title>
        <english-title>SYSTEM EXECUTING PRE-PROCESSING, PROCESSING DEVICE AND OPERATING METHOD OF THE PROCESSING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251201B">G06F13/28</main-classification>
        <further-classification edition="200601120251201B">G06F13/40</further-classification>
        <further-classification edition="200601120251201B">G06F9/50</further-classification>
        <further-classification edition="200601120251201B">G06F3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商愛思開海力士有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK HYNIX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>兪希在</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, HUI JAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曺政鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOH, JUNG HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種系統包括：中央處理單元；第一處理裝置；以及第二處理裝置，並且第一處理裝置：（i）從第一記憶體讀取原始資料，（ii）從第一基底位址暫存器讀取預處理資訊，（iii）利用預處理資訊對原始資料執行預處理操作以產生結果資料，以及（iv）將結果資料傳輸到第二處理裝置而無需繞經外部處理器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system includes a central processing unit; a first processing device; and a second processing device, and the first processing device (i) reads original data from the first memory, (ii) reads pre-processing information from the first base address register, (iii) executes a pre-processing operation on the original data using the pre-processing information to generate result data, and (iv) transmits the result data to second processing device without detouring via an external processor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">110:中央處理單元</p>
        <p type="p">120:第一處理裝置</p>
        <p type="p">130:第二處理裝置</p>
        <p type="p">BAR1:第一基底位址暫存器</p>
        <p type="p">BAR2:第二基底位址暫存器</p>
        <p type="p">MEM1:第一記憶體</p>
        <p type="p">MEM2:第二記憶體</p>
        <p type="p">PU1:第一處理器</p>
        <p type="p">PU2:第二處理器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1900" publication-number="202624764">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624764</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144707</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電流測定電路、載臺裝置及致動器之控制方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">G01R19/00</main-classification>
        <further-classification edition="200601120260202B">G01R15/20</further-classification>
        <further-classification edition="200601120260202B">G01R15/08</further-classification>
        <further-classification edition="200601120260202B">G01R19/25</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友重機械工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO HEAVY INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>髙山健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAYAMA, KEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種能夠抑制在測定對象的電流路徑上產生雜訊之電流測定電路。  &lt;br/&gt;　　[解決手段]流過電流路徑之電流與感測器輸出的關係不同，且彼此串聯連接之多個電流感測器插入到電流路徑中。選擇電路依據來自多個電流感測器各自的感測器輸出，從多個感測器輸出中選擇1個感測器輸出，並將所選擇之感測器輸出作為電流測定值輸出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電流測定電路</p>
        <p type="p">11H:大電流用電流感測器</p>
        <p type="p">11L:小電流用電流感測器</p>
        <p type="p">12H,12L:電流檢測元件</p>
        <p type="p">13H,13L:AD轉換器</p>
        <p type="p">15:選擇電路</p>
        <p type="p">50:電流路徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1901" publication-number="202625553">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625553</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144714</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體晶片</chinese-title>
        <english-title>SEMICONDUCTOR CHIP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260302B">H10B12/00</main-classification>
        <further-classification edition="202601120260302B">H10W20/43</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金炳圭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, BYUNGKYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權民寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, MINYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴相俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SANGJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卞相赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BYUN, SANGHYUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李仁榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, INYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明概念提供一種半導體晶片。在一記憶體胞元結構及一周邊電路結構之一接合結構中，一矽穿孔經配置成使得一禁入區段之區域可減少，同時確保一連接結構之電可靠性。因此，本發明概念具有改良整合度之效應。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The inventive concept provides a semiconductor chip. In a bonding structure of a memory cell structure and a peripheral circuit structure, a through-silicon via is arranged such that the area of a keep out zone can be reduced while securing electrical reliability of a connection structure. Accordingly, the inventive concept has the effect of improving the degree of integration.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體晶片</p>
        <p type="p">101:第一基體</p>
        <p type="p">101LD:第一溝槽隔離層</p>
        <p type="p">101SD:第二溝槽隔離層</p>
        <p type="p">110:第一周邊電路連接器</p>
        <p type="p">111:第一周邊電路絕緣層</p>
        <p type="p">113:第一周邊電路佈線層</p>
        <p type="p">115:第一接觸通孔</p>
        <p type="p">210:記憶體胞元連接器</p>
        <p type="p">211:記憶體胞元絕緣層</p>
        <p type="p">213:記憶體胞元佈線層</p>
        <p type="p">300:記憶體胞元電晶體</p>
        <p type="p">BI:接合介面</p>
        <p type="p">CP:周邊電路層</p>
        <p type="p">CX1:區</p>
        <p type="p">KOZ:禁入區段</p>
        <p type="p">MC:記憶體胞元層</p>
        <p type="p">PT:周邊電路電晶體</p>
        <p type="p">TSV1:第一穿孔</p>
        <p type="p">TSV2:第二穿孔</p>
        <p type="p">X:第一水平方向</p>
        <p type="p">Y:第二水平方向</p>
        <p type="p">Z:豎直方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1902" publication-number="202625704">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625704</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144854</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>上部電極組裝體及電漿處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260310B">H10P50/20</main-classification>
        <further-classification edition="201201120260310B">H01J11/20</further-classification>
        <further-classification edition="201201120260310B">H01J11/22</further-classification>
        <further-classification edition="200601120260310B">H01J37/32</further-classification>
        <further-classification edition="202601120260310B">H10W40/10</further-classification>
        <further-classification edition="200601120260310B">F16B37/04</further-classification>
        <further-classification edition="200601120260310B">F16B45/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>髙栖紀尚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKASU, NORINAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供將電極板固定於固持板的上部電極組裝體及電漿處理裝置。  &lt;br/&gt;本發明之上部電極組裝體，在電漿處理裝置中使用；該上部電極組裝體，具備：固持板，具有貫通孔；電極板，具有插入溝；襯套，具有內螺紋構造部及卡鉤構造部；該內螺紋構造部，具有緊固溝；該卡鉤構造部，在令該襯套嵌入到該插入溝之際，防止該襯套自該插入溝的脫落；以及，外螺紋構件，插入穿通該貫通孔，並與該內螺紋構造部的該緊固溝螺合，而將該電極板固定於該固持板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">131:固持板</p>
        <p type="p">132:電極板</p>
        <p type="p">200:插入溝</p>
        <p type="p">250:貫通孔</p>
        <p type="p">300:襯套</p>
        <p type="p">400:螺栓(外螺紋構件，緊固部件)</p>
        <p type="p">500:上部電極組裝體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1903" publication-number="202625509">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625509</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144882</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於在電子迴旋共振加熱期間反射微波輻射的設備及其使用</chinese-title>
        <english-title>DEVICE AND USE OF THE DEVICE FOR REFLECTING MICROWAVE RADIATION DURING ELECTRON-CYCLOTRON RESONANCE HEATING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">H05H13/00</main-classification>
        <further-classification edition="200601120260309B">H05B6/64</further-classification>
        <further-classification edition="200601120260309B">H05H7/00</further-classification>
        <further-classification edition="200601120260309B">H05H1/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義大利商ＥＮＩ公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENI S.P.A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>札農　法比奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZANON, FABIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德馬奇　埃莉安娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE MARCHI, ELIANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>里斯波利　納塔雷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RISPOLI, NATALE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布魯斯基　亞歷山德羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRUSCHI, ALESSANDRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦薩羅　埃斯佩迪托</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VASSALLO, ESPEDITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佩德羅尼　馬泰奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEDRONI, MATTEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布拉金　弗朗切斯科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRAGHIN, FRANCESCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布西　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUSI, DANIELE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕利亞羅　阿爾弗雷多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAGLIARO, ALFREDO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種用於在電子迴旋共振加熱（electron-cyclotron resonance heating；ECRH）期間反射微波輻射的設備100。設備100包括本體部200及至少一個反射層300a、300b、300c，其中本體部200包括介電材料，並且該至少一個反射層300a、300b、300c是由導電率在0.1 - 70 MS/m的範圍內的導電材料製成的，以及其中本體部200的熱膨脹係數與該至少一個反射層300a、300b、300c的熱膨脹係數的差異量在0 – 20x10&lt;sup&gt;-6&lt;/sup&gt;/K的範圍內，以及其中冷卻構件400a、400b、400c設置在本體部200處或至少部分地設置在本體部200內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a device 100 for reflecting microwave radiation during electron-cyclotron resonance heating (ECRH). The device 100 comprises a bulk portion 200 and at least one reflective layer 300a, 300b, 300c, wherein the bulk portion 200 includes dielectric material and the at least one reflective layer 300a, 300b, 300c is made of an electrically conductive material which has an electrical conductivity in a range of 0.1 - 70 MS/m, and wherein the thermal expansion coefficient of the bulk portion 200 differs from the thermal expansion coefficient of the at least one reflective layer 300a, 300b, 300c by an amount in a range of 0 – 20x10&lt;sup&gt;-6&lt;/sup&gt;/K, and wherein a cooling means 400a, 400b, 400c is provided at or at least partially within the bulk portion 200.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:設備</p>
        <p type="p">200:介電本體</p>
        <p type="p">300a:前表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1904" publication-number="202623732">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623732</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144905</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於可移動地安裝傢俱元件的拉出導引裝置</chinese-title>
        <english-title>PULL-OUT GUIDE FOR MOVABLE MOUNTING OF A FURNITURE ELEMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260311B">A47B88/427</main-classification>
        <further-classification edition="201701120260311B">A47B88/57</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧地利商朱利葉斯百隆股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JULIUS BLUM GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彼得梅爾　曼紐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PETERMAIR, MANUEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慕斯克　艾維斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUSIC, ELVIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格拉布赫爾　西蒙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRABHERR, SIMON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布魯格　喬納斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRUGGER, JONAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於將傢俱元件（12）可移動地安裝在傢俱主體（11）上的拉出導引裝置（2），包括滑軌（21）和主體軌道（22），其中該滑軌（21）以相對於主體軌道（22）可移動的方式安裝，以及包含佈置在該等軌道之一者上的鎖緊裝置（3），其中該鎖緊裝置帶有要與傢俱元件（12）連接的鎖緊元件（4）和固定裝置（5），其中固定裝置（5）包含第一緊固板（51）用於固定在拉出導引裝置（2）上和另外的緊固板（52）用於固定在拉出導引裝置（2）上，其中該另外的緊固板（52）與該第一緊固板（51）成角度，該第一緊固板（51）佈置在拉出導引裝置（2）的端部，並且橫截於拉出導引裝置（2）的縱向（7），且其中該另外的緊固板（52）朝著拉出導引裝置（2）的與第一端部相對的第二端部延伸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:拉出導引裝置</p>
        <p type="p">3:鎖緊裝置</p>
        <p type="p">7:拉出導引裝置的縱向</p>
        <p type="p">21:滑軌</p>
        <p type="p">22:主體軌道</p>
        <p type="p">23:拉出導引裝置的頂面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1905" publication-number="202625198">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625198</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144909</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>邏輯單元資源域</chinese-title>
        <english-title>LOGICAL UNIT RESOURCE DOMAIN</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">G11C29/52</main-classification>
        <further-classification edition="200601120260309B">G06F13/10</further-classification>
        <further-classification edition="200601120260309B">G06F13/16</further-classification>
        <further-classification edition="200601120260309B">G06F13/38</further-classification>
        <further-classification edition="201301120260309B">G06F21/30</further-classification>
        <further-classification edition="201801120260309B">G06F9/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭燦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, CAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁　宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VUONG, HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　桑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRAN, SANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘迪　瑪尼許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANDEY, MANISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿雷帕利　納文庫馬古德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AREPALLI, NAVEEN KUMAR GOUD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉瓦特　尼汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAWAT, NITIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">多個態樣係關於定義資料儲存裝置中的邏輯單元(logical unit, LU)資源域，以域為基礎來管理LU相關資源。一種資料儲存裝置（例如，UFS裝置）可經組態以啟用該資料儲存裝置內的複數個資源域。各資源域經組態以管理該資料儲存裝置的複數個資源的各別專用資源。例如，該複數個資源可包括該資料儲存裝置的至少複數個邏輯單元。該資料儲存裝置可進一步經組態以將該複數個邏輯單元的一或多個各別邏輯單元指派給該複數個資源域之各者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Aspects relate to defining logical unit (LU) resource domains in data storage devices to manage LU-related resources on a domain basis. A data storage device (e.g., a UFS device) may be configured to enable a plurality of resource domains within the data storage device. Each resource domain is configured to manage respective dedicated resources of a plurality of resources of the data storage device. For example, the plurality of resources may include at least a plurality of logical units of the data storage device. The data storage device may further be configured to assign one or more respective logical units of the plurality of logical units to each of the plurality of resource domains.</p>
      </isu-abst>
      <representative-img>
        <p type="p">802:主機軟體</p>
        <p type="p">804:主機控制器</p>
        <p type="p">806:裝置</p>
        <p type="p">808,810,812,814,816,818:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1906" publication-number="202625281">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625281</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144969</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>能量儲存外殼及能量儲存系統</chinese-title>
        <english-title>ENERGY STORAGE ENCLOSURE AND ENERGY STORAGE SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">H01M10/16</main-classification>
        <further-classification edition="202101120260306B">H01M50/114</further-classification>
        <further-classification edition="201901120260306B">B60L50/50</further-classification>
        <further-classification edition="200601120260306B">H02J7/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商富安能源有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLUENCE ENERGY, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡拉漢　凱瑟琳　科琳　史特朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CALLAHAN, KATHRYN CORINE STRENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮特里　喬丹　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PETRIE, JORDAN DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施羅德　伊莉莎白　安妮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHROEDER, ELIZABETH ANNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">能量儲存外殼包括一電池組包，複數個電池組模組經設置在該電池組包內。該複數個電池組模組之各者包括：一電池組模組外殼；複數個電池組子模組，其等設置在該電池組模組外殼內；複數個中梁，其等設置在該電池組模組外殼內；及複數個隔熱層，其等設置在該電池組模組外殼內。該複數個電池組子模組之各者包括一對相對的端板，及設置在該對相對的端板之間的複數個電池組單元。該複數個中梁之各者設置在相鄰的電池組子模組之間。該複數個隔熱層中之至少一者相鄰於該複數個中梁之一者而設置，並且該複數個隔熱層中之至少另一者相鄰於該電池組模組外殼的一內部表面而設置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An energy storage enclosure includes a battery pack, a plurality of battery modules disposed within the battery pack. Each of the plurality of battery modules includes a battery module enclosure, a plurality of battery submodules disposed the battery module enclosure, a plurality of mid-beams disposed within the battery module enclosure, and a plurality of thermal isolation layers disposed within the battery module enclosure. Each of the plurality of battery submodules includes a pair of opposing end plates, and a plurality of battery cells disposed between the pair of opposing end plates. Each of the plurality of mid-beams is disposed between adjacent battery submodules. At least one of the plurality of thermal isolation layers is disposed adjacent to one of the plurality of mid-beams, and at least another of the plurality of thermal isolation layers is disposed adjacent to an internal surface of the battery module enclosure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:能量儲存系統/模組化能量系統</p>
        <p type="p">102:能量儲存外殼</p>
        <p type="p">103:電池組包</p>
        <p type="p">104:控制器</p>
        <p type="p">106:冷卻系統(或冷卻器)</p>
        <p type="p">108:電力轉換模組</p>
        <p type="p">110:直流保護模組(DCPM)</p>
        <p type="p">112:輔助組件</p>
        <p type="p">114:加熱、通風及空調(HVAC)</p>
        <p type="p">120:DC斷連箱</p>
        <p type="p">122:DC斷連開關</p>
        <p type="p">124:爆燃板</p>
        <p type="p">126:被動通風口</p>
        <p type="p">128:DC-DC轉換器</p>
        <p type="p">130:不斷電電源供應器(UPS)</p>
        <p type="p">132:主控板(MCB)</p>
        <p type="p">134:配電器</p>
        <p type="p">136:接地點</p>
        <p type="p">138:外殼至外殼連接</p>
        <p type="p">140:電池模組</p>
        <p type="p">150:外部電源</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1907" publication-number="202625182">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625182</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144993</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體的資料讀取電路、方法及記憶體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G11C11/405</main-classification>
        <further-classification edition="200601120260102B">G11C11/4063</further-classification>
        <further-classification edition="200601120260102B">G11C16/26</further-classification>
        <further-classification edition="200601120260102B">G11C16/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商廈門半導體工業技術研發有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIAMEN INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹家宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉美冬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘天龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白麗霞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭喆鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王悅蓉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種記憶體的資料讀取電路、方法及記憶體，其中，電路包括比較輸出單元和電路控制單元，比較輸出單元包括偽電流管和鎖存對管，比較輸出單元用於獲取預充信號和資料信號，以根據預充信號控制鎖存對管的輸出節點電壓處於預充電狀態或者資料讀取狀態；電流控制單元包括傳輸門，電流控制單元用於獲取傳輸門的控制信號，以根據控制信號、預充信號和資料信號控制鎖存對管的輸出節點電壓通過偽電流管進行放電，或者控制鎖存對管的輸出節點電壓穩定在第一電壓和第二電壓，以便進行資料讀取；由此，通過引入傳輸門電路，使得輸出節點電壓進行快速放電，同時通過鎖存對管使兩個輸出節點電壓分別穩定在第一電壓和第二電壓，從而降低了電路功耗。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">PM5:第五MOS管</p>
        <p type="p">PM6:第六MOS管</p>
        <p type="p">PM7:第七MOS管</p>
        <p type="p">PM8:第八MOS管</p>
        <p type="p">PM9:第九MOS管</p>
        <p type="p">PM10:第十MOS管</p>
        <p type="p">NM0:偽電流管</p>
        <p type="p">NM1:第一MOS管</p>
        <p type="p">NM2:第二MOS管</p>
        <p type="p">NM3:第三MOS管</p>
        <p type="p">NM4:第四MOS管</p>
        <p type="p">NM11:第十一MOS管</p>
        <p type="p">NM12:第十二MOS管</p>
        <p type="p">Latch:第二控制信號</p>
        <p type="p">Latchb:第一控制信號</p>
        <p type="p">VD:第二電壓</p>
        <p type="p">VS:第一電壓</p>
        <p type="p">VREF:參考電壓</p>
        <p type="p">SAE:預充信號</p>
        <p type="p">SAIN:資料信號</p>
        <p type="p">OUT:第一輸出節點電壓</p>
        <p type="p">OUTb:第二輸出節點電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1908" publication-number="202625188">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625188</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144994</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多值ＲＲＡＭ讀取電路及其讀取方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260112B">G11C13/00</main-classification>
        <further-classification edition="200601120260112B">G11C7/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商廈門半導體工業技術研發有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIAMEN INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何伊妮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃永宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王悅蓉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請的實施例提供了一種多值RRAM讀取電路及其讀取方法。該多值RRAM讀取電路包括：包括RRAM、電晶體、比較器、編碼器以及至少一D觸發器；所述電晶體的源極與位線相連接，其柵極與字線連接，其漏極與所述RRAM的一端相連接；所述RRAM的另一端與所述比較器的負輸入端連接，所述比較器的正輸入端與所述位線相連接；所述比較器的輸出端與所述D觸發器的輸入端相連接，所述D觸發器的輸出端與所述編碼器的輸入端相連接，所述編碼器用以將至少一所述D觸發器所輸出的信號轉化為對應的二進位數字字信號並輸出。本申請實施例的技術方案無需參考單元和ADC即可讀取多值RRAM所存儲的資訊，在減小讀取電路的版圖面積的同時，也降低了其功耗。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">M1:電晶體</p>
        <p type="p">A1:比較器</p>
        <p type="p">C1:電容</p>
        <p type="p">BL:位線</p>
        <p type="p">WL:字線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1909" publication-number="202625570">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625570</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145118</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包括包含高K材料的介電層之電容器、包括該電容器之電子裝置及製造該電容器之方法</chinese-title>
        <english-title>CAPACITOR INCLUDING DIELECTRIC LAYER INCLUDING HIGH-K MATERIAL, ELECTRONIC DEVICE INCLUDING THE CAPACITOR, AND METHOD OF MANUFACTURING THE CAPACITOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260225B">H10D1/60</main-classification>
        <further-classification edition="202301120260225B">H10B12/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金眞弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JINHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昌洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHANGSOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金聖鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNGHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李載昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JAEHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種包括包含一高k材料的一介電層之電容器及一種包括該電容器之電子裝置。該電容器包括：一第一電極；一第二電極，其面向該第一電極；一介電層，其位於該第一電極與該第二電極之間；以及一傳導界面層，其位於該第一電極與該介電層之間。該介電層包括具有一金紅石結晶相之一介電材料。該介電層包括設置於該介電層中之一第一中間層及一第二中間層。該第一中間層包括具有p型特性之金屬的氧化物。該第二中間層包括具有一金紅石結晶相之一第IV族金屬元素的氧化物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are a capacitor including a dielectric layer including a high-k material and an electronic device including the same. The capacitor includes a first electrode, a second electrode facing the first electrode, a dielectric layer between the first electrode and the second electrode, and a conductive interface layer between the first electrode and the dielectric layer. The dielectric layer includes a dielectric material having a rutile crystalline phase. The dielectric layer includes a first intermediate layer and a second intermediate layer which are provided in the dielectric layer. The first intermediate layer includes an oxide of metal having p-type characteristics. The second intermediate layer includes an oxide of a Group IV metal element having a rutile crystalline phase.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電容器</p>
        <p type="p">110:第一電極，電極</p>
        <p type="p">120:傳導界面層</p>
        <p type="p">121:第一傳導界面層</p>
        <p type="p">122:第二傳導界面層</p>
        <p type="p">130:介電層</p>
        <p type="p">131:第一中間層</p>
        <p type="p">132:第二中間層</p>
        <p type="p">140:第二電極，電極</p>
        <p type="p">g:間隙</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1910" publication-number="202624233">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624233</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145123</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>異山梨醇環氧衍生物化合物及其製備方法、環氧樹脂組合物及其固化物</chinese-title>
        <english-title>ISOSORBIDE EPOXY DERIVATIVE COMPOUND AND METHOD FOR PREPARING THE SAME, EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D493/04</main-classification>
        <further-classification edition="200601120260302B">C08G59/50</further-classification>
        <further-classification edition="200601120260302B">C08L63/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商國都化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUK DO CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>玉昌𤣮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OK, CHANG YUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金龍彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YONG BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及包含至少一個胺取代基的異山梨醇環氧衍生物化合物及其製備方法、環氧樹脂組合物及其固化物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1911" publication-number="202624966">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624966</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145274</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>控制器和儲存裝置</chinese-title>
        <english-title>CONTROLLER AND STORAGE DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260204B">G06F12/0866</main-classification>
        <further-classification edition="200601120260204B">G06F13/38</further-classification>
        <further-classification edition="200601120260204B">G06F13/14</further-classification>
        <further-classification edition="200601120260204B">G06F12/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商愛思開海力士有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK HYNIX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李熙源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HUI WON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宅珪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TAEK GYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種重置請求被預先設置以在儲存裝置中發生不可恢復錯誤時，透過控制器的硬體配置傳送到主機裝置。因此，可以提供一種能夠快速穩定地從主機裝置接收硬體重置訊號並且執行快速恢復操作的儲存裝置及其操作方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A reset request is set in advance to be transmitted to a host device through a hardware configuration of a controller when an unrecoverable error occurs in a storage device. Therefore, it is possible to provide a storage device capable of quickly and stably receiving a hardware reset signal from a host device and performing a fast recovery operation, and an operating method thereof.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:儲存裝置</p>
        <p type="p">110:記憶體</p>
        <p type="p">120:控制器</p>
        <p type="p">200:主機裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1912" publication-number="202624472">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624472</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145313</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光阻劑剝離組成物及方法</chinese-title>
        <english-title>PHOTORESIST STRIPPING COMPOSITIONS AND METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C11D3/43</main-classification>
        <further-classification edition="200601120260102B">C11D7/50</further-classification>
        <further-classification edition="200601120260102B">G03F7/42</further-classification>
        <further-classification edition="200601120260102B">B08B3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商陶氏全球科技有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOW GLOBAL TECHNOLOGIES LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商陶氏化學韓國有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOW CHEMICAL KOREA LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桂秦源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUI, QINYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈澄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REN, HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金宗鐵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JONGCHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>築島新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUKISHIMA, SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳吉濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JITAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於光阻劑剝離應用之溶劑混合物，其包含：由至少兩種組分構成之深共熔溶劑(deep eutectic solvent, DES)，其包含以下中之一者：呋喃衍生物及四氫呋喃衍生物；呋喃衍生物及一或多種選自由苯乙酮、百里酚(thymol)、及三乙醇胺組成之群組的溶劑；四氫呋喃衍生物及一或多種選自由苯乙酮、百里酚、及三乙醇胺組成之群組的溶劑；或至少兩種呋喃或四氫呋喃衍生物；及一或多種二醇醚溶劑。一種移除光阻劑之方法，其包含：將溶劑混合物施加至包含光阻劑之基材，該溶劑混合物包含：由至少兩種組分構成之深共熔溶劑(DES)及一或多種二醇醚溶劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A solvent mixture for photoresist stripping applications, comprising: a deep eutectic solvent (DES) composed of at least two components comprising one of: a furan derivative and a tetrahydrofuran derivative; a furan derivative and one or more solvents selected from a group consisting of acetophenone, thymol, and triethanol amine; a tetrahydrofuran derivative and one or more solvents selected from a group consisting of acetophenone, thymol, and triethanol amine; or at least two furan or tetrahydrofuran derivatives; and one or more glycol ether solvents. A method of removing a photoresist, comprising: applying a solvent mixture to a substrate comprising a photoresist, the solvent mixture comprising: a deep eutectic solvent (DES) composed of at least two components and one or more glycol ether solvents.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1913" publication-number="202625565">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625565</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145334</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體積體電路元件及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120251202B">H10B63/00</main-classification>
        <further-classification edition="202301120251202B">H10N70/00</further-classification>
        <further-classification edition="202301120251202B">H10N70/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商廈門半導體工業技術研發有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳安喬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱泰瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, TAI WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇小麗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康賜俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, SZU-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李武新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種半導體積體電路元件及其製造方法，該半導體積體電路元件包括阻變層，以及分別位於阻變層兩側且相對的底電極和頂電極，其中，底電極包括由至少兩種電極材料縱向交替形成的至少兩層底電極層，不同電極材料形成的底電極層的橫向尺寸不同；阻變層隨型覆蓋底電極的側表面，頂電極隨型覆蓋阻變層的側表面。由於阻變層覆蓋在底電極的側表面，可通過增加底電極堆疊層數的方式增大阻變區域的面積，從而有效降低導電細絲形成電壓，垂直的阻變區域還可以有效避免阻變層的蝕刻損傷對半導體積體電路元件的性能影響，有利於提高元件的穩定性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板</p>
        <p type="p">101:通孔</p>
        <p type="p">102:底電極</p>
        <p type="p">103:阻變層</p>
        <p type="p">104:頂電極</p>
        <p type="p">201、202:底電極層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1914" publication-number="202625227">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625227</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145479</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>PCB磁性組件</chinese-title>
        <english-title>PCB MAGNETIC ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">H01F27/28</main-classification>
        <further-classification edition="200601120260122B">H01F17/00</further-classification>
        <further-classification edition="200601120260122B">H01F17/04</further-classification>
        <further-classification edition="200601120260122B">H01F19/00</further-classification>
        <further-classification edition="200601120260122B">H01F27/26</further-classification>
        <further-classification edition="200601120260122B">H01F27/29</further-classification>
        <further-classification edition="200601120260122B">H05K1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>常學良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, XUELIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭興新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, XINGXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種PCB磁性組件包括多層電路板支架結構和磁性組件。多層電路板支架結構包含多層電路板，相對的上表面和下表面分別包括有上連接位和下連接位。多層電路板包括上凹槽、下凹槽和支撐層。支撐層位於上凹槽和下凹槽間。支撐層為N層電路板，N≧1，支撐層包括銅層和M個貫穿的孔洞，M≧2，銅層環設于孔洞周圍，形成繞組。銅層包括第一端與多層電路板的上連接位電連接；第二端與多層電路板的下連接位電連接。多層電路板的上、下表面構成PCB磁性組件的上、下表面。磁性組件設置於多層電路板支架結構內。磁性組件部分穿過支撐層的孔洞。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A PCB magnetic assembly is disclosed and includes a multi-layer circuit board bracket structure and a magnetic component. The multi-layer circuit board bracket structure includes a multi-layer circuit board having an upper surface and a lower surface opposite to each other, including an upper connection position and a lower connection position, respectively. The multi-layer circuit board includes an upper recess, a lower recess and a support layer. The support layer is located between the upper recess and the lower recess. The support layer is an N-layer circuit board, wherein N≧1. The support layer includes a copper layer and M through holes, wherein M≧2. The copper layer is arranged around the through holes to form a winding. The copper layer includes a first terminal electrically connected to the upper connection position of the multi-layer circuit board, and a second terminal electrically connected to the lower connection position of the multi-layer circuit board. The upper surface and the lower surface of the multi-layer circuit board form an upper surface and a lower surface of the PCB magnetic assembly. The magnetic component is arranged in the multi-layer circuit board bracket structure, wherein a portion of the magnetic component passes through the through holes of the support layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:PCB磁性組件</p>
        <p type="p">10:多層電路板支架結構</p>
        <p type="p">11:多層電路板</p>
        <p type="p">12:上表面</p>
        <p type="p">121:上連接位</p>
        <p type="p">13:下表面</p>
        <p type="p">14:上凹槽</p>
        <p type="p">16:支撐層</p>
        <p type="p">161:銅層</p>
        <p type="p">162:孔洞</p>
        <p type="p">17:板邊鍍銅</p>
        <p type="p">20:磁性組件</p>
        <p type="p">21:上磁芯</p>
        <p type="p">211:上磁柱</p>
        <p type="p">212:上磁蓋</p>
        <p type="p">22:下磁芯</p>
        <p type="p">221:下磁柱</p>
        <p type="p">222:下磁蓋</p>
        <p type="p">S1:第一側面</p>
        <p type="p">S2:第二側面</p>
        <p type="p">S3:第三側面</p>
        <p type="p">S4:第四側面</p>
        <p type="p">X、Y、Z:軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1915" publication-number="202625446">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625446</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145480</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於終端播放品質來調整編碼器參數的雲端遊戲終端設備與雲端遊戲伺服器以及相關方法</chinese-title>
        <english-title>CLOUD GAMING TERMINAL DEVICE AND CLOUD GAMING SERVER AND METHODS FOR ADJUSTING ENCODER PARAMETERS BASED ON TERMINAL PLAYBACK QUALITY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201101120260102B">H04N21/422</main-classification>
        <further-classification edition="201101120260102B">H04N21/234</further-classification>
        <further-classification edition="201101120260102B">H04N21/233</further-classification>
        <further-classification edition="202201120260102B">H04L69/164</further-classification>
        <further-classification edition="201401120260102B">A63F13/33</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭建宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHIEN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅柏欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, PO-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種雲端遊戲終端設備，包含：一播放品質評估單元與一回饋引擎客戶端。該播放品質評估單元用於根據該雲端遊戲終端設備中的一網路介面控制單元、一媒體解碼單元以及一媒體渲染單元中之至少一者所提供的資訊，產生至少一播放品質評估參數。該回饋引擎客戶端用於透過一網路將該至少一播放品質評估參數傳送至一雲端遊戲伺服器。其中，該雲端遊戲伺服器根據接收到的該至少一播放品質評估參數調整一媒體串流的至少一媒體編碼參數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cloud gaming terminal device includes a playback quality evaluation unit and a feedback engine client. The playback quality evaluation unit is configured to generate at least one playback quality evaluation parameter based on information provided by at least one of a network interface control unit, a media decoding unit, and a media rendering unit within the cloud gaming terminal device. The feedback engine client is configured to transmit at least one playback quality evaluation parameter to a cloud gaming server through a network. The cloud gaming server is configured to adjust at least one media encoding parameter of a media stream according to the received playback quality evaluation parameter.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:雲端遊戲系統</p>
        <p type="p">50:網路</p>
        <p type="p">100:雲端遊戲終端設備</p>
        <p type="p">103:網路介面控制單元</p>
        <p type="p">105:媒體解碼單元</p>
        <p type="p">110:視訊解碼器</p>
        <p type="p">120:音訊解碼器</p>
        <p type="p">107:媒體渲染單元</p>
        <p type="p">130:播放品質評估單元</p>
        <p type="p">140:回饋引擎客戶端</p>
        <p type="p">150:顯示設備</p>
        <p type="p">160:音訊設備</p>
        <p type="p">200:雲端遊戲伺服器</p>
        <p type="p">201:來源串流</p>
        <p type="p">203:網路介面控制單元</p>
        <p type="p">205:媒體編碼單元</p>
        <p type="p">210:視訊編碼器</p>
        <p type="p">220:音訊編碼器</p>
        <p type="p">230:編碼器參數計算單元</p>
        <p type="p">240:回饋引擎伺服器端</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1916" publication-number="202624928">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624928</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145569</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磁芯組裝治具及電源模塊組裝方法</chinese-title>
        <english-title>MAGNETIC CORE ASSEMBLING FIXTURE AND ASSEMBLING METHOD OF POWER MODULE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">G06F1/26</main-classification>
        <further-classification edition="200601120260309B">H05K13/04</further-classification>
        <further-classification edition="200601120260309B">H02M3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舒文佩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHU, WENPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種磁芯組裝治具，適用於組裝電源模塊。電源模塊包含功率板、第一磁芯和第二磁芯。第一磁芯和第二磁芯設置於功率板的兩相對側。第一壓合模組包含第一基板、第一彈性件、第一卡扣和第二卡扣。多個第一彈性件設置於第一基板，抵頂於第一磁芯。第一卡扣和第二卡扣相對設置於第一基板的兩側，且用於抵接連片結構。第二壓合模組包含第二基板、第二彈性件、第三卡扣和第四卡扣。第二彈性件設置於第二基板，抵頂於第二磁芯。第三卡扣和第四卡扣相對設置於第二基板的兩側，且用於抵接第一壓合模組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A magnetic core assembling fixture for assembling a power module is disclosed. The power module includes a power board, a first magnetic core, and a second magnetic core. The first magnetic core and the second magnetic core are disposed on two opposite sides of the power board. A first pressing module includes a first substrate, a plurality of first elastic members, a first latch, and a second latch. The plurality of first elastic members are disposed on the first substrate, and abut against the first magnetic core. The first latch and the second latch are disposed on opposite sides of the first substrate, and are configured to engage a connecting-sheet structure. A second pressing module includes a second substrate, a plurality of second elastic members, a third latch, and a fourth latch. The second elastic members are disposed on the second substrate, and abut against the second magnetic core. The third latch and the fourth latch are disposed on opposite sides of the second substrate, and are configured to engage the first pressing module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第一壓合模組</p>
        <p type="p">11:第一基板</p>
        <p type="p">11a:第一基板頂面</p>
        <p type="p">11b:第一基板底面</p>
        <p type="p">11c:第一基板側面</p>
        <p type="p">12:第一彈性件</p>
        <p type="p">13:第一卡扣</p>
        <p type="p">131:勾狀部</p>
        <p type="p">131a:第一平面</p>
        <p type="p">14:第二卡扣</p>
        <p type="p">141:勾狀部</p>
        <p type="p">141a:第一平面</p>
        <p type="p">15:定位銷</p>
        <p type="p">200:電源模塊</p>
        <p type="p">201a:連片基板</p>
        <p type="p">201b:連片單元</p>
        <p type="p">202:功率板</p>
        <p type="p">202a:磁芯槽</p>
        <p type="p">202b:第一面</p>
        <p type="p">202c:第二面</p>
        <p type="p">202d:第三面</p>
        <p type="p">202e:第四面</p>
        <p type="p">203:磁芯組</p>
        <p type="p">203a:第一磁芯</p>
        <p type="p">203b:第二磁芯</p>
        <p type="p">2:第二壓合模組</p>
        <p type="p">21:第二基板</p>
        <p type="p">21a:第二基板頂面</p>
        <p type="p">21b:第二基板底面</p>
        <p type="p">21c:第二基板側面</p>
        <p type="p">22:第二彈性件</p>
        <p type="p">23:第三卡扣</p>
        <p type="p">231:勾狀部</p>
        <p type="p">231a:第二平面</p>
        <p type="p">24:第四卡扣</p>
        <p type="p">241:勾狀部</p>
        <p type="p">241a:第二平面</p>
        <p type="p">A:區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1917" publication-number="202624957">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624957</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145707</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>資源分配調整</chinese-title>
        <english-title>RESOURCE ALLOCATION ADJUSTMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G06F9/50</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商ＡＲＭ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARM LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾約萊　姆布</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EYOLE, MBOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博徹　馬蒂亞斯洛塔爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOETTCHER, MATTHIAS LOTHAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文森　雨果約翰馬汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VINCENT, HUGO JOHN MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加爾西亞-托賓　卡洛斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARCIA-TOBIN, CARLOS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種設備包括：解碼電路系統，其經組態以解碼指令；處理電路系統，其經組態以回應於由該解碼電路系統解碼之該等指令而執行資料處理操作；延伸處理電路系統，其經組態以相對於由該處理電路系統執行的資料處理操作異步地執行其他資料處理操作；一延伸任務卸載介面，其與該處理電路系統藉由其向一記憶體系統發布一記憶體系統請求的一介面分開，其中該延伸任務卸載介面回應於由該解碼電路系統解碼之至少一個任務卸載指令，而將該等其他資料處理操作卸載至該延伸處理電路系統；及資源分配調整電路系統，其經組態以回應於一資源調整指示而調整該處理電路系統與該延伸處理電路系統之間的一資源分配。  &lt;br/&gt;[圖6]</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus includes decoding circuitry configured to decode instructions; processing circuitry configured to perform data processing operations in response to the instructions decoded by the decoding circuitry; extension processing circuitry configured to perform other data processing operations asynchronously with respect to data processing operations performed by the processing circuitry; an extension task offload interface separate from an interface by which the processing circuitry issues a memory system request to a memory system, wherein the extension task offload interface is responsive to at least one task offloading instruction decoded by the decoding circuitry to offload the other data processing operations to the extension processing circuitry; and resource allocation adjustment circuitry configured to adjust a resource allocation between the processing circuitry and the extension processing circuitry responsive to a resource adjustment indication. &lt;br/&gt;[Figure 6]</p>
      </isu-abst>
      <representative-img>
        <p type="p">6:處理電路系統</p>
        <p type="p">10:設備；處理器；上下文；CPU；請求者；資料處理設備</p>
        <p type="p">13:解碼電路系統；解碼級</p>
        <p type="p">23:延伸處理電路系統；小執行緒延伸；延伸電路系統</p>
        <p type="p">24:延伸任務卸載介面；延伸卸載介面</p>
        <p type="p">60:資源分配調整電路系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1918" publication-number="202624077">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624077</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145739</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>人力車輛變速器</chinese-title>
        <english-title>HUMAN-POWERED VEHICLE DERAILLEUR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251231B">B62M9/12</main-classification>
        <further-classification edition="201001120251231B">B62M9/122</further-classification>
        <further-classification edition="201001120251231B">B62M9/132</further-classification>
        <further-classification edition="201001120251231B">B62M9/1244</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商島野股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMANO INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤本尚希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIMOTO, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倉地剛志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURACHI, TSUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野﨑晃央</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOZAKI, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小出智貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOIDE, TOMOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立花克裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TACHIBANA, KATSUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">人力車輛變速器，包括基座構件、可動構件、電致動器和電子控制器電路。電子控制器電路配置為控制電致動器移動可動構件，使得可動構件在可動構件從起始位置移動到該/一位置的過程中經過中間位置。第一平均值是當可動構件從中間位置移動到第一位置時提供給電致動器的電量的平均值。第一附加平均值是當可動構件從起始位置移動到中間位置時提供給電致動器的電量的平均值。第一附加平均值低於第一平均值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A human-powered vehicle derailleur comprises a base member, a movable member, an electric actuator, and electronic controller circuitry. The electronic controller circuitry is configured to control the electric actuator to move the movable member such that the movable member passes through an intermediate position during movement of the movable member from a start position to the/ a position. A first average is an average of an electrical quantity which is supplied to the electric actuator when the movable member moves from the intermediate position to the first position. A first additional average is an average of an electrical quantity which is supplied to the electric actuator when the movable member moves from the start position to the intermediate position. The first additional average is lower than the first average.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:人力車輛</p>
        <p type="p">3:操作裝置</p>
        <p type="p">4:操作裝置</p>
        <p type="p">14:可動構件</p>
        <p type="p">20:連桿結構</p>
        <p type="p">22:第一連桿構件</p>
        <p type="p">26:第一連桿銷</p>
        <p type="p">34:電致動器</p>
        <p type="p">35:馬達</p>
        <p type="p">36:齒輪結構</p>
        <p type="p">38:齒輪</p>
        <p type="p">50:電子控制器電路</p>
        <p type="p">50C:電路板</p>
        <p type="p">50D:系統匯流排</p>
        <p type="p">50M:記憶體</p>
        <p type="p">50P:處理器</p>
        <p type="p">51:連接器埠</p>
        <p type="p">52:馬達驅動器</p>
        <p type="p">54:通訊器電路</p>
        <p type="p">54A:有線通訊器</p>
        <p type="p">56:位置感測器</p>
        <p type="p">64:可動構件</p>
        <p type="p">70:連桿結構</p>
        <p type="p">74:電致動器</p>
        <p type="p">75:馬達</p>
        <p type="p">76:齒輪結構</p>
        <p type="p">78:齒輪</p>
        <p type="p">80:電子控制器電路</p>
        <p type="p">80C:電路板</p>
        <p type="p">80D:系統匯流排</p>
        <p type="p">80M:記憶體</p>
        <p type="p">80P:處理器</p>
        <p type="p">81:連接器埠</p>
        <p type="p">82:馬達驅動器</p>
        <p type="p">84:通訊器電路</p>
        <p type="p">84A:有線通訊器</p>
        <p type="p">84B:有線通訊器</p>
        <p type="p">86:位置感測器</p>
        <p type="p">CS11:控制訊號</p>
        <p type="p">CS12:控制訊號</p>
        <p type="p">CS21:控制訊號</p>
        <p type="p">CS22:控制訊號</p>
        <p type="p">DU:輔助驅動單元</p>
        <p type="p">EC:電子佈線結構</p>
        <p type="p">FD:人力車輛變速器</p>
        <p type="p">P1:位置</p>
        <p type="p">P2:位置</p>
        <p type="p">P3:位置</p>
        <p type="p">P4:位置</p>
        <p type="p">PS:電源</p>
        <p type="p">RD:人力車輛變速器</p>
        <p type="p">U11:使用者輸入</p>
        <p type="p">U12:使用者輸入</p>
        <p type="p">U21:使用者輸入</p>
        <p type="p">U22:使用者輸入</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1919" publication-number="202625400">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625400</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145741</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於無線區域網路之實體層存取控制方法、實體層授權驗證方法、相關無線存取裝置、無限接收裝置及其相關非暫態電腦可讀媒體</chinese-title>
        <english-title>PHYSICAL LAYER ACCESS CONTROL METHOD FOR WLAN, PHYSICAL LAYER AUTHENTICATION AND AUTHORIZATION METHOD FOR WLAN, RELATED WIRELESS ACCESS DEVICE, WIRELESS RECEPTION DEVICE AND RELATED NON-TRANSITORY COMPUTER-READABLE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H04L5/00</main-classification>
        <further-classification edition="200601120260102B">H04L25/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英特博股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTELPRO INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方瑞達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, JUI-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳貴祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUEI-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王士瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佳宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIA-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張尹劭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YIN-SHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡尚達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, SHANG-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連育廣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIEN, YU-KUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於無線區域網路之實體層存取控制方法，於正交分頻多工封包的前導碼部份選擇性地對若干非零子載波之相位施加單位增益之存取控制碼符號序列，授權判定可於封包偵測期間或於完成同步與粗頻偏估測後進行；通過者得以據該序列快速判定存取權限並進行通道估測與後續解調；未授權接收端則因相位嵌碼使其前導碼偵測/通道估測失配而無法正確同步或解讀，該序列可由正交矩陣導出、預存於裝置或經專有協定動態協商，並可依使用者/服務類型切換，以同時達成裝置識別、服務區隔與CSI偽造抑制。另揭露對應之發送/接收裝置與非暫態電腦可讀媒體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A physical-layer access-control method for WLAN embeds a unit-gain access-code symbol sequence into phases of selected non-zero subcarriers within preamble components. Authorized receivers verify the sequence either during packet detection or after synchronization and coarse CFO estimation to grant access and proceed with channel estimation and demodulation, while unauthorized devices fail to synchronize or obtain valid channel estimates due to intentional phase embedding. The sequence can be derived from orthogonal matrices, stored or negotiated via a proprietary protocol, and switched per user/service to enable device identification, service differentiation, and CSI-spoofing mitigation. Corresponding transmitter/receiver devices and non-transitory computer-readable media are also disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">30:發送端相位嵌碼流程</p>
        <p type="p">302-306:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1920" publication-number="202624597">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624597</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145750</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>混凝土天花板或混凝土牆、用於製造其的中空體及中空體的用途</chinese-title>
        <english-title>A CONCRETE CEILING OR A CONCRETE WALL, HOLLOW BODY FOR PRODUCING A CONCRETE CEILING OR A CONCRETE WALL, AND USE OF HOLLOW BODY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260214B">E04B5/32</main-classification>
        <further-classification edition="200601120260214B">E04B5/36</further-classification>
        <further-classification edition="200601120260214B">E04B2/84</further-classification>
        <further-classification edition="200601120260214B">E04B9/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商科比亞克斯有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COBIAX GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱爾門迪　梅莫特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KELMENDI, MEHMET</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種中空體(1)，用於製造一混凝土天花板或混凝土牆(10)，其包括：一第一半殼體(2)；及一第二半殼體(3)；其中該第一半殼體(2)及該第二半殼體(3)在一接觸面上相互對接並包圍至少一封閉空腔，該第一半殼體(2)透過複數緊固裝置(4)固定在該第二半殼體(3)上；至少一密封元件(25, 35)設置在該接觸面上，並由一材料製成，該材料的彈性高於第一半殼體(2)的材料和/或第二半殼體(3)的材料。藉此，該第一半殼體(2)與該第二半殼體(3)之間的該至少一封閉空腔在澆築混凝土時能牢固密封。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A hollow body (1) for producing a concrete ceiling or concrete wall (10) comprises a first half-shell (2) and a second half-shell (3) which abut each other at a contact surface and surround at least one closed cavity, wherein the first half-shell (2) is held on the second half-shell (3) via fastening means (4), wherein at least one sealing element (25, 35) made of a material having a higher elasticity than the material of the first half-shell (2) and/or the second half-shell (3) is provided at the contact surface. This allows the at least one closed cavity between the first half-shell (2) and the second half-shell (3) to be securely sealed when pouring concrete.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:半殼體</p>
        <p type="p">20:殼體元件</p>
        <p type="p">21:連接肋</p>
        <p type="p">22:邊緣</p>
        <p type="p">23:邊緣</p>
        <p type="p">24:開口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1921" publication-number="202624254">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624254</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145757</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>二鏈嵌合神經毒素及其生產方法及用途、醫藥組成物及其用途、套組、單鏈多肽及其生產方法、核苷酸序列、載體、細胞、以及嵌合神經毒素的活性二鏈形式及其用途</chinese-title>
        <english-title>DI-CHAIN CHIMERIC NEUROTOXINS AND PRODUCTION METHODS AND USES THEREOF; PHARMACEUTICAL COMPOSITIONS AND USES THEREOF; KITS; SINGLE-CHAIN POLYPEPTIDES AND PRODUCTION METHODS THEREOF; NUCLEOTIDE SEQUENCES; VECTORS; CELLS; AND ACTIVE DI-CHAIN FORMS OF CHIMERIC NEUROTOXINS AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">C07K14/33</main-classification>
        <further-classification edition="200601120260304B">C12N9/52</further-classification>
        <further-classification edition="200601120260304B">A61K38/16</further-classification>
        <further-classification edition="200601120260304B">A61P21/00</further-classification>
        <further-classification edition="200601120260304B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商艾普森生物製藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IPSEN BIOPHARM LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖　世民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, SAI MAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種具有增強的性質之嵌合神經毒素及其於治療上之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to chimeric neurotoxins with enhanced properties and their use in therapy.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1922" publication-number="202623937">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623937</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145873</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>玻璃基板的雷射加工方法及加工台</chinese-title>
        <english-title>LASER PROCESSING METHOD FOR GLASS SUBSTRATE AND STAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260302B">B23K26/53</main-classification>
        <further-classification edition="202601120260302B">H10W70/63</further-classification>
        <further-classification edition="202601120260302B">H10P72/78</further-classification>
        <further-classification edition="202601120260302B">H10W70/692</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商愛玻索立克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABSOLICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴鍾玄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JONG HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金鎭哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JINCHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">實施方式公開一種玻璃基板的雷射加工方法及加工台。玻璃基板的雷射加工方法包括：在佈置有通氣膜的加工台上以留有空間的方式佈置玻璃基板的佈置步驟；以及在上述玻璃基板上照射雷射以形成缺陷的加工步驟；透過上述步驟製備形成有缺陷的玻璃基板。加工台為適用於雷射加工的加工台，其包括：加工台主體；支撐部，以突出的方式佈置於上述加工台主體上；加工台腔體，由上述支撐部圍繞且上部開放；及銷，允許上下移動；上述銷在上述加工台腔體內佈置一個或兩個以上，上述加工台主體具有金屬表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The embodiments disclose a laser processing method for a glass substrate and a stage. The method comprises: a placement operation of disposing the glass substrate with a space above a stage on which a venting film is disposed; and a processing operation of irradiating a laser onto the glass substrate to form defects, thereby manufacturing the glass substrate in which the defects are formed. The stage, which is applied to laser processing, comprises: a stage main body; a support rim protruding from the stage main body; a stage cavity surrounded by the support rim and open at a top; and a pin permitted to move vertically; wherein the pin is disposed in the stage cavity in a number of one or two or more, and the stage main body has a metal surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:加工台</p>
        <p type="p">110:加工台主體</p>
        <p type="p">120:支撐部</p>
        <p type="p">125:接地安置部</p>
        <p type="p">127:連接部</p>
        <p type="p">130:銷</p>
        <p type="p">135:銷安置部</p>
        <p type="p">140:真空泵</p>
        <p type="p">200:通氣膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1923" publication-number="202623907">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623907</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145891</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>決定方法、液體供給方法、物品製造方法、存儲媒體、資訊處理裝置及液體供給裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260225B">B05C11/10</main-classification>
        <further-classification edition="200601120260225B">B41J2/01</further-classification>
        <further-classification edition="200601120260225B">B41J2/025</further-classification>
        <further-classification edition="200601120260225B">B41J2/07</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANON KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤正裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>猪股裕也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOMATA, YUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中山周吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAYAMA, SHUGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中澤広一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAZAWA, KOICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供有利於向基板上高精度供給液滴的技術。決定方法在使一邊在一個方向排列多個排出孔的噴頭和基板在掃描方向相對掃描並一邊從各排出孔排出液滴的處理中，決定用於分別對在上述基板上沿上述掃描方向排列的多個目標區域從各排出孔供給液滴的條件，基於多種資訊決定上述噴頭相對於上述掃描方向的傾斜量作為條件，上述多種資訊包括：有關多個排出孔的間距的第1資訊；有關多個目標區域的間距的第2資訊；有關噴頭和基板的相對掃描速度的第3資訊；有關直到因液滴排出在1個排出孔發生的振動的振幅在相鄰排出孔中達到容許範圍內為止的時間的第4資訊；以及有關因液滴排出在1個排出孔發生的振動的振幅達到容許範圍內的相距該1個排出孔的距離的第5資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:液體供給裝置</p>
        <p type="p">2:基板</p>
        <p type="p">3:基板載台</p>
        <p type="p">4:排出頭</p>
        <p type="p">4a:排出面</p>
        <p type="p">5:液滴</p>
        <p type="p">6:驅動機構</p>
        <p type="p">7:控制部</p>
        <p type="p">8:目標區域</p>
        <p type="p">30:噴嘴列(排出孔列)</p>
        <p type="p">31:噴嘴(排出孔)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1924" publication-number="202625862">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625862</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145962</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W74/00</main-classification>
        <further-classification edition="202601120260302B">H10W72/20</further-classification>
        <further-classification edition="202601120260302B">H10W20/20</further-classification>
        <further-classification edition="202601120260302B">H10W74/01</further-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹佩華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAO, PEI-HAW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱立寰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, LI-HUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳有志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁得期</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, TE-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開提供了一種半導體結構。該半導體結構包括第一介電層、第一金屬層和阻障層。該第一金屬層設置於該第一介電層上。該阻障層覆蓋該第一金屬層的上表面和側表面。該阻障層包括位於該第一金屬層上方的第一通孔。此外，該阻障層包括一種金屬間化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure is provided. The semiconductor structure includes a first dielectric layer, a first metal layer, and a barrier layer. The first metal layer is disposed on the first dielectric layer. The barrier layer covers an upper surface and side surfaces of the first metal layer. The barrier layer includes a first via hole above the first metal layer. Moreover, the barrier layer includes an intermetallic compound.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體結構</p>
        <p type="p">102:基板</p>
        <p type="p">104a:第一介電層</p>
        <p type="p">104b:第二介電層</p>
        <p type="p">104V:第二通孔</p>
        <p type="p">106:種子層</p>
        <p type="p">106a:第一子層</p>
        <p type="p">106b:第二子層</p>
        <p type="p">108a:第一金屬層</p>
        <p type="p">108b:第二金屬層</p>
        <p type="p">108d:側表面</p>
        <p type="p">108m:下表面</p>
        <p type="p">108t:上表面</p>
        <p type="p">110:阻障層</p>
        <p type="p">110C:金屬間化合物</p>
        <p type="p">110V:第一通孔</p>
        <p type="p">S1:第一部分</p>
        <p type="p">S2:第二部分</p>
        <p type="p">T110-2:厚度</p>
        <p type="p">W108a:寬度</p>
        <p type="p">X:方向</p>
        <p type="p">Y:方向</p>
        <p type="p">Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1925" publication-number="202625159">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625159</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146004</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>音訊語言模型中的多輪對話</chinese-title>
        <english-title>MULTI-TURN CONVERSATIONS IN AUDIO LANGUAGE MODELS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">G10L15/22</main-classification>
        <further-classification edition="202501120260309B">G06F16/332</further-classification>
        <further-classification edition="202301120260309B">G06N3/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施里達　阿文德　克利希納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SRIDHAR, ARVIND KRISHNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝藍葛　珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BELANGER, JAW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭寅一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, YINYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維瑟　艾瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VISSER, ERIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦卡達　納文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAKADA, NAVEEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬富茲　蕾哈娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAHFUZ, REHANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述用於機器學習的系統及技術。一種裝置可包括一或多個記憶體，該一或多個記憶體經組態以儲存輸入資料。一種裝置可包括一或多個處理器，該一或多個處理器耦接至該一或多個記憶體且經組態以：獲得音訊資料；生成該音訊資料的文字表示；從該音訊資料生成後設資料；從一使用者裝置接收一使用者查詢；使用一第一機器學習模型處理該使用者查詢、該音訊資料的該等文字表示、從音訊資料生成的該後設資料；及與該音訊資料相關聯的一交談歷史記錄，以生成對該使用者查詢的一回應；及將該回應輸出至該使用者裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and techniques are described herein for machine learning. A device may include one or more memories configured to store input data. A device may include one or more processors coupled to the one or more memories and configured to: obtain audio data; generate text representations of the audio data; generate metadata from the audio data; receive a user query from a user device; process, using a first machine learning model, the user query, the text representations of the audio data, the metadata generated from audio data; and a conversation history associated with the audio data to generate a response to the user query; and output the response to the user device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:系統</p>
        <p type="p">302:音訊</p>
        <p type="p">304:音訊表示</p>
        <p type="p">306:文字投影</p>
        <p type="p">308:系統提示</p>
        <p type="p">310:後設資料</p>
        <p type="p">312:使用者查詢</p>
        <p type="p">314:查詢-答案對</p>
        <p type="p">316:損失；交叉熵損失</p>
        <p type="p">320:音訊編碼器</p>
        <p type="p">322:變換器編碼器；經變換編碼器</p>
        <p type="p">324a:層</p>
        <p type="p">324b:層</p>
        <p type="p">324n:層</p>
        <p type="p">326:線性投影模型</p>
        <p type="p">330:音訊分類裝置(ACD)</p>
        <p type="p">340:投影模組</p>
        <p type="p">350:大型語言模型(LLM)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1926" publication-number="202624840">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624840</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146078</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>投射裝置、其廣角鏡頭及廣角式投射方法</chinese-title>
        <english-title>PROJECTION DEVICE, WIDE-ANGLE LENS STRUCTURE THEREOF AND WIDE-ANGLE PROJECTION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">G02B27/18</main-classification>
        <further-classification edition="200601120260304B">G02B27/42</further-classification>
        <further-classification edition="200601120260304B">G02B13/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鉅嘉聯合科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIGA-IMAGE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉怡緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林修輊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIU-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種投射裝置、其廣角鏡頭及廣角式投射方法，其是關於具有準直透鏡組、繞射光學元件以及調整透鏡組的廣角鏡頭。其中，準直透鏡組、繞射光學元件與調整透鏡組從廣角鏡頭的第一側到廣角鏡頭的第二側依序排列。藉此，在提供具有大角度投射範圍的輸出光時，同時還能將整體光學畸變控制在有效的規格內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A projection device, wide-angle lens assembly thereof and wide-angle projection method is related to a wide-angle lens structure includes a collimating lens assembly, a diffractive optical element (DOE), and an adjustment lens assembly. The collimating lens assembly, the DOE, and the adjustment lens assembly are arranged sequentially from a first side to a second side of the wide-angle lens. Therefore, it can provide multiple output light with a wide-angle projection range, and simultaneously control overall optical distortion within effective specifications.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:投射裝置</p>
        <p type="p">12:廣角鏡頭</p>
        <p type="p">12a:第一側</p>
        <p type="p">12b:第二側</p>
        <p type="p">121:準直透鏡組</p>
        <p type="p">123:繞射光學元件</p>
        <p type="p">125:調整透鏡組</p>
        <p type="p">121a,121b,125a,125b:透鏡</p>
        <p type="p">14:光源模組</p>
        <p type="p">X,Y,Z:方向</p>
        <p type="p">O1:光軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1927" publication-number="202625490">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625490</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146127</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>無線區域網路系統中低延遲訊務通道存取之增強式管理</chinese-title>
        <english-title>ENHANCED MANAGEMENT OF LOW LATENCY TRAFFIC CHANNEL ACCESS IN WLAN SYSTEMS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260302B">H04W72/512</main-classification>
        <further-classification edition="202301120260302B">H04W72/29</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商內數位專利控股公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERDIGITAL PATENT HOLDINGS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樓　漢卿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOU, HANQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　曉飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, XIAOFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示使一無線區域網路(WLAN)中之一站台(STA)指示其透過一共用無線媒體傳輸高優先級訊務，諸如低延遲訊務之意圖之方法及設備。揭示由一STA傳輸指稱一低延遲訊務指示(LLTI)以及低延遲訊務之一信號之多項實施例。一存取點(AP)管理STA可傳輸該LLTI且出於傳輸低延遲訊務之目的而爭用該無線媒體所經受之條件。亦揭示用於在一AP與一STA之間協商該等條件之各種程序。揭示方法及設備之多項實施例。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and apparatuses are disclosed for a station (STA) in a Wireless Local Area Network (WLAN) to indicate its intent to transmit high priority traffic, such as low latency traffic, over a shared wireless medium. Multiple embodiments for the transmission by a STA of a signal referred to as a Low Latency Traffic Indication (LLTI) as well as low latency traffic are disclosed. An Access Point (AP) manages the conditions subject to which STAs may transmit the LLTI and contend for the wireless medium for the purpose of transmitting low latency traffic. Various procedures for negotiating said conditions between an AP and a STA are also disclosed. Multiple embodiments of methods and apparatuses are disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">511:低延遲訊務指示(LLTI)請求訊框</p>
        <p type="p">512:LLTI請求</p>
        <p type="p">521:LLTI回應訊框</p>
        <p type="p">522:LLTI回應</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1928" publication-number="202625486">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625486</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146212</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>位置管理方法及設備，以及非暫態電腦可讀媒體</chinese-title>
        <english-title>METHOD AND DEVICE FOR LOCATION MANAGEMENT AND NON-TRANSITORY COMPUTER-READABLE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260222B">H04W64/00</main-classification>
        <further-classification edition="201801120260222B">H04W4/90</further-classification>
        <further-classification edition="201001120260222B">G01S19/48</further-classification>
        <further-classification edition="202201120260222B">H04L69/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡達巴　斯里尼迪　蓋亞特里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KADABA SRINIDHI, GAYATHRI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿羅拉　拉利特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARORA, LALIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金泰振</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, TAEJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓相賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, SANGHYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露一種用於位置管理的系統和方法。系統和方法包括基於用戶設備接收來自核心網路或與用戶設備的核心網路關聯的基地台的請求，向用戶設備（user equipment，UE）的積體電路發送第一位置資訊的請求；基於當計時器過期時第一位置資訊的接收處於待處理狀態，判斷第一位置資訊的請求超時；基於第一位置資訊的請求超時，判斷不同於第一位置資訊的第二位置資訊；以及向基地台發送回應訊息，回應訊息包括第二位置資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and methods are disclosed for location management. The systems and methods include sending, to an integrated circuit of a user equipment (UE), a request for first position information based on the UE receiving a request from a core network or a base station associated with a core network of the UE; determining that the request for the first position information times out based on receipt of the first position information being in a pending state when a timer expires; determining, based on the request for the first position information timing out, second position information different from the first position information; and sending a response message to the base station, the response message comprising the second position information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">700:方法</p>
        <p type="p">705、710、715、720:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1929" publication-number="202625307">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625307</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146263</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電連接器</chinese-title>
        <english-title>ELECTRICAL CONNECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260108B">H01R13/24</main-classification>
        <further-classification edition="200601120260108B">H01R13/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英屬開曼群島商鴻騰精密科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOXCONN INTERCONNECT TECHNOLOGY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>KY</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許碩修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, SHUO-HSIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種電連接器，包括絕緣本體及複數導電端子；絕緣本體設有複數收容槽及連通收容槽的固持槽；導電端子包括上、下端子片，上端子片包括固持於固持槽的上固持部、向上傾斜的上彈性臂、裸露於上表面的上接觸部，自上固持部向下傾斜的上連接部；下端子片包括固持於固持槽且位於上固持部下方的下固持部、向下傾斜的下彈性臂、裸露於下表面的下接觸部，自下固持部向上傾斜的下連接部；上連接部與下固持部搭接而電導通，下連接部與上固持部搭接而電導通。本發明一端子片的連接部與另一端子片的固持部搭接，兩端子片之間形成可靠連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrical connector includes an insulating housing and plural conductive terminals, the insulating housing has plural receiving passages and plural retaining slots communicating with corresponding receiving passages. Each of the conductive terminals includes an upper piece and a lower piece. The upper piece includes an upper retaining portion retained in the retaining slot, an upper elastic arm slanting upwards, an upper contacting portion above the upper face, and an upper connecting portion slanting downwards from the upper retaining portion. The lower piece includes a lower retaining portion retained in the retaining slot and below the upper retaining portion, a lower elastic arm slanting downwards, a lower contacting portion below the lower face, and a lower connecting portion slanting upwards from the lower retaining portion. The upper connecting portion mechanically and electrically connects with the lower retaining portion and the lower connecting portion mechanically and electrically connects with the upper retaining portion. The connecting portion of one piece contacts the retaining portion of another piece, thereby ensuring the two pieces to have a reliable connection.</p>
      </isu-abst>
      <representative-img>
        <p type="p">21:上端子片</p>
        <p type="p">211:上固持部</p>
        <p type="p">214:上連接部</p>
        <p type="p">22:下端子片</p>
        <p type="p">221:下固持部</p>
        <p type="p">224:下連接部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1930" publication-number="202624340">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624340</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146313</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>固化性樹脂組合物及固化物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">C08G65/02</main-classification>
        <further-classification edition="200601120260305B">C08F220/18</further-classification>
        <further-classification edition="200601120260305B">C09D4/02</further-classification>
        <further-classification edition="202001120260305B">G02B30/27</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大阪有機化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSAKA ORGANIC CHEMICAL INDUSTRY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小西將太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONISHI, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIYAMA, DAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供一種能夠形成厚度大且具有良好形狀的固化物的固化性樹脂組合物及由上述固化性樹脂組合物得到的固化物。本發明的固化性樹脂組合物包含鹼溶性樹脂（A）、玻璃化轉變溫度為0℃以上的單官能單體（B）和有機溶劑（C），上述鹼溶性樹脂（A）包含具有環狀醚基的重複結構單元（a1）和具有酸基的重複結構單元（a2），上述鹼溶性樹脂（A）的玻璃化轉變溫度為100℃以下且酸值為40～120mgKOH／g，上述單官能單體（B）的含量在每100質量份上述鹼溶性樹脂（A）中為10～60質量份，上述固化性樹脂組合物不包含玻璃化轉變溫度小於0℃的單官能單體（D）和多官能單體（E），或者在包含上述單官能單體（D）的情況下，上述單官能單體（D）的含量在每100質量份上述鹼溶性樹脂（A）中為25質量份以下，在包含多官能單體（E）的情況下，多官能單體（E）的含量在每100質量份上述鹼溶性樹脂（A）中為2質量份以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1931" publication-number="202625753">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625753</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146334</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板塗覆設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/30</main-classification>
        <further-classification edition="200601120260302B">B05C13/02</further-classification>
        <further-classification edition="200601120260302B">G03F7/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商盛美半導體設備（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACM RESEARCH(SHANGHAI), INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊仁政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, RENZHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, FEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳雷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開了一種基板塗覆設備，包括：熱處理模塊，用於對基板進行熱處理；塗覆模塊，用於對基板進行塗覆處理；載置台，用於裝載待處理的基板以及卸載完成塗覆處理的基板；基板傳輸模塊，用於在熱處理模塊、塗覆模塊和載置台之間輸送基板，基板傳輸模塊周圍包括基板處理工位、基板裝卸工位和維護工位，熱處理模塊和塗覆模塊設置於基板處理工位，載置台設置於基板裝卸工位，維護工位用於為維護人員提供進入基板傳輸模塊進行維護的通道。本申請實現了降低基板塗覆設備的維護難度的技術效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:基板</p>
        <p type="p">30:基板塗覆設備</p>
        <p type="p">31:熱處理模塊</p>
        <p type="p">32:塗覆模塊</p>
        <p type="p">33:載置台</p>
        <p type="p">34:基板傳輸模塊</p>
        <p type="p">35:控制模塊</p>
        <p type="p">38:殼體</p>
        <p type="p">381:維護門</p>
        <p type="p">41:基板處理工位</p>
        <p type="p">42:第一基板處理工位</p>
        <p type="p">43:第二基板處理工位</p>
        <p type="p">44:基板裝卸工位</p>
        <p type="p">45:維護工位</p>
        <p type="p">55:機械手</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1932" publication-number="202624732">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624732</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146357</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在半導體製造業中的全人工智慧解決方法</chinese-title>
        <english-title>A COMPLETE ARTIFICIAL INTELLIGENCE (AI) SOLUTION IN SEMICONDUCTOR MANUFACTURING INDUSTRY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G01N21/88</main-classification>
        <further-classification edition="202601120260302B">H10P74/00</further-classification>
        <further-classification edition="202301120260302B">G06N3/08</further-classification>
        <further-classification edition="202201120260302B">G06V10/72</further-classification>
        <further-classification edition="202201120260302B">G06V10/764</further-classification>
        <further-classification edition="202201120260302B">G06V10/82</further-classification>
        <further-classification edition="200601120260302B">H04L12/28</further-classification>
        <further-classification edition="201301120260302B">G06F3/048</further-classification>
        <further-classification edition="200601120260302B">G06F11/30</further-classification>
        <further-classification edition="201801120260302B">G06F9/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬來西亞商正齊科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MI EQUIPMENT (M) SDN. BHD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　恩澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, EARN TZEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　沛穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, PEI YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳天賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於對半導體元件進行視覺檢測的機器學習作業系統（101），該系統包括多個半導體視覺檢測裝置（105），其被配置為通過至少一個網路交換機（109）與中央工作站（107）進行連通。本發明還提供一種使用所述系統對半導體元件進行視覺檢測的方法，其中所述方法利用所採集的資料集進行機器學習模型訓練並且將經訓練的機器學習模型部署至所述半導體視覺檢測裝置（105）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a system (101) for performing vision inspection on sidewall of semiconductor device (107), wherein said system (101) comprises of at least one set of light emitting device configured to emit a plurality of light rays towards the sidewall of said semiconductor device (107), wherein said plurality of light rays are at an oblique angle towards the top of said plane of said semiconductor device (107), at an oblique angle towards the bottom of said plane of said semiconductor device (107) or combination thereof to inspect sidewalls that are vertical, slanted or combination thereof, said slant possibly caused by cutting of said semiconductor device from a wafer.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1933" publication-number="202625186">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625186</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146424</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路</chinese-title>
        <english-title>INTEGRATED CIRCUIT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G11C11/4097</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李燦昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHANHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOUN, SUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容提供了一種積體電路，其包括複數個位元胞元。該等複數個位元胞元之中的一位元胞元包括：一第一主動區中之複數個第一電晶體，該第一主動區在一第一方向上延伸；一第二主動區中之複數個第二電晶體，該第二主動區在與該第一方向相交之一第二方向上與該第一主動區間隔開，且在該第一方向上延伸；以及安置於一第三主動區中之複數個第三電晶體，該第三主動區在該第一主動區與該第二主動區之間在該第一方向上延伸。該等複數個第三電晶體之一數目小於該等複數個第一電晶體之一數目。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An integrated circuit including a plurality of bit cells is provided. A bit cell among the plurality of bit cells includes a plurality of first transistors in a first active region extending in a first direction, a plurality of second transistors in a second active region that is spaced apart from the first active region in a second direction intersecting the first direction, and that extends in the first direction, and a plurality of third transistors that are disposed in a third active region extending in the first direction between the first active region and the second active region. A number of the plurality of third transistors is smaller than a number of the plurality of first transistors.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:位元胞元</p>
        <p type="p">BLa_A:第一位元線</p>
        <p type="p">BLa_B:第二位元線</p>
        <p type="p">BLb_A:第一互補位元線</p>
        <p type="p">BLb_B:第二互補位元線</p>
        <p type="p">N1:第一資料節點</p>
        <p type="p">N2:第二資料節點</p>
        <p type="p">PD1:第一下拉電晶體</p>
        <p type="p">PD2:第二下拉電晶體</p>
        <p type="p">PD3:第三下拉電晶體</p>
        <p type="p">PD4:第四下拉電晶體</p>
        <p type="p">PS1:第一通路電晶體</p>
        <p type="p">PS2:第二通路電晶體</p>
        <p type="p">PS3:第三通路電晶體</p>
        <p type="p">PS4:第四通路電晶體</p>
        <p type="p">PU1:第一上拉電晶體</p>
        <p type="p">PU2:第二上拉電晶體</p>
        <p type="p">VDD:正供應電壓</p>
        <p type="p">VSS:負供應電壓</p>
        <p type="p">WL_A:字線，第一字線</p>
        <p type="p">WL_B:字線，第二字線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1934" publication-number="202623986">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623986</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146477</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>擠出機及連續式高剪切加工裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120251205B">B29C48/025</main-classification>
        <further-classification edition="201901120251205B">B29C48/78</further-classification>
        <further-classification edition="201901120251205B">B29C48/50</further-classification>
        <further-classification edition="200601120251205B">C08J3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商芝浦機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBAURA MACHINE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>笹井裕也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAI, YUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於提供一種可以一台進行高剪切加工前的熔融、混練以及高剪切加工後的樹脂的冷卻的擠出機來代替設置於連續式高剪切加工裝置的兩個擠出機。擠出機2包括滾筒4以及螺桿5，滾筒4具有供給口6、第一連接口8、第二連接口9及噴出口7，螺桿5在沿著螺桿軸的流動方向（X方向）上具有設置於第一連接口8的上游（X1）側的上游側螺桿部11、設置於第二連接口9的下游（X2）側的下游側螺桿部13、以及設置於第一連接口8與第二連接口9之間的阻擋部12。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:連續式高剪切加工裝置</p>
        <p type="p">2:擠出機</p>
        <p type="p">3:高剪切加工機</p>
        <p type="p">4:滾筒</p>
        <p type="p">4A:第一滾筒部</p>
        <p type="p">4B:第二滾筒部</p>
        <p type="p">5、5a、5b:螺桿</p>
        <p type="p">6:供給口</p>
        <p type="p">7:噴出口</p>
        <p type="p">8:第一連接口</p>
        <p type="p">9:第二連接口</p>
        <p type="p">10:樹脂</p>
        <p type="p">11、11a、11b:上游側螺桿部</p>
        <p type="p">12、12a、12b:阻擋部</p>
        <p type="p">13、13a、13b:下游側螺桿部</p>
        <p type="p">14:排氣口</p>
        <p type="p">X1:方向(上游)</p>
        <p type="p">X2:方向(下游)</p>
        <p type="p">Y2:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1935" publication-number="202625695">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625695</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146510</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基片處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P50/00</main-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商盛美半導體設備（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACM RESEARCH (SHANGHAI), INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商盛帷半導體設備（上海）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACM RESEARCH (LINGANG), INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王文軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WENJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張曉燕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XIAOYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基片處理裝置包括處理槽，用於容納處理液；基片承載部，設置於所述處理槽內，所述基片承載部用於承載多個基片，所述多個基片沿Y方向間隔且豎直排列；鼓泡盒，設置於所述基片承載部的下方，用於在處理液中形成氣泡，所述鼓泡盒包括多個鼓泡單元，沿X方向間隔設置，相鄰所述鼓泡單元之間形成緩衝通道；處理液供給部，設置於所述鼓泡盒的下方，用於向所述處理槽提供處理液。所述處理液供給部供給的處理液通過所述緩衝通道向上供應，所述緩衝通道用於緩衝所述處理液供給部供給的處理液。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">110:處理槽</p>
        <p type="p">120:外槽</p>
        <p type="p">200:基片承載部</p>
        <p type="p">300:鼓泡盒</p>
        <p type="p">310:鼓泡單元</p>
        <p type="p">311:緩衝通道</p>
        <p type="p">400:處理液供給部</p>
        <p type="p">510:迴圈管路</p>
        <p type="p">520:迴圈泵</p>
        <p type="p">W:基片</p>
        <p type="p">X,Y:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1936" publication-number="202624370">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624370</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146535</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>解聚反應器</chinese-title>
        <english-title>DEPOLYMERIZING REACTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08J11/10</main-classification>
        <further-classification edition="200601120260302B">B01J19/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商可隆工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOLON INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慶忠顯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GYOUNG, CHUNG-HYOUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李東殷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DONG EUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, WON HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種根據實施例的解聚反應器包括用於解聚聚合物的反應部分，其中反應部分包括設置在反應部分主體內部的圓盤、連接到圓盤的中心的圓盤旋轉軸、設置在圓盤上的一或多個刀片部分支撐件、以及由一或多個刀片部分支撐件支撐的一或多個刀片部分，並且一或多個刀片部分在徑向方向上的總長度（L1）可為圓盤的半徑（R）的30%到70%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a depolymerizing reactor according to an embodiment includes a reaction portion for depolymerizing a polymer, wherein the reaction portion includes a disk disposed inside a main body of the reaction portion, a disk rotation shaft connected to a center of the disk, one or more blade portion supports disposed on the disk, and one or more blade portions supported by the one or more blade portion supports, and a total length in a radial direction (L1) of the one or more blade portions may be 30 % to 70 % of a radius (R) of the disk.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:解聚反應器</p>
        <p type="p">100:反應部分</p>
        <p type="p">110:反應部分主體</p>
        <p type="p">120:圓盤旋轉軸</p>
        <p type="p">130:圓盤</p>
        <p type="p">140:刀片部分支撐件</p>
        <p type="p">150:刀片部分</p>
        <p type="p">200:原料進料裝置</p>
        <p type="p">300:分解劑進料裝置</p>
        <p type="p">310:泵</p>
        <p type="p">400:氮氣供應裝置</p>
        <p type="p">500:排放槽</p>
        <p type="p">510:排放管</p>
        <p type="p">520:排氣管</p>
        <p type="p">530:螺旋輸送機</p>
        <p type="p">540:螺桿馬達</p>
        <p type="p">600:乾燥機</p>
        <p type="p">700:冷凝器</p>
        <p type="p">800:主馬達</p>
        <p type="p">810:馬達旋轉軸</p>
        <p type="p">820:旋轉皮帶</p>
        <p type="p">830:框架</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1937" publication-number="202624474">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624474</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146683</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>組成物、處理含金屬層之方法及製造半導體裝置之方法</chinese-title>
        <english-title>COMPOSITION, METHOD OF TREATING METAL-CONTAINING LAYER, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">C11D7/16</main-classification>
        <further-classification edition="200601120260309B">C11D7/18</further-classification>
        <further-classification edition="200601120260309B">C23F1/16</further-classification>
        <further-classification edition="200601120260309B">C23F1/26</further-classification>
        <further-classification edition="200601120260309B">C09K13/04</further-classification>
        <further-classification edition="202601120260309B">H10P50/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金吉娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高基淏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, GIHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金聖玟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNGMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金榮燦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YOUNGCHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文珠姬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOON, JUHEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裵珍惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE, JINHYE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹園植</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, WONSIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙旻炯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, MINHYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>咸喆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAM, CHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃圭榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, KYUYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容提供一種組成物、藉由使用該組成物處理含金屬層的方法及藉由使用該組成物製造半導體裝置的方法。該組成物可包括氧化劑、含銨化合物及蝕刻控制劑。該蝕刻控制劑可包括由式1表示之化合物。式1之描述提供於本文中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are a composition, a method of treating a metal-containing layer by using the composition, and a method of manufacturing a semiconductor device by using the composition. The composition may include an oxidizing agent, an ammonium-containing compound, and an etching controller. The etching controller may include a compound represented by Formula 1. A description of Formula 1 is provided herein.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1938" publication-number="202624245">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624245</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146716</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>形成圖案的方法</chinese-title>
        <english-title>METHOD OF FORMING PATTERNS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07F7/22</main-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="200601120260302B">G03F7/36</further-classification>
        <further-classification edition="200601120260302B">G03F7/40</further-classification>
        <further-classification edition="202601120260302B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星ＳＤＩ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG SDI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林雪熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, SEOL HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓美蓮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, MIYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白載烈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAEK, JAEYEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔正敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, JUNG MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卞勝煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BYUN, SEUNGHWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全鐘爀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, JONGHYUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申尙勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, SANGHOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張慧眞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, HYEJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">公開了一種形成圖案的方法。形成圖案的方法可包括：在基底上形成或提供蝕刻目標膜；在蝕刻目標膜上塗佈包含有機金屬化合物和溶劑的半導體光阻組成物以形成或提供光阻膜；利用圖案化罩幕曝光光阻膜；利用氣體對光阻膜進行乾式顯影以形成光阻圖案；以及利用光阻圖案作為蝕刻罩幕對蝕刻目標膜進行蝕刻。本申請可實現優異的塗佈性質和線邊緣粗糙度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of forming patterns is disclosed. The method of forming patterns may include: forming or providing an etching target film on a substrate; coating a semiconductor photoresist composition including an organometallic compound and a solvent on the etching target film to form or provide a photoresist film; exposing the photoresist film utilizing a patterned mask; dry developing the photoresist film utilizing gas to form a photoresist pattern; and etching the etching target film utilizing the photoresist pattern as an etching mask. The present application can implement excellent coating properties and a line edge roughness.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基底</p>
        <p type="p">108:光阻圖案</p>
        <p type="p">112:有機膜圖案</p>
        <p type="p">114:薄膜圖案</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1939" publication-number="202625696">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625696</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146782</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種SiC晶錠鐳射剝離生成晶片的方法和設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P50/00</main-classification>
        <further-classification edition="202601120260302B">H10P72/50</further-classification>
        <further-classification edition="201401120260302B">B23K26/082</further-classification>
        <further-classification edition="201401120260302B">B23K26/50</further-classification>
        <further-classification edition="201401120260302B">B23K26/53</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商西湖儀器（杭州）技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉東立</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉峰江</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹思敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱佳凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>俞小英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳友炘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及晶片生成方法，尤其涉及一種SiC晶錠鐳射剝離生成晶片的方法和設備。該方法通過調整SiC錠的旋轉角度和雷射光束的掃描方向，使雷射光束的掃描方向相對于主切邊偏離一個特定的角度範圍，從而改善改質層的形成和裂痕的傳播路徑，減少了晶圓缺陷的殘留，提高了成品合格率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a wafer generation method, in particular to a method and equipment for generating wafers by laser slicing of SiC ingots. This method improves formation of modified layers and propagation paths of cracks, reduces residual wafer defects, and enhances production yield by adjusting a rotation angle of a SiC ingot and a scanning direction of a laser beam so that the scanning direction of the laser beam deviates from a primary flat within a specific angular range.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無圖號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1940" publication-number="202624865">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624865</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146796</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示設備</chinese-title>
        <english-title>DISPLAY APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">G02F1/13357</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金鎮鍊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JIN-RYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金地坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JI-GON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李敏珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MINJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金大用</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DAEYONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔恩憘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, EUNHEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露一種顯示設備，包含一背光單元，背光單元包含一背光導光板。多個背光片，位於背光導光板的一前表面上。多個背光片中分別形成多個片孔。以及一背光光源元件，用於向背光導光板發出光線。一液晶面板，位於背光單元的一前表面上。以及一光學模組，位於背光單元的一背表面上，且光學模組與多個片孔重疊，光學模組用於偵測經由多個片孔入射的外部光。一片孔導引部被插入至該多個片孔中，用於對齊該多個片孔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a display apparatus including a backlight unit including a backlight light guide plate, a plurality of backlight sheets located on a front surface of the backlight light guide plate, the backlight sheets having sheet holes respectively formed therein, and a backlight light source element configured to emit light to the backlight light guide plate, a liquid crystal panel located on a front surface of the backlight unit, and an optical module located on a portion of a back surface of the backlight unit, the portion overlapping the plurality of sheet holes, the optical module being configured to detect external light incident through the sheet holes. A sheet hole guide part configured to align the plurality of sheet holes is inserted into the plurality of sheet holes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:液晶面板</p>
        <p type="p">AA:主動區域</p>
        <p type="p">BZ:邊框區域</p>
        <p type="p">HA:開孔區域</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1941" publication-number="202624679">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624679</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146811</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>冷板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260215B">F28F3/02</main-classification>
        <further-classification edition="201401120260215B">B23K26/21</further-classification>
        <further-classification edition="200601120260215B">F28F9/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商尼得科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIDEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西川和宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIKAWA, KAZUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉野慎吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHINO, SHINGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石田淳一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIDA, JUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>花野雅昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANANO, MASAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露之一態樣之冷板具備第1板及第2板。第1板由金屬形成，具有第1面、位於第1面相反側之第2面、及配置於第2面之複數個鰭片。第2板由金屬形成，具有與第2面對向之第3面、及位於第3面相反側之第4面。第2面具有配置有複數個鰭片之第1區域、位於第1區域外側之第2區域、及位於第1區域與第2區域之間之第3區域。第1板於第2區域中藉由雷射焊接而與第2板接合。又，第3區域中之第1板之至少部分厚度較第2區域中之第1板之厚度厚。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:冷板</p>
        <p type="p">110:第1板</p>
        <p type="p">110a:第1面</p>
        <p type="p">110b:第2面</p>
        <p type="p">111:鰭片</p>
        <p type="p">112:第1凸部</p>
        <p type="p">113:第2凸部</p>
        <p type="p">120:第2板</p>
        <p type="p">120b:第4面</p>
        <p type="p">130:中間構件</p>
        <p type="p">141:接頭</p>
        <p type="p">151,153:熔融部</p>
        <p type="p">C1:內周</p>
        <p type="p">C2:外周</p>
        <p type="p">CP:中心位置</p>
        <p type="p">M1:部</p>
        <p type="p">R1,R2,R3:區域</p>
        <p type="p">T1:厚度</p>
        <p type="p">X,Y,Z:軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1942" publication-number="202625481">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625481</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146840</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種通信方法及裝置</chinese-title>
        <english-title>A COMMUNICATION METHOD AND APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260102B">H04W40/02</main-classification>
        <further-classification edition="200901120260102B">H04W8/12</further-classification>
        <further-classification edition="200901120260102B">H04W8/04</further-classification>
        <further-classification edition="200901120260102B">H04W88/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商華為技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>章晨宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, CHENYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許勝鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, SHENGFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李岩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及通信技術領域，尤其涉及一種通信方法及裝置，以期將消息路由功能與接入和移動性管理功能網元解耦，避免網路引入新特性時，影響終端設備和RAN節點與核心網的路由，以及接入和移動性管理功能網元的接入管理和移動性管理功能。該方法可以由第三網元執行，該方法包括：接收來自終端設備的第一信息，第一信息用於請求第一業務；確定與第一網元關聯的第一標識，第一網元服務於第一業務；向第一網元發送第一信息和第一標識；向終端設備發送第一標識，其中，第一標識用於至第一網元的路由。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application relates to the field of communications technologies, and in particular, to a communication method and apparatus, aiming to decouple a message routing function from an access and mobility management function network element, so as to avoid affecting the routing between a terminal device and a RAN node and the core network, as well as the access management and mobility management functions of the access and mobility management function network element when new features are introduced into the network. The method may be performed by a third network element, and includes: receiving first information from a terminal device, where the first information is used to request a first service; determining a first identifier associated with a first network element, where the first network element serves the first service; sending the first information and the first identifier to the first network element; and sending the first identifier to the terminal device, where the first identifier is used for routing to the first network element.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S901、S902、S903、S904:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1943" publication-number="202625413">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625413</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146852</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>網路系統、及終端</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260305B">H04L41/16</main-classification>
        <further-classification edition="202201120260305B">H04L41/08</further-classification>
        <further-classification edition="202201120260305B">H04L67/10</further-classification>
        <further-classification edition="202301120260305B">G06N5/02</further-classification>
        <further-classification edition="200901120260305B">H04W24/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商豐田自動車股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOTA JIDOSHA KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵校</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAO, XIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">為了一面活用既存網路之機能，一面合適地進行基於使用者意圖的自律式次世代網路之提供，網路系統係含有：第1節點群，係由包含有：1個以上之使用者終端、和被1個以上之使用者終端所連接的1個以上之基地台、和將已被1個以上之基地台所連接之核心網予以構成的網路實體在內的複數個第1網路節點所構成，且具有已被複數個第1網路節點所連接之網路構成；和第2節點群，係由對應於複數個第1網路節點的複數個第2網路節點亦即複數個AI代理人所構成；複數個AI代理人，係針對對象之第1網路節點而進行監視或管理，且與複數個AI代理人間進行通訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:使用者終端(UE)</p>
        <p type="p">3:RAN</p>
        <p type="p">11e:NEF</p>
        <p type="p">11g:NRF</p>
        <p type="p">11j:UDM</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1944" publication-number="202625401">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625401</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146863</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在無線區域網路系統中基於分散式資源單元音調方案的傳輸或接收的方法及裝置</chinese-title>
        <english-title>DISTRIBUTED RESOURCE UNIT TONE PLAN BASED TRANSMISSION OR RECEPTION METHOD AND DEVICE IN WLAN SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">H04L5/00</main-classification>
        <further-classification edition="202301120260309B">H04W72/04</further-classification>
        <further-classification edition="202301120260309B">H04W72/1268</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG ELECTRONICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴恩成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, EUNSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔鎭洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, JINSOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林東局</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, DONGGUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭仁植</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, INSIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露在無線區域網路系統中基於分散式資源單元音調方案的傳輸或接收的方法及裝置。根據本發明實施例的方法可以包括：接收包含與分散式資源單元（DRU）相關的資訊的觸發訊框；以及傳送基於該DRU的觸發式（TB）實體層協定資料單元（PPDU）。在本發明中，基於包含在該TB PPDU的頻寬中於80 MHz頻率子區塊內之未使用的最高20 MHz頻道，可以將60 MHz分散式頻寬應用到該80 MHz頻率子區塊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A transmission or reception method and apparatus based on a distributed resource unit tone plan in a wireless LAN system are disclosed. A method according to an embodiment of the present disclosure may include receiving a trigger frame including information related to a distributed resource unit (DRU), and transmitting a trigger-based (TB) physical layer protocol data unit (PPDU) based on the DRU. Here, based on a highest 20 MHz channel within an 80 MHz frequency subblock included in a bandwidth of the TB PPDU being unused, a 60 MHz distributed bandwidth may be applied to the 80 MHz frequency subblock.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1310:步驟</p>
        <p type="p">S1320:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1945" publication-number="202624334">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624334</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146872</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>環氧樹脂、硬化性樹脂組成物、硬化物及碳纖維強化複合材料</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08G61/02</main-classification>
        <further-classification edition="200601120260102B">C08G59/06</further-classification>
        <further-classification edition="200601120260102B">C08G59/20</further-classification>
        <further-classification edition="200601120260102B">C08G59/50</further-classification>
        <further-classification edition="200601120260102B">C08L63/00</further-classification>
        <further-classification edition="200601120260102B">C08K5/18</further-classification>
        <further-classification edition="200601120260102B">C08K7/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本化藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON KAYAKU KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今井嵩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMAI, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鎗田正人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YARITA, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川野裕介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWANO, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>水野裕彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZUNO, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中西政隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANISHI, MASATAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種高彎曲彈性係數、低吸水率優異的環氧樹脂、硬化性樹脂組成物及其硬化物。一種環氧樹脂，由下述式（1）表示。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="236px" width="337px" file="ed10015.JPG" alt="ed10015.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;（式（1）中，存在多個的A由X或Y的結構式表示，存在多個的A中至少一個為X，存在多個的A中至少一個為Y。存在多個的B由Z的結構式表示。G表示經取代或未經取代的縮水甘油基，R&lt;sup&gt;1&lt;/sup&gt;表示氫原子、碳數1～4的烴基或碳數1～4的烷氧基。R&lt;sup&gt;2&lt;/sup&gt;表示碳數1～4的烴基或碳數1～4的烷氧基。R&lt;sup&gt;3&lt;/sup&gt;、R&lt;sup&gt;4&lt;/sup&gt;分別表示氫原子或甲基。n為重複數的平均值，為1＜n＜15的實數）</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1946" publication-number="202625370">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625370</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146873</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>時脈竄改偵測器及偵測時脈竄改事件之方法</chinese-title>
        <english-title>CLOCK TAMPER DETECTOR AND METHOD FOR DETECTING A CLOCK TAMPERING EVENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260204B">H03K5/125</main-classification>
        <further-classification edition="200601120260204B">H03K5/22</further-classification>
        <further-classification edition="201301120260204B">G06F21/78</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熵碼科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PUFSECURITY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊愷莘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, KAI-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王盛宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHENG-TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧彥彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露揭示一種時脈竄改偵測器，該時脈竄改偵測器包括：一時脈端，用於接收系統時脈信號；一時脈產生器，用於產生參考時脈信號；一振盪器，用於產生振盪信號，該信號具有目標頻率大於該參考時脈信號的目標頻率和該系統時脈信號的目標頻率；一控制電路，用於在校準模式下根據該參考時脈信號校準該振盪信號的工作頻率；一偵測計數器，用於在偵測模式下，計數該系統時脈信號每週期內所經歷的該振盪信號之週期數；以及一比較邏輯電路，用於在該偵測模式下，至少在該振盪信號的該週期數與預定數量代碼間之差異大於臨界值時，發出警報信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application discloses a clock tamper detector. The clock tamper detector includes a clock terminal for receiving a system clock signal, a clock generator for generating a reference clock signal, an oscillator for generating an oscillation signal having a targeted frequency greater than a targeted frequency of the reference clock signal and a targeted frequency of the system clock signal, a control circuit for calibrating an operating frequency of the oscillation signal according to the reference clock signal in a calibration mode, a detection counter for counting a number of cycles of the oscillation signal that occur within each cycle of the system clock signal in a detection mode, and a comparison logic circuit for issuing an alarm signal at least when a difference between the number of cycles of the oscillation signal and a predetermined number code is greater than a threshold value in the detection mode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:時脈竄改偵測器</p>
        <p type="p">110:時脈產生器</p>
        <p type="p">120:振盪器</p>
        <p type="p">130:控制電路</p>
        <p type="p">140:偵測計數器</p>
        <p type="p">150:比較邏輯電路</p>
        <p type="p">152,154:比較電路</p>
        <p type="p">156:OR閘</p>
        <p type="p">160:參考計數器</p>
        <p type="p">170:記憶體裝置</p>
        <p type="p">AL1:警報信號</p>
        <p type="p">CKS:系統時脈信號</p>
        <p type="p">CKR:參考時脈信號</p>
        <p type="p">CT1:時脈端</p>
        <p type="p">NC1,NC2:預定數量代碼</p>
        <p type="p">NA1,NA2,NA3:週期數</p>
        <p type="p">OSC1:振盪信號</p>
        <p type="p">TC:微調碼</p>
        <p type="p">V1,V2:臨界值</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1947" publication-number="202625616">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625616</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146899</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及包括該半導體裝置之電子設備</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS INCLUDING THE SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D84/85</main-classification>
        <further-classification edition="202501120260302B">H10D62/824</further-classification>
        <further-classification edition="202501120260302B">H10D62/17</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金尙元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SANGWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金俊奭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JOONSEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昌錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHANGSEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權俊榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, JUNYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳嬉堤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RYU, HUIJE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種半導體裝置及一種包括該半導體裝置之電子設備。該半導體裝置包括第一及第二電晶體。該第一電晶體包括：一第一通道層，其包括一第一過渡金屬二硫屬化物(TMD)材料；以及一第一源極電極及一第一汲極電極。該第二電晶體安置於該第一電晶體下方。該第二電晶體包括：一第二通道層，其包括一第二TMD材料；以及一第二源極電極及一第二汲極電極。該第一源極電極及該第一汲極電極中之各者包括一第一拓樸金屬，該第一拓樸金屬包括該第一TMD材料中所包括之至少一種元素。該第二源極電極及該第二汲極電極中之各者包括一第二拓樸金屬，該第二拓樸金屬包括該第二TMD材料中所包括之至少一種元素。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are a semiconductor device and an electronic apparatus including the semiconductor device. The semiconductor device includes first and second transistors. The first transistor includes a first channel layer including a first transition metal dichalcogenide (TMD) material, and a first source electrode and a first drain electrode. The second transistor is disposed below the first transistor. The second transistor includes a second channel layer including a second TMD material, and a second source electrode and a second drain electrode. Each of the first source electrode and the first drain electrode includes a first topological metal including at least one element included in the first TMD material. Each of the second source electrode and the second drain electrode includes a second topological metal including at least one element included in the second TMD material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">111:第一通道層</p>
        <p type="p">112:第二通道層</p>
        <p type="p">121:第一汲極電極</p>
        <p type="p">122:第二汲極電極</p>
        <p type="p">131:第一源極電極</p>
        <p type="p">132:第二源極電極</p>
        <p type="p">151:第一通孔層</p>
        <p type="p">152:第二通孔層</p>
        <p type="p">170:絕緣層</p>
        <p type="p">MA,M'D:半導體化合物</p>
        <p type="p">ME,M'E:傳導化合物</p>
        <p type="p">TR1:第一電晶體</p>
        <p type="p">TR2:第二電晶體</p>
        <p type="p">x,z:軸方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1948" publication-number="202624529">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624529</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146910</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製造具有降低漏電流密度的超薄絕緣層之方法</chinese-title>
        <english-title>METHOD OF MANUFACTURING AN ULTRA-THIN INSULATING LAYER HAVING REDUCED LEAKAGE CURRENT DENSITY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C23C16/452</main-classification>
        <further-classification edition="200601120260302B">C23C16/50</further-classification>
        <further-classification edition="202501120260302B">H10D64/68</further-classification>
        <further-classification edition="202601120260302B">H10P14/692</further-classification>
        <further-classification edition="202601120260302B">H10P95/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳敏璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MIIN-JANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳敏璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MIIN-JANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種製造具有降低漏電流密度的超薄絕緣層之方法，係藉由複數個原子層沉積循環來完成，並且於原子層沉積製程的每一循環中，於預定時間點導入原位的氫氣電漿處理步驟。氫氣電漿處理步驟係兩者擇一地於前驅物吸附於材料結構之材料層上之後且在反應物導入反應腔體之前，或於反應物導入反應腔體之後執行。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of manufacturing an ultra-thin insulating layer with reduced leakage current density is performed by a plurality of atomic layer deposition (ALD) cycles. In each ALD cycle, an in-situ hydrogen plasma treatment step is introduced at a predetermined time point. The hydrogen plasma treatment step is performed either after the precursor has been adsorbed on a material layer of a material structure and before the reactant is introduced into the reaction chamber, or after the reactant has been introduced.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:原子層沉積循環</p>
        <p type="p">S10~S18:流程步</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1949" publication-number="202625870">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625870</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146911</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>散熱模組及包含該散熱模組之半導體封裝結構</chinese-title>
        <english-title>HEAT DISSIPATION MODULE AND SEMICONDUCTOR PACKAGING STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W74/40</main-classification>
        <further-classification edition="202601120260302B">H10W40/00</further-classification>
        <further-classification edition="202601120260302B">H10W20/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳敏璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MIIN-JANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳敏璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MIIN-JANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種散熱模組包含熱散逸元件以及形成並被覆於熱散逸元件的預定表面上之超薄導熱絕緣層。超薄導熱絕緣層係藉由基於原子層沉積製程所形成，且具有等於或小於50奈米的厚度及極低的漏電流密度。超薄導熱絕緣層能有效降低熱阻，並允許接觸高導熱但具導電性的熱介面材料而不致短路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A heat dissipation module includes a heat-dissipating device and an ultra-thin thermally conductive insulating layer formed to overlay a predetermined surface of the heat-dissipating device. The ultra-thin thermally conductive insulating layer is formed by an atomic layer deposition based process, and features a thickness of 50 nanometers or less and an extremely low leakage current density. The ultra-thin thermally conductive insulating layer can effectively reduce the thermal resistance and allows for contact with a highly conductive but electrically conductive thermal interface material without causing a short circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:散熱模組</p>
        <p type="p">10:熱散逸元件</p>
        <p type="p">10a:散熱器</p>
        <p type="p">10b:均熱片</p>
        <p type="p">102:預定表面</p>
        <p type="p">104:底表面</p>
        <p type="p">106:外表面</p>
        <p type="p">12:超薄導熱絕緣層</p>
        <p type="p">20:熱介面材料</p>
        <p type="p">22:熱介面材料</p>
        <p type="p">24:晶片</p>
        <p type="p">26:凸塊</p>
        <p type="p">28:電路板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1950" publication-number="202624812">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624812</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146935</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光網路介面卡及光傳輸裝置</chinese-title>
        <english-title>OPTICAL NETWORK INTERFACE CARD AND OPTICAL TRANSMISSION APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G02B6/36</main-classification>
        <further-classification edition="200601120260302B">G02B6/42</further-classification>
        <further-classification edition="200601120260302B">G02B6/12</further-classification>
        <further-classification edition="201301120260302B">H04B10/40</further-classification>
        <further-classification edition="202601120260302B">H05K1/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>星系科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIP INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種適用於至少一光纜單元的光網路介面卡及光傳輸裝置。光網路介面卡包括載板、設置在載板上的網路晶片、安裝在載板上用於連接光纜單元的至少一光適配器、設置在載板上並與網路晶片電連接的光子積體電路，以及安裝在載板上並連接在光適配器和光子積體電路之間的光耦合元件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical network interface card, adapted for use with at least an optical cable unit, includes a load board, a network chip disposed on the load board, at least an optical adapter installed on the load board for connection with the optical cable unit, a photonic integrated circuit disposed on the load board and electrically connected to the network chip, and an optical coupling assembly installed on the load board and connected between the optical adapter and the photonic integrated circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1A:光網路介面卡</p>
        <p type="p">10:載板</p>
        <p type="p">11:光適配器</p>
        <p type="p">12:光適配器</p>
        <p type="p">13:支架</p>
        <p type="p">30:光耦合元件</p>
        <p type="p">300:光纖陣列單元</p>
        <p type="p">301:光纖</p>
        <p type="p">303:連接頭</p>
        <p type="p">305:套芯元件</p>
        <p type="p">51:光子積體電路</p>
        <p type="p">511:訊號傳輸部</p>
        <p type="p">53:網路晶片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1951" publication-number="202623828">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623828</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146951</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含咖啡組合物之萃取物和抗生素的抗菌組合物及其用途</chinese-title>
        <english-title>ANTI-BACTERIAL COMPOSITION COMPRISING EXTRACT OF COFFEE COMPOSITION AND ANTIBIOTIC, AND USE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K36/74</main-classification>
        <further-classification edition="200601120260302B">A61K31/165</further-classification>
        <further-classification edition="200601120260302B">A61K31/65</further-classification>
        <further-classification edition="200601120260302B">A61P31/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>京冠生物科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KING'S GROUND BIOTECH CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立嘉義大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHIAYI UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>嘉義市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畢家甄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PI, CHIA-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李佳勲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JIA-SHIUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宜蓁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭宇捷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, YU-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭鴻志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, HUNG-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹昆衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, KUN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳青芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHING-FEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種抗菌組合物及其用途，具體涉及一種包含一咖啡組合物之萃取物和一抗生素的抗菌組合物，以及將該抗菌組合物用於製備抗菌藥物的用途；其中該咖啡組合物包含固成分與水，該固成分包含咖啡豆與輔料，該抗生素係選自由青黴素類、頭孢菌素類、氟喹諾酮類、四環素類、氯黴素類、胺基醣苷類抗生素及其組合所組成的群組，並且該咖啡組合物與該抗生素之重量比為1.5：1至25000：1。本發明之抗菌組合物可發揮出比單獨使用抗生素時更佳的抑菌效果，並且所述抑菌效果對於具抗藥性的細菌亦能產生作用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is an anti-bacterial composition and a use thereof, specifically involving an anti-bacterial composition comprising an extract of a coffee composition and an antibiotic, and a use of the anti-bacterial composition for manufacturing an anti-bacterial medicament. The coffee composition comprises a solid content and water. The solid content comprises coffee beans and an auxiliary material. The antibiotic is selected from penicillins, cephalosporins, fluoroquinolones, tetracyclines, chloramphenicols, aminoglycosides, and a combination thereof. The ratio of the coffee composition to the antibiotic is in an amount of 1.5: 1 to 25000: 1. The anti-bacterial composition has a better anti-bacterial effect than the antibiotic alone, and the anti-bacterial effect may also be effective against drug-resistant bacteria.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1952" publication-number="202625228">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625228</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146955</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>磁性元件及整合磁性組件</chinese-title>
        <english-title>MAGNETIC COMPONENT AND INTEGRATED MAGNETIC ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01F38/42</main-classification>
        <further-classification edition="200601220260102B">H02M3/335</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普坎　里彭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PHUKAN, RIPUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫馬爾　美莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, MISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>包　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARBOSA, PETER MANTOVANELLI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓少鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, SHAOPENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案涉及一種磁性元件及整合磁性元件。磁性元件包含磁芯組、初級繞組、第一次級繞組、第二次級繞組及一三級繞組。磁芯組包含中心柱、第一側柱及第二側柱。第一側柱包括第一接腳及第二接腳。第二側柱包括第三接腳及第四接腳。三級繞組的第一區段是繞設於第一接腳及第二接腳的其中之一，三級繞組的第二區段是繞設於第三接腳及第四接腳的其中之一。兩側柱分別分為兩接腳，通過三級繞組實現部分耦合。因此，可實現可調整及增強的耦合係數、降低損耗、節省空間和提高性能等優點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a magnetic component and an integrated magnetic assembly. The magnetic component includes a magnetic core set, a primary winding, a first secondary winding, a second secondary winding and a tertiary winding. The magnetic core set includes a central column, a first and a second lateral column. The first lateral column includes a first leg and a second leg. The second lateral column includes a third leg and a fourth leg. A first segment of the tertiary winding is wound on one of the first leg and the second leg, and a second segment of the tertiary winding is wound on one of the third leg and the fourth leg. The two lateral columns are divided into two legs respectively to achieve partial coupling through the tertiary winding. Consequently, the advantages of adjustable and enhanced coupling coefficient, reduced loss, saving footprint and enhanced performance are achieved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:磁性元件</p>
        <p type="p">2:磁芯組</p>
        <p type="p">21:中心柱</p>
        <p type="p">22:第一側柱</p>
        <p type="p">221:第一接腳</p>
        <p type="p">222:第二接腳</p>
        <p type="p">223:第一子繞組通道</p>
        <p type="p">23:第二側柱</p>
        <p type="p">231:第三接腳</p>
        <p type="p">232:第四接腳</p>
        <p type="p">233:第二子繞組通道</p>
        <p type="p">26:第一繞組通道</p>
        <p type="p">27:第二繞組通道</p>
        <p type="p">3:初級繞組</p>
        <p type="p">4:第一次級繞組</p>
        <p type="p">5:第二次級繞組</p>
        <p type="p">6:三級繞組</p>
        <p type="p">61:第一區段</p>
        <p type="p">62:第二區段</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1953" publication-number="202625011">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625011</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146957</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有多個匯流排的系統和控制該系統中處理核心的方法</chinese-title>
        <english-title>SYSTEM HAVING MULTIPLE BUSES AND METHOD FOR CONTROLLING PROCESSING CORE IN THE SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260202B">G06N3/04</main-classification>
        <further-classification edition="200601120260202B">G06N3/06</further-classification>
        <further-classification edition="200601120260202B">G06F13/38</further-classification>
        <further-classification edition="200601120260202B">G06T1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商蒂普愛可斯有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEEPX CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔載翊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, JE IK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本公開的一個示例，可以提供一種系統。該系統可以包括至少一個處理核心，其被配置為執行與張量相關聯的至少一個神經網路模型的計算操作；被配置為儲存張量的至少一個記憶電路；可操作地耦合到至少一個處理器核心和至少一個記憶電路的多個匯流排電路。多個匯流排電路被配置為響應於接收到對讀取操作或寫入操作的請求，將張量從至少一個記憶電路發送到至少一個處理核心；以及可操作地耦合到多個匯流排電路的控制器，該控制器被配置為確定每個匯流排電路對每個張量進行讀取操作或寫入操作的優先級。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">According to one example of the present disclosure, a system may be provided. The system may comprise at least one processing core configured to perform computation operations of at least one neural network model associated with tensors, at least one memory circuit configured to store the tensors, a plurality of bus circuits operably coupled to the at least one processing core and the at least one memory circuit. The plurality of bus circuits configured to send the tensors from the at least one memory circuit to the at least one processing core responsive to receiving requests for read operations or write operations, and a controller operably coupled to the plurality of bus circuits, the controller configured to determine a priority of each of the tensors for each bus circuit for the read operations or the write operations.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10000:系統</p>
        <p type="p">1000:神經處理單元NPU</p>
        <p type="p">1000-1,…,1000-n:多個處理核心</p>
        <p type="p">1000-1:第一處理核心</p>
        <p type="p">2000:中央處理單元CPU</p>
        <p type="p">3000:記憶體</p>
        <p type="p">4000:圖像傳感器</p>
        <p type="p">5000:解碼器</p>
        <p type="p">6000:匯流排</p>
        <p type="p">1100:第一控制器</p>
        <p type="p">100:第二控制器</p>
        <p type="p">200:直接記憶體存取DMA</p>
        <p type="p">300:內部記憶體</p>
        <p type="p">400:處理元件陣列</p>
        <p type="p">500:特殊功能單元</p>
        <p type="p">110:計數器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1954" publication-number="202625758">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625758</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146971</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶圓保持裝置及晶圓保持方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/70</main-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商雅馬哈智能機器股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAHA ROBOTICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野口勇一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOGUCHI, YUICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種晶圓保持裝置，能夠以簡便的結構進行晶圓在上下方向的移動並使其保持於接合載台。包括接合載台10、升降器20、夾持器30、以及基座部40A。基座部40A具有滑動器40以及彈簧35。滑動器40使升降器20與夾持器30相對移動。彈簧35對夾持器30施加預定壓合力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:接合載台</p>
        <p type="p">11:承載面</p>
        <p type="p">13:溝槽</p>
        <p type="p">20:升降器</p>
        <p type="p">21:升降器基座</p>
        <p type="p">22:升降器立柱</p>
        <p type="p">23:支撐臂</p>
        <p type="p">30:夾持器</p>
        <p type="p">31:夾持器基座</p>
        <p type="p">32:夾持器立柱</p>
        <p type="p">33:壓合板</p>
        <p type="p">34:圓孔</p>
        <p type="p">35:螺旋彈簧</p>
        <p type="p">40:滑動器</p>
        <p type="p">40A:基座部</p>
        <p type="p">41:上板</p>
        <p type="p">42:銷</p>
        <p type="p">43:下板</p>
        <p type="p">44:肋</p>
        <p type="p">45:螺栓</p>
        <p type="p">46:滑動板</p>
        <p type="p">47:驅動滾輪</p>
        <p type="p">48:旋轉軸</p>
        <p type="p">49:導軌</p>
        <p type="p">50:驅動部</p>
        <p type="p">53:第二連桿</p>
        <p type="p">55:長孔</p>
        <p type="p">60:框架</p>
        <p type="p">80:晶圓</p>
        <p type="p">100:晶圓保持裝置</p>
        <p type="p">FR:前側</p>
        <p type="p">LH:左側</p>
        <p type="p">UP:上側</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1955" publication-number="202625738">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625738</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147007</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>內襯和半導體加工腔室</chinese-title>
        <english-title>LINER AND SEMICONDUCTOR PROCESSING CHAMBER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/00</main-classification>
        <further-classification edition="200601120260302B">C23C16/54</further-classification>
        <further-classification edition="202601120260302B">H10P72/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊紀鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JI PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茅興飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAO, XING FEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王海莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HAI LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李岩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊延銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YAN MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王英傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YING JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程超傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHAO JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚衛傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, WEI JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖鳳英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, FENG YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種內襯，包括內襯本體和設置於內襯本體的至少一個接地結構，接地結構包括接地主體、連接部和接地部，其中，接地主體呈條狀，且與內襯本體的下端間隔設置，接地主體在其延伸方向上的至少一端設置有連接部，連接部與內襯本體的下端連接，且電導通；接地部與連接部沿接地主體的延伸方向間隔設置；接地部在使用時用於與接地件固定連接，且電導通。本申請還提供一種半導體加工腔室。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a liner, which includes a liner body and at least one grounding structure disposed on the liner body. The grounding structure includes a grounding main body, a connecting portion, and a grounding portion. The grounding main body is strip-shaped and is spaced apart from the lower end of the liner body. At least one end of the grounding main body, in its extending direction, is provided with a connecting portion that is connected to the lower end of the liner body and is electrically conductive. The grounding portion and the connecting portion are spaced apart along the extending direction of the grounding main body. The grounding portion is used for a fixed connection with a grounding component and is electrically conductive. This application also provides a semiconductor processing chamber.</p>
      </isu-abst>
      <representative-img>
        <p type="p">210:內襯本體</p>
        <p type="p">220:接地結構</p>
        <p type="p">221:接地主體</p>
        <p type="p">222:連接部</p>
        <p type="p">223:接地部</p>
        <p type="p">231:凸台</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1956" publication-number="202624042">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624042</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147026</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於支撐機構的腳踏裝置及兒童載具</chinese-title>
        <english-title>FOOTREST DEVICE FOR SUPPORT MECHANISM AND CHILD CARRIER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260215B">B60N2/26</main-classification>
        <further-classification edition="200601120260215B">B60N3/06</further-classification>
        <further-classification edition="201801120260215B">B60N2/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫小龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MO, XIAOLONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於支撐機構的腳踏裝置及兒童載具，其中的用於支撐機構的腳踏裝置，包括：踏板部；連接部，環設於所述支撐機構，且用於將所述踏板部連接於所述支撐機構；鎖定部，設置於所述連接部，所述鎖定部具有鎖定位置以用於將所述腳踏裝置鎖定於所述支撐機構，以及釋鎖位置以用於將所述腳踏裝置從所述支撐機構釋鎖，藉由所述踏板部相對於所述連接部的樞轉觸發所述鎖定部的鎖定位置和釋鎖位置，其中，所述踏板部具有展開位置和收折位置，或者，所述踏板部可拆卸地連接於所述支撐機構。根據本申請的支撐機構的腳踏裝置及兒童載具，兒童在乘坐時可以將腳放置於腳踏裝置上，極大地提高了乘坐的體驗感。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A footrest device for a support mechanism and a child carrier are provided. The footrest device for the support mechanism includes: a pedal portion; a connecting member surrounding the support mechanism and used for connecting the pedal portion to the support mechanism; and a locking member disposed on the connecting member. The locking member has a locked position for locking the footrest device to the support mechanism and an unlocked position for unlocking the footrest device from the support mechanism. The locked position and the unlocked position of the locking member are triggered by the pivoting the pedal portion relative to the connecting member. The pedal portion has an unfolded position and a folded position, or the pedal portion is detachably connected to the support mechanism. With the footrest device for the support mechanism and the child carrier according to the present disclosure, a child can place their feet on the footrest device when riding, which greatly improves the riding experience</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:兒童載具</p>
        <p type="p">10:座椅本體</p>
        <p type="p">20:底座</p>
        <p type="p">30:支撐機構</p>
        <p type="p">100:支撐管</p>
        <p type="p">200:支撐底腳</p>
        <p type="p">300:腳踏裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1957" publication-number="202625530">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625530</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147035</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>模組化把手結構及電子裝置</chinese-title>
        <english-title>MODULAR HANDLE STRUCTURE AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251209B">H05K5/02</main-classification>
        <further-classification edition="200601120251209B">E05B3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商環榮電子（惠州）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNIVERSAL GLOBAL TECHNOLOGY (HUIZHOU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬唯程</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, WEI CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種模組化把手結構，模組化把手結構包含把手外殼、把手模組以及連動模組。把手外殼包含把手殼體。把手模組包含把手座、限位件及把手。限位件凸設於把手座。把手連接把手座。連動模組包含卡勾及連動元件。卡勾包含卡勾部凸出把手殼體。連動元件包含壓抵部接觸卡勾。模組化把手結構設置於面板並組設於機殼時，卡勾部凸出以對應機殼的鎖孔。把手被施以外力時，壓抵部壓抵卡勾，使卡勾部脫離鎖孔，允許模組化把手結構帶動面板與機殼分離。藉此，透過將模組化把手結構設置於面板，可達成安裝及拆卸方便的目的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a modular handle structure. The modular handle structure includes a handle shell, a handle module and a linking module. The handle shell includes a handle shell body. The handle module includes a handle seat, a limiting element and a handle. The limiting element protrudes from the handle seat. The handle is connected to the handle seat. The linking module includes a hook body and a linking element. The hook body includes a hook portion, and the hook portion protrudes from the handle shell body. The linking element includes a suppressing portion, and the suppressing portion contacts the hook body. When the modular handle structure is disposed at a bezel to be assembled with a chassis, the hook portion protrudes so as to correspond a hole of the chassis. When an external force is exerted on the handle, the suppressing portion suppresses the hook body, and the hook portion is disengaged from the hole, allowing the modular handle structure to drive the bezel and the chassis to separate. Therefore, through placing the modular handle structure at the bezel, a purpose of the convenience for assembling and disassembling the bezel can be achieved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:模組化把手結構</p>
        <p type="p">100:把手外殼</p>
        <p type="p">110:把手殼體</p>
        <p type="p">111:第一面</p>
        <p type="p">112:第二面</p>
        <p type="p">113:側面</p>
        <p type="p">120:把手卡孔</p>
        <p type="p">130:把手側孔</p>
        <p type="p">140:設置孔</p>
        <p type="p">150:樞設凸部</p>
        <p type="p">200:把手模組</p>
        <p type="p">210:把手座</p>
        <p type="p">211:把手設置部</p>
        <p type="p">212:樞轉溝部</p>
        <p type="p">213:段差部</p>
        <p type="p">214:彈臂</p>
        <p type="p">215:容置槽</p>
        <p type="p">220:限位件</p>
        <p type="p">230:把手</p>
        <p type="p">240:結合柱</p>
        <p type="p">250:彈性體</p>
        <p type="p">300:連動模組</p>
        <p type="p">310:卡勾</p>
        <p type="p">311:卡勾體</p>
        <p type="p">312:卡勾部</p>
        <p type="p">313:受壓部</p>
        <p type="p">320:第一彈性件</p>
        <p type="p">330:連動元件</p>
        <p type="p">331:連動體</p>
        <p type="p">332:壓抵部</p>
        <p type="p">340:第二彈性件</p>
        <p type="p">400:銷件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1958" publication-number="202624683">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624683</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147192</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>冷板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260122B">F28F9/18</main-classification>
        <further-classification edition="200601120260122B">F28F3/02</further-classification>
        <further-classification edition="200601120260122B">G06F1/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商尼得科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIDEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西川和宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIKAWA, KAZUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉野慎吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHINO, SHINGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石田淳一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIDA, JUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>花野雅昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANANO, MASAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露之一態樣之冷板具備第1板、第2板、冷媒之流入口及流出口、及接頭。第1板由金屬形成，具有第1面、位於第1面相反側之第2面、及配置於第2面之複數個鰭片。第2板由金屬形成，具有與第2面對向之第3面、及位於第3面相反側之第4面。流入口及流出口貫通第3面與第4面。接頭連接於流入口及流出口，從第4面朝向外側突出。又，接頭藉由局部加熱接合而與第2板接合，藉由局部加熱接合形成之第1接合部從第3面朝向接頭延伸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:冷板</p>
        <p type="p">110:第1板</p>
        <p type="p">110a:第1面</p>
        <p type="p">110b:第2面</p>
        <p type="p">111:鰭片</p>
        <p type="p">120:第2板</p>
        <p type="p">120a:第3面</p>
        <p type="p">120b:第4面</p>
        <p type="p">121:流入口</p>
        <p type="p">130:中間構件</p>
        <p type="p">141:接頭</p>
        <p type="p">151:熔融部</p>
        <p type="p">153:熔融部</p>
        <p type="p">M1:部</p>
        <p type="p">R1,R2,R3:區域</p>
        <p type="p">T1:厚度</p>
        <p type="p">X,Y,Z:軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1959" publication-number="202625477">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625477</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147211</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>通信方法及裝置</chinese-title>
        <english-title>A COMMUNICATION METHOD AND APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260305B">H04W28/02</main-classification>
        <further-classification edition="200901120260305B">H04W28/24</further-classification>
        <further-classification edition="202201120260305B">H04L67/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商華為技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃國剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, GUOGANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭宇宸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, YUCHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李云波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YUNBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供通信方法及裝置，該方法可以應用於支持IEEE 協定，如802.11be/Wi-Fi 7/Wi-Fi 8協定，IEEE 802.11 Integrated mmWave協定，IEEE 802.11bf/感知協定，UWB協定，或星閃協定。該方法包括：發送SCS請求幀，SCS請求幀中包含SCS識別字、第一TID和第一UP，SCS識別字用於標識第一SCS流，第一TID為請求將第一SCS流映射至的TID，第一UP為請求將第一TID映射至的UP，第一TID的值和第一UP的值不同；接收回應於SCS請求幀的SCS回應幀；可以減少接收端解析SCS流的資料包的時間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a communication method and apparatus. The method may be applied to support IEEE protocols, such as the 802.11be/Wi-Fi 7/Wi-Fi 8 protocol, the IEEE 802.11 Integrated mmWave protocol, the IEEE 802.11bf/sensing protocol, the UWB protocol, or the SparkLink protocol. The method includes: sending an SCS request frame, where the SCS request frame includes an SCS identifier, a first TID, and a first UP; the SCS identifier is used to identify a first SCS flow, the first TID is a TID to which the first SCS flow is requested to be mapped, the first UP is a UP to which the first TID is requested to be mapped, and the value of the first TID is different from the value of the first UP; and receiving an SCS response frame in response to the SCS request frame. This can reduce the time required for the receiving end to parse data packets of the SCS flow.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1301、1302:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1960" publication-number="202624680">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624680</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147219</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>冷板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">F28F3/02</main-classification>
        <further-classification edition="200601120260302B">F28F9/18</further-classification>
        <further-classification edition="200601120260302B">F28F21/08</further-classification>
        <further-classification edition="202601120260302B">H10W40/47</further-classification>
        <further-classification edition="200601120260302B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商尼得科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIDEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西川和宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIKAWA, KAZUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉野慎吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHINO, SHINGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石田淳一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIDA, JUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>花野雅昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANANO, MASAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露之一態樣之冷板具備金屬製之第1板、金屬製之第2板、及中間構件。第2板接合於第1板，與第1板之間形成內部空間。中間構件位於內部空間。又，第2板藉由局部加熱接合而接合於第1板，由局部加熱接合形成之接合部至少形成於第1板與第2板之邊界處。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:冷板</p>
        <p type="p">110:第1板</p>
        <p type="p">110a:第1面</p>
        <p type="p">110b:第2面</p>
        <p type="p">111:鰭片</p>
        <p type="p">120:第2板</p>
        <p type="p">120a:第3面</p>
        <p type="p">120b:第4面</p>
        <p type="p">121:流入口</p>
        <p type="p">130:中間構件</p>
        <p type="p">141:接頭</p>
        <p type="p">151,153:熔融部</p>
        <p type="p">M1:部</p>
        <p type="p">R1,R2,R3:區域</p>
        <p type="p">X,Y,Z:軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1961" publication-number="202625487">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625487</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147244</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於在分散式資源單元（DRU）中進行導頻子載波分配的系統、方法和裝置</chinese-title>
        <english-title>SYSTEMS, METHODS AND APPARATUS FOR PILOT TONE ALLOCATION IN DISTRIBUTED RESOURCE UNITS (DRUS)</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260102B">H04W72/0453</main-classification>
        <further-classification edition="202301120260102B">H04W72/04</further-classification>
        <further-classification edition="200601120260102B">H04L5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商華為技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛　岩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIN, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐正勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUH, JUNG HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿布勒-馬格德　奧薩馬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABOUL-MAGD, OSAMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈薩貝爾納比　馬哈茂德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASABELNABY, MAHMOUD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>EG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諾魯齊　薩拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOROUZI, SARA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉辰辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHENCHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的實施例提供了用於在無線局域網（wireless local area network，WLAN）中利用打孔在分散式資源單元（distributed resource unit，DRU）中進行導頻子載波分配的系統、裝置和方法。實施例涉及選擇與預定義的導頻子載波索引集合關聯的導頻子載波索引，所述預定義的導頻子載波索引集合被分配給可用分配頻寬內的242個子載波的集合。實施例還可以定義各種DRU大小，包括26-tone、52-tone、106-tone和242-tone DRU，其中，每種DRU類型具有對應的導頻子載波索引。選擇這些索引可以改進因為20 MHz被打孔或未分配而具有60 MHz分配頻寬的80 MHz PPDU中的導頻子載波分配。實施例可以改進80 MHz PPDU中的導頻子載波分配和可用頻譜的使用。實施例可以通過選擇使干擾最小化的適當的導頻子載波來進一步增強信道估計。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure provide systems, apparatus, and methods for pilot tone allocation in distributed resource units (DRUs) with puncturing in wireless local area networks (WLANs). Embodiments involve selecting pilot tone indices associated with predefined sets of pilot tone indices, which are assigned to a set of 242 subcarriers within the available distribution bandwidth. Embodiments may further define various DRU sizes, including 26-tone, 52-tone, 106-tone, and 242-tone DRUs, with each DRU type having corresponding pilot tone indices. These indices may be selected to improve pilot tone distribution in 80 MHz PPDU with 60 MHz distribution bandwidth due to 20 MHz being punctured or unallocated. Embodiments may enable improved pilot tone distribution in 80 MHz PPDUs and improved use of available spectrum. Embodiments may further enhance channel estimation by choosing appropriate pilot tones that minimize interference.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1962" publication-number="202625396">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625396</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147260</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於解決協調波束成形中的站點ID衝突的方法和裝置</chinese-title>
        <english-title>METHODS AND APPARATUS FOR RESOLVING STATION ID CONFLICT IN COORDINATED BEAMFORMING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H04B7/06</main-classification>
        <further-classification edition="202301120260102B">H04W72/04</further-classification>
        <further-classification edition="200901120260102B">H04W88/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商華為技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈薩貝爾納比　馬哈茂德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASABELNABY, MAHMOUD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>EG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐正勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUH, JUNG HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛　岩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIN, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿布勒-馬格德　奧薩馬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABOUL-MAGD, OSAMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諾魯齊　薩拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOROUZI, SARA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了用於在多個AP之間配置協調波束成形的方法和裝置，所述方法和裝置緩解或防止與不同協作基本服務集相關聯的STA之間的站點ID衝突。在Co-BF PPDU的U-SIG欄位中，所有STA都使用公共BSS顏色。可以在UHR-SIG欄位中使用消歧位元來確定STA與兩個AP中的哪一個相關聯。初始控制幀和初始控制回應序列可以用於為具有衝突的STA ID的STA分配新的STA ID。可以通過為重疊AP分配唯一的最高有效位集合以用於其所有STA ID來防止STA ID衝突。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and apparatus for configuring coordinated beamforming among multiple APs which mitigate or prevent station ID collisions between STAs associated with different collaborating Basic Service Sets are provided. A common BSS color is used for all STAs in the U-SIG field of a Co-BF PPDU. A disambiguation bit may be used in the UHR-SIG field to determine with which of two APs a STA is associated. The Initial Control Frame and Initial Control Response sequence can be leveraged to assign new STA IDs to STAs with conflicting STA IDs. STA ID conflicts can be prevented by assigning overlapping APs unique sets of most significant bits to use for all of their STA IDs.</p>
      </isu-abst>
      <representative-img>
        <p type="p">601:共用AP1</p>
        <p type="p">602:被共用AP2</p>
        <p type="p">605:TXOP</p>
        <p type="p">610:Co-BF ICF(Co-BF邀請)</p>
        <p type="p">611:AP1-STA</p>
        <p type="p">612:AP2-STA</p>
        <p type="p">615:Co-BF ICR(Co-BF回應)</p>
        <p type="p">621:向AP1-STA發送的ICF</p>
        <p type="p">622:向AP2-STA發送的ICF</p>
        <p type="p">631、632:ICR</p>
        <p type="p">650:COBF觸發</p>
        <p type="p">651、652:COBF PPDU</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1963" publication-number="202624186">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624186</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147292</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含氟聚合物、含氟樹脂膜形成用組成物、含氟樹脂膜、光阻圖案形成用組成物、光阻圖案的形成方法、光阻上層膜形成用組成物、含氟聚合物的分解方法、含氟聚合性單體及含氟聚合性單體的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07C67/08</main-classification>
        <further-classification edition="200601120260302B">C07C69/653</further-classification>
        <further-classification edition="200601120260302B">C08F20/28</further-classification>
        <further-classification edition="200601120260302B">C08L33/14</further-classification>
        <further-classification edition="200601120260302B">C08J5/18</further-classification>
        <further-classification edition="200601120260302B">C08J11/28</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/039</further-classification>
        <further-classification edition="200601120260302B">G03F7/11</further-classification>
        <further-classification edition="200601120260302B">G03F7/16</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="200601120260302B">G03F7/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商中央硝子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CENTRAL GLASS COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>增渕毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASUBUCHI, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>兼子譲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANEKO, YUZURU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露以提供可較以往之含氟聚合物在低溫下分解的含氟聚合物為課題。本揭露係關於一種含氟聚合物，其包含由以下通式（1）或（1′）所示之重複單元。（通式（1）中，R&lt;sup&gt;1&lt;/sup&gt;係氫原子、氟原子、氯原子或碳數1～10之直鏈狀或碳數3～10之分枝狀的烷基。上述烷基中之鍵結於碳原子的氫原子之中，一部分或全部亦可取代為氟原子。通式（1）中，R&lt;sup&gt;2&lt;/sup&gt;係單鍵、亦可具有直鏈或分枝或環狀結構的伸烷基、芳環、酯、羰基、醚、醯胺、胺或此等的複合取代基，其一部分亦可氟化及／或氯化。通式（1）中，X係－CH&lt;sub&gt;3&lt;/sub&gt;、－CH&lt;sub&gt;2&lt;/sub&gt;F、－CHF&lt;sub&gt;2&lt;/sub&gt;、－CF&lt;sub&gt;2&lt;/sub&gt;Cl、－CFCl&lt;sub&gt;2&lt;/sub&gt;或－O－R&lt;sup&gt;A&lt;/sup&gt;（R&lt;sup&gt;A&lt;/sup&gt;係烷基，上述烷基中之鍵結於碳原子的氫原子之中，一部分或全部亦可取代為氟原子）。通式（1）中，n為1～3的自然數。）（通式（1′）中，R&lt;sup&gt;1&lt;/sup&gt;係氫原子、氟原子、氯原子或碳數1～10之直鏈狀或碳數3～10之分枝狀的烷基。上述烷基中之鍵結於碳原子的氫原子之中，一部分或全部亦可取代為氟原子。通式（1′）中，R&lt;sup&gt;3&lt;/sup&gt;係碳數1～8之直鏈狀或碳數3～8之分枝狀的烷基。通式（1′）中，X係－CH&lt;sub&gt;3&lt;/sub&gt;、－CH&lt;sub&gt;2&lt;/sub&gt;F、－CHF&lt;sub&gt;2&lt;/sub&gt;、－CF&lt;sub&gt;2&lt;/sub&gt;Cl、－CFCl&lt;sub&gt;2&lt;/sub&gt;或－O－R&lt;sup&gt;A&lt;/sup&gt;（R&lt;sup&gt;A&lt;/sup&gt;係烷基，上述烷基中之鍵結於碳原子的氫原子之中，一部分或全部亦可取代為氟原子）。通式（1′）中，n為1～3的自然數。）&lt;br/&gt;&lt;img align="absmiddle" height="633px" width="351px" file="ed10061.JPG" alt="ed10061.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1964" publication-number="202625455">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625455</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147295</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像訊號處理器和用於處理影像訊號的方法</chinese-title>
        <english-title>IMAGE SIGNAL PROCESSOR AND METHOD FOR PROCESSING IMAGE SIGNAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260102B">H04N25/68</main-classification>
        <further-classification edition="202301120260102B">H04N25/683</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商愛思開海力士有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK HYNIX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張徹存</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, CHEOL JON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金童翼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DONG IK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊珍羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JIN NA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔俊赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, JUN HYEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種影像訊號處理器包括：缺陷像素檢測器，其被配置為從相似特性像素當中檢測缺陷像素，相似特性像素表示具有與目標核中包括的目標像素的特性相同特性的像素；圖案確定器，其被配置為當存在缺陷像素時基於目標核中包括的像素的像素資料來確定目標核的圖案；以及像素插值器，其被配置為當缺陷像素位於圖案的紋理區域中時，基於不相似特性像素當中位於紋理區域中的像素的像素資料和相似特性像素當中位於紋理區域中的像素的像素資料對目標像素進行插值，所述不相似特性像素表示具有與目標像素的特性不同特性的像素。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image signal processor includes a defective pixel detector configured to detect a defective pixel from among similar characteristic pixels, the similar characteristic pixels representing pixels having a characteristic same as a characteristic of a target pixel included in a target kernel, a pattern determiner configured to determine a pattern of the target kernel based on pixel data of pixels included in the target kernel when the defective pixel is present, and a pixel interpolator configured to interpolate, when the defective pixel is positioned in a texture area of the pattern, the target pixel based on pixel data of pixels positioned in the texture area among dissimilar characteristic pixels and pixel data of pixels positioned in the texture area among the similar characteristic pixels, the dissimilar characteristic pixels representing pixels having a characteristic different from the characteristic of the target pixel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:缺陷像素校正器</p>
        <p type="p">410:不相似特性像素確定器</p>
        <p type="p">412:梯度確定器</p>
        <p type="p">414:比值確定器</p>
        <p type="p">420:像素插值器</p>
        <p type="p">IDATA_P:經處理的影像資料</p>
        <p type="p">PTD:圖案資料</p>
        <p type="p">UPD:不相似特性像素資料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1965" publication-number="202625140">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625140</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147320</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260127B">G09G3/32</main-classification>
        <further-classification edition="202501120260127B">H10H29/49</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商阿爾卑斯阿爾派股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALPS ALPINE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北村一博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAMURA, KAZUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">課題在於，提供以非矩陣驅動方式驅動微型LED等發光元件的顯示裝置。解決方案在於，本發明的顯示裝置(100)具有驅動電路(110)和在表面安裝多個發光元件的電路基板(120)。多個發光元件以構成固定的顯示圖案(130、132、134、136、138)的二維形狀的方式配置在電路基板(120)上，多個發光元件的一部分或全部發光元件經由布線串聯連接。驅動電路(110)經由布線(140)使選擇的發光元件點亮或熄滅。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示裝置</p>
        <p type="p">110:驅動電路</p>
        <p type="p">120:電路基板</p>
        <p type="p">130,132,134,136,138:顯示圖案</p>
        <p type="p">132A:數字；區段；段</p>
        <p type="p">132A-1~132A-7:段</p>
        <p type="p">140:驅動布線數；驅動布線；布線</p>
        <p type="p">P:方格；發光元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1966" publication-number="202625211">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625211</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147321</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>燒燙傷評估方法與系統</chinese-title>
        <english-title>BURN INJURY ASSESSMENT METHOD AND SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260227B">G16H50/20</main-classification>
        <further-classification edition="201801120260227B">G16H30/40</further-classification>
        <further-classification edition="202201120260227B">G06V40/10</further-classification>
        <further-classification edition="202201120260227B">G06V10/764</further-classification>
        <further-classification edition="201701120260227B">G06T7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立成功大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIH-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂宥憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YU-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳孟軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, MENG-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佑俞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種燒燙傷評估方法。燒燙傷評估方法包括：取得傷口的可見光影像、深度影像、多光譜影像、熱影像及受傷時間參數；輸入該可見光影像至影像分割模型，以取得傷口區域，及傷口區域遮罩；對齊該深度影像、該多光譜影像、該可見光影像及該熱影像，以產生對齊影像；根據該傷口區域遮罩及該疊和影像計算出該傷口區域的多個生理參數及傷口區域面積，以及輸入該傷口面積、該些生理參數及受傷時間參數至燒燙傷分級模型，以取得該傷口的燒燙傷指數（Burns Index）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A burn injury assessment method is provided. The method includes acquiring a visible light image of a wound, a depth image of the wound, a multispectral image of the wound, a thermal image of the wound and an injury time parameter; inputting the visible light image into an image segmentation model to obtain a wound region and a wound region mask; aligning the depth image, the multispectral image, the visible light image, and the thermal image to generate an aligned image; calculating a plurality of physiological parameters and a wound area of the wound region based on the wound region mask and the aligned image; and inputting the wound area, the physiological parameters, and an injury duration parameter into a burn classification model to obtain a burn index of the wound.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S301、S303、S305、S307、S309:燒燙傷評估方法的步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1967" publication-number="202624898">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624898</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147323</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>調節裝置、調節方法、檢測系統和加工系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251212B">G03F7/20</main-classification>
        <further-classification edition="200601120251212B">G03F9/00</further-classification>
        <further-classification edition="200601120251212B">G05B19/402</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商京城中安半導體（北京）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JINGCHENG ZHONGAN SEMICONDUCTOR (BEIJING) LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾振軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZENG, ZHENJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱充</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, CHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙　永亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, YONGLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李保祿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種調節裝置，調節裝置包括從下至上依次層疊設置的底座、Z向調節單元、X向調節單元、Y向調節單元和多維調節單元；鏡筒組件的出射端延伸至底座的外部，鏡筒組件的入射端與多維調節單元可轉動連接；X向調節單元與Z向調節單元可移動連接，X向調節單元被配置為調節鏡筒組件在X軸方向上的位置；Y向調節單元與X向調節單元可移動連接，Y向調節單元被配置為調節鏡筒組件在Y軸方向上的位置；Z向調節單元與底座可移動連接，Z向調節單元被配置為調節鏡筒組件在Z軸方向上的位置；多維調節單元與Y向調節單元可移動連接，多維調節單元被配置為使鏡筒組件繞X軸轉動和/或繞Y軸轉動，和/或調節鏡筒組件在Z軸方向上的位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:底座</p>
        <p type="p">2:Z向調節單元</p>
        <p type="p">3:X向調節單元</p>
        <p type="p">4:Y向調節單元</p>
        <p type="p">5:多維調節單元</p>
        <p type="p">6:鏡筒組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1968" publication-number="202625263">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625263</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147324</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>固定結構、安裝方法及檢測系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">H01J43/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商京城中安半導體（北京）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JINGCHENG ZHONGAN SEMICONDUCTOR (BEIJING) LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜書強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DU, SHUQIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾振軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZENG, ZHENJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱充</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, CHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙　永亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, YONGLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李保祿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種固定結構，該固定結構用於將光電倍增管安裝於檢測系統中，固定結構包括角度調節組件、平移調節組件和調焦組件，光電倍增管與角度調節組件可轉動連接，以調整光線在光電倍增管的感光面上的入射角度；光電倍增管通過角度調節組件與平移調節組件固定連接，在平移調節組件的作用下，光電倍增管沿其軸線方向移動；平移調節組件與調焦組件固定連接，調焦組件使光電倍增管靠近或遠離光源，以調整光線在感光面上的聚焦效果。本發明的有益效果為：通過在固定結構中設置調焦組件、角度調節組件和平移調節組件，可以實現光電倍增管安裝在光路中時姿態的多維度調節。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光電倍增管</p>
        <p type="p">12:第一法蘭</p>
        <p type="p">2:夾持組件</p>
        <p type="p">22:第二螺釘孔</p>
        <p type="p">23:第三螺釘孔</p>
        <p type="p">3:第二法蘭</p>
        <p type="p">4:支架</p>
        <p type="p">41:第一條形孔</p>
        <p type="p">42:第二刻度線</p>
        <p type="p">5:基座</p>
        <p type="p">6:相位調節件</p>
        <p type="p">7:螺紋法蘭</p>
        <p type="p">8:螺紋調焦環</p>
        <p type="p">9:鏡筒組件</p>
        <p type="p">91:第三法蘭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1969" publication-number="202625723">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625723</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147332</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置</chinese-title>
        <english-title>SUBSTRATE PROCESSING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P70/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部寿洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, TOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>篠原智之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINOHARA, TOMOYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>船橋和雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUNAHASHI, KAZUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池本光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEMOTO, HIKARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的基板處理裝置包括：清洗用具，對基板進行清洗；載荷傳遞構件，具有第一力傳遞點及第二力傳遞點；以及線性引導件，將載荷傳遞構件支撐為能夠沿下方向（-Z方向）及上方向（+Z方向）移動。另外，基板處理裝置還包括：氣缸裝置，對載荷傳遞構件的第一力傳遞點施加朝向下方向的力；以及載荷傳感器，具有能夠與載荷傳遞構件的第二力傳遞點接觸的接觸構件，檢測從第二力傳遞點對接觸構件沿下方向作用的力。載荷傳遞構件的第一力傳遞點、第二力傳遞點及線性引導件在俯視時與沿水平方向延伸的假想直線重疊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The substrate processing device includes: a cleaning tool cleaning a substrate; a load transmission member having first and second force transmission points; and a linear guide movably supporting the load transmission member downward (-Z direction) and upward direction (+Z direction), and further includes: an air cylinder device applying a downwardly directed force to the first force transmission point of the load transmission member; and a load sensor having a contact member able to contact the second force transmission point of the load transmission member and detecting a force acting downwardly from the second force transmission point to the contact member. The first and second force transmission points and the linear guide of the load transmission member overlap with a virtual line extending in a horizontal direction when viewed in a plan view.</p>
      </isu-abst>
      <representative-img>
        <p type="p">41:刷臂</p>
        <p type="p">42:刷支撐部</p>
        <p type="p">101:基座構件</p>
        <p type="p">102:罩構件</p>
        <p type="p">110:氣缸裝置</p>
        <p type="p">111:缸主體</p>
        <p type="p">113:氣缸驅動部</p>
        <p type="p">119:缸台座</p>
        <p type="p">120:按壓機構</p>
        <p type="p">121:支柱構件</p>
        <p type="p">122:梁構件</p>
        <p type="p">122a:第一端部</p>
        <p type="p">122b:第二端部</p>
        <p type="p">123:連結軸</p>
        <p type="p">130:載荷傳遞構件</p>
        <p type="p">131:載荷承受部</p>
        <p type="p">200:線性引導件</p>
        <p type="p">310:載荷傳感器</p>
        <p type="p">311:接觸構件</p>
        <p type="p">420:上軸承部</p>
        <p type="p">510:馬達</p>
        <p type="p">511:馬達固定片</p>
        <p type="p">520:馬達驅動部</p>
        <p type="p">521、522:帶輪</p>
        <p type="p">523:帶</p>
        <p type="p">H:殼體</p>
        <p type="p">L11:假想直線</p>
        <p type="p">P1:第一力傳遞點</p>
        <p type="p">P2:第二力傳遞點</p>
        <p type="p">P3:第三力傳遞點</p>
        <p type="p">X、Y、Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1970" publication-number="202625070">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625070</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147339</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>通過聊天室與外部問答平臺聯動以提供問答的方法、電腦裝置以及電腦程式</chinese-title>
        <english-title>METHOD, COMPUTER DEVICE, AND COMPUTER PROGRAM TO PROVIDE Q&amp;A BY LINKING WITH EXTERNAL Q&amp;A PLATFORM VIA CHAT ROOM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260106B">G06Q50/10</main-classification>
        <further-classification edition="200601120260106B">G09B7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商連加股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINE PLUS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金容珉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YONG MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河憲光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HA, HUNKWANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李芝水</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JISU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章典</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種通過聊天室與外部問答平臺聯動以提供問答的方法、電腦裝置以及電腦程式。問答提供方法可包括如下步驟：通過與外部問答平臺相關機器人之間的聊天室，顯示由用戶輸入的提問；在所述聊天室內，將對於所述提問的回答顯示成第一類型的消息；以及在所述聊天室內，將所述回答的出處顯示成第二類型的消息。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S310,S320,S330,S340,S350,S360:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1971" publication-number="202625488">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625488</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147343</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種通信方法和裝置</chinese-title>
        <english-title>A COMMUNICATION METHOD AND APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260305B">H04W72/0453</main-classification>
        <further-classification edition="200601120260305B">H04L5/00</further-classification>
        <further-classification edition="202301120260305B">H04W72/23</further-classification>
        <further-classification edition="200901120260305B">H04W52/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商華為技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GONG, BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>淦明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAN, MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開了一種通信方法和裝置。適用於802.11系列標準協定，802.11系列標準協定例如包括但不限於：802.11a/b/g、802.11n、802.11ac、802.11ax、802.11be以及802.11bn等。方法包括：接收觸發幀，觸發幀用於指示分配給站點的DRU；根據觸發幀在分配的DRU上發送PPDU；其中，分配的DRU的離散頻寬為60MHz。該方法中，接入點給站點分配離散頻寬為60MHz的DRU，站點基於離散頻寬為60MHz的DRU傳輸PPDU，可以實現在不增加功率譜密度的情況下，提高站點的發送功率以獲得更高的增益。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application discloses a communication method and apparatus. The method is applicable to 802.11 series standard protocols, which include, for example, but are not limited to: 802.11a/b/g, 802.11n, 802.11ac, 802.11ax, 802.11be, and 802.11bn. The method includes: receiving a trigger frame, where the trigger frame is used to indicate a DRU allocated to a station; and transmitting a PPDU on the allocated DRU according to the trigger frame, where the discrete bandwidth of the allocated DRU is 60 MHz. In this method, an access point allocates a DRU with a discrete bandwidth of 60 MHz to a station, and the station transmits the PPDU based on the DRU with a discrete bandwidth of 60 MHz. This can achieve higher transmit power for the station to obtain a higher gain without increasing the power spectral density.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101、S102:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1972" publication-number="202624852">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624852</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147362</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>觸控感測顯示裝置及其驅動方法</chinese-title>
        <english-title>TOUCH SENSING DISPLAY APPARATUS AND DRIVING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">G02F1/133</main-classification>
        <further-classification edition="200601120260202B">G09G3/20</further-classification>
        <further-classification edition="200601120260202B">G06F3/041</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ顯示器股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛承錄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, SEUNG ROK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李得秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DEUK SU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種觸控感測顯示裝置及其驅動方法。該觸控感測顯示裝置包括：觸控螢幕面板，設置在顯示面板上，並且包含：沿第一方向佈置的第一觸控電極，其中，該第一方向是該顯示面板的資料線延伸的方向；沿第二方向佈置的第二觸控電極，其中，該第二方向與該第一方向相交；第一補償電極，分別被該些第一觸控電極包圍；以及第二補償電極，分別被該些第二觸控電極包圍；觸控電路，配置為驅動該些第一和第二觸控電極，以感測施加到各個觸控感測器的觸控輸入；以及補償電路，配置為在對該觸控輸入進行感測時，向該些第一和第二補償電極供應補償電壓，該補償電壓用於補償由該些資料電壓中的每一個的變化所引起的串擾。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a touch sensing display apparatus and driving method thereof. The touch sensing display apparatus includes a touch screen panel disposed on a display panel and including first touch electrodes arranged in a first direction in which data lines of the display panel extend, second touch electrodes arranged in a second direction intersecting the first direction, first compensation electrodes respectively surrounded by the first touch electrodes, and second compensation electrodes respectively surrounded by the second touch electrodes, a touch circuit configured to drive the first and second touch electrodes to sense a touch input applied to each of touch sensors, and a compensation circuit configured to supply the first and second compensation electrodes with a compensation voltage for compensating for crosstalk caused by a variation of each of the data voltages while the touch input is being sensed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:觸控感測顯示裝置</p>
        <p type="p">110:顯示面板</p>
        <p type="p">120:顯示驅動電路</p>
        <p type="p">140:時序控制器</p>
        <p type="p">150:微控制單元</p>
        <p type="p">200:觸控電路</p>
        <p type="p">210:觸控驅動器</p>
        <p type="p">220:觸控感測單元</p>
        <p type="p">300:補償電路</p>
        <p type="p">CE:補償電極</p>
        <p type="p">CPT:補償單元</p>
        <p type="p">Csync:控制同步訊號</p>
        <p type="p">TE:觸控電極</p>
        <p type="p">TSP:觸控螢幕面板</p>
        <p type="p">Tsync:觸控同步訊號</p>
        <p type="p">Vdata:資料訊號</p>
        <p type="p">XCE:第二補償電極</p>
        <p type="p">XTE:第二觸控電極</p>
        <p type="p">YCE:第一補償電極</p>
        <p type="p">YTE:第一觸控電極</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1973" publication-number="202624570">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624570</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147366</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>生產矽單晶棒的方法及矽單晶棒</chinese-title>
        <english-title>METHOD OF PRODUCING A MONOCRYSTALLINE ROD OF SILICON AND MONOCRYSTALLINE ROD OF SILICON</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251210B">C30B15/20</main-classification>
        <further-classification edition="200601120251210B">C30B15/10</further-classification>
        <further-classification edition="200601120251210B">C30B15/14</further-classification>
        <further-classification edition="200601120251210B">C30B29/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商世創電子材料公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILTRONIC AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博德洛斯　沃夫岡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BODLOS, WOLFGANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克羅普肖弗　克勞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KROPSHOFER, CLAUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　皞瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, HAO WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曼哲柏格　卡爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANGELBERGER, KARL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳翠華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種從矽中提拉單晶的方法，包括：在坩堝中將多晶矽熔融成熔體；使晶種與熔體的表面接觸；將晶種提拉成具直徑的細頸部；將細頸部直徑增加至目標直徑；使用具電功率的鼓式加熱器，並使用水平磁場，以參考提拉速度和恆定的晶體旋轉提拉具該目標直徑且長度為L1的單晶的基本圓柱形子段；結束基本圓柱形子段的提拉；將單晶與熔體分離；當基本圓柱形子段提拉結束時，提拉速度降低至低於參考提拉速度的2%；鼓式加熱器的輸出增加10千瓦至30千瓦，晶體旋轉增加超過1 rpm，並且在基本圓柱形子段提拉結束開始後的15分鐘至60分鐘時，將單晶與熔體分離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of pulling a single crystal from silicon, comprising the following steps: the melting of polycrystalline silicon in a crucible to a melt; the contacting of a seed crystal with the surface of the melt; the pulling of the seed crystal to a thin neck having a diameter; the increasing of the diameter of the thin neck to a target diameter; the pulling of an essentially cylindrical subsection of the single crystal having said target diameter with a length L1 at a reference pulling speed and constant crystal rotation using a drum heater having an electrical power and using a horizontal magnetic field; the ending of the pulling of the essentially cylindrical subsection; the separating of the single crystal from the melt; wherein when the pulling of the essentially cylindrical subsection ends, the pulling speed has been reduced to less than 2% of the reference pulling speed; the output of the drum heater has been increased by at least 10 kW to not more than 30 kW, the crystal rotation is increased by more than 1 rpm, and the single crystal is separated from the melt after not less than 15 min to not more than 60 min after commencement of the ending of the pulling of the essentially cylindrical subsection.</p>
      </isu-abst>
      <representative-img>
        <p type="p">L:長度</p>
        <p type="p">D:直徑</p>
        <p type="p">S:條紋</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1974" publication-number="202624571">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624571</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147367</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>生產矽的單晶棒的方法及矽的單晶棒</chinese-title>
        <english-title>METHOD OF PRODUCING A MONOCRYSTALLINE ROD OF SILICON AND MONOCRYSTALLINE ROD OF SILICON</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C30B15/20</main-classification>
        <further-classification edition="200601120260102B">C30B15/22</further-classification>
        <further-classification edition="200601120260102B">C30B15/30</further-classification>
        <further-classification edition="200601120260102B">C30B29/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商世創電子材料公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILTRONIC AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克羅普肖弗　克勞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KROPSHOFER, CLAUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曼哲柏格　卡爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANGELBERGER, KARL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳翠華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種藉由柴可斯基法從矽中提拉單晶的方法，包含以下步驟：在坩堝中將多晶矽熔融成熔體；使晶種與熔體的表面接觸；將晶種提拉成具有直徑的細頸部；將細頸部的直徑增加至目標直徑；使用具電功率的鼓式加熱器，以參考提拉速度和晶體旋轉提拉具有該目標直徑的單晶的基本圓柱形子段；結束基本圓柱形子段的提拉；將單晶與熔體分離；其中，當基本圓柱形子段的提拉結束時，提拉速度降低至低於參考提拉速度的15%；鼓式加熱器的輸出增加至少15%至40%，且在基本圓柱形子段的提拉結束開始後的不少於15分鐘至不超過60分鐘之後，將單晶與熔體分離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of pulling a single crystal from silicon by the Czochralski method, comprising the following steps: the melting of polycrystalline silicon in a crucible to a melt; the contacting of a seed crystal with the surface of the melt; the pulling of the seed crystal to a thin neck having a diameter; the increasing of the diameter of the thin neck to a target diameter; the pulling of an essentially cylindrical subsection of the single crystal having said target diameter at a reference pulling speed and crystal rotation using a drum heater having an electrical power; the ending of the pulling of the essentially cylindrical subsection; the separating of the single crystal from the melt; wherein, when the pulling of the essentially cylindrical subsection ends, the pulling speed has been reduced to less than 15% of the reference pulling speed; the output of the drum heater has been increased by at least 15% to 40%, and the single crystal is separated from the melt after not less than 15 min to not more than 60 min after commencement of the ending of the pulling of the essentially cylindrical subsection.</p>
      </isu-abst>
      <representative-img>
        <p type="p">D:直徑</p>
        <p type="p">L:長度</p>
        <p type="p">S:條紋</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1975" publication-number="202624243">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624243</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147382</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感放射線性組合物、硬化膜、液晶顯示裝置、有機電致發光顯示裝置、及硬化膜的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07F7/18</main-classification>
        <further-classification edition="200601120260102B">C08K5/41</further-classification>
        <further-classification edition="200601120260102B">C08K5/5465</further-classification>
        <further-classification edition="200601120260102B">C08F212/14</further-classification>
        <further-classification edition="200601120260102B">C08F220/06</further-classification>
        <further-classification edition="200601120260102B">C08F220/14</further-classification>
        <further-classification edition="200601120260102B">C08F220/32</further-classification>
        <further-classification edition="200601120260102B">C08F222/40</further-classification>
        <further-classification edition="200601120260102B">C08F232/08</further-classification>
        <further-classification edition="200601120260102B">C09D133/14</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/022</further-classification>
        <further-classification edition="200601120260102B">G03F7/075</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
        <further-classification edition="200601120260102B">G03F7/40</further-classification>
        <further-classification edition="200601120260102B">G02F1/1333</further-classification>
        <further-classification edition="200601120260102B">H05B33/22</further-classification>
        <further-classification edition="202301120260102B">H10K50/11</further-classification>
        <further-classification edition="202301120260102B">H10K50/80</further-classification>
        <further-classification edition="202301120260102B">H10K59/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林依風</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHI, ERIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松本晃幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO, TERUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋本律</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIMOTO, RITSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是鑒於所述課題而成，其目的在於提供一種可形成放射線感度、保存穩定性優異、顯影密接性優異的硬化膜的感放射線性組合物。另外，本發明的目的還在於提供使用所述感放射線性組合物所形成的硬化膜、硬化膜的製造方法、以及包括所述硬化膜的液晶顯示裝置及有機電致發光顯示裝置。本發明是有關於一種感放射線性組合物，其含有堿可溶性聚合物（A）、感放射線性化合物（B）、溶劑（E）、以及含亞氨基的有機氧基矽烷化合物（D）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1976" publication-number="202624722">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624722</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147408</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製程腔室的狀態診斷方法、維護方法及記錄媒體</chinese-title>
        <english-title>METHOD FOR DIAGNOSING THE STATE OF A PROCESS CHAMBER, MAINTENANCE METHOD AND RECORDING MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G01N21/27</main-classification>
        <further-classification edition="200601120260302B">G01N21/31</further-classification>
        <further-classification edition="200601120260302B">H01J37/244</further-classification>
        <further-classification edition="202601120260302B">H10P74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＰＳＫ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PSK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋完守</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, WAN SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安嘉藍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHN, KA RAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李致榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHI YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種診斷製程腔室狀態的方法。上述方法可包括以下步驟：氣體注入步驟，向上述製程腔室內注入至少兩種以上分子類氣體；電漿產生步驟，自上述分子類氣體產生電漿；氣體解離率運算步驟，自上述電漿所產生的光的強度計算出上述分子類氣體各者的目標氣體解離率；及腔室狀態判斷步驟，根據上述分子類氣體的上述目標氣體解離率，判斷上述製程腔室的狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S10:製程腔室的狀態診斷方法</p>
        <p type="p">S11:氣體注入步驟</p>
        <p type="p">S12:電漿產生步驟</p>
        <p type="p">S13:光強度觀察步驟</p>
        <p type="p">S14:氣體解離率運算步驟</p>
        <p type="p">S15:標準資料比較步驟</p>
        <p type="p">S16:腔室狀態判斷步驟</p>
        <p type="p">S17:回饋步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1977" publication-number="202625705">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625705</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147413</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理方法</chinese-title>
        <english-title>SUBSTRATE PROCESSING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P50/20</main-classification>
        <further-classification edition="200601120260302B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＰＳＫ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PSK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋完守</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, WAN SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安嘉藍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHN, KA RAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李致榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHI YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李濬赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JUN HYEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種處理基板的方法。基板處理方法可向製程腔室內處理空間搬入基板，向上述製程腔室供應包含第1氣體及第2氣體的製程氣體以產生電漿，利用上述電漿在處理空間中去除基板上的去除對象薄膜，且在變化上述第1氣體及第2氣體的供應比率的同時，計算與處理空間內存在的上述電漿的狀態及上述去除對象薄膜的去除率相關聯的資料，基於上述資料，設定向上述製程腔室供應的上述第1氣體及上述第2氣體的供應比率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S110、S120、S130、S140、S150、S160:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1978" publication-number="202624842">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624842</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147427</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>AR眼鏡</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260129B">G02C3/02</main-classification>
        <further-classification edition="200601120260129B">G02C5/12</further-classification>
        <further-classification edition="200601120260129B">G02C5/14</further-classification>
        <further-classification edition="200601120260129B">G02B27/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商玳能本股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DYNABOOK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>糸川真路</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITOGAWA, SHINJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩本林三</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWAMOTO, RINZO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中野昌則</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANO, MASANORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊晟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOU, SEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明大致上為一種AR眼鏡，具備：骨架；鏡片，具有後端面與顯示圖像的顯示區域；鏡腳，連接至前述骨架；耳端，連接至前述鏡腳；鼻墊，接觸使用者的鼻子；及凹狀的觸耳部，具有：觸耳面、第1角部、第2角部，且前述觸耳部跨於前述鏡腳及前述耳端而設置；前述後端面與前述鼻墊的中心之間的長度為6～12mm；前述後端面與前述第1角部之間的長度為100～110mm；前述後端面與前述第2角部之間的長度為122～132mm；前述顯示區域的中心線與前述鼻墊的中心之間的長度為12～18mm；前述中心線與前述觸耳面之間的長度為5～8mm。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:AR眼鏡</p>
        <p type="p">10:骨架</p>
        <p type="p">11L:鏡框</p>
        <p type="p">20L:鏡片</p>
        <p type="p">30L:端片</p>
        <p type="p">40L:鏡腳</p>
        <p type="p">41L:骨架</p>
        <p type="p">42L:絞鏈</p>
        <p type="p">50L:耳端</p>
        <p type="p">70:鼻墊</p>
        <p type="p">70C:鼻墊中心</p>
        <p type="p">77L:墊</p>
        <p type="p">78L:觸鼻部</p>
        <p type="p">80L:觸耳部</p>
        <p type="p">81L:觸耳面</p>
        <p type="p">82L,83L:傾斜面</p>
        <p type="p">C1,C2:角部</p>
        <p type="p">DA:顯示區域</p>
        <p type="p">DCL:顯示中心線</p>
        <p type="p">E50:前端</p>
        <p type="p">EY:設想點</p>
        <p type="p">FS:鏡片前端面</p>
        <p type="p">LL1:長度(第1長度)</p>
        <p type="p">LL2:長度(第2長度)</p>
        <p type="p">LL3:長度(第3長度)</p>
        <p type="p">LL4:長度(第4長度)</p>
        <p type="p">LL5:長度(第5長度)</p>
        <p type="p">LL6:長度(第6長度)</p>
        <p type="p">LS:鏡片後端面</p>
        <p type="p">LSL:光源</p>
        <p type="p">S1:內表面</p>
        <p type="p">S2:外表面</p>
        <p type="p">θ82,θ83:角度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1979" publication-number="202624835">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624835</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147432</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>AR眼鏡</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251210B">G02B27/01</main-classification>
        <further-classification edition="200601120251210B">G02C3/02</further-classification>
        <further-classification edition="200601120251210B">G02C5/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商玳能本股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DYNABOOK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>糸川真路</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITOGAWA, SHINJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊晟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOU, SEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">大致來說，根據實施型態，為一種AR眼鏡，具備：第1骨架，保持一對第1鏡片；一對鏡腳，連接至前述第1骨架，並在一方向中延伸；光源，內藏於前述第1骨架中，朝向前述一對第1鏡片將顯示圖像的圖像光加以出射；及覆蓋部，具有與前述一對第1鏡片對向的一對第2鏡片以及保持前述一對第2鏡片的第2骨架，且以可拆裝的方式安裝於前述第1骨架；其中，前述一對第2鏡片的透光率低於前述一對第1鏡片的透光率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:AR眼鏡</p>
        <p type="p">2:本體部</p>
        <p type="p">10:骨架</p>
        <p type="p">11R,11L:鏡框</p>
        <p type="p">12:鼻橋</p>
        <p type="p">13R,13L:溝槽部</p>
        <p type="p">20R,20L:鏡片</p>
        <p type="p">30R,30L:端片</p>
        <p type="p">31R,31L:骨架</p>
        <p type="p">32R,32L:覆蓋部</p>
        <p type="p">40R,40L:鏡腳</p>
        <p type="p">41R,41L:骨架</p>
        <p type="p">42R,42L:絞鏈</p>
        <p type="p">50R,50L:耳端</p>
        <p type="p">50Rs,50Ls:內表面</p>
        <p type="p">60R,60L:緩衝墊</p>
        <p type="p">100:覆蓋部</p>
        <p type="p">110:骨架</p>
        <p type="p">111R,111L:鏡框</p>
        <p type="p">112:鼻橋</p>
        <p type="p">114:第1簷部</p>
        <p type="p">120R,120L:鏡片</p>
        <p type="p">CM1,CM2R,CM2L:攝影機</p>
        <p type="p">IS:照度感測器</p>
        <p type="p">S1:內表面</p>
        <p type="p">S2:外表面</p>
        <p type="p">S3:內表面</p>
        <p type="p">S4:外表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1980" publication-number="202625782">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625782</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147445</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於評估半導體材料的棒的電腦實施方法</chinese-title>
        <english-title>COMPUTER-IMPLEMENTED METHOD OF ASSESSING RODS OF SEMICONDUCTOR MATERIAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260309B">H10P74/20</main-classification>
        <further-classification edition="200601120260309B">G01N21/88</further-classification>
        <further-classification edition="202301120260309B">G06N3/08</further-classification>
        <further-classification edition="201801120260309B">G06F9/44</further-classification>
        <further-classification edition="202201120260309B">G06V10/22</further-classification>
        <further-classification edition="202201120260309B">G06V10/24</further-classification>
        <further-classification edition="202201120260309B">G06V10/26</further-classification>
        <further-classification edition="202201120260309B">G06V10/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商瓦克化學公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WACKER CHEMIE AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菲拉　皮歐特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FILAR, PIOTR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿克曼　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACKERMANN, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比爾施奈德　約翰內斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIERSCHNEIDER, JOHANNES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勞　沃夫岡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAU, WOLFGANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文賽斯　馬庫斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENZEIS, MARKUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳翠華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於評估半導體材料的棒的電腦實施方法，其中該棒係藉由氣相沉積反應器中的生產過程製造，其中該方法包含以下步驟：&lt;br/&gt;  控制具有至少一個相機的成像裝置，該相機用於在一批次棒的該生產過程結束之後擷取該氣相沉積反應器的反應室中的該批次棒的一個或多個圖像，以及&lt;br/&gt;  在至少一個機器學習模型中處理輸入資料以便獲得輸出資料，&lt;br/&gt;  其中該輸入資料係基於該一個或多個圖像，&lt;br/&gt;  其中該輸出資料包含用於評估該棒的一個或多個輸出項目。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a computer-implemented method for assessing rods of semiconductor material, wherein the rods are produced by means of a production process in a vapor deposition reactor, wherein the method comprises the following steps:&lt;br/&gt; controlling an imaging device having at least one camera for capturing one or more images of a batch of rods in a reaction chamber of the vapor deposition reactor after the end of the production process for the batch of rods, and&lt;br/&gt; processing input data in at least one machine-learned model in order to obtain output data, &lt;br/&gt; wherein the input data are based on the one or more images,&lt;br/&gt; wherein the output data comprise one or more output elements for assessing the rods.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:反應器</p>
        <p type="p">305:反應室</p>
        <p type="p">306:中心軸</p>
        <p type="p">309:棒</p>
        <p type="p">311、312、313:視角</p>
        <p type="p">320:照明裝置</p>
        <p type="p">Z:方向</p>
        <p type="p">φ:方位角</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1981" publication-number="202625063">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625063</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147474</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>管理裝置、管理方法及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260305B">G06Q30/0601</main-classification>
        <further-classification edition="201901120260305B">G06F16/215</further-classification>
        <further-classification edition="201901120260305B">G06F16/954</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商樂天集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAKUTEN GROUP, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>厳妍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西川知孝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIKAWA, TOMONORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種可更佳地管理書籤之管理裝置、管理方法及程式。  &lt;br/&gt;本發明之管理裝置自根據使用者之請求而登錄之書籤中，擷取與當前未在電子市場中銷售之項目對應之書籤即休止書籤，算出表示與擷取出之休止書籤對應之項目在電子市場中再次銷售之可能性的再售程度。然後，擷取與算出之再售程度較預設之基準低之再售程度之項目對應之書籤作為建議刪除書籤，將擷取出之建議刪除書籤作為催促自書籤刪除之建議刪除通知，通知給使用者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S11~S22:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1982" publication-number="202625220">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625220</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147516</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>線纜</chinese-title>
        <english-title>CABLE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260211B">H01B7/02</main-classification>
        <further-classification edition="200601120260211B">H01B7/04</further-classification>
        <further-classification edition="200601120260211B">H01B7/08</further-classification>
        <further-classification edition="200601120260211B">H01B7/17</further-classification>
        <further-classification edition="200601120260211B">H01B11/10</further-classification>
        <further-classification edition="200601120260211B">H01B11/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英屬開曼群島商鴻騰精密科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOXCONN INTERCONNECT TECHNOLOGY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>KY</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龔宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GONG, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊阿南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, A-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝寒潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, HAN-RUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張祿侑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, LU-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周　毓成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEW, YUHTSENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種線纜，其包括：芯線；第一遮罩層，所述第一遮罩層縱向包覆在所述芯線外；第二遮罩層，所述第二遮罩層設置在所述第一遮罩層外；及外皮，所述外皮包覆所述第二遮罩層；所述第一遮罩層至少有兩個部分，不同的部分之間彼此間隔開以形成相鄰部，所述第二遮罩層包括多個部分，所述第二遮罩層的多個部分覆蓋對應的所述相鄰部，所述第二遮罩層的各部分的寬度大於相應的所述相鄰部的寬度，使得線纜進行彎折時，所述第二遮罩層的各部分仍然能覆蓋並遮罩對應的所述相鄰部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cable includes: a core wire; first shielding layer covering the core wire in a longitudinal manner; a second shielding layer covering the first shielding layer; and an outer sheath covering the second shielding layer; wherein the first shielding layer has at least two parts spaced apart to form adjacent portions, the second shielding layer has a plurality of parts covering the adjacent portions, and a width of each part of the second shielding layer is greater than a distance of the adjacent portions，so that when the cable is bent, the second shielding layer can still cover and shield the adjacent portions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:線纜</p>
        <p type="p">10:芯線</p>
        <p type="p">11:內芯線</p>
        <p type="p">12:護套</p>
        <p type="p">101:內導體</p>
        <p type="p">102:內絕緣層</p>
        <p type="p">112:空氣間隙</p>
        <p type="p">130:第一遮罩層</p>
        <p type="p">131:第一部分</p>
        <p type="p">132:第二部分</p>
        <p type="p">133:開口</p>
        <p type="p">15:外皮</p>
        <p type="p">170:第二遮罩層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1983" publication-number="202623824">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623824</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147545</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於處理及預防甲癬的包含次氯酸的合成物</chinese-title>
        <english-title>COMPOSITION COMPRISING HYPOCHLOROUS ACID FOR USE IN THE TREATMENT AND PREVENTION OF ONYCHOMYCOSIS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">A61K33/20</main-classification>
        <further-classification edition="200601120260102B">A61K47/02</further-classification>
        <further-classification edition="200601120260102B">A61P31/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商雅各臣貿易有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JACOBSON VAN DEN BERG (CHINA) LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　國明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM, KWOK-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林明璇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種在用於處理及預防甲癬的包含次氯酸的合成物，包括：約1至50,000ppm的次氯酸；pH調整劑以調整合成物的pH到2至9；以及水。優選地，合成物包括100至200ppm的次氯酸。優選地，合成物包括240ppm以下的pH調整劑。優選地，pH調整劑調整合成物的pH到5至6.5。優選地，pH調整劑包括碳酸鈉、碳酸氫鈉和氫氧化鈣的其中一種。該次氯酸可抑制或殺死紅色毛癬菌、白色念珠菌、鐮孢菌屬、麴黴屬、枝頂孢黴屬、柱頂孢黴屬、和短柄帚黴及其他有潛在風險引致灰甲的真菌菌株和其孢子，因此有效處理灰指甲內的真菌及孢子和其他引致灰甲的病菌，避免灰甲反覆復發，為患者帶來徹底的解決方案，並為一般大眾（包括患者）在甲癬的癥狀出現之前提供良好方法預防甲癬的形成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1984" publication-number="202623879">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623879</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147547</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>酸性蝕刻銅用之吸收氯氣回用裝置</chinese-title>
        <english-title>CHLORINE ABSORPTION AND RECYCLING DEVICE FOR ACIDIC COPPER ETCHING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">B01D53/18</main-classification>
        <further-classification edition="200601120260202B">B01D53/68</further-classification>
        <further-classification edition="200601120260202B">B01D53/78</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳市京中康科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENZHEN JINGZHONGKANG TECHNOLOGY CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張建軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JIAN JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何國雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, GUOX IONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳清華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, QING HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹尚書</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAO, SHU ZHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周京萍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, JING PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯慶辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種酸性蝕刻銅用之吸收氯氣回用裝置，涉及氯氣回收技術領域，包括塔體和均布組件，塔體一側設置有進氣管，均布組件設置於進氣管位於塔體內的一端，均布組件包括外罩、均布腔、出氣口、集液槽、出液口、排液口、均布葉輪和隔水膜，進氣管位於塔體內的一端連接有外罩，且外罩內開設有均布腔。使用時對送入塔體的廢氣進行氣液分離，並均布廢氣以提升廢氣與吸收液的接觸面，對氯氣充分吸收，在對吸收氯氣後的尾氣進行排放前的除濕，對尾氣中的氯氣含量進行檢測，若殘留氯氣過多則將尾氣進行回流再次吸收，並同步對吸收液進行處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a chlorine-absorption and recycling device for acidic copper etching, belonging to the technical field of chlorine recovery. The device includes a tower body and a distribution assembly. An air inlet pipe is arranged on one side of the tower body, and the distribution assembly is positioned at the end of the air inlet pipe inside the tower body. The distribution assembly comprises an outer cover, a distribution chamber, an air outlet, a liquid collecting tank, a liquid outlet, a drainage outlet, a distribution impeller, and a water-blocking membrane. The end of the air inlet pipe located inside the tower body is connected to the outer cover, and a distribution chamber is formed inside the outer cover. During operation, the waste gas introduced into the tower body undergoes gas–liquid separation and is evenly distributed to increase the contact area between the waste gas and the absorbing liquid, thereby allowing full absorption of chlorine gas. Before the exhaust gas, after chlorine absorption, is discharged, dehumidification is carried out. The chlorine concentration in the exhaust gas is then monitored, and if excessive residual chlorine is detected, the exhaust gas is recirculated for further absorption. At the same time, the absorbing liquid is also processed accordingly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:均布組件</p>
        <p type="p">301:外罩</p>
        <p type="p">302:均布腔</p>
        <p type="p">303:出氣口</p>
        <p type="p">304:集液槽</p>
        <p type="p">305:出液口</p>
        <p type="p">306:排液口</p>
        <p type="p">307:均布葉輪</p>
        <p type="p">308:隔水膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1985" publication-number="202624814">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624814</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147548</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光連接器組件</chinese-title>
        <english-title>OPTICAL CONNECTOR ASSEMBLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260121B">G02B6/42</main-classification>
        <further-classification edition="200601120260121B">G02B6/36</further-classification>
        <further-classification edition="200601120260121B">G02B6/26</further-classification>
        <further-classification edition="200601120260121B">G02B6/24</further-classification>
        <further-classification edition="200601120260121B">G02B6/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>星系科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIP INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光連接器組件，包括第一連接器和光傳輸裝置。第一連接器包括設置在光子積體電路一側的基座，以及設置在基座上與光子積體電路光耦合的波導裝置。光傳輸裝置所包括的第二連接器可拆卸地連接至第一連接器，並且包括主體和可移動地連接至主體的可動緊固件。可動緊固件在垂直於波導裝置的厚度方向緊固於第一連接器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical connector assembly includes a first connector and an optical transmission device. The first connector includes a base mounted to a side of a photonic integrated circuit, and a waveguide device installed on the base in optical communication with the photonic integrated circuit. The second connector included in the optical transmission device is detachably connected to the first connector and includes a main body and a movable fastening member movably connected to the main body. The movable fastening member is movably fastened to the first connector in a direction perpendicular to a thickness direction of the waveguide device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光連接器組件</p>
        <p type="p">1:第一連接器</p>
        <p type="p">11:基座</p>
        <p type="p">15:卡合件</p>
        <p type="p">150:保持空間</p>
        <p type="p">151:卡合凸起</p>
        <p type="p">20:波導裝置</p>
        <p type="p">3:光傳輸裝置</p>
        <p type="p">31:光纖</p>
        <p type="p">32:第二連接器</p>
        <p type="p">321:主體</p>
        <p type="p">3231:第一台階部</p>
        <p type="p">3233:第二台階部</p>
        <p type="p">33:定位件</p>
        <p type="p">34:限位件</p>
        <p type="p">341:限位杆</p>
        <p type="p">342:彈性件</p>
        <p type="p">35:可動緊固件</p>
        <p type="p">350:緊固槽</p>
        <p type="p">351:罩部</p>
        <p type="p">352:彎曲部</p>
        <p type="p">353:連接部</p>
        <p type="p">355:翼部</p>
        <p type="p">51:光子積體電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1986" publication-number="202625452">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625452</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147549</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基於事件的雙重積分成像的系統與方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR EVENT-BASED DOUBLE INTEGRAL IMAGING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260102B">H04N25/53</main-classification>
        <further-classification edition="202401120260102B">G06T5/00</further-classification>
        <further-classification edition="202301120260102B">H04N25/78</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商豪威科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OMNIVISION TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱正偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, CHENG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬國淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, GUO-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　正賓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHENG-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">EVS事件資料可以作為多個事件值儲存在事件緩衝器中，每個事件值對應於多個事件幀中的相應事件幀。對於每個事件幀，處理器可以實現改進的EDI模型，以對於第一事件幀之後的每個事件幀，更新事件幀計數，並且僅在當前事件值不同於緊接在前的事件值時：（1）基於當前事件值和所有先前事件值更新事件資料的第一積分，以及（2）基於至少事件資料的第一積分和事件幀計數更新事件資料的第二積分，並使用至少事件資料的第二積分，對原始圖像資料進行去模糊，以產生潛在去模糊圖像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">EVS event data may be stored in an event buffer as a plurality of event values, each event value corresponding to a respective event frame of the plurality of event frames. For each event frame, a processor may implement an improved EDI model to update the event-frame count, for each event frame after a first event frame, and only when a current event value is different than an immediately preceding event value: (1) updating a first integral of event data based on the current event value and all preceding event values, and (2) updating a second integral of event data based on at least the first integral of event data and the event frame count, and using at least the second integral of event data, deblurring raw image data to yield a latent deblurred image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">802-818:塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1987" publication-number="202625342">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625342</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147553</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多模組直流-直流轉換器、集成磁性組件及集成磁性組件的製造方法</chinese-title>
        <english-title>MULTI-MODULE DC-DC CONVERTER, INTEGRATED MAGNETIC COMPONENT, AND MANUFACTURING METHOD OF INTEGRATED MAGNETIC COMPONENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200701120260102B">H02M1/00</main-classification>
        <further-classification edition="200601120260102B">H02M3/335</further-classification>
        <further-classification edition="201601120260102B">H01F41/071</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王達開</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, DAKAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫馬爾　美莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, MISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>包　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARBOSA, PETER MANTOVANELLI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種集成磁性組件及其製造方法，用於多模組直流-直流轉換器。集成磁性組件包含N個初級繞組、N個次級繞組及N個磁芯，且N為大於1的整數。N個磁芯是依序設置，且每個磁芯包含板件、第一共同磁芯柱、第二共同磁芯柱、電感磁芯柱及變壓器磁芯柱。第一共同磁芯柱及第二共同磁芯柱分別設置於板件的第一側及第二側。電感磁芯柱是架構為以對應初級繞組或對應次級繞組繞設，且變壓器磁芯柱是架構為以彼此交錯的對應初級及次級繞組繞設。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An integrated magnetic component and a manufacturing method thereof for a multi-module DC-DC converter are provided. The integrated magnetic component includes N primary windings, N secondary windings and N magnetic cores, and N is an integer greater than one. The N magnetic cores are arranged sequentially, and each magnetic core includes a plate, first and second common core legs, an inductor core leg and a transformer core leg. The first common core leg and the second common core leg are disposed at a first side and a second side of the plate respectively. The inductor core leg is configured to be wound with a corresponding primary or secondary winding, and the transformer core leg is configured to be wound with the corresponding primary and secondary windings interleaved with each other.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:多模組直流-直流轉換器</p>
        <p type="p">11、12、1N:轉換模組</p>
        <p type="p">Cin:輸入電容</p>
        <p type="p">Co:輸出電容</p>
        <p type="p">Vin:電源</p>
        <p type="p">RL:負載</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1988" publication-number="202625453">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625453</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147555</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>生成中解析度影像的方法</chinese-title>
        <english-title>METHOD FOR GENERATING A MIDDLE-RESOLUTION IMAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260102B">H04N25/57</main-classification>
        <further-classification edition="202301120260102B">H04N25/583</further-classification>
        <further-classification edition="202301120260102B">H04N25/77</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商豪威科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OMNIVISION TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慕　博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MU, BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉成明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHENGMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENG, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>代　鐵軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI, TIEJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於從影像感測器的像素單元生成影像資料的方法，包括對包括第零像素和第一像素的像素單元的重置閘極施加脈衝；透過分別對第零像素的第零轉移閘極和第一像素的第一轉移閘極順序施加脈衝，從像素單元生成訊號；以及避免對像素單元的重置閘極施加脈衝，直至第零轉移閘極和第一轉移閘極中的每個已被施加脈衝；對訊號進行採樣，以得到訊號S0和S1以及重置訊號；將合併訊號確定為訊號S1與重置訊號之間的差值；將從第零像素輸出的像素訊號確定為訊號S0與重置訊號之間的差值；及將從第一像素輸出的像素訊號確定為訊號S1與訊號S0之間的差值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for generating image data from a pixel cell of an image sensor includes pulsing a reset gate, of the pixel cell, that includes a zeroth pixel and a first pixel; generating a signal from the pixel cell by sequentially pulsing a zeroth transfer gate and a first transfer gate of the zeroth pixel and the first pixel, respectively; and abstaining from pulsing the reset gate of the pixel cell until each of the zeroth and the first transfer gate has been pulsed; sampling the signal to yield signals S0 and S1 and a reset-signal; determining a binned signal as a difference between signal S1 and reset-signal; determining a pixel signal, output from the zeroth pixel, as a difference between signal S0 and reset-signal; and determining a pixel signal, output from the first pixel, as a difference signal S1 and signal S0.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:影像感測器</p>
        <p type="p">407(1、2、...、&lt;i&gt;M&lt;/i&gt;):像素行</p>
        <p type="p">408(1、2、...、&lt;i&gt;N&lt;/i&gt;):像素列</p>
        <p type="p">1100:資料流程圖</p>
        <p type="p">1110:合併影像段</p>
        <p type="p">1112(1、2、...、&lt;i&gt;m&lt;/i&gt;):合併影像資料行</p>
        <p type="p">1114(1、2、...&lt;i&gt;N&lt;/i&gt;/&lt;i&gt;b&lt;/i&gt;):列</p>
        <p type="p">1120:高解析度影像段</p>
        <p type="p">1122(1、2、...、&lt;i&gt;p&lt;/i&gt;&lt;sub&gt;1&lt;/sub&gt;&lt;i&gt;m&lt;/i&gt;):高解析度資料行</p>
        <p type="p">1130:上採樣合併影像段</p>
        <p type="p">1132(1、2、...、&lt;i&gt;p&lt;/i&gt;&lt;sub&gt;1&lt;/sub&gt;&lt;i&gt;m&lt;/i&gt;):行</p>
        <p type="p">1134(1、2、...、&lt;i&gt;N&lt;/i&gt;):列</p>
        <p type="p">1140:組合影像段</p>
        <p type="p">1151-1153:通道段</p>
        <p type="p">1161-1163:上採樣通道段</p>
        <p type="p">1171-1173:下採樣通道段</p>
        <p type="p">1180:重馬賽克影像段</p>
        <p type="p">1182(1):非邊緣行</p>
        <p type="p">1182(2,3,...R):非邊緣行</p>
        <p type="p">1210-1270:步驟</p>
        <p type="p">1310:步驟</p>
        <p type="p">1320:步驟</p>
        <p type="p">
        &lt;i&gt;b&lt;/i&gt;:合併因數</p>
        <p type="p">
        &lt;i&gt;M&lt;/i&gt;:行數</p>
        <p type="p">
        &lt;i&gt;N&lt;/i&gt;:列數</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1989" publication-number="202624521">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624521</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147594</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>碳材料及其製造方法、以及碳複合材料及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260206B">C23C16/26</main-classification>
        <further-classification edition="201701120260206B">C01B32/15</further-classification>
        <further-classification edition="201001120260206B">H01M4/133</further-classification>
        <further-classification edition="200601120260206B">C08L101/12</further-classification>
        <further-classification edition="201301120260206B">H01G11/22</further-classification>
        <further-classification edition="201301120260206B">H01G11/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商３ＤＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>3DC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井殿大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IDEN, MASARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種碳材料及其製造方法、以及碳複合材料及其製造方法，具有高導電性等的特性且能夠適用於各種產品。本發明的碳材料，是纖維狀且在內部具備由複數個孔在3次元連續而成的孔群。本發明的碳複合材料，具備芯部，是纖維狀且具有多孔質構造；及，3次元碳構造部，覆蓋前述芯部的外表面並且存在於前述多孔質構造的內部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1990" publication-number="202624098">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624098</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147620</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>空中搬運車及其擷取模組</chinese-title>
        <english-title>OVERHEAD HOIST TRANSPORT (OHT) VEHICLE AND CAPTURING MODULE THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251217B">B65G47/60</main-classification>
        <further-classification edition="200601120251217B">B65G35/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盟立自動化股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIRLE AUTOMATION CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林郁茹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種空中搬運車及其擷取模組。所述擷取模組包含一捲揚機構、一夾持機構、及一調整機構。所述捲揚機構包含一支撐體、安裝於所述支撐體的一傳動輪組、安裝於所述支撐體並連動於所述傳動輪組的一驅動件、及各繞設於所述傳動輪組中皮帶輪的多個皮帶。所述夾持機構包含有連接於多個所述皮帶底端的多個連接部。所述調整機構安裝於所述支撐體且其位置對應且間隔於至少一個所述皮帶，其定義為一目標皮帶。所述調整機構能通過頂抵於所述目標皮帶實施一調整作業，以使相連於所述目標皮帶的所述連接部的高度隨之抬升。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides an overhead hoist transport (OHT) vehicle and a capturing module thereof. The capturing module includes a winch mechanism, a clamping mechanism, and an adjustment mechanism. The winch mechanism includes a support, a transmission wheel assembly assembled to the support, a driver assembled to the support and linked to the transmission wheel assembly, and a plurality of belts that are respectively wound around the belt pulleys of the transmission wheel assembly. The clamping mechanism includes a plurality of connection portions respectively connected to bottom ends of the belts. The adjustment mechanism is assembled to the support, and the adjustment mechanism corresponds in position to and is spaced apart from at least one of the belts that is defined as a target belt. The adjustment mechanism is configured to implement an adjustment process by abutting against the target belt for enabling the connection portion connected to the target belt to be raised up.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:擷取模組</p>
        <p type="p">1:捲揚機構</p>
        <p type="p">11:支撐體</p>
        <p type="p">12:傳動輪組</p>
        <p type="p">121:傳動桿</p>
        <p type="p">122:皮帶輪</p>
        <p type="p">122-1:第一皮帶輪</p>
        <p type="p">122-2:第二皮帶輪</p>
        <p type="p">123:輔助輪</p>
        <p type="p">123-1:第一輔助輪</p>
        <p type="p">123-2:第二輔助輪</p>
        <p type="p">13:驅動件</p>
        <p type="p">14:皮帶</p>
        <p type="p">14a:目標皮帶</p>
        <p type="p">14-1:第一皮帶</p>
        <p type="p">14-2:第二皮帶</p>
        <p type="p">141:底端部</p>
        <p type="p">142a、142b、142c:皮帶段</p>
        <p type="p">2:夾持機構</p>
        <p type="p">21:連接部</p>
        <p type="p">3:調整機構</p>
        <p type="p">31:調整器</p>
        <p type="p">311:位移件</p>
        <p type="p">312:轉動件</p>
        <p type="p">32:連接件</p>
        <p type="p">4:距離感測器</p>
        <p type="p">5:多軸感測器</p>
        <p type="p">200:車體</p>
        <p type="p">D:補正深度</p>
        <p type="p">F:載具</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1991" publication-number="202623874">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623874</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147665</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>聚醚的純化方法與系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">B01D3/38</main-classification>
        <further-classification edition="200601120260102B">C08G65/30</further-classification>
        <further-classification edition="200601120260102B">C08G65/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中國石油化工科技開發有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA PETROCHEMICAL TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王瀚彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HANBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡帥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, SHUAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畢豐雷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BI, FENGLEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李雋森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JUNSEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳展俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種聚醚的純化方法與系統，所述純化方法包括：(1)用汽提蒸氣I對聚醚粗產物與進行一次汽提，其中，所述汽提蒸氣I選自有機醇蒸氣或有機醇水溶液蒸氣。所述方法和系統主要解決聚合物多元醇脫雜質工藝純化成本高、工藝複雜、各組份無法有效分離、產品品質差等問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">101:聚醚粗產品進料</p>
        <p type="p">102:加熱後粗產品進料</p>
        <p type="p">103:汽提塔I的塔釜物料I</p>
        <p type="p">104:汽提塔I的塔頂物料I</p>
        <p type="p">105:汽提塔I的塔頂物料I一次凝液</p>
        <p type="p">106:汽提塔I的塔頂物料I二次凝液</p>
        <p type="p">107:混合物料I</p>
        <p type="p">108:除醛後混合物料I</p>
        <p type="p">109:汽提蒸氣I</p>
        <p type="p">110:汽提塔II進料</p>
        <p type="p">201:汽提塔II塔釜出料</p>
        <p type="p">202:純化聚醚</p>
        <p type="p">203:汽提塔II的塔頂物料II</p>
        <p type="p">204:汽提塔II的塔頂物料II冷卻液</p>
        <p type="p">205:汽提塔II塔頂凝液</p>
        <p type="p">206:汽提塔II塔頂氣相</p>
        <p type="p">207:混合物料II</p>
        <p type="p">208:汽提蒸氣II</p>
        <p type="p">E1:換熱器I</p>
        <p type="p">E2:換熱器II</p>
        <p type="p">E3:蒸氣發生器</p>
        <p type="p">E4:冷卻器</p>
        <p type="p">P3:汽提塔II塔頂氣相泵</p>
        <p type="p">T1:汽提塔I</p>
        <p type="p">T2:汽提塔II</p>
        <p type="p">V1:脫醛裝置</p>
        <p type="p">V2:凝液罐</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1992" publication-number="202624301">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624301</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147712</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>減少及防止用於生產烯系不飽和單體之製程中聚合物積垢及附聚的方法及其相關組合物</chinese-title>
        <english-title>METHOD OF REDUCING AND PREVENTING POLYMER FOULING AND AGGLOMERATION IN PROCESSES FOR PRODUCING ETHYLENICALLY UNSATURATED MONOMERS AND COMPOSITIONS RELATED THERETO</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08F216/14</main-classification>
        <further-classification edition="200601120260302B">C08F220/06</further-classification>
        <further-classification edition="202201120260302B">C09K23/52</further-classification>
        <further-classification edition="200601120260302B">C07C51/50</further-classification>
        <further-classification edition="200601120260302B">C07C57/04</further-classification>
        <further-classification edition="200601120260302B">C07C67/62</further-classification>
        <further-classification edition="200601120260302B">C07C69/54</further-classification>
        <further-classification edition="200601120260302B">C07C253/32</further-classification>
        <further-classification edition="200601120260302B">C07C255/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商ＢＬ科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BL TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝小安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, XIAOAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高嫄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史永濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, YONGTAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種減少與諸如用於製備烯系不飽和單體之處理設備接觸之製程流體中聚合物積垢的方法。該方法包括使製程流體中之聚合物積垢物與具有結構式I之水溶性聚合物接觸，其中E為來自可聚合烯系不飽和單體之重複單元；R&lt;sub&gt;1&lt;/sub&gt;及R&lt;sub&gt;2&lt;/sub&gt;獨立地為H或C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;4&lt;/sub&gt;烷基；X為OR、OOR、OM、NH&lt;sub&gt;2&lt;/sub&gt;、NH-R或NH-O-R；Y為SO&lt;sub&gt;3&lt;/sub&gt;M或OSO&lt;sub&gt;3&lt;/sub&gt;M；Q為C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;4&lt;/sub&gt;伸烷基或羰基；P為O、NH或NR；R&lt;sub&gt;3&lt;/sub&gt;為C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;100&lt;/sub&gt;烷基、C&lt;sub&gt;2&lt;/sub&gt;-C&lt;sub&gt;100&lt;/sub&gt;伸烷基、C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;100&lt;/sub&gt;經羥基取代之烷基部分或C&lt;sub&gt;2&lt;/sub&gt;-C&lt;sub&gt;100&lt;/sub&gt;經羥基取代之伸烷基部分；M為氫或水溶性陽離子；R為烷基；a為0-100；且b:c之莫耳比為30:1至1:20。  &lt;br/&gt;&lt;img align="absmiddle" height="287px" width="590px" file="ed10006.JPG" alt="ed10006.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for reducing polymer fouling in a process fluid in contact with processing equipment for the preparation of an ethylenically unsaturated monomer, such as is provided. The method includes contacting a polymer foulant in the process fluid with a water-soluble polymer having structural Formula I, where E is a repeating unit from a polymerizable ethylenically unsaturated monomer; R&lt;sub&gt;1&lt;/sub&gt; and R&lt;sub&gt;2&lt;/sub&gt; are independently H or a C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;4&lt;/sub&gt; alkyl group; X is OR, OOR, OM, NH&lt;sub&gt;2&lt;/sub&gt;, NH-R, or NH-O-R; Y is SO&lt;sub&gt;3&lt;/sub&gt;M or OSO&lt;sub&gt;3&lt;/sub&gt;M; Q is a C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;4&lt;/sub&gt; alkylene group or a carbonyl group; P is O, NH or NR; R&lt;sub&gt;3&lt;/sub&gt; is a C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;100&lt;/sub&gt; alkyl group, a C&lt;sub&gt;2&lt;/sub&gt;-C&lt;sub&gt;100&lt;/sub&gt; alkylene group, a C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;100&lt;/sub&gt; hydroxy- substituted alkyl moiety or C&lt;sub&gt;2&lt;/sub&gt;-C&lt;sub&gt;100&lt;/sub&gt; hydroxy-substituted alkylene moiety; M is hydrogen or a water-soluble cation; R is an alkyl group; a is 0-100; and the molar ratio of b:c is from 30:1 to 1:20. &lt;br/&gt;&lt;img align="absmiddle" height="241px" width="570px" file="ed10007.JPG" alt="ed10007.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:典型甲基丙烯酸酯及/或甲基丙烯酸ACH製造製程</p>
        <p type="p">20:反應器</p>
        <p type="p">30:廢酸流</p>
        <p type="p">40:儲槽</p>
        <p type="p">50:回收單元</p>
        <p type="p">A:點</p>
        <p type="p">B:點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1993" publication-number="202624942">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624942</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147808</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含多個區域之觸控顯示裝置及其控制方法</chinese-title>
        <english-title>TOUCH DISPLAY DEVICE INCLUDING PLURALITY OF REGIONS AND METHOD OF CONTROLLING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">G06F3/041</main-classification>
        <further-classification edition="200601120260305B">G06F3/044</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＸ半導體科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LX SEMICON CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宰煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JAE HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>催相珉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, SANG MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李鎭完</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHINWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">依據本發明之一實施例之包含多個區域之一觸控顯示裝置的控制方法，包含：施加觸控驅動訊號至該等區域中之第一區域；在施加觸控驅動訊號至第一區域時進行控制，以防止觸控驅動訊號被施加至該等區域中除第一區域以外的多個其他區域；僅在於第一區域中辨識到觸控時，同時施加觸控驅動訊號至所有的該等區域；以及基於回應於被施加至所有的該等區域之觸控驅動訊號之辨識，判定第一區域中之觸控是否正常。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of controlling a touch display device including a plurality of regions according to one embodiment of the present invention includes: applying a touch driving signal to a first region; performing control so as not to apply the touch driving signal to other regions while applying the touch driving signal to the first region; applying the touch driving signal to a second region when a touch is not recognized in the first region; performing control so as not to apply the touch driving signal to other regions while applying the touch driving signal to the second region; simultaneously applying the touch driving signal to all regions only when a touch is recognized in the second region; and when a touch is recognized again in the second region in response to the touch driving signal applied to all regions, regarding the recognized touch as a normal touch.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S810,S820,S830,S840,S850,S860,S870:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1994" publication-number="202625849">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625849</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147827</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用在光誘發組件轉移之方法中的施體基體</chinese-title>
        <english-title>DONOR SUBSTRATE FOR USE IN A METHOD OF LIGHT-INDUCED COMPONENT TRANSFER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260309B">H10W72/00</main-classification>
        <further-classification edition="202601120260309B">H10W20/40</further-classification>
        <further-classification edition="202501120260309B">H10H29/03</further-classification>
        <further-classification edition="200601120260309B">G02B27/40</further-classification>
        <further-classification edition="200601120260309B">G02B11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭應用科學研究組織</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧利羅　瑞卡多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OLLEARO, RICCARDO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德洛伍　尼克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE LOUW, NICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡奇　阿克切塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARKI, AKCHHETA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗雷德魯斯　亨里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLEDDERUS, HENRI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿魯提諾夫　加里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARUTINOV, GARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格林克　葛溫　Ｈ．</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GELINCK, GERWIN HERMANUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文件係關於一種用在向一受體基體之光誘發組件轉移之一方法中的施體基體。該施體基體包含一光學透明載體，且為了在轉移之前支撐至少一個組件，進一步包含在該光學透明載體上之一接觸層，該接觸層係組配來將該組件附接於該施體基體。該接觸層包含用於被照明之一釋放層，該釋放層係組配來在暴露於光束時釋放該組件。該接觸層之至少部分被圖案化以便在至少一接觸區域上形成將該組件連接於該施體基體之接觸元件，使得該等接觸區域的一總和小於該組件之支撐表面之一總區域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present document relates to a donor substrate for use in a method of light-induced component transfer to an acceptor substrate. The donor substrate comprises an optically transparent carrier and for supporting the at least one component prior to transfer, further comprises a contact layer on the optically transparent carrier configured to attach the component to the donor substrate. The contact layer comprises a release layer for being illuminated configured to release the component when exposed to the light beam. At least part of the contact layer is patterned such as to form contact elements connecting the component to the donor substrate over at least a contact area, such that a sum of the contact areas is smaller than a total area of the component's support surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:施體基體</p>
        <p type="p">2:組件</p>
        <p type="p">3:受體基體</p>
        <p type="p">4:支撐表面</p>
        <p type="p">5:光學透明載體</p>
        <p type="p">6:光束</p>
        <p type="p">7:光源</p>
        <p type="p">8:接觸層</p>
        <p type="p">9:釋放層</p>
        <p type="p">10:接觸元件</p>
        <p type="p">11:接觸區域</p>
        <p type="p">12:支撐表面之區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1995" publication-number="202625602">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625602</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147848</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種半導體基板的製造方法以及採用此方法製造的半導體基板。</chinese-title>
        <english-title>A METHOD FOR PRODUCING A SEMICONDUCTOR SUBSTRATE AND THE SEMICONDUCTOR SUBSTRATE WHICH IS PRODUCED BY THE METHOD.</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260224B">H10D62/852</main-classification>
        <further-classification edition="200601120260224B">B32B3/26</further-classification>
        <further-classification edition="200601120260224B">C30B23/02</further-classification>
        <further-classification edition="200601120260224B">C30B29/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柏林研發總會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FORSCHUNGSVERBUND BERLIN E.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>路茲　格爾哈爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUTZ, GEELHAAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧利弗　布蘭特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OLIVER, BRANDT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張懷德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, HUAI-DE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭振田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體基板的製造方法，係包括提供一基底基板(10)。該方法還包括：在一氮過量（化學計量過量）條件下，沿一外延生長方向(A)使一第一III族氮化物半導體層(20)外延生長於該基底基板(10)上，其中該第一III族氮化物半導體層(20)的表面(22)具有多個凹陷(24)，這些凹陷(24)係由相對於該外延生長方向(A)呈斜向取向之刻面(24)所界定。該方法進一步包括：沿該外延生長方向(A)在該第一III族氮化物半導體層(20)上外延生長一第二III族氮化物半導體層30，其覆蓋該等凹陷(24)。此外，本發明亦關於一種半導體基板(100)，其優選為依照上述方法製得。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a method for manufacturing a semiconductor substrate (100). The method comprises providing a base substrate (10).&lt;br/&gt; The method further comprises growing a first group-III nitride semiconductor layer (20) on the base substrate (10) along a growth direction (A) under a superstoichiometric nitrogen supply, wherein a surface (22) of the first group-III nitride semiconductor layer (20) comprises recesses (24) defined by facets (26) of the first group-III nitride semiconductor layer (20) oriented obliquely with respect to the growth direction (A). The method further comprises growing a second group-III nitride semiconductor layer (30) on the first group-III nitride semiconductor layer (20) along the growth direction (A). The second group-III nitride semiconductor layer (30) covers the recesses (24). The invention further relates to a semiconductor substrate (100), which is preferably produced by the method.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基底基板</p>
        <p type="p">12:AlN層或GaN層</p>
        <p type="p">14:藍寶石層</p>
        <p type="p">20:第一III族氮化物半導體層</p>
        <p type="p">22:第一III族氮化物半導體層之表面</p>
        <p type="p">24:凹陷</p>
        <p type="p">26:刻面</p>
        <p type="p">30:第二III族氮化物半導體層</p>
        <p type="p">4:中空區</p>
        <p type="p">100:半導體基板</p>
        <p type="p">A:外延生長方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1996" publication-number="202624912">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624912</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147861</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>控制機器人行駛的方法及機器人</chinese-title>
        <english-title>METHOD FOR CONTROLLING ROBOT MOVEMENT AND ROBOT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120260211B">G05D1/43</main-classification>
        <further-classification edition="202401120260211B">G05D1/242</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京極智嘉科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING GEEKPLUS TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋春旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, CHUN XU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧明寬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, MING KUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李然</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, RAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尚文玉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANG, WEN YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈桐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIA, TONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俐均</last-name>
                <first-name></first-name>
              </chinese-name>
              <address></address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種控制機器人行駛的方法及機器人，該方法包括：獲取機器人對應的待執行任務；其中，待執行任務包括一規劃路徑；基於機器人對應的參考行駛參數，控制機器人按照規劃路徑在一目標倉庫中行駛；透過機器人的一檢測裝置採集機器人在目標倉庫行駛過程中的目標行駛資訊；基於目標行駛資訊及規劃路徑，確定機器人的行駛誤差參數；基於行駛誤差參數對參考行駛參數進行調整，得到目標行駛參數，並控制機器人基於目標行駛參數按照規劃路徑行駛。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides a method for controlling the movement of a robot and a robot, and the method includes: obtaining a task to be performed corresponding to the robot; wherein the task to be performed includes planning a planned path; based on reference driving parameters corresponding to the robot, controlling the robot to travel in a target warehouse according to the planned path; collecting target driving information of the robot during its movement in the target warehouse through a detection device of the robot; determining driving error parameters of the robot based on the target driving information and the planned path; adjusting the reference driving parameters based on the driving error parameters to obtain target driving parameters, and controlling the robot to travel according to the planned path based on the target driving parameters.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110,120,130,140,150:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1997" publication-number="202625759">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625759</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147889</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>保持裝置及基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/70</main-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
        <further-classification edition="202601120260302B">H10P70/00</further-classification>
        <further-classification edition="200601120260302B">B65G47/90</further-classification>
        <further-classification edition="200601120260302B">B05C11/10</further-classification>
        <further-classification edition="200601120260302B">B05D1/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福本将也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUMOTO, SHOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>根本脩平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEMOTO, SHUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實現一種能夠降低由熱所致之被加工物之水平度惡化之保持裝置。本發明之保持旋轉機構(2)包含以保持面(210)保持基板之保持部(211)；且保持部包含：保持本體部(211a)，其由金屬構成；流體導通部(211b)，其形成有流體導通口(211c)，由樹脂構成，該流體導通口(211c)貫通保持部並供流體自該被加工物與保持部之間之空間、或向該空間導通；及樹脂塗層(211d)，其設置於保持本體部之保持面側之面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">21:旋轉夾具</p>
        <p type="p">25:流體導通路</p>
        <p type="p">28:配管</p>
        <p type="p">210:保持面</p>
        <p type="p">211:保持部</p>
        <p type="p">211a:保持本體部</p>
        <p type="p">211b:流體導通部</p>
        <p type="p">211c:流體導通口</p>
        <p type="p">211d:樹脂塗層</p>
        <p type="p">211e:凹部</p>
        <p type="p">211f:筒部</p>
        <p type="p">212:基座部</p>
        <p type="p">213a:第1密封構件</p>
        <p type="p">213b:第2密封構件</p>
        <p type="p">214:螺釘</p>
        <p type="p">215:面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1998" publication-number="202625767">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625767</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147890</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/78</main-classification>
        <further-classification edition="202601120260302B">H10P72/50</further-classification>
        <further-classification edition="202601120260302B">H10P50/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福本将也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUMOTO, SHOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>根本脩平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEMOTO, SHUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梶野一樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAJINO, ITSUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南翔耀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINAMI, SHOYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>正司和大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHOJI, KAZUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菱谷大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HISHITANI, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明將對基板施以處理之裝置之構成簡單化。處理單元之控制單元當藉由定心機構進行定心時，以於真空管線中氣體流動之方向成為與真空時為反向之方式，控制進排氣機構，且根據自定心機構對基板賦予之按壓力是否落於預設之規定範圍內，而判斷是否需要繼續進行定心。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:處理單元(基板處理裝置)</p>
        <p type="p">2:保持旋轉機構</p>
        <p type="p">2A:基板保持部</p>
        <p type="p">2B:旋轉機構</p>
        <p type="p">3:防飛散機構</p>
        <p type="p">4:上表面保護加熱機構</p>
        <p type="p">5:處理機構</p>
        <p type="p">6:氛圍分離機構</p>
        <p type="p">7:升降機構</p>
        <p type="p">8:定心機構(定心單元)</p>
        <p type="p">9:基板觀察機構(觀察單元)</p>
        <p type="p">10:控制單元(控制部)</p>
        <p type="p">10A:運算處理部</p>
        <p type="p">10B:記憶部</p>
        <p type="p">10C:讀取部</p>
        <p type="p">10D:圖像處理部</p>
        <p type="p">10E:驅動控制部</p>
        <p type="p">10F:通訊部</p>
        <p type="p">10G:排氣控制部</p>
        <p type="p">10H:顯示部</p>
        <p type="p">10J:輸入部</p>
        <p type="p">11:處理腔室</p>
        <p type="p">11a:底板</p>
        <p type="p">11f:頂面</p>
        <p type="p">11f1:開口</p>
        <p type="p">12:內部空間</p>
        <p type="p">12a:密閉空間</p>
        <p type="p">12b:外側空間</p>
        <p type="p">13:風扇過濾單元(FFU)</p>
        <p type="p">14:衝孔板</p>
        <p type="p">16:基座支持構件</p>
        <p type="p">17:基座構件</p>
        <p type="p">21:旋轉夾具(保持載台)</p>
        <p type="p">22:旋轉軸部</p>
        <p type="p">22A:吸引路</p>
        <p type="p">23:馬達</p>
        <p type="p">24:動力傳遞部</p>
        <p type="p">25:配管</p>
        <p type="p">26:進排氣機構</p>
        <p type="p">27:動力傳遞部</p>
        <p type="p">27a:圓板構件</p>
        <p type="p">27b:旋轉夾具側磁鐵</p>
        <p type="p">27c:杯側磁鐵</p>
        <p type="p">28:真空管線</p>
        <p type="p">31:旋轉杯部</p>
        <p type="p">32:下杯</p>
        <p type="p">33:上杯</p>
        <p type="p">34:固定杯部</p>
        <p type="p">38:排氣部</p>
        <p type="p">41:遮斷板</p>
        <p type="p">42:圓板部</p>
        <p type="p">43:支持構件</p>
        <p type="p">45:中央噴嘴</p>
        <p type="p">46:配管</p>
        <p type="p">47:加熱氣體供給部</p>
        <p type="p">48:帶狀加熱器</p>
        <p type="p">49:樑構件</p>
        <p type="p">50,51:處理液噴出噴嘴</p>
        <p type="p">57:噴嘴支持部</p>
        <p type="p">61:下密閉杯構件</p>
        <p type="p">62:上密閉杯構件</p>
        <p type="p">63,64:O型環</p>
        <p type="p">71:第1升降驅動部</p>
        <p type="p">72:第2升降驅動部</p>
        <p type="p">81:抵接部(第1定心單元)</p>
        <p type="p">82:抵接部(第2定心單元)</p>
        <p type="p">83:定心驅動部</p>
        <p type="p">93:觀察頭</p>
        <p type="p">94:觀察頭驅動部</p>
        <p type="p">211:吸附孔</p>
        <p type="p">231:旋轉軸</p>
        <p type="p">241:第1皮帶輪</p>
        <p type="p">242:第2皮帶輪</p>
        <p type="p">243:環形帶</p>
        <p type="p">331:下圓環部位</p>
        <p type="p">332:上圓環部位</p>
        <p type="p">333:傾斜部位</p>
        <p type="p">334:傾斜面</p>
        <p type="p">341:液承接部位</p>
        <p type="p">342:排氣部位</p>
        <p type="p">343:區劃壁</p>
        <p type="p">344:氣體導引部</p>
        <p type="p">421,471:加熱器</p>
        <p type="p">422:加熱器驅動部</p>
        <p type="p">571:圓筒部位</p>
        <p type="p">572:凸緣部位</p>
        <p type="p">611,612,621:凸緣部</p>
        <p type="p">613:突起部</p>
        <p type="p">AX:旋轉軸</p>
        <p type="p">RM:記錄媒體</p>
        <p type="p">S:基板</p>
        <p type="p">SP:基板處理部</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="1999" publication-number="202624505">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624505</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147985</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鐵素體系不銹鋼及其製造方法</chinese-title>
        <english-title>FERRITIC STAINLESS STEEL AND MANUFACTURING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260205B">C22C38/06</main-classification>
        <further-classification edition="200601120260205B">C22C38/14</further-classification>
        <further-classification edition="200601120260205B">C22C33/06</further-classification>
        <further-classification edition="201601120260205B">H01M8/021</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商浦項股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POSCO CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孔正賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONG, JUNGHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金鍾熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JONGHEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐輔晟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, BOSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴榮豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, YOUNGHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明的鐵素體系不銹鋼包括母材以及形成在所述母材的最外側表面部的氧化皮層，所述母材包括與所述氧化皮層接觸且包含Ti-Al複合氧化物的界面部，以重量%計，包含：C：0.0010%至0.0200%、N：0.0010%至0.0200%、Si：0.010%至0.400%、Mn：0.10%至1.50%、Cr：18.0%至25.0%、Mo：0.01%至2.00%、Nb：0.05%至1.00%、Ti：0.010%至0.200%、Al：0.010%至0.200%、餘量的Fe及其它不可避免的雜質，並且下述式(1)的1000×[Si]/(0.65×[Nb]+[Ti]+[Al])的值滿足390以下。&lt;br/&gt;  式(1)：1000×[Si]/(0.65×[Nb]+[Ti]+[Al])≤390&lt;br/&gt;  (其中，[Si]、[Nb]、[Ti]及[Al]表示各元素的重量%)</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2000" publication-number="202625713">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625713</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147992</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶圓加工裝置</chinese-title>
        <english-title>WAFER PROCESSING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P52/00</main-classification>
        <further-classification edition="202601120260302B">H10P50/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商未來股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEERE COMPANY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴榮熺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAK, YOUNG HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明一實施例的晶圓加工裝置可包括：轉檯，其以旋轉軸為中心旋轉，以定位至對晶圓進行磨削的磨削區域和對晶圓進行研磨的研磨區域；複數個卡盤台，其配置於所述轉檯上，供所述晶圓放置於其上；磨削裝置，其對位於所述磨削區域的所述晶圓進行磨削；研磨裝置，其對由所述磨削裝置磨削後的所述晶圓進行研磨；框架，其在所述轉檯上劃分所述磨削區域和所述研磨區域；以及水分去除部，其配置於所述框架上，用以去除透過所述轉檯的旋轉從所述磨削區域移動至所述研磨區域的所述晶圓的水分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:晶圓加工裝置</p>
        <p type="p">110:轉檯</p>
        <p type="p">121:第一卡盤台</p>
        <p type="p">122:第二卡盤台</p>
        <p type="p">123:第三卡盤台</p>
        <p type="p">130:粗磨裝置</p>
        <p type="p">140:磨削裝置</p>
        <p type="p">141:第一旋轉裝置</p>
        <p type="p">142:磨削輪</p>
        <p type="p">150:研磨裝置</p>
        <p type="p">151:第二旋轉裝置</p>
        <p type="p">152:研磨輪</p>
        <p type="p">160:框架</p>
        <p type="p">170:水分去除部</p>
        <p type="p">180:擺動噴嘴</p>
        <p type="p">A:輸送裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2001" publication-number="202623955">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623955</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114147993</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>晶圓加工裝置</chinese-title>
        <english-title>WAFER PROCESSING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260302B">B24B37/34</main-classification>
        <further-classification edition="202601120260302B">H10P52/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商未來股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEERE COMPANY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃斗善</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, DU SUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康智勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, ZHI YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明一實施例的加工裝置可包括：框架；研磨單元，其配置於所述框架上，並包括主軸電機、由所述主軸電機旋轉的研磨輪以及配置於所述研磨輪上的研磨輪罩；罩體，其具有供所述研磨輪穿過的加工孔，並可移動地配置於所述框架內；第一罩，其覆蓋所述研磨輪罩與所述加工孔之間，並由柔性材料製成；以及第二罩，其覆蓋所述罩體與所述框架之間，並由柔性材料製成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:加工裝置</p>
        <p type="p">110:框架</p>
        <p type="p">120:研磨單元</p>
        <p type="p">121:主軸電機</p>
        <p type="p">122:支架</p>
        <p type="p">123:研磨輪罩</p>
        <p type="p">130:罩體</p>
        <p type="p">140:第一罩</p>
        <p type="p">151:第二-1罩</p>
        <p type="p">152:第二-2罩</p>
        <p type="p">160:驅動部</p>
        <p type="p">161:第一移動體</p>
        <p type="p">162:第二移動體</p>
        <p type="p">1611:第一伺服電機</p>
        <p type="p">1612:第一驅動導軌</p>
        <p type="p">1621:第二伺服電機</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2002" publication-number="202624676">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624676</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148030</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>冷媒循環裝置</chinese-title>
        <english-title>REFRIGERANT CIRCULATION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260128B">F28D15/02</main-classification>
        <further-classification edition="200601120260128B">F28F9/26</further-classification>
        <further-classification edition="200601120260128B">F28F19/01</further-classification>
        <further-classification edition="200601120260128B">G06F1/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商尼得科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIDEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡慶次鋭彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKESHI, TOSHIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種能提高維護性的冷媒循環裝置。實施方式的冷媒循環裝置具備一次配管、二次配管、一次過濾器、二次過濾器及殼體。一次配管中提供一次冷媒流動。二次配管中提供二次冷媒流動。一次過濾器連接於一次配管。二次過濾器連接於二次配管。殼體容納一次配管、二次配管、一次過濾器及二次過濾器。一次過濾器及二次過濾器具備刷及把手。刷配置於一次過濾器的內部。把手驅動刷。把手配置於面向殼體的第一側面的位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure provides a refrigerant circulation device with improved maintainability. The refrigerant circulation device according to an embodiment includes a primary pipe, a secondary pipe, a primary filter, a secondary filter, and a housing. The primary pipe provides a flow of primary refrigerant. The secondary pipe provides a secondary refrigerant. The primary filter is connected to the primary pipe. The secondary filter is connected to the secondary pipe. The housing holds the primary pipe, the secondary pipe, and the secondary filter. The primary filter and the secondary filter each include a brush and a handle. The brush is located inside the primary filter. The handle drives the brush. The handle is located facing the first side surface of the housing.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:冷媒循環裝置</p>
        <p type="p">3:一次配管</p>
        <p type="p">4:二次配管</p>
        <p type="p">5:熱交換器</p>
        <p type="p">6:一次過濾器</p>
        <p type="p">8:泵</p>
        <p type="p">11:膨脹儲罐</p>
        <p type="p">12:顯示器</p>
        <p type="p">20:殼體</p>
        <p type="p">21:第一側面</p>
        <p type="p">22:門</p>
        <p type="p">31,41:流入口</p>
        <p type="p">32,42:流出口</p>
        <p type="p">61:一次把手</p>
        <p type="p">62:旋轉軸</p>
        <p type="p">81:馬達部</p>
        <p type="p">82:泵部</p>
        <p type="p">83:逆變器</p>
        <p type="p">142,143:調整閥</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2003" publication-number="202625739">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625739</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148085</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置及其所使用之門模組</chinese-title>
        <english-title>SUBSTRATE PROCESSING APPARATUS AND DOOR MODULE USED THEREFOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/00</main-classification>
        <further-classification edition="202601120260302B">H10P72/10</further-classification>
        <further-classification edition="202601120260302B">H10P72/50</further-classification>
        <further-classification edition="202601120260302B">H10P72/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＨＰＳＰ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HPSP CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安宰範</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHN, JAE BEOM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓釉大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, YUDAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳世昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, SE CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱珍元</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種基板處理裝置及其所使用之門模組。該門模組可包括遮斷門、旋轉門及執行器。該遮斷門可被形成為以遮斷由該基板處理裝置之外殼模組所界定之反應室。該旋轉門可被形成為可旋轉地連接於該遮斷門，隨著相對於該外殼模組自第一關係至第二關係旋轉，以鎖定於該外殼模組。該執行器可被形成為連接於該遮斷門，以使該遮斷門相對於該旋轉門對準。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a substrate processing apparatus and a door module used therefor. The door module may include a blocking door, a rotating door, and an actuator. The blocking door may be configured to block a reaction chamber defined by a housing module of the substrate processing apparatus. The rotating door may be configured to be rotatable connected to the blocking door, and to lock onto the housing module as it rotates relative to the housing module from a first relationship to a second relationship. The actuator may be configured to be connected to the blocking door to align the blocking door relative to the rotating door.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:內部腔室</p>
        <p type="p">113:晶舟</p>
        <p type="p">115:內部門</p>
        <p type="p">120:外部腔室</p>
        <p type="p">121:外部殼體</p>
        <p type="p">122:下部區域</p>
        <p type="p">125:門基座</p>
        <p type="p">126:支撐部件</p>
        <p type="p">127:旋轉門</p>
        <p type="p">150:鎖定模組</p>
        <p type="p">153:支撐突起</p>
        <p type="p">155:卡止突起</p>
        <p type="p">165:支架單元</p>
        <p type="p">166:第一支架</p>
        <p type="p">167:第二支架</p>
        <p type="p">E:開閉方向</p>
        <p type="p">R:旋轉方向</p>
        <p type="p">W:晶圓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2004" publication-number="202625566">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625566</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148086</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>RRAM電路及其操作方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260107B">H10B63/00</main-classification>
        <further-classification edition="200601120260107B">G11C11/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商廈門半導體工業技術研發有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郝午陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭喆鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉美冬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹家宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘天龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白麗霞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種RRAM電路及其操作方法，RRAM電路包括：m×n個儲存單元，每個儲存單元包括兩個電晶體和兩個記阻器；每個第一MOS開關的一端與第一字線連接，另一端與第二字線連接；同一行的儲存單元的兩個電晶體的源極連接至同一條第一源極線；每個第二MOS開關的閘極與第一字線連接，源極與第一源極線連接；所有第二MOS開關的汲極共同連接至第二源極線；其中，與被選中電晶體連接的第二字線接入第一電壓，第一MOS開關上的閘極電壓隨時序變化而發生改變，使得與被選中電晶體連接的第一字線的電壓升高；第二源極線接入第二電壓；在與被選中電晶體連接的第一字線的電壓升高至預定電壓時，與被選中電晶體連接的第一源極線的電壓等於第二電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:儲存單元</p>
        <p type="p">11:電晶體</p>
        <p type="p">12:記阻器</p>
        <p type="p">21:第一MOS開關</p>
        <p type="p">22:緩衝器</p>
        <p type="p">30:第二MOS開關</p>
        <p type="p">LWL:第一字線</p>
        <p type="p">GWL:第二字線</p>
        <p type="p">LSL:第一源極線</p>
        <p type="p">SL:第二源極線</p>
        <p type="p">BL:位線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2005" publication-number="202625740">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625740</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148087</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置</chinese-title>
        <english-title>SUBSTRATE PROCESSING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/00</main-classification>
        <further-classification edition="202601120260302B">H10P72/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＨＰＳＰ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HPSP CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安宰範</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHN, JAE BEOM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓釉大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, YUDAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳世昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, SE CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱珍元</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種基板處理裝置。該基板處理裝置可包括外殼模組、門模組、鎖定模組及對位模組。該外殼模組可以定義形成用以容納基板的反應室。該門模組可以具備形成為開閉該反應室的遮斷門。該鎖定模組設置於該外殼模組與該門模組，並可形成為鎖定該外殼模組與該門模組。該對位模組可形成為於該門模組接近該外殼模組的過程中，使該門模組相對於該外殼模組對位。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a substrate processing apparatus. The substrate processing apparatus may include a housing module, a door module, a locking module, and an alignment module. The housing module may define a reaction chamber for receiving a substrate. The door module may have a shut-off door configured to open and close the reaction chamber. The locking module is disposed on the housing module and the door module and is configured to lock the housing module and the door module. The alignment module is configured to align the door module relative to the housing module as the door module approaches the housing module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板處理裝置</p>
        <p type="p">113:承載架</p>
        <p type="p">115:內部門</p>
        <p type="p">120:外部腔室</p>
        <p type="p">121:外部殼體</p>
        <p type="p">125:外部門</p>
        <p type="p">127:支撐部件</p>
        <p type="p">150:鎖定模組</p>
        <p type="p">151:旋轉體</p>
        <p type="p">153:容納孔</p>
        <p type="p">153a:貫通部</p>
        <p type="p">153b:限制部</p>
        <p type="p">155:承托部件</p>
        <p type="p">155a、161a:柄部</p>
        <p type="p">155b、161b:頭部</p>
        <p type="p">160:對位模組</p>
        <p type="p">161:對位銷</p>
        <p type="p">165:對位孔</p>
        <p type="p">165a:基準部</p>
        <p type="p">165b:逃逸部</p>
        <p type="p">171:對位感測器</p>
        <p type="p">175:對位標靶</p>
        <p type="p">E:開閉方向</p>
        <p type="p">R:旋轉方向</p>
        <p type="p">W:晶圓</p>
        <p type="p">W&lt;sub&gt;1&lt;/sub&gt;、W&lt;sub&gt;2&lt;/sub&gt;:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2006" publication-number="202624130">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624130</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148089</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鈦酸化合物微粒粉末及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">C01G23/08</main-classification>
        <further-classification edition="200601120260313B">C08L1/02</further-classification>
        <further-classification edition="200601120260313B">C01F11/00</further-classification>
        <further-classification edition="202401120260313B">B01J35/58</further-classification>
        <further-classification edition="200601120260313B">C04B35/462</further-classification>
        <further-classification edition="202601320260313B">C09K111/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商戶田工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TODA KOGYO CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博多俊之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAKATA, TOSHIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖俊龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本實施方式涉及一種包含改性鈦酸化合物粉末的鈦酸化合物微粒粉末。詳細而言，該鈦酸化合物微粒粉末以少量的高分子分散劑提供能夠抑制粒子的凝聚和再凝聚的鈦酸化合物粉末分散體。另外，本實施方式涉及在各種溶劑中呈現優異的分散性的鈦酸化合物粉末分散體。並且，本實施方式涉及一種經濟且在工業上有利的鈦酸化合物微粒粉末的製造方法。本發明提供包含改性鈦酸化合物粉末的鈦酸化合物微粒粉末，上述改性鈦酸化合物粉末包含纖維素奈米纖維和鈦酸化合物粉末。上述纖維素奈米纖維與上述鈦酸化合物相互附著或吸附。上述鈦酸化合物微粒粉末的總碳量與上述鈦酸化合物微粒粉末的布魯納-埃米特-泰勒比表面積（Brunauer–Emmett–Teller surface area，BET）的比率為0.006以下。另外，提供鈦酸化合物微粒粉末的製造方法，包括：在將未改性鈦酸化合物粉末與纖維素奈米纖維混合後對該混合物進行乾燥的工序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2007" publication-number="202624166">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624166</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148130</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含氧化釔的複合物粉末及其製備方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C04B35/04</main-classification>
        <further-classification edition="200601120260202B">C04B35/505</further-classification>
        <further-classification edition="200601120260202B">C04B35/626</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商美可有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICO LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＫＯＭＩＣＯ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMICO LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DEUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金成龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNG YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嬉珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JO, HEE JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金大成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DAE SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭東勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, DONG HUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方晟植</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANG, SEONG SIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金藝燦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YE CHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的實施例提供一種複合物粉末的製備方法及通過該製備方法製備的複合物顆粒粉末，所述複合物粉末的製備方法包括：製備混合有氧化釔粉末、氧化鎂粉末、溶劑及有機添加劑的漿料的步驟；對所述漿料進行球磨製程的步驟；以及乾燥所述漿料，以製成包含所述氧化釔粉末及所述氧化鎂粉末的顆粒粉末，所述顆粒粉末包含氧化釔晶體及氧化鎂晶體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S100、S110、S120:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2008" publication-number="202624171">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624171</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148179</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>低溫共燒陶瓷基板的製造方法、低溫共燒陶瓷基板、高溫共燒陶瓷基板的製造方法、高溫共燒陶瓷基板、空間轉換器基板及探針卡</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">C04B35/64</main-classification>
        <further-classification edition="200601120260309B">G01R1/04</further-classification>
        <further-classification edition="200601120260309B">G01R1/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本電氣硝子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON ELECTRIC GLASS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大西直幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONISHI, NAOYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村奏太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, SOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石原健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIHARA, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">低溫共燒陶瓷基板的製造方法包括煆燒步驟S3以及孔部形成步驟S4。孔部形成步驟S4包括：第一凹部形成步驟S41，藉由對低溫共燒陶瓷基板6的第一主表面Sa照射雷射光L而形成第一凹部9；以及機械加工步驟S43，藉由自第一凹部9朝向低溫共燒陶瓷基板6的第二主表面Sb實施機械加工而形成孔部11。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S41:第一凹部形成步驟</p>
        <p type="p">S42:第二凹部形成步驟</p>
        <p type="p">S43:機械加工步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2009" publication-number="202624211">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624211</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148292</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>芳香環類衍生物及其製備方法和用途</chinese-title>
        <english-title>AROMATIC RING DERIVATIVES, THEIR PREPARATION METHODS AND USES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07D213/81</main-classification>
        <further-classification edition="200601120260202B">C07D401/04</further-classification>
        <further-classification edition="200601120260202B">C07D239/34</further-classification>
        <further-classification edition="200601120260202B">C07C317/22</further-classification>
        <further-classification edition="200601120260202B">C07C317/02</further-classification>
        <further-classification edition="200601120260202B">C07D405/12</further-classification>
        <further-classification edition="200601120260202B">A61K31/44</further-classification>
        <further-classification edition="200601120260202B">A61K31/166</further-classification>
        <further-classification edition="200601120260202B">A61K31/4439</further-classification>
        <further-classification edition="200601120260202B">A61K31/513</further-classification>
        <further-classification edition="200601120260202B">A61K31/4427</further-classification>
        <further-classification edition="200601120260202B">A61K31/506</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商浙江海正藥業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHEJIANG HISUN PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海昂睿醫藥技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI ARYL PHARMTECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張盼盼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, PANPAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>俞　鳴烽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, MINGFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱慧芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, HUIFEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林承才</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHENGCAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAO, QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孟力陳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENG, LICHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙志敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, ZHIMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YE, CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>毛利飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAO, LIFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王丹琦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, DANQI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭曉鶴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, XIAOHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周厚江</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, HOUJIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種芳香環類衍生物、其製備方法及含有該衍生物的藥物組合物在醫藥上的應用。具體而言，本發明涉及一種通式(I)所示的芳香環類衍生物、其製備方法及其作為治療劑特別是作為WRN抑制劑的用途；通式(I)中各取代基的定義與說明書中的定義相同。&lt;br/&gt;&lt;img align="absmiddle" height="173px" width="244px" file="ed10200.JPG" alt="ed10200.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention relates to an aromatic ring derivative, its preparation method, and the pharmaceutical application of a pharmaceutical composition containing the derivative. Specifically, this invention relates to an aromatic ring derivative represented by general formula (I), its preparation method, and its use as a therapeutic agent, particularly as a WRN inhibitor; the definitions of each substituent in general formula (I) are the same as those in the specification.&lt;br/&gt;&lt;img align="absmiddle" height="170px" width="245px" file="ed10201.JPG" alt="ed10201.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2010" publication-number="202624556">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624556</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148369</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>金屬電鍍組合物</chinese-title>
        <english-title>METAL ELECTROPLATING COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C25D5/02</main-classification>
        <further-classification edition="200601120260302B">C01G3/10</further-classification>
        <further-classification edition="201801120260302B">C09D7/47</further-classification>
        <further-classification edition="200601120260302B">C25D3/52</further-classification>
        <further-classification edition="200601120260302B">C08K3/24</further-classification>
        <further-classification edition="200601120260302B">C08K5/103</further-classification>
        <further-classification edition="200601120260302B">C25D21/14</further-classification>
        <further-classification edition="200601120260302B">C25D3/38</further-classification>
        <further-classification edition="202601120260302B">H10W70/692</further-classification>
        <further-classification edition="202601120260302B">H10W70/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商安集微電子科技（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANJI MICROELECTRONICS TECHNOLOGY (SHANGHAI) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳豔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孟迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENG, DI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭洪修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, HONGXIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種金屬電鍍組合物，包括：硫酸銅、硫酸、氯離子、加速劑、抑制劑及整平劑。實現了無空洞、雜質含量低、表面平整的銅填充。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a metal electroplating composition comprising: copper sulfate, sulfuric acid, chloride ions, accelerators, inhibitors, and leveling agents, achieving void-free, low-impurity, and smooth surface copper filling.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2011" publication-number="202624219">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624219</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148398</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>一種二苯噻吩類液晶化合物及其製備方法和應用</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07D333/76</main-classification>
        <further-classification edition="200601120260102B">C09K19/34</further-classification>
        <further-classification edition="200601120260102B">G02F1/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京八億時空液晶科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫建波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李瑞山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏景景</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>殷勝強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王文源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董姍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭忠輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱世仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種二苯噻吩類液晶化合物及其製備方法和應用，本發明提供的液晶化合物具有較大的各向介電各項異性，且同時具有高清亮點，比較高的光學各向異性，適中的旋轉粘度和液晶互溶性的特點，並且低溫工作效果表現優秀，具有良好的熱穩定性、化學穩定性、光學穩定性及力學等方面的性能；從而能夠有效降低應用其的液晶顯示裝置的驅動電壓，提高液晶顯示裝置的回應速度，同時使液晶顯示裝置具有光學各向異性數值適中、電荷保持率高等特點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2012" publication-number="202624929">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624929</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148419</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>充電保護方法和用戶設備</chinese-title>
        <english-title>CHARGING PROTECTION METHOD AND USER EQUIPMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260202B">G06F1/26</main-classification>
        <further-classification edition="200601120260202B">G06F13/38</further-classification>
        <further-classification edition="200601120260202B">H02H7/20</further-classification>
        <further-classification edition="200601120260202B">H02H7/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃譯霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊家宥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, JIA-YOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王凱陞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, KAI-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游聲炫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOU, SHENG-XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃政雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHENG-HSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張恩銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, EN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種充電保護方法，用於通過充電端口由電源為用戶設備充電，包括：由該用戶設備的電壓比較器將該充電端口的引腳電壓與第一閾值進行比較並生成比較結果；以及根據該比較結果確定是否繼續為該用戶設備充電。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A charging protection method, for a user equipment being charged by a power supply through a charging port, includes comparing, by a voltage comparator of the user equipment, voltages of pins of the charging port with a first threshold and generating a comparison result; and determining whether to keep charging the user equipment according to the comparison result.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:充電系統</p>
        <p type="p">10:電源供應器</p>
        <p type="p">100:第一充電端口</p>
        <p type="p">200:第二充電端口</p>
        <p type="p">20:用戶設備</p>
        <p type="p">22:充電模組</p>
        <p type="p">24:應用處理器</p>
        <p type="p">242:決策模組</p>
        <p type="p">244:電壓比較器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2013" publication-number="202625087">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625087</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148553</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於影像分析的單應性估計設備、方法以及系統</chinese-title>
        <english-title>HOMOGRAPHY ESTIMATION APPARATUS, METHOD AND SYSTEM FOR IMAGE ANALYSIS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260102B">G06T7/33</main-classification>
        <further-classification edition="201701120260102B">G06T7/50</further-classification>
        <further-classification edition="201701120260102B">G06T7/246</further-classification>
        <further-classification edition="202201120260102B">G06V10/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿斯加爾　穆罕默德　瓦卡斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASGHAR, MOHAMMAD WAQAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍鲁日　奥列格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHORUZHIY, OLEG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JO, HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳浩俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEU, HO JUNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河成昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HA, SUNGHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在本文中闡述了一種用於估計單應性的高效技術的系統及方法。特徵提取器被配置成自第一影像提取第一組特徵且自第二影像提取第二組特徵。特徵匹配器被配置成將第一組特徵與第二組特徵進行匹配以產生匹配的特徵對。參數估計器被配置成使用迭代程序基於匹配的對來估計將第一組特徵變換為第二組特徵的變換的參數，迭代程序產生先前迭代中的先前單應性與當前迭代中的當前單應性之間的差異度量。差異度量對應於具有最大值的二次曲面，且當最大值小於預定臨限值時，迭代程序終止。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and a method are described herein for an efficient technique of estimating a homography. A feature extractor is configured to extract a first set of features from a first image and a second set of features from a second image. A feature matcher is configured to match the first set of features to the second set of features to generate matched pairs of features. A parameter estimator is configured to estimate parameters of a transformation that transforms the first set of features to the second set of features based on the matched pairs using an iterative procedure that generates a difference measure between a previous homography in a previous iteration and a current homography in a current iteration. The difference measure corresponds to a quadric surface that has a maximum value and the iterative procedure is terminated when the maximum value is less than a predetermined threshold.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">110:影像感測器/相機</p>
        <p type="p">115:單應性</p>
        <p type="p">120:特徵提取器</p>
        <p type="p">130:特徵匹配器</p>
        <p type="p">140:參數估計器</p>
        <p type="p">150:高階解譯器</p>
        <p type="p">160:真實世界應用</p>
        <p type="p">162:醫學成像</p>
        <p type="p">164:運動估計</p>
        <p type="p">166:對象識別</p>
        <p type="p">168:面部識別</p>
        <p type="p">172:影像拼接</p>
        <p type="p">174:道路導航</p>
        <p type="p">180:影像分析器</p>
        <p type="p">185:使用者</p>
        <p type="p">190:感測器控制器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2014" publication-number="202623756">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623756</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148614</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自移動設備的控制方法和裝置、自移動設備及存儲介質</chinese-title>
        <english-title>CONTROL METHOD AND APPARATUS FOR SELF-MOVING DEVICE, SELF-MOVING DEVICE, AND STORAGE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120251218B">A47L11/40</main-classification>
        <further-classification edition="200601120251218B">A47L11/24</further-classification>
        <further-classification edition="202401120251218B">G05D1/648</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邢穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XING, YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供了一種自移動設備的控制方法和裝置、自移動設備及存儲介質，涉及智慧清潔技術領域。該方法根據自移動設備和障礙物的相對位置，確定自移動設備的預轉動方向；對自移動設備上測距感測器的旋轉方向進行調整，使得測距感測器調整後的旋轉方向與預轉動方向一致。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a control method and apparatus for a self-moving device, as well as the self-moving device itself and a storage medium, pertaining to the field of intelligent cleaning technology. The method determines a pre-rotation direction of the self-moving device based on the relative positions of the self-moving device and obstacles; it then adjusts the rotation direction of the ranging sensors on the self-moving device so that the adjusted rotation direction of the ranging sensors aligns with the pre-rotation direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101、S102:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2015" publication-number="202624405">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624405</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148713</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組合物、複合材料及製備方法、增層膜</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08L71/12</main-classification>
        <further-classification edition="200601120260302B">C08L101/00</further-classification>
        <further-classification edition="200601120260302B">C08L63/00</further-classification>
        <further-classification edition="201801120260302B">C08K3/013</further-classification>
        <further-classification edition="200601120260302B">C08K5/00</further-classification>
        <further-classification edition="200601120260302B">C08J3/20</further-classification>
        <further-classification edition="200601120260302B">C08J5/24</further-classification>
        <further-classification edition="202601120260302B">H10W70/69</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商廣東盈驊新材料科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUANGDONG HINNO-TECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭永軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, YONGJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫文彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEN, WENYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肖浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIAO, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及一種樹脂組合物、複合材料及製備方法、增層膜。所述功能樹脂選自環氧樹脂、苯並噁嗪樹脂、雙馬來醯亞胺樹脂、碳氫樹脂中的至少一種；所述改性聚苯醚樹脂預聚物的製備原料包括具有如式I的官能化聚苯醚樹脂和具有如式II的乙烯基芴類化合物。上述樹脂組合物通過具有特定結構的官能化聚苯醚樹脂和乙烯基芴類化合物製備的改性聚苯醚樹脂預聚物、特定組分的功能樹脂與無機填料以及固化劑組分相互協同，固化後得到聚合物複合材料具有熱膨脹係數較低、耐熱性較好且介電性能較好的優勢。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2016" publication-number="202624031">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624031</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148728</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電動挖土機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260302B">B60L3/00</main-classification>
        <further-classification edition="201901120260302B">B60L53/10</further-classification>
        <further-classification edition="201901120260302B">B60L53/14</further-classification>
        <further-classification edition="200601120260302B">E02F9/00</further-classification>
        <further-classification edition="200601120260302B">E02F3/04</further-classification>
        <further-classification edition="202601120260302B">H02J7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友建機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CONSTRUCTION MACHINERY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢野和輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANO, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">為了減輕使用者的負擔。  &lt;br/&gt;　　電動挖土機具備：下部行走體；上部迴轉體，係迴轉自如地搭載於前述下部行走體；附件，係與前述上部迴轉體連接；駕駛室，係搭載於前述上部迴轉體；顯示裝置，係設置於前述駕駛室的內部；門，係能夠開關以進出前述駕駛室的內部；檢測部，係檢測前述門的開關；蓄電裝置；充電口，係用於向蓄電裝置供給電力；及控制部，係進行如下控制：在用於對前述蓄電裝置進行充電的電纜與前述充電口連接的期間，在由檢測部檢測到前述門已經打開之情況下，將與正在對前述蓄電裝置進行的充電相關之資訊顯示於前述顯示裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1A,1B:行走油壓馬達</p>
        <p type="p">2A:迴轉油壓馬達</p>
        <p type="p">7:動臂缸</p>
        <p type="p">8:斗桿缸</p>
        <p type="p">9:鏟斗缸</p>
        <p type="p">12:泵用電動機</p>
        <p type="p">12s:感測器</p>
        <p type="p">12s1:電流感測器</p>
        <p type="p">12s2:電壓感測器</p>
        <p type="p">12s3:旋轉狀態感測器</p>
        <p type="p">14:主泵</p>
        <p type="p">15:引導泵</p>
        <p type="p">16:高壓油壓管線</p>
        <p type="p">17:控制閥</p>
        <p type="p">18:反向器</p>
        <p type="p">19:蓄電裝置</p>
        <p type="p">25:引導管線</p>
        <p type="p">26:操作裝置</p>
        <p type="p">30:控制器</p>
        <p type="p">31:油壓控制閥</p>
        <p type="p">44:DC-DC轉換器</p>
        <p type="p">46:電池</p>
        <p type="p">48:感測器</p>
        <p type="p">61:鎖芯</p>
        <p type="p">64:水泵</p>
        <p type="p">70:車載充電器</p>
        <p type="p">72,72A,72B:充電口</p>
        <p type="p">90:冷卻風扇</p>
        <p type="p">301:取得部</p>
        <p type="p">302:顯示控制部</p>
        <p type="p">D1:輸入裝置</p>
        <p type="p">D2:顯示裝置</p>
        <p type="p">S6:攝像裝置</p>
        <p type="p">SD:門感測器</p>
        <p type="p">T:作動油箱</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2017" publication-number="202624967">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624967</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148755</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>處理屏蔽寫入命令的記憶體控制器、記憶體控制器的操作方法及記憶體系統</chinese-title>
        <english-title>MEMORY CONTROLLER PROCESSING MASKED WRITE COMMAND, OPERATING METHOD OF THE MEMORY CONTROLLER, AND MEMORY SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260202B">G06F12/10</main-classification>
        <further-classification edition="200601120260202B">G06F13/14</further-classification>
        <further-classification edition="201801120260202B">G06F9/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安孝源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AN, HYOWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴朱勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JOOYONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文元俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOON, WONJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">記憶體控制器的操作方法包括從主機接收屏蔽寫入請求，為屏蔽寫入請求的目標位址產生虛擬讀取命令，基於虛擬讀取命令的處理將屏蔽寫入請求轉換為正常寫入命令，以及執行正常寫入命令。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An operating method of a memory controller includes receiving, from a host, a masked write request, generating a dummy read command for a target address of the masked write request, converting the masked write request into a normal write command, based on processing of the dummy read command, and performing the normal write command.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S410~S490:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2018" publication-number="202624292">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624292</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148782</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感放射線性組成物、硬化物、顯示元件、攝像元件及硬化物的製造方法</chinese-title>
        <english-title>RADIATION-SENSITIVE COMPOSITION, CURED PRODUCT, DISPLAY ELEMENT, IMAGE SENSOR, AND METHOD FOR PRODUCING CURED PRODUCT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260209B">C08F2/50</main-classification>
        <further-classification edition="200601120260209B">C08F220/06</further-classification>
        <further-classification edition="200601120260209B">C08K3/22</further-classification>
        <further-classification edition="200601120260209B">G02B3/02</further-classification>
        <further-classification edition="200601120260209B">G03F7/004</further-classification>
        <further-classification edition="202501120260209B">H10F39/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭康巨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, KANG-GO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>角昭寛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMI, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>依田杏介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YODA, KYOUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林和佳菜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHI, WAKANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供一種可形成低溫下的耐彎折性優異的硬化物的感放射線性組成物、由所述感放射線性組成物形成的硬化物及其製造方法、包括所述硬化物的顯示元件、以及包括所述硬化物的攝像元件。本發明有關於一種感放射線性組成物，其為光學構件形成用，包含：金屬氧化物粒子（A）；多官能聚合性化合物（B），具有選自由碳數7以上的直鏈狀的烷二基、碳數5以上的烷三基及聚環氧烷基所組成的群組中的至少一個基；及光引發劑（E），且25℃下的黏度為50 cP以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2019" publication-number="202624192">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624192</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148783</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>低介電常數氧化物薄膜保護劑、使用該保護劑的氧化物薄膜形成方法、由此製備的半導體基板及半導體裝置</chinese-title>
        <english-title>LOW­K OXIDE THIN FILM PROTECTING AGENT, METHOD FOR FORMING OXIDE THIN FILM USING THE SAME, SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR DEVICE PREPARED THEREFROM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07C69/96</main-classification>
        <further-classification edition="200601120260302B">C07D317/38</further-classification>
        <further-classification edition="200601120260302B">C23C16/02</further-classification>
        <further-classification edition="200601120260302B">C23C16/40</further-classification>
        <further-classification edition="200601120260302B">C23C16/455</further-classification>
        <further-classification edition="200601120260302B">C23C16/52</further-classification>
        <further-classification edition="202601120260302B">H10P14/692</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商秀博瑞殷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOULBRAIN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李承鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEUNG HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭在善</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, JAE SUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金德鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DEOK HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴志源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JI WON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金成基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNG GI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種低介電常數氧化物薄膜保護劑、使用該保護劑的氧化物薄膜形成方法、由此製備的半導體基板及半導體裝置，將規定結構的化合物用作包括包含與矽烷元素直接連接的鹵素基團的結構的前體化合物的保護劑，以提供有效的高溫沉積氧化物薄膜形成技術，從而即使在高溫下形成氧化物薄膜時，也具有降低沉積速度、每個沉積循環的沉積厚度及生長率並顯著改善抗蝕刻性、階梯覆蓋性（step coverage）及雜質含量等的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2020" publication-number="202624328">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624328</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114148795</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組合物、半固化片、印刷電路板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08G59/50</main-classification>
        <further-classification edition="200601120260102B">C08G73/06</further-classification>
        <further-classification edition="200601120260102B">C08L63/00</further-classification>
        <further-classification edition="200601120260102B">C08L79/04</further-classification>
        <further-classification edition="200601120260102B">C08K3/36</further-classification>
        <further-classification edition="200601120260102B">C08K5/315</further-classification>
        <further-classification edition="200601120260102B">C08K5/3445</further-classification>
        <further-classification edition="200601120260102B">C08J5/24</further-classification>
        <further-classification edition="200601120260102B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商廣東盈驊新材料科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUANGDONG HINNO-TECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭永軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, YONGJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫文彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEN, WENYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹廣盛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAO, GUANGSHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肖浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIAO, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請屬於高分子材料領域，具體地涉及樹脂組合物、半固化片、印刷電路板。本申請提供的樹脂組合物，包括以下組分：預聚物 40份～80份、固化劑 10份～50份、環氧樹脂 30份～70份、咪唑類化合物 1份～10份，以及填料 50份～150份；其中，所述預聚物的製備原料包括馬來醯亞胺樹脂和含胺基的芴基化合物；所述馬來醯亞胺樹脂包括具有式（I）所示結構化合物中的一種或多種；所述含胺基的芴基化合物包括具有式（II）所示結構化合物中的一種或多種。本申請提供的樹脂組合物選用馬來醯亞胺樹脂改性的預聚物，其與環氧樹脂具有良好的相容性，可有效降低填料的添加，進而能夠保證其加工性能；且本申請提供的樹脂組合物具備優異的耐熱性能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2021" publication-number="202624900">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624900</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149066</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＥＵＶ光阻劑的低溫乾式顯影的整合解決方案及半導體處理工具</chinese-title>
        <english-title>INTEGRATED SOLUTION WITH LOW TEMPERATURE DRY DEVELOP FOR EUV PHOTORESIST AND SEMICONDUCTOR PROCESSING TOOL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">G03F7/36</main-classification>
        <further-classification edition="200601120260313B">G03F7/004</further-classification>
        <further-classification edition="202601120260313B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　茲順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, TZU SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓振興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, ZHENXING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙奇安　馬賀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SACHAN, MADHUR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　樂群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, LEQUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡贊姆　納斯琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAZEM, NASRIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡路塔瑞奇　蘭卡摩查理杜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KALUTARAGE, LAKMAL CHARIDU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩利　馬克喬瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SALY, MARK JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示的實施例可包括一種用於顯影光圖案化金屬氧光阻劑的方法。在一實施例中，該方法可包括利用預處理製程預處理光圖案化金屬氧光阻劑，利用熱乾式顯影製程將光圖案化金屬氧光阻劑顯影以選擇性地移除該光圖案化金屬氧光阻劑的一部分並且形成阻劑遮罩。在一實施例中，熱乾式顯影製程包括第一子操作，以及不同於該第一子操作的第二子操作。在一實施例中，該製程進一步包括用後處理製程後處理阻劑遮罩。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments disclosed herein may include a method for developing a photopatterned metal oxo photoresist. In an embodiment, the method may include pre-treating the photopatterned metal oxo photoresist with a pre-treatment process, developing the photopatterned metal oxo photoresist with a thermal dry develop process to selectively remove a portion of the photopatterned metal oxo photoresist and form a resist mask. In an embodiment, the thermal dry develop process includes a first sub¬operation, and a second sub-operation that is different than the first sub-operation. In an embodiment, the process further includes post-treating the resist mask with a post-treatment process.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:製程</p>
        <p type="p">111:操作</p>
        <p type="p">112:操作</p>
        <p type="p">113:操作</p>
        <p type="p">114:操作</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2022" publication-number="202624235">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624235</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149152</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>選擇性沉積劑、其合成方法、包含其的選擇性薄膜的製備方法、半導體基板及半導體裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">C07F7/02</main-classification>
        <further-classification edition="200601120260313B">C07F7/08</further-classification>
        <further-classification edition="200601120260313B">C07F7/10</further-classification>
        <further-classification edition="200601120260313B">C07F7/12</further-classification>
        <further-classification edition="200601120260313B">C23C16/34</further-classification>
        <further-classification edition="200601120260313B">C23C16/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商秀博瑞殷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOULBRAIN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
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                <last-name>鄭仁京</last-name>
                <first-name></first-name>
              </chinese-name>
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                <last-name>JUNG, IN KYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
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              <chinese-name name-type="organization">
                <last-name>金成基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNG GI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
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              <chinese-name name-type="organization">
                <last-name>林幸墩</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>LIM, HAENG DON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
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              <chinese-name name-type="organization">
                <last-name>李三東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SAM DONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭在善</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, JAE SUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
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          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
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      <isu-abst lang="tw">
        <p type="p">本發明涉及一種選擇性沉積劑、包含其的選擇性薄膜形成方法、半導體基板及半導體裝置，根據本發明，包含僅選擇性沉積在SiO&lt;sub&gt;2&lt;/sub&gt;基板表面的規定化合物，在後沉積SiN或SiCN時，能夠以選擇性薄膜形式實現，最終，可形成高純度及高品質選擇性薄膜，從而為包括半導體基板（包括所述選擇性薄膜）的半導體裝置提供高性能及高可靠性等效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
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  <tw-patent-application no="2023" publication-number="202623832">
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      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623832</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114149193</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>刺激細胞生長之方法</chinese-title>
        <english-title>METHOD FOR STIMULATING THE GROWTH OF A CELL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">A61K38/18</main-classification>
        <further-classification edition="201501120260305B">A61K35/16</further-classification>
        <further-classification edition="201001120260305B">C12N5/0775</further-classification>
        <further-classification edition="201001120260305B">C12N5/071</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永美久和環宇企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YCCM, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬歇爾　約翰　格雷葛瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARSHALL, JOHN GREGORY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種刺激細胞生長之方法，其包含使該細胞與包含分離之晶狀體表皮真皮生長因子之組合物接觸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a method for stimulating the growth of a cell comprising contacting the cell with a composition comprising an isolated lens epidermal dermal growth factor.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2024" publication-number="202623811">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623811</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101044</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>治療白血病的方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/54</main-classification>
        <further-classification edition="200601120260302B">A61K31/535</further-classification>
        <further-classification edition="200601120260302B">A61K31/53</further-classification>
        <further-classification edition="200601120260302B">A61K31/495</further-classification>
        <further-classification edition="200601120260302B">A61K31/435</further-classification>
        <further-classification edition="200601120260302B">A61K31/40</further-classification>
        <further-classification edition="200601120260302B">A61K31/397</further-classification>
        <further-classification edition="200601120260302B">A61K31/16</further-classification>
        <further-classification edition="200601120260302B">A61K31/075</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
        <further-classification edition="200601120260302B">A61P25/00</further-classification>
        <further-classification edition="200601120260302B">A61P37/00</further-classification>
        <further-classification edition="200601120260302B">A61P7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳市塔吉瑞生物醫藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENZHEN TARGETRX CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　義漢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YIHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹　景蓉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAO, JINGRONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史豔霞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, YANXIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉允</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙九洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, JIUYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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      <isu-abst lang="tw">
        <p type="p">本發明提供了通過向受試者給藥式(I)化合物或其藥學上可接受的鹽、晶型、溶劑合物或水合物來治療受試者的慢性期和/或加速期和/或急變期慢性粒細胞白血病和/或急性淋巴細胞性白血病的方法。本發明還提供了式(I)化合物或其藥學上可接受的鹽、晶型、溶劑合物或水合物與ATP競爭性的BCR-ABL1抑制劑組合的用途。  &lt;br/&gt;&lt;img align="absmiddle" height="125px" width="245px" file="ed10144.JPG" alt="ed10144.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2025" publication-number="202623720">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623720</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101180</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>吸煙替代系統、吸煙替代設備、及操作吸煙替代設備的方法</chinese-title>
        <english-title>SMOKING SUBSTITUTE SYSTEM, SMOKING SUBSTITUTE DEVICE, AND METHOD OF OPERATING SMOKING SUBSTITUTE DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260306B">A24F40/53</main-classification>
        <further-classification edition="202001120260306B">A24F40/60</further-classification>
        <further-classification edition="202001120260306B">A24F40/65</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商帝國菸草有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMPERIAL TOBACCO LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菲力　凱特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FERRIE, KATE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雪頓　羅絲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENTON, ROSS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅德　克力斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LORD, CHRIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫瑞　薩曼莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURRAY, SAMANTHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓊斯　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JONES, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班耶札　馬德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BENYEZZAR, MED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
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        </agents>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本案揭露了一種吸煙替代系統，具有包括控制器的設備，控制器被配置為接收進入安全模式的命令且響應於此而停用此設備的至少一個功能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a smoking substitute system having a device comprising a controller configured to receive a command to enter a safety mode and, in response, disable at least one function of the device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:方法</p>
        <p type="p">301:方塊</p>
        <p type="p">302:方塊</p>
        <p type="p">303:方塊</p>
        <p type="p">304:方塊</p>
        <p type="p">305:方塊</p>
        <p type="p">306:方塊</p>
        <p type="p">307:方塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2026" publication-number="202624958">
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      <volno>24</volno>
      <isuno>12</isuno>
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        <document-id>
          <doc-number>202624958</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101286</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>控制器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">G06F11/10</main-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中塚裕康</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKATSUKA, HIROYASU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉伊　Ｄ　Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAI, DEVESH KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可驗證用於資料復原的奇偶校驗是否正確的控制器。實施方式的控制器所包括的第一電路構成為：基於第一記憶體系統中所記憶的第一資料以及第二記憶體系統中所記憶的第二資料，生成第一奇偶校驗，並將第一奇偶校驗寫入非揮發性記憶體，自主機接收第一資料的更新資料即第三資料，自第一記憶體系統接收第一資料，自非揮發性記憶體讀出第一奇偶校驗，基於第一奇偶校驗、第一資料、以及第三資料，生成第二奇偶校驗，基於第二奇偶校驗、第一奇偶校驗、以及第一資料，生成第一復原資料，對第一復原資料與第三資料進行比較。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:主機設備(主機)</p>
        <p type="p">3-3、3-5:記憶體系統</p>
        <p type="p">D2:資料區段</p>
        <p type="p">New D2:更新後資料區段(第三資料)</p>
        <p type="p">New Q:更新後奇偶校驗(第二奇偶校驗)(第三奇偶校驗)</p>
        <p type="p">New Q':中間資料</p>
        <p type="p">Old D2:更新前資料區段(第一資料)</p>
        <p type="p">Old Q:更新前奇偶校驗(第一奇偶校驗)</p>
        <p type="p">Q:奇偶校驗</p>
        <p type="p">Rebuild D2(Q):復原資料區段(第一復原資料)(第二復原資料)(第三復原資料)</p>
        <p type="p">#12、#14、#16、#18、#20、#22、#24、#26、#28、#30、#32、#34、#36、#38、#40、#42、#44:處理順序</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2027" publication-number="202624747">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624747</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101453</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>實施分析量測之組合物及方法</chinese-title>
        <english-title>COMPOSITIONS AND METHODS FOR CARRYING OUT ASSAY MEASUREMENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">G01N33/53</main-classification>
        <further-classification edition="200601120260303B">G01N33/543</further-classification>
        <further-classification edition="200601120260303B">G01N21/66</further-classification>
        <further-classification edition="200601120260303B">G01N21/76</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商梅梭刻度技術公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MESO SCALE TECHNOLOGIES, LLC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔克　施瓦茨　亞歷山大　Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUCKER-SCHWARTZ, ALEXANDER K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西格爾　喬治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIGAL, GEORGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示案提供用於執行分析之組合物、試劑、套組、系統、系統組件及方法。更特定言之，本揭示案係關於一種用於偵測發光之分析組合物，該分析組合物包括烷基二乙醇胺，例如&lt;i&gt;N&lt;/i&gt;-丁基二乙醇胺（BDEA）。在實施例中，該分析組合物包括2-二丁基胺基乙醇（BDAE）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides compositions, reagents, kits, systems, system components, and methods for performing assays. More particularly, the disclosure relates to an assay composition for detecting luminescence, which comprises an alkyl diethanolamine, for example, &lt;i&gt;N-&lt;/i&gt;butyldiethanolamine (BDEA). In emodiments, the assay composition comprises 2-dibutylaminoethanol (BDAE).</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2028" publication-number="202625589">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625589</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101621</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>薄膜半導體切換設備</chinese-title>
        <english-title>THIN FILM SEMICONDUCTOR SWITCHING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D30/67</main-classification>
        <further-classification edition="202501120260302B">H10D62/17</further-classification>
        <further-classification edition="202501120260302B">H10D64/23</further-classification>
        <further-classification edition="202501120260302B">H10D62/82</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商齊耐特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZINITE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴萊吉　道格拉斯Ｗ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARLAGE, DOUGLAS W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曉泰　林傑姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHOUTE, LHING GEM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡迪恩　肯尼斯Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CADIEN, KENNETH C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬　艾利克斯莫利克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, ALEX MUNNLICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米爾柏恩　艾瑞克威爾森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MILBURN, ERIC WILSON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">教導了新穎的半導體設備。新穎的設備包括一種薄膜電晶體（TFT），它具有n型半導體層以在源極與汲極之間形成通道。該TFT進一步包括源極-通道界面構件，該源極-通道界面構件至少位在該設備的源極觸點附近，以提供對該TFT的操作的空乏層控制。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Novel semiconductor devices are taught. The novel devices include a thin film transistor (TFT) with an n-type semiconductor layer to form a channel between a source and a drain. The TFT further includes a source-channel interfacial member adjacent to at least the source contact of the device to provide depletion layer control of the operation of the TFT.</p>
      </isu-abst>
      <representative-img>
        <p type="p">903:閘極觸點</p>
        <p type="p">907:源極觸點</p>
        <p type="p">908:源極電極</p>
        <p type="p">911:汲極觸點</p>
        <p type="p">914:介電層</p>
        <p type="p">916:n型半導體層</p>
        <p type="p">920:基板</p>
        <p type="p">922:閘極調整層</p>
        <p type="p">925:第二絕緣層</p>
        <p type="p">950:源極-通道界面構件</p>
        <p type="p">900c:TFT</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2029" publication-number="202625484">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625484</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101769</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>針對能力降低的設備的功率節省</chinese-title>
        <english-title>POWER SAVINGS FOR REDUCED CAPABILITY DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200901120260304B">H04W52/02</main-classification>
        <further-classification edition="202301120260304B">H04W72/121</further-classification>
        <further-classification edition="202301120260304B">H04W72/51</further-classification>
        <further-classification edition="200901120260304B">H04W24/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷　敬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEI, JING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何群峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, QUNFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊斯萊　穆罕默德納茲穆爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISLAM, MUHAMMAD NAZMUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BD</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何　林海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, LINHAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加爾　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAAL, PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑卡爾　哈利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANKAR, HARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>派德森　卡斯登阿賈德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEDERSEN, CARSTEN AAGAARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅農　穆拉里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENON, MURALI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈羅波夫　艾雷斯尤里維奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOROKHOV, ALEXEI YURIEVITCH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案內容的某些態樣提供了用於針對能力降低的設備的功率節省的技術。一種可以由使用者設備（UE）執行的方法包括以下步驟：接收共享頻寬部分（BWP）配置和群組共用BWP配置。群組共用BWP配置指示由具有一或多個共用能力或共用UE類型的包括該UE的UE群組共享的群組共用BWP。該方法包括以下步驟：基於群組共用BWP配置，使用群組共用BWP進行通訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Certain aspects of the present disclosure provide techniques for power savings for reduced capability devices. A method that may be performed by a user equipment (UE) includes receiving a shared bandwidth part (BWP) configuration and a group common BWP configuration. The group common BWP configuration indicates a group common BWP shared by a group of UEs, including the UE, having one or more common capabilities or a common UE type. The method includes communicating using the group common BWP based on the group common BWP configuration.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:操作</p>
        <p type="p">510:方塊</p>
        <p type="p">520:方塊</p>
        <p type="p">530:方塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2030" publication-number="202624484">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624484</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102449</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>哺乳動物細胞之保存液</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201001120260310B">C12N5/0775</main-classification>
        <further-classification edition="201001120260310B">C12N5/078</further-classification>
        <further-classification edition="201001120260310B">C12N5/0783</further-classification>
        <further-classification edition="200601120260310B">C12N1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商美加細胞股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEGAKARYON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大塚製藥工場股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKA PHARMACEUTICAL FACTORY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富塚順子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMIZUKA, JUNKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>重盛智大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIGEMORI, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邉奈月</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, NATSUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹縄太一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKENAWA, TAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白川智景</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIRAKAWA, CHIKAGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西村益浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMURA, MASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤田泰毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJITA, YASUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澤本修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAWAMOTO, OSAMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種用以於非冷凍狀態下長時間保存哺乳動物細胞之新穎保存液。藉由將抗壞血酸及/或菸酸添加至等張液中製備保存液，將該保存液與血小板混合並振盪保存，能在至少10天抑制血小板之功能或存活率降低。又，藉由將上述保存液與間葉系幹細胞、巨核細胞、或T細胞混合，並於非冷凍狀態下保存，能在至少數天～數十天抑制該等細胞之功能或存活率降低。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2031" publication-number="202624136">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624136</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102466</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於印刷電路板製程、五金電鍍和化學銑削的零液體排放回收的系統</chinese-title>
        <english-title>METHODS AND SYSTEMS FOR ZERO LIQUID DISCHARGE RECYCLING OF WASTE GENERATED FROM MANUFACTURING OPERATIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260313B">C02F1/04</main-classification>
        <further-classification edition="202301120260313B">C02F1/28</further-classification>
        <further-classification edition="202301120260313B">C02F1/32</further-classification>
        <further-classification edition="202301120260313B">C02F1/44</further-classification>
        <further-classification edition="202301120260313B">C02F9/00</further-classification>
        <further-classification edition="200601320260313B">C02F103/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商綠源製造有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GREENSOURCE FABRICATION LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯泰平斯基　亞歷山大　斯拉沃米爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEPINSKI, ALEXANDER SLAVOMIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李保祿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種用於處理從製造操作產生的廢物的方法和系統，該製造操作包括印刷電路板製程（PCB FAB）、五金電鍍（GMF）、半導體製造、化學銑削和物理氣相沉積（PVD）中的至少一種。該方法和系統用於產生零液體排放回收。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:系統</p>
        <p type="p">100:導管</p>
        <p type="p">102:導管</p>
        <p type="p">104:導管</p>
        <p type="p">106:導管</p>
        <p type="p">108:導管</p>
        <p type="p">110:導管</p>
        <p type="p">112:導管</p>
        <p type="p">114:導管</p>
        <p type="p">116:導管</p>
        <p type="p">118:導管</p>
        <p type="p">120:導管</p>
        <p type="p">122:導管</p>
        <p type="p">124:導管</p>
        <p type="p">126:導管</p>
        <p type="p">128:導管</p>
        <p type="p">130:導管</p>
        <p type="p">132:導管</p>
        <p type="p">134:導管</p>
        <p type="p">136:導管</p>
        <p type="p">138:導管</p>
        <p type="p">140:導管</p>
        <p type="p">142:導管</p>
        <p type="p">144:導管</p>
        <p type="p">146:導管</p>
        <p type="p">148:導管</p>
        <p type="p">150:導管</p>
        <p type="p">152:導管</p>
        <p type="p">154:導管</p>
        <p type="p">156:導管</p>
        <p type="p">158:導管</p>
        <p type="p">160:導管</p>
        <p type="p">162:導管</p>
        <p type="p">164:導管</p>
        <p type="p">166:導管</p>
        <p type="p">168:導管</p>
        <p type="p">170:導管</p>
        <p type="p">172:導管</p>
        <p type="p">174:導管</p>
        <p type="p">176:導管</p>
        <p type="p">178:導管</p>
        <p type="p">180:導管</p>
        <p type="p">182:導管</p>
        <p type="p">184:導管</p>
        <p type="p">186:導管</p>
        <p type="p">188:導管</p>
        <p type="p">190:導管</p>
        <p type="p">192:導管</p>
        <p type="p">194:導管</p>
        <p type="p">196:導管</p>
        <p type="p">198:導管</p>
        <p type="p">200:導管</p>
        <p type="p">202:導管</p>
        <p type="p">204:導管</p>
        <p type="p">206:導管</p>
        <p type="p">208:導管</p>
        <p type="p">210:導管</p>
        <p type="p">212:導管</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2032" publication-number="202625741">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625741</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102563</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可偏壓的旋轉底座</chinese-title>
        <english-title>BIASABLE ROTATING PEDESTAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260306B">H10P72/00</main-classification>
        <further-classification edition="200601120260306B">H02N13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙布藍尼　安納薩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUBRAMANI, ANANTHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭颺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法澤利　席德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAZELI, SEYYED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑達爾　拉姆查朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNDAR, RAMCHARAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科特拉帕　阿倫庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOTRAPPA, ARUN KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示的具體實施例包括靜電吸盤。在一具體實施例中，該靜電吸盤包括：底座，底座具有支撐表面以及與支撐表面相對的第二表面，支撐表面用於支撐基板；吸附電極，吸附電極位於底座內。在一具體實施例中，偏壓電極位於底座內，加熱元件位於底座內。在一具體實施例中，靜電吸盤進一步包含：軸，軸耦接至底座的第二表面；以及旋轉部件，旋轉部件耦接至軸以旋轉軸與底座。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments disclosed herein include an electrostatic chuck. In an embodiment, the electrostatic chuck comprises a pedestal with a support surface for supporting a substrate and a second ‎surface opposite from the support surface, and chucking electrode within the pedestal. In an embodiment, a biasing electrode is within the pedestal, and a heating element is within the pedestal. In an embodiment, the electrostatic chuck further comprises a shaft coupled to the second surface of the pedestal, and a rotation assembly coupled to the shaft to rotate the shaft and the pedestal.‎</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:腔室</p>
        <p type="p">210:擋板結構</p>
        <p type="p">212:第一轉軸</p>
        <p type="p">220:內部空間</p>
        <p type="p">221:區域</p>
        <p type="p">222:區域</p>
        <p type="p">223:內部空間</p>
        <p type="p">224:底座</p>
        <p type="p">270:內部第二軸</p>
        <p type="p">272:軸承</p>
        <p type="p">273:軸承</p>
        <p type="p">274:軸承</p>
        <p type="p">275:真空饋通件</p>
        <p type="p">276:導線</p>
        <p type="p">280:RF旋轉饋通件</p>
        <p type="p">281:定子</p>
        <p type="p">282:轉子</p>
        <p type="p">283:接點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2033" publication-number="202625571">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625571</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102795</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可調的金氧半電容元件</chinese-title>
        <english-title>ADJUSTABLE MOS CAPACITOR ELEMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D1/66</main-classification>
        <further-classification edition="202501120260302B">H10D1/64</further-classification>
        <further-classification edition="202501120260302B">H10D48/00</further-classification>
        <further-classification edition="202501120260302B">H10D84/00</further-classification>
        <further-classification edition="200601120260302B">H01G7/00</further-classification>
        <further-classification edition="200601120260302B">H03H7/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鯨鏈科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WHALECHIP CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　惠禎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, HUEY-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可調的金氧半電容元件。金氧半電容元件包括一閘極端、一源極端、一汲極端及一基底端。該閘極端接收一閘極電壓。該源極端接收一接地電壓。該汲極端與該源極端電性連接，接收該接地電壓。該基底端接收一控制電壓，該控制電壓與該接地電壓不相同。其中，該金氧半電容元件的一電容值相應於該控制電壓而改變。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An adjustable MOS capacitor element. The MOS capacitor element includes a gate terminal, a source terminal, a drain terminal and a body terminal. The gate terminal is connected a gate voltage. The source terminal and the drain terminal are shorted to ground. The body terminal is connected to a control voltage which is different from the ground voltage. Wherein, the capacitance value of the MOS capacitor element changes corresponding to the control voltage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:金氧半電容元件</p>
        <p type="p">GND:接地電壓</p>
        <p type="p">B:基底端</p>
        <p type="p">D:汲極端</p>
        <p type="p">G:閘極端</p>
        <p type="p">S:源極端</p>
        <p type="p">V&lt;sub&gt;G&lt;/sub&gt;:閘極電壓</p>
        <p type="p">V&lt;sub&gt;B&lt;/sub&gt;:控制電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2034" publication-number="202624822">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624822</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102832</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學成像系統</chinese-title>
        <english-title>OPTICAL IMAGING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">G02B9/64</main-classification>
        <further-classification edition="200601120260306B">G02B15/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金學哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HAG CHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭弼鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, PHIL HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種光學成像系統，包含：第一透鏡群組、第二透鏡群組以及第三透鏡群組，各自包含多個透鏡且沿著光軸依序配置；反射部件，安置於第一透鏡群組前部；以及孔徑，安置於第一透鏡群組與第二透鏡群組之間，其中第一透鏡群組至第三透鏡群組中的至少一者經組態以可沿著光軸移動，且其中包含於第二透鏡群組中的多個透鏡當中的最接近孔徑安置的透鏡由玻璃形成。一種電子裝置亦被提供。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical imaging system includes a first lens group, a second lens group, and a third lens group, each including a plurality of lenses and arranged in order along an optical axis, a reflecting member disposed in front of the first lens group, and an aperture disposed between the first lens group and the second lens group, wherein at least one of the first lens group to the third lens group is configured to be movable along the optical axis, and wherein the lens disposed closest to the aperture among the plurality of lenses included in the second lens group is formed of glass. An electronic device is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光學成像系統</p>
        <p type="p">110:第一透鏡</p>
        <p type="p">120:第二透鏡</p>
        <p type="p">130:第三透鏡</p>
        <p type="p">140:第四透鏡</p>
        <p type="p">150:第五透鏡</p>
        <p type="p">160:第六透鏡</p>
        <p type="p">170:第七透鏡</p>
        <p type="p">180:第八透鏡</p>
        <p type="p">190:濾光片</p>
        <p type="p">191:成像平面</p>
        <p type="p">G1:第一透鏡群組</p>
        <p type="p">G2:第二透鏡群組</p>
        <p type="p">G3:第三透鏡群組</p>
        <p type="p">IS:影像感測器</p>
        <p type="p">R:反射部件</p>
        <p type="p">S:孔徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2035" publication-number="202623837">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623837</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102912</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含經結合之莢膜醣抗原的免疫原組合物及其用途</chinese-title>
        <english-title>IMMUNOGENIC COMPOSITIONS COMPRISING CONJUGATED CAPSULAR SACCHARIDE ANTIGENS AND USES THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201701120260305B">A61K47/64</main-classification>
        <further-classification edition="200601120260305B">A61K39/09</further-classification>
        <further-classification edition="200601120260305B">A61P31/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商輝瑞大藥廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PFIZER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜塔　考希克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUTTA, KAUSHIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高拉格　凱特林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GALLAGHER, CAITLYN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坎恩夫斯基　伊西斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANEVSKY, ISIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　進煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JIN-HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>摩蘭　賈斯汀　凱斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORAN, JUSTIN KEITH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛格　蘇德漢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGH, SUDDHAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法塔克　艾柏席賽克　拉文卓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VARTAK, ABHISHEK RAVINDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣大中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於包含經結合之肺炎鏈球菌(&lt;i&gt;Streptococcus pneumoniae&lt;/i&gt;)莢膜醣抗原(醣結合物)之新免疫原組合物、包含該等免疫原組合物之套組及其用途。本發明之免疫原組合物將通常包含至少一種來自未出現在PREVNAR&lt;sup&gt;®&lt;/sup&gt;、SYNFLORIX&lt;sup&gt;®&lt;/sup&gt;及/或PREVNAR 13&lt;sup&gt;®&lt;/sup&gt;中的肺炎鏈球菌血清型之醣結合物。本發明亦關於使用該等新穎免疫原組合物對人類個體，尤其嬰兒及老年人進行疫苗接種以抵抗肺炎鏈球菌感染。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to new immunogenic compositions comprising conjugated &lt;i&gt;Streptococcus pneumoniae&lt;/i&gt; capsular saccharide antigens (glycoconjugates), kits comprising said immunogenic compositions and uses thereof. Immunogenic compositions of the present invention will typically comprise at least one glycoconjugate from a &lt;i&gt;S. pneumoniae&lt;/i&gt; serotype not found in PREVNAR&lt;sup&gt;®&lt;/sup&gt;, SYNFLORIX&lt;sup&gt;®&lt;/sup&gt; and/or PREVNAR 13&lt;sup&gt;®&lt;/sup&gt;. The invention also relates to vaccination of human subjects, in particular infants and elderly, against pneumococcal infections using said novel immunogenic compositions.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2036" publication-number="202625154">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625154</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102947</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顫音機構</chinese-title>
        <english-title>VIBRATO MECHANISM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260313B">G10D3/153</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商泰勒里斯特公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAYLOR-LISTUG, INC. D/B/A TAYLOR GUITARS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>包爾斯　安德魯泰勒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWERS, ANDREW TAYLOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於弦樂器的顫音機構。實施例包括具有複數個區段的桿，該複數個區段中的每個各別區段經配置以連接至弦樂器的複數根弦中的各別弦。在一些實施例中，複數個區段中的第一區段具有第一大小並且經配置以連接至具有第一張力的複數根弦中的第一弦；以及複數個區段中的第二區段具有不同於第一大小的第二大小並且經配置以連接至具有不同於第一張力的第二張力的複數根弦中的第二弦。實施例包括致動器臂，該致動器臂操作地連接至桿，使得致動器臂在接合時導致桿繞其縱向軸線旋轉。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A vibrato mechanism for a string instrument. Embodiments include a bar with a plurality of segments, each respective segment of the plurality of segments being configured to connect to a respective string of a plurality of strings of a string instrument. In some embodiments, a first segment of the plurality of segments has a first size and is configured to connect to a first string of the plurality of strings having a first tension, and a second segment of the plurality of segments has a second size that is different than the first size and is configured to connect to a second string of the plurality of strings having a second tension that is different than the first tension. Embodiments include an actuator arm that is operatively connected to the bar such that the actuator arm, when engaged, causes the bar to rotate about its longitudinal axis.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:顫音機構</p>
        <p type="p">304:致動器臂</p>
        <p type="p">310:桿</p>
        <p type="p">320:附加桿</p>
        <p type="p">500:吉他</p>
        <p type="p">510:主體</p>
        <p type="p">520:頸部</p>
        <p type="p">525:弦</p>
        <p type="p">530:琴頭</p>
        <p type="p">540:弦用琴鍵</p>
        <p type="p">560:琴枕</p>
        <p type="p">565:指板</p>
        <p type="p">570:第一音品</p>
        <p type="p">575:鞍</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2037" publication-number="202625386">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625386</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103016</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>快閃記憶體控制器與快閃記憶體控制器的編解碼方法</chinese-title>
        <english-title>FLASH MEMORY CONTROLLER AND CODING METHOD OF FLASH MEMORY CONTROLLER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">H03M13/35</main-classification>
        <further-classification edition="200601120260313B">H03M13/29</further-classification>
        <further-classification edition="200601120260313B">H03M13/11</further-classification>
        <further-classification edition="200601120260313B">H03M13/37</further-classification>
        <further-classification edition="200601120260313B">G11C29/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慧榮科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICON MOTION, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧惇益</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TENG, DUEN-YIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭軒豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, SHIUAN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種快閃記憶體控制器的編解碼方法，包括：根據一編解碼矩陣來對一資料單元進行一局部編碼操作以及對多個資料單元進行一全域編碼操作以產生並寫入一錯誤更正碼資料至該頁單元，該資料單元要被寫入該快閃記憶體裝置的一頁單元之一部分，而該多個資料單元要被寫入至該頁單元；根據該編解碼矩陣所對應的該錯誤更正碼資料來對從該頁單元之該部分所讀取出的該資料單元進行一局部解碼操作以及對從該頁單元所讀取出的該多個資料單元進行一全域解碼操作以取得該頁單元之正確資料；以及動態地決定該編解碼矩陣以動態地選擇一編解碼模式。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A coding method of a flash memory controller includes: performing a local encoding operation upon a data unit and performing a global encoding operation upon multiple data units according to a coding matrix to generate and write error correction code data into the page unit, the data unit to be written into a portion of the page unit of the flash memory device and the multiple data units to be written into the page unit; performing a local decoding operation upon the data unit read from the portion of the page unit and performing a global decoding operation upon the multiple data units read from the page unit according to the error correction code data corresponding to the coding matrix to obtain correct data of the page unit; and dynamically determining the coding matrix to dynamically select a coding mode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:快閃記憶體控制器</p>
        <p type="p">101:主機裝置</p>
        <p type="p">102:快閃記憶體裝置</p>
        <p type="p">105DE:解碼器電路</p>
        <p type="p">105EN:編碼器電路</p>
        <p type="p">110:處理電路</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2038" publication-number="202624823">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624823</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103082</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學成像系統</chinese-title>
        <english-title>OPTICAL IMAGING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">G02B9/64</main-classification>
        <further-classification edition="200601120260306B">G02B15/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張東赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, DONG HYUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學成像系統包括：第一透鏡、第二透鏡、第三透鏡、第四透鏡、第五透鏡、第六透鏡、第七透鏡及第八透鏡，自物體側至影像平面依次排列，第四透鏡具有凹的物體側表面及凸的影像側表面，其中滿足{TTL/(2*IMG HT)}*Fno ＜ 1.000，其中TTL是光軸上自第一透鏡的物體側表面至影像平面的距離，IMG HT是影像平面的對角線長度的一半的距離，且Fno是光學成像系統的F值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens having a concave object-side surface and a convex image-side surface, a fifth lens, a sixth lens, a seventh lens, and an eighth lens arranged in order from an object-side to an image plane, wherein {TTL/(2*IMG HT)}*Fno ＜ 1.000 is satisfied, where TTL is a distance on an optical axis from an object-side surface of the first lens to the image plane, IMG HT is a distance half of a diagonal length of the image plane, and Fno is an F value of the optical imaging system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光學成像系統</p>
        <p type="p">110:第一透鏡</p>
        <p type="p">120:第二透鏡</p>
        <p type="p">130:第三透鏡</p>
        <p type="p">140:第四透鏡</p>
        <p type="p">150:第五透鏡</p>
        <p type="p">160:第六透鏡</p>
        <p type="p">170:第七透鏡</p>
        <p type="p">180:第八透鏡</p>
        <p type="p">F:紅外阻擋濾光片</p>
        <p type="p">IP:影像平面</p>
        <p type="p">ST:光圈</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2039" publication-number="202623719">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623719</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103098</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包括萊賽爾絲束的香煙過濾嘴及其製造方法</chinese-title>
        <english-title>CIGARETTE FILTER HAVING LYOCELL TOW AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">A24D3/06</main-classification>
        <further-classification edition="200601120260302B">A24D3/08</further-classification>
        <further-classification edition="200601120260302B">A24D3/10</further-classification>
        <further-classification edition="200601120260302B">A24D3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商韓國煙草人參股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KT&amp;G CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商可隆股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOLON INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河成薰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HA, SUNG HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬京培</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, KYENG BAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁眞哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JIN CHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李駿熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JUN HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭奉洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEONG, BONG SU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐昇潼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, SEUNG DONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李廷薰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JEONG HUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭鍾喆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, JONG CHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦尙佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, SANG WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃永男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, YEONG NAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種包括萊賽爾絲束的香煙過濾嘴，其包括：萊賽爾絲束，其由多個萊賽爾纖維製成；以及黏合劑，其使上述萊賽爾纖維相互結合。本發明一具體例的香煙過濾嘴將由煙草煙霧轉移的焦油和尼古丁分別減少70重量百分比至95重量百分比。本發明一具體例的香煙過濾嘴具有80mmWG至200mmWG的吸氣阻力。在本發明一具體例的香煙過濾嘴中，萊賽爾絲束以0.2g/mL至0.6g/mL的填充密度填充至香煙過濾嘴中。本發明一具體例的香煙過濾嘴解決了萊賽爾絲束基本具有的硬度等的材料問題，進而，具有作為過濾嘴的優秀的過濾功能性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:吸煙物質部</p>
        <p type="p">100:吸煙製品</p>
        <p type="p">20:過濾嘴部</p>
        <p type="p">30a:吸煙物質部包裝紙</p>
        <p type="p">30b:過濾嘴部包裝紙</p>
        <p type="p">40:接裝紙</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2040" publication-number="202624443">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624443</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103130</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微小構造體之安裝方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">C09J183/04</main-classification>
        <further-classification edition="200601120260306B">B81C1/00</further-classification>
        <further-classification edition="202501120260306B">H10H20/00</further-classification>
        <further-classification edition="202601120260306B">H10P72/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小川敬典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGAWA, YOSHINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大堀敬司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHORI, KEIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上田修平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEDA, SHUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>近藤和紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONDO, KAZUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小材利之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OZAI, TOSHIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松本展明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO, NOBUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北川太一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAGAWA, TAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大竹滉平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTAKE, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川原実</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAHARA, MINORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據至少含有下述步驟之微小構造體之移載方法：  &lt;br/&gt;　　(i)將形成於供給基板的一面的多個微小構造體與形成於施體基板上的聚矽氧系橡膠層貼合的步驟、  &lt;br/&gt;　　(ii)由前述供給基板將多個微小構造體的一部分或全部分離，並透過前述聚矽氧系橡膠層移送至前述施體基板，而得到暫時固定多個微小構造體的施體基板的步驟、  &lt;br/&gt;　　(iii)將前述暫時固定多個微小構造體的施體基板洗淨或中和的步驟、  &lt;br/&gt;　　(iv)將前述洗淨或中和後之暫時固定多個微小構造體的施體基板乾燥的步驟、  &lt;br/&gt;　　(v)為了將前述乾燥後之暫時固定多個微小構造體的施體基板供應至接下來的步驟而移載的步驟  &lt;br/&gt;，可將微小構造體以暫時固定於一枚施體基板的狀態供應至多個步驟，因此步驟數目不會增加，能有效率地達成微小構造體的移載。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2041" publication-number="202625668">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625668</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103135</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示設備</chinese-title>
        <english-title>DISPLAY APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260302B">H10K59/80</main-classification>
        <further-classification edition="202301120260302B">H10K59/38</further-classification>
        <further-classification edition="202301120260302B">H10K59/40</further-classification>
        <further-classification edition="200601120260302B">G06F3/041</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃聖翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, SEONGHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昇凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEUNG-BUM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張慶國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, KYUNGKOOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本公開一示例性實施例的顯示設備包括：基板，包括第一子像素及第二子像素；第一電極，設置於第一子像素及第二子像素的每一者中；以及岸堤，設置為覆蓋第一電極的終端且將發光區域及包圍發光區域的非發光區域分開，其中岸堤包括設置於第一電極上的第一岸堤，及設置於第一岸堤上且包括溝槽的第二岸堤。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The display apparatus according to an exemplary embodiment of the present disclosure includes: a substrate including a first sub pixel and a second sub pixel; a first electrode disposed in each of the first sub pixel and the second sub pixel; and a bank disposed to cover an end point of the first electrode and separating an emission area and a non-emission area which encloses the emission area, wherein the bank includes a first bank disposed on the first electrode, and a second bank disposed on the first bank and including a trench.</p>
      </isu-abst>
      <representative-img>
        <p type="p">320:第一岸堤</p>
        <p type="p">321:第一圖案</p>
        <p type="p">322:第二圖案</p>
        <p type="p">323:第三圖案</p>
        <p type="p">330:第二岸堤</p>
        <p type="p">P:像素</p>
        <p type="p">EA:發光區域</p>
        <p type="p">EA1:第一發光區域</p>
        <p type="p">EA2:第二發光區域</p>
        <p type="p">EA3:第三發光區域</p>
        <p type="p">NEA:非發光區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2042" publication-number="202624122">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624122</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103156</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氫氧化鋁粉末之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260312B">C01F7/023</main-classification>
        <further-classification edition="201801120260312B">G01N23/2055</further-classification>
        <further-classification edition="200601120260312B">B02C19/22</further-classification>
        <further-classification edition="200601120260312B">C08K3/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北智孝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITA, TOMOYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>前田巧介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAEDA, KOUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供添加於樹脂時能充分抑制黏度上升之氫氧化鋁粉末及其製造方法。  &lt;br/&gt;　　其解決手段為一種氫氧化鋁粉末，其在10MPa下經成型時之密度為1.59~2.00g/cm&lt;sup&gt;3&lt;/sup&gt;，XRD圖型中(002)面之繞射強度對(110)面之繞射強度的比為2.0~7.5。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2043" publication-number="202624059">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624059</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103181</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>車架</chinese-title>
        <english-title>CARRIER FRAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">B62B7/06</main-classification>
        <further-classification edition="200601120260303B">B62B9/20</further-classification>
        <further-classification edition="200601120260303B">B62B5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁家良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, JIALIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種車架包含第一、第二、第三管件及收合單元，第三管件樞接於第二及第一管件。收合單元包含第二桿件、第五桿件及連動桿。第二桿件與第三管件及第五桿件樞接。第五桿件與第二管件樞接。連動桿與第一管件及第二桿件樞接。當第一管件相對於第三管件樞轉收合時，第一管件經由連動桿連動第二桿件相對於第五桿件樞轉收合，使得第三管件相對於第二管件樞轉收合。本發明的的車架能夠實現車架的整體同步釋鎖並收折，提高車架收合的穩定性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A carrier frame includes first and second tubular members, a third tubular member pivoted to the first and second tubular members and a folding unit including a second rod, a linkage rod, and a fifth rod. The second rod is pivoted to the third tubular member and the fifth rod. The fifth rod is pivoted to the second tubular member. The linkage rod is pivoted to the first tubular member and the second rod. The first tubular member is folded for driving the second rod to be folded relative to the fifth rod via the linkage rod, to make the third tubular member folded relative to the second tubular member. The carrier frame can be released and folded synchronously and convenient to operate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第一管件</p>
        <p type="p">2:第二管件</p>
        <p type="p">3:第三管件</p>
        <p type="p">5:第四管件</p>
        <p type="p">6:保護欄</p>
        <p type="p">10:樞轉部</p>
        <p type="p">41:樞轉架</p>
        <p type="p">42:第一桿件</p>
        <p type="p">43:連動桿</p>
        <p type="p">44:第二桿件</p>
        <p type="p">100:車架</p>
        <p type="p">411:第三桿件</p>
        <p type="p">412:第四桿件</p>
        <p type="p">413:第五桿件</p>
        <p type="p">431:避讓凹</p>
        <p type="p">a:第一樞接點</p>
        <p type="p">b:第二樞接點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2044" publication-number="202624260">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624260</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103224</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＴＧＦ－β受體及使用方法</chinese-title>
        <english-title>TGF-Β RECEPTORS AND METHODS OF USE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07K14/71</main-classification>
        <further-classification edition="200601120260302B">C07K14/725</further-classification>
        <further-classification edition="200601120260302B">C07K16/30</further-classification>
        <further-classification edition="202501120260302B">A61K40/11</further-classification>
        <further-classification edition="202501120260302B">A61K40/31</further-classification>
        <further-classification edition="202501120260302B">A61K40/42</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商凱特製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITE PHARMA, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維曼　莎拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WYMAN, SARAH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>埃塔吉　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EMTAGE, PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅曼　嘉貝麗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROMAIN, GABRIELLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供涉及細胞激素信號傳導之經工程改造受體。本發明亦提供用於調節TGF-β信號傳導之經工程改造受體，使用嵌合抗原受體調節TGF-β信號傳導及治療癌症之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are engineered receptors involved in cytokine signaling. Also provided herein are engineered receptors for modulating TGF-β signaling, methods of modulating TGF-β signaling and treating cancer using chimeric antigen receptors.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2045" publication-number="202624058">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624058</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103229</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>動物運輸推車</chinese-title>
        <english-title>ANIMAL TRANSPORTATION CART</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">B62B3/00</main-classification>
        <further-classification edition="200601120260306B">B62B3/04</further-classification>
        <further-classification edition="200601120260306B">B62B5/06</further-classification>
        <further-classification edition="200601120260306B">A01K1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商居佳國際有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANI INTERNATIONAL PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭欽明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHINMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭凱文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, KAIWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種動物運輸推車包含推車本體和動物載具，所述推車本體包括推車把手、置物層、至少一對車架豎桿連接所述推車把手和所述置物層、以及輪件。根據本揭露之構想，所述動物載具包含箱體和支架裝置，所述箱體包含底部和連接所述底部的周壁，所述支架裝置結合所述箱體於所述周壁外側；所述推車本體包含支撐部，所述支撐部與所述置物層平行，且連接於所述車架豎桿上、高於所述置物層的位置；以及所述動物載具以所述周壁和所述底部中其一可分離地連接於該支撐部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An animal transport cart includes a cart body and an animal carrier. The cart body is constructed mainly by a cart handle, a storage layer, at least a pair of vertical cart frame members connecting the cart handle and the storage layer, and wheels. The animal carrier includes a box portion and a bracket assembly. The box portion includes a bottom and a peripheral wall connected to the bottom. The bracket assembly is combined with the box portion on the outside of the peripheral wall. The cart body includes a supporting part configured parallel to the storage layer, and connected to the vertical cart frame members at a position higher than the storage layer. The animal carrier is detachably connected to the supporting part by one of the peripheral wall and the bottom thereof.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:動物運輸推車</p>
        <p type="p">115:支撐部</p>
        <p type="p">121:箱體</p>
        <p type="p">122:支架裝置</p>
        <p type="p">1221:第一支架</p>
        <p type="p">1222:第二支架</p>
        <p type="p">1223:第三支架</p>
        <p type="p">123:連接結構</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2046" publication-number="202623835">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623835</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103234</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>心臟衰竭及心腎症候群之精準治療</chinese-title>
        <english-title>PRECISION TREATMENT OF HEART FAILURE AND CARDIORENAL SYNDROME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">A61K39/395</main-classification>
        <further-classification edition="200601120260305B">C12N15/12</further-classification>
        <further-classification edition="200601120260305B">G01N33/547</further-classification>
        <further-classification edition="200601120260305B">G01N33/487</further-classification>
        <further-classification edition="200601120260305B">G01N33/50</further-classification>
        <further-classification edition="200601120260305B">A61P9/00</further-classification>
        <further-classification edition="200601120260305B">A61P13/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>耶魯大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YALE UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹麥商諾佛　儂迪克股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVO NORDISK A/S</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泰斯塔尼　杰弗里　莫爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TESTANI, JEFFREY MOORE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉奧　維納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAO, VEENA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡卡爾　拉胡爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAKKAR, RAHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德瓦拉杰　馬達夫　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEVALARAJA, MADHAV N.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅　志鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, CHIH-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供藉由向需要多尿(diuresis)之患者投與IL-6拮抗劑來治療利尿劑抗性之方法。本發明亦提供藉由向具有TMPRSS6 rs855791主要對偶基因之至少一個複本之心臟衰竭患者投與IL-6拮抗劑來治療心臟衰竭及尤其是心臟衰竭之腎症狀之方法。視情況，該患者具有較高尿液IL-6水準、較高血漿IL-6水準，或較高尿液IL-6水準及較高血漿IL-6水準。本發明亦提供偵測患者之心腎症候群之方法，該方法包含量測該患者尿液或血漿中的IL-6水準。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides methods of treating diuretic resistance by administering an IL-6 antagonist to patients who require diuresis. The present disclosure also provides methods of treating heart failure, and in particular renal symptoms of heart failure, by administering an IL-6 antagonist to heart failure patients who have at least one copy of the TMPRSS6 rs855791 major allele. Optionally, the patient has elevated urine levels of IL-6, plasma levels of IL-6, or both urine and plasma levels of IL-6. Also provided are methods of detecting cardiorenal syndrome in a patient comprising measuring a level of IL-6 in the patient's urine or plasma.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2047" publication-number="202624715">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624715</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103286</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用二氧化碳偵測腔室元件的表面顆粒</chinese-title>
        <english-title>DETECTION OF SURFACE PARTICLES OF CHAMBER COMPONENTS WITH CARBON DIOXIDE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120260306B">G01N15/06</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　長功</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHANGGONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>左智力</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZUO, ZHILI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯常</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KE, CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐松文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUH, SONG-MOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中揭露了一種方法，該方法包括以下步驟：從分佈單元朝向製品引導包括固體CO&lt;sub&gt;2&lt;/sub&gt;顆粒或CO&lt;sub&gt;2&lt;/sub&gt;液滴中的至少一者的流，其中該製品包括複數個表面顆粒，且其中包括固體CO&lt;sub&gt;2&lt;/sub&gt;顆粒或CO&lt;sub&gt;2&lt;/sub&gt;液滴中的至少一者的該流使得從該製品的表面去除該製品上的該複數個表面顆粒的至少一部分；在基板的表面、或實時煙霧取樣單元上收集該複數個表面顆粒的從該製品的該表面去除的該部分中的至少一些，該基板具有預定的初始狀態，該預定初始狀態包括該基板的該表面上的初始表面顆粒；在執行該收集步驟之後分析該基板的該表面；及決定該複數個表面顆粒的從該製品的該表面去除且收集在該基板的該表面上的該部分的尺寸、形態、化學組成、顆粒數量濃度、或顆粒尺寸分佈中的至少一者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein is a method comprising directing, from a distribution unit, a stream comprising at least one of solid CO&lt;sub&gt;2&lt;/sub&gt; particles or CO&lt;sub&gt;2&lt;/sub&gt; droplets toward an article, wherein the article comprises a plurality of surface particles, and wherein the stream comprising at least one of solid CO&lt;sub&gt;2&lt;/sub&gt; particles or CO&lt;sub&gt;2&lt;/sub&gt; droplets causes at least a portion of the plurality of surface particles on the article to dislodge from the surface of the article; collecting, on a surface of a substrate having a pre-determined initial state comprising initial surface particles on the surface of the substrate or a real-time aerosol sampling unit, at least some of the portion of the plurality of surface particles dislodged from the surface of the article; analyzing the surface of the substrate after performing the collecting; and determining at least one of a size, a morphology, a chemical composition, a particle number concentration, or a particle size distribution of the portion of the plurality of surface particles that were dislodged from the surface of the article and collected on the surface of the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:顆粒偵測腔室</p>
        <p type="p">302:製品</p>
        <p type="p">304:製品支撐組件</p>
        <p type="p">306:噴霧噴嘴</p>
        <p type="p">308:液體CO&lt;sub&gt;2&lt;/sub&gt;源</p>
        <p type="p">310:供應管線</p>
        <p type="p">312:CO&lt;sub&gt;2&lt;/sub&gt;流</p>
        <p type="p">314:細網過濾器</p>
        <p type="p">316:層狀流</p>
        <p type="p">318:整流器</p>
        <p type="p">320:出口</p>
        <p type="p">322:預過濾器</p>
        <p type="p">324:高效顆粒空氣過濾器</p>
        <p type="p">326:顆粒電荷中和器</p>
        <p type="p">328:基板</p>
        <p type="p">330:基板支撐組件</p>
        <p type="p">332:實時煙霧取樣元件</p>
        <p type="p">334:煙霧取樣探針</p>
        <p type="p">336:CDA噴嘴</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2048" publication-number="202625657">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625657</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103332</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發光顯示裝置</chinese-title>
        <english-title>LIGHT EMITTING DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260302B">H10K59/12</main-classification>
        <further-classification edition="202301120260302B">H10K59/121</further-classification>
        <further-classification edition="202301120260302B">H10K59/122</further-classification>
        <further-classification edition="202301120260302B">H10K59/32</further-classification>
        <further-classification edition="202301120260302B">H10K59/38</further-classification>
        <further-classification edition="202301120260302B">H10K59/80</further-classification>
        <further-classification edition="202301120260302B">H10K50/19</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫英訓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SON, YOUNGHOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金美笑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MI-SO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種發光顯示裝置包含：不同顏色的第一子像素至第三子像素；沿第一子像素以及第二子像素和第三子像素之間的邊界延伸且包含突出部的突出結構的分隔壁；位於第一子像素的邊界的突出部之下的連接電極；藉由分隔壁分隔開的第一發光堆疊和第二發光堆疊、電荷產生層以及第二電極；以及藉由位於第一子像素中的電荷產生層以及第二發光堆疊之間的分隔壁分隔開的位於第一子像素中且連接至連接電極的中間電極，其中第二發光堆疊發出第一子像素的顏色，且第一發光堆疊發出第二子像素以及第三子像素的顏色的混合顏色。本發明可以降低功率消耗以及彩色濾光片圖案的材料成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light emitting display device includes: first to third subpixels of different colors; a partition wall of an overhang structure extending along a boundary between the first subpixel and the second and third subpixels, and including a protrusion portion; a connection electrode under the protrusion portion at the boundary of the first subpixel; first and second light emitting stacks, a charge generation layer, and a second electrode separated by the partitional wall; and an intermediate electrode separated by the partition wall and in the first subpixel, located between the charge generation layer and the second light emitting stack in the first subpixel, and connected to the connection electrode, wherein the second light emitting stack emits a color of the first subpixel, and the first light emitting stack emits a mixed color of colors of the second and third subpixels. The present invention can reduce a power consumption and a material cost of a color filter pattern.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:發光顯示裝置</p>
        <p type="p">101:基板</p>
        <p type="p">135:鈍化層</p>
        <p type="p">150:陽極</p>
        <p type="p">160:堤部</p>
        <p type="p">169:陰極</p>
        <p type="p">170:封裝層</p>
        <p type="p">180:外塗層</p>
        <p type="p">CF:彩色濾光片層</p>
        <p type="p">CFg:濾光片圖案</p>
        <p type="p">CFt:透明圖案</p>
        <p type="p">CFr:濾光片圖案</p>
        <p type="p">CHd:汲極接觸孔</p>
        <p type="p">COE:連接電極</p>
        <p type="p">G:綠色</p>
        <p type="p">IE:中間電極</p>
        <p type="p">IEd:虛擬中間電極</p>
        <p type="p">OD:發光二極體</p>
        <p type="p">OH:分隔壁</p>
        <p type="p">OH_1:第一部分</p>
        <p type="p">OH_2:第二部分</p>
        <p type="p">OP:開口</p>
        <p type="p">PP:突出部、突出部分</p>
        <p type="p">R:紅色</p>
        <p type="p">SP:子像素</p>
        <p type="p">SPb:發光堆疊</p>
        <p type="p">SPg:發光堆疊</p>
        <p type="p">SPr:發光堆疊</p>
        <p type="p">ST:發光堆疊</p>
        <p type="p">ST1:發光堆疊</p>
        <p type="p">ST2:發光堆疊</p>
        <p type="p">T:薄膜電晶體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2049" publication-number="202625760">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625760</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103361</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>陶瓷接合體、靜電卡盤裝置及陶瓷接合體的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/70</main-classification>
        <further-classification edition="200601120260302B">C04B37/00</further-classification>
        <further-classification edition="200601120260302B">B23Q3/15</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友大阪水泥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO OSAKA CEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>有川純</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARIKAWA, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日高宣浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIDAKA, NOBUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三浦幸夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIURA, YUKIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種陶瓷接合體，包括：一對陶瓷板；以及電極層，介於一對陶瓷板之間，電極層埋設於一對陶瓷板中的至少一者，於電極層的外緣，一對陶瓷板中的至少一者與電極層的接合面相對於一對陶瓷板及電極層的厚度方向具有傾斜度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:陶瓷接合體</p>
        <p type="p">2:陶瓷板(第一陶瓷板)</p>
        <p type="p">3:陶瓷板(第二陶瓷板)</p>
        <p type="p">3a、5:接合面</p>
        <p type="p">3A:凹部</p>
        <p type="p">3b、4a、4b:面</p>
        <p type="p">3c:底面</p>
        <p type="p">3d:傾斜面</p>
        <p type="p">4:電極層</p>
        <p type="p">A、B:位置</p>
        <p type="p">L1:長度</p>
        <p type="p">T1:厚度</p>
        <p type="p">X、Y:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2050" publication-number="202624063">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624063</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103366</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>護頭裝置和載具</chinese-title>
        <english-title>HEAD PROTECTION DEVIDE AND CARRIER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">B62B9/24</main-classification>
        <further-classification edition="200601120260306B">A47D15/00</further-classification>
        <further-classification edition="200601120260306B">A47D13/02</further-classification>
        <further-classification edition="200601120260306B">B60N2/26</further-classification>
        <further-classification edition="200601120260306B">B60R22/10</further-classification>
        <further-classification edition="200601120260306B">B60N2/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>于雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, XIONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, QIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范美鳳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, MEIFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種護頭裝置，用於包裹載具的肩帶以及載具的長度調整裝置，肩帶與載具的背靠和載具的座體直接或間接連接，肩帶繞接於長度調整裝置，長度調整裝置能沿肩帶的長度延伸方向相對肩帶滑動。護頭裝置包括：護片，包括位於長度調整裝置和背靠之間的第一部分；以及限位結構，設置在第一部分上；其中，肩帶通過限位結構沿相反的兩個方向在第一部分的至少一處兩次穿過護片，護片能沿肩帶的長度延伸方向相對肩帶滑動，長度調整裝置隨護片於肩帶上的滑動而同步滑動。本發明還公開了一種載具。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application discloses a head protection device for wrapping a shoulder belt of a carrier and a length adjustment device of the carrier, the shoulder belt is directly or indirectly connected to a backrest of the carrier and a seat of the carrier, and the shoulder belt is wound around the length adjustment device, the length adjustment device can slide relative to the shoulder belt along a length extension direction of the shoulder belt. The head protection device comprises: a protection sheet, including a first part located between the length adjustment device and the backrest; and a limiting structure, which is arranged on the first part; wherein, the shoulder belt passes through the protection sheet twice in opposite directions at at least one position on the first part through the limiting structure, and the protection sheet is slidable relative to the shoulder belt along a length extension direction of the shoulder belt, the length adjustment device synchronously slides with the protection sheet on the shoulder belt. The present application further discloses a carrier.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:護頭裝置</p>
        <p type="p">10A:第一部分</p>
        <p type="p">10B:第二部分</p>
        <p type="p">21:公扣</p>
        <p type="p">22:母扣</p>
        <p type="p">31:第一縫隙</p>
        <p type="p">200:載具</p>
        <p type="p">301:第一帶(上肩帶)</p>
        <p type="p">302:第二帶(下肩帶)</p>
        <p type="p">400:長度調整裝置</p>
        <p type="p">410:第一調整扣</p>
        <p type="p">600:背靠</p>
        <p type="p">900:連接扣</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2051" publication-number="202625802">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625802</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103377</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及在互連基板的側表面上設置電性構件的方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF DISPOSING ELECTRICAL COMPONENTS OVER SIDE SURFACES OF INTERCONNECT SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260304B">H10W20/00</main-classification>
        <further-classification edition="202601120260304B">H10W74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商星科金朋私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STATS CHIPPAC PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李建赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, GUNHYUCK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李喜秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HEESOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫相賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SON, SANGHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃寶慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, BOKYEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體裝置，其具有具備導電通孔之互連基板。第一電性構件設置於該互連基板之主表面上方。電互連化合物設置於從該互連基板之側表面暴露的該導電通孔上方。該電互連化合物能利用以一角度定向之傾斜噴嘴來施加。第二電性構件設置於從該互連基板之該側表面暴露的該導電通孔上之該電互連化合物上。複數個第二電性構件能設置於該互連基板之兩個或更多個側表面上。該互連基板能具有複數個堆疊導電通孔，且該第二電性構件設置於所述堆疊導電通孔上方。密封劑沉積於該第一電性構件及該互連基板上方。屏蔽層能形成於該密封劑上方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device has an interconnect substrate with a conductive via. A first electrical component is disposed over a major surface of the interconnect substrate. An electrical interconnect compound is disposed over the conductive via exposed from a side surface of the interconnect substrate. The electrical interconnect compound can be applied with a tilt nozzle oriented at an angle. A second electrical component is disposed on the electrical interconnect compound on the conductive via exposed from the side surface of the interconnect substate. A plurality of second electrical components can be disposed on two or more side surfaces of the interconnect substrate. The interconnect substrate can have a plurality of stacked conductive vias and the second electrical component is disposed over the stacked conductive vias. An encapsulant is deposited over the first electrical component and interconnect substrate. A shielding layer can be formed over the encapsulant.</p>
      </isu-abst>
      <representative-img>
        <p type="p">120:基板</p>
        <p type="p">122:導電層</p>
        <p type="p">123:絕緣層</p>
        <p type="p">124:互連通孔</p>
        <p type="p">126:頂部主表面</p>
        <p type="p">128:底部主表面</p>
        <p type="p">130a:電性構件</p>
        <p type="p">130b:電性構件</p>
        <p type="p">130c:電性構件</p>
        <p type="p">136:密封劑</p>
        <p type="p">138:SIP模組</p>
        <p type="p">141:側表面</p>
        <p type="p">144:電互連化合物</p>
        <p type="p">148a:電性構件</p>
        <p type="p">148b:電性構件</p>
        <p type="p">149a:接觸墊/外部連接端子</p>
        <p type="p">149b:接觸墊/外部連接端子</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2052" publication-number="202624203">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624203</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103469</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鎓鹽、光酸產生劑、化學增幅正型阻劑組成物及阻劑圖案形成方法</chinese-title>
        <english-title>ONIUM SALT, PHOTOACID GENERATOR, CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION, AND RESIST PATTERN FORMING PROCESS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07C309/77</main-classification>
        <further-classification edition="200601120260302B">C07C309/42</further-classification>
        <further-classification edition="200601120260302B">C07C381/12</further-classification>
        <further-classification edition="200601120260302B">C07D327/08</further-classification>
        <further-classification edition="200601120260302B">C07D333/76</further-classification>
        <further-classification edition="200601120260302B">C07C25/18</further-classification>
        <further-classification edition="200601120260302B">C08F220/30</further-classification>
        <further-classification edition="200601120260302B">C08F212/14</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/039</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島将大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邉聡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小竹正晃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOTAKE, MASAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松澤雄太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUZAWA, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>増永恵一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASUNAGA, KEIICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係提供可產生擴散小的酸之鎓鹽、含有其之化學增幅正型阻劑組成物、及使用該阻劑組成物之阻劑圖案形成方法。  &lt;br/&gt;該課題之解決手段為一種鎓鹽，係以下式(A)表示。  &lt;br/&gt;&lt;img align="absmiddle" height="156px" width="519px" file="ed10368.JPG" alt="ed10368.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An onium salt containing an aromatic sulfonic acid anion having an alkyl or fluoroalkyl group, iodized aromatic ring, and fluorinated substituent group generates an acid with controlled diffusion. A chemically amplified positive resist composition comprising the onium salt is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2053" publication-number="202625402">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625402</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103487</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於多使用者複製傳輸的方法、無線通訊設備</chinese-title>
        <english-title>METHOD, WIRELESS COMMUNICATION DEVICE FOR MULTI-USER DUPLICATE TRANSMISSION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">H04L5/00</main-classification>
        <further-classification edition="200601120260303B">H04L27/26</further-classification>
        <further-classification edition="202201120260303B">H04L9/40</further-classification>
        <further-classification edition="202301120260303B">H04W72/044</further-classification>
        <further-classification edition="202301120260303B">H04W72/0453</further-classification>
        <further-classification edition="200901120260303B">H04W84/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳嘉陵李</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JIALING LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳坎克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, KANKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田　濱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIAN, BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案內容提供了用於增加在功率譜密度（PSD）受限的無線通道上操作的無線通訊設備的發射功率的方法、設備和系統。一些實現方式更具體地涉及支援到多個使用者的複製（或「DUP模式」）傳輸的音調映射技術和封包設計。在一些實現方式中，存取點（AP）可以發送包括第一使用者資料和第二使用者資料的PPDU，其中至少第一使用者資料是以DUP模式發送的。因此，可以根據雙載波調制（DCM）方案將第一使用者資料映射到跨越第一RU的多個（N個）音調，並且可以根據DCM方案將第一使用者資料的複製副本映射到跨越第二RU的N個音調。在一些實現方式中，第二使用者資料亦可以是以DUP模式發送的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure provides methods, devices and systems for increasing the transmit power of wireless communication devices operating on power spectral density (PSD)-limited wireless channels. Some implementations more specifically relate to tone mapping techniques and packet designs that support duplicate (or "DUP mode") transmissions to multiple users. In some implementations, an access point (AP) may transmit a PPDU that includes first user data and second user data, where at least the first user data is transmitted in a DUP mode. As such, the first user data may be mapped to a number (N) of tones spanning a first RU in accordance with a dual carrier modulation (DCM) scheme, and a duplicate copy of the first user data may be mapped to N tones spanning a second RU in accordance with the DCM scheme. In some implementations, the second user data also may be transmitted in a DUP mode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">900:頻率圖</p>
        <p type="p">901:使用者資料</p>
        <p type="p">902:資料有效載荷</p>
        <p type="p">904:邏輯RU</p>
        <p type="p">906:實體RU</p>
        <p type="p">908:實體RU</p>
        <p type="p">910:使用者資料</p>
        <p type="p">914:邏輯RU</p>
        <p type="p">916:實體RU</p>
        <p type="p">918:實體RU</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2054" publication-number="202624994">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624994</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103515</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於安全遠端協作之方法、非暫時性電腦可讀儲存媒體、及製造商之電腦系統</chinese-title>
        <english-title>METHOD FOR SECURE REMOTE COLLABORATION, NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM, AND COMPUTER SYSTEM OF MANUFACTURER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120260302B">G06F21/40</main-classification>
        <further-classification edition="202201120260302B">H04L9/40</further-classification>
        <further-classification edition="202201120260302B">H04L41/28</further-classification>
        <further-classification edition="201301120260302B">G06F21/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布萊恩　麥克　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRAIN, MICHAEL D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐拉法瑞亞　雷蒙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OLAVARRIA, RAMON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古提爾茲　約瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUTIERREZ, JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴葛特　拉維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHAGAT, RAVI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康托羅維奇　阿薩夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANTOROVICH, ASSAF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在某些實施例中，在一製造商之一電腦系統處執行一種方法。該製造商操作包含來自一設備供應商之設備之一製造設施。在該方法中，接收由該設備供應商對該製造設施進行電子存取以執行該設備之一遠端支援活動之一請求。該請求係路由至預定義核准者。接收來自該等預定義核准者對該請求之核准。回應於接收來自該等預定義核准者對該請求之核准，在該製造設施中之一電子裝置與該設備供應商之一電腦系統之間自動建立一連接。該連接係用於該遠端支援活動。在該遠端支援活動完成之後，旋即自動終止該連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:網路架構</p>
        <p type="p">102:設備供應商</p>
        <p type="p">104:電腦系統</p>
        <p type="p">106:網路</p>
        <p type="p">108:閘道器</p>
        <p type="p">110:網際網路</p>
        <p type="p">112:製造設施</p>
        <p type="p">114:非軍事區</p>
        <p type="p">116:閘道器</p>
        <p type="p">118:權限引擎</p>
        <p type="p">119:網路</p>
        <p type="p">120:電子裝置</p>
        <p type="p">122:相機</p>
        <p type="p">124:設備</p>
        <p type="p">126:子網</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2055" publication-number="202625181">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625181</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103553</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G11C11/401</main-classification>
        <further-classification edition="200601120260302B">G11C11/409</further-classification>
        <further-classification edition="200601120260302B">G11C11/4091</further-classification>
        <further-classification edition="200601120260302B">G11C7/06</further-classification>
        <further-classification edition="200601120260302B">G11C7/12</further-classification>
        <further-classification edition="202301120260302B">H10B12/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐佐木知嶺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKI, TOMONE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和田政春</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WADA, MASAHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">第1以及第2逆變器，係被連接於第1、第2節點之間。第1逆變器，係包含有被與第3節點作連接之第3電晶體。第2逆變器，係包含有被與第4節點作連接之第5電晶體。第6電晶體，係被與第5電晶體之閘極以及第3節點作連接。第7電晶體，係被與第3電晶體之閘極以及第4節點作連接。第8電晶體，係被與第3電晶體之閘極以及第3節點作連接。第9電晶體，係被與第5電晶體之閘極以及第4節點作連接。在第1時刻處，第6以及第7電晶體之閘極之電壓係被降低，在第2時刻處，第8以及第9電晶體之電壓係被降低，在第3時刻處，係被形成有於第1以及第2節點處而被施加有第1以及第2電壓之狀態，在第1時刻之後且較第3時刻而更之前，第6以及第7電晶體之閘極之電壓係被提高。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">19:感測放大器</p>
        <p type="p">BL:位元線</p>
        <p type="p">￣BL:互補位元線</p>
        <p type="p">EQ:訊號</p>
        <p type="p">ISO:訊號</p>
        <p type="p">IV1:逆變器電路</p>
        <p type="p">IV2:逆變器電路</p>
        <p type="p">NBP:節點</p>
        <p type="p">OC:訊號</p>
        <p type="p">SAC:感測放大器電路</p>
        <p type="p">SAc:節點</p>
        <p type="p">SAN:節點</p>
        <p type="p">SAP:節點</p>
        <p type="p">SAt:節點</p>
        <p type="p">TN1~TN6:n型之MOSFET</p>
        <p type="p">TN11:電晶體</p>
        <p type="p">TN12:電晶體</p>
        <p type="p">TP1:p型之MOSFET</p>
        <p type="p">TP2:p型之MOSFET</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2056" publication-number="202623833">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623833</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103566</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>軸突損傷之預防</chinese-title>
        <english-title>PREVENTION OF AXONAL DAMAGE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">A61K39/00</main-classification>
        <further-classification edition="200601120260305B">C07K16/18</further-classification>
        <further-classification edition="200601120260305B">A61P25/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商梅迪繆思有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIMMUNE LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商美國禮來大藥廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELI LILLY AND COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>譚　凱特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, KEITH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝林　克雷格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHERING, CRAIG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希姆斯　約翰　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIMS, JOHN R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達格　傑弗瑞　Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAGE, JEFFREY L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於神經元軸突損傷之預防。更特定言之，本發明係關於使用選擇性地結合人類類澱粉蛋白β1-42肽(Aβ1-42)之結合成員預防神經元軸突損傷，其中用該結合成員處理患者會降低患者中之神經絲輕鏈(NfL)的含量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to the prevention of neuronal axonal damage. More particularly, the present invention relates to the prevention neuronal axonal damage using binding members that selectively bind human amyloid beta 1-42 peptide (Aβ1- 42), wherein the treatment of a patient with said binding member decreases the level of neurofilament light chain (NfL) in patients.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2057" publication-number="202624430">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624430</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103617</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>組成物、含磁性粒子之硬化物、磁性粒子導入基板、電子材料</chinese-title>
        <english-title>COMPOSITION, MAGNETIC PARTICLE-CONTAINING CURED MATERIAL, SUBSTRATE HAVING MAGNETIC PARTICLES INTRODUCED THEREIN, AND ELECTRONIC MATERIAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C09J4/02</main-classification>
        <further-classification edition="200601120260302B">C09J11/04</further-classification>
        <further-classification edition="200601120260302B">C09J163/00</further-classification>
        <further-classification edition="200601120260302B">H01F1/28</further-classification>
        <further-classification edition="200601120260302B">H05K1/03</further-classification>
        <further-classification edition="200601120260302B">H05K1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮田哲志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYATA, TETSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於提供一種能夠形成流動性優異並且磁特性及填充適性優異之硬化物之組成物、提供一種使用上述組成物形成之含磁性粒子之硬化物及提供一種含有上述含磁性粒子之硬化物之磁性粒子導入基板及電子材料。本發明的組成物含有：磁性粒子；選自包括樹脂及樹脂前驅物之群組中之1種以上的成分；及溶劑，上述組成物中，一次粒徑為4μm以上的磁性粒子的含量相對於磁性粒子的總質量為25質量%以上，上述磁性粒子的含量相對於組成物的總固體成分為91質量%以上，上述溶劑的含量相對於組成物的總質量為3～24質量%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2058" publication-number="202625091">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625091</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103655</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於角色一致性之封閉式影像與影片生成系統及其方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR CLOSED IMAGE AND VIDEO GENERATION WITH CHARACTER CONSISTENCY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260305B">G06T11/00</main-classification>
        <further-classification edition="202201120260305B">G06V40/16</further-classification>
        <further-classification edition="201101120260305B">G06T13/80</further-classification>
        <further-classification edition="202301120260305B">G06N3/045</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>智見科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRINTAGE , INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鈺潔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>甘岱樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAN, TAI HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">  本發明旨在一種具備高度一致性之角色影像與影片生成系統，旨在解決生成式AI在角色特徵漂移（Identity Drift）、語意模糊性及隱私資產管理缺失等問題。本系統架構包含一隱私控制層，用以界定封閉式執行環境；一基準圖像選取模組，從初始圖像集中自動篩選高可信度之基準角色圖像並存入身份特徵保險箱，以進行身份錨定；以及一語意轉換模組，將模糊之原始描述轉譯為具備顯式特徵約束之標準化指令。其中，所述語意轉換模組僅處理不包含角色身份特徵之文字資訊，且不存取所述身份特徵保險箱中之任何身份資料。透過影像生成控制模組融合基準圖像、標準化指令與可選之參考圖像集，系統能產出維持角色特徵一致性之靜態影像，並可進一步經由跨模態生成模組產出時序穩定之動態影片。最終藉由封閉式相簿管理介面與緩存即時銷毀機制，達成高隱私性之角色資產閉環管理。 </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">  The present invention discloses a system and method for generating highly consistent character images and videos, aiming to address issues such as identity drift, semantic ambiguity, and deficiencies in privacy asset management within generative AI. The system architecture comprises a privacy control layer for defining a closed execution environment; a reference image selection module configured to automatically screen a high-confidence reference character image from an initial image set and store it in an identity feature vault for identity anchoring; and a semantic transformation module configured to translate vague original descriptions into standardized instructions equipped with explicit feature constraints. By fusing the reference image, the standardized instructions, and an optional reference image set through an image generation control module, the system produces static images that maintain character feature consistency. Furthermore, the system can generate temporally stable dynamic videos via a cross-modal generation module. Finally, through a closed album management interface and a mechanism for immediate cache destruction, the invention achieves high-privacy, closed-loop management of character assets. </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:輸入端顯示面板</p>
        <p type="p">101:初始角色圖像集</p>
        <p type="p">102:原始自然語言描述</p>
        <p type="p">103:參考圖像集(選填)</p>
        <p type="p">210:基準圖像選取模組</p>
        <p type="p">220:語意轉換模組</p>
        <p type="p">230:影像生成控制模組</p>
        <p type="p">310:跨模態生成模組</p>
        <p type="p">320:一致性靜態影像</p>
        <p type="p">330:角色一致動態影片</p>
        <p type="p">400:封閉式管理環境</p>
        <p type="p">410:身份特徵保險箱(Identity Vault)</p>
        <p type="p">420:封閉式相簿管理界面</p>
        <p type="p">430:隱私控制層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2059" publication-number="202624223">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624223</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103719</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>二氟甲基－吡啶－２－基三唑</chinese-title>
        <english-title>DIFLUOROMETHYL-PYRIDIN-2-YL TRIAZOLES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D401/14</main-classification>
        <further-classification edition="200601120260302B">A61K31/501</further-classification>
        <further-classification edition="200601120260302B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹麥商薩尼奧納有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANIONA A/S</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蒙特爾　弗洛里安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONTEL, FLORIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔　耘海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUI, YUNHAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海因　尼可拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEINE, NIKLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡克　奧利弗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUCKE, OLIVER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利平斯基　拉多斯拉夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIPINSKI, RADOSLAW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彼德斯　史緹芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PETERS, STEFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉爾森　傑納斯施雷伯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LARSEN, JANUS SCHREIBER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DK</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雅雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於通式(I)之二氟甲基-吡啶-2-基三唑，其為含有α5亞單元之GABA&lt;sub&gt;A&lt;/sub&gt;受體的調節劑，可用於治療中樞神經系統疾病及其他疾病。此外，本發明係關於製備醫藥組合物之方法以及製造根據本發明之化合物之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to difluoromethyl-pyridin-2-yl triazoles of general formula (I) which are modulators of GABA&lt;sub&gt;A&lt;/sub&gt; receptors containing the α5 subunit, useful in treating central nervous system diseases and other diseases. In addition, the invention relates to processes for preparing pharmaceutical compositions as well as processes for the manufacture of compounds according to the invention.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2060" publication-number="202625742">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625742</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103746</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發光二極體（ＬＥＤ）加熱器系統以及配備所述加熱器系統的半導體晶圓處理裝置</chinese-title>
        <english-title>LED HEATER SYSTEM AND APPARATUS FOR SEMICONDUCTOR WAFER PROCESSING HAVING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260304B">H10P72/00</main-classification>
        <further-classification edition="200601120260304B">H05B3/00</further-classification>
        <further-classification edition="202601120260304B">H10P50/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＨＳ高科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HS HI-TECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李仁五</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, IN O</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱寧民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JU, YOUNG MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李政昱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JUNG WOOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種發光二極體（LED）加熱器系統以及配備所述加熱器系統的半導體晶圓處理裝置。作為對半導體晶圓進行加熱的發光二極體（LED）加熱器系統，包括散熱板以及沿著圓周方向配備於散熱板的多個發光二極體（LED）模組。各個發光二極體（LED）模組包括電路基板以及安裝到電路基板上的多個發光二極體（LED）。各個發光二極體（LED）模組包括對沿著放射方向配置的多個發光二極體（LED）進行分組並一起進行控制的通道。各個發光二極體（LED）模組以扇形形狀形成，在將多個發光二極體（LED）模組全部緊固到散熱板時，其整體形成圓形形狀。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:發光二極體(LED)加熱器系統</p>
        <p type="p">1100:散熱板</p>
        <p type="p">1200:發光二極體模組</p>
        <p type="p">1210:電路基板</p>
        <p type="p">1220:發光二極體(LED)</p>
        <p type="p">1280:連接器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2061" publication-number="202625743">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625743</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103766</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發光二極體（ＬＥＤ）加熱器系統以及配備所述加熱器系統的半導體晶圓處理裝置</chinese-title>
        <english-title>LED HEATER SYSTEM AND APPARATUS FOR SEMICONDUCTOR WAFER PROCESSING HAVING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260304B">H10P72/00</main-classification>
        <further-classification edition="200601120260304B">H05B3/00</further-classification>
        <further-classification edition="202601120260304B">H10P50/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＨＳ高科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HS HI-TECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李仁五</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, IN O</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱寧民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JU, YOUNG MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李政昱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JUNG WOOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種發光二極體（LED）加熱器系統以及配備所述加熱器系統的半導體晶圓處理裝置。作為對半導體晶圓進行加熱的發光二極體（LED）加熱器系統包括散熱板以及沿著圓周方向配備於散熱板的多個發光二極體（LED）模組，各個發光二極體（LED）模組包括對多個發光二極體（LED）進行分組並一起進行控制的通道，通道沿著圓周方向配備有多個，發光二極體（LED）加熱器系統分割成多個發光二極體（LED）模組並沿著圓周方向進行分割配置，而且配備有將發光二極體（LED）沿著放射方向進行分組的多個通道，在將多個通道沿著圓周方向進行空間分割的同時使其可對多個通道進行相互單獨控制。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:發光二極體(LED)加熱器系統</p>
        <p type="p">1100:散熱板</p>
        <p type="p">1200:發光二極體模組</p>
        <p type="p">1210:電路基板</p>
        <p type="p">1220:發光二極體(LED)</p>
        <p type="p">1280:連接器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2062" publication-number="202625820">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625820</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103768</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具散熱隔離結構的半導體裝置、散熱隔離結構的製造方法及晶粒</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE WITH HEAT DISSIPATION ISOLATION STRUCTURE, METHOD FOR MANUFACTURING HEAT DISSIPATION ISOLATION STRUCTURE, AND DIE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W40/25</main-classification>
        <further-classification edition="202601120260302B">H10W40/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林泳辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUNG-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林芳緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, FANG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林浩月</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HAO-YUEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林泳辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUNG-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊億</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種具散熱隔離結構的半導體裝置，其包含一矽基板、複數半導體結構及至少一散熱隔離結構。半導體結構間隔設於矽基板；至少一散熱隔離結構設於矽基板且位於半導體結構之間，散熱隔離結構包含有一絕緣體以及設於絕緣體中的一散熱通道。藉此，本揭露之散熱隔離結構係設於半導體結構之間，以此散熱隔離結構能夠直接將半導體裝置的內部熱能導引至半導體裝置之外，並結合封裝散熱結構形成以及外部散熱系統組成架構，顯著提升半導體裝置的散熱能力，以及提升半導體裝置的整體工作效能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device having a heat dissipation isolation structure. The semiconductor device includes a silicon substrate, a plurality of semiconductor structures, and at least one heat dissipation isolation structure. The semiconductor structures are spaced apart and disposed on the silicon substrate. The at least one heat dissipation isolation structure is disposed on the silicon substrate and located between the semiconductor structures, wherein the heat dissipation isolation structure includes an insulator and a heat dissipation channel formed within the insulator.Accordingly, the heat dissipation isolation structure of the present disclosure is arranged between the semiconductor structures, such that the heat dissipation isolation structure is capable of directly guiding internal thermal energy of the semiconductor device to the exterior of the semiconductor device. By further combining with a packaging heat dissipation structure and an external heat dissipation system to form an integrated thermal management architecture, the heat dissipation capability of the semiconductor device is significantly enhanced, and the overall operational performance of the semiconductor device is improved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">10:矽基板</p>
        <p type="p">11:凹槽</p>
        <p type="p">20:半導體結構</p>
        <p type="p">30:散熱隔離結構</p>
        <p type="p">31:絕緣體</p>
        <p type="p">32:散熱通道</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2063" publication-number="202625744">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625744</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103772</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發光二極體（ＬＥＤ）加熱器系統以及配備所述加熱器系統的半導體晶圓處理裝置</chinese-title>
        <english-title>LED HEATER SYSTEM AND APPARATUS FOR SEMICONDUCTOR WAFER PROCESSING HAVING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260304B">H10P72/00</main-classification>
        <further-classification edition="200601120260304B">H05B3/00</further-classification>
        <further-classification edition="202601120260304B">H10P50/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＨＳ高科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HS HI-TECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李仁五</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, IN O</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱寧民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JU, YOUNG MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李政昱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JUNG WOOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種發光二極體（LED）加熱器系統以及配備所述加熱器系統的半導體晶圓處理裝置。作為對半導體晶圓進行加熱的發光二極體（LED）加熱器系統，包括散熱板以及沿著圓周方向配備於散熱板的多個發光二極體（LED）模組，各發光二極體（LED）模組包括對多個發光二極體（LED）進行分組並一起進行控制的通道，通道沿著圓周方向配備有多個，多個通道都包括配備於中心區域的至少一個發光二極體（LED）以及配備於外廓區域的至少一個發光二極體（LED），而配置在多個通道中的至少某一個通道的中心區域以及外廓區域之間的多個發光二極體（LED）的排列與其他某一個通道的發光二極體（LED）的排列互不相同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:發光二極體(LED)加熱器系統</p>
        <p type="p">1100:散熱板</p>
        <p type="p">1200:發光二極體模組</p>
        <p type="p">1210:電路基板</p>
        <p type="p">1220:發光二極體(LED)</p>
        <p type="p">1280:連接器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2064" publication-number="202624313">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624313</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103774</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>附防霧膜之樹脂基板、及附防霧膜之透明物品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08F261/12</main-classification>
        <further-classification edition="200601120260302B">C09D183/12</further-classification>
        <further-classification edition="200601120260302B">C09D129/14</further-classification>
        <further-classification edition="200601120260302B">C08J5/22</further-classification>
        <further-classification edition="200601120260302B">B32B27/08</further-classification>
        <further-classification edition="200601120260302B">B32B33/00</further-classification>
        <further-classification edition="200601120260302B">C09D5/16</further-classification>
        <further-classification edition="201801120260302B">C09D7/63</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本板硝子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON SHEET GLASS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林清美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHI, KIYOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大家和晃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OYA, KAZUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋康史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種附防霧膜之樹脂基板，其具備樹脂基板及其表面上之防霧膜，防霧膜包含矽烷偶合劑及/或來自其之交聯結構、吸水性聚合物、聚醚改質矽氧烷、及碳數2～8之二醇。矽烷偶合劑包含矽烷偶合劑A、矽烷偶合劑B及/或矽烷偶合劑C。矽烷偶合劑A具有胺基、矽原子、及與胺基及矽原子鍵結之碳數1～3之烴基，矽烷偶合劑B具有胺基、矽原子、及與胺基及矽原子鍵結之碳數4以上之烴基，矽烷偶合劑C係具有複數個胺基之聚合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:附防霧膜之樹脂基板</p>
        <p type="p">10:樹脂基板</p>
        <p type="p">11:防霧膜</p>
        <p type="p">12:保護片材</p>
        <p type="p">13:黏著層</p>
        <p type="p">14:剝離片材</p>
        <p type="p">15:防霧片材</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2065" publication-number="202625439">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625439</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103780</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>解碼方法、裝置及其設備</chinese-title>
        <english-title>DECODING METHODS AND APPARATUSES, AND DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260312B">H04N19/42</main-classification>
        <further-classification edition="201401120260312B">H04N19/176</further-classification>
        <further-classification edition="201401120260312B">H04N19/91</further-classification>
        <further-classification edition="201401120260312B">H04N19/124</further-classification>
        <further-classification edition="201401120260312B">H04N19/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商杭州海康威視數字技術股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANGZHOU HIKVISION DIGITAL TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林晨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李哲暘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, ZHEYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>譚文明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, WENMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開提供一種解碼方法、裝置及其設備，該方法包括：從當前圖像塊對應的碼流中解碼當前圖像塊對應的目標特徵；基於目標特徵確定目標解碼網路的第一輸入特徵；獲取目標解碼網路的目標特徵值量化位元寬和目標特徵值量化超參數，基於目標特徵值量化位元寬和目標特徵值量化超參數將第一輸入特徵轉換為第二輸入特徵；基於目標解碼網路的整數型權重對第二輸入特徵進行處理，得到目標解碼網路的輸出特徵；其中，整數型權重是基於目標權重量化位元寬和目標權重量化超參數確定；基於目標解碼網路的輸出特徵確定當前圖像塊對應的重建圖像塊。通過本公開技術方案，能夠在保證解碼品質的前提下，降低解碼計算量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a decoding method and apparatus, and a device. The method comprises: decoding a target feature corresponding to a current image block from a bitstream for the current image block; determining a first input feature of the target decoding network according to the target feature; obtaining a target feature value quantization bit width and a target feature value quantization hyperparameter of the target decoding network, and converting the first input feature into a second input feature according to the target feature value quantization bit width and the target feature value quantization hyperparameter; processing the second input feature based on a integer weight of the target decoding network to obtain an output feature of the target decoding network, where the integer weight is determined according to a target weight quantization bit width and a target weight quantization hyperparameter of the target weight; and determining a reconstructed image block for the current image block according to the output feature of the target decoding network. Through the technical solution of the present disclosure, decoding computation can be reduced while ensuring decoding quality.</p>
      </isu-abst>
      <representative-img>
        <p type="p">201~205:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2066" publication-number="202624866">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624866</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103834</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>配向液晶膜之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G02F1/1337</main-classification>
        <further-classification edition="200601120260302B">B32B37/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木暢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, MITSURU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土屋裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUCHIYA, YUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山岡洋平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAOKA, YOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠製造即使長時間暴露於高溫環境下光學特性之變化亦較小之配向液晶膜之配向液晶膜之製造方法，其以卷對卷方式將配向液晶層與光學層經由活性能量線硬化型接著劑貼合。  本發明之配向液晶膜之製造方法具有貼合步驟，其係以卷對卷方式將配向液晶層與光學層經由活性能量線硬化型接著劑貼合。貼合步驟具有塗佈步驟及照射步驟。塗佈步驟中，於配向液晶層及光學層中之至少一個表面塗佈硬化前且溫度0℃以上45℃以下之接著劑。照射步驟中，對將配向液晶層與光學層經由硬化前之接著劑積層而成之積層體在沿著積層體之搬送方向上賦予了70 N/1000 mm寬以上550 N/1000 mm寬以下之張力之狀態下照射活性能量線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:含配向液晶層之膜</p>
        <p type="p">11:塗佈裝置</p>
        <p type="p">12:塗佈層</p>
        <p type="p">13:含光學層之膜</p>
        <p type="p">14:導輥</p>
        <p type="p">15:第一貼合輥</p>
        <p type="p">16:第二貼合輥</p>
        <p type="p">17:積層體</p>
        <p type="p">18:活性能量線照射裝置</p>
        <p type="p">19:接著劑層</p>
        <p type="p">100:配向液晶膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2067" publication-number="202623764">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623764</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103872</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光體積變化描記圖法量測裝置及光學血壓量測裝置</chinese-title>
        <english-title>PHOTOPLETHYSMOGRAPHY MEASUREMENT DEVICE AND OPTICAL BLOOD PRESSURE MEASUREMENT DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">A61B5/1455</main-classification>
        <further-classification edition="200601120260306B">A61B5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臺醫光電科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN BIOPHOTONIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曲昌盛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, CHANG-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　業文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YEH-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藍仁佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAN, JEN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘怡婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, YI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張嘉芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIA-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾隆斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, LUNG-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佑俞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種光體積變化描記圖法（Photoplethysmography, PPG）量測裝置，其包括：外殼體；內殼體，其與該外殼體耦接並可相對移動，兩者之間包括容置待測物體的容置空間；內蓋，其與該內殼體耦接而組成具有開口部與接合部的元件組合，內殼內側表面在沿前後方向具有傾斜角，以使該容置空間在該開口部的截面積大於該接合部；及光訊號模組，其用以量測該待測物體，該光訊號模組包括光源模組及光量測模組中的至少一個，該光源模組用以發射具有發光波長的發射光，該發光波長是從低血氧影響光波段中做選擇，及該光量測模組用以接收該發射光進行PPG量測後的偵測光。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A photoplethysmography (PPG) measurement device is provided and includes: an outer housing; an inner housing coupled to and movable relative to the outer housing, where an accommodation space is provided for accommodating a detectable object between two housings; an inner cover coupled to the inner housing to form an element assembly including an opening portion and a joint portion, where an inclined angle is provided on an inner-housing internal surface along a front-to-back direction, such that a cross-sectional area of the accommodation space at the opening portion is larger than that at the joint portion; and an optical signal module configured to measure the detectable object, where the optical signal module comprises at least one of a light source module and a light measurement module , the light source module is configured for emitting an emitting light having an emitting wavelength, the emitting wavelength is selected within a low-blood-oxygen-impact wavelength band, and the light measurement module is configured for receiving a detecting light generated from the emitting light by a PPG measurement.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光學生理訊號量測裝置</p>
        <p type="p">110:運算模組</p>
        <p type="p">120:光學模組</p>
        <p type="p">121:光源模組</p>
        <p type="p">122:光量測模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2068" publication-number="202623868">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623868</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103896</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>配發機構及遊戲裝置</chinese-title>
        <english-title>MECHANISM FOR PROVIDING ARTICLE AND GAME DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260306B">A63F13/95</main-classification>
        <further-classification edition="201401120260306B">A63F13/25</further-classification>
        <further-classification edition="201401120260306B">A63F13/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商萬遊樂聖有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARVELOUS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土手真悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOTE, SHINGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大林武尊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OBAYASHI, TAKERU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於用以配發與遊戲相關之配發物的配發機構及遊戲裝置。配發機構包含：收納部，收納前述配發物；第1動作部，設有前述收納部，構成可動的態樣；推出機構，設於前述第1動作部附近，並用以將前述配發物推出；及第2動作部，保持自前述收納部推出的前述配發物，構成可動的態樣。其中，前述收納部以相對於垂直方向傾斜的狀態設於前述第1動作部。藉此可提供一種能夠因應遊戲結果有效率地配發配發物的配發機構及具備這種配發機構的遊戲裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a game device and a mechanism for providing an article in connection with a game. The mechanism includes: an accommodating part that accommodates the article; a first operating part provided with the accommodating part and configured to be operable; an pusing mechanism provided near the first operating part for pushing out the article; and a second operating part configured to hold the article pushed out from the accommodating part and to be operable. Wherein the accommodating part is provided on the first operating part in a state inclined with respect to the vertical direction. This makes is possible to provide a mechanism capable of efficiently providing the article according to results of the game and a game device including such a mechanism.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:遊戲裝置</p>
        <p type="p">1A:第1子遊戲裝置</p>
        <p type="p">1B:第2子遊戲裝置</p>
        <p type="p">2:框架</p>
        <p type="p">3:操作部</p>
        <p type="p">5:揚聲器</p>
        <p type="p">6:顯示部</p>
        <p type="p">10:配發機構</p>
        <p type="p">11:收納部</p>
        <p type="p">12:第1動作部</p>
        <p type="p">13:第2動作部</p>
        <p type="p">14:推出機構</p>
        <p type="p">15:配發引導部</p>
        <p type="p">16:拍攝部</p>
        <p type="p">18:底座部</p>
        <p type="p">21:配發口</p>
        <p type="p">31:按鈕</p>
        <p type="p">32:操作欄</p>
        <p type="p">151:閘口部</p>
        <p type="p">152:配發路徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2069" publication-number="202624821">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624821</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103974</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>取像鏡頭</chinese-title>
        <english-title>IMAGING LENS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">G02B9/62</main-classification>
        <further-classification edition="200601120260304B">G02B11/32</further-classification>
        <further-classification edition="200601120260304B">G02B13/02</further-classification>
        <further-classification edition="200601120260304B">G02B13/18</further-classification>
        <further-classification edition="200601120260304B">G02B17/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鉅嘉聯合科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIGA-IMAGE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉冠揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, GUAN-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉怡緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種取像鏡頭，自物側朝成像面沿光軸依序包括第一透鏡、第二透鏡、第三透鏡、第四透鏡、第五透鏡以及第六透鏡，其中取像鏡頭具屈折力的透鏡共六片。第一透鏡至第六透鏡皆為Q型（Q-type）非球面透鏡，且屈光度分別是正、正、負、負、正以及正。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An imaging lens including a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element and a sixth lens element arranged in sequence from an object side toward an imaging plane along an optical axis is provided. The imaging lens has a total of six refractive lens elements. The first to the sixth lens elements are Q-type aspherical lens elements, and refractive powers thereof are positive, positive, negative, negative, positive, and positive, respectively.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:取像鏡頭</p>
        <p type="p">100:第一透鏡</p>
        <p type="p">101、111、121、131、141、151、161、171、181:物側面</p>
        <p type="p">102、112、122、133、142、152、162、172、183:像側面</p>
        <p type="p">110:第二透鏡</p>
        <p type="p">120:第三透鏡</p>
        <p type="p">130:第一稜鏡</p>
        <p type="p">132、182:反射面</p>
        <p type="p">140:第四透鏡</p>
        <p type="p">150:第五透鏡</p>
        <p type="p">160:第六透鏡</p>
        <p type="p">170:濾光片</p>
        <p type="p">180:第二稜鏡</p>
        <p type="p">190:成像面</p>
        <p type="p">I:光軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2070" publication-number="202625544">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625544</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103990</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>散熱結構、散熱模組及電子裝置</chinese-title>
        <english-title>HEAT SINK, THERMAL MODULE AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">H05K7/20</main-classification>
        <further-classification edition="200601120260306B">F28F3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王友志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YU-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君愷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHUN-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱柏凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, PO-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王婷鈺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TING-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">散熱結構、散熱模組及電子裝置。散熱結構包括基底以及多個彎曲鰭片，其中彎曲鰭片並列地設置於基底上，每一個彎曲鰭片具有多個波峰，而該些波峰中任意二個相鄰的波峰之間距離一間距，且該些間距中的至少二個不相同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A heat sink, a thermal module and an electronic device are provided. The heat sink includes a base and a plurality of curved fins arranged in parallel on the base. Each curved fin features a plurality of wave peaks, with a pitch between any two adjacent wave peaks define, and at least two of the plurality of wave peaks are variant.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:散熱結構</p>
        <p type="p">11:基底</p>
        <p type="p">12:彎曲鰭片</p>
        <p type="p">12a:波峰</p>
        <p type="p">12b:第二表面</p>
        <p type="p">13:流道</p>
        <p type="p">P:間距</p>
        <p type="p">H:波峰高度</p>
        <p type="p">T:厚度</p>
        <p type="p">W:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2071" publication-number="202625512">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625512</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115104061</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鍍銅積層體及可撓性電路基板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">H05K1/03</main-classification>
        <further-classification edition="200601120260306B">H05K3/38</further-classification>
        <further-classification edition="200601120260306B">C23C18/31</further-classification>
        <further-classification edition="200601120260306B">C23C18/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東洋鋼鈑股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYO KOHAN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉松陽平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIMATSU, YOUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迎展彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUKAI, NOBUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉田隆広</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIDA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種既能抑制應用於可撓性電路基板時之傳輸損耗，又能同時實現低介電樹脂膜之無電解鍍銅層之良好之體積電阻率的鍍銅積層體及其製造方法。  &lt;br/&gt;本發明之鍍銅積層體之特徵在於包含：低介電樹脂膜，其頻率10 GHz時之相對介電常數為3.5以下且介電損耗因數為0.008以下；及無電解鍍銅層，其積層於上述低介電樹脂膜之至少一面；而且上述無電解鍍銅層中之Ni含有率為0.01～1.2 wt%，且上述無電解鍍銅層之體積電阻率為6.0 μΩ・cm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:樹脂膜</p>
        <p type="p">2:無電解鍍銅層</p>
        <p type="p">10:鍍銅積層體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2072" publication-number="202625865">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625865</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115104063</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>整合式封裝中天線結構</chinese-title>
        <english-title>INTEGRATED ANTENNA-IN-PACKAGE STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260304B">H10W74/01</main-classification>
        <further-classification edition="202601120260304B">H10W72/50</further-classification>
        <further-classification edition="202601120260304B">H10W76/01</further-classification>
        <further-classification edition="202601120260304B">H10W74/00</further-classification>
        <further-classification edition="202601120260304B">H10W72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＪＣＥＴ　星科金朋韓國有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JCET STATS CHIPPAC KOREA LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李承炫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEUNGHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李喜秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HEESOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體裝置，其包含第一基板。電組件設置於該第一基板上方。板對板連接器設置於該第一基板上方。囊封劑沉積於該第一基板及電組件上方以形成子封裝。該板對板連接器保持自該囊封劑暴露。接觸墊形成於該子封裝之側表面上。該子封裝透過該接觸墊安裝至天線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a first substrate. An electrical component is disposed over the first substrate. A board-to-board connector is disposed over the first substrate. An encapsulant is deposited over the first substrate and electrical component to form a subpackage. The board-to-board connector remains exposed from the encapsulant. A contact pad is formed on a side surface of the subpackage. The subpackage is mounted to an antenna through the contact pad.</p>
      </isu-abst>
      <representative-img>
        <p type="p">104:半導體晶粒/組件</p>
        <p type="p">152:基板</p>
        <p type="p">154:絕緣層</p>
        <p type="p">156:導體層</p>
        <p type="p">160:離散組件</p>
        <p type="p">162:B2B連接器</p>
        <p type="p">176:囊封劑/模製化合物</p>
        <p type="p">182:接觸墊</p>
        <p type="p">200:天線</p>
        <p type="p">202:基板</p>
        <p type="p">204:絕緣層</p>
        <p type="p">206:導體層</p>
        <p type="p">210:凸塊</p>
        <p type="p">230:AiP</p>
        <p type="p">232:黏著劑或環氧樹脂珠或凸塊/環氧樹脂</p>
        <p type="p">234:子封裝</p>
        <p type="p">400:電子裝置</p>
        <p type="p">402:基板/PCB</p>
        <p type="p">404:跡線</p>
        <p type="p">406:B2B連接器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2073" publication-number="202624218">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624218</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115104211</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感放射線性組成物、抗蝕劑圖案形成方法及聚合體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">C07D317/70</main-classification>
        <further-classification edition="200601120260304B">C08F212/14</further-classification>
        <further-classification edition="200601120260304B">C08F220/18</further-classification>
        <further-classification edition="200601120260304B">C08F220/38</further-classification>
        <further-classification edition="200601120260304B">G03F7/004</further-classification>
        <further-classification edition="200601120260304B">G03F7/039</further-classification>
        <further-classification edition="200601120260304B">G03F7/20</further-classification>
        <further-classification edition="202601120260304B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮田拡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYATA, HIROMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷口拓弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANIGUCHI, TAKUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">於感放射線性組成物中含有包含式（1）所表示的結構單元（I）的聚合體。式（1）中，R&lt;sup&gt;2&lt;/sup&gt;為單鍵、二價烴基等。R&lt;sup&gt;3&lt;/sup&gt;為式（2）或式（3）所表示的二價基。R&lt;sup&gt;4&lt;/sup&gt;為二價有機基。Y&lt;sup&gt;-&lt;/sup&gt;為藉由曝光而生成磺酸基、醯亞胺酸基或甲基化物酸基的一價陰離子。M&lt;sup&gt;a+&lt;/sup&gt;為a價的陽離子。a為1或2。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2074" publication-number="202624358">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624358</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115104252</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>固化性有機聚矽氧烷組成物及其固化物、保護劑或黏合劑以及電氣電子設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08G77/18</main-classification>
        <further-classification edition="200601120260302B">C08G77/12</further-classification>
        <further-classification edition="200601120260302B">C08G77/20</further-classification>
        <further-classification edition="200601120260302B">C08F2/40</further-classification>
        <further-classification edition="200601120260302B">C08F4/80</further-classification>
        <further-classification edition="200601120260302B">C09J11/04</further-classification>
        <further-classification edition="200601120260302B">C08L83/05</further-classification>
        <further-classification edition="200601120260302B">C09K3/10</further-classification>
        <further-classification edition="200601120260302B">C08L83/07</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商陶氏東麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOW TORAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商陶氏有機矽公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOW SILICONES CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戶田能乃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TODA, NOHNO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>須藤学</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUTOH, MANABU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑德蘭　茱莉亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNDERLAND, JULIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舒茲曼　喬瑟夫　羅納德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOOTSMAN, JOSEPH RONALD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古魯格　史帝芬　提摩西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRUEGER, STEVEN TIMOTHY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雪波哈德　尼克　伊凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEPHARD, NICK EVAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種固化性有機聚矽氧烷組成物，其單液形態之保存穩定性優異，於相對較低溫度下亦具有良好之固化性及黏合性，且具有適當之可使用時間。提供一種尤其是於80℃以下之溫度下固化性亦優異，對於聚酯及聚苯硫醚等樹脂之黏合性優異的固化性有機聚矽氧烷組成物。  &lt;br/&gt;本發明之固化性有機聚矽氧烷組成物係單液型固化性有機聚矽氧烷組成物，包含以下(A)至(E)成分：  &lt;br/&gt;(A)   一分子中具有至少2個烯基之有機聚矽氧烷，  &lt;br/&gt;(B)   一分子中具有至少2個矽原子鍵合氫原子之有機聚矽氧烷，  &lt;br/&gt;(C)   氫化矽烷化反應用觸媒，  &lt;br/&gt;(D)   選自由四三級丁氧基鈦、二(異丙氧基)雙(乙醯乙酸乙酯)鈦以及鋁螯合錯合物所組成之群組中之縮合反應用觸媒或其縮合反應物，以及  &lt;br/&gt;(E)   固化抑制劑；  &lt;br/&gt;且藉由固化，可形成具有5以上JIS A硬度之聚矽氧橡膠組成物。該組成物可選地含有大量(H)無機填料等。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2075" publication-number="202624689">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624689</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115104253</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>利用干涉儀特徵化樣本之區域之方法及經組態以測量小型結構之干涉儀</chinese-title>
        <english-title>METHOD OF CHARACTERIZING WITH AN INTERFEROMETER A REGION OF A SAMPLE AND INTERFEROMETER CONFIGURED TO MEASURE SMALL STRUCTURES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202201120260306B">G01B9/02</main-classification>
        <further-classification edition="200601120260306B">G01B11/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商昂圖創新公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONTO INNOVATION INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施密特　喬安納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHMIT, JOANNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆斯塔法　海瑟姆　ＡＢ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUSTAFA, HAITHEM A.B.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SD</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種干涉儀經組態以特徵化包括高縱橫比結構之一樣本中之複數個結構。該干涉儀以照明光學元件照射該樣本，該照明光學元件具有一數值孔徑，該數值孔徑小於收集經反射光之收集光學元件的數值孔徑，以便增加穿透所述結構之深度的光量，並改善信號對雜訊比。在測量期間，該收集光學元件相對於該樣本之焦點位置係固定的，同時該樣本光與該參考光之間之一光學路徑差經改變以通過所述結構之該深度掃描相干條紋。以該參考光與該樣本光之間之不同光學路徑差收集該樣本之一區域之影像，並進行分析以特徵化該樣本中之所述結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An interferometer is configured to characterize a plurality of structures in a sample including High Aspect Ratio structures. The interferometer illuminates the sample with illumination optics having a numerical aperture that is smaller than the numerical aperture of the collection optics that collect the reflected light in order to increase the amount of light that penetrates the depth of the structures and improves the signal to noise ratio. During measurement, the focal position of the collection optics with respect to the sample is fixed, while an optical path difference between the sample light and the reference light is altered to scan the coherence fringes through the depth of the structures. Images of a region of the sample are collected at different optical path differences between the reference light and the sample light and are analyzed to characterize the structures in the sample.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1702:流程方塊</p>
        <p type="p">1704:流程方塊</p>
        <p type="p">1706:流程方塊</p>
        <p type="p">1708:流程方塊</p>
        <p type="p">1710:流程方塊</p>
        <p type="p">1712:流程方塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2076" publication-number="202623794">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623794</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115104452</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含有山奈酚類似物之組成物</chinese-title>
        <english-title>KAEMPFEROL ANALOG-CONTAINING COMPOSITION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/352</main-classification>
        <further-classification edition="200601120260302B">A61K31/7048</further-classification>
        <further-classification edition="200601120260302B">A61P43/00</further-classification>
        <further-classification edition="200601120260302B">A61P27/02</further-classification>
        <further-classification edition="200601120260302B">A61P3/00</further-classification>
        <further-classification edition="201601120260302B">A23L33/105</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大塚製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKA PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池田泰𨺓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEDA, YASUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溝上翼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZOKAMI, TSUBASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿比留康弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABIRU, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秋山稔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKIYAMA, MINORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小山亜由子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OYAMA, AYUKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供以含有山奈酚類似物為特徵的運動效率提高組成物、疲勞減輕組成物、及動態視力改善組成物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a kinematic efficiency improving composition, a fatigue reducing composition, and a dynamic vision improving composition characterized by containing a kaempferol analog.</p>
      </isu-abst>
      <representative-img>
        <p type="p">由於本案圖式皆為實驗數據，無法代表本發明。故本案無指定代表圖。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2077" publication-number="202625148">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625148</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115104466</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260213B">G09G3/36</main-classification>
        <further-classification edition="200601120260213B">G09G3/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商半導體能源研究所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三宅博之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAKE, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的一個方式抑制設置在顯示裝置中的掃描線的各部分中的電位變化的時序偏差。當輸入到掃描線的信號從選擇信號切換為非選擇信號時，不僅從該掃描線的一端而且從該掃描線的兩端都輸入非選擇信號。明確而言，在顯示裝置中設置從一端輸入選擇信號或非選擇信號的掃描線、時脈信號輸入到其閘極，非選擇信號輸入到其源極且其汲極與該掃描線連接的電晶體。並且，從一端輸入到掃描線的信號從選擇信號切換為非選擇信號的時序與電晶體從關閉狀態變為開啟狀態的時序相同或大致相同。由此，不僅從掃描線的一端而且從掃描線的兩端都輸入非選擇信號。因此，可以抑制該掃描線的各部分中的電位變化的時序偏差。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A scan line to which a selection signal or a non-selection signal is input from its end, and a transistor in which a clock signal is input to a gate, the non-selection signal is input to a source, and a drain is connected to the scan line are provided. A signal input to the end of the scan line is switched from the selection signal to the non-selection signal at the same or substantially the same time as the transistor is turned on. The non-selection signal is input not only from one end but also from both ends of the scan line. This makes it possible to inhibit the potentials of portions in the scan line from being changed at different times.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:掃描線</p>
        <p type="p">102:掃描線</p>
        <p type="p">111:電晶體</p>
        <p type="p">112:電晶體</p>
        <p type="p">121_1:像素</p>
        <p type="p">121_2:像素</p>
        <p type="p">122_1:像素</p>
        <p type="p">122_2:像素</p>
        <p type="p">131_1:電晶體</p>
        <p type="p">131_2:電晶體</p>
        <p type="p">132_1:電晶體</p>
        <p type="p">132_2:電晶體</p>
        <p type="p">141:移位暫存器</p>
        <p type="p">142:移位暫存器</p>
        <p type="p">CK1:時脈信號</p>
        <p type="p">CK2:時脈信號</p>
        <p type="p">VSS:低電源電位</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2078" publication-number="202624537">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624537</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115104741</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>表面平滑化金屬構件之製造方法</chinese-title>
        <english-title>SURFACE SMOOTHED METAL MEMBER PRODUCTION METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C23C22/07</main-classification>
        <further-classification edition="200601120260302B">C25D11/26</further-classification>
        <further-classification edition="200601120260302B">C25D11/20</further-classification>
        <further-classification edition="200601120260302B">C22C14/00</further-classification>
        <further-classification edition="200601120260302B">C25D5/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本輕金屬股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON LIGHT METAL COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新山歩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIIYAMA, AYUMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水裕太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中野耕一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANO, KOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大嶋毅士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSHIMA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種表面平滑化金屬構件及其簡便且有效率的製造方法，在鈦或鈦合金製的大型的金屬構件的表面，被平滑化直到平坦部的最大高度粗糙度(Rz)成為1.1μm以下，且曲率半徑為0.05~2.5mm的部分的最大高度粗糙度(Rz)成為不足2μm的程度。本發明的表面平滑化金屬構件的製造方法，對由鈦或鈦合金所成的基材實施陽極氧化處理，在該基材的表面予以形成陽極氧化皮膜，使該陽極氧化皮膜脫離從而平滑化基材的表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2079" publication-number="202623946">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623946</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115104755</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>研磨方法、基板處理方法及基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">B24B7/04</main-classification>
        <further-classification edition="200601120260304B">B24B7/22</further-classification>
        <further-classification edition="200601120260304B">B24B27/033</further-classification>
        <further-classification edition="200601120260304B">B24B49/14</further-classification>
        <further-classification edition="202601120260304B">H10P52/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石井弘晃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHII, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石井淳一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHII, JUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種研磨方法及基板處理裝置。研磨方法具備：旋轉步驟，其使基板以水平姿勢旋轉；蝕刻步驟，其藉由將蝕刻液供給至基板W之背面，去除形成於基板W之背面之膜；及研磨步驟，其於去除基板W之背面之膜之後，將具有分散有磨粒之樹脂體之研磨具96與旋轉之基板W之背面接觸，藉由化學機械研削方式研磨基板W之背面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">22:研磨單元</p>
        <p type="p">35:保持旋轉部</p>
        <p type="p">37:研磨機構</p>
        <p type="p">39:基板厚度測定裝置</p>
        <p type="p">41:旋轉基座</p>
        <p type="p">43:保持銷</p>
        <p type="p">45:加熱板</p>
        <p type="p">46:溫度感測器</p>
        <p type="p">47:氣體噴出口</p>
        <p type="p">49:軸</p>
        <p type="p">51:旋轉機構</p>
        <p type="p">59:氣體供給管</p>
        <p type="p">61:氣體配管</p>
        <p type="p">63:氣體供給源</p>
        <p type="p">65:第1藥液噴嘴</p>
        <p type="p">67:第2藥液噴嘴</p>
        <p type="p">69:第1洗淨液噴嘴</p>
        <p type="p">71:第2洗淨液噴嘴</p>
        <p type="p">73:清洗液噴嘴</p>
        <p type="p">75:氣體噴嘴</p>
        <p type="p">77:第1藥液供給源</p>
        <p type="p">78:藥液配管</p>
        <p type="p">80:第2藥液供給源</p>
        <p type="p">81:藥液配管</p>
        <p type="p">83:第1洗淨液供給源</p>
        <p type="p">84:洗淨液配管</p>
        <p type="p">86:第2洗淨液供給源</p>
        <p type="p">87:洗淨液配管</p>
        <p type="p">89:清洗液供給源</p>
        <p type="p">90:清洗液配管</p>
        <p type="p">92:氣體供給源</p>
        <p type="p">93:氣體配管</p>
        <p type="p">95:噴嘴移動機構</p>
        <p type="p">96:研磨具</p>
        <p type="p">147:加熱器</p>
        <p type="p">154:加熱器</p>
        <p type="p">AX3:旋轉軸</p>
        <p type="p">AX4:旋轉軸</p>
        <p type="p">AX5:鉛直軸</p>
        <p type="p">V1:開關閥</p>
        <p type="p">V2:開關閥</p>
        <p type="p">V3:開關閥</p>
        <p type="p">V4:開關閥</p>
        <p type="p">V5:開關閥</p>
        <p type="p">V6:開關閥</p>
        <p type="p">V7:開關閥</p>
        <p type="p">W:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2080" publication-number="202625562">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625562</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115104757</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260302B">H10B43/27</main-classification>
        <further-classification edition="202301120260302B">H10B41/30</further-classification>
        <further-classification edition="202301120260302B">H10B41/35</further-classification>
        <further-classification edition="202301120260302B">H10B43/30</further-classification>
        <further-classification edition="202301120260302B">H10B43/35</further-classification>
        <further-classification edition="202601120260302B">H10W20/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澤田元気</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAWADA, GENKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野田光彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NODA, MITSUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平野聖也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRANO, SEIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本實施形態之半導體裝置具備設置於第1絕緣膜之第1方向之第1配線。第1配線排列於第2方向，沿第3方向延伸。第2絕緣膜分別與第1配線對應地設置於其上。第2絕緣膜之與各個第1配線相接之面上第2方向之寬度，較與其對應之第1配線之寬度為窄。第3絕緣膜分別與第1配線對應地設置於其上，分別覆蓋第2絕緣膜之兩側面。第4絕緣膜設置於第3絕緣膜上，第5絕緣膜設置於第4絕緣膜上。第1接觸件貫通第2～第5絕緣膜而連接於第1配線。第2配線設置於第1接觸件上。於第1配線之第1方向設置有第1接觸件，或設置有第2及第4絕緣膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:陣列晶片</p>
        <p type="p">23:位元線</p>
        <p type="p">24:配線</p>
        <p type="p">25a~25d:絕緣膜</p>
        <p type="p">28a,28b:通孔接觸件</p>
        <p type="p">28a1,28b1:障壁金屬</p>
        <p type="p">28a2,28b2:接觸件本體</p>
        <p type="p">60,70:絕緣膜</p>
        <p type="p">BL:位元線</p>
        <p type="p">F23a:上表面</p>
        <p type="p">PC1,PC2,PC3:寄生電容</p>
        <p type="p">STP:階差</p>
        <p type="p">W28b1,W28b2,W60,W70,Wbl:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2081" publication-number="202623721">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623721</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115104787</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>系統、霧氣生成裝置、充電裝置、終端裝置、電腦執行方法及電腦程式</chinese-title>
        <english-title>SYSTEM, AEROSOL GENERATION DEVICE, CHARGING DEVICE, TERMINAL DEVICE, COMPUTER EXECUTION METHOD AND COMPUTER PROGRAM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202001120260303B">A24F40/53</main-classification>
        <further-classification edition="202001120260303B">A24F40/90</further-classification>
        <further-classification edition="202001120260303B">A24F40/65</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本煙草產業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAPAN TOBACCO INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>濱口秀司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMAGUCHI, HIDESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示的課題在於提供一種在用以對霧氣生成裝置充電之充電裝置與終端裝置進行通信的系統中，靈活調整肇因於該通信所造成之電力消耗的技術。  &lt;br/&gt;　　本揭示的實施形態提供一種方法，其為與用以對霧氣生成裝置(106)充電之充電裝置(102)進行通信之終端裝置(104)的動作方法，該方法係包含：從充電裝置(102)獲得關於充電裝置(102)之電池(208)的充電資訊的步驟，根據充電資訊，判斷電池(208)的充電狀況的步驟；以及根據充電狀況，決定終端裝置(104)與充電裝置(102)之間可否通信的步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An objective of this disclosure is to provide a technique for flexibly adjusting power consumption caused by communication in a system in which a charging device for charging an aerosol generating device communicates with a terminal device. &lt;br/&gt;An embodiment of this disclosure provides a method which is an operation method of a terminal device 104 in communication with a charging device 102 for charging an aerosol generating device 106, which includes a step of acquiring a charging information relating to a battery 208 of the charging device 102 from the charging device 102, a step of determining the charging state of the battery 208 based on the charging information, and a step of determining whether the communication between the terminal device 104 and the charging device 102 can be performed based on the charging state.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:充電裝置</p>
        <p type="p">202:控制部</p>
        <p type="p">204:系統</p>
        <p type="p">206:記憶部</p>
        <p type="p">208:電池</p>
        <p type="p">210:充電埠</p>
        <p type="p">212:電力介面</p>
        <p type="p">214:第一通知部</p>
        <p type="p">216:第二通知部</p>
        <p type="p">218:電池控制部</p>
        <p type="p">220:通知控制部</p>
        <p type="p">222:資訊取得部</p>
        <p type="p">224:第一路徑</p>
        <p type="p">226:第二路徑</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2082" publication-number="202624230">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624230</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115104809</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用３，５－二取代苯炔基化合物與帕博利珠單抗之癌症治療法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">C07D487/04</main-classification>
        <further-classification edition="200601120260306B">A61K31/519</further-classification>
        <further-classification edition="200601120260306B">A61K39/395</further-classification>
        <further-classification edition="200601120260306B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大鵬藥品工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIHO PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米倉和比古</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONEKURA, KAZUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平井洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRAI, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松岡和明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUOKA, KAZUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示所欲解決之課題為提供一種新穎的併用療法，其對於對免疫檢查點抑制劑具有耐受性的癌症患者顯示優異的抗腫瘤效果，且其使用(S)-1-(3-(4-胺基-3-((3,5-二甲氧基苯基)乙炔基)-1H-吡唑并[3,4-d]嘧啶-1-基)吡咯啶-1-基)丙-2-烯-1-酮或其鹽。本揭示提供一種可與帕博利珠單抗併用投予至對免疫檢查點抑制劑具有耐受性的癌症患者之抗腫瘤劑，其包含(S)-1-(3-(4-胺基-3-((3,5-二甲氧基苯基)乙炔基)-1H-吡唑并[3,4-d]嘧啶-1-基)吡咯啶-1-基)丙-2-烯-1-酮或其鹽作為有效成分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2083" publication-number="202624224">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624224</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115104832</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>吡咯啶化合物的結晶</chinese-title>
        <english-title>CRYSTALLINE FORM OF PYRROLIDINE COMPOUND</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D401/14</main-classification>
        <further-classification edition="200601120260302B">A61K31/454</further-classification>
        <further-classification edition="200601120260302B">A61P29/00</further-classification>
        <further-classification edition="200601120260302B">A61P37/00</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商田邊製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANABE PHARMA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>子
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEDA, NAOKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長田裕臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGATA, HIROOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉田琢紘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIDA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種具有可作為醫藥品原料藥使用之一定品質的1-{2- [(3S,4R)-1-[(3R,4R)-1-環戊基-3-氟-4-(4-甲氧基苯基)吡咯啶-3-羰基]-4-(甲氧基甲基)吡咯啶-3-基]-5-(三氟甲基)苯基}哌啶-4-羧酸的結晶。具體而言，本發明提供一種結晶，其包含等莫耳量的1-{2-[(3S,4R)-1-[(3R,4R)-1-環戊基-3-氟-4-(4-甲氧基苯基)吡咯啶-3-羰基]-4-(甲氧基甲基)吡咯啶-3-基]-5-(三氟甲基)苯基}哌啶-4-羧酸與磷酸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a crystalline form of 1-{2-[(3S,4R)-1- [(3R,4R)-1-cyclopentyl-3-fluoro-4-(4-methoxyphenyl)pyrrolidine-3-carbonyl]-4-(methoxymethyl) pyrrolidin-3-yl]-5-(trifluoromethyl)phenyl}piperidine-4-carboxylic acid having a certain quality which can be used as an active pharmaceutical ingredient. Specifically, the present invention provides a crystalline form comprising an equimolar amount of 1-{2-[(3S,4R)-1-[(3R,4R)-1-cyclopentyl-3-fluoro-4-(4-methoxyphenyl) pyrrolidine-3-carbonyl]-4-(methoxymethyl)pyrrolidin-3-yl]-5-(trifluoromethyl)phenyl}piperidine-4-carboxylic acid and phosphoric acid.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2084" publication-number="202625075">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625075</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115104839</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>安裝在救急車輛上的系統與電腦實施方法</chinese-title>
        <english-title>SYSTEM INSTALLED IN AN EMERGENCY RESPONSE VEHICLE AND COMPUTER-IMPLEMENTED METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120260306B">G06Q50/60</main-classification>
        <further-classification edition="201801120260306B">H04W4/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商惠倫工程股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WHELEN ENGINEERING COMPANY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷米爾　肯尼斯　Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEMIEUX, KENNETH S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑克遜　科爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JACKSON, COLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅素　艾力克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUSSELL, ERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃爾查克　托馬斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WALCZAK, TOMASZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於配置和操作救急車輛中的多個串聯裝置的系統、方法和儲存介質。該系統包括多個周邊裝置，每個周邊裝置配置為接收和儲存一位址。一控制器，其與該多個周邊裝置通訊，至少兩個裝置具有一第一裝置類型，其中每個裝置的位址可由用戶選擇。該方法包括：選擇多個周邊裝置，每個周邊裝置配置為接收和儲存一位址；其中多個周邊裝置中的至少兩個具有一相同裝置類型；連接多個周邊裝置的每一個至一執行配置軟體的電腦來偵測每個裝置、接收至少一個裝置的地位址，及將該位址儲存於儲存介質中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system, method and storage medium for configuring and operating a plurality of serial devices in an emergency response vehicle. The system may include a plurality of peripheral devices, each configured to receive and store an address, a controller configured to transmit addressable commands to each of the devices, at least two of the devices having a first device type wherein the addresses of each of the devices are selectable by a user. The method may include selecting a plurality of peripheral devices, each configured to receive and store an address, with at least two of the devices have a same device type, connecting each of the devices to a computer executing configuration software, detecting each of the devices, receiving an address for at least one of the devices, and storing the address in a storage medium.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">102:控制器</p>
        <p type="p">110:燈條</p>
        <p type="p">112:交通燈號</p>
        <p type="p">114:內緣燈號</p>
        <p type="p">120:警報器</p>
        <p type="p">130:控制磁頭</p>
        <p type="p">140:遠端警報器模組</p>
        <p type="p">150:輸出擴充模組</p>
        <p type="p">152:輸出擴充模組</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2085" publication-number="202625160">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625160</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115104860</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自適應及智慧提示系統及控制介面</chinese-title>
        <english-title>ADAPTIVE AND INTELLIGENT PROMPTING SYSTEM AND CONTROL INTERFACE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G10L15/22</main-classification>
        <further-classification edition="200601120260302B">G10L15/16</further-classification>
        <further-classification edition="201901120260302B">G06N20/00</further-classification>
        <further-classification edition="200601120260302B">H04S7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商博姆雲３６０公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOOMCLOUD 360 INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賽得斯　柴克瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SELDESS, ZACHARY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自適應控制系統可自一使用者之自然語言指令識別使用者希望調整之一音訊渲染系統之一音訊參數。該自適應控制系統可識別其中該使用者提供該等指令之情境，其中該情境可包含特性化該使用者周圍之一環境之感測器資訊、特性化該使用者透過其放映音訊之裝置之裝置資訊或在一參數空間上追蹤之音訊參數之狀態。該自適應控制系統可包含將該情境特性化為一或多個機器學習模型之輸入資料以判定一可能音訊參數及該使用者透過其指令請求之一對應改變程度。該自適應控制系統可基於其中該使用者利用一可控系統之情境使用機器學習來產生音訊參數之推薦調整。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An adaptive control system may identify, from a user's natural language instructions, an audio parameter of an audio rendering system that the user wishes to adjust. The adaptive control system may identify the context in which the user is providing the instructions, where the context can include sensor information characterizing an environment around the user, device information characterizing the device through which the user is consuming audio, or states of audio parameters as tracked on a parametric space. The adaptive control system may input data characterizing the context into one or more machine learning models to determine a likely audio parameter and a corresponding degree of change the user is requesting through their instruction. The adaptive control system may generate recommended adjustments to audio parameters using machine learning based on the context in which the user is utilizing a controllable system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:使用者</p>
        <p type="p">120:自然語言指令</p>
        <p type="p">130:電視</p>
        <p type="p">140:音訊渲染系統</p>
        <p type="p">141:揚聲器</p>
        <p type="p">150:自適應控制系統</p>
        <p type="p">160:額外提示</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2086" publication-number="202625641">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625641</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115104870</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>發光裝置</chinese-title>
        <english-title>LIGHT EMITTING DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10H20/858</main-classification>
        <further-classification edition="202501120260302B">H10H20/854</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日亞化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NICHIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>髙鶴一真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOZURU, KAZUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>榎本聖史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENOMOTO, KIYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種散熱性優異的發光裝置。本發明之發光裝置具備半導體雷射元件、及將以金屬為主材料之底部與以陶瓷為主材料之框部接合而成之基部，基部具有配置半導體雷射元件之配置面、圍繞所配置之半導體雷射元件四周之框、及用於與半導體雷射元件電性連接之第一及第二電極層，底部具有配置面，框部具有與配置面接合之接合面、與接合面相交且形成比配置面大的框之內側面、及與接合面相交且形成比配置面小的框之內側面，第二電極層於框部中設置於與接合面不同的平面上，且該平面與形成比配置面小的框之內側面之至少一部分相交。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light emitting device includes a semiconductor laser element and a base member. The base member includes a bottom part, a frame part, and first and second electrode layers. The frame part forms a frame surrounding the semiconductor laser element. An area within an intersection line between the first inner surface and the bonding surface of the frame part has a size larger than a size of the arrangement surface of the bottom part. An area within an intersection line between the second inner surface and the bonding surface of the frame part has a size smaller than the size of the arrangement surface. The planar surface of the frame part intersects at least a part of the second inner surface. The planar surface and the second inner surface form a step portion on an inner side of the frame. The second electrode layer is disposed on the planar surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:發光裝置</p>
        <p type="p">100:基板</p>
        <p type="p">101:散熱部</p>
        <p type="p">102:絕緣部</p>
        <p type="p">110:基部</p>
        <p type="p">111:框部</p>
        <p type="p">118:底部</p>
        <p type="p">120:蓋部</p>
        <p type="p">130:接著部</p>
        <p type="p">140:透鏡部件</p>
        <p type="p">150:光反射部件</p>
        <p type="p">160:子基板</p>
        <p type="p">170:半導體雷射元件</p>
        <p type="p">180:引線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2087" publication-number="202625678">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625678</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115104880</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>垂直固態裝置</chinese-title>
        <english-title>VERTICAL SOLID-STATE DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P10/00</main-classification>
        <further-classification edition="202601120260302B">H10H29/20</further-classification>
        <further-classification edition="202501120260302B">H10H29/10</further-classification>
        <further-classification edition="202601120260302B">H10K39/10</further-classification>
        <further-classification edition="202501120260302B">H10D64/27</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商弗瑞爾公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VUEREAL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查吉　格拉姆瑞札</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAJI, GHOLAMREZA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查吉　格拉姆瑞札</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAJI, GHOLAMREZA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">隨著光電子裝置之像素密度變得更高，且該等光電子裝置之大小變得更小，隔離個別微型裝置之問題變得更困難。一種製作包含一微型裝置陣列之一光電子裝置之方法包括：在一基板上形成包含一單片作用層之一裝置層結構；在該裝置層結構上形成界定該微型裝置陣列之一第一觸點陣列；將該第一觸點陣列安裝至一背板，該背板包括控制流動至該微型裝置陣列中之電流之一驅動電路；移除該基板；及形成與該第一觸點陣列對應之一第二觸點陣列，其中在每一第二觸點之間具有一障壁。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">As the pixel density of optoelectronic devices becomes higher, and the size of the optoelectronic devices becomes smaller, the problem of isolating the individual micro devices becomes more difficult.A method of fabricating an optoelectronic device, which includes an array of micro devices, comprises: forming a device layer structure including a monolithic active layer on a substrate; forming an array of first contacts on the device layer structure defining the array of micro devices; mounting the array of first contacts to a backplane comprising a driving circuit which controls the current flowing into the array of micro devices; removing the substrate; andforming an array of second contacts corresponding to the array of first contacts with a barrier between each second contact.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:微型裝置/裝置</p>
        <p type="p">102:功能觸點</p>
        <p type="p">104:功能觸點</p>
        <p type="p">106:電流</p>
        <p type="p">110:金屬-絕緣體-半導體結構</p>
        <p type="p">112:電極/金屬-絕緣體-半導體結構</p>
        <p type="p">A:功能觸點</p>
        <p type="p">B:功能觸點</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2088" publication-number="202624824">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624824</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115104897</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學成像系統</chinese-title>
        <english-title>OPTICAL IMAGING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">G02B11/20</main-classification>
        <further-classification edition="200601120260306B">G02B13/00</further-classification>
        <further-classification edition="202101120260306B">G02B7/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金學哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HAG CHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙鏞主</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JO, YONG JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學成像系統包括具有正折射能力的第一透鏡、具有正折射能力的第二透鏡、具有正折射能力的第三透鏡及具有正折射能力的第四透鏡，並且所述光學成像系統的焦距比數等於或小於1.0。所述光學成像系統能夠在低照度下捕獲影像的同時達成小型化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical imaging system includes a first lens having positive refractive power, a second lens having positive refractive power, a third lens having positive refractive power, and a fourth lens having positive refractive power, and an F No. of the optical imaging system is equal to or less than 1.0. The optical imaging system is capable of achieving miniaturization while capturing an image at low illumination.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光學成像系統</p>
        <p type="p">110:第一透鏡</p>
        <p type="p">120:第二透鏡</p>
        <p type="p">130:第三透鏡</p>
        <p type="p">140:第四透鏡</p>
        <p type="p">150:濾光器</p>
        <p type="p">160:影像感測器</p>
        <p type="p">ST:光闌</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2089" publication-number="202625581">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625581</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115104938</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有有基板連接部的源極或汲極結構的環繞式閘極積體電路結構</chinese-title>
        <english-title>GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING SOURCE OR DRAIN STRUCTURES WITH SUBSTRATE CONNECTION PORTIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260305B">H10D30/43</main-classification>
        <further-classification edition="202501120260305B">H10D62/10</further-classification>
        <further-classification edition="202501120260305B">H10D62/13</further-classification>
        <further-classification edition="202501120260305B">H10D64/27</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商英特爾股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈桑　穆罕默德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASAN, MOHAMMAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BD</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫瑪　尼泰斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, NITESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏　魯沙布</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAH, RUSHABH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫希　安拿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURTHY, ANAND</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>派特爾　波提克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATEL, PRATIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>甘尼　塔何</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GHANI, TAHIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邁爾　崔希亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEYER, TRICIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>保伯格　寇利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOMBERGER, CORY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛雷斯　葛蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLASS, GLENN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賽亞　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CEA, STEPHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑哈吉爾達　阿拿特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAHAGIRDAR, ANANT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述具有包括基板連接部分的源極或汲極結構的環繞式閘極積體電路結構，以及製造具有包括基板連接部分的源極或汲極結構的環繞式閘極積體電路結構的方法。例如，積體電路結構包括垂直配置的奈米線。閘極堆疊在該等垂直配置的奈米線上方。第一磊晶源極或汲極結構在該等垂直配置的奈米線的第一端。第二磊晶源極或汲極結構在該等垂直配置的奈米線的第二端。該第一或第二磊晶源極或汲極結構的一或二者具有上部和下磊晶延伸部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Gate-all-around integrated circuit structures having source or drain structures with substrate connection portions, and methods of fabricating gate-all-around integrated circuit structures having source or drain structures with substrate connection portions, are described. For example, an integrated circuit structure includes a vertical arrangement of nanowires. A gate stack is over the vertical arrangements of nanowires. A first epitaxial source or drain structure is at a first end of the vertical arrangement of nanowires. A second epitaxial source or drain structure is at a second end of the vertical arrangement of nanowires. One or both of the first or second epitaxial source or drain structures has an upper portion and a lower epitaxial extension portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:積體電路結構</p>
        <p type="p">102:基板</p>
        <p type="p">104:子鰭</p>
        <p type="p">108:奈米線</p>
        <p type="p">112:介電蓋</p>
        <p type="p">116A:介電閘極間隔物</p>
        <p type="p">116B:內部間隔物</p>
        <p type="p">124:磊晶源極或汲極結構</p>
        <p type="p">124A:下磊晶延伸部</p>
        <p type="p">124B:上部</p>
        <p type="p">126:高k閘極介電層/閘極堆疊</p>
        <p type="p">128:金屬閘極電極/閘極堆疊</p>
        <p type="p">130:導電接觸</p>
        <p type="p">132:層間介電材料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2090" publication-number="202625141">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625141</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115104959</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示面板、顯示裝置、輸入輸出裝置、資料處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260306B">G09G3/32</main-classification>
        <further-classification edition="202501120260306B">H10H29/30</further-classification>
        <further-classification edition="202501120260306B">H10H29/39</further-classification>
        <further-classification edition="202501120260306B">H10D30/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商半導體能源研究所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>豊高耕平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOTAKA, KOUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村太紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, DAIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種方便性或可靠性優異的新穎的顯示面板。一種顯示面板，包括顯示區域、第一功能層及第二功能層。顯示區域包括像素，像素包括顯示元件及像素電路。另外，第一功能層包括像素電路、掃描線及第一連接部，顯示元件與像素電路電連接，像素電路與掃描線電連接。另外，第二功能層包括與第一功能層重疊的區域，第二功能層包括驅動電路及佈線，驅動電路以在與顯示元件之間夾著像素電路的方式設置。佈線在第一連接部與掃描線電連接，佈  &lt;br/&gt;線與驅動電路電連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">GD:驅動電路</p>
        <p type="p">SD:驅動電路</p>
        <p type="p">700:顯示面板</p>
        <p type="p">702(i,j):像素</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2091" publication-number="202624882">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624882</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105023</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>附多層反射膜之基板、反射型光罩基底、反射型光罩、與半導體裝置之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260306B">G03F1/24</main-classification>
        <further-classification edition="200601120260306B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＨＯＹＡ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOYA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木宏太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, KOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尾上貴弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONOUE, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用以製造具有對蝕刻氣體之耐性較高且對洗淨之耐性較高之保護膜的反射型光罩之附多層反射膜之基板。  &lt;br/&gt;本發明係一種附多層反射膜之基板，其特徵在於：具有基板、設置於該基板之上之多層反射膜、及設置於該多層反射膜之上之保護膜，且上述保護膜含有釕(Ru)、以及選自鋁(Al)、釔(Y)、鋯(Zr)、銠(Rh)及鉿(Hf)中之至少1種添加材料，上述添加材料之含量為5原子%以上且未達50原子%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光罩基底用基板(基板)</p>
        <p type="p">5:多層反射膜</p>
        <p type="p">6:保護膜</p>
        <p type="p">110:附多層反射膜之基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2092" publication-number="202624899">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624899</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105044</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>投影曝光裝置以及用於設計投影曝光裝置之組件的方法</chinese-title>
        <english-title>PROJECTION EXPOSURE APPARATUS AND METHOD FOR DESIGNING A COMPONENT OF A PROJECTION EXPOSURE APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G03F7/20</main-classification>
        <further-classification edition="200601120260302B">G02B27/18</further-classification>
        <further-classification edition="200601120260302B">G02B26/10</further-classification>
        <further-classification edition="202001120260302B">G06F30/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARL ZEISS SMT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普拉克　希羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POLLAK, THILO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜爾　迪特瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUERR, DIETMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施雷岑邁爾　伊琳娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHREZENMEIER, IRINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齊施蓋爾　喬爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSCHISCHGALE, JOERG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥杰　瑪西爾斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANGER, MATTHIAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>別利亞科夫　安德烈亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BELJAKOV, ANDREAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑雷格　斯蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAUEREGGER, STEFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐斯坦朵夫　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSTENDORF, ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝德　迪特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BADER, DIETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉布　馬庫斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAAB, MARKUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱勒　巴斯蒂安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KELLER, BASTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種用於半導體微影的投影曝光裝置（1、101）之組件（30），其中該組件（30）包含一光學元件（31）及一致動器（32、35、39.x、43、50），且該光學元件（31）與該致動器（32、35、39.x、43、50）彼此力壓合連接，並且其中該致動器（32、35、39.x、43、50）配置成使該光學元件（31）至少局部變形。根據本發明，該致動器（32、35、39.x、43、50）具體實施使得在限定致動器（32、35、39.x、43、50）周邊處的剛性損失對成像品質影響降至最低。  &lt;br/&gt;本發明進一步關於一種方法，用於設計一具有光學元件31的投影曝光裝置1、101之組件30；及一致動器32、35、39.x、43、50，用於使在由致動器32、35、39.x、43、50所引起光學元件31變形情況下寄生變形對投影曝光裝置1、101的成像品質之影響降至最低，該方法包括下列步驟：  &lt;br/&gt;- 設計該致動器（32、35、39.x、43、50）；  &lt;br/&gt;- 確定由致動或由該光學元件（31）和該致動器（32、35、39.x、43、50）的不同熱膨脹係數所引起該光學元件（31）的寄生變形；  &lt;br/&gt;- 基於該寄生變形確定該寄生像差，同時考慮該投影曝光裝置（1、101）中使用的掃描曝光之總和效應；  &lt;br/&gt;- 基於該已確定寄生像差，將該致動器（32、35、39.x、43、50）最佳化；  &lt;br/&gt;- 重複該等前述處理步驟（61、62、63、64）中的至少一些者直到該寄生像差之值低於一預定值為止。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a component (30) for a projection exposure apparatus (1, 101) for semiconductor lithography, wherein the component (30) comprises an optical element (31) and an actuator (32, 35, 39.x, 43, 50), and the optical element (31) and the actuator (32, 35, 39.x, 43, 50) are force-fittingly connected to each other, and wherein the actuator (32, 35, 39.x, 43, 50) is configured to at least locally deform the optical element (31). According to the invention, the actuator (32, 35, 39.x, 43, 50) is embodied such that the influence of the loss in rigidity at the peripheries delimiting the actuator (32, 35, 39.x, 43, 50) on the imaging quality is minimized. &lt;br/&gt;The invention furthermore relates to a method for designing a component (30) of a projection exposure apparatus (1, 101) with an optical element (31) and an actuator (32, 35, 39.x, 43, 50) for minimizing the effects of parasitic deformations in the case of the deformation of the optical element (31) caused by the actuator (32, 35, 39.x, 43, 50) on the imaging quality of the projection exposure apparatus (1, 101), comprising the following method steps: &lt;br/&gt;- designing the actuator (32, 35, 39.x, 43, 50), &lt;br/&gt;- determining the parasitic deformations of the optical element (31) caused by an actuation or by different coefficients of thermal expansion of the optical element (31) and the actuator (32, 35, 39.x, 43, 50), &lt;br/&gt;- determining the parasitic aberrations on the basis of the parasitic deformations while taking into account the summing effect of a scanning exposure used in the projection exposure apparatus (1, 101), &lt;br/&gt;- optimizing the actuator (32, 35, 39.x, 43, 50) on the basis of the determined parasitic aberrations, &lt;br/&gt;- repeating at least some of the preceding process steps (61, 62, 63, 64) until the value for the parasitic aberration falls under a predetermined value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">30:組件</p>
        <p type="p">31:反射鏡</p>
        <p type="p">35:致動器矩陣</p>
        <p type="p">36:致動器墊</p>
        <p type="p">37:行</p>
        <p type="p">38:孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2093" publication-number="202624793">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624793</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105072</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於校準閃爍偵測器的脈衝中子靈敏度的方法和系統</chinese-title>
        <english-title>METHODS AND SYSTEMS FOR CALIBRATING PULSED NEUTRON SENSITIVITY OF SCINTILLATION DETECTOR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260306B">G01T3/06</main-classification>
        <further-classification edition="200601120260306B">G01T7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商眉山博雅新材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEISHAN BOYA ADVANCED MATERIALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭洪生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, HONGSHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本說明書實施例提供一種用於校準閃爍偵測器的脈衝中子靈敏度的方法和系統。該系統包括：閃爍偵測器；電漿焦點裝置，用於發射脈衝中子；銀啟動中子偵測器，用於測量由所述電漿焦點裝置發射的所述脈衝中子的中子總數，以便基於所述中子總數來確定所述閃爍偵測器的所述脈衝中子靈敏度；以及延時裝置，連接所述電漿焦點裝置和所述銀啟動中子偵測器，用於延遲觸發所述銀啟動中子偵測器對所述脈衝中子的偵測。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure provides a method and system for calibrating a pulsed neutron sensitivity of a scintillation detector. The system may include: a scintillation detector; a plasma focus device configured to emit pulsed neutrons; a silver-activated neutron detector configured to measure a total number of neutrons emitted by the plasma focus device as pulsed neutrons, so as to determine the pulsed neutron sensitivity of the scintillation detector based on the total number of neutrons; and a delay device, connected to the plasma focus device and the silver-activated neutron detector, being configured to delay a triggering of the silver-activated neutron detector to detect the pulsed neutrons.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:電漿焦點裝置</p>
        <p type="p">120:閃爍偵測器</p>
        <p type="p">130:銀激活中子偵測器</p>
        <p type="p">200:校準系統</p>
        <p type="p">210:延時裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2094" publication-number="202625261">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625261</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105093</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電漿處理裝置</chinese-title>
        <english-title>PLASMA PROCESSING APPARATUS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">H01J37/32</main-classification>
        <further-classification edition="202601120260304B">H10P72/70</further-classification>
        <further-classification edition="202601120260304B">H10P50/20</further-classification>
        <further-classification edition="200601120260304B">H05H1/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石川真矢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIKAWA, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>針生大輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARIU, DAIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種改良之電極構造，可高效率地向基板支持部內之電極供給電力。  &lt;br/&gt;本發明包含：電漿處理腔室、包含基座、陶瓷構件、環狀構件、配置於基板支持面下方之第1及第2中央電極、內側區域配置於第1中央電極之邊緣區域下方並經由第1縱向連接器與第1中央電極之邊緣區域電性連接之第1環狀連接器、內側區域配置於第2中央電極之邊緣區域下方並經由第2縱向連接器與第2中央電極之邊緣區域電性連接之第2環狀連接器、以及經由氣體分配空間而形成於第1環狀連接器及第2環狀連接器之下方之中央加熱器電極之基板支持部、經由第3縱向連接器而電性連接於第1環狀連接器之外側區域之DC電源，以及經由第4縱向連接器而電性連接於第2環狀連接器之外側區域之電壓脈衝生成部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There is provided a plasma processing apparatus comprising: a plasma processing chamber; a substrate support disposed in the plasma processing chamber, the substrate support including: a base, a ceramic member disposed on the base and having a substrate support surface and a ring support surface, one more annular members disposed on the ring support surface to surround a substrate on the substrate support surface, first and second central electrodes inserted into the ceramic member, first to fourth vertical connectors inserted into the ceramic member, first and second annular connectors inserted into the ceramic member, and a central heater electrode inserted into the ceramic member; a DC power source electrically connected to an outer region of the first annular connector through the third vertical connector; and a voltage pulse generator electrically connected to an outer region of the second annular connector through the fourth vertical connector.</p>
      </isu-abst>
      <representative-img>
        <p type="p">111a:中央區域</p>
        <p type="p">111b:環狀區域</p>
        <p type="p">114:靜電吸盤</p>
        <p type="p">114a:陶瓷構件</p>
        <p type="p">114b:底面</p>
        <p type="p">115:靜電電極</p>
        <p type="p">115a:第1靜電電極</p>
        <p type="p">115b1,115b2:第2靜電電極</p>
        <p type="p">115c:吸附用環狀驅動器</p>
        <p type="p">115d,115e,115f:導電性通路</p>
        <p type="p">1150a,1150b:端子</p>
        <p type="p">116:偏壓電極</p>
        <p type="p">116a:第1偏壓電極</p>
        <p type="p">116b:第2偏壓電極</p>
        <p type="p">116b2:外側區域</p>
        <p type="p">116c:偏壓用環狀驅動器</p>
        <p type="p">116d,116e,116f:導電性通路</p>
        <p type="p">116g:結合用環狀驅動器</p>
        <p type="p">116g1:內側區域</p>
        <p type="p">116h:導電性通路</p>
        <p type="p">1160a,1160b:端子</p>
        <p type="p">117:加熱器電極</p>
        <p type="p">117a:第1加熱器電極群</p>
        <p type="p">117b:第2加熱器電極</p>
        <p type="p">117c:導電性通路</p>
        <p type="p">1170a,1170b:端子</p>
        <p type="p">118:傳熱氣體供給部</p>
        <p type="p">118a:分配空間(氣體分配空間)</p>
        <p type="p">118b:氣體入口</p>
        <p type="p">118c:氣體出口</p>
        <p type="p">E1:邊緣區域</p>
        <p type="p">E2:邊緣區域</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2095" publication-number="202624225">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624225</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105124</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>ＧＬＰ－１Ｒ調節化合物</chinese-title>
        <english-title>GLP-1R MODULATING COMPOUNDS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D401/14</main-classification>
        <further-classification edition="200601120260302B">C07D401/10</further-classification>
        <further-classification edition="200601120260302B">C07D405/14</further-classification>
        <further-classification edition="200601120260302B">C07D471/04</further-classification>
        <further-classification edition="200601120260302B">C07D417/14</further-classification>
        <further-classification edition="200601120260302B">A61K31/4439</further-classification>
        <further-classification edition="200601120260302B">A61K31/444</further-classification>
        <further-classification edition="200601120260302B">A61P3/00</further-classification>
        <further-classification edition="200601120260302B">A61P1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商基利科學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GILEAD SCIENCES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿姆斯壯　梅根　Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARMSTRONG, MEGAN K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱希帝　詹姆士　Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CASSIDY, JAMES S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　阿爾伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIN, ELBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周　建宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, CHIENHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科特爾　傑若米　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COTTELL, JEROMY J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪兆億</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, CHAO-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯拉杜瑞　卡沃士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOLAHDOUZAN, KAVOOS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　大衛　Ｗ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, DAVID W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米契爾　麥克　Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITCHELL, MICHAEL L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅伯特　以斯拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROBERTS, EZRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舒羅德　史考特　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHROEDER, SCOTT D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏皮羅　納森　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAPIRO, NATHAN D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泰勒　詹姆士　Ｇ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAYLOR, JAMES G.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="14">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯姆士　崔　萊茵農</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THOMAS-TRAN, RHIANNON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="15">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊特　納森　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WRIGHT, NATHAN E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="16">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　征宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, ZHENG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供GLP-1R促效劑、及其組成物、方法、及套組。此類化合物通常可用於治療人類的GLP-1R介導之疾病或病況。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides GLP-1R agonists, and compositions, methods, and kits thereof. Such compounds are generally useful for treating a GLP-1R mediated disease or condition in a human.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2096" publication-number="202625636">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625636</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105126</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>微型封裝結構</chinese-title>
        <english-title>MICRO PACKAGE STRUCTURE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260304B">H10H20/85</main-classification>
        <further-classification edition="202301120260304B">H10K50/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海顯耀顯示科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JADE BIRD DISPLAY (SHANGHAI) LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岳楊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUE, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種微型封裝結構，包括：微型LED面板，其包括IC(積體電路)基板和形成在所述IC基板上的微型LED陣列區域；形成在所述微型LED面板上方的頂蓋板，使得從所述微型LED陣列區域發射的光向上透射到所述頂蓋板；以及圍繞所述微型LED陣列區域形成在所述微型LED面板的邊緣與所述頂蓋板的邊緣之間的密封結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A micro package structure includes a micro LED panel including an IC (integrated circuit) substrate and an micro LED array area formed on the IC substrate; a top cover plane formed above the micro LED panel, so that light emitted from the micro LED array area is transmitted upward to the top cover plane; and a seal structure formed between an edge of the micro LED panel and an edge of the top cover plane around the micro LED array area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:微型封裝結構</p>
        <p type="p">110:支撐基板</p>
        <p type="p">120:外部電路板</p>
        <p type="p">130:微型LED面板</p>
        <p type="p">131:IC(積體電路)基板，IC基板</p>
        <p type="p">132:微型LED陣列區域</p>
        <p type="p">140:頂蓋板</p>
        <p type="p">150:密封結構</p>
        <p type="p">151:密封劑</p>
        <p type="p">152:間隔件</p>
        <p type="p">170:鍵合線</p>
        <p type="p">180:保護層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2097" publication-number="202625436">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625436</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105127</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>影像編碼器、影像解碼器及非暫時性電腦可讀取媒體</chinese-title>
        <english-title>IMAGE ENCODER, IMAGE DECODER AND NON-TRANSITORY COMPUTER READABLE MEDIUM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201401120260304B">H04N19/119</main-classification>
        <further-classification edition="201401120260304B">H04N19/176</further-classification>
        <further-classification edition="201401120260304B">H04N19/583</further-classification>
        <further-classification edition="201401120260304B">H04N19/513</further-classification>
        <further-classification edition="201401120260304B">H04N19/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商松下電器（美國）知識產權公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安倍清史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, KIYOFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西孝啓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHI, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠間正真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMA, TADAMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加納龍一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANOH, RYUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　宗順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, CHONG SOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖如伶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, RU LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫　海威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, HAI WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏西達　史寇敘　巴曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHASHIDHAR, SUGHOSH PAVAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　漢文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEO, HAN BOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李靜雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JING YA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種影像編碼器，其包括電路；以及耦接至該電路之一記憶體；其中該電路在操作時執行一分割程序，其包括：判定一影像區塊中之複數個分割區，該等複數個分割區包括一第一分割區及一第二分割區，該第一分割區具有一非矩形形狀，且該第二分割區係與該第一分割區重疊；選擇用於該第一分割區之一第一運動向量及用於該第二分割區之一第二運動向量；以及使用該第一運動向量對該第一分割區編碼且使用該第二運動向量對該第二分割區編碼，並且該電路在操作時，當該影像區塊之寬度對該影像區塊之高度的比率係大於4時，或該高度對該寬度的比率係大於4時，停用該分割程序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image encoder is provided, which includes circuitry; and a memory coupled to the circuitry; wherein the circuitry, in operation, performs a partition process including: determining a plurality of partitions in an image block, the plurality of partitions including a first partition having a non-rectangular shape and a second partition which is overlapped with the first partition; selecting a first motion vector for the first partition and a second motion vector for the second partition; and encoding the first partition using the first motion vector and the second partition using the second motion vector, and the circuitry, in operation, disables the partition process when a ratio of a width of the image block to a height of the image block is larger than 4 or a ratio of the height to the width is larger than 4.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2000:分裂影像區塊之程序</p>
        <p type="p">S2001、S2002、S2003:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2098" publication-number="202625126">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625126</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105136</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學片材及光學片材之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">G09F9/33</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大日本印刷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>足達功太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADACHI, KOTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋口明典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIGUCHI, HIRONORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河本和樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAMOTO, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢野哲朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANO, TETSURO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]將目視辨識顯示裝置的方向上的亮度增大。&lt;br/&gt;  [解決手段]顯示裝置1具備：發光基板10，具有區分成單位區域10a的半導體層11、及配置在複數個單位區域10a的發光部13；及光學片材20。光學片材20具有複數個單位透鏡21。複數個單位區域10a是在第1方向及第2方向上排列。w/p小於0.025，且以下至少任1者成立：r/p為0.2以上且小於0.525並且滿足式(1)、r/p為0.525以上且小於1.5並且滿足式(2)、r/p為0.2以上且小於0.525並且滿足式(3)、r/p為0.525以上且小於0.725並且滿足式(4)、及r/p為0.725以上且小於1.5並且滿足式(5)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:顯示裝置</p>
        <p type="p">10:發光基板</p>
        <p type="p">10a:單位區域</p>
        <p type="p">10c:單位區域第2方向列</p>
        <p type="p">11:半導體層</p>
        <p type="p">13:發光部</p>
        <p type="p">20:光學片材</p>
        <p type="p">21:單位透鏡</p>
        <p type="p">21a:透鏡面</p>
        <p type="p">23:本體部</p>
        <p type="p">40:密封層</p>
        <p type="p">50:黏著層</p>
        <p type="p">60:基材層</p>
        <p type="p">C1,C2:中心</p>
        <p type="p">d:距離</p>
        <p type="p">d1:第1方向</p>
        <p type="p">d4:法線方向</p>
        <p type="p">h:高度</p>
        <p type="p">L1:邊界</p>
        <p type="p">p,p2:間距</p>
        <p type="p">P1:頂點</p>
        <p type="p">r:曲率半徑</p>
        <p type="p">w:寬度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2099" publication-number="202624439">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624439</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105160</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>黏著劑組成物、黏著片、光學積層體、影像顯示面板及影像顯示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">C09J171/00</main-classification>
        <further-classification edition="200601120260304B">C09J133/10</further-classification>
        <further-classification edition="200601120260304B">C09J11/04</further-classification>
        <further-classification edition="201801120260304B">C09J7/30</further-classification>
        <further-classification edition="201801120260304B">C08K3/014</further-classification>
        <further-classification edition="200601120260304B">B32B7/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小野寬大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONO, HIROTOMO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村智之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, TOMOYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>外山雄祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYAMA, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供之黏著劑組成物包含具有聚醚結構之聚合物(A)作為主成分，且更包含導電劑及自由基捕捉劑。由上述黏著劑組成物形成黏著片後，上述黏著片具有1×10&lt;sup&gt;10&lt;/sup&gt;Ω/□以下之表面電阻值。又，本發明提供之黏著片亦可由含聚合物(B)之黏著劑組成物形成，且該聚合物(B)在頻率100kHz下之相對介電常數為5.0以上，並且，該黏著片在105℃及加熱120小時後，甲酸之含量以質量基準計為1000ppm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:黏著片</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2100" publication-number="202624540">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624540</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105183</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>製造乾膜之裝置與方法、乾膜、基板以及能量儲存或能量轉換系統</chinese-title>
        <english-title>DEVICE AND METHOD FOR PRODUCING A DRY FILM, A DRY FILM, A SUBSTRATE AND AN ENERGY STORAGE OR ENERGY CONVERTER SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">C23C24/06</main-classification>
        <further-classification edition="200601120260303B">H01M4/04</further-classification>
        <further-classification edition="200601120260303B">H01M10/04</further-classification>
        <further-classification edition="200601120260303B">B29C43/24</further-classification>
        <further-classification edition="200601120260303B">B29C43/52</further-classification>
        <further-classification edition="201301120260303B">H01G11/28</further-classification>
        <further-classification edition="201301120260303B">H01G13/00</further-classification>
        <further-classification edition="201301120260303B">H01G11/86</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商馬修斯國際有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATTHEWS INTERNATIONAL GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商馬修斯國際有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATTHEWS INTERNATIONAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈克堡　托馬斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HACKFORT, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃爾特斯　凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOLTERS, KAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波音　托斯騰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOING, THORSTEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克萊恩葛里斯　卡斯騰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLEINGRIES, CARSTEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施雷格爾　羅尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHLEGEL, RONNY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">該發明涉及一種用於製造乾膜的裝置，包含乾粉的進料器、粉末磨和輥裝置。粉末磨具有第一體和第二體，以這樣的方式排列，使它們在第一體和第二體之間提供第一間隙，其中至少第一體或第二體被設計為旋轉體，並且第一間隙形成以接收來自進料器的乾粉並將其加工成乾膜。輥裝置包含至少一個輥，其中輥裝置被設計為接收來自粉末磨的乾膜。粉末磨和輥裝置彼此解耦。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a device for producing a dry film, comprising a feeder of dry powder, a powder mill and a roll arrangement. The powder mill has a first body and a second body, arranged in such a way that they provide a first gap between the first body and the second body, wherein at least the first body or the second body is designed as a rotating body and the first gap is formed to receive the dry powder from the feeder and to process it into a dry film. The roll arrangement, comprises at least one roll, wherein the roll arrangement is designed to receive the dry film from the powder mill. The powder mill and the roll arrangement are decoupled from each other. 」</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:第一輥</p>
        <p type="p">102:第一間隙</p>
        <p type="p">106:第一輥的旋轉方向</p>
        <p type="p">201:第二輥</p>
        <p type="p">203:乾膜</p>
        <p type="p">204:進料器</p>
        <p type="p">205:乾粉</p>
        <p type="p">206:第二輥的旋轉方向</p>
        <p type="p">207:粉末磨和輥裝置之間的距離</p>
        <p type="p">209:基板</p>
        <p type="p">210:粉末磨</p>
        <p type="p">220:輥裝置</p>
        <p type="p">301:第三輥</p>
        <p type="p">302:第三間隙</p>
        <p type="p">306:第三輥的旋轉方向</p>
        <p type="p">401:第四輥</p>
        <p type="p">406:第四輥的旋轉方向</p>
        <p type="p">501:第五輥</p>
        <p type="p">506:第五輥的旋轉方向</p>
        <p type="p">601:第六輥</p>
        <p type="p">606:第六輥的旋轉方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2101" publication-number="202624914">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624914</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105227</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>清潔設備控制方法及裝置、計算機可讀取媒介及電子設備</chinese-title>
        <english-title>METHOD AND APPARATUS FOR CONTROLLING CLEANING DEVICE, AND COMPUTER-READABLE STORAGE MEDIUM AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202401120260306B">G05D1/648</main-classification>
        <further-classification edition="202401120260306B">G05D1/24</further-classification>
        <further-classification edition="202401120260306B">G05D1/60</further-classification>
        <further-classification edition="202201120260306B">G06V20/80</further-classification>
        <further-classification edition="202401320260306B">G05D107/20</further-classification>
        <further-classification edition="202401320260306B">G05D109/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, QING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牛延升</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIU, YANSHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>叢一鳴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CONG, YIMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宇軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YUXUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種清潔設備控制方法、清潔設備控制裝置、計算機可讀存儲介質及電子設備。該方法包括：在地面鋪材為具有拼接縫隙的地板時，識別該地面鋪材的鋪設方向，其中，鋪設方向為地面鋪材的最長對稱軸所在的方向；根據鋪設方向，確定清潔設備的清潔方向；控制清潔設備沿清潔方向進行清潔。該方法能夠根據地面鋪材的實際情況設置清潔方向</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a method for controlling a cleaning device, an apparatus for controlling a cleaning device, a computer-readable storage medium, and an electronic device. The method includes: identifying the laying direction of the floor paving material when the floor paving material is floor with joint seams, where the laying direction is a direction in which the longest symmetry axis of the floor paving material is located; determining the cleaning direction of the cleaning device according to the laying direction; and controlling the cleaning device to clean along the cleaning direction. This method can set the cleaning direction according to the actual situation of the floor paving material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110:步驟</p>
        <p type="p">S120:步驟</p>
        <p type="p">S130:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2102" publication-number="202624902">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624902</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105244</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯像劑補給容器</chinese-title>
        <english-title>DEVELOPER SUPPLY CONTAINER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">G03G15/08</main-classification>
        <further-classification edition="200601120260305B">G03G21/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANON KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神羽學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIMBA, MANABU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沖野禮知</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKINO, AYATOMO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村上雄也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAKAMI, KATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長島利明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGASHIMA, TOSHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田澤文朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAZAWA, FUMIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的是提供一種：可使「用來促使顯像劑接收部位移，而連接於顯像劑補給容器的機構」簡易化的顯像劑補給容器。</p>
        <p type="p">在可通過「可裝卸於顯像劑接收裝置(8)，且可位移地設於前述顯像劑接收裝置(8)」的顯像劑接收部(11)來補給顯像劑的顯像劑補給容器(1)中，具有用來收容顯像劑的顯像劑收容部(2c)及卡合部(3b2、3b4)，該卡合部(3b2、3b4)可與前述顯像劑接收部(11)卡合，並伴隨著前述顯像劑補給容器(1)的安裝動作，使前述顯像劑接收部(11)朝向前述顯像劑補給容器(1)移動，而形成前述顯像劑補給容器(1)與前述顯像劑接收部(11)連接的狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">4:遮斷器</p>
        <p type="p">4d:支承部</p>
        <p type="p">4k:被限制突起(突起部)</p>
        <p type="p">D4:被限制突起的高度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2103" publication-number="202623953">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623953</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105280</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>研磨墊、研磨墊的製造方法及研磨方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260309B">B24B37/20</main-classification>
        <further-classification edition="201201120260309B">B24B37/24</further-classification>
        <further-classification edition="202601120260309B">H10P52/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士紡控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIBO HOLDINGS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立野哲平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TATENO, TEPPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>栗原浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURIHARA, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口早月</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, SATSUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>髙見沢大和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAMIZAWA, YAMATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種研磨墊，包括研磨層，所述研磨層具有用於對被研磨物進行研磨加工的研磨面，所述研磨墊中，所述研磨層包含在所述研磨層內形成中空體的中空微小球體，所述研磨層的剖面具有10 μm～14 μm的平均開孔徑，於將1 μm的範圍表示為1級的所述研磨層的剖面的開孔徑直方圖中，25 μm以上的開孔數的總和相對於所述剖面的總開孔數而為5%以下，25 μm以上的各級的開孔面積的總和相對於所述剖面的合計開孔面積而為20%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:研磨裝置</p>
        <p type="p">3:研磨墊</p>
        <p type="p">4:研磨層</p>
        <p type="p">6:緩衝層</p>
        <p type="p">8:被研磨物</p>
        <p type="p">9:漿料</p>
        <p type="p">10:研磨壓盤</p>
        <p type="p">16:保持壓盤</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2104" publication-number="202625018">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625018</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105313</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>將一ｋ個位元信號轉換成一ｎ個位元信號之輸入區塊</chinese-title>
        <english-title>INPUT BLOCK FOR CONVERTING A K-BIT SIGNAL INTO AN N-BIT SIGNAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260305B">G06N3/063</main-classification>
        <further-classification edition="202301120260305B">G06N3/04</further-classification>
        <further-classification edition="200601120260305B">H03M1/66</further-classification>
        <further-classification edition="200601120260305B">G11C16/04</further-classification>
        <further-classification edition="200601120260305B">G11C16/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商超捷公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICON STORAGE TECHNOLOGY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　曉萬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRAN, HIEU VAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">揭示用於在一深度學習人工神經網路中執行各種電性參數之校準的眾多實施例。在一個實施例中，一種系統包含：一數位至類比轉換器，其用於接收&lt;i&gt;k&lt;/i&gt;個位元之一輸入且產生一第一類比輸出；一映射純量器，其用於將該第一類比輸出轉換成一第二類比輸出；及一類比至數位轉換器，其用於自該第二類比輸出產生&lt;i&gt;n&lt;/i&gt;個位元之一輸出，其中&lt;i&gt;n&lt;/i&gt;為不同於&lt;i&gt;k&lt;/i&gt;之一值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Numerous examples are disclosed for performing calibration of various electrical parameters in a deep learning artificial neural network. In one example, a system comprises a digital-to-analog converter for receiving an input of &lt;i&gt;k&lt;/i&gt; bits and generating a first analog output, a mapping scalar for converting the first analog output into a second analog output, and an analog-to-digital converter for generating an output of &lt;i&gt;n&lt;/i&gt; bits from the second analog output, where &lt;i&gt;n&lt;/i&gt; is a different value than &lt;i&gt;k&lt;/i&gt;.</p>
      </isu-abst>
      <representative-img>
        <p type="p">C1:層</p>
        <p type="p">C2:層</p>
        <p type="p">C3:層</p>
        <p type="p">CB1:突觸</p>
        <p type="p">CB2:突觸</p>
        <p type="p">CB3:突觸</p>
        <p type="p">CB4:突觸</p>
        <p type="p">P1:激勵函數</p>
        <p type="p">P2:激勵函數</p>
        <p type="p">S1:層</p>
        <p type="p">S2:層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2105" publication-number="202623722">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623722</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105316</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>衣料用構件之製造方法</chinese-title>
        <english-title>METHOD FOR PRODUCING MEMBER FOR GARMENT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201901120260308B">A41D31/02</main-classification>
        <further-classification edition="200601120260308B">A41C3/00</further-classification>
        <further-classification edition="201201120260308B">D04H1/4374</further-classification>
        <further-classification edition="200601120260308B">D04H3/16</further-classification>
        <further-classification edition="200601120260308B">B32B5/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商華歌爾股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WACOAL CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>深川直哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKAGAWA, NAOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川村雅樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAMURA, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中小路哲也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAKOJI, TETSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">衣料用構件係使用熔噴法，並在基材上於常壓條件下以立體方式堆疊樹脂纖維，且具有以立體方式堆疊樹脂纖維於厚度方向的構造。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A member for a garment is a member prepared by using the melt blow method to deposit resin fibers in a three dimensional arrangement on a substrate under normal pressure conditions, and has a structure in which the resin fibers are deposited three dimensionally in the thickness direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">46:基材固持部</p>
        <p type="p">50:基材</p>
        <p type="p">50A,50B:基材</p>
        <p type="p">51:表面</p>
        <p type="p">52:孔部</p>
        <p type="p">53:基台部</p>
        <p type="p">54:堆疊面部</p>
        <p type="p">55:連結部</p>
        <p type="p">200:衣料用構件</p>
        <p type="p">F:樹脂纖維</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2106" publication-number="202623814">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623814</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105334</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療真菌感染之化合物及方法</chinese-title>
        <english-title>COMPOUNDS AND METHODS FOR TREATING FUNGAL INFECTIONS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">A61K31/661</main-classification>
        <further-classification edition="200601120260303B">A61K9/00</further-classification>
        <further-classification edition="200601120260303B">A61P31/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商巴塞利亞阿爾斯維爾藥業國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASILEA PHARMACEUTICA INTERNATIONAL AG, ALLSCHWIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛雷　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GREY, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布雷坦　傑森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRITTAIN, JASON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍吉斯　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HODGES, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供用於治療真菌感染及疾病的組合物及其使用方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are compositions and methods of use thereof for the treatment of fungal infections and diseases.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2107" publication-number="202623801">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623801</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105335</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>含有雜環化合物之經口醫藥組合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">A61K31/496</main-classification>
        <further-classification edition="200601120260305B">A61K9/20</further-classification>
        <further-classification edition="200601120260305B">A61K9/28</further-classification>
        <further-classification edition="200601120260305B">A61P25/00</further-classification>
        <further-classification edition="200601120260305B">A61K31/381</further-classification>
        <further-classification edition="200601120260305B">A61K31/075</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大塚製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKA PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉村元靖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIMURA, MOTOYASU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤井拓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJII, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鎌田直興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMADA, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>冨樫亮平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOGASHI, RYOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>⻘野留太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AONO, RYUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王新宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, XINYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可防止有效成分之初期之過量釋出，且可長時間以治療有效量持續釋出該有效成分之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2108" publication-number="202624022">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624022</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105336</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>液體排出裝置、液體排出方法及物品的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">B41J2/175</main-classification>
        <further-classification edition="200601120260303B">B41J2/18</further-classification>
        <further-classification edition="200601120260303B">B41J2/01</further-classification>
        <further-classification edition="200601120260303B">B41J2/195</further-classification>
        <further-classification edition="200601120260303B">B41J2/17</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANON KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>志岐美佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIKI, MIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤村秀彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIMURA, HIDEHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>関谷任史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKITANI, TADASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飯村晶子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IIMURA, AKIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口岳人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, TAKEHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>磯川友邦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISOKAWA, TOMOKUNI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浮世典孝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UKIYO, NORITAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]需要一種在具備用於調整墨的黏度的加熱部的液體排出裝置中，能夠穩定地持續排出的方法。  &lt;br/&gt;　　[解決手段]一種液體排出裝置，其中，所述液體排出裝置具備沿著墨循環地流動的方向依次連接有第一容器、脫氣模組、第一頭單元的第一環流路，在所述第一頭單元，沿著墨流動的方向依次配置有第二容器及排出頭，連接有對儲存於所述第二容器的墨進行加熱的加熱部，對由所述加熱部加熱後的墨中的未被所述排出頭排出的墨進行冷卻，使冷卻後的所述墨流入所述脫氣模組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第一容器</p>
        <p type="p">2:第二容器</p>
        <p type="p">3:排出頭</p>
        <p type="p">4:加熱部</p>
        <p type="p">5:第一流路</p>
        <p type="p">6:脫氣模組</p>
        <p type="p">7:液體排出單元</p>
        <p type="p">8:主容器</p>
        <p type="p">9:第二流路</p>
        <p type="p">P1:第一泵</p>
        <p type="p">P2:第二泵</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2109" publication-number="202624648">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624648</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105352</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>氣體基元基板</chinese-title>
        <english-title>GAS-PRIMITIVE SUBSTRATE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">F16K27/00</main-classification>
        <further-classification edition="200601120260304B">F16L41/02</further-classification>
        <further-classification edition="200601120260304B">C23C16/455</further-classification>
        <further-classification edition="200601120260304B">F17D1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯圖姆夫　約翰　福爾登</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STUMPF, JOHN FOLDEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龍　達米恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LONG, DAMIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中島　諾曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKASHIMA, NORMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李瑟　卡爾　費德瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEESER, KARL FREDERICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一實施例中，被揭露的儀器係用於一氣體輸送盒之中的至少一氣體基元基板。每一該至少一氣體基元基板具有將安裝一氣體輸送元件於其上的至少一位置。該至少一位置具有形成於該氣體基元基板的主體之中的至少一氣體輸送元件輸入埠及一氣體輸送元件出口埠。至少一第一對搪孔包含分別形成於該氣體輸送元件的位置的一上游側及一下游側的一氣體流路徑。其他儀器及系統亦加以揭露。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In one embodiment, the disclosed apparatus is at least one gas-primitive substrate for use in a gas-delivery box. Each of the at least one gas-primitive substrates has at least one location on which a gas-delivery component is to be mounted. The at least one location has at least a gas-delivery component inlet port and a gas-delivery component outlet port formed within a body of the gas-primitive substrate. At least one first pair of bore holes comprising a gas-flow path is formed on an upstream side and a downstream side, respectively, of the location of the gas-delivery component. Other apparatuses and systems are disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">209:吹掃閥</p>
        <p type="p">213:質量流控制器入口閥</p>
        <p type="p">223:防護警告標示(LOTO)閥</p>
        <p type="p">225:氣體接頭元件</p>
        <p type="p">300:設施入口基元基板</p>
        <p type="p">303:調節器</p>
        <p type="p">305:轉換器</p>
        <p type="p">307:濾器</p>
        <p type="p">309:氣體分流埠</p>
        <p type="p">317:出口埠</p>
        <p type="p">400:立體圖</p>
        <p type="p">401:基板安裝孔</p>
        <p type="p">403:氣體輸送元件安裝孔</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2110" publication-number="202625145">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625145</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105355</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>像素電路與像素電路的驅動方法</chinese-title>
        <english-title>PIXEL CIRCUIT AND DRIVING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260313B">G09G3/3233</main-classification>
        <further-classification edition="201601120260313B">G09G3/3291</further-classification>
        <further-classification edition="202501120260313B">H10D30/67</further-classification>
        <further-classification edition="202301120260313B">H10K59/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹科學園區新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉彥緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, YEN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林煒力</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEI-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種像素電路與其驅動方法。像素電路包括電容器、重置電路、寫入電路、驅動電路以及發光二極體。電容器耦接至一節點。重置電路受控於重置訊號，用以依據參考電壓重置節點上的電壓。寫入電路受控於寫入訊號，用以將灰階電壓寫入至電容器。驅動電路受控於驅動訊號，用以依據節點的電壓產生驅動電流以驅動發光二極體。重置訊號的致能期間部分地重疊於寫入訊號的致能期間，使灰階電壓寫入至電容器的同時參考電壓施加於節點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a pixel circuit and its driving method. The pixel circuit includes a capacitor, a reset circuit, a writing circuit, a driving circuit, and a light-emitting diode (LED). The capacitor is coupled to a node. The reset circuit is controlled by a reset signal and configured to reset the voltage at the node based on a reference voltage. The writing circuit is controlled by a writing signal and is configured to write a gray-level voltage into the capacitor. The driving circuit is controlled by a driving signal and is configured to generate a driving current to drive the LED based on the voltage of the node. The enabling period of the reset signal partially overlaps with the enabling period of the writing signal, allowing the reference voltage to be applied to the node while the gray-level voltage is written to the capacitor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">310,320,330,341,342:致能期間</p>
        <p type="p">351:第一期間</p>
        <p type="p">352:第二期間</p>
        <p type="p">EM:驅動訊號</p>
        <p type="p">RS:重置訊號</p>
        <p type="p">WR:寫入訊號</p>
        <p type="p">Vsig:灰階電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2111" publication-number="202625146">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625146</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105356</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>像素電路與像素電路的驅動方法</chinese-title>
        <english-title>PIXEL CIRCUIT AND DRIVING METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201601120260313B">G09G3/3233</main-classification>
        <further-classification edition="201601120260313B">G09G3/3291</further-classification>
        <further-classification edition="202501120260313B">H10D30/67</further-classification>
        <further-classification edition="202301120260313B">H10K59/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹科學園區新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉彥緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, YEN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林煒力</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEI-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種像素電路與其驅動方法。像素電路包括電容器、重置電路、寫入電路、驅動電路以及發光二極體。電容器耦接至一節點。重置電路受控於重置訊號，用以依據參考電壓重置節點上的電壓。寫入電路受控於寫入訊號，用以將灰階電壓寫入至電容器。驅動電路受控於驅動訊號，用以依據節點的電壓產生驅動電流以驅動發光二極體。重置訊號的致能期間部分地重疊於寫入訊號的致能期間，使灰階電壓寫入至電容器的同時參考電壓施加於節點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a pixel circuit and its driving method. The pixel circuit includes a capacitor, a reset circuit, a writing circuit, a driving circuit, and a light-emitting diode (LED). The capacitor is coupled to a node. The reset circuit is controlled by a reset signal and configured to reset the voltage at the node based on a reference voltage. The writing circuit is controlled by a writing signal and is configured to write a gray-level voltage into the capacitor. The driving circuit is controlled by a driving signal and is configured to generate a driving current to drive the LED based on the voltage of the node. The enabling period of the reset signal partially overlaps with the enabling period of the writing signal, allowing the reference voltage to be applied to the node while the gray-level voltage is written to the capacitor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">310,320,330,341,342:致能期間</p>
        <p type="p">351:第一期間</p>
        <p type="p">352:第二期間</p>
        <p type="p">EM:驅動訊號</p>
        <p type="p">RS:重置訊號</p>
        <p type="p">WR:寫入訊號</p>
        <p type="p">Vsig:灰階電壓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2112" publication-number="202625876">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625876</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105379</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基材之接合與去接合之方法</chinese-title>
        <english-title>METHOD FOR THE BONDING AND DEBONDING OF SUBSTRATES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260303B">H10W80/00</main-classification>
        <further-classification edition="202601120260303B">H10P34/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧地利商ＥＶ集團Ｅ塔那有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EV GROUP E. THALLNER GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伯格拉夫　喬根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BURGGRAF, JURGEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威司鮑爾　哈拉德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIESBAUER, HARALD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種經由連接層(4)將產品基材(2)接合至載體基材(5)之方法，其中將可溶層(3)施加於該連接層(4)與該產品基材(2)之間，及其中  &lt;br/&gt;a)該可溶層(3)可因與輻射源之電磁輻射相互作用而溶解，及  &lt;br/&gt;b)該連接層(4)及該載體基材(5)對該電磁輻射係至少主要透明的。  &lt;br/&gt;此外，本發明係關於用於自經由連接層(4)接合至產品基材(2)之載體基材(5)去接合該產品基材(2)之方法，其中一可溶層(3)施加於該連接層(4)與該產品基材(2)之間，及其中  &lt;br/&gt;a)該可溶層(3)係通過與輻射源之電磁輻射相互作用而溶解，及  &lt;br/&gt;b)該連接層(4)及該載體基材(5)對該電磁輻射係至少主要透明的。  &lt;br/&gt;此外，本發明係關於相應之產品基材至載體基材之接合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a method for bonding a product substrate (2) to a carrier substrate (5) via a connection layer (4), wherein a soluble layer (3) is applied between the connection layer (4) and the product substrate (2), and wherein &lt;br/&gt;a) the soluble layer (3) is soluble due to an interaction with an electromagnetic radiation of a radiation source and &lt;br/&gt;b) the connection layer (4) and the carrier substrate (5) are at least predominantly transparent to the electromagnetic radiation. &lt;br/&gt;Furthermore the invention relates to a method for debonding a product substrate (2) from a carrier substrate (5) bonded to the product substrate (2) via a connection layer (4) wherein a soluble layer (3) is applied between the connection layer (4) and the product substrate (2), and wherein &lt;br/&gt;a) the soluble layer (3) is dissolved through an interaction with an electromagnetic radiation of a radiation source, and &lt;br/&gt;b) the connection layer (4) and the carrier substrate (5) are at least predominantly transparent to the electromagnetic radiation. &lt;br/&gt;Furthermore the present invention relates to a corresponding product-substrate-to-carrier-substrate bond.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基材堆疊</p>
        <p type="p">2:產品基材</p>
        <p type="p">3:可溶層</p>
        <p type="p">3o:可溶層之表面</p>
        <p type="p">4:連接層</p>
        <p type="p">5:載體基材</p>
        <p type="p">6:功能單元</p>
        <p type="p">7:凸起結構</p>
        <p type="p">9:雷射</p>
        <p type="p">10:雷射束</p>
        <p type="p">15:經溶解之可溶層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2113" publication-number="202625653">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625653</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105394</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260303B">H10K50/858</main-classification>
        <further-classification edition="202301120260303B">H10K59/12</further-classification>
        <further-classification edition="202301120260303B">H10K59/30</further-classification>
        <further-classification edition="202301120260303B">H10K59/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, YOOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金容玟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YONGMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秉州</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, BYUNG-JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>玄周奉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HYUN, JOO BONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李京鎭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KEONGJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明實施例的顯示裝置可以包含位於基板上的絕緣層。此絕緣層包含置於複數個子像素中的複數個凹部。這些子像素中之第一子像素內所設置的第一凹部之面積大於這些子像素中之第二子像素內所設置的第二凹部之面積。複數個透鏡部件置於此絕緣層上並包含與第一凹部對應的第一透鏡部件和與第二凹部對應的第二透鏡部件。進而，提供一種可改善光提取效率之顯示裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device is disclosed that includes an insulating layer located on a substrate. The insulating layer includes a plurality of concave portions which are located in a plurality of subpixels. An area of a first concave portion disposed in a first subpixel among the plurality of subpixels is larger than an area of a second concave portion disposed in a second subpixel among the plurality of subpixels. A plurality of lens parts are located on the insulating layer, and include a first lens part corresponding to the first concave portion and a second lens part corresponding to the second concave portion. It is possible to provide a display device capable of improving light extraction efficiency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">210:觸控感測器</p>
        <p type="p">220:黑色矩陣</p>
        <p type="p">400:凹部</p>
        <p type="p">PG2:第二像素組</p>
        <p type="p">R:紅色子像素</p>
        <p type="p">G:綠色子像素</p>
        <p type="p">B:藍色子像素</p>
        <p type="p">FD:第一方向</p>
        <p type="p">SD:第二方向</p>
        <p type="p">TD:第三方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2114" publication-number="202624993">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624993</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105408</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>指紋感測系統及其操作方法</chinese-title>
        <english-title>FINGERPRINT SENSING SYSTEM AND OPERATION METHOD THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201301120260303B">G06F21/32</main-classification>
        <further-classification edition="201301120260303B">G06F3/0487</further-classification>
        <further-classification edition="200601120260303B">G06F3/041</further-classification>
        <further-classification edition="201301120260303B">G06F3/0354</further-classification>
        <further-classification edition="200601120260303B">G06F3/03</further-classification>
        <further-classification edition="202201120260303B">G06V40/12</further-classification>
        <further-classification edition="202201120260303B">G06V10/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義隆電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELAN MICROELECTRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹科學工業園區新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡呈新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHENG-SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YEN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃榮壽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, JUNG-SHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昱丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種指紋感測系統，包括一指紋感測器、一控制器及一中央處理單元。該指紋感測器感測指紋以產生多張連續的指紋圖像。該控制器依據該多張連續的指紋圖像的至少其中之一來產生一識別結果，以及依據該多張連續的指紋圖像產生一移動資訊。該中央處理單元用於執行一應用程式及一驅動程式。該驅動程式接收該識別結果以及該移動資訊，並且該中央處理器因應該識別結果啟動該應用程式。該中央處理器因應該移動資訊控制游標的移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fingerprint sensing system includes a fingerprint sensor, a controller and a central processing unit (CPU). The fingerprint sensor senses fingerprints to produce a plurality of sequential fingerprint images. The controller produces an identification result according to at least one of the plurality of sequential fingerprint images, and the controller generates a movement information according to the plurality of sequential fingerprint images. The CPU is used to execute an application program and a driver program. The driver program receives the identification result along with the movement information, and the CPU starts the application program in response to the identification result. The CPU controls a movement of a cursor according to the movement information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:指紋感測系統</p>
        <p type="p">11:指紋感測模組</p>
        <p type="p">111:指紋感測器</p>
        <p type="p">112:控制器</p>
        <p type="p">13:震動感應器</p>
        <p type="p">14:中央處理單元</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2115" publication-number="202624820">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624820</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105415</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>光學成像鏡頭</chinese-title>
        <english-title>OPTICAL IMAGING LENS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260303B">G02B9/12</main-classification>
        <further-classification edition="202101120260303B">G02B7/04</further-classification>
        <further-classification edition="200601120260303B">G02B3/00</further-classification>
        <further-classification edition="200601120260303B">G02B11/06</further-classification>
        <further-classification edition="200601120260303B">G02B13/18</further-classification>
        <further-classification edition="200601120260303B">G02B15/14</further-classification>
        <further-classification edition="200601120260303B">G02B15/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商玉晶光電（廈門）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENIUS ELECTRONIC OPTICAL (XIAMEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>公金輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GONG, JINHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董傳博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONG, CHUANBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張嘉元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JIAYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝宏健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, HUNG-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學成像鏡頭，從物側至像側沿光軸依序包括第一透鏡組、第二透鏡組及第三透鏡組，且第一透鏡組至第三透鏡組中的透鏡各自包括朝向物側且使成像光線通過的物側面及朝向像側且使成像光線通過的像側面。第一透鏡組從物側數來的第一個透鏡具有正屈光率且其物側面的光軸區域為凸面。第二透鏡組包含至少兩片透鏡。第三透鏡組從像側數來的第一個透鏡的像側面的光軸區域為凹面。第三透鏡組從像側數來的第二個透鏡的物側面的光軸區域為凹面且物側面的圓周區域為凸面。當光學成像鏡頭進行變焦時，至少一透鏡組沿光軸朝物側方向或像側方向移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical imaging lens including a first lens group, a second lens group and a third lens group sequentially along an optical axis from an object-side to an image-side is provided. The lens elements in the first lens group to the third lens group each includes an object-side surface facing toward the object-side and allowing imaging rays to pass through as well as an image-side facing toward the image-side and allowing imaging rays to pass through. A lens element of the first lens group in a first order counted from the object-side has a positive refracting power and an optical axis region of the object-side surface is convex. The second lens group includes at least two lens elements. An optical axis region of the image-side surface of a lens element of the third lens group in a first order counted from the image-side is concave. An optical axis region of the object-side surface of a lens element of the third lens group in a second order from the image-side is concave, and a periphery region of the object-side surface is convex. When the optical imaging lens performs zooming, at least one lens group moves along the optical axis toward the object-side or the image-side.</p>
      </isu-abst>
      <representative-img>
        <p type="p">0:光圈</p>
        <p type="p">1:第一透鏡組</p>
        <p type="p">2:第二透鏡組</p>
        <p type="p">3:第三透鏡組</p>
        <p type="p">9:濾光片</p>
        <p type="p">10:光學成像鏡頭</p>
        <p type="p">11:1A透鏡</p>
        <p type="p">12:1B透鏡</p>
        <p type="p">13:1C透鏡</p>
        <p type="p">21:2A透鏡</p>
        <p type="p">22:2B透鏡</p>
        <p type="p">31:3A透鏡</p>
        <p type="p">32:3B透鏡</p>
        <p type="p">95,115,125,135,215,225,315,325:物側面</p>
        <p type="p">96,116,126,136,216,226,316,326:像側面</p>
        <p type="p">99:成像面</p>
        <p type="p">1151,1161,1251,1261,1351,1361,2151,2161,2251,2261,3151,3161,3251,3261:光軸區域</p>
        <p type="p">1153,1163,1253,1263,1353,1363,2153,2163,2253,2263,3153,3163,3253,3263:圓周區域</p>
        <p type="p">A1:物側</p>
        <p type="p">A2:像側</p>
        <p type="p">D1,D2,D3:可調整的空氣間隙</p>
        <p type="p">I:光軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2116" publication-number="202623736">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623736</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105434</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>可折疊遊戲床、用於可折疊遊戲床的構架</chinese-title>
        <english-title>FOLDABLE PLAYARD AND FRAME FOR THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">A47D13/06</main-classification>
        <further-classification edition="200601120260309B">A47D9/00</further-classification>
        <further-classification edition="200601120260309B">A47D7/00</further-classification>
        <further-classification edition="200601120260309B">A47D15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕斯拉　強納森Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PACELLA, JONATHAN M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聖高　納森奈爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAINT, NATHANAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克萊瑪　蘭斯Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CLEMMER, LANCE J</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>包爾斯　派翠克ＪＧ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOWERS, PATRICK JG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種用於可折疊遊戲床的構架，其包括多個腳支承組件，其可旋轉耦接到多個X型構架組件。每個腳支承組件包括一轉角體。該等轉角體包括一上層物安裝套管，且該等X型構架組件包括一或多個上層物支承件。該等上層物安裝套管和該等上層物支承件沿著該構架之該頂部周邊提供多個位置，以牢固耦接並支承一或多個上層物。舉例來說，該構架可支承提供尿布更換台和組體的上層物。該尿布更換台或該組體為可旋轉，以為照護者提供更多儲存空間，或在該上層物維持安置的同時部署及/或儲存該尿布更換台的能力。在另一範例中，該構架可透過嬰兒掛籃配件支承自支撐且可收疊嬰兒掛籃上層物。該嬰兒掛籃上層物提供支承平台，而無需來自該構架或該嬰兒掛籃配件的任何附加結構性支承。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A frame for a foldable playard includes multiple leg support assemblies rotatably coupled to multiple X-frame assemblies. Each leg support assembly includes a corner. The corners include a topper mount socket and the X-frame assemblies include one or more topper supports. The topper mount sockets and the topper supports provide multiple locations along the top periphery of the frame to securely couple and support one or more toppers. For example, the frame may support a topper that provides a changing table and an organizer. The changing table or the organizer is rotatable to provide the caregiver more storage space or the ability to deploy and/or store the changing table while the topper remains installed. In another example, the frame may support a freestanding and collapsible bassinet topper via a bassinet accessory. The bassinet topper provides a support platform without any additional structural support from the frame or the bassinet accessory.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100c:構架；遊戲床構架</p>
        <p type="p">110c:彎曲腳支承組件；腳支承組件</p>
        <p type="p">112:支承腳管</p>
        <p type="p">114:腳座</p>
        <p type="p">151:輪子組件</p>
        <p type="p">170:圓形底段部</p>
        <p type="p">300:軟質件</p>
        <p type="p">302:軟質件頂部；頂部</p>
        <p type="p">304:底層部位</p>
        <p type="p">306:側面部位</p>
        <p type="p">700a:轉角體組件</p>
        <p type="p">800a:尿布更換台上層物；上層物；第二上層物</p>
        <p type="p">810a:構架；上層物構架</p>
        <p type="p">820a:支承腳座；第二支承腳座</p>
        <p type="p">880a:軟質件；上層物軟質件</p>
        <p type="p">890a:支承平台</p>
        <p type="p">900a:嬰兒掛籃上層物；上層物；第二上層物</p>
        <p type="p">910a:構架；上層物構架</p>
        <p type="p">980a:軟質件；嬰兒掛籃上層物軟質件；上層物軟質件</p>
        <p type="p">1000c:可折疊遊戲床；遊戲床</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2117" publication-number="202624949">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624949</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105612</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">G06F3/06</main-classification>
        <further-classification edition="200601120260305B">G06F12/02</further-classification>
        <further-classification edition="200601120260305B">G06F11/08</further-classification>
        <further-classification edition="200601120260305B">G11C16/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史帝辰　桑切斯　坦　梅爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STYCHEN SANCHEZ TAN, MEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PH</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實現一種記憶體系統，其能夠有效率地利用資源。  &lt;br/&gt;控制器將複數個超級區塊中之最大可寫入尺寸作為第1尺寸通知給主機，上述第1尺寸係主機對資料之管理單位之尺寸。上述控制器響應於從上述主機接收到指定具有上述第1尺寸之第1管理單位之一個以上之寫入命令，將屬於上述第1管理單位之資料中能夠寫入第1超級區塊之尺寸即第2尺寸之資料寫入上述第1超級區塊，且將屬於上述第1管理單位之資料中上述第1尺寸與上述第2尺寸之差量即第3尺寸之資料寫入第2超級區塊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:主機</p>
        <p type="p">3:記憶體系統</p>
        <p type="p">SB1,SB3,SB4:超級區塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2118" publication-number="202625559">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625559</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105619</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及半導體記憶裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260304B">H10B43/00</main-classification>
        <further-classification edition="202301120260304B">H10B12/00</further-classification>
        <further-classification edition="202301120260304B">H10B10/00</further-classification>
        <further-classification edition="200601120260304B">G11C8/14</further-classification>
        <further-classification edition="200601120260304B">G11C8/10</further-classification>
        <further-classification edition="200601120260304B">G11C7/18</further-classification>
        <further-classification edition="200601120260304B">G11C5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西本健郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMOTO, TATSURO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之實施形態，係有關於半導體裝置及半導體記憶裝置。  &lt;br/&gt;　　半導體裝置，係具備有：第1基板，係具有第1區域、第2區域、以及在前述第1區域和前述第2區域之間而與前述第1區域和前述第2區域相鄰接之第3區域；和第1電晶體，係被設置於前述第1區域處；和第2電晶體，係被設置於前述第2區域處；和第1溝渠，係於前述第3區域處，而被設置在前述第1基板處；和第1導電層，係被設置在前述第1電晶體之上方、前述第2電晶體之上方以及前述第1溝渠之上方處，並從前述第1區域起而一直連續至前述第2區域處；和第1雜質區域，係被設置在與前述第1溝渠相鄰接之前述第1基板處，並包含有碳。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體裝置</p>
        <p type="p">100:閘極絕緣層</p>
        <p type="p">110:閘極電極</p>
        <p type="p">120:閘極絕緣層</p>
        <p type="p">130:閘極電極</p>
        <p type="p">140:閘極配線</p>
        <p type="p">150:溝渠</p>
        <p type="p">160:雜質區域</p>
        <p type="p">170:雜質區域</p>
        <p type="p">591:基板</p>
        <p type="p">D1:方向</p>
        <p type="p">R1:區域</p>
        <p type="p">R2:區域</p>
        <p type="p">R3:區域</p>
        <p type="p">S1:第1面</p>
        <p type="p">S2:第2面</p>
        <p type="p">TR22-1:電晶體</p>
        <p type="p">TR22-2:電晶體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2119" publication-number="202625627">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625627</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105751</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於具有垂直光發射的多色ＬＥＤ像素單元的系統及方法</chinese-title>
        <english-title>SYSTEMS AND METHODS FOR MULTI-COLOR LED PIXEL UNIT WITH VERTICAL LIGHT EMISSION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260306B">H10F55/00</main-classification>
        <further-classification edition="202501120260306B">H10F55/10</further-classification>
        <further-classification edition="202301120260306B">H10K50/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國大陸商上海顯耀顯示科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JADE BIRD DISPLAY (SHANGHAI) LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐群超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, QUNCHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐慧文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, HUIWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李起鳴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, QIMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種微型多色LED裝置，其包含用於發射一系列色彩之兩個或更多個LED結構。該兩個或更多個LED結構經垂直堆疊以組合來自該兩個或更多個LED結構之光。來自該微型多色LED裝置之光實質上垂直向上發射穿過該等LED結構之各者。在一些實施例中，各LED結構連接至一像素驅動器及/或一共同電極。該等LED結構係透過接合層接合在一起。在一些實施例中，平坦化層圍封該等LED結構之各者或該微型多色LED裝置。在一些實施例中，在該裝置中實施反射層、折射層、微透鏡、間隔件及反射杯結構之一或多者以改良LED發射效率。包括微型三色LED裝置之一陣列之一顯示面板具有一高解析度及一高照明亮度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A micro multi-color LED device includes two or more LED structures for emitting a range of colors. The two or more LED structures are vertically stacked to combine light from the two more LED structures. Light from the micro multi-color LED device is emitted substantially vertically upward through each of the LED structures. In some embodiments, each LED structure is connected to a pixel driver and/or a common electrode. The LED structures are bonded together through bonding layers. In some embodiments, planarization layers enclose each of the LED structures or the micro multi-color LED device. In some embodiments, one or more of reflective layers, refractive layers, micro-lenses, spacers, and reflective cup structures are implemented in the device to improve the LED emission efficiency. A display panel comprising an array of the micro tri-color LED devices has a high resolution and a high illumination brightness.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:單像素三色發光二極體(LED)裝置/三色發光二極體(LED)裝置/微型三色發光二極體(LED)結構/發光二極體(LED)裝置/裝置/微型發光二極體(LED)</p>
        <p type="p">104:基板/支撐基板/半導體基板</p>
        <p type="p">106:驅動器電路/像素驅動器</p>
        <p type="p">108:金屬接合層/接合層</p>
        <p type="p">110:導電層/導電透明層/層</p>
        <p type="p">112:發光二極體(LED)發光層/紅色發光二極體(LED)發光層/底部發光二極體(LED)發光層/底部紅色發光二極體(LED)發光層/發光層</p>
        <p type="p">114:導電層/導電透明層/層/透明電極接觸層</p>
        <p type="p">116:N電極接觸墊</p>
        <p type="p">118:N電極接觸組件</p>
        <p type="p">120:N電極接觸墊</p>
        <p type="p">122:P電極接觸組件/組件/p電極連接結構</p>
        <p type="p">124:P電極接觸組件</p>
        <p type="p">126:P電極接觸墊</p>
        <p type="p">128:導電層/導電透明層/層</p>
        <p type="p">130:發光二極體(LED)發光層/綠色發光二極體(LED)發光層/中間發光二極體(LED)發光層/發光層</p>
        <p type="p">132:導電層/導電透明層/層/透明電極接觸層</p>
        <p type="p">134:導電層/導電透明層/層</p>
        <p type="p">136:發光二極體(LED)發光層/藍色發光二極體(LED)發光層/頂部發光二極體(LED)發光層/發光層/第三發光二極體(LED)發光層/頂部發光層</p>
        <p type="p">138:導電層/導電透明層/層/透明電極接觸層</p>
        <p type="p">140:N電極/頂部電極/頂部電極層</p>
        <p type="p">142:N電極接觸墊/頂部電極/電極</p>
        <p type="p">144:N電極接觸墊/頂部電極/電極</p>
        <p type="p">146:光學隔離結構/反射杯部分</p>
        <p type="p">148:光學隔離結構/反射杯部分</p>
        <p type="p">154:平坦化之絕緣層/經平坦化層</p>
        <p type="p">156:透明接合層/接合層</p>
        <p type="p">158:平坦化之絕緣層/經平坦化層</p>
        <p type="p">160:透明接合層/接合層</p>
        <p type="p">162:平坦化之絕緣層/經平坦化層</p>
        <p type="p">164:延伸部分</p>
        <p type="p">166:延伸部分</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2120" publication-number="202625640">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625640</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105754</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於具有水平光發射的多色ＬＥＤ像素單元的系統及方法</chinese-title>
        <english-title>SYSTEMS AND METHODS FOR MULTI-COLOR LED PIXEL UNIT WITH HORIZONTAL LIGHT EMISSION</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260308B">H10H20/856</main-classification>
        <further-classification edition="202501120260308B">H10D86/00</further-classification>
        <further-classification edition="202301120260308B">H10K59/00</further-classification>
        <further-classification edition="201601120260308B">G09G3/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國大陸商上海顯耀顯示科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JADE BIRD DISPLAY (SHANGHAI) LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐群超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, QUNCHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐慧文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, HUIWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李起鳴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, QIMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種微型多色LED裝置，其包含用於發射一系列色彩之兩個或更多個LED結構。該兩個或更多個LED結構經垂直堆疊以組合來自該兩個或更多個LED結構之光。來自該微型多色LED裝置之光自該等LED結構之各者水平發射且經由一些反射結構向上反射。在一些實施例中，各LED結構連接至一像素驅動器及/或一共同電極。該等LED結構係透過接合層接合在一起。在一些實施例中，平坦化層圍封該等LED結構之各者或該微型多色LED裝置。在一些實施例中，在該裝置中實施反射層、折射層、微透鏡、間隔件及反射杯結構之一或多者以改良LED發射效率。包括微型三色LED裝置之一陣列之一顯示面板具有一高解析度及一高照明亮度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A micro multi-color LED device includes two or more LED structures for emitting a range of colors. The two or more LED structures are vertically stacked to combine light from the two more LED structures. Light from the micro multi-color LED device is emitted horizontally from each of the LED structures and reflected upward via some reflective structures. In some embodiments, each LED structure is connected to a pixel driver and/or a common electrode. The LED structures are bonded together through bonding layers. In some embodiments, planarization layers enclose each of the LED structures or the micro multi-color LED device. In some embodiments, one or more of reflective layers, refractive layers, micro-lenses, spacers, and reflective cup structures are implemented in the device to improve the LED emission efficiency. A display panel comprising an array of the micro tri-color LED devices has a high resolution and a high illumination brightness.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:單像素三色發光二極體(LED)裝置/三色發光二極體(LED)裝置/微型三色發光二極體(LED)結構/發光二極體(LED)裝置/裝置/微型發光二極體(LED)</p>
        <p type="p">104:基板/支撐基板/半導體基板</p>
        <p type="p">106:驅動器電路/像素驅動器</p>
        <p type="p">108:金屬接合層/接合層</p>
        <p type="p">109:反射層</p>
        <p type="p">110:導電層</p>
        <p type="p">112:發光二極體(LED)發光層/紅色發光二極體(LED)發光層/底部發光二極體(LED)發光層/底部紅色發光二極體(LED)發光層/發光層</p>
        <p type="p">114:導電層</p>
        <p type="p">115:反射層</p>
        <p type="p">126:P電極接觸墊</p>
        <p type="p">127:反射層</p>
        <p type="p">128:導電層</p>
        <p type="p">128-1:延伸部分</p>
        <p type="p">130:發光二極體(LED)發光層/綠色發光二極體(LED)發光層/中間綠色發光二極體(LED)發光層/中間發光二極體(LED)發光層/發光層</p>
        <p type="p">132:導電層</p>
        <p type="p">133:反射層</p>
        <p type="p">134:導電層</p>
        <p type="p">134-1:延伸部分</p>
        <p type="p">135:反射層</p>
        <p type="p">136:發光二極體(LED)發光層/藍色發光二極體(LED)發光層/頂部發光二極體(LED)發光層/第三發光二極體(LED)發光層/頂部發光層</p>
        <p type="p">138:導電層/頂部導電層</p>
        <p type="p">140:N電極接觸墊/N電極墊/頂部電極/N電極</p>
        <p type="p">146:光學隔離結構/反射杯部分</p>
        <p type="p">146-1:反射杯</p>
        <p type="p">148:光學隔離結構/反射杯部分</p>
        <p type="p">148-1:反射杯</p>
        <p type="p">152:P電極接觸墊</p>
        <p type="p">156:接合層</p>
        <p type="p">160:接合層</p>
        <p type="p">174:絕緣層</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2121" publication-number="202624797">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624797</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105761</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包括具有二維擴展的光導光學元件的光學系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260304B">G02B5/12</main-classification>
        <further-classification edition="200601120260304B">G02B6/10</further-classification>
        <further-classification edition="200601120260304B">G02B6/24</further-classification>
        <further-classification edition="200601120260304B">G02B6/42</further-classification>
        <further-classification edition="200601120260304B">G02B27/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商魯姆斯有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUMUS LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾森菲爾德　齊翁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EISENFELD, TSION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>切里基　羅寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHRIKI, RONEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖俊龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學系統，包括光導光學元件（LOE），LOE具有第一組相互平行的部分反射表面以及與第一組相互平行的部分反射表面取向不同的第二組相互平行的部分反射表面。兩組部分反射表面均位於一組相互平行的主外表面之間。在耦入位置處引入的圖像照射沿LOE傳播，被第一組部分反射表面朝向第二組部分反射表面重定向，圖像照射在第二組部分反射表面被朝向使用者的眼睛耦出。第一組部分反射表面被實現為位於向眼動箱填充所需圖像而所需的位置處的部分表面。另外地或替選地，第一組部分反射表面的間隔跨LOE的第一區域變化。附加特徵涉及投射儀和部分反射表面的相對取向，以提高緊湊性並且實現各種調整。&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;b&gt;&lt;br/&gt;&lt;/b&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">12:LOE</p>
        <p type="p">14:圖像投射儀(或“POD”)</p>
        <p type="p">15:棱鏡</p>
        <p type="p">16:第一區域</p>
        <p type="p">17、19:部分反射表面</p>
        <p type="p">18:第二區域</p>
        <p type="p">24:主外表面</p>
        <p type="p">26:眼動箱</p>
        <p type="p">28:矩形</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2122" publication-number="202624263">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624263</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105790</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於遞送顆粒蛋白穿過血腦障壁之化合物</chinese-title>
        <english-title>COMPOUNDS FOR THE DELIVERY OF GRANULIN ACROSS THE BLOOD BRAIN BARRIER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260305B">C07K16/18</main-classification>
        <further-classification edition="200601120260305B">C07K14/475</further-classification>
        <further-classification edition="200601120260305B">C07K19/00</further-classification>
        <further-classification edition="200601120260305B">A61K38/16</further-classification>
        <further-classification edition="200601120260305B">A61K39/395</further-classification>
        <further-classification edition="200601120260305B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商美國禮來大藥廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELI LILLY AND COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐法拉杜　歐伯圖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALVARADO, ALBERTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安德魯斯　佛瑞斯特　Ｈ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANDREWS, FOREST H.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴弗　大衛　亞伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DRIVER, DAVID ALBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費洛斯　羅斯　愛德華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FELLOWS, ROSS EDWARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗羅寧　凱倫　珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRONING, KAREN JEAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉拉德　丹尼爾　史考特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIRARD, DANIEL SCOTT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦迪若　佩卓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERDINO, PETRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　亞鳴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YAMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於遞送顆粒蛋白前體、顆粒蛋白前體片段及/或至少一個顆粒蛋白次單元穿過血腦障壁之化合物。本發明提供用於遞送顆粒蛋白前體、顆粒蛋白前體片段及/或至少一個顆粒蛋白次單元穿過血腦障壁之化合物，該等化合物包括顆粒蛋白前體域、TfR1結合域及視情況存在之白蛋白結合域。本發明提供用於遞送野生型或未經修飾之顆粒蛋白前體穿過血腦障壁之化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Compounds for the delivery of progranulin, a progranulin fragment, and/or at least one granulin protein subunit across the blood brain barrier. Compounds for the delivery of progranulin, a progranulin fragment, and/or at least one granulin protein subunit across the blood brain barrier, the compounds including a progranulin domain, a TfR1 binding domain, and optionally an albumin binding domain. Compounds for the delivery of wildtype or unmodified progranulin across the blood brain barrier.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2123" publication-number="202625618">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625618</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105803</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260305B">H10D88/00</main-classification>
        <further-classification edition="202601120260305B">H10B80/00</further-classification>
        <further-classification edition="202601120260305B">H10W70/65</further-classification>
        <further-classification edition="202301120260305B">H10B43/35</further-classification>
        <further-classification edition="202501120260305B">H10D84/85</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大塚靖夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKA, YASUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提高品質。半導體裝置包括：配線基板；第一積層體，包含沿與上下方向相交的寬度方向具有第一寬度的N（N為2以上的整數）個第一板狀部，且N個第一板狀部沿上下方向積層在配線基板的上方；以及第二積層體，包含第二板狀部及M（1以上的整數）個第三板狀部，所述第二板狀部沿寬度方向具有較第一寬度大的第二寬度，且設在第一積層體的上方，所述M個第三板狀部設在第二板狀部的上方，且沿寬度方向具有第一寬度，且第二板狀部及M個第三板狀部沿上下方向積層，第一板狀部包含第一記憶體晶片，第二板狀部包含第二記憶體晶片、及連接於第二記憶體晶片的寬度方向的第一側的第一樹脂層，第三板狀部包含第三記憶體晶片，第一積層體及第二積層體的寬度方向的第一側的相反側即第二側呈階梯狀，第二積層體的第二側的端部較第一積層體的第二側的端部位於第二側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">According to one embodiment, a semiconductor device includes: a wiring substrate; a first laminated body that includes N first plate-shaped portions being laminated in the up-down direction above the wiring substrate; and a second laminated body that includes a second plate-shaped portion provided above the first laminated body and M third plate-shaped portions provided above the second plate-shaped portion, the second plate-shaped portion and the M third plate-shaped portions being laminated in the up-down direction, a second side of the first laminated body and the second laminated body opposite to a first side in a width direction has a stepped shape, and an end portion of the second laminated body on the second side is located closer to the second side than an end portion of the first laminated body on the second side.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:半導體裝置</p>
        <p type="p">25:配線基板</p>
        <p type="p">25a:面</p>
        <p type="p">26a、26b:基板電極</p>
        <p type="p">64:焊球</p>
        <p type="p">65:密封樹脂</p>
        <p type="p">81a、81b:接合線</p>
        <p type="p">401、402:積層體</p>
        <p type="p">401a、402a:端部</p>
        <p type="p">411a、412a、413a:記憶體晶片</p>
        <p type="p">411b、412b、413b:CMOS晶片</p>
        <p type="p">411c、412c、413c:模塑樹脂</p>
        <p type="p">411d、412d、413d:電極墊</p>
        <p type="p">411、412、413:板狀部</p>
        <p type="p">421、422、423:晶片黏結薄膜</p>
        <p type="p">501:單塔結構體</p>
        <p type="p">SP1、SP2:台階面</p>
        <p type="p">X、Y、Z:軸</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2124" publication-number="202623974">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623974</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105843</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板搬送機器人及其控制方法</chinese-title>
        <english-title>SUBSTRATE TRANSPORT ROBOT AND CONTROL METHOD FOR THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260316B">B25J13/08</main-classification>
        <further-classification edition="200601120260316B">B25J19/04</further-classification>
        <further-classification edition="200601120260316B">B25J9/16</further-classification>
        <further-classification edition="200601120260316B">B25J15/00</further-classification>
        <further-classification edition="200601120260316B">B65G49/07</further-classification>
        <further-classification edition="202601120260316B">H10P72/30</further-classification>
        <further-classification edition="201701120260316B">G06T7/30</further-classification>
        <further-classification edition="202601120260316B">H10P72/76</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商川崎重工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASAKI JUKOGYO KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋崎知</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIZAKI, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北野真也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITANO, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金丸亮介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANAMARU, RYOUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下雄大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHITA, KATSUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長澤知也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGASAWA, TOMOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的半導體製造裝置系統係具備基板保持手、拍攝至少半導體製造裝置的構成要素的攝影部、以及依據攝影部所拍攝到的拍攝影像檢測半導體製造裝置的構成要素的異常的控制部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor manufacturing apparatus system of the present invention includes a substrate holding hand, a photographing portion for photographing at least constituting elements of the semiconductor manufacturing apparatus, and a control portion for detecting abnormality in the constituting elements of the semiconductor manufacturing apparatus based on the images photographed by the photographing portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板</p>
        <p type="p">20:收納部</p>
        <p type="p">21:基板載置部</p>
        <p type="p">30:基板保持手</p>
        <p type="p">31:載片</p>
        <p type="p">32:載片支持部</p>
        <p type="p">40:臂部</p>
        <p type="p">41:第一部分</p>
        <p type="p">42:第二部分</p>
        <p type="p">50:升降機構部</p>
        <p type="p">51:升降軸</p>
        <p type="p">60:攝影部</p>
        <p type="p">101:基板搬送機械人</p>
        <p type="p">102:收納容器</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2125" publication-number="202625173">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625173</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105858</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>單端式感應放大器及其操作方法</chinese-title>
        <english-title>SINGLE-ENDED SENSE AMPLIFIERS AND METHODS FOR OPERATING SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G11C7/06</main-classification>
        <further-classification edition="200601120260302B">G11C11/4091</further-classification>
        <further-classification edition="200601120260302B">G11C7/12</further-classification>
        <further-classification edition="202301120260302B">H10B12/00</further-classification>
        <further-classification edition="202501120260302B">H10D62/815</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商安托梅拉公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ATOMERA INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅伊　理查Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROY, RICHARD S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳絲倩</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭建中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一位元線被預充至接地。一鎖存電路的第一及第二節點分別被耦合至接地及一參考電壓。一DRAM位元格被啓動，從而將一DRAM單元電容器耦合至該位元線，並在該位元線上產生一讀取電壓。當該DRAM位元格被啓動，該位元線與該鎖存電路隔離。該第一節點從接地解耦合，然後該位元線耦合至該第一節點，從而在該第一節點上產生該讀取電壓。接着，該第二節點從該參考電壓解耦合，該位元線與該第一節點隔離。該鎖存電路被啓動，以放大該第一及第二節點之間的電壓差，並帶來該第一節點上的讀取資料電壓。該位元線被再耦合至該第一節點，將該讀取資料電壓施加至該位元線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bit line is pre-charged to ground. First and second nodes of a latch are coupled to ground and a reference voltage, respectively. A DRAM bitcell is activated, thereby coupling a DRAM cell capacitor to the bit line, and developing a read voltage on the bit line. The bit line is isolated from the latch when the DRAM bitcell is activated. The first node is decoupled from ground, and the bit line is then coupled to the first node, thereby developing the read voltage on the first node. Then, the second node is de-coupled from the reference voltage, and the bit line is isolated from the first node. The latch is activated, amplifying the voltage difference between the first and second nodes, resulting in a read data voltage on the first node. The bit line is recoupled to the first node, applying the read data voltage to the bit line.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:MTDRAM處理器系統</p>
        <p type="p">101~104:MTDRAM晶片</p>
        <p type="p">101&lt;sub&gt;0&lt;/sub&gt;~104&lt;sub&gt;0&lt;/sub&gt;:MTDRAM單位格</p>
        <p type="p">105:ASIC控制器晶片</p>
        <p type="p">105&lt;sub&gt;0&lt;/sub&gt;:處理器陣列</p>
        <p type="p">111~114:TSVC</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2126" publication-number="202624428">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624428</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105887</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體晶圓之製造方法、硬化體、以及暫時固定組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">C09J4/00</main-classification>
        <further-classification edition="200601120260309B">C09J5/00</further-classification>
        <further-classification edition="202601120260309B">H10P72/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商電化股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENKA COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>内田留智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UCHIDA, TOMETOMO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒井亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAI, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堂本高士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOMOTO, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷川貴子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANIGAWA, TAKAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡辺淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稲葉恵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INABA, MEGUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉田準</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIDA, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種暫時固定組成物，含有下述(A)至(C)：&lt;br/&gt;  (A)含有下述(A-1)及(A-2)之(甲基)丙烯酸酯；&lt;br/&gt;  (A-1)側鏈為碳數18以上之烷基且均聚物之玻璃轉移溫度為-100℃至60℃的單官能(甲基)丙烯酸酯；&lt;br/&gt;  (A-2)多官能(甲基)丙烯酸酯；&lt;br/&gt;  (B)聚異丁烯均聚物及／或聚異丁烯共聚物；&lt;br/&gt;  (C)光自由基聚合起始劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2127" publication-number="202624733">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624733</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105941</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>檢查裝置及檢查方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">G01N21/88</main-classification>
        <further-classification edition="200601120260311B">G01N21/956</further-classification>
        <further-classification edition="202601120260311B">H10P74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商濱松赫德尼古斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMAMATSU PHOTONICS K.K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村共則</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, TOMONORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池村賢一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEMURA, KENICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大高章弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTAKA, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之檢查裝置係對形成有複數個發光元件之樣品進行檢查者，且具備：激發光源，其產生照射至樣品之激發光；分色鏡，其將來自樣品之螢光藉由根據波長使其透過或反射而分離；相機，其拍攝經分色鏡反射之螢光；相機，其拍攝透過分色鏡之螢光；及控制裝置，其基於由相機所獲取之第1螢光圖像、與由相機所獲取之第2螢光圖像導出發光元件之色斑資訊；分色鏡中之透過率及反射率根據波長之變化而變化之波長帶之寬度即邊沿移變寬度，較發光元件之正常螢光光譜之半峰全幅值更寬。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:檢查裝置</p>
        <p type="p">11:吸盤(保持構件)</p>
        <p type="p">12:XY載台</p>
        <p type="p">20:激發光源</p>
        <p type="p">30:光學系統</p>
        <p type="p">31:光纖電纜</p>
        <p type="p">32:導光透鏡</p>
        <p type="p">40:分色鏡</p>
        <p type="p">51:物鏡</p>
        <p type="p">52:Z載台</p>
        <p type="p">60:分色鏡</p>
        <p type="p">71:成像透鏡</p>
        <p type="p">72:成像透鏡</p>
        <p type="p">75:帶通濾波器</p>
        <p type="p">81:相機(第1攝像部)</p>
        <p type="p">82:相機(第2攝像部)</p>
        <p type="p">90:暗箱</p>
        <p type="p">100:控制裝置(處理部)</p>
        <p type="p">110:監視器</p>
        <p type="p">S:樣品(對象物)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2128" publication-number="202625660">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625660</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105971</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>顯示面板及其製作方法、顯示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260304B">H10K59/121</main-classification>
        <further-classification edition="202301120260304B">H10K59/122</further-classification>
        <further-classification edition="202301120260304B">H10K59/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國商京東方科技集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOE TECHNOLOGY GROUP CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國商成都京東方光電科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國商北京京東方技術開發有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張微</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳新桐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, XINTONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董向丹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONG, XIANGDAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王紅麗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HONGLI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示面板及其製作方法、顯示裝置，該顯示面板包括第一區域、第二區域、第三區域、多個子像素、襯底基板、以及位於襯底基板上的無機層、第一隔斷結構和第二隔斷結構，第一隔斷結構包括層疊設置的第一隔離部和第二隔離部，第一隔離部包括相對於第二隔離部的邊緣突出的第一突出部；第二隔斷結構包括層疊設置的第一隔離件和第二隔離件，第一隔離件包括相對於第二隔離件的至少部分邊緣突出的第二突出部；第一隔斷結構和第二隔斷結構均被配置為隔斷發光功能層的至少一層，無機層的位於第一區域的至少部分作為第一隔離部，無機層的位於第三區域的至少部分作為第一隔離件，本揭露提供的顯示面板的第一隔斷結構和第二隔斷結構的結構簡單，並易於製作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">01:顯示面板</p>
        <p type="p">010:無機層</p>
        <p type="p">020:絕緣層/有機層</p>
        <p type="p">021,022:膜層</p>
        <p type="p">10:子像素</p>
        <p type="p">100:發光元件</p>
        <p type="p">110:發光功能層</p>
        <p type="p">111:第一發光層</p>
        <p type="p">112:第二發光層</p>
        <p type="p">113:電荷產生層</p>
        <p type="p">120:第一電極</p>
        <p type="p">130:第二電極</p>
        <p type="p">200:第一隔斷結構</p>
        <p type="p">201:第一突出部</p>
        <p type="p">210:第一隔離部</p>
        <p type="p">220:第二隔離部</p>
        <p type="p">300:第二隔斷結構</p>
        <p type="p">301:第二突出部</p>
        <p type="p">310:第一隔離件</p>
        <p type="p">320:第二隔離件</p>
        <p type="p">400:像素限定圖案</p>
        <p type="p">410:第一開口</p>
        <p type="p">A1:第一區域</p>
        <p type="p">A2:第二區域</p>
        <p type="p">A3:第三區域</p>
        <p type="p">BS:襯底基板</p>
        <p type="p">P0:尺寸</p>
        <p type="p">P1,P2:平均環寬</p>
        <p type="p">N1:連接過孔</p>
        <p type="p">R:發光層</p>
        <p type="p">W1’-W1:線</p>
        <p type="p">Z:方向</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2129" publication-number="202625451">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625451</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105993</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>感測裝置、感測裝置的控制方法及多裝置影像同步系統</chinese-title>
        <english-title>SENSING DEVICE, CONTROL METHOD OF SENSING DEVICE, AND MULTI-DEVICE IMAGE SYNCHRONIZATION SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260309B">H04N23/90</main-classification>
        <further-classification edition="202301120260309B">H04N25/707</further-classification>
        <further-classification edition="202001120260309B">G01S17/894</further-classification>
        <further-classification edition="200601120260309B">G01S7/481</further-classification>
        <further-classification edition="202301120260309B">H04N23/661</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鉅嘉聯合科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIGA-IMAGE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳一帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, I FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開提供一種的感測裝置、感測裝置的控制方法及多裝置影像同步系統。所述感測裝置包括第一感測器以及處理單元。第一感測器經組態以於執行一感測操作的期間產生第一觸發訊號。處理單元接收第一觸發訊號，並依據第一感測器及接收端的感測器類型判定預定延遲時間，且依據第一觸發訊號的輸入訊號極性及接收端的觸發邏輯判定第二觸發訊號的輸入訊號極性；基於預定延遲時間以及對應第二觸發訊號的輸入訊號極性產生第二觸發訊號，並輸出第二觸發訊號至接收端，以致使接收端執行對應的感測操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a sensing device with a programmable trigger signal adjustment function, a control method of the sensing device, and a multi-device image synchronization system. The sensing device includes a first sensor and a processing unit. The first sensor is configured to generate a first trigger signal during a sensing operation. The processing unit receives the first trigger signal, determines a predetermined delay time based on sensor types of the first sensor and a receiver, and determines an input signal polarity of a second trigger signal based on an input signal polarity of the first trigger signal and a trigger logic of the receiver. The processing unit generates the second trigger signal based on the predetermined delay time and the input signal polarity corresponding to the second trigger signal, and outputs the second trigger signal to the receiver to cause the receiver to perform a corresponding sensing operation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S310~S350:步驟</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2130" publication-number="202624950">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624950</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115106008</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於減少非揮發性儲存裝置中的寫入緩衝器大小的系統以及方法</chinese-title>
        <english-title>SYSTEMS AND METHODS FOR REDUCING WRITE BUFFER SIZE IN NON-VOLATILE STORAGE DEVICES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">G06F3/06</main-classification>
        <further-classification edition="201601120260309B">G06F12/08</further-classification>
        <further-classification edition="200601120260309B">G06F12/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍爾斯普　奈傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORSPOOL, NIGEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克拉克　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CLARKE, BRIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">系統可以包含控制器、寫入緩衝器及裝置。裝置可以包含非揮發性記憶體(non-volatile memory；NVM)、第一資料緩衝器及第二資料緩衝器。控制器可以被配置為將資料從寫入緩衝器傳送至第一資料緩衝器及第二資料緩衝器，並確定是否發生電源故障。響應於確定沒有發生電源故障，控制器可以將裝置配置為在第一模式下將儲存在第一資料緩衝器或第二資料緩衝器中的至少一者中的資料編程至NVM。響應於確定發生電源故障，控制器可以將裝置配置為在不同於第一模式的第二模式下將儲存在第一資料緩衝器或第二資料緩衝器中的至少一者中的資料編程至NVM。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system may include a controller, a write buffer, and a device. The device may include a non-volatile memory (NVM), a first data buffer, and a second data buffer. The controller may be configured to transfer data from the write buffer to the first data buffer and the second data buffer and determine whether a power failure occurs. In response to determining that a power failure does not occur, the controller may configure the device to program data stored in at least one of the first data buffer or the second data buffer to the NVM in a first mode. In response to determining that the power failure occurs, the controller may configure the device to program data stored in at least one of the first data buffer or the second data buffer to the NVM in a second mode different from the first mode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">30:主機</p>
        <p type="p">300:SSD(固態硬碟)</p>
        <p type="p">310:DRAM(動態隨機存取記憶體)</p>
        <p type="p">312:寫入緩衝器</p>
        <p type="p">320:控制器SoC(系統單晶片)</p>
        <p type="p">330:記憶體控制器</p>
        <p type="p">340:主機I/F控制器</p>
        <p type="p">350:NAND控制器</p>
        <p type="p">352:電源故障控制</p>
        <p type="p">354:緩衝器控制</p>
        <p type="p">360:命令控制/寫入緩衝器</p>
        <p type="p">370:閃記憶體轉換層(FTL)</p>
        <p type="p">380:NAND陣列</p>
        <p type="p">380-1:NAND子系統/子系統</p>
        <p type="p">380-2:NAND子系統/子系統</p>
        <p type="p">380-N:NAND子系統/子系統</p>
        <p type="p">382-1:NAND</p>
        <p type="p">382-2:NAND</p>
        <p type="p">382-N:NAND</p>
        <p type="p">384-1:編程(P)緩衝器/P-緩衝器</p>
        <p type="p">384-2:編程(P)緩衝器/P-緩衝器</p>
        <p type="p">384-N:編程(P)緩衝器/P-緩衝器</p>
        <p type="p">386-1:附加(A)緩衝器/A-緩衝器</p>
        <p type="p">386-2:附加(A)緩衝器/A-緩衝器</p>
        <p type="p">386-N:附加(A)緩衝器/A-緩衝器</p>
        <p type="p">390:NAND匯流排</p>
        <p type="p">3000:電腦系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2131" publication-number="202625554">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625554</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115106030</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>三維動態隨機存取記憶體裝置、記憶體裝置、及相關的電子系統</chinese-title>
        <english-title>3D DYNAMIC RANDOM-ACCESS MEMORY DEVICE, MEMORY DEVICE, AND RELATED ELECTRONIC SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260302B">H10B12/00</main-classification>
        <further-classification edition="202601120260302B">H10D88/00</further-classification>
        <further-classification edition="202601120260302B">H10W80/00</further-classification>
        <further-classification edition="202601120260302B">H10W20/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商美光科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICRON TECHNOLOGY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>席賽克　艾吉　費瑪　雅遜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIMSEK-EGE, FATMA ARZUM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀佩君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種微電子裝置，其包括一第一微電子裝置結構及附接至該第一微電子裝置結構之一第二微電子裝置結構。該第一微電子裝置結構包括一記憶體陣列區，該記憶體陣列區包括一堆疊結構，該堆疊結構包括與絕緣結構層級垂直交錯之導電結構層級，及在該堆疊結構之橫向末端處之階梯結構。該記憶體陣列區進一步包括記憶體胞元之垂直堆疊，記憶體胞元之該等垂直堆疊之至少一者包括：堆疊電容器結構，各堆疊電容器結構包括由該等絕緣結構層級之至少一層級彼此垂直間隔之電容器結構；電晶體結構，各電晶體結構可操作地耦合至一電容器結構及耦合至該等導電結構層級之該等導電結構之一者；及一導電支柱結構，其垂直延伸穿過該等電晶體結構。該第一微電子裝置進一步包括在該等階梯結構之台階處與該等導電結構層級電連通之導電接觸結構。該第二微電子裝置包括：控制邏輯裝置，其等經組態以實現用於記憶體胞元之該等垂直堆疊之控制操作之至少一部分；導電互連結構，其等垂直延伸穿過一個氧化物材料且與該等導電接觸結構電連通；及一額外導電互連結構，其垂直延伸穿過該氧化物材料且與記憶體胞元之該等垂直堆疊之該至少一者之該導電支柱結構電連通。本發明亦描述相關的微電子裝置、電子系統及方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A microelectronic device comprises a first microelectronic device structure and a second microelectronic device structure attached to the first microelectronic device structure. The first microelectronic device structure comprises a memory array region comprising a stack structure comprising levels of conductive structures vertically alternating with levels of insulative structures, and staircase structures at lateral ends of the stack structure. The memory array region further comprises vertical stacks of memory cells, at least one of the vertical stacks of memory cells comprising stacked capacitor structures, each stacked capacitor structure comprising capacitor structures vertically spaced from each other by at least a level of the levels of insulative structures, transistor structures, each transistor structure operably coupled to a capacitor structure and to one of the conductive structures of the levels of conductive structures, and a conductive pillar structure vertically extending through the transistor structures. The first microelectronic device further comprises conductive contact structures in electrical communication with the levels of conductive structures at steps of the staircase structures. The second microelectronic device comprises control logic devices configured to effectuate at least a portion of control operations for the vertical stacks of memory cells, conductive interconnect structures vertically extending through an oxide material and in electrical communication with the conductive contact structures, and an additional conductive interconnect structure vertically extending through the oxide material and in electrical communication with the conductive pillar structure of the at least one of the vertical stacks of memory cells. Related microelectronic devices, electronic systems, and methods are also described.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:第一基底結構</p>
        <p type="p">104:絕緣結構</p>
        <p type="p">105:陣列區</p>
        <p type="p">112:存取裝置</p>
        <p type="p">120:導電結構</p>
        <p type="p">122:第一導電接觸結構</p>
        <p type="p">124:台階</p>
        <p type="p">130:階梯結構</p>
        <p type="p">150:周邊區</p>
        <p type="p">158:多工器</p>
        <p type="p">162:電晶體</p>
        <p type="p">174:第一氧化物材料</p>
        <p type="p">201:隔離溝槽</p>
        <p type="p">202:第二基底結構</p>
        <p type="p">203:導電摻雜區</p>
        <p type="p">204:閘極結構</p>
        <p type="p">205:電晶體結構</p>
        <p type="p">206:導電互連結構</p>
        <p type="p">207:佈線結構</p>
        <p type="p">208:墊結構</p>
        <p type="p">209:互連結構</p>
        <p type="p">210:感測放大器(SA)區</p>
        <p type="p">211:絕緣材料</p>
        <p type="p">220:第一導電接觸出口區</p>
        <p type="p">230:第二導電接觸出口區</p>
        <p type="p">240:第二氧化物材料</p>
        <p type="p">272:第四導電墊結構</p>
        <p type="p">274:第四導電互連結構</p>
        <p type="p">275:線區</p>
        <p type="p">276:第五導電墊結構</p>
        <p type="p">278:導電線結構</p>
        <p type="p">280:第六導電墊結構</p>
        <p type="p">282:導電著陸墊結構</p>
        <p type="p">322:第三氧化物材料</p>
        <p type="p">330:第二介電材料</p>
        <p type="p">342:導電佈線結構</p>
        <p type="p">344:第七導電互連結構</p>
        <p type="p">350:微電子裝置結構總成</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2132" publication-number="202625193">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625193</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115106054</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>記憶體系統及記憶體控制方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260302B">G11C16/26</main-classification>
        <further-classification edition="200601120260302B">G11C11/56</further-classification>
        <further-classification edition="200601120260302B">G11C16/10</further-classification>
        <further-classification edition="201601120260302B">G06F12/0802</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤川尚志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIKAWA, HISASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">實施形態，係提供一種成為能夠進行高速之讀取的記憶體系統以及記憶體控制方法。  &lt;br/&gt;　　實施形態之記憶體系統，係具備有：記憶體，係能夠在複數之記憶體胞之各者處而分別保持2位元以上之位元數的資料；和記憶體控制器，係進行將資料對於前述各記憶體胞作寫入之控制、和將被寫入至前述各記憶體胞中之資料作讀出之控制，前述記憶體控制器，若是從主機而收訊第1指令，則係將成為了前述第1指令之對象的資料從前述記憶體而讀出，並進行以與較與所讀出的資料之寫入時之寫入方式相對應之位元數而更小的位元數相對應之寫入方式來將前述所讀出的資料寫入至前述記憶體中之第1寫入控制，若是從前述主機而收訊針對成為了前述第1指令之對象的資料之讀取指令，則將藉由前述第1寫入控制而被寫入至了前述記憶體中之資料讀出，並傳輸至前述主機處。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2133" publication-number="202624646">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624646</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115106063</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>托架式閥配置</chinese-title>
        <english-title>POPPET-STYLE VALVE ARRANGEMENTS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">F16K1/46</main-classification>
        <further-classification edition="200601120260309B">F16K17/06</further-classification>
        <further-classification edition="200601120260309B">F16K1/42</further-classification>
        <further-classification edition="200601120260309B">F16K1/36</further-classification>
        <further-classification edition="200601120260309B">F16K15/02</further-classification>
        <further-classification edition="200601120260309B">F16K17/00</further-classification>
        <further-classification edition="200601120260309B">F16K27/02</further-classification>
        <further-classification edition="200601120260309B">F16K39/02</further-classification>
        <further-classification edition="200601120260309B">G05D16/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商世偉洛克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SWAGELOK COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕克斯　大衛　Ｊ　Ｏ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARKES, DAVID JOHN OWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IM</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐文　巴里　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IRVINE, BARRY CANNELL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IM</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史帝芬森　格雷厄姆　Ｈ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEPHENSON, GRAHAM HARWOOD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IM</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布雷加齊　查爾斯　Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BREGAZZI, CHARLES KNEEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IM</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於一閥之底座載體次總成包括：一環形底座載體主體，該環形底座載體主體包括一徑向延伸至一中心通路中之一環形突出部；及一環形塑膠密封環，該環形塑膠密封環包覆模製至該環形突出部上，其中該環形塑膠密封環界定一底座密封件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A seat carrier subassembly for a valve includes an annular seat carrier body including an annular projection extending radially into a central passage, and an annular plastic seal ring over-molded onto the annular projection, with the annular plastic seal ring defining a seat seal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2000-3:活塞感測非通氣總成</p>
        <p type="p">2009:細長螺栓</p>
        <p type="p">2100:減壓調節器閥主體模組</p>
        <p type="p">2110:閥主體外殼塊</p>
        <p type="p">2118:擴大的上部凹部</p>
        <p type="p">2120:插塞</p>
        <p type="p">2130:減壓托架</p>
        <p type="p">2140:底座</p>
        <p type="p">2170:導環</p>
        <p type="p">2200:活塞模組/模組總成塊</p>
        <p type="p">2210:活塞配接器塊</p>
        <p type="p">2220:活塞感測部件</p>
        <p type="p">2400:彈簧負載模組/模組總成塊</p>
        <p type="p">2410:負載塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2134" publication-number="202624406">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624406</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115106126</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物、預浸體、附樹脂之薄膜、附樹脂之金屬箔、覆金屬積層板及配線板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260310B">C08L71/12</main-classification>
        <further-classification edition="200601120260310B">C08K5/3415</further-classification>
        <further-classification edition="200601120260310B">C08K9/06</further-classification>
        <further-classification edition="200601120260310B">C08J5/24</further-classification>
        <further-classification edition="200601120260310B">B32B27/18</further-classification>
        <further-classification edition="200601120260310B">B32B27/28</further-classification>
        <further-classification edition="200601120260310B">B32B15/08</further-classification>
        <further-classification edition="200601120260310B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下知識產權經營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅原大明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UMEHARA, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤宏典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, HIROSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之一面向是一種樹脂組成物，含有：聚苯醚化合物，於末端具有碳-碳不飽和雙鍵；馬來醯亞胺化合物(A)，於分子中具有茚烷結構；及無機充填材。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2135" publication-number="202625308">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625308</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115106145</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>輸入／輸出連接器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">H01R13/24</main-classification>
        <further-classification edition="201101120260309B">H01R12/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商莫仕有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOLEX, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉裕達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YU-DA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　烈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龔　智超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GONG, ZHI CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯泰爾　多明尼克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEIER, DOMINIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周　其傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEW, CHEE-KIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯柯維爾　安納丹妮爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCOVILL, ANNA DANIELLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種輸入/輸出（I/O）連接器包括至少一個柔性遮罩件。所述柔性遮罩件包括：一細長的本體，具有界定一第一細長的遮罩邊緣和一第二細長的遮罩邊緣的多個缺口區域；多個連接部，設在所述第一細長的遮罩邊緣和所述第二細長的遮罩邊緣之間；以及多個彈片，從所述第一細長的遮罩邊緣和所述第二細長的遮罩邊緣中的至少一個突伸出。所述多個連接部的一第一子集相對所述細長的本體的一平坦表面抬高，而所述多個連接部的一第二子集相對所述細長的本體的平坦表面降低。所述多個連接部的一部分包括界定與所述細長的本體的平坦表面偏離的一通道的片體，其中，一相應的端子位於所述通道中。所述相應的端子可包括一接地端子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">106:薄片體元件</p>
        <p type="p">109:端子</p>
        <p type="p">118:後端子</p>
        <p type="p">121:第一排</p>
        <p type="p">124:第二排</p>
        <p type="p">127a:第一端子支援結構</p>
        <p type="p">127b:第二端子支援結構</p>
        <p type="p">130a:第一柔性遮罩件</p>
        <p type="p">130b:第二柔性遮罩件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2136" publication-number="202624061">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624061</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115106148</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>兒童車的車架的防釋鎖機構和兒童車</chinese-title>
        <english-title>CHILD STROLLER AND ANTI-UNLOCKING MECHANISM OF FRAME THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">B62B9/08</main-classification>
        <further-classification edition="200601120260309B">B62B5/04</further-classification>
        <further-classification edition="200601120260309B">B62B9/12</further-classification>
        <further-classification edition="200601120260309B">B62B9/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡艷戈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, YANGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種兒童車的車架的防釋鎖機構和兒童車，所述車架能夠收合和展開, 所述車架的車手上設有釋鎖拉柄和防釋鎖機構，所述釋鎖拉柄能夠被驅動而使所述車架收合，所述防釋鎖機構設置成能夠阻擋所述釋鎖拉柄被驅動，從而防止車架被收合。根據本發明的防釋鎖機構能夠防止車架的關節意外釋鎖，從而防止車架意外收合，並能夠快速地安裝至車架或拆離車架。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an anti-unlocking mechanism for a frame of a child stroller and a child stroller. The frame can be folded and unfolded, a handlebar of the frame is provided with an unlocking handle and the anti-unlocking mechanism, the unlocking handle can be driven to fold the frame, and the anti-unlocking mechanism is arranged to be able to block the unlocking handle from being driven, thereby preventing the frame from being folded. The anti-unlocking mechanism according to the disclosure can prevent joints of the frame from being accidentally unlocked, thereby preventing the frame from being accidentally folded, and can be quickly installed to or detached from the frame.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:車架</p>
        <p type="p">100:防釋鎖機構</p>
        <p type="p">200:車手</p>
        <p type="p">300:釋鎖拉柄</p>
        <p type="p">400:站立板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2137" publication-number="202625810">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625810</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115106178</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>整合石墨烯與ＢＥＯＬ的互連結構</chinese-title>
        <english-title>GRAPHENE BEOL INTEGRATION INTERCONNECTION STRUCTURES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260310B">H10W20/40</main-classification>
        <further-classification edition="202601120260310B">H10W20/43</further-classification>
        <further-classification edition="202601120260310B">H10W20/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商迪斯尼２Ｄ公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DESTINATION 2D INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舒格拉夫　克勞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHUEGRAF, KLAUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴納吉　考斯塔夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANERJEE, KAUSTAV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克朗奎斯特　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CRONQUIST, BRIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐宏昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉俞佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種互連結構，包括：第一BEOL（Back-End-Of-Line後端製程）階層，該BEOL階層包括第一MLG（Multi-Layer Graphene多層石墨烯）層，該第一MLG層包括至少一個含MLG材料的第一線結構；第一隔離層，包括電性隔離材料，且設置於該至少一個含MLG材料的第一線結構上方及旁邊；第二BEOL層，包括設置在第一隔離層上方的第二MLG層（包括MLG材料）；連接路徑，用於將第一MLG層電性連接到第二MLG層；以及至少一個通孔，具有鋸齒狀邊緣。本發明可減輕未對準所產生的影響並提供通孔到線/接點的低電阻。該連接路徑包括至少一個通孔之一，該MLG材料的至少一個第一線結構的寬度大於至少一個通孔之一的直徑，並且其中兩個MLG層都是經過插層摻雜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An interconnection structure, including: a first BEOL(Back-End-Of-Line) level which includes a first MLG(Multi-Layer Graphene) layer which includes at least one first line structure of MLG material; and a first isolation layer which includes an electrically isolating material and is disposed above and beside the at least one first line structure of MLG material; a second BEOL level which includes a second MLG layer(includes MLG material) disposed above the first isolation layer; a connection path electrically connecting first MLG layer to second MLG layer; and at least one via with serrated edges mitigating misalignment impacts and providing low via to line contact resistance, where the connection path includes one of the at least one via, where a width of the at least one first line structure of MLG material is greater than a diameter of the one of the at least one via, and where both MLG layers are intercalation doped.</p>
      </isu-abst>
      <representative-img>
        <p type="p">520:通孔金屬</p>
        <p type="p">525:接點/通孔</p>
        <p type="p">L:邊緣長度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2138" publication-number="202623724">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623724</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115106198</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>鞋面和鞋類物品</chinese-title>
        <english-title>SHOE UPPER AND ARTICLE OF FOOTWEAR</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">A43B23/02</main-classification>
        <further-classification edition="200601120260312B">A43B23/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商史柯契爾　ＩＩ　美國股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SKECHERS U.S.A., INC. II</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格林伯格　查斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GREENBERG, CHASE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊　豐陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, FRANK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堤佳　強生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TJA, JOHNSON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ID</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭碗玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, WANLING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請實施例提供一種鞋面和鞋子，其中，鞋面包括：鞋幫，具有相連接的鞋幫頭部和鞋幫側部，鞋幫側部的內表面設置有限位部；鞋舌，具有相對設置的第一部分和第二部分，鞋舌的第一部分固定連接於鞋幫頭部；彈性帶，用於連接鞋舌的第二部分和鞋幫側部，彈性帶的至少部分位於限位部和鞋幫側部的內表面之間，在彈性帶的作用下，鞋舌的第二部分與限位部限位配合。本申請實施例的技術方案可以避免在使用者脫掉鞋子後鞋舌下降，使鞋舌與鞋墊之間可以保持足夠的距離，從而避免在使用者穿鞋過程中由於鞋舌與腳部產生干涉而阻礙腳部的伸入，無需使用者手動操作，進而有效提升使用者的穿鞋效率，提升使用者的體驗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present application provides a shoe upper and a shoe having the same, characterized in that the shoe upper comprises a shoe upper having a vamp toe portion and a vamp side portion that are connected to each other, wherein the inner surface of the vamp side portion is provided with a position limiting component; a tongue having a first portion and a second portion that are oppositely disposed, wherein the first portion of the tongue is affixed to the vamp toe portion; an elastic band configured to connect the second portion of the tongue with the vamp side portion, wherein at least part of the elastic band is located between the position limiting component and the inner surface of the vamp side portion, and the second portion of the tongue is in limiting mating with the position limiting component under the action of the elastic band. According to the technical scheme of the embodiments of the present application, the tongue can be prevented from dropping after the user takes off the shoe, so that a sufficient distance can be kept between the tongue and the insole. This avoids obstructing the insertion of the foot due to interference between the tongue and the foot when the user puts on the shoe. The insertion does not require any manual operation, thus effectively improving the efficiency of putting on the shoe by the user and improving the user’s experience.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:鞋面</p>
        <p type="p">20:鞋子</p>
        <p type="p">201:鞋底</p>
        <p type="p">300:彈性帶</p>
        <p type="p">310:縫線</p>
        <p type="p">500:開口</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2139" publication-number="202624433">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624433</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115106208</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>接著劑組成物、接著膜以及連接體的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201801120260313B">C09J7/35</main-classification>
        <further-classification edition="201801120260313B">C09J7/20</further-classification>
        <further-classification edition="202601120260313B">H10W72/30</further-classification>
        <further-classification edition="200601120260313B">B32B38/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏川昌典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATSUKAWA, MASANORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大久保恵介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHKUBO, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上田麻未</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEDA, ASAMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示的一方面的接著劑組成物用於半導體晶片與撓性印刷電路基板的接著，且130℃下的熔融黏度為3500 Pa·s～20000 Pa·s。本揭示的一方面的接著膜包括：寬度100 mm以下的帶狀的載體膜；以及以沿載體膜的長邊方向排列的方式配置於載體膜上的多個接著劑片，並且接著劑片包含所述接著劑組成物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">3p:接著劑片(接著劑組成物)</p>
        <p type="p">50:模組(連接體)</p>
        <p type="p">C:半導體晶片</p>
        <p type="p">C1:半導體晶片的表面</p>
        <p type="p">S:撓性印刷電路基板</p>
        <p type="p">S1:撓性印刷電路基板的前端部</p>
        <p type="p">S2:撓性印刷電路基板的上表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2140" publication-number="202624060">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624060</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115106219</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>車架及推車</chinese-title>
        <english-title>FRAME AND STROLLER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">B62B7/08</main-classification>
        <further-classification edition="200601120260309B">B62B9/12</further-classification>
        <further-classification edition="200601120260309B">B62B9/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳海濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HAITAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐頌雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種車架及推車，推車包括車架。第一輪架，包括第一支撐組件；第二輪架，包括第二支撐組件；推杆架，包括推杆組件；以及收合機構，包括連動組件和轉動軸。所述第一支撐組件、所述第二支撐組件和所述推杆組件通過所述轉動軸樞接，所述第一支撐組件和所述第二支撐組件能通過所述連動組件相對於所述推杆組件轉動收合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a frame and a stroller. The stroller includes the frame. The frame includes: a first wheel frame including a first support assembly; a second wheel frame including a second support assembly; a push rod frame including a push rod assembly; and a folding mechanism including a linkage assembly and a rotating shaft. The first support assembly and the second support assembly, and the push rod assembly are pivotally connected by the rotating shaft. The first support assembly and the second support assembly are capable of being rotated and folded relative to the push rod assembly by the linkage assembly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:車架</p>
        <p type="p">2:座椅組件</p>
        <p type="p">3:座椅鎖合裝置</p>
        <p type="p">31:座椅架</p>
        <p type="p">32:連接座</p>
        <p type="p">33:活動座</p>
        <p type="p">100:第一輪架</p>
        <p type="p">110:第一支撐組件</p>
        <p type="p">120:第一連接杆</p>
        <p type="p">200:第二輪架</p>
        <p type="p">210:第二支撐組件</p>
        <p type="p">220:第二連接杆</p>
        <p type="p">410:推杆組件</p>
        <p type="p">411:第一推杆</p>
        <p type="p">412:第二推杆</p>
        <p type="p">413:樞接座</p>
        <p type="p">420:握杆組件</p>
        <p type="p">421:連接套筒</p>
        <p type="p">423:握把</p>
        <p type="p">424:封閉蓋</p>
        <p type="p">800:車輪組件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2141" publication-number="202625584">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625584</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115106311</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積體電路裝置</chinese-title>
        <english-title>INTEGRATED CIRCUIT DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260313B">H10D30/60</main-classification>
        <further-classification edition="202501120260313B">H10D62/17</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘋果公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉格凡　普瑞文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAGHAVAN, PRAVEEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章典</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示實施奈米片電晶體之各種結構。各種結構包括在電晶體裝置內具有不同寬度的奈米片電晶體。電晶體裝置內之奈米片電晶體的寬度的變化允許電晶體裝置之輸入級及輸出級的不同設計，這可改善電晶體裝置的功率利用率及性能。在一些情況下，輸入級具有比輸出級中之奈米片電晶體更小寬度之奈米片鰭的奈米片電晶體。奈米片電晶體寬度的變化亦可藉由奈米片鰭的合併而在輸入級或輸出級內實施。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various structures that implement nanosheet transistors are disclosed. The various structures include nanosheet transistors with different widths inside a transistor device. Variation of the width of nanosheet transistors within a transistor device allows for different designs of the input stage and the output stage of the transistor device that may improve power utilization and performance of the transistor device. In some instances, the input stage has nanosheet transistors with smaller width nanosheet fins than nanosheet transistors in the output stage. Variations in nanosheet transistor width may also be implemented within the input stage or the output stage by merging of nanosheet fins.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:電晶體裝置；裝置</p>
        <p type="p">502:閘極節距方向</p>
        <p type="p">504:單元高度方向</p>
        <p type="p">506A,506B:標準單元高度</p>
        <p type="p">510A,510B,510C:啟用閘極結構</p>
        <p type="p">520A,520B,520C:虛置閘極結構</p>
        <p type="p">530A,530B,530C,530D,530E,530F,530G:通道區域</p>
        <p type="p">540A,540B,540C,540D,540E,540F,540G:奈米片鰭</p>
        <p type="p">542A,542B,542C,542D,:寬度</p>
        <p type="p">550A,550B,550C,550D,550E,550F,550G,550H,550I,550J,550K:啟用閘極</p>
        <p type="p">560:輸入級</p>
        <p type="p">570:輸出級</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2142" publication-number="202625392">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625392</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115106354</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有可調濾波器之射頻系統</chinese-title>
        <english-title>RADIO FREQUENCY SYSTEMS WITH TUNABLE FILTER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260310B">H04B1/18</main-classification>
        <further-classification edition="200601120260310B">H03H7/12</further-classification>
        <further-classification edition="200601120260310B">H04B1/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商天工方案公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SKYWORKS SOLUTIONS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃羅茲夏克　史堤芬尼　理查　馬利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WLOCZYSIAK, STEPHANE RICHARD MARIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供具有可調濾波器之射頻(RF)系統。在特定實施例中，一RF系統包含經組態以處理一第一通信標準之一第一頻帶及一第二通信標準之一第二頻帶之一第一RF處理電路。該第一頻帶及該第二頻帶係頻率接近及/或部分頻率重疊。該第一RF處理電路包含一可調濾波器，其用於改變該第一RF處理電路之頻寬以增強該第一RF處理電路對一第三頻帶之阻斷或干擾信號之穩健性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Radio frequency (RF) systems with tunable filters are provided herein. In certain embodiments, an RF system includes a first RF processing circuit configured to process a first frequency band of a first communication standard and a second frequency band of a second communication standard. The first frequency band and the second frequency band are close in frequency and/or partially overlapping in frequency. The first RF processing circuit includes a tunable filter for changing the bandwidth of the first RF processing circuit to enhance the robustness of the first RF processing circuit to blocker or jammer signals of a third frequency band.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:收發器</p>
        <p type="p">51:第一天線</p>
        <p type="p">52:第二天線</p>
        <p type="p">55:前端電路</p>
        <p type="p">61:第一射頻(RF)信號處理電路</p>
        <p type="p">62:第二RF信號處理電路</p>
        <p type="p">63:第三RF信號處理電路</p>
        <p type="p">64:雙工器</p>
        <p type="p">67:可調濾波器</p>
        <p type="p">68:低雜訊放大器(LNA)</p>
        <p type="p">71:第一功率放大器</p>
        <p type="p">72:第二功率放大器</p>
        <p type="p">78:天線間耦合</p>
        <p type="p">79:洩漏</p>
        <p type="p">80:RF系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2143" publication-number="202624880">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624880</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115106375</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>位於ＥＵＶ　ＰＳＭ遮罩上明缺陷的修復製程</chinese-title>
        <english-title>REPAIR PROCESS FOR CLEAR DEFECTS ON EUV PSM MASKS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="201201120260312B">G03F1/22</main-classification>
        <further-classification edition="201201120260312B">G03F1/26</further-classification>
        <further-classification edition="201201120260312B">G03F1/72</further-classification>
        <further-classification edition="200601120260312B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARL ZEISS SMT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倫辛　克里斯欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RENSING, CHRISTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布倫德爾　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRENDEL, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米特　傑森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METTE, GERSON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赫爾曼斯　克里斯汀　菲利克斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HERMANNS, CHRISTIAN FELIX</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧斯　妮可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUTH, NICOLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明有關於一種處理用於EUV微影的相移遮罩之方法，該方法包含：使用一種用於修復該遮罩的成像結構的前驅物氣體，實施粒子束誘導沉積以修復材料。根據本發明，能以一修復該成像結構的方式，即該遮罩的至少一臨界尺寸與一預定臨界尺寸之間的偏差至少低於15%，優選低於10%，更優選低於5%，最優選低於3%。  &lt;br/&gt;本發明更有關一種用於EUV微影的相移遮罩、一種電腦程式及一種裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a method of processing a phase-shift mask for EUV lithography, comprising: particle beam-induced depositing of a repair material using a precursor gas for repair of an imaging structure of the mask. According to the disclosure, the imaging structure can be repaired in such a way that at least one critical dimension of the mask has a deviation from a predetermined critical dimension of at least below 15%, preferably below 10%, more preferably below 5%, most preferably below 3%. &lt;br/&gt;The present disclosure further relates to a phase-shift mask for EUV lithography, to a computer program and to a device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">CL:外層</p>
        <p type="p">d1:目標高度</p>
        <p type="p">d2:修復材料高度</p>
        <p type="p">LR’:修復材料寬度</p>
        <p type="p">LR&lt;sub&gt;+1&lt;/sub&gt;’:結構寬度</p>
        <p type="p">LR&lt;sub&gt;-1&lt;/sub&gt;’:結構寬度</p>
        <p type="p">ML:相鄰反射層堆疊</p>
        <p type="p">RM:修復材料</p>
        <p type="p">S:基板</p>
        <p type="p">S&lt;sub&gt;+1&lt;/sub&gt;’:距離</p>
        <p type="p">S&lt;sub&gt;-1&lt;/sub&gt;’:距離</p>
        <p type="p">SM:層材料</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2144" publication-number="202624221">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624221</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115106436</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>嘧啶化合物</chinese-title>
        <english-title>PYRIMIDINE COMPOUND</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">C07D401/04</main-classification>
        <further-classification edition="200601120260313B">C07D401/14</further-classification>
        <further-classification edition="200601120260313B">A61K31/505</further-classification>
        <further-classification edition="200601120260313B">A61P25/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大塚製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKA PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>篠原友一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINOHARA, TOMOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩田伸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWATA, SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新井健太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAI, KENTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤展明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, NOBUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木征希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供由式[I]代表的新穎的嘧啶化合物及其鹽：</p>
        <p type="p">
        &lt;figure&gt;
          &lt;img align="absmiddle" height="150px" width="375px" file="d10001.TIF" alt="化學式ed10001.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10001.png"&gt;
          &lt;/img&gt;
        &lt;/figure&gt;
      </p>
        <p type="p">[在式中，該等符號係如在說明書中所定義的]，它們用於治療、預防和/或診斷涉及癲癇發作或抽搐發作(包括多重抗藥性發作、難治的發作、急性症狀發作、熱性癲癇和癲癇持續狀態)的疾病之發作等，連同它們的醫學用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a novel pyrimidine compound represented by Formula [I] and a salt thereof: </p>
        <p type="p">
        &lt;figure&gt;
          &lt;img align="absmiddle" height="145px" width="369px" file="d10002.TIF" alt="化學式ed10002.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10002.png"&gt;
          &lt;/img&gt;
        &lt;/figure&gt;
      </p>
        <p type="p">[in the formula, the symbols are as defined in the specification], which is useful for treating, preventing and/or diagnosing seizure and the like in disease involving epileptic seizure or convulsive seizure (including multiple drug resistant seizure, refractory seizure, acute symptomatic seizure, febrile seizure and status epilepticus), as well as a medical use therefor.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2145" publication-number="202623905">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623905</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115106490</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>對準裝置、對準套件和對準方法</chinese-title>
        <english-title>ALIGNMENT DEVICE, ALIGNMENT TOOLKIT, AND ALIGNMENT METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260310B">B05B13/02</main-classification>
        <further-classification edition="200601120260310B">F16H1/28</further-classification>
        <further-classification edition="200601120260310B">F16H25/20</further-classification>
        <further-classification edition="201201120260310B">F16H48/11</further-classification>
        <further-classification edition="202601120260310B">H10P72/50</further-classification>
        <further-classification edition="202601120260310B">H10P72/76</further-classification>
        <further-classification edition="200601120260310B">B25B27/02</further-classification>
        <further-classification edition="200601120260310B">B25B27/14</further-classification>
        <further-classification edition="200601120260310B">H01J37/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞特克　阿列克謝　Ｖ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALTECOR, ALEKSEY V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種對準裝置，以經對準配置將二構件曳接在一起。示例性對準裝置包括行星齒輪組及一或更多側板，其中該行星齒輪組包括環形齒輪及至少二行星齒輪，而該一或更多側板係用於支撐該等齒輪。該等二行星齒輪的各者包括孔口，該孔口的尺寸係訂制以接收螺紋緊固件，其中該螺紋緊固件係用於與各自螺紋桿接合，而該各自螺紋桿係與該二構件的其中一者接合，其中該環形齒輪的轉動將轉動動作傳遞至該等螺紋緊固件，使該對準裝置沿著該等二螺紋桿同步前進。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An alignment device is provided to draw two components together in an aligned configuration. An example alignment device comprises a planetary gear set including a ring gear and at least two planetary gears and one or more side plates for supporting the gears. Each of the planetary gears includes an aperture sized to receive a threaded fastener for engagement with a respective threaded rod that is engaged with one of the two components, wherein rotation of the ring gear imparts rotational movement to the threaded fasteners to cause synchronized advancement of the alignment device along the threaded rods.</p>
      </isu-abst>
      <representative-img>
        <p type="p">104:噴淋頭</p>
        <p type="p">200:組件</p>
        <p type="p">202:對準裝置</p>
        <p type="p">204:冷卻板</p>
        <p type="p">206:噴淋頭桿部</p>
        <p type="p">208:螺紋孔洞</p>
        <p type="p">210:螺紋桿</p>
        <p type="p">212:環形齒輪</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2146" publication-number="202624399">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624399</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115106517</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>樹脂組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">C08L63/00</main-classification>
        <further-classification edition="201801120260311B">C08K3/013</further-classification>
        <further-classification edition="200601120260311B">C08K5/3415</further-classification>
        <further-classification edition="200601120260311B">C08J5/18</further-classification>
        <further-classification edition="200601120260311B">H05K1/03</further-classification>
        <further-classification edition="202601120260311B">H10W74/47</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商味之素股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AJINOMOTO CO., INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池平秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEHIRA, SHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供可抑制翹曲，同時帶來呈現良好之長期可靠性之絕緣材料的樹脂組成物。  &lt;br/&gt;　　本發明係一種樹脂組成物，其係包含(A)環氧樹脂，及(B)應力緩和材，其中，以下述＜Stud pull試驗條件＞進行5次試驗時，下述＜剝離模式之判定基準＞之中，表示剝離模式I或剝離模式III，且剝離時之荷重值為180kgf/cm&lt;sup&gt;2&lt;/sup&gt;以上。  &lt;br/&gt;＜Stud pull試驗條件＞  &lt;br/&gt;　　在進行了粗化處理之貼銅積層板設置該樹脂組成物之層，以溫度T&lt;sub&gt;1&lt;/sub&gt;(℃)加熱90分鐘，使樹脂組成物硬化，得到評價基板。該評價基板之樹脂組成物之硬化物層上，以環氧接著劑(epoxy adhesive)固定螺柱銷(stud pin； 釘狀冶具；接著面之直徑2.7mm)，以150℃加熱1小時接著。使用Stud pull試驗機，以2kgf/秒之速度，將螺柱銷對於評價基板之主面呈垂直方向拉伸，觀察硬化物層剝離時點之荷重值(kgf/cm&lt;sup&gt;2&lt;/sup&gt;)與剝離模式。又，溫度T&lt;sub&gt;1&lt;/sub&gt;(℃)係指使用示差掃描熱量計，在昇溫速度5℃/分鐘的條件下，由30℃昇溫至350℃時，該樹脂組成物所呈現之放熱峰(exothermic peak)之溫度為T(℃)時，表示(T+10)(℃)以上的溫度。  &lt;br/&gt;＜剝離模式之判定基準＞  &lt;br/&gt;　　剝離模式I：在貼銅積層板-硬化物層之界面產生剝離(層間剝離)為3次以上  &lt;br/&gt;　　剝離模式II：硬化物層產生凝聚破壞(層內剝離)為3次以上  &lt;br/&gt;　　剝離模式III：在硬化物層-螺柱銷之界面產生剝離(層間剝離)為3次以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2147" publication-number="202623963">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623963</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115106547</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>緊固工具</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">B25B21/00</main-classification>
        <further-classification edition="200601120260312B">B25B23/04</further-classification>
        <further-classification edition="200601120260312B">B25B23/06</further-classification>
        <further-classification edition="200601120260312B">B25B23/14</further-classification>
        <further-classification edition="200601120260312B">B25B13/14</further-classification>
        <further-classification edition="200601120260312B">B25F5/00</further-classification>
        <further-classification edition="201601120260312B">H02P23/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商美克司股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAX CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大澤祐輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSAWA, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹内和也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEUCHI, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]本發明提供能夠藉由使螺絲起子頭向緊固螺絲的方向移動的動作來控制螺絲起子頭的移動結束位置的緊固工具。  &lt;br/&gt;[解決手段]緊固工具（1）包括：起子頭保持部（3），以能夠拆裝的方式保持螺絲起子頭（2），並能夠在螺絲起子頭（2）的周向上旋轉且能夠在軸向上移動；起子頭移動馬達（50），使起子頭保持部（3）沿著軸向移動；及控制部（100），藉由起子頭移動馬達（50）的轉數來控制起子頭保持部（3）的沿著軸向的位置，控制部（100）係，執行設定起子頭保持部（3）的沿著軸向的待機位置的初始化動作，並從待機位置藉由起子頭移動馬達的轉數來控制起子頭保持部（3）的沿著軸向的位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:緊固工具</p>
        <p type="p">10:工具主體</p>
        <p type="p">100:控制部</p>
        <p type="p">10a:殼體</p>
        <p type="p">10b:前框架</p>
        <p type="p">10c:後框架</p>
        <p type="p">10f:鼻主體部</p>
        <p type="p">11:握把</p>
        <p type="p">111:基板收納部</p>
        <p type="p">12:電池</p>
        <p type="p">13:電池安裝部</p>
        <p type="p">2:螺絲起子頭</p>
        <p type="p">20:插入部</p>
        <p type="p">200:螺絲</p>
        <p type="p">3:起子頭保持部</p>
        <p type="p">30:保持部件</p>
        <p type="p">30a:開口</p>
        <p type="p">30b:連結部件</p>
        <p type="p">31:旋轉引導部件</p>
        <p type="p">31a:槽部</p>
        <p type="p">32:移動部件</p>
        <p type="p">32a:第一移動部件</p>
        <p type="p">32b:軸承(軸承)</p>
        <p type="p">32c:第二移動部件</p>
        <p type="p">32d:緩衝部件</p>
        <p type="p">33:施力部件</p>
        <p type="p">34a:軸承(軸承)</p>
        <p type="p">4:第一驅動部</p>
        <p type="p">40:起子頭旋轉馬達(馬達、第一馬達)</p>
        <p type="p">40a:軸</p>
        <p type="p">41:減速機</p>
        <p type="p">41a:軸</p>
        <p type="p">42:軸承(軸承)</p>
        <p type="p">5:第二驅動部</p>
        <p type="p">50:起子頭移動馬達(馬達、第二馬達)</p>
        <p type="p">50a:軸</p>
        <p type="p">51:減速機</p>
        <p type="p">51a:軸</p>
        <p type="p">52:滑輪(傳遞部件)</p>
        <p type="p">53:軸承</p>
        <p type="p">54:線材(傳遞部件)</p>
        <p type="p">6:螺絲收納部</p>
        <p type="p">8:鼻部</p>
        <p type="p">80:射出通路</p>
        <p type="p">81:接觸部件</p>
        <p type="p">81a:射出口</p>
        <p type="p">9:觸發器</p>
        <p type="p">A1,A2:箭頭</p>
        <p type="p">P1:待機位置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2148" publication-number="202625805">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625805</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115106562</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置和相關方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICES AND RELATED METHODS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260311B">H10W20/20</main-classification>
        <further-classification edition="202601120260311B">H10W76/42</further-classification>
        <further-classification edition="202601120260311B">H10W72/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商安靠科技新加坡控股私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翰古文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, GYU WAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班文貝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANG, WON BAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李祖亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JU HYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張民華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, MIN HWA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴東久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, DONG JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金進勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHIM, JIN YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金傑雲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JAE YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪詩煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, SE HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余祥傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, SEUNG JAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布爾　舒恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOWERS, SHAUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林基泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, GI TAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓炳武</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, BYOUNG WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周名佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, MYUNG JEA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="14">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秀碧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEUL BEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="15">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜桑古</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, SANG GOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="16">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴坤祿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, KYUNG ROK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一個實例中，一種半導體裝置可包括基板、裝置堆疊、第一及第二內部互連件和囊封物。所述基板可包括彼此相對的第一基板側面及第二基板側面、在所述第一基板側面與所述第二基板側面之間的基板外側壁以及在所述第一基板側面與所述第二基板側面之間限定空腔的基板內側壁。所述裝置堆疊可以在所述空腔中，且可包括第一電子裝置和堆疊於所述第一電子裝置上的第二電子裝置。所述第一內部互連件可耦合到所述基板和所述裝置堆疊。所述囊封物可覆蓋所述基板內側壁和所述裝置堆疊，且可填充所述空腔。本文中揭示其它實例和相關方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">101:模組/第一模組</p>
        <p type="p">110:基板</p>
        <p type="p">110i:內側壁</p>
        <p type="p">110s:外側壁</p>
        <p type="p">111:空腔</p>
        <p type="p">112:內部端子</p>
        <p type="p">113:外部端子</p>
        <p type="p">120:裝置堆疊</p>
        <p type="p">121:電子裝置</p>
        <p type="p">121a:裝置端子</p>
        <p type="p">122:電子裝置</p>
        <p type="p">122a:裝置端子</p>
        <p type="p">123:電子裝置</p>
        <p type="p">123a:裝置端子</p>
        <p type="p">124:電子裝置</p>
        <p type="p">124a:裝置端子</p>
        <p type="p">130:內部互連件</p>
        <p type="p">140:囊封物</p>
        <p type="p">150:外部互連件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2149" publication-number="202625343">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625343</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115106575</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>多相控制器的相數控制電路、多相控制器及多相開關電源</chinese-title>
        <english-title>PHASE-NUMBER CONTROL CIRCUIT FOR MULTIPHASE CONTROLLER, MULTIPHASE CONTROLLER, AND MULTIPHASE SWITCHING POWER SUPPLY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200701120260304B">H02M1/00</main-classification>
        <further-classification edition="200601120260304B">H02M1/088</further-classification>
        <further-classification edition="200601120260304B">H02M3/158</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商杰華特微電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOULWATT TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬朋朋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, PENG PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫力</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖俊龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種多相控制器的相數控制電路、多相控制器及多相開關電源，多相控制器包括n個脈寬調變（Pulse Width Modulation，PWM）引腳，包括分別與n個PWM引腳一一對應的n個比較器，與第k PWM引腳對應的第k比較器的第一輸入端接收第k負載電流採樣信號，第二輸入端接收第k閾值信號，輸出端輸出第k比較信號，其中，第k負載電流採樣信號為第k PWM引腳所在輸出軌的負載電流採樣信號，第k閾值信號為用於判斷是否開啟與第k PWM引腳對應的開關電路的閾值信號；多相控制器根據第k比較信號控制與第k PWM引腳對應的開關電路是否進行功率運行，多相控制器適於控制相數小於等於n且輸出軌個數小於等於p的多相開關電源，其中，2≤p≤n。能夠減小面積和功耗，以及提高相數切換回應速度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a phase-number control circuit for a multiphase controller, a multiphase controller, and a multiphase switching power supply. The multiphase controller comprises n PWM pins and n comparators corresponding one-to-one to the n PWM pins. A k-th comparator corresponding to a k-th PWM pin receives a k-th load current sampling signal at a first input and a k-th threshold signal at a second input, and outputs a k-th comparison signal at an output, wherein the k-th load current sampling signal is a load current sampling signal of an output rail of the k-th PWM pin, and the k-th threshold signal is a threshold signal for determining whether to turn on a switching circuit corresponding to the k-th PWM pin. The multiphase controller controls whether the switching circuit corresponding to the k-th PWM pin performs power operation according to the k-th comparison signal, and the multiphase controller is configured to control a multiphase switching power supply with a phase number less than or equal to n and an output rail count less than or equal to p, wherein 2 ≤ p ≤ n. Area and power consumption are reduced, and phase-switching response speed is increased.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:多相控制器</p>
        <p type="p">200:相數控制電路</p>
        <p type="p">201,202,...,20n:負載電流比較模組</p>
        <p type="p">210:存儲單元</p>
        <p type="p">300:PWM信號產生模組</p>
        <p type="p">CMP1,CMP2,...,CMPn:比較器</p>
        <p type="p">DAC1,DAC2,...,DACn:數模轉換器</p>
        <p type="p">L1,L2,...,Ln:比較信號</p>
        <p type="p">PWM1,PWM2,...,PWMn:PWM信號</p>
        <p type="p">Sio&lt;sub&gt;R1&lt;/sub&gt;,Sio&lt;sub&gt;R2&lt;/sub&gt;,...,Sio&lt;sub&gt;Rp&lt;/sub&gt;,Sio1,Sio2,...,Sion:負載電流採樣信號</p>
        <p type="p">th1,th2,...,thn:閾值信號</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2150" publication-number="202623844">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623844</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115106581</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>包含排毒迴路的透析系統</chinese-title>
        <english-title>DIALYSIS SYSTEM INCORPORATING A TOXIN-REMOVAL LOOP</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260312B">A61M1/28</main-classification>
        <further-classification edition="200601120260312B">A61M1/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美國華盛頓大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNIVERSITY OF WASHINGTON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵國征</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAO, GUOZHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海恩兹　布魯斯　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HINDS, BRUCE J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種受保護流體環路，其可利用對尿素轉運具高度選擇性的滲透膜或其他膜類型。該等膜可以一正向滲透幾何結構達成尿素之充足擴散溶流量。當與一氧化單元組合時，此受保護幾何結構可具有尿素自用過的透析液側至尿素排除側之一高選擇性溶流量；藉由控制穿過一蒸汽可滲透膜之水蒸發速率由正向滲透流進行之患者中之流體(水)位準之平衡；對患者透析液/血液迴路免受氧化副產物影響之保護；及最佳化原本與血液接觸不相容之氧化系統效能(pH值、離子強度、其他電解質等等)之一能力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A protected fluid circuit can utilize osmotic membranes or other membrane types that are highly selective to urea transport. The membranes can achieve sufficient diffusional flux of urea in a forward osmosis geometry. When combined with a oxidation unit, this protected geometry can have a high selective flux of urea from the spent dialysate side to the urea removal side; balance of fluid (water) levels in patients by forward osmotic flow by controlling water evaporation rate through an vapor permeable membrane; protection of patient dialysate/blood loop from oxidation by-products; and an ability to optimize oxidation system performance (pH, ionic strength, other electrolytes, etc.) that would be otherwise incompatible with blood contact.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:環路</p>
        <p type="p">202:患者血液環路/血液環路/環路</p>
        <p type="p">204:透析液迴路/迴路</p>
        <p type="p">206:排毒迴路/迴路</p>
        <p type="p">210:透析膜/膜</p>
        <p type="p">212:毒素選擇性膜/膜</p>
        <p type="p">214:活性炭卡匣/液體過濾器/卡匣</p>
        <p type="p">216:液體過濾器/額外活性炭過濾器</p>
        <p type="p">218:排毒元件/光氧化元件/尿素去除元件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2151" publication-number="202624231">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624231</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115106592</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於治療疾病之雙環化合物及其用途</chinese-title>
        <english-title>BICYCLIC COMPOUNDS AND USES THEREOF FOR THE TREATMENT OF DISEASES</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260310B">C07D487/04</main-classification>
        <further-classification edition="200601120260310B">A61K31/519</further-classification>
        <further-classification edition="200601120260310B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商里歐納生物股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEONABIO, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡娃斯　蓮恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAS, LEEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雀曲　凱文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHURCH, KEVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泰勒　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAYLOR, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>強斯頓　傑韋爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOHNSTON, JEWEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>保特曼　道格拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOATMAN, DOUGLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供用於調節肝細胞生長因子之化合物及其組合物。在一些實施例中，提供該等化合物及該等組合物以用於治療包括神經性病症的疾病。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are compounds and compositions thereof for modulating hepatocyte growth factors. In some embodiments, the compounds and compositions are provided for treatment of diseases, including neurological disorders.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2152" publication-number="202624264">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624264</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115106673</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>生產含ＦＣ蛋白質的方法</chinese-title>
        <english-title>METHODS OF PRODUCING FC-CONTAINING PROTEINS</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260310B">C07K16/18</main-classification>
        <further-classification edition="200601120260310B">A61K39/395</further-classification>
        <further-classification edition="200601120260310B">C12P21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商美國禮來大藥廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELI LILLY AND COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧恩　席亞拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUNNE, CIARA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IE</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡恩斯　布萊恩　吉拉德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KEARNS, BRIAN GERARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷特伯格　艾希莉　林恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RETTBERG, ASHLEY LYNN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供改良的用於生產含Fc蛋白質的方法。該等方法通常涉及培養產生該含Fc蛋白質的哺乳動物細胞在第一pH設定值第一時間段，隨後該細胞在高於該第一pH設定值的第二pH設定值培養第二時間段。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are improved methods for producing an Fc-containing protein. The methods generally involve culturing mammalian cells that produce the Fc-containing protein at a first pH setpoint for a first period of time followed by culturing the cell at a second pH setpoint that is higher than the first pH set point for a second period of time.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2153" publication-number="202623712">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623712</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115106714</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>釣力閥墊圈及釣魚用捲線器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260315B">A01K89/02</main-classification>
        <further-classification edition="200601120260315B">A01K89/027</further-classification>
        <further-classification edition="200601120260315B">D04H1/44</further-classification>
        <further-classification edition="200601120260315B">F16D7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商島野股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMANO INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新妻翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIITSUMA, AKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楠田周</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUSUDA, SHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>八柄篤司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAGARA, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>髙松卓司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAMATSU, TAKUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]可以同時達成高耐久性和確保適合釣魚的釣力閥(drag)用的制動力，並且進一步降低成本。  &lt;br/&gt;　　[解決手段]提供一種釣力閥墊圈，是用於釣魚用捲線器且藉由相對於釣力閥墊片相對旋轉讓支承面成為滑動面(44a)的釣力閥墊圈(44)；釣力閥墊圈(44)，具有：纖維長度方向朝向沿著主齒輪軸的方向的縱纖維(4A)、及纖維長度方向朝向沿著滑動面(44a)的方向的橫纖維(4B)；是由縱纖維(4A)與橫纖維(4B)纏繞而成的氈材所構成，縱纖維(4A)的纖維長度方向的長度為0.5mm以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">4A:縱纖維(第1纖維)</p>
        <p type="p">4B:橫纖維(第2纖維)</p>
        <p type="p">44(44A~44D):釣力閥墊圈</p>
        <p type="p">44a:滑動面</p>
        <p type="p">440:纖維</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2154" publication-number="202625633">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625633</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115106748</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電子裝置及其製造方法</chinese-title>
        <english-title>ELECTRONIC DEVICE AND ITS MANUFACTURING METHOD</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202501120260311B">H10H20/831</main-classification>
        <further-classification edition="202501120260311B">H10H20/857</further-classification>
        <further-classification edition="202501120260311B">H10F77/00</further-classification>
        <further-classification edition="202501120260311B">H10F30/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商沖電氣工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKI ELECTRIC INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古田裕典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUTA, HIRONORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小酒達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSAKA, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷川兼一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANIGAWA, KENICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塙遼平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANAWA, RYOUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石川琢磨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIKAWA, TAKUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北島由隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAJIMA, YUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">目的在於，即使在功能部件發生翹曲的情況下，也能夠將功能部件良好地接合至基板。一種電子裝置（10），包括功能部件（102）、支撐功能部件（102）的基板（130）、沉積在功能部件（102）面向基板（130）的一側上的作為電極的第一金屬膜（110）、以及形成在基板（130）上且與第一金屬膜（110）接合的第二金屬膜（140）。功能部件（102）包括經由第一金屬膜（110）面向基板（130）的第一表面（102a）和從第一表面（102a）沿與第一表面（102a）不同的方向延伸的第二表面（102b）。第一金屬膜（110）從功能部件（102）的第一表面（102a）沉積到第二表面（102b）的一部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the present disclosure is to make it possible to excellently join a functional part to a substrate even when warpage of the functional part has occurred. An electronic device (10) includes a functional part (102), a substrate (130) that supports the functional part (102), a first metallic film (110) as an electrode deposited on a side of the functional part (102) facing the substrate (130), and a second metallic film (140) which is formed on the substrate (130) and to which the first metallic film (110) is joined. The functional part (102) includes a first surface (102a) that faces the substrate (130) via the first metallic film (110) and a second surface (102b) that extends from the first surface (102a) in a direction different from an extending direction of the first surface (102a). The first metallic film (110) is deposited from the first surface (102a) of the functional part (102) to a part of the second surface (102b).</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:功能層</p>
        <p type="p">102a:下表面</p>
        <p type="p">102b:側表面</p>
        <p type="p">110:第一金屬膜</p>
        <p type="p">130:裝置基板</p>
        <p type="p">140:第二金屬膜</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2155" publication-number="202624155">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624155</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115106765</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>具有改良機械耐久性之可離子交換鹼鋁矽酸鹽玻璃組成物</chinese-title>
        <english-title>ION EXCHANGEABLE ALKALI ALUMINOSILICATE GLASS COMPOSITIONS HAVING IMPROVED MECHANICAL DURABILITY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">C03B27/03</main-classification>
        <further-classification edition="200601120260313B">C03C10/12</further-classification>
        <further-classification edition="200601120260313B">C03C3/076</further-classification>
        <further-classification edition="200601120260313B">C03C3/089</further-classification>
        <further-classification edition="200601120260313B">C03C3/091</further-classification>
        <further-classification edition="200601120260313B">C03C3/097</further-classification>
        <further-classification edition="200601120260313B">C03C21/00</further-classification>
        <further-classification edition="201301120260313B">G06F21/84</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUI, SHUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭曉菊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, XIAOJU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷奇　彼德約瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEZZI, PETER JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種玻璃組成物，包含：50.0莫耳%至70.0莫耳%的SiO&lt;sub&gt;2&lt;/sub&gt;；10.0莫耳%至25.0莫耳%的Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;；0.0莫耳%至5.0莫耳%的P&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;；0.0莫耳%至10.0莫耳%的B&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;；5.0莫耳%至15.0莫耳%的Li&lt;sub&gt;2&lt;/sub&gt;O；1.0莫耳%至15.0莫耳%的Na&lt;sub&gt;2&lt;/sub&gt;O；以及0.0莫耳%至1.0莫耳%的K&lt;sub&gt;2&lt;/sub&gt;O。存在於玻璃組成物中之所有鹼金屬氧化物的總和，R&lt;sub&gt;2&lt;/sub&gt;O，可在大於或等於11.0莫耳%至小於或等於23.0莫耳%之範圍內。存在於玻璃組成物中之Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;及R&lt;sub&gt;2&lt;/sub&gt;O的總和可在大於或等於26.0莫耳%至小於或等於40.0莫耳%之範圍內。玻璃組成物可滿足以下關係： -0.1 ≤ (Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;-(R&lt;sub&gt;2&lt;/sub&gt;O+RO))/Li&lt;sub&gt;2&lt;/sub&gt;O ≤ 0.3。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A glass composition comprises: 50.0 mol% to 70.0 mol% SiO&lt;sub&gt;2&lt;/sub&gt;; 10.0 mol% to 25.0 mol% Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;; 0.0 mol% to 5.0 mol% P&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;; 0.0 mol% to 10.0 mol% B&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;; 5.0 mol% to 15.0 mol% Li&lt;sub&gt;2&lt;/sub&gt;O; 1.0 mol% to 15.0 mol% Na&lt;sub&gt;2&lt;/sub&gt;O; and 0.0 mol% to 1.0 mol% K&lt;sub&gt;2&lt;/sub&gt;O. The sum of all alkali oxides, R&lt;sub&gt;2&lt;/sub&gt;O, present in the glass composition may be in the range from greater than or equal to 11.0 mol% to less than or equal to 23.0 mol%. The sum of Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt; and R&lt;sub&gt;2&lt;/sub&gt;O present in the glass composition may be in the range from greater than or equal to 26.0 mol% to less than or equal to 40.0 mol%. The glass composition may satisfy the relationship -0.1 ≤ (Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;-(R&lt;sub&gt;2&lt;/sub&gt;O+RO))/Li&lt;sub&gt;2&lt;/sub&gt;O ≤ 0.3.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:裝置-掉落機器</p>
        <p type="p">12:夾具</p>
        <p type="p">14:夾持顎</p>
        <p type="p">16:測試盤</p>
        <p type="p">18:掉落表面</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2156" publication-number="202625745">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625745</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115106783</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260310B">H10P72/00</main-classification>
        <further-classification edition="202601120260310B">H10P50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新藤尚樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINDO, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑嶋亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUWAJIMA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口博史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, HIROFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為有效率地進行使用處理氣體之基板處理。  &lt;br/&gt;        一種基板處理裝置，係處理基板之基板處理裝置，具有：處理容器，係收納基板；載置台，係設置於該處理容器的內部來載置基板；分隔壁，係設置於該處理容器的內部且圍繞該載置台的外周；內側供氣部，係將第1氣體供應至該分隔壁的內側；以及外側供氣部，係在該處理容器的內部來將第2氣體供應至該分隔壁的外側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:晶圓處理裝置</p>
        <p type="p">10:處理容器</p>
        <p type="p">11:載置台</p>
        <p type="p">12:供氣部</p>
        <p type="p">13:分隔壁</p>
        <p type="p">14:升降機構</p>
        <p type="p">15:內壁</p>
        <p type="p">16:排氣部</p>
        <p type="p">20:側壁</p>
        <p type="p">21:頂板</p>
        <p type="p">22:底板</p>
        <p type="p">30:上部台</p>
        <p type="p">31:下部台</p>
        <p type="p">32:溫度調整機構</p>
        <p type="p">40:噴淋頭</p>
        <p type="p">41:第1內側供氣部</p>
        <p type="p">42:第2內側供氣部</p>
        <p type="p">43:外側供氣部</p>
        <p type="p">50:圓筒部</p>
        <p type="p">51:上凸緣部</p>
        <p type="p">52:下凸緣部</p>
        <p type="p">53:密封組件</p>
        <p type="p">54:密封組件</p>
        <p type="p">60:致動器</p>
        <p type="p">61:驅動軸</p>
        <p type="p">62:導引軸</p>
        <p type="p">63:伸縮管</p>
        <p type="p">64:伸縮管</p>
        <p type="p">70:本體部</p>
        <p type="p">71:突出部</p>
        <p type="p">72:槽縫</p>
        <p type="p">80:排氣機構</p>
        <p type="p">81:排氣管</p>
        <p type="p">90:控制部</p>
        <p type="p">S:內側空間</p>
        <p type="p">T:外側空間</p>
        <p type="p">V:排氣空間</p>
        <p type="p">W:晶圓</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2157" publication-number="202624567">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624567</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115106900</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>使用汽化摻雜物生產單晶矽錠之方法</chinese-title>
        <english-title>METHODS FOR PRODUCING A SINGLE CRYSTAL SILICON INGOT USING A VAPORIZED DOPANT</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">C30B15/04</main-classification>
        <further-classification edition="200601120260309B">C30B15/14</further-classification>
        <further-classification edition="200601120260309B">C30B15/20</further-classification>
        <further-classification edition="200601120260309B">C30B29/06</further-classification>
        <further-classification edition="200601120260309B">C30B31/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>環球晶圓股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLOBALWAFERS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳雨樵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YU-CHIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>路特　威廉　里恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUTER, WILLIAM LYNN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菲利浦　理查　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PHILLIPS, RICHARD J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾奧夫　斯姆士　迪恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EOFF, JAMES DEAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪榮宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示用於摻雜自一拉錠裝置內容置之一矽熔體中拉出之一單晶矽錠之系統及方法。該拉錠裝置包含界定一室之一外殼、安置於該室內之一坩堝及延伸到該外殼之一摻雜物注射器。該方法包含加熱一氣化杯，且將該外殼之一內部之一壓力保持在一第一壓力下。該方法進一步包含將液體摻雜物注射到該氣化杯。該液體摻雜物之一壓力在注射前保持在大於該第一壓力之一第二壓力處。該方法亦包含藉由使用該氣化杯加熱該液體摻雜物來氣化該液體摻雜物及藉由將該液體摻雜物注射到該外殼將該液體摻雜物之壓力自該第二壓力降低至該第一壓力，及將該氣化摻雜物引導至該外殼。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and methods for doping a single crystal silicon ingot pulled from a silicon melt held within an ingot puller apparatus are disclosed. The ingot puller apparatus includes a housing defining a chamber, a crucible disposed within the chamber, and a dopant injector extending into the housing. The method includes heating a vaporization cup and maintaining a pressure of an interior of the housing at a first pressure. The method further includes injecting liquid dopant into the vaporization cup. A pressure of the liquid dopant is maintained at a second pressure greater than the first pressure prior to injection. The method also includes vaporizing the liquid dopant by heating the liquid dopant with the vaporization cup and reducing the pressure of the liquid dopant from the second pressure to the first pressure by injecting the liquid dopant into the housing, and channeling the vaporized dopant into the housing.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:拉錠裝置</p>
        <p type="p">102:拉錠器外殼</p>
        <p type="p">104:拉錠器內室</p>
        <p type="p">106:坩堝</p>
        <p type="p">108:矽熔體</p>
        <p type="p">110:單晶矽錠</p>
        <p type="p">112:遮熱板</p>
        <p type="p">114:摻雜物注射器</p>
        <p type="p">116:注射模組</p>
        <p type="p">118:輸送模組</p>
        <p type="p">120:第一凸緣</p>
        <p type="p">122:摻雜物注射器開口</p>
        <p type="p">126:第二側</p>
        <p type="p">128:第二凸緣</p>
        <p type="p">172:進料管</p>
        <p type="p">176:加熱系統</p>
        <p type="p">178:遠端</p>
        <p type="p">180:近端</p>
        <p type="p">182:通道</p>
        <p type="p">200:加熱器</p>
        <p type="p">202:種子晶體</p>
        <p type="p">204:種子夾頭</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2158" publication-number="202623891">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623891</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115106916</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>生產顆粒材料的加工系統和方法</chinese-title>
        <english-title>PROCESSING SYSTEM AND METHOD FOR PRODUCING A PARTICULATE MATERIAL</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260310B">B01J19/06</main-classification>
        <further-classification edition="200601120260310B">B01J19/26</further-classification>
        <further-classification edition="201001120260310B">H01M4/48</further-classification>
        <further-classification edition="200601120260310B">C01B13/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商壹久公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EJOULE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　良毓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LIANG-YUH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　焱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊錄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, LU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李貞儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一種由液體混合物生產顆粒材料的處理系統和方法。該處理系統通常包括一個連接到一個或多個氣體管線以將一種或多種氣體輸送到處理系統中的系統入口，一個或多個適於將液體混合物噴射到一個或多個液滴流中並迫使其中一個或更多的液滴流進入處理系統的動力噴射模塊，以及一個反應室，其適於在一種或多種氣體的存在下遞送一種或多種液滴流並將該一種或多種液滴流處理成顆粒材料。該方法包括將一種或多種氣體輸送到處理系統中，使用處理系統的一個或多個動力噴射模塊將液體混合物噴射到一個或多個第一液滴流中並進入處理系統，並在存在一種或多種氣體的情況下，在第一溫度下，使從處理系統中反應室內的反應室運送的一個或多個第一液滴流反應成顆粒材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A processing system and method of producing a particulate material from a liquid mixture are provided. The processing system generally includes a system inlet connected to one or more gas lines to deliver one or more gases into the processing system, one or more power jet modules adapted to jet a liquid mixture into one or more streams of droplets and to force the one or more streams of droplets into the processing system, and a reaction chamber adapted to deliver the one or more streams of droplets in the presence of the one or more gases and process the one or more streams of droplets into the particulate material. The method includes delivering one or more gases into a processing system, jetting the liquid mixture into one or more first droplets streams using one or more power jet modules of the processing system and into the processing system, and reacting the one or more first droplets streams delivered from the processing chamber inside a reaction chamber of the processing system in the presence of the one or more gases into the particulate material at a first temperature.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:處理系統</p>
        <p type="p">102:系統入口</p>
        <p type="p">104:系統出口</p>
        <p type="p">106:氣管入口</p>
        <p type="p">210:反應室</p>
        <p type="p">220:分散室</p>
        <p type="p">230:緩衝室</p>
        <p type="p">240A:動力噴射模塊</p>
        <p type="p">240B:動力噴射模塊</p>
        <p type="p">240C:動力噴射模塊</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2159" publication-number="202625427">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625427</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115106917</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>短波紅外光學系統及用於製造被動Ｑ開關雷射器的多個部件的方法</chinese-title>
        <english-title>SHORT-WAVE INFRARED OPTICAL SYSTEM AND METHOD FOR MANUFACTURING PARTS FOR PASSIVELY Q-SWITCHED LASER</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202301120260309B">H04N5/33</main-classification>
        <further-classification edition="202301120260309B">H04N25/63</further-classification>
        <further-classification edition="202301120260309B">H04N25/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商趣眼有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRIEYE LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅拉穆德　納達夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MELAMUD, NADAV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴卡爾　烏拉罕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAKAL, AVRAHAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡帕奇　俄梅爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAPACH, OMER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利維　烏利爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEVY, URIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">公開了短波紅外光學系統及用於製造被動Q開關雷射器的多個部件的方法。該系統包括：被動Q開關雷射器，包括：增益介質，包括一陶瓷的增益介質結晶材料，該陶瓷的增益介質結晶材料包括陶瓷摻釹稀土元素的晶體；可飽和吸收體，被剛性耦合到該增益介質，該可飽和吸收體包括一陶瓷的可飽和吸收體結晶材料，該陶瓷的可飽和吸收體結晶材料選自於由以下材料組成的多種摻雜結晶材料的一群組：(a) 摻三價釩的釔鋁石榴石(V³⁺:YAG)及(b) 多種摻鈷結晶材料；及光腔，該增益介質及該可飽和吸收體位於該光腔中，該光腔包括高反射率鏡及輸出耦合器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A short-wave infrared (SWIR) optical system and a method for manufacturing parts for passively Q-switched laser are disclosed. The system comprises: a passively Q-switched laser that includes:a gain medium comprising a ceramic gain medium crystalline (GMC) material that includes a ceramic neodymium-doped rare-earth element crystal; a saturable absorber (SA) rigidly coupled to the gain medium, the SA comprising a ceramic saturable absorber crystalline (SAC) material selected from a group of doped crystalline materials consisting of (a) three-valence vanadium-doped yttrium aluminum garnet (V³⁺:YAG) and (b) Cobalt-doped crystalline materials; and an optical cavity within which the gain medium and the SA are positioned, the optical cavity including a high reflectivity mirror and an output coupler.</p>
      </isu-abst>
      <representative-img>
        <p type="p">600:雷射器</p>
        <p type="p">602:晶體增益介質(GM)</p>
        <p type="p">604:可飽和吸收體(SA)</p>
        <p type="p">608:高反射率鏡</p>
        <p type="p">610:輸出耦合器</p>
        <p type="p">612:雷射光束</p>
        <p type="p">618:雷射二極體</p>
        <p type="p">700:短波紅外(SWIR)光學系統</p>
        <p type="p">702:感測器</p>
        <p type="p">704:光學器件</p>
        <p type="p">706:光電探測器陣列(PDA)</p>
        <p type="p">708:光學器件</p>
        <p type="p">710:處理器</p>
        <p type="p">712:控制器</p>
        <p type="p">910:物體</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2160" publication-number="202624741">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624741</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115106944</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於檢測一管的方法及系統</chinese-title>
        <english-title>A METHOD AND SYSTEM FOR TESTING A PIPE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202101120260313B">G01N27/9013</main-classification>
        <further-classification edition="200601120260313B">G01N21/88</further-classification>
        <further-classification edition="200601120260313B">G01R33/025</further-classification>
        <further-classification edition="200601120260313B">G01R31/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商特納利斯連接器公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TENARIS CONNECTIONS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼科里尼　艾爾伯托</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NICOLINI, ALBERTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博納德奧　尼可拉斯赫爾南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BONADEO, NICOLAS HERNAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索洛薩諾培瑞茲　貝諾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEREZ SOLORZANO, BENITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MX</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>埃切維里　哈維爾伊格納西歐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ETCHEVERRY, JAVIER IGNACIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳絲倩</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭建中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種檢測一系統的一組件的方法，該系統包含第一長度的一管一。該方法步驟包括：提供一第二長度的原料管，該第二長度大於該第一長度；切割該原料管至該第一長度，以生產一切割管；使用一非破壞性檢驗技術檢驗該切割管。該非破壞性檢驗技術步驟包含：在該切割管的一內表面上執行一第一非破壞性檢測；在該切割管的一外表面上執行一第二非破壞性檢測。該方法還包括若檢驗該管的步驟識別出一缺陷時，則剔除該切割管的步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of testing of a component of a system that includes a pipe of a first length is provided. The method comprises the steps of: providing a second length of stock pipe, the second length being greater than the first length; cutting the stock pipe to the first length to produce a cut pipe; inspecting the cut pipe using a non-destructive inspection technique. The non-destructive inspection technique includes the steps of: performing a first non-destructive test on an inner surface of the cut pipe; performing a second non-destructive test on an outer surface of the cut pipe. The method further comprises the step of rejecting the cut pipe if the step of inspecting the pipe identifies a flaw.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第一檢測布置</p>
        <p type="p">2:第二檢測布置</p>
        <p type="p">3:第三檢測布置</p>
        <p type="p">15:轉盤</p>
        <p type="p">17:出口輸送機</p>
        <p type="p">100:檢測裝置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2161" publication-number="202624905">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624905</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115107035</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>在受測裝置之測試期間監控機電開關之過電流之方法</chinese-title>
        <english-title>METHOD OF MONITORING ELECTROMECHANICAL SWITCHES FOR OVERCURRENT DURING TESTING OF DEVICE UNDER TEST</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260309B">G05B19/048</main-classification>
        <further-classification edition="200601120260309B">H02H3/08</further-classification>
        <further-classification edition="200601120260309B">G05F1/10</further-classification>
        <further-classification edition="202601120260309B">H10P74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商克斯希拉公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XCERRA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博伊德　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOYD, STEFEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作揭示一種過電流監控方法，其可由一或多個硬體處理器執行之電腦程式指令實施。在一些實施例中，該方法可包含：在一半導體裝置測試器中提供一受測裝置；藉由操作電耦合至該受測裝置之一機電開關來控制至該受測裝置之測試訊號；藉由使用直接串聯連接至該機電開關之一電流量測感測器在該機電開關之該操作期間直接量測來自該機電開關之一測試訊號來監控該機電開關中之一過電流狀態；及使用電耦合至該電流量測感測器之一偵測電路系統來判定是否偵測到該過電流狀態。該方法可利用監控電路系統來產生過大電流訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An overcurrent monitoring method which can be implemented by computer program instructions executed by one or more hardware processors. In some embodiments, the method can include providing in a semiconductor device tester a device under test, controlling testing signals to the device under test by operation of an electromechanical switch electrically coupled to the device under test, monitoring for an overcurrent condition in the electromechanical switch by directly measuring a testing signal from the electromechanical switch during the operation thereof using a current measurement sensor directly serially connected to the electromechanical switch and determining whether the overcurrent condition has been detected using a detection circuitry electrically coupled to the current measurement sensor. The method can make use of monitoring circuitry to generate excess current signals.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:測試訊號</p>
        <p type="p">104:受測裝置(DUT)</p>
        <p type="p">106:輸出電流/輸出訊號</p>
        <p type="p">108:電壓</p>
        <p type="p">200:半導體裝置測試器</p>
        <p type="p">202:機電開關</p>
        <p type="p">204:電流量測感測器</p>
        <p type="p">208:比較訊號</p>
        <p type="p">210:過大電流訊號</p>
        <p type="p">212:偵測電路系統</p>
        <p type="p">214:監控電路系統</p>
        <p type="p">218:測試訊號源</p>
        <p type="p">600:電腦系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2162" publication-number="202624160">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624160</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115107036</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>Ｌｉ２Ｏ－Ａｌ２Ｏ３－ＳｉＯ２系結晶化玻璃</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">C03C3/097</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本電氣硝子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON ELECTRIC GLASS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>横田裕基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOKOTA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東條真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOJO, SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平野翔太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRANO, SHOTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種紫外～紅外區域之透過性高，不易破裂之Li&lt;sub&gt;2&lt;/sub&gt;O-Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;-SiO&lt;sub&gt;2&lt;/sub&gt;系結晶化玻璃。  &lt;br/&gt;本發明之Li&lt;sub&gt;2&lt;/sub&gt;O-Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;-SiO&lt;sub&gt;2&lt;/sub&gt;系結晶化玻璃之特徵在於以質量%計，含有40～90%之SiO&lt;sub&gt;2&lt;/sub&gt;、5～30%之Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;、1～10%之Li&lt;sub&gt;2&lt;/sub&gt;O、0～20%之SnO&lt;sub&gt;2&lt;/sub&gt;、0～5%之ZrO&lt;sub&gt;2&lt;/sub&gt;、0～10%之MgO、0～10%之P&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;5&lt;/sub&gt;、0～4%之TiO&lt;sub&gt;2&lt;/sub&gt;，且以質量比計，Li&lt;sub&gt;2&lt;/sub&gt;O/(MgO＋CaO＋SrO＋BaO＋Na&lt;sub&gt;2&lt;/sub&gt;O＋K&lt;sub&gt;2&lt;/sub&gt;O)為3以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2163" publication-number="202625826">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625826</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115107136</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>靜電放電保護裝置</chinese-title>
        <english-title>ELECTROSTATIC DISCHARGE PROTECTION DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260313B">H10W42/60</main-classification>
        <further-classification edition="202501120260313B">H10D89/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋宗圭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, JONGKYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許鎭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEO, JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金珉昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MINHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋周永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, JOOYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李恩淑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, EUNSUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全燦熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, CHANHEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種靜電放電保護裝置，包含基底，包含具有第一導電性類型的第一井及包圍第一井的第二井、形成於第一井上的第一擴散區至第五擴散區以及形成於第二井上的第六擴散區及第七擴散區。第二擴散區包圍第一擴散區，第四擴散區包圍第五擴散區，且第五擴散區包圍第二擴散區及第四擴散區。第六擴散區包圍第五擴散區，且第七擴散區包圍第六擴散區。第六擴散區及第七擴散區連接至陽極電極，且第一擴散區至第五擴散區連接至陰極電極。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is an electrostatic discharge protection device which includes a substrate including a first well having a first conductivity type and a second well surrounding the first well, first to fifth diffusion regions formed on the first well, and sixth and seventh diffusion regions formed on the second well. The second diffusion region surrounds the first diffusion region, the fourth diffusion region surrounds the fifth diffusion region, and the fifth diffusion region surrounds the second diffusion region and the fourth diffusion region. The sixth diffusion region surrounds the fifth diffusion region, and the seventh diffusion region surrounds the sixth diffusion region. The sixth and seventh diffusion regions are connected to an anode electrode, and the first to fifth diffusion regions are connected to a cathode electrode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:ESD保護裝置</p>
        <p type="p">131:第一擴散區</p>
        <p type="p">132:第二擴散區</p>
        <p type="p">133:第三擴散區</p>
        <p type="p">134:第四擴散區</p>
        <p type="p">135:第五擴散區</p>
        <p type="p">136:第六擴散區</p>
        <p type="p">137:第七擴散區</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">I-I'、II-II':線</p>
        <p type="p">STI:淺溝槽隔離</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2164" publication-number="202625185">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625185</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115107156</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於執行電阻器偏移校準訓練的記憶體裝置和記憶體系統</chinese-title>
        <english-title>MEMORY DEVICE AND MEMORY SYSTEM FOR PERFORMING RESISTOR OFFSET CALIBRATION TRAINING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260313B">G11C11/4093</main-classification>
        <further-classification edition="200601120260313B">G11C11/407</further-classification>
        <further-classification edition="200601120260313B">G11C7/10</further-classification>
        <further-classification edition="200601120260313B">G11C7/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商長江存儲科技有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANGTZE MEMORY TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李哲凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, ZHE-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張黃鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, HUANG-PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳家豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JIA-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本揭示書的一方面，提供一種週邊電路。週邊電路可以包括DQ電路，所述DQ電路包括多個判決反饋均衡（DFE）部件。週邊電路可以包括電阻器偏移校準（RXOC）電路。RXOC電路可以包括振盪器。振盪器可以生成內部時鐘源。RXOC電路可以包括DQ選擇部件。DQ選擇部件可以選擇多個DFE部件中的DFE部件以用於校準。DQ選擇部件可以輸出從DFE部件接收的指示偏移值的限幅器結果訊號。RXOC電路可以包括控制邏輯。控制邏輯可以基於限幅器結果訊號將與DFE部件相關聯的校準訊號發送到DQ電路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">According to one aspect of the present disclosure, a peripheral circuit is provided. The peripheral circuit may include a DQ circuit comprising a plurality of decision feedback equalization (DFE) components. The peripheral circuit may include a resistor offset calibration (RXOC) circuit. The RXOC circuit may include an oscillator. The oscillator may generate an internal clock source. The RXOC circuit may include a DQ-selection component. The DQ selection component may select a DFE component of the plurality of DFE components for calibration. The DQ-selection component may output a slicer result signal indicating an offset value received from the DFE component. The RXOC circuit may include control logic. The control logic may send a calibration signal associated with the DFE component to the DQ circuit based on the slicer result signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">404:RXOC振盪器(OSC)</p>
        <p type="p">406:判決反饋均衡(DFE)塊</p>
        <p type="p">408:電阻器偏移校準(RXOC)控制邏輯</p>
        <p type="p">410:DFE選擇部件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2165" publication-number="202624625">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624625</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115107410</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>繫留緊固件及其組裝方法</chinese-title>
        <english-title>CAPTIVE FASTENER AND METHOD OF ASSEMBLING THE SAME</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">F16B5/02</main-classification>
        <further-classification edition="200601120260311B">G05G1/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商南柯有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOUTHCO, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭景耀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, JINGYOA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐塞馬斯　湯馬士　Ｖ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUKZEMAS, THOMAS V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>覃學先</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIN, XUEXIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏雷克　理查　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHLACK, RICHARD E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江秉樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, BING HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李傳軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHUANJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖小營</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, XIAOYING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可沿著一緊固件軸線附接至一面板之繫留緊固件。該繫留緊固件包含一緊固件，該緊固件具有一頭部部分及自該頭部部分延伸且沿著該緊固件軸線延伸之一軸件。該繫留緊固件亦包含一旋鈕，該旋鈕具有嚙合至該緊固件之該頭部部分之一近端部分以及在該緊固件軸線及該緊固件之該軸件周圍徑向延伸之一環狀部分。一套圈與該旋鈕相關聯，該套圈界定沿著該緊固件軸線延伸且接納該緊固件之該軸件之一開口。該套圈具有經構形以阻止該旋鈕沿著該緊固件軸線與該套圈分開之一近端部分及經構形以嚙合至該面板之一遠端部分。一彈簧經定位以相對於該套圈在近端偏置該旋鈕或該緊固件且抑制該旋鈕或該緊固件相對於該緊固件軸線傾斜。該套圈之該近端部分已經定位為在一插入方向上沿著該緊固件軸線與該旋鈕相關聯，且該緊固件之該頭部部分已在該插入方向上插入於該旋鈕內以嚙合至該旋鈕。該旋鈕之該近端部分與該緊固件之該頭部部分之間的該嚙合經構形以抵抗該旋鈕相對於該緊固件沿著該緊固件軸線之軸向移動、該旋鈕相對於該緊固件圍繞該緊固件軸線之旋轉移動及該旋鈕相對於該緊固件軸線之樞轉移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A captive fastener attachable to a panel along a fastener axis is provided. The captive fastener includes a fastener having a head portion and a shaft extending from the head portion and along the fastener axis. The captive fastener also includes a knob having a proximal end portion engaged to the head portion of the fastener and an annular portion extending radially around the fastener axis and the shaft of the fastener. A ferrule is associated with the knob, the ferrule defining an opening extending along the fastener axis and receiving the shaft of the fastener. The ferrule has a proximal end portion configured to prevent separation of the knob from the ferrule along the fastener axis and a distal end portion configured for engagement to the panel. A spring is positioned to bias the knob or the fastener proximally relative to the ferrule and to inhibit tilting of the knob or the fastener relative to the fastener axis. The proximal end portion of the ferrule having been positioned to be associated with the knob in an insertion direction along the fastener axis, and the head portion of the fastener having been inserted within the knob for engagement to the knob in the insertion direction. The engagement between the proximal portion of the knob and the head portion of the fastener is configured to resist axial movement of the knob relative to the fastener along the fastener axis, rotational movement of the knob relative to the fastener about the fastener axis, and pivotal movement of the knob relative to the fastener axis.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:繫留緊固件</p>
        <p type="p">EL:經延伸長度</p>
        <p type="p">FA:緊固件軸線</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2166" publication-number="202625679">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625679</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115107417</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>積層體、及濺鍍靶材</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260308B">H10P14/22</main-classification>
        <further-classification edition="202501120260308B">H10D30/67</further-classification>
        <further-classification edition="200601120260308B">C23C14/08</further-classification>
        <further-classification edition="200601120260308B">C23C14/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商神鋼科研股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBELCO RESEARCH INSTITUTE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>越智元隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OCHI, MOTOTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日野綾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HINO, AYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮田浩一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYATA, KOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示的一態樣的結晶性氧化物半導體薄膜包含In元素及B元素，所述In的含有率[原子%]與所述B的含有率[原子%]之比滿足下述式1，藉由電子顯微鏡觀察到的表面上的平均晶粒尺寸為0.25 μm以上。  &lt;br/&gt;B/（In+B）≤0.20  ····（1）</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2167" publication-number="202625262">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625262</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115107438</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>電漿處理裝置、電源系統及頻率控制方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260310B">H01J37/32</main-classification>
        <further-classification edition="200601120260310B">H05H1/46</further-classification>
        <further-classification edition="202601120260310B">H10P50/20</further-classification>
        <further-classification edition="200601120260310B">G05B13/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>輿水地塩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSHIMIZU, CHISHIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明所揭示之電漿處理裝置具備腔室、基板支持部、高頻電源及控制部。基板支持部設置於腔室內。高頻電源構成為供給源高頻電力，以於腔室內由氣體產生電漿。控制部構成為：根據之前單獨供給源高頻電力時之源頻率、及源高頻電力之反射程度，設定單獨供給源高頻電力時之源高頻電力之源頻率，以抑制源高頻電力之反射程度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電漿處理裝置</p>
        <p type="p">2:控制部</p>
        <p type="p">2a:電腦</p>
        <p type="p">2a1:處理部</p>
        <p type="p">2a2:記憶部</p>
        <p type="p">2a3:通信介面</p>
        <p type="p">10:腔室</p>
        <p type="p">10a:側壁</p>
        <p type="p">10e:氣體排出口</p>
        <p type="p">10s:電漿處理空間</p>
        <p type="p">11:基板支持部</p>
        <p type="p">13:簇射頭</p>
        <p type="p">13a:氣體供給口</p>
        <p type="p">13b:氣體擴散室</p>
        <p type="p">13c:氣體導入口</p>
        <p type="p">20:氣體供給部</p>
        <p type="p">21:氣體源</p>
        <p type="p">22:流量控制器</p>
        <p type="p">30:電源系統</p>
        <p type="p">30c:控制部</p>
        <p type="p">31:高頻電源</p>
        <p type="p">31a:放大器</p>
        <p type="p">31g:高頻信號產生器</p>
        <p type="p">31m:匹配器</p>
        <p type="p">31s:感測器</p>
        <p type="p">32:偏壓電源</p>
        <p type="p">32a:放大器</p>
        <p type="p">32g:信號產生器</p>
        <p type="p">32m:匹配器</p>
        <p type="p">34:脈衝控制器</p>
        <p type="p">40:排氣系統</p>
        <p type="p">111:本體部</p>
        <p type="p">111a:中央區域</p>
        <p type="p">111b:環狀區域</p>
        <p type="p">111c:靜電吸盤</p>
        <p type="p">111e:基台</p>
        <p type="p">112:環組件</p>
        <p type="p">EB:電偏壓</p>
        <p type="p">HF:源高頻電力</p>
        <p type="p">W:基板</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2168" publication-number="202625829">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625829</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115107467</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體裝置及製造半導體裝置的方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260312B">H10W70/02</main-classification>
        <further-classification edition="202601120260312B">H10W74/10</further-classification>
        <further-classification edition="202601120260312B">H10W70/62</further-classification>
        <further-classification edition="202601120260312B">H10W70/60</further-classification>
        <further-classification edition="202601120260312B">H10W90/10</further-classification>
        <further-classification edition="202601120260312B">H10W72/30</further-classification>
        <further-classification edition="202601120260312B">H10W74/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商安靠科技新加坡控股私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林基泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, GI TAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金傑雲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JAE YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周名佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, MYUNG JEA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一個實例中，一種半導體結構包括：重新分佈結構，所述重新分佈結構包括導電結構；腔基板，所述腔基板位於所述重新分佈結構的頂側上並且具有腔和接觸所述重新分佈結構的柱；電子組件，所述電子組件位於所述重新分佈結構的頂表面上和所述腔中，其中所述電子組件與所述導電結構電耦合；以及囊封件，所述囊封件位於所述腔中和所述重新分佈結構的所述頂側上，所述囊封件接觸所述電子組件的側面、所述腔的側面以及所述柱的側面。本文還公開了其它實例和相關方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In one example, a semiconductor structure comprises a redistribution structure comprising a conductive structure, a cavity substrate on a top side of the redistribution structure and having a cavity and a pillar contacting the redistribution structure, an electronic component on the top surface of the redistribution structure and in the cavity, wherein the electronic component is electrically coupled with the conductive structure, and an encapsulant in the cavity and on the top side of the redistribution structure, contacting a lateral side of the electronic component, a lateral side of the cavity, and a lateral side of the pillar. Other examples and related methods are also disclosed herein.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置/第一半導體裝置</p>
        <p type="p">101:半導體封裝件</p>
        <p type="p">110:基板</p>
        <p type="p">111:絕緣層</p>
        <p type="p">112:導電襯墊</p>
        <p type="p">113:導電襯墊</p>
        <p type="p">114:導電路徑</p>
        <p type="p">115:介電層</p>
        <p type="p">116:介電層</p>
        <p type="p">117:基板互連件</p>
        <p type="p">119:腔</p>
        <p type="p">120:電子組件</p>
        <p type="p">121:端子</p>
        <p type="p">122:組件互連件</p>
        <p type="p">130:囊封件</p>
        <p type="p">140:重新分佈結構</p>
        <p type="p">141:介電結構</p>
        <p type="p">142:導電結構</p>
        <p type="p">143:介電結構</p>
        <p type="p">144:導電結構</p>
        <p type="p">150:外部互連件</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2169" publication-number="202624659">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624659</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115107709</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>廢棄物焚化設備</chinese-title>
        <english-title>WASTE INCINERATION FACILITY</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">F23G5/14</main-classification>
        <further-classification edition="200601120260311B">F23G5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商科納維股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANADEVIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人京都大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYOTO UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古林通孝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUBAYASHI, MICHITAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安井裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YASUI, YUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永森稔朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAMORI, TOSHIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>冨山茂男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMIYAMA, SHIGEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>植田全紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEDA, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原田浩希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARADA, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高岡昌輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAOKA, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的廢棄物焚化設備（1）包括：焚化爐（3），將廢棄物焚化；廢氣流路（4），供自焚化爐（3）排出的廢氣流通；集塵器（42），設置於廢氣流路（4）；再循環廢氣線（6），在廢氣流路（4）中連接於集塵器（42）的下游側的取出位置（P1），取出在廢氣流路（4）中流通的廢氣的一部分作為再循環廢氣，並將其供給至焚化爐（3）內；及氧氣混合部（68），對在再循環廢氣線（6）中流通的再循環廢氣混合氧濃度高於空氣的高濃度氧氣。藉此，能夠容易地減少廢氣量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A waste incineration facility (1) includes an incinerator (3) for incinerating waste, a flue gas flow path (4) through which flue gas discharged from the incinerator (3) flows, a dust collector (42) provided in the flue gas flow path (4), a recirculated flue gas line (6) connected to a take-out position (P1) located downstream of the dust collector (42) in the flue gas flow path (4), for extracting some of the flue gas flowing in the flue gas flow path (4) as recirculated flue gas to supply it into the incinerator (3), and an oxygen mixing part (68) for mixing highly concentrated oxygen gas, which has a higher oxygen concentration than air, with the recirculated flue gas flowing in the recirculated flue gas line (6). This makes it possible to easily reduce the amount of flue gas.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:污物焚化設備</p>
        <p type="p">2:污物坑</p>
        <p type="p">3:焚化爐</p>
        <p type="p">4:廢氣流路</p>
        <p type="p">5、5a:已處理氣體線</p>
        <p type="p">6:再循環廢氣線</p>
        <p type="p">21:抽出氣體線</p>
        <p type="p">41:鍋爐管組</p>
        <p type="p">42:集塵器</p>
        <p type="p">43:濕式洗煙塔</p>
        <p type="p">44:二氧化碳回收裝置</p>
        <p type="p">45:廢氣處理部</p>
        <p type="p">51:廢氣再加熱器</p>
        <p type="p">52:抽風機</p>
        <p type="p">59:煙囪</p>
        <p type="p">66:風扇</p>
        <p type="p">67:預熱器</p>
        <p type="p">68:(再循環廢氣用的)氧氣混合部</p>
        <p type="p">211:(抽出氣體用的)氧氣混合部</p>
        <p type="p">P1:取出位置</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2170" publication-number="202623845">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202623845</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115107803</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>自動注射器及其相關的使用方法</chinese-title>
        <english-title>AUTO-INJECTOR AND RELATED METHODS OF USE</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">A61M5/142</main-classification>
        <further-classification edition="200601120260311B">A61M5/145</further-classification>
        <further-classification edition="200601120260311B">A61M5/20</further-classification>
        <further-classification edition="200601120260311B">A61M39/24</further-classification>
        <further-classification edition="200601120260311B">A61M5/155</further-classification>
        <further-classification edition="200601120260311B">A61M5/168</further-classification>
        <further-classification edition="200601120260311B">A61M5/24</further-classification>
        <further-classification edition="200601120260311B">A61M5/31</further-classification>
        <further-classification edition="200601120260311B">A61M5/315</further-classification>
        <further-classification edition="200601120260311B">A61M5/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商再生元醫藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REGENERON PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伯吉斯　巴特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BURGESS, BART</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格呂古斯　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRYGUS, BRYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈爾比格　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HALBIG, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱尼恩　羅斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KENYON, ROSS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭利　特雷弗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANGLEY, TREVOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥納瑪拉　傑里米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCNAMARA, JEREMY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>保斯利　馬修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAUSLEY, MATTHEW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜蒙　安德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUMONT, ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韋斯特　佩奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAECHTER, PAIGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伯克　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BURKE, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邦托　馬丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BONTOFT, MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥加雷爾　克雷格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCGARRELL, CRAIG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬丁　史考特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARTIN, SCOTT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="14">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫厄　詹姆士尼古拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOWER, JAMES NICHOLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="15">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格倫克羅斯　詹姆士坎寧翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLENCROSS, JAMES CUNNINGHAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="16">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥克盧斯基　詹姆士唐納德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCLUSKY, JAMES DONALD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">自動注射器可包括一外殼，具有一縱向軸線和一橫向軸線，該外殼沿著橫向軸線的尺寸小於沿著縱向軸線之尺寸，其中橫向軸線係垂直於縱向軸線；一流動路徑，具有一第一端部和一第二端部；及一容器，包封一第一流體，該容器從一第一端部沿著或平行於縱向軸線延伸朝一第二端部，並可從一第一位置沿著或平行於縱向軸線移動至一第二位置，該容器係於第一位置中與流動路徑流體地隔離，並在第二位置中流體地連接至流動路徑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An auto-injector may include a housing having a longitudinal axis and a transverse axis, the housing having a shorter dimension along the transverse axis than along the longitudinal axis, wherein the transverse axis is perpendicular to the longitudinal axis; a flowpath having a first end and a second end; and a container enclosing a first fluid, the container extending from a first end toward a second end along or parallel to the longitudinal axis and being movable from a first position to a second position along or parallel to the longitudinal axis, the container being fluidly isolated from the flowpath in the first position and fluidly connected to the flowpath in the second position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:自動注射器</p>
        <p type="p">3:外殼</p>
        <p type="p">4:表面</p>
        <p type="p">40:縱向軸線</p>
        <p type="p">42:側向軸線</p>
        <p type="p">44:橫向軸線</p>
        <p type="p">50:透明窗口</p>
        <p type="p">52:按鈕</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2171" publication-number="202625384">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625384</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115108063</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>偵測半導體裝置測試中類比電訊號之安定之方法</chinese-title>
        <english-title>METHOD OF DETECTING SETTLING OF ANALOG ELECTRICAL SIGNAL IN SEMICONDUCTOR DEVICE TESTING</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260311B">H03M1/34</main-classification>
        <further-classification edition="202001120260311B">G01R31/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商克斯希拉公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XCERRA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博伊德　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOYD, STEFEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一態樣中，一種偵測半導體裝置測試中一類比電訊號之安定之方法包含：在一半導體裝置測試器中提供一受測裝置(DUT)；將一輸入訊號提供至該DUT且量測該輸入訊號；藉由使該量測輸入訊號與彼此不重疊之循序量測窗重疊來隨時間追蹤量測，各量測窗跨越一恆定量測時段及一恆定訊號值範圍，同時根據該輸入訊號之量測變化來移位，使得各量測窗與對應於前一量測窗之該量測輸入訊號之至少一部分重疊；設定表示具有未移位恆定訊號值範圍之連續且未移位量測窗之一數目之一安定計數；及在偵測到由該等循序量測窗追蹤之該量測輸入訊號已滿足或超過該安定計數之後判定已達到一安定點。態樣亦包含一種適合於執行前述方法之設備及一種含有在由一或多個電腦處理器讀取時執行前述方法之指令之非暫時性電腦儲存媒體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In an aspect, a method of detecting settling of an analog electrical signal in semiconductor device testing includes providing in a semiconductor device tester a device under test (DUT); providing an input signal to the DUT and measuring the input signal; tracking the measurements over time by overlapping the measured input signal with sequential measurement windows that do not overlap with each other, each measurement window spanning a constant measurement period and a constant signal value range while shifting according to measured changes in the input signal such that each measurement window overlaps at least a portion of the measured input signal corresponding to a preceding measurement window; setting a settle count representing a number of consecutive and unshifted measurement windows having unshifted constant signal value ranges; setting a settle count representing a number of consecutive and unshifted measurement windows having unshifted constant signal value ranges; and determining that a settle point has been reached after detecting that the settle count has been met or exceeded by the measured input signal tracked by the sequential measurement windows. Aspects also include an apparatus for adapted performing the aforementioned method and a non-transitory computer storage medium containing instructions that when read by one or more computer processors perform the aforementioned method.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:輸入訊號</p>
        <p type="p">104:受測裝置(DUT)</p>
        <p type="p">106:輸出訊號</p>
        <p type="p">200:半導體裝置測試器</p>
        <p type="p">204:訊號量測感測器</p>
        <p type="p">206:量測輸入訊號</p>
        <p type="p">208:數位訊號</p>
        <p type="p">212:偵測電路系統</p>
        <p type="p">218:輸入訊號源</p>
        <p type="p">700:電腦系統</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2172" publication-number="202625812">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202625812</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115108123</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>半導體結構及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THEREOF</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="202601120260313B">H10W20/43</main-classification>
        <further-classification edition="202601120260313B">H10W80/00</further-classification>
        <further-classification edition="202501120260313B">H10D1/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>愛普科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AP MEMORY TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾基偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, KEE-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　文良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡茹宜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAI, RU-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃愷</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置包括第一堆疊對和連接單元。第一堆疊對包括第一重複單元和第二重複單元。第一重複單元包括第一介電層、被第一介電層包圍的第一裝置、以及包括第一金屬層的第一互連結構，第一金屬層覆蓋第一裝置並且被第一介電層包圍。第一金屬層電耦合至第一裝置。第二重複單元包括第二介電層、第二互連結構和第二裝置，第二互連結構包括接合至第一金屬層的第二金屬層。第二裝置被第二介電層包圍和電耦合至第二金屬層。連接單元包括電耦合至第一金屬層和第二金屬層的接觸墊。第一金屬層及第二金屬層為後段製程所形成之頂部金屬層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a first stacking pair and a connecting unit. The first stacking pair comprises a first repeating unit and a second repeating unit. The first repeating unit comprises a first dielectric layer, a first device surrounded by the first dielectric layer, and a first interconnect structure comprising a first metal layer over the first device and surrounded by the first dielectric layer, the first metal layer electrically coupled to the first device. The second repeating unit comprises a second dielectric layer, a second interconnect structure comprising a second metal layer bonded to the first metal layer, and a second device surrounded by the second dielectric layer and electrically coupled to the second metal layer. The connecting unit comprises a contact pad electrically coupled to the first metal layer and the second metal layer. The first metal layer and the second metal layer are top metal layers formed in Back End of Line (BEOL).</p>
      </isu-abst>
      <representative-img>
        <p type="p">10A:第一重複單元</p>
        <p type="p">15:第一堆疊對</p>
        <p type="p">20A:第二重複單元</p>
        <p type="p">25:連接單元</p>
        <p type="p">100:第一基板</p>
        <p type="p">101A:半導體結構</p>
        <p type="p">110:第一介電層</p>
        <p type="p">112:導電插塞</p>
        <p type="p">112A:第一組導電插塞</p>
        <p type="p">112B:第二組導電插塞</p>
        <p type="p">114:導電板</p>
        <p type="p">114A:第一導電板</p>
        <p type="p">114B:第二導電板</p>
        <p type="p">120:第一裝置</p>
        <p type="p">130:第一互連結構</p>
        <p type="p">132:導電貫孔</p>
        <p type="p">134:導線</p>
        <p type="p">136:第二金屬層</p>
        <p type="p">136A:第一部分</p>
        <p type="p">136B:第二部分</p>
        <p type="p">210:第二介電層</p>
        <p type="p">212:導電插塞</p>
        <p type="p">212A:第三組導電插塞</p>
        <p type="p">212B:第四組導電插塞</p>
        <p type="p">214:導電板</p>
        <p type="p">214A:第三導電板</p>
        <p type="p">214B:第四導電板</p>
        <p type="p">220:第二裝置</p>
        <p type="p">230:第二互連結構</p>
        <p type="p">232:導電貫孔</p>
        <p type="p">234:導線</p>
        <p type="p">236:第二金屬層</p>
        <p type="p">236A:第一部分</p>
        <p type="p">236B:第二部分</p>
        <p type="p">240:鈍化層</p>
        <p type="p">250:接觸墊</p>
        <p type="p">250A:第一接觸墊</p>
        <p type="p">250B:第二接觸墊</p>
        <p type="p">260:連接墊</p>
        <p type="p">1201:頂部導電板</p>
        <p type="p">1202:底部導電板</p>
        <p type="p">2201:頂部導電板</p>
        <p type="p">2202:底部導電板</p>
        <p type="p">L1:長度</p>
        <p type="p">L2:長度</p>
        <p type="p">T100:厚度</p>
        <p type="p">T110:厚度</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application no="2173" publication-number="202624667">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>12</isuno>
      <publication-reference>
        <document-id>
          <doc-number>202624667</doc-number>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115108793</doc-number>
        </document-id>
      </application-reference>
      <invention-title>
        <chinese-title>用於供熱、通風或空調系統之冷凍器總成</chinese-title>
        <english-title>CHILLER ASSEMBLY FOR HEATING, VENTILATING, OR AIR CONDITIONING SYSTEM</english-title>
      </invention-title>
      <classification-ipc>
        <main-classification edition="200601120260315B">F25B1/053</main-classification>
        <further-classification edition="200601120260315B">F25B25/00</further-classification>
        <further-classification edition="200601120260315B">F25B39/04</further-classification>
        <further-classification edition="200601120260315B">F25B6/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商泰科消防保安公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TYCO FIRE &amp; SECURITY GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>欽納拉傑　阿南德　Ｎ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINNARAJ, ANAND N.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施賴伯　傑布　Ｗ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHREIBER, JEB W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧茨　安迪　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUTZ, ANDY J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博爾高卡　曼吉里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BORGAOKAR, MANJIRI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫蘭卡拉　薩西什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KULANKARA, SATHEESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>考夫曼　賈斯汀　Ｐ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAUFFMAN, JUSTIN P.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布拉斯奎茲　布萊恩　Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BLASQUEZ, BRIAN S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於一供熱、通風或空調（HVAC）系統之冷凍器總成可包括一框架、一第一蒸氣壓縮迴路、一第二蒸氣壓縮迴路、一製程流體迴路及至少一個風扇。該第一蒸氣壓縮迴路包括經組態以使一第一致冷劑循環通過該第一蒸氣壓縮迴路之一第一冷凝器旋管及一第一蒸發器的一第一壓縮機。該第二蒸氣壓縮迴路包括經組態以使一第二致冷劑循環通過該第二蒸氣壓縮迴路之一第二冷凝器旋管及一第二蒸發器的一第二壓縮機。該製程流體迴路通過該第一蒸發器及該第二蒸發器。該第一蒸發器及該第二蒸發器經組態以使致冷劑與該製程流體迴路之製程流體處於一熱交換關係。該至少一個風扇經組態以引導空氣穿過該第一冷凝器旋管及該第二冷凝器旋管。該第一蒸氣壓縮迴路及該第二蒸氣壓縮迴路經組態以提供400致冷噸至1000致冷噸。該冷凍器總成經組態以容納於一聯運容器內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A chiller assembly for a heating, ventilating, or air conditioning (HVAC) system can include a frame, a first vapor compression circuit, a second vapor compression circuit, a process fluid circuit, and at least one fan. The first vapor compression circuit includes a first compressor configured to circulate a first refrigerant through a first condenser coil and a first evaporator of the first vapor compression circuit. The second vapor compression circuit includes a second compressor configured to circulate a second refrigerant through a second condenser coil and a second evaporator of the second vapor compression circuit. The process fluid circuit passes through the first evaporator and the second evaporator. The first evaporator and the second evaporator are configured to place refrigerant in a heat exchange relationship with the process fluid of the process fluid circuit. The at least one fan is configured to direct air across the first condenser coil and the second condenser coil. The first vapor compression circuit and the second vapor compression circuit are configured to provide between 400 refrigeration tons and 1000 refrigeration tons. The chiller assembly is configured to be housed within an intermodal shipping container.</p>
      </isu-abst>
      <representative-img>
        <p type="p">700:冷凍器總成</p>
        <p type="p">716A:壓縮機總成/第一壓縮機</p>
        <p type="p">716B:壓縮機總成/第二壓縮機</p>
        <p type="p">718A:膨脹閥</p>
        <p type="p">718B:膨脹閥</p>
        <p type="p">720A:蒸發器/第一蒸發器</p>
        <p type="p">720B:蒸發器/第二蒸發器</p>
        <p type="p">722:冷凝器總成</p>
        <p type="p">722A:第一冷凝器旋管</p>
        <p type="p">722B:第二冷凝器旋管</p>
        <p type="p">1100:蒸氣壓縮系統</p>
        <p type="p">1102:第一蒸氣壓縮迴路</p>
        <p type="p">1104:第二蒸氣壓縮迴路</p>
        <p type="p">1106:水迴路/製程流體迴路</p>
      </representative-img>
    </description>
  </tw-patent-application>
</tw-patent-applications>